Electronica Azi International no. 3 - 2021

3/2021

I N T E R N A T I O N A L A PAN EUROPEAN MAGAZINE

https://international.electronica-azi.ro

https://international.electronica-azi.ro

Lowest-Power ChipDNA PUF Technology from Analog Devices Secures Embedded Devices from Edge to Cloud Cryptographic controller provides 30x lower power and industrialgrade protection for battery-powered devices in the harshest, most security-critical environments Today Analog Devices, Inc. unveiled the ultra-low power MAXQ1065 cryptographic controller featuring its proprietary ChipDNA™ physically unclonable functionality (PUF) technology, which offers the strongest protection for edge-tocloud Internet of Things (IoT) nodes, including medical and wearable devices, against invasive security attacks. The security co-processor provides 30x lower power when compared to similar products and its extended lifetime and operating range make it well-suited for longterm deployments in harsh environments.

The MAXQ1065 security co-processor provides turnkey cryptographic functions for root-of-trust, mutual authentication, data confidentiality and integrity, secure boot, secure firmware update, and secure communications. It includes standard algorithms for key exchange and bulk encryption, or complete transport layer security (TLS) support. The device integrates 8KB of secure storage for user data, keys, certificates and counters with user-defined access control and life cycle management functionality for IoT equipment. https://international.electronica-azi.ro

“With billions of deployed devices and ongoing exponential growth, it’s common knowledge that IoT devices are a favorite hacking target, normally with malicious intent. The threats to the systems critical to society such as infrastructure, medical and industrial are very real and without proper protection they may be compromised,” said Scott Jones, Managing Director, Micros, Security and Software Business Unit at Maxim Integrated®, now part of Analog Devices. “The MAXQ1065 with ChipDNA technology is designed to address these threats. Built with the most advanced security technology and targeting IoT applications, it provides a superior level of protection for your equipment and has the technology to future-proof designs against tomorrow’s system threats.”

The MAXQ1065’s low power consumption and wide operating range makes it suitable for battery-powered applications, and the very small footprint and low pin count enable easy integration into medical and wearable devices. The MAXQ1065 life cycle management allows flexible access

control rules during the major life cycle stages of the device and end equipment, ensuring long-term operation in harsh environments. The device integrates Analog Devices’ proprietary ChipDNA PUF technology, which protects against invasive attacks since any attempt to probe the PUF cryptographic destroys its value. The MAXQ1065 is also supported by Analog Devices’ secure key preprogramming service for customers who want keys, data and life cycle state initialized prior to shipment to a contract manufacturer.

MAXQ1065 Security Co-Processor Features and Benefits • Most complete and robust edge-to-cloud security: The MAXQ1065 includes a TLS/ DTLS 1.2 command set built upon hardware-based ECDSA, ECDHE and AES for authentication, key exchange and secure communication. Additional countermeasures against security attacks include the irreversible ChipDNA PUF technology which is used to cryptographically protect all stored data from discovery.

• Lowest power: The MAXQ1065 operates at 100nA during power down mode, which is 30x lower than comparable products.

Analog Devices https://www.analog.com 3

Electronica Azi International » TABLE OF CONTENTS 3 | Lowest-Power ChipDNA PUF Technology from Analog Devices Secures Embedded Devices from Edge to Cloud 6 | Renesas and OmniVision deliver integrated Reference Design for Automotive Camera Systems 6

21 | Renesas Launches 32-Bit RX671 MCUs Realizing High Performance and Power Efficiency with HMI Functions for Contactless Operation 26 | Use Sensorless Vector Control with BLDC and PMS Motors 30 | Multitasking at the edge 36 | What’s the right wireless tool for the job?

38 | Nexperia surface-mount device passes Board Level Reliability requirements for automotive application 39

7 | Mouser Electronics Examines Impact of 5G and Edge Computing on Intelligent Transportation Systems in Newest EIT Episode 8 | Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI 9 | Brand new Qseven upgrade: NXP i.MX 8 10 | How to Design a Better Pulse Oximeter 16

39 | COSEL expands its value added STMGF DC/DC converter platform with 80W unit for industrial applications 40 | Power Integrations’ New SCALE-iFlex LT Plug-andPlay Gate Driver Improves EconoDUAL IGBT Module Performance by 20% 42 | iSYSTEM introduces Infineon AURIX™ TC377TE Emulation Adapter 44 | New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments 45 | Renesas Reimagines Remote Design With Enhanced Lab on the Cloud Environment 46

16 | New Bosch sensor evaluation board for rapid prototyping accelerates development 17 | Low Power Asset Tag from onsemi Brings Unmatched Five-Year Battery Life to Industrial Asset Management 18 | Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform 20 | MPLAB® Cloud Tools Ecosystem Brings Secure, Platform-independent Development Workflow to PIC® and AVR® Microcontrollers

46 | “Eight processes, infinite possibilities” – Rehm at productronica 2021 in Munich 56 | Leuze: DRT 25C: The one for everything

® Management Managing Director - Ionela Ganea Editorial Director - Gabriel Neagu Accounting - Ioana Paraschiv Advertisement - Irina Ganea Web design - Eugen Vărzaru

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Contributing editors Cornel Pazara PhD. Paul Svasta PhD. Norocel Codreanu PhD. Marian Blejan PhD. Bogdan Grămescu

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Electronica Azi International is published 4 times per year in 2021 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering decisions.

Copyright 2021 by Euro Standard Press 2000 s.r.l.

All rights reserved.

Electronica Azi International | 3/2021

Design Features Renesas’ New Automotive HD Link (AHL) Technology and OmniVision’s OX01F10 1.3MP SoC to Deliver Low Cost, High Quality Video

Renesas and OmniVision deliver integrated Reference Design for Automotive Camera Systems Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today introduced an integrated reference design for a High Definition automotive camera system.

The new design features Renesas’ recently introduced Automotive HD Link (AHL) technology that transmits high-definition video over low-cost cables and connectors. The AHL components in the design pair with OmniVision’s OX01F10 1.3MP SoC, which provides the industry’s best imaging performance across a wide range of challenging lighting conditions, along with the most compact form factor and lowest power consumption.

HD video is increasingly important in car safety systems for object recognition functionality. The new RAA279971 AHL encoder and RAA279972 decoder use a modulated analog signal to transmit the video, enabling transmission rates 10 times less than required to transmit HD signals digitally. The lower transmission rate means that unshielded twisted pair (UTP) cables and standard low-cost connectors can be used, as can existing tradi6

tional analog video cables and connectors. Renesas is a leader in the Advanced Driver Assist Systems (ADAS) market, and AHL can be paired with other Renesas products, such as the R-Car Automotive SoCs, RH850 MCUs, automotive PMICs, and analog components to cost-effectively implement numerous safety features in virtually any vehicle.

OmniVision’s OX01F10 SoC integrates a high performance 3.0 micron image sensor and an advanced image signal processor (ISP) with OmniVision’s PureCel®Plus technology for low noise, solving the automotive rear view camera (RVC) and surround view system (SVS) challenges of achieving a small form factor with excellent low-light performance, ultra-low power and reduced cost while improving reliability by enabling single printed circuit board (PCB) designs.

“This reference design featuring our AHL technology combines market-leading technologies from two industry leaders,” said Niall Lyne, Vice President of the Automotive Analog Power and Video Business Division at Renesas. “Together, we’re enabling an efficient and economical HD video system design for any vehicle class worldwide.”

“The 1.3MP OX01F10 provides automotive designers with the industry’s best imaging performance across a wide range of challenging lighting conditions, supporting HDR up to 120dB and high performance ISP. The sensor features ASIL-B, which targets cost-effective solutions, along with the most compact form factor and lowest power consumption,” said Michael Wu, Senior Vice President of Global Sales and Marketing at OmniVision. “This reference design with Renesas takes that concept further by pairing with another high-quality, economical solution.”

The reference design will be demonstrated at OmniVision’s booth # 15 at the upcoming AutoSens Brussels 2021 Exhibition, September 15-16.

Availability The new reference design is available through both Renesas Sales and OmniVision Sales.

Visit https://www.renesas.com/AHL to learn more about the AHL technology, and https://www.ovt.com/sensors/OX01F10 for information about the OX01F10.

Renesas Electronics Corporation https://www.renesas.com Electronica Azi International | 3/2021

PRODUCT NEWS

Mouser Electronics Examines Impact of 5G and Edge Computing on Intelligent Transportation Systems in Newest EIT Episode Mouser Electronics Inc. today releases the fifth installment of the 2021 Empowering Innovation Together™ (EIT) program. The latest instalment offers deeper insight into the trends surrounding intelligent transportation systems through a featured blog, infographic, video and more. The series also includes a new episode of The Tech Between Us podcast, available on the Mouser website: https://eu.mouser.com/empowering-innovation/intelligent-transportation-systems#podcast-its.

In the latest podcast episode, Raymond Yin, Mouser’s Director of Technical Content, speaks with Dr. Maxime Flament, CTO of the 5G Automotive Association, about the emergence of industry safety standards. They explore the capabilities of implementing 5G networks into transportation systems and the effects of edge computing in the automotive industry. https://international.electronica-azi.ro

The podcast is also available on Alexa, Apple Podcasts, Google Podcasts, iHeartRadio, Pandora, Spotify and Mouser’s YouTube channel.

“Worldwide, we’re seeing rapidly increasing needs for safe, secure and intelligent transportation systems,” states Glenn Smith, President and CEO of Mouser Electronics. “With new developments enabled by technologies like 5G, ultra-wide bandgap, next-gen wireless connectivity and more, we’re in an era of smart transportation solutions that will change the industry and impact our communities, cities, travel and more.”

The 2021 EIT series includes four bytesized videos, Then, Now and Next, as well as articles, blogs, infographics and other content, with conversations led by Mouser thought leaders and other experts. Future tech topics following intelligent transportation solutions will

review the latest in product technologies such as RF and wireless. The program showcases multiple new product developments and unveils the technical developments required to stay timely with new trends in the marketplace.

The fifth instalment of the 2021 EIT program is sponsored by Mouser’s valued partners Amphenol ICC, Amphenol RF, Digi International, Intel®, KEMET, Microchip Technology, Molex, STMicroelectronics, TDK and TE Connectivity.

Established in 2015, Mouser’s Empowering Innovation Together program is one of the industry’s most recognised electronic component programs. To learn more, visit https://eu.mouser.com/empoweringinnovation and follow Mouser on Facebook and Twitter.

Mouser Electronics https://www.mouser.com 7

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates Routers, switches and line cards need higher bandwidth, port density and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data center traffic driven by 5G, cloud services and Artificial Intelligence (AI) and Machine Learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition to the 112G (gigabits per second) PAM4 Serializer/Deserializer (SerDes) connectivity that is needed to support the latest pluggable optics, system backplanes and packet processors. These challenges can now be overcome with the industry’s most compact, 1.6T (terabits per second), low-power PHY (physical layer) solution from Microchip Technology Inc. (Nasdaq: MCHP) with its PM6200 METADX2L that reduces power per port by 35 percent compared to its 56G PAM4 predecessor, META-DX1, the industry’s first terabit-scale PHY solution.

With its high-density 1.6T bandwidth, space-saving footprint, 112G PAM4 SerDes technology, and support for Ethernet rates 8

from 1 to 800 GbE, Microchip’s META-DX2L Ethernet PHY is an industrial-temperaturegrade device that offers the connectivity versatility to maximize design reuse across applications ranging from a retimer, gearbox or reverse gearbox to a hitless 2:1 multiplexor (mux). Highly configurable crosspoint and gearbox features make full use of a switch device’s I/O bandwidth to enable the flexible connections necessary for multi-rate cards that support a wide range of pluggable optics.

The PHY’s low-power PAM4 SerDes enables it to support the next-generation infrastructure interface rate for cloud data centers, AI/ML compute clusters, 5G, and telecom service provider infrastructure, whether over long-reach direct attach copper (DAC) cables, backplanes, or connections to pluggable optics. META-DX2L is offered in the industry’s smallest package size, 23 × 30 millimeter (mm), which enables the space savings necessary to deliver the line card port densities demanded by hyperscalers and system developers. Product highlights include:

• Dual 800 GbE, Quad 400 GbE and 16x 100/50/25/10/1 GbE PHY • Supports Ethernet, OTN, and Fibre Channel data rates • Supports proprietary data rates for AI/ML applications • Integrated 2:1 hitless mux enables high availability/protection architectures • Highly configurable crosspoint supporting multi-rate services on any port • Constant latency, enabling IEEE 1588 Class C/D PTP at the system level • FEC termination, monitoring and conversion between various interface rates • 32 long-reach (LR) capable 112G PAM4 SerDes with programmability to optimize power vs. performance • Support for DAC cables, including auto-negotiation and link training • Industrial-temperature-range support, enabling deployments in outdoor environments • Complete Software Development Kit (SDK) with hitless upgrade and warm restart capabilities and compatible with the field-proven META-DX1 SDK Microchip Technology https://www.microchip.com Electronica Azi International | 3/2021

PRODUCT NEWS

Brand new Qseven upgrade: NXP i.MX 8 New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future congatec – a leading vendor of embedded and edge computing technology – celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor.

This next generation processor platform is the perfect upgrade for all NXP i.MX 6 based Qseven applications that have been running in the field for many years.

It brings modern machine learning and AI capabilities as well as TSN support for real-time Ethernet to those applications and will extend their life time by an additional 10 to 15 years, maximizing the return on investment for such systems.

The powerful new Qseven module is based on the i.MX 8M Plus application processor with 1.8 GHz Arm Cortex-A53 quad-core performance and an additional integrated neural processing unit (NPU) with up to 2.3 TOPS. As the first i.MX processor with a machine learning accelerator, the i.MX 8M Plus provides substantially higher performance for deep learning inference and artificial intelligence at https://international.electronica-azi.ro

the edge. At a typical ultra-low power consumption of just 3 watt, the new congaQMX8-Plus module delivers a performance boost of more than 150 %, supported by the 64-bit architecture and onboard LPDDR4 memory with up to 6 GB. Highly energy efficient Arm performance, machine learning capabilities and Ethernet with TSN support enable even more powerful and smarter embedded and IIoT connected edge systems at the edge. Vertical markets for these low power modules range from industrial controls, smart robotics and factory automation to medical health care and retail, and from transportation and smart farming to smart cities and smart buildings.

THE I.MX 8M PLUS PROCESSOR IMPROVEMENTS Existing and new applications can now benefit from silicon manufactured in 14nm process and leverage lowest power consumption of typically 3 watt, 64-bit support instead of 32-bit and up to 6 GB LPDDR4 memory including inline ECC support instead of only 4GB.

Also new are: AES encryption for higher cyber security, the image signal processor (ISP) for parallel real-time processing of high resolution images including H265 decoding/encoding, a high-quality DSP that enables speech recognition applications, and the NPU that adds 2.3 TOPS of dedicated AI computational power for machine and deep learning inference. The integrated Cortex-M7 further provides real-time control together with a TSN-capable Ethernet port and can also be used as a fail-safe unit.

Next to an encryption module (CAAM) for hardware-accelerated ECC and RSA encryption, the Arm TrustZone also integrates the Resource Domain Controller (RDC) for isolated execution of critical software, and secure High Assurance Boot mode to prevent the execution of unauthorized software during boot.

THE FEATURE SET OF THE NEW QSEVEN MODULES IN DETAIL The new conga-QMX8-Plus Qseven modules are equipped with 1.8 GHz Arm Cortex‑A53 quad-core based NXP i.MX 8M Plus processors for the industrial (0°C to +60°C) or 1.6 GHz variants for the extended (-40°C to +85°C) temperature ranges. The modules can control up to three independent displays, connected via natively supported HDMI 2.0a, LVDS 2x24bit and MIPI-DSI, and provide hardware accelerated video decoding and encoding including H.265 so that high resolution camera streams delivered by two integrated MIPICSI interfaces can be sent directly to the network. For onboard data storage, the modules provide up to 128 GB 5.1 eMMC, which can also operate in safe pSLC mode, as well as 1x onboard μSD socket.

Peripheral interfaces include 1x PCIe Gen 3, 1x USB 3.0, 3x USB 2.0, 4x UART as well as 1x CAN FD and 14x GPIO. For real-time networking, the module offers 1x Gbit with TSN support. 2x I2S for sound rounds off the feature set. The supported operating systems include Linux, Yocto and Android.

Further information on the new congaQMX8-Plus Qseven Computer-onModule from congatec can be found at: https://www.congatec.com/en/products/qseven/conga-qmx8-plus/ Further information about Qseven technology is available at: https://www.congatec.com/en/technologies/qseven/ congatec https://www.congatec.com 9

How to Design a Better Pulse Oximeter Author: Robert Finnerty Systems Applications Engineer

It is more important than ever to design medical devices that are more convenient and less power hungry. This article covers the fundamentals of SpO2 measurement and demonstrates how a new generation of optical analog front ends (AFEs) can help create a better oximeter. The new devices can have reduced design complexity, a reduced burden on the mechanical design, and decreased power consumption.

INTRODUCTION Traditionally, peripheral blood oxygen saturation (SpO2) is a measurement taken at the peripherals of the body on the finger or ear, most commonly with a clip device to determine the ratio of oxygen saturated hemoglobin to total hemoglobin. This measurement is used to tell how well red blood cells are transporting oxygen from the lungs to other parts of the body.

Normal SpO2 levels vary from 95% to 100% in a healthy adult. Levels below this range indicate a condition known as hypoxemia.

This means that the body is not transporting enough oxygen to maintain healthy organs and cognitive function.

A person suffering from hypoxemia may experience dizziness, confusion, shortness of breath, and headaches. Several medical conditions can cause poor blood oxygenation and may require continuous or intermittent monitoring at home or in a clinical setting.

SpO2 is one of the most common vital signs recorded within a clinical setting.

Some conditions that require continuous SpO2 monitoring include asthma, heart disease, COPD, lung disease, pneumonia, and COVID-19 induced hypoxia.

One of the ways to determine whether symptomatic COVID-19 patients need hospitalization is by monitoring their SpO2 levels. If those levels fall below the baseline number (usually under 92%), they need to be checked into an emergency room.

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THE RECENT LINK BETWEEN COVID-19 AND HYPOXIA Very recently, COVID-19 patients have been diagnosed with a particularly insidious condition known as silent hypoxia.

Silent hypoxia can do severe damage to the body before any of the typical COVID19 respiratory symptoms, like shortness of breath, occur. An article on the National Center for Biotechnology Information website1) states “the ability to detect this silent form of hypoxia in COVID-19 patients before they begin to experience shortness of breath is critical for preventing the pneumonia from progressing to a dangerous level.”

SpO2 monitoring is also a key indicator in diagnosing sleep apnea. Obstructive sleep apnea causes the airways to become partially or fully blocked during sleep.

This can be observed as long pauses in breathing or periods of shallow breathing causing temporary hypoxia. If untreated over time, sleep apnea can increase the likelihood of heart attack, stroke, and obesity. It is estimated that sleep apnea affects between 1% to 6% of the total adult population.

THE URGENT NEED FOR A BETTER PULSE OXIMETER NOW AND IN THE FUTURE As patient care trends toward ambulatory and in-home monitoring, there is a need to develop vital sign monitoring devices that will not impede users from completing daily tasks.

