2014 IPC APEX EXPO by IPC

MEETINGS & EDUCATION > March 23-27, 2014 CONFERENCE & EXHIBITION > March 25-27, 2014 速

MANDALAY BAY RESORT AND CONVENTION CENTER

LAS VEGAS, NEVADA

www.IPCAPEXEXPO.org

DESIGN | PRINTED BOARDS | ELECTRONICS ASSEMBLY | TEST

There’s no other international event like it in the world!

Technical Conference • Exhibition • Professional Development Standards Development • Certification Be Inspired! Hear about the latest advances in technology, materials and processes to pursue your own innovation. Build Relationships! Connect with thousands of your peers and thought leaders from more than 50 countries. Drive Your Continued Success! Get the tools, expertise, contacts and insights to address your most pressing challenges and prepare for the future.

THIS EVENT IS …

Produced by: IPC — Association Connecting Electronics Industries® Supported by: China Printed Circuit Association (CPCA) European Institute of Printed Circuits (EIPC) Hong Kong Printed Circuit Association (HKPCA) Int’l Electronics Manufacturing Initiative (iNEMI) Indian Printed Circuit Association (IPCA) JPCA-Japan Electronics Packaging and Circuits Assn.

JEDEC Solid State Technology Association Korea Printed Circuit Association (KPCA) Microelectronics Packaging and Test Engineering Council (MEPTEC) Taiwan Printed Circuit Association (TPCA)

With support from: • AIM Global • ASI Magazine • ASSEMBLY • Circuit Cellar • Circuitnet • Circuits Assembly • EDACafé.com • Electronics Assembly/ Electronics Sourcing North America • Electronics Industry Update • Electronics Protection • Elektor US

• EMChina.org.cn • EMSNow • EPP/EPP Europe • Electronics Purchasing Strategies • FLEX007 • Global SMT & Packaging • Medical Product Outsourcing • Metal Finishing • MoreRFID • The PCB Magazine • PCB007

• PCBDesign007 • PCQR2 — A Partnership between CAT and IPC • Printed Circuit Design & Fab • Printed Circuit Journal • Printed Circuit World • Prototype Today • Silicon Semiconductor Magazine • SMT magazine • SMTnet.com • U.S. Tech • Wiring Harness News

www.IPCAPEXEXPO.org

Table of Contents Invitation . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 2 Schedule of Events. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 3 Exhibitors. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 4 On the Show Floor. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 6 Hand Soldering Competitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Networking Activities . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 9 Keynote Sessions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Programs for Executives . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 12 Programs with a Design Focus. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 13 BUZZ Sessions . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. 14 Technical Conference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Professional Development Courses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Standards Development Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Hotel and Travel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Registration Options . .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. inside back cover

The show, conference and meetings will take place at Mandalay Bay Convention Center, Las Vegas, Nevada USA. 1

Keynote Speakers

Invitation from IPC Chairman Innovation is powered by ideas. With that in mind, IPC APEX EXPO is bringing some of the world’s top thought leaders and experts to share their research, knowledge and visions with you. Idea men, and women, like our keynote speakers who will help you stimulate ideas that may drive the innovations of tomorrow. In addition to being recognized as “the best show

Opening Keynote: CREATING A WORLD OF ABUNDANCE: Exponential Technologies Causing Disruptive Innovations Peter Diamandis, M.D. Chairman & CEO XPrize Foundation

to do business,” IPC APEX EXPO has set out to deliver the most progressive and impactful technical programs to help feed your mind, uncover solutions to your challenges and explore new opportunities. I invite you to join your peers as we share New Ideas for New Horizons.

Sincerely,

Wednesday Keynote: Swarm Robotics and the Toys, Movies and Insects that Made it All Possible James McLurkin

Steve Pudles

Thursday Keynote: The Physics of NASCAR Leslie-Pelecky, Ph.D. www.Diandra IPCAPEXEXPO. org

Schedule at a Glance as of November 15, 2013 Sunday, March 23 8:00 am–6:00 pm Standards Development Committee Meetings 9:00 am–12:00 pm Professional Development Courses 2:00 pm–5:00 pm Professional Development Courses

Monday, March 24 7:30 am–9:00 pm PCB Executive Management Meeting & VIP Dinner 7:30 am–9:00 pm EMS Management Council Meeting & VIP Dinner 7:30 am–2:00 pm Design Forum 8:00 am–5:00 pm Standards Development Committee Meetings 9:00 am–12:00 pm Professional Development Courses 12:00 pm–1:30 pm Event Awards Luncheon 2:00 pm–5:00 pm Professional Development Courses 5:30 pm–6:30 pm FREE International Reception

Tuesday, March 25 7:30 am–8:30 am 8:30 am–9:30 am 9:45 am–10:00 am 10:00 am–5:00 pm 10:00 am–6:00 pm 11:00 am–12:00 pm 12:00 pm–1:30 pm 1:30 pm–5:00 pm 1:30 pm–5:00 pm 4:30 pm–6:00 pm

FREE IPC First-Timers’ Welcome FREE Opening Keynote Ribbon Cutting Ceremony Standards Development Committee Meetings EXHIBITS OPEN IPC Government RElations Committee Open Forum Event Luncheon & IPC Annual Meeting Technical Conference Sessions FREE BUZZ Sessions FREE Show Floor Reception

Wednesday, March 26 7:30 am–8:30 am 8:00 am–5:00 pm 9:00 am –10:00 am 10:00 am–12:00 pm 10:00 am–12:00 pm 10:00 am–6:00 pm 12:00 pm–1:30 pm 1:30 pm–5:00 pm 1:30 pm–5:00 pm 3:30 pm–4:30 pm 6:00 pm

FREE Women in Electronics Networking Meeting Standards Development Committee Meetings FREE Keynote Technical Conference Sessions FREE BUZZ Sessions EXHIBITS OPEN Event Awards Luncheon Technical Conference Sessions FREE BUZZ Sessions FREE Poster Presentations by Authors Exhibitor Networking Functions

Thursday, March 27 8:00 am–5:00 pm 9:00 am–10:00 am 9:00 am–5:00 pm 10:00 am–12:00 pm 10:00 am–12:00 pm 10:00 am–2:00 pm

Standards Development Committee Meetings FREE Keynote Professional Development Courses Technical Conference Sessions FREE BUZZ Sessions EXHIBITS OPEN

All events in blue are FREE with pre-registration. Visit www.IPCAPEXEXPO.org for the most current schedule. Select IPC Standards Development Meetings will take place on Saturday, March 22. Certification programs in design and EMS program management will take place throughout the week. See pages 12–13 for dates and times.

Exhibitors Exhibits Open Tuesday, March 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10:00 am–6:00 pm Wednesday, March 26 . . . . . . . . . . . . . . . . . . . . . . . . .10:00 am–6:00 pm Thursday, March 27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10:00 am–2:00 pm See and compare equipment from more than 400 of the industry’s top suppliers. Discover new processes to gain greater efficiency. Find new suppliers to save you hundreds of thousands of dollars. Uncover new solutions that will improve your bottom line. Every year, attendees tell us that they’ve learned something important or found a critical new supplier, often with a big impact on their companies. That can be your story, too! Exhibits-Only registration is FREE to individuals who pre-register online at www.IPCAPEXEXPO.org. Register today! 3M Electrical Solutions Division ABBA Roller AccuAssembly Acculogic Inc. ACCU-TECH Laser Processing Inc. ACD ACE Production Technologies Aculon, Inc. ADS Gold Inc. Advanced West Aegis Software Agilent Technologies AI Technology, Inc. AIM Air & Water Systems Air Products AIRTECH International, Inc. Air-Vac Engineering Company, Inc. Aiscent Technologies All Flex Flexible Circuits & Heaters all4-PCB (North America) Inc. Allfavor Circuits (Shenzhen) Co., Ltd. Alpha Alpha 1 Technologies ALT-Dynachem American Hakko Products Amerivacs Amistar Automation, Inc. Amtech - Advanced SMT Solder Products AnyLogic North America, LLC. APE.com Apex FA/Mirae Apexyl Enterprises Ltd./Jiujiang Flex Co., Ltd. Apollo Seiko Aqua Klean Systems, Inc.

Aqueous Technologies Arlon Technology Enabling Innovation ASC International Ascentec Engineering Ascentech-GEN3 ASG, Division of Jergens, Inc. Ash Technologies ASM Assembly Systems Assembléon America Inc. Aster Technologies Asys Group Americas Inc. AT&S Americas LLC A-Tek LLC atg-LM Atotech USA Austin American Technology Averna Baker Technology Associates Inc. BigC: Dino-Lite Scopes Blackfox Training Institute, LLC BOFA Americas Inc. BPM Microsystems BTU International Bürkle North America, Inc. CALTEX Scientific Camtek USA, Inc. Cardinal Circuit Carl Zeiss Microscopy, LLC CCI CCPIT.ECC Cencorp CeTaQ Americas CeTaQ Americas Changzhou Quick Soldering Co., Ltd. CheckSum CHEMCUT Corporation Cincinnati Sub-Zero

Circuit Foil Luxembourg Circuits Assembly Cirris Systems Cogiscan Computrol Inc. Conductive Compounds, Inc. Conecsus LLC Control Micro Systems, Inc. Control Systems Design & Automation Count On Tools, Inc. CPCA Creative Electron Crystal Mark, Inc. C-Tech Systems, Inc. CTI Systems Custer Consulting Group CyberOptics Corporation Cytec Industries Dalian Pacific Electronics Co., Ltd. Data I/O Corporation Datapaq, Inc. Daylight Company DDM Novastar De Nora Tech, Inc. DEK International Diamond-MT, Inc. Digitaltest Inc. DIS Inc. Divsys International, LLC DMI International Dow Electronic Materials DownStream Technologies DuPont Electronics E.V. Roberts Eastman Kodak Company Easy Braid Co.

www.IPCAPEXEXPO.org

ECD EIPC, European Institute of Printed Circuits ELANTAS PDG, Inc. Electra Polymers Ltd. Electrolube (HK Wentworth America, Inc.) EMSNow EPTAC Corporation Equipment Technologies, Inc. ERSA North America ESSEMTEC USA Europlacer Exatron Excellon Automation Exopack Advanced Coatings Fancort Industries, Inc. FASTechnologies, Corp. FCT Assembly FEASA Finetech Fischer Technology, Inc. Fisnar Inc. FKN Systek, Inc. FLEXcon FlexLink Systems, Inc. Fralock Fritsch GmbH Fuji America Corporation Gardien Services USA Inc. Glenbrook Technologies, Inc. GOEPEL Electronics GPD Global GSC Hamamatsu Corporation Heller Industries Henkel Electronic Materials LLC HEPCO Inc. Hirox-USA, Inc. Hisco Inc.

Hitachi High Technologies America Hitachi Via Mechanics (USA), Inc. Hong Kong Printed Circuit Association Humiseal - Chase Electronic Coatings I Source Technical Services, Inc. IBE SMT Equipment IBL Technologies LLC ICAPE Group ICSN, Inc. Indian Printed Circuit Association Indium Corporation INGUN USA, Inc. Inovaxe Corporation Insulectro InsulFab PCB Tooling Integrated Process Systems Intercept Technology Inc. Interconnect Systems, Inc. InterLatin Inc. inTest Thermal Solutions Inventec Performance Chemicals Isola iTAC Software AG ITC Intercircuit Ito America Corporation Jabil - Chad Industries Japan Unix JBC Tools USA JMW Enterprises JNJ Industries JPCA-Japan Electronics Packaging & Circuits Assoc. JTAG Technologies Inc. Juki Automation Systems KIC Kingboard Laminates Koh Young Technology Koki Company LTD Kuper Technologies

Kyzen LaserJob Inc. Lewis & Clark, Inc. Lista International LPKF Laser & Electronics M.E.T. M+B Plating Racks MacDermid Inc. Machine Vision Products, Inc. Malcolmtech International Manncorp Maskless Lithography, Inc. MatriX-FocalSpot Inc. Maxpcb Mentor Graphics Corporation MG Chemicals MicroCare Corp. MicroCraft, Inc. Micron Laser Technology MicroScreen, LLC Microtek Laboratories Mid America Taping in Reeling, Inc. Miller-Stephenson Chemical Co., Inc. MIRTEC Corp. mta automation inc. Multek Flexible Circuits, Inc. MYDATA automation, Inc. National Graphic Supply Nihon Superior Co., Ltd. Nikon Metrology, Inc. Nix of America Nordson ASYMTEK Nordson Dage Nordson EFD Nordson YESTech Nortec Systems North Star Imaging, Inc. Novagard Solutions, Inc. nScrypt Inc.

Get a head start on your show experience with CORE APPLICATION ICONS: My APEX EXPO® interactive planner GENERAL SEARCH, AGENDA, PRODUCT SEARCH, SESSION SEARCH, FACI

Learn about all the companies exhibiting •S earch for companies by keyword, category and more. • Read up on exhibitors’ products and services. •A ccess photos, press releases, company contacts and more. • View exhibiting companies on the floor plan. •C ommunicate with exhibitors in advance of the show and schedule appointments with them to CORE APPLICATION ICONS: talk about your needs. GENERAL SEARCH, AGENDA, PRODUCT SEARCH, SESSION SEARCH, FACILITY SEARCH

It’s all at your fingertips in your planner — so you can make informed buying decisions once you’re on-site. Visit www.IPCAPEXEXPO.org/my-show to get started.

FREE Activities On the Show Floor New Products Corridor

View cutting-edge products and services in the New Products Corridor on the show floor. Get a sneak preview of the equipment, materials and services that are breaking new ground in our industry.

Show Floor Reception Tuesday, March 25, 4:30 pm–6:00 pm

Kick back with your colleagues at IPC’s very own happy hour. Walk the exhibition, scope out the new exhibitor offerings and catch up with colleagues.

IPC APEX EXPO® Hand Soldering Competition Tuesday–Wednesday, March 25–26

Do you think you have what it takes to win at soldering? BRING IT!

IPC Hand Soldering WORLD CHAMPIONSHIP Thursday, March 27

Watch the world’s best hand soldering technicians vie for the title of IPC Hand Soldering World Champion.

Exhibitors (continued) Nutek Americas O.C. White Co. Oak Mitsui Inc. OEM Press Systems Inc. Ohmega Technologies Inc. OK International OMG Electronic Chemicals, LLC Omni Training Omron Inspection Systems On Site Gas Systems Inc. On-Hand Adhesives Orbotech, Inc. ORPRO Vision LLC Ovation-Products/DTG International GmbH Oxygen Generating Systems Int’l. P. Kay Metal, Inc. Pac Tech USA Inc. PACE Inc. Panasonic Factory Solutions Company of America Para Tech Coating Park Electrochemical Corp. Parker FNS PCQR2 — A Partnership between CAT & IPC PDQ Precision Inc. PDR America Pemtron Technology Pentagon EMS Petroferm Phibro-Tech, Inc. Photo Stencil Pillarhouse USA Inc. Pluritec North America, Ltd. Polyonics Posalux, SA PPG Industries, Semco (UKTI) Precogs Premier Semiconductor Services LLC Printed Circuit Journal Co. Ltd. Production Solutions, Inc. ProEx Prototron Circuits Purex Fume Extracation PVA Q Corporation Q1 Test Inc. QA Technology Company, Inc. Qioptiq Qualitek International Quasys AG Quick Vision Inc. Quik-Tool, LLC

www.IPCAPEXEXPO.org

Tintronics Industries TMP Inc., A Division of French TOPLINE TPP Transition Automation Inc. U.S. Tech Ucamco USA UL LLC United Resin Corporation Universal Instruments Corporation Uyemura International Corporation Valuetronics Holdings Limited Ventec USA Vi Technology Viscom Inc. Vision Engineering IPC APEX EXPO provides a unique opportunity to Vitronics Soltec talk with suppliers face-to-face and discover new Vitrox Technologies ideas. It allowed me to find effective solutions for VJ Electronix, Inc. V-TEK, Inc. improving our product performance. Weller/Apex Tool Group David Nevo WISE srl Microwave Engineer, Thales Alenia Space World Equipment Source (DBA R-1 Source) Super Dry Scienscope International Wuxi Unicomp Technology Co, Ltd. Taconic SEHO North America, Inc. XACT Taiwan Printed Circuit Association Seica Inc. XJTAG Taiwan Union Technology Corporation X-Line Assets Seika Machinery, Inc. Taiyo America Inc. Semblant XOS Taiyo Industrial Co., Ltd. Senju Comtek Corp. X-Treme Series Auto Dry Cabinet Tamura H.A. Machinery, Inc. Shengyi Technology Co. Ltd./ (EMT) Paramount Laminates Tapco Circuit Supply Yamaha Motor IM America, Inc. Shenmao America Inc. TDI International, Inc. Yincae Advanced Materials LLC ShenZhen Goldsky PCB Technology TDK - Lambda Americas YJ Link America, Inc. Co., Ltd. TE Connectivity Yxlon Shenzhen Kunqi Xinhua Technology Technic Inc. ZESTRON Co., Ltd. Technica USA Zhuhai Kingroad Electronic Co. Shenzhen Youguo Technology Co., Technical Devices Company Zymet, Inc. Ltd. Tecoo Electronics Co., Ltd. Shin-Etsu Silicones of America, Inc. Exhibitor list is current as of Teradyne, Inc. SiFO November 26, 2013 Test Research USA, Inc. Simplimatic Automation Texmac/Takaya Inc. Smart Sonic Stencil & Pallet Cleaning Ticer Technologies QxQ, Inc. Rainbow Technology Systems RBP Chemical Technology, Inc. Real Time with ... IPC Retronix Ltd. Rogers Corporation RPS Automation RS Simmons Co., LLC Saki America, Inc. Samsung C&T Automation, Inc. SANMINA ScanCAD International, Inc. Schleuniger, Inc. Schmid Systems Inc. Schunk Electronic Solutions

Smart Splice LLC SMT North America, Inc. SMTnet SMTXTRA Sonoscan, Inc. Sono-Tek Corporation Sovella Inc. SPEA America Specialty Coating Systems Speedline Technologies, Inc. Speedprint Spindle Dynamics LLC StenTech Stoelting Cleaning Equipment Sunshine Circuits

Hand Soldering Competition March 25–26 and

IPC WORLD CHAMPIONSHIP March 27

Who’s the Best-of-the-Best?

