EP&Dee DESIGN & MANUFACTURING
electronics
products
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design
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eastern
europe
OctOber, 2015 - issue nO. 8, vOl. 13
THE EAST EUROPEAN RESOURCE FOR EMBEDDED APPLICATIONS
OCTOBER 2015 Table of Contents
DESIGN FEATURES 10 Silicon provides expanded options for the system clock When faced with the decision of what to use for the clock source in an electronic design, the traditional assumption has been that the only realistic choice for any application that needs even moderate accuracy is a quartz-based oscillator.
14 New MIPS64-based Loongson processors break performance barrier If you’ve been following me on Twitter, you might have noticed a few recent posts focusing on past and present MIPS64 CPUs that have set new records in high performance and power efficiency. Today I’d like to highlight a new MIPS64-based, high-performance architecture and two corresponding processors coming out of China courtesy of Loongson Technology. The company organized a swanky launch event where its chief architect introduced a 64-bit processor architecture called GS464E, and Loongson-3A2000 and 3B2000, two quad-core processors based on GS464E.
16 Raising Touch Sensing To The Next Level Since the emergence of touch-screens, user-interface technology has experienced continued and rapid evolution, in order to meet ever-rising consumer expectations. Projected capacitive touch sensing - detecting without contact - now enables multitouch and gesture recognition in most smart phones and tablets, creating a level of expectation amongst users of other devices.
18 Automotive cyber-security: striving for better solutions You might ask yourself what cyber-security has to do with cars. Think again. The two most emblematic examples to illustrate the need for in-vehicle security are real-life use cases known by many: engine tuning and odometer fraud.
22 MEMS Sensors: The Next Level of Integration It all began in the automotive industry. Around 20 years ago the first MEMS sensors were used in airbags, ABS and ESP systems. The use in smartphones and gaming consoles have since ensured that the miniaturization, energy efficiency and cost of these sensors has continued. Today, this development has reached a new level, providing completely new and interesting features for many applications.
27 New Grid-EYE infrared array sensor Evaluation Kit from Panasonic set to launch this autumn enables fast prototyping of IoT applications 28 BPS 300i with large range of bus interfaces With the addition of the Profibus and SSI interfaces, Leuze electronic further expands its new BPS 300i bar code positioning system in the area of connectivity.
28 Cost-effective safeguarding with Safetinex Type 2 from Contrinex During semi-automated heat staking of assemblies for domestic white goods, manufacturers use light curtains to preserve operator safety without compromising production throughput.
31 Precise Measurement & Control of Cooling Water Distribution System 31 GMW Appliance Tester TG omni 1 36 3D Print
PRODUCT NEWS 5
Embedded Systems (p 4, 5, 6, 7, 8, 9) Active Components (p 27 - 34) 4
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Group Publishing Director Gabriel Neagu Managing Director Ionela Ganea Accounting Ioana Paraschiv Advertisement Irina Ganea WEB Eugen Vărzaru © 2015 by Euro Standard Press 2000
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EP&Dee | October, 2015 | www.epd-ee.eu
Contributing editors Radu Andrei Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang tel: +886-4-3223633 charles@medianet.com.tw
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EP&Dee (electronics products & design - eastern europe) is published 10 times per year in 2015 by euro standard press 2000 s.r.l. it is a free to qualified electronics engineers and managers involved in engineering decisions. starting on 2010, this magazine is published only in digital format. copyright 2015 by euro standard press 2000 s.r.l. all rights reserved.
INDUSTRY NEWS Altera Partners with Intrinsic-ID to Develop World’s Most Secure High-end FPGA Altera Corporation and Intrinsic-ID, a leading provider of Physically Unclonable Function (“PUF”) technology, announced their collaboration on the integration of advanced security solutions into Altera’s Stratix® 10 FPGAs and SoCs. PUF-based key storage is a new requirement for many defense and infrastructure applications today to secure and bind software to hardware functions and prevent the cloning of systems. The integration of Intrinsic-ID’s PUF technology within Stratix 10 FPGAs and SoCs greatly enhance the security capabilities of the devices, addressing the growing need for security for all components used in systems.
Today’s FPGAs and SoC FPGAs are sophisticated, multi-function components that demand the latest advancements in hardware security as a defense against greater adversarial challenges. Intrinsic-ID’s PUF security solution adds strong anti-tamper protection to Stratix 10 FPGA-based systems by binding proprietary and sensitive design information to the unique physics of each individual device. Binding hardware functions and software to a PUF provides a very strong device authentication method and protection against cloning. The inclusion of PUF technology and the use of a Secure Device Manager (SDM) for security management, make Stratix 10 FPGAs and SoCs an ideal solution for use in military, cloud security and IoT infrastructure, where multi-layered security and partitioned IP protection are paramount. INTRINSIC-ID ALTERA
www.intrinsic-id.com www.altera.com
EMBEDDED SYSTEMS congatec integrates the new 14 nm Intel Pentium and Celeron processors on COM Express Mini Enhanced computing and graphics performance for credit card sized computer modules. congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, extends its portfolio of credit card-sized computer modules by integrating the new 14 nm Intel Pentium and Celeron processors (codenamed Braswell) on COM Express Mini modules. The new conga-MA4 module further enhances the computing and graphics performance of their predecessors and offers a new class of performance density. Despite the increase in performance, heat dissipation has been lowered to a SDP (Scenario Design Power) of 4 Watts, enabling very compact, passively cooled system designs. Comprehensive Microsoft Windows 10 support makes the new COM Express Mini modules ideal for system designs with state-of-the-art operating systems. The modules also make it easy to connect two 4k screens thanks to the powerful new Intel Gen 8 graphics with up to 16 execution units. The high level of computing and graphics performance is complemented by a full set of COM Express Type 10-compliant interfaces. This makes the new COM Express Mini modules the ideal choice for graphics-intense low-power applications requiring a small footprint. Typical applications can be found in high-performance banking, vending and POS terminals. Additional uses could include medical imaging, compact diagnostic workstations as well as IoTconnected industrial controls and in extremely compact and robust box PCs and thin clients. Users of the new computer modules benefit from the high level of standardization and scalability of the COM Express modules combined with congatec's extensive documentation, industry-grade driver implementations and customary personal integration support, which further simplifies the design-in effort. congatec supports its products with long-term availability of at least seven years including software support for security updates of UEFI and BSPs. The feature set in detail The conga-MA4 COM Express Mini Type 10 modules are equipped with 14 nm Intel Pentium and Celeron processors with a 4 Watt SDP (Scenario Design Power) or 6 Watt TDP (Thermal Design Power), as well as up to 8 GB of fast dual channel DDR3L 1600 RAM. The integrated Intel Gen 8 graphics enable applications with high quality visuals at resolutions of up to 4k with the latest 3D features i.e. DirectX 11.1 and OpenGL 4.2 on two screens. The video engine provides judder-free decoding of H.265/HEVC compressed videos while offering maximum CPU offload and real time encoding of two 1080p H.264 video streams at 60Hz. Innovative, interactive applications with facial recognition and/or gesture control can also be supported through the optional feature connector, which allows direct connection of two CSI2 cameras. The new congatec computer modules support COM Express Type 10 pin-out with 3x PCI Express Gen 2.0 Lanes, 1x Gigabit Ethernet, 2x SATA 3.0, 2x USB 3.0, 8x USB 2.0, 2x UART along with I²C, SPI, LPC and HD Audio. congatec's operating system support covers Linux distributions and Microsoft Windows variants - including Microsoft Windows 10. An extensive range of accessories that simplify design-in, such as heatsinks, carrier boards and starter kits as well as SMART battery management modules, round off congatec's offering. CONGATEC AG
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www.congatec.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
IAR Systems invests in the Internet of Things by launching IAR Connect The portal IAR Connect meets the need for globalized, customized and simplified embedded development in a world with a growing number of connected applications.
IAR Systems® is proud to announce IAR Connect™, a portal that presents product development platforms, as well as a meeting point connecting people interested in the Internet of Things and other emerging technologies in the connected world. The Internet of Things and the connected world are already changing people’s lives and future possibilities are limitless. Virtually all industries have devices or products that can be further utilized through improved communication and connectivity. To meet the demands of the connected world, new product innovations must be brought to market fast and easy. More and more development teams are without geographical boundaries and should have high-quality solutions and the support they need brought right to them. The solutions should support current needs, as well as future requirements. IAR Connect represents this next-generation embedded development that is globalized, customized and simplified. One of the first members of IAR Connect is Renesas Electronics. Renesas and IAR Systems have a long-standing partnership and IAR Systems’ highperformance development tools are part of the Renesas Synergy Platform. Customers using Renesas Synergy will be able to start product development at a much higher level of abstraction and be able to focus completely on designing innovative and differentiated features for embedded applications and connected devices. “During our more than 30 years in the industry, we have collected a deep knowledge about embedded development as well as a unique understanding of different customer needs,” says Stefan Skarin, CEO, IAR Systems. “The best way to take advantage of the possibilities of the new connected world is by providing new technology offerings, sharing knowledge and establishing strategic alliances, such as our strong partnership with Renesas. With IAR Connect, we enable innovation by connecting people and technologies. I invite everyone to connect, get inspired and explore the potential of the Internet of Things and the connected world at iarconnect.com.” Discover IAR Connect at www.iarconnect.com. IAR SYSTEMS
Win a Microchip Motor Control Starter Kit with mTouch Sensing Demonstration Board!!
The MPLAB® Starter Kit for PIC24F (DM240015) Intelligent Integrated Analog is a comprehensive development kit featuring the PIC24F “GC” family of 16-bit microcontrollers. This family features advanced integrated analog which reduces BOM cost, lowers noise, and has faster throughput. The board demonstrates these features of the PIC24 FJ128GC010 Microcontroller: direct LCD drive, 16-bit Sigma-Delta ADC, 12-bit Pipeline ADC, 10-bit DAC, OpAmps, CTMU, DMA, USB, and XLP low power consumption. EP&Dee is offering its readers the chance to win a Microchip Motor Control Starter Kit with mTouch Sensing Demonstration Board. The Motor Control Starter Kit with mTouch Sensing is a complete hardware and software tool suite for evaluating Microchip’s ultra-low cost Motor Control Family dsPIC DSCs. It contains a single board with a BLDC motor, capacitive-touch sliders and a built-in debugger. The 2” × 5” demo board Motor Control Starter Kit with mTouch Sensing has a compact design and includes features such as: a very low cost 16-bit Motor Control DSC (dsPIC33FJ16MC102), on-board In-Circuit programming / debug via USB, an on board 3-phase BLDC motor, 15v, 2.6A On Board Drive Circuit with pads for user supplied motor, Capacitive Touch Slider for Speed Control with LED indicators and it is powered via 9V power supply.
For the chance to win a Motor Control Starter Kit with mTouch Sensing Demonstration Board, log onto: www.microchip-comps.com/epdee-motor-control-touch and enter your details in the entry form.
www.iar.com www.epd-ee.eu | October, 2015 | EP&Dee
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INDUSTRY NEWS
EMBEDDED SYSTEMS
Silicon Labs Reduces Cost and Complexity of Voice-Enabled ZigBee Remote Controls Silicon Labs released the industry’s most cost-effective solution for voice-enabled ZigBee® remote controls. This comprehensive reference design solution significantly reduces the need for costly external hardware by implementing a high-quality, software-based audio codec into a single-chip wireless SoC. The new software codec is a key part of Silicon Labs’ form-factor reference design for voiceenabled, ZigBee-based and proprietary remote controls, bringing the power of voice to TVs, set-top boxes (STBs), over-the-top (OTT) boxes and connected home products.
