Manual de serviço tv lg 42lh20r chassis lp91a

Page 1

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LCD TV SERVICE MANUAL CHASSIS : LP91A

MODEL : 42LH20R

42LH20R-MA

CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.


CONTENTS

CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 TROUBLE SHOOTING ............................................................................14 BLOCK DIAGRAM...................................................................................17 EXPLODED VIEW .................................................................................. 18 SVC. SHEET ...............................................................................................

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit Keep wires away from high voltage or high temperature parts.

AC Volt-meter

Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock. To Instrument's exposed METALLIC PARTS

Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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Good Earth Ground such as WATER PIPE, CONDUIT etc. 0.15uF

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard

LGE Internal Use Only


SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

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LGE Internal Use Only


IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Copyright Š 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This spec sheet is applied to LCD TV used LP91A chassis.

1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC

2. Specification Each part is tested as below without special appointment. 1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC 2) Relative Humidity : 65±10% 3) Power Voltage : Standard input voltage(100~240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.

4. Electrical specification 4.1. General Specification No

Item

Specification

1

Screen Size

2

Aspect Ratio

16:9

3

LCD Module

42” TFT WXGA LCD

4

Operating Environment

Temp.: 0 ~ 40 deg

Measurement

42” wide Color Display Module

Remark Resolution : 1366*768

Humidity : 0 ~ 85 % 5

Storage Environment

Temp.: -20 ~ 60 deg Humidity : 0~ 85 %

6

Input Voltage

AC100-240V~, 50/60Hz ≤ 200 W

42” HD

7

LDC Module

HD

983 x 576 x 46

(Maker : LGD)

Unit : mm

0.227 x 0.681 18 EEFL Coating

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

3H

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LGE Internal Use Only


5. Chroma& Brightness (Optical) 5.1. LCD Module the Color Coordinates check condition - 50cm from the surface, Full White Pattern - Picture mode Vivid No.

Item

1.

Luminance

2.

VIew angle (R/L, U/D)

3.

Color Coordinates

Min.

Typ.

400

500

Max.

cd/m2

Unit

178 / 178

degree

Maker

Remark

(W/O PC mode) White RED Green Blue 4.

Contrast ratio

5.

Luminance Variation

Wx

Typ

0.279

Typ

Wy

-0.03

0.292

+0.03

Xr

0.637

Yr

0.335

Xg

0.290

Yg

0.611

Xb

0.145

Yb

0.062 800:1

LGD LGD 42”(HD) LC420WXE-SBA1

1200:1 1.3

6. Component Video Input (Y, PB, PR) Specification

No Resolution

Remark

H-freq(kHz)

V-freq(Hz) 59.94

Pixel Clock(MHz)

1

720* 480

15.73

13.500

SDTV, DVD 480I( 525I)

2

720* 480

15.75

60.00

13.514

SDTV, DVD 480I( 525I)

3

720* 576

15.625

50.00

13.500

SDTV, DVD 576I( 625I) 50Hz

4

720* 480

31.47

59.94

27.000

SDTV 480P

5

720* 480

31.50

60.00

27.027

SDTV 480P

6

720* 576

31.25

50.00

27.000

SDTV 576P 50Hz

7

1280* 720

44.96

59.94

74.176

HDTV 720P

8

1280* 720

45.00

60.00

74.250

HDTV 720P

9

1280* 720

37.50

50.00

74.25

HDTV 720P 50Hz

10

1920* 1080

28.125

50.00

74.250

HDTV 1080I 50Hz,

11

1920* 1080

33.72

59.94

74.176

HDTV 1080I

12

1920* 1080

33.75

60.00

74.25

HDTV 1080I

13

1920* 1080

56.25

50

148.5

HDTV 1080P

14

1920* 1080

67.432

59.94

148.350

HDTV 1080P

15

1920* 1080

67.5

60.00

148.5

HDTV 1080P

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


7. RGB 7.1. Analog PC, RGB- DTV –NOT SUPPORT Specification

No Resolution

H-freq(kHz)

Proposed V-freq(Hz)

Pixel Clock(MHz)

1

640* 350

31.468

70.09

25.17

EGA

2

720* 400

31.469

70.09

28.32

DOS

3

640* 480

31.469

59.94

25.17

VESA( VGA)

4

800* 600

37.879

60.317

40

VESA( SVGA)

5

1024* 768

48.363

60.004

65

VESA( XGA)

6

1280* 768

47.776

59.87

79.5

Remark

VESA( WXGA)

7

1360* 768

47.72

59.799

84.75

VESA( WXGA)

8

1280* 1024

63.668

59.895

109.00

XGA

Only FHD Model

9

1920* 1080

66.587

59.934

138.50

WUXGA(Reduced Blanking)

Only FHD Model

8. HDMI Input 8.1. PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No 1

Resolution 640 x 480

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

31.469

59.94

25.17

Proposed

Remark

VESA( VGA)

2

800 x 600

37.879

60.317

40.00

VESA( SVGA)

3

1024 x 768

48.363

60.004

65.00

VESA( XGA)

4

1280 x 768

47.776

59.87

79.5

VESA( WXGA)

5

1360 x 768

47.72

59.799

84.62

VESA( WXGA)

6

1366 x 768

47.7

60.00

84.62

WXGA

7

1280 x 1024

63.595

60.00

108.875

SXGA

8

1920 x 1080

66.647

59.988

138.625

WUXGA

8.2. DTV Mode Specification

No Resolution

H-freq(kHz)

Remark V-freq(Hz)

Pixel Clock(MHz)

1

720 x 480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

Spec. out

2

720 x 480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

but display.

3

720 x 576

15.625

50.00

13.500

4

720 x 480

31.47

59.94

27

SDTV 480P

5

720 x 480

31.5

60.00

27.027

SDTV 480P

6

720 x 576

31.25

50.00

27

SDTV 576P

7

1280 x 720

44.96

59.94

74.176

HDTV 720P

8

1280 x 720

45

60.00

74.25

HDTV 720P

9

1280 x 720

37.5

50.00

74.25

HDTV 720P

10

1920 x 1080

28.125

50.00

74.25

HDTV 1080I

11

1920 x 1080

33.72

59.94

74.176

HDTV 1080I

12

1920 x 1080

33.75

60.00

74.25

HDTV 1080I

13

1920 x 1080

56.25

50.00

148.5

HDTV 1080P

14

1920 x 1080

67.432

59.94

148.350

HDTV 1080P

15

1920 x 1080

67.5

60.00

148.5

HDTV 1080P

SDTV, DVD 576I(625I) 50Hz

16

1920 x 1080

27

24.00

74.25

HDTV 1080P

17

1920 x 1080

33.75

30.00

74.25

HDTV 1080P

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


ADJUSTMENT INSTRUCTION 1. Application Range This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis.

(2) Download steps 1) Execute ‘ISP Tool’ program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the “Connect” button and confirm “Dialog Box”

2. Specification 1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 25 ±5 °C of temperature and 65±10% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100~220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.

3. Adjustment items 3.1. PCB assembly adjustment items (1) Download the MSTAR main software (IC800, Mstar ISP Utility) 1) Using D/L Jig 2) Using USB Memory Stick. (2) Input Tool-Option/Area option. (3) Download the EDID - EDID datas are automatically download when adjusting the Tool Option2 (4) ADC Calibration – RGB / Component (4) Check SW Version.

3) Click the “Config.” button and Change speed I2C Speed setting : 350Khz~400Khz

3.2. SET assembly adjustment items (1) Input Area option (2) Adjustment of White Balance : Auto & Manual (3) Input Tool-Option/Area option (4) Intelligent Sensor Inspection Guide (5) Preset CH information (6) Factoring Option Data input

4. PCB assembly adjustment method 4.1. Mstar Main S/W program download 4.1.1. Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(RGB) jack

4) Read and write bin file. Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

- LH20/ LH30

1

1

Filexxx.bin

Fil

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


1 Filexxx.bin

5) Click “(2)Auto” tab and set as below 6) Click “(3)Run”. 7) After downloading, you can see the “(4)Pass” message.

(3). Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value Caution : Don’t Press “IN-STOP” key after completing the function inspection.

4.3. EDID D/L method Recommend that don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If not possible, recommend that connect the MSPG equipment. There are two methods of downloading the edid data

4.1.2. Using the Memory Stick * USB download : Service Mode 1) Insert the USB memory stick to the ISB port. 2) Automatically detect the SW Version. -> S/W download process is executed automatically. 3) Show the message “Copy the file from the Memory”

4.3.1. 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2. Automatically downloaded when pushing the enter key after adjusting the tool option2. It takes about 2seconds.

4) After Finished the Download, Automatically DC Off -> On 4.3.2. 2nd Method * Caution : Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well. 1) Press the ADJ key 2) Move to the EDID D/L and Press the right direction key(G) 3) Press the right direction key(G) at Start. 4) After about a few seconds, appear “OK”, then compele.

5) Check The update SW Version.

4.2. Input tool option. Adjust tool option refer to the BOM. - Tool Option Input : PCBA Check Process - Area Option Input : Set Assembly Process

4.3.3. RS-232C command Method (1) Command : AE 00 10

After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)

* Caution Don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If the cables are connected, Downloading of edid could be failed.