Do you think you have what it takes to win at soldering? Is your company proud of how many IPC Certified Specialists it has on staff? If you think you have what it takes to be a soldering champion, BRING IT at the IPC APEX EXPO Hand Soldering Competition. Cash prizes of $500, $250 and $100 will be awarded to the top three finalists at the close of the competition at 5:00 pm on Wednesday, March 26. Visit www.IPCAPEXEXPO.org/soldering for more information and to submit your entry. The entry deadline is January 31, 2014.

IPC WORLD CHAMPIONSHIP March 27, 2014

The winner of the IPC APEX EXPO Hand Soldering Competition will move on to the IPC WORLD CHAMPIONSHIP on Thursday, March 27 to face off with winners from IPC hand soldering competitions around the world. The winner of the IPC Hand Soldering Grand Championship will be awarded a $1,000 cash prize.

www.IPCAPEXEXPO.org/soldering

Great Networking Activities! FREE! International Reception

IPC Event Luncheons

Monday, March 24 • 5:30 pm–6:30 pm

(registration required)

Our international friends are invited to relax, have a bite to eat and meet their colleagues from around the world at this festive gathering.

Awards Luncheons

FREE! First-Timers’ Welcome

Event Luncheon and IPC Annual Meeting

Tuesday, March 25 • 7:30 am–8:30 am

Monday, March 24 • 12:00 pm–1:30 pm Wednesday, March 26 • 12:00 pm–1:30 pm Tuesday, March 25 • 12:00 pm–1:30 pm

Maximize your time at IPC APEX EXPO. Enjoy a continental breakfast while your colleagues share the ins and outs of this event. Learn how to put IPC’s resources to work for you and your company and find out how to take advantage of everything this event has to offer. Even if you’re not a first-timer, join us for a refresher course on IPC programs.

FREE! IPC Government Relations FREE! Women in Electronics Committee Open Forum Networking Meeting Tuesday, March 25 • 11:00 am–12:00 pm

What are your international, national and regional concerns regarding government regulations and laws impacting your company’s ability to compete globally? Members of the IPC Government Relations Committee will provide an update on key issues impacting your company’s bottom line and give an overview of IPC efforts to support the prosperity of the global electronic interconnect industry. After the overview, there will be open discussion on future issues for the committee to address.

Wednesday, March 26 Breakfast 7:30 am Meeting 7:45 am–8:30 am

Join your colleagues from across the supply chain to share your ideas and experiences as a woman in the electronic interconnect industry and build your network. RSVP through IPC APEX EXPO online registration.

Flickr

Twitter

Retweet

MySpace

StumbleUpon

Digg

Dot

Get Connected! Five Easy Ways!

Mixx

Skype

☞ Twitter: Use #IPCShow ☞ Facebook: www.IPC.org/facebook

FriendFeed YouTube us ☞ LinkedIn: Find Flickr Twitter us at www.ipc.org/linkedin

ne ook

Technorati

☞M y APEX EXPO: Connect with exhibitors and attendees and plan your itinerary before the Delicious Flickr show at www.IPCAPEXEXPO.org/my-show!

LinkedIn Retweet Facebook

☞ IPC Technet: Ask questions and connect with experts at www.ipc.org/technet.

MySpace

9 SlideShare MySpace

Google StumbleUpon

Google Digg Talk

Keynote Sessions

Tuesday, March 25 | 8:30 am–9:30 am

FREE! Opening Keynote CREATING A WORLD OF ABUNDANCE: Exponential Technologies Causing Disruptive Innovations Peter Diamandis, M.D. Chairman/CEO, X PRIZE Foundation

A dynamic inspirational speaker and tech entrepreneur, Dr. Diamandis will share his insights into how breakthroughs in exponentially growing technologies like artificial intelligence, nanomaterials, 3-D printing, robotics and digital medicine will re-engineer products, companies, industries — and even society — over the next 20 years. Through his work, Diamandis has proven the transformational power that exponentially growing technology has on companies, governments and humanity. This inspirational keynote will give you plenty of reasons for optimism … and a roadmap to creating a world of abundance.

www.IPCAPEXEXPO.org

Wednesday, March 26 | 9:00 am–10:00 am

Swarm Robotics and the Toys, Movies and Insects that Made it All Possible James McLurkin Roboticist, Inventor, Researcher and Teacher

They will flock. They will swarm. And they will tackle dangerous, dirty and dull jobs — from Mars exploration and search-and-rescue missions to warehouse operations. They’re multirobot systems, and one day they will become the norm, according to roboticist and inventor James McLurkin. Get a fascinating look at the future of robotics … and the technology that is making it happen.

Thursday, March 27 | 9:00 am–10:00 am

The Physics of NASCAR

Diandra Leslie-Pelecky, Ph.D. Physicist, Researcher and Author How do you design and manufacture a car that will move at speeds in the neighborhood of 200 mph (321 km/h) — yet handle with precision and, most important, keep the driver alive? What technology makes a NASCAR car different from the vehicles you see on the highways every day? Dr. Leslie-Pelecky will take you behind the scenes of America’s most popular spectator sport and explain the feats of engineering that make NASCAR work, tracing the lifecycle of a racecar from its creation to the action of the NASCAR series.

Programs for Executives IPC PCB Supply Chain Leadership Meeting Monday, March 24 • 8:00 am–5:00 pm (includes networking breakfast, lunch and dinner)

A learning and networking forum exclusively for senior-level executives of PCB fabricators and their suppliers, this meeting focuses on issues related to executive decision making in the industry, such as market trends, customer requirements and the economy. Hear from noted industry experts and find out how your peers are addressing common challenges.

IPC EMS Management Council Meeting Monday, March 24 • 8:00 am–5:00 pm (includes networking breakfast, lunch and dinner)

Receive the information you need to lead. With a unique high-level focus, this event will keep you up on current trends and strategies so you can make the best choices for your company’s future. Network with your peers and learn how other EMS executives are resolving problems that you are also facing. Must be a representative of an EMS company to attend. Agendas will be available soon. For the most current information on the EMS management and PCB supply chain leadership programs, visit www.IPCAPEXEXPO.org/executives.

IPC EMS Program Management Training and Certification Exclusively from IPC, this comprehensive training program is a three-part course that tailors topics, such as operations management, finance management, contract management and leadership skills, for the EMS industry. Begin your training for the respected CEPM credential at IPC APEX EXPO.

Essentials of EMS Program Management Thursday, March 27 • 8:00 am–5:00 pm Friday, March 28 • 8:00 am–5:00 pm Saturday, March 29 • 8:00 am–5:00 pm

EMS Leadership Training: Friday, March 28 • 8:00 am–5:00 pm

EMS Program Management Training and Certification Exam Saturday, March 29 • 8:00 am–12:00 pm

Visit www.IPCAPEXEXPO.org/EMScert to learn more about the program or to download a registration form.

www.IPCAPEXEXPO.org

Technical Education with a Design Focus A commitment to professional development makes a difference not only to your career, but also to your customers, suppliers and employees. IPC APEX EXPO’s design-focused activities will benefit engineering staff and managers in design, sales, purchasing and quality. Register today for the Design Forum or get the most education from your investment by registering for the All-Access Package. •D esign Forum — Half-day educational program featuring presentations by experts in design • Professional Development Courses — Three-hour classes led by subject-matter experts • Designer Certification Program — Basic (CID) and advanced (CID+) • Exhibition — Many of the more than 400 exhibitors can help you address your design challenges. For more information on design-focused programs, visit www.IPCAPEXEXPO.org/design.

Design Forum Monday, March 24

Stay on top of design advancements, sharpen your skills and network with leaders in the industry. 7:30 am Networking Breakfast 8:00 am Keynote: New Elements of IPC Design Programs Gregory Munie, Ph.D., Director of Design Programs, IPC 8:15 am Real Version Control: Gateway to Effective Data Management and Design Collaboration Benjamin Jordan, Senior Manager, Content Marketing Strategy, Altium 9:30 am Enabling I/O Optimization with 3-D SoC, SiP and PCB Co-Design Humair Mandavia, Solutions Architect, Zuken USA 10:00 am Break 10:15 am A Revolutionary New Routing Method Charles Pfeil, Engineering Director, Mentor Graphics

11:00 am Enabling Efficient, Collaborative Design with IPC-2581 Gary Carter, Senior Manager of CAD Engineering, Fujitsu Network Communications 11:45 am Documentation, Documentation, Documentation – And Did I Say Documentation? Karen McConnell, Manager of EDA, Northrop Grumman Corporation 12:30 pm Life is About to Get Better: Status Report on the 770 Re-Write Tom Hausherr, President, PCB Libraries Dieter Bergman, Director of Technology Transfer, IPC 1:15 pm Networking Lunch 2:00 pm Professional Development courses (separate registration is required)

IPC Designer Certification (CID and CID+) The IPC Designer Certification or CID (Certified Interconnect Designer) and CID+ (Advanced Certified Interconnect Designer) are the industry’s premier professional development programs focused on PCB design philosophy and requirements. If your passion is the transformation of electrical schematics and descriptions into works of art that can be manufactured, assembled and tested, these programs are for you.

Workshops: CID and CID+

Exams: CID and CID+

Friday, March 21 • 8:00 am–5:00 pm Saturday, March 22 • 8:00 am–5:00 pm

Sunday, March 23 • 8:00 am–5:00 pm

Separate registration is required at www.IPCAPEXEXPO.org/designer-cert. Courses and exam will be administered by

FREE BUZZ Sessions What’s got the industry buzz’n? Check out these FREE sessions to keep yourself in the loop.

BZ1 Underwriters Laboratories: Updates

Tuesday, March 25 • 1:30 pm-3:00 pm Speakers: Crystal Vanderpan, UL LLC; Douglas Sober, Shengyi Technology Co. Ltd.

What do the new definitions in UL 746E mean to the electronics manufacturing industry? This session will review UL activities surrounding the standard’s revision which goes into effect in June 2014, and outline its impact on industry. The session will also cover how UL component recognition, in terms of component characterization testing, helps with end-product certification.

BZ2 P romoting Excellence: New IPC

Standards for Reliability and Quality, and IPC Validation Services Program

Tuesday, March 25 • 3:30 pm-5:00 pm Moderator: Jasbir Bath, IPC Speakers: John Davignon, Davignon Consultancy, LLC; Eddie Hofer, Rockwell Collins; Jason Keeping, Celestica; Nick Koop, CID, TTM Technologies; Randy Cherry, CIT, CID IPC

Get an overview of IPC-9641, High Temperature Printed Board Flatness Guideline, a new standard that provides guidance on methods and procedures for critically evaluating the relative change in shape (printed board flatness) of local areas of interest during a simulated temperature reflow cycle. Learn about new updates to IPC-6013, Qualiﬁcation and Performance Speciﬁcation for Flexible Printed Boards; IPC-A-630, Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures; and IPC-HDBK-830A, Guidelines for Design, Selection, and Application of Conformal Coatings and find out how the Validation Services program is enhancing supply chain management.

Validation Services

Supply chain procurement quality assurance is getting easier The IPC Qualified Products List (QPL) and Qualified Manufacturers List (QML) programs provide auditing and certification to companies in the electronics manufacturing industry on their products and processes which conform to the requirements of IPC standards and specifications. These programs also provide verification of conformance to the IPC standards through third-party testing.

Leverage IPC’s network of trusted sources to: • Reduce time to market • Improve operational efficiency • Optimize supply chain performance Learn more at BUZZ Session BZ2 or visit www.ipc.org/validation

www.IPCAPEXEXPO.org

From keynote speeches, BUZZ sessions and opportunities to network with colleagues to vendor booths on the show floor, IPC APEX EXPO offers a wellrounded, impressive learning environment. Rosemary Rubin QC Material Analyst Johns Hopkins University Applied Physics Laboratory

BZ3 F orbidden by the Government:

Electronics’ Materials Restrictions

Wednesday, March 26 • 10:00 am-12:00 pm Moderator: Fern Abrams, IPC

The EU Commission is currently reviewing the list of substances restricted under RoHS and has prioritized 23 additional substances to be reviewed for restriction, including a number of phthalates and TBBPA, the most common flame retardant in PCBs. Meanwhile, 144 substances have been placed on the EU’s REACH Substances of Very High Concern (SVHC) Candidate List, and the State of California’s Safer Consumer Products Regulation, which requires manufacturers to seek safer alternatives to harmful chemical ingredients used in products, went into effect on October 1, 2013. This session will feature experts on the current and anticipated substance restrictions affecting the electronics industry.

BZ6 Counterfeit Components

Wednesday, March 26 • 3:30 pm-5:00 pm Moderator: Dennis Fritz, MacDermid, Inc. Speakers: Mark Schaffer, iNEMI; Robert Metzger, Rogers Joseph O’Donnell; Mark Northrup, IEC Electronics Corp.

Counterfeit components have grown into a multimillion dollar problem. New standards and guidelines are available to help establish and maintain product traceability, and inspection and detection protocols. Find out where possible points of entry exist in the supply chain, hear about the impact of counterfeit components on the industry at various points of use and learn about new risk assessment matrices.

BZ7 i NEMI Surface Mount Assembly and Rework Reliability Forum

Thursday, March 27 • 10:00 am-12:00 pm Moderator: Robert Pfahl Jr., Ph.D., iNEMI

Get an inside look at the results of the iNEMI SMT and Rework Project Phase 3 — Reliability Evaluation. iNEMI Payette 2 test vehicles were manufactured using lead-free assembly and rework processes; and then, as-assembled and reworked boards underwent accelerated thermal cycling to validate the assembly and rework processes. Session leaders will examine the assembly and rework processes used for the test, explain results of the thermal cycling and share conclusions.

BZ4 iNEMI Sustainability Forum

Wednesday, March 26 • 1:30 pm-3:00 pm Moderator: Robert Pfahl Jr., Ph.D., iNEMI Speakers: Leo Kenny, Intel; Wayne Rifer, Green Electronics Council

Continuing a decade-long tradition, iNEMI will review its recent environmental projects and introduce future sustainability initiatives that are under way. This session will highlight new results from the Alternative Material Assessment Project, Metals Recycling and Quantifying Reuse, Repair and Recycling Project.

