Manual de serviço tv lg lcd 22lh20r lg chassis lp91a

Page 1

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LCD TV SERVICE MANUAL CHASSIS : LP91A

MODEL : 22LH20R

22LH20R-MA

CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.


CONTENTS

CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION................................................................11 TROUBLE SHOOTING ............................................................................16 BLOCK DIAGRAM...................................................................................19 EXPLODED VIEW .................................................................................. 20 SVC. SHEET ...............................................................................................

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LGE Internal Use Only


SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit Keep wires away from high voltage or high temperature parts.

AC Volt-meter

Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock. To Instrument’s exposed METALLIC PARTS

Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

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-3-

Good Earth Ground such as WATER PIPE, CONDUIT etc. 0.15uF

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard

LGE Internal Use Only


SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

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LGE Internal Use Only


IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This spec sheet is applied to LCD TV used LP91A chassis.

1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC

2. Specification Each part is tested as below without special appointment. 1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC 2) Relative Humidity : 65±10% 3) Power Voltage : Standard input voltage(100~240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.

4. Electrical specification 4.1 General Specification No

Item

Specification

1

Screen Size

22” wide Color Display Module

2

Aspect Ratio

16:9

3

LCD Module

22” TFT WXGA LCD

4

Operating Environment

Temp.: 0 ~ 40 deg

Measurement

Remark Resolution: 1366*768

Humidity : 0 ~ 80 % 5

Storage Environment

Temp.: -20 ~ 60 deg Humidity : 0~ 85 %

6 7

Input Voltage LDC Module

AC100-240V~, 50/60Hz ≤ 65 W

22” HD

HD

626 x 373 x 44.1

(Maker : LGD)

with inverter

0.1405 x 0.4215 12 EEFL Coating

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3H

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LGE Internal Use Only


5. Chroma& Brightness (Optical) 5.1. LCD Module the Color Coordinates check condition - 50cm from the surface, Full White Pattern - Picture mode Vivid No.

Item

1.

Luminance

2.

VIew angle (R/L, U/D)

3.

Color Coordinates

Min.

Typ.

280

350

Max.

Unit

Maker

Remark

cd/m2

(W/O PC mode) 178 / 178 White RED Green Blue 4.

Contrast ratio

5.

Luminance Variation

degree

Wx

Typ

0.285

Typ

Wy

-0.03

0.293

+0.03

Xr

0.642

Yr

0.333

Xg

0.295

Yg

0.608

Xb

0.147

Yb

0.063 700:1

CR > 10 LGD 22”(HD) LC220WXE-TBA1

1000:1

LGD 22”(HD) 1.3

8. Component Video Input (Y, PB, PR) Specification

No Resolution

Remark

H-freq(kHz)

V-freq(Hz) 59.94

Pixel Clock(MHz)

1

720* 480

15.73

13.500

SDTV, DVD 480I( 525I)

2

720* 480

15.75

60.00

13.514

SDTV, DVD 480I( 525I)

3

720* 576

15.625

50.00

13.500

SDTV, DVD 576I( 625I) 50Hz

4

720* 480

31.47

59.94

27.000

SDTV 480P

5

720* 480

31.50

60.00

27.027

SDTV 480P

6

720* 576

31.25

50.00

27.000

SDTV 576P 50Hz

7

1280* 720

44.96

59.94

74.176

HDTV 720P

8

1280* 720

45.00

60.00

74.250

HDTV 720P

9

1280* 720

37.50

50.00

74.25

HDTV 720P 50Hz

10

1920* 1080

28.125

50.00

74.250

HDTV 1080I 50Hz,

11

1920* 1080

33.72

59.94

74.176

HDTV 1080I

12

1920* 1080

33.75

60.00

74.25

HDTV 1080I

13

1920* 1080

56.25

50

148.5

HDTV 1080P

14

1920* 1080

67.432

59.94

148.350

HDTV 1080P

15

1920* 1080

67.5

60.00

148.5

HDTV 1080P

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LGE Internal Use Only


9. RGB 9.1 Analog PC, RGB- DTV –NOT SUPPORT Specification

No Resolution

H-freq(kHz)

Remark V-freq(Hz)

Pixel Clock(MHz)

1

640* 350

31.468

70.09

25.17

EGA

2

720* 400

31.469

70.09

28.32

DOS

3

640* 480

31.469

59.94

25.17

VESA( VGA)

4

800* 600

37.879

60.317

40

VESA( SVGA)

5

1024* 768

48.363

60.004

65

VESA( XGA)

6

1280* 768

47.776

59.87

79.5

VESA( WXGA)

7

1360* 768

47.72

59.799

84.75

VESA( WXGA)

8

1280* 1024

63.668

59.895

109.00

XGA

Only FHD Model

9

1920* 1080

66.587

59.934

138.50

WUXGA(Reduced Blanking)

Only FHD Model

10. HDMI Input 10.1 PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

640 x 480

31.469

59.94

25.17

VESA( VGA)

2

800 x 600

37.879

60.317

40.00

VESA( SVGA)

3

1024 x 768

48.363

60.004

65.00

VESA( XGA)

4

1280 x 768

47.776

59.87

79.5

VESA( WXGA)

5

1360 x 768

47.72

59.799

84.62

VESA( WXGA)

1

Resolution

Proposed

6

1366 x 768

47.7

60.00

84.62

WXGA

7

1280 x 1024

63.595

60.00

108.875

SXGA

8

1920 x 1080

66.647

59.988

138.625

WUXGA

Remark

10.2 DTV Mode Specification

No Resolution

H-freq(kHz)

Remark V-freq(Hz)

Pixel Clock(MHz)

1

720 x 480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

2

720 x 480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

Spec. out

3

720 x 576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50Hz

but display.

4

720 x 480

31.47

59.94

27

SDTV 480P

5

720 x 480

31.5

60.00

27.027

SDTV 480P

6

720 x 576

31.25

50.00

27

SDTV 576P

7

1280 x 720

44.96

59.94

74.176

HDTV 720P

8

1280 x 720

45

60.00

74.25

HDTV 720P

9

1280 x 720

37.5

50.00

74.25

HDTV 720P

10

1920 x 1080

28.125

50.00

74.25

HDTV 1080I

11

1920 x 1080

33.72

59.94

74.176

HDTV 1080I

12

1920 x 1080

33.75

60.00

74.25

HDTV 1080I

13

1920 x 1080

56.25

50.00

148.5

HDTV 1080P

14

1920 x 1080

67.432

59.94

148.350

HDTV 1080P

15

1920 x 1080

67.5

60.00

148.5

HDTV 1080P

16

1920 x 1080

27

24.00

74.25

HDTV 1080P

17

1920 x 1080

33.75

30.00

74.25

HDTV 1080P

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LGE Internal Use Only


11. Mechical spec. No

Item

Min

Typ

Max

Unit

1.

C/ A + B/ C top gap

0.5

1

1.5

mm

2.

C/ A + B/ C side gap

0.5

1

1.5

mm

3.

C/ A + Deco Front gap( ONE SIDE).

0.8

1

1.2

mm

1) Gap between Front Frame /Back cover and Middle Cabinet 2) Gap between Front Frame /Middle Cabinet

Top View Back Cover "b Middle Cabinet "b

Front Frame Gap b between Front Frame (Back cover) and Middle Cabinet -> 0 † b † B (Side gap)

"b

Gap a between Front Frame and Middle Cabine -> 0 † a † A (Side gap)

"a Gap a between Front Frame and Middle Cabine -> 0 † a † A (Left/ Right gap)

3) Gap between Back Cover and Side AV Side View

Back View

Side AV

Back Cover

Gap f between Back Cover and Side AV -> 0 † f † 1.0 Gap g between Back Cover and Side AV -> 0 † g † 1.0 Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


4)Gap between Back Cover and Side AV

Side View

"h"

Control Braket

Back Cover

Gap h between Back Cover and Control Bracket -> 0 †h †0.8 *Active area 1. Active area of LCD PANEL is in bezel of cabinet 2. Interval between active area and bezel |A-B|< 2.0 mm ,|C-D|< 2.0 mm A:Interval between left of active area and bezel B:Interval between right of active area and bezel C:Interval between top of active area and bezel D:Interval between bottom of active area and beze C Active Area B

A

D

Bezel

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LGE Internal Use Only


ADJUSTMENT INSTRUCTION 1. Application Range This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis.

(2) Download steps 1) Execute ‘ISP Tool’ program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the “Connect” button and confirm “Dialog Box”

2. Specification 1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 25 ±5 °C of temperature and 65±10% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100~220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.

3. Adjustment items 3.1. PCB assembly adjustment items (1) Download the MSTAR main software (IC800, Mstar ISP Utility) 1) Using D/L Jig 2) Using USB Memory Stick. (2) ADC Calibration – RGB / Component (3) Input Tool-Option/Area option. (4) Check SW Version.

4. PCB assembly adjustment method 4.1. Mstar Main S/W program download

3) Click the “Config.” button and Change speed I2C Speed setting : 350Khz~400Khz

4.1.1. Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(RGB) jack - LH20/ LH30

4) Read and write bin file. Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

1

1

Filexxx.bin

Filexxx.

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LGE Internal Use Only


5) Click “(2)Auto” tab and set as below 6) Click “(3)Run”. 7) After downloading, you can see the “(4)Pass” message.

