Exhibition
September 23–24
Technical Conference September 23
Renaissance Schaumburg Hotel & Convention Center Schaumburg, Ill.
The Best of Our Industry is Coming Together for You — One Show … One Place!
DESIGN
PRINTED BOARDS
ELECTRONICS ASSEMBLY
TEST
BE GLOBAL, STAY LOCAL
IPC Midwest Conference & Exhibition was designed with our industry’s specialized needs in mind, and with very specific goals to connect you with the experts, industry colleagues, and resources that can help you enhance your business and your staff’s knowledge base. 3 Cultivate new business relationships … while you strengthen existing ones 3 Gain access to cost-effective resources to stay up-to-date on our industry’s advancements … as well as emerging opportunities for growth 3 Brainstorm and consult with experts about the specific challenges you’re facing at work … along with the new issues on the horizon 3 Find the tools, processes and equipment that could help your company streamline and become more efficient … and save money We’re all looking for ways to work more efficiently and cost-effectively. Get Interconnected with IPC Midwest and put solutions within your reach — Be Global, Stay Local!
Hotel All events will take place at the:
Renaissance Schaumburg Hotel & Convention Center 1551 Thoreau Drive, Schaumburg, IL 60173 Just 14 miles northwest of Chicago’s O’Hare International Airport and 35 miles northwest of Midway Airport.
Make your reservation: Online: Follow the link at www.IPCMidwestShow.org/hotel By Phone: +1 847-303-4100 or toll free at 800-468-3571 Ask for the special IPC Midwest room rate of $179 single/double. The IPC rate is available until our block is full, but only for reservations made by Monday, August 24, 2009.
IPC Travel ecial 4! Visit www.IPCMidwestShow.org/travel for airline and car rental discount p s r 2 fo gust line codes. Free parking is available at the convention center. Dead ate is Au r l e t ho Services for Persons With Disabilities Please contact IPC at +1 847-597-2824.
Exhibition
September 23–24
Technical Conference September 23
Professional Development Courses September 24
The conference was very valuable. I got some excellent information … that is directly applicable to my job. Having this information available will save my company a significant amount of time in the future. The specifics on new solders will be very helpful to us. Neil J. Witkowski, Reliability Technical Manager, Alcatel-Lucent
Standards Development Meetings September 20–23*
* Select meetings will take place on September 18, 19, and 24
www.IPCMidwestShow.org
shows@ipc.org • 877-472-4724 (U.S./Canada)
FIND YOUR NEXT GREAT IDEA AT MIDWEST Table of Contents On the Show Floor
2
Exhibitors
3
Special Events
4
Technical Conference
5
Professional Development Courses
7
Standards Development Meetings
10
Registration Options
Don’t forget to get the data on via reliability for lead-free printed boards!
inside back cover
Produced by IPC — Association Connecting Electronics Industries® A global trade association based in Bannockburn, Ill., IPC (www.IPC.org) represents all facets of the electronic interconnect industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.
In cooperation with: • Circuitnet • CircuiTree • EMSNow • EMTWorldWide • Global SMT & Packaging • I-Connect007 • SMT Magazine • U.S. Tech
Event Policies Children under the age of 18 are allowed on the trade show floor only during exhibit hall hours. No photography or videotaping by attendees or exhibitors is allowed. Show management photography of attendees or exhibitors may be used for promotional purposes.
Suitcasing IPC does not permit solicitation by nonexhibiting companies. Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event (known as “suitcasing”) will be asked to leave.
Hospitality For more than 50 years, IPC has been consistent in its policy requesting that no one conduct or sponsor hospitality suites or functions at IPC events in order to preserve the focus on education, technology and standards development. Therefore, any function that is not part of the “official program” is prohibited during event hours. For details related to event policies, visit www.IPCMidwestShow.org/policies. www.IPCMidwestShow.org
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ON THE SHOW FLOOR Check out the A-Line Get in the A-Line and see SMT assembly in action! Attendees will follow a product through screen printing, pick-and-place, and reflow while learning about the processes and equipment that manufacture the device. Representatives from participating companies will be on hand to operate the systems and answer your questions. At the end of the line, you’ll get a finished assembly thanks to our participating companies: Ace Production Technologies, ASYS Inc., Aqueous Technologies, Bare Board Group, Fuji America Corporation, Kyzen Corporation, The Morey Corporation, and Promation Inc.
Participants:
IPC Bookstore Informational resources to enhance the work you do, help train your staff and support your company’s strategic planning efforts are waiting for you in the IPC bookstore on the show floor. • Browse through industry standards on design, board fabrication and assembly. • Check out IPC training and certification programs.
• Review IPC’s catalog of multimedia training resources, including DVDs, interactive CD-ROMs, online video resources, training and reference guides, wall posters and image archives. • Learn about IPC’s management programs, market research reports and technology roadmaps.
Discover IPC’s industry resources ... It’s like adding your own industry expert to your team!
FREE Forums IPC Technology Roadmap Thursday, September 24 8:30 am–10:00 am Moderator: Jack Fisher, Interconnect Technology Analysis, Inc. The IPC International Technology Roadmap provides vision and direction for companies in the electronics manufacturing industry. The Roadmap encompasses the supply chain infrastructure needed for single chip and multichip packaging, printed board issues,
assembly considerations, optoelectronics and related management/environmental key pressure points. The Roadmap even includes a technical driver software tool so long-range planners can compare their current offerings with the technology needs of tomorrow. Learn more about this incredible document from the key contributors in this free session. More free forums will be added soon. Visit www.IPCMidwestShow.org for the latest information.
