Electronic Products and Technology October 2013 by Annex Business Media

electronic products and technology -

MEDICAL ELECTRONICS

electronic products and technology

OCTOBER 2013

AN EP&T SPECIAL REPORT PAGE 22

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e d i t o r i a l electronic products andtechnology technology electronic products and Volume 35 Number 7

October 2013

Stephen Law Editor 416.510.5208 slaw@ept.ca

Sohail Kamal

West Coast Correspondent

Joanna Malivoire

Peter Loney

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Future of BlackBerry, Waterloo biz climate still in the air More than a month has passed and still no official word yet on the final sale of Canada’s largest and most influential electronics OEM – BlackBerry. But things appear to be close, (at least at EP&T’s presstime). Newspaper reports showed that Fairfax Financial Holdings Ltd. was seeking more than $1-billion from other investors to help fund a takeover of BlackBerry, but the Toronto-based investment firm may still have a long way to go before it gains the support it needs. That tentative bid could become more attractive as BlackBerry continues to lose value on stock markets. The man behind the drive to save BlackBerry is Fairfax leader Prem Watsa, who has gone on the offensive to win over the skeptics. Watsa, often referred to as Canada’s answer to Warren Buffett, aims to keep it in Canada, while returning it to a private company. By doing so, it serves as an opportunity for BlackBerry to focus on the business strategy without the scrutiny of the public markets. A sale would offer a break from the spotlight that shines on the company’s every move, but would also allow BlackBerry to return to where it began. “BlackBerry is one of Canada’s great success stories,” Watsa said. “There is no question it’s fallen on hard times recently, but we have every confidence it will be successful again. We’re putting a consortium together to make sure that that takes place.” It’s also important to recognize BlackBerry’s (nee RIM) historical

significance in what’s now a healthy and vibrant tech community in the Waterloo Region. BlackBerry’s plan to cut about 40% of its global workforce, about 4,500 jobs, is also underway. The good news is, while Waterloo is best known as the home of the smartphone maker, the KW region’s job market is well diversified. Employment in the region is spread-out across many industries, with manufacturing, trade, healthcare, professional and technical services, financial services, education, and construction all playing important roles. In fact, Canada is becoming the perfect North American launch location for a new technology business, according to recent trends. Dozens of new tech companies have launched in, or moved to Canada, primarily Vancouver and Toronto/Waterloo, and begun growth trajectories. Canada’s different culture and proximity to the U.S. make it better suited for a company launch or expansion. Our culture is more laid back and inclusive, with a mindset tuned to team building rather than the competitive ferocity and demand for hyper-growth commonly found in New York or Silicon Valley. In the meantime, we wait to see if Mr. Watsa can pull the appropriate strings to preserve the dignity of this industry’s crown jewel. Stephen Law, Editor slaw@ept.ca Follow me on Twitter http://twitter.com/#!/EPTmagazine

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NEWSWATCH N E W S WATCH NEWSWATCH electronic products and technology • october 2013

Bittele sees double-digit growth

Energy monitoring firm sets up office in Ottawa

Bittele Electronics Inc., a leading electronics manufacturing service (EMS) provider achieved double-digit, year-over-year revenue growth in 2012. These exceptional financial results have positioned Bittele as one of the fastest growing pcb assembly companies of its size in Canada. “Throughout this past year, we experienced strong demand for our pcb assembly which emphasizes high quality with fast turnaround,” says Ben Yang, president and CEO of Bittele. “Our customer list expanded to hundreds of new corporations and we deepened our business activity with existing Fortune 500 customers. What made 2012 a banner year was our successful deployment of new state of the art assembly and testing equipment that included a 3-D X-ray machine and a reflow oven. This demonstrates our commitment to improving service to guarantee value for design engineers who desire fast turnarounds of low production run pcbs. 2012 was clearly our best year.” Specializing in turnkey pcb assembly, Bittele recently invested in high tech assembly equipment that can automate the pcb assembly process required for increasingly smaller sized, sophisticated designs.

Blue Line Innovations, a company born and bred in St. John’s NL, has opened a new office in Ottawa, aiming to take advantage of local talent and expertise in product development, engineering and customer care. The firm currently has five staff in Ottawa and is recruiting for additional positions. “Roosting in Ottawa was an easy decision. Ontario is a really important market for us. We are supporting a number of electric utilities through the peaksaverPLUS program, and we really see Ottawa becoming a smart grid/cleantech hub. Being just down the 416/401 to our key customers and just around the corner from key industry collaborators is already bearing fruit”, says Blue Line Innovations CEO Peter Porteous. Blue Line Innovations is a unique technology that provides an in home dashboard for electricity, putting real time electricity usage data into the hands of homeowners and small businesses. Access to data is step one in the Smart Grid future where users will take a more active role with utilities in managing energy costs and consumption.

C2MI innovation centre upgrades pcb capabilities

Celestica receives solar test approval TÜV Rheinland PTL, a leading provider of solar and photovoltaic (PV) testing has audited and approved Celestica Inc. solar lab in Toronto to provide testing required for certification of solar modules. Celestica’s Solar Lab is a state-of-the-art facility, with experience in product testing and analysis, and is capable of carrying out tests for a variety of PV standards, including UL-1703 / ULC-1703 and IEC-61215 /IEC-61730. It operates independently within the Total Quality Management System at Celestica, ensuring the integrity of test procedures and results. The solar lab’s testing capabilities and quality system, aligned with TÜV Rheinland PTL’s existing comprehensive regulatory compliance, testing and certification infrastructure, will decrease time-to-market for local solar customers.

The MiQro Innovation Collaborative Centre (C2MI) in Bromont QC has improved its research infrastructure for players in the electronics arena with the addition of some new equipment. C2MI installed a FinePlacer femto bonding system in its advanced packaging sector. The automated, sub-micron accuracy system from Finetech, Gilbert AZ, is designed to position and attach small electronic or opto-electronic components on printed circuit boards or substrates. As a centre of excellence for commercialization and research, C2MI provides a state-ofthe-art infrastructure for the benefits of its members. The high-technology hub provides support so that innovative concepts can be promptly commercialized. C2MI is active in die-level packaging, complex microsystems, 3D design integration and micro electromechanical systems (MEMS) development.

Intertek launches microsite to assist AHJs Intertek, a multinational inspection, product testing and certification company headquartered in London UK, recently launched a new microsite that serves as an educational resource specially designed for state fire marshals, building inspectors, electrical inspectors and other Authorities Having Jurisdiction (AHJs). Loaded with useful information in one easy-to-navigate place, the site (www. PartnershipInSafety.com) provides resources on timelines of product safety, plus an infographic detailing the firm’s role in product safety.

Medical Components

Simcona golf tournament reaches 20th milestone Twenty-years in the making, Simcona Electronics, hosted it annual golf tournament for suppliers and vendors in London ON recently. The picture perfect day saw the foursome of Eric Post, Millennium Marketing; Mark Glover, Simcona; Tom Luke, Weiss Co.; and John Meikle, CSIS, taking top honours. Pictured here, the foursome poses with one of the tournament hosts Carl Candler of Simcona, who thanked the following sponsors for their contributions to the tournament: EBM Canada, Buckland Custom Brokers, Hammond Electronics, Dennis Dani, Matera Technologies and X-Tronics.

Diverse appoints Ontario sales manager ŸAC-DC Medical Power Supply Modules

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Diverse Electronics, a Montreal-based franchised, electronic component, stocking distributor, has appointed Ingrid Bergh to the position of general sales manager for Ontario, responsible for sales and day-to-day operations in the province. Bergh has extensive experience with global distributors including more than 25 -years with Future Electronics. Diverse stocks a wide range of electronic components from more than 100 world-class manufacturers serving original equipment manufacturers (OEMs), MRO’s and electronic manufacturing services (EMS) across Canada. “Ingrid will work on increasing design and engineering support strategies that will further develop sales, increase market share and overall business,” says Diverse president Rick Masciotra. “Her commitment, previous successful performance and proven expertise, will enhance our partnerships with both our customers and suppliers.”

Rittal Systems unveils revised website Rittal Systems Ltd., Mississauga ON, has revamped its website to provide a “fresher and more functional” usage to web browsers. The completely rebuilt site, www.Rittal.ca, can assist viewers in finding a local distribution partner for Rittal products or download a CAD drawing. With simple navigation, the site is loaded with rich content ranging from product specifications to assembly videos. “More than ever customers want to be able to find the information they need quickly and easily and they want to do it at their convenience. With that in mind the new site offers access to CAD drawings, 3D models, instructional videos, product specifications, product literature, selection guides, press and event information, software downloads and much more,” says Tim Tim Rourke, business operations manager, Rittal.

SMTA golf tournament raises funds for charity The SMTA hosted its 17th Annual Electronics Manufacturing Industry and friends Charity Golf Tournament in Bolton ON recently, managing to raise funds for Shining Through Centre. Professionals involved in the surface mount and electronic manufacturing sector from the Greater Toronto Area participated in the event.

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electronic products and technology • october 2013

Semiconductors & ICs

How the SEMI industry will succeed in

another $100B growth

By Paul Marchal, director of technical marketing, imec

This article discusses three main technologies that will enable further growth for the semiconductor industry. Paul Marchal was a guest speaker during the imec technology forum held recently at the Semicon West show in San Francisco.

Industry analysts expect semiconductor industry to expand within the next five years to $400B, driven by three large application domains: smart phones and tablets, the associated infrastructure needed to support wireless data and finally the Internet of things that emerges, with applications in healthcare, logistics and consumer goods. The above growth is fueled by further advances in logic scaling, progress in material sciences enabling new memory concepts such as STT MRAM; advanced packaging solutions such as silicon interposers and 3D integration; and other More Than Moore (MtM) technologies enabled by advanced packaging. All these technologies together provide a platform for reducing power and form-factor; and for increasing the system performance.

Logic scaling: complex and costly Gordon Moore said that no exponential is forever, but we can delay forever. Today, there is no doubt that we can further improve transistor performance and reduce the power consumption down to the 5nm node. There are many options to boost performance and increase density. We are working on new concepts in litho such as EUV, multi-patterning and directed self-assembly; in device engineering such as non-silicon channels (III-V/ Ge or SiGe); in BEOL such as alternate barrier technologies and ELK materials. However, the truth is that every disruption increases complexity. Also, it may require new tool investments and thus ultimately increases NRE & capex. More than ever, the semiconductor industry needs to collaborate to share R&D for identifying a worthwhile scaling path. Also for the fabless companies, this evolution has consequences. First, they need to steer the technology definition (‘technology pathfinding phase’), the technology choices need to be driven by architecture needs. The most cost-effective options must be taken, making sense from a design point of view. Fabless companies should in an early stage understand how the technology may impact their architecture, giving them the time to adapt. To address above challenges, we are providing fabless companies with device models and cost estimates and we give them an idea of the maturity of the different options. Secondly, we help fabless companies during the design for manufacturing phase to understand how they need to fine-tune the designs for yield based on our fundamental understanding of the process. For example, we are using litho simulations to indicate hotspots in the designs. Finally, we help fabless companies to set up the infrastructure to monitor yield and possible causes of yield loss during ramp.

