IPC APEX EXPO 2010 Show Directory by IPC

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Conference & Exhibition April 6–8, 2010 Meetings & Education April 6–9, 2010 Mandalay Bay Resort & Convention Center Las Vegas www.IPCAPEXEXPO.org

Meet us at

IPC APEX EXPOTM 2010

Mandalay Bay Resort & Convention Center

April 6th - 8th

South Convention Center, Bayside Halls C & D, Booth 1948

Surface Mount Technology

Las Vegas, Nevada, USA

AOI solutions to reduce defective PCBAs

automotive

consumer computer telecom Proven

EfďŹ cicent

Dual-lane

3DSPI

SERIES

by Synapse

Innovative

www.vitechnology.com

7KDL

CREATING VALUE

Table of Contents DISCOVER. DISCOVER. CONNECT. CONNECT. THRIVE. THRIVE. Welcome and Show Schedule

Welcome and Acknowledgements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Show Schedule. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

General Information

Registration Hours. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Official Hotel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Getting Around . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Business Services . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . More Info You Should Know. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Convention Center Floor Plan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Events

FREE Keynote Sessions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FREE International Reception. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FREE First-Timers Welcome Breakfast. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FREE Women in Electronics Networking Meeting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FREE Show Floor Reception. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FREE Government Relations Committee Open Forum. . . . . . . . . . . . . . . . . . . . . . . . . . . Event Luncheons. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On the Show Floor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Innovative Technology Center. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC Bookstore. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internet Lounge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC Silent Auction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Academic Poster Competition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Programs for Executives

PCB Executive Management Meeting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMS Management Council Meeting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Certification Programs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contracting with the Customer: What the EMS Manager Needs to Know. . . . . . . . .

12 12 12 12 12 14 16 16 16 16 16 16 16 18 18 18 18 18 18 20 20 20 20

Programs for Designers

Designers Day. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Designer Certification Programs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Technical Programs

FREE Forums . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Professional Development Courses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FREE Technical Posters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Technical Conference Sessions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPC Standards Development Meetings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

23 24 26 27 36

Exhibitors

New Products Listing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Index of Exhibitors by Product Category . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Exhibitors Listing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Advertiser Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Exhibit Hall Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Many thanks to our Exhibitor Supporters:

Conference Bags

IPC APEX EXPOâ&#x201E;˘

Attendee Lanyard

Conference Pen

Welcome and Acknowledgements DISCOVER. CONNECT. THRIVE. IPC Board of Directors

This event is …

Produced by IPC — Association Connecting Electronics Industries®

Sponsored by Bvents — Conventions, Trade Shows and Conferences China Printed Circuit Association (CPCA) European Institute of Printed Circuits (EIPC) Hong Kong Printed Circuit Association (HKPCA) Indian Printed Circuits Association International Electronics Manufacturing Initiative (iNEMI) International Microelectronics and Packaging Society (IMAPS) Japan Electronics Packaging and Circuits Association (JPCA) Japan Robotics Association (JARA) JEDEC Solid State Technology Association Korea Printed Circuit Association (KPCA) Microelectronics Packaging and Test Engineering Council (MEPTEC) Surface Mount and Circuit Board Association (SMCBA) Taiwan Printed Circuit Association (TPCA)

Chairman of the Board: Nilesh S. Naik, OneSource Group Vice Chairman: Robert J. Ferguson, Dow Electronic Materials Secretary/Treasurer: Stephen Pudles, API Technologies Corp. Immediate Past Chairman: C. James Herring, Applied Corporate Solutions, LLC President and CEO: Dennis P. McGuirk, IPC Directors: Peter Bigelow, IMI Inc. Robert J. Black, Juki Automation Systems, Inc. Michael C. Brown, Logic Corporation Jack Calderon, Lincoln International Michael V. Carano, OMG Electronic Chemicals Joseph O’Neil, Hunter Technology Marc Peo, Heller Industries Inc. Rex Rozario, Graphic Plc Don Schroeder, CTS Shane Whiteside, TTM Technologies Alan W. Wong, Aavid Thermalloy, LLC Zhou Xin, Huawei Technologies Co., Ltd. Sammy Yi, Aptina Imaging Corporation Past Chairman: Peter J. Murphy, Astrodyne Corporation

In cooperation with ASSEMBLY Circuit Cellar Circuitnet CircuiTree Circuits Assembly Dempa Publications, Inc. Eco Design Electronic Components World Electronic Production World Electronics Assembly Electronics Protection EMChina.org.cn EMSNow EMT Worldwide Global PCB Marketplace Global SMT & Packaging I-Connect007

Industrial and Specialty Printing MDeviceNow.com Medical Product Outsourcing Metal Finishing PCBTalk.com Printed Circuit Design & Fab Printed Circuit Journal Printed Circuit World Reed Business Information Asia Screen Printing SMT SMTnet.com Surface Mount World Test & Measurement World THERMAL News U.S. Tech Wiring Harness News

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Welcome Letter from the Chairman Welcome to IPC APEX EXPO 2010 and the tenth anniversary of the IPC APEX trade show. We have much to celebrate: 2009 is behind us and hopefully all the pain and struggles of the past 18 months have, in the words of Nietzsche, only made us stronger. The vitality of our industry is only limited by our creativity, knowledge and spirit; I hope that the next few days at IPC APEX EXPO will help feed these. In celebration of the tenth anniversary of APEX, you will notice special APEX10 logos and ribbons in the exhibition and conference areas. We are grateful to all our participants for their continued support of IPC ... and our industry. For when we come together, like we do here, we each have a part in making our industry stronger — through our commitment to continued education, through participation in standards development meetings and through sharing our expertise with others. In 2004, IPC APEX joined with IPC Printed Circuits Expo to become our industry’s “one place” for face-to-face dialogues, relationship building, and product demonstrations. Today, we are that and more. Just as the world and our industry have evolved, so has IPC APEX EXPO. Today, IPC’s online exhibit hall and IPC Technet help you prepare for your time here and ensure that the conversations continue and the relationships keep building well beyond the close of the show. Today, developing fruitful relationships with companies abroad can be facilitated through IPC’s partnership with the U.S. Department of Commerce International Buyer’s Program. Today, standards development participation continues to grow, bringing more people to the table to discuss and develop the critical industry standards that our industry relies on. IPC APEX EXPO is more than just a trade show — it’s our industry’s annual event. I encourage you to take advantage of all that IPC APEX EXPO has to offer, and to take charge of the new opportunities and relationships that await with renewed strength!

Sincerely,

Nilesh S. Naik CEO OneSource Group

IPC APEX EXPO™

IPC APEX Trade Show Subcommittee Chairman: Leo van de Vall, Assembléon America Jason Spera, Aegis Industrial Software Corporation Mike Konrad, Aqueous Technologies Alec J. Babiarz, Asymtek Jim Griffin, BTU International Karen Moore-Watts, DEK International GmbH Sebastian Schmidt, ERSA Inc. John Perrotta, Europlacer North America Scott E. Wischoffer, Fuji America Corporation Marc Peo, Heller Industries Douglas Dixon, Henkel Corporation Brian Duffey, MYDATA automation, Inc. Juan A. Arango, Panasonic Factory Solutions Company of America Leonard (Butch) D. Garrison, II, Siemens Energy & Automation, Inc. Brad Bennett, Universal Instruments Corporation

IPC EXPO Trade Show Subcommittee Chairman: Fred Johnson, Schmid Systems Inc. Rick Lies, Chemcut Corporation David Vaughan, Taiyo America, Inc.

Technical Program Committee Conference Director: Greg Munie, Ph.D. Jasbir Bath, Bath Technical Consultancy Michael Beauchesne, Amphenol Printed Circuits, Inc. Beverley Christian, Ph.D., Research in Motion Limited Gary Ferrari, FTG Circuits Corp. Patty Goldman, Dielectric Solutions David H. Hoover, Multek Kim Hyland, Cisco R. Wayne Johnson, Ph.D., Auburn University

Innovative Technology Center Review Board Wendi Boger, DDi Don Dupriest, Lockheed Martin Missiles & Fire Control Gary Ferrari, FTG Circuits Corp. Jack Fisher, Interconnect Technical Analysis Inc. Thomas F. Gardeski, Gemini Sciences Inc. Chris Mahanna, Robisan Laboratory Inc. Renee Michalkiewicz, Trace Laboratories, Inc.

Show Schedule DISCOVER. CONNECT. THRIVE. EVENT

CODE

TIME

CHAIRMAN/MODERATOR

ROOM

PAGE

Monday, April 5 Center for International Commerce

8:30 am–6:00 pm

Exhibit Hall

Show Office

8:30 am–6:00 pm

Exhibit Hall

Event Registration — Remote

2:00 pm–5:00 pm

North Convention Center Foyer

iNEMI Meeting

8:00 am–5:00 pm

South Pacific I

Roadmap Steering and Planning Committee

8-40

9:00 am–12:00 pm

Jack Fisher, Interconnect Technology Analysis, Inc.

Captain’s

Jisso North America Council

JNAC

1:00 pm–4:00 pm

Dennis Fritz, MacDermid, Inc.

Captain’s

Terms and Definitions Committee

2-30

2:00 pm–3:00 pm

Michael Green, Lockheed Martin Space Systems

Islander H

Committee Chairman Council (By Invitation)

CCC

4:00 pm–5:30 pm

Peter Bigelow, IMI Inc.

Islander H

Chairmen’s Reception (By Invitation)

5:30 pm–6:30 pm

Palm D Foyer

FREE! International Reception

5:30 pm–6:30 pm

Palm D Foyer

18th Annual SMT Vision Awards

6:00 pm–7:30 pm

Islander I

Event Registration — Remote

7:00 am–5:00 pm

North Convention Center Foyer

Speaker Ready Room

8:00 am–5:00 pm

South Pacific D

Press Office

8:00 am–5:00 pm

South Pacific J

Center for International Commerce

8:00 am–6:00 pm

Exhibit Hall

Show Office

8:00 am–6:00 pm

Exhibit Hall

Event Registration — Main

9:00 am–6:00 pm

Exhibit Hall

Exhibits Open

10:00 am–6:00 pm

Exhibit Hall

FREE! First-Timers’ Welcome Breakfast

7:30 am–8:30 am

Islander E

Introduction to EMS Training and Program Management

8:00 am–5:00 pm

Coral A

iNEMI Meeting

8:00 am–5:00 pm

FREE! Keynote — Achieving Strategic Balance: Integrating Global Security Solutions in the New Operational Landscape

8:30 am–9:30 am

Ribbon-Cutting Ceremony

9:45 am–10:00 am

Tuesday, April 6

Susan Mucha, Powell-Mucha Consulting Inc.

South Pacific I Jeff Wilcox, Lockheed Martin

South Pacific E

Exhibit Hall Entrance

Electronic Documentation Technology Committee

2-40

10:00 am–12:00 pm

Karen McConnell, Lockheed Martin, EPI Center

Magellan

Halogen-Free Materials Subcommittee

4-33

10:00 am–12:00 pm

Douglas Sober, Kaneka Texas Corporation

Tradewinds D

Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group

4-34b

10:00 am–12:00 pm

Jasbir Bath, Bath Technical Consultancy; Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc.

Coral B

Space Electronic Assemblies J-STD-001 Addendum Task Group

5-22as

10:00 am–12:00 pm

Garry McGuire, NASA Marshall Space Flight Center

Tradewinds C

Flux Specifications Task Group

5-24a

10:00 am–12:00 pm

Renee Michalkiewicz, Trace Laboratories–East

Tradewinds B

Conductive Anodic Filament (CAF) Task Group

5-32e

10:00 am–12:00 pm

Karl Sauter, Sun Microsystems, Inc.

Coral C

IPC-HDBK-620 Handbook Task Group

7-31h

10:00 am–12:00 pm

Randy McNutt, Northrop Grumman Corp.; Brett Miller, USA Harness, Inc.

Mariners B

Flexible Circuits Specifications Subcommittee

D-12

10:00 am–12:00 pm

Nick Koop, Minco Products Inc.

Mariners A

High Speed/High Frequency Committee

D-20

10:00 am–12:00 pm

Edward Sandor, Taconic Advanced Dielectric Division

Shell Seekers A

Intellectual Property Committee

10:00 am–12:00 pm

Captain’s

Assembly and Joining Handbook Subcommittee

7-35

10:00 am–5:00 pm

Mary Muller, Crane Aerospace & Electronics

Tradewinds A

Joint Meeting — Plastic Chip Carrier Cracking Task Group and JEDEC JC-14.1

B-10a/ JEDEC JC-14.1

10:00 am–5:00 pm

Steven Martell, Sonoscan Inc.

Shell Seekers B

Access the show schedule and a list of exhibitors right from your mobile device at www.IPCAPEXEXPO.org/showguide.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. EVENT

CODE

IPC Annual Meeting and Luncheon

TIME

CHAIRMAN/MODERATOR

12:00 pm–1:30 pm

ROOM

PAGE

South Pacific E

Woven Glass Reinforcement Task Group

3-12d

1:30 pm–3:00 pm

Patricia Goldman, Dielectric Solutions, LLC

Tradewinds B

J-STD-001 Training Task Group

5-22bt

1:30 pm–3:00 pm

Teresa Rowe, AAI Corporation

Mariners B

Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee

D-36

1:30 pm–3:00 pm

Gary Long, Intel Corp.

Tradewinds E

FREE! Test & Inspection Summit

FF01

1:30 pm–3:00 pm

Rick Nelson, Test and Measurement World

Exhibit Hall #2400

PCB Fabrication

S01

1:30 pm–3:00 pm

Gary Roper, Roper Resources, Inc.

South Pacific B

Cleaning I

S02

1:30 pm–3:00 pm

Beverley Christian, Ph.D., Research In Motion Limited, Canada

South Pacific C

Emerging Technology

S03

1:30 pm–3:00 pm

R. Wayne Johnson, Ph.D., Auburn University

South Pacific A

Design

S04

1:30 pm–3:00 pm

Michael Beauchesne, Amphenol Printed Circuits, Inc.

Islander G

Lead-Free Issues

S05

1:30 pm–3:00 pm

Russell Nowland, Alcatel-Lucent

Islander F

Joint Meeting — Data Generation and Transfer Committee and Shop Floor Communication Subcommittee

2-10/ 2-13

1:30 pm–5:00 pm

Andrew Dugenske, Georgia Institute of Technology; Karen McConnell, Lockheed Martin, EPI Center

Magellan

Low-Halogen Guideline Task Group

4-33a

1:30 pm–5:00 pm

Tradewinds D

SIR and Electrochemical Migration Task Group

5-32b

1:30 pm–5:00 pm

Chris Mahanna, Robisan Laboratory Inc.

Mariners A

IPC-A-630 Requirements for Structural Enclosure Task Group

7-31j

1:30 pm–5:00 pm

Eddie Hofer, Rockwell Collins; Richard Rumas, Honeywell Canada

Coral B

High Speed/High Frequency Board Performance Subcommittee

D-22

1:30 pm–5:00 pm

Mahendra Gandhi, Northrop Grumman Aerospace Systems

Shell Seekers A

Solder Products Value Council Steering Committee

SPVC

1:30 pm–5:00 pm

Karl Seelig, AIM, Inc.

Tradewinds C

FREE! Military Roadmap

FF02

3:15 pm–4:45 pm

Steve Lach, Viasystems Group Inc.

Exhibit Hall #2400

Chemistry of Plating

S06

3:15 pm–4:45 pm

Dennis Fritz, MacDermid, Inc.

South Pacific B

Cleaning II

S07

3:15 pm–4:45 pm

Scott Priore, Cisco Systems Inc.

South Pacific C

Test and Inspection I

S08

3:15 pm–4:45 pm

Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD

South Pacific A

High Reliability Assembly: Reliability and Rework

S09

3:15 pm–4:45 pm

Michael Beauchesne, Amphenol Printed Circuits, Inc.

Islander G

The Challenges of Counterfeit Components

S10

3:15 pm–4:45 pm

James Williams, Polyonics, Inc.

Islander F

Test Coupon and Artwork Generation Task Group

1-10c

3:15 pm–5:00 pm

Timothy Estes, Conductor Analysis Technologies, Inc.

Tradewinds E

Base Materials Roundtable Task Group

3-12e

3:15 pm–5:00 pm

Edward Kelley, Isola Group SARL

Tradewinds B

Underfill Adhesives for Flip Chip Applications Task Group

5-24f

3:15 pm–5:00 pm

Brian Toleno, Ph.D., Henkel Corporation; Fonda Wu, Raytheon Company

Coral C

IPC-A-610 Certification Technical Committee

7-31bt

3:15 pm–5:00 pm

Mary Muller, Crane Aerospace & Electronics

Mariners B

Circuits Assembly New Product Introduction and Service Excellence Awards/Printed Circuit Design & Fab New Product Introduction Awards (By Invitation) Technical Activities Executive Committee (By Invitation)

5:00 pm–6:00 pm

TAEC

5:00 pm–6:30 pm

Test & Measurement World’s Best In Test Awards (By Invitation)

5:00 pm–7:00 pm

Executive Market & Technology Steering Committee (By Invitation)

6:30 pm–9:30 pm

Exhibit Hall #237

Leo Lambert, EPTAC Corporation

Tradewinds C

Islander D Don Schroeder, CTS

Captain’s

Wednesday, April 7 Event Registration — Remote

7:00 am–5:00 pm

North Convention Center Foyer

Speaker Ready Room

7:00 am–5:00 pm

South Pacific D

Press Office

8:00 am–5:00 pm

South Pacific J

Event Registration — Main

9:00 am–6:00 pm

Exhibit Hall

Center for International Commerce

9:00 am–6:00 pm

Exhibit Hall

All meetings will take place in Mandalay Bay Resort and Convention Center. PD=Educational Course • S=Conference Session • FF=Free Forum IPC APEX EXPO™

Show Schedule DISCOVER. CONNECT. THRIVE. EVENT

CODE

TIME

CHAIRMAN/MODERATOR

ROOM

PAGE

Show Office

9:00 am–6:00 pm

Exhibit Hall

Exhibits Open

10:00 am–6:00 pm

Exhibit Hall

FREE! Women in Electronics Networking Breakfast

7:30 am–8:30 am

Islander D

IPC EMS Management Council Meeting

7:30 am–5:00 pm

Stephen Pudles, API Technologies Corp.

Islander H

IPC PCB Executive Management Meeting

7:30 am–5:00 pm

Peter Bigelow, IMI Inc.

Islander I

FREE! Keynote — Global Business Outlook: Where Do We Go Next?

8:00 am–9:30 am

Walt Custer, Custer Consulting; Sharon Starr, IPC

Islander E

Joint Meeting — Solder Mask Performance and Cover Coat Materials Task Groups

5-33b/ D-13b

8:00 am–10:00 am

David Vaughan, Taiyo America, Inc.; Steve Musante, Raytheon Missile Systems

Coral B

SMT Attachment-Reliability Test Methods Task Group

6-10d

8:00 am–10:00 am

Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

Tradewinds C

CRANE Embedded Passives Committee (By Invitation)

CRANEEP

8:00 am–10:00 am

Jason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLC

Tradewinds D

High Speed/High Frequency Test Methods Subcommittee

D-24

8:00 am–10:00 am

Don DeGroot, CCNi

Tradewinds B

Trade Show Committee (By Invitation)

8:00 am–10:00 am

Tradewinds A

Laminate/Prepreg Materials Subcommittee

3-11

8:00 am–12:00 pm

Tony Senese, Panasonic Electric Works

Mariners A

Solder Stencil Task Group

5-21e

8:00 am–12:00 pm

William Coleman, Ph.D., Photo Stencil Inc.

Shell Seekers A

Component and Wire Solderability Specification Task Group

5-23b

8:00 am–12:00 pm

David Hillman, Rockwell Collins

Mariners B

8:00 am–1:00 pm

Susan Mucha, Powell-Mucha Consulting Inc.

Coral A

Introduction to EMS Training and Program Management Materials Declaration Task Group

2-18b

8:00 am–5:00 pm

Mark Frimann, Texas Instruments Inc.

Shell Seekers B

Bottom Termination Components (BTCs) Task Group

5-21h

8:00 am–5:00 pm

Ray Prasad, Ray Prasad Consultancy; Vern Solberg, STC-Madison

Coral C

Wire Harness Acceptability Task Group

7-31f

8:00 am–5:00 pm

John Laser, L-3 Communications; Brett Miller, USA Harness, Inc.

Tradewinds E

iNEMI Meeting

8:00 am–5:00 pm

South Pacific I

Tin Whiskers

S11

9:00 am–10:00 am

Beverley Christian, Ph.D., Research In Motion Limited, Canada

South Pacific B

Backwards Compatibility

S12

9:00 am–10:00 am

Jasbir Bath, Bath Technical Consultancy

South Pacific C

Test and Inspection II

S13

9:00 am–10:00 am

Steve Perng, Cisco Systems Inc.

South Pacific A

Business and Data Transfer

S14

9:00 am–10:00 am

J. Lee Parker, Ph.D., JLP Consultants LLC

Islander G

Head On Pillow I

S15

9:00 am–10:00 am

Robert Priore, Cisco Systems Inc

Islander F

Moisture Effects in Laminates

S16

10:15 am–11:45 am

Jeff Murdock, XACT PCB Software

South Pacific B

Contamination and Corrosion I

S17

10:15 am–11:45 am

David Hoover, Multek Inc.

South Pacific C

Photo Chemical Etching

S18

10:15 am–11:45 am

Patricia Goldman, Dielectric Solutions, LLC

South Pacific A

Packaging On Packaging I: The Practical Solution for Mixed Function IC Integration

S19

10:15 am–11:45 am

Bob Willis, ASKbobwillis.com

Islander G

Emerging Technology II: Embedded Actives

S20

10:15 am–11:45 am

R. Wayne Johnson, Ph.D., Auburn University

Islander F

Current Carrying Capacity Task Group

1-10b

10:15 am–12:00 pm

Michael Jouppi, Lockheed Martin

Coral B

Potting and Encapsulation Task Group

5-33f

10:15 am–12:00 pm

Barry Ritchie, Dow Corning Corp.

Tradewinds D

Plated-Through Via (PTV) Reliability-Accelerated Test Methods Task Group

6-10c

10:15 am–12:00 pm

Randy Reed, Viasystems Group Inc.; Dewey Whittaker, Honeywell Inc. Air Transport Systems

Tradewinds C

High Frequency Test Methods Task Group: FrequencyDomain Methods

D-24c

10:15 am–12:00 pm

Mike Janezic, Ph.D., National Institute of Standards and Technology

Tradewinds B

FREE! Solar Panels: New Opportunities for Electronics

FF06

10:30 am–12:00 pm

Dongkai Shangguan, Ph.D., Flextronics International

Exhibit Hall #2400

IPC Event and Awards Luncheon

South Pacific E

Microsection Subcommittee

7-12

1:30 pm–3:00 pm

Russell Shepherd, Microtek Laboratories

Shell Seekers A

FREE! Changing Environment of Printed Circuit Board Technology and the Evolution of Safety

FF03

1:30 pm–3:00 pm

Crystal Vanderpan and Greg Monty, Underwriters Laboratories Inc.

Exhibit Hall #2400

Laminate Dielectric Properties and Characterization

S21

1:30 pm–3:30 pm

Louis Hart, Compunetics Inc.

South Pacific B

New and Improved Standards

S22

1:30 pm–3:30 pm

Patricia Goldman, Dielectric Solutions, LLC

South Pacific C

12:00 pm–1:30 pm

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. EVENT

CODE

TIME

CHAIRMAN/MODERATOR

ROOM

PAGE

Low-Silver Alloys

S23

1:30 pm–3:30 pm

Jasbir Bath, Bath Technical Consultancy

South Pacific A

Solar PV Module Assembly: Challenges & Opportunities

S24

1:30 pm–3:30 pm

Dongkai Shangguan, Ph.D., Flextronics International

Islander G

Contamination and Corrosion II

S25

1:30 pm–3:30 pm

Russell Nowland, Alcatel-Lucent

Islander F

Printed Circuit Board Solderability Specifications Task Group

5-23a

1:30 pm–5:00 pm

Gerard O’Brien, Solderability Testing and Solutions Inc.

Mariners B

Cleaning & Alternatives Subcommittee

5-31

1:30 pm–5:00 pm

Mike Bixenman, D.B.A., Kyzen Corporation

Tradewinds D

Test Methods Subcommittee

7-11

1:30 pm–5:00 pm

Joe Russeau, Precision Analytical Laboratory, Inc.

Tradewinds B

IPC-2221/2222 Task Group

D-31b

1:30 pm–5:00 pm

Gary Ferrari, FTG Circuits; Cliff Maddox, Boeing Co.

Tradewinds C

IPC-A-600 Certification Technical Committee

7-31at

3:00 pm–5:00 pm

Deborah Obitz, Trace Laboratories — East

Coral B

Designer Focus Group (By Invitation)

3:00 pm–6:00 pm

Dieter Bergman, IPC

Captain’s

FREE! IPC Technology Roadmap

FF05

3:15 pm–4:45 pm

Jack Fisher, Interconnect Technology Analysis, Inc.

Exhibit Hall #2400

Metallic Foil Task Group

3-12a

3:15 pm–5:00 pm

Rolland Savage, High Performance Copper Foil Inc.

Mariners A

Propagation Loss Test Method Task Group

D-24b

3:15 pm–5:00 pm

Richard Mellitz, Intel Corporation

Shell Seekers A

FREE! Technical Poster Presentations

3:30 pm–4:30 pm

South Pacific F

FREE! Show Floor Reception

5:00 pm–6:00 pm

Exhibit Hall

Designers Council Executive Board (By Invitation)

6:30 pm–9:30 pm

Glenn Wells, CID, Techsville

Captain’s

Thursday, April 8 Speaker Ready Room

7:00 am–12:00 pm

South Pacific D

Event Registration — Remote

7:00 am–5:00 pm

North Convention Center Foyer

Press Office

8:00 am–5:00 pm

South Pacific J

Event Registration — Main

9:00 am–2:00 pm

Exhibit Hall

Center for International Commerce

9:00 am–4:00 pm

Exhibit Hall

Show Office

9:00 am–4:00 pm

Exhibit Hall

Exhibits Open

10:00 am–2:00 pm

Exhibit Hall

SMEMA Council Steering Committee (By Invitation)

7:00 am–9:00 am

Robert Black, Juki Automation Systems, Inc.

Captain’s

J-STD-001 Task Group

5-22a

8:00 am–8:30 am

Teresa Rowe, AAI Corporation

Islander H

New Technology Subcommittee (By Invitation)

9-40d

8:00 am–9:00 am

David Rund, Taiyo America Inc.

Magellan

Supplier Declaration Subcommittee

2-18

8:00 am–11:00 am

Eric Simmon, National Institute of Standards and Technology

Coral C

Solder Paste Task Group

5-24b

8:00 am–11:00 am

Brian Toleno, Ph.D., Henkel Corporation

South Pacific H

Joint Meeting — Ionic Conductivity and Bare Board Cleanliness Assessment Task Groups

5-32a/ 5-32c

8:00 am–11:00 am

Douglas Pauls, Rockwell Collins; John Radman, Trace Laboratories East Denver

Mariners B

Flexible Circuits Base Materials Subcommittee

D-13

8:00 am–11:00 am

Clark Webster, ALL Flex LLC.

South Pacific G

High Speed/High Frequency Base Materials Subcommittee

D-23

8:00 am–11:00 am

Edward Sandor, Taconic Advanced Dielectric Div.

Mariners A

Embedded Devices Design Subcommittee

D-51

8:00 am–11:00 am

Gary Ferrari, FTG Circuits

Islander I

Islander D

Designers Day

8:00 am–5:00 pm

EMS Leadership Training IPC-A-610 Task Group

7-31b

FREE! Government Relations Committee Open Forum

8:00 am–5:00 pm

Don Turner, DWT Management

Coral A

8:30 am–9:00 am

Jennifer Day, U.S. Army/Stanley Associates; Constantino Gonzalez, ACME Training & Consulting

Islander H

9:00 am–10:00 am

Dan Feinberg, Fein-Line Associates

Islander E

Environmental Regulation

S26

9:00 am–10:00 am

John Burke, Optichron Inc.

South Pacific B

Printing I

S27

9:00 am–10:00 am

Paul Lotosky, Cookson Electronics

South Pacific C

Reliability I

S28

9:00 am–10:00 am

Gary Ferrari, FTG Circuits

South Pacific A

Assembly Process Optimization

S29

9:00 am–10:00 am

Helmut Oettl, Rehm Thermal Systems GmbH, Germany

Islander G

Head On Pillow II

S30

9:00 am–10:00 am

Robert Priore, Cisco Systems Inc.

Islander F

All meetings will take place in Mandalay Bay Resort and Convention Center. PD=Educational Course • S=Conference Session • FF=Free Forum

IPC APEX EXPO™

Show Schedule DISCOVER. CONNECT. THRIVE. EVENT PCB Suppliers Leadership Meeting Subcommittee (By Invitation)

CODE 9-40e

SMEMA Statistical Subcommittee (By Invitation)

TIME 9:00 am–10:00 am

CHAIRMAN/MODERATOR Mark Kannenberg, RBP Chemical Technology, Inc.

ROOM Magellan

9:00 am–10:00 am

Karen Moore-Watts, DEK, UK

Captain’s

PAGE

PCB Fabrication Basics: Process and Specification

PD-01

9:00 am–12:00 pm

Don Schmieder, Plexus Electronic Assembly Corp.; Jim Vanden Hogen, Plexus Corp.

Tradewinds D

Lead-Free Reliability

PD-03

9:00 am–12:00 pm

Ronald Lasky, Ph.D., Indium Corporation of America

Tradewinds C

Statistical Process Control (SPC) for SMT Electronics Assembly

PD-05

9:00 am–12:00 pm

Rita Mohanty, Ph.D., Speedline Technologies Inc

Tradewinds B

Package on Package (PoP), STACK Assembly, Rework and Inspection

PD-07

9:00 am–12:00 pm

Bob Willis, ASKbobwillis.com

Tradewinds E

Survival Is Not Mandatory: 10 Things Every CEO Should Know about Lean

PD-09

9:00 am–12:00 pm

Steven Williams, Plexus Corp.

Shell Seekers A

4 P’s of SMT in a Lead-Free World: Principles, Practices, Promises and Problems

PD-24

9:00 am–12:00 pm

Ray Prasad, Ray Prasad Consultancy

Tradewinds A

Advanced Component Packages and Processes

PD-25

9:00 am–12:00 pm

S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

Tradewinds F

Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group

7-31fs

10:00 am–10:30 am

Garry McGuire, NASA Marshall Space Flight Center

Islander H

PCB Presidents’ Management Council Steering Committee (By Invitation)

9-20a

10:00 am–11:00 am

Peter Bigelow, IMI Inc.

Magellan

Halogen-Free Material

S31

10:15 am–11:45 am

David Hoover, Multek Inc.

South Pacific B

Printing II

S32

10:15 am–11:45 am

Paul Lotosky, Cookson Electronics

South Pacific C

Reliability II

S33

10:15 am–11:45 am

Gary Ferrari, FTG Circuits

South Pacific A

Package-on-Package II: The Practical Solution for Mixed Function IC Integration

S34

10:15 am–11:45 am

Irene Sterian, Celestica International Inc., Canada

Islander G

Lead-Free Processing

S35

10:15 am–11:45 am

Helmut Oettl, Rehm Thermal Systems GmbH, Germany

Islander F

A-620 Technical Training Task Group

7-31ft

10:30 am–12:00 pm

Debbie Wade, Advanced Rework Technology-A.R.T

Islander H

FREE! Don’t Be Surprised by the New RoHS

FF04

10:30 am–12:00 pm

Fern Abrams, IPC

Exhibit Hall #2400

EMS Council Steering Committee (By Invitation)

9-10a

1:00 pm–2:30 pm

Stephen Pudles, API Technologies Corp.

Coral C

Corrosion of Metal Finishes Task Group

3-11g

1:00 pm–3:00 pm

Beverley Christian, Ph.D., Research In Motion Limited, Canada

South Pacific I

Plating Processes Subcommittee

4-14

1:00 pm–3:00 pm

George Milad, Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc.

South Pacific H

Flexible Circuits Design Subcommittee

D-11

1:00 pm–3:00 pm

William Ortloff, Raytheon Company

South Pacific G

Embedded Devices Test Methods Subcommittee

D-54

1:00 pm–3:00 pm

Jan Obrzut, Ph.D., National Institute of Standards and Technology

Islander I

Laminate Declarations

2-18x

1:00 pm–5:00 pm

Douglas Sober, Kaneka Texas Corporation

Captain’s

Environment, Health & Safety (EHS) Steering Committee

4-30

1:00 pm–5:00 pm

Lee Wilmot, TTM Technologies, Inc.

Islander E

J-STD-001 Handbook Task Group

5-22f

1:00 pm–5:00 pm

Daniel Foster, Defense Acquisition Inc.

Islander H

Conformal Coating Handbook Task Group

5-33c

1:00 pm–5:00 pm

Amy Hagnauer, Raytheon Company; Jason Keeping, Celestica

Mariners B

Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups

7-31a/ D-33a

1:00 pm–5:00 pm

Mark Buechner, BAE Systems

Mariners A

Flex Circuitry Is More Than an Electrical Interconnect

PD-02

2:00 pm–5:00 pm

Mark Finstad and Mark Verbrugge, Minco Products Inc.

Tradewinds B

SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly

PD-04

2:00 pm–5:00 pm

S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

Tradewinds C

Conformal Coating Applications, Inspection, Rework and Quality Control

PD-08

2:00 pm–5:00 pm

Bob Willis, ASKbobwillis.com

Tradewinds D

Ball Grid Array (BGA): Principles and Practice

PD-10

2:00 pm–5:00 pm

Ray Prasad, Ray Prasad Consultancy

Tradewinds A

Printed Circuit Board Fabrication: Back to Basics

PD-21

2:00 pm–5:00 pm

Michael Carano, OMG Electronic Chemicals

Shell Seekers A

Lead-Free for the Exemptee: Surviving in a Lead-Free World

PD-34

2:00 pm–5:00 pm

W. James Hall and Phil Zarrow, ITM Consulting Inc.

Tradewinds E

Access the show schedule and a list of exhibitors right from your mobile device at www.IPCAPEXEXPO.org/showguide.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. EVENT

CODE

TIME

CHAIRMAN/MODERATOR

ROOM

PAGE

PCB Suppliers Council Steering Committee (By Invitation)

9-40

2:30 pm–3:30 pm

Mark Kannenberg, RBP Chemical Technology, Inc.

Coral C

Process Effects Handbook Subcommittee

7-23

3:15 pm–5:00 pm

Dennis Fritz, MacDermid, Inc.

South Pacific H

Flexible Circuits Test Methods Subcommittee

D-15

3:15 pm–5:00 pm

Rocky Hilburn, Insulectro; Duane Mahnke, Mahnke Consulting

South Pacific G

Embedded Component Materials Subcommittee

D-52

3:15 pm–5:00 pm

David McGregor, DuPont

Islander I

5:00 pm–6:30 pm

Bay View Patio

7:00 am–3:00 pm

North Convention Center Foyer

Designers Day Reception

Friday, April 9 Event Registration — Remote Press Office

8:00 am–12:00 pm

South Pacific J

Printed Board Storage and Handling Subcommittee

D-35

8:00 am–10:00 am

C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Tom Kemp, Rockwell Collins

Islander I

SMT Component Placement Equipment Subcommittee

5-41

8:00 am–11:00 am

Michael Cieslinski, Panasonic Factory Solutions Company of America

Islander H

Industry Advisory Group Meeting for UL

UL-IAG

8:00 am–11:00 am

Truda Chow, Underwriters Laboratories

Islander G

8:00 am–2:00 pm

Donald Walsh, Uyemura International Corp.

Islander F

8:00 am–3:00 pm

John Ciba, Brady Corporation; Lee Wilmot, TTM Technologies, Inc.

Islander E

Certified Interconnect Designer (CID) Workshop

8:00 am–5:00 pm

Dieter Bergman, IPC

Coral C

Advanced Certified Interconnect Designer (CID+) Workshop

8:00 am–5:00 pm

Kate Mayer, CID+, Mayer Associates

Coral B

EMS Leadership Training

8:00 am–5:00 pm

Don Turner, DWT Management

Coral A

PCB Suppliers Council (By Invitation) Packaging Declarations Task Group

2-18f

iNEMI Meeting

8:00 am–5:00 pm

South Pacific I

Implementing SMT Technologies

PD-06

9:00 am–12:00 pm

W. James Hall and Phil Zarrow, ITM Consulting Inc.

Tradewinds D

Designing PCB Stack-ups to Balance Signal Integrity Against Manufacturability

PD-11

9:00 am–12:00 pm

Lee Ritchey, Speeding Edge

Mariners A

Basics of PCB Design

PD-13

9:00 am–12:00 pm

Susy Webb, CID, FairfieldNodal

Mariners B

Flexible and Rigid Flex Circuit Design Principles and Fabrication Requirements

PD-15

9:00 am–12:00 pm

Vern Solberg, STC-Madison

Tradewinds A

High Speed Signal Integrity PCB Design

PD-17

9:00 am–12:00 pm

Richard Hartley, CID, L-3 Avionics Systems Inc.

Tradewinds B

Integrating Design For Excellence (DFX) into the PCB Design Process

PD-19

9:00 am–12:00 pm

Mike Febo and Jim Vanden Hogen, Plexus Corporation

Tradewinds C

Counterfeit Components — Causes, Cures and Solutions

PD-27

9:00 am–12:00 pm

Bob Willis, ASKbobwillis.com

South Pacific B

Mastering Lead-Free and Tin-Lead Selective Soldering

PD-29

9:00 am–12:00 pm

Bob Klenke, ITM Consulting Inc.

Tradewinds F

Achieving High Reliability for Lead-Free Solder Joints — Materials Consideration

PD-33

9:00 am–12:00 pm

Ning-Cheng Lee, Ph.D., Indium Corporation of America

South Pacific A

Fighting Thermal Cycling Effects

PD-35

9:00 am–12:00 pm

Gabe Cherian, Cherian Enterprises

Tradewinds E

The Skinny on Lean — A Lean Primer Focused on SMT

PD-37

9:00 am–12:00 pm

States Mead, Panasonic Factory Solutions Company

South Pacific C

DFM for Manufacturing: When a Six Sigma Process Is Not Sufficient to Achieve a High Yielding Manufacturing Process

PD-39

9:00 am–12:00 pm

Dale Lee, Plexus

South Pacific D

9:00 am–5:00 pm

Jeff Roth and Allen Anderson, Fees & Burgess, P.C.

Shell Seekers A

Contracting with the Customer: What the EMS Manager Needs to Know Joint Meeting — UL/CSA and UL 796F & UL 746F Task Groups

3-11f/ D-12a

11:00 am–12:00 pm

Jack Bramel, Jack Bramel & Associates; Duane Mahnke, Mahnke Consulting

Islander G

UL-STP Committee Meeting (By Invitation)

UL-STP

12:00 pm–5:00 pm

Brad Schmidt, Underwriters Laboratories

Islander G

Purchasing Basics for the PCB Buyer

PD-12

2:00 pm–5:00 pm

Gary Ferrari, FTG Circuits

Mariners A

Designing with Your “Thumbs”

PD-14

2:00 pm–5:00 pm

Susy Webb, CID, FairfieldNodal

Mariners B

HDI: Essential Requirements for Implementation — Routing into the Future

PD-16

2:00 pm–5:00 pm

Daniel Smith

Tradewinds D

All meetings will take place in Mandalay Bay Resort and Convention Center. PD=Educational Course • S=Conference Session • FF=Free Forum IPC APEX EXPO™

Show Schedule DISCOVER. CONNECT. THRIVE. TIME

CHAIRMAN/MODERATOR

ROOM

Process Challenges and Metallization Options for Embedding Chip-on-Board into Mainstream SMT

EVENT

PD-18

CODE

2:00 pm–5:00 pm

Mukul Luthra, Waterfall Technologies, Canada

Tradewinds C

PAGE

Circuit Grounding to Control Noise and EMI

PD-20

2:00 pm–5:00 pm

Richard Hartley, CID, L-3 Avionics Systems Inc.

Tradewinds B

Advanced PCB Troubleshooting: Identification, Analysis and Prevention of Critical Defects

PD-22

2:00 pm–5:00 pm

Michael Carano, OMG Electronic Chemicals

Tradewinds A

Stencil Printing Process for Solder Paste Application — An In-Depth Look

PD-26

2:00 pm–5:00 pm

S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

South Pacific B

Lead-Free SMT: Troubleshooting for Higher Yields

PD-28

2:00 pm–5:00 pm

Chrys Shea, Shea Engineering Services

Tradewinds F

Practical Tips for Rework of Advanced Packages — Reballing BGAs, Leadless Device Rework

PD-30

2:00 pm–5:00 pm

Norman Mier Jr. and Robert Wettermann, B E S T Inc.

South Pacific D

The NEW J-STD-001 Revision E — Learn from the Leaders

PD-32

2:00 pm–5:00 pm

Dan Foster, Defense Acquisition Incorporated; Teresa Rowe, AAI Corporation

South Pacific A

Lead-Free Material and Solder: Impact on Manufacturing and Field Reliability With a Focus on Failure Analysis of Assembly Case Studies

PD-38

2:00 pm–5:00 pm

Martin Anselm, Universal Instruments Corporation

South Pacific C

Coral A

Saturday, April 10 EMS Program Manager Training and Certification Exam

8:00 am–12:00 pm

Certified Interconnect Designer (CID) Workshop

8:00 am–5:00 pm

Dieter Bergman, IPC

Coral C

Advanced Certified Interconnect Designer (CID+) Workshop

8:00 am–5:00 pm

Kate Mayer, CID+, Mayer Associates

Coral B

Advanced Certified Interconnect Designer (CID+) Exam

8:00 am–3:00 pm

Kate Mayer, CID+, Mayer Associates

Coral B

Certified Interconnect Designer (CID) Exam

8:00 am–3:00 pm

Dieter Bergman, IPC

Coral C

Sunday, April 11

The learning goes on all year… May 17

The Impact of Updates to J-STD-001

Irvine, CA May 18

June 9–10

IPC Capitol Hill Day (co-located with IPC Executive Market & Technology Conference)

The Impact of Updates to IPC A-610

Washington, D.C. June 10

The Impact of Updates to J-STD-001

San Jose, CA June 15

The Impact of Updates to IPC A-610

Irvine, CA June 16

Irvine, CA May 19

San Jose, CA May 20 San Jose, CA May 20–21

IPC International Conference on Reliability and Quality of Lead-Free Electronics

Frankfurt, AM, Germany June 8

The Impact of Updates to IPC-A-600 and IPC-6012

Irvine, CA June 9

Lean in the Electronics Industry: Applying Theory to Practice

Irvine, CA June 9

IPC Executive Market & Technology Conference: HighReliability Electronics and the Future of American Electronics Manufacturing

Washington, D.C.

www.IPC.org/events

The Impact of Updates to IPC-A-600 and IPC-6012 IPC International Conference on Flex Circuits — Workshops IPC International Conference on Flex Circuits

Irvine, CA June 22

IPC Workshop on Lead-Free Assembly for High Yields and Reliability

San Jose, CA July 20–21

It’s Not Easy Being Green! Understanding Proliferating Chemical and Product Regulations

Boston, MA September 28–30

Electronics Midwest — Presented by Canon Communications and IPC

Rosemont, IL October 13–14

IPC Electronics Industry Executive Summit

Palm Springs, CA

www.IPCAPEXEXPO.org

General Information and Services DISCOVER. CONNECT. THRIVE. Internet Lounge

Official Hotels Information

Located in the Exhibit Hall, the lounge is equipped with computers and a station to plug in your laptop.

Excalibur . . . . . . . . . . . . . . . . . . . . . . . . . 702-597-7777 3850 Las Vegas Blvd. South

Twitter/On-site Text Announcements

Luxor Las Vegas . . . . . . . . . . . . . . . . . . . . 702-262-4444 3900 Las Vegas Blvd. South

Get up-to-the-minute show announcements, including daily IPC bookstore discounts. Find us at Twitter @IPCAPEXEXPO. Tweeting from the show? Use hashtag #IPCAPEXEXPO.

Mandalay Bay . . . . . . . . . . . . . . . . . . . . . 702-632-7777 3950 Las Vegas Blvd. South

More Info You Should Know

Getting Around

Photo and Video Prohibition

Free Tram Service A free tram runs between the Excalibur, Luxor and Mandalay Bay hotels every three to seven minutes, between the hours of: Monday–Friday . . . . . . . . . . . . . . . . . . . . 7:00 am–11:00 pm Saturday–Sunday . . . . . . . . . . . . . . . . . . 8:00 am–Midnight

Taxi Cabs Cabs are readily available and only accept cash.

Bus Service — The Deuce

Still photography and video recording of any exhibit or function is prohibited in the exhibit hall, meeting rooms and lobbies. This applies to both exhibitors and attendees. Show Management, the official photographer, and accredited members of the news media are exempt from this rule. Exhibitors are allowed to photograph or make video recordings of their own booth at any time. Attendees may also take photographs of a particular booth, provided they are accompanied by a badged exhibitor for that booth. Mandalay Bay strictly monitors filming and photography throughout its premises. To photograph or film outside the exhibit hall or meeting rooms, you must have permission from hotel authorities. Contact the IPC press office for more information.

Policies

Buses on the Strip run 24 hours a day, seven days a week. One-way fare is $3.00. A full-day pass is $5.00. For information or to purchase tickets call +1 702-699-8299 or visit www.lvmonorail.com.

Any function that is not part of the “official program” is prohibited, from the first meeting to the close of the event. IPC does not permit solicitation from nonexhibiting companies. Any individual observed soliciting or selling products to attendees or exhibitors without having a booth (an activity known as suitcasing) will be asked to leave.

Business Services

First Aid

Las Vegas Monorail

First Aid is located behind the Business Center in the South Convention Center lobby.

Business Center and Coat/Bag Check 7:00 am–6:00 pm daily

Destinations Direct

Bayside Foyer

The Business Center provides customary business services. For more information, call +1 702-322-5700 or visit www.mandalaybay.com.

Visit Destinations Direct in IPC’s registration area in Bayside D to make reservations for shows, dinner or other fun things to do at discounted prices!

Free Wireless Internet Access

Free Wi-Fi service is available on the meeting room level of the North Convention Center and the Exhibit Hall, courtesy of IPC.

A very special thank you to the following individuals for their commitment to excellence and participation in IPC APEX every year over the past 10 years! Jerry Arreola Jasbir Bath Mike Bixenman, D.B.A. Peggi Blakley Mumtaz Bora Marshall Canaday Beverley Christian, Ph.D. Michael De Santo Don DeMille Thomas DeSisto Douglas Eng Brad Frederick Dennis Fritz Benoit Giroux Haritt Gonzalez

Constantino Gonzalez Carol Handwerker, Sc.D. David Hillman Greg Hurst Wayne Johnson, Ph.D. Un Kim Jerry Lindholm William May Garry McGuire Randy McNutt Atul Mehta Claudio Miniaci Mary Muller Ken Neff Deon Nungaray

Douglas Pauls Teresa Rowe Arline Ruhl David Scheiner Vern Solberg Howard Stevens Jeremy Stevens Blen Talbot Brian Toleno, Ph.D. Sharon Ventress Thomas Woodrow, Ph.D. Ernie Woyma, Jr. David Zueck

www.IPCAPEXEXPO.org

IPC APEX EXPO™

General Information DISCOVER. CONNECT. THRIVE.

www.IPCAPEXEXPO.org

Special Events DISCOVER. CONNECT. THRIVE. FREE Keynote Sessions Achieving Strategic Balance: Integrating Global Security Solutions in the New Operational Landscape Jeff Wilcox, Vice President, Corporate Technology & Engineering, Lockheed Martin

Tuesday, April 6, 8:30 am–9:30 am

South Pacific E

In his keynote address, Jeff Wilcox will address the challenge of developing a full spectrum of global security solutions that strike a strategic balance between conventional and unconventional missions. He will discuss how Lockheed Martin’s Engineering and Technology Enterprise is meeting this challenge and what that will mean to the global electronics industry. Wilcox will describe the four types of innovation the company is bringing to bear to engineer affordable solutions in the new operational landscape.

Global Business Outlook: Where Do We Go Next? Walt Custer, President, Custer Consulting Sharon Starr, Director of Market Research, IPC

Wednesday, April 7, 8:00 am–9:30 am

Islander E

Are the challenges of 2009 behind us? Walt Custer and IPC Director of Market Research Sharon Starr will team up to present the latest data and market trends for the electronics industry. Custer will cover electronics equipment and component markets, as well as business performance by the leading companies worldwide by industry sector. Starr will bring IPC survey data to the discussion to identify the latest trends in demand and production for worldwide PCB, EMS and supplier industries, as well as forecasts. Both speakers will comment on the challenging global economy and present some leading indicators, as well as note how seasonal and cyclical trends affect the industry and its supply chain.

Meet the People Who Move an Industry FREE International Reception Monday, April 5, 5:30 pm–6:30 pm

Palm D Foyer

Our international friends are invited to relax, have a bite to eat, and meet key IPC volunteers.

FREE First-Timers’ Welcome Breakfast Tuesday, April 6, 7:30 am–8:30 am

Islander E

Maximize your time at IPC APEX EXPO with some advice from a few insiders. Enjoy a continental breakfast while your colleagues share the ins and outs of IPC and this event. Learn how to put IPC’s resources to use for you and your company and find out how to take advantage of everything this event has to offer. Even if you’re not a first-timer, join us for a refresher course on IPC programs and activities.

FREE Women in Electronics Networking Breakfast Wednesday, April 7, 7:30 am-8:30 am

Islander D

From engineering to sales and marketing to executive management, women are making a greater impact in all areas of the electronic interconnect industry. How has being a woman affected your career? Share your ideas and experiences with your peers and build your industry network for your future career success. There is no charge to attend, but please stop by registration to RSVP for this meeting.

FREE Show Floor Reception Wednesday, April 7, 5:00 pm–6:00 pm

Exhibit Hall

Put down the Blackberrys, set the cell phones on vibrate, and take a few moments to kick back with your colleagues for our very own happy hour, replete with beverages, munchies and lots of friends to catch up with and friends to make. Take a casual stroll through the exhibition, scope out all the goodies the exhibitors have to offer, and be sure to check out the academic poster competition and place your vote for the winner.

FREE Government Relations Committee Open Forum Thursday, April 8, 9:00 am–10:00 am

Islander E

What are your international, national, and regional, concerns regarding government regulations, legislation, and international trade? How can IPC help make your business more profitable? The focus of this special meeting is YOU and your government relations concerns and needs. Government Relations (GR) Committee members will provide an overview of their efforts to support the prosperity of the global electronic interconnect industry, including lobbying on proposed revisions to the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive, government support for research and development (R&D), and the future of military electronics. After the overview, there will be open discussion of future issues for the committee to address. In short, the IPC GR Committee wants to know what they can do for you.

Luncheons

Registration is required.

IPC Annual Meeting and Luncheon Tuesday, April 6, 12:00 pm–1:30 pm

South Pacific E

IPC Event and Awards Luncheon Wednesday, April 7, 12:00 pm–1:30 pm

www.IPCAPEXEXPO.org

South Pacific E

your total solutions provider for maximizing your productivity

OEE

Overall Enterprise Effectiveness

Manufacturing Execution System

PTH

SMT

Pin-Through-Hole

booth

MES

Surface Mount Technology

1871

Special Events DISCOVER. CONNECT. THRIVE. On the Show Floor

Academic Poster Competition Cast Your Vote!

Innovative Technology Center Through a very rigorous evaluation process, these cutting-edge products and services are reviewed by an expert technology panel to identify and award the very best of 2010. Get a sneak preview of the equipment, materials and services that will change the direction of our industry. • IC Thermal Detection Unit, SEICA Inc. • Nordson EFD UV-traceable Solder Paste, EFD, Inc. — A Nordson Co. • F5000H Laser Marker, FlexLink Systems, Inc. • Loctite PowerstrateXtreme Printable (PSX-P), Henkel Corp. • DEK ProFlow ATx, DEK International ®

Booth 901

In its second year, the IPC Academic Poster Competition solicited research from universities around the world. Through industry voting, the top ten finalists were invited to showcase their work on the show floor. Now it’s your job to determine the top three posters. Stop by booth 901 to view the posters and cast your vote. The academic poster authors will be available Wednesday, April 7, 3:30 pm–6:00 pm. Cash prizes totaling $4,500 will be awarded to the top three posters at the close of the Show Floor Reception on Wednesday, April 7.

Bonding/Barrier Composites on Bismuth Telluride(Bi2Te3) for High Temperature Applications Wen P. Lin, University of California, Irvine

• DEK Sentinel, DEK International • DEK VectorGuard® Double Layer Platinum Stencil, DEK International

Reliability of Lead-Free Solder Under High Temperature Aging John Evans, Auburn University

Gold to Gold Solid-State Bonding of Silicon Chips to Alumina Substrates

Chu-Hsuan Sha and Chin C. Lee, University of California, Irvine

A Defect Phase Diagram for Tin Whisker and Local Film Properties Near Whiskers Pylin Sarobol, Aaron Pedigo, P. Su, J.E. Blendell, C.A. Handwerker, Purdue University

Use of RF Impedance Analysis for Non-Destructive Sensing of Interconnect Failure Mechanisms

IPC Bookstore — Save 25% on Training DVDs! Informational resources to enhance the work you do, help train your staff and support your company’s strategic planning efforts are waiting for you in the IPC bookstore, booth 2073. • Browse industry standards on design, board fabrication and assembly. • Check out IPC training and certification programs.

Michael H. Azarian, Daeil Kwon, Michael Pecht, University of Maryland

Tin Whisker Growth Related to the Crystallographic Texture of Sn and Sn Alloy Electrodeposits Aaron Pedigo, Pylin Sarobol, P. Su, J.E. Blendell, C.A. Handwerker, Purdue University

• Review IPC’s catalog of multimedia training resources, including DVDs, interactive CD- ROMs, online video resources, training and reference guides, wall posters and image archives. • Learn about IPC’s management programs, market research reports and technology roadmaps. Member prices will be extended to all attendees on-site, even if you aren’t one! And, save 25% on all IPC training DVDs … any quantity … any IPC title … only during show hours. While you’re at the bookstore, pick up a new IPC publications catalog.

FREE Internet Lounge Take a quick minute to catch up with the office so you can focus on the new products on the show floor. FREE access to computers will be available in a convenient spot in the hall.

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor

IPC First Annual Silent Auctions

Analysis of Electrochemical Migration Kinetics

Tuesday, April 6 and Wednesday, April 7

Booth 901

Thanks to generous donations, the IPC Foundation sponsors an “all academic poster competition” at IPC APEX EXPO to foster better cooperation between industry and academia in the areas of electronic interconnection technology. In addition, the Foundation has funded IPC trade show scholarships to individuals experiencing financial hardship. See page 57 for details.

Amendra Koul, Missouri University of Science and Technology Xiaofei He, Michael H. Azarian, Michael Pecht, University of Maryland

Lifetime Modeling of an Embedded Planar Capacitor Laminate

Mohammed Alam, Michael H. Azarian, Michael Pecht, University of Maryland

Effect of Pb Additions on the Creep and Tensile Behavior of Sn3.0Ag0.5Cu Solder Jonathon P. Tucker, Purdue University

www.IPCAPEXEXPO.org

EFD® is now Nordson EFD

™

See us at Booth 1641

info@nordsonefd.com www.nordsonefd.com IPC APEX EXPO™

Programs for Executives CONNECT. THRIVE. DISCOVER. IPC PCB Executive Management Meeting

IPC EMS Management Council Meeting

Wednesday, April 7

Islander I

Senior leaders of PCB manufacturing companies are invited to this exclusive meeting. PCB executives from around the world will gather to discuss best practices. This meeting is open to members and nonmembers, but you must represent a PCB manufacturer to attend. Registration is required.

Agenda

7:30 am 8:00 am 8:10 am

Networking Breakfast Welcome and Introductions Are the Consequences of Industry Consolidation Good or Bad? Jack Calderon, Managing Director, Lincoln International Encouraging Technology Growth: Opportunities Open to PCB Manufacturers John Dement, Technology Engagement Office/ORTA, NSWC Crane Pam Simonds, General Manager, Amphenol Printed Circuits PCB Management Council Working Session • CAD Checklist for the PCB Industry • Whitepaper: Patents — What the PCB Executive Needs to Know • IPC Executive Agent Task Force Update • IPC Intellectual Property Task Force Update The Patent Process: What is Patentable and How Do I Get One? Raj Kumar, Vice President & Chief Technology Officer, DDi Lunch Where Should You Be? Results of the IPC PCB Executive Benchmarking Survey Sharon Starr, Director of Market Research, IPC Roundtable Discussions Adjourn Show Floor Reception VIP Networking Dinner

9:00 am

10:15 am

11:15 am

Noon 1:30 pm

2:30 pm 4:30 pm 5:00 pm 6:00 pm

If you head an EMS company, this meeting will help you find solutions to the challenges you face. Spend the day with other EMS executives from around the world discussing business strategy and best practices. This meeting is open to members and nonmembers, but you must represent an EMS company to attend. Registration is required.

