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Conference & Exhibition April 6–8, 2010 Meetings & Education April 6–9, 2010 Mandalay Bay Resort & Convention Center Las Vegas www.IPCAPEXEXPO.org +1 847-597-2860 • shows@ipc.org
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Put the resources of the world’s premier technical conference and exhibition for printed boards, design, electronics manufacturing and test within your reach. Join your colleagues and an international audience of more than 10,000 in exciting Las Vegas for education, networking and standards development. There’s no other event like it in the world!
This event is … Produced by: IPC — Association Connecting Electronics Industries® Sponsored by: • China Printed Circuit Association (CPCA) • European Institute of Printed Circuits (EIPC) • Hong Kong Printed Circuit Association (HKPCA) • Indian Printed Circuits Association • International Electronics Manufacturing Initiative (iNEMI) • International Microelectronics and Packaging Society (IMAPS) • Japan Electronics Packaging and Circuits Association (JPCA) • Japan Robotics Association (JARA) • JEDEC Solid State Technology Association • Korea Printed Circuit Association (KPCA) • Microelectronics Packaging and Test Engineering Council (MEPTEC) • Surface Mount and Circuit Board Association (SMCBA) • Taiwan Printed Circuit Association (TPCA)
What do your colleagues think of IPC APEX EXPO? “This is the best gathering of technical people in the world. Networking with these individuals is priceless and you will always leave with more information and new contacts to help you achieve your goals and objectives.” Leo Lambert, Vice President/Technical Director, EPTAC Corp. See more testimonials on page 12.
In cooperation with: • ASSEMBLY • Circuit Cellar • Circuitnet • CircuiTree • Circuits Assembly • Dempa Publications, Inc. • Electronics Assembly • EMChina.org.cn • EMSNow • EMT Worldwide • Equipment Protection • Global PCB Marketplace • Global SMT & Packaging • IConnect007 • MDeviceNow.com
• Medical Product Outsourcing • Metal Finishing • Printed Circuit Design & Fab • Printed Circuit Journal • Reed Business Information Asia • SMT • Test & Measurement World • THERMAL News • U.S. Tech • Wiring Harness News
Show off your creative talent and jump into YouTube stardom! We’re celebrating 10 years of APEX with a video contest. Let your creative juices flow! See page 29 for details.
The show, conference and meetings will take place at the Mandalay Bay Resort & Convention Center 3950 Las Vegas Blvd. South, Las Vegas, Nevada USA
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Welcome Thriving on change and new opportunities … and doing it better The past 18 months have taken a toll on many in our industry, but as painful as change can be, it can also be renewing and strengthening. As we forge ahead, we must each make a commitment to doing it better — we must continue building our knowledge base, expanding our network of industry resources and business contacts, and breaking new ground through innovation. To help you achieve this, I invite you to join us at IPC APEX EXPO 2010 and surround yourself with the information, experts and ideas to Discover! Connect! and Thrive! Discover new solutions, new resources, new ideas, and new opportunities to capitalize on to add vitality to your performance and future success. Connect with experts in our industry and build your professional network of business contacts, industry colleagues and industry resources. Thrive by applying the knowledge you gain from the technical conference, courses, exhibition and collegial interchange back at work to make a difference in your company’s profitability and performance. Once again, industry leaders from around the world will be on hand to share the latest technologies, innovations, processes, equipment, best practices, and solutions to address your most vexing challenges. Join together with your colleagues at IPC APEX EXPO 2010 for an intense period of learning and networking, and take charge of the new opportunities that await with renewed strength. My very best wishes to you, Nilesh S. Naik CEO OneSource Group
Table of Contents Schedule of Events . . . . . . . . 2
Technical Conference . . . . .
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Who’s Exhibiting . . . . . . . . . 3
IPC Standards Development . . Meetings
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Special Events . . . . . . . . . . On the Show Floor . . . . . . . Free Forums . . . . . . . . . . Keynote Sessions . . . . . . . More Networking Activities . .
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10th Anniversary Video Contest 29 Professional Development . . . Courses
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Programs for Designers . . . .
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Hotel & Travel . . . . . . . . .
Programs for Executives . . . .
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Registration Options . . . . . . IBC
Policies Any function that is not part of the “official program” is prohibited, from the first meeting to the close of the event. IPC does not permit solicitation by nonexhibiting companies. Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event will be asked to leave immediately.
www.IPCAPEXEXPO.org
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Schedule of Events Exhibits Open Tuesday, April 6 Wednesday, April 7 Thursday, April 8
1:30 pm–4:30 pm 10:00 am–6:00 pm 10:00 am–6:00 pm 10:00 am–2:00 pm
Monday, April 5 1:00 pm–5:30 pm IPC Standards Development Committee Meetings 5:30 pm–6:30 pm Chairmen’s Reception (By Invitation only) 5:30 pm–6:30 pm
International Reception
Tuesday, April 6
Free Forums
3:30 pm–4:30 pm Poster Presentations by Authors 5:00 pm–6:00 pm Free Show Floor Reception
Thursday, April 8 8:00 am–5:00 pm IPC Standards Development Committee Meetings 8:00 am–6:30 pm
IPC Designers Day & Reception
9:00 am–12:00 pm Half-day Professional Development Courses 9:00 am–11:45 am Technical Conference Sessions
7:30 am–8:30 am IPC First-Timers’ Welcome Breakfast
10:00 am–2:00 pm
Exhibits Open
10:30 am–12:00 pm
Free Forum
8:30 am–9:30 am FREE! Opening Keynote Session
2:00 pm–5:00 pm Half-day Professional Development Courses
9:45 am–10:00 am Ribbon-Cutting Ceremony
Friday, April 9
10:00 am–5:00 pm IPC Standards Development Committee Meetings
8:00 am–5:00 pm IPC Standards Development Committee Meetings
10:00 am–6:00 pm
9:00 am–12:00 pm Half-day Professional Development Courses
Exhibits Open
12:00 pm–1:30 pm IPC Annual Meeting and Luncheon 1:30 pm–4:45 pm Technical Conference Sessions 1:30 pm–4:45 pm
Free Forums
Wednesday, April 7 7:30 am–8:30 am Women in Electronics Breakfast 7:30 am–9:00 pm IPC PCB Executive Management Meeting & Dinner 7:30 am–9:00 pm IPC EMS Management Council Meeting & Dinner 8:00 am–9:30 am FREE! Keynote Session — Global Business Outlook 8:00 am–5:00 pm IPC Standards Development Committee Meetings
2:00 pm–5:00 pm Half-day Professional Development Courses * Select IPC Standards Development Committee Meetings will take place on Saturday, April 3 and Saturday, April 10. All events in gold are FREE with pre-registration As of October 28, 2009. Subject to change.
Ways to Save! • Pre-register for any paid activity and save $200 with promo code APEX10. • Register by March 5, 2010 and save 20% off all paid activities. www.IPCAPEXEXPO.org/register
9:00 am–11:45 am Technical Conference Sessions 10:00 am–6:00 pm
Exhibits Open
10:30 am–11:30 am
Free Forum
12:00 pm–1:30 pm
IPC Awards Luncheon
1:30 pm–3:30 pm Technical Conference Sessions
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Who’s Exhibiting Tuesday, April 6 10:00 am–6:00 pm Wednesday, April 7 10:00 am–6:00 pm Thursday, April 8 10:00 am–2:00 pm See and compare equipment. Discover new processes to gain greater efficiency. Find suppliers to save you hundreds of thousands of dollars. Uncover new solutions that will improve your bottom line. Every year, attendees tell us that they’ve learned something important or found a critical new supplier, often with a big impact on their companies. That can be your story too! Exhibits Only registration is FREE to individuals who pre-register online at www.IPCAPEXEXPO.org. 3M Electronic Solution Division
Brock Electronics
Dage Precision Industries, Inc.
AccuAssembly
BTU International
Datapaq, Inc.
Acculogic, Inc.
Bürkle North America, Inc.
DEK International
ACE Production Technologies, Inc.
C. A. Picard Inc.
Dempa Publications, Inc.
Aegis Industrial Software Corporation
cab Technology, Inc.
Digitaltest Inc.
CAC, Inc.
DIS Inc.
Agilent Technologies
Caltex Scientific
Diversified Systems, Inc.
AIM
Calumet Electronics
Dow Electronic Materials
Air Products
Camtek USA
DuPont Electronic Technologies
AIR-VAC Engineering Co.
CCI
Eastman Kodak Company
Airtech International, Inc.
Cencorp
ECD - Electronic Controls Design
Almit Co., Ltd.
Chad Industries
ECI Technology
AmeriVacS
CheckSum
EFD, Inc. A Nordson Company
APE.com
CHEMCUT Corporation
EIPC
Apexyl Enterprises Ltd.
China Printed Circuit Association
Electro-Comp Services, Inc.
Apollo Seiko Ltd.
Christopher Associates, Inc.
Electronics Assembly
APS NOVASTAR
Cincinnati Sub-Zero Products, Inc.
EMCHINA
Aqueous Technologies
Circuit Check, Inc.
EMT Worldwide
Arlon Materials For Electronics
Circuitnet
Equipment Protection
ASC International
CircuiTree
Equipment Technologies, Inc.
Ascentec Engineering
Circuits Assembly
ERSA North America
Ascentech, LLC
Cirris Systems
ESSEMTEC
Assembléon America
Cogiscan Inc.
Europlacer North America
ASSEMBLY
Computrol, Inc.
Everett Charles Technologies
Asymtek
Conductor Analysis Technologies Inc.
FASTechnologies, Corp.
ASYS Inc. Austin America Technology Group
Control Micro Systems, Inc.
Finetech
Bare Board Group, Inc.
Count On Tools, Inc.
FKN Systek, Inc.
Beamworks, Inc.
Crystal Mark, Inc.
FocalSpot, Inc.
BigC.com
Custer Consulting Group
Blackfox Training Institute, LLC
CyberOptics Corporation
www.IPCAPEXEXPO.org
FEASA
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Who’s Exhibiting (continued) Fuji America Corporation
ITC Intercircuit
Oak Mitsui Inc.
Gardien Services USA Inc.
OEM Press Systems, Inc.
Generon IGS
JPCA — Japan Electronics Packaging & Circuits Association
Glenbrook Technologies, Inc.
JTAG Technologies
OMG Electronic Chemicals
Global Laminates, Inc.
Juki Automation Systems
Omni Training
Global PCB Marketplace
KIC
Omron Electronics
Global SMT & Packaging
Koh Young Technology, Inc.
On Site Gas Systems, Inc.
GOEPEL Electronics
Kyzen Corporation
Orbotech
Gordon Brush Mfg. Co., Inc.
L.C.O.A. Laminating Company of America
Ovation Products
GPD Global Guangdong Shengyi Sci. Tech. Co. Ltd.
Lewis & Clark, Inc. M.E.T. (Metal Etching Technology)
Ohmega Technologies Inc.
P. Kay Metal, Inc. Pac Tech USA Packaging Technologies, Inc.
Heller Industries
M+B Plating Racks Inc.
Henkel Corporation
MacDermid Inc.
Panasonic Factory Solutions Company of America
HEPCO, Inc.
Machine Vision Products, Inc.
Para Tech Coating, Inc.
Heraeus
Malcomtech International
Pentagon EMS
Hesse & Knipps
Manncorp
Petroferm Inc.
HIROX-USA, Inc.
Matrix USA Inc.
Phibro-Tech, Inc.
Hitachi High Technologies America
MDEVICENow.com
Photo Stencil
Hitachi Via Mechanics (USA), Inc.
Medical Product Outsourcing
Pillarhouse USA
HIWIN Corporation
MEPTEC
Plasma Etch, Inc.
HMS Hoellmuller Maschinenbau GmbH
Metal Finishing
Precision PCB Products
Metris USA/X-Tek
Precision Placement Machines
Hong Kong Printed Circuit Assn.
Metro SMT Ltd.
Printed Circuit Design & Fab
HumiSeal - Chase Specialty Coatings
MicroCraft
Printed Circuit Journal
Micron Laser Technology
Production Solutions, Inc.
I & J Fisnar Inc.
Microscan Systems, Inc.
I Source Technical Services, Inc.
MicroScreen LLC
Productivity Systems Associates, LLC
IBE SMT Equipment
Microtek Labs
ProEx
I•Connect007
Mid America Taping & Reel
Prototron Circuits
IMAPS
Milara Inc.
PVA
Indium Corporation
MIRTEC Corp.
QA Technology Company, Inc.
Inovaxe Corporation
MYDATA automation Inc.
QRP, Inc.
InsulFab PCB Tooling
NBS
Qualitek International Inc.
Integrated Process Systems, Inc.
Nihon Superior Co., Ltd.
Quality Tech Tool
Interconnect Systems, Inc.
North Star Imaging, Inc.
QxQ, Inc.
Intuitive & Cimnet Systems, Consona ERP Solutions
NSWC Crane Division
RBP Chemical Technology
Nujay Technologies, Inc.
Real-Time With...IPC
Nutek Americas Inc.
Rehm Thermal Systems
Nu-Way Electronics
Rematek - ATE
IP Systems LLC Isola Group
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Sony Manufacturing Systems America, Inc.
Transition Automation, Inc.
Samsung Techwin Ltd./Dynatech Technology, Inc.
SPEA America
U.S. Tech
Specialty Coating Systems
Unicote - Halco LLC
Saturn Electronics Corporation
Speedline Technologies, Inc.
United Resin Corporation
ScanCAD International, Inc.
Stoelting LLC
Uyemura International Corporation
Schleuniger, Inc.
Taiwan Printed Circuits Journal
Valor Computerized Systems
Schmid Systems Inc. USA
Taiwan Union Technology Corp.
Viscom Inc.
Scienscope International
Taiyo America, Inc.
ViTechnology
SEICA Inc.
TDK - LAMBDA AMERICAS
Vitronics Soltec
Seika Machinery, Inc.
Technic Inc.
VJ Electronix
Semco Packaging & Applications Systems
Technical Devices Company
V-TEK Incorporated
Test & Measurement World
Senju Comtek
Wiring Harness News
Test Research USA, Inc.
Siemens Electronics Assembly Systems
Wise srl
Texmac/Takaya Corporation
XJTAG
THERMAL News
X-Line Assets
Ticer Technologies
YesTech, Inc.
Tintronics Industries
YXLON International Inc.
Tongling Haorong Electronic Technology
ZESTRON America
TopLine
As of October 29, 2009
Rogers Corporation Saki Corporation
Simplimatic Automation Smart Sonic Stencil Cleaning Systems SMT SMT Technologies Sonoscan, Inc.
Tresky Corporation
Totech America Corporation
Online Exhibit Hall Extend your trade show experience beyond the show floor! Create your personal planner for the event by using the “My APEX EXPO Planner” function of our new online exhibit hall at www.IPCAPEXEXPO.org/exhibitors. Search for companies by keyword, category, name, or by using the “Featured Exhibitors” section of the site. View exhibiting companies on the floor plan, and add them to your agenda! Access photos, audio and video presentations, new products and services listings, press releases, company contacts, and more — it’s all at your fingertips in the Online Exhibit Hall. Visit often! Exhibitors are adding new information daily.
www.IPCAPEXEXPO.org/exhibitors
www.IPCAPEXEXPO.org
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Special Events
On the Show Floor Innovative Technology Center (ITC) Cutting-edge products and services that have been selected by an expert technology panel will be on display in the ITC. Get a sneak preview of the equipment, materials and services that break new ground in our industry.
IPC Bookstore — Save 25% on Training DVDs! Informational resources to enhance the work you do, help train your staff and support your company’s strategic planning efforts are waiting for you in the IPC bookstore on the show floor. • Browse industry standards on design, board fabrication and assembly. • Check out IPC training and certification programs. • Review IPC’s catalog of multimedia training resources, including DVDs, interactive CD- ROMs, online video resources, training and reference guides, wall posters and image archives. • Learn about IPC’s management programs, market research reports and technology roadmaps. Member prices will be extended to all attendees on-site, even if you aren’t one! And, save 25% on all IPC training DVDs … any quantity … any IPC title … only during show hours. While you’re at the bookstore, pick up a new IPC publications catalog and a free standards development CD.
All-Academic Poster Competition Get Out and Vote! In a collegial spirit we’re showcasing the best posters from international colleges and universities with a strong focus on the electronics industry. Your mission is to help IPC determine the top three. Visit the exhibition to view the posters and cast your vote. Winners will be announced in Las Vegas during the Show Floor Reception on Wednesday, April 7.