In the case of SpO2, monitoring areas other than the finger and ear will present a host of design challenges. The recent emergence of silent hypoxia makes the case for development of more portable clinical-grade pulse oximeter units even more compelling.

This article will explain some of the fundamental principles of SpO2 measurement and introduce ADI’s latest generation of optical AFEs, the ADPD4100 and ADPD4101, which reduce design complexities for medical grade SpO2 devices.

Built-in high performance automatic ambient light rejection reduces the burden on mechanical and electronic design.

The high dynamic range in the ADPD4100 at lower power consumption reduces the number of photodiodes or LED current in a design to determine slight variations in patient SpO2 level efficiently. Finally, digital integrator options allow users to enter an extremely efficient power consumption mode to enable longer run times in portable PPG solutions by disabling analog blocks in the optical signal path.

WHAT IS OXYGEN SATURATION? Oxygen saturation is the percentage of oxygen saturated hemoglobin within the blood with respect to the total available hemoglobin. The gold standard for measuring oxygen saturation is the atrial blood oxygenation measurement, SaO2.

Electronica Azi International | 3/2021

DESIGN SOLUTIONS » Pulse Oximeter

However, this method requires laboratorybased blood gas analysis of a blood sample. The calibration section covers this in greater depth.

SpO2 is an estimate of the oxygen saturation levels measured at the peripherals of the body, using a pulse oximeter. Until recently, the most common way to measure oxygen saturation has been to use a pulse oximeter positioned on the finger.

The pulse oximeter will pulse the red LED and measure the resulting signal on the PD. Repeat this for the IR LED and finally with both LEDs off to get a baseline for any ambient external light sources. This generates a photoplethysmography (PPG) signal for both wavelengths.

The intensity of light absorbed at the diastole and systole are related by: (3) Where α measures the absorption rate of light in atrial blood and d2 is the AC amplitude of the PPG signal (see Figure 3).

Figure 3

HOW DOES A PULSE OXIMETER WORK? A pulse oximeter works on the principal that absorption of light in oxygenated hemoglobin (HbO2) and deoxygenated hemoglobin (RHb) differ significantly at specific light wavelengths. Figure 1 shows the extinction coefficient of HbO2, Hb, and methemoglobin (MetHb) across the visible and infrared light spectrum. The extinction coefficient is a measurement of how strongly a chemical substance absorbs light at a given wavelength.

© ADI

Figure 1

Extinction factor of light through hemoglobin.

© ADI

Light attenuation through tissue.

From Figure 1, it can be seen that HbO2 absorbs more red light (600 nm) and allows more infrared light (940 nm) to pass through. RHb absorbs more light at infrared wavelengths, which allows more red light to pass through than in HbO2.

Figure 2

The signal contains DC and AC components. The DC component is due to constant reflective matter such as skin, muscle and bone, and venous blood. When a body is at rest and motion is less of a factor, the AC component comprises mainly of reflected light from the pulsation of artery blood.

The AC component depends on heart rate and artery thickness, with more reflected or transmitted light in systolic (pump) than the dystopic (relaxation). During the systolic phase, blood is pumped from the heart, which increases atrial blood pressure. The increase in blood pressure expands the arteries and leads to an increase in atrial blood volume. This increase in blood causes an increase in light absorption. Blood pressure drops during the diastolic phase and therefore so does the absorption of light. Figure 3 shows the diastolic trough and systolic peaks caused by the beating heart.

Basic pulse oximeter circuit.

© ADI

(1)

The most basic pulse oximeter consists of two LED (one red 660 nm LED and one infrared (IR) 940 nm LED) and a single photodiode (PD) in a reflective or transmissive configuration (see Figure 4). https://international.electronica-azi.ro

(2) The Beer-Lambert law explains that light decays exponentially when travelling though absorptive material. This can be used to determine the level of oxygenated hemoglobin to total hemoglobin.

Idiastole is equal to the DC component labelled d1.

(4)

By computing AC and DC from a PPG signal, we are able to determine the change in absorption of light in atrial blood –α.d2 caused by blood pumping from the heart, with no contribution from other tissue.

The ratio of the AC component to the DC component is known as the perfusion index, which is the ratio of the pulsating blood flow to the nonpulsatile static blood flow. The goal of a PPG-based heart rate or SpO2 measurement system is to increase the AC to DC signal ratio.

PI = AC/DC The perfusion index for infrared and red wavelengths can be used to calculate the ratio of ratios (RoR), which is the ratio of PIred to PLir. As the absorption of the light at a given wavelength is proportional to the (5) In theory, the RoR can be substituted into the following formula to compute SpO2: 11

MEDICAL DEVICES

(6)

Where: EHbO2,red = extinction coefficient of HbO2 at 600 nm, EHbO2,ired = extinction coefficient of HbO2 at 940 nm ERHb,ired = extinction coefficient of RHb at 940 nm, ERHb,red = extinction coefficient of RHb at 600 nm However, the Beer-Lambert law cannot be used directly as there are a number of variable factors in every optical design that cause variations to the RoR to SpO2 relationship. These include mechanical baffle design, LED to PD spacing, electronic and mechanical ambient light rejection, PD gain errors, and many more.

To obtain clinical grade accuracy from a PPG-based SpO2 pulse oximeter, a lookup table or algorithm must be developed for the correlation between RoR and SpO2.

CALIBRATION Calibration of the measurement system is required to develop a high accuracy SpO2 algorithm. To calibrate an SpO2 system, a study must be completed where a participant’s blood oxygen levels are medically reduced, monitored, and overseen by a medical professional. This is known as a hypoxia study.

The SpO2 measurement system can only be as accurate as the reference.

Reference options include medical grade finger clip pulse oximeters and the gold standard co-oximeter. The co-oximeter is an invasive method of measuring the oxygen saturation of blood that yields high accuracy, but in most cases is not convenient to administer.

The calibration process is used to generate a best fit curve of RoR value calculated from the optical SpO2 device to the co-oximeter SaO2 measurement. This curve is used to generate a lookup table or equation for calculating SpO2.

Calibration will be required for all SpO2 designs as RoR is dependent on a number of variables such as LED wavelength and intensity, PD response, body placement, and ambient light rejection, which will differ with each design.

An increased perfusion index and, in turn, a high AC dynamic range on the red and IR wavelengths will increase the sensitivity of the RoR calculation and, in turn, return a more accurate SpO2 measurement.

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During a hypoxia study, 200 measurements equally spaced between 100% and 70% blood oxygen saturation need to be recorded. Subjects are chosen with a variety of colored skin tone, and an equal spread of age and gender. This variation in skin tone, age, and gender accounts for differing perfusion index results from a spread of individuals.

The overall error for transmissive pulse oximeters must be ≤3.0% and ≤3.5% for reflective configuration.

DESIGN CONSIDERATIONS TRANSMISSIVE VS. REFLECTIVE A PPG signal can be obtained using a transmissive or reflective LED and PD configuration. A transmissive configuration measures the nonabsorbed light passed through a part of the body.

This configuration is best suited to areas such as the finger and earlobe where measurement benefits from the capillary density of these body locations, which make the measurements more stable, repetitive, and less sensitive to variations in placement.

SENSOR POSITIONING & PERFUSION INDEX Positioning on the wrist and chest require greater dynamic range in the PPG AFE as the DC signal is greatly increased due to the depth of the arteries below static reflective components such as skin, fat, and bone.

Greater resolution in the PPG measurements will reduce the uncertainty in the SpO2 algorithm. With a typical PI of 1% to 2% for wrist-worn SpO2 sensors, the goal of pulse oximeter design is to increase the PI through mechanical design or to increase the dynamic range.

The spacing of the LED to PD will have a major effect on the PI. Too little spacing will increase LED to PD crosstalk or backscatter. This will appear as a DC signal and saturate the AFE. Increasing this spacing reduces the effect of both backscatter and crosstalk but also reduces the current transformer ratio (CTR), which is the LED output to PD return current. This will affect the efficiency of the PPG system and require greater LED power to maximize the AFE dynamic range.

Figure 4

© ADI

1

LED-PD configuration.

Transmissive configurations achieve a 40 dB to 60 dB increase in the perfusion index.

Reflective PPG configurations are chosen when the PD and LED must be placed next to each other for practicality, such as with wrist- or chest-worn devices.

Rapidly pulsing one or multiple LEDs has the benefit of reducing the 1/f noise contribution to the overall signal. Pulsing the LEDs also makes it possible to use synchronized modulation at the receive side to cancel out ambient light interferers.

Electronica Azi International | 3/2021

DESIGN SOLUTIONS » Pulse Oximeter

Integrating multiple pulses increases the PD signal amplitude and lowers the average current consumption. Increasing the total PD area also increases CTR as more of the reflective light is captured.

For heart rate PPG measurement, a combination of a single large PD and multiple power efficient green LEDs has been adopted by many HR device manufacturers to be used on places where there is limited blood flow. Green LEDs are chosen due to their high rejection of motion artifacts.2) However, this comes at the cost of power. Green LEDs have a higher forward voltage than red and IR and high absorbance in human tissue, meaning a higher LED power is required to return meaningful cardiac information.

When motion is present, the width of the arteries and veins change due to pressure. The amount of light absorbed by the photodiode changes and this is present on the PPG signal because photons are absorbed or reflected differently than when a body is at rest.

For an infinitely wide photodiode area covering an infinitely long deep tissue sample, all photons will eventually be reflected to the photodiode.

In this case, no artifact due to motion will be detected. This, however, cannot be achieved; the solution is to increase the photodiode area while taking capacitance into account - lowering AFE and providing filtering for motion artifacts.

The normal frequency for a PPG signal is between 0.5 Hz to 5 Hz while motion

Figure 5

ADI VSM watch V4, baffle, and LED DP array. © ADI

As SpO2 requires multiple wavelengths and most systems still incorporate high efficiency green LEDs for the HR PPG, the most common configuration for HR and SpO2 PPG systems is a single green, red, and IR LED array surrounded by multiple PDs, as seen on the ADI VSM watch in Figure 5. PD to LED spacing has been optimized to reduce backscatter and the baffle design reduces LED to PD crosstalk.

Multiple prototypes of the ADI VSM watch were trialed to verify the most efficient PD to LED spacing for our HR PPG and SpO2 measurement.

MOTION ARTIFACTS Motion artifacts provide one of the greatest design challenges to a PPG measurement system. https://international.electronica-azi.ro

artefacts are typically between 0.01 Hz to 10 Hz. Simple band-pass filtering techniques cannot be used to remove motion artifacts from the PPG signal.

To achieve high accuracy motion cancellation, an adaptive filter needs to be supplied with highly accurate motion data. For this purpose, Analog Devices has developed the ADXL362 3-axis accelerometer.

This accelerometer provides 1 mg resolution with up to 8 g of range while consuming only 3.6 μW at 100 Hz and is available in a 3 mm × 3 mm package.

ADI SOLUTION: ADPD4100 The positioning of the pulse oximeter generates several challenges. Wrist-worn SpO2 devices provide additional design challenges as the AC signal of interest is

only 1% to 2% of the total received light on the PD. To achieve medical grade certification and distinguish between slight variations in oxyhemoglobin levels, a higher dynamic range on the AC signal is required.

This can be achieved by reducing ambient light interference and decreasing LED driver and AFE noise. ADI has addressed this problem with the ADPD4100.

The ADPD4100 and ADPD41001 achieve up to 100 dB SNR. This increased dynamic range is essential to measure SpO2 under low perfusion scenarios. This integrated optical AFE has eight onboard low noise current sources and eight separate PD inputs. The digital timing controller has 12 programmable timing slots that enable the user to define an array of PD and LED sequences with specific LED current, analog and digital filtering, integration options, and timing constraints.

A key benefit of the ADPD4100 is the increase in SNR/μW, which is an important parameter for battery-powered continuous monitoring. This key metric has been addressed by increasing the AFE dynamic range while also lowering the AFE current consumption. The ADPD4100 now boasts a total power consumption of only 30 μW for a 75 dB, 25 Hz continuous PPG measurement including the LED supply. Increasing the number of pulses per sample (n) will result in a (√n) increase in SNR while increasing the LED drive current will have a proportional increase in SNR. 1 μW total system consumption will return 93 dB SNR for a continuous PPG measurement using a 4 V LED supply.

Automatic ambient light rejection reduces the burden on the host microprocessor while achieving 60 dB of light rejection. This is achieved using LED pulses as fast as 1 μs in conjunction with a band-pass filter to reject interference. In certain operating modes, the ADPD4100 automatically calculates the photodiode dark current or LED off state. This result is subtracted from the LED on state before conversion in the ADC to remove ambient light as well as gain errors and drift within the photodiode.

The ADPD4100 is supported with the EVAL-ADPD4100-4101 wearable evaluation kit along with the ADI Vital Signs Monitoring Study Watch.

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MEDICAL DEVICES

This hardware seamlessly connects to the ADI Wavetool application to enable bioimpedance, ECG, PPG heart rate, and multiwavelength PPG measurements for SpO2 development.

based positioning due to the reduction in bone and tissue, which also reduces the DC component contribution. For such applications, the ADPD144RI module and the ADPD1080 are suitable devices.

The ADPD144RI mechanically has been optimized to reduce optical crosstalk as much as possible. This provides a solid solution, even when the sensor is placed under a single glass window.

The ADPD1080 is an integrated optical AFE with three LED drive channels and two PD current input channels in a 17-ball, 2.5 mm × 1.4 mm WLLCSP. This AFE is ideal for custom design low channel count PPG products where board space is critical.

REFERENCES Toshiyo Tamura. “Current Progress of Photoplethysmography and SpO2 for Health Monitoring.” Biomedical Engineering Letters, February 2019.

2) Jihyoung Lee, Kenta Matsumura, Ken-Ichi Yamakoshi, Peter Rolfe, Shinobu Tanaka, and Takehiro Yamakoshi.

“Comparison Between Red Green and Blue Light Reflection Photoplethysmography for Heart Rate Monitoring During Motion.”

2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), July 2013.

© ADI

1)

Figure 6

ADPD410X block diagram.

Embedded in the study watch is an automatic gain control (AGC) algorithm for the ADPD4100 that tunes the TIA gain and LED current to deliver optimum AC signal dynamic range for all LED wavelengths selected.

ALTERNATIVE ADI SOLUTIONS Finger- and earlobe-based SpO2 readings are the easiest to design for as the signalto-noise ratio is higher than wrist- or chest-

The ADPD144RI is a complete module with an integrated red 660 nm LED and 880 nm IR LED and four PDs in a 2.8 mm × 5 mm package. The spacing between the LEDs and PD have been optimized to give the best signal-to-noise ratio for SpO2 high accuracy PPG measurements.

This module allows users to quickly skip the design challenges associated with LED and PD placement and spacing to achieve optimal power to noise ratios.

About the Author Robert Finnerty is a systems applications engineer working in the Digital Healthcare Group based in Limerick, Ireland. He works closely with the Vital Signs Monitoring Group, focusing on optical and impedance measurement solutions. Rob joined the precision converters group within ADI in 2012 and has focused on low bandwidth precision measurement. He holds a bachelor’s degree in electronic and electrical engineering (B.E.E.E) from National University of Ireland Galway (NUIG). He can be reached at rob.finnerty@analog.com Analog Devices https://www.analog.com Engage with the ADI technology experts in our online support community.

Ask your tough design questions, browse FAQs, or join a conversation.

© ADI

Visit https://ez.analog.com

Figure 7

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Contact Romania: Email: inforomania@arroweurope.com Mobil: +40 731 016 104 Arrow Electronics | https://www.arrow.com

ADPD4100 simultaneous red (right) and IR (left) PPG measurement.

Electronica Azi International | 3/2021

New Bosch sensor evaluation board for rapid prototyping accelerates development

Application Board 3.0 provides a scalable, easy-to-use sensor development platform The newly launched Application Board 3.0 provides a versatile development solution that makes it quick and easy for engineers to work with all Bosch Sensortec sensors on one common platform. The new board simplifies the evaluation and prototyping of sensors for a wide range of applications, particularly in Industry 4.0, IoT, Smart Home systems, and wrist- and headmounted wearables. To maximize scalability, any sensor – mounted on a ‘shuttle board’ – from Bosch Sensortec is simply plugged into the socket on the Application board. All shuttle boards have an identical footprint, and Bosch Sensortec’s software automatically detects which sensor is plugged in at any given moment and launches the appropriate software. This enables the straightforward evaluation of a wide range of sensors and solutions.

Prototypes can be easily built to quickly test different use case configurations.

The new board is conveniently provided in a small form factor, measuring just 47.0 × 37.0 × 7.0mm3, which is ideal for evaluating sensors in portable applications. It can be powered using a 3.7V Li-ion battery or a standard 5V USB power supply.

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“The Application Board 3.0 makes it quick and easy for developers to build their projects with any of our sensors on a single platform, meaning that they can now focus on creating unique use cases and differentiating their products,” says Dr. Stefan Finkbeiner, CEO at Bosch Sensortec. “Our customers also benefit from efficient support through regional Field Application Engineers and Bosch offices.”

The integrated development environment (IDE) software provided with the board includes a simplified graphical user interface (GUI) to evaluate and tune sensor parameters, as well as to visualize

and record sensor data. The software also saves time in troubleshooting sensorrelated issues.

Application Board 3.0 is designed around the u-blox NINA-B302 Bluetooth Low Energy (BLE) module and is based on the nRF52840 chipset from Nordic Semiconductor, which includes an ARM Cortex-M4F CPU. It is certified and compliant with multiple directives for different international regions: CE, RoHS, China RoHS, FCC, IC, VCCI, SRRC and NCC. To ensure efficient and fast customization of the vast majority of IoT use cases, the new board comes with 256 KB RAM, 1MB of internal flash and 2GB of external flash memory for data logging. It provides full-speed micro-USB 2.0 connectivity and BLE to connect to a host, such as a PC, for transferring the logged sensor data from the board.

The Application Board 3.0 is available from now on.

Bosch Sensortec https://www.bosch-sensortec.com Electronica Azi International | 3/2021

PRODUCT NEWS

RTLS solutions,” said Gery Pollett, CEO and co-founder of Blyott, “The RSL10 allowed us to meet the challenging needs of the healthcare industry. We were particularly impressed by the energy efficiency of the RSL10 radio.”

The RSL10 Asset Tag is available with a comprehensive suite of development tools that include multi-protocol wireless support for Bluetooth® Low-Energy connectivity and the Quuppa Intelligent Locating System™ Real Time Localization Services (RTLS). Within the CMSIS-Pack, included with the evaluation board, onsemi has developed a custom application that demonstrates the ultra-lowpower features and capabilities of the platform in an asset tracking use-case.

Low Power Asset Tag from onsemi Brings Unmatched Five-Year Battery Life to Industrial Asset Management Bluetooth® Low Energy technology enabled design platform offers Quuppa® Real Time Localization Services (RTLS) onsemi, a leader in intelligent power and sensing technologies, unveiled a new system solution that overcomes the main challenges associated with developing asset tracking tags. Battery life has been a major obstacle to asset tag adoption, particularly within industrial sectors where reducing maintenance efforts and associated costs are a primary concern. The RSL10 Asset Tag offers an unprecedented, industry-leading battery life of up to five years. Until now, the accepted battery life for asset tracking tags or beacons has been just a year or even months.