Smart, LIN Bus motor control IC simplifies 12V actuator

Next to logic scaling, advanced packaging is an enabling technology for semiconductor growth, supporting many new applications: logic-on-logic, multi-node integration, DRAM stacking, DRAM/logic stacking, radio/analog and logic stacking, optical and logic stacking etc. The 3D integration technology is relatively mature. The biggest barrier for its adoption today is the industry’s limited experience ramping its yield. For instance, it’s hard to control co-planarity of microbumps during stacking, necessary for achieving good yield. Provided the small geometries, co-planarity must be below 1.5µm, which is a big challenge. Besides, the combination of many different materials inside a stack with very soft BEOL layers may easily become a reliability headache. We are supporting fabless companies in their 2.5/3D integration efforts by providing them with designs optimized for manufacturing yield and help them select the right materials and assembly approach.

Silicon photonics: an important MtM technology 3D is an outstanding technology that enables an entire new field of MtM integration. A promising example of such a technology is silicon photonics. This technology can provide an answer in the field of wireless communications. It is well known that the bandwidth of the wireless network needs to increase by a factor of 1000 in the coming five years. This means that the bandwidth of the chips’ input/output interface has to increase with a factor 1000 or the area/Gbs has to be reduced. Classical electrical solutions don’t scale in this way because of physical limits. Optical IO may be a better way to go. Today, work is done on integrating these optical IO in a 3D fashion. 3D integration provides massive bandwidth between the optical subsystem and the logic die at low energy consumption. Heterogeneous (3D) integration and in particular silicon photonics are not always available as off-the-shelf options in a foundry. Because of this, we develop prototypes and low volumes to companies, based on our expertise through our R&D work and based on our state-of-the-art infrastructure. With this, we have provided you a glimpse of the technology innovations and its challenges that will bring the semiconductor industry a $100B growth in the next five years. That’s something to look forward to. For more information about logic scaling and how design houses should be involved from the very beginning; the challenges in 3D packaging; and the huge promise of optical I/O; visit the website: www.itf2013-semi-us.be http://www2.imec.be/be_en/about-imec/imec-technology-forums.html

Support for CEI 25G and 28G delivered on 28nm PHY IP platform

MLX81150 advanced motor controller IC incorporates many of the external components critical for dc/BLdc motor control into its compact package, curbing board space utilization, bill of materials costs and system power budget. Device has a high performance 16-bit embedded Flash microcontroller, with 32kByte Flash memory, which deals with specific motor control application requirements, while the built-in 4-bit central processor is able to completely take care of the LIN protocol (with Melexis providing the LIN protocol software necessary to accompany this). MELEXIS

Snowbush IP group will ship a new Silicon Intellectual Property (SiIP) platform supporting Common Electrical Interface (CEI) standards up to 28 Gigabits per second (Gbps) for deployment in high data-rate chip-to-chip and chip-to-module applications. Model SBMULTC2T28HPM28G SiIP PHY is targeted for the new generation of chips supporting emerging Exascale computing, Terabit networking, and Petabyte storage markets. Device is capable of being deployed in a multi-lane macro to support the highest I/O bandwidth possible with the lowest power per bit transferred. SEMTECH http://ept.hotims.com/46002-33

RAD-hard MOSFETs boost efficiency, reduce footprint 50%

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RF Switch enchances linearity and isolation performance PE42720 75-Ohm RF HaRP-enhanced single-pole, double-throw (SPDT) switch provides high linearity, leading isolation performance and improved video feedthrough. This combination is suitable for supporting higher data rates in cable modem termination systems (CMTS), multi-service headends, cable television (CATV) optical transceivers, fiber hubs, optical network terminals, and CATV amplifier modules. Using firm’s UltraCMOS technology, device upports increasing data rates as required by the industry transition to DOCSIS 3.1. High linearity minimizes distortion in the cable network to support new modulation schemes such as 4096-QAM, while the ability to support high isolation between RF ports minimizes unwanted signal interference. PEREGRINE SEMICONDUCTOR http://ept.hotims.com/46002-32

Advanced packaging: mature technology but yield and cost are an issue

R8 logic level power MOSFETs utilize Trench technology to provide extremely low on-state resistance (RDS(on)) of 12 milliohms (typical) and total gate charge (QG) of 18nC (typical), increasing efficiency performance by up to 6% compared to existing solutions. Model IRHLNM87Y20SCS has a BVDSS rating of 20V and a maximum drain current (ID) rating of 17A. Devices are available in firm’s SMD 0.2 surface-mount style package, achieving a 50% space saving compared to the existing SMD 0.5 package solution. INTERNATIONAL RECTIFIER http://ept.hotims.com/46002-34

High-voltage BLDC MOSFET gate driver IC can drive IGBTs, switches A4900 high-voltage (600 V), BLDC MOSFET gate driver IC provides six gate drives capable of driving a wide range of N-channel IGBT or power MOSFET switches. The gate drives are configured as three high-voltage high-side drives and three low-side drives. The high-side drives are isolated up to 600V to allow operation with high bridge (motor) supply voltages. Highside drives use a bootstrap capacitor to provide greater than the supply gate drive voltage needed for N-channel FET’s. Each FET can be controlled with a TTL logic level input compatible with 3.3 V or 5 V logic systems. ALLEGRO MICROSYSTEMS http://ept.hotims.com/46002-35

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electronic products and technology • october 2013

Instrumentation & Test

Thermal imaging camera fine-tunes quality control of resistors By Flir Systems Canada

FLIR A615 fixed mount automation and research thermal camera.

Cutting down failure rates of electronic components is essential for companies that want to supply a perfect product to their customers. The only way to ensure this is by checking each individual component to provide 100% quality control. This requirement was addressed by Isabellenhütte - a manufacturer of resistance alloys for thermocouples, alloys for extension leads and

passive components used in the automotive industry - by using a thermal imaging camera system from FLIR Systems. Located in Dillenburg, near Frankfurt, Germany. Isabellenhütte’s products are used by the automotive industry in fuel injection systems and other electronic control units. The company has a deserved international reputation for the high quality of its products. To achieve

Thermal imagery with temperature analysis is used to locate problems on circuit boards.

and maintain the high quality standards demanded by its customers worldwide, the company invests heavily in quality control and research & development.

Reducing failure rates by 100% But despite these investments, customers were still reporting failure rates of up to 5 p.p.m. By Isabellenhütte’s exacting standards, even a failure rate of 10-8 was considered unacceptable. It therefore decided to implement 100% control of all components. Weak points in the components may occur during the manufacturing process, and these can later result in faulty built-in electronic devices. The result is that the final electronic systems will not achieve the designed durability, leading to potential quality problems for both the device supplier and the automotive company. The solution that Isabellenhütte adopted was to install a thermal imaging camera system from FLIR Systems. This is used to inspect each component produced. Within a timeframe of less than 1 second, the system makes an infrared image that allows it to check the resistor for possible defects. These are shown as hot spots in the image, resulting from the higher surface temperature of a faulty device. In the quality control process, each resistor is charged for a very short period of time. Within 20ms the thermal imaging camera observes the thermal cycle of the component. Using the machine vision software IRCheck designed by the system integrator Automation Technology (www.automationtechnology.de), the computer compares the maximum detected temperature with

Infrared quality control principle: • Each resistor is electrically charged for an extremely short period of time. • A 20 ms snapshot is taken with the FLIR Systems thermal imaging camera. • The difference between the maximum and average surface temperatures of the component is compared against a predefined value. • If a faulty component is detected, a trigger output is automatically generated to remove the component from the production line. • The corresponding thermal image is stored in a database for statistical quality control purposes System configuration. • FLIR thermal imaging camera with a digital high-speed interface and an acquisition rate of 50 frames/s. • Close-up lens 34/80 with a 34mm horizontal field of view (HFOV) and 80 mm focal length. • Industrial components such as armoured cables, 19” rack and computer running Windows® NT™ Key benefits for the customer. • Fully automated quality control. • 24-hour operation with no need for an operator. • 100% quality control of every component. • Greatly reduced rate of later system Failures. http://ept.hotims.com/46002-5

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instrumentation & test

electronic products and technology • october 2013

Portable logic analyzers speed timing capture with deep memory

Due to the limits of physical wavelength, thermal cameras cannot achieve the microscopic resolutions of optical microscopes. However they can still achieve resolutions better than 3 microns/pixel at the high end of the technology.

the average surface temperature of the resistor. If the difference between the maximum and average values exceeds a predefined value, this means that the component has a hot spot. When a hot spot is detected a trigger signal is automatically generated to remove the faulty component from the production line. The whole process takes less than 1 second, from the entry to the exit of the testing machine. The thermal image with the defective area on the component is stored in a database for statistical process control purposes.

16850 Series portable logic analyzers provide speedy timing capture with deep memory for quickly debugging digital systems. Product provides both single-ended and differential probing options to help designers get their high-speed digital devices to market faster. The high sample resolution of these instruments makes it possible to differentiate timing problems from functional problems, providing the insight needed to shorten the debug and validation process and bring products to market more quickly. With 2.5 GHz, 400 ps period timing capture across all input channels, and up to 128-megasample memory depth, unit provides up to 50% faster timing capture with deep memory than any other portable logic analyzer on the market, with twice the memory depth. AGILENT http://ept.hotims.com/46002-38

Base station tester boosts performance in thinner, lighter design MT8220T BTS Master multi-function handheld durable tester provides all the capabilities network operators, sub-contractors, installers and regulatory authorities need when measuring base stations. Unit has improved performance, including a standard GPS receiver, enhanced two-port dynamic range, faster LTE scanner, and expanded spectrum analysis capability, in a design that is thinner and lighter than previous models. Product provides line sweeping, comprehensive wireless measurements, ultra-sensitive spectrum analysis and sophisticated interference tracking in a compact handheld solution. ANRITSU http://ept.hotims.com/46002-39

Even higher quality standards “Infrared thermography, and in particular the FLIR Systems thermal imaging camera, proved to be the perfect way to ensure that our quality standards are even higher than before,” says Mr. Eichman, Production Manager at Isabellenhütte. “We now monitor our production 24-hours a day. As we no longer need an operator to do this, we are saving money. Our initial investment in the thermal imaging camera repaid itself within an extremely short period of time.” What is more important is that each and every resistor is now checked, allowing them to deliver a perfect product. It goes without saying that Isabellenhütte’s efforts to supply a perfect product are highly appreciated by their demanding customers, ensuring that they remain a leading company in their sector. For more information on thermal imaging cameras from FLIR Systems Canada, go to http://ept.hotims.com/46002-36

