Molded Interconnect Devices Market to grow at 12% CAGR from 2018 to 2024: Global Market Insights Inc. (MID) Molded Interconnect Devices Market was estimated at over USD 320 million in 2017, is set to expand USD 840 million by 2024; according to a new research report by Global Market Insights, Inc. The molded interconnect devices market is projected to witness a strong growth across consumer device applications owing to the ability of the devices to integrate numerous electrical and mechanical functions, reduce circuit density, and facilitate miniaturization of the products. The devices require fewer auxiliary components, thereby saving considerable costs and driving the industry growth. Low failure ratio and high reliability of these devices can be attributed to the existence of less auxiliary components and a low degree of system complexity. These devices also have superior environmental benefits such as recyclable thermoplastic materials with minimal additives.
These devices enable the combination of mechanical components and electrical circuits on three-dimensional thermoplastic materials. The technology allows to integration of chips directly with their assemblies, saving space and facilitating miniaturization. For instance, the smartphone antennas can be installed directly within the housing with the help of the devices. The products can be manufactured with fewer assembly steps as compared to the traditional PCB manufacturing and offer a high degree of freedom to circuit designers. Integration of sensors and functions reduces assembly time and production steps, resulting in high-quality components and optimization of supplementary costs. These factors are anticipated to positively impact the MID market growth over the coming years. LDS molded interconnect devices market is expected to grow at a CAGR of over 15% over the forecast timespan. Several industrial and aerospace & defense manufacturers are developing compact and advanced models by integrating mechanical & electrical functions in a single product. This helps manufacturers to save production costs and offer aesthetically-improved features along with the reduction in their production times. With miniaturization driving the consumer electronics industry, the LDS market is growing in popularity by allowing smaller designs with integrated functionalities. These processes have presented new and efficient forms of production from a single component to mass production and have also led to innovative product designs, thereby driving the LDS MID market demand. 1|Page
U.S. molded interconnect devices (MID) market size, by end-use, 2017 & 2024 (USD Million))
A major trend driving the molded interconnect devices market is the implementation of the devices for LDS in the automotive industry. These devices are used for reducing vehicle weight and increasing reliability owing to the benefits such as the elimination of circuits boards and wired circuitry. Rapid technological advancements in seatbelt safety system, position sensors, brake sensors, motorcycle LED lights, steering wheel hubs, and control switches are generating several opportunities for the industry growth. Moreover, the devices provide video-based driving assistance by using vehicle camera systems, thereby strengthening the driver safety. Vehicle tracking systems are majorly implementing these devices in the LED displays and monitors to assist parking and traffic situations and monitor the driving behavior. Design flexibility and low cost of the solution are expected to drive the growth of the automotive molded interconnect device market. The Asia Pacific MID market is projected to exceed USD 400 million by 2024. Strong growth in the region can be attributed to the presence of several companies including Samsung Electronics, Co., Ltd. and Sony Corporation. These companies are expanding and upgrading their product portfolio thereby offering several opportunities for vendors operating in the molded interconnect devices market. Several players in the region are also entering into collaborations for the development of new technologies. They are offering high-end products at competitive prices and are adopting aggressive marketing strategies. The exponential advancements in the
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technology and increasing commercialization of several innovative products have resulted in high growth prospects thereby attracting more players to the MID market. Key industry players operating in the molded interconnect devices market include MacDermid Enthone, Harting Mitronics, Molex, SelectConnect Technologies, and RTP Company. The designers and electronic developers have expanded their capabilities in the prototyping and functioning of the final device by using advanced 3D design tools such as the Target 3001. The MID market growth can be attributed to the rise in advancements in thermoplastic materials and the development and adoption of LDS technology. A major portion of production volume is concentrated