Global Semiconductor Assembly Test Services Market - Trends, Size, Share, Analysis to 2021

Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others

Persistence Market Research

Global Semiconductor Assembly and Testing Services Market is Expected to Increase US$ 39,050.7 Mn by 2021 Persistence Market Research

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others

Persistence Market Research Released New Market Report “Global Market Study on Semiconductor Assembly & Testing Services (SATS): To be Driven by Increasing Demand for High-End Packaging Solutions�, the semiconductor assembly & testing services market is estimated to be valued at US$ 29,585.9 Mn by the end of 2015 and is anticipated to expand at a CAGR of 4.7% from 2015 to 2021, to account for US$ 39,050.7 Mn by 2021.

Semiconductor Assembly and Testing Services (SATS) market are witnessing increased demand for outsourced SATS services. Presently, around half of the market is exploiting the Outsourced Semiconductor Assembly and Test (OSAT) services, and the trend is expected to continue in the long run. With increasing competition from the leading and regional players, the market is witnessing consolidation. This helps market participants in utilizing resources of other players to meet increasing technological demands.

Currently, the semiconductor assembly & testing services market across the world is mainly driven by factors such as increasing demand for mobility and connectivity in the consumer electronic products. An increasing demand for connected devices worldwide including smartphones and tablets having connectivity and multimedia capabilities are fuelling the demand for higher packaging technologies, setting up potential revenue opportunity for the SATS market. Additional features offered by SATS providers over in-house testing and packaging capabilities is also one of the primary reasons for the market growth. Additionally, SATS providers facilitate a more efficient supply chain and in-turn reduces time-to-market for a product, therefore SATS providers are becoming the primary choice of integrated design manufacturers.

Increased use of safety systems in the automobile industry is also one of the factors contributing to the growth of the SATS market. . However, factors such as the high capital requirement for offering higher end packaging solutions, fluctuations in exchange rates, and volatility in the market are expected to constrain the growth of the SATS market.

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others On the basis of services, the semiconductor assembly & testing services market has been segmented into assembly & packaging services and testing services. The assembly & packaging services segment is expected to account for 79.4% share of the global Semiconductor assembly & testing services market by 2015 end and is anticipated to increase at a CAGR of 4.9%, during the forecast period (2015–2021).

The Assembly and Packaging services segment is further classified on the basis of packaging solutions (interconnecting technologies) which includes copper and gold wire bonding, copper clip, flip chip, wafer level packaging, and TSV. Copper and gold wire bonding accounted for the 55.5%share of the assembly and packaging services segment in 2014.

The wafer level packaging (interconnecting technology) segment in the global SATS market is anticipated to expand at a CAGR of 9.2% during the forecast period.

On the basis of application, the semiconductor assembly & testing services market is segmented into communications, computing & networking, consumer electronics, industrial and automotive electronics. Among these, communication segment dominated the market in 2014 and is expected to account for 49.4% share of the global semiconductor assembly & testing services market by 2015 end. This segment is expected to expand at CAGR of 5.9% during the forecast period.

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Increasing adoption of tablets and wearable devices globally, is expected to drive the market growth of consumer electronics segment during the forecast period. Consumer electronics segment is analyzed to increase at a CAGR of 6.6% during the forecast period.

The report provides detailed information about various trends driving each segment and offers analysis and insights about the potential of the semiconductor assembly & testing services market in specific regions. On the basis of region, the semiconductor assembly & testing services market is segmented into six regions; among these, Taiwan is expected to dominate the market representing 46.5% share by the end of 2015. The market in the region is analyzed to represent largest market share by 2021 expanding at a CAGR of 5.8% during the forecast.

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Key players in global semiconductor assembly & testing services market include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI), GlobalFoundries and Chipbond Technology Corporation.