Source measure unit instrument displays with interactive touchscreen Model 2450 SourceMeter benchtop Source Measure Unit (SMU) Instrument combines intuitive touchscreen and iconbased control that boosts versatility and provides a full-color, 5-inch touchscreen user interface: The full-color display and large on-screen characters enhance legibility. A simple, icon-based menu structure allows reaching any measurement set-up panel with just a touch. • The low current (100nA, 10nA) and voltage (20mV) ranges eliminate the need to add separate low-level instruments to a benchtop system. Back-panel triax cable connections eliminate the need for expensive cable adaptors, which can degrade low-level measurement performance. KEITHLEY INSTRUMENTS http://ept.hotims.com/46002-37

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instrumentation & test

electronic products and technology • october 2013

M-PHY The PHY driving innovation testing in mobile performance

tips & tricks

About 3-billion MIPI-powered ICs were shipped in 2012, but of those only 100-million were based on the highperformance, low-power M-PHY specification. That is certain to change in the coming years as M-PHY will be used in the development of high-end mobile devices to deliver increased performance, effective power management schemes, robustness against RF interferences and low RF emission. For designers accustomed to working with such high-speed serial standards as

By Chris Loberg, senior technical marketing manager, Tektronix

USB and PCI Express, M-PHY’s changeable gears, terminations and amplitudes will introduce a new set of testing challenges. For mobile designers who have been working with slower speeds, the higher speeds available in M-PHY will create new signal integrity challenge to manage timing/jitter and noise. Receiver stress testing will also be a requirement for the high speed gears (HS2, HS3). The MIPI M-PHY specification realizes the MIPI Alliance’s vision of a single low-power, mobile PHY, powerful enough

to address existing and future mobile devices requirements. It is the mobile PHY of the future for smartphones, tablets and will likely power next generation devices that merge the power of a PC with the responsiveness and long battery life of mobile devices. The MIPI first PHY standard, D-PHY, was introduced in 2005 and can be found in most mobile devices today. D-PHY is commonly used to connect an applications processor to a camera using the MIPI Camera Serial Interface (CSI) and

Spectrum/Signal Analyzers

to connect the applications processor to the mobile device’s display using the MIPI Display Serial Interface (DSI). D-PHY’s reach has not extended beyond the camera and display due to inherent architectural limitations restricting the transmission rate to 1.5 Gbps. This was not seen as a limitation several years ago, but is too slow to handle the data traffic in today’s smartphones and tablets. The M-PHY specification was fresh start designed for the long haul. This effort resulted in a serial, low pin count, embedded clock PHY that offers multiple transmission and power-saving modes. The M-PHY supports data rates from 10kbps up to 5.8Gbps, enough bandwidth to support the various data interfaces within a mobile device. Interfaces employing M-PHY now include several MIPI standards (CSI-3, DSI-2, LLI, UniPro, and DigRF), the USB SSIC standard, the Universal Flash Storage (UFS) standard, and more recently the M-PCIe standard. The interfaces are organized in a layered stack as shown in Figure 1.

Instruments for the

Full Spectrum of Testing

Figure 1: M-PHY provides a single standard that can accommodate a range of technologies.

M-PHY transmitter testing

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The MS2830A spectrum/signal analyzer offers measurement speed of high-end test instruments for the price you’d expect of a mid-range instrument. It has exceptional dynamic range (average noise level [DANL]: –153 dBm, third-order intermodulation distortion [TOI]: +15 dBm) and excellent ±0.3 dB (typ.) total level accuracy using unique level calibration technology.

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> Test your devices with 125 MHz wide real-world signals captured with the signal analyzer

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M-PHY transmitter testing involves approximately 1,000 tests across different combinations of gears, sub-gears, amplitudes, and termination for each lane under test. Set-up and reporting requirements are demanding as well. Due to the faster signaling frequency, a number of performance parameters need to be measured for M-PHY devices including slew rate, transition time, pulse width, unit interval, differential DC and common mode voltage, minimum eye opening, power spectral density (PSD) and jitter (long term and short term). In M-PHY HS measurements, signal validation on the following parameters are checked and validated on the acquired signal: • Data Rate – The unit interval of an M-PHY burst data signal needs to be computed since data rate variations could be within 2,000 ppm for any HS gear. • MARKER0 – This parameter (considering both positive and negative disparity) is searched in the acquired waveform. If MARKER0 is present, then the signal validation is passed for this parameter. M-PHY data transmissions can happen in burst or continuous mode. In burst mode data will have different states including PREPARE, SYNC, MK0, PAYLOAD and STALL. M-PHY has a number of electrical parameters that need to be measured at specific states of the burst. For example, PREPARE length uses PREPARE state, differential DC positive and negative uses PREPARE and STALL respectively. EYE, jitter, transition time and unit interval use MK0, PAYLOAD and MK2 only. From a test perspective, this means the engineer has to identify

instrumentation & test

electronic products and technology • october 2013

Transmitter test solutions To make M-PHY testing less onerous, test and measurement vendors offer automation software that reduces the overall test complexity and reduces the time required to test devices. While not all tests are covered, vendors typically support anywhere from 75 to 95 percent of the most important tests. Multi-lane setups are often also supported, which mean that four lanes of an M-PHY transmitter can be connected simultaneously to four channels on an oscilloscope to help shorten run times. The software also generates a single printable report for all the different test combinations.

Receiver testing for M-PHY Receiver testing has many waveform generation needs including non-return to zero (NRZ) signaling, pulse width modulation (PWM) signaling, 8b/10b encoding, reference clock, differential signal generation with common mode dc, and addition of jitter impairments such as ISI, Pj and Rj. Loopback mode is the most common mechanism for receiver testing, primarily for bit error rate (BER) testing. In M-PHY loopback testing, the receiver routes and re-transmits a recovered M-PHY signal through the transmitter without decoding 8b/10b symbols. Loopback mode requires that both the transmitter and receiver use the same mode and gear. An oscilloscope-based error detector or BERT can perform this testing. Similar to the transmitter side, software that automates Rx test set and execution can reduce complexity and save time. In addition to an oscilloscope, Rx testing also requires an arbitrary waveform generator. A typical configuration is shown in Figure 2. The software typically supports error count testing and provides options to modify the test setup according to device configurations such as the high-speed gear, test time or loopback duration. Before the receiver test can start, the device under test must be put in loopback mode. Once loopback is set on the DUT, the AWG sends a burst mode signal with

Optical spectrum analyzer fills tier-1 gap FTB-5230S Optical Spectrum Analyzer (OSA) is a tier-1 entry-level product suitable for a variety of field applications. Device meets the needs of a variety of turn-up and commissioning applications by delivering power and wavelength measurements, in addition to system critical OSNR testing in accordance with IEC 61280-2-9 (interpolation method). Product can also handle up to 23dBm per channel, making it suitable for modern cable operator networks. EXFO http://ept.hotims.com/46002-41

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recommended patterns for all measurements. The software allows the user to configure the loopback settings initially, and retain them for subsequent test executions by sending the signal continuously during the transition from one test to another. By working together, the AWG and the oscilloscope error detector can complete each measurement in about three minutes.

manually interpret the protocol layer information using oscilloscope data is time consuming and prone to human errors, particularly for protocol applications as versatile as M-PHY.

M-PHY protocol testing

Bright future

Designers working on M-PHY hardware and firmware designs need to monitor and debug protocol interfaces such as LLI, UniPro and SSIC to ensure reliable operation of the M-PHY system. High speed serial designers prefer familiar instruments such as mixed signal oscilloscopes for both electrical and protocol testing. Oscilloscopes provide extensive details about the electrical characteristics of the signal and with the decode software can provide insight into packet contents at different protocol layers. Decode capability is necessary because trying to

As PCs become lighter and thinner and tablets and Figure 2: Here is a typical configuration for M-PHY receiver testing. smartphones become proven low-power PHY layer. As with any more functional, it’s easy to see the emerhigh-speed serial technology verification, gence of a new class of device that comcompliance testing and debug will be bines all the power of a workstation-class critical to successfully PC with the always on/always connected bringing M-PHY based convenience of mobile device. The emertechnologies to market. gence of M-PHY along with the adaption of popular PC I/O standards to M-PHY will allow component and device manufacturers to reduce product development and validation time by taking advantage of a

For more information on M-PHY testing tips & tricks from Tektronix, go to http://ept.hotims.com/46002-40

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different states in a burst waveform, place markers or cursors and then measure the required electrical parameter. M-PHY burst has SYNC and PAYLOAD which are 8b10b encoded; meaning there are no symbols which have more than five continuous ones or zeros (maximum allowed run length of 5 bits). This behavior is used to identify PREPARE and STALL. The remaining part of the waveform (SYNC, MK0, PAYLOAD and MK2) are converted into bits, the location of MK0 (considering both positive and negative disparity) and end of burst are identified and measurements are performed on cursor gated regions.

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instrumentation & test

electronic products and technology • october 2013

Tektronix expands 100G electrical test portfolio Adds industry’s first multi-function 32Gbps linear equalizers Test and measurement leader Tektronix Inc., Beaverton OR, announced a significant expansion of its portfolio of instrumentation and software to support designers working on the electrical side of 100Gbps communication systems. The introductions include the LE320, a 2 differential channel, 9 tap Linear Equalizer supporting data rates up to 32Gbps as part of a BERTScope receiver test system; new options for the PPG/ PED multi-channel BERTs that provide signal impairments and output adjustment at data rates up to 32Gbps, as well as, a new 40Gbps error detector model; and Option CEI-VSR that automates the DSA8300 Sampling Oscilloscope to perform required compliance tests for the CEI-28G-VSRstandard. The need for 4x25G testing is becoming more important as the industry moves from silicon design to transceiver and system design. Designers are creating

innovative network elements that allow up to 100Gb/s, which will be delivered using four lanes of 25-28Gb/s. Design challenges emerge when transmitting these high frequencies on printed circuit boards, even for short distances. The LE320 provides test engineers with versatile output signal conditioning and tunable input equalization to create an optimal system for testing four electrical channels operating at 25-28 Gbps each; an ideal complement to the multi-channel capabilities of the enhanced line of PPG/ PED pattern generator and error detector products. The Sampling Oscilloscope Option CEI-VSR will ensure efficient and consistent compliance testing support so that design teams can smooth the transition to manufacturing. “As 100G moves into the mainstream, we are providing two critical additions to our portfolio that address challenges in 4x25G electrical PHY testing for chips, gearbox-

es, transceivers and systems,” says Brian Reich, general manager, performance oscilloscopes, Tektronix. “For receiver testing we’ve enhanced our BERTScope with support for electronic channel modeling and equalization while adding 40Gbps support to our multichannel BERT.” Designers developing systems that run at 10Gbps or faster need an equalizer in front of Rx inputs or a pre-emphasis module on transmitter Tx outputs. As speeds increase, designers have had a limited selection of instrument-grade signal conditioning products beyond 12Gb/sec for meeting these requirements.

