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LCD TV SERVICE MANUAL CHASSIS : LP91A
MODEL : 42LH20R
42LH20R-MA
CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 TROUBLE SHOOTING ............................................................................14 BLOCK DIAGRAM...................................................................................17 EXPLODED VIEW .................................................................................. 18 SVC. SHEET ...............................................................................................
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit Keep wires away from high voltage or high temperature parts.
AC Volt-meter
Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock. To Instrument's exposed METALLIC PARTS
Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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Good Earth Ground such as WATER PIPE, CONDUIT etc. 0.15uF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard
LGE Internal Use Only
SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
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LGE Internal Use Only
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Copyright Š 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
3. Test method
This spec sheet is applied to LCD TV used LP91A chassis.
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC
2. Specification Each part is tested as below without special appointment. 1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC 2) Relative Humidity : 65±10% 3) Power Voltage : Standard input voltage(100~240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.
4. Electrical specification 4.1. General Specification No
Item
Specification
1
Screen Size
2
Aspect Ratio
16:9
3
LCD Module
42” TFT WXGA LCD
4
Operating Environment
Temp.: 0 ~ 40 deg
Measurement
42” wide Color Display Module
Remark Resolution : 1366*768
Humidity : 0 ~ 85 % 5
Storage Environment
Temp.: -20 ~ 60 deg Humidity : 0~ 85 %
6
Input Voltage
AC100-240V~, 50/60Hz ≤ 200 W
42” HD
7
LDC Module
HD
983 x 576 x 46
(Maker : LGD)
Unit : mm
0.227 x 0.681 18 EEFL Coating
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
3H
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LGE Internal Use Only
5. Chroma& Brightness (Optical) 5.1. LCD Module the Color Coordinates check condition - 50cm from the surface, Full White Pattern - Picture mode Vivid No.
Item
1.
Luminance
2.
VIew angle (R/L, U/D)
3.
Color Coordinates
Min.
Typ.
400
500
Max.
cd/m2
Unit
178 / 178
degree
Maker
Remark
(W/O PC mode) White RED Green Blue 4.
Contrast ratio
5.
Luminance Variation
Wx
Typ
0.279
Typ
Wy
-0.03
0.292
+0.03
Xr
0.637
Yr
0.335
Xg
0.290
Yg
0.611
Xb
0.145
Yb
0.062 800:1
LGD LGD 42”(HD) LC420WXE-SBA1
1200:1 1.3
6. Component Video Input (Y, PB, PR) Specification
No Resolution
Remark
H-freq(kHz)
V-freq(Hz) 59.94
Pixel Clock(MHz)
1
720* 480
15.73
13.500
SDTV, DVD 480I( 525I)
2
720* 480
15.75
60.00
13.514
SDTV, DVD 480I( 525I)
3
720* 576
15.625
50.00
13.500
SDTV, DVD 576I( 625I) 50Hz
4
720* 480
31.47
59.94
27.000
SDTV 480P
5
720* 480
31.50
60.00
27.027
SDTV 480P
6
720* 576
31.25
50.00
27.000
SDTV 576P 50Hz
7
1280* 720
44.96
59.94
74.176
HDTV 720P
8
1280* 720
45.00
60.00
74.250
HDTV 720P
9
1280* 720
37.50
50.00
74.25
HDTV 720P 50Hz
10
1920* 1080
28.125
50.00
74.250
HDTV 1080I 50Hz,
11
1920* 1080
33.72
59.94
74.176
HDTV 1080I
12
1920* 1080
33.75
60.00
74.25
HDTV 1080I
13
1920* 1080
56.25
50
148.5
HDTV 1080P
14
1920* 1080
67.432
59.94
148.350
HDTV 1080P
15
1920* 1080
67.5
60.00
148.5
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
7. RGB 7.1. Analog PC, RGB- DTV –NOT SUPPORT Specification
No Resolution
H-freq(kHz)
Proposed V-freq(Hz)
Pixel Clock(MHz)
1
640* 350
31.468
70.09
25.17
EGA
2
720* 400
31.469
70.09
28.32
DOS
3
640* 480
31.469
59.94
25.17
VESA( VGA)
4
800* 600
37.879
60.317
40
VESA( SVGA)
5
1024* 768
48.363
60.004
65
VESA( XGA)
6
1280* 768
47.776
59.87
79.5
Remark
VESA( WXGA)
7
1360* 768
47.72
59.799
84.75
VESA( WXGA)
8
1280* 1024
63.668
59.895
109.00
XGA
Only FHD Model
9
1920* 1080
66.587
59.934
138.50
WUXGA(Reduced Blanking)
Only FHD Model
8. HDMI Input 8.1. PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No 1
Resolution 640 x 480
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
31.469
59.94
25.17
Proposed
Remark
VESA( VGA)
2
800 x 600
37.879
60.317
40.00
VESA( SVGA)
3
1024 x 768
48.363
60.004
65.00
VESA( XGA)
4
1280 x 768
47.776
59.87
79.5
VESA( WXGA)
5
1360 x 768
47.72
59.799
84.62
VESA( WXGA)
6
1366 x 768
47.7
60.00
84.62
WXGA
7
1280 x 1024
63.595
60.00
108.875
SXGA
8
1920 x 1080
66.647
59.988
138.625
WUXGA
8.2. DTV Mode Specification
No Resolution
H-freq(kHz)
Remark V-freq(Hz)
Pixel Clock(MHz)
1
720 x 480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
Spec. out
2
720 x 480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
but display.
3
720 x 576
15.625
50.00
13.500
4
720 x 480
31.47
59.94
27
SDTV 480P
5
720 x 480
31.5
60.00
27.027
SDTV 480P
6
720 x 576
31.25
50.00
27
SDTV 576P
7
1280 x 720
44.96
59.94
74.176
HDTV 720P
8
1280 x 720
45
60.00
74.25
HDTV 720P
9
1280 x 720
37.5
50.00
74.25
HDTV 720P
10
1920 x 1080
28.125
50.00
74.25
HDTV 1080I
11
1920 x 1080
33.72
59.94
74.176
HDTV 1080I
12
1920 x 1080
33.75
60.00
74.25
HDTV 1080I
13
1920 x 1080
56.25
50.00
148.5
HDTV 1080P
14
1920 x 1080
67.432
59.94
148.350
HDTV 1080P
15
1920 x 1080
67.5
60.00
148.5
HDTV 1080P
SDTV, DVD 576I(625I) 50Hz
16
1920 x 1080
27
24.00
74.25
HDTV 1080P
17
1920 x 1080
33.75
30.00
74.25
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-8-
LGE Internal Use Only
ADJUSTMENT INSTRUCTION 1. Application Range This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis.
(2) Download steps 1) Execute ‘ISP Tool’ program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the “Connect” button and confirm “Dialog Box”
2. Specification 1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 25 ±5 °C of temperature and 65±10% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100~220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.
3. Adjustment items 3.1. PCB assembly adjustment items (1) Download the MSTAR main software (IC800, Mstar ISP Utility) 1) Using D/L Jig 2) Using USB Memory Stick. (2) Input Tool-Option/Area option. (3) Download the EDID - EDID datas are automatically download when adjusting the Tool Option2 (4) ADC Calibration – RGB / Component (4) Check SW Version.
3) Click the “Config.” button and Change speed I2C Speed setting : 350Khz~400Khz
3.2. SET assembly adjustment items (1) Input Area option (2) Adjustment of White Balance : Auto & Manual (3) Input Tool-Option/Area option (4) Intelligent Sensor Inspection Guide (5) Preset CH information (6) Factoring Option Data input
4. PCB assembly adjustment method 4.1. Mstar Main S/W program download 4.1.1. Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(RGB) jack
4) Read and write bin file. Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
1
Filexxx.bin
Fil
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
1 Filexxx.bin
5) Click “(2)Auto” tab and set as below 6) Click “(3)Run”. 7) After downloading, you can see the “(4)Pass” message.
(3). Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value Caution : Don’t Press “IN-STOP” key after completing the function inspection.
4.3. EDID D/L method Recommend that don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If not possible, recommend that connect the MSPG equipment. There are two methods of downloading the edid data
4.1.2. Using the Memory Stick * USB download : Service Mode 1) Insert the USB memory stick to the ISB port. 2) Automatically detect the SW Version. -> S/W download process is executed automatically. 3) Show the message “Copy the file from the Memory”
4.3.1. 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2. Automatically downloaded when pushing the enter key after adjusting the tool option2. It takes about 2seconds.
4) After Finished the Download, Automatically DC Off -> On 4.3.2. 2nd Method * Caution : Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well. 1) Press the ADJ key 2) Move to the EDID D/L and Press the right direction key(G) 3) Press the right direction key(G) at Start. 4) After about a few seconds, appear “OK”, then compele.
5) Check The update SW Version.
4.2. Input tool option. Adjust tool option refer to the BOM. - Tool Option Input : PCBA Check Process - Area Option Input : Set Assembly Process
4.3.3. RS-232C command Method (1) Command : AE 00 10
After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)
* Caution Don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If the cables are connected, Downloading of edid could be failed.
