2009 IPC Midwest Show Directory by IPC

Show Directory

Enhance your knowledge and network with industry leaders.

PRINTED BOARDS • ELECTRONICS ASSEMBLY • DESIGN • TEST Sunday–Thursday, September 20–24, 2009 Renaissance Schaumburg Hotel & Convention Center, Schaumburg, Ill. www.IPCMidwestShow.org 877-472-4724 (U.S./Canada)

Association Connecting Electronics Industries

Put IPC Membership to Work for YOU Save 25% on first year dues when you join during the show! Visit IPC booth #331 for more details! Join more than 2,700 companies worldwide that enjoy access to unparalleled opportunities to participate in and shape the direction of our collective future.

Enhance Your Knowledge • Gain FREE access to membersonly online resources, including a searchable archive of articles on the latest technical issues and industry/ market trends. • Receive a copy of every new IPC standard, by request, within 90 days of its release. • Access market research studies and learn about the latest trends in markets and technology. • Get special member rates on IPC workshops, educational conferences and IPC documents. • Stay abreast of global environmental directives, legislation and regulations that beget critical technology changes and supply chain challenges.

Get Connected

Shape the Industry

• Put the resources of a global industry behind your most challenging technical and business issues.

• Become part of a worldwide network of professionals who are actively involved in shaping the future of our industry.

• Participate in problem-solving exchanges on a range of industryspecific issues and concerns through IPC’s technical e-mail forums.

• Participate in developing industry standards your company, customers, competitors and suppliers use.

• Get priority responses to your technical questions from IPC’s technical staff. • Network with industry professionals at premier industry events such as the international IPC APEX EXPO and the regional IPC Midwest Conference & Exhibition.

• Get involved in PCB and EMS management councils to develop new programs to support of the industry. • Protect your company’s interests by participating in IPC-organized environmental and public policy activities.

To learn how IPC membership can enhance your company’s operations, stop by the IPC booth #331 or visit www.ipc.org.

Serving the printed board and electronics assembly industries, their customers and suppliers

Table of Contents Show Schedule Convention Center Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . 2 Show Schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Free Forums IPC Technology Roadmap . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Acceptability, Reliability and Failure Analysis . . . . . . . . . . 13

General Information Hotel and Business Center . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Registration Hours and Policies . . . . . . . . . . . . . . . . . . . . . . 8 Schaumburg Area Information . . . . . . . . . . . . . . . . . . . . . . 10

Technical Program Technical Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Standards Development Meetings . . . . . . . . . . . . . . . . . . 16 Professional Development Courses . . . . . . . . . . . . . . . . . . 23

Special Events A-Line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Free Opening Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On the Show Floor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Free First-Timers’ Welcome Breakfast . . . . . . . . . . . . . . . . Luncheons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Exhibition Exhibit Hall Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 New Products Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Index of Exhibitors by Category . . . . . . . . . . . . . . . . . . . . . 27 Exhibitor Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

10 12 12 12 12

Follow us on Twitter and get up-to-the-minute show announcements and daily bookstore discounts. Find us on www.IPCMidwestShow.org/twitter.

Standards Development Meetings

Technical Conference Sessions

In Cooperation With:

Professional Development Courses

Exhibits Open

• CircuiTree

September 20–24. . . . . . . . . . . 8:00 am–5:00 pm September 23. . . . . . . . . . . . 10:00 am–12:00 pm • Advanced Packaging . . . . . . . . . . . . . . . . . . . . . . . . . 1:30 am–4:45 am • Circuitnet September 24. . . . . . . . . . . . . 9:00 am–12:00 pm Wednesday, September 23. . . 10:00 am–6:00 pm • EMS007 . . . . . . . . . . . . . . . . . . . . . . . . . 2:00 pm–5:00 pm Thursday, September 24. . . . . 10:00 am–4:00 pm • EMSNow

• Global SMT & Packaging • PCB007 • SMT • U.S. Tech

• EMT Worldwide IPC is a global, nonprofit trade association dedicated to furthering the competitive excellence and financial success of its members, who are participants in the electronics industry. In pursuit of these objectives, IPC will devote resources to management improvement and technology enhancement programs, the creation of relevant standards, protection of the environment and pertinent government relations. IPC encourages the active participation of all its members in these activities and commits to full cooperation with all related organizations.

www.IPCMidwestShow.org

Convention Center Floor Plan

event registration

2 |

www.IPCMidwestShow.org

restrooms first aid

Show Schedule

Event Title Friday, September 18, 2009

Code

Time

Chair/Moderator

IPC-A-610 Task Group 7-31b 8:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army Constantino Gonzalez, ACME Training & Consulting

Room

Page

Off-Site

Nirvana C

Saturday, September 19, 2009 IPC-A-610 Task Group

7-31b

8:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army

Constantino Gonzalez, ACME Training & Consulting

Sunday, September 20 Attendee Registration

7:00 am–5:00 pm

Foyer

Terms and Definitions Committee 2-30 8:00 am–9:00 am Michael Green, Lockheed Martin Space Systems Company

Utopia A

J-STD-001 Task Group 5-22a 8:00 am–2:30 pm Teresa Rowe, AAI Corporation Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Group

Schaumburg 16 GH

7-31a/ 9:00 am–3:00 pm Mark Buechner, BAE Systems; D-33a Randy Reed, Merix Corp

Utopia A

Committee Chairman Council (By Invitation) CCC 3:00 pm–4:30 pm Peter Bigelow, IMI Inc.

Schaumburg 20 GH

Assembly and Joining Processes Planning 5-20 4:30 pm–6:00 pm Leo Lambert, EPTAC Corporation Committee (By Invitation)

Schaumburg GH

Committee Chairman’s Reception 6:00 pm–7:00 pm

Sam&Harry’s Terrace*

Monday, September 21 Attendee Registration

7:00 am–5:00 pm

Foyer

Exhibitor Registration

10:00 am–5:00 pm

Foyer

IPC Cleaning and Coating Committee

5-30

8:00 am–9:00 am Douglas Pauls, Rockwell Collins

Innovation

Product Assurance Committee (By Invitation)

7-30

8:00 am–9:00 am Mel Parrish, STI Electronics, Inc.

Nirvana C

Thermal Stress Test Methodology Subcommittee

D-32

8:00 am–10:00 am Michael Freda, Sun Microsystems Inc.

Utopia B

Electronic Documentation Technology Committee

2-40

8:00 am–12:00 pm Bryan Truax, CADParts & Consulting, LLC

Epiphany

Laminate/Prepreg Materials Subcommittee

3-11

8:00 am–12:00 pm Tony Senese, Panasonic Electric Division

Utopia A

Component and Wire Solderability Specification Task Group

5-23b

8:00 am–12:00 pm David Hillman, Rockwell Collins

Euphoria

EMS Program Manager Training and Certification Program — Introduction to Program Management

8:00 am–5:00 pm Susan Mucha, Powell-Mucha Consulting

Serenity

SMT Processes and Six Sigma Green Belt

SMTA

8:00 am–5:00 pm

Perfection

Potting and Encapsulation Task Group

5-33f

9:00 am–10:00 am Douglas Pauls, Rockwell Collins

Innovation

Joint Meeting — J-STD-001 and IPC-A-610 5-22a/ 9:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army Nirvana C Task Groups 7-31b Constantino Gonzalez, ACME Training & Consulting; Teresa Rowe, AAI Corporation

High Speed/High Frequency Committee D-20 10:15 am–12:00 pm Edward Sandor, Taconic Advanced Dielectric Division

Connection

Utopia B

Nirvana AB

Utopia A

Printed Board Process Capability, Quality and Relative D-36 10:15 am–12:00 pm Gary Long, Intel Corp. Reliability Benchmark Test Subcommittee Committee Awards Luncheon Woven Glass Reinforcement Task Group

3-12d

12:00 pm–1:30 pm 1:30 pm–3:00 pm Patricia Goldman, Dielectric Solutions, LLC

Access the show schedule and a list of exhibitors from your mobile device at www.IPCMidwestShow.org/mobile. *Will be held indoors in the event of inclement weather. www.IPCMidwestShow.org

Show Schedule

Event Title

Code

Time

Chair/Moderator

Room

Page

Joint Meeting — Data Generation and Transfer 2-10/ 1:30 pm–5:00 pm Andrew Dugenske, Georgia Institute of Technology Epiphany Committee and Shop Floor Communication 2-13 Karen McConnell, Lockheed Martin, EPI Center Subcommittee

Low-Halogen Electronics Standard Task Group

4-33a

1:30 pm–5:00 pm Scott O’Connell, Dell; Stephen Tisdale, Intel Corp. Utopia CD

Printed Circuit Board Solderability Specifications 5-23a 1:30 pm–5:00 pm Gerard O’Brien, Solderability Testing and Task Group Solutions Inc.

Euphoria

SIR and Electrochemical Migration Task Group

Innovation

Imagination

High Speed/High Frequency Board D-22 1:30 pm–5:00 pm Mahendra Gandhi, Northrop Grumman Aerospace Connection Performance Subcommittee Systems

Base Materials Roundtable Task Group

5-32b

1:30 pm–5:00 pm Chris Mahanna, Robisan Laboratory Inc.

IPC-A-630 Box Build Task Group 7-31j 1:30 pm–5:00 pm Eddie Hofer, Rockwell Collins Richard Rumas, Honeywell Canada

3-12e

3:15 pm–5:00 pm Edward Kelley, Isola Group SARL

Utopia A

Tuesday, September 22 Attendee Registration

7:00 am–5:00 pm

Foyer

Exhibitor Registration

7:00 am–6:00 pm

Foyer

Show Sales Office

8:00 am–6:00 pm

Exhibit Hall

Corrosion of Metal Finishes Task Group

3-11g

8:00 am–10:00 am Beverley Christian, Ph.D., Research In Motion Ltd.

Utopia A

Metallic Foil Task Group

3-12a

8:00 am–10:00 am Rolland Savage, High Performance Copper Foil Inc.

Euphoria

Space Electronic Assemblies J-STD-001 5-22as 8:00 am–10:00 am Garry McGuire, NASA Marshall Space Addendum Task Group Flight Center

Imagination

Embedded Devices Design Subcommittee

D-51

8:00 am–10:00 am Gary Ferrari, FTG Circuits

Knowledge

Cleaning & Alternatives Subcommittee

5-31

8:00 am–12:00 pm Mike Bixenman, Kyzen Corporation

Connection

8:00 am–12:00 pm Susan Mucha, Powell-Mucha Consulting

Serenity

EMS Program Manager Training and Certification Program — Introduction to Program Management

Test Methods Subcommittee

7-11

8:00 am–12:00 pm Joe Russeau, Precision Analytical Laboratory, Inc.

Nirvana C

Materials Declaration Task Group

2-18b

8:00 am–5:00 pm Mark Frimann, Texas Instruments Inc.

Innovation

8:00 am–5:00 pm Mary Muller, Crane Aerospace & Electronics

Utopia D

8:00 am–5:00 pm

Perfection

Assembly and Joining Handbook Subcommittee SMT Processes and Six Sigma Green Belt

7-35 SMTA

Bottom Termination Components (BTCs) Task Group 5-21h 9:30 am–5:00 pm Ray Prasad, BeamWorks Inc. Vern Solberg, STC-Madison

Epiphany

Halogen-Free Materials Subcommittee

4-33

Utopia B

Flux Specifications Task Group

5-24a 10:15 am–12:00 pm Renee Michalkiewicz, Trace Laboratories–East

Utopia A

Plated-Through Via (PTV) Reliability — 6-10c 10:15 am–12:00 pm Randy Reed, Merix Corp. Accelerated Test Methods Task Group Dewey Whittaker, Honeywell Inc.

Utopia C

CRANE Embedded Passives Committee CRANE 10:15 am–12:00 pm Jason Ferguson, NSWC Crane Meeting (By Invitation) Richard Snogren, Bristlecone LLC

Euphoria

Knowledge

Space Electronic Assemblies IPC/WHMA-A-620 7-31fs 10:15 am–5:00 pm Garry McGuire, NASA Marshall Space Flight Ctr. Addendum Task Group

Imagination

Committee Awards Luncheon

Nirvana AB

Flexible Circuits Specifications Subcommittee

D-12

10:15 am–12:00 pm Douglas Sober, Kaneka Texas Corporation

10:15 am–12:00 pm Nick Koop, Minco Products Inc.

12:00 pm–1:30 pm

Solder Alloy Task Group

5-24c

1:30 pm–3:00 pm David Scheiner, Kester

Utopia A

Conductive Anodic Filament (CAF) Task Group

5-32e

1:30 pm–3:00 pm Karl Sauter, Sun Microsystems, Inc.

Utopia B

FF=Free Forum

4 |

| PD= Educational Course | S=Conference Session

www.IPCMidwestShow.org

Show Schedule

Event Title

Code

Time

Chair/Moderator

Room

Page

Knowledge

Utopia C

Connection

Flexible Circuits Test Methods Subcommittee D-15 1:30 pm–5:00 pm Rocky Hilburn, CAC, Inc. Duane Mahnke, Mahnke Consulting

Euphoria

IPC-2221/2222 Task Group

D-31b

1:30 pm–5:00 pm Gary Ferrari, FTG Circuits

Nirvana C

Underfill Adhesives for Flip Chip Applications Task Group

5-24f

3:15 pm–5:00 pm Brian Toleno, Ph.D., Henkel Corporation

Utopia A

Knowledge

High Speed/High Frequency Test Methods Subcommittee

D-24

1:30 pm–3:00 pm Don DeGroot, CCNi

SMT Attachment Reliability Test Methods Task Group

6-10d

1:30 pm–5:00 pm Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

IPC-A-600/IPC-6012 Technical Training Committee

7-31at

1:30 pm–5:00 pm Debora Obitz, Trace Laboratories–East

High Frequency Test Methods Task Group: D-24c 3:15 pm–5:00 pm Mike Janezic, National Institute of Standards Frequency-Domain Methods and Technology Committee Reception 5:00 pm–6:00 pm

Sam&Harry’s Terrace*

Wednesday, September 23 Speaker Ready Room

7:00 am–5:00 pm

Utopia C

Attendee Registration

7:00 am–6:00 pm

Foyer

Exhibitor Registration

8:00 am–5:00 pm

Foyer

Show Sales Office

8:00 am–6:30 pm

Exhibit Hall

First Timer’s Welcome Breakfast

7:30 am–8:15 am

Utopia A

SMT Processes and Six Sigma Green Belt

8:00 am–5:00 pm

Perfection

FREE! Opening Session: A Leaded Engineer in a Lead-Free World

8:30 am–9:30 am David Hillman, Rockwell Collins

Euphoria

Declaration Process Management Subcommittee

2-18

9:30 am–12:00 pm Eric Simmon, NIST

Epiphany

Solder Paste Task Group

5-24b

9:30 am–12:00 pm Brian Toleno, Ph.D., Henkel Corporation

Serenity

Imagination

SMTA

Conformal Coating Handbook Task Group 5-33c 9:30 am–12:00 pm Amy Hagnauer, Raytheon Company Jason Keeping, Celestica

A-620 Technical Training Task Group

7-31ft 9:30 am–12:00 pm Debbie Wade, Advanced Rework Technology-A.R.T Utopia D

Covercoat Materials Task Group

D-13b 9:30 am–12:00 pm Steve Musante, Raytheon Missile Systems

Connection

High Speed/High Frequency Base Materials D-23 9:30 am–12:00 pm Edward Sandor, Taconic Advanced Dielectric Div. Subcommittee

Prosperity

Printed Board Storage and Handling Subcommittee

D-35 9:30 am–12:00 pm C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Tom Kemp, Rockwell Collins

Nirvana C

Embedded Component Materials Subcommittee

D-52

9:30 am–12:00 pm David McGregor, E.I. du Pont de Nemours and Co. Innovation

Ribbon Cutting Ceremony

Ribbon 9:45 am–10:00 am

Exhibit Hall

Exhibit Hall Open

10:00 am–6:00 pm

Lead Free Model Cage Match

S01

10:00 am–12:00 pm Carol Handwerker, Ph.D., Purdue University

Euphoria

Strategies for Fighting Counterfeiting

S02

10:00 am–12:00 pm James Williams, Polyonics, Inc.

