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LCD TV SERVICE MANUAL CHASSIS : LD91A
MODEL : 32LH4000
32LH4000-ZA
CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 TROUBLE SHOOTING ............................................................................14 BLOCK DIAGRAM...................................................................................17 EXPLODED VIEW .................................................................................. 18 SVC. SHEET ...............................................................................................
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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To Instrument's exposed METALLIC PARTS
0.15uF
Good Earth Ground such as WATER PIPE, CONDUIT etc.
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard
LGE Internal Use Only
SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
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LGE Internal Use Only
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Copyright Š2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
3. Test method
This specification is applied to the LCD TV used LD91A chassis.
2. Requirement for Test
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC:CE, IEC
Each part is tested as below without special appointment. 1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC 2) Relative Humidity : 65±10% 3) Power Voltage : Standard input voltage (100-240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.
4. Electrical specification 4.1 Module General Specification No
Item
Specification
1
Screen Device
32” wide color display module
2
Aspect Ratio
16:9
3
LCD Module
32” TFT LCD FHD
4
Storage Environment
Temp. : -20 ~ 60 deg
Remark LCD
LGD
Humidity : 10 ~ 90 % 5
Input Voltage
AC100-240V~, 50/60Hz
6
Power Consumption
Typ : 116.2, Max : 128.1
7
Module Size
760.0 (H) x 450.0 (V) x 48.0 (D)
8
Pixel Pitch
0.36375 mm(D)
9
Back Light
14EEFL
10
Display Colors
1.06Billion(FHD LGD),16.7M (others)
11
Coating
3H, AG
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
FHD
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LGE Internal Use Only
5. Chroma& Brightness 5.1 Module optical specification No. Item
Specification
Min.
Typ.
1.
Viewing Angle<CR>10>
Right/Left/Up/Down
178
2.
Luminance
Luminance (cd/m2)
400
500
3.
Contrast Ratio
CR
900
1300
4.
CIE Color Coordinates
White
Remark Degree
Variation
WX
0.279
WY
0.292
Xr
0.638
Yr
0.334
Green
Xg
0.291
Yg
0.607
Blue
Xb
0.145
Yb
0.062
RED
Max.
1.3
MAX /MIN
Typ ±0.03
1) Standard Test Condition (The unit has been ‘ON’) 2) Stable for approximately 30 minutes in a dark environment at 25±2°… 3) The values specified are at approximate distance 50Cm from the LCD surface 4) Ta=25±2°C, VLCD=12.0V, fV=60Hz, Dclk=74.25MHz VBR_A=1.65V,ExtVBR_B=100%
6. Component Video Input (Y, CB/PB, CR/PR) Specification
No Resolution
Remark
H-freq(kHz)
V-freq(Hz)
1.
720x480
15.73
60.00
SDTV,DVD 480i
2.
720x480
15.63
59.94
SDTV,DVD 480i
3.
720x480
31.47
59.94
480p
4.
720x480
31.50
60.00
480p
5.
720x576
15.625
50.00
SDTV,DVD 625 Line
6.
720x576
31.25
50.00
HDTV 576p
7.
1280x720
45.00
50.00
HDTV 720p
8.
1280x720
44.96
59.94
HDTV 720p
9.
1280x720
45.00
60.00
HDTV 720p
10.
1920x1080
31.25
50.00
HDTV 1080i
11.
1920x1080
33.75
60.00
HDTV 1080i
12.
1920x1080
33.72
59.94
HDTV 1080i
13.
1920x1080
56.250
50
HDTV 1080p
14.
1920x1080
67.5
60
HDTV 1080p
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
7. RGB (PC) Specification
No Resolution
Proposed
H-freq(kHz)
V-freq(Hz)
Pixel Clock(MHz)
1.
720*400
31.468
70.08
28.321
2.
640*480
31.469
59.94
25.17
Remark For only DOS mode Input 848*480 60Hz, 852*480 60Hz
VESA
-> 640*480 60Hz Display 3.
800*600
37.879
60.31
40.00
VESA
4.
1024*768
48.363
60.00
65.00
VESA(XGA)
5.
1280*768
47.78
59.87
79.5
WXGA
6.
1360*768
47.72
59.8
84.75
WXGA
7.
1366*768
47.56
59.6
84.75
WXGA
8.
1280*1024
63.595
60.0
108.875
SXGA
FHD model
9.
1600*1200
74.07
59.98
130.375
UXGA
FHD model
10.
1280*720
45
60
74.25
720P
DTV Standard
11.
1920*1080
66.647
59.988
138.625
WUXGA
FHD model
8. HDMI Input (PC/DTV) (1) DTV Mode No
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
1.
720*480
15.734 /15.6
59.94 /60
27.00
SDTV 480I
2.
720*480
31.469 /31.5
59.94 /60
27.00/27.03
SDTV 480P
3.
720*576
15.625
50
27(54)
SDTV 576I
4.
720*576
31.25
50
54
SDTV 576P
5.
1280*720
37.500
50
74.25
HDTV 720P
6.
1280*720
44.96 /45
59.94 /60
74.17/74.25
HDTV 720P
7.
1920*1080
33.72 /33.75
59.94 /60
74.17/74.25
HDTV 1080I
8.
1920*1080
28.125
50.00
74.25
HDTV 1080I
9.
1920*1080
26.97 /27
23.97 /24
74.17/74.25
HDTV 1080P
10.
1920*1080
33.716 /33.75
29.976 /30.00
74.25
HDTV 1080P
11.
1920*1080
56.250
50
148.5
HDTV 1080P
12.
1920*1080
67.43 /67.5
59.94 /60
148.35/148.50
HDTV 1080P
Remark
(2) PC Mode No
Resolution
H-freq(kHz)
V-freq.(Hz) 70.08
Pixel clock(MHz)
Proposed
720*400
31.468
2.
640*480
31.469
59.94
25.17
VESA
HDCP
3.
800*600
37.879
60.31
40.00
VESA
HDCP
4.
1024*768
48.363
60.00
65.00
VESA(XGA)
HDCP
5.
1280*768
47.78
59.87
79.5
WXGA
HDCP
6.
1360*768
47.72
59.8
84.75
WXGA
HDCP
7.
1366*768
47.56
59.6
84.75
WXGA
HDCP
8.
1280*1024
63.595
60.0
108.875
SXGA
HDCP
9.
1600*1200
74.07
59.98
130.375
UXGA
HDCP
10.
1920*1080
66.647
59.988
138.625
WUXGA
HDCP
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
28.321
Remark
1.
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HDCP
LGE Internal Use Only
ADJUSTMENT INSTRUCTION 4. Click “Connect” tab. If “Can’t” is displayed, check connection between computer, jig, and set.
1. Application Range This specification sheet is applied to all of the LCD TV with LD91A chassis.
(1)
(4)
2. Designation 1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing. 2) Power Adjustment: Free Voltage 3) Magnetic Field Condition: Nil. 4) Input signal Unit: Product Specification Standard 5) Reserve after operation: Above 5 Minutes (Heat Run) Temperature : at 25±5ºC Relative humidity : 65±10% Input voltage : 220V, 60Hz 6) Adjustment equipments: Color Analyzer (CA-210 or CA110), DDC Adjustment Jig equipment, SVC remote controller 7) Push The “IN STOP KEY” - For memory initialization.
Please Check the Speed : To use speed between from 200KHz to 400KHz
5. Click “Auto” tab and set as below 6. Click “Run”. 7. After downloading, check “OK” message. (5)
filexxx.bin
Case1 : Software version up 1. After downloading S/W by USB, TV set will reboot automatically 2. Push “In-stop” key 3. Push “Power on” key 4. Function inspection 5. After function inspection, Push “I n-stop” key. Case2 : Function check at the assembly line 1. When TV set is entering on the assembly line, Push “In-stop” key at first. 2. Push “Power on” key for turning it on. -> If you push “Power on” key, TV set will recover channel information by itself. 3. After function inspection, Push “In-stop” key.
(5)
(7) ……….OK (6)
* USB DOWNLOAD 1) Put the USB Stick to the USB socket 2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting 3) Show the message “Copying files from memory”
3. Main PCB check process * APC - After Manual-Insult, executing APC
* Boot file Download 1. Execute ISP program “Mstar ISP Utility” and then click “Config” tab. 2. Set as below, and then click “Auto Detect” and check “OK” message If “Error” is displayed, Check connection between computer, jig, and set. 3. Click “Read” tab, and then load download file (XXXX.bin) by clicking “Read” (3) fi lexxx.bin
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
4) Updating is staring.
3.1. ADC Process (1) ADC • Input signal : Component 480i • Signal equipment displays.
Adjustment pattern - Component 480I MODEL: 209 in Pattern Generator(480i Mode) PATTERN : 65 in Pattern Generator(MSPG-925 SERIES) • After enter Service Mode by pushing “ADJ” key, • Enter Internal ADC mode by pushing “G” key at “5. ADC Calibration”
5) Fishing the version uploading, you have to put USB stick and “AC Power” off. 6) After putting “AC Power” on and check updated version on your TV. * If downloading version is more high than your TV have, TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
<Caution> Using ‘power on’ button of the Adjustment R/C , power on TV. * ADC Calibration Protocol (RS232) Item Adjust ‘Mode In’ ADC Adjust
* After downloading, have to adjust Tool Option again. 1) Push "IN-START" key in service remote controller 2) Select “Tool Option 1” and Push “OK” button. 3) Punch in the number. (Each model hax their number) 4) Completed selecting Tool option. Model 32LH4000
Adjust Sequence • aa 00 00 [Enter Adjust Mode] • xb 00 40 [Component1 Input (480i)] • ad 00 10 [Adjust 480i Comp1] • xb 00 60 [RGB Input (1024*768)] • ad 00 10 [Adjust 1024*768 RGB] • aa 00 90 End Adjust mode * Required equipment : Adjustment R/C.
Tool option1 Tool option2 Tool option3 Tool option4 16640
2598
36260
CMD1 CMD2 Data0 A A 0 0 When transfer the ‘Mode In’, Carry the command. A D 1 0 Automatically adjustment (The use of a internal pattern)
3584
3.2 Function Check (1) Check display and sound · Check Input and Signal items. (cf. work instructions) 1. TV 2. AV (SCART1/SCART2/ CVBS) 3. COMPONENT (480i) 4. RGB (PC : 1024 x 768 @ 60hz) 5. HDMI 6. PC Audio In * Display and Sound check is executed by Remote controller. Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
* Manual W/B process using adjusts Remote control.
4. Total Assembly line process
• After enter Service Mode by pushing “ADJ” key, • Enter White Balance by pushing “ G ” key at “3. White Balance”.
4.1. Adjustment Preparation · W/B Equipment condition CA210 : CH 9, Test signal : Inner pattern (85IRE) · Above 5 minutes H/run in the inner pattern. (“power on” key of adjust remote control) Cool
11,000k
Medium 9,300k Warm
6,500k
ºK ºK ºK
X=0.276(±0.002) Y=0.283(±0.002)
<Test Signal>
X=0.285(±0.002)
Inner pattern
Y=0.293(±0.002)
(216gray,85IRE)
X=0.313(±0.002) Y=0.329(±0.002)
* Connecting picture of the measuring instrument (On Automatic control) Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER ON -> Enter the mode of White-Balance, the pattern will come out
Full White Pattern
CA-210
* After done all adjustments, Press “In-start” button and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model. * Push The “IN STOP KEY” after completing the function inspection.
4.2. DDC EDID Write (RGB 128Byte )
COLOR ANALYZER TYPE: CA-210
• Connect D-sub Signal Cable to D-sub Jack. • Write EDID Data to EEPROM(24C02) by using DDC2B protocol. • Check whether written EDID data is correct or not. * For SVC main Ass’y, EDID have to be downloaded to Insert Process in advance.