FREE Show Floor Reception Wednesday, April 7 : 5:00 pm–6:00 pm Put down the Blackberry’s, set the cell phones on vibrate, and take a few moments to kick back with your colleagues for our very own happy hour, replete with beverages, munchies and lots of friends to catch up with and friends to make. Take a casual stroll through the exhibition, scope out all the goodies the exhibitors have to offer, and be sure to check out the academic poster competition and place your vote for the winner.
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Free Forums (… on the Show Floor) Free education to maximize your return on time invested! Visit www.IPCAPEXEXPO.org/free-forums for more information. FF01 Test & Inspection Summit Tuesday, April 6 : 1:30 pm–3:00 pm Moderator: Rick Nelson, Test and Measurement The emergence of 3-D chips is posing test challenges to board and system designers as well as chip makers. Designers and manufacturers will have to pay particular attention to design-for-test techniques, leveraging the DFT that chip makers provide to support PCB test, field diagnostics, and field firmware upgrades. Building on the 2009 Summit, a panel of experts will discuss the latest test challenges and the technologies that are emerging to deal with them, including JTAG/boundary-scan test and vectorless test techniques as well as the continued role of in-circuit electrical test, optical inspection, X-ray inspection and functional electrical test.
FF02 DoD/IPC Roadmap Tuesday, April 6 : 3:15 pm–4:45 pm Charged with the development and implementation of a PCB and interconnect technology roadmap for the Department of Defense (DoD), the DoD Executive Agent (EA) is required to create a policy to ensure that the DoD has access to PCB manufacturing capabilities and the technical expertise necessary to meet future military requirements. To assist the EA, leading North American printed board manufacturers on the IPC Executive Agent Task Force created a roadmap to identify the challenges printed board designs and materials will need to overcome to meet future DoD and OEM needs. This forum will cover the various sections of the roadmap and how the roadmap will: 1. Match technology capability with product performance requirements, and 2. Sustain and build upon a North American printed board industry capable of supporting DoD needs and ensuring national security.
FF03 Changing Environment of
Printed Circuit Board Technology and the Evolution of Safety
Wednesday, April 7 : 1:30 pm–3:00 pm Moderator: Carl Wang, Underwriters Laboratories Inc. UL has been in the forefront in research in many product areas and has recently been very active in the area of printed boards. Learn the details of UL’s recent and ongoing PCB research, including possible changes in test methods, requirements and standards, in order to accommodate the quickly changing board and material technologies. Hear how your company can use UL labs and technical experts to collaborate on new research.
www.IPCAPEXEXPO.org
FF04 Don’t Be Surprised by the New RoHS
Thursday, April 8 : 10:30 am–12:00 pm Moderator: Fern Abrams, IPC The Eu RoHS Directive had an enormous impact on the electronics industry and, now, the European Union is at it again. Our panel of experts will discuss proposed changes to the RoHS Directive that are currently being debated in Europe, including a new and broader scope of covered electronics, additional substance restrictions and a new compliance program under the CE mark.
FF05 IPC Technology Roadmap Wednesday, April 7 : 3:00 pm–4:30 pm Moderator: Jack Fisher, Interconnect Technology Analysis, Inc. Wouldn’t it be nice to have a yellow brick road to follow to business success? Unfortunately, nothing in business is that simple. Companies spend considerable time understanding the needs and wants of their customers and trying to figure out the direction technology is moving. But is their data comprehensive? And what about opportunities to enter new markets or extend beyond a current customer base? The IPC Technology Roadmap provides fabricators, EMS companies, designers, and materials and equipment suppliers with a consolidated view of today’s solutions and tomorrow’s needs for the printed board and assembly supply chain. This seminar will provide attendees with an understanding of the critical information contained in the roadmap and explain how it can be used to develop business and market strategies, and to validate and justify capital investment or to guide development activities. Learn how the IPC Technology Roadmap can become a part of building your own yellow brick road!
FF06 Solar Panels: New Opportunities for Electronics
Wednesday, April 7 : 10:30 am–11:30 am Dongkai Shangguan, Ph.D., Flextronics Corporate Technology Group Green is hot! And it looks like there’s nothing greener than solar. What opportunity does this offer for you? How will electronics support the “green wave” to solar power? Join us for this forum on technology and opportunity!
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Special Events
FREE Keynote Sessions Achieving Strategic Balance: Integrating Global Security Solutions in the New Operational Landscape Jeff Wilcox, Vice President, Corporate Technology & Engineering, Lockheed Martin Tuesday, April 6 : 8:30 am–9:30 am In his keynote address, Jeff Wilcox will address the challenge of developing a full spectrum of global security solutions that strike a strategic balance between conventional and unconventional missions. He will discuss how Lockheed Martin’s Engineering and Technology Enterprise is meeting this challenge and what that will mean to the global electronics industry. Wilcox will describe the four types of innovation the company is bringing to bear to engineer affordable solutions in the new operational landscape.
Global Business Outlook: Where Do We Go Next? Walt Custer, President, Custer Consulting Sharon Starr, Director of Market Research, IPC Wednesday, April 7 : 8:00 am–9:30 am Are the challenges of 2009 behind us? Walt Custer and Sharon Starr will team up to present the latest data and market trends for the electronics industry. Going well beyond a discussion of the challenging global economy, both speakers will present leading indicators and discuss how seasonal and cyclical trends affect the industry and its supply chain. Custer will share key insights into the electronics equipment and component markets. He will also reveal business performance by the leading companies worldwide by industry sector. Starr will bring IPC survey data to the discussion to share the latest trends in demand and production for worldwide PCB, EMS and supplier industries. The session would not be complete without the crucial forecasts she will divulge to help attendees plan for the future.
IPC Government Relations Committee OPEN MEETING Thursday, April 8 : 9:00 am–10:00 am What are your international, national, and regional concerns regarding government regulations, legislation, and international trade? How can IPC help make your business more profitable? Find out what you need to know about key lobbying issues from members of the IPC Government Relations Committee.
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More Networking Activities FREE Show Floor Reception
Industry Awards
Wednesday, April 7 : 5:00 pm–6:00 pm
18th Annual SMT Vision Awards
Put down the Blackberry’s, set the cell phones on vibrate, and take a few moments to kick back with your colleagues for our very own happy hour, replete with beverages, munchies and lots of friends to catch up with and friends to make. Stroll through the exhibition, scope out all the goodies the exhibitors have to offer, and place your vote for the academic poster competition winners.
FREE International Reception Monday, April 5 : 5:30 pm–6:30 pm Our international friends are invited to relax, have a bite to eat and meet their colleagues from more than 50 countries during this festive gathering.
FREE First-Timers’ Welcome Breakfast Tuesday, April 6 : 7:30 am–8:30 am Maximize your time at IPC APEX EXPO with some advice from a few insiders. Enjoy a continental breakfast while your colleagues share the ins and outs of IPC and this event. Learn how to put IPC’s resources to use for you and your company and find out how to take advantage of everything this event has to offer. Even if you’re not a first-timer, join us for a refresher course on IPC programs and activities.
Monday, April 5 : 6:30 pm–8:00 pm
Best in Test® Awards (by invitation only) Tuesday, April 6 : 6:00 pm–9:00 pm
Circuits Assembly New Product Introduction and Service Excellence Awards Wednesday, April 7 : 5:00 pm–6:00 pm
Printed Circuit Design & Fab New Product Introduction Award Wednesday, April 7 : 5:00 pm–6:00 pm
IPC and California Circuits Association Golf Tournament Reception & Dinner TBA Visit www.IPCAPEXEXPO.org for information as it becomes available.
FREE Women in Electronics Networking Breakfast Wednesday, April 7 : 7:30 am–8:30 am Last year’s event was standing room only, so it’s back by popular demand! Women are making a greater impact in all areas of the electronic interconnect industry. Join your colleagues from across the supply chain to share your ideas and experiences as a woman and build your industry network. Please RSVP for this free meeting through the online registration process. For more information, contact MaryMacKinnon@ipc.org.
Luncheons (registration required) IPC Annual Meeting and Luncheon
IPC Awards Luncheon
Tuesday, April 6 12:00 pm–1:30 pm
Wednesday, April 7 12:00 pm–1:30 pm
www.IPCAPEXEXPO.org
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IPC Programs
… for Designers Designers Day Thursday, April 8 : 8:00 am–6:30 pm It’s a full-day program of education and networking for individuals interested in design, including those working in engineering, manufacturing, sales and management. In addition to the educational program, Designers Day registration includes: • Networking reception following the conference • Free admission to the exhibit hall — including lunch there on Thursday • Standards development meetings • Keynote sessions, free forums and poster sessions
AGENDA 8:00 am
Welcome
8:30 am–9:45am
Keynote: Roadmap of the Future for Electronic Design Dieter Bergman, IPC
10:00am–11:30 am
HDI: 21st Century Design Dan Smith, 30-year veteran of software design firms and military contractors
11:30 am–1:00 pm
Lunch
1:00 pm–1:45 pm
10 Things Every Designer Should Know Ruth Delker, Cipher Systems, Inc. and Scott McCurdy, Freedom CAD, Inc.
2:00 pm–3:30 pm
Placement and Routing Decision Making Susy Webb, Fairfield Industries
3:30 pm–5:00 pm
EMI: High Frequency/High Speed Design Rick Hartley, L-3 Communications Avionics Systems
5:00 pm–6:30pm
Networking Reception
Designer Certification (CID and CID+) Earn the credential that promotes your role and expertise to everyone in the printed board and electronics assembly industries. IPC’s Designer Certificationl program provides objective evaluation of core competencies in design, based on industry standards. Certification demonstrates a commitment to excellence. The CID and CID+ are credentials recognized and respected throughout the electronics industry. PCB Designer Certification Workshop (CID) Friday, April 9 : 8:00 am–5:00 pm Saturday, April 10 : 8:00 am–5:00 pm CID Exam Sunday, April 11 : 8:00 am–3:00 pm PCB Advanced Designer Certification Workshop (CID+) Friday, April 9 : 8:00 am–5:00 pm Saturday, April 10 : 8:00 am–5:00 pm CID+ Exam Sunday, April 11 : 8:00 am–3:00 pm
Six half-day professional development courses with a focus on design are offered on Friday, April 9. Check them out on page 34.
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… for Executives IPC PCB Executive Management Meeting Wednesday, April 7: 7:30 am Breakfast; 8:00 am–5:00 pm Presentations; 6:00 pm–9:00 pm Dinner The IPC PCB Executive Management Meeting is a learning and networking forum for senior level decision makers of the PCB industry. Developed by the IPC PCB Management Council Steering Committee, this meeting features industry insiders focusing on critical management issues, such as future technology drivers, supply chain management, increasing sales and securing funding for growth. No other event specifically addresses the needs of PCB executives, from information to peer-to-peer networking. Participants must be senior level executives of a PCB manufacturer to attend.
IPC EMS Management Meeting Wednesday, April 7: 7:30 am Breakfast; 8:00 am–5:00 pm Presentations; 6:00 pm–9:00 pm Dinner Before the show opens, EMS executive from all over the world will gather for the IPC EMS Management Meeting. What will of the future of the industry be? Attendees will spend the day answering this question. A line up of industry experts will provide solutions to the critical challenges facing EMS providers. Networking is a major benefit of the event. Attendees will have the opportunity to trade thoughts and ideas with their peers, and will walk away with a complete picture of where the industry is headed. It is your meeting! No other event specifically addresses the needs of EMS executives, from information to executive level networking.
Special Session:
Contracting with the Customer: What the EMS Executive Needs to Know Friday, April 9 : 9:00 am–5:00 pm Jeff Roth and Allen Anderson, Fees & Burgess, P.C. Without a doubt, negotiating with OEMs is one of the biggest challenges facing the EMS executive. What needs to be covered in the contract? Is your company protected? What should you do if there is a dispute? This unique workshop addresses the specific issues EMS companies face while contracting. Participants will be led through the contracting lifecycle between an electronic manufacturing services (EMS) provider and its customer, starting with the initial engagement and signing of a nondisclosure agreement, through the bid process and formal contract negotiation, to resolution of disputes under the applicable contract(s). Through real EMS situations, attendees will develop an understanding of the contracting process and the questions that must be answered before entering into an agreement. Participants must be representatives of EMS companies to attend. Visit www.IPC.org/EMS-Contracting for details and to register.
Certification Programs An EMS program manager needs a multitude of skills to be successful. The IPC EMS Program Manager Training and Certification Program is a four-part course that tailors topics such as operations management, finance management, contract management, and leadership skills to the EMS industry. Upon completion of all four segments, students are tested to demonstrate their level of understanding of course concepts. Students must also meet work experience requirements before granted full certification. To learn more about the program or to download a registration form, visit www.ipc.org/EMSCERT. Introduction to EMS Training and Program Management Tuesday, April 6 : 8:00 am–5:00 pm Wednesday, April 7 : 8:00 am–1:00 pm EMS Program Manager Training and Certification II Friday, April 9 : 8:00 am–5:00 pm Saturday, April 10 : 8:00 am–5:00 pm
www.IPCAPEXEXPO.org
EMS Leadership Training Thursday, April 8 : 8:00 am–5:00 pm Friday, April 9 : 8:00 am–5:00 pm EMS Program Manager Training and Certification Exam Saturday, April 10 : 8:00 am–12:00 pm
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Testimonials IPC APEX EXPO is the premier show for our industry, but don’t just take our word for it. Take a moment to read why your colleagues value IPC APEX EXPO. The IPC show has limitless opportunities for all individuals who attend. Frank L. Collins, Process Engineer, Johns Hopkins University — Applied Physics Laboratory
For me, it was a great networking opportunity. I was able to connect with various companies and people from different areas of the assembly process. I have several projects now underway because of APEX. Ricky Bennett, President/CEO, Assembly Process Technologies.
If you manufacture electronics, this is where you need to be once a year. A superb showcase of equipment, material and ideas!
Jack Schreiner, Mfg Manager, American Panel Corporation
An excellent show which allowed me to see some of the new technologies available in test and measurement. Well worth the travel from New Zealand.
Stuart Macpherson, Manufacturing Engineering Manager, Navico
A great way to meet many sources all in one day! I completed several days work much faster and quicker — meeting the vendors directly. Web is nice but does not substitute for direct contact with a person who knows the subject. Jeffrey McGinley, National Training Center for Microelectronics
The networking opportunities were great. It allowed me to pick up business opportunities as well as keep up on industry needs and direction. The ability to give and get back from the industry is an IPC APEX EXPO tradition!
Duane Mahnke, President, DBMahnke Consulting
APEX EXPO was a convenient venue to gather information and generate ideas used in updating our strategic plan. This year, we were able to identify and evaluate two new pieces of equipment that could improve responsiveness to customers developing new products, and reduce our costs. The networking events we attended provided a perfect opportunity to exchange ideas about business trends and possible approaches to taking advantage of them. Overall, it was a great “one-stop-shop.” Phil Clay, Consultant, Allendale Electronics
2009 APEX was a great event — the networking was GREAT as I met several very valuable future contacts. Tech Conference and Professional Development classes were also very much worth the trip.
Doug Vaught, PCB Design/Projects, QuEST LLC
Attending IPC APEX EXPO provided insight at a detailed level as to what equipment advances exist today as well as what technological advances are in development. I know what equipment is available to make improvements to our processes and continue to stay on the cutting edge of technology. Jeffrey Cox, President, Quality Manufacturing Services
It was good that we attended because we are making decisions based on information and demonstrations that we could have only received at the show. It was money well spent. Christopher Brewer, Quality Manager, Delta Group Electronics, Inc.
This conference gave me great insight into the technological developments and difficulties of our customers in general. This will aid me and my team in supplying world-class comprehensive support to these customers. Christopher Ryder, Global Customer Quality Manager, AT&S Austria Technologie & Systemtechnik AG
Visit www.IPCAPEXEXPO.org to view even more testimonials.
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Technical Conference April 6–8 The IPC APEX EXPO technical conference is known worldwide as one of the finest and most selective in the world. Take advantage of new research and innovations from key industry players in the areas of board fabrication and design and electronics assembly. New sessions this year include a focus on solar panel assembly, the fight against counterfeit components, embedded active components, “head-on-pillow” defects and Package-on-Package (POP) design. That’s in addition to a strong focus on the key areas of lead-free soldering and reliability. Sign up for one day, the full conference or get the most for your money with the All-Access Pass. Register by March 5 and save 20%. S01 PCB Fabrication Tuesday, April 6 : 1:30 pm–3:00 pm Gary Roper, Roper Resources, Inc. Fabrication of flex and laminates is a demanding process. In today’s competitive environment, an increase in efficiency in all areas is needed to be cost effective as a fabricator. In this session, papers on reel-to-reel flex production, registration and drilling will bring you up to date on the latest methods to improve the bottom line of your fabrication process.