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others

Market History: The semiconductor industry is highly volatile in nature. Leading market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizes its expertise in enhancing the performance of the chipsets or ICs. Thus, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as Outsourced Semiconductor Assembly and Test Services (OSATS) Providers. Moreover, the shift of semiconductor processing technology to the larger wafers and smaller feature sizes has increased the cost of building a state-of-theart wafer fabrication factory. High CAPEX involved in wafer fabrication and its associated packaging and test operations has enforced semiconductor companies to remain fabless and instead focus on their core business. As a result, SATS providers have witnessed high demand in the past and are expected to be sole choice for fabless companies during the foreseeable future.

The global semiconductor assembly & testing services market is anticipated to expand at a CAGR of 4.7% during the period 2015-2021 to reach US$ 39,050.7 Mn by 2021.

The global semiconductor assembly & testing services market was valued at US$ 28,177.9 Mn in 2014. Increasing adoption of consumer electronics products including tablet PCs, wearable devices (smart watches, smart glasses, head mounted displays, fitness equipment etc.), gaming consoles, audio/video devices along with the rising penetration of smartphones in the communications segment is driving the overall SATS market growth. Additionally, growing technological advancements in next-generation cars (automotive electronics) equipped with enhancing car safety and management systems, are also driving the growth of SATS market.

In 2014, the assembly & packaging services segment was valued at US$ 22,298.9 Mn and is expected to account for US$ 23,494.8 Mn by the end of 2015. Advanced packaging solutions such as wafer level packages and flip chip are driving the market growth of packaging solutions (inter-connecting solutions) segment in the total SATS market.

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others In 2014, wafer level packaging segment was valued at US$ 3,508.9 Mn and is expected to reach US$ 3,800.6 Mn by the end of 2015. Growing adoption of wearable devices which mandates high performance with low power and thermal ratings, the demand for wafer-level packaging inter-connecting solution is expected to grow in the foreseeable future. This segment is analyzed to expand at a CAGR of 9.2% during the forecast period.

In 2014, consumer electronics application segment was valued at US$ 3,738.5 Mn and is analyzed to value US$ 3,999.6 Mn by the end of 2015.

Key players in global semiconductor assembly & testing services market include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI), Global Foundries and Chipbond Technology Corporation.

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others

Table of Content 1. Global Semiconductor Assembly and Testing Services Market- Executive Summary 2. Assumptions & Acronyms Used 3. Research Methodology 4. Market Overview 4.1. Introduction 4.1.1. Global Semiconductor Assembly and Testing Services Market Definition 4.1.2. Global Semiconductor Assembly and Testing Services Market Taxonomy 4.2. Global Semiconductor Assembly and Testing Services Market Dynamics 4.2.1. Drivers 4.2.2. Restraints 4.3. Value Chain 4.4. Global Semiconductor Assembly and Testing Services Market Forecast, 2015-2021 4.4.1. Global Semiconductor Assembly and Testing Services Market Size (Value) Forecast 4.4.1.1. Y-o-Y Growth Projections 4.4.1.2. Absolute $ Opportunity 4.5. Global Semiconductor Assembly and Testing Services Market Trends 4.6. Global Semiconductor Assembly and Testing Services Market Snapshot (2014) 4.6.1. Market Share By Services 4.6.2. Market Share By Packaging Solutions 4.6.3. Market Share By Applications 4.6.4. Market Share By Regions 5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services 5.1. Introduction 5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services 5.2.1. Assembly & Packaging services (Interconnecting technologies)

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 5.2.1.1.1. Copper and gold wire bonding 5.2.1.1.2. Copper clip 5.2.1.1.3. Flip Chip 5.2.1.1.4. Wafer Level Packaging 5.2.1.1.5. TSV 5.2.2. Testing Services 5.3. Basis Point Share (BPS) Analysis, By Services 5.4. Y-o-Y Growth Comparison, By Services 5.5. Market Absolute $ Opportunity, By Services 5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services 5.7. Qualitative Analysis 6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions 6.1. Introduction 6.2. Global Semiconductor Assembly and Testing Services Market Forecast By Packaging Solutions 6.2.1. Copper/gold Wire Bonding 6.2.2. Copper Clip 6.2.3. Flip Chip 6.2.4. Wafer Level Packaging 6.2.5. 3D TSV 6.3. Basis Point Share (BPS) Analysis, By Packaging Solutions 6.4. Y-o-Y Growth Comparison, By Packaging Solutions 6.5. Absolute $ Opportunity, By Packaging Solutions 6.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions 6.7. Qualitative Analysis