RS-232C Communication
* Auto-control interface and directions 1) Adjust in the place where the influx of light like floodlight around is blocked. (illumination is less than 10ux). 2) Adhere closely the Color Analyzer (CA210) to the module less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°). 3) Aging time - After aging start, keep the power on (no suspension of power supply) and heat-run over 15minutes. - Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
4.3. DDC EDID Write (HDMI 256Byte) • Connect HDMI Signal Cable to HDMI Jack. • Write EDID Data to EEPROM(24C02) by using DDC2B protocol. • Check whether written EDID data is correct or not. * For SVC main Ass’y, EDID have to be downloaded to Insert Process in advance.
4.4. EDID DATA
• Auto adjustment Map(RS-232C) RS-232C COMMAND MIN
CENTER
[CMD ID DATA]
MAX
(DEFAULT)
Cool
Mid
Warm
R Gain
jg
Ja
jd
G Gain
jh
Jb
je
00
172
192
192
255
B Gain
ji
Jc
jf
00
192
192
172
255
R Cut
64
64
64
128
G Cut
64
64
64
128
B Cut
64
64
64
128
00
Cool
Mid
Warm
172
192
192
1) All Data : HEXA Value 2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum
255
** Caution ** Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module) Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
1) Analog Data 128Byte (2Bi)
- Auto Download • After enter Service Mode by pushing “ADJ” key, • Enter EDID D/L mode. • Enter “START” by pushing “OK” key.
a
b
c
d e
d
2) DIGITAL DATA(HDMI-1/2/3/4) 256Byte a
b
c
d e
d
* Edid data and Model option download (RS232) Item Download
CMD1 CMD2 Data0 A
A
0
‘Mode In’ Download
f f
0 When transfer the ‘Mode In’, Carry the command.
A
E
00 10 Automatically Download (The use of a internal pattern)
- Manual Download * Caution 1) Use the proper signal cable for EDID Download - Analog EDID : Pin3 exists - Digital EDID : Pin3 exists - Never connect HDMI & D-sub Cable at the same time. - Use the proper cables below for EDID Writing - Download HDMI1, HDMI2, separately because HDMI1 is different from HDMI3 For Analog EDID D-sub to D-sub
* Detail EDID Options are below ⓐ Product ID Model Name
HEX
EDID Table
DDC Function
FHD Model
0001
01 00
Analog/Digital
HD Model
0000
00 00
Analog/Digital
ⓑ Serial No: Controlled on production line. ⓒ Month, Year: Controlled on production line: ex) Monthly : ‘09’ -> ‘09’ Year : ‘2006’ -> ‘10’
For HDMI EDID DVI-D to HDMI or HDMI to HDMI
ⓔ Model Name(Hex):
No. 1 2 3
Item ManufacturerID Version Revision
Condition GSM Digital : 1 Digital : 3
Hex Data 1E6D 01 03
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
MODEL
MODEL NAME(HEX)
all
00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
ⓕ Checksum: Changeable by total EDID data. ⓖ Vendor Specific(HDMI)
- 12 -
INPUT
MODEL NAME(HEX)
HDMI1
67030C001000B82D
HDMI2
67030C002000B82D
HDMI3
67030C003000B82D
LGE Internal Use Only
4.5. V-COM Adjust(Only 37/42/47LH4000-ZA)
5. Serial number D/L
- Why need Vcom adjustment? A The Vcom (Common Voltage) is a Reference Voltage of Liquid Crystal Driving. -> Liquid Crystal need for Polarity Change with every frame.
• press “Power on” key of service remocon. (Baud rate : 115200 bps) • Connect RS232 Signal Cable to RS-232 Jack. • Write Serial number by use RS-232. • Must check the serial number at the Diagnostics of SET UP menu. (Refer to below).
Circuit Block Ga mma Re f e r e nce V o ltage
Data (R ,G,B ) & Cont rol si gnal
Da t a I n p u t
Y S
In t e r f a ce
S
Ti m i n g Co nt r o ll e r
Data (R ,G,B ) & C ont ro l s ignal
So urce D r i v e I C
Power Po w e rInput I nput
M
Po w e r Blo ck
V COM
Gat e Driv e IC
T E
Gamm a Reference Volta ge
Cont rol si gnal
Column Line
Pane l
V COM CLC
CST Liquid Crys tal
Row Li ne TFT
V COM
5.1. Signal TABLE CMD
- Adjust sequence · After enter Service Mode by pushing “ADJ” key. · Enter V-Com Adjust mode by pushing “G” key at “10. VCom” · As pushing the right or the left button on the remote controller, Find the V-COM value that is stopped the Flicker. · If there is no flicker at default value, turn down or turn up at least 20 step and check the flicker. Then go to the default value.
LENGTH
ADH
ADL
DATA_1
...
Data_n
CS
DELAY
CMD : A0h LENGTH : 85~94h (1~16 bytes) ADH : EEPROM Sub Address high (00~1F) ADL : EEPROM Sub Address low (00~FF) Data : Write data CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n Delay : 20ms
5.2. Command Set No. 1
Adjust mode EEPROM WRITE
CMD(hex) A0h
LENGTH(hex)
Description
84h+n
n-bytes Write (n = 1~16)
* Description FOS Default write : <7mode data> write Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0, Phase Data write : Model Name and Serial Number write in EEPROM,.
5.3. method & notice
(Visual Adjust and control the Voltage level)
· Push the store button by “OK” key in the ADJ remocon.
4.6. Outgoing condition Configuration - When pressing IN-STOP key by SVC remocon, Red LED are blinked alternatively. And then Automatically turn off. (Must not AC power OFF during blinking)
A. Serial number D/L is using of scan equipment. B. Setting of scan equipment operated by Manufacturing Technology Group. C. Serial number D/L must be conformed when it is produced in production line, because serial number D/L is mandatory by D-book 4.0.
4.7. Internal pressure Confirm whether is normal or not when between power board's ac block and GND is impacted on 1.5kV(dc) or 2.2kV(dc) for one second
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 -
LGE Internal Use Only
TROUBLESHOOTING 1. TV/CATV doesn’t display Check TU1200. Can you see the normal signal?
Could you measure voltage of TU1200 & IIC lines? Are they all normal?
NO
NO
You should check power line & IIC lines.
YES YES
You should replace Main Board.
Check the output of TR(Q1201). Can you see the normal waveform?
NO
You should decide to replace TR (Q1201) or not.
YES
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?
NO
After checking the Power of Main IC(IC100) you should decide to replace Main IC or not.
YES
This board has big problem because Main IC(IC100) have some troubles. After checking thoroughly all path once again, You should decide to replace Main Board or not.
2. DTV doesn’t display Check the output data of TU1200 Pin 4,21,22. Can you see the normal signal?
NO
Could you measure voltage of TU1200 & IIC lines? Are they all normal?
NO
You should check power line & IIC lines.
YES
You should replace Main Board. YES
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?
NO
After checking the Power of Main IC(IC100) you should decide to replace Main IC or not.
YES
This board has big problem because Main IC(IC100) have some troubles. After checking thoroughly all path once again, You should decide to replace Main Board or not.
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
LGE Internal Use Only
3. AV 1/2 doesn’t display Check JK1100, JK1101 Can you see the normal waveform?
NO
JK1100, JK1101 may have problem. Replace this Jack.
YES
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?
NO
After checking the Power of Main IC(IC100) you should decide to replace Main IC or not.
YES
This board has big problem because Main IC(IC100) have some troubles. After checking thoroughly all path once again, You should decide to replace Main Board or not.
4. Component doesn’t display Check JK400 Can you see the normal waveform?
NO
JK400 may have problem. Replace this Jack.
YES
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?
NO
After checking the Power of Main IC(IC100) you should decide to replace Main IC or not.
YES
This board has big problem because Main IC(IC100) have some troubles. After checking thoroughly all path once again, You should decide to replace Main Board or not.
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
LGE Internal Use Only
5. RGB PC doesn’t display Check P400 , Can you see the normal waveform?
NO
P400 may have problem. Replace this Jack.
YES
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?
NO
After checking the Power of Main IC(IC100) you should decide to replace Main IC or not.
YES
This board has big problem because Main IC(IC100) have some troubles. After checking thoroughly all path once again, You should decide to replace Main Board or not.
6. HDMI doesn’t display Check input connect JK600, JK601, JK602 Can you see the normal waveform?
NO
JK600, JK601, JK602 may have problem. Replace this Jack.
YES NO
Check DDC communication lines(IC100, IC107) YES
After checking the Power of this chip, you should decide to replace this or not.
NO
After checking the Power of this chip, you should decide to replace this or not.
Check HDCP communication lines(IC107) YES
Check the output of Main IC(IC100). Especially you should check The H,V sync and clock. Can you see the normal waveform?
NO
After checking the Power of Main IC(IC100) you should decide to replace Main IC or not.
YES
This board has big problem because Main IC(IC100) have some troubles. After checking thoroughly all path once again, You should decide to replace Main Board or not.