As many “things” for the IoT grow smarter and more connected, it becomes increasingly difficult to incorporate feature-rich user interfaces into small form-factors. Voice enablement is transforming how we control and interface with connected devices by providing an easier, hands-free way to search, explore and experience content and services. By combining the power of voice-over-RF technology and cloud-based speech recognition, voice-enabled remotes free consumers from the line-of-sight, push-button limitations of legacy infrared (IR)-based controls. Silicon Labs’ new voice codec technology and complete reference design simplify the process of designing truly smart remotes. Silicon Labs’ new ZigBee Remote Control (ZRC) reference design provides all of the hardware and software needed to develop fullfeatured, voice-enabled remote controls. The reference design is based on Silicon Labs’ EM34x wireless SoCs and ZRC 2.0 Golden Unit-certified software stack, which provides an industry-standard way to implement interoperable, low-power RF remote controls. The reference design includes complete RF layout and design files, an acceleration sensor for backlight control, a buzzer for “find me” capabilities, support for IR control, a digital microphone and the ability to transmit voice commands over RF. Silicon Labs engineered the reference design to support voice control using either an external hardware codec or the company’s software codec technology. The hardware codec reduces the processing load on the EM34x SoC while the software codec trades off increased CPU utilization for the lowest possible bill of materials (BOM) cost. Both design options meet the stringent voice quality requirements of leading cloud-based speech recognition software providers. SILICON LABS 6
www.silabs.com/zigbee-remote-control
EP&Dee | October, 2015 | www.epd-ee.eu
Dialog Semiconductor and Bosch Sensortec Collaborate on Low Power Smart Sensor Wireless Platform for IoT Devices Dialog Semiconductor plc announces a collaboration with Bosch Sensortec to create an extremely low power smart sensor platform that combines Bosch Sensortec’s sensors with Dialog’s Bluetooth Smart technology. The product resulting from the collaboration is the world’s lowest power 12-DOF smart sensor reference platform for gesture recognition in wearable computing devices and immersive gaming, including augmented reality, and 3D indoor mapping and navigation. The platform combines Dialog’s DA14580 (http://www.dialogsemiconductor.com/products/connectivity/bluetooth-smart/smartbond-da14580) Bluetooth Smart System-on-Chip (SoC) with three low power sensors from Bosch Sensortec: the BMM150 for 3-axis geo-magnetic field measurement, the BME280 pressure, humidity and temperature sensor, and the 6-axis BMI160 (a combination of a 3-axis accelerometer and 3-axis gyroscope in one chip). The resulting unit, built onto a 14 × 14 mm2 printed circuit board, consumes less than 500µA from a 3V coin cell when updating and transferring all 12 × 16 bits of data wirelessly to a smartphone.
Platform technical summary The DA14580 SmartBond™ SoC, which has already been adopted by numerous leading manufacturers of wearables, integrates a Bluetooth Smart radio with an ARM® Cortex™-M0 application processor and intelligent power management. It more than doubles the battery life of an application-enabled smartphone accessory, wearable device or computer peripheral in comparison with competing solutions. The DA14580 includes a variety of analogue and digital interfaces and features less than 15 mW power consumption in active mode and 600 nA standby current. It is half the size of rivals, measuring 2.5 × 2.5 × 0.5 mm. Bosch Sensortec’s BMI160 6-axis Inertial Measurement Unit (IMU) integrates a 16 bit, 3-axis, low-g accelerometer and an ultra-low power 3-axis gyroscope within a single package. When the accelerometer and gyroscope are in full operation mode, the typical current consumption is 950µA, only half of that of its nearest rivals. DIALOG SEMICONDUCTOR
www.dialog-semiconductor.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
Parker inverters help fuel energy storage to support EV rapid charging development project A major project to create a modular energy storage system that reduces the barriers to installing electric vehicle rapid chargers is making use of inverter technology supplied by Parker, the global leader in motion and control technologies. The project is spearheaded by Future Transport Systems and its subsidiary Connected Energy, a market leader in energy storage technologies and, along with Parker, involves a European automotive OEM giant, Renault, and Ricardo, a global strategic, technical and environmental consultancy. Clearly, rapid charging is one of the main factors able to stimulate the increased uptake of electric vehicles. However, as recharging rates increase and clusters of systems are installed to meet growing demand, the development constraint is fast becoming the local electricity supply network. As a consequence, Connected Energy and its partners, including Parker, set about creating the E-STOR range of energy storage systems.
Epitomising a highly successful project partnership, these modular, selfcontained, expandable and portable devices are designed to address the issues associated with the need to upgrade site electricity networks when installing plug-in vehicle rapid charging infrastructure. As a remotely managed solution, E-STOR offers a potentially quicker, lower cost and more flexible alternative to network infrastructure upgrades, along with a range of additional commercial and integration benefits. Utilising proven Li-ion, 2nd life automotive battery technology, high efficiency power conversion and state-of-the-art monitoring systems, Connected Energy’s E-STOR 50 and E-STOR 100 models are the first products in the new range. Supplied typically as a 50kW/50kWh nominal rated module, the integral management system optimises energy storage in relation to complementary assets and parameters – in real time. Furthermore, the system provides detailed technical and operational reporting, along with remote site management, monitoring and control. It can also be configured as part of a wider portfolio of assets and integrated with existing building management systems.
Microchip Enables Cost-Efficient CI+ Based Pay TV in Automotive Infotainment Networks Via Broad MOST® Technology Device Portfolio MOST Cooperation Standardization Organization Releases Specification for CI+ Content Protection Transmission Over MOST Automotive Multimedia Networks.
Microchip Technology Inc. announced that system designers using the de-facto industry standard, MOST® technology, in their automotive infotainment networks can now leverage Microchip’s broad product portfolio of MOST networking products to quickly bring cost-efficient CI+-based Pay TV to their cars. The MOST Cooperation recently released its latest MOST Stream Transmission Specification, which includes support for the MOST CI+ Interim License Agreement issued by CI Plus LLP. CI+ is a technical specification that provides additional security and features to the proven DVB Common Interface Standard, and now allows a MOST network to transport CI+ protected content using Digital Transmission Content Protection (DTCP). According to CI Plus, CI+ compatible consumer electronic devices, such as integrated digital televisions and set-top boxes, can access a wide range of Pay TV Services via plug-in CI+ Modules, wherever the CI+ technology is supported by the local Pay TV provider. “We are proud to offer our customers a complete, easy-to-use, cost-efficient solution to transport the latest CI+ protected digital video inside automobiles,” said Dan Termer, vice president of Microchip’s Automotive Information Systems Division. “Once again, this demonstrates Microchip’s close collaboration with our customers and commitment to listening to their needs.”
The system comprises modular batteries and integral battery management systems, bi-directional battery charger, isolation transformer, power control module, AC/DC protection, HMI, router and communication interface. It is delivered pre-assembled directly to site and requires a minimum of preparation.
On the leading edge of the latest innovations in automotive infotainment, Microchip currently offers MOST Intelligent Network Interface Controllers (INICs) that support high-quality video streaming, as defined by the latest MOST Stream Transmission Specification. In addition, the approved content protection schemes for DTCP implemented in Microchip’s MOST Multimedia Companion ICs allow the transport of CI+ protected content. Microchip’s free DTCP software stack completes the one-stop solution for transmitting the latest digital video content inside the car.
PARKER HANNIFIN FTS
MICROCHIP TECHNOLOGY www.microchip.com/Homepage-101315a
www.parker.com www.futuretransportsystems.co.uk
www.epd-ee.eu | October, 2015 | EP&Dee
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INDUSTRY NEWS
Renesas Electronics Introduces RZ/G Series HMI Solution for MultipleImage Processing and 3-D Graphics Tasks Renesas Electronics announced the availability of the RZ/G microprocessor (MPU) Series, which enables rapid development of high-performance Linux and Android applications. Designed for industrial, home appliances, and office equipment employing a human machine interface (HMI), the RZ/G series extends the capabilities of the successful RZ/A Series MPUs – which supports 2D graphics at up to WXGA resolution - to deliver high-end performance in applications such as image processing, video sensing, and 3-D graphics and multimedia at up to 1080p resolution.
Key features of the new RZ/G Series: 1) High performance for enhanced UI expressiveness and video sensing The new RZ/G series of MPUs utilizes Renesas’ proprietary Full HD video codec (processing up to 1080@60) in addition to the PowerVR™ SGX540 (RZ/G1E) or Power VR™ SGX544MP2 (RZ/G1M) 3-D graphics core from Imagination Technologies Limited. These intellectual property (IP) blocks make it possible to develop highly effective user interfaces (UI) on products ranging from hand-held medical devices to digital signage by incorporate elements such as simple still images, 3-D graphics, plus video content. This functionality improves UI expressiveness and adds value to new products. 2) Hierarchy of support and services provided in collaboration with partners The RZ/G Series is backed by an ecosystem of Renesas partners that provides system integration services, graphical user interface (GUI) frameworks, middleware, OS support, board design, as well as sales of evaluation and mass-production boards. RENESAS ELECTRONICS EUROPE www.renesas.eu 8
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EMBEDDED SYSTEMS congatec introduces new Thin Mini-ITX motherboards with Intel® Pentium® and Celeron® processors congatec AG, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, is extending its industrial-grade Thin Mini-ITX motherboard portfolio to include graphics-rich conga-IA4 boards with 14 nm Intel® Pentium® and Celeron® processors (codenamed Braswell) and full Windows 10 support. Compared to their predecessors, the new Thin Mini-ITX boards offer increased computing and graphics performance as well as support for up to three 4k displays. Despite the distinct performance gain, the power requirement has been lowered to 3 watt SDP (Scenario Design Power), which enables energy-saving, fanless system designs. With their construction height of just 20 mm, the Thin MiniITX motherboards allow for flat system designs and can even be integrated into slim Panel PCs. The new industrial-grade Thin Mini-ITX motherboards are designed for deployment in applications where conventional motherboards do not suffice in terms of robustness, interference resistance, 24/7 operation as well as long-term availability. Target applications of the boards include, among others, cash register systems, scales and vending machines, gaming and digital signage applications as well as industrial HMIs, Panel PCs and thin clients in manufacturing, logistics and clinical environments. congatec's Thin Mini-ITX motherboards are differentiated from similar industrial-grade offerings by the added value of extensive documentation as well as congatec's integration support. Continuous software support with regular security upgrades for UEFI and software drivers round out congatec's services. The feature set in detail The conga-IA4 Thin Mini-ITX boards come equipped with 14 nm Intel® Pentium® or Celeron® processors with a 3 to 4 watt SDP (Scenario Design Power) and a 4 to 6 watt TDP (Thermal Design Power) as well as up to 16 GB of fast Dual Channel DDR3L 1600 RAM. The integrated Intel Gen 8 Graphics means that applications benefit from high image quality with up to 3x 4k resolutions (3840 × 2160) with the latest 3D features such as DirectX11.1 and OpenGL 4.2. The integrated video engine provides judder free decoding of H.265/HEVC-compressed videos with maximum CPU offload and encoding for two 1080p H.264 video streams with 60 Hz in real time. The extensive range of interfaces includes, alongside a PCIe x1, two Mini PCIe slots as well as 4x USB 3.0 and 2x USB 2.0 for specific extensions. Up to two CSI-2 camera sensors can be connected directly via the feature connector. In addition, 2x Gigabit Ethernet, 1x mSATA 3.0, 1x SATA 3.0, 2x UART plus 8 GPIO and HD Audio are also provided. congatec offers operating system support for Linux and all popular Microsoft Windows variants, including Microsoft Windows 10. A wide range of design-in-simplifying accessories, such as cooling solutions, I/O shields and cable sets round out the offering. Further information on the new conga-IA4 Mini-ITX boards is available at: http://www.congatec.com/en/products/mini-itx/conga-ia4.htm CONGATEC AG
www.congatec.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
FTDI Chip Unveils New Hardware to Support its High Performance Microcontroller Offering FTDI Chip has introduced a series of easy-to-utilize modules to facilitate the evaluation, development and subsequent implementation of its 32bit FT90X Super-Bridge MCUs. This will mean that engineers in the embedded space are better positioned to benefit from the industryleading performance levels and extensive connectivity that these highly advanced ICs are able to deliver.
