4/2020
I N T E R N A T I O N A L A PAN EUROPEAN MAGAZINE
https://international.electronica-azi.ro
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EVENTS
electronica 2020 to be held digitally • Virtual concept for electronica virtual will replace the in-person trade fair in Munich • Expansion of digital offering • Online conference program planned Messe München will organize the world’s leading trade fair and conference for electronics as a virtual event this year. The current travel restrictions in Europe, which are becoming more stringent, have required a re-thinking of planning. The digital format for electronica in November will give exhibitors the opportunity to book digital trade fair booths. electronica virtual will also provide all customers additional ways to interact and network. A large portion of the conference and supporting program will also be available digitally. New developments related to the coronavirus pandemic prompted Messe München to decide to hold electronica as a virtual event this year. In light of travel restrictions that have been imposed by a large number of visitor and exhibitor countries, electronica would have lost its character as a world-leading trade fair if it had been held as an in-person event in November. Falk Senger, Managing Director of Messe München, said: “Even though an in-person trade fair could have been conducted with the help of our safety and hygiene concept, the latest developments related to travel restrictions in many countries forced us to rethink our plans. We are adapting these plans to this dynamic situation and are now focusing solely on our virtual format. International exhibitors and visitors are the heart of electronica. In light of current Covid-19 conditions, we would not have been able to meet the expectations with an in-person trade fair.” Kurt Sievers, the CEO of NXP Semiconductors and the Chairman of the electronica Advisory Board, added: “After reevaluating the situation, I consider the decision of Messe München to be very appropriate and responsible. We are https://international.electronica-azi.ro
pleased that, with electronica virtual, a concept is now offered for 2020 that allows exhibitors to reach their international customers, even in the continuing difficult pandemic period. Via this digital platform, exhibitors can present their innovations, learn about industry trends and efficiently network with customers and suppliers.”
for global industry discussions this November. Its opportunities will include virtual trade fair booths, which will enable exhibitors to continue to communicate with their international customers and sell them on their products and solutions. The virtual event will be complemented by a digital conference and
Christoph Stoppok, the Head of Components, Mobility & Systems at the German Electrical and Electronic Manufacturers’ Association, said: “The electronics industry and the solutions it provides are one of the major driving forces behind digitalization. Let’s put the industry’s ingenuity to use and get together this year at a virtual fair. This is exactly the right time to foster a dialogue in the industry and generate economic momentum once again.”
supporting program. Individual talks and panel discussions on trend topics like the automotive industry, embedded systems, IIoT, 5G, medical electronics and smart energy will be available online.
Online trade fair with virtual product presentations and supporting program The virtual format of electronica will provide the electronics industry with a platform
You will soon find more information and offers on the trade fair’s website at: www.electronica.de Melanie Daller - PR Manager Messe München https://messe-muenchen.de/en/
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Electronica Azi International » TABLE OF CONTENTS 3 | electronica 2020 to be held digitally
27 | How to Select the Right Board
6 | First COM-HPC and next-gen COM Express
28 | Silicon Labs Simplifies IoT Development with
8 | The Industry’s Only Low-Inductance Silicon Carbide (SiC) Power Module and Programmable Gate Driver
Simplicity Studio 5 30 | Analog Devices Announces Complete Audio
Kit is Now Available for Inverter Designers
System Leveraging A2B® Audio Bus Technology 8
33 | CUI Devices adds IP67 rated models to enclosed speaker line 34 | Mouser Offers Latest Products and Resources for Home and Building Automation
10 | Maxim Integrated’s Essential Analog Temperature Sensor ICs Deliver Precision Measurement to Enable Robust Protection for Goods and Equipment 12 | How to Accurately Control a BLDC Motor’s Torque
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35 | Digi-Key Electronics Announces Global Distribution
and Speed in Industrial Applications 20 | Design separately, integrate seamlessly:
Partnership with Septentrio 36 | Renesas Rolls Out 48V Mobility Winning
Dual-core Digital Signal Controllers speed development for design engineering teams
Combination Solution Featuring New 16-Cell Battery Front End and 32-bit MCU with Built-in FPU for Complex Inverter Control Algorithms 36
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22 | Rutronik develops first development kit for AI based applications to implement EDGE intelligence 23 | Better streaming and connection quality: Rutronik expands portfolio with Intel® WiFi 6 modules 24 | Bluetooth 5.1 - With New Direction Finding Function Aimed at Industrial
42 | Digi International Transforms Digi Remote Manager to Empower IoT Network Success 45 | Martin offers an innovative solution to gently extract residual solder
® Management Managing Director - Ionela Ganea Editorial Director - Gabriel Neagu Accounting - Ioana Paraschiv Advertisement - Irina Ganea Web design - Eugen Vărzaru
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Contributing editors Cornel Pazara PhD. Paul Svasta PhD. Norocel Codreanu PhD. Marian Blejan PhD. Bogdan Grămescu
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Electronica Azi International is published 6 times per year in 2020 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Copyright 2020 by Euro Standard Press 2000 s.r.l. All rights reserved.
Electronica Azi International | 4/2020
PRODUCT NEWS
First COM-HPC and next-gen COM Express congatec fuels launch of 11th Gen Intel Core processors with two great new design options In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec – a leading vendor of embedded computing technology – announces the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact
“congatec’s modules based on the 11th Gen Intel Core processors feature high-performance CPU/GPU compute with integrated AI acceleration for critical applications that demand high-speed processing, and computer vision,” explains Gerhard Edi, CTO at congatec.
The benefits of choice “For the first time, design engineers now have the choice to go either with COM Express or COM-HPC. Each provide unique benefits for example, we have an improved next-gen connector for COM Express that is expected to offer better bandwidth capaci-
Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s broader array of interfaces. OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel Core processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.
The highlights of the 11th Gen Intel Core processors provide a massive CPU performance boost, fast DDR4 memory, expansive PCIe Gen4 and USB 4.0 bandwidth. These performance enhancements are complemented by features that are critical for communication connected edge computers such as congatec’s support for hypervisor technologies e.g. from Real-Time Systems.
ties compared to what was available in the past. This is essential information for engineers thinking about utilizing the high bandwidth interfaces such as PCIe Gen 4. Engineers choosing COM-HPC will benefit from by far more high-speed interfaces delivered over 800 signal pins in total. This is almost twice as many pins as COM Express Type 6 modules deliver with 440 pins,” explains Andreas Bergbauer, Product Line Manager at congatec. To help engineers make the best choice, congatec provides engineering support and is creating a COM Express and COM-HPC design decision guide and a whitepaper, which will be available on congatec’s 11th Gen Intel Core processors page.
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All this comes in a powerful and energyefficient package leveraging Intel’s SuperFin technology delivering increased power savings, physical density and providing even more compute power for given thermal envelopes.
Electronica Azi International | 4/2020
PRODUCT NEWS Even more innovations and benefits It is important to mention that besides PCIe Gen 4, the new congatec Computeron-Modules with low-power 11th Gen Intel Core processors also offer USB 4.0, which is fundamentally based on Intel’s Thunderbolt technology. USB 4.0 supports amazing data transfer rates of up to 40 Gbit/s and tunneling of PCIe 4.0 as well as DP-Alt mode supporting video signals of up to 8k resolution with 10-bit HDR at 60 Hz. The feature set in detail The COM-HPC Client size A module conga-HPC/cTLU as well as the COM Express Compact conga-TC570 will become available with the 11th Gen Intel Core processors. Both modules are the first to support PCIe x4 in Gen 4 quality to connect external peripherals with massive bandwidth. In addition, designers can leverage 8x PCIe Gen 3.0 x1 lanes. Where the COM-HPC module offers latest 2x USB 4.0 and 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules. Comprehensive board support packages are provided for all leading OS’s like Linux, Windows and Chrome, as well as hypervisor support from Real Time Systems.
Further information about congatec’s new modules based on 11th Gen Intel Core processors can be found on the main landing page: https://congatec.com/ 11th-gen-intel-core
products/com-hpc/conga-hpcctlu/ The conga-TC570 COM Express Compact module has its landing page here: www.congatec.com/en/products/comexpress-type-6/conga-tc570/
Further information on the new congaHPC/cTLU COM-HPC Client module can be found at: www.congatec.com/en/
congatec https://www.congatec.com
congatec and SE Spezial-Electronic sign distribution agreement congatec – a leading vendor of embedded computing technology – and international electronic component distributor SE Spezial -Electronic are pleased to announce that they have signed a distribution agreement. SE Spezial-Electronic will now distribute the entire congatec product portfolio. The non-exclusive distribution agreement covers the entire DACH region as well as Poland and Great Britain. “Computer-on-Modules and industrial single board computers from congatec are an attractive addition to SE Spezial-Electronic‘s memory and display offerings. The created synergies are excellent and have great potential to benefit customers. SE Spezial-Electronic is therefore predestined to become a strong sales channel partner,” says Diethard Fent, Sales Partner Manager EMEA at congatec. “We are very pleased that our sales partnerhttps://international.electronica-azi.ro
ship with congatec will allow us greater access into the core of embedded applications,” comments Christopher Wuttke, CEO of SE Spezial-Electronic. “It marks a highlight in this special year – in which SE celebrates its 50th anniversary – to be able to add another really attractive product area and partner to our portfolio.”
The line managers of the new Embedded Group at SE Spezial-Electronic, Johannes Lange, Benjamin Bräuer and Jean-Paul Thom,
also see significant synergies between their current product areas and the congatec solutions. “With congatec, we now have a five-star partner from Germany at our side who is the market leader in the field of Computer-on-Modules, provides innovative products and shares our philosophy of full development support. This enables us to provide our customers with an even more extensive choice of products,” adds Marius Wüstefeld, head of Inside Sales at SE Spezial-Electronic. In addition to Computer-onModules and single board computers from congatec, SE SpezialElectronic’s embedded offering includes sensor technology, storage solutions, displays, GNSS solutions and products for wireless communication (Bluetooth & WiFi). congatec https://www.congatec.com 7
PRODUCT NEWS
The Industry’s Only Low-Inductance Silicon Carbide (SiC) Power Module and Programmable Gate Driver Kit is Now Available for Inverter Designers
Microchip’s AgileSwitch® digital programmable gate driver and SP6LI SiC power module kit solution enables developers to proceed quickly from benchtop to production The transformation to electrify transportation – from trains, trams, and trolleys to buses, automobiles and EV chargers – continues at a rapid pace, as countries shift toward improved modes of transit with greater efficiency and innovative technology. Microchip Technology Inc. announced its AgileSwitch digital programmable gate driver and SP6LI SiC power module kit, a unified system solution to help designers quickly and effectively adopt disruptive Silicon Carbide (SiC) power devices – reducing time to market and ensuring confidence in field deployment. 8
Microchip’s AgileSwitch digital programmable gate driver and SP6LI SiC power module kit speeds development from evaluation through production, eliminating the need to procure power modules and gate drivers separately – including gate drivers that are qualified for endproduct production. With Microchip’s AgileSwitch gate drivers and proven, high-performance SiC power modules, developers can avoid qualifying power modules and spending time to develop their own gate drivers, which can save months in development schedules.
“We listened to developers in providing total system solutions for our microcontrollers and analog products,” said Leon Gross, vice president of Microchip’s Discrete Product Group business unit. “Now as SiC power modules increasingly enable the technologies transforming transportation and other industries, this complete product kit allows developers to focus on innovation and significantly reduce time to market.” Microchip’s flexible portfolio of 700, 1200 and 1700V SiC Schottky Barrier Diode (SBD)-based power modules utilizes its Electronica Azi International | 4/2020
PRODUCT NEWS
newest generation of SiC die. In addition, its dsPIC® Digital Signal Controllers deliver performance, low power consumption and flexible peripherals. Microchip’s AgileSwitch family of digital programmable gate drivers further accelerates the process of moving from the design stage to production. Microchip’s combination of SiC power module and software-configurable gate driver features Augmented Switching™ technology that enables designers to influence dynamic issues including voltage overshoot, switching losses and electromagnetic interference. Using a Windows®-based computer interface, this “configure-at-a-click” method may be used throughout the design process,
from expediting early evaluation to simplifying final optimization using a computer mouse instead of a soldering iron. Microchip’s AgileSwitch digital programmable gate driver and SP6LI SiC power module kit provides design engineers with a central point of contact for support, and ensures that the die, power package and gate driver are designed specifically for each other – eliminating potential development delays.
Pricing and Availability Microchip’s AgileSwitch digital programmable gate driver and SP6LI SiC power module kit solution is available for volume production and limited sampling.
Development Tools The kit includes the AgileSwitch Intelligent Configuration Tool that optimizes gate turn-on and turn-off, short circuit response and module efficiency while reducing voltage overshoot, ringing and electromagnetic interference.
For additional information, contact a Microchip sales representative, authorized worldwide distributor, or visit Microchip’s website.
Family pricing on Microchip’s ASDAKMSCSM70AM025CT6LIAG-01 AgileSwitch digital programmable gate driver and 1200V, 495A, Single Phase Leg SP6LI SiC power module kits starts at $999.95.