This game-changing battery life is made possible by the low power consumption of the RSL10 Bluetooth® 5 radio SoC and enhancements at the firmware level.

Alongside the RSL10, the platform features a 3-axis accelerometer and environmental sensors (motion, pressure and temperature) to provide valuable data and insights into an asset’s environment, condition and orientation. Each sensor is powered through a dedicated MOSFET load switch, controlled by the RSL10. This https://international.electronica-azi.ro

design enables the overall system power consumption to be controlled on a persensor basis, which decreases the total power used. Additional features of the platform include a low-cost antenna, matching circuit optimized for Bluetooth Low Energy transmissions, a multi-purpose dome switch and a 10-pin debugger that can be removed depending on the needs of the application.

“The next generation of RSL10-powered Bluetooth LE tags will allow Quuppa partners to leverage highly accurate, sensorenriched positioning data with unprecedented battery lifetime. This enables use-cases that haven’t been possible before due to the high cost of ownership,” said Santtu Pulli, Senior Customer Manager at Quuppa.

“Real-time asset visibility and related productivity optimization will become a key competitive advantage for companies in manufacturing, warehousing and logistics domains. This is just the beginning – the possibilities are endless!”

The RSL10 Asset Tag is available now through your local onsemi sales support.

The RSL10 was recently selected for use in an indoor localization beacon designed to track and monitor hospital equipment and provide actionable insight to healthcare providers. Blyott, an IoT solution provider, and Tatwah, a market leader in Bluetooth LE tags and beacons, developed the device. Blyott selected Tatwah’s RSL10-based beacons because of their small form-factor, ultralow-power capabilities and the ability of the IP67 tags to meet the stringent sterilization requirements.

Additional Resources & Documents: • Asset Management Solutions (https://bit.ly/3Ec7acZ) • RSL10 Asset Tag User Manual (https://bit.ly/3AekjzQ) • The Battery Life of Asset Tags- Why Five Months is Too Short (Blog) (https://bit.ly/3EfdWOS) • Creating Ultra-Low-Power Tags for IoT Asset Management with High-Accuracy Positioning (Blog) (https://bit.ly/2XaBROx) • Case Study: RSL10-based Beacon with Indoor Localization Tracks Essential Hospital Equipment (https://bit.ly/39cl8Nn) • How IoT Asset Management Technologies are Transforming Manufacturing (Video) (https://bit.ly/2Xcx3Z0)

“onsemi provided us with an ideal hardware platform to develop Bluetooth-based

onsemi https://www.onsemi.com 17

PRODUCT NEWS

Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform The need to combine performance with low power consumption in edge compute applications has driven demand for Field Programmable Gate Arrays (FPGAs) to be used as power-efficient accelerators while also providing flexibility and speeding time to market. However, a large majority of edge compute, computer vision and industrial control algorithms are developed natively in C++ by developers with little or no knowledge of underlying FPGA hardware. To enable this important development community, Microchip Technology Inc. has added an HLS design workflow, called SmartHLS, to its PolarFire FPGA families that greatly enhances productivity and ease of design by allowing C++ algorithms to be directly translated to FPGA-optimized Register Transfer Level (RTL) code.

FPGA business unit. “Together with our VectorBlox™ Neural Network Software Development Kit these tools will greatly improve designers’ productivity in creating cutting-edge solutions using C/C++ based algorithms for applications such as embedded vision, machine learning, motor control and industrial automation using FPGAbased hardware accelerators.”

times fewer lines of code than an equivalent RTL design, with the resultant code being easier to read, understand, test, debug and verify. The tool also simplifies exploration of hardware microarchitecture design trade-offs and enables a developer’s pre-existing C++ software implementations to now be used with PolarFire FPGAs and FPGA SoCs.

Based on the open-source Eclipse integrated development environment, the SmartHLS design suite uses C++ software code to generate an HDL IP component for integration into Microchip’s Libero SmartDesign projects. This enables engineers to describe hardware behavior at a higher level of abstraction than is possible with traditional FPGA RTL tools.

“SmartHLS enhances our Libero® SoC design tool suite and makes the vast benefits of our award-winning mid-range PolarFire and PolarFire SoC platforms accessible to a diverse community of algorithm developers without them having to become FPGA hardware experts,” said Bruce Weyer, vice president of Microchip’s

It further improves productivity while reducing development time through a multi-threading Application Programming Interface (API) that executes hardware instructions concurrently and simplifies the expression of complex hardware parallelism as compared to other HLS offerings.

The SmartHLS tool requires up to 10

About the PolarFire FPGA Family PolarFire FPGAs and FPGA SoCs solve difficult edge compute system design challenges by offering the industry’s lowest power at mid-range densities. The company recently announced low-density additions to its family that, by consuming half the static power of alternatives and providing the world’s smallest thermal footprint, enable developers to reduce system costs and meet thermal management requirements without forfeiting bandwidth.

These new FPGAs as well as the company’s SmartFusion® 2 FPGA and IGLOO® 2 FPGA are also supported by the new tool.

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Microchip Technology https://www.microchip.com Electronica Azi International | 3/2021

MPLAB® Cloud Tools Ecosystem Brings Secure, Platform-independent Development Workflow to PIC® and AVR® Microcontrollers Microcontroller (MCU) design is now easier than ever with the new MPLAB cloud tools ecosystem available today for PIC and AVR devices from Microchip Technology Inc. The free, all-in-one cloud platform combines easy, integrated search and discovery of example code, graphical configuration of projects and code debugging in a collaborative environment. This environment enables enterprise-scale rapid development while simplifying software design for users at all skill levels with an intuitive browser-based interface and cloud connectivity.

Microchip’s MPLAB cloud tools ecosystem incorporates three powerful components designed to modernize the development workflow for PIC and AVR microcontrollers.

Users can easily find fully-configured and complete source code, projects, examples and software applications using the intuitive catalog in MPLAB Discover. Selected code and projects instantly populate in the MPLAB Xpress Integrated Development Environment (IDE) for further development.

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MPLAB Code Configurator, with its easyto-use graphical configuration, offers point-and-click options to set up hardware peripherals and further configure projects.

Device setup is simplified with optimized peripheral libraries, modular downloads and updates. Developing, debugging and deploying project applications directly from any web browser can be completed without any software installation.

The enhanced MPLAB Xpress IDE delivers a powerful, scalable cloud infrastructure for development and debug along with community collaboration tools using secure GitHub repository interface controls. Designers have the option to download MPLAB Xpress projects to continue development in MPLAB X IDE. Seamless, quick access to MPLAB Discover and MPLAB Code Configurator is provided from the Xpress toolbar. The MPLAB cloud tools ecosystem, which has been designed as a front end to access these cloud tools based on the development flow the client is in, also has a quick start guide and overview of tools.

Online security is provided through tight integration with secure public and private GitHub repositories for saving and sharing source code, as well as through seamless import and export of online projects to local storage and secure myMicrochip login enabled for online sessions.

“To improve the development experience and help designers speed time to market, this new platform provides everything designers need to go from innovative idea to production,” said Rodger Richey, senior director of Microchip’s Development Tools business unit. “Unlike tools that require multiple software applications and complex installations, IDEs and services, this ecosystem has no installation requirement and was purposely developed as an intuitive, easy-to-use working environment.”

For more information on the MPLAB cloud tools ecosystem and supported devices, visit www.microchip.com/MPLABCloudTools Microchip Technology https://www.microchip.com Electronica Azi International | 3/2021

Renesas Launches 32-Bit RX671 MCUs Realizing High Performance and Power Efficiency with HMI Functions for Contactless Operation

PRODUCT NEWS

A Single-Chip Solution for a Wide Range of Needs That Combines Large Memory Capacity and an Ultracompact Package Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the RX671 group of 32-bit microcontrollers (MCUs), adding a new high-performance, high-functionality single-chip solution with touch sensing and voice recognition capabilities for contactless operation to the popular RX Family. Part of Renesas’ mainstream RX600 Series, the RX671 MCUs are built around an RXv3 CPU core operating at 120 MHz and integrates flash memory supporting fast read access at a clock speed of 60 MHz, for excellent real-time performance with a CoreMark score of 707, and power efficiency among the best in the class at 48.8 CoreMark/mA. Available in a wide variety of packages with pin counts ranging from 48 to 145 pins with up to 2 megabytes (MB) of flash memory and 384 kilobytes (KB) of SRAM, the RX671 MCUs are well suited for a wide range of applications that require advanced functionality, power efficiency, and compact size, such as heating, ventilation, and air conditioning (HVAC), smart meters, and smart home appliances. For size-constrained devices that require advanced functionality, the RX671 is available with 2 MB of flash memory in a 64-pin TFBGA package measuring only 4.5 mm × 4.5 mm – among the smallest anywhere among MCUs with 2MB flash memory.

The COVID-19 pandemic created new health and safety requirements that are https://international.electronica-azi.ro

transforming how people interact with their devices and environments, increasing the demand for hygienic contactless user interfaces in particular. The new RX671 MCU is optimized for contactless applications, integrating a capacitive touch sensing unit that combines high sensitivity with excellent noise tolerance and can be used to implement contactless proximity switches.

In addition, the serial sound interface can be used to connect digital microphones that support voice recognition over long distances. Used in combination with voice recognition middleware from Renesas’ RX ecosystem partners, these features enable developers to create contactless operation functions utilizing voice recognition in a short amount of time.

The RX671 integrates Renesas’ Trusted Secure IP as a part of its built-in hardware security engine which comprises an encryption engine with AES, RSA, ECC, and SHA support, a true random number generator (TRNG), and an encrypted key management mechanism. Combining these with the dual-bank function and protection function of the on-chip flash memory, allows users to implement capabilities such as secure firmware updates and secure boot.

Renesas also introduced two new evaluation boards with the RX671 group of MCUs. The Target Board for RX671 makes it easy to evaluate the RX671 without the need for a separate debugger; the Renesas

Starter Kit+ for RX671 supports detailed evaluation of the MCU’s main functions.

Both boards are equipped with connectors to the Wi-Fi Pmod Expansion Board (RTK00WFMX0B00000BE) for easy evaluation utilizing wireless network connectivity. The combination of Renesas Starter Kit+ for RX671 and the Wi-Fi Pmod Expansion Board is FreeRTOS-certified, allowing users to obtain certified sample programs from GitHub and try out using the RX671 in coordination with AWS without delay.

Renesas has combined the RX671 MCUs with its complementary power devices to create a complete Touchless Button Solution, which can be used to implement hygienic proximity switches on all kinds of devices to prevent viruses or dirt from adhering to the user’s fingers. The solution is part of Renesas’ “Winning Combinations” – comprehensive solutions that combine complementary Analog + Power + Embedded Processing product portfolios.

These certified solutions are engineered to help customers accelerate their designs and get to market faster. Renesas offers more than 250 Winning Combinations with compatible devices that work together seamlessly for a wide range of applications and end products. They can be found at renesas.com/win.

Renesas Electronics Corporation https://www.renesas.com 21

PRODUCT NEWS

Digi-Key Electronics Partners with Siemens to Distribute Automation and Control Products Digi-Key Electronics, which offers the world’s largest selection of in-stock and ready-to-ship electronic and automation components, announced that it has secured a distribution partnership with Siemens. to offer their wide range of automation and control products.

Siemens is the largest supplier of high-quality products for manufacturing automation and control applications, including automotive manufacturing, data centers, electronics manufacturing, healthcare, intralogistics, food and beverage, textiles and more. This partnership brings Siemens’ reliable, durable and easy-to-use products such as power supplies, human-machine interface (HMI) technology, programmable logic controllers (PLCs) and heavy duty switches to Digi-Key customers around the world.

Siemens’ future-focused software, hardware and powerful automation technologies – backed by global sales and support – covers the entire production process and offers maximum interoperability across all automation and control components.

“We are proud to partner with Siemens, the global leader in automation, to further our commitment to maintaining the world’s largest selection of automation products,“ said Eric Wendt, strategic program development director at Digi-Key. “Siemens’ leading-edge technology and broad product offering, combined with our extensive reach and inventory, will be a powerful combination.“ “e-commerce is one of our fastest growing industrial automation distribution channels in the U.S., and we’re proud to be launching our new partnership with Digi-Key,“ said Marla Davids, vice president of digital industrial sales at Siemens.

“Our customers expect greater flexibility and convenience now more than ever, and Digi-Key has the online product selection and unique engineering design tools that are important to their success. With Dig-Key’s special emphasis on new product introductions, we’re looking forward to further growth.“ For more information about Siemens and to order from their product portfolio, please visit the Digi-Key website. ►Digi-Key Electronics | https://www.digikey.com 22

Digi-Key Elect Announces 20 Back2School P

Sweepstakes Fosters Innovatio Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will hold their highly anticipated annual Back2School Prize Draw sweepstakes, which gives college students an opportunity to win prizes while using real-world tools and resources to learn about the field of engineering.

As part of the Back2School Prize Draw, students are invited to design and submit sketch concepts that improve on the student life, using electronic components and other products found on Digi-Key’s website. With some college campuses reopening this fall, students can envision products or projects intended to help smooth out the return to in-person education. Students can also develop and implement a design and provide a video or photo of the design to qualify for the grand prize category.

One grand prize winner will receive an InstaLab kit they can use to build prototypes of their concepts. The InstaLab is the turn-key kit for setting up a private lab, with all the key pieces of hardware included. The kit includes an oscilloscope, function generator, bench power supply, digital multimeter, 120 V soldering station, lead-free Solder, wire strippers and more.

The runner-up prize is a Lulzbot 3D printer and next tier winners will receive a Back to School kit that includes a Fume Extractor, an Adafruit Parts Pal, Seeed Grove Arduino Kit, a Sparkfun Deluxe tool kit, a Benchtop Power Supply, and an Analog Discovery 2.

Electronica Azi International | 3/2021

tronics 021 Prize Draw

on and Learning for Students Additionally, all participants can enter their name and contact information to be eligible to win a PyGamer, an entrylevel handheld for DIY gaming. The content of the prize kits may vary depending on the applicant’s region, but the prize will be of equivalent value.

“We’re thrilled to announce the return of our Back2School Prize Draw, which inspires students to build products that solve realworld problems through hardware engineering and automation,” said YC Wang, global academic program director at Digi-Key. “Giving them the components they need offers an excellent way to advance their skills and promote their longterm interest in engineering.”

“At Digi-Key, we’re eager to empower the next generation of innovators,” said David Sandys, director of technical marketing at Digi-Key. “We’re proud to promote and host educational competitions such as this one that spark ideas for future engineers.”

The sweepstakes is open to any student with a university or college email address. To learn more or enter the Back2School Prize Draw, visit Digi-Key’s website here.

Submissions are open from August 25th through November 11th, 2021, and winners will be announced shortly after the November 11th deadline. ►Digi-Key Electronics https://www.digikey.com https://international.electronica-azi.ro

Digi-Key Electronics Launches Power Focus Campaign with Power Integrations Collaboration Provides Users Enhanced Power Conversion and Efficienc As part of its Power Focus campaign, Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, is collaborating with Power Integrations, a leading innovator in semiconductor technologies for high-voltage power conversion, to offer Power Integrations’ InnoSwitch™3 IC family with PowiGaN™ technology.

This technology delivers high-impact performance for demanding consumer and industrial applications while simultaneously reducing energy consumption.

As more applications increase their reliance on smart devices and power automation, demand for higher-efficiency solutions with stronger thermal performance is rising and GaN is quickly replacing silicon. PowiGaN is Power Integrations’ internallydeveloped technology that allows InnoSwitch3 ICs to achieve 95% efficiency across the full load range and up to 100 W in enclosed adapter implementations without heat sinks.

“We are excited to work with Digi-Key to make our InnoSwitch3 ICs available to such a broad, global audience,” says Trevor Hiatt, channel marketing director at Power Integrations.

“GaN technology is revolutionizing the power electronics industry and the number of applications requiring PowiGaN levels of efficiency and integration is growing. Digi-Key’s ability to reach the worldwide engineering audience is invaluable in allowing us to support customers of any scale.”

David Stein, vice president of global supplier management at Digi-Key agrees: “This campaign with Power Integrations demonstrates our ongoing commitment to working with industry leaders to offer components that are more efficient, more compact and lighter than silicon alternatives, and will power faster, more efficient, and diverse applications.”

For more information about Power Integrations and to order from their product portfolio, please visit the Digi-Key website. ►Digi-Key Electronics | https://www.digikey.com 23

Compiler Update for HighTec C/C++ Development Platform for Infineon AURIX TC4xx for Safety-relevant Applications HighTec EDV-Systeme GmbH presents a new version of the compiler of the HighTec C/C++ Development Platform for Infineon’s AURIX TC4xx. The current version 5.3.0 convinces with a complete integration of the TC4xx family, its even faster build system and the advanced code optimizations based on the architecture-specific functions of the AURIX microcontrollers. Sub-processors like HSM, GTM/MCS or PPU and other application specific architectures are also fully supported.

With the compiler update, HighTec accelerates the development and certification of safety-relevant applications, for example in industrial automation, but especially in driver assistance systems and functions for autonomous driving.

HighTec is the only compiler provider to be an “Infineon Preferred Design House”; the HighTec C/C++ Development Platform is used by leading automotive manufacturers and Tier One suppliers.

The HighTec C/C++ Development Platform is a multi-architecture and multi-core compiler suite with support for TriCore, AURIX, AURIX 2G, Power Architecture (PowerPC), Arm, RISC-V and Renesas architectures. The compiler is based on the innovative LLVM open-source compiler technology developed by major IT companies; it is available for both Windows and Linux platforms. Extension with third-party Eclipse plug-ins is quite easy, as is integration into custom IDEs using the command line version. The integrated Content Manager of the HighTec C/C++ Development Platform allows fast access to BSP (Board Support Package), integrated examples, safety libraries and driver packages such as MCAL and ILLD (Infineon Low Level Driver). Through the HighTec Library Qualification Kit, standard libraries that can be utilized without open-source license restrictions can be used for safety applications. For the tool qualification of the C/C++ compiler according to ISO26262 ASIL D and IEC 61508 SIL 3, HighTec offers their customers a Tool Qualification Kit (Q-Kit).

Numerous examples, tutorials and training documents help developers get started and work with the HighTec C/C++ Development Platform. The new compiler version 5.4.0 for the HighTec C/C++ Development Platform for Infineon AURIX TC4xx is now available, also as evaluation version. ►HighTec EDV Systeme | https://www.hightec-rt.com 24

IAR Systems enables Advantech to innovate smart industrial IoT edge devices IAR Systems®, the future-proof supplier of software tools and services for embedded development, announced that its development tools have enabled Advantech, a global leader in Industrial Internet of Things (IIoT) technology, to successfully develop their latest remote I/O data acquisition module, ADAM-6300.

ADAM-6300 is able to serve as an intelligent network node in an IoT application, to meet the needs of environmental monitoring, make application configurations easier and faster and assist companies in their digital transformation.

