Electronica Azi International no. 1 - 2021 by Electronica Azi

1/2021

I N T E R N A T I O N A L A PAN EUROPEAN MAGAZINE

https://international.electronica-azi.ro

AEC-Q100 Qualified and Defense-grade PolarFire® FPGAs Now Available in Volume Production

Expanded product offering with robust device certification and characterization gives customers programmable logic solutions ideal for thermally challenging environments Automotive, defense, aerospace and industrial designers who need automotiveand defense-grade programmable logic solutions can now order PolarFire Field Programmable Gate Arrays (FPGAs) in volume production quantities. Microchip Technology (Nasdaq: MCHP) announced it is shipping PolarFire FPGAs qualified for both the Automotive Electronics Council Q100 (AEC-Q100) specification Grade T2 (40°C to 125°C TJ) and military temperature grade (-40°C to 125°C TJ). These offerings extend Microchip’s lowpower leadership as a supplier of FPGAs for diverse high-reliability markets. With their thermal and space design constraints, automotive, industrial and military applications deployed in harsh environments require solutions that offer power and space efficiency as well as cryptographic security. PolarFire FPGAs offer on-chip security features that enable secure communication, an encrypted bitstream, and a cryptographically secured supply chain, ensuring tamper-proof solutions for these market segments. Unlike SRAM-based FPGAs, Microchip devices can operate without fans and in some cases without heatsinks, simplifying the thermal design of the system and creating new opportunities for smaller, lighter https://international.electronica-azi.ro

PRODUCT NEWS

requirements and procedures for packaged integrated circuits used in the automotive industry. An AEC-Q100 qualified device means that the device has passed the specified stress tests and guarantees a certain level of quality/reliability.

designs. This is especially important in automotive applications such as blind spot detection, lane change warning systems and back up cameras. Additionally, the extended temperature range of our military grade devices coupled with our stateof-the-art security enables developers to trust and add more compute power within a thermally constrained environments such as those found in advanced strategic weapons systems.

About the PolarFire FPGA PolarFire FPGAs deliver up to 50% lower power than competing solutions. The family of devices pan from 100K Logic Elements (LEs) to 500K LEs and feature 12.7G transceivers. Libero® SoC Design Suite, the development tool for designing with Microchip’s FPGAs and SoCs, now supports both AECQ100 and military-temperature-grade FPGAs today.

“Removing heat from a system is not free,” said Bruce Weyer, vice president of Microchip’s FPGA business unit. “The less heat you move, the lower your total system costs become. In some cases, complete removal of fans from systems, which often have a low mean time between failure, is possible. Automotive and aerospace design engineers can now develop mid-range FPGA solutions with the lowest total power, highest reliability, and best-in-class security technologies, all at a lower total system cost.”

Availability PolarFire automotive- and military-grade FPGAs are available in volume production. They are supported by development boards, Microchip’s Libero® software tool suite, VectorBlox™ Accelerator Software Development Kit and IP, plus Microchip’s High-Level Synthesis (HLS) tool for edge compute solutions. More information can be found at: www.microchip.com/polarfire.

About AEC-Q100 AEC-Q100 is a failure-mechanism-based stress test qualification for packaged integrated circuits used in automotive applications. This specification has been established by the AEC to define qualification

Please let us know if you would like to speak to a subject matter expert on Microchip’s PolarFire FPGAs and the challenges of high-thermal requirements of certain applications. Microchip Technology https://www.microchip.com/polarfire 3

Electronica Azi International » TABLE OF CONTENTS

3 | AEC-Q100 Qualified and Defense-grade PolarFire® FPGAs Now Available in Volume Production

20 | COSEL’s PJMA series power supplies are robust and reliable for demanding medical applications

6 | Renesas Extends IoT Security Leadership With PSA Certified Level 2 and SESIP Certification for

22 | Why and How to Use a Component-Based Distributed Power Architecture for Robotics 26 | COM Express Type 6 and COM-HPC Client

RA Family Devices 7

7 | Microchip releases the first IEEE® 802.3bt Power over Ethernet to USB Type-C® Power and Data Adapter

30 | 5G: A Quantum Leap for High-Speed Transmission 34 | Sustaining the Industry and the Environment

8 | Maxim Integrated’s AI Accelerator IC honored with

38 | Imperas Donates Latest RV32/64K Crypto (scalar)

“embedded award” at embedded world 2021 DIGITAL

Architectural Validation Test Suites to the RISC-V

9 | Analog Devices, University of Limerick and Stripe Collaborate to Leverage Software Technology for the Transformation of Engineering Education

Verification Ecosystem 39 | Kontron expands its Industrial Ethernet solutions with the KSwitch family 40

10 | Always look on the bright side of life

40 | Industrial DDR4 DRAM Memory

14 | Getting in the fast lane to Gen4

41 | X-86m2 and F-86:

16 | Low power flagship for embedded vision and AI 17 | More power for low power 24/7 systems 18 | StereoPi V2, the Open-Source Raspberry Pi Stereoscopic Camera, Now Available from Crowd Supply

New SATA III portfolio with 3D-NAND from Swissbit 44 | ON Semiconductor launches World’s First Automotive Qualified SiPM Array Product for LiDAR Applications 46 | Small volume production of electronics – equipment

® Management Managing Director - Ionela Ganea Editorial Director - Gabriel Neagu Accounting - Ioana Paraschiv Advertisement - Irina Ganea Web design - Eugen Vărzaru

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Contributing editors Cornel Pazara PhD. Paul Svasta PhD. Norocel Codreanu PhD. Marian Blejan PhD. Bogdan Grămescu

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Electronica Azi International is published 4 times per year in 2021 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Copyright 2021 by Euro Standard Press 2000 s.r.l. All rights reserved.

Electronica Azi International | 1/2021

Renesas Extends IoT Security Leadership With PSA Certified Level 2 and SESIP Certification for RA Family Devices

RA Family of 32-bit Arm Cortex-M Microcontrollers Offers Ultimate IoT Security with Renesas’s Secure Crypto Engine and Arm TrustZone

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced both PSA Certified Level 2 and Security Evaluation Standard for IoT Platforms (SESIP) certifications for its RA Family of 32-bit Arm® Cortex®-M microcontrollers (MCUs). Renesas’ RA6M4 MCU Group devices with the Flexible Software Package (FSP) have been PSA Level 2 certified, expanding on the PSA Certified Level 1 achieved by RA4 and RA6 Series MCUs. Renesas’ RA6M3, RA6M4, and RA4M2 MCU groups have achieved SESIP1 certification with Physical and Logical Attacker certifications. In addition to these widely recognized industry certifications, Renesas RA MCUs offer customers the ultimate IoT security by combining Secure Crypto Engine IP with NIST CAVP certifications on top of Arm TrustZone® for Armv8-M. RA Family devices incorporate hardware-based security features from simple AES acceleration to fully-integrated crypto subsystems isolated within the MCU. The Secure Crypto Engine provides symmetric and asymmetric encryption and decryption, hash functions, true random number generation (TRNG), and advanced key handling, including key generation and MCU-unique key wrapping. An access 6

management circuit shuts down the crypto engine if the correct access protocol is not followed, and dedicated RAM ensures that plaintext keys are never exposed to any CPU or peripheral bus. “Renesas understands that security is essential for IoT designers, so we have engineered the RA Family from the ground up with security in mind,” said Roger Wendelken, Senior Vice President in Renesas’ IoT and Infrastructure Business Unit. “These industry certifications augment what is already the most secure device family in the industry for IoT applications.” “We are glad to work with Renesas on the SESIP and PSA Certified certifications. Renesas RA Family certifications are prime examples of the relevance of security standards for the industry,“ said Carlos Serratos, Senior Director of Strategy, Policy and Advocacy at Brightsight. “From an OEM perspective, there is an increasing awareness of the value of certified devices as a tool for managing risk, and for aligning with multiple device certifications. While this is particularly relevant for devices used in critical infrastructures, it is steadily becoming the norm for the rest of the IoT domain.”

PSA Certified offers a framework for securing connected devices, from analysis through to security assessment and certification. The framework provides standardized resources addressing the growing fragmentation of IoT requirements, ensuring security is no longer a barrier to product development. PSA Certified through a third- party laboratory evaluation of a PSA Root of Trust (PSA-RoT), PSA Certified Level 2 provides evidence of protection against scalable software attacks. Evaluation Labs use vulnerability analysis and penetration testing of the PSA-RoT to establish if the nine security requirements of the PSA-RoT Protection Profile have been met. SESIP is an optimized version of Common Criteria methodology (ISO 15408-3) for the evaluation of IoT components and connected platforms. SESIP defines a catalogue of Security Functional Requirements (SFRs), which the product developer can use to build their secure device, scaling appropriately for their specific threat model and use case. SESIP also incorporates and refines Common Criteria Security Assurance Requirements (SARs), including the requirement ALC_FLR.2 Flaw Reporting Procedures, which Renesas addresses with its Renesas PSIRT (Renesas Product Security Incident Response Team) process and public web interface. Brightsight https://www.brightsight.com Renesas’ RA MCU Family https://www.renesas.com/RA Renesas Electronics Corporation https://www.renesas.com Electronica Azi International | 1/2021

PRODUCT NEWS

Microchip releases the first IEEE® 802.3bt Power over Ethernet to USB Type-C® Power and Data Adapter Enables extended installation reach of USB Type-C devices while supporting a variety of input PoE standards up to 90W and output power up to 60W

There are many consumer, enterprise and industrial devices today that have a USB Type-C port as the only input power option. While USB-C® technology can offer high power and high data rate, it limits the range of the installation to a maximum of three meters from an AC outlet. As Power over Ethernet (PoE) becomes more prevalent and a more convenient solution to provide power over a standard Ethernet cable, it is the most practical solution to provide both power and data up to 100 meters. While most adapters on the market provide only power, they provide only limited power up to 25W. Microchip Technology Inc. (Nasdaq: MCHP) announced a PoE to USB-C adapter with the highest power capability that converts both power and data while offering up to 60W USB output power via an Ethernet cable supported by PoE infrastructure.

Without the dependency of an AC outlet, there is no longer a range limitation of three meters and power can be delivered over 100 meters. This adapter also enhances the remote power management capabilities of the USB-C power device. The remote power reset capability, provided by the PoE source, allows power cycling via web interface or Simple Network Management Protocol (SNMP) to reset the device, rather than having to manually unplug and restart at the location of the equipment.

The adapter (part number PD-USB-DP60) can accept up to 90W of PoE and convert it to 60W output over USB-C that will power most cameras, laptops, tablets and other devices using USB-C for input power. This adapter simplifies installation by reducing dependency on AC infrastructure.

“This new device is ideal for easily deploying USB-C devices and providing them longrange power and data connectivity,” said Iris Shuker, director of Microchip's PoE business unit. “The adapters are built using Microchip’s USB power delivery ICs and PoE chipsets and are a perfect pairing with our latest PoE injectors and midspans.”

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Microchip’s PoE to USB-C adapter can connect to a variety of PoE sources with various standards deployed. It supports newer IEEE® 802.3af/at/bt standards as well as legacy PoE standards. Having a versatile adapter is crucial due to the many different implementations of PoE already installed.

Having the capability of converting 90W input to 60W output enables devices requiring higher power charging to make use of PoE that could not have done so before. The adapter can be paired with Microchip’s cost-effective single-port and multi-port (up to 24) PoE injectors/ midspans and switches that comply with IEEE 802.3af/at/bt industry standards and provide up to 90W power per port. If a lower power is needed to power the USB-C device, IEEE802.3af (15.4W) or IEEE802.3at (30W) PoE sources can be used. Microchip also offers key integrated circuit solutions that enable the PoE to USB-C adapter, including the PD70xxx family of PoE ICs and the LAN7800 USB-to-Ethernet bridge. Functionality is enabled by Microchip’s Power Delivery Software Framework (PSF), an open-source Power Delivery (PD) stack that runs on the UPD301C PD controller and provides full PD 3.0 capability and customization for Microchip’s PD controllers, microcontrollers and USB hubs. Pricing and Availability The PoE to USB-C adapter is available now for $100.00 each. For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here visit our purchasing portal or contact a Microchip authorized distributor. Microchip Technology https://www.microchip.com/wwwproducts/en/PD-USB 7

Maxim Integrated’s AI Accelerator IC honored with “embedded award” at embedded world 2021 DIGITAL The MAX78000 neural-network microcontroller was awarded for moving artificial intelligence to the edge without compromising performance in battery-powered IoT devices Maxim Integrated Products, Inc. (NASDAQ: MXIM) is the proud winner of the prestigious “embedded award 2021”. During the embedded world 2021 DIGITAL Exhibition&Conference (March 1-5, 2021), the company was awarded by the top-class expert jury for its MAX78000 low-power, neural-network microcontroller. Maxim received the prize during an online ceremony on March 3 during the virtual show. The jury was especially impressed by the outstanding performance of Maxim’s AI accelerator IC. The microcontroller executes AI inferences at less than 1/100th the energy of software solutions which dramatically improves run-time for battery-powered AI applications. 8

The power improvements come with no compromise in latency or cost, as the MAX78000 executes inferences 100x faster than software solutions running on low power microcontrollers, at a fraction of the cost of FPGA or GPU solutions. This is paving the way for complex new AI use cases which previously had been considered impossible and is enabling machines to see and hear complex patterns with local, low-power AI processing that executes in real-time. “We feel very honored to have been presented with the embedded award 2021”, said Ruth Hernández, Vice President of EMEA Sales and Applications at Maxim Integrated, who accepted the award at the virtual ceremony.