(1) Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market (2) Equipment : adjustment remote control.
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
4.3.4. EDID data (1) Analog(RGB): 128bytes>
4.4. ADC Calibration 4.4.1. ADC Calibration - Component (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to Component1 or 2 mode. 2) Input the Component 480i@60Hz 100% Color Bar YPbPr signal into Component1 or 2. (MSPG-925F Model: 209 / Pattern: 65 )
(2) HDMI 1 : 256Bytes
3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : Component” by using D/E (CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear (3) HDMI 2 : 256Bytes
OK
4.4.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to RGB mode.. 2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : RGB” by using D/E(CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear OK
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
4.5. Check SW Version
5.2. Adjustment of White Balance
(1) Method 1) Push In-star key on Adjust remote-controller. 2) SW Version check Check “SW VER : V3.xx” – LH70
: (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC CommunicationWhite Balance Mode. (1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode)
5. PCB assembly adjustment method 5.1. Input Area-Option (1) Profile : Must be changed the Area option value because being different of each Country’s Language and signal Condition. (2) Equipment : adjustment remote control. (3) Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.)
(3) Enter the adjust mode of white balance) - Enter the white balance adjustment mode with aging command (F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)
Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value.
* White Balance Adjustment - Purpose : Adjust the color temperature to reduce the deviation of the module color temperature. - Principle : To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. - Adjustment mode : Three modes – Cool / Medium / Warm - Required Equipment 1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product LCD TV( ch : 9 ), (should be used in the calibrated ch by CS-1000) 3) Auto W/B adjustment instrument(only for Auto adjustment)
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.3. Adjustment of White Balance
- 12 -
(for Manual adjustment) (1) Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting. (3) For manual adjustment, it is also possible by the following sequence. 1) Select white pattern of heat-run by pressing “POWER ON” key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.) 2) Push “Exit” key. 3) Change to the AV mode by remote control. 4) Input external pattern (85% white pattern) 5) Push the ADJ key -> Enter “0000” (Password) 6) Select “3. W/B ADJUST” 7) Enter the W/B ADJUST Mode 8) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.. 9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 10) Adjust three modes all (Cool / Medium / Warm) : Fix the one of R/G/B gain and change the others 11) When adjustment is completed, Enter “COPY ALL”. 12) Exit adjustment mode using EXIT key on R/C. LGE Internal Use Only
* CASE First adjust the coordinate far away from the target value(x, y). 1. x, y > target i) Decrease the R, G. 2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode
x
y
Temp
uv∆
Cool
0.276±0.002 0.283±0.002
11,000K
0.000
Medium
0.285±0.002 0.293±0.002
9,300K
0.000
Warm
0.313±0.002 0.329±0.002
6,500K
0.003
To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 -
LGE Internal Use Only
TROUBLESHOOTING No power (LED indicator off)
:
[A] PROCESS
Fail
Check short of Main B/D or Change Power B/D
Fail
Check short of IC1001, IC1003, IC1007
Check 24V, 12V, 5,2V of Power B/D Pass
Check Output of IC1001, IC1003, IC1007
Fail
Re-soldering or Change defect part of IC1001, IC1003, IC1007
Pass Pass Change IC1002,, Q1003 Fail Check LEDAssy
Change LEDAssy
Pass
Check P307 Connector
No Raster
[B]: Process
Pass
Check LED status On Display Unit
Fail
Repeat A PROCESS
Pass
Check Panel Link Cable Or Module
Fail
Change Panel Link Cable Or Module
Fail
Change Inverter Connector Or Inverter
Pass
Check Inverter Connector Or Inverter Pass
Check Output of IC802
Fail
Change IC802
Pass Check LVDS Cable
Fail
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Change Module
- 14 -
LGE Internal Use Only
No Raster on PC Signal
Pass Check Input source Cable and Jack Pass Check the Input/Output Of J104
Fail
Re-soldering or Change the defect part
Pass Check the Input/Output Of IC100
Fail
Re-soldering or Change the defect part, Check RGB EDID Data
Pass Check the Input/Output Of IC800
Fail
Re-soldering or Change the defect part
Pass Repeat [A], & [B] Process
No Raster on HDMI Signal
No Raster on COMMPONENT Signal
Pass
Pass
Check Input source Cable And Jack
Check Input source Cable And Jack
Pass
Pass Check The Input/Output Of JK101
Check the Input/Output Of JK301, JK302, JK303
Fail
Re-soldering or Change the defect part
Check the Input/Output Of IC300, IC301, JK302
Fail
Re-soldering or Change the defect part
Pass
Pass Check the Input/Output Of IC800
Fail
Re-soldering or Change the defect part
Fail
Re-soldering or Change the defect part Check HDMI EDID Data Re-download HDCP
Pass Check the Input/Output Of IC800
Fail
Re-soldering or Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
LGE Internal Use Only
No Raster On AV (Video, S-Video)Signal
No Signal On TV(RF) Signal
Pass
Pass
Check Input source Cable And Jack
Check Input source Cable And Jack
Pass Pass Check The Input/Output Of JK101, JK201
Fail
Re-soldering or Change the defect part
Check The Input/Output Of TU500
Fail
Re-soldering or Change the defect part
Pass Pass Check the Input/Output Of IC800
Fail
Re-soldering or Change the defect part
Check the Input/Output Of IC800
Pass
Fail
Re-soldering or Change the defect part
Pass
Repeat [A], & [B] Process
Repeat [A], & [B] Process
No Sound
Check The Input Sourse.
Fail
Change The Source Input.
Pass
Check The Input/Output Of IC600.
Fail
Re-soldering or Change the defect part.
Pass
