Solder Paste
The Multicore® line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes. Whether your process requires long abandon times, wide process windows, or high-speed printing, Henkel offers a paste that suits your requirements.
Leaded Solder Paste PRODUCT
description/APPLICATION
% METAL LOAD
ALLOY
MP218
- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues - Extended open time and tack-life - Suitable for fine pich, high speed printing
WS200
- High performance water washable solder paste. - Residues are readily removed with DI water, without the need for a saponifier - Good open time with excellent print definition and soldering activity
SN62/SN63 63S4
TACK (g./mm ²)
print speed mm/sec.
ipc/j-std classification
1.1
25-200
ROL0
(Anti-Tombstoning)
89.5 90.5 (Proflow)
SN62/SN63
90.5
0.8
25-100
OHR1
POWDER TYPE
%METAL LOAD
Lead Free Solder Paste system
description/APPLICATION
ALLOY
LF318
- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues - Extended open time and tack-life
96SC
LF700
- No-clean - Low voiding - Excellent humidity resistance - Long abandon time - High printing speed
96SC 97SC
(38-20 µm)
WS300
- Lead-free water washable solder paste
96SC 97SC
(45-20 µm)
AGS (45-20 µm)
TACK (G./MM²)
PRINT SPEED MM/SEC.
88.5
2.0
25-150
ROL0
1.8 2.4
1.8 2.4
20-150
ROL0
0.9
0.9
25-100
OHR1
DAP
AGS
Solder Paste
No Clean Lead free
No Clean Tin Lead
Water Wash Lead Free
Water Wash Tin Lead
LF318™
MP218™
WS300™
WS200™
LF700™ Tin Lead
2
ipc/j-std classification
Lead Free
Solder Wire
The line of cored wires features the renowned multiple flux cores technology to ensure even and consistent distribution of flux throughout the solder wire. This reliability makes Multicore solder wires the first choice for wire soldering processes.
product
halide content
description
ipc class
alloy options (SN/PB)
alloy options (PB-free)
content (BYweight)
CRYSTAL 400
Halide free, no-clean, clear residue, increased flux content for improved wetting
ZERO
ROL0
60/40, SN62
96SC, 99C, 97SC
2.2%
CRYSTAL 502
No-clean, clear residue, minimal activation for increased wetting speed
0.2%
ROM1
60/40, SN62
96SC, 99C, 97SC
3%
CRYSTAL 511
No clean, clear residues, heat stable
1.1%
ROM1
60/40
96SC, 97SC
2.7%
General purpose high activity for fast wetting
0.5%
ROL1
60/40, SN62
96SC, 99C, 97SC
3%
3%
ORH1
60/40, SN62
96SC, 99C, 97SC
2%
362 HYDRO-X
High activity water washable
Bolded text is normal warehouse products. 96SC = Sn 95,5, AG 3,8%, Cu 0,7% melting point 217 °C 99C = Sn 99,3%, Cu 0,7% melting point 227 °C 97SC = Sn 96,5% Ag 3,0%, Cu 0,5% melting point 217-218 °C
Cored Wire
Water Wash
No Clean
Hydro-X™
C400™ C502™ C511™ 362™
Use fume absorbers when soldering. More info on page 48-49
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
Homepage: www.oemklitso.dk 3
Fluxes
The range of VOC-free (Volatile Organic Compound) fluxes offer reliable, high yield, no clean wave soldering whilst providing significant environmental and safety benefits due to the non flammable VOC-free (water based) flux carrier systems.
Alcohol Based Fluxes product
description/application
% solids
% Halids
acid value
ipc class
application
X32-10
- Clear residue - Wide process window - A general purpose halide-free low solids flux - Suitable for foam and spray flux application systems
2.2
ZERO
15.3
REM0
SPRAY/FOAM
MF 388
- Low residue - Halide free - Ideal for Pb-free wave soldering
3.5
ZERO
20
ROL0
SPRAY
5372
- High temperature - Dipping flux - Suitable for all Multicore alloys
75
0.12
38
-
DIPPING
VOC-Free Fluxes product
MF300
description/application
% solids
- General purpose VOC-free (water based) - No-clean, halide-free and resin-free flux - Compatible with Pb-free processes
% Halids
4.6
acid value
ZERO
ipc class
37
ORM0
application
SPRAY/FOAM
Water Washable Fluxes product
HYDROX/20
description/application
% solids
- IPA based - A high activity water washable flux - Unique activator package - Residues are readily and completely removed by water wash after soldering - Suitable for lead-free wave soldering
20
% Halids
1.0
acid value
IPC CLASS
24
ORH1
Cleaners page 34
Liquid Fluxes
No Clean
Voc Free
Water Wash
5372
MF300™
Hydro-X20™ SC01™
MF388™ ROML
X32-10i™ REMO
Syntehetic Resin
4
Rework Small Areas
application
SPRAY/FOAM
Surface Mount Adhesives
Henkel is the world leader in developing cutting edge technology for high-speed syringe dispense and stencil print Chipbonders®. Innovative new surface mount adhesives are developed to meet the challenges of high speed assembly processes and high reliability end user requirements.
Syringe Dispense Adhesive product
description/application
color***
cure
process methid
storage (protect from heat)
shelf life**
3609
- For high-speed dispensing - Red for best vision pickup on light surfaces
RED
90 sec. at 150 °C or 3-4 min at 125 °C
High Speed Dispensing 40,000+ DPH capable.
5 °C ± 3 °C
6 months DOM
3621
- Superior humidity resistance and electrical properties - Can be used in lead free solder applications - Room temperature storage capable
RED
90 sec. at 150 °C or 3-4 min at 125 °C
Very High Speed Dispensing 47,000 DPH capable. Jettable.
5 °C ± 3 °C or 8 °C -21 °C for 30 days
10 months DOM
3627
- Specially formulated for excellent high-speed dispensing - Room temperature storage capable
RED
90 sec. at 150 °C 3-4 min at 125 °C
High Speed Dispensing
5 °C ± 3 °C
6 months DOM
3629
- High reliability - Low temperature cure - Lead-Free capable - Flourescence under UV light
RED PINK
60 sec. at 150 °C 110 sec. at 120 °C 3 min. at 110 °C
Dispensing Printing
5 °C ± 3 °C
6 months DOM
Stencil Print/Pin Transfer Adhesives product
description/application
color***
cure
process methid
storage (protect from heat)
shelf life**
3616
- Specifically formulated for metal stencil print applications - Especially well-suited for large components
RED
60 sec. at 150 °C or 2-8 min at 125 °C
Stencil Print (0.5-2"/sec.)
