LTE-M – Delivering a Futureproof IoT

SYSTEM DEVELOPMENT LTE-M

– Delivering a Futureproof IoT

By Dima Feldman, VP of Product Management and Marketing at Sony Semiconductor Israel

The CAT-1 LTE modem was initially defined in 2008 as a low-cost, low-power alternative to connect IoT devices that needed to transfer limited amounts of data. However, vendors and network providers at that time focused on higher throughput. The actual device introduction started about five or six years later.

In 2016, eight years after the initial CAT-1 definition, CAT-1bis was finalized in 3GPP release 13. The new protocol was expected to further reduce the cost of the modem and simplify the device by removing the second antenna. Those technologies were far better suited for the IoT than 4G/LTE (CAT3 and above), which were designed for smartphones and other demanding devices, and whose high cost and power consumption needs were far beyond the requirements of a connected utility meter, tracker devices, medical health devices, and other applications.

At about the same time, in 2016, the specs for LTE-M (CAT-M) were frozen and released by 3GPP. Device makers and chipset designers have debated which is better. Today, staring into the future, it is clear that LTE-M’s futureproof technology, better coverage, and lower power costs should make it the cellular modem of choice for the IoT.

CAT-1 has several key benefits over LTE-M. It offers higher maximal throughput, which

Utility device designers and smart-city planners want to create connected devices that will share data for the next 10-15 years.

may be needed for some applications, and lower power consumption when uploading or downloading significant amounts of data (faster transmission and shorter on time), as well as slightly lower latency. However, the majority of IoT devices rarely need high throughput or capacity as they are inherently designed to operate at low data rates. Therefore, those advantages do not offer a compelling use case for smart cities and utilities.

CAT-1bis, as an alternative solution, is significantly inferior to LTE-M in terms of network coverage and cost. While they both use a single antenna, the CAT-1bis network coverage is degraded by 9db, and it is still 20%50% more expensive than LTE-M. As a result, it does not provide a real alternative.

Being Part of the 5G Framework Matters

Utility device designers and smart-city planners want to create connected devices that will share data for the next 10-15 years. LTE-M was included in the 5G framework. As a result, its technology is expected to be supported until 2040 and beyond. Smart meters and other critical infrastructure applications Figure 1 - UL throughput estimation Cat-1 / Cat-M1 comparison

Image 2 - Marine Corps Sgt. Danielle Grimshaw launches an R80D Skyraider unmanned aerial system at Berga Naval Base, Sweden, Sept. 20, 2022, during Archipelago Endeavor, an integrated field training exercise. will continue to pump out information deep into the foreseeable 5G future.

All flagship smartphones have supported 5G features for about two years, and 5G is becoming a standard feature for any new smartphone. For carriers, smartphone connectivity is a major business today, and it drives many of the spectrum management decisions. Since all smartphones (and new vehicles) are 5G capable, cellular carriers around the world have already begun their spectrum re-farming from LTE to 5G. As 5G devices become commoditized, carriers will have financial pressure to migrate their spectrum to 5G. In contrast to LTE-M, CAT-1, which is supported by the LTE network only, could find itself completely unsupported as soon as 2030. Once that support is gone, devices with CAT-1 will be unable to transmit data and will need to be replaced.

For the better part of ten years, we have seen telecom carriers and industry insiders offer their vision of 5G. The vision is coming to fruition across the planet, enhancing IoT and bringing more smart cities closer to reality. Ironically, we may see CAT-1 holdouts cling to LTE technology. With LTE’s lack of support coming in as little as eight years, no one can guarantee its longevity.

This alone should be enough to drive developers to LTE-M. However, LTE-M has additional factors in its favor.

Tests Show LTE-M Offers More Reliable Coverage

In CE Mode A, we have seen a 5 dB improvement for LTE-M over CAT-1. CAT-1’s dual antenna seemingly would give it an advantage over LTE-M’s single antenna.

