EP&Dee no 4 - May 2012 by Electronica Azi

MAY, 2012 ISSUE NO. 4, VOL. 10

DESIGN & MANUFACTURING

EP&Dee ELECTRONICS

PRODUCTS

DESIGN

EASTERN

EUROPE

Microchip’s energy-measurement Analogue Front End has two 24-bit ADCs with industry’s best accuracy, plus low power & highspeed modes Microchip announces its next generation of energy-measurement analogue front end (AFE), the MCP3911, which features two 24-bit, delta-sigma ADCs that operate at 3V with industry-leading accuracy of 94.5 dB SINAD and 106.5dB THD.

This provides better energy-meter and powermonitoring performance by accurately measuring from start-up to maximum current, and enables faster calibration during production. Four different power modes offer the flexibility of enabling either extremely low-power designs, to 0.8mA per channel, or designs for higher-speed signals and harmonic content. The extended temperature range allows operation from -40°C to +125°C. The MCP3911 features 2.7 to 3.6V analogue and digital operation, which simplifies the interface by running off the same power rail as the microcontroller. An internal, low-temperature-coefficient voltage reference, along with PGAs on each channel, further enables metering and monitoring designs. As the global energy-metering infrastructure is being upgraded and the power-monitoring market is growing, designers of energy-measurement and other signal-acquisition applications are looking for ways to increase performance whilst lowering costs. Microchip is meeting these needs with the industry’s most accurate AFEs, which reduce power consumption with their low-power modes, and reduce costs by decreasing the number of power rails and external components. MICROCHIP TECHNOLOGY www.microchip.com/get/XA2A

T H E E A S T E U R O P E A N J O U R N A L F O R E M B E D D E D A P P L I C AT I O N S

MAY 2012 Table of Contents COMMENTS INDUSTRY NEWS 3 Beyond the PC

INDUSTRY NEWS COMPANIES 4 Setting out to conquer Mars!

DESIGN MCUs 8 Freescale Announces Next Generation S08P 8-bit MCU Series In the strong momentum after rolling out ARM® Cortext-M4 based high-end 32-bit MCU, Freescale announced recently its next generation S08P 8-bit MCU series, with high robustness, cost-effectiveness, ease-of-use, compatibility and scalability, to address the broad market needs in home appliance, power conversion, motor control and many other industrial and consumer applications.

DESIGN DISPLAY 10 Family Concept Solution for variable visualisations Human perception is most strongly influenced by sight – which is why the spotlight is on visualisation in the most varied of applications. Currently, the development of new technologies is accelerating with brilliant colours and sharp, focused images increasingly becoming a sales criterion.

The ABM SE field robot representing Poland, was equipped with WISDOM prototype georadar that Page 4 has been developed by French scientists.

DESIGN EMBEDDED 12 Implementing a tilt compensated eCompass using accelerometer and magnetometer sensors This technical note provides the mathematics code and guidance for engineers implementing a tilt-compensated electronic compass (eCompass).

INDUSTRY NEWS EMBEDDED SYSTEMS PCB-DESIGN TRAINING 18 EAGLE Version 6 - Drawing a schematic Last time we started with the schematic. The ADD command places components. At the bottom of the ADD dialog you will find the Search line. There you can enter the name of the part, for example: LM555. If you want to make the search more flexible use placeholders like * and ?. For example: *555*. This gives more results.

INDUSTRY NEWS DISPLAY INDUSTRY NEWS LIGHTING INDUSTRY NEWS ACTIVE COMPONENTS

Human perception is most strongly influenced by sight – which is why the spotlight is on visualisation Page 10 in the most varied of applications.

INDUSTRY NEWS PASSIVE COMPONENTS INDUSTRY NEWS SMT DESIGN SENSORS 34 Keys to successful gas flow measurement When I first began working with fluid dynamics, I was advised the field was as much an art as a science. Working to improve the efficiency of industrial pollution control equipment through better flow distribution, we studied field test data, developed solutions, built scaled models to test them, and then often held our breath when it came time to see if they scaled up properly.

INDUSTRY NEWS SENSORS INDUSTRY NEWS CONNECTORS 36 ODU Single contacts 37 Morek splice terminals in TME range of products Trade reliability, soundness of every action, speed and flexibility are the motto of Morek company. Morek operates in the territory of Lithuania, Latvia and Estonia. It manufactures automatic and electrical engineering subassemblies. The products offered by Morek Group are also available in Poland – in TME range of products. The assortment includes, among others: terminals and splice terminals.

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

EAGLE Version 6 - Drawing a schematic

Page 18

When I first began working with fluid dynamics, I was advised the field was as much an art as a science. Page 34

Beyond the PC Mobile gadgets are overshadowing the personal computer; their impact will be far reaching. It appears safe to conclude that the merger between computer and phone is in full swing. The smart phone (or iPhone) is an upgraded traditional phone, a first step towards the computer end of the scale. The tablet is basically a slimmed down higher mobility computer, a first step towards the phone end of the scale. We look forward to the day when the two trains will “meet in the middle.” This revolution is mobile and marks a turning point in the world of personal technology. For around three decades PCs in various forms have been people’s main computing devices. Indeed, they were the first machines truly to democratize the computing power, boosting personal productivity and giving people access, via the Internet, to a host of services from their homes and offices. Now the rise of smart phones and tablet computers threatens to erode PC’s dominance, prompting talk that a “post-PC” era is finally downing. Over the last decade, the consumer market has become a hotbed of innovation in its own right. According to a prominent entrepreneur, the polarity has reversed in the technology industry. Many exciting developments in information technology (IT) are appearing in the hands of consumer first and only then making their way into other areas, a trend that is referred to as the “consumarization” of IT. We are witnessing live the transformation of the “militaryindustrial” into a “consumer-industrial” complex. The “post-PC” shift is not only techtonic but also tectonic, with far reaching implications for the entire society. The combination of new devices with pervasive connectivity and plentiful on-line contents is raising citizens’ expectations of what personal technology can achieve. In addition, it is leading them to bring their own devices into the workplace, where some of the technology they are expected to use now seems antediluvian by comparison. This trend is challenging companies to rethink their IT departments’ strategies. The burgeoning global market for smart personal technology is also inspiring an outpouring of entrepreneurial energy that is expected to create many more remarkable products. And it is encouraging organizations of all kinds to adapt innovations form the consumer worlds to their own ends. Companies are setting up on-line apps stores for their employees; hospitals are handing out specially modified smart phones for nurses; soldiers are trying out tablet computers to control drones and experimenting with “battlefield apps.” Many more such opportunities are likely to emerge ass the technological and economic forces behind this popular computing revolution gather steam. (inspired and adapted from The Economist) n Radu Andrei www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

COMPANIES INDUSTRY NEWS

Setting out to conquer Mars!

Digital Voice Processor CMX7011 CML Microcircuits has released a new digital voice scrambler. The CMX7011 is a flexible, half duplex, digital voice processor specifically designed to implement a digital voice scrambler for use with conventional radio communication systems including analogue professional mobile radio, wireless door access and gate entry systems. The need for secure voice communication has become an important requirement for wireless communication. With new communication systems moving towards the digital domain which inherently provides voice security, the widely-used legacy analogue systems are being left behind. A number of analogue voice privacy systems are available today, based on frequency inversion techniques that provide a level of security. In many applications higher levels of voice security are required whilst remaining on lower-cost, widely available analogue radio systems.

Digital scrambling is the answer, providing the highest level of voice security and the advantage of digital voice. The CMX7011 provides the solution with an embedded state-of-the-art, lowcost, low-bit rate Vocoder combined with a robust audio-band voice data modem.

The device allows simple implementation and configuration within existing designs and is intended to be added to a radio via an accessory port or ‘feature socket’. The CMX7011 offers good quality speech and, using the internal digital scrambling algorithm, significantly higher levels of security are achieved. CML MICROCIRCUITS www.cmlmicro.com

Evatronix Launches Display Processor based on Latest ARM Security Technology Silicon intellectual property (IP) provider Evatronix SA has announced the release of the first member of its PANTA high performance display controller core family. Developed using ARM technology the PANTA DP20 is targeted specifically at high-end mobile/portable products, like smartphones and tablet PCs, with ultra-low power consumption that does not sacrifice processing performance. The PANTA DP20 off-loads the general purpose central processing units (CPUs) from powerconsuming video processing tasks, like composition of up to 3 graphics or video layers, YUV to RGB conversion, alpha-blending and gamma correction. It supports a variety of display standards and features programmable resolutions of up to 8191×8191 pixels. The processor’s output pixel interface, with HSYNC, VSYNC and blanking

signals, is compatible with HDMI (also 3D) and MIPI DPI interfaces. A plethora of RGB and YUV pixel formats are supported, as well as progressive/interlaced video input.

The processor features support the advanced AMBA® 4 AXI4 system bus protocol, which increases performance and lowers data transfer latency within the application. EVATRONIX www.evatronix.com/ip

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TME has always supported new technologies and is observing their development with unremitting interest. We have already sponsored Scarabeus, Martian robot and its creators – Warsaw Technical University students and members of Mars Society Poland, who, as the only representatives of Europe, qualified for the international competition of Martian field robots organized by Rover Challenge University 2009. The competition took place on a dessert in Utah, USA. That is why, we did not hesitate a single moment when Toruń technological startup, ABM Space Education gathering Mikołaj Kopernik University PhD students, asked us to support their expedition to Dachstein mountains, Austria, where Martial field robots test were held from April 17 to May 12, 2012. The tests were conducted in three carefully selected locations in Ice and Mammoth caves of the UNESCO protected natural reserve. The organizer of the event was Austrian Space Forum, an organization running a longterm Mars, planets and extreme environments exploration R&D program. The tests, apart from the Polish team, was attended by 9 other teams from Austria, France and USA.

The ABM SE (Magma White) field robot representing Poland, was equipped with WISDOM prototype georadar that has been developed by French scientists. This mechanism is designed specifically for EXOMARS field robot to be used during the ESA Martian mission scheduled for 2018. The radar is undergoing tests in various places around the whole world – so called Martian analogues, where full simulation of conditions present on the Mars. Participation in the mission constitutes a unique opportunity to gain a lot of interesting information, establish relationships with other enthusiasts. It is also a great opportunity to encounter state of the art technology, present one’s own equipment and share experiences. During the tests, a number of experiments and tests of the latest version of Auoda.X spacesuit were conducted. Furthermore, connection and remote control methods were tested. The tested WISDOM technology might turn out to be very useful in Martian conditions, but also in the non-space research. The whole mission was broadcast via the Internet. TME is one of the Dachstein mission sponsors. TRANSFER MULTISORT ELEKTRONIK www.tme.eu

EMBEDDED SYSTEMS INDUSTRY NEWS

STMicroelectronics and IS2T Perfect Java Platform for STM32, Bringing Intuitive Design to Everyday Electronic Equipment Computerized devices such as white goods, office equipment and industrial controls could soon present users with rich graphical features such as animations and widgets, as seen in smartphones, thanks to new technology fromSTMicroelectronics. Gadgets such as smartphones and media players have become increasingly attractive, dynamic and easier to use than other electronic products in the kitchen or workplace. One reason for this is advanced ObjectOriented Programming (OOP) software-design environments, such as Java; the mobile industry is using Java, while microcontroller systems mainly use traditional structured programming languages such as C. In particular, Java simplifies building graphical user interfaces, which by nature are object-oriented using features such as hierarchies of widgets.

The MicroEJ Software Development Kit can be regarded as the world’s first professionalquality tool-set enabling embedded system designers to leverage Java Object-Oriented Programming (OOP). MicroEJ provides extended features to create, simulate, test and deploy

Java applications in embedded systems. Support for Graphical User Interface (GUI) development includes a widget library, design tools including storyboarding, and tools for customizing fonts. STMICROELECTRONICS www.st.com

With the UDE 3.3, PLS presents the first optimized test and debug solution for the new AURIX™ 32-bit multi-core MCUs As a result of the very early and close cooperation with Infineon Technologies and several key customers, PLS now presents the first optimized test and debug solution, the Universal Debug Engine (UDE) 3.3, for the new multicore architecture of the 32bit microcontroller family AURIX. The first AURIX architecture based microcontroller (MCU), part number TC275T, contains three TriCore processor cores (version 1.6). Two of these are optimized for maximum performance (high-performance TriCore CPU 1.6P) and can execute up to three instructions in one cycle at a maximum clock frequency of 200MHz. With the third core, a high-efficiency TriCore CPU 1.6P, lowest possible power consumption and an efficient data exchange with the peripherals are the most impor-

tant factors. It can execute a maximum of one instruction per cycle and is currently clocked at a maximum of 200MHz. The UDE 3.3 allows management and control of the various TriCore-CPUs with-

in one user interface. This is supported by a flexible multicore program loader that enables the loading of program code and data as well as symbol information separately for each core. PLS PROGRAMMIERBARE LOGIK & SYSTEME www.pls mc.com

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Ericsson Extends 3E Gold Design Kit with New Development Boards Ericsson has announced an extension to its 3E Gold Design Kit with the launch of two new development board kits. Launched in June 2011, the 3E Gold Edition Design Kit has been widely used by board and system architects and enables the easy implementation of Ericsson’s Advanced Bus Converters – the BMR453 and BMR454 – and the company’s 3E PMBus-compliant Point-of-Load DC-DC regulators – the BMR462, BMR463 and BMR464. Developed for system-level power design, the new ROA1285068 and ROA1285077 3E design kits enable systems architects to develop not only the exact power architecture required for their final application, but also to configure and monitor every single component to optimize performance and reduce energy consumption. The

two new board kits can also be interconnected with other 3E kits such as the ROA1283835 and the ROA1283836 and can be used as stand-alone kits for smaller systems or educational purposes. For easy control, monitoring and programming of the target 3E

Point-of-Load DC-DC converters, the two boards are PMBus compliant and can be connected via Ericsson’s KEP91017 USB-toPMBus adaptor to a personal computer running the 3E Gold Edition software package. ERICSSON POWER MODULES www.ericsson.com/powermodules

Maxim’s Security Reference Design enables licensing control and secure Feature-Set Upgrades for Spartan-6 FPGA-Based Designs Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces a reference design to protect Xilinx® Spartan®-6 field-programmable gate arrays (FPGAs). The reference design comprises free security software from Maxim or Xilinx and the Maxim® DS28E01-100, a 1-Wire® secure memory device. Operating over a single pin, the built-in challenge-and-response SHA-1 authentication scheme in the DS28E01-100 prevents unauthorized product builds and safeguards FPGA IP. The reference design allows manufacturers to remotely turn on fee-based software-controlled feature upgrades, without physically altering the installed hardware.

The security scheme requires secret keys to be loaded in the FPGA and the 1-Wire secure memory. Maxim’s reference core seamlessly overlays on the Spartan-6 device; utilizes less

than 5% of the logic cell resources and eases the loading of secret keys into the FPGA. Maxim can also preprogram* the DS28E01-100 with customerspecified keys prior to delivery. MAXIM INTEGRATED PRODUCTS www.maxim-ic.com

EMBEDDED SYSTEMS INDUSTRY NEWS

Advantech selects Innovasic’s RapID Platform for Profinet I/O Modules – Innovasic is pleased to announce that Advantech has selected the Innovasic RapID Platform solution with the fido1100 Communication Controller to provide Profinet Class B connectivity in their new ADAM-6100PN series of real-time Profinet I/O modules for factory automation. The RapID Platform is a complete, royalty-free design that provides PROFINET and EtherNet/IP connectivity for factory automation applications. The RapID Platform product line includes universal gateway modules, network interface modules and a complete developer solution. INNOVASIC www.innovasic.com

Atollic introduces TrueSTORE for one-click internet download of example projects Atollic announced the opening of Atollic TrueSTORE, a simple, user-friendly service for the discovery and distribution of embedded systems example projects via the internet. Atollic TrueSTORE is a repository of hundreds of free example projects that are available to suit many different microcontroller-based evaluation boards.