Check The Speaker.
Fail
Change Speaker.
Pass
Check The Speaker Wire.
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
AV2 ( Sid e AV)
HDMI3
USB
USB Fo r D/ L
RS232
TV ( RF)
AV1
MNT_OUT
COMP1 COMP2
RGB_PC
PC_Aud io
EEPROM 24C02
SIDE_V : 1Vp p
SIF
SUB_SCL / SDA
PC_SCL/ SDA
EEPROM 24C02 HDMI3_SCL/ SDA
AUDIO AMP
HDMI1_SCL/ _ SDA
HDM 2_SCL/ SDA
232C Driver ST3232C
SIDE_L/ SIDE_R :5 00mVrms
TMDS
Tx/ Rx : ± 15Vp p
TUNER
TU_MAIN
MNT_LOUT/ ROUT: 500m Vrm s
AV11_LIN/ RIN :5 00m Vrms
MNT_OUT: 1Vp p
AV1_VIN: 1Vp p
COMP2_Y/ Pb /Pr / : 1/ 0. 7Vp p Co mp 1_L/ R :5 00mVrms Co mp 2_L/ R :5 00mVrms
Pr : 1/ 0. 7Vp p COMP1_Y/ Pb / P
PC_R/ G/ B/ HS/ VS
EEPROM 24C02
EEPROM 24C02 PC_Aud io _L/ R :7 00m Vrms
TMDS TMDS
AV2_VIN
AV2_LIN/ RIN
HDMI_DATA_3
USB_DN/ PN
IIS_OUT
OUT_O_TX_A± OUT_O_TX_A OUT_O_TX_B OUT_O_TX_B± OUT_O_TX_C OUT_O_TX_C± OUT_O_TX_CLK± OUT_O_TX_C OUT_O_TX_D OUT_O_TX_D± OUT_O_TX_E OUT_O_TX_E±
OUT_E_TX_A OUT_E_TX_A± OUT_E_TX_B OUT_E_TX_B± OUT_E_TX_C OUT_E_TX_C± OUT_E_TX_CLK OUT_E_TX_CLK± OUT_E_TX_D ± OUT_E_TX_ OUT_E_TX_E ± OUT_E_TX_
MAIN SCALER
TXD / RXD :5V Dig it al
SIF
TU_MAIN
MNT_L/ R OUT
AV1_LIN/ RIN
MNT_VOUT
AV1_VIN
COMP2_LIN/ RIN
COMP2_Y/ Pb / Pr: 1/0. 7Vp p MNT_OUT RIN COMP1_LIN/
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p
PC_R/ G/ B/ HS/ VS
PC_Aud io _L/ R
IR HDMI_DATA_1 HDMI_DATA_2 TX
DDR2( 512MB)
EEPROM( 256K)
Serial Flas h ( 8MByt e)
PWM NTP3100L R_CH L_CH
L VDS c onnec tor
HDMI1 HDMI2
R_SPK_OUT L_SPK_OUT
BLOCK DIAGRAM
LGE Internal Use Only
EXPLODED VIEW IMPORTANT SAFETY NOTICE
806
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
A10 310
510
300
500
120
A2
900
200
A5
LV1
530
550
802
803
801
804
805
540
521
400
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
- 18 -
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
AUDIO_R
MNT_ROUT
MNT_LOUT
MNT_VOUT
C100
POP NOISE
MUTE_LINE
16V 10uF C101 R101 0 HOTEL_OPT
SPK_R+_HOTEL
POP NOISE
MUTE_LINE
16V 10uF
SPK_R-_HOTEL
C B E
Q101 RT1C3904-T112 E
B
Q100 RT1C3904-T112
16V100uF C102
C
R105 0 HOTEL_OPT R106 0 NON_HOTEL_OPT
C103 100pF READY
R103 0 HOTEL_OPT
R102 75
[YL]O-SPRING_B
D103 30V NON_HOTEL_OPT
6
7
3
SHIELD
5
4
2
C-LUG4
C-LUG3
0-SPRING
C-LUG2
C-LUG1
ZD107 SD05
ZD106 SD05
D106 30V
D107 30V
R122 75
R121 75
S-VIDEO
R123 10K
S-VIDEO
SIDE_C
C104 OPT READY
SIDE_Y
+3.3V_MULTI_MST
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GND
1
S-VIDEO JK101 PSJ014-01
6L
5L
7K
6J
5J
JK100 PPJ226-01
S_VIDEO_DET
[RD]CONTACT_B
[RD]O-SPRING_B
D102 30V NON_HOTEL_OPT
[WH]C-LUG_B
[YL]CONTACT_B
S-VIDEO(China Model)
MNT_OUT
3H [RD]CONTACT_A_2
4H [RD]O-SPRING_A_2
9H [RD]2P_CAN
8G [WH]C-LUG_A_2
9G [WH]2P_CAN
3F [YL]CONTACT_A
4F [YL]O-SPRING_A
9F [YL]2P_CAN
3E [RD]CONTACT_A_1
4E [RD]O-SPRING_A_1
9E [RD]1P_CAN_2
8D [WH]C-LUG_A_1
9D [WH]1P_CAN
8C [RD]C-LUG_A
9C [RD]1P_CAN_1
8B [BL]C-LUG_A
9B [BL]1P_CAN
3A [GN]CONTACT_A
4A [GN]O-SPRING_A
9A [GN]1P_CAN
SD05 ZD105
ADUC30S03010L_AMODIODE
D105 30V
D104 30V
ZD104 SD05
D100 30V
D101 30V
ZD100 SD05
ZD101 SD05
ZD102 SD05 SD05 ZD103
COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100
EAX56856904 H6 LCD MERCURY
10K
10K
R112 220K
R116 10K
R111 220K
R115 10K
R110 75
R100 220K
R113
R104 220K
R114
R107 75
R108 75
R109 75
R120 12K
R119 12K
R117 12K
R118 12K
CVBS_RIN
CVBS_LIN
CVBS_VIN
COMP2_R
COMP2_L
COMP2_PR
COMP2_PB
COMP2_Y
COMPONENT1 AV1
LGE Internal Use Only
INPUT1
MSTAR N-EU
1
9
2008/12/16
INPUT1 : COMPONENT1, S-VIDEO
2
5
4
7
R2IN 8
T2OUT
V- 6
C2-
C2+
C1- 3
V+
1
0
0
R230
JK201
JK204
R204 4.7K
2C[RD]U_CAN
5C[RD]CONTACT
4C[RD]O_SPRING
2B[WH]U_CAN
3B[WH]C_LUG
2A[YL]U_CAN
0
R201
D208 30V READY
USB_DP
USB_DL_P
5.6B ZD203
5.6B ZD202
D205 30V
D206 30V
R227 75
RXD TXD
0 R237 Non_OCP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D207 30V READY
Itís possibel to 27~47ohm R200 USB_DN USB_DL_N 0
1A Design
C210 10uF 6.3V
220uF 16V
C212
L201 500
100uF 16V
C214
R205 4.7K
IR_OUT
D201 ADUC30S03010L_AMODIODE 30V
D200 ADUC30S03010L_AMODIODE 30V
+3.3V_MST
100
100
5A[YL]CONTACT
Close to SIDE_USB
**
R203
R202
4A[YL]O_SPRING
9 R2OUT
10 T2IN
PPJ218-01
SIDE_USB
REAR_USB
USB_DL_P
USB_DL_N
REAR_USB R229
USB
R1OUT
11 T1IN
12
13 R1IN
14 T1OUT
15 GND
16 VCC
IC200 ST3232CDR
SIDE AV
C202 0.1uF
C201 0.1uF
C200 0.1uF
C1+
KJA-UB-4-0004
+3.3V_MST
REAR_USB JK205
R222 220K
READY
R225
R223 220K
READY
R224
10K
10K
JK200
10
GND 2 ENABLE 3
5 ILIMIT 4 FAULT/
VIN 1
6 VOUT
IC202 OCP_READY MIC2009YM6-TR
Pin to Pin with EAN43439401
SIDE_RIN
SIDE_LIN
9
8
7
6
C A
KDS226 D213
AC
OCP_READY
5
4
3
2
1
R210 4.7K OCP_READY
C208 0.1uF OCP_READY
L200 120OHM OCP_READY
R238 510 OCP_READY
C209 10uF OCP_READY
+5V_USB
SHILED
15
14
13
12
11
VSS
A2
A1
A0
4
3
2
1
5
6
7
8
SDA
SCL
WP
R218 100
R217 100
R220 4.7K
C204 0.1uF
+5V_MULTI
C
R221 4.7K
10K
10K
R234
R232 220K
R231 220K
R233
PC_B ZD201 SD05
ZD200 SD05
30V
PC_AUD_L
PC_AUD_R
DDC_WP DSUB_SCL DSUB_SDA
R236 12K
R235 12K
R213 75
PC_G
PC_R
ADUC30S03010L_AMODIODE 30V
C207 0.1uF
C206 0.1uF
R212 75
C205 0.01uF
+5VST_MST
D203 30V CDS3C30GTH
D202 30V CDS3C30GTH
R211 75
C
D209
R215 4.7K
R214 4.7K
R208 68
R207 68
PC_VS
DSUB_SCL
C211 68pF
PC_HS
DSUB_SDA
C213 68pF
D204 ADUC30S03010L_AMODIODE
INPUT2
MSTAR N-EU
2
9
2008/12/16
INPUT2 : PC,RS-232C,SIDE AV,USB
READY
R219 4.7K
SHIELD_PLATE
R216 100
T_TERMINAL2 8
B_TERMINAL2
T_SPRING
R_SPRING
6B
7B
5
4
B_TERMINAL1
7A
E_SPRING T_TERMINAL1
3
DDC_GND
DDC_CLOCK
SYNC_GND
GND_1
V_SYNC
NC
BLUE
H_SYNC
BLUE_GND
GREEN
DDC_DATA
GREEN_GND
RED
GND_2
RED_GND
6A
VCC
IC201 CAT24C02WI-GT3
PC EDID
PEJ024-01
16
10
9
8
7
6
PC SOUND JK203
5
4
3
2
1
6630TGA004K
KCN-DS-1-0089
JK202
PC A AC
KCN-DS-1-0088
R209 1K OCP_READY
OCP_READY R206 160
R228 12K
12K
R226
SIDE_V
IR_OUT
UB01123-4HHS-4F
C203 0.1uF
1
2
3
5 4
1 2 3 4
ENKMC2837-T112 D210
RS-232C (CI ITEM) C
ENKMC2837-T112 D211
AC
A AC
A
ENKMC2837-T112 D212
EAX56856904 H6 LCD MERCURY
USB DOWN STREAM 5
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes USB DOWN STREAM
LGE Internal Use Only
21
22
E
2SC3875S
21
20 JACK_GND
1 DATA2+
.
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
11 10 CLK+
12
13
14
15
16
17
18
19
B
Q300C
JK301 QJ41193-CFEE1-7F
R300 10K
.