4.2. Adjust tool/area option. Adjust tool/area option refer to the BOM.

4.3. Adjust tool/area option. Adjust tool/area option refer to the BOM.

4.4. EDID D/L method Recommend that don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If not possible, recommend that connect the MSPG equipment. There are two methods of downloading the edid data

4.1.2. Using the Memory Stick * USB download : Service Mode 1) Insert the USB memory stick to the ISB port. 2) Automatically detect the SW Version. -> S/W download process is executed automatically. 3) Show the message “Copy the file from the Memory”

4.4.1. 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2. Automatically downloaded when pushing the enter key after adjusting the tool option2. It takes about 2seconds.

4.4.2. 2nd Method * Caution : Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well. 1) Press the ADJ key 2) Move to the EDID D/L and Press the right direction key(G) 3) Press the right direction key(G) at Start. 4) After about a few seconds, appear “OK”, then compele.

4) After Finished the Download, Automatically DC Off -> On

4.4.3. RS-232C command Method (1) Command : AE 00 10 * Caution Don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If the cables are connected, Downloading of edid could be failed.

5) Check The update SW Version. Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only


4.4.4. EDID data (1) HD MODEL <Analog(RGB): 128bytes>

4.5. ADC Calibration 4.5.1. ADC Calibration - Component (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to Component1 or 2 mode. 2) Input the Component 480i@60Hz 100% Color Bar YPbPr signal into Component1 or 2. (MSPG-925F Model: 209 / Pattern: 65 )

<HDMI 1 : 256Bytes>

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : Component” by using D/E (CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear <HDMI 2 : 256Bytes>

OK

4.5.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to RGB mode.. 2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : RGB” by using D/E(CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear OK

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LGE Internal Use Only


4.6. Input Tool-Option, Area Option. ## TOOL Option, Area Option change and AC off Before PCBA check, you have to change the Tool option, Area option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)

5.3. Connecting diagram of equipment for measuring (For automatic adjustment)

4.6.1. Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market 4.6.2. Equipment : adjustment remote control. 4.6.3. Adjustment method The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) * Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value * Never push the IN-STOP KEY after completing the function inspection.

* LP91A~D Support RS-232C & I2C DDC Communication-White Balance Mode. (1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode)

4.7. Check SW Version (1) Method 1) Push In-star key on Adjust remote-controller. 2) SW Version check Check “SW VER : V3.xx” – LH20

(3) Enter the adjust mode of white balance) - Enter the white balance adjustment mode with aging command (F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)

5.3. Adjustment of White Balance (for Manual adjustment)

5. White Balance adjstment 5.1. Overview (1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature. (2) Principle : To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. (3) Adjustment mode : Three modes – Cool / Medium / Warm

5.2. Required Equipment (1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product LCD TV (ch:9) (should be used in the calibrated ch by CS-1000) (3) Auto W/B adjustment instrument(only for Auto adjustment)

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 14 -

(1) Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting. (3) For manual adjustment, it is also possible by the following sequence. 1) Select white pattern of heat-run by pressing “POWER ON” key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.) 2) Push “Exit” key. 3) Change to the AV mode by remote control. 4) Input external pattern (85% white pattern) 5) Push the ADJ key -> Enter “0000” (Password) 6) Select “3. W/B ADJUST” 7) Enter the W/B ADJUST Mode 8) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.. 9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 10) Adjust three modes all (Cool / Medium / Warm) : Fix the one of R/G/B gain and change the others 11) When adjustment is completed, Enter “COPY ALL”. 12) Exit adjustment mode using EXIT key on R/C. LGE Internal Use Only


* CASE First adjust the coordinate far away from the target value(x, y). 1. x, y > target i) Decrease the R, G. 2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode Cool

x

y

0.285 ± 0.002

0.293 ± 0.002

Medium 0.295 ± 0.002 Warm

0.313 ± 0.002

Temp

uv∆

9300K

0.000

0.305 ± 0.002

8000K

0.000

0.329 ± 0.002

6500K

0.000

To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 15 -

LGE Internal Use Only


TROUBLESHOOTING No power (LED indicator off)

:

[A] PROCESS

Fail

Check 24V, 12V, 5,2V of Power B/D

Check short of Main B/D or Change Power B/D

Pass

Fail

Check Output of IC1001, IC1003, IC1007

Check short of IC1001, IC1003, IC1007

Fail

Re-soldering or Change defect part of IC1001, IC1003, IC1007

Pass Pass Change IC1002,, Q1003 Fail Check LEDAssy

Change LEDAssy

Pass

Check P307 Connector

No Raster

[B]: Process

Pass

Check LED status On Display Unit

Fail

Repeat A PROCESS

Pass

Check Panel Link Cable Or Module

Fail

Change Panel Link Cable Or Module

Fail

Change Inverter Connector Or Inverter

Pass

Check Inverter Connector Or Inverter Pass

Check Output of IC802

Fail

Change IC802

Pass Check LVDS Cable

Fail

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

Change Module

- 16 -

LGE Internal Use Only


No Raster on PC Signal

Pass Check Input source Cable and Jack Pass Check the Input/Output Of J104

Fail

Re-soldering or Change the defect part

Pass Check the Input/Output Of IC100

Fail

Re-soldering or Change the defect part, Check RGB EDID Data

Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Pass Repeat [A], & [B] Process

No Raster on HDMI Signal

No Raster on COMMPONENT Signal

Pass

Pass

Check Input source Cable And Jack

Check Input source Cable And Jack

Pass

Pass Check The Input/Output Of JK101

Check the Input/Output Of JK301, JK302, JK303

Fail

Re-soldering or Change the defect part

Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Pass Check the Input/Output Of IC300, IC301, JK302

Pass

Fail

Re-soldering or Change the defect part

Fail

Re-soldering or Change the defect part Check HDMI EDID Data Re-download HDCP

Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Pass

Repeat [A], & [B] Process

Repeat [A], & [B] Process

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 17 -

LGE Internal Use Only


No Raster On AV (Video, S-Video)Signal

No Signal On TV(RF) Signal

Pass

Pass

Check Input source Cable And Jack

Check Input source Cable And Jack

Pass Pass Check The Input/Output Of JK101, JK201

Fail

Re-soldering or Change the defect part

Check The Input/Output Of TU500

Fail

Re-soldering or Change the defect part

Pass Pass Check the Input/Output Of IC800

Fail

Re-soldering or Change the defect part

Check the Input/Output Of IC800

Pass

Fail

Re-soldering or Change the defect part

Pass

Repeat [A], & [B] Process

Repeat [A], & [B] Process

No Sound

Check The Input Sourse.

Fail

Change The Source Input.

Pass

Check The Input/Output Of IC600.

Fail

Re-soldering or Change the defect part.

Pass

Check The Speaker.

Fail

Change Speaker.

Pass

Check The Speaker Wire.

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 18 -

LGE Internal Use Only


Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 19 -

AV2 ( Sid e AV)

HDMI3

USB

USB Fo r D/ L

RS232

TV ( RF)

AV1

MNT_OUT

COMP1 COMP2

RGB_PC

PC_Aud io

EEPROM 24C02

SIDE_V : 1Vp p

SIF

SUB_SCL / SDA

PC_SCL/ SDA

EEPROM 24C02 HDMI3_SCL/ SDA

AUDIO AMP

HDMI1_SCL/ _ SDA

HDM 2_SCL/ SDA

232C Driver ST3232C

SIDE_L/ SIDE_R :5 00mVrms

TMDS

Tx/ Rx : – 15Vp p

TUNER

TU_MAIN

MNT_LOUT/ ROUT: 500m Vrm s

AV11_LIN/ RIN :5 00m Vrms

MNT_OUT: 1Vp p

AV1_VIN: 1Vp p

COMP2_Y/ Pb /Pr / : 1/ 0. 7Vp p Co mp 1_L/ R :5 00mVrms Co mp 2_L/ R :5 00mVrms

Pr : 1/ 0. 7Vp p COMP1_Y/ Pb / P

PC_R/ G/ B/ HS/ VS

EEPROM 24C02

EEPROM 24C02 PC_Aud io _L/ R :7 00m Vrms

TMDS TMDS

AV2_VIN

AV2_LIN/ RIN

HDMI_DATA_3

USB_DN/ PN

IIS_OUT

OUT_O_TX_A– OUT_O_TX_A OUT_O_TX_B OUT_O_TX_B– OUT_O_TX_C OUT_O_TX_C– OUT_O_TX_CLK– OUT_O_TX_C OUT_O_TX_D OUT_O_TX_D– OUT_O_TX_E OUT_O_TX_E–

OUT_E_TX_A OUT_E_TX_A– OUT_E_TX_B OUT_E_TX_B– OUT_E_TX_C OUT_E_TX_C– OUT_E_TX_CLK OUT_E_TX_CLK– OUT_E_TX_D – OUT_E_TX_ OUT_E_TX_E – OUT_E_TX_

MAIN SCALER

TXD / RXD :5V Dig it al

SIF

TU_MAIN

MNT_L/ R OUT

AV1_LIN/ RIN

MNT_VOUT

AV1_VIN

COMP2_LIN/ RIN

COMP2_Y/ Pb / Pr: 1/0. 7Vp p MNT_OUT RIN COMP1_LIN/

COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p

PC_R/ G/ B/ HS/ VS

PC_Aud io _L/ R

IR HDMI_DATA_1 HDMI_DATA_2 TX

DDR2( 512MB)

