EP&Dee no 5 - June 2012

JUNE, 2012 ­ ISSUE NO. 5, VOL. 10

DESIGN & MANUFACTURING

EP&Dee ELECTRONICS

PRODUCTS

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DESIGN

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EASTERN

EUROPE

Design the next innovation in EAGLE V6 on element14's EAGLE design competition element14, the first collaborative community and electronics store for design engineers and electronics enthusiasts and a part of global electronics distributor Premier Farnell, has teamed with CadSoft Computer GmbH to invite engineers to take part in the EAGLE Design Competition between 01 May to 31 August 2012.

Electronic design engineers and enthusiasts will need to submit their innovative design projects to win prizes with a pot value of $7000.

The competition, which is powered by Microchip and hosted on the element14 Community, aims to bring the most innovative design engineering communities together using CadSoft EAGLE’s Version 6.

To enter the competition applicants must ensure that all designs use EAGLE Version 6 and that a Microchip MCU or DSC is integrated in the design.

After registering on the element14 Community, users can submit a screenshot of their layout and add a description of their project on the competition page. Users who do not have an EAGLE license can download a free 30-days trial version on www.element14.com/eagle-freemium to participate in the contest.

The prizes: 1. DELL Alienware M17x r3 + EAGLE version 6 Professional incl. all three modules 2. MICROCHIP - DV164037 - KIT, EVAL, ICD3 W/ EXPLORER 16 & DM163022-1 8-Bit development board + EAGLE Version 6#Professional incl. all three modules 3. EAGLE Version 6 Standard incl. all three modules

Embedded Digital Control Facilitates Adaptive Power Control Strategies Able to swap seamlessly between utility ac line and local battery backup power, the intermediate-bus architecture (IBA) that the telecoms industry has refined over decades to become cost-competitive with traditional offline-only sources is an evermore attractive proposition for system architects needing high availability in a wide range of page 8 industries.

The outcome of the competition will feature peer-voting from the element14 community.

Members of the leading global technology community can “like” entries and comment on the submission. Based on the community “likes” and comments, a judging panel consisting of CadSoft, Premier Farnell and Microchip representatives along with independent EAGLE expert Prof. Dr. Francesco Volpe from the University of Applied Sciences in Aschaffenburg will pick the winners.

Judging criteria include clarity in description of the product, the electronic concept, the design complexity, the design quality and the functionality.

For more details and terms and conditions please visit: www.element14.com/eagle-competition

T H E E A S T E U R O P E A N J O U R N A L F O R E M B E D D E D A P P L I C AT I O N S

JUNE 2012 Table of Contents COMMENTS INDUSTRY NEWS 3 Beyond the PC – Part 2

INDUSTRY NEWS COMPANIES 4 Low Power Industrial Use Transceiver for International Applications

DESIGN EMBEDDED 6 Complete sensor solutions at your fingertips Bee Thakore, explores some of the technologies influencing the sensing industry and how the distributor is working to offer customers latest solutions.

8 Embedded Digital Control Facilitates Adaptive Power Control Strategies Able to swap seamlessly between utility ac line and local battery backup power, the intermediate-bus architecture (IBA) that the telecoms industry has refined over decades to become cost-competitive with traditional offline-only sources is an evermore attractive proposition for system architects needing high availability in a wide range of industries.

INDUSTRY NEWS EMBEDDED SYSTEMS DESIGN WIRELESS 12 Medical Wireless Sensor Networks Use Ultra-Low Power Radio Technology To Enable Continuous Monitoring Using Low-Cost Batterie The advent of wireless personal area networks (WPANs) and wireless body area networks (WBANs) has created the need for sensing and monitoring solutions that can support continuous data streaming with extremely low power consumption.

The Sensors and sensing application electronics are considered as one of the fastest growing industries, with a forecasted compound annual growth rate of 10 percent, outpacing the overall semiconductor Page 6 industry.

INDUSTRY NEWS EMBEDDED SYSTEMS DESIGN ANALOG 16 Sensorless BLDC motor control for the masses Using Digital Signal Controllers (DSCs) for sensorless control of Brushless DC (BLDC) motor control to bring this technology within reach of low-cost, mass applications, explains Charlie Ice, of Microchip Technology Inc.

PCB-DESIGN TRAINING 18 EAGLE and DesignLink - Valueable information about components This time I want to show you one specialty of EAGLE: the DesignLink interface.

INDUSTRY NEWS DISPLAY INDUSTRY NEWS LIGHTING INDUSTRY NEWS ACTIVE COMPONENTS INDUSTRY NEWS PASSIVE COMPONENTS SMT PRODUCTION

As the technology of choice for many high- to midrange systems, Brushless DC (BLDC) motors offer a constant or variable speed drive combined with Page 16 high reliability and ease of control.

28 Using Essemtec’s SMD Tower for IGBT Storage in a Clean Room ABB Semiconductors in Lenzburg, Switzerland, long searched for a suitable production storage system for HiPak IGBT modules production.

Project Manager Prabath Lewdeni found the SMD Tower by chance. Its supplier Essemtec re-engineered the SMD component storage system into clean room storage for ABB.

INDUSTRY NEWS SMT INDUSTRY NEWS CONNECTORS 34 ODU-MAC Modular Connector System

DESIGN SENSORS 35 Optical fibres and optical fibre sensors Together with the advance of science and technology, the demand for the most optimum information carrier has grown incredibly fast, for long distances in particular. Optical fibres turned out to be an ideal solution.

INDUSTRY NEWS SENSORS 38 LSIS 400i - the smart camera from Leuze, now with new features

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EAGLE and DesignLink Valueable information about components.

Page 18

Beyond the PC – Part 2 Anyone wanting to get a better idea of the scale of the changes taking place in the world of consumer electronics should take a look at the globalized supply chain, the main factor helping consumer-electronics companies to cut costs. These companies are also benefitting from economies of scale as the incomes of more and more people in more and more countries rise to the point at which gadgets become affordable. Because of this, manufacturers of consumer electronics are now moving down production learning curves faster than most specialized tech firms.

The ability to amortize spending over a fast-growing audience encourages tech firms to pour money into consumer-focused R&D. The market for PCs grows faster than ever before; however, the market for smart phones, the flag product for consumer electronics, outgrows that for PCs by leaps and bounds. As a result, R&D is shifting to consumer-focused markets simply because here it is monetized faster and with a higher return.

The economic trends are being reinforced by several technological ones. Arguably the most important is the ability of micro-chip makers to squeeze ever more computing power onto their products. One of the most important leaps has been the introduction of “multi-core” processors. Often, smart phones are used only for simple stuff, such as calls and emails, which do not require much computing power. By using multi-core chips in conjunction with smart software, more functions can be implemented and power can be saved by selectively shutting on and off cores, reducing the drain on phones’ batteries. This way, smart phone companies have become experts at “doing nothing.”

Other technology advances also contribute to the personal electronics revolution. Lithium-ion polymer batteries, which can be easily molded to different shapes, have made possible ultra-slim devices. Developments in Flash memory technology have made it possible to store more data onto portable devices. Advances in screen know-how have begotten super-sharp displays. Photos and videos can be shot and shared on the move. Some phones even allow video calls.

Technologically impressive as all this is, the biggest change that these new devices have wrought is to transform many people’s experience of computing. The PC may have been personal; a smart phone or tablet, held in your hand rather than perched on your desk, is almost intimate, and you can take it practically anywhere. This shift has been driven by Apple, which likes to boast that most of its revenue now comes from “post-PC” devices such as iPods and iPhones rather than from its Macintosh computers. This is partly true, partly marketing talk: crack open an iPhone and you will find many of the paraphernalia – including the motherboard and microchips – that make up the guts of the PC. Post PC electronics is driven by consumerism, an unstoppable force that has hugely raised people’s expectations. It used to be that the best IT experience people had were in the office. Now that technology has been further democratized, they have become used to doing new and exiting things themselves. For their employers, this creates both headaches and opportunities. (inspired and adapted from The Economist) n Radu Andrei www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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COMPANIES INDUSTRY NEWS

Low Power Industrial Use Transceiver for International Applications With STD-302N-R, Circuit Design, Inc. offers a radio transceiver module which is not only available in 434 MHz, 458 MHz and 869 MHz for Europe but also in 335 MHz (India), 419 MHz (China) and 429 MHz ( Japan). This variety of international frequencies supports industrial equipment manufacturers seeking to enter these markets.

The pin assignment in all frequency versions is the same, so that by changing the PLL frequency program, manufacturers can switch between versions according to their market.

LMD-400-R, the higher grade model of the STD-302N-R, is available in FCC Part 90 and EN 300 113 compliant versions. Furthermore, the LMD-400-R has the same interface as the STD-302N-R. Using this common platform, manufacturers can meet the requirements of the sub-GHz radio and the radio standards in each country simply by replacing the radio component.

The STD-302N-R was developed as a narrowband RF transceiver for use in industrial radio

equipment. It is resistant to mechanical vibration and impact, and its double superheterodyne receiver circuit ensures high receiver sensitivity. Operating in a narrow band and with high selectivity, the STD-302N-R provides highly reliable communication even in applications where several devices are used at the same time.

The STD-302N-R is designed for high performance while the flexibility of discrete, interchangeable components ensures a stable supply of products over the long term.

This concept, combined with stable performance and quality, is highly regarded by manufacturers around the world.

STD-302N-R lineup Frequency 335MHz 419MHz 429MHz 434MHz 447MHz 458MHz 869MHz Market India China Japan E.U. Korea U.K. E.U. Power (mW) 1 10 10 10 10 10 5 CH space (kHz) 25 25 12.5 25 12.5 25 25 Data rate (bps) 4800 9600 4800 9600 4800 9600 9600 Sensitivity (dBm) -120 -118 -120 -119 -120 -119 -116 * Sensitivity: 12 dB SINAD

* 335 MHz is assigned as the frequency for remote control

LMD-400-R lineup Frequency Standard Market Power (mW) CH space (kHz) Data rate (bps) Sensitivity (dBm)

458 to 462.5 MHz FCC Part 90 U.S. 10 12.5 4800 -116

438 to 442 MHz EN 300 113 E.U. 10 12.5 4800 -110

458 to 462 MHz EN 300 113 E.U. 10 12.5 4800 -110

* Sensitivity: 12 dB SINAD * An external power amplifier and control board are available from Reimesch Kommunikationssysteme GmbH, Germany.

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About Circuit Design Circuit Design, Inc. designs and supplies low power radio modules for various application fields such as telecontrol, telemetry, alarms, serial data transmission and audio. The products comply with European ETSI, US FCC and Japanese ARIB standard.

Quality is assured with an ISO9001-certified design and manufacturing process based in Japan.

Inquiries:

Schleißheimer Str. 263 80809 München Tel.: 089/358283-60 Fax: 089/358283-66 E-Mail: info@circuitdesign.de Internet: www.circuitdesign.de

We are looking for local distributors.

EMBEDDED DESIGN

Complete sensor solutions at your fingertips

by Bee Thakore, European Technical Marketing Manager, Farnell element14

Bee Thakore, explores some of the technologies influencing the sensing industry and how the distributor is working to offer customers latest solutions.

The Sensors and sensing application electronics are considered as one of the fastest growing industries, with a forecasted compound annual growth rate of 10 percent, outpacing the overall semiconductor industry. The two strongest market segments impacting the sensor industry are consumer electronics and the automotive industry, together forming a 40% of the sensors market. A layer deeper, this is largely aided by the rapid uptake of smartphones and mobile health devices; as well as MEMs and sensor integration into cars to enable smarter ergonomic and safety features, better engine performance management as well as networked infotainment devices.

MEMs integration into smartphones A state of the art Smartphone such as the

product improvement and looking at the competitive positioning of the sensor manufacturer, age of the sensor (time since it was launched or revised) and the reliability or MTBF (Mean Time Between Failure) that determines its operational life.

An illustration of how fast things can move is the recent release of iPhone 4, the first mobile phone to integrate a micro-electromechanical systems (MEMS) gyroscope, followed a few days later by the announcement of IPO of InvenSense. InvenSense has been a leader in integrated six-axis motion processing employing gyroscopes together with digital accelerometers. An emphasis on such new technologies along with the best in industry options for high res ADCs, low pass filters and signal processing etc would accelerate design cycles.

sors is hard. And it is hard, because sensors present metrological measurements of their physical environment but, without proper perspectives and interpretation, those measurements are often meaningless. This is why it is important that design engineers have easy and quick access to development kits, dev and debug tools, operating stacks, software all the way to onboard test, PCB design and fabrication – the full design cycle.

The advent of mobile health devices Next generation smartphones would soon be able to incorporate a whole slew of new embedded sensors that could help to make mobile health services more accessible.

Image 1: A typical smartphone block diagram showing incorporated sensors. iPhone 4 or Samsung Galaxy S2 is loaded with various sensors (Image 1), such as motion sensors and accelerometers, a gyro, a camera (or two), a microphone, WiFi and Bluetooth radios (which can be used both for communication and for sensing RF signals), Near Field Communication (NFC), a touch sensor, etc.

Given the economy of scale of smartphones and the tough competition in this market, their prices are likely to be halved within a year, as new models launch. Customers working on smart phone applications are focused on

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Going further and faster with the design cycle These smartphone devices are increasingly equipped with high performance processors, such as the 1.2GHz dual core Cortex-A9 processor of the Galaxy S2. Additionally, these phones run a fully-fledged operating system and modern developing languages. Analysts project the smartphone and tablet industry will soon consume over $2 billion of sensors annually.

Yet, for all that, the top mobile apps rarely involve sensors. App developers say using sen-

Image 2: Mobile Health devices integrating As location based services enhance, we would see the introduction of altimeters, sensors to detect perspiration and microphones,

temperature and humidity sensors for more environmental data in devices to already compelling function of the GPS location and positioning sensors.

This would mean that sensors which are not contained within smartphones, but embedded within garments or other items would be able to measure the user’s personal health factors. This is where the future forms of these devices offer a promising and safe way to cope with health issues like allergies (alert systems), location of someone who is in need for medical help and even remote or distributed diagnosis on basis of sensing heart rate/heart flux, blood pressure and more (Image 2). There was much excitement about Apple filling a ’smart garment’ patent in April 2010 which involves clothing that can transmit location and physiometric data wirelessly to an “external data processing device”; well, that might take more than one form.

Such a device becomes the ultimate sensor.

The requirement here is to provide the design engineers of today with as many examples as possible for solutions that can connect different application areas and offer the right level of choice.

Development modules from STMicroelectronics are an example of getting this right and no wonder the manufacturer has established itself as a leader in wearable mobile sensors fit for medical and smartphone applications. One can now imagine these sensors also interacting with wireless sensor networks, GPS location devices within vehicles in order to determine its precise location for emergency situations. We are also seeing key manufacturers gear up to take advantage of the full scope of opportunity, like Freescale who offer entire solutions for key sensor networks both for smartphones and automotive applications - sensors, processors, power etc.

Farnell element14 has been working with these leading manufacturers to extend our offering of reliable components, high level of customer support, an extensive product portfolio and price offers with design cycle resources through the element14 knode. Design engineers are able to get an overview of each device and easily select solutions from

g use of smartphone sensors is a disruptive growth opportunity. major component manufacturers by using interactive block diagram navigation and full application specific line cards on our dedicated n portal for sensing technologies on farnell.com/sensing www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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EMBEDDED DESIGN

Embedded Digital Control Facilitates Adaptive Power Control Strategies

by Patrick Le Fèvre, Marketing and Communications Director, Ericsson Power Modules

Able to swap seamlessly between utility ac line and local battery backup power, the intermediate-bus architecture (IBA) that the telecoms industry has refined over decades to become cost-competitive with traditional offline-only sources is an evermore attractive proposition for system architects needing high availability in a wide range of industries. Continual development in areas such as intelligent power management strengthens the arguments in favor of the IBA approach and while such strategies have been possible for many years, the recent commercialization of digital power converters vastly simplifies their implementation. Contemporary economic and environmental sensibilities make potential energy savings impossible to ignore - and this particularly applies to demand-driven systems that experience significant load-level swings.