The LE320 will support signal conditioning on data rates from 8Gbps to 32Gbps in a 9-tap design used to deliver the highprecision error rate testing required by 100G communication standards like CEI28G-VSR. http://ept.hotims.com/46002-66

EMI test receiver tests EMC up to 26.5GHz R&S ESR26 EMI test receiver covers the frequency range from 10Hz to 26.5GHz. Unit performs conducted or radiated certification measurements in line with commercial standards such as EN, CISPR and FCC as well as military standards. Product performs standard-compliant disturbance measurements up to 6000 times faster than other testers. Unit provides comprehensive diagnostic tools to support design engineers. The persistence mode differentiates between pulse and continuous disturbances. ROHDE & SCHWARZ http://ept.hotims.com/46002-42

Accelerometer senses in demanding downhole Honeywell Energy Q-Flex Accelerometers consist of the QAT160, QAT185 and the Mini Q. Family of ruggedized acceleration sensors are designed and built to tolerate demanding measurement-while-drilling (MWD) and wireline environments while providing precision accuracy. Field scaleable products deliver two temperature ranges and come with square and/or round flanges. XTRONICS

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LTE network simulator supports TD-LTE carrier aggregation MD8430A Signaling Tester adds software enhancements to deliver LTE network simulator support Time Division Duplex LTE (TD-LTE) Carrier Aggregation (CA) test functionality. Coupled with existing Frequency Division Duplex (FDD) LTE CA test capability, as well as leading-edge LTE Advanced functions, including enhanced Inter-Cell Interference Coordination (eICIC) and advanced beamforming functionality, product provides platform for device testing from development to certification and carrier acceptance. ANRITSU

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instrumentation & test

electronic products and technology • october 2013

Rugged digital pressure sensors are highly configurable

Short-reach, long Haul 100/400G optical networking test solutions enhance capability

Model DPS Digital Pressure Sensors with CANopen are rugged, all-welded, provide consistent performance in harsh environments and can be used in a wide range of demanding applications. Units are highly configurable, so customers can choose from multiple pressure types, accuracy levels, pressure ranges, pressure connections and electrical terminations to meet specific application needs. Configurations for digital measurements are fully temperature compensated and calibrated for pressure ranges from 10 psi to 10K psi or 1 bar to 700 bar or 70kPA to 70000 kPa, with accuracy ranges of 0.25% and 0.1%, and operating and storage temperature ranges from -25C to 85C. HONEYWELL SENSING

80C15 32GHz MultiMode Optical Sampling Module and the OM5110 46GBaud Multi-format Optical Transmitter expand testing support for both short range and long haul 100G optical network testing. Devices provide enhanced capability to test silicon photonic components, network elements and systems as well as the coherent modulation formats used in next generation optical fiber networks. 32GHz 80C15 multi-mode optical sampling module for use with DSA8300 Series Sampling Oscilloscopes provides high-fidelity acquisition of 850 and 1310 multi-mode signals. With a tightly controlled frequency response, it enables repeatable automated compliance testing for all of the short reach standards from 22 to 32GHz. OM5110 modulates all common formats including BPSK, PM- QPSK, and PM-16QAM up to 46GBaud with both fully automated and manual bias control of modulator and RF amplifiers giving users complete configurability and versatility. Unit provides built-in C or L band lasers along with support for external lasers. TEKTRONIX

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VNA leverages pulse measurement, true mode stimulus capabilities MS4640B series joins VectorStar family of Vector Network Analyzers (VNAs) provding PulseView, a pulse profile, point-inpulse and pulse-to-pulse measurements of S-parameters, and DifferentialView for true mode stimulus S-parameter measurements. Unit helps engineers address the challenges associated with testing and characterizing components and sub-systems designed for radar and today’s high-speed serial applications. Product provides 2.5ns resolution with 100dB dynamic range, coupled with independent measurement gates, provides clarity of results. ANRITSU http://ept.hotims.com/46002-46

Triaxial isotron accelerometer tests wide range in aerospace Endevco model 7253D triaxial Isotron accelerometer is suitable for applications requiring the measurement of shock and vibration simultaneously in three mutually perpendicular axes. Available in sensitivities of 10mV/g or 100mV/g, unit is small and lightweight with a broad frequency response. Features include thruhole mounting for 360-degree cable orientation, hermetically sealed titanium housing to protect against environmental contamination, and signal ground isolated from the mounting surface by a hard anodized insulator. MEGGIT SENSING SYSTEMS http://ept.hotims.com/46002-47

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Your question: EMI debugging with oscilloscopes? Our answer: Yes, you can! With digital oscilloscopes from the EMC expert. The R&S®RTO digital oscilloscope is a valuable tool for analyzing EMI problems. Using near-field probes, electronic design engineers can quickly understand unwanted emissions and identify their causes. Your advantages at a glance: ❙ High-speed, easy-to-use FFT ❙ Wide dynamic range and high sensitivity of 1 mV/div ❙ Color-coded display of the frequency of occurrence of spectral components to reveal intermittent signals ❙ Correlated time-frequency analysis with gated FFT ❙ Frequency mask for capturing sporadic events See for yourself: www.scope-of-the-art.com/ad/emi

RF signal generation, analysis speeds test throughput M9391A 1-MHz to 3- or 6-GHz PXIe vector signal analyzer provides up to 160MHz bandwidth designed to test the latest wireless standards. Used in combination with firm’s modular X-series applications, product provides a consistent user interface, common measurement consistency, and backward-compatible APIs to accelerate test development and throughput. Unit is a complementary product to the M9381A PXIe VSG for testing and design validation of wireless power amplifiers, transceivers and cellular base stations, primarily picocell and femtocell. Device provides Fastune technology that enables fast servo-loop test times through rapid frequency and amplitude adjustments. Plus, its hardware-accelerated power measurements maximize throughput while retaining measurement integrity. AGILENT

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electronic products and technology • october 2013

Supply Chain Management / Distribution

Turnkey services increasing

to meet supply chain changes

Semiconductor penetration continues to increase and diversify across market sectors and into more end-product devices. With this increase of semiconductor chips on Bills of Materials (BOMs) populating more industry sectors, end-product manufacturers in particular are finding themselves in need of global, turnkey solutions to manage the growing list of By Todd Burke, required electronic senior account component sourcing executive, and inventory manSmith & Associates agement services. Not only are semiconductors and electronic components on the rise in BOMs, the complexity of the chips is increasing as well. What this means is that industrial manufacturers are facing both a steep learning curve pertaining to the acquisition, possession, and internal distribution of components, while they simultaneously contend with the ever-increasing sophistication of components requiring testing and quality

control to detect counterfeit, fraudulent and/or subpar parts from entering their inventories. Having industry standard, quality management systems (QMS) and procedures in place is important for navigating complex electronic component supply chain challenges. Balancing QMS needs with overall cost management for the acquisition and possession of electronic components is at the center of industrial companies’ strategic shifts for turnkey sourcing and inventory management services.

Turnkey solutions in demand from industrial companies Among the most cited reasons that industrial companies increasingly are demanding turkey services are cost savings, inventory management and quality assurance. These strategic advantages are realized by consolidating vendors from a group with individual strengths to a few, best-in-class providers, that provide broad and deep supply chain experience through a full range of global services, industry standards, quality management, processes and procedures for sourcing

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“Reducing the vendor base in and of itself is a significant cost savings and improves both risk and quality management” and handling an array of components that notably include electronics. Reducing the vendor base in and of itself is a significant cost savings and improves both risk and quality management. There are many cost benefits to turnkey services, both externally and internally to the company. By reducing the number of vendors, the costs of regular auditing and transaction costs are also reduced while more favorable pricing for increased orders are achieved, for example. Similarly, internal costs that can be reduced include the need for investing in the construction and maintenance of warehousing space and technical engineers to ensure the proper management of the materials, particularly for electronic components and parts. Additionally, costs include meeting and maintaining industry standard handling and anti-counterfeiting processes and procedures. These handling and anticounterfeiting operations must be done by trained quality inspectors; having the proper equipment, packaging, storing facilities, insurance, and related possession costs for the inventory. In reality, such dedicated electronics inventory management capabilities are not a core competency in many industrial or other enterprise settings. The goal for businesses and turnkey service providers is to reduce the total cost of acquisition and possession of parts while ensuring long-term supply chain stability. In terms of costs, the costs can be tied to the value of the inventory being managed such as the number of transactions per week or month, or it can be negated altogether by agreeing to pre-defined monthly or quarterly sales targets. In the end, turnkey services are centered around a partnership in which both parties want the other to succeed and thereby both do.

Quality is always paramount Quality and best practices are at the core of turnkey service demands by industrial customers. The unique nature of many electronic components dictates using service providers with specialized process and industry recognized certifications. At a minimum it is essential that supply chain partners hold SAE and ISO accreditations and certifications, notably ISO 9001, ISO 17025, and ISO 14001. High performance automatic cut and strip machine featuring intuitive programming and a wide range of processing options that make it a wise investment. n Measures, cuts and strips up to 600 MCM and jacketed cables up to 1.38” in diameter n Modular, open system architecture offers supreme flexibility n Indexing cutterhead with up to 4 blade sets n Programmable rotary cutting unit for precise shield cutting n Automatic locking guide system Schleuniger, Inc. | Manchester, NH | (603) 668-8117 | www.schleuniger-na.com/ms9650_ept

“Quality and best practices are at the core of turnkey service demands by industrial customers” Evaluation of electronic components’ quality can require laboratory testing. In the case of the semiconductor and electronics industry, testing laboratories can

be accredited under the ISO/IEC 17025 quality standard. The ISO/IEC 17025 is both a management and a technical facility quality standard and is importantly related to ISO 9001, Quality Management Systems (QMS). Laboratories and businesses receiving ISO/IEC 17025 and ISO 9001 accreditation, therefore, have demonstrated not only that the operations, procedures, business and quality management processes are well-established, adopted throughout the organization, and meet rigorous requirements, but it also means that the technical laboratories, in which the testing is performed, is staffed by appropriately certified and trained professionals. Also, these sophisticated, high-tech labs must meet multiple levels of equipment, facility management, and should be able to perform standard, non-standard and laboratory-developed methods for testing and calibration of the products being handled. Additionally vital to the safe and proper handling and storage of electronics is the ANSI ESD 20:20 certification. Furthermore, in sourcing and ensuring the traceability of electronic components, having industry-recognized processes and procedures in place is paramount; among those should be AS5553, AS6081, AS9100, and AS9120. It is important that checklists of accreditations and certifications, such as those listed above, be considered only a starting point. On-site auditing and due diligence of supply chain partners are paramount to ensuring that the full suite of services for sourcing, documenting (including reporting and traceability), testing, handling, storing, repackaging (when necessary), and logistics handling of all semiconductor and electronic components is properly and consistently followed. Beyond the quality and control standards required to be certified, there are also vendor auditing and rating systems that bring with them a history of sourcing relationships and experience with quality management that are essential to successful anti-counterfeiting efforts. While each supplier will have their own vendor rating and quality control (QC) operations in place, it is essential that employees have continued education for technical and operational procedures and that they understand how to implement these policies and procedures in their enterprise. Performing on-site audits of suppliers is the best way to ensure that these critical business practices are in place and in use.

