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IOSR Journal of Engineering (IOSRJEN) ISSN: 2250-3021 Volume 2, Issue 8 (August 2012), PP 91-95 www.iosrjen.org

A New Technique to Decrease Leakage Power in VLSI Circuits K.Sridhar1, L.Narayana Rao2, Santosh Amshala3, Mohd Saleem Uddin4 Abstract: - Motivated by emerging battery-operated application on one hand and shrinking technology of deep sub micron (DSM) regime on the other hand, leakage power dissipation is rapidly playing a significant role in the total power dissipation as threshold voltage becomes small. The Low-power design techniques for leakage power minimization are investigated and presented in this paper and then propose a novel method, named ‘‘Multi purpose technique”. This method is based on reducing leakage power in active mode with the least delay and the off-state leakage mechanism while saving exact logic state. Library designed using 65nm BSIM4 model of Berkeley Predictive Technology Model (BPTM) has been used to simulate proposed technique compared to investigate techniques. Key Words: - Multipurpose, DSM, ITRS, 65nm.

I.

INTRODUCTION

Rapid growth in semiconductor technology has led to shrinking of feature sizes of transistors using deep submicron (DSM) process. As MOS transistors enter deep submicron sizes, undesirable consequences regarding power consumption arise. Until recently, dynamic or switching power component dominated the total power dissipated by an IC. Voltage scaling is perhaps the most effective method to decrease dynamic power due to the square law dependency of digital circuit active power on the supply voltage. As a result, this demands a reduction of threshold voltage to maintain performance. Low threshold voltage results in an exponential increase in the sub-threshold leakage current. On the other hand as technology scales down, shorter channel lengths result in increased sub-threshold leakage current through an off transistor. Therefore, in DSM process static or leakage power becomes a considerable proportion of the total power dissipation. For these reasons, static power consumption, i.e. leakage power dissipation, has become a significant portion of total power consumption for current and future silicon technologies.

II. SUB-THRESHOLD LEAKAGE CURRENT Sub-threshold or weak inversion conduction current between source and drain in an MOS transistor occurs when gate voltage is below VTH .The sub-threshold leakage is modeled as Equation (1):

μ denotes carrier mobility ,Cox is the gate oxide capacitance per unit area, W and L denote the width and effective length of the transistor, K is the Boltzmann constant, T is the absolute temperature, and q is the electrical charge of an electron. In addition, VTH is the zero biased threshold voltage, _ is body effect coefficient, _ denotes the drain-induced barrier lowering (DIBL) coefficient, n is the slope shape factor subthreshold swing coefficient. [1]

III. PREVIOUS WORK There are several different approaches tackling leakage. Each technique provides an efficient way to reduce leakage power, but disadvantages of each technique limit the application of each technique. Previously proposed work can be divided into following techniques: (1) state-saving techniques: where circuit state (present value) is retained. (2) state-destructive techniques: where the current Boolean output value of the circuit might be lost. MTCMOS power gating is a well-known way to reduce leakage and it continues to be applied to verydeep submicron CMOS technologies. This can be done by using one PMOS transistor and one NMOS transistor in series with the transistors of each logic block to create a virtual ground and a virtual power supply as depicted in Fig.1(a). Notice that in practice only one transistor is necessary, because of their lower on-resistance, NMOS transistors are usually used.

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