Electronica Azi International no. 5

5/2017

A PAN EUROPEAN MAGAZINE

www.international.electronica-azi.ro

NEWS Supporting Program for productronica 2017

ElEctronics Manufacturing is bEcoMing Digital anD sMart Industrial Internet of Things, automation and smart factory: digitalization is the focus in the supporting program at the world's leading trade fair for the development and production of electronics. In addition to two special shows of VDMA and Fraunhofer IZM on smart data, the opening keynote address will deal with smart manufacturing. productronica will take place on the grounds of Messe München from November 14 to 17, 2017.

Think outside the box and get new ideas from outside. The supporting program of this year's productronica provides this possibility. In addition to the three forums on the subject areas of SMT, PCB & EMS as well as innovation, talks and discussion rounds will present products and solutions for the development and production of electronics.

integration of various sensors and actuators in production machines on processes and technologies using examples of modern assembly manufacturing. On a virtual learning trail, visitors will get information, among other things, about how data collection is actually happening and how data robustness along the value chain proves its worth.

Opening keynote address for the digital production of footwear For the first time, a keynote address will open the forum program at productronica on November 14 (12.30, SMT Speakers Corner, Hall A1). In addition, Christian Decker, Managing Director of DESMA Shoe Machinery and a cross-industry speaker, will talk about the digitalization of manufacturing. The keynote address will detail the evolution and transformation of traditional industries for consumer products. Mr. Decker will also talk about Computer Integrated Manufacturing (CIM), based on which the individual wishes of ordering parties can be adapted for batch size 1.

productronica innovation award For the second time, Messe München is presenting the productronica innovation award, together with the trade journal productronic this year. Approx. 60 companies have submitted their products. The winners of the six categories Cable, Coils & Hybrids, Future Markets, PCB & EMS, Semiconductors as well as SMT and Inspection & Quality will be announced during the main press conference at 11 am on Tuesday, November 14.

Christian Decker, Managing Director of DESMA Special Show “Smart Data - Future Manufacturing” In the special show “Smart Data − Future Manufacturing” in Hall B2, VDMA and Lufthansa Industry Solutions will together explain how new business models are developed from a variety of data. Visitors experience the path of “Big Data − Collecting Data” (sensors in manufacturing machines) to “Smart Data − Processing Data” (predictive maintenance) and all the way to “New Business −Interpreting Data and Deriving Decisions.”

Special Show “Hardware Data Mining” Also in Hall B2, the Fraunhofer Institute for Reliability and Microintegration (IZM) will show the influence of the www.international.electronica-azi.ro

Talks and panel discussions in three forums Visitors have the possibility to obtain information about developments and innovations in electronics production in talks and panel discussions in SMT Speakers Corner (Hall A1), PCB & EMS Speakers Corner (Hall B3) and the Innovation Forum (Hall B2).

The highlights in the forums include round table discussions on the subject “Rework & Repair − can automated systems and processes provide reproducibly reliable quality?” (in Hall A1 − SMT Speakers Corner at 12 noon on Wednesday, November 15) an “EMS goes Smart” (in Hall B3 - PCB & EMS Speakers Corner at 15:00 on Wednesday, November 15) and “Electronics production on the way to the smart factory – where are stumbling blocks lurking and what are the chances?” (in Hall A1 − SMT Speakers Corner at 12 noon on Thursday, November 16).

IPC Hand Soldering World Championship IPC is again holding the European Regional Competition in hand soldering at productronica this year. In addition, the IPC HSC World Championship will be held on the last trade fair day.

Along with the regional European productronica winner, representatives from Russia, Poland, United Kingdom, France, Hungary, Germany and Asia will be competing for the World Championship In this competitive event,

industry professionals must build a functional assembly within 60 minutes, meeting IPC-A-610F Class 3 criteria.

Special show “Cleanroom” High-tech products place high demands on manufacturing conditions, and the clean room plays a key role in that process. The “Cleanroom” (Hall B2) shows how people are keeping things clean there. The training module “Intelligent Lock” represents a trade fair novelty. Visitors can enter a virtual reality clean room.

Interactive instructions tell them how to put on clothing in the right order and how to wash and disinfect their hands correctly. The imaginary “door” to the clean room only opens for those who observe all the guidelines.

“Make in India − Medium-Sized Firms” Workshop The Indian economy is currently the fastest growing economic zone in the world and a center for trade and investment opportunities. The “Made in India” initiative (MIIM) created by the Indian Government provides foreign investors access to the Indian market as the first of its kind and makes India a global site for the manufacturing industry. To this end, Messe München in collaboration with MIIM is offering a two-hour workshop on November 15, which provides a detailed presentation of the electronics and manufacturing industries in India.

IT2Industry IT2Industry will take place within the context of productronica for the second time this year. The trade fair for intelligent, digitally networked working worlds shows applications in the areas of the industrial Internet of Things, big data, cloud and industrial IT security.

The following talks are among the highlights of the accompanying Open Conference: On Wednesday 15 November (13:00, Hall B2), Claus Cremers, Siemens AG, will explain how manufacturing companies can connect machines and physical infrastructure with the digital world. With that, they achieve more productivity and efficiency as well as reduce downtime in their complete company. In addition, Niklaus Waser, IBM Watson, will show what new opportunities arise for industry in a digitally connected world (11:30 on Thursday, November 16).

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TABlE Of CONTENTS 3 | Electronics Manufacturing is becoming Digital

20 | ON Semiconductor’s KAE-04471 Interline

and Smart

Transfer EMCCD Image Sensor for Excellent

6 | from PIC16f877 to PIC16f18877,

Picture Quality in Extreme low light Applications 28 | Efficiently powering sensors in IoT

Twenty Years of PIC Evolution

30 | Many new solutions and eight integrated workflows

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10 | Intel® Compute Card a small-format PC

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12 | TOREX − 18V MICRO DC/DC 13 | flAT AS A PANCAKE

32 | Suitability of an enhanced low melting point alloy

14 | Any Way You Want It

for a handheld device

15 | CONTEST: Win a Microchip MPlAB® ICD 4 In-Circuit Debugger!

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37 | MicroCare Expert Educates the Electronics Industry on Optimizing Benchtop Cleaning

18 | Powerbox announces advanced marine power supply and platform for immersed computers

38 | Through hole wetting on an OSP finished PCB in a lead-free selective soldering process

® Management Managing Director - Ionela Ganea Editorial Director - Gabriel Neagu Accounting - Ioana Paraschiv Advertisement - Irina Ganea Web design - Eugen Vărzaru

“Electronica azi” is a registered trademark at osiM - romania, registered position: 124259

Contributing editors Cornel Pazara Marian Blejan PhD. Paul Svasta PhD. Norocel Codreanu PhD. Bogdan Grămescu

issn: 1582-3490 Printed by

EURO STANDARD PRESS 2000 srl VAT: RO3998003 | Tel.: +40 (0) 31 8059955 | Tel.: +40 (0) 722 707254 office@electronica-azi.ro | www.international.electronica-azi.ro

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Electronica Azi International is published 6 times per year in 2017 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering decisions.

Copyright 2017 by Euro Standard Press 2000 s.r.l.

All rights reserved.

Electronica Azi international | 5/2017

EMBEDDED SYSTEMS

FROM PIC16f877 TO PIC16f18877, TWENTy yEARs OF PIC EVOluTION author: lucio di Jasio, Microchip Technology INTRODUCTION the Pic16f877 microcontroller (Mcu) family was designed in 1997 as one of the very first flash microcontroller products from Microchip. it has been featured in countless projects, articles, books and blog posts in many languages around the world. twenty years later, the Pic16f877 is still in production and its product page is one of the most visited on the company web site! this is despite the availability of several newer generations of microcontrollers (with similar features) having been introduced on an almost regular cycle: Pic16f877a, Pic16f887, Pic16f1938 and eventually the Pic16f18877 model. clearly this is a testimony of the appreciation that embedded control designers have for Microchip’s “customer driven obsolescence” program. that program is the stated commitment not to end the life of any product that is selling. as long as orders are being placed for a device, even if only in minimal quantities, Microchip will continue to provide the device for customers. this is a great reassurance for those who have a working product and would prefer to spend their time and resources developing something new with the potential to generate additional revenue. While an old product cannot benefit from the latest advancements in innovative technology such as core independent Peripherals, a design team gains the freedom to manage the innovation cycle rather than being forced re-work the same product in an endless loop because their original part is no longer available.

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PIN-TO-PIN AND BACKWARD COMPATIBIlITY if you did not already know about Microchip’s focused mandate on backward compatibility, then you’re in for a very pleasant surprise. as the newer generations of Pic microcontrollers continued to be released over the years, Microchip has ensured that its design teams provide pin-to-pin and even binary backward compatibility for previous generations of Pic devices. the extent of the efforts required to guarantee such a long term migration strategy are perhaps not obvious, but the fact that more than

BASIC fEATURES TABlE COMPARISON at this point you might be tempted to make the direct comparison between the datasheets of the two extremes of the time continuum: the Pic16f877 and its latest [re]incarnation, the Pic16f18877. incidentally at 660 pages the ‘18877 preliminary datasheet is almost triple the size of the ‘877 datasheet and is destined to grow larger as the full characterization data (graphs and charts) are added. but nobody has time to read datasheets anymore. Most will briefly gaze at the summary table, characteristically offered at the bottom of the first datasheet page:

PIC16f877 Program Memory (KW) 8 cPu speed (MiPs) 5 raM (bytes) 368 Data EEProM (bytes) 256 Digital communication Peripherals 1 × uart 1 × MssP (sPi/i2c) capture/compare/PWM Peripherals 2 timers

2 × 8-bit 1 × 16-bit

aDc

8 ch, 10-bit

comparators i/o pins

2 33

PIC16f18877 32 8 4,096 256 1 × uart w/lin 2 × MssP (sPi/i2c) 5 × capture/compare/ PWM 2 × PWM 3 × 8-bit w/Hlt 4 × 16-bit 1 × 20-bit (numerically controlled oscillator) 2 × 24-bit (signal measurement timer) 35 ch, 10-bit (analog to digital converter with computation) 2 w/5-bit Dac 36 w/peripheral pin select

table 1: Side-by-side comparison 250 diverse models exist of Pic microcontrollers (in a 40-pin package alone) that all fit in the same exact DiP socket - defined back in 1989 – should give you pause. that is commitment.

looking at table 1, the general increase in all kinds of memory sizes and in the number of peripherals present is obvious. flash memory has quadrupled, effectively filling up the entire addressable space 64 Kb of a Electronica Azi international | 5/2017

MCUs

typical 8-bit architecture. raM memory has grown almost 10 times the size!

While this is not according to Moore’s law, let me remind you that these are embedded devices, where robustness and power consumptions are much tighter constraints than the typical desktop Pc/consumer industry would demand. there is also an apparent explosion in the number of timers (and PWMs). timing is an important matter in embedded control where real time performance is valued more than the ability to process large amounts of data or computational performance. in fact, upon closer inspection of the datasheet, it is revealed that the new devices have a complex internal clock system comprised of as many as seven oscillators and two Pll circuits capable of producing accurate clock signals without use of any external components where the original devices had none. the newer devices can also execute code faster – almost doubling the speed – although, as we will see, MiPs figures can be deceiving.

C lANGUAGE SUPPORT the greatly increased use of c programming language in the development of embedded applications can certainly be blamed for some of the growth in memory demand. to adapt to requirement changes over the past decade, the Pic architecture has changed under the hood. With the Pic16f1 series, new instructions have been added to the Pic core with the sole purpose of increasing its code density. they address the need to better support pointers and larger amounts of raM. Most notably the raM banking scheme for which the Pic is famously known - so handy for very compact assembly coding - has been paired with a more compiler friendly linear memory addressing. note that the old banking mechanism is still available and continues to guarantee backward compatibility for those legacy assembly applications. further, the new linear addressing scheme is unifying the data and program memory space of the Pic16f1. this allows for definition of large data tables in flash memory, unlimited size raM arrays and generic pointers. interestingly these major architectural changes have gone un-noticed to most c language Pic developers, after all this is exactly the kind of detail compilers were meant to abstract. this is one of the reasons why the MiPs figures of the old ‘877 microcontroller cannot www.international.electronica-azi.ro

be compared directly anymore to the MiPs figures of the newer f1 cores in table 1.

