COTS Journal

Tech Focus:

COM Express Boards Roundup

The Journal of Military Electronics & Computing

PLUS: Major DoD Programs: A Review

— Volume 13 Number 1 January 2011

An RTC Group Publication

cotsjournalonline.com

10 Gbit Ethernet Plays System Interconnect Role

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Below: a sample of RTD’s Express offering. RTD proudly leads the industry in PCI/104-Express selection and development.

The Journal of Military Electronics & Computing

12

COTS (kots), n. 1. Commercial off-the-shelf. Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customerpaid minor modification to standard COTS products to meet the customer’s unique requirements.

—Ant. When applied to the procurement of electronics for the U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade.

E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

OpenVPX Strengthens Its Hand for Military Embedded Designs

CONTENTS January 2011

Volume 13

Number 1

SPECIAL FEATURE OpenVPX Readies for Prime Time

12 OpenVPX Strengthens Its Hand for Military Embedded Designs Jeff Child

20 COTS Journal’s OpenVPX Solutions Center

Departments 6 Publisher’s Notebook Hey Washington...

We’re Important 8

The Inside Track

66

COTS Products

78 Editorial Time, Convergence and SWaP

28 Hurdles Fall for Doing Intel x86 DSP on OpenVPX Ian Stalker, Curtiss-Wright Controls Embedded Computing

TECH RECON

Coming in February See Page 76

Major DoD Programs Overview

34 Major Defense Programs Boost Their Appetite for Electronics Jeff Child

SYSTEM DEVELOPMENT 10 Gbit Ethernet Opens New Opportunities

42 Ethernet Becomes Entrenched as Military System Interconnect Jeff Child

TECHNOLOGY FOCUS COM Express Boards

50 COM Express Brings Its Multimedia Muscle to Defense Jeff Child

54

COM Express Boards Roundup

Digital subscriptions available: cotsjournalonline.com

On The Cover: OpenVPX offers the ruggedness and performance capabilities required by deployed military platforms aboard such ground vehicles as the Army’s Stryker. Here, a Stryker from the 2nd Stryker Cavalry Regiment is in action during Combined Partnership 2010 at the Grafenwoehr Training Area in Germany last Spring.

(U.S. Army photo Ralph Zwilling)

Patient Infotainment & eHealthcare Station

M1726

The Journal of Military Electronics & Computing

Publisher PRESIDENT John Reardon, johnr@rtcgroup.com PUBLISHER Pete Yeatman, mail@yeatmangroup.com

Editorial EDITOR-IN-CHIEF Jeff Child, jeffc@rtcgroup.com CONTRIBUTING EDITOR David Cotton, davidc@rtcgroup.com MANAGING EDITOR Marina Tringali, marinat@rtcgroup.com COPY EDITOR Rochelle Cohn

Feature Feat ature

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ARBOR Solution, Inc.

CREATIVE DIRECTOR Jason Van Dorn, jasonv@rtcgroup.com ART DIRECTOR Kirsten Wyatt, kirstenw@rtcgroup.com GRAPHIC DESIGNER Christopher Saucier, chriss@rtcgroup.com GRAPHIC DESIGNER Maream Milik, mareamm@rtcgroup.com WEB DEVELOPER Hari Nayar, harin@rtcgroup.com

Advertising WESTERN REGIONAL SALES MANAGER Stacy Mannik, stacym@rtcgroup.com (949) 226-2024 Untitled-7 1

1/11/11 11:37:43 AM

EASTERN REGIONAL SALES MANAGER Shandi Ricciotti, shandir@rtcgroup.com (949) 573-7660 ASIAN REGIONAL SALES MANAGER Jessica Marinescu, jessicam@rtcgroup.com (+852) 2548 5100 BILLING Cindy Muir, cmuir@rtcgroup.com (949) 226-2000

POWER YOUR LAPTOP & CHARGE YOUR BB-2590 MILITARY BATTERY WITH SOLAR POWER

COTS Journal

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Untitled-8 1

HOME OFFICE

Editorial office Jeff Child, Editor-in-Chief 20A Northwest Blvd., PMB#137, Nashua, NH 03063 Phone: (603) 429-8301 Fax: (603) 424-8122 Published by THE RTC GROUP Copyright 2009, The RTC Group. Printed in the United States. All rights reserved.

All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.

POWER SPECIALISTS FOR MOBILE COMPUTING

1/11/11 11:40:44 AM

A surprising blend of personalities

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Publisher’s

Notebook Hey Washington…

We’re Important

W

e’ve cleaned the slate of 2010 and now we can start 2011.

I hope everyone had a happy and joyous holiday season.

Now it’s time to roll up our sleeves and get to work. January 3rd we seated a new Congress and sometime in the first quarter we should have a new Secretary of Defense. Hopefully they’ll all get things rolling and work together for the good of the country.

Continuing the trend of the last two years, in 2011 the military will need a greater number of upgrades and technology insertions for existing programs. There probably won’t be any significant changes to RDT&E spending until after the first quarter.

But at least 2011 should end up with much better investment in RDT&E spending than 2010. Technology upgrades and insertions will predominate in maintaining the shining star status of the military embedded electronics market when compared to the overall economy—not only this year but in subsequent years.

It’s important that military electronics suppliers don’t fall into the same malaise the general industry is currently settled in to. When the accounting dust settles and analysts surveys report on 2010, I expect we’ll see that the military embedded market had about 10 percent growth last year. If the politicians don’t screw up too much this year we should see 5 to 7 percent growth.

All that said, it’s never been a more important time for us to get the message out to Washington that the embedded electronic industry is the backbone of the equipment used by the military.

COTS Journal is going to make a major effort to convey to the Under Secretary of Defense for Acquisition, Technology & Logistics, Dr. Ashton B. Carter, how important our industry is to the military. And also that we need to develop a better avenue for dialog between the DoD and our industry.

A little closer to home for each of us are—or should be— efforts to increase sales and market share. Times like these are really opportunities for companies and individuals to just go that one extra step. Our industry also needs to sell its worth as well as its products. To aide such efforts, the military embedded market has never had an organization that championed our industry as a whole. The closest we ever came was through VITA when it ran its Military Embedded Electronics and Computing Conference (MEECC) and its Executive Director would comply to requests to present market data in Washington. Not having [ 6 ] COTS Journal January 2011

an industry champion means that each and every organization in our industry must not only promote their goods and services, but also promote the industry itself.

The administration in Washington wants small business and private industry to take the lead in our country’s economic recovery. Unlike our industry’s customers—the prime contractors—few of our organizations can afford multi-million dollar lobbyists or any of the other things multi-billion dollar organizations can do.

But what we can do is espouse our industry’s critical worth to every company and politician that we interact with. Most of us don’t run silicon fabs or develop silicon, but we take those components and make them useable in military systems. We develop a wide variety of products and standards like OpenVPX, CompactPCI, COM Express and ATCA. In the end it is our industry’s collective knowledge and talent that produces all this goodness—not one particular company or a department of the government.

We at COTS Journal will continue to do our part. Over the last four years we’ve had an ever increasing number of persons from the DoD and military organizations requesting to be placed on our circulation list to receive the magazine. Our focus has, and always will be, technology for the military. In support of those readers we’ve been adding a little editorial to show how and when that technology may benefit readers that need to make major long-term decisions about which technology to back. In 2010 we were thrilled that an independent survey of our industry confirmed COTS Journal’s prominent position as the source of industry information. To maintain your trust and loyalty, we pledge to continue providing first class independent editorial and offering expansions and greater insight to our content online at cotsjournal.com.

Here’s wishing you a happy, healthy and prosperous 2011 from our entire team.

Pete Yeatman, Publisher COTS Journal

Taking performance to the next level.

IntelŽ Core™ processors aren’t just faster, they’re smarter.

Intel, maker of the classic IntelŽ PentiumŽ processor, unveils the new standard in processor power and performance—the IntelŽ Core™ Processor Family.

IPC 4116 1U EXTREME RUGGED TWIN SERVER

4BMFT!TZTUFMVTB DPN www.systelusa.com Systel Inc. is a leading designer and system integrator PG $054 BOE DVTUPN SVHHFEJ[FE JOEVTUSJBM DPNQVUFST SBDL NPVOU BOE XBMM NPVOU TFSWFST -$% EJTQMBZT BOE "5$" $PNQBDU 1$* QMBUGPSNT 4ZTUFM QSPEVDUT BSF EFTJHOFE BOE UFTUFE UP NFFU .*- 45% TQFDJĂ˝ DBUJPOT Intel is not responsible for and has not verified any statements or computer system product-specific claims contained herein.

t *OUFMŽ $PSF™ J QSPDFTTPS t 4VQQPSUT UXP *OUFMŽ EVBM QSPDFTTPS NPUIFSCPBSET t 3FNPWBCMF )%%T t .*- 45% G $PNQMJBOU

IPC 42312 2U SPACE SAVER SERVER t *OUFMŽ $PSF™ J QSPDFTTPS t JODI EFQUI DIBTTJT GPS IBSTI FOWJSPONFOUT t TPMJE TUBUF ESJWFT BOE POF OPUFCPPL %7% t .*- 45% G DPNQMJBOU

Š 2011, Intel Corporation. All rights reserved. Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.

The

Inside Track Navy Contracts Lockheed Martin to Construct up to 10 Littoral Combat Ships The U.S. Navy has awarded a Lockheed Martin-led industry team a fixed-price-incentive-fee contract to construct up to 10 Littoral Combat Ships (LCS). The first of the 10 ships will be acquired under the 2010 budget, at a contract value of $437 million, and the rest via options through 2015. If all options are exercised, the total value of the ship construction portion of the contract will reach approximately $3.6 billion. Marinette Marine Corporation, a Fincantieri company, will construct the ships in Marinette, WI, and naval architect Gibbs & Cox will provide engineering and design support.

Prior to this contract, the Lockheed Martin industry team designed and constructed the nation’s first LCS, USS Freedom. USS Freedom’s capabilities have been demonstrated since its commissioning in 2008 (Figure 1). The ship successfully completed its first deployment earlier in 2010 and also participated in the world’s largest maritime exercise, the Rim of the Pacific Exercise, known as RIMPAC. LCS 3, the Navy’s future USS Fort Worth and Lockheed Martin’s second LCS, is more than 80 percent complete and was recently christened and launched.

Lockheed Martin. Bethesda, MD. (301) 897-6000. [www.lockheedmartin.com/ms2].

ViaSat Receives $13.8 Million in Orders for Blue Force Tracking 2 ViaSat has received delivery orders from PM Force XXI Battle Command Brigade and Below totaling $13.8 million under its Blue Force Tracking 2 (BFT-2) IDIQ contract. These contracts include the installation and test of production satellite ground station and satellite network control center equipment as well as L-band bandwidth leasing, network ground equipment, and thousands of additional production vehicular transceivers. These next generation BFT-2 systems are designed to enable much faster situational awareness updates and higher transmission speeds.

The ViaSat BFT-2 network offers situational awareness updates and increased data throughput. The next generation BFT-2 network is expected to [ 8 ] COTS Journal January 2011

Figure 1

The nation’s first Littoral Combat Ship, Freedom (LCS 1), is shown here in 2008 when it was put to sea for the first time, marking the beginning of Builder’s Sea Trials for the first-in-class coastal surface combatant.

improve situational awareness latency from minutes to just seconds. The new BFT-2 system is derived from ViaSat mobile satellite communication technology, which enables fast, efficient network access using very small antennas. These systems provide communications-on-the-move (COTM) service to both military and commercial customers.

ViaSat Carlsbad, CA.

Figure 2

(760) 476-2200.

JCREW initiatives increase coverage of the radio controlled IED (RCIED) frequency spectrum. These new versions include portable and vehicle mounted systems for vehicles like the MRAP.

[www.viasat.com].

Mercury to Supply Embedded Computing for JCREW 3.3 Counter-IED Program Mercury Computer Systems has been awarded a subcontract

by ITT Electronic Systems to deliver products and services for the JCREW (Joint CounterRadio Controlled Improvised

Explosive Device) 3.3 program.

As recently announced by ITT Electronic Systems, the U.S. Naval Sea Systems Command has exercised the third option

of the JCREW 3.3 contract and has awarded ITT the development of this next generation counter-IED system, designed to detect, prevent and neutralize IEDs, the single biggest threat faced by in-theatre forces today.

IEDs, such as roadside bombs, are frequently employed in terrorist-based or unconventional warfare, and have been a primary cause of death in recent military activity, because they are very difficult to detect and destroy (Figure 2). The JCREW 3.3 specification requires open architecture-based softwareenabled implementations.

All electronic warfare applications involve access to the electromagnetic spectrum, denying access for enemies, and ensuring access for allied forces.

The counter-IED application is an example of active electronic warfare, which not only searches the electromagnetic spectrum for energy, but also takes ac-

Inside Track

tion to mitigate that energy.

The counter-IED technology that Mercury will supply to ITT is based on the previously announced active electronic warfare solutions.

Mercury Computer Systems, Chelmsford, MA. (866) 627-6951. [www.mc.com].

Raytheon to Continue Software Development for the AN/TPY-2 Radar The Missile Defense Agency (MDA) awarded Raytheon a $43 million contract modification to continue developing the common X-Band capability software and modeling and simulation capabilities for the AN/TPY-2 radar. Raytheon's AN/TPY-2 radar provides a common mission capability: in terminal-based mode with the THAAD Fire Control Center in support of the THAAD weapon system, and in a forwardbased mode with command, control, battle management and communications, enabling MDA's Ballistic Missile Defense System.

It is a phased array, capable of search, threat detection, classification, discrimination and precision tracking at extremely long ranges.

Work on this contract will be performed at Raytheon's Missile Defense Center, Woburn, MA. and at Raytheon's Warfighter Protection Center, Huntsville, AL. Raytheon Waltham, MA. (781) 522-3000. [www.raytheon.com].

