Electronica Azi International no. 1 - 2022 by Electronica Azi

1/2022

I N T E R N A T I O N A L A PAN EUROPEAN MAGAZINE

https://international.electronica-azi.ro

PRODUCT NEWS

Comprehensive Solutions Feature Celeno’s Industry-Leading Wi-Fi 6 and 6E Chipsets Combined with Renesas Embedded Processing, Power, Timing and Analog Offerings

Renesas Announces 10 New Winning Combinations Integrating Celeno and Renesas Products Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced 10 new Winning Combinations that combine Wi-Fi 6 and 6E chipsets from recently acquired Celeno Communications with a broad range of solutions from Renesas including embedded processing, analog, power, timing and connectivity. The new Winning Combos include solutions for IoT, Industrial, Infrastructure and other applications. Renesas’ Winning Combinations are engineering-vetted designs that allow customers to take advantage of an elevated platform for their design ideas, accelerating product development cycles and lowering overall risk in bringing designs to market. Renesas now offers more than 300 Winning Combinations for a wide range of customers and markets. “These new solutions illustrate clearly that the Celeno Wi-Fi solutions are extremely complementary with the Renesas product portfolio,” said DK Singh, Senior Director of the System and Solutions Team at Renesas. “In a very short time, we have delivered Winning Combinations with Celeno technology that further our mission of enabling intelligence from the cloud to the end-point sustainably. https://international.electronica-azi.ro

Customers understand and appreciate that we are leading the market in providing integrated solutions to help them get innovative products to market faster and more efficiently.” The new Winning Combinations include the following: Industrial Gateway with Wi-Fi 6 Realizing the fastest data transmission for on-field programmable logic controller (PLC) applications, this winning combination leverages a leading-edge MPU and a high-performance Wi-Fi 6 chip to drive up to 4.8 Gbps PHY/data link speed. Automated Optical Inspection (AOI) Solution This winning combination provides a high-end flexible Wi-Fi 5 IEEE 802.11ac solution for industrial applications requiring high data throughput and high data accuracy. Here, the combination of an RZ/V2M microprocessor main board with plugged in Wi-Fi 5 provides high throughput up to 4800 Mbps along with a fast PCIe interface. Wireless Digital Signage This Wi-Fi connected digital signage solution combines Celeno Wi-Fi with

Renesas power devices and the RZ/G2H MPU to connect different displays. The solution supports displays from HDMI or LVDS connected flat panel displays to LED-based matrix displays. Other Celeno Winning Combinations Other winning combinations introduced this month combine proven Renesas technology with Celeno’s connectivity expertise for high performance networking, AI, and video applications. • AI Vision and Voice Recognition • Wireless Network Video Recorder • Wireless IIoT Gateway • Wireless Gaming Table • Wi-Fi Connected Retail Scale • High-Throughput Wi-Fi 6 Router • Wired & Wireless IEEE-1588 Solution Availability and More Information All of the 10 new Renesas-plus-Celeno Winning Combinations, in addition to 300+ existing Winning Combinations, include block diagrams, product information, and the ability to sample and buy. They are available at www.renesas.com/win. Renesas Electronics Corporation https://www.renesas.com 3

Electronica Azi International » TABLE OF CONTENTS 3 | Renesas Announces 10 New Winning Combinations Integrating Celeno and Renesas Products 6 | Renesas Launches Virtual Development Environment for Fast Automotive Application Software Development and Evaluation 6

36 | TSN synchronized real-time over 5G 38 | Sixteenth brick DC/DC delivers 100W down to 30V input 38 | E-PEAS Unveils Constant Voltage PMICs for Intermittent Input Energy Harvesting Arrangements 39 | Toshiba further expands super junction MOSFET range with four additional 650V devices 40 | How to Rapidly Prototype IoT Devices using the B-L4S5I-IOT01A Discovery Kit IoT Node 43 | Build multimedia applications simply and quickly using Mikromedia smart display development boards from MIKROE 44

7 | Navitas Drives GaN into High-Power Markets at PCIM Europe 8 | Analog Devices’ Wireless Battery Management System Achieves Top Automotive Cybersecurity Qualification 9 | Infineon extends CoolSiC™ M1H technology portfolio with 1200 V SiC MOSFETs, using enhanced features for highest system efficiency 10 | Need Clinical-Grade PPG from your wearable? Sometimes it pays NOT to shine a light on a problem 14 | The embedded SIM device testing challenge 18

44 | Trends within the power electronics industry in 2022 48 | How to Achieve Test Goals 50 | Murata partners with Ignion to help accelerate and simplify IoT design 50 | Rutronik presents innovative solutions for IIoT and IoE from leading manufacturers and own developments at Sensor+Test 2022 51 | New versions of the SEN5x environmental sensor node now available 52 | Mouser Electronics Signs Global Distribution Agreement with ISI to Deliver High-Performance PCIe XMC Modules 52 | Performance Meets Customer Service 53 | Digi-Key Electronics and Phoenix Contact to Host Data Connectors Webinar 54

18 | Boundless freedom for edge servers 22 | A holistic view on microcontroller security 26 | Modular system facilitates development of applicationspecific robots 30 | Best Practices for Powering USB4 33 | AI of Things Implementation on MCUs 33 | Powerbox’s 1200W power supply has adjustable ‘near to zero’ output voltage and current for conduction cooling applications 34 | Renesas Wireless Power Charging Technology Is Integrated in Wacom Active ES® Pen Solutions 36 | Nuclei Studio IDE now with SEGGER’s emRun runtime library for RISC-V

54 | Smart lighting 57 | Bosch barometric pressure sensor raises the bar for accuracy and performance in mobile devices 60 | Leuze - The new ODT 3C

® Management Managing Director - Ionela Ganea Editorial Director - Gabriel Neagu Accounting - Ioana Paraschiv Advertisement - Irina Ganea Web design - Eugen Vărzaru

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Electronica Azi International is published 4 times per year in 2022 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Copyright 2022 by Euro Standard Press 2000 s.r.l. All rights reserved.

Electronica Azi International | 1/2022

PRODUCT NEWS

Renesas Launches Virtual Development Environment for Fast Automotive Application Software Development and Evaluation New Environment Allows Customers to Bring Leading-Edge Software to Market Quickly Renesas Electronics Corporation announced the launch of a virtual development environment that enables advance development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). The environment includes a “Virtual Turnkey Platform”, which allows engineers to develop application software before devices or evaluation boards are available. Additionally, the new environment offers a Multicore Debug and Trace Tool, which enables users to analyze and evaluate the operation of their software as if it were running on an actual chip. These tools will allow customers to kick-start development and get to market faster with leading-edge software. As software becomes a critical part of automobiles, customers’ application software becomes larger and more complex. In order to increase the value of their software, customers are looking for new development methods and environments to develop highly reliable software more quickly. “Virtual Turnkey Platform” Application Software Development Environment This platform consists of the R-Car Virtual Platform (R-Car VPF) development environment and a software development kit 6

(R-Car SDK) that includes pre-tested software libraries and sample code. R-Car VPF is based on Virtualizer Development Kits (VDKs) from Synopsys, and integrates virtual models of intellectual property (IP) specific to R-Car to customize for R-Car devices. By overlaying the R-Car SDK on this platform, it enables engineers to immediately start development of application software virtually. The platform accurately recreates the behavior of the actual chip and thus eliminates the need to build up a development environment with a physical evaluation board. Multiple users can also develop software simultaneously on separate PCs or servers. “Multicore Debug and Trace Tool” for Analyzing and Evaluating Software Operation Once engineers complete the development of multiple software components side by side on the Virtual Turnkey Platform, the next step is to integrate the software and verify that it runs on a single chip. Software components share resources such as the multiple CPUs and IPs on R-Car SoCs. If operational problems are detected after the software components are integrated, it requires a tremendous amount of work to analyze and solve these issues.

With this in mind, Renesas created the Multicore Debug and Trace Tool, which simplifies the process of analyzing and identifying the causes of errors occurring from the interaction of the multiple hardware resources in R-Car SoCs. This enables synchronous and simultaneous debugging of the entire heterogeneous architecture of R-Car without using the actual device. This helps identify potential problems and thus accelerates the development process. Availability The development environment is available for the R-Car S4 SoC for automotive gateways. Renesas has plans to support the RCar V4H as well as future versions of R-Car products and RH850 automotive MCUs. For more information on the Virtual Turnkey Platform, please visit: https://www.renesas.com/products/auto motive-products/automotive-systemchips-socs/r-car-virtual-platform. For more information on the Multicore Debug and Trace Tool, please visit: https://www.renesas.com/softwaretool/multi-core-debug-and-trace-tool. Renesas Electronics Corporation https://www.renesas.com Electronica Azi International | 1/2022

Navitas Drives GaN into High-Power Markets at PCIM Europe Leverages leadership in mobile fast chargers and benchmark 20-year warranty into data centers, solar and EV markets Navitas Semiconductor, the industryleader in gallium nitride (GaN) power integrated circuits (ICs) will highlight next-generation IC technologies and market advancement at Europe’s most prestigious power electronics conference, PCIM (Power, Control and Intelligent Motion) 2022 (May 10th – 12th, Nuremberg, Germany). Gallium nitride (GaN) is a next-generation semiconductor technology that runs up to 20x faster than legacy silicon and enables up to 3x more power, 40% energy savings and 3x faster charging in half the size and weight. Navitas’ GaNFast™ power ICs integrate GaN power and drive plus sensing, protection and control to deliver simple, small, fast and efficient power conversion performance. Recent announcements of 40,000,000 mass-production shipments with zero https://international.electronica-azi.ro

reported GaN-related field failures, and an industry-benchmark 20-year limited warranty have confirmed the quality and reliability of GaNFast ICs across multiple markets and applications with customers including Samsung, Xiaomi, Dell, Lenovo and LG. Application-specific GaN ICs tailored for data center, solar and EVs were sampled in late 2021, and PCIM provides the perfect opportunity to update customers on efficiency, power density, quality and reliability for these new, higher-power markets.

(solar) and especially Compuware (data center) with the looming EU ‘Titanium+’ Directive 2009/125/EC, plus applicationspecific design centers, we can demonstrate Navitas’ rapid progress into these strategic, higher-power markets.”

“Europe is a key market for Navitas, which is reflected in our growing team presence, our industry-leading focus on sustainability and the development of multiple GaN ICs families targeting 1kW to 20kW applications,” said Navitas CEO and co-founder Gene Sheridan. “With recent customer announcements from Brusa (EV), Enphase

To book a meeting with Navitas at PCIM, please: • Book online at ly/NavitasPCIM2022 • Call +1 ThinkGaNIC (844-654-2642), or • Email Info@NavitasSemi.com

PCIM Europe will take place at the Nürnberg Messe from May 10-12, 2022. As well as showcasing the latest integrated GaNFast ICs with GaNSense™ technology, Navitas will give visitors to booth 523 (Hall 9) the chance to win a Tesla Model 3 Performance, worth over $60,000.

Navitas Semiconductor https://www.navitassemi.com 7

The transition of battery packs from wired to wireless connectivity enables automotive manufacturers to scale their electric vehicle fleets into volume production across a wide range of vehicle classes, and wBMS provides the modularity, flexibility, and scalability to streamline the design and assembly processes with connector-free batteries. With this reliance on wireless communication, ensuring transparency, security, and ease of deployment for the system are critical.

Analog Devices’ Wireless Battery Management System Achieves Top Automotive Cybersecurity Qualification Analog Devices, Inc. announced its Wireless Battery Management System (wBMS) is certified to the highest standard of automotive cybersecurity engineering and management. ISO/SAE 21434 is the new standard for cybersecurity risk management throughout the lifecycle of the vehicle from concept, product development and production, to operation, maintenance, and decommissioning of electrical and electronic systems. TÜV NORD Mobilität, the assessor for this qualification, affirmed that ADI’s 8

wBMS is the first automotive system that it has certified for ISO/SAE 21434. The assessment confirmed that ADI performed appropriate assurance measures within the product development to fulfill the CAL 4 requirements. Since announcing the industry’s first wBMS with General Motors in 2020, ADI has brought this technology to mass production as a turnkey solution for vehicle manufacturers with security designed in at every level.

“We conducted an intensive assessment to verify that ADI’s wBMS conforms to ISO/SAE 21434 requirements. With ADI considering the CAL 4 classification conditions throughout product development, the cybersecurity assurance measures complied with the highest requirements,” said Leif-Erik Schulte, Senior Vice President at TÜV NORD Mobilität. “This system certification is a key element to build trust across the full electrification ecosystem – from energy storage to OEMs to consumers – to support EV adoption and help reduce emissions.” According to a recent McKinsey report1, ‘Cybersecurity is becoming a new dimension of quality for automobiles … Cybersecurity will be nonnegotiable for securing market access and type approval’ in the future. The CAL 4 classification according to the ISO/SAE 21434 standard requires strong risk assessments to proactively identify any component, application programming interface (API) or software function that could be vulnerable to a cyber-attack. “Personal vehicles are a major contributor to global warming and accelerated EV adoption plays a critical role in achieving a sustainable future,” said Roger Keen, General Manager of Battery Management Systems at Analog Devices. “Improving the security and accuracy of EV batteries removes roadblocks in end-users’ buying considerations and advances OEMs’ decisions to expand their EV offerings. With this certification, ADI can provide ongoing transparency and seamless deployment within the EV battery supply chain to progress our vision of a greener world. It further accelerates the speed to market for our customers by saving their cybersecurity development time and associated infrastructure investment.” Analog Devices https://www.analog.com Electronica Azi International | 1/2022

PRODUCT NEWS

Infineon extends CoolSiC™ M1H technology portfolio with 1200 V SiC MOSFETs, using enhanced features for highest system efficiency Infineon Technologies AG introduces a new CoolSiC™ technology: the CoolSiC™ MOSFET 1200 V M1H. The advanced silicon carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy module family, along with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar energy systems, such as inverters, that have to meet peak demand. The chip is also ideal for applications such as fast EV charging, energy storage systems and other industrial applications. The latest advancements of the CoolSiC base technology enable a significantly larger gate operation window that improves the on-resistance for a given die size. Simultaneously, the larger gate operation window provides a high robustness against driver- and layout-related voltage peaks at the gate, without any restrictions even at higher switching frequencies. Along with the M1H chip technology also

the related housings have been adopted in technology and package variants to enable higher power densities and more options for design engineers to improve on application performance. Easy modules enable higher power density The M1H will be integrated into the popular Easy family to further improve the Easy 1B and 2B modules. In addition, a new product which enhances the Easy 3B module with the new 1200 V CoolSiC MOSFET, will also be launched. The rollout of new chip sizes maximizes flexibility and ensures the broadest industrial portfolio. With the M1H chip, the onresistance of the modules can be significantly improved, making the devices more reliable and efficient. Furthermore, with a maximum temporary junction temperature of 175°C, overload capability increases, enabling higher power density and coverage of failure events.

Compared to its predecessor, the M1, the M1H has implemented a small adoption of the internal R G, enabling the switching behavior to be easily optimized. The dynamic behavior is maintained with the M1H chip.

Discrete packages with ultra-low on-resistances In addition to the Easy module family, the CoolSiC MOSFET 1200V M1H portfolio includes new ultra-low on-resistances 7mΩ, 14mΩ and 20mΩ in the TO247-3 and TO247-4 discrete packages. The new devices are easy to design-in, especially due to the gate voltage overshoots and undershoots with the new maximum gate-source voltage down to -10 V, and come with avalanche and short-circuit capability specifications. Infineon’s .XT interconnection technology, previously introduced in the D 2PAK-7L package, is now also implemented in a TOfootprint. The thermal dissipation capabilities are enhanced by more than 30 percent compared to a standard interconnection. As a result, such thermal benefit can be used to increase the output power of up to 15 percent. Alternatively it can be used to increase the switching frequency to further reduce the passive components in e.g. Electric vehicle (EV) charging, energy storage or photovoltaic systems for enhanced power density and reduced system cost. Without changing the system operating conditions, the .XT technology will lower the SiC MOSFET junction temperature, therefore significantly increasing the system lifetime and power cycling capabilities. This is a key requirement in applications like e.g. servo drives. The new 1200 V CoolSiC MOSFET M1H additions further enhance the optimization potential for SiC-based applications, with fast implementation of clean energy and energy efficiency in a global world. Availability The module and discrete variants can be ordered now. More information is available at www.infineon.com/sic-mosfet. Infineon Technologies https://www.infineon.com

https://international.electronica-azi.ro

MEDICAL DEVICES

Need Clinical-Grade PPG from your wearable? Sometimes it pays NOT to shine a light on a problem Author: Andrew Burt | Executive Business Manager | andrew.burt@analog.com Analog Devices Inc.

Heart rate (HR) and blood oxygen saturation (SpO2) are quickly moving from the “desirable” to the “expected” phase in the list of features available in health and fitness wearables. A consequence of this transition, however, has been a reduction in the quality of readings caused by some sensor manufacturers making questionable claims about the accuracy of their products in the rush to meet the market demand for these features. While the accuracy of readings may not be critical in everyday wearables, the quality and integrity of measurements must be unquestionable in clinicalgrade wearables. A key challenge for designers is how to make high quality HR and SpO2 measurements in a way that doesn’t Figure 1 place a heavy drain on the bat- Measuring HR and SpO2 using a wrist-worn device. tery of the device. In this design solution, we show why the conventional approach to optical readings wastes power before presenting a sensor IC that uses a novel architecture to substantially reduce power consumption while making clinical-grade measurements. Photoplethysmography (PPG) HR and SpO2 are measured using an optical technique called photoplethysmography or PPG (Figure 1). A PPG signal is obtained by illuminating skin using a light-emitting diode (LED) and detecting changes in the intensity of 10

light reflected from blood vessels below the surface (Figure 2) using a photodiode (PD) that generates a current proportional to the amount of received light. The current signal is conditioned by the PPG analog front end (AFE) before being

converted by an ADC for processing by an optical algorithm running on the system’s microcontroller. In principle, a single LED-PD pair is sufficient to make a PPG measurement and this architecture is common in equipment used in clinical settings (Figure 3). Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Clinical-Grade PPG

This is made even more challenging by the variety of skin tones of different wearers. Darker skin is described as having a lower perfusion index than lighter skin, meaning it requires greater illumination (requiring a sensor to use more power) for measurements to be made. We consider next the merits of different AFE architectures that can be used to make PPG measurements.

skin perfusion index of the wearer, can be up to an average of 1 mW. Overall, this approach is inefficient and detrimental to battery life.

However, these devices operate in conditions very different to those encountered in everyday life. First, the patient is relatively immobile, and the measurement is performed using a sensor that is securely fastened to a fingertip. Lighting conditions are relatively constant, which simplify light detection for the PD and power consumption is not a concern since these devices are usually mains powered.

Figure 4 Using two LEDs to achieve better skin illumination. PPG AFE with Dual ADC Channels A better way to increase skin illumination is to use a single LED with two PDs that can be used to detect a greater amount of reflected light (Figure 5).

Figure 2 PPG measurement using an LED and a PD.

Figure 5 Using one LED with two PDs for better light detection.

