TUG '07 by LIMA Design

HOLLYWOOD NIVERSAL HOTEL SHERATON U

APRIL 23-25 Because Testing Mat ters Teradyne, Inc. 600 Riverpark Drive North Reading, MA 01864 978-370-2700 www.teradyne.com

Teradyne® is a registered trademark of Teradyne, Inc. All brands and product names are trademarks or registered trademarks of Teradyne, Inc., including its subsidiaries. ©2007 Teradyne, Inc. • All rights reserved.

HOLLYWOOD•APRIL 23-25 TUG 2007 STEERING COMMITTEE Chair Kevin Walt, Broadcom Vice Chair Johnny Steck, Texas Instruments Secretary Donna McNeill, Teradyne, Inc. Treasurer/Registrar Nancy Wenstrom, Teradyne, Inc. ASSEMBLY TEST Mil/Aero Todd Bigham, U.S. Air Force Teresa Lopes, Teradyne, Inc SEMICONDUCTOR TEST Digital Tom Munns, Freescale Semiconductor Mike Patnode, Teradyne, Inc. Mixed Signal Rainer Fink, Texas A & M Zak Zakour, Teradyne, Inc. Power Management/Automotive Tim McCoy, Texas Instruments Chris Quaranta, Teradyne, Inc Production Integration & HW/SW Interface Larry Grieve, Freescale Semiconductor Marcel Jussaume, Teradyne, Inc. RF Wireless Mike Bellanger, NXP Semiconductors Greg Renk, Teradyne, Inc.

Daily Session Grids ..............................6 Semiconductor Test Program

• Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 • Mixed Signal . . . . . . . . . . . . . . . . . . . . . . . . .21 • Power Management/Automotive . . . . . .28 • Product Integration & Hardware/Software Interface . . . . . . . . . .34

• RF Wireless . . . . . . . . . . . . . . . . . . . . . . . . . .42 Assembly Test Program

• Mil/Aero . . . . . . . . . . . . . . . . . . . . . . . .48

Semiconductor Delegates-at-Large Jessica Faulkner, Teradyne, Inc. Zoltan Goldschmidt, Teradyne, Inc. Karin Mogler, Teradyne, Inc. Bill Wyckoff, Teradyne, Inc.

CONFERENCE INFORMATION

Letter from the Chairman

If you are reading this, Dear TUG 2007 Attendees – Welcome to the Sheraton Universal Hotel, here in beautiful Southern California (my home town) As you are here, you have accepted the challenge to take on this “daring adventure”. The Teradyne Users Group Conference has continued for over 24 years with the “best in test” sharing the tools and methods that work in the never ending quest to reduce the cost of test and deliver the best possible products to the consumer. The 2006-2007 Steering Committee has put together 3 days of technical papers, presentations and tutorials by the brightest engineers in test today. TUG continues to be the place where the test community gathers to share new techniques, discuss new challenges and breakthroughs in the use of Teradyne equipment, as well as discussing the direction and latest trends in the industry. I have been in the test industry since 1983 and consider myself lucky to be working with a dedicated and professional group of elected industry “users” as well as Teradyne employees. If you are interested in becoming a part of the Steering Committee, contact anyone on the current committee and submit a nomination! We will start working on TUG 2008 soon. Please go now and attend sessions, investigate, share and give feedback to Teradyne. Meet new people, establish valuable relationships, learn something new from your peers. TUG’s goal is to provide each of you with a technical

you have accepted the challenge to participate in TUG 2007 License to Test. You are now a part of the longest running Users Group conference in the ATE Industry. Continue reading for more information...

experience that will benefit your job, career, product line and your industry. Remember to take the knowledge you gain here and share it with your fellow engineers.

WHO IS ATTENDING

Thank you again for your participation and for being a member of the Teradyne Users Group.

The Annual Teradyne Users Group Conference is open to all licensed users of Teradyne’s test systems and software products.

KEYNOTE ADDRESS TUG 2007 Sincerely,

Kevin Walt 2007 TUG Chair Principal Engineer Broadcom

We are honored this year to have two keynote presenters speaking to us at TUG 2007. Both are leaders in their fields. Keivan Keshvari Director, Product and Test Engineering Microcontroller Division Transportation & Standard Products Group Freescale Semiconductor Inc. Austin, Texas Mr. Keshvari has held various engineering and management positions within Freescale (formerly Motorola Semiconductor Products Sector) during the past 18 years and has a strong background in semiconductor test and manufacturing. He was one of the key drivers of Motorola’s original Six Sigma implementation and has

since been a focal point for Zero Defect programs, driving innovative methods to further improve the quality of Freescale's integrated circuits. In his current role, Mr. Keshvari is responsible for product and test engineering for all microcontrollers for the automotive, consumer and industrial markets. Freescale microcontroller quality levels have improved dramatically during Keivan’s tenure in this position. The company’s latest flagship 32-bit microcontroller for engine management applications shipped more than one million units without a customer return. Mr. Keshvari holds a Bachelor’s degree in Computer Science, as well as a Master's of Business Administration degree. Ahmad Abde-Yazdani Director of Test Engineering Automotive Products Worldwide Infineon Technologies Munich, Germany Mr. Ahmad Abde-Yazdani has been the Director of Test Engineering for Automotive Products Worldwide at Infineon Technologies since 2000. Before that he was at Siemens Company for 14 years working as the Department Leader in Test Engineering, and as a test engineer for Analog, Mixed Signal, and Microprocessor devices. He also worked with the University Wuppertal from 1985-1986 on scientific investigation in Digital filtering methods. Mr. Abde-Yazdani has a strong background in test engineering, from his days working at the University Wuppertal, to his experience at Siemens where he held several positions from testing microprocessor devices and mixed-signal devices before becoming the department leader for test engineering. Mr. Abde-Yazdani holds a Master's degree in Electronic/Broadcasting from University Wuppertal in Germany. For the keynote presentation, Mr. Keshvari will open the keynote address discussing Freescale’s involvement in the transportation industry, the history of ICs in the automotive industry, current and future applications, and why zero defects are critical today. Mr. Abde-Yazdani will then discuss Infineon’s involvement in the transportation industry: the technical challenges that zero defects have on the manufacturing and design process; the history of IC's application complexity in the automotive industry; what will the next generation of products bring; and, what the challenge is to the ATE Industry. Please join us.

TUG 2006 Attendees — Jacksonville, Florida

CONFERENCE INFORMATION

Micron Technology

Aeroflex

Micronas GmbH

AMI Semiconductor

Mindscale Consulting

Analog Devices

National Semiconductor

Anteon Corporation

Naval Surface Warfare Center Naval Undersea Warfare Center

NEW THIS YEAR!

TUG REGISTRATION DESK IS OPEN:

CAR RENTAL

Applied Wave Research

We are offering Seminars on Sunday to those who are continuously searching for knowledge and don’t want to wait until Monday.

Monday, April 23, 2007 Tuesday, April 24, 2007 Wednesday, April 25, 2007

If anyone wants to rent a car while at the Sheraton Universal, there is an Enterprise desk at the hotel.

ATI Research

Semiconductor Customer Forum Discussion Attend the Engineering Update by Mike Malone, Teradyne VP of Engineering and hear what Teradyne is planning for the future. Immediately following, representatives from Teradyne’s Marketing, Engineering and Customer Support organizations will be there to answer questions, listen to concerns, and make note of your inputs.

BACK THIS YEAR Vendor Fair The TUG 2007 Steering Committee is pleased to provide a forum to discuss breakthrough technologies that meet a broad range of test challenges. Vendors will highlight key products and services that interface with Teradyne semiconductor test systems. The Vendor Fair begins Tuesday afternoon as part of the Roundtable Session. TUG attendees are invited to enjoy refreshments while participating in this informal vendor/customer exchange. A description of each company can be found later in the Program Book. The following companies will be exhibiting this year: • Dynamic Test Solutions, Inc. • GSI Group Inc. • Everett Charles Technologies • Gorilla Circuits, Inc. • HCL America, Inc. • inTEST Corporation • Mentor Graphics Corporation • Pintail Technologies • Salland Engineering (Europe) BV • Teradyne – Test Assistance Group (TAG) • Test Advantage

REGISTRATION FEES AND PAYMENT The fee for TUG 2007 registration on-site (no prior registration) is $300.00 per day. TUG accepts U.S. currency and personal, travelers or company checks. Please make checks payable to “Teradyne Users Group”. You may also pay on-site by American Express, MasterCard or VISA. (Please note: We cannot accept Diners Club or Discover card, nor can we accept company or government Purchase Orders).

Advint, LLC

6:00 AM – 5:00 PM 7:00 AM – 5:00 PM 7:30 AM – 12:00 PM

BAE Systems

TERADYNE PARTY ON MONDAY NIGHT! LOCAL ATTRACTION DISCOUNTS Please check with the hotel concierge for any local attraction discounts that may apply for Teradyne Users and Guests.

SPECIAL NEEDS Both TUG and the Sheraton Universal Hotel are ADA compliant and will accommodate special needs, as well as dietary requirements. If you do have special dietary or other ADA needs, we will accommodate you.

HOTEL INFORMATION Enjoy the warmth of smiling faces and the California sun at the Sheraton Universal Hotel. The hotel has over 30,000 square feet of versatile meeting space and it will provide the atmosphere of elegance and professionalism our attendees expect. The hotel's central location makes it easy to leave the premises when not in a technical session and take advantage of free time. Complimentary tram rides to Universal Studios Hollywood and Universal Citywalk save you time and keep you relaxed. Find refreshment in the heated outdoor swimming pool. Make time for conversation in the outdoor whirlpool. Or re-energize at the fitness center, open all day and night. After sessions, catch up with friends and stroll over to Melrose Avenue, Hollywood, Beverly Hills, and downtown Los Angeles. Let the good times linger late into the night as you gather together for refreshments at the Baja Bar. Share amazing views of Universal Studios and find all the comforts of home. Other Services at the hotel include: • Business Center • Wake up service • Babysitting service • Laundry Service

Join us for a tour of Universal Studios and a party at the Universal Studios Theme Park. This year Teradyne will host their annual TUG party on Monday, April 23, from 6:00-9:00 PM. Join us at Universal Studios where you can experience the behind-the-scenes action, as well as re-live your favorite movie sets such as “Jurassic Park”, “Back Draft” and “Revenge of the Mummy”. Shuttles will depart the convention area of the hotel (check with the TUG registration desk for pick up location) to take you on a studio tour ending at Studio Center, an area specially reserved for TUG. Enjoy food and beverage from any of the vending areas such as Panda Wok, Jurassic Cafe, and Ben & Jerry's, as you explore the stage sets, relax and listen to the music, or challenge others in the video game room. Shuttles are available throughout the evening for your return trip, and should you decide to extend your evening, hotel shuttles will be available from the City Walk area.

SURVIVOR PARTY

Boca Test Broadcom Circuit Check CSR DARA DOD Eagle Systems Everett Charles Technologies Freescale Semiconductor Galaxy Semiconductor Solutions

For those attendees driving in for the day to attend sessions, parking will be offered at a special rate of $8.00 for the day for self-parking only. Overnight parking is $16.00 for self-parking and $21.00 for valet parking with in and out privileges.

Philips Styria Austria Qualcomm Raytheon Raytheon Missile Systems RF Micro Devices Royal NL Navy Salland Engineering Samsung Electronics Siemens VDO SigmaTel Sitel Semiconductor

For those staying over Wednesday, April 25th, TUG will be hosting a “Survivor” Party at the hotel.

Gennum Corporation

STMicroelectronics

Hewlett Packard

Syndetix Corp.

EVALUATION FORMS

IBM Canada

Tessolve Services

Everyone will be given evaluation forms before every session. It is important that these forms are completed and put into the baskets located at the back of every room. Awards are given to the Best Papers based on these forms. Overall TUG 2007 Evaluation Forms will be distributed with your TUG materials at registration. Everyone who completes and returns the Overall Evaluation Form by lunchtime will be eligible for a prize at daily drawings each lunch hour. These forms are especially important as the TUG Steering Committee reviews your comments and takes them into consideration when planning the TUG 2008 Program. As always, feedback regarding meeting content, logistics and location will be appreciated.

Infineon Technologies

Test Advantage

Infineon Technologies Austria

Test Spectrum

Infineon Technologies Asia Pacific

Texas A&M University

Integrated Systems Test Intel Intersil Iowa State University Lockheed Martin

PARKING

Philips Semiconductors

TUG 2008 STEERING COMMITTEE NOMINATIONS During this 2007 Conference, a new TUG Chairman will be elected, along with committee members who will plan TUG 2008. If you would like to nominate yourself or a colleague for the Steering Committee, please go to the Registration Desk for the forms. NOTE: Elections will be held on Tuesday afternoon, so please submit your nominations by 12:00 PM on Tuesday.

Marvell Semiconductor Medtronic Mfg Vision Ltd

Texas Instruments The Boeing Company The MathWorks, Inc. U.K. MOD U.S. Air Force U.S. Army VXI Technology, Inc. Wolfson Microelectronics Zarlink Semiconductor

Microchip Technology

7:00 – 8:00

BREAKFAST

8:15 – 8:45

WELCOME

8:45 – 9:30

KEYNOTE I

9:30 – 10:15

KEYNOTE II

10:15 – 10:30

BREAK

GROUP 10:30 – 12:00

MIXED SIGNAL

POWER MANAGEMENT/ AUTOMOTIVE

PRODUCTION INTEGRATION & HW/SW INTERFACE

RF WIRELESS

ASSEMBLY TEST MIL/AERO

The Man with the Innovative Test Technique

Q's Lab

Accelerating Program Development and Characterization

Data Analysis

Instrumentation

Test Development

10:30 – 11:00

1/A Pattern Matching on the Tiger™ Jason Laderman, Intel Corp.

1/A Jitter Testing with Dig_Cap Joyce Ng, Kevin Walt, David Yin, Broadcom

1/A Reduce Program Development Time for the 1/A Use Scripting to Get the Most out of Data Automotive Market on the FLEX™ Analysis Antoine Megens, Salland Engineering Dominique Le Roux, Teradyne

1/A Introducing the Port Expander Instrument Glenn Burnham, Teradyne

1/A Using Interchangeable Virtual Instrument (IVI) to Increase Test Development Efficiency Sameer Bivalkar, Teradyne

11:00 – 11:30

1/B Using the HexVS as an Independent DVM Data Acquisition Instrument Patrice Ducharm, Roxan Lemire, Michel Paradis, IBM; George. Simbles, Teradyne

1/B What Is and How to Use Learn Mode Michael Cavallini, Brent Herling, Kent Magnuson, Teradyne

1/B VBT or POP? How to Decide the Implementation of a Mixed-Signal Test Fast Cristian Cesarini, Filomena Ricci Teradyne

1/B Data Analysis in Real-time Mode Martijn van der Vlag, Salland Engineering

1/B Improving the Level Accuracy of Gen4 MW Hardware David DiBona, Teradyne

1/B Cost Benefit Analysis for Using ATLAS Brandon Beaulieu, Jim Danscuk, U.S. Air Force/Tinker

11:30 – 12:00

1/C KeepAlive™: Then and Now Way Kyi, Teradyne

1/C FLEX™ DSSC vs. ADB Bus Kevin Cheng, Jerry Hsieh, Teradyne

1/C Better Programming on the FLEX™ Tester for Easy Debug and Easy Switch from Characterization to Production Test Elie Trognon, Freescale Semiconductor

1/C Yield Monitor Tool for IG-XL™ Platforms Jimmy Chan, Yeng Chee Liew, Broadcom; Nagappan Nachiappan, Jeffrey Tan, Teradyne

1/C The Implementation of GSM/EDGE Source and Receive Library in IG-XL™ Ronald Burke, Helen Chen, Peter Chen, Greg Dionne, Shu Xia, Zhe Xu, Teradyne

1/C Programmable Test Boards for Assembly TPS Troubleshooting Luis Villalta, Teradyne

12:00 – 1:00 1:00 – 2:30

DIGITAL

LUNCH For Your SB6G Only

LUNCH Q's Lab

Accelerating Program Development and Characterization

Tester Integration A

Code Examples

1:00 – 1:30

2/A A User Characterization of the SB6G Instrument Patrice Ducharme, Roxan Lemire, Dany Minier, Doris Viens, IBM; Fady Bishay, Mike Patnode, George Simbles, Teradyne

2/A Advanced Measurement Methods of Hysteresis Featured in Mixed-Signal IC Chips Weishu Wu, Texas Instruments

2/A My Pattern is Running - Can I Still Debug? Lorenzo Simonini, Elisa Woo, Teradyne

2/A Integrating the FLEX™ Test System into a Well-Established Test Floor Chad Bray, Trevor Dixon, Texas Instruments

1:30 – 2:00

2/B Characterizing High-Speed Parallel Buses with the SB6G and Sub-MOSC Timing Erik Lusis, IBM; Fady Bishay, Doug Mainz, Teradyne

2/B The Implementation of Fourier eXtended Transform (FXT) in IG-XL™ Edmond Tan, Shu Xia, Teradyne

2/B Using the PLMeter as a Debug Resource Krista Bertsch, Teradyne

2/B Planning and Logistics: Converting a 2/B On-the-Fly Statistics with IG-XL™ Complex SoC Catalyst™ to FLEX™ in Asia without Jos Driessen, NXP Semiconductors Leaving Europe John Tatchell, CSR; Ian Beck, Teradyne

2:00 – 2:30

2/C Testing High-Speed Serial Buses through a Generalized Template for the UltraFLEX™ SB6G Joe DeSimone, Freescale Semiconductor; Bill Davis, Teradyne

2/C Understanding IG-XL™ DSP Enhancements Hmayak Dravatshyan, Scott Therrien, Teradyne

2/C Sync Panel, Uncovering Issues Walter Oldham, Derek Sam, Teradyne

2/C Working with OpenFLEX™ — A Customer’s Experience of Developing Test Solutions through Teradyne’s OpenFLEX Office Omar Biabani, Sten Peeters, Teradyne

2:30 – 3:00

BREAK

3:00 – 5:00

Protocol, High-Speed Protocol

2/A Migrating a Final Test RF SoC from SingleSite Catalyst to Quad-Site FLEX™ Kim Gundersen, AMI Semiconductor

Programming in C # 2/A Programming in C # Workshop (90 Minutes)

BREAK Tools

Test Quality: Ready to Ramp?