The ability to review all equipment exhibitors under one roof and get live demonstration as well as get our questions answered was very helpful. Seeing the new technology offerings from processing, inspection to testing … makes the IPC Midwest show definitely worth it. Russ Payton, Process Engineer, Samtec, Inc.
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EXHIBITION September 23 September 24
10:00 am–6:00 pm 10:00 am–4:00 pm
eir new follow-up — th ion plating applicat thousands could save us
Discover the latest equipment, chemicals, materials, software and services available to you. More than 100 of our industry’s top suppliers will be available to answer your questions, discuss your unique situation and help you solve your most pressing needs.
It’s the most cost-effective way to see and compare products in all major categories for printed board manufacturing, electronics assembly and test! Visit www.IPCMidwestShow.org/exhibitors for up-to-date exhibitor information and start building the perfect itinerary to address your challenges. Sign up by September 18 for a free show pass!
Exhibitors
NEW!
A focused area of reliability featuring ACE Production Technologies, Inc. exhibits and show floor presentations. Check Aegis Industrial Software Corporation out www.IPCMidwestShow.org for details. AGI Corporation AIM MIRTEC Corp. Apollo Seiko Ltd. MYDATA automation Aqueous Technologies NSWC Crane Ascentech, LLC Omron Electronics Assembléon America Ovation Products Asymtek Pentagon EMS ASYS Inc. Petroferm Inc. Bare Board Group, Inc. Pillarhouse Calumet Electronics Corporation PROMATION, Inc. CHEMCUT Corporation Qualitek International Inc. Circuitnet Real Time With ... IPC CircuiTree RMD Instruments Corp. Control Micro Systems, Inc. Rogers Corporation CyberOptics Corporation Senju Comtek Digitaltest Inc. SMT Magazine Diversified Systems, Inc. U.S. Tech EKRA America Uyemura International Corporation EMT Worldwide YESTech Europlacer North America ZESTRON America Fuji America Corporation Glenbrook Technologies, Inc. Global SMT & Packaging I-Connect007 Kyzen MicroScreen LLC Exhibitor list as of May 15, 2009
www.IPCMidwestShow.org
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SPECIAL EVENTS FREE First-Timers Welcome Breakfast Wednesday, September 23 7:30 am–8:15 am Wake up to breakfast replete with networking opportunities and information to make the most of your visit to the show. Find out how IPC resources and involvement in IPC can boost your career and benefit your company.
FREE Opening Session: A Leaded Engineer in a LeadFree World
Wednesday, September 23 8:30 am–9:30 am Moderator: Dave Hillman, Rockwell Collins Panelists: Linda Woody, Lockheed Martin Missile & Fire Control Carol Handwerker, Sc.D., Purdue University Stephan Meschter, Ph.D., BAE Systems Platform Luncheons Solutions (Registration required) Mark Fulcher, Continental AG Monday, September 21 Lead-free assembly is here and growing in 12:00 pm–1:30 pm size and scope in many, but not necessarily Tuesday, September 22 all product areas. Even with RoHS, there are 12:00 pm–1:30 pm products that are exempt from lead-free use. Wednesday, September 23 What is the view from these last bastions of 12:00 pm–1:30 pm tin-lead? How do designers and component and Let’s do lunch! Take some quality time to join manufacturing engineers deal with a world that your industry colleagues for lunch and make new is becoming lead free while they’re still operating friends and business contacts. Luncheons on in leaded mode? Our panel of experts will fill you Monday and Tuesday will include a program to in on how they and their companies are coping recognize the volunteers who contribute their time with manufacturing RoHS-exempt product in a and expertise to the development of IPC standards world where lead free is becoming the norm. and other activities. Let’s give ’em a hand!
Chicagoland Circuit Board Association Annual Golf Outing Tuesday, September 22 Registration — 11:00 am Tee off begins— 12:00 pm Join your colleagues for some fun in the sun and golf at Klein Creek Golf Club in Winfield, Ill. The 18-hole championship course at Klein Creek is an ideal place to make new friends, network and show off your golf prowess (or lack thereof). Green fees, cart, lunch and prizes … $100. For more information and to register, visit www IPCMidwestShow org/golf. Questions? Contact Rob Coleman, RBP Chemicals at +1 630-881-6819. Registration deadline is September 8 4
FREE
Show Floor Welcome Reception Wednesday, September 23 5:00 pm–6:00 pm Enjoy a casual stroll through the exhibit floor and get familiar with the companies, products and services that can help you with your work. Celebrate friendships, new and old, and enjoy the company of colleagues that keep our industry vital.