Optimized for use in home security, industrial control, home/building automation systems, data logging and embedded multimedia applications, the MM900EVxA series of FT90X-centered modules is made up of 4 different units. The MM900EV2A and MM900EV3A incorporate 1.3M pixel camera modules, capable of capturing images from VGA (up to 30fps) to SXGA (up to 15fps) resolution in front-facing and rear-facing configurations respectively. Each module also has a built-in audio codec with microphone input pins, a 3.5mm stereo headphone jack, a stereo speaker output header, DC power socket, 2 RGB LEDs, reset switch and a real time clock with coin cell battery support. An RJ45 connector allows 10/100Mbps Ethernet data transfer and extra memory capacity can be made available via the Micro SD card socket. The standard USB-A port (which provides the USB hosting) is complemented by a Micro-B USB port (which serves as a USB device port and a power source connection). A 40-way expansion connector enables access to the IC’s complete complement of IO, while a Micro-MaTch 2×5 female socket facilitates the debugging/downloading process. An additional 2 × 8-pin 2.54mm pitch connector and 16-pin 0.5mm pitch FFC/FPC connector permit interfacing with FT800/FT810 EVE display modules. Presenting engineers with more streamlined versions of the MM900EVxA platform are the MM900EV1A and MM900EV-LITE. The MM900EV1A offers the exactly the same functionality as the MM900EV2A and MM900EV3A, excluding the camera unit and is aimed primarily bridging functions. The MM900EV-LITE is optimized for HMI and embedded display applications. It dispenses with the need for Ethernet connectivity, audio codec and the USB Host, but instead has a supplementary IO connector (so that these functions can be added on if required). FTDI CHIP
www.ftdichip.com
Qt framework delivers smart in-vehicle infotainment interface in record time The Qt development framework, developed together by The Qt Company and the open source Qt Project, has enabled, in just nine weeks, the creation of a complete human-machine interface (HMI) for a smart invehicle infotainment (IVI) system. Built for Intel, the system was designed to demonstrate the ease with which highly graphical and interactive interfaces can be incorporated into the next generation of motor vehicles. To implement a demonstrator that shows how IVI systems can offer the same user experience in vehicles as on their personal computing and communications devices, Intel turned to Boston, Massachusetts-based Integrated Computer Solutions (ICS), the largest Qt consulting firm in North America.
ICS provides companies worldwide with powerful visual user experience (UX) design and agile software product development services, using the advanced Qt framework because of its flexibility and ability to move quickly from concept to production with a minimum of re-engineering. To support the rapid development of the IVI system over the tight nine-week schedule, ICS adopted an agile-development methodology and performed a series of five ‘sprints’ to build successively more complete prototypes. Daily ‘stand up’ meetings were held that included an Intel representative to guide progress of the project. ICS took advantage of the Qt architecture in which business logic is separated from presentation, allowing the two to be tuned independently. Qt deploys a number of technologies to underpin the creation of fluid, highly interactive user interfaces, including the declarative QML environment. ICS www.ics.com QT COMPANY http://qt.io www.epd-ee.eu | October, 2015 | EP&Dee
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DESIGN
SYSTEM CLOCK
Silicon provides expanded options for the system clock When faced with the decision of what to use for the clock source in an electronic design, the traditional assumption has been that the only realistic choice for any application that needs even moderate accuracy is a quartz-based oscillator. Author: Craig Bakke, Product Manager at Digi-Key
Quartz has dominated the market for decades but its limitations are opening up opportunities for new technologies. Quartz oscillators rely on the material’s piezoelectric properties. The crystal distorts when a electrical pulse is applied to it. Conversely, its distortion leads to the generation of an electrical signal. These two aspects of the piezoelectric effect are used in oscillators to induce resonance such that the crystals oscillate within a narrow range of frequencies. The key to controlling the frequency and range of frequencies lies in size and shape of the crystal. The higher the desired frequency, the smaller the crystal, but as the crystals are made smaller they become more fragile and harder to make reliably. Maintaining tight frequency control involves the use of a number of external components and often leads to precise rules over how the devices are placed on a board and how close they can be to other parts of the system. To provide a stable clock signal, the oscillator circuitry needs to be protected from onboard interference. High-frequency data buses can inject switching noise into the oscillator feedback loop, disturbing the relatively weak signal produced by the quartz crystal. In general, the simplest way to protect the oscillator is to keep most signal traces and components outside an ‘exclusion zone’ of several square centimetres on the PCB. One issue that quartz clocks face is frequency shifting caused by the high temperatures encountered during soldering. Crystal-based products exposed to solder reflow, during which temperature excursions may reach more than 200°C for tens of seconds, can experience frequency shifts of up to ±5ppm. Quartz devices are also vulnerable to shock and vibration because of the way in which 10
EP&Dee | October, 2015 | www.epd-ee.eu
the crystal needs to be held within the package. As a result, the trend for miniaturisation in electronics as well as demand for more rugged devices is building demand for other options.
shapes, including discs and multibeam structures, have been used to create the vibrating element, which is generally set into motion using electrostatic interactions. The mass of this resonator is extremely small –
Silicon semiconductor technology has moved into the position where it can provide an effective alternative. Microelectromechanical machine (MEMS) technology provides one way to harness semiconductor-grade silicon for clock generation, with an increasing number of products arriving on the market based on this approach. The core component of the MEMS clock generator is a mechanical resonator etched from a silicon wafer, tuned to vibrate at a target frequency. Masses of various sizes and
often on the order of one ten-billionth of a gram. The small mass can be used to generate high frequencies that often require cuts to quartz crystals that are difficult and expensive to make. The MEMS resonator can be constructed using a variety of silicon-based materials, such as single-crystal silicon, polysilicon or polysilicon-germanium (poly-SiGe). The resonators are susceptible to the adsorption of moisture. A single layer of water can push the operating frequency down by hundreds
DESIGN
of parts per million as the mass of the resonator increases. To prevent adsorption, MEMS timing devices need to be sealed against the environment. Their resonating frequencies will also drift significantly with temperature – the materials become softer as temperatures rise leading to a temperature coefficient of up to −40 ppm/°C. However, MEMS products are typically less vulnerable to temperature shifts caused by reflow soldering. For example, Maxim Integrated’s MEMS-based real-time clock products experience a shift of less than ±1ppm following reflow, five times lower than equivalent quartz products. Being much smaller, MEMS products exhibit much greater immunity to shock and vibration than quartz-based components. To deal with the problem of temperaturerelated frequency shifts, the output of the MEMS resonator is typically compensated electronically. This can be done in a similar manner to the techniques used for temperature-compensated crystal oscillators (TCXOs). One digital technique is to provide an electronic reference oscillator, based on a transimpedance amplifier, that is fed to a fractional-N synthesiser and phaselocked loop. The output of the reference oscillator is measured during calibration at room temperature and compared to the target frequency. The output is then measured at another temperature and these results stored in local memory. As temperature shift is normally monotonic, only a few points are needed to provide voltage offsets that are used to drive the frequency synthesiser or PLL to provide the
SYSTEM CLOCK
required frequency output. To improve the performance of MEMS resonators, aspects of quartz and MEMS have been brought together, using piezoelectric effects rather than mechanical resonance. IDT, for example, manufactures piezoelectric MEMS-based oscillators. In these devices, the
offer sub-picosecond jitter with products operating at up to 20MHz. To support use in high-frequency communications, networking and computing designs – which need sources in the 150MHz to 200MHz range – IDT took advantage of its ability to copackage the tiny MEMS res-
cantilevered beam is coated with a thin piezoelectric film made from materials such as aluminium nitride or zinc oxide. The combination of structures leads to strong electromechanical coupling, providing low resistance motion and high quality factors, or resonance. Vendors claim the structure leads to high long-term frequency stability and low jitter. For example, the IDT pMEMS products
onators with signal-conditioning circuitry to provided its pMEMS products with lowvoltage differential signalling (LVDS) and low-voltage positive emitter-coupled logic (LVPECL) outputs. As well as providing an alternative to quartz, MEMS technology is also creating new opportunities for the piezoelectric material.
www.epd-ee.eu | October, 2015 | EP&Dee
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SYSTEM CLOCK
To provide greater control over frequency, Epson-Toyocom started to use micromachining techniques on quartz and developed the QMEMS range of devices to create new shapes such as the inverted-mesa – a sunken structure with steep walls and a flat bottom within a larger quartz crystal that is placed closed to the excitation electrodes. This shape allows operation at higher frequencies as it reduces the thickness of the oscillating por-
of MEMS structures on a silicon CMOS wafer, using poly-SiGe as the MEMS structural material. It can be deposited at temperatures comparable to those used to produce the metal wiring on conventional CMOS ICs. That means the processes used to deposit the poly-SiGe will not melt the existing CMOS and backend materials if directly deposited on top of a mainstream CMOS wafer. The etching agents, which are used to cut away
parts per million. Improvements to PLL technology applied to quartz and MEMS products has been used to tighten up the specification of electronic resonators, making them now usable in a much wider range of designs. Because the parts are entirely electronic and their output controlled using data stored in a lookup table, they can be programmed in the factory to provide any required frequency within their output range.
tion of the crystal to just a few micrometres. The larger surrounding area is left as a support to maintain overall mechanical strength. The use of a thinner oscillating section also reduces the sensitivity of the device to frequency dips and thermal changes. One promise of MEMS is to facilitate high integration. In principle, the resonator structure can be integrated onto the same die as the compensation and other signal-conditioning circuitry. In practice, cost and yield considerations mean that many of the MEMS products on the market are two-die solutions. Silicon Laboratories has been able to combine MEMS and commercial CMOS with its Si50x series of products. Silicon Labs’ CMEMS is a technology that enables the post-processing
material from underneath the resonator so that it can vibrate are friendlier than the hydrofluoric acid and other etchants commonly often used in dedicated MEMS processes. To stabilise the frequency output, the Si50x CMEMS oscillators employ the DSPLL technology used in Silicon Labs’ crystal-based oscillator family for a total stability of as little as ±20ppm over ten years. A further step is to move away from mechanical or piezoelectric resonators and to use an entirely electronic solution. Inductor-capacitor (LC) resonating circuits have been used as a relatively low-quality clock source for microcontrollers for some years, but their application has been limited because their jitter is on the order of tens of thousands of
Products such as Silicon Labs’ Si500, for example, can support any frequency between 900kHz and 200MHz with a total stability of ±150ppm. As they have no moving parts, the devices are practically impervious to shock and vibration effects and are unaffected by the heat generated during soldering. Thanks to developments in silicon-processing technology, the quartz clock is no longer the only option for designers seeking highperformance timing solutions. Through the use of MEMS, hybrid-MEMS or fully electronic timing control, designers now have access to a widening range of devices that can meet cost, vibration and reliability targets ￭ Digi-Key www.digikey.com
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MIPS PROCESSORS
New MIPS64-based Loongson processors break performance barrier By Alexandru Voica Imagination Technologies
If you’ve been following me on Twitter, you might have noticed a few recent posts focusing on past and present MIPS64 CPUs that have set new records in high performance and power efficiency: #MIPS R4000 was one of the first 64-bit microprocessors, had an eightstage integer pipeline and ran #WindowsNT.