R302 1K
RT1C3904-T112
20 JACK_GND
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
11 10 CLK+
12
13
14
15
16
17
18
19
JP301
+5V_HDMI_1
JP300
A2
4
3
5
6
7
8
SDA
SCL
WP
VCC
4
3
2
1
TMDS1_RX2+
CEC TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+ TMDS1_RX1TMDS1_RX1+ TMDS1_RX2-
VSS
A2
A1
A0
5
6
7
8
SDA
SCL
WP
VCC
IC300 CAT24C02WI-GT3
TMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ TMDS2_RX1TMDS2_RX1+ TMDS2_RX2TMDS2_RX2+
CEC TMDS2_RXC-
VSS
2
1
A0
E
A1
IC301 CAT24C02WI-GT3
R303 1K
C
JK302 QJ41193-CFEE1-7F
22
B
RT1C3904-T112
R301 10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HPD_MST_1
HPD_MST_2
Q301
+5V_HDMI_2
JP303
JP302
R307 100
R306 100
R331 100
R305 100
R304 100
R327 100
A2
R308 R310 10K 10K
C302 0.01uF
D300 KDS184S
+5V_HDMI_1
+5V_MULTI
R309 R311 10K 10K
DDC_WP
HPD_MST_3
DDC_SDA1 DDC_SCL1
DDC_WP
DDC_SDA2 DDC_SCL2
D301 KDS184S
A1 C301 0.01uF
C
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
10 CLK+
11 CLK_SHIELD
12 CLK-
13 CEC
14 NC
15 SCL
16 SDA
17DDC/CEC_GND
18 +5V_POWER
E
Q303 BSS83 CEC_READY D B G S
JP305
JP304
VSS
A2
A1
A0
D304 CDS3C30GTH 30V CEC_READY
R313 0
D303 MMBD301LT1G 30V CEC_READY
R315 68K CEC_READY
+3.3V_MST
R316 56K CEC_READY
TMDS3_RXC+ TMDS3_RX0TMDS3_RX0+ TMDS3_RX1TMDS3_RX1+ TMDS3_RX2TMDS3_RX2+
4
3
2
1
SDA
SCL
WP
VCC
CEC
CEC_C
5
6
7
8
IC302 CAT24C02WI-GT3
CEC TMDS3_RXC-
R314 1K
RT1C3904-T112
Q302C 2SC3875S
19 HPD
B
KJA-ET-0-0032 JK303
20
JACK_GND
R312 10K
+5V_HDMI_3
R318 100
R317 100
R329 100
A2 C300 0.01uF
DDC_SDA3 DDC_SCL3
DDC_WP
HDMI
MSTAR N-EU
R319 R320 10K 10K
D302 KDS184S
+5V_HDMI_3
+5V_MULTI
MST_HPD : USE MST HPD
3
9
2008/12/16
SW_HPD : USE SW HPD (Default)
OPTION
A1
+5V_MULTI +5V_HDMI_2
A2
2SC3875S
A1
C
EAX56856904 H6 LCD MERCURY
C
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
.
.
8
ZD401
ZD402
LED_R
LED_B
IR
GND
C414
19_22_26"
C402 100pF 50V
19_22_26" L405 BG1608B121F
0
READY
R400
0.1uF READY +3.3V_MST
R426 47K IR-OUT B
IR
R428 10K IR-OUT
E Q405 2SC3052 IR-OUT
C
R427 10K IR-OUT
+5VST_MST
NON_19_22_26"
C411 0.1uF
KEY2
KEY1
+3.3V_MULTI_MST
R418 0 READY
C B Q402 E 2SC3052 19_22_26"
R415 10K 19_22_26"
R414 10K 19_22_26"
+3.3V_MST
SUB_SCL
R406 4.7K 19_22_26"
+3.3V_MST
LED_R
B
C Q404 2SC3052 E IR-OUT
R429 10K IR-OUT
+5VST_MST
R430 22 IR-OUT
IR_OUT
KEY2
KEY1
19_22_26"
19_22_26"
L401 BG1608B121F
19_22_26" L400 BG1608B121F
C400 100pF 50V
C401 GND 100pF 19_22_26" 50V
KEY2
KEY1
3
2
1
SMAW200-03
19_22_26" P404
CONTROL KEY (19/22/26")
IR(19/22/26")
0 NON_19_22_26"
0.1uF NON_19_22_26" 16V R403
L407 120-ohm
+3.3V_MULTI_MST
NON_19_22_26" NON_19_22_26" R417 0
ZD400
C406 47uF 16V
L404 120-ohm
C408 0.1uF
R421 4.7K
+3.3V_MST
NON_19_22_26"
+5VST_MST
NON_19_22_26"
C412 470pF
L402 120ohm C403 C407 47pF
R404 10K 19_22_26" R416 0 READY C R410 10K 19_22_26" B Q401 E 19_22_26" 2SC3052
19_22_26" L408 BG1608B121F
C405 100pF 50V 19_22_26"
READY R413 0
5V_ST
GND
KEY2
KEY1
POWER_ON(LED_R_SMALL)
ST_3.3V(LED_B)
GND
IR
WARM_ST(LED_R_BIG)
GND
5V_ST
KEY2
KEY1
GND
SDA
SCL
C404 470pF
NON_19_22_26"
L406 120ohm
NON_19_22_26"
L403 120ohm
NON_19_22_26"
R420 4.7K
SUB_SDA
SUB_SCL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
9
7
6
5
4
3
2
1
19_22_26" P405
13
12
11
10
9
8
7
6
5
4
3
2
1
12507WS-12L
P400
NON_19_22_26"
L411 500-ohm NON_19_22_26" L410 500-ohm NON_19_22_26"
52
FHD
3 4 5
5
HD(26/32/37/42/47")
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
100
READY
R409
NON 22/27" FHD R425 0 R431 0 NON 22/27" FHD
TXCO4-
TXCO4+
TXCO3-
TXCO3+
TXCLKO-
TXCLKO+
TXCO2+ TXCO2-
TXCO0+ TXCO0TXCO1+ TXCO1-
TXCE4-
TXCE4+
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
8BIT(HD) 8BIT(FHD) 52 sharp 32 sharp
X X X X
NON 22/27" FHD R423 0
+3.3V_MULTI_MST
R424 0 VESA
R407 4.7K JEIDA
R402 X 0 0 0 X
*8BIT(FHD):22/27"
R401 R402 0 8 B I T o r 5 2 s h a r p 10BIT(FHD) 4.7K
R401 4.7K 10BIT
+3.3V_MULTI_MST
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
9 10
8
7
8
7
6
2
4
6
1
3
TXCE0+ TXCE0TXCE1+
P402 FF10001-30
2
NON 22/27" FHD R419 0 R422 0 NON 22/27" FHD
+5V_+12V_LCD
+5V_+12V_LCD
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
0
MSTAR LVDS,CTR KEY
External VBR
E-DIM
OPC_OUT
OPC_OUTPUT
OPC_EABLE C B OPC_EN OPC_ENABLE E Q400 RT1C3904-T112
R411 1K
OPC_ENABLE
OPC_ENABLE
R412
R405 READY 0
R435 470 OPC_ENABLE
+3.3V_MULTI_MST
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
P403
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SMW200-28C
4
9
2008/12/16
HD(19/22")
+5V_+12V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
PANEL WAFER
1
TF05-51S
P401
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
IR(Non 19/22/26) CONTROL KEY(Non 19/22/26)
EAX56856904 H6 LCD MERCURY
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
READY
B
C503 0.1uF 50V
E Q502 ISA1530AC1 C
R507 220
R506 220
120-ohm
L501 0 0 Ohm
L501-*1
C504 READY
C509 100uF 16V
+5V_TUNER
C506 100uF 16V
TV_MAIN
21
NTSC_TUNER
16
15
14
13
12
11
10
9
8
7
6
5
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SHIELD
20 NC_9
SHIELD
18
17
20
MAIN_SIF
M_SCL
M_SDA
C505 100uF 16V
Near the pin
19 NC_8
R502 4.7K
R505 47
R504 47
C508 10uF 16V
3
19
C507 82pF READY
C502 27pF
C501 0.01uF
+5V_TUNER
2
1
NC_9
NC_8