BZ5 A dvanced Fabrication Instruction

Exchange Between Design and Manufacturing: The IPC-2581 B Model

Wednesday, March 26 • 3:00 pm-5:00 pm Moderator: Gregory Munie, Ph.D., IPC Speakers: Gary Carter, Fujitsu Network Communications; Dieter Bergman, IPC

Manufacturability, quality, reliability and consistency in electronics assemblies begin with communication. This session will feature updates on IPC-2581, a generic standard for printed board assembly products’ manufacturing description data and transfer methodology. Learn what’s new with IPC-2581, and see how it facilitates transmission of information between a printed board designer and a manufacturing or assembly facility.

Technical Conference Recognized worldwide as the finest and most selective in the world, the IPC APEX EXPO technical conference presents new research and innovations from experts in the areas of board fabrication and design, electronics assembly and test.

Sign up for one day, the full conference or get the most for your money with the All-Access Package. Register by February 28 and save 20%. S01 Hot Topic—Cleaning

Tuesday, March 25: 1:30 pm-3:00 pm Beverley Christian, Ph.D., BlackBerry

Is there a new low-global warming potential (GWP) solvent on the horizon? What will be the effect of the HCFC-225 ban on electronics cleaning? How good is a multi-variable sensing approach to contamination control in a closed loop cleaning system? Find out the answers to these questions and more. • Alternative Solvent with Low Global Warming Potential Rajat Basu, Ph.D., Honeywell • HCFC-225 Phase-out — What Now? Edward Kanegsberg, Ph.D., BFK Solutions • Concentration Monitoring & Closed Loop Control Phase 2 — A Paradigm Shift Umut Tosun, ZESTRON America

S02 P CB (Thermal Considerations/ Management)

Tuesday, March 25: 1:30 pm–3:00 pm

Learn several approaches to thermal management at the PCB level, including standard thermal solutions and development of copper filled thermal vias in thin board constructions as well as different buildup concepts (e.g., cavities) with thermal simulations being shown. The session will also present guidelines for insulated metal substrate printed boards and describe several methods for manufacturing aluminum circuit boards that bypass the soldering process. Representative samples and prospective aluminum circuit assembly constructions will be shown along with FEA models and early reliability data. • Aluminum — A Highly Sustainable and Environmentally Friendlier Alternative Substrate for Future Circuit Assemblies Joe Fjelstad, Verdant Electronics • Optimizing the Insulated Metal Substrate Application Through Proper Material Selection and Circuit Fabrication Processes David Sommervold, The Bergquist Company, Prescott • Advanced Thermal Management Solutions on PCBs for High Power Applications Gregor Langer, AT&S Austria Technologie & Systemtechnik AG

S04 Printing I

Tuesday, March 25: 1:30 pm–3:00 pm Jeff Schake, DEK International

Although the architectural form of solder paste printing stencils have remained consistent since their introduction into SMT, the technology advancements for these highly engineered templates may not be obvious to the end user. Aperture fabrication methods, foil materials and post process surface treatments represent such veiled enhancements that can differentiate stencil printing capability. This stencil research-focused session describes selected latest developments, quality characterizations and SPI referenced print performance comparisons. • Print Performance Studies Comparing Electroform and Laser-Cut Stencils Rachel Miller-Short, Photo Stencil Inc. • Quantifying Stencil Aperture Wall Quality Christopher Tibbetts, Analogic Corporation • Development, Testing and Implementation of SAMP-Based Stencil Nano Coatings Chrys Shea, Shea Engineering Services

www.IPCAPEXEXPO.org

S05 PCBA Reliability — Pad Cratering Tuesday, March 25: 1:30 pm–3:00 pm Russell Nowland, Alcatel-Lucent

With pad cratering plaguing the electronics industry, research is underway to understand the issue and how to prevent it. We know the increase of pad cratering is due to higher-temperature laminates being more brittle — but how do we test a material to determine its susceptibility? The papers in this session will explore some innovative test methods that reveal a laminate material’s susceptibility to pad cratering. • Numerical Study on New Pin Pull Test for Pad Cratering of PCB Billy Hu, Flextronics • Pad Crater Susceptibility Testing with Acoustic Emissions Boon San Wong, Agilent Technologies Malaysia Sdn.Bhd. • Novel Approaches for Minimizing Pad Cratering Chen Xu, Ph.D., Alcatel-Lucent

S06 Hot Topic — Automation

Tuesday, March 25: 1:30 pm–3:00 pm

Evolving manufacturing approaches and renewed interest in automation and robotics have the potential to change the way we manufacture today and tomorrow. Expanding the automation in the discrete automation steps of SMT and back-end operations into systems that build integrated products may lead to factories that produce closer to, or at, the point of consumption. To do that, adjacencies must be leveraged from the discrete automation that already exists in electronics manufacturing to enable next generation automation. This session will discuss automation in electronics, manufacturing automation trends, robotics soldering, automated mechanical assembly, haptics, DFX for automation and 3-D manufacturing.

S07 Nanomaterials

Tuesday, March 25: 3:30 pm–5:00 pm Alan Rae, Ph.D., Nanomaterial Innovation Center

As we move to semiconductor nodes at 20nm and below, interconnection needs are changing. Distribution pitch and the size of a particle of conventional solder powder are converging as 2.5-D and 3-D packages gain ground. Solder bumps and reflow are reaching their limits and being replaced by copper pillars and thermocompression bonding. This session discusses some of the newer interconnect technology concepts addressing these challenges, including nano-sized copper, carbon nanotubes and nanowires. • Lead-Free Nano Solder Based Materials for Micro/Nanoelectronics Assembly and Integration Fan Gao, Ph.D., University of Massachusetts Lowell • Embedded Fibers Enhance Nano-Scale Interconnections Vincent Desmaris, Ph.D., Smoltek AB • Nano Copper Based Solder-Free Electronic Assembly at 200°C Alfred Zinn, Ph.D., Lockheed Martin

S08 PCB Reliability

Tuesday, March 25: 3:30 pm–5:00 pm

This session will characterize the degradation of interfacial bonds between glass fibers and organic resin in the PCB which can lead to conductive filament formation (CFF); use a Design of Experiment (DOE) to determine if there is a relationship between the PCB fabrication process and the development of fine copper barrel cracks; and present a method to help characterize and determine the sensitivity of various materials and processes to CAF (conductive anodic filamentation). • An Experimental Approach to Characterizing CAF Christopher Hunt, Ph.D., National Physical Laboratory • Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Wade Goldman, Draper Labs • An Examination of Interfacial Degradation in Printed Circuit Boards Bhanu Sood, University of Maryland

Technical Conference S09 Solder Paste Reliability

Tuesday, March 25: 3:30 pm–5:30 pm Beverley Christian, Ph.D., BlackBerry

The session will examine the effect of low stand-off, short distances and higher voltages on SIR results; compare no-clean and water wash solder pastes in printing, reflow, cleaning and SIR; and explore the effect of different reflow profiles on SIR results. The session will also review the use of epoxy flux and package-on-package application. • New Requirements for SIR Measurement Joerg Trodler, Heraeus Materials Technology GmbH & Co. KG • Reliability Assessment of No-clean and Water-soluble Solder Pastes Emmanuelle Guene, Inventec Performance Chemicals • The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues Eric Bastow, Indium Corporation of America • Low Cost High Reliability Assembly of PoP with Novel Epoxy Flux on Solder Paste Ning Cheng Lee, Ph.D., Indium Corporation

S10 Printing II

Tuesday, March 25: 3:30 pm–5:00 pm Tim Jensen, Indium Corporation

Many argue that printing is the most important step in the surface mount manufacturing process. This session will look at stencil mounting systems and examine the effects of foil mounting techniques with respect to uniformity and planarity of the foil, as well as the printing of miniature devices alongside the traditional larger footprint devices for automotive and industrial manufacturing applications while ensuring a high yield print process. Enclosed media print head technology as an alternative to metal squeegee blade solder paste printing will also be explained. • Analysis and Characterization of Stencil Mounting Systems: The Reality of Foil Tensions of SMT Stencils Ricky Bennett, Ph.D., Assembly Process Technologies • An Investigation into Printing Miniaturized Devices for the Automotive and Industrial Manufacturing Sectors Clive Ashmore, DEK Printing Machines Ltd. • Enclosed Media Print Head Technology as an Alternative to Metal Squeegee Blade Solder Paste Printing Michael Martel, Speedline Technologies, Inc.

S11 PCB Fabrication I

Tuesday, March 25: 3:30 pm–5:00 pm Todd MacFadden, Bose Corporation

This session will focus on reducing inner layer defects such as cut circuits or opens by using Six Sigma methodology resulting in defect reduction of more than 50 percent, and provide an analysis of the key cost drivers and comparisons for two fabrication approaches: traditional sequential lamination methods versus

interconnecting with conductive paste. In addition, an investigation into using a microwave plasma treatment to improve adhesion strength between direct electroless copper plating and PTFE will be discussed. • Cost Comparison of Complex PCB Fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste Chet Palesko, Savansys Solutions LLC • Effect of Microwave Plasma Surface Treatment for Improved Adhesion Strength of Direct Cu Plating on Polytetrafluoroethylene (PTFE) Akira Takeuchi, Nissin Inc. • Reduction of Inner Layer Defects Using Six Sigma Methodology Prasad Mushti, FTG Circuits, Inc.

S12 Hot Topic — OnShoring

Tuesday, March 25: 3:30 pm–5:00 pm

The 2013 update to IPC’s study, On-Shoring in the Electronics Industry: Trends and Outlook for North America, confirms that companies continue to locate new operations and are returning some existing ones to North America. It also finds that more on-shoring is planned for the coming year. How will on-shoring, re-shoring and right-shoring affect you? Learn what the trends mean to your company. • On-Shoring in the Electronics Industry Sharon Starr, IPC

S13 Automation in Assembly and Reflow Wednesday, March 26: 10:00 am–12:00 pm Jeff Schake, DEK International

In this dual-topic session, the first half will address integrated automatic position systems for selective soldering and rework equipment. Descriptions of unique placement technologies, accuracy test results and functional significance to assembly success will be reviewed for both applications. The second half will be more process and materials directed, with a focus on assembled solder joint quality relating to both reflow management and PCB surface finish. Hear from representatives of equipment manufacturers and EMS companies. • Position Accuracy Machines for Selective Soldering Fine Pitch Components Gerjan Diepstraten, CIT, Vitronics Soltec • New Placement Technology for Rework Systems Joerg Nolte, ERSA GmbH • Minimizing Tombstones through Reflow Air Velocity Optimization Matt Amidon, EPE Corporation • Study of Various PCBA Surface Finishes Georgie Thein, Flextronics International

www.IPCAPEXEXPO.org

S14 Solder Mixing/Reliability

Wednesday, March 26: 10:00 am–12:00 pm Russell Nowland, Alcatel-Lucent

With the migration to lead-free soldering materials, a host of challenges have emerged — from higher process temperatures to long-term reliability issues due to rigidity of the lead-free solder and the presumed risk of mixing alloys. This session will look at reliability aspects of low and medium melting point solder formulations using varying amounts of bismuth, and reliability testing of mixed alloy BGA assemblies in a military application using HALT (highly accelerated life test) techniques. A standardized test method to compare alloys as well as tin whisker testing of solder alloys will also be reviewed. • Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly Ning-Cheng Lee, Ph.D., Indium Corporation of America • HALT Testing of Backward Soldered BGAs on a Military Product Linda Woody, Lockheed Martin Missile & Fire Control • Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi Joseph Juarez Jr., Ph.D., Honeywell Air Transport Systems and Polina Snugovsky, Ph.D., Celestica • Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys Karl Seelig, AIM, Inc.

S15 A ssembly and Reliability of Bumped Components

Wednesday, March 26: 10:00 am–12:00 pm Wayne Johnson, Ph.D., Tennessee Tech University

“Bumped” components range from BGA packages to semiconductors with copper-pillar micro-bumps. Bump co-planarity is a critical issue for high yield assembly. High speed solder ball height measurement is required in high-volume production. Fine pitch CSPs present assembly challenges and the pad design, solder printing, reflow profile and use of underfill all impact solder joint reliability. Assembly of bare semiconductor die with copper-pillar micro-bumps and gold stud bumps can be assembled without the use of solder using thermo compression bonding. This session examines assembly, design and reliability aspects of using “bumped” components. • Flip Chip Gold Stud Bump Bonding on Molded Interconnect Devices Liu Weifeng, Huawei Technologies Co., Ltd. • Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP (Thermal Compression with Non-Conductive Paste Underfill) Method Myung-June Lee, Altera Corporation • Study on Solder Joint Reliability of Fine Pitch CSP Hill Liang, MIT, Flextronics Mfg. (Zhuhai) Co. Ltd. • Stereo Vision Based Automated Solder Ball Height Detection Jin Jun Li, CID, Huawei Technologies Co., Ltd.

S16 Test I

Wednesday, March 26: 10:00 am–12:00 pm Steve Butkovich, OnCore Manufacturing of Fremont

Advancing techniques in printed circuit assembly are creating changes in tools and methods used for electrical test of the assemblies as well as new design for test requirements. This session will discuss some of those changes and best practices as well as challenges in providing high test coverage at the electrical printed circuit assembly test area. • Implementing a Robust Bead Probe Test Process into Standard Pb-Free Assembly John McMahon, Celestica • Investigation into Challenges of Using .BSDL Files Philip Geiger, Dell Inc. • Built-In Self-Test (BIST) Short-Term and LongTerm Strategies for Use Case Standardization Zoe Conroy, Ph.D., Cisco Systems Inc. • Good Product Quality Comes From Good Design for Test (DFT) Strategies Adrian Cheong, Agilent Technologies

S17 Hot Topic — Printed Electronics I

Wednesday, March 26: 10:00 am–12:00 pm Patricia Goldman, P. J. Goldman Consulting

The global printed electronics market is being fueled by a range of new applications with matching technological advancements in materials and processes. In this session, authors will present new developments in the printing of electronic circuits and packaging and in substrates for flexible electronics exploring the typical issues associated with substrate development and selection. In addition, a case study on the transition from a traditional coated battery design to a digitally printed one will be described. • Advanced Printing for Microelectronic Packaging Kenneth Church, Ph.D., nScrypt Inc. • Substrates: Polyester Film for the Flexible Electronics Industry Scott Gordon, DuPont Teijin Films • Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery: Advantages, Challenges and Successes Dan Tillwick, Solicore

S18 Rework

Wednesday, March 26: 1:30 pm–3:00 pm Bob Wettermann, BEST Inc.

This session will cover rework of electronics assemblies, addressing challenges related to rework of smartphones and tablets including removal and replacement of PoP (package-on-package) and fine pitch BGA components. It will also review the iNEMI Rework Roadmap. • Rework Challenges for Smart Phones & Tablets Paul Wood, OK International • iNEMI Rework Roadmap Jasbir Bath, IPC

Technical Conference S19 PCB Microvia Reliability

S21 PCB (Electrical Test): Test II

With increasingly complex PCB designs, microvia reliability remains an important subject. Different microvia stacking options and aspect ratios are important design considerations from both a density and reliability perspective. For a given design, reliability is further impacted by the choice of dielectric material, via morphology, surface preparation and copper plating type and thickness. Unfortunately, every microvia does not replicate the design and process intent. Simulations can be used to study the influence of manufacturing quality on reliability. This session provides a comprehensive examination of factors influencing microvia reliability. • Effects of Dielectric Material, Aspect Ratio, Morphology and Copper Plating on Microvia Reliability Thomas Lesniewski, Northrop Grumman Mission Sys. • Reliability of Stacked Microvia Hardeep Heer, FTG Circuits; Ryan Wong, FTG Circuits • Simulation of the Influence of Manufacturing Quality on the Reliability of Microvias Yan Ning, University of Maryland

In today’s ever-changing PCB industry, electrical testing and validating state-of-the-art technologies becomes more difficult. This session will investigate and discuss the use of 4 Wire Kelvin testing for extremely high aspect ratios and HDI structures. Additionally, the electrical test of active/passive buried components such as capacitance cores or resistors will be discussed and insights into success in testing these structures will be shared. • What is Kelvin Test Electrical Test Consideration? Rick Meraw, Gardien Services USA, Inc. • Electrical Test of Active/Passive Components Todd Kolmodin, Gardien Services USA, Inc.

Wednesday, March 26: 1:30 pm–3:00 pm Wayne Johnson, Ph.D., Tennessee Tech Univ.