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications 7.1. Introduction 7.2. Global Semiconductor Assembly and Testing Services Market Forecast By Applications 7.2.1. Communications 7.2.2. Computing & Networking 7.2.3. Consumer Electronics 7.2.4. Industrial 7.2.5. Automotive Electronics 7.3. Basis Point Share (BPS) Analysis, By Applications 7.4. Y-o-Y Growth Comparison, By Applications 7.5. Absolute $ Opportunity 7.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions 7.7. Qualitative Analysis 8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region 8.1. Introduction 8.2. Global Semiconductor Assembly and Testing Services Market Forecast By Region 8.2.1. North America Market Value Forecast 8.2.2. Asia Pacific (Excluding Taiwan) Market Value Forecast 8.2.3. Taiwan Market Value Forecast 8.2.4. Europe Market Value Forecast 8.2.5. Middle East & Africa Market Value Forecast 8.2.6. Latin America Market Value Forecast 8.3. Y-o-Y Growth Projections, By Region 8.4. Basis Point Share (BPS) Analysis, By Region 8.5. Market Attractiveness Analysis, By Region

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 9. North America North America Semiconductor Assembly and Testing Services Market Analysis 9.1. Market overview 9.2. Introduction 9.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity 9.3. North America Semiconductor Assembly and Testing Services Market Forecast 9.3.1. Market Value Forecast By Services 9.3.1.1. Assembly & Packaging services 9.3.1.2. Testing services 9.3.1.2.1. Y-o-Y Growth Comparison, By Services 9.3.1.2.2. Basis Point Share (BPS) Analysis, By Services 9.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies) 9.3.2.1. Copper/gold wire bonding 9.3.2.2. Copper Clip 9.3.2.3. Flip Chip 9.3.2.4. Wafer level Packaging 9.3.2.5. 3D TSV 9.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions 9.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions 9.3.3. Market Value Forecast By Applications 9.3.3.1. Communications 9.3.3.2. Computing and Networking 9.3.3.3. Consumer Electronics 9.3.3.4. Industrial 9.3.3.5. Automotive Electronics 9.3.3.5.1. Y-o-Y Growth Comparison, By Applications 9.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications 9.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis 9.3.4.1. By Services 9.3.4.2. By Packaging Solutions 9.3.4.3. By Applications 9.3.5. Drivers & Restraints: Impact Analysis

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis 10.1. Market overview 10.2. Introduction 10.2.1. Y-o-Y Growth Projections, By Country 10.2.2. Basis Point Share (BPS) Analysis, By Country 10.3. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Forecast 10.3.1. Market Value Forecast By Country 10.3.1.1. China Absolute $ Opportunity 10.3.1.2. Japan Absolute $ Opportunity 10.3.1.3. Singapore Absolute $ Opportunity 10.3.1.4. Thailand Absolute $ Opportunity 10.3.1.5. Philippines Absolute $ Opportunity 10.3.1.5.1. Y-o-Y Growth Comparison, By Countries 10.3.1.5.2. Basis Point Share (BPS) Analysis, By Countries 10.3.2. Market Value Forecast By Services 10.3.2.1. Assembly & Packaging services 10.3.2.2. Testing services 10.3.2.2.1. Y-o-Y Growth Comparison, By Services 10.3.2.2.2. Basis Point Share (BPS) Analysis, By Services 10.3.3. Market Value Forecast By Packaging Solutions (Interconnecting technologies) 10.3.3.1. Copper/gold wire bonding 10.3.3.2. Copper Clip 10.3.3.3. Flip Chip 10.3.3.4. Wafer level Packaging 10.3.3.5. 3D TSV 10.3.3.5.1. Y-o-Y Growth Comparison, By Packaging solutions 10.3.3.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions 10.3.4. Market Value Forecast By Applications 10.3.4.1. Communications 10.3.4.2. Computing and Networking 10.3.4.3. Consumer Electronics