Utopia A

Challenges in Building a High Reliability Military PWB

S03

10:00 am–12:00 pm Vern Solberg, STC-Madison

Utopia B

Nirvana AB

Awards Luncheon

12:00 pm–1:30 pm

Exhibit Hall

Plating Processes Subcommittee 4-14 1:30 pm–3:00 pm George Milad, UIC/Uyemura International Corp. Nirvana C Gerard O’Brien, Solderability Testing and Solutions

J-STD-001 Training Task Group

5-22bt

1:30 pm–3:00 pm Teresa Rowe, AAI Corporation

Utopia D

Access the show schedule and a list of exhibitors from your mobile device at www.IPCMidwestShow.org/mobile. *Will be held indoors in the event of inclement weather. www.IPCMidwestShow.org

Show Schedule

Event Title

Code

Time

Chair/Moderator

Room

Page

Flexible Circuits Base Materials Subcommittee

D-13

1:30 pm–3:00 pm Clark Webster, ALL Flex Inc.

Connection

Embedded Devices Test Methods Subcommittee

D-54

1:30 pm–3:00 pm Jan Obrzut, Ph.D., NIST

Innovation

IPC Solder Products Value Council: Alloy Testing and Take Action Limits

S04

1:30 pm–3:00 pm Karl Seelig, AIM, Inc.

Euphoria

The Quality and Reliability View As Seen from the Assembly Line

S05

1:30 pm–3:00 pm Dieter Bergman, IPC

Utopia A

Printed Board Reliability Issues

S06

1:30 pm–3:00 pm Cheryl Tulkoff, DfR Solutions

Utopia B

Epiphany

Imagination

IPC-HDBK-620 Handbook Task Group 7-31h 1:30 pm–5:00 pm Randy McNutt, Northrop Grumman Corp. Brett Miller, USA Harness, Inc.

Serenity

Reliability and the Solder Interface

S07

3:15 pm–4:45 pm Werner Engelmaier, Engelmaier Associates, L.C.

Euphoria

Environmental Issues

S08

3:15 pm–4:45 pm Fern Abrams, IPC

Utopia A

High Frequency Printed Boards

S09

3:15 pm–4:45 pm Duane Mahnke, Mahnke Consulting

Utopia B

Process Effects Handbook Subcommittee

7-23

3:15 pm–5:00 pm Dennis Fritz, MacDermid, Inc.

Innovation

Marking, Symbols and Labels for Identification 4-34b 1:30 pm–5:00 pm Jasbir Bath, Bath Technical Consultancy of Assemblies, Components and Devices Task Group Jack McCullen, Intel Corporation Lee Wilmot, TTM Technologies, Inc. Joint Meeting — Ionic Conductivity and Bare Board Cleanliness Task Groups

5-32a/ 1:30 pm–5:00 pm Douglas Pauls, Rockwell Collins; 5-32c John Radman, Trace Laboratories East Denver

IPC-A-610 Certification Technical Committee

7-31bt

3:15 pm–5:00 pm Mary Muller, Crane Aerospace & Electronics

Utopia D

Flexible Circuits Design Subcommittee

D-11

3:15 pm–5:00 pm William Ortloff, Raytheon Company

Nirvana C

5:00 pm–6:00 pm

Exhibit Hall

Attendee Registration

7:00 am–5:00 pm

Foyer

Exhibitor Registration

9:00 am–3:00 pm

Foyer

Show Sales Office

9:00 am–5:00 pm

Exhibit Hall

Manufacturing Process Declaration Task Group

2-18a

8:00 am–12:00 pm Fritz Byle, Astronautics Corp. of America

Packaging Declarations Exploratory Meeting

2-18x

8:00 am–12:00 pm Michael Hutchings, Sun Microsystems

FREE! Show Floor Welcome Reception

Thursday, September 24

SMT Component Placement Equipment Subcommittee 5-41 8:00 am–12:00 pm Michael Cieslinski, Panasonic Factory Solutions Company of America

Perfection

Imagination

Connection

IPC EMS Program Manager Training and Certification Program — EMS II

8:00 am–5:00 pm Ray Prasad, BeamWorks Inc.

Serenity

EMS Program Manager Training and Certification Program — Leadership Training

8:00 am–5:00 pm Don Turner — Penn State Outreach Program

Prosperity

FREE! IPC Technology Roadmap FF01 8:30 am–10:00 am Dieter Bergman, IPC Euphoria Jack Fisher, InterconnectTechnology Analysis Joe Fjelstad, Verdant Electronics Dennis Fritz, MacDermid, Inc.

Stencil Printing Process for Solder Paste Application PD-01 9:00 am–12:00 pm S. Manian Ramkumar, Rochester Institute — An In-Depth Look of Technology

Utopia A

LGA and QFN Design, Assembly and Rework Guide

PD-03 9:00 am–12:00 pm Bob Willis, ASKBobWillis.com

Utopia B

Fundamentals of Solder Joint Reliability

PD-05 9:00 am–12:00 pm Werner Engelmaier, Engelmaier Associates, L.C.

Utopia C

DFM: When a Six Sigma Process Is Not Sufficient to Achieve a High Yielding Manufacturing Process

PD-07 9:00 am–12:00 pm Dale Lee, Plexus

Epiphany

FF=Free Forum

6 |

| PD= Educational Course | S=Conference Session

www.IPCMidwestShow.org

Show Schedule

Event Title

Code

Exhibit Hall Open Joint Meeting — UL/CSA and UL 796F and UL 746F Task Groups

Time

Chair/Moderator

10:00 am–4:00 pm

Room

Page Page

Exhibit Hall

3-11f/ 10:00 am–12:00 pm Jack Bramel, Jack Bramel & Associates D-12a Duane Mahnke, Mahnke Consulting

Utopia D

FREE! Cross-Sectional Preparation of FF 10:15 am–11:00 am Richard Wagner and Gabe Lucas, Buehler Ltd. Exhibit Hall Specialty and Problematic Components Booth 731

FREE! Advanced Applications of XRF for FF 11:00 am–11:45 am Paul Lomax, Fischer Technology Inc. Lead Detection on Electronic Assemblies

Exhibit Hall Booth 731

FREE! Are the Test Results in Your C of C Still FF 11:45 am–12:30 pm Debby Obitz, John Radman and Applicable to the Products You Are Buying? Renee Michalkiewicz, Trace Laboratories

Exhibit Hall Booth 731

FREE! Implementing the New IPC Thermal FF 12:30 pm–1:15 pm Chris Mahanna, Robisan Laboratory Stress, Convection Reflow Assembly Simulation Test Method, IPC-TM-650, Method 2.6.27

Exhibit Hall Booth 731

Joint Meeting — Roadmap Steering and Planning Committee and JISSO North America Council

8-40/ 1:00 pm–5:00 pm Jack Fisher, Interconnect Technology Analysis, Inc. Perfection JNAC Dennis Fritz, MacDermid, Inc.

FREE! Analytical Methods of Detecting Lead in FF 1:15 pm–2:00 pm Mike Fredrickson and Carmine Meola, Electronic Assemblies ACI Technologies Inc. Solder Products Value Council

SPVC

Exhibit Hall Booth 731

Imagination

FREE! Failures Resulting from Cleanliness: FF 2:00 pm–2:45 pm Joe Russeau, Precision Analytical What to Test? Laboratory, Inc.

Exhibit Hall Booth 731

FREE! Creep Corrosion — Immersion Silver FF 2:45 pm–3:30 pm Terry Munson, Foresite Corrosion Issues

Exhibit Hall Booth 731

Utopia A

Advanced Component Packages and Processes PD-04 2:00 pm–5:00 pm S. Manian Ramkumar, Rochester Institute of Technology

Utopia B

Final Finishes and Their Compatibility with Lead-Free Assembly

2:00 pm–5:00 pm Michael Carano, OMG Electronic Chemicals

Utopia C

Accelerated Thermal Cycling and Acceleration Factors PD-08 for Lead-Free Surface Mount Assemblies

2:00 pm–5:00 pm Jean-Paul Clech, Ph.D., EPSI

Epiphany

Industry Advisory Group Meeting for UL

2:00 pm–5:00 pm Jeff Brandt, Underwriters Laboratories Inc.

Utopia D

Connection

Troubleshooting Your PCB Assembly Yields — On-Site PD-02 or Offshore

PD-06

UL-IAG

1:30 pm–5:00 pm Karl Seelig, AIM, Inc.

2:00 pm–5:00 pm Bob Willis, ASKBobWillis.com

Friday, September 25 Certified Interconnect Designer (CID) Workshop

8:00 am–5:00 pm Dieter Bergman, IPC

IPC EMS Program Manager Training and Certification Program — EMS II

8:00 am–5:00 pm Ray Prasad, BeamWorks Inc.

Serenity

EMS Program Manager Training and Certification Program — Leadership Training

8:00 am–5:00 pm Don Turner — Penn State Outreach Program

Prosperity

EMS Program Manager Training and Certification Program — Exam

8:00 am–12:00 pm

Prosperity

Certified Interconnect Designer (CID) Workshop

8:00 am–5:00 pm Dieter Bergman, IPC

Serenity

Advanced Certified Interconnect Designer (CID+) Exam

8:00 am–12:00 pm Dieter Bergman, IPC

Serenity

Certified Interconnect Designer (CID) Exam

8:00 am–1:00 pm Dieter Bergman, IPC

Serenity

Saturday, September 26

Sunday, September 27

Access the show schedule and a list of exhibitors from your mobile device at www.IPCMidwestShow.org/mobile. www.IPCMidwestShow.org

Technical General Information Conference Photography and Videography Policy Still photography and video recording of any exhibit or function is prohibited within the exhibit hall, meeting rooms and lobbies. This applies to both exhibitors and attendees. Show Management, the official photographer and accredited members of the news media are exempt from this rule. Any photography during show hours must be ordered through CGPA Photography, the official photographer for the event. Exhibitors may take pictures of their own booth before and after show hours only. Photos taken by Show Management may be used in future promotional materials.

Event Policies Renaissance Schaumburg Hotel & Convention Center

Children under the age of 18 are allowed on the trade show floor only during exhibit hall hours.

Suitcasing

1551 Thoreau Drive Schaumburg, IL 60173 +1 847-303-4100 Parking is complimentary. The charge for valet parking is $14 per day.

Business Center

IPC does not permit solicitation by nonexhibiting companies. Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event (known as “suitcasing”) will be asked to leave.

Hospitality

A full-service business center is available in the hotel near the escalators on the first floor. The center is open 24 hours with keycard access. A technician will be on-site Monday through Friday between the hours of 7:00 am and 5:00 pm.

Registration Hours Sunday, September 20 . . . . . . . . . . . . . . . . . . . . . . 7:00 am–5:00 pm Monday, September 21 . . . . . . . . . . . . . . . . . . . . . 7:00 am–5:00 pm Tuesday, September 22 . . . . . . . . . . . . . . . . . . . . . 7:00 am–5:00 pm Wednesday, September 23 . . . . . . . . . . . . . . . . . . 7:00 am–6:00 pm Thursday, September 24 . . . . . . . . . . . . . . . . . . . . 7:00 am–4:00 pm

Speaker Ready Room

Utopia D

Wednesday, September 23 . . . . . . . . . . . . . . . . . . 7:30 am–5:00 pm

For more than 50 years, IPC has been consistent in its policy requesting that no one conduct or sponsor hospitality suites or functions at IPC events in order to preserve the focus on education, technology and standards development. Therefore, any function that is not part of the “official program” is prohibited during event hours. For details related to event policies, visit www.IPCMidwestShow.org/policies.

Thanks to Our Sponsors!

Conference Notepad Sponsor

Exhibit Hall Hours Wednesday, September 23. . . . . . . . . . . . . . . . . . 10:00 am–6:00 pm Thursday, September 24. . . . . . . . . . . . . . . . . . . . 10:00 am–4:00 pm

Press Office Wednesday, September 23. . . . . . . . . . . . . . . . . . . 8:00 am–5:00 pm Thursday, September 24. . . . . . . . . . . . . . . . . . . . . 8:00 am–5:00 pm

First Aid is located by Adventure Hall. Follow us on Twitter and get up-to-theminute show announcements and daily bookstore discounts. Find us on www.IPCMidwestShow.org/twitter.

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Badge Lanyard Sponsor

General Information Schaumburg Area Information

Special Events IPC A-Line

Taxi Call for a taxi through American Taxi at +1 847-253-4411.

FREE Trolley The Trolley offers free transportation with pickup directly in front of the Renaissance Schaumburg Hotel to seven local destinations: • IKEA • Roosevelt University • Woodfield Village Green (shopping center) • Costco • Woodfield Mall (two stops) • Streets of Woodfield (shopping center) •Pace Northwest Transportation Center. Trolley service is available every 30 minutes, Friday–Sunday.

Trolley Hours of Operation Friday. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12:00 pm–9:00 pm Saturday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10:00 am–9:00 pm Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11:00 am–6:00 pm

PACE Dial-a-Ride Transportation (DART) As an alternative to the Trolley (and for use on weekdays), the Village of Schaumburg sponsors the PACE Dial-a-Ride Transportation Service throughout the operating area of the Trolley. One-way rates are approximately $1.60 (subject to change). To schedule a ride, call +1 847-352-8097. Advance reservation of 90 minutes is required.

PACE DART Hours of Operations Monday–Friday. . . . . . . . . . . . . . . . . . . . . . . . . . 6:00 am–9:30 pm Saturday. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9:00 am–6:00 pm For more information about things to do and see while in Schaumburg (and valuable coupons!), visit www.chicagonorthwest.com. Streets of Woodfield Photo credit: Pete Hruda

Explore Chicago! Use the RTA (Regional Transportation Authority) Transportation and Itinerary Scheduler to make the most of your visit to the Chicago Metropolitan area. Visit www.GoRoo.com.

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Check out the A-Line in the Exhibit Hall and see assembly in action! Follow a product from screen printing to component mounting (through hole and surface mount), and then through reflow — all while learning about the processes, equipment (and end-item cleaning) that were used to manufacture the assembly. At the end of the line, you’ll get a finished assembly thanks to our participating companies:

Special Events FREE Opening Session: A Leaded Engineer in a Lead-Free World

Euphoria

Wednesday, September 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8:30 am–9:30 am Moderator: Dave Hillman, Rockwell Collins Panelists: Linda Woody, Lockheed Martin Missile & Fire Control Carol Handwerker, Sc.D., Purdue University Stephan Meschter, Ph.D., BAE Systems Platform Solutions Mark Fulcher, Continental AG Lead-free assembly is here and growing in size and scope in many, but not necessarily all, product areas. Even with RoHS, there are products that are exempt from lead-free use. What is the view from these last bastions of tin-lead? How do designers and component and manufacturing engineers deal with a world that is becoming lead free while they’re still operating in leaded mode? Our panel of experts will fill you in on how they and their companies are coping with manufacturing RoHS-exempt product in a world where lead free is becoming the norm.

On the Show Floor IPC Bookstore

Booth # 331

Informational resources to enhance the work you do, help train your staff and support your company’s strategic planning efforts are waiting for you in the IPC bookstore on the show floor. • Browse industry standards on design, board fabrication and assembly. • Check out IPC training and certification programs. • Review IPC’s catalog of multimedia training resources, including DVDs, interactive CD-ROMs, online video resources, training and reference guides, wall posters and image archives. • Learn about IPC’s management programs, market research reports and technology roadmaps. Member prices will be extended to all attendees on-site, even if you aren’t one! And, save 25% on all IPC training DVDs … any quantity … any IPC title … only during show hours. While you’re at the bookstore, pick up a new IPC publications catalog and a free standards development CD.

Free Internet Lounge We know you’re invaluable to your office, so go ahead and catch up with your office. Convenient, FREE access to the Internet will be available in the exhibit hall to help your show experience go smoothly.

FREE First-Timers’ Welcome Breakfast

Wednesday, September 23. . . . . . . . . . . . . . . . . . . 7:30 am–8:15 am Wake up to breakfast replete with networking opportunities and information to make the most of your visit to the show. Find out how IPC resources and involvement in IPC can boost your career and benefit your company.

Luncheons (Registration required) Nirvana AB Monday, September 21. . . . . . . . . . . . . . . . . . . . . 12:00 pm–1:30 pm Tuesday, September 22. . . . . . . . . . . . . . . . . . . . . 12:00 pm–1:30 pm Wednesday, September 23. . . . . . . . . . . . . . . . . . 12:00 pm–1:30 pm Join your industry colleagues for lunch and make new friends and business contacts. Luncheons on Monday and Tuesday will recognize committee members and leaders with special recognition, committee leadership and distinguished committee service awards. On Wednesday, IPC will present the coveted IPC Presidents Award to George Milad, Uyemura International Corp., for his long-term contributions to IPC. In addition, Endicott Interconnect Technologies and Lockheed Martin will be recognized for 50 years of continuous membership.