Cobham Selected for New Aegis Radar Systems Cobham will provide major Radio Frequency and Microwave assemblies for Aegis surveillance and fire control radar systems ordered as part of new-build

Arleigh Burke guided missile destroyers for the U.S. Navy and foreign customers. In a deal worth approximately $40 million, Cobham will provide prime contractor Lockheed Martin Mission Systems and Sensors with 3700 assemblies for each Aegis system, which has been fitted to several classes of U.S. Navy vessel and shore-based locations. The U.S. Navy is so far committed to building eight Arleigh Burke vessels (Figure 3) between 2011 and 2016.

AeroMech Small Tactical UAV Has Successful First Flight

Event Calendar

AeroMech Engineering has announced the successful first flight of the Fury 1500 Small Tactical Unmanned Aerial System (STUAS) (Figure 4). The successful hour-and-a-half flight occurred at Hunter Liggett Airfield. This new version of the Fury was developed at AME's UAS facility in San Luis Obispo, California. It is operated and controlled by AME's UAS Mission Management software, SharkFin. The Fury is a long-endurance, survivable and runwayindependent UAS providing the large payload capacity needed to satisfy critical requirements for the warfighter. Fury 1200, which was designed for multiple special missions, had its initial flight in 2008.

Real-Time & Embedded Computing Conference

January 27

Santa Clara, CA www.rtecc.com February 15

Real-Time & Embedded Computing Conference Huntsville, AL www.rtecc.com February 17

Real-Time & Embedded Computing Conference Melbourne, FL www.rtecc.com February 23-25

AUSA Winter Ft. Lauderdale, FL www.ausa.org March 1-3

Embedded World Nuremberg, Germany www.embedded-world.de March 22

Figure 3

Aegis surveillance and fire control radar systems as installed on Arleigh Burke guided missile destroyers.

The Aegis system is a maneuverable low-cost Ballistic Missile Defense radar for smaller platform ships such as frigates.

Cobham Antenna Systems Vice President Fred Cahill said this follow on order was testament to the performance of Cobham components on earlier versions of the radar. Cobham has supported Lockheed Martin for more than 30 years, supplying major RF microwave components in the production of Aegis SPY 1DV weapons systems.

Cobham Wimborne, Dorset, UK. +44 (0) 1202 857529 [www.cobham.com].

Real-Time & Embedded Computing Conference Figure 4

The Fury is a long-endurance, survivable and runway-independent UAV providing the large payload capacity.

Fury 1500 development is being supported by the United States Air Force Research Laboratory (AFRL) to address multiple warfighter requirements. Designed for a broad range of missions and long endurance, the UAV’s large payload volume and power capacity can support several payloads simultaneously and provide for a flexible, multi-mission capability not currently available with other UAS platforms.

Minneapolis, MN www.rtecc.com March 24

Real-Time & Embedded Computing Conference Chicago, IL www.rtecc.com To list your event, email: sallyb@rtcgroup.com

AeroMech Engineering San Luis Obispo CA. (805) 503-4306. [www.aeromechengineering.com].

January 2011 COTS Journal [ 9 ]

GE INTELLIGENT PLATFORMS

PHONE: (800) 433-2682 WEB: www.ge-ip.com/vpx

IPN250 - 6U GPGPU OpenVPX Multiprocessor

MAGIC1

GE Intelligent Platforms’ rugged IPN250 is the first single slot, 6U OpenVPX GPGPU COTS Mil/Aero multiprocessor.

GE Intelligent Platforms’ MAGIC1 Rugged Display Computer gives unprecedented Mil/Aero graphics processing capabilities.

The IPN250 is the world’s first single slot, 6U OpenVPX GPGPU COTS multiprocessor for rugged Mil/Aero applications. This innovative processor delivers unprecedented levels of computing performance for size, weight and power (SWaP)-constrained platforms at lower cost, creating new application opportunities that were previously unthinkable. It enables system integrators to deploy a single COTS module where previously multiple disparate modules would have been required—undertaking, for example, front end processing of sensor-acquired data, digital signal processing, backend processing and graphics/video processing while delivering high-resolution, mission-critical data more rapidly than has previously been possible.

Using the latest in desktop performance technology, GE Intelligent Platforms’ MAGIC1 Rugged Display Computer delivers unprecedented graphics performance demanded by military and aerospace customers.

Combining the processing power of the Intel Core 2 Duo with the NVIDIA G73, connected together with 16-lane PCI Express™, the MAGIC1 Rugged Display Processor is capable of driving the industry’s most demanding visual applications such as embedded training, digital mapping, and terrain visualization.

• Latest 96 core GPU with CUDA/OpenCL/OpenGL

The processing node consists of an Intel T7400 Core 2 Duo CPU running at 2.16 GHz with 4 Mbytes of L2 cache. The graphics processing node is based on the dual channel NVIDIA G73 graphics processing unit, as featured on the NVIDIA GeForce™ 7600GT, and incorporates 256 Mbytes of GDDR3 SDRAM arranged in two banks.

• Fast interprocessor communication and I/O

• 2.16 GHz Intel® Core™ 2 Duo processor

• Scalable computing platform

• NVIDIA® G73 graphics processor

• Wide deployed computing application space—ideal for SWaPconstrained applications

• Multiple video standards (DVI, VGA, TV)

• High-performance CPU and wide OS support

• Dual channel video output • Up to 64 GBytes solid state disk

GE Intelligent Platforms is an experienced high-performance technology company and a global provider of software, hardware and services with expertise in automation and embedded computing. We offer a unique foundation of agile and reliable technology providing customers a sustainable advantage in the industries they serve, including energy, water, consumer packaged goods, military and aerospace, and telecommunications.

GE Intelligent Platforms

From proposal to deployment in record time.

Our new COTS Rugged Systems are ready whenever the development clock is ticking.

More often than not, you need to be able to pull your next rugged system off the shelf.

Our new line of integrated COTS Rugged Systems provides the quick delivery time most developers need for their UAV, ground vehicles or manned aircraft systems. These fully integrated computing platforms can be built around Freescale or Intel processors with a variety of 3U slot configurations to provide enough options to handle most applications. The CRS series takes the risk out of rugged system development with a fully tested computing platform that integrates with our own wide range of COTS products as well as those of third-party providers.

Finally, a rugged system that puts “off-theshelf” back into COTS.

For more information, visit:

defense.ge-ip.com/systems For more information about QRcodes, visit www.ge-ip.com/qrcodes

© 2011 GE Intelligent Platforms, Inc. All rights reserved.

All other brands or names are property of their respective holders.

Special Feature OpenVPX Readies for Prime Time

Special Feature

OpenVPX Strengthens Its Hand for Military Embedded Designs As the OpenVPX ecosystem shifts into a higher gear, board and backplane developers are rolling out solutions for a variety of military system application needs.

Jeff Child, Editor-in-Chief

M

ilitary system developers have long faced a conflicting desire to harness the latest and greatest computing technologies versus the need to mitigate the risks inherent in banking on new system architecture approaches. Aimed at bridging those desires, the OpenVPX spec provides implementation details for VPX payload and switch modules, backplane topologies and chassis products. And most importantly, it provides specific profiles on all the key aspects of an OpenVPX so that users and product vendors now have a clear language defining which OpenVPX are compatible with one another. In doing so, OpenVPX solves the long-known problem that has faced VPX from its beginning: With its large number of open pins and the variety of fabric options available to it, it was difficult to ensure compatibility between VPX products of different vendors. The spec provides defense primes and suppliers clear direction for crafting interoperable computing and comms platforms.

While it’s still early yet to predict which specific OpenVPX profiles will emerge as the dominant ones, the general consensus is that the list will shake down to four or five that serve the main needs of military system developers.

Fortunately in this age of programmable pins and FPGAs, it will be easy for OpenVPX module vendors to build boards that are usable in more than one profile. With that in mind, migrating a basic board design to meet different profiles isn’t expected to require a lot of design and engineering effort. Figure 1 shows an example OpenVPX board—an Intel-based server-class embedded computer.

January 2011 COTS Journal [ 13 ]

Special Feature

Figure 1

The Ensemble HDS6600 is designed for rugged deployed ISR systems. The board is based on Intel’s Xeon processor and does standards-based protocol management, such as Serial RapidIO and PCIe, with high-speed real-time switching capability.

Profiles Keep Definitions Clear In its more than 400 pages, the OpenVPX System Specification spells out the technical implementation details for 3U and 6U VPX payload and switch

modules, backplane topologies and chassis products, which provides clear guidance to the Defense primes and suppliers on how to build interoperable computing and communication platforms. The VPX standard was developed to define a new generation of computing systems that employs high-performance switch fabrics over a new high-speed connector, as well as operates in harsh environments.

In a nutshell, the OpenVPX specification is designed to improve interoperability of 3U and 6U VPX boards by implementing predefined system topologies.

This was needed, according to members, in order to lower the risk of adoption, expand the addressable market for VPX solutions, increase the market opportunities, and accelerate the deployment of VPX solutions into defense-related applications. OpenVPX member companies continue to announce OpenVPX products compatible with the spec—and today there are over a hundred OpenVPX products. Table 1 lists the current members of the VPX Marketing Alliance.

OpenVPX designates a series of defini-

tions for module mechanics, connectors, thermal, communications protocols, utility and power provided by specific VPX standards. The document takes those definitions and uses them to describe a series of standard profiles that define slots, backplanes, modules and “Standard Development Chassis.”

The goal of all this is interoperability, with the OpenVPX standard defining each allowable combination of interfaces between any given module, backplane and chassis.

Switched Fabrics Are Key The specification includes profile definitions comprised of a variety of factors; the switch fabric part of those profiles is among the most crucial of OpenVPX system developers’ choices. Which OpenVPX fabric to use will be dictated by the application area of the system. On an architecture level, the fabric choice will be driven by how tightly or loosely coupled the processing and memory needs to be. For applications that require shared memory, RapidIO will be the data plane of choice. In contrast, if the system requires parallel processing— where very little data exchange is required Switch

Payload Slots

VPX Application Example: UAV CommINT Transceiver • System receiver scans for spectral activity, acquires signals, performs signal classification, demodulation and decoding.

• Received information is encrypted and then delivered over a secure link to a satellite system where it is relayed to an analysis station.

• Key Features: • Low power • Small size • Ruggedized environment

VPX 1

VPX 2

VPX 3

VPX 4

VPX 5

VPX 6

Expansion Plane (FP)

Expan Plane

Expan Plane

Expan Plane

Expan Plane

Expan Plane

Data Plane (FP)

Data Plane

Data Plane

Data Plane

Data Plane

Data Plane

Data Switch

Control Plane (UTP)

Contrl Plane

Contrl Plane

Contrl Plane

Contrl Plane

Contrl Plane

Contrl Switch

Management Plane (IPMB)

IPMC

IPMC

IPMC

IPMC

IPMC

ChMC

FP

TP UTP

Utility Plane Includes Power Module & Function CPU, Software Radio, FPGA Switch

Slot Profiles SLT3-PAY-1F2F2U-25.2.2 SLT3-SWH-6F6U-25.4.1

Modules Profiles MOD3-PAY-1F2F2U-27.2.2-1 MOD3-SWH-6F6U-27.4.1-6

Figure 2

This VPX application example shows the requirements and system topology and the OpenVPX profiles best suited to implement it. [ 14 ] COTS Journal January 2011

Special Feature

VPX Marketing Alliance Member Companies 4DSP Aitech Defense Systems Amphenol BittWare Concurrent Technologies Plc. Conduant Creative Electronic Systems (CES) CSPI Curtiss-Wright Controls Diversified Technology Dynatem Elma Electronic Emerson Network Power Extreme Engineering Solutions GE Intelligent Platforms

HDL Research Lab Innovative Integration Kontron Mercury Computer Systems Meritec / Joy Signal Technology Pentek SIE Computing Solutions Technobox TEK Microsystems Themis Computer Tracewell Systems Tyco Electronics VTI Instruments.

Xembedded

Table 1

Together these VPX Marketing Alliance companies offer over a hundred OpenVPX products, with more emerging each month.

between computing nodes—a fabric like PCI Express, Gbit Ethernet or 10 Gbit Ethernet is a better choice. Figure 2 shows a VPX application example and the associated OpenVPX profiles that best suit it.

A military radar processing system is an example of where tight coupling is important (Figure 3). Radars use an N x N matrix and a linear transformation is done to transpose the data from one domain space to another. Passing that much data back and forth in radar processing requires high-performance computing with shared memory.

Moreover, the OpenVPX system must be set up so each processing node can actually see the memory in another application space.

RapidIO is suited for such design because it’s a low-latency, memory-address-based protocol. It allows chip-to-chip and boardto-board communications at performance levels scaling to 10 Gbits/s and more.

For loosely coupled systems, either Ethernet or PCI Express is expected to be the dominant OpenVPX fabric choice.

For military systems that are very communications or networking based—for example ad hoc networks with RF— switched Ethernet becomes the leading fabric choice. Ethernet fits in well with the military’s push toward an EverythingOver-Internet Protocol (EOIP) strategy, leveraging the ubiquitous ecosystem of TCP/IP and Ethernet technologies.

PCI Express for Distributed Systems

Figure 3

RapidIO is the fabric most suited as a OpenVPX data plane for radar processing systems because they rely heavily on shared memory and tightly coupled computing. RapidIO is a low-latency, memory-address-based protocol.