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 10.3.4.4. Industrial 10.3.4.5. Automotive Electronics 10.3.4.5.1. Y-o-Y Growth Comparison, By Applications 10.3.4.5.2. Basis Point Share (BPS) Analysis, By Applications 10.3.5. Semiconductor Assembly and Testing Services Market Attractiveness Analysis 10.3.5.1. By countries 10.3.5.2. By Services 10.3.5.3. By Packaging Solutions 10.3.5.4. By Applications 10.3.6. Drivers & Restraints: Impact Analysis 11. Taiwan Semiconductor Assembly and Testing Services Market Analysis 11.1. Market overview 11.2. Introduction 11.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity 11.3. Taiwan Semiconductor Assembly and Testing Services Market Forecast 11.3.1. Market Value Forecast By Services 11.3.1.1. Assembly & Packaging services 11.3.1.2. Testing services 11.3.1.2.1. Y-o-Y Growth Comparison, By Services 11.3.1.2.2. Basis Point Share (BPS) Analysis, By Services 11.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies) 11.3.2.1. Copper/gold wire bonding 11.3.2.2. Copper Clip 11.3.2.3. Flip Chip 11.3.2.4. Wafer level Packaging 11.3.2.5. 3D TSV 11.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions 11.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions 11.3.3. Market Value Forecast By Applications 11.3.3.1. Communications 11.3.3.2. Computing and Networking 11.3.3.3. Consumer Electronics

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 11.3.3.4. Industrial 11.3.3.5. Automotive Electronics 11.3.3.5.1. Y-o-Y Growth Comparison, By Applications 11.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications 11.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis 11.3.4.1. By Services 11.3.4.2. By Packaging Solutions 11.3.4.3. By Applications 11.3.5. Drivers & Restraints: Impact Analysis 12. Europe Semiconductor Assembly and Testing Services Market Analysis 12.1. Market overview 12.2. Introduction 12.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity 12.3. Europe Semiconductor Assembly and Testing Services Market Forecast 12.3.1. Market Value Forecast By Services 12.3.1.1. Assembly & Packaging services 12.3.1.2. Testing services 12.3.1.2.1. Y-o-Y Growth Comparison, By Services 12.3.1.2.2. Basis Point Share (BPS) Analysis, By Services 12.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies) 12.3.2.1. Copper/gold wire bonding 12.3.2.2. Copper Clip 12.3.2.3. Flip Chip 12.3.2.4. Wafer level Packaging 12.3.2.5. 3D TSV 12.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions 12.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions 12.3.3. Market Value Forecast By Applications 12.3.3.1. Communications 12.3.3.2. Computing and Networking 12.3.3.3. Consumer Electronics 12.3.3.4. Industrial

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 12.3.3.5. Automotive Electronics 12.3.3.5.1. Y-o-Y Growth Comparison, By Applications 12.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications 12.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis 12.3.4.1. By Services 12.3.4.2. By Packaging Solutions 12.3.4.3. By Applications 12.3.5. Drivers & Restraints: Impact Analysis 13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis 13.1. Market overview 13.2. Introduction 13.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity 13.3. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Forecast 13.3.1. Market Value Forecast By Services 13.3.1.1. Assembly & Packaging services 13.3.1.2. Testing services 13.3.1.2.1. Y-o-Y Growth Comparison, By Services 13.3.1.2.2. Basis Point Share (BPS) Analysis, By Services 13.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies) 13.3.2.1. Copper/gold wire bonding 13.3.2.2. Copper Clip 13.3.2.3. Flip Chip 13.3.2.4. Wafer level Packaging 13.3.2.5. 3D TSV 13.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions 13.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions 13.3.3. Market Value Forecast By Applications 13.3.3.1. Communications 13.3.3.2. Computing and Networking 13.3.3.3. Consumer Electronics

