GRD Journals- Global Research and Development Journal for Engineering | Volume 2 | Issue 5 | April 2017 ISSN: 2455-5703
Schematic Design and Layout of Digital Circuits using CMOS Technology: A Literature Survey Sana Ur Rahman Department of Electronics and Communication Engineering Integral University, Lucknow, INDIA
Tarana Afrin Chandel Department of Electronics and Communication Engineering Integral University, Lucknow, INDIA
Abstract The various digital electronic circuits like Microprocessors, Registers, and Memory modules are using flip flop as a basic unit for providing the proper processing of applications or working. This paper describes in detail about the importance of Flip Flops, and its layout design using CMOS technology. Using CMOS technology we can enhance the speed and reduce power consumption .There is various research works had been carried out throughout the world. Thus in this paper we are going through various steps as well as looking for various technology details in order to full fill our research work. Keywords- CMOS Technology, Digital Circuits, Tanner EDA, Flip Flop, Low Power
I. INTRODUCTION To design high performance VLSI chip, the impact on the design time and design cost has significant to choose backend methodology. Latches and flip-flop have a direct impact on power consumption and design of VLSI systems. So many flip-flop topologies were designed for some dedicated applications. A Flip-flop is a digital electronic circuit that stores a logical state of one or more data input signals in response to a clock pulse. Schematic Design phase is early in the design process. Schematic designs establishes the general scope, conceptual ideas the scale and relationship of the various program element. A Flip-flop is an edge triggered and only changes its state when a control signal goes low to high or high to low. As transistors used have small area and low power consumption, they can be used in various applications like digital VLSI clocking system, registers, buffer, microprocessors etc. There are various technologies to analyses Flip-flop. These technologies are 180nm, 90nm and 65nm and 45nm technologies. When the technology is scale decreases then the leakage power increases which can be reduced by using multi threshold technology and we can compare the designed flip-flop and latches in terms of Power consumption, propagating delays and power dissipation product using EDA tanner tool or DSCH micro wind tool.
II. RELATED WORK DESIGN OF A LOW POWER FLIP-FLOP USING CMOS DEEP SUBMICRON TECHNOLOGY is analysed by B.CHINNARAO et.al in 2012 [1] When the technology scale is decreases then the leakage power increases which can be reduced by using many techniques. In this paper submicron technology is used. Thereby comparison of different conventional flip flops, latches and TSPC flip-flop in terms of power consumption, propagation delays and product of power consumption and when technology scale is decreases then power dissipation increases and propagation delay decreases. Among these TSPC FF is having least power delay product; therefore its performance is best. Furthermore, it can be used in various applications like level converters, microprocessors, clocking systems counters and others. Design of a Low Power Flip-Flop Using MTCMOS Technique proposed by C.H .DayaSagar in 2012 [2], transistors uses small area and low power consumption, so they can be used in various applications like digital VLSI clocking system buffers, registers, microprocessors etc.[3].In this paper the Flip-Flops are analyzed at 90nm, 70nm and 50nm technologies. As the technology scale is decreases then the leakage power increases, which is reduced by using MTCMOS technique. In this paper the designed Flip-Flops and Latches are compared in terms of power consumption, propagation delays and power dissipation product using DSCH and Micro wind tools on various technology. In digital CMOS circuits, there are three sources of power dissipation, the first one is due to signal transition, the second one comes from short circuit current which flows directly from supply to ground terminal and the last one is due to leakage currents. As technology scale is decreases the short circuit power becomes comparable to dynamic power dissipation. Furthermore, the leakage power also becomes highly significant. High leakage current is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length and gate oxide thickness are reduced. MTCMOS is one of the most important low power technique which successfully reduces the leakage power. Design of Flip-Flops for High Performance VLSI Applications using Deep Submicron CMOS Technology is presented by Rishikesh V. Tambat in2014[3] In this paper the Flip-Flops are analyzed at 90nm technologies. The designed Flip-Flops and Latches are related in terms of its area, transistor count, power dissipation and propagation delay using DSCH and Micro wind tools. As chip manufacturing technology is abruptly on the threshold of major evaluation. This technology shrinks chip in size and
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Schematic Design and Layout of Digital Circuits using CMOS Technology: A Literature Survey (GRDJE/ Volume 2 / Issue 5 / 020)