(1) Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market (2) Equipment : adjustment remote control.

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


4.3.4. EDID data (1) Analog(RGB): 128bytes>

4.4. ADC Calibration 4.4.1. ADC Calibration - Component (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to Component1 or 2 mode. 2) Input the Component 480i@60Hz 100% Color Bar YPbPr signal into Component1 or 2. (MSPG-925F Model: 209 / Pattern: 65 )

(2) HDMI 1 : 256Bytes

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : Component” by using D/E (CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear (3) HDMI 2 : 256Bytes

OK

4.4.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to RGB mode.. 2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : RGB” by using D/E(CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear OK

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


4.5. Check SW Version

5.2. Adjustment of White Balance

(1) Method 1) Push In-star key on Adjust remote-controller. 2) SW Version check Check “SW VER : V3.xx” – LH70

: (For automatic adjustment)

* LP91A~D Support RS-232C & I2C DDC CommunicationWhite Balance Mode. (1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode)

5. PCB assembly adjustment method 5.1. Input Area-Option (1) Profile : Must be changed the Area option value because being different of each Country’s Language and signal Condition. (2) Equipment : adjustment remote control. (3) Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.)

(3) Enter the adjust mode of white balance) - Enter the white balance adjustment mode with aging command (F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)

Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value.

* White Balance Adjustment - Purpose : Adjust the color temperature to reduce the deviation of the module color temperature. - Principle : To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. - Adjustment mode : Three modes – Cool / Medium / Warm - Required Equipment 1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product LCD TV( ch : 9 ), (should be used in the calibrated ch by CS-1000) 3) Auto W/B adjustment instrument(only for Auto adjustment)

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

5.3. Adjustment of White Balance

- 12 -

(for Manual adjustment) (1) Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting. (3) For manual adjustment, it is also possible by the following sequence. 1) Select white pattern of heat-run by pressing “POWER ON” key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.) 2) Push “Exit” key. 3) Change to the AV mode by remote control. 4) Input external pattern (85% white pattern) 5) Push the ADJ key -> Enter “0000” (Password) 6) Select “3. W/B ADJUST” 7) Enter the W/B ADJUST Mode 8) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.. 9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 10) Adjust three modes all (Cool / Medium / Warm) : Fix the one of R/G/B gain and change the others 11) When adjustment is completed, Enter “COPY ALL”. 12) Exit adjustment mode using EXIT key on R/C. LGE Internal Use Only


* CASE First adjust the coordinate far away from the target value(x, y). 1. x, y > target i) Decrease the R, G. 2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode

x

y

Temp

uv∆

Cool

0.276±0.002 0.283±0.002

11,000K

0.000

Medium

0.285±0.002 0.293±0.002

9,300K

0.000

Warm

0.313±0.002 0.329±0.002

6,500K

0.003

To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 13 -

LGE Internal Use Only


TROUBLESHOOTING No power (LED indicator off)

:

[A] PROCESS

Fail

Check short of Main B/D or Change Power B/D

Fail

Check short of IC1001, IC1003, IC1007

Check 24V, 12V, 5,2V of Power B/D Pass

Check Output of IC1001, IC1003, IC1007

Fail

Re-soldering or Change defect part of IC1001, IC1003, IC1007

Pass Pass Change IC1002,, Q1003 Fail Check LEDAssy

Change LEDAssy

Pass

Check P307 Connector

No Raster

[B]: Process

Pass

Check LED status On Display Unit

Fail

Repeat A PROCESS

Pass

Check Panel Link Cable Or Module

Fail

Change Panel Link Cable Or Module

Fail

Change Inverter Connector Or Inverter

Pass

Check Inverter Connector Or Inverter Pass

Check Output of IC802

Fail

Change IC802

Pass Check LVDS Cable

Fail

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

Change Module

- 14 -

LGE Internal Use Only


No Raster on PC Signal

Pass Check Input source Cable and Jack Pass Check the Input/Output Of J104

Fail

Re-soldering or Change the defect part

Pass Check the Input/Output Of IC100

Fail

Re-soldering or Change the defect part, Check RGB EDID Data

Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Pass Repeat [A], & [B] Process

No Raster on HDMI Signal

No Raster on COMMPONENT Signal

Pass

Pass

Check Input source Cable And Jack

Check Input source Cable And Jack

Pass

Pass Check The Input/Output Of JK101

Check the Input/Output Of JK301, JK302, JK303

Fail

Re-soldering or Change the defect part

Check the Input/Output Of IC300, IC301, JK302

Fail

Re-soldering or Change the defect part

Pass

Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Fail

Re-soldering or Change the defect part Check HDMI EDID Data Re-download HDCP

Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Pass

Repeat [A], & [B] Process

Repeat [A], & [B] Process

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 15 -

LGE Internal Use Only


No Raster On AV (Video, S-Video)Signal

No Signal On TV(RF) Signal

Pass

Pass

Check Input source Cable And Jack

Check Input source Cable And Jack

Pass Pass Check The Input/Output Of JK101, JK201

Fail

Re-soldering or Change the defect part

Check The Input/Output Of TU500

Fail

Re-soldering or Change the defect part

Pass Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Check the Input/Output Of IC800

Pass

Fail

Re-soldering or Change the defect part

Pass

Repeat [A], & [B] Process

Repeat [A], & [B] Process

No Sound

Check The Input Sourse.

Fail

Change The Source Input.

Pass

Check The Input/Output Of IC600.

Fail

Re-soldering or Change the defect part.

Pass

Check The Speaker.

Fail

Change Speaker.

Pass

Check The Speaker Wire.

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 16 -

LGE Internal Use Only


Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 17 -

AV2 ( Sid e AV)

HDMI3

USB

USB Fo r D/ L

RS232

TV ( RF)

AV1

MNT_OUT

COMP1 COMP2

RGB_PC

PC_Aud io

EEPROM 24C02

SIDE_V : 1Vp p

SIF

SUB_SCL / SDA

PC_SCL/ SDA

EEPROM 24C02 HDMI3_SCL/ SDA

AUDIO AMP

HDMI1_SCL/ _ SDA

HDM 2_SCL/ SDA

232C Driver ST3232C

SIDE_L/ SIDE_R :5 00mVrms

TMDS

Tx/ Rx : ± 15Vp p

TUNER

TU_MAIN

MNT_LOUT/ ROUT: 500m Vrm s

AV11_LIN/ RIN :5 00m Vrms

MNT_OUT: 1Vp p

AV1_VIN: 1Vp p

COMP2_Y/ Pb /Pr / : 1/ 0. 7Vp p Co mp 1_L/ R :5 00mVrms Co mp 2_L/ R :5 00mVrms

Pr : 1/ 0. 7Vp p COMP1_Y/ Pb / P

PC_R/ G/ B/ HS/ VS

EEPROM 24C02

EEPROM 24C02 PC_Aud io _L/ R :7 00m Vrms

TMDS TMDS

AV2_VIN

AV2_LIN/ RIN

HDMI_DATA_3

USB_DN/ PN

IIS_OUT

OUT_O_TX_A± OUT_O_TX_A OUT_O_TX_B OUT_O_TX_B± OUT_O_TX_C OUT_O_TX_C± OUT_O_TX_CLK± OUT_O_TX_C OUT_O_TX_D OUT_O_TX_D± OUT_O_TX_E OUT_O_TX_E±

OUT_E_TX_A OUT_E_TX_A± OUT_E_TX_B OUT_E_TX_B± OUT_E_TX_C OUT_E_TX_C± OUT_E_TX_CLK OUT_E_TX_CLK± OUT_E_TX_D ± OUT_E_TX_ OUT_E_TX_E ± OUT_E_TX_

MAIN SCALER

TXD / RXD :5V Dig it al

SIF

TU_MAIN

MNT_L/ R OUT

AV1_LIN/ RIN

MNT_VOUT

AV1_VIN

COMP2_LIN/ RIN

COMP2_Y/ Pb / Pr: 1/0. 7Vp p MNT_OUT RIN COMP1_LIN/

COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p

PC_R/ G/ B/ HS/ VS

PC_Aud io _L/ R

IR HDMI_DATA_1 HDMI_DATA_2 TX

DDR2( 512MB)

EEPROM( 256K)

Serial Flas h ( 8MByt e)