EEPROM( 256K)

Serial Flas h ( 8MByt e)

PWM NTP3100L R_CH L_CH

L VDS c onnec tor

HDMI1 HDMI2

R_SPK_OUT L_SPK_OUT

BLOCK DIAGRAM

LGE Internal Use Only


EXPLODED VIEW IMPORTANT SAFETY NOTICE

900

121 500

A2

510

300

120

LV1

A10

200

530

910

540

800

AC1

400

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

- 20 -

LGE Internal Use Only


4

3

2

VSS

A2

A1

A0

1K

0

1K

6

3

150

SDA

SCL

WP

VCC

2K

22

R8000 10K

Q800 ISA1530AC1 B E C R886

C870 47uF25V

R885

220

R807 402 READY

R808

E C B Q801 ISA1530AC1

+12V_AUDIO

5

7

2

4

8

1

R813

22

C803 0.01uF

R812

SW800 JTP-1127WEM

+5VST_MST

R810 68

R8041 C B E 47 Q802 RT1C3904-T112

R809 470

R8006 22

R8005 22

R817 4.7K

EEP_SDA

EEP_SCL

EEP_SDA

EEP_SCL

R888 C814 0.1uF

C8000 READY

1K

R853

D802 KDS181

MNT_VOUT_T

R8028 4.7K

+3.3V_MULTI_MST

R8027 4.7K

100 R887 33K

Q803 RT1C3904-T112

R855 10K

+5VST_MST

C

2.2uF E 16V

B

C871 4.7uF 10V READY

+5VST_MST

D803 KDS181

C812 4.7uF

C819

C815

0.1uF

0.1uF

0.1uF

C810

C838

SYS_RESET

MULTI_PW_SW

POWER_DET

RL_ON

MNT_L_AMP MNT_R_AMP

SIDE_LIN SIDE_RIN

MAIN_SIF

MNT_VOUT_T

TV_MAIN

COMP2_PR SIDE_C SIDE_Y CVBS_VIN SIDE_V

COMP2_PB COMP2_Y

PC_R

PC_B PC_G

HDMI_2 0.01uF

0.1uF

C804/C805/C806:Close to IC as close as possible

Q804 NON 19_22" RT1C3904-T112 R8037 C B R8007 33K E NON 19_22" 0

NON 19_22"

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

RESET

R861

D801 KDS181

R8001

R8036 20K 19_22_26"

R860

R800 READY 0

SDA

SCL

WP

VCC

IC803 CAT24WC08W-T

5

6

7

8

P_24V_SMALL_15V P_12V_SMALL_15V

MNT_VOUT

GAIN X 4

R8004 4.7K

HDCP EEPROM

VSS

A2

A1

1

3 1

A0

2

4

C833

0.01uF

C841

0.1uF 0.1uF 2.2uF 2.2uF 100 100 100 100

C856 C861 R882 R881 R846 R847

0.047uF 0.047uF 0.047uF

0.047uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF

0.047uF

0.047uF

C868 C869

C834 C836 C837

C826 C828 C835 C830 C800 C801 C831 C832

C829

+1.2V_VDDC_MST

22K

47 47

R875 R876

22K 0.01uF

47 47 47

R831 R857 R830

R845

47 47 470 47 47 47 47 47

R832 R834 R835 R837 R804 R815 R897 R802

R842 C839

47

C827

47

R836

10 10

R891 R892

R833

10 10

R880 R890

R814 R803 R816 R818 R838

10 10 10 10 10 10

R869 R871 R872 R873 R874 R879

390 0.1uF 0.1uF 0.1uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF

10 10

R859 R862

R840 C804 C805 C806 47 C843 470 C846 47 C845 47 C847 47 C825

TMDS1_RX2TMDS1_RX2+ HPD_MST_1

TMDS1_RX1TMDS1_RX1+

TMDS2_RX2TMDS2_RX2+ TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+

100

0.1uF C883

POWER_SW SYS_RESET CEC_C PC_VS PC_HS 0 0 R8035 R8034

TXD LED_R

100 100 R895 R849

IR DSUB_SDA RXD 100 100 R850 R8012

KEY2 KEY1

0 READY 0 READY R8016 R8017

100 100 R824 R825

C816 20pF

C817 20pF X801 12MHz R839 1M

I2S_WS I2S_MCLK PANEL_STATUS R829

TXD RXD EEP_SCL EEP_SDA RL_ON I2S_SDO I2S_SCK 100 R8022 100 R8021

0.1uF C844

MST99A88ML(MATRIX BASIC)

+3.3V_MULTI_MST

4.7K

4.7K

R864

R863

HDMI_3

+3.3V_MULTI_MST

R867 1K 1K R868

0.1uF C863

DDR2_A[6] DDR2_A[4] DDR2_A[2] DDR2_A[0] AR815 56

AR813 56

AR812 56

DDR2_CKE 56

DDR2_A[11] DDR2_A[8] DDR2_BA1 DDR2_WEZ AR814 56

DDR2_A[3] DDR2_A[7] DDR2_A[12] DDR2_A[9] DDR2_A[5] DDR2_A[10] DDR2_A[1] R852

DDR2_CASZ DDR2_RASZ DDR2_ODT AR800 56

DDR2_BA0

HWRESET 256 CEC 255 VSYNC1 254 HSYNC1 253 VSYNC0 252 HSYNC0 251 IRIN 250 GPIO140 249 GPIO139 248 GPIO138 247 GPIO135 246 GPIO134 245 XIN 244 XOUT 243 AVDD_MPLL 242 SAR3 241 SAR2 240 SAR1 239 SAR0 238 USB0_DP 237 USB0_DM 236 GND_18 235 GND_17 234 UART1_TX/GPIO87 233 UART1_RX/GPIO86 232 UART2_TX/I2CM_SCK 231 UART2_RX/I2CM_SDA 230 SPDIFO 229 I2S_OUT_SD 228 I2S_OUT_BCK 227 VDDC_7 226 GND_16 225 VDDP_5 224 I2S_OUT_WS 223 I2S_OUT_MCK 222 I2S_IN_SD 221 I2S_IN_BCK/GPIO68220 I2S_IN_WS/GPIO67219 VDDC_6 218 A_MCLKE 217 A_MADR[3] 216 A_MADR[7] 215 A_MADR[12] 214 A_MADR[9] 213 A_MADR[5] 212 AVDD_DDR_6 211 A_MADR[10] 210 A_MADR[1] 209 A_BADR[0] 208 A_BADR[1] 207 A_WEZ 206 A_MADR[11] 205 A_MADR[8] 204 A_MADR[6] 203 GND_15 202 A_MADR[4] 201 A_MADR[2] 200 A_MADR[0] 199 A_CASZ 198 A_RASZ 197 A_ODT 196 MVREF 195 AVDD_MEMPLL 194 GND_14 193 IC800

R884 1K READY

R883 1K

[MODE SELECTION]

R889 1K

R811 1K READY

+3.3V_MULTI_MST

C842

0.1uF

0.01uF

100

R8042

C850

1K

R8038

0.1uF

0.1uF

C849

C848

0.1uF

C853

DDR2_D[13] DDR2_D[10] DDR2_D[8] DDR2_D[15]

R8018

DDR2_D[6] DDR2_D[1] DDR2_D[3] DDR2_D[4]

DDR2_D[14] DDR2_D[9] DDR2_D[12] DDR2_D[11]

1K

1 2 3

187

10 11 12 13 14

176

173

174

175

177

178

179

180

181

182

183

184

185

16

20

19

18

17

15

186

188

189

190

191

192

5

9

8

7

6

4

R893 4.7K

165

161

158

154

144

SIF0M

AUVRM

AUR5

AUL5

VDDC_1

AUOUTL2 AUOUTL1

AUOUTR2 AUOUTR1

52 53

56 57 58 59 60 61 62 63 64

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

145

146

147

148

149

150

151

152

153

155

38

48

51

50

49

47

46

45

44

43

42

41

40

39

156

157

159

160

162

163

164

166

167

168

169

170

172

27

31

34

37

36

35

33

32

30

29

28

26

25

24

171

21

22

23

54 SIF0P 55

GND_3

CVBSOUT

AVDD_33_4

VCOM0

CVBS0

VCOM1

CVBS1

CVBS2

CVBS3

CVBS4

CVBS5

CVBS6

RIN2P

SOGIN2

GIN2P

BIN2P

GND_2

AVDD_33_3

RIN0P

RINM

SOGIN0

GIN0P

GINM

BIN0P

BINM

RIN1P

GIN1P

SOGIN1

BIN1P

REFM

REFP

VCLAMP

REXT

HOTPLUGA

C858 0.01uF

C859 0.01uF

B_DDR2_DQS[0]

B_DDR2_DQSB[0]

AVDD_DDR_3

VDDP_4

GND_12

B_DDR2_DQS[1]

B_DDR2_DQSB[1]

AVDD_DDR_4

B_MDATA[15]

B_MDATA[8]

GND_13

B_MDATA[10]

B_MDATA[13]

AVDD_DDR_5

B_MDATA[7]

B_MDATA[0]

B_MDATA[2]

