www.ipc.org
Association Connecting Electronics Industries
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FEATURE
Vol. 4, No. 3: May/June 2011
IPC APEX EXPOTM 2011 Deals a Full House in Vegas Attendees Travel from 52 Countries to Learn About New Technologies and Products and Participate in Standards Development
Between the LINES
One for the Record Books
A mere few days after the show, IPC released verified attendance figures from IPC APEX EXPO, held April 12–14, 2011, in Las Vegas, indicating an 8 percent increase over last year with 7,208 total participants. The number of attendees to the educational programs and exhibition grew an additional 5 percent over last year to 3,887, but most notably, an increasing number of these attendees, 20 percent more, participated in the technical conference and professional development courses. The largest event in North America dedicated to the electronic interconnect industry, IPC APEX EXPO saw a sizable increase in international attendance, representing 52 countries and nearly 20 percent of all attendees. “International attendees are participating in the conference and courses in growing numbers, as well as the industry’s all-important standards development meetings,” says Denny McGuirk, IPC president & CEO. An activity unique to IPC events, standards setting is vital to the global electronics industry. McGuirk explains that as more industry leaders participate in standards meetings through IPC groups such as TGAsia and TGNordic, these individuals, he says, “… understand the value of face-to-face networking with their colleagues around the world to develop industry best practices.” The increased attendance was also met with increased participation from companies on the show floor with 366 exhibitors, a 10 percent increase over 2010, spanning across 112,820 square feet of exhibit space. The exhibition makes life for attendees like Steve Draws, a procurement professional with Plexus Corp., much easier. “This show is invaluable in helping me to research and evaluate products, and to make sensible, money-saving decisions on purchases for my company.” More than 78 percent of respondents to the IPC APEX EXPO postshow
I’ve been back in the office for a few days after IPC APEX EXPO™ and my head is still swirling with impressions of the people, events and energy I experienced last week. The vibe on the show floor was Denny McGuirk teeming with pent up energy from the IPC President last few years resulting in orders and noticeable investment on the show floor. Exhibitors shipped an additional 150,000 pounds (68,000 kg) of freight to the show this year, providing a wide range of choices for attendees looking to compare equipment. Attendees finally had the willingness — and the budgets — to make serious investments for their companies. Exhibitors were elated with the response and the activity on the show floor. Steve Wozniak, our keynote speaker, was an investment for IPC that “paid off” big time. I heard from many attendees that he was one of the best keynotes at any show they had ever attended. That’s saying a lot considering we have had keynote speakers like General Norman Schwarzkopf and explorer Bob Ballard. The “Woz” was truly gracious and members described his talk as “inspirational,” “amazing” and “fabulous” — and I know you are a pretty tough crowd. Another inspirational moment was the awarding of the IPC Raymond E. Pritchard Hall of Fame award to Don Dupriest from Lockheed Martin. Don has been involved in IPC for nearly 25 years and has served as chairman of the IPC Technical Activities Executive Committee, among other committee leadership positions. Don stressed the rewards of his participation,
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In This ISSUE 1
F eature: IPC APEX EXPO Deals a Full House in Vegas
1
etween the Lines: One for the Record B Books
2 5
IPC News ew Standard Fills the Void in Test N Methods for Pad Cratering
5 6
Status of Standardization
8 8
IPC Honors Best Technical Papers
lectronics Industry Volunteers Honored E for Contributions to Industry and IPC I PC Elects New Members to Board of Directors
9
est U.S. Paper: A New Approach for B Early Detection of PCB Pad Cratering Failures
10 IPC Honors TTM Technologies
and Celestica with 2011 Corporate Recognition Awards
12 Upcoming Events
IPC News In Memorium
Werner Engelmaier, “Mr. Reliability,” Noted Consultant and IPC Volunteer Passes Away A memorial mass celebrating the life of Werner Engelmaier, 72, was held on Wednesday, April 20, 2011 in Bunnell, Fla. Engelmaier died on April 15 while scuba diving in Aqaba, Jordan. Engelmaier had more than 40 years of experience in electronic packaging and interconnection technology. Known as “Mr. Reliability” in the industry, he was president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. He was a lifetime member of the IPC Technical Activities Executive Committee. At the time of his death, he was chair of the Thermal Profiling Guide Task Group and served as vice chairman of the product reliability committee and two related test method task groups. He was a member of an additional 21 IPC committees, subcommittees and task groups. He was elected into the IPC Hall of Fame 2003 and was awarded the IPC Presidents Award in 1996 and the IEPS Electronic Packaging Achievement Award in 1987. He was named a Bell Telephone Laboratories Distinguished Member of Technical Staff in 1986 and an IMAPS Fellow in 1996. In addition, he authored more than 200 technical publications and received two patents. He was an active member of St. Mary Catholic Church, the Knights of Columbus and was a life member of the First Aid Squad in Mendham Township, N.J. He was an avid skier, tennis player, cyclist, scuba diver, sailor and developing golfer. He is survived by Osie, his wife of 49 years, two children and six grandchildren. Engelmaier will be missed by IPC Technet participants, staff members and the entire electronics manufacturing industry.