5 °C ± 3 °C
9 months DOM
3627
- Excellent high-speed printing for finepitch components - Room temperature storage capable
RED
90 sec. at 150 °C 3-4 min at 125 °C
Dispense and Stencil Print
5 °C ± 3 °C
6 months DOM
3629
- High reliability - Low temperature cure - Lead-Free capable - Flourescence under UV light
RED PINK
60 sec. at 150 °C 110 sec. at 120 °C 3 min. at 110 °C
Dispensing Printing
5 °C ± 3 °C
6 months DOM
Clean Up Solvent product
7360
description/application
solvent type
- Nozzle and dispense machine component cleaner - Excellent for removal of uncured adhesive from the board without causing the adhesive to gel
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
Aliphatic Ester Blend
E-mail: info@oemklitso.dk
flashpoint
100 °C
corrosive properties
ozone depletion potential
None
None
Homepage: www.oemklitso.dk 5
Conductive Adhesives
Loctite® Electrically Conductive Adhesives provide both a mechanical bond and an electrical interconnection between a device and a circuit board. Loctite® electrically conductive adhesives meet the industry’s need for lead-free alternatives to solder.
Electrically Conductive Epoxy Adhesives system
3880
3888
description/application
shelf life*
lapshear adhesion (AL/AL)
cure schedules
tg °C
cte ppm/ °C
volume resistivity (ohm-cm)
work life at room temp.
Heat Cure 1-component
- Syringe or stencil dispense - Silver conductive adhesive for solder replacement - Long work life
6 months at 0-(-10 °C)
>1,000 psi 6.9 N/mm²
10 min at 125 °C 6 min at 150 °C 3 min at 175 °C
40
45
<.0.0005
7 days
Room temperature 2-component
Room-temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties
6 months at 21-25 °C
>1,000 psi 6.9 N/mm²
24 hrs at 23 °C 1 hr at 120 °C 30 min at 155 °C
50
>50
<.0.0001
90 min.
description/ cure
*Shelf life- 2-component materials have a one year shelf life at room temperature (21 °C-25 °C)
2-Component Packages
1-Component Packages
Typically used for sample evaluation and rework applications. These packages do not require special storage equipment. They can be stored up to 12 months at room temperature.
All 1-component products are packaged in convenient syringes. These packages must be stored FROZEN at -40 °C. (The exception is product 3880 which is stored at 0 °C.)
Electrically Conductive Adhesives
Chipbonder ™
Screen Print/ Pin Transfers
Dispense Adhesives
3616™
3609™
3627™
3621™
3629™
3627™ 3629™
6
Cleaner
7360™
Isotropical Conductive 3880™ 3888™
Adhesive Clean-Up Solvent 7360™
Thermal Management Materials
The PCTIMs are silicone-free and do not migrate or dry out like thermal greases. These innovative products are manufactured as a highly thixo-tropic phase change compound coated in a strictly controlled manner upon the surfaces of special grades of thin AL or CU foils, or to dielectric substrate films.
Phase Change Thermal Interface Material thermal impedance (°C-in. ²/W) at 80 PSI
thermal impedance (°C-in. ²/W) at 550 kpaI
Thermal conductivity (W/mk)
Phase change temperature (ºC)
substrates thickness (mm)
total thickness (mm)
substrates material
Unsupported film with very low thermal impedance even at low pressure. Fills gaps up to 0.2 mm (0.008") or collapses to form a thin interface. Direct attach to heat sink without heating. Suitable for semiconductor and power electronics applications
0.003
0.022
3.3
45
N/A
0.008 0.2
None
Powerstrate® 51r™
Low thermal impedance, reworkable grade. Most suited to applications on lidded processors where the heat sink may have to be removed for rework.
0.008
0.052
3
51
0.051
0.074 to 0.083
AL 1145-0
Powerstrate® 51,60™
Low thermal impedance, robust grade. Suited to a wide range of applications on bare die processors and other electronics devices.
0.008
0.052
3
51 or 61
0.051
0.064 to 0.16
AL 1145-0
PSX-D
Thermal paste for stencil print or manual application
0.008
0.052
3.4
N/A
N/A
0.254
All
Silverstrate®
Excellent thermal performace, particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required, (Silverfilled).
0.003
0.022
3.14
51
0.051
0.102 to 0.127
AL 1145-0
Thermstrate® TC™
Phase change compound in applicator bar. Ideal for prototyping, rework and small scale production.
0.021
0.137
0.47
60
N/A
N/A
None
Thermstrate® 2000™
Good thermal performance most suited to applications on power IGBTs, semiconductors, DC-DC converters and other isolated packages.
0.022
0.143
3
60
0.051 & 0.128
0.076 to 0.191
AL 1145-0
product
description/application
Powerstrate® Xtreme™
Phase Change Thermal Interface Material - Electrically Isolating Products thermal impedance (°C-in. ²/W) at 80 PSI
thermal impedance (°C-in. ²/W) at 550 kpaI
Thermal conductIVITY (W/mk)
Phase change temp. (ºC)
Thickness substrates (mm)
Electrically isolating phase change material for use with a wide range of non-isolated components.
0.12
0.78
0.45
60
0.025 to 0.076
Electrically isolating phase change material. Ideal for nonisolated devices in high volume applications where high thermal performance is not required.
0.48
3.12
0.155
60
MCMstrate®
Adhesive backed version of Isostrate. Allows pad to be postioned to facilitate assembly.
0.25
1.325
0.4
EMIstrate®
Unique combination of thermal and EMI management. Excellent choise for radiated EMI control.
0.4
2.6
0.69
product
Isostrate® 2000™
Isostrate®
J-Series™
description/application
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
substrates material
DIELECTRIC RATING VAC/MIL SUBSTRATE
UL YELLOW CARD
UL FLAMMABILTY
0.051 to 0.153
Polyimide
>5000
None
None
0.0051
0.076
Polyethylene
>5000
See data sheet
See data sheet
60
0.025 to 0.076
0.064 to 0.114
Polyimide
>5000
E1049 35
94V-0
60
See data sheet
See data sheet
Polyimide
N/A
N/A
N/A
E-mail: info@oemklitso.dk
total thickness (mm)
Homepage: www.oemklitso.dk 7
Thermal Management Adhesives
Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips while providing an efficient method of thermal transfer between heat generating electronics devices and their heat sinks.
Thermal Adhesives product
description/application
cure/ chemistry
specific gravity
viscosity
shelf life
cure schedules
modulus
tg °C
Cte ppm/ ºC
thermal conductivity
315
Self-shimming for electrical isolation; room-temperaturecuring adhesive.