Agenda

7:30 am 8:00 am 8:10 am

Networking Breakfast Welcome and Introductions Q & A Panel: How Chinese and North American Companies Manage Common Business Situations Kim Vandermeulen, CEO, Alternative Manufacturing Michael Goeringer, VP, Operations, Arc-Tronics Mark Wolfe, VP, Quality Supply Management, Phoenix Int’l. Corp. Yang Rong, President Assistant, Daya Bay Guanghong Electronics Co., Ltd. Zhu Tao, Managing Director, Best System (HK) Limited Wu Zhixiang, General Manager, Sevenus Electronic Technology Co., Ltd. Considering Sale or Raising Your Firm’s Value — Factors Influencing EMS Company Value and How They May Be Managed Wallace Leyshon, President/CEO, Heartland Industrials Realizing How Cost Accounting Impacts Profitability and Quoting in an EMS Organization Brian Throneberry, VP of Sales, API Technologies Inc. Lunch What It Takes to Be a Player: Alternative Technologies and the EMS Industry • Solar and Photovoltaics Jack Calderon, Managing Director, Lincoln International Irene Sterian, Manager, Corporate Process Development, Celestica • LEDs Dan Gatza, Director, Lighting Segment, Arrow Electronics The Lean Surface Mount Line Kenneth Heifner, VP, Quality & Operations, SMS Technologies Roundtable Discussions Adjourn to Show Floor Reception VIP Networking Dinner

10:00 am

11:00 am

Noon 1:30 pm

3:15 pm

Certification Programs Registration is required.

Introduction to EMS Training and Program Management

Coral A

Tuesday, April 6, 8:00 am–5:00 pm Wednesday, April 7, 8:00 am–1:00 pm

Susan Mucha, Powell-Mucha Consulting Inc.

EMS Leadership Training

Coral A

Thursday, April 8, 8:00 am–5:00 pm Friday, April 9, 8:00 am–5:00 pm Don Turner, DWT Management

EMS Program Manager Training and Certification Exam Saturday, April 10, 8:00 am–12:00 pm

Coral A

Islander H

3:45 pm 5:00 pm 6:00 pm

Special Session: Contracting with the Customer: What the EMS Manager Needs to Know Shell Seekers A Friday, April 9, 9:00 am–5:00 pm

Jeff Roth and Allen Anderson, Fees & Burgess, P.C. Without a doubt, negotiating with OEMs is one of the biggest challenges facing the EMS executive. What needs to be covered in the contract? Is your company protected? What should you do if there is a dispute? This workshop addresses the specific issues EMS companies face while contracting. Participants must be representatives of EMS companies to attend. Registration is required.

www.IPCAPEXEXPO.org

IS415 Laminate and Prepreg IS415 InIn more more products. products. InIn more more places. places. IS415

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IS415 - COMPARISON dB/inch loss Loss dB/inch 16 mil wide Microstrips

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Next generation product combining electrical and thermal performance. • Non-phenolic, non-dicy cured, lead free assembly compatible material • RoHS compliant

• Very High Tg - 200ºC DSC • Very High Td - 370ºC by TGA • Dk equivalent to Std High Tg FR406

• Global availability - Standard constructions in North America and Asia Pacific • Outstanding IST performance — PTH reliability (very low z-axis CTE)

• Df equivalent to Std Mid Dk materials (40% lower than phenolic-cured systems) • Finished multi-layer boards passed 6x through lead free assembly conditions at 260ºC

• Electrical test methods make a difference in Dk and Df values - Bereskin Stripline Test Method Df @ 2 GHz - 0.0125 Df @ 10 GHz - 0.0127 - Split Post Cavity Test Method Df @ 2 GHz - 0.0084 Df @ 10 GHz - 0.0090

• IPC 4101/ C slash sheet approval / 21 / 24 / 26 / 28 / 121/ 124 /129

• CTE z-axis (50ºC – 260ºC) = 2.8% equivalent to filled phenolic systems • Exhibited CAF resistant > 600 hours at 85ºC/85 RH, 0.010” space, 10, 48 and 100 VDC

The data, The while data, believed while believed to be to accurate be accurate and based and based on analytical on analytical methods methods considered considered to be to reliable, be reliable, is for information is for information purposes purposes only. only. Any sales Any of sales these of these materials materials will bewill governed be governed by theby terms the terms and conditions and conditions of theof agreement the agreement underunder which which they are they sold. are sold.

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Visit us at IPC APex exPo™, Booth #847

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Programs for Designers CONNECT. THRIVE. DISCOVER. IPC Designers Day Registration is required.

Thursday, April 8

Islander D

Designers Day offers a full-day, design-focused program. Network with designers, learn at the Designers Day program and then hit the show floor to evaluate suppliers. Designers Day registration includes a networking reception following the conference, free admission to the exhibit hall — including lunch there on Thursday — and access to free keynote sessions, free forums and poster sessions.

Designers Day Agenda 8:00 am 8:30 am 10:00 am 11:30 am 1:00 pm 2:00 pm 3:30 pm 5:00 pm

Welcome Keynote: Roadmap of the Future for Electronic Design Dieter Bergman, IPC HDI: 21st Century Design Dan Smith, 30-year veteran of software design firms and military contractors Lunch on the Show Floor 10 Things Every Designer Should Know Ruth Delker, CID, Cipher Systems, Inc. and Scott McCurdy, Freedom CAD, Inc. Placement and Routing Decision Making Susy Webb, CID, FairfieldNodal EMI: High Frequency/High Speed Design Rick Hartley, CID, L-3 Avionics Systems Inc. Networking Reception

Designer Certification (CID and CID+) Program Registration is required. Certified Interconnect Designer (CID) Workshops Dieter Bergman, IPC Friday, April 9 8:00 am–5:00 pm Saturday, April 10 8:00 am–5:00 pm

Coral C

Advanced Certified Interconnect Designer (CID+) Workshops Kate Mayer, CID+, Mayer Associates Friday, April 9 8:00 am–5:00 pm Saturday, April 10 8:00 am–5:00 pm

Coral B

CID Exam Sunday, April 11

Coral C 8:00 am–3:00 pm

CID+ Exam Sunday, April 11

8:00 am–3:00 pm

Coral B

Check out our newest addition to IPC APEX EXPO 2010 …

Visit our exhibitors in PHOTOVOLTAICS 22

www.IPCAPEXEXPO.org

Technical Programs Free Forums DISCOVER. CONNECT. THRIVE. Industry experts discuss challenges, cutting-edge solutions and new opportunities in these free interactive forums on the Show Floor (booth 2400).

Tuesday, April 6 Test & Inspection Summit 1:30 pm–3:00 pm Moderator: Rick Nelson, Editor-in-Chief, Test and Measurement World Panelists: Heiko Ehrenberg, Managing Director US Operations, GOEPEL Electronics LLC Chad Hankinson, President, Fixture and Services Group, Everett Charles Technologies David Levine, National Sales Manager, Seica Inc. Jack Rozwat, General Manager, EMT Americas, Agilent Technologies Frank Silva, Vice President, FocalSpot, Inc. The emergence of 3-D chips is posing test challenges to board and system designers as well as chip makers. Designers and manufacturers will have to pay particular attention to design-for-test techniques, leveraging the DFT that chip makers provide to support PCB test, field diagnostics, and field firmware upgrades. Building on the 2009 Summit, a panel of experts will discuss the latest test challenges and the technologies that are emerging to deal with them, including JTAG/boundary-scan test and vectorless test techniques as well as the continued role of in-circuit electrical test, optical inspection, X-ray inspection and functional electrical test.

Military Roadmap 3:15 pm–4:45 pm Moderator: Steve Lach, Vice President, North America Operating & Global Engineering, Viasystems Group Inc. Panelists: George Trinite, Advanced Interconnect Manager, Sanmina-SCI Rajesh Kumar, Vice President & Chief Technology Officer, DDi Corp. Al Wasserzug, Director of Corporate Development, Vulcan Flex Circuit Corporation Charged with the development and implementation of a PCB and interconnect technology roadmap for the Department of Defense (DoD), the DoD Executive Agent (EA) is required to create a policy to ensure that the DoD has access to PCB manufacturing capabilities and the technical expertise necessary to meet future military requirements. To assist the EA, leading North American printed board manufacturers on the IPC Executive Agent Task Force created a roadmap which identifies the challenges printed board designs and materials will need to overcome to meet future DoD and OEM needs. This forum will cover the various sections of the roadmap.

Wednesday, April 7 Solar Panels: New Opportunities for Electronics 10:30 am–12:00 pm Moderator: Dongkai Shangguan, Ph.D., Vice President — Advanced Technology, Flextronics International Panelists: Alan Rae, Ph.D., Managing Member, TPF Enterprises LLC Ryne P. Raffaelle, Ph.D., Director, National Renewable Energy Lab Bettina Weiss, Sr. Director, Photovoltaic Segment, SEMI International Green is hot! And it looks like there’s nothing greener than solar. What opportunity does this offer for you? How will electronics support the “green wave” to solar power? Join us for this forum on technology and opportunity!

IPC APEX EXPO™

Changing Environment of Printed Circuit Board Technology and the Evolution of Safety 1:30 pm–3:00 pm Presenters: Crystal Vanderpan, Principal Engineer P.C. Technologies, and Greg Monty, Director, Underwriters Laboratories Inc. UL has been in the forefront in research in many product areas and has recently been very active in the area of printed boards. Learn the details of UL’s recent and ongoing PCB research, including possible changes in test methods, requirements and standards, in order to accommodate the quickly changing board and material technologies. Hear how your company can use UL labs and technical experts to collaborate on new research.

IPC Technology Roadmap 3:15 pm–4:45 pm Moderator: Jack Fisher, Interconnect Technology Analysis, Inc. Panelists: Dieter Bergman, Director of Technology Transfer, IPC Michael Weinhold, Technical Director, EIPC Wouldn’t it be nice to have a yellow brick road to follow to business success? Unfortunately, nothing in business is that simple. Companies spend considerable time understanding the needs and wants of their customers and trying to figure out the direction technology is moving. But is their data comprehensive? And what about opportunities to enter new markets or extend beyond a current customer base? The IPC Technology Roadmap provides fabricators, EMS companies, designers, and materials and equipment suppliers with a consolidated view of today’s solutions and tomorrow’s needs for the printed board and assembly supply chain. This seminar will provide attendees with an understanding of the critical information contained in the roadmap and explain how it can be used to develop business and market strategies, and to validate and justify capital investment or to guide development activities. Learn how the IPC Technology Roadmap can become a part of building your own yellow brick road!

Thursday, April 8 Don’t Be Surprised by the New RoHS 10:30 am–12:00 pm Moderator: Fern Abrams, Director, Government Relations and Environmental Policy, IPC Panelists: Michael Battaion, Corporate Director, Environmental Leadership, Flextronics International Krista Botsford, Founder/Principal, Botsford EcoTech Partners LLC Michael Hutchings, Program Manager — Substance PMO, Sun Microsystems Inc. John Sharp, Corporate Product Compliance Manager, TriQuint Semiconductor, Inc. The Eu RoHS Directive had an enormous impact on the electronics industry and, now, the European Union is at it again. Our panel of experts will discuss proposed changes to the RoHS Directive that are currently being debated in Europe, including a new and broader scope of covered electronics, additional substance restrictions and a new compliance program under the CE mark.

Technical Programs Professional Development Courses DISCOVER. CONNECT. THRIVE. Registration is Required. Course descriptions are available at www.IPCAPEXEXPO.org.

Friday, April 9

Thursday, April 8

PD-06 Implementing SMT Technologies Tradewinds D W. James Hall and Phil Zarrow, ITM Consulting Inc.

9:00 am–12:00 pm

PD-01 PCB Fabrication Basics: Process Tradewinds D and Specification Don Schmieder, Plexus Electronic Assembly Corp. and Jim Vanden Hogen, Plexus Corp.

PD-11 Designing PCB Stack-ups to Balance Signal Integrity Against Manufacturability Lee Ritchey, Speeding Edge

Mariners A

PD-03 Lead-Free Reliability Tradewinds C Ronald Lasky, Ph.D., Indium Corporation of America

PD-13 Basics of PCB Design Susy Webb, CID, FairfieldNodal

Mariners B

PD-05 Statistical Process Control (SPC) Tradewinds B for SMT Electronics Assembly Rita Mohanty, Ph.D., Speedline Technologies Inc

PD-15 Flexible and Rigid Flex Circuit Design Principles and Fabrication Requirements Vern Solberg, STC-Madison

Tradewinds A

PD-17 High Speed Signal Integrity PCB Design Richard Hartley, CID, L-3 Avionics Systems Inc.

Tradewinds B

PD-19 Integrating Design For Excellence (DFX) into the PCB Design Process Mike Febo and Jim Vanden Hogen, Plexus.

Tradewinds C

PD-07 Package on Package (PoP), STACK Assembly, Rework and Inspection Bob Willis, ASKbobwillis.com

Tradewinds E

PD-09 Survival Is Not Mandatory: 10 Things Every CEO Should Know About Lean Steven Williams, Plexus.

Shell Seekers A

PD-24 4 P’s of SMT in a Lead-Free World: Tradewinds A Principles, Practices, Promises and Problems Ray Prasad, Ray Prasad Consultancy PD-25 Advanced Component Packages Tradewinds F and Processes S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

2:00 pm–5:00 pm PD-02 Flex Circuitry is More than an Tradewinds B Electrical Interconnect Mark Finstad and Mark Verbrugge, Minco Products Inc. PD-04 SMT Process Fundamentals for Tradewinds C Tin-Lead and Lead-Free Assembly S. Manian Ramkumar, Ph.D., Rochester Institute of Technology PD-08 Conformal Coating Applications, Tradewinds D Inspection, Rework and Quality Control Bob Willis, ASKbobwillis.com PD-10 Ball Grid Array (BGA): Principles and Practice Ray Prasad, Ray Prasad Consultancy

Tradewinds A

PD-21 Printed Circuit Board Fabrication: Shell Seekers A Back to Basics Michael Carano, OMG Electronic Chemicals PD-34 Lead-Free for the Exemptee: Surviving in a Lead-Free World Tradewinds E W. James Hall and Phil Zarrow, ITM Consulting Inc.

PD-27 Counterfeit Components — Causes, South Pacific B Cures and Solutions Bob Willis, ASKbobwillis.com PD-29 Mastering Lead-Free and Tin-Lead Tradewinds F Selective Soldering Bob Klenke, ITM Consulting Inc. PD-33 Achieving High Reliability for South Pacific A Lead-Free Solder Joints — Materials Consideration Ning-Cheng Lee, Ph.D., Indium Corporation of America PD-35 Fighting Thermal Cycling Effects Gabe Cherian, Cherian Enterprises

Tradewinds E

PD-37 The Skinny on Lean — A Lean South Pacific C Primer Focused on SMT States Mead, Panasonic Factory Solutions Company PD-39 DFM for Manufacturing: When A Six Sigma Process Is Not Sufficient To Achieve a High Yielding Manufacturing Process Dale Lee, Plexus

South Pacific D

2:00 pm–5:00 pm PD-12 Purchasing Basics for the PCB Buyer Mariners A Gary Ferrari, FTG Circuits PD-14 Designing with Your “Thumbs” Susy Webb, CID, FairfieldNodal

Mariners B

PD-16 HDI: Essential Requirements for Implementation — Routing into the Future Daniel Smith

Tradewinds D

PD-18 Process Challenges and Metallization Options for Embedding Chip-on-Board into Mainstream SMT Mukul Luthra, Waterfall Technologies, Canada

Tradewinds C

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. PD-26 Stencil Printing Process for South Pacific B Solder Paste Application — An In-Depth Look S. Manian Ramkumar, Ph.D., Rochester Institute of Technology PD-28 Lead-Free SMT: Troubleshooting for Higher Yields Chrys Shea, Shea Engineering Services

Tradewinds F

PD-30 Practical Tips for Rework of South Pacific D Advanced Packages — Reballing BGAs, Leadless Device Rework Norman Mier Jr. and Robert Wettermann, B E S T Inc. PD-32 The NEW J-STD-001 Revision E — Learn from the Leaders Dan Foster, Defense Acquisition Incorporated; Teresa Rowe, AAI Corporation PD-20 Circuit Grounding to Control Noise Tradewinds B and EMI Richard Hartley, CID, L-3 Avionics Systems Inc. PD-22 Advanced PCB Troubleshooting: Identification, Analysis and Prevention of Critical Defects Michael Carano, OMG Electronic Chemicals

IPC APEX EXPO™

Tradewinds A

South Pacific A

PD-38 Lead-Free Material and Solder: South Pacific C Impact on Manufacturing and Field Reliability With a Focus on Failure Analysis of Assembly Case Studies Martin Anselm, Universal Instruments Corporation

Technical Programs Technical Posters DISCOVER. CONNECT. THRIVE. Technical posters will be on display Tuesday through Thursday in South Pacific F. Authors will be available to answer questions on Wednesday, 3:30 pmâ&#x20AC;&#x201C;4:30 pm. There is no charge to attend. P01 Printable Materials and Devices for Electronic Packaging Rabindra Das, Ph.D., Endicott Interconnect Technologies, Inc P02 High Density Substrate Solution for Complex FinePitch Flip Chip Applications Vern Solberg, Solberg Technical Consulting P03 Robust Void Detection and Measurement Bonnie Bennett, Intel Corporation P04 Effect of Squeegee Blade on Solder Paste Print Quality Rita Mohanty, Ph.D., Speedline Technologies, Inc. P05 Determining Dielectric Properties of High Frequency PCB Laminate Materials John Coonrod, Rogers Corporation P06 Design Guidelines for Stencil Design Using Regression Equation to Improve Yield After Reflow Machine in Printed Circuit Assembly (PCA) Process Subrat Prajapati, Larsen & Toubro Ltd. P07 An Example of a Universal, Low-pin Count Automated Test Equipment for Printed Circuit Assemblies Heiko Ehrenberg, GOEPEL Electronics LLC P08 Sculpted Flex Circuits Provide Interconnect Solutions Al Wasserzug, Vulcan Flex Circuit Corporation P09 Solder Joint Reliability from Material Properties Christopher Hunt, Ph.D., National Physical Laboratory P10 RoHS/REACH Compliance Challenges for RF-IC Packages Bora Mumtaz, Peregrine Semiconductor P11 Simplifying Conversion and Enhancing Outgoing Product Quality on the ICOS Vision System with TRIZ Darin Moreira, Intel Microelectronics

P14 Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages Under Torsion Loads Vikram Srinivas, University of Maryland P15 A Novel Technology of Packaging Substrate and Application Thereof Chih Kuang Yang, Princo Corp., Taiwan P16 EA Activated Hydrogen Fluxless Soldering: A Promising Solution to Advanced Packaging and 3D Interconnection C. Christine Dong, Air Products and Chemicals P17 An Optimized N2 Inerting Technology for Wave Soldering C. Christine Dong, Air Products and Chemicals P18 Corrosion Impacts from Free Air Cooling Randy Schueller, Ph.D., DfR Solutions P19 Design of Diplexer Using in Wi-Fi System with Embedded Passive Technology Yung-Chung Chang, Industrial Technology Research Institute P20 Cryogrinding Method for Laminate Formulation Development Anteneh Worku, Dow Chemical USA P21 Performance Comparison of Alloy/Flux Systems on an Automated Selective Soldering Machine Edward Cherizola, Cookson Electronics / Alpha Metals P22 Detecting Faulty ICs in Depot Repair David Sigillo, Seica Inc.

P12 Initial Corrosion Study of Soldered Interconnects Utilizing No-Clean Flux Roger Berg, Medtronic Inc.

P23 New Techniques Challenge Traditional Stencil Manufacturing Beliefs Richard Lieske, DEK USA Inc.

P13 A Novel Low Loss Material for High Frequency PCB Application Juho Shin, Doosan Electro-Materials Co. Ltd., South Korea

P24 Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards David Lee, Johns Hopkins University P25 Influence of Conductor Surface for High Frequency PCB on Electrical Properties and Reliability Mutsuyuki Kawaguchi, MEC Company Ltd. P26 High Density Integration by Embedding Chips Reduced Size Modules and Electronic Systems Arnaud Grivon, Thales Services EPM, France

www.IPCAPEXEXPO.org

Technical Programs Technical Conference DISCOVER. CONNECT. THRIVE. Registration is required.

Technical Conference AT A GLANCE Emerging Technologies S03 S18 S19 S20 S24 S34

Emerging Technology Photo Chemical Etching POP I: The Practical Solution for Mixed Function IC Integration Emerging Technology II: Embedded Actives Solar PV Module Assembly: Challenges & Opportunities Package-on-Package II: The Practical Solution for Mixed Function IC Integration

Quality, Reliability and Test S08 S09 S11 S12 S13 S16 S21 S23 S28 S33

Test and Inspection I High Reliability Assembly: Reliability and Rework Tin Whiskers Backwards Compatibility Test and Inspection II Moisture Effects in Laminates Laminate Dielectric Properties and Characterization Low-Silver Alloys Reliability I Reliability II

PCB Fabrication and Materials S01 S06 S12 S16 S21

PCB Fabrication Chemistry of Plating Backwards Compatibility Moisture Effects in Laminates Laminate Dielectric Properties and Characterization

Design S04 Design

Assembly Processes for Lead Free and Tin Lead S05 S09 S15 S23 S27 S29 S30 S32 S35

Lead-Free Issues High Reliability Assembly: Reliability and Rework Head On Pillow I Low-Silver Alloys Printing I Assembly Process Optimization Head On Pillow II Printing II Lead-Free Processing

Environmental Issues and Compliance S26 Environmental Regulation S31 Halogen-Free Material

Supply Chain/Business Issues S10 S14 S22 S29 S32

The Challenges of Counterfeit Components Business and Data Transfer New and Improved Standards Assembly Process Optimization Printing II

Cleaning/Coating/Contamination S02 S07 S17 S25

Cleaning I Cleaning II Contamination and Corrosion I Contamination and Corrosion II

IPC APEX EXPO™

S01

PCB Fabrication

Tuesday, April 6 1:30 pm–3:00 pm South Pacific B Gary Roper, Roper Resources, Inc. Fabrication of flex and laminates is a demanding process. In today’s competitive environment, an increase in efficiency in all areas is needed to be cost effective as a fabricator. In this session, papers on reel-to-reel flex production, registration and drilling will bring you up to date on the latest methods to improve the bottom line of your fabrication process. 1:30 pm Production of Flexible Circuits in Reel-to-Reel Horizontal Production Systems Stephan Kenny, Atotech Deutschland GmbH, Germany 2:00 pm A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources Lionel Fullwood, WKK Distribution Ltd., Hong Kong 2:30 pm Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties Lameck Banda, Ph.D., Dow Chemical USA

S02

Cleaning I

Tuesday, April 6 1:30 pm–3:00 pm South Pacific C Beverley Christian, Ph.D., Research In Motion Limited, Canada It’s a new world of cleaning! Lead free, cost pressures and the never-ending question of “how clean is clean” present today’s assembly operations with constant challenges. The papers in this first of two sessions on cleaning technology address these challenges head on. Learn how lead free has made cleaning a new ball game, what the cost of cleaning really is and how new technology will help you better assess the effectiveness of your cleaning operation. 1:30 pm Lead-free Flux Technology and Influence on Cleaning Ning-Cheng Lee, Ph.D., Indium Corporation of America 2:00 pm Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership Mike Savidakis, Ph.D., Petroferm 2:30 pm Validity of the IPC R.O.S.E. Method 2.3.25 Researched Mike Bixenman, D.B.A., Kyzen Corporation

S03

Emerging Technology

Tuesday, April 6 1:30 pm–3:00 pm South Pacific A R. Wayne Johnson, Ph.D., Auburn University If there’s one thing you can count on, it’s the evolution of technology for manufacturing. Old technologies evolve to fit the needs of today. New technologies emerge to provide new opportunities for product development and manufacture. This session will showcase the latest in ink jet printing technology for circuit manufacture and 3-D embedded technology employing active and passive components. 1:30 pm The Use of Inkjet Printing Technology for Fabricating Electronic Circuits: The Promise and the Practical Thomas Sutter, Dow Electronic Materials 2:00 pm Industrial PCB Development Using Embedded Passive & Active Discrete Chips Focused on Process and DfR. Arnaud Grivon, Thales Services EPM, France 2:30 pm A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit Minsu (Tim) Lee, Ph.D., Doosan Corp. Electro-Materials Corp., South Korea 27

Technical Programs Technical Conference DISCOVER. CONNECT. THRIVE. S04

Design

Tuesday, April 6 1:30 pm–3:00 pm Islander G Michael Beauchesne, Amphenol Printed Circuits, Inc. Interested in wafer level technology? The best method for designing to grid on a PCB? How to best use embedded technology in your next design? If you answered yes, then this session highlighting the latest information in these areas of product design is just for you. 1:30 pm PCB Design and Assembly for Flip-Chip and Die Size CSP Vern Solberg, STC-Madison 2:00 pm The Universal PCB Design Grid System Tom Hausherr, Valor Computerized Systems 2:30 pm A Strategy for Via Connections in Embedded Sheet Capacitance Designs J. Lee Parker, Ph.D., JLP

S05

Lead-Free Issues

Tuesday, April 6 1:30 pm–3:00 pm Islander F Russell Nowland, Alcatel-Lucent Lead free has never been an easy manufacturing issue to deal with. One of the great challenges with lead free is the position we now find ourselves in on the manufacturing learning curve. Where tin-lead solders have years of history, study and reliability testing, lead free is the “new kid on the block” with no history and only limited reliability credentials. This session focuses on studies of lead-free defects and reliability modeling that will move us along the learning curve. If you’re still struggling with your personal “learning curve” in lead free, then join us for the latest in research on leadfree defects and reliability. 1:30 pm Lead-Free Acceleration Factors: Overview, Testing and Validation Jean-Paul Clech, Ph.D., EPSI 2:00 pm Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation Werner Engelmaier, Engelmaier Associates, L.C.

S06

Chemistry of Plating

Tuesday, April 6 3:15 pm–4:45 pm South Pacific B Dennis Fritz, MacDermid, Inc. Plating is a key technology for producing solderable surface finishes and reliable PCB interconnection. In this session, the basic chemistry of the plating process and the latest developments for reliable and cost-effective plating technology are showcased. 3:15 pm Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal Jim Kenny, Enthone Cookson 3:45 pm Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards David Lee, Johns Hopkins University 4:15 pm Chemical “Kick Start” for the Autocatalytic FormaldehydeFree Electroless Copper Plating Process Tafadzwa Magaya, Atotech Deutschland, Germany

S07

Cleaning II

Tuesday, April 6 3:15 pm–4:45 pm South Pacific C Scott Priore, Cisco Systems Inc. In this second session on cleaning, we expand to cover the issues associated with cleaning of OA flux. Learn the tradeoffs between water only and the new chemistries for cleaning high density assemblies. Discover the best method for cleaning stencils and misprinted boards. Top off your knowledge base with the latest information on this important assembly technology. 3:15 pm OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters Mike Bixenman, D.B.A., Kyzen Corporation 3:45 pm Case Study — “Limitations of DI-Water Cleaning Processes” Umut Tosun, ZESTRON America 4:15 pm Cleanliness of Stencils and Cleaned Misprinted Circuit Boards Beverley Christian, Ph.D., Research In Motion Limited, Canada

S08

Test and Inspection I

Tuesday, April 6 3:15 pm–4:45 pm South Pacific A Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD Test and inspection is more than a go/no-go issue. Customers demand functional, reliable products and test and inspection can make that happen. In this first of two sessions, experts discuss repeatability in test, the coordination of test methods (X-ray, AOI, in circuit, etc.) and the use of X-ray in void detection to help you optimize your test processes. 3:15 pm Robust Automated Void Detection in Solder Balls and Joints Bonnie Bennett, Intel Corporation 3:45 pm Zoom Fixtures for ATE Gary St. Onge, Everett Charles Technologies 4:15 pm Advances in Automatic Monitoring of Screen Printing Processes Richard Johnson, DEK International, UK

S09

High Reliability Assembly: Reliability and Rework

Tuesday, April 6 3:15 pm–4:45 pm Islander G Michael Beauchesne, Amphenol Printed Circuits, Inc. In high reliability markets, there is no room for error. Find out how companies in the aerospace and military markets address the problems associated with reliability and repair and rework in the lead-free era. 3:15 pm Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component Rework/Repair Douglas Pauls and David Hillman, Rockwell Collins 3:45 pm NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test Thomas Woodrow, Ph.D., The Boeing Company 4:15 pm Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges Between the Leads of HandReworked Fine-Pitch Components Jeff Kukelhan, BAE SYSTEMS Electronics

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. S10

The Challenges of Counterfeit Components

Tuesday, April 6 3:15 pm–4:45 pm Islander F James Williams, Polyonics, Inc. Counterfeit isn’t just a problem for clothing and bootleg electronics. Today, it is a major problem touching all levels of the electronics industry and even compromising government security. You need to be proactive in addressing this threat. Walk away with the best methods to protect your company from this growing menace by joining this panel discussion. 3:15 pm Counterfeit James Williams, Polyonics, Inc. 3:45 pm The Challenges of Counterfeit Components Hal Rotchadl, Premier Semiconductor Services 4:15 pm Counterfeit Jack Stradley, Rochester Electronics LLC

S11

Tin Whiskers

Wednesday, April 7 9:00 am–10:00 am South Pacific B Beverley Christian, Ph.D., Research In Motion Limited, Canada Lead free has begotten a host of problems and issues for manufacturing and reliability. Not the least of these is the issue of tin whiskers. But what makes a whisker? And how can it be prevented? Get answers to these questions in this revealing session. 9:00 am Conformal Coatings for Tin Whisker Risk Management William Fox, Lockheed Martin Missiles & Fire Control 9:30 am Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues Keith Sweatman, Nihon Superior Co., Ltd., Japan

S12

Backwards Compatibility

Wednesday, April 7 9:00 am–10:00 am South Pacific C Jasbir Bath, Bath Technical Consultancy It would be wonderful if all changes, especially mandated changes, were carefully coordinated in execution. Unfortunately, we live in an imperfect world. The mandated change to lead free has been fraught with issues resulting from the very process of change from lead to lead free. How does one best handle the issue of dealing with the interface between the two technologies? Hear how backwards compatibility need not be the onerous task it may appear to be. 9:00 am Bridging Supply Chain Gap for Exempt High-Reliability OEMs Hal Rotchadl, Premier Semiconductor Services

S13

Test and Inspection II

Wednesday, April 7 9:00 am–10:00 am South Pacific A Steven Perng, Cisco Systems, Inc. Our second session on test and inspection focuses on in-circuit testing. Overcome the in-circuit test issues for your products with the knowledge you gain in this session. 9:00 am Benefits and Limitations of Universal, Low Pin-Count Automated Test Equipment for Printed Circuit Assemblies Heiko Ehrenberg, GOEPEL Electronics LLC 9:30 am A Flexible Fixturing System for In-Circuit Test of High NodeCount Circuit Boards Robert Jukna, Jabil

Everett Charles Technologies (ECT) Contact Products Group (CPG), Fixture Services Group (FSG), and atg Luther & Maelzer GmbH, the market leader in providing electrical test solutions to the PCB and Package Industry, will feature the latest electrical test technologies in booth 1782 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV. ECT’s companies will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its range of electrical test equipment and accessory products. Everett Charles Technologies, a subsidiary of Dover Corporation (NYSE: DOV), is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, Pogo® test contacts, and bare and loaded PCB test fixtures.

IPC APEX EXPO™

Technical Programs Technical Conference DISCOVER. CONNECT. THRIVE. S14

Business and Data Transfer

Wednesday, April 7 9:00 am–10:00 am Islander G J. Lee Parker, Ph.D., JLP Consultants LLC Hardware may be the life blood of manufacturing and assembly processes may be the muscles of the product-realization process, but it’s the information and data that are the brains. Master how to “work smart” with data to optimize cash flow and the bottom line. 9:00 am Effective Transition of Electronics Production Between Manufacturing Sites Paul Novak, Delphi Corporation 9:30 am Migrating from Paper to Interactive Paperless Work Instructions John Stimadorakis, ScanCAD International, Inc.

S15

Head On Pillow I

Wednesday, April 7 9:00 am–10:00 am Islander F Robert Priore, Cisco Systems Inc. As design and assembly tolerances decrease, the opportunities for a “perfect storm” of small errors increase exponentially. Hard-to-isolate solder defects, like “head-on-pillow” defects, increase the risk of bringing your assembly process to a halt. Learn the best ways to combat this assembly problem in this first of two sessions. 9:00 am Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control Russell Nowland, Alcatel-Lucent 9:30 am Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly Mario Scalzo, Indium Corporation

S16

Moisture Effects in Laminates

S18

Photo Chemical Etching

Wednesday, April 7 10:15 am–11:45 am South Pacific A Patricia Goldman, Dielectric Solutions, LLC Photochemical etching is a technology offering a new range of possibilities for assembly. Gain an understanding of this emerging technology for manufacturing from our learned panel. 10:15 am Photochemical Machining (PCM) for Cost-effective, Rapid Production David Allen, Cranfield University 10:45 am Photochemical Machining and Photoetching: What Can It Do For You? Mike Lynch, United Western Enterprises Inc. 11:15 am Precision Parts Made by Photochemical Machining Anthony Marrett, PrecisionMicro Ltd

S19

Packaging On Packaging I: The Practical Solution for Mixed Function IC Integration

Wednesday, April 7 10:15 am–11:45 am South Pacific B Jeff Murdock, XACT PCB Software With the higher temperatures of lead-free processing moisture sensitivity is no longer a package issue only. Today’s laminates can suffer from delamination as a result of entrapped moisture expanding during leadfree assembly. They can also show degraded performance by moisture absorption alone. How does moisture impact performance and board properties? And how can assembly defects from trapped moisture can be detected? Get answers to those critical questions in this important session. 10:15 am Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor Scott Hinaga, Cisco Systems, Inc. 10:45 am Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD 11:15 am Assessment of Moisture Content Measurement Methods for Printed Circuit Boards Christopher Hunt, Ph.D., National Physical Laboratory, UK

Wednesday, April 7 10:15 am–11:45 am Islander G Bob Willis, ASKbobwillis.com Solutions for packaging multiple die elements in a single-package outline have evolved rapidly. A solution that has proved very efficient is packageon-package (PoP). This methodology vertically combines fully packaged and pretested discreet logic and memory on separate array-configured package substrate levels that are designed to align and mount on top of one another. This first of a two-part session will furnish the market outlook, assembly process methodologies and key infrastructure elements that have evolved to enable integrating the new generations of high-performance discreet logic and memory die elements within a single package outline. 10:15 am Market Forecast and Applications for Package-on-Package Jim Walker, Gartner, Inc. 10:45 am Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly Ning-Cheng Lee, Ph.D., Indium Corporation of America 11:15 am PCB Assembly System Set-Up for PoP Gerry Padnos, Juki Automation Systems

S17

S20

Contamination and Corrosion I

Wednesday, April 7 10:15 am–11:45 am South Pacific C David Hoover, Multek Inc. The level of agreement between the real-world, electrical performance of a board and the original design intent can make a product famous or make it a flop. In today’s highly stressful environment of lead-free assembly, is the old standby of SIR testing enough to predict operational performance? This session will uncover the issues of SIR testing and electrochemical migration. Tap into the knowledge base of our experts and discover how to make your products famous for performance. 10:15 am Understanding SIR Eric Bastow, Indium Corporation 10:45 am Effects of Solder Mask on Electrochemical Migration of TinLead and Lead-Free Boards Xiaofei He, University of Maryland 11:15 am Solder Paste Residue Corrosivity Assessment: Bono Test Celine Puechagut, INVENTEC 30

Emerging Technology II: Embedded Actives

Wednesday, April 7 10:15 am–11:45 am Islander F R. Wayne Johnson, Ph.D., Auburn University For many, new portable electronics embedded passives are a sine qua non. What about the possibility of embedded actives? This session will introduce you to the rapidly growing field of 3-D integration of active and passive components within the PCB structure. 10:15 am Embedded Packaging Technologies: Embedding Components to Meet Form, Fit, and Function Casey Cooper, STI Electronics, Inc. 10:45 am Printable Materials and Devices for Electronic Packaging Rabindra Das, Endicott Interconnect Technologies, Inc.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. S21

Laminate Dielectric Properties and Characterization

Wednesday, April 7 1:30 pm–3:30 pm South Pacific B Louis Hart, Compunetics Inc. The new electronic products of today are not possible without an efficient match between the intelligence of the components and the interconnectivity of the substrate. As components grow more and more complex, the PCB is keeping step with new and varied materials and technologies. Hear how PCB material and design development and associated testing are continuing to advance the capabilities of today’s hot new products. 1:30 pm Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency George Kang, Arlon-MED 2:00 pm Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD 2:30 pm Low Loss & Novel Halogen-Free Laminates for HighFrequency Device Applications Anderson Cheng, Ph.D., ITEQ Corporation 3:00 pm Determining Dielectric Properties of High Frequency PCB Laminate Materials John Coonrod, Rogers Corporation

Apex Ad SMT 03

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S22

New and Improved Standards

Wednesday, April 7 1:30 pm–3:30 pm South Pacific C Patricia Goldman, Dielectric Solutions, LLC Want to know the latest in new standards development cooking up at IPC? Hear about the new and hot standards that support the industry in dealing with the ever-changing nature of electronics design and manufacturing. 1:30 pm Design to Manufacturing Standards — What’s Now, What’s New, What’s Next? Dieter Bergman, IPC 2:00 pm IPC/JEDEC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), LeadFree (Pb-Free) and Other Attributes Fern Abrams, IPC; Jack McCullen, Intel Corp; Lee Wilmot, TTM Technologies 2:30 pm The Value of IPC-2152 Michael Jouppi, Lockheed Martin Space Systems Company 3:00 pm IPC-2221, Keeping Pace with the Times Gary Ferrari, FTG Circuits

Page 1

BTU has been a leader in SMT reflow for well over two decades. A major force in the transition to convection reflow, BTU’s closedloop convection continues to set the standard for process performance. In 2010, BTU’s financial strength, global footprint and industry leadership makes us the perfect fit for SMT.

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See Us At Booth 871

Technical Programs Technical Conference DISCOVER. CONNECT. THRIVE. S23

Low-Silver Alloys

Wednesday, April 7 1:30 pm–3:30 pm South Pacific A Jasbir Bath, Bath Technical Consultancy Lead-free alloys have not yet proven themselves in attachment reliability the way the old standby lead solders have over the years. Moreover, leadfree alloys have shown a disturbing tendency to lack the shock and vibration performance of their leaded counterparts. This session tackles the need for data on lead free for a new class of low silver alloys. If you have reliability concerns, this session is for you. 1:30 pm Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys Joe Smetana, Alcatel-Lucent 2:00 pm Achieving High-Reliability, Low-Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping Ning-Cheng Lee, Ph.D., Indium Corporation of America 2:30 pm Low-Silver BGA Assembly Phase II-Reliability Assessment. Fifth Report: Preliminary Thermal Cycling Results Chrys Shea, Shea Engineering Services

S24

Solar PV Module Assembly: Challenges & Opportunities

Wednesday, April 7 1:30 pm–3:30 pm Islander G Dongkai Shangguan, Ph.D., Flextronics International Solar power is hot! Meeting today’s energy needs with environmentally “green” sun power presents a huge opportunity in electronics assembly. Join our invited group of experts who will discuss critical issues for solar module assembly:

• Technology Overview • Assembly Process • Assembly Equipment • Materials • Certification and Industry Standards • Process Capability, Quality Control, and Reliability • Design for Manufacturing • Industry Outlook & Business Models

S25

Module Assembly Process Dongkai Shangguan, Ph.D., Flextronics International Module Assembly Material Steven Greene, STR Module Assembly Equipment Patrick Hofer-Noser, 3S Industries AG Module Assembly Standards David Torp, IPC Module Certification Richard Bozicevich, TUV

Contamination and Corrosion II

Wednesday, April 7 1:30 pm–3:30 pm Islander F Russell Nowland, Alcatel-Lucent Session two on contamination and corrosion continues our explanation of the how and whys of corrosion processes that threaten the reliability of today’s assemblies. 1:30 pm Creep Corrosion of OSP and ImAg PWB Finishes Chen Xu, Ph.D., Lucent Technologies Inc. 2:00 pm An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics Douglas Pauls, Rockwell Collins 2:30 pm Relationship of Via Size and Cleanliness Eric Camden, Foresite

S26

Environmental Regulation

Thursday, April 8 9:00 am–10:00 am South Pacific B John Burke, Optichron Inc. REACH. RoHS. What else is on the horizon? Find out what you need to know to ensure your company is compliant with existing environmental regulations and prepared for what’s coming down the road. 9:00 am Where are REACH SVHC in Electronic Products and Parts? Walter Jager, Intertek 9:30 am Round Robin Testing in Support of IPC J-STD-709 Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl Javier Falcon, Ph.D., Intel Corporation

S27

Printing I

Thursday, April 8 9:00 am–10:00 am South Pacific C Paul Lotosky, Cookson Electronics Paste printing is still the heart of the surface mount assembly process. If you’re serious about making this “heart” of your process strong and healthy, let industry experts guide you with the latest on stencil design and optimization of the clamping of boards during print. 9:00 am Effect of Board Clamping System on Solder Paste Print Quality Rita Mohanty, Ph.D., Speedline Technologies, Inc 9:30 am Stencil Design Considerations to Improve Drop Test Performance Jeff Schake, DEK USA Inc.

S28

Reliability I

Thursday, April 8 9:00 am–10:00 am South Pacific A Gary Ferrari, FTG Circuits Reliability. In many cases, you simply can’t live without it! Learn how to achieve it and, more importantly, how to test for it in this first session of two on the topic. 9:00 am Fighting the Undesirable Effects of Thermal Cycling Gabe Cherian, Cherian Enterprises 9:30 am Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors Michael Azarian, Ph.D., University of Maryland

S29

Assembly Process Optimization

Thursday, April 8 9:00 am–10:00 am Islander G Helmut Oettl, Rehm Thermal Systems GmbH, Germany A poorly designed assembly process can be as damaging to your company’s bottom line as a poorly designed product. This session brings together two industry experts who will help you master control of placement metrology and assembly of high power components. 9:00 am Poor Metrology: The Hidden Cost Michael Cieslinski, Panasonic Factory Solutions Company of America 9:30 am Using DMAIC Methodology for MLP Reflow Process Optimization Dennis Lang, Fairchild Semiconductor

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. S30

Head On Pillow II

Thursday, April 8 9:00 am–10:00 am Islander F Robert Priore, Cisco Systems Inc. Session two of our head-on-pillow series continues with more information on how to do battle with this insidious solder defect. 9:00 am Head-On-Pillow Defect — A Pain in the Neck or Head-OnPillow BGA Solder Defect Chris Oliphant, Research in Motion Ltd., Canada 9:30 am A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects Guhan Subbaraya, Cisco Systems Inc

S31

Halogen-Free Material

Thursday, April 8 10:15 am–11:45 am South Pacific B David Hoover, Multek Inc. Are you prepared to meet OEM needs for halogen-free products? Join us for an overview of how far halogen free may go and novel approaches to halogen-free assemblies. 10:15 am Challenges Toward Implementing a Halogen-Free PCB Assembly Process Chris Anglin, Indium Corporation of America 10:45 am A Novel Halogen-Free Material for High Speed PCB Minsu (Tim) Lee, Ph.D., Doosan Corp. Electro-Materials BG, South Korea 11:15 am Polyphenylene Ether Macromolecules. VI. Halogen-Free Flame Retardant Epoxy Resins Edward Peters, Ph.D., Sabic Innovative Plastics

IPC APEX EXPO™

S32

Printing II

Thursday, April 8 10:15 am–11:45 am South Pacific C Paul Lotosky, Cookson Electronics Our second session on printing addresses the issues associated with stencil and squeegee design and the printing of paste for small passives. Learn how you can improve this vital assembly process within your company. 10:15 am Stencil Options for Printing Solder Paste for .3mm Pitch CSPs and 01005 Chip Components William Coleman, Ph.D., Photo Stencil Inc. 10:45 am Effect of Squeegee Blade on Solder Paste Print Quality Rita Mohanty, Ph.D., Speedline Technologies, Inc 11:15 am Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume Chris Anglin, Indium Corporation of America

Technical Programs Technical Conference DISCOVER. CONNECT. THRIVE. S33

Reliability II

Thursday, April 8 10:15 am–11:45 am South Pacific A Gary Ferrari, FTG Circuits The issues of drop shock and pad cratering in lead-free assembly along with the reliability of embedded capacitors will be covered in this second session. Don’t miss this important wrap up on reliability. 10:15 am Drop Test Performance of Medium Complexity Lead-Free Board After Assembly and Rework Jason Bragg, Celestica Inc. 10:45 am Pad Cratering Evaluation of PCB Dongji Xie, Ph.D., Flextronics International USA 11:15 am Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors Mohamed Alam, University of Maryland

S34

Package-on-Package II: The Practical Solution for Mixed Function IC Integration

Thursday, April 8 10:15 am–11:45 am Islander G Irene Sterian, Celestica International Inc., Canada The second session dedicated to package-on-package will focus on PoP assembly in the EMS environment, supply chain management of vertically stacked Ics for efficient assembly line processing and new underfill technologies for reliability of PoP. 10:15 am Basic PCB Level Assembly Process Methodology for 3-D Package-on-Package Vern Solberg, STC-Madison 10:45 am Designing the PCB for Efficient Pop Underfill Brad Perkins, Asymtek 11:15 am Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package-on-Packages under Torsion Loads Vikram Srinivas, Center for Advance Life Cycle Engineering, UMD

S35

Lead-Free Processing

Thursday, April 8 10:15 am–11:45 am Islander F Helmut Oettl, Rehm Thermal Systems GmbH, Germany You can’t be too rich, too beautiful or have too much up-to-the-minute information on lead-free assembly. Let our hot papers from Intel, HP, Universal and Samina bring you up to date on the important issue of leadfree processing. 10:15 am Progress in Developing Industry Standard Test Requirements for Solder Alloys Gregory Henshall, Ph.D., Hewlett Packard 10:45 am Characterizing the Lead-Free Impact on PCB Pad Craters Brian Roggeman, Universal Instruments Corporation 11:15 am Challenges in Reflow Profiling Large & High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes Raiyomand Aspandiar, Intel Corporation and Robert Kinyanjui, Sanmina-SCI

Put IPC Membership to Work for YOU Join 2,700 companies worldwide and take a leadership role in shaping our collective future SAVE 25% on first-year dues when you join during the show! Visit the IPC booth 2073 for more details. For more than 50 years, company leaders have looked to IPC for the tools, information and forums they need to thrive in the electronic interconnect industry. Whether your company is a small start-up, a mid-size organization poised for growth, a Fortune® 500 firm or an educational or government institution, IPC membership puts valuable resources at your disposal, so you can get serious about what matters to you most … your success. • Stay INFORMED • NETWORK WITH INDUSTRY LEADERS • ACCESS MARKET RESEARCH • TRAIN YOUR PEOPLE • CONTAIN COSTS • MARKET YOUR BUSINESS • SHAPE THE INDUSTRY

Serving the printed board manufacturing, electronics assembly and test industries and their customers and suppliers

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DISCOVER. CONNECT. THRIVE. IPC Specification Tree Electronics Assembly

TERM AND DEFINITIONS IPC-T-50

ACCEPTANCE

Design Track

IPC-DRM-40 IPC-A-610 IPC-9191 IPC-DRM-SMT POSTERS

ASSEMBLY

ASSEMBLY J-STD-001 IPC-HDBK-001 IPC-9261 IPC-7912

SOLDERABILITY IPC-WP-001 J-STD-002 J-STD-003 IPC-WP-005 IPC-TR-461 IPC-TR-462 IPC-TR-464 IPC-TR-465-1 IPC-TR-465-2 IPC-TR-465-3 IPC-TR-466 IPC-TR-585

ASSEMBLY SUPPORT SMC-WP-002 IPC-DRM-18 IPC-DW-426 IPC-TR-581 IPC-TA-722 IPC-TA-723 IPC-CM-770 IPC-SM-780 IPC-SM-785 IPC-S-816 IPC-AJ-820 IPC-TP-1115 IPC-1720 IPC-7095 IPC-7525 IPC-7526 IPC-7530 IPC-7711/7721 IPC-9701 IPC/JEDEC-9702 IPC/JEDEC-9704 IPC-9850 IPC-9851

IPC-D-279 IPC-D-326 IPC-C-406 IPC-C-408 IPC-7351

ASSEMBLY MATERIALS Flux/Solder J-STD-004 IPC-HDBK-005 J-STD-005 J-STD-006 IPC-TP-1043 IPC-TP-1044 Adhesives IPC-SM-817 IPC-CA-821 IPC-3406 IPC-3408 Coat/Mask/Marking IPC-CC-830 IPC-HDBK-830 IPC-HDBK-840 IPC-SM-840 IPC-4781

ADVANCED IPC-TR-001 IPC-WP-003 J-STD-012 J-STD-013 J-STD-026 J-STD-028 IPC-SM-784 IPC-MC-790

PRINTED BOARD/ ACCEPTANCE IPC-DW-425 IPC-TR-486 IPC-A-600 IPC-QE-605 IPC-OI-645 IPC-TF-870 IPC-ML-960 IPC-1710 IPC-4761 IPC-6011 IPC-6012 IPC-6013 IPC-6015 IPC-6016 IPC-6018 IPC/JPCA-6801 IPC-9151 IPC-9191 IPC-9194 IPC-9199 IPC-9252 IPC-9691

LAMINATE

EHS IPC-WP/TR-584 IPC-1065 J-STD-609 IPC-1331 IPC-1751 IPC-1752

IPC APEX EXPO™

FOIL IPC-CF-152 IPC-1731 IPC-4562 IPC-4563

Rigid IPC-1730 IPC-4101 IPC-4103 Flex IPC-FC-234 IPC-4202 IPC-4203 IPC-4204 HDI IPC-DD-135 IPC-4104

CABLE AND WIRE HARNESS IPC-DRM-WHA IPC-WHMA-A-620

COMPONENTS J-STD-020 J-STD-027 J-STD-032 J-STD-033 J-STD-035 IPC-9501 IPC-9502 IPC-9503 IPC-9504 IPC-9591 IPC-9592

FABRICATION IPC-DR-572 IPC-TA-724 IPC-4552 IPC-4553 IPC-4554

EMBEDDED TECHNOLOGIES IPC-2316 IPC-4811 IPC-4821

REINFORCEMENT IPC-SG-141 IPC-A-142 IPC-QF-143 IPC-1731 IPC-4110 IPC-4121 IPC-4130 IPC-4411 IPC-4412

OPTOELECTRONICS IPC-0040 IPC-8413-1

CLEANING/ CLEANLINESS IPC-SC-60 IPC-SA-61 IPC-AC-62 IPC-CH-65 IPC-TR-468 IPC-TR-476 IPC-TR-580 IPC-TR-581 IPC-TR-582 IPC-TR-583 IPC-SM-839 IPC-5701 IPC-5702 IPC-9201

INTERFACES IPC-D-310 IPC-A-311 IPC-D-356 IPC-2501 IPC-2511 IPC-2531 IPC-2541 IPC-2546 IPC-2547 IPC-2571 IPC-2581 IPC-2582 IPC-2583 IPC-2584 IPC-2588

PRINTED BOARD SMC-WP-004 IPC-D-859 IPC-1902 IPC-2141 IPC-2221 IPC-2222 IPC-2223 IPC-2224 IPC-2225 IPC-2226 IPC-2251 IPC-2252 IPC-2315 IPC-2615

IPC Staff Liaison Jack Crawford — JackCrawford@ipc.org Tom Newton — TomNewton@ipc.org John Perry — JohnPerry@ipc.org Dieter Bergman — DieterBergman@ipc.org Jeanne Cooney — JeanneCooney@ipc.org Fern Abrams — FernAbrams@ipc.org February 2010

Technical Programs Standards Development Meetings DISCOVER. CONNECT. THRIVE. Registration is required.

Assembly and Joining Processes 5-21e Solder Stencil Task Group Wednesday, April 7 8:00 am–12:00 pm Shell Seekers A William Coleman, Ph.D., Photo Stencil Inc. This task group will begin development of revision B to IPC-7525, Stencil Design Guideline This guide assists users in selecting stencil apertures for solder paste printing and now provides expanded support for use with lead-free alloys.

5-21h Bottom Termination Components (BTCs) Task Group Wednesday, April 7 8:00 am–5:00 pm Coral C Ray Prasad, Ray Prasad Consultancy; Vern Solberg, STC-Madison This task group is developing a companion document to IPC-7094 and IPC7095 that describes the design and assembly challenges for implementing bottom termination components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. The focus of the document is on critical design, assembly, inspection, repair and reliability issues associated with bottom-only termination type components.

5-22a J-STD-001 Task Group Thursday, April 8 8:00 am–8:30 am Islander H Teresa Rowe, AAI Corporation This task group has developed revision E of IPC J-STD-001, Requirements for Soldered Electrical & Electronic Assemblies, and will be celebrating the document’s release.

5-22as Space Electronic Assemblies J-STD-001 Addendum Task Group Tuesday, April 6 10:00 am–12:00 pm Tradewinds C Garry McGuire, NASA Marshall Space Flight Center This task group is continuing development of J-STD-001ES, Space Applications Electronic Hardware Addendum.

5-22bt J-STD-001 Training Task Group Tuesday, April 6 1:30 pm–3:00 pm Mariners B Teresa Rowe, AAI Corporation This working group provides technical guidance for the certification program of J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The agenda for this meeting is to review J-STD-001E training plans.

5-22f J-STD-001 Handbook Task Group Thursday, April 8 1:00 pm–5:00 pm Islander H Daniel Foster, Defense Acquisition Inc. This task group will begin the process for a major revision to IPC-HDBK-001, Handbook and Guide to Supplement J-STD-001. The handbook needs to be aligned to J-STD-001E and the content significantly updated to include lead free, new fluxes, solder alloys and other issues that are not in previous versions.

5-23a Printed Circuit Board Solderability Specifications Task Group Wednesday, April 7 1:30 pm–5:00 pm Mariners B Gerard O’Brien, Solderability Testing and Solutions Inc. This task group is updating IPC J-STD-003B. The C revision of this document will address more wetting balance data generation and include a solder spread test protocol.

5-23b Component and Wire Solderability Specification Task Group Wednesday, April 7 8:00 am–12:00 pm Mariners B David Hillman, Rockwell Collins This task group is working on consolidating the IPC/ECA J-STD-002C, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, and JESD 22-B102 (JEDEC document on same topic) into a single document as J-STD-002D. 36

5-24a Flux Specifications Task Group Tuesday, April 6 10:00 am–12:00 pm Tradewinds B Renee Michalkiewicz, Trace Laboratories - East This group is beginning to develop revision C of J-STD-004, Requirements for Soldering Fluxes.

5-24b Solder Paste Task Group Thursday, April 8 8:00 am–11:00 am South Pacific H Brian Toleno, Ph.D., Henkel Corporation This group is continuing work on revision A of J-STD-005, Requirements for Soldering Pastes.

5-24f Underfill Adhesives for Flip Chip Applications Task Group Tuesday, April 6 3:15 pm–5:00 pm Coral C Brian Toleno, Ph.D., Henkel Corporation; Fonda Wu, Raytheon Company This task group is updating J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages.

7-31h IPC-HDBK-620 Handbook Task Group Tuesday, April 6 10:00 am–12:00 pm Mariners B Randy McNutt, Northrop Grumman Corp.; Brett Miller, USA Harness, Inc. This task group is developing a handbook to support users of IPC/ WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

7-35

Assembly and Joining Handbook Subcommittee

Tuesday, April 6 10:00 am–5:00 pm Tradewinds A Mary Muller, Crane Aerospace & Electronics This subcommittee is nearing completion of a major update to IPC-AJ-820, Assembly and Joining Handbook, that now incorporates the best parts of IPC-HDBK-001 and IPC-PE-740 documents, plus IPC-HDBK-830, IPC-CM-770 and DRM-18.

Assembly Equipment 5-41

SMT Component Placement Equipment Subcommittee

Friday, April 9 8:00 am–11:00 am Islander H Michael Cieslinski, Panasonic Factory Solutions Company This committee is developing revision A to IPC-9850 Surface Mount Placement Equipment Characterization. This will encompass a major rewrite of the standard because of pick-and-place equipment technologies.