Atollic TrueSTUDIO users will be able to quickly find the latest set of available projects on the Atollic TrueSTORE server, and download them into the active Atollic TrueSTUDIO® workspace with just a single mouse-click. This greatly simplifies the development process and allows embedded designers to quickly select a desired project template and have it running on target hardware within minutes. ATOLLIC www.atollic.com

Algotronix releases MACsec product to secure Ethernet links at up to 10 Gbps Algotronix Ltd., Edinburgh, UK announces that it is shipping MACsec cores that are used to secure data on Ethernet links at up to 10 Gbps. The Media Access Control Security (MACsec) products comply with the requirements of IEEE 802.1AE. They are available as intellectual property cores for FPGAs or SoC technology to cover the needs of gigabit Ethernet for 1GbE and 10GbE throughputs. The architectural design allows 10Gbps to be achieved in readily available 40-nm or 28nm FPGAs, while the 1G data rate product can use lower cost families. The design has been carefully crafted to support both jumbo frames and minimum size packets with a key change on every packet, which represents the worst case situation for the system. The cores support both 128-bit encryption keys as well as the newly standardised 256-bit keys used for enhanced security in applications such as Metropolitan Area Networks. “The MACsec cores evolved from our popular AES-GCM encryption cores, as they add the extensive logic required to perform the validation, statistics and Connectivity Associations. We have seen an upsurge in enquiries for the MACsec products, even before they are publicly announced”, said Tom Kean, Algotronix Managing Director. “These early customers operate in markets as diverse as military, communications and test equipment. Our ability to hit the performance requirements in existing FPGAs is a testament to the efficiency of the architecture”. MACsec provides confidentiality and authentication in the link layer (layer 2) and prevents eavesdropping and so-called “man-in-the-middle” attacks, because it detects any alteration or replay of frames. This differs from other schemes, such as IPsec, which are set up as an end-to-end session based encryption at layers 3/4. MACsec does not compete with IPsec, and should be considered as a complementary cyber security technology. MACsec is agnostic to the Ethernet traffic type, and with the introduction of these cores can be easily added to systems to provide an additional layer of protection to a network. Enterprise customers can adopt MACsec to provide protection behind their fire wall. System administrators can authorise ports to communicate in a secure fashion, and can detect misuse such as attempted Denial of Service

(DOS). Data Center and Cloud-based systems can benefit from the confidentiality and data source authentication offered by MACsec. Commenting on the new products, Paul Dillien, a consultant from High Tech Marketing in the UK said, “There is a rapidly growing awareness of the emerging MACsec standard. Telecoms links and data centers will most probably focus on the 10Gbps product, with the 1G version being the target for enterprise and military customers”. Each MACsec core can support a range of popular FPGA families. The IP is supplied as source code with a very extensive verification testbench. Customers can select from various modes and parameterise the performance to match their needs. All AES products are built around cores that are NIST certified for compliance. Applying the cores to ASIC technology provides a route to lower power and even higher performance. The cores comply with the full specification, however customers who do not need all the features can be provided with a sub-set to save resources. Algotronix can also quote for bespoke cores with additional capabilities. MACsec typically works in conjunction with IEEE 801.1X-2010 which provides the secure key distribution around the network. The 1G and 10G MACsec cores are shipping now, and the architecture is designed to scale to 40G and 100G for future product releases.

ALGOTRONIX www.algotronix-store.com www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

MCUs DESIGN

Freescale Announces Next Generation

S08P 8-bit MCU Series In the strong momentum after rolling out ARM® Cortext-M4 based high-end 32-bit MCU, Freescale announced recently its next generation S08P 8-bit MCU series, with high robustness, cost-effectiveness, ease-of-use, compatibility and scalability, to address the broad market needs in home appliance, power conversion, motor control and many other industrial and consumer applications. This new series inherits the industrial proven, high-efficient and reliable S08 core architecture with optimization to further reduce power consumption. It adopts mature automotive grade advanced process technology which has already been long-time proven with mass silicon shipment for automotive product designs. It takes enhanced chip-level design approach to meet the industrial-leading performance on EMC & ESD immunity. It helps to achieve low system-level EMI with on-chip internal clock source and frequency multiplier, plus programmable drive-strength and slew-rate control. It fully complies with IEC-60730 safety requirement, including independent watchdog clock source, windowed watch-dog clearing, chip reset signal output, as well as having hardware CRC engine. Apart from adopting new process to lower the silicon manufacturing cost, S08P series also integrates abundant peripherals to help customers minimize the system BOM cost. It has high accuracy internal clock source (less than 1.5% deviation across entire temperature and voltage range) which can help to save both cost and PCB area by eliminating external crystal clock source for most of the designs; 12-bit high resolution ADC can ensure accurate signal measurement with lowcost simplified external signal conditioning circuitry; TSI (Touch Sensing Interface) enables easy implementation for humanmachine touch control without the need of any extra components; On-chip EEPROM can save external data storage chip when applica-

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

tion needs frequent small amount of data update and storage; other features such as 6channel PWM in 3-phase complementarypair output with dead-time insertion simplifies motor control or power conversion application, communication modules including SPI, I2C & SCI provide flexible inner-board or inter-board data connection, multiple timer modules allow adequate timing control for various application tasks, RTC (Real Time Counter) module provides a periodic wakeup scheme after MCU gets into low-power stop mode. Besides, it can also implement real-time calendaring function with simple firmware coding. Taking the advantage of consistent S08 core architecture, the whole S08P series can reuse

all the existing S08 hardware and software development tool chain broadly available, including vast 3rd party ecosystem, thus greatly reduces the investment for project development. All Freescale existing customers can easily port their legacy and proven S08 code library onto this new platform. Freescale’s CodeWarrior IDE as the standard development platform fully supports new S08P code development. It’s based on opensource Eclipse environment, bundled with source code editor, C-complier, source-code level debugger interface, as well as ProcessorExpert, a professional automatic code generating tool helps to initialize the code project through a few clicks.

S08P series feature block diagram

MCUs DESIGN More importantly, it offers full-featured free C-Complier supporting entire S08P series code development. BDM hardware debugger works seamlessly with CodeWarrior IDE which enables simple, low cost yet high efficiency

interactive code debug and development. In addition, there’s open-source OSBDM tool available with intrinsic support from CodeWarrior. It can be DIY’ed with all the design material downloadable from the web.

S08P series consists of three classes: full-featured touch-sensing enabled S08PT class, fullfeatured without touch-sensing S08PA class, and feature-lite cost competitive S08PL class. All three classes are pin-to-pin compatible on the same package option, despite some differences on peripheral feature-sets and performance. In this series from the smallest 2KB Flash in 8-pin package to the biggest 60K Flash in 64-pin package, all of them are compatible in core, peripheral functions and pinout on particular package. Customers can pick a most suitable part to start with their product design and keep the freedom of switching to other class parts without the need of any hardware modification. S08P has been sampled from Q4 2011 for those early adopters. Mass production begins in Q2 2012. Suggested resale price in 10,000 volume starts from $0.35 for low-end 2K/8pin S08PL2, up to $1.26 for 60K/64-pin S08PT60. n For getting more product info on S08P series, please visit product specific page on Freescale web site: www.freescale.com/S08P www.freescale.com

eDevice Announces the HealthGO Monitor, Built on Freescale’s Home Health Hub Reference Platform;

HealthGO is the Industry’s First Fully Customizable Technology Platform for Remote Patient Monitoring eDevice introduced HealthGO, a complete technology platform for Remote Patient Monitoring based on Freescale Semiconductor’s Home Health Hub (HHH) reference platform.

HealthGO is a Remote Patient Monitoring technology platform designed for medical device and healthcare monitoring companies seeking to quickly roll‐out an end‐to‐end innovative, customized and reliable solution. HealthGO‐based telehealth solutions increase patient quality of life and quality of care through accurate and focused medical home‐based monitoring. The need for connected healthcare is growing and the increase in life expectancy, the cost of the chronic diseases and the financial pressure on the healthcare system will further accelerate this growth. At the end of 2011, according to Berg Insight, only 2.2 million

patients worldwide were using a home monitoring service based on equipment with integrated connectivity, while more than 200 million people in the EU and the US suffer from one or several diseases where home monitoring can become a treatment option. The number of home monitoring systems with cellular connectivity integrated is projected to grow at a CAGR of 34.6 percent during the next 5 years. With the HHH and its team of application specific experts, eDevice has built a range of “universal medical gateways”. The HealthGO will be branded and marketed by home monitoring companies, whose quality and regulatory constraints are very important. Internally specifying, designing, developing and testing the hardware products would drain an important part of their financial resources and skilled staff. eDevice allows them to focus on their core business and offers them the possibility to launch a complete solution without going through the long, expensive, and

risky process of creating a new monitor. The HealthGO monitors are complete and customizable. They come with vital sign monitoring, USB and Bluetooth peripheral interfaces, embedded Blood Pressure monitor (optional on HealthGO+), touch‐screen, embedded microphone and speaker, disease management possibilities, capability to display information, messages, weather or heath education tutorials. Both the firmware and the hardware of the HealthGO are customizable by the client. An API is available for in‐house development of the client applications and graphical user interface and the casing can be modified to fit client requirements. The HealthGo is part of eDevice’s complete remote monitoring offer, which also includes Worldwide Cellular Connectivity and Services & Logistics Portal.

FREESCALE SEMICONDUCTOR www.freescale.com eDEVICE www.edevice.com www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

DISPLAY DESIGN

Family Concept Solution for variable visualisations Human perception is most strongly influenced by sight – which is why the spotlight is on visualisation in the most varied of applications. Currently, the development of new technologies is accelerating with brilliant colours and sharp, focused images increasingly becoming a sales criterion. Suppliers are therefore faced with the challenge of equipping their existing applications with state-of-the-art displays. Low costs and short development times are therefore a must. A family concept with turnkey kit solutions fulfils both the technological and commercial requirements. Two contrary approaches can be used to achieve this: The first is platform-independent and therefore extremely flexible. Displays specially developed for this are configured for the same expanded temperature range and the same power supply across all displays. Thanks to the standardised interface, these are therefore both pin and electrically compatible and the customer has the choice

whether to replace or expand each display diagonal with another from the same series. And to do this: Simply reconnect and it's all done, no other hardware changes are required. The displays can equally be used for RGB applications as for MCU applications and can be connected to practically any existing board. A touchscreen as well as the appropriate controller as chip or finished hardware is also available for each display.

Made-to-measure off the rack The second approach follows the motto: “Plug and Play”. It comprises a turnkey solution consisting of a display plus a cable set specially adapted for the system, a control board as well as the necessary software with timing parameters for the display. Such a kit solution can also be configured to support a number of wireless technologies, e.g. WLAN for network connectivity, RFID for

Display-Kit 10

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

DISPLAY DESIGN

access control or identification applications, Bluetooth or proprietary wireless sticks, GSM or GPS. Not only do companies save on their own development, something which is always an important argument when low volumes are involved, but they also benefit from an extremely short time until market readiness. “We have preconfigured solutions at hand which we have evaluated based on many customer enquiries and our experience,” explains Tobias Zilly, Technical Support Engineer for Displays & Boards at Rutronik. “Despite this, we consult extensively with the customer at the beginning of each project in order to fulfil the individual requirements of each application. Often only minor adjustments are required, allowing us to keep the development time very short.” In this way, investment in evaluation, development, the test phase and development of prototypes is as low as possible. However, to ensure that this is not at the expense of quality, Rutronik concentrates on high-quality components from selected manufacturers. In addition, the engineers check all data sheets to ensure that all individual components are optimally coordinated with each other. Market-specific factors are also incorporated, e.g. the required certifications. “However, in addition to technical data, other factors such as manufacturing quality, delivery reliability of the manufacturer, its product strategy or availability also play a role in the selection of components. Our wide experience gained from many customer projects has stood us in good stead in this respect,” says Displays & Boards expert Zilly. Full flexibility Flexibility is one of the main advantages of this concept. Within a turnkey solution, sizes of 3.5“ to 7“ as well as RGB and MCU interfaces can be realised. The MCU models may replace existing passive displays which no longer achieve the desired performance. The optical performance is therefore significantly increased, but the proven control technology remains untouched. Even the transition to TFT displays will be smooth and cost-effective in this way. Smaller software adjustments to the existing application, such as the import of the display initialisation as well as its parameter transfer are quick and easy to implement. Different wireless technologies or performance scaling of the control can also be handled in advance so that customers can concentrate on other development priorities, such as the adaptation and programming of software or housing design. ‘All-inclusive’ kit solutions “Special requirements outside the small sizes of 3.5“ to 7“ are fulfilled with turnkey display solu-

tions which function independently of the family concept,” explains Zilly. “These are also designed in accordance with the ‘Plug and Play’ motto.“ For industrial customers, such a solution could comprise a Tianma 10.4“ display TM104SDH03 LED and a D3003-S1 board from Fujitsu. All the cables required for this are adapted and specifically manufactured according to the customer’s specifications. The display combines a 50,000-hour LED backlight lifetime with a converter integrated into a piece of hardware. This eliminates the need for separate mounting points for the converter as well as the additional backlight cable required for this. The D3003-S1 board in mITX format offers many approaches and connectivity options for the greatest possible creative freedom. In addition to the opportunity to use MSATA flash memory from Apacer as the data carrier, the platform is fitted with a newest generation Atom processor and an LVDS port. A riser card provides even more expansion slots. The combination of the Fujitsu board with the Tianma display thus offers great flexibility with mid-range performance and low energy consumption. If the performance requirements are higher, the Fujitsu D3003-S3 can be selected with a dualcore Atom CPU. “The broad portfolio comprising several manufacturers guarantees that we can offer the appropriate hardware for every customer and every application,” says Zilly. Moreover, the customer can also select additional components, for example one of the touch variants from Hantouch, an additional bar of RAM from Swissbit or a data carrier suitable for its application such as a hard disk, SSD, USB stick or CF card. Rutronik has stored such kits, e.g. for industrial and medical applications, in a database-based system. “Each individual one is tested and corresponds to the applicable industry standards. This gives the opportunity to draw on many preconfigured solutions,” explains Zilly. “Most individual customer requirements can be fulfilled cost-effectively, efficiently and quickly with just minor adaptations.“ The data sheets for all the components are cross-checked to ensure that the individual components are perfectly suited to each other. Market-specific factors, such as component certifications, are also taken into account. All this ensures that the customer receives a perfectly customised turnkey solution. Not only does this enable them to benefit from a shorter wait for market readiness but also from planning reliability, flexibility of design and concentration on purchasing. n www.rutronik.com

Rutronik now global distributor for MPE Garry Rutronik Elektronische Bauelemente GmbH has now become MPE Garry GmbH's global distribution partner. As the only broadliner on a global scale, Rutronik is marketing the entire product range of precision connectors and circuit board connection systems manufactured by MPE Garry as well as the network connection solutions of its subsidiary K+B GmbH with immediate effect. The main market for the fittings, pin headers and female headers, device plugs as well as customer-specific punched parts or stamped bent parts is the industrial market. “Rutronik has a strong global position in the industrial market and has established a great deal of expertise in the connectors field,” explains Peter Fuchs, Product Manager at MPE Garry. “That is why we see Rutronik as the ideal partner with whom we can continue to grow and expand our customer base on a worldwide scale.” Kathrin Felten, Product Sales Manager for connectors and cables at Rutronik, adds: “MPE Garry, just like its subsidiary K+B, supply extremely reliable products and customer-specific solutions with excellent cost-effectiveness. These represent a great potential that we wish to exploit together.” New device connectors according to IEC-320 from K+B The new series from K+B comprises network connector plugs according to IEC-320 with integrated overvoltage protection to provide a reliable shield against voltage peaks. The device plugs are fitted with two device fuses, and optionally with voltage selectors as well as integrated single or double-pole mains switches. On the connection side they have plug contacts according to DIN 46244 or soldered contacts. The snap-on assembly means that they can be installed easily. There are standard versions for four different front panel thicknesses. As the connectors fit the same assembly apertures as the versions without overvoltage protection, an upgrade is always possible without any significant effort. RUTRONIK www.rutronik.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

EMBEDDED DESIGN

Implementing a tilt compensated eCompass using accelerometer and magnetometer sensors This technical note provides the mathematics code and guidance for engineers implementing a tilt-compensated electronic compass (eCompass). by Talat Ozyagcilar, Applications Engineer, Freescale Semiconductor The eCompass uses a three axis accelerometer and three axis magnetometer. The accelerometer measures the components of the earth's gravity and the magnetometer measures the components of earth's magnetic field (the geomagnetic field). Since both the accelerometer and magnetometer are fixed on the Printed Circuit Board (PCB), their readings change according to the orientation of the PCB. If the PCB remains flat, then the compass heading could be computed from the arctangent of the ratio of the two horizontal magnetic field components. Since, in general, the PCB will have an arbitrary orientation, the compass heading is a function of all three accelerometer readings and all three magnetometer readings. The tilt compensated eCompass algorithm actually calculates all three angles (pitch, roll, and yaw or compass heading) that define the PCB orientation. The eCompass algorithms can therefore also be used to create a 3 D Pointer with the pointing direction defined by the yaw and pitch angles. The accuracy of an eCompass is highly dependent on the calculation and subtraction in software of stray magnetic fields both within, and in the vicinity of, the magnetometer on the PCB. By convention, these fields are divided into those that are fixed (termed Hard Iron effects) and those that are induced by the geomagnetic field (termed Soft Iron effects). Any zero field offset in the magnetometer is normally included with the PCB’s Hard Iron effects and is calibrated at the same time. This document describes a simple three element model to compensate for Hard Iron effects. This three element model should suffice for many situations. For convenience, the remainder of this document assumes that the eCompass will be implemented within a mobile phone.

x axis of the phone is the eCompass pointing direction; the y axis points to the right and the z axis points downward (see Figure 1). A positive Yaw angle ψ is defined to be a clockwise rotation about the positive z axis. Similarly, a positive pitch angle θ and positive roll angle φ are defined as clockwise rotations about the positive y and positive x axes respectively.