Production of Flexible Circuits in Reel-to-Reel Horizontal Production Systems Stephan Kenny, Atotech Deutschland GmbH, Germany A New System for Automatically Registering and Exposing Solder Mask Materials for PCB Manufacturing. Lionel Fullwood, WKK Distribution Ltd. Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties Lameck Banda, Ph.D., Dow Chemical
S02 Cleaning I Tuesday, April 6 : 1:30 pm–3:00 pm Beverley Christian, Ph.D., Research In Motion Limited, Canada It’s a new world of cleaning! Lead free, cost pressures and the never-ending question of “how clean is clean” present today’s assembly operations with constant challenges. The papers in this first of two sessions on cleaning technology address these challenges head on. Learn how lead free has made cleaning a new ball game, what the cost of cleaning really is and how new technology will help you better assess the effectiveness of your cleaning operation.
Lead-Free Flux Technology and Influence on Cleaning Ning-Cheng Lee, Ph.D., Indium Corporation of America Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership Mike Savidakis, Petroferm Designing New De-fluxing Solvent Blends for Cleaning and Measuring Cleanliness of Electronics Assemblies Using Hansen Solubility Parameters Mike Bixenman, Kyzen Corporation
S03 Emerging Technology Tuesday, April 6 : 1:30 pm–3:00 pm R. Wayne Johnson, Ph.D., Auburn University If there’s one thing you can count on, it’s the evolution of technology for manufacturing. Old technologies evolve to fit the needs of today. New technologies emerge to provide new opportunities for product development and manufacture. This session will showcase the latest in ink jet printing technology for circuit manufacture and 3-D embedded technology employing active and passive components.
The Use of Inkjet Printing Technology for Fabricating Electronic Circuits: The Promise and the Practical Thomas Sutter, Dow Electronic Materials, LLC Industrial PCB Development Using Embedded Passive and Active Discrete Chips Focused on Process and DfR Arnaud Grivon, Thales Services EPM, France A Novel Primer Coating on Organic Substrate for Reliable Ink Jet Printed Circuits Minsu (Tim) Lee, Ph.D., Doosan Electro-Materials Corp., Korea
Visit www.IPCAPEXEXPO.org/technical-conference for more information. More papers and speakers will be added.
www.IPCAPEXEXPO.org
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Technical Conference S04 Design Tuesday, April 6 : 1:30 pm–3:00 pm Michael Beauchesne, Amphenol Printed Circuits, Inc. Interested in wafer level technology? The best method for designing to grid on a PCB? How to best use embedded technology in your next design? If you answered yes, then this session highlighting the latest information in these areas of product design is just for you!
The Universal PCB Design Grid System Tom Hausherr, Valor Computerized Systems A Strategy for Via Connections in Embedded Sheet Capacitance Designs J. Lee Parker, Ph.D., JLP
S05 Lead-Free Issues Tuesday, April 6 : 1:30 pm - 3:00 pm Lead free has never been an easy manufacturing issue to deal with. One of the great challenges with lead free is the position we now find ourselves in on the manufacturing learning curve. Where tin-lead solders have years of history, study and reliability testing, lead free is the “new kid on the block” with no history and only limited reliability credentials. This session focuses on studies of lead-free defects and reliability modeling that will move us along the learning curve. If you’re still struggling with your personal “learning curve” in lead free, then join us for the latest in research on lead-free defects and reliability.
Copper-Tin Intermetallic Crystals and Their Role in the Formation of Microbridges Between the Leads of Hand-Reworked Fine-Pitch Components Jeff Kukelhan, BAE SYSTEMS Electronics Lead-Free Acceleration Factors: Overview, Testing and Validation Jean-Paul Clech, Ph.D., EPSI Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation Werner Engelmaier, Engelmaier Associates, L.C.
S06 Chemistry of Plating Tuesday, April 6 : 3:15 pm–4:45 pm Plating is a key technology for producing solderable surface finishes and reliable PCB interconnection. In this session, the basic chemistry of the plating process and the latest developments for reliable and cost-effective plating technology are showcased.
Thin Immersion Tin James Kenny, Enthone Inc.
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Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards David Lee, Johns Hopkins University The Potential Environmental Benefits of a Chemical “Kick Start” for the Autocatalytic Electroless Copper Plating Process Tafadzwa Magaya, Atotech Deutschland, Germany
S07 Cleaning II Tuesday, April 6 : 3:15 pm–4:45 pm Kim Hyland, Cisco Systems Inc. In this second session on cleaning, we expand to cover the issues associated with cleaning of OA flux. Learn the tradeoffs between water only and the new chemistries for cleaning high density assemblies. Discover the best method for cleaning stencils and misprinted boards. Top off your knowledge base with the latest information on this important assembly technology.
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters Mike Bixenman, Kyzen Corporation “Part II — Why Switch from Pure DI-water to Chemistry?” Umut Tosun, ZESTRON America Cleanliness of Stencils and Cleaned Misprinted Circuit Boards Beverley Christian, Ph.D., Research In Motion Limited, Canada
S08 Test and Inspection I Tuesday, April 6 : 3:15 pm–4:45 pm Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD Test and inspection is more than a go/no-go issue. Customers demand functional, reliable products and test and inspection can make that happen. In this first of two sessions, experts discuss repeatability in test, the coordination of test methods (X-ray, AOI, in circuit, etc.) and the use of X-ray in void detection to help you optimize your test processes.
Making Repeatable Optical LED Measurements in a Production/Manufacturing Environment Tom Melly, Feasa Practical Application of Total Product Test and Inspection Coverage Jack L’Heureux, Delphi E&S A Robust Automated Method for Void Detection in Solder Joints Bonnie Bennett, Intel Corporation
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S09 High Reliability Assembly: Reliability and Rework Tuesday, April 6 : 3:15 pm–4:30 pm
Michael Beauchesne, Amphenol Printed Circuits, Inc. In high reliability markets, there is no room for error. Find out how companies in the aerospace and military markets address the problems associated with reliability and repair and rework in the lead-free era.
Dippable Solder Paste Ball Grid Array (BGA) Component Rework/Repair — A Process Evolution David Hillman, Rockwell Collins NASA/DoD Lead-Free Electronics Project: Mechanical Shock Testing Thomas Woodrow, Ph.D., The Boeing Company Copper-Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand-Reworked Fine-Pitch Components Jeff Kukelhan, BAE SYSTEMS Electronics
S10 The Challenge of Counterfeit Components Tuesday, April 6 : 3:15 pm–4:45 pm
Jim Williams, Polyonics, Inc. Counterfeit isn’t just a problem for clothing and bootleg electronics. Today, it is a major problem touching all levels of the electronics industry and even compromising government security. You need to be proactive in addressing this threat. Walk away with the best methods to protect your company from this growing menace by joining this panel discussion.
S11 Tin Whiskers Wednesday, April 7 : 9:00 am–10:00 am
S12 Backwards Compatibility Wednesday, April 7 : 9:00 am–10:00 am Jasbir Bath, Bath Technical Consultancy It would be wonderful if all changes, especially mandated changes, were carefully coordinated in execution. Unfortunately, we live in an imperfect world. The mandated change to lead free has been fraught with issues resulting from the very process of change from lead to lead free. How does one best handle the issue of dealing with the interface between the two technologies? Hear how backwards compatibility need not be the onerous task it may appear to be.
Lead-free BGA Mixed Soldering Process Study Daicheng Fu, Schweitzer Engineering Laboratories Bridging Supply Chain Gap for Exempt HighReliability OEMs Hal Rotchadl, Premier Semiconductor Services
S13 Test and Inspection II Wednesday, April 7 : 9:00 am–10:00 am Kim Hyland, Cisco Systems Inc. Our second session on test and inspection focuses on in-circuit testing. Overcome the in-circuit test issues for your products with the knowledge you gain here.
Benefits and Limitations of Universal, Low PinCount Automated Test Equipment for Printed Circuit Assemblies Heiko Ehrenberg, GOEPEL Electronics LLC A Universal Grid-Based Test Fixturing System for In-Circuit Testing of Very High Node-Count Circuit Boards Harry Jin, CheckSum, LLC
Beverley Christian, Ph.D., Research In Motion Limited, Canada Lead free has begotten a host of problems and issues for manufacturing and reliability. Not the least of these is the issue of tin whiskers. But what makes a whisker? And how can it be prevented? Get answers to those questions in this revealing session.
S14 Business and Data Transfer
Conformal Coatings for Tin Whisker Risk Management William Fox, Lockheed Martin Missiles & Fire Control
Effective Transition of Electronics Production Between Manufacturing Sites Paul Novak, Delphi Corporation, Electronics & Safety Division
Effect of Soldering Method, Temperature and Humidity on Whisker Growth in the Presence of Flux Residues Keith Sweatman, Nihon Superior Co., Ltd., Japan
Wednesday, April 7 : 9:00 am–10:00 am Hardware may be the life blood of manufacturing; assembly processes may be the muscles of the productrealization process, but it’s the information and data that are the brains. Master how to “work smart” with data to optimize cash flow and the bottom line.
History Lesson — Closing the Loop with Printed Board Data Karen McConnell, Lockheed Martin, EPI Center
Visit www.IPCAPEXEXPO.org/technical-conference for more information. More papers and speakers will be added.
www.IPCAPEXEXPO.org
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Technical Conference S15 Head On Pillow I
S17 Contamination and Corrosion I
Wednesday, April 7 : 9:00 am–10:00 am
Wednesday, April 7 : 10:15 am–11:45 am
Robert Priore, Cisco Systems Inc. As design and assembly tolerances decrease, the opportunities for a “perfect storm” of small errors increase exponentially. Hard-to-isolate solder defects, like “Head-on-Pillow” defects, increase the risk of bringing your assembly process to a halt. Learn the best ways to combat this assembly problem in this first of two sessions.
David Hoover, Multek The level of agreement between the real-world, electrical performance of a board and the original design intent can make a product famous or make it a flop. In today’s highly stressful environment of lead-free assembly, is the old standby of SIR testing enough to predict operational performance? This session will uncover the issues of SIR testing and electrochemical migration. Tap into the knowledge base of our experts and discover how to make your products famous for performance.
Analysis of Head-in-Pillow Phenomena and Mitigation of Defects through Assembly Process Modifications Russell Nowland, Alcatel-Lucent Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly Mario Scalzo, Indium Corporation
S16 Moisture Effects in Laminates Wednesday, April 7 : 10:15 am–11:45 am Jeff Murdock, XACT PCB Software With the higher temperatures of lead-free processing, moisture sensitivity is no longer just a package issue. Today’s laminates can suffer from delamination as a result of entrapped moisture expanding during lead-free assembly. They can also show degraded performance by moisture absorption alone. How does moisture impact performance and board properties? How can assembly defects from trapped moisture be detected? Get answers to those critical questions in this important session.
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD Thermal Assembly Simulation: Effects on PCB Laminate Material Dielectric Constant and Dissipation Scott Hinaga, Cisco Systems Inc. Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD Detecting Delamination in PCBs Christopher Hunt, Ph.D., National Physical Laboratory, UK
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Understanding SIR Eric Bastow, Indium Corporation Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards Michael Azarian, Ph.D., University of Maryland Accelerated Life Prediction of Electrochemical Ion Migration on FR-4 PCB Using TemperatureHumidity-Bias Test Won Sik Hong, Ph.D., Korea Electronics Technology Institute, Korea
S18 PCM for Cost-Effective, Rapid Production Wednesday, April 7 : 10:15 am–11:45 am
Patricia Goldman, Dielectric Solutions, LLC Photochemical etching is a technology offering a new range of possibilities for assembly. Gain an understanding of this emerging technology for manufacturing from our learned panel.
Photochemical Machining and Photoetching: What Can It Do for You? David Allen, Cranfield University, UK
S19 POP I: The Practical Solution for Mixed Function IC Integration Wednesday, April 7 : 10:15 am–11:45 am
Bob Willis, AskBobWillis.com Solutions for packaging multiple die elements in a singlepackage outline have evolved rapidly. A solution that has proved very efficient is package-on-package (PoP). This methodology vertically combines fully packaged and pretested discreet logic and memory on separate array-configured package substrate levels that are designed to align and mount on top of one another. This first of a two-part session will furnish the market outlook, assembly process methodologies and key infrastructure elements that have evolved to enable integrating the new generations of high performance discreet logic and memory die elements within a single package outline.
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Package on Package Vern Solberg, STC-Madison Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages Under Torsion Loads Vikram Srinivas, Center for Advanced Life Cycle Engineering, UMD
S20 Emerging Technology II:
Embedded Actives Wednesday, April 7 : 10:15 am–11:45 am
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency George Kang, Arlon-MED Thermal Assembly Simulation: Effects on PCB Laminate Material Dielectric Constant and Dissipation Scott Hinaga, Cisco Systems, Inc. Frequency Domain Propagation and Permittivity Characterization Method for Low-Loss Materials Printed Circuit Boards Anderson Cheng, Ph.D., ITEQ Corporation
R. Wayne Johnson, Ph.D., Auburn University For many, new portable electronics embedded passives are a sine qua non. But what about the possibility of embedded actives? This session will introduce you to the rapidly growing field of 3-D integration of active and passive components within the PCB structure.
Determining Dielectric Properties of High Frequency PCB Laminate Materials John Coonrod, Rogers Corporation
Embedded Packaging Technologies: Embedding Components to Meet Form, Fit and Function Casey Cooper, STI Electronics, Inc.
Patricia Goldman, Dielectric Solutions, LLC Want to know the latest in new standards development cooking up at IPC? Hear about the new and hot standards that support the industry in dealing with the ever-changing nature of electronics design and manufacturing.
Printable Materials and Devices for Electronic Packaging Rabindra Das, Endicott Interconnect Technologies
S21 Laminate Dielectric Properties and Characterization Wednesday, April 7 : 1:30 pm–3:30 pm
Louis Hart, Compunetics The new electronic products of today are not possible without an efficient match between the intelligence of the components and the interconnectivity of the substrate. As components grow more and more complex, the PCB is keeping step with new and varied materials and technologies. Hear how PCB material and design development and associated testing are continuing to advance the capabilities of today’s hot new products.
Ways to Save! • Pre-register for any paid activity and save $200 with promo code APEX10. • Register by March 5, 2010 and save 20% off all paid activities. www.IPCAPEXEXPO.org/register
S22 New and Improved Standards Wednesday, April 7 : 1:30 pm–3:30 pm
S23 Low Silver Alloys Wednesday, April 7 : 1:30 pm–3:30 pm Jasbir Bath, Bath Technical Consultancy Lead-free alloys have not yet proven themselves in attachment reliability the way the old standby lead solders have over the years. Moreover, lead-free alloys have shown a disturbing tendency to lack the shock and vibration performance of their leaded counterparts. This session tackles the need for data on lead free for a new class of low silver alloys. If you have reliability concerns, this is the session for you.
Thermal Cycle Reliability Testing of Different LeadFree Solder Ball Alloys Joe Smetana, Alcatel-Lucent Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping Ning-Cheng Lee, Ph.D., Indium Corporation of America Low-Silver BGA Assembly Phase I — Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results Chrys Shea, Shea Engineering Services Impact of Thermal Aging on the Thermal Cycling Reliability of Lead-Free Solder Joints in 2512 Resistors Preeti Chauhan, University of Maryland
Visit www.IPCAPEXEXPO.org/technical-conference for more information. More papers and speakers will be added.
www.IPCAPEXEXPO.org
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Technical Conference S24 Solar Panel Assembly
S27 Printing I
Wednesday, April 7 : 1:30 pm–3:30 pm
Thursday, April 8 : 9:00 am–10:00 am
Dongkai Shangguan, Ph.D., Flextronics Corporate Technology Group Solar power is hot! Meeting today’s energy needs with environmentally “green” sun power presents a huge opportunity in electronics assembly. Join our invited group of experts who will discuss critical issues for solar module assembly: • Technology Overview • Assembly Process • Assembly Equipment • Materials • Certification and Industry Standards • Process Capability, Quality Control, and Reliability • Design for Manufacturing • Industry Outlook & Business Models
Paul Lotosky, Cookson Electronics Paste printing is still the heart of the surface mount assembly process. If you’re serious about making this “heart” of your process strong and healthy, let industry experts guide you with the latest on stencil design and optimization of the clamping of boards during print.