NC_7
NC_6
SIF-OUT
A-OUT
NC_5
V-OUT
NC_4
MOPLL_AS
SCL
SDA
GND_2
NC_3
TP[3.3V_OPT]
RF_AGC
NC_2
+B[5V]
GND_1
NC_1
TAFT-H203F
TU500-*1
15 A-OUT 16 SIF-OUT 17 NC_6 18 NC_7
14 NC_5
L502 10uH READY
9 SDA 10 PAL_TUNER SCL C500 27pF 11 MOPLL_AS 12 NC_4 13 V-OUT
21
120-ohm
L500
6 TP[3.3V_OPT] 7 NC_3 8 GND_2
5 RF_AGC
3 +B[5V] 4 NC_2
1 NC_1 2 GND_1
TU500 TAFT-Z203D
EAX56856904 H6 LCD MERCURY
MSTAR TUNER
5
9
2008/12/16
R624
READY
4
SPK_L+
C600 10uF 16V
C604 10uF 16V
6
7
VSS_IO
CLK_I
+1.8V_DVDD
C607 0.1uF 50V
C609 10uF 16V
14
12
AVDD_PLL
13
11
LFM
TEST0
10
AGND_PLL
DVDD_PLL
9
DGND_PLL
8
5
DVSS_1
VDD_IO
4
3
2
1
AD
RESET
VDR1A
BST1A
C611
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3
SPK_L-
2
SMAW250-04
P600
+1.8V_DVDD
+1.8V_AVDD
C602 0.1uF
+3.3V_MULTI_MST
C608 R601 100 1uF C606 1000pF
C605 C603 0.1uF 1000pF C601 100pF R600 3.3K
+1.8V_AVDD
I2S_MCLK
Q603 RT1C3904-T112
SPK_R+
0
0 R631 22KREADY R627
E
SPK_R-
READY
10KB
1
MULTI_PW_SW
SW_RESET
R629
C
R630 10K
+3.3V_MST
+1.8V_DVDD
22000pF
PGND1A_2
56
MLB-201209-0120P-N2 0LCML00003B
C610 0.1uF
PGND1A_1
C642 10uF 35V
C615 0.1uF
C617 0.1uF
IC600 NTP-3100L
R602 R603 100 100
C638 33pF 50V READY
+16V_NTP
C612 330uF 35V
C616 22000pF
C613 0.01uF
R604 3.3
Main AMP
55
L605
OUT1A_2 54 17 100 R676
SDATA
18 WCK 100 R677
120-ohm
OUT1A_1 53
READY
PVDD1A_2 52
+1.8V_AVDD
SDA
19 BCK 100 R678
120-ohm
PVDD1A_1 51 20
MLB-201209-0120P-N2
PVDD1B_2 50 21 SCL
15
PVDD1B_1 49 22 MONITOR_0
23
0LCML00003B
OUT1B_2 48
C639 33pF 50V READY
C614 1uF
R673 0 C651 1000pF 50V
24 MONITOR_2
L606
OUT1B_1 47 25 FAULT
+1.8V
PGND1B_2 46 VDR2B
EAX56856904 H6 LCD MERCURY
PGND1B_1 45
MONITOR_1
I2S_SDO I2S_WS I2S_SCK M_SDA M_SCL AMP_MUTE_HOTEL
DVSS_2
BST1B 44
26
R656 0 HOTEL_OPT
16 DVDD
VDR1B 43
27 BST2B
28 PGND2B_1
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
R611 12
VDR2A BST2A PGND2A_2 PGND2A_1 OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2 PVDD2B_1 OUT2B_2 OUT2B_1 PGND2B_2
40 39 38 37 36 35 34 33 32 31 30 29
C626 0.1uF
+16V_NTP
R623 4.7K
R663 4.7K
C671 0.01uF
R625 3.3
R626 3.3
C672 0.01uF
R621 12
C634 390pF 1S 1F EAP38319001 R654 12
C673 0.47uF
SPK_L-
R658 R653 12 12 C630 L607 390pF 2S DA-8580 2F
C669 0.1uF
C637 0.1uF
C629 0.1uF
C632 0.47uF
C625 22000pF
C624 1uF
MULTI_PW_SW
C623 22000pF
NC
41
1S 1F EAP38319001
L603 2S DA-8580 2F
42
C618 1uF
C621 390pF R610 R638 12 12
C619 390pF
R608 12
C643 0.1uF
C644 0.1uF
R667 4.7K
R628 4.7K
SPK_L-
SPK_L+
C647 0.01uF
R635 3.3
R671 3.3
C648 0.01uF
SPK_R-
SPK_R+
MNT_ROUT
B
C
E
B
AMP_MUTE_HOTEL
R613-* 12K
R614 5.6K
C631 33pF
R613 10K
NON_HOTEL_OPT
R609 1K
C633 33pF
R615 5.6K
GND 11
8 9
AUDIO
10
6
9
2008/12/16
6
SPK_R-_HOTEL
5
4
3
2
P601 12505WR-09A00 HOTEL_OPT 1
7
OUT3 8
SPK_R+_HOTEL
R619 0
HOTEL_OPT
R620 0 C636 HOTEL_OPT 0.1uF HOTEL_OPT
+16V_NTP
7 OUT2
6 INPUT2- INPUT3- 9
5 INPUT2+ INPUT3+ 10
4 VCC
3 INPUT1+ INPUT4+ 12
2 INPUT1- INPUT4- 13
E
MSTAR N-EU
R612 200 B HOTEL_OPT
AUDIO_R
R622 6.8K
C635 0.01uF
R618 6.8K
1 OUT1 LM324DOUT4 14
IC601
R617 SW_RESET 10K HOTEL_OPT C Q602 RT1C3904-T112 HOTEL_OPT
+3.3V_MULTI_MST
R616-* 12K
HOTEL_OPT
R616 10K
NON_HOTEL_OPT
Chinese Hotel Option
R606 4.7K
Q601 RT1C3904-T112
C622 0.1uF
C628 6800pF
MNT_R_AMP
R607 1K
+12V_AUDIO
C627 6800pF
MNT_L_AMP
R605 4.7K
E
+12V_AUDIO
MNT_LOUT
Q600 RT1C3904-T112
C620 0.1uF
C
HOTEL_OPT
AMP :GAIN X 4 +12V_AUDIO
4
3
2
1
VSS
A2
A1
A0
1K
0
4
3
2
1
1K
150
SDA
SCL
WP
VCC
2K
R886
22
22
R8000 10K
Q800 ISA1530AC1
B E C
C870 47uF 25V
R885
220
R807 402 READY
R808
E B C Q801 ISA1530AC1
+12V_AUDIO
5
6
7
8
R813
R812
C803 0.01uF
R8028 4.7K
22
22
EEP_SDA
EEP_SCL
EEP_SDA
EEP_SCL
R888 C814 0.1uF
C8000 READY
1K
R853
D802 KDS181
MNT_VOUT_T
SW800 JTP-1127WEM
+5VST_MST
R810 68
R8041 C B E 47 Q802 RT1C3904-T112
R809 470
R8006
R8005
R817 4.7K
+3.3V_MULTI_MST
R8027 4.7K
+3.3V_MULTI_MST
100
C871 4.7uF 10V READY
R887 33K
E
Q803 RT1C3904-T112
R855 10K
+5VST_MST
C
D803 KDS181
C812 4.7uF
+5VST_MST
C819
C815
C833
0.1uF
0.1uF
0.1uF
L800 120-ohm
C810
C838
SYS_RESET
MULTI_PW_SW
POWER_DET
RL_ON
MNT_L_AMP MNT_R_AMP
SIDE_LIN SIDE_RIN
MAIN_SIF
MNT_VOUT_T
TV_MAIN
COMP2_PR SIDE_C SIDE_Y CVBS_VIN SIDE_V
COMP2_PB COMP2_Y
PC_R
PC_B PC_G
0.01uF
0.1uF
C804/C805/C806:Close to IC as close as possible
Q804 NON 19_22" RT1C3904-T112 R8037 C B R8007 33K E NON 19_22" 0
NON 19_22"
2.2uF 16V
B
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RESET
R861
D801 KDS181
R8001
R8036 20K 19_22_26"
R860
R800 READY 0
SDA
SCL
WP
VCC
IC803 CAT24WC08W-T
5
6
7
8
P_24V_SMALL_15V P_12V_SMALL_15V
MNT_VOUT
GAIN X 4
R8004 4.7K
HDCP EEPROM
VSS
A2
A1
A0
IC801 24LC256-I/SM
3 1
EEPROM
8 SO/SIO1 WP/ACC 9
SPI_DO
2
4
C841
0.1uF 0.1uF 2.2uF 2.2uF 100 100 100 100
C856 C861 R882 R881 R846 R847
0.047uF 0.047uF 0.047uF
0.047uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF
0.047uF
0.047uF
C868 C869
C834 C836 C837
C826 C828 C835 C830 C800 C801 C831 C832
+1.2V_VDDC_MST
22K 0.01uF
R845
47 47
R875 R876
22K 0.01uF
47 47 47
R831 R857 R830
R842 C839
47 47 470 47 47 47 47 47
R832 R834 R835 R837 R804 R815 R897 R802
C829
C827
47
10 10
R891 R892
47
10 10
R880 R890
R836
10 10 10 10 10 10
R869 R871 R872 R873 R874 R879
R833
10 10
R859 R862