“The MAX78000 is an outstanding AI microcontroller built to enable neural networks to execute at ultra-low power. We are delighted to see our technology being recognized by the independent jury of this prestigious award.” Maxim showcasesed the MAX78000 lowpower, neural-network microcontroller at embedded world 2021 DIGITAL. In a special demo, visitors learned how Maxim’s AI technology is used for face and keyword identification and experience an AI camera (MAXCAM) in action. For details regarding Maxim’s presence at embedded world, visit https://maxim.click/EmbeddedWorldMaxim Maxim Integrated https://www.maximintegrated.com Electronica Azi International | 1/2021

Analog Devices, University of Limerick and Stripe Collaborate to Leverage Software Technology for the Transformation of Engineering Education Analog Devices, Inc. (Nasdaq: ADI) has collaborated with the University of Limerick (UL) and other prominent companies, including economic infrastructure technology leader Stripe, to launch a world-leading computer science program called Immersive Software Engineering (ISE). Given increased demand for developer talent globally and rapid growth of the internet economy, ISE is designed to revolutionize the way computer science is taught, creating industry experienced software professionals to drive greater business impact. As part of the research start-up aspect of this UL initiative, ADI will fund experimental development and research with the aim of developing new software processes and services. Through the ISE program, students will be able to take advantage of the resources offered at ADI Catalyst, a hands-on, incubator-like R&D facility in Limerick, Ireland, focused on forming new communities, creating living labs and developing breakthrough technologies such as artificial intelligence, robotics and sustainable applications. ADI Catalyst serves as a collaboration center that uses a true partnership approach to help customers resolve the challenges they face at an accelerated pace. It provides a unique setting for customers and research organizations to interact with ADI and solve problems together in a single collaborative environment. Limerick is also home to Analog Devices’ European Research and Development Center, which has a long-standing reputation for developing cutting-edge technology. • To learn more about how ADI is advancing the impact software has in industry, visit: https://www.analog.com/en/signals/articles/impact-ofcollaborative-partnerships.html • Watch a video to learn more about ADI Catalyst: https://www.analog.com/en/education/educationlibrary/videos/6233882732001.html Analog Devices https://www.analog.com https://international.electronica-azi.ro

Always look on the bright side of life

This article covers the use of the energy harvesting controller (EHC) implemented on the new RE01 family of embedded controllers from Renesas. The EHC is designed to remove the start-up problem and allow the developer to manage both the start-up cycle of the microcontroller – without taking too much current – and the external power reservoirs. In this case, these comprise storage capacitors and secondary batteries or super caps. This allows the developer to carefully manage the small amounts of energy generated by the energy harvesting power supply and store that energy until needed. The EHC is designed to be flexible enough to work with a wide range of energy harvesting power sources, such as solar cells, thermoelectric generators, vibration harvesters and many other types of power generators. Author: Graeme Clark Principal Engineer, Renesas Electronics

Many developers today are being tasked with developing low-power sensors to populate the Internet of Things. These sensors will be embedded into our streets, offices and factories and will be expected to collect data for years and share it with the cloud, most likely wirelessly. Of course, these products will also have to be low cost and require little or no maintenance, as many will be embedded in difficult to reach locations. Today, these products also have to be sustainable and ethical in terms of materials 10

and energy use, while contributing as little as possible to climate change. The use of batteries as a power source is one of the key areas developers have to address. It comprises many issues around limited lifetimes, product sustainability, manufacturing materials, shipment issues and the disposal of the battery at the end of its life. However, we can look on the bright side as there is a solution that would allow us to remove or at least reduce the size of the battery. We can use the energy that’s

all around us, whether in the form of light, motion, heat or some other form to power our products. This is becoming achievable for a wider range of products with the latest generation of energy harvesting power sources. These are capable of harvesting useful amounts of electrical energy from ever smaller amounts of energy in the environment, and these systems are now capable of using these small amounts of energy more effectively to power products when needed. Electronica Azi International | 1/2021

DESIGN SOLUTIONS » Energy harvesting controller

To allow developers to easily design products that harness energy in our surroundings as a power source, Renesas has implemented an energy harvesting controller on the RE01 family of embedded controllers. These devices are implemented on the new Silicon on Thin Buried Oxide semiconductor process, providing active current consumptions as low as 10 μA/ MHz, making them ideal for intelligent sensors powered by energy harvesting. The biggest problem that designers have to face when designing a product using an energy harvesting power source is the start-up current of the circuitry, especially the microcontroller (MCU). When power is applied to an MCU, the power-on reset circuit will release the reset line once there is a sufficient voltage level on the supply pin. The MCU starts to initialise, so clocks start to run, registers are initialised, and any boot application runs. This can take a significant amount of current, often many mAs which most small energy harvesting sources are unable to supply.

small amounts of energy. For example, a 25 cm2 solar cell with a light level of 200 LUX, comparable to the light levels indoors on a rainy day in the UK, might provide 40 – 50 μA. The latest generation of thermoelectric generators with a temperature difference of 2 – 3°C will produce a similar current level. So the EHC has to manage

the start-up of the device, and an optional secondary battery which can be charged when enough energy is available. The EHC can optionally use energy stored in the system to power external devices, such as sensors or radios. Before we look in detail at the EHC, we first must understand a little more about

Figure 3: I/O Power domains these small amounts of energy and store them to be used when required by the microcontroller or by other components in the system. In this article, we will focus for simplicity on the solar cell use case.

the design of the microcontroller, which has been optimised to support the minimal power available in energy harvesting applications. The RE01 microcontroller has a unique power supply design with four separately powered internal power domains and 6 external power domains. Each of these can be independently switched on or off depending on the application’s requirements. This allows the user to optimise the energy consumed by the device depending on the requirements of the application at any time. Each of the I/O peripheral and pin functions is allocated to a separate domain that can be individually powered when required. The RE01 I/O power domains are shown in Figure 3.

Figure 1: The start-up current problem

When the energy harvesting controller detects that voltage has been applied to the VSC_VCC pin and the supply is capable of generating at least 5 μA, then the energy harvesting cycle is started. The design of the energy harvesting controller power supply is such that the power output from the VCC pin can be supplied both to other power supply pins and to peripheral devices, such as external sensors and a radio.

Figure 2: RE01 energy harvesting controller At this point, the microcontroller will fail to operate correctly as the supply collapses and the start-up will fail. In embedded designs using small harvesters, we are typically talking about https://international.electronica-azi.ro

Figure 2 shows a simplified block diagram of the EHC. It illustrates the solar cell that provides the power to the device, the external storage capacitor that’s used as the original energy reservoir to support

When power output starts from the VCC pin, the VCC pin and the secondary battery are not connected inside the energy harvester. A simplified diagram of the power supply circuit is shown in figure 4.

EMBEDDED CONTROLLERS

The EHC monitors the state of the capacitor to detect whether it contains sufficient energy to power the MCU. The capacitor should be dimensioned correctly to supply enough energy for the MCU to complete its initialisation routines.

Figure 4: Energy harvesting system with simplified power supply design Power is applied to the MCU inside the RE01 by closing switch SW6 and the reset signal is released. At this point, current is also output from the VCC pin, so care should be taken to minimise any

First, let's look at the initial charging period, when voltage is first applied to the device from the solar cell. In this case, shown in Figure 5, power is supplied from the solar cell to the EHC.

Figure 5: Power supplied by the solar cell charges the storage capacitor 12

current consumption by external circuitry powered by this pin. This process is shown in Figure 6. Once the MCU has started and has run its

Figure 6: MCU starts up powered by the energy stored in the storage capacitor

In order to avoid this phenomenon, a mechanism to separate these circuits from the power is necessary. Figure 4 shows a switch installed between the VCC pin and the peripheral devices, and the load switch is controlled on/off by using a general-purpose port. For this reason, one of the I/O domains is always powered. (The load switch should be turned off at start-up and turned on after the secondary battery is fully charged.) Let’s look in more detail at how the energy harvest controller (EHC) operates. It comprises several switches and associated control logic. This circuit controls where the current flows in the device during operation.

However, rather than starting up the microcontroller, switches SW1 and SW3 are closed so the energy available is used to charge the external storage capacitor.

At this time, if the I/O domains and the external devices are connected directly to the VCC, the power they consume may be larger than the output of the solar cell and the energy held in the storage capacitor will be insufficient. In this case, the MCU will not be able to operate correctly and the start-up cycle will fail.

initialisation software using the energy in the storage capacitor, the MCU changes state into one of its ultra-low power modes to allow the storage capacitor to be recharged. Once this is complete, we can look to charge the secondary battery (or supercap if preferred). In this case, switch SW3 is opened and switch SW2 is closed to divert the available energy to charge the battery. This is done under the control of the MCU, which monitors the state of the battery. The MCU monitors the state of the secondary battery (or supercap) and when it is charged we can release the full power of the device as required. With a charged battery, we can power external sensors or a radio as required, and can increase the MCU speed and peripheral function. This operating state is illustrated in Figure 7. The energy harvesting controller is still monitoring all the voltage levels on the device, including the voltage levels on the storage capacitor and on the secondary battery. If the voltage across the capacitor drops below a set threshold, the charging process of the secondary battery is temporarily stopped to recharge the storage capacitor. When the storage capacitor is fully recharged, the secondary battery charging can start again. This cycle can be repeated as many times as required during operation. The energy harvest control circuit also has a function to prevent the overcharging of the secondary battery. When the power supply from the solar cell is too large and Electronica Azi International | 1/2021

DESIGN SOLUTIONS » Energy harvesting controller

powered by the energy contained in the secondary battery and storage capacitor, until these are discharged. As the EHC monitors the voltage levels on both these devices, it will generate a warning that the power is failing to allow the sys-

the secondary battery is overcharged, the switch SW2 is turned off to protect it. When the power generation element stops producing current, the operation continues with the power supplied from the secondary battery.

Figure 7: All energy reservoirs charged and CPU powered

Figure 8: MCU operation continues when power fails from the solar cell

Figure 9: Waveform diagram showing power status of storage capacitor and secondary battery during operation This process is shown in Figure 8. There is also a reverse current prevention function to stop any damage caused by power flowing back to the solar cell: the circuit inside the EHC is disconnected. The application will continue to run, https://international.electronica-azi.ro

tem to power down gracefully before the energy supply is exhausted. The EHC allows users to usefully manage the energy from an energy harvesting source, generating currents as low as a few μA, and store this energy to be released

when required by the application. The typical power supply cycle is shown in Figure 9, including the start-up of the EHC when power is first supplied from the solar cell. The diagram also illustrates how the MCU is released from reset. The voltage on the storage capacitor drops; the MCU then initialises, sets up the harvester and enters a low power state while still executing code slowly and consuming around 1 μA. The storage capacitor is then recharged and the secondary battery starts charging. When the secondary battery is charged and interrupt is generated, there is enough energy available to switch the MCU into full speed, and switch on external sensors and a radio as required. This can be done under the control of the MCU’s application. When the secondary battery is discharged and the voltage falls to a predetermined limit, the system gets a warning to reduce power and the cycle starts again. The energy harvesting controller implemented on the RE01 family of microcontrollers allows users to easily implement the hardware required to use many types of energy harvesting power sources. The EHC enables us to both overcome the start-up limitations of normal microcontrollers and manage the energy available to power the complete application. The EHC allows us to look on the bright side of how to power our products in future, if we are expected to populate the Internet of Things with billions of intelligent communicating devices to sense and record the environment around us. Energy harvesting provides the ideal solution to power these devices, either to remove the need for batteries, or at least allow the local recharging of secondary batteries to remove the need for battery replacement and remote recharging. This is really the bright side of the IoT. About the author Graeme Clark has been with Renesas Electronics Europe, and previously Hitachi Electronics, working with low power microcontrollers in a variety of roles for over 20 years. He is now responsible for the introduction of the new SOTB-based embedded controllers into the European market. Renesas Electronics www.renesas.com

Getting in the fast lane to Gen4

congatec starter set for COM-HPC with 11th Gen Intel Core processors congatec – a leading vendor of embedded and edge computing technology – presented a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Optimized for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-onModule conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake). This new high-end embedded module generation targets system engineers working on the broadband connected edge devices that are emerging in industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision based inspection and video surveillance systems, to name just a few. The starter set’s various Ethernet configuration options range from 8x 1GbE switching options and 2x 2.5 GbE including TSN support up to dual 10 GbE connectivity. Processor

Intel Core i71185G7E Intel Core i71185GRE Intel Core i51145G7E Intel Core i51145GRE Intel Core i31115G4E Intel Core i31115GRE Intel Celeron 6305E 14

congatec’s comprehensive AI support for MIPI-CSI connected cameras from Basler adds further application readiness to IIoT and Industry 4.0 connected embedded systems. AI and inferencing acceleration can be achieved with Intel DL Boost running on the CPU vector neural network instructions (VNNI), or with 8-bit integer instructions on the GPU (Int8). Attractive in this context is the support of the Intel Open Vino ecosystem for AI, which comes with a library of functions and optimized calls for OpenCV and OpenCL kernels to accelerate deep neural network workloads across multiple platforms to achieve faster, more accurate results for AI inference. The starter set presented at embedded world 2021 DIGITAL is based on the following components of congatec’s COM-HPC ecosystem: ATX compliant carrier board conga-HPC/EVAL-Client The ATX compliant carrier board congaHPC/EVAL-Client incorporates all interfaces specified by the new COM-HPC

Cores/ Frequency at Cache Graphics Ext. Threads 28/15/12W TDP, [MB] Execution Temp. (Max Turbo) Units range [GHz] 4/8 2.8/1.8/1.2 (4.4) 12 96 −

InBand ECC −

4/8

2.8/1.8/1.2 (4.4)

yes

4/8

2.6/1.5/1.1 (4.1)

−

4/8

2.6/1.5/1.1 (4.1)

yes

2/4

3.0/2.2/1.7 (3.9)

−

2/4

3.0/2.2/1.7 (3.9)

yes

2/2

1.8 (n/a)

−

Client standard and supports the extended temperature range from -40°C to +85°C. It comes with two massively performant PCIe Gen4 x16 connectors plus a variety of LAN data bandwidths, data transfer methods and connectors, including 2x 10 GbE, 2.5 GbE and 1GbE support. Over mezzanine cards, the carrier can run even higher-performance interfaces up to 2x25 GbE, making this evaluation platform a perfect fit for massively connected edge devices. The board supports the COMHPC sizes A, B and C, and includes all interfaces engineers require for programming, firmware flashing and reset. New conga-HPC/cTLU COM-HPC Client module The heart of the presented starter set for COM-HPC Client designs, the congaHPC/cTLU computer-on-module, is available in different processor configurations. For each of these configurations, three different cooling solutions are available that fit the entire configurable 12-28W TPD range of the 11th Gen Intel Core processors. The product page of the congaHPC/cTLU can be found at: https://www.congatec.com/en/products/a ccessories/conga-hpceval-client/ Free COM-HPC training Engineers who want to learn more about why and how to design systems on the basis of the COM-HPC ecosystem can participate in congatec’s 3-hour online ‘Add-on COM-HPC Training’ course. congatec https://www.congatec.com COM-HPC standard https://www.congatec.com/com-hpc Electronica Azi International | 1/2021

PRODUCT NEWS

Low power flagship for embedded vision and AI speech recognition without any cloud connection. • The Cortex-M7, which can also be used as a fail-safe unit, provides real-time control together with a time synchronized networking capable Ethernet port. • Next to an encryption module (CAAM) for hardware-accelerated ECC and RSA encryption, the Arm TrustZone also integrates the Resource Domain Controller (RDC) for isolated execution of critical software, and the secure High Assurance Boot mode to prevent the execution of unauthorized software during boot.

congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor congatec – a leading vendor of embedded and edge computing technology – presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra low power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, visual inspection, identification, surveillance and tracking as well as gesture-based contactless machine operation and augmented reality. Technical highlights of the Arm CortexA53 based quad-core processor platform include the integrated neural processing unit (NPU) for AI computational power, and the image signal processor (ISP) for parallel real-time processing of high resolution images and video streams from the two integrated MIPI-CSI camera interfaces. The extensive ecosystem of this new SMARC module – such as applicationready 3.5-inch carrier boards as well as Basler camera and AI software stack support – complements the product launch for a fast proof of concept. Vertical markets for these credit card sized low power vision and AI modules can be found anywhere 16

from smart farming and industrial manufacturing to retail, and from transportation to smart cities and smart buildings. “If engineers leverage the rich and highly efficient feature set of the new SMARC modules along with our extensive ecosystem and implement further application-specific functions via PCIe Gen 3 as well as 2x USB 3.0 and 2x SDIO, they have a highly reliable and robust 2-6 Watt low power platform for vision and AI. Depending on the variant, the new modules can even be used in the extended temperature range of -40°C to 85°C,” explains Martin Danzer, Director Product Management at congatec. With its various specialized processing units, the new i.MX 8M Plus processor based SMARC module from congatec enables impressively responsive embedded vision and AI applications with an extremely low power envelope. Advantages include: • The NPU adds 2.3 TOPS of dedicated AI computational power to the four powerful multi-purpose Arm Cortex-A53 processor cores. • The integrated ISP processes full HD video streams with up to 3x 60 frames per second for video enhancement. • The high-quality DSP enables local