Microchip Technology https://www.microchip.com
COSEL announces 3W high isolation DC/DC converters for medical and industrial applications COSEL Co, Ltd announced the addition of a new series of high isolation 3W DC/DC converters for medical and industrial applications. Packaged in a Single In Line (SIP) type 8, the COSEL MH3 series has a reinforce isolation of 3kVAC, 4.2KVDC, complies with medical isolation standard (2MOOP (250VAC)) and ruggedized for industrial applications that might implies differential In/OUT voltage. Three input voltages (4.5V-18V ; 9V – 36V and 18V 76V) and a large variety of single (MHFS3) and dual output (MHFW3) cover a large range of applications. Designed for performances, the MH3 has only 20pF max insulation capacitance reducing noise transfer. The COSEL MH3 is a unique design from COSEL, manufactured in
https://international.electronica-azi.ro
Japan and covers by a 5 years warranty. Designed with high reliability in mind, the COSEL MH3 series has a reinforced insulation, sustains 3kVAC and 4.2kVAC isolation test in accordance to safety standards and its transformer designed to sustain differential voltage that might happen in industrial applications. With long expertize in designing power supplies for equipment using IGBT drivers, COSEL designers applied high-power high-isolation best practice to the low power 3W MH3 series to reduce isolation fatigue resulting from differential high voltage happening in motor control or IGBT driver. COSEL conducted tests and verifications and provides, in the Application Manual, life expectancy curves helping system’s architects developing Gate Controllers for industrial equipment to apply proper design rules and cautions. For medical applications, the MH3 series complies with the 2xMOOP (250VAC) (Means Of Operator Protection) isolation requirement, as specified in the IEC60601-1 3rd edition standard. To reduce inventory but as well making their equipment easy to install and main-
tain, system’s designers require DC/DC converter able to accept a large range of input voltages. The COSEL MH3 series is available in three wide-input range voltage: 4.5V to 18V covering 12V battery applications, 9V to 36V combining 12V and 24V battery systems and 18V to 76V addressing 24V and 48V systems. The MH3 series is available in five single output 3.3V, 5V, 9V, 12V, 15V (MHFS3) and two dual outputs +/-12V and +/-15V (MHFW3). Output can be used in series, delivering 24V or 30V. Single output voltage MHFS3 can be adjusted by using the Vout Trim pin on the secondary side. The MH3 series has built-in overcurrent protection circuit, with automatic recovery. A remote control pin operating as negative logic (L:ON, H:OFF) is available on standard. The MH3 series can be operated within a temperature range of -40 to +85C ambient, 20 - 95%RH (Non condensing). Depending on cooling, a power derating may apply to not exceed +105C at specified measuring point. To reduce transfer noise, COSEL designers reduced the isolation capacity to lowest possible level, reaching a maximum of 20 pF, which is a great benefit when powering motor control systems. COSEL https://www.coseleurope.eu 9
PRODUCT NEWS
Maxim Integrated’s Essential Analog Temperature Sensor ICs Deliver Precision Measurement to Enable Robust Protection for Goods and Equipment
MAX31889 delivers the highest accuracy temperature monitoring of cold-chain assets; MAX31825 reduces complexity of using multiple temperature sensors for consumer and factory automation Designers of highly reliable cold-chain pharma and other temperature-sensing applications can achieve high accuracy and robust system operation with two new industry-leading Essential Analog ICs from Maxim Integrated Products, Inc. The MAX31889 digital temperature sensor features an unmatched combination of accuracy and power consumption, replacing expensive resistance temperature detectors (RTDs) in precise temperature-sensitive applications. The MAX31825 digital temperature sensor enables up to 64 devices per bus, all parasitically powered by the 1-Wire® bus, to drastically reduce wiring complexity. MAX31889: Accuracy, low power and 10
design simplicity are essential objectives for designers of pharmaceutical cold chains, medical monitors and industrial automation applications. Variances as little as 2-degrees Celsius can adversely impact products and processes by limiting the producer’s ability to deliver quality products, thereby impairing the bottom line. The MAX31889 ensures the industry’s highest accuracy at the lowest power consumption, providing robust protection of customer assets. Delivering precision measurement of ±0.25-degree Celsius accuracy across a wide temperature range, the MAX31889 measures cold-chain pharma product temperatures at a fraction of the cost of RTDs and
at 35 percent the power consumed by competitive solutions. The MAX31889 comes in a 6-pin μDFN package. MAX31825: Sensitive processes and applications often require connecting multiple devices in a space-constrained system to measure temperature and protect processes, assets and equipment from unacceptable variation. Competitive solutions offer the ability to connect up to eight devices and require an additional wire for power. The MAX31825 reduces design and wiring complexity by allowing up to 64 devices, all connected to the same parasitically powered 1-Wire bus, with the precision of ±1-degree Celsius accuracy. Each device has a unique code which can Electronica Azi International | 4/2020
PRODUCT NEWS
be optionally programmed with a location address, simplifying system design. The 1Wire versatility improves system robustness by delivering an 8x reduction in necessary wiring compared to competitive two- or three-wire solutions. The MAX31825, which comes in a 6-bump WLP, also supports longer battery life and extends operational uptime with a low standby current of 2.5μA, ideal for consumer devices and factory automation. Commentary “These Essential Analog products by Maxim Integrated enable manufacturers to make their operations and supply chains more reliable, helping to ensure quality to their customers and savings to their bottom line,” said Colin Bamden, principal analyst, Semicast Research. “These temperature sensor ICs epitomize
the values of precision measurement and robust protection from Maxim Integrated’s Essential Analog portfolio. Our customers can measure temperature with precision, and thereby protect their assets from potential damage by heat or cold,” said David Andeen, executive director for the Core Products Group at Maxim Integrated. Maxim Integrated’s Essential Analog Products Maxim Integrated’s Essential Analog portfolio of high-performance, singlefunction analog ICs lead the industry in providing the core analog functions of efficient power, precision measurement, reliable connectivity and robust protection. These low-power, accurate, high performance Essential Analog integrated circuits deliver innovative products that propel next-generation wearable, wireless and advanced applications.
NEW: Maxim Integrated’s Essential Analog Mobile App Maxim Integrated’s free Essential Analog mobile app for smartphones makes it fast and easy to research analog ICs, order parts, get product news and much more. Available from Apple’s App Store and the Google Play Store, the new app brings analog expertise directly into your hands - perfect for helping you build innovative, nextgeneration systems. The app provides a window into our Essential Analog ICs, which enable you to solve the toughest design challenges in power efficiency, precision measurement, reliable connectivity and robust protection to make your systems cooler, smaller, smarter and longer running. For more information, visit https://maxim. click/Maxim_Essential_Analog_Mobile_App Maxim Integrated https://www.maximintegrated.com
Availability and Pricing • The MAX31889 is available at Maxim Integrated’s website for $1.65 (1000-up, FOB USA); also available from authorized distributors • The MAX31825 is available at Maxim Integrated’s website for $1.55 (1000-up, FOB USA); also available from authorized distributors • The MAX31889EVSYS# evaluation kit is available for $56 • The MAX31825EVSYS1# evaluation kit is available for $56 Further Information • For information about Maxim Integrated’s portfolio of Essential Analog products, visit: https://maxim.click/Essential_Analog_Products_Maxim • To order MAX31889 or learn more, visit: https://maxim.click/MAX31889 • To order MAX31825 or learn more, visit: https://maxim.click/MAX31825
MICS Modules from Murata Enable Short Range Wireless Connectivity in Low Power Implantable Medical Devices Murata announces the availability of a new addition to its Type 1RM family of ultrasmall Medical Implant Communication System (MICS) band radio modules. The LBAA0PC1RMH298 module utilises the 402-405 MHz frequency band. It supports a 128 kbps data rate and can cover a communication range of up to 2m.
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The new Murata module is designed for use in body-worn and implantable monitoring/diagnostic devices, with the capacity to address even the most dataintensive of operational requirements. Typical applications include insulin, drug, and baclofen pumps, as well as arrhythmia and bladder monitors. Supplied in an extremely compact form factor, measuring 8.6 × 5.6 × 1.7 mm, this module is one of the smallest and most highly integrated solutions currently on the market. It leverages Murata’s proprietary wireless technology, which bundles all the key constituent active and passive components into a single miniaturised package. In addition to
its elevated performance, the resultant module has a very low power budget with a sleep state current consumption of just 0.2 μA. “This latest addition to our Type 1RM family underlines the primary impetus behind Murata’s philosophy – to help create a better society by developing innovative, classleading solutions,” states Rui Ramalho, Product Manager for Connectivity Modules at Murata. “Through our numerous MICS variants, and the unique bundling technology employed by them, Murata is helping to improve the lives of patients with serious health conditions.” Data sheets and samples are available at: https://wireless.murata.com/type-1rm.html Murata https://www.murata.com 11
How to Accurately Control a BLDC Motor’s Torque and Speed in Industrial Applications
Author: Rolf Horn Contributed by Digi-Key's North American Editors
Brushless DC (BLDC) motors are an integral part of industrial production floors, primarily for use in servo, actuation, positioning, and variable speed applications. In these applications, precise motion control and stable operation are critical. As BLDCs operate on the principal of a moving magnetic field to produce the motor’s torque, when designing an industrial BLDC system, the primary control challenge is to accurately measure the motor’s torque and speed. 12
This article will briefly discuss the issues associated with achieving precise torque control, including a cost-effective means of implementing a required shunt resistor. It will then introduce the AD8479 precision difference amplifier and the AD7380 dual sampling successive approximation register ADC (SAR-ADC), both from Analog Devices, and show how they can be used to get accurate phase measurements for a robust system design. To capture the BLDC motor’s torque, two of the three inductive phase currents need to be simultaneously measured with a multi-channel, simultaneous sampling, analog-to-digital converter (ADC). A microcontroller with suitable algorithms calculates the third instantaneous phase current. This process takes an accurate, instantaneous snapshot of the condition of the motor, a key step in the development of a high precision, robust, motor torque control system.
HOW BLDC MOTORS WORK A BLDC motor is a permanent magnet synchronous motor with a back electromotive force (EMF) waveform. The observed terminal back EMF is not constant; it changes with both the torque and the speed of the rotor. While a DC voltage source does not directly drive the BLDC motor, the basic BLDC principle of operation is similar to a DC motor. The BLDC motor has a rotor with permanent magnets and a stator with inductive windings. Electronica Azi International | 4/2020
DESIGN SOLUTIONS » Brushless DC motors
This motor type is essentially a DC motor turned inside out by eliminating the brushes and commutator, and then connecting the windings directly to the control electronics. The control electronics replace the commutator function and energize the windings in the correct sequence for the required motion. The energized windings rotate in a synchronized, balanced pattern around the stator. The powered stator winding leads the rotor magnet and switches just as the rotor aligns with the stator.
The end of the signal path requires a dual simultaneous sampling ADC that sends the digital measurement data to the microcontroller. The magnitude, phase, and timing of each excitation current provide the motor torque and speed information required for precise control. CURRENT SENSING USING PC BOARD COPPER RESISTORS While there is much to be concerned about in such a precise measurement and data acquisition design, the process Figure 1
Motor control system comprises a PFC to stabilize the power, a three-phase sensorless driver for the BLDC motor windings, shunt resistors and current sensing amplifiers, a (Image source: Digi-Key Electronics) simultaneous amplifier ADC, and a microcontroller. The BLDC motor system requires a threephase, sensorless BLDC motor driver that generates the currents in the motor’s three windings (Figure 1). The circuit is supplied via a digital power factor correction (PFC) stage with inrush current control that provides stable power for the three-phase sensorless driver. Three excitation currents drive the BLDC motor, each energizing and creating the phases in the windings, each with differing phases that add up to 360°. The differing phase values is significant: As the excitation of the three legs maintain a 360° total, they balance out evenly to 360°, for example, 90° + 150° + 120°. While the current in all three windings of a system must be known at any given time, to accomplish this in a balanced system, the currents of only two of the three windings need to be measured. The third winding is calculated using a microcontroller. The two windings are simultaneously sensed using shunt resistors and current sensing amplifiers. https://international.electronica-azi.ro
low, and the measurement strategy will have minimal effect on the motor circuit. In Figure 2, the current sense amplifier captures the instantaneous voltage drop of IPHASE × RSHUNT. The SAR-ADC then digitizes this signal. The shunt current resistor selection value involves interactions between RSHUNT, VSHUNT, ISHUNT, and amplifier input errors. An increase in RSHUNT causes an increase in VSHUNT. The good news is that this lessens the significance of the amplifier’s voltage offset (VOS) and input bias current offset (IOS) errors. However, the ISHUNT × RSHUNT power loss with a large RSHUNT reduces the system’s power efficiency. Also, the power rating of RSHUNT impacts the system’s reliability as the ISHUNT × RSHUNT power dissipation can produce a self-heating condition which can lead to a change in the nominal RSHUNT resistance. For RSHUNT, special purpose resistors are available from several vendors. However, a low-cost alternative is to use careful layout techniques for the fabrication of a pc board trace resistance for RSHUNT (Figure 3). CALCULATING THE PC BOARD TRACE FOR RSHUNT As temperatures can be extreme in industrial applications, it’s important to factor temperature into a board shunt resistor design. Figure 2
Motor phase sensing system using a current shunt resistor (RSHUNT) to measure the instantaneous motor phase with a high-precision amplifier, such as Analog Devices’ (Image source: Digi-Key Electronics) AD8479 and a high-resolution ADC (AD7380). starts at the front-end with developing an effective, low-cost way to sense the BLDC motor winding phase signal. This can be done by placing a small value, inline pc board resistor (RSHUNT) and using a current sense amplifier to detect the voltage drop across this small resistor (Figure 2). Assuming the resistor value is low enough, the voltage drop will also be
In Figure 3, the temperature coefficient (α20) of a copper pc board trace shunt resistor at 20°C is approximately +0.39%/°C (the coefficient varies according to temperature). The length (L), thickness (t), width (W), and resistivity (r) determine the pc board trace resistance. 13
INDUSTRIAL CONTROL
If a pc board has 1 ounce (oz) copper (Cu), the thickness (t) is equal to 1.37 thousandths of an inch, and the resistivity (r) equals 0.6787 microohms (μW) per inch.
on a 1 oz. Cu pc board, an RSENSE length (L) of 1 in. and a trace width of 50 mil (0.05 in.), RSHUNT at 20°C can be calculated using Equations 2 and 3: Figure 3
SIMULTANEOUS SAMPLING ADC CONVERSION The ADC in Figure 2 converts the voltage at a point in the phase cycle to a digital representation. It is critical that the simultaneous phase voltage of all three windings be part of this measurement. This is a balanced system, so as alluded to earlier, only two of the three windings need to be measured; an external microcontroller calculates the phase voltage of the third winding. An appropriate ADC for this motor control system is the AD7380 dual simultaneous sampling SAR-ADC (Figure 4).
Careful pc board layout techniques are a cost-effective way to create the appropriate RSHUNT value. (Image source: Digi-Key Electronics) The pc board trace area is measured in terms of trace square (�), which is an area of L/W. For example, a 2 inch (in.) trace with a width of 0.25 in. is an 8 � structure. With the variables above, the pc board 1 oz Cu trace resistance, R�, at room temperature, is calculated using (Equation 1):
L/W = number of squares (�) = 1 in / 0.050 in = 20 squares (Equation 2) RSHUNT = (L/W) × R� = (20 �) × 0.50mW / � = 10 mW
R� ≈ r/t (1 + α20 (T - 20)) ≈ 0.50 miliohms (mW)/� (1 + 0.39%/°C (T - 20˚)) (Equation 1)
(Equation 3) The power dissipation of this resistor with a 1A shunt current is calculated using Equation 4:
Where T = temperature at the resistor. For example, starting with a 1 ampere (A) (maximum) current per BLDC motor leg
PSHUNT = ISHUNT2 × RSHUNT = 1A2 × 10 mW = 0.1 W (Equation 4)
In Figure 4, the AD8479, is a precision difference amplifier with a very high input common-mode voltage range (±600 volts) to survive wide motor current drive excursions from the three-phase sensorless driver. The AD8479’s characteristics are such that it can replace costly isolation amplifiers in applications that do not require galvanic isolation. Figure 4
A fast, low-noise dual simultaneous sampling SAR-ADC such as the AD7380 can capture an instantaneous picture of two of the motor windings. 14
(Image source: Digi-Key Electronics)
Electronica Azi International | 4/2020
DESIGN SOLUTIONS » Brushless DC motors
Key characteristics of the AD8479 also include low offset voltage, low offset voltage drift, low gain drift, low commonmode rejection drift, and an excellent common-mode rejection ratio (CMRR) to accommodate swift motor changes.
trol, the dual simultaneous sampling SARADC structure performs an instantaneous capture of the current sensing amplifier’s output. For this, the AD7380/AD7381 have two identical, internal ADCs that are clocked simultaneously.