B_MDATA[5]

B_MCLK

B_MCLKZ

TXCE4TXCE4+ TXCE3TXCE3+ TXCLKETXCLKE+ TXCE2TXCE2+ TXCE1TXCE1+ TXCE0TXCE0+

TXCO4TXCO4+ TXCO3TXCO3+ TXCLKOTXCLKO+ TXCO2TXCO2+ TXCO1TXCO1+ TXCO0TXCO0+

+3.3V_MULTI_MST

DDR2_D[0-15]

C864 0.01uF

+1.8V_DDR

C857 0.01uF

+1.2V_VDDC_MST

LVB4P

LVB4M

LVB3P

LVB3M

LVBCKP

LVBCKM

LVB2P

LVB2M

LVB1P

LVB1M

LVB0P

LVB0M

AVDD_LPLL

GND_7

VDDC_4

GPIO150/I2C_OUT_MUTE

GPIO151/I2C_OUT_SD2

GPIO152/I2C_OUT_SD3

GND_8

GPIO51

GPIO52

GPIO53

GPIO54

GPIO55

GPIO56

GPIO57

GPIO58

VDDP_3

VDDC_5

B_MDATA[4]

B_MDATA[3]

GND_9

B_MDATA[1]

B_MDATA[6]

AVDD_DDR_1

B_MDATA[11]

B_MDATA[12]

GND_10

B_MDATA[9]

B_MDATA[14]

AVDD_DDR_2

B_DDR2_DQM[1]

B_DDR2_DQM[0]

GND_11

IC800-*1 LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]

RXA2P

RXA2N

GND_1

RXA1P

RXA1N

AVDD_33_2

RXA0P

RXA0N

RXACKP

RXACKN

RXB2P

RXB2N

AVDD_33_1

RXB1P

RXB1N

HOTPLUGB

RXB0P

RXB0N

RXBCKP

RXBCKN

OPC_EN

MUTE_LINE R865 4.7K SUB_SCL R866 4.7K SUB_SDA S_VIDEO_DET PANEL_ON R819 3.3K DISP_EN/VAVS_ON SW_RESET DDC_WP

AR810 56

AR809 56

DDR2_DQM0 DDR2_DQM1

DDR2_DQS0M DDR2_DQS0P

DDR2_DQS1M DDR2_DQS1P

AR806 56

65

+3.3V_MULTI_MST

HWRESET

66 AUL0

IC801 24LC256-I/SM

CEC 255

256

67 AUL1

AUR0

HDMI_1

GND

DDR2_MCLKZ DDR2_MCLK DDR2_D[5] DDR2_D[2] DDR2_D[0] DDR2_D[7]

HSYNC1 68

AUL0 AUR0 AUL1 AUR1 AUL2 AUR2 AUL3 AUR3 AUCOM AUL4 AUR4 GND_4 AUVRP AUVAG AVDD_AU GND_5 VDDC_2 DDCA_CK DDCA_DA DDCDA_CK DDCDA_DA DDCDB_CK DDCDB_DA GPIO20 VDDP_1 VDDC_3 UART2_RX UART2_TX DDCDC_CK RXCCKN RXCCKP DDCDC_DA RXC0N RXC0P GND_6 RXC1N RXC1P AVDD_DM RXC2N RXC2P HOTPLUGC USB1_DM USB1_DP SCK SDI SDO SCZ PWM0 PWM1 PWM2 PWM3 LVA4P LVA4M LVA3P LVA3M LVACKP LVACKM LVA2P LVA2M LVA1P LVA1M LVA0P LVA0M VDDP_2

AR805 56

70

33 33

74 AUL4

R843 R844

VSYNC0 252

253

69 AUL2

AUR1

B_MCLKZ 192 B_MCLK 191 B_MDATA[5] 190 B_MDATA[2] 189 B_MDATA[0] 188 B_MDATA[7] 187 AVDD_DDR_5 186 B_MDATA[13] 185 B_MDATA[10] 184 GND_13 183 B_MDATA[8] 182 B_MDATA[15] 181 AVDD_DDR_4 180 B_DDR2_DQSB[1] 179 B_DDR2_DQS[1] 178 GND_12 177 VDDP_4 176 AVDD_DDR_3 175 B_DDR2_DQSB[0] 174 B_DDR2_DQS[0] 173 GND_11 172 B_DDR2_DQM[0] 171 B_DDR2_DQM[1] 170 AVDD_DDR_2 169 B_MDATA[14] 168 B_MDATA[9] 167 GND_10 166 B_MDATA[12] 165 B_MDATA[11] 164 AVDD_DDR_1 163 B_MDATA[6] 162 B_MDATA[1] 161 GND_9 160 B_MDATA[3] 159 B_MDATA[4] 158 VDDC_5 157 VDDP_3 156 GPIO58 155 GPIO57 154 GPIO56 153 GPIO55 152 GPIO54 151 GPIO53 150 GPIO52 149 GPIO51 148 GND_8 147 GPIO152/I2C_OUT_SD3 146 GPIO151/I2C_OUT_SD2 145 GPIO150/I2C_OUT_MUTE 144 VDDC_4 143 GND_7 142 AVDD_LPLL 141 LVB0M 140 LVB0P 139 LVB1M 138 LVB1P 137 LVB2M 136 LVB2P 135 LVBCKM 134 LVBCKP 133 LVB3M 132 LVB3P 131 LVB4M 130 LVB4P 129

71 AUL3

AUR2

RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA REXT VCLAMP REFP REFM BIN1P SOGIN1 GIN1P RIN1P BINM BIN0P GINM GIN0P SOGIN0 RINM RIN0P AVDD_33_3 GND_2 BIN2P GIN2P SOGIN2 RIN2P CVBS6 S-VIDEO CVBS5 CVBS4 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_4 CVBSOUT GND_3 SIF0P SIF0M VDDC_1 AUL5 AUR5 AUVRM AUOUTL2 AUOUTR2 AUOUTL1 AUOUTR1

72 AUR3

EEPROM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64

75 AUR4

10 10 10 10

76 GND_4

R851 R854 R856 R858

80 GND_5

TMDS2_RXCTMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ HPD_MST_2 TMDS2_RX1TMDS2_RX1+

77 AUVRP

READY

78 AUVAG

8 SO/SIO1 WP/ACC 9

73 AUCOM

SPI_DO

81 VDDC_2

C866 10uF

79 AVDD_AU

L800 120-ohm

82

C867 0.1uF

83

DDC_WP

89

R828 C B E 10K Q805 READY RT1C3904-T112

93

R878 4.7K

94

GND 10

97

7 CS

98

SPI_CZ

103

+3.3V_MULTI_MST

105

NC_5 11

107

NC_6 12

109 SDI

6 NC_4

AVDD_DDR_6

111 SCZ

5 NC_3

A_MADR[10] 210

211 110 SDO

R877 4.7K

112 PWM0

+3.3V_MULTI_MST

113 PWM1

C823 2.2uF 65 CVBS_LIN 66 C824 2.2uF CVBS_RIN 67 68 69 C802 2.2uF COMP2_L 70 C873 2.2uF COMP2_R C874 2.2uF 71 72 C875 2.2uF 73 C808 0.1uF Close to IC 74 C821 2.2uF PC_AUD_L with width trace 75 C822 2.2uF PC_AUD_R C809 10uF 16V 76 C813 0.1uF 77 78 C818 1000pF 79 C820 4.7uF C840 0.01uF L801 80 120-ohm 81 82 R894 0 DSUB_SCL 83 R899 0 DSUB_SDA 84 R8023 100 DDC_SCL1 85 R8024 100 DDC_SDA1 86 R8025 100 DDC_SCL2 87 R8026 100 DDC_SDA2 88 R8033 0 READY POWER_DET 89 C882 0.1uF 90 R806 0 91 M_SDA R870 0 92 M_SCL R8039 100 HDMI3_SIDE 93 DDC_SCL3 R801 10 HDMI3_SIDE 94 TMDS3_RXCR805 10 HDMI3_SIDE 95 TMDS3_RXC+ R8040 100HDMI3_SIDE 96 DDC_SDA3 R820 10 HDMI3_SIDE 97 TMDS3_RX0R821 10 HDMI3_SIDE 98 TMDS3_RX0+ 99 R822 10 HDMI3_SIDE 100 TMDS3_RX1R823 10 HDMI3_SIDE 101 TMDS3_RX1+ C876 0.01uF 102 R841 10 HDMI3_SIDE 103 TMDS3_RX2R848 10 HDMI3_SIDE 104 TMDS3_RX2+ 105 HPD_MST_3 106 R826 0 USB_DN 107 USB PART USB_DP R827 0 108 SPI_CLK 109 AR818 SPI_DI 33 110 SPI_DO 111 SPI_CZ 112 113 114 I-DIM 115 E-DIM 116 117 118 119 120 121 122 123 124 125 126 127 128

