Electronic Products & Technology September 2014 by Annex Business Media

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electronic products and technology - SEPTEMBER 2014 electronic products and technology

AN EP&T SPECIAL REPORT PAGE 18

CONNECTORS Page 5

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EMBEDDED SYSTEMS & ENGINEERING COMPUTERS Page 14

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SWITCHES & CIRCUIT PROTECTION Page 16 STANDEX-MEDER ELECTRONICS

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e d i t o r i a l electronic products andtechnology technology electronic products and Volume 36 Number 6

September 2014

Stephen Law Editor 416.510.5208 slaw@ept.ca

Sohail Kamal

West Coast Correspondent sohail@nextgear.ca

Joanna Malivoire

Peter Loney

Account Manager Direct: 866.868.7089 jmalivoire@ept.ca

Publisher 416.510.5207 pdloney@ept.ca

Vancouver’s tech community surges ahead of US counterparts It’s been hard to avoid the palpable buzz around Vancouver over its apparent rise to becoming a top prospect within high tech communities across North America - reaching out precariously to attain the official crown as Silicon Valley North. We’ve seen this routine before – Ottawa in its Nortel days, followed by the Waterloo Region during the peak of RIM’s success. But, the present circumstance with Vancouver is different, in that there isn’t any one dominant player that stands out among the rest. Today, VanCity represents an amalgam of amazing, unique technologies, ranging from electronic application silos to emerging software firms and of course tech giants such as Facebook, Microsoft and Amazon. The proof is in the numbers – the digital entertainment & interactive sector alone adds $3 billion to Vancouver’s GDP and Tech employs nearly 80,000 in BC, many of whom live and work in the city. The tech industry in BC is growing in jobs and GDP at over 6% per year, according to the Vancouver Economic Commission (VEC). This trend is being driven by local success stories like Bardel Entertainment, now partnering with Warner Brothers and Dreamworks and well-known tech anchors like Hootsuite, Avigilon, and A Thinking Ape who have sprouted and bloomed out of Vancouver’s supportive ecosystem. These are just a few examples of why the global spotlight has set on Vancouver. Among the numbers aggregated include some 18,750 emerging tech companies counted by the provincial government arm Invest

BC. The VEC says the city’s three most popular tech job websites list more than 1,320 jobs – a figure likely smaller than actual openings, as many go unpublished. British Columbia’s statistical agency tallied 9,010 tech companies and 84,070 jobs over all in the province in an April, 2014, report. Recent media reports point to the obstructive U.S. immigration system that makes it difficult, and sometimes impossible, to bring talented engineers to US headquarters. As the political battle around overhauling U.S. immigration laws emerges, red-hot tech hubs like Vancouver stand to siphon coveted brain power from the international pool. Canada’s federal government is aware of the issue and doesn’t make any bones about exploiting it to boost the domestic economy. Offering permanent residency, the Canadian government launched a special ‘start-up visa’ last year to facilitate the arrival of young entrepreneurs, and will open another stream this January. BC also boasts lower corporate tax rates than the U.S., as well as enticing personal income tax rates. Reality is that it may be the city’s beauty that attracts people to the tech industries in Vancouver, but it’s the beauty of the jobs that inspires them to stay. Stephen Law, Editor slaw@ept.ca @EPTmagazine

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Editorial Purpose: Electronic Products & Technology provides timely, comprehensive coverage of the latest worldwide developments and trends in electronic products, equipment and systems, and interprets their significance to manufacturers and end-users in the Canadian marketplace. Publications Mail Agreement No. 40069240 Canada Post: Return undeliverable Canadian addresses to: EP&T Circulation Dept., 80 Valleybrook Drive, Toronto, ON M3B 2S9, Subscription Inquiries: 416.442.5600 x3548 • circulation@ept.ca EP&T (Electronic Products & Technology) assumes no responsibility for the validity of claims in items reported. © 2014 This publication or any part of it may not be reproduced, stored or transmitted in any form whatsoever without the express written consent of the publisher. From time to time we make our subscription list available to companies and organizations whose products and services we believe may be of interest to you. If you do not want your name to be made available, please contact EP&T with your subscription number.

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NEWSWATCH N E W S WAT C H NEWSWATCH electronic products and technology • september 2014

Xerox Canada gains patent for graphene nano-sheets

Keysight Technologies begins operations

The Xerox Research Centre Canada (XRCC), Mississauga ON, was issued its 2000th patent for an invention dubbed “Graphene Nano-Sheets and Methods for Making the Same” (U.S. Patent 8,734,683). Graphene is a thin, flexible conductor, 200 times stronger than steel and could form the basis of a whole range of next generation devices such as ultrafast transistors that will dramatically increase the processing speed of a personal computer, smartphone or tablet. Hailed as the ‘miracle material’ in the world of electronics and photonics, Xerox scientists are exploring materials such as graphene for use in digital manufacturing to make smart 3D structures that support the Internet of Everything. XRCC researchers Yiliang Wu and Sandra Gardner were the inventors named on the patent. Wu, a principal scientist, leads the center’s printable electronics activities. Xerox is exploring methods and software that use data collected by cameras to remotely detect vital signs and other physiological reactions. This patent covers real-world services that could be built around human ‘remote sensing’ such as a web service that can detect the level of nervousness a person experiences when speaking and help the speaker improve his or her performance.

Keysight Technologies Inc., Santa Rosa CA, officially launched the electronic measurement business of Agilent Technologies last month, now operating under the Keysight name. It will remain a wholly owned subsidiary of Agilent Technologies until early November when the separation is expected to be completed and Keysight begins trading on the NYSE under the symbol KEYS. Keysight is a market leader holding the number one position in the electronic test and measurement industry segments of communications; aerospace and defense; and industrial, computers and semiconductors. Keysight’s separation from Agilent was announced in September 2013. “As we launch our new company, we are mindful of our rich heritage as part of Agilent and prior to that, Hewlett-Packard,” says Ron Nersesian, Keysight president and CEO. “We are also mindful of our responsibility and commitment to our stakeholders including customers, our shareholders and our employees. We look forward to the many opportunities ahead Ron Nersesian, Keysight president that will allow us to focus solely on electronic measurement and showcase the leading-edge technologies that our customers have come to expect.” and CEO

Irwin Industrial to distribute EHC knobs Electronic Hardware Corp. (EHC), best known for having a broad selection of knobs, expanded its sales channels in North America by recently signing a franchised distribution agreement with Irwin Industrial, Aurora ON. EHC designs and manufactures control and clamp knobs, ratchet and bridge handles, index plungers, and small custom assemblies for OEMs. EHC is also one of few full certification manufacturers of illuminated and non-illuminated military knobs in the world. “With our focus on electromechanical components for equipment manufacturers, EHC was an ideal addition to our roster of brands,” says Brad Jolly, Irwin product manager. “Also, Weissco represents EHC in Canada, From left are Brad Jolly, marketing & product so we have tremendous local support manager at Irwin Industrial; Ed Polito, EHC sales across the country.” manager; Tom Luke, vice-president sales Ed Polito, EHC sales manager, visited at Weissco. Irwin’s headquarters and Montreal facility in July to provide some comprehensive product training on this engineered product line. “Irwin has a great team with plenty of depth in their organization. We look forward to a long and successful relationship.” Polito said.