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FLEXIBLE CIRCUITS
Key Electronics Companies Set to Speak at IPC Flex Conference According to 2009–2010 IPC Industry Analysis and Forecast for Flexible Circuits in North America, the sales of flexible circuits is forecasted to grow to $50.8 billion globally by 2012. In order to provide the industry with the latest information on this important market segment, IPC will hold the IPC International Conference on Flexible Circuits, June 21–23, 2011, in Minneapolis, Minn. The two-and-a-halfday event will provide participants with insights into the engineering and business challenges associated with the technology of flexible circuitry from key leaders in the industry, including Research In Motion (RIM), Lockheed Martin, Mayo Clinic, DuPont and Rockwell Collins. The day-and-a-half conference portion of the event will begin June 22 with the keynote, “The Future of Flex — Opportunities and Challenges,” presented by Phil Plonksi of Prismark Partners. Then, representatives from RIM, Lockheed Martin, Mayo Clinic and Delphi will discuss what they need from the supply chain during “Technology Requirements of the End User.” In addition, the conference will feature information on ground-breaking technologies. Attendees will also receive an update on the latest advancements on materials for flex during a panel featuring representatives from DuPont, Arlon and Tapco Circuit Supply. John Bauer of Rockwell Collins will present performance reliability data. Sharon Starr, IPC director of market research, will provide an overview of trends in the flex market based on new IPC studies. Other highlights of the conference portion include presentations on assembly issues in flex, solving processing issues, flex as an enabler for 3-D packaging and heater flex circuits for medical applications. For more information or to register for IPC International Conference on Flexible Circuits, visit www.ipc.org/flexible-circuits .
STANDARDS
IPC-A-610E Now Available in Seven Languages
(L) Flattened post-defect, (R) Flattened post-acceptable
Did you know that IPC-A-610E, Acceptability of Electronic Assemblies, IPC’s most widely used electronics assembly standard is available in seven languages? Revision E is available in English, Spanish, Chinese, German, Polish, Danish and Swedish. The Polish, Danish and Swedish language translations were made available in March 2011. Revision E now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations. The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A-610, have also been upgraded. The E revision contains 165 new or updated illustrations, bringing the total to more than 800. In addition, the standard has been revamped for ease of use and clarity. Sections have been reorganized so data and images are easier to find and to make it easier to use. The many changes that have occurred in array packaging since the standard’s last revision are also addressed in the E revision, as are changes to hot tear and filet lifting. Designers and manufacturers will appreciate criteria for package-onpackage technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular to the assembly using a through-the-board method. For more information or to purchase IPC-A-610E, visit www.ipc.org/610 . The hard copy price for IPC members is $55 and the nonmember price is $110. Additional formats of IPC-A-610E are available.
government relations
IPC Summit to Address American Competitiveness The IPC Summit on American Competitiveness will be held June 15–16, 2011, in Washington, D.C. at the Hyatt Regency on Capitol Hill. This unique IPC event combines conference presentations with legislative and regulatory briefings as well as key lobbying visits with members of Congress to discuss critical issues that directly impact the U.S. electronics industry’s ability to compete globally. As a part of the two-day Summit, exclusive events with members of the National Association of Manufacturers will offer opportunities to hear from and network with members of Congress and senior-level Administration officials. The IPC Summit will offer information on specific measures companies can take to increase their competitiveness. During “Taking Action: How U.S. Electronics Manufacturers are Ensuring their Competitiveness,” a panel of senior-level executives representing companies in the electronics industry will share the critical steps they have taken to gain an advantage in the current global marketplace. In addition, information on resources such as the Federal Trade Adjustment Assistance Program will be discussed and the international factors impacting the industry’s competitiveness will be highlighted. IPC’s legislative and regulatory briefings by subject-matter experts will help prepare participants for their Congressional appointments. These briefings will address the significant issues that Congress must address to enhance the U.S. electronics industry’s ability to compete.
Day two of the IPC Summit will be devoted to meetings between participants and their legislators to establish valuable relationships and discuss timely legislative issues and actions. Details and registration information for the IPC Summit on American Competitiveness are available at www.ipc.org/CHD .
IPC Efforts to Repeal Burdensome EPA Proposal Results in Congressional Action IPC recently garnered Congressional support in its quest to stop EPA from imposing burdensome reporting requirements under the Toxics Substances Control Act (TSCA) inventory Update Reporting (IUR) proposed rule. On April 4, Representative Fred Upton (R-MI), Chairman of the House Committee on Energy and the Environment, and Representative John Shimkus (R-IL), Chairman of the Subcommittee on Environment and Economy, sent a letter requesting repeal of the proposed rule. As a result of IPC’s efforts, the proposed TSCA IUR rule was discussed during a subcommittee hearing held on February 15, 2011 on burdensome, unnecessary Environmental Protection Agency (EPA) regulations. Industry concerns with the proposed rule raised during the hearing resonated with Congress. The letter highlights many of industry’s concerns, including the EPA’s outlandish interpretation that byproducts sent for recycling are new chemicals subject to the rule. IPC hopes that this letter, combined with other IPC advocacy efforts, will result in significant changes to the proposed rule.
IPC REVIEW is available only to members of IPC. As a benefit of membership, IPC REVIEW is sent bimonthly to the Primary Contact of all member companies, chairmen of technical committees, and other representatives designated by the Primary Contact. Each issue contains reports on technical and management programs undertaken by IPC. IPC Member Subscriptions/Changes of Address/ADDITIONAL COPIES: Susan Storck Membership Manager Phone +1 847-597-2872 Fax +1 847-615-7105 E-mail SusanStorck@ipc.org How to Contact Us Sandy Gentry Editor E-mail SandyGentry@ipc.org IPC, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015 Phone +1 847-615-7100 Fax +1 847-615-7105 Web www.ipc.org To contact staff by e-mail, use name (without space), followed by @ipc.org © Copyright 2011 IPC. ISSN 1523-6927. IPC REVIEW is published bi-monthly by IPC, Inc., 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015. Subscription rate for IPC members is $50 (US), which is included in membership dues. IPC REVIEW is not available to nonmembers. POSTMASTER: Send address changes to IPC REVIEW, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015. +1 847-615-7100 Fax 847-615-7105.