TECHNICAL CONFERENCE Wednesday, September 23 Take advantage of the Midwest’s premier technical conference to build your knowledge base, network with peers and stimulate ideas for new ways to nce approach your challenges. The technical conference fere e r t is divided into three tracks focusing on quality grea re with m and reliability for PCBs and electronics assembly. ha ea — s ering t Although several of the sessions focus on critical ine t research, there are also sessions that can help you eng plan t a k find answers to the quality and reliability problems bac you face today. As an added bonus, conference registrants will receive a copy of all of the technical conference S03 Challenges in Building a High Reliability presentations on CD to refer to all year long. Military PCB 10:00 am–12:00 pm Moderator: Vern Solberg, STC-Madison Best Value: Register for the Committee Conference Reliability in mission-critical systems is a matter Package and save 20% off a la carte prices! of life and death. This first of two sessions on reliability will dissect the critical components of reliability for the printed board, especially in the Wednesday Morning Sessions harsher manufacturing environments of lead free. S01 Lead Free Model Cage Match Surface Finishes and Their Impact 10:00 am–12:00 pm on Reliability Moderator: Carol Handwerker, Sc.D., Al Wasserzug, Pioneer Circuits Inc. Purdue University Design Considerations for High Tin-lead solder is a well understood system Reliability PCB with more than thirty years of reliability models Raj Kumar, Dynamic Details, Inc. development behind it. Lead-free solders are not Pb-Free Reflow, PCB Degradation and so well understood. There have been attempts to the Influence of Moisture Absorption develop models, but how successful have they Craig Hillman, Ph.D., DfR Solutions been? Join us for some heated debate on what works and what doesn’t in lead-free systems! Wednesday Afternoon Sessions Modeling Creep-Fatigue of Pb-Free S04 IPC Solder Products Value Council: Alloy Solder Joints Testing and Take Action Limits Werner Engelmaier, 1:30 pm–3:00 pm Engelmaier Associates, L.C. Moderator: Karl Seelig, AIM, Inc. Work on Development of a Lead-Free This session highlights the IPC Solder Products Reliability Model Value Council’s latest work on take action limits Ganesh Subbaraya, Purdue University (TAL) for lead-free solder pot contamination and in Development of a Lead-Free Reliability developing industry consensus on test methods for Model Based on Stress Strain Hysteresis lead-free alloy comparison. Jean-Paul Clech, Ph.D., EPSI Take Action Limits for Lead-Free Wave S02 Strategies for Fighting Counterfeiting Soldering Alloys: A Solder Products 10:00 am–12:00 pm Value Council Study Moderator: James Williams, Polyonics, Inc. Stanley R. Rothschild, Metallic Resources Inc. Counterfeiting of components has become a serious Proposed Standardization of Lead-Free issue. Learn how to fight counterfeiting from our Alloy Testing Karl Seelig, AIM, Inc. distinguished panelists: Debra Eggeman, IDEA; Elliot Grant, Yottamark; Dennis Fritz, MacDermid. Join us Drop Shock and Vibration Testing for Leadfor a timely discussion of what to do about a very Free Solders Thomas Woodrow, Ph.D., The Boeing Company serious problem. www.IPCMidwestShow.org
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TECHNICAL CONFERENCE S05 The Quality and Reliability View As Seen From the Assembly Line 1:30 pm–3:00 pm Moderator: Dieter Bergman, IPC What are the defining quality and reliability issues of manufacturing and test? Our speakers will guide you through the roadblocks and hurdles they have seen in their years of striving to keep the flag of quality and reliability flying over the manufacturing line. Implementing Quality and Reliability on the Assembly Line with Standards David Bergman, IPC Manufacturing and Quality Issues Leo Reynolds, Electronic Systems Inc. An EMS Perspective on Manufacturing Quality Issues Representative of Plexus S06 Printed Board Reliability Issues 1:30 pm–3:00 pm Moderator: Joelle Arnold, DfR Solutions In our second session on board reliability, we expand on the issues for via reliability and the transition of telecom products into the era of lead free. Join us for the latest information. Microvia Reliability Failure Modes Paul Reid, PWB Interconnect Solutions Inc. PWB Quality Issues for High Reliability Telecom Applications Ted Lach, Alcatel-Lucent Water Vapor Uptake and Release in Printed Boards Joseph Kane, BAE Systems S07 Reliability and the Solder Interface 3:15 pm–4:45 pm Moderator: Werner Engelmaier, Engelmaier Associates, L.C. In this session, three speakers will guide you through some of the critical issues that influence the reliability of your solder joints. Comparative Study on Lead-Free Assembly of ENEPIG versus ENIG and Immersion Silver Eric Stafstrom, Technic, Inc. A Study of Solder Optimization Development for Portable Electronic Device Lee Hyun-Kyu, Duksan Hi-Metal Co., Ltd. The Role of the Interfacial Intermetallic in Lead-Free Solders Keith Howell, Nihon Superior Co., Ltd. 6
S08 Environmental Issues 3:15 pm–4:45 pm Moderator: Fern Abrams, IPC Keeping tabs on ever-changing environmental regulations and customer product requirements is a major effort for the entire electronics supply chain. This session will address the ever-expanding list of restricted substances and supply chain requirements for materials declaration. REACH, RoHS, TSCA — What’s Next? John Ciba, Brady Corporation International Environmental Standards for the Electronics Industry Walter Jager, Intertek, Ageus Solutions Materials Declaration: Practical Tips for Cutting Through the Paperwork N. Nagaraj, Ph.D, Papros Inc. S09 High Frequency Printed Boards 3:15 pm–4:45 pm Moderator: Duane Mahnke, Mahnke Consulting This session takes you from the board surface to the base material and into the fiber weave for a complete look at what makes a high frequency board tick. Join us for a session of insight and innovation. High Frequency Materials Used in the PCB Industry John Coonrod, Rogers Corporation Are Lead-Free Assemblies Especially Endangered by Climatic Safety? A Closer Look at Why Cleaning Prior to Conformal Coating Becomes Key and Essential Harold Wack, Ph.D., ZESTRON America Bandwidth Limitations and Fiber Weave Effect: Opening the Eye John Kuhn, Dielectric Solutions, LLC Russell Dudek, Compunetics, Inc.