Figure 1

It is crucial that the accelerometer and magnetometer outputs are aligned with the phone coordinate system. Different PCB layouts may have different orientations of the accelerometer and magnetometer packages and even the same PCB may be mounted in different orientations within the final product. For example, in Figure 1, the accelerometer yaxis output Gy, is correctly aligned, but the xaxis Gx and z-axis Gz signals are inverted in sign. Also in Figure 1, the magnetometer output Bz is correct, but the y-axis signal should be set to Bx and the x-axis signal should be set to -By. Once the package rotations and reflections are applied in software, a final check should be made while watching the raw accelerometer and magnetometer data from the PCB: 1. Place the PCB flat on the table. The z-axis accelerometer should read +1g and the x and y axes negligible values. Invert the PCB so that the z axis points upwards and verify that the zCoordinate System and Package Alignment axis accelerometer now indicates -1g. Repeat This application note uses the industry stan- with the y-axis pointing downwards and then dard “NED” (North, East, Down) coordinate upwards to check that the y axis reports 1g and system to label axes on the mobile phone. The then reports -1g. Repeat once more with the x-

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axis pointing downwards and then upwards to check that the x-axis reports 1g and then -1g. 2. The horizontal component of the geomagnetic field always points to the magnetic north pole. In the northern hemisphere, the vertical component also points downward with the precise angle, being dependent on location. When the PCB x-axis is pointed northward and downward, it should be possible to find a maximum value of the measured x component of the magnetic field. It should also be possible to find a minimum value when the PCB is aligned in the reverse direction. Repeat the measurements with the PCB y- and z-axes aligned first with, and then against, the geomagnetic field which should result in maximum and minimum readings in the y- and then z-axes. Accelerometer and Magnetometer Outputs as a Function of Phone Orientation Any orientation of the phone can be modeled as resulting from rotations in yaw, pitch and the roll applied to a starting position with the phone flat and pointing northwards. The accelerometer, Gr, and magnetometer, Br, readings in this starting reference position are (see Figure 2):

Figure 2

Eqn. 1 Eqn. 2 The acceleration due to gravity is g = 9.81 ms-². B is the geomagnetic field strength which varies over the earth's surface from a minimum of 22μT over South America to a maximum of 67μT south of Australia. δ is the angle of inclination of the geomagnetic field measured

EMBEDDED DESIGN

downwards from horizontal and varies over the earth's surface from -90° at the south magnetic pole, through zero near the equator to +90° at the north magnetic pole. Detailed geomagnetic field maps are available from the World Data Center for Geomagnetism at http://wdc.kugi.kyoto-u.ac.jp/igrf/ There is no requirement to know the details of the geomagnetic field strength nor inclination angle in order for the eCompass software to function. The magnetic field strength B and the inclination angle δ, cancel in the angle calculations (see Equations 20, 21 and 22). The phone accelerometer, Gp, and magnetometer, Bp, readings measured after the three rotations Rz(ψ) then Ry(θ) and finally Rx(φ) are described by the equations:

plying Equation 3 by the inverse roll and pitch rotation matrices giving:

where the vector contains the three components of gravity measured by the accelerometer. Expanding Equation 9 gives:

The y component of Equation 11 defines the roll angle φ as: (Eqn. 12)

The three rotation matrices referred to in Equations 3 and 4 are:

The x component of Equation 11 gives the pitch angle θ as:

With the angles φ and θ known from the accelerometer, the magnetometer reading can be de-rotated to correct for the phone orientation using Equation 5:

Equation 3 assumes that the phone is not undergoing any linear acceleration and that the accelerometer signal Gp is a function of gravity and the phone orientation only. A tilt-compensated eCompass will give erroneous readings if it is subjected to any linear acceleration. Equation 4 ignores any stray magnetic fields from Hard and Soft Iron effects. The standard way of modeling the Hard Iron effect is as an additive magnetic vector, V, which rotates with the phone PCB and is therefore independent of phone orientation. Since any magnetometer sensor zero flux offset is also independent of phone orientation, it simply adds to the PCB Hard Iron component and is calibrated and removed at the same time. Equation 4 then becomes:

where Vx, Vy, and Vz, are the components of the Hard Iron vector. Equation 8 does not model Soft Iron effects. Tilt-Compensation Algorithm The tilt-compensated eCompass algorithm first calculates the roll and pitch angles φ and θ from the accelerometer reading by pre-multi-

The vector represent the components of the magnetometer sensor after correcting for the Hard Iron offset and after de-rotating to the flat plane where θ = φ = 0. The x and y components of Equation 19 give:

Equation 22 allows a solution for the yaw angle ψ where ψ is computed relative to magnetic north. The yaw angle ψ is therefore the required tilt-compensated eCompass heading. Since Equations 13, 15 and 22 have an infinite number of solutions at multiples of 360°, it is standard convention to restrict the solutions for roll, pitch and yaw to the range -180° to 180°.

A further constraint is imposed on the pitch angle to limit it to the range -90° to 90°. This ensures only one unique solution exists for the compass, pitch and roll angles for any phone orientation. Equations 13 and 22 are therefore computed with a software ATAN2 function (with output angle range -180° to 180°) and Equation 15 is computed with a software ATAN function (with output angle range -90° to 90°). Estimation of the Hard Iron Offset V Equation 22 assumes knowledge of the Hard Iron offset V, which is a fixed magnetic offset adding to the true magnetometer sensor output. The Hard Iron offset is the sum of any intrinsic zero field offset within the magnetometer sensor itself plus permanent magnetic fields within the PCB generated by magnetized ferromagnetic materials. It is quite normal for the Hard Iron offset to greatly exceed the geomagnetic field. Therefore, an accurate Hard Iron estimation and subtraction are required to avoid Equation 22 jamming and returning compass angles within a limited range only. It is common practice for magnetometer sensors to be supplied without zero field offset calibration since the standard Hard Iron estimation algorithms will compute the sum of both the magnetometer sensor zero field offset and the PCB Hard Iron offset. In the absence of any Hard Iron effects, the locus of the magnetometer output under arbitrary phone orientation changes lies on the surface of a sphere in the space of Bpx, Bpy and Bpz with a radius equal to the magnitude of the geomagnetic field B. In the presence of Hard Iron effects, the locus of the magnetic measurements is simply displaced by the Hard Iron vector V so that the origin of the sphere is equal to the Hard Iron offset Vx, Vy and Vz. The Hard Iron Offset can then be simply computed by monitoring the minimum and maximum values of the x, y, and z components of the magnetometer readings and estimating the Hard Iron offset components by:

The minimum and maximum magnetometer readings can either i) be measured and the Hard Iron offset computed and stored at factory calibration time or ii) be tracked on the fly using the random orientations of the phone to continuously self-calibrate the phone. SOFTWARE IMPLEMENTATION The reference C# code uses integer operands only and makes no calls to any external mathematical libraries. Custom functions are provided in this document for all the trigonometric and numerical calculations required. It is provided in the Application Note AN4248 from Freescale Semiconductor and can be found at www.element14.com/freescale n www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

EMBEDDED SYSTEMS INDUSTRY NEWS

Highly efficient high current eighth-brick DC/DC converters suit high density embedded applications

Murata Power Solutions launches highly efficient compact 1U open frame 120 W AC/DC power supply

Murata Power Solutions announced the introduction of the UWE series of highly efficient 100 – 120 Watt open frame isolated DOSA-compatible eighthbrick DC/DC converters. Using the industry standard throughhole package, measuring 58.42 × 22.86 × 9.91mm (2.3 × 0.9 × 0.39 inches), the single output units offer the nominal outputs of 3.3, 5 or 12VDC. Providing an efficiency of typically 91.5% means that for most applications no forced airflow is required. Suiting embedded computing applications and instrumentation subsystems, the converters accommodate an ultra-wide 4:1 input voltage range from 18 to 75VDC around a nominal 48 VDC. Line regulation is kept within ±0.25% Vout and load regulation is maximum ±0.2% Vout across the complete range. On-board remote sense inputs compensate for line

Murata Power Solutions announced the MVAB120 series of high efficiency, typically up to 91%, open frame single output 120Watt power supplies aimed at a broad range of telecom and industrial applications. Measuring just 101.6 × 50.8 × 34.3mm (2 × 4 × 1.35 inches), the low profile units satisfy the 1U height constraints of this industry standard footprint. The high efficiency design of the MVAB120 ensures that waste heat is kept to a minimum and the units are capable of delivering up to 75W using convection cooling only. Just 250 LFM forced airflow is required for the supply to operate at the 120W full load output. The series comprises three single output models covering the nominal outputs of 12, 24 or 48 VDC. Accommodating the full universal range of input voltages, from 90 - 264 VAC and 120 – 300VDC, the MVAB120 also

voltage errors at high output currents. A trim function provides the ability to adjust outputs ±10% of nominal output voltage in order to compensate for line

losses. A remote on/off input, negative or positive, provides the ability to remotely control the converter such as required to schedule load startup. The UWE series can operate from –40°C to +85°C. Protection features include input under voltage, output short circuit, over current and over temperature. MURATA POWER SOLUTIONS www.murata-ps.com

High-performance box IPC with Intel® QM57 chipset for installation in a control cabinet DSM Computer's new Galaxy® G4-QM57 control cabinet PC integrates the Intel® Core™ i5520M processor clocked with 2.4 GHz, and the Intel® QM57 chipset. In addition to the standard version, a higher-performance model with the Intel® Core™ i7-620M (2.66GHz) and a lower-cost system with the Intel® Celeron™ P4500 Dual Core CPU are available as options. The fast, standard 4GB DDR3 RAM main memory (800/1066MHz) can be expanded to a maximum capacity of 8GB. The robust Galaxy® G4QM57 is designed specially for the harsh industrial environment. Thanks to its compact size of 149 × 260 × 280mm, the computer can be installed flexibly in a control cabinet. To permit the fast access to all components, the drive bay and the connections are located on the front side of the industri-

al housing. Two 8-cm temperature-controlled system fans ensure the optimum ventilation of the housing, irrespective of the positioning of the control cabinet. The operating temperature range is 0° to +45°C. To expand the system with short, commercially-available supplementary modules, e.g. for CAN

bus and other fieldbus cards, or with customer-specific controller cards, the control cabinet PC provides three free PCI slots and one PCI Express™ ×1 slot. DSM COMPUTER www.dsm-computer.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

meets the EU PFC directive for active power factor correction. Safety approvals include the internationally recognized UL/EN/IEC 60950-1:2005 2nd edition standard for IT and commercial equipment. The units

also comply with IEC/EN 61000 Class A and EN55022 Class B standards for emissions and immunity. Suiting most operating environments, the MVAB120 series can deliver full load from 10 to + 50°C, and is capable of start-up from temperatures as low as -20°C. MURATA POWER SOLUTIONS www.murata-ps.com

COM Express™ Modules with brand-new, quadcore 3rd Generation Intel® Core™ Processors MSC Vertriebs GmbH presents the first COM Express™ modules based on the 3rd generation Intel® Core™ processor family (formerly codenamed ‘Ivy Bridge’). The 3rd generation Intel Core processor family utilizes Intel’s advanced 22nm process technology with three-dimensional transistors for higher performance at lower power. The new COM Express modules feature a further leap forward in computing power, graphics and video performance in comparison to modules based on the previous generation Intel platform. Important innovations of this new product generation are lower power consumption at higher clock frequencies and an improved graphics and video performance. For the first time, the new Intel platform supports DirectX 11. The first products of these module families are equipped with the quad-core Intel® Core™ i7-3615QE processor

with 45W thermal dissipation power (TDP) and the Intel® Core™ i7-3612QE processor (35W TDP).

The quad-core processors include support for Intel® 64 architecture, Intel® Virtualization Technology, Intel® Advanced Vector Extensions and the Intel® Advanced Encryption Standard (AES). Thanks to the integration of enhanced Intel® Turbo Boost Technology, single cores can be over-clocked in order to increase the performance. MSC www.msc-ge.com

EMBEDDED SYSTEMS INDUSTRY NEWS

XP Power unveils 95% efficient 250 Watt convection cooled power supply with 3rd edition medical and industrial approvals XP Power announced the CCB250 series of highly efficient single output 250 Watt AC-DC power supplies aimed at a broad range of industrial and medical applications. With an operating efficiency of up to 95%, the convection cooled CCB250 series generates very little waste heat and does not require any forced air cooling. The series achieves an absolute minimum efficiency of 90% with a 90 VAC input at full load. Meeting the stringent demands of the latest IEC60601-1 3rd edition medical safety standards, the CCB250 complies with 2 × MOPP (Means Of Patient Protection) and offers the complete risk management files, thus removing the burden and expense typically placed on the end product designer in achieving product compliance. The series operates from an ultra wide input range of 80 – 275VAC, in an ambient of –20°C to + 70°C, with no derating until +

50°C. In addition to being able to continuously deliver the maximum output of 250W, the CCB250 has a peak power capability of up to 300 W for a maximum of 500 ms. This allows the delivery of a short-term higher current, such as for starting motors, without engineers needing to incur the additional costs or space required for a higher rated unit. Measuring just 101.6 × 152.4 × 38.1mm (4 × 6 × 1.5 inches), the open frame CCB250 series fits into a 1U space.

XP POWER www.xppower.com

IAR Systems delivers even faster code for Renesas RL78 applications IAR Systems® introduces version 1.20 of the high-performing development toolsuite IAR Embedded Workbench® for RL78. The new version brings highly efficient speed optimizations. IAR Embedded Workbench is a full set of development tools for building and debugging embedded applications. It includes a project manager, editor, compiler, assembler, linker, debugger, and library tools in a user-friendly integrated development environment. Thanks to the longstanding and solid relationship between IAR Systems and Renesas Electronics, IAR Embedded Workbench for RL78 was the first set of development tools to be made available for the RL78 family. From start, the compiler has created very compact code, for example by using intelligent linking and making full use of the hardware multiplier/divider for faster arith-

metic. This makes the execution run faster and allows the microcontroller to enter one of its lowpower modes after fewer clock cycles. Because the RL78 family is specifically designed for use in low-power applications, the power-saving contribution from having highly optimized code is extremely valuable. Version 1.20 of IAR Embedded Workbench for RL78 brings even more improved optimizations. The code generated for integer arithmetic and floating-point operations is now several times faster compared to the previous version.

IAR SYSTEMS www.iar.com

16 EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

New Starterkit for ultra small and rugged applications with COM Express mini Type 10 Computer-on-Modules Kontron announced a new COM Express Starterkit with the industrial grade (E2) Carrier Board Kontron COM Express Reference Carrier-i Type10 for ultra small and rugged applications based on COM Express mini Computer-onModules with pin-out Type 10. The Kontron COMe Starterkit Ref. Carrier T10 is specifically configured to make evaluation and development of small form factor and mobile applications easy, even for the extended temperature range (-40°C to +85°C). For an individual Starterkit, only the COMe-mini module and the suitable cooling solution have to be selected to immediately start the development, while all other components are preinstalled. In addition to the minisized (120mm × 120mm) COM Express Reference Carrier-i Type 10, the Starterkit includes a 7" WVGA touch panel, cables and PSU. The kit is compatible with all

COM Express mini Type 10 modules and it unleashes its full potential when used with industrial grade COMs such as the Kontron COMe-mTT10 to develop by-design rugged applications. The Starterkit minimizes development time and cost by featuring the enhanced interface range of the COM Express Type 10 pin-

out including new digital video interfaces (DDI) as well as a CAN Bus and COM ports on an ultra compact footprint. KONTRON www.kontron.com

12 new RX631 MCUs in 48 and 64 pin packages MSC now offers 12 new highperformance RX631 microcontrollers (MCUs) in 64- and 48pin packages from Renesas Electronics. The new devices are particularly suited for compact and cost-sensitive industrial and consumer applications. The MCUs are provided with 256KB, 384KB or 512KB flash memory and achieve up to 165 DMIPS processing power at 100MHz operation. At the same time, the new MCUs offer users a wide range of communication, timer and analog peripherals including USB 2.0 full-speed channel (Host, Device and OTG), CAN interface, 12 A/D converter channels, a 10-bit D/A converter and a real-time clock (RTC). Furthermore, the RX631 derivatives that come in a 64-pin LQFP package, provide a six-channel multi-function timer pulse unit 2 (MTU2) with complementary sixphase PWM, a six-channel timer pulse unit (TPU), a four-channel compare match timer (CMT), a

four-channel timer (TMR) and dual watchdog timers. The RX631 derivatives also feature numerous serial data communication channels, six SCI, two SPI, and one I2C. Four channels of DMA and a Data Transfer Controller make it easy to handle transfers with peripherals and ensure efficient use of the CPU.