Solar Manufacturing Technology: Challenges & Opportunities Dongkai Shangguan, Ph.D., Flextronics Corporate Technology Group
S25 Contamination and Corrosion II Wednesday, April 7 : 1:30 pm–3:30 pm Session two on contamination and corrosion continues our explanation of the how and whys of corrosion processes that threaten the reliability of today’s assemblies.
Effect of Board Clamping System on Solder Paste Print Quality Rita Mohanty, Ph.D., Speedline Technologies, Inc PCB Design and Assembly for Flip-Chip and Die Size CSP Vern Solberg, STC-Madison Stencil Design Influence on Mechanical Test Performance of CSP and LGA Devices Jeff Schake, DEK USA Inc.
S28 Reliability I Thursday, April 8 : 9:00 am–10:00 am Gary Ferrari, FTG Circuits Reliability. In many cases, you simply can’t live without it! Learn how to achieve it and, more importantly, how to test for it in this first session of two on the topic.
Fighting the Undesirable Effects of Thermal Cycling Gabe Cherian, Cherian LLC
Creep Corrosion of PWB Finishes Chen Xu, Ph.D., Alcatel-Lucent
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors Michael Azarian, Ph.D., University of Maryland
Tin Corrosion Under QFN Packages at Elevated Temperature and Humidity Karen Tellefsen, Cookson Electronics
S29 Assembly Process Optimization
S26 Environmental Regulation Thursday, April 8 : 9:00 am–10:00 am REACH. RoHS. What else is on the horizon? Find out what you need to know to ensure your company is compliant with existing environmental regulations and prepared for what’s coming down the road.
Where are REACH SVHC in Electronic Products and Parts? Walter Jager, Intertek Ageus Solutions Round Robin Testing of Sample Combustion Methods in Support of IPC-J-STD-709 Javier Falcon, Ph.D., Intel Corporation
Thursday, April 8 : 9:00 am–10:00 am Helmut Oettl, Rehm Thermal Systems A poorly designed assembly process can be as damaging to your company’s bottom line as a poorly designed product. This session brings together two industry experts who will help you master control of placement metrology and assembly of high power components.
Poor Metrology: The Hidden Cost Michael Cieslinski, Panasonic Factory Solutions Company of America Using DMAIC Methodology for MLP Reflow Process Optimization Dennis Lang, Fairchild Semiconductor
“Between the technical conference and the show exhibits, I was able to get a clear picture of the path our company needs to take to meet the future high tech demands of our industry.” Jim Layer, Director of Engineering, Vermont Circuits, Inc.
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S30 Head On Pillow II
S33 Reliability II
Thursday, April 8 : 9:00 am–10:00 am
Thursday, April 8 : 10:15 am–11:45 am
Robert Priore, Cisco Systems Inc. Session two of our head-on-pillow series continues with more information on how to do battle with this insidious solder defect.
Gary Ferrari, FTG Circuits The issues of drop shock and pad cratering in lead-free assembly along with the reliability of embedded capacitors will be covered in this second session. Don’t miss this important wrap up on reliability.
Head-on-Pillow Defect – A Pain in the Neck or Head-on-Pillow BGA Solder Defect Beverley Christian, Ph.D., Research In Motion Limited, Canada
S31 Halogen-Free Material Thursday, April 8 : 10:15 am–11:45 am David Hoover, Multek Unlike lead free, halogen free is not yet in force, but it is looming on the regulatory horizon. Are you prepared? Join us for an overview of how far halogen free may go and two papers on novel approaches to halogen-free assemblies.
Challenges for Implementing a Halogen-Free Process Tim Jensen, Indium Corporation of America A Novel Halogen-Free Material for High Speed PWB Minsu (Tim) Lee, Ph.D., Doosan Electro-Materials Corp., Korea Polyphenylene Ether Macromolecules. VI. Halogen-Free Flame Retardant Epoxy Resins Edward Peters, Ph.D., Sabic Innovative Plastics
S32 Printing II Thursday, April 8 : 10:15 am–11:45 am Paul Lotosky, Cookson Electronics Our second session on printing addresses the issues associated with stencil and squeegee design and the printing of paste for small passives. Learn how you can improve this vital assembly process within your company.
Stencil Options for Printing Solder Paste for .3mm CSPs and 01005 Chip Components William Coleman, Ph.D., Photo Stencil Inc. Effect of Squeegee Blade on Solder Paste Print Quality Rita Mohanty, Ph.D., Speedline Technologies, Inc
Drop Test Performance of a Medium Complexity Lead-Free Board After Assembly and Rework Polina Snugovsky, Celestica International Inc., Canada Evaluation of PCB Pad Cratering Dongji Xie, Ph.D., Flextronics International USA Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors Michael Azarian, Ph.D., University of Maryland
S34 POP II Thursday, April 8 : 10:15 am–11:45 am The second session dedicated to package on package will focus on PoP assembly in the EMS environment, supply chain management of vertically stacked ICs for efficient assembly line processing and new underfill technologies for reliability of PoP.
S35 Lead-Free Processing Thursday, April 8 : 10:15 am–11:45 am Helmut Oettl, Rehm Thermal Systems You can’t be too rich, too beautiful or have too much up-to-the-minute information on lead-free assembly. Let our three hot papers from Intel, HP and Universal bring you up to date on the important issue of lead-free processing.
Progress in Developing Industry Standard Test Requirements for Solder Alloys Gregory Henshall, Ph.D., Hewlett Packard Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes Stephen Tisdale, Intel Corporation Characterizing the Lead-Free Impact on PCB Pad Craters Brian Roggeman, Universal Instruments Corporation
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly Chris Anglin, Indium Corporation of America
Visit www.IPCAPEXEXPO.org/technical-conference for more information. More papers and speakers will be added.
www.IPCAPEXEXPO.org
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Standards Development Meetings April 5–9
Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on. These sessions are open to all attendees. Sign up for committee meetings at no charge before the show. Take advantage of all the show has to offer with the All-Access Pass. Register by March 5 and save 20%. Save an additional $200 off any paid activity by using promo code APEX10 when you pre-register.
Assembly and Joining Processes 5-21e Solder Stencil Task Group Wednesday, April 7 : 8:00 am–12:00 pm William Coleman, Ph.D., Photo Stencil Inc. This task group will begin development of revision B to IPC-7525, Stencil Design Guideline. This guide assists users in selecting stencil apertures for solder paste printing and now provides expanded support for use with lead-free alloys.
5-21h Bottom Termination Components (BTCs) Task Group Wednesday, April 7 : 8:00 am - 5:00 pm Ray Prasad, BeamWorks Inc.; Vern Solberg, STC-Madison This task group is developing a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing bottom termination components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. The focus of the document is on critical design, assembly, inspection, repair and reliability issues associated with bottom-only termination type components.
5-22bt J-STD-001 Training Task Group Tuesday, April 6 : 1:30 pm–3:00 pm Teresa Rowe, AAI Corporation This working group provides technical guidance for the certification program of J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The agenda for this meeting is to review J-STD-001E training plans.
5-23a P rinted Circuit Board Solderability Specifications Task Group Wednesday, April 7 : 1:30 pm–5:00 pm Gerard O’Brien, Solderability Testing and Solutions Inc. This task group is updating IPC J-STD-003B. The C revision of this document will address more wetting balance data generation and will include a solder spread test protocol.
5-23b C omponent and Wire Solderability Specification Task Group Wednesday, April 7 : 8:00 am–12:00 pm David Hillman, Rockwell Collins
Teresa Rowe, AAI Corporation
This task group is working on consolidating IPC/ECA J-STD-002C, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, and JESD 22-B102 (JEDEC document on same topic) into a single document as J-STD-002, revision D.
This task group is developing revision E to IPC J-STD-001, Requirements for Soldered Electrical & Electronic Assemblies. The committee will review the status of the document.
5-24a Flux Specifications Task Group Tuesday, April 6 : 10:00 am–12:00 pm
5-22a J-STD-001 Task Group Thursday, April 8 : 8:00 am–5:00 pm
Renee Michalkiewicz, Trace Laboratories - East
5-22as Space Electronic Assemblies J-STD-001 Addendum Task Group Tuesday, April 6 : 10:00 am–12:00 pm
This task group is beginning to develop revision C of J-STD-004B, Requirements for Soldering Fluxes, and is also pursuing an amendment to that document that deals with halogen content in new flux and flux residue.
Garry McGuire, NASA Marshall Space Flight Center
5-24b Solder Paste Task Group Thursday, April 8 : 8:00 am–11:00 am
This task group is continuing development of J-STD-001ES, Space Applications Electronic Hardware Addendum for the proposed revision E of J-STD-001.
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Brian Toleno, Ph.D., Henkel Corporation This task group is continuing work on revision A of J-STD-005, Requirements for Soldering Pastes.
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5-24c Solder Alloy Task Group Tuesday, April 6 : 1:30 pm–3:00 pm David Scheiner, Kester This group has completed modifying, via amendments, revision B of J-STD-006 on electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications, and continues work on revision C.
5-24f Underfill Adhesives for Flip Chip Applications Task Group Tuesday, April 6 : 3:15 pm–5:00 pm Brian Toleno, Ph.D., Henkel Corporation; Fonda Wu, Raytheon Company This task group is updating J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages.
7-31h I PC-HDBK-620 Handbook Task Group Tuesday, April 6 : 10:00 am–12:00 pm Randy McNutt, Northrop Grumman Corp.; Brett Miller, USA Harness, Inc. This task group is developing a handbook with to support users of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.
7-35
ssembly and Joining A Handbook Subcommittee
Tuesday, April 6 : 10:00 am–5:00 pm Mary Muller, Crane Aerospace & Electronics This subcommittee is nearing completion of a major update to IPC-AJ-820, Assembly and Joining Handbook, that now incorporates the best parts of IPC-HDBK-001 and other popular IPC guides.
Assembly Equipment 5-41
MT Component Placement S Equipment Subcommittee
Thursday, April 8 : 8:00 am–11:00 am Michael Cieslinski, Panasonic Factory Solutions Company of America; Peter Borg, Research In Motion Ltd., Canada This committee is developing revision A to IPC-9850, Surface Mount Placement Equipment Characterization. This will encompass a major rewrite of the standard because of pick-and-place equipment technologies.
Base Materials 3-11
Laminate/Prepreg Materials Subcommittee
Wednesday, April 7 : 8:00 am–12:00 pm Tony Senese, Panasonic Electric Works This subcommittee is working on revision D of IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards. Comments on this document are solicited.
3-11f UL/CSA Task Group Friday, April 9 1:00 pm–3:00 pm Jack Bramel, Jack Bramel & Associates This task group provides a forum for the exchange of ideas and data related to Underwriters Laboratories’ and Canadian Standards Association’s recognition of printed board materials and processes. This task group continues to request industry input for UL 796 and UL 746E that can be presented to the applicable STP as well as the Industry Advisory Group (IAG).
3-11g C orrosion of Metal Finishes Task Group Thursday, April 8 : 1:00 pm–3:00 pm Beverley Christian, Ph.D., Research In Motion Limited, Canada This task group is exploring and gathering data on the effects of corrosion on surface finishes.
3-12a Metallic Foil Task Group Wednesday, April 7 : 3:15 pm–5:00 pm Rolland Savage, High Performance Copper Foil This task group is gathering data on copper foil surface roughness measurements using non-contact test methods for possible inclusion in revision B of IPC-4562.
3-12d W oven Glass Reinforcement Task Group Tuesday, April 6 : 1:30 pm–3:00 pm Patricia Goldman, Dielectric Solutions, LLC This group is exploring the dielectric constant for E-glass and will examine the testing data obtained from glass fiber manufacturers for possible inclusion into IPC-4412 as a specification value. This effort follows the guideline value that was inserted into IPC-4412A via Amendment 2. The group will also work on the inclusion of three new glass weaves, principally from the Japanese market.
Days and times are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule.
www.IPCAPEXEXPO.org
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Standards Development Meetings 3-12e Base Materials Roundtable Task Group Tuesday, April 6 : 3:15 pm–5:00 pm
5-32e C onductive Anodic Filament (CAF) Task Group Tuesday, April 6 : 10:00 am–12:00 pm
Edward Kelley, Isola Asia Pacific (Singapore) Inc.
Karl Sauter, Sun Microsystems, Inc.
This task group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated.
This task group will consider comments to revision B of IPC-9691A, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing).
Cleaning and Coating 5-31
leaning & Alternatives C Subcommittee
Wednesday, April 7 : 1:30 pm–5:00 pm Mike Bixenman, Kyzen Corporation This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, Post Solder Solvent Cleaning Handbook, IPC-SA-61, Post Solder Semi-Aqueous Cleaning Handbook, IPC-AC-62, Aqueous Post Solder Cleaning Handbook, and IPC-CH-65, Guidelines for Cleaning of Printed Boards and Assemblies.
5-32a/ Joint Meeting — Ionic 5-32c Conductivity and Bare Board Cleanliness Assessment Task Groups Thursday, April 8 : 8:00 am–11:00 am Douglas Pauls, Rockwell Collins; John Radman, Trace Laboratories — East Denver This joint meeting will address the development of an IPC-5703 cleanliness guideline for fabricators and new test methods for ionic cleanliness.
5-32b S IR and Electrochemical Migration Task Group Tuesday, April 6 : 1:30 pm–5:00 pm
5-33c C onformal Coating Handbook Task Group Thursday, April 8 : 1:00 pm–5:00 pm Amy Hagnauer, Raytheon Company; Jason Keeping, Celestica This task group is developing revision A to IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings.
5-33f P otting and Encapsulation Task Group Wednesday, April 7 : 10:15 am–12:00 pm Barry Ritchie, Dow Corning Electronics This newly formed task group is evaluating industry needs for potting and encapsulation of conformal coatings.
Data Generation & Transfer Documentation 2-18
upplier Declaration S Subcommittee
Tuesday, April 6 : 1:30 pm–5:00 pm Eric Simmon, National Institute of Standards and Technology This subcommittee has developed IPC-1751 for supplier data exchanges, including materials declarations (IPC-1752) and manufacturing process declarations (IPC-1756). The subcommittee will review the XML schema for all supplier declaration standards.
Chris Mahanna, Robisan Laboratory Inc. This task group is developing a user guide for the IPC-B-52 SIR test board and reviewing international efforts on SIR. CAF issues previously under the 5-32e task group will also be addressed.
“By attending the IPC Standards Development Committee meetings, I was able to better understand my company’s position on standards relative to other industry leaders.” Christine Blair, Corporate Packaging & Automation Engineer, STMicroelectronics, Inc.
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2-18b M aterials Declaration Task Group Wednesday, April 7 : 8:00 am–5:00 pm Mark Frimann, Texas Instruments Inc. This task group will review the materials declaration standard IPC-1752 and discuss feedback on recent enhancements to the standard. The group will discuss further enhancements, review the tools available for use with IPC-1752, and discuss plans to gain further adoption of the standard.
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2-18f P ackaging Declarations Task Group Friday, April 9 : 8:00 am–3:00 pm
Electronic Data Generation & Transfer/Documentation
Lee Wilmot, TTM Technologies, Inc.; John Ciba, Brady Corp.
2-40
This task group will review and discuss a strawman for a data exchange standard for packaging/packing materials. The standard will include information that companies need to know about the packaging/packing they purchase and use as well as those purchased and used by their suppliers when shipping products or items for the company. This could address use of restricted materials as well as recycling, material content, applicable standards and laws, labels, etc. This standard would be based on the XML schema in the 175x family of supplier declarations.
Tuesday, April 6 : 10:00 am–12:00 pm
2-18x Laminate Declarations Thursday, April 8 : 1:00 pm–5:00 pm Douglas Sober, Kaneka Texas Corporation This is an exploratory meeting to determine if there is industry interest in development of a data exchange standard for laminate materials. The standard could include information that companies need to know about the laminates they purchase and use. It is expected that the standard would be based on the XML schema in the 175x family of supplier declarations.
