Laboratory bench for verification
Test board
The final frontier of space exploration Integrated circuits need to withstand a harsh radiative environment if they are to function effectively in space. We spoke to Mr Daniel González about the work of the SEPHY project in designing and developing a new Ethernet transceiver device, work which will enhance European competitiveness in what is a fast-moving area. The harsh environment
of space places heavy demands on equipment, so equipment and components designed for use beyond the Earth’s atmosphere need to be correspondingly robust and reliable. Effective high-speed networking technologies are increasingly essential to modern space systems and the EU is keen to enhance the competitiveness of European companies in this area, a large part of the motivation behind the work of the SEPHY project. “The main goal of the initial funding call was to support the development of integrated circuits for space applications, enabling European countries to compete with components made in the US,” outlines Mr Daniel González, the coordinator of the project. The primary goal of the project is to develop an Ethernet transceiver device, enabling the wider adoption of Ethernet in space applications, including fully synchronous Time-Triggered Ethernet communication, which was developed by Austrian company TTTech, a key partner in the SEPHY consortium.
Protocol stack A large proportion of the key elements of the overall protocol stack for both regular (‘eventdriven’) and scheduled (‘Time-Triggered’) Ethernet has been developed, with only the
86
physical layer remaining, the part which enables the transmission and reception of packets of information through a cable. This is what Mr González and his colleagues from both the academic and commercial sectors are designing in the project, taking into account the challenges of the space environment. “In order to be used in space, integrated circuits need to be designed in such a way that they can withstand the radiation that they will
robust and reliable. This approach makes them more suitable for use in space. “This is related to radiation hardening by process,” outlines Mr González. The other method is radiation hardening by design, which means that special features or counter-measures are added in the design process, so that the chip will ultimately be able to withstand the radiation levels found in space; both these methods are being used in the SEPHY project.
In order to be used in space, integrated circuits need to be designed in such a way that they can withstand the radiation that they will be exposed to. be exposed to,” he says. There are two main ways in which a chip can be prepared, or hardened, for use in space; the first is called radiation hardening by process. “This means that the process by which the chip is built has some features that make it well-suited to fabricating integrated circuits for space applications. By process, that means all of the fabrication steps required to fabricate a given integrated circuit,” says Mr González. These integrated circuits are built on silicon wafers, the manufacturing of which can be adapted in such a way that they are more
“The process that we are using to fabricate this ASIC (Application-Specific Integrated Circuit) is offered by Microchip Technology Nantes. It’s a SOI (Silicon Over an Insulator) process, which gives full protection against a space radiation effect called Single Event Latchup (SEL), which can cause serious damage,” continues Mr González. “This SOI protects our circuit against SEL, one of the destructive events that can affect a circuit in space.” There are also several other radiation effects to consider, one of which is Total
EU Research