PROFESSIONAL DEVELOPMENT COURSES Thursday, September 24 Find solutions to your company’s greatest challenges with learned guidance from our industry experts. They have the experience, knowledge and tools to help you sharpen your skills and contribute to your company’s success. Combine a course with the technical conference and maximize your return on time invested. View full descriptions and speaker biographies at www.IPCMidwestShow.org/courses. PD-01 Stencil Printing Process for Solder Paste Application — An In-Depth Look 9:00 am–12:00 pm S. Manian Ramkumar, Rochester Institute of Technology This course will provide a thorough understanding of the solder paste print process and its influence on yield. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. A brief discussion on using this process for adhesive print applications will be held. What You Will Learn Overview of SMT assembly types and process • Factors that affect the stencil printing process • Stencils: constructions and materials • Solder paste, flux, packaging, storage handling • Squeegee • Solder paste printer types and features • Print parameters • Temperature and humidity • Process characterization • Inspection techniques, 2-D vs. 3-D inspection • Defect identification and correction • Stencil printing for adhesive applications.
PD-02 Troubleshooting Your PCB Assembly Yields – On-Site or Offshore 2:00 pm–5:00 pm Bob Willis, ASKbobwillis.com During this workshop, the most common leadfree process problems will be discussed along with the solutions or ways of investigating the root causes. Attendees will learn how to use free online soldering defect databases to solve process problems. Attendees are encouraged to share their process problems and board assemblies for discussion. Each participant will receive a set of color wall charts to help with lead-free inspection and fault identification in manufacture. Attendees www.IPCMidwestShow.org
with the best questions will win interactive training CD-ROMs on inspection, design and rework. What You Will Learn: Modern SMT assembly & common opportunities for failure • Top ten process failures in lead-free assembly • Components, PCBs and assembly • Practical first-level failure analysis in manufacture • Defining process parameters; key process checks during assembly • Reflow, wave, selective and conformal coating • Monitoring contract assembly process yields • Solving defects 24/7
PD-03 LGA and QFN Design, Assembly and Rework Guide 9:00 am–12:00 pm Bob Willis, ASKbobwillis.com LGA (land grid array) and QFN (quad flat no-lead) have quickly become common package types in many portable products. With any new device type, there is always a learning curve for design, process and quality engineers who are facing the challenges these packages bring. This practical, “how to” course will review each step of the implementation process for LGA and QFN devices and present results of practice process trials with these devices. Participants will receive a set of optical and X-ray inspection charts for later reference. What You Will Learn: Component package types • Component construction • Moisture sensitive device (MSD) handling levels • Solderability testing packages • Printed board layout on rigid and flexible circuits • Solder mask layout options • Lead-free stencil printing options • Placement and component packaging • Convection and vapor phase soldering yields • Visual inspection criteria.
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PROFESSIONAL DEVELOPMENT COURSES PD-04 Advanced Component Packages and Processes 2:00 pm–5:00 pm S. Manian Ramkumar, Rochester Institute of Technology This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages, including BGAs, CSPs, flip chip, wafer level CSPs, COB, TAB and MCMs. A thorough comparison of the advantages and disadvantages of each component type as well as their implementation requirements will be presented. High density interconnection, thermal management requirements and microvia technology will be discussed. The course will also cover assembly process details when using these devices in leadbased and lead-free assembly. What You Will Learn: Electronics packaging and levels • Thermal management in advanced packaging • Substrate properties for advanced packaging • IC packaging trends • Package evolution • BGA, CSP, WaferLevel CSP and flip chip • Self-centering of area array packages • Assembly process for area array packages • Rework and repair of area array packages • Need for underfill and encapsulation • Ceramic column grid array (CCGA) • Chip-on-board (COB) technology • Tape automated bonding (TAB) • Multi-chip-module (MCM)
PD-05 Fundamentals of Solder Joint Reliability 9:00 am–12:00 pm Werner Engelmaier, Engelmaier Associates, L.C. This course explores the mechanisms underlying thermally induced solder joint fatigue, combined with the temperature-, time- and stress-dependent behavior of solder. It puts quality, manufacturability and reliability into context and examines the reliability hazard, pertinent design parameters and material properties. The course addresses accelerated fatigue testing to establish reliability databases, electronic product-use categories of different environmental severity and accelerated testing regimens. Participants will gain hands-on practice, including developing a solder fatigue model based on experimental results and using an acceleration model to extrapolate results from accelerated reliability tests. What You Will Learn: Underlying technical issues of solder joint failures • Relative importance of assembly design, material interactions and solder joint quality • Solder joint creep-fatigue and the primary drivers in terms of the physics-of-failure and the statistical failure • Distribution • Solder behavior under load • How to use a state-of-the-art, but practical, reliability estimation model • The differences between the three most widely used test acceleration models • How to apply appropriate DFR procedures • Reliability information underlying key industry documents.
Certification Programs at IPC Midwest IPC EMS Program Manager Certification — Introduction to the EMS Industry and Program Management September 21–22 IPC EMS Leadership Training and Program Manager Certification Exam September 24–26
For more information and to register, contact Susan Filz at SusanFilz@ipc.org or visit www.ipc.org/EMSCert.
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Designer Certification (CID) and Advanced Designer Certification (CID+) September 25–27 ®
Designers Council
For more information on IPC’s designer certification programs, visit http://dc.ipc.org.