As shown in Figure 1 on previous page, CAT-1 and CAT-1bis transfer more bits per second in good conditions. However, as conditions deteriorate and coupling loss increases, CAT-1’s bit rate drops and becomes closer to LTE-M. CAT-1bis completely disconnects at around 145 dB MCL (minimum coupling loss), and CAT-1 loses its connection at about 149 dB. LTE-M, on the other hand, can maintain its connection down to 154 dB CL.

In effect, LTE-M is a more robust solution, able to maintain connectivity even after CAT1 has dropped offline.

LTE-M’s extended coverage in poor conditions and poor coverage areas is especially important for critical infrastructure applications, as devices frequently need to be in-

stalled in challenging reception environments like basements. System integrators also must consider that coverage could degrade over time due to vegetation growth or changes in our cities’ landscape due to continuous housing development.

LTE-M Costs Less to Build

Across the board, the costs associated with LTE-M are significantly lower than both CAT1 and CAT-1bis. Using LTE-M as our baseline, CAT-1bis is 20%-50% more expensive, and CAT-1 is up to 80% more expensive. LTE-M uses less hardware in its design. Its simpler design has fewer parts, including just a single antenna, and no need for expensive, country-specific SAW filters – enabling ONESKU™ solutions. This is one of the examples where economy of scale helps to reduce the cost and simplify the logistics.

LTE-M’s operational costs are also lower than that of its rival technologies. LTE-M is far better than CAT-1 and CAT-1bis at conserving power. Its reduced power consumption not only extends battery life but costs less to operate due to the smaller number of batteries.

Look to the Future

IoT utility devices are built to last for the long term. As such, LTE-M is the right technology choice. Admittedly, LTE-M does not have the same throughput as CAT-1 offers. With a 5Mbps upload and 10Mbps download, CAT-1 can move data faster than LTE-M’s 1.2Mbps upload and download speed (3GPP Release 17). However, connected utilities typically do not need the higher throughput provided by CAT-1. They can transfer data just as effectively over LTE-M.

The two technologies have comparable network capacity as well, although, in practice, LTE-M only deploys 6RB, which could lead to reduced network capacity to match the current demand. This is sufficient for a connected utility use case and helps reduce operating expenses for the carriers. LTE-M offers better latency in poor coverage areas, which is important considering that many utility meters are located in rural areas with weaker network coverage.

Considering that LTE-M is included in the 5G framework and will last until at least 2040, has lower costs, and meets the requirements of smart utilities, it is the obvious choice for utility and smart city developers.

Figure 4 - U.S. and Korean Marines call for fire during tactical air control party and close air support training at Pilsung Range, Gangwan Province, South Korea, Sept. 15, 2022.

October 2022

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ZMicro and Brelyon Team Up to Develop Ultra Reality™ Rugged Military Displays

Brelyon, the MIT spin-off pioneering a new category of ultra-immersive display technology, and ZMicro today announced a strategic partnership under which the companies will jointly develop Brelyon’s Ultra Reality™ rugged displays for deployed military markets. ZMicro will be the exclusive supplier of Brelyon’s technology in rugged markets.

“Brelyon’s Ultra Reality™ technology is unlike anything we’ve seen,” said Jason Wade, President of ZMicro. “It has the potential to enable an entirely new way of computing and human-computer interface. By bringing depth and panorama to conventional displays, Brelyon can provide large-format and immersive visualization solutions in a small form factor. This is something that can bring huge benefits to military end-users.”

Through this strategic partnership, ZMicro will license Brelyon’s Ultra Reality™ technology to create one or more rugged, large-format display products for defense applications, including indirect vision, training, simulation, teleoperations, command and control, and intelligence, surveillance, and reconnaissance (ISR).

Built upon revolutionary work from the MIT Media Lab, Brelyon’s Ultra Reality™ uses computational wavefront engineering to create a massive field of view with true optical depth, generating an immersive panoramic virtual screen that engulfs the viewer without the need for a headset. Launched at CES in January, Brelyon’s Ultra Reality™ combines the latest technical advances in novel physics and computational optics with the company’s patented superconic light-field expansion technologies. Unlike conventional stereoscopic displays, Brelyon uses its monocular depth modulation capabilities to provide a visual experience that alleviates eye fatigue and image artifacts for the user.