Figure 5
Shown is the ADC conversion stage for one of the AD7380’s two channels. Signal acquisition begins when SW3 is opened and SW1 and SW2 are closed. At that point, the voltage across CS changes to changes to AINx+ and AINx-, (Image source: Analog Devices) causing the comparator inputs to become unbalanced The AD7380/AD7381 are 16-bit/14-bit, respectively, dual simultaneous sampling, high speed, low power, SAR-ADCs that feature throughput rates up to 4 Msamples/s. The differential analog input accepts a wide common-mode input voltage. A buffered internal 2.5 volt reference (REF) is included. To achieve precise torque and speed con-
They each also have a capacitive input stage with a capacitive charge redistribution network (Figure 5). In Figure 5, VREF and ground are the initial voltages across the sampling capacitors, CS. Opening SW3 and closing SW1 and SW2 initiates signal acquisition. When SW1 and SW2 close, the voltage across
the sampling capacitors, CS, changes per the voltage at AINx+ and AINx-, causing the comparator inputs to become unbalanced. SW1 and SW2 are then opened, and the voltage across CS is captured. The CS voltage capture process involves the digital-to-analog converters (DACs). The DACs add and subtract fixed amounts of charge from CS to bring the comparator back into a balanced condition. At this point, the conversion is complete, SW1 and SW2 are opened, and SW3 is closed to remove residual charge and prepare for the next sampling cycle. During the DAC conversion time, the control logic generates the ADC output code and the data is accessed from the device via a serial interface. CONCLUSION The accurate measurement of BLDC motor torque and speed begins with an accurate, low-cost shunt resistor. As shown, this can be cost-effectively implemented using a pc board trace. By adding this to the combination of an AD8479 current sense amplifier and an AD7380 simultaneous sampling SAR-ADC, a designer can create a high-precision, robust, torque and velocity control system measurement front-end for environmentally hostile motor control applications. Digi-Key Electronics www.digikey.com
Digi-Key Electronics Announces Global Partnership with EAO Corporation for New Digital Product Selector Tool Digi-Key Electronics announced that it has expanded its tool offerings by signing a global partnership with EAO to provide Digi-Key customers with a new Digital
Product Selector (DPS) tool for emergency stop switches. EAO’s Digital Product Selector is an interactive and intuitive virtual configuration tool, enabling engineers and designers to easily configure products online to their specific needs. EAO’s Digital Product Selector, exclusively offered by Digi-Key, takes the guess work out of configuring emergency stop switches for engineers and designers The new DPS tool offers an engaging user experience for cusEAO’s Digital Product Selector, exclusively offered by Digi-Key, takes the guess tomers to select emerwork out of configuring emergency stop switches for engineers and designers gency stop switches
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and configure them to their needs based on 3D photo realistic selections, as well as parametric input. Customers can view 360-degree images, mounting depths, dimensional representations, illumination previews, and panel mounted views. Users can also download files such as data sheets designed for specific configuration, CAD drawings, launch installation videos and certifications. The new tool gives customers access to over 130 parts, which can be configured in more than 2,000 different combinations. Once a customer has selected a configured emergency stop switch to meet their specific needs, they may add it to their cart and purchase it through Digi-Key’s website. Digi-Key Electronics https://www.digikey.com 15
PRODUCT NEWS
Reliable Panel PC solution with True Flat PCAP Touch With the P156-10AI, another Panel PC from the P-series of ICP Germany comes onto the market, which is equipped with True Flat PCAP Touch Technology. The P156-10AI offers a 15.6" TFT-LC display with Full HD resolution (1920×1080) and 16.2 million colors at a color depth of 8 bit. The display delivers a brightness of 450 cd/m2 and a viewing angle stability of 170°/170°. The front offers IP65 protection and the airbonded 10-point True-Flat
Projected Capacitve Touch Screen provides a crystal clear image. Anti-glare, anti-reflection and anti-bacterial coatings are optionally available. The cornerstone of the P156-10AI is the Thin-Mini-ITX Board PD10-AI, which is equipped with a dual core Intel® Apollo Lake-M CeleronTM N3350 with a maximum turbo frequency of 2.4 Ghz. Optionally, other processors such as the quad-core PentiumTM N4200 with a maximum 2.5GHz are also available. In terms of memory, the P156-10AI can be equipped with a maximum of 8GB DDR3L with 1867MHz clock frequency. On the I/O Shield, the motherboard provides two RJ45 Gigabit Ethernet ports with Intel® I211-AT network chips, one HDMI and one display port each for connecting additional displays and four USB3.0 interfaces. Furthermore two RS-232 interfaces and an eight bit GPIO slot are provided. A 2.5" mounting frame with SATA connection is available for storage media. Via the M.2 2230 E Key and the M.2 2280 B Key with PCIe and USB signal the P156-10AI can be equipped with add-on cards. The P156-10AI is designed for a voltage range from 8 to 24 Volt DC and can be operated in a temperature range from -20°C to 55°C. The compact size of 387×236×68 mm and the possibility to operate the on/off switch remotely allow easy panel mounting. Suitable for the P156-10AI, ICP Germany supplies industrial storage media and main memory. ICP Deutschland GmbH https://www.icp-deutschland.de/en/home
High-performance 21.5" Panel PC with True Flat PCAP Touch ICP Germany extends the True-Flat PCAP Panel PC series by further high-performance variants with Kaby Lake processors. The P210-11KS is equipped with an Intel® CoreTM i3-7100U as standard. Alternatively, models with Celeron® 3965U, CoreTM i57300U and CoreTM i7-7600U are available. Compared to the P210-10AI with Apollo Lake SoC, the new variants offer performance gains of up to 236%. The P210-11KS offers a 21.5" TFT-LC display with Full HD resolution (1920×1080) and 16.7 million colors at 8 bit color depth. The display delivers a brightness of 250 cd/m2 and a viewing angle stability of 170°/160°. The front offers
the proven IP65 protection and the airbonded 10-point TrueFlat Projected Capacitve Touch Screen provides a crystal clear image. Anti-glare, anti-reflection and anti-bacterial coatings are optionally available. The two 260-pin SODIMM sockets hold a maximum of 32 GB DDR4 memory with a clock speed of 2133 MHz. Two RJ45 Gigabit Ethernet ports with Intel® I219-LM and I211-AT network chips, one HDMI and one display port for connecting additional displays and four USB3.0 interfaces are available as interfaces. Four RS-232 interfaces and an eight-bit GPIO slot are also provided. In addition to the two integrated twowatt speakers, further audio interfaces such as MIC-IN or LINEOUT are provided on the IO-Shield. A 2.5" rack with SATA connection is available for storage media and the P210-11KS can be equipped with add-on cards via the M.2 2230 E Key with PCIe and USB signal. The P210-11KS is designed for a voltage range from 8 to 24 Volt DC and can be operated in a temperature range from 0°C to 50°C. The compact size of 508×308×83 mm and the possibility to operate the on/off switch remotely allow easy panel mounting. Suitable for the P210-11KS, ICP Germany supplies industrial storage media and main memory. Applications • Display systems; • Info terminals • Self-Service Terminal; • Automation Controller • Embedded Device Dashboard • Input device for production lines ICP Deutschland GmbH https://www.icp-deutschland.de/en/home
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Electronica Azi International | 4/2020
PRODUCT NEWS
Silicon carbide MADK board for servo drives: Easy start with CoolSiC™ MOSFET technology in drives applications In power electronics motor drives take up a major share in the market. With its CoolSiC™ MOSFET Modular Application Design Kit (MADK) boards Infineon Technologies AG helps in further shortening time to market in this relevant segment. As part of the MADK platform for motors of up to 7.5 kW, the evaluation board EVAL-M5-IMZ120R-SIC is a 3-phase inverter board aiming at servo drive applications. As a true first, Infineon offers details about schematics (PDF), parts (Excel), layout (Gerber), and design package (Altium) as download package on the company’s website. In this way, the board can also serve as a reference design facilitating the design process. For servo drive applications, silicon carbide reduces semiconductor power losses by up to 80 percent. Making use of this technology can lead to zero maintenance of drives since fans might not be needed
for cooling. Additionally, it allows the integration of motor and drive with less complex cabling making inverter cabinets redundant. The evaluation board
was developed to support customers during their first steps designing applications with the CoolSiC™ MOSFET 1200V in discrete packages (IMW120R045M1) and EiceDRIVER™ 1200 V isolated gate driver (1EDI20H12AH). The assembled discrete
has a rated blocking voltage of 1200 V at a typical on-state resistance of 45 mΩ, the board supports all CoolSiC™ MOSFETs in 3pin and 4pin TO247 packages. The evaluation board integrates a 3phase rectifier EMI filter, current sensors, and protection features as well as thermal management and heatsink. All relevant analog and control signals are easily accessible with test pads. To ensure precise measurements the signals are isolated from the power part. The board is equipped with a 32-pin interface connector for all control signals, this M5 connector is fitting to the controller board XMC DriveCard 4400 (KIT_XMC4400_DC_V1). In combination, evaluation and control board make the motor run with little effort and within a short period. Infineon Technologies https://www.infineon.com
Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric and Hybrid Electric Vehicle HVAC Systems Renesas Electronics Corporation introduced the ZSSC4132 – an automotive pressure sensor solution featuring an integrated certified LIN v2.2a interface. The single-package sensor signal conditioner (SSC) delivers best-in-class performance, increased design flexibility, and cost efficiency in a compact form factor for HVAC applications used in plug-in hybrid electric vehicle (PHEV), Battery
Electric Vehicle (BEV), and Fuel-cell Electric Vehicle (FCEV) climate control systems. The ZSSC4132 can be configured for nearly all resistive bridge sensors. This flexibility, combined with leading performance levels, an integrated LIN PHY, small package footprint, and AECQ100 Grade 0 qualifications, makes the SSC ideally suited for small automotive sensor modules with limited space, tight
budget and end-of-line (EOL) calibration requirements. Key Features of the ZSSC4132 The ZSSC4132 combines best-in-class analog front end (AFE) technology for enhanced sensor signal conditioning as well as digital calibration to significantly reduce the noise sensitivity and deliver high accuracy for pressure and temperature readings. The SSC’s integration reduces overall bill of material (BOM) requirements by minimizing the need for external components. In addition, the ZSSC4132’s unique digital calibration feature that allows customers to minimize calibration efforts, further reducing overall system costs. Availability The ZSSC4132 is available now in a 4mm × 4mm, 24-lead QFN package with prices starting at $1.38 USD per unit in 10,000unit quantities. An evaluation kit for the ZSSC4132 is also available now with prices starting at $185 USD. Renesas Electronics Corporation https://www.renesas.com
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17
PRODUCT NEWS
Mouser Widens Industry-Leading Line Card, Adds 45 New Manufacturers in First Half of 2020 Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, further bolstered its industry-leading line card by adding 45 new manufacturers to date in 2020. Bringing Mouser’s current line card to almost 850 manufacturer partners, these new manufacturers enable Mouser to provide an even wider range of product options for its global customer base of design engineers, component buyers, and procurement agents. Mouser continues to focus on the breadth of its product offering, with new manufacturers in product categories such as embedded, connectors, optoelectronics, semiconductors and hardware. Among the manufacturers, many of the new manufacturers are embedded as Mouser continues to expand its Internet of Things (IoT) offerings. The global authorised distributor provides the world’s most extensive assortment
and inventory of the newest semiconductors and electronic components, with more than five million products in stock. Among the new manufacturer partners Mouser has added in 2020 are:
• GigaDevice, a leading provider of nonvolatile memory solutions. • Fractus Antennas, designers and manufacturers of miniature, off-the-shelf antennas for IoT, mobile connectivity and
• Mini-Circuits, a leading supplier of radio frequency (RF), microwave and millimetre-wave components and systems. • Kontron, a leading global provider of IoT and Embedded Computing Technology (ECT) and a Premier Member of the Intel® Internet of Things Solutions Alliance. • Amphenol i2s, a leader in intelligent sensor solutions for almost 20 years.
short-range wireless devices. For more information on Mouser’s newest manufacturer partners, go to: https://eu.mouser.com/new-manufacturer. To see the latest products available from Mouser, visit https://eu.mouser.com/new. Mouser Electronics https://www.mouser.com
Latest u-blox GNSS technology platforms offer out-of-the-box support for recently completed BeiDou-3 navigation satellite system modernizations u-blox announced that its current GNSS platforms, from u-blox M8 and beyond, support the recently completed BeiDou navigation satellite system modernizations, improving the availability of GNSS positioning services. The opening ceremony of the BeiDou-3 global navigation satellite system (GNSS) was held in Beijing on July 31, officially celebrating the expansion of coverage offered by the critical Chinese space infrastructure to a global user base. As a global supplier of industry-leading GNSS positioning and wireless communication technologies, u-blox has been driving technological innovation and deeply involved in the Chinese market for many years. Tests conducted across China and Europe have shown that including the BeiDou system can improve the positioning accuracy of GNSS receivers when multiple navigation satellite systems are tracked concurrently. In particular when signals are partially obstructed, positioning accuracy can be significantly improved by incorporating the BeiDou system. 18
GNSS: a winning ingredient in emerging applications Data shows that in 2019, the overall output value of the Chinese satellite navigation and location service industry reached nearly 345 billion yuan, an increase of 14.4% over 2018, with the output value expected to exceed 400 billion yuan in 2020. The BeiDou global nav-
igation satellite system provides a whole suite of additional services, including satellite and ground-based augmentation services, precise single-point positioning, precise timing, and global short message services, laying a solid founda-
tion for BeiDou's ubiquitous navigation and tracking applications. Applications of GNSS technology continue to diversify, leveraging the all-weather, alltime, tracking, navigation, and timing services it offers. GNSS technology is penetrating deeper into traditional industrial verticals, such as agriculture, forestry, animal husbandry and fishery, power and energy, as well as in railway and air transportation, including their infrastructure construction and management. At the same time, GNSS technology has become an indispensable and "smart" winning factor in emerging application fields such as the Internet of Things and the Internet of Vehicles, as well as in innovative applications such as autonomous driving, automatic parking, and automatic logistics, and is now commonplace in many industrial and consumer use cases. u blox https://www.u blox.com Electronica Azi International | 4/2020
PRODUCT NEWS
Panasonic Industry Europe intensifies collaboration with NXP Semiconductors Panasonic Industry Europe is proud to announce its Gold partner status under NXP Semiconductor’s Ecosystem member program. With the Gold partner status NXP recognizes market leaders and strengthens the bond for future product development. It also underlines a strong strategic positioning between the products of both companies and the shared mindset for offering solutions to customers which are one step ahead in the market. The close relationship between NXP Semiconductors and Panasonic Industry enables customers to utilize the features of NXP’s MCUXpresso software with integrated driver support for Panasonic Wi-Fi solutions like the PAN9026 module on the i.MX RT MCU series. This valuable advantage simplifies and accelerates the application development and speed-up the ready-to-market process. Furthermore the PAN9026 Wi-Fi Dual
Band and Bluetooth module supports Linux Full GPL for NXP’s i.MX6 or i.MX8 and any other Linux based application processor.
Pascal Meier, Panasonic Industry Product Marketing Sensors & Wireless Connectivity states: “We are very proud to be awarded the Gold partner status within NXP’s member program because our customers profit from the knowledge and experience of Panasonic and NXP. With the combination of NXP’s 88W8977 SoC on the PAN9026 module for
example we were able to combine the most important short range wireless technologies in one chip. Engineered in Germany, manufactured in Slovakia we can provide our customers the flexibility for a wide range of wireless applications.” In a joint web-seminar of NXP Semiconductor and Panasonic Industry we will showcase the potential of the Panasonic PAN9026 Wi-Fi module combined with the i.MX RT Microcontroller range of NXP. We will discuss the product advantages of coupling i.MX RT crossover MCUs with the PAN9026 module and present live demonstration of the Panasonic Wi-Fi + Bluetooth combination module running on the i.MX RT1060 MCUs. This web-seminar will be held on the 16th of September from 10 – 11 am CEST. You can register for your virtual seat here. Panasonic Industry Europe https://industry.panasonic.eu
Smart Touch Displays in a compact format With the uniTFTs series, Electronic Assembly offers a range of small touch displays that give every switch or control unit the operating convenience of a tablet. With integrated graphics controller, extensive graphics functions and numerous interfaces, the displays are ready to run without additional peripherals.
Only three fingers wide is the smallest variant from Electronic Assembly's new uni TFTs series. Nevertheless, this capacitive touch display has a resolution of 320 × 240 pixels on its 2.0 inch screen diagonal. In addition, this series is currently also available in 2.8 inch (320 × 240), 3.5 inch (480 × 320) and 4.3 inch (480 × 272) diagonals.
