Product News TeraStar SLF77
The TeraStar SLF77, the latest version of KLA-Tencor’s series of advanced reticle inspection systems, provides high-performance, high-sensitivity die-to-database inspection that meets critical layer requirements for 130 nm production and 100 nm research and development. Database rendering capabilities include advanced database modeling, high-precision algorithms, and high-speed image-computing hardware. Reticle defect detection features include advanced Tera algorithms that enable high-sensitivity inspection and low false-defect counts. Advanced image-computing capabilities allow inspection of small linewidths and optical proximity correction (OPC) features, including sub-resolution assist features.
TeraPro HP high productivity mode
The TeraPro HP High Productivity Mode, a feature of the TeraStar SLF77 reticle inspection system, provides pattern, contamination and must-be-black (MBB) border inspections all in one inspection, saving time and increasing productivity. This multi-faceted inspection using MBB inspects for yieldkilling pinhole defects in the opaquing border, eliminating the need for an extra inspection. With TeraPro HP, multiple algorithms now run concurrently in multiple areas. Concurrent inspection modes—STARlight and die-to-die or STARlight and die-to-database—save time by reducing the number of inspection passes performed in the reticle flow.
Viper 2430
The Viper 2430 is an automated macro-defect inspection system for inspecting 300 mm wafers using a multi-channel, multi-algorithm setup to capture yield-limiting defects at design rules of 0.13 µm and below. Built upon the extensive knowledge base developed in the field with customers who use the 2401 (the Viper 2430’s predecessor), this system is ideal for process modules such as litho, CMP, and etch, or in passivation and final inspection. It also captures defects in advanced processes and materials such as copper dual damascene, low-κ dielectrics, and silicon-oninsulator (SOI). The Viper 2430 plays an important role in a fab’s overall strategy to improve yield because it also monitors process excursions. It complies with all I300I factory-automation standards for immediate and seamless integration into the 300 mm production environment. For rapid dispositioning of wafer lots and faster root-cause analysis, the Viper 2430 features inline binning and flexible, on-board review capability that allows users to view individual defect images, wafer maps, wafer images, and galleries of wafer maps. 66
Winter 2002
Yield Management Solutions
Surfscan SP1 backside inspection module
Available as an option on both the Surfscan SP1TBI and Surfscan SP1DLS, the backside inspection module (BSIM) provides full edge handling and enables fabs to perform automatic, non-destructive inspection of both sides of a wafer, including the backside of patterned production wafers. Manufacturers can now control backside contamination and damage. They can also monitor the effectiveness of backside cleans between process modules, and ultimately reduce yield loss due to particle-induced hot spots and other defects that result from backside contamination. The module also supports 200 mm and 300 mm wafer manufacturing and advanced processes such as copper, low-κ dielectrics, and design rules of 0.13 µm and smaller.
µLoop™
µLoop (MicroLoop) is the industry’s first inline, non-contact electrical defect monitoring solution designed to help chipmakers speed time to market and time to profit. The µLoop solution reduces the length of each electrical yield-learning cycle within the fab from as much as eight weeks down to as little as a few days. This enables chip manufacturers to substantially accelerate the production ramp of new IC technologies while, at the same time, increasing their baseline yields. µLoop’s speed and accuracy in isolating the location of electrical defects is made possible by utilizing a combination of seamlessly integrated capabilities, including: (a) patented test structures, which replicate customer-specific design rules and products; (b) latest-generation eS20XP scanning e-beam inspection and µLoop Controller systems, which use a voltage-contrast technique to identify and characterize electrical defects; (c) advanced electrical defect and yield-analysis algorithms, which filter out non-yield relevant defects; and (d) industryleading yield-acceleration expertise.
Winter 2002
Yield Management Solutions
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Attend KLA-Tencor’s 3rd Annual Lithography Users Forum Sunday, March 3rd, 2002 Techmart, Santa Clara, CA w w w. k l a - t e n c o r. c o m / s p i e
Register and submit poster papers online. R S V P by F r i d ay, F e b r u a r y 2 2 n d , 2 0 0 2 .
K Accelerating Yield