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Invention Journal of Research Technology in Engineering & Management (IJRTEM) ISSN: 2455-3689 www.ijrtem.com Volume 1 Issue 12-Version-2 ǁ October. 2017 ǁ PP 61-70

Thermal and fluid characteristics of three-layer microchannels heat sinks Sana J. Yaseen1 , Abul Muhsin A, Rageb 2, Ahmed K. Alshara3 1,2,

(Mechanical, Engineering/ Basrah University, Iraq) 3 (Civil, Engineering/ Misan University, Iraq)

ABSTRACT : A heat sink with three layers of microchannels with different flow arrangements has been studied numerically using CFD fluent software version 15. The different flow arrangements using uniform and divergence channels on thermal characteristics of heat sinks at the same mass flow rate are investigated. The results indicated that, uniform channels with counter-flow 1 arrangement provide the best temperature uniformity and divergence channels with counter flow gives the best heat sink performance. KEYWORDS : Multilayered microchannel, Micro heat sink, Counter flow

I.

INTRODUCTION

The progress toward higher circuit density and quicker operation speed, claim a steady increase in the dissipative heat flux. Heat sink of microchannel design is a good choice for cooling of the high-power electronic device with a small volume. But as the devices or systems become smaller, heat flux increases. So an effective cooling strategy was required to dispersal heat [1]. Heat dissipation has become one of the key design tasks [2] and the successful design of micro-channel heat sinks requires dissipate the heat to the environment to maintain micro-devices at an acceptable temperature [3]. A large number of recent studies have carry out to study the basics of microchannel flow in multi-layered microchannels, the characteristics of flow and heat transfer in multi-layered microchannels are studied in the following fields: Vafai and Zhu (1999) [4] investigated counter flow arrangement for two layered microchannel heat sink numerically. They proved that the temperature rise on the base surface was reduced and the pressure drop for the two layered was smaller than that of the one layered heat sink. Wei and Joshi (2003) [5] developed stacked micro-channel heat sink using genetic algorithms. They indicated that the optimal number of layers for microchannel under constant pumping power of 0.01 W is 3. Skandakumaran et al. (2004)[6] studied single and multilayer channeled heat sinks analytically. They found that multi-layer heat sinks have lower thermal resistance compared to single layer. Also, they noticed that increasing the number of layers reducing the overall pressure drop. Alfieri et al. (2010)[7] studied three dimensional microchannels with cylindrical pin-fins experimentally and numerically. They developed CFD model of conjugate heat transfer in order to dissipated heat reach currently as high as 250 W/ cm2 in multilayer chip stacks of less than 0.3 cm3 volume. The performance of trapezoidal shape double layer microchannel heat sink was investigated by Sharma et al. (2013)[8]. They studied counter and parallel configuration. Their analysis showed that among various trapezoidal configurations, the one with larger side face to face was most suitable. Adewumi et al. (2014)[9] investigated a three-dimensional parallel and counter-flow for fluid flowing in single and two-layer microchannels inserted with circular micro pin fins numerically. Their results showed that the two-layer microchannel with counter flow was the best design in maximising thermal conductance and minimizing the temperature variation on the heated base. Lin et al. (2015) [10] investigated a three-dimensional model of multi-layered microchannel heat sinks numerically. They concluded that as the layer number increases, the multilayered MCHS can achieve a more uniform bottom wall temperature. The objective of the present work is to use heat sink contains three layers of microchannels to obtain good thermal performance for microelectronics devices at low pressure drop and good temperature uniformity on the heat sink.

II.

NOMENCLATURE

Ac cross-sectional area (m2) Ws total width of heat sink (m) Cp specific heat at constant pressure (kJ/kgK) Dh hydrulic diameter of micro-channel

Re Reynolds number T temperature (K) u velocity component in the x direction (m/s) v velocity component in the Y direction (m/s)

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