INTERRUPT ChANGES the other architectural element that has seen a significant improvement is the interrupt management system. While the newer Pic16f1 core maintains the original singlevector interrupt design, a new set of four shadow registers has been added to streamline the interrupt context save and restore sequences. listing 1 shows the traditional Pic16 prologue / epilogue: ; ISR: SWAPF CLRF MOVWF MOVF MOVWF CLRF

MOVWF W_TEMP STATUS, W STATUS STATUS_TEMP PCLATH, W PCLATH_TEMP PCLATH

; Prologue

; ;(Interrupt Service Routine code here) ; MOVF PCLATH_TEMP, W ;Epilogue MOVWF PCLATH SWAPF STATUS_TEMP, W MOVWF STATUS SWAPF W_TEMP, F SWAPF W_TEMP, W listing 1: Prologue and epilogue sequence for interrupt context saving the standard interrupt prologue and epilogue used to take as many as 56 clock cycles. With the new Pic16f1 shadow register mechanism the need for the two sequences is completely eliminated and the cost of an interrupt is reduced to the basic four cycles required for the cPu branch. the result is a considerable increase in the microcontroller responsiveness or its real-time performance by as much as an order of magnitude. flEXIBIlITY careful observation at the bottom of table 1 reveals another interesting detail: the number of general purpose i/os available for the two devices is different despite the claimed pin to pin compatibility. it turns out that the new devices are multiplexing three more pins, previously reserved to a crystal oscillator and an external reset, which are now available optionally as a general purpose i/os. but only a deeper study of the datasheet will reveal the true golden nugget: All digital peripherals input/outputs are now multiplexed on each device pin! this feature

is known cryptically as Peripheral Pin select (PPs) and provides a quantum leap in flexibility to the Pic16f18877 devices and several similar Pic16f1 families. similarly the new Pic16f1 devices’ aDc module is now coupled with a [very] large analog input multiplexer that makes as many as 35 of the same pins available as possible analog inputs. this effectively means that each analog and/or digital signal directed to/from the microcontroller can now be routed optimally on the Pcb to control noise, increase robustness, simplify (speed up) layout and possibly reduce the number of layers and vias, ultimately helping to reduce cost.

CORE INDEPENDENT PERIPhERAlS unfortunately the sole analysis of table 1, row by row, will never reveal the true game changing features found on the latest generation Pic16f1 devices. this is the presence of core independent Peripherals or ciPs for short.

More than the individual peripherals’ features: sMt, Hlt, cWg, nco, clc … about which we could (and did) write entire books and the new datasheet spends most of the 400 additional pages – it is the design philosophy behind them that matters. the new peripherals are different because they are designed to be directly interconnected to each other and to perform autonomous functions, independently of the core. ciPs are meant to provide a hardware assist to the microcontroller to avoid the cPu bottlenecking of the system. When core independent Peripherals are connected among each other to perform a function, interrupts are not simply being executed faster, but rather they are completely removed from the application. the result is a more balanced design where configurable hardware efficiency and parallelism is matched by software flexibility. additionally, there are additional core independent Peripherals (not shown in the figure above) that are available on other Pic microcontrollers, allowing designers to pick the solution that best fits their needs.

ROBUSTNESS a significant portion of the new hardware modules found on the Pic16f18877 is devoted to increasing the robustness of the microcontroller. the traditional watchdog circuit is replaced by a windowed system with a rich selection of scaling options.

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EMBEDDED SYSTEMS the brown-out reset (bor) circuit has several thresholds, low-power modes and a dedicated crc scan circuit can be used to constantly monitor, in the background, the integrity of the memory content - without impacting the Mcu’s performance. lOW POWER While maintaining the ability to operate at 5V and drive even higher continuous currents on its i/os (up to 50ma), the electrical characteristics of the Pic16f18877 device tell us about much lower active power consumption figures (approximately by a factor of four) when operating over the entire voltage range (1.8V – 5.5V). the passive (stand-

tinuous and every application is connected! the most important feature of the newer Pic16f18877 devices might well be the availability of rapid development tools to automate and speed up the code generation by order of magnitude over what was possible before. the latest generation Pic microcontrollers are supported by MPlab® code configurator (or Mcc). this is a tool that can speed up the tedious process of initializing each device’s peripheral in minutes rather than hours, and some claim can eliminate entirely the need to read the datasheet (or at least a good portion of that time). further, a complete cloud-based toolchain, MPlab Xpress, is available to make the eval-

Every developer is empowered to decide if and when to revise an existing design or to simply maintain it as-is and focus instead on creating new products that can bring fresh new business opportunities / revenue. but when launching a new design, it is important to realize that by selecting the same trusted and true (popular) microcontroller model might mean missing out on a lot of new features and possibilities. the company consistency over the years and the obsessive commitment to [backward] compatibility might have had you believe that Pic microcontroller architectures have not changed much over the past

Figure 1: Comparison of the PIC16F877 and its latest [re]incarnation, the PIC16F18877. by) current consumption figures are even more impressive, promising a reduction of almost two orders of magnitude (100x). once more, only a very detailed analysis of the device datasheet will reveal entire new chapters about features that extend the ability to control power on a much finer grain, offering many intermediate modes (including idle and doze). also a new set of registers (PMDs) add the ability to control power consumption for each individual peripheral to achieve the ultimate level of flexibility.

uation and prototyping phase of a design as simple and fast as opening a browser and loading a single web page. gone is the need to download an integrated development environment (iDE) and a compiler, adding up to hundreds of megabytes. gone is the time required to install them and to maintain them so that they are properly configured and up to date. anybody can evaluate a new microcontroller model by opening, customising and building a (sample) project in minutes rather than hours.

IT'S All ABOUT ThE TOOlS but all of the above new features could ultimately be irrelevant in the modern design world where design cost is dominated by time-to-market, where design cycles are con-

YOU ARE GOING TO MISS OUT BIG! the commitment by Microchip to not discontinuing products so long as there is still demand gives designers the ability to take control of their innovation cycle.

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few decades, but that could not be further from the truth. the core independent Peripherals subvert the old embedded control design paradigm and the new cloud and code generation tools can dramatically improve the design process efficiency. the next time you have an opportunity to select a microcontroller for a new application, make sure to spend a few minutes to check out the latest* Pic microcontroller family or you‘ll be sure to miss out in big way! (*hint: The part number better start with PIC16F1 followed by four more digits!)

Microchip Technology www.microchip.com Electronica Azi international | 5/2017

EMBEDDED SYSTEMS

Intel® Compute Card a small-format PC Author: Mario Klug, Senior Marketing Manager, Embedded Boards & Systems

new designs in the it market are considered to be revolutionary if they enable new device concepts and applications that were previously either impossible or only possible to a limited extent in this new form. the ongoing miniaturization of chip designs and the resulting ever-increasing concentration of more and more computing performance in ever-shrinking spaces have been associated with new device concepts in the past that have heavily influenced the usability of computer systems.

Whether one takes a tablet computer or smartphones as an example: these concepts first changed the consumer market before advancing into the industrial market in the next step, where they also opened up new ways of applying computer technology. However, all of these concepts involve completely new device classes that enable innovative application scenarios. looking at the approach to mobility in computer technology thus far, we can find various concepts that still coexist, but at best merely complement each other.

When traveling on holidays, we tend to bring a tablet, which is complemented by a smartphone. in the work environment, notebooks, convertibles, or slimbooks are part of the standard repertoire. closer examination of a business trip quickly reveals different scenarios in which one needs to access computer technology and must therefore employ different concepts.

When traveling by air, people sit in airport lounges and work on presentations on a 10

New designs in the IT market are considered to be revolutionary if they enable new device concepts and applications that were previously either impossible or only possible to a limited extent in this new form.

notebook while writing messages using the messaging services on a smartphone. When on board the aircraft itself, people are generally cut off from communicating with the outside world and continue using a laptop to prepare for meetings etc. on arrival at the destination, they must then connect the notebook to a projector or monitor for the presentation. the hotel room, on the other hand, is equipped with a more or less interactive television that connects via the hotel's Wlan with a tablet, notebook, and smartphone to allow us to carry out workrelated as well as personal tasks. one can therefore assume with a degree of certainty that most people always carry two to three different devices with them when they travel, and that these devices spend most of their time either switched off or running in power-save mode given the low average utilization across all devices.

UNIVERSAl SOlUTION fOR BUSINESS AND PERSONAl USE How much more practical would it be if just one computer replaced all these devices? one that can do virtually everything that the other devices can also do? one that is also as small and handy as a credit card, therefore not only saving space and weight, but also enabling greater utilization. this is precisely where the intel® compute card comes in: it is a fully-functional computer with external dimensions of 95 × 55 × 5 mm − roughly the size of a credit card −, a power consumption of below 10 W as well as a standardized interface that offers a completely new approach to mobile computing. it is clear that this concept is unlikely to catch on without a widely available eco-system. this is the very point where we need to consider the possibilities of this concept. as mentioned at the outset, designs previously classified as revolutionary were devices that functioned more or less out-of-the-box without any notable eco-system, and this

One for all

enabled them to gain acceptance quickly. this is not the case with the intel® compute card because the card requires docking facilities. assuming that the eco-system partners can make suitable devices available to coincide with the launch of the card and that these circulate rapidly in the market, the following scenario is conceivable: CARD INSTEAD Of ChAOS apart from a smartphone, the only thing you need to carry with you is the intel® compute card. You complete your final preparations the day before your departure via the docking station at your desk in the office. ideally, you simply insert the card into the card slot in the monitor. at the end of the day, you simply remove the card from the slot, put it in your bag, and set off on your trip the next morning. in the airport lounge, you insert the compute card into small monitors with compatible slots that are provided at the seats or in the restaurants and continue working until it's time to check in. on the aircraft itself, the entertainment system will ideally also have a slot for the card so that you can also continue working here. on arrival at your destination, you simply insert the card for the meeting and presentation into the slot on the monitor and give your presentation. the television set in your hotel room also has a compatible slot so that you can continue working on the big www.international.electronica-azi.ro

COMPUTE CARDS monitor. What is the major difference to the now more commonplace docking stations designed for smartphones? Very simple: flexibility in the choice of operating system and applications used. With Microsoft continuum, the choice of software is limited by the processor platform and small number of smartphones available with Windows 10, while the docking concept by samsung for the galaxy s8 is tied to android. for the time being, the performance of smartphones is unlikely to be sufficient for emulations and VMs, which means in most cases that these concepts do not offer the required added value. the advantage consists solely of only having to carry one device around. this − at least up to now − has not been satisfactorily achieved.

PERfECT PERfORMANCE, SPECIfIC SCAlING it's a different story with the compute card: the scaling of the celeron® n3450 all the way to the vPro™-enabled core™ i5-7Y57 enables performance to be adjusted to the majority of day-to-day applications. the interfaces provided via the docking connector enable the device manufacturers to connect both usb 3.0 host connections as well as Ethernet and up to two displays to the card, one of which can even be controlled at up to uHD resolution with 60Hz. as with the intel® bluetooth 4.2 and Wifi already integrated in the cards, this means that the interfaces required for the card to be used for the intended purpose in every docking system are available. However, use of the intel® compute card is not confined to the applications described in the specified scenario. the continuation of this concept, which intel® has already confirmed will include future processor generations, means that the compute card is also available for other applications that call for scalability, flexibility in the choice of operating system and programs used, as well as the possibility of easy upgrades to newer processor technology. one example is digital signage installations, most of which are currently realized by means of connected external Pc systems, oPs modules in the monitors or boards integrated in the system.

Each of these concepts has its advantages and disadvantages. Disadvantages include the complex and interference-prone wiring of the external systems on the one hand, and the cost of upgrading the internal board to new technology on the other. this is why the

oPs concept was long expected to prevail.

However it has proved to be too costly and complex to implement. although new approaches such as Mini oPs improve the solution in principle, they do nothing to change the rather poor availability in the market. assuming that the intel® compute card is available in sufficient numbers at market launch, the situation for applications in which robustness is not an essential − in which case external fanless box Pcs or fanless Mini oPs modules are the better choice − should be more positive.

COMPUTE CARD IN ThE IoT if we cast the net a little further to include everyday domestic appliances in our homes, interactive and networked televisions as well as interactive refrigerators would be the ideal candidates to use the intel® compute card. these appliances could also be upgraded to the latest processor technology and software after a few years. likewise, the compute card from work could be connected to the domestic television set, which would allow you to continue working on a large screen at home. naturally, you can already connect a tablet via HDMi to the television and use it as a monitor. but you are still restricted to the respective platform. if the development in the field of roll-up or folding olED screens continues to progress and if these types of concepts are brought to market maturity, there would also be no obstacles to the mobile use of the intel® compute card in conjunction with these types of display solutions. ultimately, the availability in the near future of an eco-system that is as diverse as possible will determine the success of this revolutionary design. in this context, rutronik is on hand to advise device and system manufacturers about developments - be it implementation in a new digital signage system or in the very latest high-end refrigerators. our colleagues on the ground are only too happy to advise you of the possibilities that the use of an intel® compute card in your application could provide.