The rapid development of IIoT has led to a substantial growth in the demand for smart edge devices. Advantech’s ADAM6300 is an OPC UA remote I/O data acquisition module that does not require an external gateway, and can be directly connected to SCADA, database or public cloud services. It supports OPC UA (Open Platform Communications Unified Architecture) function and includes built-in hardware security protection. ADAM-6300 is highly recommended for applications such as water treatment, machine management, and production process monitoring.

Electronica Azi International | 3/2021

PRODUCT NEWS

IAR Systems extends development tools performance capabilities for Andes RISC-V cores Using IAR Embedded Workbench has helped Advantech to deliver smart solutions that strengthen production management efficiency and enable digital transformation “Advantech has been working with IAR Systems tools for more than 16 years, because of its extensive support for MCUs, stable products and the fact that it meets Advantech’s requirements for development of industrial products,” said Adam Lin, Senior R&D Manager Industrial Internet of Things Business Group, Advantech. “ADAM-6300 can be seen as a representative work of Advantech brand and as an industry pioneering work, since it was implemented the way that it originally would need to run on a PC rather than on an embedded platform. And this could only have been developed and realized through the use of IAR Embedded Workbench.”

“The industrial-grade products developed by Advantech have very high requirements for stability, and it is a great match with IAR Embedded Workbench to provide stable product quality and service,” said Chris Lin, Sales Manager Taiwan, IAR Systems. “We are honored to have Advantech using our tools to realize the integration of IoT edge devices. With new smart monitoring function, we look forward to continue assisting Advantech in their innovations for industrial IoT applications.”

IAR Embedded Workbench is a complete development toolchain with powerful code optimizations capabilities, which enables developers to generate small, fast code, improving the execution performance as well as reducing power consumption. Combined with its extensive debugging features, developers are to make their product development more efficient.

IAR Systems®, the future-proof supplier of software tools and services for embedded development, presented a new version of its professional development tools for RISC-V. With the latest release, the complete development toolchain IAR Embedded Workbench® for RISC-V adds support for latest Andes RISC-V extension and devices, enabling maximized performance in RISC-V-based applications.

Through its excellent optimization technology, IAR Embedded Workbench for RISC-V helps developers ensure the application fits the required needs and optimize the utilization of on-board memory. With the support of the AndeStar™ V5 RISC-V Performance Extension, developers can use IAR Embedded Workbench to create applications with increased performance and reduced code size. The toolchain supports all Andes 32-bit V5 RISC-V cores, including the N22, N25F, D25F, A25, A27, N45, D45 and A45. The RISC-V Packed SIMD/DSP extension specification (RVP draft) and the corresponding intrinsic functions as well as Andes DSP libraries are supported.

IAR Embedded Workbench for RISC-V is a complete C/C++ compiler and debugger toolchain with everything embedded developers need integrated in one single IDE. To ensure code quality, the toolchain includes C-STAT® for static code analysis. C-STAT proves code alignment with industry standards like MISRA C:2012, MISRA C++:2008 and MISRA C:2004, and also detects defects, bugs, and security vulnerabilities as defined by CERT C and the Common Weakness Enumeration (CWE). For companies working with safety-critical applications, IAR Embedded Workbench for RISC-V is available in a functional safety edition certified by TÜV SÜD according to IEC 61508, ISO 26262, IEC 62304, EN 50128, EN 50657, IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119, delivering qualified tools, simplified validation and guaranteed support through the product life cycle.

More information about IAR Systems and Advantech is available at www.iar.com/customer_advantech.

More information about IAR Systems’ offering for RISC-V is available at www.iar.com/riscv.

►IAR Systems | https://www.iar.com

►IAR Systems | https://www.iar.com

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Use Sensorless Vector Control with BLDC and PMS Motors TO DELIVER PRECISE MOTION CONTROL

Author: Rolf Horn Contributed by Digi-Key's North American Editors

The need for precise motion control is growing across applications such as robotics, drones, medical devices, and industrial systems. Brushless DC motors (BLDCs) and AC driven permanent magnet synchronous motors (PMSMs) can deliver the required precision, while also meeting the need for high efficiency in a compact form factor. However, unlike brushed DC motors and AC induction motors, which are easy to connect up and run, BLDCs and PMSMs are much more complex.

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This article briefly describes some of the needs for precision motion control and reviews the differences between brushed DC, AC induction, BLDC and PMSMs. It then summarizes the basics of vector control before introducing several platforms and evaluation boards from Texas Instruments, Infineon Technologies and Renesas Electronics, along with design guidance that facilitates the development of precision motion control systems.

For example, techniques such as sensorless vector control (also called field-oriented control, or FOC), in particular, offers excellent efficiency together with the advantage of eliminating the sensor hardware, thereby reducing costs and improving reliability. The problem for designers is that sensorless vector control is complicated to implement, so its use can extend development times, adding cost and possibly missing timeto-market windows.

To solve this dilemma, designers can turn to development platforms and evaluation boards that already have the sensorless vector control software baked in, enabling them to focus on system design issues and not get bogged down in the nuances of coding the control software.

In addition, these development environments include all of the motor controller and power management hardware integrated into a complete system, speeding time to market.

Electronica Azi International | 3/2021

DESIGN SOLUTIONS » Sensorless Vector Control

MOTOR CHOICES Basic DC motors and AC induction motors are relatively inexpensive and simple to drive. They are widely used in a broad array of applications from vacuum cleaners to industrial machinery, cranes and elevators.

However, while they are inexpensive and easy to drive, they cannot provide the precision operation required by applications such as robotics, drones, medical devices, and precision industrial equipment.

A simple brushed DC motor generates torque by mechanically switching the direction of current in coordination with https://international.electronica-azi.ro

rotation using a commutator and brushes.

Shortcomings of brushed DC motors include the need for maintenance due to wear of the brushes and the generation of electrical and mechanical noise.

A pulse-width-modulation (PWM) drive can be used to control the speed of rotation, but precision control and high efficiency are difficult due to the inherently mechanical nature of brushed DC motors.

Figure 1

© Texas Instruments

Drones typically use four or more motors, typically BLDCs or PMSMs, spinning at 12,000 revolutions per minute (RPM) or higher, and are driven by an electronic speed controller (ESC). This example shows an ESC module in a drone using a brushless motor with sensorless control.

© Texas Instruments

Figure 2

A stationary multi-axis industrial robot has to deliver different amounts of force in three dimensions in order to move objects of varying weights and coordinate its activities with other robots on the assembly line.

Figure 3

© Texas Instruments

EXAMPLES OF PRECISION MOTION CONTROL APPLICATIONS Drones are complex motion control systems and typically employ four or more motors. Precise and coordinated motion control is needed to enable a drone to hover, climb, or descend (Figure 1).

To hover, the net thrust of the rotors pushing the drone up must be balanced and exactly equal to the gravitational force pulling it down. By equally increasing the thrust (speed) of the rotors, the drone can climb straight up. Conversely, decreasing the rotor thrust causes the drone to descend. In addition, there’s yaw (spinning the drone), pitch (flying the drone forward or backward) and roll (flying the drone to the left or right).

Precise and repetitive motion is one of the features of many robotics applications. A stationary multi-axis industrial robot has to deliver different amounts of force in three dimensions in order to move objects of varying weights (Figure 2). Motors inside the robot supply variable speed and torque (rotational force) at precise points, which the robot’s controller uses to coordinate motion along different axes for exact speed and positioning.

In the case of wheeled mobile robots, a precise differential drive system can be used to control both the speed and direction of motion. Two motors are used to provide motion along with one or two caster wheel(s) to balance the load. The two motors are driven at different speeds to achieve rotation and changes in direction, while the same speed for both motors results in straight line motion, either forward or backward. While the motor controllers are more complex when compared with a conventional steering system, this approach is more precise, mechanically simpler, and therefore more reliable.

A PMSM motor generates a sinusoidal Ebemf, while a BLDC generates a trapezoidal Ebemf wave.

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MOTION CONTROL

A BLDC eliminates the commutator and brushes of brushed DC motors, and depending on how the stators are wound, it can also be a PMSM. The stator coils are wound trapezoidally in a BLDC motor, and the back electromotive force (EMF) produced has a trapezoidal wave form, while PMSM stators are wound sinusoidally and produce a sinusoidal back EMF (Ebemf) (Figure 3).

Torque in BLDC and PMSM motors is a function of current and back EMF. BLDC motors are driven with square wave current while PMSM motors are driven with sinusoidal current.

BLDC motor features: • Easier to control with six-step square wave DC currents • Produces significant torque ripple • Are lower cost and performance than PMSMs • Can be implemented with Hall effect sensors or with sensorless control PMSM features: • More complex control using three-phase sinusoidal PWM • No torque ripple • Higher efficiency, torque and cost than BLDC • Can be implemented with shaft encoder or with sensorless control WHAT IS VECTOR CONTROL? Vector control is a variable-frequency motor drive control method in which the stator currents of a three-phase electric motor are identified as two orthogonal components that can be visualized with a vector. One component defines the magnetic flux of the motor, the other the torque.

At the core of the vector control algorithm are two mathematical transforms: the Clarke transform modifies a threephase system to a two-coordinate system, while the Park transform converts two-phase stationary system vectors to rotating system vectors and their inverse.

Use of the Clarke and Park transforms bring the stator currents that can be controlled into the rotor domain. Doing this allows a motor control system to determine the voltages that should be supplied to the stator to maximize the torque under dynamically changing loads.

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High-performance speed and/or position control requires real-time and precise knowledge of rotor shaft position and velocity in order to synchronize the phase excitation pulses to the rotor position.

This information has typically been supplied by sensors such as absolute encoders and magnetic resolvers attached to the shaft of the motor. These sensors have several system disadvantages: lower reliability, susceptibility to noise, more cost and weight, and higher complexity. Sensorless vector control eliminates the need for speed/position sensors.

High-performance microprocessors and digital signal processors (DSPs) enable modern and efficient control theory to be embodied in advanced system modeling, ensuring optimal power and control efficiency for any real-time motor system.

It is expected that as a result of the increasing computational power and declining costs of microprocessors and DSPs, sensorless control will almost universally displace sensored vector control, as well as simple but lower performance single-variable scalar volts-per-hertz (V/f) control.

DRIVING THREE-PHASE PMSM AND BLDC MOTORS FOR INDUSTRIAL AND CONSUMER ROBOTICS To get around the complexity of vector control, designers can use ready-made evaluation boards. For example, the DRV8301-69M-KIT from Texas Instruments is a DIMM100 controlCARD-based motherboard evaluation module that designers can use to develop three-phase PMSM/ BLDC motor drive solutions (Figure 4). It includes the DRV8301 three-phase gate driver with dual current shunt amplifiers and a buck regulator, and an InstaSPINenabled Piccolo TMS320F28069M microcontroller (MCU) board.

The DRV8301-69M-KIT is an InstaSPIN-FOC and InstaSPIN-MOTION Texas Instruments technology-based motor control evaluation kit for spinning three-phase PMSM and BLDC motors. With InstaSPIN, the DRV8301-69M-KIT allows developers to quickly identify, automatically tune, and control a three-phase motor, providing an “instantly” stable and functional motor control system.

Together with InstaSPIN technology, the DRV8301-69M-KIT provides a high-performance, power-efficient, cost-effective sensorless or encoder sensor-enabled FOC platform that speeds development for

quicker time to market. Applications include sub 60 volt and 40 ampere (A) synchronous motors for driving pumps, gates, lifts, and fans, as well as industrial and consumer robotics and automation.

Figure 4

Designers can develop three-phase PMSM/ BLDC motor drive solutions using the DRV8301-69M-KIT motor kit which includes a DRV8301 and an InstaSPIN-enabled Piccolo TMS320F28069M MCU board. © Texas Instruments

The DRV8301-69M-KIT hardware features: • A three-phase inverter baseboard with interface to accept DIMM100 controlCARDs • A DRV8301 three-phase inverter integrated power module (with integrated 1.5 A buck converter) base board supporting up to 60 volts and 40 A continuous • The TMDSCNCD28069MISO InstaSPINFOC and InstaSPIN-MOTION cards • The ability to work with MotorWare supported TMDXCNCD28054MISO (sold separately) and TMDSCNCD28027F + External Emulator (sold separately) HIGH-PERFORMANCE, HIGH-EFFICIENCY PMSM AND BLDC MOTOR DRIVES The EVAL-IMM101T from Infineon Technologies is a full-featured starter kit that includes an IMM101T Smart IPM (integrated power module) that provides a fully integrated, turnkey, high-voltage motor drive solution that designers can use with high-performance, high-efficiency PMSM/BLDC motors (Figure 5). The EVAL-IMM101T also includes other necessary circuitry required for “out-of-thebox” evaluation of IMM101T Smart IPMs, such as a rectifier and EMI filter stage, as well as an isolated debugger section with USB connection to a PC. Electronica Azi International | 3/2021

DESIGN SOLUTIONS » Sensorless Vector Control

The EVAL-IMM101T was developed to support designers during their first steps developing applications with an IMM101T Smart IPM. The eval board is equipped with all assembly groups for sensorless FOC. It contains a single-phase AC connector, EMI filter, rectifier and three-phase output for connecting the motor. The power stage also contains source shunt for current sensing and a voltage divider for DC link voltage measurement.

24 VOLT MOTOR CONTROL EVAL SYSTEM Designers of 24 volt PMSM/BLDC motor drives can turn to Renesas’ RTK0EM 0006S01212BJ motor control evaluation system for the RX23T microcontrollers (Figure 6).

The IMM100 series integrates either a 500 volt FredFET or a 650 volt CoolMOS MOSFET. Depending on the power MOSFETs employed in the package, the IMM100 series covers applications with a rated output power from 25 watts (W) to 80 W with 500 volt/600 volt maximum DC voltage. In the 600 volt versions, the Power MOS technology is rated at 650 volts, while the gate driver is rated at 600 volts, which determines the maximum allowable DC voltage of the system.

RX23T microcontrollers operate over the range of 2.7 to 5.5 volts, and are highly compatible with the RX62T line at the pin arrangement and software level.

The kit includes: • • • • • • •

Infineon’s IMM101T offers different control configuration options for PMSM/BLDC drive systems in a compact 12 × 12 millimeter (mm) surface mount package, minimizing external component count and printed circuit board (pc board) area.

The package is thermally enhanced such that it can perform well with or without a heatsink. The package features a 1.3 mm creepage distance between the high-voltage pads beneath the package to ease surface mounting and increase the robustness of the system.

In addition, due to the core, the current consumed in software standby mode (with RAM retention) is only 0.45 microamperes (μA).

Figure 6

Renesas’ 24 volt motor control evaluation system for the RX23T microcontroller includes an inverter board to drive the PMSM that’s included in the evaluation package. © Renesas Electronics

The RX23T devices are 32-bit microcontrollers suited for single inverter control with a built-in floating point unit (FPU) that enables them to be used to process complex inverter control algorithms.

This helps to greatly reduce the manhours required for software development and maintenance.

Figure 5

24 volt inverter board PMSM control function Three-shunt current detection function Overcurrent protection function CPU card for RX23T microcontroller USB mini B cable PMSM

CONCLUSION BLDC and PMSMs can be used to deliver precision motion control solutions that are compact and highly efficient. The use of sensorless vector control with BLDC and PMS motors adds the advantage of eliminating the sensor hardware, thereby reducing costs and improving reliability.

However, sensorless vector control in these applications can be a complex and time-consuming process.

As shown, designers can turn to development platforms and evaluation boards that come with sensorless vector control software. In addition, these development environments include all of the motor controller and power management hardware integrated into a complete system, speeding time to market.

RECOMMENDED READING • “Field Control Leads to Better AC Motor Efficiency” • “The Next Evolutionary Step in Drone Design”

►Digi-Key Electronics https://www.digikey.com

The IMM101T eval board is a complete solution including a motion control engine (MCE 2.0), gate driver, and 3-phase inverter capable of driving PMSM and BLDC © Infineon Technologies motors using sensorless FOC. https://international.electronica-azi.ro

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Multitasking at the edge Author: Andreas Bergbauer, Senior Product Line Manager at congatec AG

In the past, there was rarely a need to put much emphasis on a high number of cores as most established embedded systems had little parallel processing to do.

With Industry 4.0 and IIoT digitization, this picture has dramatically changed. IoT gateways and edge computers can hardly get enough cores. Thanks to AMD Ryzen™ Embedded V2000 processor technology and RTS hypervisor support, congatec’s new COM Express Type 6 modules are perfect for these IoT gateway application needs.

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Electronica Azi International | 3/2021

DESIGN SOLUTIONS » New IoT gateway modules

And last but not least, OPC-UA communication must be managed – in real time and with TSN support.

CONTROL AND IOT GATEWAY IN ONE SYSTEM Nowadays, existing machines and systems are often retrofitted with these and many other new functions using external gateway systems. In new OEM designs to be embedded into machines and systems, control and GUI tend to get integrated directly. In the interest of hardware consolidation, such new solutions allow the integration of all the various functions in one system. Sometimes, even several production cell controls are condensed in a single system. The controls still communicate via Ethernet, but often it’s a matter of one virtual machine talking to another. Only the sensors and vision systems as well as the actuators/drives of the manufacturing robots are then distributed in the production cell itself. Communication is

increasingly taking place over real-time IP, often using simple single-pair Ethernet cabling via 10BASE-T1S or 10BASE-T1L. The choice between S or L then boils down to whether the system must communicate across no more than 25 meters in discrete manufacturing, or up to 1000 meters in the process industries. However, implementations increasingly include over IP functionality and thanks to TSN support also cater for deterministic real time.

LESS THAN 1 WATT TDP PER CORE IS POSSIBLE Will such high integration necessitate the installation of air-conditioned server rooms in production cells? Fortunately, not! First, because new COM-HPC server modules that provide rugged edge servers with entry-level data center performance will soon be available.

And second, because the number of cores in client systems has also increased from the standard 2 to 4, to up to 8.

►

© Ekkasit919 / Dreamstime.com / congatec

Figure 1: With up to 8 cores, AMD Ryzen Embedded V2000 based Computer-on-Modules can process many tasks in parallel.

Previously, classic x86 embedded systems used to consolidate at the very most control and HMI in one system – if there was any task consolidation at all. Today, Industry 4.0 and IIoT digitization demand many additional gateway and edge computing tasks, to read and analyze all the data, transcode logs, send alerts, and so on. Access to multiple instances also needs managing – from devices and users to administrators, both on behalf of the customer and the OEM. Locally as well as remotely. With VPN, encryption, firewall, whitelisting, intrusion detection and other security features. https://international.electronica-azi.ro

c

ate

ng

o ©c

Figure 2: To consolidate multiple edge applications in one system, congatec’s Server-on-Modules support real-time hypervisor technology from Real-Time Systems.

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EMBEDDED COMPUTING

Multifunctional industrial edge gateways are therefore a major application area.

With up to 40% more GPU performance for up to 4x 4k60 graphics and full GPGPU support, machine vision and machine learning systems are further target markets.

In embedded systems that need real time – which many industrial applications in Industry 4.0 environments do – it is no longer possible to simply place a container above the operating system to effectively encapsulate the individual tasks.