The brilliant color displays are using improved IPS-Panels with AACS technology (All Angle Color Stability). Contrast and colors are retained even at extreme viewing angles. Unlike commonly used TNPanels these displays do not have an inverse tilt effect. With typ. 1,000 cd/m2 and more brightness, the displays are rich in contrast and clearly readable even in direct sunlight. A video on website show this impressively. All screens are equipped with an optically bonded, capacitive touch surface. Extensive graphic functions support the programming of impressive touch and display functions as well as animations with the included Windows tool uniTFT Designer (available f.o.c.). All displayed objects can be animated and can be changed in form, colour and content during runtime. With USB, RS232, SPI and I2C the uniTFTs have all common serial interfaces. Four analog inputs as well as eight freely definable I/O interfaces are used to acquire data and issue control commands. The I/Os are expandable up to 136. ELECTRONIC ASSEMBLY GmbH https://www.lcd-module.com
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19
EMBEDDED APPLICATIONS
Design separately, integrate seamlessly:
Dual-core Digital Signal Controllers speed development for design engineering teams
By Tom Spohrer
For example, a contemporary automotive DC to DC converter design project team might be comprised of power supply firmware developers from one site or country and communication stack firmware developers from another site or country. Integrating the code developed at multiple locations onto the same microcontroller can increase the schedule risk due to the complex interaction between the separately designed firmware. 20
Today’s engineers are often challenged to develop increasingly sophisticated designs while completing them within shorter schedules. The requirements for products that include additional functional safety features or complex communications capabilities adds to the design complexity and challenges. Sometimes compounding these challenges is the geographically-dispersed nature of the engineers available to work on a particular product. INTRODUCING THE DUAL-CORE DSC FAMILY System developers designing high-end embedded control applications with multiple software teams can now benefit from a new family of dual-core Digital Signal Controllers (DSCs) in a single chip, enabling easier software integration. Microchip Technology’s dsPIC33CH has one core designed to function as a master, while the other functions as a slave. In
this master-slave architecture, the slave core can be used for executing dedicated, time-critical control code, while the master core is busy running system-level functions, including user interface (UI), monitoring and communications, customised for the end application. The dsPIC33CH is designed to facilitate independent code development for each core by separate design teams – but later enables seamless integration when they Electronica Azi International | 4/2020
DESIGN SOLUTIONS » Dual-core Digital Signal Controllers
are brought together in one chip. Its dual independent cores simplify firmware development, enabling a multi-team software development approach, with two workflows running in parallel. Time-critical control loops can be separated from housekeeping functions such as UI, monitoring and diagnostics, and communication. This speeds the development process, allows each core’s code to be individually and more effectively optimised, with minimal code interaction between the two cores, easing the debug process. IDEAL APPLICATIONS The dsPIC33CH family is optimised for high-performance digital power, motor control and embedded applications requiring sophisticated algorithms. Typical power applications for this dualcore controller include wireless charging, server power supplies, DC to DC converters, chargers and inverters. The family will also be popular for motor control in pumps, fans, drones, robotics, power tools and consumer appliances. As a high-performance DSC, these devices excel when used in automotive electronic sensors, industrial automation and control and medical diagnostic equipment. Benefiting from two microcontroller cores on the same die, this family can provide the performance required for gateways and central processors for IoT applications. For example, in a digital power supply, the slave core manages the math-intensive algorithms, closing the control loop in firmware by running latency-critical compensator algorithms, while the master core independently manages the PMBus™
protocol stack and provides system monitoring functions, increasing overall system performance and responsiveness. In an automotive fan, pump or other motor control application, the slave core can be dedicated to executing time-critical speed and torque control, while the master core runs functional safety routines and manages the Controller Area Network Flexible Data rate (CAN-FD) stack for robust communications, as well as other system-level functions, including monitoring and diagnostics. And in other highperformance embedded applications, such as electronic sensors used in automotive or IoT systems, the slave core accelerates math-intensive functions, such as DSP filtering of sensor inputs, while the master core facilitates reliability and fault-tolerance for safety-critical applications. HIGH-PERFORMANCE The master core has 64 to 128 Kilobytes of program flash, with ECC and 16KB RAM, while the slave has 24KB of program RAM, with ECC and 4KB data RAM. Core frequency for the master is 90MIPS at 180MHz, while the slave delivers 100MIPS at 200MHz. Additionally, both processor sub-systems have their own interrupt controllers, clock generators, port logic, I/O MUXes and PPS. The device is effectively the equivalent of having two complete dsPIC® DSCs on a single die. The two cores work seamlessly together, enabling advanced algorithms to improve efficiency and responsiveness. In addition, each of the new cores in dsPIC33CH devices has been designed to deliver more performance than current dsPIC DSC cores, through more context-
selected registers to improve interrupt responsiveness, new instructions to accelerate DSP (digital signal processor) performance and faster instruction execution. In a performance-critical calculation used in many power supplies, the new controller achieves core performance almost twice as fast as the previous generation – with latency of 280ns, compared to 543ns. Another key benefit of distributing processing workload across two DSC cores in a single device is the ability to achieve higher power density through higher switching frequencies (more than 2MHz compared to around 1MHz for a single-core controller), which can result in smaller components. Live system updates enable firmware to be upgraded with zero downtime, which is especially important in high-availability systems, such as server power supplies. Additionally, the dsPIC33CH architecture allows the two cores to be programmed to monitor each other for functional safety reasons, facilitating robust system design. To reduce system costs and board size, typical advanced peripherals available to each core include high-speed Analog to Digital Converters (ADCs), Digital to Analog Converters (DACs) with waveform generation, analogue comparators, analogue programmable gain amplifiers and high-resolution Pulse Width Modulation (PWM) with 250ps resolution. With up to 12 PWM channels, the controller is well suited for uninterruptible power supplies (UPS), DC/DC converters and AC/DC power supplies. The devices in the dsPIC33CH family are the first Microchip dual core, 16-bit digital signal controllers, and they deliver unprecedented integration in packages as small as 5 × 5 mm. These are the first dsPIC33s capable of managing CAN-FD for robust communication, with increased bandwidth. It is available in eight package variants and is supported by Microchip’s MPLAB® development ecosystem, including Microchip’s free, downloadable and award-winning MPLAB X Integrated Development Environment (IDE) and MPLAB Code Configurator. CONCLUSION Microchip’s dsPIC33CH is optimised for high-performance and time-critical, realworld embedded control applications. The dsPIC33CH family enables separate code design and seamless integration, while also reducing system cost and size. Microchip Technology www.microchip.com
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PRODUCT NEWS
Rutronik develops first development kit for AI based applications to implement EDGE intelligence
The first development kit developed by Rutronik, the RUTDevKit-STM32L5, is a complete solution for AI-based applications running on an MCU platform. It enables hardware and firmware developers to deliver proof-of-concepts within a short space of time. The focus here is firmly on security and data protection, short latency periods, low energy consumption and adequate storage resources. Data generated by (I)IoT ((Industrial) Internet of Things) devices is increasingly evaluated on MCU platforms within the application or close to the MCU-based embedded system. This is particularly the case in industrial environments, whether for security reasons or because of the 22
required latency periods. When it comes to implementing this Edge AI or Edge Intelligence (EI), Rutronik now offers a unique development kit that contains all the necessary components. Every single module is from the Rutronik product portfolio, while the complete BOM is available at www.rutronik.com/development-kit. The RUTDevKit-STM32L5 is based on the ultra-low-power high-performance microcontroller STM32L562ZET6Q, which operates at 110MHz. Its 32bit RISC-Core Arm Cortex-M33 with Arm TrustZone offers hardware-based security features that ensure data security of the EI application during the inference phase. Thanks to Arm TrustZone, one core provides two inde-
pendent processing environments: A protected one for cyber protection and sensitive code, and an unprotected one for the execution of untrusted code. Further, Arm TrustZone also supports Secure Boot, thereby enabling secure read and write protection for the integrated memory (64Mbit PSRAM and 128Mbit NOR flash) and cryptography acceleration. Arm TrustZone can also include I/O ports, a peripheral function and flash or SRAM regions. The Octo SPI interface to PSRAM and the Quad SPI interface to the NOR flash memory along with the fast A/D converter of the microcontroller support short latency periods. In addition to the microcontroller memory, the RUTDevKitSTM32L5 facilitates use of an SD card with Electronica Azi International | 4/2020
PRODUCT NEWS
OVERVIEW OF THE RUTDEVKIT-STM32L5 COMPONENTS: Hardware: • STM32L562ZET6Q Cortex®-M33 512KB Flash • APS6408L 64Mbit Octo-SPI PSRAM • EN25QH128A 128Mbit Quad-SPI NOR Flash • CAN FD with TLE9251VLE driver • USB-C Power Supply with TCPP01-M12 Protection IC • RS485 Interface with ST3485EDBR driver • Slot for Micro-SD card • On-Board ST-LINK V2 debugger / programmer • Arduino extension connector • 4-layer design several GB as well as a protected area to securely store both raw data and inference data of the AI model. Equipped with CAN FD and RS485 interface, the kit enables fast transmission of large amounts of data. The USB-C power supply features Protection IC, and low power functions can be tested with a battery. Additionally, there is the on-board STLINK V2 debugger / programmer as well as Arduino interfaces for supplementary boards, such as an Anybus communication
Software / Firmware: • CAN-FD test mode demo • RS485 Modbus demo • USB power supply demo • Dual bank flash bootloader demo • TrustZone® demo • Tamper detection demo
module that enables products to communicate via all common field buses and on Industrial Ethernet networks, e.g. EtherCat. The kit also includes software and sample firmware, including a TrustZone demo, a test mode demo for CAN FD, an RS485 Modbus demo, a USB power supply and tamper detection demo, and a dual bank flash bootloader demo.
The RUTDevKit-STM32L5 is available from Rutronik at www.rutronik.com/ development-kit. Rutronik Elektronische Bauelemente https://www.rutronik.com
Better streaming and connection quality: Rutronik expands portfolio with Intel® WiFi 6 modules More performance thanks to new standard: The Intel® AX200-/ AX201 modules ensure smooth streaming of highresolution video, fewer dropped connections and faster connections, even at greater distances from the router or in dense environments. This is possible by implementing the new WiFi 6 (802.11ax) standard with its features OFDMA, 1024QAM, Target Wake Time (TWT) and spatial reuse. The Intel® Wi-Fi 6 portfolio is available at www.rutronik24.de. The AX200 features a PCIe interface for Wi-Fi and a USB interface for Bluetooth 5. Bluetooth® 5.1 offers a range of 4x over Bluetooth® 4.2 with the same Tx performance, enabling ubiquitous availability. It also doubles the speed of data rates, thereby reducing overall power consumption. It also improves data transmission, enabling seamless location-based services and easier pairing of Bluetooth® devices. The AX201 CRF module created for use with Intel‘s proprietary interface (CNVio2), matches therefore only with certain Intel® chipsets and platforms. https://international.electronica-azi.ro
PERFORMANCE AND SECURITY AT THE HIGHEST LEVEL Using Wi-Fi 6 technology with 1024QAM and 160 MHz channels, Intel® Wi-Fi 6 modules can deliver nearly three times the peak data rates (up to 2.4 Gbps) and
uses orthogonal frequency division multiplexing (OFDMA) and MU-MIMO (Multi User Multiple Input, Multiple Output) to ensure communication between the access point and multiple devices. In addition to the improved performance, the new WPA3 features provide state-of-the-art authentication and military-grade encryption, creating a secure environment for sensitive data traffic. The M.2 2230 form factor modules are designed for flexible system configuration and platform usage by using a standard Key-A or Key-E socket. M.2 1216 modules, on the other hand, enable space-saving platform design.
up to four times the capacity improvement in dense or congested environments compared to Wi-Fi 5 (IEEE 802.11ac). The new IEEE 802.11ax Wi-Fi standard
For more information about Intel‘s new WiFi 6 modules and a direct ordering option, please visit our e-commerce platform at www.rutronik24.com. https://www.rutronik24.com/ search-result/qs:ax200% 20ax201 Rutronik Elektronische Bauelemente https://www.rutronik.com 23
BLUETOOTH SIG
Bluetooth 5.1
With New Direction Finding Function Aimed at Industrial
(Image source: Bluetooth SIG)
By Heike Halder, Product Manager - Wireless Competence Center
With the latest generation of Bluetooth Low Energy, Core Specification 5.1 (available here), the Bluetooth Special Interest Group (Bluetooth SIG) has paved the way for even more precise location tracking services based on the widespread Bluetooth standard. ABI Research expects up to 431 million products supporting Bluetooth location tracking services to be sold in 2023 [Bluetooth Market Update 2019]. In addition to the known distance tracking functionality using RSSI, the new Core Specification also offers a direction-find24
The Core Specification 5.1 for Bluetooth and the directionfinding function that it contains now allows for direction detection and improves location tracking accurate to just a few centimeters. Thanks to numerous improvements in automation scenarios and indoor location tracking services, Bluetooth will be a serious option for hard industrial applications in the future. ing function that allows the direction from which a signal is coming to be determined. This also allows for very precise position tracking, accurate to just a few centimeters, and offers a wide variety of new potential applications, both in the consumer segment and in industrial applications. PROXIMITY-BASED SOLUTIONS AND POSITIONING SYSTEMS Bluetooth-based location tracking services may take the form of proximity-based solutions or positioning systems (Figure 1).
The former are frequently applications that are used to approximate the distance between two Bluetooth devices within range of one another – often smartphones. Typical applications for proximitybased solutions already in use include point-of-interest solutions (POI), for example in retail or museums – when a visitor approaches a POI, they receive detailed information about the object being viewed. Many functions for everyday objects are also based on the proximitybased solution concept. In these applications a ‘beacon tag’ is placed on the object Electronica Azi International | 4/2020
DESIGN SOLUTIONS Âť The Core Specification 5.1
to be located (keychain, pallet, etc.) that can then be found using the smartphone. The second type, the positioning system, determines the location of individual objects in a closed system – a defined spatial area such as a warehouse, museum or airport lobby. The most common applications are real-time location systems (RTLS) and indoor positioning systems (IPS). RTLSs enable multiple persons or objects equipped with appropriate tags to be
tracked within a closed system. This makes it suitable for applications such as locating and tracking equipment, pallets or personnel in a warehouse. Indoor positioning systems are comparable to GPS, but unlike these, they also work in enclosed spaces. Permanently installed locator beacons regularly transmit signals that can be received by devices such as smartphones, which calculate their relative position based on the distance to the indi-
vidual beacons. This allows passengers or visitors at airports or shopping malls to better find their way around. Previously, all Bluetooth-based location tracking systems were based on estimated distances calculated using the Received Signal Strength Indicator (RSSI). Using a reference value and the actual measured signal strength, the receiver calculates its distance from the beacon to just a few meters accuracy (~1m - 10m).