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 13.3.3.4. Industrial 13.3.3.5. Automotive Electronics 13.3.3.5.1. Y-o-Y Growth Comparison, By Applications 13.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications 13.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis 13.3.4.1. By Services 13.3.4.2. By Packaging Solutions 13.3.4.3. By Applications 13.3.5. Drivers & Restraints: Impact Analysis 14. Latin America Semiconductor Assembly and Testing Services Market Analysis 14.1. Market overview 14.2. Introduction 14.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity 14.3. Latin America Semiconductor Assembly and Testing Services Market Forecast 14.3.1. Market Value Forecast By Services 14.3.1.1. Assembly & Packaging services 14.3.1.2. Testing services 14.3.1.2.1. Y-o-Y Growth Comparison, By Services 14.3.1.2.2. Basis Point Share (BPS) Analysis, By Services 14.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies) 14.3.2.1. Copper/gold wire bonding 14.3.2.2. Copper Clip 14.3.2.3. Flip Chip 14.3.2.4. Wafer level Packaging 14.3.2.5. 3D TSV 14.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions 14.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions 14.3.3. Market Value Forecast By Applications 14.3.3.1. Communications 14.3.3.2. Computing and Networking 14.3.3.3. Consumer Electronics 14.3.3.4. Industrial

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others 14.3.3.5. Automotive Electronics 14.3.3.5.1. Y-o-Y Growth Comparison, By Applications 14.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications 14.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis 14.3.4.1. By Services 14.3.4.2. By Packaging Solutions 14.3.4.3. By Applications 14.3.5. Drivers & Restraints: Impact Analysis 15. Competition Landscape 15.1. Competition Dashboard 15.2. Competitive Strategies 15.3. Market Structure 15.4. Company Profiles 15.4.1. ASE Group 15.4.1.1. Revenue 15.4.1.2. Products/Brand Offerings 15.4.1.3. Company Highlights 15.4.2. Amkor Technology Inc. 15.4.3. STATS chipPAC Ltd. (JCET) 15.4.4. Powertech Technology Inc. 15.4.5. Silicon Precision Industries Company Ltd. 15.4.6. CORWIL Technology Corp.

15.4.7. Chipbond Technology Corporation 15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.) 15.4.9. GlobalFoundries Inc.

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others List of Tables Table 1: Global Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn) Table 2: Global Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn) Table 3: Global Semiconductor Assembly and Testing Services Market Size Forecast By Applications (US$ Mn) Table 4: Global Semiconductor Assembly and Testing Services Market Size Forecast By Geography (US$ Mn) Table 5: North America Semiconductor Assembly and Testing Services Market Value Forecast

By Services (US$ Mn) Table 6: North America Semiconductor Assembly and Testing Services Market Value Forecast

By Packaging Solutions (US$ Mn) Table 7: North America Semiconductor Assembly and Testing Services Market Value Forecast

By Applications (US$ Mn) Table 8: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Country (US$ Mn) Table 9: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn) Table 10: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn) Table 11: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn) Table 12: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn) Table 13: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn) Table 14: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn) Table 15: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Table 16: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn) Table 17: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn) Table 18: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn) Table 19: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast by Packaging solutions (US$ Mn) Table 20: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn) Table 21: Latin America Semiconductor Assembly and Testing Services Market Value Forecast

By Services (US$ Mn) Table 22: Latin America Semiconductor Assembly and Testing Services Market Value Forecast

By Packaging Solutions (US$ Mn) Table 23: Latin America Semiconductor Assembly and Testing Services Market Value Forecast