Prefer Wi-Fi access? Contact Swank AV for service at the IPC registration desk. $10/day or $20 for 2 or more days.

Show Floor Reception Wednesday, September 23. . . . . . . . . . . . . . . . . . . . . . 5:00 pm–6:00 pm Enjoy a casual stroll through the exhibit floor and get familiar with the companies, products and services that can help you with your work. Celebrate friendships, new and old, and enjoy the company of colleagues that keep our industry vital.

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Utopia A

Free Forums IPC Technology Roadmap Free Forum

Euphoria Thursday, September 24 8:30 am–10:00 am Moderator: Jack Fisher, Interconnect Technology Analysis, Inc. Panelists: Dieter Bergman, IPC, Joe Fjelstad, Verdant Electronics, Denny Fritz, MacDermid, Inc. Learn how you can put this critical tool for strategic planning to work for your company. The IPC International Technology Roadmap provides vision and direction for companies in the electronics manufacturing industry. It encompasses the future supply chain infrastructure needed for single chip and multichip packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points, and even includes a technical driver software tool so long-range planners can compare their current offerings with the technology needs of tomorrow.

Acceptability, Reliability and Failure Analysis Free Forums Thursday, September 24

On the Show Floor Booth 731 10:15 am-3:30 pm

After a product has been successfully built, delivered to the customer, and put in the field, something really bad can happen — it can come back. Failure analysis has always been on the final frontier of electronics assembly, but at IPC Midwest, we’re bringing it to the front of the line. Learn the intricacies of ensuring reliability throughout the lifecycle of electronic products and systems as the world’s foremost failure analysts present technical case studies and provide how-to guidance: 10:15 am Cross-Sectional Preparation of Specialty and

Problematic Components

Richard Wagner and Gabe Lucas, Buehler Ltd. Explore cross-sectioning techniques for identification of failure sites and verification of failure mechanisms through actual case studies. 11:00 am Advanced Applications of XRF for Lead Detection on

Electronic Assemblies

Paul Lomax, Fischer Technology Inc. RoHS regulations have forced component suppliers to provide components with many different solder finishes. Review a new technique for reliably identifying unknown samples of material for the presence of lead utilizing XRF instrumentation.

11:45 am Are the Test Results in Your C of C Still Applicable to

the Products You Are Buying?

Debby Obitz, John Radman and Renee Michalkiewicz, Trace Laboratories What happens when materials tested don’t meet the requirements of the specification that the Certificate of Compliance (C of C) states have been met? Learn which material purchases are the largest risks for the OEM and determine what questions need to be asked when receiving that C of C. 12:30 pm Implementing the New IPC Thermal Stress,

Convection Reflow Assembly Simulation Test Method, IPC-TM-650, Method 2.6.27

Chris Mahanna, Robisan Laboratory Get a handle on the implementation, qualification and ongoing verification of IPC’s new industry test method that simulates convection reflow rather than traditional wave soldering 1:15 pm Analytical Methods of Detecting Lead in Electronic

Assemblies

Mike Fredrickson and Carmine Meola, ACI Technologies Inc. Understand recent advances in nondestructive methods of quantifying lead in electronic products through spectroscopy, fluorescence and other elemental analysis. 2:00 pm F ailures Resulting from Cleanliness: What to Test? Joe Russeau, Precision Analytical Laboratory, Inc. Identify how failures resulting from cleanliness can be among the most difficult to diagnose, and address the disconnect between understanding what causes a fault and identifying the origin of the residue(s) that played a role in the fault. 2:45 pm C reep Corrosion — Immersion Silver Corrosion Issues Terry Munson, Foresite Immersion silver has emerged as a cost effective replacement for HASL surface finishes with long shelf life protection, but its exposure to sulfur rich environments with moderate amounts of humidity can lead to a very distinct chemical reaction called “Creep Corrosion.” See how cleaning to remove corrosion and other contaminates prior to conformal coat applications is proving to be very effective.

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Technical Conference Lead Free Technologies S01 Lead Free Model Cage Match S04 IPC Solder Products Value Council: Alloy Testing and Take Action Limits S07 Reliability and the Solder Interface

PCB Fabrication S03 Challenges in Building a High Reliability Military PWB

FREE! Opening Session: A Leaded Engineer in a Lead Free World Wednesday, September 23 David Hillman, Rockwell Collins

Euphoria 8:30 am–9:30 am

Lead-free assembly is here and growing in size and scope in many, but not necessarily all product areas. Even with RoHS, there are products that are exempt from lead-free use. What is the view from these last bastions of tin-lead? How do designers and component and manufacturing engineers deal with a world that is becoming lead free while they’re still operating in leaded mode? Our panel of experts will fill you in on how they and their companies are coping with manufacturing RoHS-exempt product in a world where lead free is becoming the norm.

S06 Printed Board Reliability Issues

Take advantage of the Midwest’s premier technical conference to build your knowledge base, network with peers and stimulate ideas for new ways to approach your challenges. Registration is required.

S09 High Frequency Printed Boards

S01 Lead Free Model Cage Match

Assembly Processing S05 The Quality and Reliability View As Seen From the Assembly Line

Supply Chain / Business Issues S02 Strategies for Fighting Counterfeiting

Environmental S08 Environmental Issues

Quality and Reliability S01 Lead Free Model Cage Match S03 Challenges in Building a High Reliability Military PWB S05 The Quality and Reliability View As Seen From the Assembly Line S06 Printed Board Reliability Issues S07 Reliability and the Solder Interface

Wednesday, September 23 Carol Handwerker, Ph.D., Purdue University

Euphoria

10:00 am–12:00 pm

Tin-lead solder is a well understood system with more than thirty years of reliability models development behind it. Lead-free solders are not so well understood. There have been attempts to develop models, but how successful have they been? Join us for some heated debate on what works and what doesn’t in lead-free systems. • Solder Creep-Fatigue Model Parameters for SAC and SnAg Lead-Free Solder Joint Reliability Estimation Werner Engelmaier, Engelmaier Associates, L.C. • Constitutive and Failure Behavior of SnAgCu Solder Joints Ganesh Subbaraya, Purdue University • Filling in the Gaps in Lead-Free Reliability Modeling and Testing Jean-Paul Clech, Ph.D., EPSI

S02 Strategies for Fighting Counterfeiting Wednesday, September 23 James Williams, Polyonics, Inc.

Utopia A

10:00 am–12:00 pm

Counterfeiting of components has become a serious issue. Learn how to fight counterfeiting from our distinguished panelists. Join us for a timely discussion of what to do about a very serious problem. • Debra Eggeman, IDEA • Richard Stanton, Symetrics Industries • Dennis Fritz, MacDermid, Inc.

S03 Challenges in Building a High Reliability Military PWB Wednesday, September 23 Vern Solberg, STC-Madison

Utopia B

10:00 am–12:00 pm

Reliability in mission-critical systems is a matter of life and death. This first of two sessions on reliability, will dissect the critical components of reliability for the printed board. If you are concerned about board reliability in the harsher manufacturing environments of lead free, this session is for you. • Impact of Converting Flex Circuits from HASL to RoHS-Compliant Surface Finishes Al Wasserzug, Vulcan Flex Circuit Corporation • Design Considerations for High Reliability PCB Raj Kumar, Dynamic Details, Inc. • Lead-Free Reflow, PCB Degradation and the Influence of Moisture Absorption Cheryl Tulkoff, DfR Solutions

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Standards Technical Development Conference Meetings S04 IPC Solder Products Value Council: Alloy Testing and Take Action Limits Wednesday, September 23 Karl Seelig, AIM, Inc.

Euphoria

1:30 pm–3:00 pm

S08 Environmental Issues Wednesday, September 23 Fern Abrams, IPC

Utopia A

3:15 pm–4:45 pm

This session highlights the IPC Solder Products Value Council’s latest work on take action limits (TAL) for lead-free solder pot contamination and in developing industry consensus on test methods for lead-free alloy comparison. • Proposed Standardization of Lead-Free Alloy Testing Karl Seelig, AIM, Inc. • Take Action Limits for SAC 305 Lead-Free Automated Soldering Processes Howard Stevens, Metallic Resources Inc. • Vibration and Mechanical Shock Testing Thomas Woodrow, Ph.D., The Boeing Company

Keeping tabs on ever-changing environmental regulations and customer product requirements is a major effort for the entire electronic supply chain. This session will review the growing number of worldwide regulations restricting the use of substances in products, and how standards making organizations are working to develop supply chain compliance tools, such as materials declaration standards. • REACH, RoHS, TSCA — What’s Next? John Ciba, Brady Corporation • International Environmental Standards for the Electronics Industry Walter Jager, Intertek • Materials Declaration: Practical Tips for Cutting Through the Paperwork N. Nagaraj, Papros Inc.

S05 The Quality and Reliability View As Seen From the Assembly Line

S09 High Frequency Printed Boards

Wednesday, September 23 Dieter Bergman, IPC

Utopia A

1:30 pm–3:00 pm

What are the defining quality and reliability issues at manufacturing and test? Our speakers will guide you through the roadblocks and hurdles they have seen in their years of striving to keep the flag of quality and reliability flying over the manufacturing line. • Implementing Quality and Reliability on the Assembly Line David Bergman, IPC • High Performance Work Teams in EMS: The Critical Difference Leo Reynolds, Reynolds Consulting • Manufacturing Quality Issues from the EMS Perspective Bill Barthel, Plexus Corp.

S06 Printed Board Reliability Issues Wednesday, September 23 Cheryl Tulkoff, DfR Solutions

Utopia B

1:30 pm–3:00 pm

In our second session on board reliability, we expand on the issues for via reliability and the transition of telecom products into the era of lead free. Join us for the latest information. • Microvia Reliability Failure Modes Paul Reid, PWB Interconnect Solutions Inc. • Bare Board Material Performance After Lead-Free Reflow Ted Lach, Alcatel-Lucent • Water Vapor Uptake and Release in Printed Boards Joseph Kane, BAE Systems Platform Solutions

S07 Reliability and the Solder Interface

Euphoria

Wednesday, September 23 3:15 pm–4:45 pm Werner Engelmaier, Engelmaier Associates, L.C. In this session, three speakers will guide you through some of the critical issues that influence the reliability of your solder joints. • Why Electroless Palladium? Study on Impact of Electroless Palladium on Electroless Nickel Deposits Eric Stafstrom, Technic, Inc. • A Study of Solder Optimization Development for Portable Electronic Devices Lee Hyun-Kyu, DUKSAN HI-METAL CO., LTD • The Role of the Interfacial Intermetallic in Lead-free Solders Keith Howell, Nihon Superior USA

Wednesday, September 23 Duane Mahnke, Mahnke Consulting

Utopia B

3:15 pm–4:45 pm

This session takes you from the board surface to the base material and into the fiber weave to do a complete look at what makes a high frequency board tick. Join us for a session of insight and innovation. • High Frequency Materials Used in the PCB Industry John Coonrod, Rogers Corporation • A Closer Look at Why Cleaning Prior to Conformal Coating is Key in Aspects of Climatic Reliability Jigar Patel, ZESTRON America • Opening Eyes on Fiber Weave and CAF John Kuhn, Dielectric Solutions, LLC

Keep the Learning Going! We hope to see you at these upcoming 2009 events: October 21–22 IPC Electronics Industry Executive Summit Scottsdale, Ariz. November 9 “It’s Not Easy Being Green:” Complying with Changing Global Environmental Laws Conference Irvine, Calif. November 10 IPC Materials Conference: Engineering for Compliance Irvine, Calif. November 17-18 LEAN for Electronics Engineers Conference: Taking LEAN from the Executive Suite to the Floor Phoenix, Ariz. December 9-10 IPC Technology Interchange — The North American PCB Industry: It Can and Will Support the Military Market Washington DC Visit www.ipc.org/events for more information.

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Standards Technical Development Conference Meetings Get involved in the development of industry standards used by your company, customers, competitors and suppliers. Anyone in the industry is welcome to register and attend the standards development committee meetings, except for meetings listed as “By Invitation.” Registration is required. 5-22as Space Electronic Assemblies Assembly and Joining J-STD-001 Addendum Processes Task Group 5-20 Assembly and Joining Processes Tuesday, September 22 8:00 am–10:00 am Committee (By Invitation) Imagination Sunday, September 20 4:30 pm–6:00 pm Schaumburg GH Leo Lambert, EPTAC Corporation This is a planning meeting for the leaders of the Assembly and Joining Processes Committee.

5-21h Bottom Termination Components (BTCs) Task Group

Tuesday, September 22 9:30 am–5:00 pm Epiphany Ray Prasad, BeamWorks Inc.; Vern Solberg, STC-Madison

Garry McGuire, NASA Marshall Space Flight Center

This task group will be celebrating publication of a revision to Space Applications Electronics Hardware Addendum for J-STD-001D and will immediately begin work on the addendum for J-STD-001E.

5-22bt J-STD-001 Training Task Group

Wednesday, September 23 1:30 pm–3:00 pm Utopia D Teresa Rowe, AAI Corporation

This new task group is developing a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing bottom termination components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body.

This task group will review progress toward updating the J-STD-001DS space addendum unique training and develop an outline for J-STD-001E training update.

5-22a J-STD-001 Task Group

Monday, September 21 1:30 pm–5:00 pm Euphoria Gerard O’Brien, Solderability Testing and Solutions Inc.

Sunday, September 20 8:00 am–2:30 pm Schaumburg GH Teresa Rowe, AAI Corporation This task group is developing revision E to IPC J-STD-001. The leaders hope to be able to close all comments and action items as a prelude to ballot.

5-22a/ Joint Meeting of J-STD-001 7-31b and IPC-A-610 Task Groups

Monday, September 21 9:00 am–5:00 pm Nirvana C Jennifer Day, Stanley Associates, U.S. Army Redstone Arsenal; Constantino Gonzalez, ACME Training & Consulting; Teresa Rowe, AAI Corporation This is a joint working group to resolve comments common to revision E of both J-STD-001 and IPC-A-610.

5-23a Printed Circuit Board Solderability Specifications Task Group

This task group is working on the C revision of J-STD-003B which will address more wetting balance data generation and include a solder spread test protocol.

5-23b Component and Wire Solderability Specification Task Group

Monday, September 21 8:00 am–12:00 pm Euphoria David Hillman, Rockwell Collins This task group is working on consolidating IPC/ ECA J-STD-002C and JESD 22-B102 (JEDEC document on same topic) into a single document.

5-24a Flux Specifications Task Group

Tuesday, September 22 10:15 am–12:00 pm Utopia A Renee Michalkiewicz, Trace Laboratories– East This task group will begin the revision of J-STD-004B.

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5-24b Solder Paste Task Group

Wednesday, September 23 9:30 am–12:00 pm Serenity Brian Toleno, Ph.D., Henkel Corporation This task group is continuing work on revision A of J-STD-005.

5-24c Solder Alloy Task Group Tuesday, September 22 Utopia A David Scheiner, Kester

1:30 pm–3:00 pm

This task group is revising J-STD-006C.

5-24f Underfill Adhesives for Flip Chip Applications Task Group

Tuesday, September 22 3:15 pm–5:00 pm Utopia A Brian Toleno, Ph.D., Henkel Corporation This task group is updating J-STD-030.

7-31h IPC-HDBK-620 Handbook Task Group

Wednesday, September 23 1:30 pm–5:00 pm Serenity Randy McNutt, Northrop Grumman Corp.; Brett Miller, USA Harness, Inc. This task group is developing a handbook to support users of IPC/WHMA-A-620.

7-35 Assembly and Joining Handbook Subcommittee

Tuesday, September 22 8:00 am–5:00 pm Utopia D Mary Muller, Crane Aerospace & Electronics; Guy Ramsey, R & D Assembly This subcommittee is nearing completion of a major update to IPC-AJ-820 that now incorporates the best parts of IPC-HDBK-001, IPC-PE-740, IPC-HDBK-830, IPC-CM-770, and the component identification desk reference manual DRM-18.

Assembly Equipment 5-41 SMT Component Placement Equipment Subcommittee

Thursday, September 24 8:00 am–12:00 pm Connection Michael Cieslinski, Panasonic Factory Solutions Company of America This committee is developing revision A to IPC-9850 to incorporate pick and place equipment technologies.

Standards Development Meetings Base Materials 3-11 Laminate/Prepreg Materials Subcommittee

Monday, September 21 8:00 am–12:00 pm Utopia A Tony Senese, Panasonic Electric Division This subcommittee is revising IPC-4101C.