+1.2V_VDDC_MST

114 PWM2

+1.8V_DDR

115 PWM3

L802 120-ohm

116 LVA4P

+3.3V_MULTI_MST

118 LVA3P

SPI_DI

122 LVA2P

NC_7 13

124 LVA1P

NC_8 14

126 LVA0P

SI.SIO015

99 RXC0P

4 NC_2

100 GND_6 RXC0N

3 NC_1

GND_16

101 RXC1P RXC1N

2 VCC

104 RXC2P RXC2N

+3.3V_MULTI_MST

88 GPIO20

I2S_OUT

117 LVA4M

SPI_CLK

119 LVA3M

SCLK 16

123 LVA2M

1 HOLD

A_RASZ

125 LVA1M

C807 0.01uF

A_ODT 196

197

C860 0.01uF

C877 0.01uF

C862 0.01uF

C878 0.01uF

C865 0.01uF

C879 0.01uF

Close to IC as close as possible

127 LVA0M

+3.3V_MULTI_MST

90 VDDP_1

+1.8V_DDR

128 VDDP_2

R8003 10K

91 VDDC_3

+3.3V_MST

120 LVACKP

R8020 10K

108 SCK

USB1_DP

C811 0.1uF

121 LVACKM

+3.3V_MST

84 DDCA_CK

** Small HD : 19/22/26 Inch ** Non Small FHD : Normal(non 100Hz) FHD Model

SAR1

85 DDCA_DA

IC802 MX25L6405DMI-12G

102 AVDD_DM

SERIAL FLASH 64M

92 UART2_TX

UART2_RX

4.7K R8010 4.7K R8011 +3.3V_MULTI_MST R896 4.7K R898 4.7K +3.3V_MULTI_MST Small_HD Small_HD Non_Small_FHD Small_FHD R898-*2 R8010-*3 R896-*2 R8011-*3 4.7K 4.7K 4.7K 4.7K 100Hz Non_Small_HD 100Hz Apollo DDR2_A[0-12] R8010-*2 R8011-*2 R898-*1 R896-*1 4.7K 4.7K 4.7K 4.7K Small_FHD Non_Small_FHDApollo Apollo R8010-*1 R8011-*1 4.7K 4.7K +5VST_MST Small_FHD Non_Small_HD

106 USB1_DM HOTPLUGC

R8011 X 4.7K 4.7K X 4.7K 4.7K

95 RXCCKP RXCCKN DDCDC_CK

R8010 4.7K 4.7K X 4.7K 4.7K X

VSYNC1 254

SAR2 240

SAR3 241

AVDD_MPLL 242

XOUT 243

XIN 244

GPIO134 245

GPIO135 246

GPIO138 247

GPIO139 248

GPIO140 249

IRIN 250

HSYNC0 251

VDDC_7 226

I2S_OUT_BCK 227

I2S_OUT_SD 228

SPDIFO 229

UART2_RX/I2CM_SDA 230

UART2_TX/I2CM_SCK 231

UART1_RX/GPIO86 232

UART1_TX/GPIO87 233

GND_17 234

GND_18 235

USB0_DM 236

A_MADR[5] 212

A_MADR[9] 213

A_MADR[12] 214

A_MADR[7] 215

A_MADR[3] 216

A_MCLKE 217

VDDC_6 218

I2S_IN_WS/GPIO67 219

I2S_IN_BCK/GPIO68 220

I2S_IN_SD 221

I2S_OUT_MCK 222

I2S_OUT_WS 223

A_CASZ 198

A_MADR[0] 199

A_MADR[2] 200

A_MADR[4] 201

GND_15 202

A_MADR[6] 203

A_MADR[8] 204

A_MADR[11] 205

A_WEZ 206

A_BADR[1] 207

A_BADR[0] 208

A_MADR[1] 209

GND_14 193

AVDD_MEMPLL 194

MVREF 195

USB0_DP 237

86 DDCDB_CK DDCDA_CK

R898 X X X 4.7K 4.7K 4.7K

SAR0 238

239

87 DDCDB_DA

R896 Small HD 4.7K Small FHD (27) 4.7K Non Small HD 4.7K Non Small FHD X Apollo X X 100HZ

VDDP_5 224

225 96 DDCDC_DA

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes DDCDA_DA

*H/W OPTION

SCHEMATIC DIAGRAM MSTAR

LGE Internal Use Only


Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes +1.8V_DDR

DDR2_DQS0M DDR2_DQS1M

DDR2_DQM0 DDR2_DQM1

DDR2_DQS0P DDR2_DQS1P

DDR2_RASZ DDR2_CASZ DDR2_WEZ

DDR2_ODT

DDR2_MCLK DDR2_MCLKZ DDR2_CKE

DDR2_BA1

DDR2_BA0

READY

R906 150

R901 56

R903 56

56

VDDL

VSSDL

NC3

NC2

NC1

NC6

NC5

NC4

UDQS

LDQS

UDM

LDM

UDQS

LDQS

WE

CAS

RAS

CS

ODT

CKE

CK

CK

BA1

BA0

A12

A11

J2

J1

J7

R8

E2

A2

R7

R3

L1

A8

E8

B3

F3

B7

F7

K3

L7

K7

L8

K9

K2

K8

J8

L3

L2

R2

P7

M2

P3

P8

P2

N7

N3

N8

N2

M7

M3

M8

H8

H2

F8

F2

E7

D8

D2

A7

B8

B2

P9

N1

J3

E3

A3

G9

G7

G3

G1

E9

C9

C7

C3

C1

A9

R1

M9

J9

E1

A1

B9

B1

D9

D1

D3

D7

C2

C8

F9

F1

H9

H1

H3

H7

G2

G8

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

VSSQ10

VSS1

VSS2

VSS3

VSS4

VSS5

VDDQ1

VDDQ2

VDDQ3

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

VDDQ10

VDD1

VDD2

VDD3

VDD4

VDD5

DQ15

DQ14

DQ13

DQ12

DQ11

DQ10

DQ9

DQ8

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

DDR2 MEMORY

C919 10uF 10V

R905 56

R904

56

R902

56

A9

A8

A7

A6

A5

A4

A3

A2

A1

A0

VREF

IC900 HYB18TC512160B2F-2.5

DDR2_D[0-15]

A10/AP

V_REF

R900

C900 0.01uF 50V

DDR2_A[12]

DDR2_A[11]

DDR2_A[10]

DDR2_A[9]

DDR2_A[8]

DDR2_A[7]

DDR2_A[6]

DDR2_A[5]

DDR2_A[4]

DDR2_A[3]

DDR2_A[2]

DDR2_A[1]

DDR2_A[0]

Close to DDR2 IC

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDR2_A[0-12]

C918 0.1uF 50V

V_REF

C904 C905 0 . 0 1 u F 1000pF

+1.8V_DDR 1K R907 1K R908

DDR2_D[0-15]

+1.8V_DDR

DDR2_D[15]

DDR2_D[14]

DDR2_D[13]

DDR2_D[12]

DDR2_D[11]

DDR2_D[10]

DDR2_D[9]

DDR2_D[8]

DDR2_D[7]

DDR2_D[6]

DDR2_D[5]

DDR2_D[4]

DDR2_D[3]

DDR2_D[2]

DDR2_D[1]

DDR2_D[0]

C901 0.01uF

C902 0.01uF

C903 0.01uF

C906 0.01uF

Close to DDR2 IC +1.8V_DDR

C907 0.01uF

C908 0.01uF

C909 0.01uF

C910 0.01uF

C911 0.01uF

C912 0.01uF

C913 0.01uF

C914 0.01uF

C915 0.01uF

C916 0.01uF

C917 0.01uF

DDR2

LGE Internal Use Only


Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

NC

24V

GND

12V

GND

5.2V

5.2V

GND

GND

NC

R1005 1.2K

R1002 10K

3

1

26"

23

21

19

17

15

13

11

9

7

5

25

8

6

4

2

24

22

20

18

16

14

12

10

5.2V

GND

GND

Power ON

24

PWM Dim

Error Out

R10450 CMO 32,42,47,57

R1043 0 NON CMO 32,42,47,57

R1042 0

R1041 0 CMO 57"

R1064 0

120-ohm

L1001

120-ohm

+5VST_MST

VIN

OPC_ENABLE R1021 1K OPC_DISABLE

R1075 1K

OPC_DISABLE R1076 1K

NON 19_22"

R1022 1K OPC_ENABLE

NC

NC

5V

5V

GND

GND

15V

15V

RL_ON

C1053 0.01uF

8

7

6

5

4

3

2

1

SMAW200-11

R1001 0 NON CMO 57"

PANEL_STATUS

11

10

C1044 2.2uF 16V

R1079 10K

I-DIM

R1023 0 NON (CMO 32,42,47,57, SHARP 32")

A.Dim

PWM_Dim

P1002

19_22"

+3.3V_MST C1034 1uF 25V READY

+5VST_MST C1011 0.01uF

R1014 0 CMO 32,42,47,57

OPC_OUT

E-DIM

DISP_EN/VAVS_ON

+16V_NTP

+12V_AUDIO

C1001 0.1uF 50V

Inverter_ON 9

C1052 10uF16V

C1008 0.01uF

C1007 0.01uF

C1046 0.01uF

3 R1003 10K 12 NON 19_22" Q1000 2SC3875S

R1000 2.2K

P_24V_SMALL_15V

**OPC_ENABLE : USE LGD Module

C1045 2.2uF 16V R1044-*1 100 DC_DIM PWM_DIM

R1044 1K DC_DIM

R1039 0 CMO 32,42,47

3 R1047 10K 1 2 Q1002 2SC3875S

R1046 3K

+5V_MULTI

VOUT

NON 19_22"

P_5V

GND

3 2 MAX 300mA 1

P_12V_SMALL_15V

P_5V

IC1007 AP2121N-3.3TRE1

R1054 4.7K NON SHARP 32&52",AUO 25V R1053 C1043 0 0.47uF SHARP 52",AUO NON SHARP 52",AUO

R1040 0 CMO 57"

C1003 10uF 16V

C1002 47uF 25V

*ST 5V->3.3V

*SHARP32":DC DIMMING

Inverter ON

24V

GND

12V

GND

5.2V

5.2V

GND

GND

NON_19_22_26"

23

22

20

19

21

18

16

14

12

10

8

6

4

2

17

15

13

11

9

7

5

3

1

Power ON

PWM Dim

Error Out

Inverter ON

24V

GND

12V

GND

5.2V

P1000 FW20020-24S

NC

A.Dim

NC

24V

GND

12V

GND

5.2V

5.2V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D1002 SAM2333

+5V_MULTI

NC

A.Dim

+5VST_MST

LED Block

P_24V_SMALL_15V

P_12V_SMALL_15V

P_5V

R1077 0 READY

NC

GND

GND

P_5V

C1006 68uF 35V

R1074 0

P1001 FM20020-24

P_12V_SMALL_15V

L1000 CIC21J501NE EAM58113401

19_22"

.