Evolution or continuous revolution?

Re-examining long-established practices and actively exploring new ones has never been more appropriate for a power-system designer.

However, revolution is also a realistic description of the step-change in capability that recently available power converters, which exploit digital inner-loop control, deliver over analog counterparts that have decades of evolution behind them, making significant functionality or performance gains unlikely for such a well-refined platform.

To compete, the digital approach has to be better from initial product launches onwards, which is one reason it’s taken so long to successfully commercialize. Commodity mixedsignal processes that allow silicon architects to pack a measurement and control subsystem and communications interface alongside the digital PWM controller core at negligible additional cost now enable products that are electrically superior to analog designs.

For instance, at 396 W with ±2% regulation Ericsson’s BMR453 almost doubles the power density delivered by tightly regulated analog quarter-brick intermediate-bus converters.

Moreover, the digital platform enables a raft of

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programmable functions that range from setting constants such as output voltage, sequencing delays and slew rates, and fault-condition thresholds in a one-time programming step to dynamically optimizing key parameters in a

analog converters and in turn enables compelling opportunities for system design improvements.

Figure 1 shows the key functions within a representative digitally controlled buck converter:

Figure 1 A digitally controlled buck converter with power management and PMBus™ link. running system. With its SMBus hardware basis and a standard power-control command language, PMBus™ - an industry success story in its own right - makes it easy to explore and implement a level of control that’s unprecedented in

Able to adapt to line and load conditions in real time, digital inner-loop control mitigates losses using techniques that include adaptive dead-time control - that is, to vary the period between the power switches conducting to

EMBEDDED DESIGN avoid shoot-through. Using a buck-converter example, the objective is to minimize the conduction period of the relatively lossy body diode in the lower sync FET. The efficiency improvement that results from optimizing this conventionally fixed parameter becomes greater with increasing downconversion ratios and higher switching speeds, and can be several percent higher. Relative to analog DC-DC converters that are typically most efficient between about 50 – 70% of full load, the result that figure 2 shows for the BMR453 is to widen the efficiency curve, which is almost flat from about 10% of full load upwards and achieves 96% or better in typical operation while also being relatively insensitive to input voltage levels. Significantly for power-converter designers, other family products of widelyvarying power levels that employ common core designs reflect virtually identical efficiency characteristics that promise far greater scalability than delivered by analog circuitry.

48 VDC systems. This consideration has costof-ownership implications that are easy to overlook. Providing that the AC-DC front-end furnishes double-insulation from the primary AC-line supply, almost any system merely

standard 1500 VDC isolation that exceeds the requirements of the vast majority of applications other than truly niche environments - notably IEEE 802.3af-compliant outdoor Power-overEthernet links that demand 2250 VDC.

Figure 2 Adaptive digital inner-loop control minimizes losses over wide-ranging conditions.

Classic 48 VDC suits high-power systems Reliable power is increasingly crucial as society’s reliance upon communications-system availability rises, and that data-centric infrastructures structurally consign any meaningful division between telecoms and datacomms to history. The generic model for assuring continuously available power in such systems combines an AC-DC front-end that sources utilityline power alongside a battery backup system and standby generator to supply a DC powerdistribution bus; and it’s a well-proven arrangement that’s attractive to multiple industries.

Keeping in mind that its roots lie in lead-acid accumulator technology that pre-dates AC-line supplies, the 48 VDC level that telecom-spec ETSI EN 300 132-2 defines as a service voltage of 40.5 – 57.0 VDC remains an excellent choice for a DC power-distribution bus for systems that may require kW+ power levels, either initially or as they evolve to meet increases in demand. Relative to say a 12 VDC distribution level that will struggle to service high-power applications, 48 VDC eases Ohmic-loss issues and reduces wiring and connector bulk.

Peripheral issues include the need to meet safety specification IEC/EN 60950-1, which is effectively a global prerequisite, which is eased by 60 VDC abnormal operation limit for

Figure 3: Practical systems most often short-circuit an IBC’s isolation barrier. requires an IBC to embody functional insulation that’s straightforward to construct. This approach is more energy-efficient than barriers that require greater separation between elements, such as transformer windings, as energy-transfer efficiency quickly degrades with increasing coupling distance.

It’s also worth remembering that the IBC’s isolation barrier rarely has any safety-related purpose, as systems almost invariably connect their input and output grounds at board level or at a remote protective-Earth reference point - shortcircuiting the IBC’s isolation barrier as figure 3 shows. The “two-wire” option requires no isolation within the IBC, but most designers prefer the “three-wire” option as it offers more flexibility in EMC counter-measures. Most often, isolation within the IBC exists to protect the device from high voltages that transient currents may create in the wiring hierarchy due to events in external networks or switching between power sources. While isolated converters are intrinsically less efficient than non-isolated ones, market expectations and production economics result in vendors offering isolated IBCs with industry-

Optimizing conversion efficiency for time-variant load conditions As figure 4 illustrates, a typical IBA system board includes an IBC that transforms distribution-bus power to an intermediate-bus level that some number of point-of-load regulators (POLs) use to generate the final

Figure 4 An IBA system board with PMBus control for DC-DC converters in cascade. load voltages. Cascading DC-DC converters in this way may not be the most intuitive approach for maximizing efficiency or minimizing component count. www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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EMBEDDED DESIGN The obvious alternative is to provide isolation and downconversion to a final level in one component, as the classic distributed power architecture (DPA) model demonstrates. Yet this arrangement can create more problems than it solves as multiple isolated DC-DC converters per board are intrinsically more complex, expensive, and less efficient than an IBC and an equivalent complement of non-isolated buck converters. Also, issues such as balancing conversion efficiency, unconditional load stability, and transient response performance make it difficult to manage the very large downconversion ratios that low-voltage silicon processes require in a single step.

Yet the step down from 48VDC to the optimum intermediate-bus level for the POLs remains difficult to specify. Despite the paradox that as semiconductor voltages fall to create greater downconversion issues for the POLs, the 12VDC intermediate-bus level that has its origins in supplying legacy 12/5VDC components now generally best suits boards that consume 150W or more. Experience shows that below about 150W, 12VDC may not be most appropriate and that below about 75W it’s not even a realistic option, leading vendors to offer IBCs with a range of preset output voltages such as the 9, 5, and 3.3 VDC options offered by the BMR453 and its eighth-brick derivative, the BMR454. Preset values are traditionally fine for systems that experience little load variation, but the implication for heavily demand-driven systems is obvious - for optimum efficiency, we need to adjust the intermediate-bus voltage as load demands change.

How best to implement this strategy for a particular power system will depend upon factors such as its hardware configuration, the magnitude of the load-level changes that it experiences, and time-related demand patterns that are likely to be reasonably predictable. These factors do not have to be givens as smart algo-

rithms can continually minimize energy losses in unpredictable circumstances without compromising supply stability, which is a key design objective. As a result, aggressive “bangbang” control strategies are unlikely to match supervisory control software with a light-touch approach that always favors power availability over minimization, yet can respond to rapid increases in load demand.

A pragmatic approach to developing supervisory control algorithms starts with establishing a reference power loss value by recording the input and output voltage and current levels at the IBC and at each POL via PMBus commands as the system runs, possibly also monitoring and correlating each device’s on-chip temperature.

In operation, application software computes power losses until reaching a threshold value that triggers an optimization cycle and trims the bus voltage to maximize efficiency. The routine always first checks for overcurrent risks and, if necessary, raises the bus voltage to safe levels.

Figure 5 graphs the impact upon power loss that results from varying the BMR453’s intermediate-bus voltage from no-load towards 300 W that today’s high-density system boards can consume:

Figure 5 System power losses depend upon intermediate-bus voltage and load demand.

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A breakpoint clearly exists where each combination of conditions converges, above or below which point adjustments to bus voltage deliver appreciable energy savings that are multiplied by similar savings in companion assemblies, and for communications infrastructures across multiple systems that work in parallel to provide adequate network capacity.

Some people call this the “light-bulb effect” — saving a few Watts by selecting energy-saving luminaires makes consumers feel good about themselves and reduces their electricity charges, but the overall impact upon a society’s energy consumption is massive.

Development effort shifts to software As with any other class of programmable device, from a user’s perspective the development effort that produces the physical hardware is invisible in comparison with any software development that’s necessary to apply the component. Accordingly, vendors invest in development environments that ease application challenges, and the quality of those environments is very often the final decider in an engineer’s part selection process. This model applies strongly to digital power converters, PMBus control, and power-management methods that remain unfamiliar to many designers.

To make these topics easily accessible to anyone with a PC and a power supply, Ericsson offers an evaluation kit that includes the hardware and software elements that you need to explore the technology. As you might expect, it includes samples of the company’s digital IBCs and POLs and software that’s primarily designed to exploit their features. Unusually, the platform can also communicate with any PMBus-compliant device and capture lengthy message exchanges, making it useful for developing and debugging real-world systems.

More details appear on the company’s website www.ericsson.com/powermodules together with an archive of digital power conversion material that is useful as a general-purpose resource to anyone wishing to learn more about the technology and techniques for applying it. www.ericsson.com/powermodules

EMBEDDED SYSTEMS INDUSTRY NEWS

Innovasic Launches New Version of Its RapID Platform Industrial Ethernet Connectivity Solution Innovasic announces a new and improved version of its RapID Platform Network Interface for Industrial Ethernet connectivity.

PROFINET Class B, EtherNet/IP and ModbusTCP can all be supported without changing hardware or changing the host processor software. This means host communication with the Network Interface remains the same regardless of the protocol, saving significant development time. The EtherNet/IP and PROFINET Class B versions have been certified, enabling the final product to get to market quicker. All versions are ready to ship today. In addition, all protocol versions of the Network Interface incorporate PriorityChannel™, a new technology for Industrial Ethernet field devices that eliminates the effects of network traffic and loading.

PriorityChannel™ ensures realtime Industrial Ethernet messages are always processed on-time, every time regardless of the

amount or type of network traffic. A field device incorporating the Network Interface is protected from unpredictable packet delays, excessive latency, and connection failure. The RapID

Platform Network Interface is available as a module or an embedded design. The choice is up to the user and the transition can be made at any time. It is possible to start with a module and migrate to the lower cost, smaller form factor embedded design whenever it makes sense.

INNOVASIC www.innovasic.com

PMC introduces industry’s most integrated, lowest power radio transceiver chipset for next-generation macro basestations PMC®, the semiconductor innovator transforming storage, optical and mobile networks, has announced the industry’s lowest power and most integrated radio transceiver chipset for macro basestation designs. PMC’s new UniTRX™ chipset replaces up to 14 discrete devices, and reduces both board space and power by more than 50 percent for equivalent multi-standard basestation radio designs. It addresses multi-standard macro basestation performance requirements and simplifies the design of dense MIMO (multiple input, multiple output) radio units, such as active antenna systems. The UniTRX chipset is designed to support wideband modules operating in the 400MHz to 4GHz

frequency range. It addresses the performance requirements of macro basestation transceivers that feature multiple standards, including MC-GSM, cdma2000®, WCDMA and LTE. High integration and low power make the chipset suitable for single-sector radio module designs and scalable for MIMO applications, such as active antenna systems.

PMC www.pmcs.com

Microchip expands zero-drift operational amplifier portfolio Microchip has broadened its portfolio of zero-drift operational amplifiers (op amps) with the debut of the MCP6V11 and MCP6V31 single amplifiers.

Operating with a single supply voltage as low as 1.6V and a quiescent current as low as 7.5μA, these ultra-high-performance devices offer some of the industry’s lowest quiescent current for the given bandwidth without sacrificing the optimal performance essential for portable applications in the consumer, industrial and medical markets. With an ageing world population in need of new therapies and early diagnostic tools, devices such as the MCP6V11/31 enable the development of portable medical products integrated with higher efficiency, and signal-conditioning hardware and software, which is critical to accommodate the continued push for lower costs and faster times to market. In addition,

designers of industrial applications such as portable sensor conditioning and instrumentation which require low power, smaller form factors, simplified thermal management and cost control, can benefit from the optimised performance, low quiescent current and low operating voltage made possible by the MCP6V11/31 op amps. The self-correcting architecture of the MCP6V11/31 family provides a maximum input offset voltage of 8μV for ultra-lowoffset and low-offset drift, enabling maximum accuracy across time and temperature.

MICROCHIP TECHNOLOGY www.microchip.com/get/1L7G

Launch of SCSI Bridge provides drop-in, solid state replacement for ageing/failing legacy SCSI drives Solid State Disks Ltd, the advanced storage systems design, development and integration specialist, has launched the SCSI Bridge drive which solves the growing and increasingly expensive problem of repairing or replacing ageing and failing SCSIbased hard disk (3.5 inch and 5.25 inch HDD), magneto optical (MO), quarter-inch tape (Pertec, QIC DAT, DLT 3490), Jazz, ZIP, Bernoulli and floppy (FDD) drives on computer-based legacy equipment. The SCSI Bridge drive provides a low-cost, solid state drive replacement that enables CompactFlash cards to be seen as SCSI drives by the host system. The SCSI Bridge drive combines proven SCSI drive architectures (SASI, SCSI-1, SCSI-2) with industry-standard, solid state CompactFlash card technology to provide a highly reliable, solid state drop-in replacement for any style of SCSI-based drive including

hard disk, magneto optical, tape and floppy drives. Importantly, SCSI Bridge is completely programmable, enabling the SCSI driver implementation nuances of all equipment manufacturers to be fully emulated. The SCSI Bridge solution applies to a broad range of computer-based legacy equipment in a spectrum of industries and markets from telecommunications and broadcasting through to industrial process control, factory automation and instrumentation, semiconductor manufacturing, pointof-sale and mil/aero applications.

SOLID STATE DISKS www.ssd.gb.com

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WIRELESS DESIGN

Medical Wireless Sensor Networks Use Ultra-Low Power Radio Technology To Enable Continuous Monitoring Using Low-Cost Batteries

by Reghu Rajan, Technical Marketing in Microsemi’s Wireless Machine to Machine group Microsemi Corporation

The advent of wireless personal area networks (WPANs) and wireless body area networks (WBANs) has created the need for sensing and monitoring solutions that can support continuous data streaming with extremely low power consumption. Today’s wearable medical systems are targeted at applications including on-site and remote patient monitoring, mobility therapies and the management of diseases such as sleep apnea, and are used in environments where frequent battery replacement would be difficult and expensive. While solutions for these short-range applications previously required AA or AAA batteries, they can now be powered by a new generation of micro-power batteries – as long as power efficiency is optimized. Now, the advent of ultra-low-power short-range radio transceivers is enabling low-cost button cell or small lithium ion batteries to support continuous data streaming in WPANs and WBANs for up to two weeks before replacement.

WPANs occupy a network space around an individual that covers the living or working space nearby (typically up to ten meters), and are implemented with protocols such as Bluetooth and Zigbee. WBANs occupy a smaller wireless space of approximately one meter around a person and are used for sensor communication associated with the human body.

Applications have expanded from heavily dutycycled spot measurement to more data intense continuous links. There are a variety of uses for this technology in hospital and clinical facilities, clinical home monitoring and ambulatory applications, and consumer health and fitness (see Figure 1). Many issues must be considered when selecting a short-range radio transceiver capable of optimizing power efficiency in these networks. Among these, power supply voltage is particularly important. Most sensors run on a single battery cell depending on chemistry, so sub-2 Volt (v) supply voltages are preferable.

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Figure 1

Figure 1 External sensing use cases and technology requirements.