Figure 3 Measuring SpO2 and HR in a clinical setting. By contrast, a wearable device is typically wrist-worn, meaning the level of skin contact varies, depending on the personal preferences (strap tightness) and the motion of the wearer. Lighting conditions can vary considerably depending on location and time of day and since these devices are battery-powered, it is important for the current consumption of the sensor to be as low as possible. https://international.electronica-azi.ro

PPG AFE with Single ADC channel Increasing LED current, or using two LEDs, is an intuitive way to achieve a higher degree of skin illumination (Figure 4) since it can illuminate a greater skin area. However, this is a power-hungry approach because LED current accounts for at least 50% of the power consumed in a PPG system that, depending on the

The advantage here is that the standard 20 mA LED current can be reduced to 10 mA to achieve the same level of total PD current when compared to using a single PD. In challenging operating conditions (low skin perfusion and/or when the wearer is moving) where the system algorithm determines that a higher LED current is required, a proportional increase in system sensitivity can be attained. For example, applying the same LED current as in the previous arrangement delivers a 100% increase in PD current, thus delivering higher overall sensitivity, albeit at the cost of increased power consumption. 11

MEDICAL DEVICES

effects of motion and how tight the wearer fastens the device. Four PD receivers also increase the probability of detecting light reflected from illuminated blood vessels. The graph in Figure 7 shows HR measured using four photodi-

odes (configured as two independent pairs: LEDC1 and LEDC2) with respect to a reference measurement (polar). The wearable needs to ensure that a good skin contact is maintained while this measurement is being performed.

PPG AFE with Quad ADC Channels Using four PDs (which require a quadchannel ADC) to detect reflected light saves yet more power (Figure 6) as the LED can be run for a lot less power (Table 1).

Figure 6

Figure 8 12

Figure 7 HR readings using two pairs of independent PDs.

A MAX86177 quad-channel optical AFE block diagram.

Table 1 summarizes the relative power consumption of each of the architectures previously considered, assuming a 1.6 V typical supply voltage. This architecture delivers higher quality readings because blood vessels and bones are distributed asymmetrically in the wrist and four PDs help mitigate the

PPG using one LED and four PDs.

Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Clinical-Grade PPG

Initially, the wearer is at rest, then after 5 minutes (300 seconds) they begin exercising causing their HR to increase. It is clear that the signals on LEDC1 and LEDC2 deviate differently from the reference measurement and the benefit of using two pairs of PDs to capture and combine all of these deviations is apparent. Number of PD ADC Channels 1 2 4

integrating front ends that each include independent 20-bit ADCs that can multiplex input signals from eight PDs (configured as four independent pairs). It achieves a dynamic range of 118 dB and provides ambient light cancellation (ALC) up to 90 dB at 120 Hz. It operates on a 1.8 V main supply voltage with a 3.1 V to 5.5 V LED driver supply voltage.

No. of LED CurrentLED Power AFE Power Total Power LEDs (mA) (mW) (mW) (mW) 1 1 1

20 10 5

320 160 80

30 40 60

350 200 140

Table 1: Comparison of the Typical Power Consumption for 1-, 2-, and 4-Channel ADC Architectures. Practical Quad ADC Solution The MAX86177 (Figure 8) is an ultra low power quad-channel optical data acquisition system with both transmit and receive channels that is ideal for use in clinical-grade (as well as general purpose) portable and wearable devices. On the transmitter side, it has two high current 8-bit programmable LED drivers that support up to six LEDs. On the receiver side, it has four low noise charge

The device provides fully autonomous support for both I2C and SPI compatible interfaces. The MAX86177 is available in a 7 × 4, 28-ball wafer-level package (WLP) with dimensions of 2.83 mm × 1.89 mm and that operates over –40ºC to +85ºC temperature range. Lab-tested samples of this AFE exhibited an overall root-mean-square error for hypoxia measurement of 3.12%, well inside the 3.5% limit set by the FDA for clinical-grade monitors.

Conclusion A major headache for designers of clinical-grade wearables is how to make optical PPG measurements of HR and SpO2 without placing a significant drain on the battery life of the device. In this design solution, we have shown that a fourchannel ADC architecture can deliver power savings of up to 60% when compared to the basic architecture that uses a single LED and PD. The MAX86177’s four-channel architecture in a small form factor package is ideal for use in finger, wrist and ear-worn wearables to measure clinical-grade HR and SpO2. It can also be used to measure body hydration, muscle, and tissue oxygen saturation (SmO2 and StO2) and maximum oxygen consumption (VO2 Max). ■ Analog Devices www.analog.com

Contact Romania: Email: inforomania@arroweurope.com Mobil: +40 731 016 104 Arrow Electronics | www.arrow.com

Engage with the ADI technology experts in our online support community. Ask your tough design questions, browse FAQs, or join a conversation.

Visit: https://ez.analog.com

About the author Andrew Burt is an executive business manager of the Digital Healthcare Business Unit at Analog Devices. He focuses on business development for the company’s healthcare products that include sensors, AFEs, optical modules, and algorithms. Andrew also helps define new sensors that will be part of future wellness and disease management solutions. He studied electrical and electronics engineering at Oxford Brookes University. He can be reached at andrew.burt@analog.com https://international.electronica-azi.ro

The embedded SIM device testing challenge eSIM on the path of becoming mainstream In recent years the telecom industry has seen the emergence of a new type of SIM card, the embedded SIM, or eSIM; essentially a UICC (Universal Integrated Circuit Card) soldered onto the circuit board which cannot be removed. The use of eSIMs has been driven by two types of applications: Size reduction and water proofing for wearables, such as smartwatches, and the pursuit for a rugged telecom module with always-on connectivity in automotive. Tablet and smartphone vendors have also started to adopt this technology. Remote Provisioning, who is in control? Due to their non-removable nature, an eSIM cannot be swapped. Hence, to change the network operator subscription, a mechanism called RSP (Remote SIM Provisioning) has been defined by GSMA. This allows the manipulation of profiles on the card to carry out operations such as: 14

Download, enable, disable, edit, … The RSP specification distinguishes between two types of device which defines who has control over the eSIM: • An M2M device where the service provider has control over the network. In this context, a service provider could be the eSIM manufacturer, the operator, or the device maker.

Figure 1 SIM evolution

• A consumer device, where each end user can proactively update the SIM information such as the subscriber contract. Despite the soldered eSIM being its main use case, RSP can also be used for removable types of UICC eSIM featuring the RSP applet.

Electronica Azi International | 1/2022

DESIGN SOLUTIONS » How to define and access a test profile?

M2M device architecture, shown in figure 2 is operator driven. This means that the operator controls the SIM profile on the UICC and is the only one who can change the information located on the hardware. This delivers the highest security as the network is managed entirely by the mobile network operator (MNO), who can bring dedicated services to a specific hardware.

Device testing, how to define and access a test profile? With security being essential in the RSP architecture, an M2M device cannot establish a connection if has not been provisioned by means of a live operator network certified by GSMA.

One solution, to ensure that it is possible to test a device during these life cycle stages, is to use a provisioned test certificate and test profile on the eUICC.

This architecture is challenging for device testing as the industry relies on dummy virtual operators to establish a connec-

Recently a working group at GSMA busy has defined the test profile to be used by the testing industry.

This enables devices to be directly connected to network simulators.

Figure 2 Remote SIM Provisioning device type (simplified) © Anritsu

This is the case for car manufacturers who strike deals with MNOs to ensure the optimal quality of service for their cloud connectivity. However, for the general public, the use of this architecture can be perceived as a continuation of a hostile operator sales strategy, where the consumer is essentially tied to one operator for their services. The second architecture is the ‘consumer device’. This allows the user to change the profile if desired. This architecture is favoured by device and software manufacturers offering different network plans as they can also gain a share of the revenue. Once the user has chosen his or her plan, the MNO assumes control of the profile. eSIM Certificates, the key to security Introducing the capability to remotely change the parameters of a SIM creates obvious security concerns. However, the RSP M2M Architecture has been designed with security in mind; relying on trust certificates issued by the GSMA Authority to certify each actor in the chain to ensure there is no security breach within live ecosystems. https://international.electronica-azi.ro

Figure 3 Example of a local trigger to switch an eUICC from live to test mode tion to test devices, using the variety of test profiles, throughout the entire life cycle of the device: • During product development to validate the chipset, RF characteristics and protocols. • At the conformance level to certify devices will work according to standard. • On the production line to verify consistency in quality. • In repair centres. Unfortunately, using live certificates prevents the usage of laboratory network simulators.

The methodology for switching to a test profile or enabling a test certificate is also still under discussion. One typical methodology is to use special production batches where test profiles are provisioned. This is not an ideal solution and a standardised approach is demanded by the industry. Another solution is to locally trigger the test mode via a secure interface (AT commands, SPI, SSH, Adb …) 15

eSIMs

Anritsu/COMPRION Solution for M2M and Consumer devices Using the Anritsu network Simulator MD8475B in combination with the COMPRION eUICC Profile Manager, however, allows over-the-air updating of eUICCs, and their profiles, by means of a simulated network. The COMPRION eUICC Profile Manager simulates an SM-SR and SM-DP (Subscription Manager Secure Routing and Subscription Manager Data Preparation) remote management server and directly controls the Anritsu network simulator. Different networks can be configured directly from the GUI and there is no need to be an expert in cellular networks to achieve a connection. The test scenarios include Profile Management operations; a set of functions related to the download of a new profile onto the eUICC and verification of its contents. This laboratory test bench is, for example, used in the conformance tests for Automatic emergency calls (ERAGLONASS GOST chapter 9). The Signalling Tester MD8475B is an allin-one base station simulator supporting 2g/3G/LTE and 5G anchors.

It supports connectivity to the cloud, VoLTE and call-processing. This is an ideal tool for validation purposes where all levels of tracing are available from the Physical layer to the IP layer. One major advantage of test networks is the possibility to configure any country network to test roaming. This alleviates the need to go into the field to test the switching between operators across national borders.

■ Anritsu Corporation www.anritsu.com

Figure 4 eUICC test bench to verify eUICC and DUT

Conclusion Many non-standardised approaches currently exist to test cellular devices using M2M eUICCs using network simulators. These vary from eUICC manufacturer to device maker. However, once the test profile and test certificate are provi-

Figure 5 GUI to control eUICC: Update /Load / Enable / Disable/ Remove … 16

sioned on a device, the standardised communication GSMA RSP link can be established. The Anritsu/COMPRION solution is the ideal tool to establish the RSP link and comprehensively test this communication channel and your devices for a variety of scenarios such as roaming agreements.

Electronica Azi International | 1/2022

The integration of Intel Xeon D processors on COM-HPC Server-on-Modules from manufacturers such as congatec allows edge server installations to break free from the tight thermal constraints of air-conditioned server rooms. For the first time, they can now be installed anywhere where massive data throughput with lowest possible latencies is required – all the way to deterministic real time. Author: Andreas Bergbauer Product Line Manager COM-HPC | congatec

Edge servers process data at the edge of communication networks instead of in central clouds. This enables interaction with clients of all kinds without delay or in real time but presents manufacturers of server, networking and storage technologies with major challenges. Until now, they used to develop standardized rack solutions for their systems, with active ventilation concepts and powerful air-conditioning technology to control the thermal management of the racks and the air-conditioning in the server rooms. However, such an approach is often no longer a good 18

fit for the edge server technology of today. The American Society of Heating, Refrigerating and Air-Conditioning Engineers, or ASHRAE for short, has looked thoroughly at the question of how to best install edge server performance in harsh environments. So, from the perspective of the associated heating, cooling, ventilation and air-conditioning companies, there are already quite plausible recommendations on how to design edge data centers with high-performance air-conditioning and the best possible insulation to protect them from heat and cold.

The world’s first COM-HPC Server-onModules with Intel Xeon D processors free edge servers from the shackles of air-conditioned server rooms. congatec offers the Intel Xeon D processor on COM-HPC Server Size E and Size D as well as COM Express Type 7.

Freeing edge servers from the shackles of air-conditioning However, ASHRAE proposes a maximum permissible temperature fluctuation of 20°C within one hour and a maximum of 5°C in 15 minutes for edge data centers. This requires complex air-conditioning technology and is therefore very difficult to implement. But not only that; adhering to these guidelines is near impossible, especially during maintenance work in edge data centers that are smaller than a telephone booth, because such solutions must be opened for maintenance at any ambient temperature. It is simply not possible to slip into such systems via a climate control chamber and quickly close the door again before carrying out maintenance work in the fully air-conditioned edge server room. Edge servers and data centers operating in harsh environments therefore need system designs that can cope with greater temperature fluctuations and a much wider temperature range than the 0 ... 40°C that is common for indoor IT. Electronica Azi International | 1/2022

Boundless freedom for edge servers

DESIGN SOLUTIONS » Intel Xeon D processors on COM-HPC Server-on-Modules

In industrial environments, embedded system designs can be exposed to ambient temperatures ranging from an arctic 40°C to a searing hot 85°C. Which means each component must be hardened.

Rugged designs reduce air-conditioning costs The most neuralgic point in the design of edge server, networking and storage technologies is the choice of processor technology. The decision that stands and falls with this choice is whether to follow the ASHRAE recommendations and invest massively in air-conditioning technology and insulation, which comes with high investment and operating costs for secondary energy. Or whether to develop systems that don’t need any of that because they work reliably even in

extreme temperatures and can therefore be implemented in harsh environments much more cheaply – from factory installations to outdoor communications, video surveillance and other critical infrastructure equipment to servers in mobile systems ranging from trains and airplanes to self-driving shuttle buses in smart cities. Thanks to the new Intel Xeon D processors, there is now a very powerful server technology that is qualified for use in extreme temperature ranges from -40°C to 85°C. Even ultra high-performance server designs are no longer constrained by the tight thermal restrictions of air-conditioned server rooms. Ultimately, they can be deployed wherever latency-free massive data throughput is required at the edge of the Internet of Things and in Industry 4.0 factories.

The modular Server-on-Module approach makes it easy to develop dedicated edge servers with application-specific interface layouts using custom-designed carrier boards. COM-HPC based multi-module designs

Reference design for machine-learning AI clustering

COM-HPC edge server designs are not limited to singlemodule concepts. The standard also explicitly supports multi-module carriers with heterogeneous COM-HPC module Edge server with configurations that three COM-HPC integrate e.g. FPGAs modules for extreme or GPGPU accelerareal-time workloads tors. A mix of COMHPC Server and COM-HPC Client modules on one board is also possible. For example, congatec is currently working with the University of Bielefeld and Christmann IT on an edge server design that combines different COM-HPC modules on one carrier board to process extreme real-time workloads in a multi-system design for machine-learning AI clustering of high dimensional data (self-organizing maps). https://international.electronica-azi.ro

High system design demands However, a server processor alone does not make a rugged edge server. Meeting the system design demands for harsh environments also requires extensive know-how. Every single component used must be qualified for this environment, and special requirements also apply for the circuit board and board design. Examples are special coatings that protect against condensation water and other environmental influences, or a high level of protection against extraneous electromagnetic and high-frequency signals that could hamper device performance. Developers of embedded computing technologies such as congatec have decades of experience in the design of such systems. They have long been integrating standard PC technologies such as Intel Core processors into embedded systems in a way that is suitable for industrial use. They know the requirements and certification standards of a wide range of industries inside out; and they are used to designing their systems for long-term availability in order to meet industry requirements and to be able to supply OEM solutions with identical board configurations for 7, 10 or 15 years. They also know that industrial applications differ significantly from standard system designs for the office environment, because industrial applications always require a greater or lesser degree of customization, which makes modular designs that deploy Computer-on-Modules the ideal way to develop boards. They have also learned that standardization is key, which is why they helped to create globally recognized standards for such modules. Reaching the goal faster with standards With the new COM-HPC Server specification in place, and the launch of the Intel Xeon D processors, this bundled expertise has now been transposed to industrial edge server designs. For the first time, developers have access to real products. The advantage of these new standardized COM HPC Server-on-Modules is that developers can integrate them into their custom carrier boards as application-ready embedded computing logic. This means they don’t have to concern themselves with basic processor technology issues, but only deal with the application-specific positioning of the board components and execute the interfaces at the right place on the carrier board. 19

COMPUTER-ON-MODULES

To this end, the PICMG standardization committee recently released the COMHPC Carrier Design Guide. It provides essential guidelines for building interoperable and scalable customer-specific embedded computing platforms based on the new standard and also makes it easy for developers to understand the logic behind the standard.

Knowledge is power To allow developers to dive quickly, easily and efficiently into the new design rules, congatec has opened an online and onsite training academy for COM-HPC Server and Client designs. Here, developers can get an expert-led introduction to the new world of high-end embedded and edge

3.2 Gen 2 and USB 4 with Thunderbolt on USB-C to 100 Gigabit Ethernet, and also including the management of sideband signals for 10G / 25G / 40G / 100G Ethernet KR interfaces, which in COM-HPC must be deserialized on the carrier board. During these sessions it is also explained how best practice designs utilize interface standards such as eSPI, I²C and GPIOs. An introduction to x86 firmware implementation – ranging from embedded BIOS to Board Management Controller and Module Management Controller features – complements the design-in training. And last but not least, there are sessions on verification and test strategies that address all challenges from initial carrier board design verification to mass production testing.

computing designs based on the new Computer-on-Module standard. The training program covers all mandatory and recommended design basics and best practice schematics of COM-HPC carrier boards and accessories such as high-end fanless cooling solutions for server designs up to 100 Watt or more. The feature-rich evaluation carrier boards for COM-HPC Server modules serve as a reference platform for learning how to implement Intel Xeon D processors. They leverage the full feature set of the standard, and developers can use them as platforms for further application development. The congatec academy aims to train developers in all fundamental COM-HPC design basics – from PCB layer principles, power management rules and signal integrity requirements to component selection. Sessions with a special focus on communication interfaces provide guidance on how to avoid pitfalls in the challenging design of high-speed serial communications: from PCIe Gen 4 and 5 to USB 20

Module Form factor Dimensions Processor Cores RAM TDP PCIe USB Ethernet

SATA

With such a comprehensive training program, the congatec academy aims to make the design of rugged edge server technology as easy as possible. Needless to say, the company can also provide interested OEM customers with complete system designs that leverage their new COM-HPC Server modules and large partner network. Accelerating edge server workloads However, the new COM-HPC Server-onModules in Size E and Size D with BGAmounted Intel Xeon D processors (code name Ice Lake D) impress not just with support for the extended temperature range from -40°C to 85°C. They also break many of the previous bottlenecks caused by edge server restrictions and will significantly accelerate the coming generation of real-time micro server workloads in harsh environments and extended temperature ranges. Improvements include up to 20 cores, up to 1TB memory on up to 8 DRAM sockets at 2933MT/s, up to 47 PCIe lanes per module in total and 32 PCIe Gen 4 lanes with double throughput per lane, and up to 100 GbE connectivity and TCC/TSN support with optimized power consumption thanks to 10nm manufacturing. Video storage and analytics servers also benefit from integrated Intel AVX-512, VNNI and OpenVINO support for AI-based data analytics.

conga-B7Xl conga-HPC/sILL conga-HPC/sILH COM Express Type 7 COM-HPC Server Size D COM-HPC Server Size E 125 mm × 95 mm 160 mm × 160 mm 200 mm × 160 mm Intel Ice Lake D (LCC) Intel Ice Lake D (LCC) Intel Ice Lake D (HCC) 4 to 10 4 to 10 4 to 20 Up to 128GB DDR4 Up to 256GB DDR4 Up to 1TB DDR4 (up to 4x S0-DIMM) (4x RDIMM/UDIMM) (8x RDIMM/UDIMM) 40-67 W 40-67 W 65-118 W Interfaces 16x PCIe Gen 4 16x PCIe Gen 4 32x PCIe Gen 4 16x PCIe Gen 3 16x PCIe Gen 3 16x PCIe Gen 3 4x USB 3.1 Gen 1 4x USB 3.1 Gen 1 4x USB 3.1 Gen 1 4x USB 2.0 4x USB 2.0 4x USB 2.0 1x 2.5GbE with TSN 1x 2.5GbE with TSN 1x 2.5GbE with TSN 4x 10GbE (KR support) 2x 25, 4x 10, 8x 2.5 GbE 1x 100, 2x 50, 4x 25,... (KR or SFI support) GbE (KR or SFI support) 2x SATA II 2x SATA II 2x SATA II