L1012 MLB-201209-0120P-N2

1/4W 5%

P_24V_SMALL_15V

C1004 10uF 16V

C1017 10uF 16V GND 4

3

2

1

MAX 2A

5

6

7

8

PGND

SW

PVCC

EN

R1073

0

C1014 0 . 1 u FC1013 16V 10uF 16V

INPUT 3 C1054 0.1uF 1

P_12V_SMALL_15V

C1056 1uF25V

R1065 33K NON 19_22"

R1049 33K

R1068 10K B

R1069 1.6K

R1070 22K

E

C

C1048 1uF

P_12V_SMALL_15V

L1008 CIC21J501NE

0 NON 19_22"

R1012

S2A 50V

19_22" D1001

C1030 10uF 25V

R2

R1

Q1004 RT1C3904-T112

P_5V

R1065-*1 19_22" 10K C R1048 10K B Q1001 RT1C3904-T112 R1020 E 10K

C1027 68uF 35V READY Close to Q1003

**DC-DC CONVERTER 12V->5V_TUNER/USB

POWER_SW

PANEL_ON

P_5V

G2

4

5

D2_1

6 D2_2

D1_2

S2 3

8

7 D1_1

1

Q1003 SI4925BDY EBK32753101

G1 2

S1

C1031 10uF 25V

R1058 5.6K

R1057 30K

BS 4

IN 3

GND2

FB 1 C1032 560pF 50V

0

R1011

MAX 3A

IC1006 MP2212DN

5 VCC

6 SW_1

7 SW_2

8 EN/SYNC

R1059 10K NON 19_22"

V0 = 0.8*(1+(R1/R2))

L1006 L1005 120-ohm 120-ohm 19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"

R2 C1018 10uF 16VR1010 3.3K 1%

R1009 2K R1

1/10W 1/10W 1%

C1035 1uF 25V

1

C1029 0.1uF 50V

R1024 10

+5V_MULTI

L1009 3.6uH

READY

R1051 2.2K

C1024 0.1uF 50V READY

R1007 56 1%

R1004 120 5%

C1020 10uF 16V

R1052 2.2K

C1033 0.1uF 50V

C1000 10uF 16V

OUT:5V

R1056 10

+5V_MULTI

R2

R1

OUT:1.85V C1022 C1023 0.1uF 10uF 50V 6.3V

R1013 0

19_22"

R1015 10

C1025 0.1uF 16V

19_22"

+5V_MULTI

+5V_+12V_LCD

+5V_USB

RL_ON

Small(19_22") 3 R1017 10K 12 19_22" Q1005 2SC3875S

R1016 4.7K

+5V_MULTI 19_22"

DDR2, Vref

NTP,AUDIO DSP

+1.8V

L1010 MLB-201209-0120P-N2 +5V_TUNER

C1010 0.01uF

C1038 1uF 25V READY

C1009 100uF16V

120-ohm

C1037 1uF 25V READY

+1.8V_DDR

+3.3V_MULTI_MST

OUT:1.27V +1.2V_VDDC_MST

L1013 MLB-201209-0120P-N2

C1036 1uF 25V READY

V0 = 1.25*(1+(R2/R1))

OUT

ADJ/GND

3 MAX 1A 2

0LCML00003B R1050 2.2K

C1026 100uF 16V

R1018 2K NON 19_22"

IC1002 AP1117EG-13

L1007 MLB-201209-0120P-N2

C1015 0.1uF 50V

IN

C1019 C1021 10uF 16V 0.01uF

C1005 0.1uF

C1016 10uF 10V

2 OUTPUT OUT:3.3V C1028 100uF16V

ADJ/GND

MAX 3A

IC1003 AZ1085S-3.3TR/E1

R1078 3.3 READY C1055 2200pF 50V READY

L1002 2.2uH

10K R1006

V0 = 0.8*(1+(R2/R1))