390 0.1uF 0.1uF 0.1uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF
10 10 10 10
R851 R854 R856 R858
R814 R803 R816 R818 R838
C866 10uF
R840 C804 C805 C806 47 C843 470 C846 47 C845 47 C847 47 C825
TMDS1_RX2TMDS1_RX2+ HPD_MST_1
TMDS1_RX1TMDS1_RX1+
TMDS2_RX2TMDS2_RX2+ TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+
TMDS2_RXCTMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ HPD_MST_2 TMDS2_RX1TMDS2_RX1+
C867 0.1uF
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
POWER_SW SYS_RESET CEC_C PC_VS PC_HS 0 0 R8035 R8034
TXD LED_R
100 100 R895 R849
IR DSUB_SDA RXD 100 100 R850 R8012
RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA REXT VCLAMP REFP REFM BIN1P SOGIN1 GIN1P RIN1P BINM BIN0P GINM GIN0P SOGIN0 RINM RIN0P AVDD_33_3 GND_2 BIN2P GIN2P SOGIN2 RIN2P CVBS6 S-VIDEO CVBS5 CVBS4 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_4 CVBSOUT GND_3 SIF0P SIF0M VDDC_1 AUL5 AUR5 AUVRM AUOUTL2 AUOUTR2 AUOUTL1 AUOUTR1
Close to IC with width trace
HDMI_2
0.1uF
KEY2 KEY1
0 0 READY READY R8016 R8017
100 100 R824 R825
C816 20pF
C817 20pF X801 12MHz R839 1M
+3.3V_MULTI_MST
10uF 16V 0.1uF 1000pF 4.7uF C809 C813 C818 C820
HDMI_1
GND
100
C883
TXD RXD EEP_SCL EEP_SDA RL_ON I2S_SDO I2S_SCK R8022 R8021 100 100
I2S_WS I2S_MCLK PANEL_STATUS R829
0.1uF C844
MST99A88ML(MATRIX BASIC)
IC800
R863 R864
4.7K 4.7K
HDMI_3
+3.3V_MULTI_MST
R867 1K R884 1K READY
R883 1K
100
0.01uF
C850
DDR2_D[13] DDR2_D[10] DDR2_D[8] DDR2_D[15]
R8018
DDR2_D[6] DDR2_D[1] DDR2_D[3] DDR2_D[4]
DDR2_D[14] DDR2_D[9] DDR2_D[12] DDR2_D[11]
1K
DDR2_A[6] DDR2_A[4] DDR2_A[2] DDR2_A[0] AR815 56
AR813 56
AR812 56
DDR2_CKE 56
DDR2_A[11] DDR2_A[8] DDR2_BA1 DDR2_WEZ AR814 56
1 2 3 4 5
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
R893 4.7K
AUOUTR1
AUOUTL1
AUOUTR2
AUOUTL2
AUVRM
AUR5
AUL5
VDDC_1
SIF0M
SIF0P
GND_3
CVBSOUT
AVDD_33_4
VCOM0
CVBS0
VCOM1
CVBS1
CVBS2
CVBS3
CVBS4
CVBS5
CVBS6
RIN2P
SOGIN2
GIN2P
BIN2P
GND_2
AVDD_33_3
RIN0P
RINM
SOGIN0
GIN0P
GINM
BIN0P
BINM
RIN1P
GIN1P
SOGIN1
BIN1P
REFM
REFP
VCLAMP
REXT
HOTPLUGA
21
22
23
24
25
26 27 28 29 30
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
MSTAR
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
C858 0.01uF
C859 0.01uF
B_DDR2_DQS[0]
B_DDR2_DQSB[0]
AVDD_DDR_3
VDDP_4
GND_12
B_DDR2_DQS[1]
B_DDR2_DQSB[1]
AVDD_DDR_4
B_MDATA[15]
B_MDATA[8]
GND_13
B_MDATA[10]
B_MDATA[13]
AVDD_DDR_5
B_MDATA[7]
B_MDATA[0]
B_MDATA[2]
B_MDATA[5]
B_MCLK
B_MCLKZ
TXCE4TXCE4+ TXCE3TXCE3+ TXCLKETXCLKE+ TXCE2TXCE2+ TXCE1TXCE1+ TXCE0TXCE0+
TXCO4TXCO4+ TXCO3TXCO3+ TXCLKOTXCLKO+ TXCO2TXCO2+ TXCO1TXCO1+ TXCO0TXCO0+
+3.3V_MULTI_MST
DDR2_D[0-15]
C864 0.01uF
+1.8V_DDR
C857 0.01uF
+1.2V_VDDC_MST
LVB4P
LVB4M
LVB3P
LVB3M
LVBCKP
LVBCKM
LVB2P
LVB2M
LVB1P
LVB1M
LVB0P
LVB0M
AVDD_LPLL
GND_7
VDDC_4
GPIO150/I2C_OUT_MUTE
GPIO151/I2C_OUT_SD2
GPIO152/I2C_OUT_SD3
GND_8
GPIO51
GPIO52
GPIO53
GPIO54
GPIO55
GPIO56
GPIO57
GPIO58
VDDP_3
VDDC_5
B_MDATA[4]
B_MDATA[3]
GND_9
B_MDATA[1]
B_MDATA[6]
AVDD_DDR_1
B_MDATA[11]
B_MDATA[12]
GND_10
B_MDATA[9]
B_MDATA[14]
AVDD_DDR_2
B_DDR2_DQM[1]
B_DDR2_DQM[0]
GND_11
C862 0.01uF
C878 0.01uF
C865 0.01uF
C879 0.01uF
7
9
2008/12/16
C860 0.01uF
C877 0.01uF
Close to IC as close as possible
IC800-*1 LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]
RXA2P
RXA2N
GND_1
RXA1P
RXA1N
AVDD_33_2
RXA0P
RXA0N
RXACKP
RXACKN
RXB2P
RXB2N
AVDD_33_1
RXB1P
RXB1N
HOTPLUGB
RXB0P
RXB0N
RXBCKP
RXBCKN
OPC_EN
MUTE_LINE R865 4.7K SUB_SCL R866 4.7K SUB_SDA S_VIDEO_DET PANEL_ON R819 3.3K DISP_EN/VAVS_ON SW_RESET DDC_WP
AR810 56
AR809 56
DDR2_DQM0 DDR2_DQM1
DDR2_DQS0M DDR2_DQS0P
DDR2_DQS1M DDR2_DQS1P
AR806 56
DDR2_MCLKZ DDR2_MCLK DDR2_D[5] DDR2_D[2] DDR2_D[0] DDR2_D[7]
AR805 56
MSTAR N-EU
0.1uF
1K
C842
0.1uF
C848
0.1uF
C849
R8042
0.1uF
C853
R8038
33 33
R843 R844
[MODE SELECTION]
R889 1K
R811 1K READY
+3.3V_MULTI_MST
192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129
0.1uF C863
B_MCLKZ B_MCLK B_MDATA[5] B_MDATA[2] B_MDATA[0] B_MDATA[7] AVDD_DDR_5 B_MDATA[13] B_MDATA[10] GND_13 B_MDATA[8] B_MDATA[15] AVDD_DDR_4 B_DDR2_DQSB[1] B_DDR2_DQS[1] GND_12 VDDP_4 AVDD_DDR_3 B_DDR2_DQSB[0] B_DDR2_DQS[0] GND_11 B_DDR2_DQM[0] B_DDR2_DQM[1] AVDD_DDR_2 B_MDATA[14] B_MDATA[9] GND_10 B_MDATA[12] B_MDATA[11] AVDD_DDR_1 B_MDATA[6] B_MDATA[1] GND_9 B_MDATA[3] B_MDATA[4] VDDC_5 VDDP_3 GPIO58 GPIO57 GPIO56 GPIO55 GPIO54 GPIO53 GPIO52 GPIO51 GND_8 GPIO152/I2C_OUT_SD3 GPIO151/I2C_OUT_SD2 GPIO150/I2C_OUT_MUTE VDDC_4 GND_7 AVDD_LPLL LVB0M LVB0P LVB1M LVB1P LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P LVB4M LVB4P
1K R868
DDR2_A[3] DDR2_A[7] DDR2_A[12] DDR2_A[9] DDR2_A[5] DDR2_A[10] DDR2_A[1] R852
DDR2_CASZ DDR2_RASZ DDR2_ODT AR800 56
DDR2_BA0
256 255 254 253 252 251 250 249 248 247 246 245 244 243 242 241 240 239 238 237 236 235 234 233 232 231 230 229 228 227 226 225 224 223 222 221 220 219 218 217 216 215 214 213 212 211 210 209 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 HWRESET CEC VSYNC1 HSYNC1 VSYNC0 HSYNC0 IRIN GPIO140 GPIO139 GPIO138 GPIO135 GPIO134 XIN XOUT AVDD_MPLL SAR3 SAR2 SAR1 SAR0 USB0_DP USB0_DM GND_18 GND_17 UART1_TX/GPIO87 UART1_RX/GPIO86 UART2_TX/I2CM_SCK UART2_RX/I2CM_SDA SPDIFO I2S_OUT_SD I2S_OUT_BCK VDDC_7 GND_16 VDDP_5 I2S_OUT_WS I2S_OUT_MCK I2S_IN_SD I2S_IN_BCK/GPIO68 I2S_IN_WS/GPIO67 VDDC_6 A_MCLKE A_MADR[3] A_MADR[7] A_MADR[12] A_MADR[9] A_MADR[5] AVDD_DDR_6 A_MADR[10] A_MADR[1] A_BADR[0] A_BADR[1] A_WEZ A_MADR[11] A_MADR[8] A_MADR[6] GND_15 A_MADR[4] A_MADR[2] A_MADR[0] A_CASZ A_RASZ A_ODT MVREF AVDD_MEMPLL GND_14