Rutronik Elektronische Bauelemente www.rutronik.com 11

POWER DESIGN

TOREX

18V Micro Dc/Dc 18V, 500ma synchronous step-Down Micro Dc/Dc converter at coDico

XCl225/26 series With an operating temperature range of up to +105°c and a quiescent current of only 12μa, this new 18V, 500ma buck Micro Dc/Dc from torEX is a welcome addition to the ever expanding range of ultra-small Micro Dc/Dcs from torEX! the Xcl225/26 series is a 1.2MHz synchronous step-down Micro Dc/Dc converter with integrated inductor in an ultra-small 3.0× 3.0×1.6mm Dfn3030-10b package. integration of the inductor simplifies the board layout and minimizes any unwanted radiated noise. a stable and efficient power supply circuit can be configured by simply adding only two ceramic capacitors externally thereby contributing to Pcb space saving and the shortening of development time.

With a P-ch High side switch to ensure low voltage operation and 100% max duty ratio, the Xcl225/26 can operate from 3.0~18.0V and deliver loads up to 500ma making it an ideal replacement for inefficient linear regulators used in many industrial applications. output voltage is set externally within a range of 1.0~15.0V and the new Xcl225/26 is designed for very high efficiencies at low output loads. in addition, this new Micro Dc/Dc features low quiescent current (12 μa) and ultralow output ripple voltage. the Xcl225/26 includes over current and short-circuit 12

protection, adjustable soft start and a power good output. the operating ambient temperature range is -40°c~+105°c.

Many traditional mid-voltage Dc/Dc converters use an n-ch MosfEt for the High side switch. Whilst an n-ch fEt is excellent for High speed switching it normally needs a special bootstrap circuit to drive it. a bootstrap circuit has the advantage of being simple and low cost, but it also has limitations. the duty-cycle and on time is limited by the requirement to refresh the charge in the bootstrap capacitor, which means the maximum duty ratio can never be 100% and this has implications when the input voltage goes below Vout. the Xcl225/26 uses a P-ch MosfEt for the High side switch that does not need a bootstrap circuit, so the maximum duty ratio can be 100%. this means that the output remains stable even when the input drops beneath Vout. the Xcl225/26 output follows the input when it goes below Vout and this can be important when the Vin source has a high impedance (i.e. due to a long cable). for more information, please contact our coDico regional sales Manager ivan Mitic.

Ivan Mitic ivan.mitic@codico.com +43 1 86 305-194 www.codico.com Electronica Azi international | 5/2017

POWER MODUlES

Eos Power india Pvt. stays on track and focusses consequently on their three core competencies: Miniaturisation, high flexibility and adaption to customer requests, in-depth know-how in medical applications.

flAT AS A PANCAKE after their latest release, the WlP series, the indian manufacturer just introduced their ulP series to the power world. ulP as in »ultralow profile« only measures 0.75” (19.05mm) in height and is available on all three standard footprints (2x3”@40W, 2x4”@180, 3x5”@275W).

the series literally is the next logical step after the recently introduced WlP series (1” i.e. 25.4mm in height on 75/120W@ 2x3“, 225W@2x4“, 350W@3x5“footprints). the entire family is available in safety class I and II and is perfectly suitable for industrial and medical applications.

Due to its isolation grade of 2×MoPP (Means of Patient Protection) between primary and secondary side as well as 1×MoPP between primary and Earth as much as sElV-circuit and Earth, the device is the perfect fit for literally any portable device or homecare equipment with direct patient contact (bf-body floating). customers increasingly demand long term availability especially in the medical industry as much as long time warranty.

Eos can comply with both desires by offering an optional seven-year warranty (»-EX«) for very versatile product offering. if you are interested on more information, please get in touch with your coDico contact or ivan Mitic.

Ivan Mitic | ivan.mitic@codico.com +43 1 86 305-194 | www.codico.com www.international.electronica-azi.ro

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EMBEDDED SYSTEMS

Any Way You Want It

SCh322x Super I/O Product family feature-rich and flexible family of next-generation i/o controllers is customized for industrial and Embedded computing Designs Did you know that the machines you use on a regular basis have the full processing power of today’s most advanced computers? these machines are actually industrial and embedded computing applications packaged in non-standard computing form factors. rather than being constrained to a laptop or tablet, one example of an application is the point-of-sale terminal at your neighborhood grocery store. or it is the information kiosk you use at the airport to check-in for an upcoming flight, change your seats or print your boarding pass. it is even the multifunction printer in your office that prints, scans, handles faxes and more. other embedded and industrial computing applications include gaming consoles, thin clients, set-top boxes, factory automation, ruggedized Pcs and single-board computers.

Embedded and industrial computing applications are becoming smaller while offering more features with each new introduction.

However, they still need to support legacy input/output (i/o) such as parallel ports 14

and even, in some cases, floppy Disk controllers (fDcs). these needs are addressed by super i/o controllers on the motherboard. a super i/o controller is a type of semiconductor chip, first used in

personal computer motherboards, that combines interfaces for a variety legacy i/o functions. these functions include a parallel port (commonly used for printers), serial port uarts, keyboard controller and Ps/2

Figure 1

Electronica Azi international | 5/2017

CONTEST

ports for keyboard or mouse interfaces. in addition to these functions, super i/o controllers may also include some low-speed devices such as temperature, voltage and fan speed sensors, automatic fan speed control, infrared port controllers, watchdog timer and general Purpose input/output (gPio) pins. today’s super i/o devices use the low Pin count (lPc) bus for communication with the central processing unit. combining many functions in a single chip reduces the number of parts needed on a motherboard, thus reducing the cost of production.

Microchip has introduced a family of feature-rich and flexible super i/o controllers, the scH322X family, customized to address the challenge of providing advanced functionality while meeting the space and cost constraints specific to your design. Each product in the family contains a different feature set, combining serial ports, parallel port, and Ps/2 with flexible gPio capability and world-class temperature and voltage monitoring to assist with developing more cost-effective industrial applications.

Designed to operate with the x86 architecture, the scH322X family includes six devices tailored for different applications: the scH3221, scH3222, scH3223, scH3224, scH3226 and scH3227. some of the choices they offer include a varying number of serial ports, combined with hardware monitoring, and with and without keyboard controller functionality. the scH3227 is the most full-featured device in the family. it is a 3.3V super i/o controller with an lPc interface that operates from 19MHz to 33MHz to support legacy and the current x86-based architecture. the scH3227 includes a keyboard controller, hardware monitoring capabilities, power control logic and motherboard glue logic. the device also provides a parallel port, four full serial ports and the option for two additional 4-pin serial ports. the serial ports are fully functional ns16550compatible uarts that support data rates up to 1.5 Mbps. this device also offers hardware monitoring capability to track temperature, voltage and fan speed. this feature also provides programmable, automatic fan control. three fan tachometer inputs and three pulse-width modulator (PWM) fan control outputs are available. it has the ability to alert the system to out-of limit conditions and automatically control the speed of multiple fans in response. as illustrated in figure 1, the fans are used to monitor and control the temperature of the host processor, power supply and memory of the system. additional system related functionality is available via the 40 gPio control functions available with the scH3227. these gPios can serve as additional i/o ports, interrupt steering inputs, power lED outputs and even infrared pins. this next-generation family features smaller packages than previous super i/o devices. the scH3227 is available in a 144-Wfbga (9 × 9 mm) package and in commercial and industrial operating temperature versions.

Devices in this family are also offered in area-efficient bga packages to further enable the most compact board designs. combining both legacy and advanced i/o functions in a single chip, these i/o controllers reduce the overall number of devices required to implement your design cost effectively. www.international.electronica-azi.ro

Win a MicrocHiP MPlab® icD 4 in-circuit DEbuggEr!

Win a Microchip MPlAB ICD 4 In-Circuit Debugger (DV164045) from Electronica Azi International. the new MPlab icD 4 introduces a faster processor and increased raM to deliver up to twice the speed of icD 3 for the in-circuit debugging of Pic® microcontrollers and dsPic® digital signal controllers. the MPlab icD 4 also introduces a wider target voltage range and an optional 1a of power via an external power supply. for maximum flexibility, MPlab icD 4 features a selectable pull-up/ pull-down option to the target interface and programmable adjustment of debugging speed for greater productivity the MPlab icD 4’s significant improvement in speed is accomplished through a 32-bit Mcu running at 300MHz. faster processing, together with an increased buffer memory of 2Mb, results in a product that is up to twice as fast as its predecessor.

Microchip’s MPlab icD 4 is easy to use and supports many Pic microcontrollers and dsPic digital signal controllers in Microchip’s portfolio through the MPlab X integrated Development Environment (iDE). this simplifies the design process for customers when they choose to migrate from one Pic Mcu to another to meet the needs of their application the MPlab icD 4 connects to the Pc using a high-speed usb 2.0 interface and is connected to the target with a debugging connector which is also compatible with the MPlab icD 3 or MPlab rEal icE™ in-circuit Emulator systems. the MPlab icD 4 also works with Jtag interfaces. faster and more flexible real-time in-circuit debugging: • supports many Pic microcontrollers and dsPic Dscs • x2 faster than icD 3 • reduced wait time improves debugging productivity • simplifies migration between Pic Mcus

for your chance to win a Microchip MPlab icD 4 in-circuit Debugger, visit:

www.microchip-comps.com/eaziint-icd4 and enter your details in the online entry form.

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EMBEDDED SYSTEMS SCh3227 - Block Diagram Many times, after completing a project, a designer needs to go back and redesign a board because a key device has been put on their supplier’s end-of-life list.

Microchip’s expertise in the development of products for the leading Pc oEMs enables them to provide outstanding solutions, like the scH322X family, with long product life cycles for your next embedded and industrial computing application. this helps you manage your innovation risk over the entire life of your product. With their wide range of features and small package sizes, the scH322X super i/o devices enable you to develop your embedded/industrial computing application almost any way you want it.

Visit the Desktop and super i/o page on the Microchip website to learn more.

Microchip Technology www.microchip.com

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Electronica Azi international | 5/2017

NEWS

Powerbox announces advanced marine power supply and platform for immersed computers Powerbox, one of Europe’s largest power supply companies and a leading force for four decades in optimizing power solutions for demanding applications, has announced the launch of its second generation of power supplies dedicated for Marine applications and demanding industrial systems. responding to a demand from Marine equipment manufacturers to simplify logistics and to reduce energy consumption, the Pt578 integrates programed digital protection, built-in redundancy and paralleling circuitry. based on latest technologies, the 500W Pt578 has a typical efficiency of 94% and can be operated between -25 to +70°c. it includes an active Pfc, three output protection modes firmware reconfigurable, is designed for convection cooling and is protected against humidity and corrosion with conformal coating and can withstand high shock and vibration levels. the technology developed for the Pt578 is suitable for immersed computing systems requiring the power unit to operate safely within neutral fluid containers and part of PrbX custom Power library.

ded applications have adopted immersed computers requiring compliant power supplies” said Martin fredmark, Powerbox’s VP Product Management. “The technology platform developed for the Marine PT578 employs the same components and design rules as immersed power supplies. Our Custom Power solution group has now qualified these supplies as part of the PRBX Technology platform, shortening time to

market for immersed embedded industrial computer and similar applications.” the requirements imposed on products responsible for shipping and offshore installations are greater than the average for industrial and office environments, requiring power designers to follow strict design rules and to select components and technology complying with international standards. the limits regarding mechanical

“Introduced in 2005, the concept of immersed data-centers emerged and since then a number of experiments became market reality. This technology requires specific caution when selecting switching power components and building practice very similar to that required by the Marine Industry.

Immersed data centers are becoming widespread and a number of industrial embed18

Electronica Azi international | 5/2017

POWER SUPPlIES

and climatic requirements are also more demanding than for typical industrial applications. Vibration levels up to 4g are common, as well as large temperature fluctuations from -25°c and + 70°c and high relative humidity where condensation cannot be excluded. the new product, Pt578 integrates the latest power technologies specific to the Marine industry offering a unique combination of electrical and mechanical performance. to guarantee the highest level of safety, marine power architectures and immersed computing designs often require redundant power sources. to ensure this, several power supplies are usually connected in parallel, linked to each other through external oring diodes modules. to simplify installa-

PRBX PT578 Marine Line 500W power supply

tion and utilization, the Pt578 has built-in circuitry making it possible for the user to select if the power unit will be used in “single Mode” or “Parallel mode with droop current sharing.” this also reduces the number of products to keep in inventory as well the space used in the power rack.

Depending on the application, the output protection may need a different type of configuration (switch off, Hiccup mode or constant current), which is one of the features included in the Pt578. based on firmware defined profiles and the output protection the mode of operation can be selected via a DiP switch with factory default settings though, in case of specific demand, it is possible to reconfigure any of the profiles at one of our PrbX configuration centers.

the unit also includes a Dc oK signal and a potential free relay contact for fault protection. a front lED indicates power unit status (oK or fault).

When constant current mode selected, the Pt578 behaves as a current generator and is suitable for high capacitive loads, driving Dc motors, and as well an ideal solution to charge a second level battery backup for critical equipment such as navigation systems.

