Front End of the Line Semiconductor Equipment Market Analysis, Share and Size, Emerging Trends, Overview and Outlook, Growth And Segment Forecasts To 2020
Technavio Announces the Publication of its Research Report Global Front-End-Of-The-Line (FEOL) Semiconductor Equipment Market 2016-2020 Technavio recognizes the following companies as the key players in the global front-end-of-the-line (FEOL) semiconductor equipment market: Applied Materials, ASML, KLA-Tencor, Lam Research, and Tokyo Electron Other Prominent Vendors in the market are: Dainippon Screen Manufacturing, Hitachi HighTechnologies, Nikon, and Hitachi Kokusai Electric Browse full report with TOC@ https://marketreportscenter.com/reports/374140/global-front-end-ofthe-line-semiconductor-equipment-market-2016-2020 Commenting on the report, an analyst from Technavio’ s team said that proliferation of automotive electronics is one of the trends spurring growth for the market. The automotive market is going through a lot of changes with electronics such as advanced driver assistance systems (ADAS), connected vehicles, and electric energy, having good growth potential. In the future, most of the automobile buying decisions will be made based on the electronics content of the vehicles and the associated services. In 2015, 70 million units of cars were sold globally, and 73.54 million units will be sold in 2016. The semiconductor content will increase in vehicles during the forecast period. According to the report, increase in number of fabs worldwide is a key driver aiding to the growth of this market. Financial services are one of the most data-intensive industries. The semiconductor market will see a high demand for semiconductor chips and memory devices from 2017 onward due to the growing adoption of IoT, high demand for connected devices, and increased vehicle automation. Semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment for new facilities will be for the development of memory and logic ICs due to their high demand. Further, the report states that high cost of equipment is challenge the market is facing. Semiconductor manufacturing equipment is expensive. The cost of constructing a semiconductor fab is between $3 and $4 billion, with equipment accounting for the majority of this cost. By 2020, a semiconductor fab will cost around $20 billion. This is because of the growing adoption of 3D packaging solutions like TSV, stacked packaging, flip chip packaging, and MEMS packaging, which require upgraded equipment. The price of equipment varies widely, depending on its function. For instance, the equipment used in front-