WIRELESS DESIGN This means that short-range radio transceivers must be designed for low-voltage operation – ideally, down to 1.1V in order to optimize design flexibility and reduce power management constraints. In contrast, radios that operate at 2.5V consume twice as much power as those with the same current consumption operating at 1.25V. Operating at higher voltage is only required when output power in excess of 5dBm is needed. In short-range applications, output power rarely exceeds 0dBm. Other key power supply considerations include the ability to maintain transceiver and receiver performance, and the use of a current profile without excessive peaks to fit supply impedance.

Another key issue is peak current. Almost all wireless-based sensor networks rely on some level of duty-cycling to save power and restrict the usage of radio space, which generates peaks in the current consumption profile of the sensor. Low peak current consumption in the radio transceiver reduces constraints on the wireless sensor’s power supply.

Output impedance is also important, as it has a major effect on power amplifier (PA) power consumption. Most radios have output impedance below 100 Ohms. Low impedance is only required for high-output-power, longrange applications, however, and results in up to five times higher current consumption than higher-output impedance options that are more suited for short-reach wireless interconnect applications. Overall, assuming a similar receiver sensitivity and PA efficiency, a high impedance 900MHz radio would use only 1mW in its PA to achieve the same range as a 50-Ohm 2.4GHz radio using 25mW to 40mW. The choice of carrier frequency also influences power consumption. The two available options within the medical (ISM) radio band are 2.4GHz or sub-GHz frequencies. The most prevalent 2.4GHz protocols are Wi-Fi®, Bluetooth® and ZigBee®. In low-power and lower-data-rate wireless medical monitoring applications, however, sub-GHz wireless systems offer several advantages, including reduced power consumption, as well as longer range for given power.

The Friis Equation quantifies the superior propagation characteristics of a sub-GHz radio, showing that path loss at 2.4GHz is 8.5dB higher than at 900MHz. This translates into 2.67 times longer range for a 900MHz radio since range approximately doubles with every 6dB increase in power. To match the range of a 900MHz radio, a 2.4GHz solution would need greater than 8.5dB additional power. Another benefit of sub-GHz carrier frequencies is that they reduce the risk of interference from airways that are crowded with colliding 2.4GHz Wi-Fi®, Bluetooth® and ZigBee® signals used in in everything from wireless hubs and computers to cellphones and microwave ovens. Sub-GHz ISM bands are mostly used for proprietary low-duty-cycle links and are not as likely to interfere with each other. The quieter spectrum means easier transmissions and fewer retries, which is more

efficient and saves battery power.

Furthermore, the narrower sub-GHz bandwidth creates higher receiver sensitivity and allows efficient operation at lower transmission rates.

For example, at 300MHz, if the transmitter and receiver crystal errors (XTAL inaccuracies) are both 10 ppm (parts per million), the error is 3kHz for each. For the application to efficiently transmit and receive, the minimum channel bandwidth is two times the error rate, or 6kHz, which is ideal for narrowband applications. The same scenario at 2.4GHz requires a minimum channel bandwidth of 48kHz, which wastes bandwidth for narrowband applications and requires substantially more operating power.

Carrier frequency also has a major impact on the average power budget at the network level.

extract meaningful waveforms.

One example of a solution that delivers this level of performance is the ZL70250 transceiver from Microsemi (see Figure 2). Housed in an approximately 2mm × 3mm chip-scale package, it has standard 2-wire and SPI interfaces for control and data transfer using any standard microcontroller. The microcontroller’s analog-to-digital converter (ADC) connects to the ultra-lowpower analog front-end device. Combined with the ZL70250 transceiver, the resulting solution can be used to develop a wireless ECG solution that can run continuously from a CR series coin cell for up to a week. Similar power efficiency can be achieved with such devices as a 3-axis accelerometer or pulse-oximeter for patient respiration measurement, as well as a variety of

Block diagram of a typical wireless sensor based on the ZL70250.

Figure 2 Zigbee and Bluetooth offer highly sophisticated link and network layers, but these stacks account for up to 50 to 75 percent of the radio power consumption, with larger overheads. For ultra low-power systems, the “one size fits all” standardized option is rarely the optimum solution. Instead, designers developing solutions for ultra-low-power applications should consider using the protocol best suited for their need.

Finally, link data rate is one of the most important factors influencing power consumption in duty-cycled wireless links. The average power is almost inversely proportional to the link data rate; for instance, a 100kbps radio will consume almost half the power of a 50kbps radio for the same payload. When comparing RF transceivers, “energy per bit” is a better indicator of power efficiency than current consumption. But high data rate radios are often those with the higher peak currents, and these are highly undesirable for most small batteries as they result in large, leaky, storage capacitors.

Each of the aforementioned factors is critical for applications where power is at a premium and payload is greater than 10 bits/sec.

Whereas previous body-worn wireless sensors could only be used for slowly varying parameters, new RF technologies can be used to help observe more rapidly changing physiological parameters, such as heart and brain electrical activity or blood oxygenation, that require data rates on the order of 0.5 to 5 kbit/s to

other wearable health monitoring platforms.

The advent of micro-power batteries along with advances in ultra-low-power transceiver technology are making it possible to build smart, flexible and smart wireless sensors.

Proper transceiver selection is critical for addressing a variety of key design issues so that wearable wireless medical devices can perform continuous monitoring of bio-signals for long periods using a single, low-cost battery. n About the author: Reghu Rajan received his B.S. degree in Biomedical Engineering from Cochin University of Science and Technology, India in 1996, M.S. degree in Electrical Engineering from Oklahoma State University in 2001 and is currently pursuing to receive his MBA at San Diego State University. His master's thesis involved wide range RF power sensor for the US military (SPAWAR, San Diego). He started his career with GE Medical systems at their Medical Imaging division in 1996 and moved on to power electronics and circuit design for Grentel Technologies Limited (India). From 2001 to present he has been working with Communication & Medical Product Group at Microsemi, San Diego, where his job roles included analog and RF circuit design for Ultra Low-power Radios and his current role is in technical marketing for the wireless health care area. www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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EMBEDDED SYSTEMS INDUSTRY NEWS

New Pareon tool from Vector Fabrics smooths multicore software optimization Vector Fabrics, a company that specializes in programming tools to optimize software for multicore architectures, today announced the launch of its new development tool, PareonTM. Pareon allows software developers to optimize their applications for multicore systems in hours or days, a task that typically takes weeks or months to complete. The tool’s analysis engine prevents hard-to-find and hard-toreproduce threading bugs, while its hardware modelling engine prevents the developer from writing code that introduces performance bottlenecks or even causes slowdowns.

Pareon helps developers address the consumer’s demand for fast, high-quality, and responsive applications. Pareon combines the features of Vector Fabrics’ previous vfEmbedded and vfThreaded-X86 parallelization tools into one product. In addition, Pareon incorporates over 50

new features, including bus and shared cache contention modelling, support for C/C++, ARM Neon, and recognizing many more parallel code patterns.

Whereas Vector Fabrics’ previous

tools were cloud-based and ran in the user’s web browser, Pareon runs locally on a workstation, integrating more closely with typical development workflows that include complex build mechanisms, and targets large applications that rely heavily on calling routines inside binary libraries.

VECTOR FABRICS www.vectorfabrics.com

The newest Intel® Core™ Processors with two Cores on COM Express™ Modules The dual-core variants of the Intel® Core™ processor family of the third generation (code name “Ivy Bridge”) that have just been introduced by Intel® are now also available on the newest COM Express™ modules of MSC Vertriebs GmbH. In an innovative 22nm process technology by Intel® the processor family is manufactured with three-dimensional transistors in order to achieve higher performance with lower power dissipation.

The new COM Express™ modules stand out for the additional increase of the processing performance, graphics and video in comparison to the predecessor platform.

MSC delivers two new COM Express™ module families that support the plug pin-out according to Type 2 (MSC CXB-6SI) or Type 6 (MSC C6B-7S). Besides the first products with the quad

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core processors Intel®Core™ i73615QE with 45W maximum power dissipation (TDP) and Intel® Core™ i7-3612QE (35W TDP), which have already been announced in April, the more economical Intel® Core™ i3 and i5 versions with two processor cores are now also available.

The COM Express™ modules are offered with Intel® Core™ i53610ME (35W TDP), Intel® Core™ i3-3210ME (35W TDP) or Intel® Core™ i3-3217UE (17W TDP) processors.

MSC VERTRIEBS www.msc-ge.com

EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

Feature-packed Kontron embedded Mini-ITX motherboard with 3rd generation Intel Core processors Kontron has announced its new high-quality Mini-ITX motherboard for embedded applications, the Kontron KTQM77/mITX, featuring the Intel QM77 Express Chipset and 3rd generation Intel Core processors. It surpasses previous designs based on the 2nd Generation Intel Core processors with up to 20% enhanced computing power and 50% higher graphics performance. It is therefore not only the highest performing Mini-ITX motherboard in the Kontron series, but, additionally, Kontron has integrated a range of interfaces which differentiates it from typical commercial motherboards. It also includes the latest serial I/O performance such as PCIe 3.0 and USB 3.0. With longterm availability and support for up to three independent displays, it provides everything to build a broad array of future-ori-

ented, rich media embedded applications on a single compact Mini-ITX form factor, making it an ideal fit for markets such as digital signage, gaming, kiosk/POS, industrial automation and medical imaging. The new Kontron

KTQM77/mITX provides OEMs and developers with a scalable performance range from the price-optimized, dual-core Intel Celeron processor up to the quad-core 3rd generation Intel Core i3/i5/i7 processors with up to 3.5GHz (in Turbo Mode) for highest performance.

KONTRON www.kontron.com

Posedge standardizes on EnSilica’s eSi-3250 processor for wired/wireless networking IP solutions EnSilica, a leading independent provider of IC design services and system solutions, has announced that Posedge has standardized on its eSi-3250 32-bit processor core for the processing engine architecture for its range of wired/wireless networking IP solutions. The decision to standardize on the eSi-3250 has enabled Posedge to develop a single, flexible hardware architecture for multiple products that are also futureproofed for different protocols.

Posedge chose the eSi-3250 over alternative solutions due to its scalability, programmability, low power consumption and competitive licensing model. Posedge uses the eSi-3250 processor core, which delivers a Dhrystone MIPS performance of up to 1.41 DMIPS per MHz, in both single and challenging, mixed-mode multicore configurations to provide scalable performance and

address different markets including those for Wired Packet Processors, Wireless Packet Processors, Security Protocol Processors and Wireless LAN MAC Controllers.

Posedge’s latest solution to use the eSi-3250 is an innovative 12core Wireless Packet Processor for application-aware WLAN access points and LTE basestations that not only delivers a 10x performance improvement over existing solutions but also provides application level value added features.

EnSilica www.ensilica.com

ANALOG DESIGN

Sensorless BLDC motor control for the masses

by Charlie Ice, Microchip Technology Inc.

Using Digital Signal Controllers (DSCs) for sensorless control of Brushless DC (BLDC) motor control to bring this technology within reach of low-cost, mass applications, explains Charlie Ice, of Microchip Technology Inc.

As the technology of choice for many high- to mid-range systems, Brushless DC (BLDC) motors offer a constant or variable speed drive combined with high reliability and ease of control.

The use of even a few Hall Effect sensors, however, adds to the total system cost which can take BLDC out of the reach of low-cost applications.

Previous attempts at sensorless control have also been priced out of the reach of mass-market applications by requiring expensive controllers to run the algorithms used to replace the sensors.

Now, however, with volume costs of close to one dollar per unit, Digital Signal Controllers (DSCs) such as such as Microchip’s dsPIC33FJ15MC102, can overcome these challenges and make sensorless BLDC motor control a viable choice for low-cost applications.

Sensored BLDC To understand how sensorless BLDC motor control works, it is useful to consider the basic sensored control model.

The BLDC motor uses an energised coil, or stator, which causes a permanent magnet on the rotor, or shaft, to align with the coil, and rotate the rotor to generate torque. In a three-phase BLDC motor the stator’s three coils, or phases,

16 EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

are turned on and off sequentially in advance of the rotor. To make the rotor spin smoothly, the motor is built using multiple sets of coils for each coil or phase and each phase must be turned on and off in a specific order to make the rotor rotate. The position of the rotor dictates which phase needs to be turned on or off. Therefore, it is critical that the position of the rotor is known, and that the controller actively switches the phases on and off so that the BLDC motor can operate. The simplest way to calculate the rotor’s position is to use Hall Effect sensors, which generate pulses which allow the controller to identify the rotor’s position. With the rotor’s position identified, the basic BLDC controller just needs to lookup which pattern for the three phases corresponds to the position of the rotor, and switch the phases to that pattern.

Sensorless BLDC Taking a closer look at the three phases of a BLDC motor can help to explain how a sensorless BLDC algorithm can calculate the position of the rotor.

In trapezoidal control, one phase is pulled high (+VBUS), one phase is pulled low (-VBUS), and the third phase is inactive, at any one time. The waveform of each phase is shaped like a trapezoid, as shown in Figure 1. When the rotor passes by a phase, the permanent magnet on the rotor induces a current in that phase that results in a voltage known as back Electromotive Force (EMF). The back EMF is dependent on the number of turns in each phase winding, the angular velocity of the rotor, and the strength of

the rotor’s permanent magnet. The back-EMF waveform of each phase is related to the position of the rotor, so the back EMF can be used to determine the rotor’s position.

Although there are many methods of using back EMF to determine the position of the rotor, one of the most common and robust is zero-crossing detection.

Figure 1: BLDC motor windings and trapezoidal waveforms.

ANALOG DESIGN When one of the back-EMF signals crosses zero, the controller must switch the pattern on the phases. This process, known as commutation, is shown in Figure 2. In order to keep the rotor advancing, there must be a phase shift between the point at which the zero crossing occurs and when commutation occurs. The controller must calculate and compensate for this.

A simple way to implement zero crossing is to assume that a zero-crossing event occurs whenever the back EMF on any of the phases reaches VBUS/2.

that of the other phase. Finally, this simplistic sensing method causes positive and negative phase shifts in the sensed back-EMF signals.

Real-world BLDC In real-world applications, the zero-crossing threshold voltage varies considerably. This variable threshold voltage is, however, equal to the voltage of the neutral point of the motor, as the neutral point of motor is the average of the back EMF of all three phases.

Therefore, whenever the back EMF of any

Figure 2: Back EMF zero crossing.

Reducing development cost New development tools, optimised for sensorless BLDC control, can significantly cut the cost and development time for implementing sensorless BLDC in mass-market and other applications. Microchip’s motor-control starter kit, shown in Figure 3, costs less than $100 and includes detailed application notes, as well as example software and hardware schematics.

Motor-controller suppliers, including Microchip, also typically provide downloads of software and hardware files free of charge, which makes the learning process even easier.

Figure 3: Low-cost sensorless BLDC Development Kit. This method can be easily implemented by using a few operational amplifiers, configured as comparators. However, this does present a number of problems: The back EMF is typically less than VBUS, so the zero-crossing events do not necessarily happen at VBUS/2; In addition, the properties of each phase may be different, so the back-EMF voltage for a zero crossing on one phase could be different from

in software by taking the average of the three back-EMF signals. The software can then compare this value to the sensed back EMF of the three phases and detect when a zero-crossing event has occurred. Once a zero-crossing event has occurred, the controller commutates the motor and the process starts again. Using the back EMF of the motor to detect zero crossings means that the sensor can be eliminated from the system without compromising performance.