Pt578 will operate with wide ac input voltages of 90 to 265Vac and with a Dc bus voltage of 125 to 375VDc. the input ac frequency is of 47-63Hz, and for naval airborne 440Hz with reduced Pfc. covering a large range of Marine applications, from sea to air, the Pt578 is specified to operate up to 10.000 feet and up to 30.000 feet in non-operating. two versions with adjustable output voltages are available in standard, 24VDc (23 to 29VDc) and 48VDc (47 – 56VDc) with an output power of 500W with peak power up to 750W during 10 seconds.

Designed to meet international Marine requirements, the Pt578 complies with vibration specified in the DnV-gl table 7 High vibration strain, class b, ±1.6mm displacement, 2-25Hz, 4g; 25-100Hz (1 octave/ min). Protected by a conformal coating the Pt578 works in a humid environment of up to 100%, condensing at all relevant temperatures and meets the iEc60947-2 2kV, 60s. the product has an isolation of 3000Vac input to output and 2000Vac input to chassis. using high density integration building practice, the Pt578 is housed in a 132 × 67 × 128 mm (excluding the Din-rail mounting device) cassette-box, which is one of the most compact 500W power supply in its category, saving critical space in the power shelf to fit more functions per rail. the Pt578 also meets and complies with related chapters of the En61000-3 and -4, EMc Emissions En60945 conducted & radiated, conducted lf iEc60533 3VrMs, 50Hz-12kHz, EMc Directive 2014/30/Eu and DnV-gl temperature class D, -25 – +55°c; Humidity class b, up to 100%, condensing; Vibration class b, ±1.6mm displacement, 2-25Hz, 4g; 25-100Hz; EMc class b, class guiDElinE, DnVgl-cg0339, Edition november 2015. Pending at date of publication.

Powerbox www.prbx.com

www.international.electronica-azi.ro

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NEWS The KAE-04471 image sensor by ON Semiconductor provides exceptional imaging performance, both in extreme low light applications and in direct sunlight. The new 4.4 Megapixel Interline Transfer EMCCD sensor features high dynamic range coupled with very low image noise and is available at the imaging expert, FRAMOS. Applications operating both in extreme darkness and in variable light conditions mostly benefit the Military and Defense, ITS, Surveillance, Scientific and Medical Imaging sectors.

The square 4/3” sensor features both Interline Transfer and Electron Multiplying, that combine these two successful imaging techniques to enable advanced ultra-low light applications that require extreme sensitivity at fast frame rates. The KAE-04471 sensor achieves a dynamic range of 72dB and a low readout noise of under 10rms in normal mode. A dynamic range of 92dB and a readout noise of under 1rms can be achieved using the Intra-Scene switchable gain feature. The improved pixel size of 7.4µm compared to the 5.5µm pixel size in the existing KAE-02150, results in a higher sensitivity and similar to daylight images produced in extreme low light.

The aforementioned features provide an outstanding image quality with excellent image uniformity and MTF, with very little image irregularity.

ON Semiconductor’s KAE-04471 Interline Transfer EMCCD Image Sensor for Excellent Picture Quality in Extreme Low Light Applications

Depending on the intensity of the incident light, pixel readout is routed through either the regular CCD output, or the electron multiplier. This mode of selection enables both focused and high contrast imaging in a variety of light applications, like direct sunlight, or low light night scenes.

Sibel Yorulmaz-Cokugur from FRAMOS highlights the unique qualities of KAE-04471, “ON Semiconductor is the only sensor producer

to offer Interline Transfer EMCCD technology and sensor sensitivity ranging from 0.002 lux in the sub-lux range to direct sunlight at 10,000 lux. With very good image quality, ON Semiconductors KAE-04471 provides an excellent low light performance where other sensors reach their limits. The sensor is specially designed for the use in varying light applications for surveillance in Military & Defense, Intelligent Traffic Systems, as well as in Scientific and Medical applications.”

BENEFITS FOR MILITARY AND DEFENSE, TRAFFIC SURVEILLANCE, MEDICAL IMAGING, AND SCIENCE Its day and night capability makes the KAE04471 from ON Semiconductor the best choice for 24/7 operations for outdoor surveillance, driver assistance systems, aviation, traffic and toll surveillance. The medical and scientific sectors also benefit from sharp images at low light levels. High contrast and low readout noise are features that also benefit microscopy, fluoroscopy, ophthalmology, and dermatology. The KAE-04471 sensor is available in both monochrome and Bayer color versions. The industry and product experts at FRAMOS apply their profound knowledge of sensors and systems to support customers integrating new sensors into their applications and projects, together with additional services like development support, customizations, and logistics.

FRAMOS | www.framos.com

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Electronica Azi International | 5/2017

EMBEDDED SYSTEMS

usb sMart Hub ics EnablE sMartPHonE-connEctED autoMotiVE infotainMEnt the devices enable multiple architectures to enable manufacturers to implement their design of choice to easily interface with all major smartphone operating systems. these systems allow the graphical user interface of the phone or tablet to be displayed on the vehicle’s screen and enable integration with voice commands inside the car, all while simultaneously charging the mobile devices. they also enable driver assistance applications on mobile handsets to be integrated with a vehicle’s infotainment system.

Microchip’s new smart hub ics enable cascading of the hubs to the second- and third-row seats with simultaneous data and charging in all ports. for example, if there are dual usb ports, one port can connect the phone or tablet to the head unit, leaving the other port free to charge and upload/download data. With Microchip’s new usb4914, usb4916, usb4925, and usb4927 smart hub ics, car manufacturers can customise solutions to meet their design needs. as the car becomes more of an entertainment environment, manufacturers can create solutions that allow consumers, for example, to use one phone for navigation and another for music or video.

Microchip’s new usb4715, usb4914, usb4916, usb4925 and usb4927 usb 2.0 smart hub ics provide unique usb configurations including single- and dual-bus implementations for optimal connection to infotainment systems. all devices operate with standard usb drivers present in most automotive head units for faster development, system validation and field updates. Each device also contains an integrated 32-bit microcontroller for advanced bridging, audio application support and usb Power Delivery (usb PD).

a demonstration application board and evaluation board are available for each of the new usb 2.0 smart hub ics. the demonstration application board emulates a system that a tier one supplier or original Equipment Manufacturer (oEM) would use in their application. Microchip also provides a usb Power Delivery application showing charging for the usb PD 3.0 specification. the usb4715, usb4914 and usb4925 are offered in a 48-pin Qfn package and the usb4916 and usb4927 in a 64-pin Qfn package. all devices are available today in volume production.

Microchip Technology | www.microchip.com/usB4914

sEggEr announcEs flasHEr atE HigH sPEED gang PrograMMing solution sEggEr announces the availability of flasher atE, a brand new modular gang programmer. it uses the same turbo-Mode and universal flash loaders proven in the flasher Pro and other members of the flasher family. flasher atE supports up to 10 completely individual parallel programming channels. Each channel has its own programming circuit and memory, allowing it to be used individually and programs at maximum speed on every channel. in mass production, the in-system programming process usually is tightly coupled with the testing facilities such as automatic test Equipment (atE) or similar devices. flasher atE comes with a ready to use uart communication channel, hand shake lines, usb and Ethernet interfaces. any of these can be used to control its operation. in addition to this, the built-in web and ftP servers allow updates and monitoring from the nearby production control office. support for programming of unique serial numbers and patch data is also included. flasher atE can program any on or off chip memory. all that is required is a flash loader, which is already available for most popular devices and can be created for all others. www.international.electronica-azi.ro

to access more information on the mass production programming flasher atE please go to: https://www.segger.com/products/production/flasher/models/gang-programmer-flasher-ate/ SEGGER | www.segger.com

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NEWS MicrosEMi announcEs aVailabilitY of its rtg4 HigH-sPEED, raDiation-tolErant fPga EnginEEring saMPlEs in a cEraMic QuaD flat PacKagE Microsemi corporation announced its rtg4™ high-speed signal processing radiation-tolerant field programmable gate array (fPga) engineering samples in a ceramic quad flat pack (cQfP) package are now available. the new cQ352 package, which conforms to the cQfP industry standard for space applications, features 352 pins to enable a more cost-effective integration than higher pin count packages and is the only cQfP package available for high-speed radiation-tolerant fPgas in its class. as an industry standard, the cQfP package is well-known for its ability to support a variety of space flight applications, primarily due to their lower costs of integration and well-understood assembly techniques, making cQfP easier to assemble onto the printed circuit board (Pcb) than ceramic column grid array (ccga) packages. as a result, cQfP is widely respected by space customers worldwide, including its meticulous package assembly, inspection and testing processes. the rtg4 fPga in a cQ352 package is ideally suited to control applications which do not require a high number of inputs/outputs (i/os), including satellites, space launch vehicles, planetary orbiters and landers and deep space probes, as well as others requiring frequent switching and a high number of temperature cycles, which can be challenging for ccga packages. according to Euroconsult’s report titled, “satellites to be built and launched by 2024,” 60 percent more satellites will be launched by 2024 versus

the past decade. this increase is driven primarily by civilian government agencies as established space countries replace and expand their in-orbit satellite systems and more countries acquire their first operational satellite systems.

Microsemi’s rtg4 fPga in the cQ352 package features 166 3.3V general purpose i/os, four embedded spaceWire clock and data recovery circuits and four high-speed serialization/deserialization (serDes) transceivers which can be used for either external physical coding sublayer (EPcs) or Peripheral component interconnect Express (Pcie) protocols.

Microsemi | www.microsemi.com

saMtEc introDucEs nEW Vita 57.4-coMPliant fMc+ looPbacK carDs samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the two new Vita 57.4-compliant fMc+ loopback cards. these new solutions provide fPga designers easy to use loopback options for testing low-speed and high-speed multi-gigabit transceivers on any fPga development board or fPga carrier card. samtec’s two new fMc+ loopback cards – the Vita 57.4 fMc+ HsPc loopback card and the Vita 57.4 fMc+ HsPc/HsPce loopback card– each come in Vita 57.4-compliant form factors. the new fMc+ loopback cards feature optimized si performance via samtec final inch® break-our region (bor) Pcb trace routing for the Vita 57.4 fMc+ connectors included in the cards. the Vita 57.4 fMc+ HsPc loopback card includes one HsPc Vita 57.4 fMc+ connector (samtec P/n asP-184330-01). it supports 24 high-speed multi-gigabit transeceivers operating at data rates up to 28 gbps per channel. the Vita 57.4 fMc+ HsPc/HsPce loopback card includes one HsPc Vita 57.4 fMc+ connector (samtec P/n asP-184330-01) and HsPce Vita 57.4 fMc+ connector (samtec P/n asP186900-01). it supports up to 32 high-speed multi-gigabit transeceivers operating at data rates up to 28 gbps per channel.

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“samtec’s new FMC+ loopback cards make FPGA evaluation and development much easier,” said Matt Burns, Product Marketing Manager at samtec, inc. “samtec’s tested and verified VITA 57.4compliant solutions offer peace-of-mind and ease-of-use via readily available reference designs and technical documentation.” for more information on the samtec’s Vita 57.4 fMc+ loopback cards, please download the Vita 57.4 fMc+ HsPc loopback card Product brief, the Vita 57.4 fMc+ HsPc/HsPce loopback card Product brief, visit www.samtec.com/kits Samtec | www.samtec.com Electronica Azi international | 5/2017

EMBEDDED SYSTEMS

rEnEsas ElEctronics EXPanDs 3D graPHics clustEr MarKEt to EntrY-class cars WitH r-car D3 sYstEM-on-cHiP renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced its high-performance r-car D3 automotive infotainment system system-on-chip (soc), designed to expand the use of 3D graphics instrument clusters (3D clusters) that support 3D graphics displays in entry-class cars. the r-car D3 achieves both high-performance graphic capabilities and contributes to significant reduction in overall system development cost. the new soc includes a high-performance 3D graphics core that enables a high-quality 3D display and lower system costs equivalent to the bill of materials (boM) costs of developing with 2D graphics instrument clusters (2D clusters). by adopting the r-car D3, system developers can re-use their 3D graphics development assets, including software and graphics designs from high-end vehicles that adopt high-performance rcar H3 or r-car M3 socs to entry-level cars. this scalability enables development of easy-to-use and high visibility entry cluster 3D graphics at approximately the same level cost as the existing 2D clusters. in addition, renesas collaborates with industryleading partners in the instrument cluster field to further reduce development steps and costs. the increasing number of connections between the instrument cluster and the various sensors and control devices allows more information about the vehicle and its surroundings to be captured and displayed on the instrument cluster. However, this increases the need for improved visibility from a safety point of view. currently, entry-class vehicles feature mostly 7- to 10-inch liquid crystal displays (lcDs) that support mainly 2D graphics. in the

future, advancements in automotive lcDs size, resolution, and prices will support an anticipated explosive demand in 3D clusters to meet the growing need for clearer and highly visible designs on a large screen, particularly in the chinese market. in the meantime, system developers working with automotive instrument clusters must manage an increasing number of development steps and costs, as 3D clusters for entry-class cars are required to meet both the strict cost and high-performance as existing 2D clusters but with 3D graphics drawing requirements.