PROFESSIONAL DEVELOPMENT COURSES PD-06 Final Finishes and Their Compatibility with Lead-Free Assembly 2:00 pm–5:00 pm Michael Carano, OMG Electronic Chemicals Due to lead-free solders, the industry is seeing a new importance in the solderable finishes that protect the bare copper prior to assembly. In addition to coplanarity, these surface finishes provide the optimum lead-free solder paste spreadability and lead-free solder through hole fill for optimum joint strength. Higher temperature melting points for lead-free solders will add additional heat stress and aging. How will this impact solderability and long term reliability? Learn what board manufacturers and assembly companies must do to be successful with lead-free finishes. Issues related to dross formation and copper dissolution will also be addressed. What You Will Learn: Solderability overview • Metallic coatings: electroplated nickel-gold, electroless nickelimmersion gold, palladium, immersion tin, immersion silver • Thin versus thick organic coatings • Compatibility of lead-free surface finishes with lead-free solders • Paste spreadability studies • Through hole fill studies • Joint strength testing • Effects of aging and multiple thermal cycles on solderability • Process control: solderability checks, deposit integrity • Cost implications of lead-free finishes
PD-07 DFM for Manufacturing: When a Six Sigma Process Is Not Sufficient to Achieve a High Yielding Manufacturing Process 9:00 am–12:00 pm Dale Lee, Plexus Corporation Today’s design tolerances have impacted traditional assembly processes with very tight solder application, component placement and soldering constraints. Traditional Six Sigma process controls are insufficient to achieve a high yielding manufacturing process. This course will introduce the element of design for matched process (DFMP) to product design and examples of several opportunities within DFMP process for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching and environmental controls. What You Will Learn: PCB Design Elements • Wave Solder Design Elements • SMT Solder Design Elements • Process Control — Is Six Sigma Good Enough • Compatibility Issues
PD-08 Accelerated Thermal Cycling and Acceleration Factors for Lead-Free Surface Mount Assemblies 2:00 pm–5:00 pm Jean Paul Clech, Ph.D., EPSI The timely assessment of lead-free solder joint reliability requires the use of efficient accelerated thermal cycling profiles, coupled with reasonably accurate acceleration factors (AFs) that allow for the extrapolation of failure times from test to field conditions. AFs are a key factor of lead-free solder joint reliability assessments. Using reliability test data and predictive models developed for standard SnAgCu (SAC305/396) assemblies, this workshop reviews test procedures as well as the basic ingredients and methodologies that are needed to develop AF or life prediction models for lead-free soldered assemblies. What You Will Learn: Trends and comparison of SnPb and lead-free accelerated testing results • Thermal cycling conditions • Thermo-mechanical behavior of soft solders • Life-prediction techniques
www.IPCMidwestShow.org
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STANDARDS DEVELOPMENT MEETINGS Chances are these committees are working on standards used by your company, customers, competitors and suppliers. Become the standards expert at your company and make yourself even more invaluable. Whether you attend to lend your expertise or just to learn from industry experts, you can help shape the future of the industry while you build visibility for you and your company. Visit www.IPCMidwestShow.org/committees for complete descriptions and meeting times (subject to change).
This process assembly
standard is right up our alley! Distribute draft to
staff and submit comments before it goes to ballot.
Sign up for the Committee Meetings Package and save! Get even more value with the Committee Conference Package which includes the full technical conference on Wednesday and the conference proceedings CD. Assembly and Joining Processes 5-20 Assembly and Joining Processes Committee (By Invitation)
5-22a/ Joint Meeting — J-STD-001 and 7-31b IPC-A-610 Task Groups
This is a planning meeting for the leaders of the Assembly and Joining Processes Committee. 5-21h Bottom Termination Components (BTCs) Task Group
This is a joint working group to resolve comments common to revision E of both J-STD-001 and IPC-A-610. 5-22as Space Electronic Assemblies J-STD-001 Addendum Task Group
Sunday, September 20 Leo Lambert, EPTAC Corporation
Tuesday, September 22 Ray Prasad, Ray Prasad Consultancy Group.; Vern Solberg, STC-Madison
This new task group is developing a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing bottom termination components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. 5-22a J-STD-001 Task Group Sunday, September 20 Teresa Rowe, AAI Corporation
This task group is developing revision E to IPC J-STD-001. The leaders hope to close all comments and action items as a prelude to ballot.
Monday, September 21 Teresa Rowe, AAI Corporation; Jennifer Day, Sanmina-SCI; Constantino Gonzalez, ACME Training & Consulting
Tuesday, September 22 Garry McGuire, NASA Marshall Space Flight Center
This task group will be celebrating publication of a revision to Space Applications Electronics Hardware Addendum for J-STD-001D and will immediately begin work on the addendum for J-STD-001E. 5-22bt J-STD-001 Training Task Group Wednesday, September 23 Teresa Rowe, AAI Corporation
This working group provides technical guidance for the certification program for J-STD-001. 5-23a Printed Circuit Board Solderability Specifications Task Group Monday, September 21 Gerard O’Brien, Solderability Testing and Solutions Inc.
PCB solderability is the focus of this task group that has published J-STD-003A.
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STANDARDS DEVELOPMENT MEETINGS 5-23b Component and Wire Solderability Specification Task Group Monday, September 21 David Hillman, Rockwell Collins
This task group is working on consolidating IPC/ECA J-STD-002C and JESD 22-B102 (JEDEC document on same topic). 5-24a Flux Specifications Task Group Tuesday, September 22 Renee Michalkiewicz, Trace Laboratories - East
This task group will begin to revise J-STD-004C. 5-24c Solder Alloy Task Group Tuesday, September 22 David Scheiner, Kester
This task group is revising J-STD-006C. 5-24f Underfill Adhesives for Flip Chip Applications Task Group
Tuesday, September 22 Brian Toleno, Ph.D., Henkel Corporation
This task group is updating J-STD-030. 7-31b IPC-A-610 Task Group
Friday, September 18 Saturday, September 19 Jennifer Day, Sanmina-SCI; Constantino Gonzalez, ACME Training & Consulting
This task group is continuing development of revision E to IPC-A-610. The goal is to close all comments and action items as a prelude to ballot. 7-31h IPC-HDBK-620 Handbook Task Group
Wednesday, September 23 Randy McNutt, Northrop Grumman Corp.; Brett Miller, USA Harness, Inc.