PWM NTP3100L R_CH L_CH

L VDS c onnec tor

HDMI1 HDMI2

R_SPK_OUT L_SPK_OUT

BLOCK DIAGRAM

LGE Internal Use Only


EXPLODED VIEW IMPORTANT SAFETY NOTICE

806

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

A10 310

510

300

500

120

A2

900

200

A5

LV1

530

550

802

803

801

804

805

540

521

400

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

- 18 -

LGE Internal Use Only


Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

AUDIO_R

MNT_ROUT

MNT_LOUT

MNT_VOUT

C100

POP NOISE

MUTE_LINE

16V 10uF C101 R101 0 HOTEL_OPT

SPK_R+_HOTEL

POP NOISE

MUTE_LINE

16V 10uF

SPK_R-_HOTEL

C B E

Q101 RT1C3904-T112 E

B

Q100 RT1C3904-T112

16V100uF C102

C

R105 0 HOTEL_OPT R106 0 NON_HOTEL_OPT

C103 100pF READY

R103 0 HOTEL_OPT

R102 75

[YL]O-SPRING_B

D103 30V NON_HOTEL_OPT

6

7

3

SHIELD

5

4

2

C-LUG4

C-LUG3

0-SPRING

C-LUG2

C-LUG1

ZD107 SD05

ZD106 SD05

D106 30V

D107 30V

R122 75

R121 75

S-VIDEO

R123 10K

S-VIDEO

SIDE_C

C104 OPT READY

SIDE_Y

+3.3V_MULTI_MST

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

GND

1

S-VIDEO JK101 PSJ014-01

6L

5L

7K

6J

5J

JK100 PPJ226-01

S_VIDEO_DET

[RD]CONTACT_B

[RD]O-SPRING_B

D102 30V NON_HOTEL_OPT

[WH]C-LUG_B

[YL]CONTACT_B

S-VIDEO(China Model)

MNT_OUT

3H [RD]CONTACT_A_2

4H [RD]O-SPRING_A_2

9H [RD]2P_CAN

8G [WH]C-LUG_A_2

9G [WH]2P_CAN

3F [YL]CONTACT_A

4F [YL]O-SPRING_A

9F [YL]2P_CAN

3E [RD]CONTACT_A_1

4E [RD]O-SPRING_A_1

9E [RD]1P_CAN_2

8D [WH]C-LUG_A_1

9D [WH]1P_CAN

8C [RD]C-LUG_A

9C [RD]1P_CAN_1

8B [BL]C-LUG_A

9B [BL]1P_CAN

3A [GN]CONTACT_A

4A [GN]O-SPRING_A

9A [GN]1P_CAN

SD05 ZD105

ADUC30S03010L_AMODIODE

D105 30V

D104 30V

ZD104 SD05

D100 30V

D101 30V

ZD100 SD05

ZD101 SD05

ZD102 SD05 SD05 ZD103

COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100

EAX56856904 H6 LCD MERCURY

10K

10K

R112 220K

R116 10K

R111 220K

R115 10K

R110 75

R100 220K

R113

R104 220K

R114

R107 75

R108 75

R109 75

R120 12K

R119 12K

R117 12K

R118 12K

CVBS_RIN

CVBS_LIN

CVBS_VIN

COMP2_R

COMP2_L

COMP2_PR

COMP2_PB

COMP2_Y

COMPONENT1 AV1

LGE Internal Use Only

INPUT1

MSTAR N-EU

1

9

2008/12/16

INPUT1 : COMPONENT1, S-VIDEO


2

5

4

7

R2IN 8

T2OUT

V- 6

C2-

C2+

C1- 3

V+

1

0

0

R230

JK201

JK204

R204 4.7K

2C[RD]U_CAN

5C[RD]CONTACT

4C[RD]O_SPRING

2B[WH]U_CAN

3B[WH]C_LUG

2A[YL]U_CAN

0

R201

D208 30V READY

USB_DP

USB_DL_P

5.6B ZD203

5.6B ZD202

D205 30V

D206 30V

R227 75

RXD TXD

0 R237 Non_OCP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D207 30V READY

Itís possibel to 27~47ohm R200 USB_DN USB_DL_N 0

1A Design

C210 10uF 6.3V

220uF 16V

C212

L201 500

100uF 16V

C214

R205 4.7K

IR_OUT

D201 ADUC30S03010L_AMODIODE 30V

D200 ADUC30S03010L_AMODIODE 30V

+3.3V_MST

100

100

5A[YL]CONTACT

Close to SIDE_USB

**

R203

R202

4A[YL]O_SPRING

9 R2OUT

10 T2IN

PPJ218-01

SIDE_USB

REAR_USB

USB_DL_P

USB_DL_N

REAR_USB R229

USB

R1OUT

11 T1IN

12

13 R1IN

14 T1OUT

15 GND

16 VCC

IC200 ST3232CDR

SIDE AV

C202 0.1uF

C201 0.1uF

C200 0.1uF

C1+

KJA-UB-4-0004

+3.3V_MST

REAR_USB JK205

R222 220K

READY

R225

R223 220K

READY

R224

10K

10K

JK200

10

GND 2 ENABLE 3

5 ILIMIT 4 FAULT/

VIN 1

6 VOUT

IC202 OCP_READY MIC2009YM6-TR

Pin to Pin with EAN43439401

SIDE_RIN

SIDE_LIN

9

8

7

6

C A

KDS226 D213

AC

OCP_READY

5

4

3

2

1

R210 4.7K OCP_READY

C208 0.1uF OCP_READY

L200 120OHM OCP_READY

R238 510 OCP_READY

C209 10uF OCP_READY

+5V_USB

SHILED

15

14

13

12

11

VSS

A2

A1

A0

4

3

2

1

5

6

7

8

SDA

SCL

WP

R218 100

R217 100

R220 4.7K

C204 0.1uF

+5V_MULTI

C

R221 4.7K

10K

10K

R234

R232 220K

R231 220K

R233

PC_B ZD201 SD05

ZD200 SD05

30V

PC_AUD_L

PC_AUD_R

DDC_WP DSUB_SCL DSUB_SDA

R236 12K

R235 12K

R213 75

PC_G

PC_R

ADUC30S03010L_AMODIODE 30V

C207 0.1uF

C206 0.1uF

R212 75

C205 0.01uF

+5VST_MST

D203 30V CDS3C30GTH

D202 30V CDS3C30GTH

R211 75

C

D209

R215 4.7K

R214 4.7K

R208 68

R207 68

PC_VS

DSUB_SCL

C211 68pF

PC_HS

DSUB_SDA

C213 68pF

D204 ADUC30S03010L_AMODIODE

INPUT2

MSTAR N-EU

2

9

2008/12/16

INPUT2 : PC,RS-232C,SIDE AV,USB

READY

R219 4.7K

SHIELD_PLATE

R216 100

T_TERMINAL2 8

B_TERMINAL2

T_SPRING

R_SPRING

6B

7B

5

4

B_TERMINAL1

7A

E_SPRING T_TERMINAL1

3

DDC_GND

DDC_CLOCK

SYNC_GND

GND_1

V_SYNC

NC

BLUE

H_SYNC

BLUE_GND

GREEN

DDC_DATA

GREEN_GND

RED

GND_2

RED_GND

6A

VCC

IC201 CAT24C02WI-GT3

PC EDID

PEJ024-01

16

10

9

8

7

6

PC SOUND JK203

5

4

3

2

1

6630TGA004K

KCN-DS-1-0089

JK202

PC A AC

KCN-DS-1-0088

R209 1K OCP_READY

OCP_READY R206 160

R228 12K

12K

R226

SIDE_V

IR_OUT

UB01123-4HHS-4F

C203 0.1uF

1

2

3

5 4

1 2 3 4

ENKMC2837-T112 D210

RS-232C (CI ITEM) C

ENKMC2837-T112 D211

AC

A AC

A

ENKMC2837-T112 D212

EAX56856904 H6 LCD MERCURY

USB DOWN STREAM 5

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes USB DOWN STREAM

LGE Internal Use Only


21

22

E

2SC3875S

21

20 JACK_GND

1 DATA2+

.

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

8 DATA0_SHIELD

9 DATA0-

11 10 CLK+

12

13

14

15

16

17

18

19

B

Q300C

JK301 QJ41193-CFEE1-7F

R300 10K

.

R302 1K

RT1C3904-T112

20 JACK_GND

1 DATA2+

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

8 DATA0_SHIELD

9 DATA0-

11 10 CLK+

12

13

14

15

16

17

18

19

JP301

+5V_HDMI_1

JP300

A2

4

3

5

6

7

8

SDA

SCL

WP

VCC

4

3

2

1

TMDS1_RX2+

CEC TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+ TMDS1_RX1TMDS1_RX1+ TMDS1_RX2-

VSS

A2

A1

A0

5

6

7

8

SDA

SCL

WP

VCC

IC300 CAT24C02WI-GT3

TMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ TMDS2_RX1TMDS2_RX1+ TMDS2_RX2TMDS2_RX2+