Base Materials 3-11

Laminate/Prepreg Materials Subcommittee

Wednesday, April 7 8:00 am–12:00 pm Mariners A Tony Senese, Panasonic Electric Works This subcommittee is gathering information for revision D of IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards. Comments on this document are solicited and will be discussed.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. 3-11g Corrosion of Metal Finishes Task Group

3-12e Base Materials Roundtable Task Group

Thursday, April 8 1:00 pm–3:00 pm South Pacific I Beverley Christian, Ph.D., Research In Motion Limited, Canada This task group is exploring and gathering data on the effects of corrosion on surface finishes.

Tuesday, April 6 3:15 pm–5:00 pm Tradewinds B Edward Kelley, Isola Group SARL Using an open discussion format, this task group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated.

3-12a Metallic Foil Task Group Wednesday, April 7 3:15 pm–5:00 pm Mariners A Rolland Savage, High Performance Copper Foil Inc. This task group is working on generating a noncontact test method and will be gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562, Metal Foil for Printed Board Applications.

3-12d Woven Glass Reinforcement Task Group Tuesday, April 6 1:30 pm–3:00 pm Tradewinds B Patricia Goldman, Dielectric Solutions, LLC This task group continues to explore the dielectric constant (permittivity) for E-glass and will examine the data obtained from testing this property by glass fiber manufacturers for possible inclusion into IPC-4412, Specification for Finished Fabric Woven from “E” Glass for Printed Boards, as a specification value. This effort follows the guideline value that was inserted into IPC-4412A via Amendment 2. The group will also work on the inclusion of three new glass weaves, principally from the Japanese market.

Cleaning and Coating 5-31

Cleaning & Alternatives Subcommittee

Wednesday, April 7 1:30 pm–5:00 pm Tradewinds D Mike Bixenman, D.B.A., Kyzen Corporation This subcommittee is creating a new handbook on cleaning of electronic assemblies and related operations, such as stencil cleaning. The subcommittee will review content for the primary sections of this handbook, including solvent, aqueous and semiaqueous cleaning.

5-32a/ Joint Meeting — Ionic Conductivity and 5-32c Bare Board Cleanliness Assessment Task Groups Thursday, April 8 8:00 am–11:00 am Mariners B Douglas Pauls, Rockwell Collins; John Radman, Trace Laboratories Denver This joint meeting will address the development of an IPC-5703 cleanliness guideline for fabricators and a proposed round-robin test for examining extract solutions for assemblies.

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Technical Programs Standards Development Meetings DISCOVER. CONNECT. THRIVE. 5-32b SIR and Electrochemical Migration Task Group Tuesday, April 6 1:30 pm–5:00 pm Mariners A Chris Mahanna, Robisan Laboratory Inc. This task group is conducting SIR research on IPC-B-52 test assemblies and developing an IPC-B-52 test vehicle users guideline.

5-32e Conductive Anodic Filament (CAF) Task Group Tuesday, April 6 10:00 am–12:00 pm Coral C Karl Sauter, Sun Microsystems, Inc. This task group will consider comments to revision B of IPC-9691A, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing).

5-33b/ Joint Meeting — Solder Mask Performance D-13b and Cover Coat Materials Task Groups Wednesday, April 7 8:00 am–10:00 am Coral B David Vaughan, Taiyo America, Inc.; Steve Musante, Raytheon Missile Systems This joint meeting will address the proposed revision E of IPC-SM-840, Qualification and Performance Specification of Permanent Solder Mask, that addresses flexible cover materials in addition to solder mask materials.

5-33c Conformal Coating Handbook Task Group Thursday, April 8 1:00 pm–5:00 pm Mariners B Amy Hagnauer, Raytheon Company; Jason Keeping, Celestica This task group is developing revision A to IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings.

5-33f Potting and Encapsulation Task Group Wednesday, April 7 10:15 am–12:00 pm Tradewinds D Barry Ritchie, Dow Corning Corporation This newly formed task group is evaluating industry needs for potting and encapsulation of conformal coatings.

Data Generation & Transfer/ Documentation 2-18

Supplier Declaration Subcommittee

2-18x Laminate Declarations Thursday, April 8 1:00 pm–5:00 pm Captain’s Douglas Sober, Kaneka Texas Corporation This is an exploratory meeting to determine if there is industry interest in development of a data exchange standard for laminate materials. The standard could include information that companies need to know about the laminates they purchase and use. It is expected that the standard would be based on the XML schema in the 175x family of supplier declarations.

Data Generation & Transfer/Shop Floor Communication 2-10/ Joint Meeting — Data Generation and 2-13 Transfer Committee and Shop Floor Communication Subcommittee Tuesday, April 6 1:30 pm–5:00 pm Magellan Andrew Dugenske, Georgia Institute of Technology; Karen McConnell, Lockheed Martin, EPI Center The 2-10 committee oversees all CAD, CAM and CAE data transfer standards described in the IPC-25XX series, including standards such as GenCAM®, CAMX, PDX, OffSpring, and the Message Broker. The 2-13 subcommittee will discuss the IPC-2540 standards and their implications for both end-users and equipment suppliers on the factory floor.

Electronic Documentation Technology 2-40

Electronic Documentation Technology Committee

Thursday, April 8 8:00 am–11:00 am Coral C Eric Simmon, National Institute of Standards and Technology This subcommittee has developed IPC-1751A for supplier data exchanges, including materials declarations (IPC-1752A) and manufacturing process declarations (IPC-1756). The subcommittee will review the XML schema for all supplier declaration standards.

Tuesday, April 6 10:00 am–12:00 pm Magellan Karen McConnell, Lockheed Martin, EPI Center The 2-40 committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machine.

2-18b Materials Declaration Task Group

CRANE- CRANE Embedded Passives Committee EP (By Invitation)

Wednesday, April 7 8:00 am–5:00 pm Shell Seekers B Mark Frimann, Texas Instruments Inc. This task group will review the materials declaration standard IPC-1752A and discuss feedback on recent enhancements to the standard. The group will discuss further enhancements, review the tools available for use with IPC-1752A, and discuss plans to gain further adoption of the standard.

2-18f Packaging Declarations Task Group Friday, April 9 8:00 am–3:00 pm Islander E John Ciba, Brady Corporation; Lee Wilmot, TTM Technologies, Inc. This task group will review and discuss a strawman for a data exchange standard for packaging/packing materials. The standard will include information that companies need to know about the packaging/packing they purchase and use as well as those purchased and used by their suppliers when shipping products or items for the company. This could address use of restricted materials as well as recycling, material content, applicable standards and laws, labels, etc. This standard would be based on the XML schema in the 175x family of supplier declarations.

Embedded Components Wednesday, April 7 8:00 am–10:00 am Tradewinds D Jason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLC Status on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles. The emulator project will also be presented to encourage candidate designs for embedded passive integration.

D-51

Embedded Devices Design Subcommittee

Thursday, April 8 8:00 am–11:00 am Islander I Gary Ferrari, FTG Circuits This subcommittee is developing a working draft of IPC-2227, Sectional Design Standard for Printed Boards Containing Embedded Devices.

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DISCOVER. CONNECT. THRIVE. D-52

Embedded Component Materials Subcommittee

Thursday, April 8 3:15 pm–5:00 pm Islander I David McGregor, Du Pont This subcommittee has completed Amendment 1 to IPC-4821, Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards, and is continuing to address material impacts from the possible incorporation of active embedded components.

D-54

Embedded Devices Test Methods Subcommittee

Thursday, April 8 1:00 pm–3:00 pm Islander I Jan Obrzut, Ph.D., National Institute of Standards and Technology This subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices used in printed boards and specifically, a power rating for embedded resistors.

Environment, Health & Safety 4-30

Environment, Health & Safety (EHS) Steering Committee

Thursday, April 8 1:00 pm–5:00 pm Islander E Lee Wilmot, TTM Technologies, Inc. The EHS Committee is responsible for promoting cleaner and safer electronics manufacturing worldwide. The committee will discuss regulations affecting the electronics industry, including the Globally Harmonized System for the Classification and Labelling of Chemicals, health and safety regulations, revisions to the RoHS Directive currently under consideration by the EU, and global climate-change regulations.

4-33

Halogen-Free Materials Subcommittee

Tuesday, April 6 10:00 am–12:00 pm Tradewinds D Douglas Sober, Kaneka Texas Corporation This subcommittee will consider new comments for revision B of the white paper/technical report on low-halogen base materials. This white paper/ technical report focuses on the legislative, marketing and environmental pressures to remove halogenated flame retardants from PCBs and electronic assemblies. Additionally, this group will discuss how to assist the efforts on halogen-free and its application to other electronic products beyond PCBs and their assemblies.

4-33a Low-Halogen Guideline Task Group Tuesday, April 6

1:30 pm–5:00 pm

Tradewinds D

This task group will review the draft standard on the definition of lowhalogen electronics, including printed circuit boards, components, electronics assemblies, cables and mechanical plastics.

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Technical Programs Standards Development Meetings DISCOVER. CONNECT. THRIVE. 4-34b Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group Tuesday, April 6 10:00 am–12:00 pm Coral B Jasbir Bath, Bath Technical Consultancy; Jack McCullen, Intel Corporation; Lee Wilmot, TTM Technologies, Inc. With the transition to a variety of lead-free solders, labeling of circuit board properties is increasingly important for PCB manufacture and assembly, OEM manufacturing, rework and repair of printed circuit assemblies and end-of-life disposition (recycling or disposal). This combined working group of IPC and JEDEC will review IPC/JEDEC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes.

D-15

Flexible Circuits Test Methods Subcommittee

Thursday, April 8 3:15 pm–5:00 pm South Pacific G Rocky Hilburn, Insulectro; Duane Mahnke, Mahnke Consulting This subcommittee provides test methods required by the other subcommittees within the D-10 Flexible Circuits Committee. IPC-TM-650, Test Methods Manual, which is defined in all flexible circuits committee documents, will be examined in detail for applicability and need for replacement or revision. Also, any test methods specified in new flexible circuitry documents will be generated. Specifically, revision A of the test method on service temperature for flexible base materials, TM 2.6.21, is nearing completion.

Fabrication Processes

High Speed/High Frequency Interconnections

4-14

D-20

Plating Processes Subcommittee

Thursday, April 8 1:00 pm–3:00 pm South Pacific H George Milad, Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc. This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/ immersion plating. The subcommittee is continuing its work on IPC-4555, Specification for Organic Solder Preservative (OSP) for Printed Circuit Boards. In addition, the group will be generating a new specification for ENEPIG surface finish.

Flexible and Rigid Printed Boards 3-11f/ Joint Meeting — UL/CSA and UL 796F & D-12a UL 746F Task Groups Friday, April 9 11:00 am–12:00 pm Islander G Jack Bramel, Jack Bramel & Associates; Duane Mahnke, Mahnke Consulting These combined task groups provide a forum for ideas and data for both rigid and flexible printed boards and materials to support efforts on four UL standards: UL 746E, UL 796, UL 746F and UL 796F. Industry input will be provided to the appropriate UL Industry Advisory Group (IAG) for both rigid and flex materials/printed boards or to the Standards Technical Panel (STP) groups for rigid or flexible materials/printed boards.

Flexible Circuits D-11

Flexible Circuits Design Subcommittee

Thursday, April 8 1:00 pm–3:00 pm South Pacific G William Ortloff, Raytheon Company This subcommittee is developing revision C of IPC-2223, Sectional Design Standard for Flexible Printed Boards, that will include a new addendum providing design guidance/tutorials for the printed board designer.

D-12

Flexible Circuits Specifications Subcommittee

Tuesday, April 6 10:00 am–12:00 pm Mariners A Nick Koop, Minco Products Inc. This subcommittee is developing HDI acceptance criteria for IPC-6013, Qualification and Performance Specification for Flexible Printed Boards, and will discuss the development of criteria for ACF bonding films.

D-13

Flexible Circuits Base Materials Subcommittee

Thursday, April 8 8:00 am–11:00 am South Pacific G Clark Webster, ALL Flex LLC This subcommittee maintains IPC-4202, Flexible Base Dielectrics for Use in Flexible Printed Circuitry, IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films, and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry. IPC-4202A will be released at IPC APEX EXPO 2010. IPC-4204 revision A work will continue at this meeting.

High Speed/High Frequency Committee

Tuesday, April 6 10:00 am–12:00 pm Shell Seekers A Edward Sandor, Taconic Advanced Dielectric Division This is a planning meeting for the task group and subcommittee leaders of the D-20 Committee. The group will discuss concepts for future revisions to IPC-2141, IPC-2251 and IPC-2252.

D-22

High Speed/High Frequency Board Performance Subcommittee

Tuesday, April 6 1:30 pm–5:00 pm Shell Seekers A Mahendra Gandhi, Northrop Grumman Aerospace Systems This subcommittee is working on revision B of IPC-6018, Microwave End Product Board Inspection and Test, evaluating the document in comparison to the older IPC-HF-318 standard.

D-23

High Speed/High Frequency Base Materials Subcommittee

Thursday, April 8 8:00 am–11:00 am Mariners A Edward Sandor, Taconic Advanced Dielectric Division This task group is developing revision A to the IPC-4103 materials specification for high frequency laminates, comparing it to the older IPC-L125A specification.

D-24

High Speed/High Frequency Test Methods Subcommittee

Wednesday, April 7 8:00 am–10:00 am Tradewinds B Don DeGroot, CCNi This oversight subcommittee will discuss potential revisions to existing test methods to evaluate high speed/high frequency boards and materials.

D-24b Propagation Loss Test Method Task Group Wednesday, April 7 3:15 pm–5:00 pm Shell Seekers A Richard Mellitz, Intel Corporation This task group is considering updates to IPC-TM-650, Method 2.5.5.12, Test Methods to Determine the Amount of Signal Loss on Printed Boards.

D-24c High Frequency Test Methods Task Group: Frequency-Domain Methods Wednesday, April 7 10:15 am–12:00 pm Tradewinds B Mike Janezic, Ph.D., National Institute of Standards and Technology This task group determines the needs of the microelectronics industry for high frequency dielectric test methods. The group is reviewing recent results from a transmission line test method for characterizing dielectric materials.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Management IP

SPVC Solder Products Value Council Steering Committee (By Invitation)

Intellectual Property Committee

Tuesday, April 6 10:00 am–12:00 pm Captain’s This committee is working to develop an intellectual property standard for PCB manufacturers. The standard is expected to support the DoD in developing a trusted source program for PCB manufacturers and may also be of interest to commercial markets.

Tuesday, April 6 1:30 pm–5:00 pm Tradewinds C Karl Seelig, AIM, Inc. The SPVC Steering Committee’s objective is to identify and execute programs designed to enhance the competitive position of solder manufacturers and their customers.

8-40

TAEC Technical Activities Executive Committee (By Invitation)

Roadmap Steering and Planning Committee

Monday, April 5 9:00 am–12:00 pm Captain’s Jack Fisher, Interconnect Technology Analysis, Inc. The committee will discuss the strategy for the 2011 IPC Technology Roadmap.

CCC

Committee Chairman Council (By Invitation)

Monday, April 5 4:00 pm–5:30 pm Islander H Peter Bigelow, IMI Inc. This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs.

Tuesday, April 6 5:00 pm–6:30 pm Tradewinds C Leo Lambert, EPTAC Corporation This committee comprises leaders of all IPC general committees and oversees IPC’s standardization efforts.

Packaged Electronic Components B-10a/ Joint Meeting — Plastic Chip Carrier JEDEC Cracking Task Group and JEDEC JC-14.1 JC-14.1

SMEMA Council Steering Committee (By Invitation)

Thursday, April 8 7:00 am–9:00 am Captain’s Robert Black, Juki Automation Systems, Inc. The SMEMA Council Steering Committee is dedicated to developing projects and initiatives to further the growth of IPC member companies that supply assembly equipment.

Tuesday, April 6 10:00 am–5:00 pm Shell Seekers B Steven Martell, Sonoscan Inc. During this joint meeting, IPC-B-10a and JEDEC JC-14.1 groups will continue revision efforts on J-STD-020D, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, and J-STD-033B, Handling, Packing, Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices.

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Technical Programs Standards Development Meetings DISCOVER. CONNECT. THRIVE. Printed Board Design Technology 1-10b Current Carrying Capacity Task Group Wednesday, April 7 10:15 am–12:00 pm Coral B Michael Jouppi, Lockheed Martin With the publication of IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design, this task group will discuss goals for a future revision A, including high current transients, flex circuits and microvias.

1-10c Test Coupon and Artwork Generation Task Group Tuesday, April 6 3:15 pm–5:00 pm Tradewinds E Timothy Estes, Conductor Analysis Technologies, Inc. This task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. With the completion of the A/B-R coupon, the task group is evaluating needs for other coupon designs, such as peel strength, interconnect resistance and solder mask adhesion.

Process Control 7-23

Process Effects Handbook Subcommittee

Thursday, April 8 3:15 pm–5:00 pm South Pacific H Dennis Fritz, MacDermid, Inc. This subcommittee is continuing with revision B to IPC-PE-740, Troubleshooting for Printed Board Manufacture and Assembly. The revision concentrates on updating printed circuit fabrication issues, including the impact of lead-free assembly on the bare board.

Product Assurance 7-31a/ Joint Meeting — IPC-A-600 and Rigid D-33a Printed Board Performance Specifications Task Groups Thursday, April 8 1:00 pm–5:00 pm Mariners A Mark Buechner, BAE Systems These task groups are celebrating the completion of IPC-A-600H and IPC6012C, in addition to evaluating goals for future revisions to each document.

7-31at IPC-A-600 Certification Technical Committee Wednesday April 7 3:00 pm–5:00 pm Coral B Deborah Obitz, Trace Laboratories - East This working group provides technical guidance for the certification program for IPC-A-600, Acceptability of Printed Boards. The group will review IPC-A600H training plans.

7-31b IPC-A-610 Task Group Thursday, April 8 8:30 am–9:00 am Islander H Jennifer Day, U.S. Army/Stanley Associates; Constantino Gonzalez, ACME Training & Consulting This task group will celebrate completion of revision E to IPC-A-610, Acceptability of Electronic Assemblies.

7-31bt IPC-A-610 Certification Technical Committee Tuesday, April 6 3:15 pm–5:00 pm Mariners B Mary Muller, Crane Aerospace & Electronics This working group provides technical guidance for the certification program of IPC-A-610, Acceptability of Electronic Assemblies. The group will review IPC-A-610E training plans.

7-31f Wire Harness Acceptability Task Group Wednesday, April 7 8:00 am–5:00 pm Tradewinds E John Laser, L-3 Communications; Brett Miller, USA Harness, Inc. This task group is a joint effort with the Wire Harness Manufacturers Association. The group will begin revision B of IPC/WHMA-A-620, Requirements & Acceptance for Cable & Wire Harness Assemblies.

7-31fs Space Electronic Assemblies IPC/ WHMA-A-620 Addendum Task Group Thursday, April 8 10:00 am–10:30 am Islander H Garry McGuire, NASA Marshall Space Flight Center This task group will be celebrating publication of an addendum that provides exception requirements to IPC/WHMA-A-620A. This addendum enables users of the standard and addendum to specify fabrication and acceptance of cable and wire harness assemblies used in rigorous space electronics hardware.

7-31ft A-620 Technical Training Task Group Thursday, April 8 10:30 am–12:00 pm Islander H Debbie Wade, Advanced Rework Technology-A.R.T. This working group provides technical content direction for the IPC/ WHMA-A-620 training and certification program. The meeting will focus on training for A-620AS Space Electronics Hardware Addendum.

7-31j

IPC-A-630 Requirements for Structural Enclosure Task Group

Tuesday, April 6 1:30 pm–5:00 pm Coral B Eddie Hofer, Rockwell Collins; Richard Rumas, Honeywell Canada This task group is developing a handbook for box level assembly of electronic enclosures for use in military and aerospace applications. Emphasis will be placed on materials selection, mechanical assembly, fasteners, gasketing and sealing, as well as related testing associated with high level assemblies and electronic enclosures.

Product Reliability 6-10c Plated-Through Via (PTV) ReliabilityAccelerated Test Methods Task Group Wednesday, April 7 10:15 am–12:00 pm Tradewinds C Randy Reed, Viasystems Group Inc.; Dewey Whittaker, Honeywell Inc. Air Transport Systems This task group is establishing a guideline for the attributes affecting leadfree assembly process survivability.

6-10d SMT Attachment-Reliability Test Methods Task Group Wednesday, April 7 8:00 am–10:00 am Tradewinds C Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory This task group is working to complete the IPC/JEDEC-9707 spherical-bend test method for determining printed board assembly strain limits and IPC9708 for pad cratering test methods.

Rigid Printed Boards D-31b IPC-2221/2222 Task Group Wednesday, April 7 1:30 pm–5:00 pm Tradewinds C Gary Ferrari, FTG Circuits; Cliff Maddox, Boeing Company This task group is preparing a Final Draft of revision B of IPC-2221, Generic Standard on Printed Board Design.

D-35

Printed Board Storage and Handling Subcommittee

Friday, April 9 8:00 am–10:00 am Islander I C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Tom Kemp, Rockwell Collins This subcommittee is reviewing industry comments to the forthcoming IPC1601, Printed Board Handling and Storage Guidelines.

D-36

Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee

Tuesday, April 6 1:30 pm–3:00 pm Tradewinds E Gary Long, Intel Corp. This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Terms and Definitions 2-30

UL-STP UL-STP Committee (By Invitation)

Terms and Definitions Committee

Monday, April 5 2:00 pm–3:00 pm Islander H Michael Green, Lockheed Martin Space Systems This committee maintains standard industry definitions for the electronic interconnection industry within IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. The committee will provide an overview of terms being addressed in 2010.

Testing

Friday, April 9 12:00 pm–5:00 pm Islander G Brad Schmidt, Underwriters Laboratories This meeting of the Standards Technical Panel (STP), the official voting body for four UL Standards: UL 746E, UL 796, UL 746F and UL 796F, will provide STP members with additional information on proposed technical changes to one or more of the four standards.

Xtras JNAC Jisso North America Council

Wednesday, April 7 1:30 pm–5:00 pm Tradewinds B Joseph Russeau, Precision Analytical Laboratory, Inc. This subcommittee maintains and updates IPC-TM-650, Test Methods Manual. It is undergoing an extensive review of IPC test methods older than five years for reaffirmation, revision or cancellation.

Monday, April 5 1:00 pm–4:00 pm Captain’s Dennis Fritz, MacDermid, Inc. JNAC provides input to a global council identified as Jisso International Council (JIC). The JIC focuses on the Total Packaging Solution. The meeting on Monday will focus on the development of North American positions on some of the projects that have been identified in the technical working groups of the JIC and preparation for JIC 11.

7-12

Government Relations Committee Open Forum

7-11

Test Methods Subcommittee

Microsection Subcommittee

Wednesday, April 7 1:30 pm–3:00 pm Shell Seekers A Russell Shepherd, Microtek Laboratories This re-activated subcommittee is responsible for the development of concepts and guidelines for multiple mounting and microsectioning for evaluating printed board quality.

UL-IAG Industry Advisory Group Meeting for UL Friday, April 9 8:00 am–11:00 am Islander G Truda Chow, Underwriters Laboratories This is an open meeting run by UL for the purpose of resolving questions about nontechnical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronic interconnection industry. This advisory group of industry and UL personnel addresses items not appropriate for the UL-STP meetings, where only technical modifications to UL-746E, UL-796, UL-746F and UL-796F are discussed.

Thursday, April 8 9:00 am–10:00 am Islander E Daniel Feinberg, Fein-Line Associates What are your international, national, and regional concerns regarding government regulations, legislation, and international trade? How can IPC help make your business more profitable? Find out what you need to know about key lobbying issues from members of the IPC Government Relations Committee.

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IPC APEX EXPO™

Products Listing DISCOVER. CONNECT.NewTHRIVE. Acculogic, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 FLS 980Dxi Flying Scorpion FiS640 Compact In-Circuit Test System ScanNavigator™ and Victory™ software APS NOVASTAR . . . . . . . . . . . . . . . . . . . . . . . . . . . 749 EWS-310 Wave Soldering Machine ESS-310 & ESS-500 Selective Soldering Machines Aqua Klean Systems . . . . . . . . . . . . . . . . . . . . . . . 1584 AKS-M Closed Loop System Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . 725 Trident III Trident DUO Arlon Materials For Electronics . . . . . . . . . . . . . . . . . 1329 EP2 (Enhanced Polyimide) ASC International . . . . . . . . . . . . . . . . . . . . . . . . . 1634 ASC International AV 860 Series AOI ASC LineMaster SPI Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . 325 MC-24X end-of-line pick & place solution MCP Screen Printer Austin American Technology . . . . . . . . . . . . . . . . . . 2242 Mega ION Blackfox Training Institute, LLC . . . . . . . . . . . . . . . . . 1424 Skill and Knowledge Assessments Brock Electronics . . . . . . . . . . . . . . . . . . . . . . . . . 2047 Mirae Mx200LP Cluso Vision System with Dual View Camtek USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 841 GreenJet Cobar Solder Products Inc./Balver Zinn . . . . . . . . . . . . 1876 Aquasol Branded Water Soluble solder paste Cogiscan Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1828 Cycle Stop Controller Count On Tools, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 1870 Custom Engineered SMT Nozzles Custom LED Nozzles for SMT Components DEK International . . . . . . . . . . . . . . . . . . . . . . . . . 1573 Sentinel ProFlow ATx VectorGuard Double Layer Platinum Horizon Platform DIS Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1228 Direct Optical Registration System DMI International . . . . . . . . . . . . . . . . . . . . . . . . . 1175 BGA Rework Pallet EFD, Inc. A Nordson Company . . . . . . . . . . . . . . . . . . 1641 Nordson EFD UV-traceable Solder Paste Electrolube . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2459 TFA - Toluene Free Acrylic NVOC - 200ml Aerosol NVOC-HV High Viscosity Non VOC NVOC-GL Non-VOC Coating Gel DCA-FD Fast Dry DCA Coating TCER - Thermally Conductive Ethoxy RTV SWAT - Safewash Total ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1259 Tower Paraquda

IPC APEX EXPO™

Europlacer North America . . . . . . . . . . . . . . . . . . . . 2259 Xpii-II Everett Charles Technologies . . . . . . . . . . . . . . . . . . 1782 Zoom Metrix Probe Line Metrix Fixture Line FCT Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . 2317 NL930PT NL932 WS888 Finetech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2228 FINEPLACER Core Rework System Fisnar Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1529 Twin-Pack Cartridge Dispense System FlexLink Systems, Inc. . . . . . . . . . . . . . . . . . . . . . . . 877 F5000H Laser Marker FocalSpot, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2035 Mini-V Series II VIP II Image Processing Software First Article Inspection Process Software Henkel Corporation . . . . . . . . . . . . . . . . . . . . . . . . 2159 Multicore HF108 Loctite PowerstrateXtreme Printable (PSX-P) HIROX-USA, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . 450 VCR-800 MX-BGAZ II IBL Technologies LLC . . . . . . . . . . . . . . . . . . . . . . . 2311 Premium Vacuum Vapor Phase Soldering System Indium Corporation . . . . . . . . . . . . . . . . . . . . . . . . . 441 Indium8.9HF-1 Inovaxe Corporation . . . . . . . . . . . . . . . . . . . . . . . . 658 Suitcase-Sized KitCart INVENTEC PERFORMANCE CHEMICALS . . . . . . . . . . . . 465 ECOREL FREE 305-6D33 ECOFREC 303 PROMOCLEAN DISPER 605 PROMOCLEAN OVEN N°4

New Products Listing DISCOVER. CONNECT. THRIVE. IPC — Association Connecting Electronics Industries . . . . 2073 IPC-J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies IPC-A-610E, Acceptability of Electronic Assemblies IPC-A-600H, Acceptability of Printed Boards IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards IPC Wage & Salary Report for the North American EMS Industry IPC Executive Summit 2009 Highlights Recorded Live White Paper, “Take Action Limits for SAC305” 2008-2009 Analysis/Forecast for the EMS Industry IPC Printed Board Defense Roadmap Soldering Iron Tip Care (DVD-15C) JTAG Technologies . . . . . . . . . . . . . . . . . . . . . . . . 2325 JTAG Live Juki Automation Systems . . . . . . . . . . . . . . . . . . . . 1735 FX-2 high-speed chip mounter FX-3XL Kyzen Corporation . . . . . . . . . . . . . . . . . . . . . . . . .2241 AQUANOX® A4703 Malcomtech International . . . . . . . . . . . . . . . . . . . . 1431 TMR reflow oven process monitoring devices Martin GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . 638 Expert 10.6XL Rework System Milara/Mirae . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 959 P3 H1, H3 and H4 Diamond Series Atmospheric Robots MIRTEC Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2219 MX-7xi In-Line AOI System MS-11 In-Line SPI System Nihon Superior Co., Ltd. . . . . . . . . . . . . . . . . . . . . . 1426 Completely Halogen-Free SN100C P602 D4 Solder Paste Nordson EFD . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1641 Nordson EFD UV-traceable Solder Paste North Star Imaging, Inc. . . . . . . . . . . . . . . . . . . . . . 1911 ImagiX Compact Computed Tomography X-ray System efX-DR Industrial Digital Radiography Software OK International . . . . . . . . . . . . . . . . . . . . . . . . . . 1482 MRS-1000 Modular Rework System Panasonic Factory Solutions Company of America . . . . . . 1871 NPM Next Production Modular PanaCIM™ Enterprise Edition Software Suite Park Electrochemical Corp. . . . . . . . . . . . . . . . . . . . . 401 Mercurywave™ 9350 PCB Planet (India) Ltd. . . . . . . . . . . . . . . . . . . . . . . 2226 Engineering Services PCQR2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1231 PCQR2 Test Panel Coupon Strip Pillarhouse USA . . . . . . . . . . . . . . . . . . . . . . . . . . 2149 Orissa Synchrodex — Inline Fluxer IR pre-heat combo Jade Handex — Top/Bottom IR Pre Heat Production Solutions, Inc. . . . . . . . . . . . . . . . . . . . . 2150 RED-E-SET Ultra HD Q Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511 Fristch Pick and Place Equipment Qualectron Systems Corporation . . . . . . . . . . . . . . . . 2276 Focus5500DT 46

Qualitek International Inc. . . . . . . . . . . . . . . . . . . . . 1548 Qualitek PF608 No-Clean Paste Flux Qualitek Ceasolder-PAL Solder Mask Qualitek Expands Solder Check Up Program 2020 Water Soluble Wave Oil Quik-Tool, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 440 Quik-tool Automatic SMT Support Tooling R&D Technical Services Inc. . . . . . . . . . . . . . . . . . . 1276 V-Works 24 ScanCAD International, Inc. . . . . . . . . . . . . . . . . . . . 1447 ProWorks Work Instruction Software (WIS) Schleuniger, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . 527 JacketStrip 8310 UniStrip 2300 StripCrimp FSC SEHO North America, Inc. . . . . . . . . . . . . . . . . . . . . . 259 GoWave 1030 PowerRepair SEICA Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 973 IC Thermal Detection Unit Seika Machinery, Inc. . . . . . . . . . . . . . . . . . . . . . . . 407 Solder Paste Recycling Unit Taconic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 807 TSM-DS Dimensionally Stable Laminate Taiwan Union Technology Corporation . . . . . . . . . . . . . 1025 TU-872 LK TU-862 HF TU-84P NF TopLine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1825 Colored Tray Clips Transition Automation, Inc. . . . . . . . . . . . . . . . . . . . 1729 PrinTEK SMT Stencil Printer Unicomp North America LLC . . . . . . . . . . . . . . . . . . . 576 Unicomp Stencil Cleaner Unicomp X-Ray Series Valor Computerized Systems . . . . . . . . . . . . . . . . . . 2337 Valor MES Suite for PCB Assembly Vi TECHNOLOGY . . . . . . . . . . . . . . . . . . . . . . . . . . 1948 Selective 3D AOI XACT pcb Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 819 XPLAIN XJTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1564 XJTAG XTR series

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IPC APEX EXPO™

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Adhesives 3M Electronic Solution Division . . . . . 1465 AIM . . . . . . . . . . . . . . . . . . . . 1827 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Aqueous Technologies . . . . . . . . . . . 725 Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 ELANTAS PDG, Inc. . . . . . . . . . . . . 567 Electrolube . . . . . . . . . . . . . . . . 2459 ERSA North America . . . . . . . . . . . . 625 Henkel Corporation . . . . . . . . . . . . 2159 Heraeus . . . . . . . . . . . . . . . . . . 2143 Indium Corporation . . . . . . . . . . . . . 441 INVENTEC PERFORMANCE CHEMICALS . 465 Mid America Taping & Reel . . . . . . . . 541 PVA . . . . . . . . . . . . . . . . . . . . . 649 Smart Sonic Stencil Cleaning Systems . . 1771 Tapco Circuit Supply . . . . . . . . . . . . 435 United Resin Corporation . . . . . . . . . 1547 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Analytical/Laboratory Equipment & Supplies ECI Technology . . . . . . . . . . . . . . . 831 Equipment Technologies, Inc. . . . . . . . 741 Generon IGS . . . . . . . . . . . . . . . . 1646 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 Metrohm USA . . . . . . . . . . . . . . . 809 Microtek Labs . . . . . . . . . . . . . . . 1928 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 OEM Press Systems, Inc. . . . . . . . . . 920 QRP, Inc. . . . . . . . . . . . . . . . . . . 1165 Specialty Coating Systems . . . . . . . . 1635 Totech America Corporation . . . . . . . 2425 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635 ZESTRON America . . . . . . . . . . . . . 865 Artwork Generation/ Phototooling C. A. Picard Inc. . . . . . . . . . . . . . . 1248 Dow Electronic Materials . . . . . . . . . 419 Eastman Kodak Company . . . . . . . . . 1224 Exopack Advanced Coatings . . . . . . . . 337 Hitachi Via Mechanics (USA), Inc. . . . . 1237 NSWC Crane Division . . . . . . . . . . . 1129 ScanCAD International, Inc. . . . . . . . . 1447 48

Tapco Circuit Supply . . . . . . . . . . . . 435 Ucamco USA . . . . . . . . . . . . . . . . 902

Assembly Equipment: Feeding Systems-Bulk Assembléon America . . . . . . . . . . . 325 Brock Electronics . . . . . . . . . . . . . 2047 Chad Industries . . . . . . . . . . . . . . 1373 Conveyor Technologies Inc./CTI Systems . 265 Europlacer North America . . . . . . . . 2259 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 Schleuniger, Inc. . . . . . . . . . . . . . . 527 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 SMT Technologies . . . . . . . . . . . . . 2224 TopLine . . . . . . . . . . . . . . . . . . 1825 Universal Instruments Corporation . . . . 1083 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Assembly Equipment: Chip Placement AIR-VAC Engineering Co. . . . . . . . . . 2347 APS NOVASTAR . . . . . . . . . . . . . . 749 Aqueous Technologies . . . . . . . . . . . 725 Assembléon America . . . . . . . . . . . 325 Brock Electronics . . . . . . . . . . . . . 2047 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Chad Industries . . . . . . . . . . . . . . 1373 Count On Tools, Inc. . . . . . . . . . . . . 1870 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Europlacer North America . . . . . . . . 2259 Finetech . . . . . . . . . . . . . . . . . . 2228 Fuji America Corporation . . . . . . . . . 659 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 MYDATA automation Inc. . . . . . . . . . 2225 Ovation Products . . . . . . . . . . . . . 1173 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Pentagon EMS . . . . . . . . . . . . . . 1262

Production Solutions, Inc. . . . . . . . . . 2150 Q Corporation . . . . . . . . . . . . . . . 511 Qualectron Systems Corporation . . . . . 2276 Quik-Tool, LLC . . . . . . . . . . . . . . . 440 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 ScanCAD International, Inc. . . . . . . . . 1447 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 SMT Technologies . . . . . . . . . . . . . 2224 Sony Manufacturing Systems America, Inc. . . . . . . . . . . . . . . . 641 TopLine . . . . . . . . . . . . . . . . . . 1825 Tresky Corporation . . . . . . . . . . . . 1777 Universal Instruments Corporation . . . . 1083 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Assembly Equipment: Component Insertion Ascentec Engineering . . . . . . . . . . . 1636 Assembléon America . . . . . . . . . . . 325 Brock Electronics . . . . . . . . . . . . . 2047 Chad Industries . . . . . . . . . . . . . . 1373 Conveyor Technologies Inc./CTI Systems . 265 Count On Tools, Inc. . . . . . . . . . . . . 1870 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Finetech . . . . . . . . . . . . . . . . . . 2228 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 IBE SMT Equipment . . . . . . . . . . . . 664 Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 Ovation Products . . . . . . . . . . . . . 1173 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Pentagon EMS . . . . . . . . . . . . . . 1262 Production Solutions, Inc. . . . . . . . . . 2150 ScanCAD International, Inc. . . . . . . . . 1447

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Engineering Solutions for PCB Manufacturing SMT is focused on surface mount assembly of printed circuit boards, and covers feature articles, news, products,

ENGINEERING SOLUTIONS FOR PCB MANUFACTURING

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Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 SMT Technologies . . . . . . . . . . . . . 2224 TopLine . . . . . . . . . . . . . . . . . . 1825 Tresky Corporation . . . . . . . . . . . . 1777 Universal Instruments Corporation . . . . 1083 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Assembly Equipment: Flip-Chip Technology AIR-VAC Engineering Co. . . . . . . . . . 2347 APS NOVASTAR . . . . . . . . . . . . . . 749 Aqueous Technologies . . . . . . . . . . . 725 Assembléon America . . . . . . . . . . . 325 Brock Electronics . . . . . . . . . . . . . 2047 Assembly Equipment: Fine-Pitch ESSEMTEC . . . . . . . . . . . . . . . . 1259 Placement Finetech . . . . . . . . . . . . . . . . . . 2228 AIR-VAC Engineering Co. . . . . . . . . . 2347 Fuji America Corporation . . . . . . . . . 659 APS NOVASTAR . . . . . . . . . . . . . . 749 Heller Industries . . . . . . . . . . . . . . 1747 Aqueous Technologies . . . . . . . . . . . 725 Juki Automation Systems . . . . . . . . . 1735 Assembléon America . . . . . . . . . . . 325 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Brock Electronics . . . . . . . . . . . . . 2047 Manncorp . . . . . . . . . . . . . . . . . 2458 Caltex Scientific . . . . . . . . . . . . . . 1365 MYDATA automation Inc. . . . . . . . . . 2225 Chad Industries . . . . . . . . . . . . . . 1373 Nordson ASYMTEK . . . . . . . . . . . . 1925 Count On Tools, Inc. . . . . . . . . . . . . 1870 Ovation Products . . . . . . . . . . . . . 1173 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Panasonic Factory Solutions Company Europlacer North America . . . . . . . . 2259 of America . . . . . . . . . . . . . . . 1871 Finetech . . . . . . . . . . . . . . . . . . 2228 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 Fuji America Corporation . . . . . . . . . 659 ScanCAD International, Inc. . . . . . . . . 1447 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Smart Sonic Stencil Cleaning Systems . . 1771 Manncorp . . . . . . . . . . . . . . . . . 2458 TopLine . . . . . . . . . . . . . . . . . . 1825 Milara/Mirae . . . . . . . . . . . . . . . . 959 Tresky Corporation . . . . . . . . . . . . 1777 MYDATA automation Inc. . . . . . . . . . 2225 Universal Instruments Corporation . . . . 1083 Ovation Products . . . . . . . . . . . . . 1173 World Equipment Source Panasonic Factory Solutions Company (Owned by R-1 Source) . . . . . . . . . 619 of America . . . . . . . . . . . . . . . 1871 Assembly Equipment: Production Solutions, Inc. . . . . . . . . . 2150 Multifunctional Placement Q Corporation . . . . . . . . . . . . . . . 511 AIR-VAC Engineering Co. . . . . . . . . . 2347 Qualectron Systems Corporation . . . . . 2276 APS NOVASTAR . . . . . . . . . . . . . . 749 Quik-Tool, LLC . . . . . . . . . . . . . . . 440 Assembléon America . . . . . . . . . . . 325 Samsung Techwin Ltd./Dynatech Brock Electronics . . . . . . . . . . . . . 2047 Technology, Inc. . . . . . . . . . . . . . 1559 Chad Industries . . . . . . . . . . . . . . 1373 ScanCAD International, Inc. . . . . . . . . 1447 Count On Tools, Inc. . . . . . . . . . . . . 1870 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Smart Sonic Stencil Cleaning Systems . . 1771 Europlacer North America . . . . . . . . 2259 SMT Technologies . . . . . . . . . . . . . 2224 Finetech . . . . . . . . . . . . . . . . . . 2228 TopLine . . . . . . . . . . . . . . . . . . 1825 Fuji America Corporation . . . . . . . . . 659 Tresky Corporation . . . . . . . . . . . . 1777 IBE SMT Equipment . . . . . . . . . . . . 664 Universal Instruments Corporation . . . . 1083 Juki Automation Systems . . . . . . . . . 1735 V-TEK Incorporated . . . . . . . . . . . . 1539 Lewis & Clark, Inc. . . . . . . . . . . . . 1582

Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 MYDATA automation Inc. . . . . . . . . . 2225 Ovation Products . . . . . . . . . . . . . 1173 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Production Solutions, Inc. . . . . . . . . . 2150 Q Corporation . . . . . . . . . . . . . . . 511 Qualectron Systems Corporation . . . . . 2276 Quik-Tool, LLC . . . . . . . . . . . . . . . 440 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 ScanCAD International, Inc. . . . . . . . . 1447 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 SMT Technologies . . . . . . . . . . . . . 2224 TopLine . . . . . . . . . . . . . . . . . . 1825 Tresky Corporation . . . . . . . . . . . . 1777 Universal Instruments Corporation . . . . 1083 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Assembly Equipment: Odd Form AIR-VAC Engineering Co. . . . . . . . . . 2347 APS NOVASTAR . . . . . . . . . . . . . . 749 Assembléon America . . . . . . . . . . . 325 Brock Electronics . . . . . . . . . . . . . 2047 Cencorp . . . . . . . . . . . . . . . . . . 547 Chad Industries . . . . . . . . . . . . . . 1373 Conveyor Technologies Inc./CTI Systems . 265 Count On Tools, Inc. . . . . . . . . . . . . 1870 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Europlacer North America . . . . . . . . 2259 Fuji America Corporation . . . . . . . . . 659 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 Manncorp . . . . . . . . . . . . . . . . . 2458 Mid America Taping & Reel . . . . . . . . 541 Milara/Mirae . . . . . . . . . . . . . . . . 959 Ovation Products . . . . . . . . . . . . . 1173 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Production Solutions, Inc. . . . . . . . . . 2150 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 ScanCAD International, Inc. . . . . . . . . 1447

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Associations, Societies & Government Agencies EIPC . . . . . . . . . . . . . . . . . . . . 213 IPC Designers Council . . . . . . . . . . . 2073 IPC — Association Connecting Electronics Industries© . . . . . . . . . 2073 NSWC Crane Division . . . . . . . . . . . 1129 Ball Placement Systems & Equipment AIR-VAC Engineering Co. . . . . . . . . . 2347 DEK International . . . . . . . . . . . . . 1573 Europlacer North America . . . . . . . . 2259 HEPCO, Inc. . . . . . . . . . . . . . . . . 1546 IBE SMT Equipment . . . . . . . . . . . . 664 Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Photo Stencil . . . . . . . . . . . . . . . 1430 ScanCAD International, Inc. . . . . . . . . 1447 TopLine . . . . . . . . . . . . . . . . . . 1825 Barcode Printers & Readers AccuAssembly . . . . . . . . . . . . . . . 1449 ASYS Group Americas Inc. . . . . . . . . 2247 Brock Electronics . . . . . . . . . . . . . 2047 cab Technology, Inc. . . . . . . . . . . . . 1349 Cogiscan Inc. . . . . . . . . . . . . . . . 1828 Control Micro Systems, Inc. . . . . . . . . 1624 Conveyor Technologies Inc./CTI Systems . 265 FlexLink Systems, Inc. . . . . . . . . . . . 877 Microscan Systems, Inc. . . . . . . . . . 1826 Milara/Mirae . . . . . . . . . . . . . . . . 959 MYDATA automation Inc. . . . . . . . . . 2225 Omron Electronics . . . . . . . . . . . . . 1346 Universal Instruments Corporation . . . . 1083 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Board Handling Equipment (Conveyors & Depanelizers) Assembléon America . . . . . . . . . . . 325 ASYS Group Americas Inc. . . . . . . . . 2247 cab Technology, Inc. . . . . . . . . . . . . 1349 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Cencorp . . . . . . . . . . . . . . . . . . 547 Chad Industries . . . . . . . . . . . . . . 1373 Control Micro Systems, Inc. . . . . . . . . 1624 Conveyor Technologies Inc./CTI Systems . 265 Equipment Technologies, Inc. . . . . . . . 741 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Europlacer North America . . . . . . . . 2259 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 FlexLink Systems, Inc. . . . . . . . . . . . 877 Fuji America Corporation . . . . . . . . . 659 HEPCO, Inc. . . . . . . . . . . . . . . . . 1546 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Juki Automation Systems . . . . . . . . . 1735 Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 MYDATA automation Inc. . . . . . . . . . 2225 Nutek Americas Inc. . . . . . . . . . . . . 1865 Saki America . . . . . . . . . . . . . . . 2213 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 Seika Machinery, Inc. . . . . . . . . . . . 407 Simplimatic Automation . . . . . . . . . . 458 Totech America Corporation . . . . . . . 2425 Universal Instruments Corporation . . . . 1083 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Brushes Equipment Technologies, Inc. . . . . . . . 741 Gordon Brush Mfg. Co., Inc. . . . . . . . . 621 Tapco Circuit Supply . . . . . . . . . . . . 435 Cable & Wire Harness Chad Industries . . . . . . . . . . . . . . 1373 Computrol, Inc. . . . . . . . . . . . . . . . 626 Everett Charles Technologies . . . . . . . 1782 Mid America Taping & Reel . . . . . . . . 541 Nu-Way Electronics . . . . . . . . . . . . 630 Schleuniger, Inc. . . . . . . . . . . . . . . 527 Tapco Circuit Supply . . . . . . . . . . . . 435 V-TEK Incorporated . . . . . . . . . . . . 1539

World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Carts, Racks & Accessories cab Technology, Inc. . . . . . . . . . . . . 1349 CCI . . . . . . . . . . . . . . . . . . . . . 1359 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 IBE SMT Equipment . . . . . . . . . . . . 664 Inovaxe Corporation . . . . . . . . . . . . 658 Manncorp . . . . . . . . . . . . . . . . . 2458 Seika Machinery, Inc. . . . . . . . . . . . 407 Simplimatic Automation . . . . . . . . . . 458 Smart Splice LLC . . . . . . . . . . . . . 2275 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Chemical Processing Atotech USA, Inc. . . . . . . . . . . . . . 201 ELANTAS PDG, Inc. . . . . . . . . . . . . 567 Metrohm USA . . . . . . . . . . . . . . . 809 Petroferm Inc. . . . . . . . . . . . . . . . 1648 RBP Chemical Technology . . . . . . . . . 1040 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Cleaning Agents/Solvents 3M Electronic Solution Division . . . . . 1465 AIM . . . . . . . . . . . . . . . . . . . . 1827 Aqueous Technologies . . . . . . . . . . . 725 Atotech USA, Inc. . . . . . . . . . . . . . 201 Christopher Associates, Inc. . . . . . . . 1917 Cobar Solder Products Inc./Balver Zinn . . 1876 DEK International . . . . . . . . . . . . . 1573 Dow Electronic Materials . . . . . . . . . 419 Electrolube . . . . . . . . . . . . . . . . 2459 HumiSeal - Chase Specialty Coatings . . . 410 INVENTEC PERFORMANCE CHEMICALS . 465 Kyzen Corporation . . . . . . . . . . . . . 2241 Petroferm Inc. . . . . . . . . . . . . . . . 1648

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Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Qualitek International Inc. . . . . . . . . 1548 RBP Chemical Technology . . . . . . . . . 1040 Smart Sonic Stencil Cleaning Systems . . 1771 Tapco Circuit Supply . . . . . . . . . . . . 435 Uyemura International Corporation . . . . 1049 ZESTRON America . . . . . . . . . . . . . 865

Cleaning Equipment/Systems 3M Electronic Solution Division . . . . . 1465 Aqua Klean Systems . . . . . . . . . . . 1584 Aqueous Technologies . . . . . . . . . . . 725 Ascentech, LLC . . . . . . . . . . . . . . 2359 Atotech USA, Inc. . . . . . . . . . . . . . 201 Austin American Technology . . . . . . . 2242 CHEMCUT Corporation . . . . . . . . . . 1035 Christopher Associates, Inc. . . . . . . . 1917 Crystal Mark, Inc. . . . . . . . . . . . . . 1149 Equipment Technologies, Inc. . . . . . . . 741 HMS Hoellmuller Maschinenbau GmbH . 848 IBE SMT Equipment . . . . . . . . . . . . 664 Integrated Process Systems, Inc. . . . . . 735 Kyzen Corporation . . . . . . . . . . . . . 2241 Malcomtech International . . . . . . . . 1431 Manncorp . . . . . . . . . . . . . . . . . 2458 Petroferm Inc. . . . . . . . . . . . . . . . 1648 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 Qualectron Systems Corporation . . . . . 2276 Schmid Systems Inc. USA . . . . . . . . . 925 Seika Machinery, Inc. . . . . . . . . . . . 407 Smart Sonic Stencil Cleaning Systems . . 1771 Speedline Technologies, Inc. . . . . . . . 373 Stoelting LLC . . . . . . . . . . . . . . . 1258 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Technical Devices Company . . . . . . . . 2041 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 ZESTRON America . . . . . . . . . . . . . 865 Coating Equipment/Systems Ascentec Engineering . . . . . . . . . . . 1636 Bürkle North America, Inc. . . . . . . . . 1225 Equipment Technologies, Inc. . . . . . . . 741 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Fisnar Inc. . . . . . . . . . . . . . . . . . 1529 IBE SMT Equipment . . . . . . . . . . . . 664 Integrated Process Systems, Inc. . . . . . 735 54

ITC Intercircuit . . . . . . . . . . . . . . . 1137 Nordson ASYMTEK . . . . . . . . . . . . 1925 Para Tech Coating, Inc. . . . . . . . . . . 2127 Pentagon EMS . . . . . . . . . . . . . . 1262 PVA . . . . . . . . . . . . . . . . . . . . . 649 ScanCAD International, Inc. . . . . . . . . 1447 Specialty Coating Systems . . . . . . . . 1635 Tapco Circuit Supply . . . . . . . . . . . . 435 Unicote - Halco LLC . . . . . . . . . . . . 1128 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Coatings (Conformal, etc.) 3M Electronic Solution Division . . . . . 1465 Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 Crystal Mark, Inc. . . . . . . . . . . . . . 1149 ELANTAS PDG, Inc. . . . . . . . . . . . . 567 Electra Polymers Ltd. . . . . . . . . . . . . 906 Electrolube . . . . . . . . . . . . . . . . 2459 Exopack Advanced Coatings . . . . . . . . 337 Henkel Corporation . . . . . . . . . . . . 2159 HumiSeal - Chase Specialty Coatings . . . 410 INVENTEC PERFORMANCE CHEMICALS . 465 Para Tech Coating, Inc. . . . . . . . . . . 2127 PVA . . . . . . . . . . . . . . . . . . . . . 649 Rogers Corporation . . . . . . . . . . . . 1125 Specialty Coating Systems . . . . . . . . 1635 United Resin Corporation . . . . . . . . . 1547 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Component Packaging Products 3M Electronic Solution Division . . . . . 1465 AmeriVacS . . . . . . . . . . . . . . . . . 1530 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Electro-Comp Services, Inc. . . . . . . . . 351 Interconnect Systems, Inc. . . . . . . . . . 610 Mid America Taping & Reel . . . . . . . . 541 Nu-Way Electronics . . . . . . . . . . . . 630 Smart Splice LLC . . . . . . . . . . . . . 2275 TopLine . . . . . . . . . . . . . . . . . . 1825 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Component Preparation 3M Electronic Solution Division . . . . . 1465 ACE Production Technologies, Inc. . . . . . 464

APS NOVASTAR . . . . . . . . . . . . . . 749 Electro-Comp Services, Inc. . . . . . . . . 351 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 GPD Global . . . . . . . . . . . . . . . . 1459 HEPCO, Inc. . . . . . . . . . . . . . . . . 1546 Manncorp . . . . . . . . . . . . . . . . . 2458 Mid America Taping & Reel . . . . . . . . 541 Nu-Way Electronics . . . . . . . . . . . . 630 Pentagon EMS . . . . . . . . . . . . . . 1262 ScanCAD International, Inc. . . . . . . . . 1447 Smart Splice LLC . . . . . . . . . . . . . 2275 Totech America Corporation . . . . . . . 2425 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Components HIWIN Corporation . . . . . . . . . . . . . 930 Interconnect Systems, Inc. . . . . . . . . . 610 Nu-Way Electronics . . . . . . . . . . . . 630 Omni Training . . . . . . . . . . . . . . . 531 Omron Electronics . . . . . . . . . . . . . 1346 TopLine . . . . . . . . . . . . . . . . . . 1825 Totech America Corporation . . . . . . . 2425 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Connectors, Fasteners & Hardware 3M Electronic Solution Division . . . . . 1465 Electro-Comp Services, Inc. . . . . . . . . 351 Everett Charles Technologies . . . . . . . 1782 Ingun Pruefmittelbau GmbH . . . . . . . 2319 Interconnect Systems, Inc. . . . . . . . . . 610 QA Technology Company, Inc. . . . . . . . 2236 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Consulting Services Acculogic, Inc. . . . . . . . . . . . . . . . 249 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Assembléon America . . . . . . . . . . . 325 Blackfox Training Institute, LLC . . . . . . 1424 Custer Consulting Group . . . . . . . . . 1124 Equipment Technologies, Inc. . . . . . . . 741 Europlacer North America . . . . . . . . 2259 INVENTEC PERFORMANCE CHEMICALS . 465 JTAG Technologies . . . . . . . . . . . . 2325 Malcomtech International . . . . . . . . 1431

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Six ContinentS

one Magazine www.globalsmt.net

Volume 10 Number 2, February 2010 ISSN 1474 - 0893

The Global Assembly Journal for SMT and Advanced Packaging Professionals

Volume 10 Number 1, January 2010 ISSN 1474 - 0893

Global SMT & Packaging Southeast Asia Vol. 1 No. 1

The Global Assembly Journal for SMT and Advanced Packaging Professionals

www.globalsmt.net

SMT

Global Technology Awards

Southeast Asia

The Global Assembly Journal for SMT and Advanced Packaging Professionals

Volume 1 Number 1 Spring 2010

BGA ASSEMBLY RELIABILITY...PWB QUALITY IS THE KEY METALLIZATION OPTIONS FOR OPTIMUM CHIP-ON-BOARD ASSEMBLY

Fred Hume Interview Inside

2010 Company Milestones

Guidelines for establishinG a lead-free wave solderinG process for hiGh-reliability

Also Global SMT & Packaging’s 10th anniversary TRACK, TRACE & CONTROL: HIGH PRODUCTION OUTPUT AT LOW COSTS

Industry News

FAILURE DEFINITION—NOT AS EASY AS IT SOUNDS

2/9/10 10:14 AM

10.2-EU-temp.indd 1

2/9/10 10:14 AM

process challenGes and solutions for embeddinG chip-on-board into mainstream smt assembly

Mike Konrad Interview Inside NEW PRODUCTS INDUSTRY NEWS INTERNATIONAL DIARY

1/6/10 5:46 PM

10.1-EU-temp.indd 1

1/6/10 5:46 PM

TWISTED WIRE INTERCONNECT SYNERGY, THE OCCAM PROCESS AND

Interview Inside Bryan Gass

SOUNDS FAILURE DEFINITION—NOT AS EASY AS IT

International Diary New Products

0102 gnirpS

NEW PRODUCTS | INDUSTRY NEWS | INTERNATIONAL DIARY

10.1-EU-temp.indd 1

International Diary

Spring 2010

10.2-EU-temp.indd 1

New Products

Bryan Gass Interview Inside

SYNERGY, THE OCCAM PROCESS AND TWISTED WIRE INTERCONNECT

NEW PRODUCTS | INDUSTRY NEWS | INTERNATIONAL DIARY

investiGation and development of tin-lead and lead-free solder pastes to reduce headin-pillow defects

PRODUCTION OUTPUT AT LOW COSTS TRACK, TRACE & CONTROL: HIGH

smt assembly embeddinG chip-on-board into mainstream process challenGes and solutions for in-pillow defects and lead-free solder pastes to reduce headinvestiGation and development of tin-lead

Industry News

solderinG process for hiGh-reliability Guidelines for establishinG a lead-free wave

Also Global SMT & Packaging’s 10th anniversary

2010 Company Milestones

INTERNATIONAL DIARY INDUSTRY NEWS NEW PRODUCTS

Interview Inside Mike Konrad

Interview Inside Fred Hume

CHIP-ON-BOARD ASSEMBLY METALLIZATION OPTIONS FOR OPTIMUM IS THE KEY BGA ASSEMBLY RELIABILITY...PWB QUALITY

Global Technology Awards ISSN 1474 - 0893 Volume 10 Number 2, February 2010

Advanced Packaging Professionals The Global Assembly Journal for SMT and

ISSN 1474 - 0893 Volume 10 Number 1, January 2010

SMT

Advanced Packaging Professionals The Global Assembly Journal for SMT and

Volume 1 Number 1 Spring 2010

www.globalsmt.net 1 .oN 1 .loV aisA tsaehtuoS gnigakcaP & TMS labol

Advanced Packaging Professionals The Global Assembly Journal for SMT and

Southeast Asia

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Nutek Americas Inc. . . . . . . . . . . . . 1865 Omni Training . . . . . . . . . . . . . . . 531 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 PCQR2 â&#x20AC;&#x201D; A Partnership between CAT, Inc. & IPC . . . . . . . . . . . . . . . . 1231 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 Unicote - Halco LLC . . . . . . . . . . . . 1128 YXLON International Inc. . . . . . . . . . . 635

Curing Equipment & Systems APS NOVASTAR . . . . . . . . . . . . . . 749 BTU International . . . . . . . . . . . . . 871 Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 Equipment Technologies, Inc. . . . . . . . 741 ERSA North America . . . . . . . . . . . . 625 Heller Industries . . . . . . . . . . . . . . 1747 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Manncorp . . . . . . . . . . . . . . . . . 2458 Nordson ASYMTEK . . . . . . . . . . . . 1925 PVA . . . . . . . . . . . . . . . . . . . . . 649 Rehm Thermal Systems . . . . . . . . . . 1959 SMT Technologies . . . . . . . . . . . . . 2224 Specialty Coating Systems . . . . . . . . 1635 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Design Entry Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Design Services: PCB Libraries and Models Acculogic, Inc. . . . . . . . . . . . . . . . 249 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 NBS . . . . . . . . . . . . . . . . . . . . 2141 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Design Services: PCB Tools Acculogic, Inc. . . . . . . . . . . . . . . . 249 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 JTAG Technologies . . . . . . . . . . . . 2325 NBS . . . . . . . . . . . . . . . . . . . . 2141 ScanCAD International, Inc. . . . . . . . . 1447

World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XACT pcb Ltd. . . . . . . . . . . . . . . . 819

Design Services: Systems Interconnect Systems, Inc. . . . . . . . . . 610 JTAG Technologies . . . . . . . . . . . . 2325 Microtek Labs . . . . . . . . . . . . . . . 1928 NSWC Crane Division . . . . . . . . . . . 1129 Pentagon EMS . . . . . . . . . . . . . . 1262 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 ScanCAD International, Inc. . . . . . . . . 1447 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XACT pcb Ltd. . . . . . . . . . . . . . . . 819 Dicing Equipment Control Micro Systems, Inc. . . . . . . . . 1624 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Die Bonding Equipment AIR-VAC Engineering Co. . . . . . . . . . 2347 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Dage Precision Industries, Inc. . . . . . . 1625 Finetech . . . . . . . . . . . . . . . . . . 2228 GPD Global . . . . . . . . . . . . . . . . 1459 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 PVA . . . . . . . . . . . . . . . . . . . . . 649 TopLine . . . . . . . . . . . . . . . . . . 1825 Tresky Corporation . . . . . . . . . . . . 1777 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Dispensing Equipment AIR-VAC Engineering Co. . . . . . . . . . 2347 APS NOVASTAR . . . . . . . . . . . . . . 749 Chad Industries . . . . . . . . . . . . . . 1373 EFD, Inc. A Nordson Company . . . . . . 1641 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Finetech . . . . . . . . . . . . . . . . . . 2228 Fisnar Inc. . . . . . . . . . . . . . . . . . 1529 Fuji America Corporation . . . . . . . . . 659 GPD Global . . . . . . . . . . . . . . . . 1459 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 Manncorp . . . . . . . . . . . . . . . . . 2458

Martin GmbH . . . . . . . . . . . . . . . . 638 Metrohm USA . . . . . . . . . . . . . . . 809 MYDATA automation Inc. . . . . . . . . . 2225 Nordson ASYMTEK . . . . . . . . . . . . 1925 Nordson EFD . . . . . . . . . . . . . . . 1641 OK International . . . . . . . . . . . . . . 1482 Production Solutions, Inc. . . . . . . . . . 2150 PVA . . . . . . . . . . . . . . . . . . . . . 649 Quik-Tool, LLC . . . . . . . . . . . . . . . 440 RBP Chemical Technology . . . . . . . . . 1040 ScanCAD International, Inc. . . . . . . . . 1447 Specialty Coating Systems . . . . . . . . 1635 Speedline Technologies, Inc. . . . . . . . 373 Tresky Corporation . . . . . . . . . . . . 1777 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Distributor/Manufacturers Representative Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Bare Board Group, Inc. . . . . . . . . . . . 834 Brock Electronics . . . . . . . . . . . . . 2047 Christopher Associates, Inc. . . . . . . . 1917 Count On Tools, Inc. . . . . . . . . . . . . 1870 Hitachi Via Mechanics (USA), Inc. . . . . 1237 Malcomtech International . . . . . . . . 1431 Mid America Taping & Reel . . . . . . . . 541 Milara/Mirae . . . . . . . . . . . . . . . . 959 Nu-Way Electronics . . . . . . . . . . . . 630 RBP Chemical Technology . . . . . . . . . 1040 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 Seika Machinery, Inc. . . . . . . . . . . . 407 Smart Splice LLC . . . . . . . . . . . . . 2275 Tapco Circuit Supply . . . . . . . . . . . . 435 V-TEK Incorporated . . . . . . . . . . . . 1539

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. IPC First Annual Silent Auctions

. . . . . . . Booth 901

Tuesday, April 6 and Wednesday, April 7

To benefit the IPC Foundation — Investing in the future of the industry Thanks to generous donations, the IPC Foundation sponsors an “all academic poster competition” at IPC APEX EXPO to foster better cooperation between industry and academia in the critical areas of electronic interconnection technology. Universities around the world are invited to submit their research for consideration in this competition. In addition, scholarships to IPC’s trade shows have been made available to individuals who are experiencing financial hardship.