Collaboration vital for industrial semi supply-chain The semiconductor and electronics supply chain is a complex, global network that has always been rather volatile in nature due to sometimes-dramatic supply and demand shifts and the threat of counterfeiters looking to take advantage of those less-seasoned in global sourcing challenges. As industrial companies are seeing increases in their electronic components inventories, there is the simultaneous need to control costs and hold vendor bases to a set of best-inclass providers. Understanding what the continued on page 18

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supply chain management / distribution

electronic products and technology • october 2013

Innovating beyond the speed of consumer demand OEMs turn to a new model to stay competitive in the global electronics industry By Matt Perry, director of North America business development, electronic materials at Engent Inc. & Zhiwei Cai, global business director for electronic and assembly materials, H.B. Fuller

Pendulums often swing between extremes before settling on equilibrium; and, so it has been the case with the electronics supply chain. Nearly two decades have passed since there’s been a major disruption: when original equipment manufacturers (OEMs) opted to relinquish control of the manufacturing of consumer devices to a new set of suppliers that provide manufacturing services. The move swung the pendulum between extremes that transformed it into today’s highly complex, global marketplace. The shift sent the industry in a better direction with increased efficiencies and manufacturing costs, but with it were a new set of challenges. With reports of a lagging market, and tech-obsessed consumers demanding innovation, OEMs are seeking a smarter, faster and better way to move from product concept to consumer. OEMs are realizing that they must speed up the product development lifecycle and that they require constant innovation in order to meet the demands of retailers and consumers. As a result, they are looking for the equilibrium – or the right balance – that enables them to gain more influence and control over the product development lifecycle, while leveraging the ingenuity of the supply chain that supports their current manufacturing suppliers.

Setting new expectations Finding the equilibrium that enables OEMs to innovate faster and stay ahead of consumer demand is driving the newest disruption to the electronics supply chain. With the resources required to fuel the disruption now available, the change will happen sooner than you think. Already, OEMs are experiencing the results of this new model and are starting to expect more, thus swinging the pendulum further towards equilibrium. The new model – dubbed the ‘eco-system approach’ – gives the OEM the opportunity to have influence deeper into the supply chain by reaching past their manufacturing suppliers to directly involve the supply chain. With this direct line of communication, OEMs can task the supply chain to proactively innovate on their behalf to speed up innovation as well as the product development lifecycle. Being able to supply the total package is not something the manufacturing suppliers are able to do without direct involvement from the eco-system. Here’s how the eco-system approach works: As the OEM reaches into the supply chain (that provides products and services to the manufacturing partner), they present design challenges that are defined at the systems level. This forces the supply chain to expand their knowledge past what they sell and requires them to be able to interact and provide knowledge past the product or service they provide. To do this, the supply chain interacts, in concert, as

independent groups within the supply chain that span from materials, components, adhesives, pcbs, manufacturing equipment, etc. In addition, they also act interdependently with others in the supply chain, with the intent to innovate proactively on the OEMs behalf. The shared knowledge enables the supply chain to direct their research and development resources towards future innovation since they can now access actual demand, thus allowing the OEM to innovate faster.

“Being able to supply the total package is not something the manufacturing suppliers are able to do without direct involvement from the eco-system” In addition to the new benefits for OEMs, the supply chain is rewarded by having a direct audience with the OEMs to collaborate at a systems level, rather than at the supply level (e.g. materials and equipment). The OEMs’ manufacturing suppliers also come out ahead in the eco-system approach. They benefit through streamlined knowledge sharing which leads to increased yields using fewer resources. Ultimately, the eco-system approach places influence back into the OEMs’ hands, speeding up the innovation process. Through the eco-system approach, the supply chain is becoming smarter about how to structure their business operations to better navigate and optimize the complex eco-system. At the same time, OEMs must understand how to harness their power and best utilize their influence in this dynamic new world.

Harnessing the power of collaboration and supply chain ingenuity To take advantage of the eco-system approach, OEMS need to figure out how to reach beyond manufacturing suppliers and influence the broader supply chain. The move requires a willingness to interact with the supply chain despite not having done so in the past and an understanding of the highly complex global supply chain. OEMs must also understand how they can leverage their resources – manufacturing suppliers and supply chain. To help better understand the complexities of this new approach, consider that the electronics industry has its own eco-system with respect to where the product life cycle lives. In the electronics product eco-system, development starts with an idea of a new product and goes through many stages from the initial idea, until the product is in the hands of the consumer. This includes prototyping, new product introduction, product launch and production.

“Consider that the electronics industry has its own eco-system with respect to where the product life cycle lives” The developers of the product interact across all corners of the globe and across multiple companies in order to produce the electronic device. This eco-system is very dynamic due to increased consumer demand for smaller, lighter and more functional products. In order for the eco-system to yield optimum results, it must draw from the expertise that exists within the eco-system, from all over the world with developers of the product working together to leverage expertise and facilities. Since the eco-system is global, there is a need for the right level of customer support to be located in the right regions of the world. Through this model, the eco-system requires the manufacturing supplier to interact with both the OEM and the supply chain in order to accomplish the goal of improving the supply chain. Knowing that the entities that make up the supply chain are independent from

Matt Perry is the director of North America business development, electronic materials at Engent Inc. He holds a BS in Mechanical Engineering from Purdue University and an MBA from the Fuqua School of Business at Duke University

Zhiwei Cai is the global business director for electronic and assembly materials at H.B. Fuller. He holds a BS in Electrical Engineering and Master in Machinery engineering from Beijing University of Aeronautics and Astronautics.

each other as well as from the manufacturing supplier, members of the supply chain need to leverage their resources – of knowledge (materials, processes and equipment) and infrastructure – to ensure the whole solution from the concept phase to the consumers’ hands is successful, and not just their part. Under the eco-system model, while members of the supply chain are interdependent, no one – OEM, manufacturing supplier or other supply chain members – gets to the next stage unless they all do it together. To illustrate the dynamic model, imagine a scenario where consumers are demanding larger viewing screens on their mobile devices but they also want them to be thinner and lighter weight. That’s not so hard to imagine, right? As it stands today, no materials alone exists to make this possible. Now consider what happens when an OEM reaches deep into the supply chain (past their manufacturing supplier) to engage one of the supply chain members who has the knowledge and infrastructure to navigate the eco-system. The move forces collaboration between those in the supply chain who specialize in 3D stacking of components including adhesives, components, printed circuit boards, materials, assembly and packaging suppliers. Together, through shared resources and knowledge, the supply chain holds the ingenuity to define and develop the new materials needed that make this electronic device possible.

A better way to create: benefits of an eco-system approach OEMs are just beginning to understand the opportunity that exists within a new eco-system approach for the product development lifecycle. On the surface, it means designers will have more options to innovate faster. And, with the power of collaboration between suppliers in the eco-system, OEMs will enjoy better advancements in technology for their products in a compressed timeframe, enabling a competitive advantage in an already highly competitive marketplace. The approach will also simplify and speed along the process up front. And suppliers with the infrastructure to offer the full lifecycle approach will be able to satisfy the OEMs needs in a condensed timeframe. With the new eco-system supply chain model in mind, OEMs are beginning to look inward and asking: Can I afford to keep doing what I’m doing? What’s the best way to innovate beyond my manufacturing supplier? How can I interact and influence the larger eco-system? At the same time, they are starting to challenge the supply chain by asking a new set of qualifying questions: What can I expect from my supply base and their supply chain? Are they global? Do they need process knowledge of materials, equipment and advanced packaging technologies? Do they have facilities to support the development of technology as well as on-site production support? Are they aware of the eco-system and how its parts interact? Manufacturing suppliers and supply chain members who are able to offer OEMs this type of ecosystem support will be the glue that holds everything together in the new electronics product development lifecycle. And the equilibrium will once again enable OEMs to heavily influence the manufacturing process, speeding up innovation. For more information on electronic materials from Engent Inc., go to http://ept.hotims.com/46002-50

For more information on electronic and assembly materials from H.B. Fuller, go to http://ept.hotims.com/46002-51

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supply chain management / distribution

electronic products and technology • october 2013

Are ‘just-in-time’ supply chain policies adversely impacting the electronics components industry By Components Direct

The rise of just-in-time manufacturing has created a revolution across the supply chains of many industries, including electronics components. Accurate forecasting and inventory control have enabled far-flung manufacturers to produce and deliver components, essentially on-demand, to a global network of suppliers and customers, while avoiding costly warehousing and other overhead expenses. However, these justin-time policies have a downside and can leave many companies vulnerable to missed production targets and inability to meet customer demands. Whenever there is an interruption in the supply chain (natural or manmade), the ‘just-in-time’ system is in jeopardy of breaking down and mission-critical industries must look elsewhere for highly desirable components. If a manufacturer has forecasted incorrectly and not manufactured enough of a product line, it could take 6-12 months before it can return to production after having retooled for other components. Steve Culp of Accenture’s Risk Management practice stated in an October 2012 article in Forbes, “the fragility of global supply chains is related to emerging risks, but is also related to supply and network design strategies.” He may have added that these seemingly well-thought out design strategies have proven to be easily impacted by interruptions. Take the example of a natural disas-

ter. When the 2011 Japanese earthquake and tsunami struck, production delays rippled throughout the supply chain.

“The fragility of global supply chains is related to emerging risks, but is also related to supply and network design strategies.” A report by the Congressional Research Service cited several examples of how the electronics industry was negatively impacted by this catastrophic event: • Two Japanese plants accounting for 25% of the world’s supply of silicon wafers for computer chips were closed • Texas Instruments had to close a factory in Japan (until September 2011) accounting for about 10% of its revenues • Nihon Dempa Kogyo, the second-largest maker of quartz components (with a roughly 20% share of the global market), had to turn to overseas facilities to compensate for damage at its plant in northern Japan In these cases, buyers seeking inventory have historically had little recourse beyond the unreliable broker channel or being forced to turn to the gray market. Turning to the gray market and purchasing a part from a source other than the

EP&T is pleased to announce its 2013 series of EPTECH trade shows

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electronic products and electronic products and technology technology

For more information on excess and end-oflife components from Components Direct, go to http://ept.hotims.com/46002-52

Content touches on computer science, electrical engineering and human-computer interaction Arduino expert, author and element14 Community thought leader Jeremy Blum has written a new book, Exploring Arduino: Tools and Techniques for Engineering Wizardry. The work uses the popular Arduino microcontroller platform as a tool to teach about computer science, electrical engineering and human-computer interaction. It also shares best practices in programming and design that readers can apply to any project, as well as code snippets and schematics that will serve as useful references for future projects, even after mastering all the topics in the book. “Jeremy‘s insight has been incredibly helpful to our element14 Community, and we are pleased to see him expand his influence by publishing this work,”says global head of community Dianne Kibbey. “Weíre also happy to provide our Community members with the opportunity to win a signed copy.” Exploring Arduino features: • Projects that utilize different capabilities of the Arduino, while interfacing with external hardware. • Chapters that build upon each other, tying in concepts from previous chapters to illustrate new ones. • Arduino aspects that are accompanied by video tutorials and other multimedia content. • Electrical engineering and programming concepts, interfacing with the world through analog and digital sensors, communicating with a computer and other devices, and internet connectivity. • How to combine smaller topics into more complex projects. • Downloadable materials and source code for everything covered in the book. http://www.jeremyblum.com/2013/07/14/exploring-arduino/

Turnkey services increasing challenges are and having a guidepost to conduct due diligence on electronics service providers is critical to ensuring quality parts and quality management processes and procedures for this sector.