CEC TMDS2_RXC-

VSS

2

1

A0

E

A1

IC301 CAT24C02WI-GT3

R303 1K

C

JK302 QJ41193-CFEE1-7F

22

B

RT1C3904-T112

R301 10K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

HPD_MST_1

HPD_MST_2

Q301

+5V_HDMI_2

JP303

JP302

R307 100

R306 100

R331 100

R305 100

R304 100

R327 100

A2

R308 R310 10K 10K

C302 0.01uF

D300 KDS184S

+5V_HDMI_1

+5V_MULTI

R309 R311 10K 10K

DDC_WP

HPD_MST_3

DDC_SDA1 DDC_SCL1

DDC_WP

DDC_SDA2 DDC_SCL2

D301 KDS184S

A1 C301 0.01uF

C

1 DATA2+

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

8 DATA0_SHIELD

9 DATA0-

10 CLK+

11 CLK_SHIELD

12 CLK-

13 CEC

14 NC

15 SCL

16 SDA

17DDC/CEC_GND

18 +5V_POWER

E

Q303 BSS83 CEC_READY D B G S

JP305

JP304

VSS

A2

A1

A0

D304 CDS3C30GTH 30V CEC_READY

R313 0

D303 MMBD301LT1G 30V CEC_READY

R315 68K CEC_READY

+3.3V_MST

R316 56K CEC_READY

TMDS3_RXC+ TMDS3_RX0TMDS3_RX0+ TMDS3_RX1TMDS3_RX1+ TMDS3_RX2TMDS3_RX2+

4

3

2

1

SDA

SCL

WP

VCC

CEC

CEC_C

5

6

7

8

IC302 CAT24C02WI-GT3

CEC TMDS3_RXC-

R314 1K

RT1C3904-T112

Q302C 2SC3875S

19 HPD

B

KJA-ET-0-0032 JK303

20

JACK_GND

R312 10K

+5V_HDMI_3

R318 100

R317 100

R329 100

A2 C300 0.01uF

DDC_SDA3 DDC_SCL3

DDC_WP

HDMI

MSTAR N-EU

R319 R320 10K 10K

D302 KDS184S

+5V_HDMI_3

+5V_MULTI

MST_HPD : USE MST HPD

3

9

2008/12/16

SW_HPD : USE SW HPD (Default)

OPTION

A1

+5V_MULTI +5V_HDMI_2

A2

2SC3875S

A1

C

EAX56856904 H6 LCD MERCURY

C

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only


Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

.

.

8

ZD401

ZD402

LED_R

LED_B

IR

GND

C414

19_22_26"

C402 100pF 50V

19_22_26" L405 BG1608B121F

0

READY

R400

0.1uF READY +3.3V_MST

R426 47K IR-OUT B

IR

R428 10K IR-OUT

E Q405 2SC3052 IR-OUT

C

R427 10K IR-OUT

+5VST_MST

NON_19_22_26"

C411 0.1uF

KEY2

KEY1

+3.3V_MULTI_MST

R418 0 READY

C B Q402 E 2SC3052 19_22_26"

R415 10K 19_22_26"

R414 10K 19_22_26"

+3.3V_MST

SUB_SCL

R406 4.7K 19_22_26"

+3.3V_MST

LED_R

B

C Q404 2SC3052 E IR-OUT

R429 10K IR-OUT

+5VST_MST

R430 22 IR-OUT

IR_OUT

KEY2

KEY1

19_22_26"

19_22_26"

L401 BG1608B121F

19_22_26" L400 BG1608B121F

C400 100pF 50V

C401 GND 100pF 19_22_26" 50V

KEY2

KEY1

3

2

1

SMAW200-03

19_22_26" P404

CONTROL KEY (19/22/26")

IR(19/22/26")

0 NON_19_22_26"

0.1uF NON_19_22_26" 16V R403

L407 120-ohm

+3.3V_MULTI_MST

NON_19_22_26" NON_19_22_26" R417 0

ZD400

C406 47uF 16V

L404 120-ohm

C408 0.1uF

R421 4.7K

+3.3V_MST

NON_19_22_26"

+5VST_MST

NON_19_22_26"

C412 470pF

L402 120ohm C403 C407 47pF

R404 10K 19_22_26" R416 0 READY C R410 10K 19_22_26" B Q401 E 19_22_26" 2SC3052

19_22_26" L408 BG1608B121F

C405 100pF 50V 19_22_26"

READY R413 0

5V_ST

GND

KEY2

KEY1

POWER_ON(LED_R_SMALL)

ST_3.3V(LED_B)

GND

IR

WARM_ST(LED_R_BIG)

GND

5V_ST

KEY2

KEY1

GND

SDA

SCL

C404 470pF

NON_19_22_26"

L406 120ohm

NON_19_22_26"

L403 120ohm

NON_19_22_26"

R420 4.7K

SUB_SDA

SUB_SCL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

9

7

6

5

4

3

2

1

19_22_26" P405

13

12

11

10

9

8

7

6

5

4

3

2

1

12507WS-12L

P400

NON_19_22_26"

L411 500-ohm NON_19_22_26" L410 500-ohm NON_19_22_26"

52

FHD

3 4 5

5

HD(26/32/37/42/47")

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

100

READY

R409

NON 22/27" FHD R425 0 R431 0 NON 22/27" FHD

TXCO4-

TXCO4+

TXCO3-

TXCO3+

TXCLKO-

TXCLKO+

TXCO2+ TXCO2-

TXCO0+ TXCO0TXCO1+ TXCO1-

TXCE4-

TXCE4+

TXCE3-

TXCE3+

TXCLKE-

TXCLKE+

TXCE2-

TXCE2+

TXCE1-

8BIT(HD) 8BIT(FHD) 52 sharp 32 sharp

X X X X

NON 22/27" FHD R423 0

+3.3V_MULTI_MST

R424 0 VESA

R407 4.7K JEIDA

R402 X 0 0 0 X

*8BIT(FHD):22/27"

R401 R402 0 8 B I T o r 5 2 s h a r p 10BIT(FHD) 4.7K

R401 4.7K 10BIT

+3.3V_MULTI_MST

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

9 10

8

7

8

7

6

2

4

6

1

3

TXCE0+ TXCE0TXCE1+

P402 FF10001-30

2

NON 22/27" FHD R419 0 R422 0 NON 22/27" FHD

+5V_+12V_LCD

+5V_+12V_LCD

TXCE0+

TXCE0-

TXCE1+

TXCE1-

TXCE2+

TXCE2-

TXCLKE+

TXCLKE-

TXCE3+

TXCE3-

0

MSTAR LVDS,CTR KEY

External VBR

E-DIM

OPC_OUT

OPC_OUTPUT

OPC_EABLE C B OPC_EN OPC_ENABLE E Q400 RT1C3904-T112

R411 1K

OPC_ENABLE

OPC_ENABLE

R412

R405 READY 0

R435 470 OPC_ENABLE

+3.3V_MULTI_MST

TXCE0+

TXCE0-

TXCE1+

TXCE1-

TXCE2+

TXCE2-

TXCLKE+

TXCLKE-

TXCE3+

TXCE3-

P403

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

SMW200-28C

4

9

2008/12/16

HD(19/22")

+5V_+12V_LCD

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

PANEL WAFER

1

TF05-51S

P401

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

IR(Non 19/22/26) CONTROL KEY(Non 19/22/26)

EAX56856904 H6 LCD MERCURY


Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

READY

B

C503 0.1uF 50V

E Q502 ISA1530AC1 C

R507 220

R506 220

120-ohm

L501 0 0 Ohm

L501-*1

C504 READY

C509 100uF 16V

+5V_TUNER

C506 100uF 16V

TV_MAIN

21

NTSC_TUNER

16

15

14

13

12

11

10

9

8

7

6

5

4

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SHIELD

20 NC_9

SHIELD

18

17

20

MAIN_SIF

M_SCL

M_SDA

C505 100uF 16V

Near the pin

19 NC_8

R502 4.7K

R505 47

R504 47

C508 10uF 16V

3

19

C507 82pF READY

C502 27pF

C501 0.01uF

+5V_TUNER

2

1

NC_9

NC_8

NC_7

NC_6

SIF-OUT

A-OUT

NC_5

V-OUT

NC_4

MOPLL_AS

SCL

SDA

GND_2

NC_3

TP[3.3V_OPT]

RF_AGC

NC_2

+B[5V]