IBM unveils first neurosynaptic chip Scientists from IBM have unveiled the first neurosynaptic computer chip to achieve an unprecedented scale of one-million programmable neurons, 256-million programmable synapses and 46-billion synaptic operations per second per watt. At 5.4-billion transistors, this fully functional and production-scale chip is currently one of the largest CMOS chips ever built, yet, while running at biological real time, it consumes a minuscule 70mW—orders of magnitude less power than a modern microprocessor. A neurosynaptic supercomputer the size of a postage stamp that runs on the energy equivalent of a hearing-aid battery, this technology could transform science, technology, business, government and society by enabling vision, audition and multi-sensory applications. The breakthrough, published in Science in collaboration with Cornell Tech, is a significant step towards bringing cognitive computers to society. This second generation chip is the culmination of almost a decade of research and development, the device’s architecture has an on-chip two-dimensional mesh network of 4096 digital, distributed neurosynaptic cores, where each core module integrates memory, computation, and communication, and operates in an event-driven, parallel, and fault-tolerant fashion. To enable system scaling beyond single-chip boundaries, adjacent chips, when tiled, can seamlessly connect to each other—building a foundation for future neurosynaptic supercomputers. To demonstrate scalability, IBM also revealed a 16-chip system with sixteen million programmable neurons and four billion programmable synapses.

For a more in-depth and Canadian perspective on the spinoff and reflagging of Keysight Technologies, read the important and positive changes for the firm online by Denis Jacques, president & CEO of Keysight Technologies Canada. http://www.ept.ca/news/conveying-our-longstanding-focus-with-a-new-name-keysighttechnologies/1003175708/

think green

RoHS exemptions set to expire in under 2 years By Walter Jager, principal consultant, ECD Compliance http://ecdcompliance.com

Since July 1, 2006 when the EU RoHS Directive first came into effect, the electronics industry has relied on exemptions that allow restricted substances to be used in specific materials or parts within a RoHS compliant product. Some of these exemptions are commonly used; if fact, most complex electronic products will claim at least a few exemptions. However, many of the exemptions that do not have a fixed expiry date begin to expire in less than two years. Work groups set up by industry associations and major manufacturers are hard at work to develop proposals to renew many of these exemptions, but some of the exemptions may be allowed to expire. Manufacturers and suppliers should be aware of the industry dynamics and to plan accordingly. RoHS 2 (EU Directive 2011/65/EU) article 5(2) states that the exemptions have a maximum validity period of five years for product categories 1-7 and 10 and 11 (seven years for medical devices and monitoring and control instruments). The current five year validity period (July 22, 2011 to July 21, 2016) applies to the use of exemptions (that have no expiry date) by products in categories 1-7 and 10. The exemptions are not valid after July 21, 2016; that is, unless an application to renew the exemption is successful. A renewal request (with technical justification) must be submitted no later than 18 months before the exemption expires – that is by January 22, 2015. Common Exemptions Annex III exemptions that are used

broadly in electronic components and systems include: • 6(a), 6(b), and 6(c) that allow specified max. levels of lead (Pb) to be used in iron, aluminum and copper alloys; • 7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead); • 7(c)-I, 7(c)-II, and 7(c)-IV which allow Lead in various glass and ceramic applications (including certain capacitors) • 8(b) Cadmium in contacts • Several exemptions for lead and cadmium in glass for certain optical and filter applications • 15 lead in solder for flip chip die attach Products with fluorescent lamps will likely be using one of the mercury exemptions. For communications equipment and servers, exemption 7(b) “Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission and network management for telecommunications” is still used by many manufacturers, particularly for complex printed circuit boards using large BGA devices. Significant work has been underway during the past decade to develop new materials and techniques to improve the long-term reliability using Pb-free solders. Product OEMs and suppliers should ensure that they are aware of the exemptions being used in their products and monitor efforts by industry to submit renewal requests for these exemptions. The opportunity to submit a renewal request ends 18 months before the expiry date. There will likely be a few surprises and some re-design work required.

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electronic products and technology • september 2014

Connectors

How trends in electronics are affecting connectors

Big demands on designs for small and portable devices By Bob Stanton, director of technology, Omnetics Connector Corp.

Rapidly changing demands and designs in product performance and electrical integrity are having a huge effect on electronic connector systems. New smaller and more portable electronics in aerospace, defense, and other stressful environments, like those encountered in robotics and oil exploration, are resulting in changing demands and designs. To meet the needs, changes are needed to standard micro-D connectors. New technology, including new latching Micro-D connectors developed by Omnetics, provide improvements for rapid connection and release with proven signal integrity for the portable and ruggedized electronics flooding into the market. The new latch technology provides high shock and vibration performance tested at military-level specifications.

Newer electronic instruments need smaller and lighter connectors

g personnel.

E L E C T R O N I C S

C O R P.

n Engineering c products for

Corporate and Manufacturing Headquarters 31-07 20th Road, Astoria, New York 11105-2017 Tel: (718) 956-8900 • (800) 221-5510 • Fax: (718) 956-9040 Website: www.keyelco.com • e-mail: kec@keyelco.com

nterconnect tilize the most nting to

It is a fact of life that instruments are changing rapidly and everything is getting smaller. Today’s newer electronic instruments can afford neither the space nor the weight required by older cabling and connector systems. (See Figure 1 for a few examples of the variety of connector types traditionally used for electronics.) Even many of the older military specification models are rapidly becoming outdated in the face of the evolving demand for smaller and lighter connection systems. Older connectors like the D-Subminiature connectors (Mil.DTL-24308), requiring 0.100-inch from pin to pin just do not fit within today’s systems. Rapid industry growth in microsize at 0.050-inch spacing and nanoconnectors at 0.025-inch spacing are fulfilling the need in today’s higher technology electronics. The change is sweeping through many industries as each one in turn sees the benefits of rugged portability and miniaturization and adjusts to the need for new connector and cable designs. For example, a number of military and deep space applications began using robotics and soon we began to see emergency rescue device development companies beginning to use miniature cable and connectors. Then, since many emergency applications require the use of devices that can run at higher temperatures, up to 200°C, we began to see the petroleum research and geothermal industry following suit and testing new micro-D connector technology for their applications. In short, squeezing a lot into small spaces is becoming key across the industry and micro-D connector technology must be available to serve that need. The designers are heralding the ruggedized miniature connector as a major solution to a combination of design needs and application-related demands. The trend also includes a need for quick plug-and release connector technology, because users do not want to have to go back to a lab and use additional tools to mate or release a connector.