“Today’s monitors can take up a lot of space and are not immersive,” said Alok Mehta, COO of Brelyon. “Technologies like VR and AR headsets aren’t user-friendly and have poor image quality. We’re reimagining displays to take the computer display experience into the virtual world without headsets. Through our partnership with ZMicro, we will be able to bring a much richer and more productive viewer experience to end-users of deployed military applications.”

Brelyon’s patented Ultra Reality™ technology renders a massive virtual screen in a compact form factor, making it an ideal solution for space-constrained applications, including inside next-generation ground combat vehicles and remote or distributed node command and control centers.

“In ZMicro, we’ve found an exceptional partner with the expertise and resources to meet the defense industry’s MIL-SPEC ruggedization standards and bring our products to market,” added Mehta. “With Ultra Reality™, Brelyon has been able to break several performance records on conventional parameters for peak brightness, resolution, eye comfort, image size, and more. As the defense industry’s need for high-performance displays continues to grow, we believe Brelyon’s large-format display solution is well-positioned to dominate the market.”

ZMicro https://zmicro.com/

October 2022

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AMETEK Abaco Systems Releases VP461 Dual RFSoC, Dual FPGA Card Aligned to SOSA Standard Share

Abaco Systems introduced its VP461 6U VPX FPGA carrier card aligned with the Sensor Open Systems Architecture™ (SOSA) technical standard at the AUSA Annual Meeting and Exposition.

The VP461 is designed with two Xilinx® Virtex® UltraScale+™ FPGAs and two Xilinx® Zynq® UltraScale+™ RFSoCs, allowing for closer proximity to the sensor for lower-latency and higher precision signal processing. A single slot populated with a VP461 can replace many different acquisition and processing boards that traditionally occupy multiple slots in a system. The RF and processing density of the VP461 enables new system architectures by offering one of the highest-performance solutions in a SWaP-constrained environment.

An additional MPSoC manages the data traffic between the four primary FPGAs and the backplane while offering robust security. This allows the VP461 to be configured to each program’s unique RF and processing requirements. The space-saving carrier card is available air and conduction-cooled. The rugged VP461 is designed to reliably operate in some of the harshest environments and applications, including radar, EW, DRFM, telecommunication base stations, semiconductor manufacturing equipment, autonomous vehicles, renewable energy stations, and more.

The SOSA-aligned backplane supports multiple 100GbE paths for high-speed data exchanges between other cards in the chassis, including multiple VP461s. Optional MORA, VITA 49.2, REDHAWK, or GNU Radio support is available.

“This exceptionally powerful carrier card not only is aligned with the SOSA standard, but it also saves valuable processing space,” said Mike Underwood, Abaco division vice president, and business unit manager. “By putting these boards in parallel, for example, users can easily quadruple their system-level computing power in the same footprint.”

Abaco Systems / AMETEK www.abaco.com

New PICMG® standard for modular industrial PCs - EKF showed first prototypes at the InnoTrans

Under the name PICMG® ModBlox7™, several manufacturers are currently working on a new standard for modular industrial PCs that is intended to combine the advantages of scalable systems such as CompactPCI® with cost-saving box PCs.

As a flexible BoxPC system, ModBlox7™ is based on units defined in height and depth, but expandable in width.

Each unit has a front width of 7HP or a multiple thereof (1HP = 5.08mm). The mechanics allow for flexible mounting options, including wall mounts, DIN Rail clamp technology, or 19-inch sub-racks.

ModBlox7™ allows simple interconnection of boards without the need for an additional backplane. The rear panel of the housing is used for heat dissipation. Thus, highly integrated and redundant architectures can be realized.

In 2023, the PICMG® ModBlox7™ specification is expected to be finally approved.

In cooperation with Ci4Rail, EKF showed the first prototype systems at InnoTrans in Berlin. The railsuitable concept is based on a 7TE power supply arranged on the far left, next to it a 14TE wide CPU module, followed by I/O modules.