Please join IPC in supporting educational excellence, by participating in its first annual silent auctions. Two separate auctions will be held: one on Tuesday and one on Wednesday.

Photograph Hand Signed and Inscribed “The Force is Strong with You” by David Prowse (Darth Vader)

Rat Pack Memorabilia Shadowbox

Batman Dark Knight Collage

San Fran 49ers Super Bowl Years Multi-Signature Helmets

Hollywood Legends Collage The Beatles 1964 Photograph

Bids may be made during Exhibit Hall hours each day. Winners of the auction items will be announced at 6:00 pm each evening. Auction items will include a variety of sports and entertainment memorabilia, trips and experiences — how about a day in the air as the pilot of a fighter jet? Stop by booth 901 to check out the special gifts that you could take home. Visa, MasterCard, American Express and cash will be accepted. Your purchase is tax deductible to the fullest extent of the law. IPC APEX EXPO™

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Drilling & Routing Equipment & Supplies Bürkle North America, Inc. . . . . . . . . 1225 Equipment Technologies, Inc. . . . . . . . 741 FASTechnologies, Corp. . . . . . . . . . . 1242 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 Hitachi Via Mechanics (USA), Inc. . . . . 1237 Micron Laser Technology . . . . . . . . . 1029 Pentagon EMS . . . . . . . . . . . . . . 1262 Posalux SA . . . . . . . . . . . . . . . . . 317 PVA . . . . . . . . . . . . . . . . . . . . . 649 Quality Tech Tool . . . . . . . . . . . . . . 813 Saki America . . . . . . . . . . . . . . . 2213 ScanCAD International, Inc. . . . . . . . . 1447 Seika Machinery, Inc. . . . . . . . . . . . 407 Tapco Circuit Supply . . . . . . . . . . . . 435 Dryers/Drying Systems AccuAssembly . . . . . . . . . . . . . . . 1449 APS NOVASTAR . . . . . . . . . . . . . . 749 Aqueous Technologies . . . . . . . . . . . 725 BTU International . . . . . . . . . . . . . 871 CHEMCUT Corporation . . . . . . . . . . 1035 Equipment Technologies, Inc. . . . . . . . 741 HMS Hoellmuller Maschinenbau GmbH . 848 Integrated Process Systems, Inc. . . . . . 735 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Manncorp . . . . . . . . . . . . . . . . . 2458 Metrohm USA . . . . . . . . . . . . . . . 809 PVA . . . . . . . . . . . . . . . . . . . . . 649 Rehm Thermal Systems . . . . . . . . . . 1959 Seika Machinery, Inc. . . . . . . . . . . . 407 Smart Sonic Stencil Cleaning Systems . . 1771 Stoelting LLC . . . . . . . . . . . . . . . 1258 Totech America Corporation . . . . . . . 2425 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Electronics Manufacturing Services (EMS)/Contract Manufacturer Apollo Seiko Ltd. . . . . . . . . . . . . . 1159 Computrol, Inc. . . . . . . . . . . . . . . . 626 Count On Tools, Inc. . . . . . . . . . . . . 1870 Diversified Systems, Inc. . . . . . . . . . 1535 Micron Laser Technology . . . . . . . . . 1029 NBS . . . . . . . . . . . . . . . . . . . . 2141

PCB Planet (India) Ltd. . . . . . . . . . . . 2226 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Embedded Technologies DuPont Electronic Technologies . . . . . . 616 Microscan Systems, Inc. . . . . . . . . . 1826 Oak Mitsui Inc. . . . . . . . . . . . . . . . 924 Ticer Technologies . . . . . . . . . . . . . 1151 Encapsulation Equipment 3M Electronic Solution Division . . . . . 1465 GPD Global . . . . . . . . . . . . . . . . 1459 Heller Industries . . . . . . . . . . . . . . 1747 Nordson ASYMTEK . . . . . . . . . . . . 1925 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 PVA . . . . . . . . . . . . . . . . . . . . . 649 Enclosures Front Panel Express LLC . . . . . . . . . . 2435 Environmental & Waste Treatment/Management Aqueous Technologies . . . . . . . . . . . 725 CHEMCUT Corporation . . . . . . . . . . 1035 Dow Electronic Materials . . . . . . . . . 419 Equipment Technologies, Inc. . . . . . . . 741 Metrohm USA . . . . . . . . . . . . . . . 809 Phibro-Tech, Inc. . . . . . . . . . . . . . . 1031 RBP Chemical Technology . . . . . . . . . 1040 Totech America Corporation . . . . . . . 2425 EOS/ESD Handling Products & Services 3M Electronic Solution Division . . . . . 1465 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Crystal Mark, Inc. . . . . . . . . . . . . . 1149 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 Mid America Taping & Reel . . . . . . . . 541 Omni Training . . . . . . . . . . . . . . . 531 QRP, Inc. . . . . . . . . . . . . . . . . . . 1165 Seika Machinery, Inc. . . . . . . . . . . . 407 V-TEK Incorporated . . . . . . . . . . . . 1539 Equipment Lease/Refurbish/& Resale Agilent Technologies . . . . . . . . . . . 1473 ASC International . . . . . . . . . . . . . 1634 Assembléon America . . . . . . . . . . . 325 Atotech USA, Inc. . . . . . . . . . . . . . 201 Equipment Technologies, Inc. . . . . . . . 741

ESSEMTEC . . . . . . . . . . . . . . . . 1259 Europlacer North America . . . . . . . . 2259 IBE SMT Equipment . . . . . . . . . . . . 664 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Manncorp . . . . . . . . . . . . . . . . . 2458 MYDATA automation Inc. . . . . . . . . . 2225 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 SMT Technologies . . . . . . . . . . . . . 2224 Totech America Corporation . . . . . . . 2425 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635

Fans & Blowers Equipment Technologies, Inc. . . . . . . . 741 FlexLink Systems, Inc. . . . . . . . . . . . 877 Nu-Way Electronics . . . . . . . . . . . . 630 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Flexible Circuits Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Bare Board Group, Inc. . . . . . . . . . . . 834 DMI International . . . . . . . . . . . . . 1175 DuPont Electronic Technologies . . . . . . 616 Interconnect Systems, Inc. . . . . . . . . . 610 Micron Laser Technology . . . . . . . . . 1029 Microtek Labs . . . . . . . . . . . . . . . 1928 Para Tech Coating, Inc. . . . . . . . . . . 2127 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 Tapco Circuit Supply . . . . . . . . . . . . 435 Totech America Corporation . . . . . . . 2425 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Flip Chip Bonding Equipment AIR-VAC Engineering Co. . . . . . . . . . 2347 Finetech . . . . . . . . . . . . . . . . . . 2228 Nordson ASYMTEK . . . . . . . . . . . . 1925 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 PVA . . . . . . . . . . . . . . . . . . . . . 649 Tresky Corporation . . . . . . . . . . . . 1777 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Flux AIM . . . . . . . . . . . . . . . . . . . . 1827 Christopher Associates, Inc. . . . . . . . 1917 Cobar Solder Products Inc./Balver Zinn . . 1876 EFD, Inc. A Nordson Company . . . . . . 1641 ERSA North America . . . . . . . . . . . . 625 Henkel Corporation . . . . . . . . . . . . 2159 Heraeus . . . . . . . . . . . . . . . . . . 2143 Indium Corporation . . . . . . . . . . . . . 441 INVENTEC PERFORMANCE CHEMICALS . 465 Nihon Superior Co., Ltd. . . . . . . . . . . 1426 Nordson EFD . . . . . . . . . . . . . . . 1641 P. Kay Metal, Inc. . . . . . . . . . . . . . 2449 Qualitek International Inc. . . . . . . . . 1548 RBP Chemical Technology . . . . . . . . . 1040 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Foils & Laminates Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Arlon Materials For Electronics . . . . . . 1329 DuPont Electronic Technologies . . . . . . 616 Exopack Advanced Coatings . . . . . . . . 337 Isola Group . . . . . . . . . . . . . . . . . 847 Oak Mitsui Inc. . . . . . . . . . . . . . . . 924 Ohmega Technologies Inc. . . . . . . . . . 825 Rogers Corporation . . . . . . . . . . . . 1125 Taiwan Union Technology Corporation . . 1025 Tapco Circuit Supply . . . . . . . . . . . . 435 Ticer Technologies . . . . . . . . . . . . . 1151 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Fume Extraction Systems AIR-VAC Engineering Co. . . . . . . . . . 2347 Apollo Seiko Ltd. . . . . . . . . . . . . . 1159 Equipment Technologies, Inc. . . . . . . . 741 ERSA North America . . . . . . . . . . . . 625 IP Systems LLC . . . . . . . . . . . . . . 1859 Metrohm USA . . . . . . . . . . . . . . . 809 OK International . . . . . . . . . . . . . . 1482 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Gas: Analyzers Heller Industries . . . . . . . . . . . . . . 1747 Gas: Atmosphere Systems AmeriVacS . . . . . . . . . . . . . . . . . 1530 Generon IGS . . . . . . . . . . . . . . . . 1646 IPC APEX EXPO™

Heller Industries . . . . . . . . . . . . . . 1747 Manncorp . . . . . . . . . . . . . . . . . 2458

Hand Tools AIR-VAC Engineering Co. . . . . . . . . . 2347 Ascentec Engineering . . . . . . . . . . . 1636 Count On Tools, Inc. . . . . . . . . . . . . 1870 EFD, Inc. A Nordson Company . . . . . . 1641 ERSA North America . . . . . . . . . . . . 625 FocalSpot, Inc. . . . . . . . . . . . . . . . 2035 Gordon Brush Mfg. Co., Inc. . . . . . . . . 621 Omni Training . . . . . . . . . . . . . . . 531 Schleuniger, Inc. . . . . . . . . . . . . . . 527 Smart Splice LLC . . . . . . . . . . . . . 2275 TopLine . . . . . . . . . . . . . . . . . . 1825 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Ink/Thick Films & Equipment Apexyl Enterprises Ltd. . . . . . . . . . . 1330 ASC International . . . . . . . . . . . . . 1634 DuPont Electronic Technologies . . . . . . 616 Electra Polymers Ltd. . . . . . . . . . . . . 906 Equipment Technologies, Inc. . . . . . . . 741 Heraeus . . . . . . . . . . . . . . . . . . 2143 Integrated Process Systems, Inc. . . . . . 735 MicroCraft . . . . . . . . . . . . . . . . . 301 ScanCAD International, Inc. . . . . . . . . 1447 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Labeling Systems 3M Electronic Solution Division . . . . . 1465 ASYS Group Americas Inc. . . . . . . . . 2247 cab Technology, Inc. . . . . . . . . . . . . 1349 Cogiscan Inc. . . . . . . . . . . . . . . . 1828 Control Micro Systems, Inc. . . . . . . . . 1624 Conveyor Technologies Inc./CTI Systems . 265 FlexLink Systems, Inc. . . . . . . . . . . . 877 Nutek Americas Inc. . . . . . . . . . . . . 1865 Schleuniger, Inc. . . . . . . . . . . . . . . 527 Simplimatic Automation . . . . . . . . . . 458 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Lamination Equipment & Services Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Bürkle North America, Inc. . . . . . . . . 1225

C. A. Picard Inc. . . . . . . . . . . . . . . 1248 Christopher Associates, Inc. . . . . . . . 1917 DIS Inc. . . . . . . . . . . . . . . . . . . 1228 Equipment Technologies, Inc. . . . . . . . 741 OEM Press Systems, Inc. . . . . . . . . . 920 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Laser Systems Agilent Technologies . . . . . . . . . . . 1473 Apollo Seiko Ltd. . . . . . . . . . . . . . 1159 ASC International . . . . . . . . . . . . . 1634 ASYS Group Americas Inc. . . . . . . . . 2247 cab Technology, Inc. . . . . . . . . . . . . 1349 Control Micro Systems, Inc. . . . . . . . . 1624 Conveyor Technologies Inc./CTI Systems . 265 Equipment Technologies, Inc. . . . . . . . 741 FlexLink Systems, Inc. . . . . . . . . . . . 877 Hitachi Via Mechanics (USA), Inc. . . . . 1237 Integrated Ideas & Technologies, Inc. . . . 448 M.E.T. (Metal Etching Technology) . . . . 1725 Malcomtech International . . . . . . . . 1431 Micron Laser Technology . . . . . . . . . 1029 Nutek Americas Inc. . . . . . . . . . . . . 1865 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Simplimatic Automation . . . . . . . . . . 458 Sony Manufacturing Systems America, Inc. . . . . . . . . . . . . . . . 641 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Lighting Brock Electronics . . . . . . . . . . . . . 2047 Microscan Systems, Inc. . . . . . . . . . 1826 Scienscope International . . . . . . . . . 1460 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Marking Tools & Systems ASYS Group Americas Inc. . . . . . . . . 2247 cab Technology, Inc. . . . . . . . . . . . . 1349 Cencorp . . . . . . . . . . . . . . . . . . 547 Control Micro Systems, Inc. . . . . . . . . 1624 Crystal Mark, Inc. . . . . . . . . . . . . . 1149 EFD, Inc. A Nordson Company . . . . . . 1641 FlexLink Systems, Inc. . . . . . . . . . . . 877 Nordson EFD . . . . . . . . . . . . . . . 1641 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Schleuniger, Inc. . . . . . . . . . . . . . . 527 Simplimatic Automation . . . . . . . . . . 458 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Masking & Demasking Systems Ascentec Engineering . . . . . . . . . . . 1636 Crystal Mark, Inc. . . . . . . . . . . . . . 1149 Electrolube . . . . . . . . . . . . . . . . 2459 Fisnar Inc. . . . . . . . . . . . . . . . . . 1529 Pentagon EMS . . . . . . . . . . . . . . 1262 Masks & Screens for Soldering/ Printing DEK International . . . . . . . . . . . . . 1573 Electra Polymers Ltd. . . . . . . . . . . . . 906 I Source Technical Services, Inc. . . . . . 1525 Integrated Ideas & Technologies, Inc. . . . 448 M.E.T. (Metal Etching Technology) . . . . 1725 Micron Laser Technology . . . . . . . . . 1029 MicroScreen LLC . . . . . . . . . . . . . . 743 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Pentagon EMS . . . . . . . . . . . . . . 1262 Qualitek International Inc. . . . . . . . . 1548 ScanCAD International, Inc. . . . . . . . . 1447 Material Handling Equipment/ Automation Systems AccuAssembly . . . . . . . . . . . . . . . 1449 AmeriVacS . . . . . . . . . . . . . . . . . 1530 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Ascentec Engineering . . . . . . . . . . . 1636 Assembléon America . . . . . . . . . . . 325 Atotech USA, Inc. . . . . . . . . . . . . . 201 Brock Electronics . . . . . . . . . . . . . 2047 Bürkle North America, Inc. . . . . . . . . 1225 CHEMCUT Corporation . . . . . . . . . . 1035

Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 DIS Inc. . . . . . . . . . . . . . . . . . . 1228 Electro-Comp Services, Inc. . . . . . . . . 351 Equipment Technologies, Inc. . . . . . . . 741 Europlacer North America . . . . . . . . 2259 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 Inovaxe Corporation . . . . . . . . . . . . 658 Integrated Process Systems, Inc. . . . . . 735 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Manncorp . . . . . . . . . . . . . . . . . 2458 OEM Press Systems, Inc. . . . . . . . . . 920 Schleuniger, Inc. . . . . . . . . . . . . . . 527 Schmid Systems Inc. USA . . . . . . . . . 925 Seika Machinery, Inc. . . . . . . . . . . . 407 Simplimatic Automation . . . . . . . . . . 458 Technic Inc. . . . . . . . . . . . . . . . . . 943 Totech America Corporation . . . . . . . 2425 Universal Instruments Corporation . . . . 1083 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Materials: Chip Packaging CCI . . . . . . . . . . . . . . . . . . . . . 1359 DuPont Electronic Technologies . . . . . . 616 Electra Polymers Ltd. . . . . . . . . . . . . 906 Electro-Comp Services, Inc. . . . . . . . . 351 Heraeus . . . . . . . . . . . . . . . . . . 2143 Mid America Taping & Reel . . . . . . . . 541 Rogers Corporation . . . . . . . . . . . . 1125 Ticer Technologies . . . . . . . . . . . . . 1151 TopLine . . . . . . . . . . . . . . . . . . 1825 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Materials: Other 3M Electronic Solution Division . . . . . 1465 Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Ascentec Engineering . . . . . . . . . . . 1636 Dow Electronic Materials . . . . . . . . . 419 DuPont Electronic Technologies . . . . . . 616 Electro-Comp Services, Inc. . . . . . . . . 351 Electrolube . . . . . . . . . . . . . . . . 2459 ERSA North America . . . . . . . . . . . . 625 Heraeus . . . . . . . . . . . . . . . . . . 2143 Indium Corporation . . . . . . . . . . . . . 441

Mid America Taping & Reel . . . . . . . . 541 Omni Training . . . . . . . . . . . . . . . 531 Pentagon EMS . . . . . . . . . . . . . . 1262 Rogers Corporation . . . . . . . . . . . . 1125 Senju Comtek . . . . . . . . . . . . . . . 673 United Resin Corporation . . . . . . . . . 1547 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Media/Industry Publications Custer Consulting Group . . . . . . . . . 1124 I-Connect007 . . . . . . . . . . . . . . . . . . IPC — Association Connecting Electronics Industries© . . . . . . . . . 2073 Real-Time With...IPC . . . . . . . . . . . 1621 Microvias/Embedded Components Dow Electronic Materials . . . . . . . . . 419 Micron Laser Technology . . . . . . . . . 1029 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 Motion Control/Automation Caltex Scientific . . . . . . . . . . . . . . 1365 Chad Industries . . . . . . . . . . . . . . 1373 Europlacer North America . . . . . . . . 2259 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 HIWIN Corporation . . . . . . . . . . . . . 930 Omron Electronics . . . . . . . . . . . . . 1346 Package-on-Package Assembléon America . . . . . . . . . . . 325 Nordson ASYMTEK . . . . . . . . . . . . 1925 TopLine . . . . . . . . . . . . . . . . . . 1825 Packing & Storage 3M Electronic Solution Division . . . . . 1465 AccuAssembly . . . . . . . . . . . . . . . 1449 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Equipment Technologies, Inc. . . . . . . . 741 Front Panel Express LLC . . . . . . . . . . 2435 Mid America Taping & Reel . . . . . . . . 541 Totech America Corporation . . . . . . . 2425 V-TEK Incorporated . . . . . . . . . . . . 1539 Pallets & Carriers Aqueous Technologies . . . . . . . . . . . 725 Ascentec Engineering . . . . . . . . . . . 1636 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Conveyor Technologies Inc./CTI Systems . 265

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DISCOVER. CONNECT. THRIVE. DEK International . . . . . . . . . . . . . 1573 DMI International . . . . . . . . . . . . . 1175 Front Panel Express LLC . . . . . . . . . . 2435 I Source Technical Services, Inc. . . . . . 1525 InsulFab PCB Tooling . . . . . . . . . . . 1861 Integrated Ideas & Technologies, Inc. . . . 448 Ovation Products . . . . . . . . . . . . . 1173 Pentagon EMS . . . . . . . . . . . . . . 1262 Simplimatic Automation . . . . . . . . . . 458 Smart Sonic Stencil Cleaning Systems . . 1771 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Photoimaging Equipment Bürkle North America, Inc. . . . . . . . . 1225 Caltex Scientific . . . . . . . . . . . . . . 1365 Dow Electronic Materials . . . . . . . . . 419 Equipment Technologies, Inc. . . . . . . . 741 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 Integrated Process Systems, Inc. . . . . . 735 ScanCAD International, Inc. . . . . . . . . 1447 Schmid Systems Inc. USA . . . . . . . . . 925 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Ucamco USA . . . . . . . . . . . . . . . . 902 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Photoresist Materials & Phototooling Dow Electronic Materials . . . . . . . . . 419 DuPont Electronic Technologies . . . . . . 616 Eastman Kodak Company . . . . . . . . . 1224 Electra Polymers Ltd. . . . . . . . . . . . . 906 Electrolube . . . . . . . . . . . . . . . . 2459 Exopack Advanced Coatings . . . . . . . . 337 National Graphic Supply . . . . . . . . . . 537 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Photovoltaics/Solar BTU International . . . . . . . . . . . . . 871 Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 DEK International . . . . . . . . . . . . . 1573 Dow Electronic Materials . . . . . . . . . 419 IPC APEX EXPO™

DuPont Electronic Technologies . . . . . . 616 Electra Polymers Ltd. . . . . . . . . . . . . 906 MacDermid Inc. . . . . . . . . . . . . . . 810 Metrohm USA . . . . . . . . . . . . . . . 809 Nordson ASYMTEK . . . . . . . . . . . . 1925 ScanCAD International, Inc. . . . . . . . . 1447 Schmid Systems Inc. USA . . . . . . . . . 925 TUV Rheinland of North America . . . . . 674 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Plating/Wet Process: Equipment Atotech USA, Inc. . . . . . . . . . . . . . 201 CHEMCUT Corporation . . . . . . . . . . 1035 Dow Electronic Materials . . . . . . . . . 419 Dynatronix, Inc. . . . . . . . . . . . . . . 1878 ECI Technology . . . . . . . . . . . . . . . 831 Equipment Technologies, Inc. . . . . . . . 741 HMS Hoellmuller Maschinenbau GmbH . 848 Integrated Process Systems, Inc. . . . . . 735 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Schmid Systems Inc. USA . . . . . . . . . 925 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Unicote - Halco LLC . . . . . . . . . . . . 1128 Uyemura International Corporation . . . . 1049 Wise srl . . . . . . . . . . . . . . . . . . 949 Plating/Wet Process: Supplies Atotech USA, Inc. . . . . . . . . . . . . . 201 Dow Electronic Materials . . . . . . . . . 419 ECI Technology . . . . . . . . . . . . . . . 831 Equipment Technologies, Inc. . . . . . . . 741 Integrated Process Systems, Inc. . . . . . 735 Phibro-Tech, Inc. . . . . . . . . . . . . . . 1031 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Uyemura International Corporation . . . . 1049 Printed Circuit Board (PCB) Manufacturer Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Bare Board Group, Inc. . . . . . . . . . . . 834 Calumet Electronics . . . . . . . . . . . . 1126 Diversified Systems, Inc. . . . . . . . . . 1535 Micron Laser Technology . . . . . . . . . 1029 NSWC Crane Division . . . . . . . . . . . 1129

Omni Training . . . . . . . . . . . . . . . 531 Para Tech Coating, Inc. . . . . . . . . . . 2127 Prototron Circuits . . . . . . . . . . . . . 935 Saturn Electronics Corporation . . . . . . 1628 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Printed Electronics Taiyo America, Inc. . . . . . . . . . . . . 1041 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Prototyping Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Bare Board Group, Inc. . . . . . . . . . . . 834 Calumet Electronics . . . . . . . . . . . . 1126 Count On Tools, Inc. . . . . . . . . . . . . 1870 Digitaltest Inc. . . . . . . . . . . . . . . . 459 Diversified Systems, Inc. . . . . . . . . . 1535 EFD, Inc. A Nordson Company . . . . . . 1641 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Finetech . . . . . . . . . . . . . . . . . . 2228 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 Integrated Ideas & Technologies, Inc. . . . 448 Manncorp . . . . . . . . . . . . . . . . . 2458 Micron Laser Technology . . . . . . . . . 1029 Mid America Taping & Reel . . . . . . . . 541 NBS . . . . . . . . . . . . . . . . . . . . 2141 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Prototron Circuits . . . . . . . . . . . . . 935 Texmac/Takaya Corporation . . . . . . . . 859 TopLine . . . . . . . . . . . . . . . . . . 1825 Tresky Corporation . . . . . . . . . . . . 1777 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 REACH/RoHS Compliance Services Blackfox Training Institute, LLC . . . . . . 1424 CCI . . . . . . . . . . . . . . . . . . . . . 1359 Electro-Comp Services, Inc. . . . . . . . . 351 INVENTEC PERFORMANCE CHEMICALS . 465 Mid America Taping & Reel . . . . . . . . 541 RMD Instruments Corp. . . . . . . . . . . 349 TUV Rheinland of North America . . . . . 674 Unicote - Halco LLC . . . . . . . . . . . . 1128 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Reclamation/Recovery Systems (Environmental) Aqua Klean Systems . . . . . . . . . . . 1584 Brock Electronics . . . . . . . . . . . . . 2047 National Graphic Supply . . . . . . . . . . 537 P. Kay Metal, Inc. . . . . . . . . . . . . . 2449 Stoelting LLC . . . . . . . . . . . . . . . 1258 Technic Inc. . . . . . . . . . . . . . . . . . 943 Uyemura International Corporation . . . . 1049 Reflow Soldering Equipment (Ovens) APS NOVASTAR . . . . . . . . . . . . . . 749 Brock Electronics . . . . . . . . . . . . . 2047 BTU International . . . . . . . . . . . . . 871 Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 ECD - Electronic Controls Design, Inc. . . 1361 ERSA North America . . . . . . . . . . . . 625 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Heller Industries . . . . . . . . . . . . . . 1747 IBE SMT Equipment . . . . . . . . . . . . 664 KIC . . . . . . . . . . . . . . . . . . . . . 1549 Malcomtech International . . . . . . . . 1431 Manncorp . . . . . . . . . . . . . . . . . 2458 Nordson ASYMTEK . . . . . . . . . . . . 1925 On Site Gas Systems, Inc. . . . . . . . . . 2137 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Q Corporation . . . . . . . . . . . . . . . 511 Qualitek International Inc. . . . . . . . . 1548 Rehm Thermal Systems . . . . . . . . . . 1959 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 SEHO North America, Inc. . . . . . . . . . 259 Seika Machinery, Inc. . . . . . . . . . . . 407 Senju Comtek . . . . . . . . . . . . . . . 673 SMT Technologies . . . . . . . . . . . . . 2224 Speedline Technologies, Inc. . . . . . . . 373 Technic Inc. . . . . . . . . . . . . . . . . . 943 Vi TECHNOLOGY . . . . . . . . . . . . . 1948 Vitronics Soltec . . . . . . . . . . . . . . 1073 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Repair & Rework ACE Production Technologies, Inc. . . . . . 464 AIR-VAC Engineering Co. . . . . . . . . . 2347 APS NOVASTAR . . . . . . . . . . . . . . 749 66

Ascentec Engineering . . . . . . . . . . . 1636 Caltex Scientific . . . . . . . . . . . . . . 1365 Christopher Associates, Inc. . . . . . . . 1917 Computrol, Inc. . . . . . . . . . . . . . . . 626 Conveyor Technologies Inc./CTI Systems . 265 Crystal Mark, Inc. . . . . . . . . . . . . . 1149 EFD, Inc. A Nordson Company . . . . . . 1641 Electro-Comp Services, Inc. . . . . . . . . 351 Electrolube . . . . . . . . . . . . . . . . 2459 ERSA North America . . . . . . . . . . . . 625 Finetech . . . . . . . . . . . . . . . . . . 2228 FocalSpot, Inc. . . . . . . . . . . . . . . . 2035 HEPCO, Inc. . . . . . . . . . . . . . . . . 1546 I Source Technical Services, Inc. . . . . . 1525 Interconnect Systems, Inc. . . . . . . . . . 610 M.E.T. (Metal Etching Technology) . . . . 1725 Manncorp . . . . . . . . . . . . . . . . . 2458 Martin GmbH . . . . . . . . . . . . . . . . 638 Micron Laser Technology . . . . . . . . . 1029 Nordson EFD . . . . . . . . . . . . . . . 1641 OK International . . . . . . . . . . . . . . 1482 Omni Training . . . . . . . . . . . . . . . 531 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Pentagon EMS . . . . . . . . . . . . . . 1262 Photo Stencil . . . . . . . . . . . . . . . 1430 Pillarhouse USA . . . . . . . . . . . . . . 2149 Q Corporation . . . . . . . . . . . . . . . 511 ScanCAD International, Inc. . . . . . . . . 1447 Simplimatic Automation . . . . . . . . . . 458 TopLine . . . . . . . . . . . . . . . . . . 1825 Totech America Corporation . . . . . . . 2425 Tresky Corporation . . . . . . . . . . . . 1777 Vision Engineering . . . . . . . . . . . . 1177 VJ Electronix . . . . . . . . . . . . . . . 2059 V-TEK Incorporated . . . . . . . . . . . . 1539 YXLON International Inc. . . . . . . . . . . 635

RFID Atotech USA, Inc. . . . . . . . . . . . . . 201 FlexLink Systems, Inc. . . . . . . . . . . . 877 Sheeting Equipment Equipment Technologies, Inc. . . . . . . . 741 Software: CAD/CAM/CIM AccuAssembly . . . . . . . . . . . . . . . 1449 Aegis Industrial Software Corporation . . 2025

Assembléon America . . . . . . . . . . . 325 Digitaltest Inc. . . . . . . . . . . . . . . . 459 FASTechnologies, Corp. . . . . . . . . . . 1242 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 Juki Automation Systems . . . . . . . . . 1735 Machine Vision Products, Inc. . . . . . . . 1647 MYDATA automation Inc. . . . . . . . . . 2225 NSWC Crane Division . . . . . . . . . . . 1129 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 ScanCAD International, Inc. . . . . . . . . 1447 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 Smart Sonic Stencil Cleaning Systems . . 1771 Tapco Circuit Supply . . . . . . . . . . . . 435 Ucamco USA . . . . . . . . . . . . . . . . 902

Software: Data Acquisition & Systems AccuAssembly . . . . . . . . . . . . . . . 1449 Aegis Industrial Software Corporation . . 2025 ASC International . . . . . . . . . . . . . 1634 Assembléon America . . . . . . . . . . . 325 Cogiscan Inc. . . . . . . . . . . . . . . . 1828 Datapaq, Inc. . . . . . . . . . . . . . . . 1640 ECD - Electronic Controls Design, Inc. . . 1361 FASTechnologies, Corp. . . . . . . . . . . 1242 Integrated Process Systems, Inc. . . . . . 735 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 KIC . . . . . . . . . . . . . . . . . . . . . 1549 Machine Vision Products, Inc. . . . . . . . 1647 Microscan Systems, Inc. . . . . . . . . . 1826 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 PCQR2 — A Partnership between CAT, Inc. & IPC . . . . . . . . . . . . . . . . 1231 ScanCAD International, Inc. . . . . . . . . 1447

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IPC APEX EXPO™

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 XACT pcb Ltd. . . . . . . . . . . . . . . . 819

Software: Electronic Design Automation (EDA) ScanCAD International, Inc. . . . . . . . . 1447 Software: MES AccuAssembly . . . . . . . . . . . . . . . 1449 Aegis Industrial Software Corporation . . 2025 Assembléon America . . . . . . . . . . . 325 Cogiscan Inc. . . . . . . . . . . . . . . . 1828 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 Machine Vision Products, Inc. . . . . . . . 1647 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 ScanCAD International, Inc. . . . . . . . . 1447 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 Software: Other AccuAssembly . . . . . . . . . . . . . . . 1449 Aegis Industrial Software Corporation . . 2025 FASTechnologies, Corp. . . . . . . . . . . 1242 Inovaxe Corporation . . . . . . . . . . . . 658 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 North Star Imaging, Inc. . . . . . . . . . . 1911 Scienscope International . . . . . . . . . 1460 Smart Sonic Stencil Cleaning Systems . . 1771 Ucamco USA . . . . . . . . . . . . . . . . 902 XACT pcb Ltd. . . . . . . . . . . . . . . . 819 Software: Process Control AccuAssembly . . . . . . . . . . . . . . . 1449 Aegis Industrial Software Corporation . . 2025 Agilent Technologies . . . . . . . . . . . 1473 ASC International . . . . . . . . . . . . . 1634 Cogiscan Inc. . . . . . . . . . . . . . . . 1828 Datapaq, Inc. . . . . . . . . . . . . . . . 1640 Digitaltest Inc. . . . . . . . . . . . . . . . 459 ECD - Electronic Controls Design, Inc. . . 1361 Europlacer North America . . . . . . . . 2259 Everett Charles Technologies . . . . . . . 1782 FASTechnologies, Corp. . . . . . . . . . . 1242 FlexLink Systems, Inc. . . . . . . . . . . . 877 Integrated Process Systems, Inc. . . . . . 735

Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 Juki Automation Systems . . . . . . . . . 1735 KIC . . . . . . . . . . . . . . . . . . . . . 1549 Machine Vision Products, Inc. . . . . . . . 1647 Malcomtech International . . . . . . . . 1431 MYDATA automation Inc. . . . . . . . . . 2225 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 ScanCAD International, Inc. . . . . . . . . 1447 Schleuniger, Inc. . . . . . . . . . . . . . . 527 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 Viscom Inc. . . . . . . . . . . . . . . . . 1273 XACT pcb Ltd. . . . . . . . . . . . . . . . 819

Software: Product Data Management (PDM) AccuAssembly . . . . . . . . . . . . . . . 1449 Aegis Industrial Software Corporation . . 2025 Agilent Technologies . . . . . . . . . . . 1473 Assembléon America . . . . . . . . . . . 325 Integrated Process Systems, Inc. . . . . . 735 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 Machine Vision Products, Inc. . . . . . . . 1647 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 XACT pcb Ltd. . . . . . . . . . . . . . . . 819 Software: Product Lifecycle Management (PLM) AccuAssembly . . . . . . . . . . . . . . . 1449 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 Solar/Photovoltaics BTU International . . . . . . . . . . . . . 871 Christopher Associates, Inc. . . . . . . . 1917 Conveyor Technologies Inc./CTI Systems . 265 DEK International . . . . . . . . . . . . . 1573 Dow Electronic Materials . . . . . . . . . 419 DuPont Electronic Technologies . . . . . . 616 Electra Polymers Ltd. . . . . . . . . . . . . 906 MacDermid Inc. . . . . . . . . . . . . . . 810 Metrohm USA . . . . . . . . . . . . . . . 809 Nordson ASYMTEK . . . . . . . . . . . . 1925 ScanCAD International, Inc. . . . . . . . . 1447

Schmid Systems Inc. USA . . . . . . . . . 925 TUV Rheinland of North America . . . . . 674 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Solder (Paste/Bar/Cream/ Powder) AIM . . . . . . . . . . . . . . . . . . . . 1827 Caltex Scientific . . . . . . . . . . . . . . 1365 Christopher Associates, Inc. . . . . . . . 1917 Cobar Solder Products Inc./Balver Zinn . . 1876 EFD, Inc. A Nordson Company . . . . . . 1641 ERSA North America . . . . . . . . . . . . 625 Henkel Corporation . . . . . . . . . . . . 2159 Heraeus . . . . . . . . . . . . . . . . . . 2143 Indium Corporation . . . . . . . . . . . . . 441 INVENTEC PERFORMANCE CHEMICALS . 465 Manncorp . . . . . . . . . . . . . . . . . 2458 Nihon Superior Co., Ltd. . . . . . . . . . . 1426 Nordson EFD . . . . . . . . . . . . . . . 1641 P. Kay Metal, Inc. . . . . . . . . . . . . . 2449 Qualitek International Inc. . . . . . . . . 1548 Seika Machinery, Inc. . . . . . . . . . . . 407 Senju Comtek . . . . . . . . . . . . . . . 673 Transition Automation, Inc. . . . . . . . . 1729 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Solder Resist: Equipment Bürkle North America, Inc. . . . . . . . . 1225 CHEMCUT Corporation . . . . . . . . . . 1035 Electra Polymers Ltd. . . . . . . . . . . . . 906 Equipment Technologies, Inc. . . . . . . . 741 HMS Hoellmuller Maschinenbau GmbH . 848 Integrated Process Systems, Inc. . . . . . 735 MicroCraft . . . . . . . . . . . . . . . . . 301 ScanCAD International, Inc. . . . . . . . . 1447 Schmid Systems Inc. USA . . . . . . . . . 925 Tapco Circuit Supply . . . . . . . . . . . . 435

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DISCOVER. CONNECT. THRIVE. Technic Inc. . . . . . . . . . . . . . . . . . 943 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Solder Resist: Materials Dow Electronic Materials . . . . . . . . . 419 Electra Polymers Ltd. . . . . . . . . . . . . 906 Electrolube . . . . . . . . . . . . . . . . 2459 Henkel Corporation . . . . . . . . . . . . 2159 Rogers Corporation . . . . . . . . . . . . 1125 Taiyo America, Inc. . . . . . . . . . . . . 1041 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Solderability Test Systems Christopher Associates, Inc. . . . . . . . 1917 ECI Technology . . . . . . . . . . . . . . . 831 Electro-Comp Services, Inc. . . . . . . . . 351 Malcomtech International . . . . . . . . 1431 Qualectron Systems Corporation . . . . . 2276 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Soldering Equipment: Other ACE Production Technologies, Inc. . . . . . 464 AIR-VAC Engineering Co. . . . . . . . . . 2347 Apollo Seiko Ltd. . . . . . . . . . . . . . 1159 APS NOVASTAR . . . . . . . . . . . . . . 749 Aqueous Technologies . . . . . . . . . . . 725 Ascentec Engineering . . . . . . . . . . . 1636 Caltex Scientific . . . . . . . . . . . . . . 1365 Centralink Technology Limited . . . . . . . 361 Christopher Associates, Inc. . . . . . . . 1917 Control Micro Systems, Inc. . . . . . . . . 1624 DMI International . . . . . . . . . . . . . 1175 EFD, Inc. A Nordson Company . . . . . . 1641 ERSA North America . . . . . . . . . . . . 625 Finetech . . . . . . . . . . . . . . . . . . 2228 Generon IGS . . . . . . . . . . . . . . . . 1646 Heller Industries . . . . . . . . . . . . . . 1747 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 Malcomtech International . . . . . . . . 1431 Manncorp . . . . . . . . . . . . . . . . . 2458 Nordson ASYMTEK . . . . . . . . . . . . 1925 Omni Training . . . . . . . . . . . . . . . 531 Pentagon EMS . . . . . . . . . . . . . . 1262

IPC APEX EXPO™

Pillarhouse USA . . . . . . . . . . . . . . 2149 Qualitek International Inc. . . . . . . . . 1548 Rehm Thermal Systems . . . . . . . . . . 1959 SEHO North America, Inc. . . . . . . . . . 259 Senju Comtek . . . . . . . . . . . . . . . 673 Tapco Circuit Supply . . . . . . . . . . . . 435 Unicote - Halco LLC . . . . . . . . . . . . 1128 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Soldering Equipment: Selective ACE Production Technologies, Inc. . . . . . 464 AIR-VAC Engineering Co. . . . . . . . . . 2347 Apollo Seiko Ltd. . . . . . . . . . . . . . 1159 APS NOVASTAR . . . . . . . . . . . . . . 749 Ascentec Engineering . . . . . . . . . . . 1636 Centralink Technology Limited . . . . . . . 361 DMI International . . . . . . . . . . . . . 1175 ERSA North America . . . . . . . . . . . . 625 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735 Manncorp . . . . . . . . . . . . . . . . . 2458 NBS . . . . . . . . . . . . . . . . . . . . 2141 On Site Gas Systems, Inc. . . . . . . . . . 2137 Pentagon EMS . . . . . . . . . . . . . . 1262 Pillarhouse USA . . . . . . . . . . . . . . 2149 PVA . . . . . . . . . . . . . . . . . . . . . 649 Rehm Thermal Systems . . . . . . . . . . 1959 SEHO North America, Inc. . . . . . . . . . 259 SEICA Inc. . . . . . . . . . . . . . . . . . 973 Senju Comtek . . . . . . . . . . . . . . . 673 SMT Technologies . . . . . . . . . . . . . 2224 Vitronics Soltec . . . . . . . . . . . . . . 1073 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Soldering Equipment: Wave ACE Production Technologies, Inc. . . . . . 464 APS NOVASTAR . . . . . . . . . . . . . . 749 Ascentec Engineering . . . . . . . . . . . 1636 Centralink Technology Limited . . . . . . . 361 DMI International . . . . . . . . . . . . . 1175 ECD - Electronic Controls Design, Inc. . . 1361 ERSA North America . . . . . . . . . . . . 625 ESSEMTEC . . . . . . . . . . . . . . . . 1259 IBE SMT Equipment . . . . . . . . . . . . 664 Juki Automation Systems . . . . . . . . . 1735

Manncorp . . . . . . . . . . . . . . . . . 2458 NBS . . . . . . . . . . . . . . . . . . . . 2141 On Site Gas Systems, Inc. . . . . . . . . . 2137 Pentagon EMS . . . . . . . . . . . . . . 1262 Pillarhouse USA . . . . . . . . . . . . . . 2149 Qualitek International Inc. . . . . . . . . 1548 SEHO North America, Inc. . . . . . . . . . 259 Senju Comtek . . . . . . . . . . . . . . . 673 SMT Technologies . . . . . . . . . . . . . 2224 Speedline Technologies, Inc. . . . . . . . 373 Technical Devices Company . . . . . . . . 2041 Vitronics Soltec . . . . . . . . . . . . . . 1073 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Soldering Irons/Tips/& Stations AIR-VAC Engineering Co. . . . . . . . . . 2347 Apollo Seiko Ltd. . . . . . . . . . . . . . 1159 Christopher Associates, Inc. . . . . . . . 1917 ERSA North America . . . . . . . . . . . . 625 Martin GmbH . . . . . . . . . . . . . . . . 638 OK International . . . . . . . . . . . . . . 1482 Omni Training . . . . . . . . . . . . . . . 531 Qualitek International Inc. . . . . . . . . 1548 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Stencil: Cleaning Systems Aqueous Technologies . . . . . . . . . . . 725 Ascentech, LLC . . . . . . . . . . . . . . 2359 Assembléon America . . . . . . . . . . . 325 ASYS Group Americas Inc. . . . . . . . . 2247 Austin American Technology . . . . . . . 2242 Europlacer North America . . . . . . . . 2259 IBE SMT Equipment . . . . . . . . . . . . 664 Kyzen Corporation . . . . . . . . . . . . . 2241 Manncorp . . . . . . . . . . . . . . . . . 2458 Milara/Mirae . . . . . . . . . . . . . . . . 959 ScanCAD International, Inc. . . . . . . . . 1447 Seika Machinery, Inc. . . . . . . . . . . . 407 Smart Sonic Stencil Cleaning Systems . . 1771 SMT Technologies . . . . . . . . . . . . . 2224 Stoelting LLC . . . . . . . . . . . . . . . 1258 Transition Automation, Inc. . . . . . . . . 1729 Unicomp North America LLC . . . . . . . . 576 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 ZESTRON America . . . . . . . . . . . . . 865

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Stencil: Printing Systems APS NOVASTAR . . . . . . . . . . . . . . 749 Ascentec Engineering . . . . . . . . . . . 1636 Assembléon America . . . . . . . . . . . 325 ASYS Group Americas Inc. . . . . . . . . 2247 DEK International . . . . . . . . . . . . . 1573 ERSA North America . . . . . . . . . . . . 625 ESSEMTEC . . . . . . . . . . . . . . . . 1259 Europlacer North America . . . . . . . . 2259 I Source Technical Services, Inc. . . . . . 1525 IBE SMT Equipment . . . . . . . . . . . . 664 Manncorp . . . . . . . . . . . . . . . . . 2458 MicroScreen LLC . . . . . . . . . . . . . . 743 Milara/Mirae . . . . . . . . . . . . . . . . 959 Ovation Products . . . . . . . . . . . . . 1173 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Pentagon EMS . . . . . . . . . . . . . . 1262 Photo Stencil . . . . . . . . . . . . . . . 1430 Production Solutions, Inc. . . . . . . . . . 2150 Quik-Tool, LLC . . . . . . . . . . . . . . . 440 Samsung Techwin Ltd./Dynatech Technology, Inc. . . . . . . . . . . . . . 1559 ScanCAD International, Inc. . . . . . . . . 1447 Smart Sonic Stencil Cleaning Systems . . 1771 SMT Technologies . . . . . . . . . . . . . 2224 Sony Manufacturing Systems America, Inc. . . . . . . . . . . . . . . . 641 Speedline Technologies, Inc. . . . . . . . 373 Transition Automation, Inc. . . . . . . . . 1729 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Stencil: Supplies & Accessories Aqueous Technologies . . . . . . . . . . . 725 ASYS Group Americas Inc. . . . . . . . . 2247 DEK International . . . . . . . . . . . . . 1573 Electrolube . . . . . . . . . . . . . . . . 2459 I Source Technical Services, Inc. . . . . . 1525 Kyzen Corporation . . . . . . . . . . . . . 2241 M.E.T. (Metal Etching Technology) . . . . 1725 MicroScreen LLC . . . . . . . . . . . . . . 743 Ovation Products . . . . . . . . . . . . . 1173 Photo Stencil . . . . . . . . . . . . . . . 1430 Production Solutions, Inc. . . . . . . . . . 2150 ScanCAD International, Inc. . . . . . . . . 1447 Smart Sonic Stencil Cleaning Systems . . 1771

Transition Automation, Inc. . . . . . . . . 1729 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 ZESTRON America . . . . . . . . . . . . . 865

Surface Finishing (HASL/OSP/ Other) Atotech USA, Inc. . . . . . . . . . . . . . 201 CHEMCUT Corporation . . . . . . . . . . 1035 Dow Electronic Materials . . . . . . . . . 419 ECI Technology . . . . . . . . . . . . . . . 831 Equipment Technologies, Inc. . . . . . . . 741 HMS Hoellmuller Maschinenbau GmbH . 848 Integrated Process Systems, Inc. . . . . . 735 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Para Tech Coating, Inc. . . . . . . . . . . 2127 Schmid Systems Inc. USA . . . . . . . . . 925 Specialty Coating Systems . . . . . . . . 1635 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Unicote - Halco LLC . . . . . . . . . . . . 1128 Uyemura International Corporation . . . . 1049 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Surface Prep Atotech USA, Inc. . . . . . . . . . . . . . 201 CHEMCUT Corporation . . . . . . . . . . 1035 Dow Electronic Materials . . . . . . . . . 419 Electrolube . . . . . . . . . . . . . . . . 2459 Equipment Technologies, Inc. . . . . . . . 741 HMS Hoellmuller Maschinenbau GmbH . 848 Integrated Process Systems, Inc. . . . . . 735 INVENTEC PERFORMANCE CHEMICALS . 465 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Micron Laser Technology . . . . . . . . . 1029 Para Tech Coating, Inc. . . . . . . . . . . 2127 Phibro-Tech, Inc. . . . . . . . . . . . . . . 1031 Plasma Etch, Inc. . . . . . . . . . . . . . 1236 Schmid Systems Inc. USA . . . . . . . . . 925 Tapco Circuit Supply . . . . . . . . . . . . 435 Technic Inc. . . . . . . . . . . . . . . . . . 943 Wise srl . . . . . . . . . . . . . . . . . . 949 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Tape & Reel Equipment & Services 3M Electronic Solution Division . . . . . 1465 Chad Industries . . . . . . . . . . . . . . 1373 Electro-Comp Services, Inc. . . . . . . . . 351 Manncorp . . . . . . . . . . . . . . . . . 2458 Mid America Taping & Reel . . . . . . . . 541 Nu-Way Electronics . . . . . . . . . . . . 630 Q Corporation . . . . . . . . . . . . . . . 511 Smart Splice LLC . . . . . . . . . . . . . 2275 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — Analog Acculogic, Inc. . . . . . . . . . . . . . . . 249 Caltex Scientific . . . . . . . . . . . . . . 1365 Equipment Technologies, Inc. . . . . . . . 741 Everett Charles Technologies . . . . . . . 1782 JTAG Technologies . . . . . . . . . . . . 2325 MicroCraft . . . . . . . . . . . . . . . . . 301 PCQR2 — A Partnership between CAT, Inc. & IPC . . . . . . . . . . . . . . . . 1231 Qualectron Systems Corporation . . . . . 2276 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 Texmac/Takaya Corporation . . . . . . . . 859 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — AOI/Automated Acculogic, Inc. . . . . . . . . . . . . . . . 249 Agilent Technologies . . . . . . . . . . . 1473 ASC International . . . . . . . . . . . . . 1634 Brock Electronics . . . . . . . . . . . . . 2047 Caltex Scientific . . . . . . . . . . . . . . 1365 Cencorp . . . . . . . . . . . . . . . . . . 547 Christopher Associates, Inc. . . . . . . . 1917 Cirris Systems . . . . . . . . . . . . . . . 525 Computrol, Inc. . . . . . . . . . . . . . . . 626 CyberOptics Corporation . . . . . . . . . 2271 Electro-Comp Services, Inc. . . . . . . . . 351 Equipment Technologies, Inc. . . . . . . . 741 Europlacer North America . . . . . . . . 2259 FocalSpot, Inc. . . . . . . . . . . . . . . . 2035 HIWIN Corporation . . . . . . . . . . . . . 930

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DISCOVER. CONNECT. THRIVE. IBE SMT Equipment . . . . . . . . . . . . 664 JTAG Technologies . . . . . . . . . . . . 2325 Koh Young Technology, Inc. . . . . . . . . 447 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Machine Vision Products, Inc. . . . . . . . 1647 Malcomtech International . . . . . . . . 1431 MIRTEC Corp. . . . . . . . . . . . . . . . 2219 NBS . . . . . . . . . . . . . . . . . . . . 2141 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 Nordson YESTECH . . . . . . . . . . . . 1759 Qualectron Systems Corporation . . . . . 2276 Saki America . . . . . . . . . . . . . . . 2213 ScanCAD International, Inc. . . . . . . . . 1447 SEICA Inc. . . . . . . . . . . . . . . . . . 973 SPEA America . . . . . . . . . . . . . . . 2065 Texmac/Takaya Corporation . . . . . . . . 859 Vi TECHNOLOGY . . . . . . . . . . . . . 1948 Viscom Inc. . . . . . . . . . . . . . . . . 1273 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635

Test and Inspection: Equipment — Boundary Scan Computrol, Inc. . . . . . . . . . . . . . . . 626 Everett Charles Technologies . . . . . . . 1782 JTAG Technologies . . . . . . . . . . . . 2325 NBS . . . . . . . . . . . . . . . . . . . . 2141 Qualectron Systems Corporation . . . . . 2276 Seika Machinery, Inc. . . . . . . . . . . . 407 SPEA America . . . . . . . . . . . . . . . 2065 Texmac/Takaya Corporation . . . . . . . . 859 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XJTAG . . . . . . . . . . . . . . . . . . . 1564 Test and Inspection: Equipment — Digital Acculogic, Inc. . . . . . . . . . . . . . . . 249 Caltex Scientific . . . . . . . . . . . . . . 1365 Equipment Technologies, Inc. . . . . . . . 741 Everett Charles Technologies . . . . . . . 1782 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 JTAG Technologies . . . . . . . . . . . . 2325 PCQR2 — A Partnership between CAT, Inc. & IPC . . . . . . . . . . . . . . . . 1231 Qualectron Systems Corporation . . . . . 2276