DIB Design Verification

Board/Material Considerations

3:00 – 3:30

3/A High-Speed Loop-Back Test Solution for SerDes Products Using SB6G Patrice Ducharme, Dany Minier, Doris Viens, IBM; David Keezer, Georgia Institute of Technology

3/A Get the Best of your High-Density PMU DirkJan Stuij, Salland Engineering; Francois Deun, Teradyne

3/A Faster Ramps and Higher Yields in the Pursuit of 0 DPM Richard Ackerman, Mentor Graphics (Vendor)

3/A DIB Design Sanity Check Using Circuit 3/A Defining Inductance in Contactors Simulation Software Ryan Satrom , Everett Charles (Vendor) Ambika Krishnamoorthy, Swetha Thiagarajan, Intel Corp; Tom Chambers, Chris Paull, Teradyne

3:30 – 4:00

3/B SATA Testing with SB6G Zubir Ebrahim, Teradyne

3/B AC Characterization of BBAC and POOL2 Signal Sources Don Jussaume, Analog Devices

3/B Force Fail Tool, Accelerating Production Release Walter Oldham, Teradyne

3/B Automating Schematic Verification for Better Efficiency and Better Chance for FirstPass Success David Baird, Freescale Semiconductor

3/B RF Connectors and Material: A Performance Comparison Martin Dresler, Wolfgang Steger, Teradyne

4:00 – 4:30

3/C High-Definition Multimedia Interface (HDMI) Receiver Characterization and Test Techniques on the UltraFLEX™ Peter Huber, Edward Seng, Teradyne

3/C Automated Test Program Conversion K. Padma Priya, Vinai Kumar Singh, Teradyne/HCL Technologies

3/C Relays — Conquering the Test Engineer's Nemesis Paul Nelson, Elisa Woo, Teradyne

3/C Self-Documenting PIB Diagnostics Chad Bray, Trevor Dixon, Texas Instruments

3/C Design Example for a Generic RF DIB and Custom Daughter Board KN Chui, Corad; Charles Kao, Teradyne

4:30 – 5:00

3/D HyperTransport™ 3.0 Link Characterization with SB6G on the UltraFLEX™ James Yeh, AMD; Fady Bishay, Shawn Sullivan, Teradyne

3/D Understanding DCTime Larry Lovell, Teradyne

3/D Lowering DPPM without Increasing Burn-in 3/D A Chip that Avoids Mechanical Relays on a or Test Time DIB Jeff Bibbee for OptimalTest Giuseppe Amelio, Francesco Cantini, Moreno Lupi, Francesco Picchi, Microtest

6:00 – 9:00

TERADYNE PARTY

Bi-Series 3/A Hands-on Programming the Bi4-Series Workshop

3/D RF Debugging Techniques for Volume Production Peter Higgins, Teradyne

TERADYNE PARTY

7:30 – 8:30 GROUP 9:00 – 10:00

BREAKFAST

DIGITAL

MIXED SIGNAL

POWER MANAGEMENT/ AUTOMOTIVE

PRODUCTION INTEGRATION & HW/SW INTERFACE

RF WIRELESS

ASSEMBLY TEST MIL/AERO

Letting Q Program the FLEX

How Many Bonds Can You Convert? I

Welcome to Power: High Voltage/High Current Test

Collaboration

Miscellaneous

iStudio/Di-Series

9:00 – 9:30

4/A TUTORIAL - FLEX™ Platform Calibration 101 Igor Lavrinenko, Teradyne

4/A Use Half of ADC Bits Output to Reconstruct Waveform for Dynamic Testing Adonis Chang, Teradyne

4/A How to go Beyond 30V @ 100mA with only 4/A PI Version Selector Two DC30 Channels Mike Knapp, Analolg Devices; Laurent Bonneval, Teradyne Dean Garrison, Sherry Sponheimer, Teradyne

4/A Characterization/HVM Comprehensive Test 4/A Hands-on Programming the Di-Series using Solution for 10G/3G Transceiver Utilizing the iStudio Workshop Teradyne Tiger Platform and SDM 10G Module Fayez Sedarous, Intel Corp.

9:30 – 10:00

4/B How to Capture All Fail Data from Scan Vectors Using the Memory Test Option (MTO) on the FLEX™ Johnny Steck, Texas Instruments; Dwayne Dohmann, Thuy Tran, Teradyne

4/B Improving INL DNL Repeatability Steve Matej, Jim Ptasinski, Texas Instruments; Kent Magnuson, Teradyne

4/B Pararallel Test Solution for a High Current 4/B How to Write and Use Simple DLLs to PROFET Device Using FLEX™ DC90 DEMUX Accelerate Code Execution Petar Fanic, Tzong Sheng Ng, Infineon Technologies Emanuele Vazzoler, STMicroelectronics; Alfredo Stabile, Teradyne

4/B Interpolation Cookbook: Algorithms, Performance, and Guidelines Aimen Oueslati, NXP Semiconductors; Martin Dresler, Teradyne

10:00 – 10:30 10:30 – 12:00

BREAK FLEX: Shaken not Stirred

BREAK How Many Bonds Can You Convert? II

Welcome to Power: High Voltage/High Current Test

Collaboration and Revision Control

10:30 – 11:00

5/A Fast Time Measurements in Milliseconds with HSD Channels on the FLEX/microFLEX Diego Koch, Massimo Zambusi, Teradyne

5/A Microcontroller-Based Servo Loop for ADC Linearity Testing Shu Xia, Teradyne

5/A DC90™ Voltage Compliance, Part 1: Insider Look at the DC90 Power Model Cristian Cesarini, Arthur Russell, Chi-Heng Wang, Teradyne

5/A Test Program Guidelines for Collaborative Development Jeff Cramer, Jonathan Kubala, Tom Vance, Teradyne

11:00 – 11:30

5/B A Simplified J750™ Technique to Handle EFlash Data Management Chi Wee Ang, Gang Liu, Infineon Technologies

5/B Undersampling Using Beat Frequency (Theory and Practice) Ching-Chia Tien, Teradyne

5/B TUTORIAL — DC90™ Voltage Compliance, Part 2: Are You Getting your Two Kilowatt's Worth? Cristian Cesarini, Arthur Russell, Chi-Heng Wang, Teradyne

5/B Subprogram Modularity: Improving Test Program Development Productivity and Reusability Kevin Bushe, Teradyne

11:30 – 12:00

5/C ETAccess to IG-XL™ Silicon Solution Givargis Danialy, LogicVision; Ted Kim, Iwan Oei, Guillermo Pidal, Teradyne

5/C Testing a Correlated Double Sampling ADC on the FLEX™ Lai-Choon Chan, Teradyne

12:00 – 1:00 1:00 – 2:30 1:00 – 1:30

BREAKFAST

LUNCH Memory Test Never Dies

5/C Smarter ASCII Export for Dumber CM Tools: Using Interpose Functions with ASCII_Utils.xla Glenn Carson, Freescale Semiconductor

Tutorials

iStudio/Di-Series

5/A TUTORIAL — Forward Error Correction in Wireless Communication Standards Steven Fields, Teradyne

5/A Hands-on Programming the Di-Series using iStudio Workshop (Continued)

5/B TUTORIAL — GSM/EDGE EVM Test Ching-Chia Tien, Teradyne

5/B Replacing M9-Series Digital Test Instruments (M9-Series DTI) with Di-Series Digital Test Instruments (Di-Series DTI) Lloyd Frick, Teradyne

LUNCH How Many Bonds Can You Convert? III

6/A Enabling Modularity and Portability to Test 6/A Clock Jitter Effect for Testing Data Multi-Configuration Memories within a Single Converters Chip TayBian Yeoh, Texas Instruments Jin-Soo Ko, Teradyne

Welcome to Power: High Voltage/High Current Test 6/A When to Use Which V/I Crossover Type on the FLEX DC90™XP Mereen Mammen, Teradyne

Tester Integration B 6/A Mixed-Signal Simulation for Test Program Development Philippe Raynaud, Mentor Graphics; Philippe Planelle, STMicroelectronics

1:30 – 2:00

6/B Trade Between Speed and Flexibility: Develop a Pattern Conversion Tool Adun Ye, Teradyne

6/B Conversion of ADC Ramp Tests from the J750™ to the UltraFLEX™ Russell Long, Freescale Semiconductor; Tim Scanlon, Teradyne

6/B Paralleling DC90XP VIs to Achieve Currents 6/B Integrating the GSI Group WaferTrim™ Beyond Merged Mode M310 with the microFLEX™ Eric Bergeron, Maurilio Fabiano, Teradyne John Grandbois, Analog Devices; Peter Turner, Teradyne

2:00 – 2:30

6/C High-Speed Memory Test and Redundancy Analysis (RA) on the UltraFLEX™ Hiroshi Kaga, NEC Electronics; Hideaki Nakajima, Teradyne

6/C Testing High-Speed Mixed-Signal Devices on the UltraFLEX™ Daniel Weinberg, Analog Devices

6/C Introduction to the DC90XP™ — A High Power Instrument Optimized for the Automotive Market Cristian Cesarini, Larry Klein, Teradyne

2:30 – 3:00

BREAK

3:00 – 7:00

BUSINESS MEETING, ENGINEERING UPDATE, POSTER/ROUNDTABLE SESSIONS, VENDOR FAIR

3:00 – 3:15

7/A SEMICONDUCTOR BUSINESS MEETING

3:15 – 4:00

7/B SEMICONDUCTOR ENGINEERING UPDATE

4:00 – 4:45

7/C SEMICONDUCTOR OPEN FORUM DISCUSSION

4:00 – 7:00

VENDOR FAIR

4:45 – 7:00

POSTER/ROUNDTABLE SESSIONS

6/C Enabling Customers to Develop Tailored Instruments for the FLEX™ Architecture through OpenFLEX™ Omar Biabani, Lee Holt, Robert Manlick, Teradyne

Tutorial 6/A TUTORIAL — DTV/HDTV testing on UltraFLEX™ Fang Xu, Teradyne

Instrument Replacement 6/A Applications for Ai- and Bi-Series Instruments in Legacy™ Tester Replacement Gary Bryant, Richard Lawrence, NAVAIR

6/B TBA

6/C A Reconfigurable, Extendable L200 AutoConverter Yonet Eracar, Teradyne

BREAK

7/A Engineering Update

ROUNDTABLE DISCUSSIONS

POSTER/ROUNDTABLE SESSIONS POSTERS DIGITAL A Perl Script to Search Pattern Files for One Port and Write Values in a Summary File Tao Li, Yi Fan Li, Infineon Technologies A Total Solution to Convert a Verigy 93000 Project Henry Zhou, Teradyne IMAGE™ to UltraFLEX™ Conversion: New Strategy and New Solution Jack Chen, Hall Lou, Teradyne Performance Enhancement for Pattern Loader Hemamalini Nagarajan, Gopalakrishnan Srinivasan, Teradnye/HCL Technologies Standalone Pattern Compiler Vinai Kumar Singh, Latha Subramanian, Teradnye/HCL Technologies

VOM (Voice of Mine) — Closing the Loop Swagata Chakrabarti, Peter Chuang, Teradyne Integration of Full Dynamic TestCell Controller with IG-XL™ Rob Marcelis, Salland Engineering Enabling Customers to Develop Tailored Instruments for the FLEX™ Architecture through OpenFLEX™ Omar Biabani, Lee Holt, Robert Manlick, Teradyne (Also Paper - PI_6C) Securing Test Systems in the Production Environment Bob Mastrogiacomo, Jaci Wilson Teradyne

ROUNDTABLE DISCUSSIONS

MIXED SIGNAL

SEMICONDUCTOR TEST

Advanced Techniques to Overcome Tester Limitations When Testing ADCs Aarthi Sundararajan, Tessolve Test Services

Update on IG-XL Help John Buckley, Mike Gill, Teradyne

Another POP Story Kent Magnuson, David Pickard, Teradyne Increase Time for Coffee Breaks — Reduce Time for Test Development and Debug Roy Chorev, Ali Syed, Teradyne Incorporating the J750™ into the Electrical and Computer Engineering Curriculum — MSO Option Robert Weber, Iowa State University

POWER MANAGEMENT/ AUTOMOTIVE Implementating a SetupManager VB Class to Simplify PSet-Based Instrument Programming Manfred Graf, Teradyne

PRODUCTION INTEGRATION

DTV/HDTV Testing on the UltraFLEX Q&A Fang Xu, Teradyne OpenFLEX TAG Table

ASSEMBLY TEST — MIL/AERO Bi-Series Di-Series iStudio

TUG 2007 VENDOR FAIR The following companies are participating in the TUG 2007 Vendor Fair:

Dynamic Test Solutions, Inc. RICHARDSON, TX 75081 • TEL 972-235-9477 Dynamic Test Solutions offers custom designed PCBs for ATE applications, including loadboards, DUT boards and Probe Card circuit boards. DTS provides complete turn-key test hardware (probe card, socket, stiffeners and assembly) for all Teradyne tester platforms. DTS specializes in complex designs, including RF, mixed signal and fine pitch applications. Design platforms include Cadence Allegro, Mentor Expedition and PADS Power PCB. Additional information about DTS is available at www.dynamic-test.com

GSI Group, Inc. WILMINGTON, MA 01887 • TEL 734-623-8170 GSI Group Inc. supplies laser-based manufacturing systems to global medical, semiconductor, electronics, and industrial markets. Featuring the WaferTrim M350 laser system. The superior solution for active IC trim (trimming while probing and measuring), passive trim, link cutting, and linear trimming at wafer level. The M350 incorporates precision probing, wafer handling, latest laser technology while integrating today's state of the art testers.

Everett Charles Technologies WARWICK, RI 02886 • TEL 401-739-7310 X237 The Semiconductor Test Group of Everett Charles Technologies (ECT) is the premier supplier of Turnkey Interface Solutions to the worldwide semiconductor test market. ECT designs, manufactures, services and supports printed circuit boards, test sockets, probe towers and spring probes, offering Integration Services for BOM management and PCB Assembly with 100% post-assembly test. They offer bare-board-only fabrication, board + assembly, contactor-only, or any combination of products for ATE Interface Solutions. ECT provides true worldwide support, with Design and Applications Centers in Arizona, California, Minnesota, the United Kingdom, Malaysia, Singapore, and the Philippines, and Field Repair offices in California, Malaysia, Singapore, the Philippines, and China. Additional information about ECT is available at www.ectinfo.com

Spectrum Ai-Series

Gorilla Circuits, Inc. SAN JOSE, CA 95112 • TEL 781-238-0214 Gorilla Cicuits is a Printed Circuit Board Manufacturer that has extensive experience with all Teradyne ATE Test Platforms. Gorilla has focused its technology and expertise to cater to DUT and Probe Card PCB manufacturing. These technologies include: 31:1+ aspect ratio holes, .5mm pitch, 50+ layers, critical impedance tolerances, multiple lamination steps, and high speed/mixed materials.

HCL Amereica, Inc.

Salland Engineering (Europe) BV

SUNNYVALE, CA 94085 • TEL 408-733-0480

8024 HA ZWOLLE, THE NETHERLANDS • TEL 31 38 454 7702

HCL Technologies is one of India’s leading global IT Services companies, providing software-led IT solutions, remote infrastructure management services and BPO. HCL Technologies focuses on Transformational Outsourcing, working with clients in areas that impact and re-define the core of their business. HCL leverages an extensive global offshore infrastructure and its global network of offices in 16 countries to deliver solutions across select verticals including Financial Services, Retail & Consumer, Life Sciences Aerospace, Automotive, Semiconductors, Telecom and MPE (Media Publishing & Entertainment). Additional information about HCL Technologies is available at www.hcltech.com

inTEST Corporation CHERRY HILL, NJ 08003 • TEL 856-424-6886 inTEST provides test head docking, manipulator, and wafer probing interfaces for Teradyne test systems. Our products are available from Teradyne, as OEM products, or are available from inTEST directly. Our engineers work closely with Teradyne to ensure that our products will enhance the productivity and utility of your test floor. Visit our website:www.intest.com to see the complete array of products available from inTEST.

Mentor Graphics Corporation WILSONVILLE, OR 97070 • TEL 502-685-7000 As technologies move below 100nm, the IC industry is experiencing a significant change in the way devices are failing and the types of defects encountered. New defect mechanisms, combined with initial and mature yields that are trending downward, require a renewed focus on the quality of test in order to maintain adequate quality levels of shipped devices. Mentor Graphics market-leading DFT tools are critical to the role test methodologies and tools play in defect detection and yield improvement. Mentor offers new diagnostics techniques that can be used to mine valuable data about the failing mechanisms, enabling isolation of the root causes and correction of the yield loss issues.

Additional information about Mentor Graphics Design-for-Test is available at www.mentor.com/dft.

Pintail Technologies PLANO, TX 75024 • TEL 972-464-5835 Pintail Technologies is a leading semiconductor test improvement and yield learning company. Pintail’s software products are based upon realtime data acquisition running on most popular ATEs. With over 250 systems installed worldwide, these products reduce the test cost, increase quality and accelerate yield learning across the supply chain. Pintail has offices in Dallas, Austin, San Jose, Seoul, Singapore, Taiwan, and Munich. www.pintail.com.

Salland Engineering is a world leader in Test Application Support, Data Analysis, ATE custom hardware products and solutions. The unique combination of Test Engineering knowledge with handson experience has helped our customers achieve their goals in terms of time-to-market, reduced test time and overall improved test efficiency. We are specialized on new high-density test instruments, and we offer now the highest amount of channels for DC & AC instruments in the market. We offer, as well, test cell integration solutions for: EG, TSK, TEL, KLA, handlers, including PAT, real-time monitoring etc. Additional information about Salland is available at www.salland.com.

Teradyne — Test Assistance Group (TAG) WORLDWIDE LOCATIONS • WEB http://teradyne.com/TAG • EMAIL tag-mktg@teradyne.com Teradyne's Test Assistance Group (TAG) combines global presence with a successful test development history to provide the low risk solution for bringing your products to market sooner. TAG's full spectrum of support solutions satisfy your needs in device test planning, code development, characterization, interface hardware design, correlation and porting to high-volume test facilities. Additionally, TAG's global support and training centers offer convenient access to the latest Teradyne test systems and expertise. We look forward to meeting you personally at TUG-2007.

Take advantage of TAG's technical support: Milestone Project Solutions • Test Interface Hardware • Training & Skill Development • Consulting/Coaching

Test Advantage TEMPE, AZ 85296 • TEL 480-357-3351 Test Advantage offers a software product line focused on improving yield, quality, DPPM, and overall test process efficiency during both rampup and volume production. Products include: Streetwise™ Production, Streetwise™ Engineering and Express™. Streetwise is an integrated, in-line data analysis solution utilizing automatic algorithm selections for highly efficient dynamic parametric outlier detection for all types of data population distributions, with additional comprehensive spatial outlier detection methodologies at wafer test. Express is an off-line test engineering assistant offering comprehensive analysis of test data, in order to automatically generate recommendations for improving the test process in the areas of quality, yield, and test efficiency.

Additional information about Test Advantage is available at www.testadvantage.com.