PICMG® www.picmg.org

October 2022

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Elma’s New 12-Slot, 3U Backplane Aligned to SOSA™ 1.0 Enables Development & Deployment

Elma has released a new 3U 12-slot backplane that aligns with The Open Group Sensor Open Systems Architecture™ (SOSA) Technical Standard 1.0. The backplane is an update to Elma’s original CMOSS reference backplane supporting the U.S. Army’s latest open-standards requirements. The new 3U OpenVPX backplane offers a mix of plug-in card (PIC) slots that enable complex, high-speed signal processing and system development, supporting up to 100 Gigabit Ethernet.

The SOSA-aligned backplane supports highspeed signals on all the data paths as well as incorporates leading-edge VITA 67.3 connectors compatible with legacy VITA 67.1 and VITA 66.4 RF and optical I/O connectors. In addition to providing the latest optical fiber and RF connectivity, the backplane features precision network timing (PNT) plus the integration of mixed payload modules including SBCs, switches, radial clocks, and system expansion.

Ken Grob, Director of Embedded Computing Development, said, “Our new backplane aligned to SOSA establishes the foundation for system development of high-performance mission-critical C5ISR and EW systems based on a common, modular architecture that lowers lifecycle costs, allows rapid technology insertion, and enables complex, high-speed signal processing.”

The full-featured CMOSS reference backplane offers a range of OpenVPX slot profiles aligned with the SOSA technical reference standard. The backplane provides a dual-domain architecture, supporting MORA, ML2B, and Victory Messaging. Ideal uses include MOSA-aligned open standards-based military computing systems that require critical high-speed data communications, necessary for sensor-based systems.

The backplane can handle the highest data rates possible with Expansion Plane links supporting PCIe Gen 4, and optionally 100GBASEKR4, while Data & Control Planes links support 100GBASE-KR4 and 25GBASE-KR respectively. It features two switch slots, a PNT timing slot, nine payload slots, and two VITA 62 PSU slots.

When equipped with optical interfaces, the VPX architecture now supports higher overall bandwidths by augmenting the copper interconnects, allowing multiple fiber optic interfaces per slot. This greatly increases the overall connectivity providing additional data paths for system designers. The VPX optical interface ensures that this backplane will be able to meet future bandwidth requirements.

The backplane includes two I/O-intensive SBC slots, while the nine Payload slots can support RF Payload, GPGPU, and compute-intensive SBCS. Maintenance ports, AUX CLK, REF CLK, and GPIO signals are routed to headers allowing for outside connection. The backplane also routes IPMB A and B interfaces to support connection to an external VITA 46.11 Chassis Manager. The backplane is included in the SOSA 1.0 Reference Guide for Integrators (RIG) as a reference 3U backplane example for larger systems.

Elma’s products aligned to the SOSA Technical Standard 1.0 strive to follow the defense industry’s hardware and software convergence initiatives per the DoD’s convergence initiative as laid out in the Modular Opens Systems Approach (MOSA) mandate.

Elma www.elma.com

New 10U RiCool Chassis from Pixus Supports Redundant Rear Pluggable Power Supplies

Pixus Technologies has a new 10U RiCool chassis that supports single, dual, or N+1 redundant power suppliers that plug-in from the rear of the enclosure.

The 10U RiCool chassis features a 6U OpenVPX or SOSA aligned backplane in up to 16 slots at 1.0” pitch and speeds to 100GbE. The enclosure is extra deep to allow rear pluggable power supplies. This additional space also allows RF devices or other modules to fit within the rear of the chassis. The enclosure also supports a pluggable SOSA-aligned chassis manager or a rear mezzanine approach that fits behind the backplane without taking up any slot space. of airflow for a powerful cooling solution in a front-to-rear airflow configuration. The highly efficient and hot-swappable fans typically run under 59 DB. Various I/O and power options are available, along with optical or RF interfaces through the backplane.

Pixus offers OpenVPX and SOSA-aligned chassis in commercial grade and MIL rugged formats. The company also has options for other VITA and PICMG-based standards such as VME, CompactPCI Serial, SpaceVPX, xTCA, and more.