S20 Reliability

Wednesday, March 26: 1:30 pm–3:00 pm Dennis Fritz, MacDermid, Inc.

Papers in this session determine the failure point for solder joints, measure the fatigue-induced failure from low stress but very frequent power cycling, and develop a predictive model for component failure due to moisture ingress. This session will be of particular interest to reliability engineers and board assembly designers. Modeling and simulation are used in all papers. • Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Ph.D., DfR Solutions • Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation Junaid Shafaat, Lotek Wireless Inc. • A Control-Chart Based Method for Solder Joint Crack Detection Jianbiao (John) Pan, Cal Poly State University

Wednesday, March 26: 1:30 pm–3:00 pm David Hoover, TTM Technologies

Attending the technical sessions and professional development courses at IPC APEX EXPO is an excellent way to learn about new materials development and processing issues that affect the electronics assembly industry. Randy Hasken Process Technology Engineering Manager Danfoss Drives

S22 ESD

Wednesday, March 26: 1:30 pm–3:00 pm Jerry Karp, JSK Associates

With the push for ever-improving performance on semiconductor component I/O interfaces, semiconductor components are being driven into a realm that makes them more sensitive to electrostatic discharge. This session will discuss semiconductor components that have been directly exposed to ESD events by automated surface mount equipment. It will also include a review of ESD exposure along every step of the SMT assembly process, and outline recommended mitigation methods and control systems for ESD working areas and machines — all with an emphasis on cost-effectiveness. • Electrostatic Discharge Considerations in Surface Mount Technology Julian Montoya, Intel Corporation • Electrostatic Discharge (ESD), Factory Issues, Measurement Methods and Product Quality Hartmut Berndt, B.E.STAT European ESD competence centre

www.IPCAPEXEXPO.org

S23 Hot Topic — Printed Electronics II

Wednesday, March 26: 1:30 pm–3:00 pm Patricia Goldman, P. J. Goldman Consulting

• Josh Goldberg, Taiyo America, Inc. • Glass for Wi-Fi and Microwave Application with Through Glass Vias and Thick Film Copper Metallization Vern Styger, ACGM Electronics America

S24 PCB Plating

Wednesday, March 26: 3:00 pm–5:00 pm Todd MacFadden, Bose Corporation

This session will discuss challenges and developments during plating for copper via-fill for applications such as smartphones and tablet PCs, including zero tolerance of dimples/voids as well as minimal copper build-up for ultra-fine line circuit formation along with reduced plating cycle times. New approaches for acid copper plating using insoluble anodes that are isolated from the main plating bath to obtain a surface free of nodules and pits, as well as precise control of copper thickness distribution minimizing the impact of breakdown products will be shared. This session covers the results from prototype testing through implementation into production. The IPC 4-14 plating subcommittee has issued a series of plating specifications which will also be discussed. • The Total Environmental Solution For Any-Layer HDI Production Steven Tam, ALPHA Alent • The Perfect Copper Surface Eric Stafstrom, Technic Inc. • An Overview of IPC Plating Specification Completions, Revisions and Future Plans George Milad, Uyemura International Corp.

S25 PCB/High Speed I

Wednesday, March 26: 3:30 pm–5:00 pm David Hoover, TTM Technologies

When PCBs are used in very high speed applications, they are no longer just a series of point A to point B copper wire connections. The behavioral characteristics of all the composites that go into making a PCB become very important as the operating frequency goes up. This session includes topics such as electrical performance and loss of low profile copper (roughness) and laminates along with various studies at different frequencies. HDI structures supporting 3G, 4G and up to satellite frequencies will also be discussed. • Alternative Concepts for High Speed, High Frequency & Signal Integration into the PCB Erich Schlaffer, AT&S Austria Technologie & Systemtechnik AG • Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region Elaine Liew, Mitsui Copper Foil (M) Sdn. Bhd. • How Low Can Epoxy Go? Joey Storer, Dow Chemical Company

S26 Miniaturization and High Density

Wednesday, March 26: 3:30 pm–5:00 pm Wayne Johnson, Ph.D., Tennessee Tech Univ.; Liu Weifeng, Huawei Technologies Co., Ltd.; Jeff Schake, DEK International

This session will explore placement equipment, assembly materials and process controls for 03015M chip components with adaptive process controls to place components to the solder position rather than the land pad. Papers will also cover different layout, assembly and material selections to reduce component-to-component spacing down to 100um spacing with different solder pastes, stencil types and stencil thicknesses evaluated to achieve the lowest possible DPMO values. Cavity technology in printed boards will also be reviewed in terms of cavity design and assembly issues identified during design of experiments (DOEs). • Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Michael Cieslinski, Panasonic Factory Solutions Company of America • Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Flextronics • Benefit and Challenges of Manufacturing with Printed Circuit Board Cavities Pedro Martinez, Intel Corporation

S27 Printing III

Wednesday, March 26: 3:30 pm–5:00 pm Eric Bastow, Indium Corporation of America

Depositing solder paste onto PCB pads in a repeatable and precise manner as well as achieving the proper paste volume continues to be a key aspect in the overall SMT assembly process. Changes in pad geometry and size, component and board challenges, improvements in traditional and new paste deposition (jetting) and measurement techniques will be the focus of this session. Engineers and operators with a keen interest and appreciation for the solder paste printing process and the repeatability of SPI (solder paste inspection) equipment and measurement accuracy and its impact on product reliability should attend. • Solder Paste Screen-printing — Quality Assurance Process Lars Bruno, Ericsson AB • Jetting Strategies for Mbgas — A Question of Give or Take… Gustaf Martensson, Ph.D., Micronic Mydata AB

S28 Embedded Technology

Wednesday, March 26: 3:30 pm–5:00 pm Rajesh Kumar, Viasystems North America, Inc.

• Implementing the Latest Embedded Component Technology from Concept-to-Manufacturing Humair Mandavia, Zuken USA, Inc. • Embedded vs. SMT: A Comparative Analysis of Reliability Guenther Mayr, AT&S Austria Technologie & Systemtechnik AG

Technical Conference S29 Reliability — Corrosion and Tin Whiskers Thursday, March 27: 10:00 am–12:00 pm Dennis Fritz, MacDermid, Inc.

Of particular interest to reliability engineers and those designing for harsh environments, this session views long-term reliability problems with circuit board assemblies. Creep corrosion will be discussed, based on both mixed flowing gas and flowers of sulfur testing. The corrosion protection afforded by conformal coating the assembly will be reviewed. And, actual multi-year observations of tin whisker formation and penetration of conformal coatings will be reported. • Evaluating Corrosion Resistance of Ceramic Resistors: Mixed Flowing Gas versus Flower of Sulfur Tests Michael Osterman, Ph.D., University of Maryland • Tin Whisker Risk Management by Conformal Coating Linda Woody, Lockheed Martin Missile & Fire Control • Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber Prabjit Singh, IBM Corporation • Effectiveness of Conformal Coat to Prevent Corrosion of Nickel Palladium Gold Finished Terminals Michael Osterman, Ph.D., University of Maryland

S30 PCB/High Speed II

Thursday, March 27: 10:00 am–12:00 pm Gary Ferrari, CID+, CIT, FTG Circuits

The current drive to higher speed applications in the 2+Ghz range has placed greater demands on designs, material performance and product performance verification. This session will look at what must be done to extract more performance out of epoxy laminates, as well as the various test methods used to verify electrical performance characteristics of these halogen-free laminate materials. • Evaluation of High Speed/High Frequency Test Methods for Critical Signal Integrity Laminate Material Selection Karl Sauter, Oracle America, Inc. • Overview of High Frequency RF Radiation Effects and Losses for PCBs John Coonrod, Rogers Corporation • Insertion Loss Reduction through Non-roughening Inner layer Surface Treatments Scott Hinaga, Cisco Systems • New High Performance Organophosphorous Flame Retardant Kimberly White, Ph.D., Albermarle Corporation

S31 BTC Reliability

Thursday, March 27: 10:00 am–12:00 pm Brook Sandy-Smith, Indium Corporation of America

The use of bottom terminated components (BTC) has become extremely popular because of their low cost and good thermal and electrical performance. But the challenge for the industry is knowing how to achieve the best possible assembly and reliability of BTCs. Attendees will be presented with information discussing reliability in terms of stand-off height and component die size and solder joint void size as well as thermal modeling, automated X-ray inspection versus 2-D X-ray and crosssectional analysis in addition to cleaning of residues under BTC components. Join us as we take a first-hand look into this expanding area. • Combination of Spray and Soak Improves Cleaning under Bottom Terminations Mike Bixenman DBA, Kyzen Corporation • Solder Paste Stencil Design for Optimal QFN Yield and Reliability Ben Gumpert, Lockheed Martin Missile & Fire Control • Reliability Study of Bottom Terminated Components Jennifer Nguyen, Flextronics International • AXI Applications with BTC in Flextronics KH Ooi, Flextronics Mfg. (Zhuhai) Co. Ltd.

S32 Test II

Thursday, March 27: 10:00 am–12:00 pm Steve Butkovich, OnCore Manufacturing of Fremont

Increasing test capability and decreasing test development time are important requirements for many products. Methods of expanding test capability in printed circuit board assembly and functional tests using new tools and test methods will be discussed in this session. • Color Logical Analysis Approach for LED Testing in Manufacturing Min Shi, Agilent Technologies • Proposed System of Using Design Blocks Common to Design, Verification Tests, Qualification Tests and Production Functional Tests Stephen Golemme, CID2012, FMC Technologies Schilling Robotics • SJIT, Solder Joint Integrity Test, to Find Latent Defects in Printed Wiring Board Assembly Hiroshi Yamazaki, Hioki E.E. Corporation • The Use of a Commercially Available Color Sensor for Monitoring Burn-in of LED Based Products Tom Melly, Ph.D., Feasa Enterprises Ltd.

S33 Hot Topic — 2.5-D/3-D Packaging Thursday, March 27: 10:00 am–12:00 pm Alan Rae, Ph.D., NanoMaterials Innovation Center

• Andy Mackie, Ph.D., Indium Corporation

www.IPCAPEXEXPO.org

Professional Development Courses Learn the latest in design, lead-free technology, materials, process improvement, solder joint reliability and more. Courses are listed by general categories to focus on the specialized knowledge you’re looking for. Get the most for your money by registering for the All Access Package and selecting five half-day courses that meet your professional needs. Register by February 28 to save 20%. Assembly Processes for 23 Lead Free and Tin-Lead Cleaning/Coating/Contamination 28 Design 28 Emerging Technologies 30

Environmental Issues and Compliance PCB Fabrication and Materials Quality, Reliability and Test Supply Chain/Business Issues

30 31 33 34

Assembly Processes for Lead Free and Tin-Lead PD01 S tencil Printing Process and Solder

PD02 R eflow Soldering Process & the

Sunday, March 23 • 9:00 am–12:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology INTERMEDIATE

Sunday, March 23 • 2:00 pm–5:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology INTERMEDIATE

Paste Inspection: An In-Depth Look

The stencil printing process is the most critical in surface mount electronics assembly. It tremendously influences the quality of the final PCB. This course will provide a thorough understanding of the print process for leadbased and lead-free solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course will acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included. • Stencil printing process and process parameters • I mportance and influence of solder paste, flux, temperature, humidity, board support and machine setup • E valuation of materials such as paste, stencil and squeegee for efficient printing • S older paste constituents and types of paste • S tencils, solder paste and printer requirements for various applications • S tencil construction and features for efficient paste transfer • R ecent advances in print technology • E valuation of raw materials and procedure for qualifying vendors • P rint process for adhesive applications About the Instructor

Dr. S. Manian Ramkumar teaches courses in SMT electronics packaging and manufacturing automation. He was instrumental in developing the CIM and Surface Mount Electronics Manufacturing Laboratory and curriculum at RIT, and has been the principal investigator for several applied research projects.

Influence on Defects

The reflow soldering process is a key process in surface mount electronics assembly after the stencil printing process. The soldering parameters influence the quality of the solder joint in a surface mount PCB assembly. This course will provide a thorough understanding of the reflow process for tin-lead and lead-free soldering. Topics include an in-depth look at the various soldering methods, mechanism for solder joint formation, intermetallic formation, reflow parameters, effect of reflow parameters, thermocouple attachment and profiling, importance of profiling, defect identification and corrective action. Participants in this course will acquire a sound understanding of the soldering process and its influence on assembly yield. • Describing the reflow soldering process and the process parameters • Identifying the importance and influence of alloy phase diagrams, flux, temperature, time, profile parameters and thermocouple attachment • Evaluating materials such as flux, solder alloy and pad/lead/bump metallization for efficient soldering • Specifying profile requirements for various assembly types and applications • Evaluating oven construction and features for efficient soldering • Evaluating solder joints, their formation and parameter requirements for effective soldering About the Instructor

See PD01 on this page.

Professional Development Courses PD03 U nderstanding and Implementing

PD04 U nderstanding and Implementing

Sunday, March 23 • 9:00 am–12:00 pm W. James Hall, ITM Consulting Phil Zarrow, ITM Consulting Inc. INTERMEDIATE

Sunday, March 23 • 2:00 pm–5:00 pm W. James Hall, ITM Consulting Inc.; Phil Zarrow, ITM Consulting Inc. INTERMEDIATE

Best Practices in Electronics Assembly Processes — Part I

Gain a comprehensive perspective on problem issues for today’s most critical electronics assembly processes, materials, equipment, procedures and methods — and discover practical solutions to help improve productivity in your assembly operation. This course will identify and resolve key issues that consistently result in assembly problems and low yields. Anyone involved in directing, developing, managing and/or executing assembly line operations, including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering will benefit from this course. Manufacturing, process, design, test and quality engineering staff and managers will also benefit. Register for this course and Part II (PD 04) in the afternoon. • Assembly process • Solder paste printing process • Pick and place • Reflow, wave and selective soldering • Conformal coating • QFNs • Ultra-miniature components • Data-driven process design (including DOE and SPC) About the Instructors

Jim Hall is a principal consultant with ITM Consulting and a Lean Six Sigma Master Black Belt who has more than 30 years’ experience in electronics assembly. He works with OEMs, contract assemblers and equipment manufacturers to solve design and assembly problems, and to optimize facility operations. Hall’s expertise is in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world, and serves as co-host of IPC Outlook’s “BoardTalk” audio program. Phil Zarrow has been involved with PCB fabrication and assembly for more than 35 years. His expertise includes the manufacture of equipment for PCB fabrication and assembly of through hole and surface mount technologies. Since 1993, Zarrow has helped clients around the world solve assembly problems and optimize facility operations. Zarrow has also served on the Editorial Advisory Board for Circuits Assembly, won awards for his writing and is currently producer and co-host of the IPC Outlook’s “BoardTalk” audio program.

Best Practices in Electronics Assembly Processes — Part II

Building on concepts introduced in Part I (PD03), Part II continues discussion on problem resolution to improve productivity. Participants should register for both this course and Part I (PD03) in the morning. • Assembly process • Solder paste printing process • Pick and place • Reflow, wave and selective soldering • Conformal coating • QFNs • Ultra-miniature components • Data-driven process design (including DOE and SPC) About the Instructors

See PD03 on this page.

PD13 S MT and Through Hole Defect Analysis and Process Troubleshooting — Part I

Monday, March 24 • 9:00 am–12:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology BASIC

This is Part I of a two-part course pertaining to surface mount technology (SMT) and through hole defect analysis and process troubleshooting. This course aims to provide a thorough understanding of SMT and through hole defects, as well as the various factors that influence the formation of defects. Participants will get an indepth look at possible root causes of defects and their influence on yield. Knowledge gained from this course will help companies enhance product development and manufacturing yield. Be sure to also register for Part II of the workshop (PD16), which will use case studies to teach participants a systematic approach to solve process problems and identify the true root cause(s) of defects. • Systematic approach to problem solving • How to clearly define a problem by repeated questioning • Skills to address the root causes of problems • Methodology to find one or more solutions to address the root cause and identify a fix • How to apply analytical methodology to many different situations About the Instructor

See PD01 on page 23

www.IPCAPEXEXPO.org

PD16 S MT and Through Hole Defect Analysis

PD17 P reventing Assembly Production

Monday, March 24 • 2:00 pm–5:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology BASIC

Monday, March 24 • 9:00 am–12:00 pm Jennie Hwang, Ph.D., Sc.D., H-Technologies Group INTERMEDIATE

and Process Troubleshooting — Part II

The second half of a two-part course, this session will build on the morning’s information (PD13) pertaining to SMT and through hole defect analysis and process troubleshooting. This course aims to provide a systematic problem-solving approach that can be used for troubleshooting the surface mount technology (SMT) and through hole electronics packaging process to avoid defects. This hands-on session will use case studies to actively engage participants in the problem-solving process. Knowledge gained from this course will help companies enhance product development and manufacturing yield through systematically addressing the root causes of any problem. Part I of the workshop series will provide an in-depth look at the factors influencing the SMT and through hole process, root causes of defects and their impact on yield. For maximum benefit, enrollment in both this session and Part I (PD13) in the morning is highly recommended. • S ystematic approach to problem solving •H ow to clearly define a problem by repeated questioning • S kills to address the root causes of problems •M ethodology to find one or more solutions to address the root cause and identify a fix • How to apply analytical methodology to many different situations About the Instructor

See PD01 on page 23.