7:30 – 8:30 GROUP 9:00 – 10:00

BREAKFAST DIGITAL

MIXED SIGNAL

POWER MANAGEMENT/ AUTOMOTIVE

PRODUCTION INTEGRATION & HW/SW INTERFACE

RF WIRELESS

R. Moore Patterns

Spectre's World Domination Concepts I

Automotive SoC and IC Integration

Calibration

Test Time Reduction

9:00 – 9:30

8/A Getting More with UltraFLEX™: Pattern Files, Modules, and Sets Preeti Nargund, Teradyne

8/A Programming Pattern Vectors and DSSC on MUX Mode for FLEX™ Yan Jin, Jason Miller, Haibo Zhang, Texas Instruments; Cliff McCallister, Teradyne

8/A Challenges to Test an ADC in an Automotive Device Hugo Molina, Texas Instruments

8/A Calibration of SE-HDACTO Pushes the DC Calibration Unit to its Limits Dirk Jan Stuij, Salland Engineering

8/A Test Time: A License for an RF Test Engineer! Philippe Soleil, NXP Semiconductors

9:30 – 10:00

8/B A Flexible Pattern Format and Platform Conversion Tool Ramon Liu, Freescale Semiconductor

8/B High-Speed Dynamic ADC Test on a LowCost Digital Tester Mile Cheung, Claus Dworksi, Infineon Technologies

8/B An Easy Way for SPI Communication via DSSC Wei Chong Ng, Infineon Technologies; Nazlen Jabar, Teradyne

8/B Effective Spot Calibration of the DC30™ Source and Meter Using PSets Michael Shilhanek, Texas Instruments; Zayd Hammoudeh, Nathaniel Jansak-NobleTeradyne

8/B Test Time Reduction and Strategy on a Multi-Chip Device Mike Bellanger, Salvatore Cutrupia, NXP Semiconductors

10:00 – 10:30 10:30 – 12:00

BREAK Production is Not Enough

Automotive SoC and IC Integration

Programming

Test Techniques

10:30 – 11:00

9/A Test Time Reduction Technique through Shared Resources Joo Yong Teng, Kar Meng Thong, Infineon Technologies

9/A How to Specify Units and Scale Test Limits in the IG-XL™ 5.1 Flow Sheet Eric Buvry, Teradyne

9/A Airbag Device Testing on the FLEX™ Jian-Wei Wang, Kenny Zhu, Teradyne

9/A A Useful VBT Programming Tool Integrated in IG-XL™ Hao Chang, Teradyne

9/A Generating ASK Modulation Signals for Contactless Chip Card Controllers on the J750™ Hubert Schafzahl, Johannes Schorrer, Infineon Technologies

11:00 – 11:30

9/B Converting J750™ Test Programs from DPS to High Density Voltage and Current Source (HDVIS) for More Parallelism Leo Di Bello, Thomas Fanter, Teradyne

9/B Advanced Parallel Trim Algorithm with POOL PVM Auto-Calibration Jared Jones, Analog Devices

9/B Octal-Site Final Test Concept for Automotive Intelligent Distributed Control Products Johann Hilburger, Gerhard Knez, Olaf Neper, Freescale Semiconductor

9/B Buttons to Generate VBT Bin Chiu, Teradyne

9/B Low-cost Alternate EVM Test for Wireless Transmitter Systems Philippe Brousse, NXP Semiconductors

11:30 – 12:00

9/C Adding Setup Information to Test Flow Using IG-XL™ VBT Ramon Liu, Freescale Semiconductor

9/C Improving Test Efficiency Using DFT Concepts: A Potpourri of Ideas from Servo Devices Sundeep Desai, Texas Instruments

9/C The Lowest Cost Method of IDDQ Testing on the J750™ Satoshi Funakoshi, Teradyne

9/C Automated Optimization and Cleanup of VBA-based Test Programs Hubert Schafzahl, Infineon Technologies

9/C RF Test Code Templates for WCDMA+GSM Transceiver on Generic RF DIB Albert Jen, Charles Kao, Luis Tang, Teradyne

12:00 – 1:00 1:00 – 2:00

LUNCH A Golden Eye on Characterization

Spectre's World Domination Concepts III

Power Management

General Programming

Test Techniques

10/A Getting the Most Out of IG-XL™ Characterization Mike Patnode, Teradyne

10/A It Pays to Own a FLEX™ Norikazu Sugano, Sony Japan; Jack Chen, Gavin Gao, Terayne

10/A Modulation Input Applications Extend DCVI Applicability in POP Diego Koch, Alfredo.Stabile, Massimo Zambusi, Teradyne

10/A Automated Voltage and Temperature Characterization Utility for IG-XL™ Tarang Dadia, Qualcomm; Daniel Buker, Teradyne

10/A Developing the Spectrum Mask/Adjacent Channel Power Test on the FLEX HongBin Tong, NXP Semiconductors; Ching-Chia Tien, Teradyne

1:30 – 2:00

10/B AppsShmoo: A Tool for Characterizing Devices Stephen Davis, Zubir Ebrahim, Yukichi Inoue, Teradyne

10/B Double Your Sampling Rate See Hwa Goh, Teradyne

10/B Octal-Site High-Power Class-D Amplifier Interface Board Design Mike Chu, Yan Jin, Haibo Zhang, Texas Instruments

10/B Introducing Power Supply Status Variables – A Simple and Efficient Way to Organize and Document Test Functions Yaw-Hua Hong, Weishu Wu, Texas Intruments

10/B Accurate GSM Phase Error and EVM Measurements on the FLEX™ Helen Chen, Greg Dionne, Shu Xia, Zhe Xu, Teradyne

2:00 – 2:30

10/C IG-XL™ UltraFLEX™ Characterization Library Anne Marie Guray, Broadcom; Vivian Wang, Teradyne

10/C Controlling the Flow - Implementing Complex Test Program Flows in the IG-XL™ Flow Table John Arico, Analog Devices

10/C A Software Technique for Checking Data Integrity in Fuses Steve Sheck, Freescale Semiconductor

10/C RF Modulation/ Demodulation for Dummies M.Ramasamy, Gopalakrishnan Srinivasan, Teradyne/HCL Technologies

1:00 – 1:30

2:30 – 3:00 3:00 – 5:00

BREAK Testing is Forever

UltraFLEX Concepts

Reducting Test Costs

Handler n'All

3:00 – 3:30

11/A IG-XL™ STIL Bridge Michael Cavallini, Julia DiChiaro, Teradyne

11/A New Approaches to Pulse Train Integrity Testing Scott Therrien, Fang Xu, Teradyne

11/A Reducing Wafer Testing Cost for the Automotive Market on the FLEX™ Jerome Mercier, Freescale Semiconductor; Francis Danel, Teradyne

11/A Reduce, Reuse, and Recycle: On-the-Fly DC Measurements without a New Instrument Jim Crafts, Amit Shah IBM

3:30 – 4:00

11/B Proper PPMU Route Sequence to Minimize Glitches at the DUT Zuyan Liang, Shams Syed, Teradyne

11/B Using DCTimeHP to Measure Spread Spectrum Clock Generation (SSCG) Modulate Clock Frequency on the UltraFLEX™ David Wu, Teradyne

11/B Speed Up Test Program Execution for DC Instrumentation Giorgio Calia, STMicroelectronics; Nicolino Tassara, Teradyne

11/B Using 32x Parallel Test with ViProbe for Test Time and Test Cost Reduction on Low Cost Devices Andreas Berdzentis, Texas Instrumentsy; Andre Vogel, Teradyne

4:00 – 4:30

11/C Extended Characterization Method for the J750™ Deyan Karastoyanov, Infineon Technologies

11/C UltraFLEX™ DSSC Test Time Optimization Tyler Tolman, Broadcom; David Lam, Teradyne

11/C Help! Where Do I Start in Test Program Conversion? WL Chan, Dean Garrison, Teradyne

11/C Practical Hardware and Software Considerations for High-Parallel Mixed-Signal Testing with the J750™ Michael Jonas, Texas Instruments

11/D An Easily Integrated, Efficient Approach for Wideband Captures Using TurboAC™ Andrew Varley, Teradyne

4:30 – 5:00

5:30 – 7:00

Spectre's World Domination Concepts II

11/D Simultaneous Device Testing at Multiple Handlers with Single FLEX™ and Cable Docking Armin Winkler, Infineon Technologies; Ramanamurthy Pakki, Teradyne

SURVIVOR PARTY

DIGITAL

KeepAlive™: Then and Now Way Kyi, Teradyne

7:00 – 8:00: BREAKFAST 8:15 – 8:45: WELCOME 8:45 – 9:30: KEYNOTE I 9:30 – 10:15: KEYNOTE II 10:15 – 10:30: BREAK

Session 1: 10:30 – 12:00 The Man with the Innovative Test Technique

KeepAlive can be used for uninterrupted (seamless) pattern operation while changing a new pattern or downloading a new pattern subroutine. All of these functions can be done without losing a pattern heartbeat. It can also be used to run multiple DSSC patterns without stopping and restarting pattern generator. KeepAlive is used to keep Phase Lock Loop running while switching from one pattern to another. There are other applications, like changing digital levels or timing edges which can be used in KeepAlive mode. In this presentation, the similarities and differences of KeepAlive usage among all three platforms (J750™, FLEX™ and UltraFLEX™) will be described. An application note in a Microsoft Word file will accompany this presentation.

LUNCH: 12:00 – 1:00

Session 2: 1:00 – 2:30 For Your SB6G Only Session 2/A: 1:00 – 1:30

Session 1/A: 10:30 – 11:00

Pattern Matching on the Tiger™ Jason Laderman, Intel Corporation The Tiger offers a variety of methods to determine a passing pattern. However, there are limitations, particularly when distinguishing different failure modes and getting conclusions from nondeterministic interfaces. When the Tiger’s HRAM is used, realistic methods can be developed to automate checking non-deterministic logic outputs, broaden an edge search, decrease tester time, read registers easily, and manipulate data to distinguish different failure modes.

Session 1/B: 11:00 - 11:30

Using the HexVS as an Independent DVM Data Acquisition Instrument Patrice Ducharme, Roxan Lemire, Michel Paradis, IBM; George Simbles, Teradyne With more applications in the high power range of 100+ watts, having the capability to profile power planes against temperature rise becomes a valuable tool. This profiling capability will help to characterize and understand hot spots, thermal resistances, and power fluctuations. Previously, mixed-signal digitizers or external scope/data acquisition equipment were commonly used to capture analog-type profiles. This paper will present a novel approach to accomplish DATAQ using the HexVS as an independent DVM profiler.

A User Characterization of the SB6G Instrument

Session 2/C: 2:00 – 2:30

Testing High-Speed Serial Buses through a Generalized Template for the UltraFLEX™ SB6G Joe DeSimone, Freescale Semiconductor; Bill Davis, Teradyne This paper will demonstrate the key features of the SB6G highspeed serial test instrument for the UltraFLEX. Several of the challenges met while testing today's high-speed 8b10b encoded data streams will be addressed using various test methodologies. For example, the differences between real-time compare, postprocessed capture data, and 32-bit signature generation will be explained in detail. The template code provided with this paper will enable customers to bring up their high-speed tests for production and/or characterization quickly and easily. Several options are available for the end-user with regard to datalogging, jitter and eye measurements, and the creation of data files for postprocess or use with the offline Cyclops tool provided by Teradyne.

BREAK: 2:30 – 3:00

Patrice Ducharme, Roxan Lemire, Dany Minier, Doris Viens, IBM; Fady Bishay, Mike Patnode, George Simbles, Teradyne With more applications in the Gbps range, test engineers should seriously consider using the SB6G instrument for its speed and capabilities for at-speed functional test or as a clean high-frequency clock source. Before using SB6G, the authors first characterized its performance and functions using different loadboard, board strips, and test JIG designs for evaluation. Particular focus was put on the TX side SB6G instrument. In this paper, the results of that characterization will be presented from the customer’s perspective.

Session 2/B: 1:30 – 2:00

Characterizing High-Speed Parallel Buses with the SB6G and Sub-MOSC Timing Erik Lusis, IBM; Fady Bishay, Doug Mainz, Teradyne A method for characterizing parallel high-speed buses using the SB6G and sub-MOSC timing will be presented. A requirement for this technique is that the lane-to-lane skew on the device inputs are compensated by phase adjust circuitry (e.g., Rambus FlexIO). Techniques used to achieve sub-MOSC timing for SB6G drive and receive will be shown, along with how they are used to measure input data eye and output setup and hold.

Session 3: 3:00 – 5:00 Protocol, High-Speed Protocol Session 3/A: 3:00 – 3:30

High-Speed Loop Back Test Solution for SerDes Products Using SB6G Patrice Ducharme, Dany Minier, Doris Viens, IBM; David Keezer, Georgia Institute of Technology One test strategy used for testing SerDes and high-speed buses is the built-in self test or BIST (sometimes called BOST or built off self-test) approach where the device under test is in loop-back mode. To complement the SB6G cards, the authors developed a modular approach that allows passive and active loop-back test on an UltraFLEX™ device interface board. This paper outlines the technique used and presents the characterization results for the solution in the test environment.

Session 3/B: 3:30 – 4:00

SATA Testing with SB6G Zubir Ebrahim, Teradyne The Parallel ATA is being replaced with the high-speed Serial ATA (SATA). Currently there are three generations of SATA which run at the rates of 1.5Gbps, 3.0Gbps, and 6.0Gbps, respectively. SATA Gen I and SATA Gen II are in production today. At present, customers are preparing to characterize SATA GEN III, which will run at the rate of 6.0Gbps.

DIGITAL

Session 1/C: 11:30 – 12:00

As the speed increases, current loop-back testing methods are starting to have gaps and flaws. Customers recognize the need to test at high speed to determine the critical test items that will guarantee their devices will operate in the end application. This paper will describe testing SATA using SB6G. One main challenge in testing SATA is the Out of Band Sequence (OOB). This paper will focus on how the author uses SB6G to characterize and test the OOB sequence and the other critical test items.

Session 3/C: 4:00 – 4:30

High-Definition Multimedia Interface (HDMI) Receiver Characterization and Test Techniques on the UltraFLEX™ Peter Huber, Edward Seng, Teradyne HDMI is an all-digital interface capable of transmitting streams of uncompressed audio/video information between compatible multimedia equipment. Examples include set-top box, DVD player, PC, video game console, audio receiver, and video monitor and/or digital television (DTV). HDMI is readily becoming the industry standard, supporting content protection and future-generation video resolution standards, and is subsequently being integrated into the majority of next-generation SoC multimedia devices. This paper will describe ways to characterize an HDMI receiver, utilizing the features of the SB6G instrument synchronized with the HSD1000 on the UltraFLEX test system.

Session 3/D: 4:30 – 5:00

HyperTransport™ 3.0 Link Characterization with SB6G on the UltraFLEX™ James Yeh, AMD; Fady Bishay, Shawn Sullivan, Teradyne This paper will describe characterization of a HyperTransport (HT) 3.0 Link using the SB6G option on the UltraFLEX test system. HT 3.0 is an extremely high-bandwidth interconnect with low latency; it can be used for chip-to-chip and board-to-board connections. The SB6G was designed to test SerDes devices with embedded clock and, therefore, has relatively loose edge placement accuracy specs. HT is a source-synchronous link which requires tight edge placement accuracy. Although HT 3.0 has loosened lane-to-lane timing requirements, it still requires the test instrument skew to be tightly controlled to allow characterization of some key specs. Devices with HT 3.0 links must also be able to boot up in HT 1.x mode which also requires tight control of edge placement during characterization. The primary HT 3.0 transmitter characterization tests include unit interval, differential peak-to-peak output voltage swing, common mode output voltage, transmitter eye width, rise/fall time, output impedance and data valid time relative to the clock. The primary HT 3.0 receiver characterization tests include differential input voltage sensitivity, common mode input voltage, eye width (jitter tolerance), input impedance, and max skew allowed between clock and data.

TERADYNE PARTY: 6:00 – 9:00

DIGITAL

High-Speed Memory Test and Redundancy Analysis (RA) on the UltraFLEX™

Session 5: 10:30 – 12:00 FLEX: Shaken not Stirred BREAKFAST: 7:30 – 8:30

Session 4: 9:00 – 10:00 Letting Q Program the FLEX Session 4/A: 9:00 – 9:30

Tutorial — FLEX™ Platform Calibration 101 Igor Lavrinenko, Teradyne This tutorial will include many FLEX calibration topics. Some topics that will be covered are: 1) high-level user model and tools; 2) calibration and processes in an IG-XL™ job as well as in the maintenance (MUI) environment; 3) software and hardware components involved in the calibration process; 4) from the software perspective, autocal, job-dependent calibration, cal-related activities in the maintenance environment, success and failure patterns in calibration software, and various ways to view and interpret calibration status; 5) calibration-related hardware components, including DC Cal Module, Timing Cal Module, PSP, DIB, EEPROM, and the extent of their involvement in calibration; 6) digital instrumentation highlights; and 7) VBT and other calibration related programming interfaces. In addition, various useful cal-related “tricks” and “hacks” that one day may save your life will be shared.

Session 4/B: 9:30 – 10:00

How to Capture All Fail Data from Scan Vectors Using the Memory Test Option (MTO) on the FLEX™ Johnny Steck, Texas Instruments; Dwayne Dohmann, Thuy Tran, Teradyne An easy way to build a datalog of scan results is to capture scan index, scan cycle, and scan output pins with HRAM and write the result to a text file. While this method works well with smaller patterns or fail counts, it is difficult to use when capturing data sets that exceed the 256 locations available in HRAM. One alternative method is to use the larger capture memory or Capmem (1.5 GB RAM: 24M x 64 bits wide). Capmem is available on the digital channel cards and capable of capturing data up to 100MHz to obtain the fail data. Using MTO opcodes such as Xaddress-increment (xa inc) and Y-address-increment (ya inc), the scan index and scan cycle can be mapped into the X and Y counters. In addition, by using the MTO resource map it is possible to obtain the scan output pins for capture bits. This paper will describe this method as applied to a customer application program.

Session 5/A: 10:30 – 11:00

Fast Time Measurements in Milliseconds with HSD Channels on the FLEX/microFLEX™ Diego Koch, Massimo Zambusi, Teradyne This test technique enables precise measurement of propagation delays and rise/fall times to be performed in milliseconds with one HSD board. Standard techniques require two HSD boards or time-consuming edge-find methods. The technique uses a special timing and a pattern that can be generated automatically. It uses a linear search instead of a binary one, thus improving the robustness in the presence of jitter and noise. This technique scales to multi-pin and multi-site easily and efficiently and overcomes some severe limitations of accuracy and parallelism in the FLEX/microFLEX instrumentation.

Session 5/B: 11:00 – 11:30

A Simplified J750™ Technique to Handle E-Flash Data Management Chi Wee Ang, Gang Liu, Infineon Technologies Most of the new microcontrollers have embedded flash which can be used to store unique chip information during test runs. The data storing activities are to be handled by the test program with the help of some special pattern and functions. This paper introduces a technique to implement a simple but efficient method to store and verify unique chip information to a dedicated address in e-flash.

Session 5/C: 11:30 – 12:00

ETAccess to IG-XL™ Silicon Solution Givargis Danialy, LogicVision; Ted Kim, Iwan Oei, Guillermo Pidal, Teradyne To increase the silicon debugging capabilities of the UltraFLEX™, a solution to interface IG-XL™ and ETAccess from LogicVision was developed. The ETAccess group of products supports the at-speed testing, datalogging, and debugging of silicon. When the power of ETAccess is combined with ATE, engineers can diagnose and debug devices much faster than ever before. This presentation will give a brief introduction to ETAccess and describe the solution for UltraFLEX and how it can be leveraged for other IG-XL-based testers.

DIGITAL

Session 6/C: 2:00 – 2:30

BREAK: 10:00 – 10:30

Hiroshi Kaga, NEC Electronics; Hideaki Nakajima, Teradyne

LUNCH: 12:00 – 1:00

Session 6: 1:00 – 2:30 Memory Test Never Dies Session 6/A: 1:00 – 1:30

Enabling Modularity and Portability to Test Multi-Configuration Memories within a Single Chip TayBian Yeoh, Texas Instruments Memory Test Chip (MTC) architecture presents a unique challenge to test engineering. An MTC may consist of a few dozen memory instances, each with its own array configuration, word width, operating mode, power management, and Design-For-Test options. Using Pattern Runtime Modification techniques, this paper will introduce concepts and methods for modularity and code portability which, when used within this multi-configuration environment, will greatly improve programming efficiency. Test environment initialization that employs parallel-load controller registers and the serial-shifting JTAG protocol are discussed. In addition, the concept of an ‘Algorithm Repository’ with appropriate methods to control SVM usage will be introduced. Limitations and workarounds are also highlighted.

Recently, the device trend is on highly integrated SoC or SiP, but no tester can be used for all products. The UltraFLEX test system has a universal slot architecture and HSD1000 already includes MTO hardware which can generate up to a 250MHz pattern, create the bit map data, and execute the redundancy analysis. In addition, the MTO can run up to 500Mbps with some techniques. In this paper, the authors will describe a high-speed memory test and RA on the UltraFLEX.

BREAK: 2:30 – 3:00

Session 7: 3:00 – 7:00 Engineering Update, Round Table/ Poster Sessions & Vendor Fair Session 7/A: 3:00 – 3:15

Semiconductor Business Meeting Session 7/B: 3:15 – 4:00

Semiconductor Engineering Update Session 7/B: 4:00 – 4:45

Semiconductor Open Forum Discussion

Session 6/B: 1:30 – 2:00

Trade Between Speed and Flexibility: Develop a Pattern Conversion Tool

VENDOR FAIR: 4:00 – 7:00

Adun Ye, Teradyne Unlike translating a test program from one platform to another, pattern conversion is more difficult and usually requires a tool. To develop a tool, several things need to be considered, including program language, grammar analysis, and potential reuse for the tool. Using an LTX Envision to IG-XL™ pattern converter tool and its coding experience, the author will describe the exploration of different text parsing methods and apply them to the same project. Based on the author’s analysis, a general rule and program structure which balances development difficulty and application flexibility for a pattern conversion tool will be recommended.