1-component Activator* Acrylic
1.7
Paste
9 months at 5 °C
5 min. at 20 °C 4-24 hr. at 20 °C
390,000 psi 2700 N/ mm2
50
69
0.80 W/mK
384
epairable, room-temperatureR curing adhesive utilized for parts subject to disassembly.
1-component Activator* Acrylic
1.6
Paste
9 months at 5 °C
5 min. at 20 °C 4-24 hr. at 20 °C
400,000 psi 2800 N/ mm2
50
110
0.76 W/mK
5404
S elf-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.
1-component Heat Cure Silicone
2.4
280** g/min.
5 months at 4 °C
10 min. at 150 °C
587 psi**** 4 N/mm2
-40
104
1.0 W/mK
7386
7 387 DEPEND is one component of a two part no mix adhesive system. It is solvent based and has a very low viscosity. 1.75 oz bottle
Heptane and Isopropanol
0.8
Very low
on part life 2 months
N/A
N/A
N/A
N/A
N/A
* Use with activator 7386.
** Extrusion measured @ 50 psi/0.125" orifice. *** Made to order. Initial order may require longer lead time.
**** Youngs Modulus
Thermal Management Mtl.
Adhesives
Shimming
NonShimming
315™
384™
5404™
Thermal Pads
Activator
NonInsulating
Electrically Insulating
Electrically Conductive
7386™
Powerstrate® Xtreme™
Isostrate®
Silverstrate®
Powerstrate® Thermstrate®
8
Thermal Paste
Specialty Mtl.
PSX-D®
EMI-Strate®
Silicones
Silicones offer highly diverse product properties for virtually unlimited applications. With their great versatility, silicone products are ideal for intelligent, customized solutions. They offer thermal stability, weatherability, hydrophobic and hydrophilic surface properties, and excellent release, lubricating and dielectric characteristics.
Potting and Encapsulation Silicone gel addition-curing colour
1K
Transp.
Viscosity mPa s
pot life 23° C
0.96
150
6H
100˚/240 min 130˚/40 min 150˚/10 min
0.98
35 000 2 500
3 month 15˚C/ 6 month
100˚/240 min 130˚/40 min 150˚/10 min
1 000
1 000
features
Semicosil® 926
- Low viscosity - Ready-to-use, one-component - Rapid heat cure - Low content of uncured polymer - Low ion content
Semicosil® 924
- Thixotropic flow - Low ion content - Low content of volatiles - Low content of uncured polymer - Forms a soft gel on vulcanization
Wacker Silgel® 612
- Very low viscosity - Very low hardness (silicone gel) - Crystal clear vulcanizate - Pronounced tackiness - Excellent mechanical damping properites
1:1
Transp.
0.96
- Very low viscosity - Low ion content
1K
Transp.
0.97
Elastosil® RT745S
mix
dencity g/cm³
product
1K
Transp.
cure time °C/ime for 1 cm
hardness cone mm/10
applications
60
Encapsulation of electronic components.
50
Recommended for local encapsulation of delicate electronic components,e.g.bonded chips on hybrid components which are exposed to extreme external influences.
2H
23˚/8 hrs 70˚/15 min 120˚/5 min
300
Encapsulation of electronic components and solar cells. Embedding of optical fibres. Production of shock absorbers. Sealing of clean-room filters.
>4 H
80˚/30 min 120˚/5 min 150˚/2 min
5 37 Shore 00
Encapsulation of electronic components
Silicone Rubber Addition-Curing RTV-2 product
Elastosil® RT 601
hardness cone mm/10
mix
colour
dencity g/cm³
Viscosity mPa s
pot life 23° C
- Low viscosity - Medium cured hardness - Excellent tensile strength - Crystal clear vulcanizate
9:1
Transp
1,02
3 500
90 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
45
All-round potting compound. Manufacture of moulded articles by casting.
9:1
Light Grey
1,17
3 500
80 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
30
All-round potting compound.
9:1
Transp
1,02
800
90 min
23˚/24 hrs 70˚/30 min 100˚/8 min 150˚/5 min
25
Encapsulation of electrical and electronic components.
9:1
Reddish brown
1,43
10 000
80 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
55
All-round potting compound.
9:1
Reddish brown
1,3
12 000
60 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
27
All-round potting compound. Technical mouldings. Encapsulation of electrical components.
9:1
Reddish brown
2,3
35 000
150 min
23˚/24 H 70˚/60 min 100˚/30 min 150˚/10 min
80
Encapsulation of electrical components.
9:1
Grey
1,50
1 100
8h
100˚/60 min 150˚/15 min
20
Encapsulation of electrical components.
Elastosil® RT 602
- Low viscosity - Medium hardness - Excellent heat stability
Elastosil® RT 604
- Very low viscosity - Low hardness - Crystal clear vulcanizates
Elastosil® RT607
- High hardness - Excellent heat stability - Flame retardant
Elastosil® RT 622
cure time °C/ime for 1 cm
features
- Good processing due to low viscosity - Very good mechanical properties - Soft vulcanizates
Elastosil® RT 675
- Low viscosity - Low hardness - Fast curing at higher temperatures
Elastosil® RT 743 LV
- Extreme hardness - Excellent heat stability - Extremely high thermal conductivity
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
applications
Homepage: www.oemklitso.dk 9
Silicones
Encapsulaation and Coating Silicone Rubber product
features
mix
colour
dencity g/cm³
Viscosity mPa s
pot life 23° C
cure time °C/ime for 1 cm
hardness cone mm/10
Elastosil® 935
- Low viscosity - Very long pot life - Fast curing at elevated temperatures - Low hardness - High flexibility - Low risk of inhibition by soldering or flux residues
1:1
Transp
0.97
3 500
7 days 10˚C/14 d
80˚/30 min 120˚/10 min 150˚C/5 min
15
applications
Coating of printed circuit boards. Encapsulation of electronic components.
Bonding, Fixing and Sealing/Gasketing Room temperature Curing RTV-1 features
mix
color
dencity g/cm³
Viscosity mPa s
pot life 23° C
cure time °C/ime for 1 cm
hardness cone mm/10
Elastosil® A 07
- Ready to use, one-component system - Low viscosity - High flexibility - Primerless adhesion to many substrates
1K
Transp.
1.08
10 000 -
3-5 min
5
20
Multipurpose sealant and coating material.
Elastosil® A 234
- Amine-curing system - Flowable - Excellent heat stability - Excellent primerless adhesion to many substrates
1K
White
1.21
35 000
10-20 min
2
36
Gluing and sealing of steam chambers and sole plates of steam iron
Elastosil® A 33
- Ready to use, one-component system - Good mechanical properties - Primerless adhesion to many substrates
1K
Ivory
1.16
2
10-20 min
2
25
Adhesive for the coating and sealing at high temperatures.