Renesas Electronics Europe | www.renesas.com

rutroniK PrEsEnts sEnsor MlX75023 anD cHiP MlX75123 MlX75023 time-of-flight (tof) sensor together with MlX75123 companion chip provides a complete tof solution. the MlX75023 supports up to QVga resolution with unpaired sunlight rejection. the chipset offers performance, flexibility, simplifies the design and allows a very compact 3D camera. the MlX75123 tof companion chip and the MlX75023 tof optical sensor array chipset, has been designed to facilitate the design and minimize component count of a tof camera aiming for sunlight robustness and operation over a broad temperature range.the sensor features 320 × 240 (QVga) pixels based on Depthsense® technology. this unique design allows up to 120 klux background light rejection in typical application conditions. the tof chipset provides integrated light source control and thanks to its high-speed output, which enables a peak rate of 600 raw frames per second, it can be used to track for fast moving objects. features include up to 40MHz modulation frequency, 12-bit parallel camera interface up to 80Mpix/s, up to 120 klux background light robustness and extended diagnostics.

features like region-of-interest, configurable timings, statistics & diagnostics, and programmable modulation. operating temperature ranges between -20°c and +85°c and -40°c and +105°c. the tof sensor is available in a small glass bga form factor while the tof companion chip comes in a compact 7 × 7mm² ElP package.

Rutronik Elektronische Bauelemente | www.rutronik.com

the MlX75123 controls the MlX75023 tof sensor, the illumination unit and streams data to the host processor. its built-in high speed aDcs convert the analog sensor data and support system www.international.electronica-azi.ro

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NEWS on sEMiconDuctor introDucEs WorlD’s first HigHlY scalablE faMilY of nEXt-gEnEration autoMotiVE iMagE sEnsors on semiconductor announced a cMos image sensor platform that brings new levels of performance and image quality to automotive applications such as aDas, mirror replacement, rear and surround view systems and autonomous driving. the HayabusatM platform features a ground-breaking 3.0-micron backside illuminated pixel design that delivers a charge capacity of 100,000 electrons, the highest in the industry, with other key automotive features such as simultaneous on-chip high dynamic range (HDr) with lED flicker mitigation (lfM), plus real-time functional safety and automotive grade qualification. the high charge capacity of this pixel design enables every device in the Hayabusa family to deliver super-Exposure capability, which results in 120-decibel (db) HDr images with lfM for high image fidelity in the most challenging scenes without sacrificing low-light sensitivity. the simultaneous HDr and lfM capability is especially important in enhancing safety as it ensures that all objects and potential hazards can be identified in both very dark and very bright areas of the scene. With the widespread use of lEDs for front and rear lighting as well as traffic signs, the lfM capability of the platform makes certain that pulsed light sources do not appear to flicker, which can lead to driver distraction or, in the case of front facing aDas, the misinterpretation of a scene by machine vision algorithms. the Hayabusa product family also features real-time, iso26262compliant functional safety capabilities to alert the system processor if the sensor has any issues or potential errors. these features enable system designs rated up to asil-c. the real-time capabili-

ty enables errors to be identified immediately rather than waiting for the full image to be transferred to the processor and then waiting for image analysis. this faster response time means the system processor can take immediate action to remedy the issue, which is crucial when considering that a vehicle moving on a freeway easily covers 100 feet in less than one second.

ON Semiconductor | www.onsemi.com

nEW 2.3MP cMos Digital iMagE sEnsor froM on sEMiconDuctor on semiconductor, driving energy efficient innovations, has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) cMos digital image sensor with an active-pixel array of 1936H × 1188V. the ar0239 produces extraordinarily clear and sharp digital images in challenging bright and low light conditions. this, along with its ability to capture continuous video and single frames, makes it an ideal choice for many applications including security and surveillance systems, body cameras and vehicle DVrs (dash cameras).

Key attributes of the ar0239 include superior low-light performance, robust near infrared (nir) quantum efficiency (QE) and the capability to capture high dynamic range scenes. the highly sensitive 3-micrometer (μm) × 3 μm backside illuminated (bsi) pixels with improved nir process, that include on semiconductor’s Dr-Pix™ technology, give a 21 percent improvement in responsivity and a 10 percent improvement in QE versus the device’s predecessor. the sensor features a variety of sophisticated camera functions such as in-pixel binning and windowing, and it has an on-chip analog to digital converter (aDc) that supports both 10-bit and 12-bit architectures. When operating in linear mode with a serial interface, the device offers fully HisPi/MiPi compatible HD support up to 1080p at 90fps thereby delivering excellent video performance. two- or three-exposure 1080p HDr output is available at up to 30fps. the ar0239 is optimised for ease of design-in with multi-camera synchronisation capability simplifying more sophisticated installations. being housed in an ibga package enhances the robustness 24

and reliability of the new image sensor in terms of thermal and humidity resilience and performance. the device has an operating temperature range, aligned with industrial application specifications, of -30°c to +85°c.

ON Semiconductor | www.onsemi.com

Electronica Azi international | 5/2017

EMBEDDED SYSTEMS

rEnEsas, toYota, anD DEnso bring autonoMous-DriVing VEHiclEs to MarKEt fastEr renesas Electronics announced that its automotive technologies will drive toyota Motor corporation’s autonomous vehicles, which are presently under development and scheduled for commercial launch in 2020. selected by toyota and Denso corporation, renesas’ autonomous-driving vehicle solution for toyota’s autonomous vehicles combines the r-car system-on-chip (soc), which serves as an electronic brain for in-vehicle infotainment and advanced driver-assistance systems (aDas), and the rH850 microcontroller (Mcu) for automotive control. this combination delivers a comprehensive semiconductor solution that covers peripheral recognition, driving judgements, and body control. as the leading global supplier of automotive processors (Mcus and socs), renesas offers highly-advanced technologies for use in increasingly critical areas for autonomous driving, such as security technology to protect against cyberattacks and functional safety technology to predict system failures. Production-ready autonomous-driving vehicles will require these capabilities as well as the expertise to match these technologies to actual use cases. renesas has been committed to providing the perfect balance between advanced technologies and traditional automotive requirements, including performance and power consumption, optimal installation of electronic systems and considerations to the space available, and to implementing measures to protect

against heat and environmental conditions. recognizing the depth of advanced automotive development technology and expertise that renesas has demonstrated over the years, toyota selected renesas as the key semiconductor supplier for its “Highway teammate”, an autonomous-driving prototype car designed to merge, pass, change lanes, and perform other actions during highway driving, under supervision.

Renesas Electronics Europe | www.renesas.com

congatEc brings gErMan inDustrY 4.0 EXPErtisE to cHina the taiwan located subsidiary of congatec - a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services - is presenting smart manufacturing it platforms for 'Made in china 2025' (Mic 2025) solutions at ciif, china international industry fair (Hall 6.1H, booth a065) in shanghai. these instantly deployable computing platforms enable chinese machine building and manufacturing systems engineers to develop smart, connected manufacturing equipment as well as robotics and intra-logistics devices with situational awareness for collaborative manufacturing. the new congatec Mic 2025 platforms are based on embedded motherboards and single board computers as well as computer/server-on-Modules, leveraging open standards that are freely accessible all over the world. With congatec acting as a fabless platform vendor, they can facilitate any logistical requirements for chinese customers wishing to export their Mic 2025 manufacturing solutions globally. the showcased congatec Mic 2025 computer platforms feature all required interface functionalities and software support for smart connected manufacturing systems - including iiot based machine control and monitoring as well as maintenance clouds. one of the various Mic 2025 demonstrations at ciif includes a presentation featuring virtualized coM Express type 7 computer-on-Modules based on the new intel atom c3000 platform (code name Denverton) and focusing on the real-time capabilities of virtualized industrial server platforms. the installation is tailored for industrial and carrier-grade cloud, edge and fog www.international.electronica-azi.ro

servers as well as smart real-time controls, robotics and manufacturing cells that need a virtualized environment to cater for various tasks in parallel. Examples are deterministic, hard real-time machine control; iiot and cloud connectivity; and horizontal realtime communication in industry 4.0 environments. additional presentations include multifunctional gateway technologies for smart sensor networks which offer all the fundamental gateway logic off-the-shelf and based on open standard initiatives. congatec AG | www.congatec.de

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NEWS intErsil’s nEW raDiation-tolErant Plastic ics to PoWEr sMall satEllitE MEga-constEllations intersil, a subsidiary of renesas Electronics corporation (tsE: 6723), today announced the first three members of its new family of radiation-tolerant plastic-package ics designed to support the emerging field of small satellites that will provide solutions such as high-speed internet connections to hundreds of millions of users in communities, governments, and businesses worldwide. fleets of hundreds of small satellites will create mega-constellation networks to deliver broadband internet links from low Earth orbit (lEo) to every corner of the globe, including rural areas without wireless connectivity access. intersil’s rad-tolerant plastic parts include the isl71026M 3.3V controller area network (can) transceiver, isl71444M 40V quad precision rail-to-rail input and output (rrio) op amp, and the isl71001M 6a point-of-load (Pol) voltage regulator. these ics deliver rad-tolerance performance at a much lower cost point versus radiation assurance tested class V (space level) products. all three isl71xxxM devices go through characterization testing, which includes total ionizing doze (tiD) up to 30krads (si) for single event effects (sEE). sEE take into account single event burnout (sEb), single event latch-up (sEl), single event transients (sEts) and single event functional interrupts (sEfis) at a linear energy transfer (lEt) of 43MeV•cm2/mg. intersil’s rad-tolerant plastic packaging flow leverages the company’s more than 50 years of spaceflight experience developing rad hard (>75krad) and rad-tolerant (<75krad) products for extremely harsh environments. the upfront radiation effects characterization and aEc-Q100 automotive-like qualification gives customers

the utmost confidence to design intersil radiation-tolerant plastic parts into cost-sensitive small satellites for lEo mission profiles up to five-years. the isl71xxxM are also well suited for high altitude (>40km) avionic systems, launch vehicles that are prone to heavy ions, and medical equipment where radiation is a concern. the isl71026M radiation-tolerant 3.3V can transceiver provides serial data transmission at speeds up to 1Mbps. up to 120 transceivers can be connected to a single can bus to reduce cabling/harness size, weight and power (sWaP) costs for satellite command and telemetry systems.

Intersil | www.intersil.com

Vicor EXtEnDs 48V cool-PoWEr ZVs bucK rEgulators faMilY Vicor has extended the cool-Power 48V ZVs 20a buck regulator portfolio by releasing the Pi3523-00-lgiZ (Pi3523). the Pi352x family offers 20a solutions complementing the previously released 10a 48Vin Pi354x family, enabling scalable power options for 48V direct to point-of-load (Pol) applications. the Pi3523 is a 48Vin, 3.3Vout nominal buck regulator capable of supplying up to 22a. this family of regulators enables 48Vin to 20a point-of-load voltages spanning 2.2Vout – 14Vout. offering all the same industry leading features of Vicor’s existing 48V cool-Power ZVs buck regulators, the Pi352x portfolio extends performance by delivering twice the power of the Pi354x regulators using only a 40% larger package. the Pi3523 requires only an output inductor and minimal passives for a complete cost effective design that consumes less than 740 mm2 of Pcb space. Designed to Part Number Package Input Nominal Current Voltage Output Range Voltage PI3523-00-lGIZ* 10×14 mm 30 – 60V 3.3V 22A PI3525-00-lGIZ 10×14 mm 30 – 60V 5.0V 20A PI3526-00-lGIZ* 10×14 mm 30 – 60V 12V 18A Pi3542-00-lgiZ 10×10 mm 36 – 60V 2.5V 10a Pi3543-00-lgiZ 10×10 mm 36 – 60V 3.3V 10a Pi3545-00-lgiZ 10×10 mm 36 – 60V 5.0V 10a Pi3546-00-lgiZ 10×10 mm 36 – 60V 12V 9a Table 1: items in green are newly released products 26

be easily paralleled in combinations of up to three regulators, the Pi352x regulators can be scaled to support higher current loads. the Pi352x family addresses the growing need for 48V direct-toPol solutions in many applications including lighting, communications, automotive equipment, and datacenter applications. the cool-Power ZVs regulators are focused on high power density and high efficiency while delivering ease of use. the end result is first pass design success with best-in-class performance.