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
LGE Internal Use Only
Tun er (TDFW-G235D) TU1200
Copyright ©2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
SPDIF
RS-232C
Head Phon e
SC1/2_L/R_IN, FE_AM_AUDIO,AV_L/R_IN, COMP_L/R_IN, PC_L/R_IN
RGB
COMPONENT
AV3
MAX3232CDR IC403
FE_VMAIN
PCM_A[0:7]
SPDIF_OUT
DGB_TX/RX
TPA6110A IC700
AUDIO IN
HP_L/ROUT
DSUB_H/VSYNC
DSUB_ R/G/B
COMP_Y/Pb/Pr
AV_CVBS_IN
SC2_CVBS_IN
DTV/MNT_VOUT
SC1_R/G/B
FE_ VOUT SC1_CVBS_IN
CI_ADDR[0:7]
PCM_D[0:7] ∆ CI_DATA[0:7] 74LCX244 Buffer IC501
H-SCART
F-SCART
74LVC541A Buffer IC502
FE_TS_DATA[0:7] ∆ CI_MDI[0:7]
CI_TS_DATA[0:7]
BUF_TS_CLK/ERR/SYN/DATA[0]
(IC100)
LGE3368A
Mstar S6
TMDS[0:7] ( Data, Clock (+/-))
5V_HDMI_1/2/3
L/R
LCD Panel
HDMI 1/2/3
EEPROM M24512-WMW6 (IC105) EEPROM CAT24WC08W-T (HDCP)IC107
Serial Flash IC103 For Boot
MP6205DH USB Power IC402
NAND Flash HYNIX IC102
DDR2 SDRAM (512Mb) IC301
Digital amp (NTP3100L) IC701
HPD1/2/3, HDMI_CEC
USB_DM/DP USB
I2S
I2C
PCM_A[0:7]
TDDR_A[0:12]
TDDR_D[0:15]
SDDR_A[0:12]
DDR2 SDRAM (1Gb) IC300
USB Power
KIA7427 (IC101) Voltage Detector
SDDR_D[0:15]
Reset
LVDS (10 bit)
BLOCK DIAGRAM
CI Slot (P500)
LGE Internal Use Only
EXPLODED VIEW IMPORTANT SAFETY NOTICE
900 310
300
500
122
121
510
120
200
A2
802
LV1
803
550
801
804
806
530
805
540
A10
521
400
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 18 -
LGE Internal Use Only
/F_RB
/PF_OE
0
OPT
0
R151
R1509
0
R102
B
+3.3V
Q101 KRC103S OPT
OPT
0
R101
E
C
B
+3.3V
/PF_WE
PF_ALE
/PF_CE1
SPI_DO
SPI_CS
1
8
7:F13;11:AG9
7:F12;11:AG10
11:Q8
11:J8
10:I12
10:I12
WP
DO
4
3
2
1
22
+5V_GENERAL
22
R171
C114 0.1uF
$0.76
R161
+3.3V
4.7K
C103 0.1uF
SPI_DI
SPI_CK
26~32 R1527 1K 1%
R1529 1.8K 37~47
37~47 R1528 2.7K 1%
+12V/+15V
I
FRC/LVDS_B
2
G
KIA7042AF 1 3
O
R1543 10K
+3.3V
0.1uF
4
3
2
1
$0.418
8
5
6
7
SDA
SCL
WC
VCC
C1501 2.2uF OPT
PWM0
7:G25;7:R15;9:AI24;9:AI25
GND
LED_ON/LED_R
E16;E20;T19
E16;E19;T19
C3
A7
D6
D7
C4
D6
C4
2 R115 10K
/F_RB
PF_WP
PF_ALE
/PF_WE
/PF_OE
/PF_CE1
/PF_CE0
OUT
SCL0
SDA0
EEPROM_SDA
EEPROM_SCL
22
AR101
R1500 1K OPT
R199 1K OPT
PWM1
SDA1 SCL1
SDA0 SCL0
SDA0 SCL0
POWER_DET
AK12
AK12
T21;Y14
T21;Y14
T21;Y14
T21;Y14
EEPROM_SDA E16;E20;Y14 EEPROM_SCL E16;E19;Y13
R1501 1K
R198 1K PWM_DIM
/FE_RESET
FE_AGC_SPEED_CTL
MEMC_RESET
100
R1611
R1601
R1604 3.3K HD
100
100
FRC/LVDS_B
R1600
R1603 3.3K FHD
100
R1544
MODEL OPTION
100
R1545
R1606 3.3K LED_MOVING
R1608 3.3K
NO_FRC/LVDS_A
R1607 3.3K
FRC/LVDS_B R1605 3.3K LED_NORMAL
+3.3V
PWM2
R1610 OPT
R1609 3.3K
MODEL_OPT_3
MODEL_OPT_2
MODEL_OPT_1
MODEL_OPT_0
SB_MUTE
9:AI24
100
MODEL_OPT_3
MODEL_OPT_2
MODEL_OPT_1
MODEL_OPT_0
PIN NAME
R1550
11:AE17
DBG_TX
DBG_RX
ISP_RXD
C1500 1uF OPT
E19;T19;Y13
C101 0.022uF 16V
10uF
IC101
6.3V
KIA7427F VCC 1 3
C102
+3.3V_ST
ISP_TXD A_DIM
22
EEPROM_SCL EEPROM_SDA E20;T19;Y14
VOLTAGE DETECTOR
*Mstar reset:Active high reset
+3.3V
PWM0
R113
DIMMING
C108 8pF OPT
22
0IMMRMP008A(MICROCHIP)
R110
C100 0.1uF
+3.3V
IC105: EAN43352801(ATMEL SHRINK)
PCM_A[0-7]
10 : BOOT 51 11 : BOOT RISC
MCU BOOT STRAP
R100 0 VSS
E2
E1
E0
IC105 M24512-WMW6
EEPROM
NC_16
NC_17
NC_18
C107 8pF OPT
PCM_A[0]
I/O0
22
PCM_A[1]
NC_19
PCM_A[2]
PCM_A[3]
I/O1
AR103
C106
I/O2
I/O3
NC_20
NC_21
NC_22
VSS_2
VCC_2
PRE
NC_23
NC_24
PCM_A[4]
PCM_A[5]
I/O5
22
PCM_A[6]
I/O4
PCM_A[7]
I/O6
AR102
C105 10uF 6.3V
I/O7
NC_25
NC_26
NC_27
NC_28
+3.3V_ST
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R1508 1.8K 19~22
3.6K
19~32 R1521
+24V/+15V
0
0
0
R128
R129
SDA_SUB/AMP
SCL_SUB/AMP
R131
0
MEMC_SCL
0
R123
0
R130
MEMC_SDA
R122
IC1500
+3.3V
EEPROM_SDA E16;T19;Y14
E16;T19;Y13 EEPROM_SCL
FE_DEMOD_SDA
FRC/LVDS_B
1386 WON
IC102 HY27US08121B-TPCB
Addr:10101--
DIO
CLK
HOLD
VCC
+3.3V_TUNER
5
6
7
8
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
+3.3V
NC_15
NC_14
NC_13
NC_12
NC_11
WP
WE
ALE
CLE
NC_10
NC_9
VSS_1
VCC_1
NC_8
NC_7
CE
RE
R/B
NC_6
NC_5
NC_4
NC_3
IC103 W25X32VSSIG
OPT
FE_DEMOD_SCL
FE_TUNER_SCL
R109
AI13;10:I9
SDA
SCL
WP
FE_TUNER_SDA
5
VCC
33
R1530
CS
GND
Q100 KRC103S OPT
+3.3V
E
C
AI13;10:I9
6
A2 3
VSS 4
A1 $0.199 2 7
A0
IC107 CAT24WC08W-T
POWER DETECT
I2C
R158 4.7K
HDCP EEPROM
Flash_WP_1
Serial FLASH MEMORY for BOOT
PF_WP
R104 10K
10K
R1533 4.7K
3.9K
R111
NC_2
4.7K
1K
R1540
1K
R112
R1505 4.7K
R103
R105 OPT 1K
R1539 1K
R1504 4.7K
R107 470
NC_1
R1503 2.2K
/PF_CE0
R1506 1.2K
L102
+3.3V
R1502 2.2K
D7
KEY2
PCM_D[7]
33
R1516
OPT
J2
AD12
B9
E11
B9(FHD) B9(HD)
D6
PIN NO.
FHD
LED_NORMAL
FRC LVDS_B
LCD
HIGH
MODEL OPTION
DSUB_DET
MODEL_OPT_0 COMP_DET
100 0 100 100
R166 R126 R148 R147
LOW PDP
HD
LED_MOVING
NO_FRC LVDS_A
C5
D5
D6
E10
E8
E11
D7
D9 D10 0
100
0 100 R160
R168
R189
100
MODEL_OPT_2 8:C6 ERROR_OUT 7:R15 NTP_MUTE
R157
AC11
C4
E4
F4
B4
A4
AA13
R156
0
100
SCART2_MUTE
R146
R150
AB12
AB13
V5
W5
J1
22
22
R143
22
AC21
0
22
AB21
0
R142
F8 D11
AB11
Y14
AC9
AA11
AA12
AF6
AE6
T4
W4
AA5
0
33
33
AC7
AC8
AA10
AB15
Y5
AB18
AA14
AD6
AA7
AB9
Y4
V4
AA4
AB5
AA9
AC13
AB8
AC12
AB14
AC14
AC15
AB16
0
R1519
R1518
33
33
R1515 R1517
33
33
R1514
33
33
R1513
R1511 R1512
33
R1510
PCM_A[14]
PCM_A[13]
PCM_A[12]
PCM_A[11]
PCM_A[10]
PCM_A[9]
PCM_A[8]
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
Y13
R140 R141
R164 R165
R162 R163
Y11 Y12
Y10
AC6
AA16
AA15
AC16
D4
PCM_D[5] PCM_D[6]
IC100
GPIO_PM3/GPIO137
SAR3
GPIO102
GPIO103/I2S_OUT_SD3
GPIO99
GPIO98
GPIO97
GPIO91
GPIO90/I2S_OUT_MUTE
GPIO88
GPIO96
GPIO44
IRIN
GPIO68
GPIO67
ET_COL
ET_MDIO
ET_MDC
ET_TX_EN
ET_RXD1
ET_RXD0 SAR2
ET_TX_CLK SAR1
ET_TXD1
ET_TXD0
TS1_CLK
TS1_VLD
TS1_SYNC
TS1_D0
TS0_CLK
TS0_VLD
TS0_SYNC
TS0_D7
TS0_D6
TS0_D5
TS0_D4
TS0_D3
TS0_D2
TS0_D1
TS0_D0
GPIO43/PCM2_IRQA_N
GPIO42/PCM2_CE_N
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/GPIO85
UART2_RX/GPIO84
GPIO79/LVSYNC2/TX1
LVSYNC/GPIO133
LHSYNC2/I2S_OUT_MUTE/RX1
GPIO62/PCM2_CD_N/TX1
GPIO60/PCM2_RESET/RX1
GPIO132/LHSYNC/SPI_WPn
GPIO130/LCK
GPIO131/LDE/SPI_WPn1
GPIO_PM6/INT2/GPIO140
GPIO_PM5/INT1/GPIO139
SAR0
PWM3
PWM2
PWM1
PWM0
UART_TX2
UART_RX2
DDCA_DA
DDCA_CLK
DDCR_CK
DDCR_DA
UART2_RX/SDAM
UART2_TX/SCKM
F_RBZ
PF_AD15
PF_ALE
/PF_WE
/PF_OE
/PF_CE1