Elastosil® A 43
- Amine-curing system - Flowable - Excellent heat stability - Excellent primerless adhesion to many substrates
1K
Transp. Black
1.09
350 000
10-25 min
1-2
30
General-purpose adhesive and coating for technical and medical applications
Elastosil® N 2010
- Neutral curing system (alkoxy) - Sprayable - Flowable - Primerless adhesion to many substrates - Good heat stability
1K
Transp.
1.01
20 000 -
10-25 min
2-4
25
General-purpose adhesive and coating for technical applications
Elastosil® N 2034
- Neutral curing system (alkoxy) - Short skin forming time - Fast curing - Flowable - Primerless adhesion to many substrates - Good heat stability
1K
Black
1.14
45 000 -
20 min
2-4
36
General-purpose adhesive and for technical applications. CIPG- and FIPG-applications e.g. for headlamps.
- Neutral curing system - Solvent free - Non-slump - Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces
1K
Grey
1.24
N/A
25 min
2-4
35
General-purpose adhesive and for technical applications.
- Neutral curing system - Solvent free - Non-slump - Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces
1K
Transp.
1.05
N/A
25 min
2-4
40
General-purpose adhesive and for technical applications.
The fully cured rubber can withstand expansioncompression cycles for many years. Especially well suited for joining materials with different coefficients of thermal expansion.
product
Elastosil® N 2197
Elastosil® N 2199 Elastosil® N 9132 N 9132 S
Elastosil® N 189
10
- One-part, ready-to-use - Neutral curing system - Non-slump - Excellent unprimed adhesion to most plastic, metal, glass and ceramic substrates - Flame retardant:meets UL 94V-O
1K
- Neutral curing system (oxime) - Non-slump - Good resistance against mineral oil and coolant fluids - Excellent heat stability - Excellent adhesion to many substrates
1K
Grey 1.30
N/A
5-20 min
2-4
33
1.0
10
10-25 min
1-2
60
White
Black
applications
General-purpose adhesive fortechnical applications. FIPG- and CIPG-application
Silicones
Heat Cure SiliconeAdhesive Silicone Rubber Addition-Curing product
features
mix
colour
dencity g/cm³
Viscosity mPa s
Shear rate. g/10s
cure time 23 °C
26 min
140˚/20 min 200˚/3 min
45
Allround glue for houseware and metal industry. Useable for silk screen printing.
hardness shore a
applications
- Ready-to-use, one-component - Flowable - Thixotropic - High extrusion rate - Fast curing at high temperatures - Good heat stability - Excellent primerless adhesion to many substrates
1K
Black
1.23
100 000 13 000
Semicosil® 986/1K
- Ready-to-use, one-part system - Thixotropic - Translucent, medium hardness - High flexibility
1K
Transp.
1.07
300 000
-
100 °/6 h 130 °/30 min 150 °/10min
51
General purpose adhesive for the electronics industry.
Semicosil® 987/1K
- Ready-to-use, one-component system - Low viscosity during dispensing nonslump after dispensing - Medium hardness - High flexibility - Primerless adhesion to many substrates
1K
Transp. + Grey.
1.1
300 000 30 000
-
100˚/6 h 130˚/1 h 150˚/10 min
50
General purpose adhesive for the electronic industry. FIPG-and CIPGapplications.
Elastosil® RT 705
Silicone Paste features
colour
dencity g/cm³
operating temp.
hardness cone mm/10
- Good electrical properties - Good adhesion to metal and ceramic materials - Excellent water repellency
Transp.
1.0
-40 - +220
350
Lubricants for shut-off valves. Release agents for compression moulding, extruder die rings.
Silicone Paste P 12
- Soft, heat sink paste with marked thermal conductivity - Electrically insulating
White
2.25
-30 - +200
300
Especially used in semiconductor technology as a heat sink paste.
Geniosil N 550
- Silane modified polymere adhesive, free of isocyanates, tin catalysts and silicones - Neutral curing - Temperature range -50° C to 120 °C - Solvent free - Excellent adhesioin
Grey.
1.3
-50 - +120
Shore A 55
product
Silicone Paste P 4
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
applications
Sealant/elastic adhesive for technical applications. Can be varnished with suitable paints in cured and uncured state.
Homepage: www.oemklitso.dk 11
Die Attach Adhesives
Based on ultra-hydrophobic chemistry, Hysol® die attach adhesives offer very high adhesive strength, elongation at break, and cohesive energy at high reflow temperatures. These properties help electronic packages retain adhesive strength and structural integrity during moisture soak and absorb stresses during the deformations associated with lead free reflow processing.
Die Attach Adhesives for Non-Hermetic Packages For organic substrates including laminates, array, BGA and CSP packagers product
QMI 536 QMI 550SI QMI 550 EC
Thermal conductivity
tg (°C)
9000 CPS
0.3 W/mk
-31
15 min at1 50 ˚C oven 10 sec at 150 ˚C SC
17000 CPS
0.6 W/mk
15 min at 150 ˚C oven 10 sec at 150 ˚C SC
17000 CPS
3.8 W/mk
resin
filler
oven cure/ skip cure
Industry Standard Industry standard for die-to-die bonding; dielectric, high adhesive strength material for organic substrates.
BMI
PTFE
15 min at 150 ˚C oven 10 sec at 150 ˚C SC
Low CTE CVersion of QMI 550 Silica-filled for low shrinkage and low warpage on laminate and flex substrates.
BMI
Silica
Electrically Conductive Silver-filled version of QMI 550; very high adhesive and cohesive strength.
BMI
Silver
description/application
viscosity 5rpm at 25 °C
cte 1/2
modulus at 25°C
storage temp.
93 174
0.30 GPa
-40 °C
33
43 91
1.50 GPa
-40 °C
2
46 148
2.8 GPa
-40 °C
For inorganic substrates incl. CU, Pd, Ag & Au plating, ceramic and black oxide product
12
description/application
resin
filler
Recommende cure
BMI
Silver
15 min at 180 ˚C oven 10 sec at 200 ˚C SC
QMI 518
Electrically Conductive, Large die Similar properties to QMI 519, but formulated to have a low modulus to reduce stress on die larger than 500+500 mil./13-13µm.
QMI 519
JEDEC L1 260C for SOIC, QFN Industry standard for QFN packages. Good for all preplated leadframes, and bare copper. Higher adhesion, excellent electrical and thermal performance.
BMI
Silver
15 min at 185 ˚C oven 10 sec at 200 ˚C SC
QMI 519HT02l
High Thermal Conductivity Very high electrical and thermal conductivity while maintaining excellent adhesion. Suitable for high heat dissipating devises.