on antennas for telecommunication and smart computing devices such as smartphones, laptops, smart watches, and tablets, among others. Browse key industry insights spread across 210 pages with 155 market data tables & 36 figures & charts from the report, “Molded Interconnect Devices (MID) Market Size By Process (Laser Direct Structuring (LDS), Two-Shot Molding) By End-Use (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing), Industry Analysis Report, Regional Outlook (U.S., Canada, UK, Germany, France, Spain, Italy, Sweden, Russia, China, India, Japan, South Korea, Taiwan, Malaysia, Australia, Brazil, Mexico, Saudi Arabia, UAE, South Africa), Application Potential, Competitive Market Share & Forecast, 2018 - 2024� in detail along with the table of contents: https://bit.ly/24jYVkS
Table of Content (TOC-)
Chapter 1. Methodology and Scope 1.1. Methodology 1.1.1. Initial data exploration 1.1.2. Statistical model and forecast 1.1.3. Industry insights and validation 1.1.4. Definition and forecast parameters
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1.1.4.1. Definitions 1.1.4.2. Assumptions, methodology and forecast parameters 1.2. Data Sources 1.2.1. Primary 1.2.2. Secondary Chapter 2. Executive Summary 2.1. MID industry 3600 synopsis, 2013 - 2024 2.1.1. Business trends 2.1.2. Process trends 2.1.3. End-use trends 2.1.4. Regional trends Chapter 3. MID Industry Insights 3.1. Industry segmentation 3.2. Industry landscape, 2013 – 2024 3.2.1. MID industry landscape 3.2.1.1. MID market size & forecast, 2013 – 2024 3.2.1.1.1. North America 3.2.1.1.2. Europe 3.2.1.1.3. Asia Pacific 3.2.1.1.4. Latin America 3.2.1.1.5. MEA 3.2.2. Thermoplastic industry landscape 3.2.2.1. Thermoplastic market size & forecast, 2013 – 2024
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3.2.2.1.1. North America 3.2.2.1.2. Europe 3.2.2.1.3. Asia Pacific 3.2.2.1.4. Latin America 3.2.2.1.5. MEA 3.2.3. PCB industry landscape 3.2.3.1. PCB market size & forecast, 2013 – 2024 3.2.3.1.1. North America 3.2.3.1.2. Europe 3.2.3.1.3. Asia Pacific 3.2.3.1.4. Latin America 3.2.3.1.5. MEA 3.2.4. Smartphone industry landscape 3.2.4.1. Smartphone thickness reduction trends 3.2.4.2. Smartphone antenna market 3.2.4.3. Smartphone market size & forecast, 2013 – 2024 3.2.4.3.1. North America 3.2.4.3.2. Europe 3.2.4.3.3. Asia Pacific 3.2.4.3.4. Latin America 3.2.4.3.5. MEA 3.3. Industry ecosystem analysis 3.3.1. Raw material suppliers
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3.3.2. OEMs 3.3.3. Distribution channel analysis 3.3.4. Vendor Matrix 3.4. Technology landscape 3.4.1. Internet of Things (IoT) 3.4.2. Wearable devices 3.4.3. Software suites 3.5. Raw material analysis 3.5.1. Special polyamides (nylons) 3.5.2. Thermoplastic polyesters 3.5.2.1. Polybutylene Terephthalate (PBT) 3.5.2.2. Polyetherimide (PEI) 3.5.2.3. Polyphthalamides (PPA) 3.5.3. Liquid Crystal Polymers (LCP) 3.5.4. Acrylonitrile Butadiene Styrene (ABS) 3.6. LDS plating material analysis 3.6.1. Electroless copper 3.6.2. Electroless nickel 3.6.3. Immersion Gold 3.7. Regulatory landscape 3.7.1. Environmental regulations 3.7.1.1. RoHS 3.7.1.2. WEEE Directive
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3.7.1.3. Others 3.7.2. ISO standards 3.8. Industry impact forces 3.8.1. Growth drivers 3.8.1.1. Proliferation of wearable devices in the U.S. 3.8.1.2. Favorable regulatory scenario for electronic waste reduction in the European Union 3.8.1.3. High demand from automotive industry across Germany, France, Italy 3.8.1.4. Surge in demand for smartphones in Asia Pacific 3.8.1.5. Growth of semiconductor manufacturing industry in China, South Korea, Taiwan 3.8.2. Industry pitfalls and challenges 3.8.2.1. Raw material price issues 3.8.2.2. High tooling cost 3.9. Growth potential analysis 3.10. Porter’s analysis 3.10.1. Threat of new entrants 3.10.2. Buyer power 3.10.3. Supplier power 3.10.4. Threat of substitutes 3.10.5. Industry rivalry 3.11. Competitive landscape, 2017 3.11.1. Company market share 3.11.2. Strategy dashboard 7|Page
3.12. PESTEL analysis
Industry Coverage
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About Global Market Insights
Global Market Insights, Inc., headquartered in Delaware, U.S., is a global market research and consulting service provider; offering syndicated and custom research reports along with growth consulting services. Our business intelligence and industry research reports offer clients with penetrative insights and actionable market data specially designed and presented to aid strategic decision making. These exhaustive reports are designed via a proprietary research methodology and are available for key industries such as chemicals, advanced materials, technology, renewable energy and biotechnology. Contact Us: Arun Hegde Corporate Sales, USA Global Market Insights, Inc. Phone: 1-302-846-7766 Toll Free: 1-888-689-0688 Email: sales@gminsights.com Web: https://www.gminsights.com Blog: http://algosonline.com/technology
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