/PF_CE0
/PCM_CE
PCM_IOR/CI_RD
PCM_IOWR/CI_WR
/PCM_WE
/PCM_IRQA
GPIO_PM4/GPIO138
PCM_REG/CI_CLK PCM_WAIT/CI_WACK
GPIO_PM2/GPIO136
GPIO_PM1/GPIO135
PCM_CD/CI_CD /PCM_OE
GPIO_PM0/GPIO134
PCM_RST/CI_RST
PCM_A14/CI_A14
PCM_A13/CI_A13
PCM_A12/CI_A12
PCM_A11/CI_A11
PCM_A10/CI_A10
PCM_A9/CI_A9
PCM_A8/CI_A8
USB_DP_2
USB_DM_2
PCM_A6/CI_A6 PCM_A7/CI_A7
USB_DM_1
USB_DP_1
PCM_A5/CI_A5
PCM_A4/CI_A4
PCM_A3/CI_A3
PCM_A2/CI_A2
PCM_A1/CI_A1
PCM_A0/CI_A0
SPI_CK
SPI_DO /SPI_CS
PCMD7/CI_D7
PCMD6/CI_D6
SPI_DI
TESTPIN/GND
XOUT
XIN
PCMD5/CI_D5
PCMD4/CI_D4
PCMD3/CI_D3
PCMD2/CI_D2
PCMD1/CI_D1
PCMD0/CI_D0
HWRESET
LGE3368A (Saturn6 No-DivX)
PCM_D[4]
PCM_D[3]
PCM_D[2]
PCM_D[1]
PCM_D[0]
PCM_A[0]
R116
AMP_RST 7:F6 MODEL_OPT_1
11:X16;11:AD14
IR
KEY1
11:Y9
22
/PCM_CE
/PCM_IORD
/PCM_WE /PCM_IOWR
/PCM_IRQA
11:Y10
PWM2
PWM1
PWM0
AR100
/PCM_OE /PCM_REG
PCM_RST /PCM_CD
0
/PCM_WAIT
PCM_A[0-14]
PCM_D[0-7] B3
R175 R178 R179
AB10
G6
R1535
R1537 R1534 R1538
AC18 C6
0
0
0
0
100
0
0
100 100
22 100
22
22
22
CI_TS_DATA[6] CI_TS_DATA[7]
CI_TS_DATA[4]
100
B8
A7
A11
B9
A10
B10
R192 R155
R153
R191
R190
100
100
100
100
100
100
100 R177 C11 C9
R183
R154 B11 A9
C10
AA19
AC19
AA20
AB19
AB4
AD5
AC4
CI_TS_DATA[5]
CI_TS_DATA[3]
AC5
AA6 U4
AB7 AB6
CI_TS_DATA[2]
CI_TS_DATA[1] Y9
CI_TS_DATA[0] Y8
+3.3V_ST
SPI_CK
SPI_CS
SPI_DI G12 SPI_DO
SCL1
SCART2_DET SC_RE2
5:D10
USB_CTL 4:AL4 SCART1_MUTE 9:AI25
SCART1_DET
MODEL_OPT_3
BIT_SEL
SC_RE1 SIDE_HP_MUTE HP_DET EDID_WP
9:N24 7:G26
R1523
100
R187 OPT 100
6:AI16;6:AL7;6:AL12
9:AI24
100
R182 OPT100
ISP_TXD
POWER_DET
POWER_DET
DBG_TX
SIDE_USB_DM 4:AJ6 SIDE_USB_DP 4:AJ5 SIDE_USB
REAR_USB_DM4:AJ5
REAR_USB REAR_USB_DP4:AJ6
CI_TS_DATA[0-7]
11:N20
9:N25
FE_TUNER_SDA
OPC_EN
FE_TUNER_SCL
5:D10
5:V22
8:M10 8:Q8 POWER_ON/OFF1 8:P5 DBG_RX
PANEL_CTL
INV_CTL
8:B11 WARM_LED_ON/LED_W R1520
5:D10
T22
5:V22 BUF_TS_VAL_ERR 5:V21 BUF_TS_CLK 5:V21
BUF_TS_SYN
BUF_TS_DATA[0]
CI_TS_CLK
CI_TS_VAL
4:M4
5:D24
CI_TS_SYN
AV_CVBS_DET
5V_HDMI_2 PCM_5V_CTL
5V_HDMI_1
4:AG3
R197 15K OPT
PM GPIO Assignment Recommended by MStar
R196 15K OPT
10:AA4 FE_BOOSTER_CTL 10:AA4 Flash_WP_1 A11 SDA1 T22
LVDS_SEL
USB_OCD
R152 4.7K OPT
20pF
C112
20pF
080923_Time Delay X100 C111 12MHz
R133 15K OPT
+3.3V
V4
R193 1M
100
100
100
R132 15K OPT
33
33
33
100
0
0
AA8
AF10
R127
R170
B6 AF5
R169
A6
F10
F9
E7
R1536
R159
R167
R188
AA18 AA17
AF11
AB17
AC17
H6
R186
R185
H5 F6
R184
G5
F5
E5
R174
A5 AC10
R1526
B5
R1525
AE12
R1524
R173
R172
AD11
AF12
AE11
E6
A3
10K
/PF_CE0 H : Serial Flash L : NAND Flash /PF_CE1 H : 16 bit L : 8 bit
R1507 1.2K
0.1uF C104
R124
- 27 4.7K
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes R125
R195
NAND FLASH MEMORY
SCHEMATIC DIAGRAM MAIN 1
LGE Internal Use Only
6:K8
6:K9
D2+_HDMI2
D2-_HDMI2
6:K22
D1-_HDMI2
D0-_HDMI2 D1+_HDMI2
D0+_HDMI2
CK-_HDMI2
CK+_HDMI2
HPD1
DDC_SCL_1
DDC_SDA_1
D2-_HDMI1
D2+_HDMI1
D1-_HDMI1
D0-_HDMI1 D1+_HDMI1
D0+_HDMI1
CK-_HDMI1
CK+_HDMI1
6:K22
6:K21
6:K21
6:K20
6:K21
6:K19
6:K20
6:J6
6:K7;6:AL9
6:K7;6:AL9
6:K11
6:K12
6:K10
6:K11
6:K9
6:K10
HDMI
FE_VSCART_OUT
DTV/MNT_VOUT
FE_VMAIN
AV_CVBS_IN
SC2_CVBS_IN
SC1_CVBS_IN
9:P8
COMP_Pb
COMP_Y
COMP_Pr
DSUB_B
DSUB_G
DSUB_R
DSUB_VSYNC
DSUB_HSYNC
SC1_CVBS_IN
SC1_B
SC1_G
SC1_R
SC1_FB
SC1_ID
HDMI_CEC
HPD3
DDC_SCL_3
DDC_SDA_3
D2-_HDMI3
D2+_HDMI3
D1-_HDMI3
D0-_HDMI3 D1+_HDMI3
SC2_ID
0 100
100
R249
R204
47
47 47
470
47
47 47
R211
R212
R214
R215
R216
47
47 47 470
47 47
47 470
100
47
47
47
47
47
47
100 100
R219
R222
R224
R284
R205
R206
R226
R227
R235
R236
R228
R209
R225
R223
R221
R220
R218
R244 10K
R217
R213
47
R210
R200
0
R248
0.047uF
0.047uF
C222
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
1000pF
0.047uF 0.047uF
0.047uF
1000pF
0.047uF 0.047uF
22 0.047uF
22
0.047uF 0.047uF
0.047uF
C221
C2019
C2024
C218
C217
C211
C210
C209
C216
C214 C215
C208
C213
C212 C207
R245
R246
C206
C205
C203 C204
1000pF
0.047uF 0.047uF
C201
C202
0.047uF
C200
RIN1P/DSUB_R
VSYNC2
VCOM1
Y2 CVBSOUT0/SC2_MNTOUT AA2 CVBSOUT1
W1 CVBS0/RF_CVBS Y3 VCOM0
N3 CVBS5 M3 CVBS7
M1 CVBS4/S-VIDEO_Y M2 CVBS6/S-VIDEO_C
T2
U3 CVBS1/SC1_CVBS U2 CVBS2/SC2_CVBS T1 CVBS3/SIDE_CVBS
J5
U1 BIN2P/COMP_PB+ V3 SOGIN2
V1 RIN2P/COMP_PR+ V2 GIN2P/COMP_Y+
GIN1P/DSUB_G K1 BIN1P/DSUB_B L2 SOGIN1
L3
L1
K3 HSYNC1/DSUB_HSYNC K2 VSYNC1/DSUB_VSYNC
BINM R2 GINM
T3
P3 SOGIN0/SC1_CVBS P1 RINM
R3 GIN0P/SC1_G R1 BIN0P/SC1_B
N2 HSYNC0/SC1_ID N1 VSYNC0/SC1_FB P2 RIN0P/SC1_R
AD7 HOTPLUG_C J3 CEC
AE7 DDCD_C_DA AF7 DDCD_C_CK
AE10 RXC2P AD10 RXC2N
AF9 RXC1P AE9 RXC1N
AD9 RXC0P AF8 RXC0N
CK-_HDMI3
D0+_HDMI3
E2 HOTPLUG_B
D1 RXB2N E1 DDCD_B_DA F3 DDCD_B_CK
D3 RXB1N E3 RXB2P
CK+_HDMI3
R243 10K
0 100
R202
R203
0
R201
C1 RXB0P C2 RXB0N D2 RXB1P
C3 RXBCKP B1 RXBCKN
B2 DDCD_A_CK A2 HOTPLUG_A
H2 RXA2N A1 DDCD_A_DA
G1 RXA1N H1 RXA2P
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
9:AL4
10:AA8
4:M2
9:AE2
E17;9:O4
4:K12
4:K11
4:K13
4:C23
4:C24
4:C26
4:C22
4:C22
E21;9:O4
9:J9
9:J8
9:J6
9:O6
9:P8
6:AM25
6:W11
6:X13;6:AL13
6:X13;6:AL14
6:X17
6:X17
6:X16
6:X16
6:X15
6:X15
6:X14
6:X15
0 100
R208
R247
0
R207
RXACKN
RXACKP
G2 RXA0P G3 RXA0N H3 RXA1P
F2
F1
AE8 RXCCKP AD8 RXCCKN
HPD2
DDC_SCL_2
6:K18;6:AL18
6:J16
DDC_SDA_2
6:K18;6:AL19
SCART_RGB
DSUB
COMP
CVBS
LVA0P
OPT
100
R264 R265
R262 R263
R283
R282
R281
R280
R279
R278
R277
R276
R260 R261
R258 R259
R275
R273
R272
R271
R270
R269
R268
R267
C2007 C2008
AF3
AE3 AUR2 AUL2 AE2 AA1 AUR3 AB1 AUL3 AB2 AUR4 AC2 AUL4 AB3 AUR5 AC3 AUL5
AUR1
AUVAG
AUVRP
AUVRM
AUCOM
REXT
REFM
REFP
VCLAMP
I2S_IN_SD
I2S_OUT_SD
I2S_OUT_BCK
I2S_OUT_WS
I2S_OUT_MCK
AUOUTL2/SC2_LOUT
AUOUTR2/SC2_ROUT
AUOUTL1/SC1_LOUT
AUOUTR1/SC1_ROUT
AUOUTL0/HP_LOUT
AUOUTR0/HP_ROUT
SPDIF_OUT
SPDIF_IN
SIF0M
SIF0P
AUL1
2.2uF 2.2uF
C2013
C232
R240 R250
AD1 AC1
390
0.1uF
1uF 4.7uF
C226 C227
Close to IC as close as possible
C228
0.1uF
C225
10uF 6.3V
C234
C235
22
22
22
22
100
100
100
100
100
100
100
100
0.1uF
0.1uF
2.2uF
2.2uF
C233
AD4
C224
1% +3.3V Check
R229
AF4
AE4
AE5
G4
J4
H4
K4
0.1uF
R234
D8
0.1uF
R233
C7
C223
R232
B7
C8
R231
A8
R251
R239
AD3
AD2
R237 R238
AF1
R230
AF2
E9
R266
W2
F11
C231
W3
C2016
C2015
2.2uF
C2012 C2014