FANLESS AND PASSIVELY COOLED SYSTEMS The new AMD Ryzen Embedded V2000 processor is of course also a great choice for actively cooled systems with 54 watt TDP. However, it is not uncommon for customers to require fanless and passively cooled systems with 15 watt TDP or even less. The goal of such strict power limitations is to enable extremely rugged, fully enclosed systems for reliable 24/7 operation in harsh environments.

Instead, real-time control requires full and exclusive hardware access. Real-time multitasking therefore needs real-time capable hypervisor technology as offered

by Real-Time Systems.

All x86 Computer-on-Modules from congatec support hypervisor technology by default, and the company also takes care of customer implementation in collaboration with developers from Real-Time Systems. © AMD

Importantly, these systems still don’t require fan cooling. The current flagship processor for such systems is the new AMD Ryzen™ Embedded V2000 processor, which features up to 8 cores and supports up to 16 threads. congatec offers it on space-saving COM Express Compact Type 6 Computer-on-Modules. With twice the performance of the earlier AMD Ryzen™ Embedded V1000 processors, the modules set a new performance-per-watt benchmark that according to AMD tests yields the highest performance gains in 15 watt TDP designs. If the TDP of the AMD Ryzen™ Embedded V2718 is throttled down to 10 watt, solutions that consume as little as 1.25 watt TDP per x86 core are possible, not factoring in other features such as graphics cores. The out-

Figure 3: AMD Ryzen Embedded V2000 processors vs. 9th and 10th generation Intel Core i7 processors. Since the performance advantage is distributed over 8 cores, the new processors are literally predestined for multitasking at the edge. standing performance leap of this lowpower platform was validated with the Cinebench R15 nt cross-platform test suite simulating real-world application scenarios. Compared to modules with AMD Ryzen™ Embedded V1608B processors, conga-TCV2 modules deliver 97% (V2516) to 140% (V2718) more performance on up to 8 cores. Thanks to the new 7nm Zen 2 cores, single-core performance is also up by 25% to 35%. This makes the new modules a perfect fit for the diverse tasks of 24/7-connected fanless embedded systems deployed across a wide range of industrial edges.

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For such applications, the performance per watt gains delivered by the new AMD Ryzen Embedded V2000 processors are ideal. And since these gains are closely linked to the higher number of cores, V2000 processors are predestined for use as multitasking platforms at the edge.

All in all, this makes it theoretically possible to integrate a dedicated control on each of the new Computer-on-Module’s 8 cores and to operate these controls independently, so when one needs rebooting, this does not affect the real-time capability of the other virtual machines.

HYPERVISORS ARE ESSENTIAL FOR MULTITASKING But how do you integrate all these different tasks – especially when control design must be deterministic and TSNsupported real-time communication via Ethernet is required?

FLEXIBLE SYSTEM DESIGN FOR EVERY APPLICATION In practice, there will be system installations hosting one or more real-time controls in separate virtual machines of the RTS hypervisor to allow deterministic control of each robot in a production cell.

Electronica Azi International | 3/2021

DESIGN SOLUTIONS » New IoT gateway modules

For all other tasks, one or more additional virtual machines can be opened, and container virtualization implemented above their OS. This can be done using Docker, an open-source software for isolating applications wherever real-time is not required.

Such a solution is extremely convenient, as the containers en bloc contain all the data required to deploy the application.

As a result, these data files are also easier to install and transport, which ultimately simplifies resource management. When flexible resource allocation with RTS realtime hypervisor technology and Docker container virtualization are coupled with the resource scaling opportunities a

demands-based choice of suitable modules provides, it becomes easy to create perfectly tailored edge computers and IoT gateways, and to adapt to constantly changing demands. As the TDP is configurable, developers can also scale it to match the exact system requirements.

Available in two 6- and 8-core variants, the new AMD Ryzen Embedded processors currently rank top of the embedded client class with a TPD that is scalable from 10 to 54 watt across the family.

THE FEATURE SET IN DETAIL The new conga-TCV2 Computer-onModules with AMD Ryzen Embedded V2000 processors offer 6 to 8 cores and

feature 4MB L2 cache, 8MB L3 cache and up to 32GB energy-efficient and fast dual-channel 64-bit DDR4 memory with up to 3200 MT/s and ECC support for maximum data security. The integrated AMD Radeon™ graphics with up to 7 processing units can be used as GPGPU. However, it also supports up to four independent displays with up to 4k60 UHD resolution over 3x DisplayPort 1.4/HDMI 2.1 and 1x LVDS/eDP, making it an extremely powerful GUI for machines and systems as well as control station and control room computers.

Other performance-oriented interfaces include 1x PEG 3.0 x8 and 8x PCIe Gen 3 lanes, 4x USB 3.1, 8x USB 2.0, up to 2x SATA Gen 3, 1x Gbit Ethernet, 8 GPIO I/Os, SPI, LPC, and 2x legacy UART provided by the board controller. The modules support the RTS Hypervisor as well as the Microsoft Windows 10, Linux/Yocto, Android Q, and Wind River VxWorks operating systems. The integrated AMD Secure processor helps with hardwareaccelerated RSA, SHA and AES encryption and decryption, which is important for safety-critical applications. TPM support is also provided onboard.

More information about the new highperformance conga-TCV2 COM Express Compact Type 6 module is available at: https://www.congatec.com/en/products/com-express-type6/conga-TCV2/

►congatec https://www.congatec.com

© congatec

Figure 4: The new high-performance conga-TCV2 COM Express Compact modules with Type 6 pinout are based on the latest AMD Ryzen Embedded V2000 multicore processors and come in 4 different variants.

Processor

AMD Ryzen™ Embedded V2748 AMD Ryzen™ Embedded V2718 AMD Ryzen™ Embedded V2546 AMD Ryzen™ Embedded V2516 https://international.electronica-azi.ro

Cores/ Clock [GHz] L2/L3 GPU TDP [W] Threads (base/boost) Cache Compute (MB) Units 8 / 16 2.9 / 4.25 4/8 7 35 – 54 8 / 16 1.7 / 4.15 4/8 7 10 – 25 6 / 12 3.0 / 3.95 3/6 6 35 – 54 6 / 12 2.1 / 3.95 3/6 6 10 – 25

The author reserves the right to publish this text on the company website, in other, noncompeting publications, or in other languages. However, a second parallel placement in a direct competitive environment is excluded. Alternative agreements can be made at any time if required.

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Suitable for a variety of parameters

Author: Edgar Schaefer Automotive FAE On the road to autonomous driving, cars are being equipped with an increasing number of sensors. Magnetic field sensors based on the Hall Effect offer several advantages over other measuring principles and technologies. Current models also meet the more stringent requirements of ISO 26262:2018. Hall sensors detect the voltage difference that results when a magnetic field is applied to a semiconductor perpendicular to the direction of flow of the electric current. Since this Hall voltage is directly proportional to the strength of the magnetic field, the sensors, together with a permanent magnet, can indirectly measure numerous variables, e.g. rotation, speed, distance, pressure, angle, and fill level. Since the sensor measures the strength of a magnetic field around a conductor with a steady flow of current, it can also measure current without contact. Similarly, it also detects the other parameters without contact, meaning that it operates without any wear and tear and therefore reliably delivers precise measurements, even in long-term operation.

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Simple Hall sensors are often used as switches, e.g. in seat belt buckles, windshield wipers, or engine switching systems.

In this context, a threshold value for the magnetic field strength is saved in the sensor. If the detected value reaches this threshold, the switching state of the sensor changes. For example, Melexis’ MLX92241, with its built-in blocking capacitors, makes a local board-less design possible with operation directly on a cable harness, e.g. for detecting whether the seat belt is fastened. Its EEPROM memory can store customer-specific threshold values for the switching points, output polarity, Ioff current, and temperature compensation coefficient for the magnetic material. The programmable negative temperature coefficient can be used to compensate for the behavior of permanent magnets that become weaker at high temperatures. The Hall sensor elements are equipped with safety mechanisms to protect against electrostatic discharge, reverse polarity, and thermal overload. They meet the requirements of ASIL A.

LINEAR HALL SENSORS ALSO MEASURE DISTANCES AND ROTATION Hall sensors with linear output signals are necessary to measure distances or rotational movements. They not only recognize the states “on” and “off,” but also output an analog signal proportional to the magnetic field strength. The A/D converter, which is integrated into either the MCU or the Hall sensor, converts the analog signal into a digital signal. To control other system components, the MCU then outputs a proportional pulse-width modulated (PWM) signal or a data stream compatible with the SENT automotive sensor bus system. Some of the latestgeneration Hall sensors have the PWM interface and the SENT interface built right into the sensor itself.

When using Hall sensors that merely detect the magnetic field perpendicular to the chip plane, large and cost-intensive additional assemblies are often required. More advanced solutions integrate an increasing number of sensors as well as signal processing and calculation functions, often eliminating the need for additional components and allowing additional parameters to be measured. For example, vertical Hall sensors detect not only the magnetic field perpendicular to the direction of the current, but also that parallel to the direction of the current or to the chip plane.

Electronica Azi International | 3/2021

DESIGN SOLUTIONS » Magnetic field sensors

In addition to the amplitude of the magnetic field, 2D sensors also detect its direction.

This can be used to determine an engine’s direction of rotation, for example. For example, the Hall-based Xensiv TLE4988C from Infineon makes it possible to quickly measure the position of the camshaft. One major benefit for module manufacturers is the reduced dependence on rare-earth backbiased magnets; the sensor is optimized for Fe, SmCo, and NdFe, for example.

Automatic in-vehicle calibration takes the tolerances of ferromagnetic wheels and magnetic encoders as well as the mounting tolerances of the sensor takes into account, thereby ensuring extremely accurate sensing in real application environments. The TLE4988C comes inside a PG-SSO-3-52 camshaft sensor package with Sn plating as well as a 3-wire voltage I/F and increased supply/output capacitance of 220/1.8nF for higher EMC robustness.

The Xensiv TLE5501 analog angle sensor from Infineon is based on TMR (tunneling magnetoresistive) technology. It features high detection sensitivity with a high output voltage, eliminating the need for an internal amplifier and allowing the sensor to be connected directly to the microcontroller. In addition, TMR technology features minimal temperature drift, which reduces the need for external calibration and compensation. The TLE5501 uses 360° angle measurement to detect the orientation of a magnetic field by measuring the sine and cosine angle components using TMR elements. It outputs the raw signals as a differential output signal. Due to the high bridge output voltage, additional signal amplification is not necessary. The TLE5501 is available in AEC-Q100 and automotive ASIL versions and is suitable for angular position sensing, steering angle sensing, safety applications, and BLDC motor commutation.

THE THIRD DIMENSION 3D Hall sensor technology combines lateral and vertical Hall sensors and as a result, can detect the strength of the magnetic field in all three dimensions.

This type of sensor makes it possible to detect the absolute rotary or linear position of each moving magnet.

The MLX92256, for example, is equipped with lateral sensing. Designed specifically for use in window lift systems, it integrates a voltage regulator, two Hall sensors – one with IMC (integrated magnetic concentrator) and both with an advanced www.international.electronica-azi.ro

offset cancellation system – and two open-drain output drivers all in a single package. It is available in two versions.

The MLX92256LSE-AAA-000 toggles the pulse signal when there is a change in the lateral or vertical component, while the direction pin only changes in the event of a change in direction. The MLX92256LSEABA-000 is equipped with two speed outputs, one for the perpendicular field and one for the lateral field.

The MLX90371/MLX90372 Triaxis position sensors from Melexis are now available in the third generation. They combine a magnetic Triaxis Hall front-end, an analog/digital signal conditioner, a DSP (digital signal processor) for signal processing, and an output stage driver. They are immune to stray fields up to 4 kA/m (or 5 mT) as they occur as a result of the increasing electrification of vehicles, especially electric and

(configurable as a high/low-side switch), and the HAL 3980 with a PSI5 interface.

The sensors can suppress external magnetic stray fields by using an array of Hall plates. Only a simple two-pole magnet is required to measure a rotation angle, ideally placed over the sensitive area in an end of-shaft configuration. ´The sensors can also be used for off-axis measurements. They can measure an angular range of 360°, linear movements, and a 3D position, making them ideal for steering angle position sensing. Depending on the device, it is possible to transmit temperature-compensated values of BX, BY, BZ, or up to two calculated angles. The HAL-39xy sensors operate in an ambient temperature range from –40°C to +160°C; they are ASIL B-ready and designed as SEooC according to ISO 26262 for automotive applications.

© Infineon Technologies

hybrid vehicles. Since they can also work with a weak magnetic field, smaller and cheaper magnets are sufficient. This not only results in cost benefits, but also space savings. The MLX90371 is an ASILB SEooC (safety element out of context) to ISO 26262 and offers an analog or PWM output. The MLX90372 is an ASIL-C SEooC to ISO 26262 and has a SENT or PWM output.

Both meet the EMC requirements of automotive OEMs and are specified for operating temperatures up to 160°C. For applications with particularly stringent safety requirements such as accelerator pedal position sensing, the MLX90372 is also available in a “dual die” (fully redundant) TSSOP-16 package for redundant sensing.

TDK-Micronas offers a programmable 3D sensor family for position sensing. It consists of three members: the HAL 3900 with an SPI interface, the HAL 3930 with a PWM/SENT interface and switch output

RUGGED AND RELIABLE The examples show that not only have tremendous advancements been made in sensor technology to meet the increasing demands in cars, but that their design has also evolved. Many of the latest models also meet the more stringent guidelines of ISO 26262:2018, some as ASIL-C SEooCs. Redundancy and safety functions contribute to this as well as measures to improve EMC. Corresponding packages ensure the sensors are resistant to moisture, dust, and dirt. For use in high-temperature environments, Hall sensors are specified for operating temperatures of up to 170°C. As a result of these features, they play a key role on the road to autonomous driving. ►Rutronik https://www.rutronik.com

35

POWER SUPPLIES

What’s the right wireless tool for the job?

How to navigate the many wireless options in the market and select the best solution for every application.

When there is a task to complete around your home, like hanging a picture or tightening a chair leg, you need the right tools to get the job done. After all, you’ll have a poor result if you try to fix a loose chair leg with a hammer. We can look at wireless technologies the same way.

Each technology has specific benefits that align well with certain tasks, and rarely does one tool work in every circumstance. So, let’s open your tool box and examine the best use for each of these wireless tools: Bluetooth® Low Energy, Wi-Fi™, LoRa® and IEEE 802.15.4™.

Author: Jason Tollefson, Sr. Product Marketing Manager

OPEN YOUR TOOL BOX Bluetooth Low Energy Through the use of our smart phones, we have become more familiar with Bluetooth. We use apps to connect to speakers, door locks, exercise equipment and many other products. The Bluetooth Low Energy (BLE) standard offers interoperability, low power consumption, an easyto-use user interface and ranges up to 30100 meters. That’s why it’s a go-to technology for many products that involve a human user and their phone.

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Wi-Fi If there was one universal wireless technology, it would be Wi-Fi. We find free Wi-Fi in hotels, airports, coffee shops and now in the cars we buy. Wi-Fi is popular because it is fast, secure and great for sending and receiving data across networks. Home Telecom notes that 802.11n speeds for single antenna devices is roughly 25-50 Mbps in real world environments. Compare that to under 2 Mbps for Bluetooth Low Energy 5.

While it has good range, most of us would

say it is not good enough. For Wi-Fi, this is one of its greatest opportunities for improvement. Lifewire states that a typical 802.11n 2.4GHz network range is roughly 46 meters indoors. Not bad, but when you switch to a 5GHz network, that range will be reduced to just 15 meters.

LoRa LoRa is receiving a lot of buzz around its entry into the wireless market. The term is short for “Long Range,” and it definitely Electronica Azi International | 3/2021

DESIGN SOLUTIONS » The right wireless tool

lives up to its name. LoRa networks can communicate up to 10 kilometers, making it the king of long-distance communication for IoT. Another powerful attribute of LoRa is its low power consumption, making it suitable for remote battery powered sensors.

In contrast to Wi-Fi and BLE, LoRa requires a dedicated network infrastructure, much like our mobile phones. You can set up your own network gateways, or lease bandwidth with a network provider. Another contrast is its throughput. LoRa network throughput is measured in kilobits per second, far lower than Wi-Fi or Bluetooth, but suitable for sensors, simple commands and control.

Throughput (Mbps)

IEEE 802.15.4 IEEE 802.15.4 is the basis for Zigbee® and MiWi™ protocols. It can support 2.4GHz or Sub-GHz frequencies, each with slight advantages over the other. This wireless technology forms “mesh networks” and was designed to solve key problems in battery powered networks like power consumption, reliability, persistence and range.

Many factors can disturb wireless networks like human movement, changes in the environment, dead batteries and temporary interference. When these disturbances occur, mesh networks based on 802.15.4 can selfheal. This feature dramatically improves the robustness of the network and therefore the reliability of the communication.

Range Power Infrastructure (meters) Consumption

Nodes in mesh networks based on 802.15.4 also offer increased persistence.

They have the ability to sleep, ceasing transmission for extended periods of time. Unlike network technologies such as Ethernet or Wi-Fi which “age-out” uncommunicative nodes within the network, 802.15.4 networks feature permanent membership.

Throughput for IEEE 802.15.4 networks ranges from 100 Kbps to 1 Mbps depending on configuration and protocol selected. These networks are proprietary and feature little to no interoperability with existing infrastructure. A summary of attributes is shown in Table 1 below.

Interoperability

Wi-Fi

High >25

15-50

High

Common

Very High

Bluetooth Low Energy

Med 1-2

30-100

Medium

Common

Very High

Med Low 0.1-1

40+

Very Low

Proprietary

Low

Low 0.1

10,000

Very Low

Proprietary or Operator

High

IEEE 802.15.4 LoRa

Available Products ATWINC1500 ATWILC1000 RN4678 RN4870 ATSAMR21 (2.4 GHz) ATSAMR30 (Sub-GHz) ATSAM34

Table 1: Summary of Wireless Attributes

GRAB YOUR TOOL AND GET TO WORK Now that we’ve identified the strengths of each wireless tool, the next step is to determine the best way to interface with these products for optimal operation.

Microchip Technology offers four varieties of wireless product interfaces; UART, SPI, SDIO and Standalone.

Wi-Fi

Bluetooth Low Energy IEEE 802.15.4 LoRa

The first three are used with a host, such as an MCU, microprocessor or FPGA. The Standalone device is an “all-in-one” device that combines an MCU and radio into one package or module.

Microchip has even created drivers and ASCII interpreters for interface products

Throughput (Mbps) High >25 Med 5-11 Med 8-10 Med 1-2 Med Low 0.1-1 Low 0.1

to help simplify the use of hosted devices. With the Standalone device, the wireless protocol can merge with your own code for a compact, customized solution.

Table 2 shows the types of available interfaces for wireless tools.