Intel Xeon D processor-based COM Express Type 7 and COM-HPC Server Size D modules don’t just differ in size but also in pinout. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Intel Xeon D processors on COM-HPC Server-on-Modules

nga

tec

A milestone for real-time edge server designs In fact, the market launch of the Ice Lake D based COM-HPC Server-on-Modules sets a triple milestone: First, because extended temperature range support means Intel Xeon D Server-on-Modules are no longer limited to standard industrial applications but also target outdoor and automotive environments. Second, the world’s first COM-HPC Server-on-Modules increase the number of available cores to 20 for the first time; with up to 8 DRAM sockets, this provides massively more memory bandwidth than Server-on-Modules based on other PICMG specifications. Third, these new server modules are real-time capable, both in terms of processor cores and

Standard motherboard/motherboard designs usually only support standard interfaces onboard that are executed at the rear of the board (rear I/Os). As this doesn’t take industrial requirements into account, their suitability as edge servers for the Internet of Things is limited. And as a rule, they are neither designed for the extended temperature range of -40°C to +85°C nor do they guarantee long-term availability of 7 to 15 years. With Server-on-Modules, however, it is possible to use the mechanics of these form factors and design a carrier board that executes the desired interfaces where they are required. Processor

Cores/ Clock Threads [GHz]

Intel Xeon D-2796TE 20 / 40 Intel Xeon D-2775TE 16 / 32 Intel Xeon D-2752TER 12 / 24 Intel Xeon D-2733NT 8 / 16 Intel Xeon D-2712T 4/8

2.0 2.0 1.8 2.1 1.9

TCC/TSN-enabled real-time Ethernet, which is essential for digitalized IIoT and Industry 4.0 projects. To be able to implement server balancing and server consolidation services for deterministic real-time edge server installations, where diverse real-time applications operate independently of each other on a single edge server, it is helpful if the platforms support real-time-capable virtual machines, as the RTS Hypervisor from Real-Time Systems does, for example. This allows Industry 4.0 factories to host heterogeneous real-time applications on a single server platform at the edge of their private 5G networks, and to allocate exclusive system resources to the individual processes. Server-on-Modules from congatec are pre-qualified for such services. Custom installations with all the necessary parameterizations can be included in the standard services that congatec offers for the new COM-HPC modules. The modules further impress with a comprehensive server-grade feature set: For mission-critical designs, they offer powerful hardware security functions such as Intel Boot Guard, Intel Total Memory Encryption - Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX). For best RAS capabilities, the processor modules integrate the Intel ME Manageability Engine and support remote hardware management features such as IPMI and redfish. In fact, there is another PICMG specification that ensures the interoperability of such implementations, and the training program of the congatec academy also covers this aspect. L2 / L3 Cache [MB] 25 / 30 20 / 24 15 / 18 10 / 12 5/6

CPU Base Power [W] 118 100 77 80 65

Temperature range -40°C ... 85°C -40°C ... 85°C -40°C ... 85°C 0°C ... 60°C 0°C ... 60°C

The Intel Xeon D 27xx HCC processor configurations of COM-HPC Server Size E modules (200 mm × 160 mm) from congatec. Processor

Cores/ Threads

Intel Xeon D-1746TER Intel Xeon D-1732TE Intel Xeon D-1735TR Intel Xeon D-1715TER Intel Xeon D-1712TR

10 / 20 8 / 16 8 / 16 4/8 4/8

Clock speed [GHz] 2.0 1.9 2.2 2.4 2.0

L2 / L3 Cache [MB] 12.5 / 15 10 / 12 10 / 12 5/6 5/6

CPU Base Power [W] 67 52 59 50 40

Temperature range -40°C ... 85°C -40°C ... 85°C 0°C ... 60°C -40°C ... 85°C 0°C ... 60°C

Server-on-Module options for Intel Xeon D The new modules will come as a High Core Count (HCC) and a Low Core Count (LCC) variant featuring different flavors of the Intel Xeon D processor series. The conga-HPC/sILH COM-HPC Server Size E modules will be available with 5 different Intel Xeon D 27xx HCC processors with a choice of 4 to 20 cores, 8 DIMM sockets for up to 1 TByte of 2933 MT/s fast DDR4 memory with ECC, 32x PCIe Gen 4 and 16x PCIe Gen 3 as well as 100 GbE throughput plus real-time capable 2.5 Gbit/s Ethernet with TSN and TCC support at a processor base power of 65 to 118 Watt. The COM-HPC Server Size D and COM Express Type 7 modules will come with 5 different Intel Xeon D 17xx LCC processors with a choice of 4 to 10 cores. While the conga-B7Xl COM Express Server-onModule supports up to 128 GB DDR4 2666 MT/s RAM via up to 3 SODIMM sockets, the conga HPC/SILL COM-HPC Server Size D module offers 4 DIMM sockets for up to 256 GB of 2933 MT/s fast DDR4 RAM or 128 GB with ECC UDIMM RAM. Both module families offer 16x PCIe Gen 4 and 16x PCIe Gen 3 lanes. For fast networking, they provide up to 50 GbE throughput and TSN/TCC support via 2.5 Gbit/s Ethernet at a processor base power of 40 to 67 Watt. The modules can be pre-ordered now and application ready evaluation samples – with rugged cooling solutions to match the processor TDP – are available immediately. Cooling solutions range from powerful active cooling with heat pipe adapter to fully passive cooling solutions for best mechanical resilience against vibration and shocks. The latter also alleviate thermal stress in applications that must endure short bursts of extreme temperature fluctuations. On the software side, the new modules come with comprehensive board support packages for Windows, Linux and VxWorks, and RTS hypervisor technology. ■ congatec www.congatec.com

The Intel Xeon D 17xx LCC processor configurations of COM-HPC Server Size D (160mm × 160mm) and COM Express Type 7 (95 mm × 120 mm) modules from congatec. https://international.electronica-azi.ro

EMBEDDED SYSTEMS

A holistic view on

microcontroller security Security as a high-level requirement is becoming increasingly important for more and more embedded systems as these evolve from standalone applications into connected systems capable of storing, receiving and transmitting data, updating themselves with the latest software versions, get remotely monitored and so on. Such requirements are quickly propagating even into the tiniest implementations in spite of limited memory resources and computational power. For modern embedded developers this might be a new field, perceived as too complex to handle, whereas the very first thought while thinking of security might remind of cryptography-related topics. But in fact security-related aspects encompass many different parts of the software and chip architecture which must be designed specifically, and work together seamlessly, to achieve their goals. This article goes over the most relevant aspect to consider in relation to microcontroller security implementation in such small embedded systems. Author: Giancarlo Parodi Renesas Electronics One of the first step to secure access to a valuable asset, is to make it available under a specified usage policy. Such a policy could for example restrict which part of the application software can use it, forcing it though a defined functional interface which cannot be bypassed, and at best implemented in hardware. An example of such isolation capability is provided by Arm TrustZone technology, which allows separating the user application into a so-called “secure” and “nonsecure” environment, by defining such additional state within the CPU context. Essentially the MCU memory space inherits such “security” attribute which in turn defines the access policy to a certain memory mapped address, for both code execution and data read/write. But where is the policy enforcement executed? The match between the current processor security state and the access policy for a certain address is evaluated by a dedicated security “stage”, located within the CPU core boundary. This evaluation is done before the MCU address is transaction is propagated to the internal bus system (more to this later). If the access policy is violated, an exception (i.e. an interrupt notification) is thrown, according to Figure 1. 22

Consequently the application can react to it and depending on the requirement perform user defined actions (like restarting a specific service, logging the event, signaling some fault to other equipment, and so on). Looking at Figure 1, it’s easy to see that software executed in “secure” mode, has unrestricted access to data, but can directly fetch and execute instructions only from program areas defined as secure. Non-secure software can instead access only non-secure data, and execute only non-secure software. It cannot access any secure resource.

Figure 1 TrustZone access policy But then, how do the two words communicate with each other? The case that each environment is completely independent and autonomous from the other, seems not really meanigful; it can be expected

that the non-secure application software needs to access resources and ‘services’ that are located within the secure domain. The final goal shall be to have a controlled, user defined way to let the secure and nonsecure application interact with each other. Fortunately, there is a mechanism to do that. To execute any secure function, the CPU needs to change its security attribute to secure, and to do that, it uses a dedicated special instruction called ‘secure gateway’ (SG). A SG instruction is paired with an immediately following branch (i.e. ‘jump’) instruction to the desired secure function

address; the non-secure application can use this ‘trampoline’ to first switch its state to secure (by executing the SG) and then to jump to the desired function, without issuing an exception. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Arm TrustZone technology

When the secure function returns, the processor state is switched back to nonsecure mode. An example of resource allocation between secure and non-secure environment is provided in Figure 2. All pairs of ‘SG + Branch address’ instructions need to be allocated into a special area defined as non-secure callable. A non-secure callable area is secure and has such special attribute.

are stacked by default on the secure stack and its contents are cleared out automatically. This is to prevent unintended leakage of information from the secure area. Partitioning the exceptions (peripheral interrupts) to be assigned to the secure or non-secure environment is supported via a dedicated and separate interrupt vector table within each domain. Similarly, there is a separate implementation of the stack pointers, systick timers, and so on.

individual threads from each other, and enhance the overall robustness of the software against errors. Figure 3 shows how the software application could be partitioned on a microcontroller supporting TrustZone. Have we achieved any security related goal so far? Actually, not yet. TrustZone provides isolation between application threads executing in the secure environment, and those executing into the non-secure environment.

Figure 2 Non-secure callable functions

For the sake of details, all function parameters like memory pointers and buffer references passed by the non-secure callable functions can be tested for their security attribute, to make sure the calling function has really the proper access permissions (for example, to check that a memory buffer is really located in non-secure memory, and does not overlap over secure memory, so there is no risk of data leakage).This check can be done via a specialized ‘test target’ instruction. Finally, it is also possible that while the CPU is in secure mode, a non-secure function needs to be called back. This would be a typical use case to notify the caller function about the status of the request, issue some RTOS-related notifications, and so on. The compiler toolchain can handle it and generate an appropriate special branch instruction that switches the state to non-secure before the call, and pushes the return address to the secure stack. Embedded systems are heavily interrupt driven, and in such scenario we need to think of what happens when an interrupt is issued when the CPU is in a particular state. In case a non-secure interrupt happens while the CPU is in secure mode, the registers https://international.electronica-azi.ro

This all sounds great, but how are those secure memory areas and boundaries defined? There are two units that get interrogated in parallel: the SAU (security attribution unit) and the IDAU (implementation-defined attribution unit). On each CPU access, both units perform an address lookup and respond with the security attribute associated with that address. The response of the two units gets combined, to define the address attribute; the overall principle is that the stricter of the two wins (meaning it is not possible to ‘override’ a secure region setting with a less secure attribute). Finally, the combined security attribute for that address is evaluated against the policy defined as in figure 1. If the access is legitimate, it can proceed – otherwise, it is blocked and an exception (secure interrupt) is raised at the CPU level. Noticeably, the configuration of the SAU (how many regions are supported, the default settings, etc) can be defined at design time, and the implementation of the IDAU is implementaiton defined, i.e. left to the device manufacturer. For further partitioning of application tasks, memory protection units (MPUs) can be used within each domain, to protect

But it does not provide any “security” perse and cannot control which threads access the secure environment, i.e. it cannot enforce legitimacy; rather prevent unintended usage or direct access to resources. At the end, it is the developer’s decision, which part of the application shall be isolated, and this is highly application dependent. TZ isolation can be used to protect any assets and enhance the reliability of an application, compared to a classical MPU based approach which relies on a priviledge level only (but is fairly easy to modify and circumvent in software). On the other hand, putting inside TrustZone area the cryptographic related operation seems a good idea for most applications requring crypto. Important is that the system shall apply any such settings right from the start of execution (at reset), and the configuration of such boundaries cannot be tampered with. Those could for example get stored into a special memory area not directly modifiable by the CPU itself. For typical security (cryptographical) related requirements, good practice would suggest keeping the amount of functionality implemented within the secure environment as essential and minimal as possible. 23

EMBEDDED SYSTEMS

This to reduce the possibility of misbehavior due to bugs in software implementation, runtime errors, and the malicious exploiting of any software defects by an attacker trying to gain unauthorized access to MCU resources. As a side effect, following this principle also makes validation of the functionality much easier during debug and test, since there is less to test. Which resources shall a cryptography capable microcontroller provide? It depends on the application complexity, as for an entry level solution, a pure software routine might be used as well. But having support for cryptographic algorithms in hardware has many advantages in terms of power consumption, code size and responsiveness of the system thanks to higher execution speed.

In any case, the hard problem behind their use is the key management. The most valuable asset represented by the user key must be protected by keeping its confidentiality (not exposing its value), its integrity (not allowing the key to be unnoticeably modified) and ensuring its availability. This opens lots of scenarios to consider, from when the key is injected (stored) in the system, how it gets transported there, how it gets loaded in the cryptographic hardware and protected from leakage during operation. Ideally the key material shall not be handled by the application software in plain text, i.e. in clear format, since it will be dangerously exposed. A simple way to prevent this could be to handle the key within the secure area defined by TrustZone, but best

Figure 3 TrustZone and MPU partitioning Having said that, the first building block of most cryptographic protocols is a TRNG (true random number generator), which shall be validated and tested for its entropy properties and quality of randomness (since an ill-constructed RNG can spoil the security of any algorithm using it). For local storage, support of symmetric algorithms like AES with multiple operation modes is almost mandatory, to encrypt and decrypt bulk of data. In combination with hashing algorithms (a sort of cryptographically secure checksums) like SHA-2 or SHA-3 can be perform simple authentication checks and verify that the contents of data have not been modified. For more advanced connectivity, the device shall support asymmetric encryption algorithms like RSA or ECC (elliptic curve cryptography) to support identity verification in client / server connections, derive secrets to generate ephemeral session keys, or verify the source and legitimacy of a firmware update, for example. All those accelerators shall also be able to generate user keys on-chip, for local usage. 24

would be use the keys only within a dedicated subsystem isolated from the rest. A similar problem raises once the keys are (typically) stored in the non-volatile memory; to avoid a break of confidentiality, techniques like key “wrapping” (essentially, key encryption) can help to protect the user key privacy. Making the wrapped data unique on every MCU further helps against shared keys leakage, and eliminates the risk of key copying (cloning) from an existing system to another. Obviously to implement such mechanism a ‘root of trust’ for storage is mandatory, therefore the cryptographic subsystem must have exclusive access to a ‘key encryption key’ unique for each microcontroller. The root of trust being unique per each MCU avoids that a compromise in one specific device allows a ‘class’ attack on all equipments fitting the same unit. Another important aspect is to assess the robustness of the crypto subsystem against DPA and SPA attacks, which log and analyze the power consumption traces and can reverse-engineer the key value.

This type of attacks are getting increasingly cheap and quick to implement, even for non-highly skilled attackers with limited resources. If physical access to the device is of concern, and there are no other access control means in the system, countermeasures against those those threats should be available and used. Additionally, any early detection feature which can monitor IOs connected to the equipment housing, generate a notification to the system, and possibly take a timestamp when a tamper is detected, will be desirable as well. To make the user life easier, the subsystem shall allow a way to provision, i.e. ‘inject’ user chosen keys into the device and have those wrapped and securely stored, ready for later application usage. The microcontroller should support some interface to provision the keys both in field and in factory, allowing easy first-time production, and later provisioing and updating in the field. Such provisioning step shall be secured as well, i.e. not expose any key content while this is in transit to the MCU. Considering now the software implementation, the mentioned approaches so far focused on the main CPU executing the application software. But in modern microcontrollers, other functional entities are able to autonomously transfer data to and from memory or peripherals, to improve performance by more efficiently using the available bandwidth. Some examples include DMA engines, graphics controllers, ethernet controllers and such. All the isolation features related to TrustZone are meaning-less for those agents, since these can issue transactions on the main interconnect bus autonomously and irrespectively of the CPU security attribution units, withouth further countermeasures. Therefore, it is vitally important that the microcontroller implements options to define the security attribute of each of those master peripheral channels, and has specific “filters” located on the slave side of the communication (in front of memories and memory mapped periperhals). Violations of the access policies at system level also need to be able to trigger exceptions (i.e. interrupt notifications) to the main CPU, in order to take corrective actions. Any microcontroller system would be almost useless without the capability of performing input and output operations on external digital and analog signals. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Arm TrustZone technology

Protecting such interfaces from misuse is also a fundamental requirement to prevent tampering, as this is obvoiusly the pre-defined way to interact with the MCU. The wary designer should make sure that the microcontroller can restrict the access levels for the I/O ports and peripherals, to prevent software to maliciously ‘take control’ of an interface, interfere with it, or snoop the communication (thereby breaking the security policy). The implemented functionality shall allow to isolate the peripherals and their ports from each other securely.

Figure 4 Secure Crypto Engine Keeping in mind space constraints, especially in small microcontroller packages the amount of functional interfaces can be much higher than the number of phisical pins available on the package; many of those are multiplexed together for the user to choose from. During the development phase, to test the software and verify it behaves as expected, a Jtag based debug probe is almost mandatory. By its very definition, such interface is able to access almost all resources on the chip and therefore constitutes a significant backdoor for any application which is later deployed in the field. The use cases for securing Jtag might be very different: some would want to permanently lock it, https://international.electronica-azi.ro

others might want to keep debug capability in the field and simply protect the access. Whatever strategy is chosen, it shall not be possible to bypass a permanent protection or access it without proper authorization; an authentication code or key owned by the developer shall be required in a challenge-response mechanism, and the latter shall complete succesfully to enable any successive communication. Finally, the device shall support a secure mechanism to send the device back to the factory for further analysis, in case a product defect is

suspected; this might involve erasing any stored secret assets, by still keeping the interface secured. After development, the final application image is ready to be deployed in the field. Part of it might be subject to later updates, but part of it shall be immutable to ensure that the application or the boot loader code is in a well-known state at any time. To support this requirement, the microcontroller shall have the capability to permanently protect user-defined parts of the non-volatile memory from modification. Last but not least, each microcontroller undergoes a lenghty test process in factory, to verify its correct functioning according to the techincal specification.

