Global Flip Chip Bonder market is expected to reach $445.06 million by 2022

Global Flip Chip Bonder market is expected to reach $445.06 million by 2022 QYRESEARCH FOCUS ON MARKET SURVEY AND RESEARCH

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QYResearch • The smartphone market has grown rapidly for the past few years, and has entered into a mature phase. Meanwhile, the new driving force for the semiconductor market shifts to the IoT market. Over 50 billions of things will be virtually connected on the internet by 2020, and a change can be seen in the demand for semiconductor devices. In the future, it will be essential for big servers and supercomputers to be larger volume and higher speed, and for mobile devices to be energy saving as well as smaller and thinner sized. Due to these changes in the trend of semiconductor packaging, the popularity of wireless processes, such as flip chip and wafer-level packaging, is expected to grow. To respond to the trend, the enterprises have been enhancing the product lineup for the flip-chip bonder market.

QYR

• Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 22.71% of the total sales of global Flip Chip Bonder in 2016. Besi is the world leading manufacturer in global Flip Chip Bonder market with the market share of 28.64%, in terms of revenue.

• Compared to 2015, Flip Chip Bonder market increased sales by 6.46 percent to 261.20 million USD worldwide in 2016 from 245.35 million USD in 2015. It shows that the Flip Chip Bonder market performance is positive, despite the weak economic environment.

• The global Flip Chip Bonder market is expected to reach $445.06 million by 2022 from $245.25 million in 2017, growing at a CAGR of 12.66% from 2017 to 2022. And China market is expected to be the biggest market with sales market share of 25.67% in 2022.

QYR

• Despite the presence of competition problems, investors are still optimistic about this area, in future still more new investment will enter into the field. Technology and cost are two major problems.

• Although sales of Flip Chip Bonder brought a lot of opportunities, for the new entrants with only advantage in capital without sufficient support in technology and downstream channels, the research group did not recommend taking risk enter this market.

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