Data Generation & Transfer/ Shop Floor Communication 2-10/ Joint Meeting — Data 2-13 Generation and Transfer Committee and Shop Floor Communication Subcommittee Tuesday, April 6 : 1:30 pm–5:00 pm Karen McConnell, Lockheed Martin, EPI Center; Andrew Dugenske, Georgia Institute of Technology The 2-10 committee oversees all CAD, CAM and CAE data transfer standards described in the IPC-25XX series, including standards such as GenCAM®, CAMX, PDX, OffSpring, and the Message Broker. The 2-13 subcommittee will discuss the IPC-2540 standards and their implications for both end-users and equipment suppliers on the factory floor.
www.IPCAPEXEXPO.org
Electronic Documentation Technology Committee
Karen McConnell, Lockheed Martin, EPI Center The 2-40 committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machine.
Embedded Components CRANE-EP
RANE Embedded C Passives Committee Meeting (By Invitation)
Wednesday, April 7 : 8:00 am–10:00 am Jason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLC Status on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles. The emulator project will also be presented to encourage candidate designs for embedded passive integration.
D-51 E mbedded Devices Design Subcommittee Thursday, April 8 : 8:00 am–11:00 am Gary Ferrari, FTG Circuits This subcommittee is developing a working draft of IPC-2227, Sectional Design Standard for Printed Boards Containing Embedded Devices.
D-52 E mbedded Component Materials Subcommittee Thursday, April 8 : 3:15 pm–5:00 pm David McGregor, E.I. du Pont de Nemours and Co. This subcommittee is pursuing Amendment 1 to IPC-4821, Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards, and is continuing to address material impacts from the possible incorporation of active embedded components.
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Standards Development Meetings D-54 E mbedded Devices Test Methods Subcommittee Thursday, April 8 : 1:00 pm–3:00 pm Jan Obrzut, Ph.D., National Institute of Standards and Technology This subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices used in printed boards and specifically, a power rating for embedded resistors.
Environment, Health & Safety (EHS) 4-30
nvironment, Health & Safety E (EHS) Steering Committee
Thursday, April 8 : 1:30 pm–5:00 pm Lee Wilmot, TTM Technologies, Inc. The EHS Committee is responsible for promoting cleaner and safer electronics manufacturing worldwide. The committee will discuss regulations affecting the electronics industry, including the Globally Harmonized System for the Classification and Labelling of Chemicals, health and safety regulations, revisions to the RoHS Directive currently under consideration by the EU, and global climate change regulations.
4-33
alogen-Free Materials H Subcommittee
Tuesday, April 6 : 10:00 am–12:00 pm Douglas Sober, Kaneka Texas Corporation This subcommittee will consider new comments for revision B of the white paper/technical report on low-halogen base materials. This paper/report focuses on the legislative, marketing and environmental pressures to remove halogenated flame retardants from PCBs and electronic assemblies. Additionally, this group will discuss how to assist the efforts on halogen-free and its application to other electronic products beyond PCBs and their assemblies.
4-33a Low-Halogen Guideline Task Group Tuesday, April 6 : 1:30 pm–5:00 pm
This task group will review the draft standard on the definition of low-halogen electronics, including printed circuit boards, components, electronics assemblies, cables and mechanical plastics.
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4-34b M arking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group Tuesday, April 6 : 10:00 am–12:00 pm Jasbir Bath, Bath Technical Consultancy; Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc. With the transition to a variety of lead-free solders, labeling of circuit board properties is increasingly important for PCB manufacture and assembly, OEM manufacturing, rework and repair of printed circuit assemblies and end-of-life disposition (recycling or disposal). This combined working group of IPC and JEDEC will review IPC/JEDEC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes.
2-18b M aterials Declaration Task Group Wednesday, April 7 : 8:00 am–5:00 pm
See listing under Data Generation & Transfer/Documentation focus area on page 22.
2-18f P ackaging Declarations Task Group Friday, April 9 : 8:00 am–3:00 pm
See listing under Data Generation & Transfer/Documentation focus area on page 23.
Fabrication Processes 4-14
lating Processes P Subcommittee
Thursday, April 8 : 1:00 pm–3:00 pm George Milad, Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc. This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating. The subcommittee is continuing its work on IPC-4555, Specification for Organic Solder Preservative (OSP) for Printed Circuit Boards. In addition, the group will be generating a new specification for ENEPIG surface finish.
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Flexible and Rigid Printed Boards 3-11f/ Joint Meeting — UL/CSA and D-12a UL 796F & UL 746F Task Groups Friday, April 9 : 11:00 am–12:00 pm Jack Bramel, Jack Bramel & Associates; Duane Mahnke, Mahnke Consulting These task groups provide a forum for ideas and data for rigid and flexible printed boards and materials to support efforts on four UL standards: UL 746E, UL 796, UL 746F and UL 796F. Industry input will be provided to appropriate UL Industry Advisory Groups (IAG) for both rigid and flex materials/printed boards or the Standards Technical Panel (STP) groups for rigid or flexible materials/ printed boards.
Flexible Circuits D-11 Flexible Circuits Design Subcommittee Thursday, April 8 : 1:00 pm–3:00 pm William Ortloff, Raytheon Company This subcommittee is initiating revision C of IPC-2223, Sectional Design Standard for Flexible Printed Boards, that will include a new addendum providing design guidance/tutorials for the board designer.
D-12 Flexible Circuits Specifications Subcommittee Tuesday, April 6 : 10:00 am–12:00 pm Nick Koop, Minco Products Inc. This subcommittee is developing HDI acceptance criteria for IPC-6013, Qualification and Performance Specification for Flexible Printed Boards. “I always enjoy the standard meetings. This is the most important purpose for me going to APEX. It is a way of keeping up with some of the changes happening in electronics. Changes are hitting us constantly.” Nancy Chism, Training Supervisor MIT, Flextronics International
D-13 Flexible Circuits Base Materials Subcommittee Thursday, April 8 : 8:00 am–11:00 am Clark Webster, ALL Flex Inc. This subcommittee maintains IPC-4202, IPC-4203, and IPC-4204. All three documents are being revised. Primary activity is generating IPC-4202A.
D-13b CoverCoat Materials Task Group Wednesday, April 7 : 1:30 pm–3:00 pm Steve Musante, Raytheon Missile Systems This new task group will pursue adding information on flexible circuit needs to the IPC-SM-840E revision that addresses soldermask. The new information will address various liquid applied covercoat materials that are subsequently cured through photo and/or thermal exposure and need to be fully characterized as both flame resistant and electrically insulating.
D-15 Flexible Circuits Test Methods Subcommittee Thursday, April 8 : 3:15 pm–5:00 pm Rocky Hilburn, CAC, Inc.; Duane Mahnke, Mahnke Consulting This subcommittee provides test methods required by the other subcommittees within the D-10 Flexible Circuits Committee. IPC-TM-650, Test Methods Manual, which is defined in all flexible circuits committee documents will be examined in detail for applicability and need for replacement or revision. Also, any test methods specified in new flexible circuitry documents will be generated. Specifically, the test method on service temperature for flexible base materials is being revised and will be addressed.
High Speed/High Frequency Interconnections D-20 H igh Speed/High Frequency Committee Tuesday, April 6 : 10:00 am–12:00 pm Edward Sandor, Taconic Advanced Dielectric Division This is a planning meeting for the task group and subcommittee leaders of the D-20 Committee. The group will discuss concepts for future revisions to IPC-2141, IPC-2251 and IPC-2252.
www.IPCAPEXEXPO.org
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Standards Development Meetings D-22 H igh Speed/High Frequency Board Performance Subcommittee Tuesday, April 6 : 1:30 pm–5:00 pm
TAEC Technical Activities Executive Committee (By Invitation)
Tuesday, April 6 : 5:00 pm–6:30 pm Leo Lambert, EPTAC Corporation
Mahendra Gandhi, Northrop Grumman Aerospace Systems
This committee comprises leaders of all IPC general committees and oversees IPC’s standardization efforts.
This subcommittee is working on revision B to IPC-6018, Microwave End Product Board Inspection and Test, evaluating the document in comparison with the older IPC-HF-318 standard.
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D-23 H igh Speed/High Frequency Base Materials Subcommittee Thursday, April 8 : 8:00 am–11:00 am Edward Sandor, Taconic Advanced Dielectric Division This task group is developing revision A to the IPC-4103 materials specification for high frequency laminates, comparing it with the older IPC-L-125A specification.
oadmap Steering and R Planning Committee
Monday, April 5 : 9:00 am–12:00 pm Jack Fisher, Interconnect Technology Analysis, Inc. The committee will discuss the strategy for the 2011 IPC Technology Roadmap.
Packaged Electronic Components
D-24 H igh Speed/High Frequency Test Methods Subcommittee Wednesday, April 7 : 8:00 am–10:00 am
B-10a/ Joint Meeting — JEDEC Plastic Chip Carrier JC-14.1 Cracking Task Group and JEDEC JC 14.1 Tuesday, April 6 : 10:00 am–5:00 pm
Don DeGroot, CCNi
Steven Martell, Sonoscan Inc.
This oversight subcommittee will discuss potential revisions to existing test methods to evaluate high speed/ high frequency boards and materials.
During this joint meeting, IPC-B-10a and JEDEC JC-14.1 groups will continue revision efforts on J-STD-020D, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices and J-STD-033B, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices.
D-24c H igh-Frequency Test Methods Task Group: Frequency — Domain Methods Task Group Wednesday, April 7 : 10:15 am–12:00 pm Mike Janezic, National Institute of Standards and Technology This task group determines the needs of the microelectronics industry for high frequency dielectric test methods. Currently, the task group is reviewing recent results from a transmission line test method for characterizing dielectric materials.
Management CCC
ommittee Chairman Council C (By Invitation)
Printed Board Design Technology 1-10c T est Coupon and Artwork Generation Task Group Tuesday, April 6 : 3:15 pm - 5:00 pm Timothy Estes, Conductor Analysis Technologies This task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. With the completion of the A/B-R coupon, the task group is evaluating the need for other coupon designs, such as peel strength and interconnect resistance.
Monday, April 5 : 4:00 pm–5:30 pm Peter Bigelow, IMI Inc. This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs.
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Process Control 7-23
rocess Effects Handbook P Subcommittee
Thursday, April 8 : 3:15 pm–5:00 pm Dennis Fritz, MacDermid, Inc. This subcommittee is continuing with revision B to IPC-PE-740, Troubleshooting for Printed Board Manufacture and Assembly. The revision concentrates on updating printed circuit fabrication issues, including the impact of lead-free assembly on the bare board.
Product Assurance 7-31a/ Joint Meeting — IPC-A-600 D-33a and Rigid Printed Board Performance Specifications Task Groups Thursday, April 8 : 1:00 pm–5:00 pm Mark Buechner, BAE Systems These task groups are evaluating goals for future revisions of IPC-A-600 and IPC-6012.
7-31b IPC-A-610 Task Group Friday, April 9 : 8:00 am–5:00 pm Saturday, April 10 : 8:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army Redstone Arsenal; Constantino Gonzalez, ACME Training & Consulting This task group is continuing development of revision E to IPC-A-610, Acceptability of Electronic Assemblies. The task group will review the status of the document.
7-31bt IPC-A-610 Certification Technical Committee Tuesday, April 6 : 3:15 pm–5:00 pm Mary Muller, Crane Aerospace & Electronics This working group provides technical guidance to the developer of the certification program for IPC-A-610, Acceptability of Electronic Assemblies. The agenda for this meeting is to review IPC-A-610E training plans.
7-31f W ire Harness Acceptability Task Group Wednesday, April 7 : 8:00 am–5:00 pm John Laser, L-3 Communications
7-31j I PC-A-630 Requirements for Structural Enclosure Task Group Wednesday, April 7 : 8:00 am–12:00 pm Eddie Hofer, Rockwell Collins; Richard Rumas, Honeywell Canada This task group will look at a “strawman” draft of IPC-A-630, Requirements and Acceptance for Enclosures, High Performance Applications.
Product Reliability 6-10c P lated-Through Via (PTV) Reliability-Accelerated Test Methods Task Group Wednesday, April 7 : 10:15 am–12:00 pm Randy Reed, Merix Corp.; Dewey Whittaker, Honeywell Inc. This task group is establishing a guideline for the attributes affecting lead-free assembly process survivability.
6-10d S MT Attachment-Reliability Test Methods Task Group Wednesday, April 7 : 8:00 am–10:00 am Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory This task group is working to complete the IPC/ JEDEC-9707 spherical bend test method for determining printed board assembly strain limits and the IPC-9708 for pad cratering test methods.
Rigid Printed Boards D-31b IPC-2221/2222 Task Group Wednesday, April 7 : 1:30 pm–5:00 pm Gary Ferrari, FTG Circuits This task group is preparing the Final Draft of revision B of IPC-2221, Generic Standard on Printed Board Design.
D-35 P rinted Board Storage and Handling Subcommittee Friday, April 9 : 8:00 am–10:00 am C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Tom Kemp, Rockwell Collins This task group is developing the forthcoming IPC-1601, Printed Board Handling and Storage Guidelines.
This task group is a joint effort with the Wire Harness Manufacturers Association. The group will begin revision B to IPC/WHMA-A-620, Requirements & Acceptance for Cable & Wire Harness Assemblies.
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Standards Development Meetings D-36 P rinted Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee Tuesday, April 6 : 1:30 pm–3:00 pm Gary Long, Intel Corp. This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers.
Terms and Definitions 2-30
erms and Definitions T Committee
Monday, April 5 : 2:00 pm–3:00 pm Michael Green, Lockheed Martin Space Systems Company This committee maintains standard industry definitions for the electronic interconnection industry within IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. The committee will provide an overview of terms currently being addressed.
Testing 7-11 Test Methods Subcommittee Wednesday, April 7 : 1:30 pm–5:00 pm Joe Russeau, Precision Analytical Laboratory, Inc. This subcommittee maintains and updates IPC-TM-650, Test Methods Manual. It is undergoing an extensive review of IPC test methods older than five years for reaffirmation, revision or cancellation.
7-12 Microsection Subcommittee Wednesday, April 7 : 1:30 pm–3:00 pm Russell Shepherd, Microtek Laboratories This subcommittee is responsible for the development of concepts and guidelines for multiple mounting and microsectioning for evaluating printed board quality.
UL-IAG Industry Advisory Group for UL Friday, April 9 : 8:00 am–11:00 am Truda Chow, Underwriters Laboratories Inc. To resolve questions about nontechnical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronics interconnection industry, the re-establishment of an IAG for interpretation of the UL 746E, UL 796, UL 746F and UL 796F has begun. This group of industry and UL personnel will address items not appropriate for the UL-STP meetings, which cover technical modifications to the four UL documents mentioned above.
Xtras IPC Government Relations Committee Thursday, April 8 : 9:00 am–10:00 am Dan Feinberg, Fein-Line Associates What are your international, national, and regional concerns regarding government regulations, legislation, and international trade? How can IPC help make your business more profitable? Find out what you need to know about key lobbying issues from members of the IPC Government Relations Committee.
JNAC Jisso North America Council Monday, April 5 : 1:00 pm–4:00 pm Dennis Fritz, MacDermid, Inc. JNAC provides input to a global council identified as Jisso International Council (JIC). The JIC focuses on the “Total Packaging Solution.” The meeting on Monday will focus on the development of North American positions on some of the projects that have been identified in the technical working groups of the JIC and preparation for JIC 11.
Ways to Save! • Pre-register for any paid activity and save $200 with promo code APEX10. • Register by March 5, 2010 and save 20% off all paid activities. www.IPCAPEXEXPO.org/register
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!
e b u T u o Y C est P I ont C Video a star uld be
You sho
in honor of
IPC APEX 10th Anniversary Show 2010
We’re celebrating the tenth anniversary of APEX with a celebration of YOU! Engineers are known for their relentless curiosity and willingness to experiment, traits that have helped our industry grow and innovate over the last ten years. But along the way, there are sure to be crazy moments and experiments that didn’t come out quite right. Show us or tell us about those moments — your Bloopers, Blunders or Bonus Moments — in your own YouTube Video. Entries are due by February 13, 2010. All entries will be placed on the APEX 2010 Web site for industry voting. Winners will be selected by the industry. Winners receive lasting fame, a viewing at the APEX 2010 keynote, a spot for a year on the APEX EXPO Web site and on IPC’s YouTube channel www.youtube.com/ipcassociation, and a Nintendo Wii Console with Wii Sports Resort to help you relax and recover! And the bragging rights are priceless... Contact Kim Sterling at KimSterling@ipc.org or +1 847-597-2805 for more information.
www.IPCAPEXEXPO.org
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Professional Development Courses April 8–9
Increase your industry IQ! Find out about the latest in emerging technologies, cleaning, design, eco-compliance, lead-free technologies, materials, process improvements, solder joint reliability and more. Create your own customized itinerary by selecting the courses that meet your professional needs. Ways to Save! Register by March 5 and save 20%. Save an additional $200 off any paid activity by using promo code APEX10 when you pre-register.