The feature set in detail The new SMARC 2.1 modules for vision and AI applications feature four quadcore Arm Cortex-A53 based NXP i.MX 8M Plus processors for the industrial (0°C to +60°C) or extended temperature ranges (-40°C to +85°C) as well as in-line ECC for up to 6 GB LPDDR4 memory. The modules can drive up to three independent displays and provide hardware accelerated video decoding and encoding including H.265 so that high resolution camera streams delivered by two integrated MIPI-CSI interfaces can be sent directly to the network. For data storage, engineers will find onboard up to 128 GB eMMC, which can also operate in safe pSLC mode. Peripheral interfaces include 1x PCIe Gen 3, 2x USB 3.0, 3x USB 2.0, 4x UART as well as 2x CAN FD and 14x GPIO. For real-time networking, the module offers 1x Gbit with TSN support plus conventional Gbit Ethernet. An optional M.2 WiFi and Bluetooth LE card soldered on the module adds wireless connectivity. 2x I2S for sound rounds off the feature set. The supported operating systems include Linux, Yocto 2.0 and Android. Further information on the new congatec SMARC Computer-on-Module conga-SMX8-Plus can be found at: https://www.congatec.com/en/products/s marc/conga-smx8-plus/ To see congatec’s complete i.MX 8 portfolio, please visit www.congatec.com/imx8 congatec https://www.congatec.com Electronica Azi International | 1/2021

More power for low power 24/7 systems congatec doubles performance with AMD Ryzen Embedded V2000 processor congatec introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance has been validated using real-world cross-platform test suite Cinebench R15 nt. Compared to modules with AMD Ryzen Embedded V1608B processors, conga-TCV2 modules deliver a performance plus of 97% (V2516) to 140% (V2718) with up to 8 cores. Due to the new 7nm Zen 2 cores, single core performance also increased between 25% and 35%, making the new modules a perfect candidate for performance improvements in 24/7 connected and fanless embedded systems operating at the various industrial edges. Typical applications include multi-functional industrial edge gateways, digital signage systems, gaming terminals and infotainment platforms. With up to 40% more GPU capabilities[2] for up to 4x 4k60 graphics at 15 Watt and comprehensive GPGPU support, multi-headed medical imaging systems in the operating theater as well machine vision and machine learning systems are further target markets. Next to stationary equipment, solar powered stationary, mobile and autonomous systems also welcome the low power values of the new AMD Ryzen Embedded V2000 processor based Computer-onModules, which can be configured down to as low as 10 Watt cTDP. This is significant because the productive operation time without re-charging extends the lower the TPD is. Competing 10 Watt TDP platforms https://international.electronica-azi.ro

with 4 cores offer only half the core count, which puts them into an entirely different, significantly weaker performance league. Other 15 Watt TPD platforms also have just 4 cores but without the ability to scale down the TPD, which limits the platform balancing options. The AMD Ryzen V2000 Embedded processors, on the other hand, offer an ultra broad performance range from 10 Watt up to 54 Watt on the basis of this single processor architecture. The feature set in detail The new conga-TCV2 high-performance COM Express Compact modules with Type 6 pinout are based on the latest AMD Ryzen Embedded V2000 multi-core processors and will become available in 4 different flavors: Processor AMD Ryzen Embedded V2748 AMD Ryzen Embedded V2718 AMD Ryzen Embedded V2546 AMD Ryzen Embedded V2516

Cores/ Threads 8 / 16

The conga-TCV2 Computer-on-Module supports up to four independent displays with up to 4k60 UHD resolution over 3x DisplayPort 1.4/HDMI 2.1 and 1x LVDS/eDP. Further performance-oriented interfaces include 1x PEG 3.0 x8 and 8x PCIe Gen 3 Lanes, 4x USB 3.1, up to 8x USB 2.0, up to 2x SATA Gen 3, 1x Gbit Ethernet, 8 GPOIs I/Os, SPI, LPC, as well as 2x legacy UART provided by the board controller. The supported hypervisor and operating systems include RTS Hypervisor as well as Microsoft Windows 10, Linux/Yocto, Android Q and Wind River VxWorks. For safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated encryption and decryption of RSA, SHA and AES. TPM support is onboard as well.

Clock [GHz] L2/L3 GPU TDP [W] (Base/Boost)[3] Cache (MB) Compute Units 2.9 / 4.25 4/8 7 35 – 54

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These modules offer up to double the compute performance per watt and double the core count over previous generations. Thanks to symmetrical multiprocessing capabilities, they also provide particularly high parallel processing performance with up to 16 threads. The modules feature 4MB L2 cache, 8MB L3 cache, and up to 32GB energy-efficient and fast dual-channel 64-bit DDR4 memory with up to 3200 MT/s and ECC support for maximum data security. The integrated AMD Radeon graphics with up to 7 compute units continues to support applications and use cases that need high-performance graphics computing.

More information about the new conga-TCV2 module is available at: https://www.congatec.com/en/products/com-express-type6/conga-TCV2/ congatec https://www.congatec.com [1] Testing conducted by AMD Performance Labs as of July 2020 on the Ryzen Embedded V2718 and June 2018 on the Ryzen Embedded V1605B processor both at 15 watts (STAPM mode enabled) using Cinebench R15 nt. Results may vary. EMB-170 [2] Testing conducted by AMD Performance Labs as of July 2020 on the Ryzen Embedded V2718 and June 2018 on the Ryzen Embedded V1605B processor both at 15 watts (STAPM mode enabled) using 3DMark11. Results may vary. EMB-172 [3] Max boost for AMD Ryzen and Athlon processors is the maximum frequency achievable by a single core on the processor running a bursty single-threaded workload. Max boost will vary based on several factors, including, but not limited to: thermal paste; system cooling; motherboard design and BIOS; the latest AMD chipset driver; and the latest OS updates. GD-150

Mouser Sponsors 2021 Global Create the Future Design Contest Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is pleased to announce its sponsorship of the 19th Create the Future Design Contest, a global challenge to engineers and innovators around the world to design the next great thing. Mouser, which has sponsored the contest for several years, is joined again by valued suppliers Intel® and Analog Devices, Inc. as co-sponsors. The contest is produced by SAE Media Group, an SAE International Company. COMSOL is also a principal sponsor of the contest. The contest is now open for submissions through July 1, 2021. The grand prize winner receives worldwide recognition and a cash prize of $25,000 for an innovative product that benefits society and the economy. Previous contests have produced more than 15,000 design ideas from engineers, entrepreneurs and students in more than 100 countries. “At Mouser, fostering innovation is rooted in our foundation from the company’s earliest days,” said Kevin Hess, Mouser Electronics’ Senior Vice President of Marketing. “We proudly support programs like the Create the Future Design Contest that bring out the best in engineers, innovators and students.” “Mouser Electronics, renowned for delivering best-in-class service and products to customers, is also a recognized advocate for design and innovation,” said Joseph Pramberger, President of SAE Media Group. “We are excited to have the support of industry leaders such as Mouser, Intel and Analog Devices.” The Create the Future Design Contest brings attention to product designs that enhance humanity, improve quality of healthcare or help to provide sustainable solutions. Previous grand prize-winning entries include a small, self-contained device for organ and limb transport and an economical rapid screening device to prevent food-borne illness. The contest was created in 2002 by the publishers of Tech Briefs magazine to help stimulate and reward engineering innovation. The grand prize winner will be chosen from the winners in seven entry categories: Aerospace and Defense, Automotive/ Transportation, Consumer Product Design, Electronics/ Sensors/IoT,Manufacturing/Automation/ Robotics, Medical, and Sustainable Technologies/Future Energy. For more information: https://eu.mouser.com/createthefuture ►Mouser Electronics | https://www.mouser.com 18

StereoPi V2, the Open-Source Raspberry Pi Stereoscopic Camera, Now Available from Crowd Supply Crowd Supply, the leading product development platform connecting hardware creators with early adopters and enthusiastic backers, announces the availability of StereoPi V2, a high-performance stereoscopic camera based on Raspberry Pi. Featuring on-board Bluetooth®, Wi-Fi, and advanced power and memory, StereoPi V2 offers a versatile solution for wireless electronic applications. The new StereoPi V2 is compatible with external antennas, making it an ideal choice for use with drones. This version of the StereoPi camera follows the successful launch of V1, which generated more than 300% of its funding on Crowd Supply. The compute module of the StereoPi V2 boasts a Broadcom SoC module – which delivers up to twice the speed of V1 – as well as extremely fast eMMC and DDR4 memory. StereoPi V2 features advanced wireless management, allowing operators to use software to power down WiFi or Bluetooth, plus dedicated Gigabit Ethernet. Electronica Azi International | 1/2021

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Digi-Key Electronics is the exclusive sponsor of Würth Elektronik‘s 2021 technical WEbinars © Würth Elektronik

The versatile device offers a configurable power switch option, letting developers place an external power switch anywhere in the design. StereoPi V2 is fully open source and offers out-of-the-box Raspberry Pi OS compatibility. StereoPi V2, one the newest hardware projects launched through Crowd Supply, is part of the Microchip Get Launched program. Developed to support projects integrating Microchip components, the Get Launched program provides promotion, technical consultations, and reducedprice components to qualifying developers. To learn more about StereoPi V2, visit: https://www.crowdsupply.com/stereopi/stereopi-v2. ►Crowd Supply | https://www.crowdsupply.com

Content to help educate customers In 2021, Würth Elektronik expects to triple the number of presented webinars; including topics in English, Spanish, and Portuguese. Brand new topics include custom transformer design, coupled inductors, optocouplers, and more. Amelia Thompson, Marketing & Communications Coordinator with Würth Elektronik, is hoping the continued partnership with Digi-Key Electronics helps to not only grow the base attendance rate, but also reach universities and students as a free educational tool, as topics range from basic to advanced subjects. “Over the last several years, our educational webinars have become increasingly popular. Our continued goal is to educate any person willing to learn about electronics. Online presence continues to the best way to do so, especially after everything we have seen in 2020,” says Amelia Thompson. “Our strong partnership and exclusive sponsorship with Digi-Key Electronics ensures the webinars remain free for our attendees.” “Digi-Key is proud to be the exclusive sponsor for Würth Elektronik’s webinar series once again in 2021,” said David Stein, vice president, global supplier management for Digi-Key. “These webinars provide great content to help educate our mutual customers on their entire portfolio from capacitors to wireless modules. Our partnership with Würth Elektronik on the webinars illustrates our commitment to providing our customers with knowledge and resources related to electronic and electromechanical components.” Registration for all 2021 WEbinars is available at https://www.we-online.com/webinars ►Würth Elektronik eiSos | https://www.we-online.com

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Rugged Industrial Ac-Dc Power Supplies Rated from 35 up to 350 Watts CUI Inc, a Bel group company, announced the addition of three new lines to its VGS family of chassis mount, singleoutput ac-dc power supplies housed in a compact metal case. The VGS-C, VGS-D, and VGS-W series offer power ratings from 35 to 350 W, depending on the series, and an operating temperature range of -25 to +70 °C, with most series offering an operating temperature range of -30 to +70 °C. All three series are 62368-1 safety certified with low no-load power consumption for reducing standby power usage in industrial applications. For budget-constrained applications, CUI’s VGS-C series offers power ratings from 35 to 350 W and carries single output voltages of 5, 12, 15, 24, 36, and 48 Vdc. Featuring active power factor correction and over temperature protection, models in the VGS-D series offer power ratings from 75 to 320 W and carry voltages from 5, 12, 15, 24, and 48 Vdc. The VGS-W series is rated from 35 to 150 W and carries 5, 12, 15, 24, 36, and 48 Vdc. The VGS-D and VGS-W have a wide input range of 305 Vac and models across all three series are output adjustable. While most models in the three series are convection cooled, the higher power VGS-350C and VGS-320D both use forced air cooling with a built-in temperature-controlled fan. All models further feature a screw terminal interface, along with short circuit, over current, and over voltage protections. Terminal cover and conformal coating options are also available. The VGS-C, VGS-D, and VGS-W series are designed to meet IEC/EN 61558, IEC/EN 60335, and GB 4943 system requirements. The units also comply with 55032 Class B radiated/conducted emissions and meet 61000-3-2 harmonics and 610004-3 immunity. ►CUI | https://www.cui.com 20

COSEL’s PJMA series power supplies are robust and reliable for demanding medical applications COSEL Co, Ltd (6905: Tokyo) today announced the expansion of its medical power offering with the addition of the PJMA series. The 600W PJMA600F and the 1000W rated PJMA1000F have a universal input range of 85 to 264VAC and comply with international safety standards. Designed for demanding medical applications, the PJMA series input/output isolation complies with 2MOPP requirements. Based on a robust platform, the units’ design has been optimized to offer a very good price/performance ratio for medical applications requiring a high quality power solution. The PJMA series is available in four output voltages of 12, 24, 36 and 48VDC. Medical applications are requiring robust and highly reliable power supplies that are able to operate around the world and comply with safety regulations. Based on many years of expertize, COSEL power designers developed an optimized platform to offer an excellent price/performance ratio without compromising on quality and reliability. The PJMA series can be operated within the so called ‘universal Input’ range of 85 to 264VAC, and has a typical efficiency of 88% at high line. Four single output voltages are available as standard in each unit. That’s 12V/50A, 24V/25A, 36V/16.7A, and 48V/12.5A for the PJMA600F, and 12V/84A, 24V/42A, 36V/28A, and 48V/21A for the PJMA1000F.The output voltage can be adjusted by using the built-in potentiometer. The PJMA series includes inrush current limiting circuitry, overcurrent and overvoltage protection, as well a thermal protection. Electronica Azi International | 1/2021

