2009 IPC APEX EXPO Conference Brochure by IPC

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Conference & Exhibition, March 31–April 2, 2009 Meetings, March 29–April 2, 2009 Mandalay Bay Resort & Convention Center, Las Vegas, Nevada www.IPCAPEXEXPO.org +1 847-597-2860 shows@ipc.org

It’s our industry’s own event — the world’s premier technical conference and exhibition for printed boards, design, electronics manufacturing and test. Join your colleagues and an international audience of more than 13,000 in exciting Las Vegas for education, networking and standards development. There’s no other event like it in the world! This event is …

IPC Board of Directors

Produced by: IPC — Association Connecting Electronics Industries® Sponsored by: • China Printed Circuit Association (CPCA) • European Institute of Printed Circuits (EIPC) • Hong Kong Printed Circuit Association (HKPCA) • Indian Printed Circuits Association • International Electronics Manufacturing Initiative (iNEMI) • International Microelectronics and Packaging Society (IMAPS) • Japan Electronics Packaging and Circuits Association (JPCA) • Japan Robotics Association (JARA) • JEDEC Solid State Technology Association • Korea Printed Circuit Association (KPCA) • Microelectronics Packaging and Test Engineering Council (MEPTEC) • Surface Mount and Circuit Board Association (SMCBA) • Taiwan Printed Circuit Association (TPCA) In cooperation with: • Adhesives and Sealants Industry (ASI) • Advanced Packaging • ASSEMBLY • Chip Scale Review • Circuit Cellar • Circuitnet • CircuiTree • Circuits Assembly • Dempa Publications, Inc. • EMChina.org.cn • EMSNow • EMT Worldwide • Equipment Protection • Global SMT & Packaging • IConnect007 • MDeviceNow.com • Medical Product Outsourcing • Metal Finishing • Printed Circuit Design & Fab • Printed Circuit Journal • Printed Circuit World • Reed Business Information Asia • SMT • Surface Mounting World • Test & Measurement World • THERMAL News • U.S. Tech • Wiring Harness News

Chairman of the Board Nilesh S. Naik, OneSource Group Vice Chairman Robert Ferguson, Rohm and Haas Electronic Materials Secretary/Treasurer Stephen Pudles, API Nanotronics Corporation Immediate Past Chairman C. James Herring, Creation Technologies–Chicago President and CEO Dennis P. McGuirk, IPC

Directors Peter Bigelow, IMI Inc. Robert J. Black, Juki Automation Systems, Inc. Michael C. Brown, Logic Corporation Jack Calderon, Lincoln International Michael V. Carano, OMG Electronic Chemicals Paul C. Langston, Coretec Inc. Peter J. Murphy, Astrodyne Corporation Joseph O’Neil, Hunter Technology Marc Peo, Heller Industries, Inc. Rex Rozario, Graphic Plc Don Schroeder, CTS Electronics Manufacturing Solutions Shane Whiteside, TTM Technologies Alan W. Wong, Aavid Thermalloy, LLC Zhou Xin, Huawei Technologies Co., Ltd. Sammy Yi, Flextronics International A very special thanks to our planning committees!

The show, conference and meetings will take place at the Mandalay Bay Resort & Convention Center 3950 Las Vegas Blvd. South, Las Vegas, Nevada USA

IPC APEX Trade Show Subcommittee Chairman: Leo van de Vall, Assembléon America Jason Spera, Aegis Industrial Software Corporation Mike Konrad, Aqueous Technologies Alec J. Babiarz, Asymtek Tom Nash, BTU International Karen Moore-Watts, DEK International GmbH Sebastian Schmidt, ERSA Inc. Scott E. Wischoffer, Fuji America Corporation Marc Peo, Heller Industries Douglas Dixon, Henkel Corporation Brian Duffey, MYDATA Automation, Inc. Juan A. Arango, Panasonic Factory Solutions Company of America Leonard D. Garrison, II (Butch), Siemens Energy & Automation, Inc. Jeff Mogensen, Speedline Technologies Inc. Brad Bennett, Universal Instruments Corporation

IPC EXPO Trade Show Subcommittee Chairman: Fred Johnson, Schmid Systems Inc. Rick Lies, Chemcut Corporation Art Wolfrum, MacDermid, Inc. David Vaughan, Taiyo America, Inc.

Technical Program Committee Conference Director: Greg Munie, Ph.D. Jasbir Bath, Bath Technical Consultancy Michael Beauchesne, Amphenol Printed Circuits, Inc. Beverley Christian, Ph.D., Research in Motion Limited Gary Ferrari, FTG Patty Goldman, Dielectric Solutions David H. Hoover, Multek Kim Hyland, Cisco R. Wayne Johnson, Ph.D., Auburn University

Welcome Meet James Fuller Like many executives who are responsible for leading a company’s operations, James W. Fuller, Vice President and General Manager, Fabrication, for Endicott Interconnect Technologies, has an extremely full schedule. But leaving the office for a few days each year to attend IPC APEX EXPO™ actually helps Jim improve operations. “The event is an extremely efficient vehicle to meet with most of my key suppliers, and to conduct meaningful business. With the pace of today’s business, I really value the opportunity to get so much done in so little time.”

Jim’s advice to new attendees: “Whether you’re an exhibitor or attendee, don’t cut it short. It’s a three day show because there is so much to see. Use all the time they give you.”

Taking the Bull by the Horns … In uncertain times, it is comforting to have a resource to count on through it all. For me, and many in the industry, that resource is our industry’s association, IPC. From its inception, IPC has served as an advocate for our industry and the vehicle through which we can band together to drive our industry forward. But frankly, when you strip away the name, or pull away the curtain, what we really see is … us. We, the industry, are IPC. So that constant that we count on is us, banding together, leaning on each other, learning from each other and growing stronger through it all. When we demand nothing but the very best from all of us, all of our employees and all of our suppliers, we ensure our success. To give you, and your staff, the tools, information and resources you need to do your best, I invite you to band together with your colleagues at the 2009 IPC APEX EXPO — for an intense period of learning, networking and building business contacts. As always, we’re bringing the movers and the shakers of the industry from around the world to share the latest technologies, processes, equipment, best practices, efficiencies and solutions to today’s challenges. You just need to take the bull by the horns. My very best wishes to you, Nilesh S. Naik CEO OneSource Group

Table of Contents Welcome............................................ 1

Programs for Designers.................... 9

Schedule of Events............................. 2

Free Forums...................................... 9

Who’s Exhibiting............................... 3

Technical Conference......................10

Special Events

IPC Standards Development............15 Meetings

Keynote Sessions............................ 6 OEM Summit.................................. 6

Places to Go ... People to Meet........... 7 Programs for Executives................... 8

Professional Development Courses.. 21 Travel.............................................

Registration Options....................... 32

Viva Las Vegas After each full day of ideas and knowledge to feed your mind, there’s plenty to do in Las Vegas. The total experience of study and city will help you recharge, so you can tackle your toughest challenges back at work with new energy — give up the ordinary and plan now for something extraordinary!

Schedule of Events Saturday, March 28

Wednesday, April 1

8:00 am–5:00 pm

7:30 am–8:30 am Women in Electronics Breakfast Meeting

I PC Standards Development Committee Meetings

Sunday, March 29 8:00 am–6:00 pm IPC Standards Development Committee Meetings 8:30 am–5:00 pm Full- and half-day Professional Development Courses 12:30 pm–9:00 pm IPC CCA Golf Tournament, Reception and Dinner

Monday, March 30 7:30 am–9:00 pm IPC PCB Executive Management Meeting & Dinner 7:30 am–9:00 pm IPC EMS Executive Management Meeting & Dinner 8:00 am–5:00 pm IPC Standards Development Committee Meetings

8:00 am–5:00 pm IPC Standards Development Committee Meetings 8:00 am–9:30 am Keynote Session 8:30 am–11:45 am Free Forums 9:00 am–3:30 pm Technical Conference Sessions 10:00 am–6:00 pm Exhibits Open 12:00 pm–1:30 pm

Event Awards Luncheon

1:30 pm–3:30 pm Technical Conference Sessions 1:30 pm–3:00 pm Free Forums 3:30 pm–4:30 pm Poster Presentations by Authors 6:00 pm–9:00 pm

Best in Test Awards

Thursday, April 2 8:00 am–10:00 am OEM Summit

8:00 am–8:00 pm IPC Designers Day & Reception

8:00 am–12:00 pm IPC Standards Development Committee Meetings

8:30 am–5:00 pm Full- and half-day Professional Development Courses

8:00 am–1:00 pm EMS Program Management Continuing Education Series

12:00 pm–1:30 pm

8:30 am–11:45 pm Free Forums

Event Awards Luncheon

4:00 pm–5:30 pm Circuits Assembly’s Service Excellence Awards

9:00 am–11:45 pm Technical Conference Sessions

5:30 pm–6:30 pm International Reception

10:00 am–2:00 pm Half-day Professional Development Courses

6:30 pm–8:00 pm

10:00 am–2:00 pm Exhibits Open

SMT Vision Awards

2:30 pm–3:30 pm

Closing Keynote Session

Tuesday, March 31 7:30 am–8:30 am IPC First-Timers Welcome Breakfast 8:30 am–9:30 am Opening Keynote Session 9:45 am–10:00 am Ribbon Cutting Ceremony

All events in gold are FREE with pre-registration

10:00 am–5:00 pm IPC Standards Development Committee Meetings 10:00 am–6:00 pm Exhibits Open 12:00 pm–1:30 pm IPC Annual Meeting and Luncheon

As of October 30, 2008. Subject to change.

ON THE SHOW FLOOR Innovative Technology Center (ITC) Cutting-edge products and services that have been selected by an expert technology panel, will be on display in the ITC. Get a sneak preview of the equipment, materials and services that will change the direction of our industry.

IPC Bookstore Need more detail on a certain PCB or electronics assembly issue, but don’t know where to get the information? Stop by IPC’s bookstore and peruse industry standards and publications. Special member prices will be extended to all attendees for on-site purchases!

FREE Internet Lounge Take a quick minute to catch up with the office so you can focus on the new products on the show floor.

All-Academic Poster Competition Get Out and Vote! In a collegial spirit we’re showcasing the best posters from international colleges and universities with a strong focus on the electronics industry. Your mission is to help IPC determine the top three. Visit the exhibition to view the posters and cast your vote. Winners will be announced at the closing keynote on Thursday, April 2, at 2:30 pm.

Real Time With … IPC Just inside the entrance to the exhibit hall, you’ll find the folks from iConnect007.com hosting a series of industry thought-leader roundtables and interviews. Check the show home page at www.IPCAPEXEXPO.org during or after the show to see extensive video coverage and photos.

1:30 pm–4:45 pm Technical Conference Sessions 1:30 pm–4:45 pm Free Forums 5:00 pm–6:00 pm A Look into the Future Happy Hour Welcome Reception

www.IPCAPEXEXPO.org

Who’s Exhibiting See and compare equipment. Discover new processes to gain greater efficiency. Find supplies to save you hundreds of thousands of dollars. Uncover new solutions that will improve your bottom line. Every year, attendees tell us that they’ve learned something important or found a critical new supplier, often with a big impact on their companies. That can be your story, too! Exhibits Only registration is FREE to individuals who pre-register online at www.IPCAPEXEXPO.org. Accuassembly Acculogic, Inc. ACE Production Technologies, Inc. ACL Staticide ADS Gold Inc. Advanced Packaging Advanced West Aegis Electronic Group Inc. Aegis Industrial Software Corporation Aeroflex AGI Corporation Agilent Technologies AIM Airtech International Inc. AIR-VAC Engineering Co., Inc. Akrometrix, LLC all4-PCB (North America) Inc. Allied High Tech Products Inc. Alternative Solutions Inc. AmeriVacS Amerway Incorporated Amistar Automation Inc. Apexyl Enterprises Ltd. Apollo Seiko Ltd. APS NOVASTAR LLC Aqueous Technologies Corp. Arlon Technology Enabling Innovation Artnet Pro, Inc. ASC International Ascentec Engineering ASG Division of Jergens Inc. Assembléon America ASSEMBLY ASSET InterTech Asymtek ASYS Inc.

Atotech USA, Inc. Austin American Technology Automa-Tech ORC imaging Bare Board Group, Inc. BE Semiconductor Industries N.V. Beamworks, Inc. BEST, Inc. Blackfox Training Institute, LLC Blue Thunder Technologies BPM Microsystems Brady Corporation Brinkmann Instruments Brock Electronics Ltd.

As a manufacturing engineer at SPX, Barry Borwege finds IPC APEX EXPO® to be a helpful venue for sourcing new equipment, every year. “I like that I can do comparison shopping under one roof. “If I see a feature I like on one machine, I can go to the next one and see how it compares. It’s instant feedback.” BTU International Bürkle North America, Inc. C.A. Picard International cab Technology, Inc. CAC, Inc. Caltex Scientific Calumet Electronics Camtek USA, Inc. CCI Cencorp CeTaQ Americas Chad Industries

CheckSum CHEMCUT Corporation China Printed Circuit Association (CPCA) Chip Scale Review Christopher Associates, Inc. Ciba Cimnet Systems, a Consona Product Cincinnati Sub-Zero Products, Inc. Circuit Cellar Circuit Check Inc. Circuitnet CircuiTree Circuits Assembly Cirris Systems Cobar Solder Products, Inc. Cogiscan Inc. Control Micro Systems, Inc. Conveyor Technologies of Sanford, NC, Inc. Cookson Electronics CORELIS an EWA Company Count On Tools, Inc. Crystal Mark, Inc. Custer Consulting Group CyberOptics Corporation Dage Precision Industries, Inc. Danaher Motion/MEI Datapaq, Inc. DEK International Dempa Publications, Inc. Digitaltest Inc. DIS Inc. Diversified Systems, Inc. DMI International DuPont Eastman Kodak Company Easy Braid Co. ECI Technology EFD, Inc. A Nordson Company EIPC Electra Polymers Ltd. Electro-Comp Services, Inc. Electrolube Electronic Controls Design, Inc. EMCHINA Endicott Interconnect Technologies, Inc. Equipment Protection Magazine List current as of November 6, 2008

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Who’s Exhibiting Equipment Technologies, Inc. ERSA North America ESSEMTEC Europlacer North America Everett Charles Technologies Excellon Automation Exopack Advanced Coatings FASTechnologies, Corp. FCT Assembly Finetech Fischer Technology, Inc. FKN Systek, Inc. FlexLink Systems, Inc. FLIR Infrared Cameras FocalSpot, Inc. FUBA Printed Circuits GmbH Fuji America Corporation Glenbrook Technologies, Inc. Global Automation, Inc. Global SMT & Packaging GOEPEL Electronics Gordon Brush Mfg. Co., Inc. GPD Global HDI Solutions Heller Industries Henkel Corporation HEPCO, Inc. Heraeus Hesse & Knipps, Inc. HIROX-USA, Inc. Hitachi High Technologies America Hitachi Via Mechanics (USA), Inc. HIWIN Corporation HMS Höllmüller Maschinenbau Gmbh Hong Kong Printed Circuit Association (HKPCA) HumiSeal — Chase Specialty Coatings Husson Inc. — ESD/DOS Control I Source Technical Services, Inc. I&J Fisnar Inc. IBE SMT Equipment iConnect007 Indium Corporation Infinite Graphics Innov-X Systems Inovaxe Corporation InsulFAB PCB Tooling

Integrated Process Systems, Inc. Interconnect Systems, Inc. IP Systems LLC IPC Designers Council IPC PCQR2 Database Isola Group ITC Intercircuit ITW Chemtronics JBC Tools JNJ Industries JPCA–Japan Electronics Packaging & Circuits Association JTAG Technologies Juki Automation Systems KIC Koh Young Technology, Inc.

“Take your time and try to look at every booth. I found leads for production supplies and tips on production methods that I hadn’t expected, just from talking to the exhibitors.” Steve Kahn, Technical Operations Manager, Wireless Technology Inc.

Kyzen Corporation L.C.O.A. Laminating Company of America Lewis & Clark, Inc. LPKF Laser & Electronics M+B Plating Racks Inc. MacDermid Incorporated Machine Vision Products Malcomtech International Mania Technologie Outsourcing Services, Inc. MANN Corp. Matrix Circuits Technology Ltd. Matrix Metrologies MDEVICENow.com Medical Product Outsourcing MEPTEC Metal Etching Technology (M.E.T.) Metal Finishing Metris USA/X-Tek Metro SMT MicroCraft

Micron Laser Technology Microscan Systems, Inc. MicroScreen LLC Microtek Labs Mid America Taping & Reeling Inc. Milara Incorporated Millennium Electronics, Inc. MIRTEC Corp. Molded Fiber Glass Tray Company Multiline Technology MYDATA automation Inc. National Graphic Supply NEA Inc. Nihon Superior Co., Ltd. Nihon-Almit (c/o ANA Trading Corp. USA) NIX of America NSWC Crane Division Nutek Americas Inc. Oak Mitsui Inc. OEM Press Systems, Inc. Ohmega Technologies, Inc. OK International OLAMEF USA OMG Electronic Chemicals Omni Training Omron Electronics LLC On Site Gas Systems, Inc. Operations Technology Inc. (OPTEK) Ovation Products Oxford Instruments Industrial Analysis P. Kay Metal, Inc. Pac Tech USA Packaging Technologies, Inc. PACE Inc. Panasonic Factory Solutions Company of America Para Tech Coating, Inc. Park Electrochemical Corp. PCB Planet (India) Ltd. PCB-POOL Pentagon EMS Petroferm Inc. Phibro-Tech, Inc. phoenix | x-ray Systems + Services, Inc. Photo Stencil Pillarhouse USA Plasma Etch, Inc. Pluritec North America, Ltd.

For an up-to-date exhibitor list, visit www.IPCAPEXEXPO.org/exhibitors

www.IPCAPEXEXPO.org

Who’s Exhibiting Polar Instruments, Inc. Polyonics, Inc. Precision PCB Products Premier Semiconductor Services, LLC/LP Printed Circuit Design & Fab Printed Circuit Journal Production Solutions, Inc. Productivity Systems Associates, LLC Pro-Line PROMATION, Inc. Prototron Circuits PVA Q Corporation QA Technology Company, Inc. Q-Fab, Inc. QRP, Inc. QTS — Quick Tensioning Systems, Inc. Qualectron Systems Corporation Qualitek International Inc. Quality Tech Tool Quantum Silicones — QSI QxQ, Inc. R&D Technical Services Inc. RBP Chemical Technology Reactive Nanotechnologies Reed Business Information Asia Rehm Thermal Systems, LLC Rematek — ATE RMD Instruments, LLC Rogers Corporation Rohm and Haas RPS Automation LLC RSF Electronics Inc. Saki America, Inc. Samsung Techwin Ltd./Dynatech Technology, Inc. ScanCAD International, Inc. Schlenk Metallfolien GmbH & Co. KG Schleuniger, Inc. Schmid Systems Inc. USA Scienscope International SEHO North America, Inc. SEICA Inc. Seika Machinery, Inc. SEMI-KINETICS Senju Comtek SERFILCO Ltd.