MSC www.msc-ge.com

EMBEDDED SYSTEMS INDUSTRY NEWS

Kontron brings benefits of quad-core 3rd generation Intel Core i7 processor technology to the embedded space Kontron announced the support of the quad-core 3rd generation Intel Core i7-3615QE (4×2.3GHz, 6MB L2 cache) and i7-3612QE (4×2.1GHz, 6MB L2 cache) processors on seven embedded computing platforms, to match the market demands for ever increasing power savings and performance gains. These are the first boards and modules to feature the increased computing power, graphics performance, long-term availability and energy efficiency of the new transistor technology from Intel. Available in COM Express basic, Flex-ATX, Mini-ITX, AdvancedMC, 3U and 6U CompactPCI as well as 3U VPX, Kontron gives OEMs a jump-start in developing a broad range of leading-edge compute- and graphics-intensive applications. Based on Intel's innovative 22nanometer (nm) 3-D tri-gate tran-

sistor technology, the 3 generation Intel Core i7 processorbased boards provide up to 20% enhanced computing power and up to 40% increased performance per watt compared to

designs based on the 2 generation Intel Core processors. This meets and exceeds the requirement for improved size, weight and power (SWaP) of embedded designs and enables designers to utilize the power of the latest quad-core Intel processors for the first time on small form factors such as COM Express, AdvancedMC and 3U VPX. KONTRON www.kontron.com

Universal Debug Engine 3.3 now also available for Freescale MPC57×× and STMicroelectronics SPC57× families of MCUs As a result of the early and close cooperation with Freescale and STMicroelectronics, PLS Programmierbare Logik & Systeme, as authorized tool partner, now offers Version 3.3 of its Universal Debug Engine (UDE). The UDE 3.3 is a sophisticated and proven test and debug solution for the new Freescale MPC57xx family of Qorivva automotive multicore microcontrollers (MCUs) and the STMicroelectronics SPC57x family MCUs. The UDE 3.3, which is not only suitable for the development and test phases but also for future field maintenance work, allows users, among other things, management and control of the three integrated Power Architecture

e200 cores within one user interface. Individual cores or the entire device can be selected as debug target. This is supported by a flexible multicore program

loader that enables the loading of program code and data as well as symbol information separately for each core. PLS PROGRAMIERBARE LOGIK & SYSTEME www.pls mc.com

Data logger for temperature, relative humidity and dew point Electronic Assembly can supply a data logger to monitor and record ambient temperature, relative humidity and dew point. The EA SYLOG-USB-2 is ideal for applications in the pharmaceutical and food industry, transportation and logistics and general laboratory use. The device can simply be inserted into a PC USB port for fast, uncomplicated analysis of the data which has been logged. Drivers for current versions of Windows are provided. The EA SYLOG-USB-2 captures temperature and relative humidity data simultaneously and can store up to 16,382 readings. It also calculates the dew point for each reading. The data logging intervals can be in the range between 10 seconds and 12 hours and are user selectable. The date and time when logging starts can also be pre-programmed. Software is supplied for displaying the results on the computer screen in graph-

ics format. The graphs can also be formatted for printing. The data can be converted into a variety of standard formats and exported for further processing. Colored LED indicators display the current device status. The LEDs also indicate whether preset minimum or maximum tem-

perature thresholds have been exceeded, which is important to verify the integrity of the cooling chain in the food and pharmaceutical industries. The data logger has an operating temperature range of -35°C to +80°C. ELECTRONIC ASSEMBLY www.lcd-module.com

Silicon Labs Simplifies Power over Ethernet Deployment for Residential Gateways and surveillance Systems Silicon Laboratories Inc. introduced a single-port Power over Ethernet (PoE) controller that brings economical “plug-andplay” simplicity to embedded power sourcing equipment (PSE) designs. The new Si3462 controller eases the development of PSE endpoints such as residential gateways, set-top boxes, fiberoptic media converters, and surveillance and security systems that connect to a wide variety of powered devices including VoIP phones, security cameras, keypads, network attached storage and WiFi access points. With the rising popularity of the higher power IEEE 802.3at PoE+ standard and the need to support PD applications that consume up to 30 watts, developers require PSE controllers that offer flexible power measurement and monitoring capabilities, standards-compliance and no inter-

operability hassles. The Si3462 controller is a complete, costeffective single-port PoE and PoE+ PSE solution. When deployed with the new Classification Optional Mode, the Si3462 eliminates the need for up to 10 discrete components, reducing the total BOM cost for embedded PSE to as lit-

tle as $1.60 (USD). In this mode, the Si3462 controller determines when a valid PD is connected at the other end of the cable and immediately applies a predetermined amount of power. SILICON LABORATORIES www.silabs.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee 17

PCB-Design TRAINING

EAGLE Version 6 Drawing a schematic Last time we started with the schematic. The ADD command places components. At the bottom of the ADD dialog you will find the Search line. There you can enter the name of the part, for example: LM555. If you want to make the search more flexible use placeholders like * and ?. For example: *555*. This gives more results.

I would like to mention two important things you should keep in mind before you start: 1. The default grid setting in schematics is 0.1 inch! Please keep this setting. All EAGLE schematic symbols in all libraries are based on this grid. Of course, you are allowed to set it to millimetre (2.54mm), but you should not change the grid size.

Please read the messages carefully and decide what to do. In some cases you will recognize that the message is okay for you. So simply Approve it.

2. Click the DISPLAY icon and switch on layer 93, Pins. So you can see exactly where the pins of a symbol have to be connected with a net. Located on the left hand side of the schematic editor there is the icon toolbar. Hovering over one of the icons with the mouse shows its name and functionality in the status bar. Simply explore the icons. If you are not sure what you can do with a certain command, look into the help function. Press F1 and there you are. An interesting command is SMASH. It releases name and value text from the symbol in order to move it or change its layer or size. By the way: For fine adjusting a text, press the Alt key when you are moving a text. Alt activates the alternative grid that can have any size which is set in the GRID dialog. This can also be used with other commands like LABEL that places the net name or a cross reference. The final step in creating a schematic should be the Electrical Rule Check. The result of this check is presented in the Errors window. Click onto the error and warning messages and EAGLE shows you where to look in the drawing.

EP&Dee â?? May, 2012 â?? www.epd-ee.eu

Next part will introduce the Design Link interface which offers access to more than 400.000 components. n www.farnell.com

DISPLAY INDUSTRY NEWS

Handheld 3D imaging system for medical applications relies on Qt Commercial An innovative handheld 3D imaging system for use in medical applications has been developed with the support of Digia, Qt Commercial. The Eykona® Wound Measurement System, created by Eykona Technologies, provides clinicians with an objective and repeatable measure of the volume of wounds, allowing comparison and monitoring of the healing process. Qt Commercial assisted Eykona in significantly reducing the project completion time. Qt is an established user interface (UI) and cross-platform application framework used in the automotive, medical, aerospace and industrial automation industries, among many others. Digia, Qt Commercial is a pioneer in the commercial development, support, services and exclusive licensor of Qt for desktop and embedded development. Eykona identified an unmet need for the accurate measurement and clinical characterisation of hard-to-heal wounds such as diabetic and pressure ulcers. Existing techniques estimated the volume

of wounds – the change of which is an important indicator of the healing process – by multiplying an area estimate with a depth measurement obtained from a probe. This method is both inaccurate and difficult to replicate. Eykona used patented technology, based on research at the University of Oxford, to develop a handheld imaging system that produces a full colour 3D model of a wound that can be stored in the patient’s treatment record and shared to enable remote assessment.

DIGIA, QT COMMERCIAL www.digia.com

New Monitor Assembly Series for Industrial Applications Data Display Solution - trendsetting German supplier of TFT displays and system solutions for industrial and multimedia applications - introduces a new product line of assembly monitors. The two new series of monitors, "KioskLine" and "PerformanceLine", present an utmost modular platform for professional touch applications. The PerformanceLine is characterized by its robust construction, and it is optionally available with an IP65 protected front panel. The industrial PC platform is aligned for a very long availability. Data Display with its KioskLine fulfills the needs of mass markets like POS as well as demanding store fittings (Shop-eMedia) with individual design and functionality. With respect to the front line for both product variants, different touch technologies can be chosen, for example resistive and P-CAP sensors for 1, 2

and 10 finger operation as well as a coated safety glass. A variety of different control solutions, reaching from the captive industrial graphics card with VGA, DVI/HDMI and DisplayPort interface or media player with LAN to an integrated high performance PC, are provided. The assembly monitors will be available with display sizes from 10.4" to 24" from summer 2012. The products are designed and produced in Germany.

DATA DISPLAY SOLUTION www.dd-solution.de

New DAWAR Multi-Touch projected Capacitive Touch Screens combine advanced features set with Rugged Durability Dawar’s new Multi-Touch Projected Capacitive Touch (PCT) Screen technology provides the optimum combination of functionality, sensitivity and advanced optics in an all-glass solution ideal for medical, instrumentation and industrial applications. Dawar’s new multitouch PCT screens presently support four simultaneous touch points with full gesture support – tap, flick, pinch, click, expand and rotate. Input is effortless with finger, glove or conductive stylus. Dawar’s PCT system provides optics with 90% light transmission, clarity of ≥ 97%, a rapid response, and excellent accuracy (no linearity calibration required). The rugged all-glass construction delivers exceptional surface durability of ≥ 9H pencil hardness and dependable performance over a wide operating temperature range. Made in the U.S.A. with full U.S.-based engineering support, the new PCT

screens are available in a range of standard sizes – 4.3” to 24” diagonal for controller board solutions and 4.3” to 17” diagonal for Chip-on-Flex. Dawar offers screens in both standard (4:3) and wide aspect ratios, and can provide custom features

such as a decorative front lens for the popular tablet PC look. All are Windows 7 HID compliant – with drivers available for most other operating systems – and support multiple interfaces (USB, RS232 and I2C). DAWAR TECHNOLOGIES www.dawar.com

Kyocera Corporation acquires LCD Manufacturer OPTREX to create Kyocera Display Corporation The Kyocera Group includes over 200 companies worldwide that manufacture a wide range of products including industrial ceramic materials, semiconductor components, automotive components, communications equipment and liquid crystal displays (LCDs). With the acquisition of Optrex and formation of Kyocera Display Corporation, Kyocera will expand its LCD product offerings and manufacturing capabilities for automotive and industrial applications. Kyocera offers a wide range of active matrix TFT LCD panels in sizes from 3.5 to 12.1 inches diagonal and resolutions from QVGA to SVGA. Optrex, founded in 1976, has been focused on small and medium size LCDs in

the automotive and industrial market sectors, offering a range of active matrix TFT and monochrome graphic and character LCDs. Kyocera’s Gen 3 TFT LCD fabrication facility produces state-of-the-art polysilicon and amorphous silicon panels.

Kyocera Display Corporation will complement their high-volume front-end array production capability with Optrex’s backend modularization capabilities. KYOCERA CORPORATION http://global.kyocera.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

LIGHTING INDUSTRY NEWS

Rutronik: Soleriq E LED from OSRAM Opto Semiconductors offers up to 4500 lm even at high application temperatures

GLT and ATD develop 2 × 2 Foot High Bay Ceiling Light with 17,000 Lumens Brightness at 300W with advanced thermal management

The new Soleriq series, the first chip-on-board LED from OSRAM Opto Semiconductors, achieves a luminous flux of 1500 lm to 4500 lm even at high application temperatures. This makes them ideal for downlights with high performance requirements. The Soleriq E is now available at Rutronik in two versions. Downlights provide high-quality background lighting, e.g. in shopping malls, offices, industrial buildings and high-end residential premises. With a luminous flux of 1500 lm to 4500 lm, only one LED of the new Soleriq series is needed to give such a luminaire enough light. This makes designing luminaires much easier because only one component has to be integrated instead of lots of LEDs. The individual chips of a Soleriq E are all under the conversion layer

Global Lighting Technologies (GLT) Inc. has utilized its advanced LED-based edge lighting technology in conjunction with Advanced Thermal Devices’ (ATD) Loop Heat Pipe heat dissipation technology to develop a new high brightness luminaire for use in high bay recessed ceiling light applications. The new ceiling light, ATD Model # SL-300-C7-NW, offers 17,000 usable lumens at a rated power of 300W and a color temperature of 4,000-5,000K. Slim and lightweight for a luminaire of its power and performance, it is ideal for a range of indoor applications such as theaters, auditoriums, convention centers, large open office spaces, parking garages and warehouses. The luminaire measures 600 × 600 × 115mm (23.6 × 23.6 × 4.5 inches) and weighs 17Kg (37lbs.), including adapter, and is waterproof. For illumination, it incor-

(chip-on-board), giving the impression of a homogeneous light emitting surface. This ensures a uniform color and light appearance in the luminaire and

even coupling into external lightguiding optics is very simple. The light generated can be used with much lower optical losses, which in turn makes the LED lamps and luminaires more efficient. The Soleriq E is available in two versions, covering the entire color spectrum from 2700 to 6500K. RUTRONIK www.rutronik.com

Everlight Introduces the Brand New Shwo D LED Lighting Series Expanding Everlight's Lighting Series component portfolio, EVERLIGHT Electronics, one of the world's leading companies in LED Lighting introduces a brand new high power, high brightness LED package, the "Shwo D" Series - our new powerful, bright and economic (superb $/lm) LED series in a compact ceramic package. The Shwo D series is a surface-mount high-power device featuring high brightness combined with a compact size (3.5x3.5x0.58mm) that is suitable for all kinds of lighting applications such as general illumination, flash, spot, signal, industrial and commercial lighting. With standard operating current of 350mA, the Shwo D family can be driven at 1 watt. The minimum luminous flux (lm) of the 1W Shwo D can be up to 110 lm at 6500K(CCT) or 80 lm

at 3000K(CCT) when driven at 350mA of current. The thermal pad of this device is electrically isolated providing convenience in thermal and electrical design. The Shwo D series

also has the advantage of low thermal resistance. It is one of the most promising devices in Everlight's high power Lighting Series product offering and is ready to face the challenges of today's Solid-State Lighting requirements. EVERLIGHT ELECTRONICS www.everlight.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

porates a light guide plate (LGP) from Global Lighting Technologies edge-lit by high brightness LEDs spaced along the edge of the LGP, which is only 5mm (0.196 inches) thick, contributing to the slim profile,

light weight and modularity of this easy-to-install unit. LHP can circularly transport waste heat and dissipate it to the surrounding environment by natural convection without extra power, effectively solving thermal problems and extending the lifetime of the LEDs. GLOBAL LIGHTING TECHNOLOGIES www.glthome.com

Everlight Electronics Announces New C52 COB LED Series Adding to the performance and popularity of Everlight’s 6.4W and 8W Chip-on-Board (COB) LED series, one of the highest CRI and highest efficiency COBs on the market, Everlight Electronics Co., Ltd. announces the brand new and smaller C52 COB LED series which is perfectly suitable for directional and decorative applications such as MR lamps and P35 bulbs at LIGHTFAIR International 2012 in Las Vegas/USA. For these types of applications, an LED light source must exhibit compact size, high efficiency, sufficient lumen output, high CRI, high color uniformity, and proper light distribution to maintain a comfortable and uniform lighting environment – all at consumer acceptable prices. With its new C52 COB Series, Everlight Electronics has created the other ideal LED to address major challenges posed when designing a retrofit like MR,

GU or candelabra type: minimum efficiency requirements, thermal management in limited space, and complexity of design.