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Digi-Key Electronics Named ON Semiconductor Global High Service Distributor of the Year for Second Year in a Row Digi-Key’s partnership contributed to the supplier’s success in the energy efficient innovation market in 2020 Exhibiting versatility and robustness, the power supplies can be operated in an environmental temperature range of -20 to +70 degrees centigrade. Depending on the final equipment assembly style and cooling conditions, a derating may apply. With its medical focus, the PJMA series input to output isolation complies with 2MOPP, its input to ground with 1MOPP, and output to ground with 1MOPP. The units are approved in accordance with ANSI/AAMI ES60601-1 and EN60601-1 3rd Edition. In conducted emission tests, the PJMA series complies with the FCC-B, CISPR11-B, CISPR32-B, EN55011-B, EN55032-B, and VCCI-B. For applications requiring even lower emission levels an additional filter COSEL type NAC can be supplied (NAC-16-472 for the PJMA600F and NAC-20-472 for the PJMA1000F). To accommodate application specific requirements, a number of options are available including conformal coating (C), low leakage current (G), external potentiometer connector (V), remote control (R), remote sensing / low output voltage alarm and parallel operation (W), and low speed fan (F4). For strength and longevity, the PJMA series is built in an enclosed, galvanized steel box with fans mounted on the rear side (one for the 600W and two for the 1000W). The PJMA600F measures 120 × 61 × 215mm [4.72 × 2.40 × 8.46 inches] (W × H × D), and has a weight of 2.0 kg max. The PJMA1000F measures 150 × 61 × 240 [5.91 × 2.40 × 9.45 inches] (W × H × D) and has a weight of 2.8kg max. The PJMA series has a five-year warranty and conforms to the European RoHS, REACH and Low Voltage Directives. Related links: https://www.coseleurope.eu/Products/AC-DC/PJMA ►Cosel Group | https://www.coseleurope.eu https://international.electronica-azi.ro

Digi-Key Electronics, the leading global electronic components distributor, was named ON Semiconductor’s Global High Service Distributor for 2020. This is the second year Digi-Key has been recognized with the Global High Service Distribution Partner Award, which honors the distributor that led channel sales, grew market share, captured increased sales of products and scored highly on overall process excellence in the evolving semiconductor market. “On behalf of the organization, I want to thank our excellent channel partners for their contributions in 2020,” said Jeff Thomson, senior vice president of global channel sales for ON Semiconductor. “Each of these winners successfully grew product sales, generated significant new business and effectively supported customer needs while keeping our company initiatives for operational excellence at the forefront. The support of our worldwide distribution partners is essential as we continue to increase market penetration, revenue growth and achieve overall success of the company.” ON Semiconductor is an industry leader in leveraging partnerships in the global distribution channel. Approximately 60 percent of the company’s business results from distribution sales, and distribution remains the fastest channel to market. “Digi-Key is thrilled to be recognized with this prestigious award for the second consecutive year from one of our most valued global partners to our engineering community, ON Semiconductor,” said David Stein, vice president of global supplier management at Digi-Key. “ON Semiconductor continues to provide Digi-Key’s customers with high-quality semiconductor based solutions that empower innovators to reduce global energy use.” For more information, or to order from Digi-Key’s full line of ON Semiconductor products, please visit any of Digi-Key’s global websites. ►ON Semiconductor | https://www.onsemi.com ►Digi-Key Electronics | https://www.digikey.com 21

POWER

Why and How to Use a Component-Based Distributed Power Architecture for Robotics

Author: Rolf Horn Contributed by Digi-Key's North American Editors

The use of battery-powered robots is growing across applications such as factory automation, agriculture, campus and consumer delivery, and warehouse inventory management. For maximum operating time between charges, designers of these battery systems have always needed to be concerned about power conversion efficiency, as well as size and weight. 22

This article briefly outlines the power needs of several robotics applications including agricultural harvesting, campus and consumer delivery, and warehouse inventory movement. It will then review the benefits of using a component-based distributed power delivery architecture, and then introduce example DC-DC converter solutions from Vicor, along with evaluation boards and associated software to help designers get started. However, these concerns have become more critical as load capacities continue to increase and sensing and safety features such as vision, ranging, proximity, location, among others, add design complexity and physical weight. At the same time, the additional electronics processing required also consumes more power. To maximize battery life in the face of

these additional challenges, designers can turn to a component-based distributed power delivery architecture to power the motors, CPUs and other subsystems. In such an approach, each individual DC-DC power conversion component can be placed at the point of load (PoL) and optimized for high efficiency, small size (high power density) and overall performance. Electronica Azi International | 1/2021

DESIGN SOLUTIONS » Distributed Power Architecture

This approach can result in a lighter overall power system, enabling further performance gains for battery-powered robotic systems. Flexibility is also enhanced since power conversion components can be paralleled to easily scale as robotic power demands increase, and they also allow for the same power architecture to be deployed across a platform of various-sized robotic systems. Power requirements for robots The power requirements for specific types of robots are determined by the application: • Agricultural harvesting robots: Plant, maintain, and harvest produce (fruits, vegetables, grains) using automated vehicle guidance along with visual recognition and multiple environmental and soil analysis sensors. These large robotic vehicles are typically powered from a high-voltage DC source of 400 volts or more. • Delivery robots: Last-mile consumer or campus delivery of various items. While payloads vary in size and weight,

these robots are typically powered by 48 to 100 volt batteries and have longer run time requirements than the warehouse inventory moving class of robots. • Warehouse inventory moving robots: Provide inventory management and order fulfillment tasks within large warehouse environments. This robot class is typically powered from a 24 to 72 volt battery source with opportunity charging performed on an as-needed basis. Component-based distributed power architectures for robotics This section reviews four examples of component-based distributed power architectures for robots ranging from a 15.9 kilowatt (kW) system for agricultural harvesting robots with a 760 volt battery pack down to a 1.2 kW system for warehouse inventory movement robots using a 48 volt battery pack. A common feature in three of these applications is a relatively high voltage main bus that distributes power throughout the robot, followed by one or more voltage step-down sections that deliver the needed power to the

subsystems. A high-voltage power distribution bus results in improved efficiency and lower power distribution currents which allows the use of smaller, lighter and less expensive power cables. The fourth application shows the simplification that can result in smaller robots that use 48 volt battery systems. The power delivery network (PDN) for agricultural harvesting robots comprises a 760 volt main power bus (Figure 1). This is supported by a series of fixed ratio (unregulated) isolated DC-DC converters (shown as BCM modules on left) with an output voltage of 1/16 of the input voltage. These converters are used in parallel, enabling the system to be resized according to the needs of the specific design. Further into the network, a series of fixed ratio (NBM, upper middle) and regulated buck-boost (PRMs, center) and buck converters (bottom) power downstream, lower voltage rails as needed. In this design, the servo is driven directly from the 48 volt intermediate power bus with no additional DC-DC conversion.

Figure 1 This PDN for 15.4 kW agricultural harvesting robots comprises a 760 volt distribution bus supporting a network of lower voltage converters (DCMs, PRMs, NBMs, and buck).

Figure 2 The PDN for campus and consumer delivery robots includes direct drive for the motor and an intermediate bus to power the remaining subsystems. © Vicor

Figure 3 The PDN for warehouse robots combines a 67 volt main power bus and a 48 volt intermediate power distribution bus. https://international.electronica-azi.ro

Figure 4 The PDN for warehouse robots using a 48 volt battery pack eliminates the need for an intermediate power bus, greatly simplifying the design.

POWER

The PDN for campus and consumer delivery robots shows the simplification that can result in medium power systems by employing a lower main power bus voltage (in this case, 100 volts), and adding regulation to the isolated DC-DC converters (DCMs) on the main power distribution bus to produce the 48 volt intermediate bus voltage (Figure 2). This approach enables the use of non-isolated buck-boost and buck DC-DC converters to power the various subsystems. In addition, the use of a lower voltage for the main power bus enables the motor drive to connect directly to the main bus, while the servo can connect directly to the 48 volt intermediate bus. Smaller campus and consumer delivery robots may incorporate a 24 volt intermediate bus voltage and either 24 or 48 volt servos, but the overall architecture is similar. The PDN for warehouse robots using a 67 volt battery pack highlights the use of buck-boost non-isolated DC-DC converters (PRMs) on the main power bus (Figure 3). These converters provide efficiencies of 96% to 98% and can be paralleled for higher power needs. This architecture also features a fixed ratio, non-isolated DC-DC converter (NBM) to power the GPU, and non-isolated regulated buck converters powering the logic sections. For smaller robot designs using a 48 volt battery there is no need to generate an intermediate bus voltage, simplifying the design (Figure 4). The loads are powered directly from the battery voltage by direct conversion using various non-isolated DC-DC converters. The elimination of the intermediate bus in the power train increases system efficiency and reduces power system weight and cost. Distributed power architecture design considerations As shown above, designers must make numerous power system choices to optimize a component-based PDN for robotics. There is no “one size fits all” approach. In general, larger robots benefit from higher battery voltages which can result in higher power distribution efficiencies and smaller, lighter power distribution buses. The use of isolated versus non-isolated DC-DC converters is an important consideration when optimizing overall system efficiency and minimizing costs. 24

The closer the DC-DC converter is to a low-voltage load the more likely it is that the optimal choice will be a lower cost, non-isolated power component, increasing overall PDN efficiency. When appropriate, the use of lower cost fixed-ratio (unregulated) DC-DC converters can also contribute to higher PDN efficiencies. Vicor offers DC-DC converters that are capable of supporting designers’ needs in a wide range of component-based distributed power delivery architectures, including the four outlined above. The following discussion focuses on specific devices that can be used in a power delivery system similar to the one described for campus and consumer delivery robots, as shown in Figure 2. DC-DC converters for robot power systems The DCM3623TA5N53B4T70 is an example of a DCM isolated and regulated DC-DC converter that can produce the 48 volt intermediate bus voltage from 100 volt battery power (Figure 5). This converter uses zero voltage switching (ZVS) technology to deliver a 90.7% peak efficiency and a 653 watts per cubic inch power density. It provides 3,000 volts dc isolation between the input and output. Leveraging the thermal and density benefits of Vicor’s Converter-housed-in-Package (ChiP) packaging technology, the DCM module offers flexible thermal management

options with very low top and bottom side thermal impedances. ChiP-based power components enable designers to achieve cost-effective power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably. To start exploring the capabilities of the DCM3623TA5N53B4T70, designers can use the DCM3623EA5N53B4T70 evaluation board (Figure 6). The DCM evaluation board can be configured for various enabling and fault monitoring schemes, as well as to exercise various modes of trimming depending upon the application requirements. The DCM3623EA5N53B4T70 can be used to evaluate DCMs in either a stand-alone configuration, or as an array of modules. © Vicor

Figure 5 The DCM3623TA5N53B4T70 isolated and regulated DC-DC converter can produce the 48 volt intermediate bus voltage from 100 volt battery power.

Figure 6: The DCM3623EA5N53B4T70 evaluation board enables designers to explore the capabilities of the DCM3623TA5N53B4T70 DC-DC converter. ©Vicor Electronica Azi International | 1/2021

DESIGN SOLUTIONS » Distributed Power Architecture

It also supports evaluation of various enable, trim and fault monitoring options: Enable options: • On-board mechanical switch (default) • External control Trim options: • Fixed trim operation (default): the TR pin is permitted to float at initial startup. The DCM disables output trimming and the output trim is programmed to the nominal rated VOUT. • Variable trim operation, on-board variable resistor: The trim pin voltage is ratiometric, with a rheostat working against a pull-up resistor inside the DCM to VCC. • Variable trim operation, off-board control: The trim pin voltage is controlled via external programming control, which is referenced to the –IN of each specific DCM in the system. Fault monitor options: • On-board LED: the FT pin drives a visible LED for visual feedback on fault status. • On-board optocoupler: the FT pin drives an on-board optocoupler to bring fault status across the primary-secondary isolation boundary. Vicor’s PI3740-00 buck-boost DC-DC converter can be used to produce 44 volt and 24 volt power for LED floodlights and high-definition (HD) cameras, respectively. It is a high efficiency, wide input and output range ZVS converter.

The PI3740-00 requires an external inductor, resistive divider, and minimal capacitors to form a complete buck-boost regulator. The 1 megahertz (MHz) switching frequency reduces the size of the external filtering components, improves power density, and enables fast dynamic response to line and load transients. To kickstart design with the PI3740-00, Vicor provides the PI3740-00-EVAL1 to evaluate the PI3740-00 in constant voltage applications where VOUT is above 8 volts. The board operates from an input voltage between 8 and 60 volts dc and supports output voltages up to 50 volts dc. Features of this eval board include: • Input and output lugs for source and load connections • Location to place a through-hole input aluminum electrolytic capacitor • Input source filter • Oscilloscope probe jack for accurate, high-frequency output and input voltage measurements • Signal pin test points and wire connectors • Kelvin voltage test points and sockets for all of the PI3740 pins • Jumper selectable high-side/low-side current sensing • Jumper selectable float voltage Finally, the PI3526-00-LGIZ buck regulator from Vicor can be used to provide 12 volt power for a computer and wireless subsystems in the PDN (Figure 8). © Vicor

This high-density system-in-package (SiP) integrates a controller, power switches, and support components (Figure 7). It features a peak efficiency up to 96%, as well as good light-load efficiency.

Figure 8 The PI3526-00-LGIZ buck regulator from Vicor can be used to provide the 12 volt power required by a computer and wireless subsystems in the PDN for campus and delivery robots.

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The evaluation board provides lugs, bottom layer banana jack footprints for input and output connections, signal connectors and test points, and Kelvin Johnson-Jacks for accurate power node voltage measurements. Conclusion Robotic system power conversion needs become more challenging as load capacities, visual recognition, and user functionality increase the complexity of robots. Existing power solutions can suffer from performance limitations in terms of size, efficiency, weight and scalability, making them less suitable for robotics applications. For robotics applications, designers can turn to component-based distributed power delivery architectures to power the motors, CPUs and other systems. As shown, this approach can result in a lighter weight power system, enabling further performance gains for batterypowered robotics. Flexibility is also enhanced as power conversion components can be paralleled to easily scale as power demands increase, allowing the same power architecture to be deployed across a platform of various sized robotic systems.

Recommended reading: 1. Reducing Robot Risk: How to Design a Safe Industrial Environment

Figure 7 The PI3740-00 buck-boost DC-DC converter SiP can be used to power LED floodlights and HD cameras in the PDN for campus and delivery robots.

The PI3526-00-EVAL1 evaluation board from Vicor can be configured to experiment with the PI3526-00-LGIZ buck regulator in a stand-alone or a remote sense configuration. Sockets are provided to permit quick probing and placement of a bulk input capacitor.

2. Use Compact Industrial Robots to Make Any Shop More Productive ►Digi-Key Electronics www.digikey.com

This DC-DC converter provides efficiency up to 98%, and support for user-adjustable soft start and tracking that includes fast and slow current-limit capabilities. These ZVS regulators integrate the controller, power switches, and support components in a SiP configuration. 25

COM Express Type 6 and COM-HPC Client

A New Generation of Embedded Processors It’s a new era for high-end embedded processors that are now available on two Computer-on-Module form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.