Shengyi — Paramount Shenzhen Suntak Multilayer PCB Co., Ltd. Siemens Electronics Assembly Systems Simplimatic Automation Smart Sonic Stencil Cleaning Systems Smart Splice LLC SMT SMT Sales LLC SMT Technologies, LLC SOLTEC Corporation Sonoscan, Inc. Sono-Tek Corporation Sony Manufacturing Systems America, Inc. SPEA America Specialty Coating Systems Stoelting LLC Struers Inc. Sun Chemical Suntech Circuits Taconic Taiwan Printed Circuit Association (TPCA) Taiwan Union Technology Corporation Taiyo America, Inc. TAKAYA Corporation TDK — LAMBDA TEAM A.T.E. Technic Inc. Technical Devices Company Temptronic Corporation Test & Measurement World Test Research USA, Inc. THERMAL News Ticer Technologies Tintronics Industries TopLine Totech America Corporation Trace Laboratories, Inc. Transition Automation, Inc. TT electronics — integrated manufacturing services Tyco Electronics U.S. Golden Sum U.S. Tech Ultrasonic Systems, Inc. Underwriters Laboratories, Inc. Unicote — Halco LLC Universal Instruments Corporation

NEW IS YEAR! TH Online Exhibit Hall Extend your trade show experience beyond the show floor! Create your personal planner for the event by using the “My APEX EXPO Planner” function of our new online exhibit hall. Search for companies by keyword, category, name, or by using the “Featured Exhibitors” section of the site. View exhibiting companies on the floor plan, and add them to your agenda! Access photos, audio and video presentations, new products and services listings, press releases, company contacts, and more — it’s all at your fingertips in the Online Exhibit Hall, www.IPCAPEXEXPO.org/exhibitors. UPA Technology Uyemura International Corporation V.J. Electronix Valor Computerized Systems Virtual Industries, Inc. Viscom Inc. Vision Engineering ViTechnology Vitronics Soltec Von Roll USA, Inc. V-TEK Incorporated Winslow Automation, Inc. (aka Six Sigma) Wise srl World Equipment Source (owned by R-1 Source) XJTAG X-Line Assets YesTech, Inc. YSC Technologies YXLON International Inc. ZESTRON America

List current as of November 6, 2008 TM TM

Special Events Keynote Sessions RAY KURZWEIL The Accelerating Future of Electronics and Information Tuesday, March 31 8:30 am–9:30 am Called “the restless genius” by the Wall Street Journal and “the ultimate thinking machine” by Forbes, Ray Kurzweil is an inventor, entrepreneur, author and futurist. Kurzweil’s ideas on the future have been touted by his many fans, ranging from Bill Gates to Bill Clinton. MIT’s Marvin Minsky writes that “with his brilliant descriptions of the coming connections of computers with immortality, Kurzweil clearly takes his place as a leading futurist of our time.” Combining wit and keen insight into contemporary issues of technology and its impact on society, Kurzweil’s presentation will offer engaging demonstrations of cutting-edge technologies. And if we’re lucky, perhaps Ramona, his “virtual female alter ego,” will honor us with her presence. Please join us for a fascinating look into the future, lead by one of the greatest inventors of our time, Ray Kurzweil.

LES STROUD SO ... There I Was ... with Les Stroud Thursday, April 2 2:30 pm–3:30 pm Les Stroud knows what it takes to be a survivor, even when his adversaries are sharks — literally. Best known as star of the highlyacclaimed hit TV series Survivorman, Stroud is a prolific, creative force. He has adeptly combined his love for the outdoors and his skills as a filmmaker to become the only producer in the history of television to produce an internationally broadcast series entirely written, videotaped and hosted alone. Survivorman has gone on to become the highest rated show in the history of both OLN Canada and the Science Channel US and is quickly becoming one of the most popular shows on the Discovery Channel US. Stroud’s addictive personality landed him on the 2007 “Top 100 People We Love To Watch” list for Entertainment Weekly magazine and the host spot for the 20th anniversary of Shark Week on the Discovery Channel. Please join us for the amazing journey of a true survivor.

Global Business Outlook Wednesday, April 1, 8:00 am–9:30 am Walt Custer and Sharon Starr will team up to present the latest data and market trends for the electronics industry. Walt will cover electronics equipment and Walt Custer component markets, as well Sharon Starr IPC Custer Consulting as business performance Group by the leading companies worldwide by industry sector. Sharon will bring IPC survey data to the discussion to identify the latest trends in demand and production for worldwide PCB, EMS and supplier industries, as well as forecasts. Both speakers will comment on the global economy and present some leading indicators, as well as note how seasonal and cyclical trends affect the industry and its supply chain.

First-

Ever!

OEM Summit

Thursday, April 2, 8:00 am–10:00 am A rare and invaluable event, the OEM Summit will present a first-hand look into the technology roadmaps of key OEMs. Join our distinguished panel of senior OEM executives as they unveil their companies’ roadmaps in this ever-changing technology landscape.

www.IPCAPEXEXPO.org

Places to Go ... People to Meet E A Look Into The Future FRE Happy Hour Welcome Reception

Tuesday, March 31

5:00 pm–6:00 pm

Join us for an illuminating hour where we focus on the future with an added twist of fun in our view finder. Enjoy cosmic beverages, culinary creations and collegial camaraderie. In true Vegas style, we’ll transport you through our time warp to an extraordinary place — where the possibilities are as real and endless as you aspire them to be — and where our exhibitors hold the keys to unlocking your most perplexing challenges … you just need to seek them out.

Meet the People Who Move an Industry E FRE International Reception

Monday, March 30

5:30 pm–6:30 pm

Our international friends are invited to relax, have a bite to eat and catch up with colleagues. We’re expecting representatives from more than 50 countries to join us for some “all-American” hospitality at this festive gathering.

IPC and California Circuits Association

CCA Golf Outing Sunday, March 29 Snow Mountain Course Las Vegas Paiute Golf Resort

Network in a wonderful, enjoyable setting. With its spectacular views of the mountains and desert, the course has been named as “One of the Top Courses in the West,” by PGA Magazine. The fee includes 18 holes of golf, GPS-equipped golf carts, lunch, reception and raffle. Registration: 11:00 am; Tee-off: 1:00 pm Fee: $200 (includes golf/lunch/reception) Pre-registration is required. Register online at www.IPCAPEXEXPO.org/register or call +1 847-597-2880.

E FRE First-Timers Welcome Breakfast

Tuesday, March 31

7:30 am–8:30 am

Maximize your time at IPC APEX EXPO with some advice from a few insiders. First-timers are invited for a continental breakfast and an update on how you can get involved and what this event has to offer. Even if you’re not a first-timer, join us for a refresher course on IPC programs and activities.

Luncheons (registration required) IPC Event Awards Luncheon Monday, March 30 12:00 pm–1:30 pm IPC Annual Meeting and Luncheon Tuesday, March 31 12:00 pm–1:30 pm

E Women in Electronics FRE Networking Meeting Wednesday, April 1 Breakfast: 7:30 am Meeting: 7:45 am–8:30 am Last year’s event was standing room only, so it’s back again this year by popular demand! Women are making a greater impact in all areas of the electronic interconnect industry. Join your colleagues from across the supply chain and across disciplines to share your ideas and experiences as a woman and build your industry network. There is no charge to attend this meeting, but be sure to RSVP for this meeting through the online registration process to reserve your place. For more information, contact MaryMacKinnon@ipc.org.

Circuits Assembly’s Service Excellence Awards Monday, March 30

4:00 pm–5:30 pm

17th Annual SMT Vision Awards Monday, March 30

6:30 pm–8:00 pm

Best in Test® Awards Wednesday, April 1 By Invitation Only

6:00 pm–9:00 pm

IPC Event Awards Luncheon Wednesday, April 1 12:00 pm–1:30 pm

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IPC Programs … … for Executives IPC PCB Executive Management Meeting

IPC EMS Management Meeting

Monday, March 30

7:30 am

Networking Breakfast

8:00 am–5:00 pm Presentations

6:00 pm

Networking Dinner

A learning and networking forum for senior-level decision makers in the PCB industry, this meeting focuses on the management issues that are impacting PCB manufacturers the most. Attendees will hear from industry insiders on topics such as future technology drivers, supply chain management, increasing sales and securing funding for growth. More importantly, executives will have the opportunity to exchange thoughts and ideas with their peers on the direction of the industry. This meeting is only open to attendees who are senior level executives of PCB manufacturers.

Networking Dinner

What will the future of the EMS industry be? EMS executives from around the world will spend the day answering this question. Helping them along the way, an impressive line up of industry experts will provide insights to critical challenges facing EMS providers and stimulate new ideas for problem solving. Networking is an important benefit of the event. Attendees will have opportunities throughout the day to network and share thoughts with their peers so that they may walk away with a complete picture of where the industry is headed. This meeting is only open to attendees who are senior level executives of EMS providers.

“Mutual sharing really does benefit the industry and the whole supply chain. The first step in that sharing is building trust, which has to be done in person. And there’s no better place to build those relationships than at the IPC Executive Management Meetings.” Greg Klein, Chairman, Epec LLC

IPC EMS Program Manager Training & Certification Continuing Education Series: Find It. Book It. Grow It: A Robust Process for Account Acquisitions in EMS

Thursday, April 2 8:00 am–12:00 pm Program 12:00 pm–1:00 pm Networking Lunch

Finding the customer is only part of the battle. What happens after the order is booked is a critical component of program management. How does one build strong customer relationships to ensure account growth? This special continuing educational series of the IPC EMS Program Manager Training and Certification Program will cover the best practices of not only winning business, but also ensuring that the account grows. This course is open to anyone in the EMS industry. However, those who have completed or are currently enrolled in the IPC EMS Program Manager Training and Certification Program receive a $200 discount.

“The EMS Management Council meeting provides a unique opportunity to interact with our counterparts from other companies … we talk about common issues and share experiences — and potentially do some brainstorming on how to tackle certain situations. It’s about helping us all be better at what we do and that keeps us all moving forward.” Chuck Needham, Director, Sales & Product Management, Phoenix International Corp.

For more information on these programs, visit www.IPCAPEXEXPO.org/executives.

www.IPCAPEXEXPO.org

… for Designers Designed For You!

The Designers Summit offers you a focused design program as well as access to other critical parts of the supply chain. In one trip, network with designers, learn at the Designers Day program and then hit the show floor to evaluate suppliers. It’s all here at the IPC Designers Summit.

Designers Day

Monday, March 30 It’s full-day program of education and networking specifically for designers like you. In addition to the educational program, Designers Day registration includes lunch and the Designers Day reception. You’ll also have free entrance to the exhibition (Tuesday–Thursday), Tuesday evening welcome reception, standards development meetings, keynote sessions, free forums and poster sessions. Add one full-day or two half-day courses and save significantly with the Designers Day Package.

Agenda 8:00 am–8:15 am

IPC Programs and Plans

8:15 am–9:00 am

The Future of the Design Industry

9:00 am–10:15 am

anufacturing Issues When Considering Signal M Integrity, Dieter Bergman, IPC

10:30 am–12:00 pm EMI Control, Rick Hartley, L-3 Avionics 12:00 pm–1:30 pm

Lunch

1:30 pm–3:00 pm

hat You Need to Learn to Design for HDI W Happy Holden, Mentor Graphics Corporation

3:15 pm–5:00 pm

High-Speed Design

5:00 pm–7:00 pm

Designers Day Reception

Designer Certification (CID and CID+) Earn the credential that promotes your role and expertise to everyone in the printed board and electronics assembly industries. PCB Designer Certification (CID)

Advanced PCB Designer Certification (CID+)

Workshop: Thursday, March 26 and Friday, March 27, 8:30 am–5:00 pm

Exam: Saturday, March 28 8:30 am–3:00 pm

“Arrive early, bring business cards, collect business cards and don’t be afraid to introduce yourself and ask questions. And when you get back to work, keep your handouts from Designers Day nearby. Mine have become a reference that I use at least once a week.” Ruth Delker, CID, Senior PCB Designer, Cipher Systems

… for Everyone Free Forums

FF01: IPC Technology Roadmap

Tuesday, March 31 1:30 pm–3:00 pm Moderator: Jack Fisher, Interconnect Technology Analysis, Inc. Hot off the press! The IPC International Technology Roadmap for 2008-2009 will be released at the show. Be among the first to hear about the future technologies that will drive the electronic interconnect industry.

FF02: iNEMI Technology Roadmap Tuesday, March 31 Moderator: Bob Pfahl, iNEMI

3:15 pm – 4:45 pm

This forum will review highlights of the 2009 iNEMI Roadmap (available to industry in March 2009) and include detailed discussions of several key technologies.

FF03: Test and Inspection Summit

Wednesday, April 1 8:30 am–10:00 am Moderator: Rick Nelson, Test & Measurement World Building on the 2008 Test and Inspection Summit, a panel of experts will bring you up-to-date on the latest test challenges and the technologies that are emerging to deal with them, including in-circuit electrical test, optical inspection, X-ray inspection, functional electrical test, and JTAG/boundary-scan test.

FF04: Counterfeit Electronics Wednesday, April 1

10:15 am–11:45 am

FF06: iNEMI Pb-Free and BFR-Free Forum Thursday, April 2 Moderator: Chuck Richardson, iNEMI

8:30 am–10:00 am

Continuing in the tradition of previous iNEMI Pb-free forums, this session will present the latest status on iNEMI’s efforts to eliminate “materials of concern.” Projects to be reviewed include: Pb-free alloy alternatives, BFR-free PCB and Pb-free wave soldering.

FF07: Industry Cost Challenges: EMS Solutions

Thursday, April 2 10:15 am–11:45 am Moderator: Gail Flower, editor-in-chief, SMT Magazine Susan Mucha, Powell-Mucha Consulting, Inc. Panelists: J ames Scholler, MEC Companies Tony Musto, Progeny International Ryan Wooten, EPIC Technologies, LLC Kevin Stone, Kimball Electronics Group Join your colleagues for a revealing look at industry cost challenges from the unique perspectives of our four distinguished panelists. Presentations will include a case study in reducing time to market, filling gaps in the supply chain, enhancing throughput through early identification of supplier and post-manufacturing defect root causes, and lessons learned in developing a robust high mix manufacturing process.

For more information on these forums, visit www.IPCAPEXEXPO.org.

TM TM

Technical Conference The technical conference is known worldwide as one of the finest and most selective in the world. Take advantage of new research and innovations from key industry players in the areas of board fabrication and design and electronics assembly. New sessions this year include a focus on moisture sensitivity, high temperature processing, die attach, and electronics and the environment. That’s in addition to our annual focus on the key areas of soldering, advanced packaging, materials and reliability. Sign up for one day, the full conference or get the most for your money with the Maximum Value Package. Register by March 4 and save 20%.

S01 PCB Materials Tuesday, March 31

1:30 pm–3:00 pm

Performance is the byword for new PCB fabrication. As the expectation for products to deliver more functionality at lower costs is realized, PCB materials, structure and fabrication are pushed to their limit. Learn the latest innovations in polymers substrate materials, metallization materials and process and solder mask available. A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials Alex Beavers, Ph.D., Averatek Corporation Polyphenylene Ether Macromonomers Ii. Enhancement of Dielectric Materials Edward Peters, Ph.D., Sabic Innovative Plastics Liquid Photo Resist and Solder Mask Processing — The Real Environmental Impact Steven Johnson, GENESIS Material Technology

S02 PCB Reliability I Tuesday, March 31

1:30 pm–3:00 pm

A PCB structure is only as good as the service it delivers. In lead-free assembly, how does one ensure the rigors of PCB processing and product performance? This session focuses on new techniques for testing and qualifying PCBs. Effects of PCB structure on solder joint integrity, testing of the PCB under use conditions and qualification for customer use will be discussed in depth. Identify and Characterize Damaging PCB Assembly and Test Processes Using Strain Gage Testing Swapnil Padhye, National Instruments

S03 Business

Tuesday, March 31 1:30 pm–3:00 pm Michael Beauchesne, Amphenol Printed Circuits, Inc. With an economy churning with change and uncertainty, this business session focuses on challenges ahead in the environmental regulation arena and ways to evaluate the cost effectiveness of AOI equipment. Hear solutions to challenges posed by RoHS and REACH, as well as the latest on how to use cost-effective inspection in electronics assembly. Preparing for Green — The Impact Of EcoFriendly Product Development on Electronic Components, Systems, and Supply Chains Sheri Rhodine, IHS Inc To Be or Not To Be in Color: A 10-Year Study of the Benefits and Pitfalls of Including Color Information in AOI Systems Pamela Lipson, Imagen, Inc. Bridging Supply Chain Gap for RoHS Exempt High-Reliability OEMs Hal Rotchadl, Premier Semiconductor Services

S04 Process Characterization

Tuesday, March 31 1:30 pm–3:00 pm Jasbir Bath, Bath Technical Consultancy How good is your process for assembly? Is it cost effective? Are your high-volume solder joints reliable? This session will cover the evaluation of process efficiency on your bottom line and avoidance of solder joint defects associated with voids and poor solderability to give you improved financial and reliability performance! SMT Process Characterization and Financial Impact Fan Li, Research In Motion Investigation of Vacuum Based Vapor Phase Soldering Process to Achieve Void-Free Solder Joints in Lead and Lead-Free Technology Santhakumar Rajesnayagham, Marquardt Switches, Inc Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly Mario Scalzo, Indium Corporation

S05 Lead Free Processing

Tuesday, March 31 1:30 pm–3:00 pm R. Wayne Johnson, Ph.D., Auburn University Although lead-free assembly is a reality, challenges remain. This session will present practical approaches to lead-free alloy choices for backwards compatibility with tin-lead, assembly of thick multi-layer boards for high reliability applications and test methods for alloy characterization. Learn how you can remove some of today’s lead-free chaos. Low-Silver BGA Assembly Phase I Reflow Considerations and Joint Homogeneity Third Report: A Variety of Low Silver Sac Alloys with Tin-Lead and Sac305 Paste Chrys Shea, Shea Engineering Services Lead-Free Process Development with Thick Multilayer PCBA Density in Server Applications Larry Pymento, IBM Corporation Comparison of Thermal Fatigue Performance of SAC105, Sn-3.5Ag, and SAC305 BGA Components with SAC305 Solder Paste Gregory Henshall, Ph.D., Hewlett Packard

Validated Test Method to Characterize and Quantify Pad Catering Under BGA Pads in Printed Circuit Boards Mudasir Ahmad, Cisco Systems, Inc. Qualification of Thin-Form Factor PWBs for Handset Assembly Mumtaz Bora, Kyocera Wireless Corporation

www.IPCAPEXEXPO.org

S06 High Performance Materials

Tuesday, March 31 3:15 pm–4:45 pm Michael Beauchesne, Amphenol Printed Circuits, Inc. “You can’t be too rich or have too much bandwidth.” The products of today are expected to perform at data rates that are enormous compared to five years ago, and the demand for even more in smaller and space form factors is unending. Hear how new materials and fabrication technologies make it possible to meet the demand for more bandwidth. FLAT-WRAP: A Novel Approach to Copper Wrap Plate Rajwant Sidhu, Ph.D., DDi Corp The Influence of Material Reactivity in Dk/Df Electrical Performance Eric Liao, Taiwan Union Technology Corporation, Taiwan Bandwidth Limitations and Fiber Weave Effect: Opening the Eye Patricia Goldman, Dielectric Solutions, LLC

S07 PCB Reliability II Tuesday, March 31 David Hoover, Multek

3:15 pm–4:45 pm

This second session on PCB reliability looks at how PCB performance is affected by a lead-free processing environment and how lead-free and halogen-free materials influence long term reliability. More about process and reliability in the world of RoHS and REACH will be discussed.