performance is implemented in layout level which develops the low power consumption chip using recent CMOS micron layout tools. In this project proposes low power and high speed design of flip flops in which True Single Phase Clocking (TSPC) and C2CMOS flip flop are compared with existing flip flop topologies in term of its area, transistor count, power dissipation, propagation delay, parasitic values with the simulation results in micro wind on 90 nm technology. Flip-flops are frequently used in computational circuits to operate in selected sequences during recurring clock intervals. Following are most high performance flip flops. 1) Single Edge-Triggered Flip-Flop (SET) 2) Double Edge-Triggered Flip-Flop (DET) 3) True Single-Phase-Clock Flip-Flop(TSPC) 4) Clocked CMOS Flip-Flop (C2CMOS) Pratiksha Gupta in 2016 worked on Low Power Design of SR Flip Flop Using 45nm Technology [4], the speedy technical trends are engrossing to decrease the geometrical feature size and power consumption of the integrated circuit in VLSI styles. During this paper the expected style shows the comparison with usual CMOS circuit on of power the idea of consumption and propagation delay and might save essential size of the ability and enhance the speed. So during this paper expected style is more optimized than the usual CMOS style as a result of the efforts have done to use the minimum power throughout schematic designing. The circuits are simulated at transistor level victimization Cadence Virtuoso Tool at 45 nm technology. The acceptable high quality of flip-flop topologies is an significant step within the kind of VLSI integrated circuits for high-speed and higher performance CMOS circuits. Understanding the essential of flip-flops and selecting the most effective topology for a given application is an important criterion to fulfil the necessity of style to satisfy low power and greater circuit. Specially, the comparison strategy includes the circuit operation, simulation setup, parasitic estimation, area estimation and power dissipation estimation. Low Voltage and Low Power Divide-By-2/3 Counter Design Using Pass Transistor Logic Circuit Technique by YinTsung Hwang [5] A true-single-phase-clock (TSPC) completely based divide-by-2/3 counter tends to provides low voltage and low power consumption applications are discussed in this paper. By engaging a wired OR scheme; just one semiconductor unit (transistor) is required to implement each the counting logic and therefore the mode selection control. This may enhance the operating frequency of the counter due to a important reduced path between the E-TSPC flip flops (FFs). Since the amount of semiconductor unit (transistor) stacking between the power rails is unbroken at simply two, the expected style is belongings to low operations. For the power saving purpose simulation results show that compared with two classic E-TSPC primarily based styles in 0.18µm method technology, the maximum amount is 16.4% operative speed and 39 in power-delay-product may be achieved by the expected style . High speed divide-by (–N) ÷ (N+1) counter (also referred to as presale) may be a basic module for frequency synthesizers. Its style is crucial due to it operates at the next frequency and consumes higher power consumption. This is often not just limits the most in operation frequency and current-drive capabilities, however conjointly will increase the entire power consumption.
III. CONCLUSION During our research we have gone through enormous number of work done by expert designers or engineers. By using their views, data and work now we are moving ahead for designing the circuit for our research work. We will use Tanner EDA tools for our research work, and also gathering for the information for the model files for different technologies in order to fulfil our research criteria.
ACKNOWLEDGEMENT I am very thankful to my guide Ms Tarana Afrin Chandel for her motivations and her assistance throughout my M.Tech studies.
REFERENCES [1] [2] [3] [4] [5] [6]
CH. DayaSagar and T. Krishna Moorthy, “Design of A Low Power FlipFlop using MTCMOS”International Journal of Computer Applications & information Technology in July 2012. Rishikesh V. TambatȦ*and SonalA.LakhotiyaȦ, “Design of Flip-Flops for High Performance VLSI Applications using Deep Submicron CMOS Technology”International Journal of Current Engineering and Technology in April 2014. B.Chinnarao, B.Francis&Y.Apparao,”Design of A Low Power Flip-Flop Using CMOS Deep Submicron Technology” Intrnational Journal of Electronics Signals and Systems in 2012. Pratiksha Gupta, Dr. Rajesh Mehra,”Low Power Design of SRFlipFlop Using 45nm Technology” IOSR Journal of VLSI and Signal Processing in 2016. K.Rajasri, A.Bharathi, M.Manikandan, ”Performance of FlipFlop using 22nm CMOS Technology” International Journal of Innovative Research in Computer and Communication Engineering in 2014. Kaphungkui N K ,”Design of low-power, high performance flip-flops” International Journal of Applied Sciences and Engineering Research in 2014.
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