Author: Christian Eder, Director Marketing at congatec and Chairman of the PICMG COM-HPC Subcommittee Considerations and Concerns Up until today, COM Express had monopolized the high-end embedded computing field for designs based on Computeron-Modules. However, as COM-HPC surfaced, customers started to have numerous questions concerning their upcoming high-end embedded projects. To begin with, the first obvious quandary for them is understanding which processor they should leverage. Nevertheless, this issue is easy to resolve since today, and for the first time in many years, the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake) high-end embedded processors are available on two Computer-on26

Module form factors: COM-HPC® Client and COM Express® Type 6. Second of all, the existence of both form factors makes designers (especially those who have been using COM Express up to this point) wonder if they should adjust their current COM Express investments or upgrade instead to a new module standard and carrier board design. In fact, these are only the first few of many questions that come to mind. Designers also began reflecting on other pressing issues like: How realistic is it that COM-HPC could make COM Express outdated? If so, to what extent will users be able to find COM Express modules? Would an immediate

shift to COM-HPC be required? What kind of an impact would this module change to COM-HPC have on OEMs, their customers, and the competitors? Therefore, to address these concerns, a thorough exploration of COM-HPC is needed so designers can conclusively understand how these new modules work and what differentiates them from the COM Express Type 6 modules. Comparing and Contrasting COM Express Basic and COM-HPC Size A Much like COM Express, the COM-HPC Client form factor is a Computer-onModule standard by the PICMG. The guidelines additionally define specific COM-HPC Server modules; however, those modules will not be discussed in this article as they are headless and serveroriented. COM-HPC Client modules on the other hand, like COM Express Type 6 modules, support graphics. COM-HPC Client modules are available in three footprints: 120 mm × 160 mm (Size C), 120 mm × 120 mm (Size B), and 120 mm × 95 mm (Size A). Hence, COM-HPC size A is practically the same as COM Express Basic with its 125 mm × 95 mm dimensions. Yet, the 95 mm × 95 mm COM Express Compact is almost 21% more compact. Electronica Azi International | 1/2021

DESIGN SOLUTIONS » COM-HPC

Therefore, upgrading from COM Express Basic to COM-HPC Size A is an effortless task as the former is only 4% larger than the latest module. The bigger Size B and Size C COMHPC Client modules, however, cover an even higher performance class above COM Express Type 6 modules and cater to the needs of high-performance applications that are not compatible with COM Express. As for the users who have been relying on COM Express Basic for their designs, they can always select the COM-HPC Client Size A form factor. It’s worth mentioning, though, that no COM-HPC Client option exists for the COM Express Compact size design. Accordingly, this clearly proves how the two factors are meant to supplement – rather than override – each other. COM-HPC’s Higher Thermal Design Power In addition to their bigger footprint sizes, COM-HPC modules can support higher power budgets than COM Express. Given that the Thermal Design Power (TDP) of COM-HPC modules can reach up to 200 watts, its power envelope is almost twice as high as that of COM Express Type 6, which cannot exceed 137 watts TDP. This makes COM-HPC’s TDP a whopping 46% higher. Hence, any user looking for a stronger processor power (which leads to a higher TDP) that COM Express is not currently able to support must consider making the shift to COM-HPC. That said, COM-HPC Size A modules like the latest 15-watt congaHPC/cTLU along with the 11th Intel Core processor generation will operate at the

comparable CPU performance range as that of earlier COM Express modules. Furthermore, and as discussed in the next section, developers will find it greatly useful that COMHPC has almost twice the number of signal pins, thereby ensuring a significantly larger bandwidth than the one COM Express Type 6 is currently able to offer.

COM-HPC’s Increased Number of Signal Pins & Bandwidth COM Express Basic Type 6 and COM-HPC Client Size A are also dissimilar with regards to the connector and number of signal pins securing the module to the carrier board. While both COM Express and COM-HPC have two connectors, each

A few factors differentiate the COM-HPC Client from the COM Express Type 6 like: The number and bandwidth of PCIe lanes, Ethernet interfaces, and USB ports. Moreover, another distinguishing feature is that only the COM-HPC Client is supplemented with further remote management support (details available upon request). COM-HPC connector has 400 pins while each COM Express connector has only 220 pins. This enormous addition in the case of COM-HPC results in a total of 800 signal pins that smoothly facilitate the connection of almost 80% more interfaces.

Much like its COM Express counterpart, the COM-HPC Client is available in three unique footprints. Since COM-Express is only slightly smaller than COM-HPC Client Size A, users can easily upgrade from the first to the latter. https://international.electronica-azi.ro

Moreover, since the COM-HPC connector is engineered for high-speed interfaces, it works well with high clock rates of PCIe 5.0 and 25 Gb/s Ethernet. On the other hand, because the connector is a major constraint for COM Express, it is suitable for interfaces up to PCIe Gen 3.0 and PCIe 4.0 in compatibility mode. However, there are efforts to replace the COM Express connector with one that is mechanically fully compatible but electronically more powerful and compatible with PCIe 4.0. Once this goal becomes a reality, it will certainly pave the way for many other innovations involving COM Express. 27

EMBEDDED COMPUTING

The Relation between Footprints and RAM Capacity Both COM-HPC and COM Express rely on SO-DIMMs (soldered memory) for their RAM capacity. To date, the RAM capacity of COM Express Basic has been proven to reach almost 128 Gbytes. As a result, and because both form factors have footprints that are nearly identical, the RAM capacity for COM-HPC Size A should also be (more or less) the same as well. If users need additional RAM, they have to rely on larger form factors. In fact, the larger

need of more memory. In addition, the modules would allow the integration of eight SO-DIMM memory modules, thereby offering up to 1.0 Terabyte of RAM. Hence, even though the COM-HPC Client Size A module can supply more memory than the latest Tiger Lake UP3 COM Express Type 6 Compact, additional RAM capacity is not being exploited for the current module. In fact, Size A and Type 6 both provide two SO-DIMM sockets for 3200 MT/s and 32 GB DDR4, culminating in a total of 64 GB RAM. However, devel-

The conga-HPC/cTLU COM-HPC Size A module requires a newly-designed carrier board. The COM-HPC evaluation board is likely to be ready for sale and distribution in the near future. COM Express extended form factor had virtually no relevance. So, larger modules will be based on the COM-HPC standard. All this will take place in the new future as COM-HPC Server modules can cater to RAM needs reaching up to the mid-performance server class that is almost always in 28

opers cannot fully benefit from the increased memory capacity of the larger COM-HPC form factors because the Tiger Lake UP3 is not able to handle more. To be more specific, requiring more RAM would undoubtedly create the need for a form factor that is bigger than the available

COM Express Basic or COM HPC Size A modules. Nevertheless, with the constant advancements taking place related to memory density, it is very unlikely for RAM capacity to become a hinderance to targeted multi-purpose applications. Graphics and Audio Support Since COM-HPC Client and COM Express Type 6 can handle up to four displays facilitated by three digital display interfaces (DDI) and one embedded DisplayPort (eDP), the graphics support offered by the Client form factor is equivalent to that of Type 6. Earlier COM Express modules were fully equipped with an HDA interface; however, with multimedia interfaces, COM-HPC is able to replace this past interface with SoundWire: The new MIPI standard. Sound Wire needs just two lines and operates at rates reaching up to 12.288 Mhz. Furthermore, the standard can support up to four audio codecs in parallel on these two lines, with each codec having its own unique ID to enable evaluation. This is a significant breakthrough for applications that also rely on sound features. Compatibility with PCIe Gen 4 and GbE beyond 1b Gigabit Bandwidth COM-HPC Client has almost twice as many PCle lanes as COM Express Type 6: While the latter accommodates up to 24 PCIe lanes, the former is able to provide 49 PCle lanes. It is important to note that one PCIe lane of COM-HPC Client is exclusively dedicated to communicating with the Board Management Controller (BMC) of the carrier board. The COM-HPC Client standard additionally supports two 25 GbE KR and up to two 10 GbE BaseT Ethernet interfaces. However, all the capabilities of this standard have not been fully unlocked yet by the current (11th) Intel Core processor generation. On the other hand, COM Express Type 6 can only handle a maximum of 1x1 GbE off the module; although, more network interfaces can be connected through PCIe and controlled from the carrier board. Therefore, since the two form factors rely on a PCIe x4 Gen 4 interface, the resulting high bandwidth connections to peripherals is exactly the same for both. Moreover, developers can also leverage 8x PCIe Gen 3.0 x1 lanes with either module. Therefore, at least at the processor level, there is no difference. That said, the distinction only becomes apparent with GbE as the COMHPC modules support 2x 2.5 GbE native Electronica Azi International | 1/2021

DESIGN SOLUTIONS » COM-HPC

connectivity, and COM Express modules allow 1x GbE natively. Consequently, the developers of COM Express have to invest in the components required for the carrier board in order to match the GbE performance of COM-HPC modules. Lastly, both COM-HPC and COM Express Type 6 modules are compatible with TimeSensitive Networking (TSN) for real-time communication via Ethernet. Accordingly, besides the fact that 2.5 GbE is a COM-HPC feature only, there are no major points of contrast with regards to PCIe and GbE. High USB Bandwidth and MIPI-CSI Interface Support The COM-HPC standard is specifically designed to support high speed interfaces. As such, the COM-HPC Client modules can accommodate up to 4x USB 4.0 interfaces and 4x USB 2.0 proving. COM Express Type 6 modules, however, can handle up to 4x USB 3.2 and 8x USB 2.0. Notwithstanding that COM-HPC has four less USB 2.0 ports than COM Express Type 6 modules, the Client is still able to offer a larger bandwidth as the USB 4.0 transfer rate is 40 Gbps.

The conga-TC570 COM Express Compact module, along with its integrated Intel Tiger Lake UP3 processor, is considered a turnkey product as it can be directly placed (plug & play) on current COM Express carrier boards that support either COM Express Basic or Compact. Moreover, COM-HPC can natively integrate up to two MIPI-CSI interfaces. These two interfaces are simultaneously economical and compatible with cameras crucial for running numerous applications and facilitating 3D vision. Modules supporting two independent cameras are very versatile and can be utilized for multiple purposes including but not limited to: user identification, gesture control, augmented reality for maintenance, video surveillance and optical quality assurance, https://international.electronica-azi.ro

situational awareness for autonomous vehicles, and collaborative robotics. Hence, the fact that COM-HPC provides MIPI-CSI interface support gives it an advantage over COM Express Type 6. To date, the conga-HPC/cTLU model is able to support these two MIPI-CSI interfaces. In fact, the conga-HPC/cTLU also offers (besides the x86 instruction set afforded in Tiger Lake UP3) AI/DL instruction sets, Vector Neural Network Instructions (VNNI) support, and additionally features up to 96 execution units provided by the integrated Intel Xe graphics (Gen 12). COM-HPC additionally allows 2x SATA interfaces to connect traditional SSDs and HDDs, as well as industrial interfaces like 2x UART and 12x GPIO. Finally, 2x I2C, SPI and eSPI complete this feature set. That said, while these COM-HPC Client features are comparable to COM Express Type 6, CAN bus support is only possible with Type 6 modules. Upgrading to COM-HPC Client: Urgent or Unnecessary? Having meticulously compared and contrasted COM-HPC client and COM Express Type 6, it becomes clear that COM Express will be the ideal platform for most designs for a minimum of another 3-5 years. This is largely because COM-HPC Client does not introduce a completely new system bus. While earlier changes included shifting from ISA to PCI and from PCI to PCI Express, with COM-HPC, specifying a new pinpoint was crucial. Another important detail to remember is the fact that it wasn’t until 2012 that COM Express finally superseded ETX by becoming the best-selling module standard. This happened almost 11 years after the launch of ETX, and 7 years after the launch of COM Express; and despite all that, ETX modules still did not become obsolete! Lastly, PCIe generations are backwards compatible and allow PCIe Gen 3.0 designs to have a durable shelf life – long after PCIe Gen 4.0 is set up across all processor levels. Therefore, if the bandwidths and interface specifications of a given design satisfy the standard requirements, it is absolutely unnecessary to upgrade to the COM-HPC Client module. The Users of COM-HPC On the other hand, the users who absolutely must opt for COM-HPC are those who would need certain specific interfaces supported by the modules. These interfaces are: full USB 4.0 band-

width, 2.5 GbE, SoundWire, and/or MIPICSI today. In fact, anyone seeking higherperformance PCIe or Ethernet interfaces with up to 25 GbE must also give serious consideration to COM-HPC. Moreover, developers of high-performance systems should keep in mind that it is far simpler to scale down a design within a chosen standard than wait for performance increases of another standard that may never even happen in the first place. While this has been the driving rationale for all innovations involving COM-HPC, it is also balanced by the equally effective motto of “Never change a running system.” Edge Server Module Remote Management Forthcoming To make the COM-HPC launch all the more special, the PICMG Remote Management Subcommittee is also working on designing an extended remote management interface with the goal of creating a simplified version of the complex Intelligent Platform Management Interface (IPMI) specification to support the remote management of edge server modules. If successful, the new set will allow OEMs and users to ensure servergrade reliability, availability, maintainability, and security (RAMS). Furthermore, the addition of a board management controller on the carrier board helps to extend remote management serviceability to individual carrier board and further system demands as needed. This way, OEMs can be equipped with a stable basis for remote management that they can later adjust whenever they want to as their needs and priorities inevitably change. Conclusion In a perpetually advancing and highly digital age, COM Express shows a lot of promise at the performance level. However, the High-Performance Computing COM-HPC modules also accommodate a wide array of newly emerging compute-intensive applications, which require the processing of bandwidth-intensive data streams in a compact edge device. For more info regarding congatec’s 11th Gen Intel Core processors based embedded computers, browse the main landing page: https://congatec.com/11th-gen-intel-core/ ►congatec www.congatec.com

A Quantum Leap for High-Speed Transmission

Everyone’s long been talking about 5G, and the first networks have already been built and early tests have been conducted. But what actual benefits will 5G provide? How will cellular infrastructure change? And what about LTE? Do all designs now need to be ported directly to 5G? Author: Anja Schaal Team Leader Product Marketing Wirless To determine whether and when businesses should start adopting 5G, it is worth taking a look at the three key aspects of 5G. Because these cater to different applications, they each offer different improvements:

New Infrastructure for 5G The first eMBB 5G products are already available on the market based on 3GPP Release 15. However, most are unable to provide the target data rate of 20Gbit/s.

eMBB (Enhanced Mobile BroadBand) with data transfer rates of up to 20Gbit/s is tailored to digital lifestyle applications as well as high-bandwidth applications such as HD videos, virtual reality and augmented reality. The high-speed data rates allow for ultra-fast loading of websites and for the uninterrupted streaming of video content.

mMTC (Massive Machine Type Communications) − offers stable network coverage everywhere in urban environments thanks to a very high connection density of MTC devices. In the final 5G development stage, a million of these connections will be supported per square kilometer, allowing numerous devices to send and receive data in the same wireless cell at the same time without disrupting one another, making connection problems in a full stadium or festival a thing of the past.

The existing LTE/sub-6GHz bands (Frequency Range 1, FR1) are usually unable to provide enough bandwidth for this purpose, which is why new bands are required for 5G - the mmWave ultra high frequency bands from 24 to 100GHz (FR2). These require entirely new mobile communications infrastructure, because an LTE radio tower covers an area of several square kilometers around it. mmWave signals only support a maximum range of one kilometer - and this isn’t all around like LTE signals, but rather in just one direction. Even so, many businesses are already launching their 5G eMBB projects, which the 5G n78 frequency band (3.3 to 3.8GHz) allows them to do. uRLLC (Ultra-Reliable and Low Latency Communications) provides latency of under 1ms to allow for time-critical applications where reliability is important—if not essential. It is essential for making autonomous driving, car-to-car and carto-everything communication possible in the first place, not to mention cloudbased predictive maintenance.