S08 Pb-Free Metallurgy

Tuesday, March 31 3:15 pm–4:45 pm Jasbir Bath, Bath Technical Consultancy As lead-free alloys were introduced, it became obvious that their repair presented a different animal. One of the most apparent problems was the voracious appetite of these alloys for copper metallization in rework and wave solder. If you struggle with lead-free problems, this session is for you. Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies Lei Nie, Center for Advanced Life Cycle Engineering Rework Process Window and Microstructural Analysis for Lead-Free Mirrored BGA Design Points C to Avoid Secondary (or Partial) Reflow of the Mirrored Solder Joints Polina Snugovsky, Celestica International Inc., Canada A Study on Copper Dissolution in Liquid Lead Free Solders in Static and Dynamic Conditions Dongkai Shangguan, Ph.D., Flextronics Corporate Technology Group

S09 Test and Measurement Tuesday, March 31

3:15 pm–4:45 pm

Test is a necessary part of ensuring quality products. This session covers a range of test topics for today’s assemblies. Conformal coat thickness testing, power issues in testing of high performance boards and loss measurements for high frequency products will be discussed.

Bare Board Material Performance After Pb-free Reflow Joe Smetana, Alcatel

Low Cost Optical Thickness Measurement of Conformal Coatings Fritz Byle, Astronautics Corp. of America

Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics After Accelerated Thermal Aging Francesca Scaltro, Ph.D., Mat-Tech BV

Safely Applying Power to Today’s Power Hungry Boards Under Test Dennis Dyer, Agilent Technologies

Long Term Reliability Analysis of Lead-Free and Halogen-Free Electronics Assemblies Sammy Shina, Ph.D., University of Massachusetts

S10 Copper Interconnect Intergrity Tuesday, March 31

3:15 pm–4:45 pm

Copper is the metal the PCB is built on. In this session, you will learn from presentations covering the technologies for assuming interconnection integrity of copper as it is impacted by fabrication and assembly processes. This session will increase your understanding of the properties of this vital metal. Influence of Electroless Copper on IC Reliability Chuck Harrison, Atotech USA, Inc. The Effect of Copper Plating Processes and Chemistries on Copper Dissolution Jennifer Nguyen, Flextronics Corporate Technology Group A Test Methodology for Copper Dissolution in Lead-Free Alloys Christopher Hunt, Ph.D., National Physical Laboratory, UK

S11 Laminates at Elevated Temperature

Wednesday, April 1 9:00 am–10:00 am Patricia Goldman, Dielectric Solutions, LLC PCB laminates are forced to withstand assembly conditions far harsher than in the past. The use of lead free means higher temperatures and smaller windows of processibility. Discover the tests that are appropriate for qualifying your laminates to meet harsh conditions. Evaluation of High-Performance RoHS Compliant PCB Laminates in Elevated Temperature Ranges Chris Smith, Intel Corporation Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD

Bilateral Comparison of Loss Measurements on Printed Circuit Boards Using a Standardized Test Method Martyn Gaudion, Polar Instruments, Great Britain

Technical Conference S12 PCB Moisture Sensitivity

Wednesday, April 1 9:00 am–10:00 am Russell Nowland, Alcatel-Lucent With the higher temperatures required in lead-free assembly, a PCB not only experiences stress on its epoxy and glass materials, it also has an induced stress from the expansion of moisture within its structure. Learn about the impact of moisture on PCBs and what the industry is doing to address this through the development of standards and testing. Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption Craig Hillman, Ph.D., DfR Solutions MSL Rating of PWBs Used in Power Product and Board Mounted Power PWB Assemblies Robert Roessler, Lineage Power

S13 Jetting

Wednesday, April 1

9:00 am–10:00 am

Jetting is a technology that is coming into its own in electronics assembly. Discover the latest innovations in jetting for both PCB fabrication and board assembly. Electronics Manufacture by Inkjet Printing Steve Thomas, Ph.D., Conductive Inkjet Technology Environmentally Friendly Digital Inkjet Solder Mask: The Advantages of Inkjet Processing Provide the PCB Fabricator with a New Tool to Improve Product Quality and Reduce Waste Yehuda David, Printar Ltd.

S14 PCB Contamination Issues

Wednesday, April 1 9:00 am–10:00 am R. Wayne Johnson, Ph.D., Auburn University Surface contamination can cause severe problems in assembly and performance. In the lead-free environment, a new set of problems associated with contamination has arisen. This session showcases papers on the effects of contamination on tin-whisker growth and surface insulation resistance and electromigration under lead-free assembly conditions. Metal Whiskers — Does Surface Contamination Have Any Impact on Whisker Formation? Paco Solis, Foresite Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with LeadFree and Tin-Lead Solders Michael Azarian, Ph.D., Center for Advanced Life Cycle Engineering (CALCE), University of Maryland

S15 Design

Wednesday, April 1 Gary Ferrari, FTG Circuits

9:00 am–10:00 am

Density of designs at all levels increases as consumers ask for more functions in smaller packages. Gain an understanding of design trends in packaging to meet those demands and learn about the design tools and procedures that can aid in meeting the demands of more functions in less space. Design for Flip-Chip and Chip-Size Package Technology Vern Solberg, STC — Madison Predictability of PCB Layout Density Ruth Kastner, ADCOM, Israel

S16 Packaging and Reliability Issues

Wednesday, April 1

10:15 am–11:45 am

If you put more and more on a board or in a package, are you setting yourself up for more to go wrong? In a lead-free environment, is that “chance of failure” greater now than in the past? This session addresses reliability issues with a review of lead-free packaging available today for SMT assembly, an investigation of package-on-package reliability and the reliability of MLCC packages in repair.

S18 PCB Metallization Wednesday, April 1

10:15 am–11:45 am

Metallization of PCB vias can be a challenge in the world of dense board features. Hear about the problems and solutions of metallization with papers on via fill and copper wrap. Blind Micro Via and Through Hole Filling in a Horizontal Conveyorized Production System Chuck Harrison, Atotech USA, Inc. Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating Mark Lefebvre, Rohm and Haas Electronic Materials Reliable Acid Copper Plating for Metallization of PCB Maria Nikolova, Ph.D., MacDermid

S19 Paste & Printing I

Wednesday, April 1 10:15 am–11:45 am Robert Priore, Cisco Systems Inc. At the heart of successful surface mount assembly is good, accurate solder paste deposition. This first session of a two-session track will discuss how to pick a solder paste, how to monitor and predict solder paste stencil life and what developments in new paste technology are emerging. Improve your assembly process by learning from the paste experts.

Designers Guide to Lead-Free SMT Components Vern Solberg, STC — Madison

The Digital Solder Paste Rick Lathrop, Heraeus Inc.

Assembly and Reliability Investigation of Package on Package Brian Roggeman, Unovis Solutions

Using TGA Analysis to Establish Pb-Free Solder Paste Heating Profiles and Estimate Stencil Life Gerjan Diepstraten, Vitronics Soltec

MLCC Soldering Evaluation William Ortloff, Raytheon Company

Three Steps to Successful Solder Paste Selection John Vivari, EFD Inc., Solder Paste Group

S17 PCB Reliability III: Test Techniques

Wednesday, April 1 10:15 am–11:45 am Patricia Goldman, Dielectric Solutions, LLC Our third and final session in the PCB reliability track will cover thermal cycling for lead-free, CAF testing of power products and highly accelerated stress testing of PCBs. Complete your review of the latest on reliability and learn from topical technical papers presented by experts in this field. Considerations in Thermal Cycle Testing of PWBs–Lead Free Applications Paul Reid, PWB Interconnect Solutions Inc. A Review of PWB Conductive Anodic Filament (CAF) Formation in Power Products Tushar Shete, Lineage Power

S20 Testing Strategies I Wednesday, April 1

10:15 am–11:45 am

This session is the first of a three-session track on test strategy. Discover the latest in test strategies in void detection and AOI. Analysis of Voiding Levels Under QFN Package Central Terminations and their Correlation to Paste Deposition Volumes and Propensity for Device Stand-off and Poor Joint Quality David Bernard, Ph.D., Dage X-Ray Systems High Speed, High Resolution Infrared Cameras: New Technology Achieves High Accuracy in PCB Inspection Eric Hughes, FLIR Systems, Inc. The Landscape of PCB Technology is Changing Rapidly. How Will AOI Testing Keep Up? Pamela Lipson, Imagen, Inc.

www.IPCAPEXEXPO.org

S21 Polymer Technology

S25 PCB Processing

The use of new and innovative polymers is expanding in electronics. This session highlights recent developments in adhesives, under film reinforcement for reliability, thermal interface materials and conductive adhesive. If you want to know what is new and cutting edge in the field of polymers for electronics, this is the session for you.

PCB processing issues of surface treatment, etching, registration and lamination will be discussed in this session. Gain a complete review of these techniques and round out your fabrication learning experience.

Partial Under Film Technology Steve Hall, Alltemated, Inc.

New Technology to Improve Etching Performance Using Shiny Side Surface Treatment for HDI Keisuke Yamanishi, Nippon Mining & Metals Co., Ltd.

Wednesday, April 1

1:30 pm–3:30 pm

Optimizing the Automated Assembly Process for Filled Polymer Based Thermal Bondlines David Rae, Unovis Solutions Conductive Film Adhesive for Use in High Temperature Applications Jing Fan, Ph.D., Emerson & Cuming

S22 Drilling

Wednesday, April 1 David Hoover, Multek

1:30 pm–3:30 pm

Drilling still remains at the heart of via formation in PCB fabrication. The four papers in this session highlight new developments in drill life prediction, drill-material interaction and control of drill depth and accuracy. Automated Evaluation of Wear Condition of Micro Drill Bit Lianyu Fu, Ph.D., Shenzhen Jinzhou Precision Technology Corp. China Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling Robert Lupfer, Jr., DDI The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates Lameck Banda, Ph.D., Dow Chemical Drilling of Printed Circuit Boards: Innovative Entry Materials for Improving Accuracy of Micro and Small Diameter Drills Rocky Hilburn, Ticer Technologies

Wednesday, April 1

1:30 pm–3:30 pm

Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide Akira Takeuchi, Nissin Inc.

S23 Soldering Topics Wednesday, April 1

1:30 pm–3:30 pm

A potpourri of solder topics, from dross control to wave solder and selective solder techniques, will be presented. Hear the latest on these technologies that lie at the heart of the interconnection process. Economic and Technical Advantages of Chemical Dross Elimination and Prevention Dan Feinberg, Fein-Line Associates Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes Christian Ott, SEHO Toratec, Shanghai

Improving Registration: When Precision is Not Enough Andrew Kelley, Xact PCB Ltd Top Doing More With Less Deiter Backhaus, MBT, Backhaus GmbH

S26 Embedded Thursday, April 2

9:00 am–10:00 am

Is embedded technology in your designs now? Will it be a part of your future product design? This two-paper session discusses the performance and reliability of embedded capacitor technology.

The Study of the Nitrogen Effect for Wave Soldering Process Han Na Noh, LG Electronics

The Electrical Performance of Buried Sheet Capacities J. Lee Parker, Ph.D., JLP Consultants LLC

Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses Mark Wooley, Avaya

Reliability of Ultra-Thin Embedded Capacitor Laminates in Lead-Free Assembly Joel Peiffer, 3M Company

S24 Paste & Printing II

Thursday, April 2

Wednesday, April 1 1:30 pm–3:30 pm Robert Priore, Cisco Systems Inc. In this second session on paste and printing, stencil design will be covered. Learn how to best utilize the technologies of step stencils and stencil design, and how to best print the wide range of component sizes and shapes that confront the electronic assembly engineer. Step Stencil Design When 01005 and .4mm Pitch BGAs Coexist with RF Shields William Coleman, Ph.D., Photo Stencil Inc.

S27 Green Tales

9:00 am–10:00 am

Is RoHS making you green? Or is it just making you mean? Hear some tales of RoHS, from a light-hearted “view from the trenches” to the serious business of choosing a reliable testing laboratory. RoHS War Stories Beverley Christian, Ph.D., Research In Motion Limited Laboratory 101: A Guide to Understanding Your Testing Laboratory Jim Cronin, Environmental Monitoring and Technologies Inc.

Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly Chris Anglin, Indium Corporation of America Broadband Printing: The New SMT Challenge Rita Mohanty, Ph.D., Speedline Technologies, Inc. Engineering Precise Solder Volumes Rick Love, Cookson Electronics

Technical Conference S28 Surface Finishes

Thursday, April 2 9:00 am–10:00 am Kim Hyland, Solectron Corp. Surface finish may be considered the topping on the PCB cake or it may be considered the point where “the rubber meets the road” in the soldering process. Get up-to-the-minute information on HASL in the lead-free era and learn about a comparative study of the metallic finishes available for lead-free assembly. Hot Air Solder Levelling in the Lead-Free Era Keith Sweatman, Nihon Superior Co., Ltd., Australia Comparative Study on Lead-Free Assembly of ENEPIG versus ENIG and Immersion Silver Eric Stafstrom, Technic, Inc.

S29 Cleaning I Thursday, April 2

S30 Testing Strategies II

S33 Die Attach Processes

This second session on test strategies will cover new advances in boundary scan and how to make the best of collected parametric data. Hear how to improve the speed and accuracy of your testing program.

Are you doing die attach now? Will you see it added to the assembly technologies you will be using in the future? This three-paper session covers flip chip, wire bonding and stud bump technologies that may challenge you now or in the future.

Thursday, April 2

Virtual Access Technique Extends Test Coverage on PCB Assemblies Anthony Suto, Teradyne Improving Quality by Performing Deep Analytics on Real-Time In-Circuit Test Data Victor Nelson, Force10 Networks

S31 Advanced Technology Thursday, April 2

9:00 am–10:00 am

Learn about cleaning of dense assemblies and how to avoid “pockets” of contamination that can lead to product failure, in this first of a two-session track on cleaning. If you are cleaning now or will be in the future, this will give you the latest from industry experts. Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves Mike Bixenman, Kyzen Corporation Cleanliness Failures — Pockets of Contamination that are Causing Field Failures and How to Avoid Them for Leaded and LeadFree Processes Eric Camden, Foresite

9:00 am–10:00 am

10:15 am–11:45 am

In this advanced technology session, you will learn the latest developments in pre-form handling and screen printing techniques for the manufacture of LEDs and thick-film circuitry on thin film, solderable substrates. Discover the cutting-edge technologies that are moving mainstream. RFS Handler Cone Chuck Simplification for Effective Handling Performance Darin Moreira, Intel Microelectronics Flexible LED Arrays Made by a Screen Printing Process Robert Turunen, DKN Research All Screen-Printing Process Has Been Developed to Build High-Resolution Thick Film Circuits with High Conductivity and Soldering Capabilities on Thin Heat-Resistant Films Masafumi Nakayama, NY Industries, Ltd.

S32 PCBs and the Environment

Thursday, April 2 10:15 am–11:45 am Beverley Christian, Ph.D., Research In Motion Limited What are the emerging legislative challenges in the environmental arena? Will it include halogen-free? What is the real environmental cost of a process? Get details of what it takes to move to halogen-free and learn how environmental analysis techniques can be applied to photo resist processes. Expand your understanding of coming environmental challenges. Design for Low-Halogen Green Electronics Tamim Sidiki, Ph.D., DSM Engineering Plastics Liquid Photo Resist and Solder Mask Processing: The Real Environmental Impact Steven Johnson, GENESIS Material Technology Challenges in Implementing a Halogen-Free Process Tim Jensen, Indium Corporation of America

Thursday, April 2

10:15 am–11:45 am

Flip Chip Bonding — Mainstream for All Pin Counts Jacques Coderre, Universal Instruments Corporation Economically Removing Corrosion Layers for Improved Wire Bond Performance Terence Collier, Collier Ventures, Inc. Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Gold Stud Bump Flip-Chip Attachment David Lee, Johns Hopkins University

S34 Cleaning II Thursday, April 2

10:15 am–11:45 am

Cleaning chemistries, in-line cleaning and batch cleaning are highlighted in this last cleaning track session. Solve your cleaning problems by joining us for this information-packed session. Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution Umut Tosun, ZESTRON America Oscillating Nozzle Technology for Improved Cleaning Performance Eric Becker, Speedline Technologies, Inc. Cleaning Today’s Assemblies in Batch Systems — A Comparison of Processes from Around the World Craig Hood, Petroferm

S35 Testing Strategies III Thursday, April 2

10:15 am–11:45 am

The final session in the test track focuses on probe testing. The effect of residues, bead probe testing and techniques for ICT will be showcased. ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture Karen Tellefsen, Cookson Electronics Bead Probe Technology: Successful Implementation in a High-Volume Manufacturing Environment Andrew Tek, Agilent Technologies Solving Today’s In-Circuit Test Challenges on Difficult to Probe PCB Targets Stacey Marotta, QA Technology

www.IPCAPEXEXPO.org

IPC Standards Development Meetings Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by attending IPC standards development meetings. These sessions are open to all attendees. Sign up for committee meetings at no charge before the show, add on the “event essentials” and luncheons, or get the most by adding the conference and education with the Maximum Value Package. Register by March 4 and save 20%. JNAC Jisso North America Council

5-22a J-STD-001 Task Group

Sunday, March 29 8:00 am–3:00 pm Dennis Fritz, MacDermid, Inc.