BMI
Silver
15 min at 180 ˚C oven 10 sec at 200 ˚C SC
viscosity 5rpm at 25 °C
Thermal conductivity
tg (°C)
8500 CPS
1.4 W/mk
-64
9000 CPS
3.8 W/mk
18800 CPS
7.3 W/mk
cte 1/2
modulus at 25°C
storage temp.
69 152
0.10 GPa
-40 °C
75
40 140
5.3 GPa
-40 °C
49
42 104
6.70 GPa
-40 °C
Encapsulants
Semiconductor Liquid Encapsulants. Henkel´s co-cure dam and fill encapsulants cure in one easy step, requiring no pre-cure of the dam material. High purity liquid epoxy encapsulants are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage and corrosion.
Chip on Board Liquid Encapsulants. These products cure to form void-free globs when exposed to heat, with formulations for low CTE, minimizing stress on wire bonds during thermal cycling. These encapsulants are easy-to-dispense, minimize induced stresses, provide improved temperature cycling performance, and offer excellent chemical resistance.
Semiconductor Liquid Encapsulants Flow Control / Dam Materials product
FP4451
description/application
Flow Control Barrier
pot life at 25 ºC
recommended cure
flow properties
24 hrs.
30 min. at 125 °C + 90 min. at 165 °C
None
viscosity at 25ºC
tg. ºC
cte (1) (ppm/ºC)
% filler
storage temp.
860,000 cps
145
24
72
-40 °C
viscosity at 25ºC
tg. ºC
cte (1) (ppm/ºC)
% filler
storage temp.
Fill Encapsulants product
FP4450
FP4470
description/application
pot life at 25 ºC
recommended cure
flow properties
ICs, COB, BGA, PGA
3 days
30 min. at 125 °C + 90 min. at 165 °C
High
50,000 cps
155
22
73
-40 °C
Lead-free Packages
5 days
30 min. at 125 °C + 90 min. at 165 °C
High
48,000 cps
148
18
75
-40 °C
flow properties
viscosity at 25ºC
tg. ºC
cte (1) (ppm/ºC)
% filler
storage temp.
Clip on Board Liquid Encapsulants product
description/application
pot life at 25 ºC
recommended cure
EO1016
COB, Watch ICs
3 months
15 min. at 150 °C
Medium
70,000 cps
115
40
40
4 °C
EO1060
Chip on Board
25 days
4-6 hrs. at 125 °C
High
15,000 cps
125
40
61
4 °C
FP4401
Chip on Board
24 hrs.
3 hrs. at 170 °C or 6 hrs. at 150 °C
Low
375,000 cps
160
22
75
-40 °C
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
Homepage: www.oemklitso.dk 13
Circuit Board Protection Underfills
Henkel´s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, providing electrical insulation, and increasing vibration and shock resistance.
Conformal Coatings description
type
pot life
viscosity cps
cure cycle
secondary cure
delectric strenght (v/mil/kV/cm)
PC 18
- A one component solvent based Acrylic conformal coating specifically designed as a toluene free alternative. - Application by non-atomized selective spray coating equipment. - Components and joints may be repaired by heating the coating with a soldering iron for easy removal.
Urethane
60 min. tack free
350
Heat 2 hrs. at 125 °C
5-7 days at RT
1200/472
continuous up to 110 ºC
PC 28
- Solvent-based, oxygen curing, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray procedures
Urethane
60 min. tack free
35
Heat 5-7 days at 25 °C
Air Dry 30-60 min. followed by 2-4 hrs. at 60 °C
1500/591
continuous up to 110 ºC
PC 62
- Solvent-based, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray to meet MIL-I-46058C, Type PUR, requirements
Acrylic conformal
5 min. tack free
40-60
24 hours at 25°C
45 minutes at 75°C
N/A
–40 -125°C
5293
- UV Silicone for severe temperature cycling environments. - High reliability automotive - No solvents - Low VOC
Silicone
N/A
600
UV 20-40 sec. 75mW/cm2
Moisture Tack free:2-6 hrs. Full cure: 72 hrs
406/160
-40 -204 °C
product
temp. range
Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing required for lead free assembly. Our green materials are developed to meet demanding end use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion. Loctite CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life.
Semiconductor Liquid Encapsulants CSP and DCA Underfill Encapsulants product
14
description/Application
viscosity at 25°C
pot life
cure schedule
tg. °C
cte(1) (ppm/°C)
capillary flow
storage temp.
3513
Reworkable CSP
4,000 cps
2 days
30 min at 100 °C
69
70
N/A
2 °C - 8 °C
3593
Snap Cure Rapid Flow CSP
4,500 cps
7 days
5 min at 150 °C
110
50
100 sek.
2 °C - 8 °C
Inspection
Optilia Instruments AB is manufacturer of high quality flexible video and digital microscopes for visual inspection, quality control, software analysis & measurements and digital image recording & documentation.
W10x • Inspection camera with built-in laser pointer • 10x optical zoom and auto focus function • Analog video signal (PAL)
Flexia Visual Inspection & Documentation kit • ESD Protected and Approved • Digital Image Recording & Documentation • High Image Quality
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
Homepage: www.oemklitso.dk 15
Cleaners and other products
product
description/application
SC01 MCF800 SPOT ON SOLDER MASK
TTC-LF
STW 001
product
NO-CLEAN DESOLDERING WICKS
product
MINI FLUXERS & CLEANERS
PACKING SIZE
- SC01 is designed for the stencil cleaning and hand cleaning of solder process residues. - A highly effective cleaner that dries rapidly (fast evaporation).
5L
- MCF800 is designed for post soldering cleaning using cleaning process equipment. - Highly effective cleaner, requires rinse using either water or solvent.
8 ML
- Temporary solder resists used with circuit boards prior to soldering. - Ideal for prevention of PTH hole filling and for the protection of contact surfaces e.g. edge connections. - Suitable for use with hand, robotic, pneumatic or template screening applications and brush. - Peelable for easy removal.
250 ML 5L
- Handy, non-abrasive solder iron tip-tinner. - Easily wets hot solder irons leaving a brightly tinned tip. - Improves hand soldering efficiency and extends tip life. - Adhesive pad allows easy mounting on or near the solder iron holder.
15 G
100 wipes/can
- Stencil Wipes
description/application
type
AVAILABLE WIDTHS
NC-00 NC-AA NC-AB NC-BB
- Fast, easy means of removing solder. - No-clean, High activity flux means minimal cleaning is required. - Comprehensive range available
description/application
0.8 MM 1.5 MM 2.2 MM 2.7 MM
RANGE AVAILABLE
- Controlled release flux and cleaner pen applicators. - Ideal for controlled application of flux when carrying out SMT re-work. - Cleaner pen easily removes residues.