Electronica Azi International | 1/2021

DESIGN SOLUTIONS » New Infrastructure for 5G

The transition from 4G (LTE-M/NB-IoT) to 5G (mMTC) will be a smooth one—with each 3GPP Release, the technologies will continue to evolve until they ultimately become 5G.

The latest LTE-M and NB-IoT solutions are already available and compliant with 3GPP Release 14. Both technologies are undergoing continued development with each new 3GPP Release, until they ultimately - as of today with 3GPP Release 16 - become 5G mMTC. This means that LTE-IoT devices currently working using LTE-M and NB-IoT will still work under 5G NR. This is true both

for standalone 5G networks (SA) where 5G NR uses a core 5G network, and also for non-standalone networks (NSA), where 5G NR services are provided over a 4G/EPC (Evolved Packet Core) network. As a result, it is not only possible for existing LTE and LTE-IoT designs to continue operating seamlessly under 5G - it is actually recommended to already start working on an LTE-M/NB-IoT solution for mMTC applications to ensure a smooth transition down the line. Components for the First Steps If you want to jump right in to 5G, Rutronik already has the right components for it.

Long Term Evolution Living Up to the Name Does the introduction of the new 5G NR standards (New Radio) make the existing LTE designs obsolete? Such concerns are justified, as many 5G FR1 frequency bands overlap LTE bands. But there’s no need to worry - technologies like DSS (Dynamic Spectrum

Sharing) allow different standards such as LTE and 5G to share the same frequency band. 5G NR also supports inband LTE-IoT -which is LTE-M with NBIoT, so “Long Term Evolution” (LTE) will still live up to its name.

This allows the creation of private or company-specific mobile networks, known as campus networks. These allow businesses to be broadly independent of mobile communication service providers - and lets them gain a headstart in setting up their smart factories.

Ideal for high data transfer rates Telit’s FN980m data card www.international.electronica-azi.ro

The ME310G1 module enables applications involving thousands or millions of IoT devices. 31

For eMBB implementations, the FN980m 5G/LTE card from Telit is one of the first to support 5G 3GPP Release 15 with sub6GHz frequencies FDD and TDD as well as mmWave, LTE, WCDMA and GNSS. 5G therefore offers downlink capacity of up to 5.5Gbit/s and uplink capacity of up to 2.7Gbit/s, while 4G still only allows 2.4Gbit/s in the downlink and 211Mbit/s in the uplink. With the standard M.2 (NGFF) form factor and an operating temperature of –40 to +85°C, it is suitable for wireless fixed network access points with high transmission rates, corporate routers and gateways, indoor and outdoor end devices (Customer Premises Equipment, CPE), video transmission and monitoring. The FN980 card model is also available as a purely 5G/LTE sub-6GHz solution. Telit has added the ME310G1 module to its xE310 family specifically for mMTC applications. Support for 3GPP Release 14 Cat M1/NB2 with Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX) allows for IoT applications with low energy consumption and longer battery life. It is ideal for applications involving thousands or millions of IoT devices where not only energy efficiency but also low costs are more important than high-speed data rates (e.g. medical devices, fitness trackers, industrial sensors, smart meters). With a maximum coupling loss (MCL) of up to 15dB/20dB, the module also offers better coverage and thus better penetration into buildings compared to previous cellular LTE standards. Nordic Semiconductor also offers a solution for LTE-M and NB-IoT (3GPP Release 13) in the form of the nRF9160 SiP (System in Package) module. This extremely com-

pact, highly-integrated SiP is pre-certified for global operation. It provides the application MCU, an ARM Cortex-M33 CPU with ARM TrustZone and ARM CryptoCell security technologies, the LTE modem, and RF front end and power management in an enclosure measuring 10mm × 16mm × 1mm. For asset tracking with precise position detection, there is a version with GPS support. With many digital and analog interfaces as well as peripheral devices, the nRF9160 is ideal for connecting devices to the internet via a mobile network, for logistics and asset tracking, for smart metering, smart city applications, smart infrastructure, smart agriculture, wearables and medical applications. Antennas for 5G Applications 5G antennas are also already part of the Rutronik portfolio. With a frequency range of 698 to 6000MHz, the W3554 series ultrabroadband dipole antenna from Pulse Larsen is suitable not only for 5G applications, but also 2G, 3G and 4G as well as GNSS, WiFi, Bluetooth, Bluetooth Low Energy, ZigBee and the 868, 915, 2400 and

©P

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5G, 4G, 3G or 2G, GNSS, WiFi, Bluetooth and more - PulseLarsen’s W3554 ultra-broadband dipole antenna can do it all.

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5000MHz ISM bands. The PCB antenna measures just 30mm × 120mm × 0.2mm. The compact W3415 5G SMD antenna from PulseLarsen supports all sub-6GHz bands (4G and 5G) with a size of just 40mm × 7mm × 3mm. With multiple antennas on one board, MIMO (multiple input, multiple output) allows for optimum use of 5G. One antenna can be used as the main antenna, while one can be used as a diversity antenna.

The compact W3415 SMD antenna from PulseLarsen supports all sub-6GHz bands (4G and 5G). Power Supply, Computing and Other 5G Aspects For developing an internal campus network, FSP provides special 5G network components. These are suitable for supplying base stations, access networks, data centers or individual network devices. Thanks to the supplier’s expanded and revised portfolio, the need to design network components yourself is finally a thing of the past. Rutronik is also able to develop custom solution concepts for networkbased information processing using products from Asus, Advantech and Intel. And if even the distributor’s considerable portfolio is unable to meet all of a customer’s needs, Rutronik can still call upon numerous partner companies as a member of the 5G Campus Network Alliance.

Conclusion To provide global 5G network coverage, cellular infrastructure will see major changes, especially through campus networks. The driving force of this change will be the improvements enabled by the 5G application profiles. But those developing on the basis of LTE have no reason to fear—LTE will survive under 5G. ►Rutronik | www.rutronik.com

Despite highly compact dimensions, the nRF9160 is highly integrated. 32

Electronica Azi International | 1/2021

PRODUCT NEWS

Flexible plug-in options for mechatronics:

Rutronik offers Lumberg high-current contact elements for price-sensitive applications Optimum connection even in tight spaces: thanks to the contact surfaces (Footprint 14,0mm × 10,2mm) that are open on both sides, the phase contact from Lumberg offers various mating options: from above, through the PCB or from below (Tab 0,8/1,0mm). The contact elements are particularly essential for numerous applications in the automotive sector, such as frequency converters of industrial electric motors, control units in electric vehicles, battery storage units or onboard charging modules. The Lumberg portfolio is available at https://www.rutronik24.com. The high-current contact element is suitable for both reflow soldering on the PCB and laser-welded placement on a conhttps://international.electronica-azi.ro

nection frame. It provides a vertical connection with a blade contact on a second PCB or busbar. This means that even in tight installation spaces, PCBs lying on top of each other can be connected with a precise fit and rated currents of up to 80A per contact can be transmitted. The contact comes with a CuNiSi alloy and is suitable for use at an operating temperature of -40°C to +120°C. Packaging on a roll is available for automatic assembly. For more information about Lumberg`s high-current contact elementsand a direct ordering option, please visit our e-commerce platform at https://www.rutronik24.com. https://www.rutronik24.com/searchresult/qs:%22CONN4201%22%20%22CO NN5292%22/reset:0

Rutronik https://www.rutronik.com 33

Sustaining the Industry and the Environment Sustainability is vitally important for the electronic components industry, from both a business and environmental standpoint. Authors:

Sandi Bevington, Manager of Corporate Certifications Digi-Key Electronics

Standardization (ISO) is the set of criteria that provides a framework for measuring and improving the company’s environmental impact.

Shane Heinle Senior supervisor, ESD program control Digi-Key Electronics

Not only is corporate responsibility key to addressing and mitigating factors that can contribute to climate change, such as pollution from increased energy consumption, packaging waste, inefficient shipping practices and more, but it can also be valuable to the bottom line like reducing the amount of resources needed to run a business. In turn, these practices are also good for our customers. At Digi-Key, sustainability is woven into every aspect of our business. We aim to be a positive corporate steward of resources in our local communities and around the world with the intent to create a positive legacy we can all be proud of.

Rick Harris Director, Facility and System management Digi-Key Electronics

Continual improvement also involves continual learning through benchmarking with others in the industry, our partners, customers, and lessons learned. Digi-Key is proud to have our Environmental Management System certified to ISO 14001. International Organization for

Digi-Key’s new product distribution center in Thief River Falls, Minnesota, is a prime example of this continual improvement mindset. Throughout the design process, we have worked to identify the most efficient and sustainable practices to ensure our facility adheres to the highest health and environmental best practices possible. Some of these practices may be quite simple, such as building the roof with a white membrane to reflect the sun’s heat, while others are quite complex, such as exploring opportunities with renewable energy sources. New construction is not the only opportunity for improvements. We have taken on aggressive retrofit projects at our existing facility, such as an ionized air purification system, sensor-activated LED lights, highefficiency water heaters and more.

For the last five years, Digi-Key’s Purchasing team has volunteered to serve as the Thief River Falls Adopt-a-River clean-up crew.

Striving for continual improvement Our approach to sustainable practices is one of continual improvement and optimization. We consistently and proactively seek out opportunities to implement solutions across our business to reduce the use of resources, increase efficiencies, and promote volunteer opportunities. 34

Electronica Azi International | 1/2021

Digi-Key’s new facility features a roof built with a white membrane to reflect the sun’s heat.

Digi-Key’s new facility features an energy efficient MT system.

COMPANIES

Digi-Key employees also participate in environmental volunteer opportunities through the Digi-Key Cares program. Our IT and Purchasing departments have adopted sections of local highway for cleanups, and for the last five years the Purchasing department has also adopted a section of the local river. These Digi-Key employees donate their time twice a year to clean the miles of banks and ditches of these areas eliminating more than 135 kilos of litter each year. Sustainability in everything With more than 2.6 million products in stock and available for immediate shipment at our U.S. facility, efficient and innovative materials handling and packaging practices are vital to ensuring that customers receive their orders quickly with as little waste as possible. We purposefully designed our conveying system to use as little energy as possible while maximizing efficiency. We also use several types of paper-based

recycled materials in our packaging, which limits the amount of plastic and foam used in shipments. Digi-Key’s annual recycling outweighs the amount of waste generated, while promoting the re-use of materials as much as possible. For example, we donate our bubble wrap to a local company, collect and donate our aluminum cans to a local non-profit for recycling, provide corrugate to be reused by employees for personal use, and even sell or give used office equipment to employees when possible. We also encourage our partners to utilize sustainable practices in their operations. As a hub for the top shippers in the U.S., we take pride in our carriers’ efforts such as committing and making progress towards converting a portion of their fleet to alternate fuel or advanced tech, improving fuel efficiency by significant percentages, and converting a percentage of its electricity usage to renewable energy.

Take pride in efforts We strive for excellence in all that we do at Digi-Key, and minimizing our environmental footprint is one of the many ways we aim to serve our global community of customers. As one of the largest distributors of electronics components, we are proud to be constantly developing new and innovative solutions to reduce the use of resources while maintaining the high level of service and product selection our customers rely on. Digi-Key is one of the world’s largest, fullservice distributors of electronics components, offering more than 11.5 million products with over 2.6 million in stock and available for immediate shipment, from more than 1,500 quality, namebrand manufacturers. ►Digi-Key Electronics www.digikey.ro

Digi-Key’s new facility features an energy efficient MT system.

Electronica Azi International | 1/2021

PICMG Announces Official Ratification of COM-HPC Specification The open specification for high performance compute modules is approved by the PICMG Consortium PICMG, a leading consortium for the development of open embedded computing specifications, announces that COM-HPC has been approved and ratified, and is now available for public download and distribution. COM-HPC defines five module sizes to deliver edge server performance for small, rugged data centers. The specification addresses emerging requirements in the embedded and edge computing market. The base specification will be accompanied later this year by a Platform Management Interface Specification, COM-HPC EEEP, and a Carrier Board Design Guide. It is important to note that the specification covers two classes of modules. The COM-HPC Client Module Type targets use in high end embedded client products

that need one or more displays, a full set of low, medium, and extremely high bandwidth I/O, powerful CPUs and modest size. Typical uses are in medical equipment, high end instrumentation, industrial equipment, casino gaming equipment, ruggedized field PCs, transportation and defense systems and much more. The COM-HPC Server Type targets use in high end headless (no display) embedded servers that require intensive CPU capability, large memory capacity, and lots of high bandwidth I/O including multiple 10Gbps or 25Gbps Ethernet, and up to 65 PCIe lanes, at up to PCIe Gen 5 speeds. Typical uses are in embedded server equipment ruggedized for use in field environments and applications such as autonomous vehicles, cell tower base stations, geophysical

field equipment, medical equipment, defense systems and much more. Both client and server modules have a dedicated platform management interface which is the first for a COM standard to include remote administration. This new specification does not replace COM Express, which will continue to play a crucial role in the COM marketplace for many years. The specification documents are available for download on the PICMG website at https://www.picmg.org/wp-content/ uploads/PICMG_COM_HPC-PreviewSpecification-Nov2020.pdf. TECHNICAL HIGHLIGHTS: • Two 400-pin BGA mount high-performance connectors • Platform Management Interface • Not limited to x86 processors • Provides for the use of x86 & RISC processors, FPGAs and GPGPUs • COM-HPC Client Modules • Up to 48 + 1 PCI Express Gen4/5 lanes • Up to 4x USB4 • Up to 4x video interfaces • Up to 2x 25 Gb Ethernet interfaces • Module sizes: • Size A: 95 × 120 mm • Size B: 120 × 120 mm • Size C: 160 × 120 mm • COM-HPC Server Modules • Up to 64 + 1 PCI Express Gen4/5 lanes • Up to 2x USB4 • Up to 4 graphic interfaces / headless • Up to 8x 25 Gb Ethernet interfaces • Module sizes: • Size D: 160 × 160 mm • Size E: 200 × 160 mm For more information on COM-HPC visit: https://www.picmg.org/openstandards/com-hpc/ PICMG https://www.picmg.org