AUL0 AUR0 AUL1 AUR1 AUL2 AUR2 AUL3 AUR3 AUCOM AUL4 AUR4 GND_4 AUVRP AUVAG AVDD_AU GND_5 VDDC_2 DDCA_CK DDCA_DA DDCDA_CK DDCDA_DA DDCDB_CK DDCDB_DA GPIO20 VDDP_1 VDDC_3 UART2_RX UART2_TX DDCDC_CK RXCCKN RXCCKP DDCDC_DA RXC0N RXC0P GND_6 RXC1N RXC1P AVDD_DM RXC2N RXC2P HOTPLUGC USB1_DM USB1_DP SCK SDI SDO SCZ PWM0 PWM1 PWM2 PWM3 LVA4P LVA4M LVA3P LVA3M LVACKP LVACKM LVA2P LVA2M LVA1P LVA1M LVA0P LVA0M VDDP_2 M_SDA M_SCL
DDC_WP
65 AUL0
R828 C B E 10K Q805 READY RT1C3904-T112
66
R878 4.7K
67
GND 10
68
7 CS
74 AUL4
SPI_CZ
69 AUL1 AUR0
+3.3V_MULTI_MST
HWRESET
70 AUL2 AUR1
NC_5 11
CEC 256
71 AUL3 AUR2
NC_6 12
VSYNC1 254
255
72 AUR3
6 NC_4
75 AUR4
5 NC_3
76 GND_4
R877 4.7K
77 AUVRP
+3.3V_MULTI_MST
AUVAG
C823 2.2uF 65 CVBS_LIN 66 C824 2.2uF CVBS_RIN 67 68 69 C802 2.2uF COMP2_L 70 C873 2.2uF COMP2_R 71 C874 2.2uF 72 C875 2.2uF 73 C808 0.1uF 74 C821 2.2uF PC_AUD_L 75 C822 2.2uF PC_AUD_R 76 77 78 79 C840 0.01uF L801 80 120-ohm 81 82 R894 0 DSUB_SCL 83 R899 0 DSUB_SDA 84 R8023 100 DDC_SCL1 85 R8024 100 DDC_SDA1 86 R8025 100 DDC_SCL2 87 R8026 100 DDC_SDA2 88 R8033 0 READY POWER_DET 89 C882 0.1uF 90 R806 0 91 R870 0 92 R8039 100 HDMI3_SIDE 93 DDC_SCL3 R801 10 HDMI3_SIDE 94 TMDS3_RXCR805 10 HDMI3_SIDE 95 TMDS3_RXC+ R8040 100 HDMI3_SIDE 96 DDC_SDA3 R820 10 HDMI3_SIDE 97 TMDS3_RX0R821 10 HDMI3_SIDE 98 TMDS3_RX0+ 99 R822 10 HDMI3_SIDE 100 TMDS3_RX1R823 10 HDMI3_SIDE 101 TMDS3_RX1+ C876 0.01uF 102 R841 10 HDMI3_SIDE 103 TMDS3_RX2R848 10 HDMI3_SIDE 104 TMDS3_RX2+ 105 HPD_MST_3 106 R826 0 USB_DN 107 USB PART USB_DP R827 0 108 SPI_CLK 109 AR818 SPI_DI 33 110 SPI_DO 111 SPI_CZ 112 113 114 I-DIM 115 E-DIM 116 117 118 119 120 121 122 123 124 125 126 127 128
+1.2V_VDDC_MST
A_MADR[11]
+1.8V_DDR
A_MADR[8] 204
205
L802 120-ohm
XOUT 78
+3.3V_MULTI_MST
82
NC_7 13
83
4 NC_2
89
SPI_DI
93
NC_8 14
94
SI.SIO0 15
97
3 NC_1
98
2 VCC
103
+3.3V_MULTI_MST
105
I2S_OUT
107
C811 0.1uF
108
SPI_CLK
110
SCLK 16
111 SCZ SDO
1 HOLD
99 RXC0P
C807 0.01uF
80 GND_5
+3.3V_MULTI_MST
100 GND_6 RXC0N
+1.8V_DDR
101 RXC1P RXC1N
R8003 10K
A_MCLKE 104 RXC2P RXC2N
+3.3V_MST
90 VDDP_1
R8020 10K
81 VDDC_2
+3.3V_MST
UART2_RX/I2CM_SDA 91 VDDC_3
** Small HD : 19/22/26 Inch ** Non Small FHD : Normal(non 100Hz) FHD Model
109 SDI SCK USB1_DP
IC802 MX25L6405DMI-12G
84 DDCA_CK
SERIAL FLASH 64M
85 DDCA_DA
4.7K R8010 4.7K R8011 +3.3V_MULTI_MST R896 4.7K R898 4.7K +3.3V_MULTI_MST Small_HD Non_Small_FHD Small_HD Small_FHD R898-*2 R8010-*3 R896-*2 R8011-*3 4.7K 4.7K 4.7K 4.7K 100Hz Non_Small_HD Apollo DDR2_A[0-12] 100Hz R8010-*2 R8011-*2 R898-*1 R896-*1 4.7K 4.7K 4.7K 4.7K Small_FHD Non_Small_FHD Apollo Apollo R8010-*1 R8011-*1 4.7K 4.7K Small_FHD +5VST_MST Non_Small_HD
AVDD_MPLL 242
243
79 AVDD_AU
R8010 R8011 X 4.7K 4.7K 4.7K X 4.7K 4.7K X 4.7K 4.7K X 4.7K
SPDIFO 229
230
92 UART2_TX UART2_RX
R898 X X X 4.7K 4.7K 4.7K
A_MADR[3] 216
217
106 USB1_DM HOTPLUGC
R896 4.7K 4.7K 4.7K X X X
95 RXCCKP RXCCKN DDCDC_CK
Small HD Small FHD (27) Non Small HD Non Small FHD Apollo 100HZ
86 DDCDB_CK DDCDA_CK
*H/W OPTION
73 AUCOM
115 PWM3
112 PWM0
113 PWM1
114 PWM2
116 LVA4P
118 LVA3P
122 LVA2P
124 LVA1P
126 LVA0P
88 GPIO20
117 LVA4M
119 LVA3M
123 LVA2M
125 LVA1M
127 LVA0M
128 VDDP_2
120 LVACKP
121 LVACKM
102 AVDD_DM
96 DDCDC_DA
EAX56856904 H6 LCD MERCURY
XIN 244
GPIO134 245
GPIO135 246
GPIO138 247
GPIO139 248
GPIO140 249
IRIN 250
HSYNC0 251
VSYNC0 252
HSYNC1 253
UART2_TX/I2CM_SCK 231
UART1_RX/GPIO86 232
UART1_TX/GPIO87 233
GND_17 234
GND_18 235
USB0_DM 236
USB0_DP 237
SAR0 238
SAR2 240
SAR3 241
VDDC_6 218
I2S_IN_WS/GPIO67 219
I2S_IN_BCK/GPIO68 220
I2S_IN_SD 221
I2S_OUT_MCK 222
I2S_OUT_WS 223
VDDP_5 224
GND_16 225
VDDC_7 226
I2S_OUT_BCK 227
I2S_OUT_SD 228
A_WEZ 206
A_BADR[1] 207
A_BADR[0] 208
A_MADR[1] 209
A_MADR[10] 210
AVDD_DDR_6 211
A_MADR[5] 212
A_MADR[9] 213
A_MADR[12] 214
A_MADR[7] 215
GND_14 193
AVDD_MEMPLL 194
MVREF 195
A_ODT 196
A_RASZ 197
A_CASZ 198
A_MADR[0] 199
A_MADR[2] 200
A_MADR[4] 201
GND_15 202
A_MADR[6] 203
SAR1 239
87 DDCDB_DA DDCDA_DA
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
DDR2_A[0-12]
DDR2_D[0-15]
C905 1000pF
C918 0.1uF 50V
V_REF
+1.8V_DDR
DDR2_DQS0M DDR2_DQS1M
DDR2_DQM0 DDR2_DQM1
DDR2_DQS0P DDR2_DQS1P
DDR2_RASZ DDR2_CASZ DDR2_WEZ
DDR2_ODT
DDR2_MCLK DDR2_MCLKZ DDR2_CKE
DDR2_BA1
DDR2_BA0
READY
R906 150
R901 56
R903 56
56
VDDL
VSSDL
NC3
NC2
NC1
NC6
NC5
NC4
UDQS
LDQS
UDM
LDM
UDQS
LDQS
WE
CAS
RAS
CS
ODT
CKE
CK
CK
BA1
BA0
A12
A11
J2
J1
J7
R8
E2
A2
R7
R3
L1
A8
E8
B3
F3
B7
F7
K3
L7
K7
L8
K9
K2
K8
J8
L3
L2
R2
P7
M2
P3
P8
P2
N7
N3
N8
N2
M7
M3
M8
H8
H2
F8
F2
E7
D8
D2
A7
B8
B2
P9
N1
J3
E3
A3
G9
G7
G3
G1
E9
C9
C7
C3
C1
A9
R1
M9
J9
E1
A1
B9
B1
D9
D1
D3
D7
C2
C8
F9
F1
H9
H1
H3
H7
G2
G8
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VSSQ6
VSSQ7
VSSQ8
VSSQ9
VSSQ10
VSS1
VSS2
VSS3
VSS4
VSS5
VDDQ1
VDDQ2
VDDQ3
VDDQ4
VDDQ5
VDDQ6
VDDQ7
VDDQ8