For OpenVPX implementations that are distributed systems, PCI Express would be a natural fit depending on what size and what latency tolerances a system has. With PCI Express, each time you go through a switch or a bridge means more latency through the PCI hierarchy. That latency can be minimized using non-transparent PCI Express bridges or by “tunneling” through address spaces. Distributed processing is common in systems where size, weight and power are critical—like UAVs, flight controllers and other systems that have motors and distributed control nodes. In such systems computational density is important, but not to the level of high-performance computing. Distributed systems commonly rely on a dozen or so nodes able to communicate with one another to accomplish the January 2011 COTS Journal [ 15 ]

Special Feature

180 160 140

2009 2009 Total: US$ 376.5 Million 2012 2012 Total: US$ 515.7 Million

$ Millions

120 100 80 60 40 20 0

VME64x VME64 VME2eSST VPX VME32 Other VME- VXS VXI based Source: VDC Research’s Embedded Hardware & Systems: 2010 Market Intelligence Service, July 2010

Figure 4

VPX. Figure 4 shows where VPX will fit in alongside other VITA technologies in the coming years. But alongside those new designs will be a substantial number of hybrid systems—systems using both VME and VPX boards and subsystems—in order to leverage the huge investment already made in the marketplace. Billions have been invested in legacy VME systems, and it will be a long while before pure OpenVPX-only systems dominate. If a VPX system, for example, needs a piece of technology like an RF tuner, a likely scenario would be to implement a hybrid system that accommodates a VXS or VME version of the tuner.

Using a specialized bridge chip, it’s straightforward for board makers to bridge between OpenVPX and VME.

As this VDC Research market research shows, VPX is expected to rapidly gain acceptance in the next two years, but older VME technologies will still flourish alongside it. task at hand. In contrast, radar processing requires a hundred or more nodes because, with radar systems, the finer the granularity the quicker it can see an incoming target.

OpenVPX is expected to have a strong presence in military programs that have brand new embedded computing implementations—some of which already use

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[ 16Untitled-6 ] COTS1Journal January 2011

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BITTWARE

PHONE: (603) 226-0404 WEB: www.bittware.com

S4-3U-VPX: Commercial & Rugged Altera Stratix® IV GX 3U VPX Board

FMC/S4-3U-VPX: Commercial & Rugged Altera Stratix® IV GX 3U VPX Data Conversion Board

BittWare’s S4-3U-VPX (S43X) is a commercial or rugged 3U VPX card based on the high-density, low-power Altera Stratix IV GX FPGA. The Stratix IV GX is designed specifically for serial I/O-based applications, creating a completely flexible, reconfigurable VPX board. BittWare’s ATLANTiS FrameWork and the FINe Host/Control Bridge greatly simplify application development and integration of this powerful board. The board provides a configurable 25-port SerDes interface supporting a variety of protocols, including Serial RapidIO, PCI Express, and 10 GigE; it also features 10/100/1000 Ethernet, and up to 4 GB of DDR3 SDRAM.

BittWare’s FMC/S4-3U-VPX is a commercial or rugged 3U VPX card based on the high-density, low-power Altera Stratix IV GX FPGA coupled with high-speed data conversion. The Stratix IV GX is designed specifically for serial I/O-based applications, creating a completely flexible, reconfigurable VPX board. BittWare’s ATLANTiS FrameWork and the FINe Host/Control Bridge greatly simplify application development and integration of this powerful board.

• VITA 57 FMC site for processing and I/O expansion • High density Altera Stratix IV GX supported by BittWare ATLANTiS™ FrameWork for FPGAs • BittWare FINe™ III Host/Control Bridge provides control plane processing and interface

• 2 channels 14-bit, 250 MSPS ADC and 2 channels 16-bit, 250 MSPS DAC • 1 or 2 channels 8-bit, up to 2.5 GSPS ADC • 4 channels 14-bit, 250 MSPS ADC • 8 channels 12-bit, 65 MSPS ADC • 1 or 2 channels 16-bit, up to 1 GSPS DAC

• Fully connected to VPX: GigE, 15 SerDes, 32 LVDS • Additional I/O: 10/100 Ethernet, RS-232, JTAG BittWare’s ATLANTiS™ FrameWork for FPGA development provides reconfigurable FPGA components, along with the infrastructure necessary to implement, simulate, synthesize, validate, and deploy a complete FPGA application on the Stratix IV GX.

High-speed serial interconnects open up a wealth of possibilities for implementing signal processing systems, and BittWare has taken advantage of this on our new FPGA-based OpenVPX boards. Reconfigurable OpenVPX boards bring flexibility to the OpenVPX system designer exploring serial fabrics and protocols, enabling sameboard use and reuse. Using reconfigurable boards in OpenVPX systems provides the flexibility to additionally enable designers to adapt their systems for future customer requirements easily and efficiently. Now that OpenVPX is a reality, VPX is simply the logical platform for us to deliver our next-generation architectures on a rugged format.

Special Feature OpenVPX Readies for Prime Time

COTS Journal’s

OpenVPX Solutions Center It’s been a critical period for OpenVPX over the past 12 months as vendors have accelerated design and release of all manner of OpenVPX board, backplane and enclosure solutions. Provided here is a representative sampling of the latest and greatest OpenVPX products now available.

Rugged 6U VPX SBC Has Integrated Onboard I/O Resources

Aitech Defense Systems has introduced a rugged 6U VPX SBC that offers the selection between PCI Express and Serial RapidIO. Using an integrated dual core PowerPC processor, the new singleslot C110 is built to OpenVPX and VPX specifications. It is fully compliant with legacy VME operations, such as VME64 per VITA 46.1, while supporting advanced VME protocols including 2eSST and 2eVME. Four x4 ports, configurable to either Serial RapidIO or PCI Express, make up the VPX core backplane fabric. The C110’s extensive onboard I/O resources include four Gigabit Ethernet, four USB 2.0 ports, two SATA 2.0 ports, six asynchronous serial ports and eight GPIO (general purpose discrete I/O) channels. Withstanding extreme military shock and vibration over an extended temperature range of -55° to +85°C (Mil-Spec), the new C110 remains reliable in extreme environmental conditions.

Aitech Defense Systems. Chatsworth, CA. (888) 248-3248. [www.rugged.com].

VPX and FMC Make Powerful Data Conversion Team

BittWare’s S4-3U-VPX (S43X) is a commercial or rugged 3U VPX card based on the high-density, low-power Altera Stratix IV GX FPGA. The Stratix IV GX is designed specifically for serial I/O-based applications, creating a completely flexible, reconfigurable VPX board.

The board provides a configurable 25-port SerDes interface supporting a variety of protocols, including Serial RapidIO, PCI Express and 10 GigE. The board also features 10/100/1000 Ethernet, and up to 4 Gbytes of DDR3 SDRAM. Providing enhanced flexibility is the VITA 57-compliant FMC site, which supports 10 SerDes, 60 LVDS pairs and 6 clocks. The 3FAD FPGA is a 2.5 GSPS, 8-bit ADC FPGA Mezzanine Card (FMC) that can be used with the VPX board.

BittWare, Concord, NH. (603) 226-0404. [www.bittware.com].

[ 20 ] COTS Journal January 2011

3U OpenVPX Board Sports Second Generation Intel Core Processors

Concurrent Technologies provides a 3U OpenVPX SBC featuring the second generation Intel Core processor and Intel 6 series chipsets from the Intel embedded roadmap. The TR 80x/39x features the quad-core Intel Core i7-2715QE processor and the dual-core Intel Core i5-2515E processor. The board has up to 8 Gbyte of ECC DDR3 SDRAM, configurable PCI Express fabric interface supporting 1 x8, 2 x4, 1 x4 + 1 x4 at Gen 1 or Gen 2 data rates, dual Gigabit Ethernet or dual 1000Base-BX channels, dual SATA600, single XMC slot, serial RS-232/422/485 port, dual USB 2.0 ports, independent VGA and display port. The TR 80x/39x is available in three temperature grades. For extreme rugged applications, the TR 80x/39x is available in VPX-REDI variants.

Concurrent Technologies, Woburn, MA. (781) 933 5900. [www.gocct.com].

Special Feature

Enclosure Boasts Innovative Thermal Management Technology

Curtiss-Wright Controls Electronic Systems offers a new technology for thermal management of rugged embedded computing enclosures. Test results of CoolWall technology, using the company’s baseplatecooled Hybricon SFF-6 enclosure, showed a 2.4x increase in thermal conductivity at the chassis level (2.4x decrease in sidewall temperature rise) along with a 10% weight decrease as compared to aluminum construction. CoolWall technology is based on a proprietary mixture of metal composite materials and delivers its higher thermal conductivity at a weight significantly lighter than aluminum. The SFF-6 Small Form Factor Chassis features CoolWall thermal technology to support payload heat dissipation up to 400W. This small ATR-style chassis speeds and simplifies the integration of high-performance, 3U OpenVPX or cPCI embedded COTS subsystems.

Curtiss-Wright Controls Electronic Systems, Santa Clarita, CA. (661) 257-4430. [www.cwcelectronicsystems.com].

VPX Cube Offers 3U Conduction-Cooled Enclosure

A ruggedized 4-slot conduction-cooled enclosure for VPX 3U modules is designed to MIL-STD-810F, DO-160E and MIL-STD-461E standards, and is compliant with applicable VITA 46 (VPX), VITA 48 (REDI) and VITA 65 (OpenVPX) specifications. The CCE3VPX4 VPX Cube from Dawn VME Products features 4 slots of 3U VPX on a 1” pitch high bandwidth backplane and an integrated, wide temperature range 400W power supply. The chassis is cold plate base-coupled, conduction cooled. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. Operating temperature range is -40° to +85°C. Full environmental sealing ensures reliable, all-conditions operation.

6U Open VPX Intel QuadCore-based SBC Sports 24-port Ethernet

Dynatem is now shipping the VPQ, a 6U SBC based on the 6U VPX (VITA 46) form factor. It is Open VPX compatible per profile MOD6-PAY-4F2T-12.2.2.4. This profile indicates a 6U Payload Module having four fat pipes (10 GBase-BX4) and two thin pipes (1000Base-T). It’s offered in both convectioncooled and ruggedized conduction-cooled variants. At the heart of the VPQ is one quad-core Intel L5408 Xeon Processor. Up to 4 Gbytes of DDR2 SDRAM are supported with the MCH running at up to 1066 MHz double data rate speeds. The VPQ supports two fully capable PMC/XMC sites with extensive user I/O. An onboard Fulcrum FM3224 24-Port 10 Gigabit Ethernet Switch provides fullmesh backplane data-layer interconnectivity.

Dynatem, Mission Viejo, CA. (949) 855-3235. [www.dynatem.com].

Dawn VME Products, Fremont, CA. (510) 657-4444. [www.dawnvme.com].

Second Gen Intel Core i7 Processor Rides 3U VPX

Extreme Engineering Solutions has introduced the XPedite7470, a conduction- or air-cooled 3U VPX SBC. The XPedite7470 utilizes the processor's quad-core technology operating at 2.1 GHz to deliver enhanced performance and efficiency, making it an excellent COTS product for deployed military applications. The XPedite7470 initially will be based on the Intel Core i7-2715QE processor and Intel QM67 Express chipset. Other XPedite7470 processor options will be available later in 1Q11. The XPedite7470 features include up to 8 Gbytes of DDR3-1333 ECC SDRAM in two channels, 32 Mbytes of boot flash and up to 16 Gbytes of user flash and an XMC/PrPMC site. The board also sports two x4 Gen2 PCI Express VPX backplane interconnects, two optional 10/100/1000BASE-T or 1000BASE-BX Ethernet ports also with USB, SATA and DVI graphics ports.

Extreme Engineering Solutions, Middleton, WI. (608) 833-1155. [www.xes-inc.com].

January 2011 COTS Journal [ 21 ]

6U VPX Load Board Designed for Conduction-Cooled Chassis

Elma Bustronic has rolled out a new 6U VPX Load Board in a conduction-cooled format. The board is designed per the IEEE standard 1101.2 mechanical format. The conduction-cooled VPX load board helps confirm the chassis meets the VITA 46/48/65 power specifications for VPX and aids in locating hot spots within the enclosure. It helps test a system's cooling capabilities by applying the load to the power supply for verification and creating the necessary heat to confirm chassis cooling. Like the standard air-cooled version, the conduction-cooled load card has a microcontroller-based stepped load control to 100W maximum. The set load power levels are saved in EEPROM. Bustronic also offers VPX load boards in a 3U form factor and 6U air-cooled formats.

Elma Electronic, Fremont, CA. (510) 490-7388. [www.elmaelectronic.com].

6U OpenVPX 10 Gbit Ethernet Switch Targets ISR and C4I

GE Intelligent Platforms has announced the NETernity GBX460 rugged 6U OpenVPX data plane switch module, the first 10 Gbit Ethernet solution of its kind to support high throughput interprocessor communication (IPC) between 10GigE-enabled processing nodes for deployed defense and aerospace applications. With 20 (optionally 24) 10GigE data plane ports and 16 GigE control plane ports, the GBX460 supports non-blocking, low-latency data transfers across a multiprocessing cluster at up to full wire speed. The GBX460 is available in conduction-cooled variants to allow deployment in harsh environments.

The standard build of the GBX460 provides 20 x 10GigE data plane fat pipes and 16 x 1 GigE control plane ultra-thin pipes to support multi-board 6U VITA65 (OpenVPX) system configurations.

GE Intelligent Platforms, Charlottesville, VA. (800) 368-2738. [www.ge-ip.com].

VPX-REDI SBC Enables Network Connectivity Mobile Apps

Designed to withstand the rigors of mobile and tactical environments, General Dynamics Canada offers the PX3030 VPXREDI single board computer. The PX3030 harnesses the computing power of the Intel Core 2 Duo Mobile processor and 8 Gbyte RAM to easily handle today’s demanding network communications, graphics, imagery and video feeds needed for Modern Brigade Combat teams.

Features of the board include dual Gbit Ethernet 10/100/1000 connectivity, onboard storage up to 16 Gbytes of SATA NAND flash, six USB 2.0 and four RS-232/422 ports. The card meets VITA 47 CC4 vibration, shock and temperature specs. It’s a 3U module per VITA 48.2 (conduction-cooled), Type 1, 0.85-inch pitch. Compatible software includes Microsoft Windows, LynuxOS, Linux, HHEL, VxWorks and other operating systems.