DIGITAL

Poster Presentations/ Roundtable Sessions: 4:45 – 7:00

Poster 4

Poster 1

Hemamalini Nagarajan, Gopalakrishnan Srinivasan, Teradyne/HCL Technologies

A Perl Script to Search Pattern Files for One Port and Write Values in a Summary File Yi Fan Li, Tao Li, Infineon Technologies Multi-site testing is the most effective way to reduce test time and cost of test. While the number of sites is restricted by the number of available testers and channels on the tester, reducing the pin count or shared drivers is one way to maximize the number of sites. This is especially true for front-end testing. When using a reduced pin count method, some functional pins or ports are disconnected with minimal impact on test coverage. The Perl Script described in this paper will help the test engineer search all pattern files for one port and write input and output values in a summary file. With the information provided in the summary file, the test engineer will know which port can be reduced with the least impact. Currently, this script can be used only on the J97x platform and several 16-bit microprocessors.

Poster 2

A Total Solution to Convert a Verigy 93000 Project Henry Zhou, Teradyne In addition to TestFunction in Verigy 93000 software, TestMethod is also a vital programming style widely used in mixed-signal tests. When V93000 conversion capability extends to TestMethod level, the "Template-Only" conversion is no longer limited, opening the possibility for mixed-signal program conversion. This paper will propose a total solution to convert a Verigy 93000 project. It will begin with an overview of basic structures of TestMethod programming style, followed by the necessary information in the V93K program package, and ending with a description of the approaches to map it to IG-XL™ platforms. Issues such as code and pattern optimization will also be covered.

Poster 3

IMAGE™ to UltraFLEX™ Conversion: New Strategy and New Solution Hall Lou, Jack Chen, Teradyne While Teradyne’s IMAGE-based testers (A5, Catalyst, Tiger) have a very large installed base in the ATE market, Teradyne’s latest tester, UltraFLEX, is gaining momentum. There have been and will continue to be an increase in conversions from IMAGE-based testers to the UltraFLEX. Currently, before an IMAGE-based tester can be converted to UltraFLEX (pattern only), it must first be con-

BREAK: 10:00 – 10:30

Session 9: 10:30 – 12:00 Production is Not Enough BREAKFAST: 7:30 – 8:30 Session 9/A: 10:30 – 11:00

Performance Enhancement for Pattern Loader

ATE performance depends on how fast it can load and test devices. When the pattern is edited, the existing procedure loads the entire pattern file into the memory instead of only the modified portion. In this paper, the authors will describe an alternate method which loads only the edited portion of the pattern file into the memory. When this method is used, the pattern load time is decreased and tester performance is increased, resulting in enhanced throughput to the customers. This method is expected to result in a performance increase of 50% in, for example, the case of pattern files with 1M vectors

Poster 5

Standalone Pattern Compiler Vinai Kumar Singh, Latha Subramanian, Teradyne/HCL Technologies Currently, the Catalyst™/Tiger™ pattern needs the IMAGE™ environment for compilation. Pattern needs only the pinmap information for compilation which can be provided independently. The drawbacks for implementing the current pattern compiler are: 1) compilation time is high; 2) tester time in the debug mode is an overhead; 3) an IMAGE-dependent environment; and 4) a heterogeneous platform so that the pattern source, i.e., Automated Test Program Generation, could be in Windows but the compilation needs to be carried out in UNIX. In this paper, the authors will propose a solution to remove the dependency of the pattern compiler. The standalone pattern compiler on a separate Linux m/c will compile the pattern (.pat) file in a binary equivalent of .pat file, created in solaris m/c.

Session 8: 9:00 – 10:00 R. Moore Patterns Session 8/A: 9:00 – 9:30

Getting More with UltraFLEX™: Pattern Files, Modules, and Sets Preeti Nargund, Teradyne For many years, the challenge for the ATE industry is to provide fast, low-cost test solutions. Test times include loading, validating, and executing test programs with large quantities of input data called Patterns. The architecture for each test platform focuses on additional techniques that will achieve test time reduction. The features on the UltraFLEX which decrease test time include the capability to reduce binary test pattern size and pattern load time, as well as make test program debug easier. This paper will discuss how UltraFLEX pattern compiler and storage options, as well as various configurations of pattern files and pattern modules, can affect test program load times. The first part of the paper will focus on the use of the Channel Data Latch (CDL) technique and its advantages with pattern load times. The same technique will be carried out to compress the patterns using Z-zip compression to measure the pattern compile and load times. Advantages and disadvantages associated with both techniques are compared. The second part of the paper will describe Pattern files, modules, and the Patset architecture of the UltraFLEX platform — its tradeoffs in debug capability vs. test program load times.

Session 8/B: 9:30 – 10:00

Round Table 1

A Flexible Pattern Format and Platform Conversion Tool

Update on IG-XL Help

Ramon Liu, Freescale Semiconductor

John Buckley, Mike Gill, Teradyne

In semiconductor test, platform conversion is strategically required to tradeoff the cost of test and capacity. Along with platform conversion, pattern conversion is an important but difficult task. Normally, pattern conversion tools are written in script language and customized for a particular pattern format. These customized tools are rarely used again but, when reused, require programming skills to modify and debug to fit the new conversion task. This paper will introduce a flexible text pattern format modification and platform conversion tool. The tool reads only pre-defined format information from a configuration file to complete the pattern format conversion, vector trim/shift, pin/column shift, and micro-code extraction/conversion. With a one-time configuration, it can be applied to any test platform; there is no re-configuration and programming required. This tool has been widely used in Freescale MCU platform conversions from Advantest to the J750™.

Round Table 2

DTV/HDTV Testing on the UltraFLEX™ — Q&A Fang Xu, Teradyne Q&A for Session 6/A

Round Table 3

OpenFLEX Round Table 4

TAG Table

DIGITAL

verted to the FLEX™ followed by a conversion to the UltraFLEX platform. This conversion process is inefficient and may cause loss of information. In this paper, the authors will propose a strategy based on the concept of a virtual platform that stores all the extracted information from the IMAGE-based program/pattern and efficiently converts it to the UltraFLEX without information loss.

Test Time Reduction Technique through Shared Resources Joo Yong Teng, Kar Meng Thong, Infineon Technologies With the complexity of our SoC devices and the increased test time needed to test each device with embedded memories, we are under tremendous pressure to reduce our test time/cost per device. One of the quickest ways to achieve this is to increase the number of devices tested in parallel. This paper describes the experience of using the shared resource feature available in IG-XL™ to increase the number of sites being tested concurrently. With this technique, we were able to double the number of sites being tested on the J750 Teradyne tester, and achieved significant test time reduction.

Session 9/B: 11:00 – 11:30

Converting J750™ Test Programs from DPS to High Density Voltage and Current Source (HDVIS) for More Parallelism Leo Di Bello, Thomas Fanter, Teradyne The high number of channels (24) per board on the HDVIS, a new instrument on the J750, allows for more parallelism. Since the HDVIS fits into the DPS slot, the test engineer can easily replace the DPS with the HDVIS when needed. This paper will describe how to convert existing DPS test programs to start using the HDVIS in the DPS slot. The authors will describe their experiences and lessons learned from two microcontroller program conversions. In addition, the paper will describe how to use some of the other additional features of the HDVIS to save test time and improve repeatability.

Session 9/C: 11:30 – 12:00

Adding Setup Information to Test Flow Using IG-XL™ VBT Ramon Liu, Freescale Semiconductor In a typical IG-XL test environment, the test setup information is stored separately in Test Instance/PatSet/TimingSet/Level Sheets, requiring frequent switching between worksheets to search setup information for a test. This reduces the efficiency of program debugging and increases the possibility of error, especially when some test instances are using inheritance mechanisms to follow the setup of a previous test instance in test flow. This paper will introduce a technique to add setup information (such as Level/Timing/Pattern/Specs/Relay Mode) to each test instance in test flow using VBT. This technique will facilitate debugging for test engineers. In addition, it can be integrated into VBA IDE as an Add-In program or a VB module.

DIGITAL

LUNCH: 12:00 – 1:00

relationship between two signals (i.e., setup, hold, delay, and so on). Specified timing involves capture of both signals to get the desired results. In the past, getting these results involved the development of custom interpose functions to calculate and datalog data. To optimize the process, a reusable library which contains commonly used functions was developed. The library can be ported easily into IG-XL test programs and save time for test engineers who will no longer need to develop custom routines.

LUNCH: 12:00 – 1:00

Session 2: 1:00 – 2:30 Q’s lab BREAKFAST: 7:00 – 8:00 WELCOME: 8:15 – 8:45

Session 10: 1:00 – 2:30 A Golden Eye on Characterization

Weishu Wu, Texas Instruments

Session 11: 3:00 – 5:00 Testing is Forever

Session 10/A: 1:00 – 1:30 Session 11/A: 3:00 – 3:30

Mike Patnode, Teradyne

Michael Cavallini, Julia DiChiaro Teradyne

This paper will explore how IG-XL characterization can be used with interposing functions, other Visual Basic functions, and Excel programming tools to present device characterization data in a clear way. The author will describe standard shmoo and measure capabilities and how customization can expand these capabilities. Among the techniques discussed will be creating a VI curve, showing per-pattern shmoos, and extracting device datasheets from characterization data.

In this paper, the author will describe the add-in application for IG-XL test platforms and how to use it. The add-in allows the user to convert the IEEE Standard Test Interface Language (STIL) to Teradyne’s IG-XL test language and convert it back to STIL.

AppsShmoo: A Tool for Characterizing Devices Stephen Davis, Zubir Ebrahim, Yukichi Inoue, Teradyne This paper will describe AppsShmoo, an application Shmoo tool developed by Teradyne for the FLEX™ and UltraFLEX™ platforms. AppsShmoo has all the main capabilities of the current IG-XL™ Shmoo tool. The features that make AppsShmoo a great device characterization tool include the accumulated Shmoo capability, one-click import and export of ASCII outputs, easy tracking of input parameters, command-line Shmoo, and one-click margin. When installed, this .exe file will integrate into Datatool to allow AppsShmoo to work with all device programs without requiring explicit references.

Session 10/C: 2:00 – 2:30

IG-XL™ UltraFLEX™ Characterization Library Anne Marie Guray, Broadcom; Vivian Wang, Teradyne When a test program is first developed for production, patterns and timing generated by designers are usually not optimized for characterization. Many times, timing characterization involves a

KEYNOTE I: 8:45 – 9:30 KEYNOTE II: 9:30 – 10:15

Getting the Most Out of IG-XL™ Characterization

Session 10/B: 1:30 – 2:00

Advanced Measurement Methods of Hysteresis Featured in Mixed-Signal IC Chips

MIXED SIGNAL

BREAK: 2:30 – 3:00

Session 2/A: 1:00 – 1:30

IG-XL™ STIL Bridge

BREAK: 10:15 – 10:30

Session 1: 10:30-12:00 Q’s Lab

Hysteresis is a common parameter in many mixed-signal IC chips. To determine the exact amount of hysteresis is often time-consuming because two searches for two transit points are involved. To reduce test time, a novel binary method that searches both transit points concurrently has been implemented in Catalyst™based test programs. To take advantage of the source memories and ramping capability of the FLEX™ testers, a search method that utilizes asynchronous trigger of DCVI by DCTime has been implemented. Test time can be reduced further when the test program is moved from Catalyst to FLEX.

Session 11/B: 3:30 – 4:00

Session 1/A: 10:30 – 11:00

Session 2/B: 1:30 – 2:00

Proper PPMU Route Sequence to Minimize Glitches at the DUT

Jitter Testing with Dig_Cap

The Implementation of Fourier eXtended Transform (FXT) in IG-XL™

Zuyan Liang, Shams Syed, Teradyne This paper will describe the PPMU connect and disconnect requirements during customer or checker jobs. Uncontrolled PPMU connection sequences produce transients that may cause device damage and PPMU latch up. A few customers have raised concerns about the transients at the DUT. Current customer templates were used to quantize transient levels. To minimize transients during PPMU routing, function calls to the current templates were modified.

Session 11/C: 4:00 – 4:30

Extended Characterization Method for the J750™ Deyan Karastoyanov, Infineon Technologies Semiconductors are getting smaller, faster, and have more features. These improvements bring new requirements for test and characterization. The characterization ability of the J750 is limited; it cannot run pre-condition and post-condition tests. In this paper, the author will describe a DUT that requires this type of characterization and a technique that will resolve the problem.

SURVIVOR PARTY: 5:30 – 7:00

Joyce Ng, Kevin Walt, David Yin, Broadcom

Edmond Tan, Shu Xia, Teradyne This paper will describe how to measure jitter on digital pins using Dig_Cap with VB code.This technique can be used for multiple tester platforms, and has been implemented on one of the products in production at Broadcom.

Session 1/B: 11:00 - 11:30

What Is and How to Use Learn Mode Michael Cavallini, Brent Herling, Kent Magnuson, Teradyne Have you ever wondered why a tester would have the capability to learn the outputs of a pattern? If so, this paper is for you. It will describe the learn mode on the FLEX™. In addition, the authors will explore one of the many reasons to use learn mode, the time it saves, and the programming necessary to implement it.

Session 1/C: 11:30 – 12:00

FLEX™ DSSC vs. ADB Bus Kevin Cheng, Jerry Hsieh, Teradyne To reduce the cost of test for the complex/high performance ADC/DAC on the FLEX, it is very important to assign a tester resource when doing loadboard layout. To minimize the DSSC used for the digital slot, it is necessary to take care of the pin assignment, especially with multisite implementation. In this presentation, a guideline will be provided for coding the DSSC when serial/parallel mode is used. The DSSC loadboard design will also be discussed. In addition, the problems encountered by the authors and their countermeasures will be addressed.

This paper is a follow-up to the TUG 2006 paper titled Incoherent Sampling without Spectrum Leakage, Is It Possible?. When coherent sampling is not achievable, FXT eliminates spectrum leakage by demodulating the fractional portion of the non-integer number of captured cycles. Since FFT-based testing is widely used in analog and mixed signal testing today, this technique has received a lot of attention. This paper will implement FXT into IG-XL as a universally functional VBT method that works transparently and consistently like other standard DSP methods to calculate dynamic results such as SNR, THD, SINAD, SFDR, and so on.

Session 2/C: 2:00 – 2:30

Understanding IG-XL™ DSP Enhancements Hmayak Dravatshyan, Scott Therrien, Teradyne This paper will discuss FLEX™ Family DSP performance considerations that need to be understood in order to write the most efficient DSP procedures, as well as symptoms and remedies for the most common issues that users encounter when working with DSP procedures. The paper will also touch on topics such as understanding DSPWaves and improvements made to them in IGXL version 6.10 and how to minimize memory usage in DSP procedures. In addition, the authors will present an overview of the global variable feature for DSP procedures.

Session 3/C: 4:00 – 4:30

Session 5: 10:30 – 12:00 How Many Bonds Can You Convert? II

Automated Test Program Conversion K. Padma Priya, Vinai Kumar Singh, Teradyne/HCL Technologies

MIXED SIGNAL

Session 3: 3:00 – 5:00 Tools Session 3/A: 3:00 – 3:30

Get the Best of your High-Density PMU DirkJan Stuij, Salland Engineering; Francois Deun, Teradyne As part of the OpenFLEX initiative, Salland Engineering developed the High-Density PMU (HDPMU). This highly integrated instrument provides the FLEX™ and microFLEX™ up to 192 VI channels to any mixed-signal DUT. This paper will introduce the basic features of the HDPMU (ForceV/I, Measure V/I) and describe the advanced techniques like channel merging, external/local sensing, focused cal, PSet usage and fast readback measurement. Written like a cookbook, this paper can be used as a reference for beginners to advanced HDPMU test engineers who are developing on the FLEX.

Session 3/B: 3:30 – 4:00

AC Characterization of BBAC™ and POOL2 Signal Sources

Session 3/D: 4:30 – 5:00

Understanding DCTime Larry Lovell, Teradyne One advantage of the FLEX™ system is its capability to have multiple instruments on each board. Each DC30, DC75, and DC90 has the advantage of two DCTime instruments onboard. This advantage is often misunderstood, especially when the engineer is migrating from the IMAGE™-based platform. In this presentation, the author will describe some of the pitfalls encountered when using DCTime, offer some insight for its proper use, and provide some alternatives when necessary.

TERADYNE PARTY: 6:00 – 9:00

Session 5/A: 10:30 – 11:00

Micocontroller-Based Servo Loop for ADC Linearity Testing BREAKFAST: 7:30 – 8:30

Session 4: 9:00 – 10:00 How Many Bonds Can You Convert? I Session 4/A: 9:00 – 9:30

Use Half of ADC Bits Output to Reconstruct Waveform for Dynamic Testing Adonis Chang, Teradyne This DSP algorithm needs only half of ADC bits output for processing which means that half of the digital captured pins on parallel output devices or half of the captured memory on serial output devices are needed. For parallel output devices, the digital captured pins need to run below 25MHz on the J750 if the ADC device is more then 16 bits output. When this DSP algorithm is used on the J750, it will no longer have this restriction and will be capable of supporting tests of 32-bits ADC up to 50MHz. For serial output devices using this DSP algorithm, only half of the captured memory size previously required is needed, resulting in twice the captured memory size. If the ADC output can be modified to use this DSP algorithm on the J750, it will be capable of testing ADC devices up to 100MHz.

Don Jussaume, Analog Devices This paper will examine the AC Performance of the FLEX™ BBAC Signal Source and the POOL2 Function generator. SNR, THD, and SINAD performance will be characterized at specific frequencies using the FLEX internal ‘loopback to capture’ feature and an independent spectrum analyzer. Amplitude linearity of the BBAC source will also be characterized. In addition, test methods, programming examples, and data result summaries will be presented.

Shu Xia, Teradyne ADC linearity testing measures the transition points of digital codes. Servo loop technique is widely used in testing the linearity of high resolution (14-bit, 16-bit, and more) analog to digital converters. However, current solutions are using either test programs or sophisticated pattern microcodes to control the servo loop operations. They also rely on expensive AC source or digitizer instruments. This paper will propose a microcontroller-based low cost and intelligent servo loop solution whose operation is fully handled by the firmware inside the microcontroller. Hence, this solution will not only simplify the programming, but can be used on a pure digital tester.

Session 5/B: 11:00 – 11:30

Undersampling Using Beat Frequency (Theory and Practice) Ching-Chia Tien, Teradyne When facing the limitation of the digitizer, engineers are forced to test the signal higher than the Nyquist frequency. The traditional undersampling method uses one unit test period plus a small delta to walk through the waveform, which is prone to droop because of the low frequency jitter. In this paper, the author will describe how to test high frequency signal using beat frequency.

Session 5/C: 11:30 – 12:00

Session 4/B: 9:30 – 10:00

Testing a Correlated Double Sampling ADC on the FLEX™

Improving INL DNL Repeatability

Lai-Choon Chan, Teradyne

Steve Matej, Jim Ptasinski, Texas Instruments; Kent Magnuson, Teradyne The uncertainty of sample location reduces measurement precision and repeatability from run-to-run or tester-to-tester. This paper will examine some steps to create better repeatability when measuring INL DNL on an ADC device.

BREAK: 10:00 – 10:30

MIXED SIGNAL

BREAK: 2:30 – 3:00

Due to the growing complexity of integrated mixed-signal video devices and shorter time-to-market cycles, the test program conversion process needs to be automated to reduce the program development time. This automated process will be most beneficial when the customer moves from one tester platform to another. In this paper, the authors will introduce the automated converter tool which will convert nearly 70% of the test program and patterns and provide a guideline for manual modification for the remainder of the test program. This user-friendly tool will be developed in the form of frameworks so that future conversions can be automated quickly.

The general rule for testing an ADC is to use an AWG with a higher resolution than the device being tested. In the event that the instrument resolution is inadequate, a segmented ramp test technique is sometimes used. In converter technology, resolution decreases as sampling frequency increases. The challenges in testing a correlated double sampling (CDS) ADC are twofold. They are: 1) the AWG has to sample at twice (or higher) the rate of the DUT because it has to generate a reference level and a data level for each ADC sample clock, and it should preferably have higher resolution; and 2) since the reference (black) level has to be generated for each test sample, the output of the AWG must be able to span the entire dynamic range throughout the test. Segmented ramp testing cannot be employed. This paper will investigate three techniques to test a CDS ADC and will describe their strengths and weaknesses. The techniques are VHFAC source; BBAC source + DC30; and high-speed, highresolution DAC + DSSC source.