IPC APEX EXPO™

Seika Machinery, Inc. . . . . . . . . . . . 407 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 Vision Engineering . . . . . . . . . . . . 1177 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XJTAG . . . . . . . . . . . . . . . . . . . 1564

Test and Inspection: Equipment — Environmental Chambers Cincinnati Sub-Zero Products, Inc. . . . . . 636 Conveyor Technologies Inc./CTI Systems . 265 Equipment Technologies, Inc. . . . . . . . 741 Microtek Labs . . . . . . . . . . . . . . . 1928 PCQR2 — A Partnership between CAT, Inc. & IPC . . . . . . . . . . . . . . . . 1231 SGS U.S. Testing Co. . . . . . . . . . . . 2424 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — Fixtures/Handlers 3M Electronic Solution Division . . . . . 1465 Acculogic, Inc. . . . . . . . . . . . . . . . 249 ASC International . . . . . . . . . . . . . 1634 Ascentec Engineering . . . . . . . . . . . 1636 CheckSum . . . . . . . . . . . . . . . . . 1435 Cirris Systems . . . . . . . . . . . . . . . 525 Dage Precision Industries, Inc. . . . . . . 1625 Digitaltest Inc. . . . . . . . . . . . . . . . 459 Everett Charles Technologies . . . . . . . 1782 Ingun Pruefmittelbau GmbH . . . . . . . 2319 InsulFab PCB Tooling . . . . . . . . . . . 1861 Omron Electronics . . . . . . . . . . . . . 1346 Pentagon EMS . . . . . . . . . . . . . . 1262 QA Technology Company, Inc. . . . . . . . 2236 Qualectron Systems Corporation . . . . . 2276 QxQ, Inc. . . . . . . . . . . . . . . . . . . 1472 Seika Machinery, Inc. . . . . . . . . . . . 407 SiFO Technology Co., Ltd. . . . . . . . . . 1278 Smart Sonic Stencil Cleaning Systems . . 1771 SMH Technologies . . . . . . . . . . . . 1485 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 TopLine . . . . . . . . . . . . . . . . . . 1825 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Test and Inspection: Equipment — Functional Acculogic, Inc. . . . . . . . . . . . . . . . 249 Agilent Technologies . . . . . . . . . . . 1473 Ascentec Engineering . . . . . . . . . . . 1636 CheckSum . . . . . . . . . . . . . . . . . 1435 Computrol, Inc. . . . . . . . . . . . . . . . 626 Dage Precision Industries, Inc. . . . . . . 1625 Digitaltest Inc. . . . . . . . . . . . . . . . 459 Equipment Technologies, Inc. . . . . . . . 741 Everett Charles Technologies . . . . . . . 1782 Ingun Pruefmittelbau GmbH . . . . . . . 2319 JTAG Technologies . . . . . . . . . . . . 2325 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 NBS . . . . . . . . . . . . . . . . . . . . 2141 Omron Electronics . . . . . . . . . . . . . 1346 QA Technology Company, Inc. . . . . . . . 2236 Qualectron Systems Corporation . . . . . 2276 QxQ, Inc. . . . . . . . . . . . . . . . . . . 1472 SEICA Inc. . . . . . . . . . . . . . . . . . 973 SiFO Technology Co., Ltd. . . . . . . . . . 1278 Sony Manufacturing Systems America, Inc. . . . . . . . . . . . . . . . 641 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — In-Circuit Acculogic, Inc. . . . . . . . . . . . . . . . 249 Agilent Technologies . . . . . . . . . . . 1473 CheckSum . . . . . . . . . . . . . . . . . 1435 Computrol, Inc. . . . . . . . . . . . . . . . 626 Conveyor Technologies Inc./CTI Systems . 265 Digitaltest Inc. . . . . . . . . . . . . . . . 459 Equipment Technologies, Inc. . . . . . . . 741 Everett Charles Technologies . . . . . . . 1782 IBE SMT Equipment . . . . . . . . . . . . 664 Ingun Pruefmittelbau GmbH . . . . . . . 2319 JTAG Technologies . . . . . . . . . . . . 2325 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 NBS . . . . . . . . . . . . . . . . . . . . 2141 QA Technology Company, Inc. . . . . . . . 2236 Qualectron Systems Corporation . . . . . 2276 QxQ, Inc. . . . . . . . . . . . . . . . . . . 1472 SEICA Inc. . . . . . . . . . . . . . . . . . 973

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Seika Machinery, Inc. . . . . . . . . . . . 407 SiFO Technology Co., Ltd. . . . . . . . . . 1278 SMH Technologies . . . . . . . . . . . . 1485 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 Texmac/Takaya Corporation . . . . . . . . 859 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XJTAG . . . . . . . . . . . . . . . . . . . 1564

Test and Inspection: Equipment — Infrared World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — Mixed Signal Acculogic, Inc. . . . . . . . . . . . . . . . 249 Everett Charles Technologies . . . . . . . 1782 JTAG Technologies . . . . . . . . . . . . 2325 SPEA America . . . . . . . . . . . . . . . 2065 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — Other Agilent Technologies . . . . . . . . . . . 1473 Aqueous Technologies . . . . . . . . . . . 725 ASC International . . . . . . . . . . . . . 1634 Ascentech, LLC . . . . . . . . . . . . . . 2359 C. A. Picard Inc. . . . . . . . . . . . . . . 1248 Caltex Scientific . . . . . . . . . . . . . . 1365 CheckSum . . . . . . . . . . . . . . . . . 1435 Cirris Systems . . . . . . . . . . . . . . . 525 CyberOptics Corporation . . . . . . . . . 2271 Dage Precision Industries, Inc. . . . . . . 1625 Datapaq, Inc. . . . . . . . . . . . . . . . 1640 Digitaltest Inc. . . . . . . . . . . . . . . . 459 Equipment Technologies, Inc. . . . . . . . 741 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 Ingun Pruefmittelbau GmbH . . . . . . . 2319 JTAG Technologies . . . . . . . . . . . . 2325 Malcomtech International . . . . . . . . 1431 MicroCraft . . . . . . . . . . . . . . . . . 301 Microtek Labs . . . . . . . . . . . . . . . 1928 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 Nordson YESTECH . . . . . . . . . . . . 1759 Omron Electronics . . . . . . . . . . . . . 1346 ScanCAD International, Inc. . . . . . . . . 1447

Schleuniger, Inc. . . . . . . . . . . . . . . 527 Scienscope International . . . . . . . . . 1460 SEICA Inc. . . . . . . . . . . . . . . . . . 973 Smart Sonic Stencil Cleaning Systems . . 1771 Sonoscan, Inc. . . . . . . . . . . . . . . . 1924 Sony Manufacturing Systems America, Inc. . . . . . . . . . . . . . . . 641 Specialty Coating Systems . . . . . . . . 1635 Texmac/Takaya Corporation . . . . . . . . 859 Viscom Inc. . . . . . . . . . . . . . . . . 1273 Vision Engineering . . . . . . . . . . . . 1177 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635

Test and Inspection: Equipment — Package Dage Precision Industries, Inc. . . . . . . 1625 Front Panel Express LLC . . . . . . . . . . 2435 Machine Vision Products, Inc. . . . . . . . 1647 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 Nordson YESTECH . . . . . . . . . . . . 1759 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 SGS U.S. Testing Co. . . . . . . . . . . . 2424 Sonoscan, Inc. . . . . . . . . . . . . . . . 1924 Vi TECHNOLOGY . . . . . . . . . . . . . 1948 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635 Test and Inspection: Equipment — PXI Systems Acculogic, Inc. . . . . . . . . . . . . . . . 249 Everett Charles Technologies . . . . . . . 1782 JTAG Technologies . . . . . . . . . . . . 2325 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — RoHS Ascentec Engineering . . . . . . . . . . . 1636 Computrol, Inc. . . . . . . . . . . . . . . . 626 Front Panel Express LLC . . . . . . . . . . 2435 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 JTAG Technologies . . . . . . . . . . . . 2325 Malcomtech International . . . . . . . . 1431 RMD Instruments Corp. . . . . . . . . . . 349 Scienscope International . . . . . . . . . 1460 SGS U.S. Testing Co. . . . . . . . . . . . 2424

UPA Technology . . . . . . . . . . . . . . 801 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635

Test and Inspection: Equipment — Solder Paste Agilent Technologies . . . . . . . . . . . 1473 ASC International . . . . . . . . . . . . . 1634 Ascentech, LLC . . . . . . . . . . . . . . 2359 Caltex Scientific . . . . . . . . . . . . . . 1365 Christopher Associates, Inc. . . . . . . . 1917 CyberOptics Corporation . . . . . . . . . 2271 Koh Young Technology, Inc. . . . . . . . . 447 Machine Vision Products, Inc. . . . . . . . 1647 Malcomtech International . . . . . . . . 1431 MIRTEC Corp. . . . . . . . . . . . . . . . 2219 NBS . . . . . . . . . . . . . . . . . . . . 2141 Nordson EFD . . . . . . . . . . . . . . . 1641 Nordson YESTECH . . . . . . . . . . . . 1759 Omron Electronics . . . . . . . . . . . . . 1346 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 Qualectron Systems Corporation . . . . . 2276 Saki America . . . . . . . . . . . . . . . 2213 ScanCAD International, Inc. . . . . . . . . 1447 Seika Machinery, Inc. . . . . . . . . . . . 407 Smart Sonic Stencil Cleaning Systems . . 1771 Vi TECHNOLOGY . . . . . . . . . . . . . 1948 Viscom Inc. . . . . . . . . . . . . . . . . 1273 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635 Test and Inspection: Equipment — System Integration Acculogic, Inc. . . . . . . . . . . . . . . . 249 ASC International . . . . . . . . . . . . . 1634 Caltex Scientific . . . . . . . . . . . . . . 1365 Cirris Systems . . . . . . . . . . . . . . . 525

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Conveyor Technologies Inc./CTI Systems . 265 JTAG Technologies . . . . . . . . . . . . 2325 SMH Technologies . . . . . . . . . . . . 1485 Texmac/Takaya Corporation . . . . . . . . 859 V-TEK Incorporated . . . . . . . . . . . . 1539 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XACT pcb Ltd. . . . . . . . . . . . . . . . 819

Test and Inspection: Equipment — Vision/Videos Agilent Technologies . . . . . . . . . . . 1473 ASC International . . . . . . . . . . . . . 1634 Ascentec Engineering . . . . . . . . . . . 1636 C. A. Picard Inc. . . . . . . . . . . . . . . 1248 Caltex Scientific . . . . . . . . . . . . . . 1365 Cencorp . . . . . . . . . . . . . . . . . . 547 Chad Industries . . . . . . . . . . . . . . 1373 Conveyor Technologies Inc./CTI Systems . 265 CyberOptics Corporation . . . . . . . . . 2271 Equipment Technologies, Inc. . . . . . . . 741 ERSA North America . . . . . . . . . . . . 625 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Machine Vision Products, Inc. . . . . . . . 1647 Malcomtech International . . . . . . . . 1431 Microscan Systems, Inc. . . . . . . . . . 1826 MIRTEC Corp. . . . . . . . . . . . . . . . 2219 Nordson YESTECH . . . . . . . . . . . . 1759 Qualectron Systems Corporation . . . . . 2276 ScanCAD International, Inc. . . . . . . . . 1447 Scienscope International . . . . . . . . . 1460 Seika Machinery, Inc. . . . . . . . . . . . 407 Sonoscan, Inc. . . . . . . . . . . . . . . . 1924 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 Texmac/Takaya Corporation . . . . . . . . 859 Viscom Inc. . . . . . . . . . . . . . . . . 1273 Vision Engineering . . . . . . . . . . . . 1177 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Equipment — Wire Harness Cirris Systems . . . . . . . . . . . . . . . 525 Computrol, Inc. . . . . . . . . . . . . . . . 626 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

IPC APEX EXPO™

Test and Inspection: Equipment — X-Ray Agilent Technologies . . . . . . . . . . . 1473 Computrol, Inc. . . . . . . . . . . . . . . . 626 Dage Precision Industries, Inc. . . . . . . 1625 Equipment Technologies, Inc. . . . . . . . 741 FocalSpot, Inc. . . . . . . . . . . . . . . . 2035 Glenbrook Technologies, Inc. . . . . . . . 559 Lewis & Clark, Inc. . . . . . . . . . . . . 1582 Microtek Labs . . . . . . . . . . . . . . . 1928 MIRTEC Corp. . . . . . . . . . . . . . . . 2219 NBS . . . . . . . . . . . . . . . . . . . . 2141 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 Nordson YESTECH . . . . . . . . . . . . 1759 North Star Imaging, Inc. . . . . . . . . . . 1911 Saki America . . . . . . . . . . . . . . . 2213 Scienscope International . . . . . . . . . 1460 SGS U.S. Testing Co. . . . . . . . . . . . 2424 Sonoscan, Inc. . . . . . . . . . . . . . . . 1924 Test Research USA, Inc. . . . . . . . . . . 1425 Unicomp North America LLC . . . . . . . . 576 UPA Technology . . . . . . . . . . . . . . 801 Viscom Inc. . . . . . . . . . . . . . . . . 1273 VJ Electronix . . . . . . . . . . . . . . . 2059 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 YXLON International Inc. . . . . . . . . . . 635 Test and Inspection: Test Laboratory/Failure Analysis INVENTEC PERFORMANCE CHEMICALS . 465 North Star Imaging, Inc. . . . . . . . . . . 1911 SGS U.S. Testing Co. . . . . . . . . . . . 2424 Underwriters Laboratories . . . . . . . . . 914 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Test and Inspection: Testing Services Acculogic, Inc. . . . . . . . . . . . . . . . 249 Agilent Technologies . . . . . . . . . . . 1473 Cincinnati Sub-Zero Products, Inc. . . . . . 636 Electro-Comp Services, Inc. . . . . . . . . 351 FocalSpot, Inc. . . . . . . . . . . . . . . . 2035 JTAG Technologies . . . . . . . . . . . . 2325 Koh Young Technology, Inc. . . . . . . . . 447 Malcomtech International . . . . . . . . 1431 MicroCraft . . . . . . . . . . . . . . . . . 301

Microtek Labs . . . . . . . . . . . . . . . 1928 Nikon Metrology, Inc./X-Tek . . . . . . . 1439 North Star Imaging, Inc. . . . . . . . . . . 1911 NSWC Crane Division . . . . . . . . . . . 1129 PCQR2 — A Partnership between CAT, Inc. & IPC . . . . . . . . . . . . . . . . 1231 Qualectron Systems Corporation . . . . . 2276 QxQ, Inc. . . . . . . . . . . . . . . . . . . 1472 ScanCAD International, Inc. . . . . . . . . 1447 SEICA Inc. . . . . . . . . . . . . . . . . . 973 SGS U.S. Testing Co. . . . . . . . . . . . 2424 SiFO Technology Co., Ltd. . . . . . . . . . 1278 SMH Technologies . . . . . . . . . . . . 1485 Sonoscan, Inc. . . . . . . . . . . . . . . . 1924 SPEA America . . . . . . . . . . . . . . . 2065 Test Research USA, Inc. . . . . . . . . . . 1425 Texmac/Takaya Corporation . . . . . . . . 859 TUV Rheinland of North America . . . . . 674 Underwriters Laboratories . . . . . . . . . 914 Viscom Inc. . . . . . . . . . . . . . . . . 1273 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XJTAG . . . . . . . . . . . . . . . . . . . 1564 YXLON International Inc. . . . . . . . . . . 635 ZESTRON America . . . . . . . . . . . . . 865

Test and Inspection: Testing Software Acculogic, Inc. . . . . . . . . . . . . . . . 249 Aegis Industrial Software Corporation . . 2025 Agilent Technologies . . . . . . . . . . . 1473 ASC International . . . . . . . . . . . . . 1634 Caltex Scientific . . . . . . . . . . . . . . 1365 CyberOptics Corporation . . . . . . . . . 2271 Datapaq, Inc. . . . . . . . . . . . . . . . 1640 Digitaltest Inc. . . . . . . . . . . . . . . . 459 ERSA North America . . . . . . . . . . . . 625 HIROX-USA, Inc. . . . . . . . . . . . . . . 450 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 JTAG Technologies . . . . . . . . . . . . 2325 KIC . . . . . . . . . . . . . . . . . . . . . 1549 Machine Vision Products, Inc. . . . . . . . 1647 Malcomtech International . . . . . . . . 1431 MicroCraft . . . . . . . . . . . . . . . . . 301 Microtek Labs . . . . . . . . . . . . . . . 1928 Nikon Metrology, Inc./X-Tek . . . . . . . 1439

Index of Exhibitors by Product Category DISCOVER. CONNECT. THRIVE. Nordson YESTECH . . . . . . . . . . . . 1759 North Star Imaging, Inc. . . . . . . . . . . 1911 Omron Electronics . . . . . . . . . . . . . 1346 QxQ, Inc. . . . . . . . . . . . . . . . . . . 1472 ScanCAD International, Inc. . . . . . . . . 1447 Scienscope International . . . . . . . . . 1460 SIEMENS Electronics Assembly Systems, LLC . . . . . . . . . . . . . . 2011 SiFO Technology Co., Ltd. . . . . . . . . . 1278 SMH Technologies . . . . . . . . . . . . 1485 SPEA America . . . . . . . . . . . . . . . 2065 Ucamco USA . . . . . . . . . . . . . . . . 902 Viscom Inc. . . . . . . . . . . . . . . . . 1273 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 XJTAG . . . . . . . . . . . . . . . . . . . 1564 YXLON International Inc. . . . . . . . . . . 635

Thermal Profiling Datapaq, Inc. . . . . . . . . . . . . . . . 1640 ECD - Electronic Controls Design, Inc. . . 1361 ERSA North America . . . . . . . . . . . . 625 FocalSpot, Inc. . . . . . . . . . . . . . . . 2035 Heller Industries . . . . . . . . . . . . . . 1747 KIC . . . . . . . . . . . . . . . . . . . . . 1549 Malcomtech International . . . . . . . . 1431 Manncorp . . . . . . . . . . . . . . . . . 2458 Pillarhouse USA . . . . . . . . . . . . . . 2149 Seika Machinery, Inc. . . . . . . . . . . . 407 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Tooling Equipment & Supplies Apexyl Enterprises Ltd. . . . . . . . . . . 1330 Ascentec Engineering . . . . . . . . . . . 1636 Brock Electronics . . . . . . . . . . . . . 2047 Bürkle North America, Inc. . . . . . . . . 1225 Caltex Scientific . . . . . . . . . . . . . . 1365 DEK International . . . . . . . . . . . . . 1573 DIS Inc. . . . . . . . . . . . . . . . . . . 1228 DMI International . . . . . . . . . . . . . 1175 Equipment Technologies, Inc. . . . . . . . 741 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 Microtek Labs . . . . . . . . . . . . . . . 1928 OEM Press Systems, Inc. . . . . . . . . . 920 Ovation Products . . . . . . . . . . . . . 1173 Pentagon EMS . . . . . . . . . . . . . . 1262

Quality Tech Tool . . . . . . . . . . . . . . 813 Quik-Tool, LLC . . . . . . . . . . . . . . . 440 Tapco Circuit Supply . . . . . . . . . . . . 435 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Training & Education Agilent Technologies . . . . . . . . . . . 1473 AIM . . . . . . . . . . . . . . . . . . . . 1827 Assembléon America . . . . . . . . . . . 325 Atotech USA, Inc. . . . . . . . . . . . . . 201 Blackfox Training Institute, LLC . . . . . . 1424 BTU International . . . . . . . . . . . . . 871 Caltex Scientific . . . . . . . . . . . . . . 1365 Custer Consulting Group . . . . . . . . . 1124 ECD - Electronic Controls Design, Inc. . . 1361 Equipment Technologies, Inc. . . . . . . . 741 IBE SMT Equipment . . . . . . . . . . . . 664 Intuitive & Cimnet Systems, Consona ERP Solutions . . . . . . . . . . . . . . 1325 INVENTEC PERFORMANCE CHEMICALS . 465 IPC Designers Council . . . . . . . . . . . 2073 IPC — Association Connecting Electronics Industries© . . . . . . . . . 2073 JTAG Technologies . . . . . . . . . . . . 2325 Malcomtech International . . . . . . . . 1431 Microtek Labs . . . . . . . . . . . . . . . 1928 MYDATA automation Inc. . . . . . . . . . 2225 NSWC Crane Division . . . . . . . . . . . 1129 Omni Training . . . . . . . . . . . . . . . 531 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 ScanCAD International, Inc. . . . . . . . . 1447 Technic Inc. . . . . . . . . . . . . . . . . . 943 TopLine . . . . . . . . . . . . . . . . . . 1825 TUV Rheinland of North America . . . . . 674 Ucamco USA . . . . . . . . . . . . . . . . 902 YXLON International Inc. . . . . . . . . . . 635 Vacuum Sealant Equipment AccuAssembly . . . . . . . . . . . . . . . 1449 AmeriVacS . . . . . . . . . . . . . . . . . 1530 PVA . . . . . . . . . . . . . . . . . . . . . 649 Totech America Corporation . . . . . . . 2425 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

Via Filling/Plugging/Tenting Atotech USA, Inc. . . . . . . . . . . . . . 201 Christopher Associates, Inc. . . . . . . . 1917 Dow Electronic Materials . . . . . . . . . 419 Electra Polymers Ltd. . . . . . . . . . . . . 906 Equipment Technologies, Inc. . . . . . . . 741 ITC Intercircuit . . . . . . . . . . . . . . . 1137 Taiyo America, Inc. . . . . . . . . . . . . 1041 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Wafer Bumping Equipment Heller Industries . . . . . . . . . . . . . . 1747 Milara/Mirae . . . . . . . . . . . . . . . . 959 Pac Tech USA Packaging Technologies, Inc. . . . . . . . . . . . . 565 Photo Stencil . . . . . . . . . . . . . . . 1430 ScanCAD International, Inc. . . . . . . . . 1447 Wire Bonding Equipment Caltex Scientific . . . . . . . . . . . . . . 1365 Manncorp . . . . . . . . . . . . . . . . . 2458 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . 1871 ScanCAD International, Inc. . . . . . . . . 1447 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Wire Cutting/Stripping and Wrapping Machine Tools Computrol, Inc. . . . . . . . . . . . . . . . 626 Control Micro Systems, Inc. . . . . . . . . 1624 FKN Systek, Inc. . . . . . . . . . . . . . . 1537 Pillarhouse USA . . . . . . . . . . . . . . 2149 Schleuniger, Inc. . . . . . . . . . . . . . . 527 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619 Workstations/Ergonomics/ Chairs AIR-VAC Engineering Co. . . . . . . . . . 2347 ASYS Group Americas Inc. . . . . . . . . 2247 Conveyor Technologies Inc./CTI Systems . 265 MYDATA automation Inc. . . . . . . . . . 2225 Simplimatic Automation . . . . . . . . . . 458 World Equipment Source (Owned by R-1 Source) . . . . . . . . . 619

www.IPCAPEXEXPO.org

Exhibitors Listing DISCOVER. CONNECT. THRIVE. 3M Electronic Solution Division

1465

926 JR Industrial Drive Sanford, NC 27332 Phone: +1 866-722-3736 3MStaticInfo@mmm.com Web: www.3MStatic.com 3M Electronic Solutions Division provides a full range of packaging, workstation and instrumentation product solutions which are designed to help electronic products manufacturers develop and maintain complete ANSI/ESD S20.20 compliant static control programs. The updated Static Control product catalog from the 3M Electronics Solutions Division features 140 pages of electrostatic discharge solutions from the industry leader. The catalog is currently available online from www.3MStatic.com.

Academic Posters

901

View and vote on submissions to IPC’s Academic Poster Competition Meet the Academic Poster presenters: Wednesday 3:30 pm–6:00 pm Voting closes at 6:00 pm on Wednesday Awards will be given at the close of the Show Floor Reception on Wednesday at 6:00

AccuAssembly

1449

1621 McEwen Drive, Unit 33 Whitby, ON L1N 9A5 Canada Phone: 905-571-4603 sales@accuassembly.com Web: www.accuassembly.com Doug Derry, Sales and Marketing 905-571-4603, doug.derry@accuassembly.com BarTector MES — for pick and place productivity, improved quality, parts traceability and PCB tracking. Dr Storage — Dry Boxes and Environmental Monitors for MSDs. HumiTel — Smart MSD Control for tracking MSDs.

Acculogic, Inc.

249

175 Riviera Drive Markham, ONT L3R 5J6 Canada Phone: 800-697-8378 Web: www.acculogic.com Robert Steel, National Sales Manager 770-205-0950, r.steel@acculogic.com Acculogic is a global supplier of automatic test equipment and application support services. Acculogic’s test products include the Flying Scorpion — world’s only double sided Flying Probe with 3-D joy-stick-like probe motion and 24 probes — the Sprint low cost, high performance single sided Flying Probe, an extensive line of bed-of-nails In-Circuit Test Systems, a powerful suite of Boundary Scan test and programming tools. New Product

ACE Production Technologies, Inc.

464

3010 N. First Street Spokane Valley, WA 99216 Phone: +1 509-924-4898 sales@ace-protech.com Web: www.ace-protech.com Alan Cable, President +1 509-924-4898, acable@ace-protech.com Randy Allinson, Business Development +1 860-395-9384, rallinson@snet.net ACE Production Technologies, Selective Soldering Solutions: Affordable selective soldering systems suitable for tin-lead and lead-free solder. The product line consists of advanced solder fountain rework stations, batch mode selective soldering and advanced in-line selective soldering with preheat options as well as automated fluxing capabilities. All of these flexible systems feature CAD friendly programming, lead-free compatible solder pots, and multiple solder nozzles.

IPC APEX EXPO™

ACME, INC. & GALUSAMEX S.A. 513 Cleveland Street Rapid City, SD 57701 Phone: +1 605-381-5963 acmetino@gwtc.net

2183

Aegis Industrial Software Corporation 2025

5 Walnut Grove Drive, Suite 320 Horsham, PA 19044 Phone: +1 215-733-3571 sales@aiscorp.com Web: www.aiscorp.com Lynette Durringer, Office Manager +1 215-773-3571, ldurringer@aiscorp.com Robert Miklosey, Vice President of Product Management +1 215-773-3571, bmiklosey@aiscorp.com Aegis Software provides single-vendor information systems for high-reliability manufacturers, providing a critical complement to enterprise-level ERP and PLM capabilities. Aegis’ manufacturing execution system (MES) software fully manages the manufacturing information environment, from process planning and launch, through manufacturing execution and shop floor materials control, to operations analytics and real-time dashboard systems.

Agilent Technologies

1473

AIM

1827

5301 Stevens Creek Blvd. Santa Clara, CA 95051 Phone: +1 800-829-4444 Web: www.agilent.com/find/pcb Agilent Technologies (NYSE: A), the premier measurement company. Be sure to plan a stop in booth 1245 for a visit with our experts. Learn more about products and services and how Agilent “Has Got Your Needs Covered.” 25 Kenney Drive Cranston, RI 02920 Phone: +1 401-463-5605 info@aimsolder.com Web: www.aimsolder.com Kelly Cardone, Marketing Coordinator +1 401-463-5605, kcardone@aimsolder.com AIM offers a full line of solder assembly materials to the electronics industry including solder paste, liquid flux, bar, wire, preforms, adhesives, cleaners and chemicals, plating anodes and indium- and gold-based specialty alloys. We are ISO9001 and QS9000 certified with manufacturing, distribution and support facilities located throughout the Americas, Asia-Pacific and Europe.

Airtech International Inc.

719

AIR-VAC Engineering Co.

2347

5700 Skylab Road Huntington Beach, CA 92647 Phone: +1 714-899-8100 Web: www.airtechpcb.com Airtech is a manufacturer of high performance release films, conformable release films, press pads and associated vacuum bagging materials for HDI, FPC and Rigid-Flex lamination applications. 30 Progress Avenue Seymour, CT 06483 Phone: +1 203-888-9900 Web: www.air-vac-eng.com Howard Lasto, West Coast Manager +1 760-438-9363, howard.lasto@air-vac-eng.com Linda Gwozdzik, Office Manager +1 203-888-9900 x107, linda.gwozdzik@air-vac-eng.com A Manufacturer of precision Assembly and Rework Systems. The Onyx Series is our Robotic Assembly Platforms capable of placing devices within 5 microns. Applications include Surface Mount & Semiconductor devices, MEMS, RF and Opto/Photonics. The DRS25 Rework and Repair System as been specifically designed for Lead-Free assemblies such as BGA/CSP and Flip Chip. Options include: 7500 watt, 3-zone IR Preheaters and Solder Removal System (vacuum). The PCBRM-15 (Lead-Free mini-wave) provides Selective Soldering and Rework possibilities for any type of Thru-Hole component. Optional top and bottom Perheaters.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. All Flex - Flexible Circuits

2430

1705 Cannon Lane Northfield, MN 55057 Phone: +1 507-663-7162 preichert@allflexinc.com Web: www.allflexinc.com Founded in 1991, Flexible circuit manufacturer specializing in quickturn, proto-type, low to medium volume production. Produces single-sided, double-sided, multi-layer flexible circuits, flexible heater circuits, and maxi-flex速 40 feet +. Also provides complete surface mount and thru hole component assembly. Expert design and engineering support, optical inspection, and automated assembly. Serves medical, military, aerospace, industrial, and instrumentation markets. ISO 9001:2008, AS 9100 Certified, Mil P50884D, ITAR, IPC 6013, RoHS Compliant, and UL. Made in the USA.

all4-PCB (North America) Inc.

207

Apexyl Enterprises Ltd.

1330

Apollo Seiko Ltd.

1159

97 Evanshen Cres Ottawa, ON K2K 2X7 Canada Phone: 613-882-6776 info@apexyl.com Web: www.apexyl.com Xin Xie 613-882 6776, sales@apexyl.com Apexyl Enterprises Ltd. represents certified Chinese suppliers in North America. All of our manufacturers are ISO certified, as well as UL and/or RoHS approved. The products have been supplied to world-renowned brands. The Products include: Flexible Copper-Clad Laminate, Coverlay, Adhesive Film, Stiffener (JiuJiang Flex Co.,Ltd.); Flexible PCB Dies and Tooling; Pierce & Blank Die; Compound Die etc.

4218 San Fernando Road Glendale, CA 91204 Phone: +1 818-230-2345 Web: www.all4-pcb.us Torsten Reckert, President +1 818-230-2345, Torsten.Reckert@all4-PCB.COM Roland Lacap, Operations Manager +1 818-515-8328, Roland.Lacap@all4-PCB.COM All4-PCB equipment and consumables for the PCB industry. EQUIPMENT: HASL machines (Pentagal), Brushing and cleaning lines (IS), Via Filler (MASS), Planarizer (Pola & Massa), wet processing & handling (Kuttler), Cross Sectioning (MSC polymers), Laser (Process Photonics). CONSUMABLES: flex material (Krempel), conductive (Tatsuta) and non-conductive via fill pastes (Sanei), release film materials (MSC Polymers).

3969 West Lemon Creek Road Bridgman, MI 49106 Phone: +1 269-465-3400 info@apolloseiko.com Web: www.apolloseiko.com Rick G. Schiffer, President +1 269-465-3400, rick@apolloseiko.com Stacey Barajas, Executive Assistant +1 269-465-3400, stacey@apolloseiko.com Apollo Seiko is the world-wide leader in selective soldering solutions. Our technologies include direct power iron tip, micro-flame, laser diode and bottom side soldering. Table-top or in-line systems are available, equipment in stock.

AmeriVacS

1530

APS NOVASTAR

Amistar Automation, Inc.

1283

3800 Main Street, Suite 9 Chula Vista, CA 91911 Phone: +1 619-498-8227 Web: www.amerivacs.com Peter Tadlock, President +1 619-498-8227, peter@amerivacs.com Manufacturer of high performance clean room compatible Vacuum Sealers with Gas Purge for protecting your sensitive products. Perfect vacuum seals on all heat sealable bags, including all ESD bags. All AmeriVacS Vacuum Sealers incorporate a quiet, non-particle generating, maintenance-free Compressed Air-Driven Vacuum Pump for quick and efficient vacuum sealed products every time. Always in stock. One week trial period. Two year limited warranty. Custom designing available. Backed up by over 20 years of experience. Proudly made in the U.S.A. 1269 Linda Vista Drive San Marcos, CA 92078-3831 Phone: +1 760-471-1700 Web: www.amistarautomation.com Joseph P. Pultinevicius, President +1 760-471-3923, joep@amistarautomation.com Richard J. Geisz, Customer Support Manager +1 760-471-3993, rgeisz@amistarautomation.com Amistar Automation, Inc. sells and supports SMT and AOI equipment manufactured by I-Pulse Company, Ltd. of Japan. They sell and service Automatic Labeling Systems manufactured by Amistar Corporation and Amistar Automation, Inc. They also provide service, parts and support for ThroughHole & SMT equipment manufactured, or distributed by, Amistar Corporation.

APE.com

359

2 North Blackwater Lane Key Largo, FL 33037 Phone: +1 305-451-4722 Web: www.ape.com Casey Scheu, President +1 305-451-4722, casey@ape.com Arielle Brill, Sales Coordinator +1 305-451-4722, arielle@ape.com A wide range of rework systems from the popular economic Chipmaster to the latest computer controlled data logging machines with Split Vision features. High power low temperature systems suitable for reworking PCS product, BGA and CSP components. Newmachines for lead free applications together with systems for reworking large infrastructure boards requiring wide area panel heaters.

749

2840 Pine Road Huntingdon Valley, PA 19006 Phone: +1 215-938-1000 info@apsgold.com Web: www.apsgold.com John Malboeuf, VP Sales +1 215-938-1000, JMalboeuf@apsgold.com John Albano, Global Sales Manager +1 215-938-1000, JAlbano@apsgold.com Designs and manufactures cost-effective turnkey solutions for surface mount and through-hole assembly for low to medium volume OEM and contract manufacturers. Equipment includes manual and automatic stencil printers, manual and automatic pick & place systems with dispensers, wave solder and selective solder machines, lead-free solder reflow ovens including models with exclusive patented horizontal convection, component counters, and through-hole rework system. Visit Booth 749 to discuss your specific needs and learn about our new products. New Product

Aqua Klean Systems

1584

22795 Savi Ranch Parkway Unit D Yorba Linda, CA 92887 Phone: +1 714-394-3870 Web: www.aquaklean.com Mike Schwager, President +1 714-394-3870, mike@aquaklean.com Uriel Sanchez, Sales / Service Engineer +1 714-921-9855, uriel@aquaklean.com Aqua Klean Systems designs and manufactures water treatment systems for the Electronic and Semiconductor Industries. Systems are built with quality and durability in mind. Every unit is quality tested to ensure full and proper operation in the field. Only high quality filters, pumps and electrical components are assembled into all units. Aqua Klean pre-designs equipment for fast water treatment solutions, or can customize a system that will fit your application. Aqua Klean has been working with manufacturing facilities for over 15 years, allowing Aqua Klean to provide customers with quality solutions. Contact Aqua Klean today for your water filtration needs! New Product

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Aqueous Technologies

725

9055 Rancho Park Court Rancho Cucamonga, CA 91730 Phone: +1 909-944-7771 Web: www.aqueoustech.com Mike Konrad, President +1 909-944-7771, konrad@aqueoustech.com Joe Herr, Sales Manager +1 909-944-7771, herr@aqueoustech.com Aqueous Technologies manufactures a variety of award-winning cleaning and cleaning related products including: Semi-Automatic Aqueous De-Fluxing stations Batch-Format Automatic Aqueous De-Fluxing Systems In-Line Format Aqueous De-Fluxing Systems; Ultrasonic Stencil Cleaning Systems; Cleaning Chemistries; Ionic Contamination (Cleanliness) Testers. Aqueous Technologies’ cleaners are capable of removing all flux/paste types including Rosin, Water Soluble and removes no-clean solder paste. New Product

Arc-Tronics, Inc. 1150 Pagni Drive Elk Grove Village, IL 60007 Phone: +1 847-437-0211 x230 marciaw@arc-tronics.com

Arlon Materials For Electronics

829

1329

9433 Hyssop Drive Rancho Cucamonga, CA 91730 Phone: +1 909-987-9533 Web: www.arlon-med.com Michael Smith, VP of Marketing +1 302-834-2100, msmith@arlon-med.com Brad Foster, VP of Sales +1 909-987-9533, bfoster@arlon-med.com Arlon is a supplier of copper clad laminates and bonding sheets for manufacture of PWB’s. Products include high performance polyimide and epoxy systems, products for thermal management and SMT Technology, as well as a full line of low loss and PTFE laminates and bonding materials for high frequency and New Product microwave applications.

ASC International

1634

1799 Couty Road 90, Suite 9 Maple Plain, MN 55359 Phone: +1 763-479-6210 info@ascinternational.com Web: www.ascinternational.com Jon Arneson, President +1 763-478-6200 x14, jona@ascinternational.com Steve Arneson, National Business Manager +1 763-478-6200 x12, stevea@ascinternational.com ASC International helps electronics manufacturers worldwide improve product quality production yields, providing unique 3D automatic optical inspection systems and process control tools. ASC International specializes in both offline and in-line solder paste inspection and AOI solutions. Products include the VisionMaster, LaserVision and AV 860 series of SPI / AOI solutions. New Product

Ascentec Engineering

1636

19535 SW 129th Avenue Tualatin, OR 97062 Phone: +1 503-925-1942 solutions@ascenteceng.com Web: www.ascenteceng.com Ian Ruef, Director, Sales & Marketing +1 503-925-1942 x118, ianr@ascenteceng.com Worldwide supplier of premium custom tooling for electronic assembly. Wave solder pallets, surface mount carriers, heat sink alignment tooling, press support plates, material prep tooling, component feeders, and vacuum fixtures. Specializing in titanium, aluminum, and glass composite materials. Staffed with experienced engineers. Your quality and quick turn specialists.

IPC APEX EXPO™

Ascentech, LLC

2359

127 Goose HIll Road Chester, CT 06412 Phone: +1 860-526-8903 Web: www.ascentechllc.com Randy Allinson +1 860-395-9384, rallinson@snet.net Gregory Alexander +1 860-395-8794, galexnder@att.net A Manufacturer of specialist test equipment including Solderability, SIR, Cleanliness and Solder Paste Analysis as well as Conformal Coating Systems both batch and in-line non robotic. Ascentech LLC will also exhibit and demonstrate the NEW Gensonics SMT Stencil Care system.

Assembléon America

325

5110 McGinnis Ferry Road Alpharetta, GA 30005 Phone: +1 770-751-4420 Web: www.assembleon.com Holly Nelson, Executive Administrative Assistant +1 770-751-4524, holly.nelson@philips.com Terry York, Manager, Business Support +1 770-751-4433, terry.york@philips.com Assembléon’s broad product range provides solutions for SMT electronics assembly with a focus on Pick-and-Place machinery and high-end screen printers. Assembléon also markets a wide range of software solutions and service capabilities. These total solutions support manufacturing from low volume high-mix batch production through to ultra-high volume continuous production of electronic assemblies. It’s machines are based on high precision X-Y positing platforms incorporating advanced parallel placement technology and continuous software calibration for the most demanding applications. New Product

ASSEMBLY Magazine

835

2401 W. Big Beaver, Suite 700 Troy, MI 48084 Phone: +1 248-786-1609 Web: www.assemblymag.com ASSEMBLY magazine is a monthly publication and complete e-media brand serving the 2.7 billion dollar Assembly market with world class information on the latest technology, innovation, and best practice of assembly in manufacturing. Free issues and subscription applications are available.

ASYS Group Americas Inc.

2247

140 Satellite Boulevard. N.E. Suwanee, GA 30024 Phone: +1 770-246-9706 info@asys-group.com Web: www.asys-group.com Markus Wilkens, President +1 770-246-9706, markus.wilkens@asys-group.com ASYS Group provides high quality equipment and excellent support worldwide. The product range includes SMD Board Handling, Marking Systems (Laser/ Label/Inkjet), Depaneling Systems (In-/Offline), Final Assembly and EKRA Screen Printers for the SMT, Semi-Pack, Solar, and Hybrid markets. Find out more about the company that is Driven by Innovation at www.asys-group.com.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Atotech USA, Inc.

201

1750 Overview Drive Rock Hill, SC 29730 Phone: +1 803-817-3500 Web: www.atotech.com Cindy Lesslie, Administrative Assistant +1 803-817-3596, cindy.lesslie@atotech.com Daniel Schmidt, Global Marketing Management +49 30 34985423, daniel-1.schmidt@atotech.com Atotech’s extensive knowledge and vast product offering gives you highly productive systems and single-source responsibility. Solid research and development combined with decades of field proven processing is your assurance for the best systems technology comprising full package of chemistry, production technology and best local service world wide. Atotech only works with certified suppliers to ensure the highest quality product with consistency second to none. Adherence to international quality standards is a way of life at Atotech. Atotech is committed to providing products and processes that are environmentally responsible according to the most stringent requirements on a global base.

Austin American Technology

2242

401 Industrial Boulevard P.O. Box 1489 Burnet, TX 78611 Phone: +1 512-756-4150 Web: www.aat-corp.com Glenn Seely, Sales & Marketing Manager +1 512-756-4150 x34, gseely@aat-corp.com Austin American Technology engineers and manufactures high performance cleaning systems. From general-purpose to high reliability, AAT systems are design-driven by the science of cleaning. Our cost-effective lineup includes batch and inline; aqueous and solvent; spray in air and spray under immersion. Applications include circuit board, semiconductor, precision and specialty cleaning. New Product

Bare Board Group, Inc.

834

7401 - 114th Avenue North, Suite 501 Largo, FL 33773 Phone: +1 727-549-2200 sales@bareboard.com Web: www.bareboard.com Greg Papandrew, President +1 727-549-2200, greg@bareboard.com Tom Coghlan, Global Operations Director +1 727-549-2200, tom@bareboard.com The Bare Board Group has the sourcing and distribution experience necessary to assist you in obtaining offshore PCBs at competitive pricing through our prequalifed network of U/L, ISO and QS approved manufacturers. BBG has personnel ready to meet your needs on both sides of the world for on-site expediting, source inspection and around-the-clock communication.

BigC.com

1143

20655 S. Western Avenue, Suite 116 Torrance, CA 90501 Phone: +1 310-618-9990 x115 marshall@bigc.com Web: www.BigC.com Bigc.com offers the Dino-Lite Portable Digital Microscope that provides highquality microscopy video interfacing to PC with clear and steady imaging and 10X–200X magnification. The included software “DinoCapture” makes it easy and convenient to take snapshots, record videos, manipulate images, and save and e-mail discoveries. A single lens device with diverse applications.

Blackfox Training Institute, LLC

1424

Brock Electronics

2047

BTU International

871

701 Delaware Avenue, Unit B Longmont, CO 80501 Phone: +1 303-684-0135 Web: www.blackfox.com Al Dill, President/CEO +1 303-684-0135 x201, ald@blackfox.com Sharon Montana-Beard, Director of Sales/Master Instructor +1 303-684-0135 x208, sharonm@blackfox.com Blackfox is the only IPC Authorized Certification Center in the world that provides customized skill-based Blackfox Certifications to achieve the IPC Acceptability Standards. Since 1996, Blackfox has offered convenient, worldwide class locations to better support our customers. Blackfox compliments this by offering an On-Line Solution designed to support our customers need for World Class Learning and Certification! Experience the Blackfox difference! New Product 350 Harry Walker Parkway N., Unit 16 Newmarket, ON L3Y 8L3 Canada Phone: 905-954-0505 info@BrockElectronics.com Web: www.brockelectronics.com Paul Walsh, General Manager 905-954-0505, Paul@brockelectronics.com Raymond Schouten 905-954-0505, raymond@brockelectronics.com BROCK Electronics (Americas Distributor) Cluso is the power tool for inspection of thru hole & SMT PCBs, eliminatong all the variables that undermine accuracy & efficiency. Micro-Tec Instrumentation offer very competitive solder paste inspection systems, hardness testers & the innovative, low cost Solder Saver Dross Recovery System. NEW — the Mirae Mx200XP premium technology pick & place platform. An ideal range of placement solutions for today’s challenging ecomomy. Consumables — high quality consumable products for the PCB assembly space, including understencil wiping roll, cover tape extenders & splicing tools & supplies. New Product

23 Esquire Road North Billerica, MA 01862 Phone: +1 978-667-4111 sales@btu.com Web: www.btu.com Coco Zhang, Product Manager +1 978-667-4111, czhang@btu.com Rob DiMatteo, Regional Sales +1 978-667-4111 x143, rdimatteo@btu.com BTU’s Pyramax solder reflow ovens are designed and built to master today’s leadfree processes, and the challenges of tomorrow. With 6, 8, 10 and 12 zone air or nitrogen models, 350°C maximum temperature, flexible platform configuration, low nitrogen and power consumption and a comprehensive menu of options, the Pyramax is both the industry’s most versatile performer and its best value.

Bürkle North America, Inc.

1225

12802 Valley View Street, Suite 12-13 Garden Grove, CA 92845 Phone: +1 714-379-5090 Web: www.burkleusa.com David Howard, Vice President & COO dhoward@burkleusa.com Richard Crowe, President rcrowe@burkleusa.com FabFour alliance (application, service, parts sales & direct factory contact & support). The FabFour product lines include Lamination & Coating Systems from BÜRKLE, Drill, Routing & Direct Imaging Systems from SCHMOLL, Imaging & Registration Solutions from BACHER and Scoring & Beveling Systems from LHMT.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. C. A. Picard Inc.

1248

cab Technology, Inc.

1349

CAC, Inc.

1238

Caltex Scientific

1365

305 Hill Brady Road Battle Creek, MI 49015 Phone: +1 269-962-2231 info@capicard.com Web: www.capicard.com Mark Fink, President +1 269-962-2231, rmfink@capicard.com Gary Weidner, Global Sales Manager +1 843-504-4246, gweidner@capicard.com Contact us for your registration equipment, image frames, artwork punch, post etch punch and lamination plate needs. Introducing the Visper AVI equipment with Gerber file capability for final visual inspection of PCBs. Please visit the Picard boot for all your registration needs and the Visper AVI equipment.

87 Progress Avenue, #1 Tyngsboro, MA 01879 Phone: +1 978-649-0293 info@cabtechn.com Web: www.cabtechn.com Joe Komus, President +1 978 649 0293, j.komus@cabtechn.com We are a manufacturer of PCB Depanelizers and PCB Magazines. We offer ten different PCB Depanelizers for pre-scored and routed boards. PCB Magazines for storage, transport and automatic feeding. We also manufacture Lasermarking equipment and Barcode, Label Printers. 20322 Windrow Drive Lake Forest, CA 92630 Phone: +1 949-587-3337 CAC, Inc. is a manufacturer of CAC® (Copper Aluminum Copper), its licensed and patented product featuring copper foil attached in their “state of the art” clean room to one or both sides of an aluminum separator sheet based on the PCB application.

16190 Scientific Irvine, CA 92618 Phone: +1 949-788-0101 info@caltexsci.com Web: www.caltexsci.com Peter Cho, President +1 949-788-0101, peter@caltexsci.com Tina Lynne, Sales Manager +1 949-788-0101, tina@caltexsci.com The Sony TechnoLOOK all-in-one digital microscope is perfect for inspection, assembly, and documentation. Caltex new 3D CX-3000 Rotational digital microscope for SMT inspection and measurement, new SPM-300-3D solder paste measurement, Caltex BH-2000 BGAInspection measurement inspection system. Applications include SMT, microelectronics, and medical device inspection.

Calumet Electronics

1126

25830 Depot Street Calumet, MI 49913 Phone: +1 906-337-1305 sales@calumetelectronics.com Web: www.calumetelectronics.com Calumet has invested millions of dollars to create a new standard for circuit board manufacturing and supply chain partnerships. Our Mission-Critical Manufacturing™ delivers better boards! Commercial: IPC-6012B Class 2 and 3 Military: MIL-PRF-31032 and MIL-PRF-55110 Our Dock-To-Stock Supply Chain Solutions™ delivers a better bottom line! • Dock-To-Stock Quality Management drives down the cost of poor quality • Inventory Management drives down the cost of carrying inventory • Life-Cycle Management drives down the cost of non-value adding activities Calumet: A Legacy of Performance, A Future of Innovation!

IPC APEX EXPO™

Camtek USA

841

2000 Wyatt Drive, Suite 3 Santa Clara, CA 95054 Phone: +1 408-986-9540 Web: www.camtek.co.il Camtek Ltd provides automated solutions dedicated for enhancing production processes and yield, enabling our customers new technologies in three industries; Semiconductors, Printed Circuit Board (PCB) and IC Substrates. Camtek addresses the specific needs of these industries with dedicated solutions based on a wide and advanced platform of technologies including intelligent imaging, image processing, ion milling and digital material deposition. Camtek’s solutions range from micro-to-nano by applying its technologies to the industryspecific requirements. New Product

CCI

1359

4500 Quebec Avenue North New Hope, MN 55428 Phone: +1 763-537-2090 info@corstat.com Web: www.corstat.com Roger Zimmerman, Sales Manager +1 612-810-8109, rogerz@corstat.com CCI the industry leader in ESD shielding packaging. Manufacturing static shielding corrugated and plastic materials. Converter of conductive and antistatic foams. CCI has the solution for the shipping, handling, and storage of your ESD sensitive components.

Cencorp

547

Centralink Technology Limited

361

3600 W. Military Highway, Suite 1 McAllen, TX 78503 Phone: +1 956-467-5660 Web: www.cencorp.com Sara Steinbrink, Office Manager +1 956-467-5660 x101, sara.steinbrink@cencorp.com Kent Dixon, Sales Manager +1 972-402-9540, kent.dixon@cencorp.com Cencorp is a global supplier of automation for depaneling, odd-form assembly, and test handling. Cencorp takes pride in bringing innovation to the market with products that reduce labor, improve quality, and provide a strong return on investment. Since1978, Cencorp has been a trusted name and partner valued by many top tier companies.

Unit A2 7/F Loyong Court Comm Bldg 212-220 Lockhart Road Wanchai Hong Kong, Hong Kong Phone: +852 8209 1298 Richard Lui, Business & Operation Director +852 9192 1975, richard@centralinkhk.com CentraLink Technology is a Hong Kong base company with technical support office in mainland China. We specialize in designing and developing various types of solder pallets and fixtures, such as wave solder pallets, SMT process carriers, adjustable pallets, selective solder pallets, etc, for the printed circuit board assembly process. We also provide quality and cost-effective custommade tooling and fixtures that meet your unique requirements. We are also distributing CirCut PCB depaneling machines. Its main advantage over other machines is its ability to de-panel both FR4 and aluminum boards without having to reset the machine.

Chad Industries

1373

1565 South Sinclair Street Anaheim, CA 92806 Phone: +1 714-938-0080 info@chadindustries.net Web: www.chadindustries.net Ward Palmer, Product Manager +1 714-938-0080, ward.palmer@chadindustries.net Scott Smith, Project Manager +1 714-398-8447, scott.smith@chadindustries.net Excellence in Automation since 1973; Chad Industries provides reliable, highly flexible semi and fully automatic systems to handle Odd-Form Board Assembly and Final Assembly applications. Featuring the CHAD-IQ product line and patented technologies including our 3-D adaptive compliance assembly head, single-pin lead clinch system, and adjustable parts feeders.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. CheckSum

1435

6120 - 195th St. NE Arlington, WA 98223 Phone: 1-877-CHECKSUM / +1 360-435-5510 info@checksum.com Web: www.checksum.com John VanNewkirk, CEO +1 360-435-5510, john.vannewkirk@checksum.com Harry Jin, Field Product Manager +1 360-421-0205, harry.jin@checksum.com CheckSum provides low-cost in-circuit test (ICT) and part programming systems. The test systems detect and isolate manufacturing process faults and functional failures. CheckSum test systems utilize sophisticated capabilities such as guarding, complex-impedance measurement, vectorless test with TestJet Technology, MultiWriter gang, on-board programming system, and fully integrated functional test. The installed base is more than 3000 systems. CheckSum is the only U.S. ATE vendor supplying complete turnkey bed-of-nails test fixtures, program and support. Our new product MultiWriter pps is the first fully integrated in-line system for high-speed gang programming of boardmounted chips, up to 384 chips simultaneously.

CHEMCUT Corporation

1035

500 Science Park Road State College, PA 16803 Phone: +1 814-272-2800 bluebox@chemcut.net Web: www.chemcut.net Rick Lies, CEO/General Manager rlies@chemcut.net Chemcut, the leading supplier of wet processing equipment to the PCB & Chem-Milling markets, delivers world-leading process uniformity, state-of-theart process controls, and customer-proven reliability. Modular systems that can be configured for any process, performance and flexibility — backed by reliable post-sale service and support — remain the hallmark of Chemcut products.

China Printed Circuit Association (CPCA)

221

Room 101, No, 28, Yangming International Garden Lane 588, Shuiqing Road Shanghai, 201100 China Phone: +86 21 5417 9011 Web: www.cpca.org.cn/en China Printed Circuit Association (CPCA) is a sole national PCB trade organization under the Ministry of Information Industry of the People’s Republic of China. It was established in June 1990 and up to now has 250 members who are big-and medium-sized PCB producers, manufactures of special equipment, raw and auxiliary materials, research institutes, colleges and universities from all over the country. In their ownership, the members are of state-run, collective, private, sino-foreign jointly invested and solely foreign funded.

Christopher Associates, Inc.

1917

3617 West MacArthur Boulevard, Suite 507 Santa Ana, CA 92704 Phone: +1 714-979-7500 info@christopherweb.com Web: www.christopherweb.com Roberto Garcia, Sales Coordinator +1 714-979-7500, roberto@christopherweb.com Angela Maniaci, Marketing +1 714-979-7500, angela@christopherweb.com Suppliers of advanced manufacturing technology and equipment including AOI, Verification/Repair stations, Solder Paste measurement systems, Air Filtration Systems, Cleanroom supplies, u.v. imaging and curing, laminators, assembly and joining materials.

Cincinnati Sub-Zero Products, Inc.

636

Circuit Cellar

BIN

12011 Mosteller Road Cincinnati, OH 45241 Phone: +1 513-772-8810 indsales@cszinc.com Web: www.cszindustrial.com Mark Chrusciel, Sales Director +1 513-772-8810, Chrusciel@cszinc.com CSZ manufactures a full range of environmental test chambers including, temperature cycling chambers, humidity chambers, accelerated stress testing chambers, thermal shock chambers, altitude chambers, AGREE vibration chambers, industrial freezers and more. Sizes range from benchtop chambers to full walk-in/drive-in rooms. Standard temperature ranges include -84ºC to +190ºC with relative humidity from 10% to 98%. P.O. Box 180 Vernon, CT 06066 Phone: +1 860-875-2199 Web: www.circuitcellar.com Circuit Cellar magazine’s unique combination of editorial products and services provides a tremendous value to the embedded systems design community. Through its monthly publication and management of numerous design contests, Circuit Cellar continually assists its global readership and industry vendors by focusing on real-world design techniques and workbench-level advice.

Circuit Check, Inc.

2146

6550 Wedgwood Road Maple Grove, MN 55311 Phone: +1 763-694-4214 neil.adams@circuitcheck.com Web: www.circuitcheck.com Circuit Check provides engineering and fabrication of innovative, reliable incircuit and functional test fixtures. We are the largest totally integrated solutions provider of testing services and interfacing products. Four product lines allow you to efficiently source your test development, NPI, volume production and functional test from one supplier. Our goal is to improve your test coverage, reduce redundant tests and simplify your communications chain.

Circuitnet

Supporter

135 Ward Hill Avenue Haverhill, MA 01835 Phone: +1 843-682-4755 Web: www.circuitnet.com Jeff Ferry, Publisher +1 843-682-4755, jferry@circuitnet.com Ken Cavallaro, Business Manager +1 978-363-2176, kcavallaro@circuitnet.com Every business day we dig through the unending stream of news, articles, features, and discussions covering the world of electronics manufacturing. We conveniently package links to these important news stories in a simple email digest and send this email to our exclusive subscribers every business day.