Increasing complexity of electronic circuitry drives need for connectors As electrical circuit technology and complexity evolves, chip speeds are increasing their data processing rates, current and voltages are being used at lower levels and mixed signal systems are demanded within the same interconnect system. The use of these new circuits with higher and higher circuit speeds are evident nearly everywhere, but are most critical in surveillance cameras and high resolution displays used in portable military applications, space satellites, and ruggedized robotic equipment. Nowadays, miniature electronic modules are moved from the big-box, out through cabling to probes, sensors, and detectors used to deliver a variety of information to the main unit, including video, thermal measurements, shock and guidance. Circuits in mission-critical applications are often placed in harm’s way and must retain the highest reliability and maintain signal integrity even in stressful environments, including high shock and constant vibration of the electronics. Changes in the electronics and the applications have both allowed and demanded significant changes in the systems that connect each electronic module to the main driving system or cable and connectors that assist in interlacing electronic connections from module to module or module to sensors, detectors, cameras, lasers or other data acquisition or data distribution devices. And keep in mind that in many cases the new electronics have to be rugged and reliable, wearable or portable, as well as meet the standards of the system in motion. A number of critical elements have changed in both the application and the design of those interconnection systems that serve the new electronics: • Voltages are somewhat standardized and are significantly lower than previously. • Current levels are dropping to the milliamp levels, compared to older electronic systems. • Space for signal routing has become limited. • Weight of the connector and cable must be reduced to increase service life of the module. • Ruggedness is increasingly significant, especially in airborne and robotized instruments. • Rapid connect and interconnection is often critical in field applications. Industry trends have shown that most cable and connector manufacturers are rapidly tooling smaller interconnect systems to meet the mechanical and physical configurations that can serve the new ruggedized miniature electronics of today. It is important to note that electronic design groups are also pushing new limits in providing faster and more efficient micro-chips. Expanded C-MOS technologies have combined most electronic sub-systems within one chip design. These new chips offer much

higher speed signals, larger memory sections and operate on lower voltages and lower current, which greatly expands battery and field life of the instruments they are supporting.

Analog versus digital signal processing Another interesting trend is that analog signal management is giving way to digital signal processing. Analog signals are not going away and remain very useful in certain level-sense control and modulation circuits, but Figure 1: Variety of connectors used in electronics. they often require larger wire FireWire, or other equivalent. Highly relidiameters and higher voltable signal speeds are being achieved ages. and maintain the high signal integrity as Digital processing seems to be eclipsthey perform in the Gigahertz range on ing many areas of electronic circuit extremely small diameter wire. This trend design and are used from commercial allows the placement of new, unique, communication application, (like cellular electronic products in portable and rugphones), to many high level military ged applications beyond what we have and space technology applications. The previously seen today. advantage of digital signal management An important note about using digiis that it can be routed easily and can be tal signal processing within cabling is dramatically speeded up with lower cost that it is more secure from listening and complexity in the electronics. devices, since the cables can be shielded Many cables use a differential pair and protected way beyond what can be of twisted wires, for example, Apple’s ™

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connectors

electronic products and technology september 2014

RFI shield cans deliver RFI/EMI screening

Figure 2: Latching Micro-D technology.

designed for signal transmission through the airwaves, especially when security and confidential information is involved.

New technology combines advantages of proven design with new trends Micro-D connector technology has been around for generations. A smaller type of connector derived from the D-subminiature or D-sub (named for its D-shaped metal shield), the microminiature D, or micro-D, is about half the length of a D-sub, and has proven to be extremely successful over the last 40 years. Recently, Omnetics developed a new Latching Micro-D to retain the advantages of the popular and proven micro-D design and update it to meet the requirements of smaller and more mobile technologies. These technologies tend to require more frequent module changing and rapid field replacement of systems in places where additional tools may not be available. Digital signals from optical surveillance systems, low voltage differential signals and even lower current power supplies are some of the newer applications taking advantage of the quick-change design opportunities of the new Latching Micro-D connection system (See Figure 2). The new technology is based on the micro-D’s well-established reliability and performance specifications. It also takes advantage of its predictable voltage and current ratings and the fact that it is adaptable for many board-mount, panelmount and wiring configurations and pin counts. The new Latching Micro-D system has three major sections or components. Wired plugs are connected to cables or open wiring that includes optional metal or over-molded back-shells to protect for

Figure 3: Cable types to protect signal intrusion.

electromagnetic interference (EMI), and a strain- relief design that reduces wear on the cable interface to the back shell of the connector. The Latching Micro-D connectors support a wide range of cable types that can include open wiring, jacketed cable sets, and even EMI-shielded braided coverings to protect signal intrusion and/or signal noise from escaping the cable and affecting other circuits (See Figure 3). With the latch design, the cable can be quickly disconnected in a simple squeeze-and-pull motion. An adapter can be added to existing micro-D connectors to allow current instruments to use the latch on cables in their system. The connectors are built with highly rugged and compact designs using aluminum alloy 6061 shells with nickel plating, offering contact counts from 9 to 51 positions. Using a one piece beryllium copper flex pin design, the connectors are plated with nickel/gold for robust service that operates from -55c to +125C, with a special version rated for 200C. The Latching Micro-D’s high reliability, light-weight, rugged, quick-connection system has been used in a number of newer designs for miniaturized equipment designs. Cable systems include braided shields to reduce EMI and cross talk. Adapting to the older jackscrew designs are done by adding a simple ‘latching adapter’ to existing Micro-D connectors. As new electronics are developed for a more portable and rugged environment, the miniature micro-D connectors are being used to fit into many limited capacity and limited weight design applications. Matching cable and wiring systems are ready and can be implemented immediately, without adjustment or design changes. Designers can even use standard solder-cup versions in their own lab for prototype and circuit development. The quick connection features also help speed up the test and analysis process. For more information on connectors from Omnetics Connector Corp., go to http://ept.hotims.com/51127-38