A die shot of the new MIPS64-based Loongson processors.
Today I’d like to highlight a new MIPS64-based, high-performance architecture and two corresponding processors coming out of China courtesy of Loongson Technology. The company organized a swanky launch event where its chief architect introduced a 64-bit processor architecture called GS464E, and Loongson-3A2000 and 3B2000, two quad-core processors based on GS464E 14
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Building ultra-high performance MIPS64 CPUs at low power consumption Both Loongson-3A2000 and 3B2000 are 4-way superscalar processors built on a 9-stage, super-pipelined architecture with in-order execution units, two floating-point units, a memory management unit, and an innovative crossbar interconnect. Several reports from China position 3A2000 as a flagship CPU aimed at the high-performance consumer electronics market (e.g. desktop computers and laptops, 64-bit embedded and DSP applications, and network routers) while 3B 2000 will be used in a number of home-grown eight and 16-core server systems.
MIPS PROCESSORS
Thanks to a series of significant microarchitectural enhancements, performance figures for the new chips show a 2.7x improvement over the previous generation cores (Loongson-3A1000 and Loongson-3B1000, respectively).
Loongson GS464E and extending the MIPS64 architecture
Loongson-3B1500 is a new high-performance MIPS64 chip.
The new GS464E architecture counts over 1,400 instructions grouped under a set called LoongISA; these instructions include:
• MIPS64 Release 3 instructions for high-performance, general-purpose computing • LoongBT, a binary translation technology that enables developers to run x86 and ARM code • LoongVM instructions for custom virtual machines • LoongSIMD instructions for 128- and 256-bit vector arithmetic operations All Loongson CPUs run LOONGNIX, an open source distribution of Linux optimized for the GS464E architecture.
Innovation in China’s semiconductor market
A die shot of the new MIPS64-based Loongson processors. The 3B series also features Loongson-3B1500, a MIPS64-based superscalar processor clocked at 1.5GHz; platforms integrating an octa-core 3B1500 configuration can deliver up to 192 GFLOPS of peak performance at only 30W. Loongson chief architect Hu Weiwu also exclusively confirmed to Imagination that his team plans to release two now chips in 2016: 3A3000 and 3B3000. These processors will be built on a leading 28nm process node and clocked closer to 2GHz, therefore increasing the company’s competitive advantage. For now, benchmarking data released last week for Loongson3A2000 shows the MIPS64-based powerhouse CPU surpassing several competing processors in performance efficiency:
Loongson-3A2000 offers competitive performance per GHz.
Originally launched in 2010 as the result of a public–private partnership, Loongson focused initially on R&D and academic activities in the field of 64-bit computing. Presently, Loongson is gearing up to become a solid contender in the Asian embedded market. This new push was visible during the launch event where multiple partners showcased products using Loongson CPUs, including Sugon Information Industry, A Loongson-based laptop China Aerospace Science and running Linux Industry, Tsinghua Tongfang Co., Neusoft Corp. and Ruijie Networks. China is often seen as the world’s factory, making many of the devices and platforms we use on a daily basis. However, it imports well over 80% of the semiconductors it consumes for end products that are both exported out of China, and products that stay in China to be used by domestic consumers. For that reason, the Chinese government sees semiconductors as a strategic industry, with domestic players having the potential to increase their market share versus overseas vendors. Therefore, investing in semiconductor design and manufacturing has become an important national strategy for China – and Loongson is capitalizing on this new wave of investment in Chinese semiconductor companies. After ten years of accumulated R&D and market exploration in the field of CPU architecture and design, Loongson has been steadily building a strong ecosystem of customers and gearing up for its next phase of expansion. For more news and updates from MIPS, follow us on Twitter ￭ (@ImaginationTech, @MIPSguru) and come back to our blog. IMAGINATION TECHNOLOGIES www.imgtec.com www.epd-ee.eu | October, 2015 | EP&Dee
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TOUCH SENSING
Raising Touch Sensing To The Next Level
Since the emergence of touch-screens, user-interface technology has experienced continued and rapid evolution, in order to meet ever-rising consumer expectations. Projected capacitive touch sensing - detecting without contact - now enables multitouch and gesture recognition in most smart phones and tablets, creating a level of expectation amongst users of other devices. Authors: Carol Crawford, Director - Touch-Screen Controllers, Microchip Technology Inc. Charlie Riegert, Product Manager - Touch-Screen Controllers, Microchip Technology Inc.
However, smart phones have access to considerable processing power, which not all applications can afford from a hardware, software or power budget aspect. Applications such as access panels, simple keypads or thermostats, gamepads, remote controls and even wearable technology all present signifi16
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cantly different use-cases in terms of response time, resolution or cost. The flexibility to optimise a design is therefore crucial if the technology is going to transition successfully across multiple vertical markets. Power consumption, in particular, represents a significant challenge for projected capaci-
tive sensing (PCAP) in many applications. The relatively high power consumption of most PCAP solutions limits their use in low-power applications. Beyond smart phones, embedded devices can now offer battery lifetimes in terms of months or even years instead of hours. Assessing the power consumption and
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management is now an essential part of evaluating any PCAP technology, but through the combination of its eXtreme Low Power (XLP) technology and royalty-free source code, Microchip can successfully address the issue of low power PCAP. As an example, single-touch tap, swipe, swipe and hold, and double-tap gestures can be implemented using low power and inexpensive devices. For example, a small sensor running at 2V would consume just 15μA in active idle mode, when woken with a touch this rises to just 150μA when actively scanning. In a recent design example, this translated to more than 2 years battery life. Remote controls, game pads and other power-conscious devices could benefit from these advancements in PCAP technology and power management. As with all applications, there are sometimes performance trade-offs, but power, size and other characteristics can be managed to meet the low power design requirements. Flexibility is the next challenge to expanding PCAP in to new markets; the rapidly emerging market trend of incorporating touch and gesture detection in to devices beyond mobiles requires rapid innovation from developers. As a result, faster design cycles require progressive and flexible PCAP touch controllers and sensor design option. Traditional PCAP solutions have long design cycles with rigid implementations, consisting of an ASIC-style touch controller and fixed sensor design. Many suppliers of touch technology offer dedicated black box ASICstyle touch controllers that match up with specific touch sensors; they work for their dedicated application but the developer has limited design flexibility. These fixed solutions don’t allow for code modifications if, for example, a small change is needed during the development phase. This means that any changes to the sensor design could constitute a new design, requiring extensive work with the technology supplier. Such closed designs also prevent the integration of code for other functions in the same controller, such as driving or controlling LEDs to extend the functionality. Being locked in to a closed solution can introduce signifiant penalties for manufacturers who need to react quickly to market demands. Developers shouldn’t be ‘boxed in’ by hardware or software with their PCAP solution; one approach to meet the challenge of maintaining flexibility and supporting design changes is to empower designers with source
TOUCH SENSING
code access and the tools to allow them to independently customise their PCAP technology, in order to create optimised solutions. This design flexibility allows customers to manage their touch-interface solutions to enable fast and targeted modifications on they own timetable, without depending on external vendors. Microchip has taken a unique approach to addressing customer needs when it comes to selecting the right PCAP solution, by offering both flexible black-box touch controllers and royalty-free source code options that can be used across its standard portfolio of 8-, 16- and 32-bit PIC microcontrollers. This allows developers to optimise their design for features, performance and cost, while providing a migration path with many options to help keep future design paths open and system costs down.
The sensor is the third challenge in enabling other markets to adopt PCAP technology. Touch sensors in the mobile market are often proprietary design with limited access to supply chains. This restricted access presents a sourcing challenge as well as functional uncertainty for those trying make their own custom solutions. Fortunately, the recent development of various types of inexpensive projected-capacitive touch sensors that are easily available and manufacturable now enable designers to start working on these new market segments with PCAP-enabled designs.
Some examples of these sensor types include touch pads and flexible sensors. Typical touch pads are inexpensive sensors based on a PCB that can be used under a plastic overlay, similar to the look and feel of touch pads on laptops. These standard sensor designs provide the desired smooth surface feel, with tap and swipe touch response, which are applicable to many applications such as gaming pads, light switches, automotive consoles and remote controls. Other sensor options include flexible PCB sensors and printed sensors created using conductive inks. These flexible sensors offer options for designs with curbed surfaces, or backlit keypads that may need cutouts for LED lighting. Printable and transparent conductive inks can now offer an inexpensive and manufacturable touch sensor solution
for wearable electronics; a rapidly emerging and highly innovative market segment. The use of touch sensing beyond its traditional smart phone and tablet application space is driving manufacturers and developers to innovate and increasingly rapid rate. Adopting a PCAP technology that supports this rapid evolution may prove essential if the technology is to meet its full potential and successfully revolutionise modern electronic devices across all vertical markets ￭ Microchip Technology www.microchip.com www.epd-ee.eu | October, 2015 | EP&Dee
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AUTOMOTIVE
Automotive cyber-security:
striving for better solutions Author: Fabrice Poulard, Automotive Business Group, Renesas Electronics Europe
Real risks, real threats You might ask yourself what cyber-security has to do with cars. Think again. The two most emblematic examples to illustrate the need for in-vehicle security are real-life use cases known by many: engine tuning and odometer fraud. It is not so difficult to boost an engine with more horsepower. What do carmakers think about this? Beyond the revenue losses they may suffer (because the customer thinks “why buy the 200HP model if I can tune the cheaper 150HP model?”), they can also face 18
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costs for engine repairs or replacements because it was badly managed by a modified EMS. And usually they are not able to prove that. Carmakers may not care so much about odometer fraud, but would you not care when buying a second-hand car? How can you make sure this lovely affordable station wagon really has 60,000 km on the clock and not the double? In fact, you cannot. However, you may experience the difference... and finally blame the carmaker for poor quality. Would they care about this then?
What is security all about in a car? It is certainly about protecting its commercial value as a whole, not only from the carmakers’ perspective, but also for car owners and to a certain extent for system suppliers. Carmakers have an interest in protecting features from being used when they are not paid for, while ensuring that no additional warranty or maintenance costs due to illegal usage will reduce their profits even further. System suppliers have an interest in offering added-value protection systems, and they also have an interest in protecting their intellectual property.
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Owners feel more comfortable when they know their car is securely locked and protected when parked, and when their private data are kept confidential. Future owners would be happy to have a guarantee on used cars without having to pay for it. Would that be all? Well, there is more to risk than money… How can a car protect against security attacks that would jeopardize the functioning of “mission critical” systems? Connection of mobile devices (phones, multimedia readers), connection to the Internet, connection to other cars and to the road infrastructure… the car is becoming part of a bigger IT system which offers access to more services and more value, but also opens up to more threats. Recent academic works [for example, see w w w.autosec.org/pubs/carsusenixsec2011.pdf] have illustrated how the multiplication of attack vectors via external connections can potentially enable a criminal to take control of the brakes or the steering wheel. Safety is also at risk: connectivity to the car should come with the most stringent security requirements. Intrinsic vs. exploited flaws The electronic system of a car is distributed across a (growing) number of electronic control units (ECUs), each unit designed for a dedicated function (e.g. braking, steering, etc.) by means of a microprocessor, linking together with other ECUs in a partially closed in-vehicle network. Automotive ECUs are designed to interact with their environment in a rather simple processing pattern: Intrinsic ECU flaws can lead to systematic malfunctions. These flaws relate to hardware and software bugs, to component malfunc-
tion linked to their characteristics (e.g. soft errors in microprocessors) or to component malfunction when used at functional limits (e.g. temperature, frequency, voltage). Intrinsic flaws can be avoided whenever a state-of-the-art development methodology is in place. Each ECU function can then be guaranteed for a given range of environmental parameters. In addition, safety mech-
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anisms ensure that such flaws do not harm the system, either by correcting recoverable errors or by putting the system into a failsafe state. However, these mechanisms do not ensure that the messages transferring within or between ECUs are authentic. Cyber-threats relate to exploiting system flaws not covered by a methodical development approach. Hardware and software modifications, environmental manipulations outside of the range for which the system has been designed (e.g. temperature, frequency, voltage), or injection of manipulated information can lead to intentional malfunctions. These in turn can be used by criminals to change the ECU behaviour in order to serve their personal interests. Electronic hobbyists will try to find their “way in” to customize their car just for the fun of it, but they can also turn “on” features that they did not pay for originally. Labs or universities will hack into automotive systems in order to advertise their work to the public. Professionals (e.g. garages) can make money from system flaws by reselling illegal tuning mechanisms (engine tuning is the most popular). Carmakers and system suppliers can gain a lot of knowledge and technical expertise from their competitors by taking ECUs apart. Finally, criminal organizations can clone genuine ECUs into counterfeits sold on the black (or grey) market.
