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Flexibility — A Defining Factor for 300 mm
As the industry moves towards 300 mm wafers, the emerging challenges could be classified into two major categories: technology-based, such as those relating to shrinking critical dimensions, new deposition methods and planarization, and logistics-based, such as wafer handling, robotics, materials production and plant design. Among logistics-based issues, the flexibility of systems and processes will be critical as billion dollar fabs are ever more tightly designed to minimize space requirements and maximize productivity. Automated wafer and information handling must be performed in a fully computer integrated manufacturing (CIM) environment. Flexibility may well become a defining factor for the coming 300 mm generation. The benefits of modularity
When KLA-Tencor merged in May 1997 bringing together an extensive breadth of inspection and measurement products, the company recognized the value of creating a modular handling system around which the company’s portfolio of 300 mm products could be built. Modular wafer handling design can enable faster time-to-market for new products, simpler user interfaces that lower training requirements, and reduced maintenance complexity. At the time of the merger, each division developed dedicated handling systems for their products. Due to the redundant engineering cost and effort this created, typically only one configuration was developed. This limited the flexibility the company was able to offer customers for integration of the system into their fab.
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Summer 1998
Yield Management Solutions
A flexible solution
In August 1997, KLA-Tencor chartered a new Robotics and Integrated Technologies (RITe) division to develop a flexible and modular wafer handling system tailored to meet the needs of 300 mm wafers. Less than a year later, a single modular solution with multiple different configurations are available for integration into new 300 mm KLA-Tencor tools, including front and side loading, open cassette and FOUP carrier options. Several systems built on this handler are already available, including the ASET-F5 film measurement system and the RS-100 resistivity tool, and others are in progress. With robotic wafer handling development now centralized, products are brought to market faster with a broader variety of configurations since the time required to develop handling systems is effectively minimized. The RITe group, headed by Robert Howe, has also focused on simplifying the robotics involved in the handling system. Where there may have been up to nine robots in some prior designs, the group has developed the new system to contain only three. “It’s an interesting paradox,” said Howe. “We’ve actually made 300 mm wafer handling, which is supposed to make everything more complicated, simpler in this context!” The development of the modular wafer handling platform is only one piece of what will be required to meet the complex needs of the 300 mm CIM environment. Resolving logistical issues such as automated wafer handling, however, must occur in order to help meet the multitude of technical challenges that clearly still lie ahead.