2.2uF 2.2uF
2.2uF 2.2uF
2.2uF
2.2uF
2.2uF
C2011
C2009
C230 C2006
AUL0
Y1
C229
R274
22 22
22 22
22
22
22
22
22
22
22
22
22 22
22 22
22
22
22
22
22
22
22
22
AA3
AD18
AE18
AE17
AF17
AF18
AD17
AE19
AF19
AF20
AD19
AD20
AE20
AD14
AE14
AE13
AF13
AF14
AD13
AE15
AF15
AF16
AD15
AD16
AE16
AE1
AUR0
LVBCKM
LVBCKP
LVB4M
LVB4P
LVB3M
LVB3P
LVB2M
LVB2P
LVB1M
LVB1P
LVB0M
LVB0P
LVACKM
LVACKP
LVA4M
LVA4P
LVA3M
LVA3P
LVA2M
LVA2P
LVA1M
LVA1P
LVA0M
R242
R241
0.1uF
0.1uF
47 47
R253 22K
R252 22K
+3.3V
C2004 0.1uF
11:J7
LVA_2P LVA_3P 11:J7
5V_HDMI_3
FE_SIF
PC_L_IN
PC_R_IN
COMP_L_IN
COMP_R_IN
AV_L_IN
AV_R_IN
SC2_L_IN
SC2_R_IN
SC1_L_IN
SC1_R_IN
LVB_CKM
C236 22pF OPT
C237 22pF OPT
10:P13
4:Z6
4:Z5
4:K13
4:K15
4:M5
4:M6
9:AE10
9:AE11
9:J10
9:J12
C238 22pF OPT
C239 22pF OPT
11:Q15;11:Q9
11:J9;11:M15
11:Q15;11:Q9
LVB_4M LVB_CKP
11:J9;11:M15
11:Q15;11:Q9
11:J9;11:M15
LVB_4P
LVB_3M
LVB_3P
11:Q15;11:Q10
11:J9;11:M15
11:Q16;11:Q10
11:Q16;11:Q10 11:J10;11:M16
LVB_2M
LVB_2P
LVB_1M
LVB_0M
11:J10;11:M16
LVB_1P
LVB_0P
11:J7 11:Q7
LVA_CKP
11:Q6
11:J6
11:Q7
LVA_CKM
LVA_4M
LVA_4P
LVA_3M
11:Q7
11:Q7
LVA_1M LVA_2M
11:J7
11:J8 11:Q8
LVA_1P
C277 0.1uF
C281 0.1uF
C241 0.1uF
MS_SCK MS_LRCH
MS_LRCK
AUDIO_MASTER_CLK
SCART2_Lout
SCART2_Rout
SCART1_Rout SCART1_Lout
HP_LOUT
HP_ROUT
SPDIF_OUT
C244 0.1uF
7:F12 7:F12
7:F12
7:F7
9:AM13
9:AN15
9:S12
9:T14
7:G19
7:G21
C291 0.1uF
C294 0.1uF
4:T11
C283 0.1uF
C289 0.1uF
+3.3V_VDDP
C266 0.1uF
C275 0.1uF
C247 0.1uF
C259 0.1uF
C264 0.1uF
C250 0.1uF
C254 0.1uF
C257 0.1uF
C253 0.1uF
C251 0.1uF
C252 0.1uF
C258 0.1uF
C248 0.1uF
C249 0.1uF
C265 0.1uF
C245 0.1uF
C276 0.1uF
C242 0.1uF
C246 0.1uF
LVA_0M
LVA_0P
C2026 0.1uF
L210 BLM18PG121SN1D
R254 22K
IC100 LGE3368A (Saturn6 No-DivX)
C2017 0.01uF
+1.8V_DDR
C2021 0.01uF
C2027 10uF
C2018 0.01uF
C243 0.1uF
C2023 0.01uF
+1.26V_VDDC
R257 22K
C2044 10uF
R255 22K
- 28 -
TV/MNT
AUDIO IN R256 22K
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes C2022 0.01uF
LVDS OUT
C2020 0.01uF
C2043 10uF
C296 0.1uF
C297 0.1uF C2000 0.1uF
C2001 0.1uF
C2005 0.1uF C2031 0.1uF C2032 0.1uF
C2033 0.1uF
AA23
Y21
W13
U5
T18
T17
T16
T15
T14
T13
T12
T11
T10
T9
T5
R18
R17
R16
R15
R14
R13
R12
R11
R10
R9
R4
P18
P17
P16
P15
P14
P13
P12
P11
P10
P9
P4
N18
N17
N16
N15
N14
N13
N12
N11
N10
N9
N4
M18
M17
M16
M15
M14
M13
M12
M11
M10
M9
L18
L17
L16
L15
L14
L13
L12
L11
L10
L9
F7
E18
E17
E16
VDDC_16
VDDP_6
GND_32
AVDD_DDR_6 AVDD_DDR_7 AVDD_DDR_8 AVDD_DDR_9 AVDD_DDR_10
GND_45 GND_46
GND_73
GND_72
GND_71
GND_70
GND_69
GND_68
GND_67
GND_66
GND_65
GND_64
GND_63
GND_62
GND_61
GND_60
GND_59
GND_58
GND_57
GND_56
GND_55
GND_54
GND_53
GND_52
AVDD_USB
AVDD_DM
AVDD_33_5
AVDD_33_4
AVDD_33_3
AVDD_33_2
AVDD_33_1
AVDD_MPLL
AVDD_LPLL
AVDD_MEMPLL_2 AVDD_MEMPLL_3
GND_49 GND_50 GND_51
AVDD_MEMPLL_1
GND_48
AVDD_DDR_11
GND_44
GND_47
GND_42
AVDD_DDR_5 GND_43
AVDD_DDR_4 GND_41
AVDD_DDR_3
AVDD_DDR_2
AVDD_DDR_1
AVDD_AU
VDDP_8
GND_40
GND_39
GND_38
GND_37
GND_36
GND_35
GND_34
VDDP_7
VDDP_5
GND_31
GND_33
VDDP_3 VDDP_4
VDDP_2 GND_29
GND_28 GND_30
VDDP_1
GND_27
GND_26
GND_25
VDDC_26
GND_24
VDDC_27
VDDC_24 VDDC_25
VDDC_23
GND_21 GND_22
VDDC_22
GND_20
GND_23
VDDC_21
VDDC_20
VDDC_19
VDDC_18
H8
W8
N7
M7
L7
K7
J7
H7
R20
V20
T20
H17
W18
W17
W16
W15
W14
H16
H15
H14
H13
G13
G12
W7
W10
W9
P20
N20
H12
H11
H10
H9
Y22
W22
W20
W19
W12
W11
V22
V7
U22
U20
U7
T22
VDDC_14 R7 VDDC_15 T7
VDDC_12 M20 VDDC_13 P7
VDDC_9 J20 VDDC_10 K20 VDDC_11 L20
VDDC_8 H20
VDDC_6 H18 VDDC_7 H19
VDDC_3 D18 VDDC_4 D19 VDDC_5 D20
VDDC_17
C2035 0.1uF C2036 0.1uF
+1.8V_DDR
0.1uF
C269
C274
0.1uF
C260
C2025 10uF 6.3V
0.1uF
C267
0.1uF
C273
+3.3V_S6
0.1uF
C2030
+3.3V_S6
AVDD_DM : 0.03mA
0.1uF
C286
+3.3V_AVDD
AVDD_33 : 281mA
AVDD_LPLL : 4.69mA
L206 BLM18PG121SN1D
0.1uF
C279
+3.3V_S6
AVDD_MEMPLL : 23.77mA
0.1uF
C2042 0.1uF
AVDD_AU : 36.11mA
C2041 0.1uF
C293
+3.3V
C2040 0.1uF
L209 BLM18PG121SN1D
AVDD_OTG : 22.96mA
0.1uF
C256
C2039 0.1uF
VDDP : 102.3mA
0.1uF 0.1uF
C271
+3.3V_S6
0.1uF
0.1uF
C262
0.1uF
C284
C2029 0.1uF
C263
C2038 0.1uF
+3.3V_AVDD_MPLL
+3.3V_S6
C2037 0.1uF
VDDC : 970mA
+3.3V_VDDP
+1.26V_VDDC
C2034 0.1uF
VDDC_1 D16 VDDC_2 D17
GND_19
GND_18
GND_17
GND_16
GND_15
GND_13 GND_14
GND_12
GND_11
GND_10
GND_9
GND_8
GND_7
GND_6
GND_5
GND_4
GND_3
GND_2
IC100 LGE3368A (Saturn6 No-DivX)
C2003 0.1uF
M
AUDIO OUT
LGE Internal Use Only
- 29 -
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
SDDR_D[10]
SDDR_D[11]
SDDR_D[12]
SDDR_D[13]
SDDR_D[14]
SDDR_D[15]
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VSSQ6
VSSQ7
VSSQ8
VSSQ9
VSSQ10
VSS1
VSS2
VSS3
VSS4
VSS5
VDDQ1
VDDQ2
VDDQ3
VDDQ4
VDDQ5
VDDQ6
VDDQ7
VDDQ8
VDDQ9
VDDQ10
VDD1
VDD2
VDD3
VDD4
VDD5
DQ9
SDDR_D[9]
+1.8V_DDR
DQ8
DQ5
SDDR_D[5]
DQ7
DQ4
SDDR_D[4]
DQ6
DQ3
SDDR_D[3]
SDDR_D[8]
DQ2
SDDR_D[2]
SDDR_D[7]
DQ1
SDDR_D[1]
SDDR_D[6]
DQ0
SDDR_D[0]
H8
H2
F8
F2
E7
D8
D2
A7
B8
B2
P9
N1
J3
E3
A3
G9
G7
G3
G1
E9
C9
C7
C3
C1
A9
R1
M9
J9
E1
A1
B9
B1
D9
D1
D3
D7
C2
C8
F9
F1
H9
H1
H3
H7
G2
G8
J2
J1
J7
R8
E2
A2
R7
R3
A8
E8
B3
F3
B7
F7
K3
L7
K7
L8
K9
K2
K8
J8
L1
L3
L2
R2
P7
M2
P3
P8
P2
N7
N3
N8
N2
M7
M3
M8
SDDR_A[6]
SDDR_A[7]
SDDR_A[8]
SDDR_A[9]
A6
A7
A8
A9
VDDL
VSSDL
NC3
NC2
NC1
NC6
+1.8V_DDR
SDDR_DQS1_N
NC5
SDDR_DQS0_N
LDQS
SDDR_DQM1_P
UDM
UDQS
SDDR_DQM0_P
SDDR_DQS1_P
UDQS
LDM
SDDR_DQS0_P
LDQS
/SDDR_WE
56
56
56
56
56
56
56
56
56
SDDR_ODT56
/SDDR_CAS
OPT 4.7K /SDDR_RAS
R347
R309 R310
R318
R317
R316
R315
R314
R313
R312
R311
C303
0.1uF
56
ADDR2_A[5]
AR308
C319
0.1uF
0.1uF
C318
C317
0.1uF
0.1uF C315
C316
0.1uF
0.1uF
C313
0.1uF C314
0.1uF
B13 C22
ADDR2_A[2] ADDR2_A[3]
C23
B12
B23
C12
A23
B21 C21 C14 C20
ADDR2_D[3] ADDR2_D[4] ADDR2_D[5] ADDR2_D[6]
ADDR2_D[15]
ADDR2_D[14]
ADDR2_D[13]
ADDR2_D[12]
ADDR2_D[11]
ADDR2_D[10]
ADDR2_D[9]
ADDR2_D[8]
A17
B19
A16
A20
B20
B16
C19
C16
C15
A15
ADDR2_D[1] ADDR2_D[2]
ADDR2_D[7]
A21
ADDR2_D[0]
B15
B17
A18
A19
C18
C17
B18
D22
D12
D13
D14
D23
A14
B14
D24
B24
C24
ADDR2_A[12] A24
ADDR2_A[10] B22 ADDR2_A[11] A12
ADDR2_A[9]
ADDR2_A[8]
ADDR2_A[7]
ADDR2_A[6]
ADDR2_A[5]
A13
A22
ADDR2_A[4]
C13
ADDR2_A[1]
C312
ADDR2_A[0]
D15
B_DDR2_A2
A_DDR2_A2 A_DDR2_A4
A_DDR2_MCLK