At the same time, many results of such tests (like trimming values, production specific data etc) and other MCU related settings are stored on the device during such factory test. This special test mode is not meaningful to an end user, but being very powerful it can access, control, and potentially tamper all chip resources. From security perspective, this is another potential backdoor and the manufacturer should ensure that a test mode cannot be entered maliciously or by mistake, once the device is out of the factory and in customer’s hands. Searching for the appropriate microcontroller supporting all or most of the above requirements can be a daunting task. Fortunately, Renesas has designed the RA series of microcontroller exactly with such goals. The RA6 and RA4 series of Renesas microcontrollers include devices featuring an Arm Cortex-M33 CPU with TrustZone and secure Memory Protection Units. They allow programming secure and nonsecure boundaries and settings for all built-in memory types in an easy and simple way. They embed the Secure Crypto Engine, a crypto subsystem (depicted in Figure 4) which provides comparable secure element functionality at higher performance and less bill of material cost. The SCE includes state of the art cryptographic algorithm accelerators, a TRNG, key generation, key injection in factory, SPA/DPA countermeasures, and implements a secure hardware root of trust by means of a hardware unique key. At system level DMA controllers, bus masters, peripherals and I/O pins have dedicated security attributes, tamper detection functionality is implemented. The MCU implements a device lifecycle management with integrated handling of secure/nonsecure debugging, secure/non-secure programming, return material procedure and protection of test mode. Any nonvolatile memory block can be made permanently protected at user discretion, thereby allowing a flexible Root Of Trust definition. For more information about the RA family security features, please visit www.renesas.com/RA Bibliography Evaluation Kit for RA6M4 MCU Group. R01UH0890EJ0110 RA6M4 Group User’s Manual: Hardware. R01AN5562EJ0100 Standard Boot Firmware for the RA family MCUs Based on Arm® Cortex®-M33

■ Renesas Electronics Europe www.renesas.com

EMBEDDED SYSTEMS

Modular system facilitates development of applicationspecific robots Germany’s largest distributor of pharmaceuticals – Transpharm Logistik, part of Teva Pharmaceutical Industries – relies on application-specific modular autonomous robots from Toolify Robotics, a start-up from Ulm University of Technology, to pick promotional materials. The robots Transpharm uses are based on Computer-on-Modules from embedded computing specialist congatec.

Transpharm has replaced conventional order picking carts with self-driving carts

Author: Zeljko Loncaric Marketing Engineer | congatec

The solution at a glance Industrial robots are a key cornerstone of Industry 4.0. But because it is very costly and time-consuming to develop and implement customized robotic solutions, many small and medium-sized companies shy away from the investment. Not only in production, but also in intralogistics. This is why start-up Toolify Robotics has developed Xito (www.xito.one), an open, manufacturer-independent modular system for autonomous intralogistics vehicles and mobile pick-and-place robots. In combination with Computer-on-Modules from congatec, this paves the way to flexible and low-cost development of customized automation solutions.

Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Computer-on-Modules for autonomous intralogistics vehicles

The automation of materials handling processes has long been a driver of innovation and investment in the intralogistics sector. In many areas, processes can be automated using a wide variety of materials handling solutions to accelerate material and goods flows, and to shorten work processes. But there are also areas that cannot easily be automated by installing fixed conveyor technology. So, not every warehouse can become an automated high-bay warehouse. This is only viable if the comparatively steep investment is justified by the throughput, and the storage bays are highly standardized.

Compatibility is the key Martin Zwiebel decided to test the open, vendor-independent platform Xito (https://www.xito.one). Xito is a modular building block system and software ecosystem from Toolify Robotics for the design, interface management, implementation and operation of customized autonomous intralogistics vehicles and robots. It grew out of a joint project between several universities. The start-up Toolify went on to develop the concept into a market-ready solution as a spin-off of Ulm University of Technology. Martin Zwiebel used it to easily assemble a customized autonomous picking cart in line with his own ideas and requirements. “I was able to pick the most suitable components from the Xito marketplace and connect them together,” enthuses Zwiebel.

At Transpharm Logistik, however, the promotional products change frequently and come in different shapes, sizes and weights. Staff therefore have to pick them individually per recipient.

Nevertheless, Transpharm Supply Chain Analyst Martin Zwiebel was tasked to optimize the pick and delivery process further. “Staff were using heavy, bulky carts to pick promotional products,” recounts Zwiebel. Equipped with tablets and supported in some cases by pick-bylight systems, they gathered the individual items from across the entire warehouse and then wheeled the cart with the complete pick to the packing department, where the promotional products were made ready for dispatch. “When looking for a faster and easier solution, it became apparent that a driverless transport system promised significant advantages,” the analyst continued. So, what was needed was an affordable robotic trolley that could autonomously find its way to the next storage bay following a predefined optimized route, and that would prove a constant and helpful companion to staff.

Xito from Toolify is a development platform to easily build mission specific autonomous robots such as logistics vehicle and transport robots, with optional pick-and-place functionality. https://international.electronica-azi.ro

EMBEDDED SYSTEMS

The Xito marketplace today offers more than 50 hardware building blocks for various autonomous transport logistics and mobile pick-and-place robotics applications: navigation, augmented or virtual reality, localization, intelligent obstacle avoidance, speech and object recognition, RFID readers, etc. Even grasping and positioning would be possible. Dr. Dennis Stampfer, CEO and co-founder of Toolify Robotics, developed the necessary software for the modular system with his team. “We offer easy-to-use tools to create plug-and-play components that make it comparatively simple to realize quite complex robotics applications,” says Dr. Stampfer.

that is pushed like a shopping trolley, there is now a self-driving robotic cart with tote waiting to accompany pickers. When all picks have been made, they send the robot with the picked items to the packing department. To take itself there, as well as when driving around in the warehouse, the robotic cart follows routeoptimized pre-defined paths. And a new empty robot waits at the starting point, ready for the next picking task. “Xito made it easy, quick and affordable to configure an autonomous logistics vehicle that perfectly fits our specific picking task,” confirms Martin Zwiebel. “Everything worked flawlessly. That is not a given.

This makes solutions viable that would previously have needed extremely high throughput and scaling to offset the costs. At Transpharm’s warehouse, three such autonomous picking carts are fully sufficient for handling the promotional products. Modular kit needs modular processor “The integration capabilities and advanced modularity of Xito needed a similarly modular and flexible hardware architecture as one of the core components”, explains Dr. Stampfer After all, the required computing performance of the individual Xito solutions varies depending on how the modular components are assembled. The platform therefore deploys Computer-on-Modules as

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To be able to adapt the intelligence to the specific tasks, the Toolify development kit leverages flexibly scalable Computeron-Modules from embedded computing specialist congatec.

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The new conga-TCA7 modules based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processors come in 8 scalable variants and are specially designed for energy-saving and/or cost-optimized applications.

Xito drastically simplifies and accelerates the programming of robotic applications, requiring no expert knowledge. “The overall system consists of many different subsystems and devices. We act as the interpreters with our manufacturer-independent platform.”

Without a development kit like Xito’s, the individual components often lack the required compatibility, necessitating immensely costly efforts to develop a working software and hardware solution – costs that often exceed the financial means of small and medium-sized companies.”

Robotics and automation for all Transpharm now has a collaborative mobile robot that autonomously follows the pickers to the next relevant location. A pilot project with several robots went down extremely well with staff: Since then, they have been enjoying the robotic assistance as it means they no longer have to push the heavy picking carts by hand. Just like before, picking begins at a specific starting point, but instead of a picking cart

Depending on the requirements, Xito saves users up to 75% of the development and implementation time of conventional solutions. This is because they can use simple, less expensive standard components that would not be able to communicate with each other without the Xito development kit. Another advantage: The individual building blocks of the kit are reusable and can also be assembled differently.

they allow flexible scaling of computing power. Next to task-specific load balancing, this also enables application-specific price and performance balancing. The latest Computer-on-Modules to be supported are based on the COM Express compact form factor and feature the new 11th generation Intel Core processors (Tiger Lake). They scale in performance up to the Intel Core i7. For low-power or cost-sensitive applications, there are modules based on the Intel x6000 Intel Atom Celeron and Pentium processors (Elkhart Lake). Developers can scale their applications across 15 different performance levels based on this new processor technology alone. Many further variants can be created using other processor platforms, as they are quasi pin-compatible Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Computer-on-Modules for autonomous intralogistics vehicles

thanks to the COM Express module standard and can therefore be scaled across all processor architectures. For robotic applications in particularly harsh environments, there are modules that are specifically designed for the extended temperature range of -40°C to 85°C.

ther by using real-time capable hypervisor technology. In fact, support for hypervisors from Real-Time Systems is standard on all x86 Computer-on-Modules from congatec. These innovative hypervisors enable multiple operating systems – both real-time operating systems (RTOS) and standard operating

congatec modules featuring the latest Intel Core processors of the 11th generation (Tiger Lake) are also available for the extended temperature range of -40°C to 85°C

Without congatec’s Computer-on-Modules, however, such flexibility and modularity would be hard to imagine.

This expands the field of robotics for logistics applications from cold storage right across to large bakeries, where robots are for instance deployed to move trolleys with racks of freshly baked goods in the immediate vicinity of the ovens. These options can be expanded still fur-

Great prices, huge improvements Robotics is booming, but for many small and medium-sized companies the investment is too high. “We help to make the development of robotic solutions simpler and more sustainable so that small companies can also reap the benefits of this technology,” explains Dennis Stampfer.

systems (GPOS) such as Microsoft™ Windows® or Linux – to run in parallel on x86 multicore processors while retaining their hard realtime characteristics. This makes the modular congatec systems at the heart of the Xito robots highly configurable for a wide variety of tasks and subsystems.

Martin Zwiebel estimates that Transpharm increased its productivity by 20% to 25% thanks to the new robotic solution. Now he is already planning what next projects to tackle with Xito. “Refrigerated picking faces similar challenges: a constantly growing portfolio and more agile processes. Besides, the prevalent space constraints do not allow automation with conventional conveyor technology.” He also sees potential for Xito systems in production and quality assurance, and maybe picking itself can also be realized automatically with a robotic transport system in the future. ■ congatec www.congatec.com

Transpharm Logistik building

Transpharm Logistik, part of the internationally active Teva Pharmaceutical Industries Group, has been managing pharmaceutical and healthcare logistics processes for over 30 years. From the inflow of products through to merchandise management, warehousing, order processing, and delivery, Transpharm handles the complete range of logistics processes involved in distribution. Two million medicine packages leave the logistics center in Ulm every day. This makes Transpharm Germany’s largest pharma distributor. https://international.electronica-azi.ro

Best Practices for

Powering USB4 USB receptacles are everywhere, and everyone with a smartphone has at some point found themselves staring at a port wondering if it will charge their device. Author: Fionn Sheerin | Principal Product Marketing Engineer, Analog Power and Interface Division Microchip Technology

The power landscape is getting simpler with industry convergence on USB Power Delivery (PD) standards, and with good implementations USB4 can continue that trend. Ensuring the best possible charging experience across multiple new use cases will depend on several application design decisions. The main purpose of the USB4 development is to double the data rate compared

Figure 1 USB Cable Plug Form Factors.

to USB 3.2 (40 Gbps compared to the prior 20 Gbps) and to enable support for Intel's Thunderbolt protocol. USB4 will exclusively use the USB type-C port, the oval-looking port with the blade down the center famous for accepting cables even when they are inserted upside down. While inserting the cable may be getting simpler, the charging technology behind for USB4 ports must now include USB PD, which

adds complexity. Prior generation USB specifications using the type-C port had an option to allow for PD; USB4 requires it. Power Delivery Required in USB4 The PD specification was revised to include new messages to discover and transition to USB4 mode, but the power schemes are the same. They use a singlewire 300 kHz bus on one of the Configuration Channel (CC) lines of the USB type-C interface for the host and device to discover and negotiate the power and data they will be transferring (figure 1). The other CC line assumes the role of “VCONN” a dedicated power source for the electronic marker (an identification circuit inside the USB cable). The power delivered between USB ports is transferred on a separate set of wires within the connector (labelled “VBUS”, see figure 2). When two PD devices connect, they use the CC wire to detect each other, communicate power capabilities (which voltages, and how much power at each voltage), understand which device should source or sink power, negotiate how much power to deliver, and then provide that power on VBUS. This 300kHz digital signal is also used to identify that the USB connection can support a USB4 link, so there is no way to implement USB4 without this communication. USB4 ports are not required to supply or receive any power beyond a minimum 5V / 900mA; but they must support PD communication to function as USB4. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Powering USB4

Historical Power on the Universal Serial Bus To look at the charging user experiences in USB4, it is helpful to understand the history of power across the USB connector (see figure 2). The Universal Serial Bus was originally meant for serial data communication, with a maximum of 100mA of current in the cable. USB 2.0 specifications were limited to 500 mA in the VBUS line; this was suitable for powering basic computer peripherals. USB 3.0 standards increased the current limit to a 900 mA, but with portable devices converging on a single connector for data and power, it was not enough. The USB committees released the battery charging (BC) specifications, ending with the BC1.2 specification in 2010, allowing 1.5A (7.5W); and at that point, many smartphone manufacturers gave up on being USB specification compliant. This led to a proprietary charging protocol free-for-all, using voltage levels set on the D+ and D- lines (USB data lines): 2V on one line and 2.7V on the other might give a 10W charge; 2.7V on both data lines might signal a 12W charge; 3.3V on each line would trigger a charger to provide 20V (which could be damaging, if applied by mistake). These methods were not interoperable, and results were unpredictable. In addition, the data lines used to decide charging levels were no longer available for data. A port can transfer files, or it can charge faster, but not both. Anyone who has ever experienced a phone dying while charging - that port was possibly a data connection supplying 500 mA under the USB 2.0 specifications. This issue motivated the first PD specification (revision 1), creating a universal standard for charging at alternate voltages (more than 5V) using traditional 4pin USB cables. Maintaining backwards compatibility required adding a handshake signal to the VBUS line itself, which was complicated to implement and the whole thing was scrapped without significant adoption. The USB-IF would prefer everyone forget this spec was ever written and practically speaking, everyone should. This approach is no longer valid or supported. Today, there are PD versions 2.0 and 3.0, and the included programmable power supply (PPS) specifications. These were created alongside the USB type-C port, with added signal connections. The differences between version 2 and 3 are mostly https://international.electronica-azi.ro

in the CC communication details. Both are backwards compatible with prior USB implementations (excluding PD revision 1) and the user experiences will be the same. Devices negotiate charging profiles, potentially down to 20mV increments (under PPS implementations). PD

charging at 5V (recognized by resistors on the CC pin, instead of the digital signal). Type-C ports do not require PD, but PD does require a type-C port, which is where USB4 changes things (see figure 3); USB4 uses PD communication to enable the USB4 mode.

USB Power Policies over Time. The proprietary standards varied by Figure 2 manufacturer, while new USB specifications generally maintained

backwards compatibility with prior specifications.

USB Data and USB Power Relationships - USB 2.0 can exist on any USB cable, with or without power delivery on a type-C cable. USB3.x requires a cable with additional superspeed lanes, with or without Figure 3 power delivery on a type-C cable. USB4 can only exist on a type-C connection, with Power Delivery communication. Power Delivery can only exist on a type-C connection but does not require data. capable devices can (but are not required to) support up to 100W of power transfer within the specification (5A at 20V). The proprietary schemes to advertise alternate charging profiles using the data lines are explicitly forbidden, but USB type-C also allows for simplified 1.5A and 3A

While new devices will follow the new streamlined specifications, the complexity in USB charging comes from all of these legacy standards, all of which still exist on older ports, and a new USB4 port may be connected to any of those legacy ports (see Table 1). 31

POWER

Use Cases and User Experiences Trying to maintain five generations of backwards compatibility creates a complicated landscape of possible power connections. It leaves a big question about what happens to all the older USB ports and cables, and users may still be wondering “will it charge?” Fortunately, ignoring the proprietary specifications, most of that history falls into just a few possible user experiences. While they will all charge, they may not all charge quickly. There are fundamentally four use cases to consider in the context of USB4: 1. A legacy charging port connects to a USB4 type-C device using an adapter cable 2. A USB4 type C charger connects to a legacy port using an adapter cable 3. A USB4 type C port connects to a non-USB4 type C port with a C-C cable, and places a resistive divider on the CC line 4. Two type-C ports connect with a C-to-C cable, and communicate on the CC lines; either or both could be USB4 devices

the cable could carry 7.5W. If the USB4 isn't set up to support the extra overhead of BC1.2, the USB4 port will need to default to 500mA for a USB 2.0 data connection, or 900 mA for a USB 3.x data connection. This will lead to some user frustration, as the fanciest USB port may result in the slowest charging when used with adapter cables. USB4 to Non-USB4 Type C, with Resistive Dividers If either the power provider or consumer is using the type-C resistive divider method to advertise power capabilities, that will dictate the power transfer. The USB4 device will not be able to communicate on the CC lines, but it will still recognize the attachment, the provider/consumer relationship and the current limit (1.5A or 3A) using current sources or resistors connected to the CC lines.

power (and this is a valid use case for data transfer between portable devices). Provider ports may be marked with a battery symbol, so in many cases users will know which ports on a dock or a laptop are setup to provide power. In that case, the port providing power must be able to supply at least 1.5A at 5V (7.5W, same as BC1.2) to use a USB-IF approved charging logo. Higher power levels are not guaranteed to be available even in a type-C port labelled with a charging icon. Since the power contract could be any power level from 7.5W to 100W, the user will only know what is happening if one of the devices reports information about the contract (indicating a power level or fast charging connection). This use case certainly has the potential to create unpredictable and frustrating user experiences, but with good reporting and good user interfaces, this could also be a perfect user experience.

In terms of USB standards, the 8-pin Apple Lightning connector carries the same signals as a legacy USB 3.x cable. USB4 ports connecting by type-C to Lightning adapter cables will behave similarly to type-C to micro-B, or type-C to type-A cables, in terms of power functionality. The following is a summary of what to expect with each charging use case: Legacy Charging Port Connected to a USB4 Device Using an Adapter Cable Legacy ports like the type-A and type-B ports may have been created before the Type-C specifications (see figure 1). There wasn't, and will not be, a requirement for these ports to implement any specific faster charging scheme. A USB 2.0 port could default to 500 mA charging, or a USB 3.x port could default to 900 mA. The good news is that most newer USB ports do support BC1.2 and will provide 7.5W. It doesn't matter what kind of adapter cable is used, the USB4 or type-C device connected into the legacy charge port cannot draw more than 7.5W of power without violating the USB specifications. USB4 Charging Port Connected to a Legacy Device Using an Adapter Cable In cases where a USB4 charging port is connected to a legacy device, a few possible outcomes could happen. The USB4 port could advertise 1.5A using BC1.2 standards, and 32

Table 1 USB Power Connections.

The bus voltage will stay at 5V, and the load device will be able to draw power up to 7.5W or 15W. Since the device knows it isn't in PD mode, it may indicate that it is not fast charging for a clear user experience. Type-C to Type-C, with PD Communication This is potentially the most capable USB4 connection in terms of power transfer, but the exact results will vary. The two connected devices will negotiate a power contract based on their capabilities, up to 20V and 5A. Part of the negotiation is the role as a provider or consumer of power. It is possible to connect two power consumers, who would negotiate not to transfer

Conclusion The addition of USB4 will add a lot of bandwidth and capabilities to the USB applications that can use them, but USB 2.0 and USB3.x will continue to live in applications that can live with less data transfer. The power use cases will multiply, but with smart application design this does not need to create bad user experiences. ■ Microchip Technology www.microchip.com

Electronica Azi International | 1/2022

PRODUCT NEWS

Powerbox’s 1200W power supply has adjustable ‘near to zero’ output voltage and current for conduction cooling applications Powerbox has announced the release of the 1200W rated OFI1200A AC/DC power supply for industrial applications. Optimized for conduction cooling, the OFI1200A delivers high performance levels across a baseplate temperature range of -40 to +95°C without the use of a fan. The power supply operates with a wide universal input range from 85 to 305VAC with power factor correction (PFC). Covering a large range of applications, its output voltage and current can be adjusted from near zero to the maximum allowed for each model. A number of industrial applications require power supplies to operate with limited or no ventilation cooling. In this respect, those operating in harsh environments where electronic equipment is installed in a sealed box, radio communication systems subject to adverse weather conditions, outdoor displays and traffic signaling, and indoor equipment with very strict audible noise restrictions. In addition to environmental requirements, reliability and cost of maintenance are motivating systems designers not to use fans and blowers. To cover a large range of applications, the OFI1200A operates with a wide universal input range from 85 to 305VAC (Nominal https://international.electronica-azi.ro

100 to 277VAC). The unit includes a PFC with a coefficient of 0.98/0.95 (110VAC/230VAC). The OFI1200A is available in three versions of single output DC voltage, 12V/84A; 28V/43A and 48V/25A. Using a high efficiency topology, the typical efficiency for the 48V output unit at 230VAC input is an excellent 92%. Industrial applications such as professional lighting or even low-power electrolyzers require the power supply to deliver constant current, and this must be easily adjustable. Often such equipments are operated in environments requiring the electronics to be enclosed and protected from hazards. This necessitates the power supply to offer an external control to adjust the output voltage and/or current from the maximum allowed to near zero. To make it possible for customers to precisely adjust the voltage and current to their application, the OFI1200A offers two analog inputs, VTRM and ITRM. Using those functions, the output voltage and current can be adjusted from near zero up to the maximum specified per model. For example, the 28V output can be adjusted from near zero volts up to 33.6V, and the output current from near zero amps up to 43A.