Defects and Failures

Considering the new and anticipated developments in packaging and assembly and with the goal to achieve high yield and reliability, this course focuses on how to prevent prevailing production defects and reliability issues through an understanding of potential causes. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will be outlined. Different sources and respective remedies of solder joint voids and their effects on the solder joint reliability will be discussed. The course also provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions. • The most common production defects/issues in lead-free assembly • PCB pad cratering (vs. pad lifting) — causes and solutions • BGA head-on-pillow defect — causes, factors, remedies • Open or insufficient solder joints — different sources, best practices • Solder joint voids — contributors, minimization, criteria, reliability • Copper dissolution — process factors, impact on through-hole joint reliability, mitigation • Lead-free through-hole barrel filling — material, process and solder joint integrity • Product reliability — solder joint, PCB and component considerations • Tin whiskers — new developments and mitigation About the Instructor

Dr. Hwang, a long-standing leader in SMT manufacturing and lead-free development and implementation, has provided solutions for many challenging problems — from production yield to field failure diagnosis to reliability issues. She is the author of more than 350 articles and internationally used textbooks, a featured speaker, and a recipient of numerous national and international awards and honors.

Professional Development Courses PD21 D esign and Assembly Challenges of

Ball Grid Arrays (BGAs) and Bottom Termination Components (BTCs) in a Lead-Free World

Thursday, March 27 • 9:00 am–12:00 pm Ray Prasad, Ray Prasad Consultancy Group INTERMEDIATE

Lead free has impacted the entire electronics industry, especially for those who must deal with backward and forward compatibility issues. Designing for BGA and BTC can involve trial and error and a lot of frustration, compounded by fast-paced changes in packaging technologies. This course tackles real-world problems in lead-free implementation and includes updated information on BTCs based on IPC-7093. Learn to identify design and process issues in BGAs and BTCs, and the issues that must be resolved for effective implementation of mixed assembly electronics products — for both tin-lead and lead free.This course will review theories of whisker growth, tin whisker failure mechanisms and strategies for assessing and mitigating tin whisker failure risk. • Overview of BGA, CSP and emerging technologies, such as BTCs (QFN, DFN and MLF)

PD24 U nderstanding and Solving Head-inPillow, Non-Wet Open and QFN/CSP Voiding Challenges

Monday, March 24 • 2:00 pm–5:00 pm Timothy Jensen, Indium Corporation of America INTERMEDIATE

There are three challenging lead-free assembly defects facing the industry today: head-in-pillow (HIP), non-wet open (NWO) and QFN/CSP voiding. HIP and NWO defects are related to the warping of area array packages. With the increased use of CSP and QFN components, it has become increasingly challenging to overcome solder joint voiding. This course will cover many of the factors that contribute to these defects, and look at how to optimize processes and materials to reduce the potential for these issues. It will also include a thorough discussion of the mechanisms leading to these defects and why they are more prevalent today than in the past. • Overview of head-in-pillow (HIP) and non-wet open (NWO) • Differences between HIP and NWO • Materials impacting HIP/NWO

• How to effectively implement BGAs and bottom termination surface mount components in a lead-free world, at a lower cost and higher yield

• Process optimization for defect minimization

• Troubleshooting BGA and BTC problems in manufacturing

• Printing and reflow process optimization

• Best way to handle backward and forward compatibility situations: lead-free and tin-lead components on the same board

• Using preforms to reduce voiding

• Metallurgy of lead-free solder: selection of appropriate lead-free solder alloys, soldering and rework processes and equipment • Key strategies in design and manufacturing processes to prevent field returns

• Voiding in BGAs, CSPs and QFNs • Material selection factors impacting voiding • Stencil and PCB design for QFNs About the Instructor

Tim Jensen is the product manager for Indium Corporation’s PCB Assembly Materials. He has spent more than 15 years working SMT process lines and solving issues such as head-on-pillow, graping and QFN voiding. Jensen is a published author and a frequent presenter.

• Design and process guidelines for BGAs and BTCs About the Instructor

Prior to starting his consulting practice, Ray Prasad held key technology positions at Boeing and Intel. At Intel, he was responsible for developing and implementing SMT. A published author, Prasad chaired the committee that drafted IPC-7095. He is a recipient of the IPC Presidents Award.

www.IPCAPEXEXPO.org

PD27 P oP Assembly and Challenges

PD29 L ead-Free Wave Soldering 2.0

Thursday, March 27 • 9:00 am–12:00 pm Dudi Amir, Intel Corporation INTERMEDIATE

Thursday, March 27 • 9:00 am–12:00 pm Gerjan Diepstraten, CIT, Vitronics Soltec BASIC

This course will address a package on package (PoP) approach to 3-D stacking. The instructor will lead participants through the PoP assembly process, starting with PoP SMT assembly applications, including flux dip and paste dip, PoP warpage control in multilevel packages and rework issues; then move on to bigger challenges such as preventing defects, identifying root causes and conducting failure analysis. PoP applications examples will be used to illustrate concepts. This course will benefit anyone involved in the design, assembly or troubleshooting of assemblies with PoP. •W hat is PoP and what are the benefits of PoP? • T he types of PoP technologies, such as top memory, conventional PoP, PoP with an interposer and solder on pad • T he steps in the PoP assembly process •A ssembly challenges such as dynamic warpage, package assembly height and die gap • P rocess characterization (solder volume, fluxing parameters, paste dipping, placement and reflow) • T ypical PoP defects and prevention (head on pillow, non-wet open, solder bridging, voids and placement misalignment) • I nspection and failure analysis (optical microscope, 2-D and 3-D x-ray inspection, dye and pry, cross section) • R ework •U nderfill • P oP applications About the Instructor

Dudi Amir is a senior technology development engineer for Intel Inc. supporting new technology development. He has experience in the development of assembly process for motherboards mobile and handheld modules, PoP package development, and PBX and microwave board assembly. He has authored industry papers, led workshops and holds nine U.S. patents in package and board technologies.

With the introduction of lead-free solder, the wave soldering process has become more challenging. On the one hand are the positive soldering aspects, such as proper hole-filling for multilayer boards, eliminating bridging and reducing solder balling. On the other hand, high metal prices for SAC-alloys resulted in conversion to lower cost alloys like low SAC or SnCubased alternatives. While there is pressure to produce assemblies in a cost-effective manner by using low-cost materials, these materials should be used in an effective way to minimize defects and rework costs. This course will help participants improve individual process skills and achieve first-class workmanship in lead-free wave soldering. • Tools to control the lead free wave process • Options to help widen the process window • Nitrogen tunnel concepts compared with open wave soldering systems • Effects of solder contamination on solder joint formation • Practical cases discussing fillet lifting • Secondary reflow of SMD components • Flux reliability • Pin-to-hole ratios • Pallet designs About the Instructor

Diepstraten’s engineering experience spans 30 years, with the last 23 years in soldering. He has presented more than 100 papers at IPC APEX EXPO and many other events. His articles have appeared in SMT, EPP, Circuits Assembly, Onboard, and other electronics magazines. He represents Vitronics Soltec on IPC committees and is a Certified IPC trainer for IPC-A-610 and J-STD-001.

Professional Development Courses Cleaning/Coating/Contamination

Design

PD25 C leaning and Contamination Process

PD10 D fX: Design for Excellence — Part I

Guide

Thursday, March 27 • 9:00 am–12:00 pm Mike Bixenman DBA, Kyzen Corporation BASIC

Numerous factors should be considered when engineering a cleaning process capable of removing flux residues from highly dense circuit assemblies. Uniqueness of the part, sensitivity of components, best cleaning processes, type of soil, cleaning equipment and cleaning agents are just a few of the elements that must be considered. This course will discuss the dynamics of assuring a successful cleaning result. • How clean is clean? • Cleaning of bottom termination components (BTC) • Material compatibility concerns • Considerations for cleaning assemblies and bare boards

Sunday, March 23 • 9:00 am–12:00 pm Cheryl Tulkoff, CRE, DfR Solutions

High density interconnect (HDI) has become the most widely used emerging technology for high-performance electronics, but implementation can be formidable. This course relates the successful design training used by large aero/military, telecom and computer OEMs for product development to successfully implement HDI in their PCB programs. Designing HDI boards has many different options versus designing a conventional multilayer board. Understanding and using these new design paradigms allows HDI to actually reduce costs while increasing layout density by factors of 2X to 4X. Certain through hole multilayer practices have to be unlearned to properly utilize HDI. This course will illustrate new design requirements and introduce a planning methodology. • Introduction to design for manufacturing

• Selecting the cleaning machine

• Key global DfM guidelines

• Soils that require cleaning

• Industry standard design rules

• Factors that may affect cleaning rate

• Overview of DfM, task such as review process, root cause problem solving and failure analysis

• Cleaning agent options • Will the proposed cleaning work? • Machine cleaning with solvent versus manual cleaning with solvent • Experiments and tests to measure the cleanliness and reliability of board assemblies About the Instructor

Dr. Mike Bixenman is a co-founder and CTO of Kyzen Corporation. An active researcher and innovator in the field of precision cleaning, he chaired the committee that developed the IPC Cleaning & Alternatives Handbook and IPC Stencil Cleaning Handbook.

• Component factors in DfM, such as component robustness, temperature sensitivity level and moisture sensitivity level • Printed board factors in DfM including surface finishes, laminate selection, cracking & delamination, plated through vias/holes, conductive anodic filament and electrochemical migration, strain/flexure issues, pad cratering and cleanliness • Solder issues in DfM, including hand soldering, copper dissolution and mixed assembly About the Instructor

Cheryl Tulkoff has more than 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, through the analysis and evaluation of field returns. She has also managed no-clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

www.IPCAPEXEXPO.org

PD11 M aking the Most of Design Time

PD18 D esign for Excellence — Part II

Sunday, March 23 • 9:00 am–12:00 pm Susy Webb, CID BASIC

Sunday, March 23 • 2:00 pm–5:00 pm Dale Lee, Plexus Corp. INTERMEDIATE

Layout time is often one of the last things considered in the project cycle, so designers need to manage their time wisely to get the job done. This class will discuss what designers can do to streamline the input and output process. • Fully utilize software using macros and scripts •O ptimize the design preparation and layout process •M ake the checking and saving process more manageable About the Instructor

Susy Webb is a senior PCB designer with 35 years of experience in a variety of fields including point-topoint microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. Webb also serves on the IPC Designers Council Executive Board and Education Committee.

PD14 N oise Control in High Speed PC Boards Sunday, March 23 • 2:00 pm–5:00 pm Richard Hartley, CID, L-3 Avionics Systems Inc. INTERMEDIATE

“Noise” is simply “intentional energy” that travels to unintended places in a circuit. This classic definition fails to say why the energy sometimes travels and at other times does not. The problem is worse in high-speed circuits but happens at all frequencies and IC speeds. Generated noise can show up at the input of a circuit or on traces or as EMI or in many other forms. The key to successfully reducing noise is to understand why it is generated in the first place and how to lower the threat when it cannot be stopped entirely. •W hy noise has increased in recent years • I mpact of frequency — analog and digital circuits •W hat is noise, and why it spreads •M isuse of “ground” • I mpact of component positions • R outing to control noise • L ow-noise layout techniques • I mpact of connector pin out • I C’s role in noise generation • P CB stackup to control noise

Today’s design tolerances have impacted traditional assembly processes with very tight solder application, component placement and soldering constraints. Traditional Six Sigma process controls are insufficient to achieve a high-yielding manufacturing process. This course will introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching and environmental controls. • Global product design elements • PCB design impacts • Wave solder design impacts • SMT solder design impacts • Thermal balance, trace routing, equipment limitation/ tolerance, PCB array tolerance, process tooling design • Process control impacts • Paste volume, thermal shock SMT and PTH, reflow process warpage • Cleaning impacts • Compatibility issues, low stand-off components About the Instructor

Dale Lee is a staff DFX process engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields. He has served as an author, instructor and speaker on advanced packaging, PCB and SMT design, assembly, DFX and rework.

IPC APEX EXPO allowed us to further our existing knowledge and identify areas in which we can continue our education. We left with a better understanding of the industry and where it is headed. Heidi Havelka Quality Engineer Interplex Sunbelt, Inc.

About the Instructor

Richard Hartley is a senior principal engineer at L-3 Communication and the principal of RHartley Enterprises, through which he consults and teaches internationally to resolve noise, signal integrity and EMI problems. Hartley’s focus is on correct design of PC boards to prevent and solve problems. He has consulted with major corporations worldwide.

Professional Development Courses PD26 F undamental Considerations to EMC

and High Speed Signal Behavior on Printed Circuits Boards — reconfirmed by 3-D Field Simulation Results (Solving Maxwell Equations)

Monday, March 24 • 2:00 pm–5:00 pm Rainer Thueringer, Ph.D., CID+, FEDFachverband Elektronik Design e.V. BASIC

Gain an understanding of the impact of EMC in PCBs, and learn the rules for EMC-optimized design. This course will examine sources of RF; electric and magnetic dipole antenna structures; and near-field arrangements that generate common and differential mode currents, and create crosstalk and far-field radiation. Using 3-D field simulation results, the instructor will demonstrate design techniques for trapping the RF generated by your application. • Design rules and samples of EMC and high speed PCB design

• Component selection criteria, embedded PCB structure variations and design principles for efficient fabrication process flow • Material selection and termination methodology for embedding both active and passive components, including resistor, capacitor, inductor and discrete transistor elements • Process variations for embedding and interconnecting thinned semiconductor elements within multilayer PCBs (core type and coreless substrate structures) About the Instructor

Vern Solberg is a technical consultant with more than 30 years of experience working with commercial and aerospace electronic products. Solberg currently serves as the chairman of the IPC D-55 Task Group which is developing IPC-7092, Design and Assembly Process Implementation for Embedded Components.

• Influence of connector placement on external noise.

Environmental Issues and Compliance

• Role of line and power structures in EM-field and highspeed signal propagation

PD19 T he Basics of Conflict Minerals

• Current density distributions of different signal structures (single-ended and differential lines) to reconfirm proposed design structures • Effect of slotted ground planes under signal traces, and high-speed signal propagation switching between reference planes • The influence of 90° trace inflections and non-matching differential trace length for very-high speed signals About the Instructor

Dr. Thueringer has 10 years of experience in the PCB and EMS industry where he focused on impedance controlled high speed boards in design and production. Now an instructor at Technical University Mittelhessen — University of Applied Science, he specializes in device construction including EMI and high speed design.

Emerging Technologies PD09 3 -D Embedded Component Packaging: Design and Assembly Process Implementation

Sunday, March 23 • 9:00 am–12:00 pm Vern Solberg, Solberg Technical Consulting INTERMEDIATE

The decision to embed components within the multilayer circuit structure must be made early in the design process. Although it is possible to embed uncased active and passive components, some components are better candidates for embedding than others involving more complex processes that are difficult to rationalize. This course will provide participants with an understanding of the principles for electronics packaging by embedding components in an organic multilayer circuit board structure.