Vicor Corporation | www.vicorpower.com

Electronica Azi international | 5/2017

POWER MODUlES

WürtH ElEKtroniK suPPliEs WirElEss PoWEr coil for sEMtEcH’s linKcHargE® lP Multi-DEVicE WirElEss cHarging solution Würth Elektronik eisos, announced its collaboration with semtech corporation by integrating its transmission coil, WEWPcc, with semtech’s linkcharge® lP (low power) platform, an innovative wireless charging solution that concurrently charges multiple, low-power devices using a single transmitter. the WE-WPcc series transmission coil excels with its niZn ferrite shielding to protect sensitive electronics and concentrate the magnetic field. the coil is specially designed for resonant inductive coupling and allows several receivers to be used at the same time. semtech’s linkcharge lP (tsWitX-5V-2rX-EVM), featuring Würth’s transmission coil, provides positioning and spatial freedom that allows for charging of multiple devices. the platform delivers one-watt of output power to charging devices and specifically targets low-power applications including hearing aids, activity trackers, smart headphones, smart jewelry and clothing, low power industrial, portable medical equipment, and lED fixtures.

“The semtech linkCharge lP wireless charger represents exemplary use of our high-grade coils and we are pleased about this important reference,” explains Jörg hantschel, business Development Manager Wireless Power at Würth Elektronik eisos. “The coil used in linkCharge lP is also suitable beyond the Qi standards, which primarily focus on consumer electronics.” “semtech's linkCharge lP platform was designed to enhance the over-

all user experience by allowing people to charge multiple devices at once without the hassle of cables," said Ruwanga Dassanayake, Power Management Product line Manager for semtech's Power and High-reliability Products group. “Würth Elektronik's WE-WPCC transmission coil is a key component of linkCharge lP and makes it possible for our solution to give our customers a unique experience.” the windings of the WE-WPcc coil consist of high frequency stranded wire with high permeability shielding. the coil also scores a far lower resistance and higher Q factor than all those comparable products previously on the market.

Semtech | www.semtech.com Würth Elektronik eiSos Gmbh & Co. KG | www.we-online.com

Vicor introDucEs nEW 700V K of 1/16 bus conVErtEr Vicor has added a new fixed-ratio high-voltage bus converter to its bus converter module (bcM) lineup. the new 700V K of 1/16 bcM offers a power level of 1.75 kW and a peak efficiency of 97%, with a power density of 700W/in³. the device is available in the thermally adept 4414 (111mm × 36mm × 9.3mm) Via package, with either a chassis-mount or board-mount option and 4.3 kV of galvanic isolation. the robust Via package also provides integrated PMbus™ communication, EMi filtering, and voltage transient protection. these flexible modules can be easily paralleled into higher power arrays. in addition, the bcM outputs can be connected in series for higher output voltages. bcMs are ideal power components for a broad range of applications such as tethered unmanned vehicles, power distribution systems, and 3-Phase front ends. bcM’s can also be used as isolated unregulated front ends, which can then feed a multiplicity of Vicor’s ZVs Pol buck and buck-boost regulators or PrMs and VtMs in a factorized power architecture. the new higher voltage bcMs are available in either “t-grade” (-40°c to 100°c) or “cgrade” (-20°c to 100°c) temperature grades. a Mil-grade rating (55°c to 100°c) is scheduled for release by the end of 2017.

Providing Dc-Dc conversion after ac rectification and Pfc, the 700V bcM provides a small, efficient, power component for power system designers to develop very compact and cost-effective 3-Phase systems with an sElV output. the 400V – 700V input capable device addresses nominal 380VrMs and 400VrMs input Part Number bcM4414xg0f4440yzz

VIN 400V – 700V

www.international.electronica-azi.ro

VOUT 25V – 43.75V

ac-Dc conversion needs, commonly found in industrial applications. the 1:16 transformation ratio and bidirectional operation makes the uHV bcM an ideal solution for remote unmanned vehicles used in air, sea, or underground exploration. bidirectional operation enables systems to step up then step down line voltage to take advantage of reduced i2r losses, which dramatically improves power distribution cable size, weight, and costs with significant system efficiency improvements.

Vicor Corporation | www.vicorpower.com

IOUT Continuous 40a

Peak Efficiency 97%

Release Status released 27

PRODUCT NEWS

EFFICIENTly POWERING sENsORs IN IoT With the arrival of industry 4.0, cyberphysical systems, the internet of things and cloud computing have found their way into modern factories. operating as integrated communication networks, cyberphysical systems take decisions and act, while communicating in real-time with other systems as well as with humans. one of the main reasons for the rapid technological progress over the last few years is the drop in price of sensors of all types. only ten years ago, sensor technology was the preserve of highly specialised applications. today, sensors are a mass product. this development has made it possible to integrate more and more devices into networks where they combine, process and exchange ever larger volumes of data.

However, every single sensor in such a network must be supplied with power â&#x20AC;&#x201C; be it through a central power supply, battery or energy harvesting devices.

figure 1: The R-78S boost switching regulator prolongs not only the service life of batteries in IoT applications but squeezes the last bit of power out of the cells.

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Without sensors, there would be no internet of things (iot). they measure and record temperature, brightness, movement and many other parameters and transfer the data to the smart control devices. sensors however need power. although their power consumption is generally very low, they cannot work without it. Making sure that battery-operated sensors keep running for many years without any maintenance is quite a difficult task. this article describes how the service life of batteries can be significantly extended.

The myth of the 3V coin battery Many iot and industry 4.0 applications run with 3V coin batteries, which are not only cheap but also very reliable. such batteries need however to be changed quite frequently. a fully charged cr2032 coin battery supplies approximately 3.2V. after only a few operating hours, the voltage drops however to below 3V, which might not be sufficient for certain wireless modules

(Wlan, bluetooth, loraWan, etc.). as a result, transmission can become unreliable or the signalling range might suddenly be limited.

Extending the service life of batteries by using switching regulators the r-78s boost switching regulator from rEcoM (figure 1) has been specially developed for battery-powered iot devices.

Electronica Azi international | 5/2017

COMPANIES

the plug&play module provides a stable output of 3.3V from input voltages of as little as 0.65VDc to 3.15VDc, squeezing the last bit of energy from the battery cell. the r-78s thus enables users to run microprocessors, Wlan/bluetooth modules and iot systems with a single 1.5V battery or cell, which has a much longer service life

the capacitor charge drops below a certain limit, the circuit is briefly activated for recharging. this technology guarantees reliable, maintenance-free operation for periods of 10 years and more. as converters are affordable, the extra investment pays for itself in no time thanks to much lower battery and maintenance costs.

vise the machines and notify incoming interferences automatically to each other. they make use of predictive analytic models to trigger a corrective action. turning away from wires and batteries, these sensors could be supplied by micro generators (MEMs), which harvest energy of up to 4ma through environmental conditions, such as vibrations, heat, light, or temperature differences. this concept is called Energy scavenging or Energy Harvesting.

figure 3: In combination with an energy harvesting device the R-78S boost switching regulator provides a stable voltage to a sensor application. an r-78s from rEcoM is ideal to support the MEMs in providing a stable output voltage to the sensor application.

figure 2: TBy integrating a buffer capacitor into the circuit, the R-78S can be set to sleep mode, saving valuable battery power. than a conventional coin battery. figure 2 shows a typical application of the r78s in a wireless module. the circuit is only activated for brief periods to send data.

During these short times, the entire circuit consumes around 600µW. When not sending data, the circuit is in sleep mode. During these times, the r-78s is powered by a buffer capacitor and consumes only 7µa. if

Condition based maintenance condition-based maintenance is a system, which aims to provide information about a machines’ condition to conduct maintenance only if actually needed and falls in the category of predictive maintenance. to achieve this, typically many sensors are needed to communicate different types of signals. in future systems, intelligent sensors will super-

RECOM SWITChING REGUlATOR, 0.65 → 3.15V DC INPUT, 3.3V DC OUTPUT, 100MA the r-78s is a Dc-Dc boost converter designed to run from single cell batteries. the input voltage range of 0.65V-3.15V means that alkaline, nicd, niMH, zinc-carbon or lithium chemistry cells can be used to generate a stable 3.3 V output to power microprocessors, Wlan/bluetooth modules and iot systems. the high efficiency and low standby consumption can be used to extend battery lifetimes until the “last gasp” to get the maximum available energy out of the cell. the wide operating temperature of 40°c to +100°c, short circuit protection, otP, class a EMc and 3-year warranty round off this high performance converter. www.international.electronica-azi.ro

Conclusion as the internet of things is really an internet of sensors, it depends on innovative power supply solutions. rEcoM offers intelligent components that help safe battery power with the r-78s boost switching regulator. these regulators squeeze the last bit of energy out of the battery, so that applications can be run for more than a decade without problems and no need for servicing.

Aurocon Compec www.compec.ro

features and Benefits: • • • • • • • •

SIP4 Single Output 0.1 A Boost Converter Efficiency 93% Continuous short circuit protection Input range down to 0.65 V 3-year warranty

Rs stock No: 139-2824 Brand: recom Mfr. Part. No.: r-78s3.3-0.1 29

SMT Productronica 2017: asM leads the way to the smart sMt factory

Many new solutions and eight integrated workflows under the motto “check-in to the smart factory”, technology leader asM assembly systems will present innovative solutions for all areas of modern electronics production at the 2017 Productronica trade show.

With the company’s “Quick factory check”, visitors can compare the processes in their own plants with those in award-winning smart factories and identify the workflows that will have the greatest potential impact on costs, efficiency and quality. new products being rolled out include improved siPlacE tX high-speed placement modules and siPlacE placement heads, a new JEDEc tray feeder, and innovations like the asM Production Planner, offline Printer Programming, onboard Pcb inspection, touchless Placement, or siPlacE command center. With the HErMEs and aDaMos initiatives, asM also underscores its trailblazing role in open data integration and the industrial internet of things (iiot). asM will also show for the first time a complete solution chain for advanced packaging that enables electronics manufacturers to enter an attractive growth market. as a supplement to its booth at the Munich trade fair centre, asM will show off additional process innovations in the sMt center of competence at its Munich headquarters.

“standalone solutions for machines and lines, setup preparation areas, warehousing and other central operations in electronics plant block the way to the smart sMT factory.

That’s why we decided to focus on eight core processes in electronics manufacturing at this year’s Productronica: four line workflows – planning, virtual production, process optimization, and production – and four factory workflows – material management, preparation, factory monitoring, and factory integration,” explains Gabriela Reckewerth, senior Director global Marketing.

Gabriela Reckewerth, senior Director global Marketing: “Productronica visitors can learn more about our broad spectrum of networked and integrated solutions that enable them to improve their processes and KPIs” “Productronica visitors can run our “Quick Factory Check” to analyze the status of process integration in their own plants before taking guided tours and visiting expert stations to learn more about our broad spectrum of networked and integrated solutions that enable them to improve their processes and KPIs.”

www.asm-smt.com 30

Electronica Azi international | 5/2017

SMART SMT FACTORY

MORE flEXIBlE SIPlACE TX AND PlACEMENT hEADS Even the smartest factory needs powerful equipment. that’s why the asM booth will feature two sMt lines: one with siPlacE tX placement modules for high-volume applications like mobile phones, computers or lEDs, and one with siPlacE sX placement modules for high-mix applications with small lot sizes and frequent product changeovers. fIRST-hAND INfORMATION: Customers demonstrate optimized core processes smart, consistently optimized and heavily automated workflows provide the greatest efficiency benefits in modern electronics production. that’s why technology leader asM provides visitors of its booth with a process-oriented look at its extensive portfolio of solutions and its many innovations. in eight core processes, asM will demonstrate how the right combination of hardware of software can automate and improve processes. the focus will be on four line workflows (planning, virtual production, process optimization, and production run) and four factory workflows (material management, preparation, factory monitoring, and factory integration). as for another feature making it special, asM’s rolled out its “sMt smart network” last year, a global group of reference plants that work closely with asM’s experts to improve production processes and implement the smart sMt factory. reference of these smart reference plants will be present at the asM booth to convey first-hand information about their workflow solutions and their impact on their respective KPis.

AsM has rolled out its “sMT smart Network” last year, a global group of reference plants that work closely with AsM's experts to improve production processes and implement the smart sMT factory.

INNOVATIONS fOR All PROCESSES for all eight workflows, asM will present innovations that make users’ processes more effective and efficient. two examples from workflow planning are the asM Production Planner and offline Printer Programming. With the asM Production Planner, users can import jobs from their ErP and MEs systems so that the setups can be scheduled and optimized across multiple lines with sicluster Multiline. With offline Printer Programming, users can create printing programs offline and store them in a central database

irrespective of specific lines and configurations. this reduces nonproductive preparation time on the line as well as program selection errors. before the programs are downloaded to the printer, the system checks automatically whether the printer’s equipment and configuration are suitable for the respective job. among other innovations being shown at the asM booth are asM remote smart factory, a comprehensive and secure solution for remote support, touchless Placement, a new process for placing highly sensitive components with a force of 0 n, and onboard Pcb inspection, a feature that inspects Pcbs for cleanliness and makes sure that solder pads were printed properly and previously placed components placed correctly before large components, bgas and shields are placed.