CircuiTree Magazine

835

2401 West Big Beaver Road, Suite 700 Troy, MI 48084 Web: www.circuitree.com Darryl Seland, Publisher +1 610- 436-4220, selandd@bnpmedia.com Chris Wilson, Advertising Sales Manager +1 248-244-8264, wilsonc@bnpmedia.com CircuiTree is the only global magazine covering printed circuit board manufacture. Its monthly blend of technical and business articles is complemented by columnists who are regarded as industry experts. CircuiTree also translates technical articles into Chinese for its Asian edition. Please visit us at www.circuitree.com for a free subscription or advertising information.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Circuits Assembly Magazine

237

Cirris Systems

525

P.O. Box 470 Canton, GA 30169 Phone: +1 617-327-4702 mbuetow@upmediagroup.com Web: www.circuitsassembly.com Circuits Assembly is the leading monthly trade journal exclusively serving the electronics assembly market. Circuits Assembly covers the entire surface mount process: printing, placement, soldering, inspection, cleaning, test and rework, including procurment and Lean manufacturing. Visit our booth for your free subscription, and for info on our new EMS Directory.

1991 Parkway Boulevard Salt Lake City, UT 84119 Phone: +1 800-441-9910 info@cirris.com Web: www.cirris.com Brent Stringham, Vice President, Sales & Marketing +1 800-441-9910, bs@cirris.com Joe Klekas, Sales/Trade Shows +1 800-441-9910, jklekas@cirris.com Cirris is a worldwide leader in cable and harness test equipment. We manufacture the Easy-wire and Signature lines of cable/harness analyzers. New this year are the “Pin-Sight” guide for pinning a connector; and 1500VAC on the CH2 model. 64 to 32,000 test point ranges; 5VDC to 2800VDC/2000VAC voltage ranges. We have a solution for most cable, harness, and interconnect testing and pinning applications.

Cobar Solder Products Inc./Balver Zinn 1876

53 Wentworth Avenue Londonderry, NH 03053 Phone: +1 603-432-7500 L.Larrabee@cobar.com Web: www.cobar.com Cobar, part of the Balver Zinn Group, is a recognized global supplier of solder paste, solder fluxes and related materials for electronics assembly. Cobar is accredited to the prestigious ISO/TS 16949 Quality Management Standard. Please visit our booth #1876 to discover the new Aquasol Branded Water Soluble solder paste. New Product

Cogiscan Inc.

1828

50 De Gaspe, Suite A5 Bromont, QC J2L 2N8 Canada Phone: 450-534-2644 info@cogiscan.com Web: www.cogiscan.com Francois Monette, Co-President 450-534-2644, fmonette@cogiscan.com Mitch DeCaire, Sales Manager (Americas) 450-534-2644, mdecaire@cogiscan.com Cogiscan is the leader in Material Control for the electronics manufacturing industry. We offer real-time tracking, traceability, and control of all materials (feeders, components, PCBs, solder paste) throughout SMT and other assembly processes. Cogiscan provides cost-effective and scalable solutions that ensure the right material is at the right place at the right time. New Product

Computrol, Inc.

626

499 East Corporate Drive Meridian, ID 83642 Phone: +1 208-887-1000 sales@computrol.com Web: www.computrol.com Jeff Yturbe, Sales +1 208-887-1000 x231, jyturbe@computrol.com Kevin Kimsey, Sales +1 208-887-1000 x277, kkimsey@computrol.com Computrol is a turnkey, Electronic Contract Manufacturing Services Provider, specializing in low/medium to high volume, high mix, high technology assembly, including Box build, Cable and Wire Harnesses, SMT, through-hole and mixed technology board assembly. We are a multi facility company headquartered in Meridian Idaho. We are ISO 9001:2008, 13485:2003, J-Std and IPC class II and III certified, plus we are ITAR registered and RoHS compliant. We have full electrical and functional test capabilities as well as design, DFM and DFT analysis. IPC APEX EXPO™

Control Micro Systems, Inc.

1624

4420A Metric Drive Winter Park, FL 32792 Phone: +1 407-679-9716 Web: www.pcbmarking.com Sales Department +1 407-679-9716, salesmail@cmslaser.com Provides laser marking systems for fast, permanent marking of text, graphics, barcodes and ECC200 2D matrix codes on pc boards. Specializes in laser systems configured to specific marking requirements, including board material, boardhandling, vision systems/readers and integration with computer networks. Systems configurations range from stand-alone marking islands to fully integrated, SMEMA in-line workstations.

Conveyor Technologies Inc./CTI Systems 265

5313 Womack Road Sanford, NC 27330 Phone: +1 919-776-7227 sales@conveyor-technologies.com Web: www.conveyor-technologies.com Jason Vann, Sales Manager +1 919-776-7227, jasonv@conveyor-technologies.com Tom Pilson, Operations Manager +1 919-776-7227, tomp@conveyor-technologies.com Conveyor Technologies / CTI Systems, Is the industry leader in manufacturing of Automated PCB Handling Equipment / Laser Marking – Label Applicators / Routers / Pallet Systems / Final Assembly Cells / Robotics Automation Cells, and many additional machines.

Count On Tools, Inc.

1870

Crystal Mark, Inc.

1149

Custer Consulting Group

1124

2481 Hilton Drive, Suite 3 Gainesville, GA 30501 Phone: +1 800-538-0426 sales@cotinc.com Web: www.cotinc.com Donna Shook, Account Representative +1 770-538-0411 x315, dshook@cotinc.com Curt Couch, President +1 770-538-0411 x302, ccouch@cotinc.com Count On Tools specializes in high quality SMT nozzles and consumables for pick and place machines. Our product range includes most types of placement machine (vacuum nozzles, glue dispense nozzles, cutter blades, and other consumable parts. We provide special engineering design service of custom nozzles for those unique and odd components. We provide contract manufacturing services and are an exclusive distributor of PB Swiss Tools, New Product (www.pbtools.us).

613 Justin Avenue Glendale, CA 91201 Phone: +1 818-240-7520 sales@crystalmarkinc.com Web: www.crystalmarkinc.com Jawn Swan, President +1 818-240-7520 x223, jawn@crystalmarkinc.com Chris Romero, Inside Sales & Marketing +1 818-240-7520 x235, sales@crystalmarkinc.com Manufacturers and Automaters of Micro Sandblast Equipment, Work Stations, Dust Collectors, Nozzles, Abrasive Blasting Powders. For: Texturing, Frosting, Drilling, Conformal Coating Removal, Component Demarking, Deflashing, Solder Mask Removal and more. Smoke & Fume Collectors. 92 Spindrift Close P.O. Box 299 The Sea Ranch, CA 95497-0299 Phone: +1 707-785-1777 Web: www.custerconsulting.com Walter Custer, President +1 707-843-0440, walt@custerconsulting.com Jon Custer - Topai, Vice President +1 707-620-0053, jon@custerconsulting.com Market research, business analyses and forecasts for printed circuit board fabrication and assembly, passive components, semiconductors, and the electronic equipment end markets.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. CyberOptics Corporation

2271

Dage Precision Industries, Inc.

1625

5900 Golden Hills Drive Golden Valley, MN 55416 Phone: +1 763-542-5000 info@cyberoptics.com Web: www.cyberoptics.com Connie Prasher, Marketing Coordinator +1 763.542.5000, cprasher@cyberoptics.com Chris Rockwell, North American Sales Director +1 763-542-5000, chris@cyberoptics.com CyberOptics Corporation is a leading provider of market-based process yield and through-put improvement solutions for the global electronics assembly market. We offer stand-alone measurement and inspection systems used in the SMT electronic assembly market for process control and inspection.

48065 Fremont Boulevard Fremont, CA 94538 Phone: +1 510-683-3930 sales@dage-group.com Web: www.dage-group.com Hal Hendrickson, Sales Manager Americas +1 510-683-3930 x101, sales@nordsondage.com Dage, the leading supplier of X-ray inspection and bond testing equipment, offers XiDAT digital X-ray inspection systems including the XD7600NT100 system featuring groundbreaking 100nm feature recognition. The XD7600NT features 2M pixel imaging for enhanced resolution and CT for 3D modeling. With digital acquisition technology and easy to operate ImageWizard software, Dage X-ray systems are the most advanced X-ray systems on the market. Also on display are the 4000HS high-strain rate bondtester, the world’s first bondtester designed to detect brittle fracture failures in BGA bump interfaces and the Quick View CT system for volumetric imaging of MEMS, PiP and PoP devices.

Datapaq, Inc.

1640

DEK International

1573

187 Ballardvale Street Wilmington, MA 01887 Phone: +1 978-988-9000 Web: www.datapaq.com Richard Burke, National Reflow Sales Manager +1 978-988-9000, sales@datapaq.com Datapaq introduces its brand new Easy Oven Setup (EOS) software for reflow ovens. EOS is an easy-to-use software program that automatically calculates the best reflow oven settings based on the product and process limits that users set. A newly developed search engine processes thousands of oven settings before recommending the best options to the user. EOS eliminates the need to conduct repeated trial and error experiments and reduces oven setup time by more than half. 1785 Winnetka Circle Rolling Meadows, IL 60008 Phone: +1 847-368-1155 Web: www.dek.com With award-winning customer support, decades of materials deposition experience and technologies that enable multiple applications from SMT to semiconductor packaging to photovoltaics, DEK delivers the knowhow and printing solutions you need to stay competitive. Designing every product mindful of customers’ future production needs, DEK keeps choice, versatility and low cost-of-ownership at the core of our development philosophy. Visit the booth to find out how DEK’s portfolio of screen printing, stencil and consumable products can enable your process today and tomorrow. New Product

Dempa Publications, Inc.

BIN

1-11-15 Higashi Gotanda, Shinagawa Ku Tokyo, 141-8715 Japan Phone: +81 3 3445 6111 Web: www.dempa.net Sherelyn Sanchez, Assistant Circtulation Manager sheh@dempa.co.jp DEMPA is the leading Japanese publisher serving the electronics industry. Besides its daily newspaper Dempa Shimbun, the company publishes monthly English magazines such as the Asia Electronics Industry (AEI) and the Journal of the Electronics Industry (JEI). While the Broadcast Equipment and Technology (BET) is available three times a year.

DeNora Tech, Inc.

926

Digitaltest Inc.

459

100 Seventh Avenue Chardon, OH 44024 Phone: +1 440-285-0384 Mark Vozar, Regional Manager 440-285-0384, mark.vozar@denora.com Don Groszek, Director of Business Units 440-285-0359, don.groszek@denora.com De Nora is a global industrial network manufacturing and supplying DSA anodes for plating circuit boards and electrochemical products for many industries. De Nora’s products include DT anodes for use in acid copper plating baths and DSA for ferrous-ferric systems. With facilities in Asia, Europe and the Americas, De Nora provides advanced technologies in plating anodes.

5046 Commercial Circle, Suite C Concord, CA 94520 Phone: +1 925-603-8650 sales@digitaltest.net Web: www.digitaltest.net Sarah Boctor, Marketing Specialist +1 925-603-8650, sboctor@digitaltest.net Mark Harding, Director of Sales, North America +1 925-603-8650, mharding@digitaltest.net Digitaltest offers In-Circuit and Functional test equipment and the 2nd Generation CONDOR Flying Prober. Converters are available for migration from legacy testers to the SIGMA, saving your initial fixture investments. For a complete list of available converters and for more information on our products and services visit www.digitaltest.net

DIS Inc.

1228

Diversified Systems, Inc.

1535

DMI International

1175

200 Blydenburgh Road, Suite 22 Islanida, NY 11749 Phone: +1 631-851-0102 sales@distechnology.com Web: www.distechnology.com Anthony G. Faraci, President +1 631-851-0102, afaraci@distechnology.com Gary Sortino, Engineering Manager +1 631-851-0102, gsortino@distechnology.com DIS Inc is an innovative producer of innerlayer/sub-lamamination registration and welding equipment. DIS is the leading innovator in ‘Direct Optical Registration’, a new method of optically registering and welding innerlayers/sub-lam such that registration is improved by eliminating mechanical tooling tolerances. Operational cycle times are reduced and process flexibility is increased all while significantly reducing operating costs. New Product 3939 West 56th Street Indianapolis, IN 46254 Phone: +1 317-299-9547 Web: www.divsys.com Tammie Fish, VP, Sales & Marketing +1 317-299-9547 x169, tammie.fish@divsys.com Larry Robinson, Business Development Manager +1 317-299-9547 x297, larry.robinson@divsys.com For 35 years, Diversified Systems Inc. has maintained its reputation as a premier PC board manufacturer and electrical contract assembler by specializing in both prototype (including rapid) and production arenas. The company offers engineering solutions for complete life cycle management of all electronic manufacturing needs. 30750 N.W. Hillcrest Street North Plains, OR 97133 Phone: +1 503-647-5188 sales@dmipallet.com Web: www.dmipallet.com PCB Custom Wave Solder Palleting, C/C, & More; Wash Baskets; Specialty Hardware & Accessories; Jigs; Dedicated Plastics Machining & Metal Machining; Custom Built Auxiliary Projects: Simple design requests to the complex, cost-effective tooling. New Product

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Dow Electronic Materials

419

455 Forest Street Marlborough, MA 01752 Phone: +1 800-832-6200 Web: www.rohmhaas.com Colleen Paydos, CBT Sales Executive Assistant cpaydos@rohmhass.com Hal Thrasher, Director, Sales +1 508-229-7594, hthrasher@rohmhaas.com Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, is a leader in the semiconductor, interconnect, chip packaging, display and photovoltaic markets. From technology centers worldwide, teams of talented Dow scientists and application experts work closely with customers to deliver innovative solutions for next-generation electronics. For the interconnect segment, with a broad range of core competencies and deep industry knowledge in the PWB, electronic finishes and photovoltaic industries, Dow delivers advanced technologies and unmatched services to our customers. Conference Pen Sponsor

DuPont Electronic Technologies

616

4417 Lancaster Pike CRP 702-1274A Wilmington, DE 19880-0702 Phone: +1 302-999-3334 Web: electronics.dupont.com DuPont Electronics is connecting science and technology from across the company and around the world to deliver advanced material solutions for the PWB industry, including new Pyralux(r) flexible circuit materials, Riston(r) dry film photoresists, Interra(tm) embedded passive materials, and new Microcircuit Materials offerings.

Dynatronix, Inc.

1878

462 Griffin Blvd Amery, WI 54001 Phone: +1 715-268-8118 sales@dynatronix.com Web: www.dynatronix.com David Osero, VP of Sales +1 715-268-5340, dosero@dynatronix.com Mark Thede, South Central Region Manager +1 715-268-5344, mthede@dynatronix.com POWER SUPPLIES!! Dynatronix Pulse, Pulse Reverse and DC power supplies are the most advanced power supplies available in the metal finishing industry today. Dynatronix is excited to be introducing our new LT Series 36kw DC power supplies at the show in Las Vegas this year. With output available up to 18 volts at 2,000 amps, it is truly an amazing piece of equipment. Stop by and see the new LT Series 36kw DC power supply, you won’t be disappointed! You can find us at booth #1878.

Eastman Kodak Company

1224

343 State Street Rochester, NY 14650-0505 Phone: +1 800-698-3324 pcbproducts@kodak.com Web: www.kodak.com/go/pcb Kristen Rush, WW Marketing & Operations Manager +1 585-724-7861, kristen.rush@kodak.com Kodak showcases their extensive portfolio of PCB imaging products, designed specifically for PCB fabrication. Kodak PCB films feature unmatched dimensional stability, superior durability and scratch resistance and a permanent anti-static coating — giving you the ability to produce high yields and low defect rates.

IPC APEX EXPO™

ECD - Electronic Controls Design, Inc. 1361 4287 S.E. International Way Milwaukie, OR 97222 Phone: +1 503-659-6100 ecd@ecd.com Web: www.ecd.com Grant Peterson, VP Sales & Marketing +1 503-659-6100, grant.peterson@ecd.com Rex Breunsbach, President +1 503-659-6100, rex.breunsbach@ecd.com ECD offers the broadest product line for thermal profile planning, board profiling, machine verification (wave/reflow) & continuous thermal monitoring in the electronics manufacturing industry. ECD’s legacy of innovation continues with MEGAM.O.L.E. 20 thermal profiler: thinnest on the market, 20 channels, patentpending “nano-connector” thermocouple technology, one-touch “ok” button for go/no-go decision.

ECI Technology

831

ECO Design Magazine

BIN

60 Gordon Drive Totowa, NJ 07512 Phone: +1 973-890-1114 info@ecitechnology.com Web: www.ecitechnology.com Michael Schneider, Sales Manager - Metrology & Process Equipment +1 973-890-1114, mschneider@ecitechnology.com Ted Myers, Sales Manager +1 973-890-1114, tmyers@ecitechnology.com ECI Technology, world leading supplier of Chemical Monitoring Systems, presents the QualiLab bench-top analyzer. Based on CVS, Titration, and Spectroscopy techniques, QualiLab ensures success of PCB plating processes, including Via filling and through-hole metallization. Tecnoservizi Via Cremosano, 4A Milano, 20148 Italy Phone: +39 02 9520799 armando.zecchi@tin.it

EFD, Inc. A Nordson Company

1641

40 Catamore Boulevard East Providence, RI 02914 Phone: +1 401-431-7000 info@efd-inc.com Web: www.efd-inc.com EFD,Inc. A Nordson Company (now known as Nordson EFD LCC) is a leading manufacturer of high-quality solder paste and precision dispensing systems. Nordson EFD Solder is ISO9001 certified and offers a comprehensive line of printing and dispensing solder pastes for improving yields and reducing costs in electronics and electro-mechanical assembly processes. We provide applicationbased solder products, complete paste dispensing solutions and develop supportive technical partnerships with our customers. Nordson EFD precision dispensing systems apply controlled amounts of all types of assembly fluids used in most manufacturing processes. Products: benchtop dispensers, precision valves, XYZ robots, and dispensing components. New Product

EIPC

213

Bourgognestraat 16 Maastricht, NL 6221 BX The Netherlands Phone: +31 43 344 0872 sderhaag@eipc.org Web: www.eipc.org The European Institute of Printed Circuits (EIPC), based in The Netherlands, is an international service provider to the European Interconnection and Packaging Industry. Since 1968, the EIPC is servicing about 110 member companies, including suppliers of machinery and materials to the PCB industry, PCB Manufacturers, contract electronics manufacturers and OEM’s. The EIPC is a network of PCB professionals providing platforms to exchange business and technology information for the success of the European electronics industry.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. ELANTAS PDG, Inc.

567

5200 North Second Street St. Louis, MO 63147 Phone: +1 314-621-5700 x748 Web: www.elantas.com/pdg Carla Russo, Sales & Marketing Director +1 314-622-8748, carla.russo@altana.com Jim Stockhausen, Business Development Manager +1 314-621-5700 X729, jim.stockhausen@altana.com A premier global manufacturer of a wide range of liquid electrical insulation products including potting compounds, conformal coatings, adhesives, specialty epoxy products used in hi-temp applications and insulating resins offering heat, chemical, shock, and moisture resistance as well as good thermal conductivity and dielectric protection. The Epoxylite®, ELAN-Tron®, ELAN-Cast®, Pedigree®, and Sterling® brands are used for coating, sealing and potting electronic components, sensors, PCBs and other applications. Registered ISO 9001:2000 and ISO/TS 16949:2002-SecondEd.

Electra Polymers Ltd.

906

Roughway Mill Tonbridge, Kent, TN11 9SG United Kingdom Phone: +44 1732 811 118 USA@electrapolymers.com Web: www.electrapolymers.com Shaun Tibbals, Sales Director +44 (0) 1732 811118, shaun.tibbals@electrapolymers.com Chris Wall, Technical Director +44 (0) 1732 811118, chris.wall@electrapolymers.com Electra is a leader in the development and manufacture of advanced resists & coatings for the global Electronics industry: Conventional & LDI Photoimageable Soldermasks, Photoimageable Flex-Coverlay, Polymer Thick Film materials for surface and embedded applications, automotive dielectrics, 100% solids holeplug & Peelable masks formulated for lead-free solder processes. For close to 20 years Electra has been a major supplier of PWB soldermask inks to the North American market and are pleased to announce increasing market share with our latest high performance EMP110 LPI soldermask range formulated for exceptional yields in all final finishes with simple trouble-free processing.

Electro-Comp Services, Inc.

351

3634 131st Avenue Clearwater, FL 33762 Phone: +1 727-532-4262 Web: www.electro-comp.com Michael Render, VP/GM +1 727-532-4262, mrender@electro-comp.com We are an ISO 9001:2000 value added company specializing in Components Authentication, Testing, Programming, Tinning, Turn Key Materials, Component Procurement and Tape & Reel of all package types.

Electrolube

2459

7101 Adams, Suite 8 Willowbrook, IL 60527 Phone: +1 630 323 5100 info@hkw.us.com Web: www.electrolube.us.com John Bova, Business Development Consultant +1 518-482-4521, john.bova@hkw.us.com Amy Van Ollefen, Sales & Technical Co-Ordinator +1 630-323-5100, amy.vanollefen@hkw.us.com Electrolube, a division of H K Wentworth Limited, is a leading manufacturer of electro-chemicals for electronics, automotive and industrial manufacturing. Electrolube specializes in Conformal Coatings, Resins, Contact Lubricants, Thermal Management, Cleaners and service and maintenance products. New Product

Electronic Components World 3, Inishkeen Kilcoole, Co. Wicklow, Ireland Phone: +353 (0)86 2485842 donal@blackdotpublishing.com

Supporter

Electronic Production World 3, Inishkeen Kilcoole, Co. Wicklow Ireland Phone: +353 (0)86 2485842 donal@blackdotpublishing.com

Supporter

Electronics Assembly

BIN

Electronics Protection Magazine

BIN

EM ASIA

BIN

MMG Publishing Limited, MMG House Connors Yard, Beeches Road, Crowborough East Sussex, TN6 2AH United Kingdom Phone: +44 01892 613400 mark.leary@mmgpublishing.co.uk

7355 East Orchard Road, Suite 100 Greenwood Village, CO 80111 Phone: +1 720-528-3770 Web: www.infowebcom.com Electronics Protection is a product and service news tabloid edited for OEM design engineers and product development professionals of electrical, electronic, commercial, medical, consumer and industrial products and equipment; and for managers and integrators of highly sensitive equipment who utilize equipment protection technologies and testing. 51 Changi Business Park Central 2 #07-01 The Signature Singapore, 486066 Singapore Phone: +65 6789 8800 info@rbi-asia.com Web: www.emasiamag.com June Tan, Publisher +65 6780 4304, june.tan@rbi-asia.com Electronics Manufacturing (EM) Asia is the primary source of information for industry professionals who design, assemble and test printed circuit board (PCB) assemblies in Asia. It is the premier publication in the region targeted at contract manufacturers (EMS/ODMs), OEMS, and at vendors, suppliers and distributors who want to remain informed on the latest developments and technologies in the SMT and electronic packaging/interconnect industries. Published in both English and Chinese editions, EM Asia reaches 21,000 qualified recipients in Asia.

EMCHINA

Supporter

EMT Worldwide

Supporter

16 Jianguomenwai Blvd., #511 Tower One Chaoyang District Beijing, 100022 China Phone: +86 10135 013836 75 Web: www.emchina.org.cn EMCHINA (www.emchina.org.cn), China’s principal digital media network dedicated to the electronic manufacturing industry, in collaboration with CBC Consulting, specializes in providing e-media, marketing consulting and public relation services to companies doing business in Chinese electronic industry. These services include market research, technologies and products validation, identifying partner, PR and webinar, email broadcast and database rental.

IML Group plc Blair House, High Street Tonbridge, Kent, TN9 1BQ United Kingdom Phone: +44 0 1732 359990 tim.fryer@imlgroup.co.uk Web: www.EMTWorldWide.com EMTWorldWide is a new approach to online publishing. The newsletter is delivered, free, weekly and contains the best news along with original comments from global correspondents. The newsletter is backed by a website packed with reference information, including ‘The ShortList’ — a unique buyers guide containing over 30,000 items of data.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Equipment Technologies, Inc.

741

19 Park Avenue Hudson, NH 03051 Phone: +1 603-881-5253 info@equiptech.com Web: www.equiptech.com Jon Pelletier, President +1 603-881-5253, jon@equiptech.com Eric Winkler, Vice President, Int’l Sales & Marketing +1 603-881-5253, eric@equiptech.com Equipment Technologies, Inc. (ETI) is the oldest and largest supplier of high quality second-hand rebuilt PCB fabricating equipment. We offer support worldwide through our sales and service teams on the US East and West coasts, Guangzhou, China and our European office in Germany. Installation, technical support, spare parts, shipping, crating and warranties are available. 100% money back guarantee. ETI offers certified AMEA appraisal services. ETI handles liquidations of all pcb equipment. 28 years of exceptional service to the PCB industry.

ERSA North America

625

1779 Pilgrim Road Plymouth, WI 53073 Phone: +1 920-893-3772 Web: www.ersanorthamerica.com Sebastian Schmidt, President & CEO +1 920-892-9248, sebastian.schmidt@kna.net Theresa Allee, Sales Coordinator +1 920-892-9267, theresa.allee@kna.net A complete line of lead free hand soldering tools, including the powerful i-con series, maker of the new hybrid series, complete line of solder rework stations, a complete range of Hotflow reflow soldering ovens, lead free wave soldering machines for low to high volume production requirements, and the Versaflow line of selective soldering systems. ERSA has expanded its product range by screen printers for solder paste applications on the PCBs with 100% in line inspection.

ESSEMTEC

1259

816 North Delsea Drive, # 308 Glassboro, NJ 08028 Phone: +1 856-218-1131 sales@essemtec-usa.com Web: www.essemtec.com Steve Pollock, General Manager +1 856-218-1131, sales@essemtec-usa.com Essemtec is a world-leading provider of specialized production equipment for the low to midsize surface mount technology market. The combination of fine engineering in hardware and software with proven Swiss Quality production enables the company to manufacture machines that are widely introduced today throughout the world market. New Product

Europlacer North America

2259

2521 Schieffelin Road, Suite 102 Apex, NC 27502 Phone: +1 919-362-8623 sales@europlacer-na.com Web: www.europlacer.com John Perrotta, Vice President +1 267-884-6760, john.perrotta@europlacer-na.com David Fenton, Technical Services Manager +1 919-362-8623 x115, david.fenton@europlacer-na.com Europlacer designs and manufactures a comprehensive range of highly flexible SMT placement systems for the global electronics industry. Europlacer North America attributes its strong growth to a commitment to its core values of customer-driven product innovation and genuine integrity in all its business activities. New Product Conference Bag Sponsor

IPC APEX EXPO™

Everett Charles Technologies

1782

700 East Harrison Avenue Pomona, CA 91767 Phone: +1 909-625-5551 Web: www.ectinfo.com Brian Crisp, Regional Sales Manager - Contact Products Division +1 909-273-7111, brian.crisp@ectinfo.com Tom Merline, Regional Sales Manager - Fixture and Services Division +1 949-278-8715, tom.merline@ectinfo.com New Product

Excellon Automation

718

Exopack Advanced Coatings

337

20001 S. Rancho Way Rancho Dominguez, CA 90220 Phone: +1 310-668-7700 sales@excellon.com Web: www.excellon.com Excellon Automation, features high-technology mechanical and laser equipment. Advanced CNC depth-control techniques allow high precision microvia and blind via drilling of High Density Interconnect (HDI) PCB. Excellon’s hybrid laser technology (UV and CO²) is most flexible for blind via drilling, cutting/routing and micro-machining/repair applications. 700 Crestdale Street Matthews, NC 28105 Phone: +44 1978 660241 gwen.simms@exopack.com Web: www.exopackadvancedcoatings.com Complex coatings for high-performance electronic components including: Phototool & Artwork Protect Film, Conductive Electrodes, Interactive White Boards, Current Collectors, Photoresist and Special Adhesives.

FASTechnologies, Corp.

1242

FCT Assembly

2317

FEASA

1483

9 Hickory Irvine, CA 92614 Phone: +1 949-551-4135 sales@fastec.com Web: www.fastechnologies.com Ofer Ton, President +1 949.551.4135, ofer@fastec.com Steve Wester, VP Applications +1 763.263.0611, steve@fastec.com FASTechnologies specialized in custom solutions to drill and rout applications. Our products include the DNC UltraServer, NC-CAM Rout and Drill, SmartParts Classics, monitoring and Cassetting. We are the PWB Drill & Rout experts. If you have drill or rout issue call us. 1309 North 17th Avenue Greeley, CO 80631 Phone: +1 970-346-8002 Web: www.fctassembly.com FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil, and A-Laser. With numerous facilities in the United States, we are one of the electronics industry’s leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts. New Product National Technology Park Castletroy, Limerick Ireland Phone: +353 61 330333 sales@feasa.ie Web: www.feasa.ie

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Finetech

2228

8380 South Kyrene, #110 Tempe, AZ 85284 Phone: +1 480-893-1630 sales@finetechusa.com Web: www.finetechusa.com Robert Avila, Western Regional Manager +1 480-893-1630, robert@finetechusa.com Neil O’Brien, Director of Sales +1 603-627-8989, neil@finetechusa.com Finetech’s advanced rework systems and precision bonders offer industry-leading machine specifications and in-depth process expertise. The new cost-effective FINEPLACER Core will be demonstrated for the first time in the US. Rework systems for today’s challenging applications: 01005s, BGAs, POP, head-inpillow, memory devices, reballing and more. Manual & automated bonders with placement accuracy down to ±0.5 micron for IC’s, opto, MEMs, flip chip. New Product

Fisnar Inc.

1529

15 Corporate Drive, Suite E Wayne, NJ 07470 Phone: +1 201-796-1477 info@fisnar.com Web: www.fisnar.com Vladimir Siroky, Director of Operations +1 201-796-1477, vsiroky@fisnar.com Stephen Kohnle, Sales Manager +1 201-796-1477, skohnle@fisnar.com Manufacturer and supplier of automation systems, robots, valve, single part and dual part dispensing including precise fluid dispensing technologies for electronic, pharmaceutical, medical and aeronautic industries. New Product

FKN Systek, Inc.

1537

86 Kendall Avenue Framingham, MA 01702 Phone: +1 508-935-2282 fkn@fknsystek.com Web: www.fknsystek.com Klaus Heimann, President +1 508-935-2282 Werner Christ, Sales Manager +1 508-935-2262 FKN Systek designs and manufactures tools and equipment for the electronics industry. We supply a full line of depaneling equipment used for singulating fully loaded pre-scored and tab routed Printed Circuit Cards. This includes PLC controlled multi-blade saws, bench top routers, punches and automated and hand operated circular blade depanelizers for pre-scored boards. We also provide PCB racks and trays for in process board storage.

FlexLink Systems, Inc.

877

6580 Snowdrift Road Allentown, PA 18106 Phone: +1 610-973-8200 us1.marketing@flexlink.com Web: www.flexlink.com Based on our unique application experience and global network, FlexLink provides innovative, profitable, and quality automation solutions to demanding world-leading customers. FlexLink’s specialty is Production Logistics, defined as ensuring that each machine and workstation is fed with the right product, quantity, and quality at the right time. The solution considers intelligent value adding processes and elimination of non-value adding ones. We offer custom solutions, standard modules, and software that allows for efficient, variable, and progressive production flow throughout the assembly, testing, and packaging process. New Product

FocalSpot, Inc.

2035

9915 Businesspark Avenue, Suite A San Diego, CA 92131-1130 Phone: +1 858-536-5050 sales@focalspot.com Web: www.focalspot.com Frank Silva, Vice President, Sales +1 858-536-5050 x 111, fsilva@focalspot.com Fred Schlieper, President/CEO +1 858-536-5050 x 112, fschlieper@focalspot.com FocalSpot, Inc. is a provider of affordable high-quality BGA/SMT inspection and rework solutions to the SMT electronics assembly, IC Assembly and the Industrial/Automotive/Medical Assembly manufacturing industry worldwide. New Product

Free Forums

2400

Join industry experts and peers as they discuss challenges & cutting-edge solutions in these free interactive sessions. See page 23 for more information. Test & Inspection Summit Tuesday, April 6, 1:30 pm–3:00 pm Military Roadmap Tuesday, April 6, 3:15 pm–4:45 pm Changing Environment of Printed Circuit Board Technology and the Evolution of Safety Wednesday, April 7, 1:30 pm–3:00 pm Solar Panels: New Opportunities for Electronics Wednesday, April 7, 10:30 am–12:00 pm IPC Technology Roadmap Wednesday, April 7, 3:15 pm–4:45 pm Don’t Be Surprised by the New RoHS Thursday, April 8, 10:30 am–12:00 pm

Front Panel Express LLC

2435

5959 Corson Avenue, Suite I Seattle, WA 98108 Phone: +1 206-768-0602 info@frontpanelexpress.com Web: www.frontpanelexpress.com/en/news/home.html Front Panel Express, LLC is your supplier for custom-designed front panels and enclosures for electronic equipment. We manufacture front panels and enclosures based on your design by using modern CNC technology. In conjunction with our free design and ordering software, Front Panel Designer, we offer an easy all-in-one solution for reasonably priced custom-designed front panels. If you are looking for a high quality front panel or enclosure to finish your prototype, production run or electronic project, Front Panel Express is the right choice for you.

Fuji America Corporation

659

171 Corporate Woods Parkway Vernon Hills, IL 60061 Phone: +1 847-913-0162 scottw@fujiamerica.com Web: www.fujiamerica.com Scott Wischoffer, Marketing Manager +1 847-821-2405, scottw@fujiamerica.com Fuji will show the newest developments in the NXT-II modular placement system including the new V-12 28k chip placement head and the M6SP 10 micron accuracy assembly module for bare die placement. We will also show the XPF-W Large Board single machine solution, and the Newest GPX Printer. FujiTrax line control software and component verification system will also be demonstrated.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Gardien Services USA Inc. 5289 NE Elam Young Parkway Hillsboro, OR 97124 Phone: +1 877-257-6433 Info@gardien.com Web: www.gardien.com

840

GE Sensing & Inspection Technologies 2329 50 Industrial Park Road Lewistown, PA 17044 Phone: +1 661-242-1967 david.lehmann@ge.com Web: www.geinspectiontechnologies.com

Generon IGS

1646

16250 Tomball Parkway Houston, TX 77086 Phone: +1 713-937-9204 Web: www.igs-global.com Thomas Roland, Sales Manager +1 713-937-5204, troland@generon.com Ross Cicero, Sales Manager +1 713-937-5257, rcicero@generon.com Generon IGS is a technology company specializing in the manufacturing of Nitrogen and Oxygen PSA’s and membrane systems, Instrument quality air packages, and Compression systems. Generon has 75 patents that backup these technologies.

Glenbrook Technologies, Inc.

559

Glenbrook Technologies 11 Emery Avenue Randolph, NJ 07869 Phone: +1 973-361-8866 Web: www.glenbrooktech.com Steven Zweig, Vice President, Sales +1 973-361-8866 x104, szweig@glenbrooktech.com Glenbrook Technologies, the leading worldwide supplier of x-ray systems to the pcb fabrication and pcb assembly markets, will be demonstrating our line of affordable, high performance real time x-ray inspection systems. We are pleased to introduce programmable motion control as an option to many of our systems. Glenbrook has over 1,600 installations in 45 countries throughout the world.

Global Laminates, Inc. 179 Ward Hill Avenue Ward Hill, MA 01835 Phone: +1 978-521-9700 Web: www.globallaminates.com

Global PCB Marketplace Rm 909, Meicum Building, Sham Mei Lim, Fution Shenzhen, Guangdong, China Phone: +86 755 8331 0984 globalpcb@126.com

Global SMT & Packaging

517

900

2237

15 Crooked Lane Naples, FL 34112 Phone: +1 603-617-4939 news@globalsmt.net Web: www.globalsmt.net Trevor Galbraith, Editor-in-Chief +1 239-784-7208, editor@globalsmt.net Lino D’Andreti, VP Sales - Americas +1 603-918-8579, ldandreti@globalsmt.net Global SMT & Packaging contains authoritative technical articles on practical issues affecting SMT assembly and packaging. Visit our stand and collect your free copy. Distributed globally, it has a separate print and electronic circulation to the US, Europe, China and Korea, enabling companies to target their advertising to regionally or globally. Global SMT & Packaging also produces a weekly video news program.

IPC APEX EXPO™

GOEPEL Electronics

624

Gordon Brush Mfg. Co., Inc.

621

9737 Great Hills Trail, 170 Austin, TX 78759 Phone: +1 512-782-2500 Web: www.goepelusa.com Jim O’Leary, Director North American Sales sales@goepelusa.com GOEPEL Electronics offers award-winning JTAG/Boundary Scan software (SYSTEM CASCON) and hardware (SCANFLEX), revolutionary JTAG based Emulation tools (VarioTAP), Automated Optical and X-Ray Inspection systems, and a variety of services.

6247 Randolph Street Commerce, CA 90040-3514 Phone: +1 323-724-7777 sales@gordonbrush.com Web: www.gordonbrush.com Arcie Lockett, Accounts Representative +1 323-724-7777 x280, arcie@gordonbrush.com Mitch Benner, Sales and Marketing Director +1 323-724-7777 x250, mitch@gordonbrush.com Gordon Brush manufactures over 5,000 stock and custom brush styles for the ESD, manufacturing, and aerospace industries. We expanded our line of stock brushes and are affiliated with Milwaukee Dustless Brush, a leader in the janitorial marketplace, and JEK, a leader in the printed circuit board conditioning industry.

GPD Global

1459

611 Hollingsworth St. Grand Junction, CO 81505 Phone: +1 970-245-0408 request@gpd-global.com Web: www.gpd-global.com Christian Vega, Worldwide Sales Manager +1 970-245-0408, cvega@gpd-global.com Sven Wedekin, VP/GM +1 970-245-0408, sven@gpd-global.com Manufacturer of automated fluid-dispensing systems for adhesives, solderpaste, soldermask, conductive and nonconductive materials, glob-top, underfill and dam/fill. Other products include axial and radial lead-formers and SMT Tape Peel Back Force Tester.

Guangdong Shengyi Sci. Tech. Co., Ltd. 1048 2143 N. Glassell Street Orange, CA 92865 Phone: +1 714-921-1132 Web: www.paramount-usa.com

Heller Industries

1747

4 Vreeland Road Florham Park, NJ 07932 Phone: +1 973-377-6800 info@hellerindustries.com Web: www.hellerindustries.com Marc Peo, President MK3.5 model with the lowest Nitrogen and electrical consumption! NEW Flux Separation System provides Maintenance Free operation with Self Cleaning mode maximizes up-time and generates more revenue! 100% Forced Convection Reflow Soldering and Curing systems are Lead Free compliant and provides the best Delta T and lowest cost of ownership available.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Henkel Corporation

2159

HEPCO, Inc.

1546

15350 Barranca Parkway Irvine, CA 92618 Phone: +1 949-789-2500 Web: www.henkel.com/electronics Doug Dixon, Global Marketing Director +1 949-789-2500, doug.dixon@us.henkel.com Jocelyne Bricker, Marketing Specialist +1 626-923-1210, jocelyne.bricker@us.henkel.com Henkel’s leading brands of Acheson®, Hysol®, Loctite® and Multicore® have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, traditional tin-lead and high performance lead-free solder solutions as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance. New Product 150 San Lazaro Avenue Sunnyvale, CA 94086 Phone: +1 408-738-1880 info@hepcoblue.com Web: www.hepcoblue.com Bill Manfroy, Sales Manager +1 408-738-1880, info@hepcoblue.com Tim Hoffman, President +1 408-738-1880, tim@hepcoblue.com BGA Sphere placement equipment and supplies; Lead Cutting and Forming equipment for axial components, transistors, capacitors, DIPs, SIPs, crystal oscillators and LEDs. Able to process parts from tape and reel, tube, card or bulk; PCB depaneling machines for routed PCBs.

Heraeus

2143

24 Union Hill Road West Conshohocken, PA 19428 Phone: +1 610-825-6050 customerservice.hcd@heraeus.com Web: www.4CMD.com Frank Murch, Director of Sales & Marketing +1 610-825-6050 x235, Frank.Murch@heraeus.com Steve.Ratner, Sales Manager - Assembly Materials +1 949-525-2990, steve.ratner@heraeus.com Heraeus Materials Technology, LLC is part of Heraeus, the precious metals and technology group with headquarters in Hanau, a globally active, family-owned company with business areas that include precious metals, sensors, dental and medical products, quartz glass and specialty lighting sources. With a business volume of over 10 billion and more than 11,000 employees in over 100 companies worldwide, Heraeus has been an internationally recognized specialist in materials and precious metals for more than 150 years. Heraeus Materials Technology is one of the world’s leaders in materials used to manufacture highperformance circuitry, semiconductors and surface mount assemblies.

Hesse & Knipps

2129

2305 Paragon Drive San Jose, CA 95131 Phone: +1 484-665-0219 Web: www.hesse-knipps.us Automatic wedge, thin and heavy aluminum and gold wire and ribbon bonders; integrated pull and shear test; advanced setup; NEW PiQC Process-integrated Quality Control system utilizes real production data to alert users in real time of questionable bonds due to deteriorating wedges, bad sections of wire, or possibly contaminated devices.

HIROX-USA, Inc.

450

1060 Main Street River Edge, NJ 07661 Phone: +1 201-342-2600 info@hirox-usa.com Web: www.hirox-usa.com Hideyuki Masui, General Manager +1 201-342-2600, masui@hirox-usa.com Yasuo Monno, Sales +1 510-489-2500, monno@hirox-usa.com The KH-7700 Ver. 2.0 Digital Microscope System is HIROX’s newest most advanced development. The digital camera, light source, LCD monitor, computer and software are all integrated into this one unit. The KH-7700 provides the user with the ultimate in high performance observation, measurement, analysis, recording, management, and output. The Hirox Digital Microscope System also offers such unique features as magnification up to 7000x and the 3D rotary head adapter, for 360 degree inspection. Hirox is also the pioneer of the ACS function, which displays and updates the magnification on the screen as the lens is zoomed in and out. New Product

Hitachi High Technologies America

1337

Hitachi Via Mechanics (USA), Inc.

1237

1375 N. 28th Avenue Dallas, TX 75261 Phone: +1 972-998-2699 Web: www.hitachi-hta.com Hitachi HTA, a world leading manufacturer of SMT placement equipment will be exhibiting our high speed modular GXH-3 and GXH-3J platforms with a component range of 0201 (01005) up to 55x55/100x26 mm and through-put up to 95,000cph. In addition we will also exhibit our PHX high speed screen printer. 2325 Paragon Drive, Suite 10 San Jose, CA 95131 Phone: +1 408-392-9650 Web: www.hitachi-via-usa.com Sam Sekine, President +1 408-392-9650, sam.sekine@hitachi-via-usa.com Jenny Tran, Vice President of Enginering +1 408-392-9650 x215, tjenny@hitachi-via-usa.com Hitachi Via Mechanics is your manufacturing solution. Offering the most advanced mechanical drilling and routing sytems, as well as industry leading laser drills. From the ultra fine line DE digital direct exposure artwork generation to our HA hole analyzer with blind via capability, we Inspire the Next.

HIWIN Corporation

930

1400 Madeline Lane Elgin, IL 60124 Phone: +1 847-827-2270 info@hiwin.com Web: www.hiwin.com Roxanna Rosca, Marketing +1 630-883-4295, tradeshows@hiwin.com Hiwin manufactures an extensive line of both linear motion components and complete solutions. With a goal of supplying superior quality at the most competitive prices, Hiwin offers a variety of precision ground and rolled ballscrews, linear guideways, electric actuators, ballscrew-driven stages and linear motors, with many fully integrated value-added features.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Hong Kong Printed Circuit Association (HKPCA)

219

Rm. 2107, Corporation Park 11 On Lai Street Shatin, N.T. Hong Kong Phone: +852 2155 5123 secretary@hkpca.org Web: www.hkpca.org Manda Wong, Admin Officer +852 21555099, mandawong@hkpca.org Hong Kong Printed Circuit Association Limited (HKPCA), established in year 2000, is a Hong Kong based trade association dedicated to promote and protect the right and interests of its member companies in the printed circuit industry. As the number of PCB manufacturers in China continues to grow, HKPCA supports and organizes technical and business seminars, training, conferences and exhibitions in Hong Kong and Mainland China to help its members and other industry players to sustain their growth.

1086 Whirlaway El Paso, TX 79936 Phone: +1 915-929-0033 Web: www.ibl-tech.com Jochen Lipp, CEO +1 915 929 0033, j.lipp@ibl-tech.com Reyna Mora, Executive Administrative Assistant +1 915-929-0355, r.mora@ibl-tech.com IBL was founded in1985 and has been working in the soft-soldering sector of electronics since then. They began to develop their own new systems technology for vapour phase soldering during the introduction of SMD-techniques in the manufacture of assemblies. This early entry enabled IBL to develop an enormous amount of know-how and convincing innovative strengths. That has been documented by more than 30 national and international patents and recognised by a special award from the Bavarian State Government. IBL has pioneered vapour phase systems technology and is the world leader in Vapour Phase Soldering Machine Technology. New Product

HumiSeal - Chase Specialty Coatings

410

ICAPE

210 Zeta Drive Pittsburgh, PA 15238 Phone: +1 412-828-1500 sales@humiseal.com Web: www.humiseal.com Jerry Donahue, Sales Manager, the Americas +1 412-406-5542, jdonahue@humiseal.com Phil Kinner, HumiSeal Business Director pkinner@chasecorp.com With over 50 years of expertise HumiSeal is the World’s Leading Manufacturer of Conformal Coatings! We offer a complete line of Coatings, Thinners, Strippers, Cleaners and Masking materials to fit all your Conformal Coating requirements. Through our extensive network of Distributors, Representatives and Global Partners HumiSeal’s full product line is available globally!

I Source Technical Services, Inc.

1525

5 Rancho Circle Lake Forest, CA 92630 Phone: +1 949-453-1500 incoming@i-source.com Web: www.i-source.com Jerry Cabello, Sales Engineer +1 949-283-7460, jerry@i-source.com David Tuza, General Manager +1 949-453-1500, david@i-source.com SMT Stencils, Multi-Level step up and down, epoxy stencils. Mini, Micro and BGA Rework Stencils. ISO 9001-2000 certified. in-house fixture and pallet design & Mfg. Locations in USA and Mexico. I-Source is the Premier stencil manufacturer in USA and Latin America.

IBE SMT Equipment

664

318 Corporate Woods Drive Magnolia, TX 77354 Phone: +1 800-353-6942 sales@ibesmt.com Web: www.ibesmt.com Steve Hakes, Sales/Administration +1 281-259-9660, steve.hakes@ibesmt.com Jared Garver, Sales/Technical +1 281-259-9660, jared.garver@ibesmt.com For over a decade IBE SMT Equipment has provided quality SMT equipment and service to our valued customers around the world. Whether buying or selling, IBE SMT Equipment has the resources and reputation to create a solution that is right for you.

IPC APEX EXPO™

IBL Technologies LLC

2311

676

31 rue des Jeuneurs Paris, 75002 France Phone: +86 769 85076770 leon.chen@icape.cn Web: www.icape.cn ICAPE is an international trading company specializing in printed circuit boards.

I-Connect007

1621

IMAPS

2240

P.O. Box 50 Seaside, OR 97138 Phone: +1 916-608-0668 Web: www.iconnect007.com Barb Hockaday +1 916-608-0660, barb@iconnect007.com Marcy LaRont +1 480-280-5229, marcy@iconnect007.com I-Connect007 covers the entire electronics manufacturing supply chain with its family of global online magazines: PCB007, EMS007, PCBDesign007, Flex007 and MilAero007. I-Connect007 also publishes three Mandarin online magazines (PCBDesign007 China, EMS007 China and PCB007 China). Our magazines have produced over 3,300 videos and published over 40,000 articles since 1999. Our various e-newsletters reach over 38,000 industry in-boxes every week. Find out more about I-Connect007 and its comprehensive information network at Booth 1621 (our Real Time with...IPC APEX EXPO studio). While you’re there, subscribe to any of our newsletters. 611 - 2nd Street, N.E. Washington, DC 20002 Phone: +1 202-548-8717 Web: www.imaps.org The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS has 23 North American and 21 international chapters.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Indium Corporation

441

34 Robinson Road Clinton, NY 13323 Phone: +1 315-853-4900 askus@indium.com Web: www.indium.com Patrick Ryan, Continental Sales Manager +1 315-853-4900 x7581, pryan@indium.com Tim Jensen, Product Manager +1 315-853-4900, tjensen@indium.com Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, performs and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. New Product

Industrial & Specialty Printing 11262 Cornell Park Drive Cincinnati, OH 45242

Ingun Pruefmittelbau GmbH

BIN 2319

Max-Stromeyer-Strasse 162 Konstanz, 78467 Germany Phone: +49 7531 8105 62 silke.maier@ingun.com Web: www.ingun.com Since 1971 INGUN is the reliable partner for innovative technology in the field of Test Equipment and for well thought-through testing strategies. INGUN offers an extensive range of Test Probes, RF-Probes, Test Fixtures and for individual testing tasks and is a globally active company with its headquarters in Konstanz/ Germany and over 40 Agencies worldwide.

Inovaxe Corporation

658

1570 Global Court Sarasota, FL 34240 Phone: +1 941-379-5954 Web: www.inovaxe.com Ron Wrable, Regional Sales Director +1 941-350-3457, ron_wrable@inovaxe.com Mary Huggins, Marketing/Sales Representative +1 941-379-5954, mary.huggins@inovaxe.com Inovaxe Corporation offers ambient and moisture sensitive component storage systems powered by web based software offerings to promote inventory control and visibility. The InoCart Storage Systems provide very dense, non-dedicated, flexible storage of component packages. The simple to use, but powerful software assures inventory accuracy and monitors to the “single package, single location level”. (SPSL) Applications range from traditional stockroom environment, kitting/component delivery process and control of WIP inventory located on the production floor. New Product

InsulFab PCB Tooling

1861

834 Hayne Street Spartanburg, SC 29305 Phone: +1 800-845-7599 sales@insulfab.com Web: www.insulfab.com Scott F. Cain, Global PCB Sales Manager +1 404-617-9899, scain@insulfab.com Charles (Chuck) O. Casey, VP of Sales +1 864-582-7506, ccasey@insulfab.com InsulFab PCB Tooling provides the highest quality custom tooling for all your process needs. We can assist in process improvement for every application including, SMT, wave, conformal coat, depaneling, press fit, vacuum and hand solder. We offer the quickest delivery times in the industry with 2 locations to better serve your needs. We are certified with both ISO and ITAR to assure your quality and security. Visit www.insulfabtools.com or booth 1861 for more information.

Integrated Ideas & Technologies, Inc.

448

Integrated Process Systems, Inc.

735

Interconnect Systems, Inc.

610

Intuitive & Cimnet Systems, Consona ERP Solutions

1325

6164 W. Seltice Way Post Falls, ID 83854 Phone: +1 208-262-7200 Web: www.integratedideas.com Stephanie Henninger, Director of Technical Services & Marketing +1 208-262-7200, steph@integratedideas.com Sharon Irvine, Director of Sales +1 208-262-7200, sharon@integratedideas.com IIT, Inc. is an industry leader in laser cut SMT stencils. In addition, IIT Metal Fabrication Division manufactures steel, sheet metal enclosures, and machined products.

2183 West Park Avenue Cedar City, UT 84720 Phone: +1 435-586-1188 parts@ips-vcm.com Web: www.ips-vcm.com Mike Brask, President +1 435-586-1188, mbrask@sisna.com Ian Rosenberg, Vice President, Sales & Marketing +1 714-333-8544, isr4u@sbcglobal.com Manufacturers of horizontal and vertical conveyorized wet process equipment. Manufacturers of automatic and manual plating equipment for electrolis and electrolytic plating processes. Suppliers of WWTP equipment and fume scrubbers. Manufacturers of table top wet process equipment.

759 Flynn Road Camarillo, CA 93012 Phone: +1 805-482-2870 info@isipkg.com Web: www.isipkg.com Mike Laskey, Sales Manager +1 805-482-2870, mike.laskey@isipkg.com ISI specializes in high density module packaging and advanced system-level interconnect. ISI offers design, qualification & testing coupled with fully integrated in-house manufacturing. Capabilities include: high density PCB design, fine pitch SMT, flip chip, wirebond assembly, IC packaging, custom molding, overmolding and automated optical inspection.

901 Warrenville Road, Suite 400 Lisle, IL 60532 Phone: +1 800-245-1246 info@cim-sys.com Web: www.cim-sys.com Stevie Hay, Project Managerm, Cimnet Systems’ Paradigm +1 630-512-8361, Stevie.Hay@consona.com Iain Wilson, Product Manager, Cimnet Systems’ Engenix +1 630-512-8369, iain.wilson@consona.com Consona ERP, is a division of Consona Corporation — a worldwide leader in providing enterprise resource planning (ERP) and customer relationship management (CRM) software and services. Consona ERP includes two leading products that enable over 700 PCB and electronics customers to continuously improve their business processes. Cimnet Systems delivers a comprehensive family of PCB-specific ERP, engineering automation, sales quotation, manufacturing execution, and supply chain communication solutions, as well as outsourced CAM and sales quotation services. Intuitive ERP offers rich functionality for a broad range of electronics manufacturing environments and makes implementation easy for small to midsized companies.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. INVENTEC PERFORMANCE CHEMICALS 465 26, avenue du petit parc Vincennes, 94683 France Phone: +33 14398 7500 ameunier@inventec.dehon.com Web: www.inventec.dehon.com LAÜGT Anne-Marie, Electronic BU Director +33 1 49 83 53 00, amlaugt@inventec.dehon.com BADER Catherine, Electronic BU Sales Manager Europe +33 1 43 98 76 58, cbader@inventec.dehon.com INVENTEC, one of Europe’s leading Performance Chemicals companies, is the hig-tech industries business of the Dehon Group.h-tech industries business INVENTEC supplies these solutions to three markets: Electronic Assembly: Soldering, Adhesive, Cleaning and protection. Surfaces Technologies: Surface treatment, Insulation-Fire Protection, Products and equipment for the Wine industry, Low temperature sterilization Fine Chemicals: Aerosols Formulation, Foams expansion, Synthetic Chemicals and pharmaceuticals. New Product

IP Systems LLC

1859

IPC — Association Connecting Electronics Industries

2073

50-A Satellite Blvd. NW Suwanee, GA 30024 Phone: +1 770-614-7701 sales@ipsystemsusa.com Web: www.ipsystemsusa.com Karl Schuepstuhl, Director +1 770-614-7701, karls@ipsystemsusa.com Air purification equipment for the removal of solder fumes from solder irons, solder pots, reflow ovens, selective soldering, wave solder systems, and laser fumes. We manufacture exhaust arms, fume cabinets and filter units with airflow rates from 200cfm to 2000cfm.

3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015 Phone: +1 847-615-7100 info@ipc.org Web: www.ipc.org Denny McGuirk, President +1 847-597-2841, DennyMcGuirk@ipc.org Neal Bender, Director of Membership +1 847-597-2808, NealBender@ipc.org IPC is a global trade association serving 2700 member companies worldwide in the electronics assembly and printed board industries. Through the contributions of our members, IPC supports the industry with standards, education, training, market research, and environmental and government relations programs. IPC has offices in the U.S., China, Sweden and Russia. Visit the IPC bookstore and take advantage of special show prices on industry standards and publications and learn how membership can help your company. New Product

IPC Designers Council

2073

3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015 Phone: +1 847-615-7100 Web: dc.ipc.org Anne Marie Mulvihill, Manager, Designers Council +1 847-597-2827, AnneMarieMulvihill@ipc.org The IPC Designers Council is an international network of designers. Its mission is to promote printed board and printed board assembly design as a profession and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters. The Designers Council is a Council under IPC with its own set of membership benefits. Visit http://dc.ipc.org for more information.

IPC APEX EXPO™

Isola Group

847

3100 West Ray Road, Suite 301 Chandler, AZ 85226 Phone: +1 480-893-6527 info-usa@isola-group.com Web: www.isola-group.com Rich Pangier, Director OEM Marketing +1 651-406-9451, rich.pangier@isola-group.com Isola Group builds innovative substrate materials for manufacturing circuit boards including copper-clad laminates and prepregs. Isola has 11 production facilities worldwide. New Products: FR408HR for High Reliability and High Speed Digital Applications. IS680 for RF/ Microwave, High Speed Digital and Backplane Designs. IS415 High Reliability FR-4 Mid Dk Df product. Other Products include FR406, IS410, 370HR, FR408, IS620i, Polyimide - P95/ P96 and DE156 a mid-Tg Halogen Free material. Isola offers A11, FR406N (FR4) and P26N (polyimide). Isola is a licensed manufacturer of Buried Capacitance Products.