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PRODUCT NEWS

Thin Mini-ITX motherboard for 10th generation Core-I processors Flat Mini ITX motherboard for Comet Lake processors Behind the term PH11CMI hides a new motherboard from ICP Germany in the Thin Mini-ITX form factor, which supports the 10th generation of Intel® CoreTM processors. The mainboard in the classic size of 170 × 170 mm only has a height of 20 mm. The PH11CMI is equipped with the Intel® H410 chipset and features an LGA 1200 socket. All Intel® CoreTM I processors of the 10th generation with 10 cores and 35 Watt thermal design power as well as processors with 8 cores and 65 Watt thermal design power can be used on the PH11CMI. Two DDR4 SO-DIMM sockets allow the use of up to 64GB non-ECC memory with a maximum clock frequency of up to 2933 MHz. The integrated Intel® HD graphics unit offers dual display support at a maximum resolution of 4K. On the PH11CMI, an HDMI port with a resolution of up to 4096×2160 pixels, a display port with a maximum of 4096×2304 pixels and an LVDS port with a full HD 1920×1200 pixel resolution are available for connecting displays. Optionally, the LVDS port can be replaced by an eDP port with 4096×2304 pixel resolution. Furthermore, an Intel® I219M and an Intel® I211-AT Gigabit LAN, four USB 3.2 (generation 1), five USB 2.0, two SATA-6G ports, three serial RS-232 and one serial RS-232/422/485 as well as audio MICIn and LINE-Out interfaces are available. The MiAPI pin header also provides 10 GPIOs, watchdog, SMBUS, brightness control for displays and motherboard monitoring functionality. For expansion, the PH11CMI offers a PCI-Express 3.0 x4 slot, an M.2 2242/2280 M-Key and an M.2 2230 slot with E-Key. A TPM pin header optionally enables the use of the TPM NPCT750 module board. The PH11CMI is offered in two voltage input variants with 12 volts or 19 volts DC. Both variants are designed for a temperature range of 0 to 60°C and meet CE/FCC Class B requirements. Upon customer request, ICP also delivers the PH11CMI as a bundle with processor, industrial RAM and storage medium. ►ICP Deutschland | https://www.icp-deutschland.de 38

Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem Imperas developed test suites released as open source under the Apache 2.0 license Imperas Software Ltd., the leader in RISC-V processor verification technology, today announced the release of the latest update to the RISC-V architectural validation test suites for the RV32/64K Crypto (scalar) extension. Developed in conjunction with the guidelines of the RISC-V International Architecture Tests SIG, Imperas has achieved an almost 100% functional coverage of the instructions based on the RISC-V Cryptographic Extensions task group’s functional coverage plan. The released tests support the RISC-V ISA Crypto specification proposed as the “K” extension, current draft spec 0.8.1, and will be updated as the spec is publicly reviewed and ratified. Imperas has uploaded the new test suite to the official RISC-V International GitHub repository, available at https://github.com/ riscv/riscv-arch-test, and the riscv-crypto repository is on GitHub at https://github.com/riscv/riscv-crypto. In addition, Imperas has also updated the free RISC-V Open Virtual Platform Simulator, known as riscvOVPsimPlus™, as a reference Instruction Set Simulator (ISS) for users and developers of RISC‑V processor cores, with the new Crypto extensions, which is available on OVPworld. “The new scalar cryptography extension for RISC-V is designed to be lightweight and to be suitable for 32- and 64-bit base architectures, from embedded, IoT class cores to large, application class cores,” said Richard Newell, Associate Technical Fellow at Microchip and Chair of the RISC-V International Cryptographic Extensions Task Group. “The working group coordinates the member driven contributions and we welcome the Imperas Crypto tests to support the early implementors and adopters.” “The RISC-V open standard ISA offers a compatibility framework, yet has built-in flexibility across the specification envelope,” said Electronica Azi International | 1/2021

Kontron expands its Industrial Ethernet solutions with the KSwitch family New portfolio of industrial-grade Ethernet Switches with long-term availability Allen Baum of Esperanto Technologies, Inc., and Chair of the RISC-V International Architecture Test SIG. “The Imperas contribution of new Crypto extension tests is a welcome addition to the trusted test suite portfolio, supporting implementers with verification of their hardware.”

The free riscvOVPsimPlus package including many test suites and functional coverage analysis is available on OVPWorld at: https://www.ovpworld.org/riscvOVPsimPlus/

Kontron, a global leader in IoT/Embedded Computing Technology (ECT), is expanding its Industrial Switch product line with additional high-performance and cost-effective models of the KSwitch family for Fast- and Gigabit- Ethernet. The first 23 KSwitch variants will be available before the end of Q1/2021, with additional variants to be added throughout the year. Modern high-performance chips, automation solutions, 5G connectivity and, last but not least, industrial switches are essential building blocks for successful Industry 4.0 and IoT applications. Kontron’s new KSwitch models are suitable for Fast- and Gigabit-networks up to 10G and have been specially developed for use in industrial environments. In addition to a compact design, the switches offer the possibility to easily connect machines, controllers and other components based on industry standards. All switches can be flexibly combined with each other, making it easier to set up a future-oriented IT environment. Thanks to the single-chip design, the switches operate reliably and with high performance while reducing power consumption. Further cost savings result from the use of standardized RJ45 and optional SFP (small form factor pluggable) slots. SFPs are available as modular, optical or electrical transceivers for fiber optics or “direct attach copper” and can be used flexibly and scalably depending on the application. The compact design reduces the space requirement in the control cabinet or industrial rack by up to 35%. The switches have a high-quality metal housing, which predestines them for use in rugged environments. They can be used at temperatures from -40 to +75º Celsius or from -10 to +60º Celsius as standard, and most products also support an extended supply voltage range from 12 to 58V DC. Thanks to the robust power supply and electrical immunity on each port of up to 2KV Surge, the switches operate safely and reliably even in harsh production environments with strong magnetic fields or unstable power source. All models will be available for purchase from the online shop of Kontron’s partner Rutronik24 as of March 2021.

►Imperas | http://www.imperas.com

►Kontron – An S&T Company | https://www.kontron.com

“RISC-V International’s mission is to support the adoption of RISCV through industry-wide partnerships and collaboration,” said Mark Himelstein, CTO of RISC-V International. “The continued contributions, including the Imperas Open Source Architecture tests, are helping to ensure an ecosystem of compatibility that all members and users can build on.” “As the lead implementors complete the verification phase of the Crypto extensions, a final test case is needed for architectural validation,” said Simon Davidmann, CEO at Imperas Software Ltd. “Imperas developed these test suites for our commercial users, and we are now pleased to offer these as open source to support the growing RISC-V Verification Ecosystem.” The free riscvOVPsimPlus package including the test suites and functional coverage analysis are now available on OVPworld at www.ovpworld.org/riscvOVPsimPlus. The riscvOVPsimPlus solution is an entry ramp for development and verification and includes a proprietary freeware license from Imperas, which covers free commercial use as well as academic use. The simulator package also includes a complete open-source model licensed under the Apache 2.0 license. Availability: The RV32/64K Crypto (scalar) Architectural Validation Test Suites are available now on GitHub at: https://github.com/riscv/riscv-arch-test

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PRODUCT NEWS

KIOXIA Introduces World’s Thinnest 1TB Ver 3.1 UFS Embedded Flash Memory Device KIOXIA Europe GmbH announced sampling of its 1 terabyte (TB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in a 1.1mm-high package – making it the thinnest 1TB UFS offering available – the new product utilizes KIOXIA’s BiCS FLASH 3D flash memory and achieves sequential read speed of up to 2,050MB/sec and sequential write speed of up to 1,200MB/sec. Mobile devices are constantly evolving, and 5G networks are poised to deliver levels of speed, scale and complexities the likes of which have never been seen before. Reaping the connectivity benefits of 5G – namely, faster downloads and reduced lag time – requires high performance and low power consumption. Additionally, with 5G making it easier and faster for users to store even more on their mobile devices, the storage requirements for smartphones and other applications are increasing at a rapid pace. KIOXIA’s 1TB UFS brings the ultra-high speed read/write performance, low power consumption, shortened application launch times and storage capacity demanded by 5G and other digital consumer products. KIOXIA’s new 1TB UFS device integrates BiCS FLASH 3D flash memory and a controller, which performs error correction, wear leveling, logical-to-physical address translation and bad-block management for simplified system development. “The introduction of a 1 TB UFS device with a super thin package reconfirms the leading position of KIOXIA in the mobile NAND Flash memory market. Mobile markets continuously require higher performance and densities to enable the development of new features and functions”, explains Axel Stoermann, Vice President Memory Marketing & Engineering, KIOXIA Europe GmbH. The new UFS 1TB device includes the following features: WriteBooster: Enables significantly faster write speeds. Host Performance Booster (HPB) Ver. 2.0: Improves random read performance by utilizing the host side memory to store logical to physical translation tables. While HPB Ver. 1.0 only enables 4KB chunk size access, HPB Ver. 2.0 enables wider access – which can further boost random read performance. ►KIOXIA Europe GmbH | https://www.kioxia.com 40

DDR4 DRAM modules of the CIR series for industrial computers Especially for mainboards used in industrial PCs, ICP Germany offers DDR4 DIMM modules, which are designed for tougher applications and can meet higher requirements than standard RAM. All modules are developed and manufactured according to JEDEC standard. Original DRAM chips in industrial quality are used. To meet higher requirements, all RAM modules are subordinated to the principle of a fixed production bill of materials (Fixed-BOM) and use only components that are available on a long-term basis. The 288 PIN standard DIMM and the 260 PIN standard SODIMM RAM bars offer modules with memory organization of 512Mx8, 1Gx8, and 2Gx8, tuned clock rates from 2400 Mhz up to 3200MHz and memory sizes from 4GB up to 32GB. The standard series is designed for 0 to +85 °C. The Wide-Temp DIMM series, which is also available, additionally offers a negative operating temperature range of -40 °C. For systems with particularly low heights or special internal airflow conditions, the VLP form factor (Very-Low-Profile) can be used. With a height of only 18.75mm, the DIMM VLP series offers memory organizations of 512Mx8 and 1Gx8, clock rates up to 2666MHz and memory sizes from 4GB up to 16GB. Electronica Azi International | 1/2021

Industrial DDR4 DRAM Memory

X-86m2 and F-86: New SATA III portfolio with 3D-NAND from Swissbit. Highest reliability for industrial applications in M.2 2242 and CFast™ formats.

Applications • Industrial PC • Embedded Systems • Panel PC

Durable, reliable and attractively priced: Swissbit is strengthening its range of industrial-grade storage media with two new product ranges featuring SATA III interfaces. The X-86m2 series in the ultra-compact M.2 2242 form factor and the CFast™ card F-86 show off their full performance capabilities, especially as robust boot and application drives, and set themselves apart with a perfectly coordinated feature set. The key highlights are a high-quality 3D-NAND in pSLC mode, a SATA NAND flash controller specially developed for industrial requirements without additional DRAM, and fully optimized proprietary firmware. This makes both series the optimal storage solution for embedded systems and industrial applications, as well as for network devices where durability, system reliability and safety from power failure are imperative. Whether as a removable medium in the proven CFast™ form factor (F-86) or as an M.2 SATA SSD module (X-86m2), the newly introduced series are notable for their low power consumption and reduced heat output. This ensures stable, high-performance, and consistent read and write operation, even in critical applications. Both series are based on highquality flash memory chips with 3D TLC NAND technology, configured in pSLC mode. The application areas where the new series will deliver benefits are diverse, ranging from embedded systems, HMI devices and PLCs for industrial automation & control technology to POS/POI terminals, industrial PCs and medical technology to network components such as routers, switches or gateways. X-86m2 and F-86 are each available with storage capacities from 10 GB to 160 GB (8 GB is also available on request). The interface conforms to the SATA III standard with 6 Gb/s and is backwards compatible with SATA II and SATA I. The sequential data rates are up to 375 MB/s for reading and 236 MB/s for writing. Those sequential data rates are also available with SATA II. Both series are specified for industrial use at operating temperatures from -40°C to +85°C but will also be available in versions for the 0°C to +70°C temperature range.

►ICP Deutschland | https://www.icp-deutschland.de

►Swissbit | https://www.swissbit.com

The SO-DIMM VLP series, on the other hand, offers a maximum of 8GB memory size with a height of 18mm. For additional applications where data security must be ensured, DIMM and SO-DIMM series with ECC and a DIMM series with Registered ECC are available. All ECC series are available with modules with a memory organization of 512Mx8, 1Gx8 or 2Gx8, tuned clock rates from 2400 Mhz up to 3200 MHz, and sizes from 4Gb up to 32GB. Support in selecting the right modules is offered by ICP Germany by phone and e-mail. Specifications • 4th Generation DDR DRAM Modules • DIMM, SO-DIMM and VLP-DIMM form factor • Standard, Server and Wide-Temp series • Buffered, unbuffered, registered ECC • Fixed BOM, Long term availability

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PRODUCT NEWS

Ten times better: a liberation blow in switching performance High voltage specs that surpass the predecessor by a factor of ten: The new Panasonic Industry 1FormA AQV209G PhotoMOS® relay The technological progress of industrial equipment has become almost dizzyingly fast – and so have the performance demands on the necessary components. Under these signs, the new Panasonic Industry 1FormA PhotoMOS® relay AQV209G must be considered an undisputed breakthrough in terms of high power semiconductor switching – remarkably outperforming the last generation’s specs by a 10 times higher switching capability. By combining proven technology with next-gen materials and Galvanic isolation between input and output circuit, the semiconductor, photo-coupled relay achieves an unrivaled output rating of 1,200V at 0.75A. Continuously, with unlimited lifetime, ready for both AC and DC load. Notwithstanding this performance increase, this latest member of the PhotoMOS® family is still coming in a small standard DIP6-pin housing, feasible by an outstanding low ON resistance of typically 1Ohm. Based on future-proof technology, the AQV209G type is a truly interesting substitute for a lot of conventional reed relay applications or as an replacement for mercury containing types. Ensuring quiet, fast and bounce free switching, it will be a recommended choice for a wide field of modern industrial applications, testing and measuring equipment, controls or I/O modules. https://industry.panasonic.eu/components/relays/photomos-relays/hf-series-low-resistance ►Panasonic Industry Europe | https://eu.industrial.panasonic.com 42

Toshiba’s announces five 650V superjunction power MOSFETs housed in the new TOLL package Toshiba Electronics Europe GmbH (“Toshiba”) has announced five 650V superjunction power MOSFETs housed in the new compact SMD package in TO-leadless (TOLL) format. Measuring just 9.9mm x11.68mm x2.3mm (WxLxH), the TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z and TK190U65Z devices have a 27% smaller footprint than the conventional D2PAK package. Typical applications include server power supplies in data centres, solar (PV) power conditioners, uninterruptible power systems (UPS) and other industrial applications. The lineup has been expanded to products in the DTMOS VI series with low On-resistance down to 65mΩ. In addition, the 4-pin package includes the option of a Kelvin source. This capability can reduce the parasitic inductance of the source wire in the package and enhance switching efficiency by suppressing oscillation. Compared to the TK090N65Z, a device with equivalent voltage and On-resistance that uses the TO247 package without a Kelvin connection, the TK090U65Z has a 68% lower turn-on switching loss and turn-off switching loss is reduced by about 56%. Deploying the latest generation of the DTMOS VI series of 650V superjunction power MOSFETs with the TOLL package will help engineers reduce the size of their end equipment and improve efficiency. DTMOS VI is targeting highest efficiency switching with best in class FOM: Rds(on) x Qdg. The new devices enter mass production today and shipments begin immediately. Electronica Azi International | 1/2021

Infineon’s CoolGaN™ delivers ultimate efficiency and reliability to telecom power applications The pace of digitalization is speeding up, not only because of the recent push to online collaboration due to the coronavirus pandemic. Thus, powerful and sufficient state-of-the-art telecom infrastructure is crucial. To meet the requirements associated with this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has provided CoolGaN™ to deliver ultimate efficiency and reliability to telecom power supply systems.