3-11g Corrosion of Metal Finishes Task Group

Tuesday, September 22 8:00 am–10:00 am Utopia A Beverley Christian, Ph.D., Research In Motion Limited This task group is exploring and gathering data on the effects of corrosion on surface finishes.

3-12a Metallic Foil Task Group

Tuesday, September 22 8:00 am–10:00 am Euphoria Rolland Savage, High Performance Copper Foil Inc. This task group is gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562.

3-12d Woven Glass Reinforcement Task Group

Monday, September 21 1:30 pm–3:00 pm Utopia A Patricia Goldman, Dielectric Solutions, LLC This task group continues to explore the dielectric constant (permittivity) for E-glass and will examine the data obtained from testing this property by glass fiber manufacturers for possible inclusion into IPC-4412.

Cleaning and Coating 5-30 IPC Cleaning and Coating Committee

Monday, September 21 8:00 am–9:00 am Innovation Douglas Pauls, Rockwell Collins; Debora Obitz, Trace Laboratories–East This open session will feature a presentation on all its task group and subcommittee activities.

3-12e Base Materials Roundtable Task Group

5-31 Cleaning & Alternatives Subcommittee

This task group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs.

This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, IPC-SA-61, IPCAC-62, and IPC-CH-65.

Monday, September 21 3:15 pm–5:00 pm Utopia A Edward Kelley, Isola Group SARL

Tuesday, September 22 8:00 am–12:00 pm Connection Mike Bixenman, Kyzen Corporation

Standards Development Meetings 5-32a/ Joint Meeting — Ionic 5-32c Conductivity and Bare Board Cleanliness Task Groups

Wednesday, September 23 1:30 pm–5:00 pm Imagination Douglas Pauls, Rockwell Collins; John Radman, Trace Laboratories East Denver; Joe Russeau, Precision Analytical Laboratory, Inc.

Data Generation & Transfer/Documentation 2-18 Declaration Process Management Subcommittee

Wednesday, September 23 9:30 am–12:00 pm Epiphany Eric Simmon, NIST

This joint meeting will address the completion of IPC-5704 on cleanliness assessment requirements for printed board fabricators and new test methods for ionic cleanliness.

This subcommittee has developed IPC-1751 for supplier data exchanges, including materials declarations (IPC-1752) and manufacturing process declarations (IPC-1756), and will review the XML schema for all supplier declaration standards.

5-32b SIR and Electrochemical Migration Task Group

2-18a Manufacturing Process Declaration Task Group

Monday, September 21 1:30 pm–5:00 pm Innovation Chris Mahanna, Robisan Laboratory Inc.; Graham Naisbitt, Gen3 Systems Limited; Russell Shepherd, Microtek Laboratories This task group is developing a user guide for the IPC-B-52 SIR test board and reviewing international efforts on SIR and CAF.

5-32e Conductive Anodic Filament (CAF) Task Group

Tuesday, September 22 1:30 pm–3:00 pm Utopia B Karl Sauter, Sun Microsystems, Inc. This task group will consider comments to revision B, of IPC-9691A.

5-33c Conformal Coating Handbook Task Group

Thursday, September 24 8:00 am–12:00 pm Perfection Fritz Byle, Astronautics Corp. of America This task group will discuss the development of a standard for the exchange of manufacturing process information, such as moisture sensitivity level, lead finish, and tin whisker mitigation.

2-18b Materials Declaration Task Group

Tuesday, September 22 8:00 am–5:00 pm Innovation Mark Frimann, Texas Instruments Inc. This task group will review proposed revision 2.0 of the materials declaration standard IPC-1752. Changes include multiple-part declarations and updating the data for global material restrictions beyond RoHS.

Wednesday, September 23 9:30 am–12:00 pm 2-18x Packaging Declarations Exploratory Meeting Imagination Amy Hagnauer, Raytheon Company; Jason Keeping, Celestica; Fonda Wu, Raytheon Company

This task group is developing revision A to IPCHDBK-830.

5-33f Potting and Encapsulation Task Group

Monday, September 21 9:00 am–10:00 am Innovation Douglas Pauls, Rockwell Collins This newly formed task group is evaluating industry needs for potting and encapsulation of conformal coatings.

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Thursday, September 24 8:00 am–12:00 pm Imagination Michael Hutchings, Sun Microsystems This is an exploratory meeting to determine the level of interest in the development of a data exchange standard for packaging/packing materials. The standard could address use of restricted materials as well as recycling, material content, applicable standards and laws, labels, etc.

Data Generation & Transfer/Shop Floor Communication 2-10/ Joint Meeting — Data 2-13 Generation and Transfer Committee and Shop Floor Communication Subcommittee

Monday, September 21 1:30 pm–5:00 pm Epiphany Andrew Dugenske, Georgia Institute of Technology; Gary Ferrari, FTG Circuits; Karen McConnell, Lockheed Martin The 2-10 committee oversees all CAD, CAM and CAE data transfer standards described in the IPC-25XX series. The 2-13 subcommittee will discuss the IPC-2540 standards and their implications for both end-users and equipment suppliers on the factory floor.

Electronic Documentation Technology 2-40 Electronic Documentation Technology Committee

Monday, September 21 8:00 am–12:00 pm Epiphany Bryan Truax, CADParts & Consulting, LLC The 2-40 committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machine.

Embedded Components CRANE Embedded Passives Committee (By Invitation)

Tuesday, September 22 10:15 am–12:00 pm Euphoria Jason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLC Status on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles. The emulator project will also be presented to encourage candidate designs for embedded passive integration.

Standards Development Meetings D-51 Embedded Devices Design Subcommittee

4-34b Marking, Symbols and Labels for Identification of Assemblies, Tuesday, September 22 8:00 am–10:00 am Components and Devices Knowledge Task Group Gary Ferrari, FTG Circuits; Richard Snogren, Bristlecone LLC

This subcommittee is developing a working draft of IPC-2227.

D-52 Embedded Component Materials Subcommittee

Wednesday, September 23 9:30 am–12:00 pm Innovation David McGregor, E.I. du Pont de Nemours and Co. This subcommittee is pursuing Amendment 1 to IPC-4821 and is continuing to address material impacts from the possible incorporation of active embedded components.

D-54 Embedded Devices Test Methods Subcommittee

Wednesday, September 23 1:30 pm–3:00 pm Innovation Jan Obrzut, Ph.D., NIST This subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices used in printed boards and specifically, a power rating for embedded resistors.

Environment, Health & Safety (EHS) 4-33 Halogen-Free Materials Subcommittee

Tuesday, September 22 10:15 am–12:00 pm Utopia B Douglas Sober, Kaneka Texas Corporation This subcommittee will consider new comments for revision B of the white paper/technical report on low-halogen base materials. This paper/ report focuses on the legislative, marketing and environmental pressures to remove halogenated flame retardants from PCBs and electronic assemblies.

4-33a Low-Halogen Electronics Standard Task Group

Monday, September 21 1:30 pm–5:00 pm Utopia CD Scott O’Connell, Dell; Stephen Tisdale, Intel Corp. This task group will review the draft standard on the definition of low-halogen electronics, including printed circuit boards, components, electronics assemblies, cables and mechanical plastics.

Wednesday, September 23 1:30 pm–5:00 pm Epiphany Jasbir Bath, Bath Technical Consultancy; Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc. This combined working group of IPC and JEDEC will review IPC/JEDEC J-STD-609.

Fabrication Processes 4-14 Plating Processes Subcommittee

Wednesday, September 23 1:30 pm–3:00 pm Nirvana C George Milad, UIC/Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc. This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/ immersion plating. The subcommittee is continuing its work on IPC-4555. In addition, the group will celebrate the release of IPC-4553A.

Flexible Circuits D-11 Flexible Circuits Design Subcommittee

Wednesday, September 23 3:15 pm–5:00 pm Nirvana C Mark Finstad, Minco Products, Inc.; William Ortloff, Raytheon Company This subcommittee is initiating revision C of IPC2223 that will include a new addendum providing design guidance/tutorials for the board designer.

D-12 Flexible Circuits Specifications Subcommittee

Tuesday, September 22 10:15 am–12:00 pm Knowledge Nick Koop, Minco Products Inc.; Mahendra Gandhi, Northrop Grumman Aerospace Systems This subcommittee is developing HDI acceptance criteria for IPC-6013.

D-13 Flexible Circuits Base Materials Subcommittee

Wednesday, September 23 1:30 pm–3:00 pm Connection Clark Webster, ALL Flex Inc.

D-13b Covercoat Materials Task Group

Wednesday, September 23 9:30 am–12:00 pm Connection Steve Musante, Raytheon Missile Systems This new task group will pursue the addition of one (or more) specification sheet(s) to IPC-4203. The new specification sheets will address various liquid applied covercoat materials that are subsequently cured through photo and/or thermal exposure and need to be fully characterized as both flame resistant and electrically insulating.

D-15 Flexible Circuits Test Methods Subcommittee

Tuesday, September 22 1:30 pm–5:00 pm Euphoria Rocky Hilburn, CAC, Inc; Duane Mahnke, Mahnke Consulting This subcommittee provides test methods required by the other subcommittees within the D-10 Flexible Circuits Committee. IPC-TM-650, will be examined in detail for applicability and need for replacement or revision. Also, any test methods specified in new flexible circuitry documents will be generated. The test method on service temperature for flexible base materials is being revised and will be addressed.

High Speed/High Frequency Interconnections D-20 High Speed/High Frequency Committee

Monday, September 21 10:15 am–12:00 pm Connection Thomas Bresnan, R&D Circuits; Edward Sandor, Taconic Advanced Dielectric Division This is a planning meeting for the task group and subcommittee leaders of the D-20 Committee. The group will discuss concepts for future revisions to IPC-2141, IPC-2251 and IPC-2252.

D-22 High Speed/High Frequency Board Performance Subcommittee

Monday, September 21 1:30 pm–5:00 pm Connection Mahendra Gandhi, Northrop Grumman Aerospace Systems; Michael Luke, Raytheon Company This subcommittee is working on revision B to IPC-6018.

This subcommittee maintains IPC-4202, IPC-4203, and IPC-4204. All three documents are being revised and balloting will begin this spring.

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Standards Development Meetings D-23 High Speed/High Frequency Base Materials Subcommittee

Wednesday, September 23 9:30 am–12:00 pm Prosperity Edward Sandor, Taconic Advanced Dielectric Division; Roy Keen, Rockwell Collins This task group is developing revision A to the IPC-4103 materials specification for high frequency laminates.

D-24 High Speed/High Frequency Test Methods Subcommittee

Tuesday, September 22 1:30 pm–3:00 pm Knowledge James Baker-Jarvis, NIST; Don DeGroot, CCNi This oversight subcommittee will discuss potential revisions to existing test methods to evaluate high speed/high frequency boards and materials.

D-24c High Frequency Test Methods Task Group: Frequency-Domain Methods Tuesday, September 22 Knowledge Mike Janezic, NIST

3:15 pm–5:00 pm

This task group determines the needs of the microelectronics industry for high frequency dielectric test methods. Currently, the task group is reviewing recent results from a transmission line test method for characterizing dielectric materials.

Management 8-40/JNAC Joint Meeting — Roadmap Steering and Planning Committee and JISSO North America Council

Thursday, September 24 1:00 pm–5:00 pm Perfection Jack Fisher, Interconnect Technology Analysis, Inc.; Dennis Fritz, MacDermid During this joint meeting, JNAC and the IPC Roadmap Steering and Planning Committee will coordinate activities. JNAC provides input to the Jisso International Council (JIC) on technology, materials, testing and standards through this cooperative effort.

CCC Committee Chairman Council (By Invitation) Sunday, September 20 Schaumburg GH Peter Bigelow, IMI Inc.

3:00 pm–4:30 pm

This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs.

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SPVC Solder Products Value Council (By Invitation) Thursday, September 24 Imagination Karl Seelig, AIM, Inc.

1:30 pm–5:00 pm

This council identifies and executes programs designed to enhance the competitive position of solder manufacturers and their customers.

Process Control 7-23 Process Effects Handbook Subcommittee

Wednesday, September 23 3:15 pm–5:00 pm Innovation Dennis Fritz, MacDermid, Inc. This subcommittee is continuing with revision B to IPC-PE-740. The revision concentrates on updating printed circuit fabrication issues, including the impacts of lead-free assembly on the bare board.

Product Assurance 7-30 Product Assurance Committee (By Invitation)

Monday, September 21 8:00 am–9:00 am Nirvana C Mel Parrish, STI Electronics, Inc. This is a planning meeting for all Product Assurance Committee task group and subcommittee leaders.

7-31a/ Joint Meeting — IPC-A-600 D-33a and Rigid Printed Board Performance Specifications Task Groups

Sunday, September 20 9:00 am–3:00 pm Utopia A Mark Buechner, BAE Systems; Randy Reed, Merix Corp. These task groups are preparing IPC-6012C and IPC-A-600H for ballot.

7-31b IPC-A-610 Task Group

Friday, September 18 8:00 am–5:00 pm Off-Site Saturday, September 19 8:00 am–5:00 pm Nirvana C Jennifer Day, Stanley Associates, U.S. Army Redstone Arsenal; Constantino Gonzalez, ACME Training & Consulting This task group is continuing development of revision E to IPC-A-610. The goal at the meeting is to close all comments and action items as a prelude to ballot of this revision.

7-31bt IPC-A-610 Certification Technical Committee

Wednesday, September 23 3:15 pm–5:00 pm Utopia D Mary Muller, Crane Aerospace & Electronics This working group provides technical guidance to the developer of the certification program for IPC-A-610 and will be developing an outline to update the training program for Revision E.

7-31fs Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group

Tuesday, September 22 10:15 am–5:00 pm Imagination Garry McGuire, NASA Marshall Space Flight Center This task group will review the final draft before ballot of an addendum to IPC/WHMA-A-620. This addendum will enable users of the standard and addendum to specify fabrication and acceptance of cable and wire harness assemblies used in rigorous space electronics hardware.

7-31ft A-620 Technical Training Task Group

Wednesday, September 23 9:30 am–12:00 pm Utopia D Debbie Wade, Advanced Rework Technology-A.R.T This working group provides technical content direction for the IPC/WHMA-A-620 training and certification program. This meeting will focus on training for A-620AS Space Electronics Hardware Addendum.

Association Connecting Electronics Industries

IPC STANDARDS —

EVERYTHING YOUEVERYTHING NEED FROM YOU START TO FINISH IPC STANDARDS — NEED FROM START TO FINISH

End-Product Repair IPC-7711/21 Solderability J-STD-002 J-STD-003 Stencil Design Guidelines IPC-7525 Assembly Materials J-STD-004 J-STD-005 IPC-HDBK-005 J-STD-006 IPC-SM-817 IPC-CC-830 HDBK-830 Solder Mask IPC-SM-840 Copper Foils IPC-4562 Marking and Labeling J-STD-609

Requirements and Acceptance for Cable and Wire Harness Assemblies IPC-A-620 Acceptability of Electronic Assemblies IPC-A-610 Requirements for Soldered Electronic Assemblies J-STD-001

Acceptability of Printed Boards IPC-A-600 Qualifications for Printed Boards IPC-6011, 6012, 6013, 6017

BGA, CSP, HDI Flip Chip J-STD-030 IPC-7094 IPC-7095 Components J-STD-020 J-STD-033 J-STD-075 Test Methods IPC-TM-650 IPC-9691 Electrical Test IPC-9252

Base Materials for Printed Boards IPC-4101, 4104, 4202, 4203, & 4204

Surface Treatments IPC-4552 IPC-4553 IPC-4554

Design & Land Patterns IPC-2220 series + 7351

High Speed/ Frequency IPC-2141 IPC-2251

Data Transfer and Electronic Product Documentation IPC-2581 Series, IPC-2610 Series

Materials Declaration IPC-1751 IPC-1752

PURCHASE IPC STANDARDS AT DISCOUNT MEMBER PRICES MORE IPC STANDARDS AVAILABLE AT BOOTH #331 www.ipc.org/SpecTree (.pdf format)

Standards Development Meetings 7-31j IPC-A-630 Box Build Task Group

Monday, September 21 1:30 pm–5:00 pm Imagination Eddie Hofer, Rockwell Collins; Richard Rumas, Honeywell Canada This task group will look at a “strawman” draft of IPC-A-630, Requirements and Acceptance for Enclosures, High Performance Applications.