ITC Intercircuit

1137

21625 Grenada Avenue Lakeville, MN 55044 Phone: +1 952-469-2310 inquiry@itcintercircuit.com Web: www.itcintercircuit.com Hubertus Hein, Design Engineer + 49 89 4536 040, hubertushein@aol.com Greg Malcolm, Sales Manager +1 952-469-2310, greg@itcintercircuit.com ITC supplies the most up to date Hole Filling Equipment in the industry as well as spray coating systems, ovens & handling equipment. The THP35 Hole Filling Machine with new patented fill/vacuum heads can fill blind & via holes in ONE pass. Our service department in Germany, welcomes you with any and all test panels to put our equipment to the test. Please stop by and see why we are the #1 hole filling service in Europe.

Jevco International Inc.

313

JPCA-Japan Electronics Packaging & Circuits Association

215

915 26th Avenue NW, Building A Gig Harbor, WA 98335 Phone: +1 253-858-2605 Web: www.jevco.com

Kairo Kaikan 2F, 3-12-2 Nishiogikita Suginami-ku, Toyko, 167-0042 Japan Phone: +81 3 5310 2020 show@jpca.org Web: www.jpca.org Yoshiko Watabe, Sectino Chief +81 5310 2020, watabe@jpca.org JPCA was established in 1962 and became as a trade organization under the authorization by MITI in 1977. JPCA has been very active with support and cooperation of its member companies in the areas of technology, advancement, standardization, studies and researches, management, fair trading, international information exchange, technical seminars, work shops and JPCA Shows.

JTAG Technologies

2325

1006 Butterworth Court Stevensville, MD 21666 Phone: +1 877-367-5824 info@jtag.com Web: www.jtag.com Bryant Grand, North American Sales Manager +1 949-454-9040, bryant@jtag.com JTAG Technologies delivers Boundary-Scan testing and in-system programming (ISP) tools based on IEEE 1149.1, 1149.6 and related standards, providing access to complex surface-mount PCBs including BGAs. JTAG ProVision automates application development; JTAG Visualizer provides graphical control and observation. The tools support multi-chain, multi-board designs. ISP for NAND/ NOR flash, SPI, I2C, embedded flash, PLDs and FPGAs. Wide choice of production integration alternatives including ICT, MDA, flying probe and functional test. New this year is JTAG Live, the prototype debug tool geared specifically for high-density, tough-to-access PCBs. The Buzz app of JTAG Live is available for download at no charge at www.jtaglive.com. New Product

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Juki Automation Systems

1735

507 Airport Boulevard Morrisville, NC 27560 Phone: +1 919-460-0111 Web: www.jukiamericas.com Geron Ryden, Marketing Manager +1 919-460-0111, gryden@jas-smt.com Bob Black, President +1 919-460-0111, rjblack@jas-smt.com Juki manufactures high-quality SMT placement machines with over 22,000 systems installed worldwide. Stop by our booth and see the high-speed FX-3, KE3020 line featuring 22”x24” board size and new motor-driven electronic feeders, the new FX-2 chip-shooter, the KE2080 flexible placement system with an automated fluxer to that supports new dippable soldering techniques for easy and accurate placement of CSPs and µBGAs and the JX-100, a compact, economical placement system capable of efficiently building long, narrow LED board applications. For Selective Solder, we will exhibit the Flexsolder W510 that New Product supports dual nozzle capability.

KIC

1549

16120 West Bernardo Drive San Diego, CA 92127 Phone: +1 858-673-6050 Web: www.kicthermal.com Brian O’Leary, North American Sales Manager +1 408-964-0392, boleary@kicmail.com Bjorn Dahle, President +1 858-673-6050, bdahle@kicmail.com Visit our booth #1549, for a chance to win an Apple iPad, by beating KIC’s award winning prediction software, Navigator. Also stop by KIC’s booth to see its exciting new profiling tool that promises to not only get your process In-Spec and Stay In-Spec but make the task of profiling whole lot easier and even fun!

King Industries, Inc.

815

Koh Young Technology, Inc.

447

Science Road Norwalk, CT 06852 Phone: +1 203-866-5551 dmiller@kingindustries.com Web: www.kingindustries.com King Industries manufactures high purity, specialty chemicals used in a variety of electronic applications. Primary product types include: thermal acid generators, corrosion inhibitors, resin and rheology modifiers as well as numerous catalysts for a broad spectrum of systems. A pioneer in the development of catalysts for amino thermoset systems, King today offers non-tin, Hg-free catalysts for urethanes, catalysts for the thermal cure of epoxies and siloxane reactions. 15F Halla Sigma Valley 345-90 Gasan-dong, Geumcheon-gu Seoul, 153-802 Korea Phone: +82 2 6670 5000 kohyoung@kohyoung.com Web: www.kohyoung.com JD Shin, Senior Manager +82 2 6670 5000, info@kohyoung.com Bora Lee, Manager +82 2 6670 5000, boralee@kohyoung.com Koh Young is the 3D inspection market leader, proven by world leading EMS companies and electronics manufacturers. More than 1,000 in-line SPI systems have been installed globally during the last 7 years. Using Koh Young’s measurement accuracy and reliability, help customers optimize their SMT process and improve production line yields.

Kyzen Corporation

2241

430 Harding Industrial Drive Nashville, TN 37211 Phone: +1 615-831-0888 contact_us@kyzen.com Web: www.kyzen.com Sherry Stepp, Product Manager +1 615-831-0888, sherry_stepp@kyzen.com Tom Forsythe, VP Sales +1 615-831-0888, tom_forsythe@kyzen.com Kyzen provides award winning cleaning chemistries for electronics and advanced packaging applications. We offer a broad range of process solutions ranging from sprayable aqueous cleaning formulations to engineered vapor degreasing solvents. Kyzen also has a fully equipped applications lab staffed with experts to help with customer process development. All of our products are environmentally friendly and effective in virtually all cleaning systems available today. Our goal is to provide our customers with integrated cleaning SOLUTIONS! New Product

L.C.O.A. Laminating Company of America

1240

Landrex Technologies, Inc.

2171

Lewis & Clark, Inc.

1882

20322 Windrow Drive Lake Forest, CA 92630 Phone: +1 949-587-3337

P.O. Box 2698 Fremont, CA 94536 Phone: +1 805-689-2407 j.gibson@landrex-us.com

131 Burke Street Nashua, NH 03060 Phone: +1 603-594-4229 info@lewis-clark.com Web: www.lewis-clark.com Frank Clark, President/CEO +1 603-594-4229, fclark@lewis-clark.com Arlin Horsley, VP Operations/Sales +1 813-888-7436, ahorsley@lewis-clark.com Lewis and Clark, Inc. is a value-added reseller of previously owned equipment for the Electronic Assembly industry, headquartered in Nashua, NH. LCI buys, sells, and reconditions SMT, and Test systems as well as offering variety of field service solutions. Additional locations in in FL, CA, Europe and Latin America.

LPKF Laser & Electronics

436

12555 SW Leveton Drive Tualatin, OR 97062 Phone: +1 503-454-4200 info@lpkfusa.com Web: www.lpkfusa.com LPKF Laser & Electronics supplies a full line of systems for PCB fabrication and multiple technologies for through-hole plating. LPKF also distributes laser stenciling systems that create plastic or stainless-steel stencils for solder bumps on wafers or stencils that support fine-pitch technology in surface-mount designs.

M.E.T. (Metal Etching Technology)

1725

140 Mt. Holly Bypass, Unit 10 Lumberton, NJ 08048 Phone: +1 609-261-2670 sales@metassocs.com Web: www.metassocs.com Barry R. Goukler, VP Sales & Marketing +1 609-261-2670, barry@metassocs.com Fred Cox, Executive Vice President +1 609-261-2670, fred@metassocs.com A full service stencil supplier with 2 locations — N.J. & MN Laser Cut Stencils, Electroformed Stencils, Laser Rework Stencils as well as Chem-Etched Stencils. Complete CAD services. Also, a distributor for the cost effective Wizard Quick Mount frame system, the Space Saver system, and a licensed distributor for the DEK VectorGuard system.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. M+B Plating Racks Inc.

941

MacDermid Inc.

810

5400 Vanden Abeele Ville ST - Laurent, QC H4S 1P9 Canada Phone: 514-335-2436 Web: www.mbracks.com Howard Brown, CEO 514-335-2436, howard@mbracks.com Max Ferri, Design Engineer 514-335-2436, max@mbracks.com Racks, Clamps & Baskets for all your plating needs. M+B have been dedicated to the PWB Industry since 1986. We are the leaders for all your racking & clamping requirements. Our moto has always been “YES WE CAN”. Yesterday, today & tomorrow we are here to serve You. 245 Freight Street Waterbury, CT 06416 Phone: +1 203-575-5700 Web: www.macdermid.com MacDermid Electronics Solutions is a complete provider of specialty chemical solutions for the printed circuit board and photovoltaics industries. At MacDermid, we know it takes more than innovative, high performance products and superior technical service to help our customers compete and win in today’s marketplace. It takes a total commitment to understanding their needs and the ability to provide the right solutions — every time. When success is your only goal, count on the company that says “Yes We Can”.

Machine Vision Products, Inc.

1647

5940 Darwin Court Carlsbad, CA 92008 Phone: +1 760-438-1138 sales@visionpro.com Web: www.machinevisionproducts.com Paul Groome, Sales Manager +1 760-438-1138, pgroome@visionpro.com Richard Osborne, North American Sales Manager +1 614-263-6661, rosborne@visionpro.com Machine Vision Products, Inc., provide the fastest and most accurate advanced AOI, SPI and 3D measurement solutions to electronics, SMT, microelectronics, and semiconductor manufacturers. Our AOI solutions provide class-leading defect detection for SMT components including 01005s and full 3D laser based paste inspection. For microelectronics environments we provide wirebond, die placement and damage, die tilt and alignment, epoxy underfill, routing, foreign material inspection for defects such as solder or epoxy splatter and dimensional measurements in x, y and z.

Malcomtech International

1431

26230 Industrial Boulevard Hayward, CA 94545 Phone: +1 510-293-0580 info@malcomtech.com Web: www.malcomtech.com Tom Fujikawa, President +1 510-293-0580, tomfuji@malcomtech.com Charlie Fujikawa, Technical Support Manager +1 510-293-0580, charlie@malcomtech.com MALCOM SWB-2 Wetting balance tester for checking wetting force and wetting time of components. MALCOM SP-2 Solder paste wetting tester. MALCOM SPS Solder paste mixer. MALCOM TD-6A 2D 3D Solder paste print inspection. UNITECH UC-250 inline pcb surface cleaning system. New Product

Manncorp

2458

2845 Terwood Road Willow Grove, PA 19090 Phone: +1 800-745-6266 sales@manncorp.com Web: www.manncorp.com Established in 1968, Manncorp specializes in surface mount production equipment for mid-volume PCB assembly, including flexible pick and place systems, lead-free reflow ovens, stencil printers and rework equipment. Manncorp’s ‘Turnkey Systems’ are fully integrated manufacturing solutions of pre-selected printing, placement and reflow equipment geared to user throughput and budgetary requirements. Through-hole products include lead-free wave solder machines and lead formers. Other products are component counters, desiccant cabinets, stencil cleaners, aqueous PCB cleaners, soldering equipment, depanelers, solder paste and dispensers.

Martin GmbH

638

Matrix USA Inc.

612

360 Harvey Road Unit B-02-L Manchester, NH 03103 Phone: +1 630-627-8989 Web: martin-smt.de Scott Rushia, Sales Manager - Martin Products +1 603-627-8989, sr@martin-rework.com Martin offers hand soldering, affordable rework systems, reballing and dispensing technologies. The USA sales and service office is located in Manchester, NH, and the manufacturing facility is in Wesseling, Germany. Martin is a FINETECH company. New Product 1124 Midway Boulevard Mississauga, ON L5T 2C1 Canada Phone: 905-670-8400

MDEVICENow.com

1727

Medical Product Outsourcing

1727

70 Hilltop Road, 3rd Floor Ramsey, NJ 07470 Phone: +1 201-825-2552 howard@rodpub.com Web: www.mdevicenow.com MDeviceNow.com is dedicated to the medical device manufacturing industry for both the OEM and Component Manufacturer. It provides valuable information to it’s targeted user audience of Design Engineers, R&D, QA/QC and Manufacturing Professionals. 70 Hilltop Road Ramsey, NJ 07446 Phone: +1 201-825-2552 Web: www.mpo-mag.com Howard Revitch, Group Publisher +1 201-825-2552 x343, howard@rodpub.com Medical Product Outsourcing covers all aspects of medical device and invitro diagnostic outsourcing from partnership issues to regulatory concern to design and manufacturing complexities. Within the pages of Medical Product Outsourcing, readers will find insightful articles and columns, up-to-date industry news, and a network of partners domestically and abroad. Please sign up for a free subscription at our website www.mpo-mag.com. In addition, please visit the website www.odtmag.com for information on our other publication, Orthopedic Design and Technology.

MEPTEC

BIN

P.O. Box 222 Medicine Park, OK 73557 Phone: +1 607-714-1570 Web: www.meptec.org Bette Cooper +1 650-714-1570, bcooper@meptec.org MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association of over 500 semiconductor professionals committed to enhancing the competitiveness of the back-end portion of the semiconductor business. MEPTEC is concerned exclusively with assembly, packaging and test issues and is dedicated to the advancement of that segment of the industry.

IPC APEX EXPO™

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Metal Finishing Magazine

BIN

360 Park Avenue New York, NY 10010 Phone: +1 212-633-3100 Web: www.metalfinishing.com Larry Post, Advertising Sales Manager +1 212-633-3191, l.post@elsevier.com Jason Awerdick, Marketing Manager +1 212-633-3103, j.awerdick@elsevier.com Metal Finishing Magazine is the leading publication for finishers including those involved in plating and coatings for electronics and printed circuits.

Metro SMT Ltd.

2125

Whitehurst House - One Sylvia Great Missenden Bucks Hp16 Oes Great Missenden England Phone: 866-789-7841 Web: www.metrosmt.com The technology behind the worlds best SMT nozzles will be on display. Including the revolutionary ceramic material ‘Roxton’ for longer life and less-wear. Brand new ranges of lower cost specialist feeders for all SMT machines.

Metrohm USA

809

6555 Pelican Creek Circle Riverview, FL 33578 Phone: 800-727-6768 info@metrohmusa.com Web: www.metrohmusa.com Michael Kubicsko, Business Manager - Electrochemistry +1 800-727-6768 x2262 Metrohm USA offers a wide range of bath analyzers, including the CVS/CPVS 797 Computrace for bench analysis of brightener/carrier and trace metals. Also available: manual to automated Metrohm titration systems and ProcessLab at-line analyzers for determination of inorganic bath components; Eco Chemie Autolab electrochemistry systems for bath design and configuration.

MicroCraft

301

8220 Belvedere Avenue, Suite C Sacramento, CA 95826 Phone: +1 916-273-1601 Web: www.usamicrocraft.com Adelino Sousa, President +1 916-273-1601, lino@usamicrocraft.com Manufacturer of High Speed Moving Probe Testers, TDR and Latent Defect Testers. DLP Direct Legend Printers with Barcoding capability. MicroCraft also offers 3 Technology Centers in USA and 1 in Toronto, Canada for Testing Services.

Micron Laser Technology

1029

22750 N.W. Wagon Way, Suite A Hillsboro, OR 97124 Phone: +1 503-439-9000 sales@micronlaser.com Web: www.micronlaser.com Sig Jensen, CEO Troy Dowdy, Sales Manager +1 503-439-9000 ext. 20, troyd@micronlaser.com Laser material processing contract manufacturer: High speed microvia drilling (copper and dielectric), skiving (flex circuits and other thin films and cavities), cutting & drilling (flex circuits and hybrid circuits), soldermask repair, cutting & drilling (LTCC tape, thin metal, rubber & plastics).

Micronic North America P.O. Box 431 San Luis Rey, CA 92068 Phone: +1 760-458-4818 conrad.pearson@micronic-na.com

912

Microscan Systems, Inc.

1826

1201 SW 7th Street Renton, Washington 98057 Phone: +1 425-226-5700 info@microscan.com Web: www.microscan.com Laura Hoffman, Marketing Director John Agapakis, Director of Business Development jagapakis@microscan.com Microscan is a global leader in the design and manufacture of advanced Auto ID and Machine Vision solutions. Microscan products serve a broad range of electronics applications and have received global recognition for their high quality and leading edge technology. From reliable data capture to complex visual inspection, Microscan is the preferred choice of major electronics companies around the world.

MicroScreen LLC

743

1106 South High Street South Bend, IN 46601 Phone: +1 574-232-4358 info@microscreen.org Web: www.microscreen.org Holly Wise, Technical Accounts Manager +1 574-232-4418, hollyw@microscreen.org Kathy Jenczewski, General Manager +1 574-232-4637, kathyj@microscreen.org Laser cut and electroformed stencils for printing solder paste. Options for lead free stencils include: high nickel content metal for improved paste release and ‘green’ identification for isolation. All stencils 100% inspected for integrity using ScanCheck AOI. Distributors of Wizard Frame System and Space Saver Frames.

Microtek Labs

1928

1435 Allec Street Anaheim, CA 92805 Phone: +1 714-999-1616 techservice@thetestlab.com Web: www.thetestlab.com Mike Shepherd, President/CFO +1 800-878-6601, mike@thetestlab.com Russ Sheperd, Laboratory Manager +1 800-878-6601, russ@thetestlab.com Microtek Laboratories specializes in printed wiring board and laminate conformance testing and failure analysis. Microtek is ISO 9001:2000 registered, UL certificated, and DSCC recognized test facility serving the requirements of the PCB/PWB’s, PCB assemblies, PCB Materials, Laminates, Contract Mfr’s and OEM’s. Test capabilities include visual and dimensional inspection; electrical, mechanical, and environmental testing; as well as microsectional analysis, and IPC training. Testing to MIL-PRF-55110, MIL-P-50884, MIL-PRF-31032, ASTM and IPC test methods.

Mid America Taping & Reel

541

121 Exchange Boulevard Glendale Heights, IL 60139 Phone: +1 630-629-6646 Web: www.matr.com Ed Walton, Vice President +1 630-629-6646 x223, ed@matr.com Barb Pauls, Owner/President/CEO +1 630-629-6646 x224, barb@matr.com For over 26 years, Mid-America Taping & Reeling Inc. has been the leader in the electronic component automation preparation business. Mid America offers SMD, radial and axial taping, lead forming, programming, baking, and dry packing. Mid America distributes U.S. made products of all materials used in these processes. ISO 9001:2000 and WBE registered.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Milara/Mirae

959

4 Marc Road Medway, MA 02053 Phone: +1 508-533-5322 Web: www.milarasmt.com Milara Inc. is a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications. Company: Mirae Corporation — Leading worldwide supplier of Pick and Place assembly equipment. Address: #714, Baekseok-Dong, Seobuk-Gu City: Cheonan-Si, State/Province: Chungcheongnam-Do; Postcode: 331-220; Country: South Korea; Tel: 82 41 621 5070; Fax: 82 41 559 8719 New Product

MIRTEC Corp.

2219

3 Morse Road, Unit 2AB Oxford, CT 06478 Phone: +1 203-881-5559 Web: www.mirtecusa.com Brian D’Amico, President +1 203-232-9343, b.damico@mirtecusa.com Robert Horowitz, Regional Sales Manager +1 203-217-0271, r.horowitz@mirtecusa.com Global manufacturer and supplier of desktop, in-line automated optical inspection (AOI), Solder Paste Inspection (SPI), and real-time x-ray inspection equipment. Among the many strengths are the ease of programming and the flexibility to be used anywhere in the manufacturing process. New Product

ML System Inc.

2443

1860 Renaissance Boulevard Sturtevant, WI 53177 Phone: +1 262-884-4669 als@ml-system.com Web: www.ml-system.us ML System Inc. provides industrial humidification solutions for EOS/ESD control. Consistently controlled RH at optimum levels results in dramatic improvement or elimination of dry air problems. Increased productivity and lower waste lead to improved profitability and quality for you.

Multek Flexible Circuits Inc.

1385

1150 Sheldahl Road Northfield, MN 55057 Phone: +1 507-663-8201 jane.wrolson@multek.com Web: www.multek.com mark Wadekamper, Account Manager +1 507-663-8463, mark.wadekamper@multek.com Tiffani Nelson, Product Manager +1 507-663-8381, tiffani.nelson@multek.com Multek Flexible Circuits is a high-volume flexible circuits manufacturer processing almost 20 million square feet of single and double-sided circuits annually. Multek’s technology is based on low cost, high volume, reel-to-reel fabrication processes and techniques. With over 40 years of flexible circuits experience. Multek is a global leader in flexible circuit development and delivery. On the foundation of our Sheldahl Technical Materials business unit, we uniquely offer vertical integration to rapidly tailor our materials to meet the specific requirements of our customers.

Multiline Technology

513

400 Broadhollow Road Farmingdale, NY 11735 Phone: +1 631-249-8300 Web: www.multiline.com The leading supplier of Registration Systems: Post Etch Punches, Artwork Punches, Glass Exposure Frames, Post Lamination X-Ray and Inspection and all related tooling and accessories for manufacturing Multilayer PCB’. Multiline offers registration.

IPC APEX EXPO™

MYDATA automation Inc.

2225

320 Newburyport Turnpike Rowley, MA 01969 Phone: +1 978-948-6919 john.mcmahon@mydata.com Web: www.mydata.com Catey Eberly, Marketing +1 978-948-6919 x124, catey.eberly@mydata.com Brian Duffey, President +1 978-948-6919, brian.duffey@mydata.com MYDATA automation AB designs and builds SMT placement machines and stencil-free printers for the electronics industry. With MYDATA solutions — specifically designed with lean manufacturing in mind — you can save substantial time in your production. With unique machine concepts and advanced software tools, MYDATA represent the intelligent factory of the future. Our mission is to always be innovating in order to satisfy the electronic industry’s need for surface mount technology and services that meet the highest demands in terms of productivity and quality.

National Graphic Supply

537

8730 Prestige Court Rancho Cucamonga, CA 91730 Phone: +1 800-779-5657 Web: www.ngspcb.com Jon Weins, National Sales Manager +1 909-989-5200, jweins@ngspcb.com National Graphic Supply is a nationwide distributor for FujiFilm and private label phototool imaging films. Our 14 Technical Specialists provide a high level of technical support to assure optimum process control for your phototools. NGS has 9 warehouses to support your supply needs.

NBS

2141

Nihon Superior Co., Ltd.

1426

Nikon Metrology, Inc./X-Tek

1439

2950 Patrick Henry Drive Santa Clara, CA 95054 Phone: +1 408-654-1100 Web: www.nbscorp.com Chris Alessio, VP of Sales & Marketing +1 408-206-4260, calessio@nbscorp.com NBS is a fully integrated EMS provider headquartered in Northern California. NBS provides end-to-end solutions that include leading-edge services in design engineering, manufacturing engineering, NPI, production, supply chain and logistics, test, box build and systems integration.

3101 Cowley Way, Unit 176 San Diego, CA 92117 Phone: +1 619-684-1422 nsusa@nihonsuperior.com Web: www.nihonsuperior.com Masato Nakamura, Manager +1 619-684-1422, m.nakamura@nihonsuperior.co.jp With its unique tin-copper-nickel-germanium alloy SN100C now firmly established as one of the global electronics industry’s most popular lead-free wave soldering alloys, Nihon Superior announces that it is extending the range of material forms in which the alloy is available. New Product 12701 Grand River Brighton, MI 48116 Phone: +1 810-220-4360 marketing_us@nikonmetrology.com Web: www.nikonmetrology.com Ken Gribble, Business Development Manager, X-Ray Products +1 408-486-9620, ken.gribble@nikonmetrology.com As the newest member of the Nikon Metrology family of products, X-Tek offers a complete range of real time nano focus and Computed Tomography X-Ray Inspection Systems. Now Nikon Metrology welcomes you to experience our latest software and hardware advances. Nikon Metrology’s x-ray product line features sub-micron defect detection, 75-degree oblique viewing, digital detectors and automatic BGA analysis software.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Nordson ASYMTEK

1925

2762 Loker Ave West Carlsbad, CA 92010 Phone: +1 760-431-1919 info@nordsonasymtek.com Web: www.nordsonasymtek.com Brad Perkins, Regional Sales Manager - Southwest +1 760-431-1919, brad.perkins@nordsonasymtek.com Roy Ciardella, Regional Sales Manager - Northwest +1 760-431-1919, roy.ciardella@nordsonasymtek.com Automated fluid dispensing, jetting and conformal coating systems from Nordson ASYMTEK are ideal for many operations: printed circuit board assembly, semiconductor packaging, and other precision assembly processes for LEDs, flat panel displays, automotive products, medical/biotech products, solar products, fuel cells, and other electro-mechanical devices. Nordson ASYMTEK sets the pace of innovation for better dispensing and conformal coating products with Spectrum™ dispensing and coating platforms and DispenseJet® and PreciseCoat™ valves and applicators, all supported by an outstanding global support network. The company is ISO 9001:2008 certified.

Nordson EFD

1641

NSWC Crane Division

1129

300 Highway 361 Building 3287E, Code GXSP Crane, IN 47522 Phone: +1 812-854-1299 Dean May, Production Manager +1 812-854-3073, william.may@navy.mil The Emerging Critical Interconnect Technology Program (ECIT) is a cooperative venture between the electronics industry (IPC) and NAVSEA Crane. The ECIT program provides support for new material and product technology development through teaming arrangements with military, private industry, and academic parties. The intent of the program is to promote domestic research and development as well as accelerate the integration of new technology into warfighter applications.

Nujay Technologies Inc. 22981 Triton Way, Unit E Laguna Hills, CA 92653 Phone: +1 949-215-8555 nesh@nujaytech.com

717

40 Catamore Boulevard East Providence, RI 02914 Phone: +1 401-431-7000 solder@efd-inc.com Web: www.nordsonefd.com Nordson EFD LLC (formerly known as EFD, Inc. A Nordson Company) is a leading manufacturer of high-quality solder paste and precision dispensing systems. Nordson EFD Solder is ISO9001 certified and offers a comprehensive line of printing and dispensing solder pastes for improving yields and reducing costs in electronics and electro-mechanical assembly processes. We provide applicationbased solder products, complete paste dispensing solutions and develop supportive technical partnerships with our customers. Nordson EFD precision dispensing systems apply controlled amounts of all types of assembly fluids used in most manufacturing processes. Products: benchtop dispensers, precision valves, XYZ robots, and dispensing components. New Product

Nutek Americas Inc.

Nordson YESTECH

Nu-Way Electronics

630

Oak Mitsui Inc.

924

1759

2762 Loker Ave West Carlsbad, CA 92010 Phone: +1 760-918-8471 sales@nordsonyestech.com Web: www.nordsonyestech.com Don Miller, President +1 760-918-8471, don.miller@nordsonyestech.com Nordson YESTECH is a leading provider of AOI and X-Ray inspection systems, with integrated Yield Enhancement Solutions for electronic manufacturers. Our high-speed FX Series and BX Benchtop AOI systems are configurable with 5 megapixel color camera imaging technology. With one top-down and 4 sideviewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. The new X3 X-Ray system’s proprietary technology provides unsurpassed 3D inspection capability for BGA’s and other hidden solder joints on double-sided PCBs. Nordson YESTECH’s advanced SPC software is available with all systems, providing realtime yield information.

North Star Imaging, Inc.

1911

19875 South Diamond Lake Road, Suite 10 Rogers, MN 55374 Phone: +1 763-463-5650 sales@4nsi.com Web: www.4nsi.com North Star Imaging manufactures industrial 2D and 3D X-ray systems and ranks among the nation’s most sophisticated resources for NDT equipment, services, training and accessories. NSI’s X-View series of real-time Digital Radiography systems are designed for conventional inspections, plus NSI offers custom systems to solve the most complex applications. NSI’s X-ViewCT series of Computed Tomography systems integrates the most powerful CT reconstruction and visualization software available (efX-CT), including modules for calibration, measurement, real-time density segmentation, surface extraction and more. NSI’s Inspection Services Group (ISG) provides high-resolution inspection services to assist in product development, failure analysis, rapid prototyping, QA/QC and more. New Product

1865

1811 Lefthand Circle, Suite B Longmont, CO 80501 Phone: +1 303-684-0400 info@nutekamericas.com Web: www.nutekamericas.com Bill Brennan, Service/Sales Manager +1 303-684-0400, b.brennan@nutekamericas.com Colin C. Drier, President/CEO +1 303-684-0400, c.drier@nutekamericas.com Nutek, the worldwide leader in automation systems since its inception over 20 years ago, conceptualizes designs and manufactures robust/flexible automation systems and is highly regarded for its world class quality. Nutek’s core business is made up of Printed Circuit Board (PCB) handling equipment, Laser marking, and Barcode labeling systems. 165 Martin Lane Elk Grove Village, IL 60007 Phone: +1 847-437-7120 info@nuway.net Web: www.nuway.net Bill Aldeen, President +1 847-437-7120, baldeen@nuway.net April Cantu, Sales +1 847-437-7120, acantu@nuway.net

29 Battleship Road Camden, SC 29020 Phone: +1 803-425-7900 Web: www.oakmitsui.com John Andresakis, VP of Strategic Technology +1 518-668-8088, john.andreaski@oakmitsui.com John Blaber, Senior VP of Sales & Marekting +1 803-425-7948, john.blaber@oakmitsui.com Oak-Mitsui is a wholly owned subsidiary of Mitsui Kinzoku, the world’s largest manufacturer of copper foils and high performance products for the electronics industry. Headquartered in Camden, SC, with locations in Hoosick Falls, NY and Riverside, CA. Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex® Buried Capacitance™ materials.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. OEM Press Systems, Inc.

920

Omron Electronics

1346

Ohmega Technologies Inc.

825

On Site Gas Systems, Inc.

2137

311 South Highland Avenue Fullerton, CA 92832 Phone: +1 714-449-7500 Web: www.oempresssystems.com Mary Quinlan, Sales Manager +1 714-449-7500, mary.quinlan@oempresssystems.com John Copp, President +1 714-449-7500, john.copp@oempresssystems.com OEM Press Systems, Inc. offers vacuum enclosed hydraulic press systems which incorporate the best lamination technology for high tech PCBs, Flexible Circuitry and Rigid Flex providing accurate & repeatable process control with even pressure application, and superb temperature uniformity, over the entire surface area of the platen resulting in uniform thickness across the entire product. High temp (800°F to 1000°F) vacuum presses are offered for LCP, Teflon bonding and high-temp applications. Fully integrated automated material handling systems can be integrated with your OEM Vacuum Press system to provide a fully integrated turnkey system.

4031 Elenda Street Culver City, CA 90232 Phone: +1 310-559-4400 customerservice@ohmega.com Web: www.ohmega.com Bruce Mahler, Vice President +1 310-559-4400, bmahler@ohmega.com Dan Brandler, Technical Director +1 310-559-4440, dbrandler@ohmega.com Ohmega Technologies has been producing Ohmega-Ply, the premier embedded resistive material, for over 30 years. As the leader in embedded resistor technology, we are committed to producing the world’s most efficient and reliable thin film resistive material.

OK International

1482

12151 Monarch Street Garden Grove, CA 92841 Phone: +1 714-230-2366 jsimmons@okinternational.com Web: www.okinternational.com Jerry Simmons, Marketing Manager +1 714-230-2366, jsimmons@okinternational.com Brian Langley, Director of Sales, The Americas +1 770-886-0776, blangley@okinternational.com Only at OK International, the exclusive provider of SmartHeat® Technology, will you find products that allow you to tap into unique advantages over competitive systems. Our OKi and Metcal brands minimize your training investment, maximize your applications solutions and boost your productivity, yield and bottom line. Our soldering and desoldering, advanced package rework, fluid dispensing and fume extraction products reflect our philosophy for best-in-class performance and innovative design. Known. Trusted. Quality. That’s OK International. With decades of experience, OK International, Inc. is committed more than ever to provide customer driven solutions and the reliable products you demand. New Product

Omni Training

531

9513 Business Center Drive, Suite J Rancho Cucamonga, CA 91730 Phone: +1 909-945-9495 info@omnitraining.com Web: www.omnitraining.com Ken Moore, President +1 909-945-9495, kenamoore@omnitraining.com After nearly 30 years Omni Training still provides Assembly, Soldering & Rework Courses, Training Kits & PCBs, Posters, Handbooks, Workbooks, CDs, ESD Awareness materials and Dummy Components. We’re an Official IPC Certification Center for J-STD-001, IPC-A-610, IPC/WHMA-A-620 and IPC-7711/7721. Customized “skills-intensive” classes including Lead-free kits and hands-on training/certification at our classrooms or on-site at your facility. Rental tools, Inspection & Consulting available.

IPC APEX EXPO™

1 Commerce Drive Schaumburg, IL 60173 Phone: +1 866-88-OMRON aoi.request@omron.com Web: www.omron247.com Chris Speck, AOI Business Unit Manager +1 916-749-7573, chris.speck@omron.com Tim Anderson, AOI Sales Support Manager +1 847-285-7330, Tim.Anderson@Omron.com Omron’s PCB inspection systems lead the AOI market with the fastest production speeds, 3D imaging, and patented technology providing increased productivity and high quality inspection capability. New for 2009, Omron introduces an in-line X-ray inspection system with the industry’s fastest and most accurate inspection capability utilizing CT technology. Omron’s comprehensive line of AOI-X-ray inspection equipment from bench-top to in-line systems provides a total SMT solution fully compatible with the QupNavi Software suite for root-cause analysis and total SMT quality improvement. 35 Budney Road Newington, CT 06111 Phone: +1 860-667-8888 info@onsitegas.com Web: www.onsitegas.com Wayne Heist, Regional Sales Manager +1 860-667-8888, wheist@onsitegas.com Dick Lusso, Regional Sales Manager +1 860-667-8888, dlusso@onsitegas.com Manufacturer of nitrogen and oxygen generation systems. Nitrogen purites from 95% to 99.9995%, oxygen purities 95% or 99%. Generate your own nitrogen gas on site for your selective and wave solder needs for just pennies.

Orbotech

609

44 Manning Road Billerica, MA 01821 Phone: +1 978-667-6037 Web: www.orbotech.com Guy Alon, Director of Marketing - PCB +1 978-667-6037, guya@orbotech.com Ken Maylor, Vice President - Sales PCB +1 978-667-6037, kenm@orbotech.com Expand your business opportunities with our latest Inkjet Legend Printing, Automated Optical Repair, Laser Direct Imaging, AOI, Laser Plotting and CAM/ Engineering Solutions.

Orpro Vision

2365

Ovation Products

1173

44 Manning Road Billerica, MA 01821 Phone: +1 617-676-1101 x201 arnon.tuval@orprovision.com

3864 Courtney Street, Suite 240 Bethlehem, PA 18017 Phone: +1 484-893-1028 support@ovation-products.com Web: www.ovation-products.com Marius Popitiu, Sales Manager Europe +40 722 629 108, mpopitiu@ovation-products.com Dave Simmons, Operations Manager, Sales +1 484-893-1028, sales@ovation-products.com Ovation Products manufactures Grid-Lok Tooling, and Magna-Print Squeegees for SMT printing and assembly. Grid-Lok tooling eliminates set up time for printers and placement machines by automatically conforming to the bottomside of the PCB. Magna-Print Squeegees offer a universal, rapid changeover squeegee solution.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. P. Kay Metal, Inc.

2449

2448 East 25th Street Los Angeles, CA 90058 Phone: +1 323-585-5058 Web: www.pkaymetal.com Daniel Feinberg, Vice President +1 323-585-5058, baer@pkaymetal.com Gladys Flores, Sales Manager +1 323-585-5058, gladysflores@pkaymetal.com MS2® Molten Solder Surfactant totally eliminates dross, and enhances the soldering process by eliminating dross related defects. The result is significant cost savings and improved quality. This year P. KAY Metal introduces an additional and even easier way to use MS2 in batch mode. For over 25 years, the company’s ISO 9001:2000 certified Puretronix™ solder bar, cored wire solder, and chemistries have been used widely in electronics assembly.

Pac Tech USA Packaging Technologies, Inc.

565

328 Martin Avenue Santa Clara, CA 95050 Phone: +1 408-588-1925 sales@pactech-usa.com Web: www.pactech-usa.com Mausumi Sarkar, Sales Support Manager +1 408-588-1925 x212, sarkar@pactech-usa.com Dr. Thorsten Teutsch, President +1 408-588-1925 x202, teutsch@pactech-usa.com Pac Tech builds solder balling and assembly equipment for flip-chip and chipscale packaging. With systems for solder jetting (SB2) and flip-chip attach (LAPLACE) Pac Tech is the leader in laser heating and reflow technology for advanced packaging applications like HGA assembly, MEMS and optoelectronic packaging. The solder bump repair system SB2-R is the solution for lead-free CSP/BGA rework. Pac Tech also offers contract bumping & backend services for quick-turn and mass production in Santa Clara-California, Penang-Malaysia and Nauen-Germany.

PACE Inc.

365

255 Air Tool Drive Southern Pines, NC 28387 Phone: +1 301-317-3569 Mluzius@paceworldwide.com Web: www.paceworldwide.com PACE manufactures a wide range of products for hand soldering, PCB Repair, SMT/Area Array Rework and fume extraction. PACE continues to provide innovative solutions, products and training for the rework, repair and testing of printed circuit assemblies. Our unique capabilities and evolving vision have provided universal solutions to thru-hole and surface mount assembly and rework problems for the most advanced electronics. 50 Years of Experience and Industry Leadership.

Panasonic Factory Solutions Company of America

1871

909 Asbury Drive Buffalo Grove, IL 60089 Phone: +1 847-495-6100 PFSAmarketing@us.panasonic.com Web: www.panasonicfa.com John Stewart, Regional Sales Manager +1 847-495-6239, StewartJo@us.panasonic.com Masa Kaji, Sales, Group Manager +1 847-495-6100, KajiM@us.panasonic.com Panasonic Factory Solutions Company of America provides industry-leading, electronics assembly solutions that can maximize manufacturers’ productivity, quality and profit through a combination of software, process, support and hardware offerings. In addition, Panasonic has proven expertise in lean and six-sigma applications, metrology, and advanced processes enhanced with enterprise-wide vision. Visit our booth and view our continuously evolving, singleplatform solution, the NPM, our MES PanaCIM® Enterprise Edition software, and more efficiency solutions beyond equipment for your entire manufacturing process. Watch live demonstrations and learn how Panasonic can help maximize your productivity in Booth 1871. New Product

Para Tech Coating, Inc.

2127

35 Argonaut Circle Aliso Viejo, CA 92656 Phone: +1 800-999-4942 info@parylene.com Web: www.parylene.com William Gleason, General Manager +1 949-855-8010, bgleason@parylene.com Erika Partida, Customer Support +1 949-900-8861, epartida@parylene.com Para Tech Coating (PTC) provides Parylene conformal coating services, automated vacuum deposition systems and raw materials (dimer). Proprietary processes and capabilities that are unique in the industry result in improved production results and faster coating turn-around times. Parylene benefits include complete surface conformability, pinhole and stress free application, dielectric/moisture barrier, optical clarity, enhanced lubricity and biocompatibility. PTC offers pre and post process related supplies and tools, including thickness measuring and pre-treatment devices, as well as product process development to meet unique customer specifications. PTC is ISO 9001:2000, AS9100, IPC-CC-830B and MIL-I-46058C certified, ITAR and RoHS compliant.

Park Electrochemical Corp.

401

48 South Service Road, Suite 300 Melville, NY 11747 Phone: +1 631-465-3600 cacs@parkelectro.com Web: www.parkelectro.com Jim Hartzell, Sales Director and Key Account Manager +1 714-870-2257, jhartzell@parkelectro.com George Pinzon, Sales Director and Key Account Manager +1 714-501-4070, gpinzon@parkelectro.com Park Electrochemical Corp. is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies principally for the aerospace markets. Park’s core capabilities are in the areas of polymer chemistry formulation and coating technology. New Product

PCB Planet (India) Ltd.

2226

PCQR2

1231

B-9, GIDC, Electronic Estate, Sector-25 Gandhinagar, Gujarat, 382044 India Phone: +91 79 23287127 sales@pcbplanet.com Web: www.pcbplanet.com Paresh, Mr. V., sales@pcbplanet.com World Class Engineering services for Electronics, Assemly and PCB Industry. We have the latest technology and dynamic work force to provide the best possible services to our customers. New Product 12231 Academy Rd. NE, Suite 301 Albuquerque, NM 87111 Phone: +1 952-652-9033 Web: www.pcbquality.com David L. Wolf, VP-Technical Marketing +1 952-652-9033, dave.wolf@cat-test.info Timothy A. Estes, Chairman & CEO +1 505-797-0100, tim.estes@cat-test.info CAT, Inc. is a global provider of market-critical data utilized by designers, purchasers, assemblers and manufacturers of printed boards (including rigid, rigid-flex and flexible), and by material and equipment suppliers to the printed board industry. The products and services provide quantitative data on printed board manufacturing capability, quality and reliability. For more information visit the following websites: www.cat-test.info; www.pcbquality.com; and www.hats-tester.com. New Product

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Pemtron Technology Corporation

2083

Pentagon EMS

1262

2525 Vista Industria Compton, CA 90221 Phone: +1 614-732-8625 swong@pemtron.com Pemtron Corporation is a premier manufacturer of 3D Solder Paste Inspection Equipment emphasizing the latest technology vs. lowest cost of ownership in todays versatile manufacturing environment. Other focuses of technology are Scanning Electron Microscopes, 3D Nano Focus system for Semi Conductor Manufacturers and the latest addition to our inspection family; UV AOI Inspection for touch panel displays. Please be sure to visit us at APEX 2010 Booth #2083 Enjoy the Show! 10950 S.W. Fifth Street, Suite 275 Beaverton, OR 97005 Phone: +1 503-924-2747 sales@pentagon-ems.com Web: www.pentagon-ems.com Randy Morrison, Marketing Manager +1 503-924-2747 x222, randym@pentagon-ems.com Chad Haima, Vice President, Sales +1 503-924-2747 x226, chadh@pentagon-ems.com Complete PCB assembly process tooling design and manufacture. Wave Solder Pallets, SMT tooling, Press Fit and Conformal Coat tooling and more. Industryleading turn times, no-fault guarantee. New services include contract precision machining, low volume to high production. Visit us and see why Pentagon is your best assembly tooling choice.

Petroferm Inc.

1648

3938 Porett Drive Gurnee, IL 60031 Phone: +1 847-244-3410 techservice@petroferm.com Web: www.petroferm.com Bill Breault, Marketing Manager +1 859-312-4602, bbreault@petroferm.com Petroferm Inc. Cleaning Products develops, manufactures and markets environmentally responsible cleaning agents to meet the increasing demands of today’s manufacturing operations. Sold under the AXAREL, BIOACT, CleanSafe, HYDREX, LENIUM and RE-ENTRY trade names, our products are used to clean precision parts during production, ranging from simple hand wipe applications to sophisticated multi-stage cleaning systems. Our major markets are Aerospace, Defense, Electronics, and Medical as well as other high tech industries. In Electronics, we supply best-in-class cleaning products for Aqueous (BIOACT EC-88), Semi-Aqueous (AXAREL 32 and BIOACT EC-15) and Vapor Degreasing (LENIUM ES) process. We also have over 10 stencil cleaning products to choose from. The electronics product line is available directly from Petroferm or through an extensive network of distributors and business partners operating in approximately 45 countries worldwide.

Phibro-Tech, Inc.

1031

8851 Dice Road Santa Fe Springs, CA 90670 Phone: +1 562-698-8036 Web: www.phibro-tech.com Steve Ansley +1 562-698-8036 Laurie Lanham +1 562-698-8036, laurie.lanham@pahc.com Suppliers of etchants, including alkaline and cupric chloride; recycling services for etchants and other metal bearing wastes; copper sulfate and other metal salts and inorganic acids. Patented TFT® technology.

IPC APEX EXPO™

Photo Stencil

1430

Pillarhouse USA

2149

Plasma Etch, Inc.

1236

4725 Centennial Boulevard Colorado Springs, CO 80919 Phone: +1 719-599-4305 info@photostencil.com Web: www.photostencil.com Bill Coleman, Vice President of Technology +1 719-599-4305, bcoleman@photostencil.com David Doggett, Sr Vice President of Sales +1 719-535-8560, ddoggett@photostencil.com Photo Stencil is a full-service provider of SMT stencils and tooling, including the patented AMTX E-FAB electroformed stencils, and high performance NicAlloy, laser and chem-etch stencils. Related tooling includes squeegee blades, thick film and metal mask screens. Photo Stencil also offers comprehensive design and support services. 635 Touhy Avenue Elk Grove, IL 60007 Phone: +1 847-593-9080 sales@pillarhouseusa.com Web: www.pillarhouseusa.com Adrian De’Ath, Vice President +1 847-893-9080 x121, adriand@pillarhouseusa.com Jon Wol, President +1 847-593-9080 x117, jwol@pillarhouseusa.com Pillarhouse will be showcasing selective solder solutions for today’s global needs. Equipment ranging from, inexpensive hand load solutions to high speed automated modular lines, capable of handling boards from 1x1” to 24x48”. New for 2010-Jade Handex with slide in/out, bottom side pre heat & Modular Inline fluxer/Pre heater combo to compliment the Synchrodex Inline system. Pillarhouse offers offline programming, fiducial recognition, board warpage detection, and closed loop wave height monitoring. Also, closed loop pre heat control, electronic nitrogen flow and purity monitoring, pump RPM monitoring, flash programmable firmware, pallet position recognition and bar code reading & more options available. New Product 3522 Arrowhead Drive Carson City, NV 89706 Phone: +1 775-883-1336 sales@plasmaetch.com Web: www.plasmaetch.com Greg DeLarge, President +1 773-883-1336 Ron Bruckel, California Regional Sales Office +1 818-790-6684, ronbruckel@aol.com Free Sample Processing! — World wide sales, parts & service. 27+ years manufacturing reliable, effective and repeatable Plasma Etching, Cleaning and Reactive Ion Etching (RIE) equipment for the industry. Custom configurations a specialty. Call or email today for a quote!

Pluritec North America Ltd.

803

1556 Ocean Avenue, Suite 18 Bohemia, NY 11716 Phone: +1 631-981-3000 Web: www.pluritec.com Kurt Weber, National Sales Manager +1 714-767-6367, kurt.weber@pluritec.com Carolina Gilio, Office Manager +1 631-981-3000, carolina.gilio@pluritec.com Pluritech North America provides sales, service and spare parts for Pluritec drilling, routing and x-ray equipment.

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Polyonics

1377

867 Route 12, Unit 4 Westmoreland, NH 03467 Phone: +1 603-352-1415 info@polyonics.com Web: www.polyonics.com Jody O’Brien, National Sales Manager +1 410-822-9892, jody.obrien@polyonics.com Levi Dow, Asian Sales Manager + 65 65425484, levi.dow@polyonics.com Polyonics is a leader in advanced polymeric coating technologies for high performance film, tape & label applications. Our THERMOGARD® and TRIBOGARD®polyimide label materials are thermal transfer printable, come in a wide variety of colors and finishes and comply with a wide variety of MIL-STD’s, UL recognition and ASTM standards. Our label materials are compliant with the specifications set forth by REACH, RoHS, PFOS, WEEE and are Halogen Free. Visit www.polyonics.com to learn more.

Posalux SA

317

18, F. Opplinger Biel-Bienne, CH-2500 Switzerland Phone: +41 32 344 7672 sklay@posalux.ch Web: www.posalux.net Various Applications — Worldwide Presence — Innovation, experience and perfection are the characteristics which distinguish Posalux as one of the leading manufacturers of industrial high-performance machines. Posalux is a major worldwide supplier of automatic machine tools for: Drilling and routing of printed circuit boards and non-ferrous materials, Electrical discharge machining of nozzles for diesel and gasoline injection nozzles, spinnerets, etc, and Faceting, engraving and milling in the watch and jewelry industry. Posalux is headquartered in Biel-Bienne, one of the most important cities of Switzerland, which is famous not only as a watch metropolis, but also as one of the most important centers for advanced technologies.

Precision Placement Machines

1958

326 Main Street, Unit 11 Fremont, NH 03044 Phone: +1 603-895-5112 Web: www.goppm.com Thomas Nisbet, President +1 603-895-5112, tom@goppm.com Sharon Breault, Sales +1 603-895-5112, sharon@goppm.com PPM is a full service supplier of used & reconditioned automated PCB assembly equipment for the electronics industry. We specialize in through hole insertion equipment and surface mount placement machines.

Printed Circuit Design & Fab

237

P.O. Box 470 Canton, GA 60169 Phone: +1 678-589-8800 Web: www.pcdandf.com Kathy Nargi-Toth, Editor +1 678-589-8866, knargitoth@upmediagroup.com Pete Waddell, Publisher +1 678-589-8800, pwaddell@upmediagroup.com Printed Circuit Design & Fab magazine is the must-have resource for electronics interconnect professionals. PCD&F provides engineers, designers, executives, fabricators and suppliers with the latest information on technologies, techniques, processes and market conditions relating to the design and fabrication of PCBs and high-density interconnects. Stop by our booth for a free subscription.

Printed Circuit Journal

918

2-20-1 Amanuma Suginami-ku Tokyo, 167-0032 Japan Phone: +81 3 3393 1341 Web: www.pcjcorp.jp/ Toshio Kataoka, President +81 3 3393 1341 Mariko K. Nakazawa, Editor Japanese PWB industry News from Tokyo. First published in 1965, issued every ten days, brings you the most up-to date market information on the Japanese Printed Circuit market.

100

Production Solutions, Inc.

2150

12675 Danielson Court, Suite 403 Poway, CA 92064 Phone: +1 858-486-1088 info@production-solutions.com Web: www.production-solutions.com Douglas Farlow, President dfarlow@production-solutions.com Lori Rosenblatt, Inside Sales +1 858-486-1088, info@production-solutions.com Production Solutions is a manufacturer of universal substrate support tooling systems for the electronics industry. Products include the patented Red-E-Set system which substantially Reduces Changeover Time, Improves Quality and Eliminates Component Damage for pick & place, screen printers, and dispensers. New Product

ProEx

672

Prototron Circuits

935

PVA

649

Q Corporation

511

7842 South 1300 West West Jordan, UT 84088 Phone: +1 801-569-8500 robm@proex1.com

15225 N.E. 95th Street Redmond, WA 98052 Phone: +1 888-847-7686 Web: www.prototron.com Priscilla Vavra, Sales Administrator +1 425-823-7000, priscillav@prototron.com Dave Ryder, Owner +1 425-823-7000, daver@prototron.com Prototron Circuits is a full service quickturn PCB manufacturer with facilities in Redmond,WA and Tucson, AZ/Standard lead time on commercial boards is five days, expedited service starting at 24 hrs. We offer IPC 6012 Class III builds, Controlled Impedance modeling, specialty materials, various surface finishes, is RoHS-compliant and ITAR registered. For more information, visit www.prototron.com. 15 Solar Drive Halfmoon, NY 12065 Phone: +1 518-371-2684 info@pva.net Web: www.pva.net Frank Hart, Director of Marketing and Regional Sales +1 518-371-2684 x229, fhart@pva.net David Gomez, Regional Sales Manager +1 281-217-7247, dgomez@pva.net PVA is a global manufacturer of multi-axis robotic solutions for selective conformal coating and dispensing applications including meter-mix, potting, bonding, gasketing, solder paste, and surface mount adhesive processes. PVA platforms are also integrated for robotic soldering, spray flux, and automatic screw-driving cells.

301 River Street P.O. Box 730 Derby, KS 67037 Phone: +1 800-835-1099 qcorp@qcorporation.com Web: www.qcorporation.com Paul Miller, Sales Manager +1 800-835-1099, paul.miller@qcorporation.com Q Corporation is a recognized world leader in component handling for surface mount technology and mass lead trimming. For 40 years, companies throughout the world have depended on Q quality to meet the most demanding production schedules. Q Corporation has partnered with Fritsch, a Germany equipment manufacturer to bring you a full line of manual, semi-automatic, and automatic pick and place equipment. We are the exclusive North American distributor, and we will provide all sales and support on these machines. New Product

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. QA Technology Company, Inc.

2236

QRP, Inc.

1165

P.O. Box 27466 Tucson, AZ 85726 Phone: +1 800-832-3882 info@qrpgloves.com Web: www.QRPGloves.com Fred Buchanan, Global Sales Director +1 520-790-3533 x33, fred@QRPgloves.com Fred Guidi, North Ameircan Sales Director +1 304-265-1256, fredguidi@gmail.com QRP, Inc. is a leading manufacturer of latex, nitrile, vinyl, other specialty polymer, and knitted/coated gloves, plus latex and nitrile fingercots. These products are designed to increase yields in high technology industries, clean rooms, ESD applications, laboratories and general industry. RoHS compliant. QRP — Protecting People, Products and Processes — since 1974.

10 Tanglewood Road Plainville, MA 02762 Phone: +1 508-699-9077 jbernhard@quik-tool.com Web: www.quik-tool.com Jim Bernhard, Managing Partner +1 508-699-9077, jbernhard@quik-tool.com Quik-tool sets the “Gold Standard” in automatic compliant SMT Tooling for printers and placement equipment! 10 years ago, we introduced a concept to the industry that was the standard in SMT tooling. Now, we have done it again! Our tooling is all High Density at the lowest entry cost in the market. Our patent pending tooling is the easiest to use with “set it and forget it” technology, in manual or automatic modes. Quik-tool is virtually zero maintenance with hands down the lowest ownership cost. Ask about “Starter Kits” which get the tooling in on your expense (not capital) budget. New Product

Qualectron Systems Corporation

2276

QxQ, Inc.

1472

R&D Technical Services Inc.

1276

110 Towle Farm Road Hampton, NH 03842 Phone: +1 603-926-1193 sales@qatech.com Web: www.qatech.com Wendy Wing, Marketing Specialist +1 603-601-0128, wwing@qatech.com Jeff Smith, North America Sales Manager +1 603-601-0166, jsmith@qatech.com QA Technology is a manufacturer of high quality test probes and sockets used in the ATE industry. Our new Advanced Steel Razor Tip Styles solve today’s test challenges such as OSP, Lead Free and No-Clean. This new family of tip styles can help lower your board test costs, reduce board flex and improve electrical contact. Our X Probe Socketless Series allows for a larger test probe to be mounted on closer centers while maintaining reliable electrical contact on smaller boards.

780 Montague Expressway, #507 San Jose, CA 95131 Phone: +1 408-432-1686 sales@qualectron.com Web: www.qualectron.com Ricky Ma, Sales Manager +1 408-476-6636, rickyma@qualectron.com Qualectron Systems provides wide range of testing and inspection solutions like SPI, AOI, ICT / MDA and functional testers. We also offer various testing components and services like bed-of-nail test fixture and programming, mechanical functional fixture box, test probes...etc. All testers are USB 2.0 based. Test program can be downloaded to testers to become standalone operation. New Product

Qualitek International Inc.

1548

315 Fairbank Street Addison, IL 60101 Phone: +1 630-628-8083 solder@qualitek.com Web: www.quailitek.com Charles Han, VP Sales & Marketing +1 630-328-8083 x112, chan@qualitek.com Debbie Liguori, Marketing Department +1 630-628-8083 x122, dliguori@qualitek.com Worldwide solder materials manufacturer. Lead & Lead Free Alloys, Halogen Free Materials, Solder Paste, Flux, Bar, Wire, BGA Spheres, Dross Eliminators, Stencil Cleaners, Residue Removers, Rework Materials, Wave Solder Oil, Ceasolder Masks and Chemicals. JT Lead Free Wave Soldering Systems and Reflow Ovens. BGA Rework Stations. Metals reclamation & Solder Checkup programs, technical support. QS 9000 and ISO 9001:2008 certified. New Product

IPC APEX EXPO™

Quality Tech Tool

813

Quik-Tool, LLC

440

550 Bennett Road Elk Grove Village, IL 60007 Phone: +1 847-952-0999 qttinc@aol.com Web: www.qualitytechtool.com Zoran Denic, President +1 847-952-0006, zdenicqtt@aol.com Alyx Schmid, Program Manager +1 858-587-9797, alyx.schmid@qsic.com Stop by and visit one of the last standing and most complete AMERICAN MANUFACTURER of CARBIDE CUTTING TOOLS. We carry a full line of Micro Drills, Large Drills, Router Bits, End Mills, Slotting Drills, Specialty Cutting tools, C’Sinks, Step Drills, etc. SPECIAL DESIGNED TOOLS IN DAYS NOT WEEKS. We offer factory certified re-sharpening in house. Some areas for distribution available. MADE IN THE USA.