No clean flux x335-07i pen Cleaner MCF-800 pen
SOLDER ACCESSORIES
Solder Masks Multicore
Spot-On™
Mini Cleaners Multicore
MCF800™ Multicore
SC01™
Mini Fluxers (Flux Pen) No Clean Multicore
x33S-07i
Tip Tinners Multicore
TTC-LF™
Wicks Multicore
NC-00™ Multicore
NC-AA™ Multicore
NC-AB™ Multicore
NC-BB™
16
Soldering Stations Soldering Stations 2010
Phone: Fax: E-mail: Homepage:
SWEDEN +46 (0)75 24 24 650 +46 (0)75 24 24 651 info@cyncrona.se www.cyncrona.se
FINLAND +358 (0)20 7528 700 +358 (0)20 7528 770 info@cyncrona.fi www.cyncrona.fi
DENMARK +45 87 42 66 66 +45 87 42 66 77 info@cyncrona.dk www.cyncrona.dk
NORWAY +47 32 21 05 80 +47 32 21 05 81 info@cyncrona.no www.cyncrona.no
ESTONIA +372 510 05 05 +372 445 65 70 baltic@cyncrona.fi www.cyncrona.com
17
Soldering Stations
18
Soldering Stations
19
Soldering and desoldering stations
Entry line soldering stations system/ PART NO
description
nominal power
total peak power
temp. selection between
BD-2BA BD-2SA
Digital soldering station with 2-lines readout display and menu for modification of values from original setting
75W
60/140 W
90-450 °C
CD-2BA
Soldering station 230V For general electronics jobs. Includes control unit BD, handpiece T245-A, cartridges C245-003 and C245-007
75W
140 W
90-450 °C
CD-2SA
Soldering station 230V For high precision solder joints. Incudes control unit BD, handpiece T210-A, cartridge C210-001 and 210-008
75W
60 W 140 W
90-450 °C
nominal power
total peak power
temp. selection between
75W
140 W
90-450 °C
2 x 20W
2 x 40 W
90-450 °C
Single line soldering stations system/ PART NO
description
CF-2A
Solder feed station 230V Designed for repetitive soldering or when you need a free hand. Equiped with solder feed iron of 1mm diameter. Includes AP control unit, AP-A solder feed iron, C130-403 cartridge.
CP-2A
Micro tweezers station 230V For soldering and desoldering SMD components with micro-tweezer. Includes control unit PA, PA-A micro hot tweezers and 2 x C120-002 cartridge.
Single line desoldering stations system/ PART NO
20
description
nominal power
total peak power
temp. selection between
CS-2A
Electric system 230V Electric suction system powered by control unit DSV or electric vacuum pump MS-A. Includes control unit DSV, DS-A micro desoldering iron with tip C360-004, MS-A electric vacuum pump.
20W
30 W
300-450 °C
CV-2A
Pneumatic system 230V Pneumatic suction system with dial for temperature selection. Includes control unit DSV, DS-A micro desoldering iron with tip C36-004, pneumatic suction system feeded by compresed air max 6 bar.
20W
30 W
300-450 °C
Soldering and desoldering stations
DIT and DIR Soldering Stations, one channel system/ PART NO
nominal power
description
total peak power
temp. selection between
weight
DIT-2A
Soldering station 230V For general electronic applications. Includes control unit DI-2A, stand AD-SA, soldering iron T245-A and cartridge C245-003
75 W
140 W
300-450 ºC
2 kg
DIR-2A
Soldering station 230V For high and medium precision solder-joints. Includes control unit DI-2A, soldering iron T210-A, cartridge C210-001 ad stand AD-SA
75 W
140 W 60 W
300-450 ºC
2 kg
DIS Desoldering Station system/ PART NO
nominal power
description
total peak power
temp. selection between
weight
DIS-2A
Desoldering station 230V. For desoldering insertion componenets and cleaning circuits with SMD components. Includes control unit DI-2A, desoldering iron with tip C560-003, stand DR-SA, MS-A suction module electric system and accessories set.
75 W
140 W
300-450 ºC
2 kg
DSS-2A
Micro desoldering station 230V. For desoldering small and medium-sized insertion components; high-precision station with small measurements. Includes control unit DI-2A, desoldering iron DS-A with tip C360-004, stand DS-SA, MS-A suction module electric system and accessories set.
75 W
140 W
300-450 ºC
2 kg
DIN Nitrogen Soldering Station 230V system/ PART NO
nominal power
description The DIN-2A nitrogen soldering station combines 2 ways of transferring heat: - By direct contact between the solder tip and the solder joint, just like a normal soldering iron. - By nitrogen which is heated when flowing through the soldering tip. Includes DI-SA control unit, stand DN-SA, nitrogen handpiece T245-NA with C245-003. MN-A nitrogen flow regulator. N2 flow regulation:: 0,5-3,5 LPM at 5 Bar.Max pressure:6 Bar.
DIN-2A
75 W
total peak power
140 W
temp. selection between
90-450 ºC
weight
1,2 kg
An externa nitrogen circuit is needed or the nitrogen generator from JBC GN-A
GN-A Nitrogen module generator product/PART NO
GN-A
Description • • • •
Compressed air pressure: 4 to 6 Bar Gas N2 concentration: up to 99,9% Concentraded N2 gas flow: 1 to 2 NL/min. Weight: 2 kg
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
Homepage: www.oemklitso.dk 21
Soldering and desoldering stations
DDST Rework Station system/PART NO
DDST-2A
description
nominal power
total peak power
Sleep mode power
Soldering and desoldering station 230 V The station offers a complete solution for fast and safe repair of insertion component circuits by suction of hte solder. The station can also be used for cleaning pads in SMD circuits.
2 x 75W
2 x 140W
2 x 10W
Hibernation mode power
temp. selection between
weight
2 x 4W
4.5 kg
air flow regulation
protected against antistatic discharge
90-450 °C
includes Control unit DD-2A Handspiece T245-A Cartridge C245003 Desoldering DR-A Tip C560-003 Stand AD-SA and DR-SA Suction electrical system MS-A Set of tools and accessories
JT High Power Hot Air Station 230 V system/PART NO
JT-2A
description
maximum power
A high power hot air station used for desoldering all types of SMD's. Its powerful heater desolders even the biggest QFPs and PLCCs quickly and safely. Desoldering small and mediumsized BGAs is done in a very short time.