GND_1

NC_1

TAFT-H203F

TU500-*1

15 A-OUT 16 SIF-OUT 17 NC_6 18 NC_7

14 NC_5

L502 10uH READY

9 SDA 10 PAL_TUNER SCL C500 27pF 11 MOPLL_AS 12 NC_4 13 V-OUT

21

120-ohm

L500

6 TP[3.3V_OPT] 7 NC_3 8 GND_2

5 RF_AGC

3 +B[5V] 4 NC_2

1 NC_1 2 GND_1

TU500 TAFT-Z203D

EAX56856904 H6 LCD MERCURY

MSTAR TUNER

5

9

2008/12/16


R624

READY

4

SPK_L+

C600 10uF 16V

C604 10uF 16V

6

7

VSS_IO

CLK_I

+1.8V_DVDD

C607 0.1uF 50V

C609 10uF 16V

14

12

AVDD_PLL

13

11

LFM

TEST0

10

AGND_PLL

DVDD_PLL

9

DGND_PLL

8

5

DVSS_1

VDD_IO

4

3

2

1

AD

RESET

VDR1A

BST1A

C611

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

3

SPK_L-

2

SMAW250-04

P600

+1.8V_DVDD

+1.8V_AVDD

C602 0.1uF

+3.3V_MULTI_MST

C608 R601 100 1uF C606 1000pF

C605 C603 0.1uF 1000pF C601 100pF R600 3.3K

+1.8V_AVDD

I2S_MCLK

Q603 RT1C3904-T112

SPK_R+

0

0 R631 22KREADY R627

E

SPK_R-

READY

10KB

1

MULTI_PW_SW

SW_RESET

R629

C

R630 10K

+3.3V_MST

+1.8V_DVDD

22000pF

PGND1A_2

56

MLB-201209-0120P-N2 0LCML00003B

C610 0.1uF

PGND1A_1

C642 10uF 35V

C615 0.1uF

C617 0.1uF

IC600 NTP-3100L

R602 R603 100 100

C638 33pF 50V READY

+16V_NTP

C612 330uF 35V

C616 22000pF

C613 0.01uF

R604 3.3

Main AMP

55

L605

OUT1A_2 54 17 100 R676

SDATA

18 WCK 100 R677

120-ohm

OUT1A_1 53

READY

PVDD1A_2 52

+1.8V_AVDD

SDA

19 BCK 100 R678

120-ohm

PVDD1A_1 51 20

MLB-201209-0120P-N2

PVDD1B_2 50 21 SCL

15

PVDD1B_1 49 22 MONITOR_0

23

0LCML00003B

OUT1B_2 48

C639 33pF 50V READY

C614 1uF

R673 0 C651 1000pF 50V

24 MONITOR_2

L606

OUT1B_1 47 25 FAULT

+1.8V

PGND1B_2 46 VDR2B

EAX56856904 H6 LCD MERCURY

PGND1B_1 45

MONITOR_1

I2S_SDO I2S_WS I2S_SCK M_SDA M_SCL AMP_MUTE_HOTEL

DVSS_2

BST1B 44

26

R656 0 HOTEL_OPT

16 DVDD

VDR1B 43

27 BST2B

28 PGND2B_1

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

R611 12

VDR2A BST2A PGND2A_2 PGND2A_1 OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2 PVDD2B_1 OUT2B_2 OUT2B_1 PGND2B_2

40 39 38 37 36 35 34 33 32 31 30 29

C626 0.1uF

+16V_NTP

R623 4.7K

R663 4.7K

C671 0.01uF

R625 3.3

R626 3.3

C672 0.01uF

R621 12

C634 390pF 1S 1F EAP38319001 R654 12

C673 0.47uF

SPK_L-

R658 R653 12 12 C630 L607 390pF 2S DA-8580 2F

C669 0.1uF

C637 0.1uF

C629 0.1uF

C632 0.47uF

C625 22000pF

C624 1uF

MULTI_PW_SW

C623 22000pF

NC

41

1S 1F EAP38319001

L603 2S DA-8580 2F

42

C618 1uF

C621 390pF R610 R638 12 12

C619 390pF

R608 12

C643 0.1uF

C644 0.1uF

R667 4.7K

R628 4.7K

SPK_L-

SPK_L+

C647 0.01uF

R635 3.3

R671 3.3

C648 0.01uF

SPK_R-

SPK_R+

MNT_ROUT

B

C

E

B

AMP_MUTE_HOTEL

R613-* 12K

R614 5.6K

C631 33pF

R613 10K

NON_HOTEL_OPT

R609 1K

C633 33pF

R615 5.6K

GND 11

8 9

AUDIO

10

6

9

2008/12/16

6

SPK_R-_HOTEL

5

4

3

2

P601 12505WR-09A00 HOTEL_OPT 1

7

OUT3 8

SPK_R+_HOTEL

R619 0

HOTEL_OPT

R620 0 C636 HOTEL_OPT 0.1uF HOTEL_OPT

+16V_NTP

7 OUT2

6 INPUT2- INPUT3- 9

5 INPUT2+ INPUT3+ 10

4 VCC

3 INPUT1+ INPUT4+ 12

2 INPUT1- INPUT4- 13

E

MSTAR N-EU

R612 200 B HOTEL_OPT

AUDIO_R

R622 6.8K

C635 0.01uF

R618 6.8K

1 OUT1 LM324DOUT4 14

IC601

R617 SW_RESET 10K HOTEL_OPT C Q602 RT1C3904-T112 HOTEL_OPT

+3.3V_MULTI_MST

R616-* 12K

HOTEL_OPT

R616 10K

NON_HOTEL_OPT

Chinese Hotel Option

R606 4.7K

Q601 RT1C3904-T112

C622 0.1uF

C628 6800pF

MNT_R_AMP

R607 1K

+12V_AUDIO

C627 6800pF

MNT_L_AMP

R605 4.7K

E

+12V_AUDIO

MNT_LOUT

Q600 RT1C3904-T112

C620 0.1uF

C

HOTEL_OPT

AMP :GAIN X 4 +12V_AUDIO


4

3

2

1

VSS

A2

A1

A0

1K

0

4

3

2

1

1K

150

SDA

SCL

WP

VCC

2K

R886

22

22

R8000 10K

Q800 ISA1530AC1

B E C

C870 47uF 25V

R885

220

R807 402 READY

R808

E B C Q801 ISA1530AC1

+12V_AUDIO

5

6

7

8

R813

R812

C803 0.01uF

R8028 4.7K

22

22

EEP_SDA

EEP_SCL

EEP_SDA

EEP_SCL

R888 C814 0.1uF

C8000 READY

1K

R853

D802 KDS181

MNT_VOUT_T

SW800 JTP-1127WEM

+5VST_MST

R810 68

R8041 C B E 47 Q802 RT1C3904-T112

R809 470

R8006

R8005

R817 4.7K

+3.3V_MULTI_MST

R8027 4.7K

+3.3V_MULTI_MST

100

C871 4.7uF 10V READY

R887 33K

E

Q803 RT1C3904-T112

R855 10K

+5VST_MST

C

D803 KDS181

C812 4.7uF

+5VST_MST

C819

C815

C833

0.1uF

0.1uF

0.1uF

L800 120-ohm

C810

C838

SYS_RESET

MULTI_PW_SW

POWER_DET

RL_ON

MNT_L_AMP MNT_R_AMP

SIDE_LIN SIDE_RIN

MAIN_SIF

MNT_VOUT_T

TV_MAIN

COMP2_PR SIDE_C SIDE_Y CVBS_VIN SIDE_V

COMP2_PB COMP2_Y

PC_R

PC_B PC_G

0.01uF

0.1uF

C804/C805/C806:Close to IC as close as possible

Q804 NON 19_22" RT1C3904-T112 R8037 C B R8007 33K E NON 19_22" 0

NON 19_22"

2.2uF 16V

B

READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

RESET

R861

D801 KDS181

R8001

R8036 20K 19_22_26"

R860

R800 READY 0

SDA

SCL

WP

VCC

IC803 CAT24WC08W-T

5

6

7

8

P_24V_SMALL_15V P_12V_SMALL_15V

MNT_VOUT

GAIN X 4

R8004 4.7K

HDCP EEPROM

VSS

A2

A1

A0

IC801 24LC256-I/SM

3 1

EEPROM

8 SO/SIO1 WP/ACC 9

SPI_DO

2

4

C841

0.1uF 0.1uF 2.2uF 2.2uF 100 100 100 100

C856 C861 R882 R881 R846 R847

0.047uF 0.047uF 0.047uF

0.047uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF

0.047uF

0.047uF

C868 C869

C834 C836 C837

C826 C828 C835 C830 C800 C801 C831 C832

+1.2V_VDDC_MST

22K 0.01uF

R845

47 47

R875 R876

22K 0.01uF

47 47 47

R831 R857 R830

R842 C839

47 47 470 47 47 47 47 47

R832 R834 R835 R837 R804 R815 R897 R802

C829

C827

47

10 10

R891 R892

47

10 10

R880 R890

R836

10 10 10 10 10 10

R869 R871 R872 R873 R874 R879

R833

10 10

R859 R862

390 0.1uF 0.1uF 0.1uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF

10 10 10 10

R851 R854 R856 R858

R814 R803 R816 R818 R838

C866 10uF

R840 C804 C805 C806 47 C843 470 C846 47 C845 47 C847 47 C825

TMDS1_RX2TMDS1_RX2+ HPD_MST_1

TMDS1_RX1TMDS1_RX1+

TMDS2_RX2TMDS2_RX2+ TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+

TMDS2_RXCTMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ HPD_MST_2 TMDS2_RX1TMDS2_RX1+

C867 0.1uF

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64

POWER_SW SYS_RESET CEC_C PC_VS PC_HS 0 0 R8035 R8034

TXD LED_R

100 100 R895 R849

IR DSUB_SDA RXD 100 100 R850 R8012

RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA REXT VCLAMP REFP REFM BIN1P SOGIN1 GIN1P RIN1P BINM BIN0P GINM GIN0P SOGIN0 RINM RIN0P AVDD_33_3 GND_2 BIN2P GIN2P SOGIN2 RIN2P CVBS6 S-VIDEO CVBS5 CVBS4 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_4 CVBSOUT GND_3 SIF0P SIF0M VDDC_1 AUL5 AUR5 AUVRM AUOUTL2 AUOUTR2 AUOUTL1 AUOUTR1