VDDQ9
VDDQ10
VDD1
VDD2
VDD3
VDD4
VDD5
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
DDR2 MEMORY
C919 10uF 10V
R905 56
R904
56
R902
56
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
VREF
IC900 HYB18TC512160B2F-2.5
DDR2_D[0-15]
A10/AP
V_REF
R900
C900 0.01uF 50V
DDR2_A[12]
DDR2_A[11]
DDR2_A[10]
DDR2_A[9]
DDR2_A[8]
DDR2_A[7]
DDR2_A[6]
DDR2_A[5]
DDR2_A[4]
DDR2_A[3]
DDR2_A[2]
DDR2_A[1]
DDR2_A[0]
Close to DDR2 IC
C904 0.01uF
+1.8V_DDR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2
EAX56856904 H6 LCD MERCURY
1K R907 1K R908
+1.8V_DDR
DDR2_D[15]
DDR2_D[14]
DDR2_D[13]
DDR2_D[12]
DDR2_D[11]
DDR2_D[10]
DDR2_D[9]
DDR2_D[8]
DDR2_D[7]
DDR2_D[6]
DDR2_D[5]
DDR2_D[4]
DDR2_D[3]
DDR2_D[2]
DDR2_D[1]
DDR2_D[0]
C901 0.01uF
C902 0.01uF
C903 0.01uF
C906 0.01uF
Close to DDR2 IC +1.8V_DDR
C907 0.01uF
C909 0.01uF
C910 0.01uF
DDR2
MSTAR
C908 0.01uF
C911 0.01uF
C912 0.01uF
C913 0.01uF
C914 0.01uF
C916 0.01uF
C917 0.01uF
8
9
2008/12/16
C915 0.01uF
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
NC
24V
GND
12V
GND
5.2V
5.2V
GND
GND
NC
R1005 1.2K
R1002 10K
5.2V
5
26"
23
21
19
17
15
13
11
9
7
25
2
24
22
20
18
16
14
12
10
8
6
4
Power ON
PWM Dim
24
R10450 CMO 32,42,47,57
R1043 0 NON CMO 32,42,47,57
R1042 0
R1041 0 CMO 57"
R1064
0
PWM Dim
Error Out
120-ohm
L1001
120-ohm
L1012 MLB-201209-0120P-N2
+5VST_MST
OPC_ENABLE R1021 1K OPC_DISABLE
R1075 1K
OPC_DISABLE R1076 1K
NON 19_22"
R1022 1K OPC_ENABLE
OPC_OUT
E-DIM
DISP_EN/VAVS_ON
+12V_AUDIO
+16V_NTP
NC
NC
5V
5V
GND
GND
15V
15V
RL_ON
C1053 0.01uF
PANEL_STATUS
11
10
C1044 2.2uF 16V
R1079 10K
I-DIM
R1023 0 NON (CMO 32,42,47,57, SHARP 32")
R1014 0 CMO 32,42,47,57
A.Dim
PWM_Dim
9
8
7
6
5
4
3
2
1
SMAW200-11
P1002
19_22"
+3.3V_MST C1034 1uF 25V READY
+5VST_MST C1011 0.01uF
C1001 0.1uF 50V
Inverter_ON
C1052 10uF 16V
C1008 0.01uF
C1007 0.01uF
C1046 0.01uF
R1001 0 NON CMO 57"
3 R1003 10K 12 NON 19_22" Q1000 2SC3875S
R1000 2.2K
P_24V_SMALL_15V
**OPC_ENABLE : USE LGD Module
C1045 2.2uF 16V R1044-*1 100 DC_DIM PWM_DIM
R1044 1K DC_DIM
R1039 0 CMO 32,42,47
3 R1047 10K 1 2 Q1002 2SC3875S
R1046 3K
+5V_MULTI
VOUT
NON 19_22"
P_5V
GND
3 2 MAX 300mA 1
P_12V_SMALL_15V
P_5V
IC1007 AP2121N-3.3TRE1 VIN
R1054 4.7K NON SHARP 32&52",AUO 25V R1053 C1043 0 0.47uF SHARP 52",AUO NON SHARP 52",AUO
R1040 0 CMO 57"
C1003 10uF 16V
C1002 47uF 25V
C1006 68uF 35V
*ST 5V->3.3V
P_5V
P_12V_SMALL_15V
*SHARP32":DC DIMMING
Inverter ON
24V
GND
12V
GND
5.2V
5.2V
GND
GND
NON_19_22_26"
23
22
20
19
21
18
16
14
12
10
8
6
4
2
17
15
13
11
9
7
5
3
1
Power ON
Error Out
Inverter ON
24V
GND
12V
GND
5.2V
5.2V
GND
GND
P1000 FW20020-24S
NC
A.Dim
NC
24V
GND
12V
GND
1
3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D1002 SAM2333
+5V_MULTI
NC
A.Dim
+5VST_MST
LED Block
P_24V_SMALL_15V
P_12V_SMALL_15V
P_5V
R1077 0 READY
NC
5.2V
GND
GND
P1001 FM20020-24
.
L1000 CIC21J501NE EAM58113401
R1074 0
P_24V_SMALL_15V
1/4W 5%
EAX56856904 H6 LCD MERCURY
19_22"
C1004 10uF 16V
C1017 10uF 16V C1012 560pF 50V
R1008 12K 4
3
2
1
MAX 2A
5
6
7
8
PGND
SW
PVCC
EN
R1073
0
INPUT 3 C1054 0.1uF
R1068 10K
R1020 10K
R1048
R1049 33K
B
R1069 1.6K
R1070 22K
E
C
C1048 1uF
Q1004 RT1C3904-T112
P_5V
P_12V_SMALL_15V
L1008 CIC21J501NE
0 NON 19_22"
R1012
S2A 50V
19_22" D1001
C1030 10uF 25V
R2
R1
C1056 1uF 25V
R1065 33K NON 19_22" R1065-*1 19_22" 10K C 10K B Q1001 RT1C3904-T112 E
C1027 68uF 35V READY Close to Q1003
**DC-DC CONVERTER 12V->5V_TUNER/USB
POWER_SW
PANEL_ON
P_12V_SMALL_15V
1
2
1
G2
4
S2 3
G1
S1
Q1003 SI4925BDY EBK32753101
R1057 30K
C1031 10uF 25V
R1058 5.6K
C1032 560pF 50V
BS 4
IN 3
GND2
FB 1
R2 C1018 10uF 16VR1010 3.3K 1%
R1009 2K
D1_2
5
D2_1
6 D2_2
7 D1_1
8
0
R1011
MAX 3A
IC1006 MP2212DN
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
R1059 10K NON 19_22"
R1
C1035 1uF 25V
1
C1029 0.1uF 50V
R1007 56 1%
C1022 10uF 6.3V
R1013 0
R1004 120 5%
MSTAR
C1033 0.1uF 50V
C1000 10uF 16V
POWER
R1024 10
+5V_MULTI
L1009 3.6uH
C1024 0.1uF 50V READY
R1056 10
+5V_MULTI
READY
R1051 2.2K
OUT:5V
R1050 2.2K
R2
R1
OUT:1.85V C1023 0.1uF 50V
C1020 10uF 16V
R1052 2.2K
19_22"
R1015 10
C1025 0.1uF 16V
19_22"
+5V_USB
+5V_TUNER
+5V_MULTI
9
9
2008/12/16
RL_ON
Small(19_22") 3 R1017 10K 12 19_22" Q1005 2SC3875S
R1016 4.7K
+5V_MULTI 19_22"
DDR2, Vref
NTP,AUDIO DSP
+1.8V
+5V_+12V_LCD
L1010 MLB-201209-0120P-N2
C1010 0.01uF
C1038 1uF 25V READY
C1009 100uF16V
120-ohm
C1037 1uF 25V READY
+1.8V_DDR
+3.3V_MULTI_MST
OUT:1.27V +1.2V_VDDC_MST
L1013 MLB-201209-0120P-N2
C1036 1uF 25V READY
V0 = 1.25*(1+(R2/R1))
OUT
ADJ/GND
3 MAX 1A 2
0LCML00003B
C1026 100uF 16V
R1018 2K NON 19_22"
IC1002 AP1117EG-13
L1007 MLB-201209-0120P-N2
C1015 0.1uF 50V
IN
C1019 C1021 10uF 16V 0.01uF
C1005 0.1uF
C1016 10uF 10V
C1028 100uF 16V
2 OUTPUT OUT:3.3V
ADJ/GND
MAX 3A
V0 = 0.8*(1+(R1/R2))
L1006 L1005 120-ohm 120-ohm 19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"
P_5V
C1014 0 . 1 u F C1013 10uF 16V 16V
IC1003 AZ1085S-3.3TR/E1
R1078 3.3 READY C1055 2200pF 50V READY
L1002 2.2uH
10K R1006
V0 = 0.8*(1+(R2/R1))
GND
ITH
VCC
IC1001 BD9130EFJ-E2
**Switch 12V:P12V **Switch 5V:5V_MULTI -> 1.8V
+5V_MULTI
ADJ
**5V_MULTI->3.3V->1.2V
1/10W 1% 1/10W
P/NO : MFL60021513
Jan., 2009 Printed in Korea