1000 W
includes JT-2A
includes JT-2QA
Control unit JTE-2A Heater 1000 W Extractor stand with 5 extractors, 5 protectors and 2 tripods Heater stand Set of accessories
Control unit Stand Heater handle 1000 W No accessories
Temp. selection
°C
temp. room
room 450°C and "cool"
6-45 l/min
Yes
Total weight
8,7 kg
TE Hot Air Station 230V system/PART NO
TE-2A
22
description A precision hot air station ideal for soldering and desoldering small and medium-sized SMD components. Autonomus hot air station, digital, thermo regulated with air flox control.
includes TE-2A
includes TE-2Qa
Control unit JTE-2A Heater 300 W Heater stand JT-SA Accessories Extractor stand with 2 tripods, 3 extractros and 5 protectors
Control unit Stand Heater handle 300 W No accessories
Power max out
Temp. selection
variable air flow settings
total weight
300 W
room 450°C and "cool"
between 4 and 11 l/ min
6,7 kg
90-450 °C
Soldering and desoldering stations
HD Heavy Duty Station 230 V system/PART NO
description
nominal power
total peak power
sleep mode
hibernations mode
145 W
270 W
20 W
9W
90-500ºC
4,5 kg
temp. range
weight
Ideal solution for high thermal demand and prolonged heavy duty soldering applications. Specifically designed for extensive soldering of multi-layerd circuits and parts which require high remperatures.
HD-2A
temp. range
weight
includes Control unit HD-2A Handspiece T245-A Cartridge C470003 Stand AD-SA
AL Automatic Solder Feed Station 230 V system/PART NO
description
Ideal solution for extensive soldering application, and any soldering application that requires one or two free hands.
AL-2A
nominal power
total peak power
sleep mode
hibernations mode
Solder wire diamters
75 W
140 W
10 W
4W
0,5 - 1,5 mm
90-500ºC
3,2 kg
includes Control unit AL-2A Complete handle AL-A Cartridge C250403 Stand AL-SA Tubes set and guides for: wires ø 0,9 - 1 mm: 00024101
AL-IA Hands-free soldering arm for soldering iron AL product
Description
AL-IA
Part no
Indispensable for using the AL system while having both hands free. For this purpose it is also necessary to use the pedal set
0964551
AM Rework Station 230 V system/PART NO
AM-2A
description
nominal power
peak power
Designed for rework and repair of through-hole and SMT boards. The station´s 4 modules offer the following rework/repair operations: - Desoldering of SMD components of any size by hot air. - Desoldering SMT and through-hole components. - Pick & Place tip for placing components. - Soldering of any kind of components.
2 x 75 W
2 x 140 W
Air flow regulation
includes Control unit AM-2A T245 handpiece with cartridge C245003 DR-A desoldering iron with the C560-003 tip heater 1000W. MP 2260 Pick & Place Extractor stand with.5 extractors, 5 prtectors and 2 tripods. Stands for soldering iron, desoldering iron and heater. Set of accessories.
Phone: +45 70 10 64 00
6-45 l/min
Fax: +45 70 10 64 10
Vacuum pump for holding ICs
x
weight
8,1 kg
Power hot air unit
soldering iron temp range
desoldering iron temp range
hot air temp. range
900 W
90-450ºC
300-450ºC
150-450ºC
sleep mode
2 x 10 W
E-mail: info@oemklitso.dk
hibernations mode
2x6W
Homepage: www.oemklitso.dk 23
Soldering and desoldering stations
NAST Nano Station 230 V system/PART NO
NAST-2A
nominal power
description A complete station designed for micro soldering and desoldering of small-size components like chips 0201, 0402 etc.
15W
peak power
temp regulation
30W
weight
90-450 째C
2.6 kg
temp. selection
weight
includes Control unit NA-2A Nano soldering iron NT205-A Nano tweezers NP105-A Cartridge set (10 pcs)
DI-2A 1 Tool Control Unit system/PART NO
DI-2A
description 1-tool digital control unit features a digital read-out display for accurate temperature and tool control.
Nominal power
75 W
peak power
140 W
sleep power
10 W
hibernation power
4W
90-450 째C
2 kg
temp. selection
weight
for a complete station following is needed Control unit One tool with corresponding stand & cartridge
DD and DM 2- & 4- Tools digital Control Units description
nominal power
total peak power
DD-2A
2 tools control unit 230 V Offers connectivity for working with 2 tools simultaneously.. Designed for production and rework applications with high thermal requirements.
2 x 75W
2 x 140W
2 x 10W
2 x 4W
90-450 째C
3,5 kg
DM-2A
4 tools control unit 230 V Offers connectivity for working with 4 tools simultaneously.. Designed for production and rework applications with high thermal requirements.
4 x 75W
4 x 140W
4 x 10W
4 x 4W
90-450 째C
4,5 kg
system/PART NO
for a complete station following is needed Control unit From 1 to 4 tools with its corresponding stand & cartridge
24
sleep power
hibernations power
Soldering and desoldering stations
MS-A and MV-A Desoldering Suction Modules system/PART NO
description
power
supply
typical surface resistance
recommended air pressure
weight
MS-A
MS-A electric suction module Electric suction module with overdrive startup funtion that offers quick collection of solder before it cools down. This suction system is regulated by the control unit.
12 W
24 V
1015-1011
-
1,7 kg
MV-A
MV-A pneumatic suction module This pneumatic suction module uses compressed air and a Venturi valve. This system offers outstanding desoldering results because of its immediate suction responsiveness. This suction system is powered by compressed unit.
3W
24 V
1015-1011
5 Bar (max 6)
1,4 Kg
Cleaning of Tips Cleaning sand CL6780 Tip tinner TT-A For chemical cleaning and tinning the tip at the same time. Very efficient.
Stand
The most "aggressive" method to clean even the most oxidated tips.
Metal wool CL6205 Dry cleaning method, indispensable for lead-free soldering. Removes oxidation and facilitates tinning.
Metal brush CL6217 Cleans tips, tweezers and desoldering irons the same way as metal wood.
Stand accesory + sponge S7080
Dry cleaning system + Metal wool CL6760 Dry cleaning + sand CL6780
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
Homepage: www.oemklitso.dk 25
Stands and Tools
26
system/PART NO
for handpiece
includes
AD-SA
• T210-A • T245-A
• • • •
PA-SA
• For PA-A micro hot tweezers
• Sponge stand • Sleep mode
DR-SA
• For DR-A desoldering iron
• Brush and sponge stand • Sleep mode
AP-SA
• For AP-A solder feed iron
• Sponge stand • Sleep mode
HT-SA
• For HT-A hot tweezers
• Sponge stand • Sleep mode
AD-SA
• For AP-A solder feed iron
• Sponge stand • Sleep mode
HT-SA
• For HT-A hot tweezers
• Sponge stand • Sleep mode
DS-SA
• For DS-A micro desoldering iron
• Brush and sponge stand • Sleep mode
Dry cleaning module with metal wool 3 cartridges extractor magazine for C210 or C245 Quick cartridges change Sleep mode
tools
system/PART NO
descriptiion
NANO The smallest soldering tools available in the market
• NP-A
• Uses cartridges C105 • Perfect for soldering and desoldering very smal-sized chip components.