General Dynamics C4 Systems, Scottsdale, AZ. (480) 441-3033. [www.gdc4s.com].

[ 22 ] COTS Journal January 2011

3U VPX SBC Serves Up Intel Core2 Duo

Interface Concept’s new IC-DC2-VPX3a 3U VPX board is based on the Intel Core 2 Duo processor SL9380 (or SU 9300). The board also boasts the Intel 3100 Chipset and is compliant with several Payload Slot Profiles of the OpenVPX standard. Designed for applications requiring a very high level of performance in a compact 3U form factor, the IC-DC2-VPX3a provides a flexible combination of interfaces, supporting VPX’s high bandwidth serial switched fabrics (PCI Express VITA 46.4). The IC-DC2VPX3a board also provides two Gbit Ethernet ports that can be used on P1 as 1000BT or 1000KX interfaces.

The IC-DC2-VPX3a is available in standard, extended, rugged and conduction-cooled grades.

Interface Concept Briec de l’Odet, France. +33 (0)2 98 57 30 30. [www.interfaceconcept.com].

Special Feature

OpenVPX IPv4/v6 Switch Offers 28 Gigabit Ethernet Ports

The Kontron Gigabit Ethernet Switch VX3910 offers 3U VPX (VITA 46.x) and OpenVPX (VITA 65) platforms Enterprise-Class Switching functionality with a total of 28 Gigabit Ethernet ports and advanced management features. The non-blocking fully managed L2/ L3 Gigabit Switch Kontron VX3910, with its 20x Gigabit ports to the backplane, offers the highest port density for the implementation of various network topologies in 3U appliances. Four additional 2.5 Gigabit ports to the backplane simplify a redundant system architecture with multiple switches with no single point of failure. The VX3910 is available in an aircooled version for ambient temperatures from 0° to +55°C and in a rugged conduction-cooled version for the extended temperature range from -40° to + 85°C.

Intel-based Rugged Server-Class Board Targets ISR Apps

Mercury Computer Systems offers the Intel-based Ensemble HDS6600 High Density Server for rugged deployed ISR systems.

With dual quad-core Intel Xeon enterprise server-class processors in a standard 1-inch OpenVPX slot, a 10-board system reaches over 1 Tflops of peak performance. Mercury’s Protocol Offload Engine Technology (POET) on the board encapsulates standards-based protocol management, such as Serial RapidIO and PCIe, with high-speed real-time switching capability. The large 12 Gbytes of onboard SDRAM memory is well balanced for the 8 Intel Xeon cores, and represents a 4X increase over previous generation module memory size.

Mercury Computer Systems, Chelmsford, MA. (866) 627-6951. [www.mc.com].

Kontron America, Poway, CA. (858) 677-0877. [www.kontron.com].

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1/18/11Journal 10:38:54 AM ] January 2011 COTS [ 23

Special Feature

6U, OpenVPX I/O Card for Multifunction I/O and Serial Comms

A single-slot, OpenVPX, 6U, multifunction I/O and serial communications card supporting VME, Gigabit Ethernet and Serial RapidIO (sRIO) or PCI Express (PCIe) control interface options enables users to take advantage of the higher speed, switched fabric communication architectures, offering significantly greater capability. The 67C3 from North Atlantic Industries contains six independent module slots, each of which can be populated with a function-specific module and can now be controlled by VME, dual Gigabit Ethernet and sRIO or PCIe. The 67C3 is available with an operating temperature range of -40° to +85°C. Pricing for a rugged, conductioncooled 67C3, configured with 96 programmable 0 to 60V discrete channels, starts at $9,982 in quantities of 100 or more.

North Atlantic Industries, Bohemia, NY. (631) 567-1100. [www.naii.com].

VPX Board Family Packages Virtex-6 FPGAs for Mil Apps

Pentek’s 53xxx Cobalt board family incorporates Xilinx’s Virtex-6 FPGAs for onboard signal processing, delivering digital sampling rates to 1 GHz in a compact 3U VPX form factor. With more than twice the resources of previous Virtex generations, including new enhancements in digital signal processing, logic and clocking, the Virtex-6 family provides developers with a previously unavailable level of customizable processing power. All Cobalt VPX products are available with a choice of Xilinx Virtex-6 LXT or SXT FPGA devices to match the application. Other common features of Cobalt boards include PCI Express (Gen 2) interfaces up to 8 lanes wide, synchronous clocking locked to an external system reference, and an LVPECL synch bus for synchronizing multiple modules to increase channel count.

Pentek, Upper Saddle River, NJ. (201) 818-5900. [www.pentek.com].

[ 24Untitled-9 ] COTS1Journal January 2011

1/11/11 11:42:12 AM

Special Feature

3U OpenVPX Backplane Supports Board-Agnostic System Designs

SIE Computing Solutions has a new 3U OpenVPX backplane designed for board-agnostic system design and integration. Designed to form a flexible standard design that allows for multiple vendor boards and other system components without sacrificing interoperability, SIE’s new OpenVPX backplane is a centralized 6-slot design that provides maximum flexibility for both customization and varied standardization between OpenVPX profiles. Based on a ratified profile that addresses the centralized switching topology, the new backplane is a core design foundation developed to meet the requirements of multiple designs with minimal adjustments for customers. The 3U OpenVPX backplane uses the BKP3-CEN06-15.2.2-3 profile ratified by VITA 65 and is available now. The highly configurable backplane offers maximum bandwidth in a compact size.

SIE Computing Solutions, Brockton, MA. (800) 926-8722. [www.sie-computing.com].

Pre-Integrated Payload Solution Serves up 3U VPX

Themis Computer’s Mission and Payload Systems Initiative (MPSI) is aimed at providing integrated system solutions focused on specific market platforms. The MPSI target applications include UAV Sensor Processors, Data Processing and Recording Units, Mission Computers, Display Processors and EW/ SIGINT Suite Controllers for new platforms as well as platform upgrades. The new Themis hardware includes both a 5-slot conductioncooled chassis, as well as an 8-slot ½ ATR conduction-cooled chassis with Universal Cooling and Configuration Options. Complementing Themis’ 3U VPX rugged chassis products are an Intel Core i7-based Single Board Computer, an ATI E4690-based GPGPU, an 8 channel SATA / SAS RAID Controller with PMC/ XMC mezzanine site, and a generalpurpose PMC/XMC carrier card for miscellaneous I/O.

Themis Computer, Fremont, CA. (510) 252-0870. [www.themis.com].

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1/12/11 3:43:58 PM ] January 2011 COTS Journal [ 25

MERCURY COMPUTER SYSTEMS

PHONE: +1(866)627-6951 WEB: www.mc.com

Ensemble 6000 OpenVPX Intel® Core i7 LDS6521 Low Density Server

Ensemble 3000 OpenVPX Intel® Core i7 SBC3510 Single Board Computer

The Ensemble™ 6000 Series OpenVPX Intel® Core i7 Quad-Core Next Generation LDS6521 Module combines a powerful Sandy Bridge mobile-class quadcore Intel® 2nd Generation Core i7 processor, a highperformance FPGA for both fabric bridging and user-application functions, and high-bandwidth on-board and off-board communication fabrics in a single 6U OpenVPX slot.

The Ensemble™ 3000 Series OpenVPX Intel® Core i7 Next Generation SBC3510 Single-Board Computer brings the disruptive compute technology of the Sandy Bridge mobile-class processor to 3U OpenVPX™ subsystems. Designed with command-and-control applications in mind, the SBC3510 combines the processing capabilities of the 2nd Generation Core i7 processor with significant I/O capabilities.

The LDS6521, as Mercury’s next low-density server, provides a nextgeneration architecture that balances the disruptive computational capabilities of the Intel 2nd Generation Core i7 processor with key highbandwidth I/O interfaces, providing a powerful and scalable computing architecture that is well aligned with high-end radar, electronic warfare, and image processing applications.

With both built-in I/O and the flexibility of an on-board PMC/ XMC mezzanine site, the SBC3510 is uniquely suited to meeting the intense size, weight, and power (SWaP) constraints of the C2/C3 and Active EW application space, as well as commercial applications such as geophysical exploration and in-field scientific data collection.

Benefits: • New low-density server delivers next-generation processing and fabric capabilities • 6U OpenVPX™-compliant VITA 65/46/48 (VPX-REDI) module • Intel® 2nd Generation Core i7 (Sandy Bridge mobile-class) quad-core processor at up to 2.1 GHz with 134 GFLOPS peak performance • POET™-enabled for Gen 2 serial RapidIO® and/or 10 Gigabit Ethernet fabric • Integrated Gen 2 80-lane PCIe switching infrastructure for on-board and off-board co-processing expansion-plane communications • Mercury MultiCore Plus® software infrastructure support

Mercury Computer Systems provides embedded computing systems and software that combine image, signal, and sensor processing with information management for data-intensive applications. Mercury serves a broad range of industries that include aerospace and defense, homeland security, telecommunications, and other computationally challenging markets.

Benefits: • I/O optimized SBC-class processing for 3U OpenVPX systems • 3U OpenVPX™-compliant VITA 65/46/48 (VPX-REDI) module • Intel® 2nd Generation Core i7 (Sandy Bridge mobile-class) dual-core processor at up to 2.2 GHz • PMC/XMC mezzanine site for expansion • Built-in SBC-class I/O subsystems • Rugged versions for harsh environments

Special Feature OpenVPX Readies for Prime time

Hurdles Fall for Doing Intel x86 DSP on OpenVPX Enhanced vector graphics and Serial RapidIO support are opening the way for Intel processing to meet military embedded DSP needs.

Ian Stalker, DSP Product Manager Curtiss-Wright Controls Embedded Computing

W

ith Intel’s introduction this month of its new Intel Core i72715QE next-generation quadcore processor, the design of x86-based embedded military digital signal processing (DSP) systems takes a great leap forward. The new processor, which is faster and more power efficient than its previous generation, also features the new 256-bit wide Intel Advanced Vector Extensions (AVX) floating-point instructions (Figure 1). DSP algorithms rely heavily on the throughput of vector instructions and so will benefit greatly. Before the introduction of Intel AVX, vectorized signal processing functions have been limited to 128 bits.

Of equal interest to signal processing system designers is the fact that with this platform, Serial RapidIO (S-RIO), the preferred fabric for the types of processorto-processor communications required by demanding DSP systems, is now for the first time, supported, thanks to IDT’s upcoming PCIe Gen2 to S-RIO Gen2 protocol conversion bridging semiconductor products. This brings S-RIO, the fabric of choice, well supported by the OpenVPX/ VITA 65 standard, to Intel-based open architecture system designs.

Now the latest x86 processor can be [ 28 ] COTS Journal January 2011

used in a RapidIO-based network, supporting reliable packet transmission, any architecture, while also delivering low and predictable latencies and providing the benefits of RapidIO messaging, which are ideal for large peer to peer clusters of processors used in complex signal processing applications.

The DSP Sweet Spot For embedded DSP designers, Intel’s most recent micro-architecture (code named micro-architecture Sandy Bridge) further establishes the x86 architecture as the leading candidate for the most demanding compute intensive multiprocessor systems. The Intel quad-core processor boasts numerous micro-architecture enhancements and design features over Intel’s previous processors. For example, the new processor is faster at the same clock speeds as earlier processors, because of its more sophisticated caching and branch prediction. This platform also delivers quad-core processing with power levels that match the stringent requirements of rugged embedded military environments: 4 cores at 45W. But the single greatest improvement for DSP system performance delivered

by Intel’s latest platform is the new AVX processing unit. In recent years Intel has

Figure 1

The new Intel Core i7-2715QE quad-core processor marries x86-based embedded military digital signal processing with the new 256-bit wide Intel Advanced Vector Extensions (AVX) floating-point instructions.

demonstrated its ongoing commitment to high-performance vectorized processing by investing in continual enhancements to AVX’s predecessor, Intel Streaming

Special Feature

SIMD Extensions (Intel SSE), a 128-bit wide processing unit capable of simultaneously operating on four 32-bit floatingpoint values. Intel SSE also featured support for double-precision floating point, a feature that was not available in AltiVec. In Intel’s multicore processors each core was given its own SSE unit, so the raw floating-point performance scaled with the number of cores. In the new platform Intel has upgraded the SSE approach with AVX, doubling the size to 256 bits wide.

This doubling of vector processing performance is a significant milestone in DSP system design. DSP algorithms used in critical military applications such as radar, SIGINT and image processing, depend on the precision achieved with floating point numbers along with speed of processing (Figure 2). The new Intel Core i7 effectively doubles that performance over previous approaches. For typical size 1D and 2D FFTs, the improvement gained by AVX is in the 1.5 to 2X range (approx) over SSE. The AVX instruction set was designed to support future extensions, which hints at wider implementations in the future.

Serial RapidIO for Data Movement Further helping to establish Intel as the ideal platform for DSP applications is the addition of S-RIO support. For embedded and high-performance applications, S-RIO as of yet has no peer when it comes to multiprocessor system processor-to-processor communications. But prior to this generation of Core i7, there was no support for S-RIO for Intel platforms, which of course limited the viability of Intel architecture’s use in DSP multiprocessor systems. Solutions have been available to support InfiniBand, which is popular in the cluster computing world but is not embraced in military applications, and for Gigabit Ethernet. For single board computers, where the requirement is typically a single processor communicating with I/O, these fabrics have been sufficient. The lack of support for S-RIO though deprived would-be Intelbased DSP system designers of the ability to select the multiprocessor fabric of choice.