Monday, March 30 9:00 am–5:00 pm Teresa Rowe, AAI Corporation

JNAC provides input to a global council identified as Jisso International Council (JIC). The JIC focuses on the total packaging solution. The meeting on Sunday will focus on the development of North American positions on some of the projects that have been identified in the technical working groups of the JIC and preparation for JIC 10 in Grenoble.

This task group is developing revision E to IPC J-STD-001, Requirements for Soldered Electrical & Electronic Assemblies.

Assembly and Joining Processes

This working group provides technical guidance to the developer of the certification program for J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The agenda for this meeting is to review progress toward updating existing J-STD-001DS space addendum unique training.

5-20 Assembly and Joining Processes Planning Committee (By invitation only)

Sunday, March 29 4:30 pm–6:00 pm Leo Lambert, EPTAC Corporation

5-22bt J-STD-001 Certification Technical Working Group

Wednesday, March 25 1:30 pm–5:00 pm Teresa Rowe, AAI Corporation

This is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committee.

This new task group is developing a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing leadless surface-mount components (LSCs) whose external connections consist of metallized terminations that are an integral part of the component body. The focus of the information contained in the document is on critical design, assembly, inspection, repair and reliability issues associated with leadless surface-mount components.

Task Group

Tuesday, March 31 3:15 pm–5:00 pm Dennis Fritz, MacDermid, Inc. This task group is working on a new solder spread test to evaluate alternate final finishes for lead free.

5-24a Flux Specifications Task Group Tuesday, March 31 10:00 am–12:00 pm Renee Michalkiewicz, Trace Laboratories–East This task group will move forward with final touches on Amendment 1 to J-STD-004B, Requirements for Soldering Fluxes. Work and comments on what will be revision C of this document will also begin.

5-24b Solder Paste Task Group Tuesday, March 31 1:30 pm–3:00 pm Paul Niemczura, Heraeus, Inc.; Brian Toleno, Ph.D., Henkel Corporation This task group is continuing work on revision A of J-STD-005, Requirements for Soldering Pastes.

5-24c Solder Alloy Task Group Monday, March 30 David Scheiner, Kester

1:30 pm–3:00 pm

This task group is gathering new information for revision C of J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.

5-24f Underfill Adhesives for Flip Chip Applications Task Group

Monday, March 30 3:15 pm–5:00 pm Brian Toleno, Ph.D., Henkel Corporation; Fonda Wu, Raytheon Company

5-21h No-Leads Parts Task Group Wednesday, April 1 1:30 pm–5:00 pm Ray Prasad, Ray Prasad Consultancy Group; Vern Solberg, Soldberg Technical Consulting

5-23d Alternate Final Finishes

7711/21B Committee Celebration

5-23a/b Joint Meeting — Printed Wiring Board Solderability Specification and Component and Wire Solderability Specification Task Groups

Monday, March 30 8:00 am–12:00 pm David Hillman, Rockwell Collins The joint working groups for IPC/ECA J-STD-002C, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, and IPC J-STD-003B, Solderability Tests for Printed Boards, are meeting together to cover thoughts and comments on best efforts on pre-conditioning for solderability testing in J-STD-002 for its upcoming revision D.

This task group is updating J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages.

7-31h IPC-HDBK-620 Handbook Task Group

Wednesday, March 25 1:30 pm–5:00 pm Gary Grandprey, BAE Systems Land & Armaments L.P.; Brett Miller, USA Harness, Inc. This task group is developing a handbook with general information to support users of IPC/ WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Days and times are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule.

IPC Standards Development Meetings 7-35 Assembly and Joining Handbook Subcommittee

Tuesday, March 31 10:00 am–5:00 pm Mary Muller, Crane Aerospace & Electronics; Guy Ramsey, R & D Assembly This subcommittee is nearing completion of a major update to IPC-AJ-820, Assembly and Joining Handbook that now incorporates the best parts of IPC-HDBK-001 and IPC-PE-740, plus IPC-HDBK-830, IPC-CM-770 and the component identification desk reference manual, DRM-18.

Base Materials 3-11 Laminate/Prepreg Materials Subcommittee

Monday, March 30 8:00 am–12:00 pm Tony Senese, Panasonic Electric Works This subcommittee will be resolving comments submitted on the final draft of revision C of IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.

3-11f UL/CSA Task Group Thursday, April 2 1:00 pm–2:30 pm Jack Bramel, Jack Bramel & Associates This task group provides a forum for the exchange of ideas and data related to Underwriters Laboratories’ and Canadian Standards Association’s recognition of printed board materials and processes. The group continues to seek industry input for UL 796 and UL 746E that can be presented to the applicable STP as well as newly re-formed Industry Advisory Group.

3-11g Metal Finishes Data Acquisition Task Group

Wednesday, April 1 3:15 pm–5:00 pm Donald Cullen, MacDermid, Inc. This task group is exploring and gathering data on the effects of corrosion on surface finishes.

3-12a Metallic Foil Task Group Tuesday, March 31 3:15 pm–5:00 pm Rolland Savage, High Performance Copper Foil Inc. This task group is working on gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562.

3-12d Woven Glass Reinforcement Task Group

Task Group

Monday, March 30 1:30 pm–3:00 pm Patricia Goldman, Dielectric Solutions, LLC

Monday, March 30 1:30 pm–5:00 pm Chris Mahanna, Robisan Laboratory Inc.

This task group continues to explore the dielectric properties (permittivity and loss tangent) for E-glass and is testing these properties for possible inclusion into IPC-4412, Specification for Finished Fabric Woven from E Glass for Printed Boards.

This task group is developing a user guide for the IPC-B-52 SIR test board and reviewing international efforts on SIR. The task group is also addressing CAF issues previously under the 5-32e task group.

3-12e Base Materials Roundtable Task Group

Monday, March 30 3:15 pm–5:00 pm Douglas Sober, Kaneka Texas Corporation This task group, through an open forum, will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated.

Cleaning and Coating 5-30 IPC Cleaning and Coating Committee

Monday, March 30 8:00 am–9:00 am Douglas Pauls, Rockwell Collins This open session will feature a presentation on all the current task group and subcommittee activities within the IPC 5-30 Cleaning and Coating Committee.

5-31 Cleaning and Alternatives Subcommittee

Monday, March 30 9:00 am–12:00 pm Mike Bixenman, Kyzen Corporation This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, Post Solder Solvent Cleaning Handbook; IPC-SA-61, Post Solder Semi-Aqueous Cleaning Handbook; IPC-AC-62, Aqueous Post Solder Cleaning Handbook and IPC-CH-65, Guidelines for Cleaning of Printed Boards and Assemblies.

5-32a/ Joint Meeting — Ionic 5-32c Conductivity and Bare Board Cleanliness Task Groups

Wednesday, April 1 8:00 am–12:00 pm Douglas Pauls, Rockwell Collins; John Radman, Trace Laboratories — East Denver This joint meeting will address the working draft of IPC-5704 on cleanliness assessment requirements for printed board fabricators and test methods for ionic cleanliness.

5-32b Surface Insulation Resistance

5-32e Conductive Anodic Filament (CAF)

Tuesday, March 31 1:30 pm–3:00 pm Karl Sauter, Sun Microsystems, Inc. This task group will consider comments to revision B, of IPC-9691A, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing).

5-33c Conformal Coating Handbook Task Group

Wednesday, April 1 1:30 pm–5:00 pm Amy Hagnauer, Raytheon Company This task group is developing revision A to IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings.

Data Generation & Transfer/ Documentation 2-10/ Joint Meeting — Data Generation 2-13 and Transfer and Shop Floor Communication Committees

Monday, March 30 1:30 pm–5:00 pm Karen McConnell, Lockheed Martin; Andrew Dugenske, Georgia Institute of Technology The 2-10 committee encompasses all the CAD, CAM and CAE data transfer standards described in the IPC25XX series. It includes standards such as GenCAM®, CAMX, PDX, OffSpring and the Message Broker. The 2-13 subcommittee will discuss the 2540 standards and their implications for both end-users and equipment suppliers on the factory floor.

2-18 Declaration Process Management Subcommittee

Monday, March 30 Eric Simmon, NIST

1:30 pm–5:00 pm

This subcommittee has developed IPC-1751 for supplier data exchanges, including materials declarations (IPC-1752) and manufacturing process declarations (IPC-1756). The subcommittee will review the XML Schema for all supplier declaration standards.

www.IPCAPEXEXPO.org

2-18a Manufacturing Process Declaration Task Group

Thursday, April 2 8:00 am–12:00 pm Fritz Byle, Astronautics Corp. of America This task group will discuss the development of a standard for the exchange of manufacturing process information such as moisture sensitivity level, lead finish and tin whisker mitigation. This standard will include data elements previously included in the IPC-1752 standard as well as new data elements.

2-18b Materials Declaration Task Group Tuesday, March 31 10:00 am–5:00 pm Mark Frimann, Texas Instruments Inc. This task group will review proposed revision 2.0 of the materials declaration standard IPC-1752. Changes include multiple part declarations and updating the data for global material restrictions beyond RoHS.

2-18e Process Chemicals Declaration Task Group

Monday, March 30 8:00 am–12:00 pm Scott Houthuysen, LSI Corporation This task group will discuss its draft standard for declaration of restricted chemicals used in the manufacture of electronics. Discussion will include a review of criteria for selecting chemicals to be declared as well as information to be exchanged. Chemicals that may be considered for inclusion include ozone depleting substances and those restricted by REACH.

D-51 Embedded Devices Design Subcommittee

Tuesday, March 31 Gary Ferrari, FTG Circuits

10:00 am–12:00 pm

This subcommittee is developing the IPC-2227 design standard for embedded devices.

D-52 Embedded Component Materials

Environment, Health & Safety (EHS) 4-30 Environment, Health & Safety (EHS) Committee

Wednesday, April 1 1:30 pm–5:00 pm Lee Wilmot, TTM Technologies, Inc.

Having accomplished the release of IPC-4811, Specification for Embedded Passive Devices Resistor Materials for Rigid and Multilayer Printed Boards, this subcommittee is next examining the material impacts with incorporation of active embedded components.

The committee will discuss its energy use benchmarking survey results and implications for cost savings and compliance with global climate change regulations in development. Additional meeting topics will address issues affecting EHS compliance in the electronics industry and may include discussion of EPA hazardous waste deregulation, environmental reporting, facility permitting issues, worker safety and global environmental requirements such as RoHS, WEEE and REACH.

Wednesday, April 1 8:00 am–12:00 pm Bryan Truax, CADParts & Consulting, LLC.

D-53 Embedded Devices Performance

4-33 Halogen-Free Materials

The 2-40 committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machine data. Certification of software and tools and the “universal dynamic hub” will be discussed.

Wednesday, April 1 10:15 am–12:00 pm Michael Luke, Raytheon Company

2-40 Electronic Documentation Technology Committees

Embedded Components CRANE-EP CRANE Embedded Passives Committee Meeting (By invitation only)

Tuesday, March 31 10:00 am–12:00 pm Jason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLC Status on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles. The emulator project will also be presented to encourage candidate designs for embedded passive integration. This meeting is by invitation only.

Subcommittee

Wednesday, April 1 8:00 am–10:00 am David McGregor, E.I. du Pont de Nemours and Co.

Subcommittee

This subcommittee is finalizing IPC-6017, Qualification and Performance Specification for Printed Boards Utilizing Embedded Devices.

D-54 Embedded Devices Test Methods Subcommittee

Wednesday, April 1 Jan Obrzut, Ph.D., NIST

1:30 pm–3:00 pm

This subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices used in printed boards.

Subcommittee

Tuesday, March 31 10:00 am–12:00 pm Douglas Sober, Kaneka Texas Corporation This subcommittee will consider new comments for revision B of the white paper/technical report on low-halogen base materials. This document focuses on the legislative, marketing and environmental pressures to remove halogenated flame retardants from PCBs and electronic assemblies. This group will also discuss how to assist the efforts on halogen free and its application to other electronic products beyond PCBs and their assemblies being covered by the 4-33a Task Group.

Days and times are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule.

IPC Standards Development Meetings 4-33a Low-Halogen Electronics Standard Task Group

Monday, March 30 Scott O’Connell, Dell; Stephen Tisdale, Intel Corp.

1:30 pm–5:00 pm

This task group will review its industry standard for definitions and data-supported threshold limits associated with low-halogen electronics, including printed circuit boards, components, electronics assemblies, cables and mechanical plastics.

4-34b Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group

Wednesday, April 1 10:00 am–12:00 pm Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc. With the transition to a variety of lead-free solders, labeling of circuit board properties is increasingly important for printed circuit board manufacture and assembly, OEM manufacturing, rework and repair of printed circuit assemblies and end-of-life disposition (recycling or disposal). This combined working group of IPC and JEDEC will review IPC/JEDEC J-STD-609.

Fabrication Processes Committee 4-14 Plating Processes Subcommittee Wednesday, April 1 1:30 pm–3:00 pm George Milad, UIC/Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc. This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating. The subcommittee is continuing its work on IPC-4555, Specification for Organic Solder Preservative (OSP) for Printed Circuit Boards. In addition, any comments on previously released IPC-4552, IPC-4553, and IPC-4554 will be addressed.

Flexible Circuits

D-13b Covercoat Materials Task Group

D-11 Flexible Circuits Design Subcommittee

Wednesday, April 1 10:15 am–12:00 pm William Ortloff, Raytheon Company This subcommittee is initiating revision C of IPC-2223, Sectional Design Standard for Flexible Printed Boards.

D-12 Flexible Circuits Specifications Subcommittee

Monday, March 30 10:15 am–12:00 pm Nick Koop, Minco Products Inc. This subcommittee will be discussing goals for a future revision C to IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.

D-12a UL 796F and UL 746F Task Group

Thursday, April 2 10:15 am–12:00 pm Duane Mahnke, Mahnke Consulting This task group works actively with Underwriters Laboratories Inc. on two associated documents, UL 796F and UL 746F, and the proper industry STP/IAG representatives for this area. The work of this task group is key to successfully generating useful documents, particularly when the new document is being separated from an existing document, as is the case with UL 746F (flexible materials) separating from UL 746E (general materials).

D-13 Flexible Circuits Base Materials Subcommittee

Wednesday, April 1 Clark Webster, ALL Flex Inc.

1:30 pm–3:00 pm

This subcommittee maintains IPC-4202, Flexible Base Dielectrics for Use in Flexible Printed Circuitry; IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films; and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry. All three documents are being revised and the balloting on the three will be close to starting or in process.

Wednesday, April 1 8:00 am–10:00 am Steve Musante, Raytheon Missile Systems This new task group will pursue the addition of one (or more) specification sheet(s) to IPC-4203, the standard that addresses numerous cover materials for flexible circuitry applications. The new specification sheets will address various liquid applied covercoat materials that are subsequently cured through photo and/or thermal exposure and need to be fully characterized as both flame resistant and electrically insulating cover materials.

D-15 Flexible Circuits Test Methods Subcommittee

Wednesday, April 1 3:15 pm–5:00 pm Rocky Hilburn, CAC, Inc.; Duane Mahnke, Mahnke Consulting This subcommittee provides test methods required by the D-10 Flexible Circuits Committee. IPC-TM-650, Test Methods Manual, which is defined in all flexible circuits committee documents will be examined in detail for applicability and need for replacement or revision. Also, any test methods specified in new flexible circuitry documents will be generated.

High Speed/High Frequency Interconnections D-20 High Speed/High Frequency Committee

Monday, March 30 1:30 pm–2:00 pm Thomas Bresnan, R&D Circuits This is a planning meeting for the task group and subcommittee leaders of the High Speed/High Frequency Committee.

D-22 High Speed/High Frequency Board Performance Subcommittee

Monday, March 30 2:00 pm–5:00 pm Mahendra Gandhi, Northrop Grumman Space Technology This subcommittee is working on revision B to IPC-6018, Microwave End Product Board Inspection and Test.

D-23 High Speed/High Frequency Base Materials Subcommittee

Wednesday, April 1 8:00 am–12:00 pm Edward Sandor, Taconic Advanced Dielectric Division This task group is developing revision A to the IPC-4103 materials specification for high frequency laminates.

www.IPCAPEXEXPO.org

Management 8-40 Roadmap Steering and Planning Committee

Saturday, March 28 1:00 pm–5:00 pm Jack Fisher, Interconnect Technology Analysis, Inc. The committee will discuss completion of the 2008/2009 IPC International Technology Roadmap.

CCC Committee Chairman Council (By invitation only)

Sunday, March 29 3:00 pm–4:30 pm Peter Bigelow, IMI Inc.; Sammy Yi, Flextronics International

D-24 High Speed/High Frequency Test Methods Subcommittee

Tuesday, March 31 Don DeGroot, CCNi

10:00 am–11:00 am

This oversight subcommittee will review current test method projects to evaluate high speed/high frequency boards and materials.

D-24a Propagation Delay Test Method Task Group

Tuesday, March 31 Don DeGroot, CCNi

11:00 am–12:00 pm

This task group is completing test method 2.5.5.11, Propagation Delay of Lines on Printed Boards by TDR.

D-24b Propagation Loss Test Method Task Group

Tuesday, March 31 1:30 pm–3:00 pm Richard Mellitz, Intel Corporation This task group is developing IPC test method 2.5.5.12, Method Determining the Amount of Signal Propagation Loss Caused by Material Characteristics of Traces and Accompanying Structures on Printed Boards.

D-24c High Frequency Test Methods Task Group: Frequency-Domain Methods

Tuesday, March 31 Mike Janezic, NIST

3:15 pm–5:00 pm

This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs.

TAEC Technical Activities Executive Committee (By invitation only)

Monday, March 30 5:00 pm–6:30 pm Leo Lambert, EPTAC Corporation This committee comprised of leaders of all IPC general committees oversees IPC’s standardization efforts.

Packaged Electronic Components B-10a/ IPC B-10a, JEDEC JC-14.1 JEDEC-14.1 and ECA Joint Working Groups

Monday, March 30 8:00 am–5:00 pm Steven Martell, Sonoscan Inc.; Paul Krystek, IBM Corporation; Jack McCullen, Intel Corporation This is a joint meeting of IPC B-10a, JEDEC JC-14.1 and Electronic Components Association committees to begin revision of J-STD-075 (a classification system to identify assembly thermal limits on components) and revision efforts on standards and test methods for classification, packaging, labeling and handling moisture sensitive components (J-STD-020 and J-STD-033).

Printed Board Design Technology 1-10b Current Carrying Capacity Task Group

Monday, March 30 10:15 am–12:00 pm Michael Jouppi, Lockheed Martin Space Systems Company This task group is finalizing IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.