LUNCH: 12:00 – 1:00

Session 6/C: 2:00 – 2:30

Poster 4

Testing High-Speed Mixed-Signal Devices on the UltraFLEX™

Incorporating the J750™ into the Electrical and Computer Engineering Curriculum — MSO Option

Daniel Weinberg, Analog Devices

MIXED SIGNAL

Session 6/A: 1:00 – 1:30

Clock Jitter Effect for Testing Data Converters

BREAK: 2:30 – 3:00

Jin-Soo Ko, Teradyne Estimating data converter noise by clock jitter performance is not a simple task. In most cases, jitter vs. noise tables or some complicated calculations are used. Since the estimate is related more to the input and output frequency than the clock frequency, this can create confusion for the test and design engineers. The author has suggested a simple noise power calculation formula by changing the clock jitter RMS level. The formula was tested with a 14-bit DAC using a jittered clock source. The calculation was verified using a simulation model by DSP. This formula provides a simple way for engineers to design and test data converters.

Session 6/B: 1:30 – 2:00

Conversion of ADC Ramp Tests from the J750™ to the UltraFLEX™

Session 7: 3:00 – 7:00 Engineering Update, Round Table/ Poster Sessions & Vendor Fair

Poster 1

Advanced Techniques to Overcome Tester Limitations When Testing ADCs Aarthi Sundararajan, Tessolve Services This paper will substantiate the use of inexpensive crystal filtering techniques in providing remarkable noise filtering capabilities to aid ADC testing when using low resolution tester resources. In addition, the author will describe how to expand the tester’s DSP library by adding some simple algorithms.

Poster 2

Semiconductor Business Meeting

Another POP Story

Round Table 1

Kent Magnuson, David Pickard, Teradyne

Update on IG-XL™ Help

Session 7/B: 3:15 – 4:00

Semiconductor Engineering Update Session 7/B: 4:00 – 4:45

Semiconductor Open Forum Discussion

VENDOR FAIR: 4:00 – 7:00

Poster Presentations/ Roundtable Sessions: 4:45 – 7:00

This paper will describe an extension of a testing curriculum in the Department of Electrical and Computer Engineering at Iowa State University (ISU), Ames, based on the addition of a Mixed-Signal Option (MSO) to the J750 platform. Several different events coalesced to enable the establishment of a testing curriculum at ISU. In the early 1990s, a center for mixed-signal and analog VLSI design was formed at ISU. In early 2000, Teradyne and ISU initiated discussions on the need to augment the VLSI design center with the capability for high-speed VLSI testing. In late 2002, Teradyne donated a J750 with 64 channels of 100 Mb/s digital capability to ISU. After continued interaction, Teradyne donated a Mixed-Signal Option (MSO) for the J750 in late 2005. In March 2006, ISU alumni working at Teradyne conducted an on-site training for the MSO. A senior design team is writing an operating manual for the use of students for the MSO.

Session 7/A: 3:00 – 3:15

Russell Long, Freescale Semiconductor; Tim Scanlon, Teradyne As part of an overall program conversion project, a series of ADC ramp tests were converted from the J750 to the UltraFLEX. The primary instruments used on the J750 platform were the MSO, MTO and DPS. The target instruments on the UltraFLEX platform were the BBAC, DSSC Capture, and DCVI. In addition, differences in the software components such as Test Procedure elements, instrument-specific VB code, and DspWave objects were addressed. The primary benefit of this conversion was improvement in throughput and accuracy.

Robert Weber, Iowa State University

This paper will describe how to take advantage of the Pattern Oriented Programming (POP) available on the FLEX™ by converting an existing program to the tester. It will examine the time saved when using POP compared to non-POP.

MIXED SIGNAL

Session 6: 1:00 – 2:30 How Many Bonds Can You Convert? III

This paper will present the findings from an evaluation of the UltraFLEX High-Speed Digital Subsystem and its suitability as a platform for testing high-speed mixed-signal devices. A Dual, 16bit, 1GSPS DAC was used to evaluate the system's digital capabilities to provide clock and data signals for the DUT and the performance of the GigaDig as an AC capture and analysis mechanism. In addition, the test execution times to existing test solutions will be compared.

John Buckley, Mike Gill, Teradyne

Round Table 2

DTV/HDTV Testing on the UltraFLEX™ — Q&A

Poster 3

Fang Xu, Teradyne

Increase Time for Coffee Breaks – Reduce Time for Test Development and Debug

Q&A for Session 6/A

Roy Chorev, Ali Syed, Teradyne

OpenFLEX

Test engineers realize that the time required to develop a test program is becoming as important as test time. With the increasing need to get to market faster, test engineers require development and debug tools that improve their efficiency, create highly optimized test programs, and allow time for coffee breaks! Integrated into the existing FLEX™ IG-XL™ architecture are new development/debug tools that will help test engineers improve their productivity. Through a variety of test examples and illustrations, this paper will describe how test development and debugging productivity can be improved for engineers who create mixed-signal test programs. Among the topics covered are tools to generate VBT code from instrument debug displays and create PSet and Signal Definitions from standard IG-XL DataTool Sheets.

Round Table 4

Round Table 3

TAG Table

Session 11/A: 3:00 – 3:30

Session 9: 10:30 – 12:00 Spectre's World Domination Concepts II

New Approaches to Pulse Train Integrity Testing Scott Therrien, Fang Xu, Teradyne

Session 9/A: 10:30 – 11:00

How to Specify Units and Scale Test Limits in the IG-XL™ 5.1 Flow Sheet

Session 8: 9:00 – 10:00 Spectre's World Domination Concepts I Session 8/A: 9:00 – 9:30

Programming Pattern Vectors and DSSC on MUX Mode for FLEX™

Eric Buvry, Teradyne IG-XL 5.1 supports limits in the flow sheet. Without impacting test time, a custom VB module can support unit limits and scaling from the same flow sheet. When using POP, a routine will help to reduce the VB code to be written. In this paper, the author will describe how to specify units and scale test limits in the IG-XL 5.1 flow sheet.

Session 9/B: 11:00 – 11:30

Yan Jin, Jason Miller, Haibo Zhang, Texas Instruments; Cliff McCallister, Teradyne

Advanced Parallel Trim Algorithm with POOL PVM Auto-Calibration

The HSD200 can run at only 50MHz without a license for a higher frequency. To run the serial port above 50MHz and avoid the extra license, a MUX mode design and programming method is needed. In this paper, the authors will introduce the methodology to program the serial port to write at 80MHz using digital patterns, and read at 80MHz using DSSC capture, both at MUX mode. The details of hardware design, digital timing programming, DSSC capture setup, pattern programming at MUX mode, and data manipulation from dual channel DSSC capture will be discussed.

Jared Jones, Analog Devices

Session 8/B: 9:30 – 10:00

High-Speed Dynamic ADC Test on a Low-Cost Digital Tester

Multisite, parallel, fast, and accurate test techniques are the goals in keeping costs low and meeting customer demands. Trimming the product helps to guarantee high performance. Complicated trim algorithms challenge the test engineer to meet these goals. This paper will describe techniques to achieve these goals of the test program. “Flattening” a complicated trim flowchart and using the IG-XL™ SiteVariants allow the test engineer to implement a parallel multisite trim flow even when sites require different trim steps. Using a fast measurement instrument which measures multiple sites in parallel is desired. Automatic calibration of the faster instrument with the ideal measurement instrument helps to meet accuracy requirements.

Mile Cheung, Claus Dworski, Infineon Technologies

Session 9/C: 11:30 – 12:00

With the trend to integrate analog or RF parts on one silicon chip, the normal approach is to test the device on more than one tester platform, namely digital, mixed signal and RF. However, this approach will increase the overall cost of test or reduce EBIT. Therefore, a simple and effective reusable solution is needed. In this paper, the authors will demonstrate and describe the implementation of a high-speed direct digital synthesizer add-on circuit on the J750™ test system. As a result, a good resolution sinusoidal wave up to 40MHz (14-bit, 400MSPS internal clock speed running on the DDS) will be generated using the J750 MTO option to capture the device outputs and perform certain DSP functions (e.g., FFT, Digital Filtering, and so on). The demonstration will show that a high-speed dynamic ADC test can be performed on a low-cost digital tester.

Improving Test Efficiency Using DFT Concepts: A Potpourri of Ideas from Servo Devices

BREAK: 10:00 – 10:30

Sundeep Desai, Texas Instruments

Session 10: 1:00 – 2:30 Spectre's World Domination Concepts III Session 10/A: 1:00 – 1:30

It Pays to Own a FLEX™ Xnorikazu Sugano, Sony; Gavin Gao, Jack Chen, Teradyne In this paper, the authors will describe a key customer’s conversion to the FLEX platform and its advantages over the customer’s original platform. With the FLEX, test time is reduced 70%. The capabilities on the FLEX that make this major reduction in test time possible include its multisite flexibility, DSSC, and parallel DSP processing. The authors will describe the differences between the instruments on the FLEX and the original platform, test solutions, and how tests were done before and how they are done now.

Session 10/B: 1:30 – 2:00

Double Your Sampling Rate See Hwa Goh, Teradyne Using one DC30 channel, the maximum capture sampling rate of 100kHz can be doubled with the aid of another DC30 channel. Connect the two DC30 channels to the point of capture and set one DC30 channel to capture at 100kHz and one to capture at 100kHz at about 5us later. Both captured data can be interleaved accordingly, resulting in twice the waveform samples. This method, as described by the author, will achieve an effective capture rate of 200kHz.

Session 10/C: 2:00 – 2:30

Controlling the Flow — Implementing Complex Test Program Flows in the IG-XL™ Flow Table

DFT has become a cliché in test parlance and has attained a rhetorical value in its implementation. By providing practical examples for DFT usage in SPG mixed-signal designs, this paper will disprove that cliché. A careful distinction will be made between ideas that deal primarily with observability and controllability issues to ones that employ authentic changes to architecture and technique. Thus, the possibilities that will be covered run the gamut from having test access to observe latched over current signals on power FETs to converting time measurements to DC. In addition, a number of ideas that cannot yet be implemented will also be included, e.g., voltage divider ratios on hysterectic comparators.

John Arico, Analog Devices

LUNCH: 12:00 – 1:00

BREAK: 2:30 – 3:00

Most test programs require only a simple, sequential flow. Sometimes, however, a more complex route through the test list is required. Although this can be accomplished by writing complex program code underneath the test instances, the result is less portable code. Portability can be maintained, though, if test flow decisions are made at a higher level, instead of in the program code. The IG-XL Flow Table provides many features through which a very complex test flow can be implemented using simple, more modular test instances. This paper will discuss some of these features and will provide practical examples of complex Flow Table programming.

Session 11: 3:00 – 5:00 UltraFLEX Concepts

MIXED SIGNAL

BREAKFAST: 7:30 – 8:30

Testing integrity of PLL or clock circuits is often a difficult challenge requiring very high speed sampling instrumentation. Typical solutions use an undersampling technique to reconstruct the time domain aspects of the pulse train output for analysis. But what happens if there are missing pulses in the pulse train? Will an undersampling technique be a robust solution in such a case? This paper will show how one can utilize a mathematical solution to accomplish the task of testing pulse train integrity using frequencybased measurement instrumentation instead of time-based sampling instrumentation. In addition, mathematical principles as well as actual tester characterization data will be discussed.

Session 11/B: 3:30 – 4:00

Using DCTimeHP to Measure Spread Spectrum Clock Generation (SSCG) Modulate Clock Frequency on the UltraFLEX™ David Wu, Teradyne This paper will describe an inexpensive solution to test SSCG by implementing two DCTimeHP time stamps on the UltraFLEX. This presentation will provide a guideline to use DCTimeHP to stamp events for SSCG into Dspwave for analyzing the next step. It will point out how to measure SSCG and what the spec limitation is for DCTimeHP on this application.

Session 11/C: 4:00 – 4:30

UltraFLEX™ DSSC Test Time Optimization Tyler Tolman, Broadcom; David Lam, Teradyne During test program development on the UltraFLEX tester, DSSC programming is a very convenient tool to program and test the device. However, getting the tool to work efficiently can be a challenge. This paper will explain the techniques used in both DSSC pattern and VBT programming to reduce test time significantly for DSSC applications.

Session 11/D: 4:30 – 5:00

An Easily Integrated, Efficient Approach for Wideband Captures Using TurboAC™ Andrew Varley, Teradyne Wide bandwidth measurements usually require the user to take multiple captures and re-center the local oscillator between each acquisition. Multiple captures have always meant longer test times, but this paper will describe how automated multiple captures can acquire wide bandwidth spectrums with fast test times and high performance. The program is easily portable, which allows users to plug-nplay this technique into any test program to capture the desired wideband spectrum. DSP reconstruction interweaves the multiple captures together to generate a single plot of the total spectrum. Efficient test time and high performance for wideband spectrums is possible using TurboAC and multiple down conversion captures.

SURVIVOR PARTY: 5:30 – 7:00

Session 1/C: 11:30 – 12:00

Session 3/B: 3:30 – 4:00

Better Programming on the FLEX™ Tester for Easy Debug and Easy Switch from Characterization to Production Test

Force Fail Tool, Accelerating Production Release Walter Oldham, Teradyne

Elie Trognon, Freescale Semiconductor

BREAKFAST: 7:00 – 8:00 WELCOME: 8:15 – 8:45 KEYNOTE I: 8:45 – 9:30 KEYNOTE II: 9:30 – 10:15

Test program development time is always a big challenge. The same test program is modified to debug and characterize the device and finally test it in production. Therefore, the step from characterization to production requires a long development phase which was not planned during the first phase coding. This paper presents techniques on the FLEX that allow easy debugging and switching from characterization to production test.

LUNCH: 12:00 – 1:00

POWER MANAGEMENT/ AUTOMOTIVE

Session 1: 10:30-12:00 Accelerating Program Development and Characterization Session 1/A:10:30 – 11:00

Reduce Program Development Time for the Automotive Market on the FLEX™ Dominique Le Roux, Teradyne Reusing a proven working code will dramatically reduce test time development for a new test package. In this paper, the author will describe a set of functions, including the trim and fuses description, best fit trim selection, and memory management, to be reused as a standard. The capability to record the trim effect will allow fine tuning according to the lot parameters.

Session 1/B:11:00 - 11:30

VBT or POP? How to Decide the Implementation of a Mixed-Signal Test Fast Cristian Cesarini, Filomena Ricci, Teradyne When approaching the implementation of a mixed-signal test, the dilemma is VBT or pattern. At first glance, it is not always easy to determine whether testing in a pattern will lead to better execution time as the time overhead associated with pattern start and pattern halt can jeopardize it. Furthermore, pattern may increase test complexity, making it difficult to debug. The goal of this paper is to simplify the decision process by providing a few guidelines to help you make a good approximation of the expected time overhead. User programming style can also affect start pattern overhead. Keeping in mind a few IG-XL™ behaviors will help to minimize that overhead as well.

Session 2: 1:00 – 2:30 Accelerating Program Development and Characterization

Sync Panel, Uncovering Issues Walter Oldham, Derek Sam, Teradyne The market window for today’s devices is much tighter than in the past. As a result, the time to develop and debug the HW and SW components to test devices in production has also shrunk. As test engineers, we seek debug tools that allow us to get our jobs done faster and more effectively. Using the Sync Panel and an oscilloscope on the FLEX™ platform provides an efficient means to debug device setups and tester signals. This paper will demonstrate the use of the Sync Panel in a variety of use cases.

BREAK: 2:30 – 3:00

Session 2/A: 1:00 – 1:30

My Pattern is Running — Can I Still Debug?

Session 3: 3:00 – 5:00 Test Quality: Ready to Ramp?

Lorenzo Simonini, Elisa Woo, Teradyne

Session 3/A: 3:00 – 3:30 In most power and mixed-signal test programs there is a need for handshaking between pattern and VBT program flows. On the FLEX™ there are different ways to implement the handshaking with different tradeoffs between test time and ease of debug, namely KeepAlive™ versus CPU loops. This paper will address the different tradeoffs and also present new software techniques for users to interact with FLEX DC (DC30, DC75, DC90) instruments via debug displays while a pattern is running during CPU loop execution.

Session 2/B: 1:30 – 2:00

Using the PLMeter as a Debug Resource Krista Bertsch, Teradyne Oftentimes there are unused resources in your tester for any one device. Since the resource is already in place, how can we use it to our advantage? The PLMeter is one good example of a resource that can be useful as a debug tool. The PLMeter can function as an onboard scope, offering more advantages for low pin count devices with short test times. Because the PLMeter has a capture memory of 4096, it can capture an entire test program that is 500ms long with a resolution of just over 120us. In this paper, the author will describe the advantages and disadvantages of using this technique, as well as providing the code to set up the meter. In addition, the author will discuss an example LDO program that was debugged using this technique.

Faster Ramps and Higher Yields in the Pursuit of 0 DPM Richard Ackerman, Becki Watt, Mentor Graphics Integrated circuit manufacturers are under constant and increasing pressure from their customers to reduce costs; this pressure makes it imperative they produce high-yielding, high-quality devices with a quick production ramp. Although particulate defect rates are relatively stable, yields continue to fall with each process generation as systematic, or feature dependant, defects become the predominant failure mechanisms. Yield improvement in the presence of these defects requires design corrections. Maintaining profitability in this market requires high-quality tests; accurate, high-volume diagnosis of production failures; and the development of a feedback process where design parameters are driven by production data. In this paper, the author will describe ways to produce higher yields with faster time to market.

Session 3/C: 4:00 – 4:30

Relays — Conquering the Test Engineer's Nemesis

POWER MANAGEMENT/ AUTOMOTIVE

BREAK: 10:15 – 10:30

Session 2/C: 2:00 – 2:30

Releasing a test program to production is never an easy task for test engineers. They must ensure the program is stable and meets quality requirements while responding to other demands, some of which may be in conflict, such as meeting aggressive schedules and hitting yield and performance targets. The Force Fail Tool described in this paper is targeted to help test engineers with the production release process. The tool forces failures on some or all limit checks in a program for a specified site automatically. It will help test engineers check for site-to-site interactions, site shutdown issues, and improper reset conditions quickly.

Paul Nelson, Elisa Woo, Teradyne Instrument connections continue to present test time challenges and plague reliability on instruments that use relays for DIB connections. The DC instrument hot-switching detection tool has been deployed to aid in relay use education. This paper will describe the highlights and lowlights from the first year of tool usage in field applications; it will describe the tool and how lessons from it can be applied to other instruments and DIB relays. Determining the best methods for using different instruments and programming structures based on the instruments’ specifications and documentation to optimize the connections will also be covered. These methods will also include techniques that will put FLEX™ instruments into benign states rather than repeating disconnects and connects.

Session 3/D: 4:30 – 5:00

Lowering DPPM without Increasing Burn-in or Test Time Jeff Bibbee, OptimalTest Common sense leads test and product engineers to believe the only way to lower DPPM is to either increase burn-in or increase test time by introducing additional stress tests. Using an emerging technology named Test Management Solutions (TMS), DPPM can be lowered significantly while burn-in and test time are actually reduced. Case study results show that TMS and its inherent rule sets push DPPM toward zero.

TERADYNE PARTY: 6:00 – 9:00

Session 5: 10:30 – 12:00 Welcome to Power: High Voltage/ High Current Test

Session 7: 3:00 – 7:00 Engineering Update, Round Table/ Poster Sessions & Vendor Fair

Session 5/A: 10:30 – 11:00

BREAKFAST: 8:00 – 9:00

Tutorial — DC90™ Voltage Compliance, Part 1: Insider Look at the DC90 Power Model Cristian Cesarini, Arthur Russell, Chi-Heng Wang, Teradyne

Session 4: 9:00 – 10:00 Welcome to Power: High Voltage/ High Current Test Session 4/A: 9:00 – 9:30

POWER MANAGEMENT/ AUTOMOTIVE

Dean Garrison, Sherry Sponheimer, Teradyne Two customers asked whether it is possible to drive a DC30 to 35V @ 200mA. Another customer asked if he can test a -48V DC Hot-Swap controller with a DC30. Yet another asked how to get a DC30 to act more like a High Voltage DPS (Device Power Supply 30V @ 200mA). This paper will describe how to achieve higher than 30V @ 500mA using only a single DC30 channel and a few additional parts. The paper will also present one way of achieving this goal schematically, a simple FPGA controller to allow low current IDDQ measurements without glitches, and how the DC30 channel can be adapted for use as a DPS.