CALL FOR PARTICIPATION
IPC Issues Call For Participation for 2012 IPC APEX EXPO™ IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for 2012 IPC APEX EXPO at the San Diego Convention Center, San Diego, February 28–March 1, 2012. Expert presentations are being sought on all relevant design, PCB fabrication and electronics manufacturing topics. Submissions are sought on design, materials, assembly, processes and equipment. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by June 4, 2011. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of the technical and/ or appropriate test results in the final paper. In addition, proposals are solicited for full-day and half-day professional development (PD) courses on design, printed circuit board and electronics manufacturing processes and materials. TM
Technical conference paper abstracts and PD proposals are due June 4, 2011. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/CFP . For more information about conference presentations, contact Greg Munie, IPC conference director, at GregMunie@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org or +1 847-597-2825. For course proposal information, contact Anne Marie Mulvihill, IPC professional development program manager at AnneMarieMulvihill@ipc.org or +1 847-597-2827.
Martin Anselm, Universal Instruments Corporation, presents a professional development course at 2011 IPC APEX EXPO.
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IPC APEX EXPO IPC APEX EXPO 2011 Deals a Full House in Vegas (continued from page 1) survey agree with Draws, indicating that the exhibition influences their buying choices throughout the year. To help attendees sort through the information overload of the packed exhibition, IPC introduced “My APEX EXPO” this year, an online personalized show planner to help attendees effectively plan their itinerary to focus on their companies’ priorities.
“We were extremely pleased with a very steady flow of visitors in our booth …” “We were extremely pleased with a very steady flow of visitors in our booth, all three days,” says Scott Rushia, sales manager for Martin. “It was a good combination of people who came to the exhibition with Martin and Finetech rework systems on their prepared research list, as well as others who discovered us on the show floor. The days were full of relevant demos and we took some orders at the show.” “APEX 2011 was the best show we have ever had at APEX,” extolls Bob Black, president & CEO of Juki. “The booth was consistently crowded and we received double the sales inquiries of last year. APEX is clearly the flagship show of the circuit assembly industry.” INVENTEC Performance Chemicals (worldwide headquarters in France) also saw an increase in business. “With a 5 percent plus compared to 2010, the show in 2011 was a real success for us,” says Anke Sandra Meunier, communication manager for INVENTEC. “In addition, our two conference sessions on cleaning PCBs and solder paste reliability generated interesting technical feedback. APEX is always a great international show for us.” IPC APEX EXPO trades in the bright lights of Las Vegas in 2012 for the warm Pacific breezes of San Diego, February 28–March 1, 2012. Academics, researchers and others who wish to submit an abstract for consideration in next year’s technical conference or professional development courses, may view the 2012 IPC APEX EXPO Call for Participation at www.IPCAPEXEXPO.org/cfp .
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IPC Standard
STATUS of Standardization
New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering
Published Standards/ Documents
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering. The new industry standard provides three standardized test methodologies that enable product developers to determine the best material for their application. “In the beginning, there wasn’t much attention to these types of failures because they were almost unheard of,” says Dr. Reza Ghaffarian, a NASA Jet Propulsion Laboratory engineer and the chair of the IPC SMT Attachment Reliability Test Methods Task Group that developed IPC-9708. He explains that as companies started getting products ready to ship they began to realize they had a problem that was not with just one or two parts, but with many. “These are catastrophic failures that are sometimes latent. The defect doesn’t always show itself in testing.” IPC-9708 provides test methods to evaluate the susceptibility of printed board assembly materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include cold ball pull, ball shear and hard pin pull, can be used to rank order and compare different printed board materials and design parameters. “The standard will help people select, say, four materials that seem to meet their needs. Then they can build test coupons defined by IPC-9708 and run tests on these coupons,” says Satish Parupalli, an Intel engineer who helped coordinate the development of the IPC-9708 within the IPC 6-10d task group. “That lets them make a decision before they build any real products.” Companies that use IPC-9708 will also see substantial cost reductions by reducing the burden of verification and qualification. “Testing is costly and time
consuming. If you don’t have standardized test methodologies, you can’t quantify which material performs better,” said Mudasir Ahmad, a Cisco engineer who led the development of IPC-9708 along with Parupalli. Some companies are making IPC-9708 a mainstay in their material selection process. Cisco, for example, is setting up its infrastructure. “We’re working with multiple suppliers and testing multiple materials. Investing our time and money highlights to suppliers that we believe in this standard and its benefits,” Ahmad said.
“Investing our time and money highlights to suppliers that we believe in this standard and its benefits” Mudasir Ahmad, Cisco As is the case with many standards, widespread adoption would bring significant benefits to industry. Proponents hope that resin suppliers and board fabricators will begin reporting data based on standardized testing. “Now there is a common base line for measurements. We hope material providers will supply this information and make it simpler for their customers to select the right material for their applications,” Parupalli said. Added Ahmad, “We hope third party labs will see the benefits and utilize this. The infrastructure for each test is not that difficult or expensive to set up.” For more information or to order a copy of IPC-9708 , Test Methods for Characterization of PCB Pad Cratering, visit www.ipc.org/9708 .