Secure ECUs Since the design of the first engine control unit based on a microprocessor (more than 30 years ago), carmakers and system suppliers have developed security countermeasures to cyber-threats that have spread in various ECUs. Until recently, these countermeasures were either relatively ineffective because they were based on software-only security primitives, or too expensive because they used custom microprocessors. The microprocessor is the security enabler that can effectively turn an ordinary ECU into a secure ECU. Nowadays, the semiconductor suppliers enable state-of-the-art ECU designs using security-enabled microprocessors, offering higher resistance to cyber-threats while being reasonably priced and certified for use in the automotive field. This change enhances the standard ECU processing pattern with a pre-process and a post-process stage, first to ensure that the ECU processes genuine (and potentially safety critical) information, and second to deliver the result of the processing so that it cannot be forged by any other entity within the communication network. To ensure that the computation is not compromised or altered in any way, those security-capable microprocessors can enforce the authenticity and integrity of the software and data processed within the ECU.
This type of setup implies some adaptations to the way ECUs are developed and manufactured. Security is not only considered at ECU level, it also touches on the in-vehicle network and the ECU life-cycle management. This global scheme needs a holistic approach within the automotive industry to secure the supply chains and to implement specific IT systems for key provisioning, including the development of widely accepted standard components. Threats Manipulation within the ECU Manipulation outside the ECU ECU counterfeiting Risks Revenue loss “Mission critical” ECUs unsafe Brand / reputation damage
Renesas product offering To foster the availability of secure ECUs in the long term, Renesas has developed a comprehensive security concept that integrates many of its automotive chips. The concept establishes the existence, within the processor (the host), of a secure domain aside from the application domain. www.epd-ee.eu | October, 2015 | EP&Dee
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The application domain senses, communicates and actuates. The secure domain processes the security services that maintain the system in a secure state, while off-loading these additional tasks from the host. The secure domain combines four essential components: • An intelligence that processes the security services as requested by the application domain • A set of cryptographic accelerators for high processing throughput • Dedicated interfaces within its hosts (i.e. the processor) with slave and master capabilities • An exclusive non-volatile memory area to store the secret material used by the security services Three types of secure domains are available in Renesas’ offering to scale with the type of host where it is integrated: • Cost-effective: offering the security services as defined in the HIS SHE specification • Flexible: allowing carmakers and/or system providers to implement any kind of security services required by the application domain • High performance: combining flexibility of use, high performance and specific cryptographic functions, such as media stream ciphers The Renesas Intelligent Cryptographic Unit concept (ICU) is the foundation of the costeffective (ICU S) and flexible (ICU M) secure domains in its automotive microcontroller offering with embedded Flash, based on the RH850 32-bit CPU. Both secure domains allow the implementation of a wide range of security services, such as verifying the secure boot at microcontroller start-up, encryption/decryption of incoming/outgoing data, or authenticating CAN frames within the invehicle network. While the ICU-S intelligence is a size-optimized finite state machine (FSM) implementing a fixed set of services, the ICUM integrates an RH850 CPU core that can run custom (user defined) services, either when the host triggers it (e.g. on-demand ciphering operation) or autonomously (e.g. background memory check). They both incorporate a true random seed and an AES-128 cryptographic accelerator with simple (ICU-S) and complex (ICU-M) block ciphering modes. The size of the secure embedded Flash varies depending on the service needs. The ARM®-based Flash-less system-on-chip R-CAR is no slacker when it comes to security. It integrates a high-performance security module named CryptoCell, targeting highend multimedia applications and advanced 20
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driver assistance systems (ADAS). In combination with the ARM® TrustZone® technology, it supports the operation of Trusted Applications (TA) within a Trusted Execution Environment aside from the Real-Time Execution Environment. The R-CAR’s CryptoCell integrates a digital source of randomness and a comprehensive set of cryptographic accelerators (AES supporting all key sizes, DES and 3DES, standard hash functions, public key accelerator for RSA and ECC operations). It provides fast security services demanded by the application, such as stream ciphering of multimedia content. Although the system operates without embedded non-volatile memory, a chip-dependent root-of-trust, initialized during manufacturing, enables the protection of the externally stored code and data. Renesas support to the industry All Renesas secure domains come with dedicated software stacks and examples to facilitate integration within the different application domains. In addition, engineering teams with dedicated security expertise support customers with development worldwide. Renesas is collaborating with leading software suppliers to further expand its security ecosystem. In a recent announcement, Renesas has announced the short-term availability of the Escrypt CycurHSM for its RH850 microcontroller products. Renesas contributes to the establishment of automotive security standards through its involvement and active participation in dedicated working groups, such as in AUTOSAR or in the European Car to Car Communication Consortium. And it is already extensively supporting the HIS SHE specification endorsed by many carmakers worldwide, as well as the EVITA HSM concept proposed by the EVITA project. Thanks to its strong experience within the smart card industry, Renesas offers key injection services within a trusted environment for its automotive products. It also plans the extension toward an extensive key provisioning system supporting various security schemes tailored to carmaker needs. Towards an affordable root-of-trust The security assurance delivered by the onchip addition of a secure domain aside from the application domain suffices for most automotive use cases. A very high security assurance level is only required in a few applications where the demand for privacy and authenticity exceeds by far the standards (e.g. for car to car communications). It is also required to fight against ECU counterfeiting, where the need for a secure rootof-trust is paramount.
The possibilities offered today by the industry to cover those requirements are limited to the use of security-certified microprocessor. Besides the integration hassle, the cost of such chips (including the cost of certification) and for the secure infrastructure that comes with it (supply chain, key provisioning) heavily impacts the overall ECU cost. As a new alternative, Renesas plans to roll out a disruptive security technology that creates a whole new kind of root of trust. It is secure by design, at a reduced cost, and does not require secure production sites, screened personnel or similar precautions. This innovative root of trust allows carmakers and system suppliers to combine their software with Renesas microprocessors based on chip-dependent, non-initialized and unalterable hardware functions, eliminating the risk of software manipulation and ECU counterfeiting. Conclusion More comfort, safer roads, efficient driving... in-vehicle electronic systems are delivering the promise. But the evolution of these systems, in particular towards higher over-theair (OTA) connectivity and forthcoming services such as OTA reprogramming, is generating new threats to the value of the car and to “mission critical” ECUs. Cyber-threats can take many forms. The only limit is the imagination, the skills and the motivation of the criminal. To limit the impact of a multi-million dollar attack while rendering low-cost attacks ineffective, carmakers have adapted their requirements by implementing state-of-the-art security services using security-enabled microprocessors. Moreover, instead of looking at security at the ECU level independently of other ECUs, they are starting to look at the security of the entire in-vehicle network, and of the entire ECU life-cycle management. The challenge of this approach is that it has a significant impact in terms of development efforts and cost, and it will take time until it becomes standardized throughout the entire automotive industry. Renesas is striving to support this change with tailored and costoptimized solutions: its security-enabled microprocessors fit all kinds of security services and automotive ECU types. In addition, its worldwide support structure makes the system integration easier. Finally, Renesas is preparing the ground for a security innovation that can help eradicate the risk of counterfeiting on all kind of electronic devices, including automotive ECUs ￭ Renesas Electronics Europe www.renesas.com
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www.epd-ee.eu | October, 2015 | EP&Dee
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MEMS SENSORS
MEMS Sensors
The Next Level of Integration
It all began in the automotive industry. Around 20 years ago the first MEMS sensors were used in airbags, ABS and ESP systems. The use in smartphones and gaming consoles have since ensured that the miniaturization, energy efficiency and cost of these sensors has continued. Today, this development has reached a new level, providing completely new and interesting features for many applications.
Martin Grimmer, Senior Marketing Manager Analog & Sensors, Rutronik Elektronische Bauelemente GmbH
Wearables such as smart watches, bracelets, glasses or functional clothing would be unthinkable without MEMS sensors. But they also bring increasing added value to industrial, medical and gaming applications. This is especially true for current Sensor Hubs and Application Specific Sensor Nodes (ASSNs). They offer up to 9 Degrees 22
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of Freedom (DoF), i.e. a 3-axis accelerometer, a 3-axis gyroscope, a 3-axis magnetometer plus a microcontroller all within one housing. Other external sensors, such as pressure or ambient light sensors, can achieve even higher than 10 Degrees of Freedom. This provides more accurate and robust sensor data than existing individual
sensors, even under severe conditions. Due to the various types of sensors, each with its own drift and noise characteristics, they compensate for the shortcomings of individual sensors. Other plus points: they are much smaller and more efficient than discrete solutions; the calibration of temperature as well as routine calibration by the user
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is not required; the majority of integration and development work is omitted, so that the time-to-market is shortened, therefore enabling developers to fully focus on their applications and reach the market more expediently. Top two Integrated Sensors The BMX055 from Bosch Sensortec in a 3×4.5 mm² housing and the LSM9DS0 from STMicroelectronics in a 4×4 mm² housing are digital 9 DoF sensor modules, providing the industry's highest level for integration of individual MEMS sensors. Both include a 3axis accelerometer, a 3-axis gyroscope and a 3-axis magnetometer. Due to the compact dimensions these are ideal for applications with limited space. Sensor Fusion Software In order to obtain the display values or for further processing of raw data from the sensors, Bosch Sensortec and STMicroelectronics have developed the so-called Sensor Fusion software. The latest ASSN Bosch Sensortec
MEMS SENSORS
runs, for example, on the BNO055. As the software and hardware are optimally designed in this case, the highest performance is achieved with minimum energy consumption. In addition, the software can also be used with microcontrollers from other manufacturers. For this, customers will need to sign an NDA and license agreement with respect to the Sensor Fusion Software though still at a very low cost compared to self-programmed software. Another way to reach the benefit of Sensor Fusion is with the SSC7102 from Microchip. This is a 10 DoF Sensor Fusion hub running with FusionLib software licensed from Bosch Sensortec. The following externally connected sensors are supported: the Bosch Sensortec BMC150 compass module and BMG160 gyroscope, as well as the Intersil ISL29029 ambient light sensor. The fusion software of both manufacturers supports 6 and 9 DoF modules and runs on a built-in sensor module microcontroller, as well as on an external controller. It supports
Android and Microsoft 8, and thanks to the scalability it can also be adapted for other operating systems. Compensation due to robust and easily processable values The software provides, amongst other things, the following existing parameters: linear acceleration, rotation, accurate and robust positioning and gravitational vector along with quaternions. The latter allows, in many cases, a mathematically elegant depiction of three-dimensional Euclidean space and other spaces, particularly in the context of turns, whilst being 10 times more efficient than the raw data. In addition, the Sensor Fusion software compensates for the various sensors jointly. A few examples: An accelerometer measures the overall acceleration including gravity. The exact gravitational vector can be determined only at rest, in case of overlapping dynamic accelerations.