Everlight’s COB series is a 3.7W multi chip, ceramic substrate based LED that boasts a low thermal resistance (Rth <1.8°C/W) and superior efficacy of 100lm/W at 3000K CCT and high CRI (>80Ra). ). It will be available not only in ANSI 3000K CCT but in all Energy Star / ANSI color temperature ranges. EVERLIGHT ELECTRONICS www.everlight.com

ACTIVE COMPONENTS INDUSTRY NEWS

Rutronik is Microchip's global partner Microchip Technology Inc. and Rutronik enhanced their existing franchise agreement into the Greater China region (China, Taiwan and Hong Kong). Rutronik now supplies its customers with the entire Microchip product portfolio all over the globe to outsourced manufacturing locations or external assembly companies. As previously offered in Europe, Rutronik now provides design-in support on site and customized logistics solutions also in the new franchise regions. Microchip is placed as another strategic manufacturer supporting Rutronik’s global activities. For two decades now both companies have co-operated closely and successfully with joint product, segment, and franchise strategies. Rutronik now takes the fifth position in the worldwide Microchip network. Microchip is one of Rutronik's most important manufacturers with a large share in the microcontroller sales of the distributor. Besides the 8, 16 and 32-bit microcontrollers and DSC (Digital Signal Controller) solu-

tions, the focal products are analog components as well as serial and flash memories and special wireless solutions. Microchip products are predominantly targeted at Rutronik's focal markets Industrial, Automotive, Energy, Medical, Home Appliance and Lighting. “By this wide portfolio of innovative products precisely addressing our most important markets, Microchip is one of our most significant partners. By our enhanced cooperation, our customers now benefit worldwide from the products with an excellent price/performance ratio, best design-in support, low system cost and short delivery and development periods”, Gerd Fischer, Line Manager at Rutronik describes the situation. RUTRONIK www.rutronik.com

Silicon Labs Online Power Consumption Calculator Simplifies Isolation Product Selection and System Design Silicon Laboratories Inc. introduced a web-based Isolator Power Consumption Calculator that streamlines the process of assessing system power budgets for applications requiring digital isolation. The free online utility enables developers to define basic information about their isolation set-up and then calculate the power consumption in a matter of minutes. The power consumption calculator is especially helpful for power-sensitive and thermally constrained designs in small enclosures such as industrial process control modules or programmable logic controllers. In these and similar designs, the developer must understand the power consumption of every component in the system including the digital isolator. The calculator is intuitively easy to use. The user simply selects the settings that match the

design such as total number of channels, VDD supply voltage and individual channel parameters, and then clicks “Get Results” to obtain detailed power and current data. Without access to such a tool,

the developer would need to extrapolate power specifications from data sheets or conduct extensive calculations and then guess at some of the isolation parameters. SILICON LABORATORIES www.silabs.com

IR’s Family of TSOP-6 HEXFET® MOSFETs Offer Cost-Effective, Flexible Solution for Low Power Applications

6th Generation Mega Power Dual IGBT Modules by Mitsubishi Electric

International Rectifier has launched an extensive portfolio of devices featuring IR’s latest low-voltage HEXFET® MOSFET silicon in a TSOP-6 package for low power applications including load switch, charge and discharge switches for battery protection and inverter switches. Featuring very low on-state resistance (RDS(on)) to significantly cut conduction losses, the new power MOSFETs are available as 20V and 30V devices in Nand P-Channel configurations with a maximum gate drive from 12Vgs to 20Vgs. IR’s new portfolio of power MOSFETs in a TSOP-6 package complement the company’s existing devices housed in SOT-23 and SO-8 packages to provide customers

Mitsubishi Electric is introducing its 6th generation Mega Power Dual (MPD) Insulated Gate Bipolar Transistor (IGBT) modules. The modules, which are for use in power converters such as large-capacity photovoltaic and wind power generation systems, are also suitable for other highpower applications e.g. in the areas of Uninterruptible Power Supply (UPS) systems and AC motor control. The new modules’ 6th generation Carrier-Stored Trench-gate Bipolar Transistor (CSTBT) reduces collector-emitter saturation voltage by approximately 15% compared to the MPD modules of the 5th generation and the gate capacitance by 30% to 50%. Furthermore, the maximum junction temperature is raised to 175°C. The new 6th generation MPD IGBT modules are compati-

more flexibility in designing their systems. As a result of the low RDS(on) of this platform, these devices can be used to replace MOSFETs in larger packages to save board space and reduce system cost.

All of the new devices are MSL1 and RoHS compliant containing no lead, bromide or halogen. INTERNATIONAL RECTIFIER www.irf.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

ble to the 5th generation IGBT modules in terms of dimensions, shape and pin configuration. Isolation voltage is now raised to 4000V. Modules of the new series are available as CM900DUC-24S (1200V/900A), CM1400DUC-24S (1200V/1400A) and CM1000DUC-34SA

(1700V/1000A). The new IGBT series is fully RoHS compliant. MITSUBISHI ELECTRIC EUROPE www.mitsubishichips.eu

ACTIVE COMPONENTS INDUSTRY NEWS

Avago Technologies Announces Industry Lowest Operating Power 5MBd Digital Optocouplers Avago Technologies, announced the ACPL-M21L/021L/024L/ W21L/K24L optocoupler family . These optocouplers consume less power as compared to other similar 5MBd optocouplers in the market. The ACPL-×2×L optocouplers are designed to meet customer needs for lower power,higher isolation voltage, and better common-mode rejection (CMR) performance, thanks to the excellent performance of the new LED and detector IC design. Avago Technologies’ digital optocouplers are used in a wide variety of isolation applications ranging from power supply and motor control circuits to data communications and digital logic interface circuits. The new ACPL-×2×L 5MBd digital optocouplers require minimum LED drive current of 1.6mA, and detector IC power consumption of less than 1.1mA. The detector IC contains a CMOS output

stage with glitch-free output during power-up and powerdown, and optical receiver input stage with built-in Schmitt trigger that provides logic-compatible waveforms, eliminating the need for additional waveshaping. An internal shield also guarantees high common-mode rejection (CMR) of minimum 25kV/μs at 1000V commonmode voltage. ACPL-×2×L optocouplers operate at 3.3V/5V

power supply with guaranteed AC and DC performance from an extended temperature range of –40°C to +105°C. AVAGO TECHNOLOGIES www.avagotech.com

SemiSouth first to sample 650V 55mΩ SiC JFETs SemiSouth Laboratories, Inc., the leading manufacturer of silicon carbide (SiC) transistor technology for high-power, high-efficiency, harsh-environment power management and conversion applications, is leading the world once more. After first releasing commercial 1200V trench JFETs in 2008 - which are currently being used in volume production by many manufacturers of UPS, hi-rel products, audio systems and solar inverters today SemiSouth is delivering industry’s first 650 V silicon carbide JFET power transistors. The fast switching speeds, large current handling capability combined with the superior thermal properties of SiC makes these devices ideal candidates for power electronic applications. They employ vertical trench JFET structures, which allow for industry-leading on-resistance per unit area, as much as five to ten times lower

than competing technologies. The 650V/55mΩ SJDA065R055 SiC JFETs – like many SemiSouth devices – feature a positive temperature coefficient for ease of paralleling and extremely fast switching with no "tail" current at 150°C. RDS(on) typical for these new voltage-controlled devices is 0.044Ω, which also exhibit a low gate charge and low intrinsic

capacitance. Typical applications for these TO-220-packaged devices are solar inverters, SMPS, PFC circuits, induction heating, UPS and motor drives. SEMISOUTH LABORATORIES www.semisouth.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

IR Introduces Ultra-fast Switching, Rugged 600V High Frequency IGBTs for Automotive Power Supply Applications International Rectifier introduced a highly innovative 600V automotive grade IGBT platform, COOLiRIGBT™ for use in a wide range of fast switching applications for electric (EV) and hybrid electric vehicles (HEV) including on-board DC-DC converters, motor drives, and battery chargers. The new Gen. 1 COOLiRIGBT™ devices are capable of operating at the same fast switching speeds as MOSFETs while offering higher efficiency at high current levels. The first generation COOLiRIGBT™ devices cover a broad current range and offer a minimum short circuit rating of 5μs, low Vce(on) and positive Vce(on) temperature coefficient. Additional features common to the family include square reverse bias safe operating area (SRBSOA) and maximum junction temperature of 175°C. COOLiRIGBT™ also provides designers with the flexibility of

selecting a diode with optimized performance for the application. The AUIRGC655A1N0 is optimized for main electric and hybrid vehicle inverters and large motor drives while the AUIRGC65A20N0 and AUIRGC65G20N0 are targeted for power supply and high switching frequency applications.

The new devices are all environmentally friendly and assembled with IR’s automotive grade bill of materials which are lead-free and RoHS compliant. INTERNATIONAL RECTIFIER www.irf.com

GMSK/GFSK Modulation Added to CMX7164 CML Microcircuits has released a Function Image Update for the high-performance CMX7164 Multi Mode Modem. Function Image 7164FI-1.x adds the use of GMSK/GFSK modulation and is the latest in a roadmap of function enhancements available through CML’s FirmASIC component technology. These updates are designed to add to the device’s functions and features, increasing its flexibility and facilitating in-thefield upgrades. The incorporation of FirmASIC technology allows the product's function and feature set to be easily configured via special Function Image™ data files. These are uploaded during device initialisation, either automatically from an external serial memory or via

a host microcontroller over the built-in C-BUS serial interface. The 7164FI-1.x supports GMSK/GFSK modulation with BT=0.5, 0.3, 0.27 or 0.25 and up to 20kbps, zero IF (I/Q) Rx and two-point modulation or I/Q modulation Tx. Flexible bit rates support a wide range of applications requiring a selectable flexible bit rate and robustness.

The GMSK/GFSK data is over-air compatible with the FX/MX909B and the CMX7143FI-1.x. CML MICROCIRCUITS www.cmlmicro.com

ACTIVE COMPONENTS INDUSTRY NEWS

IR Introduces Automotive Qualified AUIRS2334S 600V IC for 3-Phase Inverterized Motor Drive Applications International Rectifier has launched the automotive qualified AUIRS2334S 600V IC for 3phase inverterized motor drive applications such as high-voltage compressors (HVAC) and fans. The AUIRS2334S features an advanced input filter to improve the input/output pulse symmetry of the signals processed by the device. Other key features include integrated fixed deadtime protection circuitry, shootthrough protection circuitry and under-voltage lockout protection on both the VCC low-side and all VBS high-side floating power supplies. The new device is also fully characterized for negative transients on the switching node (NTSOA) that may occur during normal operation and protection mode. With its compact package, high level of integration and comprehensive set of protection features, the AUIRS2334S offers a smaller, robust solution for 3phase inverterized motor drive applications used in vehicles com-

pared to alternative solutions that use three half bridge drivers. Proprietary HVIC and latch immune CMOS technology enables ruggedized monolithic construction. Logic inputs are

compatible with CMOS or LSTTL outputs, down to 3.3V. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. Propagation delays are matched to simplify use in high frequency applications. The floating channel can be used to drive N-channel power MOSFETs or IGBTs in the high side configuration up to 600V. INTERNATIONAL RECTIFIER www.irf.com

SemiSouth announces new 1700V/1400mΩ SiC JFETs which simplify fast start-up of 3-phase power supplies SemiSouth Laboratories, Inc. has announced a new 1700V/ 1400mΩ silicon carbide JFET which simplifies start up circuit design in 3-phase auxiliary power supplies. Traditional solutions either use an HV bleed resistor which results in a slow start-up at low line voltages and a high quiescent power loss, or are MOSFET-based which necessitate overload protection and can suffer from high power losses in the MOSFET under fault condition e.g. short circuit. Explains Applications Engineer, Nigel Springett: “By using a depletion mode JFET, designers can achieve a fast start-up using no extra components. Our JFETs need no extra heat sink for this application.”

The SJDT170R1400 will come in a newly developed SMD D2PAK7L package in order to simplify PCB layout and optimize switching performance due to lower

inductance. This package will have a high creepage distance of 6.85mm in order to support 1700V applications and is sized of 16×10×4.4mm. SEMISOUTH LABORATORIES www.semisouth.com

Fastrax IT530 GPS module available from Rutronik now Rutronik distributes the new Fastrax IT530 GPS module featuring decreased power drain and reduced time to first fix in portable, battery-operated devices. The Fastrax IT530 is an ultra-low power consuming and super-sensitive OEM GPS module in a tiny form factor. Made available through distributor Rutronik, the device solves a critically important issue in location-aware, battery-powered consumer products: ensuring a very fast time to first fix (TTFF) without sacrificing battery life. Its sensitivity of -149dBm in acquisition, 165dBm in navigation and power consumption of just 35mW at 3.3V are ideally suited to battery-operated devices. Measuring 9.6 × 9.6 × 1.85mm and weighing 0.4g, the module has an identical footprint as the popular Fastrax IT430. The new power-saving mode AlwaysLocate™ prolongs battery life by controlling receiver power

modes and maintaining location information. Depending on the environment and motion, the module adaptively adjusts its navigation activity to balance positioning accuracy, fix rate and power consumption. The Embedded Assist System (EASY™) reduces warm-start TTFF by up

to 90% with assisting ephemeris data stored internally for up to three days. Additionally, the server-assisted EPO™ file transfer extends the external A-GPS service to a maximum of 14 days. RUTRONIK www.rutronik.com

IR’s μIPM™ power modules deliver up to 60% smaller footprint, high efficiency, cost effective motor control solution for appliances and light industrial applications International Rectifier, IR® introduced a family of highly integrated, ultra-compact, patent pending μIPM™ power modules for high efficiency appliance and light industrial applications including compressor drives for refrigeration, pumps for heating and water circulation, airconditioning fans, dishwashers, and automation systems. By utilizing an innovative packaging solution, the μIPM family delivers a new benchmark in device size, offering up to a 60 percent smaller footprint than existing 3phase motor control power ICs. Available in an ultracompact 12×12×0.9mm PQFN package, the μIPM family comprises a series of fully integrated 3phase surface-mount motor control circuit solutions. The new approach pioneered by IR for this market segment utilizes PCB cop-

per traces to dissipate heat from the module, providing cost savings through a smaller package design and even eliminating the need for an external heat sink. By using standard packaging QFN technology, assembly is simplified

by eliminating through-hole second pass assembly and improving thermal performance compared to traditional dual-in-line module solutions. INTERNATIONAL RECTIFIER www.irf.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

PASSIVE COMPONENTS INDUSTRY NEWS

VPG offers precision resistors with operating temperature over +175°C and Load Life Stability of 0.005% for High-Temperature Energy and Transportation Applications Vishay Precision Group, Inc. announced that its Vishay Foil Resistors division (VFR) is now offering a wide variety of resistors built on Bulk Metal® Z- and Z1-Foil technology for high reliability and stability in hightemperature applications and harsh environments. Z- and Z1Foil foil resistors are available in a variety of configurations. Devices such as the VCS1625Z, VCS1625P, CSM2512, and CSM3637 offer four-terminal Kelvin connections for high reliability and accurate current measurement, and the FRSH and VSMP series feature wraparound terminations to ensure safe handling during the manufacturing process, as well as to provide stability during repetitive thermal cycling. The flexible terminations

of the SMR1DZ and SMR3DZ ensure minimal stress transference from the PCB due to differences in linear CTE (coefficient of thermal expansion) while the her-

metically sealed packages of the VHP100 and PRND series eliminate the ingress of moisture and oxygen. For hybrid circuits, the HTHG is connected with gold wire bonding while the HTHA is suitable for aluminum wire bonding technology. VISHAY INTERTECHNOLOGY www.vishay.com

Tantalum chip capacitors from AVX now deliver higher CV than X5R dielectric ceramic devices AVX Corporation has more than doubled the volumetric efficiency of its tantalum technology, enabling latest versions of its TACmicrochip® capacitor to deliver 15μF/4V and 10μF/6V from a 0402 chip. The CV performance of these TLC series devices is even greater than ceramic MLCC devices using the X5R dielectric. The design of the TACmicrochip® capacitor series eliminates the need for molded plastic from the packaging – required in traditional designs - allowing much greater capacitance to be squeezed into a given package. This has increased the volumetric efficiency from less than 15% to approaching 50% - making them applicable for a much wider range of uses. High CV 15μF/4V, 10μF/6V TLC parts suit miniature application such as hearing aids, ultra-thin

smart phones and tablet PCs. TBC capacitors are available to three specifications: the conservative military standard CWR15, ranging from 0.47μF to 68μF; COTS-Plus devices which can be supplied tested to customized parameters; and SRC9000 devices - specially dedicated to satellites and space systems –

which are subjected to special post-assembly tests to assure the highest quality levels. AVX www.avx.com

26 EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

98T Series – High Currents Inductors are recognised by UL60950-1 An inductance swing of 2:1 from zero to maximum current and a high volt-seconds-currentproduct at temperatures up to +130°C characterises of the 98T series high power toroidal inductors from YDS that are available at MSC Vertriebs GmbH. In addition to standard models with inductance values between 14μH and 335μH customer specific inductors are available. The 98T series inductors are suited for all kinds of switched power circuits, i. e. switching power supplies in all circuit topologies as well as for filter circuits. The cost effective semi encapsulated design supports space saving vertical mount. All 98T series models are specified for an operating tempera-

ture range up to +130°C. Depending on the model the maximum current ranges from 3.6A to 17A. Depending on the core size the energy storage capability is specified between

700μJ and 6030μJ. The 98T series of high current inductors is recognised by UL1950. MSC VERTRIEBS www.msc-ge.com

Next-Generation TrenchFET® Gen IV 30V N-Channel Power MOSFETs feature On-Resistance down to 1.0mΩ at 10V and 1.35mΩ at 4.5V Vishay Intertechnology, Inc. introduced the first devices in its nextgeneration TrenchFET® Gen IV family of 30 V n-channel power MOSFETs. Utilizing a new highdensity design, the SiRA00DP, SiRA02DP, SiRA04DP, and SiSA04DN offer industry-low onresistance down to 1.35mΩ at 4.5V and low Miller charge, Qgd, down to 1.8nC in the PowerPAK® SO-8 and 1212-8 packages. The new Vishay Siliconix TrenchFET IV power MOSFETs incorporate technological improvements in silicon design, wafer processing, and device packaging to deliver a number of benefits to designers of today's power electronics systems. With a reduction in on-resistance times silicon area of over 60 % compared with pre-

vious-generation devices, the SiRA00DP is able to demonstrate extremely low RDS(on) values of 1.0mΩ at 10V and an industrybest 1.35mΩ at 4.5V. TrenchFET Gen IV MOSFETs offer a new structure that utilizes a very high-density design without significantly increasing the gate

charge, overcoming a problem often associated with high cell count devices. VISHAY INTERTECHNOLOGY www.vishay.com

PASSIVE COMPONENTS INDUSTRY NEWS

New 3200MHz VCO From Crystek Corporation Crystek's CVCO55CCQ-32003200 VCO (Voltage Controlled Oscillator) operates at 3200 MHz with a control voltage range of 0.5V~4.5V. This VCO features a typical phase noise of -115 dBc/Hz @ 10KHz offset and has excellent linearity. Output power is typically +6 dBm. Engineered and manufactured in the USA, the model CVCO55CCQ-3200-3200 is packaged in the industry-standard 0.5-in. × 0.5-in. SMD package. Input voltage is 6V, with a typ. current consumption of 27mA. Pulling and Pushing are minimized to 0.3MHz and

0.1MHz/V, respectively. Second harmonic suppression is -12dBc typical. The CVCO55CCQ3200-3200 is ideal for use in applications such as digital radio equipment, fixed wireless access, satellite communications systems, and base stations.