IPC-7093, March 2011 Design and Assembly Process Implementation for Bottom Termination SMT Components IPC-1071, January 2011 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
New Translations IPC-A-610E-PL, March 2011
Dopuszczalność Zespołów Elektronicznych
(Polish Language)
IPC-A-610E-DK, March 2011 Godkendelseskrav for elektronikprodukter (Danish Language) IPC-A-610E-SE, March 2011 Acceptanskrav för Kretskort (Swedish Language) J-STD-001E-DE, February 2011 Anforderungen an Gelötete Elektrische und Elektronische Baugruppen (German Language) IPC-9704-CN, February 2011 印制板应变测试指南 (Chinese Language) J-STD-001E-SP, December 2010 Requisitos de Ensambles Eléctricos y Electrónicos Soldados (Spanish Language) IPC-A-600H-CN, December 2010 印制板的可接受性 (Chinese Language)
To view a complete list of published standards and work in progress, visit www.ipc.org/status . To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like more information about any work in progress, just click the document number on the Status page. You will link to the committee home pages where you can download current drafts, comment lists and committee meeting minutes. IPC primary contacts may request one copy of any new standard (one language) within 90 days of publication. Other requests should be sent to membertechrequest@ipc.org .
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IPC APEX EXPO
Electronics Industry Volunteers Honored for Contributions to Industry and IPC Nearly 120 Awards Presented at IPC APEX EXPO™ IPC presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO, held April 12–14, in Las Vegas. The 2011 Presidents Award was presented to Stephen Pudles, API Defense USA, Inc. for his many contributions and leadership over the past 20 plus years to the industry and IPC. A founding member and leader of the IPC EMS Council, Pudles was also recognized for his leadership on the IPC Board of Directors and in IPC certification activities. Awards were also presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through active IPC committee service. For leadership and exceptional contributions to several IPC programs and committees, Rajesh Kumar, DDi Corp. and Michael Moisan, TTM Technologies were honored with Special Recognition Awards for their work with the IPC DoD Task Force, the IPC DoD Roadmap, and the E-20 IPC Intellectual Property Committee that developed IPC-1071, Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing. Honored with Distinguished Committee Service Awards for their work on IPC-1071 were: Wallace Ables, Dell Inc.; Kevin
IPC Board Member Joe O’Neal (left) presents the Presidents Award to Stephen Pudles.
Arledge, Motorola Solutions, Inc.; Blaine Davis, Scientech, LLC; George Dudnikov, Founder Technology Group Corp.; Joe Fjelstad, Verdant Electronics; Dennis Fritz, SAIC; James Fuller, Endicott Interconnect Technologies, Inc.; Roy Keen, Rockwell Collins; Bruce Kline, Mayo Clinic; Ben Lee, Cisco Systems Inc.; Matthew McQueen, NSWC Crane; Jos Purvis, Cisco Systems Inc.; Gary Roper, Roper Resources, Inc.; Al Wasserzug, Vulcan Flex Circuit Corporation; and Mikel Williams, DDi Corp. For outstanding contributions to the Process Consumables Statistical Subcommittee, Don Walsh, Uyemura International Corp. received a Distinguished Committee Service Award.
Members of the D-22 Subcommittee were recognized for Revision B of IPC-6018, a standard for high frequency boards.
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For her outstanding contributions to the development of DVD-74C, ESD Control for Electronics Assembly, Lynda Holland, Hunter Technology Corp., was given a Special Recognition Award. For the IPC D-22, High Speed/High Frequency Board Performance Subcommittee that developed IPC-6018B, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards, Mahendra Gandhi, Northrop Grumman Aerospace Systems and Michael Luke, formerly with Raytheon Company, were honored with Committee Leadership Awards. D-22 committee members recognized with Distinguished Committee Service Awards were: Lance Auer, Raytheon Missile Systems; Denise Chevalier, Amphenol Printed Circuits, Inc.; Patricia Dupuis, Raytheon Company; Ty Gragg, Unicircuit Inc.; Michael Green, Lockheed Martin Space Systems Company; Thomas Kemp and Thomas Murry, Rockwell Collins; Clifford Maddox, Boeing Company; Rene Martinez, Northrop Grumman Aerospace Systems; James Monarchio, TTM Technologies, Inc.; and Marybeth Perrino and Jose Rios, Endicott Interconnect Technologies, Inc. For the 5-22AS, Space Electronic Assemblies J-STD-001 Addendum Task Group that developed J-STD-001ES, Space Applications Electronic Hardware Addendum to IPC-J-STD-001E, Kathy Johnston, Raytheon Missile Systems and Garry McGuire, NASA Marshall Space Flight Center, were honored with Committee Leadership Awards. IPC 5-22AS committee members who received Distinguished Committee Service Awards were: James Blanche and Charles Gamble, NASA Marshall Space Flight Center; Thomas Carroll, Boeing – Integrated Defense Systems; Robert Cooke and Anthony Wong, NASA Johnson Space Center; Daniel Foster, Defense Acquisition Inc.; Matt Garrett, Phonon Corporation; Dr. Reza Ghaffarian, Kim Phillips and Alan Young, Jet Propulsion Laboratory; Hue Green and Michael Green, Lockheed Martin Space Systems