Session 4/B: 9:30 – 10:00

Parallel Test Solution for a High Current PROFET Device Using FLEX™ DC90 DEMUX Petar Fanic, Tzong Sheng Ng, Infineon Technologies Due to the limited mounting area on the DIB, getting accurate test results is difficult. Using the FLEX DC90, the authors developed a parallel test solution that reduces the number of relays on the board (eliminating high current relays) and improves test accuracy. Work required to maintain the boards should be reduced as well. In this paper, the authors will describe how they measured four 80A devices using four DC90 cards (16 DC90 sources) simultaneously. Tests up to 40A were done in parallel. Tests up to 80A were done for two devices simultaneously without relays on the board. There was no connection between the devices; the devices were electrically isolated and tested separately.

BREAK: 10:00 – 10:30

Session 5/B: 11:00 – 12:00

TUTORIAL — DC90™ Voltage Compliance, Part 2: Are You Getting your Two Kilowatt's Worth? Cristian Cesarini, Arthur Russell, Chi-Heng Wang, Teradyne DC90 VI Power Curve Tool is an interactive real-time calculator that aids in test program development and debug. It validates instrument parameters against the constraints for current amplitude, pulse width, compliance voltage, DUT voltage, VI thermal dissipation, and system level power constraints. In this tutorial, the authors will describe the tool and how it works.

LUNCH: 12:00 – 1:00

Session 6: 1:00 – 2:30 Welcome to Power: High Voltage/ High Current Test Session 6/A: 1:00 – 1:30

When to Use Which V/I Crossover Type on the FLEX DC90XP Mereen Mammen Full four-quadrant automatic V/I crossover is one feature that makes V/I instruments one of the most versatile tools for mixedsignal, power, and automotive testing. There have been several topologies employed in Teradyne instrumentation over the years, and there are advantages and disadvantages to all of them. For the DC90XP, the V/I instruments offer the choice of three user

selectable crossover types. However, before users can take advantage of this flexibility to solve their testing problems, they need to know how each type works and which type to use in certain test situations. This paper will describe when to use which crossover type so test program developers will have the best chances of using their choices successfully.

Semiconductor Business Meeting Session 7/B: 3:15 – 4:00

Semiconductor Engineering Update Session 7/C: 4:00 – 4:45

Semiconductor Open Forum Discussion Session 6/B: 1:30 – 2:00

Paralleling DC90XP VIs to Achieve Currents Beyond Merged Mode

VENDOR FAIR: 4:00 – 7:00

Eric Bergeron, Maurilio Fabiano, Teradyne

Poster Presentations/ Roundtable Sessions: 4:45 – 7:00

To deliver more current than a single DC90 VI channel, the user can merge channels and not worry about sharing current among the channels or adding DIB components that compromise voltage forcing accuracy. The DC90XP, a new version of the DC90, features a different method for paralleling as many as 16 channels. This method requires programming a new Current Limit Mode to prevent overheating the VI. No DIB components are required. This paper will describe the difference between Merged Mode and paralleling and how to parallel channels for currents up to 32ADC or 160Apulsed.

Session 6/C: 2:00 – 2:30

Introduction to the DC90XP — A High Power Instrument Optimized for the Automotive Market Cristian Cesarini, Larry Klein, Teradyne The automotive device market is changing. Devices requiring higher currents, better dynamic performance, and higher throughput are being produced in volume. These devices take advantage of newer FET technology to switch higher currents at faster on and off rates than previous generation devices. In addition, the volume of parts being designed into each automobile continues to climb, increasing production volumes for these parts and driving requirements for shorter test times. The DC90XP is an instrument designed to address these needs in the automotive market. It is an updated and improved version of the DC90™ instrument which addresses the above needs while maintaining compatibility with the DC90. This paper will describe the requirements of the automotive device test market and will detail the features of the DC90XP to address them. Technical changes will be described, along with examples of how to use them and the impact they will have on device test.mechanism. In addition, the test execution times to existing test solutions will be compared.

BREAK: 2:30 – 3:00

POWER MANAGEMENT/ AUTOMOTIVE

How to go Beyond 30V @ 100mA with only Two DC30 Channels

The DC90 VI offers users flexible control over how power is distributed and dissipated within a channel. Waveform syntax permits precise control over drive waveforms. The instrument supply rails are continuously variable and, with the new IG-XL™ release, users have almost complete control over these rails (no additional padding of Voltage Compliance). Because of this flexibility, users may bump up against several different specified capability limits, such as internal thermal limits, slot power limits, and pulse width/current limits; but, they may not always know why or how to fix them. This paper will describe the hardware's capabilities against these various constraints. In addition, it will introduce a new software tool, DC90 VI Power Curve Tool, which will help users understand and manage their performance against these constraints.

Session 7/A: 3:00 – 3:15

Poster 1

Implementating a SetupManager VB Class to Simplify PSet-Based Instrument Programming Manfred Graf, Teradyne The SetupManager VB class offers the possibility to create different types of instrument setups. The instrument setups such as DCVI PSets and HVD signals are defined for each IG-XL™ test instance in one single setup file as ASCII text. In addition, the SetupManager class supports loading specific instrument settings for each test instance. Advantages of this technique include improved reusability, a modular programming style, and a reduction in test program development time. In addition, the SetupManager tool supports the easy creation of instrument setups and is being extended to auto generate the setup information from device specifications. In this paper, the author will describe this technique and how to implement it.

Round Table 1

Update on IG-XL™ Help John Buckley, Mike Gill, Teradyne

Round Table 2

DTV/HDTV Testing on the UltraFLEX™ — Q&A Fang Xu, Teradyne Q&A for Session 6/A

Round Table 3

OpenFLEX Round Table 4

TAG Table

Session 9: 10:30 – 12:00 Automotive SoC and IC Integration

Session 11: 3:00 – 5:00 Reducting Test Costs

Session 9/A: 10:30 – 11:00

Session 11/A: 3:00 – 3:30

Airbag Device Testing on the FLEX™

Reducing Wafer Testing Cost for the Automotive Market on the FLEX™

Jian-Wei Wang, Kenny Zhu, Teradyne

BREAKFAST: 7:30 – 8:30

Session 8: 9:00 – 10:00 Automotive SoC and IC Integration Session 8/A: 9:00 – 9:30

Challenges to Test an ADC in an Automotive Device

POWER MANAGEMENT/ AUTOMOTIVE

This presentation will describe how to combine linearity data generated by the FLEX™ BBACSrc instrument and zero/full error data generated by the FLEX DCSrc to calculate ADC Total Error. DSPWave will be used to store this information. ADC total error calculation formulas and methods to evaluate and modify arrays will also be presented. INL/DNL calculations using histogram method and best fit algorithms will be used.

Session 8/B: 9:30 – 10:00

An Easy Way for SPI Communication via DSSC Wei Chong Ng, Infineon Technologies; Nazlen Jabar, Teradyne In recent years, the predominance of serial protocol interface or SPI communication protocol has become evident. Many consumer and automotive ICs rely on SPI for basic communication. Eventually, this protocol will have to be used in test programs to configure the devices. To simplify SPI signal programming and improve debugging capability with Digital Signal Source and Capture (DSSC), the authors created an SPI library. This paper will describe this new test technique that shortens the test development phase dramatically.

BREAK: 10:00 – 10:30

Session 9/B: 11:00 – 11:30

Octal-Site Final Test Concept for Automotive Intelligent Distributed Control Products Johann Hilburger, Gerhard Knez, Olaf Neper, Freescale Semiconductor Intelligent Distributed Control (IDC) devices are gaining market share in automotive electronics applications such as window lift control and safety, mirror control, and headlight leveling. This paper will analyze test strategies and cost scenarios for automotive multi-chip System-in-Package (SiP) IDC products. It will describe a cost-optimized octal-site final test (FLEX™) and gravity handling (MT9928 Gravity Handler™) solution for high-volume devices that combine microprocessor and analog technology in a single package.

Session 9/C: 11:30 – 12:00

The Lowest Cost Method of IDDQ Testing on the J750 Satoshi Funakoshi, Teradyne In microcontroller device testing today, the IDDQ test and analysis is very important. However, it can increase test time significantly when it is measuring hundreds or thousands per test item. This presentation will introduce the fastest test method on IDDQ in J750 using DPS Mout pin and CTO capture pin.

LUNCH: 12:00 – 1:00

Session 10: 1:00 – 2:30 Power Management Session 10/A: 1:00 – 1:30

Modulation Input Applications Extend DCVI Applicability in POP Diego Koch, Alfredo.Stabile, Massimo Zambusi, Teradyne DCVI modulation input allows efficient tuning of DCVI voltage without requiring multiple patgen restarts and PSet adjustments. This feature helps to overcome the DCVI lock-while-patgen-running limitation and allows real time DUT-controlled biasing. The modulating source can be another voltage source or even a DUT pin. Test time and DIB complexity can be improved. In this paper, the authors will present actual applications for power management device testing.

Session 10/B: 1:30 – 2:00

Octal-Site High Power Class-D Amplifier Interface Board Design Mike Chu, Yan Jin, Haibo Zhang, Texas Instruments As the power of digital amplifier power stage devices increases, the range of PVDD, Over Current (OC) protection on chips also increases. In order to test these chips, instruments on the tester provide very high voltage (as high as to 60v) and high current (as high as 30A pulse). Because the device is switching at 400KHz PWM, the ground bounce on HIB is significant, especially during multisite parallel test. Without a good grounding scheme and control, crosstalk between sites can cause device reference changes, and may even cause device shutdown. The result will make tests fail which will cause yield loss. Texas Instruments has worked in this area for many years and is the leader in the high power Class-D power stage market. This presentation will review lessons learned from HIB design for high power class-D amplifiers. In addition, different ground schemes will be compared.

BREAK: 2:30 – 3:00

Jerome Mercier, Freescale Semiconductor; Francis Danel, Teradyne Increasing test parallelism is a proven, effective way to reduce the cost of test. Since probe index times are significantly less than on handlers, wafer testing is a very good candidate for high parallelism. Advanced FLEX DIB design techniques, such as DIB access and XOR, can also lower the hardware costs without impacting measurement accuracy. In addition, vertical probe technology offers significant advantages that improve the overall equipment efficiency, such as quick repair operations, low-cost maintenance, and small probe marks.

POWER MANAGEMENT/ AUTOMOTIVE

Hugo Molina, Texas Instruments

Cars today have more airbags which means more channels will be designed in the airbag device. In addition, many other functional blocks are combined with airbag channels which can complicate testing. The FLEX system provides rich instrument resources to implement tests for different function blocks such as a squib driver, squib diagnosis, and ASIC. This paper will introduce airbag device testing on the FLEX and will provide examples of typical tests and circuits.

Session 11/B: 3:30 – 4:00

Speed Up Test Program Execution for DC Instrumentation Giorgio Calia, STMicroelectronics; Nicolino Tassara, Teradyne DC instrumentation does not support background move (IIM). However, for some programs, data moved from DC instruments may be large enough to use a significant percentage of the total test execution time. In addition, the time it takes for data processing may be considerable and can be hidden during pattern execution. In this paper, the author will describe how to speed up test program execution by exploiting DC instrumentation architecture and multiple processing (Patgen and VBT). This technique allows faster background data movement, and data processing.

Session 11/C: 4:00 – 4:30

Help! Where Do I Start in Test Program Conversion? WL Chan, Dean Garrison, Teradyne Many users have converted test programs from their legacy test to the FLEX™, and then wonder why they don’t see much test time improvement. Many users, with little to no experience in test program conversion, tend to copy the legacy program lock, stock, and barrel. This copying leads to programs with little test time improvement for the same number of sites as run on the legacy tester. This paper will attempt to show some of the pitfalls the authors have observed in the conversions of a few legacy programs (Eagle) to the FLEX, i.e., Trim, TMU measurements, and DUT protection.

SURVIVOR PARTY: 5:30 – 7:00

Session 1/C: 11:30 – 12:00

Session 3/B: 3:30 – 4:00

Yield Monitor Tool for IG-XL™ Platforms

Automating Schematic Verification for Better Efficiency and Better Chance for First-Pass Success

Jimmy Chan, Yeng Chee Liew, Broadcom; Nagappan Nachiappan, Jeffrey Tan, Teradyne

BREAKFAST: 7:00 – 8:00 WELCOME: 8:15 – 8:45 KEYNOTE I: 8:45 – 9:30 KEYNOTE II: 9:30 – 10:15 BREAK: 10:15 – 10:30

This paper will introduce a yield monitor tool for IG-XL-based platforms. Currently, there is no tool integrated with IG-XL to perform detailed yield and test analyses during run-time. When developed, this tool will extract yield reports without ending the current test lot or closing the stdf. The user will be able to monitor the yield results (Bin, Sort, paretos) and detailed test analyses (Cpk, Cp, Mean, etc.) for various tests. Thus, when the operator alerts the engineers to a low yield setup in a production environment, the engineers will be able to analyze the lot results and narrow the problematic test in an efficient manner. The user need not touch the setup (loadboard, tester, handler) until a proper analysis is done. The majority of the yield monitor tool will be written in the Python® programming language. There will be minimal impact on test time as the process written in Python will run independently of IG-XL.

LUNCH: 12:00 – 1:00 Session 1 : 10:30-12:00 Data Analysis Session 1/A: 10:30 – 11:00

Use Scripting to Get the Most Out of Data Analysis The toolbox of our standard data analysis tool is extensive, but some problems can only be solved by using the flexibility of a script. Scripting can be used for rapid prototyping, that is, Does this solution work? And, this rapid prototyping using script could eventually evolve into a new standard feature for the tool.

Session 1/B: 11:00 - 11:30

Data Analysis in Real-time Mode Martijn van der Vlag, Salland Engineering The real-time module offers immediate access to the tester’s data through TCI daemons. There is no need to wait for the measurement data. In addition, real-time data sets can be exported to file (STDF, CSV). Real-time data sets do not differ from normal data sets except they receive data in real-time. Real-time data sets can be used in SEDana and will update new data automatically. The real-time module offers direct feedback on production and quality issues. It can also compare historical with real-time data and do site-to-site correlation.

Session 2/A: 1:00 – 1:30

Integrating the FLEX™ Test System into a Well-Established Test Floor Chad Bray, Trevor Dixon, Texas Instruments To be competitive in the semiconductor industry we must focus on reducing the time to market for new devices, which includes installing and validating new tester platforms. Before an installation, it is imperative to understand the testing environment. Integrating a test platform into a well-established test floor requires careful planning, coordination, and communication among various groups. This paper will describe lessons learned for release to production, growing pains, equipment correlation methodology, and how to reduce the number of installation steps.

Session 2/B: 1:30 – 2:00

Planning and Logistics: Converting a Complex SoC Catalyst™ to FLEX™ in Asia without Leaving Europe John Tatchell, CSR; Ian Beck, Teradyne Converting any test application from one platform to another is difficult and even more so when the application is a complex RF SoC. To further complicate the conversion, add a fabless customer. In this particular case, when a conversion is for a fabless customer, the development is done in Europe and the production in Asia. Now link multiple test system acceptances and add a tight deadline. High pressure on the development team? Absolutely! This paper will describe how the authors planned, implemented, monitored, met their goals, and kept costs under control … and what they learned from the project.

Session 2/C: 2:00 – 2:30

Working with OpenFLEX™ — A Customer’s Experience of Developing Test Solutions through Teradyne’s OpenFLEX Office Omar Biabani, Sten Peeters, Teradyne This paper will describe to potential customers how easy, rapid, and practical it is to integrate their niche requirements into FLEX™ architecture through the OpenFLEX initiative. This paper will explain, from a customer’s point of view, the overall process to develop customized instrumentation that leverages the strengths of FLEX architecture. The audience will learn about various product development phases as experienced by a customer. A customer will share his success story by elaborating on the following topics: 1. Building a relationship with the OpenFLEX office 2. Training, support, and services provided by the OpenFLEX team 3. Roles and responsibilities for each party 4. Best practices in product development 5. Best practices in project execution

Verifying and error checking loadboard schematics can now be performed in less than one hour. This reduction in time is the result of a major software tool advancement developed by Freescale engineers. Designed specifically to check FLEX™ loadboards and Probe to PIB boards, the new tool automates most of the schematic verification and helps eliminate errors that are easily overlooked. It takes in exported net lists and sheet/part parameters and outputs any potential issues and maps from the DUT to the tester resource for easy verification.

Session 3/C: 4:00 – 4:30

Self-Documenting PIB Diagnostics Chad Bray, Trevor Dixon, Texas Instruments The manufacturing world is constantly searching for process tools and techniques to increase productivity. As a result, the time metric for processing has increased from six-minute intervals (1/10 hour) to one-second intervals. This paradigm shift from the standard Availability metric to an Overall Equipment Utilization metric has increased the tracking resolution by a factor of 360. Now, where seconds really do count, subsystems must be developed to reduce all aspects of test throughput. This paper will describe a method to reduce troubleshooting downtime through the use of self-documenting diagnostic datalogs.

PRODUCTION INTEGRATION AND HW/SW INTERFACE

Antoine Megens, Salland Engineering

Session 2: 1:00 – 2:30 Tester Integration A

David Baird, Freescale Semiconductor

6. Value of product certification 7. Teradyne/Customer IP concealment

BREAK: 2:30 – 3:00

Session 3/D: 4:30 – 5:00

A Chip that Avoids Mechanical Relays on a DIB Giuseppe Amelio, Francesco Cantini, Moreno Lupi, Francesco Picchi, Microtest

Session 3: 3:00 – 5:00 DIB Design Verification Session 3/A: 3:00 – 3:30

DIB Design Sanity Check Using Circuit Simulation Software

In this paper, the authors will describe the chip they developed that avoids the use of mechanical relays and improves DIB reliability dramatically. The chip was designed to perform best on a DIB; it increases density and decreases the number of utility bits used.

TERADYNE PARTY: 6:00 – 9:00

Ambika Krishnamoorthy, Swetha Thiagarajan, Intel; Tom Chambers, Chris Paull, Teradyne This paper will review a method for using circuit simulation software to verify DIB design. The authors were presented with a situation in which both DC and AC measurements had to be made on a DUT output. This situation required trade offs in the DIB design to handle both the current requirements for the DC measurements and the frequency requirements for the AC measurements. To validate their choices, the authors used circuit simulation software to show how the DUT response would be seen at the tester hardware. In this paper, the authors will review their creation of the circuit and the results that demonstrated they had accurately designed the DUT.

Session 6/C: 2:00 – 2:30

Session 5: 10:30 – 12:00 Collaboration and Revision Control

Enabling Customers to Develop Tailored Instruments for the FLEX™ Architecture through OpenFLEX™

Session 5/A: 10:30 – 11:00

Omar Biabani, Lee Holt, Robert Manlick, Teradyne

Test Program Guidelines for Collaborative Development BREAKFAST: 7:30 – 8:30

Session 4: 9:00 – 10:00 Collaboration Session 4/A: 9:00 – 9:30

PI Version Selector Mike Knapp, Analog Devices; Laurent Bonneval, Teradyne Managing custom software can become cumbersome, especially for user interfaces and various drivers which are IG-XL™ dependent. ADI needed a fast way of switching their custom software from one version to another using different IG-XL versions along with setting default configurations for production testing. These issues can be resolved by the PI Version Selector tool, previously developed for Analog Devices. In this presentation, the authors will describe the challenges they faced when delivering the tool to ADI and the solution chosen to manage ADI's custom software.