Product Reliability 6-10c Plated-Through Via (PTV) Reliability — Accelerated Test Methods Task Group

Tuesday, September 22 10:15 am–12:00 pm Utopia C Werner Engelmaier, Engelmaier Associates; Randy Reed, Merix Corp.; Dewey Whittaker, Honeywell Inc. This task group is establishing a guideline for the attributes affecting lead-free assembly process survivability.

D-32 Thermal Stress Test Methodology Subcommittee

Monday, September 21 8:00 am–10:00 am Utopia B Michael Freda, Sun Microsystems Inc.; Gerard O’Brien, Solderability Testing and Solutions Inc. This subcommittee has developed IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. The subcommittee is developing a test method user’s guide.

Rigid Printed Boards 7-31at IPC-A-600/IPC-6012 Technical Training Committee

Tuesday, September 22 1:30 pm–5:00 pm Connection Debora Obitz, Trace Laboratories--East This will be the initial planning meeting to outline a major update to the IPC-A-600 training program.

D-31b IPC-2221/2222 Task Group

Tuesday, September 22 1:30 pm–5:00 pm Nirvana C Gary Ferrari, FTG Circuits; Cliff Maddox, Boeing Company This task group is developing revision B of IPC-2221.

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Tuesday, September 22 8:00 am–12:00 pm Nirvana C Graham Naisbitt, Gen3 Systems Limited; Joe Russeau, Precision Analytical Laboratory, Inc. This subcommittee maintains and updates IPCTM-650. It is undergoing an extensive review of IPC test methods older than five years for reaffirmation, revision or cancellation.

UL-IAG Industry Advisory Group Meeting for UL Wednesday, September 23 9:30 am–12:00 pm Nirvana C C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Tom Kemp, Rockwell Collins This task group is completing the forthcoming IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 Printed Board Process Capability, Quality and Relative 1:30 pm–5:00 pm Reliability Benchmark Test Subcommittee

This task group is reviewing the IPC/JEDEC-9707 spherical bend test method for determining printed board assembly strain limits as well as IPC-9708 for pad crater test methods.

7-11 Test Methods Subcommittee

D-35 Printed Board Storage and Handling Subcommittee

6-10d SMT Attachment Reliability Test Methods Task Group

Tuesday, September 22 Utopia C Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory; Werner Engelmaier, Engelmaier Associates, L.C.

Testing

Monday, September 21 10:15 am–12:00 pm Utopia B Gary Long, Intel Corp.; Michael Miller, NSWC-Crane This subcommittee has developed a database for benchmarking board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers.

Terms and Definitions 2-30 Terms and Definitions Committee

Sunday, September 20 8:00 am–9:00 am Utopia A Michael Green, Lockheed Martin Space Systems Company; Vicka White, Honeywell Air Transport Systems This committee maintains standard industry definitions for the electronic interconnection industry within IPC-T-50. The committee will provide an overview of terms currently being addressed.

Thursday, September 24 2:00 pm–5:00 pm Utopia D Jeff Brandt, Underwriters Laboratories Inc. To resolve questions about nontechnical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronics interconnection industry, the re-establishment of an IAG for interpretation of the UL 746E, UL 796, UL 746F and UL 796F has begun. This group of industry and UL personnel will address items not appropriate for the UL-STP meetings, which cover technical modifications to the four UL documents above.

3-11f/ Joint Meeting — UL/CSA and D-12a UL 796F and UL 746F Task Groups

Thursday, September 24 10:00 am–12:00 pm Utopia D Jack Bramel, Jack Bramel & Associates; Duane Mahnke, Mahnke Consulting These two combined task groups provide a forum for ideas and data for both rigid and flexible printed boards and materials to support efforts on four UL standards: UL 746E, UL 796, UL 746F and UL 796F. This information will be provided to the appropriate UL Industry Advisory Group (IAG) for both rigid and flex materials / printed boards or to the Standards Technical Panel (STP) groups for rigid or flexible materials / printed boards, as industry input to the four identified UL standards.

Professional Development Courses Find solutions to your company’s greatest challenges through learned guidance from our industry experts. Registration is required.

Thursday, September 24 9:00 am–12:00 pm

2:00 pm–5:00 pm

PD-01 Stencil Printing Process for Solder Paste Application — An In-Depth Look

PD-02 Troubleshooting Your PCB Assembly Yields — On-Site or Offshore

Utopia A S. Manian Ramkumar, Rochester Institute of Technology

PD-03 LGA and QFN Design, Assembly and Rework Guide Utopia B Bob Willis, ASKbobwillis.com

Utopia A Bob Willis, ASKbobwillis.com

PD-04 Advanced Component Packages and Processes Utopia B S. Manian Ramkumar, Rochester Institute of Technology

PD-05 Fundamentals of Solder Joint Reliability Utopia C Werner Engelmaier, Engelmaier Associates, L.C.

PD-07 DFM for Manufacturing: When a Six Sigma Process Is Not Sufficient to Achieve a High Yielding Manufacturing Process Epiphany Dale Lee, Plexus

PD-06 Final Finishes and Their Compatibility with Lead-Free Assembly Utopia C Michael Carano, OMG Electronic Chemicals

PD-08 Accelerated Thermal Cycling and Acceleration Factors for Lead-Free Surface Mount Assemblies Epiphany Jean-Paul Clech, Ph.D., EPSI

Certification Programs at IPC Midwest September 21–22

September 25–27

IPC EMS Program Manager Training and Certification Program — Introduction to Program Management

Certified Interconnect Designer (CID) Workshop and Exam

September 24–26

Designers Council

EMS Program Manager Training and Certification — Leadership Training iPC EMS

Program manager Training and CerTifiCaTion Program

IPC PCB AdvAnCed desIgner CertIfICAtIon study guide

For more information on IPC’s designer certification programs, visit http://dc.ipc.org.

For more information, contact Susan Filz at SusanFilz@ipc.org or visit www.ipc.org/EMSCert. CID+ Advanced Training Module n Rev. A

PWBADV-SGA

Earn Your CEPM CrEdEntial todaY! www.ipc.org/emscert

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Internet Lounge

Exhibit Hall Floor Plan

IPC Bookstore

331

537

327

426

324

325

424

525

425

732

631

730

627

726

625

724

731

826 725

824

Sales Office

326

633

Reliability and Failure Analysis Forums

A-Line 317 314

315

414

415

617

716

615

714

816 715

513

312

815

308

307

408

411

510

409

508 507

306 304

405

504

302

403

502

401

500

300

24 |

609

301

www.IPCMidwestShow.org

400

605

704 702

501

600

601

700

802 701

800

New Products Listing Ascentech, LLC

633

GENSONIC new ultra-sonic smt stencil aperature cleaning system

Asymtek

500

DispenseJet DJ-100 Jet high-speed jet dispensing ®

Juki Automation Systems

715

FlexSolder W510 FlexSolder W510 is a selective solder machine able to handle dual miniwaves for simultaneous or individual use.

MYDATA automation

525

MY100SX Picking better ways to work just got easier.

Fids-on-the-Fly™ high-speed fiducial capture

Omron Electronics

Calumet Electronics Corporation

400

Dock-To-Stock Supply Chain Solutions Calumet solves the conflict between engineering, purchasing, and quality priorities by delivering the best value on the best printed circuit boards.

Dock-To-Stock Life-Cycle Management Plan No more missed opportunities due to competitive pricing! No NRE, No Expedite, No Bull. Dock-To-Stock Quality Management Plan Performance-based solutions eliminate redundancy and non-value adding activity.

301

SE500™ The fastest, most accurate SPI!

ESSEMTEC USA

704

PANFLEX2-PKG

Fuji America Corporation

425

Large Board All-in-one-placement system XPF-W

IPC — Association Connecting Electronics Industries®

Q-upNAVI Quality Improvement Software Data mining software tool identifies root causes of failure VP6000 Solder Paste Inspection System 3D inspection accurately measures solder volume and geometry to eliminate faults

Dock-To-Stock Inventory Management Plan Standard packaging, standard procedures, exceptional savings.

CyberOptics Corporation

601

EzTS Easy Teaching Software Shortens AOI program setup, simple enough for operators to use

331

IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards The new revision adds 11 new specification sheets to reflect the expanded offerings for current commercially available laminates and prepregs. IPC-4553A, Specification for Immersion Silver Plating for Printed Boards This newly revised specification sets the requirements for the use of immersion silver as a surface finish for printed boards, adding a maximum deposit thickness based on performance criteria. IPC Fast Facts Survey, Survival Strategies and Success Measures in the Electronics Industry With data from OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals strategies being used to weather the recession, the recession’s impact on relationships with suppliers, and success measures. Annual IPC Studies, 2008–2009 Industry Analysis and Forecast for Rigid PCBs in North America and 2008–2009 Industry Analysis and Forecast for Flexible Circuits in North America Published this summer, these reports are based on surveys of North American PCB manufacturers conducted earlier this year.

VT-S700 High-Speed In-Line AOI High-speed, high resolution VT-S700 In-Line AOI System improves postsolder image accuracy using a new telecentric lens VT-X X-ray Solder Inspection System Omron Shortens tact time for in-line x-ray inspections with the world’s first dual-mode ct scanner for pcbs with surface mount components on both sides

Panasonic Factory Solutions Company of America

307

NPM (Next Production Modular) Fully integrated to maximize your productivity PanaCIM Enterprise Edition Maximize your productivity with a new MES software solution

Pillarhouse

317

Handex Jade PillarGen 40 Pillarhouse introduces low cost Nitrogen generating system enabling turn key solution from single supplier Synchrodex Orissa Modular high speed inline Synchrodex Orissa with multiple solder technologies available on one platform

Qualitek International Inc.

800

DSP 866 No-Clean Lead Free Solder Paste Truly unique with 0% ppm total halogens NC600-Sn100e Wire Solder No-clean, lead free, silver free, halogen free formulation

ZESTRON America

625

VIGON® N 501 First-of-its-kind pH-neutral defluxing cleaning agent

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Index of Exhibitors by Category Adhesives

Associations, Societies & Government Agencies

Analytical/Laboratory Equipment & Supplies

Artwork Generation/Phototooling

Ball Placement Systems & Equipment

Assembly Equipment: Feeding Systems—Bulk

Barcode Printers & Readers

AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732 Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826

Assembly Equipment: Chip Placement

Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .

Assembly Equipment: Component Insertion

Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assembly Equipment: Fine-Pitch Placement

Assembly Equipment: Flip-Chip Technology

Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .

Assembly Equipment: Multifunctional Placement

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .

Assembly Equipment: Odd Form

Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

701 826 704 513 425 715 525 307 701 826 304 715 525 307 609 701 826 704 513 425 715 525 307 701 500 826 704 513 425 715 525 307 815 701 826 704 513 425 715 525 307 701 826 513 425 715 525 307 724

IPC —Association Connecting Electronics Industries© . . . . . . . . . . . . . . . . . . 331 IPC Designers Council . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617 DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 ASYS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

401 508 513 601 724

Board Handling Equipment (Conveyors & Depanelizers)

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ASYS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

815 701 401 826 324 704 304 525 724

Cable & Wire Harness

Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732

Carts, Racks & Accessories

AGI Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cleaning Agents/Solvents

AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Petroferm Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cleaning Equipment/Systems

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CHEMCUT Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Petroferm Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

615 826 304 724 700 815 411 324 409 800 625 815 411 633 414 409 625

Coating Equipment/Systems

Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

Coatings (Conformal, etc.)

PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Component Preparation

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Consulting Services

Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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400 826 405 307 732 625

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Index of Exhibitors by Category Curing Equipment & Systems

Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

Design Services: PCB Libraries and Models

Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400

Design Services: PCB Tools

Control Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Design Services: Systems

NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617

Dicing Equipment

Control Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508

Die Bonding Equipment

Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307

Dispensing Equipment

Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

633 500 826 704 307 300

Drilling & Routing Equipment & Supplies

Electronics Manufacturing Services (EMS)/ Contract Manufacturer

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Diversified Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732

Encapsulation Equipment

Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

EOS/ESD Handling Products & Services

FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Equipment Lease, Refurbish & Resale

Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

314 826 525 732

Flux

Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307 AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

700 500 800 600

Foils & Laminates

Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Fume Extraction Systems

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826

Gas: Atmosphere Systems

ACE Production Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537

Hand Tools

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Labeling Systems

28 |

ASYS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826

www.IPCMidwestShow.org

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ASYS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Marking Tools & Systems

815 401 508 724 815 401 508 724

Masks & Screens for Soldering/Printing

ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 704 MicroScreen LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 716 Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Material Handling Equipment/Automation Systems

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

826 304 601 609

Materials: Chip Packaging

Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Materials: Other

Media/Industry Publications

Advanced Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supporter Circuitnet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supporter CircuiTree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 EMS007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507 EMSNow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 702 EMT Worldwide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Poster Global SMT & Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Poster PCB007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507 SMT Magazine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327 U.S. Tech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426

Motion Control/Automation

FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601

Package-On-Package

Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307

Packing & Storage

Flip Chip Bonding Equipment

Laser Systems

InsulFab PCB Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510

Pallets & Carriers

AGI Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 InsulFab PCB Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510

Photovoltaics

DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Plating/Wet Process: Equipment

CHEMCUT Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414

Plating/Wet Process: Supplies

Uyemura International Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415

Printed Circuit Board (PCB) Manufacturer

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bare Board Group, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

815 824 400 617

Index of Exhibitors by Category Prototyping

Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diversified Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

400 424 704 304

Reclamation/Recovery Systems (Environmental)

Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Reflow Soldering Equipment (Ovens)

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

826 704 317 800 600

Repair & Rework

RFID

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601

Software: CAD/CAM/CIM

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307

Software: Data Acquisition & Systems

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405

Software: Electronic Design Automation (EDA)

Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Software: MES

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .

627 325 513 307

Software: Other

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307

Software: Process Control

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

627 513 307 732

Software: Product Data Management (PDM)

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307

Software: Product Lifecycle Management (PLM)

Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307

Solder (Paste/Bar/Cream/Powder)

AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600

Solder Resist: Materials

Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Solderability Test Systems

Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633

Soldering Equipment: Other

ACE Production Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Soldering Equipment: Selective

ACE Production Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Soldering Equipment: Wave

ACE Production Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

537 715 525 317 724 600 609 537 815 314 500 826 715 317 300 600 537 826 715 317 800 600

Soldering Irons/Tips/& Stations

Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314 PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Stencil: Cleaning Systems

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Petroferm Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Stencil: Printing Systems

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ASYS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EKRA America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .

Stencil: Supplies & Accessories

A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EKRA America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MicroScreen LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

815 411 633 826 409 625 815 401 826 508 324 403 704 525 307 815 324 403 716

Surface Finishing (HASL/OSP/Other)

Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 Uyemura International Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415

Surface Prep

CHEMCUT Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414 Petroferm Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409 Uyemura International Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415

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Index of Exhibitors by Category Tape & Reel Equipment & Services

Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Q Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 714

Test and Inspection: Equipment—Analog

Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test and Inspection: Equipment—AOI/Automated

Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MIRTEC Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

633 325 405 732 411 301 325 725 601 307 501

Test and Inspection: Equipment—Boundary Scan

Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Digital

Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732

Test and Inspection: Equipment—Environmental Chambers

IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Test and Inspection: Equipment—Fixtures/Handlers

AGI Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Functional

Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Test and Inspection: Equipment—In-Circuit

Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Infrared

Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732

Test and Inspection: Equipment—Mixed Signal

Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732

Test and Inspection: Equipment—Other

Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

633 301 732 501

Test and Inspection: Equipment—Wire Harness

Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Test and Inspection: Equipment—X-Ray

Glenbrook Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501

Test and Inspection: Test Laboratory/Failure Analysis

Acceptability, Reliability and Failure Analysis Forums . . . . . . . . . . . . . . . . . . 731 Robisan Laboratory Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 730 Trace Laboratories, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 726

Test and Inspection: Testing Services

Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Robisan Laboratory Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trace Laboratories, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test and Inspection: Testing Software

Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Tooling Equipment & Supplies

DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . InsulFab PCB Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Training & Education

AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-Connect007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC —Association Connecting Electronics Industries© . . . . . . . . . . . . . . . . . IPC Designers Council . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . Trace Laboratories, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Wire Bonding Equipment

Test and Inspection: Equipment—Solder Paste

Wire Cutting/Stripping and Wrapping Machine Tools

Test and Inspection: Equipment—Vision/Videos

Workstations/Ergonomics/Chairs

30 |

Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501

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700 400 507 331 331 617 307 726 625

Wafer Bumping Equipment

Digitaltest Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

324 304 510 525

Via Filling/Plugging/Tenting

Test and Inspection: Equipment—PXI Systems

411 325 405 617 800 732 730 726 625

Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . . 307 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609 Control Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 FKN Systek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609 ASYS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 PROMATION, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724

Exhibitor Listings Acceptability, Reliability and Failure Analysis Free Forums

731

After a product has been successfully built, delivered to the customer, and put in the field, something really bad can happen — it can come back. Failure analysis has always been on the final frontier of electronics assembly, but at IPC Midwest, we’re bringing it to the front of the line. Learn the intricacies of ensuring reliability throughout the lifecycle of electronic products and systems as the world’s foremost failure analysts present technical case studies and provide how-to guidance on Thursday, September 24, 2009 from 10:15 am to 3:30 pm. See page 13 for schedule.