IPC APEX EXPO Company; Ronald Hebden, Honeywell Technology Solutions Inc.; Robert Humphrey and Jeannette Plante, NASA Goddard Space Flight Center; Joseph Kane, BAE Systems Platform Solutions; Leo Lambert, EPTAC Corporation; Dominic LaPinta, United Space Alliance; Lisa Maciolek, David Nelson and William Ortloff, Raytheon Company; George Millman and Leticia Vasquez, Raytheon Missile Systems; Barry Morris and Debbie Wade, Advanced Rework Technology – A.R.T.; Doug Rogers, Harris Corporation, GCSD; Bill Strachan, ASTA – Portsmouth University; Mel Parrish, STI Electronics, Inc.; Teresa Rowe, AAI Corporation; Richard Rumas, Honeywell Canada; Patricia Scott, STI Electronics Inc.; Blen Talbot, L-3 Communications; and Jonathon Vermillion, Ball Aerospace & Technologies. In addition, Blanche, Cooke, Foster, Hebden, McGuire, Rowe and Scott were also presented with Special Recognition Awards for their contributions to the development of the J-STD-001ES, Space Addendum Certification Program. For the 7-31FS, Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group that developed IPC/WHMA-A620AS, Space Applications Electronic Hardware Addendum to IPC/WHMA-A620A, Garry McGuire, NASA Marshall Space Flight Center and Randy McNutt, Northrop Grumman Corp., were presented with Committee Leadership Awards. IPC 7-31FS committee members recognized with Distinguished Committee Service Awards were: James Blanche and Charles Gamble, NASA Marshall Space Flight Center; Robert Cooke and Anthony Wong, NASA Johnson Space Center; Daniel Foster, Defense Acquisition Inc.; Matt Garrett, Phonon Corporation; Ronald Hebden, Honeywell Technology Solutions Inc.; Robert Humphrey and Jeannette Plante, NASA Goddard Space Flight Center; Kathy Johnston, George Millman, Gregory Rohrbacher and Leticia Vasquez, Raytheon Missile Systems; Dominic LaPinta, United Space Alliance; Lisa Maciolek, Raytheon Company; Barry Morris and Debbie Wade, Advanced Rework Technology – A.R.T; Mel Parrish and Patricia Scott, STI Electronics, Inc.; Teresa Rowe, AAI Corporation; Richard Rumas, Honeywell Canada; Blen Talbot,
Members of the 5-22AS, Space Electronic Assemblies J-STD-001 Addendum Task Group
L-3 Communications; Jonathon Vermillion, Ball Aerospace & Technologies; and Alan Young, Jet Propulsion Laboratory. For the IPC 6-10d SMT Attachment Reliability Test Methods Task Group that developed the recently released IPC-9708, Test Methods for Characterization of Printed Board Assembly Pad Cratering, Werner Engelmaier, Engelmaier Associates, L.C. and Dr. Reza Ghaffarian, Jet Propulsion Laboratory were honored with Committee Leadership Awards. IPC 6-10d committee members who received Distinguished Committee Service Awards were: Jennifer Burlingame, Cisco Systems Inc.; Nicole Butel, Avago Technologies; Dr. Stephen Clark, formerly with Nordson DAGE; Marie Cole, IBM Corporation; Todd Embree; Edward Kelley, Isola Group, SARL; Jeff Kennedy, Celestica; Keith Newman, Oracle America Inc.; Brian Roggeman, Universal Instruments Corporation; and Dr. Dongji Xie, NVidia Corp. Special Recognition Awards were presented to Mudasir Ahmad, Cisco Systems Inc., and Satish Parupalli, Intel Corporation, for their leadership in coordinating the development of IPC-9708. For the 5-21h Bottom Termination Components Task Group that developed IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components, Ray Prasad, Ray Prasad Consultancy Group and Vern Solberg, Solberg Technical Consulting,
were honored with Committee Leadership Awards. Recognized with Distinguished Committee Service Awards were: Richard Arnold and Dr. Stanton Rak, Continental Automotive Systems; Dr. Raiyomand Aspandiar, Intel Corporation; Dr. Bev Christian, Research in Motion Limited; Werner Engelmaier, Engelmaier Associates, L.C.; Joe Fjelstad, Verdant Electronics; David Hillman, Rockwell Collins; Bruce Hughes, U.S. Army Aviation & Missile Command; William Kunkle, MET Associates Inc.; Jack Olson, Caterpillar Inc.; Richard Otte, PROMEX Industries, Inc.; Robert Rowland, RadiSys Corporation; Jeff Shubrooks, Raytheon Company; Bill Werner, Trimble Navigation; Robert Wettermann, BEST Inc.; Bob Willis, The SMART Group; and Linda Woody, Lockheed Martin Missile & Fire Command. For the IPC 5-33b Soldermask Performance and D-13b Flexible Circuits Covercoat Materials Task Groups that developed IPC-SM-840E, Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials, Steve Musante, Raytheon Missile Systems; Douglas Pauls, Rockwell Collins; and David Vaughan, formerly with Taiyo America, were honored with Committee Leadership Awards. Task group members Robert Sheldon, Pioneer Circuits Inc. and Clark Webster, ALL Flex LLC, were given Distinguished Committee Service Awards.