1-10c Test Coupon and Artwork Generation Task Group

Monday, March 30 8:00 am–10:00 am Timothy Estes, Conductor Analysis Technologies, Inc. This task group maintains and consolidates test coupon designs referenced in IPC-2221 and IPC-6010. The task group is completing the new A/B-R platedthrough hole evaluation coupon design.

Process Control 7-23 Process Effects Handbook Subcommittee

Wednesday, April 1 3:15 pm–5:00 pm Dennis Fritz, MacDermid, Inc. This subcommittee is continuing with revision B to IPC-PE-740, Troubleshooting for Printed Board Manufacture and Assembly. The revision concentrates on updating printed circuit fabrication issues. Additionally, work is occurring on incorporating information on lead-free assembly and the impacts on the bare board fabrication from these more stressful assembly conditions.

Product Assurance 7-30 Product Assurance Committee (By invitation only)

Monday, March 30 8:00 am–9:00 am Mel Parrish, STI Electronics, Inc. This is a planning meeting for all Product Assurance Committee task group and subcommittee leaders.

This task group will determine the needs of the microelectronics industry for high frequency dielectric test methods.

Days and times are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule.

IPC Standards Development Meetings 7-31a/ Joint Meeting — IPC-A-600 D-33a and Rigid Printed Board Performance Specifications Task Groups

Sunday, March 29 9:00 am–3:00 pm Wednesday, April 1 1:30 pm–3:00 pm Mark Buechner, BAE Systems This joint meeting will address final drafts of both IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, and IPC-A-600H, Acceptability of Printed Boards.

7-31b IPC-A-610 Task Group Saturday, March 28 8:00 am–5:00 pm Sunday, March 29 8:00 am–2:30 pm Constantino Gonzalez, ACME Training & Consulting

Product Reliability

Terms and Definitions

6-10c Plated-Through Via (PTV)

2-30 Terms and Definitions Committee

Reliability-Accelerated Test Methods Task Group

Tuesday, March 31 Randy Reed, Merix Corp.

10:00 am–12:00 pm

This task group is establishing a guideline for the attributes affecting lead-free assembly process survivability.

6-10d SMT Attachment-Reliability Test Methods Task Group

Tuesday, March 31 1:30 pm–3:00 pm Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

This task group will continue development of revision E to IPC-A-610, Acceptability of Electronic Assemblies.

This task group is developing IPC/JEDEC-9705 for area array surface mount connectors and is revising IPC/JEDEC-9702 and IPC/JEDEC-9704 for bend and strain gage testing.

7-31fs Space Electronic Assemblies

Rigid Printed Boards

IPC/WHMA-A-620 Addendum Task Group

Tuesday, March 31 10:00 am–5:00 pm Garry McGuire, NASA Marshall Space Flight Center This task group is developing an addendum that provides exception requirements to IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This will enable users of the standard and addendum to specify fabrication and acceptance of cable and wire harness assemblies used in rigorous space electronics hardware.

7-31ft A-620 Technical Training Task Group

Wednesday, April 1 8:00 am–12:00 pm Debbie Wade, Advanced Rework Technology This working group provides technical content direction for the IPC/WHMA-A-620 training and certification program. This meeting will focus on training for A-620AS, Space Electronics Hardware Addendum.

D-31b IPC-2221 Task Group Tuesday, March 31 Gary Ferrari, FTG Circuits

1:30 pm–5:00 pm

This task group is developing lead-free design guidelines within revision B of IPC-2221, Generic Standard on Printed Board Design.

D-35 Printed Board Storage and Handling Subcommittee

Wednesday, April 1 3:15 pm–5:00 pm C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Tom Kemp, Rockwell Collins This task group will review the current working draft for IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 Printed Board Process Capability,

Sunday, March 29 8:00 am–9:00 am Michael Green, Lockheed Martin Space Systems Company This committee maintains standard industry definitions for the electronic interconnection industry. The group is reviewing new terms for IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.

Testing 7-11 Test Methods Subcommittee Tuesday, March 31 1:30 pm–5:00 pm Joe Russeau, Precision Analytical Laboratory, Inc. This subcommittee maintains and updates IPC-TM-650, Test Methods Manual. It is undergoing an extensive review of IPC test methods older than five years for reaffirmation, revision or cancellation. It is also building the background/development information for test methods to aid users.

UL-IAG

I ndustry Advisory Group Meeting for UL

Thursday, April 2 3:30 pm–5:00 pm Barry Kalian, Underwriters Laboratories Inc. To resolve questions about non-technical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronics interconnection industry, the re-establishment of an IAG for interpretation of the UL 746E, UL 796, UL 746F and UL 796F has begun. This group of industry and UL personnel will address items not appropriate for the UL-STP meetings, which cover technical modifications to the four UL documents above.

Quality and Relative Reliability Benchmark Test Subcommittee

Monday, March 30 Gary Long, Intel Corp.

1:30 pm–3:00 pm

This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers. This subcommittee meeting is open to all interested parties.

www.IPCAPEXEXPO.org

IPCProfessional Standards Development DevelopmentMeetings Courses Increase your industry IQ! Find out about the latest in advanced technologies, design, eco-compliance, lead-free technologies, materials, process improvements, solder joint reliability and more.

feature many analogies and examples to illustrate the process variables involved in wave soldering, each gleaned from the instructor’s 30 years of equipment design and process knowledge.

Create your own customized itinerary by selecting the full- and half-day courses that meet your professional needs. Register by March 4 and save 20%.

What You Will Learn • Flux selection versus surface finishes • Flux selection versus preheater type • Conveyor speed versus PCB temperature • Conveyor speed versus dwell time • Dwell time versus hole fill • Wave height versus dwell time • Machine maintenance versus new solder defects • Causes and solutions to solder defects — leaded and lead free

Visit www.IPCAPEXEXPO.org/courses for more information including speaker bios.

Advanced Technology PD-22 Introduction to Advanced

Packaging Sunday, March 29 9:00 am–12:00 pm R. Wayne Johnson, Ph.D., Auburn University This course reviews semiconductor trends driving packaging requirements in terms of routing, electrical performance, thermal management and reliability, including low-k dielectrics and lead free. It discusses advanced packaging — first divided into the topics of substrates and die connections, and then as integrated packaging concepts. Ceramic, laminate, flex and thin film substrates will be examined along with substrate embedded passives and the commonly used die connection by wire bonding and flip chip. The course will close with a look at area array packages including stacked die, folded flex 2.5-D packages, chips first packages and 3-D packages. What You Will Learn • Packaging requirements: routing, electrical, thermal, reliability • Packaging technologies • Substrates: ceramic, laminate, flex, thin film, embedded passives • Die connection, die attach and wire bond; flip chip • Area array packages: BGAs and CSPs

PD-15 PCB Design Fundamentals

for High Density Lead-Free Electronics Sunday, March 29 2:00 pm–5:00 pm Vern Solberg, STC — Madison Many of the new IC device families have more leads and a finer contact pitch than their predecessors, affecting the methodology used in board design and assembly. When adapting the newer QFP, BGA and CSP families of ICs, one must consider board fabrication tolerances and assembly machine accuracy. Land pattern geometry, too, is directly related to process control and solder attachment uniformity. This course will present design rules and guidelines that specifically define the geometry and spacing of land patterns for surface mount devices and factors influencing manufacturing efficiency, quality and reliability.

What You Will Learn • Fine-pitch IC package variations and standards • SMT land pattern development for lead-free HDI • High density PC board design and circuit routing • Planning for high density lead-free SMT assembly automation

PD-36 Lead-Free Flip-Chip Wafer-Level

Packaging for 3D System-inPackages and PCB Assemblies Monday, March 30 8:30 am–4:30 pm John Lau, Ph.D., Institute of Microelectronics Lead free is the law in the EU, China, Japan, Korea and other nations, which means electronic products with lead cannot be placed on the markets of these countries. But many popular packages used in consumer, computer and communication products use solders as their interconnects, and are affected by lead-free regulations. This course examines the use of lead-free flip-chip wafer-level packaging for 3-D SiP with through-silicon-vias (TSV) and PCBs. Most of the materials are based on recent literature and the instructor’s published textbooks and technical papers. What You Will Learn • Critical issues of lead-free soldering • Critical issues of solder bumped flip-chip WLP • Conductive adhesives for flip-chip WLP applications • Impact of TSV and thin-wafer handling • Solder microbumps and their assembly • Low temperature bonding for C2C, C2W and W2W • Thermal management on 3D IC integration

Assembly Processing PD-28 Optimizing the Wave Soldering

Process Sunday, March 29 9:00 am–12:00 pm Ray Chartrand, CharTrain Consulting Learn about the interactions between surface finishes, flux chemistries and time versus temperature in this course. See how changing a single parameter affects every other component of the process, and why subtle changes to equipment set-up during maintenance may mean that a defect free may suddenly sprout a bridge or skip. The session will

PD-29 Leaded and Lead-Free SMT

Process Verification Sunday, March 29 2:00 pm–5:00 pm Ray Chartrand, CharTrain Consulting What machines indicate and what assembly sees are not always the same. This course explores methods and tools for verifying and controlling the SMT assembly process. Throughout the session, a variety of case studies from assemblers around the world will be used to illustrate important concepts. What You Will Learn • Verification of solderability of PCBs and components • Paste — makeup and test methods • Stencil design and control • Reflow oven application and control • Temperature • Profiling • Machine setup and process consistency verification • Solder defects — cause and effect • Solder — wave types, immersion, dwell and contact • Speeds — quantifiable conveyor and pump speeds • Instrumentation to verify the entire process

PD-34 Applying SPC to the Surface

Mount Manufacturing Line Monday, March 30 8:30 am–4:30 pm William Messina, Data Sleuths This course will teach the statistical methods necessary for using statistical process control (SPC) on the SMT line. Once the basics are understood, case studies will be used to demonstrate how these techniques are employed in practice. Statistical methods to be examined will include statistical control charts including Shewhart, cumulative sum (CUSUM) and exponentially weighted moving average (EWMA); and process capability indices: Cp, Cpk and Cpm. The assumptions and ramifications of these methods will be discussed in-depth. What You Will Learn • Graphical methods of data presentation • Control charts • Process capability indices • Applications for screen printers, component placement equipment and electrical test equipment

Professional Development Courses PD-40 Stencil Printing Process for

Solder Paste Application — An In Depth Look Monday, March 30 9:00 am–12:00 pm S. Manian Ramkumar, Rochester Institute of Technology This course will provide a thorough understanding of the print process for solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. A brief discussion on using this process for adhesive print applications is also included. Participants will truly understand the solder paste print process and its influence on yield. What You Will Learn • Overview of SMT assembly types and process • Factors that affect the stencil printing process • Stencils: constructions and materials • Solder paste, flux, packaging, storage handling • Squeegee • Solder paste printer types and features • Print parameters • Temperature and humidity • Process characterization • Inspection techniques, 2-D vs. 3-D inspection • Defect identification and correction • Stencil printing for adhesive applications

PD-54 Taking Stress out of Lead-Free

Assembly by Weeding out PCB Fabrication Defects Before Assembly Monday, March 30 9:00 am–12:00 pm Bihari Patel, MacDermid Identifying defects on PCBs prior to assembly is essential in preventing line stoppage and expensive rework. Ensuring that quality PCBs enter the assembly process leads to a higher first-pass yield and a reduction in rework. This course will explore deficiencies in fabrication and explain how they can be addressed by following best practices. It will also cover key result areas in lead-free assembly. What You Will Learn • Defects associated with circuit board fabrication and assembly processes • How to place relative importance of different PCB tests prior to assembly • How to successfully implement incoming inspection prior to assembly process • Identification of double reflow process and component issues • Materials and design to eliminate cracks, tombstoning, solder balls, solder fines, shorts, etc. • Preferred operating parameters for screen printer, placement and reflow and wave solder • How to optimize lead-free wave solder to achieve higher yield

PD-56 Surface Mount Technology:

Principles and Practice in a Lead-Free World Monday, March 30 9:00 am–12:00 pm Ray Prasad, Ray Prasad Consultancy Group This course identifies the technical issues companies must resolve in order to implement mixed-assembly electronics products for tin-lead and lead free. After a brief overview of SMT, the course covers “real-world” implementation issues in SMT manufacturing processes, including lead-free soldering, selective soldering, inspection, quality control and repair. A quiz at the end of the class helps participants retain the material covered. What You Will Learn • SMT process steps and components • Impact of lead free on choices for components, laminates and surface finishes • Effect on MSL level and reflow profile • Key reflow defects, their desired ratios to prevent field failures • Solder paste application • Soldering (wave and reflow) • Lead-free soldering • Backward and forward compatibility • Selective soldering • Flux and cleaning • No clean • Fine pitch • Quality control, inspection and repair

PD-58 LGA and QFN Design, Assembly

and Rework Guide Monday, March 30 9:00 am–12:00 pm Bob Willis, Electronic Presentation Services LGA (land grid array) and QFN (quad flat no-lead) have quickly become common package types in many professional portable products. With any new device type, there is always a learning curve. This practical, “how to” course will review each step of the implementation process for LGA and QFN devices and present results of practice process trials with these devices. Participants will receive a set of optical and X-ray inspection charts to use. What You Will Learn • Component package types • Component construction • Moisture sensitive device handling levels • Solderability testing packages • PCB layout on rigid and flexible circuits • Solder mask layout options • Lead-free stencil printing options • Placement and component packaging • Convection and vapor phase soldering yields • Visual inspection criteria • X-ray inspection criteria • LGA and QFN rework and replacement • Array solder joint reliability • Common process problems

PD-39 Electrostatic Discharge (ESD),

Factory Issues and Product Quality Monday, March 30 2:00 pm–5:00 pm Hartmut Berndt, B.E. STAT Elektronik Elektrostatik, Germany Failures caused by electrostatic discharge (ESD) are on the rise. If you handle electrostatic sensitive devices, it is essential to know the reasons behind these failures. This course will provide an overview of possible causes for ESD and will cover ESD control steps and the ESD Control Program (ECP) according to ANSI/ESD S20.20 and IEC 61340-5-1. The importance of applying an ECP in manufacturing facilities — and anywhere electronic components, assemblies or devices are handled, treated or transported — is also addressed. An inspection program and audit process will also be presented. What You Will Learn • Causes of electrostatic discharge (ESD) • An optimized ESD control system, with an emphasis on cost-effectiveness • Putting an optimized ESD control program in place

PD-41 Advanced Component Packages

and Processes Monday, March 30 2:00 pm–5:00 pm S. Manian Ramkumar, Rochester Institute of Technology This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages including BGAs, CSPs, flip chip, wafer level CSPs, COB, TAB and MCMs. The advantages and disadvantages of each component type, as well as their implementation requirements, will also be presented. High density interconnection, thermal management requirements and microvia technology will also be discussed. What You Will Learn • Electronics packaging and levels • Thermal management in advanced packaging • Substrate properties for advanced packaging • IC packaging trends • Package evolution • Factors influencing the package evolution • Area array packaging — BGA, CSP, WL-CSP and flip chip • Self-centering of area array packages • Assembly process for area array packages • Rework and repair of area array packages • Need for underfill and encapsulation • Ceramic column grid array • Chip-on-board technology • Tape automated bonding (TAB) • Multi-chip-module

www.IPCAPEXEXPO.org

PD-43 Statistical Process Control (SPC)

for SMT Process Monday, March 30 2:00 pm–5:00 pm Rita Mohanty, Ph.D., Speedline Technologies, Inc. In the 1920s, Dr. Walter Shewharts discovered statistical process control (SPC) as a way to describe when a process is “in control” (common cause variation) or “out of control” (special cause variation). Today, NASA describes SPC as “a method of monitoring, controlling and, ideally, improving a process through statistical analysis.” In electronics assembly, it means taking the guesswork out of quality control. No matter how you view it, the term “statistical method/analysis,” can be imposing and intimidating to many manufacturing folks. Most of us consider SPC as too involved with mathematics, complex statistical rules and expensive software. This course, designed on the principles of Six Sigma, gives a simple overview of SPC, focusing on the common cause/special cause and within/between variation concept. What You Will Learn • How to create the most common form of SPC chart, Xbar and Rbar • How to use an SPC chart

PD-55 Practical Tips for Reballing

Devices Monday, March 30 2:00 pm–5:00 pm Ray Cirimele, B E S T Inc.; Robert Wettermann, B E S T Inc. With the advent of fewer lead-free packages and the unavailability of some devices in a lead-free alloy (or right alloy), many users find they don’t have the right balls on the devices they use. This course tackles methods of reballing, including the solder preform and stencil technique. Following instruction on the various techniques, participants will have the chance to reball several BGAs. What You Will Learn • Handling of parts • Items/tools for reballing • Process flow and methods • IPC-A-610D inspection criteria • IPC-7721 procedures • Gotchas, such as small pitch devices, underfill, mask damage/repair, heat spreaders and ridged parts • Bake and dry packaging • Reflow profiling • Marking of parts Reworking of single balls • Ceramic reballing process

PD-57 Troubleshooting Yield Problems

in a Lead-Free World Monday, March 30 2:00 pm–5:00 pm Ray Prasad, Ray Prasad Consultancy Group Done correctly, electronic assembly can produce high quality assemblies at a very high speed; but when something goes wrong, the same line will produce

scrap at the same high speed. The problem is further compounded with the advent of lead-free soldering technology. This course focuses on three major areas of defects in SMT (design, assembly and the quality of incoming materials) and addresses DFM and BGA-related issues. It addresses defects related to incoming material quality, including surface finishes, as well as reflow and wave soldering; and explains some unsettled issues in lead-free wave soldering.

macros and scripts; optimizing the design preparation and layout; and making the checking, saving and ECO processes more manageable.