IDT’s upcoming PCI Express (PCIe) Gen2 to S-RIO gen2 bridge provides the first solution for S-RIO support on Intel-based

Intel Advanced Vector Extension (AVX) 256-bit vector extension to SSE for FP intensive applications

KEY FEATURES Wider Vectors Increased from 128 bit to 256 bit

Enhanced Data Rearrangement Use the new 256 bit primitives to broadcast, mask loads and do data permutes

Three Operand, Non Destructive Syntax Designed for efficiency and future extensibility

BENEFITS Up to 2x peak FLOPs output

Organize, access and pull only necessary data more quickly and efficiently Fewer register copies, better register use, more opportunities for parallel loads and compute operations, smaller code size

Figure 2

DSP algorithms used in military applications such as radar, SIGINT and image processing, depend on the precision achieved with floating-point numbers along with speed of processing.

Intel has upgraded the SSE approach with AVX, doubling the size to 256-bits wide.

platforms. The new S-RIO Gen2 switches provide 3X the aggregate bandwidth and are twice as fast as the earlier RapidIO 1.3-based switches per port. Signaling rates increase from 3.125 Gbit/s to Gen2’s 6.25 Gbit/s for switch ports, resulting in 20 Gbit/s per second per port in the switch fabric. IDT’s bridge will provide a mapping from PCIe Gen2 into this S-RIO Gen2-based switch on board and into the backplane.

Better Than FPGAs IDT’s bridge will support the two main S-RIO transfer modes, memorymapped transfers and S-RIO messaging. SRIO bridges implemented in FPGAs don’t support high-performance messaging, a feature which directly maps to higher level software APIs such as MPI. Another plus offered by the IDT silicon is the inclusion of DMA engines that speed computation while off-loading the host processor. Intel processors typically don’t have DMA engines on-chip, but depend instead on the peripheral chip to move data.

Without a DMA engine, moving data can require a large amount of the host pro-

cessor’s attention, with the result that a multicore processor might have one of its cores (and associated power) largely consumed by moving data, which is all the more burdensome because it has to be done in code.

IDT’s bridge is physically much smaller and lower power than today’s 10 Gigabit Ethernet (10GbE) alternatives, (while being 1.6x faster), which is great for SWaP-constrained systems. For inthe-box processor to processor connections, 10 Gbit Ethernet is over-featured, making both the controller and switch chips larger and slower than the equivalent S-RIO devices. Moreover in a 10GbE network, reliable end to end packet transmissions with reliable transport could take several milliseconds.

Space-Constrained Military Systems Another advantage of S-RIO for space-constrained military systems is the ability to support all topologies including either distributed switch, or centralized switch architectures. Distributed switch systems (an example is the VITA 65 January 2011 COTS Journal [ 29 ]

Special Feature

Figure 3

The CHAMP-AV8 is the first rugged OpenVPX DSP engine based on the Intel Core i7-2715QE. It also supports IDT’s upcoming Gen2 PCIe-to-Serial RapidIO protocol conversion bridge.

BPK6-CEN05-11.2.5-n backplane profile) make use of the local S-RIO switch and thus avoid the need for a separate switch card. For example, if the system was using a ½ ATR Short enclosure (four 1-inch slots), this capability saves 25 percent of the space and a considerable amount of power. For large systems, centralized

switch architectures are often preferred, and S-RIO is equally adept at this approach. Many leading vendors offer SRIO switch card solutions.

An example of a high-performance DSP engine designed to take full advantage of the latest offering for Intel’sCore i7 is the new CHAMP-AV8 (Figure 3) from Cur-

tiss-Wright Controls Embedded Computing. The CHAMP-AV8 is the first rugged, high-performance OpenVPX DSP (digital signal processing) engine based on the Intel Core i7-2715QE. It also supports IDT’s upcoming Gen2 PCIe-to-S-RIO protocol conversion bridge. The rugged CHAMPAV8 pair of quad-core processors delivers performance, rated at up to 269 GFLOPS. With IDT’s bridge chip, the CHAMP-AV8 supports Gen2 S-RIO and Gen2 PCIe interfaces, which enables it to deliver triple the bandwidth of first generation VPX products with up to 240 Gbits/s of fabric performance, thus ensuring that application performance can scale commensurately with the much higher CPU performance.

Curtiss-Wright Controls Embedded Computing Ashburn, VA. (703) 779-7800. [www.cwcembedded.com].

Bricks-On-A-Plate™ Quick, Rugged, Flexible Power Solutions Field proven component power • Save valuable engineering time • Risk mitigation • Reduce cost • Improve time to market Vicor's "Bricks-On-A-Plate" power solution offers unique configuration flexibility, high power density, high reliability, and quick time to market at prices not usually found in custom solutions. Vicor's unique mass-customization capability allows you to choose from thousands of power modules and filter options.

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[ 30Untitled-5 ] COTS1Journal January 2011

4/15/10 3:53:09 PM

PELICAN

THE DEPARTMENT OF DEFENSE

PELICAN-HARDIGG

ADVANCED CASE SOLUTIONS

TM

Custom cases created by Pelican-Hardigg Advanced Case Solutions™ (ACS) provide Mission Critical confidence using a four-stage process of analysis, design, testing and manufacturing. From technical prototypes to sensitive military electronics – ACS has the experience and resources to guarantee performance. When failure is not an option, an Authentic ACS solution is the answer.

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TM

PENTEK, INC.

PHONE: (201) 818-5900 WEB: http://pentek.com/go/cotsspl

Cobalt 53621: 3U VPX with A/Ds and Virtex-6 FPGAs

Cobalt 53690: 3U VPX with L-Band Tuner, A/Ds, and Virtex-6 FPGAs

Model 53621 COTS and rugged

Model 53690 COTS and rugged

Model 53621 is a member of Pentek’s CobaltTM family of high performance 3U VPX boards based on the Xilinx Virtex-6 FPGA. A multichannel, highspeed data converter with three programmable DDCs, it is suitable for connection to HF or IF ports of a communications or radar system. Its built-in data capture and playback features provide a turnkey solution. It includes three A/Ds, one upconverter, two D/As and four banks of memory.

It features built-in support for PCI Express over the 3U VPX backplane.

Model 53690 is a member of the CobaltTM family of high performance 3U VPX boards based on the Xilinx Virtex-6 FPGA. A dual-channel, highspeed data converter, it is suitable for connection directly to the RF port of a communications or radar system. Its built-in data capture features offer an ideal turnkey solution as well as a platform for developing and deploying custom FPGA processing IP. The Model 53690 includes an L-Band RF tuner, two A/Ds, and four banks of memory. It features built-in support for PCI Express over the 3U VPX backplane.

Each DDC has an independent 32-bit tuning frequency setting that ranges from DC to the A/D sampling frequency. Each DDC can have its own unique decimation setting, supporting as many as three different output bandwidths from the board. Decimations can be programmed from 2 to 65,536 providing a wide range to satisfy most applications.

In addition to the DDCs, the 53621 features a complete beamforming subsystem. Each DDC core contains programmable phase and gain adjustments followed by a power meter that continuously measures the individual average power output.

A front panel connector accepts L-Band signals between 925 MHz and 2175 MHz from an antenna low noise block. A Maxim MAX2112 tuner directly converts these L-Band signals to baseband using a broadband downconverter.

The device includes an RF variable-gain low noise amplifier, a phaselocked loop, synthesized local oscillator, downconverting mixers, baseband lowpass filters with programmable cutoff frequencies, and variable-gain baseband amplifiers.

The factory-installed functions also include a sophisticated D/A Waveform Playback module. Up to 64 individual entries can be chained together to create complex waveforms with little programming.

The analog baseband tuner outputs are then applied to two Texas Instruments ADS5485 200 MHz, 16-bit A/D converters. The digital outputs are delivered into the Virtex-6 FPGA for data capture, signal processing, or for routing to other board resources.

Product URL: http://pentek.com/go/cots53621

Product URL: http://pentek.com/go/cots53690

Founded in 1986, Pentek is the premier source for digital signal processing, data acquisition and software radio products. Our customers enjoy the performance and flexibility afforded by our board- and system-level product lines and our world-class applications support.

An ISO 9001:2008 certified manufacturer, Pentek offers COTS and rugged VME, VXS, VPX, PCIe, XMC, PMC, cPCI, and PCI products for data acquisition, software radio and digital signal processing. Our products feature Freescale PowerPCs, Texas Instruments DSPs, and the latest Xilinx Virtex-6 FPGAs. The Pentek data acquisition line is extensive and includes A/Ds, D/As, Software Radio, Synthesized Clocks, and Recording Systems.

Setting the Standard for Digital Signal Processing

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Tech Recon Major DoD Programs Overview

Major Defense Programs Boost Their Appetite for Electronics The 2011 Defense budget puts an ever increasing emphasis on cost-effectiveness.

Technology upgrades to existing platforms and an overall network-centric push dominate this year’s plans.

Jeff Child, Editor-in-Chief

C

oming in late December, the U.S. Congress approval of the 2011 Defense Authorization bill puts a budget in place for the DoD allowing the Pentagon to spend $725 billion in fiscal 2011. Within that, approximately $80.0 billion is for programs that have been designated as Major Defense Acquisition Programs (MDAP). Packed with a host of provisions, the bill puts a lot of emphasis on management of costly programs. For example, it calls for analysis of extending the life of the F/A-18 aircraft in response to the troubles of the F-35 program. Other costly programs like the Expeditionary Fighting Vehicle are also on the verge of getting axed according to recent reports.

Figure 1 shows a breakdown of how major program funding is being allocated.

The major categories within the MDAP umbrella include: Aircraft, C4 (Command, Control, Communications and Computer Systems), Munitions/Missiles, Shipbuilding/Maritime Systems, Ground Programs, Missile Defense and Space Based and Related Systems.

Aircraft Major Programs Aircraft funding has continued to increase to support the procurement of air[ 34 ] COTS Journal January 2011

craft such as the F-35 Joint Strike Fighter, the V-22, and the Navy’s F/A-18 E/F and E/A-18G. But the F-35 continues to be under the Congressional microscope. As Figure 2 shows, a significant investment continues in UAV development, but even more investment is being made in upgrading existing manned aircraft. In terms of heavy use of advanced electronics, notable programs like the E-2D Advanced Hawkeye continue. The E-2D provides a two-generational leap in radar technology, and will provide the long range air and surface picture; theater air and missile defense, and is a key component of Naval Integrated Fire Control-Counter Air (NIFC-CA).

Meanwhile the Predator and Reaper (Figure 3) Unmanned Aerial Systems (UASs) are packed with electronics. Platforms consist of an array of sensors to include day/night Full Motion Video, Signals Intelligence (SIGINT) and Synthetic Aperture Radar (SAR) sensor payload, avionics and data links; a ground segment consisting of a Launch and Recovery Element (LRE), and a Mission Control Element with embedded ground communications equipment; a support element; and trained personnel. The Army Extend Range Multi-Purpose (ERMP) Predator MQ-1 is being developed with a 2.0L

heavy fuel engine; whereas the Air Force Predator MQ-1 has an aviation fuel piston engine and the Air Force Reaper MQ-9 has a turboprop engine.

Major Ground Programs With the cancellation of the Army’s Future Combat Systems program, the DoD ground vehicle plans have been thoroughly shaken up. The DoD is modernizing its ground force capabilities to ensure the United States remains a dominant force capable of operating in all environments across the full spectrum of conflict.

They are also modernizing their tactical wheeled vehicle fleets by replacing older vehicles with new procurement. Some of the existing programs targeted for upgrades include howitzers, Stryker vehicles, M1 Abrams, Bradley Fighting Vehicle and the Light Armored Vehicle (LAV).

The Army is focused on developing a Ground Combat Vehicle (GCV) that builds a versatile platform and includes the experiences of combat operations and the incremental modernization of brigades. The Marine Corps has been developing the Expeditionary Fighting Vehicle (EFV). The EFV is an amphibious armored vehicle that represents the Marine Corps primary means of tactical mobility during amphibious operations and subse-

Tech Recon

quent ground combat operations ashore.

The EFV’s future is in question, however, as talk of cutting this problem-fraught program has emerged recently. Figure 4 shows a breakdown of Ground Vehicle funding.

Shipbuilding and Maritime Systems The Navy’s Shipbuilding Portfolio details programs that ensure the overall maritime mission is accomplished.

The Shipbuilding Portfolio consists of bought, built and maintained systems, subsystems, and components. The Navy’s 313-ship fleet will allow the U.S. to maintain maritime superiority well into the 21st century. Notable provisions in the Congress’s Defense Authorization Bill include questions over whether sea-based missile defense can be accommodated by upgrading 13 Aegis ships that exist or by procuring additional combatant surface vessels.

The active CVN 21 carriers in the Navy’s fleet are scheduled to get new technologies such as an integrated topside island with a new multifunction radar, a new propulsion plant, monitoring improvements, manpower reduction technologies, flight deck enhancements, Electromagnetic Aircraft Launching System (EMALS) and advanced arresting gear.

Meanwhile the budget funds the CVN 78 fourth year of incremental funding, the CVN 79 advance procurement long leadtime items, and the CVN 79 advance construction labor for modular assemblies.

Also of note, Lockheed Martin and Austal USA received contracts Dec. 29 to build more Littoral Combat Ships (LCS) for the U.S. Navy, which will probably mean each company will build 10 more of the fast, small warships over the next eight years. The LCS will be the first Navy ship to separate capability from hull form. For example, it will be capable of employing interchangeable mission modules for Mine Warfare, Anti-Submarine Warfare and Anti-Surface Warfare to counter anti-access threats close to shore such as mines, quiet diesel submarines and swarming small boats. The LCS mission modules will be exchanged as operational conditions warrant. Figure 5 shows

Science and Technology $11.8

Aircraft $55.4

Mission Support $55.2

C4 Systems $11.1 Space Based and Related Systems $9.9 Shipbuilding and Maritime Systems $25.1

Figure 1

Ground Programs $23.3 Munitions and Missiles $12.9

Missile Defense $9.9 ($ in Billions)

DoD FY 2011 Major Program categories.