Assembly Processes for Lead Free and Tin Lead PD-04 SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly Thursday, April 8 : 2:00 pm–5:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
BASIC Gain a solid understanding of the surface mount and mixed-technology assembly processes for lead-based and lead-free electronics packaging in this course. Discussion will cover a comparison of lead-based and lead-free processes, including implementation issues; critical design tips for ease of manufacture and assembly; and tradeoff decisions between different materials and equipment types. What You Will Learn • Electronics packaging and levels • Packaging and thermal management issues • Assembly defect identification and corrective action • Inspection, testing, rework and repair techniques • Assembly types and assembly process sequence • PCB types, materials and manufacturing • Component types — passive and active • Stencil printing — materials and process for Sn/Pb and lead-free assembly • Automated component placement and packaging • Soldering — reflow, wave and selective soldering • Lead-free solder and profiling changes • Wave soldering • Cleaning materials, process and testing
About the Instructor Dr. Ramkumar teaches courses in SMT electronics packaging and manufacturing automation. He was instrumental in developing the CIM and Surface Mount Electronics Manufacturing Laboratory and curriculum at RIT, and has been the principal investigator for several applied research projects.
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PD-06 Implementing SMT Technologies Thursday, April 8 : 2:00 pm–5:00 pm W. James Hall and Phil Zarrow, ITM Consulting
Intermediate The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability. Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities, are the bane of the assembler. IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with QFNs, land-grid arrays (and other no-lead packages) and high-density CSPs and flip-chips. Manufacturing PCBAs with these “bleeding edge” components is not insurmountable, though not for the weak of heart. This course will provide the experienced participant with a thorough, yet practical, approach to dealing with the most challenging of component packages. What You Will Learn • Latest and best methodologies and philosophies to optimize the SMT assembly process • DFM guidelines • Solder paste • Screen/stencil printing • Component placement • Reflow, inspection and rework • Impact of lead-free and RoHS compliance
About the Instructors Phil Zarrow and Jim Hall have been actively involved in electronic assembly technology for more than 25 years. They have been involved with set-up and troubleshooting through-hole and SMT processes all over the world, working with OEMs and EMS companies to solve assembly problems and optimize facility operations. Phil Zarrow has chaired and instructed numerous technical seminars. One of the pioneers of reflow technology, Jim Hall is a certified Six Sigma black belt.
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PD-07 Package on Package (PoP), STACK Assembly, Rework and Inspection Thursday, April 8 : 9:00 am–12:00 pm Bob Willis, ASKbobwillis.com
Advanced
Package on Package (PoP) applications are growing in popularity for mobile and handheld electronics, increasing demands on assembly engineers. When “real estate” on printed boards is at a premium for logic and memory, the only way to go is up. PoP is new to many contract and OEM assembly staff, but paste dipping, reflow warpage, increased placement accuracy, process introduction can be demanding — and staying up to date with the technology is vital. Participants will receive a set of PoP inspection and quality control wall charts.
What You Will Learn • Benefits of PoP Stack Packages • Component Standards • PCB Design Rules-pad layout, via hole connection • PoP Placement – tack flux, dip solder paste • Reflow Soldering – convection, vapor phase, temperature profiling • Optical and X-ray inspection • Underfill • Rework • Defects
About the Instructor Bob Willis is technical director of the SMART Group. He is a specialist in implementing SMT and has been involved in the introduction and implementation of lead-free process technology. Willis has traveled worldwide lecturing on electronics assembly.
PD-10 Ball Grid Array (BGA): Principles and Practice Thursday, April 8 : 2:00 pm–5:00 pm Ray Prasad, Ray Prasad Consultancy Group
BASIC This interactive course will identify the technical issues in BGA design and manufacturing that must be resolved for effective implementation on a mixed-technology board. Managers will gain insight into the details of BGA to resolve implementation and vendor issues, and engineers will learn technical details of design and manufacturing problems.
What You Will Learn • Flavors of BGA, including frowning and smiling BGAs • Driving forces • BGA limitations and issues • BGA assembly processes and repair, failure case studies, troubleshooting • CSP and flip chip • Trade-offs between BGA and fine-pitch components • BGA applications • Qualifying a subcontractor for BGA assembly • Design for manufacturability and yield
About the Instructor Prior to starting his consulting practice providing SMT solutions, Ray Prasad held key technology positions at Boeing and Intel. He has published a text book, chaired the committee that drafted IPC-7095 and received the IPC Presidents Award. Prasad received his BS in metallurgical engineering from the Regional Institute of Technology, Jamshedpur, India; his MS in materials science and engineering and his MBA from UC – Berkeley.
PD-24 4 Ps of SMT in a Lead-Free World: Principles, Practices, Promises and Problems Thursday, April 8 : 9:00 am–12:00 pm Ray Prasad, Ray Prasad Consultancy Group
BASIC Manufacturing SMT assemblies requires an understanding of all facets of the SMT process. To successfully assemble reliable hardware, the delicate balance between materials and processes must be maintained. This course identifies many of the primary factors in the SMT assembly process that influence reliability. You will learn about ways to improve yield and optimize your process, illustrated by case studies from real-world manufacturing process implementation. What You Will Learn • Fundamentals of SMT process and variables that influence defects • Cause-effect relationship between defects and design • Leaded and lead-free process characteristics • Quality, inspection and repair • Impact of lead free on material choices • Key reflow defects and their desired ratios • Backward and forward compatibility (tin-lead and lead free on the same board) • Flux and cleaning • Fine pitch
About the Instructor See PD-10 above.
Visit www.IPCAPEXEXPO.org/courses for more information.
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Professional Development Courses PD-26 Stencil Printing Process for Solder Paste Application — An In-Depth Look Friday, April 9 : 2:00 pm–5:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
Intermediate This course will provide a thorough understanding of the print process for solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants will truly understand the solder paste print process and its influence on yield. What You Will Learn • Overview of SMT assembly types and process • Stencils: constructions and materials • Factors that affect the stencil printing process • Solder paste, flux, packaging, storage handling • Squeegee • Solder paste printer types and features • Print parameters • Temperature and humidity • Process characterization • Inspection techniques, 2-D vs. 3-D inspection • Defect identification and correction • Stencil printing for adhesive applications
About the Instructor See PD-04 on page 30.
PD-29 Mastering Lead-Free and Tin-Lead Selective Soldering Friday, April 9 : 9:00 am–12:00 pm Bob Klenke, ITM Consulting Inc.
Intermediate Forming through-hole interconnections on circuit boards of ever-increasing densities is a critical issue for board-level assemblers. This course provides an up-to-date review of lead-free selective soldering in a how-to-implement outline. It is an overview of site-specific selective soldering and describes the most common methods available: aperture pallets, fountain soldering, solder robots, laser soldering, focused light, molten wave and multi-wave. Selective soldering with lead-free alloys will be discussed in detail, including differences in process parameters compared to tin-lead solder: solderability aspects, wetting behavior of lead-free alloys and higher operating temperatures.
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What You Will Learn • Component limitations, clearance restrictions, thermal requirements and solder joint reliability issues • Selective soldering — methods and benefits • Selecting the right system for an application • Design guidelines • Increasing role of selective soldering • Technology drivers • Trends of the future
About the Instructor Bob Klenke is a consultant to the printed circuit board assembly industry, working with EMS companies and OEMs to solve assembly problems and optimize facility operations. His career spans over 25 years of work at Siemens, Plexus and Philips.
PD-37 T he Skinny on Lean — A Lean Primer Focused on SMT Friday, April 9 : 9:00 am–12:00 pm States Mead, Panasonic
Advanced
This interactive course highlights the main Lean tools used today. It covers the philosophy and purpose behind the Lean discipline, and explores Lean concepts, tools and methods. Attendees will incorporate what they learn into a simulation exercise — developing process and value-stream maps, identifying TAKT time, line balancing and improving quality while meeting customer on-time delivery requirements.
What You Will Learn • Identifying value-added vs. non-value-added processes • Identifying bottleneck operations, calculating TAKT time and determining options to balance processes • SMT targets in overall equipment effectiveness (OEE) • Value to the customer, 5S, waste, Kaizen, five “whys” • Continuous flow/one-piece flow • Work standards • Metrics for TAKT, tact and cycle time • Kanban • Visual management • Process/value-stream mapping • Total productive maintenance (TPM)
About the Instructor States Mead has completed operational consulting assignments for many top-tier EMS and OEM companies. Prior to joining Panasonic, he worked at Tyco Electronics in the United States, China and Brazil. He recently received his Society of Manufacturing Engineers (SME) Lean Silver certification.
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PD-28 Lessons Learned — LeadFree Surface Mount Technology Friday, April 9 : 2:00 pm–5:00 pm Chrys Shea, Shea Engineering Services
BASIC Experience is the best teacher, but its lessons are often expensive — particularly in the context of printed circuit assembly, where small problems can add up to big dollars very quickly. The assembly process is filled with quality concerns, and taking it lead free only adds to the list of potential pitfalls. This course reviews the most common problems that have occurred in lead-free soldering, how to avoid them and methods to address them. What You Will Learn • Common defects: head-on-pillow, solder bridges, voids, mid-chip solder balls, tombstones • Optimizing print quality, lead-free stencil design and intrusive reflow • Influence of PWB fabrication and surface finish on the SMT assembly process • Mixed-metals solder systems in BGAs • Hybrid solder pastes • Special concerns for RoHS-exempt assemblers • Halogens and halides in the assembly process • Separating fact from fiction in lead-free SMT
About the Instructor Chrys Shea’s industry experience includes R&D applications engineering for Cookson, and surface mount process engineering for several major OEMs. She has published numerous papers on stencil printing, process control and reflow and wave soldering. She holds a B.S. in mechanical engineering and an M.S. in manufacturing engineering.
PD-30 Practical Tips for Rework of Advanced Packages — Reballing BGAs, Leadless Device Rework Friday, April 9 : 2:00 pm–5:00 pm Ray Cirimele and Robert Wettermann, B E S T Inc.
ADvanced With the advent of fewer lead-free packages and the unavailability of some devices in a lead-free alloy, many users find they do not have the right balls on the devices they are using. This course tackles methods of reballing, including the solder preform and stencil technique. Following instruction on the practical aspects of the various techniques, participants will have the opportunity to reball several BGAs.
What You Will Learn • Handling of parts and items/tools for reballing • Process flow and methods • IPC-A-610D inspection criteria • IPC-7721 procedures • Small pitch devices, underfill, mask damage/repair, heat spreaders and ridged parts • Bake and dry packaging • Reflow profiling • Marking of parts • Ceramic reballing process
About the Instructors Ray Cirimele is the operations manager for B E S T, Inc. He has more than 20 years experience in electronics maintenance, manufacturing, PCB fabrication, rework and repair, sales and training. Prior to B E S T, Cirimele worked for the U.S. Department of Defense. Robert Wettermann is an electrical engineer with extensive experience in marketing, sales and design. He holds several patents in surface science and factory automation products.
Cleaning/Coating Contamination PD-08 Conformal Coating Applications, Inspection, Rework and Quality Control Thursday, April 8 : 2:00 pm–5:00 pm Bob Willis, ASKbobwillis.com
ADvanced
Conformal coating has provided benefits in the high-reliability and extreme-conditions sectors, as well as in consumer applications. Selective coating has also been used in the telecommunications and automotive sectors, but for different reasons. This course will provide a guide to the use of coatings: application and process, product benefits, inspection and quality control. Participants will have the opportunity to examine coated boards using different materials and inspect the coating application. They will also receive a set of inspection wall charts illustrating coating application and common defects.
Visit www.IPCAPEXEXPO.org/courses for more information.
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Professional Development Courses What You Will Learn • Why conformal coating • To clean or not to clean • Coating materials and process options • Cost of coating assemblies • SIR and cleanliness testing • Reliability • Rework and repair of board assemblies • Testing, inspection, quality control and evaluation • Design for coating • Masking options and methods
About the Instructor See PD-07 on page 31.
Design
Richard Hartley, L-3 Communication, Avionics Systems
ADvanced
Get a solid introduction to high-speed printed circuit board design, and help ensure your success using current and future fast and ultra-fast ICs. See how output edge rate (rise/fall time) of ICs — more than the rate at which the circuit is clocked — is the cause of signal integrity and EMI problems; and learn what to do about it. Participants will receive a comprehensive workbook to reference for future high-speed design projects.
What You Will Learn
PD-11 Designing PCB Stackups to Balance Signal Integrity Against Manufacturing Friday, April 9 : 9:00 am–12:00 pm Lee Ritchey, Speeding Edge
ADvanced
With increasing speeds of logic and RF systems, demands placed on PCBs make it necessary to consider more than impedance when designing the stackup used for PCB manufacturing. This course will help you make performance decisions about crosstalk rules, impedance targets, interplane capacitance needs and types of weaves — so you can minimize differential skew between high speed differential pairs used in protocols such as PCI Express, XAUI, Double XAUI and other data links. This session covers all aspects of PCB stackup design to help you maximize the advantages of the fabrication process, and work with fabricators and laminate suppliers to maximize performance at the lowest cost.
What You Will Learn • PCB stackup design • Materials choices • Arrangement of signal layers and power planes
About the Instructor Lee Ritchey has participated in the design of more than 3,000 high-speed PCBs, ranging from PC mother boards and elevator controllers to the backplanes used in terabit routers. The author of two books on high-speed design disciplines, he consults for top manufacturers of Internet and server products, and is currently involved in the design of super-computer class products, video games and servers. His background includes program management for 3Com and the Apollo space program.
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PD-17 High Speed Signal Integrity PCB Design Friday, April 9 : 9:00 am–12:00 pm
• Tips to control EMI • Circuit parasitics — inductance, capacitance, etc. • High frequency currents • Signal and wave propagation • Transmission line impedance and impedance models • Trace routing and termination schemes • Effects of vias, trace corners and connectors • Power distribution and decoupling • Split planes and plane islands • PCB layer stackups • Cost differential of controlled impedance PC boards
About the Instructor Richard Hartley is a senior principal engineer at L-3 Communications – Avionics Systems. He teaches and consults with major corporations worldwide to prevent and resolve noise, signal integrity and EMI problems. His focus is on circuits and PC boards for aircraft avionics, computers and telecommunications.
PD-39 DFM for Manufacturing: When a Six Sigma Process Is Not Sufficient to Achieve a High Yielding Manufacturing Process Friday, April 9 : 9:00 am–12:00 pm Dale Lee, Plexus Technology Group
Intermediate Today’s design tolerances have impacted traditional assembly processes with very tight solder application, component placement and soldering constraints. Traditional six sigma process controls are insufficient to achieve a high yielding manufacturing process. This course will introduce the element of design for matched process (DFMP) to product design and provide examples of several opportunities within the DFMP process for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching and environmental controls.
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What You Will Learn • Global product design elements • PCB design impacts • Wave solder design impacts • SMT solder design impacts • Thermal balance, trace routing, equipment limitation/ tolerance, pcb array tolerance, process tooling design • Process control impacts • Paste volume, thermal shock smt & pth, reflow process warpage • Cleaning impacts • Compatibility issues, low stand-off components
About the Instructor Dale Lee is a staff DFX process engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields. He has served as an author, instructor and presenter on many topics, including advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. Lee is a past recipient of the SMTA’s “Excellence in Leadership” award, and has been very involved with SMTA and IPC.
PD-13 Basics of PCB Design Friday, April 9 : 9:00 am–12:00 pm Susy Webb, Fairfield Industries
Basic This course provides an overview of the entire design process. It begins with a brief discussion about components and specification sheets, then moves into the basics of building padstacks and part libraries. Next, the session covers placement issues and scenarios, planes and stackups, and routing do’s and don’ts. The course concludes with output and saving. What You Will Learn • Reading and interpreting data sheets • Parts: libraries, padstacks, attributes and comparison • Placement: where to start, color coding, priorities • Planes and stackup information • Gate swapping, fanout, and routing ideas and information
About the Instructor Susy Webb has 29 years of design experience in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. Webb has set up standards, procedures, shortcuts and library conventions for departmental use. She is a CID (certified interconnect designer) and serves on the IPC Designers Council Executive Board.