ACE Production Technologies, Inc.

537

3010 North First Street Spokane Valley, WA 99216 Phone: +1 509-924-4898 Fax: +1 509-533-1299 sales@ace-protech.com Web: www.ace-protech.com Alan Cable, President +1 509-924-4898 The KISS (Keep It Simple Soldering) Selective Soldering Machines are the most widely accepted products on the market today. The KISS machines have an outstanding reputation for being robust, easy to operate, economically justifiable, and above all reliable. The KISS state-of-the-art features enable process development for an efficient production environment. These machines have a typical ROI of three to six months. The ACE product line also includes Re-work and Repair tools, and Lead Tinning Systems. A-Line Supplier **See our advertisement on page 9! **

A-Line with IPC

Aegis Industrial Software Corporation

627

AGI Corporation

615

5 Walnut Grove Drive, Suite 320 Horsham, PA 19044 Phone: +1 215-773-3571 Fax: +1 215-773-3572 sales@aiscorp.com Web: www.aiscorp.com Robert Miklosey, Vice President of Product Management +1 215-773-3571, bmiklosey@aiscorp.com Lynette Durringer, Office Manager +1 215-773-3571, ldurringer@aiscorp.com Aegis Software provides single-vendor information systems for high-reliability manufacturers, providing a critical complement to enterprise-level ERP and PLM capabilities. Aegis’ manufacturing execution system (MES) software fully manages the manufacturing information environment, from process planning and launch, through manufacturing execution and shop floor materials control, to operations analytics and real-time dashboard systems. 177 Nick Fitcheard Road Huntsville, AL 35806 Phone: +1 256-858-3300 Fax: +1 256-858-3304 Web: www.AGIcorp.com Doug Williamson, Sales Manager +1 256-489-1434, dwilliamson@agicorp.com Amy Buford, Inside Sales +1 256-489-1422, abuford@AGIcorp.com AGI Corp is an internationally known supplier of Wave Solder Pallets and SMT Assembly Pallets from the simplest to the most complex. Ask about our Titanium Insert Pallet, Screen Printer Tooling, Wash Baskets, Feeder Carts, Tray Carts, Stencil Storage Carts as well as the many other types of fixtures AGI manufactures. We have the most aggressive design and machining techniques available. Let us help you!

815

See assembly in action! Follow a product from screen printing to component mounting (through hole and surface mount), and then through reflow — all while learning about the processes, equipment (and end-item cleaning) that were used to manufacture the assembly. At the end of the line, you’ll get a finished assembly thanks to our participating companies:

32 |

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Exhibitor Listings Agilent Technologies, Inc.

802

AIM

700

5301 Stevens Creek Boulevard Santa Clara, CA 95051 Phone: +1 800-829-4444 Web: www.agilent.com/find/pcb Agilent Technologies (NYSE: A), the premier measurement company. Be sure to plan a stop by our booth for a visit with our experts. Learn more about our products and services and how Agilent “Has Got Your Needs Covered.”

25 Kenney Drive Cranston, RI 2920 Phone: +1 401-463-5605 Fax: +1 401-463-0203 Web: www.aimsolder.com Kelly Cardone, Marketing Coordinator +1 401-463-5605, kcardone@aimsolder.com AIM offers a full line of solder assembly materials to the electronics industry including solder paste, liquid flux, bar, wire, preforms, adhesives, cleaners and chemicals, plating anodes and indium- and gold-based specialty alloys. We are ISO9001 and QS9000 certified with manufacturing, distribution and support facilities located throughout the Americas, Asia-Pacific and Europe.

Apollo Seiko

314

3969 West Lemon Creek Road Bridgman, MI 49106 Phone: +1 269-465-3400 Fax: +1 269-465-3441 info@apolloseiko.com Web: www.apolloseiko.com Rick G. Schiffer, President +1 269-465-3400, rick@apolloseiko.com Stacey Barajas, Executive Assistant +1 269-465-3400, stacey@apolloseiko.com Apollo Seiko is the world-wide leader in selective soldering solutions. Our technologies include direct power iron tip, micro-flame, laser diode and bottom side soldering. Table-top or in-line systems are available, equipment in stock.

Aqueous Technologies

411

9055 Rancho Park Court Rancho Cucamonga, CA 91730 Phone: +1 909-944-7771 Fax: +1 909-944-7775 sales@aqueoustech.com Web: www.aqueoustech.com Mike Konrad, President +1 909-944-7771, konrad@aqueoustech.com Joe Herr, Sales Manager +1 909-944-7771, herr@aqueoustech.com Aqueous Technologies manufactures a variety of award-winning cleaning and cleaning related products including: Semi-Automatic Aqueous De-Fluxing stations Batch-Format Automatic Aqueous De-Fluxing Systems In-Line Format Aqueous De-Fluxing Systems; Ultrasonic Stencil Cleaning Systems; Cleaning Chemistries; Ionic Contamination (Cleanliness) Testers. Aqueous Technologies’ cleaners are capable of removing all flux/paste types including Rosin, Water Soluble and removes no-clean solder paste. A-Line Supplier

Ascentech, LLC

633

Assembléon America

701

Asymtek

500

ASYS Inc.

401

127 Goose Hill Road Chester, CT 6412 Phone: +1 860-526-8903 Web: www.ascentechllc.com Randy Allinson +1 860-526-8903, rallinson@snet.net Gregory Alexander +1 860-395-8794, galexnder@att.net Ascentech LLC - North American Distributor of GEN3 Systems Ltd products, including: MUST System III Solderability Test (wetting Balance) SPA1000 - Solder Paste Analyzer Auto-SIR - Surface Insulation Resistance Test CM Series - Ionic Contamination Testers Dip and Spray Conformal Coating Systems GENSONIC - NEW Ultra-Sonic SMT Stencil Cleaner New Product

5110 McGinnis Ferry Road Alpharetta, GA 30005 Phone: +1 770-751-4420 Fax: +1 770-751-4450 Web: www.assembleon.com Assembléon’s broad product range provides solutions for SMT electronics assembly with a focus on Pick-and-Place machinery and high-end screen printers. Assembléon also markets a wide range of software solutions and service capabilities. These total solutions support manufacturing from low volume high-mix batch production through to ultra-high volume continuous production of electronic assemblies. It’s machines are based on high precision X-Y positioning platforms incorporating advanced parallel placement technology and continuous software calibration for the most demanding applications. 2762 Loker Avenue West Carlsbad, CA 92010 Phone: +1 760-431-1919 Fax: +1 760-431-2678 info@asymtek.com Web: www.asymtek.com Jerry Frost, Regional Sales Manager - Midwest +1 760-431-1919, jfrost@asymtek.com Bernie McHugh, Regional Sales Manager - East +1 760-431-1919, bmchugh@asymtek.com Asymtek designs and manufactures a full line of automated precision dispensing and conformal coating systems, supported by an award-winning global service network. Established in 1983, Asymtek offers advanced applications for a range of industries, including semiconductor packaging, printed circuit board assembly, LEDs, flat panel display assembly, automotive, medical/ biotech product assembly, and other precision assembly processes. Asymtek’s systems are known for technology leadership and patented processes in jetting and coating. A subsidiary of Nordson Corporation (Nasdaq:NDSN), Asymtek is ISO 9001:2000 certified. New Product 140 Satellite Boulevard, N.E., Suite B-1 Suwanee, GA 30024 Phone: +1 770-246-9706 Fax: +1 770-246-9866 info@asys-group.com Web: www.asys-group.com Markus Wilkens, General Manager +1 770-246-9706, markus.wilkens@asys-group.com ASYS provides high quality equipment and excellent support worldwide. The product range includes SMD Board Handling, Marking Systems(Laser/Label/ Inkjet), Depaneling Systems (In-/Offline), Final Assembly and Screen Printers (LTCC, Solar). Find out more about the company that is Driven by Innovation at www.asys-group.com. A-Line Supplier

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Exhibitor Listings Bare Board Group, Inc.

824

7401 - 114th Avenue North, Suite 501 Largo, FL 33773 Phone: +1 727-549-2200 Fax: +1 727-549-2221 sales@bareboard.com Web: www.bareboard.com Greg Papandrew, President +1 727-549-2200, greg@bareboard.com Tom Coghlan, Operations Manager +1 727-549-2200, tom@bareboard.com The Bare Board Group has the sourcing and distribution experience necessary to assist you in obtaining offshore PCBs at competitive pricing through our pre-qualifed network of U/L, ISO and QS approved manufacturers. BBG has personnel ready to meet your needs on both sides of the world for on-site expediting, source inspection and around-the-clock communication. A-Line Supplier

Calumet Electronics Corporation

400

25830 Depot Street Calumet, MI 49913 Phone: +1 906-337-1305 Fax: +1 906-337-5359 sales@calumetelectronics.com Web: www.calumetelectronics.com Stephen J. Marshall, National Sales Manager +1 906-337-1305, smarshall@calumetelectronics.com Michael Messner, Sales Representative +1 906-337-1305, mmessner@calumetelectronics.com Calumet has been manufacturing mission-critical printed circuit boards in the USA since 1968! A New Standard for Printed Circuit Board Manufacturing and Supply-Chain Partnerships Harnessing 21rst Century Technology and American Innovation, Calumet restores the competitive edge to printed circuit boards Made in the USA. Mission-Critical Manufacturing™ delivers Class 3 performance at Class 2 prices with dock-to-stock dependability. Calumet; A Legacy of Performance, A Leader in Innovation! www.calumetelectronics.com New Product

Capital Equipment Exchange Company

826

2802 Barney Court McHenry, IL 60051 Phone: +1 815-363-0800 Fax: +1 815-363-0809 dlenhard@ce-exchange.com Web: www.ce-exchange.com David Lenhard, Used Equipment Business Manager +1 815 363 0800, dlenhard@ce-exchange.com Jory Feustel, Technical Manager - Used Equipment +1 815 363 0800, jfeustel@ce-exchange.com The Capital Equipment Exchange is pleased to offer you the best available used SMT equipment on the market today. CEE is looking to purchase your unused SMT equipment. SMT line sales are one of our specialties. Lenders, if you are looking for a first class organization to properly inspect/re-market your end of lease equipment, talk to our many satisfied customers. See our current inventory of conveyors, placement equipment, feeders, reflow ovens, printers, test and line support items on-line at www.ce-exchange.com. A-Line Supplier

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CHEMCUT Corporation

414

500 Science Park Road State College, PA 16803 Phone: +1 814-272-2800 Fax: +1 814-272-5206 bluebox@chemcut.net Web: www.chemcut.net Rick Lies, CEO/General Manager rlies@chemcut.net Floyd Confer +1 814 272 2804, fconfer@chemcut.net Chemcut, the leading supplier of wet processing equipment to the PCB & Chem-Milling markets, delivers world leading process uniformity, state-of-theart process controls, and customer-proven reliability. Modular systems that can be configured for any process with performance and flexibility backed by reliable post sale Chemcut service and support. Conference Notepad Sponsor

Circuitnet

Supporter

CircuiTree

312

Control Micro Systems, Inc.

508

135 Ward Hill Avenue Haverhill, MA 1835 Phone: +1 843-682-4755 info@circuitnet.com Web: www.circuitnet.com Jeff Ferry, Publisher +1 843-682-4755, jferry@circuitnet.com Ken Cavallaro, Business Manager +1 978-363-2176, kcavallaro@circuitnet.com It’s our job to dig through the hundreds of news stories and articles posted every day around the world covering electronics assembly. We don’t waste your time with everyday business news. We select and link to only the biggest of the new ideas and articles designed for business professionals from the world of electronics assembly. 600 Willow Brook Lane, Suite 610 West Chester, PA 19382 Phone: +1 610-436-4220 Fax: +1 248-502-1040 espositot@bnpmedia.com Web: www.circuitree.com Chris Wilson, Sales Manager +1 248-244-8264, wilsonc@bnpmedia.com Ed Lohmann, West Coast Sales Manager +1 925-648-2562, Lohmanne@bnpmedia.com CircuiTree is the only global magazine covering printed circuit board manufacture. Its monthly blend of technical and business articles is complemented by columnists who are regarded as industry experts. CircuiTree also translates technical articles into Chinese for its Asian edition. Please visit us at www. circuitree.com for a free subscription or advertising information. **See our advertisement on page 37!** 4420A Metric Drive Winter Park, FL 32792 Phone: +1 407-679-9716 Fax: +1 407-657-6883 salesmail@cmslaser.com Web: www.cmslaser.com Sales Department +1 407-679-9716, salesmail@cmslaser.com Provides laser marking systems for fast, permanent marking of text, graphics, barcodes and ECC200 2D matrix codes on pc boards. Specializes in laser systems configured to specific marking requirements, including board material, board-handling, vision systems/readers and integration with computer networks.Systems configurations range from stand-alone marking islands to fully integrated, SMEMA in-line workstations.

www.circuitree.com

Print/Digital Magazine

March 2009

Clearing the Way

April 2009

For High-Speed PCB Designs

In This Issue

Profile of Two Women PCB Executives Revamping the IPC-9252 Standard circuitree.com

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February 2009

In This Issue

Visit Us at Booth #312

Collaboration: The Ultimate Product Tool

Development i-Line UV Lithography for Sub-10μm Substrate Why 63 mil is a Standard PCB Thickness

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In This Issue

The world’s best source of information for the printed circuit board industry, CircuiTree magazine, brings readers face-to-face with the technological and business news they need to know. Our exclusive editorial focuses on information for circuit board fabricators and designers, their suppliers, and OEM customers with purchasing authority for products such as fabrication and design equipment, materials, test, and assembly. CircuiTree is also available in a GREEN digital format. Just select digital when you subscribe.

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Exhibitor Listings CyberOptics Corporation

301

5900 Golden Hills Drive Golden Valley, MN 55416 Phone: +1 763-542-5000 Fax: +1 763-542-5100 info@cyberoptics.com Web: www.cyberoptics.com Connie Prasher, Marketing Coordinator cprasher@cyberoptics.com Chris Rockwell, North American Sales Director +1 763-542-5979, chris@cyberoptics.com CyberOptics Corporation is a leading provider of market-based process yield and through-put improvement solutions for the global electronics assembly market. We offer stand-alone measurement and inspection systems used in the SMT electronic assembly market for process control and inspection. New Product

**See our advertisement on page 11!**

DEK International

324

1785 Winnetka Circle Rolling Meadows, IL 60008 Phone: +1 847-368-1155 Fax: +1 847-368-1177 Web: www.dek.com Jim Bernhard, Vice President, Sales +1 508-699-9077, jbernhard@grid-lok.com Charles Moncavage, Vice President, Engineering +1 484-893-1028, cmoncavage@grid-lok.com With award-winning customer support, decades of materials deposition experience and technologies that enable multiple applications from SMT to semiconductor packaging to photovoltaics, DEK delivers the knowhow and printing solutions you need to stay competitive. Designing every product mindful of customers’ future production needs, DEK keeps choice, versatility and low cost-of-ownership at the core of our development philosophy. Visit the booth to find out how DEK’s portfolio of screen printing, stencil and consumable products can enable your process today and tomorrow.

Digitaltest Inc.

325

5046 Commercial Circle, Suite C Concord, CA 94520 Phone: +1 925-603-8650 Fax: +1 925-603-8651 sales@digitaltest.net Web: www.digitaltest.net Mark Harding, Director of Sales, North America +1 925-603-8650, sales@digitaltest.net Digitaltest offers In-Circuit and Functional test equipment and the 2nd Generation CONDOR Flying Prober. Converters are available for migration from legacy testers to the SIGMA , saving your initial fixture investments. For a complete list of available converters and for more information on our products and services visit www.digitaltest.net.

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Diversified Systems, Inc.