How to Write and Use Simple DLLs to Accelerate Code Execution Emanuele Vazzoler, STMicroelectronics, Alfredo Stabile, Teradyne This paper will illustrate an easy way to write DLLs using VB or VC++ and how to call them from IG-XL™. While VB code is interpreted, DLLs are compiled which allow code to be executed at a significant increase in speed. In addition, DLLs are well suited to execute code when heavy calculations need to be performed (especially when a DSP is not available, i.e., J750™), or when dealing with complex string manipulations. A method to register an ActiveX DLL by a non-administrator user is also described. This method will be useful in production environments where users are normally given restricted rights.

BREAK: 10:00 – 10:30

This paper will describe the software guidelines and coding strategy used by a multi-member two-continent development team to implement a package test program on a complex cell phone power-management device. A description of some of the problems experienced on previous generations of devices will be included as well as a description of the efforts to eliminate these issues for this project. The software guidelines and coding standards will be presented, including the reasoning for each, and a final assessment of the strategy's successes and failures. In addition, an overview of the revision control strategy and the successes and failures of the revision control system during program development will be covered.

Session 5/B: 11:00 – 11:30

Subprogram Modularity: Improving Test Program Development Productivity and Reusability Kevin Bushe, Teradyne Subprogram modularity can make development and collaboration for an IG-XL™ test program easier for today’s System on Chip (SoC) designs. Using an Add-In built by Applications and Software engineers at Teradyne, a development team can modularize its IG-XL test program based on individual IP blocks that make up the larger SoC. Test engineers now can work on a single IP block of the chip and, once completed, the Add-In can be used to 'merge' the smaller block into the SoC's master test program. With this method, test program development time will decrease. Common or next generation devices that have similar IP blocks will be able to take the modular IG-XL test and incorporate it into the new device much more easily, which will maximize test program reuse.

Session 5/C: 11:30 – 12:00

LUNCH: 12:00 – 1:00

Session 6: 1:00 – 2:30 Tester Integration B Session 6/A: 1:00 – 1:30

Mixed-Signal Simulation for Test Program Development

BREAK: 2:30 – 3:00

Philippe Raynaud, Mentor Graphics ; Philippe Planelle, STMicroelectronics Mentor Graphics and STMicroelectronics are collaborating to develop the capability to simulate test sequences for Analog and Mixed-Signal devices and then to transfer the simulation stimuli and results into IG-XL™ for the Teradyne FLEX™ tester. During the presentation, the problem statement will be described and the implemented flow will be reviewed. A more detailed description of the AMS simulations, the STIL-AMS language initiative, as well as the roadmap will be discussed. Following the presentation, a real-life example will be demonstrated, including some of the debug steps that were carried out.

Session 7: 3:00 – 7:00 Engineering Update, Round Table/Poster Sessions & Vendor Fair Session 7/A: 3:00 – 3:15

Semiconductor Business Meeting Session 7/B: 3:15 – 4:00

PRODUCTION INTEGRATION AND HW/SW INTERFACE

Session 4/B: 9:30 – 10:00

Jeff Cramer, Jonathan Kubala, Tom Vance, Teradyne

This paper will inform the audience about various tools and services that the OpenFLEX team has developed to enable customers to integrate their customized instruments into FLEX systems rapidly. The authors will introduce a set of enablers they have used successfully in the past and a few that are planned for 2007. Customers who have the expertise to develop specialized instrumentation to test specific devices will be excited about these enablers. This paper will provide in-depth coverage of the technical aspects of these enablers, such as the controlling hardware, software language, and the user model. (Also a poster session)

Semiconductor Engineering Update

Session 6/B: 1:30 – 2:00

Session 7/B: 4:00 – 4:45

Integrating the GSI Group WaferTrim™ M310 with the microFLEX™

Semiconductor Open Forum Discussion

John Grandbois, Analog Devices; Peter Turner, Teradyne

VENDOR FAIR: 4:00 – 7:00

This presentation will summarize the integration of the M310 Active IC Trim System with the microFLEX. To control the laser, a custom circuit to use tester resources and the SW drivers will be described. In addition, the authors will present the first application of this technique on the ADXL330 from Analog Devices.

Smarter ASCII Export for Dumber CM Tools: Using Interpose Functions with ASCII_Utils.xla Glenn Carson, Freescale Semiconductor The ASCII_Utils.xla add-in provides an excellent framework to support CM activities and modular program development. It provides an ASCII sheet export function that supports CM for the modular pieces of an IG-XL™ test program. Unfortunately, many CM tools use time and date stamps to detect file changes; and the ASCII_Utils.xla always exports all files, even the files that have not been modified. This paper will present a solution that uses interpose functions available in ASCII_Utils.xla to export only changed files into the CM working directory.

Poster 3

BREAK: 10:00 – 10:30

Securing Test Systems in the Production Environment Bob Mastrogiacomo, Jaci Wilson, Teradyne

Poster Presentations/ Roundtable Sessions: 4:45 – 7:00 Poster 1

VOM (Voice of Mine) — Closing the Loop Swagata Chakrabarti, Peter Chuang, Teradyne

Poster 2

Integration of Full Dynamic Test-Cell Controller with IG-XL™ Rob Marcelis, Salland Engineering The author will demonstrate the capabilities of the Dynamic Testcell Controller, including a lot-start event which loads the test program on the tester and set-up on the prober automatically. During production run, real-time parametric data are received and being used to monitor the CPk and parametric trends for some selected tests. Actions will be taken dynamically. At the end of the run a PAT algorithm is executed in combination with “clusterdetection.” STDF is generated automatically. Equipment status and results are automatically transferred to the appropriate locations. This demonstration will show the “ultimate test-cell” automation.

BREAKFAST: 7:30 – 8:30

Enabling Customers to Develop Tailored Instruments for the FLEX™ Architecture through OpenFLEX™ (Also a paper- Session 6/C) Omar Biabani, Lee Holt, Robert Manlick, Teradyne This paper will inform the audience about various tools and services that the OpenFLEX team has developed to enable customers to integrate their customized instruments into FLEX systems rapidly. The authors will introduce a set of enablers they have used successfully in the past and a few that are planned for 2007. Customers who have the expertise to develop specialized instrumentation to test specific devices will be excited about these enablers. This paper will provide in-depth coverage of the technical aspects of these enablers, such as the controlling hardware, software language, and the user model.

Round Table 1

Update on IG-XL™ Help John Buckley, Mike Gill, Teradyne

Round Table 2

DTV/HDTV Testing on the UltraFLEX™ — Q&A Fang Xu, Teradyne

Round Table 3

OpenFLEX Round Table 4

TAG Table

Session 9/A: 10:30 – 11:00

A Useful VBT Programming Tool Integrated in IG-XL™ Session 8: 9:00 – 10:00 Calibration Session 8/A: 9:00 – 9:30

Calibration of SE-HDACTO Pushes the DC Calibration Unit to its Limits DirkJan Stuij, Salland Engineering

Poster 4

Q&A for Session 6/A

Session 4: 9:00 – 10:00 Collaboration

The SE-HDACTO pushes the limits of the DC-calibration unit, bringing the DC accuracy to the next level for synthesizer/digitizer instruments on the FLEX™. The DC calibration for the SE-HDACTO must be close to the accuracy of the DC calibration unit of the FLEX. This presentation will describe the techniques used to calibrate both the source and capture channels of the SE-HDACTO with the DC-calibration unit and will verify that the calibration meets specifications.

Session 8/B: 9:30 – 10:00

Effective Spot Calibration of the DC30 Source and Meter Using PSets Michael Shilhanek, Texas Instruments; Zayd Hammoudeh, Nathaniel Jansak-Noble, Teradyne The DC30 is a medium-performance, high-density VI. For some current generation devices, it is critical to force and measure voltages from a DC30 channel with high precision, pushing the capabilities of the instrument. Therefore, a high-precision spot calibration (SpotCal) which couples the DC30 with a high-precision meter such as the Precision Metering Option (PMO) is becoming more commonplace. Because of the increase in the use of high-end spot calibration, there is a need for a new SpotCal tool set that supplies comprehensive tester coverage, ease of use, and a standard for incorporating these SpotCal techniques into test programs. This paper will provide a DC30 source and meter SpotCal architecture for the FLEX™ and microFLEX™ that is fully site-aware and implemented to reduce run-time overhead. It achieves this reduction by storing all calibration information in a data structure capable of low access times, even lower than a standard array. Moreover, it has been designed using the PSet paradigm, which allows for reduced setup time when changing an instrument’s state as well as use in patterns. In addition, the architecture can detect when an autocalibration has occurred on a specific channel and recalibrate only that channel, further reducing overhead.

Hao Chang, Teradyne Today’s complex DUTs often have complex VBT programs, the preferred mixed-signal test programming language on the IG-XL platform. Writing and maintaining these complex programs is always tedious and difficult. This paper will introduce a tool that shows the VBT programming structure in Microsoft TreeView. This tool shows how the nodes correspond to every sub-structure in the program, such as a function, a “for loop,” and so on. It can accelerate program development and facilitate program maintenance and be integrated seamlessly into VBA IDE as an add-in program. The author will also describe how to customize VBA IDE with add-in.

Session 9/B: 11:00 – 11:30

Buttons to Generate VBT Bin Chiu, Teradyne This paper will provide a fast and friendly GUI to generate VBT. The GUI is embedded in the right-click menu. Users can select the relevant GUI and easily modify some parameters. The code will be generated automatically into the VBT. This tool will make program development faster and easier to construct. The developer will be able to click just a couple of buttons to generate VBT code.

PRODUCTION INTEGRATION AND HW/SW INTERFACE

Gathering requirements that define and describe the function for its software from the user’s point of view is one of Teradyne’s continuous improvement methods. This helps Teradyne build and deliver software that meets customers’ needs and expectations and closes the loop between the users in the field and the designers in the factory. In this paper, the basic concept and key elements of the requirements process and documentation will be introduced. How to read the requirements document from the user’s point of view and how to validate and examine the completeness and correctness of the requirements will be explained. In addition, this paper will describe and show examples of how to create requirements to facilitate communication with design engineers.

During the past 15 years, PCs have become a common household item. While many still do not own PCs, many more not only own but think they know how to manage and customize the settings for their local machines. This sense of mastery can lead to and causes many PCs to become infected with viruses, Trojans, and malicious software. An infected PC may result in slower performance and/or the loss of important data. While Teradyne recommends the use of an anti-virus software, it cannot control the security of your test system. Security needs to be addressed by the owner and System Manager for each device. This paper will review several methods to limit access for the user/operator of a test system, such as disabling web surfing, downloading programs, and changing backgrounds.

Session 9/C: 11:30 – 12:00

Automated Optimization and Cleanup of VBA-based Test Programs Hubert Schafzahl, Infineon Technologies During test program development, various elements of the test program (pattern, instances, VBA code) typically will accumulate and remain part of the test program even if they are no longer needed in the final test program. This paper will demonstrate a method to identify and remove unused elements of the test program automatically. It will also show how the method can be used to document test flow, test pattern, test instances and, most importantly, the code execution flow. Based on this information, the VBA code can be optimized for both size and speed, thus reducing complexity and increasing efficiency.

Session 10/C: 2:00 – 2:30

Session 11/D: 4:30 – 5:00

A Software Technique for Checking Data Integrity in Fuses

Simultaneous Device Testing at Multiple Handlers with Single FLEX™ and Cable Docking

Steve Sheck, Freescale Semiconductor

LUNCH: 12:00 – 1:00

Session 10: 1:00 – 2:30 General Programming Session 10/A: 1:00 – 1:30

Automated Voltage and Temperature Characterization Utility for IG-XL™ Tarang Dadia, Qualcomm; Daniel Buker, Teradyne

PRODUCTION INTEGRATION AND HW/SW INTERFACE

Session 10/B: 1:30 – 2:00

Introducing Power Supply Status Variables – A Simple and Efficient Way to Organize and Document Test Functions Yaw-Hua Hong, Weishu Wu, Texas Instruments Proper organization and documentation of test programs are especially important when used globally by various groups. It is often desired to have modular test functions which allow an engineer to insert a new test function or disable an existing one without affecting other functions. Modular test functions can be achieved by restoring the test program to a default state after each test, e.g., power-down state. Because modern IC chips offer more features and multiple resources are often used for power pins, modular test functions come at the expense of longer test times. Power supply status variables will provide a simple yet efficient way to organize test functions without sacrificing test time.

BREAK: 2:30 – 3:00

Session 11: 3:00 – 5:00 Handler n'All

Armin Winkler, Infineon Technologies; Ramanamurthy Pakki, Teradyne

Session 11/B: 3:30 – 4:00

Using 32x Parallel Test with ViProbe for Test Time and Test Cost Reduction on Low Cost Devices Andreas Berdzentis, Texas Instruments; Andre Vogel, Teradyne To improve test time and the cost of test, a simple switch was converted from a legacy single site tester to 32x FLEX™ using ViProbe from Feinmetall. With the implementation of this test, the authors realized two major advantages, i.e., calibration units on the FLEX are not needed and the production process is more robust when cantilever probe cards are replaced. The first program was released to production and is running well. The original FLEX program was modified to test three similar devices. All four test programs are now running in high volume.

The intricacies involved in testing multiple handlers with different ambient settings simultaneously using one test program and one tester are discussed in this paper. The signals from the DIB are brought to the handlers by Cable Docking. A lead frame transfers the devices through three handlers with different ambient conditions. The devices are tested and the data collected at each handler for its specific condition. When finished, the data are processed accordingly. The bin, data, site, fail and alarm handling are meticulously managed in the test program.

SURVIVOR PARTY: 5:30 – 7:00

Session 11/A: 3:00 – 3:30

Reduce, Reuse, and Recycle: On-the-Fly DC Measurements Without a New Instrument Jim Crafts, Amit Shah, IBM The objective of the authors was to perform a DC measurement concurrent with a pattern burst. Previously, the DC measurement was taken before and after a pattern burst with the Per-PinParametric-Unit (PPMU). A spare HexVS instrument on the existing tool configuration was leveraged to perform the measurement. To increase accuracy of voltage measurements, external circuitry was used to amplify the voltage readings by the HexVS. This paper will describe the methods and results.

Session 11/C: 4:00 – 4:30

Practical Hardware and Software Considerations for High-Parallel Mixed-Signal Testing with the J750™ Michael Jonas, Texas Instruments

PRODUCTION INTEGRATION AND HW/SW INTERFACE

This paper will describe a method to run an entire IG-XL test program over multiple voltage and temperature combinations automatically. When this method is used, instead of changing jobs or modifying a Spec sheet, which requires revalidation, the temperature and voltage conditions are defined with a text file or lines in the Flow sheet. The voltage/temperature characterization sequence is started either from the toolbar or from an ALT+ key combination. In addition, VBT programming examples will be presented.

Programmable fuses play a critical role in the operation of many of today’s semiconductor devices. Their primary use is in the implementation of redundancy for bulk memory, caches, and embedded memory. In addition, circuit tuning and the storing of parametric data, chip identification, and encryption keys are other common uses. Regardless of end use, it is critical that the data stored in fuses remains constant throughout the life of the device. This paper will present a technique for authenticating the data stored in fuses, and will discuss methods of analysis when stored data fails to authenticate.

With the increase in the importance for reducing test cost, more simultaneous DUT testing is required. Mixed-signal testing, in particular, requires different hardware resources such as digital channels, CTO, MTO, and MSO. Depending on the tester configuration and the device specific function, one or more instrument resources may not be sufficient. To parallel test 16- to 32-sites, there are several constraints to consider. On the hardware side, one solution is to share tester resources like digital channels, utility bits, or MSO resources. Another approach is to reduce resources applied to the DUT to the absolute minimum to execute the test. Combining these two methods allows going beyond the typical parallel site count in mixed-signal testing. Sharing resources also creates more effort on the software side, e.g., measurements must be taken for each site individually by using site loops and data arrays. The paper will describe the challenge to reduce test cost by increasing parallel testing up to 32-sites, and will give examples and solutions to deal with limited tester resources like high-voltage channels, utility bits, CTO, MTO, and MSO. In addition, some software examples will be presented.

By understanding the basics of inductance and using 3D electromagnetic simulation, engineers are able to characterize the inductance through a given contactor more accurately. As the challenge to meet the electrical requirements continues to increase, understanding the concepts described in this presentation will allow for continued improvement in contactor design.

Session 1/B: 11:00 - 11:30

Improving the Level Accuracy of Gen4 MW Hardware David DiBona, Teradyne

KEYNOTE I: 8:45 – 9:30

Hardware, Software and Applications engineering are participating in a joint development project to make significant improvements in the source and receive level accuracy of the Gen4 MW hardware. When a frequency and power-specific calibration table in a job is followed by the Gen4-focused calibration program, an improvement in level accuracy is achieved. The focused calibration program is run from a newly developed option within the Maintenance User Interface software. In this paper, the author will describe how this improvement is achieved.

KEYNOTE II: 9:30 – 10:15

Session 1/C: 11:30 – 12:00

BREAK: 10:15 – 10:30

The Implementation of GSM/EDGE Source and Receive Library in IG-XL™

BREAKFAST: 7:00 – 8:00 WELCOME: 8:15 – 8:45

Session 1 : 10:30-12:00 Instrumentation Session 1/A: 10:30 – 11:00

Introducing the Port Expander Instrument Glenn Burnham, Teradyne

RF WIRELESS 42

GSM/EDGE signals are defined in 3GPP specs which are normally generated and analyzed by bench instruments. ATE vendors correlate the results and move them to production. The GSM/EDGE Source and Receive Library enables users to generate GSM/EDGE source segments and test Error Vector Magnitude (EVM) and Output RF Spectrum (ORFS) in IG-XL easily and quickly. The correlation between the bench instrument and FLEX™ GSM Modulation Library Rev.1 functions is good and stable. In Rev.2, the Graphic User Interface for the source side and GSM Phase Error test will be added to make it more user friendly and useful. In addition, BER test for different channel types and how to use different channel decoder mode and puncture mode and so on will be described.

LUNCH: 12:00 – 1:00

Session 2: 1:00 – 2:30 Code Examples Session 2/A: 1:00 – 1:30

Migrating a Final Test RF SoC from Single-Site Catalyst to Quad-Site FLEX™ Kim Gundersen, AMI Semiconductor A summary of strengths and challenges encountered in developing an RF SoC final test program on a single-site Catalyst, then later for a quad-site FLEX, is presented. Topics include test program, RF source and measurement accuracy, DIB hardware, test time, and correlation comparisons. The intended audience includes those interested in mixed-signal and RF SoC Catalyst to FLEX test program conversion.

Session 3/B: 3:30 – 4:00

On-the-Fly Statistics with IG-XL™

RF Connectors and Material: A Performance Comparison

Jos Driessen, NXP Semiconductors SiPs (multiple dies and SMDs) show a relatively high biasing for test parameter distributions from lot to lot. To improve test coverage (outlier screening) and yield when testing a batch, dynamic (control) limits are very helpful. With IG-XL/VBA, it is possible to create a generic approach to track the statistics per test parameter (standard-deviation, mean, median) and, therefore, controllimits. In addition, when carrying out iterative settings, the ‘mean’ can be used as a starting point which improves test time. This paper will describe the IG-XL template used in this approach.

BREAK: 2:30 – 3:00

Martin Dresler, Wolfgang Steger, Teradyne With the increasing speed of digital and RF devices it is important to understand the influence of different DIB materials and RF connectors. Poor signal performance can make a high-speed DIB useless. This paper will provide theoretical and practical insights for the critical performance parameters and how they can be estimated. Finally, the performance of different types of DIB materials and RF connectors will be compared and recommendations for RF DIB design will be included.