PD-14 Designing with Your “Thumbs” Friday, April 9 : 2:00 pm–5:00 pm Susy Webb, Fairfield Industries
BASIC Have you ever wanted to sit with a mentor and absorb all those little tidbits of information that he or she understood so well and used so readily for placement, routing, planes, stackup, high speed and EMI? This course is a compilation of information gleaned from many technical sources and years of work by experienced designers. It will provide general “rules of thumb” for how and why things should be done to achieve successful board designs. It will also introduce the concepts used to lay out PCBs with good signal integrity and EMI control. What You Will Learn • General guidelines for signal integrity, high speed and EMI • “Rules of thumb” for placement, routing, planes, stackup and more • Practical technical information — no math
About the Instructor See PD-13 on same page.
PD-20 Circuit Grounding to Control Noise and EMI Friday, April 9 : 2:00 pm–5:00 pm Richard Hartley, L-3 Communication, Avionics Systems
ADvanced
This course is an introduction to the concepts needed in high-speed circuit and printed circuit design on how to “ground” a circuit for proper operation, to minimize noise and EMI. The course will define “grounding” and examine all its aspects. Attendees will receive a workbook that can be used as a reference for future designs.
What You Will Learn • Basic transmission line concepts • Successful PCB stackups • Grounding to help eliminate EMI • Pros and cons of splitting vs. not splitting ground • RF shielding techniques • Islands in ground • Ground in connectors • Partner planes • Grounded guard traces • Ground in IC packages
About the Instructor See PD-17 on page 34.
Visit www.IPCAPEXEXPO.org/courses for more information.
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Professional Development Courses Emerging Technologies PD-25 Advanced Component Packages and Processes Thursday, April 8 : 9:00 am–12:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology
ADvanced
This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Advantages and disadvantages of each component type and their implementation requirements will be presented. High density interconnection, thermal management requirements and microvia technology will also be discussed. The course will also cover details of the assembly process when using these devices, in both lead-based and lead-free assembly.
What You Will Learn • Electronics packaging and levels • Thermal management in advanced packaging • Substrate properties for advanced packaging • IC packaging trends, packaging evolution • Area array packaging: BGA, CSP, WL-CSP and flip chip • Rework and repair of area array packages • Need for underfill and encapsulation • Ceramic column grid array (CCGA) • Chip-on-board (COB) technology • Tape automated bonding (TAB) • Multi-chip-module (MCM)
About the Instructor See PD-04 on page 30.
PD-31 Introduction to Advanced Packaging Friday, April 9 : 9:00 am–12:00 pm R. Wayne Johnson, Ph.D., Auburn University
ADvanced
Increasing demand for smaller, lighter-weight, high-performance electronic products is driving developments in advanced packaging. This course reviews semiconductor trends and requirements: routing, electrical performance, thermal management and reliability, including low-k dielectrics and lead free. It discusses advanced packaging — first divided into the topics of substrates and die connections, and then as integrated packaging concepts. The course will close with a look at area array packages: stacked die, folded flex 2.5-D packages, chips-first packages and 3-D packages.
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What You Will Learn • Packaging requirements and technologies • Substrates: ceramic, laminate, flex, thin film, embedded passives • Die connection, die attach and wire bond; flip chip • Area array packages: BGAs and CSPs
About the Instructor Dr. Johnson is a professor of electrical engineering at Auburn University and director of the Laboratory for Electronics Assembly and Packaging (LEAP). His research efforts are focused on materials, processing and reliability for advanced packaging, SMT, wire bond and flip chip assembly. Dr. Johnson is the editor-in-chief of the IEEE Transactions on Electronics Packaging Manufacturing.
PD-18 Process Challenges and Metallization Options for Embedding Chip-on-Board into Mainstream SMT Friday, April 9 : 9:00 am–12:00 pm Mukul Luthra, Waterfall Technologies, Canada
ADvanced
This course examines chip-on-board (COB) technology, using real-life examples to summarize key considerations, critical factors and challenges of a successful COB-SMT merge. Driving factors and where COB is positioned vis-à-vis other approaches toward a higher level of integration, the selection criteria and considerations for bare dies, their quality and acquisition, and applicable standards are also covered.
What You Will Learn • Fundamentals of the COB process • Design rules for fan out, pitches, layout, attachment considerations, bonding variables, bonding tools and tool variables, inspection and challenges in failure analysis and rework • Optional flows for embedding COB along with SMT assembly on a common platform • Metallization — conflicting requirements for bonding versus soldering
About the Instructor Mukul Luthra is an electrical engineer with more than 35 years of experience in the electronics industry, with an emphasis on SMT. He has been involved with high-volume manufacturing, quality and process engineering in the hard disk drive, PCBA and semiconductor fields. Luthra has served as a director at Seagate Technology and ST Microelectronics, and has published more than 40 technical papers, features and columns.
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PD-16 HDI: Educating Naysayers into Implementers Friday, April 9 : 2:00 pm–5:00 pm Daniel Smith
BASIC Although HDI design methodology has helped to create hundreds of best-in-industry products for more than 25 years, there is still some reluctance to consider HDI as a design strategy for getting product to market. This course will address the facts and misconceptions about when and where to implement HDI, and explain how to create a PCB design with HDI technology. Participants should download the free HDI Handbook at www.hdihandbook.com and read Chapters 1–6 and 12. What You Will Learn • How to determine, at project start, if HDI can help to make your delivery commitment • How to quantify the number of signal layers and the interconnection stackup • How to strategize your HDI routing methodology • Frank questions to ask prospective HDI fabricators
About the Instructor Dan Smith has been involved in all aspects of the PCB design process for more than 30 years, using a variety of EDA tools to design PCBs, flex, thick film and ICs. He is the owner of several U.S. software patents and has worked at Mentor, Motorola, U.S. Robotics and Shure. Smith is the co-writer of training materials and industry articles. He is active in IPC standards development work and a member of IEEE.
Environmental Issues and Compliance PD-36 Eco-Compliance: The Energy-Using Products (EuP) Directive Friday, April 9 : 2:00 pm–5:00 pm Graham Adams, PlesTech Ltd.
Intermediate The Energy-Using Products (EuP) Directive was developed to improve the lifecycle performance of products by integrating environmental considerations and requirements into the product design and launch process. Companies impacted by this regulation have to comply with it to market their products within the EU. This course will cover the requirements, the status of implementation, the use of benchmarks and how it will impact your businesses.
What You Will Learn • Overview — purpose, history and scope • Framework — requirements, ecological profile, management systems and CE marking • Implementation measures — methodology, products covered and status • The EuP as a driver for better eco-design — EuP, Energy Star and the EU Eco Label; benchmarks
About the Instructor Graham Adams has more than 30 years of electronics industry experience, and is currently a developer of software designed to meet requirements of the EuP. He has managed mechanical design, quality systems, global environmental design and engineering systems consulting for Motorola. Adams has also worked in R&D and chaired the EICTA’s Supply Chain Management Task Force. He has also worked in R&D in diesel fuel injection systems, electronics and fiber optic sensors.
PCB Fabrication and Materials PD-01 PCB Fabrication Basics: Process and Specification Thursday, April 8 : 9:00 am–12:00 pm Don Schmieder and Jim Vanden Hogen, Plexus Corporation.
BASIC Learn how a multilayer PCB is made and the interplay of board design, fabrication and assembly. Physical samples taken from PCB fabrication process steps will be used to show how designing a cost-effective array or sub-panel will optimize material, facilitate manufacturing and allow for post-assembly singulation. Using a PCB fabrication specification for reference, participants will learn how to develop their own specifications, including ones for RoHS-compliant PCBs. What You Will Learn • Steps in the PCB fabrication process • Array design and optimal material utilization • Stack-ups, via metrics & aspect ratios • How to write a fabrication specification
About the Instructors Jim Vanden Hogen has more than 30 years of experience in the design, purchase, manufacture, assembly, test and sales of printed circuit boards. Vanden Hogen has performed technical and quality audits of more than 30 PCB fabricators, both domestic and offshore. He co-authored the original Plexus PCB DFM guidelines.
Visit www.IPCAPEXEXPO.org/courses for more information.
www.IPCAPEXEXPO.org
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Professional Development Courses Don Schmieder has more than 17 years of experience in purchasing, procurement, manufacturing, assembly and testing of PCBs, and has performed technical and quality audits of numerous PCB fabricators. Schmeider helped develop Plexus’ PCB fabrication specification and IST qualification process.
PD-15 Flexible and Rigid Flex Circuit Design Principles and Fabrication Friday, April 9 : 9:00 am–12:00 pm Vern Solberg, STC-Madison
BASIC The design guidelines for flexible circuits — although similar to rigid circuits — are unique. Material sets and fabrication processes can vary from one supplier to another. Before proceeding with the circuit layout, a number of requirements exclusive to fabrication and assembly of flexible circuits must be considered. This course will review those requirements, and provide attendees with guidelines for design decision making. What You Will Learn • Flexible circuit applications • Substrate material selection • Design guidelines for flexible and rigid-flex circuits • IC package development using flex circuits
About the Instructor Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has more than 25 years of experience related to commercial and aerospace electronic products and is an author and educator. Solberg holds several patents for IC packaging innovations and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology.
PD-02 Flex Circuitry is More Than an Electrical Interconnect Thursday, April 8 : 2:00 pm–5:00 pm Mark Finstad and Mark Verbrugge, Minco Products, Inc.
Intermediate Flexible circuitry is more than just an electrical interconnect. Because a flexible circuit is required to bend and flex during and after installation, it becomes as much a mechanical device as an electrical device. A robust flexible circuit design goes much deeper than just connecting the nets. Small variations in materials selection, stackup and routing features can dictate whether a flex circuit will function for years … or fail within minutes. This course will examine the electrical and mechanical features that must be incorporated into the design, and how those features will interact.
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What You Will Learn • The design process — concept to product • How to select the proper materials and stackup, routing techniques, termination variety and ruggedizing options • When and where to use flex circuits • When to choose rigid flex over a standard multilayer • Maximizing value for the lowest TCO • Common design errors and cost drivers
About the Instructors Mark Verbrugge is an applications engineer in the Flex Circuit division of Minco Products. He has 28 years experience in the PCB industry, the last 22 building and designing flex and rigid-flex circuits. Verbrugge is an IPC CID and co-authors a monthly trade publication column on flex circuit design and manufacture with Mark Finstad. Mark Finstad is the applications engineering manager at Minco and has 27 years of experience designing and manufacturing flex and rigid flex circuits. Finstad co-chairs the IPC D-11 Flexible Circuits Design Subcommittee, and is an active member of the IPC D-12 Flexible Circuits Performance Subcommittee as well as several flex circuit materials and test methods committees.
PD-19 Integrating Design for Excellence (DFX) into the PCB Design Process Friday, April 9 : 9:00 am–12:00 pm Mike Febo and Jim Vanden Hogen, Plexus Corporation
Intermediate As PCB physical characteristics become more complex, maintaining electrical design performance becomes more important — and more difficult. This course will give participants guidelines for integrating critical engineering procedures into their PCB design process, to meet electrical and mechanical requirements while maintaining fabrication, assembly and test efficiencies. All elements of DFX will be discussed. By considering all aspects of the product design cycle, this course will help facilitate communication between the teams responsible for design and manufacturing. What You Will Learn • Design for Manufacturability (DFM) • Design for Assembly (DFA) • Design for Test (DFT)
About the Instructors Mike Febo has 29 years of experience in the electronics industry, and is currently developing engineering solutions for the medical and networking sectors. Prior to joining Plexus, Febo was on the technical staff at Bell Laboratories. For Jim Vanden Hogen bio, see PD-01 on page 37.
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PD-21 Printed Circuit Board Fabrication: Back to Basic Friday, April 9 : 9:00 am–12:00 pm Michael Carano, OMG Electronic Chemicals
BASIC The PCB fabrication process is an intricate
maze of related steps, both chemical and mechanical. Each step is critical to minimize or eliminate costly defects. In this course, attendees will learn the basics of PCB fabrication and different troubleshooting techniques.
What You Will Learn • Multilayer and inner-layer fabrication • Up- and down-stream processes in PCB fabrication • Lamination • Latest in processing alternatives and quality control • Via formation • Metallization • De-smear/etchback • Electroplating technologies • Plating processes • Factors affecting plating distribution and throwing power
About the Instructor Michael Carano is vice president of technical operations for OMG Electronic Chemicals, Inc. He holds 29 patents covering a variety of technologies, including plating, metallization processes and PCB fabrication techniques. Carano has published and presented numerous articles in the areas of copper plating, tin plating, PCB technologies and analytical control of electroplating baths. He serves on the IPC Board of Directors.
Quality, Reliability and Test PD-03 Lead-Free Reliability Thursday, April 8 : 9:00 am–12:00 pm Ronald Lasky, Ph.D., Indium Corporation of America
BASIC There is a strong need for a systematic approach to meet the challenges of compliance with global environmental regulations. This course will cover logistical and technical issues of assembly environments (PWB finishes, components and alloys), as well as review implementation of small and large board assembly. Process and product reliability data will also be presented, with case studies. This course will address root causes of electronic product failure and provide a framework for discussion of quality, manufacturability and reliability, as well as examination of material properties and design parameters. The discussion will explore options for increasing the reliability of electronic assemblies. What You Will Learn • Current alloy systems in use • Preferred PWB finishes for lead-free assembly • Concerns with lead-free components • Best practices for setting up • Implementation of DFR procedures • Solder behavior under load, solder joint fatigue • Processing issues, and how to address them
About the Instructor Dr. Lasky has more than 30 years of experience in electronic and optoelectronic packaging, including work at IBM, Universal Instruments and Cookson. The author of five books, he holds a doctorate in materials science.
“Great networking opportunity to meet and learn with the best and the brightest in the industry, and to somewhat climb up, and look outward, on the cutting edge of what will be. At IPC APEX EXPO, we gain some sense of cutting-edge technology’s direction and also a better understanding of how to best get down that path with your colleagues of producing a quality, state-of-the-art electronic product.” Mark Mitzen, Quality Assurance Engineer, Sierra Nevada Corporation
Visit www.IPCAPEXEXPO.org/courses for more information.
www.IPCAPEXEXPO.org
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Professional Development Courses PD-05 Statistical Process Control (SPC) for SMT Electronics Assembly Thursday, April 8 : 9:00 am–12:00 pm
PD-33 Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration Friday, April 9 : 9:00 am–12:00 pm
Rita Mohanty, Ph.D., Speedline Technologies Inc
Ning-Cheng Lee, Ph.D., Indium Corporation of America
Intermediate NASA describes SPC as “a method of monitoring, controlling, and improving a process through statistical analysis.” In electronics assembly, it means “taking the guesswork out of quality control.” This course is highly practical and user-friendly: a simple overview of SPC, based upon the principles of Six Sigma. It will focus on the common cause/special cause and within/between variation concept. Design of experiment (DOE) is a key statistical tool that helps design and process engineers make breakthrough improvements. Application tools will be used in designing and analyzing the most common and powerful DOE, called two-level factorial (full and fractional) design. What You Will Learn Basic concepts behind designing, executing and analyzing DOE through the use of actual electronics assembly case studies and classroom exercise
About the Instructor Dr. Mohanty is a certified Six Sigma instructor with more than 15 years of experience in both industry and academia relating to engineering and electronic polymers, electronic packaging and assembly. Prior to joining Speedline, she managed the R&D group at Cookson Semiconductor materials group. Mohanty received her BS, MS and Ph.D. in chemical engineering from the University of Rhode Island.
Intermediate This course addresses how multiple factors contribute to failure modes, and how to select proper solder alloys and surface finishes to achieve high reliability. The class will also review reliability of through-hole solder joints and provide recommendations, particularly for thick boards. What You Will Learn • Prevailing materials: solder alloys, surface finishes • Surface finishes issues: ENIG and ImAg • Microvoiding mechanism • Etchant chemistry effect • Mechanical properties: shear and pull strength and creep • Intermetallic compounds (IMC): common interactions and their effects; formation of interfacial void • Failure modes: grain issues, lead contamination, mixed alloys and interfacial voiding • Thermal cycle reliability • Reliability of reworked SMT and through-hole joints • Fragility: novel alloys with reduced fragility • Reliability: electromigration and corrosion issues • Tin whiskers • Future lead-free alloys and fluxes
About the Instructor Dr. Lee has more than 20 years of experience in the development of fluxes and solder pastes for SMT. His background also includes a focus on the development of high temperature polymers, encapsulants for microelectronics and adhesives.