424

EKRA America

403

EMSNow

702

3939 West 56th Street Indianapolis, IN 46254 Phone: +1 317-299-9547 Fax: +1 317-298-2055 sales@divsys.com Web: www.divsys.com Tammie Fish, Executive VP +1 317-299-9547 x169, tammie.fish@divsys.com Bob Howard, Business Development +1 317-299-9547, bob.howard@divsys.com For 37 years, Diversified Systems Inc. has maintained its reputation as a premier electro-mechanical contract assembler by specializing in both prototype (including rapid) and production arenas. dsi specializes in engineering solutions for complete life cycle management of all electronic manufacturing needs, including full box build, electrical/mechanical design & layout, testing, encapsulation, coating and potting. We have all major industry certifications & registrations.

34 Saint Martin Drive Marlborough, MA 1752 Phone: +1 508-486-9566 Fax: +1 508-486-9567 sales@ekra-america.com Web: www.ekra-america.com Steve Hall, President +1 508-486-9566, shall@ekra-america.com Jeff Copson, Sales Manager +1 508-486-9566, jcopson@ekra-america.com A leading technology development company for over 50 years and now a division of the ASYS Group, EKRA designs and manufactures screen printing solutions for the SMT, Hybrid, and Semiconductor Packaging markets. By focusing on useful technology development EKRA products provide the highest value for printing processes. 30 Mill Lane Stetchworth, Cambs, CB8 9TR United Kingdom Phone: +44-7768-318111 Paul Stoten, Publisher +44 7768 318111, pstoten@emsnow.com EMSNow is the leading online source for the global electronic manufacturing industry. Read by more than 50,000 people every month and using video, audio and the written word, it reaches every corner of the EMS world! **See our advertisement on page 26!**

EMT Worldwide

Poster

IML Group plc Blair House, High Street Tonbridge, Kent, TN9 1BQ United Kingdom Phone: +44-0-1732-359990 Fax: +44-0-1732-770049 Web: www.EmtWorldWide.com Tim Fryer, Editor +44 1732 359990, tim.fryer@imlgroup.co.uk Keith Murray, Advertising Manager +44 1732 359990, keith.murray@imlgroup.co.uk EMTWorldWide is a new approach to online publishing. The newsletter is delivered, free, weeky and contains the best news along with original comments from global correspondents. The newsletter is backed by a website packed with reference information, including ‘The ShortList’ - a unique buyers guide containing over 30,000 items of data.

An independent voice for a world wide industry

NEWSt EVENTSt ANALYSISt PRODUCTSt COMMENTSt TECHNOLOGYt CASE STUDIESt JARGON BUSTERt

Exhibitor Listings ESSEMTEC USA

704

816 North Delsea Drive, Suite 308 Glassboro, NJ 8028 Phone: +1 856-218-1131 Fax: +1 856-218-1134 sales@essemtec-usa.com Web: www.essemtec-usa.com Stephen Pollock, Vice President +1 856-218-1131, sales@essemtec-usa.com ESSEMTEC is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology. Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process. New Product

E-Tool

302

870 68th Avenue Minnesota City, MN 55959 Phone: +1 507-858-0004 Fax: +1 507-453-3662 Web: www.e-tool.com At E-Tool, our mission is to design and manufacture process pallets and tooling that enhance our customer’s qualified manufacturing process. E-Tool’s engineering staff has 40+ years of electronics manufacturing experience. We work together to implement solutions that have a direct impact on product quality and product cost.

Europlacer North America

513

2521 Schieffelin Road, Suite 102 Apex, NC 27502 Phone: +1 919-362-8623 Fax: +1 919-362-8628 sales@europlacer-na.com Web: www.europlacer.com John Perrotta, Vice President +1 267-884-6760, john.perrotta@europlacer-na.com David Fenton, Technical Services Manager +1 919-362-8623 x115, david.fenton@europlacer-na.com Europlacer designs and manufactures a comprehensive range of highly flexible SMT placement systems for the global electronics industry. Europlacer North America attributes its strong growth to a commitment to its core values of customer-driven product innovation and genuine integrity in all its business activities.

FKN Systek, Inc.

304

86 Kendall Avenue Framingham, MA 1702 Phone: +1 508-935-2282 Fax: +1 508-935-2286 fkn@fknsystek.com Web: www.fknsystek.com Klaus Heimann, President +1 508-935-2282 Werner Christ, Sales Manager +1 508-935-2262 FKN Systek designs and manufactures tools and equipment for the electronics industry. We supply a full line of depaneling equipment used for singulating fully loaded pre-scored and tab routed Printed Circuit Cards. This includes PLC controlled multi-blade saws, bench top routers, punches and automated and hand operated circular blade depanelizers for pre-scored boards. We also provide PCB racks and trays for in process board storage.

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Fuji America Corporation

425

Glenbrook Technologies, Inc.

326

Global Laminates Inc.

605

171 Corporate Woods Parkway Vernon Hills, IL 60061 Phone: +1 847-913-0162 Fax: +1 847-913-0186 Web: www.fujiamerica.com Scott Wischoffer, Marketing Manager +1 847-821-2405, scottw@fujiamerica.com The New Fuji NXT-II modular placement system now better and faster than before. We will also show the New XPF-XL single machine solution with large board capabilities. New Product A-Line Supplier 11 Emery Avenue Randolph, NJ 7869 Phone: +1 973-361-8866 Fax: +1 973-361-9286 Web: www.glenbrooktech.com Steven Zweig, Vice President, Sales +1 973-361-8866 x104, szweig@glenbrooktech.com Glenbrook Technologies will be demonstrating The Jewel Box 70T real time x-ray inspection system. This system allows up to 500x geometric and 2,000x electronic magnification. It includes a 5 axis manipulator and GTI-5000 Software with auto-BGA analysis software.

179 Ward Hill Avenue Ward Hill, MA 1835 Phone: +1 978-521-9700 Fax: +1 978-521-9701 Web: www.globallaminates.com Bruce Hurley, President +1 978-388-9610, bhurley@globallaminates.com Global Laminates, Inc is an international distributor of first quality copper clad rigid, interlayer and composite substrates. We have been serving the PCB industry for over 25 years. We serve the US, Canada and Mexico with fast, personal service from our office in Massachusetts and from distribution centers in Chicago, Los Angeles, Toronto and China. All laminates are UL 94-V0 recognized, IPC 4101B certified; our thermoset plastics meet MILI 24768 type 2. Certificates of Compliance are available for all products.

Global SMT & Packaging

Poster

P.O. Box 7579 Naples, FL 34112 Phone: +1 866-948-5554 Fax: +1 239-236-4682 news@globalsmt.net Web: www.globalsmt.net Trevor Galbraith, Editor-in-Chief +1 239-784-7208, editor@globalsmt.net Lino D’Andreti, VP Sales - Americas +1 603-918-8579, ldandreti@globalsmt.net Global SMT & Packaging contains authoritative technical articles on practical issues affecting SMT assembly and packaging. Visit our stand and collect your free copy. Distributed globally, it has a separate print and electronic circulation to the US, Europe, China and Korea, enabling companies to target their advertising to regionally or globally. Global SMT & Packaging also produces a weekly video news program.

Exhibitor Listings I-Connect007

507

P.O. Box 50 Seaside, OR 97138 Phone: +1 510-738-6610 Fax: +1 309-412-4815 info@iconnect007.com Web: www.iconnect007.com Steve Gold, Publisher/Editor +1 530-852-7076, steve@iconnect007.com Barbara Hockaday, Sales Manager +1 916-608-0660, barb@iconnect007.com The I-Connect007 family of magazines include PCB007, EMS007, PCBDesign007, Flex007, PCB007China and EMS007China. Each magazine serves a specific group of readers within the electronics manufacturing supply chain. Combined, these sites offer broad industry news coverage, columns, business and technical articles on a daily basis. Publishing more than 35,000 articles since 1999, I-Connect007 is the industry’s oldest, online magazine. I-Connect007 also produces the popular Real Time with... series covering events around the world. **See our advertisement on page 31!**

IEEE—Chicago Section

306

InsulFab PCB Tooling

510

335 East Geneva Drive, PMB 389 Carol Stream, IL 60188 Phone: +1 630-493-4333 Web: www.ieee-chicago.org The Chicago Section of the IEEE serves electrical engineers and computer professionals in the Chicago Metropolitan Area. Our committees provide opportunities to work on Programs and Special Events, Publications, History Projects, Government Activities.

834 Hayne Street Spartanburg, SC 29301 Phone: +1 404-617-9899 Fax: +1 864-527-1044 scain@insulfab.com Web: www.insulfabtool.com InsulFab PCB tooling is your complete source of custom tooling for the PCB industry. Our tooling line includes product for processes such as SMT, Wave, Conformal Coat, AOI, Hand Solder, Press fit and Rework. InsulFab has 2 locations to serve your needs and is ISO and ITAR certified. Please visit our booth number 510 to talk with one of our engineers and discuss your toughest application and how we can assist with the project.

IPC — Association Connecting Electronics Industries®

331

3000 Lakeside Drive, Suite 309 S Bannockburn, IL 60015 Phone: +1-847-615-7100 Fax: +1-847-615-7105 info@ipc.org Web: www.ipc.org Denny McGuirk, President +1 847-597-2841, DennyMcGuirk@ipc.org Neal Bender, Director of Membership +1 847-597-2808, NealBender@ipc.org IPC is a global trade association serving 2700 member companies worldwide in the electronics assembly and printed board industries. Through the contributions of our members, IPC supports the industry with standards, education, training, market research,and environmental and government relations programs. IPC has offices in the U.S., China and Europe. Visit the IPC bookstore and take advantage of special show prices on industry standards, publications and membership.

IPC Designers Council

331

IPC PCQR2 Database A Partnership between IPC and CAT, Inc.

405

Juki Automation Systems

715

3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015 ® Phone: +1 847-615-7100 Fax: +1 847-615-7105 Designers Council Web: http://dc.ipc.org Anne Marie Mulvihill, Manager, Designers Council +1 847-597-2827, AnneMarieMulvihill@ipc.org The IPC Designers Council is an international network of designers. Its mission is to promote printed board and printed board assembly design as a profession and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters. The Designers Council is a council under IPC with its own set of membership benefits. Visit http://dc.ipc.org for more information.

2595 86th Court West Northfield, MN 55057 Phone: +1 952-652-9033 Fax: +1 952-487-0877 dave.wolf@cat-test.info Web: www.pcbquality.com David L. Wolf, VP - Technical Marketing +1 952-652-9033, dave.wolf@cat-test.info Timothy A. Estes, Chairman & CEO +1 505-797-0100, tim.estes@cat-test.info CAT, Inc. is a global provider of market-critical data utilized by designers, purchasers, assemblers and manufacturers of printed boards, and by material and equipment suppliers to the printed board industry. The products and services offered by CAT Inc. provide quantitative data on printed board manufacturing capability, quality and reliability. These services include process capability panel and coupon design, precision electrical testing, and comprehensive data analysis. 507 Airport Boulevard Morrisville, NC 27560 Phone: +1 919-460-0111 Fax: +1 919-469-0480 Web: www.jas-smt.com Geron Ryden, Marketing Manager +1 919-460-0111, gryden@jas-smt.com Bob Black, President +1 919-460-0111, rjblack@jas-smt.com Juki manufactures high-quality SMT placement machines with over 21,000 systems shipped worldwide. Committed to outstanding service and support, Juki provides the lowest cost of ownership to its customers. Juki placement machines are backed by a 3 year full parts warranty in the Americas and Europe. Whether you operate in a high-speed or high-mix environment, Juki has a solution for you. Easy to operate and maintain, Juki machines will improve your production efficiency keeping you ahead of your competition. New Product

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Exhibitor Listings 816

MYDATA automation

525

MicroScreen LLC

716

NSWC Crane

617

MIRTEC Corp.

725

Omron Electronics

601

Kyzen Corporation

430 Harding Industrial Drive Nashville, TN 37211 Phone: +1 615-831-0888 Fax: +1 615-831-0889 contact_us@kyzen.com Web: www.kyzen.com Sherry Stepp, Product Manager +1 615-831-0888, sherry_stepp@kyzen.com Tom Forsythe, Vice President, Sales +1 615-831-0888, tom_forsythe@kyzen.com Kyzen provides award winning cleaning chemistries and services for electronics and advanced packaging applications. We offer a broad range of process solutions ranging from sprayable aqueous cleaning formulations to engineered vapor degreasing solvents. Kyzen also has a fully equipped applications lab staffed with experts to help with customer process development. A-Line Supplier

1106 South High Street South Bend, IN 46601 Phone: +1 574-232-4358 Fax: +1 574-234-7496 info@microscreen.org Web: www.microscreen.org Holly Wise, Technical Accounts Manager +1 574-232-4418, hollyw@microscreen.org Kathy Jenczewski, General Manager +1 574-232-4637, kathyj@microscreen.org Laser cut and electroformed stencils for printing solder paste. Options for lead free stencils include: high nickel content metal for improved paste release and green indentification for isolation. All stencils 100% inspected for integrity using ScanCheck AOI. Distributors of Wizard Frame System and Space Saver Frames. A-Line Supplier 1 Jacks Hill Road Oxford, CT 6478 Phone: +1 203-881-5559 Fax: +1 203-881-3322 sales@mirtec.com Web: www.mirtec.com Brian D’Amico, President +1 203-232-9343, bkdamico@sbcglobal.net Robert Horowitz, Regional Sales Manager +1 203-217-0271, r.horowitz@cox.net Global manufacturer and supplier of desktop, in-line (AOI) automatic optical inspection, and real-time x-ray inspection equipment. Among the many strengths are the ease of programming and the flexibility to be used anywhere in the manufacturing process.

The Morey Corporation

A-Line Supporter

100 Morey Drive Woodridge, IL 60517 Phone: +1 630-754-2300 sales@moreycorp.com Web: www.moreycorp.com Development engineering services plus manufacturing and delivery, all from one source. A-Line Supplier

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320 Newburyport Turnpike Rowley, MA 1969 Phone: +1 978-948-6919 Fax: +1 978-948-6915 Web: www.mydata.com Brain Duffey, President +1 978-948-6919, brian.duffey@mydata.com John McMahon, Director of Technical Services +1 978-948-6919, John.McMahon@mydata.com MYDATA automation AB designs and builds SMT placement machines and stencil-free printers for the electronics industry. Founded in Stockholm, Sweden, in 1984, MYDATA has rapidly built a global customer base in the surface mount industry. Its mission is to be always innovating in order to satisfy the electronic industry’s need for surface mount technology and services that meet the highest demands in terms of productivity and quality. New Product

300 Highway 361 Code GXSP, Building 3287E Crane, IN 47522 Phone: +1 812-854-1299 Dean May, Production Manager +1 812-854-3073, william.may@navy.mil Roger Smith, Branch Manager +1 812-854-6430, roger.r.smith@navy.mil The Emerging Critical Interconnect Technology Program (ECIT) is a cooperative venture between the electronics industry (IPC) and NAVSEA Crane. The ECIT program provides support for new material and product technology development through teaming arrangements with military, private industry, and academic parties. The intent of the program is to promote domestic research and development as well as accelerate the integration of new technology into warfighter applications. 1 Commerce Drive Schaumburg, IL 60173 Phone: +1 866-88-OMRON Fax: +1 847-285-8011 aoisales@omron.com Web: www.omron247.com Chris Speck, AOI Business Unit Manage +1 916-300-5898, chris.speck@omron.com Tim Anderson, AOI - Sales Support Manager +1 847-285-7330, Tim.Anderson@Omron.com Omron’s PCB inspection systems lead the AOI market with the fastest production speeds, 3D imaging, and patented technology to support demand for increased productivity with the highest quality and fast changeover. Omron offers inline and benchtop AOI systems for solder paste, pre- and post-reflow, using a Windows OS. Omron’s Q-UP Navi software enables customers to optimize the inspection process by providing software that assists in identifying, documenting and correcting the root cause of failures in the SMT process. New Product

Exhibitor Listings Panasonic Factory Solutions Company of America

307

909 Asbury Drive Buffalo Grove, IL 60089 Phone: +1 847-495-6100 Fax: +1 847-495-6095 pfsamarketing@us.panasonic.com Web: www.panasonicfa.com John Stewart, Regional Sales Manager +1 847-495-6239, PFSAmarketing@us.panasonic.com Mary Lynn Chandler, Account Manager +1 847-495-6059, PFSAmarketing@us.panasonic.com Panasonic Factory Solutions Company of America provides industry-leading, electronics assembly solutions that can improve manufacturers’ productivity, quality and profit through a combination of software, process, support and hardware offerings. Some of Panasonic’s latest solutions include the NPM, a fully integrated single-platform electronics assembly machine, and PanaCIM Enterprise Edition, a MES offering new levels of capability across your entire enterprise. New Product

Petroferm Inc.