The output voltage can also be adjusted using the provided onboard potentiometer. The extended trimming and control function simplifies the utilization of the power supply in constant voltage (CV) or constant current (CC) mode, without adding external circuitry. For applications requiring redundancy or higher power, it is possible to connect up to nine units in parallel, delivering an impressive total power level of up to 9,720W in conduction cooling mode. To maintain the highest level of efficiency when operated in parallel or in redundancymode, optional active ORing circuitry deploying high performance FET technology (Option-O) is available on the OFI1200A28 and OFI1200A48. For safety, the OFI1200A has an IN/OUT isolation of 3,000VAC and IN/FG of 2,000VAC. Output isolation to FG is 500VAC. The power supply includes over current protection with auto recovery, over voltage and over temperature protection. The OFI1200A board includes easy access to auxiliary functions via on board connectors, namely: Remote Control, Output Voltage Sensing, Power Good, VTRM, ITRM. The OFI1200A has passed shock and vibration testing as specified in MIL-STD810H. In that respect the products have been tested to levels far above normal operating conditions and are designed to sustain high, 20G level shocks. In its open frame format, the OFI1200A measures 142 × 39 × 260mm (5.59 × 1.54 × 10.36 inches) and weighs 1.2kg max. An optional metal cover is available, adding just 1mm to the height and 200 grams to the weight (Option-N). Benefiting from a design optimized for conduction cooling, the OFI1200A is suitable for applications requiring a silent power solution such as in a control room. Equally, it is suitable for industrial applications when forced air ventilation is not possible due to environmental constraints. Attached to a chassis or cold plate, the OFI1200A can deliver impressive power levels with a high level of reliability. The OFI1200A is certified in accordance with UL62368-1 3rd edition, cUL (equivalent to CAN/CSA-C22.2 No.62368-1). The OFI1200A series has a full three-year warranty and conforms to the European RoHS, REACH and Low Voltage Directives. The product carries the CE, UKCA and cURus markings. Powerbox - a Cosel Group Company https://www.prbx.com 33

PRODUCT NEWS

Renesas Wireless Power Charging Technology Is Integrated in Wacom Active ES® Pen Solutions Renesas Wireless Power Receivers are Highly Efficient at Light Loads and Well-Suited for Low-Power Applications Renesas Electronics Corporation announced that its wireless power charging technology is integrated in the Active ES® pen solutions from Wacom, a leader in cuttingedge digital pen and ink solutions. The Renesas single-chip wireless power receiver IC delivers small size and high efficiency compared to alternative high-frequency charging solutions. Renesas wireless charging technology is small enough to fit into digital pen and conveniently charge it while wirelessly docked to the tablet. Integrating the low-frequency wireless charging into Wacom’s Active ES® pens opens up new possibilities. This novel and innovative concept brings the convenience of wireless charging to accessories, enabling users to creatively express themselves on both smartphones and tablets. “Renesas is proud to expand our work with a proven leader such as Wacom to help bring leading-edge wireless charging solutions to the digital pen market,” said Amit Bavisi, Vice President and general manager of Renesas’ Wireless Power Group, Mobility Infrastructure and IoT Power Business 34

Division. “We continue to be the innovation leader in wireless charging, working with customers around the world to bring the convenience of wireless charging to a variety of platforms.” “Our customers are always looking for streamlined solutions for charging their digital pens, and Renesas provided us with the much-needed support to deliver a premier solution for our consumers with the small size and power efficiency we needed,” said Sayatake Komine, EVP and head of Wacom’s Technology Solution Business Unit. About Renesas Wireless Power Receivers Renesas wireless power receivers are the world’s highest power density devices and feature high levels of integration and high efficiency at light loads. They are well-suited for low-power applications such as earbud case charging and digital pens. A unique ping-detect feature gives an early indication of the wireless charger connection and improves thermal performance at the end of complete battery charging. Additionally, the integrated 32bit processor offers a high level of programmability and design parameters that

can be easily configured to work with small rod coils that fit into digital pens. Renesas is the global leader in wireless power solutions for both the power receivers (PRx) used in smartphones and other applications, as well as the power transmitters (PTx) used in charging pads and automotive in-car applications. Visit renesas.com/wirelesspower to learn more about Renesas’ wireless power solutions. Winning Combinations Renesas has combined complementary components that work together seamlessly to create Winning Combinations for a variety of systems powered by wireless charging. An example of one of these solutions is the Pen Scanner / Reader design that can be leveraged for additional smartphone and tablet accessories. Renesas offers more than 300 Winning Combinations with compatible devices for a wide range of applications and end products. They can be found at renesas.com/win. Renesas Electronics Corporation https://www.renesas.com Electronica Azi International | 1/2022

Nuclei Studio IDE now with SEGGER’s emRun runtime library for RISC-V SEGGER and Nuclei Technology, a China-based RISC-V processor IP and solution company, announce that the Nuclei Studio IDE now comes integrated with SEGGER’s emRun runtime library. As a result of this cooperation, executables produced by the Nuclei toolchain using emRun are both smaller and faster. emRun is a complete C runtime library for use with any toolchain. Written from the ground up specifically for embedded devices, it is designed to provide high chip performance with the smallest possible memory footprint. In many cases, the reduced code size makes it possible to use smaller microcontrollers and less on-chip memory, which can lead to significant cost savings. Included in emRun is emFloat, a complete, fully optimized and verified floating-point library for embedded systems. emFloat’s arithmetic routines are hand-coded in assembly language and optimized for small code size and high execution speed. “This is another great step forward for RISC-V and for SEGGER in China,” says Guowei (Lionheart) Chen, Executive Director & General Manager, SEGGER Microcontroller China Co., Ltd. “We believe we have the ideal components for Silicon Vendors, especially small and mid-sized companies, that want to start with a perfect, affordable solution. We are proud to be jointly enhancing the RISC-V ecosystem with Nuclei.” Huaqi Fang, Software Director of the CoreTech department at Nuclei, says: “SEGGER has made a huge and lasting contribution to the development of the RISC-V ecosystem and is one of the key players broadening RISC-V usage. The integration of the emRun library will help Nuclei Studio to progress and to provide more possibilities, especially in embedded MCU scenarios. It provides excellent code size and performance, both in terms of efficiency and cost. With the continuous development of the RISC-V ecosystem and more iterative upgrades of our software platform, we also look forward to more cooperation opportunities between the two parties in the future.” emRun’s value and performance has been widely proven as part of SEGGER’s Embedded Studio IDE, which can also be used to easily evaluate this performance, free of charge. For more information on emRun, please visit: www.segger.com/emrun ►SEGGER | https://www.segger.com 36

synchronized real-time over congatec – a leading vendor of embedded and edge computing technology – introduced new Computer-on-Modules for 5G connected smart factories and industrial automation at Smart Factory & Automation World. Designed to simplify and accelerate the development of collaborative robotics and material handling systems, the smart mobility platforms from congatec are suitable for deployment in outdoor temperatures from -45°C to +85°C. Typical targets for these platforms range from next generation of real-time connected, functionally safe self-driving vehicles, to smart manufacturing and material handling applications ranging from collaborative and cooperative robots to substitutive solutions such as robots for THT assembly of PCB boards. OEM vendors of next generation smart logistics vehicles and manufacturing robots must tackle a variety of tasks when designing those new controllers. They have to integrate vision and various other sensors for gathering situational raw data, need to implement data preprocessing and artificial intelligence (AI) to improve data analytics, and design controller logic for autonomous vehicle movement and operation. In addition, they need 5G device connectivity for vehicle-to-vehicle Electronica Azi International | 1/2022

PRODUCT NEWS

COM-HPC Server modules with Intel Xeon D processors The new COM-HPC Server modules in Size E and Size D with Intel Xeon D processors are designed to accelerate the next generation of real-time microserver workloads in industrial factories and outdoor environments with extended temperature ranges. Improvements include up to 20 cores, up to 1 TB RAM, double throughput per PCIe lane compared to Gen 3, as well as up to 100 GbE connectivity and TCC/TSN support. Target use cases in smart factory applications range from servers deployed in 5G tactile internet applications to edge servers for larger machines and manufacturing equipment. More information about the new Intel Xeon D processor based Computer-onModules can be found at: https://www.congatec.com/en/technologies/intel-xeon-d-modules/ Computer-on-Modules with 12th Gen Intel Core processors Featuring 12TH Generation Intel Core processors (formerly codenamed Alder Lake), the new congatec modules in COMHPC Size A and Size C as well as COM Express Type 6 form factors offer major performance gains and improvements for the next generation of smart mobility systems and collaborative manufacturing robots. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. With up to 14 cores on BGA variants, 12th Gen Intel Core processors provide a quantum leap in multitasking and scalability to accelerate multithreaded vehicle and robotic applications and to execute dedicated real-time tasks more efficiently.

r 5G and vehicle-to-x communication, or respectively, robot-to-robot and robot-to-x-communication. And all this needs to be implemented with real-time capabilities and functional safety. “congatec positions itself as the embedded computing platform and ecosystem provider that supports smart logistics vehicle and manufacturing robot vendors comprehensively in all these tasks, from TSN capable rugged Computer-on-Modules for the extended temperature ranges and real-time hypervisor technologies to application ready OEM platform building blocks provided by our constantly expanding network of solution partners,” said Yoonsun Kim, country manager at congatec Korea. Highlights of the congatec presentations at Smart Factory & Automation World were the Intel Xeon D processor based COMHPC Server modules for industrial edge servers and 5G campus network equipment; the 12th Gen Intel Core processor based COM-HPC Client and COM Express modules for smart vehicle/ robot gateways and vehicle/robot network controllers; as well as Intel Celeron, Pentium and Atom processor based Pico-ITX Single Board Computers (SBCs) as application ready real-time processing cores for industrial edge computing applications. https://international.electronica-azi.ro

In addition, with up to 96 Execution Units, the integrated Intel Iris Xe graphics is estimated to deliver extraordinary improvements of up to 129% in GPGPU processing to accelerate parallelized workloads such as AI algorithms, as compared to 11th Gen Intel Core processors. More information about the new 12th Gen Intel Core processor based Computer-on-Modules can be found at: https://www.congatec.com/en/technologies/intelalder-lake-modules/ Pico-ITX Single Board Computers with Intel Atom x6000E processors The Pico-ITX boards with Intel Atom x6000E Series processors or Intel Celeron and Pentium N & J Series processors (code named “Elkhart Lake”) are designed for edge-connected embedded systems. They impress with graphics performance up to three simultaneous displays running at 4kp60 and impressive multithread computing power on up to 4 cores. Further benefits especially welcomed in real-time industrial markets are Time Sensitive Networking (TSN), Intel Time Coordinated Computing (Intel TCC) and Real Time Systems (RTS) hypervisor support as well as BIOS configurable ECC and extended temperature options from -40°C to +85°C. The combination of rugged realtime operation, real-time connectivity and real-time hypervisor technologies is what OEMs need for IoT-connected industrial applications. More information about the conga-PA7 Pico-ITX Single Board Computers can be found at: https://www.congatec.com/en/products/pico-itx/conga-pa7/ ►congatec https://www.congatec.com

Sixteenth brick DC/DC delivers 100 W down to 30 V input Flex Power Modules has added to its PKU-D series of lowprofile sixteenth-brick DC-DC converters with the PKU3913D, a 100 W rated part with an extended input range down to 30 V and regulated output of 12 V/8.3 A. The intended application is for nominal inputs of 48 V or 54 V with possible long cable lengths and consequent voltage drops such as microwave radio links for example. In this case, the low input drop-out voltage of the part is an advantage to guarantee extended operation, and the input range is also compatible with PoE standard IEEE 802.3af (37-57 VDC). The PKU3913D is designed for high efficiency at lower input voltages, peaking at over 95%. The parts feature pre-bias, monotonic start-up capability, remote on/off and an MTBF of 13.88 M hours at 40°C ambient according to Telcordia standards. Products are certified to IEC/EN/UL 62368-1 for 2250 VDC input to output isolation. Comprehensive protection is included against over-temperature, input undervoltage, and output overvoltage, over-current and short circuits. The PKU3913D series is housed in a 33.02 mm x 22.86 mm footprint and is just 11.3 mm high in the open-frame formats, with optional through-hole or SMT termination, or just 12.7 mm high for the pinned version with optional base plate. Size and pin-out is industry-standard. Flex Power Modules has been a technical pioneer in the development of power modules for more than 40 years with quality designed and built into products at every stage. The PKU3913D series benefits from this long experience and has undergone comprehensive qualification, which, along with highly automated manufacturing, guarantees reliable operation. Flex Power Modules’ products are backed up by ISO 9001/14001 certification and unrivaled technical support. ►Flex Power Modules | https://flexpowermodules.com 38

E-PEAS Unveils Constant Voltage PMICs for Intermittent Input Energy Harvesting Arrangements Through the release of a further three new power management ICs (PMICs), e-peas is providing product developers with even greater scope to implement their energy harvesting systems. The innovative engineering breakthroughs of these new devices include constant input voltage regulation, making them uniquely optimized for intermittent and pulsed power inputs, complementary to the existing AEM family. The AEM00330 is a full power management chip, whereas the AEM00300 being a storage element charger. Both of them are self-configurable, with the ability to automatically switch between buck, buck-boost and boost operation. This enables faster adjustments with different source, storage and load arrangements (step-up, step-down, etc.) and maximizes these devices’ energy transfer capabilities. They have been designed to respond instantly to the power input once a pre-defined threshold has been exceeded – leading to quick and effective energy extraction. The operating input voltage range goes from 140mV to 4.5V, so power levels of 3μW to 570mW can be managed. Another key feature is their ability to swap from powering the load or the storage element, giving greater flexibility in applications where there should be initial focus on one or the other. Electronica Azi International | 1/2022

PRODUCT NEWS

Among the potential uses for these devices are door access systems, smart switches for smart home or smart building, point-of-sales (PoS) units and smart running shoes. The AEM00940 is a boost solution designed for supporting high efficiency energy transfer from sources having a lower voltage than the storage element. It has an LDO-based output rather than a DC/DC-based one. The selectable operating input voltage spans from 50mV to 4.5V. As well as pulsed and intermittent sources those three PMICs are highly suited to use with sources that require a long time to reach their open-circuit. All three of these new e-peas devices have complete storage element versatility, allowing them to be applied to energy harvesting implementations with single and dual cell supercapacitors, Li-Ion, LiFePO4, Li-Po, NiCd, thin film batteries and solid-state batteries. Each of them has selectable and adjustable storage element protection mechanisms, covering over-charge and over-discharge. “Not all energy harvesting can rely on longer lasting outputs. There are many cases where only a short burst will be available,” e-peas’ CMO Christian Ferrier states; “By developing solutions that can quickly react to such sources, we are bringing something truly unique to the market. Our new constant voltage PMICs can capture energy whenever it is present, addressing the needs of home and building automation, and many new use cases”. The AEM00330 is supplied in a 40-pin QFN package format with 5mm x 5mm dimensions. The AEM00300 comes in a 4mm × 4mm 28-pin QFN package, while the AEM00940 has a 5mm × 5mm QFN28 package. They can each be adapted to meet customers’ specific packaging needs and are also available in a bare die format for high volume orders (as for the overall e-peas product family). Dedicated evaluation kits (EVKs) for each of the new PMICs will be available soon, enabling engineers to test the rich configuration sets. ►e-peas | https://www.e-peas.com https://international.electronica-azi.ro

Toshiba further expands super junction MOSFET range with four additional 650V devices

Toshiba Electronics Europe GmbH has added a further four Nchannel super junction 650V power MOSFET devices to extend their DTMOSVI series. The new devices build upon the market success of the current devices and will primarily be used in applications like Industrial and lighting power supply and other applications where ultimate efficiency at small form factor is a requirement. The new TK090E65Z, TK110E65Z, TK155E65Z, and TK190E65Z MOSFETs achieve a 40% reduction in the drain-source on-resistance (RDSON) x gate-drain charge (Qgd) figure of merit (FoM) when compared to the previous DTMOS generation. This will translate into a substantial decrease in switching losses over earlier devices. As a result, designs incorporating the new devices will see an increase in efficiency. The performance enhancement will apply to new designs as well as upgrades of existing designs. All four of the new devices offer a drain-source voltage (VDSS) of 650 V with a drain current (ID) capability up to 30 A. Drain-source on-resistance (RDSON) is as low as 0.09W and the gate-drain charge (Qgd) can be as low as 7.1 nC, allowing low-loss operation at high speeds. All devices are packaged in industry-standard TO-220 through-hole packages. Toshiba will continue to expand its product lineup to meet market trends and help improve the efficiency of power supplies. For further information, please visit: https://toshiba.semiconstorage.com/ap-en/semiconductor/product/mosfets/400v900v-mosfets/articles/state-of-the-art-super-junction-mosfet-dtmos6.html ►Toshiba Electronics Europe https://toshiba.semicon-storage.com/eu/top.html 39

IoT

How to Rapidly Prototype IoT Devices using the B-L4S5I-IOT01A Discovery Kit IoT Node This article discusses how IoT designers can rapidly prototype their products using the STMicroelectronics B-L4S5I-IOT01A Discovery Kit IoT Node. It examines the capabilities of the onboard microcontroller, the plethora of sensors and configuration options, and how to connect to Amazon Web Services (AWS) and quickly start building their prototype and end product. Author: Rolf Horn | Applications Engineer Digi-Key Electronics

As devices become increasingly connected to the Internet of Things (IoT), developers starting from scratch are realizing that it’s still not as straightforward as they would expect, particularly if schedules are tight and costs are limited. From choosing a trusted, secure, and well-supported development environment to selecting compatible software and hardware, it turns out that designing and building an IoT device still requires a wide range of skillsets. What developers increasingly need is ready access to secure solutions, cloud connectivity libraries, an RTOS, and a compatible hardware and software development platform that provides readily integrated sensors, all in one scalable package. Introduction to the B-L4S5I-IOT01A Discovery Kit IoT Node The B-L4S5I-IOT01A Discovery board is a one-stop-shop development board that can be used to prototype nearly any embedded IoT device (figure 1). The board has enough processing power, sensors, and expandability to make any embedded developer daydream about the applications they could build. The B-L4S5I-IOT01A board is based on the STM32L4S5VIT6 low-power Arm® Cortex®-M4 processor running at 120 megahertz (MHz), supported by 2 megabytes (Mbytes) of program flash 40

and 640 kilobytes (Kbytes) of SRAM. The STM32L4S5VIT6 also has features ideally suited for IoT applications such as: • A floating-point unit (FPU) • A 14-channel dynamic memory access (DMA) controller • An AES and HASH encryption hardware accelerator • Advanced graphics features • A 233 ULPMark CP energy benchmark score Processing power and energy efficiency alone do not make an excellent rapid prototype platform.