Interface Typical Host Available Products SDIO Linux MPU/FPGA ATWILC1000, ATWINC1500, ATSAMW25 SPI MCU Standalone ASCII (UART) 8-/16-/32-bit MCU RN4678, RN4870 Standalone ATSAMR21 (2.4 GHz), ATSAMR30 (Sub-GHz) Standalone ATSAM34

Table 2: Interfaces Available for Wireless Products

A JOB WELL DONE Whether it’s leveraging a sleek mobile phone user interface with Bluetooth Low Energy or achieving high data throughput with Wi-Fi and an SDIO/MPU host, selecting the best tool for your application is key.

Applying the right tool to the task helps save precious design time, accelerate time to market and increase revenue. https://international.electronica-azi.ro

For more information, visit: https://www.microchip.com/en-us/products/wireless-connectivity

►Microchip Technology https://www.microchip.com 37

PRODUCT NEWS

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application Nexperia, the expert in essential semiconductors, has announced that one of its surface-mount device packages – the clip-bond FlatPower package CFP15B – has, for the first time, passed Board Level Reliability (BLR) testing for automotive applications by a leading Tier 1 supplier.

Initially, it will be used in an engine control unit.

BLR provides a means of evaluating the robustness and reliability of semiconductor packages. The rigorous testing procedure is especially relevant in automotive applications, where safety and reliability are critical. Accreditation is particularly important as the industry shifts towards more electric and connected vehicles, increasing the complexity of onboard electronic systems.

“BLR verification is an important milestone,” said Guido Söhrn, Nexperia’s Product Manager for Power Bipolar Discretes. “The CFP15B represents the latest generation of thermally-enhanced, ultra-thin surfacemount devices. Its versatility and reliability 38

make it the perfect choice for automotive components such as engine control units, transmission control units and many other safety applications such as braking.”

BLR verification confirmed that CFP15B exceeded twice the level of reliability performance that would be expected in accordance with AEC-Q101. Power temperature cycles, combining temperature cycling and intermittent operating life tests, saw the device achieve a qualification of 2,600 cycles. “The automotive sector presents some tough applications for surface-mount devices, and CFP15B proved itself under the harshest conditions,” added Guido Söhrn.

The CFP15B is manufactured from the highest-grade materials. It provides zero delamination in the areas around the leads, die and clip, therefore eliminating moisture ingress and increasing reliability.

CFP15B’s thermal resistance is reduced by featuring a solid copper clip. This optimizes the transfer of heat into the PCB, allowing compact PCB designs. The device is up to 60 per cent smaller than

DPAK and SMx packages, with no compromise on thermal behavior. The small sizing presents huge space-saving options and therefore increases design flexibility.

The device package is used by different power diode technologies such as Nexperia’s Schottky or recovery rectifiers but can also be extended to Silicon Germanium power diodes or bipolar transistors. It offers significant product diversity, covering single/dual configuration and between 4-20 A, simplifying board design.

For more information visit www.nexperia.com/cfp You can also view Nexperia’s power diode technologies and CFP15B in action at Nexperia’s Power Live Event 21 – 23 September www.nexperia.com/power-live For more information on the MPLAB cloud tools ecosystem and supported devices, visit Nexperia https://www.nexperia.com Electronica Azi International | 3/2021

COSEL expands its value added STMGF DC/DC converter platform with 80W unit for industrial applications COSEL Co, Ltd. announced the addition of an 80W DC/DC converter to its value added STMGF platform. Available in two versions, the STMGFS80 covers all industrial voltages from 9V to 76V. Using COSEL’s efficient MGFS80 DC/DC converter assembled on a carrier board, the STMGFS80 series fits in the same footprint as its predecessor, which previously only delivered 30W. Ready to use out of the box, the STMGFS80 includes terminal blocks, output voltage potentiometer, input filter and extra capacitors. The series complies with safety standards UL62368-1 and C-UL EN62368-1.

Battery powered industrial applications require very efficient power solutions, and system developers are seeking to reduce the number of references when selecting a power supply. They also want easily mountable power sources such as DC/DC converters within their equipment.

By combining COSEL’s high efficiency, wide input range DC/DC converter modules with a robust mechanical platform, its Value Added STMG platform offers designers an easy way to acquire the benefits of a high quality power solution in an industrial mount packaging.

The STMGFS80 series is available in two models. The STMGFS8024 operates from 9VDC to 36VDC, embracing 12 and 24V systems, and the STMGFS8048 works from 18VDC to 76VDC, covering industrial 24 and 48V systems. Four output volthttps://international.electronica-azi.ro

ages are available, 3.3V/18A ; 5V/16A ; 12V/6.7A and 15V/5.4A. Output volage can be adjusted by a potentiometer included on the motherboard.

All modules include an ON/OFF remote control function via an interface connector. Negative logic is the standard method used to control ON/OFF via the remote function, although positive logic RC can be provided on request (Option R).

Benefiting from COSEL’s high efficiency topology, the STMGFS80 has a typical efficiency of up to 92%.

The COSEL STMGF platform offers a quick solution to system designers requiring reliability and performances to power industrial applications Optimized for convection cooling, the power supplies can be operated within an ambient temperature range of -20 to +70 degrees centigrade. Depending on the assembly method and ventilation levels across the final equipment, a derating may apply as specified in the technical documentation.

The STMGFS80 series includes overvoltage and overcurrent protection. In the case of overcurrent exceeding 105% rating, the module operates in hiccup mode and automatically recovers when the output current returns to normal.

For safety and galvanic isolation, the STMGFS80 series has 1,500VDC Input and RC to Output, 1,000VDC Input and RC to FG and 1,000 VDC Output to FG.

STMGFS80 can be assembled directly to a customer’s equipment chassis by fixing the base plate using the two mounting holes. It can also be clipped to a DIN rail chassis by ordering the option (N2).

Additional options e.g., plastic cover (N1) or combined DIN and cover (N3) will be available early Q2-2022

Open frame type, the STMGFS80 series measures 52 × 29 × 117mm (2.05 × 1.14 × 4.61 inches) and weighs 170g max.

The STMGFS80 complements the 15W STMGFS15 and the 30W STMGFS30, offering a wide range of options and possibilities to systems designers. To simplify system upgrades, the STMGFS80 fits in the same footprint as the STMGFS30.

The STMGFS80 series has a five-year warranty and conforms to the European RoHS, REACH and Low Voltage Directives.

Related links: https://www.coseleurope.eu/ Products/DC-DC/STMGFS Cosel Group https://www.coseleurope.eu 39

Power Integrations’ New SCALE-iFlex LT Plugand-Play Gate Driver Improves EconoDUAL IGBT Module Performance by 20% Power Integrations, the leader in gatedriver technology for medium- and highvoltage inverter applications, announced its new plug-and-play SCALE-iFlex™ LT dual gate-drivers. The new drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range.

Thorsten Schmidt, product marketing manager at Power Integrations commented: “Dynamic and static current sharing is critical for robust operation of mod40

ules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions.”

Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical

paralleling, efficiency and protection.

The new SCALE-iFlex LT gate-driver modules reduce switching losses by three to five percent, due to the fast turn-on and turn-off of the SCALE-2 ASIC which features an integrated booster stage. Power Integrations’ Advanced Active Clamping (AAC) protection enables higher DC link voltages to be achieved. A full suite of other protection features, including short-circuit, are provided. Drivers feature reinforced isolation to 1700 V and may be ordered naked or conformally coated.

As well as renewable energy, other applications include power quality, commercial air-conditioning units and medium-voltage drives.

The new SCALE-iFlex LT gate drivers are available now. For more information, please visit www.power.com/scale-iflex-lt.

Power Integrations https://www.power.com Electronica Azi International | 3/2021

PRODUCT NEWS

Power Integrations Introduces SCALE-iFlex Single Plug-and-Play Gate Drivers for “New Dual” Modules SCALE-2 technology optimizes footprint, improves efficiency, performance and reliability of power inverters and converters to 3300 V Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, announced SCALE-iFlex™ Single gate-drivers for the popular “New Dual” 100 mm × 140 mm IGBT modules. The compact new drivers support modules up to 3.3 kV and are available now for design-in. The SCALEiFlex Single gate-drivers are ideal for lightrail, renewable energy generation and other high-reliability applications that demand compact, rugged driver solutions.

Thorsten Schmidt, product marketing manager at Power Integrations commented: “SCALE-iFlex Single gate-drivers fit the outline of the latest standard IGBT power modules including the Mitsubishi LV100/HV100, Infineon xHP2 and xHP3, https://international.electronica-azi.ro

ABB LinPak, Hitachi nHPD2 and other similar products.“ SCALE-iFlex Single gate-drivers use Power Integrations’ SCALE-2™ ASIC technology which dramatically reduces component count compared to conventional products. The ASIC also provides Advanced Active Clamping (AAC) over-voltage protection during normal operation, a substantial improvement over simple soft shut down, which adds extra protection in case of short-circuit during turn-on.

Devices are conformally coated and feature reinforced isolation. Isolated housings ensure isolation between modules when they are mounted side-by-side.

Devices are pre-qualified according to rail-

way standards IEC 61373 – Class 1B (shock & vibration) and IEC 61000-4-x (EMC tests) and IEC 60068-2-x (serial environmental tests). Burn-in is optionally available.

The new gate drivers are rated at 20 A peak output current per channel at 85 °C ambient temperature with no air flow.

Higher power levels are possible with cooling or a lower ambient temperature.

Both electrical and fiber-optic interfaces are available.

The SCALE-iFlex Single gate-drivers are available for sampling now.

For more information, please visit www.power.com/products/scale-iflexsingle/.

Power Integrations https://www.power.com 41

iSYSTEM introduces Sampling-based Profiling within winIDEA Software Analyzer iSYSTEM introduces a new feature of their IDE, debug and software analyzer tool winIDEA: The Sampling-based Profiling allows developers to carry out timing analysis via the debug interface of microcontrollers and processors with limited trace options or hardware trace resources. Via Program Counter (PC) and Data Sampling, developers can statistically measure and monitor CPU utilization, load distribution and data signals over time to test their application.

The new feature is simple to use with any kind of microcontroller or processor and streamlines software development and test especially for safety applications in various markets like automotive, healthcare, and industrial automation.

Sampling-based Profiling is part of the winIDEA Software Analyzer. With this function, the developer obtains data by sampling specific memory locations or the CPU Program Counter via the debug interface – without the need for any trace hardware. The profiler also analyzes the retrieved data and visualizes the results. iSYSTEM has implemented support for two main use cases: PC Sampling and Data Sampling. The iSYSTEM Profiler samples data on program execution and calculates the CPU Utilization in percent for each function to calculate the function load. OS Running Task and ISR Load Profiling gives insights to OS Task and ISR Load distribution. In both cases, the developer will run samples until the statistics stabilize.

This provides a very good indication about the load situation in the system and helps the developer to judge if the application is running as expected or not. The third option of Sampling-based Profiling – which is not really related to Timing Analysis and less practical – is to build a kind of an oscilloscope for monitoring data signals over time.

Sampling-based Profiling does not replace real hardware trace as it cannot guarantee that all relevant events are captured. However, it is the perfect tool for statistical analysis or for sampling slowly changing variables in a system and helps developers to further streamline their testing effort. ►iSYSTEM | https://www.isystem.com 42

iSYSTEM introduces Infineon AURIX™ TC377TE Emulation Adapter Debugging and tracing for 32-bit MCUs without trace capabilities iSYSTEM, Schwabhausen near Munich, introduces an Infineon AURIX™ TC377TE Emulation Adapter. This new adapter provides full debug and trace capabilities for Infineon’s 32-bit AURIX™ TriCore™ microcontrollers TC333, TC334 and TC364, which either do not offer a trace port or lack full trace capability. This helps embedded software developers to unburden their application from the most difficult code defects and timing issues – even when the target MCU is not yet at hand.

Tracing is a debug technology used by embedded developers to record microcontroller activity in real time. It provides a non-intrusive, deep insight into the embedded software without influencing real-time application behavior.

Figure 1: Typical setup of a development system using an emulation adapter Electronica Azi International | 3/2021

PRODUCT NEWS

This helps developers to debug their applications from the the most difficult code defects and to perform advanced timing analysis, measuring code coverage and the CPU load. However, not all MCUs have trace capabilities – this is where an emulation adapter offers a real added value.

To use iSYSTEM’s Infineon AURIX™ TC377TE Emulation Adapter, the developer simply swaps it with the original microcontroller on the board. The adapter offers the same core features as the MCU but comes with additional trace ports which provide detailed insight into the execution over time including timeline information.

The emulation adapter can even be used for standalone operation, which means a huge benefit for developers whose target hardware is not yet available, e.g., because it is still in development, or manufacturing, or on a colleague’s desk. The emulation adapter can simply be used for development instead.

Further Links and Resources • Infineon AURIX™ TC377TE Emulation Adapter User manual: https://www.isystem.com/files/content/downloads/documents/hardware-reference-manuals/IEA-TC377TE.pdf • All available iSYSTEM emulation adapters: https://www.isystem.com/products/hardware/emulationdebug-adapters/emulation-adapters.html • Start tracing with iSYSTEM tools tutorial: https://www.isystem.com/support/tutorials/start-tracing-withisystem-tools.html • Introduction to Tracing video: https://www.youtube.com/watch?v=EyZtnIOOhe4 There are three fundamental concepts for timing analysis: First a purely statistical analysis based on sampling certain objects within the software. Second, you could do some measurement, either on-chip or off-chip. Off-chip would, for instance, be that you toggle a pin and measure the timing with an oscilloscope.

On-chip measurement can either be performed via core performance counters within the chip or also by using some generic counters. But in any case, this approach requires an instrumentation of the code, meaning dedicated software needs to be added to the actual software to be analyzed to control this measurement hardware. But at least this approach yields exact and reliable results.

Figure 2: Infineon AURIX™ TC377TE Emulation Adapter connection scheme With the Infineon AURIX™ TC377TE Emulation Adapter developers can speed up the development on TC333, TC334 and TC364 devices. A conversion board which comes with the emulation adapter, serves as an adjustment for the different packages of the original microcontroller. iSYSTEM’s emulation adapter supports DAP (Device Access Port), DAPE (additional DAP) and Aurora Gigabit Trace (AGBT) debug and trace interfaces.

“We are currently working on a second type of this emulation adapter to support even more Infineon AURIX™ TC3x devices, e.g., TC337LP, TC367DP, TC377TP, and more”, said Erol Simsek, CEO of iSYSTEM. “For this we have created the world’s first 292BGA-to292BGA emulation adapter – which allows for even deeper testing and development of embedded software.”

Figure 3: Fundamental concepts for timing analysis.

The blue marked parts of the graphic show what is realised by iSYSTEM Tools The third approach is based on Trace. Trace-based Timing Analysis provides the maximum of information and analysis options. The unique thing about Trace is that it allows an exact reconstruction of sequences of various events over time. From this information you can derive a complete set to timing metrics, you can analysis CPU load over time, analyze event-chains and function call sequences. So, it provides a full insight into time-related software execution. ►iSYSTEM | https://www.isystem.com

The Infineon AURIX™ TC377TE Emulation Adapter is available via https://www.isystem.com. https://international.electronica-azi.ro

43

New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption Advanced military platforms, ocean-bottom survey systems and remote sensing applications all require precise timing for mission success. Chip Scale Atomic Clocks (CSACs) ensure stable and accurate timing even when Global Navigation Satellite Systems (GNSS) time signals are unavailable. Helping industrial and military system designers to meet this requirement, Microchip Technology Inc. (Nasdaq: MCHP) announced its new SA65 CSAC, providing precise timing accuracy and stability in extreme environments.

Microchip’s SA65 CSAC is an embedded timing solution with improved environmental ruggedness, delivering higher performance than the previous SA.45s CSAC, including double the frequency stability over a wider temperature range and faster warm-up at cold temperatures. The SA65 has an operating temperature range of 40 to 80 degrees Celsius (°C) and a storage temperature range of -55 to 105°C. The warm-up time of two minutes at -40°C is 33% faster than that of the SA.45s.

44

Together, these SA65 CSAC performance improvements benefit designers of highlyportable solutions for military applications such as Assured Position, Navigation and Timing (A-PNT) and command, control, communications, computers, cyber, intelligence, surveillance and reconnaissance (C5ISR) requiring precise frequencies generated by a low Size, Weight and Power (SWaP) atomic clock. Improvements such as fast warm-up to frequency after cold start, temperature stability over a wide operating range, and frequency accuracy and stability enabling extended operation while GNSS is denied help to ensure mission success in conflict environments.

The SA65 CSAC is the world’s lowestpower commercial atomic clock and provides precise timing for portable and battery-powered applications requiring continuous operation and holdover in GNSSdenied environments. The SA65 is form-, fit- and function-compatible with the SA.45s, which minimizes risk and redesign costs for the system developer

while improving performance and environmental insensitivity.

As a world leader in the research, development and manufacture of timing and synchronization solutions, Microchip has delivered more than 275,000 rubidium clocks, 138,000 CSACs, 12,500 Cesium clocks and 200 active hydrogen masers to customers worldwide.

Development Tools The CSAC family of atomic clocks is supported by Developer Kit 990-00123-000, as well as associated software, a user guide and technical support.

Availability Complete product information about the SA65 CSAC is available at microchip.com.

To purchase Microchip’s Chip Scale Atomic Clock products mentioned here, visit Microchip’s purchasing portal.

Microchip Technology https://www.microchip.com Electronica Azi International | 3/2021

Renesas Reimagines Remote Design With Enhanced Lab on the Cloud Environment

PRODUCT NEWS

Cloud-Connected Lab Accelerates Board Configuration with Advanced New GUI and Testing for Voice, Mobile, and other Complex Applications Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced today that it has expanded its popular Lab on the Cloud environment to simplify the configuration and testing process and speed time to market. Renesas has enhanced its cloudconnected lab with new advanced GUI features and new design parameters that create a more engaging and ergonomic user experience, and offer designers greater configuration flexibility.

Lab on the Cloud enables customers to remotely access, configure, test, monitor, and measure Renesas solutions instantly 24/7 in a full-fledged, cloud-connected lab. It includes evaluation boards for popular devices, proof of concept boards from Renesas’ Winning Combinations, and other solutions from Renesas partners.

Users can access the physical lab through a convenient PC-based GUI that instantly enables them to immediately begin configuring and testing designs without requiring a physical board in hand.

The new user-friendly GUI introduces new parameters for control and additional results for monitoring. The ergonomic lab layout, advanced features, and intuitive user interface make it easier for users to quickly navigate the environment. For instance, the centralized live camera feed gives users a live view of the complete lab setup and results, including https://international.electronica-azi.ro

the ability to zoom in and out on realtime testing and data capture readings.

Advanced implementations in test setups and control for voice recognition, mobile application, and power supply enable users to complete complex testing such as transient performance in just a few clicks of the mouse.

Renesas also added several new options for components such as the Renesas Femtoclock2 point-of-use timing devices, the smallest and lowest power <100fs clock generation and jitter attenuation solution available on the market. Providing customers with Lab On the Cloud accessibility makes testing these high-performance devices easier than ever, accelerating designs and ensuring that even the most stringent performance requirements are met. In addition, Renesas added several new sections to the Lab on the Cloud suite including timing, power supply, voice recognition and control, healthcare, safety and surveillance, industrial communication, and IEEE 1588/5G computing and communication.