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IPC APEX EXPO
IPC Honors Best Technical Papers at IPC APEX EXPOTM 2011 IPC announced the winners of this year’s Best U.S. and International Papers at IPC APEX EXPO. The event’s Technical Program Committee selected the winners through a ballot process. “A New Approach for Early Detection of PCB Pad Cratering Failures,” by Anurag Bansal, Cisco Systems Inc. took the U.S. Best Paper honor. His co-authors were Gnyaneshwar Ramakrishna and KuoChuan Liu, Cisco Systems Inc. In the International Best Paper category, the winning paper was, “Mechanical Shock Test Performance of SAC 105 and Tin-3.5% Silver BGA Components with SAC 305 Solder Paste on Nickel-Gold and OSP Board Surface Finishes,” by Jasbir Bath, Bath Technical Consultancy. His 11 co-authors were: Wade Eagar and Chad Bigcraft, Motorola Solutions; Keith Newman and Livia Hu, Oracle America, Inc.; Gregory Henshall, Ph.D., Hewlett-Packard Company; Jennifer Nguyen, Flextronics International; M.J. Lee, Altera Corporation; Ahmer Syed, Amkor Technology Inc.; Weidong Xie, Cisco Systems Inc. and Fubin Song and Ricky
Lee, Ph.D., Hong Kong University of Science and Technology. Nearly 100 papers were submitted for consideration as Best Paper. Papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing. Copies of the winning papers are included in the 2011 IPC APEX EXPO Technical Conference Proceedings. The Proceedings CD will be available for purchase at the end of April through the IPC Online Store. An excerpt from the U.S. winning paper can be found on page 9. The winning international paper will be published in the July/August issue. Members may also access the winning papers in the Members-Only section of the IPC website. In addition, a video archive of the U.S. Best Paper is available for purchase as part of the S16 PCB Reliability Test Methods technical conference session. For more information on the available technical conference video archives, visit www.IPCAPEXEXPO.org/cyber-conference .
Anurag Bansal (left) accepts the Best U.S. Conference Paper award from IPC Board member Steve Pudles.
Jasbir Bath (right) accepts the Best International Conference Paper award from IPC President Denny McGuirk.
IPC BOARD
IPC Elects New Members to Board of Directors The Nominating and Governance Committee of the IPC Board of Directors presented one Board candidate for reelection and three new Board candidates for election at the IPC Annual Meeting, on Tuesday, April 12, 2011. All four candidates were elected as board directors and will serve fouryear terms, covering April 2011 through April 2015. The four board directors are: Shane Whiteside, chief operating officer, TTM Technologies. Whiteside (reelected) was elected to the IPC Board in 2007. Prior to joining TTM Technologies, he served as director of operations at Power Circuits and was previously employed by Technica USA, serving in the areas of product management and technical sales. He holds a B.A. degree in economics from the University of California at Irvine.
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Bhawnesh Mathur, CEO, Epic Technologies. Prior to joining EPIC in June 2008, Mathur was chief supply chain officer and senior vice president of supplier marketing and asset management for global components at Arrow Electronics. His nearly 30year career in the electronics industry also includes work at Sanmina-SCI as executive vice president of global supply chain, and he spent more than 20 years at IBM in various roles. Mathur received an MBA from the University of Arizona and a BSChE from the University of Florida.
IPC REVIEW
Ray Sharpe, CEO, Isola S.a.r.l. Before assuming his current position as CEO in June of 2004, Sharpe was CEO of Cookson Electronics and a board director of Cookson Group Plc for more than 10 years. He also served 10 years as director for SPS Technologies, a manufacturer of specialty materials for the aerospace industry. Sharpe is a graduate of East Carolina University and has more than 27 years of experience in the electronics industry.
Mark Wolfe, vice president, quality supply management, Phoenix International Corp. Wolfe joined Phoenix International in February 1995 as vice president of sales and marketing. In March 1999, he assumed the role of general manager, Fargo Operations. Beginning in November 2001, Wolfe served as vice president of operations and then vice president of quality and supply management in 2004. Mark received his B.S. degree in electrical engineering from the University of Minnesota in 1983.
IPC APEX EXPO
A New Approach for Early Detection of PCB Pad Cratering Failures Anurag Bansal, Gnyaneshwar Ramakrishna and Kuo-Chuan Liu, Cisco Systems, Inc. Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks, which usually initiate under the application of excessive mechanical loads, represent a serious reliability concern for the industry. In typical board level reliability tests, solder joint failures are detected by an increase in electrical resistance of a daisy chain circuit followed by failure analysis. However, board level testing to determine the onset of BGA pad cratering has been problematic because the early stage of this failure mode is not associated with an electrical signature. Based on the mechanism of pad cratering, it is known that the cracks initiate beneath BGA pads and grow under continually increasing stresses until the pad completely separates from the substrate and a pad “crater” is formed. The catastrophic fracture of an interconnect, which causes an electrical “open,” is in fact the final and most catastrophic stage of the failure. At present the higher strain levels based on electrical resistance monitoring are being reported and used in design practices. In this study, a new monitoring approach based on acoustic emission has been introduced for early detection of pad cratering failure. Two different lead-free daisy chain test vehicles were used with 1.0 mm pitch HSBGA-1096 and 0.8 mm pitch CABGA-160 packages, and four-point bend tests were performed to induce pad cratering. Acoustic emission activity from the test vehicles was monitored along with the electrical resistance of the daisy chain circuit. The bend test results, in conjunction with failure analysis, have shown that acoustic emission monitoring is indeed an effective methodology to detect the onset of the pad cratering. In contrast, the electrical daisy chain failure was detected at significantly higher strain. Using the acoustic emission approach, it has been found that PCB pad cratering
failures can initiate at strain levels significantly lower than previously reported. This board level test methodology may now be used to evaluate the propensity of different materials and packages to pad cratering, and also to improve back-end manufacturing processes without using daisy chain test vehicles.