What You Will Learn • Root causes of SMT and through hole defects • Corrective actions to implement in design, assembly and material purchases • Key actions for improving yield and reducing product cost

PD-05 Power Delivery System Design

PD-59 Vapor-Phase or Convection

Reflow Soldering for Lead-Free and Tin-Lead Assembly Monday, March 30 2:00 pm–5:00 pm Bob Willis, Electronic Presentation Services While both convection and vapor-phase (VP) soldering can be cost-effective to produce reliable lead-free assemblies, there are advantages and disadvantages. This how-to-do-it course uses examples and visual aids to examine all aspects of the different processes, and covers soldering performance and yield from different joint terminations, solder finishes and joint structures. What You Will Learn • Vapor-phase and convection reflow overview • Process parameters • Nitrogen/inert environment myths • Advantages and disadvantages of the process options • Design and layout considerations for VP • PCB solder finishes for both • VP materials and cost • Batch or inline operation • User experiences with VP materials and equipment • Profiling boards assemblies in both • Solder paste requirements • Comparing single and double sided reflow yields • Soldering flexible assemblies • Inspection results for reflow soldering • Microsection examination

Design PD-17 Make the Most of Your Design

Cycle Time Sunday, March 29 2:00 pm–5:00 pm Susy Webb, Fairfield Industries Layout time is often one of the last things considered in the project cycle, so designers need to manage their time wisely to get the job done on schedule. This class will tackle how to do just that, looking at time management from many angles of the design cycle. We will discuss streamlining the input and output processes; fully utilizing the software, including using

What You Will Learn • Organizing input, placement, routing, ECO and output processes • Using your software to the max • General approaches to work that help with organization Sunday, March 29 8:30 am–4:30 pm Lee Ritchey, Speeding Edge Gain a thorough understanding of power delivery systems (PDS) that you can immediately apply to your designs, use to troubleshoot existing designs or incorporate into next-generation product iterations. In addition to reviewing the PDS components currently available, this practical course examines how to meet the conflicting goals of the PDS system as well as how to address power plane, impedance and overall system capacitance issues. Materials and examples are drawn from actual designs of PDS systems in current manufacture, ranging from subminiature disc drives to terabit routers and supercomputers. What You Will Learn • Fundamentals of PDS design • How PCB stackup affects PDS • How materials affect PDS • Limitation of components in PDS • How PDS affects EMI • When the use of specialty materials are warranted • How to measure the performance of PDS • Troubleshooting a poorly designed PDS

PD-16 Designing with Your “Thumbs” Sunday, March 29 9:00 am–12:00 pm Susy Webb, Fairfield Industries Ever wanted to sit with a mentor and absorb all those little tidbits of information that he/she understood so well and used so readily for placement, routing, planes, stackup, high speed and EMI? This course is a compilation of information gleaned from many technical sources and years of design work. It will provide general “rules of thumb” for how and why things should be done to achieve successful board designs. It will also introduce the concepts used to lay out PCBs with good signal integrity and EMI control. What You Will Learn • General guidelines for signal integrity, high speed and EMI • Rules of thumb for placement, routing, planes, stackup and more • Practical technical information — no math

Professional Development Courses PD-20 High Speed Printed Circuit

Design — A Practical Approach Sunday, March 29 9:00 am–12:00 pm Richard Hartley, L-3 Communication, Avionics Systems Get a comprehensive introduction to high speed circuit and printed circuit board design, and help ensure your success with designs using current and future fast and ultra-fast ICs. See how output edge rate (rise/fall time) of ICs, more than the rate at which the circuit is clocked, is the cause of signal integrity and EMI problems, and what you can do about it. Participants will receive a comprehensive workbook that can be utilized for future reference. What You Will Learn • Circuit parasitic — inductance, capacitance, etc. • High frequency currents • Signal and wave propagation, propagation time and velocity • Transmission line impedance and impedance models • Trace routing and termination schemes • Effects of vias, trace corners and connectors • Power distribution and decoupling • Tips to control EMI • Split planes and plane islands • PCB layer stack-ups

PD-09 Introduction to TDR/T

Network Analysis Sunday, March 29 2:00 pm–5:00 pm Don DeGroot, CCNi Expand your understanding of TDR and TDT, and learn how to apply it to high-speed board design and design verification. This course provides basic theory, then delivers practical guidelines for getting the best network analysis out of a given TDR/T measurement set-up. Course will also cover how to connect concepts of board dielectric constant and conductor resistivity with transmission line propagation, and address limits in making measurements when material parameters become unrealistic. What You Will Learn • TDR and TDT are network analyzer measurements, not signal measurements • Understand basic TDR/T normalization • Create basic TDR/T measurement set-ups for single-ended and differential measurements • Path from TDR/T to S-parameters is a calibration problem • Relate measurements in time and frequency domain to interconnection features • Relate wiring board material parameters to transmission line propagation

PD-21 PCB Base Materials for High

Speed, High Frequency and Lead-Free Sunday, March 29 2:00 pm–5:00 pm Richard Hartley, L-3 Communication, Avionics Systems In a high speed or high frequency circuit, a number of characteristics and variables accumulate to affect the noise budget of the circuit. Many of these are driven by the characteristics of the board’s base material. At high frequencies, materials have a profound impact on performance. This course will examine base materials commonly used in high speed digital and high frequency analog circuits. Attendees will receive a reference workbook for selecting materials for specific designs. What You Will Learn • Circuit frequency — what it is and when it matters • PCB material parameters that affect performance • PCB effect on noise budgets and wave attenuation • Skin effect — rolled vs. ED copper • Loss tangent — material’s impact • Lead-free characteristics of various FR4 materials • FR4 as a high speed/high frequency material • Materials for high speed digital applications • Materials for high frequency analog applications and flex applications

PD-60 True Design for Reliability —

Understanding What Is and What Is Not DFR Monday, March 30 9:00 am–12:00 pm Craig Hillman, Ph.D., DfR Solutions As the “design for” philosophy has expanded and become identified with best practices, an expected dilution of understanding DFR has occurred. True DFR requires a technical knowledge of electronic packaging, discrete components, printed board, solder assembly and connectors — and how these aspects of electronics can fail in regards to environmental stresses. What You Will Learn • Recognizing what is DFR, and what is not DFR • Common mistakes in part selection and placement • A common-sense approach to derating and uprating • Guidelines for part placement and orientation • Design rules for PCB fabrication • Design for assembly — hand vs. wave vs. reflow soldering • Wearout mechanisms and physics of failure — predicting degradation, including wear-out of the next generation of integrated circuits

Eco-Compliance PD-10 Compliance with the Energy-

Using Products (EuP) Directive Sunday, March 29 9:00 am–12:00 pm Graham Adams, PlesTech Ltd. The Energy-using Products (EuP) Directive was developed to improve the life cycle performance of products by integrating environmental considerations and requirements into the product design and launch process. Companies impacted by this directive will have to comply with it to market their products within the EU. This course will cover the requirements, the status of implementation, the use of benchmarks and how it will impact your businesses. What You Will Learn • Overview: purpose, history and scope • Framework: requirements, ecological profile, management systems and CE marking • Implementation measures: methodology, products covered and status • The EuP as a driver for better eco-design: EuP, Energy Star and the EU Eco Label; benchmarks

PD-11 Designing Environmentally

Sound Product to Meet Legislation and Increasing Expectations from the Marketplace Sunday, March 29 2:00 pm–5:00 pm Graham Adams, PlesTech Ltd. With increased environmental legislation, such as the EuP directive, and growing public awareness of the impact products can have on the global environment, design for the environment has become an essential part of the product design process. This course will explore how to integrate it into product design so you can meet those legislation requirements, reduce the environmental impact of your products, gain market advantage and even reduce costs. What You Will Learn • Definition of eco-design • Impact of eco-design on the bottom line • Key environmental parameters • Eco-design tools and techniques • Environmental material properties

PD-42 Implementing a Halogen-Free

Circuit Board Assembly Process Monday, March 30 9:00 am–12:00 pm Tim Jensen, Indium Corporation of America; Ronald Lasky, Indium Corporation of America The drive to produce halogen-free electronics has grown exponentially over the past two years. This course will lay out the drivers behind the halogen-free movement, and the plans and actions necessary to

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successfully assemble a totally halogen-free PCB. This will include PWB, component and solder paste selection, stencil printing, reflow and test. What You Will Learn • Why halogenated materials are used • Environmental and legislative drivers for halogenfree • PCB assembly materials that potentially contain halogens • Identifying halogens in various materials • Performance and assembly trade-offs • Halogen-free solder pastes • Overview of paste manufacture • Halogen-free fluxes • Assembly process development with halogen-free pastes • Printing, reflow and test • Establishing and implementing a halogen-free plan

PD-64 Data Management for

Eco-Compliance Thursday, April 2 10:00 am–2:00 pm Krista Botsford, Botsford Eco-Tech Partners With the ever-changing landscape of eco-compliance, companies need a quick and reliable way to gather, track and report environmental compliance data for the electronic products they manufacture and distribute. From certificates of compliance to materials declarations, every company needs to be prepared to respond to a governing agency inquiry or a customer request for proof of compliance. This workshop will cover the basics of a data management system, and explain what data should be available for an audit based on existing eco-compliance legislation. What You Will Learn • Strategy for eco-compliance data management systems; as well as general eco-compliance programs • Best practices for small to medium-sized enterprises (SME) • Requirements for existing and expected international eco-compliance requirements — such as design, recycling, production and manufacturing

Lead-Free Technologies PD-01 Achieving High Reliability for

Lead-Free Solder Joints — Material Considerations Sunday, March 29 8:30 am–4:30 pm Ning-Cheng Lee, Ph.D., Indium Corporation of America This course addresses how multiple factors contribute to failure modes, and how to select proper solder alloys and surface finishes to achieve high reliability. Material considerations, joint mechanical properties and the role of intermetallic compounds (IMC) will be discussed, along with failure modes, thermal cycling reliability and solder joint fragility. Electromigration, corrosion and tin whiskers will also be discussed.

What You Will Learn • Prevailing materials • Surface finishes issues — ENIG and ImAg • Microvoiding mechanism • Etchant chemistry effect • Mechanical properties — shear and pull strength and creep • Intermetallic compounds (IMC) — common interactions and their effects, formation of interfacial void • Failure modes — grain issues, lead contamination, mixed alloys and interfacial voiding • Thermal cycle reliability • Reliability of reworked SMT joints and through hole joints • Fragility • Reliability — electromigration and corrosion issues • Tin whisker • Future lead-free alloys and fluxes

PD-04 Lean and Green SMT — Lean

Lead-Free SMT Manufacturing Sunday, March 29 8:30 am–4:30 pm W. James Hall, ITM Consulting Inc.; Phil Zarrow, ITM Consulting Inc. Leverage the conversion to RoHS-compliant, lead-free manufacturing to create a more efficient, lean production environment with higher yields and fewer defects. This course covers the essentials of lean manufacturing as they apply to SMT electronic assembly, and examines the state of the industry in applying and optimizing lead-free materials, solder, equipment and processes. It explores lead-free alloys as they pertain to reliability, assembly issues and cost. The impact upon printing, placement, reflow and inspection will be examined, and situations confronted by both OEMs and EMS companies will be discussed. What You Will Learn • Lean manufacturing in electronic assembly and manufacturing • Implementing best lean manufacturing practices • How composition and behavior of lead-free solder affect deposition, reflow, and ultimate solder joint quality • Lead-free alloy advantages for specific product applications • Fundamentals of lead-free solder paste deposition and reflow • Forward and backward compatibility issues

PD-12 Failures and their Prevention in

Lead-Free Electronic Assemblies Sunday, March 29 9:00 am–12:00 pm Puligandla Viswanadham, Ph.D., University of Texas at Arlington Research into the microstructural aspects of lead-free alloys is in its infancy, and the influence of minor elements on the behavior of lead-free solders hasn’t been adequately explored. Compositional variations of tin-silver-copper can impact interconnection behavior under different loading conditions. In addition, different component terminations and PCB

finishes introduce more complexity to the interconnection. This course will explore lead-free solder materials, zeroing in on their microstructural aspects, unique failure modes and mechanisms. What You Will Learn • Fundamental materials’ aspects • Compositional complexities • Surface and termination finishes • Metallurgical bond and complexity • Solid-solid and solid-liquid interactions • Process parameters and impact • Microstructure and intermetallics • Effect of loading conditions on reliability • Unique failure mechanisms • Prevention or mitigation

PD-14 Industry Experiences in

Lead-Free Rework Sunday, March 29 9:00 am–12:00 pm Douglas Peck, AEIC Learn from the experiences of lead-free assemblers that have implemented new processes and materials in their rework operations. This course presents examples of process issues, root causes and solutions; examines lead-free finishes for PCBs and components; covers lead-free visual inspection criteria; and compares tin-lead and lead-free solder connections. The course also describes the degraded wetting properties and extended soldering cycles needed for lead-free alloys and the potential damage caused. What You Will Learn • Lead-free alloys and their properties • Component and PCB lead and land surface finishes • Managing the move to lead-free • Hand soldering of lead-free through hole and SMT components • Rework of lead-free BGAs and discrete devices • Site prep alternatives • Flux effectiveness with lead-free solders • Thermal profiling requirements for leadfree rework • Handling moisture sensitive leadfree devices • Inspection guidelines for lead-free assemblies • X-ray of lead-free interconnects • Lead-free rework issues and their solution

PD-26 Lead-Free Surface Finishing

for PWBs Sunday, March 29 9:00 am–12:00 pm Donald Gudeczauskas and George Milad, UIC/Uyemura International Corp. Surface finish connects the board and the device. Ball grid arrays, wire bonding pads, press fit and contact switches are all outside the traditional realm of HASL and electrolytic nickel gold tab plating, and require innovative solutions. This in-depth course will focus on the alternatives. How will the present lineup of surface finish products fare under the new high temperature conditions required by lead-free solders?

Professional Development Courses Are changes needed? What effect does this higher temperature have on the integrity of the solder joint? What You Will Learn Deposit description, thickness requirements, method of manufacturing, shelf life, application, limitations and relative cost for: • Electroless nickel/immersion gold • Electroless nickel/immersion gold/electroless gold • Electroless nickel/electroless palladium/ flash gold • Immersion gold on copper • Electroless palladium on copper • Organic solderability preservatives • Immersion silver • Immersion tin

PD-27 Taking Terror Out of Lead-Free

Circuit Board Surface Finishes and Assembly Sunday, March 29 2:00 pm–5:00 pm Bihari Patel, MacDermid The transition to lead-free PCB surface finishes for SMT and fine-pitch and BGA technologies is demanding. The instructor will share his experience with lead free in double-sided, fine-pitch and BGA and the use of new, mixed and emerging technologies. This course will cover the different lead-free surface finishes and alternative choices to hot air solder leveling. What You Will Learn • Applications • Process sequences for deposition processes • Solderability comparison with multiple reflow, solder joint formation, wire bonding capability • Acceptability criteria for PCB fabrication, handling and packaging • Stencil design • Solder paste inspection for yield improvement and solder paste printing highlight finish • Component placement • Reflow (profiles/void minimization/component damage/PCB distortion and delamination) • Wave solder • Test ICT: (testability)/functional/system level • Solder spread comparison and flux compatibility

PD-50 Lead-Free Reliability — How to

Alleviate Failures Monday, March 30 9:00 am–12:00 pm Jennie Hwang, Ph.D., H-Technologies Group Inc. Gain an understanding of ultimate reliability of lead-free packaging and assembly in this course, which provides practical how-to information backed by scientific data. It examines the interrelationship of materials, design, components, PCB surface finish, process and external environment; along with likely failure processes and failure modes; strategies and remedies to prevent failures; and solder joint reliability. What You Will Learn • Failure processes • Solder joint reliability: creep and fatigue fundamentals, thermo-mechanical degradation; ductile vs. brittle failure mechanism;

interfacial, near-interfacial, bulk, inter-phase, intraphase, voids-induced, surface-crack, intermetallic failure modes, microstructure evolution vs. strengthening • Solder joint strengthening metallurgy for increased fatigue resistance and creep resistance • Thermal cycling conditions vs. results • Intermetallic vs. microstructure vs. failure modes

PD-52 Lead Free for the Exemptee —

Surviving in a Lead-Free World Monday, March 30 9:00 am–12:00 pm W. James Hall, ITM Consulting Inc.; Phil Zarrow, ITM Consulting Inc. Even if you’re exempt, deferred or “out of scope,” RoHS affects your business. As the industry heads toward 100 percent lead free, your supply chain and competitive edge are affected. This survival course provides RoHS exemptees with the background and guidance to protect the long-term viability and reliability of their products and business. It defines the realities of lead free and examines strategies for coping with and adapting to the elimination or reduced availability of tin-lead components. Tin whiskers and backward compatibility will be examined. Because the long-term reliability of lead-free solder joints is a key reason for RoHS exemption, testing parameters, acceleration factors and modeling will also be discussed. What You Will Learn • RoHs and other legislation • Reliability issues • Supply chain issues • Backward compatibility strategies

PD-51 Interactive Discussion on

Lead-Free Electronics Monday, March 30 2:00 pm–5:00 pm Jennie Hwang, Ph.D., H-Technologies Group Inc. This interactive course will provide a forum for exploring best practices in lead-free manufacturing and system reliability, plus provide insights into the evolution and development of lead-free electronics. The course will open with an overview of lead-free key research findings, real-world production results and system reliability. Each attendee is invited to bring at least one issue for class discussion on possible solutions. What You Will Learn • Material, process, production defects and remedies, rework, system compatibility, reliability and harsh environment performance • Research, testing data and manifold evaluations on yield, quality and reliability • Solder joint reliability and failure modes • Performance and reliability of component coating

and PCB surface finish • Best practices in lead-free manufacturing and system reliability • Potential solutions to your issues

PD-53 Lessons Learned — Lead-Free

Surface Mount Technology Monday, March 30 2:00 pm–5:00 pm Chrys Shea, Shea Engineering Services Experience is the best teacher, but its lessons are often expensive — particularly in the context of printed circuit assembly, where small problems can add up to big dollars very quickly. The assembly process is filled with opportunities for quality concerns, and taking it lead-free only adds to the list of potential pitfalls. This course reviews the most common problems in lead-free soldering, how to avoid them and methods to address them. What You Will Learn • Common defects: head-in-pillow, solder bridges, voids, mid-chip solder balls, tombstones • Optimizing print quality, lead-free stencil design and intrusive reflow • Influence of PWB fabrication and surface finish on the SMT assembly process • Mixed metals solder systems in BGAs • Hybrid solder pastes • Special concerns for RoHS-exempt assemblers • Halogens and halides in the assembly process • Separating fact from fiction in lead-free SMT

PD-63 Lead-Free Lessons Learned:

Wave Soldering Thursday, April 2 10:00 am–2:00 pm Chrys Shea, Shea Engineering Services As more complex assemblies become lead free, the effects of slower wetting, higher process temperatures and longer process times are reflected in much tighter process windows and in new DFM guidelines. This workshop addresses those implications based on the basic principles of wave soldering. Common issues associated with high-density, mixedtechnology assemblies such as poor hole fill, copper dissolution, secondary reflow, flux sustainability and solder bridging will be reviewed in detail and prevention of defects by appropriate process control methods will be discussed. Also, revised design guidelines to prevent or reduce defects will be provided. What You Will Learn • Processing issues with thick, multi-layer boards • Flux selection • Thermal profiling • Surface finishes and wave contact • Copper dissolution • Hole fill • Process control • DFM guidelines

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Materials

PCB Fabrication

PD-06 Base Material Basics:

