QYResearch: The global Chip on Flex (COF) market is expected to reach 1785.28 M USD by 2021

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Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all 01 process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.

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点击添加相关标题文字 Driven by a growing range of applications in the automotive, industrial, military, aerospace, computer, telecommunication, consumer electronics, and medical electronics industries, miniaturization and the use of flex circuits continue to be of prime interest to electronics manufacturers.

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点击添加相关标题文字 In China, COF manufactures mainly include Danbond Technology, AKM Industrial, Compass Technology Company and others. China is the world’s third producer of COF and the world’s biggest consumption market.

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