Figure 1: Bluetooth-Based Location Tracking Services ANTENNA MESH ENABLES DIRECTION FINDING Direction finding is a new function in Bluetooth 5.1 that allows not only the distance of a signal but also the direction of its source to be determined. Traditional proximity-based solutions also benefit from this, as the direction of a signal is essential information that for example makes looking for an object much easier. (Image source: Bluetooth SIG)
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BLUETOOTH SIG
To determine the direction of a signal, either the receiver (angle of arrival, AoA) or the transmitter (angle of departure, AoD) of a location signal must have a permanently installed antenna mesh (Figure 2). In both versions, the receiver determines the direction from the signal is coming. However, the direction-finding algorithms are not part of the Bluetooth 5.1 Core Specification. These can be determined by triangulating one or several angles measured using AoA or AoD along with the distance measured using RSSI. This allows location determination that is accurate to just a few centimeters.
current IPSs, the user now receives not only their position, but also information about the direction of their destination. Unlike AoA-based applications, the AoD-based method is better suited to situations that rely on connectionless communication. DESIGN OF THE ANTENNA MESHES Regardless of the method used, one of the most important success factors for the direction-finding function is the number and arrangement of the antennas. A series of antennas arranged simply in a row allows only the angle to be determined. More complex arrangements in three-
Figure 2: Left: The antenna mesh is in the receiver; Right: The antenna mesh is in the transmitter AoA FOR TRACKING, AoD FOR NAVIGATION IN ENCLOSED SPACES In an AoA-based application the transmitter is a beacon with a single antenna, such as a smartphone or a simple tag. Multiple permanently installed receivers (locators), each equipped with a complex antenna mesh, determine the direction from which they receive the signal. AoA applications are especially well-suited to tracking objects (RTLS), such as in automated production or warehouses. They also enable enhanced accuracy when using beacons at points of interest. AoD-based applications use antenna meshes on the transmitter of a beacon signal to send the signal via the different antennas in sequence. In this case the receiver – probably often a smartphone in the future – will have an antenna to receive the sequential signals. If the position of the beacons is known, the receiver can determine its position relative to the transmitters. This makes AoD-based applications especially well-suited to indoor positioning systems (IPS) for simple navigation in enclosed spaces such as airports. Unlike 26
dimensional space allow both horizontal and vertical angles to be determined. The Bluetooth SIG has not yet provided any specific requirements or recommendations regarding the arrangement of the antennas, although it is likely that this will change when more profiles on the new location-tracking services are published. BLUETOOTH 5.1 HAS GREAT POTENTIAL With the introduction of the latest-generation Core Specification 5.1 for Bluetooth and its direction-finding function, the Bluetooth SIG has taken a major step towards greater precision in locationtracking services, which may enable significant improvements in a variety of application scenarios. However, there are a number of aspects to be considered if this potential is to be leveraged. For example, an ideal application scenario must minimize reflections and multi-path interference. The ideal constellation is a closed system with enough permanentlyinstalled locator beacons that have the tag in view at all times. For indoor navigation using smartphone to work throughout the
entire area, Bluetooth 5.1 must be integrated into all readily-available smartphones. Polarization must also be taken into account when using smartphones, as its direction is almost impossible to control. The limited space in smartphones makes it likely that only one antenna will be available, even in the future, which is why smartphones will only be usable as transmitters in AoA-based applications or as receivers in AoD-based applications. FORWARD-LOOKING Nordic Semiconductor is one of the first manufacturers to offer a multi-protocol SoC (system on chip) with support for the new Bluetooth Core Specification 5.1. The nRF52833 supports not only Bluetooth Direction Finding and Bluetooth Long Range but also Bluetooth mesh, 802.15.4, Thread and Zigbee as well as proprietary 2.4GHz protocols, allowing for applications involving distance measurements accurate to a matter of centimeters and direction information. The SoC is based on a 64 MHz ARM Cortex M4F processor with 512 KB flash memory and 128 KB RAM. Other features include full-speed 12 Mbps USB, high-speed 32 MHz SPI and +8 dBm output power. Its analog and digital interfaces include NFC-A, ADC, UART/SPI/TWI, PWM, I2S and PDM. Its supply voltage range is 1.7V to 5.5V. The nRF52833 is operable in an expanded temperature range of -40°C and 105°C.
The seminars also include a presentation by Telit as supplier of mobile wireless, M2M sim solutions, IoT device management and short-range wireless, and by Intel, producer of WiFi 6 solutions. Simply register at www.rutronik.com/seminars/ innovation-in-automation-2019/. Sources: • Bluetooth 5.1 Core Specification • Enhancing Bluetooth Location Services • A Technical Look at Direction Finding • Bluetooth Markt Update 2019, ABI Research Rutronik www.rutronik.com Electronica Azi International | 4/2020
DESIGN SOLUTIONS » Development Boards
How to Select the Right Board Author: David Sandys, Director, Technical Marketing, Digi-Key Electronics PERIPHERAL SET Identifying what inputs and outputs your system will have and how it will communicate with the rest of the system, as well as the world, can make all the difference. Do you need anything more than I2C or SPI? What about USB, CAN or some industrial-specific bus? Will it send data to the cloud or just communicate locally? How about audio or video? Make sure you look at the architecture of the main MCU/CPU for what peripherals it supports. Major suppliers and their architectures like ST Microelectronics STM32, Microchip PIC or AVR and NXP i.MX or LPC all offer varying functionality at multiple price points. Having all or even most of these needs met via a single board may save lots hardware development time and may also simplify software development as well.
CODING ENVIRONMENT Another question to ask is what type of code base do you want to use? Traditional C/C++ IDEs like ARM Development Studio or GNU as well as modified versions like the Arduino IDE are the incumbents, but some new support for scripting languages like Java or Python have been making strides especially in non-commercial or rapid prototyping environments. Adafruit has aggressively supported their CircuitPython platform which is one of the easiest to implement for MCU-based designs. Other company’s boards are following their lead with over 150 boards now supporting the CircuitPython environment. Make sure your board, or more specifically your main CPU/MCU architecture, is supported by the coding environment you would like to use. https://international.electronica-azi.ro
ECOSYSTEM In most designs, not every function is going to be ideally implemented on the board you choose. Leveraging simple add-on boards to expand functionality is built into some platforms. Raspberry Pi has hats, Arduino has shields, Beagleboard has capes, Adafruit Feather has wings and Mikro elektronika has clicks. Between these platforms there are thousands of add-on boards that expand functionality like sensors, wireless communication and motor control. If your expansion requirements are mostly sensor type needs, do not require high pin count devices and you would rather not use an add-on board, there are connector ecosystems like SEEED Grove, SparkFun Qwiic and Adafruit STEMMA which allow you to quickly add functionality via JST connectors. COMMUNITY AND SUPPORT Nothing can help shrink your development time like leveraging existing resources and available support. Make sure you see what already exists to help reduce the workload of your design. All boards are going have startup guides, sample projects and code you can leverage, but look beyond that for things like GitHub repositories, video tutorials, forums and third-party support. Check how many members their communities have and how active those members are. Don’t forget to look at alternative support mechanisms like Discord and Twitch, too. PATH TO PRODUCTION If you are a startup or small OEM you may want to make sure that you will be able
to leverage the design effort you put forth when taking your product to production. For example, there are some suppliers that focus mainly on high-volume customers and require NDAs just to have access to device datasheets. For most people in the concept/prototyping phase this may not be an issue since things will probably change significantly when moving to the next stage of their design, however it is still something to keep in mind. COST There are many design environments where cost drives the decision process. However, if you are not going to production and this is being used for either prototyping, evaluation or maker type activities, you will probably save significant time and effort increasing your board budget a little to simplify and reduce the overall time and complexity of your design. So how do you choose and where do you start? Luckily there is a fun way to begin your search. Digi-Key and Make Community have partnered together to create their 2020 Guide to Boards. Not only does it give a great overview of some of the most popular boards that exist, but the guide is accompanied by an app for both Android and iOS that allows you to visualize the platforms in augmented reality (AR). The guide is a great way to look at key features and help you decide which boards will be right for you. To view the guide, please visit: https://www.digikey.com/boardsguide. Digi-Key Electronics https://www.digikey.com 27
PRODUCT NEWS
Silicon Labs Simplifies IoT Development with Simplicity Studio 5 Simplicity Studio 5 Features Multiprotocol Support, Faster Performance, New Interface, Supports Secure Vault Silicon Labs, a leading provider of silicon, software, and solutions for a smarter, more connected world, has delivered a major upgrade to its Integrated Developer Environment (IDE) with the launch of Simplicity Studio 5. The latest version of Simplicity Studio now offers the same access and developer experience across a wide range of wireless protocols, all within a central web-style user interface. Silicon Labs engineered the latest release of this all-in-one software suite to simplify the development of wireless Systemon-Chips (SoCs) and modules, microcontrollers, and other embedded products for IoT devices. Simplicity Studio 5 also provides IoT device developers with the same access, security configuration, and code portability across IoT SoCs and modules, significantly reducing device development time.
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“IoT developers face a wide-range of technical challenges, including optimizing for performance, power, size, multiprotocol coexistence, and security,” said Matt Johnson, senior vice president of IoT at Silicon Labs. “They also face business pressures including timelines, certifications, and code reuse. Simplicity Studio 5 is a free, state-of-the-art development platform that addresses these pain points and makes the creation of smart home, commercial, consumer, and industrial applications faster and easier than ever. It is a unification point for all of Silicon Labs’ wireless technologies, and helps developers easily create sophisticated, flexible, multiprotocol products with OpenThread and Bluetooth Dynamic Multiprotocol technologies without having to know every implementation detail.” Leveraging feedback from customers, employees, and developers, Silicon Labs
reengineered the Simplicity Studio platform to address IoT developer pain points and help users of all experience levels get started with fast resource accessibility and the ability to quickly develop, prototype, and deploy connected devices. Simplicity Studio 5 features a modern user interface, optimized workflows, improved performance, and debug and analysis capability to help developers get wireless solutions to market faster. Simplicity Studio 5 is also designed to intelligently recognize all evaluation and development kits released by Silicon Labs and then make appropriate SDKs, tools, and development resources readily available to the user. Simplicity Studio 5 Highlights • Scalable: one tool and one environment featuring multiple protocols; support for additional protocols will be
Electronica Azi International | 4/2020
PRODUCT NEWS
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continuously added. This includes support for OpenThread, making it simpler to develop IPv6 based mesh applications and paving the way for future development of Project Connected Home over IP-based devices running on Silicon Labs’ EFR32 Wireless Gecko. Responsive User Interface (UI): completely new web-like user interface. Modern Platform: based on latest versions of the C/C++ development tooling and the open source Eclipse platform, enabling use of Eclipse Marketplace plug-ins. Core Improvements: improved performance and industry-standard code editors, compilers, and debuggers. Network Analyzer: simplifies development of mesh network solutions by collating results across the network.
• Project Configuration: new project tools enabled through software component-based SDKs add enhanced levels of software component discoverability, configurability, and dependency management that surpasses competitor tools. • Power Profiler: analyzes full power consumption in a device to optimize design and extend battery life. • Advanced Security: enables state-ofthe-art Secure Vault features to help future-proof IoT devices against escalating threats and regulatory requirements. • Automatic Board Detection: automatically locates device-specific technical documentation and software examples once board is connected. • Value-add Tools: code-correlated energy
profiling, wireless network analysis, and improved debugging to speed time to market of advanced applications. Silicon Labs officially launched Simplicity Studio 5 during its Works With virtual smart home developer conference, the industry’s first gathering of the people, platforms, and protocols driving the growing smart home industry forward. Works With takes place September 9 – 10, 2020, with on-demand replays available to registrants. Registrations is free and available at silabs.workswith.com. Visit the Simplicity Studio 5 Software Center for more information and to download the Windows, Mac or Linux installers. Silicon Labs https://www.silabs.com
Silicon Labs Strengthens Industry’s Leading Bluetooth Portfolio, Delivering Unmatched Performance & Flexibility for IoT Devices Silicon Labs is expanding its portfolio of industry-leading RF performance Bluetooth® Low Energy solutions for IoT developers. The company is uniquely positioned to deliver performance, flexibility and package choice for Bluetooth 5.2, including system-on-chip (SoC), system-in-package (SiP), modules and Network Co-Processor (NCP). Silicon Labs IoT solutions feature best-in-class performance and cutting-edge security, and are optimized for power efficiency, cost, size and turnkey simplicity.
Silicon Labs expanded its Bluetooth Low Energy portfolio today with the launch of the BGM220S. At just 6×6 mm, the BGM220S is one of the world’s smallest Bluetooth SiPs. It provides an ultra-compact, low-cost, long battery life SiP module that adds turnkey Bluetooth connectivity to extremely small products. Also launching is the BGM220P, a slightly larger PCB variant optimized for wireless perhttps://international.electronica-azi.ro
formance along with a better link budget for greater range. BGM220S and BGM220P are among the first Bluetooth modules to support Bluetooth Direction Finding, all while delivering up to tenyear battery life from a single coin cell. According to Bluetooth SIG’s 2020 Bluetooth Market Update, Bluetooth Low Energy continues to be the fastest growing Bluetooth radio with a 26% CAGR. Industry-Leading High Performance with Cutting-Edge Security Silicon Labs offers the industry’s highest-performance, most secure Bluetooth Low Energy SoCs and modules. SoCs are ideal for IoT device makers needing ultimate flexibility in their IoT device development, with highly customizable software and RF design options. SiP modules are ideal for device makers needing the smallest form factor pre-certified Bluetooth Low Energy with little to no RF design or engineering required, while PCB modules offer many of the benefits of SiP modules, but at a lower cost. Silicon Labs’ silicon and module solutions also support multiprotocol connectivity for the most demanding applications including gateways, hubs and smart
lighting. Silicon Labs has been a leader in wireless mesh networking for decades, and the company is infusing its high-performance Bluetooth Low Energy line with a new suite of state-of-the-art security features dubbed Secure Vault. Secure Vault is the most advanced suite of hardware and software security protections available today for IoT devices and makes it easier for device manufacturers to protect their brand, product designs and consumer data. Last week, Silicon Labs’ new EFR32MG21B multiprotocol wireless SoCs with Secure Vault earned Arm PSA Level 2 certification, which is based on a comprehensive assurance framework that helps IoT security standardization and removes security as a barrier to timeto-market. The EFR32MG21B is the first radio to attain the Arm PSA Level 2 Certification. In August, the EFR32xG22 Wireless Gecko Series 2 development kit earned ioXt SmartCert security certification through the ioXt Alliance. As an alliance focused on advancing security in IoT, the ioXt Alliance Certification Program evaluates a device against eight ioXt pledge principles and only devices that meet or exceed the appropriate level of security receive the ioXt SmartCert. Silicon Labs https://www.silabs.com 29
PRODUCT NEWS
Analog Devices Announces Complete Audio System Leveraging A2B® Audio Bus Technology Analog Devices, Inc. (ADI) introduced a full audio system that features the SHARC® Audio Module (SAM) for the creation of digital audio devices, including audio FX processors, multi-channel audio systems,
MIDI synthesizers, and other DSP-based audio systems. SAM includes the dual-SHARC+ core ADSP-SC589 audio processor SoC (with an integrated Arm® Cortex®-A5 core) and leverages Analog Devices’ A2B audio bus technology. In addition to the main SHARC audio module board, ADI offers daughter boards to provide added functionality to the main board and expand the audio system. The Audio Project Fin board
mates directly to the main board, providing MIDI input/output as well as pushbuttons and potentiometers to modify audio effects. The A2B Amplifier Module features two high-efficiency Class-D amplifiers to output digital audio data received over the twisted-wire pair A2B bus from PDM microphones and/or serial TDM sources on the main board (or another connected A2B node).
ADZS-SC589-MINI Key Features • ADSP-SC589 floating-point SHARC processor • AD2428 low-latency A2B audio bus transceiver • Includes free CrossCore® Embedded Studio license and ICE-1000 emulator for debugging ($1145.00 value)
This complete audio system delivers high-fidelity multichannel digital audio with low and deterministic latency to a fully synchronized distributed audio system. The system is ideal for fast prototyping, evaluation projects, demonstrations, and educational applications. It enables users to realize a shorter time to market with a “ready to go” prototype system that provides a comprehensive hardware and software solution.