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The software, by means of a gyroscope, separates the dynamics of static acceleration whereby the gravitational vector can be determined even during movement. Magnetometers have a very sensitive measuring range to detect the relatively weak geomagnetic field which in turn makes these very sensitive to external magnetic fields, e.g. from a speaker or a magnet. In the case of such errors, an electronic compass may not indicate the magnetic north. However, if a sensor hub is used, the software calculates the position of the device from the angular acceleration of the gyroscope and the linear acceleration of the accelerometer. Thus the compass will function by itself when the magnetometer is disturbed or rotated. The vulnerability of a gyroscope is also compensated in this manner. It always measures against a reference motion, i.e. it determines only relative, not absolute, changes. This results in long-term deviation which increases with time. An acceleration sensor detects the home position of a device with which the software can compensate for the 24
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MEMS SENSORS
long-term deviation of the gyroscope. A magnetic field sensor can also act as an absolute reference. Top three Sensor Fusion devices The highest level of Sensor Fusion consists of two products from STMicroelectronics and one from Bosch Sensortec - by far the strongest driver and market leader in the field of MEMS sensors. The Bosch Sensortec BNO055 is the first member of a new family of intelligent absolute orientation sensors with 9 Degrees of Freedom. As the first 9-axis sensor, it only contains technologies from a single manufacturer: a 3-axis 12-bit accelerometer, a 3-axis gyroscope and a 16-bit 3-axis geomagnetic sensor. The integrated 32-bit microcontroller runs on FusionLib BSX3.0 software, however there is no application available as yet. Being 5.2×3.8 mm², the System-in-Package (SiP) solution is significantly smaller than comparable discrete or system-on-board solutions. As a plug-and-play model it is designed specifically for various applications, e.g. in the field of Augmented Reality, without having access to satellite-based navigation data, for the
strikingly realistic world of gaming, health and fitness applications, indoor navigation and all applications that require ambient detection. Because of the broad spectrum of applications it will remain available though solely focused on the smartphone market model, as it is also suitable for industrial applications. The STMicroelectronics LIS331EB combines a linear 3-axis accelerometer with a Cortex-M0 core containing up to 80 MHz, 64 KB Flash, 128 KB of SRAM in a 3×3×1 mm LGA housing. It has freely selectable, graduated scales and can measure accelerations with an output data rate of up to 1.6 kHz. Thanks to ultra-low-power operational modes it is extremely energy efficient and provides smart sleep-to-wake-up functions. With the iNEMO Engine software the sensor hub functions for both internal as well as external sensors: via I2C it can retain the data of the embedded accelerometer, as well as the additional external sensors (gyroscope, magnetometer or pressure sensor) and 9 or 10-axes bundles. A 3-axis accelerometer, a 3-axis gyroscope and a Cortex-M0 core with Flash and SRAM are built into the STMicroelectronics
DESIGN
MEMS SENSORS
LSM6DB0. This has two operating modes: either both sensors are activated or the acceleration sensor is activated while the gyroscope is switched off. As with the LIS331EB, the LSM6DB0 can also combine measurements using the iNEMO Engine software from the built-in and external sensors to 9 or 10 DoF. The two ST models have fewer integrated sensors than the BNO055 Bosch Sensortec, but they offer the advantage that the microcontroller also uses the actual application software. It is sufficient to omit an external microcontroller for applications. This is not possible with the Bosch Sensortec sensor, wherein the microcontroller is used solely with the Sensor Fusion and as an interface.
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DESIGN
Thanks to the integration of sensor and microcontroller saved in a small 3×3×1 mm³ housing space, the ST sensor modules allow other sensor types to be used and connected to the external controller.
MEMS SENSORS
For all three models: multiple sensors provide, in combination with the Sensor Fusion software, more accurate and more robust values that are aligned to the respective application - without custom software
development. Matching hardware and software ensure a minimum level of development and integration effort along with optimal performance. This gives maximum freedom for the actual application and a shorter time-to-market. Focus on sensors Rutronik, as both a market and technology leader in electronic components distribution, already demonstrates the importance of sensors within its portfolio. To the wide portfolio of semiconductor manufacturers such as Bosch Sensortec, Infineon, Micronas, Osram, STMicroelectronics and Vishay, Rutronik's broad line has added sensor, passive and electromechanical manufacturers such as Murata and Omron. So Rutronik can show that it has by far the largest portfolio of sensors. Five experts who have been working for years exclusively with sensors support this selection of customers. As do experts in the signal processing of related products ￭ Rutronik www.rutronik.com
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EP&Dee | October, 2015 | www.epd-ee.eu
PRODUCT NEWS
AUTOMATION
New Grid-EYE infrared array sensor Evaluation Kit from Panasonic set to launch this autumn enables fast prototyping of IoT applications Integrated “nanopower” Bluetooth Smart module, software and microcontroller enable easy development of new wireless sensor applications within days Panasonic Automotive & Industrial Systems is launching a Grid-EYE Infrared (IR) Array sensor Evaluation Kit this autumn that combines its ”nanopower” PAN1740 Bluetooth Smart module and a microcontroller on one PCB. By combining its new IR sensor technology with Bluetooth technology and software for IR detection of people and objects on one board, Panasonic enables customers to develop rapid prototypes and quickly build their own wireless sensor “Internet of Things” applications. Alexander Hoch, Team Leader Circuit Components, Panasonic Device Solutions Business Division comments: “With the launch of Grid-EYE evaluation kit we make our stateof-the-art Grid-EYE sensor along with an innovative IR people detection software (including basic API and image processing) available for the first time to the end customer. We have developed a PC software and a smartphone app to be provided to the customers to test our sensor in different ways with various applications. This paves the way for designers to use the advantages of Grid-EYE in combination with Bluetooth Technology and we are expecting to see some very innovative wireless IoT applications being developed by our customer base, thanks to the speed and simplicity offered by our new evaluation kit.” Grid-EYE is an infrared array sensor and the first ever 64 pixel IR camera in an all-in-one compact SMD package. Based on Panasonic’s MEMS (Micro Electro Mechanical Systems)
Grid EYE Board
doors, elevators, kiosks), and the medical industry (e.g. patient fall detection and patient positioning). Further examples include hot-spot detection, human detection inside vehicles for consumer comfort and contactless temperature measurement in industrial applications. GridEYE is also able to detect people and effectively differentiate them from other heat sources such as displays or heaters. Moreover as GridEYE is an infrared sensor, detection of people is measured almost independent of ambient light conditions. Another significant advantage of Grid-EYE sensor is that its use does not intrude on personal privacy, unlike cameras.
Grid EYE infrared array sensor
technology, Grid-EYE combines the MEMS sensor chip, a digital ASIC (I2C interface) and a silicon lens. It has 64 thermopile elements in an 8×8 grid format that detect absolute surface temperature without any contact. Unlike conventional sensors, Grid-EYE uses a patented 60° silicon lens etched out of a silicon wafer, which is (with less than 0.3mm height) the smallest available lens in the market. The combination of these modern and sophisticated technologies from Panasonic enables to reduce the sensor package size to only 11.6mm × 8mm × 4.3mm, which is around 70% smaller in size than competitor products. Compared to pyroelectric sensors, it is not only possible to detect moving people and objects but also the position and presence of motionless people and objects, the direction of movements and the accurate surface temperature from -20°C up to +100°C. With this wide range of temperature measurement Panasonic is able to reach a NETD (Noise equivalent temperature difference) of ±0.5°C at room temperature. With these features, the Grid-EYE sensor opens the door to a huge variety of new applications, ranging from energy savings in the lighting industry, domestic appliances (e.g. air conditioners, microwave ovens), safety and security systems (e.g. lifts, automatic
PAN1740 Bluetooth module The integrated Bluetooth module in the evaluation kit, PAN1740 (P/N ENW89846A1KF) is a single-mode Bluetooth Smart system-onchip module optimized for low power (only 4.9mA in transmit or receive) and small size (only 9.0mm × 9.5mm × 1.8mm). The SMD component benefits from a fully shielded case, chip antenna, and integrated crystal oscillators. The low 4.9mA power consumption allows the use of coin cell batteries and decreases battery requirements by up to 50% when compared to other BLE devices ￭ currently on the market. PAISEU http://eu.industrial.panasonic.com www.epd-ee.eu | October, 2015 | EP&Dee
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PRODUCT NEWS
SENSORS
BPS 300i with large range of bus interfaces With the addition of the Profibus and SSI interfaces, Leuze electronic further expands its new BPS 300i bar code positioning system in the area of connectivity. BPS 300i systems have been equipped with an integrated Profinet interface since their first delivery; they now feature interfaces for Profibus and SSI as well. RS232 and RS485 interfaces are expected in November 2014.
The integrated bus interfaces enable full device configuration directly via the control. This saves time during installation and money by avoiding the otherwise needed connector units. In industry, Profibus DP and Profinet are
used for fast communication between all types of controls and sensors/actuators. The Synchronous Serial Interface (SSI) is an interface for, e.g., position measuring systems, that delivers absolute information about position via serial data transmission. The modularity of the BPS 300i systems allows the device to be equipped with various connection technologies, integrated LED display and integrated heating for applications to -35°C. The Availability Control function monitors and reports the performance reserve of the total system.
The second generation of these established devices is now available in the new Leuze electronic product design. All technology and application experiences from the past ten years have been incorporated in the new BPS 300i product series. With bar code positioning systems, a reader, which is moved along a bar code tape, determines the precise position of the moved part. It is thereby possible to generate absolute values with millimeter precision in microseconds – meaning that up to 1000 measurement values are processed per second. The working range of the new BPS 300i systems is unmatched at 50 to 170 mm. They are, thus, extremely tolerant of mechanical fluctuations that can arise in typical applications in intralogistics and in the automotive industry, for example in high-bay storage devices, telpher lines, gantry cranes or pushing platforms. Even at high traverse rates of up to 10 m/s, the reproducible accuracy is ±0.15 mm.
Background information Leuze electronic invented the BPS bar code positioning system more than 10 years ago.
O’BOYLE www.oboyle.ro
AUTOMATION
Cost-effective safeguarding with Safetinex Type 2 from Contrinex During semi-automated heat staking of assemblies for domestic white goods, manufacturers use light curtains to preserve operator safety without compromising production throughput. The active optoelectronic protective device (AOPD), mounted directly in front of each bench-mounted heat-press, prevents the press-head from descending if it detects any intrusion in the working area, halting the operating cycle immediately.
Customer value • Cost-effective, active safeguarding • Improved workplace ergonomics 28
EP&Dee | October, 2015 | www.epd-ee.eu
• Increased productivity arising from unimpeded loading and unloading • Industry-standard interface requires minimal modification to control systems
Advantages of Type 2 light curtain YBB-30S/R2-0800-G012 • Permanent autocontrol not usually found on Type 2 safety devices • IP65 and IP67 protection • Non-contact operating principles • Excellent safety rating to EN/ISO 13849-1 Cat. 2 PL c and IEC 61508 SIL 1 • AOPD (active optoelectronic protective device) with aluminum housing and M12 cable connector
• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro
PRODUCT NEWS
Leuze n n n
SENSORS
ASM
Optical sensors Sensors for logistic applications Safety at work
n n n
GMW
Linear Sensors Angle Sensors Tilt Sensors
n n n n
Contrinex n n
Selec
Optical Sensors Inductive Sensors
n n n
Digital panel meters Panel indicators Bus bar isolators Current transformers
Industrial connectors
PLCs Temperature Controller Timer
n n n n
Circular connectors M8; M12; M23 Cable and Connectors for Sensors Valve Connectors Distribution Blocks
Special Approvals
Sensor Instruments n n n
Kobold
Color Sensors True Color Sensors, Spectrometers Gloss Sensors
n n n
Flowmeters Level Indicators and Switches Pressure Sensors and Switches
n
IP69K Tel. +40256201346 office@oboyle.ro www.oboyle.ro
AUTOMATION
New Kobold Vortex Flow Meters in compact Wafer Design The proven in-line Vortex Flow Meter series DVH will be completed by the new "wafer-style" version. The wafer series will be offered for nominal pipe sizes from DN15 / (1/2") up to DN 100 / (4") for DIN, ANSI and JIS flange connections. Independent of the nominal size the mounting length will be 65 mm and will be applicable for pressure rating of PN40 / CL 300 in standard.
