Product News AIT II In-Line Defect Inspection System
The industry’s first 300 mm bridge tool for sub-0.18 µm design rules, the AIT II offers exceptional defect sensitivity, high throughput and low cost-of-ownership for fast and accurate feedback on process tool performance as well as advanced line monitoring for films, CMP, non-critical etch and photo modules. The AIT II detects particle and pattern yield-limiting defects at up to 40 wafers per hour at maximum sensitivity, independent of device type. Further, the system’s MultiSpot™ feature provides tremendous inspection flexibility by offering multiple, operator-selectable sensitivity setting options — large, medium, and small spot — that can be optimized based on whether the inspection system is used for line monitoring or tool monitoring. circle RS#030
2401 Automated Macro Defect Inspection System
KLA-Tencor’s 2401 system is the industry’s first fully automated inspection system designed to detect yield-killing macro defects (50 µm and larger) generated in the lithography process. Replacing current manual after-develop inspection (ADI) methodologies where operators miss up to 80 percent of photo-related defects, the 2401 enables reliable and repeatable detection of critical macro defect types, preventing further investment in low-yielding wafers and dramatically reducing scrap/yield loss further downstream in the manufacturing process. In addition, the 2401 system allows advanced production and engineering analysis never before possible using manual macro ADI, enabling continuous process improvements for maximum ROI in minimum circle RS#034 time. FabVARS 500 Digital Image Management System
To serve the current image management requirements in the semiconductor industry, the FabVARS 500 stores and retrieves images generated from a broad variety of on-line and off-line image generating systems. While previous generation systems accepted and stored images only in analog format, the recent migration of many image producing systems to a pure digital format has rendered this capability inadequate. The FabVARS 500 accepts and stores both analog and digital images in a digital format, enabling the system to be connected to a wider variety of tools and yield enhancement systems. This in turn allows wider deployment within manufacturing facilities for faster resolution of yield problems. SEMSpec Random Mode
KLA-Tencor’s SEMSpec advanced e-beam inspection system enables faster time to results with its unique voltage contrast capabilities and 0.1 µm sensitivity for sub-0.25 µm fabs. It meets the challenges of today’s high aspect ratio structures, new materials and damascene processing. Engineers quickly identify killer defects with advanced SEM-based inspection in Array mode. For increased capability and additional flexibility, SEMSpec now offers Random mode, or die-todie comparison. Without being limited to repeating array features, a larger part of the device can be inspected. With increased capabilities in advanced e-beam inspection, SEMSpec continues to add value and a strong competitive edge for process development, process transfer, and line auditing in leading-edge fabs. circle RS#010 50
Spring 1999
Yield Management Solutions
8100XP-R Advanced Reticle Metrology System
The 8100XP-R CD SEM is the newest addition to KLA-Tencor’s 8100 family of CD SEMs. In addition to its outstanding wafer metrology and imaging capabilities, the 8100XP-R is optimized for reticle-specific applications. The XP optics, combined with ACE™ (Advanced Charge Elimination), provides a stable, repeatable imaging system for chrome-on-glass and phase shift masks. The enhanced resolution of the 8100XP-R enables the accurate characterization of optical proximity correction features, and extends the linear range of measurements to below 0.15 µm, thus providing precise measurements into the sub-100 nm realm. The 8100XP-R is the advanced reticle metrology solution for tomorrow's reticles. circle RS#037 5300 Overlay Metrology System
KLA-Tencor’s 5300 overlay metrology system enables metrology and lithography engineers to control lithography tools down to the 0.13 µm level. It is the first system of its kind to meet these design criteria. A bridge tool designed to handle both 200 and 300 mm wafers, the 5300 enables tighter overlay budgets and improved overlay control. With the fastest time to results, it maximizes utilization of expensive lithography tools by minimizing idle time. The 5300 is the only overlay system that can measure low-contrast targets resulting from CMP and STI processing consistently and reliably, using a single recipe. It also features optional KLASS 4.0 for Windows analysis software for stepper-specific registration control, and recipe database managecircle RS#038 ment (RDM). StarLight™ SL3UV Reticle Contamination Inspection System
SL3UV is KLA-Tencor‘s new UV-based reticle contamination inspection system for sub-wavelength (low k1) lithography. Sub-wavelength lithography has increased reticle defect printability, created new UV-specific defect classes, and accelerated advanced reticle deterioration, threatening yield and profitability. The SL3UV is the first UV contamination inspection system to detect new defect classes, including transmission defects and wavelength-dependent contaminants such as organic defects and gallium stains. The SL3UV can also inspect Tri-Tone PSMs and reticles with advanced OPC assist bars as well as provide the sensitivity and minimum linewidth required for the inspection of reticles for 4X lithography design rules at 0.18, 0.15 and 0.13 µm. 363UV Reticle Pattern Inspection System
KLA-Tencor recently added the 363UV model to the 300UV Series of Reticle Inspection Systems to increase inspection productivity and turn time for many advanced DUV reticles where slowdowns were occurring with the previous 353UV model. The 363UV model includes a 300 MHz Sun Microsystems Ultra60 workstation with 68 GB of available hard disc storage for faster data preparation. Also included is a C3 or C5 rendering hardware upgrade from the previous C2 or C4 to improve inspection times for some high figure count reticles. KLA-Tencor is offering: new systems, field upgrades of a 353UV, or exchanges of an older generation 351. Spring 1999
Yield Management Solutions
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