• NT-A
• Uses cartridges C105 • For high-precision soldering jobs
Handpiece
• T-210-A
• For precision applications • Used with C210 cartridges • Offers quick cartridge change
T245 Handpiece For general soldering jobs in electronics
• T-245
• Offers quick cartridge change
• T245-FA
• A screw in this handpiece allows fixation of cartridges, ideal for high-intensity jobs that do NOT require frequent change of cartriges.
T245 Comfort handpieces Same characteristics as T245. Neoprene grip, thermally isolating and giving more comfort to the user. Ideal for intensive soldering.
• T245-CA
• Quick cartridge change
• T245-TA
• Handpiece incorporates a screw that allows to fix the cartridges • Ideal for high intensity jobs where NO cartridge change is needed
• T245-SA
• A screw in this handpiece helps to securely fix the cartridge, ideal for extensive soldering jobs that do NOT require frequent cartridge changes. Supplied with a cable of 3 m lenght.
Tools and Cartridges
tools
system/PART NO
description
• PA-A
• • • • •
• HT-A
• Specially for soldering and desoldering small and medium-sized SMD components. A cable strip cartridge is also available. • Each cartrdge is individually controlled by the control unit, guaranteeing fast heating-up, accuracy and recovery of temperature. • Conntcted to JBC station DI, DD, DM AM and single line AP
• DS-A
• • • •
Adapts to the ever-decreasing size of new components. Very easy cleaning and maintenance. Tips are easily inserted by gentle pushing Contacted to JBC stations DS-2A, DV-2A, DI, DD, DM, AM and single line AP Supplied with tip C360-004
• DR
• • • •
Very easy cleaning and maintenance Two different types of solder residue chambers are available: metal and glass Tips are easily palced by thread Supplied with tip C560-003
• AP-A
• Offers a "third hand" by feeding soldering wire from diamters 0.8 to 1 mm. Specifically helpful for high-volume soldering jobs, and whenever an extra hand is needed. • Connected to JBC stations DI, DD, DM, AM and single line AP • Supplied wiht cartrigde C130-403
• SN5450
• Solder reels for AP-A • The soldering irons are fitted with lead free solder reel - 99% Sn/0.3% Ag/0.7 Cu - with 50g solder.
Microtweezers
Tweezers
Microdesoldering irons
Desoldering iron
Soldering wire feeding iron
Solder reels
Designed for soldering and desoldering SMD micro components Each cartridge is individually controlled by the control unit, guaranteeing fast heating-up, accuracy and recovery of temperature The available range of cartridge is made for desoldering a wide range of components. Connected to JBc stations, DI, DD, DM, AM and single line AP. Supplied without cartridges.
Cartridges
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
E-mail: info@oemklitso.dk
Homepage: www.oemklitso.dk 27
Cartridges
28
Work Environment
Work Environment 2010
The outline of your workplace is an important part in your work environment. It is not just about machines and premises. Access to good air, safe surroundings, beautiful interior constructions, ergonomic furniture and tools makes the work environment better.
Filter System
The world technical leader in air pollution systems Filtronic's business concept is to develop and manufacture mobile filter systems by creating a better workbench environment and protect individuals and products from hazardous gases and particles.
High Airflow Systems
Extract Arm Concept
30
CBC-Clean Bench Concept
High Vacuum Systems
Filter System
system
MG 75
MG 95
MG 100
MG 200
MG 400
description
High efficiency fume extraction with a wide range of filters depending on applications. It meets the demands for work in cleanroom. The MG75 is a filter unit with connection for one extraction arm. Remote control for High efficiency fume extraction with a wide range of filters depending on applications. It meets the demands for work in cleanroom. The MG95 is a filter unit with connection for one or two extraction arms. Remote control
max suction capacity m3/h
Blower capasity m3/h
sound level dB(A), at 1 m.
Microfiler separation degree DOP%
Gas filter-chemisorbtionseparation degree %
75
100
38-49
>99.97
>95
size (WHD)
100/250V
100 140
38-50
>99.97
weight
Voltage
100
100
remote control
power
>95
465mm 640mm 220mm
Yes
100
High efficiency fume extraction system with integrated pre filter and a combined particle and gas filter. Wide range of filters depending on application. Meets the demands for work in cleanroom. Remote control for
200
High efficiency fume extraction system with integrated pre filter and a combined particle and gas filter. Wide range of filters depending on application. Meets the demands for work in cleanroom. Remote control for
400
100W 140
<52
>99.97
>95
100/250V
300W 310
<55
>99.95
>95 115/230V
300W 450
>55
99.97
>95 115/230V
750-1000-ESD 750-1010-ESD
15 kg Accessory
465mm 640mm 220mm
Yes 950-1000-ESD 950-1010-ESD
18 kg
100/250V
Fume extraction system with high efficiency filter. Connection for one or two arms. The system can be set in variable speed and has an alarm
part no Pre filter
Accessory No
460mm 640mm 210mm
15 kg
400mm 1016mm 402mm
43 kg
100-1000-ESD 100-1032-ESD 100-1055-ESD
Accessory
Yes 200-1000-ESD Yes
796mm 1016mm 402mm
Yes 68 kg
450-1000-ESD Yes
Accessories System
description
technical data
Pre-filter
• A pre-filter for the high airflow systems MG 75, 95 and 100. • The pre filter is mounted on the filter system. • The filter media is of a “bag” type model with a high separation degree.
Pre filter bag active area 25 dm² Pre filter bag Class F8
PF-1200
Trolley
• Trolley for MG75 and MG95. An easy solution to get the filter system even more mobile. Arm brackets for the extraction arm is included
450 x 450 x 750 mm (WxDxH))
950-3202-EDS
Bench mounting set
• Bench mounting set for MG100. To be mounted on the edge of the workbench.
Remote control
• Remote control to MG units .
Connection hose
• Connection hose with quick-connection, aluminium covered Available from 1-5 meter length.
Phone: +45 70 10 64 00
Fax: +45 70 10 64 10
Part no
780-3001-ESD 700-3057
E-mail: info@oemklitso.dk
ø 65 mm (diameter)
On request
Homepage: www.oemklitso.dk 31
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