HDI Microvia PCB at EFPCB

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The concept of Microvias is very pervasive. These are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate the high input/output (I/O) density of advanced packages. Demand of HDI Microvia PCB is very high. Basing on the portability and wireless communications, the electronics industry strives to produce affordable, light, and reliable products with increased functionality. The function of such PCB is like at the electronic component level, this translates to components with increased I/Os with smaller footprint areas, and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs).

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