Ways to Save! • Pre-register for any paid activity and save $200 with promo code APEX10. • Register by March 5, 2010 and save 20% off all paid activities. www.IPCAPEXEXPO.org/register
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PD-35 Fighting Thermal Cycling Effects Friday, April 9 : 9:00 am–12:00 pm Gabe Cherian, Cherian LLC
ADvanced
Gain an understanding of the undesirable effects of thermal cycling on the components of electronic assemblies — especially as they overstress the joints between the components, which may ultimately cause a failure of the whole system. This course covers thermal cycling tests, their resulting stresses on solder joints and various approaches for counteracting these stresses.
What You Will Learn • Physical characteristics of electronic materials, especially their thermal coefficient of expansion • Deformation of components and joint stresses under thermal cycling • Theories of stress and strain, and failure theories, applied to the case of thermal cycling • Methods to overcome these undesirable effects • Evaluation of alternative solutions to problems
About the Instructor Gabe Cherian holds more than 30 patents, and has 40 years of industry experience. Specializing in development of new products, manufacturing processes and machines, Cherian has worked at AMP and Raychem, in addition to serving as an instructor of engineering at University of California – Berkeley and York College in Pennsylvania.
PD-38 Lead-Free Material and Solder: Impact on Manufacturing and Field Reliability Friday, April 9 : 2:00 pm - 5:00 pm Martin Anselm, Universal Instruments Corporation
ADvanced
Substituting lead-free compliant circuit boards and RoHS components can lead to manufacturing defects not previously observed with traditional materials. But lead-free technology is infiltrating even the military and medical arenas, so it is important to understand its impact on final-product manufacture. This course will look at research efforts and real-world failure analysis studies and present case studies that quantify the rework on lead-free vs. Sn/Pb in the years since RoHS was enacted. Attendees will receive suggestions for corrective actions that have proven to improve yield and field reliability.
What You Will Learn • RoHS and what it means to you • Failure analysis trends 2007–2009 • Case studies — what to look for and corrective actions • PCB laminate materials impacts — concerns, screening methods for selection, testing and reliability in design • Solder alloy research — process sensitivities and test methods for design optimization • Accelerated life testing procedures — predicting field reliability and interpreting data
About the Instructor Martin Anselm is the manager of Failure Analysis Services for the Universal Instruments Corporation’s Advanced Process Lab. Over the years, he has worked with some of the worlds largest electronics manufacturers on projects involving process development; material selection; root cause failure analysis in medical, military, and consumer electronics; and HDI circuit board construction. He holds a Master of Science in mechanical engineering from Clarkson University, an undergraduate degree in physics from SUNY Geneseo and is currently working on his Ph.D. in materials engineering at Binghamton University.
PD-22 Advanced PCB Troubleshooting: Identification, Analysis and Prevention of Critical Defects Friday, April 9 : 2:00 pm–5:00 pm Michael Carano, OMG Electronic Chemicals
Intermediate Addressing printed board defects can be difficult because multiple factors may contribute to them, and root causes may not be readily apparent. This course in advanced problem-solving will explore the most intricate of these factors and how the relationship of upand down-stream processes contributes to scrap product. Participants will learn how to recognize problems — and take corrective action before it is too late. Attendees will receive a copy of IPC-A-600, Acceptability of Printed Boards.
Visit www.IPCAPEXEXPO.org/courses for more information.
www.IPCAPEXEXPO.org
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Professional Development Courses What You Will Learn • Lamination and other multiplayer-related defects • Electro-deposition defects: mouse bites, pitting, nodules, crown or dome plating, dog bone defects • Copper plating reliability • Improving plating distribution and throwing power • Metallization: microvoids/voiding, interconnect separation, hole wall pullaway, glass coverage • High performance resins, wedge voids • Solderability and assembly issues • Black pad phenomenon • Effect of reflow profile and flux on solderability • Imaging: defects, surface preparation, soldermask issues and defects, process control
About the Instructor See PD-21 on page 39.
PD-32 Insights for Next-Generation Requirements for Soldered Electrical and Electronic Assemblies: Impact of J-STD-001 Revision E Friday, April 9 : 2:00 pm–5:00 pm Dan Foster, Defense Acquisition Inc.; Teresa Rowe, AAI Corporation
Intermediate In this course, committee leaders will reveal some of the changes proposed to J-STD-001, Requirements for Soldering of Electrical and Electronic Assemblies. Revision E of this key industry document will impact the user community and features changes that address constantly evolving solder technology. If you use J-STD-001 as your basis for acceptability of electronic assemblies, this course is a must-attend. What You Will Learn Upcoming changes to J-STD-001 related to: • Materials • Methods • Product classes • Supplier flow-down • Training for proficiency and rework • Compatibility with other IPC documents
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About the Instructors Teresa Rowe is the director of quality for the Logistics and Technical Services business unit of AAI. She is the chairman of the IPC 5-22A J-STD-001, 5-22BT J-STD-001 Training, and 7-34T Repair Training Technical Task Groups as well as the 5-22 Soldering Subcommittee. Dan Foster is a senior analyst with Defense Acquisition Incorporated, supporting the Quality Department for the Missile Defense Agency. He has more than 25 years experience in electronics manufacturing training and rework. Foster is the vice chair of both the IPC 5-22A J-STD-001 Task Group and the 7-34T Repair Training Technical Task Group.
Supply Chain/Business Issues PD-09 Survival Is Not Mandatory: 10 Things Every CEO Should Know About Lean Thursday, April 8 : 9:00 am–12:00 pm Steven Williams, Plexus Corp.
Intermediate Lean is the most powerful tool your company can use to improve organizational performance and competitiveness. This course provides an overview of Lean that will help decision makers understand how Lean can help any organization survive. The instructor will share lessons learned from his experience in manufacturing management. Common mistakes, myths and what it takes to successfully implement a Lean program will be covered in this workshop. What You Will Learn • The need for Lean • Drive-by Lean • The Lean philosophy • The seven deadly wastes • Process analysis • Why 99 percent yield is not good enough • The Lean toolkit • A glossary of Lean terms
About the Instructor Steven Williams is a 32-year veteran of the electronics industry, currently responsible for Plexus’ strategic materials management and tactical support of the custom engineered components supply base. He is the author of Survival Is Not Mandatory: 10 Things Every CEO Should Know About Lean.
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PD-34 Lead-Free for the Exemptee: Surviving in a Lead-Free World Thursday, April 8 : 2:00 pm–5:00 pm W. James Hall and Phil Zarrow, ITM Consulting Inc.
ADvanced
Even if you’re exempt, deferred or “out of scope,” RoHS affects your business. As much of the industry heads toward 100 percent lead free, your supply chain and competitive edge are affected. This survival course provides RoHS exemptees with the background and guidance to protect the long-term viability and reliability of their products and business. It defines the current realities of lead free and examines strategies for coping with — and adapting to — the elimination or reduced availability of tin-lead components. Tin whiskers and backward compatibility are also examined. Because the long-term reliability of lead-free solder joints is a key reason for RoHS exemption, testing parameters, acceleration factors and modeling will be discussed.
What You Will Learn • RoHS and other legislation • Reliability issues • Supply chain issues • Backward compatibility strategies
About the Instructors See PD-06 on page 30.
PD-12 Purchasing Basics for the PCB Buyer Friday, April 9 : 2:00 pm–5:00 pm Gary Ferrari, FTG Circuits
Intermediate Gain a solid knowledge-base to guide you through the essentials of purchasing today’s high technology boards. Course discussion will address the principle cost drivers behind PCBs, such as printed board materials and finishes; extra fabrication process steps; typical fabrication and design rules; tooling and artwork; testing; on-site vendor survey; and vendor relationships. What You Will Learn • PCB manufacturing overview • Cost drivers • Relative PCB costs • Customer-supplier relationships • How to conduct a vendor survey
About the Instructor Gary Ferrari has more than 35 years of experience in electronic packaging, holding senior operations, quality and engineering positions in both OEM and supplier environments. He has chaired a number of IPC design committees, including the committee responsible for the widely used IPC-2221/2222 design standards. Ferrari co-founded the IPC Designers Council and helped develop the Designers Certification program. He was honored with the IPC President’s Award in 1990.
PD-27 : C ounterfeit Components — Causes, Cures and Solutions Friday, April 9 : 9:00 am–12:00 pm Bob Willis, ASKbobwillis.com
ADvanced
Counterfeit electronic components are becoming increasingly difficult to identify — they can look right, but fail to function. This course will illustrate the problems caused by counterfeit components, and show you some test methods that can be used to confirm the integrity of components. All participants will receive a set of 28 wall charts covering testing and counterfeitavoidance procedures.
What You Will Learn • Counterfeit avoidance strategies • Component identification checklist • Examples of component counterfeits • Guidelines for reducing risk from counterfeits • Component trends and obsolescence • Impact of lead free on component availability • Mechanical, electrical and solvent testing • Visual and microscopic inspection • X-ray inspection of passive and active parts • Using an online defect database
About the Instructor See PD-07 on page 31. “The professional development courses not only allow us to hear from industry experts, they allow us to share real-world concerns and issues between peers. This helps to elevate the entire group’s knowledge base.” James Adams, Supplier Engineering, Boston Scientific Corp., Cardiac Rhythm Management Division
Visit www.IPCAPEXEXPO.org/courses for more information.
www.IPCAPEXEXPO.org
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Hotel/Travel Hotel Reservations BOOK YOUR ROOM TODAY!
Special early bird rate is offered until December 31, 2009. After December 31, standard IPC rates are available until all rooms are booked or until March 1, 2010. After March 1, 2010, the housing service may offer rooms based on current rates and availability. Be sure to book your reservation through the official housing service, Experient, to take advantage of any special IPC negotiated promotions or rate reductions. Online: www.IPCAPEXEXPO.org/hotels By Phone: 800-974-9833 or +1 847-996-5400; (8:00 am–5:00 pm Central Time) By Fax: 800-521-6017 or +1 847-996-5401 Fax your Individual Housing Request Form (available online). By Mail: Experient – Vernon Hills Service Center 568 Atrium Dr., Vernon Hills, IL 60061 Mail your Individual Housing Request Form (available online).
Mandalay Bay Resort and Convention Center 3950 Las Vegas Blvd. South By December 31 $99 (March 30–April 4) $149 (April 5–April 8) By March 1 $99 (March 30–April 4) $199 (April 5–April 8)
Additional rates may apply for more than two adults in a room. Rates are in U.S. dollars and do not include occupancy tax, currently 12%, or any other related taxes or fees. Room type and rate assignments are on a first come, first served basis. Please note that Experient will send confirmation by e-mail, fax or mail when your reservation has been confirmed. You will not receive a confirmation from your assigned hotel. Changes/Cancellations: Contact Experient with all changes and cancellations prior to 5:00 pm Central time on March 4, 2010. After March 4, visit www.IPCAPEXEXPO.org/hotels for instructions. Hotel Room Solicitation You may be contacted by housing companies claiming to be the official IPC housing group. These entities are not affiliated with IPC in any way. IPC’s official hotel provider is Experient and they will not contact you directly unless you contact them.
Luxor Las Vegas 3900 Las Vegas Blvd. South By December 31 $69 (Sunday–Thursday) $99 (Friday–Saturday)
Excalibur 3850 Las Vegas Blvd. South By December 31 $55 (Sunday–Thursday) $91 (Friday–Saturday)
By March 1 $79 (Sunday–Thursday) $129 (Friday and Saturday)
By March 1 $69 (Sunday–Thursday) $121 (Friday and Saturday)
Upgrades are available upon request at all hotels at standard rates and subject to availability. Ask your housing agent for more details.
Travel Airline American Airlines and other oneworld carriers are the official airlines for this event. Travel between March 28 and April 14, 2010, and save 5% on lowest applicable fares on any American Airlines/oneworld* carrier. Book online at www.aa.com or call 800-433-1790 and reference auth #A3530AE. American Airlines reservation hours: Mon.–Fri., 3:00 am–10:00 pm Pacific time, 5:00 am–12:00 am Central time. *Visit www.aa.com for a list of oneworld carriers. Rental Cars Avis partners with American Airlines as the official rental car agency for this event. Get the lowest available rate guaranteed, when you use AWD#D086747. Call 800-331-1600 (U.S./Canada) or +1 918-624-4201, or book online at www.avis.com. Rates are available from March 24–April 17, 2010.
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Car Pooling Coming from southern California or elsewhere in Nevada? Interested in carpooling? Visit www.IPCAPEXEXPO.org/travel for Web sites to arrange shared rides. Parking Parking at Mandalay Bay is free. Self-parking and valet are available in the parking garage. Shuttle Airport shuttles are available with drop-offs at the major hotels. Mandalay Bay is usually the first or last drop-off. Shuttles run $6.50–$8.00 per person.
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Registration Options Go to www.IPCAPEXEXPO.org/register to sign up today! Choose any of the following to create your perfect package. Whether you want face-to-face interaction, technical knowledge or an opportunity to impact the industry, we have an option for you. Visit www.IPCAPEXEXPO.org/register for complete details. Ways to Save! Register by March 5 and save 20%. Save an additional $200 off any paid activity by using promo code APEX10 when you pre-register. Group Discount: Register four colleagues from the same company, same company location, at the same time, for items marked with a and deduct $100 from each registration. X Exhibit Hall Only — includes admission to the exhibit hall and event essentials FREE ($25 on-site) A All-Access Pass — Best Value Standard Members includes all technical conference paper sessions • conference proceedings CD • standards development $1,295 $995 committee meetings • your choice of up to four half-days of professional development • IPC Luncheons • Thursday concession cash voucher on the show floor • Designers Day • PCB or EMS Executive Management Meeting (must qualify) • event essentials
Technical Conference B Full Conference includes all technical conference paper sessions • conference proceedings CD • standards development committee meetings • event essentials (luncheons not included) C One-Day Conference includes all technical conference paper sessions on the day of your choice • standards development committee meetings • event essentials
Standard
Members
$660 $540
$330 $270
Standards Development Committee Meetings Standard Members D Committee Meetings Plus Conference $700 $575 includes all technical conference paper sessions • conference proceedings CD • standards development committee meetings • Tuesday and Wednesday luncheons • Thursday Concession Cash Voucher on the show floor • event essentials 1 Committee Meetings Plus Luncheons $120 $100 includes standards development committee meetings • Tuesday and Wednesday luncheons ($150 on-site) • Thursday Concession Cash Voucher on the show floor • event essentials 2 Committee Meetings FREE standards development committee meetings • event essentials (luncheons not included) ($40 on-site) Executive Management Programs 3 PCB Executive Management Meeting (must be an executive of a PCB manufacturer to attend) includes Wednesday meeting and luncheon • VIP Networking Dinner • event essentials 4 EMS Management Council Meeting (must be an executive at an EMS company to attend) includes Wednesday meeting and luncheon • VIP Networking Dinner • event essentials 5 VIP Networking Dinner for guest Professional Development Courses 6 Half-Day course (each) one half-day course • supporting materials You may select up to four courses.
$540 $425 $540 $425 $90 each $350 $250
Designers Day and Certification 7 Designers Day $375 $300 includes Thursday meeting • Thursday Concession Cash Voucher on the show floor • networking reception • standards development committee meetings • event essentials 8 Designer Certification Workshop and Exam $795 $595 includes materials • two-day workshop and exam • Select Basic (CID) or Advanced (CID+)= $205 $205 9 Designer Certification Exam Only Select Basic (CID) or Advanced (CID+)= =
advanced certification is open to anyone with valid CID credentials
Additional Items 10 Conference Proceedings Purchase a copy of the conference proceedings on CD 11 Luncheons Select Tuesday or Wednesday
$150 $125 $40 each
Need assistance? Call 877-472-4724 (toll free in U.S. and Canada) or +1 847-597-2860 or e-mail registration@ipc.org
Event Essentials
Exhibit Hall : Free Forums : Keynote Sessions : Poster Sessions : Show Floor Reception
as we celebrate the best in electronics manufacturing and
Join us
3000 Lakeside Drive, Suite 309 S Bannockburn, IL 60015-1249 USA www.IPCAPEXEXPO.org