By Application (US$ Mn) List of Figures Figure 1: Global Semiconductor Assembly and Testing Services Market Incremental Opportunity, 2014–2021 Figure 2: Global Semiconductor Assembly and Testing Services Market Revenue by Services, 2014 Figure 3: Global Semiconductor Assembly and Testing Services Market Revenue By Application, 2014 Figure 4: Global Semiconductor Market Absolute $ Opportunity, 2014–2021 Figure 5: Global Semiconductor Market Y-o-Y Growth, 2014–2021 Figure 6: Global Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 7: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth, 2014– 2021 Figure 8: Global Semiconductor Assembly and Testing Services Market – Scenario Forecast Figure 9: Market value of IoT devices, 2013 – 2020

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Figure 10: Fluctuation in exchange rates, 2010–2015 (US$/NT$) Figure 11: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021 Figure 12: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021 Figure 13: Global Assembly & Packaging Services Segment Absolute $ Opportunity, 2014– 2021 Figure 14: Global Testing services Segment Absolute $ Opportunity, 2014–2021 Figure 15: Global Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021 Figure 16: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021 Figure 17: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021 Figure 18: Global Copper Wire & Gold Wire Bonding Segment Absolute $ Opportunity, 2014– 2021 Figure 19: Global Copper Clip Segment Absolute $ Opportunity, 2014–2021 Figure 20: Global Flip Chip Segment Absolute $ Opportunity, 2014–2021 Figure 21: Global Wafer Level Packaging Segment Absolute $ Opportunity, 2014–2021 Figure 22: Global TSV Segment Absolute $ Opportunity, 2014–2021 Figure 23: Global Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021 Figure 24: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021 Figure 25: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021 Figure 26: Global Communications Segment Absolute $ Opportunity, 2014–2021 Figure 27: Global Computing & Networking Segment Absolute $ Opportunity, 2014–2021 Figure 28: Global Consumer electronics Segment Absolute $ Opportunity, 2014–2021 Figure 29: Global Industrial Segment Absolute $ Opportunity, 2014–2021 Figure 30: Global Automotive electronics Segment Absolute $ Opportunity, 2014–2021 Figure 31: Global Semiconductor Assembly and Testing Services Market Attractiveness by Application, 2015–2021

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Figure 32: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Geography, 2014 & 2021 Figure 33: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Geography, 2014–2021 Figure 34: Global Semiconductor Assembly and Testing Services Market Attractiveness by Geography, 2015–2021 Figure 35: North America Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 36: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021 Figure 37: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021 Figure

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Attractiveness by Applications, 2015–2021 Figure 45: APAC Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 46: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By countries, 2014 & 2021 Figure 47: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison By countries, 2014–2021

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Figure

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Attractiveness by Packaging Solutions, 2015–2021 Figure 55: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021 Figure 56: APAC Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021 Figure 57: APAC Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021 Figure 58: Taiwan Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 59: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021 Figure 60: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021 Figure 61: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021 Figure 62: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021 Figure 63: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Figure 64: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021 Figure 65: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021 Figure 66: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021 Figure 67: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021 Figure 68: Europe Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 69: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021 Figure 70: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021 Figure 71: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021 Figure 72: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021 Figure 73: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021 Figure 74: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021 Figure 75: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021 Figure 77: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021 Figure 78: MEA Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 79: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021 Figure 80: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Figure 81: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021 Figure 82: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021 Figure 83: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021 Figure 84: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021 Figure 85: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021 Figure 86: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021 Figure 87: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021 Figure 88: Latin America Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021 Figure 89: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021 Figure 90: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021 Figure

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Attractiveness by Services, 2015–2021 Figure 92: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021 Figure 93: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021 Figure

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Attractiveness by Packaging Solutions, 2015–2021 Figure 95: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Application, 2014 & 2021 Figure 96: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021

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Global Semiconductor Assembly Test Services Market Market is Segmented by Copper Wire and Gold Wire Bonding, Copper Clip and others Figure

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Attractiveness by Applications, 2015–2021 Figure 98: Market Share Analysis (%), 2014 About Us:

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