CRYSTEK www.crystek.com

New 2558-2575MHz VCO From Crystek Corporation Crystek's CVCO55CC-25582575 VCO (Voltage Controlled Oscillator) operates from 2558 MHz to 2575MHz with a control voltage range of 0.3V~4.7V. This VCO features a typical phase noise of -120dBc/Hz @ 10KHz offset and has excellent linearity. Output power is typically +8dBm. Engineered and manufactured in the USA, the model CVCO55CC-2558-2575 is packaged in the industry-standard 0.5-in. x 0.5-in. SMD package. Input voltage is 8V, with a max. current consumption of 29mA. Pulling and Pushing are minimized to 2.0MHz and

0.2MHz/V, respectively. Second harmonic suppression is -15 dBc typical. The CVCO55CC-25582575 is ideal for use in applications such as digital radio equipment, fixed wireless access, satellite communications systems, and base stations.

Integrated Device Technology, Inc., the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the world’s first CrystalFree™ piezoelectric MEMS (pMEMS™) LVDS / LVPECL oscillators for high-performance communications, consumer, cloud, and industrial applications. IDT’s new oscillators operate with substantially less than one picosecond of phase jitter in compact industry-standard packaging, making them an ideal replacement for traditional six-pin crystal oscillators (XOs). The IDT 4M series high-performance LVDS / LVPECL oscillators leverage IDT’s patented CrystalFree pMEMS resonator technology, enabling IDT to rapidly factory-program the desired output frequency without the

need to fine-tune expensive crystals. In addition, because the nominal resonator frequency of pMEMS is much higher than quartz crystal, 4M oscillators are able to achieve higher frequencies at lower cost without sacrificing critical performance. The 4M series is the first of a broad port-

folio of MEMS-based devices from IDT that will provide customers with convenient, accurate, low-jitter timing references. IDT www.idt.com

Vishay Intertechnology Releases Four New Engineering Design Kits for D/CRCW e3 Thick Film Chip Resistors CRYSTEK www.crystek.com

122.400MHz crystal filter with only 3dB insertion loss MSC now offers the FTR80361, a 122.400 MHz fundamental mode monolithic crystal filter, from Precision Devices (PDI). The FTR80361 filter features insertion loss of 3dB maximum, spurious response of 70dB minimum and increased bandwidth of up to 200kHz. The device is provided with a terminating impedance (input/output) of 50ohms. Pass bandwidth is a minimum of ±35kHz at 3dB, with passband ripple 1.0dB maximum. Stop bandwidth is a maximum of ±768kHz at 70dB and ±350kHz at 60dB. To save board space in compact applications, this new crystal fil-

IDT Introduces World’s First Piezoelectric MEMS Oscillators for High-performance Applications

ter is housed in a small 25.1mm × 10.0mm × 15.00mm package. A new SMD version is scheduled to be available in Fall 2012. The wide operating temperature range of -40°C to +85°C makes the FTR80361 suitable for use in harsh industrial environments.

MSC VERTRIEBS www.msc-ge.com

Vishay Intertechnology, Inc. introduced four new engineering design kits for its AEC-Q200qualified D/CRCW e3 thick film chip resistors. Designed to help engineers select the perfect resistor for their applications, the kits offer the commercial-offthe-shelf devices in 0402, 0603, 0805, and 1206 case sizes and a wide variety of resistance values, conveniently taped in strips and individually labeled and packaged. The four design kits released today feature E96 series resistance values from 10Ω to 1MΩ (every fourth value) — in addition to a 0Ω jumper — for 122 different values each. The resistors provide tolerance of ± 1%, TCR of ± 100ppm/K, power

dissipation (P70) from 0.063W to 0.25W, and limiting element voltage from 50V to 200V. The D/CRCW e3 thick film chip resistors are ideal for automotive, industrial equipment, telecom

infrastructure, consumer, and computer applications. The devices are compliant to RoHS Directive 2011/65/EU and halogen-free according to the IEC 61249-2-21 definition. VISHAY INTERTECHNOLOGY www.vishay.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

PASSIVE COMPONENTS INDUSTRY NEWS

Rutronik introduces Redpine Signals‘ new 5 GHz Wi-Fi RTLS tags Rutronik announces new WiseMote™ Wi-Fi devices from Redpine Signals for RTLS and sensor network applications operating in 2.4 and 5GHz bands, providing enterprise security and improved battery life. The WiseMote™ WM1-20 (2.4GHz) and WM1-50 (2.4/5GHz) 802.11n from Redpine Signals work with any third-party hardware and software RTLS infrastructure. Their advanced features include enterprise security and single stream 802.11n, therefore making them ideal for deployment in enterprise environments. Operation in the 5GHz band provides for close adherence to designed battery life compared to crowded 2.4 GHz channels. The devices can be programmed to operate in a variety of modes,

supporting multiple location tracking and update mechanisms. In Cisco Compatible Extensions (CCX) mode, they offer Cisco CCX compliant beaconing with configurable patterns, telemetry and alarm notifications. In Wi-Fi associated mode, they periodically connect to access points, com-

municating sensor and channel data to a server. In other beaconing modes, the devices support standard Wi-Fi clients with simple tag identification software to locate and identify assets. RUTRONIK www.rutronik.com

Vishay Intertechnology Launches Infrared Receivers for Universal Infrared 3D TV Shutter Eyewear Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the release of two infrared (IR) receivers developed specifically for universal 3D TV glasses. The majority of LCD 3D televisions sold today use active shutter glasses to separate the images intended for the left and right eye. Despite efforts to standardize the technology used to synchronize the 3D TVs with their corresponding active shutter glasses, the industry is far from this goal, and there exists a large number of incompatible IR and RF protocols from various manufacturers. The lack of a standard has led to the development of a market for universal 3D TV eyewear capable of functioning with any 3D TV using active eyewear technology. The new TSMP6000 and TSMP77000 are surfacemount IR receivers designed to

receive any infrared signal used for 3D TV synchronization, and this capability simplifies the design of universal 3D TV eyewear. The TSMP6000 and TSMP77000 integrate a photodiode, amplifier, and signal conditioning IC into a single tiny package that helps minimize the weight of 3D glasses, and their ultra-low current consumption maximizes the battery life. The TSMP6000 and TSMP77000 are surface-mount devices that can be mounted in a side or top view.

VISHAY INTERTECHNOLOGY www.vishay.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

Omron offers downloadable 3D CAD Drawings for full electronic component range Omron Electronic Components Europe has made 2D and 3D CAD drawings for the overwhelming majority of its electromechanical solid state relays and switches as well as its connectors and sensors available for instant download online. The drawings are published on the portal run by Traceparts, a leading CAD software company with nearly a million registered users and a database of millions of parts including electronic components. They can be downloaded at http://www.tracepartsonline.net/ ws/omron/index.aspx. Commenting, Mark Jones, COO of Omron Electronic Components Europe, said, "Now, customers can quickly find a 2D or 3D CAD drawing of the Omron component they need for their design, and download it instantly in

native formats for popular CAD systems or industry standard CAD formats. This will enable engineers to design PCB layouts much quicker and more efficiently. Technical specifications and datasheets are already available on the Omron website."

By registering on the Traceparts website, Omron customers can readily search the catalogue of Omron components, view the components and configure them to suit their specific requirements then download a 2D or 3D CAD model in their preferred format. OMRON http://components.omron.eu

Next-Generation 400V, 500V, and 600V Vishay Siliconix N-Channel Power MOSFETs offer Ultra-Low On-Resistance down to 0.130Ω, FOM down to 7.65Ω-nC, and Currents from 3A to 36A Vishay Intertechnology, Inc. released the first devices in its next-generation D Series of highvoltage power MOSFETs. The new 400 V, 500 V, and 600 V nchannel devices combine low specific on-resistance with ultra-low gate charge and currents from 3 A to 36 A in a wide range of packages. Based on a new high-voltage stripe technology, the D Series MOSFETs released today enable new levels of efficiency and power density. The devices' stripe design — with a smaller die size and terminations — lowers the total gate charge by 50 % compared

with previous-generation solutions while increasing switching speed and reducing on-resistance and input capacitance. The 400 V, 500 V, and 600 V

devices feature on-resistance down to 0.17 Ω, 0.13 Ω, and 0.34 Ω, respectively. VISHAY INTERTECHNOLOGY www.vishay.com

PASSIVE COMPONENTS INDUSTRY NEWS

Vishay Intertechnology releases High-Voltage, Ultrafast SMD Avalanche Rectifier in Low-Profile DO-214AC Package Vishay Intertechnology, Inc. released a new high-voltage, ultrafast surfacemount avalanche rectifier in the plastic DO-214AC package. The BYG23T combines a low 1.98mm profile with extremely high reverse voltage of 1,300V and fast 75ns reverse recovery time. The rectifier released today is optimized for high-voltage, high-frequency rectification in switchmode power supplies (SMPS), HID ignition drives, and industrial ballasts. The BYG23T features low typical reverse current of 2.9μA at + 125°C, 5mJ pulse energy in avalanche mode, forward current of 1.0A, and forward voltage of

1.39V at 1A and + 125°C. Ideal for automated placement, the BYG23T offers a rugged maximum operating junction temperature of + 150°C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of + 260°C. The device is compliant to RoHS Directive 2011/65/EU and WEEE 2002/96/EC, and it is halogen-free according to IEC 61249-2-21. Samples and production quantities of the BYG23T are available now. VISHAY INTERTECHNOLOGY www.vishay.com

Vishay Intertechnology Introduces New AEC-Q200-Qualified, Dual-in-Line Thin Film Resistor Networks in 14- or 16-Pin SOIC Packages Vishay Intertechnology, Inc. introduced a new series of AEC-Q200-qualified, dual-in-line thin film resistor networks. The NOMCA series features low absolute TCR of ± 25ppm/°C, TCR tracking of 5 ppm/°C, tight ratio tolerances to ± 0.05%, and excellent long-term ratio stability of 0.05% after 1,000 hours at + 125°C. For improved ESD and moisture protection, the resistor networks are constructed with self-passivating tantalum nitride resistor film on a high-purity alumina or ceramic substrate. Featuring a rugged, molded 50 mil pitch construction, the NOMCA thin film resistor networks offer 7 or 8 isolated resistors of equal

value in compact, narrow (0.150in.) 14- or 16pin SOIC packages, in accordance with JEDEC

Vishay Intertechnology releases industry's first Power Thick Film Resistor to offer Power Rating of 1100W in compact 57mm by 60mm Footprint Vishay Intertechnology, Inc. released a new power thick film resistor that is the industry's first resistor in the compact 57mm by 60mm package to offer a power rating of 1100W at a heat sink temperature of + 25°C. The LPS1100 offers hightemperature derating performance and a broad range of resistance values. The LPS1100 thick film resistor is noninductive (< 0.1μH) and provides a resistance range from 1Ω to 1.3kΩ. Designed for easy mounting to a heat sink, the device's

compact footprint, low 25mm profile, and low weight of 79 grams save valuable space to help

designers reduce the size of their end products. VISHAY INTERTECHNOLOGY www.vishay.com

MS-012 variations AB and AC. Each resistor offers a wide resistance range of 1kΩ to 50kΩ and a typical power rating of 100mW. The integrated construction of NOMCA resistor networks allows for higher precision over discrete SMT chips, making the devices ideal for precision voltage dividers, op amps, and battery management applications. Typical end products will include automotive, telecommunications, industrial, process control, and medical equipment. Samples of the NOMCA resistor networks are available now. VISHAY INTERTECHNOLOGY www.vishay.com

The leader in film capacitors – endless innovation Electronic Concepts, which has its corporate headquarters in Eatontown, New Jersey, was founded in 1969. The company’s asset base is unique in the electronics industry: vertically integrated manufacturing, stateof-the-art automated production lines and a wealth of engineering experience. The company has everything it takes to produce capacitors which set the standard in the industry. Electronic Concepts is the recognized leader in the design and manufacture of film capacitors. The company markets a broad range of standard product lines ranging from small chip-size capacitors to large building blocks which are manufactured in the US and at

the Oughterard plant in Ireland, where production got underway in 1981. Basing production in two plants ensures security of supply, and the company can guarantee throughput times of 10 - 12 weeks. Prototypes can be supplied within 4 - 6 weeks.

ELECTRONIC CONCEPTS EUROPE www.electronicconcepts.ie

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

SMT INDUSTRY NEWS

Essemtec’s ePlace 4.0: A Quantum Leap ePlace 4.0 is the most modern graphical user-machine interface from Essemtec. Currently, various SMD placement machines are compatible with ePlace, including Paraquda and Cobra. ePlace 4.0 uses Windows 7/64 bit as its operating system. Windows 7 is replacing Windows XP more often in business applications and machine controls because 64-bit computers can calculate highly accurate numbers and measurements faster. Operators can profit from quicker screen displays and faster calculations of complex simulations and optimizations. The Windows 7 operating system simplifies the integration of the pickand-place machine in a company’s network. The fact that ePlace 4.0 now works with an SQL database further eases the integration. The user can chose between MSSQL, MySQL and PostgreSQL. In the past, ePlace used a highly efficient XML database, which remains available with the 4.0 release. However, data now can be exported from XML to an SQL database and vice versa via a simple mouse click. ePlace 4.0 is as

easy to understand as previous versions because the user interface appearance remains unchanged. However, user help has been expanded with numerous additional documents and process information. Many details of ePlace have been adapted to customers’ growing needs. For example, components

with no visible leads such as BGAs now can be shown from bottom-up alternatively. In conjunction of ePlace with the pickand-place machine, the vacuum detection of the placement head has been optimized. The vacuum generator is now stabilized in tighter limits. As such, pick-up errors can be detected quicker and more reliably for even the smallest components. ESSEMTEC www.essemtec.com

Rochester Institute of Technology Partners with MARTIN to Provide Rework Training & Research Rochester Institute of Technology has partnered with equipment supplier MARTIN to utilize a MARTIN Expert 10.6 Rework Station and Mini-Oven unit in its Center for Electronics Manufacturing and Assembly (CEMA) located in Rochester, NY. The systems will be on hand to support CEMA in many ways, including hands-on education for students, industry workforce training, support of student projects and applied research. The center also will provide MARTIN the opportunity to showcase its equipment to many local and regional electronics packaging companies, and to conduct investigations to explore its suitability for customer applications. The Expert 10.6 system

is capable of precision rework of SMDs, sockets and connectors, as well as residual solder removal and dispensing of fluxes and solder pastes. The hybrid platform combines both infrared and con-

vection heating technologies to achieve outstanding board temperature uniformity. MARTIN www.bgarework.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

Viscom Introduces New AOI Features with SI Software Release 7.45 With its software, Viscom offers many useful additional features to make using AOI/AXI inspection systems in electronics manufacturing faster and more convenient. With the new Software Release 7.45, Viscom has again added additional features. Highlights include improved component body detection for SOTs, the new color ring inspection capability for resistor values, further simplified optical character recognition (TopOCR), and solder ball inspection. SI Release 7.45 offers new features to provide even more improvements to increase system performance and relieve the operator. One example is improved component body detection for SOTs. Viscom has developed a new algorithm for this task and optimized it in actual manufacturing runs involving high piece counts. With this new inspection process, reliable defect detection and reduced false alarm rates can be attained. For the color ring inspection, a new analysis process based on

color images from the 8M camera technology is now available. This process ensures that color ring inspection for Melf and THT components is fast and reliable. Another new useful function is solder ball inspection. In addition to the familiar variants

of inspection window generation from GenCad or Gerber data, this function is now available as a component of the Viscom SI software release. Viscom now offers an improved optical character recognition (OCR) software. OCR has become a standard procedure on components. VISCOM www.viscom.de

MARTIN demonstrated Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum MARTIN presented its MiniOven Reball/Solder Bumping unit at the last SMTA Toronto Expo & Tech Forum, at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada. The MINIOVEN 04 provides a reflow environment in a compact, standalone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and will

accommodate up to 99 profiles, with the ability to edit individual profiles and fine tune parameters. A gas connection is avail-

able for processing gases, such as nitrogen, argon and formic. MARTIN www.bgarework.com

SMT INDUSTRY NEWS

ASM iHawk Xpress Opto Wire Bonder: Faster, wider, and more precise With its ASM iHawk Xpress Opto, ASM Pacific Technology, the global leader in backend solutions, presents a completely new wire bonder. Thanks to its improved transport, the ASM iHawk Xpress can handle lead frames that are up to 100 mm wide. Its bonding accuracy was improved to 3 μm, and ASM's GoCU technology enables it to operate faster with lower-cost copper wire than with gold wire. These features make the ASM iHawk Xpress particularly interesting for European component manufacturers looking for a more flexible and precise wire bonding solution for their development activities as well as for their prototype and small-lot production. In addition, the new and unique Auto Wire Rethread System of the ASM iHawk Xpress ensures that the bonding wire is clamped in place and automatically rethreaded after a break. This minimizes the downtime and improves the productivity of the application. With its iHawk

Xpress, ASMPT celebrated two premieres at once at the SMT Hybrid Packaging 2012: After its integration into the ASM Assembly Systems organization, the European ASMPT organization presented its packaging solutions for the first time at the SIPLACE booth next to the SIPLACE placement solutions.