Real-world systems also introduce other challenges to sensorless operation. First, at low speeds, the back EMF is very small and very difficult to detect. So, the controller must guess the rotor’s position until the motor begins to spin fast enough to generate enough back EMF to operate in sensorless mode. A software-programmable controller enables the system startup to be tailored to each application, which can minimise the effects of this issue. Another challenge is switching noise from the MOSFETs. As the MOSFETs switch to change the voltage on each phase, they introduce noise into the back EMF which is sensed by the controller’s ADC module. This noise needs to be filtered out, in order to accurately recreate the back EMF of each phase. A DSC has a DSP engine built into the processor, which can easily handle the computations needed to implement a digital filter and eliminate this switching noise. The use of a software-programmable controller can also provide easier solutions to other challenges, which are specific to each application.

phase equals the motor’s neutral point, a zerocrossing event has occurred and the controller needs to commutate. This can be done by using resistors and operational amplifiers, or by using the ADC module and software on the controller. With a programmable controller, such as a dsPIC® DSC, the back EMF for each phase can be sampled using the ADC module, and the neutral point can be easily recreated

Conclusion DSCs are taking the cost out of BLDC motor control. Sensorless BLDC motor control can be implemented using DSCs which have a volume cost which is close to one dollar per unit, and with development tools that cost less than $100, in addition to free software and schematic downloads and application notes.

These are all good reasons why sensorless BLDC is beginning to take its place in low-cost, mass-market applications. n Note: The Microchip name and logo, and dsPIC are registered trademarks of Microchip Technology Inc. in the U.S.A., and other countries. All other trademarks mentioned herein are property of their respective companies.

www.microchip.com www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee 17

PCB-Design TRAINING

EAGLE and DesignLink Valueable information about components This time I want to show you one specialty of EAGLE: the DesignLink interface.

When you are in the design process of a schematic and you want to check whether one of the components you plan to use exactly fits for your purposes, EAGLE offers a very convenient tool that allows to look up technical data and informs about availability and price. This function is realized in collaboration with Farnell/element14 by the help of an EAGLE User Language program which gives access to the Premier Farnell web site and offers information about more than 400.000 components.

Simply click onto the DesignLink icon in the schematic editor and choose the General option.

A window pops up that allows to enter search words in the bottom line.

Type in for example ATMEGA88A and click onto the Search button.

The result is shown in the window now. You have the option to look into the data sheet (click on the datasheet link) or get information about different variants and about availability and price.

If you would like to order this components directly.

Click onto Add selection to shopping cart.

If you have made your schematic and want to order all the components now, the DesignLink interface can serve again. Click onto the DesignLink icon and select the Schematic option.

Now the DesignLink ULP loops through all the components placed in the schematic and looks for already existing library attributes about the Farnell Order Code and Manufacturer Part Number.

Then the ULP estblishes a connection to the web and checks information

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EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

about availablility and price.

Components that do not have information in their attributes, EAGLE tries to find a matching result via DesignLink online. The value of the component is taken as search word.

The result will be shown and you can decide whether this is suitable for you. If not, you can initiate a manual search. Type in fitting search word(s) and check the results. If it is okay, click Accept and the next component will be processed. In case you don't want to have a certain component ordered – maybe you have it already on stock and don't need to buy it – click the Skip button.

Finally a bill of material will be presented that contains all information you need.

Now you can choose the Number of PCBs you want to order components for. Click Update for refreshing the list. To start the online ordering process click Add to shopping cart. Optionally you can Export your BOM as a text file and forward it to the purchase department.

If you activate the checkbox for Save order codes the ULP saves all the information collected in the schematic file. So you have them available for the next time.

Now we can start to create the layout in EAGLE. This can be done with a single mouse click. But this is subject for our next article. Stay tuned. ☺ Richard Hammerl www.farnell.com

DISPLAY INDUSTRY NEWS

DONTECH VCG-SERIES™ Precision Glass Optical Filters Optimize Display Clarity and Contrast in Demanding Applications

10.6-inch (27 cm) WXGA display modules with viewing angles of 176 degrees and a contrast ratio of 1000:1

Utilizing the latest in glass fabrication and thin-film vacuum deposition technology, Dontech’s VCG-Series™ glass filters provide exceptional optical transparency and environmental durability. Dontech’s precision glass optical filters are incorporated in demanding military, medical, industrial and avionic applications.

For high-end display programs, VCG-Series™ filters optimize display clarity and high ambient light contrast (e.g., sunlight readability). Filters can be fabricated from a variety of glass substrates, such as chemically strengthened soda lime (etched or polished), borosilicate, fused silica, and optical glasses (e.g., Schott nBk-7).

VCG-Series™ filter customization options include high-energy vacuum deposited coatings such as antireflective, transparent conductive (EMI shielding, transparent heaters), and infrared (IR) or near infrared (NIR) blocking.

Additional features include custom screen printing, polarizers, precision machining, and con-

Gleichmann Electronics now offers two new 10.6-inch (27 cm) WXGA display modules, part numbers NL12876AC18-03 and -03D, from NLT Technologies.

The new display modules feature ultra-wide viewing angles of 176 degrees horizontally and vertically, a brightness of 300 cd/m2 and a high contrast ratio of 1000:1.

The combination of two advanced core technologies – Ultra Advanced Super Fine TFT (UA SFT), NLT’s proprietary version of In-Plane Switching (IPS) technology, and ColorXcell, an integrated colorenhancement technology that delivers color reproduction that is comparable in color intensity to the original video source, without tint or color variance – ensures that the new 10.6 inch TFT-LCD modules provide a high-luminance, wide color gamut and vivid colors.

Thanks to the UA-SFT technolo-

ductive optical grids (woven, etched and printed). Dontech’s glass filters can be laminated or monolithic, clear or colored.

Available VCG-Series™ filter sizes range from less than 1” to greater than 42” diagonal, and can be sold as a stand-alone display

cover glass product or integrated into a higher level assembly. VCGSeries™ filters can be assembled into frames or bezels, or optically bonded to LCDs or touch screens

by Dontech using its proprietary IMO-bond™ optical bonding process to improve impact resistance and display contrast.

DONTECH www.dontech.com

PHOENIX DISPLAY Launches new Line of custom and Standard Transflective TFT Displays Phoenix Display International (PDI), Inc., has introduced a new line of custom and standard transflective TFT LCDs ideally suited for demanding outdoor applications. Phoenix Display transflective color LCD screen modules are available in 320×240 (QVGA) resolution in 2.2”, 2.8”, 3.2”, and 3.5” sizes as well as 800×480 (WVGA) in 5.0” size, and can be integrated into any number of applications. Designed with an internal transflector, PDI’s TFT LCD modules are 100% sunlight readable, operating in a reflective mode when in direct sunlight conditions, giving the user a clear image without becoming washed out. Phoenix Display’s custom and standard transflective TFT LCDs are designed to meet the ever-growing need to display full-color graphical content with

high brightness, high contrast, and full-speed video capability.

Standard brightness ranges from 80 to 160 nits, depending on size.

If customization is required, Phoenix Display's US-based, local engineering team can design the LCD module around the standard transflective glass platform to integrate both electrically and mechanically into an existing project.

PHOENIX DISPLAY INTERNATIONAL (PDI) www.phoenixdisplay.com

gy, images can be viewed in both portrait and landscape orientation from almost any angle without color shift or compromising brightness. This viewing flexibility is particularly important for applications where the display orientation may vary or where users require accurate imaging results

from multiple viewing angles, such as portable medical imaging and diagnostics or test and measurement equipment. Typically, higher saturated color filters are needed to improve color reproduction but at the cost of reduced transmissivity.

GLEICHMANN ELECTRONICS www.msc-ge.com

DSM Computer integrates the Intel® AIM Suite in its industrial displays In close cooperation with Intel, DSM Computer has integrated the Intel® AIM Suite Web-based software in its large-area industrial displays. The Intel® AIM Suite is used for the anonymized detection and analysis of the screen observer’s eye contact. An industrial display system with 140 cm (55 inch) diagonal, integrated camera and a built-in PC platform with the Intel® QM67 chipset and the Intel® Core™ i52710QE processor specially developed

by DSM was presented for the first time at the Embedded World 2012. The Intel® AIM Suite detects how long the observer's attention remains directed at the large screen. The gender and the age group of the person can also be determined. The anonymized data that can be transmitted in

real-time via a Web portal can be evaluated after 24 hours at the earliest. This time interval ensures the further anonymization of the data and so precludes a direct reference to the viewer in front of camera. These features open a number of interesting applications for the large-area displays

with the Intel® AIM Suite. For example, the eye contact of the viewer can be followed over the course of time.

DSM COMPUTER www.dsm-computer.com

www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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LIGHTING INDUSTRY NEWS

ERG’s New SMART BRIDGE™ Module Makes for an Easy Transition to LED BACKLIT LCD

Silicon Labs Embedded Technology Helps RB Concepts “Light up the Possibilities”

Is your current LCD going end of life? Does the recommended replacement LCD have an LED backlight and a built-in driver?

Are your current input signals incompatible with the new requirements? Would you like to make the LCD upgrade as seamless as possible? ERG’s Smart Bridge™ module resolves many of the problems users are currently experiencing – quickly, easily and economically – by using the system’s existing input power signals and converting the analog dimming signal used for the inverter into a PWM signal for the LED driver. In this way, the system’s existing signals are utilized, powering the LED backlight driver without additional modifications.

It’s one simple swap. Remove the inverter, plug in the footprintcompatible Smart Bridge module, and connect the input cable from the existing power supply or controller to the Smart Bridge. The Smart Bridge module converts the Power • Ground • Enable • Control signals and mates directly to the LCD via a small harness,

Nothing lights up a rock arena quite like a Coldplay audience with tens of thousands of flashing Xylobands™ LED wristbands powered by embedded technology from Silicon Laboratories Inc. Created by UK-based RB Concepts Ltd., Xylobands use wireless ICs and ultra-lowpower microcontrollers (MCUs) from Silicon Labs to receive and process wireless signals that trigger each wristband’s LEDs to light up in sync with the music and stage lightshow. The Xylobands are the unique, patented creation of inventor and Coldplay fan Jason Regler, a coowner of RB Concepts. Coldplay’s high-energy music and lyrics inspired Regler’s bright idea to create a wireless LED wristband that could be controlled remotely through proprietary software and a laptop connected to a radio transmitter to enable fans to be part of the lightshow. Recognizing the brilliance of Regler’s invention,

powering the new backlight driver correctly. This avoids the timeconsuming and expensive alternative of system re-design. The standard version (SBD4212F) is a Smart Bridge Pass-Through with Integrated PWM Dimming and operates from a typical 12V

signal. The Smart Bridge DC-DC Converter with Integrated PWM Dimming (SBDCD4213F) is designed for applications requiring a step-up conversion from 5V to 12V. The third version is the Smart Bridge DC-DC Converter Without Dimming (SBDC4227F).

ERG www.ergpower.com

Mouser Shines the Spotlight on OSRAM Ostar Stage LEDs Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced it is stocking new LEDs from OSRAM Opto Semiconductors.

OSRAM Ostar Stage LEDs offer an extremely slim, 1.23mm high profile, made possible by a flat glass cover with an anti-reflective coating. The new flatter profile allows these LEDs to provide the basis for compact spotlights with a very narrow beam and high luminance. The glass cover has been optimized specifically for injecting light into lens systems, enabling a narrow light beam of ±9º to be produced. This beam is smaller by factor 2 than that of spotlights based on plasticencapsulated LEDs and also increases the luminance of the

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spotlight by factor 2. The Ostar Stage LEDs are based on the OSRAM Ostar SMT platform and contain four different chips in red, green, blue, and white, allowing them to produce virtu-

ally any color.

All four chips are manufactured using efficient thin-film technology so that most of the light produced internally is emitted at the top and more light can be focused in the customer optics system.

MOUSER ELECTRONICS http://www.mouser.com

EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

the Brit Awards- and Grammywinning rock band has used Xylobands to light up arenas and stadiums all around the world.

Xylobands have a very broad appeal. In addition to lighting up

rock concerts, Xylobands can generate interactive audience participation at a wide variety of sporting events, theme parks, festivals, parties and corporate activities.

Seeing is believing. Visit www.coldplay.com to see Xylobands flashing on and off to Coldplay’s hit song, “Charlie Brown,” performed at Rexall Place in Edmonton.

SILICON LABORATORIES www.silabs.com

Integrating Sphere Enables Precise Measurements for Large LED Modules The rising popularity of LED light sources is making it more important for manufacturers, system integrators, illumination designers and scientific laboratories to carry out complex measurements for LED lamps, whereby the measuring equipment used must also accommodate LED modules and engines of increasing physical dimensions. GL Optic has responded to this need by developing the GLS 1100 integrating sphere. The GLS 1100 provides the basis for taking a wide variety of photometric measurements and can be used for entire modules and engines. Discussion surrounding the introduction of LED lighting equipment is frequently characterized by the question of energy efficiency, which is determined by quantifying the spectral characteristics of the respective luminous element and comparing them to conventional light sources. Key measurements are

those required to assess the luminous flux and radiant power.

Spectrally calibrated, the GLS 1100 is the ideal tool for this task

and enables absolute measurement of radiant power and its spectral distribution. The absolute value and various photometric parameters can be measured simultaneously and include color coordinates, color temperature and the color rendering index (CRI) determined in accordance with CIE standards.

GL OPTIC www.gloptic.com

ACTIVE COMPONENTS INDUSTRY NEWS

CMX994 Operating Range Extended CML Microcircuits has increased the operating range of its CMX994 Direct Conversion Receiver. Through an on-going research and development programme, CML has extended the operating range of the CMX994 Direct Conversion Receiver (DCRx) IC. Now operating over an RF range of 50MHz to 940MHz, the CMX994 now addresses a wider range of Software Defined Radio (SDR) demands. The CMX994 is a receiver Integrated Circuit (IC) featuring I/Q demodulators intended for use as a direct conversion receiver.

The device targets the next generation of multi-mode Software Defined Radios (SDR) for wireless data and two-way radio applications.

Its design provides the optimum route for on-board integration, allowing a small RF receiver to be realised with a minimum of external components in both zero IF and low IF systems. A DCRx mixes the wanted RF signal down to 0Hz in a single quadrature mixing process using a local oscillator

(LO) tuned to the wanted RF channel frequency. Selectivity filtering and gain can now take place at baseband with practical, low power, analogue and digital circuits. DCRx also eliminates the need for an image-reject filter.

The CMX994 DCRx IC offers excellent RF performance, exceptional IP2 from I/Q mixers and is suitable for modulation schemes including: QAM, 4FSK, GMSK and pi/4-DQPSK. Key features of the device include on-chip VCO for

VHF applications, on-chip LNA, precision baseband filtering with selectable bandwidths and the smallest PCB area, typically less than 50% of a dual superhet.

CML MICROCIRCUITS www.cmlmicro.com

Silicon Labs Demodulator Simplifies Video Front-Ends for TVs and Set-Top Boxes Silicon Laboratories Inc. introduced the broadcast video industry’s most advanced, singlechip multimedia demodulator, enabling developers to simplify the design of iDTV, set-top box (STB) and Blu-ray/DVD recorder products. The new Si2169 device is the first demodulator to integrate the emerging DVBT2 standard, advanced DVBS2 standard, and existing DVB-T, DVB-S and DVBC standards into a single CMOS chip supporting terrestrial, satellite and cable TV broadcast.

The Si2169 is complemented by the Si2168, a pin-compatible DVB-T2/T/C demodulator designed for terrestrial and cable TV broadcast.

The Si2168/69 demodulators offer the industry’s highest level of DVB-T2 terrestrial broadcast performance, outperforming other competing DVB-T2 demodulators in challenging

reception conditions and fully complying with the NorDig 2.2.1 and D-Book 7 specifications.

Offering superior echo performance in all DVB-T2 transmission modes, the new demodulators enable the industry’s fastest DVB-T2 channel lock times under the most challenging echo conditions. In fact, Silicon Labs

has implemented a special architecture to reduce DVB-T2 lock times to industry-leading values unlike competing demodulators that typically require significantly longer time to lock onto difficult channels.

