SAMPLING UNIT
SERVICE MANUAL
CONTENTS SPECIFICATIONS ................................................ 3/4 PANEL LAYOUT ..................................... 5 CIRCUIT BOARD LAYOUT ................ 6 WIRING .................................................................... 6 BLOCK DIAGRAM ............................ 7 DISASSEMBLY PROCEDURE .............................. 8 LSI PIN DESCRIPTION ............................. 10 IC BLOCK DIAGRAM .................................. 15 CIRCUIT BOARDS ........................................ 16 TEST PROGRAM ............................. 21/33 MIDI IMPLEMENTATION CHART ......................................... 44 PARTS LIST CIRCUIT DIAGRAM
SY 011448 19981225-99800
HAMAMATSU, JAPAN 1.90K-648
Printed in Japan ’99.02