Figure 2

The MQ-9 Reaper UAV exemplifies the kind of military platform demanding powerful, compact embedded computing gear. a breakdown of shipbuilding and maritime systems.

Command, Control, Communications and Computer Systems (C4) The category making the most significant use of embedded computing and

electronics is C4 (Command, Control, Communications and Computer Systems). The DoD is transforming and developing new concepts for the conduct of future joint military operations. This network-based interconnectivity increases the operational effectiveness by assuring access to the best possible information January 2011 COTS Journal [ 35 ]

Tech Recon

Aircraft Support $4.2

Aircraft Modifications $15.8

Cargo Aircraft $12.8

Unmanned Aerial Vehicle $4.1 Technology Development $4.5

Figure 3

Combat Aircraft $10.3 Support Aircraft $3.7

($ in Billions)

DoD FY 2011 Major aircraft program funding.

Weapons $1.0

Combat Vehicles $2.6

($ in Billions) Heavy Tactical Vehicles $4.4

(JTRS) program encompasses ground, airborne, vehicular, maritime and small form factor variants of the radio hardware; 17 Increment 1 waveforms for porting into the JTRS hardware; and network management applications. All JTRS products are being developed in a joint environment, enhancing hardware and software commonality and reusability.

FY 2011 plans for JTRS include funding the design, development and manufacture of JTRS engineering development models (EDMs) and low rate initial production (LRIP), to include hardware and software, as well as sustainment of fielded radios and certified waveforms.

Although the Future Combat System (FCS) was cancelled, the Army is leveraging its technologies by accelerating the incremental fielding of capabilities to all BCTs by 2025. Increment 1will field a network of sensors, precision munitions, unmanned ground and aerial vehicles to nine Infantry Brigade Combat Teams (IBCTs). Increment 2 will provide further advances in the network and an increased lethality for the remaining IBCTs. Heavy and Stryker BCTs will be included in later increments. The 2011 plan calls for procurement of two Increment 1 IBCT sets.

RDTE provides for testing and support of Increment 1 and the development of Increment 2 capabilities to include the Armed Robotic Vehicle- Light (ARV-L), the Common Controller (CC) and further advances in the Network.

WIN-T Rolls Forward Support Equipment $12.1

Figure 4

Light Tactical Vehicles $1.5 Medium Tactical Vehicles $1.6

DoD FY 2011 Major ground systems funding. by decision makers at all levels, thus allowing dispersed forces to communicate, maneuver, share a common user-defined operating picture, and successfully complete assigned missions more efficiently.

Net-centricity is a services-based archi[ 36 ] COTS Journal January 2011

tecture pattern for information sharing.

The three major programs here include JTRS, BCT Modernization and WIN-T. Figure 6 shows a general breakdown of funding areas.

The Joint Tactical Radio System

Meanwhile, the Warfighter Information Network – Tactical (WIN-T) is the Army’s on-the-move, high-speed, high-capability backbone communications network, linking warfighters in the battlefield with the Global Information Grid (GIG). This network is intended to provide C4ISR support capabilities. The system is being developed as a network for reliable, secure and seamless video, data, imagery and voice services for the warfighters in the theater to enable decisive combat actions.

The WIN-T program consists of four increments. Last spring the Army awarded General Dynamics C4 Systems a $164 million contract that will enable a

Tech Recon

Technology Development $2.7

Outfitting and Post Delivery $0.3

($ in Billions)

N O I S S MI TICAL C R IVoutfitting ES C I D E technology

Submarine Combatant $6.4

surface

DC-DC support2 Converters support AC-DC Power submarine Supplies

Support $2.6

Surface Combatant $12.3

Support Ships $0.8

Figure 5

DoD FY 2011 Major Shipbuilding and Maritime funding.

Information Security and Assurance $0.9

Technology Development $0.6

• Expanded Operating

Base Communications $0.1

Temperatures -55 to +85C • Vibration, Method 204, Cond. D • Shock, Method 213, Cond. I • Altitude, Method 105, Cond. D • Environmental Screening • Specification Review • Custom Models Available • 400 Hz and Now 800 Hz AC-DC Models

Automation $0.3

Theater Combat C3 & Services $9.1

ard s of Stand Thousand DC to 10,000 V Models 2V 00 Watts 0.75 to 2,0 ts u tp u O

Figure 6

DoD FY 2011 Major Command, Control, Communications and Computer Systems (C4) program funding.

General Dynamics-led team to begin lowrate initial production of the Warfighter Information Network – Tactical (WINT) Increment 2. Increment 2 will equip vehicles with on-the-move broadband communications enabling command and control from anywhere in the battlespace.

The 2011 plan calls for WIN-T Inc 1 procurement and continues to field to the

Army, with a Ka satellite upgrade, and for WIN-T Inc 2 entering into LRIP in anticipation of its Initial Operational Test in FY 2012. WIN-T Inc 3 continues in its System Development and Demonstration (SDD) phase to deliver the full networking on the move, including the airborne tier of the program.

PICO

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January 2011 COTS Journal [ 37 ] Untitled-5 1

12/8/10 1:39:12 PM

KONTRON

PHONE: +1 (888) 294-4558 WEB: www.kontron.com

VX3830 - 3U VPX FMC Carrier.

VX3830 implements a VITA57 FPGA Mezzanine Card (FMC) slot.

VX6060 - 6U VPX Dual Intel® Core™ i7 Single Board Computer

To implement custom interfaces using the Kontron VPX FMC Carrier VX3830, designers can develop IP using Xilinx tools and design a specific FMC. The FPGA image is loaded from a flash on the VX3830 or on the FMC. A rescue FLASH is also present to ease developments and secure deployments.

The Kontron VX6060 is the right answer for rugged applications where the power envelope and dissipation constraints at extreme temperature prohibit the use of quad core silicon. Implemented as two independent computing nodes, attached to a powerful Ethernet and PCIe infrastructure, the Kontron VX6060 is the ideal building block for intensive parallel computing loads. VX6060 supports VXfabric™, a set of turn-key APIs for data flow applications to implement efficient inter-boards communication at hardware speed. Although based on PCIe technology, vxfabric™ offers the ubiquitous socket API to protect customer investment over the expected future of hi speed communication technologies for bulk data transfers on VPX backplanes.

The Kontron VX3830 features a Xilinx® Virtex®-5 FPGA (XC5VLX20T) implementing a PCIe endpoint and User I/Os. VX3830 connects its FPGA endpoint to the backplane through a x4 PCIe gen 2 channel (P1 Wafers 1 to 4 is default build option). Selection between x4 or x1 PCIe width is user configurable. VX3830, which requires +5V and +12V power supply rails, is available as a Convection Cooled or Conduction Cooled 3U VPX payload board and can be pared with the VPX processor boards, VX3020 and VX3230.

Kontron also offers a development kit containing a FMC-SER0, a sample FMC with wrapping areas, a simple FPGA IP and a Linux rpm with drivers, utilities and test programs. This kit allows non regression tests and is the base for customized derivative work.

Kontron, the global leader of embedded computing technology, designs and manufactures embedded and communications standards-based, rugged COTS and custom solutions for OEMs, systems integrators, and application providers. Kontron engineering and manufacturing facilities, located throughout Europe, Americas, and Asia-Pacific, work together with streamlined global sales and support services to help customers reduce their time-to-market and gain a competitive advantage. Kontron’s diverse product portfolio includes: boards and mezzanines, Computer-on-Modules, HMIs and displays, systems, and custom capabilities. Kontron is a Premier member of Intel® Embedded Alliance. For more information, please visit: www.kontron.com

Any number of VX6060’s can be used together in centralized or distributed VPX environments.

The Kontron VX6060 features two Intel® Core™ i7 processors with an integrated DDR3 Memory Controller. The VX6060 is available in air- and conduction-cooled versions and is compliant to VITA46 (VPX), VITA65 (OpenVPX) and VITA48 (VPX REDI). Withstanding the harshest environments, the rugged conduction-cooled version (operating temperature from -40° to +85°C) remains under 100W power dissipation.

To get a quick start with VPX, the Kontron EZ2-VX6060 turnkey evaluation and development system helps to speed time to market and easy implementation of the Kontron VX6060.

Copyright © 2011 Kontron AG. All rights reserved. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized. Rev. # D108us02

» Where can I find a single source for my embedded computing project? « Kontron is your single source for COTS products and specialized systems designs built to meet the most demanding requirements.

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System Development 10 Gbit Ethernet Opens New Opportunities

Ethernet Becomes Entrenched as Military System Interconnect Offering a great mix of legacy compatibility and steady upgrade path, Ethernet continues to capture mindshare acceptance in the military as more and more programs look to Ethernet for both networking and fabric interconnect needs.

Jeff Child, Editor-in-Chief

E

Dynamics C4 Systems for a quantity of GE’s rugged NETernity 3U CompactPCI CP923RC-M Ethernet Switches. The switches will be used as the communications hub for command and control systems deployed as part of the U.S. Army’s Brigade Combat Team Modernization (BCTM) program (Figure 1). The technology provides fast, reliable data interchange between computing subsystems on a range of vehicles including unmanned air and ground vehicles. BCTM is the U.S. Army’s principal modernization program.

thernet is becoming entrenched as a favorite interconnect fabric in compute-intensive applications like sonar, radar or any application that networks sensor arrays together. System designers are reaping the benefits from the marriage of Ethernet with embedded d computing form factors like OpenVPX, VXS, Compact PCI Express, MicroTCA and AMC. While once used only as a pure networking solution for command and control systems in the military, Ethernet is now gaining nies providing solutions nowtraction in numerous other military applications as an interconnect Rugged Ethernet Solution ion into products, technologies and companies.

Whether your goal is to research the latest ation Engineer, or jumpinto compute-intensive a company's technical page, the goal of Get Connected to put you CP923RC-M 10-port fabric applications.

The isNETernity you require It’s for whatever type of technology, also deployed as multilayer switches fully managed layer 2/3 Gigabit Etherand products you are searching for. with dual IPv4 and IPv6 forwarding to net switch is designed to be deployed on www.cotsjournalonline.com/getconnected support the DoD’s sweeping plans to le- platforms that are subject to extremes of verage the benefits of IPv6 (Internet Pro- temperature, moisture, dust/sand and tocol version 6). vibration, making it ideal for demandThe number of programs embrac- ing applications in harsh environments. ing Ethernet—including both upgrades The CP923RC-M features support for and new advanced systems—continues IPv6, the Internet Protocol that will be at to ramp upward. In a recent example, last the heart of networks of the future with fall GE Intelligent Platforms received the its much larger addressing capability— first in a series of orders from General making it “future proof”—together with capabilities that greatly simplify network administration.

Get Connected Also making use of Ethernet is the with companies mentioned in this article.

NATO MEADS (Medium Extended Air www.cotsjournalonline.com/getconnected

ploration your goal k directly age, the source. nology, d products

End of Article

[ 42 ] COTS Journal January 2011

Figure 1

Network gear for the BCT Modernization program is tested by soldiers at White Sands Missile Range.

Defense System) program. Lockheed Martin Space Systems has specified the Parvus DuraNET 3825, a ruggedized version of Cisco Systems’ 3825 Integrated Services Router (ISR), to provide the network connectivity for the MEADS Tactical Operations Center. Parvus has shipped initial quantities to Lockheed and other NATO partners. Under development by Germany, Italy and the United States, MEADS is a mobile system that will replace Patriot in the United States and Nike Hercules in Italy. It will replace Hawk and Patriot systems in Germany.

The system is designed to permit full interoperability between the U.S. and allied armies, and it is the only medium-range

ELMA ELECTRONIC

PHONE: (510) 656-3400 WEB: www.elma.com

6U VPX 10-Gigabit Ethernet Switch

2-slot 3U / 6U OpenVPX Development Platform

Elma’s T4340a is built on the latest generation of Gigabit switch engine and PHY transceiver. Its highly integrated chip a full layer 3 router provides optimized power consumption. The T4340a supports full-wire speed L2 bridging and L3 IPV4/V6 Unicast and Multicast routing with L2L4 advanced traffic classification, filtering and prioritization. For instance, it can provide strict priority traffic and filtering needed for delay-sensitive or critical applications.

• 2-slot test & development platform for 3U and 6U VPX and OpenVPX™ boards.

• Supports the use of both 3U and 6U cards (3U supported by use of a shelf divider).

• 1.6 slot pitch allows use of probes on surface of VPX card under test.

• J1 A Channel broken out to 16 SMA connectors • J1 B, C and D Channels broken out to four SATA2 cable headers each (12 total/slot).

• J0, J2 thru J6 connectors still accessible by a standard RTM module.

• Allows use of standard VPX RTM module while simultaneously accessing high speed signals in the J1connector.

• Built in Voltage Monitor with green LEDs for bus voltages compliance • 580 Watts total available power • High performance cooling via three 12V fans with tach output rated at 52 CFM each • Mechanical dimensions: 16.29”H x 9.71”W x 13.24”D • Aluminum construction with scratch-resistant black painted finish • Top handle for ease of portability desktop feet on bottom • More than two VPX modules may be interconnected by using additional 2-slot test backplanes

The T4340a 10-Gigabit VPX Ethernet Switch complies with VITA 46.20 standard, with the following configuration: • Twenty four 1000KX compliant ports are routed on rear I/O (P2 & P3) • Two 10-GKX4 ports are available on P1 rear connector • Two 10-Gigabit ports are available on the front panel (XAUI/10GB-CX4) Alternatively, up to sixteen 1000KX ports can be configured in 1000BT mode and routed on P5 & P6. Four 1Gb rear ports can be made available on the front panel (four 1000SX/LX fiber channels or four 1000BT copper ports).

The T4340a can be be easily managed and monitored from a browser, a CLI or SNMP. A comprehensive Built-in Test simplifies the maintenance.