The technical features of the inline version have been adopted. • fully welded sensor • maintenance free - no sealing • very compact 65 mm mounting length • temperature and pressure sensor can be integrated • up to 3 analog output signals
plus frequency and status output available • -200 - +400°C temperature range • energy management software available
O’BOYLE www.oboyle.ro
www.epd-ee.eu | October, 2015 | EP&Dee
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PRODUCT NEWS
RELAYS
Kobold Oval Wheel Flow Meters - Flow Measurement of High Viscous Resins Production processes in manufacturing of abrasives and superabrasives require precise dosage of even high viscous resins (e.g. 1500 cP). The adjacent application picture shows one dosing skid in such application. Each skid comprises of the following components: 1) Main tank 2) Secondary tank with low level alarm, always ensuring enough products and no air in the circuit 3) Manual valve to close the circuit 4) Peristaltic pump 5) Oval Wheel Flowmeter 6) Pressure Switch (safety against high pressure) 7) 3-way valve (for manual or automated operation) 8) Outlet pipes for manual product collection At higher viscosities and depending on temperature fluctuations, the peristaltic pump (positive displacement pump comprising of flexible tube and of roller(s) displacing the medium from one end of the flexible tube to the other) is not able to displace the medium completely. This means that some part of the medium flows back through the flowmeter resulting in error readings. In addition, the operating pressure developed by the small sized peristaltic pump is quite low. Solution: Oval wheel flowmeters model DON can be provided with special cut rotors reducing the pressure drop by 50%. Choosing the optional Quad Hall Sensor Dual Pulse Output provides two out of phase pulse outputs "A” and "B”, so that net flow rate "A-B” may be computed correctly by the PLC. Net flow rate could also be computed using ZOK-Z3 electronic with a pulse discriminator in between. With these features, we are in a position to solve all problems associated with this application and conduct very fine dosing of resins, resulting in an improved repeatability and quality of the finished abrasives.
O’BOYLE www.oboyle.ro
AUTOMATION
Fuel Consumption in Diesel Engines Kobold Oval Wheel Flow Meters Model DON may be used for fuel consumption measurement in diesel engines using the dual flow inputs and the 'A-B' setting. A pair of DON flowmeters is used with a single electronic model ZOK-Z3 to give a net reading of fuel consumption. In this off-shore application, a fuel consumption measurement system has been effectively implemented on diesel engines in small ships/ vessels. Here we used a pair of stainless steel flowmeters (DON-S15... for flows upto 550 l/h per flowmeter) and one ZOK-Z3 per engine. As choking of the flowmeter or strainer in main line may result in higher differential pressure and result in diminishing fuel to the engine, an alternative is to use a pressure relief valve in the bypass line. Higher inlet pressure opens the pressure relief valve and ensures a constant supply to the diesel engine. In selective cases, the choice of “pulsating flow” option may be recommendable. With this installation, the fishermen are now in a position to monitor the actual real time fuel consumption and adapt the ship speed to optimise it. In general, the return of investment is implemented within a month. Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro 30
EP&Dee | October, 2015 | www.epd-ee.eu
PRODUCT NEWS
SENSORS
GMW Appliance Tester TG omni 1 Precise measurement modules for testing safety measures in accordance with Measurement & -WithDINcombinable VDE 0701-0702: DGUV Regulation 3 (BGV A3)Testing in transportable electrical Control of Cooling equipment’s - IEC/EN 60974-4 / DIN VDE 0544-4: Testing arc welders Water Distribution - IEC/EN 62353 / DIN VDE 0751-1: Testing medical devices and systems System In the cooling applications of Radio Frequency and Semiconductor Components, special water based coolants circulate from a chiller to different lines. These coolants are expensive so they require to be monitored with precise measurement and control for round the clock operation. • • • •
The circulated coolant changes its properties (pH and conductivity) during the continuous operation so is required to be treated in the main treatment plant in order that pH and TDS can be maintained, enabling the costly cooling water to be re-circulated. The challenge was to effectively distribute the coolant from the main chiller at 16 bar pressure to a combination of supply and return lines at required flow rates. In order to achieve the goal of precise control, the system would be designed and fabricated in stainless steel grade 316, with local and remote indicating process instruments for temperature, pressure and flow. All the process instruments had to be installed on individual branches with remote transmission output for precise control by SCADA at a remote location. Minimum pressure drop, space restriction and complexity of zero leakage in the system were other constrains.
Automatic Detection of the test object with predefined test parameters from the barcode / QR code on the tablet camera Management of test objects and customers within the app and thus locally Test Report as PDF file incl. Photo documentation when required, on the tablet camera Sending the Test Reports by e-mail, output to WLAN / Bluetooth printer
Magnetic angle sensor for automated applications ASM introduces with PRAS26 an extension of its POSIROT® series of angle sensors for automated applications. The generation of the absolute signal over the full 360 degrees of rotation is via a special magnet coupling the rotation to the sensor. The flat housing which offers protection class to IP67 is only 9.5 mm high and is therefore suitable for space-saving installations in compact automated machines and systems. Completely encapsulated electronics withstand high shocks, vibration and moisture penetration. A constant wear-free operation is ensured by use of an external magnet. In addition, the housing is made of heat-resistant materials which are a mixture of thermoplastic and epoxy glass fiber giving strength and stability. The sensor is supplied with a range of analogue outputs 0.5...4.5 V, 0.5...10V or 4...20mA. With a favorable price-performance ratio and the low profile of the PRAS26 series it is best suited for a variety of OEM applications such as automated heating systems. Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro www.epd-ee.eu | October, 2015 | EP&Dee
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PRODUCT NEWS
AUTOMATION
Sensor Instruments: Detection of fluorescent oil on flat washers The presence of oil on different flat washers should be controlled. It has to be taken into account, that the oil is fluorescent, if UV light is used. For this purpose a color sensor type SPECTRO-3-FIOUV in connection with an external UV – lightning unit type ELS-UV-1P and an optical fiber type R-S-R2.1(6x1)-1200-Y-22°/67°-UV with an optical frontend KL-8 will be used. At this, the distance of the frontend to the flat washers is around 15mm and the spot size at this distance is approximately 6mm × 1mm. The oil can be proper detected as shown in the screen shots.
Sensor Instruments: Presence control of a laser engraving on a glass bottle
The presence as well as the intensity of a laser engraving on glass bottles should be controlled. For this purpose a color sensor type SPECTRO-3-FIO-SLE in connection with an optical fiber type R-S-R2.1-(6x1)-1200-67° and an optical frontend type KL-M34-XL-R2.1 will be used. At this, the distance from the optical frontend to the surface of the bottle neck is approximately 85mm and the angle of the frontend to the horizontal axis around 40°. The presence as well as the intensity of the laser engraving can be proper detected as shown in the screen shots.
Sensor Instruments: Color differentiation of metal loudspeaker grids Two kinds of metal loudspeaker grids should be color differentiated. For this purpose a color sensor type SPECTRO-3-DIL-SLE will be used. The distance of the color sensor to the metal grid is approximately 30mm. The loudspeaker grids can be proper differentiated by the color sensor.
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EP&Dee | October, 2015 | www.epd-ee.eu
PRODUCT NEWS
ACTIVE COMPONENTS
Intersil’s Breakthrough Time-of-Flight IC Revolutionizes Object Detection and Distance Measurement Intersil Corporation introduced an innovative time-of-flight (ToF) signal processing IC that provides a complete object detection and distance measurement solution when combined with an external emitter (LED or laser) and photodiode. The ISL29501 ToF device offers one-of-a-kind functionality, including ultra-small size, lowpower consumption and superior performance ideal for connected devices that make up the Internet of Things (IoT), as well as consumer mobile devices and the emerging commercial drone market.
The ISL29501 overcomes the shortcomings of traditional amplitude-based proximity sensors and other ToF solutions that perform poorly in lighting conditions above 2,000 lux, or cannot provide distance information unless the object is perpendicular to the sensor. Alternative solutions are too expensive, bulky or power hungry for use in small form factor, battery-powered applications. Based on Intersil’s patented technology, the ISL29501 sensor provides a small solution footprint and precision long-range accuracy up to two meters in both dark and bright ambient light conditions. Unlike competitive solutions, the ISL29501 allows customers to select the emitter and photodiode of their choice and configure a low power ToF sensing system customized for their application. To make system design easy for customers, Intersil offers a reference design featuring the ISL29501, emitter and photodiode, along with graphical user interface (GUI) software and user’s guide. The ISL29501 applies Intersil’s power management expertise to save power and extend battery life through several innovations. The onchip emitter DAC with programmable current up to 255mA allows system designers to select the desired current level for driving the external infrared (IR) LED or laser. This feature enables optimization of distance measurement, object detection and power budget. The device’s single shot mode saves power by allowing designers to define the sampling period for initial object detection and approximate distance, while continuous mode more accurately measures distance. The ISL29501 also performs system calibration to accommodate performance variations of the external components across temperature and ambient light conditions. The ISL29501 can be combined with the ISL9120 www.intersil.com/products/isl9120 buckboost regulator to further reduce power consumption and extend battery life in consumer and home automation applications. INTERSIL
www.intersil.com
Murata Adds 1600 Watt DC Input Model to D1U3CS Series for Network and Storage Applications Murata announced the latest addition to the D1U3CS Series of front-end, high efficiency, 1U packaged power supplies from Murata Power Solutions. The new 1000VRMS isolated DCinput model to the D1U3CS Series can deliver a full 1600 Watt, 12 VDC output with a conversion efficiency as high as 93% at half load. The D1U3CS Series has a power density of 29 Watts per cubic inch. A 3.3Vdc, 20 Watt standby output is also provided. The DC-input D1U3CS Series is hot pluggable, and incorporates low-loss integral ORing Field Effect Transistors (FETs) on its main 12V output for fault-tolerant, redundant, and N+1 applications. With active single-wire current shar-
ing, up to 8 supplies can be easily paralleled for very high current applications. This model has no minimum load requirement. Digitally programmable, the unit is equipped with an I2C interface and supports the industrystandard PMBus™ communications protocol. The supplies
incorporate fan cooling with automatic speed control and have an ambient operating temperature range of 0 to +50°C. MURATA www.murata.com
High efficiency 350 W AC/DC supply suits IT, industrial and healthcare applications Intersil Corporation announced the ISL94203 3-to-8 cell battery pack monitor that supports lithium-ion (Li-ion) and other battery chemistries used in medical mobility carts, wheelchairs, ebikes, handheld power tools, vacuum cleaners and solar or renewable energy storage systems. Available now through Intersil’s worldwide distribution partners, the device accurately monitors, protects and cell balances rechargeable battery packs to maximize battery life and ensure safe charging and system operation. OEMs are moving away from NiCd and lead-acid batteries to embrace the more environmentally friendly Li-ion battery chemistries. Li-ion batteries are smaller, weigh less, and deliver longer battery life, but require monitoring and protection for
safe use. The ISL94203 functions as a stand-alone battery management system for rechargeable Liion battery packs. Its internal state machine has five pre-programmed stages that accurately control each cell of a battery
pack to extend operating life. The ISL94203 integrates highside charge/discharge FET drive circuitry, which allows customers to securely ground reference the battery pack to their designs. XP POWER www.xppower.com
www.epd-ee.eu | October, 2015 | EP&Dee
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PRODUCT NEWS Renesas Electronics’ ADAS Surround View Kit Accelerates Development of Surround View Applications Renesas Electronics announced the ADAS Surround View Kit. Given the increasing complexity of ADAS (Advanced Driver Assistance System) systems, Renesas is committed to providing easy-to-use solutions that enable quick time to market for automotive system manufacturers. On July 16, Renesas introduced its ADAS Starter Kit, designed to be used in a wide spectrum of applications. The new ADAS Surround View Kit, an extension of the ADAS Starter kit, simplifies and accelerates the development of surround view applications when combined with the ADAS Starter Kit in particular.
