HIGH TEMPERA TURE MA TERIA LSFOR ELECTRICAL l STRUCTURAL l INDUSTRIAL l MEDICAL APPLICATIONS TO 4000ºF Flexible Conductive Silver Based Epoxy Duralco™ 1 2 5 thermally conductive electrical epoxy bonds to most metals, ceramics and plastics to form a stress-free adhesive bond. Continuous service up to 4 5 0 ºF.
High Temperature Low Expansion Adhesive Resbond™ 9 0 5 Quartz is formulated for bonding low expansion and thermal shock resistant ceramics. Ideal for electronic and metallurgical applications to 2 5 0 0 ºF.
Thermally Conductive Adhesives Duralco™ 1 3 2 thermally conductive adhesives combine Cotronics’ unique, high temperature resins with highly conductive fillers to form thermally conductive, adhesive bonds with continuous service up to 5 0 0 ºF.
High Expansion Adhesive Thermeez™ 7 0 3 0 bonds and protects to 1 8 0 0 ºF. Apply to ceramics, ceramic cloths, door and tadpole gaskets and metals. Excellent adhesion to steel, stainless, aluminum, lead and ceramics.
High Purity, Alumina Adhesive Protects CriticalElectronic Components Resbond™ 9 8 9 offers continuous protection to 3 0 0 0 ºF. Apply directly to metals, glass, ceramics, graphite and silicon carbide. Provides high bond strength and excellent electrical, moisture, chemical and solvent resistance for bonding and sealing.
You have challenging applications… we have solutions! High Temperatu re Produ cts Since 1 9 7 1
COTRONICS C O R P.
1 3 1 4 7 th Street, Brooklyn , New York 1 1 2 3 2
Call: 718.788.5533 Fax: 718.788.5538 Email: sales@cotronics.com Web: www.cotronics.com
TECH SUPPORT I CUSTOM FORMULATIONS I QUALITY PRODUCTS