Many additional functions are provided on this fully managed switch; for details, please visit our website or contact us for further details.

The System Platform group of Elma Electronic Inc. manufactures embedded electronic packaging, boards, and subsystems. Elma’s rugged chassis platforms meet the EMI/RFI requirements for MIL-STD-461D, and shock and vibration according to MIL-STD-167, MIL-STD-810F and MIL-STD910D. Elma offers embedded boards and integrated subsystems built to open standards such as VME, OpenVPX, and VXS; ATCA, cPCI, and MicroTCA; board solutions include SBCs, Storage, I/O (1553, 429, Ethernet, Fiber), etc. This range of products and services gives Elma a unique ability to complete entire projects from initial system architecture through specification, design, manufacturing and test. Elma’s product offering encompasses standard architectures, and others. Certified to ISO 9001:2008.

System Development

Figure 2

The DuraNET 3825 combines the features available in Cisco IOS software, Catalyst Layer 2 LAN switching, and flexible Layer 3 WAN routing into a single ruggedized platform. air defense system to provide full 360-degree coverage.

The DuraNET 3825 (Figure 2) from Parvus combines the features available in Cisco IOS software, Catalyst Layer 2 LAN switching, and flexible Layer 3 WAN routing into a single ruggedized platform. Featuring mechanical packaging enhancements designed to suit shipboard / military shock and EMI environments, the DuraNET 3825 is designed to meet MIL-S-901D Grade B shock levels and MIL-STD-461 radiated emissions requirements.

Ethernet Tweaked for Avionics For avionics, Ethernet has made a number of inroads as a system interconnect. Some of Ethernet’s shortcomings have been addressed in the adaption called Avionics Full-Duplex Switched Ethernet (AFDX). Pushing this technology forward, EADS and TTTech Computertechnik AG last summer inked a licensing contract for the AFDX. AFDX is a standardized high-quality data network that provides guaranteed bandwidth and secure communications. AFDX was [ 46 ] COTS Journal January 2011

developed by the EADS Group’s Airbus company, and uses a special protocol to provide deterministic timing and redundancy management in the inter-system network environment. This standard first flew on Airbus’ A380 jetliner, and has since been applied to a variety of aircraft.

AFDX borrows concepts from the Asynchronous Transfer Mode (ATM) in order to overcome some of the weaknesses of Ethernet. A key feature of AFDX is its Virtual Links (VL) capability. In one abstraction, it is possible to visualize the VLs as an ARINC 429 style network each with one source and one or more destinations. Virtual Links are unidirectional logic paths from the source end-system to all of the destination end-systems. Unlike that of a traditional Ethernet switch, which switches frames based on the Ethernet destination or MAC address, AFDX routes packets using a Virtual Link ID.

ATCA for Heavy Duty Ethernet ATCA has carved out a respectable niche in the military where high-density computing and net-centric communications are a priority. Where ATCA shines

is in a military system where compute density and raw Ethernet performance are top priorities. The high-performance and bandwidth capabilities of ATCA bring the latest technologies to standards-based applications, such as command and control, aerospace surveillance, land mobile communications and maritime networks, which must collect and manage large amounts of data in real time.

ATCA is the perfect fit for those requirements, because ATCA was specifically designed to address high-density network communications applications and delivers up to eight times the performance of VPX and 40 times the performance of VME or cPCI. In addition, ATCA is a broadly adopted standard that has proven its interoperability through five years of deployment in the communication segment. Among the major programs embracing ATCA is the U.S. Navy’s Consolidated Afloat Networks and Enterprise Services (CANES).

An example Ethernet-centric ATCA product is Adlink’s latest 24-port GbE ATCA Multilayer Base Switch Blade.

Based on the Broadcom BCM56312 switch chip, it supports up to thirteen GbE ports for a 14-slot PICMG 3.0 ATCA system, with six egress GbE ports and two 10GbE SFP+ uplink ports via front panel access.

The aTCA-3150 from Adlink Technology incorporates Broadcom’s Fastpath networking software and is designed for ATCA adopters (NEPs & TEMs) who require AMC modularity, Gigabit layer 3 switching, a scalable control-plane engine and high-availability Base Interface.

The aTCA-3150 provides a COM Express Type 2 site for expansion with a processing subsystem, allowing users to tailor processing power to application demands. In addition, two mid-sized AMC bays for I/O expansion are also supported to suit the needs of different applications. The aTCA-3150 provides 10/100/1000Base-TX GbE and layer 3 switching on Base Interface with support for 14-slot shelves. It offers six front panel RJ-45 egress Gigabit Ethernet copper ports plus two 10 Gigabit Ethernet SFP+ optical uplink ports in connection with

System Development

the Base Interface domain. The aTCA3150’s switch blade design incorporates a powerful Freescale MPC8313E PowerQUICC II Pro 333 MHz processor for local management functions. This processor is used for managing the BCM56312 GbE switch and for hosting the Fastpath networking software switching and management modules.

OpenVPX and Switched Ethernet For rugged, harsh environment military applications, OpenVPX is emerging as the newest choice for Ethernet-based switched network applications. OpenVPX offers the advantage of high-performance computing in limited size, weight and power platforms where extreme ruggedness and harsh environment operation are required. These include everything from military combat vehicle systems to UAVs to tactical aircraft avionics. OpenVPX is perfectly suited to handle the huge processing demands of today’s ISR and C4I applications. Serving such needs, GE Intelligent Platforms offers the NETernity GBX460 rugged 6U OpenVPX data plane switch module, the first 10 Gbit Ethernet solution of its kind to support high throughput interprocessor communication (IPC) between 10GigE-enabled processing nodes for deployed defense and aerospace applications.

With 20 (optionally 24) 10GigE data plane ports and 16 GigE control plane ports, the GBX460 supports non-blocking, low-latency data transfers across a multiprocessing cluster at up to full wire speed, enabling new levels of performance for the most demanding ISR (intelligence, surveillance, reconnaissance) applications. It is designed to provide a high-speed interface for sensor I/O, IPC and data distribution to the back-end processing clusters typically found in C4I (command, control, communications, computers and intelligence) infrastructures. The GBX460 is an unmanaged Layer 2 switch that can support multiple OpenVPX slots/module profiles for maximum flexibility and throughput. The GBX460 meets the requirement to support a large number of 10GigE ports to maximize data throughput capabilities,

Figure 3

The VPQ is a 6U SBC that is Open VPX compatible per profile specifying four fat pipes (10 GBase-BX4) and two thin pipes (1000Base-T). The board has a quad-core Intel L5408 Xeon Processor and an onboard 24-Port 10 Gigabit Ethernet Switch to provide full-mesh backplane data-layer interconnectivity. and can optionally support up to four front panel 10GigE fiber ports to enable connectivity to external networks.

Ethernet in System Interconnect Role Because OpenVPX uses switched Ethernet as one of its backplane profile options, vendors are rolling out SBCs that leverage 10 Gbit Ethernet’s strength as a system interconnect. As an example along those lines, Dynatem is now shipping the VPQ (Figure 3), a 6U SBC based on the 6U VPX (VITA 46) form factor.

It is Open VPX compatible per profile MOD6-PAY-4F2T-12.2.2.4. This profile indicates a 6U Payload Module having four fat pipes (10 GBase-BX4) and two thin pipes (1000Base-T). Offered in both convection-cooled and ruggedized conduction-cooled variants, the VPQ will meet the needs of numerous commercial and military applications. At the heart of the VPQ is one quad-core Intel L5408 Xeon Processor, an Intel 5100 Memory Controller Hub (MCH) and an Intel ICH9R I/O Controller Hub (ICH), forming the central processing backbone of the design.

An onboard Fulcrum FM3224 24Port 10 Gigabit Ethernet Switch provides full-mesh backplane data-layer intercon-

nectivity. This allows up to eight VPQ SBCs to be integrated into a single chassis without the use of an additional switch board. A PLX PEX8624 PCI Express Switch provides connectivity to the XMC Sites and an Intel 82599EB Dual 10 Gigabit Ethernet controller, which connects to the 10 Gigabit Ethernet Switch. The Intel 82599EB supports the IEEE 1588 Precision Time Protocol standard allowing all node boards to be synchronized in the sub-microsecond range. An 82571EB Dual 1Gigabit Ethernet controller provides 1000Base-T or 1000Base-KX connectivity to the backplane via the VPX P4 connector.

ADLINK Technology San Jose, CA. (408) 495-5557. [www.adlinktech.com].

Dynatem Mission Viejo, CA. (949) 855-3235. [www.dynatem.com].

CommAgility Loughborough, UK. +44 1509 228866. [www.commagility.com].

GE Intelligent Platforms Charlottesville, VA. (800) 368-2738. [www.ge-ip.com].

Parvus Salt Lake City, UT. (801) 483-1533. [www.parvus.com].

TTTech Computertechnik AG Vienna, Austria. +43 1 585 34 34-899. [www.tttech.com].

January 2011 COTS Journal [ 47 ]

EXTREME ENGINEERING SOLUTIONS, INC.

PHONE: (608) 833-1155 WEB: www.xes-inc.com

XPedite7470: 3U VPX SBC Featuring Quad-Core 2nd Generation Intel® Core™ i7 Processor

XPedite5470: 3U VPX Conductionor Air-Cooled SBC Featuring Freescale Eight-Core P4080

The XPedite7470 is a high-performance, low-power 3U VPX-REDI singleboard computer based on the 2nd generation Intel® Core™ i7 processor (formerly codenamed “Sandy Bridge”) and the Intel QM67 chipset. With two x4 PCI Express VPX P1 interconnects and two Gigabit Ethernet ports, the XPedite7470 is ideal for today’s high-bandwidth and processingintensive military and avionics applications.

The XPedite5470 is a high-performance 3U VPX-REDI single-board computer based on the Freescale P4080 processor. With eight PowerPC e500 cores running at up to 1.5 GHz, the P4080 delivers enhanced performance and efficiency for today’s embedded computing applications.

The XPedite7470 accommodates up to 8 GB of DDR3 ECC SDRAM on two channels to support memory-intensive applications. The XPedite7470 also hosts numerous I/O interfaces, including Gigabit Ethernet, USB 2.0, SATA, graphics, and RS-232/RS-422/RS-485 through the backplane connectors.

Features & Benefits • 2nd generation Intel Core i7 processor with Advanced Vector Extensions (AVX) delivers highest performance for demanding DSP applications.

• 3U VPX form factor provides small footprint.

• Two x4 PCI Express VPX backplane interfaces provide high-bandwidth system interface.

• Conduction- and air-cooled versions support wide range of environmental requirements.

• PMC/XMC site supports additional processing, I/O, or storage requirements.

• DVI, SATA, Gigabit Ethernet, USB, and serial interfaces support application I/O requirements.

• Wind River VxWorks, Green Hills INTEGRITY, and Linux BSPs as well as Microsoft Windows drivers support software development.

Extreme Engineering Solutions, Inc. (X-ES) is a leader in the design, manufacture, and support of standard and custom embedded computing solutions. X-ES offers an extensive product portfolio that includes commercial and ruggedized single-board computers, high-performance processor modules, multipurpose I/O modules, SSD storage, backplanes, enclosures, power modules, and fully integrated systems.

X-ES products are used in a wide range of compute-intensive military, communications, commercial, and industrial applications with 3U/6U VPX, 3U/6U CompactPCI, 3U CompactPCI Express, VME, XMC, PMC, and PrPMC based products.

X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.

The XPedite5470 supports two separate channels of up to 4 GB each of up to DDR3-1333 ECC SDRAM, up to 16 GB of user flash, and up to 256 MB of boot flash. The XPedite5470 provides the option of utilizing a PCI Express or Serial RapidIO and two Gigabit Ethernet VPX P1 backplane interconnects. The XPedite5470 also supports dual Gigabit Ethernet, GPIO, I²C, PMC I/O, XMC I/O, and up to two RS-232/RS-422/RS-485 serial ports through the P2 connector.

Features & Benefits • Freescale P4080 processor with eight PowerPC e500 cores delivers maximum performance for demanding military applications.

• 3U VPX (VITA 46) form factor provides small footprint.

• Conduction- and air-cooled versions support wide range of application requirements.

• PrPMC/XMC site supports additional processing, I/O, or storage requirements.

• Dual x4 PCI Express or Serial RapidIO VPX fabric interconnects support high-bandwidth data movement.

• Gigabit Ethernet, USB, and serial interfaces support application I/O requirements.

• Wind River VxWorks, Green Hills INTEGRITY, and Linux BSPs support software development.

X-ES 2nd Generation Intel® Core™ i7 Processor Solutions: Delivering Innovation In 2010, Extreme Engineering Solutions, Inc. (X-ES) developed more Intel® Core™ i7 processor products based on VPX, CompactPCI, VME, CompactPCI Express, and XMC form factors than anyone in the industry. This year, X-ES has added solutions based on the 2nd generation Intel Core i7 processor. Providing products customers want, when they want them – that truly is innovation that performs.

X-ES offers an extensive product portfolio that includes commercial and ruggedized single board computers, high-performance processor modules, multipurpose I/O modules, storage, backplanes, enclosures, and fully integrated systems.

2nd generation Intel Core i7 processor solutions available in a variety of form factors.

Call or visit our website today.

Technology Focus COM Express Boards

COM Express Brings Its Multimedia Muscle to Defense Armed with a better compute-density story than alternative solutions, COM Express is emerging as a leading choice for space-constrained military embedded systems.

Jeff Child, Editor-in-Chief

T

he Computer-on-Module (COM) concept has found a solid and growing foothold in military embedded systems.

COM Express adds high-speed fabric interconnects to the mix. COM boards provide a complete computing core that can be upgraded when needed, leaving the application-specific I/O on the baseboard.