Compliance

Monday, March 24 • 9:00 am–12:00 pm Michael Littenberg, Schulte Roth & Zabel LLP Farzad Damania, Schulte Roth & Zabel LLP BASIC

Regardless of whether conflict minerals regulations directly apply to your company, you will have to provide information to your customers about the presence of conflict minerals in your products. Section 1502 of the 2010 Dodd-Frank Wall Street Reform Act requires regulated companies to report on the origin of tin, tantalum, gold and tungsten in their products. To trace these origins, your customers are demanding data and information from their supply chain. You will likely be required to query your entire supply chain on the presence and origin of conflict minerals, conduct or be subject to third-party audits, and demonstrate due diligence. This course will provide you with the fundamentals of the regulation and provide you with the tools to develop a program for complying with federal regulations and meeting your customers’ needs. • An overview of the final SEC regulation • Information on the OECD due diligence guidelines • Supply chain communication, questionnaires and data exchange • Reporting obligations to customers, the public and the SEC • Potential third-party audit requirements

www.IPCAPEXEXPO.org

About the Instructors

Michael Littenberg is a partner in Schulte Roth & Zabel’s Business Transactions Group and heads the firm’s Public Companies practice. He counsels clients on compliance as well as on transactional and general corporate matters. Littenberg has been especially active in advising companies on the SEC’s conflict minerals rule and is the most widely quoted and published attorney in the United States on the rule. Farzad Damania is a special counsel in Schulte Roth & Zabel’s Business Transactions Group where he focuses on capital markets and securities law, mergers and acquisitions and general corporate law. He counsels companies in a broad array of industries in connection with SEC, NYSE and NASDAQ filings and ongoing compliance. Damania also advises public and private companies on the SEC’s conflict minerals rule

PCB Fabrication and Materials

About the Instructors

Don Schmieder has been working in the electronics field for 25 years, with experience in production and quality at Zycon and in the Plexus Global PCB Commodity Group. His experience spans purchasing, procurement, manufacturing, assembly and testing of printed circuit boards and he has performed technical and quality audits of more than 75 PCB fabricators worldwide. Schmieder assisted in the conception of the Plexus PCB fabrication specification as well as the Plexus IST qualification process. Jim Vanden Hogen has more than 35 years of experience in the design, purchase, manufacture, assembly, test and sale of PCBs. A senior PCB designer and fabrication specialist, he has worked as a PCB commodity specialist, DFM technologist, product introduction manager and as a sales manager. Vanden Hogen has performed technical and quality audits of more than 30 PCB fabricators worldwide. He co-authored the original Plexus PCB DFM guidelines and served on the task group for IPC-6012.

PD05 P CB Fabrication Basics: Processes and

PD06 P CB Fabrication Basics: Processes and

Sunday, March 23 • 9:00 am–12:00 pm Don Schmieder III, Plexus Corporation Jim Vanden Hogen, Plexus Corp. BASIC

Sunday, March 23 • 2:00 pm–5:00 pm Don Schmieder III, Plexus Corporation BASIC

Specifications - Part I

This two-part course for engineering, design and procurement staff and management will review an entire multilayer PCB fabrication process and show how design affects fabrication and assembly. Physical samples taken from the fabrication process will be available for inspection. Part I will cover PCB types and industry specifications, laminates and their properties, front-end engineering and basic layer stackups. Discussion will continue with inner-layer processing and lamination, and conclude with drilling. For maximum benefit, register for this session and Part II (PD06) in the afternoon.

Specifications Part II

Part II of this full-day course will review the fabrication process after drilling, and discuss desmear, electroless copper, outer-layer processing, solder mask, legend and electrical test. The instructors will share the pros and cons of various surface-finish applications and discuss cost-effective arrays that maximize material, facilitate manufacturing and allow for post-assembly singulation. Using the IPC-6012 PCB fabrication specification for reference, participants will learn how to develop their own procurement documentation, including addressing RoHS-compliant materials. For maximum benefit, register for both this session and Part I (PD 05) in the morning.

• S tep-by-step PCB fabrication process

• Step-by-step PCB fabrication process (continued)

• P CB types and industry specs

• Surface finish choices

• L aminate types and properties

• Array design and optimum material utilization

• S tackups, via metrics and aspect ratios

• Fabrication specification About the Instructor

See PD05 on page above.

Professional Development Courses PD12 A dvanced HDI Substrates: Next

• The effect of drilling on hole wall quality and the subsequent metallization process

Sunday, March 23 • 2:00 pm– 5:00 pm Happy Holden ADVANCED

• How to identify which process steps caused a defect

Generation for Product Implementation

HDI has become the most widely used emerging technology for high-performance, mission-critical electronics — with fine-pitch and high I/O BGAs being major drivers. This course delivers the same engineering training used by large aero/military, telecom and computer OEMs to successfully implement HDI technologies in their printed circuit board programs. In this course, participants will gain an understanding of what it takes to be successful in HDI product implementation; explore miniaturization, ‘embedding’ technologies and optical; and learn how advanced HDI structures affect signal and power integrity, by seeing examples of the effects. • Process details, including examples with performance information • Optical waveguides in PCBs • Industry test vehicles and experiences • Reliability performance of HDI structures • Advanced HDI structures • Second and third HDI structures, including the “stacked” and “any layer via” structures • Signal integrity/power integrity of HDI • Basic HDI electrical performance of fine-line and blind vias for signal loss, crosstalk, capacitance, inductance and signal propagations About the Instructor

Happy Holden has been involved in advanced PCB technologies for more than 40 years. Prior to serving as the CTO of Foxconn, Holden was the senior PCB technologist for Mentor Graphics. The first 28 years of his career were spent at Hewlett-Packard, where he held various positions including director of PCB R&D and PCB engineering manager.

PD15 A dvanced Trouble Shooting for the PCB Fabrication Process

Monday, March 24 • 9:00 am–12:00 pm Mike Carano, OMG Electronic Chemicals ADVANCED

When dealing with advanced defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting and hole wall pull-away, the root cause may not be readily apparent because multiple factors can contribute. This course will address advanced problem solving for PCB defects and provide root cause analysis procedures and corrective action plans. Participants will explore the most intricate of root cause factors and learn how the interrelationship of both upstream and downstream processes contribute to scrap product. Learn how to recognize problems, identify the root causes and take corrective action before it is too late.

• Causes and solutions for electrodeposition defects • Causes and solutions for assembly related issues About the Instructor

An author and patent holder with more than 30 years of industry experience, Mike Carano is the director of new product and business development for OM Group. His work spans metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging, surface treatment of metallic and non-metallic substrates and imaging processes.

PD22 B uilding Long-Term Reliability in

Printed Circuit Boards: Effects of Materials, Plating Processes, and Innerlayer Treatments for Lead-Free Assembly Requirements

Monday, March 24 • 2:00 pm–5:00 pm Mike Carano, OMG Electronic Chemicals INTERMEDIATE

Who hasn’t been affected by converting the printed board assembly process from solder-based materials to lead-free alloys? It must be understood that circuit board materials, via formation quality, plating uniformity and innerlayer bonding treatments all combine to affect the reliability of the finished printed board. This course will address the integration of material, fabrication process and assembly process as it relates to enhancing long-term reliability of printed boards subject to lead-free assembly. • Properties of various materials including standard FR-4, multifunctional materials, PPO/PPE resins, molyimide and non-woven materials • Filled versus unfilled materials • PTH drilling parameters • Circuit density • Multilayer stackups and tooling considerations • Oxide and oxide alternatives • Use of reverse treat foil versus standard foil • PTH and blind via aspect ratios • Key factors in plating cell set-up and processing • Optimization of the desmear and metallization process • Assembly issues related to materials and the PCB • Assembly reflow profile optimization • Moisture sensitivities of various materials • Material property effects (Tg, Td, CTE) • Conductive anode filament formation (CAF) • Effects of higher assembly peak temperatures and dwell times on reliability About the Instructor

See PD15 above.

www.IPCAPEXEXPO.org

Quality, Reliability and Test

PD20 F ailure Analysis for Improved

PD07 Quality System Tools, Techniques &

Monday, March 24 • 2:00 pm–5:00 pm Bhanu Sood, University of Maryland INTERMEDIATE

Strategies to Pass Any Audit

Sunday, March 23 : 9:00 am-12:00 pm Steven Williams

Quality may be a given in today’s global environment, but few companies understand how to leverage quality into a competitive advantage. Developing a world-class quality system that is both simple and effective is one of the most powerful tools your company can use to improve organizational performance, competitiveness and customer delight. This course will use lessons learned from experience in manufacturing, engineering and quality management to provide attendees with a “blocking and tackling” blueprint for how to use their quality systems to create competitive advantages by moving from customer satisfaction into the realm of customer delight. • Organizational change • The founding fathers of quality • ISO • Training • Documentation KISS • SPC without tears • The quality toolbox • Delighting the customer • 10 guerrilla tactics to pass any audit About the Instructor

A 36-year veteran of the electronics industry, Steve Williams is currently responsible for strategic sourcing and supply chain management for a major EMS manufacturer. He has authored books on lean and quality and is a columnist for PCB007.

Reliability

Failure analysis is key to enhancing reliability … and keeping the customer happy. This course will cover a range of topics, including root cause analysis, physics-offailure principles and failure mechanisms in electronics. The first half will be devoted to methodologies for identifying potential failure mechanisms in electronics based on failure history, and systematic approaches to root cause analysis. The second half will be devoted to failure analysis techniques geared toward various failure mechanisms. Case studies will be used to illustrate techniques and analysis. • Failure mechanisms in electronic products • Root cause analysis process • Introduction to physics of failure • Failure analysis techniques: nondestructive analysis, destructive analysis, specimen prep and materials characterization About the Instructor

Bhanu Sood is the director of the Test Services and Failure Analysis Laboratory at the University of Maryland’s Center for Advanced Life Cycle Engineering. This experience includes developing root-cause failure analysis techniques for electronic products, materials characterization based strategies for counterfeit detection, unique failure mechanisms in printed circuit boards, embedded electronics, embedded batteries and laser-assisted micro-fabrication techniques.

Professional Development Courses PD23 F ailure Analysis Process for Printed

Supply Chain/Business Issues

Thursday, March 27 • 9:00 am–12:00 pm John Radman, Trace Laboratories - Denver INTERMEDIATE

PD08 L ean: 10 Things Every Manager Should

Boards and Assemblies

Everything fails eventually. Knowing the cause of the failure can drive design, manufacturing and end-use changes that can prevent failures in the future. Because all failures are unique to the product involved, rootcause failure analysis must also be unique. This course will address three possible failure locations: failures that occur within the board, on the board, and within connections between the board and the components. Learn the path of a typical failure analysis, and hear real life examples, that will serve as a guideline for conducting failure analysis. • The three classes of analysis: printed board internal defects, printed board surface defects and solder joint defects • Common techniques for performing each class of analysis • Specific examples of results from each technique • What questions to ask • How to draw conclusions About the Instructor

With more than 24 years of experience, John Radman is currently the Senior Technical Director of Trace Laboratories. He heads a group of engineers and scientists who specialize in the areas of contamination and root cause failure analysis. He is the author of many articles and technical presentations on topics including failure analysis, test techniques and counterfeit component analysis.

Know for a Competitive Advantage

Sunday, March 23 • 2:00 pm–5:00 pm Steven Williams BASIC

Lean is the most powerful tool your company can use to improve organizational performance and competitiveness. This course will provide an overview of lean to help managers understand how the program can help any organization survive. Lessons learned from experience in manufacturing management will be shared. Hear about common mistakes and myths as well as what it takes to successfully implement a lean program. • The need for lean • Drive-by lean • The lean philosophy • The seven deadly wastes • Process analysis • Why 99 percent yield is not good enough • The lean toolkit • A glossary of lean terms About the Instructor

See PD07 on page 33.

The professional development courses at IPC APEX EXPO provided an excellent foundation for my education. I feel like I gained five years’ experience in just three days. Jeffry Hanwell Chemical Engineer The Lincoln Electric Company

www.IPCAPEXEXPO.org

Standards Development Meetings Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on. These sessions are open to all attendees, unless noted otherwise. Registration to attend committee meetings is FREE before the show ($50 on-site). Take advantage of all the show has to offer with the All-Access Package. Register by February 28 and save 20%.

Assembly and Joining

5-20 Assembly & Joining Committee

Sunday, March 23

Chair: Leo Lambert, MIT, EPTAC Corporation Vice Chair: Renee Michalkiewicz, MIT, Trace Laboratories – Baltimore

This is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committee.

5-21a I PC-7070 Task Group Sunday, March 23

Chairs: Thomas Hausherr, CID+, PCB Libraries; Rainer Taube, MIT, Taube Electronic GmbH

This task group is responsible for the development and update of IPC-7070.

5-21g F lip Chip Mounting Task Group Wednesday, March 26

Chair: Vern Solberg, Solberg Technical Consulting

This task group is preparing Revision A of IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. The revision will include information on new semiconductor packaging concepts of 2.5 and 3-D package configurations. A draft outline is being prepared that reorganizes the document’s chapters.

5-22a J -STD-001 Task Group Sunday, March 23

Chairs: Daniel Foster, CIT, Missile Defense Agency; Teresa Rowe, CIT, AAI Corporation

This task group is developing revision F of J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The goal for this meeting is to prepare the standard for ballot.

5-22a/ Synergy Meeting - J-STD-001 7-31b & IPC-A-610 Task Groups Monday, March 24

Chairs: Daniel Foster, CIT, Missile Defense Agency; Teresa Rowe, CIT, AAI Corporation

The J-STD-001 and IPC-A-610 task groups will work together to resolve comments common to both standards. The goal for this meeting is to prepare both standards for ballot.

5-22arr J -STD-001/Conformal Coating Material & Application Industry Assessment Monday, March 24

Chair: David Hillman, Rockwell Collins

The goal of the working group is to document the current state of the industry of conformal coating application on printed board assemblies. The project will look at the major conformal coating types (i.e., AR, ER, UR, SR, XY) and method of application (i.e., spray, dip, brush). The project will not evaluate individual companies or specific conformal coating products — only do a “blind” documentation effort. Metallographic cross sectioning will be utilized for measurement of thickness and coverage.

5-22as S pace Electronic Assemblies

J-STD-001 Addendum Task Group Tuesday, March 25

Chair: Garry McGuire, CIT, NASA Marshall Space Flight Center Vice Chair: Kathy Johnston, CIT, Raytheon Missile Systems

This task group is developing the Space Electronic Hardware Addendum for Revision F of J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.

5-22bt J -STD-001 Training Task Group Wednesday, March 26 Chair: Teresa Rowe, CIT, AAI Corporation Vice Chair: Daniel Foster, CIT, Missile Defense Agency

This technical training committee is meeting to review lessons learned in the current J-STD-001 training program and set goals for training changes when the next revision is published.

5-22f J -STD-001 Handbook Task Group Wednesday, March 26

Chair: Daniel Foster, CIT, Missile Defense Agency Vice Chair: Kathy Johnston, CIT, Raytheon Missile Systems

This task group will be developing a comparison of the current draft of J-STD-001 Revision F against IPC-HDBK001E, Handbook and Guide to Supplement J-STD-001, to determine if an update is required.

5-23b C omponent and Wire Solderability Specification Task Group Monday, March 24

Chair: David Hillman, Rockwell Collins Vice Chair: Dennis Fritz, MacDermid, Inc.

This group will discuss the ongoing Round Robin Test S (found in the J-STD-002 document) to better define solder stencil aperture requirements.

Standards Development Meetings 5-24a F lux Specifications Task Group Tuesday, March 25

Chairs: Renee Michalkiewicz, MIT, Trace Laboratories - Baltimore; Brook Sandy-Smith, Indium Corporation of America Vice Chairs: John Rohlfing; Keith Sellers, Trace Laboratories – Baltimore

This group will revise/update test methods applicable to J-STD-004.

Base Materials

3-11 L aminate/Prepreg Materials

Subcommittee Monday, March 24

Chair: Antonio Senese, Panasonic Electric Works Vice Chair: Douglas Sober, Shengyi Technology Co. Ltd.

This group is responsible for the maintenance of IPCJ-STD-005, Requirements for Solder Paste, and for IPC-HDBK-005, Guide to Solder Paste Assessment. This task group will continue reviewing the appropriate test methods applicable to IPC J-STD-005.

This subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards, to its D revision. The D revision should be completed and released by IPC APEX EXPO with distribution of hard copies to the subcommittee members who attend the 3-11 Subcommittee meeting. Also, the subcommittee will discuss the work of a separate ad hoc working group that is developing a joint standard between IPC and CPCA, identified as IPC/CPCA-4105, that addresses specialized metal core laminates for primary use as a substrate for LED lighting applications.