“As application requirements continue to change rapidly, customers are looking for a powerful yet flexible and easy-to-use approach to design configuration and testing,” said DK Singh, Senior Director of the System and Solutions Team at Renesas.

“We are continually working to make designing with Renesas products easier

and faster, and the enhanced Lab on the Cloud environment takes product selection and testing capabilities to the next.”

Renesas has also introduced 14 popular evaluation boards to the Lab on the Cloud environment. The Renesas Lab on the Cloud now boasts 23 different boards addressing diversified application segments with a variety of devices.

The new boards are: • High efficiency IoT battery system • Industrial CAN Sensor Network • Voice Recognition Solutions • Capacitive Liquid Level Indicator • Multi-Purpose Air Quality Sensor Solution • Ultra-Low Power RE01 Voice recognition for IoT edge • FemtoClock2 Evaluation Kit • Surveillance Camera with CMOS Sensor • IEEE 1588 Solution • Household Smoke Detector • Simplified Contactless Thermometer • 80V Dual Synchronous Buck Controller Evaluation Board • Super Capacitor Based Terminal Backup Power Supply • Flexible MCU-based 6-Channel Power Sequencer https://www.renesas.com/labonthecloud https://www.renesas.com/WIN Renesas Electronics Corporation https://www.renesas.com 45

Rehm Product Portfolio - (© Rehm Thermal Systems)

PRODUCT NEWS

“Eight processes, infinite possibilities” – Rehm at productronica 2021 in Munich After an almost two-year break due to the pandemic, the eagerly awaited first international industry meeting with numerous exhibitors – hailing mainly from Europe – is an important indicator for the state of electronics production. The industry has already recovered significantly after the coronavirus downturn and is taking off with new ideas, technologies, and solutions. At productronica, held from 16 to 19 November at the Munich Exhibition Centre, Rehm Thermal Systems will present the highlights of its product portfolio and show how eight processes can be turned into an infinite number of possibilities. Come along! The Rehm team would be delighted to see you at Stand 335 in Hall A4.

Rehm will be presenting the following systems at productronica 2021: VisionXP+: Top quality and maximum flexibility: that’s what the convection soldering systems of the Vision series stand for. The most powerful system, the VisionXP+, now makes convection soldering with or without a vacuum even more efficient! At productronica, we will present the highlights of VisionXP+.

Besides already proven EC fan motors, the use of which makes the system both quieter and more sustainable, these also include reduced nitrogen consumption as well as the cooling zone.

In addition, an instrument for monitoring thermal profiles during soldering is integrated into the VisionXP+ via the ViCON system software: ProMetrics. It checks how well the previously created profile corresponds to the required, predefined specifications. The process window index (PWI) ascertained in this way is a statistical measure that quantifies the quality of a 46

thermal process. This is mostly determined by the specification of the solder paste and the most heat-sensitive component. The following applies as a general rule: the lower the PWI, the better the profile and thus the more efficient and stable the process. The generation of real-time data for each component allows the exact determination of the assembly position and reliably detects any deviations or delays in the soldering system.

of up to 400 °C. For a stable, reliable and flux-free soldering process, the inert carrier gas (N2) can be enriched with formic acid (HCOOH) and routed into the process chamber. The formic acid bubbler has a level control to ensure the saturation level remains consistent (saturation level of the N2 gas depends on the level in the formic acid bubbler). The Nexus thus not only benefits the soldering process, but also all other thermal processes.

CondensoXC: The CondensoXC condensation soldering system is a space-saving, powerful system – making it ideally suitable for laboratory applications, small series production and prototyping. The injection principle of the CondensoXC enables precise profiling, while the inert atmosphere also ensures optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option – thereby increasing the reliability of assemblies significantly. With its small footprint, the CondensoXC is specially designed for small series and is ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.

ProtectoXP/XC: Our selective Protecto conformal coating and dispensing system protects sensitive electronic assembly groups against damage by corrosion or other environmental influences such as humidity, chemicals or dust. The core of the Protecto systems is its coating management in conjunction with nozzle technology. Up to four coating applicators are used – with diverse options. At productronica, we will be presenting the Protecto systems with our ViCON system software.

Nexus: The Nexus contact soldering system from Rehm Thermal Systems guarantees best results in reflow soldering processes using contact heat under vacuum. This enables the Nexus to meet the highest requirements in the field of advanced packaging and power electronics. The contact soldering system under vacuum is also best suited for void-free soldering of different components (e.g.

IGBT) on DBC substrates. The substances are usually joined from different raw materials under vacuum at temperatures

RDS UV drying system: Declining cycle times during the coating process today require faster hardening times, which can be optimally implemented with the help of UV drying systems. Rehm Thermal Systems responded to this trend by developing the new RDS UV, a compact dryer, especially for hardening UV coatings and UV adhesives. UV coatings are solvent-free, and therefore particularly easy to process and environmentally friendly.

They are increasingly used as corrosion protection for electronic components in the automotive industry.

Rehm Thermal Systems https://www.rehm-group.com Electronica Azi International | 3/2021

Microchip Unifies Management of “Terrestrial Time” and “Live-Sky Time” Sources to Enable Resilient Timing for Critical Infrastructure Today’s 5G wireless infrastructure has more complex, higher-density synchronization needs than previous-generation networks and is highly dependent on the integrity of “livesky” timing signals from the Global Navigation Satellite System (GNSS). Microchip Technology Inc. announced it has integrated its BlueSky GNSS Firewall with its TimePictra 11 synchronization monitoring and management platform to protect 5G networks and other critical timing infrastructure from Global Positioning System (GPS) signal jamming and spoofing while providing single-console visibility across the entire timing architecture.

In addition to requiring precise timing from GNSS sources, critical infrastructure operators need accurate timing to be distributed across their networks so they can ensure reliable performance and service delivery. TimePictra provides full control and monitoring for resilient timing architectures created with Microchip’s broad product portfolio including its TimeProvider® 4100 grandmasters for 5G network synchronization. It also monitors the health and performance of these networks’ distributed Precision Time Protocol (PTP) client clocks. Integrating BlueSky GNSS Firewall management into the TimePictra console view now gives operators a unified picture of the entire timing architecture and all timing sources.

Beyond supporting 5G deployments, TimePictra enables aviation, railway and maritime ports with a regional, national or global view of GNSS reception. TimePictra in combination with BlueSky GNSS Firewalls monitor key GNSS observables to detect live sky signal anomalies and deliver early alerting so that operators can engage alternate procedures that do not rely on GNSS. These capabilities are increasingly important where public safety is dependent on the position and navigation for daily operations. ►Microchip Technology | https://www.microchip.com 48

22 kW reference design for an industrial general purpose motor drive combines Infineon’s latest technologies In power electronics and the semiconductor market the system approach is gaining momentum. To support this trend, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a pretested industrial reference design which reduces the time to market significantly. The reference design is a general purpose motor drive which features a nominal power of 22 kW and can be operated directly on a 380 to 480 V threephase grid. The design can be fully re-used for customization and allows customers to evaluate Infineon’s products under real operating conditions. It is suitable for applications like pumps, fans, compressors, and conveyor belts.

The design combines Infineon’s latest technologies in one system: It includes the EasyPIM™ 3B IGBT7 module FP100R12W3T7_B11 for high current and high-power density, the EiceDRIVER™ Compact 1ED3131MC12H for optimal EMI performance and low-power losses as well as the XENSIV™ current sensor TLI4971-A120T5 for measuring high currents with minimal power loss.

Electronica Azi International | 3/2021

PRODUCT NEWS

The CoolSiC™ MOSFET IMBF170R1K0M1 with a blocking voltage of 1700 V is the central part of the auxiliary power supply. The system also contains two microcontrollers – the XMC4800 for control and the XMC4300 for communication, including a pre-installed software package for motor control. This combination allows the evaluation of these products in one design and experience their interaction.

To complete the modular approach, the system is optionally available with a 3D-printed housing, which encloses all electronic components and the cooling system. The housing includes a touchscreen to display current operation conditions, as well as EtherCAT and USB interfaces for external connections.

Availability The reference design REF-22K-GPD-INV-EASY3B can be ordered now. More information and the full design package are available at www.infineon.com/gpddrive.

Mouser Electronics Sponsors Innovate FPGA Design Contest Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, proudly announces that it is a Gold Sponsor of the InnovateFPGA Design Contest, which runs from July 1, 2021, to June 23, 2022. The contest, also supported by valued manufacturer partners Intel®, Analog Devices, and Terasic, centers on the theme of Connecting the Edge for a Sustainable Future and is open to entrants 18 years and older worldwide.

Working in teams of up to three members, contestants will create solutions that reduce the environmental impact and demand placed on the planet’s resources through the intelligent use of FPGAs in edge and cloud computation. The contest features regional top prizes of $1,500 and a trip to San Jose, California, for a chance to win the $5,000 grand prize.

To create their entries, contestants will use Terasic DE10Nano FPGA Cloud Connectivity Kit with Analog Devices plug-in cards, connecting to the cloud using selected Microsoft Azure Cloud Services. All submitted projects should be based on, and make complete use of the Terasic kit, with rewards for full use of the contest platforms, including products from Microsoft and Analog Devices.

To view the full list of products and contest rules, and to register for the InnovateFPGA Design Contest, visit https://eng.info.mouser.com/intel-adi-innovatefpga-designcontest.

►Infineon Technologies | https://www.infineon.com https://international.electronica-azi.ro

►Mouser Electronics | https://www.mouser.com 49

PRODUCT NEWS

New eBook from Mouser Electronics and Amphenol Explores the Interconnects, Sensors, and Antennas Required for IIoT Mouser Electronics, Inc. announces a new eBook in collaboration with Amphenol Corporation, highlighting the many applications of the Industrial Internet of Things (IIoT) as well as the technical challenges in developing IIoT solutions. In Enabling the Industrial IoT Revolution, subject matter experts from Mouser and Amphenol offer detailed insights into topics including industrial data centres; heating, ventilation, and cooling (HVAC) systems; and indoor air quality systems as well as smart manufacturing, intelligent automation, construction, and mining.

The new eBook from Mouser and Amphenol offers six indepth articles exploring some of the most fascinating challenges facing IIoT design. The infographic showcases products such as IP-rated waterproof and ruggedised RF connectors that enable wireless connectivity in the harshest environments. The eBook also features other Amphenol IIoT solutions, such as the Amphenol ICC Minitek MicroSpace™ crimp-to-wire connector system, a vibration-tolerant product known for its high locking strength that supports a broad range of industrial applications, such as robotics, automated guided vehicles, navigation systems, and industrial cameras, as well as factory lighting and HVAC. Amphenol MCP’s PCB antennas feature an omnidirectional radiation pattern in a band range of 410 MHz to 5.85 GHz, making them an ideal choice for IIoT applications such as machine-to-machine communications, smart lighting, and smart meters.

Paramount to any IIoT system design is the need for sensors. Amphenol i2s’ Climate Control Pressure Transmitter (CCT) sensors are specifically designed to measure the pressure of many fluids, including refrigerant, process fluid, and hydronic fluid systems.

To learn more about Amphenol, visit https://eu.mouser.com/ manufacturer/amphenol/. To read the new e-book, go to https://eu.mouser.com/news/Amphenol-iiot-revolution/ amphenol-Industrial-Iot-ebook.html. ►Mouser Electronics | https://www.mouser.com 50

Mouser Debuts New Automotive Content Stream from the YAGEO Group Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, and the YAGEO Group of companies, leaders in technological innovation and advanced automotive solutions, have partnered to create a new content stream devoted to new products and trends in the automotive industry. Designers and engineers can access the platform by visiting https://manufacturers.mouser.com/yageoadvanced-automotive-solutions.

The YAGEO Group includes KEMET, Pulse Electronics, and YAGEO, innovative electronic component companies with extensive experience and expertise in materials science. As automotive design evolves to include complex electronics, connectivity, performance, and automation, high-quality components are needed to meet design requirements and deliver a safe, reliable driving experience. The new resource site from Mouser and the YAGEO Group provides a comprehensive collection of products, design strategies, and technical details needed to create the next generation of automotive solutions.

Electronica Azi International | 3/2021

Mouser Electronics Stocks Wide Selection from Vishay Intertechnology Mouser Electronics, Inc. is a global authorized distributor of products from Vishay Intertechnology, Inc., one of the world’s most trusted manufacturers of electronic components. With almost 55,000 Vishay products in stock, Mouser offers an ever-widening selection of the manufacturer’s newest products, from discrete semiconductors — including diodes, MOSFETs and infrared optoelectronics — to passive electronic components such as resistors, inductors and capacitors.

The new online content platform features 30 technical articles, videos, webinars, and white papers, each providing valuable insights into the latest automotive applications and their specific design requirements. Each content piece includes product information for relevant solutions from the YAGEO Group companies, connecting engineers to the technical knowledge and products required to address each application.

Mouser offers a comprehensive selection of YAGEO Group products, including a broad range of application-specific products for the automotive industry. The KEMET R71H high-temperature, AEC-Q200-qualified film capacitors support power factor corrections and pulse applications, with an extended operating temperature range of -55°C to +125°C, enabling the capacitors’ use in demanding automotive applications. The YAGEO automotive TVS diodes offer high reliability and fast response speeds, protecting sensitive electronic equipment from transient voltage events, including lightning strikes. The Pulse Electronics PM21x transformers are high-isolation devices ideal for a range of low-power automotive applications. The IATF- and AECQ200-qualified transformers provide application and safety isolation between high voltage sources.

To learn more about YAGEO Group, visit https://www.mouser.com/manufacturer/yageo/.

To explore the new automotive content platform, visit https://manufacturers.mouser.com/yageo-advanced-automotive-solutions. ►Mouser Electronics | https://www.mouser.com https://international.electronica-azi.ro

The following are just a few of the popular Vishay solutions available from Mouser: • SMDY1 devices are the industry’s first surface mount ceramic safety capacitors with Y1 rating of 500 VAC and 1500 VDC. The devices offer capacitances up to 4700 pF, with Class IIB humidity robustness (85°C and 85% RH for 500 hours) to meet the IEC 60384-14.4 Annex I standard.

• Vishay 600 V FRED Pt® Gen 5 hyperfast and ultrafast rectifiers feature low conduction and switching losses and are ideal for high-frequency converters. The rectifiers are specifically designed to improve the efficiency of power factor correction (PFC) and output rectification stages of electric vehicle/hybrid electric vehicle (EV/HEV) battery charging stations as well as the booster stage of solar inverters and uninterruptable power supply (UPS) applications. The devices are perfectly matched to operate with MOSFETs or high-speed IGBTs. • T54 vPolyTan™ polymer surface-mount chip capacitors are available with voltage ranges from 16 VDC to 75 VDC and capacitance ratings up to 2800 μF (stacked capacitors). The capacitors offer high-reliability processing, including accelerated voltage conditioning, thermal shock, and statistical DC leakage screening at elevated temperature and voltage.

• IHLP-2020CZ-8A automotive-grade fixed inductors are designed to operate in high temperatures up to 180°C. The inductors offer excellent DC/DC energy storage up to 2 MHz, making them suitable for a variety of automotive applications, including under the hood.

As a testament to the strong relationship with Vishay, Mouser received the Americas Passives High Service Distributor of the Year award in 2020 for the second consecutive year.

To learn more about Vishay products available from Mouser Electronics, visit https://www.mouser.com/manufacturer/vishay ►Mouser Electronics | https://www.mouser.com 51

Mouser Electronics Offers Customers Latest in Innovative Sensor Technologies and Resources Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is helping to empower today’s design engineers with insightful content around exciting new sensor technologies enabling the latest design solutions. The global authorized distributor offers a comprehensive sensor technology content stream on its industry-leading website that spotlights technical trends, articles, blogs, diagrams and featured products from the world’s top manufacturers.

“Today’s electronic design engineers face the challenge of keeping up with fast-moving technology,” shares Kevin Hess, Mouser Electronics’ Senior Vice President of Marketing. “Mouser’s strives to offer design engineers a full spectrum of products, resources, services and tools to assist them throughout the design process.”

With the rapid development of the Internet of Things (IoT) and smart connected devices, manufacturers have 52

made significant advances in sensor technology and capabilities, resulting in even smaller, less expensive and betterperforming products. To help design engineers make sense of these quickly evolving technologies, Mouser provides a wealth of resources, including videos, blog posts, and product information on the latest advanced sensors. The sensor technology content stream also offers a large collection of technical articles that cover a range of tips and best practices, such as using sensor fusion in defect detection systems.

Additionally, Mouser’s award-winning Empowering Innovation Together™ program offers a series of blogs, articles, videos, and infographics on the latest trends in technology. The latest installment includes a new sensor-focused episode of The Tech Between Us podcast, plus industry insights into the future of sensors and the crucial role they play within the Industrial and IoT sectors.

Mouser stocks the industry’s widest selection of sensor technologies, including the following new products:

Analog Devices ADIS16446 is a sixdegrees-of-freedom (DoF) inertial sensor that incorporates a triaxial gyroscope, a triaxial accelerometer, and a temperature sensor.

Amphenol Advanced Sensors T9501 is an IP67-rated humidity and temperature sensing solution with a digital RS485 Modbus interface, ideal for virtually any type of harsh-environment application.

The Bosch BMP384 is a robust barometric pressure sensor that offers high performance and low power consumption for use in wearables, home appliances and industrial applications in harsh environments.

To access Mouser’s sensor technology content stream, go to: https://resources.mouser.com/sensor For the latest sensor products available from Mouser, visit: https://www.mouser.com/new/sensors/n -5gej.

Mouser Electronics https://www.mouser.com Electronica Azi International | 3/2021

Renesas and eProsima simplify development of professional robotics applications on RA MCUs with micro-ROS development framework

PRODUCT NEWS

Agreement Facilitates Adoption of Robotics in Industrial and IoT Sectors; EK-RA6M5 Evaluation Kit Now Official Supported micro-ROS Development Board Renesas Electronics Corporation and eProsima, an SME company specialized in middleware solutions, announced that the Renesas EK-RA6M5 Evaluation Kit for RA MCUs is the official supported hardware platform of the micro-ROS development framework. micro-ROS is the industry’s robotics operating system for MCUs. Renesas teamed with eProsima, the main developer of the micro-ROS framework, to port micro-ROS into the RA MCUs, easing development of professional robotics applications for IoT and industrial systems.

The micro-ROS framework allows a standardized integration of MCUs into the Robot Operating System (ROS) 2 data space. It provides an established application development framework based on standard communication middleware to the embedded world. Porting micro-ROS into the Renesas RA MCUs facilitates the adoption of this robotic framework in Industry 4.0 and Industrial IoT applications. The Renesas e2 studio integrated development environment, which will run on Windows, as well as Linux-based computers, will support the micro-ROS implementation, simplifying the process of using the micro-ROS client library.

The Renesas Advanced (RA) Family of 32bit Arm® Cortex®-M MCUs deliver optihttps://international.electronica-azi.ro

mized performance, security, connectivity and peripheral IP to address the next generation of embedded solutions.

Renesas has built a comprehensive partner ecosystem to deliver an array of software and hardware building blocks that work out of the box with RA MCUs, including both Microsoft Azure RTOS and FreeRTOS. This combination makes the RA Family the ideal reference platform for micro-ROS implementations.