This task group is developing a handbook with general information to support users of IPC/WHMA-A-620. 7-35 Assembly and Joining Handbook Subcommittee Tuesday, September 22 Mary Muller, Crane Aerospace & Electronics; Guy Ramsey, R & D Assembly
This subcommittee is nearing completion of a major update to IPC-AJ-820 that now incorporates the best parts of IPC-HDBK-001, IPC-PE-740, IPC-HDBK-830, IPC-CM-770 and the component identification desk reference manual DRM-18.
Assembly Equipment 5-41 SMT Component Placement Equipment Subcommittee Thursday, September 24 Michael Cieslinski, Panasonic Factory Solutions Company of America
This committee is developing revision A to IPC-9850. Base Materials 3-11 Laminate/Prepreg Materials Subcommittee Monday, September 21 Tony Senese, Panasonic Electric Division
This subcommittee will be gathering information on neat resin fracture toughness to add this property to revision C of IPC-4101. 3-11f UL/CSA Task Group Thursday, September 24 Jack Bramel, Jack Bramel & Associates
This task group provides a forum for the exchange of ideas and data related to Underwriters Laboratories’ and Canadian Standards Association’s recognition of printed board materials and processes. This task group continues to request industry input for UL 796 and UL 746E that can be presented to the applicable STP as well as newly re-formed Industry Advisory Group (IAG). 3-11g Metal Finishes Data Acquisition Task Group Tuesday, September 22 Beverley Christian, Ph.D., Research In Motion Limited
This task group is exploring and gathering data on the effects of corrosion on surface finishes. 3-12a Metallic Foil Task Group
Tuesday, September 22 Rolland Savage, High Performance Copper Foil Inc.
This task group is working on gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562. Due to frequent schedule changes, dates are subject to change. Visit www.IPCMidwestShow.org/committees for the most current committee schedule and meeting times, and be sure to pick up a Show Directory on-site.
www.IPCMidwestShow.org
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STANDARDS DEVELOPMENT MEETINGS 3-12d Woven Glass Reinforcement Task Group
5-32e Conductive Anodic Filament (CAF) Task Group
This task group continues to explore the dielectric constant (permittivity) for E-glass and will examine the data obtained from testing this property by glass fiber manufacturers for possible inclusion into IPC-4412. 3-12e Base Materials Roundtable Task Group
This task group will consider comments to revision B of IPC-9691A. 5-33c Conformal Coating Handbook Task Group
Monday, September 21 Patricia Goldman, Dielectric Solutions, LLC
Monday, September 21 Edward Kelley, Isola Laminate Systems
This task group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Cleaning and Coating 5-30 IPC Cleaning and Coating Committee Monday, September 21 Debora Obitz, Trace Laboratories – East; Douglas Pauls, Rockwell Collins
This session will feature a presentation on all its current activities. 5-31 Cleaning & Alternatives Subcommittee Tuesday, September 22 Mike Bixenman, Kyzen Corporation
This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, IPC-SA-61, IPCAC-62 and IPC-CH-65. 5-32a/ Joint Meeting — Ionic Conductivity 5-32c and Bare Board Cleanliness Task Groups Wednesday, September 23 Douglas Pauls, Rockwell Collins; John Radman, Trace Laboratories East Denver
This joint meeting will address the completion of IPC-5704 on cleanliness assessment requirements for printed board fabricators and new test methods for ionic cleanliness. 5-32b SIR and Electrochemical Migration Task Group Monday, September 21 Chris Mahanna, Robisan Laboratory Inc.
This task group is developing a user guide for the IPC-B-52 SIR test board and reviewing international efforts on SIR and CAF.
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Tuesday, September 22 Karl Sauter, Sun Microsystems, Inc.
Wednesday, September 23 Amy Hagnauer, Raytheon Company
This task group is developing revision A of IPCHDBK-830. 5-33f Potting and Encapsulation Task Group Monday, September 21 Douglas Pauls, Rockwell Collins
This newly formed task group is evaluating industry needs for potting and encapsulation of conformal coatings. Data Generation & Transfer/Documentation 2-18 Declaration Process Management Subcommittee Monday, September 21 Eric Simmon, National Institute of Standards and Technology
This subcommittee has developed IPC-1751 for supplier data exchanges, including materials declarations and manufacturing process declarations. 2-18x Packaging Declarations Exploratory Meeting Thursday, September 24 Michael Hutchings, Sun Microsystems
This is an exploratory meeting to determine if there is industry interest in development of a data exchange standard for packaging/packing materials. This could address use of restricted materials as well as recycling, material content, applicable standards and laws, labels, etc. 2-18a Manufacturing Process Declaration Task Group Thursday, September 24 Fritz Byle, Astronautics Corp. of America
This task group will discuss the development of a standard for the exchange of manufacturing process information, such as moisture sensitivity level, lead finish, and tin whisker mitigation.
STANDARDS DEVELOPMENT MEETINGS 2-18b Materials Declaration Task Group Tuesday, September 22 Mark Frimann, Texas Instruments Inc.
This task group will review proposed revision 2.0 of the materials declaration standard IPC-1752. 2-18e Process Chemicals Declaration Task Group Wednesday, September 23 John Sharp, TriQuint Semiconductor Inc.