SILICON LABORATORIES www.silabs.com

RX220 Group of ultra-low power MCUs enables a cost-effective entry into the 32-bit world

Murata Power Solutions extends point-ofload series to include 3A and 5A SIP packages

MSC now offers 11 MCUs in the RX220 Group of 32-bit microcontrollers (MCUs) from Renesas Electronics. The new RX220 Group of MCUs features processing performance of up to 50 Dhrystone MIPS (DMIPS) at 32MHz and a reduced power consumption of less than half that of the earlier RX200 Series of MCUs. In particular, in intermittent operation, the new RX220 Group sets new standards. When the CPU is operating and the peripheral functions are halted, the power consumption of the new RX220 MCUs is only 0.2mA/MHz. When operating in software standby mode, in which the contents of the on-chip RAM and registers are maintained but

Murata Power Solutions announced the OKX series of miniature non-isolated single output DC/DC converters designed for embedded point-of-load (PoL) applications. Within the OKAMI OKX series there are 4 models that provide 3A or 5A outputs with either 5V or 12V nominal inputs. Complementing the existing OKY range of surface mounted PoL converters available from Murata Power Solutions, the new OKX-T/3 and OKX-T/5 series additions are packaged in a popular spacesaving 5-pin single-in-line package (SIP). Design engineers now have a choice of package format depending on available board space and application requirements. Measuring just 22.9 × 10.2 × 7.1mm, the SIP package meets Distributed-Power Open Standards Alliance (DOSA) specifications and is designed as a

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other functions are halted, the operating current is reduced to an ultra-low level of 2μA. In combination with the performance of 1.56 DMIPS/MHz, which is unusually high for mid-range MCUs, a significant reduction of

the overall system power consumption can be achieved in systems with alternating processing and standby phases.

MSC VERTRIEBS www.msc-ge.com

EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

drop-in replacement for other DOSA-compliant parts.

These highly efficient converters, typically 94.5% at 3.3Vout, and capable of driving ceramic capacitive loads up to 1,000 uF, have tight load regulation making them ideal for powering applications such as FPGAs and DSPs. The output voltage is program-

mable from 0.75 to 3.63VDC for the 5Vin part, and up to 5VDC for the 12Vin part.

MURATA POWER SOLUTIONS www.murata-ps.com

ACTIVE COMPONENTS INDUSTRY NEWS

The world’s smallest quad-band module in LCC package has a size of only 19.9mm × 23.6mm × 2.65 mm MSC now offers the M95 quadband GSM/GPRS module from Quectel. The M95 is provided in an easier soldering process SMD LCC package that has dimensions of only 19.9mm × 23.6mm × 2.65mm. The M95 is currently the world’s smallest quad-band GSM/GPRS module. Despite its compact form factor, the M95 features outstanding performance data such as: GPRS multislot class 12 for uplink transfer up to 85.6 kbps and an extremely low current consumption of only 0.9 mA in sleep mode when DRX is 5 as well as numerous additional functions such as embedded class AB amplifier.

Two UART interfaces and a large number of protocols, such as TCP/IP, UDP, FTP and PPP, are already integrated on the module. This ensures that the M95 meets the requirements of vari-

ous M2M applications including Vehicle Tracking System, Industrial PDA, Personal Tracking, Wireless POS, Smart Metering, etc. In addition to the module, MSC also offers a complete M95 development kit for evaluation purposes. The kit includes hardware and software, debug and test tools, approvals, application examples and test reports.

Detailed information about the M95 quad-band GSM/GPRS module is available from MSC. MSC VERTRIEBS www.msc-ge.com

IR’s Compact PowIRaudio™ Modules Reduce Component Count, Shrink PCB Size up to 70 Percent and Simplify Class D Amplifier Design International Rectifier has introduced the PowIRaudio™ family of integrated power modules for high performance home theater systems and car audio amplifiers. The new devices integrate a PWM controller and two digital audio power MOSFETs in a single package to offer a highly efficient, compact solution that reduces component count, shrinks PCB size up to 70 percent and simplifies Class D amplifier design.

The combination of an advanced audio controller IC with MOSFETs fully optimized for audio performance results in improved efficiency, THD, and EMI, allowing the IR43xxM family to operate without a mechanical heatsink over a wide power supply range on either a single or split power supply. High voltage ratings and noise immunity

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ensure reliable operation over various environmental conditions. The single channel IR4301M and dual channel IR4302M offer the flexibility and convenience of building stereo amplifier and multi-channel designs in various channel con-

figurations, while the devices’ 5x6 mm and 7x7 mm PQFN packages enhance the benefit of utilizing a smaller size of Class D topology.

INTERNATIONAL RECTIFIER www.irf.com

EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

Mouser delivers latest USB 3.0 Technologies: Cypress EZ-USB® FX3 and NXP USB 3.0 SuperSpeed re-driver Mouser Electronics, Inc., announced that it is stocking the EZ-USB® FX3 SuperSpeed USB Controller from Cypress Semiconductor as well as the USB 3.0 Re-Driver from NXP Semiconductors.

The Cypress EZUSB FX3 is the next-generation USB 3.0 peripheral controller that enables developers to add USB 3.0 device functionality to any system.

The FX3 has a fully configurable General Programmable Interface (GPIF™ II), which can interface with virtually any processor, ASIC, image sensor or FPGA. GPIF II provides easy and glueless connectivity to popular industry interfaces such as synchronous Slave FIFO, asynchronous SRAM, asynchronous

and synchronous Address Data Multiplexed interface, parallel ATA, etc. The FX3's programming flexibility makes it an ideal solution for any USB 3.0 device. The Cypress EZ-USB FX3 Development Kit provides complete hardware and software solutions for accelerating the firmware and device driver development for the FX3 device. It can be used to start hardware or software integration and build final systems after the integration phase is complete. The kit contains the Development Kit PCB, a USB 3.0 A to Micro B cable, the Quick Start Guide, a Kit CD, and a 5V DC adapter MOUSER ELECTRONICS www.mouser.com

Silicon Labs Announces Customer-Friendly Microcontroller Die Sales Program Silicon Laboratories Inc. introduced a customer-friendly microcontroller (MCU) die sales program, accelerating time to market and giving customers another option for small-footprint designs. Silicon Labs’ new die sales program has a minimum order quantity of only one wafer unlike typical die sales programs that require very high-volume orders to qualify. The program is available for the company’s 8-bit 8051-based mixed-signal MCUs and new 32bit Precision32™ product family based on the ARM® Cortex™-M3 core. Silicon Labs’ die sales program offers a unique mixed-signal test methodology at probe that enables fully tested die to be sold in wafer form. All wafers are tested to the same levels as packaged MCU products. In addition, customers have the option of

requesting factory programming of unpackaged die to further speed time to market.

“Many customers prefer the option of buying MCUs in die form because it gives them greater flexibility to optimize for space-constrained designs requiring small form factors and to implement

their own custom packaging in module applications,” said Mike Salas, vice president and general manager of Silicon Labs’ microcontroller products.

SILICON LABORATORIES www.silabs.com

ACTIVE COMPONENTS INDUSTRY NEWS

Silicon Labs Delivers Industry’s first Isolated Analog-to-Digital Converters for AC Mains Monitoring Silicon Laboratories Inc. introduced the industry’s first isolated 10-bit analog-to-digital converter (ADC) products designed specifically for the demands of mains line monitoring. The new Si890x family combines Silicon Labs’ patented CMOS-based digital isolation technology and its proven ADC technology to create a robust line voltage monitoring and protection solution for power management applications such as solar power inverters, switched-mode and uninterruptible power supplies, and industrial applications with sensors in high-voltage areas requiring isolated data acquisition. Isolated ADCs are essential for applications where the power drawn from the ac mains must be monitored. The most common solution for these applications today uses a current transformer coupled with discrete compo-

nents and a data converter – a bulky approach that drives up the size and complexity of power supplies. While standalone ADCs are available, they require external galvanic isolators to connect

to the mains or other high-voltage systems. Other vendors offer isolated ADCs optimized for motor control, but these devices are too costly for the mains monitoring market. Silicon Labs engineered the Si890x isolated ADCs to meet the needs of the mains monitoring market in ways no other vendors have addressed.

SILICON LABORATORIES www.silabs.com

New dual MOSFET from Advanced Power Electronics Corp. simplifies synchronous buck converter design Advanced Power Electronics Corp. (USA), a leading manufacturer of MOS power semiconductors for DC-DC power conversion applications, has announced the new AP6922GMT-HF-3, a space-saving dual MOSFET for synchronous buck converter applications, with both the highside (control) FET and low-side (synchronous) FET in one single 5×6mm PMPAK package.

AP6922GMT-HF-3 is a rugged device combining fast switching, low on resistance and cost-effectiveness. The control MOSFET (CH-1) has a drain-source voltage rating of 30V, a maximum onresistance of 8.5mΩ, and a continuous drain current rating at 25°C of 15A, and has been chosen to optimise switching performance.

The synchronous MOSFET (CH-2)

also has a drain-source voltage rating of 30V and a continuous drain current rating at 25°C of 25.7A, with a maximum onresistance of 3.8mΩ to minimise

conduction losses. The reduced parasitic inductances as a result of the short internal conduction paths also contribute to improved performance.

ADVANCED POWER ELECTRONICS www.a-powerusa.com

Cutting edge technology – Avnet Embedded presents round Memory LCDs from Sharp Avnet Embedded is introducing the new Memory LCD type LS010B7DH01 from Sharp, an ultra low-power display incorporating for the first time a circular active display area of 12,868 pixels. At a diameter of 1-inch (2.5cm) with 128 × 128 pixel the new Memory LCD provides excellent resolution and a sufficient display area for the full graphic black and white visualization of content. Excellent legibility in all light conditions is ensured by the 14:1 contrast ratio of the high reflectivity LCD. Thanks to the display area’s 0.25% transmissive ratio, the new Memory LCD can be fitted with a backlight so that the screen content can be easily recognized in the dark. With its circular shape, the LS010B7DH01 is particularly suitable for wrist-worn devices requiring extended runtimes.

These include not only wristwatches but also endurance and

mountain sports computers as well as medical tele-monitoring devices. The circular Memory LCD can also be used as screen for E-bikes speedometers, fitness equipment or thermostats.

Like all Memory LCDs, the LS010B7DH01 features very low power consumption with a mere

10 μW for static images, and, even with a regular display content refresh rate of 1 Hertz, the LCD consumes only 45 μW. AVNET EMBEDDED www.avnet-embedded.eu

XP Power eases product compliance to 3rd edition medical safety standards with 2 × MOPP XP Power announced that its 25W to 2500W medical power supply products have been approved to the new IEC60601-1 3rd edition standard. In contrast to other manufacturers who may only provide 2 × MOOP (means of operator protection), XP Power's medical safety compliance extends to providing 2 × MOPP (means of patient protection). Also available are the complete risk management files required by the 3rd edition. The provision of these files remove the burden and expense typically placed on the end-product designer in achieving product compliance. IEC 60601-1 is the harmonized standard for medical electrical equipment that has been adopted globally. In Europe the new 3rd edition standard is mandatory from June 1, 2012, and will apply to both new products introduced after that time as well as products already in existence. All of XP’s medical power supplies are now approved to EN60601-1:2006 to meet this requirement. In Canada the stan-

dard CAN/CSA C22.2 No. 601.1 will be used to signify their products meet the new requirements and their effective date is the same as the EU on June 1, 2012.

Manufacturers of medical equipment need to be aware of the major changes required in moving from the existing 2nd edition medical safety approval to the 3rd edition standard as the standards are very different.

XP POWER www.xppower.com/medical

www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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PASSIVE COMPONENTS INDUSTRY NEWS

Vishay Intertechnology Launches New Non-Zero Crossing Phototriac Optocouplers in Compact, Environmentally Green SOP-4 Package Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the release of new non-zero crossing phototriac optocouplers in the industry-standard miniflat SOP-4 package, saving up to 66% in PCB space compared to devices in the DIP-6 package. The new VOM160 and VOM305x series offer three choices of input trigger LED current: 5 mA (VOM160NT/VOM3053T), 7mA (VOM160PT), and 10mA (VOM160RT/VOM3052T).

With a package height of only 2.0mm, they feature a blocking voltage of 600VAC for high-voltage applications. In consumer applications, the VOM160 and VOM305x series will be used for turning on and off motors and solenoid control in refrigerators, washers, lamps, and coffee makers. The new devices will also be

used to drive TRIACs for solidstate relays and static AC power switches in industrial applications.

The VOM3052T and VOM3053T, with their high static dV/dt of 1500 V/μs, are particularly well suited for noisy environments where a lower dV/dt can cause a thyristor to be triggered as a result of a high slew rate transient on the output load, even without any triggering signal on the input.

VISHAY INTERTECHNOLOGY www.vishay.com

Vishay Intertechnology Releases Industry's First Panel Potentiometer With Variable Resistor and Switch Included in Built-In Knob Vishay Intertechnology Inc. announced a new panel potentiometer that is the industry's first to include a variable resistor and switch incorporated into a built-in knob. The Sfernice P16S potentiometer is designed for military, professional audio, and industrial applications that require volume, speed, intensity, and voltage controls in a compact design — such as portable equipment, communication headsets, night-vision goggles, and cockpit panels.

Featuring a compact, fully sealed, and panel-sealed construction, the Vishay Sfernice potentiometer released today is a revolutionary concept in panel mounted potentiometers. Its unique design consists of a knob driving that incorporates a cermet or conductive plastic potentiometer. Only the mounting hardware and terminals are

situated on the back side of the panel, which keeps the required clearance to a minimum and makes it ideal for small, low-profile, low-weight equipment.

The P16S offers a power rating to 1W at + 40°C and TCR of ±150 ppm/°C typical, with high dielectric strength of 2.5kVrms.

The device is available in 7mm bushing length (15mm inside equipment) with a 16mm knob diameter, and offers a temperature range of - 40°C to + 125°C. It is RoHS-compliant and lead (Pb)-free.

VISHAY INTERTECHNOLOGY www.vishay.com

26 EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

AVX launches industry’s first 63V and 75V SMD Polymer Tantalum capacitors for high voltage applications AVX Corporation has developed the industry’s first 63V and 75V single-anode tantalum polymer capacitors. Part of the TCJ Series polymer tantalum capacitors, these new surface mount devices (SMDs) deliver high capacitance, high voltage and low ESR values in a small case size.

Available in 1uF/63V, 4,7uF/63V, 10uF/63V and 4.7uF/75V, 6.8uF/75V rated voltages, the TCJ Series polymer tantalum capacitors maintain 20% recommended voltage derating, thus significantly extending the usable voltage range. This unique combination brings polymer tantalum technology to a number of new applications and enables the development of a new generation of power supplies.

The TCJ Series high voltage

capacitors feature reduced ignition failure mode, making them more robust and less likely to overload. The TCJ Series polymer tantalum capacitor maintains high reliability exceeding 1% per 1000 hours at 85ºC and full-rated

voltage. In addition, SMD technology provides the advantages of small case sizes and low profiles for high-speed pick and place during manufacturing.

AVX www.avx.com

Vishay Introduces New 940nm Reflective Optical Sensor With Detection Range From 0.2mm to 5mm in Miniature 3.4mm by 2.7 mm by 1.5mm SMD Package Vishay Intertechnology, Inc. introduced a new reflective optical sensor with transistor output in a miniature SMD package.

Measuring just 3.4mm by 2.7mm by 1.5mm, the TCNT2000 offers a detection range from 0.2 mm to 5mm for consumer, industrial, and computer applications. By utilizing Vishay's high-efficiency 940nm emitter chip, the TCNT2000 provides a typical CTR of 4%, outperforming competing devices by a factor of 2.