Close to IC with width trace

HDMI_2

0.1uF

KEY2 KEY1

0 0 READY READY R8016 R8017

100 100 R824 R825

C816 20pF

C817 20pF X801 12MHz R839 1M

+3.3V_MULTI_MST

10uF 16V 0.1uF 1000pF 4.7uF C809 C813 C818 C820

HDMI_1

GND

100

C883

TXD RXD EEP_SCL EEP_SDA RL_ON I2S_SDO I2S_SCK R8022 R8021 100 100

I2S_WS I2S_MCLK PANEL_STATUS R829

0.1uF C844

MST99A88ML(MATRIX BASIC)

IC800

R863 R864

4.7K 4.7K

HDMI_3

+3.3V_MULTI_MST

R867 1K R884 1K READY

R883 1K

100

0.01uF

C850

DDR2_D[13] DDR2_D[10] DDR2_D[8] DDR2_D[15]

R8018

DDR2_D[6] DDR2_D[1] DDR2_D[3] DDR2_D[4]

DDR2_D[14] DDR2_D[9] DDR2_D[12] DDR2_D[11]

1K

DDR2_A[6] DDR2_A[4] DDR2_A[2] DDR2_A[0] AR815 56

AR813 56

AR812 56

DDR2_CKE 56

DDR2_A[11] DDR2_A[8] DDR2_BA1 DDR2_WEZ AR814 56

1 2 3 4 5

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

R893 4.7K

AUOUTR1

AUOUTL1

AUOUTR2

AUOUTL2

AUVRM

AUR5

AUL5

VDDC_1

SIF0M

SIF0P

GND_3

CVBSOUT

AVDD_33_4

VCOM0

CVBS0

VCOM1

CVBS1

CVBS2

CVBS3

CVBS4

CVBS5

CVBS6

RIN2P

SOGIN2

GIN2P

BIN2P

GND_2

AVDD_33_3

RIN0P

RINM

SOGIN0

GIN0P

GINM

BIN0P

BINM

RIN1P

GIN1P

SOGIN1

BIN1P

REFM

REFP

VCLAMP

REXT

HOTPLUGA

21

22

23

24

25

26 27 28 29 30

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

173

174

175

176

177

178

179

180

181

182

183

184

185

186

187

188

189

190

191

192

MSTAR

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

144

145

146

147

148

149

150

151

152

153

154

155

156

157

158

159

160

161

162

163

164

165

166

167

168

169

170

171

172

C858 0.01uF

C859 0.01uF

B_DDR2_DQS[0]

B_DDR2_DQSB[0]

AVDD_DDR_3

VDDP_4

GND_12

B_DDR2_DQS[1]

B_DDR2_DQSB[1]

AVDD_DDR_4

B_MDATA[15]

B_MDATA[8]

GND_13

B_MDATA[10]

B_MDATA[13]

AVDD_DDR_5

B_MDATA[7]

B_MDATA[0]

B_MDATA[2]

B_MDATA[5]

B_MCLK

B_MCLKZ

TXCE4TXCE4+ TXCE3TXCE3+ TXCLKETXCLKE+ TXCE2TXCE2+ TXCE1TXCE1+ TXCE0TXCE0+

TXCO4TXCO4+ TXCO3TXCO3+ TXCLKOTXCLKO+ TXCO2TXCO2+ TXCO1TXCO1+ TXCO0TXCO0+

+3.3V_MULTI_MST

DDR2_D[0-15]

C864 0.01uF

+1.8V_DDR

C857 0.01uF

+1.2V_VDDC_MST

LVB4P

LVB4M

LVB3P

LVB3M

LVBCKP

LVBCKM

LVB2P

LVB2M

LVB1P

LVB1M

LVB0P

LVB0M

AVDD_LPLL

GND_7

VDDC_4

GPIO150/I2C_OUT_MUTE

GPIO151/I2C_OUT_SD2

GPIO152/I2C_OUT_SD3

GND_8

GPIO51

GPIO52

GPIO53

GPIO54

GPIO55

GPIO56

GPIO57

GPIO58

VDDP_3

VDDC_5

B_MDATA[4]

B_MDATA[3]

GND_9

B_MDATA[1]

B_MDATA[6]

AVDD_DDR_1

B_MDATA[11]

B_MDATA[12]

GND_10

B_MDATA[9]

B_MDATA[14]

AVDD_DDR_2

B_DDR2_DQM[1]

B_DDR2_DQM[0]

GND_11

C862 0.01uF

C878 0.01uF

C865 0.01uF

C879 0.01uF

7

9

2008/12/16

C860 0.01uF

C877 0.01uF

Close to IC as close as possible

IC800-*1 LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]

RXA2P

RXA2N

GND_1

RXA1P

RXA1N

AVDD_33_2

RXA0P

RXA0N

RXACKP

RXACKN

RXB2P

RXB2N

AVDD_33_1

RXB1P

RXB1N

HOTPLUGB

RXB0P

RXB0N

RXBCKP

RXBCKN

OPC_EN

MUTE_LINE R865 4.7K SUB_SCL R866 4.7K SUB_SDA S_VIDEO_DET PANEL_ON R819 3.3K DISP_EN/VAVS_ON SW_RESET DDC_WP

AR810 56

AR809 56

DDR2_DQM0 DDR2_DQM1

DDR2_DQS0M DDR2_DQS0P

DDR2_DQS1M DDR2_DQS1P

AR806 56

DDR2_MCLKZ DDR2_MCLK DDR2_D[5] DDR2_D[2] DDR2_D[0] DDR2_D[7]

AR805 56

MSTAR N-EU

0.1uF

1K

C842

0.1uF

C848

0.1uF

C849

R8042

0.1uF

C853

R8038

33 33

R843 R844

[MODE SELECTION]

R889 1K

R811 1K READY

+3.3V_MULTI_MST

192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129

0.1uF C863

B_MCLKZ B_MCLK B_MDATA[5] B_MDATA[2] B_MDATA[0] B_MDATA[7] AVDD_DDR_5 B_MDATA[13] B_MDATA[10] GND_13 B_MDATA[8] B_MDATA[15] AVDD_DDR_4 B_DDR2_DQSB[1] B_DDR2_DQS[1] GND_12 VDDP_4 AVDD_DDR_3 B_DDR2_DQSB[0] B_DDR2_DQS[0] GND_11 B_DDR2_DQM[0] B_DDR2_DQM[1] AVDD_DDR_2 B_MDATA[14] B_MDATA[9] GND_10 B_MDATA[12] B_MDATA[11] AVDD_DDR_1 B_MDATA[6] B_MDATA[1] GND_9 B_MDATA[3] B_MDATA[4] VDDC_5 VDDP_3 GPIO58 GPIO57 GPIO56 GPIO55 GPIO54 GPIO53 GPIO52 GPIO51 GND_8 GPIO152/I2C_OUT_SD3 GPIO151/I2C_OUT_SD2 GPIO150/I2C_OUT_MUTE VDDC_4 GND_7 AVDD_LPLL LVB0M LVB0P LVB1M LVB1P LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P LVB4M LVB4P

1K R868

DDR2_A[3] DDR2_A[7] DDR2_A[12] DDR2_A[9] DDR2_A[5] DDR2_A[10] DDR2_A[1] R852

DDR2_CASZ DDR2_RASZ DDR2_ODT AR800 56

DDR2_BA0

256 255 254 253 252 251 250 249 248 247 246 245 244 243 242 241 240 239 238 237 236 235 234 233 232 231 230 229 228 227 226 225 224 223 222 221 220 219 218 217 216 215 214 213 212 211 210 209 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 HWRESET CEC VSYNC1 HSYNC1 VSYNC0 HSYNC0 IRIN GPIO140 GPIO139 GPIO138 GPIO135 GPIO134 XIN XOUT AVDD_MPLL SAR3 SAR2 SAR1 SAR0 USB0_DP USB0_DM GND_18 GND_17 UART1_TX/GPIO87 UART1_RX/GPIO86 UART2_TX/I2CM_SCK UART2_RX/I2CM_SDA SPDIFO I2S_OUT_SD I2S_OUT_BCK VDDC_7 GND_16 VDDP_5 I2S_OUT_WS I2S_OUT_MCK I2S_IN_SD I2S_IN_BCK/GPIO68 I2S_IN_WS/GPIO67 VDDC_6 A_MCLKE A_MADR[3] A_MADR[7] A_MADR[12] A_MADR[9] A_MADR[5] AVDD_DDR_6 A_MADR[10] A_MADR[1] A_BADR[0] A_BADR[1] A_WEZ A_MADR[11] A_MADR[8] A_MADR[6] GND_15 A_MADR[4] A_MADR[2] A_MADR[0] A_CASZ A_RASZ A_ODT MVREF AVDD_MEMPLL GND_14

AUL0 AUR0 AUL1 AUR1 AUL2 AUR2 AUL3 AUR3 AUCOM AUL4 AUR4 GND_4 AUVRP AUVAG AVDD_AU GND_5 VDDC_2 DDCA_CK DDCA_DA DDCDA_CK DDCDA_DA DDCDB_CK DDCDB_DA GPIO20 VDDP_1 VDDC_3 UART2_RX UART2_TX DDCDC_CK RXCCKN RXCCKP DDCDC_DA RXC0N RXC0P GND_6 RXC1N RXC1P AVDD_DM RXC2N RXC2P HOTPLUGC USB1_DM USB1_DP SCK SDI SDO SCZ PWM0 PWM1 PWM2 PWM3 LVA4P LVA4M LVA3P LVA3M LVACKP LVACKM LVA2P LVA2M LVA1P LVA1M LVA0P LVA0M VDDP_2 M_SDA M_SCL