PD-02 What is HDI Technology? Do You

Manufacture and Market Sunday, March 29 9:00 am–12:00 pm Douglas Sober, Kaneka Texas Corporation This course will provide an in-depth analysis of all grades of base materials used in printed boards — from low-cost, paper-based (FR-1) to high-speed/ high-frequency PTFE. Specific attention will be focused on base materials compatible with lead-free assembly. In addition, manufacturing processes, materials and quality assurance provisions for prepreg/laminate production will be introduced. What You Will Learn • Laminate and prepreg materials for lead-free assembly • Marketing strategy of halogen-free materials • Developing standards globally for base materials • Reinforcements, such as paper, woven fiberglass, glass felt • Standard resins (phenolic, epoxy, halogen-free epoxy) • High temperature resins (BT, polyimide, modified high performance epoxy) • Low dielectric constant resins (polyester, cyanate ester, PTFE) • Microvia materials and processes • Cost considerations by grade

PD-47 Choice of Materials for Flexible

Circuits and Flex-Rigid Boards Monday, March 30 2:00 pm–5:00 pm Jerome Sallo, Ph.D., Sallo Consulting This course considers flexible base materials, including polyimide, polyester, PEN and LCP. It features a review of polyimide films and adhesives, and when to use them. The choice of copper foil relative to available thickness, electrodeposited and rolled annealed will be discussed. In addition, reasons for choosing adhesiveless materials, whether made by sputtering, casting of polyimide on copper or by other means will be reviewed, including ink-printed circuits, semi-additive and fully-additive approaches. The use of thermoplastic polyimide adhesives to form all polyimide laminate will be considered. The criteria used in these reviews will include cost, flexibility, thickness and weight, via formation methods, Z-axis expansion and UL and military requirements. What You Will Learn • Material choices • Cost considerations • Types of base films • Types of adhesives • Choices of copper foil • Benefits of adhesiveless laminates

Need HDI? Sunday, March 29 8:30 am–4:30 pm Michael Carano, OMG Electronic Chemicals; Happy Holden, Mentor Graphics This workshop covers key technologies for fabricators who want to get into HDI fabrication, as well as key design recommendations and stackups for designers and hardware engineers who want to know what HDI can do for their next PCB. Fabricators will get insights into how HDI board designers select stackups, design rules and features; designers will learn about issues and cautions that arise when fabricating an HDI-microvia board. What You Will Learn • HDI definitions, types and markets • Reliability and testing • Design rules and stackups • EDA features required and associated issues • Material types • Lamination • Via formation • Metallization — desmear, electroless copper, direct metallization and semi-additive processing • Imaging and etching — achieving fine lines and spaces, controlled copper etch • Electrodeposition — improved throwing power, enhancing through hole and microvia reliability, copper thickness requirements for thermal reliability and process controls • Solderable finishes • Via filling technology

PD-18 Flexible Circuit Technology:

Structures, Applications, Materials and Manufacturing Processes Sunday, March 29 9:00 am–12:00 pm Joe Fjelstad, Verdant Electronics Products enabled by flexible circuit technology abound. This course will explore this increasingly important technology as it evolves and changes to solve an increasing number of interconnection problems. Included will be reviews and discussions on applications, materials and processes as well as specific testing concerns. Also covered are the special design needs associated with flexible circuits, as they are true electromechanical devices that require special knowledge to avoid costly errors. What You Will Learn • Overview of flexible circuit technology • Flex laminate material options • Flex circuit structures • Flex circuit design guidelines • Flex circuit manufacturing processes • Steps to implementing flex in a design • Flex circuit testing and reliability concerns and factors • Special flex circuit assembly needs • New developments in flex

PD-19 Flexible Circuits: More Than Just

an Electrical Interconnect Sunday, March 29 2:00 pm–5:00 pm Mark Verbrugge, Minco Products Inc. Flexible circuitry is more than just an electrical interconnect. Because a flex circuit is required to bend and flex during and after installation, it becomes as much a mechanical device as an electrical one. A robust flex circuit design goes much deeper than just connecting the nets. Small variations in material selection, material stack-up and routing features can dictate whether a flex circuit will function for years or fail within minutes. This course will examine the electrical and mechanical features that must be incorporated into the design, and how these features will interact (good and bad). What You Will Learn • The design process, from concept to finished product • When/where to use flex circuits • Maximizing value for the lowest TCO • Common design errors and cost drivers

PD-07 Making Circuit Boards, One

Chemical at a Time Sunday, March 29 2:00 pm–5:00 pm Donald Cullen, MacDermid, Inc. All circuitry starts as liquid chemicals. Chemical processing transforms liquids, from copper electroplating baths for laminate foil to precious metal immersion baths for surface finishing, into a usable electronic interconnect device. Because construction of the circuit board has evolved slowly, it can be easy to overlook its complexity — it employs hundreds of individual chemical process steps and many thousands of individual chemicals. This course will provide a chemical view of PCB manufacture and a unique summary of the overall manufacturing sequence. What You Will Learn • Chemical processing steps used in making PCBs • Descriptions of key chemical reactions in nonchemist language • New chemicals to be used • Proper process control and quality assurance

PD-23 Advanced Packaging

Technologies and Future Interconnection Trends Sunday, March 29 2:00 pm–5:00 pm Joe Fjelstad, Verdant Electronics IC packaging technology is the first interconnection element supporting the semiconductor chip, and is the primary gatekeeper of electronic system performance. With so many packaging options available, understanding the basics of IC packaging is

Professional Development Courses critical to successful product design. This course will review common IC packages, including chip scale, BGA, 3-D stacked and folded packages as well as wafer-level packaging. What You Will Learn • Roles of IC packaging • Construction and manufacturing processes for common IC packages • Impact of design on the assembly process • Testing strategies • Trends in the integration of IC, package and PCB substrate • Future of IC packaging technology • Role of IC packaging technologies in electronics assembly • Chip scale packaging types • 3-D packaging concepts • Reliability testing and electrical performance of chip scale packages (CSPs) • Impact of lead-free check points and alternative approaches • Standards for substrates

PD-33 The PWB Fabrication Process —

Simplified Sunday, March 29 2:00 pm–5:00 pm Gary Ferrari, FTG Circuits Today’s printed boards are quite complex, demanding many new or enhanced fabrication processes. This course will provide a detailed description of the board fabrication process with a special look at how specific design decisions affect the manufacturability of the printed board. Actual panels taken from each step of the manufacturing process will be reviewed and discussed. The session will conclude with a “walk through the shop” slide show. What You Will Learn • PCB manufacturing process steps • Material selection • Small hole technology • Imaging, etching and plating • How design decisions affect PCB manufacturing • Cost drivers • Quality control and test

PD-37 PCB Fabrication Basics: Process

and Specification Monday, March 30 8:30 am–4:30 pm Don Schmieder, Plexus Corp.; Jim Vanden Hogen, Plexus Corp. PCB design affects fabrication and the finished product affects assembly. Physical samples taken from PCB fabrication process steps will be used to show how designing a cost-effective array or sub-panel will maximize material, facilitate manufacturing and allow for post-assembly singulation. Using a PCB fabrication specification for reference, participants will learn how to develop specifications, including ones for RoHS-compliant PCBs. What You Will Learn • Steps in PCB fabrication • Array design and optimal material utilization • Stackups, via metrics

and aspect ratios • Pros and cons of various solder mask and surface finish applications

PD-44 Implementing HDI Technology —

An OEM Model Monday, March 30 9:00 am–12:00 pm Happy Holden, Mentor Graphics; Andrew Palczweski, Harris Corp. HDI is rapidly becoming the most widely used emerging technology for high-performance electronics, fine-pitch and high I/O BGAs. This intensive workshop will walk you through an HDI product implementation program used successfully by a number of aero/military and telecom OEMs: 1) education, planning and vendor audits; 2) test-vehicle creation and testing; 3) redesigning a current board to HDI and 4) putting it all together. What You Will Learn • Critical fabrication technology for PWBs and microvias (HDIs) • Using custom test vehicles to evaluate new materials, fabricators and design strategies • How some OEMs used HDI to redesign TH multilayers with fewer layers • Evaluating and working with fabricators, and potential problems to look out for • Prior HDI test vehicles and their results

PD-46 Printed Circuit Board Fabrication — Back to Basics Monday, March 30 9:00 am–12:00 pm Michael Carano, OMG Electronic Chemicals The PCB fabrication process is an intricate maze of interrelated steps, both chemical and mechanical. Each step is critical to minimize or eliminate costly defects. This course will identify and explain the basics of PCB fabrication and the different troubleshooting techniques. What You Will Learn • Multilayer fabrication • Up- and downstream processes in PCB fabrication • Innerlayer fabrication • Lamination • Latest in processing alternatives and quality control • Via formation • Metallization • Desmear/etchback • Electroplating technologies • Plating processes • Factors affecting plating distribution and throwing power

PD-48 Nanoelectronics, MEMS and

MOEMS: Products and Packages Monday, March 30 9:00 am–12:00 pm Ken Gilleo, Ph.D., ET-Trends LLC This course will give you a comprehensive but concise view of MEMS (Micro-Electro-Mechanical Systems) and MOEMS (also known as optical-MEMS), along with a survey of emerging nanotechnology — minus the hype. Diagrams, animations, photographs and

videos will be used to illustrate MEMS/MOEMS and nanotechnology. A live accelerometer demonstration is also included. What You Will Learn • Materials • 3-D structures • Fabrication methods Actuation mechanisms • Operation • Product applications

PD-45 Materials for HDI and

Advanced PCBs Monday, March 30 2:00 pm–5:00 pm John Andresakis, Oak-Mitsui Technologies Material selection plays a critical role in the ultimate quality and performance of every PCB. This workshop, designed for both the PCB designer and fabricator, will explore existing and future materials suitable for incorporating into HDI product. These materials include resins, reinforcements and metallic foils that are currently available, as well as promising new materials that are under development. The important characteristics of these materials as they relate to HDI production will be emphasized. In addition, the workshop will cover materials for embedded passives and high frequency operation. What You Will Learn • Material types and characteristics • Trade-offs of various materials • Materials for embedded passives high frequency considerations

PD-49 Flexible Circuitry: A World of

Applications Monday, March 30 2:00 pm–5:00 pm Mark Finstad, Minco Products, Inc.; Ken Gilleo, Ph.D., ET-Trends LLC Flex makes tens of thousands of products possible by marrying motion and electronics. But it is also used for its low cost and thinness. Its high density, durability, designed flexibility, thinness and thermal resistance make flex ideal for circuits as well as packaging. It is found in products ranging from expensive, complex, military applications to the world’s lowest-cost PCBs. This course compares traditional copper-flex to the polymer thick film (PTF) now used to make value-maximized keyboards, calculators, medical sensors and RFID tags, and examines dozens of fascinating flex examples. What You Will Learn • Flex materials and processes • Dynamic flex for motion electronics • Flex in portable products • Flex packages: TAB, flex-BGAs, flip, chip-on-flex, CSPs and 3-D multi-chip • High performance flex: TBGAs, flexBGAs, TAB, integrated TAB • Polymer thick film applications • RFID tag choices • Flexible electronics: printed transistors

www.IPCAPEXEXPO.org

PD-62 Via Hole Filling Technology

and Processes: An Overview of Materials, Processes, Equipment and the Technology Drivers Thursday, April 2 10:00 am–2:00 pm Michael Carano, OMG Electronic Chemicals This workshop describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. In addition, via plugging material requirements, including a discussion on material properties, outgassing, Dk and Df will be presented in detail and several via filling technologies will be compared and contrasted. The course will also address critical success factors, including proper mechanical requirements, process control and reliability as well as defects related to the via filling process. What You Will Learn • Introduction to via filling • Technology drivers • Different types of via structures • Via filling processes • Filling via polymer materials • Filling via plating • Via fill by electroplating • Theoretical considerations • Plating additive design • Plating process parameters • Plating cell design • Process control • Reliability • Troubleshooting

Quality, Reliability and Test PD-03 Design for Reliability: Reliability

Testing, Data Analysis and Failure Analysis of Lead-Free Solder Joints Sunday, March 29 8:30 am–4:30 pm John Lau, Ph.D., Institute of Microelectronics Solder’s unique properties have fueled creative advanced packaging developments, such as solderbumped flip chip technology, ball grid array, chip scale packages and wafer-level CSPs. For these technologies, solder is the electrical and mechanical “glue” and their solder joint reliability is one of the most critical issues faced by users. What You Will Learn • Real definition of reliability • Reliability vs. qualification tests • Design for lead-free solder joint reliability • Reliability testing and data analysis • Failure analysis • Material properties • Effects of nano-material on SAC’s IMC and Cu consumption • Solder balls and bumps under shear and under pull • Solder joint reliability of lead-free flip chip assemblies, mixed and pure lead-free PBGA assemblies and WLCSP assemblies • How to select underfills for CSP, PBGA and flip chip assemblies

PD-08 Life-Testing Basics Sunday, March 29 9:00 am–12:00 pm Thomas Clifford, TJB Consultants Discover the basics of life-testing, concentrating on thermal-cycle reliability. This course will explain the best metrics, show you how to select test parameters and describe the types and size of errors likely to emerge from faulty application of principles. It will also present the most useful measure of accuracy and confidence intervals — and show how to use this concept with test data. Practical guidance on performing data reduction is also included. The course will describe what not to do with raw data, but sophisticated theoretical inquiry is not needed: emphasis is on practical use of intuitive tools, applied to everyday technology-development questions. What You Will Learn • What is a life test • Determining appropriate metrics, and the problem with first-fail • Life-testing parameters and their effect on accuracy and test duration • Reducing, interpreting and reporting test data • Definition of good data • Calculating metrics from raw failure data

PD-13 Fundamentals in Solder Joint

Reliability Sunday, March 29 2:00 pm–5:00 pm Werner Engelmaier, Engelmaier Associates, L.C. This course explores the mechanisms underlying thermally induced solder joint fatigue, combined with the temperature-, time- and stress-dependent behavior of solder. It puts quality, manufacturability and reliability into context and examines the reliability hazard, pertinent design parameters and material properties. The course also addresses accelerated fatigue testing to establish reliability databases, electronic product-use categories of different environmental severity and accelerated testing regimens. Participants will develop a solder fatigue model based on experimental results and use an acceleration model. What You Will Learn • Technical issues of solder joint failures • Relative importance of assembly design, material interactions and solder joint quality • Solder joint creep-fatigue • Solder behavior under load • Using a reliability estimation model • Different test acceleration models • Applying DFR procedures

PD-35 Lead-Free Soldering Processes —

Survival, Quality, Reliability Monday, March 30 8:30 am–4:30 pm Werner Engelmaier, Engelmaier Associates, L.C. The threat to the reliability of electronic products comes from three sources: solder joint reliability, PCB survival during soldering (and long-term reliability) and component survival of soldering processes. This course will examine each of these threats and explore solutions that can help assure the survival and reliability of electronic assemblies. What You Will Learn • Failure modes, their underlying damage mechanisms and possible solutions • Processing issues associated with lead-free solders, particularly SAC solders • Impact of processing issues on solder joint quality and assembly damage • Design, material choice and processing steps to assure survival of PCBs and components • PCB and component resin systems • The risk of latent defects and how to prevent them • Design-For-Reliability measures

PD-38 Advanced Tools for PCB Testing

and Failure Analysis Monday, March 30 9:00 am–12:00 pm Bob Neves, Microtek Laboratories This course will discuss advanced test tools and emerging test technology. The benefits of test data provided by electrical and environmental tests, surface analysis techniques and organic material identification will also be addressed. Attendees will learn how to determine the proper approach to failure and forensic analysis, as well as the decision-making processes involved in selecting the correct type(s) of tests/analyses. Examples of failures will be examined and the process of creating a test program to find the root cause will be discussed. What You Will Learn • Time domain reflectometry • Insulation resistance • Dielectric constant (permittivity) and loss tangent • Thermal shock (HATS) testing • Thermal mechanical analysis • Differential scanning calorimetry • Dynamic mechanical analysis • SEM/ EDX and AUGER analysis • Organic identification (FTIR) • Interconnection stress

PD-61 Understanding Failure and

Root-Cause Analysis in Lead-Free Electronics Monday, March 30 2:00 pm–5:00 pm Craig Hillman, Ph.D., DfR Solutions Get an in-depth understanding of failure mechanisms unique to lead-free electronics, and the tools and techniques to identify them. A physics of failure (PoF)

Professional Development Courses based approach will be taken, identifying drivers such as defect-driven, overstress and wearout, and how an understanding of these stress-strength interactions can provide guidance on corrective and preventive action. Case studies will be presented, including red phosphorus in epoxy encapsulants, creepage corrosion in immersion silver and solder joint failures.

manufacturer. This course provides you with practical guidance on how to evaluate PCB manufacturers. Ideal for PCB designers and others tasked with recommending a manufacturer, the course will prepare you to effectively evaluate a PCB manufacturer’s ability to satisfy your requirements, and assure a future positive relationship.

What You Will Learn • Changes prerequisite with lead-free electronics • Green materials • Lead-free materials failure analysis • Packaging • Component plating • Conductive anodic filaments caused by lead-free reflow soldering • Plated-through hole fatigue • Electrochemical migration • Solderability issues • Overstress (mechanical shock, bending) • Intermetallic formation • Wearout (thermal cycling, vibration)

What You Will Learn • Ten questions to ask manufacturers that will clarify the critical issues you need to know • Ten things to look for and find in a manufacturer to assure your future satisfaction • Ten insights on how to assure a successful future relationship with your manufacturer

Supply Chain/Business Issues PD-24 Product Cost Reduction Using

Supply Chain Modeling Sunday, March 29 9:00 am–12:00 pm Chet Palesko, Savansys Solutions LLC The growing complexity of the supply chain, coupled with the ever-increasing choice of technologies, makes it impossible to fully optimize product cost without modeling the cost structure and capabilities of your specific supply chain. This course examines how OEMs and suppliers can collaborate to develop a model that optimizes product manufacturing cost. Major OEMs and suppliers have used this approach to match design technology choices with supplier competencies — yields are improved and a true cost reduction is achieved across the supply chain. What You Will Learn • How to gather key supplier information related to design technology choices • Yield modeling and estimation techniques • Defect density, defects per million operations, test, rework and scrap strategies • Production activities for board fabrication and assembly, and relation to product cost and yield • Supply chain characteristics that affect production cost and yield

PD-30 Ten Questions, Observations and

Insights to Measure Confidence in a PCB Manufacturing Facility Sunday, March 29 9:00 am–12:00 pm Richard Snogren, Bristlecone LLC You can listen to sales presentations. You can take a guided tour through the shop. But if you don’t ask the right questions, you may not get the information you need to make the right decision about a potential

PD-32 Purchasing Basics for the

and competitiveness. This course will provide a 20,000-ft. view of lean that will help decision makers understand how lean can help any organization survive. The instructor will share lessons learned from his experience in manufacturing management. Common mistakes, myths and what it takes to successfully implement a lean program will be covered in this workshop. What You Will Learn • Survival is not mandatory: the need for lean • Drive-by lean • The lean philosophy • The seven deadly wastes • Process analysis • Why 99 percent yield is not good enough • The lean toolkit • A glossary of lean terms

PCB Buyer Sunday, March 29 9:00 am–12:00 pm Gary Ferrari, FTG Circuits Gain a solid knowledge base to guide you through the essentials of purchasing today’s high technology printed wiring boards. Course discussion will address the principle cost drivers behind PCBs, such as printed board materials and finishes; extra fabrication process steps; typical fabrication and design rules; tooling and artwork; testing; on-site vendor survey; and vendor relationships.