ASM ASSEMBLY SYSTEMS www.siplace.com

Blakell Europlacer Expands Distribution Range to Include Leading AOI Provider Blakell Europlacer Ltd., a manufacturer of market-leading flexible SMT placement machines, introduces the newest addition to its range of distribution products — Aleader Automatic Optical Inspection. The Aleader AOI range includes both on- and offline systems that use 3-D topography and face recognition algorithms to result in systems that are easy to program, provide extremely low false call rates (typically less than four false calls per 1000 devices tested) and are competitively priced. Blakell Europlacer’s UK General Sales Manager Andy Jones explains why he felt that Aleader was the right system to add to its other SMT assembly equipment portfolio: “We have been selling AOI systems for a period of time and have been very successful. However it has become clear that due to the nature of the UK market, many manufacturers are looking for a system that can be adapt-

ed quickly to reflect the changing nature of their business.” Headquartered in Israel, Aleader Europe is the European distributor for AOI systems and, in the global territories that have established distribution networks, sales of Aleader AOI systems are flour-

ishing. Aleader already has installed more than 30 systems in the Israeli market. BLAKELL EUROPLACER www.europlacer.com

Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego Nordson DAGE, a division of Nordson Corporation will exhibit its 4000Plus Bondtester Pad Cratering Inspection System at the upcoming Electronic Components and Technology Conference (ECTC), scheduled to take place May 29-June 1, 2012 at the Sheraton San Diego Hotel and Marina in California. The new Nordson DAGE 4000Plus Hot Bump Pull/Hot Pin Pull system is a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test. The industry unique solution conforms to IPC9708 as well as JEITA ET-7407A test standards for the detection of pad cratering for surface mount and printed circuit board assemblies. It is fully integrated into a single load cartridge on a standard 4000Plus system. Heating and cooling stages and a pin clamping mechanism are integrated into the single load cartridge. The 4000Plus Bondtester represents the new industry stan-

dard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semiautomatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

NORDSON DAGE www.nordsondage.com

ECT Introduces A7 Flying Probe Test System from atg-LM Everett Charles Technologies (ECT) introduces the new A7Cf Flying Probe Test System from atg-LM. The double-sided test system features four probes on top and four additional probes on the bottom. The test platform first was unveiled at the CPCA show in Shanghai with positive feedback. “The A7 is atg-LM’s latest innovation in high-performance, high accuracy flying probe,” said Klaus Koziol, atg LM’s Director of Sales North America. The high-speed A7 performs up to140 measurements per second or up to 8400 per minute, depending on the product under test and test method. The platform features a large test area of 20×24", and can inspect pad sizes down to 2 mil (1.3 mil with micro nee-

dle) and pitches down to 4 mil (3 mil with micro needle). The universal shuttle system offers a clamp and tension mode for testing flexible and rigid boards. In addition to providing high-speed Kelvin 4-wire measurement, the A7 features direct

linear drives and a carbon fiber Z-axis for extreme accuracy and speed. EVERETT CHARLES TECHNOLOGIES www.ectinfo.com

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

SMT INDUSTRY NEWS

New Control Center for all Cognex Vision Systems and Industrial ID Products

SIPLACE SMT-Insights Whitepaper: Maintenance

Cognex Corporation, the world’s leading supplier of machine vision systems, today announced the release of the Cognex Explorer™ control center. This unique utility displays a graphical view of all Cognex vision systems, ID readers and visualization systems connected to the network. It also incorporates powerful maintenance tools for backing up, restoring or cloning systems, carrying out firmware upgrades, and much more. Cognex Explorer was designed for control, production and maintenance engineers who will find the intuitive point-and-click interface easy to use without any training required. The new control center offers the ability to: • Display the identity, type and status of all Ethernet-connected In-Sight® vision systems, DataMan® ID readers and VisionView® display devices on the network • View device settings including

Whether you are dealing with airplanes, trucks or SMT placement machines – good maintenance preserves value and directly affects your quality, productivity and the bottom line. To explain how maintenance processes for SMT lines can be optimized, managed and easily integrated into the production flow, the SIPLACE team recently published an informative brochure for electronics manufacturers. "SIPLACE-Insights: Maintenance" explains how the maintenance intervals for placement machines and their subsystems can be organized with great flexibility and based on the respective factory's capacity utilization. It also explains the available concepts, tools and services and covers less well-known topics such as certifications and how they can be used to improve customer loyalty. And for those who believe that maintenance is nothing but

IP addresses, firmware/software versions, etc. • Execute firmware updates • Backup and restore multiple systems simultaneously • Clone systems when adding more systems to the network • Add licenses for VisionView The Cognex Explorer control cen-

ter is available now and is free of charge to all Cognex customers. To download the utility or for more information, please visit www.cognex.com/explorer COGNEX www.cognex.com

Practical Components Dummy Components Display Case Brings Training and Presentations to Life Practical Components Inc. has introduced a display case containing a sampling of components. The display case includes components ranging from the latest in high technology (01005s, PoPs, CVBGAs and flip chips) to standard SMT packages (PBGAs, MLFs, QFPs and TSOPs). The display case is equivalent to a CD case for portability. The case is educational, providing a quick, portable show-and-tell representation for students, coworkers, customers and vendors. This display case contains the following sample components: • PoP Top Package on Package • PSvfBGA Bottom Package on Package • CVBGA Very Thin ChipArray® • PBGA Plastic Ball Grid Array • QFP Quad Flat Pack • LQFP Low-Profile Quad Flat Pack

• MLF® MicroLeadFrame • QFPQFN Open-Molded Quad Flat Pack No Leads • TSOP Type I • Flip Chip • 01005 Chip Resistor • 0201 Chip Resistor • 0402 Chip Resistor • 0603 Chip Resistor • 0805 Chip Resistor • 1206 Chip Resistor • SOT23 Transistor • SOD80 Diode • TO18 Through-Hole Transistor • 1/4 Watt Axial Leaded Resistor

PRACTICAL COMPONENTS www.practicalcomponents.com

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

a necessary evil, a case study quantifies the impact of optimized maintenance on line productivity and quality, i.e. the concrete "return on maintenance". Interested electronics producers can order "SMTInsights: Maintenance" and other brochures from the SIPLACE SMT-Insights series at no charge.

ASM ASSEMBLY SYSTEMS www.siplace.com

BPM Microsystems demonstrated a new solution for In-System Device Programming at the 2012 SMT Hybrid Packaging Exhibition BPM Microsystems demonstrated its new in-system device programming solution at the last SMT Hybrid Packaging Exhibition, May 8 - 10, 2012 at the Exhibition Centre Nuremberg in Germany. The new 2800ISP Parallel In-System Device Programmer offers the unmatched performance and flexibility of 8th Generation site technology. With a custom-designed test fixture, operators can easily program flash, microcontrollers and other device technologies onboard after reflow. The semi-automated design of the 2800ISP uses a pneumatic fixture with built-in safety features to actuate the pressure

plate. Once actuated, the circuit board makes contact with high quality pogo pins that are specifically engineered to

achieve exceptional signal integrity. Ideal for medium and high-volume production, the 2800ISP is configurable and can program up to 16 devices in parallel. BPM MICROSYSTEMS www.bpmmicro.com

SMT INDUSTRY NEWS

Maximum flexibility for diverse productions UVAX Concepts chooses SIPLACE SX

Cobar launches newest Tacky Flux for Lead-Free Solders

Since 1997, UVAX Concepts from Valencia/Spain, acts as a globally successful manufacturer of electronic products. UVAX Concepts´ know-how in design of state of the art electronic circuits, devices and systems, as well as its excellent expertise as an EMS provider, is well known within the international electronic industry. For UVAX, as well as for its customers, maximum flexibility is one of the most important topics. Therefore, UVAX Concepts has decided to invest in a SIPLACE SX platform, which offers an impressive amount of flexibility, from the machine’s Capacity-on-Demand layout to the revolutionary SIPLACE MultiStar placement head. The MultiStar boasts a component range from 01005 to 50mm×40mm, besides extreme versatility, and most important for UVAX products, making sure today’s highest quality standards are met as well. For more than twenty years, UVAX Concepts has been manufacturing and deployed highest quality electronic products successfully all over the world. The company’s services include engineering support and design of integrated circuits, electronic systems, and control equipment,

With the purchase of the SIPLACE SX, UVAX expects further acceleration of its implementation of the company’s new Smart Cities product line, which is getting momentum and more demand by the day.

The Balver Zinn/Cobar Group introduces Tempotac (120-TEM), its newest next-generation tacky flux. Tempotac (385-TEM) is a well-established product within Cobar’s product portfolio and features the basic ingredients of a solder paste flux including various activators. With the introduction of lead-free solders that include higher process temperatures, a new product has been introduced — 120-TEM. This product can withstand higher temperatures and is available in a blue color for inspection purposes when required. Tempotac is a remarkably versatile material that can be used in an array of rework applications including: • Reballing — where availability of BGAs with lead-free spheres is limited, replace lead-free spheres with SnPb spheres before mounting (e.g. military, aerospace, medical, etc.) • Repair Applications — remove and replace BGAs • BGA Placement — Tempotac can be used instead of solder paste • Bridging — Removes bridges in QFP rework.

ASM ASSEMBLY SYSTEMS www.siplace.com

BALVER ZINN/COBAR GROUP www.balverzinn.com

helping customers at the prototype stage, as well as manufacturing small and large production runs. UVAX customers are all over the globe, from the USA to Malaysia, Indonesia, Germany, France, Switzerland, Australia, … .

SENSORS DESIGN

Keys to successful gas flow measurement When I first began working with fluid dynamics, I was advised the field was as much an art as a science. Working to improve the efficiency of industrial pollution control equipment through better flow distribution, we studied field test data, developed solutions, built scaled models to test them, and then often held our breath when it came time to see if they scaled up properly. Fluid dynamic calculations often take on assumptions of idealized conditions, when the actual case may be far from it. Even after running highly complex computer modelling, engineers frequently find themselves making final design adjustments to designs in their laboratory. by Donna Sandfox, Product Manager, Omron Electronic Components LLC The behaviour of gas flow and achieving a stable, accurate mass flow measurement is affected by many factors. The composition of the gas will affect properties such as density and thermal conductivity. Environmental conditions like temperature, humidity and altitude play a part, as does the medium through which the flow is moving. The surface roughness of the tube/ Mass flow sensors are often preferred to volumetric sensors, as volume is dependent on pressure and temperature, while the mass can be thought of as “how much” (not to imply that mass flow sensors are completely immune to these changes, particularly temperature). Going back to basic thermodynamics is the Ideal Gas Law (PV=nRT) - a prime example of a formula assuming idealized conditions; at least this one advertises itself as such. A quick refresher… Pressure × Volume = Amount of Gas (moles) × Universal Gas Constant × Absolute Temperature Moles = Mass / Molar Mass. Molar mass is a gasspecific constant. Rearranging and combining constants, Volume = Mass × Temperature/Pressure × Constant Why are “mass flow” sensors then rated in LPM (Liters per Minute)? If you examine the datasheets closely, you should find that the LPM readings are at a stated set of “standard” or “normalized” pressure and temperature conditions. These standards will vary depending on which organization was referenced (NIST, IUPAC…). 1 atm and 0°C are commonly used. pipe/duct influences the resistance between the gas and the walls.

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

Selecting a mass flow sensor that is suitable to the application can be a challenge, and mistakes can be costly. In the paragraphs that follow, I will illustrate a number of factors of which to be mindful. Some will be relevant to a variety of sensor types; others will focus on thermal based mass flow sensors. Gas Composition When selecting a flow sensor, the first thing we think about is the appropriate flow range. Make sure to check which gas type the sensor is calibrated for, as gas composition will change the output of many sensors. Air is the most common, but not always the case. When using a different gas, always contact the sensor manufacturer. Text book conversions don’t necessarily apply across the board for different sensor types. Gas density is certainly a factor, but for temperature based mass flow sensors, thermal conductivity is also quite important. Omron, for instance, will provide alternate output curves for some gases (air vs. natural gas vs. argon), but recommends a custom factory calibration to achieve optimal results for other gases (ex: carbon dioxide and nitrogen oxides). If the gas composition will be changing significantly, look for a sensor that is designed specifically for that condition, as most cannot distinguish the difference between a change in density versus the amount of flow. Turbulence and Pulsation in the Gas Stream Turbulence and/or pulsation in the gas stream can result in unstable and inaccurate flow measurement. These issues can be addressed in the design of the flow path around the sen-

sor, however, some sensors are designed to be more tolerant of these conditions. Several of Omron’s in line sensors are designed with a series of inlet screens (see Figure 1) which act to smooth out turbulent flow and provide a very even flow across the diameter of the sensor. This results in a representative velocity moving over the MEMS chip. When using a sensor without a laminar flow structure, incorporating sections of straight pipe upstream and downstream of the sensor is often recommended. The required length of this section can be calculated by using the Reynolds number, however, some suggest approx 10 diameters upstream and 5 diameters downstream.

Figure 1 Additionally, when screens are not used, some manufacturers recommend a filter upstream of the sensor to protect the sensing element in particulate laden environments. Pulsating flows, such as those from diaphragm pumps, can be addressed by a few methods. Outside of the sensor, a buffer tank upstream

of the measurement device or an orifice down stream are two options. Within the sensor design, an orifice installed within the sensor (ex. Omron’s 70 200 LPM D6F 01/02A2 model) may be sufficient. Flow sensors which incorporate an internal bypass design have also shown to be less prone to pulsation issues. An internal bypass is where a small amount of flow is pulled from the main flow path over the sensing element, rather than the sensing element being located in the main flow path of the sensor (watch for Omron’s D6F AB type to be Figure 2

released soon). A similar solution is to use a smaller sensor in a bypass (see Figure 2). More details on this type of set up are discussed below. The pulsation phenomenon is difficult to model. Sometimes trial and error is the only way to determine the best approach for a particular system. In exceptionally difficult situations, a combination of the above methods are sometimes required. Sensor Characteristics It is also important to make sure the characteristics of the sensor are compatible with the application. The response time of the sensor is critical in a number of devices, and this characteristic can vary significantly. Some manufacturers will modify their timing constant upon request. Please note that a faster response time may result in more noise in the output signal. Some applications have a limit to the pressure drop they can tolerate (ex. breathing circuits in medical devices). A sensor with minimal internal restrictions, or using a small sensor in a bypass configuration (see Figure 2) are two options.