B_DDR2_DQ2 B_DDR2_DQ3 B_DDR2_DQ4 B_DDR2_DQ5
A_DDR2_DQ2 A_DDR2_DQ3 A_DDR2_DQ4 A_DDR2_DQ5
A_DDR2_DQ15
A_DDR2_DQ14
A_DDR2_DQ13
A_DDR2_DQ12
A_DDR2_DQ11
A_DDR2_DQ10
A_DDR2_DQ9
A_DDR2_DQ8
A_DDR2_DQ7
BDDR2_A[2] BDDR2_A[3]
T25 AF23
BDDR2_A[9]
BDDR2_A[8]
BDDR2_A[7]
BDDR2_A[6]
BDDR2_A[5]
BDDR2_A[11]
Y25
AD25
Y26
W26
AE25
V26
AF25
AF24
W24
AE26
W25
AA25
AB25
AC26
AC25
AA26
AB26
AB24
U24
U25
U26
AB23
V24
V25
AB22
AC24
AC23
BDDR2_D[10]
BDDR2_D[9]
BDDR2_D[8]
BDDR2_D[7]
BDDR2_D[6]
BDDR2_D[5]
BDDR2_D[4]
BDDR2_D[3]
BDDR2_D[2]
BDDR2_D[1]
BDDR2_D[0]
AE22 BDDR2_A[12]
R24
AD23 BDDR2_A[10]
AC22
R25
AD22
R26
AE23
BDDR2_A[4]
BDDR2_A[1]
AF26
T24
BDDR2_A[0]
T26
0.1uF
AE24 BDDR2_D[11] B_DDR2_DQ11 AD26 BDDR2_D[12] B_DDR2_DQ12 Y24 BDDR2_D[13] B_DDR2_DQ13 AD24 BDDR2_D[14] B_DDR2_DQ14 AA24 BDDR2_D[15] B_DDR2_DQ15
B_DDR2_DQ10
B_DDR2_DQ9
B_DDR2_DQ8
B_DDR2_DQ7
B_DDR2_DQ6
B_DDR2_DQ1
A_DDR2_DQ1
A_DDR2_DQ6
B_DDR2_DQ0
B_DDR2_DQSB1
A_DDR2_DQ0
B_DDR2_DQSB0
A_DDR2_DQSB1
B_DDR2_DQM1
A_DDR2_DQM1
A_DDR2_DQSB0
B_DDR2_DQM0
A_DDR2_DQM0
B_DDR2_DQS1
A_DDR2_DQS1
/B_DDR2_WE
/A_DDR2_WE
B_DDR2_DQS0
/B_DDR2_CAS
/A_DDR2_CAS
A_DDR2_DQS0
B_DDR2_ODT /B_DDR2_RAS
/A_DDR2_RAS
B_DDR2_CKE
A_DDR2_ODT
A_DDR2_CKE
/B_DDR2_MCLK
B_DDR2_BA2 B_DDR2_MCLK
A_DDR2_BA2
/A_DDR2_MCLK
B_DDR2_BA0 B_DDR2_BA1
A_DDR2_BA0
B_DDR2_A12
B_DDR2_A11
B_DDR2_A10
B_DDR2_A9
B_DDR2_A8
B_DDR2_A7
B_DDR2_A6
B_DDR2_A5
B_DDR2_A4
A_DDR2_BA1
A_DDR2_A12
A_DDR2_A11
A_DDR2_A10
A_DDR2_A9
A_DDR2_A8
A_DDR2_A7
A_DDR2_A6
A_DDR2_A5
B_DDR2_A3
B_DDR2_A1
A_DDR2_A1 A_DDR2_A3
B_DDR2_A0
A_DDR2_A0
A_MVREF
IC100 LGE3368A (Saturn6 No-DivX)
C320
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
ADDR2_D[5]
SDDR_D[5] 56
ADDR2_D[2]
SDDR_D[2]
ADDR2_D[7]
ADDR2_D[13]
ADDR2_D[10]
ADDR2_D[8]
ADDR2_D[15]
ADDR2_D[6]
ADDR2_D[1]
ADDR2_D[3]
ADDR2_D[4]
ADDR2_D[0]
56 AR309
56
SDDR_D[0]
SDDR_D[7]
SDDR_D[13]
SDDR_D[10]
SDDR_D[8]
SDDR_D[15]
SDDR_D[6]
SDDR_D[1]
SDDR_D[3]
SDDR_D[4]
ADDR2_D[14]
ADDR2_D[9]
SDDR_D[14]
ADDR2_D[12]
ADDR2_D[11]
ADDR2_DQS1_N
ADDR2_DQS0_N
ADDR2_DQM1_P
ADDR2_DQM0_P
ADDR2_DQS1_P
ADDR2_DQS0_P
/ADDR2_WE
/ADDR2_CAS
/ADDR2_RAS
ADDR2_ODT
ADDR2_CKE
/ADDR2_MCLK
ADDR2_MCLK
ADDR2_BA[2]
ADDR2_BA[1]
ADDR2_BA[0]
ADDR2_A[8]
ADDR2_A[11]
SDDR_D[12] 56 AR307
56
R319 56
AR306
R320
ADDR2_A[6]
ADDR2_A[4]
ADDR2_A[2]
ADDR2_A[0]
ADDR2_A[7]
ADDR2_A[12]
ADDR2_A[9]
ADDR2_A[10]
SDDR_D[9]
SDDR_D[11]
+1.8V_DDR
R308
56
R305
R307
R306
56 22
SDDR_BA[2]
22
R304
56
SDDR_CKE OPT R346 4.7K
AR301
AR300
AR302
56
SDDR_BA[1]
SDDR_A[8]
SDDR_A[11]
SDDR_A[6]
SDDR_A[4]
SDDR_A[2]
SDDR_A[0]
SDDR_A[7]
SDDR_A[12]
SDDR_A[9]
R303
SDDR_CK
10uF
ADDR2_A[3]
56
/SDDR_CK
C304 ADDR2_A[1]
56
C305
SDDR_A[1] SDDR_A[10]
0.1uF +1.8V_DDR
C310 C311
0.1uF
Close to DDR Power Pin
0.1uF 0.1uF
0.1uF C328
0.1uF C326
0.1uF C327
10uF C325
C324
R325
56
56
R334 R335 R336
R337 R338
R339 R340
R341 R342
/BDDR2_CAS /BDDR2_WE
BDDR2_DQS0_P BDDR2_DQS1_P
BDDR2_DQM0_P BDDR2_DQM1_P
BDDR2_DQS0_N BDDR2_DQS1_N
BDDR2_D[5]
BDDR2_D[2]
BDDR2_D[0]
BDDR2_D[7]
BDDR2_D[13]
BDDR2_D[10]
BDDR2_D[8]
BDDR2_D[15]
AR313
56
56
56 AR312
TDDR_D[5]
TDDR_D[2]
TDDR_D[0]
TDDR_D[7]
TDDR_D[13]
TDDR_D[10]
TDDR_D[8]
TDDR_D[15]
TDDR_D[6]
TDDR_D[1]
TDDR_D[3]
TDDR_D[4]
TDDR_D[14]
TDDR_D[11]
BDDR2_D[14]
BDDR2_D[6]
TDDR_A[12]
TDDR_A[11]
TDDR_A[10]
TDDR_A[9]
TDDR_A[8]
TDDR_A[7]
TDDR_A[6]
56
56
56
56
56
56
56 R349 OPT 4.7K
+1.8V_DDR
TDDR_DQS1_N
TDDR_DQS0_N
TDDR_DQM1_P
TDDR_DQM0_P
TDDR_DQS1_P
TDDR_DQS0_P
/TDDR_WE
/TDDR_CAS
/TDDR_RAS
R348
VDDL
VSSDL
NC3
NC2
NC1
NC6
NC5
UDQS
LDQS
UDM
LDM
UDQS
LDQS
WE
CAS
RAS
CS
ODT
CKE
CK CK
TDDR_MCLK
NC4
BA1
BA0
A12
A11
A10/AP
A9
A8
A7
A6
/TDDR_MCLK
TDDR_BA[2]
TDDR_BA[1]
OPT 4.7K
TDDR_D[9]
BDDR2_D[1]
A4
+1.8V_DDR
TDDR_D[12]
BDDR2_D[3]
A3 TDDR_A[4]
A5
A2 TDDR_A[3] TDDR_A[5]
TDDR_A[2]
VREF
A1
C337
A0
0.1uF
TDDR_A[1]
0.1uF
0.1uF
0.1uF C341
C342
0.1uF C340
J1
J7
R8
E2
A2
R7
R3
A8
E8
B3
F3
B7
F7
K3
L7
K7
L8
K9
K2
K8
J8
L1
L3
L2
R2
P7
M2
P3
P8
P2
N7
N3
N8
N2
M7
M3
M8
J2
H8
H2
F8
F2
E7
D8
D2
A7
B8
B2
P9
N1
J3
E3
A3
G9
G7
G3
G1
E9
C9
C7
C3
C1
A9
R1
M9
J9
E1
A1
B9
B1
D9
D1
D3
D7
C2
C8
F9
F1
H9
H1
H3
H7
G2
G8
IC301 H5PS5162FFR-S6C
0.1uF C339
TDDR_A[0]
C335 0.1uF
TDDR_BA[0]
C333 0.1uF
TDDR_CKE
BDDR2_D[12]
BDDR2_D[4]
+1.8V_DDR
56
BDDR2_D[9] 56
R333
BDDR2_ODT /BDDR2_RAS
AR311
56 56
R332
BDDR2_CKE
BDDR2_D[11]
56
R331
AR310
22
R330
22
56
R329
BDDR2_MCLK
/BDDR2_MCLK
BDDR2_BA[2]
56
56
TDDR_A[8]
TDDR_A[11]
TDDR_A[6]
R328
56
BDDR2_BA[1] OPT
56
56
TDDR_A[4]
TDDR_A[2]
TDDR_A[0]
R327
R326
AR305
TDDR_A[7]
TDDR_A[12]
TDDR_A[5]
TDDR_A[10]
BDDR2_BA[0]
BDDR2_A[8]
BDDR2_A[11]
BDDR2_A[6]
BDDR2_A[4]
BDDR2_A[2]
BDDR2_A[0]
BDDR2_A[7]
BDDR2_A[12]
BDDR2_A[5]
BDDR2_A[10]
TDDR_A[3] TDDR_A[1]
TDDR_A[9]
0.1uF C330
BDDR2_A[1] AR304
AR303
0.1uF C329
BDDR2_A[3]
BDDR2_A[9]
Close to DDR Power Pin
C323 0.1uF
1%
C306
SDDR_A[3]
SDDR_A[5]
SDDR_BA[0]
CAS
WE
1K 1% R302 1K 1%
0.1uF 1K 1%
+1.8V_DDR
RAS
CS
ODT
CKE
CK
CK
BA2
BA1
BA0
SDDR_A[12]
SDDR_A[5]
SDDR_A[11]
SDDR_A[4]
SDDR_A[10]
SDDR_A[3]
A3
A5
A12
SDDR_A[2]
A2
A4
A11
SDDR_A[1]
A10/AP
SDDR_A[0]
VREF
A1
C300 0.1uF
A0
OPT R350
0.1uF C301 SDDR_A[0-12] OPT
IC300 HY5PS1G1631CFP-S6
0
R301 150 R300
C307 R321 R322
0.1uF C331 R343 1K
+1.8V_DDR
TDDR_A[0-12]
C302 0.1uF
C309
0.1uF C336 1%
C308
1% 0.1uF 1K ADDR2_A[0-12] ADDR2_D[0-15]
0.1uF C338 0
DDR2 1.8V By CAP - Place these Caps near Memory
BDDR2_A[0-12] BDDR2_D[0-15]
0.1uF C334 R345 1K OPT
0.1uF C332 R344 150
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes R351
+1.8V_DDR
TDDR_D[3] TDDR_D[4] TDDR_D[5] TDDR_D[6] TDDR_D[7]
DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VSSQ6
VSSQ7
VSSQ8
VSSQ9
VSSQ10
VSS1
VSS2
VSS3
VSS4
VSS5
VDDQ1
VDDQ2
VDDQ3
VDDQ4
VDDQ5
VDDQ6
VDDQ7
VDDQ8
VDDQ9
VDDQ10
VDD1
VDD2
VDD3
VDD4
VDD5
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
+1.8V_DDR
TDDR_D[15]
TDDR_D[14]
TDDR_D[13]
TDDR_D[12]
TDDR_D[11]
TDDR_D[10]
TDDR_D[9]
TDDR_D[8]
TDDR_D[2]
DQ1
DQ8
TDDR_D[0] TDDR_D[1]
DQ0
DDR2
LGE Internal Use Only
TDDR_D[0-15]
SDDR_D[0-15]
[RD]U_CAN
[RD]CONTACT
[RD]O_SPRING
[WH]U_CAN
DSUB_R
2:E19
2:E18
DSUB_G
2:E19
DSUB_HSYNC
2:E18
DSUB_B
DSUB_VSYNC
2:E18
0
0
R440
R437
[ PC ]
+3.3V