Introduction The term “pad cratering” refers to the formation of fine cracks underneath BGA pads either in the PCB laminate material or in organic package substrates. Figure 1 schematically depicts the possible location of these cracks. Due to external mechanical load, the cracks initiate due to stress concentrations arising from the corner of the copper pad and the material property mismatch between copper and the laminate resin. The cracks propagate within the resin, up to the point where the underlying glass fiber bundles are encountered. Under subsequent loads, the cracks continue to grow along the interface between the resin and glass fibers, and also beyond the glass fiber bundle. Prior studies have shown that the extent of crack growth under the BGA pads is highly dependent on the location and orientation of glass fiber bundles with respect to the BGA pad1. Pad cratering is a serious concern because depending on the loading conditions, the cracks can act either as a source for instantaneous catastrophic failure or as latent defects that can affect long term reliability. The ongoing industry transition to lead-free assemblies has further magnified this concern due to several factors. The higher reflow
Figure 1 - Schematic Depiction of Pad Cratering
temperature involved in lead-free assembly causes higher residual mechanical stress at the BGA pad interfaces2. The Sn-Ag-Cu (SAC) solder alloys, which are significantly stiffer and more brittle than eutectic tin-lead alloys, transmit higher stress to the BGA pads under a given mechanical load. The high Tg Phenolic-cured laminate materials used in Pb-free compatible PCBs are inherently more brittle than Dicy-cured laminates used in Sn-Pb assembly3, 4. Additionally, the trend of increasing device density and assembly miniaturization leads to the use of finer pitch components with smaller pad dimensions. The smaller pad dimensions are more susceptible to pad cratering under relatively lower mechanical loads2. The occurrence of internal laminate cracks under the BGA pads has mostly been observed under excessive monotonic or cyclic mechanical bending loads under quasi-static or dynamic (i.e., shock) conditions1, 5-7. These types of loads can be encountered during in-circuit testing (ICT) and PCB handling operations. Long et al have reported that pad craters due to excessive mechanical loads can cause electrical failures either due to the ultimate fracture of a trace connecting to the BGA pad, or due to cracking of a via located directly under the BGA pad2. Mukadam et al evaluated the long term reliability risk of existing laminate cracks. They reported up to 20% growth in pad cratering cracks under thermal cycling conditions8. Recently, Ma et al have even reported pad cratering as the primary failure mode in BGA test vehicles subjected to accelerated thermal cycling tests conducted with a wide temperature range of -55 to +125 °C9. Some studies have speculated that in the presence of moisture and electrical bias, internal pad cratering cracks can accelerate the conductive anodic failure (CAF) mechanism in PCBs8. At present it appears that the effect of pad cratering cracks on electrical signal integrity has not been studied. To read this IPC APEX EXPOTM 2011 technical article in its entirety, visit www.ipc.org/technical-article-0511 .
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IPC Honors TTM Technologies and Celestica with 2011 Corporate Recognition Awards The standards and guidelines that are relied on from chips to boards and systems are largely created by volunteers. Even the statistical data that’s used as the basis for many market research predictions as well as for countless industry decisions is often garnered from data that’s offered voluntarily. Companies provide varying levels of support for these important programs. Some offer a few employees paid time off so they can more easily attend committee meetings, while others actively support numerous volunteers. A few strongly back the efforts of standards bodies and trade associations, doing as much as they can to help improve the infrastructure that helps keep the electronics industry moving forward. A few of these corporations go above and beyond the average. On April 12, IPC recognized two member companies, TTM Technologies Inc. and Celestica Inc., for their continuing support with corporate recognition awards. Both awards were established in 2007 as part of IPC’s 50th anniversary activities.
Celestica received the IPC Stan Plzak Corporate Recognition Award. It honors a corporation in the electronics assembly industry that has taken initiative to actively contribute to enhancing the industry while supporting IPC by participating in technical and/or management programs. The award is named for former IPC Board Chairman Stan Plzak, former president of Pensar Corp., and a founding member of the IPC Electronics Manufacturing Services Industry Management Council. “It’s an honor to be recognized as a company; a lot of individual employees have been awarded in past years,” said Thilo Sack, principal engineer at Celestica. “When we started looking at our participation in IPC, we realized we were involved in far more IPC programs than we had ever noticed. That’s how deeply these standards are part of our company. It’s also important to us that the input we provide for IPC committees is appreciated by the industry.” TTM was awarded the IPC Peter Sarmanian Corporate Recognition Award, which recognizes a corporation in
TTM Technologies — IPC Participation at a Glance
the printed circuit board industry that has taken a leadership role and made contributions to the industry while participating in IPC’s technical and/or management programs. The award is named for former IPC Board Chairman Peter Sarmanian, former president of Printed Circuit Corp. “We’re honored to be recognized by IPC and the industry,” said Shane Whiteside, COO at TTM. “We’ve participated in quite a few ongoing programs including environmental compliance, government relations and a number of other specifications. We also participate in the statistics program.” The statistics programs offer a different service by IPC for its members. They help companies make marketing and strategic plans for the products and services that are built around IPC guidelines and standards. “We use IPC statistics frequently in our business. They help show us how we’re performing compared to the rest of the industry,” said Clay Swain, TTM’s marketing vice president.