EZ-BoardWare EZ RFI Shield Cans provide improved RFI and EMI protection to sensitive circuitry at the printed circuit board (pcb) level, when used with firm’s EZ-BoardWare RFI Shield Can Clips, Because the cans are mounted by simply pushing them into the surface mount clips, installation costs are minimized since there is no secondary processing required. Devices be easily removed for inspection/repair/ rework with no fear of damage to the pcb. Devices ensure secure can retention, resistant to shock and vibration. HARWIN

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Protective caps boost reliability in next-gen MIL apps ODU AMC protective caps boost protection and function for military applications requiring robust and secure connector solutions. Devices guarantee EMC protection up to 55dB, and trouble-free operation - quietly and reliably. Designed especially for firm’s AMC series connectors, the caps’ mounting satisfies all market requirements and customer wishes. Devices are attached to a 200mm long, fire-proof cable with the help of a dark crimp barrel. The customer can individually and flexibly adjust the other side of the cable to the desired length with the help of a second crimp barrel and a lug. ODU USA http://ept.hotims.com/51127-40

SMA bulkhead jack delivers isolated ground LTI-SASF13REGT-XX Isolated SMA bulkhead jack provides an isolated ground for applications where cable and chassis grounds need to be separated. Product is available for use with RG 316, 188, 174,178, SS405, LMR 100, 1.37 mm, 1.32D, 1.17LL, and 1.13 mm cables. LIGHTHORSE TECHNOLOGIES http://ept.hotims.com/51127-41

Test probe cable assemblies test high frequency circuits Range of low cost co-axial test probe cable assemblies for the inspection of high frequency circuits are suitable for testing Hirose MS-156 and Murata MM8030 sub miniature coaxial switch connectors. Devices provide reliable testing of RF circuits from development thru to final production. For Hirose pcb connectors the test probe cable assemblies have a mating test cycle durability of 500 operations and 2,000 with Murata. Products are suitable for testing high frequency coaxial switches in a manufacturing environment. Standard cable assemblies come with SMA jack connectors for plugging to test equipment; other coaxial interface connectors are available upon request. Customers may specify test probe orientation and cable length to improve ergonomics for operators. GRADCONN

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Low PIM cable jumpers suit PIM apps Series of low PIM cable jumpers with formable coax are suitable for low passive intermodulation (PIM) applications. Products are made using a tin-filled braid that produces a hand formable, solid outer conductor wall, making them perfect for installation into tight places. The RF cables are available with two different coax diameters sizes including 0.163” and 0.276” and connector options include 7/16 DIN, 4.1/9.5 mini-DIN, Type N, and SMA. The robust connectors’ TriMetal plating, soldered connection point and precise coaxial cable construction produce reliable low PIM performance for the life of the assembly. PASTERNACK ENTERPRISES http://ept.hotims.com/51127-43

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A world leader in backplane power interconnects

Fifteen years ago, the Positronic PCIH47 connector (above) was selected as the standard power interface connector for CompactPCI® applications. Years later the Positronic VPB connector was chosen as the dedicated power interface for AdvancedTCA® applications. Today Positronic continues to lead the pack with its wide variety of power connector solutions for all types of applications. Visit www.connectpositronic.com/products/power to survey our available products. You can also visit www.posishop.com to purchase products for next-day delivery.

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connectors

electronic products and technology september 2014

Panel feed thru terminal blocks add versatility MPT series panel feed thru terminal blocks are versatile enough to be used in a variety power distribution and terminal applications. Devices provide power handling ranges from 24A/450V to 150 A/1000V, and can accept wire ranges from 14 to 1 AWG stranded and 12 to 2 AWG solid among 7 different sizes. Product’s modular design allows any number of positions to be easily assembled on the line or in the field as each position interlocks together providing seamless modular construction side by side or stackable. This configuration for panel mount design features a through-hole design allowing a terminal feed through the panel. Mounting of the block can be with either a snap-on wedge or knurled nut to secure the block. BLOCKMASTER ELECTRONICS http://ept.hotims.com/51127-44

Low-PIM cable assemblies, adapters support system integrators SRX engineered suite of low-PIM cable assemblies and adapters support system integrators and are suitable for wireless and communication applications. Several different deployment scenarios encompassing cabinet integration, short cable runs or jumper applications, long haul cable runs, indoor use, outdoor use, riser and plenum environments, have been accommodated for and include interconnect options for SMA, N, 7/16, TNC and now the mini-DIN 4.1/9.5 mating. Devices meet the most critical requirements when it comes to attenuation, VSWR and intermodulation strength and can stand up to extreme environments due to their robust brass bodies and Albaloy plating. The mini-DINs are available as within-series adapters (mini-DIN to mini-DIN) as well as between-series adapters with Type N, SMA and 7/16 DIN connectors. SAN-TRON http://ept.hotims.com/51127-47

High frequency SSMA connector withstands high vibration

Shrink insulated connectors solder upon heating

u2019s high frequency SSMA connector with floating body and pin allow both axial and radial movement while maintaining electrical performance to 26Ghz. Device’s pin movement is independent of the body, to meet needs of high vibration applications. Custom spring designs of Elgiloy CobaltChromium-nickel non-magnetic alloy were utilized for the body and contact movements. Product’s body components are manufactured of machined 303 stainless steel and the contact of beryllium copper with MIL-STD gold plating. AVIEL ELECTRONICS

76-HISBC series heat shrink insulated solder butt connectors, once heated, dispense solder to the wires being joined via an internal fluxed solder ring, establishing a reliable connection. No crimping is required. Devices can be used in automotive, industrial and any other applications where joining wires is needed. Products come in bulk, 10pc packs and 50 and 100pc re-sealable bags. Devices are rated for 1,000 volts and 125C with a 2:1 shrink ratio. NTE http://ept.hotims.com/51127-48

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Discrete wire IDC components deliver high reliability 2mm (.0787”) pitch discrete wire IDC system is suitable for a high reliability connection and ease of discrete wire termination in field applications. Available as an IDC connector only, the system eliminates the expense and need for special tooling, as well as any additional cost to purchase and inventory separate parts including bodies, contacts. Product includes a cable socket connector (I2SS Series) and a mating board level header (T2I Series). The cable socket connector is available in 2, 3, 4 or 5 positions and accepts 24 AWG discrete wires, which are held in place by the connector and then terminated with standard flat jaw pliers. SAMTEC http://ept.hotims.com/51127-46

