US8 / XSON8U BOARD ADAPTER 1. Package US8 dimensions US8 p (pitch) 0,50 mm HE 2,9 – 3,1 mm E 2,9 – 3,1 mm D 1,9 – 2,1 mm b (pad width) 0,15 – 0,35 mm
2. Other packages that have the same pad layout: SOT765; XSON8U VSSOP8 is also compatible if have a 0,5mm pitch Links: http://ics.nxp.com/support/documents/logic/pdf/an10161.pdf
3. Our PCB board DIL compatible Pitch Spacing: Distance between connectors Board Material: Hole Diameter: Board Height: Board Width: Board Thickness: Copper Coating : Copper Thickness: No. of Copper Sides: Solder mask ROHS
2.54mm 7,61 mm FR4 Epoxy Fibreglass 0,95 mm 11mm 11mm 1.5mm chem. Niquel Gold 35µm 2 yes Conform
CAD drawing with top and bottom layers Note: bottom copper layer have a pad for easy ground connection
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