Pixus Technologies https://pixustechnologies.com/

October 2022

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Cincoze Announces New Open Frame Display Module CO-100 Series

Cincoze launched the CO-100 Series of openframe display modules with robust features and exclusive adjustable design for easy fitting into enclosures of different materials and thicknesses in industrial applications such as automation machines and kiosks. The debut CO-W121C, a 21.5” 16:9 high-resolution FHD display module with a PCAP touchscreen, is the latest addition to the CO-100 series, further expanding the variety of sizes, display ratios, and touch methods to meet a broader range of market needs.

The CRYSTAL Display Computing product line has three distinct series: CV-100 for indoor HMI requirements, CS-100 for outdoor high-brightness applications, and CO-100 for installation in a wide range of enclosures and cabinets. All three series use Cincoze’s Convertible Display System (CDS, Patent No. M482908) so they can be combined with a computer module (P2000/P1000 Series) to make an industrial panel PC, or combined with a monitor module (M1000 Series) to make an industrial touch monitor while retaining flexibility for future upgrades.

Adjustable Design Makes Installation Easy

The biggest feature of the CO-100 series is the adjustable mounting bracket, specially developed for equipment manufacturers. The thickness adjustment setting makes it easy to fit cabinets of different thicknesses and allows precise and sturdy positioning. The CO-100 series also supports different locking methods (panel and boss type) for flat or standard mounting, simplifying the installation process and providing more convenient integration while giving a smooth and consistent appearance for cabinets of different materials and thicknesses.

Integrated Structure Fits Any Machine

The CO-100 breaks free from traditional open frame designs by adopting a new integrated structure that reduces complex customizations for installation in equipment, improving the efficiency of on-site deployment and simplifying the cost of future maintenance. The different installation methods support a wide range of applications, with the flat and standard mounting as standard, but after removing the mounting bracket, the VESA mount can be used for a standalone system or installed in a 19” rack.

Robust and Reliable Design for Industrial Applications

The CO-100 series embodies Cincoze’s high quality, stability, and robustness by utilizing industrial-grade materials, providing an IP65 waterproof and dustproof front panel, supporting 0–70°C wide temperature operation, and giving 50,000 hours of backlight life. The CO-100 series is also in line with CE and FCC EMC requirements, making it ideally suited for industrial HMI applications. Finally, in addition to the standard P-CAP touch, a single-point resistive touch is set for future release.

Cincoze

www.cincoze.com

Antenova’s “Invicta” 2.4 GHz antenna gives wider coverage for tiny Bluetooth, Wi-Fi, and ZigBee designs

Antenova Ltd is releasing a new, compact, and very efficient antenna for the Wi-Fi, Bluetooth, and ZigBee frequencies at 2.4 - 2.5 GHz. This new antenna is named Invicta, part number SRFW082.

The Invicta antenna averages an efficiency of 70% across the 2.4 GHz band. Consequently, designs using this antenna will operate better, over longer distances and through walls and obstacles, thus extending the coverage and performance of wireless devices using Bluetooth, Wi-Fi, and ZigBee.

Invicta is a Flexible Printed Circuit (FPC) antenna, which is easy to place in a design. It connects directly to the PCB via a cable and IPX MHF (UFL) connector. The antenna comes with 100mm cable as standard and other cable lengths and connector options are available on request.

An FPC antenna is different from an SMD antenna in that it operates independent to a ground plane length and no antenna matching is required, so the design cycle for Invicta is simpler and shorter.

The FPC antenna also makes for easier manufacturing, as the antenna is fixed in place by a simple self-adhesive strip, and can be curved and inserted into the case of a design. This style of the antenna is ideally suited to small to medium -volume manufacturing.

Antenova has designed the Invicta antenna primarily for smart battery-powered devices for the home and office, where one single device provides global coverage. Typical applications in the home would be smart meters, home automation, wireless sensor networks, smoke, and intruder alarms. It would also be used for remote monitoring in industrial and medical environments.

Commenting, Antenova’s Product Marketing Manager Michael Castle says: “The efficiency of an antenna is related to its size, with larger antennas usually providing better performance. The Invicta antenna will be a winner because it performs better than PCB trace antennas and provides exceptional performance and range in return for the relatively small space in a design.”