[RD]1P_CAN2
2E
D413 30V
VSS
A2
A1
A0
4
3
2
1
5
6
7
8
CAT24C02WI-GT3
IC400
D411 AMOTECH 5.6V
D410 AMOTECH 5.6V
30V
AMOTECH D409
30V
AMOTECH D408
30V
D407
R419 AMOTECH0
5.6V
AMOTECH D412
SDA
SCL
WP
VCC
C400 0.1uF 16V
C401 18pF 50V
R430 470K
R429 470K
R428 75
R427 75
R426 75
R425 1K
JP413 D416 ADUC30S03010L_AMODIODE 30V
JP414 JP412
C419 OPT
D417 ADUC30S03010L_AMODIODE 30V
R406 4.7K
C
R444 22
A2
D400 ENKMC2838-T112 A1
C417 1000pF 50V
R431 10K
C415 1000pF 50V
R432 10K
P400 KCN-DS-1-0089
R413 10K
R414 10K
2:E20
COMP_Pr
+5V_ST
2:S16
OPT
R446 0
R448 DSUB_DET
ISP_TXD
ISP_RXD
EDID_WP
AV_R_IN
AV_L_IN
AV_CVBS_DET
1K D420 ADMC5M03200L_AMODIODE 5.6V
R447 4.7K
+3.3V
D419 ADMC5M03200L_AMODIODE 5.6V
R416 100
COMP_R_IN
2:S16
2:E20
COMP_Pb
COMP_L_IN
2:E20
1:AA22
COMP_Y
C414 47pF 50V
R445 22
R412 10K
R436 0
D418 ADMC5M03200L_AMODIODE 5.6V
D415 ADUC30S03010L_AMODIODE 30V
C418 OPT
C420 OPT
C412 100pF 50V
R408 470K
R435 0
C413 100pF 50V
R410 470K
C404 1K 0.1uF 16V
R409
R411 75
COMP_DET
R401 4.7K
C402 18pF 50V
R404 4.7K
AMOTECH D405 5.6V
AMOTECH D404 5.6V
D414 30V ADUC30S03010L_AMODIODE
[RD]O_SPRING
[WH]C_LUG_L
5D
3E
[WH]1P_CAN
2D
[RD]CONTACT
[RD]C_LUG_L
5C
4E
[BL]C_LUG_L
[BL]1P_CAN
2B
[RD]1P_CAN1
[GN]O_SPRING
3A
2C
[GN]CONTACT
4A
5B
[GN]1P_CAN
R418 4.7K
2A
PPJ229-01
JK400
COMPONENT
2C
5C
4C
2B
[WH]C_LUG
OPT
3B
AMOTECH D403 5.6V
6
[YL]U_CAN
7
2A
+3.3V
11 1
R443 75
R441 75
R442 75
AMOTECH D406 30V
8
[YL]CONTACT
9
R415 12K
[YL]O_SPRING
10
R434 12K R433 12K 12 2
1:AJ19
3
8
6B
7B
5
4
7A
6A
SHIELD_PLATE
T_TERMINAL2
B_TERMINAL2
T_SPRING
R_SPRING
B_TERMINAL1
T_TERMINAL1
E_SPRING
2:X18
SPDIF_OUT
DBG_RX
DBG_TX
C425 0.33uF 16V
R458 6.2K
220pF
220pF
P401 KCN-DS-1-0088
C427
C426
R457 6.2K
C406 0.1uF 16V
+5V_GENERAL
+5V_ST
OPT ZD403
R462 1K
+5V_GENERAL
50V
FIX_POLE
R450 470K
R449 470K
C428 0.33uF 16V
R459 100
R461 0 OPT
R452 15K
R451 15K
R455 0
R454 10K
C431 0.1uF 16V
PC_L_IN
PC_R_IN
D424 OPT ADUC30S03010L_AMODIODE 30V
OPT D423 ADUC30S03010L_AMODIODE 30V
IR_OUT
+5V_ST
R456 0
R453 10K
C430 0.047uF 25V
C429 0.33uF 16V
RS232C
VINPUT
VCC
GND
MAX3232CDR
50V
JK403 JST1223-001
C424 100pF 50V
C422 100pF 50V
IC403
D421 AMOTECH 5.6V OPT
D422 AMOTECH 5.6V OPT
SPDIF OPTIC JACK
JK401 PEJ024-01
PC AUDIO
ADMC5M03200L_AMODIODE
5A
13 3
1 2
4A
14 4
4
R417 12K OPT
C1 -
PPJ218-01
15 5
OPT 16
RI N2 8 9 ROUT2
DOUT2 7
V6 11 DI N1
V+
2:S16
2:S16
+5V_USB_REAR
UB01123-4HHS-4F JK404
D402 CDS3C05HDMI1 5.6V
FLAG
OUT_1
D426 CDS3C05HDMI1 5.6V
C407 10uF OPT
5
6
7
8
4
3
2
1
IC402 MP6211DH
EN
IN_2
IN_1
GND
1:AL8
1:AL7
SIDE_USB_DM
SIDE_USB_DP
USB_CTL 1:AI26
R403 47
USB_OCD 1:AI14
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D425 CDS3C05HDMI1 5.6V
C405 0.1uF
OUT_2
OUT_3
R420 10K
1:AL7
+5V_USB_SIDE
1:AL8
REAR_USB_DP
SIDE USB (OPT:SIDE_USB)
D401 CDS3C05HDMI1 5.6V
REAR_USB_DM
REAR USB (OPT:REAR_USB)
KJA-UB-4-0004 JK405
AV_CVBS_IN
@maker 1
10 DI N2
C2 -
3 RI N1
5 12 ROUT1 6
C2 + 4 13 2
3 14 R460 100 7
DOUT1 3
C1 + 1 VCC
0.1uF
R400 0
8
16 9
2 15 GND 4
- 30 10
1 2 3 4
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes Op t i c 5
Fi b e r 5
1 2 3 4 5
C423
JK402
0.1uF
USB DOWN STREAM
C403
AV (OPT:SIDE_AV)
INTERFACE
USB DOWN STREAM
LGE Internal Use Only
R503
33
33
47
PCM_5V_CTL
R501 33K
C500 0.1uF 16V
+5V_ST
R505
1
2
3
B
A
GND
R502 10K
4
5
Y
VCC
B
R529 2.2K
R504 22K
IC500 74LVC1G32GW
10K
E
C
0.1uF
10K
R511
Q500 2SC3052
S
100
C504 10uF 10V
D
Q501 RSR025P03
G
0 16V
GND
+3.3V_CI
100
10K
C502 0.1uF 16V
R510
R509
C503
R508
GND
R506
+5V_GENERAL
AR504
AR503
47
33
CI POWER ENABLE CONTROL
/CI_CD1 D4
E12 /CI_CD2
R500
/CI_CD2
DVB-CI DETECT
CI_MCLKI
CI_MISTRT CI_MIVAL_ERR
CI_TS_DATA[2] CI_TS_DATA[3]
CI_TS_DATA[1]
CI_TS_DATA[0]
CI_TS_SYN
CI_TS_CLK CI_TS_VAL
REG
/PCM_WAIT
PCM_RST
CI_MDI[7]
CI_MDI[6]
CI_MDI[5]
CI_MDI[4]
CI_MDI[3]
CI_MDI[2]
CI_MDI[1]
CI_MDI[0]
CI_IOWR
CI_IORD
CI_TS_DATA[6] CI_TS_DATA[7]
CI_TS_DATA[5]
R507
CI_TS_DATA[4]
10K
AR500
10K
C501 0.1uF 16V
0. 1uF
/CI_CD1
C5 1 0
R513
C505 10uF 10V
OPT 47
R519
GND
R512
+3.3V_CI
OPT
0
C507 0.1uF 16V
+5V_CI_ON
G2 2
GND
G1 1
1:AA10
R514
0
R515 47
15 17
100
27 28 29 30 31 32 33 34
61 62 63 64 65 66 67 68
47
R524 33K
R521
26
/PCM_CD
CI_DET
AB9
24
22
25
60
23
58
56
59
57
CI_DATA[0]
A2
AE5;10:J17 FE_TS_SYN
A5
R523 10K
GND
A7
A6
A4
R522 10K
A3
A1
AE5;10:W19 FE_TS_VAL_ERR
AG4;10:J17 FE_TS_DATA[0]
A0
AE5;10:J17 FE_TS_CLK
OE1
CI_ADDR[0]
CI_ADDR[1]
DVB-CI SERIAL BUFFER TS
GND
CI_DATA[2]
CI_DATA[1]
CI_ADDR[2]
CI_ADDR[3]
CI_ADDR[4]
CI_ADDR[5]
CI_ADDR[6]
CI_ADDR[7]
GND CI_ADDR[12]
C508 0.1uF
19 20 21
CI_ADDR[14]
CI_ADDR[13]
CI_ADDR[8]
CI_ADDR[9]
CI_ADDR[11]
CI_ADDR[10]
55
CI_DATA[0-7]
53
OPT
R516
CI_DATA[7]
R517 10K
54
18
16
50 52
51
14
48 49
12
11 13
10
44 46
45 47
9
43
CI_DATA[5]
8
CI_DATA[6]
6
4
7
42
5
40 41
39
CI_DATA[4]
37 38
CI_DATA[3] 3
36
35
10067972-050LF
P500
EAG41860101
10
9
8
7
6
5
4
3
2
1
11
12
13
14
15
16
17
18
19
20
74LVC541A(PW)
IC502
GND
C509 0.1uF 16V
Y1
Y7
Y6
Y5
Y4
Y3
R525 47
R527 47
R528 47
Y2
R526 47
+3.3V_CI
/PCM_IRQA
Y0
OE2
VCC
CI_ADDR[0-14]
CI_WE
+5V_GENERAL
CI_OE
/PCM_CE
10K
0.1uF BUF_TS_DATA[0]
BUF_TS_SYN
BUF_TS_VAL_ERR
BUF_TS_CLK
CI_MISTRT
CI_MCLKI
CI_MIVAL_ERR
CI_DATA[0-7]
TOSHIBA
33
AR512
33
/PCM_IOWR
/PCM_IORD
/PCM_WE
/PCM_OE
/PCM_REG
PCM_A[14]
PCM_A[13]
PCM_D[0-7]
PCM_A[4]
CI_ADDR[3]
PCM_A[5]
CI_ADDR[2]
PCM_A[6]
CI_ADDR[1]
PCM_A[7]
CI_ADDR[0]
FE_TS_DATA[0-7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI_IOWR
CI_IORD
CI_WE
CI_OE
REG
CI_ADDR[14]
CI_ADDR[13]
PCM_A[12]
PCM_A[11]
CI_ADDR[12]
PCM_A[10]
PCM_A[9] CI_ADDR[11]
CI_ADDR[9] CI_ADDR[10]
AR511
PCM_D[7]
FE_TS_DATA[0-7]
+3.3V_CI C511 0.1uF 16V
PCM_A[8]
PCM_D[6] CI_DATA[7]
AR510
PCM_D[5] CI_DATA[6]
PCM_D[4]
PCM_D[3]
CI_DATA[5]
33
PCM_D[2]
CI_DATA[4]
PCM_D[1]
AR509
2A1
1Y4
2A2
1Y3
2A3
1Y2
2A4
1Y1
2OE
VCC
PCM_D[0]
11
12
13
14
15
16
17
18
19
20
CI_DATA[3]
33
0ITO742440D
AR508
10
9
8
7
6
5
4
3
2
1
FE_TS_CLK
FE_TS_SYN FE_TS_VAL_ERR
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
CI_DATA[2]
33
GND
2Y1
1A4
2Y2
1A3
2Y3
1A2
2Y4
1A1
33
IC501
AR513
AR507
AR506
1OE
33
33
CI_DATA[1]
CI_DATA[0]
CI_ADDR[8]