DDC_WP

65 AUL0

R828 C B E 10K Q805 READY RT1C3904-T112

66

R878 4.7K

67

GND 10

68

7 CS

74 AUL4

SPI_CZ

69 AUL1 AUR0

+3.3V_MULTI_MST

HWRESET

70 AUL2 AUR1

NC_5 11

CEC 256

71 AUL3 AUR2

NC_6 12

VSYNC1 254

255

72 AUR3

6 NC_4

75 AUR4

5 NC_3

76 GND_4

R877 4.7K

77 AUVRP

+3.3V_MULTI_MST

AUVAG

C823 2.2uF 65 CVBS_LIN 66 C824 2.2uF CVBS_RIN 67 68 69 C802 2.2uF COMP2_L 70 C873 2.2uF COMP2_R 71 C874 2.2uF 72 C875 2.2uF 73 C808 0.1uF 74 C821 2.2uF PC_AUD_L 75 C822 2.2uF PC_AUD_R 76 77 78 79 C840 0.01uF L801 80 120-ohm 81 82 R894 0 DSUB_SCL 83 R899 0 DSUB_SDA 84 R8023 100 DDC_SCL1 85 R8024 100 DDC_SDA1 86 R8025 100 DDC_SCL2 87 R8026 100 DDC_SDA2 88 R8033 0 READY POWER_DET 89 C882 0.1uF 90 R806 0 91 R870 0 92 R8039 100 HDMI3_SIDE 93 DDC_SCL3 R801 10 HDMI3_SIDE 94 TMDS3_RXCR805 10 HDMI3_SIDE 95 TMDS3_RXC+ R8040 100 HDMI3_SIDE 96 DDC_SDA3 R820 10 HDMI3_SIDE 97 TMDS3_RX0R821 10 HDMI3_SIDE 98 TMDS3_RX0+ 99 R822 10 HDMI3_SIDE 100 TMDS3_RX1R823 10 HDMI3_SIDE 101 TMDS3_RX1+ C876 0.01uF 102 R841 10 HDMI3_SIDE 103 TMDS3_RX2R848 10 HDMI3_SIDE 104 TMDS3_RX2+ 105 HPD_MST_3 106 R826 0 USB_DN 107 USB PART USB_DP R827 0 108 SPI_CLK 109 AR818 SPI_DI 33 110 SPI_DO 111 SPI_CZ 112 113 114 I-DIM 115 E-DIM 116 117 118 119 120 121 122 123 124 125 126 127 128

+1.2V_VDDC_MST

A_MADR[11]

+1.8V_DDR

A_MADR[8] 204

205

L802 120-ohm

XOUT 78

+3.3V_MULTI_MST

82

NC_7 13

83

4 NC_2

89

SPI_DI

93

NC_8 14

94

SI.SIO0 15

97

3 NC_1

98

2 VCC

103

+3.3V_MULTI_MST

105

I2S_OUT

107

C811 0.1uF

108

SPI_CLK

110

SCLK 16

111 SCZ SDO

1 HOLD

99 RXC0P

C807 0.01uF

80 GND_5

+3.3V_MULTI_MST

100 GND_6 RXC0N

+1.8V_DDR

101 RXC1P RXC1N

R8003 10K

A_MCLKE 104 RXC2P RXC2N

+3.3V_MST

90 VDDP_1

R8020 10K

81 VDDC_2

+3.3V_MST

UART2_RX/I2CM_SDA 91 VDDC_3

** Small HD : 19/22/26 Inch ** Non Small FHD : Normal(non 100Hz) FHD Model

109 SDI SCK USB1_DP

IC802 MX25L6405DMI-12G

84 DDCA_CK

SERIAL FLASH 64M

85 DDCA_DA

4.7K R8010 4.7K R8011 +3.3V_MULTI_MST R896 4.7K R898 4.7K +3.3V_MULTI_MST Small_HD Non_Small_FHD Small_HD Small_FHD R898-*2 R8010-*3 R896-*2 R8011-*3 4.7K 4.7K 4.7K 4.7K 100Hz Non_Small_HD Apollo DDR2_A[0-12] 100Hz R8010-*2 R8011-*2 R898-*1 R896-*1 4.7K 4.7K 4.7K 4.7K Small_FHD Non_Small_FHD Apollo Apollo R8010-*1 R8011-*1 4.7K 4.7K Small_FHD +5VST_MST Non_Small_HD

AVDD_MPLL 242

243

79 AVDD_AU

R8010 R8011 X 4.7K 4.7K 4.7K X 4.7K 4.7K X 4.7K 4.7K X 4.7K

SPDIFO 229

230

92 UART2_TX UART2_RX

R898 X X X 4.7K 4.7K 4.7K

A_MADR[3] 216

217

106 USB1_DM HOTPLUGC

R896 4.7K 4.7K 4.7K X X X

95 RXCCKP RXCCKN DDCDC_CK

Small HD Small FHD (27) Non Small HD Non Small FHD Apollo 100HZ

86 DDCDB_CK DDCDA_CK

*H/W OPTION

73 AUCOM

115 PWM3

112 PWM0

113 PWM1

114 PWM2

116 LVA4P

118 LVA3P

122 LVA2P

124 LVA1P

126 LVA0P

88 GPIO20

117 LVA4M

119 LVA3M

123 LVA2M

125 LVA1M

127 LVA0M

128 VDDP_2

120 LVACKP

121 LVACKM

102 AVDD_DM

96 DDCDC_DA

EAX56856904 H6 LCD MERCURY

XIN 244

GPIO134 245

GPIO135 246

GPIO138 247

GPIO139 248

GPIO140 249

IRIN 250

HSYNC0 251

VSYNC0 252

HSYNC1 253

UART2_TX/I2CM_SCK 231

UART1_RX/GPIO86 232

UART1_TX/GPIO87 233

GND_17 234

GND_18 235

USB0_DM 236

USB0_DP 237

SAR0 238

SAR2 240

SAR3 241

VDDC_6 218

I2S_IN_WS/GPIO67 219

I2S_IN_BCK/GPIO68 220

I2S_IN_SD 221

I2S_OUT_MCK 222

I2S_OUT_WS 223

VDDP_5 224

GND_16 225

VDDC_7 226

I2S_OUT_BCK 227

I2S_OUT_SD 228

A_WEZ 206

A_BADR[1] 207

A_BADR[0] 208

A_MADR[1] 209

A_MADR[10] 210

AVDD_DDR_6 211

A_MADR[5] 212

A_MADR[9] 213

A_MADR[12] 214

A_MADR[7] 215

GND_14 193

AVDD_MEMPLL 194

MVREF 195

A_ODT 196

A_RASZ 197

A_CASZ 198

A_MADR[0] 199

A_MADR[2] 200

A_MADR[4] 201

GND_15 202

A_MADR[6] 203

SAR1 239

87 DDCDB_DA DDCDA_DA

Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only


Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

DDR2_A[0-12]

DDR2_D[0-15]

C905 1000pF

C918 0.1uF 50V

V_REF

+1.8V_DDR

DDR2_DQS0M DDR2_DQS1M

DDR2_DQM0 DDR2_DQM1

DDR2_DQS0P DDR2_DQS1P

DDR2_RASZ DDR2_CASZ DDR2_WEZ

DDR2_ODT

DDR2_MCLK DDR2_MCLKZ DDR2_CKE

DDR2_BA1

DDR2_BA0

READY

R906 150

R901 56

R903 56

56

VDDL

VSSDL

NC3

NC2

NC1

NC6

NC5

NC4

UDQS

LDQS

UDM

LDM

UDQS

LDQS

WE

CAS

RAS

CS

ODT

CKE

CK

CK

BA1

BA0

A12

A11

J2

J1

J7

R8

E2

A2

R7

R3

L1

A8

E8

B3

F3

B7

F7

K3

L7

K7

L8

K9

K2

K8

J8

L3

L2

R2

P7

M2

P3

P8

P2

N7

N3

N8

N2

M7

M3

M8

H8

H2

F8

F2

E7

D8

D2

A7

B8

B2

P9

N1

J3

E3

A3

G9

G7

G3

G1

E9

C9

C7

C3

C1

A9

R1

M9

J9

E1

A1

B9

B1

D9

D1

D3

D7

C2

C8

F9

F1

H9

H1

H3

H7

G2

G8

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

VSSQ10

VSS1

VSS2

VSS3

VSS4

VSS5

VDDQ1

VDDQ2

VDDQ3

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

VDDQ10

VDD1

VDD2

VDD3

VDD4

VDD5

DQ15

DQ14

DQ13

DQ12

DQ11

DQ10

DQ9

DQ8

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

DDR2 MEMORY

C919 10uF 10V

R905 56

R904

56

R902

56

A9

A8

A7

A6

A5

A4

A3

A2

A1

A0

VREF

IC900 HYB18TC512160B2F-2.5

DDR2_D[0-15]