“Robotics is becoming increasingly important as Industry 4.0 and Industrial IoT gain steam,” said Roger Wendelken, Senior Vice President in the IoT and Infrastructure Business Unit at Renesas. “The performance and feature set of the RA Family make it the best choice for robotic applications, and we’re pleased to work with eProsima to deliver solutions to our diverse customer base.”

“Achieving cost-effective development depends on a common platform around which hardware and software providers emerge,” said Jaime Martin Losa, eProsima CEO. “micro-ROS represents the tool that bridges the gap between microcontrollers and ROS 2, expanding the scope of new robotic applications based on embedded devices.”

Renesas has developed a ROS-based Robot Body Controller Winning Combination that showcases the RA6M5’s implementation of micro-ROS, complemented by other Renesas components. Winning Combinations consist of complementary analog, power, timing devices and embedded processing, and provide an easy to use architecture, simplifying the design process and significantly reducing design risk for customers in a wide variety of applications. Renesas offers over 250 winning combinations with compatible devices that work together seamlessly, available at renesas.com/win.

Availability The micro-ROS hardware support is divided into officially supported boards and community supported boards.

Support for micro-ROS in the RA MCUs is available in Renesas’ EK-RA6M5 evaluation kit, now the officially supported micro-ROS hardware platform. For more information, customers can visit the Renesas Robot Operating System (ROS) page and the micro-ROS landing page.

Renesas Electronics Corporation https://www.renesas.com 53

New generation of IO-Link-enabled smart sensors IO-Link inductive sensors with Smart Sensor Profile are easier to integrate into existing systems and can enhance maintenance strategies.

Contrinex announces a new generation of cloud-ready sensors that takes standardization to the next level. Thanks to their Smart Sensor Profile (SSP), data from these new inductive IO-Link sensors has a highly uniform structure for greater ease of integration into existing systems. In addition, they provide a range of pre-defined functions to enhance customers’ preventive or predictive maintenance strategies.

Designed according to IO-Link Smart Sensor Profile (SSP) 3.3, Contrinex’s new inductive sensors meet the industry standard for uniformity of data. As digital measuring sensors with a disable function, their performance is equivalent to a conventional analog output sensor, but with a digital data output. Devices have a standard 24-bit process data input (PDI) and 8-bit output (PDO). For example, distance, switching counter and temperature measurements can be assigned 16-bit values while the output switching signal, switching signal and configurable alarms can have 8-bit values.

Users can define many aspects of the sensor’s IO-Link configuration for themselves, including distance, counter and temperature. They can also select from a range of switchpoint modes (Deactivated, Single Point, Windows Mode, Two-Point Mode) and pre-defined preventive maintenance functions (operating hours over sensor lifetime/since last power-up, switching counter over sensor lifetime/since last power-up, sensor autodiagnostic alarm).

The new generation will roll out first across standard inductive types in both cylindrical (M8 to M30) and cubic housings (C8 and C44). https://www.oboyle.ro

Full Inox Chip-Immune inductive sensors: Immune to fragments of iron, aluminum, stainless steel, brass, copper or titanium IO-Link inductive sensors with Smart Sensor Profile are easier to integrate into existing systems and can enhance maintenance strategies.

Machines for turning, milling, drilling or grinding metal will inevitably generate abrasion debris. For inductive sensors, which by their nature detect metal objects, this debris presents a difficult challenge. When sensors are covered with lubricant containing metal chips, there is a risk that they will supply incorrect signals to the control system. For these applications, sensor specialist Contrinex now offers its ChipImmune series of inductive sensors in M12, M18 or M30 housings for non-embeddable mounting. Even when covered with chips of iron, aluminum, stainless steel, brass, copper or titanium, they will reliably detect targets made of these metals. The sensor achieves this with a slightly modified form of the Condet® method, which operates on the basis of pulsed currents in the coil and uses returned inductive voltage as the useful signal. These sensors have a one-piece stainless steel housing with IP68 and IP69K protection rating and a wide operating temperature range from -25 to +85°C (-13 to +185°F). This makes them particularly suitable for use in the harsh environments of the machining industry. Depending on sensor diameter, operating distances of 3, 5 or 12 mm are available while repeatability ranges from 0.2 to 0.8 mm.

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The sensors operate at frequencies of 90, 200 or 400 Hz. In the PNP version, sensors also include an I/O-Link interface for communication with the rest of the system.

In practice, the use of these new inductive sensors can save time, money and even help protect the environment. In metal-cutting operations with conventional inductive sensors, reliability is ensured by regularly spraying chips away with water. This is no longer necessary with the chip-immune range of inductive sensors.

Chip-Immune sensor overview: ■ Housing M12, M18 or M30 ■ Detection not influenced by chips of iron, aluminum, stainless steel, brass, copper or titanium ■ Detects targets made of the above metals ■ Robust: one-piece stainless-steel housing, protection rating IP68 and IP69K ■ Temperature range -25 to +85°C (-13 to +185°F) ■ Operating distance 3, 5 or 12 mm ■ IO-Link https://www.oboyle.ro Electronica Azi International | 3/2021

DRT 25C: The one for everything.

Reliable detection of confectionery and baked goods without readjustment when changing objects.

The DRT 25C dynamic reference diffuse sensor – an innovative new product from Leuze – is specially designed for the detection of confectionery and baked goods. Thanks to intelligent CAT technology it reliably recognizes flat and spherical products, transparent to high-gloss foils as well as irregular shapes and contours.

Advantages for you ■ The reliable detection of objects even with difficult shapes and surfaces ensures continuous machine output and prevents downtime ■ No adjustment of the sensor is needed when products or packaging materials are changed, shorter setup times enable higher production quantities ■ Fast and easy setup of the sensor through automatic teaching of the belt surface using the teach button; just one universal mounting position for all objects ■ Reliable operation even if the conveyor belt is dirty or vibrating ■ IO-Link for easy integration of additional functions in the machine control, such as warning message in case of excessive contamination, use of the counter built into the sensor, or locking of the teach button

Sensors must safely detect a wide variety of products and films on the conveyor belts of packaging machines (HFFS, FS, Thermoform, and VFFS) for confectionery and baked goods. In addition, they must work continuously after a product changeover, without requiring further setup.

Optical sensors that perform these tasks are typically retroreflective sensors that operate with foreground suppression. This technology has its weaknesses, however, especially when detecting flat, glossy or transparent objects.

The innovative detection method of the DRT 25C, on the other hand, works with Contrast Adaptive Teach technology, CAT for short, whereby the conveyor belt is used as a reference instead of the product. This is how the reference 56

diffuse sensor detects any type of object as a 'deviation' to the conveyor belt surface. The detection is independent of the surface characteristics of the products, such as the color, gloss, and transparency.

Applications Detection of products on conveyor belts of primary packaging machines

Requirement: To control the buffer section and the weld bar, the front edges of the products on the conveyor belt must be reliably detected. The sensor must also reliably detect products with challenging dimensions from very flat to very tall, in order to prevent machine stoppages due to incorrect detection. The sensor must be easy to set up for all products.

Solution: The DRT 25C reliably detects anything, from small and flat to tall and spherical products, even if the shapes and contours are irregular. This means that machines can be fitted with a single sensor regardless of the application.

The single button teach function also makes the DRT 25C easy to set up.

Electronica Azi International | 3/2021

Detection of products on conveyor belts of secondary packaging machines

Requirement: For trouble-free control of the buffer section, packaging made of various materials and with a wide variety of surfaces must be reliably detected from the front edge. Changing products or packaging films should not require any additional setup and adjustment work on the sensor.

Solution: The unique technology of the DRT 25C uses the conveyor belt surface as the point of reference. The detection is independent of the surface characteristics of the materials used, such as the color, gloss, and transparency. This means no setup work on the sensor is required when changing products.

widest variety of objects. This means that no setup effort is required for the sensor when changing products.

One-of-a-kind CAT technology The DRT 25C works with the conveyor belt surface as a dynamic reference for the detection of objects. With this method, the surface characteristics of the conveyor belt are taught in via the teach button. The sensor will then detect all objects that do not correspond to the conveyor belt surface. Even contamination on the conveyor belt can be compensated with the Contrast Adaptive Teach technology.

Highlights in detail Three light beams for maximum reliability No matter what shape the confectionery and baked goods and their packaging have: With its three light beams, the DRT 25C reliably detects the front edges of the objects and ensures that the process goes smoothly without any machine downtime. Thanks to the wide scan, even products with holes, such as cookie curls, are safely detected as a continuous object. For this, not all three light spots need to be on the object.

From transparent to high-gloss Packaging with different colors and transparency are safely detected as a deviation from the conveyor belt surface due to the reference technology. This means that even machines that process a wide range of films can be equipped with a single sensor type.

No setup time when changing products When performing the initial setup, the conveyor belt surface is taught in as a point of reference with the teach button. After a product changeover, it is not necessary to adjust this setting, as the point of reference remains the same. In addition, the mounting position and the alignment of the sensor itself can be continuously used for the https://international.electronica-azi.ro

Technical properties ■ Reference technology and three LED light spots for reliable object detection with the widest variety of shapes and surfaces ■ Large working range for conveyor belt spacings of 50-200 mm ■ High switching frequency of 750 Hz for belt speeds up to 2 m/s ■ Easy configuration via an operating button (teach button) ■ IO-Link interface for standardized communication with the machine control in the dual channel principle or in SIO mode ■ Compact housing: only 15 mm × 42.7 mm × 30 mm for universal use ■ Protection classes IP 67 and IP 69K and ECOLAB certification https://www.oboyle.ro 57

Precise measurement, positioning, quality assurance of objects In highly automated systems in intralogistics and production, precise monitoring and measurement of distances is essential for smooth running in daily operation.

Distance sensors are used for this purpose in, for example, stack height measurements, quality assurance in assembly lines or for positioning of vehicles. We offer a comprehensive product range of optical distance sensors that enables pinpoint measurement, positioning and quality assurance of any objects over long and short distances.

Our sensors are based on various measurement operating principles (triangulation measurement, propagation time measurement, phase measurement). These enable both the reproducible measurement of distances in the range of tenths of a millimeter as well as over larger distances in excess of 60 meters. The measurement data can be transferred with IO-Link and evaluated with software in the machine. Based on the current values, production processes can be constantly adapted and optimized.

Quality assurance

Stack height measurement

Positioning

Requirement: During assembly processes, the completeness or alignment of individual components must be ensured. To do this, the reference points must be defined and checked.

Solution: Due to their high resolution at close range, the ODSL 8 and ODS 9 sensors are suitable for checking reference points. Robust plastic and metal housings are available.

Requirement: With machining processes, the raw material must be fed into the machine without interruption. To ensure this, the stack height on the load carrier must be constantly detected.

Solution: The ODS 9 sensors with ODSL 96 with different resolutions and ranges make it possible to measure the height of differently stacked objects.

Requirement: For the positioning of vehicles and side-tracking skates, their distance to a specified reference point must be measured.

Solution: Thanks to their large operating ranges of up to 65 meters and a focused laser, the ODSL 30 and ODS 10 sensors are suitable for positioning. Models with and without reflector are available. https://www.oboyle.ro

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Electronica Azi International | 3/2021

Posital TILTIX Acceleration-Compensated Inclinometer with Modbus RTU Interface

Robust and Cost Efficient Tilt Monitoring POSITAL TILTIX inclinometers are now available with a new communication interface, Modbus RTU. Modbus RTU protocols, which are openly published and royalty-free, have emerged as a de-facto standard for simple, robust and costefficient data acquisition and control systems built around standard PLCs. Modbus RTU nodes can be connected together through RS-485 serial connections with up to 32 devices connected to the bus.

■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■

Full 360° Single Axis or Dual Axis ±80° Compensation of External Accelerations Now Available with CANopen or SAE J1939 Clean Measurement During Dynamic Movements Optional Output of Acceleration and Rate of Rotation Well Protected up to IP69K Compact and Robust Die-cast Housing with Integrated T-Coupler Wide Temperature Range from -40 to +85°C Shock Immunity up to 100 g Tough Fiber-reinforced PBT and Heavy Duty Die-cast Aluminum Housings Available.

Programmable Measurement Resolution, Zero Setting and Direction via API

Industries TILTIX inclinometers with Modbus RTU interface are ideal for solar energy systems where it is necessary to monitor the spatial orientation of multiple collectors or reflectors. They can also be used in production machineries like textile manufacturing, paper manufacturing or for material handling equipment and in many other applications where a practical, low-cost position control solution is required. https://www.oboyle.ro https://international.electronica-azi.ro

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Perfect Light for the Car Interior Light Guide Rods More and more cars today are equipped with light guide rods in their interior, the socalled ambiance area, for example in door panels, dashboard, center console, and roof lining. Through semi-transparent flat strips these light guide rods guide the light into the interior of the car.

Any inhomogeneity in the light guide rod would influence the scattering behaviour of the output light. When driving in the dark, a passenger in the car interior would notice this as a bright or dark position along the light strip and would be disturbed by it. ►

The color sensor determines the local intensity and color of the light guide rod.

All averaged RGB signals are in the dynamic range (displayed by SAT black), because all non-averaged RGB signals are within the dynamic range.

Blue - Line is in stauration

The averaged RGB signals seem to lie in the dynamic range, whereas at least one non-averaged RGB signal already is in saturation (indicated by SAT red).

With INT2 the averaged signal can now be amplified.

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Electronica Azi International | 3/2021

Inhomogeneities in the radiation behaviour are caused by so-called hotspots, i.e. refraction index discontinuities in the transparent plastic of the light guide rod.

Both the local intensity and the color of the light guide rod can be determined with the color sensor SPECTRO-3-FIOANA-LEDCON-HA. The fibre-optics frontend is moved along the light guide rod for example by means of a robot. Flaws or hotspots are picked up by the sensor as a weak or intensive signal because they have too little or too much light.

Due to the so-called pulse width modulation of RGB LEDs, placed at one of the front sides of the light guide rod, there may be considerable intensity peaks of the light pulses. For example the blue LED only is in active mode for approx.

10% of the cycle time. Since the color sensor usually (with corresponding parameterisation) provides the average intensity value (with correspondingly long averaging, in a way as seen with the human eye), it must be checked during averaging whether the respective signal (R, G, B signal) still lies within the permitted dynamic range.

If the signal leaves the operating range, a corresponding information is sent through the digital-serial interface of the color sensor. With INT1 and INT2 (software amplification before and after averaging) the received, averaged, and evaluated signal level can be optimally adjusted. In parallel to this it also is ensured that the non-averaged signal still remains in the specified dynamic range. https://www.oboyle.ro

C23 with UV LED Transparent-object sensors with patented UV technology ensure reliable detection and accurate counting of clear plastic trays During automated packaging of fast-moving products in controlled conditions, thermoforming lines produce transparent plastic tray bases from continuous reel-stock material. A small transparent-object sensor with patented UV technology detects the presence of each set of transparent trays after it is formed, initiating a subsequent operation and, optionally, triggering a counting circuit.

Manual intervention is avoided, ensuring contaminationfree, reliable operation with little or no downtime.

Customer value ■ UV sensors ensure reliable detection of transparent plastic targets ■ Safe detection of the thinnest transparent materials https://international.electronica-azi.ro

■ Maximum operating reserve owing to high absorption factor of UV light by transparent plastics ■ Elimination of multiple switching on a single target ■ Reliable operation without the need for manual intervention ■ Very low sensitivity to dust, liquid droplets and splashes ■ Wide operating range accommodates full range of machine geometries ■ Simple one- or two-step teach procedure optimizes initial sensor set-up ■ Sensitivity parameters are retrieved or updated remotely via IO-Link ■ Stability alarm highlights reduced sensitivity, avoiding unplanned stoppages Specific product advantages ■ Ultraviolet reflex photoelectric sensors for transparent object detection ■ Very low sensitivity to target shape ■ IO-Link serial-connection protocol enabled on PNP versions at no additional cost ■ Pre-taught sensitivity parameters stored on inbuilt sensor memory ■ Remote sensitivity retrieval or update via IO-Link ■ Highly tolerant of contamination by dust, liquid droplets or splashes ■ Robust, Ecolab approved sensors with IP67-rated miniature plastic housings https://www.oboyle.ro 61

Problems with Folds?

In the production of oil and air filters for the automobile industry these filters must reach the required throughput rate, which is achieved by folding the filter material so that it provides a large filter surface on a minimum of space.

Depending on the filter type there are differences in the fold depth and in the numbers of folds. Before the filter mats are formed into a cylinder they are transported on a linear table as endless material. When the required number of folds is reached, the filter mat is cut off from the endless material.

During feeding the individual folds are alternately contracted and extended, and the folds are counted by means of a non-contacting method. The differing fold height, detection in contracted condition, and the filter material itself due to its semi-transparent properties, are challenging factors for the sensor system.

Accurate edge counting under these conditions can be performed with the edge detectors of the RED series. The focused laser line that is projected onto the folds is picked up by means of two photodetectors under two different angles. While one detector is arranged near the laser transmitter, the second receiver is placed on the sensor side that faces away from the transmitter. When there is a fold, the laser spot is blocked for the detector facing away from the transmitter, whereas the signal of the receiver that is near the transmitter rather is amplified. The relationship of the two received signals provides reliable information about the existence of a fold. Additional software algorithms such as for example the activation of a dynamic dead time after fold detection and a switching hysteresis further increase the counting accuracy. With the RED-110-L there now is a sensor that reliably detects folds within a distance of 90mm to 130mm from the object. It does not matter whether the folds are in contracted or extended form. The maximum scan frequency of the laser sensor typically is 100 kHz and should thus be more than sufficient for this application. https://www.oboyle.ro

Pressure transmitter Prignitz SPT-Ti with Titanium measuring cell The piezoresistive semiconductor measuring cell of the industrial pressure transmitter SPT-Ti is made of titanium and based on a silicon on sapphire technology making it absolutely vaccum tight. Leakage of internal sealings due to material fatigue is ruled out right from the start. It does not contain any disturbing pressure transfer fluids and no large pressurized surfaces.

Connection to the connecting pins is made by gold bonding making it absolutely sturdy even in case of low temperatures, shocks or vibrations. Signal processing of the measurement bridge is effected by a mixed-signal ASIC. Titanium offers a whole range of benefits. The sturdy oxide layer provides high corrosion resistance. Moreover, titanium has got an enormous strength at a relatively low density and can be used for pressure ranges up to 5,000 bar in the long term.

Thanks to the oustanding thermal characteristics and resistance of titanium the SPT-Ti can be ■ used in high-temperature applications with medium temperatures up to 200°C. ■ ■ • medium-contacted parts made of titanium • 2.5 bar up to 5000 bar ■ • Relative pressure, absolute pressure, sealed • Precision < 0.5 % FS (setting of limit value) • Response time < 1 ms reference ■ • (0) 4 ... 20 mA, 0 ... (5)10 V, radiometric and more • Medium temperature up to 200°C https://www.oboyle.ro • ISO 4400, M12x1, cable and a lot more 62

no seal required extremely robust long-term stability high chemical resistance insensitive to overload conditions

Electronica Azi International | 3/2021