Wire-to-board connector delivers wide range of mechanical options CLIK-Mate 1.50mm wire-to-board connector system comes in a variety of circuit sizes, mounting styles and wire gauges to meet next-generation power and signal needs. Product family includes a bottom-entry version, providing capabilities for multiple applications that require the mating configuration to come from underneath. Devices provide approximately a 30% smaller footprint and mating assurance with several design features including dual inner positive locks with an audible click, a user-friendly thumb-latch for easy insertion/extraction and windows that provide visual confirmation of locking. MOLEX

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Low-loss, flexible cables outperform semi-rigid Flexible cable assemblies outperform semi-rigid cable performance by combining advanced coaxial cable and proprietary VP90 expanded PTFE (ePTFE) extrusion technologies. Firm manufactures highly phase-stable, low-loss interconnect solutions for a wide variety of applications. Coaxial cable sizes range from 16-52AWG, with most cables exhibiting insertion losses of less than 1.00db per foot with little to no phase change. Manufacturing process ranges from sophisticated conductor and applied material extrusion, to dielectric material integration and semi-automated micro-miniature termination. HIGH SPEED INTERCONNECTS

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connectors

electronic products and technology september 2014

Coaxial termination suits demanding environments

Components facilitate connector’s deployment

AMCOL-1-T medium-power coaxial termination safely absorbs RF signals in the frequency range 10-100MHz and is fitted with a TNC male connector incorporating a coarse-ribbed M27-threaded collar to ensure secure mechanical attachment. Equipped with an anodised aluminium heatsink to ensure optimum thermal dissipation, device has overall dimensions of 125 (L) x 40 (D) mm. Product is suitable for use in HF and VHF systems that are deployed in demanding environments where installation and maintenance may be carried out with gloved hands. LINK MICROTEK

Complementary har-speed M12 X-Code connector components include straight and angled pcb receptacles and M12-to-RJ45 panel adaptors, as well as an M12 gender changer. Devices expand the deployment capabilities of har-speed M12 X-Code connectors. Devices have been developed to facilitate 6A Gigabit Ethernet installations increasingly common in machine and plant automation. The straight and angled receptacles and adaptors meet the requirements for Cat 6A and Performance Class EA, with maximum transfer rates for 1/10 Gigabits. Products are effective additions for the 8-wire Ethernet environment or for transferring signals. A mounting bracket also is offered for the M12 X-Code gender changer. HARTING

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Next gen phase adjustable connector boosts performance SMA Phase Adjustable connector boosts electrical performance. Just trim the cable, plug it in and solder to the connector body. Devices deliver a means of phase adjustment over frequency ranges up to 18GHz. The high-perfomance device has an adjustment range of more than 180 degrees and a maximum VSWR of 1.30:1. The (male) direct solder device is suited for RG402 (0.141” semi-rigid) or firm’s ultra-flex and blue-flex cables. COAXICOM http://ept.hotims.com/51127-52

Single pogo pin BtB contacts come in 5 heights 70-9150 Series of single pogo pin board-to-board (BtB) contacts are available in five standard compressed stacking heights spanning 2.0mm to 5.0mm –the maximum working range and compressed height tolerance possible in a miniature 1.5mm diameter plunger. Devices enable design flexibility with regard to pin count and placement location, featuring gold plating for high reliability and signal integrity and a high force stainless steel spring - delivering up to 10,000 cycles. Contacts are rated for operating temperatures spanning -40C to +125C and 1A current. AVX http://ept.hotims.com/51127-54

Place and Play Bluetooth® Low Energy Module

LSZH power cords available off-the-shelf

With a 5mA Current Consumption The PAN1740 Series is Panasonic’s next generation “nanopower” Bluetooth Low Energy module with reduced form factor, significantly lower power consumption, embedded BLE stack and profile. The 9.0 x 9.5 x 1.8 mm footprint of the PAN1740 Series makes it one of the smallest BLE modules available.

Low smoke zero halogen (LSZH) jacketed (C13 to N5-15) North American power cords are suitable for applications where it is critical to protect people and equipment from toxic smoke and corrosive gasses and where PVC cannot be used. LSZH is commonly used in many aerospace applications, especially in sealed aircraft environments and electric boats (submarines). Products are available off-the-shelf in two and three meter lengths and are available in 14, 16 and 18AWG versions. Custom length options are also available with a 1,000 piece minimum order quantity and a 10 to 12 week lead time. L-COM GLOBAL

WIRELESS CONNECTIVITY

ASQM1 Series Turquoise Stroke Switch

Miniature IP67 Stroke Switch with High Reliability Panasonic’s new ASQM1 Series is 45% smaller than conventional products, allowing for usage in smaller spaces. Features a sliding contact structure for silent actuation and high contact reliability, the ASQM1 Series is perfect for low level load switching. The IP67 rated enclosure ensures stable operation.

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3-way connector boosts reliability

ELECTROMECHANICAL

DEUTSCH Autosport Heavy Duty (ASHD) 3-Way Connector eases application in three-phase motor/generator systems, while fills the gap between existing ASHD 2- and 4-way connectors and uses the same shell. Device has three 4 AWG power contacts with 200 A current-handling capacity and two data contacts for safety loop solutions to help allow safe handling. Product also accommodates 16mm2, 25mm2 and 35mm2 wire diameters. TE CONNECTIVITY

Tough Contact Connectors

F4S, F4, P4S and P5K Series Constructed for high reliability in various environments, the F4S, F4, P4S, and P5K Series employ the unique “Tough Contact” which has significant ability to withstand foreign particles and is highly resistant to shock. It is indispensable to all compact mobile devices.

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High Resolution LED Matrix Driver

Panasonic brings strategic innovations to our customers’ product development process. We provide the technology and engineering resources to enable manufacturers to plan and build world-class solutions to meet their customer needs.

AN3x Series Panasonic’s new AN3x Series is a single chip solution which can drive from 3 to 288 single color LEDs or from 1 to 96 RBD LEDs. With automatic LED lighting effect control over an I2C/SPI interface, it’s easy to implement special light effects with minimum software control.