A10/AP

V_REF

R900

C900 0.01uF 50V

DDR2_A[12]

DDR2_A[11]

DDR2_A[10]

DDR2_A[9]

DDR2_A[8]

DDR2_A[7]

DDR2_A[6]

DDR2_A[5]

DDR2_A[4]

DDR2_A[3]

DDR2_A[2]

DDR2_A[1]

DDR2_A[0]

Close to DDR2 IC

C904 0.01uF

+1.8V_DDR

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDR2

EAX56856904 H6 LCD MERCURY

1K R907 1K R908

+1.8V_DDR

DDR2_D[15]

DDR2_D[14]

DDR2_D[13]

DDR2_D[12]

DDR2_D[11]

DDR2_D[10]

DDR2_D[9]

DDR2_D[8]

DDR2_D[7]

DDR2_D[6]

DDR2_D[5]

DDR2_D[4]

DDR2_D[3]

DDR2_D[2]

DDR2_D[1]

DDR2_D[0]

C901 0.01uF

C902 0.01uF

C903 0.01uF

C906 0.01uF

Close to DDR2 IC +1.8V_DDR

C907 0.01uF

C909 0.01uF

C910 0.01uF

DDR2

MSTAR

C908 0.01uF

C911 0.01uF

C912 0.01uF

C913 0.01uF

C914 0.01uF

C916 0.01uF

C917 0.01uF

8

9

2008/12/16

C915 0.01uF


Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

NC

24V

GND

12V

GND

5.2V

5.2V

GND

GND

NC

R1005 1.2K

R1002 10K

5.2V

5

26"

23

21

19

17

15

13

11

9

7

25

2

24

22

20

18

16

14

12

10

8

6

4

Power ON

PWM Dim

24

R10450 CMO 32,42,47,57

R1043 0 NON CMO 32,42,47,57

R1042 0

R1041 0 CMO 57"

R1064

0

PWM Dim

Error Out

120-ohm

L1001

120-ohm

L1012 MLB-201209-0120P-N2

+5VST_MST

OPC_ENABLE R1021 1K OPC_DISABLE

R1075 1K

OPC_DISABLE R1076 1K

NON 19_22"

R1022 1K OPC_ENABLE

OPC_OUT

E-DIM

DISP_EN/VAVS_ON

+12V_AUDIO

+16V_NTP

NC

NC

5V

5V

GND

GND

15V

15V

RL_ON

C1053 0.01uF

PANEL_STATUS

11

10

C1044 2.2uF 16V

R1079 10K

I-DIM

R1023 0 NON (CMO 32,42,47,57, SHARP 32")

R1014 0 CMO 32,42,47,57

A.Dim

PWM_Dim

9

8

7

6

5

4

3

2

1

SMAW200-11

P1002

19_22"

+3.3V_MST C1034 1uF 25V READY

+5VST_MST C1011 0.01uF

C1001 0.1uF 50V

Inverter_ON

C1052 10uF 16V

C1008 0.01uF

C1007 0.01uF

C1046 0.01uF

R1001 0 NON CMO 57"

3 R1003 10K 12 NON 19_22" Q1000 2SC3875S

R1000 2.2K

P_24V_SMALL_15V

**OPC_ENABLE : USE LGD Module

C1045 2.2uF 16V R1044-*1 100 DC_DIM PWM_DIM

R1044 1K DC_DIM

R1039 0 CMO 32,42,47

3 R1047 10K 1 2 Q1002 2SC3875S

R1046 3K

+5V_MULTI

VOUT

NON 19_22"

P_5V

GND

3 2 MAX 300mA 1

P_12V_SMALL_15V

P_5V

IC1007 AP2121N-3.3TRE1 VIN

R1054 4.7K NON SHARP 32&52",AUO 25V R1053 C1043 0 0.47uF SHARP 52",AUO NON SHARP 52",AUO

R1040 0 CMO 57"

C1003 10uF 16V

C1002 47uF 25V

C1006 68uF 35V

*ST 5V->3.3V

P_5V

P_12V_SMALL_15V

*SHARP32":DC DIMMING

Inverter ON

24V

GND

12V

GND

5.2V

5.2V

GND

GND

NON_19_22_26"

23

22

20

19

21

18

16

14

12

10

8

6

4

2

17

15

13

11

9

7

5

3

1

Power ON

Error Out

Inverter ON

24V

GND

12V

GND

5.2V

5.2V

GND

GND

P1000 FW20020-24S

NC

A.Dim

NC

24V

GND

12V

GND

1

3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D1002 SAM2333

+5V_MULTI

NC

A.Dim

+5VST_MST

LED Block

P_24V_SMALL_15V

P_12V_SMALL_15V

P_5V

R1077 0 READY

NC

5.2V

GND

GND

P1001 FM20020-24

.

L1000 CIC21J501NE EAM58113401

R1074 0

P_24V_SMALL_15V

1/4W 5%

EAX56856904 H6 LCD MERCURY

19_22"

C1004 10uF 16V

C1017 10uF 16V C1012 560pF 50V

R1008 12K 4

3

2

1

MAX 2A

5

6

7

8

PGND

SW

PVCC

EN

R1073

0

INPUT 3 C1054 0.1uF

R1068 10K

R1020 10K

R1048

R1049 33K

B

R1069 1.6K

R1070 22K

E

C

C1048 1uF

Q1004 RT1C3904-T112

P_5V

P_12V_SMALL_15V

L1008 CIC21J501NE

0 NON 19_22"

R1012

S2A 50V

19_22" D1001

C1030 10uF 25V

R2

R1

C1056 1uF 25V

R1065 33K NON 19_22" R1065-*1 19_22" 10K C 10K B Q1001 RT1C3904-T112 E

C1027 68uF 35V READY Close to Q1003

**DC-DC CONVERTER 12V->5V_TUNER/USB

POWER_SW

PANEL_ON

P_12V_SMALL_15V

1

2

1

G2

4

S2 3

G1

S1

Q1003 SI4925BDY EBK32753101

R1057 30K

C1031 10uF 25V

R1058 5.6K

C1032 560pF 50V

BS 4

IN 3

GND2

FB 1

R2 C1018 10uF 16VR1010 3.3K 1%

R1009 2K

D1_2

5

D2_1

6 D2_2

7 D1_1

8

0

R1011

MAX 3A

IC1006 MP2212DN

5 VCC

6 SW_1

7 SW_2

8 EN/SYNC

R1059 10K NON 19_22"

R1

C1035 1uF 25V

1

C1029 0.1uF 50V

R1007 56 1%

C1022 10uF 6.3V

R1013 0

R1004 120 5%

MSTAR

C1033 0.1uF 50V

C1000 10uF 16V

POWER

R1024 10

+5V_MULTI

L1009 3.6uH

C1024 0.1uF 50V READY

R1056 10

+5V_MULTI

READY

R1051 2.2K

OUT:5V

R1050 2.2K

R2

R1

OUT:1.85V C1023 0.1uF 50V

C1020 10uF 16V

R1052 2.2K

19_22"

R1015 10

C1025 0.1uF 16V

19_22"

+5V_USB

+5V_TUNER

+5V_MULTI

9

9

2008/12/16

RL_ON

Small(19_22") 3 R1017 10K 12 19_22" Q1005 2SC3875S

R1016 4.7K

+5V_MULTI 19_22"

DDR2, Vref

NTP,AUDIO DSP

+1.8V

+5V_+12V_LCD

L1010 MLB-201209-0120P-N2

C1010 0.01uF

C1038 1uF 25V READY

C1009 100uF16V

120-ohm

C1037 1uF 25V READY

+1.8V_DDR

+3.3V_MULTI_MST

OUT:1.27V +1.2V_VDDC_MST

L1013 MLB-201209-0120P-N2

C1036 1uF 25V READY

V0 = 1.25*(1+(R2/R1))

OUT

ADJ/GND

3 MAX 1A 2

0LCML00003B

C1026 100uF 16V

R1018 2K NON 19_22"

IC1002 AP1117EG-13

L1007 MLB-201209-0120P-N2

C1015 0.1uF 50V

IN

C1019 C1021 10uF 16V 0.01uF

C1005 0.1uF

C1016 10uF 10V

C1028 100uF 16V

2 OUTPUT OUT:3.3V

ADJ/GND

MAX 3A

V0 = 0.8*(1+(R1/R2))

L1006 L1005 120-ohm 120-ohm 19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"

P_5V

C1014 0 . 1 u F C1013 10uF 16V 16V

IC1003 AZ1085S-3.3TR/E1

R1078 3.3 READY C1055 2200pF 50V READY

L1002 2.2uH

10K R1006

V0 = 0.8*(1+(R2/R1))

GND

ITH

VCC

IC1001 BD9130EFJ-E2

**Switch 12V:P12V **Switch 5V:5V_MULTI -> 1.8V

+5V_MULTI

ADJ

**5V_MULTI->3.3V->1.2V

1/10W 1% 1/10W


P/NO : MFL60021513

Jan., 2009 Printed in Korea


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