Figure 1 The B-L4S5I-IOT01A is based on an Arm Cortex-M4 processor running at up to 120 MHz with 2 Mbytes of flash memory, 640 Kbytes of RAM, wireless connectivity, and multiple sensors

The discovery board also comes with wireless connectivity in the form of an 802.11b/g/n compliant Wi-Fi module (ISM43362-M3G-L44) from Inventek Systems and a Bluetooth 4.1 module from STMicroelectronics, as well as a range of sensors. These include two MP34DT01 digital omnidirectional microphones, one HTS221 capacitive digital sensor for relative humidity and temperature, and one LIS3MDL high-performance three-axis magnetometer. The list above is by no means comprehensive: a more detailed description can be found here. Next, it’s important to examine the software tools and stacks available to accelerate development. The STM32 ecosystem The ecosystem surrounding any development board determines whether a team can create a rapid prototype or not. For example, to prototype an IoT device with the B-L4S5I-IOT01A, developers need access to a compiler, an integrated development environment (IDE), driver libraries, configuration tools, and software for firmware updates. The B-L4S5IIOT01A Discovery board supports all these needs. Many developers use Eclipse and the GNU C compiler for their development environment. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » B-L4S5I-IOT01A Discovery Kit IoT Node

STMicroelectronics provides a free tool, STM32CubeIDE (figure 2), allowing developers to write and build their software projects. STM32CubeIDE enables access through various perspectives to a software development environment, a microcontroller configuration tool, and a debugging environment. STM32CubeIDE not only provides a way to create, build and manage software projects, it also has an interface to STM32CubeMx. STM32CubeMx is a microcontroller configuration tool that enables developers to configure clock trees, peripherals, sensors, and middleware. Developers configure their settings, and then the toolchain generates the drivers and configuration files, dramatically decreasing development time and helping the developer focus on their application code and not standard infrastructure code. Beyond configuring and deploying a codebase, the STM32 ecosystem comes with several useful tools for developers working at the cutting edge. For example, developers looking to leverage machine learning in their applications can utilize STM32Cube.AI extension X-CUBE-AI, which provides teams with a streamlined framework for converting, validating, and

running inferences on the STM32. For example, developers can train a model using TensorFlow Lite and then convert the model in just a few minutes to C code that runs on the microcontroller. In addition, there are extension packs with ready to run software that includes: • FP-AI-FACEREC for facial recognition applications • FP-AI-NANOEDG1 for condition monitoring applications • FP-AI-VISION1 for image classification applications • FP-AI-SENSING1 for audio and scene classification applications Every IoT device should consider security, even during the rapid prototyping phase. Today's web is teeming with non-stop attacks, security breaches, and exploitation of business and customer data. Therefore, any fast prototyping platform should have the capability to scale into a production system efficiently. The discovery board can leverage STMicroelectronics' Secure Boot Secure Firmware Update (SBSFU) software stacks to provide developers with this capability. SBSFU is available in the X-CUBE -SBSFU function pack, which provides:

• • • •

Root-of-trust (RoT) services Secure key management services Cryptographic schemes Secure firmware update services

The ecosystem surrounding the B-L4S5IIOT01A Discovery board is rich, with many available function packs and tools to help the developer get started quickly. Many IoT developers are interested in the XCUBE-AWS package that provides everything necessary to connect to the cloud when using AWS. Let's examine how a developer would go about doing it. Connecting to the cloud To get started with the cloud, a developer needs to download X-CUBE-AWS. The software package comes as a zip file with several projects designed to run on the BL4S5I-IOT01A, such as: • Bootloader_KMS • Bootloader_STSAFE • Cloud These projects are located under: - Projects/B-L4S5I-IOT01A/Applications/ With the AWS cloud project being found under: - Cloud/aws_demos

Figure 2 STM32CubeIDE provides developers with an IDE to create, configure and manage their IoT device’s embedded software. https://international.electronica-azi.ro

IoT

Figure 3 X-CUBE-AWS provides the firmware and application examples necessary to connect to AWS and develop an IoT Thing capable of connecting to AWS. The cloud project is available for STM32Cube IDE, Keil, and IAR. Of course, a developer could port these to other IDE's, but these three are commonly used in the industry. A developer doesn't have to figure out how to get the project up and running independently. There are several valuable documents that can help them get started quickly. First, within the main project directory, there is a Release_Notes.html file. This file contains general information about the project along with limitations and valuable references. Next, there is a getting started guide that describes how to connect to AWS using the project. This document describes how to connect to AWS along with stack and software information (figure 3). The document also describes the software stacks in detail, which can help a developer understand how it is organized and the changes that will be necessary to connect the device to the cloud. The easiest way to connect to the cloud is to run through the Getting Started document and follow the tutorial. In addition to the tutorial, there are several additional reference sources developers can use to get up to speed with the software package, including: • FreeRTOS Next Steps • OTA Update Users Guide • Setting Up IoT Core Account and Credentials 42

Between these documents, developers can quickly get up and running with a cloud application that can be used as the foundation for their own IoT device application. Tips and tricks for using the B-L4S5I-IOT01A Discovery Board The B-L4S5I-IOT01A Discovery Board has many features and capabilities developers can leverage to prototype their embedded product rapidly. Below are several “tips and tricks” developers should keep in mind that can simplify and speed up their development, such as: • Take full advantage of the X-CUBE-AWS to connect to AWS easily. The software package comes with FreeRTOS already ported to the development board; developers only need to provision the device to connect to the cloud. • Carefully read through the getting started documentation. The documentation contains the steps necessary to perform a firmware update and connect to AWS. • Experiment with the example over-theair (OTA) update capabilities. The need to patch and update IoT devices in the field is a critical one. Developers should be aware of the capabilities and any limitations of secure firmware updates. • Avoid starting from scratch by leveraging STMicroelectronic's function packs, which help developers get a jump start on capabilities and device functionality. These function packs can dramatically accelerate development.

• Take the time to read through the STSAFE documentation and understand how secure elements can improve device security. Security must be built into a device from the start, so doing it during the rapid prototyping phase is a must. Developers that follow these “tips and tricks” will find that they save quite a bit of time and grief when prototyping their application. Conclusion Developing an IoT connected device from scratch still has many obstacles and pitfalls that can delay schedules and lead to cost overruns. To avoid these issues, developers can leverage the B-L4S5IIOT01A Discovery Board to prototype their connected applications rapidly. STMicroelectronics' software stacks, expansion packs, and ecosystem provide developers with a one-stop-shop to easily integrate software and accelerate implementation. The B-L4S5I-IOT01A is also fully capable of modern device needs such as cloud connectivity, secure firmware booting with OTA, and even running basic machine learning applications. ■ Digi-Key Electronics www.digikey.com

Electronica Azi International | 1/2022

Build multimedia applications simply and quickly using Mikromedia smart display development boards from MIKROE MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, is unveiling a portfolio of over 100 smart display development boards that enable multimedia applications to be built simply and quickly. The company’s mikromedia product range represents industry’s largest portfolio of smart displays and includes a wide range of sizes, styles and touchscreen options. Mikromedia TFT LCDs are offered from 2.8in diagonal (mikromedia 3 types) to 7in diagonal (mikromedia 7), with or without bezels, to suit a wide variety of microcontrollers including Microchip PIC, STMicro STM32, TI TIVA and NXP Kinetis. Devices include capacitve touchscreen functionality and DSP-powered, embedded sound CODEC IC, delivering a complete solution https://international.electronica-azi.ro

for the rapid development of multimedia and GUI-centric applications. However, mikromedia displays are not limited to multimedia-based applications only. USB connection, digital motion sensing, battery-charging capability and the inclusion of an SD card-reader broadens the wide range of applications that are supported. Standardized pin headers expose available MCU pins to the user, adding another layer of application flexibility, and by using MIKROE’s mikromedia shield products, connectivity can be further expanded using mikroBUS™ sockets, additional connectors, peripherals, and more. Comments Nebojsa Matic, CEO at MIKROE: “Mikromedia smart displays can be implemented directly into any project, with no additional hardware modifications required. For many applications, the addi-

tion of a stylish enclosure will turn a mikromedia development board into a fully functional, high-performance, feature-rich device. A choice of powerful MCU platforms provide sufficient processing power for the most demanding tasks, ensuring ﬂuid graphical performance and glitch-free audio reproduction.” MIKROE releases a new product every day at 10am, and many leading microcontroller companies including Microchip, NXP, Infineon, Dialog, STM, Analog Devices Renesas and Toshiba now include the company’s mikroBUS add-on-board standard socket on their development boards. For more information about MIKROE’s full range of over 100 mikromedia smart displays, visit https://www.mikroe.com/mikromedia. MikroElektronika https://www.mikroe.com 43

POWER

Trends within the power electronics industry in 2022 As is the case in many industries, power electronics has been affected by the Covid-19 pandemic, although we have seen a boost in new technologies and opportunities for power designers to capitalize on the benefits of E-learning. It’s always difficult to derive trends from large industries but as we get closer to APEC-2022, as a power engineer it is interesting to take a minute to ponder and consider what will contribute to making power supplies more efficient, more reliable and exciting to design. Author: Patrick Le Fèvre | Chief Marketing and Communication Officer Powerbox a Cosel Group Company

Overall trends and technology For sure the so-called ‘electrification’ and transition from fossil fuels to renewable energy is a major trend that we are all aware of. This segment will require a lot of technological innovations to reach the carbon neutral level expected by the European Commission, US DOE and similar initiatives in Asia.

If we refocus on what most of the power supplies companies are developing, I foresee those four trends and one technology development will influence the power industry in 2022: Reducing energy consumption; Power supplies becoming part of the Machineto-Machine eco-system; Enhanced energy storage solutions;

Acceleration of harvesting energy solutions, and all of them will benefit from the implementation of Wide Band Gap Semiconductors. In the quest for reduced energy consumption, from harvesting energy to the grid, the power electronics industry is permanently seeking new ways to improve efficiency.

Figure 1 Smart Power operation in Smart Factory with machine-to-machine communication 44

Electronica Azi International | 1/2022

Figure 2

PRBX S-CAP BOOST supercapacitors bank with digital control and communication interface able to deliver peak energy to load and to store backward energy

International and local regulations have forced power supply manufacturers to innovate but we are seeing more stringent regulations under discussion that might require the power industry to explore new topologies, components and materials. I would like to illustrate that trend with one example that will include and benefit from them, E-commerce. E-commerce was already growing before Covid-19, but as consequence of curfews, working at home, and the drastic reduction of physical interaction, it has grown exponentially, putting a high demand on shipping hubs, computerized storage and the overall supply chain. Before we even mention the associated datacenters required to manage the E-commerce process, shipping hubs and warehouses have become gigantic and consume lots of energy. Making handling and shipping hubs more energy efficient has been on the agenda for all the major players, though the 2020-2021 peak on demand was a strong a signal for them to reconsider the way to use and manage energy. https://international.electronica-azi.ro

Power supplies as such are not consuming most of the energy, but when considering their strategic position in the operational chain they become a key-point in the overall process to optimize how energy is used in the complete chain. In 2022 we will see very advanced power supplies used in E-commerce handling and shipping hubs. They will not only integrate higher levels of communication, but are able to store and restore energy from supercapacitors banks, reducing peak disturbances on the grid and consumption. Already experimented with in 2021, the power supplies have been integrated into a complete eco-system with Machine-toMachine communication (figure 1). They not only deliver power to a load e.g. conveyor motors, but they are able to sense and adjust the level of energy to store in local supercapacitors bank (figure 2). Almost invisible, from the RFID inserted in the shipping box that will get power from RF signals, to sensors placed on motors or moving elements powered by vibration, micro-systems powered by harvested

energy are developing very fast. Here also, the nanotechnology such as nanotubes make it possible to develop very small supercapacitors storing enough energy to power sensors and transmitters. To make that possible the implementation of digital power and communication is a must, but the level of performance will require power electronics engineers to design new power solutions with the so called ‘Wide band gap’ semiconductors. Depending on the application and voltage they will select GaN or SiC types but the benefits of WBG will contribute to making E-commerce more energy efficient and to a lowering of the CO2 footprint. Critical building blocks! For decades, improvements in energy efficiency levels of power supplies have been made possible by technological evolutions. Moving from linear to switching technology was probably the major one, followed by a number of more minor leap-frogs until digital power came to market. 45

POWER

Despite it having been on the market for several years, with the emerging WBG technology and the possibilities offered by those components, digital control becomes an absolute MUST and I strongly believe that will be a major building block for power designers when developing new products.

nology. Not all power supplies require megahertz switching but considering the constant quest for smaller power supplies with higher efficiency, power designers will have to consider new types of transformers and new winding techniques. In that respect they will be helped by ferrite manufacturers develop-

Figure 3

PRBX multi-cores auto-tuned power converters with advanced digital control and GaN FET transistors

Component wise, the WBG transistors are without doubt the ones that will prevail in 2022. That said, conventional Power FETs are also making big progress and power designers will have to achieve new levels of business assessment and acumen when selecting the most appropriate technology for their applications.

ing new materials but also by Artificial Intelligence software shortening time to design and test new transformer types (e.g., Frenetic, Simba). One specific example of that is research we are currently conducting at PRBX, combining digital control, GaN, and multicore transformers with advanced wiring

extremely wide input voltage ranges, as well as outputs subject to repetitive peak loads. Final products is not ready yet but it will not be possible without the combination of digital control, WBG and advanced magnetics (figure 3). I believe many of the new products that we will see in 2022 and onwards will be based on those three building blocks, which I’m sure will also include more communication to become part of a Machine-to-Machine ecosystem. In WBG we trust! What is interesting with the Wide Band Gap semiconductors is that we see a similar situation to when the first power MOSFETs were launched. Some immediately considered the benefits of the WBG, and that despite early products not being very user friendly due to them being based on a depletion mode that requires very specific drivers, it didn’t take too long for power semiconductors manufacturers to provide ‘easyto-use’ solutions. It is now more than five years since manufacturers were promoting the benefits of that technology but if the Go To Market is ready, the Go To Application for mass users is requiring a certain amount of time. We are all familiar with the ‘camel-back’ curve reflecting new technology adoption and crossing the chasm. Experienced power designers have crossed that technological chasm many times, with the latest one being the migration from analog control to digital, and it taking more than 10 years to reach a significant level of adoption (figure 4). In the case of WBG – and especially Gallium Nitride (GaN) – early adopters entered the fray much quicker than some predicted a few years ago. It is no surprise that the PC and Mobile/Nomad industries were some of the early adopters.

Figure 4

Experienced power designers have crossed that technological chasm many times, with the latest one being the migration from analog control to digital

The third building block I foresee as important is the advanced planar transformer with interleaved multi-core tech46

and auto-tuned performance within the wide operational range that we see in some industrial applications that require

The number of USB-C chargers using GaN semiconductors announced in 2020-2021 is very impressive. Particularly worthy of mention is Navitas’ next-generation GaN Fast power IC that will drive the 120W ultra-fast charger supplied ‘in-box’ with vivo’s iQOO-brand flagship iQOO 9 Pro mobile phone, demonstrating the rapid adoption of GaN by the ‘nomad’ industry. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Trends within the power electronics industry

But not just its electrical performance, using GaN reduces the physical size by 26%, reaching a stunning 1.3W/cc power density, which is quite incredible (figure 5). If it took 10 years for digital power to become a de facto technology, it took only five years for WBG to reach a similar level.

Many companies have taken that as an opportunity for their power designers to attend online training, and as a result some power-semiconductor companies have reported shipping up to 10 times more evaluation kits than before the pandemic days.

If we simplify the market into two segments: High voltage (using SiC) and Low voltage (using GaN), we see two different patterns. High voltage applications e.g. electric vehicles and solar are familiar with SiC transistors, and for that segment it is no big revolution for power engineers to undergo a learning phase for the relatively new low voltage technology. In conclusion In many different ways we have all been affected by the pandemic, although looking back it has contributed to boost new technology learning and to speed innovation. Considering all of that, 2022 will be a very important year for WBG and we can expect many new power supplies (AC/DC and DC/DC) to be announced during the year. 2022 will be a very exciting year for all us designing power solutions.

Figure 5

Navitas’ next-generation GaNFast power IC that will drive the 120W ultra-fast charger, contributing to reduce its size by 26%

What is interesting in the development of the WBG semiconductors is that due to the specificity of this technology, that’s very low internal resistance and ability to switch very fast, the packaging is very important and we see a lot of innovation from manufacturers to offer optimized solutions. Technology wise the Efficient Power Conversion (EPC) approach is very interesting, minimizing interconnection losses, and making it possible to shrink a power converter to an unprecedented size (figure 6). Something to mention is the amazing number of technical webinars proposed during the Covid-19 era, not to mention the virtual APEC-2021.