ADZS-AUDIOA2BAMP Key Features • Two SSM3582 high-efficiency 4-in 4-out Class-D amplifiers • AD2428 low-latency A2B audio bus transceiver • Can be cascaded via A2B to provide 8 amplified output channels to support 7.1 and other speaker configurations
ADZS-AUDIOPROJECT Key Features • MIDI 5-pin DIN IN/OUT/THROUGH • Four programmable, externally routable pushbuttons • Three POTs connected to housekeeping ADC of the SHARC Audio Module
Analog Devices https://www.analog.com
SEGGER J-Link adds support for Raspberry Pi as host SEGGER has just introduced a version of its J-Link software specifically for Linux Arm. Aimed at industrial automation and other applications utilizing Raspberry Pi and other single board computing platforms, this new package contains all command-line versions of the software. It supports the same target devices and the full feature set encompassed in the already-established Windows, macOS and Linux x86 versions. These features include high-speed download into Flash memory and an unlimited number of breakpoints (even in Flash memory), as well as a J-Link GDB server which makes it compatible with all popular development environments. The software is available for both 32bit and 64-bit Arm Linux, taking full advantage of the 64-bit CPU and all memory available in the system. It works on Raspberry Pi, as well as the various compatibles that are now on the market. The JLink SDK also fully supports the writing of custom programs for J-Link on Arm Linux. 30
debug probe and J-Link software, to create projects, build them and run debug sessions. Amazing!" says Liviu Ionescu, Developer of the OpenSource Eclipse Embedded CDT project. "Raspberry Pi is gaining more and more popularity as a small, inexpensive yet powerful multi-purpose computing solution. While the typical use is automated test systems, with the Raspberry Pi acting as a J-Link bridge or server in the LAN/WLAN, there are many other applications. With Eclipse Embedded CDT coming, it is possible to use Raspberry Pi and J-Link as hardware to develop, download and debug firmware for embedded devices." says Rolf Segger, founder of SEGGER. "Although it seems very unusual, even unlikely, it is now possible to use a small Raspberry Pi 4 single board computer with the Eclipse for Embedded C/C++ Developers package and the additional xPack binary tools, plus SEGGER's J-Link
Raspberry Pi https://www.raspberrypi.org SEGGER https://www.segger.com Electronica Azi International | 4/2020
PRODUCT NEWS
Mouser Electronics and iWave Systems Announce Global Agreement Mouser Electronics, Inc. announces a global distribution agreement with iWave Systems, enhancing the global reach of iWave’s extensive portfolio of system-onmodules (SoMs). Through the agreement, Mouser now stocks iWave’s SoMs based on Xilinx, NXP Semiconductors, and Intel® PSG technologies for industrial, automotive, medical, imaging, networking, and artificial intelligence (AI) applications. iWave’s Xilinx ZU19/17/11 Zynq UltraScale+ MPSoC SoMs incorporate Xilinx Zynq Ultra Scale+ multiprocessor SoCs (MPSoCs), which features an innovative combination of FPGA fabric and six heterogeneous Arm® processor cores (four 64-bit Arm Cortex®-A53 and two 32-bit Arm Cortex-R5 cores). Featuring enhanced processing system and processing logic functionality, the SoMs also offer improved security and robustness and exceptional memory and transceiver performances for use in high-end applications such as 4K video, deep neural AI and machine learning, automotive imaging radar, and highspeed networking. Mouser also stocks the Xilinx ZU19/17/11 Zynq UltraScale+ MPSoC development kit, which includes the Zynq Ultrascale+ MPSoC SoM and an
ultra-high-performance carrier card with support for FMC, FMC+, QSFP, HDMI 2.0 input and output, 12G SDI input and output, USB Type-C, Gigabit Ethernet, and more.
iWave’s i.MX 8QuadMax SMARC SoMs, based on NXP i.MX 8QuadMax applications processors, are designed to achieve high-performance multimedia processing in demanding automotive, medical and industrial applications. Providing a complete solution on a highly integrated SMARC R2.0-compatible module, the SoMs incorporate the i.MX 8QuadMax’s four Arm Cortex-A53 cores, two Cortex-M4F cores, and two Cortex-A72 cores, as well as a HiFi 4 DSP core and two graphics processing units (GPUs). The SoM is capable of implementing rich, fully independent graphics
content across four HD screens or one 4K screen. The i.MX 8QM/QP SMARC development kit includes the SoM and a SMARC carrier board with all the necessary connectors, displays, and inputs and outputs (I/Os). iWave’s Intel Arria® 10 SoC SoMs are based on the Intel Arria 10 SX family FPGAs with dual Arm Cortex-A9 cores and up to 660K logic elements. The module includes 32-bit DDR4 memory support for HPS with ECC and 64-bit DDR4 support for FPGA. The Intel Arria 10 SoC SoM and associated development platform enable engineers to create FPGAbased designs in applications such as test and measurement, industrial controls, diagnostic medical imaging, and wireless infrastructure. iWave, through its extensive portfolio of SoMs, strives to reduce time-to-market and simplify the product development process for organisations and industries across the globe. To learn more, visit https://eu.mouser.com/manufacturer/iw ave-systems/. Mouser Electronics https://www.mouser.com iWave Systems https://www.iwavesystems.com
Power-efficient Bluetooth modules from u-blox prove instrumental in COVID-19 track and trace wearable devices u-blox has confirmed that its Bluetooth® 5 modules are being built into wearable devices that are helping to combat the global COVID-19 pandemic. Available as either a wristband or a pendant, the TDS 50 has been developed by Electronic Precepts to present a highly-effective track and trace solution, with data being
directly stored on the device then periodically sent to a web server. In addition, through the social distancing function that is also featured, wearers are given https://international.electronica-azi.ro
visual and vibrational alerts if another TDS-50 wearer comes within a 2 meter distance of them for over 45 seconds. The device can be used anywhere, from schools to businesses or airport settings. The TDS-50 units needed a compact form factor to make them comfortable for the user to wear. They also had to support ultra-low power operation, with the ability to deliver passive scanning (for social distancing purposes) over a period of up to 240 hours. Consequently, the wireless communication module specified had to meet both of these key criteria fully. Given the immediacy of the COVID crisis, it was crucial as well that the solution could be brought to market very rapidly with the constituent RF electronics being quick and simple to incorporate into the
design and having all the necessary standards approvals in place. The u-blox ANNA-B112 proved itself to have all the attributes needed. With dimensions of just 6.5mm × 6.5mm × 1.2mm, this space-saving, highly-integrated and pre-approved system-in-package (SiP) is optimized for situations where a swift turnaround is mandated. It is based on Nordic’s nRF52832 chip-level Bluetooth technology, with a 64MHz Arm® Cortex®M4 processing resource plus 512kB of embedded flash memory. Supporting 1.4Mbit/s data rates, it is highly suited to wearables applications and does not impact heavily on battery reserves. u blox https://www.u-blox.com 31
PRODUCT NEWS
Mouser’s New Customer Resource Centre Provides Easy-to-Use Hub for Services & Tools Mouser Electronics, Inc. announces its new Customer Resource Centre, which allows customers to easily take advantage of Mouser’s online purchasing services and tools through a central hub containing everything customers need to optimise the purchasing process. Customers can simply click the name of the desired tool, and then view or
request what they need. To start using the new Customer Resource Centre, go to https://eu.mouser.com/customerresource-center/ From the new Customer Resource Centre, customers can access and learn how to view or track orders, request technical support and data sheets, or place orders via API or EDI through Order
Automation. The easy-to-use hub helps Mouser customers quickly get more information for parts and any other assistance they require for purchasing. “Mouser continually assesses and improves our online resources to help buyers and engineers manage their product specifications and purchases,” said Coby Kleinjan, Mouser’s VP of Americas Customer Service and Sales. “We are very excited to add this new Customer Resource Centre to our website to help customers streamline the buying process as we continue to make it our mission to provide best-in-class service around the world.” The Customer Resource Centre houses a full suite of productivity tools from Mouser, including the FORTE intelligent BOM tool and Price and Availability Assistant, as well as information on creating a My Mouser account for even easier online ordering. Mouser Electronics https://www.mouser.com
Silicon Labs Advances IoT Device Security to Thwart Evolving Threats Silicon Labs announced that its cuttingedge hardware and software technologies dedicated to securing Internet of Things (IoT) devices against growing and evolving threats have earned third-party IoT security certifications from both PSA Certified and the ioXt Alliance. Secure Vault, available September 9 in Silicon Labs’ new EFR32MG21B multiprotocol wireless SoCs, achieved PSA
Certified Level 2 certification, which is based on a comprehensive assurance framework co-founded by Arm that helps IoT security standardization and removes security as a barrier to time-to-market. The EFR32MG21B is the first radio to attain the PSA Certified Level 2 accreditation. Silicon Labs’ xG22 Thunderboard and EFR32MG21B development kits also achieved SmartCert security certification
status from the ioXt Alliance, recognized as a global standard for IoT security. Because the ioXt Alliance allows for certification inheritance, these Silicon Labs ioXt certifications can be leveraged by any device manufacturer using Silicon Labs’ xG22 and xG21B to greatly reduce their own device level ioXt certification time and effort. Silicon Labs’ Secure Vault is a new suite of state-of-the-art security features designed to help connected device manufacturers address escalating IoT security threats and regulatory pressures. Silicon Labs' Wireless Gecko Series 2 platform takes advantage of Secure Vault technologies by combining best-in-class security features such as secure boot based on hardware root of trust, secure debug, physical tamper, secure identity for attestation, and physically unclonable function (PUF) key management technology to greatly reduce the risk of IoT security breaches and compromised intellectual property. Silicon Labs https://www.silabs.com
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PRODUCT NEWS
Renesas Expands Wireless Power Portfolio with 15W Wireless Power P9415-R Receiver Featuring WattShare TRx Mode Renesas Electronics Corporation introduced the P9415-R wireless power receiver with Renesas’ exclusive WattShare™ technology as the newest member of its wireless power solutions portfolio. The new 15W wireless power receiver enables smartphones, power banks, and portable industrial and medical equipment, to wirelessly charge other mobile devices
and accessories that also have wireless charging capabilities. The P9415-R features up to 5W of transmit power capability in transmitter/receiver (TRx) mode, as well as receive up to 15W on Qi transmitters, enabling quick and convenient mobile device charging on the go. “2020 will be the year wireless charging moves into the mainstream, expanding from premium smartphones to include mid-
range devices, and gaining broader adoption into consumer and industrial devices beyond the smartphone market,” said Andrew Cowell, Vice President, Mobility, Infrastructure & IoT Power Business Division at Renesas. “With the P9415-R, we are excited to bring our state-of-the-art WattShare technology to a wider audience, offering customers broader access to
robust, scalable and flexible solutions that enable quick, convenient, and cost-effective wireless charging for portable devices.” Based on Renesas’ proprietary WattShare technology, the P9415-R combines receiver and transmitter capabilities, allowing smartphones, smartwatches, truly wireless ear buds and other devices to be wirelessly charged simply by placing them on top of a smartphone or other industrial
and medical portable devices. In WattShare TRx mode, the P9415-R enables these mobile devices to change the power flow direction and deliver up to 5W of power to charge other devices. Customers can use the same wireless power coil and same P9415 circuitry to both receive and transmit power wirelessly. Key Features of P9415-R Wireless Power Receiver • MTP non-volatile memory for easy firmware and device function updates • GUI support offering greater flexibility for user customization • Receives up to 30W in proprietary mode • UVLO as low as 2.7V for increased available charging area and fast connections • Improved IOUT sensing accuracy for improved foreign object detection capabilities • Supports an easier path to QI certification and speeds time to market • Bi-directional communications to support proprietary authentication with encryption • X-Y alignment circuitry for better receiver/transmitter device alignment • WPC 1.3 ready – Renesas’ first WPC 1.3-ready wireless power receiver Renesas Electronics Corporation https://www.renesas.com
CUI Devices Adds IP67 Rated Models to Enclosed Speaker Line CUI Devices’ Audio Group announced the addition of waterproof enclosed speakers to its CES product family. Carrying IP67 ratings, these enclosed
onance frequencies from 680 to 1700 Hz. Thanks to their enclosed speaker design and IP67 ratings, the CES series offer engineers a turnkey solution fully opti-
speakers feature sound pressure levels (SPLs) from 89 to 106 dB at 10 cm and res-
mized for superior sound quality and simplified design integration in applica-
https://international.electronica-azi.ro
tions that may be subject to moisture and environmental contaminants. Available in rectangular, round, or square frame shapes with multiple cone types, the waterproof enclosed speakers further feature nominal inputs of 1, 1.5, or 2 W and impedance ratings of 4 or 8 ohms. All models carry wire lead terminations with a connector and are housed in ABS enclosures. Select speakers also offer panel mount flanges for easier installation and secure mounting. The IP67 rated CES series are available immediately with prices starting at $3.08 per unit at 100 pieces through distribution. Please contact CUI Devices for OEM pricing. CUI Devices https://www.cuidevices.com 33
PRODUCT NEWS
Mouser Offers Latest Products and Resources for Home and Building Automation
Mouser Spotlight: Home and Building Automation Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is expanding its comprehensive range of building automation solutions from Silicon Labs, TE Connectivity (TE), and Littelfuse for the rapidly growing smart home and building automation sector. To support this, Mouser has also just unveiled a brand new smart home resource site working in conjunction with Silicon Labs and TE. This will provide customers with information on wireless SoCs, sensors and connectivity solutions, in order to implement highly effective and feature-rich automation systems within the home. Additionally, Mouser sponsored the Silicon Labs Works With Conference. Taking place virtually on September 9–10 2020, the conference featured more than 25 educational sessions exploring techniques for the development of smart home products using wireless protocols such as Bluetooth®, Zigbee, Thread, and more. Home and building automation product highlights available from Mouser include 34
the following: • Supporting Bluetooth 5.2 connectivity, the EFR32MG22 SoC family from Silicon Labs is highly optimised for building automation and IoT networking applications. Each of these units has a built-in 2.4 GHz radio with a -106.4 dBm receive sensitivity, plus a 32-bit Arm® Cortex®-M33 processing core and up to 512 kB of flash memory. • Combining Bluetooth 5 and cellular communication capabilities (both LTEM and NB-IoT), Laird Connectivity’s Pinnacle 100 modem can be employed in a wide variety of smart home- and IoT-related use cases. This module features an Arm Cortex-M4F core, along with wireless chips from Nordic and Altair. Its Bluetooth receiver supports -91dBm sensitivity levels at data rates of 1 Mbps. • Enabling accurate ongoing monitoring of the surrounding environment, TE’s MS8607-02BA01 incorporates pressure, humidity and temperature (PHT) sensing
elements. This factory-calibrated combination sensor has a wide dynamic range for each of these parameters covering 10 to 2,000 mbar for pressure, -40 to 85 °C for temperature and 0 to 100% relative humidity (RH). Supplied in a compact 5 × 3 × 1 mm QFN package, this low-power device runs off a 1.5 to 3.6 V input. • Mouser is also now offering a comprehensive range of building automation solutions from Littelfuse for designing building access, thermostats and smart metering, which allow high security, energy efficiency and safer gas and water metering. Last month, Mouser launched more than 383 new products ready for same-day shipment. To see more new innovative products, visit https://info.mouser.com/ new_Products/. Mouser Electronics https://www.mouser.com Electronica Azi International | 4/2020
PRODUCT NEWS
Digi-Key Electronics Announces Global Distribution Partnership with Septentrio Digi-Key Electronics, a global electronic components distributor, announced today that it has partnered with Septentrio, a leader in high-precision GNSS positioning solutions. Digi-Key now offers mosaic-X5™ globally for customers who need secure and reliable high-accuracy positioning in a compact and low-power form factor.