PD-31 PCB Costs — How Designers

What You Will Learn • PCB manufacturing overview • Cost drivers • Relative PCB costs • Customer-supplier relationships • How to conduct a vendor survey

What You Will Learn PCB cost adders including: • Materials and mixed dielectrics • Embedded devices • Board and manufacturing panel sizes • Specificity/coupons • Copper foil thickness • Etched features • Impedance control • Drill sizes and sequences • Blind/buried via structures • Sequential lamination • Plating thickness • Via fill/tent/plug • Finishes • Final thickness and tolerance • Complex profiles • Tight tolerances • Documentation and traceability, inspection report, etc. • Techniques to assess and affect PCB costs during the design process

PD-25 Survival Is Not Mandatory: 10

Things Every CEO Should Know About Lean Sunday, March 29 2:00 pm–5:00 pm Steven Williams, Plexus Corp. Delve into the most powerful tool your company can use to improve organizational performance

Certification Programs

Affect PCB Costs Sunday, March 29 2:00 pm–5:00 pm Richard Snogren, Bristlecone LLC Technology, volume and time affect PCB costs. Understanding the relationships between these variables, and how design can affect the cost basis for PCBs, is essential knowledge for designers. This course provides a systematic view of PCB cost drivers, and explores how they can be optimized during the design phase.

Thursday, March 26

8:30 am–5:00 pm 8:30 am–5:00 pm

PCB Designer Certification Training Advanced PCB Designer Certification Training

Friday, March 27

8:30 am–5:00 pm 8:30 am–5:00 pm

PCB Designer Certification Training Advanced PCB Designer Certification Training

Saturday, March 28

8:30 am–3:00 pm 8:30 am–3:00 pm

PCB Designer Certification Exam Advanced PCB Designer Certification Exam

Tuesday, March 31

8:00 am–5:00 pm

I ntro to EMS Program Manager Certification Training

Wednesday, April 1

8:00 am–1:00 pm

I ntro to EMS Program Manager Certification Training

Friday, April 3

8:00 am–5:00 pm

EMS Program Manager Certification Training II

Saturday, April 4

8:00 am–5:00 pm

EMS Program Manager Certification Training II

www.IPCAPEXEXPO.org

Travel Hotel Reservations

Travel Airline American Airlines and other oneworld carriers are the official airlines for this event.

Book through the official housing service, Experient, Online:

www.IPCAPEXEXPO.org/hotels

Travel between March 23 and April 7, 2009, and save 5% on lowest applicable fares on any American Airlines/oneworld* carrier. Book online at www.aa.com or call 800-433-1790 (U.S. and Canada) and reference auth # A7839AE. American Airlines reservation hours: Mon.–Fri., 3:00 am–10:00 pm Pacific time, 5:00 am–12:00 am Central time.

By Phone: 800-974-9833 or +1 847-996-5400; (8:00 am–5:00 pm Central Time) By Fax: Complete the Individual Housing Request Form (available online) and fax it to 800-521-6017 or +1 847-996-5401 By Mail: Complete the Individual Housing Request Form (available online) and send it to: Experient – Vernon Hills Service Center 568 Atrium Dr., Vernon Hills, IL 60061 Make your reservation by February 20, 2009 to receive the special IPC rates shown. After February 20, the hotels may no longer offer IPC’s special contracted rates. The housing service may offer rooms based on current rates and availability. All meetings will take place at the Mandalay Bay Convention Center unless otherwise noted. Additional rates may apply for more than two adults in a room. Rates are in U.S. dollars and do not include occupancy tax, currently 9%, or any other related taxes or fees. Room type and rate assignments are on a first come, first served basis. A credit card guarantee is required at the time your reservation is made. Credit cards must be valid through April 2009. Your credit card may be charged by your hotel between March 1, 2009, and 72 hours prior to your arrival in the amount of one night’s room and tax deposit for each room reserved. This deposit is nonrefundable for cancellations received within 72 hours of your arrival.

Mandalay Bay Resort and Convention Center 3950 Las Vegas Blvd. South Standard/Deluxe: $258 Executive Suite*: $358

Mandalay Bay Resort and Convention Center

Please note that Experient will send confirmation of your arrangements by e-mail, fax or mail when your reservation has been confirmed. You will not receive confirmation from your assigned hotel. Changes/Cancellations: Prior to February 27, 2009, please contact Experient with all changes and cancellations prior to 5:00 pm Central Time. Between February 28 and March 4, reservations made through Experient will be transferred to the hotels. Beginning March 5, please contact your assigned hotel directly with all changes and cancellations. Cancellations received by the hotel within 72 hours of scheduled arrival will be penalized in the amount of one night’s room and tax deposit on the credit card used for guarantee. Hotel Room Solicitation You may be contacted by housing companies claiming to be the official IPC housing group. These entities are not affiliated with IPC in any way. IPC’s official hotel provider is Experient and they will not contact you directly unless you contact them.

E LOW NEW TES RA

ER LOW NEW TES RA

Luxor Las Vegas 3900 Las Vegas Blvd. South (connected to Mandalay Bay by free tram and walkway)

Excalibur 3850 Las Vegas Blvd. South (connected to Mandalay Bay by free tram and walkway)

Standard/Tower: $125 (Sunday–Thursday) $189 (Friday and Saturday)

Standard: $91 (Sunday–Thursday) $169 (Friday and Saturday)

* Executive suites are offered upon request and subject to hotel availability. Ask your housing agent for more details.

*Visit www.aa.com for a list of oneworld carriers.

Rental Cars Avis partners with American Airlines as the official rental car agency for this event. Get the lowest available rate guaranteed, when you use AWD#D086747. Call 800-331-1600 (U.S./Canada) or +1 918-624-4201, or book online at www.avis.com. Rates are available from March 24–April 4, 2009. Discounts apply to rentals from Las Vegas McCarran Airport. Car Pooling Coming from southern California or elsewhere in Nevada? Interested in carpooling? Look for a shared ride at www.mashable.com/2008/09/30/carpooling/. Parking Parking at Mandalay Bay is free. Self-parking and valet are available in the parking garage. Shuttle Airport shuttles are available with drop-offs at the major hotels. Mandalay Bay is usually the first or last drop-off. Shuttles run $5–$7 per person. Excalibur-Luxor-Mandalay Bay Tram Hop this free tram, which runs between the Excalibur, Luxor and Mandalay Bay hotels every three to seven minutes. Las Vegas Monorail Hop on the high-tech Las Vegas Monorail and get ready for a fast, way-cool ride to some of the area’s hottest destinations.

Policies Any function that is not part of the “official program” is prohibited, from the first meeting to the close of the event. IPC does not permit solicitation by nonexhibiting companies. Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event will be asked to leave immediately.

IPC 2009 Registration Options

Create a Package that is perfect for you! Whether you want face-to-face interaction, technical knowledge, or an opportunity to impact the industry, we have an option for you. Choose any of the following to create your perfect package.

Group Discount: register four colleagues from the same company, same company location, at the same time, for items marked with a and deduct $100 from each registration.

FREE ($25 on-site)

X. Exhibit Hall Only includes admission to the exhibit hall and the event essentials A MVP — Maximum Value Package includes the full technical conference • all

standards development committee meetings • your choice of one full-day or two half-days of professional development • conference proceedings CD • All IPC luncheons and a complimentary voucher for free lunch on the show floor on Thursday • the event essentials

NM (nonmembers) $1150

M (members) $850

Special Bonus: Receive 20% off your hotel room rate at Mandalay Bay — only offered with this package. Technical Conference

Designer Events

B. Full Conference

$660

$540

6. Designers Day Package

$825

$635

C. One-Day Conference

$330

$270

7. Designers Day

$375

$300

Designers Certification

includes all technical conference paper sessions • conference proceedings CD • standards development committee meetings • the event essentials (luncheons not included) includes one day of technical conference paper sessions (Tuesday, Wednesday or Thursday) • standards development committee meetings • the event essentials (luncheons and proceedings not included)

Standards Development Committee Meetings NM

D. Committee Meetings Plus Conference $700

$575

includes all technical conference paper sessions • standards development committee meetings • All IPC luncheons and a complimentary voucher for free lunch on the show floor on Thursday • conference proceedings CD • the event essentials

1. Committee Meetings Plus Luncheons

includes standards development committee meetings • All IPC luncheons and a complimentary voucher for free lunch on the show floor on Thursday • the event essentials

2. Committee Meetings

includes standards development committee meetings • the event essentials (luncheons not included)

Executive Management Programs

includes Monday meeting • Monday luncheon • networking reception • standards development committee meetings • the event essentials

8. Designer Certification Workshop $795 and Exam

$595

9 Designer Certification Exam Only

$205

Professional Development Courses

10. Full-Day Course

$595

$450

11. Half-Day Course

$300 ea $225 ea

Additional Items

12. Proceedings

$150

$125

13. Luncheons

$40 ea

includes materials • two-day workshop (Thu & Fri) • exam (Sat) • Select Basic (CID) or Advanced (CID+)*

$120 $100 ($150 on-site)

FREE ($40 on-site)

includes Monday Designer Day meeting • Monday luncheon • networking reception • your choice of one full-day course (Sun) or two half-day courses (Sun or Thu) • standards development committee meetings • the event essentials

3. PCB Executive Management Meeting $540 (must be an executive leader of PCB Mfr.)

$425

4. EMS Management Council Meeting (must be an executive leader of an EMS provider)

$540

$425

5. VIP Networking Dinner for guest

$90 ea

includes Monday meeting • Monday luncheon • VIP Networking Dinner • the event essentials

exam (Sat) • Select Basic (CID) or Advanced (CID+)* *advanced certification is open to anyone with valid CID credential

one full-day course • supporting materials

one half-day course • supporting materials • A complimentary voucher for free lunch will be provided for Thursday courses only. You may select up to five half-day courses

Purchase a copy of the conference proceedings on CD Select Monday, Tuesday, or Wednesday

includes Monday meeting • Monday luncheon • VIP Networking Dinner • the event essentials

EMS Program Manager Certification EMS Program Manager Continuing Education Series: “Find It. Book It. Grow It. A Robust Process for Account Acquisition in EMS.” For more information, contact Susan Filz at SusanFilz@ipc.org

Event Essentials

Exhibit Hall ☑ Free Forums ☑ OEM Summit ☑ Keynote Sessions ☑ Show Floor Welcome Reception ☑ Poster Sessions and Mini Social ☑

Need assistance? Call 877-472-4724 (toll free in U.S. and Canada) or +1 847-597-2860 or e-mail registration@ipc.org

IPC APEX EXPO

Conference & Exhibition: Tuesday–Thursday, March 31–April 2, 2009 | Meetings: March 29–April 2, 2009 Mandalay Bay Resort & Convention Center, Las Vegas

By Internet:

www.IPCAPEXEXPO.org

International code ___________

By Fax:

By Mail:

+1 708-344-4444 If You Fax This Form, Do NOT Also Mail Form!

CSI-IPC P.O. Box 522 Brookfield, IL USA 60513

1. General Information

4. Register me for:

My main interest is in technology for (choose the most appropriate): o Electronics Assemblies o Bare Printed Circuit Boards o Design

X o E xhibit Hall Admission Only Exhibits open Tuesday–Thursday (March 31–April 2)

($25 on-site)

Best Value Package First Name

Last Name/ sUrname

Job Title

Mail Stop

A o MVP Package — Your Maximum Value: NM: $1150 or Half Days PDand PDFull Day PDEnter course code(s) above. Course codes are required.

Mailing Address (con’t.)

Province

Country

Telephone

Ext.

$______ $______

NM: $540 M: $425 NM: $540 M: $425 NM: $90 each

Designer Events

Spouse/Guest Name (if attending)

6 o Designers Day Package NM: $825 Full Day PDor Half Days PDand PDEnter course code(s) above. Course codes are required. 7 o Designers Day NM: $375

o I need a letter of invitation for VISA application o This is my first IPC meeting. o I have a disability requiring an accommodation. IPC will contact you for more details. o I would like to receive on-site text notifications of news and late-breaking events. Mobile phone _____–_____–____________. o I would like to receive IPC e-mail on relevant events and new releases. o I would like to receive e-mail communications from exhibiting companies. (You can opt-out at any time.)

Designer Certification

8 o Designer Certification Workshop and Exam NM: $795 Select o 8a CID (basic) or o 8b CID+ (advanced) 9 o Designer Certification Exam Only Select o 9a CID (basic) or o 9b CID+ (advanced)

3. Your Profile 4.

10 o Full-Day Course PD NM: $595 ea Select PD11 o Half-Day Course NM: $300 ea PDPDPDPDSelect PDEnter course code(s) above. Course codes are required.

$______ $______ $______

M: $635

$______

M: $300

$______

M: $595

$______

$205 NM/M

$______

M: $450 ea M: $225 ea

$______ $______

M: $125 $40 per day

$______ $______

Subtotal

$______ -$______ -$______

5. Additional Items 12 o Conference Proceedings CD NM: $150 13 Luncheons o 13a. Mon. o 13b. Tues. o 13c. Wed.

I plan to buy products/services: o 4A. Now o 4B. Next 6 Months o 4C. 6-12 Months o 4D. >12 Months o 4E. No Plans

5. Products I use, specify, approve and/or recommend: (check all that apply) o 5A. Adhesives & Dispensers o 5B. Assembly Chemicals & Materials o 5C. Automated Test Equipment o 5D. Cleaning Equipment & Supplies o 5E. Components, Connectors, Fasteners o 5F. Component Prep & Placement Equipment o 5G. Drilling, Routing & Tooling Equipment o 5H. EMS/Contract Assembly o 5I. PCB Manufacturer o 5J. Materials Handling Equipment o 5K. PCB Chemicals & Materials o 5L. Production Hand Tools & Fixtures o 5M. Reflow & Wave Soldering Systems o 5N. Rework, Repair Tools & Kits o 5O. Services–Desn., Consulting, Testing, etc. o 5P. Software–CAD, CAM, MES, etc. o 5Q. Stencil Printing Systems o 5R. Test/Inspection Systems o 5S. Other________________________

$FREE

Professional Development Courses

o Nonmember o Member of IPC

o AA IPC California Circuits Association (CCA) o FF MEPTEC o BB IPC Designers Council o GG iNEMI o CC IMAPS o HH ECA o DD Japan Robot Association (JARA) o II WECC Organizations o EE JEDEC Solid State Technology Association (Please note–if you have checked any member box, use member prices for registration. Membership will be validated before registration is processed.)

3. In selecting products and services, I: o 3A. Make final decisions o 3B. Recommend/Influence o 3C. Am not involved

D o Committee Meetings Plus Conference NM: $700 M: $575 1 o Committee Meetings Plus Luncheons NM: $120 M: $100 ($150 on-site) NM/M 2 o Committee Meetings ($40 on-site) NM/M 3 o PCB Executive Management Meeting 4 o EMS Management Council Meeting 5 o VIP Networking Dinner for guest

E-Mail

2. My company is: (check the most appropriate) o 2A. PCB Mfr. o 2B. EMS (Contract Assembly/Mfg.) o 2C. OEM (Original Equip. Mfr.) o 2D. Sup. of PCB or Ass. Matls, Eqmt. Serv. o 2E. Distributor/Manufacturer’s Rep o 2F. Education/Consulting o 2G. Design Service Bureau o 2H. Other ________________________

$______ $______

Executive Management Programs (must qualify)

Fax

1. My primary job function is: (check only one) o 1A. President/Owner/CEO o 1B. Vice President/Director o 1C Engineering/Manufacturing/Processing o 1D. QC/QA o 1E. R&D o 1F. Marketing/Sales o 1G. Purchasing/Finance o 1H. Human Resources/Training o 1I. Design PCB Layout o 1J. Design Package Systems o 1K. Testing o 1L. Environmental 1 M. Are you an Executive Leader? o Yes o No

M: $540 M: $270

Standard Development Committee Meetings

City State Zip (U.S.)/Postal Code

2. Membership Status

$______

B o Full Conference NM: $660 C o 1-Day Technical Conference (per day) NM: $330 Select: o C1 Tuesday o C2 Wednesday o C3 Thursday

Mailing Address

$FREE

M: $850

Technical Conference

Company

6. Price

Less Group Discount

20% Early Discount (Form and payment must be received by March 4, 2009) Less coupon Grand Total

-$______ $______

7. Method of Payment

Y ou will not be registered until we receive your payment (Choose one payment option.) Purchase Orders Not Accepted

o Check or money order payable to IPC. Charge to my: o American Express o Visa o MasterCard o Diners Club Signature Print Cardholder Name Account Number

Exp. Date

I f you must cancel for any reason, you must notify us in writing by March 27, 2009. Please contact IPC at 877-472-4724 (toll-free) or +1 847-597-2860 for full cancellation policy and instructions. Please note there will be a $50 cancellation processing fee.

PRESORTED STANDARD U.S.POSTAGE PAID CHICAGO, IL PERMIT #4358

There’s a lot to see and hear at IPC APEX EXPO!

To zero in on your key interests, we’ve created these shortcuts for you to view specific courses and sessions for ... Design www.ipcapexexpo.org/dssummit Electronics Assembly www.ipcapexexpo.org/assembly Printed Board Manufacture www.ipcapexexpo.org/boards

3000 Lakeside Drive, Suite 309 S Bannockburn, IL 60015-1249 USA www.IPCAPEXEXPO.org

Environmental Compliance www.ipcapexexpo.org/environment

On our cover (clockwise from top left) Lynn Norman, Senior Materials Engineer Continental Automotive Systems U.S. Inc. Denise Michaloski, CID, PCB Design Engineer KEYW Corporation Barry Borwege, Manufacturing Engineer SPX Service Solutions Steve Kahn, Technical Operations Manager Wireless Technology Inc. (OEM) Greg Klein, Chairman Epic LLC Chuck Needham, Director, Sales & Product Management Phoenix International Corp. Ruth Delker, CID, Senior PCB Designer Cipher Systems