With its high CTR, the device provides designers with the option of increasing the detection range, or driving the device at lower drive currents to reduce power consumption without incurring performance losses. The TCNT2000 features a compact construction with its emitting light source and silicon phototransistor detector

arranged in the same plane. The sensor's analog output signal is triggered by detection of reflected infrared light from objects 0.2mm to 5mm away (within > 20% of peak collector current). The TCNT2000 offers a built-in daylight blocking filter, which greatly suppresses dis-

turbing ambient light to increase the signal-to-noise ratio, while keeping the maximum spectral sensitivity at the operating wavelength of 940nm.

VISHAY INTERTECHNOLOGY www.vishay.com

PASSIVE COMPONENTS INDUSTRY NEWS

CRYSTEK Achieves Phase Noise Benchmark of -168dBc/Hz with CCHD-950 HCMOS Clock Oscillator Development

Miniature AEC-Q200 qualified varistor from AVX optimized for FlexRay™ communication BUS systems

Crystek Corporation’s Ultra-Low Phase Noise CCHD-950 Series HCMOS Clock Oscillator pushes the phase noise performance benchmark with a -168 dBc/Hz noise floor (100 MHz model).

The CCHD-950 generates frequencies between 45 MHz and 130 MHz, with 50 MHz, 80 MHz, 100 MHz and 130 MHz offered as standard. A high-Q crystal and 3rd overtone technology provide the ultra-low phase noise and low-jitter performance, making the CCHD950 very useful in synthetic instrumentation such as VXI/PXI. Generating no sub-harmonics, the CCHD-950 requires an input supply voltage of 3.3Vdc con-

AVX Corporation has developed a miniature 0402 varistor specifically for FlexRay™ Communication BUS Systems used in automotive applications.

The AEC-Q200 qualified Flexray Automotive Varistor Series automotive varistors combine ESD protection with EMI/RF filtering and insertion loss characteristics to protect against transients on high-speed data lines up to 10Mbps. The Flexray Auomotive Series varistors provide protection during jump-start and are capable of withstanding multiple transient strikes while providing sub-1nS response to ESD strikes.

A suitable drop-in replacement for diode protection, the compact Flexray Automotive Varistors Series deliver superior transient clamping. “This Flexray varistor series offers engineers a more robust solution for the faster digital serial bus systems currently being designed into today’s vehicles,” said Mike Muir, North American product manager at AVX.

suming 15mA of current. This high performance oscillator is available in an FR5 9×14mm SMD package. An extended temperature operating range of -40°C to +85°C is also available.

Applications include high definition TV, avionics, low phase signal sources, and test & measurement.

CRYSTEK www.crystek.com

Global Advanced Metals joins the AVX “Solutions for Hope” project AVX Corporation, a leading manufacturer of advanced passive components and interconnect solutions, has announced that USbased Global Advanced Metals’ tantalum processing division, (GAM Technology), the first tantalum smelter to achieve EICC/GeSI Conflict-Free Smelter validation in December 2010, has joined the AVX “Solutions for Hope Project.” GAM Technology will process the fourth shipment of validated conflict-free tantalite ore mined from the world’s first BGR Green Flag validated tantalum mine site, the Mai Baridi/Luba mine complex in the Katanga region of the Democratic Republic of the Congo (DRC). This particular site utilizes the ITRI Tin Supply Chain Initiative’s (iTSCi) “bag and tag” scheme, which subjects all tantalum ore set for export to a final-stage independent on-theground assessment.

The “Solutions for Hope Project,” established in July 2011, works with leading OEMs such as

Motorola Solutions, Intel, and HP to deliver a “closed-pipe” process for delivering conflict-free tantalum material from the DRC under the Organization for Economic Cooperation and Development (OECD). Incorporation of the independently-validated Conflict-Free Smelter (CFS) program was noted by the US Ambassador to the DRC, Barrie

Walkley, in his keynote speech to the EICC/GeSI in April 2012. “We strongly commend the leading efforts of the companies behind the Solutions for Hope project, including AVX, Motorola, HP and MMR,” Walkley concluded.

AVX www.avx.com

“By accommodating data rates that are up to 10 times faster than current controlled area network (CAN) BUS systems, AVX is leading the

way in circuit protection devices for today’s most demanding automotive applications. The 0402 case size also demonstrates AVX’s ability to meet the need for miniaturization in these critical applications.”

AVX www.avx.com

VPG's Extreme Pressure-Cooker Test Highlights Stability, Robustness of Hermetically Sealed Bulk Metal® Foil Resistors Vishay Precision Group, Inc. announced that its Vishay Foil Resistors (VFR) brand has unveiled a new video highlighting the stability of hermetically sealed Bulk Metal® Foil resistors.

The short video demonstrates how VFR's VHP100 resistor experiences no change in resistance after being immersed in 100% humidity under high pressure within a pressure cooker for one hour.

VFR's hermetically sealed foil resistors not only prevent moisture incursions, but they maintain their hermeticity under extreme conditions to hold their original resistance value after exposure to high temperatures as well as humidity. In the video demon-

stration introduced today, the resistance of a VFR 10 kΩ VHP100 hermetically sealed resistor is measured at room temperature (+70°F/21°C). The resistor is then placed in a pressure

cooker set to +250°F (+121°C).

After an hour, the VHP100 is removed and measured again, showing absolutely no change in resistance (<1 ppm measurement accuracy).

VISHAY INTERTECHNOLOGY www.vishay.com

www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

27

SMT PRODUCTION

Using Essemtec’s SMD Tower for IGBT Storage in a Clean Room ABB Semiconductors in Lenzburg, Switzerland, long searched for a suitable production storage system for HiPak IGBT modules production. Project Manager Prabath Lewdeni found the SMD Tower by chance. Its supplier Essemtec re-engineered the SMD component storage system into clean room storage for ABB. 18th century writer and adventurer Giacomo Casanova said that we owe the best things to chance. This holds true for ABB — a coincidence brought the end to a long search for a suitable storage system for the production of HiPak IGBT modules in Lenzburg.

washing baskets, which are identified with a barcode. For production, the specific baskets

holding the required IGBTs are required from the buffer store.

Background The HiPak from ABB Semiconductors is a highperformance semiconductor switching module for high current and voltage, and is known worldwide for its extremely short switching time and reliability (Figure 1). Therefore, the product is used where high power must be switched fast, for example, on a train or in a wind power plant.

Figure 1 HiPak IGBT Modules from ABB Semiconductors switch high voltage and current especially quickly and reliably.

A HiPak module consists of several IGBT modules that must switch simultaneously and in absolute synchronization. Therefore, it is important that all IGBTs within a HiPak have the same properties. ABB measures and marks each IGBT individually and stores its characteristic in a database. This ensures that only suitable IGBTs are combined in a HiPak module.

Buffer Store Automation During production, the IGBT modules are placed in a buffer store for one to two days (Figure 2). The IGBTs are held in so-called

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EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

Figure 2 The production process for HiPak modules requires a buffer storage with a capacity of 1 - 2 days.

SMT PRODUCTION

Previously, the buffer was a simple shelf where the baskets were moved in and out by hand.

However, using this method, it was not possible to store the IGBTs in an inert gas atmosphere as recommended.

Furthermore, the constant searching for the right baskets was time-consuming, cumbersome and prone to errors.

and redundancy. So Lewdeni continued searched for something better. He found the solution - by coincidence - in another industry.

Coincidence Leads to a Solution During a visit to Essemtec AG, the leading Swiss manufacturer of production systems for electronics, Lewdeni learned about the SMD

area from the environment, allowing an inert gas atmosphere with controlled temperature and humidity to be formed within.

The Tower features a small footprint of only one square meter and several Towers can be grouped for larger scale storage. For Lewdeni, this was the ideal solution for HiPak production at ABB Semiconductors. However, it still needed a few modifications.

Flexible Adaptation to ABB’s Requirements SMD reels are round, thin and have very exact measurements. ABB’s washing baskets are the complete opposite. They are square, thick and their sizes differ by several millimeters. Also, a clean room atmosphere is not likely for an SMD production. Therefore, the SMD Tower could not be used “out of the box.”

Essemtec has many years of experience in customer-specific adaptation of standard machines.

The engineers constructed and build a new gripper arm for the washing baskets.

The height of the lock and the position of the barcode reader were adapted.

Additionally, the Tower was made clean room compatible.

Figure 3: A lock prevents manual access and allows a controlled storage climate within the Tower.

Connection to the Production Control System ABB Semiconductors uses a special control system, Manufacturing Execution System (MES), with which all machines must be able to communicate. The Tower offers an open WebService-Client interface that a user can implement for such purposes. Therefore, ABB was able to integrate the Tower to the MES easily and by themselves.

The adaptation by Essemtec and ABB took only a few weeks. In February 2012, Essemtec delivered two Towers in advance for installation and testing. The installation went smoothly.

“Normally, we have to fight a few days with new machines, but not with the Tower,” recalls Lewdeni. In April 2012, the remaining Towers were delivered and installed.

24/7 Continuous Operation A total of eight Towers are currently in operation for the HiPak production (Figure 4). Seven of them are productive, and the eighth can be placed into operation to replace another during maintenance. In this configuration, the buffer storage is ready for the 24 hour/7 day production.

Figure 4: The Tower storage is easily expandable by adding another module.

Storage control is accomplished with a single computer.

Prabath Lewdeni, process engineer for ABB Semiconductors, was looking for alternatives.

For a long time Paternoster systems was the only choice. However, these were unable to fulfill ABB’s requirements regarding inert gas atmosphere, access protection, scaleability

Tower, which is an automatic and scaleable storage system for electronic components in the form of reels and trays.

Storage and retrieval is possible only through a lock (Figure 3). This lock secures access to the stored material while separating the storage

Awareness and a coincidence helped ABB find the right system for its HiPak buffer storage. But only the flexibility, the adaptability and the scaleability of the Tower storage system has ensured that all ABB Semiconductors’ requirements were met with one simple, robust system.

www.essemtec.com www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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SMT INDUSTRY NEWS

Juki Goes All Out for Its 25,000th Shipment at JISSO PROTEC 2012

ESCATEC now offers Package-onPackage capability

Juki Automation Systems, Inc., a world-leading provider of automated assembly products and part of Juki Corporation, participated in Juki’s 25,000th machine shipped celebration that has been held in conjunction with the JISSO PROTEC 2012 exhibition, at the Tokyo Big Sight in Japan.

JAS, Inc. hosted Scott Fillebrown, President of ACD, David Lane, Chief Technology Officer of Oncore Manufacturing Systems, Francisco Saralegui, SMT Manager of Newsan, and Adriån Lamandia, CEO of Novatech, as its guests of honor. Under the concept of 3E evolution: Easy, Economical, Expandable, Juki showcased cutting-edge products that improve productivity and quality. New products displayed for the first time include the TR7D High-Speed Matrix Tray Server and MDS Matrix Tray Server designed specifically for

ESCATEC, the EMS innovator, has added Package-on-Package (PoP) capability to its production facilities at Heerbrugg in Switzerland.

PoP enables one BGA package, such as a memory chip, to be soldered on top of another BGA, such as a processor.

die components to present the wafer or waffle tray directly to the machine. Both the TR-7D and MDS are designed to feed parts via shuttle at the rear of the machine. The TR-7D highspeed matrix tray server is equipped with dual magazines and drive systems to present two different trays simultaneously.

This method is required to meet the increased IC placement speed of the KE3020V and to eliminate wasted time during tray exchange while increasing the efficiency of placement.

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PoP stack after flow soldering ESCATEC has invested in a special Dipping unit for their new Siplace assembly line that will enable them to do PoP. The dipping unit wets about 50% of each ball of the Ball Grid Array with paste/flux. Before reflow, Xray of PoP stack The darker balls are from the upper BGA and the lighter balls are from the lower BGA.

PoP stack before soldering JUKI www.jukiamericas.com

Computrol Installs Second KISS 103 Selective Soldering System at Meridian Facility Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronics manufacturing services to OEMs, recently installed another KISS 103 Selective Solder System from ACE Production at its manufacturing facility in Meridian, Idaho.

Additionally, the company purchased a spray fluxer for mini-wave applications for both its new and existing KISS 103 Selective Solder units. Computrol’s purchase of the first KISS 103 eliminated masking and hand soldering, resulting in significant time savings and leading to the decision to invest in a second unit. The production of boards that required skilled employees

both components are stacked on each other and then both are soldered in one process step.

During the soldering the upper device sinks down so that, in the final assembly, there is virtually no gap between the two stacked chips. Verification of accurate bonding between the layers of the PoP stack is checked using XRay inspection.

to hand solder/fountain now are being run on the KISS 103, allowing the skilled employees to focus on other higher-level work. As a result, Computrol is experiencing substantial improvements in time

standards as well as consistent quality of the boards soldered on the KISS 103.

COMPUTROL www.computrol.com

EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

ESCATEC www.escatec.com

MARTIN’s EXPERT 04.6IXM: Reworking Heavy Substrates The new EXPERT 04.6IXM was introduced at SMT Nuremburg 2012 and created a lot of interest. Single-sided printed circuit boards (PCBs) are placed on a glass plate, which is heated with IR radiators rated at up to 3000W. This results in very rapid heating, even when processing large aluminium or ceramic substrates (suitable for sizes between 30 × 30 mm and 300 × 300 mm).

The system is designed for applications where substrates need to be heated quickly to temperatures up to 200°C and without overshoot. LED rework, for example, benefits from high substrate temperatures to facilitate the removal and

replacement of individual components from an array.

Two manipulator arms, each with a movement lock, individually carry the placement tool and hot air solder pen to cover the entire working area. Small components can effortlessly be picked up from a dispenser and precisely placed on the PCB with manual alignment. Optimized soldering tools precisely deliver hot air to the solder joints for gentle heating.

MARTIN www.bgarework.com

SMT INDUSTRY NEWS

GPD Global to Demonstrate World-Class Dispensing Systems at SEMICON West 2012 GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, lowvolume/high-mix and R&D production, announces that it will exhibit in Booth #6085 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

See a live demonstration of the new Island 3S benchtop manufacturing solution. The dispense system features a large work area of 12" x 16". The system features a new easy-to-use touch screen interface and will be configured with a PCD dispense pump for LED manufacturing. GPD will have a display of dispense pumps to cover a wide range of dispensing applications. The Hyflow dispense pump is ideal for heavy

fluids such as thermal grease, the MicroDot valve will be on display for precision small volume dispensing such as conductive adhesives and solder pastes.

Additionally, the Syringe mixing system format is ideal for gaining homogeneity of fluids such as silicone with phosphor.

GPD GLOBAL www.gpd-global.com

SEHO Systems Introduces the CostEffective, Energy-Efficient PowerWave N2 SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, debuting the new PowerWave N2 with the SEHO tunnel concept for reduced nitrogen and energy consumption.

The PowerWave N2 is equipped with a closed tunnel system. The special design of the stainless steel tunnel results in low nitrogen consumption. The innovative tunnel insulation ensures very high energy efficiency, a clear advantage for production costs.

Hinged heat-resistant glass covers not only make for a very attractive design but also allow for ideal accessibility to all machine areas. The PowerWave N2 features an innovative fluxer unit that reduces flux consumption remarkably, and simultane-

ously makes for low maintenance requirements. The spray fluxer with HVLP technology (high-volume – low pressure) ensures a stable spray jet and a very precise spray pattern even at the outer edges of the printed circuit boards (PCBs). This allows a reproducible fluxing process with considerably reduced flux con-

sumption. Additionally, alcoholbased as well as water-based fluxes can be processed without any problems.

SEHO SYSTEMS www.seho.de

Nordson DAGE to Exhibit Bond Test and X-Ray Solutions at SEMICON West 2012 Nordson DAGE, a division of Nordson Corporation, announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California. Featured at the show will be the Nordson DAGE 4000Plus Bondtester – the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting. Also on display will be the Nordson DAGE XD7600NT Diamond X-ray Inspection System. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube,

providing 0.1μm feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector makes this system the choice for the highest performance and highest magnification imaging tasks. The vertical system configuration, with the X-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications.