SENSORS

DESIGN

INDUSTRY NEWS

Bypass Set up The bypass set up involves more design work, however, a smaller and often less expensive sensor can then be used. (Omron’s factory engineers offer design assistance utilizing Computational Fluid Dynamics modeling software for customers interested in this option.) Flow sensors in a “bypass configuration” are similar to using a differential pressure sensor (an indirect flow measurement method); however, there are some technological differences that should not be overlooked. In both instances, the sensor is connected to two ports, which are installed on either side of an orifice creating a pressure drop. In differential pressure sensing, the difference in upstream and dow nstream pressures is measured on either side of a diaphragm. It’s a static system — the air does not pass through the diaphragm. A mass flow sensor is a dynamic system, as the airflow continually passes through the sensor. The major implication of this difference is that the pressure drop of the “bypass system” will influence the output of some sensors, meaning that the tube lengths of the bypass need to be controlled in the manufacturing process. In many applications this is not an issue; however, it can be in those such as HVAC control where tubes are installed in the field. This problem can be avoided by the use of High Impedance Flow Sensors which have a very narrow, high velocity flow path. While I’m sure I haven’t addressed all the potential issues to consider when selecting a flow sensor, I hope I’ve helped in the avoidance of some common pitfalls. If fluid dynamics is not your area of expertise, don’t be afraid to ask for some assistance at www.element14.com. n

www.element14.com

Plessey uses its EPIC sensor technology to create a heart monitor in a wristwatch Plessey Semiconductors has designed a heart rate monitor demonstration using its awardwinning EPIC™ sensor technology, which is the same size as a wristwatch and does not require a chest strap or second sensor at the end of a cable that could be easily lost or damaged. This reference design shows that simple and effective personal monitoring of electrocardiograph (ECG) signals can be as easy as taking a pulse measurement. The device straps to the wrist with a sensor electrode on the rear of the device in permanent contact with the wrist and the second electrode is on the front of the device. Touching this top electrode with a finger from the opposite hand enables the device to collect the heart signals. Plessey has also designed a version to provide continuous heart monitoring. This device straps to the upper arm and has

two contacts on the inside of the strap. These are positioned such that the electrical cardiac signals are out of phase to give a strong differential signal to noise ratio so that unwanted noise artefacts from other muscles can be easily filtered out to give a detailed ECG trace. Such a device would enable patients to be monitored as they go

about their daily routine and detect transient issues that would probably be missed during a short period of monitoring with the conventional seven electrodes and gel approach. Plessey Semiconductors www.plesseysemiconductors.com

IDT Introduces Low-power, High-accuracy Temperature Sensor for Solid State Disk Drives Integrated Device Technology, Inc. (IDT®) announced a new family of precision temperature sensors targeted at ultra-lowpower solid state drive applications. This new family of devices minimizes power consumption and optimizes bill-of-materials (BOM) costs while maintaining compatibility with existing standards for high-volume memory modules. The IDT TS3000GB0A0 is a low-power, high-accuracy temperature sensor for enterprise server and storage applications. It supports a 1.8V power supply for reduced power consumption and compatibility with the existing supply voltage for SSD memory modules, eliminating the need for additional voltage regulators. The device continues the IDT tradition of industry-leading temperature accuracy by exceeding the requirements set forth by the Joint

Electron Device Engineering Council ( JEDEC) JC42.4 specification for Grade B temperature sensors over the temperature range of -20°C to +125°C.

An innovative analog-to-digital converter (ADC) enables programmable resolution up to 12 bits (0.0625°C) with industryleading conversion time of less than 100 nanoseconds irrespective of the resolution, dramatically improving the overall precision of thermal control loops across temperature. IDT www.idt.com/go/TempSensor

www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

CONNECTORS INDUSTRY NEWS

ODU Single contacts ODU SpringtacTM contact The ODU ODU SpringtacTM contact is the ingenious invention of ODU’s founder Otto Dunkel: • • • • • • • • •

More than 100,000 mating cycles; High current capability to 2,000A; Low contact resistances; Large number of independently cushioning contact springs, for example, 40 at Ø 5mm; Low insertion and withdrawal forces; Extremely secure contacting; High vibration resistance; Long service life due to high-grade materials and surfaces; Many designs and connection types are available or feasible.

ODU Lamella contact • • • • • • • • •

More than 10,000 mating cycles; High current capability; Low contact resistances; Low insertion and withdrawal forces; Secure contacting; High vibration resistance; Long service life due to high-grade materials and surfaces; Many styles and connection technologies available or practicable; Economical alternative.

ODU slotted socket • • • •

5,000 mating cycles; Smallest dimensions are posible; High-grade materials and surfaces; Many designs are feasible.

Application All contacts shown can be either used as stand-alone contacts or in connectors and intercconnect systems. The single contacts shown are used mainly for: Power Supplies, Power Distribution, Testing, Docking Systems, Industrial (heavy Duty) Connections, Grounding and Medical Connectors.

For further details please visit the company website - online catalog. http://www.odu.de/fileadmin/template/pdf/einzel/Einzelkontakte-engl.pdf

Together we can find the perfect solution! Contact: Eng. Alina Cibu Email: alina.cibu@odurom.ro www.odurom.ro

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

ODU ROM Manufacturing Str. Fundătura Lânii nr. 22, 550019 Sibiu, Romania Tel: +40 (0) 269 206345; Fax: +40 (0) 269 221006 For general information visit: www.odu.de

CONNECTORS INDUSTRY NEWS

Morek splice terminals in TME range of products Trade reliability, soundness of every action, speed and flexibility are the motto of Morek company. Morek operates in the territory of Lithuania, Latvia and Estonia. It manufactures automatic and electrical engineering subassemblies. The products offered by Morek Group are also available in Poland – in TME range of products. The assortment includes, among others: terminals and splice terminals. Electrical engineering, power engineering, industrial automatics are the areas where the necessity of connecting high-current power leads is often required. The system of mounting equipment on a DIN bus, commonly used in automatics, greatly facilitates installers’ work, it has been tested against durability and comfort of work. At the same time, it ensures very good after-market service of the used equipment. Damaged equipment can be quickly replaced with a working one, and such replacement does not cause a long down time, e.g. of a manufacturing line. As electricians say: “each equipment works more efficiently when it is connected to the mains”. However, the problem is how to provide proper quality of such connection. The difficulty of this task increases proportionally with the increase of distributed currents intensity. One of the most reliable methods of fast installation of connection elements includes usage of screw terminals. Different variations of such terminals are commonly used starting from electronics to industrial automatics. Morek universal terminals Morek’s offer begins with a single way, universal DIN bus-mounted terminals adapted for aluminum and copper conducts. They are available in several colour versions (grey, blue and yellow-green) with two or four terminals. Those elements have been divided into several groups depending on the number of terminals and conduit intersections, which can be attached to them. The conduit, in a clear way, influences the acceptable intensity of the current that can flow through the terminal. Nevertheless, an essential parameter is the maximum operating voltage equal to 690V, the same for all groups of described subassemblies.

There is also a group of splice terminals with a double terminal. This group includes the following: T021016, T021050, T021095, T021150 and T021240. The last three digits include the information on the intersection of the conduit that can be attached to a terminal. This parameter together with permissible currents are presented in the Table 1. Terminal type T021016 T021050 T021095 T021150 T021240

mended. For example, in case of T022240 splice terminals with the conduit intersection of 150 ... 240mm2, it can be equal to as much as 55Nm. All above described splice terminals do not require the mounting of side walls. They are mounted on the DIN bus by means of specially designed snap locks, and if this is

Permissible area of the conduit intersection Current-carrying capacity [ mm2 ] [A] 1,5...16 82 1,5...50 160 6...95 245 25...150 320 35...240 425

Table 1. Conduit intersections and permissible current-carrying capacity of 2-terminal splice terminals. Depending on the conduit intersections, different torque can be used. For example, in case of conduit intersection of 1,5 mm2, it is equal to 1,5Nm and respectively: 3,5Nm for conduits of 2,5...6 mm2 and 7Nm for conduits 10...16 mm2. In TME range of products, there are also Morek 4-terminal splice terminals. Their parameters are presented in the Table 2. Terminal type T022050 T022095 T022150 T022240

necessary to use another method of mounting, two screws can be used instead. Fixing conduits to screw terminals depends on the terminal type and conduit intersection. Examples of the values are presented above. All offered splice terminals correspond to the power engineering requirements. They have the CE, UL1059 and SGS certificates, and comply with the SFS 2663 norm.

Permissible area of the conduit intersection Current-carrying capacity [ mm2 ] [A] 1,5...50 320 6...95 490 250...150 640 35...240 850

Table 2. Conduit intersections and permissible current-carrying capacity of 4-terminal splice terminals. High current-carrying capacity deserves a special attention. In this case, depending on the conduit thickness, the use of diversified torque is recom-

Transfer Multisort Elektronik Sp. z o.o. www.tme.eu export@tme.eu www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

MISCELLANEOUS INDUSTRY NEWS

Ignition transformers for safe and stable ignition of gas heating systems Electronical Ignition Sytems high frequency and high voltage > 20 000V • Circuit board assembly • Compact design • For unipolar or bipolar ignition • For one or two ignition points • Stringent individual quality-testing • Self-extinguishing potting and housing material Ignition transformers from HAHN guarantee safe and stable ignition of your gas-powered heating systems. Compact in design, they are ideal for use with printed circuit boards. Within our comprehensive Quality Management System which includes several interim checks, each component is subjected to a final 100 % test. In this test, not only the characteristic data are checked but a high-voltage insulation test is carried out. The specially selected components are all subjected to a glow wire test according to DIN EN 60 335-1:2005.

WATER-PROOF HANDHELD DEVICE FOR PRESSURE MEASUREMENTS WITH EXTERNAL CHANGEABLE PROBES

Fair prices and high-qulity products have made Greisinger GmbH a company to be reckoned with on the measuring devices sector, the company’s developing process has been steadily going upwards for the last 30 years. Globally operating and well-known companies are now amongst their regular customers. All Greisinger products are developed and produced in Germany as the only way to ensure the high-quality standards of the products. The quality management system is certified according to ISO 9001:2008 and additionally for potentially explosive atmospheres according to EN 13980: 2002. Development, production and marketing are certified according to Directive 94/9/CE since May 2003. Several products are already examined and certified according to the Directive 94/9/CE.

Features • Water-proof (device and plug-in connections); • Serial interface; • Data logger and alarm function; • Peak value detection (1000 measurements/s); • Leakage test; • Robust silicone protection cover; • Large double display; • Background ilumination. Application • industry and craft. • HVAC: heating, ventilation, air conditioning. • leakage test / pressure test. • chimney draft measurement: under pressure. • leakage test at buildings (i.e. 4 Pascal test). • measurements of gas and oil firings. • automobile trade. Available versions: GMH 5130: with connection for 1 sensor, without sensor. GMH 5150: with connection for 1 sensor, analog output and data logger, without sensor. GMH 5155: with connections for 2 sensors, analog output and data logger, without sensors. Accesories: GMSD...K51: pressure sensor for non-aggressive gases for over/under pressure, differetial and absolute pressure. MSD: stainless steel pressure sensor for air & aggressive gases for over/under pressure, differetial and absolute pressure. EBS 20M: software for long-term monitoring. GSOFT 3050: software for operation of logger devices.

O’BOYLE s.r.l. Tel.: +40 (0) 256-201346 Fax: +40 (0) 256-221036

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

office@oboyle.ro www.oboyle.ro

Eco Design – HAHN Solutions Transformers fulfilling the new guidelines of “Energy using products” (EuP). The EuP Serie 2013 of HAHN is perfect for applications of the electric power supply in electrical and electronic household and office equipment with “standby” and “off” conditions. Already today where a reduced power consumption of P0 < 0,4 is required, the EuP Serie 2013 of HAHN will be a solution.

Westec Westec represents the Italian challenge in the market of Multipole Connectors for Industrial applications.

O’BOYLE s.r.l. Tel.: +40 (0) 256-201346 Fax: +40 (0) 256-221036 office@oboyle.ro www.oboyle.ro

Westec products are certified from latest European and American laboratories (EN 61984, VDE 0627, UL 1977, CSA: C22.2 No. 182.3, NEMA 250 1991 UL50 Type 4,4x,12, DESINA, EUROMAP). We offer a wide range of standard products with a flexible design approach that allows us to manufacture special OEM solution on customers design. These are a few of the advantages you get with our connectors: •Westec is the only manufacturarer of connectors with 16 A for command and 80 A for force on the same connector; •Westec gaskets have the right shape and stronger NBR rubber with a better aging factor than competitors; •Higher percentage of silver in the alloy of the connectors than other manufacturers. O’BOYLE s.r.l. O’BOYLE s.r.l. Tel.: +40 (0) 256-201346 Fax: +40 (0) 256-221036

office@oboyle.ro www.oboyle.ro

Tel.: +40 (0) 256-201346 Fax: +40 (0) 256-221036 office@oboyle.ro www.oboyle.ro www.epd-ee.eu ⏐ May, 2012 ⏐ EP&Dee

MISCELLANEOUS INDUSTRY NEWS

OMC offers complete package of polymer fibre cables, components and assemblies OMC can now deliver a full range of polymer fibre optic components and assemblies to ensure cost-effective, secure and interference-free data transmission. Ideally applicable in factories, machinery and other industrial applications over distances ranging from a metre to 50 metres, polymer fibre has not found the wide acceptance it might have done due to limited availability of high quality, versatile connectors and a general lack of expertise in assembling the connectors onto polymer fibre. OMC addresses both these challenges with its own extensive component range, a thorough understanding of polymer fibre and a long-established excellence in producing complete data link assemblies. The emphasis with polymer fibre has all too often been to lower the cost of a system rather than exploit the technology’s major benefits of versatility, ruggedness and reliability. To address this, OMC’s connector range includes, in addition to well-designed, lowcost plastic moulded devices, a

wide range of industry standard connector types such as SMA and ST, produced in rugged all-metal housings capable of providing reliable and consistent performance in industrial and even harsh or hazardous environments.

OMC’s optical transmitter and receiver modules are actively alignedto achieve optimal performance for any particular system, and the company can manufacture their entire transmitter and receiver range to customerspecific requirements, attaining launch powers and sensitivities within tightly-specified windows.

ALPS Offers Resistive 320° Rotary Sensor for Position Detection in Automotive Applications ALPS ELECTRIC EUROPE GmbH offers with the RD6R1A a highprecision, long-life resistive rotary sensor for position detection in automotive applications. Available with three solder terminals, the component has dimensions of 41.5mm × 16.0mm × 3.5mm (L × W × H). It features a hollow shaft structure of 3.53mm in diameter and covers a rotational angle of 320 degree. The total resistance depends on individual specifications. Its operating life is specified of up to 200,000 cycles. The position sensor is rated for a power of 0.1W. Other technical specifications of the RD6R1A

include a total resistive tolerance of ±20%, an absolute linearity of ±2.2% (320°) and a rotational torque of 0.1Nm. Its operating temperature ranges from –40°C to +85°C. The position sensor is

available in minimum packing units of 1,800 pieces. ALPS ELECTRIC www.alps.com

OMC www.omc-uk.com

New Gore Business Unit offers environmental protection for Portable Electronic Devices W. L. Gore & Associates (Gore) has stepped up its efforts to help OEM customers maintain sound quality and protect sensitive electronics in cell phones, laptop/tablet PCs, two-way radios and other handheld and portable electronic devices by creating a new business unit. GORE® Portable Electronic Vents will concentrate on providing solutions to protect devices from water, dust and dirt ingress while maintaining the integrity of sound transmission. GORE® Venting solutions for portable electronics prevent contaminants from entering, while preserving sound transmission quality through the use of high transmission materials

employing Gore’s unique ePTFE (expanded polytetraflouroethylene) technology. These are available in a variety of product forms for protection from dust and splash as well as full immersion. Pre-cut adhesive vents and unique custom vent designs are also available. Benefits include: • minimal sound transmission loss due to acoustically transparent materials; • excellent dust and liquid barriers for indoors and outdoor protection; • quick venting recovery after liquid immersion;

EP&Dee ⏐ May, 2012 ⏐ www.epd-ee.eu

Contributing editors Robert Berger Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +88643223633 charles@medianet.com.tw

• robust adhesives to withstand challenging environments and adhere to different product surfaces; • low profiles for devices with limited space; • dust, splash and immersion protection that meets a range of IP standards up to IP68. W. L. GORE & ASSOCIATES www.gore.com

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EUROSTANDARD PRESS 2000 Tel.: +40 31 805 9955 Fax: +40 31 805 9887 office@esp2000.ro www.esp2000.ro VAT Registration: RO3998003 Company number: J03/1371/1993

EP&Dee (Electronics Products & Design Eastern Europe) is published 8 times per year in 2012 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format. Copyright 2012 by Euro Standard Press 2000 s.r.l. All rights reserved.