5-24c S older Alloy Task Group

3-12a Metallic Foil Task Group

Chair: Jennie Hwang, Ph.D., Sc.D., H-Technologies Group Vice Chair: David Adams, Rockwell Collins

Chair: Rolland Savage, High Performance Copper Foil Inc. Vice Chair: Arvind Partha, Ph.D., Somers Thin Strip

5-24b S older Paste Task Group Wednesday, March 26

Chair: Karen Tellefsen, Ph.D., Alpha Vice Chair: Beverley Christian, Ph.D., BlackBerry

Tuesday, March 25

This group is working on amendment 1 to IPC J-STD006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications, which includes the addition of two new alloys and will address the melting point of one alloy previously listed in the tables.

5-24f U nderfill Materials Design, Selection

and Process Task Group Monday, March 24

Chairs: Brian Toleno, Ph.D., Henkel Corporation; Bill Vuono, Raytheon Company Vice Chair: Fonda Wu, Raytheon Company

This group is updating IPC J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages, through a revision A and a re-title of the document to Design, Selection and Process Implementation for Underfill Materials, that allows the document to be less constrained on topic and serve as both a specification and a guideline.

Assembly Equipment

5-45 Reflow Oven Process Control

Wednesday, March 26

Chair: Linda Woody, Lockheed Martin Missile & Fire Control Vice Chair: Joseph Kane, BAE Systems Platform Solutions

This subcommittee is responsible for the development and maintenance of IPC-7801, Reflow Oven Profiling Standard. This is the first face-to-face meeting for this subcommittee.

Tuesday, March 25

This group is generating a noncontact test method and is gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562, Metal Foil for Printed Board Applications. The task group is developing a test method as the procedure for measuring non-contact surface roughness, TM 2.2.22, which will be included in IPC-TM-650, Test Methods Manual.

3-12d W oven Glass Reinforcement Task Group Monday, March 24

Chair: Mike Bryant, BGF Industries Inc. Vice Chair: Douglas Eng, PPG Industries Inc.

This task group recently completed the B revision of IPC-4412, Specification for Finished Fabric Woven from “E” Glass for Printed Boards. The task group is proposing a substantive definition of the generically defined “spread glass” for industry. Additional items for work will also be discussed.

3-12e B ase Materials Roundtable Task

Group Monday, March 24

Chair: Edward Kelley, Isola Group SARL Vice Chair: Douglas Sober, Shengyi Technology Co. Ltd.

Using an open discussion format, this group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated and encouraged.

www.IPCAPEXEXPO.org

Cleaning and Coating

5-31g Stencil Cleaning Task Group Wednesday, March 26

Chair: Mike Bixenman, DBA, Kyzen Corporation

This task group is responsible for the maintenance of the guideline document, IPC-7526, Stencil and Misprinted Board Cleaning Handbook. This meeting will continue the process of developing Revision A.

5-31j C leaning Compatibility Task Group Monday, March 24 Chair: Eddie Hofer, Rockwell Collins Vice Chair: Mike Bixenman, DBA, Kyzen Corp.

5-32e C onductive Anodic Filament (CAF)

Task Group Tuesday, March 25

Chair: Karl Sauter, Oracle America, Inc. Vice Chair: Graham Naisbitt, Gen3 Systems Limited

This group has just added the A revision of Test Method 2.6.25 into IPC-TM-650. The group is working on the B revision of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing).

5-33a Conformal Coating Task Group Wednesday, March 26

This task group will develop a standard test method to replace Mil-Std-202G, Method 215K which does not accurately represent modern cleaning chemistries and the cleaning equipment advancements that are currently used within electronics assembly manufacturing processes. The new test method will determine the compatibility of cleaning agents and mechanical delivery systems with general electronics assemblies, component hardware and electronics assembly materials.

Chair: John Waryold, HumiSeal Division of Chase Corporation Vice Chair: Debora Obitz, MIT, Trace Laboratories - Baltimore

5-32a I on Chromatography/Ionic

Working Group Wednesday, March 26

Conductivity Task Group Monday, March 24

This task group is initiating a revision of the IPC-CC-830 conformal coating specification to revision C in order to address new conformal coating materials and will discuss an adhesion testing method.

5-33awg C onformal Coating Requirements Chair: Douglas Pauls, Rockwell Collins

Chair: John Radman, Trace Laboratories - Denver Vice Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.

This group will be working on the conformal coating sections of IPC-A-610 and IPC J-STD-001. In addition, the group will discuss evaluating conformal coating for use environments.

5-32b S IR and Electrochemical Migration

Data Generation & Transfer/ Documentation

This task group is reviewing comments to test methods for ionic cleanliness testing. Task Group Tuesday, March 25

Chair: Keith Sellers, Trace Laboratories â&#x20AC;&#x201C; Baltimore Vice Chairs: Graham Naisbitt, Gen3 Systems Limited; Russell Shepherd, MIT, Microtek Laboratories Anaheim

This task group is working to complete IPC-9203, User Guideline for the IPC B-52 SIR Test Board.

5-32c B are Board Cleanliness Assessment

Task Group Wednesday, March 26

Chair: David Lober, Kyzen Corporation

This task group is working on the adoption of the IPC-5704 printed board cleanliness specification within the IPC6010 performance specifications.

2-18 S upplier Declaration Subcommittee Monday, March 24

Chair: Forrest Christian, Innovation Machine Ltd.

This subcommittee will review and discuss a revision to IPC-1751A. The revision will serve to better integrate the IPC-175x family of data exchange standards and align IPCâ&#x20AC;&#x2122;s materials declaration standard with the IEC 62474 materials declaration standard.

2-18b M aterials Declaration Task Group Tuesday, March 25 Chairs: Mark Frimann, Texas Instruments Inc.; Aidan Turnbull, Ph.D., ENVIRON UK Ltd

This task group will discuss how the IPC-1752A materials declaration management standard can harmonize with the IEC 62474 materials declaration standard. IPC1752A allows for the exchange of information related to materials in products. The standard is part of the IPC 175x series of data exchange standards.

Standards Development Meetings 2-18f D eclaration of Shipping, Pack and

Packing Materials Task Group Monday, March 24 Chairs: John Ciba Jr.; Lee Wilmot, TTM Technologies, Inc.

This task group will discuss an amendment to the IPC1758 standard on declaration requirements for shipping, pack and packing materials. The amendment will include a data field for recycled content.

2-18h C onflict Minerals Data Exchange Task Group Thursday, March 27

Chair: John Plyler, BlackBerry

This task group is developing a data exchange standard for the exchange of supply chain data necessary for compliance with the Dodd-Frank conflict minerals regulation and OECD Due Diligence Guidelines for conflict minerals. The data standard is being developed as a part of the IPC-175x declaration family.

2-18j L aboratory Report Declaration Task Group Monday, March 24

Chair: William Haas, Seagate Technology LLC

This task group will discuss possible improvements to IPC1753, Laboratory Declaration Standard, a data exchange standard for laboratory chemical analysis reports between supply chain members. The standard helps companies provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free.

2-40/ Joint Meeting â&#x20AC;&#x201D; Electronic 2-41 Documentation Technology

Committee and Product Data Description Subcommittee Tuesday, March 25

Chairs: Karen McConnell, CID, Northrop Grumman Corporation; Douglas Sober, Shengyi Technology Co. Ltd.

This joint meeting will cover everything under IPC-261X, including modifications to IPC-2611, IPC-2612, and IPC2612-1 as well as IPC-2614. The committee will also start work on IPC-2614-1 which shows how to use the XML computer format to describe laminate materials. If time permits, the assembly and bill of material sections will also be structured.

Electronic Product Data Description

2-16 P roduct Data Description (Laminar

View) Subcommittee Monday, March 24

Chair: Karen McConnell, CID, Northrop Grumman Corporation

This subcommittee will make determinations as to the testing methodologies being used to validate the newly released B revision of IPC-2581, and assess the need for future amendments or updates to enhance the usability of the descriptive capability of the file format.

Embedded Devices

D-55 E mbedded Devices Process

Implementation Subcommittee Sunday, March 23

Chairs: Vern Solberg, Solberg Technical Consulting; Rajesh C. Kumar, Viasystems North America, Inc.

This subcommittee will discuss IPC-7092, Design and Assembly Process Implementation for Embedded Components, which describes the design and assembly challenges for implementing passive and active components in either formed or inserted methodology on a printed board. The new standard focuses on fabrication and assembly processes and attempts to identify various board types where components are inserted on one or both sides of a center core encapsulated by additional HDI layers.

Environment, Health & Safety (EHS) 4-30 E nvironment, Health & Safety Committee Wednesday, March 26

Chair: Lee Wilmot, TTM Technologies, Inc. Vice Chair: Bret Bruhn, Viasystems Group, Inc.

The EHS committee is responsible for promoting cleaner and safer electronics manufacturing worldwide. The committee will discuss global, legislative and regulatory issues affecting the electronics industry.

4-32 E quipment Safety Subcommittee Wednesday, March 26 Chairs: Stefan Radloff, Intel Corporation; Lee Wilmot, TTM Technologies, Inc.

This committee is developing a standard for equipment safety in the PCB/electronics industry. Equipment users require some basic safety requirements for equipment; however, those requirements vary from customer to customer. The standard will establish a common set of safety expectations for equipment that will help ensure that safety is designed into equipment from the beginning and that custom requirements are minimized.

4-34b M arking, Symbols and Labels

for Identification of Assemblies, Components and Devices Task Group Wednesday, March 26

Chairs: Stephen Tisdale, Intel Corporation; Lee Wilmot, TTM Technologies, Inc.

With the transition to a variety of lead-free solders and the use of tin-lead solders in certain end-use applications, labeling of printed board properties is increasingly important. This combined working group of IPC and JEDEC will discuss further enhancements to IPC/JEDEC J-STD609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes.

www.IPCAPEXEXPO.org

Fabrication Processes

4-14 P lating Processes Subcommittee

Wednesday, March 26

Chairs: George Milad, Uyemura International Corp.; Gerard Oâ&#x20AC;&#x2122;Brien, Solderability Testing & Solutions, Inc.

D-15 F lexible Circuits Test Methods

Subcommittee Wednesday, March 26

Chairs: Rocky Hilburn, Insulectro; Duane Mahnke, DBMahnke Consulting

This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating. The subcommittee is working on Revision A of IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards.

This subcommittee provides test methods required by other subcommittees within the D-10 Flexible Circuits Committee. IPC-TM-650, Test Methods Manual, which is defined in all flexible circuits committee documents, will be examined in detail for applicability and need for replacement or revision. Also, any test methods specified in new flexible circuitry documents will be generated by this subcommittee.

Flexible and Rigid-Flex Printed Boards

High Speed/High Frequency Interconnections

D-11 F lexible Circuits Design Subcommittee Wednesday, March 26 Chair: William Ortloff Sr., Raytheon Company Vice Chair: Mark Finstad, CID, Flexible Circuit Technologies, Inc.

This subcommittee is working on Revision D of the IPC-2223 flexible printed board design standard.

D-12 F lexible Circuits Specifications Subcommittee Wednesday, March 26

D-20 H igh Speed/High Frequency Committee Tuesday, March 25

Chair: Edward Sandor, Taconic Advanced Dielectric Division Vice Chair: Roy Keen, Rockwell Collins

This is a general committee meeting addressing goals of the various high speed/high frequency subcommittees and task groups.

D-22 H igh Speed/High Frequency Board

Chair: Nick Koop, CID, TTM Technologies Vice Chair: Mahendra Gandhi, Northrop Grumman Aerospace Systems

Performance Subcommittee Wednesday, March 26

D-12a U L 796F and UL746F Task Group

This subcommittee is developing Revision C of IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.

Chair: Duane Mahnke, DBMahnke Consulting Vice Chair: Crystal Vanderpan, UL LLC

D-23 H igh Speed/High Frequency Base

This subcommittee is initiating a D revision of IPC-6013, Qualification and Performance Specification for Flexible Printed Boards. Thursday, March 27

This task group has restarted its efforts to assist Underwriters Laboratories with industry input on revising the UL standard 796F.

D-13 F lexible Circuits Base Materials Subcommittee Wednesday, March 26

Chair: Clark Webster, ALL Flex LLC Vice Chair: Michael Beauchesne, Amphenol Printed Circuits, Inc.

The subcommittee has successfully released the A revisions of all three flexible circuits base materials documents, IPC-4202, IPC-4203 and IPC-4204. In addition to adding amendments to all three materials documents, the subcommittee will begin to revise IPC-FC-234, PSA Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits.

Chair: Lance Auer, Raytheon Missile Systems Vice Chair: Mahendra Gandhi, Northrop Grumman Aerospace Systems

Materials Subcommittee Wednesday, March 26

Chair: Edward Sandor, Taconic Advanced Dielectric Division Vice Chair: Dan Welch, Arlon Materials for Electronics

This subcommittee will soon ballot Amendment 1 to IPC-4103A that corrects errors which appeared in Revision A of the document. Once the Amendment is incorporated into IPC-4103A, the subcommittee will discuss the B revision of IPC-4103.

D-24a T DR Test Methods Task Group Tuesday, March 25

Chair: Louis Hart, Ph.D., CIT, Compunetics Inc. Vice Chair: Eugene Mayevskiy, TE Connectivity

This task group is discussing a revision to IPC-TM-650, Method 2.5.5.7, for impedance testing of lines on printed boards.

Standards Development Meetings D-24c H igh Frequency Test Methods Task

V9-10a I PC EMS Management Council

Chair: Glenn Oliver, DuPont Vice Chair: John Coonrod, Rogers Corporation

Chairs: Stephen Pudles, Spectral Response, LLC; Mark Wolfe, Phoenix International Corporation

Group: Frequency-Domain Methods Tuesday, March 25 This task group monitors the needs of the microelectronics industry for high frequency dielectric test methods.

Management

8-41 T echnology Roadmap Subcommittee Monday, March 24 Chair: John Fisher, Interconnect Technology Analysis, Inc.

This subcommittee will confirm or amend the strategy used for the 2013 IPC International Technology Roadmap. The emulator vs. market model will be re-examined for the 2015 release, and the group will discuss lessons learned from using a distributed processing model for Roadmap creation.

CCC Committee Chairman Council (By Invitation) Sunday, March 23

Chair: David Torp, IPC

This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs.

E-30 C onflict Minerals Due Diligence

Committee Friday, March 28

Chair: John Ciba Jr.

This committee will discuss IPC-1081, Conflict Minerals Due Diligence Guidance, a white paper that will help the electronics industry comply with due diligence requirements for conflict minerals under Section 1502 of the Dodd-Frank Act.

G-10 I PC Government Relations Committee

Meeting (By Invitation) Tuesday, March 25

Chair: Mikel Williams, JPS Industries, Inc.

The GR Committee will review IPC’s current and future government relations activities including identification of priority issues for 2014. Following the closed meeting, there will be an open forum (see page X) to share information with attendees and receive their input.

TAEC T echnical Activities Executive Committee (By Invitation) Monday, March 24

Steering Committee (By Invitation) Wednesday, March 26

The IPC EMS Management Council helps manufacturers of electronics assemblies to be more productive and profitable. Its steering committee provides leadership in identifying and developing financial, managerial and technical programs to meet the needs of EMS companies and their customers.

V9-20 I PC PCB Management Council

Steering Committee (By Invitation) Wednesday, March 26 Chair: Peter Bigelow, IMI Inc.

The IPC PCB Management Council provides opportunities for presidents and senior-level managers of printed board manufacturing companies to exchange ideas, and identifies and disseminates information about trends and issues.

V9-40 P CB Suppliers Management Council

Steering Committee (By Invitation) Thursday, March 27 Chair: Richard Lies, Chemcut Corporation

The PCB Suppliers Management Council’s objective is to identify and execute programs to enhance the competitive position of IPC member companies that supply equipment and materials to the printed circuit board industry. The PCB Suppliers Management Council Steering Committee consists of several subcommittees that help the council meet its many goals. New subcommittees are created as new industry needs are identified.