Further information about the three products is available from the following links: TK065U65Z https://toshiba.semicon-storage.com/eu/semiconductor/product/mosfets/400v-900v-mosfets/detail.TK065U65Z.html TK090U65Z https://toshiba.semicon-storage.com/eu/semiconductor/product/mosfets/400v-900v-mosfets/detail.TK090U65Z.html TK110U65Z https://toshiba.semicon-storage.com/eu/semiconductor/product/mosfets/400v-900v-mosfets/detail.TK110U65Z.html TK155U65Z https://toshiba.semicon-storage.com/eu/semiconductor/product/mosfets/400v-900v-mosfets/detail.TK155U65Z.html TK190U65Z https://toshiba.semicon-storage.com/eu/semiconductor/product/mosfets/400v-900v-mosfets/detail.TK190U65Z.html Follow the link below for more on Toshiba’s 400V to 900V MOSFET device lineup. https://toshiba.semicon-storage.com/eu/semiconductor/product/mosfets/400v-900v-mosfets.html ►Toshiba Electronics Europe https://toshiba.semicon-storage.com/eu/top.html https://international.electronica-azi.ro

Infineon’s GaN devices are qualified according to JEDEC standards, offering lifetimes beyond 15 years, and are a perfect fit for industrial telecom and server SMPS. The CoolGaN 600 V emode HEMT in the DFN8x8 package is a key component in Delta’s DPR 3000E EnergE rectifiers enabling an industry-leading energy efficiency of 98 percent. With that, Delta’s rectifiers can heavily support the nascent 5G telecom networks of the world’s leading telecom carriers across the globe. “Delta’s Telecom Power Solutions have built an unparalleled track record in the global market, especially by enabling lower energy consumption and CO2 emissions in 4G and the nextgeneration 5G telecommunications,” said Eton Lee, General Manager of Delta’s Communication & Information Solutions Business Unit. “We have achieved that success by collaborating with tier-one brands to develop our solutions. Moreover, Infineon’s CoolGaN chips deliver excellent performance to Delta’s 3000E rectifiers, which boast industry-leading efficiency up to 98 percent and an outstanding power density of 56.8 W/in3. It provides high performance while consuming little energy.” “At Infineon, we work closely with our customers to help them achieve ever-growing requirements towards energy efficiency and also power density,” said Stefan Obersriebnig, Product Line Head High Voltage Conversion of Infineon’s Power & Sensor System Division. “With our complete portfolio of wide bandgap solutions, i.e. CoolGaN™ and CoolSiC™, we are paving the way towards a new era in the power industry.” Besides being suitable for industrial applications, Infineon’s CoolGaN family is also a perfect match for consumer applications such as adapters, chargers, wireless charging, and class-D audio amplifiers. More information about the CoolGaN is available at https://www.infineon.com/gan ►Infineon Technologies | https://www.infineon.com 43

PRODUCT NEWS

Put Your Engineering Knowledge to the Test with Mouser's New Tech Quotient Game App Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces the exciting release of Tech Quotient, a new mobile app that tests technical knowledge and engineering know-how through entertaining tasks and quizzes. Tech Quotient offers players around the world the chance to compare their skills and knowledge in challenges ranging from word scrambles and crosswords to multiple-choice quizzes and ranking questions. “Tech Quotient gives engineers the chance to connect in friendly competition, testing their knowledge across different industries and skillsets,” said Kevin Hess, Senior Vice President of Marketing at Mouser Electronics. “We invite developers, engineers and tech enthusiasts from all walks of life to download the app and to challenge their friends, families, and colleagues to find out their own personal Tech Quotient.” As the authorized global distributor that specializes in serving electronic design engineers with the newest products and technical resources, Mouser sees the Tech Quotient app as yet another way of serving aspiring and professional engineers with fascinating content that inspires, engages and challenges their thinking. Players receive merit badges for different technical achievements, and the game’s top players are highlighted in a global leaderboard. Combining a broad spectrum of technical expertise with the occasional zany general knowledge question, Tech Quotient keeps players on their toes and always offers a new, unique experience. To learn more about the Tech Quotient app, visit https://www.mouser.com/tech-quotient/. Download the Tech Quotient app directly from the App Store at https://apps.apple.com/us/app/id1513923750, or from Google Play at https://play.google.com/store/apps/details ?id=com.mouser.tech_quotient. ►Mouser Electronics | https://www.mouser.com 44

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, today announced the new RDM-Series silicon photomultiplier (SiPM) array that extends the LiDAR sensor capabilities to its broad portfolio of intelligent sensing solutions. The ArrayRDM-0112A20-QFN is the first automotive qualified SiPM product in the market, ready for the growing demands in LiDAR applications for the automotive industry and beyond. The ArrayRDM-0112A20-QFN is a monolithic 1×12 array of SiPM pixels based on the company’s market−leading RDM process, which enables high sensitivity to near-infrared (NIR) light to achieve industry-leading 18.5% photon detection efficiency (PDE)(1) at 905 nanometers (nm). The high internal gain of the SiPM allows sensitivity down to the single-photon level, a feature that in combination with the high PDE, enables the detection of the faintest return signals. This results in the ability to range to greater distances even with low reflective targets. SiPM technology has gained momentum in recent years and has become the sensor of choice for broad-market depth sensing applications due to its unique feature set. SiPMs have the ability to deliver the highest signal-to-noise performance for long distance ranging in bright sunlight conditions. Additional benefits including lower supply biases and lower sensitivity to temperature changes make it an ideal upgrade for systems that use legacy avalanche photodiodes (APDs). SiPMs are produced in a high-volume CMOS process, allowing for the lowest detector cost and therefore enabling broadmarket LiDAR solutions. Using laser light to measure the distance of an object has spanned the fields of automotive, consumer and industrial applications. In automotive, LiDAR can be employed to improve safety and driver assistance systems (ADAS), aiding features such as lane keeping and traffic jam assist by complementing and providing redundancy with other sensing modalities. LiDAR is becoming commonly used for fully autonomous driving use cases, such as robotic transportation, to safely navigate the environment in real time. Benefiting from the high PDE of ArrayRDM-0112A20-QFN, LiDAR systems supporting these functions have been proven to range over 300 meters in distance. Electronica Azi International | 1/2021

ON Semiconductor launches World’s First Automotive Qualified SiPM Array Product for LiDAR Applications More distance gives more time for the vehicle to respond to unexpected obstacles. “The high-resolution depth data provided by LiDAR enables instantaneous and accurate object identification in challenging low light conditions. As the first automotive qualified SiPM, the ArrayRDM-0112A20-QFN will enable long range, costeffective LiDAR solutions for the next level of safety and autonomy,” commented Wade Appelman, senior director, Automotive Sensing Division at ON Semiconductor. “We are continuously enhancing our sensor portfolio by offering diverse and complementary sensing modalities that pave the way to higher levels of ADAS and autonomous driving.” “At Yole Développement (Yole), we see LiDAR as a critical component on the route to full autonomy in automotive, with functionality required to reach level 2+ and above. Producing sensors that pass automotive qualification, and with a sufficient level of performance, will be a key enabler to the mass adoption of LiDAR for automotive applications, which, based on current trends, is expected to show a +144% CAGR between 2019 and 2025(2),” explained Pierrick Boulay, Technology & Market Analyst at Yole. The ArrayRDM-0112A20-QFN is AEC-Q102 qualified and developed in accordance with IATF 16949. For more information regarding our LiDAR solutions, please contact a local sales office. Additional resources: • ArrayRDM-0112A20-QFN Product Page • Evaluation Board for the ArrayRDM-0112A20-QFN • A Brief Introduction to Silicon Photomultiplier (SiPM) Sensors White Paper 1) Max PDE at typical operating voltage and 21°C. PDE increases to >25% at 905 nm at elevated temperature. 2) Source: LiDAR for Automotive and Industrial Applications 2020 report, Yole Développement (Yole), 2020 ►ON Semiconductor | https://www.onsemi.com https://international.electronica-azi.ro

Mouser Electronics Offers Comprehensive Suite of Sensirion Environmental Sensors Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, offers a broad variety of environmental sensors from Sensirion, a leading supplier of sensors for the medical and automotive industries. Over the past two decades, Sensirion has grown to become one of the world’s leading designers and manufacturers of flow and environmental sensors. These high-performance products are essential for applications that are top of mind in today’s homes and factories, including air purification, indoor air quality monitoring, and carbon dioxide detection. The Sensirion SGP40 indoor air quality sensor, available from Mouser, is an integrated CMOSens sensor system on a single chip that provides a humidity-compensated indoor air quality signal. The sensor offers long-term stability in terms of response time and sensitivity, providing a reliable solution for applications including kitchen hoods, thermostats, and demand-controlled ventilation. The SPS30 particulate matter sensor is an optical sensor that combines laser scattering with Sensirion’s contamination-resistant technology. Built for a lifetime of more than eight years, the SPS30 sensor enables accurate measurements for HVAC equipment, air conditioners, and Internet of Things (IoT) devices. Sensirion’s STC31 is a chip-sized gas concentration sensor, offering accurate, high-range CO2 measurements for highvolume production. The STC31 sensor is based on a thermal conductivity measurement principle, which results in outstanding repeatability and long-term stability. The SFA30 formaldehyde sensor module, available to order from Mouser, is based on Sensirion’s electrochemical technology and provides exceptional formaldehyde sensing performance with low cross-sensitivity to other volatile organic compounds. The SFA30 sensor module is designed for simple integration into air purifiers, indoor air quality monitors, and demand-controlled ventilation systems. To learn more about Sensirion products available at Mouser, visit https://www.mouser.com/manufacturer/sensirion/. ►Mouser Electronics | https://www.mouser.com 45

Small volume production of electronics – equipment Small volume production of electronics is governed by the same requirements as large volume production. It is necessary to maintain antistatic protection and to select the right tools and mechanisms of operation allowing for efficient and cost-effective production. What distinguishes them, however, is the flexibility requirement resulting from the nature of this activity and the ability to change series efficiently. 46

Electronica Azi International | 1/2021

series tables providing antistatic security at prices much lower than those we will encounter in imported products may be a perfect solution. The possibilities of adjusting the workstation based on such a table are very wide – constructions of this type have a modular character – which allows for their flexible configuration for the needs of a given production line. CLOTHING Before we move on to the equipment, it is worth mentioning the often-neglected element of the EPA zones – the appropriate staff clothing. Appropriate clothing, i.e. clothing with antistatic properties, should be treated as any other necessary piece of equipment. Practice shows that negligence in this respect is often the weak link that makes all efforts to properly create and maintain an EPA zone are nullified. In this case, REECO products are also worthy of recommendation. The range of antistatic clothing, again at competitive prices, is very wide here, allowing you to choose solutions tailored to your business. MANUAL WORKSTATION Once the right protection is in place, focus on the tools and equipment. As we mentioned in the introduction, flexibility is the key to small batch production due to its specificity. The basis, apart from hand tools such as cutters and tweezers, is a good soldering station. Of great impor-

tance are therefore the ability to change the temperature of the soldering tip and a wide range of compatible tips quickly and preferably capability to programme them. The work will be accelerated by stations equipped with several soldering handles with different tips, so that subsequent tasks can be performed without the need to adjust the tools. Such functions have e.g. Pace ST50 or WJS-100. Desoldering guns – such as DEN-ON SC7000Z – allowing for quick correction of soldered connections are also very important for the efficiency of the workstation. EQUIPMENT Going beyond the manual workstation, semi-automatic stencil printers such as GRP SR-2700 can be a good solution for small and medium scale production. These devices are equipped with two independent, self-levelling, pressurecontrolled, electronically activated rakles, which allows for precise and very efficient distribution of soldering paste. At the same time, the device enables a quick template change, perfectly matching the specificity of small volume activities. The next step, and at the same time the production stage is the assembly of components on a PCB. This is done with the use of pick & place machines, such as the recently very popular and at the same time the fastest on the market (capacity of up to 31 thousand components per hour) Yamaha YSM10.

Taking into account the above, the design of a small-scale electronic production line should start from the space in which the activity will take place. Due to the sensitivity of a large part of the components used in the industry, an ESD (electrostatic discharge) protective zone should be designated and appropriately equipped, which reduces the risk of electrostatic discharge losses. This applies to suitable flooring, furniture and equipment. Anti-static floors such as those of FORBO are available in the form of 60 cm fast-assembly tiles, which can be laid on any surface, so covering even a fairly large area and even its subsequent expansion is not a problem. An example of antistatic furniture designed for the production of electronics is the renowned in Europe Polish brand REECO. For small companies and those starting their business activity, Classic https://international.electronica-azi.ro

Again, with production flexibility, the choice must take into account how quickly the device can be reconfigured for the next product series. On the example of YSM10 we can see that intuitive software and speed of physical reconfiguration of the device (e.g. change of reels with components) are crucial here. WAREHOUSE MANAGEMENT Here, the issue of warehouse management should also be addressed. Contrary to appearances, small-scale production can be a much greater logistical challenge than large-scale production. It often requires a wide range of electronic components to be kept in stock and operated. Errors in this management process lead to downtime and, in the case of sensitive components (e.g. MSDs), to material losses. 48

For this reason, warehouse management is based in modern companies on ERP (enterprise resource planning) solutions allowing for effective management of warehouse management processes. An example is the recognised IEMME solution LZERO 3.

nents, not only those intended for the production of PCBs. The software also allows to obtain a full archive of data on the components used in a particular product (device), which allows, for example, to easily determine from which manufacturer the defective component came.

This system is based on a protective cabinet and software that allows the quantity, location and flow of components and subassemblies in the production plant to be tracked. It should be noted, however, that storage locations can also be defined outside the cabinet – e.g. in the warehouse/ rack/shelf diagram. This allows you to manage not only electronic components, but also large components – such as housings. As a result, the software allows you to track the inventory and flow of all compo-

Returning to the production line, the top of the line is of course a reflow oven. It is difficult to find a more recognized brand than the world leader in the production of these devices – Heller Industries and its “flagship” model 1707 MK5 equipped with 7 fully programmable heating zones and 1 cooling zone. The investment in this type of device will allow you to carry out any type of order and enable you to move smoothly from one product series to the next. Electronica Azi International | 1/2021

The line is complemented by solutions allowing automation of THT assembly. Soldering waves are conventionally used in this process. In the case of small volume production, however, more cost-efficient are precision soldering robots, which do not require heating of the entire solder crucible and can be quickly reprogrammed from one batch to another. The best example of such a solution is the REECO Soldering Robot, which many fans of sports soldering had the opportunity to see at various industry events in Poland and Europe competing with the champions in soldering. To sum up – solutions for small volume production, apart from meeting the same requirements as for large volume production, must allow for flexible and quick line reconfiguration. https://international.electronica-azi.ro

These solutions can be seen and tested at the Renex Group Technology Centre and demo room. Contact: Andrei Bratanov – National Sales Manager Strada Văliug, nr. 32, Sector 1 13986 București, ROMÂNIA T: +40 799 774 330 E: Andrei.Bratanov@renex.ro ►Renex www.renex.ro www.renexrobotics.pl

Electronica Azi International no. 1 - 2021

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