NORDSON DAGE www.nordsondage.com

Multitest’s InCarrier™ Is Now Available in a Wide Range of Loading and Unloading Configurations Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its InCarrier™ Loader/Unloader is available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination. Additionally, partner solutions for loading from wafer ring or unloading into tape-andreel can be offered. The Multitest InCarrier is a unique test handling solution that combines the substantial advantages of the strip handling process with the advantages of the standard test handling process. The concept of the InCarrier consists of a tray/carrier into which singulated ICs are loaded to be test-

ed in the InStrip®, Multitest’s high parallel strip test handler. Finally, the tested ICs are unloaded into the final packaging and shipping medium. Multitest offers the InCarrier™ Loader/Unloader tool for these processes.

The InCarrier™ is a unique solution for stable, high parallel test handling of semiconductors and sensors in the smallest packages down to 1.2 × 1.2 mm.

MULTITEST www.multitest.com

www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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SMT INDUSTRY NEWS

Virtual Industries Announces Show Special for AAT Expo Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, will highlight the Small Part Handling Kit in Booth #1047 at the upcoming Assembly & Automation Technology Expo, scheduled to take place June 19-21, 2012 at McCormick Place North in Chicago, IL. The Small Part Handling Kit (TV1000-SP8BD-MAG1), the company’s show special, is for parts as small as 01005.

This generalpurpose vacuum handling tool plugs directly into 110 V 50/60 Hz. The compact unit will handle a variety of optics, ball lenses and SMT parts used in the industry today. The kit includes a set of rubber tipped vacuum tips as well as a set of eight small parts tips. As a special at the show, all Small Part Handling Kit purchases will come

with a free 2.5X lighted magnifier that runs on three AAA batteries (included).

With the Small Part Handling Kit, parts as small as 0.05" (0.10 mm) are handled without damage. A vacuum tweezer eliminates lost parts associated with mechanical tweezer handling. The long-life

diaphragm vacuum pump generates up to 10" of mercury with an open air flow of 2.3 lpm. The unit connects to ground automatically with a three-wire power cord.

VIRTUAL INDUSTRIES www.virtual-ii.com

Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement.

As a result, Practical Components has introduced the PBGA 928HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4×4 body size, 928 balls and a single small die that has a propensity toward the ballin-socket HiP soldering defect.

The HiP effect takes place when the solder joint and the sphere are touching but no intermetallic layer is formed. Lead-free assemblies have increased warpage due to their higher processing temperatures. Mastering the correct soldering profile and paste is essential.

PBGA 928-HiP is maximized to create the HiP effect due to

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component warpage with its large plastic body size combined with the small single die.

This combination creates the maximum thermal expansion mismatch.

These components have a 1.0 mm pitch with perimeter ball alignment and the tray quantity is 21. Minimum order quantities may apply.

PRACTICAL COMPONENTS www.practicalcomponents.com

EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

Engineered Material Systems Debuts UV Cure Adhesive for Disk Drive, Camera Module, Optoelectronic and Circuit Assembly Applications Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces 53510M-1 UV Cured Adhesive formulated for disk drive camera module, optoelectronic and circuit assembly applications.

535-10M-1 is an ultra low stress, lower glass transition temperature version of the 535-10M UV Cure Adhesive. The material is designed to eliminate any “crowning” (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in the head stack assembly. The material also can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new nonconductive UV

cured adhesive cures rapidly when exposed to high-intensity UV light. 535-10M-1 is a low outgassing, extremely flexible, high-strength epoxy adhesive that does not contain antimony.

The 535-10M-1 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 53510M-1 is the latest addition to

Engineered Material Systems extensive line of electronic materials.

ENGINEERED MATERIAL SYSTEMS www.conductives.com

Get Proven Results with Kyzen’s AQUANOX® A4520 Advanced Packaging Chemistry – Learn More at SEMICON West 2012 Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will feature the proven technology of its AQUANOX® A4520 in Booth #6453 in the North Hall at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

A4520 is a highly tested aqueous cleaner for flip chips and advanced packaging that has proven to be effective on all lead-free, no-clean, and eutectic materials when run at low temperatures and low concentra-

tions. Easy to use, it is effective without the use of sump-side additives and provides brilliant joints. A4520 is widely used in

military applications or anywhere a robust cleaner is needed for the harder to clean fluxes.

KYZEN www.kyzen.com

SMT INDUSTRY NEWS

Cobar Solder Products Exhibited Leading Technologies at SMTA Upper Midwest Expo & Tech Forum 2012

Kyzen to Feature Its Award-Winning Cleaning Chemistries at NEPCON West China 2012

The Balver Zinn Group announces that Cobar Solder Products Inc. exhibited its leadfree SN100C-XF3+ solder paste and wire at the SMTA Upper Midwest Expo & Tech Forum.

Kyzen announces that it will feature its award-winning LONOX® L5611 stencil cleaning chemistry and AQUANOX® A4703 neutral pH aqueous cleaning chemistry in booth #B06 at the upcoming NEPCON West China 2012 exhibition and conference.

The event is scheduled to take place June 19-21, 2012 at the new International Convention & Exposition Center in Chengdu.

LONOX® L5611 is an aqueous blend cleaning chemistry designed for optimum effectiveness on removing flux, solder paste and uncured adhesives from stencils and misprints. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature to provide an economical cleaning solution.

LONOX® L5611 is compatible

Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints

reminiscent of leaded solders. It also exhibited a robust printing window.

SN100C- XF3+ performs better in eliminating voiding when compared to any SAC-alloy.

XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.

Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.

COBAR www.cobar.com

with most standard stencil cleaning equipment and can be used in immersion, spray-in-air as well as ultrasonic systems. LONOX® L5611 is a biodegradable low VOC aqueous solution. It contains no CFCs or HAPs. As an aqueous cleaning solution designed with a pH neutral formulation, AQUANOX® A4703 is

combined with Kyzen’s inhibition technology to provide superior material compatibility.

KYZEN www.kyzen.com

CONNECTORS INDUSTRY NEWS

ODU-MAC Modular Connector System The ODU-MAC modular connector system, manufactured by ODU, is equipped with a range of combination possibilities and with particular modules: customizable frames, plastic insulation bodies and removable crimp contacts for power, signal, coax, air couplings and fiber optic connections. The connectors are equipped with spring wire contacts, which allow up to 100 000 mating cycles. ODU-MAC modular connectors are available in aluminum frame or DIN housing.

Main characteristics: • Extremely high mating cycles (>100.000).

• Vibration protection and stability.

• Easy operation.

• High connector density, low space requirements.

• Alu-frame and Din-housing available.

ODU-MAC in aluminum frame • The docking solution: Possible lengths up to 182.5 mm

Modules - individually put together

ODU-MAC in DIN housing with spindle locking • For simple operation Size II to IV

ODU-MAC in DIN housing with lever locking • For simple operation Size I to IV

Signal, power, HF, fiber optic, bus and pneumatic modules are some of the modules that can be built into ODU-MAC.

For further details please visit the company website - online catalog.

Together we can find the perfect solution!

Contact: E­mail: sales@odu­rom.ro www.odu­rom.ro

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ODU ROM Manufacturing ­ Str. Fundătura Lânii nr. 22, 550019 Sibiu, Romania Tel: +40(0)269 206345; Mobile: +40(0)748 144488; Fax: +40(0)269 221006 For general information visit: www.odu.de

SENSORS DESIGN

Optical fibres and optical fibre sensors Together with the advance of science and technology, the demand for the most optimum information carrier has grown incredibly fast, for long distances in particular.

Optical fibres turned out to be an ideal solution.

As far as the quality of information transfer is concerned, optical fibres are much more advanced than other methods of signal transmission. It results from the fact that light transmission is insensitive to any interference of electromagnetic field influences. It is particularly important in industrial environment which, as a principle, is packed with various types of electromagnetic interferences.

Another reason for using optical transmission of signal is the possibility of using a very wide band. In optical fibres for transmission of data, instead of electrical current, properly modulated light beam. It helps to achieve bandwidth of 3 Tb/s and considerably extends the distance of transmission without using any kind of amplifiers.

Optical fibre structure Optical fibre is a kind of a cable-connection used for sending digital information in the form of visible light. It is made of the special type of quartz glass which is used for the production of optical fibre core. The core is covered by a mantle and protective layer.

The optical fiber’s principle of operation includes the use of two light conducting materials with various light reflection coefficients.

Reflection coefficient in the core is always higher than in the mantle, which ensures that light beam is maintained all the time inside the glass core, because the beam reflects from the surface of contact between glass and mantle, as a result of complete internal reflection and runs further through the glass until its opposite wall, where the story repeats itself. The mantle is covered with a Kevlar shield (lightweight but highly resistant polymer used for production of e.g. helmets, bulletproof jackets etc.) preventing cracks of the fibre and external PCV coating. A single optical fibre is responsible only for one-way transmission. The two-way transfer is possible with double optical fibers.

Optical fibres are made as single mode and multiple modes (a mode- a constituent “portion” of visible radiation). Due to the structure, they can be divided into: fibrous, laminar and bar, and due to the type of material into: glass, plastic and semi-conductive.

Optical fibre transmission principle Optical fibre transmission is connected with transmitting light beam, whose source is laser or e.g. LED. At the other side of the optical fibre, it is received by a light-sensitive element e.g. photodiode. In order to ensure proper and fast transmission, light beam is modulated.

It prevents possible signal interferences. In most cases, modulation is applied to: light wave intensity, frequency, polarization or phase.

Advantages and disadvantages of optical fibres The basic advantages of optical fibres include: 1. Huge information capacity of every single fibre and incredible data transfer speed (band width); 2. Low losses and capability of sending signals to long distances; 3. Complete resistance to electromagnetic interferences as well as absence of emission of

any interference; 4. Light weight and small dimensions; 5. The fact that they do not emit any interference makes them highly reliable and confidential means of information transfer. There is virtually no possibility of putting a tap on a phone; 6. More and more cost efficient – the optical fibres prices are continuously decreasing; 7. No sparking threat, safety at work; 8. High reliability; 9. Simplicity of operation; 10. They are becoming more and more common.

The disadvantages of optical fibres include, among others: 1. The existence of a phenomenon of dispersion in multi-mode optical fibres. This phenomenon includes broadening of the luminous flux as a result of separating its individual beams during refraction. Those beams, from the moment of their fission, start to move somehow “willfully” and they do not reach the receiver at the same time. A secondary effect of that dispersion is limitation of transmission band width. This is particularly disadvantageous in case of multi-mode cables, because in their case, the bandwidth is already limited by respective modes differing in run time. In connection to the dispersion inside the optical fibre, there is also little space and there is chaos. The smallest dispersion exists at the wavelength of 1.3 micrometers.

2. Natural dispersion of glass, existing in single and multi-mode optical fibers which are the result of changes of light refraction coefficient in glass, resulting mainly from glass defects – lack of uniform structure and also wavelength.

3. Damping – depending on the wavelength and thickness of optical fibre material.

Presently, the lowest theoretical damping takes place at the wavelength of 1.55mm and is equal to 0.16dB/km.

4. Complex and precision requiring process of assembling optical fibres: for connecting optical fibre parts, special couplers are used. www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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SENSORS DESIGN

They are applied in laboratory conditions, very precisely and in an environment free from any dust. This is particularly difficult in case of single – mode optical fibres, whose core is very thin. And to make the optical fiber work properly, one part of the core must centrally adhere its other part.

Optical fibre sensors operation principle In case of light beam modulation, external factor can influence it directly through the optical fibre structure (external modulation) or on a wave derived from the optical fibre (external modulation). In sensors with external modulation, optical fibre functions as an optical transmission channel providing and carrying away optical signal to the sensor’s head. In sensors with internal modulation, certain section of the optical fibre constitutes sensor’s head i.e. due to the external conditions influence on that part of the optical fiber; parameters of the propagated light wave also change.

Depending on the type of optical fibre used for the manufacturing of the sensor, different light wave parameters can be modulated.

Optical fibre sensor is a converter or a set of converters existing at the beginning of the measuring channel, which can receive information with the magnitude measured, described with several parameters and then process it into signal parameter changes at the output, and its structure contains the optical fibre.

Optoelectronic sensors as functionally defined appliances it according to the principle of operation is divided into: – Active i.e. with a structure containing optical signal source; – Passive i.e. with external source of light.

The output signal can be: – optical, – processed internally into electrical signal, including those with standardized parameters.

Block diagram of optical fibre sensor is presented by the following sketch:

Not every optical fiber sensor comprises of all the three converter types given in the above sketch, however, it must be at least the first one.

Optical fibre sensors are manufactured generally as parametrical (passive). Therefore, ancillary energy must be connected to the sensor.

Input signal generally causes a change of only one of the optical converter’s signal output parameters. Those sensors have properties which make them useful everywhere, where

36 EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

their use is difficult or even impossible for other sensors.

Basic features of optical fibre sensors include: – non-electrical input signal, – possibility of operation in flammable, explosive and chemically aggressive environments; – possibility of non-contact operation, – light weight and small dimensions, – resistance to electromagnetic interferences, – high processing sensitivity, – easy coupling with telecommunications systems.

Types of fiber optic sensors Classification of fiber optic sensors can be done according to different criteria, e.g. processing location, manner of receiving the information about measured magnitude and form of output signal.

1. Division according to the processing location: – with external processing, also called hybrid.

The role of optical fibre is to provide and carrying away light to and from the optical converter, e.g.: – reflection sensors, – with transmission change, – with complete internal reflection, – with diffraction gratings, – multi-mode polarimetric sensors.

– with internal processing, i.e. completely fibre optic. Optical fibre here, is, at the same time, a waveguide and optical measuring converter, e.g.:

– micro-bending sensors, – interferometric sensors, – Bragg’s special grating sensors.

2. The division according to the measured magnitude information receipt manner: – single – point e.g.: reflection sensors or sensors using optical fibre – optical fibre coupling level wastes; – multi – point: they use changes of wastes,

backward scattering intensity, polarization, fluorescence and others, e.g. multi-point sensors of transmission wastes are micro-bending sensors of force, pressure and offset; – with the continuous receipt in space – that is splitting sensors e.g. for measurements of stresses distribution in metal constructions and building structures, as well as for the measurement of temperature distribution in technical appliances and big size reservoirs.

Fibre optic sensors use linear and non-linear optical phenomena in optical fibres.

3. Division in accordance of output signal form: ● amplitude (intensity), ● phase (interferometric), ● frequency.

In fibre optic sensors with intensity modulation, the change of electromagnetic wave is a measure of the measured physical magnitude change. The advantage of those sensors is the fact that intensity modulation does not impose any conditions on light sources and receivers, it also does not require any additional sensor output signal processing, and the signal modulated by means of usual photodetectors.

A drawback of the sensors with amplitude modulation is their considerably lower sensitivity compared to sensors with phase modulation. Intensity sensors are commonly used as: micro-bend sensors, absorption sensors and transmission waste, or fluid refraction coefficient measurement sensors. The most common designs of intensity sensors include sensors with modulation of optical fiber- optical fiber coupling and refection sensors.

In case of sensors with modulation of optical fiber- optical fiber coupling, the measuring head is made of two optical fibres, whose ends are located opposite to each other. The intensity of light conducted through the two optical fibres depends on their mutual location. The amount of energy that is permeating from one optical fibre to the other depends on the shift of fibres axis, on the angle between the axes and on the distance between optical fibers’ fronts. The intensity of the light conducted through the optical fibres can be modulated by mechanical shift of optical fibres. The aberration (distance) of the optical fibre or movement of a stop can be proportional to the force, pressure and thermal expansion etc.