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Non-metallic electrical plugs resist corrosion Appleton Powertite family of industrial plugs, receptacles and connectors provide 30 Amp and 60 Amp non-metallic, corrosive-resistant plugs for use with all UL 1686-C1 receptacles (this is the industry standard for metal shell devices). Product’s impact-modified PBT polyester housing resists corrosion, deformation and cracking, while UV-stabilization helps prevent degradation due to sun exposure. A dual-molded locking ring features rigid plastic threads on the inside and a rubberized grip on the outside. EMERSON http://ept.hotims.com/51127-57

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electronic products and technology september 2014

Embedded Systems & Engineering Computers SOM solution speeds embedded systems development

Middleware solution eases IoT development X-Ware integrated, optimized, comprehensive middleware solution provides a foundation for Internet of Things (IoT) development. Product consists of firm’s ThreadX RTOS and its middleware offerings of FileX, NetX, NetX Duo, USBX, GUIX, GUIX Studio and TraceX. Together, it delivers all that’s needed for embedded systems to meet the functional and usability requirements of IoT devices. Delivering peak performance and minimal footprint, all X-Ware components can be used in IoT devices that require a graphical user interface, high-speed networking, USB capability, a file system, and an RTOS. EXPRESS LOGIC

NI SOM (system on module) complete middleware solution combines the Xilinx Zynq All Programmable system on a chip (SoC) with supporting components such as memory on a small pcb and provides ready-to-go Linux-based real-time operating system (RTOS) already integrated. Product provides customizability of a SOM without the increased time and risk of developing custom software. NATIONAL INSTRUMENTS

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Windows-based tool broadens interface support, enables use with IoT devices uC/Probe Graphical Live Watch V3.3. uC/Probe is a Windowsbased tool that allows engineers to graphically visualize and change the behavior of embedded systems at run-time. Product is a completely agnostic tool that can be used with or without other Micrium software and on virtually any CPU/MCU. Product includes an interface to Cypress PSoC4 and PSoC5 interface, as well as a CMSISDAP interface; a debug unit to connect to the CoreSight Debug Access Port. MICRIUM http://ept.hotims.com/51127-59

Compact rugged module integrates high performance computing CB70C high performance Intel Core i7-based Rugged COM Express module is suitable for robust, mission-critical operations. Product’s VITA 59 RCE design provides state-of-the-art PC technology in a rugged small form factor with scalable performance using 1, 2 or 4 processing cores, depending on system requirements. Product provides a number of I/O interfaces including PCI Express, LVDS, DDI, VGA, HD audio, SATA, Ethernet and USB for exceptional flexibility in system design. The board boasts up to 16GB of directly soldered main memory and supports other memory like USB Flash on the carrier board. MEN MICRO http://ept.hotims.com/51127-62

Software update combines ease of use with functionality 5.0 version of EXLab Software Suite for Mechanical Data Acquisition eliminates software learning curves while providing the many capabilities users have come to expect from VTI products. The ‘setup and run’ turn-key software is a complete solution for static data acquisition purposes when combined with firm’s SentinelEX precision measurement instrumentation. Product provides a remote client architecture that allows multiple users to have access to the displays and data across a test facility. Version 5.0 adds support of the EMX series of modular Dynamic Signal Analysis (DSA) products, with an Ethernet based communications interface that facilitates distributed measurement architectures. VTI INSTRUMENTS

MicroTCA chassis platform maximizes computing density with full redundancy 1U MicroTCA chassis platform allows more slots in a front-to-rear cooled solution while maintaining full redundancy. Product employs several design concepts to maximize computing density. Offering front-to-rear cooling and full redundancy takes up slot space. Product combines the fan trays and power supplies on the rear of the chassis, allowing 6 AMC slots in the single module size. Unit provides dual integrated shelf managers on the 1U chassis platform. The mezzanine approach of the shelf managers allow the company to provide various front panel I/O options in a compact dedicated space. The six AMC slots are divided among two sets of three slots for full redundancy options with failover. VADATECH

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electronic products and technology september 2014

Switches & Circuit Protection

Doing more with less drives miniaturization of next generation electronic components By John Beigel, Standex-Meder Electronics

Doing more with less is the mantra of our era. Nowhere is this more apparent than in the drive towards miniaturization in the next generation of electronic components and systems. The push for smaller parts is coming both from the need for smaller assemblies that can be used in specific applications as well as the need to reduce material costs by making smaller parts that can work as well as larger parts. One key area where this trend is playing out is with reed sensors and planar transformers, where new manufacturing techniques are pushing the limits of smaller, faster, and cheaper.

Without question, aerospace and space exploration was the initial driver towards miniaturization – electronic components in rockets and controls had to be smaller and lighter as they left our atmosphere. The advent of the semiconductor industry and the move towards integrated circuits was the next driver and today thousands of transistors exist on a single micron of space. As we started placing semiconductors on printed circuit boards (pcbs), passive components were just too large to fit, looming up like skyscrapers.

It became obvious that all passive components, including reed switches, reed sensors, reed relays, transformers, resistors, capacitors and inductors, also had to be reduced in size. Next in line was the medical industry, which developed more and more ‘invasive’ products for placement inside the body. These required ultra-reliable, very small components that use minimal power so the products don’t have to be removed frequently for battery replacement. Last, but definitely not least, is the consumer

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trend towards compact, portable, smarter devices that work faster. Let’s dive deeper into just how miniaturization affects two important passive components, reed sensors and planar transformers.

Reed sensors The reed sensor is a simple device, composed of a hermetically sealed, twoleaded (or three-leaded) reed switch. The leads are ferromagnetic and react to each other by closing when confronted by a magnetic field in its sphere of influence. When a magnet is brought close enough to the reed sensor, the contacts will close. When the magnet is withdrawn, the contacts open. The reed sensor requires no external circuitry and can switch loads directly. Importantly, reed sensors do not draw any current in the off state as do semiconductor sensors. The heart of a reed sensor is the reed switch. Because reed switches are hermetically sealed (with a glass to metal seal) they are impervious to almost all environments. The typical reed switch used to be about 25 millimeters long, but they are now down to less than 4 mm. The availability of extremely small electromagnetic, hermetically sealed switches is clearly driving more and more applications. At the same time, advancements in contact materials and construction have led to the ability of these smaller reed switches to maintain the contact ratings of their big brothers, at least in some cases. In the electronic/ semiconductor equipment testing market, the small size

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of reed switches makes them ideal for incorporating into reed relays that can pass extremely fast digital pulses and high frequencies. Semiconductors have to be able to process digital pulses in the order of billions of times per second and reed relays do this in an efficient manner with minimal signal loss.

