Global Bonding Wires market is expected to reach 10313.42 million USD by the end of 2022 Custom Research｜Research Report｜Management Consulting｜Seminar｜Database
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Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
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The global market of Bonding Wires Industry is really scattered due to the wide application and consumption scale. In 2016, Bonding wire market managed to increase sales in worldwide, with the revenue 6285.08 million USD. In the next five years, the global revenue of Bonding Wires will maintain a 10%~11% annual growth rate, revenue is expected in 2022 will be 10313.42 Million USD. The price of Bonding Wires is slightly decreased in nearly five years. For being accorded with the corresponding application area, the product price has a large differences.
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Despite the presence of competition problems, due to the global recovery trend is clear, investors are still optimistic about this areas, the future will still have more new investment enter the field. As large demand of Bonding Wires product, the domestic enterprises should hold the opportunity to improve their technology with domestic advantages, such as low raw material price.
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