One-Stop Total Solution ZenithWorld Co.,Ltd
One - Stop Total Solution _ ZenithWorld www.zenith21c.com
Message from the CEO
Welcome! We at ZenithWorld would like to extend our sincere thanks to you, our valued customers. Since 2003, we have striven to build our business around a foundation of outstanding customer service and superior quality management. In 2008, taking advantage of the experience we had gained since the establishment of our business, we began developing precision components for use in heaters and related applications. We also started to turn over our business field from precision Cleaning to manufacturing core components for semiconductors, LEDs and LCDs, manufactured through the use of an electrostatic chuck, in 2009, and have successfully achieved market penetration. Now, we are developing our company°Øs capabilities in the areas of spray technology and electroless tungsten plating. We are also focusing on the localization of sourcing of key components in order to maximize cost reductions that we then pass on to you. At ZenithWorld, our objective is to provide a level of customer satisfaction unmatched by any of our competitors. Our aim is not just to be Korea°Øs number one supplier for LCD, and LED manufacturer, but to become a global leader in providing production equipment and core components to industry. We genuinely appreciate your business, now and in the future.
Sincerely, Park, Sang - Been Chief Executive Officer ZenithWorld
One - Stop Total Solution _ ZenithWorld www.zenith21c.com
Company Outline and History
2003 ~ 2005 Founding / Stabilizing
2003.07 Established ZenithWorld Co., Ltd.
2003.09 Completed and moved into a old factory(Juk Hyun-Ri)
2004.08 Registered as business partner of Dong-Bu Electronics
2004.10 Registered as business partner of SEC LCD Business
2004.12 Registered as business partner of Magna Chip
2005.09 ISO 9001/14001 Certification
2006 ~ 2008 Growth Period
2006.12 Established research institute attached to company
2007.01 INNO-BIZ Certification
2007.12 Registered as business partner of LG Display
2008.05 Venture Company Certification
2008.05 Main Biz Certification by SMBA
2008.06 Certification of Promising SME Exporter by SMBA
2008.06 Registered as business Partner 0f Hynix
2008.10 Completed and moved into a new factory at Shin Wal-ri, Ewal-myon
2009 ~ Take-Off Period
2009.04 Capital Increase with Consideration through KDB
2009.09 Registered as business partner of Samsung LED
2009.08 Designated as Quality Excellence Company of Chungbuk Province
2009.10 Designated as Knowledge Economy Minster
2009.12 Started manufacture on ESC
2009.09 Registered as business Partner of LG INNOTEK
2010.10 Registered as business Partner of AMAT
Major Customer
Semiconductor
LCD
ICD
LED/ AMOLED
Solar Cell
Portfolio Manufacture of core Parts
Plasma Spray Coating
Precision Cleaning
One - Stop Total Solution _ ZenithWorld www.zenith21c.com
ESC ESC Electstatic Chuck,
Plate or Wafer is Fixed on lower electrode using static power and, the core of Dry Etch part to keep plate temperature steady.
Plasma Etch System
ESC principle / structure
ESC
It uses MCT equipments and it processes the base metal, coating primary insulation seam, electrode seam, secondary insulation seam using Plasma Spray equipments. It uses the formation plane polishing machine and it polishes it completes Dam and Groove and ESC.
Process Flow Manufacture Complete Reproduction Front Reproduction
Machining
Assembly
1st Insulting Layer
Electrode Layer
2nd Insulting Layer
Dam/Groove Milling
Inspection /Packing
ZW-1 coating Development background and necessity
Hitherto Al2O3, Y2O3 Coating subject matters the within it is excellent compared to shows a plasma quality and in about the coating subject matter ZW-1 Coating subject matter development completions which are an indigenous with demand augmentation.
Technical power and expectation effect
Hitherto Al2O3, Y2O3 Coating subject matters compared to F,a in about plasma reaction gas corrosion resistance and mechanical quality improvement (Hitherto plasma resistance about 2.6 time increases the within Y2O3 coating layer preparing) Particle (contamination) occurrence and size decrement and yield increase Life time increases of parts
Application parts
semiconductor equipment parts, all parts of Y2O3 and Al2O3 coating applications Material: Al, Ceramic, SUS
Quartz disk
Ceramic Dome
Sub electrode
Upper insulator
Focus Ring
DPS Poly upper chamber
One - Stop Total Solution _ ZenithWorld www.zenith21c.com
W-plating Development objective Semiconductor, Hallogen families Gas who are coming to be plentifully used in LCD processes it respects with the ostensible side food defense which is caused by
Strong point
Coating methods of existing and it compares and the corrosion resistance which excels the reduction characteristic atmosphere where the F affiliation or CI affiliation etc. reactions which are classified with Halogen families are strong it shows Halogen Gas it will be able to use specially even about oxide angular chlorine chemical compound etc. the feature where the point is biggest
Application parts
Application possible base metal: SUS, Al, GRAPHITE. The application possible object: HCl, Cl2, HF, BCl3, ClF3, TiCl4, NF3 Application possible temperatur: MAX 800 C째
Center liner
Pendulum
Side liner
Corner
Side liner
Corner
Precision Cleaning Meaning and development necessity
Semiconductor the contamination material removal which occurs from production process of Display, LED and Solar Cell etc. In order decrement remaking after cleaning advancing making, the prime cost charge which is caused by with new parts shift
Field of application
Technical power and expectation effect
In about specialization precise cleaning technical (base metal analyzes power and Co2 Cleaning) retention products lump system setup possibility (cleaning where it is perfect possibility and Parts History managements) Until specialization precision cleaning technique where the multiple competitive enterprise lines up and professional cleaning phase considerable time disturbance The environmental cleaning Chemical (HF substitution) manufacture technical retention which hits LED Wafer De-Cap relation equipment and technical power retention
Before
After
Si Wafer
Wafer Decap Sapphire Wafer
After MOCVD process advancing Decap it does hour fire or a Si Wafer dignity Gan and re-the technical power which is serviceable retention
One - Stop Total Solution _ ZenithWorld www.zenith21c.com
R&D present conditions
To found 2006 December enterprise construction laboratory, currently research worker specialty of 15 people being active research and development From establishment early stage above 5%~10% of every year sale misfortune it comes out every year new product in compliance with research and development costs and project star subjects with the investment for a new major power, It makes an application in intellectual property of etc. of the investment the commonness research which leads a industry and education union and the new high value product development and multiple patent application and utility model, propelling a registration,
Development of ESC for semiconductor 300mm
Development of ESC for semiconductor 300mm
SOFC Development core frame coating
SOFC Development core frame coating
SOFC Development core frame coating Development of ESC for semiconductor 300mm
Development of LED 6 ESC
Ni-mesh Product and coating tech
SOFC Development core frame coating
Development of Plasma Powder Development of W-Coating
Development of W-Coating
TBC coating tech developing
Development of AMOLED Metal ESC
MO-CVD equipment developing
MO-CVD equipment developing
Patent Status
Patent Patent Design
10-0906987 10-0919258 30-2009-0034977
July, 09 Sept, 09 Oct, 10
Cleansing Method for Maintenance of Lower Electrode in etching Chamber The Electrode Cleaning Device Cassette of Storage for substrate
The four case of application for a patent
One - Stop Total Solution _
ZenithWorld
1131, Sinwol-ri, Yiwol-myun, Jincheon-gun, Chungcheongbukdo (Electrical/Electronic Agricultural-industrial Complex) Tel. 82.43.536.6700 Fax. 82.43.536.6788 http://www.zenith21c.com