Septentrio mosiac-X5™, a high-end GNSS receiver module delivering reliable centimeter-level positioning, is now available on the Digi-Key website Septentrio's mosaic-X5 features complete multi-frequency multi-constella-
tion technology and tracks every existing and future signal from all Global Navigation Satellite System (GNSS) constellations. Such signal diversity coupled with advanced anti-jamming technology allows mosaic-X5 to deliver centimeterlevel positioning with maximum availability even in challenging industrial environments. This makes mosaic-X5 an ideal positioning solution for applications such as robotics, automation, telematics and many more. "Our mosaic-X5 is an advanced GNSS receiver module without performance compromises. With its small form factor and low-power design, mosaic-X5 brings high-performance positioning to volume applications," said Francois Freulon, head of product management for Septentrio. "Having Digi-Key as a distributor enables us
to scale and reach out to find new markets and applications where secure high accuracy positioning is required." "Digi-Key is excited about the new partnership with Septentrio," said David Stein, vice president of global supplier management for Digi-Key. "Demand for high-accuracy GNSS receivers with secure and robust positioning is growing strongly, as they continue to be implemented into new applications and devices. Digi-Key offers customers an easy path to order, develop, and deploy with the latest technologies available, including Septentrio's robust and precise GNSS devices, which have the latest anti-jamming and anti-spoofing technology." For more information about Septentrio and to order the mosaic development kit or the mosaic-X5 module, please visit the Digi-Key website. Septentrio https://www.septentrio.com/en Digi-Key Electronics https://www.digikey.com
Digital high power factor XDP™ controller for cost-effective flyback LED drivers Infineon Technologies AG introduces the XDP™ digital power XDPL8219. The highperformance flyback controller features secondary-side regulation for high-performance and robust LED designs. It provides high power factor and constant voltage output. The device operates in quasi-resonant mode (QRM) to maximize the efficiency and minimize the electromagnetic interference (EMI) over a wide
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load range. It accommodates active burst mode (ABM) at light load to prevent audible noise while achieving a no-load standby power level below 100 mW. The XDPL8219 detects the input voltage type (AC or constant DC) and adjusts its proprietary voltage-mode pulse modulator accordingly for enhanced system performance. For AC input, it alters the pulse modulation for achieving a high power factor (>0.9) as well as low total harmonic distortion (<10%) over a wide input and load range. For a constant DC input, adapting pulse modulation results in an adjusted switching frequency hence reducing EMI over the entire operating range. The device provides maximum design flexibility and performance
optimization through parameter configuration via a universal asynchronous receiver transmitter (UART) pin. Furthermore, the XDPL8219 optionally transmits UART signals to inform about input voltage, line frequency, controller temperature, last error code, and input voltage loss indication amongst others. Infineon provides programming tools, which include a userfriendly graphic user interface to configure the controller. This increased flexibility together with reduced bill-of-materials shortens time-to-market. Availability The XDPL8219 is housed in a DSO-8 package with a built-in 600 V HV start-up cell and a proprietary start-up sequence. This ensures a fast output voltage rise with minimal overshoot. The XDPL8219 can be ordered now. More information is available at www.infineon.com/xdpl8219. Infineon Technologies https://www.infineon.com 35
PRODUCT NEWS
Renesas Rolls Out 48V Mobility Winning Combination Solution Featuring New 16-Cell Battery Front End and 32-bit MCU with Built-in FPU for Complex Inverter Control Algorithms
Modular Reference Design Lets Customers Select Different Functional Blocks for Range of Applications, Reduces Time to Market, Saves on BOM and Resources Renesas Electronics Corporation introduced a 48V Mobility Winning Combination Solution that helps customers accelerate the development of escooters, e-bikes, UPS and energy storage systems. This reference design uses a modular approach in both hardware and software to showcase core and optional functional blocks that can be adopted for many 24V-48V applications such as lawn mowers, electric carts, robot cleaners, power tools, power banks, and more. It also uses 15 Renesas ICs, including three key devices: the ISL94216 16-cell battery front end (BFE), robust HIP2211 100V MOSFET drivers, and RX23T 32-bit microcontroller (MCU) for motor control. The 48V mobility winning combination solu36
tion is powered from a 25 AHr Li-ion battery that drives a 1600W inverter to attain speeds up to 5000 rpm. “Micromobility options like e-scooters and e-bikes offer an attractive, low-carbon footprint vehicle for first-mile and last-mile travel. Rising demand for these applications is driving new battery management capabilities as cell balancing plays an increasingly critical role in recharging,” said DK Singh, Director, Systems and Solutions Team at Renesas. “Our new 48V mobility winning combination solution combines Renesas’ advanced BFE, industry-leading MCUs, along with analog and power devices, and innovative motor control technology to help customers speed up
the development of their high power and torque e-scooters and e-bikes.” The 48V mobility winning combination solution includes two boards that address the higher battery cell count and power levels mobility applications require. The BFE and charger board focuses on larger, higher voltage battery packs. The motor control and inverter board features synchronized current/ voltage measurements and drivers that are pulse width modulated (PWM) to actuate the motor, and monitor motor status. The algorithm with the hardware is ideal for driving brushless DC (BLDC) motors. Also, two optional boards are available: Electronica Azi International | 4/2020
PRODUCT NEWS
the wireless charging receiver board, and the Bluetooth® Low Energy (BLE 5.0) control board. For system control, the winning combination solution uses a cost optimized, energy-efficient RX23T MCU with built-in floating point unit (FPU) and six high-performance timers specifically tooled for complex inverter control algorithms. These specific features and modular design helps engineers greatly reduce the man-hours in software/hardware development and debug. In addition, unlike other large cell count single-chip battery managers, the highly integrated ISL94216 offers several features that balance and monitor system conditions to improve battery life and safety, independent of the MCU. The winning combination solution also uses the ISL81601 60V bidirectional 4-switch synchronous buck-boost controller for ultra-fast charging. The controller’s CC/CV charger profile is implemented through the system MCU. KEY FEATURES OF THE 48V MOBILITY WINNING COMBINATION SOLUTION BFE and charger board • ISL94216 16-cell BFE supports up to 200 mA+ external cell balancing – key to enabling fast recharging and high utilization in large battery packs with hot plug tolerance up to 62V
• BFE provides full high-side, battery protection and monitoring for 4S to 16S cell battery packs • Renesas’ RX23T 32-bit MCU with built-in FPU supports full control of entire system • Renesas ISL28214 op amps deliver low power consumption and input bias, and the ISL81601 maximizes charging efficiency and uses current sensing and I/O monitoring to adjust input levels • Renesas’ ISL84051 multiplexer handles up to eight inputs with low RDSon connectivity and nanosecond switch times
charger board. This MCU is specifically chosen from the same RX Family to enable monotonic software design • Wireless charging receiver board features two Renesas wireless receivers used in parallel to boost output as needed; connects to the BFE and charger board • Mobile phone application unlocks scooter, controls ON/OFF power and motor start • Mobility solution sends diagnostic and parametric data to mobile phone’s secure BLE channel in 1-second intervals
Motor control and inverter board • The motor control and inverter board supports a 48V battery pack and can reach up 5000 RPM using a 1600-watt inverter powertrain with motor control sensors • Motor control and inverter board includes a DC/DC converter, ISL28191 op-amp current sensors, ISL80410 LDO regulator, HIP2211 100V half-bridge MOSFET drivers, and MOSFET bank; connects to the BFE and charger board
PRICING AND AVAILABILITY For more information on the Renesas 48V mobility winning combination solution, including system block diagram, bill of materials (BOM), and data sheets, please visit: www.renesas.com/solutions/industrial-automation/motion-and-drives/48vmobility-solution.
Optional boards and mobile phone application • BLE control board with RX23W MCU enables secure mobile phone connectivity via BLE for throttle control, battery status, GPS connection, and saved route history; connects to the BFE and
The new ISL94216 16-cell BFE is available now in a 64-lead QFN package from Renesas’ worldwide distributors, and is priced at $2.99 USD in 1,000-unit quantities. For more information and evaluation board, please visit: www.renesas.com/ products/ISL94216. Renesas Electronics Corporation https://www.renesas.com
Portwell’s latest high-performance Nano-ITX Embedded Board Solution Portwell (www.portwell.eu) a world-leading innovator for Industrial PC (IPC) and embedded computing solutions, and an associate member of the Intel® Internet of Things (IoT) Solutions Alliance, has launched its new NANO-6051, a NANOITX form factor embedded board featuring Intel 8th Gen Core i7/i5/i3 processors up to 4 cores/8 threads with a low 15W thermal design power (TDP), formerly codenamed Whiskey Lake. The proces-
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sors integrate Intel Gen 9.5 graphic engine with 24 execution units that delivers enhanced media conversion, fast frame rates and 4K Ultra HD (UHD) video, and provides significant 3D multimedia performance. According to Brian Lai, Portwell’s product manager, NANO-6051 provides an optimized balance of high performance, accelerated graphic processing, lower power consumption and energy efficient capability. Portwell’s new NANO-6051 features DDR4 2400MHz non-ECC SO-DIMM up to 32GB and storage interface 1x M.2 Key M 2280 socket for SSD. For functionality extension, it provides 2x USB 3.2 Gen 2 (10Gb/s) on rear I/O and 4x USB 3.2 Gen 1 (5Gb/s) on board
header to ensure fast data transmission with low-power consumption. 1x M.2 Key E 2230 socket for wireless module connectivity including Wi-Fi and Bluetooth which can make it an ideal solution for communication and IoT applications. Intel I210AT and Intel I219LM Ethernet Controllers provide dual Gigabit Ethernet LAN access via the two RJ-45 connectors. 1x RS-232/422/485 is selectable by BIOS adjustment. The Intel Gen 9.5 graphic engine supports dual mini DisplayPort (DP) on rear I/O with resolution up to 4096x2304. It provides a selection of multiple connections such as displays, graphic cards, cameras, storage and more on the same system. Portwell https://www.portwell.eu 37
PRODUCT NEWS
Mouser Electronics Names Its 2020 Best-in-Class Award Winners Mouser Electronics congratulates the 2020 winners of its annual Mouser Best-in-Class Awards. “We are excited to recognize these extraordinary individuals. Each year, we select our Best-in-Class Award winners from hundreds of business colleagues,” said Jeff
Newell, Mouser Electronics’ Senior Vice President of Products. “We want to thank all of these dedicated professionals. You have played a key role in helping us serve our customers with both your newest products, as well as the largest breadth of product in your channel. Thank you and congratulations!” Winners of the Mouser Best-in-Class Award are selected using five main criteria: Strategically partnering with the Mouser team; promoting product lines and work-
ing together on new product launches; finding creative solutions to grow market share mutually for both companies; maximizing Mouser’s unique value proposition within their own businesses; and championing Mouser within their organizations.
2020 Mouser Best-in-Class Award Winners: Tim Fredricks − Advantech Annette Tyler − Amphenol Sumit Awasthi − Analog Devices Mary Benetti-Condon − Bel Fuse Inc. Diane Laegeler − Digi Hailey Kamen − Henkel Markus Rick − Infineon Technologies Ivy Spidale − Littelfuse Fred Bell − Molex Todd Oelerich − Nichicon
Bob Johnson − NXP Semiconductors Tammy Stine − TE Connectivity Joe Haukos − Würth Elektronik This year, Mouser also recognized the individual who has achieved the President's Award honors. The President’s Award honors the exemplary individuals from Mouser’s supplier partners who have won the Best-in-Class Award five or more times, demonstrating consistent top performance. This year’s Wall of Fame and President’s Award Winner is Sumit Awasthi of Analog Devices. “As one of the highest and rarest recognitions that Mouser gives to colleagues at our suppliers, the President’s Award represents our profound respect and appreciation for exceptional teamwork,” said Glenn Smith, President and CEO of Mouser Electronics. “Sumit’s stewardship of the Analog Devices –Mouser relationship has been essential to our mutual success, and all of Mouser joins me in congratulating him on this welldeserved President’s Award.” https://eu.mouser.com/bestinclass. Mouser Electronics https://www.mouser.com
Selecting capacitors from a cross-technology perspective REDEXPERT, the online platform for the simulation and selection of electronic components on the basis of real measurements, now has a considerably expanded presence. Würth Elektronik has heeded its customers’ suggestions from the practical area and has installed a feature that enables the direct comparison of aluminum-electrolyte and aluminum-polymer capacitors. The calculation of the rip-
ple current has also been improved. The RedExpert online platform has now been modified to combine aluminumelectrolytic and aluminum-polymer capacitors in one single module, thus enabling users to directly compare the stored data of the different technologies. Polymer capacitors, for example, have the advantage of a higher temperature tolerance, but also the drawback of a
greater leakage current and a limited voltage range. The compromises that have to be borne in mind when selecting components can now be very transparently weighed up against each other on the RedExpert platform. The display of the ripple current has also been improved. The new diagrams and slider bars enable users to set the power point (frequency and temperature) easily, immediately showing the new maximum ripple current. Due to the differing specifications, the multipliers of aluminum-electrolytic capacitors in most cases result in an increase in the ripple current, while those of polymer capacitors reduce the ripple current. RedExpert now gives developers the opportunity to draw comparisons between the two types of capacitors that would otherwise have to be calculated in a laborious and time-consuming way, based on the respective data-sheet specifications. Würth Elektronik eiSos Group https://www.we-online.com
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PRODUCT NEWS
Mouser, Microchip, Crowd Supply Present 2020 Get Launched Design Program Designers have just under four months left to enter the 2020 Get Launched program from Microchip Technology and Crowd Supply, sponsored by Mouser Electronics. Get Launched is a start-up and incubator support program that helps companies achieve rapid time-toproduction and time-to-market by utilising Microchip’s technical expertise to advise throughout the design process.
The global electronics design program invites designers to submit projects that uniquely feature one or more components from Microchip. The program is a partnership between Mouser, Microchip, and Crowd Supply, and entries will be promoted across all three channels. Designers can enter the 2020 Get Launched program by submitting their
project proposals through the form on the Crowd Supply website. Eligibility is determined on a case-by-case basis by the organisers, and entrants can complete their 30-day Crowd Supply campaign anytime during 2020. All successful entries will receive a support package containing reduced-price parts for the initial production run, technical and marketing review consultations, and a reduced
Crowd Supply campaign fee, as well as one of several Microchip development boards, including the following: • The Microchip Curiosity PIC32MZ EF development board is designed to evaluate the high-performance PIC32MZ EF microcontroller, which offers 2 Mbytes of flash, 512 Kbytes of RAM, an integrated
FPU, crypto accelerator, and excellent connectivity options. The 32-bit Curiosity development platform incorporates a programmer/debugger, two mikroBUS™ click sockets, and an on-board Wi-Fi-N module, and is fully integrated with Microchip’s MPLAB® X IDE. • The Microchip AVR-IoT WA development board combines a powerful ATmega4808 8-bit AVR microcontroller, a Crypto Authentication™ secure element, and a fully certified Wi-Fi network controller to offer a simple and effective way to connect embedded applications to the Amazon Web Services (AWS) Cloud platform. • The Microchip PIC-IoT WA development board features a PIC24FJ128GA705 16-Bit XLP microcontroller, Wi-Fi module, and CryptoAuthentication secure element IC, and comes preloaded with firmware that enables engineers to quickly connect and send data to the AWS platform using the on-board temperature and light sensors. To learn more and to enter the 2020 “Get Launched” design program, visit https://www.crowdsupply.com/microchip /get-launched. Mouser Electronics https://www.mouser.com
New product releases and services The new “Electronic Components 2020” catalogue is now available, and can be ordered from Würth Elektronik in the print version or downloaded as a PDF. The 184-page catalogue presents new products and services in the area of passive components, optoelectronics, and power modules. Separate special catalogues are available for many other product categories of Würth Elektronik. All products in the new catalogue are available ex stock. Würth Elektronik is glad to supply free-ofcharge samples to support developers in their projects: in connection with the design kits, which can be refilled at no extra charge, they can also be supplied to development labs over their entire product life. Among the many highlights of the new “Electronic Components 2020” catalogue https://international.electronica-azi.ro
are the new high-current flat-wire inductors (WE-HCM), multilayer ceramic inductors (WE-MK), and current sense transformers of the WE-CST EE4.4 series. Thanks to an innovative manufacturing process, these transformers are smaller and better insulated than comparable products available on the market. In the optoelectronics field, the WL-OCPT optocoupler phototransistors and the extensions of the LED range by white LEDs with five different color temperatures deserve particular attention. The new additions to the range of the MagI3CFDSM family of particularly efficient power modules will surely also whet the appetites of developers and suppliers. Würth Elektronik eiSos Group https://www.we-online.com 39
PRODUCT NEWS
Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applications Renesas Electronics Corporation announced a new high-speed, low-power DDR5 data buffer for data center, server, and highperformance workstation applications. Advancements over the past few years in real-time analytics, machine learning, HPC, AI, and other memory and band-
(LRDIMMs) that have become the cornerstone memory technology for this new class of applications. The first generation of DDR5 LRDIMMs based on Renesas components enable a bandwidth increase of more than 35 percent over DDR4 LRDIMMs operating at 3200 MT/s.