Celestica — IPC Participation at a Glance
• Member since 1981
• Member since 1994
• Thirteen member locations across the world
• Forty-one member locations across the world
• Eight TTM Technologies employees hold 28 IPC technical committee memberships
• Twenty-eight Celestica employees hold 54 committee memberships
• Two employees serve as chair or co-chair of four committees • One employee serves on IPC’s Board of Directors • Certified IPC Trainers: 20 • Certified IPC Specialists: 88
About TTM Technologies TTM Technologies, Inc. is North America’s largest printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs, as well as backplane and sub-system assemblies. TTM stands for timeto-market, and represents how the company’s time-critical, one-stop manufacturing services enables customers to shorten the time required to develop new products and bring them to market.
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• One employee serves as co-chair of the 5-33 Coating Subcommittee • One employee received the IPC Presidents Award in 2000 • Certified IPC Trainers: 397 • Certified IPC Specialists: 483
About Celestica Celestica is a multinational electronics manufacturing services (EMS) company headquartered in Toronto, Canada. Celestica’s global manufacturing network spans 25 locations and 14 countries in the Americas, Europe and Asia. The company delivers innovative supply chain solutions from design and engineering services to systems assembly, fulfillment and aftermarket services to leading OEMs (original equipment manufacturers) in the consumer, enterprise networking and communications, storage and server, aerospace and defense, green technology, industrial and healthcare markets.
IPC APEX EXPO Though standards and statistics are targeted at different aspects of businesses, they share common characteristics. Both are designed to help companies move forward, building for their future and the future of the overall industry. Companies like Celestica and TTM work with many others to plan ahead and set the stage for continuing advances. “When a standards organization has its finger on the pulse, they sense the need for standards and can have them ready when people need them,” said Irene Sterian, Celestica’s advanced process development manager. One of the factors that drive companies to support volunteers and contribute to statistics programs is the synergy that exists between IPC’s goals and corporate objectives. These efforts cover mature technologies like resin materials and solder as well as emerging technologies like solar. “We view IPC as a governing body for the industry, making sure everyone is driving forward with the same playbook,” Sterian said. “It helps that IPC is taking on assembly standards in solar, recognizing that there’s a gap and filling it with standards.” When volunteers get the support they need, they can work together to address areas that would be difficult to impact as individual companies. That’s true in government relations, where even the largest companies find difficulty in getting government entities to recognize the value of technologies like printed circuit boards. When companies band together and speak as one, they also reduce concerns about conflict of interest. With support from its members, IPC has helped drive efforts to ensure that the North American circuit board industry remains viable to help ensure national security. “With TTM’s involvement in the defense industry, the IPC has played an active role in coordinating the collective interests of the PCB industry with the Department of Defense. This has resulted in a constructive dialogue that has elevated the importance of the PCB as an active component in military electronic equipment,” Michael Moisan, vice president of technology at TTM.
Shane Whiteside (right) COO, TTM Technologies, accepts the IPC Peter Sarmanian Corporate Recognition Award from IPC Board member, Stephen Pudles.
IPC President Denny McGuirk (left center) with Celestica staff and their IPC Stan Plzak Corporate Recognition Award.
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Between the LINES (continued from page 1) including the many friends he has made over the years and the impact he has had on his company through the knowledge gained. I truly enjoyed meeting his family and seeing the support he received from his work colleagues. As always, I was impressed by the dedication of our committee members, who attended hours of committee meetings to contribute to the standards they, their customers and suppliers depend on. During our awards luncheons, we recognized 119 individuals with special recognition, committee leadership, and distinguished committee service awards. Because of the number of people, I sometimes worry that our award recipients may not feel as special as they should. They’re recognized in this issue of IPC Review (page 6) and I wish to thank each one of them again.
Some people question the future of trade shows, but IPC APEX EXPO 2011 made me confident that this show has an important place in our industry. From the double-digit growth in the educational programming to the interest in next year’s event, it’s clear that the show is meeting your needs. A recent article in B-to-B found three reasons live events continue to be essential: in-person events are better suited [than virtual events or communications] for capturing attendees’ attention, inspiring positive emotions and building networks and relationships. From the feedback we’ve received on-site and since the show, I couldn’t have said it better myself.
Register Now for these Upcoming 2011 Events May
June
May 4 IPC Webinar on FR-4 CCL Reclassification Explained — A Global Update from UL 7:00 pm–8:00 pm, CT
June 9–10 EMS Training II San Jose, CA, USA
May 11–12 It’s Not Easy Being Green: Roadmap to Compliance An IPC International Symposium on Electronics and the Environment Boston, MA, USA May 23–25 Designer Certification Workshop and Exam (CID) Hosted by Cisco Corporation, in conjunction with Allegro Great Lakes Users Group Conference Richfield, OH, USA May 24–25 CALCE/IPC Joint JISSO Seminar on Advanced Interconnection Solutions College Park, MD, USA
June 15–16 IPC Summit on American Competitiveness Combining Capitol Hill Day and a conference focused on the needs of the U.S. electronics industry Washington, D.C., USA June 21–23 IPC International Conference on Flexible Circuits Minneapolis, MN, USA
Sept 21–22 IPC Midwest Conference and Exhibition Now Accepting: Paper Proposals Exhibit Today! www.IPCMidwestShow.org