Session 3/C: 4:00 – 4:30

Design Example for a Generic RF DIB and Custom Daughter Board Session 3: 3:00 – 5:00 Board/Material Considerations Session 3/A: 3:00 – 3:30

Defining Inductance in Contactors Ryan Satrom, Everett Charles Technologies Inductance is a critical parameter in determining the electrical performance of a contactor. Unfortunately, this value is rarely interpreted properly. Inductance specifications are typically determined in a Ground-Signal-Ground configuration. This value is beneficial as a relative comparison between contactor technologies, but can be very misleading when trying to model the inductance through a contactor. This presentation will give a basic overview of inductance and a description of the relationship between inductance and electromagnetic wave theory. This theory states that the inductance through a contactor is not defined by a single probe but, rather, is determined by the configuration of each individual signal/powerto-ground loop. Without this background, it is extremely difficult to model the inductance through a contactor accurately. A common method to represent the inductance through a contactor which models each probe as an inductor will be explored. By understanding electromagnetic wave theory, this method will be shown to provide inaccurate results. A more accurate technique will be presented. Inductance is directly related to the number of magnetic field lines surrounding a conductor. Only through the use of 3D electromagnetic simulation can this value be captured accurately.

KN Chui, Corad Technology; Charles Kao, Teradyne This paper will describe a generic RF DIB example with microwave Gen4 for the FLEX™ which will speed up the performance verification and test program development for modern RF SoC transceivers. Topics covered in the presentation include flexible tester configuration, low PN clocks, and programmable dampers. In addition, samples of daughter board custom features for production release will be demonstrated.

Session 3/D: 4:30 – 5:00

RF Debugging Techniques for Volume Production Peter Higgins, Teradyne The transition from semiconductor RF test development for sample quantities on one tester to high-yield volume production on many testers is major. This paper will describe some techniques for successful volume production and some hints for debugging standard RF tests. The methods are generic; they can apply to many RF devices and testers. The reasons for repeated RF calibrations, techniques, and test floor conditions will be explained, together with the reasons why RF is “special” and why RF volume production ramp is not to be taken lightly.

RF WIRELESS

RF switches are often added to DIBs to increase RF port count beyond the eleven available with Gen4. Splitters are also used to provide simultaneous signals to multiple sites, especially receivers which can be tested in parallel. Unfortunately, splitters and switches add complexity, cost, and additional risk to a DIB in production. Since Gen4 calibration does not include these components, the burden is on the test engineer to characterize the DIB to adjust Gen4 accordingly. Splitters have the additional problem of allowing a grossly failing site to affect the results of other sites. The port expander was designed to allow users to remove most, if not all, switches and splitters from DIBs. Additionally, an integrated Rhode & Swartz power sensor is used to execute a run-time focused calibration of all signal paths. These calibration factors can be easily retrieved and applied to Gen4 for source and receive. A single port expander essentially expands three Gen4 ports to twelve bi-directional Port Expander ports. This paper will present the Port Expander instrument with block diagrams and example Visual Basic language that is completely integrated into IG-XL™. Some example devices will be used to show interconnection from Gen4 through the port expander to the DUT.

Ronald Burke, Helen Chen, Peter Chen, Greg Dionne, Shu Xia, Zhe (Sophie) Xu, Teradyne

Session 2/B: 1:30 – 2:00

TERADYNE PARTY: 6:00 – 9:00

BREAK: 10:00 – 10:30

BREAK: 2:30 – 3:00

Session 5: 10:30 – 12:00 Tutorials BREAKFAST: 7:30 – 8:30

Session 4: 9:00 – 10:00 Miscellaneous Session 4/A: 9:00 – 9:30

Characterization/HVM Comprehensive Test Solution for 10G/3G Transceiver Utilizing the Teradyne Tiger Platform and SDM 10G Module

Session 5/A: 10:30 – 11:30

Tutorial — Forward Error Correction in Wireless Communication Standards Steven Fields, Teradyne This paper will describe Forward Error Correction (FEC) and how it is used to recover dropouts/burst errors. The general concept and a high-level description of need for FEC will be discussed. Following this overview, the author will focus on the convolutional encoder/puncturing on the source side physical layer and the Viterbi decoder on the receive side of the physical layer and how these play an important role in FEC.

Fayez Sedarous, Intel This paper explores the implementation of Intel’s latest HVM fully comprehensive test solution to test Optical Devices (10 Ethernet, 10G Fiber Channel and Sonnet OC-192) utilizing the Teradyne Tiger Tester Platform. It deals with the pros and cons and many of the lessons, experiences, and knowledge acquired when dealing with high-speed mixed-signal testing. It explores the test development codes and hardware implementation techniques using the Seahorse2, a 10G transceiver, as a test case example. The Seahorse2 test program is fully implemented and the device has been released to production.

Session 5/B: 11:30 – 12:00

Tutorial — GSM/EDGE EVM Test Ching-Chia Tien, Teradyne Unlike WLAN in which constellations are fixed at ideal IQ frame, GSM/EDGE's constellation can become corrupted. The inter-symbol interference cannot be recovered easily because a 90kHz window raised cosine filter is used in EVM test where the pass band is well below the 200kHz channel bandwidth. A reference frame will be generated for comparing the actual data points for EVM calculation. This reference frame is data dependent and should be generated for each unique baseband data stream.

LUNCH: 12:00 – 1:00

Session 7/A: 3:00 – 3:15

Semiconductor Business Meeting Session 6: 1:00 – 2:30 Tutorial Session 6/A: 1:00 – 2:30

Tutorial — DTV/HDTV Testing on UltraFLEX™ Fang Xu, Teradyne After a brief introduction of standards worldwide, this tutorial will describe various DTV/HDTV signal modulation schemes such as VSB8 and OFDM, followed by an introduction of DTV/HDTV related signals and a block diagram of a typical DTV System-on-Chip as well as its test list. Some DTV specific functions and their test requirements are analyzed in detail. These functions include converters, PLL, and HDMI as well as related instruments on the UltraFLEX platform and their application. Performance for DTV/HDTV test will also be demonstrated. In addition, a typical tester configuration on the UltraFLEX will be covered. This tutorial was first presented in Asia to more than 150 customers.

Session 7/B: 3:15 – 4:00

Semiconductor Engineering Update Session 7/B: 4:00 – 4:45

Semiconductor Open Forum Discussion VENDOR FAIR: 4:00 – 7:00

Poster Presentations/ Roundtable Sessions: 4:45 – 7:00 Round Table 1

Update on IG-XL™ Help John Buckley, Mike Gill, Teradyne

Round Table 2

DTV/HDTV Testing on the UltraFLEX™ — Q&A Fang Xu, Teradyne

Interpolation Cookbook: Algorithms, Performance, and Guidelines

Q&A for Session 6/A

Aimen Oueslati, NXP Semiconductors; Martin Dresler, Teradyne

Round Table 3

Interpolation algorithms can play an important role for a wide range of ATE test challenges to reduce test time or to improve measurement resolution. These challenges include mixed-signal applications with filter characterization, RF with 1dB compression point measurement, and digital with edge search. Mathematical theory provides many different algorithms, such as compensation analysis and polynomial or spline interpolation, which makes it difficult for test engineers to select the one most appropriate. This paper will describe the most common algorithms in terms of functionality, accuracy, and calculation time. The authors will share the code used for the algorithms and will compare the results of a 3dB point filter characterization.

OpenFLEX Round Table 4

TAG Table

RF WIRELESS

Session 4/B: 9:30 – 10:00

Session 7: 3:00 – 7:00 Engineering Update, Round Table/Poster Sessions & Vendor Fair

Session 10/C: 2:00 – 2:30

BREAK: 10:00 – 10:30

RF Modulation/Demodulation for Dummies M.Ramasamy, Gopalakrishnan Srinivasan, Teradyne/HCL Technologies

Session 9: 10:30 – 12:00 Test Techniques BREAKFAST: 7:30 – 8:30

Session 8: 9:00 – 10:00 Test Time Reduction Session 8/A: 9:00 – 9:30

Test Time: A License for an RF Test Engineer! Philippe Soleil, NXP Semiconductors My name is Philippe, Philippe SOLEIL. My mission: Kill the test time! This paper will describe a test strategy defined on an RF transceiver that, when followed, will drastically reduce test time and meet the profitability target. Different ways to improve test time will be presented such as a new test method (Xo steps), group of measurements, multi-tone, tips and tricks for IG-XL™ and FLEX™, correlation and redundancy between tested parameters, and System test versus Parametric Test. This paper will provide a complete package for the future test engineer to obtain his license to test.

Session 8/B: 9:30 – 10:00

Test Time Reduction and Strategy on a Multi—Chip Device Mike Bellanger, Salvatore Cutrupia, NXP Semiconductors

RF WIRELESS 46

Generating ASK Modulation Signals for Contactless Chip Card Controllers on the J750™ Hubert Schafzahl, Johannes Schorrer, Infineon Technologies Historically, the contactless functionality of chip card controllers was tested by applying ASK modulated signals with varying modulation depths. In general, these signals were generated by external circuitry controlled by the tester. This paper will describe a method that does not require additional external elements; the modulation signal will be generated by the tester. The signal is achieved with special test pattern and timing sets, and by controlling pin levels dynamically according to modulation depth. When this new method is applied, overall test cost can be significantly reduced with equal or increased test quality.

Session 9/B: 11:00 – 11:30

Low-cost Alternate EVM Test for Wireless Transmitter Systems Philippe Brousse, NXP Semiconductors The EVM is a fundamental parameter used in EDGE and WCDMA to characterize modulation accuracy under real-life conditions. The next generation RF transmitters require EVM test for each band and each mode. However, due to the complexity of this measurement, the test times for EVM are very long. This paper will present a study to calculate the EVM TX with major contributors like Phase noise, LO rejection, Image rejection, and some other tricks for the real measurements.

Session 9/C: 11:30 – 12:00

RF Test Code Templates for WCDMA+GSM Transceiver on Generic RF DIB Albert Jen, Charles Kao, Luis Tang, Teradyne In this paper, the authors will describe a set of IG-XL™ test code templates developed with WCDMA+GSM. These templates are based on a generic RF DIB developed for Teradyne FLEX™ RF testers. The generic RF contains three types of code (basic, advanced, and utility) to reduce RF test program development time and effort. The authors will show how these templates will shorten the engineering time to production on the Evaluation Board (EVB) and how the EVB can be a production board for customers.

LUNCH: 12:00 – 1:00

Session 10: 1:00 – 2:30 Test Techniques Session 10/A: 1:00 – 1:30

Developing the Spectrum Mask / Adjacent Channel Power Test on the FLEX

BREAK: 2:30 – 3:00 SURVIVOR PARTY: 5:30 – 7:00

HongBin Tong, NXP Semiconductors; Ching-Chia Tien, Teradyne The spectrum of an RF transmitter must not exceed its allocated bandwidth. Otherwise, the power spill over could corrupt the neighboring channels. The tradeoff between the test time and the measurement accuracy of the following three algorithms will be discussed. 1. Multiple captures using Gen IV RF instrument 2. One capture for symmetrical side bands and two for asymmetrical side bands 3. Two captures using an external mixer

Session 10/B: 1:30 – 2:00

Accurate GSM Phase Error and EVM Measurements on the FLEX™ Helen Chen, Greg Dionne, Shu Xia, Zhe (Sophie) Xu, Teradyne Phase error and Error Vector Magnitude (EVM) tests are commonly used to provide a figure-of-merit for the overall modulation accuracy of the Global System for Mobile Communications (GSM) systems. There is a trend for accurate, fast, yet easy to implement GSM modulation accuracy measurements in final production test on ATE platforms. This paper will describe some key techniques used inside the library that facilitate accurate and easy-to-use testing on the FLEX. Test programs using these techniques show good correlation with bench equipment when testing a real GSM transceiver device.

RF WIRELESS

In this paper, the authors will describe a fully-integrated solution for the wireless market. The solution is composed of two different dies in the same package. They are: 1) an analog and RF unit (RFAPU) integrating a power amplifier able to deliver 27dBm, a DECT transceiver and an analog process unit (two codec, ADC, one hands free and one a power management unit); and 2) a baseband processor (DPU) based on ARM9 technology. The FLEX™ platform was chosen for the solution because of its RF, analog, and digital capability. This presentation will focus on the RFAPU die. It will describe the test strategy, DFT integrated to make some blocks testable, and tips and tricks to reduce test time.

Session 9/A: 10:30 – 11:00

For the beginner, any bookish material written so far on these two topics has always been a nightmare to grasp and retain. This tutorial may help to alleviate the problems of an RF novice. The various types of analog and digital modulation and an overview of constellation diagrams will be presented. In addition, the authors will describe how to make modulation measurements using the tester.

Session 1/B: 11:00 - 11:30

Cost Benefit Analysis for Using ATLAS Jim Danscuk, U.S. Air Force

BREAKFAST: 7:00 – 8:00 WELCOME: 8:15 – 8:45 KEYNOTE I: 8:45 – 9:30 KEYNOTE II: 9:30 – 10:15 BREAK: 10:15 – 10:30

Session 1 : 10:30-12:00 Test Development Session 1/A: 10:30 – 11:00

Using Interchangeable Virtual Instrument (IVI) to Increase Test Development Efficiency Sameer Bivalkar, Teradyne A consortium of leaders in the ATE industry is developing an IVI standard. The goal is to develop a standard to write SW drivers that can be hardware independent. The tests are written using IVI Class Drivers which enable calls to be routed to the correctly configured hardware. The IVI Class Driver also provides a simulation option which completely frees the test developer from any hardware dependencies while developing test program sets. This paper will describe how IVI was used to reduce test development time significantly for Ai-760™, the new analog test instrument being developed by Teradyne. The paper will cover the following topics: 1. Introduction to IVI 2. Software requirements and system setup for IVI 3. Overview of the Ai-760 4. Writing tests using other IVI Compliant instruments 5. Debug test cases using simulation & 3rd party hardware 6. Running tests on the Ai-760 7. Impact on overall test schedule

Session 1/C: 11:30 – 12:00

Programmable Test Boards for Assembly TPS Troubleshooting Luis Villalta, Teradyne

LUNCH: 12:00 – 1:00

Session 2: 1:00 – 2:30 Programming in C # Session 2/A: 1:00 – 2:30

Hands-On Programming in C# Workshop

BREAK: 2:30 – 3:00

Session 3: 3:00 – 5:00 Bi-Series Session 3/A: 3:00 – 5:00

Hands-On Programming the Bi4Series Workshop The Bi4-Series Workshop will demonstrate how to write a simple program that uses the Bi4-Series instrument to communicate with a UUT using the RS-232 bus protocol. Attendees will get a chance to write code and run that code on a Bi4-Series instrument to control an array of LEDs.

TERADYNE PARTY: 6:00 – 9:00

Programmable development kit boards provide a troubleshooting sandbox for TPS developers and integration testers. When used, these boards reduce the risk of system and prototype UUT damage during TPS development. This approach allows for TPS development and UUT hardware emulation away from a tester. This paper will present two examples of how a development kit board can be used to troubleshoot TPS development. One example will use a Teradyne digital instrument (Di) to test a device controlled by a USB interface, and one will use a Teradyne analog instrument (Ai710) to test the electromechanical interlocks in a system.

MIL/AERO

8. Conclusions Teradyne has been able to leverage the IVI technology to reduce 'Time to Market' significantly for the new analog test instrument.

What is the cost-benefit of using legacy ATLAS code versus developing new C-code to re-host Test Program Sets from the USAF IATE tester to the ADTS tester? The Oklahoma City Air Logistics Center at Tinker Air Force Base in Oklahoma is part of a multi-organizational team working to re-host the intermediate level test software for B1-B LRU electronics. The target tester is the Advanced Digital Test Station™ (ADTS), developed by Teradyne from the Spectrum™-series tester. Since the old test programs were written in ATLAS, ATLAS 89 was chosen as the test program development language. This approach was taken to capitalize on previous ATLAS development work and, we hoped, minimize the effort. However, since the inception of the re-host project, the ATLAS language has introduced problems and limitations that have actually slowed down the development process. C programming language is commonly used to develop instrument and device drivers. C is a powerful, high-level language that is widely available and accepted in the industry. When the ATLAS language does not provide the capability to interface with test instruments, sub-programs called Non-ATLAS Modules (NAMs) are written in C to accomplish the same task. This research paper will examine the cost-benefit of using legacy ATLAS to re-host existing test programs versus developing new programs using only C. The time to convert legacy ATLAS to ATLAS 89 will be compared to development time for workaround C modules (NAMs) or complete test programs using C language exclusively Examples of Non-ATLAS Module development will be cited. Unique situations will be identified with issues that would lend themselves better to one language. Finally, a description of the advantages and disadvantages, lessons learned in several cases, along with the potential solution will be presented.

Session 6: 1:00 – 2:30 Instrument Replacement Session 6/A: 1:00 – 1:30

BREAKFAST: 7:30 – 8:30

Applications for Ai- and Bi-Series Instruments in Legacy™ Tester Replacement

BREAK: 2:30 – 3:00

Richard Lawrence, Gary Bryant, NAVAIR

Session 4: 9:00 – 10:00 iStudio/Di-Series Session 4/A: 9:00 – 10:00

Hands-On Programming the Di-Series using iStudio Workshop The Di-Series workshop will include hands on instruction on the user of iStudio to develop and debug a Di-Series-based digital test. Attendees will use iStudio on development stations to create tests and run those tests on a Di-Series digital test instrument.

BREAK: 10:00 – 10:30

Aging weapons platforms are faced with increasing complexity in system diagnoses. Diagnostic techniques for system maintenance progress throughout the lifecycle of the weapons platform in an effort to keep pace with system requirements. The progression for these diagnostic techniques tends to follow a path set by the system’s original designers. As capabilities for generic instrumentation increase, new paths are created for system maintenance that were not originally envisioned during the original system design. A study of tools currently used in the maintenance of control systems on VSTOL aircraft reveals possible applications for generic instrumentation.

Session 7: 3:00 – 7:00 Engineering Update, Round Table/Poster Sessions & Vendor Fair

Session 7/A: 3:00 – 4:00

Engineering Update Roundtable Sessions: 4:00 – 7:00

Session 6/B: 1:30 – 2:00

TBA

Roundtable 1

Bi-Series Session 5: 10:30 – 12:00 iStudio/Di-Series

Roundtable 2

Di-Series

Session 5/A: 10:30 – 11:30

Session 6/C: 2:00 – 2:30

Roundtable 3

iStudio/Di-Series Workshop (continued)

A Reconfigurable, Extendable L200 Auto-Converter

iStudio

Yonet Eracar, Teradyne

Roundtable 4

Session 5/B: 11:30 – 12:00

Replacing M9-Series Digital Test Instruments (M9-Series DTI) with Di-Series Digital Test Instruments (Di-Series DTI) Lloyd Frick, Teradyne This paper will discuss several aspects of the process to replace M9-Series with Di-Series digital test instruments using the M9Series interface of the Di-Series driver. Topics include a review of some important differences between the M9-Series DTI and DiSeries DTI architecture, how the M9-Series Interface is controlled, and several debugging techniques.

As part of the RTCASS program, The Boeing Company and U.S. Navy re-hosted a large number of L200 TPSs from CASS to RTCASS. Teradyne’s TPS Converter Studio was used to convert these tests. As part of this effort, an L200 Auto-Converter was developed as an add-on for TPS Converter Studio to automate many of the common steps and custom configurations for each conversion. The L200 Auto-Converter interacts behind the scenes with TPS Converter Studio through the Teradyne Test Studio API to complete the conversion with minimal user interaction. However, many of the configuration data and custom conversion steps were hard-coded in the L200 Auto-Converter. To reuse the L200 Auto-Converter for another legacy re-hosting program, programmatic changes and a re-build of the converter would be required. This paper will describe the steps taken to extend the capabilities of this custom tool to work with all the legacy re-hosting programs, and not only for RTCASS. Additional topics will include the new features added to the L200 Auto-Converter for easy reconfiguration and the new .NET interface that supports the addition of custom conversion steps by a user.

Roundtable 5

Ai-Series

MIL/AERO

LUNCH: 12:00 – 1:00

Spectrum

HOLLYWOOD NIVERSAL HOTEL SHERATON U

APRIL 23-25 Because Testing Mat ters Teradyne, Inc. 600 Riverpark Drive North Reading, MA 01864 978-370-2700 www.teradyne.com