Figure 6 Efficient Power Conversion (EPC) approach is very interesting, minimizing interconnection losses, and making it possible to shrink a power converter to an unprecedented size

About the author: Chief Marketing and Communications Officer for Powerbox, Patrick Le Fèvre is an experienced, senior marketer and degreequalified engineer with a 35-year track record of success in power electronics. He has pioneered the marketing of new technologies such as digital power and technical initiatives to reduce energy consumption. Le Fèvre has written and presented numerous white papers and articles at the world’s leading international power electronics conferences. These have been published over 350 times in media throughout the world. He is also involved in several environmental forums, sharing his expertise and knowledge of clean energy. ■ Powerbox www.prbx.com

References • Powerbox (PRBX): https://www.prbx.com/ • Navitas Semiconductors: https://navitassemi.com/ • Efficient Power Conversion (EPC): https://epc-co.com/epc • Frenetic: https://frenetic.ai/ • SIMBA: https://simba.io/ • Applied Power Electronics Conferences (APEC): https://apec-conf.org/ https://international.electronica-azi.ro

Oscilloscope with test setup Image source: Würth Elektronik

How to Achieve Test Goals Würth Elektronik joins Oscilloscope Days 2022 As a partner of Rohde & Schwarz, Würth Elektronik is involved in organizing their Oscilloscope Days on Wednesday April 27 and Thursday April 28, 2022. In the popular free online event, Rohde & Schwarz and partner companies will offer application-oriented presentations via live stream. The focus will be on challenges that electronics engineers face when using test and measurement equipment such as oscilloscopes. The webcasts will be streamed in English, French, German, Spanish, and Portuguese. 48

Robert Schillinger, Field Application Engineer, will represent Würth Elektronik eiSos with his presentation, “Which RF Effects Need to be Considered in the Measurement and Design of Widebandgap Semiconductor-Based Power Systems?”. The presentation will focus on power electronics utilizing SiC and GaN transistor technology, a topic being researched for many years at Würth Elektronik. Schillinger will share with Oscilloscope Days participants the latest findings on fil-

tering gate drivers. Other topics at the event include the selection of suitable measurement equipment, jitter analysis, signal integrity, and EMC troubleshooting. For more information, visit: https://www.rohdeschwarz.com/de/knowledgecenter/webinars/webinar-oscilloscopedays_255400.html Würth Elektronik eiSos https://www.we-online.com Electronica Azi International | 1/2022

Murata partners with Ignion to help accelerate and simplify IoT design Murata has entered into a technology partnership with antenna manufacturer Ignion. This will see Murata components used as a foundation for development using Ignion’s Antenna Intelligence Cloud. The new online service offers the designer an antenna cloud computing and artificial intelligence service by enabling IoT developers to integrate Virtual Antenna® correctly and quickly into their own products. The solution uses machine learning to create a realistic simulation of the real-world performance of the end-device, providing accurate and reliable design support for the IoT ecosystem. The high Q values and tight tolerances of Murata’s ceramic capacitors and RF coils will be pivotal to Ignion’s cloudbased service, facilitating a more reliable and predictable antenna integration process. The proven technology helps optimize RF performance of the connected devices, substantially reducing development costs and shortening the time-to-market. “We are excited to see our technology contribute to the antenna revolution that Ignion is driving,” said Takayuki Kaneko, Strategic Marketing, Product Marketing Unit of Murata. “This partnership proves that we can provide the IoT industry with the tools needed to enhance the development and manufacture of the necessary devices, enabling them to create much closer approximations to early-stage simulations.” Ignion has developed the Antenna Intelligence Cloud service to fuel innovation and versatility in the design of IoT endproducts. It leverages advanced simulation with machine learning, removing the need to initiate the development of physical hardware. The solution helps developers meet the evolving requirements of 5G, Wi-Fi 6E, LoRaWAN and UWB, as well as devices with multiple radios. Jaap Groot, CEO at Ignion, commented: “This partnership allows us to provide an accurate and predictable Virtual Antenna™ design that IoT makers can easily replicate and implement in their hardware designs, eliminating delays in the design phase.” ►Murata | https://www.murata.com ►Ignion | https://ignion.io 50

Rutronik presents innovative solutions for IIoT and IoE from leading manufacturers and own developments at Sensor+Test 2022 Innovative solutions for intelligent applications in the areas of Industrial Internet of Things (IIoT) and the Internet of Everything (IoE) are the focus of Rutronik Elektronische Bauelemente GmbH’s exhibition stand at Sensor+Test 2022 (May 10-12, 2022). In addition to leading manufacturers such as Melexis, TDK Micronas, Diodes Inc, Kemet, RECOM, Bosch SE, Infineon, and ams OSRAM, Rutronik System Solutions also introduces in-house developed boards in Hall 1, Stand 320. Sensor+Test is back as a presence event and so is Rutronik. In Hall 1 at Stand 320, the worldwide distributor presents its varied product portfolio in the areas of sensor, measurement, and test technology. Participating companies include Melexis, TDK Micronas, Diodes Inc, Kemet, RECOM, Bosch SE, and Infineon. Also represented is ams OSRAM, a sensor solutions supplier whose franchise agreement was recently extended to the EMEA region. “Our diverse sensor and wireless portfolio enable the development of advanced applications in the areas of IIoT and IoE. It is one of the future markets and opens up increased efficiency and great growth opportunities for companies through smart connectivity. Electronica Azi International | 1/2022

PRODUCT NEWS

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New versions of the SEN5x environmental sensor node now available With the innovative components of our suppliers combined with our expertise, we can create needs-oriented solutions. Visitors to the exhibition can convince at our stand”, explains Markus Balke, Senior Manager Product Marketing Sensor Power Analog at Rutronik. Proof-of-concepts from Rutronik System Solutions for faster time to market The R&D capacities of the distributor are bundled under Rutronik System Solutions. Using the most advanced components and specially developed boards, solutions meet complex challenges. Rutronik System Solutions presents the RDK2, RAB1 – Sensor Fusion, and RAB2 – CO2 boards at the exhibition. “With our proof-of-concepts, we demonstrate to visitors unique solutions that enable us to shorten the timeto-market in dynamic industrial environments. Customers gain the necessary scope for decision-making in the research and pre-development phase and time advantage over competitors,” says Stephan Menze, Head of Global Innovation Management. Further highlights at Sensor+Test: • The BMP581 pressure sensor and the BME688 4-in-1 environmental sensor from Bosch Sensortec, which were first released at Sensor+Test. • Two-wire switch for seat belt applications from Diodes Inc. • Vibration sensor for predictive maintenance applications from Kemet • 14 channel multispectral sensor from ams Osram • The best CO2 sensor on the market in terms of size and accuracy from Infineon • Low power Cellular IoT & Bluetooth LE solutions from Nordic Semi, InsightSIP, Panasonic, and Murata • Automotive and electromobility solutions from TDK Micronas • 1200 W power supply in a 19″ rack from Recom • Smart Home and Security solutions from Melexis and EnOcean • PoE Sensor Net & Wireless solutions from Telit and Kontron ►Rutronik | https://www.rutronik.com https://international.electronica-azi.ro

Sensirion presents its SEN50 and SEN55 environmental sensing solutions for measuring relevant environmental parameters. The SEN50 and SEN55 environmental sensor nodes serve as a straightforward sensor solution platform whose simple integration can reduce time-to-market and cut costs for manufacturers of indoor air quality solutions. Indoor air pollution inside buildings such as workplaces or homes can be harmful to breathe in and can lead to long-term health issues. Air pollution in enclosed spaces not only comes from outside air but can also be released by sources such as cleaning products and cooking. It is therefore important to maintain good indoor air quality in order to have a healthy and safe environment. Inadequate ventilation and a lack of air purification can lead to higher levels of indoor pollutants. Monitoring environmental parameters can help to indicate when ventilation or air purification is necessary by reporting the levels of relevant pollutants. Sensirion’s environmental sensor nodes are designed for use in indoor air quality applications. The SEN50 environmental node is part of the SEN5x series and represents a straightforward sensor solution platform for the accurate measurement of particulate matter. In addition to particulate matter, the SEN55 is able to detect other environmental parameters, such as volatile organic compounds (VOCs) and oxidizing gases (NOx), as well as humidity and temperature. Sensirion’s algorithms enable straightforward integration into various applications. The implemented engine known as Sensirion Temperature Acceleration Routine (STAR) accelerates the device’s response to ambient temperature changes by a factor of two to three. This, together with a temperature compensation engine, provides a better user experience and more accurate measurements to end-users. Device manufacturers therefore save valuable project time and personnel resources. End customers receive reliable air quality measurement and can benefit from an improved indoor environment with better health and comfort. “Built on highly reliable and advanced environmental sensors, Sensirion has developed the SEN5x environmental sensor node to provide a fast and straightforward integration into indoor air quality applications. With the SEN50 and SEN55, we offer new versions to fulfill our customers’ needs and continue our efforts to lead the journey in environmental sensing solutions,” says Antonio Rubino, Environmental Sensor Node Product Manager at Sensirion. ►Sensirion | https://www.sensirion.com 51

Performance Meets Customer Service Mouser Electronics Signs Global Distribution Agreement with ISI to Deliver High-Performance PCIe XMC Modules Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, announces a new distribution agreement with Interconnect Systems International (ISI), a Molex company and leading supplier of signal processing and data acquisition solutions. ISI’s hardware, software and FPGA IP design teams provide innovative products that enable faster, more intelligent systems. Through the agreement, Mouser now offers ISI PCI Express XMC modules, including the XU-AWG, which features two 8lane, high-speed serial links that support PCIe Gen 3. The XUAWG XMC card boasts two 16-bit Analog Devices AD9162 digital-to-analog converter (DAC) devices with standard operation at a 5 GSPS update rate. The module supports 1x to 24x interpolation with sub-nanosecond channel-to-channel synchronization alignment. Inputs to support external clocking and triggering are provided for synchronization across multiple modules for scalable RF channel count. A Xilinx Kintex® Ultrascale XCKU060 FPGA with 4 GBytes of DDR4 RAM memory supports the high-performance DSP core for demanding applications such as radar and wireless IF generation. Mouser also offers the XA-160M PCI Express XMC module for high-speed stimulus-response, ultrasound, and servocontrol applications. The module features two 160 MSPS, 16-bit ADC inputs and two 615 MSPS, 16-bit DAC outputs. The PCIe interface features a flexible and expandable data packet system with data rates up to 1600 Mbytes per second (Mbps). An array of internal and external clocking and triggering modes provides application flexibility and multimodule scalability. A Xilinx Artix®-7 FPGA device supported by 256Mx16 memory provides data acquisition control, signal processing, buffering, and system interface functions. Using the FrameWork Logic toolset, the XA-160M logic can be fully customized using VHDL and Simulink platforms. The ISI PCIe XMC x8 lane adapter allows a single-width XMC module to be used in a PCI Express slot. The XMC module is compatible with VITA 42.3 and supports up to eight PCI Express lanes. The adapter is completely transparent to PCI Express, with all signals from the PCI Express host bus connected directly to the XMC module.

Würth Elektronik, manufacturer of electronic and electromechanical components, will be exhibiting at PCIM, May 1012, 2022 (Nuremberg Convention Center, NCC, Hall 6, Booth 402). In keeping with the focus of the event, the manufacturer will be presenting its power electronics highlights. Würth Elektronik employees will also participate with two presentations at the trade show conference. With 500 exhibitors from around 30 countries, PCIM (Power Conversion Intelligent Motion) Europe is the pioneering international trade show and conference for power electronics, intelligent drive technology, renewable energy and energy management. Participation is possible in person or online. “For the first time since the outbreak of the pandemic, we will be represented live at a major trade fair in Germany,” Alexander Gerfer, CTO at the Würth Elektronik eiSos Group is delighted to announce. “The power electronics elite gathers in Nuremberg. This exhibition is the ideal platform for us to present our product portfolio and meet our customers.” Plenty of time to chat Technical specialists at the booth will provide plenty of opportunities for in-depth discussions. Not only visitors stand to profit. “It’s also important for us to keep our ears open and pick up ideas from our customers’ practical experience,” Gerfer stresses. “We see ourselves as technology enablers.” Which is why Würth Elektronik’s products are available from stock in any quantities and without minimum order quantities. There are also free samples for most products, which are delivered in 1-2 days. The Power Magnetics product group ranges from inductors, chokes and transformers to coils for wireless energy transmission Image source: Würth Elektronik

Würth Elektronik offers a wide range of solutions for heat dissipation. Image source: Würth Elektronik

To learn more about the ISI products available from Mouser Electronics, visit https://www.mouser.com/manufacturer/isi/. ►Mouser Electronics | https://www.mouser.com 52

Electronica Azi International | 1/2022

Digi-Key Electronics and Phoenix Contact to Host Data Connectors Webinar

Würth Elektronik will be presenting highlights from its product portfolio at the trade fair stand energy transmission Image source: Würth Elektronik

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Phoenix Contact on Tuesday, April 26, at 11 a.m. CDT titled “Connect. Network. Evolve. Phoenix Contact’s Data Connectors.” The webinar will be presented by Guadalupe Chalas, Phoenix Contact senior marketing specialist with a focus on data products. The world is becoming increasingly networked, which means more interfaces per device. This webinar will give attendees an understanding of Phoenix Contact’s versatile data connectivity portfolio for numerous applications within the device, inside the cabinet, and out in the field – from RJ45 through USB, HDMI, and D-SUB to coaxial and FO connections as well as SPE. This data connectors webinar will cover the following topics: • The benefits of using terminal blocks for ethernet applications • Why SPE and RJ45 can enhance device connectivity • How board-to-board products can enable high-speed board connectivity • Device connectivity and cabling solutions for data transmission “Phoenix Contact delivers on high-performance data connectors that provide versatile connection solutions for numerous applications,” said Eric Halvorson, partnership marketing manager – strategic programs at Digi-Key. “We’re excited to partner with them on this webinar to share with our customers and partners what this extensive portfolio of connectors for data transmission are capable of.”

A place for interesting technical discussions: the Würth Elektronik trade fair booth Image source: Würth Elektronik Interesting contributions Würth Elektronik supports PCIM with its Silver Partnership. Another highlight: Product experts will participate at the trade show conference with the following presentations (May 11, 2022, 3.00 to 5.00 pm): • Antonio Alccaria: Study of Combined Solutions for Thermal Management and Electromagnetic Shielding: Shielding Cabinets, EMI Absorbers and Thermal Gap Fillers • Christian Merz: Mathematical Model of the Temperature Rise of a Wireless Power Transfer Coil in DC Operation ►Würth Elektronik eiSos | https://www.we-online.com https://international.electronica-azi.ro

“Phoenix Contact offers reliable connectivity for any need, with solutions that support both traditional networking applications and new technologies that further enable industry 4.0 and IIoT,” Phoenix Contact’s Guadalupe Chalas said. “We continue to evolve with our customers by launching solutions like SPE and APL to meet the networking connectivity needs of devices in harsh industrial environments.” Chalas has an extensive background in the design of highspeed interconnects for automotive applications. She has three patents in connector design, and has held roles in R&D, product development and product management for automotive and industrial high-speed connectivity solutions. To attend the webinar, submit a registration form. If you can’t attend the live webinar, Digi-Key will send the recording after the event to those who register. For more information about Phoenix Contact and to order from their product portfolio, visit the Digi-Key website. ►Digi-Key Electronics | https://www.digikey.com 53

Smart lighting The basis for the central nervous system of buildings Modern building management systems can make a decisive contribution to greater energy efficiency and comfort. Smart lighting systems form the basis for a kind of central nervous system. Bluetooth usually forms the “neural pathways,” but other wireless standards also offer advantages. Smart lighting is one of the largest market sectors for Bluetooth: according to the “2021 Bluetooth Market Update” by Bluetooth SIG (Special Interest Group), 27% of shipped Bluetooth devices are already used for smart lighting. This puts them in second place behind smart appliance applications (35%), but they are growing faster than they are. Author: Kerstin Naser | Product Sales Manager Wireless Rutronik

There are good reasons for this: connected lighting with a smart control can reduce energy costs by around 70 to 75%. At the same time, comfort levels are increased, for example by allowing users to change the colors of the light as desired or by automatically adapting the light to natural daylight (Human-Centric Lighting, HCL). This lighting concept provides a light spectrum that transitions from high blue components in the morn54

ing, which have an invigorating effect, to more red components in the evening, which have a calming effect. Furthermore, presence detectors can be used, for example. Depending on whether someone is in the room or not, the light can be switched on or off automatically. Automatic switching based on the existing intensity of illumination or ambient light in a room is also possible.

Lighting is everywhere Lighting is utilized virtually everywhere in a building. This makes it the obvious foundation for the infrastructure of new building management approaches, since the wireless technology integrated into the lighting control devices can also be used for numerous other applications. Bluetooth SIG predicts that by 2029 commercial connected lighting will generate $19.1 billion in global revenue. Electronica Azi International | 1/2022

DESIGN SOLUTIONS » Modern building management systems

Together with the DALI (Digital Addressable Lighting Interface) Alliance, Bluetooth SIG has defined a gateway that allows D4icertified luminaires to be monitored and controlled via Bluetooth Mesh. This way, lighting components from various suppliers can understand each other and interoperate smoothly. Going beyond illumination, indoor location asset tracking or indoor navigation can, for example, be implemented using smart lighting. Objects that are to be tracked must be equipped with a beacon. The wireless transceiver in the luminaires receives its data signal as soon as the object is within range. The position of the object can then be derived using the building floor plan. This is particularly useful in warehouses or large factories, where it significantly reduces search times. Processes can thus be optimized and costs reduced. In hospitals, tracking can substantially contribute to increased speed and quality by easily locating mobile health-care equipment or hospital beds. Networked via Bluetooth Bluetooth Mesh is used by most smart lighting systems for reliable and secure communication. This allows the low power consumption rate and the low latency of Bluetooth Low Energy (LE) to be used for systems where hundreds or thousands of devices from various suppliers need to communicate with one another. Bluetooth Mesh uses the so-called flooding principle, which ensures messages reach their destination. This is possible as all the network participants can communicate directly with one another – and if one participant should fail, the message is transferred on via another route. In addition, smartphones can also be integrated into a BLE or mesh network with a corresponding app, thus enabling the switching of luminaires without a gateway or an Internet connection. Bluetooth Mesh is supported, for example, by powerful multiprotocol SoCs from Nordic Semiconductor’s nRF52 and nRF53 series. In combination with the nRF21540, users can enjoy a 16× range extension. The nRF5340 is equipped with two Arm Cortex-M33 processors. The application processor is optimized for performance and can be clocked at either 128 or 64 MHz, has 1 MB Flash, 512 KB RAM, a floating-point unit (FPU), an 8 KB two-way assohttps://international.electronica-azi.ro

ciative cache, and DSP instruction capabilities. The network processor is clocked at 64 MHz and is optimized for low power and efficiency (101 CoreMark/mA). It has 256 KB Flash and 64 KB RAM. In addition to Bluetooth LE and Mesh, the nRF5340 also supports NFC, Thread, and Zigbee. It offers high-speed SPI, QSPI, USB, and an operating temperature of up to 221° F (105 °C). Numerous suppliers offer modules based on these SoCs from Nordic Semiconductor. Many already have integrated antennas and are pre-certified for the key markets (CE, FCC, IC). As such, they help to shorten development time and reduce costs. Figure 1

This applies, for example, to the ISP series from Insight SiP, the PAN1780 and PAN1781 modules from Panasonic, the MBN52832 from Murata, and various modules from iVativ and EnOcean. The ISP family from Insight SiP is characterized by its small form factor, which makes it particularly suitable for use in lighting applications. The modules are based on various Nordic ICs and can be exchanged easily thanks to pin compatibility. The Panasonic PAN1780 module is based on the Nordic nRF52840-IC. Due to the integrated Arm Cortex-M4F with 1 MB Flash and 256 kB RAM, the module can be used in stand-alone mode, which helps to save costs and space. The PAN1781 is based on the Nordic nRF52820, which has 256 kB Flash and 32 kB RAM, and supports angle of arrival (AoA) and angle of departure (AoD)

of version 5.1 of the Bluetooth Core Specification, so-called direction finding. This Bluetooth standard thus enables even more precise positioning. The SX-ULPGNBTZ module from Silex is based on the Qualcomm QCA4020 System-on-Chip (SoC). With dual-band 802.11 a/b/g/n Wi-Fi, Bluetooth LE and 802.15.4 connectivity (Zigbee, Thread Pro R21), it is also ideal for lighting and many other applications. The supplier Cypress/Infineon also offers Bluetooth Mesh chips and modules suitable for lighting applications, for example the CYW 20706 IC or the CYBT-343026-01 module, which is based on the CYW20706 IC. Bluetooth SIG and DALI have defined a standardized gateway for controlling D4i luminaires via Bluetooth Mesh.

Other wireless standards In addition to Bluetooth LE and Bluetooth Mesh, other wireless standards are also common for smart lighting applications, such as the EnOcean standard, Thread, Zigbee, or Wi-Fi. The advantage of Wi-Fi compared to Bluetooth is its significantly higher range. However, the resulting higher power requirement is perhaps also the biggest disadvantage of this technology. In addition, integrating luminaires into a Wi-Fi network is somewhat more complex, as a password and SSID (Service Set Identifier) must be entered for each luminaire. And a Wi-Fi network can reach its limits when lots of luminaires are connected. 55

SMART LIGHTING

Zigbee can be used to create a large, robust mesh network. If a participant in the network fails, the information can be forwarded via an alternative route and is thus not lost. To set up the network, a bridge or hub is also required, which is connected to the WLAN router. The bridge or hub sends the (on/off) command to the luminaires via Zigbee. Unlike Bluetooth Mesh, data transmission is routed as varying tasks are assigned to the individual devices (coordinator, router, and end devices). This means that a certain path is specified for the data through the network.

short telegrams. There is little collision probability within a network, thus enabling a large network of sensors. Further, there is no interference with DECT or WLAN. The use of a rolling code and 128 AES encryption ensures advanced data security. Inside buildings, the EnOcean wireless standard achieves a range of up to 30 meters. Figure 2

Conclusion Be it Bluetooth, Bluetooth Mesh, EnOcean, WLAN, Thread, or Zigbee – all wireless standards have their specific advantages and disadvantages and which one is best suited for the relevant application needs to be decided individually.