width-hungry applications have fueled explosive growth in server memory bandwidth requirements. The new JEDEC-compliant DDR5 data buffer 5DB0148 from Renesas enables significantly higher speeds and lower latency for loadreduced dual inline memory modules
The Renesas DDR5 Data Buffer maximizes channel eye opening for systems that are heavily loaded through a combination of capacitive load reduction, data alignment, and signal recovery techniques. This allows server motherboards with a large number of memory channels and slots and com-
plex routing topologies to run at maximum speed, even when fully populated with high-density memory. Additionally, improvements in the DDR5 modules definition allow for lower power supply voltages (1.1V vs 1.2V in DDR4), on-DIMM voltage regulation, and implementation of advanced control plane architectures with the use of the SPD Hub and modern control bus communications such as I3C. Renesas is the longest running supplier of memory interface products in the industry with a history of developing complete chipset solutions since the inception of dual inline memory modules. As part of a complete family of solutions, the new Renesas DDR5 data buffer 5DB0148 is optimized to work seamlessly with the other DDR5 Renesas components on an LRDIMM memory module, including the power management IC P8900, the registered clock driver 5RCD0148, the SPD Hub SPD5118, and the temperature sensor TS5111. Memory vendors deploying Renesas chipset solutions are assured of full interoperability and robust quality. Renesas Electronics Corporation https://www.renesas.com
Microchip Introduces Its Highest-Density EEPROM with 4 Mbit Serial EEPROM Debut Portable consumer and medical devices including fitness trackers, hearing aids and glucose monitors as well as industrial, automotive and other systems often use customer-specific data sets to optimize the consumer experience. These nonvolatile data sets – including calibration constants, background conditions, user preferences and changing noise environments – often are adjusted by the end system or user a few bytes at a time. Serial Electrically Erasable Programmable Read-Only Memory (EEPROM) is the memory of choice for these applications providing nonvolatility, bytelevel control, ease-of-use and low-power consumption. Microchip Technology Inc. announced its new, highest-density EEPROM – the 25CSM04. At 4 Mbit, Microchip’s new EEPROM becomes the largest EEPROM 40
available to developers, doubling the 2 Mbit density designers previously were limited to. Until now developers have used
lower-cost NOR Flash integrated circuits (ICs) for any 2 Mbit+ nonvolatile data set application. Because EEPROM offers performance advantages over NOR Flash, Microchip has responded to customer
requests by introducing a larger 4 Mbit EEPROM. EEPROM advantages include a lower standby current (2 μA vs. 15 μA); the ability to perform single-byte, multi-byte, and full-page writes; shorter sector erase/rewrite times (5ms vs.300ms); and more erase/ rewrite cycles (1M vs 100K). The 25CSM04 becomes part of Microchip’s extensive nonvolatile memory product portfolio that integrates within Microchip’s total system solutions built around its 8-bit, 16bit, and 32-bit MCUs and MPUs. Microchip’s extensive memory product family includes serial EEPROMs, NOR Flash, SRAM, and EERAM in all standard serial buses and all standard densities from 128-bit to 64 Mbit. Microchip Technology https://www.microchip.com Electronica Azi International | 4/2020
PRODUCT NEWS
SMART Modular’s DDR4 NVDIMMs Reach New Speed Threshold SMART Modular Technologies, a subsidiary of SMART Global Holdings, Inc., a global leader in memory modules, solidstate storage products and hybrid solutions, today announces new higher density 16GB and 32GB NVDIMMs which run at DDR4-3200 high speed bus rates. These products, incorporating Micron® advanced DDR4 DRAM technology in combination with SMART’s high-speed PCB designs, significantly improve signal integrity, resulting in broader design margins even at the highest DDR4 bus speeds. NVDIMMs have seen wide adoption in applications requiring “normal” memory operation at DRAM bus clock rates. SMART’s new NVDIMMs also use Micron advanced 3D NAND technology which provides highly reliable memory persistence in the event of a system crash or power outage, with minimal back-up and restore times. “We are pleased that SMART is employing Micron’s DRAM and 3D NAND technologies in its newest leading-edge NVDIMM products to offer maximum reliability and performance,” stated Malcolm Humphrey, vice president of marketing of the Compute & Networking Business Unit at
Micron. “Enterprises that need resilient memory and storage to ensure constant availability of mission-critical information will benefit from SMART’s NVDIMMs.” The NVDIMMs operate as standard DDR4 RDIMMs with unlimited write endurance, combined with integrated persistence capability. This creates highly efficient
power modules (BPM) in various form factors which provide temporary power during back-up operations. SMART provides comprehensive firmware and technical support directly to its customers for NVDIMM and BPM products underscoring its commitment to providing long-term NVDIMM support. SMART
write acceleration in flash storage appliances and high-speed recovery capability in cloud data centers. SMART NVDIMMs offer the full feature set currently defined by JEDEC standards. Additionally, AES-XTS 256 (Advanced Encryption Standard) provides enhanced data protection. SMART also offers a comprehensive set of intelligent back-up
has a proven 10-year track record of successfully designing, manufacturing and supporting NVDIMMs and BPMs. It has been a key contributor, along with other industry partners, in establishing the evolving NVDIMM ecosystem. SMART Modular Technologies https://www.smartm.com
SMART Modular Announces High-Density DuraMemory for 1U Blade Applications
SMART Modular Technologies, Inc. announced its new DuraMemory™ 64GB DDR4 VLP (Very Low Profile) RDIMM. One of the industry’s highest densities available in a VLP form factor, SMART’s 64GB VLP RDIMM is targeted for embedded 1U blade compute, storage, enterprise networking, telecom, and industrial single board computers (SBCs). As the newest product added to SMART’s wide portfolio of DuraMemory VLP and ULP (Ultra Low Profile) modules, its main attributes are: • Space savings – VLP RDIMM height of 18.75mm allows for vertical DIMM placement in 1U blades • High-density – can achieve up to 768GB in 1U compute and storage blade systems with 12 DIMM sockets https://international.electronica-azi.ro
• High-performance – DDR4-2933 operation For ruggedized and harsh operating conditions, SMART offers retention clips to secure the socket latches in place and industrial grade temperature operation (40°C to +85°C). Compared to generic memory modules, this new high-density solution is part of SMART’s growing DuraMemory family of products which are aimed to address higher durability, reliability and optimum performance necessary to sustain the high levels of remote communications in today's workplace. SMART’s extensive capabilities based on over 30 years of designing and manufacturing specialty memory solutions, are core to the entire DuraMemory product line. Quality controls and stringent processes
in all aspects of design, procurement and manufacturing processes yield a highly superior DRAM memory module found in the new DuraMemory 64GB VLP RDIMM. Alan Marten, Senior Vice President of Specialty Memory stated, “SMART is 100% committed to supporting our customers' ongoing challenges. We’re proud to be a trusted partner to businesses that rely on durability and quality. We will continue to provide the solutions and support our partners have come to expect.” To learn more about how our DuraMemory solutions can help your business, reach out to a SMART team member today. SMART Modular Technologies https://www.smartm.com 41
PRODUCT NEWS
Digi International Transforms Digi Remote Manager to Empower IoT Network Success Digi Remote Manager Enables Businesses to Maximize IoT Investment and Empower Staff with Dynamic, Mission-Critical Network Intelligence and Single-Paneof-Glass Device Control Digi International®, a leading global provider of Internet of Things (IoT) connectivity products and services, announced the latest release of Digi Remote Manager®, its device and network management cloud platform. With these advances, Digi Remote Manager expands its ability to simplify device deployment and maintenance, ensure network uptime and security, and provides new levels of network management so that the network team is not required to change their business processes to accommodate rigid network tools. Digi Remote Manager Unlocks Network Value, Delivers Higher Resiliency Digi Remote Manager is a cloud-based platform that allows users to manage IoT devices and networks in any environment from anywhere in the world. With the ability to support applications from industrial IoT to branch connectivity, intelligent traffic management and everything in between, Digi Remote Manager unlocks the potential of IoT deployments across the board. It transforms dispersed IoT devices to a holistic IoT network, deriving operational and business value and delivering the secure, resilient network required by organizations today. ElectriCities of North Carolina – an organization that provides a range of technical services to support power services throughout North Carolina, South Carolina and Virginia – uses Digi Remote Manager to maintain a complex network that covers thousands of square miles and 42
to collect data from an array of meters, generators and telemetry equipment. “I was here before Digi Remote Manager, so I can speak directly to the difference that it has made in terms of both saving costs and providing new value,” said John Coates, Lead Systems Coordinator for ElectriCities. “Our ability to remotely maintain our network, collect data, and optimize our systems with on-device intelligence has allowed us to grow and maximize our output to best serve our members.” Advanced Configuration Features Bring Market Leading Capabilities Device Configuration, Monitoring and Maintenance are the core of any device management software, but Digi provides key differentiators that simplify processes and provide additional value. • Device grouping allows users to create groups of devices and remotely configure them by group identification rather than product type, so the same device types can be programmed in different ways without reverting to manual configurations on individual devices. The ability to configure device groups brings greater control to the network manager, providing much needed flexibility to assign configurations regardless of the device type. • Custom scripts, such as Python, can be uploaded to geographically dispersed devices to simply add the on-device intelligence users require. • Remote access to non-IP edge devices, such as sensors, via the routers that they’re connected to expands the array of
devices users can manage through the Digi Remote Manager platform. • Sub Account Management, the ability to create sub accounts that can be managed from the parent account. Sub accounts allow the parent account owner to restrict which devices sub account users can access. Complex Task Automation and Task Scheduling both enable users to optimize their time and improve operational efficiency, albeit in different ways. • Task automation allows users to create a configuration for a group of devices that is then automatically pushed to all devices in that group, enabling pre-validation of configurations and reducing cost to maintain the deployment. • Task Scheduling offers the ability to pre-program functions to run at a later time, easing the burden on network engineers and managers while still ensuring a high-functioning network. Digi Remote Manager Opens the Door to Critical API Integration API Explorer allows users to browse and test hundreds of APIs in a live environment on the platform to validate that the code works before it is live throughout the network. Digi Remote Manager APIs allow you to integrate and run third- party applications, both cloud based and on premises, to run data rules, batches, as well as import and export data and to execute reports providing deeper insight to device deployments. Electronica Azi International | 4/2020
PRODUCT NEWS With 175 Security Controls, Digi Remote Manager Delivers Critical Compliance Software-defined Security provides more than 175 controls to protect data and devices and maintain compliance with ISO27002’s ISMS, NERCs critical infrastructure protection (CIP) guidance, the Cloud Security Alliance (CSA) Cloud Controls Matrix, as well as relevant HIPAA and NIST standards. Robust reporting options and custom alerts give users a full library of reports that they can easily pull to meet their needs, while alerts are customizable to ensure specific performance levels are maintained and the network is functioning properly. Best-in-Class Customer Experience Upgraded UI/UX offers simpler and more intuitive management via a smarter, customizable, widget-based dashboard. This “build what you need” model allows
users to create the views they want and to easily access the data required to manage a dynamic network. Meanwhile, a new Dark Mode option ensures that field engineers operating from a tablet or phone in the field can easily see these dashboards on their physical screens no matter the lighting or conditions. Strong Analytics Engine Provide Network Insights Notification Center is a new addition delivering direct communications to users including notices of firmware updates, account renewal information, and instant alerts of security threats. Pre-build reports help save time while providing the high demand data needed to efficiently manage an intelligent network as well as providing data to maximize device uptime. Real-Time Diagnostics facilitate maintenance and troubleshooting.
“Businesses won’t be able to realize the full value of their IoT initiatives if they are not focused on maximizing its entire network of devices,” said Brian Kirkendall, vice president of product management at Digi International. “Digi Remote Manager transforms the way that businesses are able to think about and deploy their projects. From industry leading security software to maximized uptime and simplified operations, we help build a secure and valuable network that gives those businesses the peace of mind that operations are within compliance without the need for elaborate solutions.” Digi Remote Manager is available in multiple offerings, allowing users to select the service that best meet each user’s needs. Digi International® https://www.digi.com
Advantech releases ready-to-use Wi-Fi 5/BT 5.0 and LTE Cat.16 wireless kits – reducing time to market by removing certification obstacles Advantech, a leading global innovator in the embedded market, is pleased to announce two wireless solutions aimed at improving connectivity in diverse applications. EWM-W192 K1 & K2 and EWM-C186K1 (EWM-W/C) wireless solutions enable Wi-Fi 5/Bluetooth 5.0 and LTE CAT16 respectively. EWM-W192 K1 &
ing wireless solutions in diverse industrial, retail, and medical applications. Choosing the correct wireless solution is the first step in creating greater connectivity between machines. However, finding compatible antennas, cables, and connections can be a challenge for designers seeking to reduce time-to-market.
K2 are compatible with standard M.2 2230 A-E key form factor connectors, while EWM-C186 K1 connects easily to M.2 3042 key-B for convenient wireless access. Both EWM-W/C models feature FCC and CE-RED certified wireless antennas and cables for system designers seek-
Advantech’s EWM-W/C address these issues by featuring multiple dipole antennas and cables (EWM-W192 K1 & K2 features 2 × dipole antennas & MHF4 RF connector cables, EWM-C186K1 features 4 × dipole antennas & MFH4 connector cables).
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This adaptable wireless solution facilitates easy planning, installation, and management to reduce time-to-market. In an effort to avoid bottlenecks caused by RF testing, Advantech partnered with Intel® IoT BU to certify its EWM-W/C wireless solutions. To this end, the EWM-W/C wireless solutions satisfy international safety standards for human exposure to electric, magnetic, and electromagnetic signals, and are CE RED, FCC, and IC certified, making them an excellent choice for EU, US, and Canadian customers. The streamlining of RF testing necessitates system-level EMC/EMI related tests only. Through leveraging these solutions, customers can streamline their wireless integration process. Advantech’s wireless team used product ecosystems to test EWM-W/C compatibility before launch to improve market adaptability. EWM-W/C kits have proven to be compatible with numerous embedded computers including EPC-T4286 and EPCC301. This combination of adaptability and easy installation make EWM-W192 K1 & K2 and EWM-C186K1 excellent choices for kiosk data streaming, factory automation, and machine vision applications. Advantech https://:www.advantech.eu 43
PRODUCT NEWS
Simple assembly thanks to tool-free assembly HARTING presents the new RJ Industrial® MultiFeature series The HARTING Technology Group as pioneer for Industrial Ethernet cabling solution launch the latest generation of the legendary HARTING RJ Industrial® filed termination RJ45 connectors.
While the classic RJ45 was a telecommunications development that was not sufficient for every industrial requirement, the HARTING RJ Industrial® MultiFeature series meets all the requirements and challenges
of a tough operating environment. While the classic RJ45 was a telecommunications development that was not enough for every industrial demand, the HARTING RJ Industrial® MultiFeature series can cope
HARTING RJ Industrial® MultiFeature series available in straight and angled version.
With the new RJ Industrial® MultiFeature series, HARTING can perfectly meet the wishes and requirements of its customers for even easier installation in the field. The further development of the successful RJ Industrial® MF series is characterised by tool-free assembly, easier assembly and a robust metal housing.
HARTING RJ Industrial® MultiFeature series angled group
The highlight of the new RJ45 series are the integrated blades, which shorten the individual strands to the correct length when closing the connector. Virtually a built-in side cutter. This completely eliminates this time-consuming work step and the assembly is more than 25% faster.
HARTING RJ Industrial® MultiFeature series can be assembled without tools, making it the perfect solution for use in the field. 44
with all the requirements and challenges of a hard-operating environment. Safe Cat. 6A performance, IP20 and IP65/67 housing combined with PoE power supplies IEEE802.3af (PoE 15.4W) / IEEE802.3at (PoE 25.5W) / IEEE802.3bt (PoE 100W) supply data and power for any device. The suitability for flexible and solid wires from AWG 26 to 22, the robust cable fastening and angled connectors with variable cable outlet direction are further features with great benefits for customers. HARTING Technology Group https://www.HARTING.com Electronica Azi International | 4/2020
LTHD Corporation S.R.L. Head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., lthd@lthd.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, Fax: +40 256 490813
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