C1012 560pF 50V

R1008 12K

ITH

VCC

IC1001 BD9130EFJ-E2

**Switch 12V:P12V **Switch 5V:5V_MULTI -> 1.8V

+5V_MULTI

ADJ

**5V_MULTI->3.3V->1.2V

POWER

LGE Internal Use Only


R624

3

4

C604 10uF 16V

C600 10uF 16V

BST1A

4 5

11 12

AVDD_PLL

+1.8V_DVDD

C607 0.1uF 50V

C609 10uF16V

TEST0 14

DVDD_PLL

10

LFM

13

9

AGND_PLL

8

7

DGND_PLL

VDD_IO

CLK_I

VSS_IO 6

AD

3

2

1

DVSS_1

RESET

VDR1A

C610 0.1uF

READY

C642 10uF 35V

C615 0.1uF

C617 0.1uF

IC600 NTP-3100L

R602 R603 100 100

C638 33pF 50V READY

C612 330uF35V

C616 22000pF

C613 0.01uF

R604 3.3

Main AMP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2

SPK_L-

SPK_L+

SMAW250-04

P600

+1.8V_DVDD

+1.8V_AVDD C602 0.1uF

+3.3V_MULTI_MST

C608 R601 100 1uF C606 1000pF

C605 C603 0.1uF 1000pF C601 100pF R600 3.3K

+1.8V_AVDD

I2S_MCLK

SPK_R+

0

0 R631 22KREADY R627

1

READY

E

Q603 RT1C3904-T112

R630 10K

C

SPK_R-

MULTI_PW_SW

SW_RESET

READY

10KB

22000pF PGND1A_2 56

R629

C611

16 DVDD

+3.3V_MST

PGND1A_1 55 SDATA 100 R676

MLB-201209-0120P-N2 0LCML00003B

OUT1A_2 54 17

+1.8V_DVDD

OUT1A_1 53 18 WCK 100 R677

+1.8V_AVDD

PVDD1A_2 52 19 BCK 100 R678

120-ohm

PVDD1A_1 51 20 SDA

0LCML00003B L605

PVDD1B_2 50 21 SCL

15

PVDD1B_1 49 22 MONITOR_0 C639 33pF 50V READY

I2S_SDO I2S_WS I2S_SCK M_SDA M_SCL AMP_MUTE_HOTEL

R673 0 C651 1000pF 50V

C614 1uF

VDR2A BST2A PGND2A_2 PGND2A_1 OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2 PVDD2B_1 OUT2B_2 OUT2B_1 PGND2B_2

40 39 38 37 36 35 34 33 32 31 30 29

C626 0.1uF

+16V_NTP

C671 0.01uF

R625 3.3

R626 3.3

C672 0.01uF

SPK_L-

R621 12

C634 390pF R654 12

C673 1S 1F 0.47uF EAP38319001

R658 R653 12 12 C630 L607 390pF 2S DA-8580 2F

C669 0.1uF R623 4.7K

C637 R663 0.1uF 4.7K

C629 0.1uF

C632 0.47uF

C625 22000pF

C624 1uF

MULTI_PW_SW

C623 22000pF

NC

41

1S 1F EAP38319001

L603 2S DA-8580 2F

42

C618 1uF

C621 390pF R610 R638 12 12

C619 390pF

R608 R611 12 12

+16V_NTP

OUT1B_2 48 23 MONITOR_1

L606

OUT1B_1 47 24 MONITOR_2

120-ohm

PGND1B_2 46 25

MLB-201209-0120P-N2

PGND1B_1 45

FAULT

+1.8V

BST1B 44

26

R656 0 HOTEL_OPT

DVSS_2

VDR1B 43

27 BST2B

28

VDR2B

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes PGND2B_1

C643 0.1uF

C644 0.1uF

R667 4.7K C647 0.01uF

R635 3.3

R671 3.3

C648 R628 0.01uF 4.7K

SPK_L-

SPK_L+

SPK_R-

SPK_R+

MNT_ROUT

B

C

E

R609 1K

R616-*12K

HOTEL_OPT

R616 10K

NON_HOTEL_OPT

C633 33pF

R615 5.6K

AMP_MUTE_HOTEL

R612 200 B HOTEL_OPT

GND 11

8 9

6

SPK_R-_HOTEL

5

4

3

2

10

P601 12505WR-09A00 HOTEL_OPT 1

7

OUT3 8

SPK_R+_HOTEL

R619 0

HOTEL_OPT

R620 0 C636 HOTEL_OPT 0.1uF HOTEL_OPT

+16V_NTP

7 OUT2

6 INPUT2- INPUT3- 9

5 INPUT2+ INPUT3+ 10

4 VCC

3 INPUT1+ INPUT4+ 12

2 INPUT1- INPUT4- 13

E

AUDIO_R

R622 6.8K

C635 0.01uF

R618 6.8K

IC601 1 OUT1 LM324DOUT4 14

R617 SW_RESET 10K HOTEL_OPT C Q602 RT1C3904-T112 HOTEL_OPT

+3.3V_MULTI_MST

Chinese Hotel Option

R606 4.7K

B

R614 5.6K

C631 33pF

R613 10K

NON_HOTEL_OPT

R613-*12K

+12V_AUDIO

C628 6800pF

MNT_R_AMP

Q601 RT1C3904-T112

C622 0.1uF

R607 1K C627 6800pF

MNT_L_AMP

R605 4.7K

E

C

+12V_AUDIO

MNT_LOUT

Q600 RT1C3904-T112

C620 0.1uF

HOTEL_OPT

AMP :GAIN X 4 +12V_AUDIO

AUDI

LGE Internal Use Only


READY

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

20 NC_9

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SHIELD

21

B

C503 0.1uF 50V

E

L501 L501-*1 0 0 Ohm

C504 READY

Q502 ISA1530AC1 C

R507 220

R506 220

120-ohm

TV_MAIN

21

NTSC_TUNER

16

15

14

13

12

11

10

9

8

7

6

5

4

SHIELD

18

17

20

MAIN_SIF

M_SCL

C509 100uF16V

+5V_TUNER

C506 100uF16V

19 NC_8

R502 4.7K

R505 47

M_SDA

C505 100uF16V

3

19

C502 27pF

C508 10uF 16V

+5V_TUNER

Near the pin

2

1

NC_9

NC_8

NC_7

NC_6

SIF-OUT

A-OUT

NC_5

V-OUT

NC_4

MOPLL_AS

SCL

SDA

GND_2

NC_3

TP[3.3V_OPT]

RF_AGC

NC_2

+B[5V]

GND_1

NC_1

TAFT-H203F

TU500-*1

15 A-OUT 16 SIF-OUT 17 NC_6 18 NC_7

C507 82pF READY

L502 10uH READY

9 SDA 10 PAL_TUNER SCL C500 27pF 11 MOPLL_AS 12 NC_4 13 V-OUT 14 NC_5

C501 0.01uF

R504 47

120-ohm

L500

6 TP[3.3V_OPT] 7 NC_3 8 GND_2

3 +B[5V] 4 NC_2 5 RF_AGC

2 GND_1

1 NC_1

TU500 TAFT-Z203D

TUNER

LGE Internal Use Only


HPD_MST_1

8 DATA0_SHIELD

21

20JACK_GND

1 DATA2+

2SC3875S

7 DATA0+

21

20JACK_GND

1 DATA2+

.

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

JP300

+5V_HDMI_1

R302 1K

RT1C3904-T112

8 DATA0_SHIELD

9 DATA0-

11 10 CLK+

12

13

14

15

16

17

18

19

E

Q300C

JK301 QJ41193-CFEE1-7F

22

B

.

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

JP301

4

3

2

5

6

7

8

SDA

SCL

WP

VCC

4

3

2

1

TMDS1_RX2+

CEC TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+ TMDS1_RX1TMDS1_RX1+ TMDS1_RX2-

VSS

A2

A1

A0

5

6

7

8

SDA

SCL

WP

VCC

IC300 CAT24C02WI-GT3

CEC TMDS2_RXCTMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ TMDS2_RX1TMDS2_RX1+ TMDS2_RX2TMDS2_RX2+

VSS

A2

1

A0

E

A1

IC301 CAT24C02WI-GT3

R303 1K

C

9 DATA0-

11 10 CLK+

12

13

14

15

16

17

18

19

B

JK302 QJ41193-CFEE1-7F

22

Q301

RT1C3904-T112

R301 10K

R300 10K

HPD_MST_2

+5V_HDMI_2

JP303

JP302

R307 100

R306 100

R331 100

R305 100

R304 100

R327 100

A2

R308 R310 10K 10K C302 0.01uF

D300 KDS184S

+5V_HDMI_1

+5V_MULTI

R309 R311 10K 10K C301 0.01uF

DDC_WP

HPD_MST_3

DDC_SDA1 DDC_SCL1

DDC_WP

DDC_SDA2 DDC_SCL2

D301 KDS184S

A1

1 DATA2+

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

8 DATA0_SHIELD

9 DATA0-

10 CLK+

11 CLK_SHIELD

12 CLK-

13 CEC

14 NC

15 SCL

16 SDA

17DDC/CEC_GND

18+5V_POWER

E

Q303 BSS83 CEC_READY D B S G

VSS

A2

A1

A0

4

3

2

1

D304 CDS3C30GTH 30V CEC_READY

R313 0

D303 MMBD301LT1G 30V CEC_READY

R315 68K CEC_READY R316 56K CEC_READY

SDA

SCL

WP

VCC

CEC

CEC_C

5

6

7

8

IC302 CAT24C02WI-GT3

CEC TMDS3_RXCTMDS3_RXC+ TMDS3_RX0TMDS3_RX0+ TMDS3_RX1TMDS3_RX1+ TMDS3_RX2TMDS3_RX2+

+3.3V_MST

JP305

JP304

RT1C3904-T112

Q302C 2SC3875S

19 HPD

B

KJA-ET-0-0032 JK303

20

JACK_GND

R312 10K

+5V_HDMI_3 R314 1K

R318 100

R317 100

R329 100

SW_HPD : USE SW HPD (Default)

A2 C300 0.01uF

A1

DDC_SDA3 DDC_SCL3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

R319 R320 10K 10K

D302 KDS184S

+5V_HDMI_3

DDC_WP

MST_HPD : USE MST HPD

+5V_MULTI

C

+5V_MULTI +5V_HDMI_2

A2

2SC3875S

A1

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes C

C

OPTION

HDMI

LGE Internal Use Only


Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

AUDIO_R

MNT_ROUT

MNT_LOUT

MNT_VOUT

C100

POP NOISE

MUTE_LINE

16V 10uF C101 R101 0 HOTEL_OPT

SPK_R+_HOTEL

POP NOISE

MUTE_LINE

16V 10uF

SPK_R-_HOTEL

C B E

Q101 RT1C3904-T112E

B

Q100 RT1C3904-T112

16V 100uF C102

C

R105 0 HOTEL_OPT R106 0 NON_HOTEL_OPT

C103 100pF READY

R103 0 HOTEL_OPT

R102 75

[YL]O-SPRING_B

D103 30V NON_HOTEL_OPT

GND

6

7

4

2

3

SHIELD

5

1

S-VIDEO JK101 PSJ014-01

C-LUG4

C-LUG3

0-SPRING

C-LUG2

C-LUG1

R122 75

R121 75

C104 OPT READY

SIDE_Y

+3.3V_MULTI_MST

SIDE_C

SD05 ZD105

ADUC30S03010L_AMODIODE

D105 30V

D104 30V

ZD104 SD05

D100 30V

D101 30V

ZD100 SD05

ZD101 SD05

ZD102 SD05 SD05 ZD103

10K

10K

R112 220K

R116 10K

R111 220K

R115 10K

R110 75

R100 220K

R113

R104 220K

R114

R107 75

R108 75

R109 75

CVBS_RIN

CVBS_LIN

CVBS_VIN

COMP2_R

COMP2_L

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

R120 12K

R119 12K

R117 12K

R118 12K

COMP2_PR

COMP2_PB

COMP2_Y

AV1

S-VIDEO

R123 10K

S-VIDEO

3H [RD]CONTACT_A_2

4H [RD]O-SPRING_A_2

9H [RD]2P_CAN

8G [WH]C-LUG_A_2

9G [WH]2P_CAN

3F [YL]CONTACT_A

4F [YL]O-SPRING_A

9F [YL]2P_CAN

3E [RD]CONTACT_A_1

4E[RD]O-SPRING_A_1

9E[RD]1P_CAN_2

8D [WH]C-LUG_A_1

9D [WH]1P_CAN

8C [RD]C-LUG_A

9C [RD]1P_CAN_1

8B [BL]C-LUG_A

9B [BL]1P_CAN

3A [GN]CONTACT_A

4A [GN]O-SPRING_A

9A [GN]1P_CAN

COMPONENT1

ZD107 SD05

ZD106 SD05

D106 30V

D107 30V

6L

5L

7K

6J

5J

JK100 PPJ226-01

S_VIDEO_DET

[RD]CONTACT_B

[RD]O-SPRING_B

D102 30V NON_HOTEL_OPT

[WH]C-LUG_B

[YL]CONTACT_B

S-VIDEO(China Model)