409

Pillarhouse

317

3938 Porett Drive Gurnee, IL 60031 Phone: +1 847-244-3410 Fax: +1 847-249-6346 Customerservice@petroferm.com Web: www.petroferm.com Mike Savidakis, Market Manager +1 847-249-6826, msavidakis@petroferm.com

635 Touhy Avenue Elk Grove Village, IL 60007 Phone: +1 847-593-9080 Fax: +1 847-593-9084 sales@pillarhouseusa.com Web: wwww.pillarhouseltd.com Adrian De’Ath, Vice President +1 847-593-9080 x117, adriand@pillarhouseusa.com Jonathan Wol, President Pillarhouse USA +1 847-593-9080 x117, jwol@pillarhouseusa.com Pillarhouse offers a comprehensive line of selective solder machines to fit the needs of today’s ever changing production requirements. From single point to custom high speed multi dip processes, handling sizes from 1x1 to 24x48. Systems available in-line or hand load configurations. Pillarhouse offer windows interface, fiducial recognition, board warpage detection, closed loop wave height monitoring, universal tooling, multiple preheat options and more on our selective systems. New Product

PROMATION, Inc.

724

10411 Corporate Drive, Suite 104 Pleasant Prairie, WI 53158 Phone: +1 262-857-3100 Fax: +1 262-857-9847 sales@pro-mation-inc.com Web: www.Pro-mation-Inc.com Gary Goldberg, President & CEO Carl Ano, Marketing Manager +1 262-857-3100 x11, carl_ano@pro-mation-inc.com PROMATION provides a wide array of circuit board handling/routing systems, industrial conveyor solutions, and customized Robotic Soldering systems.

PVA

300

Q Corporation

714

Qualitek International Inc.

800

15 Solar Drive Halfmoon, NY 12065 Phone: +1 518-371-2684 Fax: +1 518-371-2688 info@pva.net Web: www.pva.net Frank Hart, Director of Mktg & Regional Sales +1 518-371-2684 x229, fhart@pva.net John Bova, Sales Manager +1 518-371-2684 x226, jbova@pva.net PVA is a global manufacturer of multi-axis robotic solutions for selective conformal coating and dispensing applications including meter-mix, potting, bonding, gasketing, solder paste, and surface mount adhesive processes. PVA platforms are also integrated for robotic soldering, spray flux, and automatic screw-driving cells. 301 River Street P.O. Box 730 Derby, KS 67037 Phone: +1 800-835-1099 Fax: +1 316-788-7428 qcorp@qcorporation.com Web: www.qcorporation.com Ben Swigart, President +1 316-788-3746, ben.swigart@qcorporation.com Paul Miller, Sales Manager +1 316-788-3746, paul.miller@qcorporation.com Q Corporation is a recognized world leader in component handling for surface mount technology and mass lead trimming. For 40 years, companies throughout the world have depended on Q quality to meet the most demanding production schedules.

315 Fairbank Street Addison, IL 60101 Phone: +1 630-628-8083 Fax: +1 630-628-6543 solder@qualitek.com Web: www.qualitek.com Debbie Liguori, Marketing Department +1 630-628-8083 x122, dliguori@qualitek.com Charlie Han, VP Sales & Marketing +1 630-628-8083 x112, chan@qualitek.com Qualitek International, Inc. A global provider of Soldering Solutions. Worldwide solder materials manufacturer. Lead & Lead Free Alloys, Sn100e Alloys, Solder Paste, Flux, Bar, Wire, BGA Spheres, Stencil Cleaners, Residue Removers, Rework Materials, Ceasolder Mask, Dross Eliminators and Cleaners. JT Lead Free Wave Soldering Systems and Reflow Ovens. BGA Rework Stations, Soldering Irons and Accessories. Metals reclamation service and full Solder Checkup Programs. Local technical support. Soldering materials sold in the U.S.A are made in the U.S.A. ISO 9001:2000 certified. New Product A-Line Supplier

A-Line Supplier

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Exhibitor Listings Richard J. Bagan, Inc.

732

RMD Instruments Corp.

504

1280 S. Williams Drive P.O. Box 169 Columbia City, IN 46725 Phone: +1 260-244-5115 x2121 Fax: +1 260-244-4158 Web: www.rjbagan.com Lydia McDevitt, VP, Sales & Marketing +1 800-552-5115, lmcdevit@rjbagan.com Bagan is a technical services company whose primary business divisions provide industrial electronic repair, precision calibration, and cable engineering to support manufacturing, military, and scientific industries worldwide. **Participant in the Acceptability, Reliability and Failure Analysis Testing Corridor.** 44 Hunt Street Watertown, MA 2472 Phone: +1 617-668-6901 Fax: +1 617-926-9743 leadtracer@rmdinc.com Web: www.rmd-leadtracer.com Paul Delmonico, Sales Coordinator +1 617-668-6908, pdelmonico@rmdinc.com Steve Glass, WEEE/RoHS Buisness Development Manager +1 805-432-5199, sglass@rmdinc.com The Award Winning LeadTrecer-RoHS is the most effective XRF System designed specifically for screening of all RoHS/WEEE and Common Elements in electronics including China RoHS. LeadTracer-RoHS analysis of entire energy spectrum eliminates the limited capability of surface measurements by the x-ray tube XRF systems.

Robisan Laboratory Inc.

730

6502 E. 21st Street Indianapolis, IN 46219 Phone: +1 317-353-6249 Fax: +1 317-917-2379 Web: www.robisan.com Chris Mahanna, President, Technical Manager +1 317-353-6249, cmahanna@robisan.com Theresa Nusbaum, Office Manager +1 317-353-6249, tnusbaum@robisan.com Robisan Laboratory provides acceptability, reliability and destructive physical/ failure analysis for the PB and PBA industry. We are very proud to offer one day turn PB structural integrity testing. We support IPC, military, and other commercial standards. Our scope includes: microsections, thermal cycling, thermal shock, NextGen thermal stress, SIR (continuous), ECM, CAF, cleanliness, solder joint analysis, underfill testing and more. **Participant in the Acceptability, Reliability and Failure Analysis Testing Corridor and Forums. See page 13.**

Rogers Corporation

502

100 S. Roosevelt Avenue Chandler, AZ 85226 Phone: +1 480-961-1382 Fax: +1 480-961-4533 Web: www.rogerscorp.com Rogers is a global technology leader providing high performance printed circuit materials for use in high frequency applications. Rogers will be showcasing their RO4000® LoPro™ laminates, RT/duroid® 6202PR along with their well known RT/duroid 5000, RT/duroid 6000, RO3000®, and TMM® laminates.

Senju Comtek

600

SM Contact/KM USA

609

SMT Magazine

327

SPEA AMERICA

315

20300 Stevens Creek Blvd., Suite 300 Cupertino, CA 95014 Phone: +1 408-446-7856 Fax: +1 408-253-2140 sales@senjucomtek.com Web: www.senju.com Derek Daily, General Manager +1 408-446-7866, sales@senjucomtek.com R. Hiro Suzuki, President & CEO Senju Metal Industry Co. (SMIC) is a global leader in solder materials and related equipments. Senju’s ECO Solder™ Lead Free materials include the world’s most widely used GRN360 and the newest S70G series. ECOPASCAL wave soldering system incorporates innovative pump technology for the hightest and most stable wave pressure. As a total solution provider, Senju offers the latest soldering technologies in the industry. 5951 Loeb Road, Suite 140 Charlevoix, MI 49720 Phone: +1 231-237-9060 Fax: +1 231-237-9345 john@KMUSALLC.com Web: www.KMUSALLC.com KM USA provides solutions for various manufacturing processes. Our latest line is advenced technology for Splice Crimping and solder application. Along with it’s popular high quality crimping applicators, KM USA can provide the latest technology for complete wire processing, wire to component connection, advanced soldering solutions, pin insersion, and PCB processing. With the ability to provide customized automation solutions for your product, it’s hard to find something we can’t do! **See our advertisement on page 17!**

98 Spit Brook Road Nashua, NH 3062 Web: www.smtonline.com SMT Magazine provides greater technical depth than any other publication of its type for OEMs and EMS providers who design, assemble, and test surface mounted printed circuit boards. The monthly magazine, Web site, biweekly E-Newsletter, and Webcasts provide the latest information and analysis on technological developments and industry trends in surface mount assembly. SMT has more than 40,000 subscribers who request SMT, all 100% qualified with purchasing power. **See our advertisement on page 42!**

2609 SSW Loop 323 Tyler, TX 75701 Phone: +1 903-595-4433 Fax: +1 903-595-5003 Web: www.spea.com David Buhrkuhl, President +1 903-595-4433 x101, davidp@speaamerica.com Heidi Lockridge, Office Aministrator +1 903-595-4433, heidil@speaamerica.com SPEA is exhibiting both the highly successful 4040 Flying Probe tester with the new MultiProbe technique, and the 3030 ICT machine with dual stage capability to perform simultaneous ICT and FLASH programming on two boards. Launched last year in Europe to critical acclaim, this range of highly modular test systems is now available in the Americas. Badge Lanyard Sponsor

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Exhibitor Listings Trace Laboratories, Inc.

726

U.S. Tech

426

5 North Park Drive Hunt Valley, MD 21030 Phone: +1 410-229-4384 Fax: +1 410-584-9099 info@tracelabs.com Web: www.tracelabs.com Trace Laboratories is a US based, internationally accredited, full service testing and analysis company, with two state-of-the-art laboratories in Maryland and Illinois. Trace can address the full scope of your test and analysis requirements. Our professionals have over 25 years experience with programs requiring strict adherence to existing specifications and custom programs designed around a specific requirement or company need. **Participant in the Acceptability, Reliability and Failure Analysis Testing Corridor and Forums. See page 13.** 10 Gay Street Phoenixville, PA 19460 Phone: +1 610-783-6100 Fax: +1 610-783-0317 ustech@gim.net Web: www.us-tech.com Jacob Fattal, Publisher +1 610-783-6100, ustech@gim.net Walter Salm, Editor +1 732-616-4716, wgsalm@gmail.com US TECH, a monthly international hi-tech electronics publication reaches over 200,000 design engineers, manufacturing & production managers,buyers, product specifiers, and corporate management on the web and in print. We focus on new innovations in SMT, PCB design & fabrication, contract assembly, test equipment, components & distribution, and alternate energy technologies.

Uyemura International Corporation

415

3990 Concours Street, Suite 425 Ontario, CA 91764 Phone: +1 909-466-5635 Fax: +1 909-466-5177 Web: www.uyemura.com Anthony R. Revier, President +1 909-466-5635, trevier@uyemura.com Donald Walsh, National Sales Manager/Director of Operations +1 860-793-4011, dwalsh@uyemura.com Final finishes: electroless nickel/immersion gold, RGA immersion silver, RMK immersion tin and DIG immersion gold over copper. Uyemura’s electroless gold and palladium products; high throw electrolytic nickel; acid copper (including market leading via fill copper—EVF); Umicore Galvanotechnik ‘s precious metal electrolytic plating processes and MEC’s specialty copper etching processes. **See our advertisement on the inside back cover!**

Viscom Inc.

408

1775 Breckinridge Parkway, Suite 500 Duluth, GA 30096 Phone: +1 678-966-9835 Fax: +1 678-966-9828 Web: www.viscom.com Verena Zurhausen, Marcom Manager +1 678-966-9835, vzh@viscomusa.com Eric J. Moen, Regional Sales Manager - East +1 678-966-9835, Eric.Moen@viscomusa.com Full range of automatic optical (AOI) and X-ray (AXI) inspection equipment for PCB assembly. In-line inspection of paste, placement, post-reflow, post-wave, and selective solder. 100% solder joint inspection, including lead-free, to IPC standards. Highspeed and high performance solutions, 3D. Microelectronics inspection equipment for wire bond, thick film, and conductive glue.

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YESTech

501

ZESTRON America

625

2762 Loker Avenue West Carlsbad, CA 92010 Phone: +1 760-918-8471 Fax: +1 760-918-8472 sales@yestechinc.com Web: www.yestechinc.com Don Miller, President +1 760-918-8471, Don.miller@yestechinc.com YESTech provides award-winning AOI and X-Ray inspection solutions for electronic manufactures. Our High Speed AOI systems are configurable with 5 megapixel top down and 4 side viewing cameras to inspect for part presence, position, correct part, polarity and solder. The new X3 X-Ray system’s proprietary technology provides unsurpassed 3-D inspection capability for BGA’s and other hidden solder joints on double-sided PCBs. YESTech’s advanced SPC software is available with all systems to provide real-time yield information. 11285 Assett Loop Manassas, VA 20109 Phone: +1 703-393-9880 Fax: +1 703-393-8618 infoUSA@zestron.com Web: www.zestron.com Sabine Braun, Marketing Specialist +1 703-393-9880, S.Braun@zestronusa.com Michael McCutchen, National Sales Manager +1 703-393-9880 x13, m.mccutchen@zestronusa.com Precision cleaning products and services for all required applications in the electronics manufacturing industry. ZESTRON’s unique MPC technology (HMIS rating 0-0-0) gives water-based cleaning agents the performance of solventbased cleaners. ZESTRON’sstate-of-the-art Application Technology Centers enable us to tailor our products specifically to your process requirements and provide the technical know-how for timely product quality assessments. New Product

Advertiser Index Ace Production Technologies . . . . . . . . . . . . 9 CircuiTree . . . . . . . . . . . . . . . . . . . . . . . . . . 35 CyberOptics . . . . . . . . . . . . . . . . . . . . . . . . . 11 EMSNow . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 EMTWorldWide . . . . . . . . . . . . . . . . . . . . . . 37 I•Connect007 . . . . . . . . . . . . . . . . . . . . . . . 31 SM Contact/KM USA . . . . . . . . . . . . . . . . . . 17 SMT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Uyemura USA . . . . . . . . . . . Inside back cover

Uyemura Final Four IPC Midwest Ad

7/31/09

6:21 PM

Page 1

UYEMURA has the ULTIMATE “Final Four!”

Our Final Finishes are Your Competitive Edge!

RGA Immersion Silver deposits only on copper. Exceptional distribution meets the needs of high-density mounting. Stable bath – Low temperature; no attack of substrate or solder mask. Uyemura is a leading supplier of immersion silver! ENIG KAT Electroless Nickel/ Immersion Gold produces a uniform mid-phos EN deposit with a thin topcoat of immersion gold, over copper. High corrosion-resistance; solderable, and aluminum wire bondable. Runs at least 10°F below competitive products. Plus, no “dummy plating” needed! Uyemura is #1 for ENIG in North America! RMK-20 Immersion Tin deposits a uniform co-planar tin surface over copper; superior thickness distribution. Ideal for lead-free soldering. Meets the needs of soldering and press fit connections. DIG Direct Immersion gold on copper – the ultimate replacement for OSP finishes – and only Uyemura has it! Deposits a 1-2 micro inch coating of immersion gold directly on copper. Ideal for lead-free, high-temperature assembly. Also ask about Electroless Gold – another Uyemura technology exclusive!

UYEMURA USA Corporate Headquarters: Ontario, CA • ph: (909) 466-5635 (800) 969-4842 • fax: (909) 466-5177

See us at IPC Midwest, booth #415

Tech Center: Southington, CT • ph: (860) 793-4011 (800) 243-3564 • fax: (860) 793-4020

www.uyemura.com

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There’s no other show like it in the world!

Conference & Exhibition April 6–8, 2010

Solve your manufacturing challenges, visit hundreds of exhibitors and meet thousands of peers and industry experts in electronics assembly, test, and board design and manufacture.

Meetings & Education April 6–9, 2010 Mandalay Bay Resort & Convention Center Las Vegas, Nevada USA www.IPCAPEXEXPO.org

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Benefit from the industry’s premier technical conference, full- and half-day educational courses and IPC standards development meetings. Focus on test technologies, advanced packaging, SMT processes, materials and environmental regulations. Pre-register for free exhibit hall admission and take advantage of free keynotes, posters, forums and networking events.

See you next year! September 27–October 1, 2010

Renaissance Schaumburg Hotel & Convention Center Schaumburg, Ill www.IPCMidwestShow.org shows@ipc.org • 877-472-4724 (U.S./Canada)