44113 S. Grimmer Boulevard Fremont, CA 94538 Phone: +1 510-252-1522 sales@qxq.com Web: www.qxq.com ICT Fixtures in as little as 3 days. Functional fixtures in as little as 4 days. Local, direct company support in North America and Asia. QxQ consistently provides the quickest turn times in the industry. Utilizing our innovative software and design tools and operating the largest set of equipment ensures the shortest turn times available. ICT fixtures system verified for quality. Durable fixture materials for longevity. Largest bandwith for quick turns. FEA/Strain Gauge Testing. ITAR Registered. Quality fiXtures Quickly - QxQ. 12261 Nicollet Avenue S, Suite A Burnsville, MN 55337 Phone: +1 952-707-1931 sales@rdtechnicalservices.com Web: www.rdtechnicalservices.com R&D Technical Services offers a full line of high quality Vapor Phase Reflow Ovens. With it’s new division Vapor Works, R&D Technical Services has added the Worlds First Vapor Phase Rework Station to it’s extensive Vapor Phase product line. Come see how R&D Technical Services / Vapor Works can bring the advantages of Vapor Phase to both Reflow and Rework. New Product

101

Exhibitors Listing DISCOVER. CONNECT. THRIVE. RBP Chemical Technology

1040

150 South 118th Street P.O. Box 14069 Milwaukee, WI 53214-0069 Phone: +1 414-258-0911 cs@rbpchemical.net Web: www.rbpchemical.com Rob Coleman, Director of Sales & Marketing +1 630-881-6819, rcoleman@rbpchemical.net Nancy Antonicci, Customer Service Manager +1 414-258-0911, nantonicci@rbpchemical.net RBP Chemical Technology is a global supplier of proprietary chemicals used in the electronics and printing industries. These products are manufactured at its headquarters in Milwaukee, Wisconsin, USA, its wholly owned subsidiary RBP Technology Pvt. Ltd. in Mumbai, India, by approved partners in Thailand and South Korea, and a licensee in Finland. RBP products are sold and serviced by factory-trained sales and service representatives and distributors in North America, Asia and Europe. RBP Chemical Technology was founded in 1954 and is ISO 9001:2008 certified.

Real-Time With...IPC

1621

P.O. Box 50 Seaside, OR 97138 Phone: +1 916-608-0660 Web: www.realtimewith.com Barb Hockaday, +1 916-608-0660, barb@iconnect007.com Marcy LaRont, +1 480-280-5229, marcy@iconnect007.com Don’t miss our industry’s best exhibition coverage: Real Time with… IPC APEX EXPO 2010 (www.realtimewith.com). Watch video interviews with industry leaders, read show articles, view our extensive photo gallery and more at Booth 1621. Real Time with…IPC is produced by I-Connect007, home of PCB007, EMS007, PCBDesign007, Flex007 and MilAero007. These global on-line magazines are the electronic manufacturing industry’s most comprehensive source for news, articles and multimedia editorial. Our magazines also have complementary newsletters, including our I-Connnect007 Daily Newsletter that contains both news and exclusive original content. Stop by our studio at the front of the hall to subscribe.

Rehm Thermal Systems

1959

3080 Northfield Place, Suite 109 Roswell, GA 30076 Phone: +1 770-442-8911 Web: www.rehm-group.com John Bashe, General Manager +1 770-442-8913, j.bashe@rehm-group.com Corey Solovay, Service Manager +1 770-442-8912, c.solovay@rehm-group.com Rehm Thermal Systems offers a complete line of ovens for most PCB assembly applications including curing, convection reflow, and vapor phase reflow soldering. VX high performance reflow ovens feature exclusive MRS modular flux management system for optimal process control and minimum maintenance. VXs ovens offer an excellent cost/performance ratio for moderate-high volume production needs. For condensation (vapor phase) soldering, CONDENSO batch systems utilize a patented injection principle which provides superior process control for critical soldering applications.

RENA GmbH

848

Kappstrasse 69 Herrenberg, 71083 Germany Phone: +49 7032 207 141 Web: www.hms-germany.de Joe, Kresky, Managing Director +49 07032 207 141, anja.spiess@hms-germany.de Anja, Spiess, Project Team Assistant +49 07032 207 141, anja.spiess@hms-germany.de One of the leading equipment manufacturers providing unique process-oriented solutions with horizontal conveyorized systems for PCB- and Display industry. Expertise in Electroplating, PTH, Develop-Etch-Strip lines and Immersion processes (silver, tin or organics). Specialist for processing backpanels, ultra-thin and standard laminates.

102

RMD Instruments Corp.

349

44 Hunt Street Watertown, MA 02472 Phone: +1 617-668-6901 leadtracer@rmdinc.com Web: www.rmd-leadtracer.com Steve Glass, RoHS Business Development Manager +1 805-432-5199, sglass@rmdinc.com The Award Winning LeadTrecer-RoHS is the most effective XRF System designed specifically for screening of all RoHS/WEEE and Common Elements in electronics including China RoHS.

Rogers Corporation

1125

RPS Automation

2177

Saki America

2213

Samsung Techwin Ltd./Dynatech Technology, Inc.

1559

One Technology Drive P.O. Box 188 Rogers, CT 06263-0188 Phone: +1 860-779-5595 Web: www.rogerscorp.com Rogers ACMD is a global technology leader in the development of high performance printed circuit materials for use in a wide range of markets including portable communications, communications infrastructure, advanced packaging, aerospace, defense, and digital applications. Key products include RO4000®, RO3000®, RT/duroid®, ULTRALAM® and Theta™ high frequency laminate materials. Technical support is available worldwide. The world runs better with Rogers.® www.rogerscorp.com. 3808 N. Sullivan Road, Building 14J Spokane Valley, WA 99216 Phone: +1 509-891-1680 sales@rpsautomation.com Web: www.rpsautomation.com RPS Automation manufactures a complete line of US-made selective soldering systems and is known for high quality soldering, low maintenance, durability and customer service. RPS provides industry leadership in solder thermal performance and wave height, keep-away and stability. RPS has delivered over 450 installations to more than 250 global customers.

2378 Walsh Avenue, Suite C Santa Clara, CA 95051 Phone: +1 408-567-0300 sakicorp@sakicorp.com Web: www.sakicorp.com Greg Nelson, US Regional Manager +1 310-318-4440, greg.nelson@sakicorp.com Antonio (Tony) Serra, Engineering Manager +1 865-385-3991, tony.serra@sakicorp.com SAKI AOI Systems feature the fastest and highest inspection with state-of-art single line scanning technology enabling entire PCB image inspection. The SPI system uses color enhanced Phase Measurement Prophilometer Technology to ensures high inspectionrepeatability. Our XRAY Systems us the latest state of the art APCT for inline PCB Inspection and our CT Systems can perform full 3D reconstruction of most solid object of a wide range of materials (Metal, Plastics, Ceramic, Biological samples).

2370 York Road, Building C-3 Jamison, PA 18929 Phone: +1 267-483-5535 Sales@DynatechSMT.com Web: www.samsung-smt.com Mike Foster, General Manager +1 267-483-5535, mike.foster@dynatechsmt.com Jonny Nichols, National Sales Manager +1 919-606-3707, jonny.nichols@dynatechsmt.com Dynatech Technology features the full line of Samsung SMT assembly equipment including screen printers, intelligent placement systems, reflow ovens and board handling equipment, all backed by Dynatech’s commitment to customer satisfaction and Samsung’s world-class global support network.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Saturn Electronics Corporation

1628

ScanCAD International, Inc.

1447

28450 Northline Road Romulus, MI 48174 Phone: +1 734-941-8100 Web: saturnelectronics.com/index.htm John Rimanelli, Business Development +1 734.941.8100, jr@saturnelectronics.com Art Wood, Sales / Marketing Representative +1 734-941-8100, artwood@saturnelectronics.com Saturn Electronics Corporation is a Minority-Owned, ITAR-Registered PCB Fabricator managing the nuances between prototype and production. Advanced Technologies include MCPCB LED Applications and RFMW; certifications include AS9100 and TS16949.

Scienscope International

1460

5751 Schaefer Avenue Chino, CA 91710 Phone: +1 909-590-7273 Web: www.scienscope.com Dan Kelsey, General Manager +1 909-590-7273 x15, dkelsey@scienscope.com Eddy Lin, President +1 909-590-7273 Scienscope is a leading manufacturer of NDT test and inspection equipment such as X-Ray machines,XRF spectrometers, stereo zoom microscopes, video inspection systems, and video measurement systems. As well, video measurement software for Field of View measurement and lighting and optical components are displayed.

12779 West Belleview Avenue Littleton, CO 80127-6207 Phone: +1 303-697-8888 info@scancad.com Web: www.scancad.com Bill Loving, President & CEO +1 303-697-8888, bill.loving@scancad.com Jeff Rupert, Director of Advanced Technology +1 734-994-8626, jeff.rupert@scancad.com Global provider of low-cost, scanner-based systems since 1990. INSPECTION: Optical inspection of stencils, screens, PCBs, balls, solderpaste, adhesive, LTCC, holes, phototools. ASSEMBLY: Off-line generation of SMD, insertion, inspection and dispensing program files. FABRICATION: Create Gerber files from existing films/boards. COMPONENTS: Automatically measure components and create vision files. TEST: Low cost flying probe test of bare PCB’s. PROCESS MANAGEMENT TOOLS: SanCAD products combine a dynamic blend of process management, work instruction and manufacturing execution software (MES) that allows for the dissemination and collection of Manufacturing Intelligence (MI) on the shop floor. New Product

SEHO North America, Inc.

Schleuniger, Inc.

50A Northwestern Drive, Suite 10 Salem, NH 03079 Phone: +1 603-890-6002 Web: www.seica.com David Sigillo, General Manager +1 603-890-6002, sigillo@seicausa.com David Levine, National Sales Manager +1 603-890-6002, levine@seicausa.com Seica is a world leader in test & measurement equipment design and services. With offices worldwide, Seica can support you no matter where your NPI centers or production facilities are located. From bare board/substrate testing to traditional in-circuit and functional testing, Seica is the only ATE company that provides solutions to both the substrate and loaded board markets.

527

87 Colin Drive Manchester, NH 03103 Phone: +1 603-668-8117 sales@schleuniger.com Web: www.schleunigher-na.com Darren Teasck, National Sales Manager +1 603-668-8117, DarrenTeasck@schleuniger.com Steve Bridgewater, Direct Sales Representative +1 603-668-8117, SteveBridgewater@schleuniger.com Schleuniger’s state-of-the-art automatic and semi-automatic wire processing machines are designed to cut, strip, crimp, seal and mark wire and cable of all types, including single conductor wire, coaxial, multi-conductor, POF, flat flexible and fiber optic cables. Integrative pre- and post-processing accessories for wire feeding, coiling, stacking, labeling and tying are also available. Companies worldwide utilize Schleuniger for their most demanding wire processing projects. Visit our booth and find out why. New Product

Schmid Systems Inc. USA

925

440 Hayward Avenue North Oakdale, MN 55128 Phone: +1 651-714-8402 ssi@schmid-group.com Web: www.schmid-group.com Fred Johnson, President Sales/service/spare parts for Gebr. Schmid, Germany of Horizontal Processing Equipment for: SURFACE TECHNOLOGY — Brushing, Chemical Cleaning, Oxide Replacement, Chemical Tin, SBU Leveling; RESIST TECHNOLOGY — Cut-Sheet Lamination, Developing, Etching (Alkaline & CuCL), Resist Stripping, Metal Stripping (DES/SES); PTH TECHNOLOGY — Desmear, Electroless Copper, Electro-Plating Copper (Segmenta for DC and/or PRPP); AUTOMATION; LCD TECHNOLOGY.

IPC APEX EXPO™

259

1420 Jamike Drive Erlanger, KY 41018 Phone: +1 859-371 7346 sehona@sehona.com Web: www.sehona.com Christian Ott, Senior Sales Manager +1 859-982-5490, Christian.Ott@sehona. com Gus Mavrou, Regional Manager North America +1 859-982-8541, gus.mavrou@sehona.com SEHO Systems is a world class manufacturer, and supplier of Selective, Wave, and Reflow soldering equipment. At SEHO we combine innovative engineering and process know how to deliver equipment manufactured to the highest quality standards, delivering a reliable and repeatable soldering process. We offer a complete product line of Selective, Wave, and Reflow equipment to meet your production requirements for both Lead Free and tin/lead soldering applications. Visit our booth at APEX to find the solution to your soldering process. New Product

SEICA Inc.

973

New Product

Seika Machinery, Inc.

407

3528 Torrance Blvd., Suite 100 Torrance, CA 90503 Phone: +1 310-540-7310 info@seikausa.com Web: www.seikausa.com Michelle Ohihara, Sales & Marketing Manager +1 310-540-7310 x120, michelle@seikausa.com Isao Muraoka, Executive Vice President +1 310-540-7310 x127, isao@seikausa.com Displaying New Anritsu 3D Solder Printing Inspection Machine; McDry LowHumidity Storage Cases - Feeder Cabinets and Baking Cabinet; Sawa Ultrasonic Stencil Cleaners; Hioki Flying Probe ICT and Solder Joint Integrity Inspection System; Sayaka PCB Router, Hirox 3D Digital Microscopes, Nihon Superior SN100C Solder and Young Jin Conveyor Systems. New Product

103

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Semco Packaging & Applications Systems 12780 San Fernando Road Sylmar, CA 91342 Phone: +1 818-741-1687

Senju Comtek

1779

673

1999 S. Bascom Ave, Suite 340 Campbell, CA 95008 Phone: +1 408-963-5319 sales@senjucomtek.com Web: www.senju.com Shoichi Usui, General Manager, Sales +1 858-268-2440, Derek Daily, General Manager, Advanced Technology +1 408-963-5310, Senju Metal Industry Co. (SMIC) is a global leader in solder materials and related equipments. Senju’s ECO Solder™ lead-free materials include the world’s most widely used GRN360 and the next generation S70G series solder paste. ECOPASCAL wave soldering system incorporates innovative pump technology for the high test and most stable wave pressure. As a total solution provider, Senju offers the latest soldering technologies in the industry.

SGS U.S. Testing Co.

2424

291 Fairfield Avenue Fairfield, NJ 07004 Phone: +1 973-575-5252 Web: www.us.sgs.com SGS U.S. Testing Co., a division of the SGS Group, is the world’s leading verification, testing and certification company. The company’s comprehensive testing, product inspection, process assessment and technical services cover the entire supply chain from product development to retailing and or commercial use. Testing services include: RoHS, REACH, SVHC, CPSIA, Product Safety Testing to UL, CSA, EN and IEC standards, EMI/EMC Testing, Ecodesign, Packaging Testing, Performance Testing and Reliability Testing. We operate the World’s Largest Network of Testing Laboratories and operate in over 143 countries. For more information please contact us at 1-800-777-TEST or visit us online at www.us.sgs.com

Shenzhen Kunqi Xinhua Technology Co., Ltd.

5th FL, E-Building, 1st Factory, Xuegang North RD GangTou Community, Bantian, Longgang Dist. GuangDong, Shenzhen, 518129 China Phone: +86 755 89586020 x8013 nobeyan@kqxhsz.com

Shenzhen Weiwenxin Industrial Development Co.,Ltd

1383

Supporter

Room 2301-2302,2322-2323 Chuangzhan Center, Anhui Building, No.6007 Shennan Road, Futian District, Shenzhen City China Phone: +86-755-61319388 Ext 136 allen@wellinkmedia.com www.pcbsmt.cn Web: www.pcbsmt.cn We were professional media supplier with 13 year experiences in Shenzhen of China, ”Printed Circuit World” & “Surface Mount World” is the specialized industrial magazine that used for advertising and publicize in the whole PCB & SMT industry. We established the specialized website to collaborate all the suppliers, buyers and manufactures of the PCB and SMT industry to share the resources, news, technology, blog, research and analysis, and new products. Members from all around the world do business in our platform through our payment gateway. Shenzhen Weiwenxin Industrial Development Co., Ltd is the best electronics and equipment journal of the Asia.

104

SIEMENS Electronics Assembly Systems, LLC

2011

SiFO Technology Co., Ltd.

1278

3140 Northwoods Parkway, Suite 300 Norcross, GA 30071 Phone: +1 770-797-3000 Web: www.siplace.com Mark Ogden, Marketing Manager +1 770-797-3189, mark.ogden@siemens.com Vince Nuzzo, Sales Manager +1 856-218-8204, vince.nuzzo@siemens.com Siemens Electronics Assembly Systems is a leading supplier of surface mount technology (SMT) equipment, software, and services to the electronics assembly market. The spectrum of our products and services include an award-winning innovative and flexible platform, customized solutions, logistics, information technology, planning and consulting, as well as customized around-the-clock service and maintenance support. Building A, Room 211, 5 Xinghan St. Suzhou Industrial Park Suzhou, Jiangsu, China Phone: +86 512 67671380 sales@sifo-ltd.com David Zhang, Customer Representative Department Manager +86 13818681254, david_zhang@sifo-ltd.com Bob Warford, Account Manager - U.S. 408-667-5162, bob_warford@sifo-ltd.com As China’s most experienced in-circuit and functional test provider, SiFO designs, delivers and installs superlative test products and services for US OEMs building products in China. SiFO operates with US-level business standards, clear English communication and documented engineering processes, assuring the OEM that its contract manufacturer’s test process meets rigorous quality standards. SiFO’s China locations near major contract manufacturers mean responsiveness; its independence means clear feedback to the OEM of test status and quality information.

Simplimatic Automation

458

7401 Timberlake Lynchburg, VA 24502 Phone: +1 434-385-9181 sales@simplimatic.com Web: www.simplimatic.com Jeremy Vaughan, Director, Project Management and Service +1 434-385-9181 x295, jeremy.vaughan@simplimatic.com Frank Tiernay, Vice President, Sales +1 440-391-3127, frank.tiernay@simplimatic.com Simplimatic® Automation provides conveyors, customer support, and accessories that allow complete integration of electronics assembly lines. Products include connecting conveyor, FIFO/LIFO buffers, inverters, elevators, shuttles, gates, turns, work stations, magazine handlers, magazines, pallet handling, and custom automation systems.

Smart Sonic Stencil Cleaning Systems

1771

6724 Eton Avenue Canoga Park, CA 91303 Phone: +1 818-610-7900 smt@SmartSonic.com Web: www.SmartSonic.com Bill Schreiber, President +1 818-610-7900, Bill@smartsonic.com D.C. Kim +1 818-610-7900, dc@smartsonic.com The original ultrasonic stencil & pallet cleaning system and the only system verified environmentally safe, user safe and effective by the U.S. EPA. A complete turnkey process that is guaranteed to clean any type of solder paste from any fine-pitch stencil. Used by over 1000 SMT assemblers worldwide and time-tested since 1990. Also, AOI inspection systems for stencil/screen accuracy, material deposition and PCB assembly. Introducing EnviroGuard 100% closed-loop stencil cleaners!

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Smart Splice LLC

2275

881 Big Tree Road Sugar Grove, PA 16350 Phone: +1 814-489-5469 Web: www.smartsplice.com Larry Welk, Co-Owner and Sales Manager +1 814-489-5469, lwelk@smartsplice.com Curt Berstler, Co-Owner and Operations Manager +1 717-431-8653, cberstler@smartsplice.com Smart Splice LLC is the recognized leader in tape splicing materials and tools in the U.S., Canada and Mexico. We can supply customers with single splice, double splice, and special splice tapes; tape extenders, and cutting and splicing tools, as well as our new SmartCART all in one wheeled splicing station. Let us show you how much money you can save by splicing instead of upkeeping and buying extra tape feeders. Every company using a pick and place machine has the need, and we have all the solutions already in place!

SMH Technologies

1582

Via Giovanni Agnelli, 1 33083 Villotta di Chions, PN Italy Phone: +39 0434 421 111 info@smh-tech.com Web: www.smh-tech.com Luca Defend, Sales Manager +39 0434 421 111, luca.defend@smh-tech.com Derek Wright, Sales & Marketing +39 0434 421 111, derek.wright@smh-tech.com SMH Technologies is a global, independent, high-tech company, leader in Silicon Device In-System Programming and related services for the electronic boards manufacturing industry. FlashRunner series, the company’s professional Silicon Device In-System Programming platform, is the result of the decennial experience in micro-code encoding for 8-, 16- and 32-bit processors. FlashRunner helps our customers to enhance quality, save time and optimize manufacturing cycles. Our Intellectual Property portfolio, combined with strategic alliances with Silicon Device Manufacturers and ATE Producers, places the Company at the forefront of the device programming industry.

SMT - PennWell Technology Division

1474

PennWell 98 Spit Brook Road Nashua, NH 03062 Phone: +1 630-891-0123 Web: www.smtonline.com Karen Watkins, Publisher & Director of Sales +1 603-891-9118, karenw@pennwell.com SMT Magazine provides greater technical depth than any other publication of its type for OEMs and EMS providers who design, assemble, and test surface mounted printed circuit boards. The monthly magazine, Web site, biweekly E-Newsletter, and Webcasts provide the latest information and analysis on technological developments and industry trends in surface mount assembly. SMT has more than 40,000 subscribers who request SMT, all 100% qualified with purchasing power.

SMT Technologies

2224

60 Franklin Avenue Binghamton, NY 13901 Phone: +1 607-772-2900 Web: www.smttechnologies.com Don Burshnick, Owner +1 607-772-2900, info@smttechnologies.com Jim Webster, Sales +1 607-772-2900, info@smttechnologies.com SMT Technologies provides remanufactured SMT and Thru Hole equipment in the US and around the world. All our remanufactured machines include installation, warranty, spare parts, and we support all our remanufactured machines by phone, email, and field service.

IPC APEX EXPO™

SMT/HYBRID/PACKAGING 2010

1274

Sonoscan, Inc.

1924

Sono-Tek Corporation

1783

Rotebuehlstrasse 83-85 Stuttgart, D-70178 Germany Phone: +49 711 61946 75 sonja.salmen@mesago.com Web: www.smt-exhibition.com SMT/HYBRID/PACKAGING — is Europe’s leading exhibition and conference for System Integration in Micro Electronics. The event will provide a comprehensive overview of the sector from design and development, PCB production, component parts, placement technologies, through to testing equipment and the latest processes. 2149 East Pratt Boulevard Elk Grove Village, IL 60007 Phone: +1 847-437-6400 info@sonoscan.com Web: www.sonoscan.com James Ries, Western Regional Sales Manager +1 623-362-1695, jries@sonoscan.com Steven Martell, Technical Support Services Manager +1 847-437-6400, smartell@sonoscan.com Founded in 1973 and headquartered in Chicago IL, Sonoscan®, Inc. is a worldwide leader and innovator in Acoustic Micro Imaging (AMI) technology. Sonoscan offers acoustic microscopes and contract services for nondestructive inspection of products for hidden internal defects such as poor bonding, delaminations between layers, cracks and voids. 2012 Route 9W Milton, NY 12547 Phone: +1 845-795-2020 info@sprayfluxing.com Web: www.sprayfluxing.com Sono-Tek offers a full line of spray fluxing systems, both stationary and reciprocating for selective and edge-to-edge PCB fluxing that reduce maintenance and cut flux consumption by as much as 80%. Compatible with all fluxes, we provide uniform thin film coverage and excellent through-hole penetration for maximizing top-side fills. Sono-Tek has been a world leader in innovation and unsurpassed customer service for over 25 years, with thousands of spray fluxing systems worldwide. Sono-Tek also offers the EVS Solder Recovery System. By safely processing dross on sight, EVS can reduce solder consumption by up to 50% and de-drossing times by 85%.

Sony Manufacturing Systems America, Inc.

641

20381 Hermana Circle Lake Forest, CA 92630 Phone: +1 888-910-7669 smt@spt.sony.com Web: www.sonysms.com Vera Chang, Marketing Manager +1 949-770-8400 x227, vera.chang@am.sony.com Sony Manufacturing Systems America, Inc. (SMSA), leading provider of advanced SMT pick & place equipments, solder paste prints and AOI inspection machines. Showcasing the NEW SI-V200 AOI and SI-P850 Printer. The SI-G200 Dual-Head pick & place offers optimal placement efficiency in a small platform.

SPEA America

2065

2609 S. SW Loop 323 Tyler, TX 75701 Phone: +1 903-595-4433 Web: www.spea.com David Buhrkuhl, President +1 903-595-4433 x101, davidb@speaamerica.com Heidi Lockridge, Office Administrator +1 903-595-4433, heidil@speaamerica.com SPEA is exhibiting both the highly successful 4040 Flying Probe tester with the new MultiProbe technique, and the 3030 ICT machine with dual stage capability to perform simultaneous ICT and FLASH programming on two boards. Launched last year in Europe to critical acclaim, this range of highly modular test systems is now available in the Americas. Attendee Lanyard Sponsor

105

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Specialty Coating Systems

1635

7645 Woodland Drive Indianapolis, IN 46278 Phone: +1 317-244-1200 scssales@scscoatings.com Web: www.scsequip.com Bill Boyd, WW Equipment Sales Program Manager +1 317-472-1248, bboyd@scscoatings.com Carla Gillespie, Marketing Communications Manager +1 317-472-1290, cgillespie@scscoatings.com Specialty Coating Systems will be exhibiting new features on the SCS Precisioncoat spray and dispense system at APEX 2010. Stop by the booth to see the system’s programmable tilt and rotate, needle calibration, and fiducial recognition system in action, in addition to the system’s offline programming capabilities. SCS will also be exhibiting the Precisioncoat RTV dispense system, Cure ovens, Ionograph® ionic contamination test system, and the company’s Parylene conformal coating services and technologies.

Speedline Technologies, Inc.

373

16 Forge Park Franklin, MA 02038 Phone: +1 508-520-0083 info@speedlinetech.com Web: www.speedlinetech.com Erica Candela, Marketing Coordinator +1 508-541-4749, ecandela@speedlinetech.com Michele Collins, Marketing Coordinator +1 573-317-3077, mcollins@speedlinetech.com Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries.

Stoelting LLC

1258

502 Highway 67 Kiel, WI 53042 Phone: +1 920-894-2293 cleaning@stoelting.com Web: www.stoeltingcleaning.com Jim Timler, Sales & Marketing Manager +1 920-894-2293, jtimler@stoelting.com Tom Gordon, Senior Sales Engineer +1 920-894-2293, tgordon@stoelting.com Stoelting’s Cleaning Equipment Division designs and manufactures a complete line of cleaning equipment, including in-line cleaners for the electronics assembly and semi-conductor packaging industries. Superior cleaning and drying results, and the variety of configurations, will provide you a cost effective solution to your specific washing needs. Ask us about our Liquid Lock Technology for cost savings!

Sun Chemical

341

Suntech Circuits

573

21492 Kinsale Drive Lake Forest, CA 92630 Phone: +1 949-547-5528 stuart.down@sunchemical.com

5355 W. Chandler Boulevard Chandler, AZ 85226 Phone: +1 480-753-0771 scitro@suntechcircuits.com Web: www.suntechcircuits.com Suntech Circuits, Inc. “Your Printed Circuit Solution…since 1990” Suntech provides high quality, high value services. Covering the full spectrum of printed circuit requirements. Suntech offers quick-turn, low volume and full production capability with unprecedented customer support.

106

Taconic

807

136 Coonbrook Road Petersburg, NY 12138 addinfo@4taconic.com Web: www.taconic-add.com Thomas McCarthy, Vice President, New Business Dev’t. & Advanced Technology +1 518-658-3202 Ed Sandor, Applications Engineering Manager +1 507-263-4075 Taconic offers the widest range of high frequency laminates and prepregs used for fabrication of antennas, multilayer RF and high speed digital boards, interconnections and devices. Unique materials include low-loss prepregs, microwave laminates designed for low moisture and solvent resistance to enhance performance in difficult environments, and low-loss flexible laminates. New Product

Taiwan Printed Circuit Association (TPCA)

217

2/F No. 1069 Jung Jeng Road Taoyuan, 33000 Taiwan, ROC Phone: +886 3 3177272 service@tpca.org.tw Web: www.tpca.org.tw Mary Hsu, Specialist +886 3 317 7272, mary@tpca.org.tw Thomas Chen, Manager +886 3 317 7272, show@tpca.org.tw The Taiwan Printed Circuit Association (TPCA) was established in 1998. The TPCA is the only PCB industry organization approved by the government of Taiwan serving 540 member companies. TPCA aims to provide the latest market information, promote information exchange and resources among members through collaborative efforts, and attend international conventions.

Taiwan Union Technology Corporation 1025

803 Bo-ai St. Jhupei, Hsinchu County, 302-65 Taiwan Phone: +886 3555 1103 x115 Web: www.tuc.com.tw George Hsin, Director, International Sales/ Marketing & Strategy +886 3 555 1103, george.hsin@tuc.com.tw Gloria Teng, Manager, International Sales +886 3 555 1103, gloria.teng@tuc.com.tw TUC’s mission is to provide the highest quality, professional support, value-added base materials, and advanced mass lamination service to the global electronics industry. With integrity, honesty, and continuous innovation, TUC provides customers not only competitive pricing, but also quick response and short lead time to maximize customer value. TUC’s lead free compatible products are RoHS compliant and survive lead free assembly with SnAgCu alloys at 260°C. Proven in the assembly line and certified by major EMS providers, TUC base materials have low CTE, excellent dimensional stability, and are CAF resistant and cost effective. TUC’s environmentally friendly, high performance materials are the choice for your future. New Product

Taiyo America, Inc.

1041

2675 Antler Drive Carson City, NV 89701-1451 Phone: +1 775-885-9959 info@taiyo-america.com Web: www.taiyo-america.com Melanie Wylie Binzel, Sales & Marketing Administrator +1 775-885-9959 x139, melaniewb@taiyo-america.com David Vaughan, Marketing Manager +1 919-854-1828, davev@taiyo-america.com Taiyo America, Inc. is a subsidiary of TAIYO INK MFG. CO., LTD., the world’s leading manufacturer of specialty inks and solder masks for printed circuit boards. Based on Taiyo’s own proprietary technology, TAIYO’s PSR-4000 liquid photoimageable solder mask products have been patented throughout the world. We now offer conductive inks for manufacturing printed electronics, solar cells and other applications.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Tapco Circuit Supply

435

1225A Greenbriar Drive Addison, IL 60101 Phone: +1 630-925-2050 info@tapcocircuitsupply.com Web: www.tapcocircuitsupply.com Todd Palmer, VP Sales and Marketing +1 763-390-1075, tpalmer@tapcocircuitsupply.com Lisa Qualey, Customer Service Manager +1 763-390-1071, lqualey@tapcocircuitsupply.com Tapco Circuit Supply is a leading national supplier of materials and process solutions to the printed circuit industry. Tapco is proud to introduce our new laminate partner ITEQ, a leading supplier of halogen free and high performance materials. Please visit us at booth 435 or visit our websites at www.tapcocircuitsupply.com and www.iteq.com.tw. Visit us at www.tapcocircuitsupply.com

TDK - LAMBDA AMERICAS

1272

405 Essex Road Neptune, NJ 07753 Phone: +1 732-922-9300 x230 john.breickner@us.tdk-lambda.com Web: www.us.tdk-lambda.com/hp Genesys™ programmable AC/DC power. 750W to 15kW, Outputs 7.5 to 600VDC, current to 1000A. Worldwide Inputs, RS-232/485 Standard. Advanced Parallel Operation — four like units in parallel for 60kW. Common family controls. Flexible, reliable power for critical test systems and OEM products. RoHS Compliant. GPIB & LAN Options available.

TEAM A.T.E.

225

1039 Inca Street Denver, CO 80204 Phone: US: +1 303-628-7722 Taiwan: +886-3-696-0303 sales@team-ate.com Web: www.team-ate.com Greg Wendell, Account Manager +1 303-628-7722 x 116, greg@team-ate.com Victor Goldbaum, Account Manager +1 303-628-7722 x 152, victor@team-ate.com TEAM A.T.E., is an international dealer of pre-owned electronics manufacturing equipment. We specialize in Automatic Test Equipment used to test semiconductors and printed circuit boards in the manufacturing process. Many systems can be custom configured to meet your specific requirements. We buy, sell and rent a broad range of equipment. TEAM A.T.E. will be expanding its parts sales division in 2010, by offering Agilent/HP, GenRad and Teradyne parts. TEAM A.T.E. also Reps products for Teradyne, Focal Spot, Saki and Takaya. Call us today at 303-628-7722 for all your automated test equipment needs.

Technic Inc.

943

1 Spectacle Street Cranston, RI 02910 Phone: +1 401-781-6100 info@technic.com Web: www.technic.com Eric Stafstrom, Global Product Manager +1 401-784-4801, estafstrom@technic.com Tom Horigome, Imagining Product Manager +1 516-349-0700, thorigome@technic.com Offering a full line of PCB process chemistry, primary imaging products, solder mask, legend ink, controllers, process equipment and ongoing technical support. North American representative for Alfachimici and Nippon Paint products. Supplier of Automated Plating Systems, customized hoist and continuous vertical processing systems for panel, pattern and flexible materials.

Technical Devices Company

2041

Test & Measurement World

2238

Test Research USA, Inc.

1425

560 Alaska Avenue Torrance, CA 90503 Phone: +1 310-618-8437 sales@technicaldev.com Web: www.TechnicalDev.com Julio Montjoy, International Sales Director +1 310-618-8437, julio@technicaldev.com Roger Trovato, Director of Sales +1 310-618-8437, roger@technicaldev.com TECHNICAL DEVICES is the leading manufacturer of INLINE and BATCH AQUEOUS CLEANING EQUIPMENT. The NU/CLEAN Line of Touch Screen Controlled Aqueous Inline and Batch Cleaners can handle any cleaning challenge from complex circuit boards to glass lenses to batteries. We even offer a hybrid — natural gas model to meet your environmental and economical needs. We also offer the Nu/Era CV line of Wave Soldering Machines along with unmatched service and support. Established in 1952, no other company in the world can match the technical know how and the superior customer service of TECHNICAL DEVICES COMPANY! www.TechnicalDev.com 225 Wyman Street Waltham, MA 02451 Phone: +1 781-734-8658 Web: www.TMWorld.com Test & Measurement World is the leading publication for engineers involved in the electronics test, measurement, and inspection. Published for over 25 years, T&MW is regarded as the industry leader and has been voted the most-preferred publication in the industry in over 43 independent readership studies. T&MW provides practical content and industry updates for engineers and engineering managers worldwide. 500 Laurelwood Road, Suite 1 Santa Clara, CA 95054 Phone: +1 408-567-9898 sales@tri.com.tw Web: www.tri.com.tw Stephen Chang, Sales VP & GM +1 408-667-4752, stephenc@tri.com.tw Floyd Conner, Technical Engineering Manager +1 408-567-9898, floydc@tri.com.tw Total Test Solution! MDA, ICT, Functional Test, AOI, SPI, and AXI tester. Better Testing, Better Quality, Better Price, Better Performance. TRI provides the great electronics TEST solution. Our products are MDA (manufacture defects analyzer), ICT (in-circuit test), AOI (automatic optical inspection), SPI (solder paste inspection), and AXI (Automatic X-Ray In-Line Inspection) system. We are a test equipment manufacturer and we have a global sales and support facility. Our goal is help customer to REDUCE TEST COST and achieve HIGHER QUALITY.

Texmac/Takaya Corporation

859

3370 Montgomery Drive Santa Clara, CA 95054 Phone: +1 408-970-9171 sales@texmac.com Web: www.texmac.com Roy McKenzie, Sales Manager +1 408-970-9171, mckenzie@texmac.com Edward Byrne, South Western Regional Sales Manager +1 214-370-9975, edward-byrne@texmac.com Inventor and world leader in fixturless loaded board testers. Takaya fixturless testers offer unmatched reliability, accuracy, ease of use and programming for complete detection of manufacturing faults on loaded p.c. boards as well as power up capability, Boundery Scan, AOI and other inspection tools.

THERMAL News

BIN

7355 East Orchard Road, Suite 100 Greenwood Village, CO 80111 Phone: +1 720-528-3770 Web: www.thermalnews.com THERMAL News serves engineers and technical professionals involved in designing products or managing systems in which temperature is a critical performance factor.

WWW.THERMALNEWS.COM

IPC APEX EXPO™

107

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Ticer Technologies

1151

Tintronics Industries

2148

2555 W. Fairview Street, Suite 101 Chandler, AZ 85224 Phone: +1 480-223-0891 info@ticertechnologies.com Web: www.ticertechnologies.com Ticer Technologies manufactures TCRÂŽ, a sputtered thin film resistor copper foil that is used for embedding in-trace resistors into multilayer PWBâ&#x20AC;&#x2122;s. Benefits of embedded resistors include: freed surface space for active devices, improved performance and signal quality, and reduced PWB size. Available in sheet resistances of 25, 50, 100, 250, and 1000 ohms per square, TCR is thermally stable and provides reliable performance after PWB fabrication processes. It can be ordered on several laminate platforms through your laminate material supplier. 2122 Metro Circle Huntsville, AL 35801 Phone: +1 256-650-0220 sales@tintronics.com Tom Ott, Sales Manager +1 256-650-0220, tom.ott@tintronics.com

Tongling Haorong Electronic Technology Co. Ltd.

Tresky Corporation 816

1825

95 GA Highway 22 W. Milledgeville, GA 31061 Phone: +1 800-776-9888 sales@topline.tv Web: www.topline.tv Sam Otto, Sales Manager +1 800-776-9888 Dummy Components and Test Vehicle Boards and Practice Kits. Lead-Free Components & PC Boards for Machine Run & Solder Practice. BGA, CSP, and fine pitch. Also, complete line of ESD Static Control Products. www.esd.tv New Product

Totech America Corporation

2425

8275 South Eastern Avenue, Suite 200 Las Vegas, NV 89123 Phone: +1 877-379-2224 sales@totechamerica.com Web: www.totechamerica.com Kevin McCarten, President +1 877 379-2224 x 702, kevin.mccarten@xdry.com Russell McCarten, Manager +1 877-379-2224 x 704, russellm@totechamerica.com Totech America Corporation is the North American Master Distributor for XDRY brand Dry Cabinets. We offer a full line of desiccant dry cabinets and accessories for the electronics industry. We feature ultra low humidity control, all surfaces are ESD safe, optional items include cabinet heaters, N2 purge systems, reel racks. Custom interiors are also available.

108

1729

5 Trader Circle, Bldg. D Tyngsboro, MA 01879 Phone: +1 978-649-2400 sales@transitionautomation.com Web: www.transitionautomation.com Alden Lewis, Vice President of Sales +1 978-649-2400, alewis@transitionautomation.com Mark Curtin, President +1 978-649-2400, mcurtin@transitionautomation.com World-Class Permalex Squeegee Technology. The flexible selection and product durability bring maximum quality and production yield to end users. Available for all Printer Platforms PrinTEK SMT Stencil Printer Platform, featuring the VersaTilt Squeegee System. The printer is a fully functional fine-pitch batch style printer with integrated X, Y, & Theta precision micrometers and Pure-Verticle Stencil Lift-off provided by four synchronous CAMS. The printing platform is available in three PCB size formats. Available as a manual printer or may be upgraded with a powered squeegee and vision alignment system. New Product

No. 1 Zha Cun Road Economic & Technological Development Zone Tongling, Anhui, 562 China Phone: +86 562 2652070 Web: www.ahhret.com Shining Xiang, Staff +86 562 2652070, shining7192@163.com The main products of Tongling Haorong Technology are FR-4, epoxy woven glass fabric copper clad laminates, thin cores and prepregs used in double-sided and multi layer PCB, which are widely used by computer, communication device, automobile electronics and domestic appliances.

TopLine

Transition Automation, Inc.

1777

50 Route 9, Suite 304 Morganville, NJ 07751 Phone: +1 732-536-8600 sales@tresky.com Web: www.tresky.com Allen Weil, Vice-President, Sales & Marketing +1 732-536-8600, sales@tresky.com Tresky Corporation is a manufacturer of application independent manual, semiautomated and fully-automated die bonding, flip chip bonding, and component placement systems, as well as, SMD and Hybrid Rework Systems.

TUV Rheinland of North America

674

12 Commerce Road Newtown, CT 06470 Phone: +1 203-426-0888 info@tuv.com Web: www.us.tuv.com TUV Rheinland of North America is an independent testing organization that provides ISO 9001:2000, ISO 14001, TL 9000, ISO/TS 16949, AS9100, registration and certification services. TUV has the skills and expertise to guide your through the complete registration process. We are committed to helping manufacturing and service companies meet regulatory challenges and succeed both here and abroad.

U.S. Tech

1260

10 Gay St. Phoenixville, PA 19460 Phone: +1 610-783-6100 ustech@gim.net Web: www.us-tech.com Walter Salm, Editor +1 732-616-4716, wgsalm@gmail.com Jacob Fattal, Publisher +1 610-783-6100, ustech@gim.net US TECH, a monthly international hi-tech electronics publication reaches over 200,000 design engineers, manufacturing & production managers, buyers, product specifiers, and corporate management on the web and in print. We focus on new innovations in SMT, PCB design & fabrication, contract assembly, test equipment, components & distribution. Also available in Chinese on the web.

Ucamco USA

902

118 Melrose Drive Mission Viejo, CA 92692 Phone: +1 949-632-6895 Web: www.ucamco.com Luc Maesen, President Ucamco USA +1 949-632-6895, Luc.Maesen@Ucamco-USA.com Karel Tavernier, Managing Director Ucamco +32 9 216 9901, Karel.Tavernier@Ucamco.com UCAMCO NV is a market leader in the design and manufacturing of PCB CAM and laser photoplotting systems. We have more than 25 years continuous experience developing, supplying and supporting leading-edge front-end tooling solutions for the global PCB industry. We help fabricators world-wide raise yields, increase factory productivity, and cut enterprise risks and costs.

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. Underwriters Laboratories

914

Unicomp North America LLC

576

18/F Delta House 3 On Yiu Street Shatin, New Territories Hong Kong Phone: +852 2276 9247 Web: www.ul.com Truda Chow, Global Business Development Manager + 852 2276 9247, truda.chow@hk.ul.com Underwriters Laboratories (UL) is an independent, not-for-profit, global product safety testing and certification organization. Visit us for more information on our latest developments and how UL can assist you with your product safety certification. Be sure to join our Industry Association Group meeting to be held from 8-11 am on Friday, April 9th to hear what is new and provide your feedback on the market and your company’s needs.

4650 East Second Street, Suite C Benicia, CA 94510 Phone: +1 707-747-0201 Web: www.unicomp-na.com Jim Donner, Sales and Service Manager +1 408-456-1536, jim@unicomp-na.com Malcolm Montanjees, Sales and Marketing Manager +1 707-747-0201, malcolm@unicomp-na.com Unicomp Technology Co.,Ltd. was established in 2001. We are an international thinking hi-tech company providing turn-key solutions for the electronics industry. Our dedicated staff has been supporting the Electronics industry since 1990. Unicomp North America has been specifically created to provide high-quality affordable “Made in China” products for the assembly industry. Located out of San Jose with back up facilities in Benicia, California for both sales and service. New Product

Unicote - Halco LLC

1128

105 Route 101A, Unit 7 Amherst, NH 03031 Phone: +1 603-883-1183 Web: www.unicote-halco.com Ray Rose, President +1 603-883-1022, rayrose@unicote-halco.com Annie St Peter, Operations Mgr +1 603-883-1183, annie@unicote-halco.com UNICOTE-Halco LLC with corporate offices in Amherst, NH manufactures Horizontal Hot Air Leveling Equipment benefiting the PCB Industry with equipment sales and by supplying a Lead Free final finish product through our own service bureau under the name of UNICOTE-Finishes LLC. Each operation is positioned to support both rigid and flexible products.

United Resin Corporation

1547

4359 Normandy Court Royal Oak, MI 48073 Phone: +1 800-521-4757 Web: www.unitedresincorp.com John B. Los, Vice President +1 800-521-4757, losjb@aol.com Linda Lenk, Operations Manager +1 800-521-4757, urecepoxy@aol.com Global Manufacturer of electronic epoxies for potting, insulating, adhering and coating applications. Specializing in thermally conductive, technology advanced adhesives, one-component and UL approved systems. Special systems include optoelectronic, COB and SMT materials. We offer over 3,000 material combinations, allowing the system to be customized. We will contract custom potting and encapsulating.

IPC APEX EXPO™

Universal Instruments Corporation

1083

33 Broome Corporate Parkway Conklin, NY 13748 Phone: +1 607-779-5806 Web: www.uic.com Kristi Schilloff, Trade Show Coordinator +1 607-779-5806, schillof@uic.com Heinz Dommel, Director, Global Marketing +1 607-779-5189, dommel@uic.com Universal Instruments is a complete solutions provider and can assist with every aspect of your products life cycle, ranging from applied materials selection, prototype production builds, factory layout, as well as applications design and development. Universal will be showing the latest in semi-conductor technology, including our high accuracy single beam platform. As well as, our best-in-class Line Level software which can make prototyping, NPI, and set-up simpler. Technical experts from our Advanced Process Laboratory will also be available to discuss how we can assist with your manufacturing challenges. Visit us at Booth 1083 and learn how we can assist you!

UPA Technology

801

8963 Cincinnati-Columbus Road West Chester, OH 45069 Phone: +1 513-755-1280 mjustice@upa.com Web: www.upa.com UPA Technology provides instruments and thickness standards for measuring coating & plating thickness for the PCB & Electronics industries. UPA also provides XRF systems for RoHS and material analysis. Instruments include: X-Ray for plating thickness, RoHs and restricted element analysis. Handheld Beta Backscatter instruments for measurement of coatings and platings on PC boards, wafers and electronics. CopperDerm systems are also available for measuring surface copper thickness on laminate.

Uyemura International Corporation

1049

Valor Computerized Systems

2337

3990 Concours Street, Suite 425 Ontario, CA 91764 Phone: +1 909-466-5635 customerservice@uyemura.com Web: www.uyemura.com Anthony R. Revier, President +1 909-466-5635, trevier@uyemura.com Donald Walsh, National Sales Manager/Director of Operations +1 860-793-4011, dwalsh@uyemura.com Final finishes: NEW electroless nickel/immersion gold, RGA immersion silver, NEW RMK immersion tin and DIG immersion gold over copper. Uyemura’s electroless gold and palladium products; high throw electrolytic nickel; acid copper (including market leading via fill copper — EVF); Umicore Galvanotechnik’s precious metal electrolytic plating processes and MEC’s NEW, EVEN HIGHER TECHNOLOGY YET MORE COST EFFICIENT, LINE of specialty copper etching processes.

30211 Avenida de las Banderas, Suite 120 Rancho Santa Margarita, CA 92688 Phone: +1 949-586-5969 Web: www.valor.com Valor Computerized Systems is the world leader for productivity improvement software solutions covering all segments of the electronics, engineering and manufacturing industries. With more than 930 customers in 45 countries, we understand the complexity and dynamic nature of the electronics industry and the imposed business challenges facing our clients. Valor’s products create solutions which span from design verification and validation, planning, and integrated manufacturing execution systems (iMES). New Product

109

Exhibitors Listing DISCOVER. CONNECT. THRIVE. Vi TECHNOLOGY

1948

V-TEK Incorporated

Viscom Inc.

1273

Wiring Harness News

BIN

Wise srl

949

World Equipment Source (Owned by R-1 Source)

619

903 N. Bowser Road, Suite 202 Richardson, TX 75081 Phone: +1 972-235-1170 info@vitechnology.com Web: www.vitechnology.com Erin Krikstone, Administration Manager - Sales +1 972-235-1170, ekrikstone@vitechnology.com Jean-Marc Peallat, President - Americas +1 972-235-1170, jmpeallat@vitechnology.com ViTechnology® researches, develops, manufactures, markets and supports an extensive range of innovative state-of-the-art equipment and software solutions which increase productivity throughout electronics manufacturing lines while enhancing the quality of finished products. New Product

1775 Breckinridge Parkway, Suite 500 Duluth, GA 30096 Phone: +1 678-966-9835 Web: www.viscom.com Verena Zurhausen, Marcom Manager +1 678-966-9835, vzh@viscomusa.com Ed Moll, Western Regional Manager +1 678-966-9835, ed.moll@viscomusa.com Full range of automatic optical (AOI) and automatic X-ray (AXI) inspection equipment for PCB assembly. In-line Inspection of Paste, Placement, Post-Reflow, Post-Wave, and Selective Solder. 100% Solder Joint Inspection, including lead-free, to IPC standards. High speed and high performance solutions, 3D. Microelectronics inspection equipment for bond, thick film, and conductive glue.

Vision Engineering

1177

Vitronics Soltec

1073

570 Danbury Road New Milford, CT 06776 Phone: +1 860-355-3776 info@visioneng.com Web: www.visioneng.us Vision Engineering is a world leader in ergonomic eyepieceless stereo microscopes (Mantis, Lynx, Alpha and Beta) and non-contact measurement systems (Kestrel, Falcon and Hawk), combining quality control accuracy and repeatability. Visit: www.visioneng.us

2 Marin Way Stratham, NH 03885 Phone: +1 603-772-7778 info@us.vitronics-soltec.com Web: www.vitronics-soltec.com Mick Austin, Director of Sales and Key Accounts +1 603-773-6203, maustin@vsww.com Vitronics Soltec is a global leader in wave, reflow and selective soldering technologies featuring brands such as the award winning XPM series reflow ovens.

VJ Electronix

2059

234 Taylor Street Littleton, MA 01460 Phone: +1 978-486-4777 Web: www.vjelectronix.com Donald Naugler, General Manager +1 978-486-4777, dnaugler@vjt.com Kathleen Grant, Office Manager +1 978-486-4777 x 1216, kgrant@vjt.com VJ Electronix, Inc., is the leader in Rework technologies and global provider of advanced X-Ray inspection systems. VJ Electronix, Inc. manufactures production ready Rework and X-ray inspection solutions with advanced capabilities. The company primarily serves the Electronics Assembly and Semiconductor Packaging industries. VJ Electronix also is capable of developing complete turn key custom solutions. Operator and maintenance training, comprehensive service contracts, technical support, and spare parts, are available to simplify all aspects of owning and using all of our systems including legacy NIS and SRT technologies.

110

1539

751 Summit Avenue Mankato, MN 56001 Phone: +1 507-387-2039 info@vtekusa.com Web: www.vtekusa.com Stacy Anderson, Marketing Specialist +1 507-387-2039, s.anderson@vtekusa.com Cornel Cristea, Director of Sales and Marketing +1 507-387-2039, c.cristea@vtekusa.com Leading the way with innovative products for the tape and reel industry. Full line of manual and automatic equipment, component counters, peel force testers, and tape splicing. V-TEK also provides complete tape and reel service capabilities and SMD tape material distribution. Visit www.vtekusa.com for more information. P.O. Box 527 Richmond, IL 60071 Phone: +1 815-337-7885 Web: wiringharnessnews.com Kathy Freund, Circulation/Advertising Sales +1 815-337-7885, kfreund2000@yahoo.com Marilyn Magowan, Editor +1 877-315-8333, marilynmagowan@yahoo.com Wiring Harness News is a bi-monthly tabloid trade newspaper serving the wire, cable and fiber-optic processor. It targets wiring harness and cable assembly shops, cord set manufacturers, and thousands of companies that process electric wire and cable for use in their own product. Via Martinella 100/A Alberi Di Parma, 43010 Italy Phone: +39 0521 649 716 wise@wisecompany.it Web: www.wisecompany.it Stefano Gatti, Area Sales Manager +39 0521 649716, sgatti@wisecompany.it Massimo Fiorani, Area Sales Manager +39 0521 649717, mfiorani@wisecompany.it FLATSTAR — The Flatstar series is a grinding machine for removing all type of residues of resins, pastes and inks after the hole plugging process. This Single Side processing series is available in two different configurations with the in line option for automatic double side production.

8655 Production Avenue, Suite B San Diego, CA 92121 Phone: +1 858-693-1991 sales@wesource.com Web: www.wesource.com For over 20 years, WES has been supplying manufacturers of electronics with pre-owned equipment — primarily equipment used for PC board production and rework (insertion as well as SMT processes). WES has also been supplying clients with all levels of test and measurement equipment — instruments used for research and development as well as production. WES offers more than preowned equipment alone — such as liquidation, valuation, and auction services. In addition, WES offers new equipment — including work benches and test equipment racks. Buyers and sellers: please stop by our booth and see what WES can offer you!

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE. World Mastery Technology Ltd.

1824

5/F, World Wide Group Centre 24 On Chuen Street, On Lok Tsuen Fanling, N.T., Hong Kong Phone: +852 2415 9848 sales@worldmastery.com Web: www.worldmastery.com World Mastery Technology Ltd is a PCB manufacturer in China. We build 1-16L PCBs, HDI PCBs, with a wide range of RoHs finishings including Lead Free HAL, Immersion gold, Immersion Tin, Immersion Silver and OSP Entek. A monthly capability of 60,000 sqm ensure a steady supply and on time delivery.

XACT pcb Ltd.

819

Howard Street Commercial Centre North Shields, Tyne & Wear, NE301AR United Kingdom Phone: +44 77106 79469 stephen.laws@xactpcb.com Web: www.xactpcb.com Jeff Murdock, Applications Manager USA 181 535 45557, jeff.murdock@xactpcb.com Neil Chilton, Sales Director +44 7802 912236, neil.chilton@xactpcb.com XACTPCB is the world’s leading innovator in technologies for the control and prediction of PCB registration. New Product

XJTAG

1564

8 The Irwin Centre Scotland Road Dry Drayton, Cambridge, CB23 8AR United Kingdom Phone: +44 0 1954 213888 enquiries@xjtag.com Web: www.xjtag.com XJTAG is a leading global supplier of IEEE Std.1149.x compliant boundary scan development tools. Its boundary scan development system is a test suite with a range of software and hardware products that can enable you to debug, test and program electronic circuits quickly and easily. How much money can XJTAG save you? “XJTAG saves us over $100,000 per year by reducing the engineering time to commission new boards, enable us to repair boards more quickly, and reducing the number of boards that are scrapped.” Haliplex, Anthony Merry, CTO. Apply for your free trial at booth 1564 or visit www.xjtag.com New Product

X-Line Assets

1458

1161 Ringwood Court, #50 San Jose, CA 95131 Phone: +1 408-690-6725 Web: www.xlineassets.com X-Line Asset Management is a leading provider of disposition and auction services which help customers liquidate surplus assets to the global marketplace for the highest value. Whether organizations are in the market to purchase, sell, or value assets, X-line can offer flexible solutions for maximum benefits to your organization.

YXLON International Inc.

635

ZESTRON America

865

3400 Gilchrist Road Akron, OH 44260 Phone: +1 330-798-4800 yxlon@yxlon.com Web: www.yxlon.com Jay Burdette, Director of Sales & Marketing +1 330-798-4828, jay.burdette@yxlon.com David Chuang, Feinfocus West-electronics +1 408-457-7514, david.chuang@yxlon.com NEW from YXLON International. The leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics, introduces Y.Cheetah to its range of Feinfocus Solutions at APEX Expo. Y.Cheetah offers effortless high-quality X-Ray imaging via 1-click solutions for a wide range of continuous inspection tasks. The Y.Cheetah combines proprietary Feinfocus technology with advanced high-speed flat panel detector technology. Within seconds, Y.Cheetah adapts between inspection tasks — failure analysis, research and development, process control and product testing. 11285 Assett Loop Manassas, VA 20109 Phone: +1 703-393-9880 infoUSA@zestron.com Web: www.zestron.com Sabine Braun, Marketing Specialist +1 703-393-9880, s.braun@zestronusa.com Dr. Harald Wack, President +1 703-339-7330, h.wack@zestronusa.com High precision cleaning products and services for all required applications in the electronics manufacturing industry. ZESTRON’s unique MPC Technology (HMIS rating 0-0-0) gives water-based cleaning agents the performance of solventbased cleaners. ZESTRON’s state-of-the-art Application Technology Centers enable us to tailor our products specifically to your process requirements and provide the technical know-how for timely product quality assessments.

Advertiser Index BTU International. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Panasonic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

CircuiTree. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Pillarhouse USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Circuits Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Printed Circuit Design & Fab. . . . . . . . . . . . . . . . . . . . . . 63

Dow Electronic Materials. . . . . . . . . . . . . . . . . . . . . . . . 15

Printed Circuit World. . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

EFD Inc. A Nordson Company. . . . . . . . . . . . . . . . . . . . . 19

Schmid Systems Inc. USA. . . . . . . . . . . . . . . . . . . . . . . . 13

EMChina.org . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Smart Sonic Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

EMTWorldwide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

SMT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Everett Charles Technolgies. . . . . . . . . . . . . . . . . . . . . . 29

SMT/HYBRID/PACKAGING 2010. . . . . . . . . . . . . . . . . . . 11

Global SMT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Surface Mount World. . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

GPD Global. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

U.S. Commercial Service. . . . . . . . . . . . . . . . . . . . . . . . . 44

I-Connect007. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

ViTechnology. . . . . . . . . . . . . . . . . . . . . inside front cover

Isola Group. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

World Equipment Source. . . . . . . . . . . . . . . . . . . . . . . . . 39

JTAG Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

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901 Academic Poster Sessions and Silent Auction

112

www.IPCAPEXEXPO.org

DISCOVER. CONNECT. THRIVE.

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