V9-40d I PC PCB New Technology

Subcommittee (By Invitation) Wednesday, March 26 Chair: Kenneth Parent, Insulectro

The IPC PCB New Technology Subcommittee is dedicated to educating the electronics industry supply chain on the latest technological developments. This subcommittee is responsible for the Embedded Devices Users Group, which is currently developing a benefits model on embedded passives.

V-EMTSC T MRC Steering Committee Tuesday, March 25

Chair: Mike Carano, OMG Electronic Chemicals

This steering committee will meet over dinner to discuss IPC’s market research programs and Executive Summit.

Chair: Douglas Pauls, Rockwell Collins

This committee comprises leaders of all IPC general committees and oversees IPC’s standardization efforts.

www.IPCAPEXEXPO.org

V-SMEMA-CN S MEMA Council

D-31b I PC-2221/2222 Task Group

V-SPVCA S older Statistical Subcommittee

Chair: Gary Ferrari, CID+, CIT, FTG Circuits Vice Chair: Clifford Maddox, Boeing Company

Wednesday, March 26

(By Invitation) Tuesday, March 25

Chair: Karl Seelig, AIM, Inc.

Tuesday, March 25

This task group is working on a C revision of IPC-2221, Generic Standard on Printed Board Design.

This committee will discuss IPC’s solder statistical program.

Printed Electronics

Packaged Electronic Components

Roadmap Subcommittee Wednesday, March 26

B-10a/ Joint Meeting — Plastic Chip Carrier JEDEC Cracking Task Group and JEDEC JC-14.1 Tuesday, March 25

Chair: Steven Martell, Sonoscan Inc.

During this joint meeting, these groups will continue revising IPC/JEDEC J-STD-020D, IPC/JEDEC Moisture/ Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, and J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Printed Board Design Technology 1-10b C urrent Carrying Capacity Task Group Monday, March 24

Chair: Michael Jouppi, Lockheed Martin

This task group is revising IPC-2152 for sizing internal and external conductors; and will discuss high current, microvias, parallel conductors and other potential topics of revision.

1-10c T est Coupon and Artwork Generation

Task Group Monday, March 24

Chair: Timothy Estes, Conductor Analysis Technologies, Inc. Vice Chair: Philip Henault, Raytheon Company

This task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. The task group is evaluating the need for new coupon designs, including CAF and modifications to the A/B-R design.

1-13/ Joint Meeting — Land Pattern 5-21a Subcommittee and IPC-7070 Task Group Wednesday, March 26

Chairs: Lionel Fullwood, WKK Distribution Ltd.; Thomas Hausherr, CID+, PCB Libraries; Rainer Taube, MIT, Taube Electronic GmbH Vice Chair: Gary Ferrari, CID+, CIT, FTG Circuits

This joint meeting will consider component mounting issues being addressed in two IPC standards: IPC-7070, Component Mounting: Issues and Recommendations and IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern. The combination of these two documents will be harmonized to facilitate “best practices” for both fabrication and assembly.

8-61 P rinted Electronics Technology Chair: Daniel Gamota, Jabil Circuit, Inc. (HQ)

This subcommittee will discuss the strategy for developing a printed electronics technology roadmap.

D-61 P rinted Electronics Design Subcommittee Thursday, March 27

Chairs: Daniel Gamota, Jabil Circuit, Inc. (HQ); Jie Zhang, Ph.D., Institute of Materials Research & Engineering (IMRE)

The subcommittee will focus on updating IPC/JPCA-2291, Design Guidelines for Printed Electronics.

D-62 P rinted Electronics Base Material/

Substrates Subcommittee Thursday, March 27

Chairs: Daniel Gamota, Jabil Circuit, Inc. (HQ); Scott Gordon, DuPont Teijin Films

The subcommittee will continue to gather input for Revision A of IPC/JPCA 4921, Requirements for Printed Electronics Base Materials.

D-63 P rinted Electronics Functional

Materials Subcommittee Thursday, March 27

Chair: Josh Goldberg, Taiyo America Inc. Vice Chair: Daniel Gamota, Jabil Circuit, Inc. (HQ)

The subcommittee will review lessons learned on the release of IPC-4591, Requirements for Printed Electronics Functional Materials, and begin collecting data for expansion and an eventual A revision.

D-64 P rinted Electronics Final Assembly Subcommittee Thursday, March 27

Chair: Daniel Gamota, Jabil Circuit, Inc. (HQ)

The subcommittee will focus on developing a draft of IPC6901, Performance Requirements for Printed Electronics Assemblies.

D-66 P rinted Electronics Processes Subcommittee Thursday, March 27

Chairs:Hirofumi Matsumoto, Nippon Mektron Ltd.; Kurt Schroder, Novacentrix

The subcommittee will focus on developing a draft of IPC6901, Performance Requirements for Printed Electronics Assemblies.

Standards Development Meetings Process Control

7-23 A ssembly Process Effects Handbook

Subcommittee Tuesday, March 25

Chairs: Greg Hurst, RSI, Inc.; Sharon Ventress, U.S. Army Aviation & Missile Command

This committee will concentrate on completion of a companion document to the modification and repair document, IPC-7711/7721. The new process effects or troubleshooting guide will have a similar focus for process effects related to the assembly (IPC-9111).

7-24 P rinted Board Process Effects

Handbook Subcommittee Tuesday, March 25

Chairs: Larry Foster, Lockheed Martin Missiles & Fire Control; Dennis Fritz, MacDermid, Inc.

This subcommittee will concentrate on a companion document to the modification and repair document, IPC7711/7721. The new process effects or troubleshooting guide will have a similar focus for process effects related to the printed board (new document IPC-9121) and will be more closely tied to IPC-A-600 acceptability criteria.

Product Assurance

7-30 P roduct Assurance Committee

Monday, March 24

7-31h/ Joint Meeting â&#x20AC;&#x201D; IPC-HDBK-620 7-31k Handbook and Wire Harness Design Task Groups Wednesday, March 26

Chairs: Robert Cooke, CIT, NASA Johnson Space Center; Brett Miller, USA Harness, Inc. Vice Chair: Christopher Olson, CIT, Minnesota Wire and Cable Co

These two task groups have combined to make wire harness design and wire harness handbook documents. This meeting will continue the discussion on the content of IPC-D-620, Design Requirements for Cable and Wiring Harnesses.

7-31j R equirements for Structural Enclosure

Task Group Wednesday, March 26

Chairs: Eddie Hofer, Rockwell Collins; Richard Rumas, CIT, Honeywell Canada

This task group is developing a handbook and the acceptance standard for box-level assembly of electronic enclosures for use in military and aerospace applications. The task group will also celebrate the publication of IPC-HDBK-630, Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

7-32c E lectrical Continuity Testing Task Group Monday, March 24

Chair: Mel Parrish, STI Electronics, Inc. Vice Chair: Mike Hill, Viasystems Group, Inc.

Chair: Mike Hill, Viasystems Group, Inc.

7-31b I PC-A-610 Task Group

Product Reliability

This is a planning meeting for all task group and subcommittee leaders of the Product Assurance Committee. Saturday, March 22

Chairs: Jennifer Day, CIT, U.S. Army Aviation & Missile Command; Constantino Gonzalez, MIT, ACME Training & Consulting

This task group is developing revision F of IPC-A-610, Acceptability of Electronic Assemblies. The goal for this meeting is to prepare the standard for ballot.

7-31bt I PC-A-610 Technical Training

Task Group Wednesday, March 26

Chair: Mary Muller, Crane Aerospace & Electronics

This technical training committee is meeting to review lessons learned in the current IPC-A-610 training program and set goals for training changes when the next revision is published.

This task group will discuss goals for a B revision of IPC9252, Requirements for Electrical Testing of Unpopulated Printed Boards.

6-10c P lated-Through Via Reliability-

Accelerated Test Methods Task Group Tuesday, March 25 Chair: Randy Reed, Viasystems Group, Inc.

This task group is developing IPC-TM-650, Method 2.3.25, Capacitance of Printed Board Substrates After Exposure to Assembly, Rework, and/or Reliability Tests.

6-10d S MT Attachment Reliability Test Methods Task Group Tuesday, March 25

Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory Vice Chair: Vasu Vasudevan, Intel Corporation

This task group develops and maintains surface mount reliability standards within the IPC-9700 series.

6-11 P rinted Board Coplanarity

Subcommittee Wednesday, March 26

Chair: John Davignon, Davignon Consultancy, LLC

This subcommittee has developed IPC-9641, High Temperature Printed Board Flatness Guideline, and is seeking industry feedback for a revision effort.

www.IPCAPEXEXPO.org

Rigid Printed Boards

3-11g C orrosion of Metal Finishes Task

Specifications Task Groups Sunday, March 23

Chair: Beverley Christian, Ph.D., BlackBerry Vice Chair: Helen Holder, Hewlett-Packard Company

7-31a/ Joint Meeting — IPC-A-600 and D-33a Rigid Printed Board Performance Chair: Mark Buechner, BAE Systems Vice Chair: Randy Reed, Viasystems Group, Inc.

These task groups are preparing the ballots for IPC-A-600J and IPC-6012D.

D-35 P rinted Board Storage and Handling Subcommittee Monday, March 24

Chair: Joseph Kane, BAE Systems Platform Solutions Vice Chair: C. Don Dupriest, Lockheed Martin Missiles & Fire Control

This subcommittee is reviewing content for the A revision of IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 P rinted Board Process Capability,

Quality and Relative Reliability Benchmark Test Subcommittee Monday, March 24 Chair: Gary Long, Intel Corporation

This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers. This subcommittee meeting is open to all interested parties.

Terms and Definitions

2-30 T erms and Definitions Committee Sunday, March 23

Co Chairs: Vicka White, Honeywell Inc. Air Transport Systems; Steven Bowles, Viasystems Group Inc.

This committee is working on Revision M of the IPC-T-50 terms and definitions standard.

Testing

3-11f U L/CSA Task Group Tuesday, March 25

Chair: Douglas Sober, Shengyi Technology Co. Ltd.

This task group addresses issues relative to UL’s standards on rigid (nonflexible) laminates (UL-746E) and on rigid (nonflexible) printed boards (UL-796). The technical issues will feed into the UL STP meeting on these two UL standards.

Group Thursday, March 27

This group is exploring and gathering data on the effects of corrosion on surface finishes through the use of mixed flowing gas (MFG) testing. Test facilities capable of running very high levels of hydrogen sulfide (≥1700 ppb) in conjunction with three other corrosive gases were located and the first cycle of round robin MFG testing was completed. In addition to a second round of MFG testing due to very mixed results from the first round, the task group is also looking at Flowers of Sulfur (FoS) testing for both printed board surface finishes as well as component lead finishes.

7-11 T est Methods Subcommittee Tuesday, March 25

Chair: Joseph Russeau, Precision Analytical Laboratory, Inc. Vice Chair: Graham Naisbitt, Gen3 Systems Limited

This subcommittee meets to review, validate and approve new or revised IPC-TM-650 Test Methods.

7-12 M icrosection Subcommittee Wednesday, March 26

Chair: Russell Shepherd, Microtek Laboratories Vice Chair: Randy Reed, Viasystems Group, Inc.

This task group is revising and combining IPC-TM-650 Methods 2.1.1 and 2.1.1.2 for microsection preparation and evaluation, addressing blind and buried via structures.

UL-STP UL STP Committee (By Invitation) Friday, March 28

Chair: Bradley Schmidt, Underwriters Laboratories Inc.

This meeting of the Standards Technical Panel (STP), the official voting body for four UL Standards: UL 746E, UL 796, UL 746F and UL 796F, will provide STP members with additional information on proposed technical changes to one or more of the four UL standards.

Xtras

8-70 C oalition for Advancement of

MicroElectronic Systems Technology (CAMEST) Sunday, March 23

Chair: Dennis Fritz, MacDermid, Inc.

This group will meet to review its formation and structure, and activities for 2014. CAMEST will also discuss the development of the multi-device packaging solutions status and action plan. The existing activity will also determine the exclusion of 3-D IC interconnections with through-silicon vias and how these will be handled to provide a roadmap for CAMEST membership in 2014.

Hotel/Travel Hotel

Travel

Mandalay Bay Resort and Convention Center 3950 Las Vegas Blvd. South Las Vegas $185 (available until March 3)

American Airlines

Save five percent off the lowest applicable fares on any American Airlines/oneworld carrier when you use 9634DD. Rates are available March 19–31. Online: www.aa.com/group By Phone: 800-433-1790 (U.S./Canada) (5:00 am–12:00 am Central time) For additional travel information visit www.IPCAPEXEXPO.org/hotel.

Book Now, Pay Later

Enjoy more than exclusive hotel discounts when you book through onPeak, the only official housing partner of IPC APEX EXPO 2014. Reserve your room without paying anything upfront (onPeak only needs your credit card as a guarantee) and enjoy flexible reservation policies — just in case your plans change.

IPC APEX EXPO is the best place to see multiple, various suppliers of equipment all in one place. Scott Buttars Operation Manager ZELPRO Assembly Solutions

Special IPC rates will be available until March 3, 2014, or until all rooms are booked, so make your reservation today! Online: www.IPCAPEXEXPO.org/hotel By Phone: 800-862-3038 or +1 847-527-7300

Policies Any function that is not part of the “official program” is prohibited, from the first meeting to the close of the event. IPC does not permit solicitation by nonexhibiting companies. Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event will be asked to leave immediately.

www.IPCAPEXEXPO.org

Registration Options

Visit www.IPCAPEXEXPO.org/register to sign up today!

Choose any of the following to create your perfect package. Register by February 28 and save 20%!

Group Discount: Register four colleagues from the same company, same company location, at the same time, for items marked with a and deduct $100 from each registration. NONMEMBER MEMBER FREE Exhibit Hall Only — includes admission to the exhibit hall and event essentials ($35 on-site) All Access Package $1,155 includes technical conference sessions and online proceedings • standards development meetings $1,505 • up to five half-days of PD courses • IPC luncheons (Mon., Tues. and Wed.) • Show floor concession cash on Thursday • Design Forum • PCB Supply Chain Leadership Meeting or EMS Management Council Meeting (must qualify) • event essentials

Technical Conference Full Conference includes technical conference sessions and online proceedings • standards development meetings • event essentials (luncheons not included) One-Day Conference includes conference sessions on day of your choice (Tues., Wed., or Thurs.) • standards development meetings • event essentials (luncheons and conference proceedings not included)

$695 $575

$365

$305

Executive Management Programs

PCB Supply Chain Leadership Meeting (must qualify)* $850 $695 includes Monday meeting • Monday luncheon • VIP Networking Dinner • event essentials EMS Management Council Meeting (must qualify)* $850 $695 includes Monday meeting • Monday luncheon • VIP Networking Dinner • event essentials VIP Networking Dinner for guest $135 ea *see page 12

Professional Development Courses

Half-Day Course includes three-hour course and supporting materials. Select up to five courses.

$385 ea

$310 ea

Standards Development Committee Meetings Committee Meetings Plus Conference $785 $660 includes technical conference sessions and online proceedings • standards development meetings • IPC luncheons Mon., Tues. and Wed. • Show floor concession cash on Thursday • event essentials Committee Networking Meetings $195 $175 includes standards development meetings • IPC luncheons Monday, Tuesday ($205 on-site) and Wednesday • Show floor concession cash on Thursday • event essentials Committee Meetings FREE includes standards development committee meetings • event essentials ($50 on-site) (luncheons not included)

Design Forum

$410 $335

includes Monday meeting • continental breakfast • networking lunch • standards development meetings • event essentials

Additional Items

Technical Conference Proceedings (provided online) $185 $160 Luncheons (each) Select Monday, Tuesday and/or Wednesday $55 ea Need assistance? Call +1 877-472-4724 (toll free in U.S. and Canada) or +1 847-597-2860 or e-mail registration@ipc.org.

Event Essentials

• Exhibit Hall • Tuesday Show Floor Welcome Reception • Keynote Sessions

• BUZZ Sessions • Poster Sessions • First-Timers’ Welcome

• Women in Electronics Networking Meeting • New Products Corridor

• IPC Hand Soldering Competitions • International Reception

Visit www.IPCAPEXEXPO.org/register! Registration for IPC Designer Certification and EMS Program Management Certification is separate. To register, visit www.IPCAPEXEXPO.org/certification.

www.IPCAPEXEXPO.org

速

IPC 3000 Lakeside Drive, 309 S Bannockburn, IL 60015-1249 USA