Surround view applications are expected to play a major role in future cars, providing additional comfort and new safety features. The ADAS Surround View Kit combines automotive cameras from Integrated Micro-electronics Inc. and multiple high-speed gigabit multimedia serial links (GMSL) from Maxim Integrated Products, Inc. on a miniature automotive chassis. This eliminates the need for system manufacturers to source and set up all these specific automotive components themselves for their surround view development. The kit also provides a 2-channel CAN interface and a gigabit Ethernet connector interface for in-car applications, where the model chassis is not used. Once connected via an on-board extension connector to the already available ADAS Starter Kit, the ADAS Surround View Kit provides outstanding processing performance to system manufacturers. It is based on the cutting-edge performance of Renesas’ R-Car H2 SoC (System-on-Chip), which is capable of delivering more than 25,000 DMIPS and providing state-of-the-art 3D graphics capabilities and powerful vision processing cores. The R-Car H2 SoC supports up to four independent input HD camera channels, allowing easy implementation of 360° camera views and object recognition. The new kit is supported by the Yocto distribution that is also used for other R-Car evaluation boards. RENESAS ELECTRONICS EUROPE www.renesas.eu 34
EP&Dee | October, 2015 | www.epd-ee.eu
ACTIVE COMPONENTS u-blox takes over manufacture and supply of Cohda Wireless pioneer V2X module u-blox announced a further cooperation with Cohda Wireless, a global leader in connected vehicle technology and the world’s number one equipment vendor in the Cooperative Intelligent Transport Systems (C-ITS) market. To meet rapidly increasing demand for V2X modules for trials, early deployments and infrastructure roll-out, Cohda Wireless and u-blox have agreed on an exclusive license for the use of the latest MK5 module design, leveraging u-blox strengths in quality manufacture and global supply of automotive components for positioning and communications. Vehicle-to-vehicle (V2V) and vehicleto-infrastructure (V2I) wireless technologies, also known as Vehicle-toeverything (V2X), are paving the way to the transportation of the future, and ultimately autonomous driving. By allowing communication between vehicles and their surroundings, V2X improves road safety, reduces traffic congestion and energy consumption,
while enhancing passenger experience and safety. Coupled with more conventional Advanced Driver Assistance Systems (ADAS) technologies, such as radar sensors and cameras, V2X enables a 360° situational awareness with information such as the position,
speed and direction of surrounding vehicles. THEO-P1 is a compact, automotive-grade transceiver module facilitating development of electronics for V2X communication systems. Already with a strong market penetration, it addresses both equipment within vehicles (OBU-On Board Units) and road infrastructure (RSU-Road Side Units). U-BLOX www.u-blox.com
ON Semiconductor expands PYTHON CMOS image sensor family with high resolution options ON Semiconductor, driving energy efficient innovations, has added four new high resolution devices to its award winning PYTHON family of CMOS image sensors. Now totalling nine separate devices that provide resolutions ranging from VGA to over 25 megapixels (MP), this high performance family addresses the needs of general purpose industrial imaging applications such as machine vision, inspection and motion monitoring, security, surveillance, and intelligent transportation systems (ITS). The new PYTHON 10K, PYTHON 12K, PYTHON 16K, and PYTHON 25K image sensors combine excellent imaging performance with high speed output architectures that meet and exceed the bandwidths available from popular industry computer interfaces such as USB 3.1, CameraLink, CoaXPress, and 10GigE. The new devices share a common high performance 4.5 µm pixel that leverages ON Semiconductor’s patented in-pixel CDS (ipCDS) technology to enable global shutter imaging with Correlated Double Sampling (CDS) in a compact pixel size. Image data is accessed
through 32, 16, 8, or 4 LVDS channels, each running at 720 MHz, to enable readout speeds of up to 80 fps for the 25K device. The devices are packaged in a µPGA-355 package and are available in monochrome, Bayer colour, and extended near-infrared (NIR) configurations. They join the previously released PYTHON 300, PYTHON 500, PYTHON 1300, PYTHON 2000, and PYTHON 5000 devices to form an integrated family that allows camera manufacturers to rapidly roll out products with multiple resolutions, from VGA to over 25MP, with greatly minimised development effort.
ON SEMICONDUCTOR
www.onsemi.com
INDUSTRY PRODUCT NEWS
3D Print What is offering 3D Print? Are you an engineer, inventor, designer, enthusiast or a person who is interested from new technology? The 3D Print is a technology who can permits you to create solid three-dimensional objects, giving you the potential to put your ideas into practice. To generated a model into a real form or a solid form with 3D printers you need a computer. The potential applications for 3D printing cross a huge range of domains like medical, architectural, engineering, designs to product prototyping and scientific research.
Design with 3D Print At Aurocon COMPEC, the unique distributor for RS Components in Romania, you can find engineers who can help you to decide what 3D Printer is best for you. Also, you can find information on DesignSpark Mechanical engaging you with a powerful 3D modelling software tool, helping you design more easily, quickly and creatively ideas, or you can access the http://ro.rsdelivers.com. 36
EP&Dee | October, 2015 | www.epd-ee.eu
INDUSTRY PRODUCT NEWS
Products that may be of interest to you Beeverycreative Beethefirst FDM 3D Printer Product Details Compact and portable desktop 3D printer Build Speed 100mm/s Build Volume 190 mm × 135 mm × 125mm Connectivity USB Exterior structure Metal / Acrylic Dimensions L × W × H 400 mm × 400 mm × 140mm Filament Diameter 1.75mm Minimum Layer Height 0.05mm Model BEETHEFIRST Multi Material Printing No Number of Heads 1 Plug Type Type C - European Plug, Type G - British 3-Pin Technology FDM Weight 9.5kg Minimum system requirements • Windows (7/8), Linux (12.04 +) • Core i3 | AMD Phenom II | AMD Athlon X2 • Mac OS X: 10.8/10.9+ (Mac hardware: late-2008+) Hardware (a PC with these minimum requirements): • Free disk space: 500MB • System RAM: 2 GB • Graphics card (GPU): 512 MB dedicated
RS Stock No. 836-0694 Mfr. Part No. 5600881930264
3D Systems 2nd Gen Cube FDM 3D Printer Product Details Build Speed Build Volume Connectivity Dimensions L × W × H Filament Diameter Minimum Layer Height Model Multi Material Printing Number of Heads Plug Type Technology Weight
15mm/s 140 mm × 140 mm × 140 mm USB 254 mm × 286 mm × 330 mm 1.75mm 0.1mm 2nd Gen Cube No 1 Type C - European Plug, Type G - British 3-Pin FDM 4.3kg
Minimum system requirements • Windows: Runs on 32 and 64-bit Operating Systems: Windows XP Professional or Home Edition with Service Pack 3 and Windows 7 • Mac OSX: Runs on Mac OSX 10.8 Hardware (a PC with these minimum requirements): • Processor: Multi-core processor - 2GHz or faster per core • System RAM: 2 GB • Screen Resolution: 1024×768
RS Stock No. 799-0411 Mfr. Part No. 381000 www.epd-ee.eu | October, 2015 | EP&Dee
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INDUSTRY PRODUCT NEWS
RepRapPro Ormerod 2 Full 3D Printer Kit Product Details Build Speed Build Volume Connectivity Dimensions L × W × H Filament Diameter Minimum Layer Height Model Multi Material Printing Number of Heads Plug Type
Technology Weight
28mm/s 200 mm × 200 mm × 200 mm SD Card, USB 500 mm × 460 mm × 410 mm 1.75mm 0.1mm Ormerod 2 Yes 1 Type A - USA 2-Pin, Type C - European Plug, Type G - British 3-Pin, Type I - Australian 3-Pin FDM 7kg
Minimum system requirements • Windows XP or higher (Windows 7 and 8 are fine) • Mac OS X, 10.6.8 • Ubuntu 12.04 or higher
RS Stock No. 811-1855 Mfr. Part No. Ormerod 528
Ultimaker 2 FDM 3D Printer Product Details Build Speed Build Volume Connectivity Dimensions L × W × H Filament Diameter Minimum Layer Height Model Multi Material Printing Number of Heads Plug Type Technology Weight
30mm/s 120 mm × 120 mm × 115 mm SD Card, USB 258 mm × 250 mm × 287.5 mm 2.85mm 0.02mm Ultimaker 2 Go Yes 1 Type C - European Plug, Type G - British 3-Pin FDM 6.2kg
Minimum system requirements • Windows XP or newer • Mac 10.6 (snow leopard) or newer • Unix Ubuntu 12.10 or newer Hardware (a PC with these minimum requirements): • Processor: Pentium 4 • System RAM: 512 MB • Free disk space: 200MB RS Stock No. 832-5379 Mfr. Part No. Ultimaker 2 Go 38
EP&Dee | October, 2015 | www.epd-ee.eu
INDUSTRY PRODUCT NEWS
Makerbot Replicator Mini FDM 3D Printer Product Details Build Speed Build Volume Connectivity Dimensions L × W × H Filament Diameter Minimum Layer Height Model Multi Material Printing Number of Heads Plug Type Technology Weight
30mm/s 100 mm × 100 mm × 125 mm USB, Wireless 295 mm × 310 mm × 381 mm 1.75mm 0.2mm Replicator Mini No 1 Type G - British 3-Pin FDM 8kg
Minimum system requirements • MAC OS X (10.7+); Apple MacOS X 10.7 or later • Windows 7 or later • LINUX (UBUNTU 12.04+, FEDORA 19+) Hardware (a PC with these minimum requirements): • Screen Resolution: 320 × 240
RS Stock No. 835-4140 Mfr. Part No. MP05925
RS IdeaWerk FDM 3D Printer Product Details Build Speed Build Volume Connectivity Dimensions L × W × H Filament Diameter Minimum Layer Height Model Multi Material Printing Number of Heads Plug Type
Technology Weight
30mm/s 150 mm × 150 mm × 140 mm SD Card, USB 211 mm × 403 mm × 298 mm 1.75mm 0.1mm IdeaWerk No 1 Type C - European Plug, Type G - British 3-Pin, Type I - Australian 3-Pin FDM 7.5kg
Minimum system requirements • Windows XP (32bit); Vista (32bit); • Windows 7 (32bit and 64bit); • Windows 8; Windows 8.1
RS Stock No. 828-6356 Mfr. Part No. 381000
Do not hesitate to ask for any additional information by email: compec@compec.ro, phone: 0213 046 233, fax: 0213 046 234 or access ro.rsdelivers.com. We offer you continuous improved services that can help you with your production facilities. An important part of our services refers to delivery. Now the lead time has become lower thus the delivery faster as in you can have now the products you need in 24 hours delivered directly to your door. No order is too small or less important for us! Author: Mihaela Sârbu Aurocon Compec www.epd-ee.eu | October, 2015 | EP&Dee
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