Planar transformers Planar transformers are designed for a very flat low profile, minimizing component height. To accomplish this, designers have eliminated the traditional copper wound coil approach, and replaced it with a laminar approach that uses multiple printed circuit boards stacked together. These planar transformers can be through-hole or surface-mounted, and they satisfy requirements for low-profile applications where height is critical. Planar transformers are steadily replacing traditional wire-wound transformers when they are more efficient and enhanced electrical capacity is needed. A real advancement in transformer design, compact high power density planar transformers are typically 30% of the volume and weight of traditional wire-wound transformers. This reduction in size from a bulky part eliminates many design constraints. Rather than the traditional transformer’s turns of copper windings, in a planar transformer spiral patterns are etched on a printed circuit board. The planar design allow more efficient transformers because it uses flat rather than round conductors, so the conductors are always closer to the transformer core material. The magnetic circuit existing between the core and the conductors is more efficient with lower losses, which improves the transformer design. A planar transformer can handle more power than a wound transformer of the same size and weight, so planar transformers reduce the space the transformer requires in the end product. Planar transformers provide more flexibility in how designers choose to process power. One key to their use is proper design of the planar transformer. There are a great number of subtleties in design that need to be detailed to ensure that the planar transformer provides repeatable inductance from one component to another. With a traditional transformer, layers will vary, but a planar transformer is more exacting; particularly when using precisely stamped or etched lead frames that can be easily and accurately layered together in a mechanized automatic format. It is critical that the mechanical and thermal designs for planar transformers include precise electrical characteristics like capacitance, output and aspect ratio.

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electronic products and technology september 2014

Wireless Designs

Standardizing high-speed serial interfaces to manage EMI By Earl McCune and Peter Lefkin, on behalf of MIPI Alliance

Introduction Standardization committees are responsible for managing electromagnetic interference (EMI) from interfaces into products that use them. Data rates currently used in high speed serial interfaces exceed many of the operating frequencies used for wireless mobile communication in devices such as smartphones and tablet computers. Careful design is needed in the interface to manage the local electromagnetic radiation from the interface so that interference with any and all local radios is avoided. The most important techniques for managing EMI from high speed digital interfaces are discussed, showing how each contributes toward solving EMI issues. For any mobile communication device to be successful, all intentional wireless communication signals must not be affected by any radio signals that other circuitry generates unintentionally, and also that the intentional radio signals must not affect the operation of any other circuitry. This is the principle

of Mutual Transparency: all components within any mobile communication device coexist while performing their tasks, unaffected by any mutual interference. The operation of any circuit is transparent – meaning not interfering – to the operation of any other circuit. Electromagnetic interference (EMI) problems arise when the mobile device must communicate with remote networks, because the data rates used in modern high speed serial (HSS) interfaces often exceed the wireless communication frequencies used in mobile wireless communications radios. Specification development committees must pay particular attention to EMI issues, both from the interface operation within the mobile device, and from radio signal coupling into the interface. This responsibility falls onto specification committees because even though the interface might work very well on its own, any interface that is either vulnerable to external interference, or that is noisy to other circuitry, will not provide functioning products. MIPI® Alliance has developed two specifications that pay very close

attention to meeting Mutual Transparency, directly supporting the success of mobile products that adopt these interfaces. Science tells us that whenever electrons are moved around, that radio signals will always be generated. These unintentional radio signals are not desired, so they must be managed at design time to minimize their possibility of becoming electromagnetic interference (EMI). Techniques available to manage EMI at specification development time include • Signal amplitude • Physical Isolation • Data Rate • Skew and balance • Slew Rate control, and • Waveform Shaping. These techniques all have different impacts on interface EMI behavior, and are each discussed below.

when the signal amplitude is cut in half, the corresponding EMI drops by only 6dB. While this may be enough to get out of an EMI problem which is close to a regulatory limit, cutting the interface signal in half also reduces the receiver operating margin which will lead to errors in interface communication. One of the more obvious techniques to keep EMI contained is to improve physical isolation. Once a radio signal exists, if it can be kept close to where it is generated, then it will not bother anything else. At cellular or wireless LAN frequencies, physical isolation is never perfect and practical isolation values vary between 20 to 40dB. Realizing this isolation within the product design is usually essential to solving EMI problems. Careful measurement of isolation provided by IC packages and PC layouts is extremely important in the design process.

Signal amplitude

Data rate variation

It is obvious that reducing the interface signal amplitude does lower EMI, however is does so very slowly. This technique is best left as a last resort because

When one examines the spectrum of the unintentional radio signal from a high continued on page 20

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wireless designs

electronic products and technology september 2014

Standardizing high-speed serial interfaces continued from page 18

speed serial digital interface has distinct properties. From an EMI perspective the most important property is the presence of a spectral null at the data rate and all of its integer multiples. Even if the interface signal is filtered, these spectral nulls will still exist. This is fortunate, because the standardization committee can then choose to allow a change to the interface data rate which can move a spectral null close to a radio receiver band to remove EMI from the interface into the receiver. This technique comes with no cost increase because no filtering components are necessary to realize this improvement. Applying this technique is particularly important for GPS receivers, which must work from extremely tiny signals arriving from multiple orbiting satellites. The balance of a differential signal refers to the amplitude matching of its

two components. Skew refers to any time shift between the two components of a differential signal. These characteristics are largely set by the interface driver circuitry, and are best analyzed together. When signal balance is within 10% of perfect, the effect of signal balance is negligible compared to the EMI impact from skew. From an EMI point of view, then, it is far more important to minimize skew than to be concerned with amplitude balance when designing interface driver circuits.

Slew rate The bandwidth out to the first spectral null, known as the first spectral lobe, contains all of the information that the interface carries. The presence of additional spectral lobes at higher frequencies, called spectral sidelobes, represent information

about the interfaceâ&#x20AC;&#x2122;s waveform transitions and not additional information about the data itself. If any EMI is caused from energy in these higher frequency sidelobes, it is possible to suppress this interference by slowing down the waveform transition time, or reducing the transition slew rate. This sets up a trade-off, between the speed of the interface waveform transition vs. the amount of high frequency EMI caused by the interface signals. As long as the interface â&#x20AC;&#x2DC;eyeâ&#x20AC;&#x2122; stays open in the middle of the unit interval, it is advantageous to use the slowest slew rate from an EMI perspective. Using Slew rate control on the interface signal has a negligible effect on the main spectral lobe. This is because slew rate control only reduces magnitude of the higher frequency sidelobes. This is both good and bad: it is good because slew rate control does not reduce the data content and it is bad if the frequency of interference is coming from the mainlobe because then any slew rate manipulation is ineffective from an EMI perspective. For this reason the MIPI Alliance DigRFSM

committee, when addressing higher data rate requirements, selected the preference to use multiple lanes of M-PHY with each lane running at lower data rates, instead of using one M-PHY lane operating at a higher data rate. The shape of the waveform transition also has an impact on the EMI properties of the interface. For example, one straightforward way to implement slew rate control is to vary the current source values used for charging and discharging capacitances along the interface connections. Ideally this provides straight-line transitions. Other waveform shapes also impact EMI values, some for better and some for worse. When all sharp corners are removed from the interface waveform, the spectral containment is greatly improved. Eliminating all sharp corners from the interface waveform, referred to as waveform curvature limiting, is the objective of waveform shaping.