Antenova Ltd www.antenova.com

October 2022

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Molex Launches PCIe Cable Connection System for Open Compute Project Servers

Molex has announced the release of its NearStack PCIe Connector System and Cable Assemblies for next-gen servers. Developed in collaboration with members of the Open Compute Project (OCP), NearStack PCIe replaces traditional paddle-card cable solutions to optimize signal integrity and improve system performance.

A standout feature of NearStack PCIe is its direct-to-contact Twinax termination, which eliminates the need for paddle cards within the cable assembly. Unlike competing cable jumpers, which are terminated by hand-soldering cables onto a PCB paddle card, NearStack uses a fully automated wire termination process. This high-precision process improves manufacturing efficiencies, repeatability, and signal integrity.

“Thanks to its superior construction, NearStack PCIe is ideal for next-generation PCIe Gen-5 and Gen-6 system implementation,” said Bill Wilson, new product development manager, at Molex Enterprise Solutions. “The product is capable of 32-Gbps NRZ data rates, enabling server OEMs to achieve unprecedented performance.”

Critical Components for the Open Compute Project

The Open Compute Project is a consortium of industry leaders dedicated to combining the best available technologies into standardized hardware development with highspeed and high-bandwidth capabilities.

NearStack PCIe was defined and adopted as a standard by the Small Form Factor (SFF) committee as SFF-TA-1026, and OCP recommends the technology as “TA-1026” for server reference designs. NearStack PCIe also has been included in the OCP Modular - Extensible I/O (M-XIO) specification and the Modular - Full-Width HPM Form Factor (M-FLW) as part of the next-generation OCP Data Center - Modular Hardware Systems (DC-MHS) family. As part of an open SFF standard, the technology is available to second-source vendors under a reasonable and non-discriminatory (RAND) license. NearStack PCIe already has been second-sourced through these licenses, with additional licenses offered to multiple vendors. This strategy ensures inter-vendor operability between Molex and other vendors while creating a robust supply chain.

Mechanical Design Optimizes Space, Simplifies Integration

Molex has optimized the cable assemblies for efficient use of space as well as the safe and easy attachment. Smart, rugged mechanical features, along with the optional “angle-exit” cable design, let technicians easily plug the jumpers into crowded boards. In addition to alleviating space constraints, NearStack PCIe offers a low-mated profile for improved airflow management and minimizes interference with neighboring components.

NearStack PCIe further simplifies integration through support for hybrid cables, with a NearStack PCIe connector on one end and a legacy connector on the other. These connectors provide a streamlined upgrade path for existing equipment, which enables customers to take advantage of the new technology immediately without redesigning or replacing current hardware.

Aitech System https://aitechsystems.com/

Evergreen Optical Solutions - Discover the flexible CEMA, C4, and ISR solutions connecting the technology of today with the capabilities of tomorrow.

The UK’s most diverse and forward-thinking security is once again bringing together military, law enforcement, and security agencies to meet with leading defense and security technology and innovation businesses on the 3rd of November at the Three Counties Showground.

3CDSE always focuses on the new threat landscape, and with the move to a new ecosystem governed by open standards for the creation and application of commercial off-theshelf (COTS) equipment, there’s never been a more important time to stay in the loop.

PPM Systems is actively involved in defining, maturing, and applying the open standards for connecting this new ecosystem, in part due to its proven history of strong collaboration and its authority in the RF and optical domains. Working with CEMA, C4, and ISR system integrators, PPM is delivering collaborative, future-proof solutions.

Connecting the technology of today with the capabilities of the future, evergreen RF over fiber solutions easily integrate with the radio equipment you have now and will allow you to smoothly add equipment from any suppliers at any point. Ease your current Vehicle Integration Kit (VIK) challenges and take your first, simple step into the ecosystem of the future.

Explore this technology-agnostic solution where all types, modulations, and classifications of a signal can be carried on a single, compact RF over fiber cable. Fiber is also impervious to interference from other electromagnetic signals and, as it can be part of a distributed network, you get flexible optical routing, distributed processing, antenna remoting, and reduced armor penetration.

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