OPEN AND READY fOR ThE fUTURE: Data integration with OIB, hERMES and ADAMOS With siPlacE oib as an open machine interface and HErMEs as an open and modern data standard and sMEMa successor for non-proprietary communication between line components, asM pursues a transparent data integration strategy on the shop floor. asM will also provide information about its participation in the aDaMos joint venture as well as its extensive activities in the iiot (industrial internet of things) field. aDaMos ag was founded in cooperation with other major technology companies like DMg Mori, software ag, Zeiss ag and Dürr ag to provide high-security cloud platforms and develop apps for industrial applications. the first results of these iiot activities will be demonstrated at Productronica in the form of mobile apps for monitoring asM machines.

ADVANCED PACKAGING: Complete solution chain for a new growth market at another station, asM will provide information about advanced packaging, i.e. the assembly of chips into subsystems with combinations of bare dies, flip-chips and classic sMt components. asM’s experts expect many EMs companies to expand into this lucrative growth market over the coming months and years as it displaces the semiconductor industry’s classic wire-bonding in many areas. asM will demonstrate solutions for the complete process chain at the Productronica, starting with extremely demanding printing and bumping processes with DEK printers and DEK E-form stencils. at the heart of this process chain will be the extremely precise siPlacE ca with its combined placement of bare dies and flipchips directly from the wafer and sMt components from classic tapes. the placement process is followed by molding, singulation, testing and taping. With its orcas, laser 1205 and sunbird machines, asM backend solutions provides powerful and complementary equipment for these processes that has proven itself in many installations in the semiconductor industry. for more information about the Productronica program and the in-house events at asM headquarters in Munich, visit us online at www.asm-smt.com/productronica2017.

Information about sIPlACE: www.siplace.com Information about DEK: www.dek.com Information about AsMPT: www.asmpacific.com

www.asm-smt.com www.international.electronica-azi.ro

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SMT

suitability of an enhanced low melting point alloy for a handheld device Current lead-free soldering temperatures can damage temperature sensitive components.

Moreover they can cause a shift in the properties of some components which can impact the functionality of sensitive electronic devices. An easy way to solve this problem is to use a soldering alloy with a lower melting point that allows for lower soldering temperatures. Currently however these alloys have limitations in shock and vibration resistance. This case study investigates the suitability of the new enhanced lMPA™-Q alloy for a handheld high accuracy measuring device from the company Megger Instruments ltd in the uK.

By: Steven Teliszewski, technical sales Manager, Interflux® Electronics N.V. it is a well-known fact that current lead-free soldering temperatures can damage temperature sensitive components and even Pcb board materials. nearly every electronic unit has some critical components on it. these can for example be: capacitors, bgas, lgas, fuses, displays, crystal oscillators, lEDs, displays, components with a plastic body, coils and transformers ...

Figure 1: Megger’s electronic unit of a high accuracy hand held measuring device

Damage by thermal stress after soldering can in most cases be determined by either visual, optical, X-ray, ict or functional testing. it is a less-known fact that current lead-free soldering temperatures can also cause a shift in the properties of some components which can impact the functionality of sensitive electronic circuits like e.g. measuring devices. these kind of failures are often harder to determine. an easy way to solve problems related to too high soldering temperatures is to use a soldering alloy that has a lower melting point. lower melting points allow for lower soldering temperatures. currently however these alloys have limitations in mechanical strength. shock and vibration resistance tend to be the weakest points. this limits the field of use of these alloys. the lMPa™-Q low melting point alloy has been specifically developed to overcome these limitations. this case study investigates the suitability of the lMPa™-Q alloy for a handheld high accuracy measuring device from the company Megger instruments ltd in the uK. this device is currently being soldered with an snag3cu0,5 alloy and is sensitive to the heat in the soldering processes. furthermore the device needs to be shock resistant in the field.

ASSEMBlY Of ThE ElECTRONIC UNIT the electronic unit consists of a double sided i-ag finished Pcb board with sMD and through hole components. the temperature sensitivity mainly lies in the different capacitors on the board that are all somehow affected by heat. the boards are printed with the DP 5600 lMPa™-Q solder paste with rol0 classification. the units are reflow soldered in a full convection oven without nitrogen and with a profile with a peak temperature below 205°c. this reflow profile will indulge the t°-sensitive components. the through hole components are being soldered with lMPa™-Q solder wire.

Figure 2: Reflow profile for LMPA™-Q 32

VIBRATION AND ShOCK RESISTANCE TESTING Handheld devices need to have good shock resistance in the field. in the past this particular property has proven to be the weak point of traditional low melting point alloys. Hence, the suitability of lMPa™-Q alloy for this device will be tested accordingly.

Electronica Azi international | 5/2017

SMT – INfO

the electronic unit is submitted to vibration and shock resistance testing according to the test standards described in bs En 60945 and bs En 60068. for objectivity purposes, the test are performed by a third party specialized testing lab. the Half sine shock test will perform shocks in both directions of all three axes. shocks will last 11ms with a peak acceleration of 30g or defined by practical limitations of the test setup. in this case, the shock in the X-axis was limited to 10g due to breaking off of the measuring sensor with higher peak accelerations. shocks in Y and Zaxis were at 30g. as a reference, 10g is equal to 4 times the shock a mobile phone experiences when dropping from 1 m on a concrete floor. the vibration test will start with a resonance frequency search on the electronic device in all 3 axes. the resonance frequency for a device is this frequency on which it experiences the highest forces. it is different for each single device and also for each axis. a 2H vibration endurance test with a peak acceleration of 3g will be performed on the found resonance frequency. if no resonance frequency is found, a standardized endurance frequency of 30Hz will be used with a peak acceleration of 3g. in this case, only for the X-axis a resonance frequency of 82.92Hz was found.

from these results can be concluded that the lMPa™-Q alloy has sufficient mechanical strength for handheld devices.

However, to get a better idea how the lMPa™-Q holds up against the snag3cu0,5 alloy, comparative vibration endurance tests were started up. comparative shock testing is more difficult due to the previously mentioned limitations of the test setup. shock and vibration resistance tend to go hand in hand as vibration actually is a Figure 5: SAC solder joint failure fast sequence of shocks.

SAC305 vs lMPA™-Q 30min X-axis vibration endurance Test sequence frequency Acceleration lMPA™-Q SAC 305 1 30Hz 18g Pass Pass 2 30Hz 20g Pass Pass 3 30Hz 21g Pass Pass 4 30Hz 22g Pass Pass 5 50Hz 25g Pass fail Table 1: sAC fails first in comparative vibration testing the same handheld high accuracy measuring device was chosen for this test. Electronic units soldered with snag3cu0,5 and lMPa™-Q were provided to the test lab as vibration in the X-axis is expected to be more critical, it was chosen as the only axis for this comparative test. a standard test frequency of 30Hz in combination with a peak acceleration of 18g was used as an initial setting for a 30min vibration endurance. after visual inspection, the acceleration or frequency was stepwise increased, until a first failure was noticed. the first failure manifested itself on an electronic unit soldered with the snag3cu0,5 alloy at a frequency of 50Hz and a peak acceleration of 25g.

Figure 3: Vibration & shock testing

RESUlTS AND CONClUSION as the lMPa™-Q alloy passes the required shock and vibration tests and the snag3cu0,5 alloy fails first in comparative vibration testing, the lMPa™-Q alloy is suitable for the production of Megger’s handheld high accuracy measuring device. the lMPa™-Q alloy allows for lower soldering temperatures in the soldering processes and temperature sensitive components are less affected by heat. this results in a more reliable production process and higher quality of the electronic device. based upon the good results, Megger instruments ltd has started the procedure to homologate the lMPa™-Q alloy for more processes and products.

More info?

▶▶▶ www.lmpa-q.com For more information, please contact:

Figure 4: Vibration & shock testing RESUlTS AND EXTENDED TESTING after shock and vibration resistance testing, the units soldered with the lMPa™-Q alloy were subject to visual inspection. none of the units showed signs of failures or misalignments. at Megger instruments ltd, the units were subject to ict and functional testing. all units passed. www.international.electronica-azi.ro

Eng. Ciprian Varga, Technical Director, Comet Electronics Tel.: +4 (0) 212 432 090 Fax: +4 (0) 212 434 090 office@comet.srl.ro www.comet.srl.ro 33

Rent Your SMT line not having to spend a lot of money upfront can help your business manage its cash flow more effectively. Whether you’re starting out or expanding, renting is the smart option for your business.

Staying Ahead of the Game We live in a time of constant changes where every day we have to adapt to our customers’ needs. Either because of the new technological challenges, a focus on roi “return on investment” or better productivity against new competition. the reasons can be many, and we believe we can help in providing the right solution.

Keeping up with the pace and always being a step ahead of your competitors is what we are all striving to. today you can rent almost everything starting from airplanes and properties to cars and machines. so, why not rent your next sMt equipment?

Advantages of Renting 1.

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it’s the right to use the equipment, and not the ownership, that creates revenue and profit for the company. rentals can be customized from 18 months, and to customer's needs: monthly, quarterly or annually. renting allows your company to “protect” your normal bank relationship. renting allows you to minimize your risk on big asset depreciation. renting does not affect a take away from the balance sheet as debt-financed assets; it has a positive effect on a number of key figures. cash flow; payments are allocated over the period during which the equipment is used and generates profit. (When you have bought the equipment your cash is locked away) renting strengthens the company’s competitiveness; use your cash where your returns are the greatest. (Production companies often choose to use their cash on new development, salaries or purchase of raw materials which equals the highest return on investment) flexibility – you are not “stuck” with your sMD-line. renting provides you the possibility to change your equipment depending on your customer's demands and market requirements!

What equipment fits your business best? to give you a choice in our rental concept, we have created two different product production lines. the first one is called the “PrEMiuM sMt concEPt” and the second one is called “EconoMic sMt concEPt”.

PREMIUM SMT CONCEPT it contains all the premium brands you know such as assembléon, DEK, Vitronics-soltec, and others. Everything to make you feel secure with the machines that will deliver your client's products. scalable from 9,000 to 165,000+ cPH.

ECONOMIC SMT CONCEPT Here we have selected the equipment that is of high quality and proven reliability and that gives you a competent and powerful alternative, that maintains a lower price image without compromising on quality and reliability, and with access to good service and support. scalable from 8,000 to 80,000+ cPH. lThD Corporation S.R.l. head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., lthd@lthd.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, fax: +40 256 490813

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Electronica Azi international | 5/2017

fINANCIAl SOlUTIONS fOR ElECTRONIC MANUfACTURING standard leasing solutions are restricted to any improvement / changes. the financial solution of SMThOUSE is tailored to the needs of electronic production environments and includes the following additional advantages. ￭ ￭ ￭ ￭ ￭ ￭ ￭

choose your manufacturing equipment based on today’s and future need from market leading suppliers. total sMt line solutions or single machines best competitive monthly rates based on contracts between 18-72 months fixed rates including service, maintenance and spares sMtH technology guarantee allows you to swap your installed equipment during the contract period additional options can be added into the running contract at any time flexible options after the end of the contract based on your needs

configure your sMt lines upon your demands from world known manufacturers like Kns/assembleon, Hanwa/samsung, Mirae, DEK, reprint, Vitronics soltec, MEK, tri and others. adapt it to your changing demands during the rental agreement and get your full flexibility regarding changing production demands.

PREMIUM lINE / 70 - 175.000 cph (IPC) renting instead of buying from 13.995,- Eur per month scalable output without the need to exchange machines COMPETITIVE lINE / 36.000 Bt/Std. (IPC) Highly flexible sMt Production line

renting instead of buying from

4.995,-

Eur per month

ENTRY lINE / 15.000 Bt/Std. (IPC) renting instead of buying from 2.495.- Eur per month complete sMt Production line for low volume and nPi

lThD Corporation S.R.l. head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., lthd@lthd.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, fax: +40 256 490813

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SEICA AUTOMATION was founded to fulfill customer needs of handling systems for the electronic production. the company can supply every kind of automation systems to complete production lines, from the easiest to the most elaborate ones. thanks to its engineering department, which uses themost advances tools for development and 3D design,sEica autoMation can offer high quality standards, fast conceiving times and a wide customization of the modules. the internal production department assures the possibility to put on trial every single machine in its entire working cycle; systems development and later upgrades can be also available.