Combined techniques Good EMI management techniques all begin with maximizing the physical isolation of the application. Once good isolation performance is achieved additional techniques can be used as necessary, depending on the particular issues encountered by the interface standardization committee. Two examples from published MIPI standards are presented below. The MIPI Alliance M-PHY specification is a HSS link that uses differential signaling with small amplitudes. Because M-PHY interface data rates are higher than many cellular communication frequencies, a combination of data rate selection, slew rate control, and bounds on skew are used to reduce EMI present at the input of internal radio receivers. The RFFE interface Working Group within the MIPI Alliance has different issues to address, and uses different techniques to manage the EMI from that interface. Single-ended signal waveforms with large amplitude are needed by the RFFE application, which causes additional EMI problems because this interface operates very close to sensitive radio inputs. In this case the RFFE Working Group adopted a technique combination where the lowest data rate is used that is consistent with the interface communication needs. Curvature control is then used on the interface waveform to insure that any EMI is suppressed below the operating frequencies used by the internal wireless communications.

Summary Managing EMI through actions of specification committees and working groups by design is an important component to achieving Mutual Transparency between interfaces and wireless communications links which are both present in mobile devices. The MIPI Alliance is a leader in recognizing this need and implementing it in interfaces used within mobile devices. Learning which EMI mitigation techniques are either very effective, or not so effective, in establishing Mutual Transparency is an important result from deliberations within the MIPI Alliance M-PHY and RFFE interface working groups during specification development. Allowing selection of the interface data rate from a small list is a technique that does not require filtering and can provide spectrally local EMI suppression. Placement of spectral nulls near frequency bands of concern is an extremely effective EMI suppression technique. This weakest technique to reduce EMI is lowering the amplitude of the interface waveform. *Editors Note: For the full version of this article, including 10 corresponding charts and illustrations, visit www.ept. ca website under Feature Stories in the News archive. For more information on the mobile device industry from MIPI Allicance, go to http://mipi.org/ http://ept.hotims.com/51127-20

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ProductSource

electronic products and technology • september 2014

product source feature product source feature product source feature

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SureCall Fusion5 Cellular Booster Kit The Fusion5 is a cellular booster solution that’s ideal for home and office for use where reception is weak due to distance from towers, the topography, building materials or structural design. Built to combine PCS and Cellular dual bands with both LTE and AWS frequencies for all major carriers.

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ADVERTISERS’ INDEX Advanced Interconnections . . . . . . . . . . . . . . . . . . 22 Allied Electronics, Inc . . . . . . . . . . . . . . . . . . . . . . . 19 Avnet EM (AZ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 B&E Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Bivar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Carling Technologies Inc. . . . . . . . . . . . . . . . . . . . . . 16 Creative Global Services . . . . . . . . . . . . . . . . . . . . . 22 Digi-Key Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 EMX Enterprises Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Fluke Electronics . . . . . . . . . . . . . . . . . . . . . . . . . 3, 22 GAP Wireless . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Hammond Mfg. Co. . . . . . . . . . . . . . . . . . . . . . . . . . IBC Harting Inc of North America . . . . . . . . . . . . . . . . . . .8 J-Squared Technologies . . . . . . . . . . . . . . . . . . . . . 14 Keysight Technologies . . . . . . . . . . . . . . . . 12-13, OBC Komax Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LPKF Laser & Electronics . . . . . . . . . . . . . . . . . . . . . 18 Master Bond . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 MPS Industries . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Murata Americas . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ODU USA Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Orion Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Otto Engineering . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Panasonic Industrial Devices Sales Co. of America . . 10 Positronic Industries, Inc. . . . . . . . . . . . . . . . . . . . . . 7 Protocase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Sager Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Schleuniger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Sealcon USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 TDK- Lambda Americas Inc. . . . . . . . . . . . . . . . . . . . 20

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2043AS_3x2.25.indd 1

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7/8/14 9:37 PM

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Enclosures conform to standard DIN, or fix to wall Italtronic Modulbox Compact XTS line of enclosures is composed of 24 kits, including units divided into three versions called A, B and C. Products can be hooked on the GUIDE EN 60715 (made in conformity with standard DIN 38880) or it can be fixed to the wall. Kit height is reduced to about 32mm and can be equipped with the same electronic boards arranged on the base, or fitted with a second board closer to the top of the enclosure using spacers or pins. Versions A or B permit the use of terminal covers (and of terminals for printed circuit) on one side of the enclosure, on two sides or on none. CONNECTOR SOLUTIONS http://ept.hotims.com/51127-66

Software test suite boosts power amplifier efficiency N7614B Signal Studio for Power Amplifier (PA) Test; an all-in-one, general-purpose test software suite improves PA efficiency through support for crest factor reduction (CFR), envelope tracking (ET) and digital pre-distortion (DPD) technologies. Product supports firm’s general-purpose MXG, EXG and ESG vector signal generators; PXA, MXA and EXA signal analyzers, and 33522B and 33622A arbitrary waveform generators. Software also supports API programming, enabling it to be easily integrated into a customized PA test system. KEYSIGHT TECHNOLOGIES http://ept.hotims.com/51127-67

50W power supply delivers five year warranty 50W model joins five-year warranty RWS-B series of ac-dc power supplies that includes five power levels and compact case sizes, including 100, 150, 300 and 600W. Operating from a universal input of 47-63Hz, 85-265Vac (300Vac for 5 seconds), unit is available with nominal outputs of 5, 12, 24 and 48Vdc with an adjustment range of a minimum of +/-10%. The convection cooled 50W models operate from -10C to 70C with derating above 40C. TDK-LAMBDA http://ept.hotims.com/51127-68

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A MARKET LEADER IN DATA ACQUISITION SWITCH UNITS (DAQs) Keysight’s 34970A/72A DAQs empower you to gather a wider range of measurements with greater efciency and precision. Built-in signal conditioning provides more measurement capabilities while noise reduction offers even greater signal delity. And BenchLink Data Logger software allows you to scan, monitor, control and analyze your data so you can quickly act on it. With these features, it’s no surprise that these DAQs continue to be the number one choice of engineers everywhere.

34970A and 34972A Data Acquisition Switch Units 61/2 digit (22 (22-bit) bit) with ultra-low ultra low reading noise (140 (140dBCMRR) dB CMRR) Measure up to 60 differential channels and 300 volts Built-in signal conditioning measures 11 functions Up to 32 MB readings of non-volatile USB memory

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