SENSORS

SENSORS

DESIGN

INDUSTRY NEWS

Reflection sensors constitute a large group of optical fibre sensors with intensity modulation. They are very common and often used in technological processes inspection – they are used for the measurement of vibrations, location, distance etc.

The basic elements of the sensor are: - Fibers beam or a single fibre providing light, - Fibers beam or a single fibre carrying away light, - Reflecting surface.

A beam of fibres or a single fibre providing light illuminates the reflecting surface. Reflected light penetrates receiving optical fibre beam.

Reflection sensors can be single or double fibre.

In case of single- fibre sensors, thanks to the use of a coupler, conveying optical fiber is at the same time off take optical fiber.

When the reflecting surface moves away from the measuring head, the intensity of radiation reflected from the surface and entering the offtake optical fiber.

Applications of fibre optic sensors At present, fibre optic sensors are used in most of industrial applications, in particular for: - Mechanical magnitudes measurements: pressure, stress, distance etc.

- Temperature measurement; - Chemical magnitudes measurements: chemical composition, pollution concentration, pH and others.

- Measurement of electrical and magnetic values: voltage, current, capacity, intensity and magnetic field direction, etc.

- Telecommunications and audio - video; - Measurement technology; - Signals processing circuits; - Medicine, electroengineering and power engineering; - Automotive, aviation and marine industry; - Multimedia appliances: PC’s displays and CRT displays; Optical fibre sensors have multiple advantages compared to traditional sensors: - Light weight and small dimensions, - High reliability, accuracy and sensitivity, - They are not the source of electromagnetic fields and are resistant to electromagnetic interferences, - Offer the opportunity of locating the signal source and detection system in long distance from the test point.

Transfer Multisort Elektronik Sp. z o.o. www.tme.eu export@tme.eu

Low-cost differential pressure sensor features high measurement accuracy Sensirion, the world's leading sensor manufacturer, has launched the SPD500 low-cost positive differential pressure sensor. This fully calibrated and temperature compensated sensor is suitable for measuring differential pressure in the range of 0 to 500 Pa and is able to detect even minute pressure differences (less than 10 Pa). With a zero-point accuracy of 0.2 Pa, the sensor offers both low cost and excellent specifications.

Integration of the sensor element and signal conditioning circuitry on a tiny CMOS silicon chip enables noise-free and precise amplification and digitization of sensor signals. As a result, the differential pressure sensor achieves extremely high meas-urement accuracy and outstanding long-term stability. The underlying CMOSens® technology allows the microchips to be produced in large volume at competitive end-user prices with

consistently high quality. With an accuracy of 4.5% of the measured value, zero-point stability and I²C digital output, the new differential pressure sensor is especially suitable for applications in the HVAC industry.

Like all other sensors in the SPD600 series, the new sensor is available in two different

versions. The SDP500 is designed to be screwed directly to a manifold with O-ring sealing, while the SDP510 is designed for tube connections.

SENSIRION AG www.sensirion.com/SDP500

Honeywell Introduces SS360NT/ SS360ST/ SS460S High Sensitivity Bipolar Latching Digital Hall Effect Sensor ICs Honeywell expands its magnetic position sensor product portfolio with the SS360NT/SS360ST/SS460S High Sensitivity Bipolar Latching Digital Halleffect Sensor Integrated Circuits. Bipolar latching magnetics make these products well-suited for accurate speed sensing and revolutions-perminute (RPM) measurement. For brushless DC motor manufacturers that need latching sensor ICs with reliable, consistent performance for efficient and small designs, Honeywell’s family of new High Sensitivity Latching Digital Hall-effect Sensor ICs respond to low magnetic fields and offer consistent repeatability while providing the fastest response to a change in magnetic field for enhanced motor efficiency. These new sensors offer reliable switching points with high magnetic sensitivity of 30 G typical (55 G maximum) without using chopper stabilization on the Hall element, resulting in a clean output signal and the fastest latch response time in its class.

These small, sensitive, and versatile devices are operated by the magnetic field from a permanent magnet or an elec-

tromagnet. They are designed to respond to alternating North and South poles. The SS360NT/SS360ST/SS460S can be used in a wide range of applications. Potential

industrial/commercial applications include brushless dc motor commutation, flowrate sensing for appliances, speed and RPM sensing, tachometer/counter pickup, motor and fan control, and robotics control. Potential transportation applications include speed and RPM sensing, tachometer/ counter pickup, motor and fan control, electronic window lifts, and convertible roof position. Potential medical applications include medical equipment that utilizes electric motors. These devices operate over the full temperature range of -40°C to 150°C [-40°F to 302°F].

HONEYWELL INTERNATIONAL www.honeywellnow.com www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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MISCELLANEOUS INDUSTRY NEWS

LSIS 400i - the smart camera from Leuze, now with new features The curent hardware and software have been extended. From now on, you can order models with IR ilumination, RGBW ilumination and a model for C-mount lenses. New characteristics have been added to the software.

LSIS with integrated IR or RGBW has the same characteristics as the standard model with the exception of the colour of the light. The IR version can be used for applications that bring better results in the infrared spectral range than with normal light. RGBW ilumination on the other hand, allows a bigger safety margin in testing due to the possibilty of selecting the right colour of the ilumination or even monochrome analisys.

The new models with C-mount lenses don’t have motorized focus adjustment, but they are very flexible when they are used together with lenses that have focal distances between 6 and 75mm. With this models you can read barcodes from a distance of up to 2m.

LSIS 400i model “C-Mount” To realize larger object distances, for example to read codes from a larger distance, now three C-Mount models of the LSIS 400i are available: BLOB analysis, Code reading and General Purpose.

Field of view from a distance of 1,5m with a standard device, 16mm focal length.

Field of view from a distance of 1,5 m with a C-Mount lens, 75mm focal length.

Please consider: • The C-Mount model has no internal illumination and no motorized focus adjustment • IP 65, IP 67 degree of protection is only achieved with mounted lens tube • The window of the lens tube is made of glass • For inspections with infrared illumination the default built-in infrared-blocking filter is replaced by a daylight-blocking filter, which is available as accessory.

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EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

LSIS 400i device model “infrared” For applications that bring better results in the infrared spectral range than with normal light, now there is a available a model of the LSIS 400i with integrated infrared illumination.

Long-wavelength light as electromagnetic radiation oscillates less frequently than short-wavelength light, and therefore shows less interaction with matter. It is therefore better able to go deeper into the material and produces less surface reflections as a short-wave light. IR radiation sometimes even shines through objects.

Since infrared radiation is not visible to humans, it can be used particularly well in areas where normal light would be disturbing, especially when it is operated flashed.

Typical applications • Backlight inspections with IR light of not completely transparent, but colored materials which have no more inherent color in the IR and thus will be (more) transparent.

• Surface inspection despite printing or slight pollution: many inks are invisible, cracks and defects on the surface can be found.

• Text-on-label presence on banknotes, credit cards, etc.

• Note: InkJet printing (expiration date, etc.) is inthe IR often no longer visible.

• Normal applications. But in combination with the integrated daylight filter they are now independent of the ambient light.

• Whether the use of IR-light helps to solve a certain application or not has to be tested in each individual case using real application samples.

Whether the use of IR-light helps to solve a certain application or not has to be tested in each individual case using real application samples.

Printed labels in normal light.

The writing of an applied sticker on the left label is almost invisible in normal light because of the printing on the label in the background.

The majority of the label printing disappears with infrared illumination. The printing on the sticker is

now very easy to see. The reason is that in the ink of the sticker printing IR-absorbing pigments are present but not in the ink of the label printing.

Milk carton in normal light

The ink jet printing of the expiration date and a part of the printing on the carton disappears with infrared illumination.

LSIS 400i device model “RGBW” The use of colored lighting sources is very common in industrial machine vision. A smart matching of colored light with the color of the test objects allows an increase (or decrease) of the contrast of certain colors. Thus colors can be better separated within the gray image. A red and a similar green then produce different shades of gray. For such applications, there is now a RGBW variant of the LSIS 400i.

Illuminating a certain area with the three colored quadrants red, green and blue of the LSIS 400i, results in white light in the overlap zone of the three colors.

Illuminating with two of the colored quadrants results in mixed colors according to the graphic depicted below depending on the color combination. This principle of light mixture is referred to as RGB model (each monitor is working to this principle).

In order to assess which colors of a test object appear lighter or darker at which illumination color, the color wheel shown on the right is quite helpful: - When lighting a color of a test object with the same light color, the color within the image will appear brighter - When lighting a color of a test object with the complementary color (ie the color that is exactly opposite on the color wheel), the color within the image will appear darker.

MISCELLANEOUS INDUSTRY NEWS Using the example of a red bar code on green background, this means:

Due to the slightly reflective surface of the paper strong reflections appear in the center of the image.

Image taken with diffuser:

When illuminating with whitelight, the red lines as well as the green background absorb more or less equally a large part of the light.

The code in the image appears dark and low contrast.

The strong reflections in the center of the image are smoothed away, but not completely.

When illuminated with green, the red lines absorb the light strongly (- > largedistance from green in the color wheel!), while the green background reflects the light well.

The code appears very dark against a light background.

LSIS 400i accessory “diffuser” To smooth out unwanted reflections within the image, there is now a “low cost” alternative to the polarizing filter: a plastic diffuser.

Image with integrated illumination:

When illuminated with redlight, the green background absorbs the light strongly (-> large distance from red in the color wheel!), while the red lines reflect the light well.

The code appears very bright against a dark background.

Image taken with polarizing filter: Only the use of the polarizing filter eliminates reflections in the middle of the image completely!

O’BOYLE s.r.l.

Tel.: +40 (0) 256-201346 Fax: +40 (0) 256-221036 office@oboyle.ro www.oboyle.ro

Human vision and recognition - only a thousand times faster: The color sensors of the SPECTRO-3 series SPECTRO-3 series there is a family of color sensors that has been specifically designed for “true-color” detection (“human color reception”) and high switching frequency.

The sensors can be operated both in AC and in DC mode, with integrated or external light source. With the included SPECTRO3Scope software illumination can also be turned off with a simple mouse-click, which then also allows the color and brightness inspection of self-luminous objects such as LEDs, automobile tail lights, halogen lamps, or fluorescent lamps.

Up to 31 colors can be provided through the 5 digital outputs, the maximum switching frequency is 30kHz. Apart from a super-bright white-light source, a high-performance UV light source also is available, which allows the color and brightness differentiation of fluorescent colors without any problems.

Different frontends make it possible to implement operating distances of almost 0 mm through to 500mm, with detection areas of Ø 0.5mm to approx. Ø 100mm. The use of an optical fibre version allows applications in Ex areas.

In the SPECTRO-3 series great importance was attached to a compact design and to the largest possible extent to a uniform appearance of the various types (M34 design), which facilitates sensor installation.

Characteristics of the SPECTRO-3 series • Optical-fibre version with different optical fibres and frontends; • Light spot sizes with a diameter of 0.5mm to 100mm, or a cross-section of 0.2mm × 2mm or 0.7mm × 4mm; • Operating distances from 0.5mm up to 2000mm; • Diffuse illumination for gloss effect suppression (DIF types); • Wide dynamic range due to focused white-light operation (FCL types); • Polarisation filter for avoiding gloss (POL types); • Color fluorescence evaluation with UV illumination (UV types); • Switching frequency of up to 30 kHz; • High-speed color mark detection; • siM evaluation according to the L*a*b* method; • RS232, USB, and ETHERNET connection; • L*u*v* measurement of extraneous light sources; • Teaching to a product series (Teach Mean Value); • High-speed automatic light power adjustment; • Color candidate selection acc. to the “smallest distance method”; • Teaching of up to 31 colors; • Forming of color groups; • Compact M34 housing; • SPECTRO3-Scope Windows® user interface.

O’BOYLE s.r.l.

Tel.: +40 (0) 256-201346 Fax: +40 (0) 256-221036

office@oboyle.ro www.oboyle.ro

www.epd-ee.eu ⏐ June, 2012 ⏐ EP&Dee

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SWITCHES INDUSTRY NEWS

Omron offers downloadable 3D CAD Drawings for full electronic component range

Omron adds miniature dust-proof detection switch

Omron Electronic Components Europe has made 2D and 3D CAD drawings for the overwhelming majority of its electromechanical solid state relays and switches as well as its connectors and sensors available for instant download online.

The drawings are published on the portal run by Traceparts, a leading CAD software company with nearly a million registered users and a database of millions

Omron Electronic Components Europe unique new dust proof switch provides a very cost effective solution for the great many domestic and commercial electrical systems that don’t need a fully waterproof solution.

Priced lower than typical fully sealed alternatives, the new Omron D2FD ultra-sub miniature dust proof detection switch is sealed to IP6x, and complements the fully sealed switches in Omron’s range such as the D2QW. By using rubber packing, Omron has created a low cost switch that is very effectively protected against dust and other dry contaminants with a J-size case of 6.5 × 12.8 × 6mm. The switch is

of parts including electronic components.

They can be downloaded at www.tracepartsonline.net/ws/omron /index.aspx.

Commenting, Mark Jones, COO of Omron Electronic

Components Europe, said, “Now, customers can quickly find a 2D or 3D CAD drawing of the Omron component they need for their design, and download it instantly in native formats for popular CAD systems or industry standard CAD formats. This will enable engineers to design PCB layouts much quicker and more efficiently. Technical specifications and datasheets are already available on the Omron website.”

By registering on the Traceparts website, Omron customers can readily search the catalogue of Omron components, view the components and configure them to suit their specific requirements then download a 2D or 3D CAD model in their preferred format.

OMRON http://components.omron.eu

Omron’s A9PS Ultra Subminiature Pushbutton Switches Now at Mouser Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced that it is the first distributor to stock a new pushbutton switch from Omron. The A9PS ultra subminiature series, with a height of only Group Publisher Director Gabriel Neagu Managing Director Ionela Ganea Accounting Ioana Paraschiv Advertisement Irina Ganea WEB Eugen Vărzaru © 2012 by Eurostandard Press 2000

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EP&Dee ⏐ June, 2012 ⏐ www.epd-ee.eu

10.5mm, is 30% smaller than Omron’s A9P series. Features of the new pushbutton switch include a gold-plated clip contact, ensuring high reliability and a sealed bottom, preventing flux penetration.

The switches are washable, with protection equivalent to IP64 (IEC-60529). A9PS pushbuttons are available as SPST or DPST, and with DIP, right angle, or vertical mount terminals. Typical applications include security control boards, electric power instrumentation, and program controllers.

To learn more, visit the page: www.mouser.com/OmronA9PS With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering

Contributing editors Robert Berger Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +886­4­3223633 charles@medianet.com.tw

EP&Dee Web page: www.epd­ee.eu EP&Dee Subscriptions: office@epd­ee.eu

based on a single leaf moving spring design, and is available in a total of 12 versions, with solder or PCB terminals, pin plunger, hinge lever or simulated roller lever actuators, rated at 2A or 0.1A. The D2FD is

protected against dust to IP6 standards but provides no protection against liquids.

OMRON http://components.omron.eu What’s Next in advanced technologies. Mouser offers customers 19 global support locations and stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects.

Mouser Electronics’ website is updated daily and searches more than 8.9 million products to locate over 3 million orderable part numbers available for easy online purchase.

Mouser.com also houses an industry-first interactive catalog, data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

MOUSER ELECTRONICS www.mouser.com

EUROSTANDARD PRESS 2000 Tel.: +40 31 805 9955 Fax: +40 31 805 9887 office@esp2000.ro www.esp2000.ro VAT Registration: RO3998003 Company number: J03/1371/1993

EP&Dee (Electronics Products & Design ­ Eastern Europe) is published 8 times per year in 2012 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format.

Copyright 2012 by Euro Standard Press 2000 s.r.l. All rights reserved.