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original manufacturer or their authorized distributor exposes the buyer to not only sub-standard components but also increases their risk of purchasing counterfeit components. According to the May 2012 report by the Senate Armed Service Committee titled “Inquiry Into Counterfeit Electronic Parts in the Department of Defense Supply Chain” an “overwhelmingly majority” of the more than one million counterfeit parts identified in an investigation of the DOD’s supply chain were sourced from a party other than the original manufacturer or their authorized distributor. Franchised excess & obsolete (E&O) distributors with guaranteed product traceability are filling a gap in the lean supply chains resulting from just-in-time manufacturing. By holding excess and unsold

For those who are long-standing in the semiconductor and electronics industry, vigilance and quality inventory sourcing and management is certainly not news. Along with the rise in semiconductor penetration in designs, there is a simultaneous diversification into more

sectors and industries. Increased chip commoditization and new design architectures of components expand the reach of electronics into more industrial designs as well as internal and external corporate clients to meet rising demands for enhanced device capabilities and more real-time connectivity with field sites and remote locations. While the advantages for industrial electronics are clear and growing steadily, there are new challenges being faced by industrial companies as they work to balance costs and QMS requirements when sourcing, handling, and distributing semiconductor and electronic components. For more information on independent distribution of semiconductors from Smith & Associates, go to http://ept.hotims.com/46002-53

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An Electrocomponents Company.

supply chain management / distribution

electronic products and technology • october 2013

Allied Electronics and RS Components release

DesignSpark Mechanical

3D solid modeling and assembly tool Leading high service distributor of electronics and maintenance products Allied Electronics Inc., Fort Worth TX, and RS Components (RS), New York, announced a significant development in the history of 3D design software with the unveiling of DesignSpark Mechanical, a new 3D solid modeling and assembly tool that is available free of charge. Developed in conjunction with SpaceClaim, the leading provider of flexible and affordable 3D modeling software for engineers, the new easy-to-use DesignSpark Mechanical is suited for design engineers and is available in multiple languages. It is a significant step in the evolution of the DesignSpark online resource hub for the engineering community. The availability of DesignSpark Mechanical overcomes the two major barriers to entry faced by potential users who do not currently have access to a 3D design solution, but who could benefit enormously from the use of 3D modeling to quickly develop sophisticated concepts and products, according to Dan Stewart, vice-president of marketing at Allied Electronics. Stewart indicates that impediments include prohibitive costs and the considerable investment in learning time associated with traditional 3D CAD tools. “Not only is DesignSpark Mechanical free, its simplicity of use means that engineers and others involved in product development can become fully conversant with the software within minutes, rather than the weeks or months required to become skilled with traditional 3D CAD tools,” Stewart enthuses. “Engineers will love using modeling software that is so intuitive and flexible,”

Stewart adds. “Its use early in the design cycle can eliminate much of the timeconsuming rework associated with traditional product development processes. This is a highly significant initiative that helps engineers to bring innovative products to market quickly, and DesignSpark Mechanicalís STL output format enables direct export of designs to 3D printers,” he adds. With access to more than 38,000 3D models in an online component library, DesignSpark Mechanical gives engineers the ability to rapidly undertake an end-toend design with professional-grade modeling tools that are at zero cost. RS and Allied have also collaborated with 3D content company TraceParts to provide access to millions of models from the online tracepartsonline.net CAD portal in DesignSpark Mechanical format. “Allied and RS are partnering with SpaceClaim to launch DesignSpark Mechanical, which combines the power and ease-of-use of direct modeling technology from SpaceClaim with access to the massive library of standard parts from Allied and RS, trusted by millions of engineers around the world,” says Rich Moore, vice president of business development for SpaceClaim. “Feature-based CAD is more difficult to learn and with DesignSpark Mechanical, users can rapidly create 3D models to accelerate engineering design and improve their competitive advantage.” The active base of 3D CAD seats globally is currently estimated at approximately 1.5 million. However, it is also estimated that there are an additional 20 million engineers globally who do not currently use 3D CAD, but could significantly benefit from a tool such as DesignSpark

DSM_Cube

Mechanical. It will enable design engineers not only to be more creative, but will also support a more efficient product development process, allowing the production of professional concepts right through to delivering highly detailed and dimensioned manufacturing blueprints. DesignSpark Mechanical employs a powerful methodology called ‘direct modeling’, which is very different from traditional feature- or parametric-based 3D CAD software. The tool uses simple gestures that enable real-time editing and instant feedback, making it possible for engineers and others to create geometry and easily explore ideas and product concepts in 3D. All basic designs can be achieved quickly and easily via the use of the softwareís four basic tools — Pull, Move, Fill and Combine — in addition to its employment of familiar Windows key-

board shortcuts such as cut/paste, undo/ redo, which makes it highly intuitive for new users. The software can also be used as a complementary 3D tool in the product development process for the creation of early concept designs, for instance, alongside 3D CAD tools that are already in use today. The tool can remove bottlenecks in the early design process by allowing changes and additions in seconds, rather than having to wait for the CAD department using the traditional 3D tools to rework the design. DesignSpark Mechanical will be available for free download via www.designspark. com/mechanical with support available through the DesignSpark community at www.designspark.com.

Sager signs disty deal with Hirose

Avnet Embedded and Wind River reach disty deal

Electronic interconnect provider Hirose Electric, Simi Valley CA, has signed a North American distribution agreement with Sager Electronics. Hirose’s broad interconnect offering includes advanced solutions for LED lighting, mobile communications, networking, broadcasting, computers, consumer electronics, measurement and control, and automotive applications. Combining a wide selection of connectors with unsurpassed customer service, Hirose caters to design engineers and buyers by designing and delivering innovative interconnect solutions for specific OEM applications. “Hirose Electric is a high-quality interconnect solutions provider that continues to invest in developing new, innovative technologies for current and next-generation designs,” says Faris Aruri, vice-president of corporate marketing for Sager Electronics. “We are extremely pleased to work with Hirose to provide our customers an enhanced interconnect offering.” “With their unique focus and dedicated customer base, Sager is an excellent distribution partner for our comprehensive product offering,” adds Rick van Weezel, vice president, sales and marketing for Hirose Electric USA. “We are excited about the new markets and customers Sager will introduce to Hirose.”

Wind River, Alameda CA, leader in embedded and mobile software, has Avnet Embedded to distribute entered into a distribution agree- TechNexion computer products ment with Avnet Embedded, a divi- Avnet Embedded, a division of Avnet Electronics sion of Avnet Electronics Marketing Marketing Americas, has entered a distribution agreement with TechNexion, a leading provider Americas, Phoenix AZ. Under the terms of the agreement, of embedded modular solutions. Avnet Embedded Avnet Embedded will market, distrib- will now offer TechNexionís low-cost embedded ute and provide sales and product System-on-Modules and systems to its original support for the full Wind River port- equipment manufacturer (OEM) customer base. TechNexion manufactures a wide range of folio of software, related hardware, embedded boards and System-on-Modules followand other products to customers ing the popular Embedded Design Modules (EDM) throughout the Americas. standard featuring ARM-based processors from Avnet Embedded focuses on pro- Texas Instruments, Freescale, and x86 processors viding a full suite of embedded solu- from Intel. The company supplies turnkey embedtions — from storage, computing, ded systems, and touch-interface panel PCs and software and networking products, to fanless systems, as well. “Adding TechNexion‘s low-cost embedded sysdisk drives, flat panels and embedtem products gives us a great tool to help our ded boards from industry leading customers reduce costs and shorten their prodsuppliers. It markets, distributes and uct development cycles,” said Jeff Ittel, senior delivers support for original equip- vice president of embedded marketing, Avnet ment manufacturer (OEM), embedded Embedded. “Their support for popular CPU archiand commercial customers. tectures and their flexible, interchangeable CPU Avnet Embedded‘s Rorke Global modules make the products ideal for a wide variety Solutions‘ team can offer all of Wind of market segments.” River‘s products to deliver comprehensive solutions that integrate hardware, software and services. OEM customers may also purchase Wind River products through Avnet‘s components divisions, Avnet Electronics Marketing and Avnet Memec, in the Americas region.

Utech adds Fujipoly products to linecard Canadian distributor of passive and electro-mechanical electronic components Utech Electronics, has signed a distribution agreement with Fujipoly America Corp., Carteret NJ, producer of silicone-based electronic packaging solutions. Fujipoly specializes in products that range from advanced thermal interface materials to extremely reliable elastomeric connectors and custom rubber extrusions. Fuji Polymer Industries was established by a joint capital venture between Dow Corning and Chugai Bussan in 1978 as a company that would specialize in the secondary processing of industrial silicone rubber. Fujipoly has grown steadily over the past 21-years and now has nine divisions located in North America, Europe and Asia.

Digi-Key signs disty deal with Sanken semis, Digilent TTI receives ISO registration renewal TTI Inc., Fort Worth TX, specialty distributor of passive, interconnect and discrete components, has received renewal of its AS910C and ISO 9001:2008 registration for American operations through September 2016. AS9000 is the international standard for quality management systems for the rigorous aerospace and defense industries. This accreditation recognizes the structure and performance of TTI‘s resources, operational control, management and continuous improvement. Kevin Sink, vice-president of total quality, commented, “With this registration renewal customers can be assured that TTI has the systems and controls in place to consistently deliver the right parts at the right time. We look forward to continued service of all companies with not only ISO 9001 requirements but those with the rigorous AS9100 series requirements as well.”

Global electronic components distributor Digi-Key Corp., Thief River Falls MN, has reached a global distribution agreement with Sanken Electric Co., a leading global supplier of analog power semiconductor products. Sanken’s long history began in 1937, when the Toho Industrial Research Laboratory was established and commenced research and trial manufacture of selenium rectifiers. Today, Sanken’s semiconductor products are widely used in automotive electronic systems, home appliances, industrial control systems, consumer electronic products, and many other applications, where high reliability is demanded. Digi-Key also recently signed a distribution agreement with Digilent Inc., specialists in boards and engineering products used for technology-based educational design tools utilized by various students and universities worldwide. Digilent’s education and development kits serve as a do-it-yourself tool for students using single-board computers in higher education.