Thread works in a similar way to Zigbee: here too, data distribution is routed, i.e. via a predefined path. Thread is a mesh protocol based on IPv6. This makes it relatively easy to integrate it into larger IP networks. The Thread protocol is also supported by the Nordic ICs and forms a perfect basis for Thread-based application layers such as Matter, HomeKit, DALI+, KNX IoT, OCF, etc.

The multisensor STM 550 from EnOcean for home automation and IoT applications is self-powered thanks to energy harvesting.

The EnOcean sub-GHz wireless standard (868 MHz according to RED specification, 902 MHz according to FCC/IC specification, 928 MHz according to ARIB specification) offers high reliability by sending

The supplier EnOcean is particularly well known for its energy harvesting technology. It offers maintenance-free wireless sensors based on the EnOcean wireless standard as well as with Bluetooth and Zigbee.

The new STM 550 IoT multisensor (figure 2) provides status information (open/closed) thanks to a magnetic contact and can measure temperature, humidity, acceleration/orientation, and illumination. The integrated solar cell produces enough energy for the measurements and to transmit the measurement data via Bluetooth, Zigbee, or the EnOcean standard, for example.

One thing applies to all though: they form the central nervous system for smart home lighting and thus for greater efficiency, convenience, comfort, and extensions, e.g. to include a navigation and tracking system. ■ Rutronik www.rutronik.com

Electronica Azi International | 1/2022

PRODUCT NEWS

Bosch barometric pressure sensor raises the bar for accuracy and performance in mobile devices BMP581 combines highest precision and low power consumption to enable fitness tracking, indoor localization and more

Compared to BMP390, the previous generation of Bosch barometric pressure sensors, the BMP581 draws 85% less current, noise is 80% lower, and TCO is reduced by 33%. Typical current consumption of just 1.3 μA at 1Hz substantially extends battery life, while the deep standby mode draws only 0.5 μA. The sensor provides an I2C, I3C and SPI (3-wire/4-wire) digital, serial interface. The BMP581 is provided in a compact 10pin LGA package shielded by a metal cover, measuring just 2.0 × 2.0 × 0.75mm3. Virtual unveiling event: Watch the video to find more detailed information and application examples for the new sensor and to get an insight into the product’s development. https://www.boschsensortec.com/unveil/event/

Bosch Sensortec introduces the BMP581, a barometric pressure sensor that couples low power consumption with extreme accuracy to provide altitude tracking in wearables, hearables or IoT devices. This capability makes it ideal for applications such as fitness tracking, fall detection, indoor localization and navigation, enabling new use cases that were previously impossible. “Building on the excellent performance and low power consumption of previous generations of Bosch sensors, our new BMP581 now delivers an entirely new level of accuracy”, says Dr. Stefan Finkbeiner, CEO at Bosch Sensortec. “It’s breathtakingly accurate: it can measure a barometric pressure fluctuation that’s equivalent to one-thousandth of the weight of a mosquito (7.6 μg).” This extreme level of accuracy enables the sensor to detect an altitude change of just a few centimeters. It can, therefore, monitor movement in fitness applications down to the level of individual pull-ups or push-ups, and can provide highly accurate location information for indoor localization, navigation, and floor detection to provide key data for emergency call requirements (E-911). The sensor can noticeably improve flight stability and landing accuracy in drones, and help detect water levels in household appliances to avoid flooding. Low power consumption coupled with high accuracy The BMP581 provides an excellent relative accuracy of ±0.06 hPa and a typical absolute accuracy of ±0.3 hPa. https://international.electronica-azi.ro

Full accuracy is available over a wide measurement range from 300 hPa to 1100 hPa. The BMP581 has a typical temperature coefficient offset (TCO) of just ±0.5 Pa/K and low RMS noise of 0.08 Pa @ 1000 hPa (typical). Long-term drift over 12 months is only ±.1 hPa.

Availability: The BMP581 is available now and offers a strong price-performance ratio.

Bosch Sensortec https://www.bosch-sensortec.com 57

Cube Encoders from POSITAL: Updating an Old Industry Favorite Dynamic Response in a Rugged Package Cube encoders – incremental rotary encoders with a cube-shaped housing – have been popular with machine builders since the 1960’s, largely because these devices are easy to install without special mounts or brackets. Now POSITAL has updated this old favourite with new features and capabilities that will keep this design relevant for years to come. ■ Simple Installation – No Special Mounts or Brackets Needed ■ Robust Housing Tolerant of Shock and Vibration Loading ■ Programmability of Incremental Interfaces and Resolution via UBIFAST Configuration Tool ■ Cost Effective Solution for Accurate Positioning ■ Easy Drop-In Replacement

POSITAL cube encoders are built around the company’s versatile magnetic measurement platform. The measurement module inside the cube provides high levels of accuracy and dynamic response in a rugged package that is tolerant of shock and vibration loading, dust and moisture. Best of all, these measurement modules are programmable. Resolution (number of pulses per revolution) can be set anywhere from one to 16,384 pulses per revolution (PPR) by simply updating the devices’ software, with no changes to mechanical components. Similarly, pulse direction and the output driver – either Push-Pull (HTL), RS422 (TTL) or Open Collector (NPN) – are defined through software. Device programmability is especially significant for distributors, system integrators or machine builders since it helps them control inventories. With programmable devices, they can hold a relatively small stock of ‘standard’ models and set them up for specific applications on an as-needed basis. When restock is necessary, POSITAL’s international production system can deliver product anywhere in the world in a matter of days at highly competitive prices. Simple and Cost Effective Replacements: POSITAL’s cube encoders are designed to be used as drop-in replacements for traditional cube designs, with identical mechanical dimensions and interfaces. This makes them a cost-effective replacement for older units that have failed or become unreliable. They are also a versatile choice for new machines, retaining the easy-to-install characteristics of the original design, while introducing up-to-date levels of performance and durability. https://www.oboyle.ro

Pressure transmitter Prignitz SPT-Ti with Titanium measuring cell ■ No seal required ■ Extremely robust ■ Long-term stability

■ High chemical resistance ■ Insensitive to overload conditions

The piezoresistive semiconductor measuring cell of the industrial pressure transmitter SPT-Ti is made of titanium and based on a silicon on sapphire technology making it absolutely vaccum tight. Leakage of internal sealings due to material fatigue is ruled out right from the start. It does not contain any disturbing pressure transfer fluids and no large pressurized surfaces. Connection to the connecting pins is made by gold bonding making it absolutely sturdy even in case of low temperatures, shocks or vibrations. Signal processing of the measurement bridge is effected by a mixed-signal ASIC. Titanium offers a whole range of benefits. The sturdy oxide layer provides high corrosion resistance. Moreover, titanium has got an enormous strength at a relatively low density and can be used for pressure ranges up to 5,000 bar in the long term. Thanks to the oustanding thermal characteristics and resistance of titanium the SPT-Ti can be used in high-temperature applications with medium temperatures up to 200°C. ■ ■ ■ ■

2.5 bar up to 5000 bar Relative pressure, absolute pressure, sealed reference (0) 4 ... 20 mA, 0 ... (5)10 V, radiometric and more ISO 4400, M12x1, cable and a lot more

■ ■ ■ ■

medium-contacted parts made of titanium Precision < 0.5 % FS (setting of limit value) Response time < 1 ms Medium temperature up to 200°C https://www.oboyle.ro Electronica Azi International | 1/2022

25 years

The new ODT 3C

All-rounder for detecting and measuring

In many industrial processes, it is not only important that an object is present, but also that it is in a specific position or on the conveyor belt at a specific distance from the machine. Even checking whether an object is separate or lying on top of another object on the conveyor belt can be crucial for the subsequent (packaging) process steps. To perform these tasks with a single sensor, the sensor must supply both switching and measuring information to the machine control. We have achieved this with the development of the new ODT 3C. The ODT 3C is both a switching and a measuring sensor. This makes it ideal for applications that involve both detection and measurement tasks. As a result, our customers can now perform these tasks easily and effectively with a single sensor. Advantages for you ■ 2-in-1 sensor: Detection and measurement tasks solved by a single sensor ■ Measurement value transmission in the process data with IO-Link ■ Range adjustment via the teach button, cable or IO-Link ■ Excellent black-and-white behaviour (< ± 3 mm at 150 mm) ■ The advantage of a sensor with IO-Link: Extensive diagnostic data from the device, e.g. temperature value, signal quality and warning ■ Remote setting: Range adjustment with numerical entry via IO-Link (e.g. 100 mm) ■ The devices have two independent switching outputs (OUT1 and OUT2) ■ Active ambient light suppression: No faulty switching despite direct light from LED hall lighting ■ Models available with warning output (as OUT2) ■ IO-Link models with Smart Sensor Profile acc. to Ed. 2 V1.1 (2021) ■ Protection against tampering thanks to lock for the operational controls ■ Status LEDs visible from all sides ■ Device-specific IO-Link function modules available for Siemens, Beckhoff, Rockwell, etc. 60

Applications Dough loop control in the baking industry

Requirement: In the food industry, a machine rolls out dough that is later processed into baked goods. This machine rolls out the dough precisely to the required thickness. While being transferred to the conveyor belt, the dough must retain its shape. Sensors are needed to monitor this. The measured variable is the distance between the dough and the sensor, which must always be between 100 and 120 mm. Solution: The new sensor ODT 3C is positioned at the outlet of the rolling machine above the dough loop and points from above at the surface of the dough, which has been pressed by the machine, to supply a distance value to the superior PLC. The goal is to regulate the dough within an optimum distance range of 100–120 mm. If the sensor detects a measurement value outside this target range, the conveyor belt motors adjust the speed of the conveyor accordingly. The measurement value is evaluated in the process data via IO-Link. In addition, diagnostic data is transmitted to the controller via IO-Link for Industry 4.0 purposes. Electronica Azi International | 1/2022

Pile positioning in the beverage/packaging industry

Requirement: In the beverage industry, the filled bottles are often provided with secondary packaging in a carton packaging machine, where they are grouped together and combined into a unit pack ready for sale. The pre-cut cartons prepared on a pile must be automatically removed from the pile, separated and then provided for the gluing and folding process. To ensure optimum performance of the downstream process steps, the carton pile must be positioned at a specific point on the conveyor belt and then adjusted to be a defined distance from the laterally positioned sensor. Solution: Using the new ODT 3C, the carton pile can be scanned along its long side for purposes of presence monitoring (switching sensor function) and then continuously positioned to a defined distance (e.g. 120 mm) at the edge of the pile flap by means of a measurement value (measuring sensor function). Quality and object height monitoring on the conveyor belt

Requirement: In the food industry, the manufactured products (e.g. chocolate bars) are conveyed separately on the conveyor belt. During this process it is important to monitor whether any objects are lying on top of each other, meaning that they cannot be used for further processing (e.g. packaging). Solution: The new sensor ODT 3C is installed just above the conveyor belt so that it looks down on the products from above. It detects the objects (switching sensor function) and measures their height (measuring sensor function). In this way, the sensor ensures that the products are conveyed separately on the conveyor belt, are not lying on top of each other and can therefore be used for the packaging process. https://international.electronica-azi.ro

Highlights 2-in-1: Detection and measurement with a single sensor Detection and measurement tasks solved by a single sensor – this saves time and money during procurement, installation and commissioning, as well as during operation. Extensive diagnostic data with IO-Link Extensive diagnostic data from the device, e.g. temperature value, signal quality, object counter and warning. Measurement value transmission in IO-Link for monitoring a specific window area. Range adjustment via remote The operating range can be adjusted numerically (e.g. 100 mm) via IO-Link (Remote Set Distance). The device calibration also enables a high level of accuracy when adjusting via remote. As a result, the switching points in the device are adjusted almost entirely independently of reflections when adjustments are made via IO-Link and when the device is exchanged for a replacement part. The high accuracy and the device calibration are also extremely beneficial when it comes to changing the device, because the pre-setting can be transferred to the new device loss-free via IO-Link without having to repeat the teach. Active ambient light suppression The new sensors in the ODT 3C series have active ambient light suppression (FW1.5). The sensor is not affected by direct light from LED hall lighting, which this does not cause faulty switching. This significantly increases the functional reliability of the sensor.

https://www.oboyle.ro 61

Leuze: Sensor solutions for AGV Typical application solutions for automatic high-lift trucks, platform vehicles and tractor vehicles

Automated guided vehicles (AGV) must transport material or goods from A to B quickly, safely and autonomously. Depending on the application and type of material to be transported, an automatic high-lift truck, a platform vehicle or a tractor vehicle may be best suited. An AGV is controlled via optical guidance, grid navigation or so-called natural navigation. Our sensor solutions also guarantee the precise storage and retrieval of pallets, safe transport even with speed changes as well as vibrationfree transfer of the transport material. The portfolio ranges from cost-optimized sensors for detection to high-resolution navigation and safety solutions. Automatic high-lift truck The automatic high-lift truck is frequently used in high-bay warehouses, where it serves as a free-moving high-bay storage device. Vertical positioning of the load receptacle It is important that the load receptacle always be positioned at the correct height. Only in this way is it guaranteed that the pallet is safely stored and retrieved. Solution: The AMS 300i sensor delivers measurement data every 2 ms with an absolute accuracy of ±2 mm. This measurement data can be transferred to the control via a wide range of interfaces. Pallet and rack detection From moving in to picking up the pallet with the load receptacle to placement of the pallet in the warehouse: the vehicle must always detect whether the path is free. The detection of the pallet itself as well as the edge of the shelf rack is also essential. Solution: With the sensors of the 3 series, very precise switch62

ing points can be defined independent of material by means of which the pallet and shelf rack can be reliably detected. With up to two digital switching outputs, solutions to these different applications can be found with just one sensor. Safeguarding the transportation path with natural navigation An AGV always travels a predefined path in both directions. To orient itself in the surroundings during navigation without the use of reflectors and to safeguard the transportation path, the surroundings must be scanned with millimeter accuracy. Solution: The RSL 400 safety laser scanner is an area scanner that scans its surroundings with a resolution of 0.1°. A very accurate map of the surroundings is thereby generated for the navigation. With up to 100 switchable protective fields, the safety area of the AGV can be adapted to the respective requirements at any time. Position detection of transport material For safe transport, it is essential to check whether the pallet or the transport material was correctly picked up by the vehicle. Solution: With the HRT 25B sensor, up to two switching points can be taught in. The time-offlight technology used here helps to set the switching points for the required distances nearly independently of material and color. Integration of safety sensors All safety functions used on the vehicle must be logically linked to one another. One example is the changeover of the protective fields of a safety laser scanner depending on the safely monitored travel speed. Solution: With the configurable safety controls of the MSI 400 series, safety sensors and functions can be efficiently integrated. Though just 45 mm wide, there are 24 inputs/outputs available in the base module. These support the connection of incremental sensors for safe speed monitoring according to EN 61800-5-2. Electronica Azi International | 1/2022

End positioning of load receptacle The position of the load receptacle must always be ensured. It should, for example, be in a defined position when changing from slow to fast speed. Solution: The IS 212 inductive switch with M12 external thread detects the position of the load receptacle. Large operating ranges – and a small size – save space and reduce costs here. Pass-under and platform vehicles In semi-automatic production areas such as semiconductor or display production, this type of AGV is used as a more flexible alternative to permanently installed conveyor systems. Grid navigation To find a predefined path, an AGV must always know exactly where it is, regardless of whether it is moving slowly or at high speed. Solution: A simple and reliable solution is grid navigation. The DCR 200i code reader detects 2D-codes that are affixed to the floor in a defined grid even during fast movements. In doing so, the DCR 200i determines the code information and the angle of rotation. Fine positioning To ensure error-free transfer of the transport material, the vehicle must be positioned at the transfer station with millimeter accuracy. Solution: The camerabased IPS 200i sensor determines its position relative to a marker – such as a through hole in the material – with millimeter accuracy. The sensor transfers its absolute measurement values to the control via the interface in millisecond intervals. Presence control of transport material There must be no errors when loading the transport material. It is therefore important to accurately determine its position after every loading and unloading operation. Solution: The compact retro -reflective photoelectric sensors of the 5 series precisely determine the position of the transport material. https://international.electronica-azi.ro

In addition, technologies such as A²LS make the sensors insensitive to ambient light. And the highly visible light spot makes the products very easy to adjust. Conveyor control The loading and unloading operation should be activated as easily and efficiently as possible. Often, just one signal suffices here. Solution: The command for activating or deactivating the conveyor is transferred easily, contact-free and economically between vehicle and conveyor system with a 3 series throughbeam photoelectric sensor. The photoelectric sensors can be aligned quickly thanks to their clearly visible indicator LEDs with all-round visibility. Insensitive to ambient light, they function reliably stable. Tractor vehicle Tractor vehicles are often used if material needs to be delivered on belts. For example, in the automotive industry or in the production of white goods. Optical guidance An AGV must move safely and efficiently through its surroundings. Often, however, expansive production and storage areas pose a challenge. Moreover, many sensors are unsuitable for integration in flat vehicles due to their dimensions. Solution: One simple possibility is optical guidance. The vehicle follows a high-contrast track on the floor that helps the sensor in the vehicle determine its position. The OGS 600 compact sensor is available in models with different detection widths and interfaces. Its minimum distance from the floor is just 10 mm. Safeguarding the transportation path To safeguard the transportation path of an AGV, a defined area in front of the vehicle must be checked and the vehicle safely stopped in the event of danger. Solution: The RSL 400 safety laser scanner reliably monitors an area of 8.25 m in a scanning angle of 270°. Due to the possibility of switching the protective fields, the protective field size can be dynamically adapted to the speed. https://www.oboyle.ro 63

C23 with UV LED

Transparent-object sensors with patented UV technology ensure reliable detection and accurate counting of clear plastic trays During automated packaging of fast-moving products in controlled conditions, thermoforming lines produce transparent plastic tray bases from continuous reel-stock material. A small transparent-object sensor with patented UV technology detects the presence of each set of transparent trays after it is formed, initiating a subsequent operation and, optionally, triggering a counting circuit. Manual intervention is avoided, ensuring contamination-free, reliable operation with little or no downtime. Customer value ■ UV sensors ensure reliable detection of transparent plastic targets ■ Safe detection of the thinnest transparent materials ■ Maximum operating reserve owing to high absorption factor of UV light by transparent plastics ■ Elimination of multiple switching on a single target ■ Reliable operation without the need for manual intervention ■ Very low sensitivity to dust, liquid droplets and splashes ■ Wide operating range accommodates full range of machine geometries ■ Simple one- or two-step teach procedure optimizes initial sensor set-up ■ Sensitivity parameters are retrieved or updated remotely via IO-Link ■ Stability alarm highlights reduced sensitivity, avoiding unplanned stoppages Specific product advantages ■ Ultraviolet reflex photoelectric sensors for transparent object detection ■ Very low sensitivity to target shape ■ IO-Link serial-connection protocol enabled on PNP versions at no additional cost ■ Pre-taught sensitivity parameters stored on inbuilt sensor memory ■ Remote sensitivity retrieval or update via IO-Link ■ Highly tolerant of contamination by dust, liquid droplets or splashes ■ Robust, Ecolab approved sensors with IP67-rated miniature plastic housings https://www.oboyle.ro 64

Electronica Azi International | 1/2022