This task group will discuss its draft standard for declaration of restricted chemicals used in the manufacture of electronics. Data Generation & Transfer/Shop Floor Communication 2-10/ Joint Meeting — Data Generation and 2-13 Transfer Committee and Shop Floor Communication Subcommittee Monday, September 21 Andrew Dugenske, Georgia Institute of Technology; Karen McConnell, Lockheed Martin
The 2-10 committee oversees all CAD, CAM and CAE data transfer standards described in the IPC25XX series. The 2-13 subcommittee will discuss the IPC-2540 standards and their implications for both end-users and equipment suppliers on the factory floor. Electronic Documentation Technology 2-40 Electronic Documentation Technology Committee Monday, September 21 Bryan Truax, CADParts & Consulting, LLC
The 2-40 committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machine. Embedded Components CRANE CRANE Embedded Passives Committee Meeting (By Invitation) Tuesday, September 22 Jason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLC
Status on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles. The emulator project will also be presented to encourage candidate designs for embedded passive integration.
D-51
Embedded Devices Design Subcommittee Tuesday, September 22 Gary Ferrari, FTG Circuits
This subcommittee is developing a working draft of IPC-2227. D-52 Embedded Component Materials Subcommittee Wednesday, September 23 David McGregor, E.I. du Pont de Nemours and Co.
This subcommittee is pursuing Amendment 1 to IPC-4821. D-54 Embedded Devices Test Methods Subcommittee Wednesday, September 23 Jan Obrzut, Ph.D., National Institute of Standards and Technology
This subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices. Environment, Health & Safety (EHS) 4-33 Halogen-Free Materials Subcommittee Tuesday, September 22 Douglas Sober, Kaneka Texas Corporation
This subcommittee will consider new comments for revision B of the white paper/technical report on low-halogen base materials. 4-33a Low-Halogen Electronics Standard Task Group Monday, September 21 Scott O’Connell, Dell; Stephen Tisdale, Intel Corp.
This task group will review the draft standard on the definition of low-halogen electronics, including printed circuit boards, components, electronics assemblies, cables and mechanical plastics. 4-34b Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group Wednesday, September 23 Jasbir Bath, Bath Technical Consultancy; Andrew Ganster, NSWC Crane; Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc.
This combined working group of IPC and JEDEC will review IPC/JEDEC J-STD-609.
Due to frequent schedule changes, dates are subject to change. Visit www.IPCMidwestShow.org/committees for the most current committee schedule and meeting times, and be sure to pick up a Show Directory on-site.
www.IPCMidwestShow.org
13
STANDARDS DEVELOPMENT MEETINGS Fabrication Processes 4-14 Plating Processes Subcommittee
D-15
The subcommittee is continuing its work on IPC-4555. In addition, the successful ballot and release of IPC-4553A will be celebrated. Flexible Circuits D-11 Flexible Circuits Design Subcommittee
This subcommittee provides test methods required by other subcommittees within the D-10 Committee. The test method on service temperature for flexible base materials will be addressed. High Speed/High Frequency Interconnections D-20 High Speed/High Frequency Committee
Wednesday, September 23 George Milad, UIC/Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc.
Wednesday, September 23 William Ortloff, Raytheon Company
This subcommittee is initiating revision C of IPC-2223 that will include a new addendum providing design guidance/tutorials for the board designer. D-12 Flexible Circuits Specifications Subcommittee Tuesday, September 22 Nick Koop, Minco Products Inc.
This subcommittee is developing HDI acceptance criteria for IPC-6013. D-12a UL 796F and UL 746F Task Group Thursday, September 24 Duane Mahnke, Mahnke Consulting
This task group works actively with Underwriters Laboratories Inc. on two associated documents, UL 796F and UL 746F, and the proper industry STP/IAG representatives for this area. D-13 Flexible Circuits Base Materials Subcommittee Wednesday, September 23 Clark Webster, ALL Flex Inc.
This subcommittee maintains IPC-4202, IPC-4203 and IPC-4204. All three documents are being revised and balloting will begin this spring. D-13b Covercoat Materials Task Group Wednesday, September 23 Steve Musante, Raytheon Missile Systems
This new task group will pursue the addition of one (or more) specification sheet(s) to IPC-4203. The new specification sheets will address various liquid applied covercoat materials that are subsequently cured through photo and/or thermal exposure and need to be fully characterized as both flame resistant and electrically insulating cover materials.
14
Flexible Circuits Test Methods Subcommittee
Tuesday, September 22 Rocky Hilburn, Laminating Company of America; Duane Mahnke, Mahnke Consulting
Monday, September 21 Edward Sandor, Taconic Advanced Dielectric Division
This is a planning meeting for the task group and subcommittee leaders of the D-20 Committee. D-22 High Speed/High Frequency Board Performance Subcommittee Monday, September 21 Mahendra Gandhi, Northrop Grumman Space Technology
This subcommittee is working on revision B to IPC-6018. D-23 High Speed/High Frequency Base Materials Subcommittee Wednesday, September 23 Edward Sandor, Taconic Advanced Dielectric Division
This task group is developing revision A to the IPC-4103 materials specification for high frequency laminates. D-24 High Speed/High Frequency Test Methods Subcommittee Tuesday, September 22 Don DeGroot, CCNi
This oversight subcommittee will review current test method projects to evaluate high speed/high frequency boards and materials. D-24c High Frequency Test Methods Task Group: Frequency-Domain Methods Tuesday, September 22 Mike Janezic, National Institute of Standards and Technology
This task group will determine the needs of the microelectronics industry for high frequency dielectric test methods.
STANDARDS DEVELOPMENT MEETINGS Management 8-40 Roadmap Steering and Planning Committee
Saturday, September 19 Jack Fisher, Interconnect Technology Analysis, Inc.