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electronic products and technology • october 2013

Medical Electronics

Usability a key factor

in modern

medical equipment

The 3rd edition of the international basic standard IEC 60601-1 is being applied across the world. It requires manufacturers to avert the risks of poor usability in equipment. The most efficient way to address usability in an organized manner is to apply the methods of standard IEC 62366.

Improving usability: a must for safety, good for users We all have cursed badly designed user interfaces; they may come in the form of doors that open in the wrong direction, set top boxes that are impossible to program or water taps that splash water on your clothes. When bad design ends up in hospitals, it may be fatal. In 1999 The Institute of Medicine issued a report entitled ‘To Err is Human: Building a Safer Health System.’ The report estimated that over 44,000 people die in US hospitals each year as a result of preventable medical errors. Most medical mistakes are not due to individual carelessness, but rather to faulty processes, conditions and systems that cause

people to make errors or fail to avoid making them. Since 1999 we have learned something. The European Medical Device Directive and United States FDA both demand that medical devices be developed taking errors arising from risk of use and human factors into account. The IEC 60601-1 3rd edition and specifically IEC 60601-1-6, are examples of international standards that seek to minimize the risks presented by poor usability. The manufacturer is responsible for making well-designed, ergonomic medical devices. The more natural a medical product is to use, and the easier it is to learn to operate, the safer it will be for patients. As a consequence, better and safer products increase their market competitiveness. Consumer electronics sector Apple’s iPhones are a good example of this. Apple revolutionized the smartphone market by providing an interface that was designed to maximize the user experience, not to force the user to learn the phone’s tricks. In the medical electronics world everything is well defined and regulated, and this applies to usability engineering as

User research / Conceptul design

Requirement and criteria development

Detailed design & specifications Evaluation

well. Extensive guidance about how best to minimize the risks with usability engineering is provided in IEC 62366. The 100-page document that defines the standard presents a user-interfaced medical device design cycle comprised of the following steps:

The usability engineering cycle

The following table further describes this usability engineering process, also providing an understanding of how the design cycle steps are designated in IEC 62366: A critical phase in the usability engineering cycle is the conceptual design. How can we understand the mental model of the user? How can we identify expectations and typical use? A good method is to use the rapid development model: build simple prototypes and simulators from cardboard and duct tape or with software tools, and let users loose. Observe what they expect your model to do or ask them to explain what they intend to do and what they expect to happen. After some repetition you have a much improved concept and are ready to define what functions are critically needed and how users expect them to behave.

What makes these 3x5’s so cool?

Usability of legacy devices

The simple answer is – very smart thermal management. • No fans • Lower noise • Up to 94% efficiency • Increased reliability

• Comply with UL60601-1 3rd edition • Input voltage range 90-264VAC ...with active inrush protection • 12 VDC 1A fan supply and auxiliary 5VDC 2A output

Convection Root Model Number Natural Cooling MVAC250-12 170W MVAC250-24 MVAC250-48 MVAC400-12 250W MVAC400-24 MVAC400-48

By Seppo Vahasalo, product line manager, Medical Devices, SGS

Many of the products that are already in use were not originally designed with usability engineering methods. There is now a proposal to address this and modify IEC 62366. The proposed amendment introduces an evaluation of User Interface of Unknown Provenance (UOUP) and a new Annex K to ensure that engineering processes include usability in legacy

devices, minor revisions of devices and standard components embedded in medical devices.

Does good usability just happen? The popular Finnish mobile game, Angry Birds is in principle just another shoot-and-crash game. What sets it apart is that everything works together seamlessly: user interface, music, characters, physics modeling and the basic idea all contribute to its overall success and popularity. Medical device design should follow the same principles; make everything easy and natural to use and reward the user when she or he does the right thing. It is not possible to ensure good usability in a product as an afterthought. Usability engineering must be incorporated from the beginning. It is also necessary to document the process continuously to comply with IEC 62366. While usability engineering is required by the regulations, good usability also offers competitive advantages in a tight market. In the medical field, good product usability is not just a gimmick, but rather a fundamental safety consideration. As an added bonus it can make your product fun and rewarding to use. When you succeed in providing top-notch usability, everybody benefits: patients, users and your balance sheet. For more information on medical inspection, verification, testing and certification from SGS Medical Devices Services, go to http://ept.hotims.com/46002-54

Forced Air Main Output Fan Output Aux Output Cooling (V1) (V2) (V3) 12Vdc 250W 24Vdc 12V 5V @250LFM on models 50Vdc ordered 12Vdc with Aux 400W output 12V 24Vdc @250LFM 50Vdc

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medical electronics

electronic products and technology • october 2013

4A step-down micromodule occupies less than 1cm²

40W, 65W convection cooled ac-dc power supplies comply with medical standards

LTM4624 is a 14V, 4A step-down µModule (micromodule) regulator in a 6.25 x 6.25 x 5.01mm BGA package which, including a few passive components, fits within 1cm² on a single-sided pcb or 0.5cm² double-sided. Product includes the dc-dc controller, power switches, inductor and compensation in a single package. Only two external ceramic capacitors (1206 case size) and a resistor (0603 or smaller case size) are required for operation. Device operates from a 4V to 14V input supply, delivering a regulated output adjustable between 0.6V to 5.5V. LINEAR TECHNOLOGY

MVAD040 and MVAD065 open frame, convection cooled ac-dc power supplies are packaged in the industry standard 2 x 4 inch format with a low profile, 1U compatible 1.3 inch height (50.8 x 101.6 x 33.02 mm). Devices provide up to 90% efficiency, and do not require additional heatsinking or forced air cooling to operate at full output power. No load power consumption is less than 0.3W which meets ErP and Energy Star requirements. MURATA http://ept.hotims.com/46002-56

Absolute encoders deliver 20 Bit resolution, non-contact technology

Netzer precision motion sensors utilize position sensing technology originally developed for harsh environment specialized http://ept.hotims.com/46002-55 GlobTek 2.13.13_ep&t 2/26/2013 9:05 AM Page 1applications. Products provide exceptionally accurate, high resolution, absolute position with miniature to wide diameter hollow shaft. Units are available with Analog Sin/Cos , Digital SSi, Digital AqB+I outputs, these rotary encoders feature up to 20Bit Resolution (with 12 bit A/D) and accuracy to <0.01. ELECTROMATE

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Smart Battery Chargers Offer Three-Phase Operation

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MedicallyApproved Open-Frame Switchers Deliver Up to 240W

Suitable for use in a variety of medical, ITE, and PoE applications, the GTM91110P240 Family of openframe AC/DC switchmode power supplies from GlobTek deliver up to 240W in a 3 x 5inch footprint. The devices are provided in factory-configured outputs from 12 to 55 V (in 0.1-V increments). Available in Class I or II versions, the 1.75-high power supplies are 85% efficient at full load and include features such as active PFC, a built-in EMI filter, and a 12-V fan output as well as DC-input versions from 130VDC to 380VDC. “Our switchers are versatile power supplies; you can use them in just about any indoor applica-

TantaMount TM3 series of surfacemount solid tantalum molded chip capacitors designed to provide improved performance and reliability in a wide variety of non-life-support medical monitoring and diagnostic instruments for in-home and hospital use. Devices provide a robust anode design, are 100 % surge current tested (B, C, D, and E case sizes) and come with Weibull grading and Hi-Rel screening options. VISHAY INTERTECHNOLOGY http://ept.hotims.com/46002-59

Demand rises in disparate regions

The global market for medical-grade displays is set to rise by nearly 30% from 2012 to 2017, driven by positive factors including improving economic conditions, the unleashing of postponed demand and rising sales in Latin America, Europe, the Middle East and Asia. Medical-grade display revenue is forecast to rise to $3.2 billion in 2017, up 29% from $2.5 billion in 2012, according to a report from IHS Inc., El Segundo CA. The global outlook for medical-grade display market encompasses monitors used for radiology, surgical and patient monitoring purposes. Within the patient monitoring category, units are employed in central stations, magnetic resonance imaging (MRI)-compatible equipment and midrange to high-end multiparameter displays. The majority of the market revenue in the coming years will be generated by patient-monitor displays because they command the highest average selling prices of all products in the market. However, the fastest growth in the medical-grade display market will be generated by the radiology and surgical segments. Revenue for these product segments are set to expand at a compound annual growth rate (CAGR) of 7 percent from 2012 through 2017, compared to about 5 percent for the overall medical-grade display space. “The medical-grade display market is reaping the benefits of multiple sources of demand,” said Shane Walker, senior manager

Power Connectors and Cord Sets

for consumer & digital health research at IHS. “After years of postponing purchases, U.S. hospitals are seeing their budget constraints loosen up, resulting in rising purchases of equipment, including displays. However, the rise in demand is actually very broad-based, with multiple developed and emerging regions around the world driving expansion of the market.”

Displays of health Despite scrutinizing budget increases and seeking ways to limit redundancy in the displays they use, U.S. healthcare providers are upgrading their units that are at the end of their warranty periods. Meanwhile, Latin American healthcare facilities are engaged in a long-term transition to digital technology. This will spur a continuous rise in demand for monitors from the region in the coming years.

Getting in the Eurozone As the year 2017 approaches, the recovery in Eurozone economies is expected to start to drive demand for medical-grade displays. The recovery is likely to be staggered, with some of the member countries remaining in a state of recession for the next few years. The southern Eurozone countries, which have been the most affected by the monetary crisis, eventually will emerge as a growth opportunity. This is because they will increase their adoption of picture archiving and communication systems (PACS) up from currently low levels, a phenomenon that will require the purchase of displays. The Middle East is also expected to emerge as a major market growth driver in the coming years, with Saudi Arabia and neighboring countries investing in multibillion-dollar research facilities and hospital building projects.

Asian health craze The Asia-Pacific region, in particular, continues to exhibit strong growth, due in part to government stimulus programs that contributed to specialty monitor adoption in 2010 and 2011. While most of the stimulus funds have now been exhausted, the initial spending helped to fuel equipment demand and industry development across the region, which has resulted in continued demand for specialty displays. The comparatively low penetration of specialty displays in Asia-Pacific is a key factor driving its high growth rate. Large segments of the Asia-Pacific market are still in the initial transition phase to higher-performance displays and increased use of digital imaging in medicine. SCHURTER's V-Lock cord retaining system is easy, safe and cost effective.

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Tantalum chip capacitors provide robust anode design

Medical-grade display market soars

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TAZ HRC5000 Medical Grade Tantalum capacitor series is rated for 4V to 50V and -55C to +125C, provides a capacitance range of 0.1µF to 330µF, and delivers very low dc leakage limits well below typical industry values. Available in case sizes ranging from A-H, devices are also available with several customization options to better suit individual medical and other high-reliability/lowleakage tantalum applications. AVX

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Providing smart rechargeable power capability to advanced portable and remote devices, the BL3100C1865004S1PSQA Li-Ion Battery Pack from GlobTek incorporates fuel-gauge functionality to provide important power status information. The 14.4V pack has a 3.1Ah capacity and includes a built-in protection circuit as well. “You can no longer put a battery in one of today’s products without providing a means to check on the power status, as device operating life is a critical aspect of a device’s performance.”

