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2 . J. Allgair, G. Chen, S. Marples, D. Goodstein, J. Miller, and F. Santos; “Feature Integrity Monitoring for Pro c e s s C o n t rol Using a CD SEM,” Metro l o g y, Inspection, and Process Control for Microlithography XIV, Neal T. Sullivan, E d i t o r, Proceedings of SPIE Vol. 3998, pg. 227-231, SPIE, Bellingham, WA, 2000. 3. D. M. Goodstein, B. Choo, B. Singh, “Correlation Flagging of i-Line Lithographic Process Drift,” KLA-Tencor CD SEM Users Group Meeting, Santa Clara, CA, 1999. 4. 8xxx Series CD SEM Operation Manual (v3.1.X), KLA-Tencor Corporation, 2000.
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5. 8xxx Series CD-SEM Application Note, “Measuring Edge Peak Widths for Process Characterization,” KLA-Tencor Corporation, 1999. 6. S.M. Sze, Editor, VLSI Te c h n o l o g y, Second Edition, McGraw Hill, 1988.
A version of this article was originally published in SPIE Proceedings Vol. 4344, paper 108, entitled “Using Pattern Quality Confirmation to Control a Metal-level DUV Process with a Top-down CD-SEM” by Chien-Sung Liang; Haiqing Zhou. Mark Boehm, Ricky Jackson (KFAB Photolithography Module, Texas Instruments); Chih-Yu Wang, Mike Slessor (KLA-Tencor Corporation).
KLA-Tencor Trade Show Calendar September 17-19
SEMICON Taiwan, Taipei, Taiwan
September 19-20
Diskcon USA, San Jose, California
October 3-4
BACUS, Monterey, California
October 6-11
AEC/APC, Banff Canada
October 30-November 1
ITC, Baltimore, Maryland
November 26-30
Fall MRS, Boston, Massachussetts
December 5-7
SEMICON Japan, Makuhari, Japan
February 5-7
SEMICON Korea, Seoul, Korea
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Summer 2001 Yield Management Solutions