People with more of 20 years of experience in board handling gives seica automation team the necessary know-how to find always the most efficient solution and to solve any production issue. sEica autoMation manufactures loaders, unloaders, conveyors, buffers, shuttles, and has a wide range of standard handling systems as well as an infinite number of other customized solutions. an experience of more than 20 years gives to sEica autoMation the necessary know-how to find the efficient solution for customer board handling,traceability and custom automated solution, we propose to our customer the complete realization of turnkey assembly system. sEica autoMation product portfolio include board Handling, traceability product like label applicators and laser marking, soldering line, press fit cell and many other custom products. the whole production flow is “MaDE in italY”, under the control of sEica autoMation r&D and quality dept, all European rules and laws are fully respected.

BOARD hANDlING create your Pcb line flow process with our proven, flexible and reliable handling system. seica automation is organized to design and manufacture our product lines and accessories to ensure the rapid response times needed to meet the demands of sMt manufacturers, providing solutions that are high performance, flexible and that have an optimum price/quality ratio. Each unit is equipped with its own control Plc and is fully sMEMa compliant. our two different product lines, flo and flex, have been designed to satisfy every customer requirement. flO SERIES® Has a great price/performance ratio, and is the ideal solution for standard lines handling small to medium size Pcbs. flEX SERIES® guarantees maximum performance for every handling requirement, thanks to its high level of flexibility and customization. We provide standardized solutions designed for your specific applications, such as traceability, testing, curing, cutting, and dispensing. High performance robots are equipped with specific tools to fulfill each application.

TRACEABIlITY the traceability system enables the user to locate boards requiring verification or modifications. it is therefore possible to track, for each assembled Pcb, every component used, as well as the operator responsible. seica automation has a wide range of both laser marking machines and labeling machines.

SOlDERING lINES soldering lines can solve every Pcb manufacturing cycle requirement involving manual assembly, by optimizing carrier logistics as well as handling of single boards. the information made available through barcode readers and pin codes, enables carriers to be sent to specific areas, as well as the automatic selection of soldering programs and the implementation of customized assembly cycles. this structure enables the operators to work either in-line (sequential assembly) or in work areas of varied complexity. We can implement your project, whether it be a simple or very complex soldering line. lThD Corporation S.R.l. head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., lthd@lthd.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, fax: +40 256 490813

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Electronica Azi international | 5/2017

SMT NEWS

MicrocarE EXPErt EDucatEs tHE ElEctronics inDustrY on oPtiMiZing bEncHtoP clEaning Removing contamination from printed circuit boards remains a huge reliability and warranty issue for PCB manufacturers. One of the cleaning experts from MicroCare Corp., the industry’s leading manufacturer of critical cleaning products, addressed that specific issue at the Texas Cleaning and Reliability Workshops in Austin and Dallas on Oct. 23rd and 25th, 2017. russell claybrook, regional sales manager for Microcare, stated that process control remains a major deficiency in the cleaning of Pcbs, whether it be on the benchtop or in an automated cleaning system. With more than 27 years of experience working in the industry, claybrook has expertise in both Pcb assembly and rework. He presented methods and tools for creating an effective ‘Process control Program’ for Pcb cleaning.

“Bench top cleaning still is performed with the same methods companies used 40 or 50 years ago,” he explained. “It’s ironic that manufacturers devote enormous amounts of energy and capital into process control at printing, placement and reflow, only to abandon that discipline at the bench − the final assembly area most circuit boards pass through before shipping to end users.”

method really is being called into question.”

“Any cleaning process should be defined with a specific quantity of cleaning materials for each cleaning task,” he added. “Furthermore, the process must stress the four steps for successful cleaning: wet, scrub, rinse and dry” cited in “to Kill a circuit board: Perils in Manual soldering and cleaning Process” by cheryl tulkoff. this paper was a major resource for claybrook’s presentation. originally Presented at sMtai 2014 in chicago, Ms. tulkoff wrote: “Manual soldering and cleaning processes are among the least controlled processes in printed circuit board assembly. as a result, they create special challenges to both quality and long term reliability. “if flux residues must be removed manually,

a four step process of wet, scrub, rinse, and dry is recommended. use some form of dispensing system for the solvent to control the flow and volume,” Ms. tulkoff concludes in her paper. the workshop gave Microcare the opportunity to push this message forward and to share its expertise on the best cleaning methods for the industry. for automated cleaning, Microcare recommends vapor degreasing processes using a modern, environmentallyprogressive low-boiling solvent. on the benchtop, the best method is a controlled dispensing systems such as the triggergrip™ system, which attaches onto an aerosol and delivers faster, better and safer cleaning, which costs less and cleans better than sloppy dip-and-brush cleaning.

“The workshops were great for bringing together local circuit board assemblers, with cleaning experts from across our industry in an educational forum,” claybrook added. “It provided me with an opportunity to share ideas for writing a PCB cleaning process while showing some of the tools MicroCare can offer for quantifying materials used in that process.” the symposiums were well attended with about 100 registered participants. the richardson (Dallas) workshop included attendees from across the spectrum of electronics and semiconductor manufacturing. Engineers and experts from Elbit systems, fujitsu, Qorvo semiconductor, raytheon and many others participated. “’Dip-and-brush’ cleaning has been the de facto standard for PCB cleaning for years,” russell explained. “But with today’s new solvents, new PCB designs, new component configurations, new fluxes and pastes, the efficacy and cost-effectiveness of this old-fashioned www.international.electronica-azi.ro

for further information on benchtop cleaning and the triggergrip™ system visit www.microcare.com.

MicroCare Corp. | www.MicroCare.com

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SMT

Through hole wetting on an osP finished Pcb in a lead-free selective soldering process Although, the OsP finish possesses some very interesting properties, it is seen by many as a low cost solution for low cost electronics. The main reason for this is that the solderability of the OsP coating degrades quite quickly after a lead-free reflow process.

This can result in problematic through hole wetting in wave and selective soldering. This case study focusses on finding the limitations of an OsP coating in terms of through hole wetting in a selective soldering process with two different lead-free alloys. A standard snCu based alloy and the new enhanced low melting point alloy lMPA™-Q.

By: Steven Teliszewski, technical sales Manager, Interflux® Electronics N.V. the ever increasing packaging density on Pcb boards and the changeover to leadfree alloys have played a major role in the evolution and choice of Pcb board finishes. the correct choice of a Pcb finish usually involves the assessment of the pros and contras that are inherent to each finish and in most cases depends on the application and its requirements. these requirements can for example be: mechanical strength of the solder joint, planarity of the finish, pollution of the solder bath, storage time, degradation of the finish after reflow and last but not least cost.

Despite its limitations in planarity, the Hal finish has succeeded to maintain a fairly wide acceptance on most markets. also niau has established itself as a reliable finish, although au pollution in the solder bath or solder joint might be of concern to some. Where i-sn appears to be more popular in Europe, i-ag seems to have the preference in the americas. the osP- finish is being used quite a lot in asia but has less acceptance in the rest of the world. although, the osP finish possesses some very interesting properties, it is seen by many as a low cost solution for low cost electronics. the main reason for this is that the solderability of the osP coating degrades quite quickly after a lead-free reflow process. this can result in problematic through hole wetting in wave and selective soldering. beside this disadvantage however, the coating has very interesting properties. the application process of osP in Pcb manufacturing is easy and has little impact on the solder mask, it has very high planarity, good 38

storage stability and it is cheaper than all the other finishes. this case study focusses on finding the limitations of an osP coating in terms of through hole wetting in a selective soldering process with two different leadfree alloys. a standard sncu based alloy and the low melting point alloy lMPa™-Q TEST SETUP a double sided fr 4 board with an osP coating commonly used in asia was chosen as a test board.

• time between ageing in reflow and selective soldering is 48 hours. in practice, osP degradation is sometimes already witnessed after 4 hours.

• an sn finished DDr3 connector was chosen because of its high pin density of 240 pins with a 2 mm pitch. this will allow for enough results to assess the through hole wetting performance. a secondary difficulty for this connector is bridging but this was not the scope of this case study. a DDr3 connector is often used in computer technology for board to board connections.

• selective soldering tests will be performed on a Kurtz Ersa Ecoselect 1 machine with a standard sncu based alloy and the low melting point lMPa™-Q alloy.

Figure 1: OSP test board with DDR3 connector • the test board has through holes for a DDr3 connector that are connected to cu-mass planes on both sides of the board for a more realistic thermal behavior.

• the boards will be soldered in three different conditions: fresh, two times aged with a reflow profile with peak temperature of 200°c and two times aged with a reflow profile with peak temperature of 240°c.

• the reflow profile of 200°c will simulate the ageing of the osP coating when submitted to a double sided reflow process with an lMPa™-Q solder paste.

• the reflow profile of 240°c will simulate the ageing of the osP coating when submitted to a double sided reflow process with a standard lead-free solder paste.

Figure 2: Kurtz Ersa Ecoselect 1 • a 14 mm nozzle allows to solder the connector in one stroke. the wettable nitrogen flooded nozzle provides for stable and repeatable soldering conditions.

• the water based selective soldering flux selectif 2040 was used for all boards.

• lower preheating temperatures compared to wave soldering are sometimes used in Electronica Azi international | 5/2017

SMT – INfO

selective soldering in combination with higher soldering temperatures to gain process time. a preheating temperature of 80°c measured on the top side of the Pcb board will be used for all boards.

• the test will start with a soldering temperature of 285°c for both alloys. this is a common soldering temperature for selective soldering with standard lead-free alloys. the soldering temperature will be stepwise reduced.

• for each soldering temperature the soldering speed will be stepwise increased starting from 5mm/s.

have consistently worse through hole filling performance than the boards aged with a peak of 200°c • there is hardly any difference between the through hole filling performance of the fresh boards and the boards aged at a peak of 200°c.

• furthermore, signs of non wetting of the osP on the solder side are nearly only witnessed on the boards aged with a peak of 240°c.

• the lMPa™-Q alloy has better through hole wetting performance than a standard sncu based alloy at similar settings. this result is anticipated because of the lower melting point of the lMPa™-Q alloy and hence bigger thermal process window.

TEST RESUlTS AND DISCUSSION • all boards are visually inspected under a microscope and by X-ray.

• through hole wetting performance is CONClUSION divided into 4 categories: the degradation of osP after reflow is influ1) + means that the barrels are filled with a enced by the peak temperature of the filet to the top side of the through hole. reflow profile. a standard lead-free reflow 2) 100% means that barrels are filled without profile has drastically more impact on a filet to the top side of the through hole. through hole wetting and non wetting than a 3) -100% means that the barrels are filled in low melting point reflow profile. boards between 70% and 100% aged with an lMPa™-Q reflow profile 4) - 70% means that the barrels are filled achieved nearly the same soldering results less than 70% than boards that were not aged.

LMPA™-Q SnCu based alloy 285°C Fresh OSP OSP 200°C OSP 240°C Fresh OSP OSP 200°C OSP 240°C 5mm/s +100% +100% +100% +100% +100% +100% 10mm/s +100% +100% +100% 100% 100% - 100% 20mm/s +100% +100% +100% * - 100% - 100% - 100% * 30mm/s +100% +100% +100% * -70% -70% -70% * 40mm/s 100% 100% - 100% * -70% -70% -70% * 260°C Fresh OSP OSP 200°C OSP 240°C Fresh OSP OSP 200°C OSP 240°C 5mm/s +100% +100% +100% 100% 100% - 100% 10mm/s +100% +100% +100% * -70% -70% -70% 20mm/s +100% +100% 100% * -70% -70% -70% * 30mm/s 100% 100% - 100% * -70% -70% -70% * 40mm/s - 100% - 100% - 100% * -70% -70% -70% * 230°C Fresh OSP OSP 200°C OSP 240°C Fresh OSP OSP 200°C OSP 240°C 5mm/s +100% +100% +100% 10mm/s +100% +100% +100% * 20mm/s +100% +100% 100% * Not tested, too close to the melting point 30mm/s - 100% - 100% - 100% * 40mm/s - 100% - 100%* - 100% *

Figure 3: +100% barrel fill

Figure 4: 70% barrel fill

Figure 5: -100% barrel fill

Figure 6: -70% barrel fill

* First signs of non wetting of the OSP on solder side of the PCB • in the table with the soldering results, signs of partial non wetting of the osP on the solder side of the through holes are marked with a red asterisk (*).

• the results clearly show a difference between the boards aged with a standard lead-free reflow profile and the boards aged with a reflow profile for the low melting point alloy lMPa™-Q. • the boards aged with a peak of 240°c

using low melting point alloys can eliminate the degradation problem of osP and facilitate the overall use of this finish. a secondary conclusion is that the lMPa™Q alloy allows for lower soldering temperatures and faster soldering speeds to get good soldering results. this can substantially increase the throughput capacity of selective soldering machines.

More info? ▶▶▶ www.lmpa-q.com

Figure 7: non wetting (*) For more information, please contact: Eng. Ciprian Varga, Technical Director, Comet Electronics Tel.: +4(0)212432090 office@comet.srl.ro www.comet.srl.ro