The committee will discuss the strategy for the 2010-2011 IPC Technology Roadmap. 8-40/ Joint Meeting — Roadmap Steering V-JNAC and Planning Committee and JISSO North America Council (JNAC)
Sunday, September 20 Jack Fisher, Interconnect Technology Analysis, Inc.; Dennis Fritz, MacDermid, Inc.
During this joint meeting, JNAC and the IPC Roadmap Steering and Planning Committee will coordinate activities. JNAC provides input to the Jisso International Council (JIC) on technology, materials, testing and standards through this cooperative effort. CCC Committee Chairman Council (By Invitation) Sunday, September 20 Peter Bigelow, IMI Inc.
This meeting is for general committee updates and discussion of IPC technical programs. Printed Board Design Technology 1-10c Test Coupon and Artwork Generation Task Group Monday, September 21 Timothy Estes, Conductor Analysis Technologies, Inc.
This task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. With the completion of the A/B-R coupon, the task group is evaluating needs for other coupon designs such as peel strength and interconnect resistance. Process Control 7-23 Process Effects Handbook Subcommittee Wednesday, September 23 Dennis Fritz, MacDermid, Inc.
This subcommittee is continuing with revision B to IPC-PE-740.
Product Assurance 7-30 Product Assurance Committee (By Invitation) Monday, September 21 Mel Parrish, STI Electronics, Inc.
This is a planning meeting for all Product Assurance Committee task group and subcommittee leaders. 7-31a/ Joint Meeting — IPC-A-600 and D-33a Rigid Printed Board Performance Specifications Task Groups Sunday, September 20 Mark Buechner, BAE Systems
These task groups are finalizing IPC-6012C and IPC-A-600H for publication. 7-31bt IPC-A-610 Certification Technical Committee Wednesday, September 23 Mary Muller, Crane Aerospace & Electronics
This working group provides technical guidance to the developer of the certification program for IPC-A-610 and will be developing an outline to update the training program for Revision E. 7-31fs Space Electronic Assemblies IPC/ WHMA-A-620 Addendum Task Group Tuesday, September 22 Garry McGuire, NASA Marshall Space Flight Center
This task group will celebrate publication of an addendum that provides exception requirements to IPC/WHMA-A-620. 7-31ft A-620 Technical Training Task Group Wednesday, September 23 Debbie Wade, Advanced Rework Technology-A.R.T
This meeting will focus on training for A-620AS Space Electronics Hardware Addendum. 7-31j Box Build Task Group
Monday, September 21 Richard Rumus, Honeywell; Eddy Hofer, Rockwell Collins
This task group will look at the first draft of a new standard in development, IPC-A-630, Requirements and Acceptance for Box Build Assemblies, High Performance Applications.
Due to frequent schedule changes, dates are subject to change. Visit www.IPCMidwestShow.org/committees for the most current committee schedule and meeting times, and be sure to pick up a Show Directory on-site.
www.IPCMidwestShow.org
15
STANDARDS DEVELOPMENT MEETINGS Product Reliability 6-10c Plated-Through Via (PTV) ReliabilityAccelerated Test Methods Task Group
D-36
This task group is establishing a guideline for the attributes affecting lead-free assembly process survivability. 6-10d SMT Attachment-Reliability Test Methods Task Group
This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. The group also maintains a family of process capability panel designs and standards for use by both subscribers and suppliers. Terms and Definitions 2-30 Terms and Definitions Committee
Tuesday, September 22 Dewey Whittaker, Honeywell Inc.
Tuesday, September 22 Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
This task group is reviewing the IPC/JEDEC-9707 spherical bend test method for determining printed board assembly strain limits as well as a revision to IPC-9701A for SAC405/305 solder joint reliability estimation. Rigid Printed Boards 7-31at IPC-A-600/IPC-6012 Technical Training Committee Tuesday, September 22 Debora Obitz, Trace Laboratories-East
This will be the initial planning meeting to outline a major update to the IPC-A-600 training program. D-31b IPC-2221 Task Group Tuesday, September 22 Gary Ferrari, FTG Circuits
This task group is developing revision B of IPC-2221. D-32 Thermal Stress Test Methodology Subcommittee Tuesday, September 22 Michael Freda, Sun Microsystems Inc.
This subcommittee has developed IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. The subcommittee is evaluating a follow-on electrical test method. D-35 Printed Board Storage and Handling Subcommittee Wednesday, September 23 Tom Kemp, Rockwell Collins
This task group is completing the forthcoming IPC-1601.
FREE EVENTS o o o o 16
Exhibit Hall Opening Session Show Floor Welcome Reception Free Forums
Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee Monday, September 21 Gary Long, Intel Corp.
Sunday, September 20 Michael Green, Lockheed Martin Space Systems Company; Vicka White, Honeywell Air Transport Systems
This committee maintains standard industry definitions for the electronic interconnection industry within IPC-T-50. The committee will provide an overview of terms currently being addressed. Testing 7-11 Test Methods Subcommittee Wednesday, September 23 Joe Russeau, Precision Analytical Laboratory, Inc.
This subcommittee maintains and updates IPCTM-650. It is undergoing an extensive review of IPC test methods older than five years for reaffirmation, revision or cancellation. UL-IAG Industry Advisory Group Meeting for UL
Thursday, September 24 Jeff Brandt, Underwriters Laboratories Inc.
To resolve questions about nontechnical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronics interconnection industry, the re-establishment of an IAG for interpretation of the UL 746E, UL 796, UL 746F and UL 796F has begun. This group of industry and UL personnel will address items not appropriate for the UL-STP meetings, which cover technical modifications to the four UL documents above.
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