Medical grade tantalum capacitors boosts dc leakage standards

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Display dispatches Revenue growth in the medical-grade display market is being boosted by stabilization in average selling prices (ASP). The ASPs, in turn, are being propped up by increasing demand for larger screen sizes and for liquid-crystal displays with newer light-emitting diode (LED) backlighting technology. Ultrasound is projected to generate the strongest growth of the imaging modality markets during the next five years. The relatively low-cost and increasing diversity of the application is driving greater demand for ultrasound systems, including displays. Also, sales of very-high-resolution mammography displays are offsetting losses from the declining demand for low-resolution monochrome displays.

http://ept.hotims.com/46002-19

full online product listings at ept.hotims.com

Custom Electronic

ENCLOSURES Built in 2-3 days! - No Minimum Orders Protocase is celebrating 10 years in business! Over the last 10 years we've had the pleasure of working with small companies and individuals, as well as some of the biggest companies in the world, such as Apple, Boeing, GM, and Microsoft. No matter how big or small the job is, we treat every customer with the same personal, friendly service, and we always do our best to maintain our lightning-fast 2-3 day manufacturing time. As our community continues to grow, so do we. Whether it's adding new faces to our growing staff, or building online communities for ongoing support and communication, we strive to provide the best experience possible when you're creating something with us. From a simple one-off prototype, or a run of 100, we want to be with you every step of the way, just as you've been there with us for the past 10 years. Thank you for an amazing 10 years, here's to the next 10!

We build fully finished enclosures to your design, in your choice of steel, aluminum, stainless or galvanized, including cutouts, powder coats, silkscreens, fasteners, and hardware.

Built in 2-3 days

We offer unhead-of manufacturing speed. This lets you complete your electronics before you finalize your enclosure design. This greatly reduces painful and time consuming work.

No minimum Orders

We’re here to help our customers get their jobs done, so we’ll give your order the same priority and respect whether it’s a single enclosure or a one-off project, or a production run of thousands.

The fastest and easiest way to design, priceand build custom electronics enclosures.

Also Available

One-stop Shopping

Free Downloadable 3D Enclosure Design Software Fast and Easy Design Instant Price Quotes Buy Your Custom Enclosure Online With 2 - 3 Day Turnaround

www.protocasedesigner.com Protocase allows you to buy custom electronics enclosures with a whole new level of speed and convenience.

P R O TO C A S E

Custom Electronic Enclosures For Engineers & Designers http://ept.hotims.com/46002-20

Our friendly and knowledgeable sales representatives will be happy to assist you in placing your order.

www.protocase.com info@protocase.com 1.866.849.3911

ProductSource

electronic products and technology • october 2013

product source feature product source feature product source feature Low PIM Termination Load Our Low PIM terminations boast an impressive -168 dBc min with 2 X 20W tones @ 25°C PIM specification and operate over the range of 698 – 2700 MHz. These units are ideal for DAS system testing, In-Building, etc. applications. These units are also used for terminating the unused port of a hybrid combiner when adding two RF signals. Other units available from 10W to 150W. GAP WIRELESS www.gapwireless.com Tel: 855.826.3781 • info@gapwireless.com http://ept.hotims.com/46002-21

ADVERTISERS’ INDEX Agilent Technologies Canada Inc . . . . . OBC Allied Electronics, Inc . . . . . . . . . . . . . . 19 Alpha Controls and Instrumentation . (Insert, Ontario only) 11 Anritsu Company . . . . . . . . . . . . . . . . . . 10 AP Circuits . . . . . . . . . . . . . . . . . . . . . . 26 Avnet EM (AZ) . . . . . . . . . . . . . . . . . . . . 17 B&E Electronics Ltd. . . . . . . . . . . . . . . 26 Conec Corp. . . . . . . . . . . . . . . . . . . . . . . . 3 Digi-Key Corp . . . . . . . . . . . . . . . . . . . . IFC Electro Sonic . . . . . . . . . . . . . . . . . . . . . . 7 GAP Wireless . . . . . . . . . . . . . . . . . . . . 26 GlobTek . . . . . . . . . . . . . . . . . . . . . . . . . 24 Hammond Mfg. Co. . . . . . . . . . . . . . . . IBC Intertek . . . . . . . . . . . . . . . . . . . . . . . . . 12 Irwin Industrial Agencies Limited . . . . . . . 4 Mega Electronics Inc. . . . . . . . . . . . . . . . 16 Mouser Electronics . . . . . . . . . . . . . . . . . . 5 Murata Power Solutions . . . . . . . . . . . . . 22 NEWARK . . . . . . . . . . . . . . . . . . . . . . . . . 15 ODU USA Inc. . . . . . . . . . . . . . . . . . . . . 23 Protocase . . . . . . . . . . . . . . . . . . . . . . . 25 Rohde & Schwarz Canada Inc. . . . . . . . . 13 Sager Electronics . . . . . . . . . . . . . . . . . . 21 Schleuniger . . . . . . . . . . . . . . . . . . . . . . 14 Schurter Inc. . . . . . . . . . . . . . . . . . . . . . 24 TDK- Lambda Americas Inc. . . . . . . . . . . . 8 Tektronix, Inc. . . . . . . . . . . . . . . . . . . . . . 9

B&E Electronics Ltd. since 1975 has offered a full range of products required for the electronic maintenance and manufacturing industries. • electronic components & equipment • test equipment • wire and cable • batteries, power & protection products • electronic chemicals • tools and cases B&E Electronics is a founding member of EDGE Marketing, a North American buying group of independent electronic distributors.

www.be-electronics.com

Head Office: B&E Electronics Ltd. 444 Manitou Road SE, Calgary, AB T2G 4C4 • Tel: 800.661.5619 Branches: Regina: 800.667.3528 • Saskatoon: 888.249.5144

http://ept.hotims.com/46002-22

http://ept.hotims.com/46002-23

products on review

Benchtop cleaner is halogen-free, zero-VOC UltraClean VOC-free flux remover is used to clean rosin fluxes, synthetic fluxes, ‘no-clean’ fluxes and hard-to-clean solder pastes in the assembly and manufacture of printed circuit boards. The halogen-free flux remover can safely be used on the benchtop, as it’s non-chlorinated formula also is completely VOC-free, which means it does not contribute to low-altitude smog over cities. Product is suitable for rework and repair tasks, it is plastic-safe and compatible with firm’s TriggerGrip circuit board cleaning system. It also removes the fingerprints, moisture, silicone residues, light oxides, dust and other airborne contamination frequently found on circuit boards returned for warranty or repairs. MICROCARE http://ept.hotims.com/46002-60

GWS500 series ac-dc, forced air-cooled power supply achieves up to 90% efficiency, dramatically cutting the heat generated in many applications. Product provides a 4.1 x 8.6 inch footprint and 1.6 inch height, representing one of the smallest products in its class. Series comes in six models with nominal outputs of 5V, 7.5V, 12V, 24V, 36V and 48V. To accommodate non-standard system voltages device’s output is user-adjustable, either via the built-in adjustment potentiometer or by injecting an external programming voltage. TDK-LAMBDA AMERICA http://ept.hotims.com/46002-63

Three-phase electrical energy logger simplifies energy waste location Fluke 1730 Three-Phase Energy Logger with professional-level energy data gathering capabilities breaks new ground by enabling a broader category of multi-disciplinary maintenance professionals to confidently gather energy data, while firm’s accompanying Energy Analyze software scales from the analysis and reporting needs of the facility manager to the advanced analytical requirements of electrical engineers. Device allows technicians to load studies and energy logging right out of the box. The results provide facility managers with the information necessary to identify and prioritize energy saving projects. FLUKE CANADA

DIN rail single, multi pole circuit breaker is interchangeable E-T-A 4230 MCB thermal magnetic miniature circuit breaker (MCB) is totally interchangeable in ‘form, fit and function’ with existing standard MCBs on the global market place. Device has international approvals including IEC 60947-2 and UL 1077 and provides UL 489 approval for use in feeder and branch circuits. Product comes in single and multi pole versions, with toggle activation, visual status indication and high rupture capacity. A positively trip-free snap action mechanism ensures reliable switching. E-T-A CIRCUIT BREAKERS http://ept.hotims.com/46002-64

http://ept.hotims.com/46002-61

Electronic lighting tool aids MRO market

Marshalling, distribution terminals boost density

WorkStar Pocket Floodlight provides easy solution for technicians and tradesmen who need a lot of light, but don‘t want to lug around a heavy, bulky work light. Product provides an advanced light emitting diode (LED) that produces over 140 lumens of light, which translates into an efficiency of more than 10 times the amount of light produced by an incandescent light bulb using the same current. Device’s wide-angle, floodlight-style beam pattern is completely clear and free from dark spots or hot spots. The light is most effective at a range from six inches to six feet. The high output LED is rated for a service life of approximately 50,000 hours. The T6 aluminum body is anodized black and is indestructible and all threaded joints have rubber O-ring seals so it is water resistant. MAXXEON

PRV/PPV 4/8/16 terminal block series, PRV (Push-In Marshalling) and PPV (Push-In Power Distribution) is equipped with ‘push in’ connection technology. Both product families support efficient wiring concepts for process industry environments and have been specifically developed for the challenging demands of DCS marshalling and distribution signals of PLC applications. Products facilitate simple wiring, reduced cabinet space requirements, expanded wire routing and signal distribution capabilities. WEIDMULLER

http://ept.hotims.com/46002-62

full online product listings

Compact, low-voltage power supplies achieve up to 90% efficiency

http://ept.hotims.com/46002-65

ept.hotims.com

http://ept.hotims.com/46002-26

http://ept.hotims.com/46002-24

http://ept.hotims.com/46002-27

http://ept.hotims.com/46002-25

http://ept.hotims.com/46002-28

http://ept.hotims.com/46002-29

Agilent 33500B Series waveform generators with exclusive Trueform signal generation technology offer more capability, fidelity and choice than traditional DDS generators. Get the precision and flexibility you need to characterize new components and designs with superior confidence. And accelerate development from start to finish. Agilent and our Distributor Network Right Instrument. Right Expertise. Delivered Right Now.

800-463-9275 www.newark.com/agilent

33500B Series Waveform Generators Sine waves with 5x lower harmonic distortion Pulses up to 30 MHz with 10x less jitter Point-by-point arbitrary waveforms with sequencing 16 -bit resolution with 1 mVpp to 10 Vpp amplitude 8 upgradable models in 20 & 30 MHz

Learn more about the advantages of Trueform waveform generation www.newark.com/Agilent_Function_Generator

http://ept.hotims.com/46002-30