MNT_OUT

COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100

INPUT1

LGE Internal Use Only


2

7

6

5

R2IN 8

T2OUT

V-

C2-

C2+ 4

C1- 3

V+

0

0

R230

JK201

9 R2OUT

10 T2IN

JK204

R204 4.7K

2C[RD]U_CAN

5C[RD]CONTACT

4C[RD]O_SPRING

2B[WH]U_CAN

3B[WH]C_LUG

2A [YL]U_CAN

L201 500

D207 30V READY

D208 30V READY

0

R201

USB_DP USB_DL_P

It’s possibel to 27~47ohm R200 USB_DN USB_DL_N 0

1A Design

C210 10uF6.3V

220uF C212 16V

100uF C214 16V

R205 4.7K

R237 0 Non_OCP

5.6B ZD203

5.6B ZD202

D205 30V

D206 30V

R227 75

RXD TXD

IR_OUT

D201 ADUC30S03010L_AMODIODE 30V

D200 ADUC30S03010L_AMODIODE 30V

+3.3V_MST

100

100

5A[YL]CONTACT

Close to SIDE_USB

**

R203

R202

4A [YL]O_SPRING

PPJ218-01

SIDE_USB

REAR_USB

USB_DL_P

USB_DL_N

REAR_USB R229

USB

R1OUT

11 T1IN

12

13 R1IN

14 T1OUT

15 GND

16 VCC

IC200 ST3232CDR

SIDE AV

C202 0.1uF

C201 0.1uF

C200 0.1uF

C1+ 1

KJA-UB-4-0004

+3.3V_MST

REAR_USB JK205

R222 220K

READY

R225

R223 220K

READY

R224

10K

10K

10

VIN 1 GND 2 ENABLE 3

6 VOUT 5 ILIMIT 4 FAULT/

IC202 OCP_READY MIC2009YM6-TR

Pin to Pin with EAN43439401

SIDE_RIN

SIDE_LIN

9

8

7

6

C A

KDS226 D213

AC

OCP_READY

5

4

3

2

1

R210 4.7K OCP_READY C208 0.1uF OCP_READY

R238 510 OCP_READY L200 120OHM OCP_READY C209 10uF OCP_READY

+5V_USB

SHILED

15

14

13

12

11

VSS

A2

A1

A0

4

3

2

1

5

6

7

8

SDA

SCL

WP

VCC

R218 100

R217 100

READY

R219 4.7K

SHIELD_PLATE 8

R216 100

T_TERMINAL2

B_TERMINAL2

T_SPRING

R_SPRING

6B

7B

5

4

B_TERMINAL1

7A

E_SPRING T_TERMINAL1

3

DDC_GND

DDC_CLOCK

SYNC_GND

GND_1

V_SYNC

NC

BLUE

H_SYNC

BLUE_GND

GREEN

DDC_DATA

GREEN_GND

RED

GND_2

RED_GND

6A

IC201 CAT24C02WI-GT3

PC EDID

JK203 PEJ024-01

16

10

9

8

7

6

PC SOUND

5

4

3

2

1

6630TGA004K

KCN-DS-1-0089

JK202

PC C204 0.1uF

+5V_MULTI

A

C

C

R220 4.7K

R221 4.7K

R232 220K

10K

R234

R231 220K

10K

R233

PC_B ZD201 SD05

ZD200 SD05

30V

PC_AUD_L

PC_AUD_R

D209

R215 4.7K

R214 4.7K

R208 68

R207 68

PC_VS

DSUB_SCL

C211 68pF

PC_HS

DSUB_SDA

C213 68pF

D204 ADUC30S03010L_AMODIODE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDC_WP DSUB_SCL DSUB_SDA

R236 12K

R235 12K

R213 75

PC_G

PC_R

ADUC30S03010L_AMODIODE 30V

C207 0.1uF

C206 0.1uF

R212 75

C205 0.01uF

+5VST_MST

D203 30V CDS3C30GTH

D202 30V CDS3C30GTH

R211 75

AC

KCN-DS-1-0088

R209 1K OCP_READY

OCP_READY R206 160

R228 12K

12K

R226

SIDE_V

IR_OUT

UB01123-4HHS-4F

C203 0.1uF

1

2

3

5 4

1 2 3 4

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

USB DOWN STREAM 5

ENKMC2837-T112 D210

JK200

C

ENKMC2837-T112 D211

AC

A AC

A

ENKMC2837-T112 D212

RS-232C (CI ITEM)

INPUT2

USB DOWN STREAM

LGE Internal Use Only


Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

9

.

8

7

6

5

4

3

2

1

19_22_26" P405

.

13

12

11

10

9

8

7

6

5

4

3

2

1

ZD401

ZD402

LED_R

LED_B

IR

GND

5V_ST

GND

KEY2

C414

19_22_26"

C402 100pF 50V

19_22_26" L405 BG1608B121F

C404 470pF

L406 120ohm

C406 47uF 16V

L407 120-ohm 0

READY

R426 47K IR-OUT B

IR

R428 10K IR-OUT

E Q405 2SC3052 IR-OUT

C

R427 10K IR-OUT

+5VST_MST

NON_19_22_26"

C411 0.1uF

KEY2

KEY1

SUB_SCL

C

R418 0 READY

B

R406 4.7K 19_22_26"

+3.3V_MST

R415 10K 19_22_26"

R414 10K 19_22_26"

+3.3V_MST

Q402 E 2SC3052 19_22_26"

R404 10K 19_22_26" R416 0 READY R410 10K 19_22_26"

+3.3V_MULTI_MST

LED_R

B

R430 22 IR-OUT

C Q404 E 2SC3052 IR-OUT

R429 10K IR-OUT

+5VST_MST

IR_OUT

KEY2

KEY1

19_22_26" C400 100pF 50V

19_22_26"

L401 BG1608B121F

19_22_26" L400 BG1608B121F

C401 GND 100pF19_22_26" 50V

KEY2

KEY1

19_22_26" P404

3

2

1

SMAW200-03

52

3 4 5

5

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

100

READY

R409

NON 22/27" FHD R425 0 R431 0 NON 22/27" FHD

TXCO4-

TXCO4+

TXCO3-

TXCO3+

TXCLKO-

TXCLKO+

TXCO2+ TXCO2-

TXCO0+ TXCO0TXCO1+ TXCO1-

TXCE4-

TXCE4+

TXCE3-

TXCE3+

TXCLKE-

TXCLKE+

TXCE2-

TXCE2+

TXCE1-

8BIT(HD) 8BIT(FHD) 52 sharp 32 sharp

X X X X

0 0 0 X

NON 22/27" FHD R423 0

R424 0 VESA

R407 4.7K JEIDA

+3.3V_MULTI_MST

*8BIT(FHD):22/27"

R401 R402 R402 0 8 B I T o r 5 2 s h a r p10BIT(FHD)4.7K X

R401 4.7K 10BIT

+3.3V_MULTI_MST

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

9

7

8

10

+5V_+12V_LCD

HD(26/32/37/42/47")

8

7

6

2

4

6

1

3

TXCE0+ TXCE0TXCE1+

P402 FF10001-30

2

NON 22/27" FHD R419 0 R422 0 NON 22/27" FHD

+5V_+12V_LCD

TXCE0+

TXCE0-

TXCE1+

TXCE1-

TXCE2+

TXCE2-

TXCLKE+

TXCLKE-

TXCE3+

TXCE3-

0

P403

HD(19/22")

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

SMW200-28C

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

External VBR

E-DIM

OPC_OUT

OPC_OUTPUT

OPC_EABLE C B OPC_EN OPC_ENABLE E Q400 RT1C3904-T112

R411 1K

OPC_ENABLE

OPC_ENABLE

R412

R405 READY 0

R435 470 OPC_ENABLE

+3.3V_MULTI_MST

TXCE0+

TXCE0-

TXCE1+

TXCE1-

TXCE2+

TXCE2-

TXCLKE+

TXCLKE-

TXCE3+

TXCE3-

+5V_+12V_LCD

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO 1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

1

TF05-51S

FHD

CONTROL KEY (19/22/26")

IR(19/22/26")

0 NON_19_22_26"

R400

+3.3V_MULTI_MST

0.1uF READY +3.3V_MST

L404 120-ohm

C408 0.1uF

R421 4.7K

+3.3V_MST

NON_19_22_26"

+5VST_MST

NON_19_22_26"

C412 470pF

L402 120ohm C403 C407 47pF

0.1uFNON_19_22_26" 16V

R403

L403 120ohm NON_19_22_26"

R420 4.7K

SUB_SDA

SUB_SCL

NON_19_22_26"

NON_19_22_26"

NON_19_22_26" NON_19_22_26" R417 0

ZD400

19_22_26" C B Q401 E 2SC3052

19_22_26" L408 BG1608B121F

C405 100pF 50V 19_22_26"

READY R413 0

POWER_ON(LED_R_SMALL)

ST_3.3V(LED_B)

GND

IR

WARM_ST(LED_R_BIG)

GND

5V_ST

KEY2

KEY1

GND

SDA

SCL

KEY1

12507WS-12L

P400

NON_19_22_26"

L411 500-ohm NON_19_22_26" L410 500-ohm NON_19_22_26"

IR(Non 19/22/26) CONTROL KEY(Non 19/22/26)

P401

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO 1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

PANEL WAFER

LVDS/ CTR KEY

LGE Internal Use Only


P/NO : MFL60021521

Feb., 2009 Printed in Korea


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