CI_ADDR[4]
PCM_A[3]
CI_ADDR[5]
PCM_A[2]
CI_ADDR[6]
PCM_A[1]
CI_ADDR[7]
PCM_A[0]
CI_DET
DVB-CI HOST I/F
D14
CI_MDI[0]
CI_MDI[1]
CI_MDI[2]
CI_MDI[3]
CI_MDI[4]
CI_MDI[5]
CI_MDI[6]
CI_MDI[7]
DVB-CI TS INPUT
CI_DATA[0-7]
+5V_GENERAL
10K
- 31 BUFFER
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes R520
R518
CI_DATA[0-7]
TC74LCX244FT
+5V_CI_ON
PCM_D[0-7]
DVB-CI SLOT
PCMCIA
LGE Internal Use Only
C512
EAG39789402
21
20
1
2
3
4
5
6
7
8
9
11 10
12
13
14
15
16
17
18
- 32 -
4
3
2
1
5
6
7
8
VCC
SDA
SCL
WP
R600
2K
R621
R623
R618 0
GND
0
0
C603 0.1uF
JP606
R607
R611
R610
E
0
R626 4.7K
5V_HDMI_1
C600 0.1uF 16V
22
22
B
4.7K
R629
HPD1
DDC_SDA_1 2:E10;AL9 DDC_SCL_1 2:E10;AL9
DDC_SDA_1
DDC_SCL_1
2:E10;K7
2:E10;K7
EDID_WP 1:AJ20;AI16;AL12
2:E9 D2+_HDMI1
2:E9 D1+_HDMI1 2:E9 D2-_HDMI1
2:E8 D0+_HDMI1 2:E9 D1-_HDMI1
CK+_HDMI1 2:E9 D0-_HDMI1
2:E8
K19;X14;AH25 CEC_REMOTE 2:E8 CK-_HDMI1
ENKMC2838-T112 D600
+5V_ST
JP601
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
VSS
A2
A1
A0
IC600
CAT24C02WI-GT3
D2+
D2_GND
D2-
D1+
D1_GND
D1-
D0+
D0_GND
D0-
CK+
R612 1K
Q601 2SC3052
A1
19
JK600
22
JP600
C
R615 10K
21
20
1
2
3
4
5
6
7
8
9
11 10
12
13
14
15
16
17
18
19
VSS
A2
A1
A0
HDMI_CEC
IC602
D2+
4
3
2
1
5
6
7
8
R601
R613 1K
DRAIN2
GATE1
3
2
1
0
0
C607 0.1uF
JP611
C601 0.1uF 16V
E
C
0
22
22
R646 4.7K
5V_HDMI_2
R605
R604
R603
Q602 2SC3052
B
R627 120K
+3.3V_ST
4.7K
R625
0
OPT
4
5
6
SOURCE2
GATE2
DRAIN1
DDC_SDA_2 2:E12;AL18 DDC_SCL_2
2:E12;AL19
HPD2
GND
OPT C605 0.1uF 16V
R631 OPT
DDC_SDA_2
DDC_SCL_2
EDID_WP
CEC_REMOTE
2:E12 D2+_HDMI2
2:E11 D1+_HDMI2 2:E12 D2-_HDMI2
2:E11 D0+_HDMI2 2:E11 D1-_HDMI2
2:E10 CK+_HDMI2 2:E11 D0-_HDMI2
CEC_REMOTE 2:E11 CK-_HDMI2
K8;X14;AH25
ENKMC2838-T112 D602
+5V_ST
JP603
JP602
R616 10K
R649
MMBD301LT1G Q600 SSM6N15FU D603 30V
R642
R645
SOURCE1
SDA
SCL
WP
2K
R640 0
GND
VCC
D2_GND
D2-
D1+
D1_GND
D1-
D0+
D0_GND
D0-
CK+
CAT24C02WI-GT3
HDMI_CEC
GND
EAG39789402
JK601
22
5V_HDMI_2
A1
C
C
$0.26
20
1
2
3
4
5
6
7
8
9
11 10
12
13
14
15
16
17
18
19
JACK_GND
VSS
A2
A1
D2+
4
3
2
1
5
6
7
8
SDA
SCL
WP
2K R622
0
E
C
0
22
22
R6 2 8 4. 7K
5V_HDMI_3
R609
R606
R608
Q603 2SC3052 C602 0.1uF 16V
C604 0.1uF
JP607
R620 0
R619 0
R614 1K
5V_HDMI_3
R602 GND
VCC
D2_GND
D2-
D1+
D1_GND
D1-
D0+
D0_GND
D0-
CK+
CAT24C02WI-GT3
IC601
JK602
A0
UI_HW_PORT3
B
R617 10K
SIDE HDMI (OPT:SIDE_HDMI)
EAG42463001
5V_HDMI_1
A2
4.7K
R630
2:E14;AL14 DDC_SDA_3 2:E15;AL13 DDC_SCL_3
HPD3
DDC_SDA_3
DDC_SCL_3
EDID_WP
2:E14 D2+_HDMI3
2:E14 D1+_HDMI3 2:E14 D2-_HDMI3
2:E13 D0+_HDMI3 2:E14 D1-_HDMI3
2:E13 CK+_HDMI3 2:E13 D0-_HDMI3
CEC_REMOTE 2:E13 CK-_HDMI3
K19;K8;AH25
ENKMC2838-T112 D601
+5V_ST
JP605
UI_HW_PORT2
A1
(OPT:REAR_HDMI_2EA)
A2
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes A2
JP604 C
UI_HW_PORT1
HDMI
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes C702 0.1uF 16V
L701
C704 1uF 10V
- 33 -
1:AJ19
1:AA19;R15;9:AI24;9:AI25
SIDE_HP_MUTE
SB_MUTE
A2
C
D708 ENKMC2838-T112 A1
EARPHONE AMP
10K
R741
B
E
C
Q705 2SC3052
R742 10K
+5V_EARPHONE
1:L22;11:AG9
10K E
C Q700 2SC3052
R701 10K
+5V_EARPHONE
R700 B
C706 0.1uF 16V
100pF 50V
C705
C707 1000pF 50V
100
100 100 100
R721
R710
100
R720
R709
100
R722
C712 33pF 50V
LFM
3.3K
C714 33pF 50V
C715 0.1uF 16V
+1.8V_AMP
TEST0
DVDD_PLL
AVDD_PLL
AGND_PLL
VDD_IO
CLK_I
VSS_IO
DVSS_1
AD
RESET
VDR1A
BST1A
DGND_PLL
C760 1uF 10V
C7 1 3 0. 1uF 16V
R708
+3.3V
C708 1000pF 50V
C709 0.1uF
R740 0
2:X19
C703 HP_ROUT 0.22uF 16V
C701 1uF 6.3V
2:X19
HP_LOUT
R702 20K
14
13
12
11
10
9
8
7
6
5
4
3
2
1
IN2-
SHUTDOWN
GND
BYPASS
4
3
2
1
R706 20K
5
6
7
8
VO2
VDD
VO1
IN1-
C710 0.1uF 16V
R711 20K
NTP-3100L
EAN60664001
IC701
TPA6110A2DGNRG4
IC700
Monitor0_1_2 TP is necessory
SDA_SUB/AMP SCL_SUB/AMP
1:L22;11:AG10
MS_SCK
MS_LRCK
2:X21
2:X21
MS_LRCH
2:X21
MCLK SDATA WCK BCK TP is necessory
C700 1uF 10V
L700
+1.8V_AMP
AUDIO_MASTER_CLK
R704
C711 100uF 16V
R712 20K
PGND2A_1 OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2
38 37 36 35 34 33
29
30
31
R718
R724 10K
Q701 2SC3052
C719 100uF 16V
C728 0.1uF 50V
E
C
1K
R715
1K
R714
C A2
B
22000pF 50V +3.3V_ST
C731
C718 100uF 16V
100
PGND2B_2
OUT2B_1
OUT2B_2
C732 22000pF 50V
+5V_GENERAL D700 ENKMC2838-T112 A1
+5V_EARPHONE
16V
C717 0.22uF
R717 33K OPT
C721 0.1uF 16V
C7 2 4 0. 1uF 16V
PGND2A_2
PVDD2B_1
BST2A
39
32
VDR2A
40
C7 3 0 0. 1uF 16V
NC
41
C725 10uF 35V
42
C727 0.1uF 16V
C726 22000pF 50V
C729 0.1uF 50V
19 BCK
AMP_RST
15
C716 22000pF 50V
PGND1A_1
PGND1A_2 56 DVDD
DVSS_2
+1.8V_AMP
BLM18PG121SN1D
OUT1A_2
55 16
2:X21
BLM18PG121SN1D
OUT1A_1 53
54 SDATA 17 WCK 18
C733 0.1uF 50V
20 SDA
PVDD1A_1 51 50 21 SCL
PVDD1B_1 MONITOR_0
PVDD1B_2 49 22
OUT1B_2 48 23 MONITOR_1
1:AA21
R703 0
PVDD1A_2 52
47 24 MONITOR_2
OUT1B_1 46 25 FAULT
PGND1B_2 45 26 VDR2B
PGND1B_1 44 27 BST2B
VDR1B 43 28 PGND2B_1
BST1B
AMP_VCC
C722 0.1uF
C723 0.1uF
10K
R729
C720 0.1uF 50V
0.1uF 50V
0.1uF 50V
A2
D711 5.6V AMOTECH
D710 5.6V AMOTECH
C
12
R725
12
1F
L704 DA-8580 EAP38319001 2F
1F
TRANSFER[R]
BREAK[R]
C-LUG-ES
C-LUG-EL
BREAK[L]
TRANSFER[L]
C-LUG-ER
9
8
6
5
4
3
7
JK701
PEJ026-01
10
DJ-S3600LM JK700
FIX-TER
5
1
2
3
4
BOTTOM_EARPHONE
1:AA22
1:AA19;G25;9:AI24;9:AI25
1S
L705 DA-8580 EAP38319001 2S 2F
1S
2S
TOP_EARPHONE_out_of_stock
R707 10K
+3.3V
NTP_MUTE
SB_MUTE
12
C736 10uF 35V
R719
12
12
R728
C744 1000pF 50V
C743 1000pF 50V
R716
12
12
R727
R713
12
R705
R726
C742 1000pF 50V
C741 1000pF 50V
HP_DET
D709 ENKMC2838-T112 A1
C735
C734
AMP_VCC
D707 1N4148W 100V OPT
D706 1N4148W 100V OPT
D705 1N4148W 100V OPT
D704 1N4148W 100V OPT
4.7K
SPK_L-
SPK_R+
SPK_R-
AE5
AE7
AE9
SPK_L+ AE3
0.1uF 50V
4.7K
R733
0.1uF 50V
C752
R732
4.7K
R731
C751
C750 0.1uF 50V
4.7K
R730
2A => 5A
L708 120-ohm
L709 120-ohm
L707 120-ohm
L706 120-ohm
C758 0.01uF 50V
3.3
R737
3.3
0.01uF 50V R736
C757
C756 0.01uF 50V
3.3
R735
3.3
R734
C755 0.01uF 50V
AB12
SPEAKER_R
AB11
AB11
SPEAKER_L
AB10
1
2
3
4
P700
WAFER-ANGLE
SPK_R-
SPK_R+
SPK_L-
SPK_L+
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C746 0.47uF 50V
C745 0.47uF 50V
C749 0.1uF 50V
AMP
LGE Internal Use Only
P/NO : MFL50326801
Feb., 2009 Printed in Korea