Just one COM Express module can provide the same processing and graphics performance as alternative solutions: like a multiple PC/104 board stack. Designers have three COM Express module sizes to choose from to suit their individual application requirements. All signals are maintained on the carrier card, where additional connectors can be added as required per specific applications. As a macro-component, COM Express enables technology insertions without a large time or monetary investment, and supports easy upgrades through multiple product lifetimes.

With recent improvements in video support and chipset graphics, integrated video support has become a mandatory requirement for UAVs and other military systems (Figure 1). COM Express planned for the expansion of video and display capabilities, and provides standard connector access for a variety of highspeed interfaces. The COM Express connector supports multiple video interfaces including DisplayPort, VGA, SDVO, HDMI or DVI. This allows designers to take advantage of the latest graphics capabilities without having to worry about affecting performance.

COM Express was specifically designed to ease the transition from legacy connectors and offers native interface support for modern-day I/O interfaces. On top of offering more PCI Express and USB ports than PC/104-Express modules, additional connecters can be added for LAN, SATA, video, audio, USB and PCI Express, delivering maximum I/O flexibility to meet specific application requirements. And since signals do not have to pass through multiple connectors, the signal integrity remains intact.

As the computing demands for systems such as UAVs continue to increase, that’s driving a need for higher performance, faster I/O, improved graphics and lower support costs. While de[ 50 ] COTS Journal January 2011

Figure 1

Streaming video is an increasingly critical part of UAV payload and control. COM Express is suited to handle the latest and greatest multimedia processing and interface technology. signers have used PC/104 for years to create UAVs, today’s growing demand for network-centric capabilities makes it an ideal time for developers to adopt COM Express. The standard’s flexible, two-board architecture makes COM Express an ideal solution for today’s most demanding UAV applications, and can help designers take advantage of the latest technologies at lower costs.

Last summer, PICMG released the COM Express Revision 2.0 specification. The rev 2.0 specification allows developers to focus on their specialized I/O requirements, without worrying about the complex interactions of CPUs, RAM, Chipsets and other basic elements that occur on the module. This recent revision helps to ensure that COM Express modules are prepared for future computer architectures while accommodating backward compatibly with older modules. The more important changes include smaller size, enhanced display support, faster Generation 2.0 PCI Express ports, high definition audio and USB client support.

Computer-On-Modules at a glance.

QsevenTM Most compact and cost efficient modules for ultra mobile applications.

COM Express® Choose from low power Intel® and AMD platforms up to Quad Core® Intel® i7 solutions.

XTXTM XTXTM is ETX® compliant and replaces the ISA Bus with PCI Express, SATA and more.

Support for Atom through Intel® Core® 2 Duo processors.

ETX® The “classic” Computer-On-Module. Now available with high performance graphics based on the AMD Fusion Platform. congatec Inc. | 6262 Ferris Square San Diego | CA 92121 USA | sales-us@congatec.com | www.congatec.us

Meet this attractive family at:

Embedded World 2011 | Nuremberg, March 1-3, 2011 Hall 12.0 Booth 122

CURTISS-WRIGHT CONTROLS ELECTRONIC SYSTEMS

PHONE: (978) 952-2000 WEB: www.cwcelectronicsystems.com

Hybricon OpenVPX, VPX, VPX-REDI Development Chassis

Hybricon SFF-6 Small Form Factor Enclosure

Electronic Systems’ Hybricon® family of OpenVPX Development Chassis products include a range of 3U and 6U air-cooled desktop, tower and open frame enclosures. These high-performance development chassis are able to cool up to 150W per slot. The chassis are designed to the latest VITA 46.0, 46.3, 46.10, 48.0, 48.1, 65.0 and 68.0 specifications. The card cage is designed to support 1.0” or 0.8” pitch cards and includes a 3U/6U x 80mm Rear Transition Module area. Choose from a selection of OpenVPX compliant backplanes – up to 16 slots. Custom configurations and system integration services are available from our U.S. based Engineered Packaging group.

The Hybricon Small Form Factor (SFF-6) is a new, rugged 6-slot 3U OpenVPX, VPX, VPX-REDI (VITA 46/48/65/68) or 7-slot 3U CompactPCI conduction-cooled chassis for harsh military environments. The SFF-6 Small Form Factor Chassis is the newest member of Electronic Systems’ Hybricon® family of advanced military COTS electronic packaging solutions and features the company’s unique CoolWall™ thermal technology (patent pending) to support system heat dissipation up to 400W. This ATR-style chassis, fabricated from a proprietary mixture of composite materials and aluminum, speeds and simplifies the integration of high performance, low-power embedded COTS subsystems designed for use in space, weight and power (SWaP)-constrained military environments. It utilizes a military power supply for MIL-STD-704 aircraft and MIL-STD-1275 vehicle use. Custom configurations and integration services are available from our U.S. based Engineered Packaging group.

Curtiss-Wright Controls Electronic Systems is one of the industry’s most comprehensive and experienced single sources for rugged, integrated solutions that are qualified for military platforms. Our product and service expertise includes Engineered Packaging, Power Supplies, HighSpeed Recording & Storage, Motion Control, Network Centric Computing, Rate Sensor Assemblies, Vehicle Management Computers and Electronic Manufacturing Services. Whether your application needs an OpenVPX backplane, chassis/enclosure or a complete vendor agnostic system solution, we utilize the latest technologies to design and manufacture COTS and custom highly reliable, rugged solutions to meet your requirements.

DOUBLE

YOUR PAYLOAD COOLING YOUR ENGINEERED PACKAGING PARTNER

CoolWallTM Enclosure Utilizes Breakthrough Thermal Management Technology!

Utilizes a mixture of metal composites to deliver enhanced thermal performance combined with the structural characteristics required for rugged applications Offers a greater than 2x improvement in payload power cooling compared to traditional aluminum construction Delivers dramatically higher thermal conductivity at a weight significantly lighter than aluminum Comprises a unique thermal metallic composite core housed within a structural metallic composite shell Offers the potential to enhance the weight and thermal performance of natural convection-cooled, forced-air conduction-cooled, or liquid conduction-cooled chassis through superior heat spreading or the design of embedded computing modules.

Ask our U.S.-based design and development team about a solution for your program requirements.

Tel: +1 (978) 952-2000 cwcelectronicsystems.com systeminfo@curtisswright.com

Technology Focus:

COM Express Boards Roundup COM Express Sports 2 GHz i7 Processor

Module Family Exploits the Benefits of COM.0 Rev 2.0

COM Express Module with Mobile Core i7 and QM57 Chipset

Gone are the days of a long gap between when a mainstream processor emerged and when it made its way into the military embedded board realm. Exemplifying that trend, several vendors have rolled out Intel i7-based products in the last month. The latest from ADLINK Technology is the ExpressCBR. The Express-CBR COM Express module combines the latest high-performance Intel

The COM.0 Revision 2.0 specification of COM Express has dropped legacy interface and adopted two new pin-outs that make space for future technology trends. Embracing the new version full force, Advantech offers a new series of COM modules that supports the new COM 2.0 specification. The newly introduced COM Express COM.0 Revision 2.0 by the PCI Industrial Computer Manufacturers Group (PICMG) takes Computer-on-Modules into a new era with smaller footprints and expanded pin-outs.

In COM 2.0 legacy digital signaling like Parallel ATA and PCI are phased out to increase

A new COM Express module is part of a portfolio of Type VI COM Express Basic (small footprint) modules from American Portwell.

The Type VI COM Express Basic is becoming a new standard in 2010. At 125 mm x 95 mm the compact PCOM-B216VG-VI is based on the Intel Core i7 processor and the Mobile Intel QM57 Express chipset. This dual-core platform

Core i7 processor running at up to 2.0 GHz with the advanced Mobile Intel QM57 Express chipset. The Express-CBR achieves hardware ruggedness by careful component selection and an extreme-rugged design methodology that gives reliable operation over a wide power supply range from 9V to 16V and over the extended temperature range of -40° to 85°C. The Express-CBR uses Extensible Firmware Interface (EFI) for a highly reliable, proven, versatile and adaptable BIOS layer that allows streamlined implementation of custom designspecific baseboard features. The powerful capabilities provided by EFI enable more indepth control than ever before of the pre-boot and boot environments. The Express-CBR supports up to 8 Gbytes of DDR3 memory and provides onboard I/O interfaces for Gbit Ethernet, eight USB 2.0 ports, four SATA ports and an IDE (PATA) channel. Legacy support is also provided for PCI, LPC, SMBus and I2C. Single unit pricing of the Express-CBR starts at $1,299.

ADLINK San Jose, CA. (408) 360-0200. [www.adlinktech.com].

more I/O connects for Digital Displays, Serial ATA, PCI Express, USB 3.0 and other futureproof interface types. More PCI Express lanes mean better connectivity for more diverse applications. Advanced high-speed I/O like SATA 3 and USB 3.0 are supported to provide volume data transmission capability for multimedia applications, and these new optimizations will make possible smaller form factors.

For flexible display connection, COM Revision 2.0 leaves dedicated pins for new DDI (Digital Display Interfaces). Without additional signal processing, DDI eliminates cable disorder and provides better anti-noise and exquisite resolution, compared with traditional analog signal interfaces. Multi-display requirements could be further extended by up to 3 DDI links through type 6 pin-outs. Aside from I/O extensions, power efficiency has improved bringing the benefit of reduced maximum input power to 137 watt for types 2, 3, 4, 5, 6, and 68 watt for type 1 and 10. This allows reuse of some additional power pins for the above I/O extensions. Carrier boards that need to work with COM Revision 1.0 modules need to address this change during the design.

Advantech Irvine, CA. (949) 789-7178. [www.advantech.com].

[ 54 ] COTS Journal January 2011

supports error-correcting code (ECC) memory and Intel Active Management Technology (Intel AMT) 6.0 along with Intel Trusted Execution Technology for effective remote management and enhanced security.

In addition, it features two SO-DIMM (non-ECC) sockets to support DDR3 SDRAM 800/1066MT/s up to 8 Gbytes; one Gigabit Ethernet; expansion (via the COM Express carrier board) of one PCI Express x16 lane, which can be configured to two x8 lanes; one DVI-D, one HDMI and one Display Port (DP) interface, seven PCI-E x1, LPC interface and high-definition audio interface; and a PCOM-C211 Developer COM Express Type VI carrier board. Equipped with Intel Turbo Boost technology—which automatically allows processor cores to run faster than the basic operating frequency—the PCOM-B216VG-VI addresses the market’s performance and power consumption concerns because it also supports Intel Intelligent Power Sharing Technology.

This balances the load of TDP (Thermal Design Power) and temperature between the CPU and the graphics engine by enforcing power clamps to non-turbo levels.

American Portwell Fremont, CA (510) 403-3399. [www.portwell.com].

COM Express Boards Roundup

Extended Temperature Module Sports Atom Z5xx Series

Board Set Merges COM Express Cores with Triple-Play I/O

Rugged COM Express Card Suits Constrained Apps

Intel’s Atom provides the best of two worlds: PC compatibility and low-power operation.

Using the new industrial temperature versions of the ultra-low-power Intel Atom processor Z5xx series and the System Controller Hub US15WPT, a new COM Express module is geared around low power consumption and the industrial temperature range. All components used for the high-density design conga-CAx from Congatec are specified for an ambient temperature range of -40° to +85°C. Typical power requirements for this module are less

Today’s level of board integration has enabled board functions that once took several boards to now fit on a single card. A boardlevel “embedded-ready subsystem” (ERS) combines the benefits of computer-on-modules (COMs) with those of stackable single board computers (SBCs). This announcement means that system manufacturers no longer need to design a custom carrier to deploy COM Express modules.

Called Magellan from Diamond Systems, the CPU core consists of a COM Express CPU module and heat spreader mounted on its bottom side, resulting in optimal thermal management and increased space for I/O

Non-backplane, stand-alone board form factors continue to expand their acceptance among military developers. Riding that wave, GE Intelligent Platforms offers the bCOM2-L1100 rugged COM Express board.

Designed specifically to respond to the growing requirement to deploy powerful computing solutions in harsh, space-constrained environments such as mining, oil and gas, manufacturing, test/measurement, unmanned

than 5W. When combined with ACPI 3.0 battery management, ultra-mobile industrial applications are now possible.

The conga-CAx is available in two different CPU variants. One version is powered by the Intel Atom processor Z510PT with 1.1 GHz and 400 MHz front side and memory bus. The other version features the 1.33 GHz Intel Atom processor Z520PT. Both variants are equipped with 512K L2 cache and can access up to 1 Gbyte of rugged onboard soldered DDR2 RAM. The conga-CAx also offers a rich connectivity feature-set. This includes up to two PCI Express x1 lanes, PCI Bus, EIDE interface, Gbit Ethernet, High Definition Audio and eight USB ports. The onboard IDE flash drive provides up to 2 Gbytes of mass storage and is also specified for the full industrial temperature range.

Congatec Cardiff-by-the-Sea, CA. (760) 635-2600. [www.congatec.us].

functions and connectors. This design makes it possible for Magellan to integrate dual gigabit Ethernet LAN ports, a 7-30V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion and a FeaturePak I/O module socket, in addition to a complete embeddedPC core—all within the 95 x 125 mm COM Express footprint. Stacking boards in one direction greatly simplifies the thermal design of embedded systems based on high-end CPUs, avoiding costly custom heat pipes and milled aluminum thermal-transfer blocks.

Diamond Systems Mountain View, CA. (800) 367-2104. [www.diamondsystems.com].

vehicles, exploration, transportation and military/aerospace, it features an Intel Core2 Duo processor operating at up to 2.26 GHz and up to 4 Gbytes of soldered DDR3 SDRAM. Soldered components substantially improve reliability.

The bCOM2-L1100 provides extensive protection to ensure reliable operation in applications that are subject to shock, vibration and extremes of temperature (-40° to +85°C).

All components are soldered to the board for optimum reliability, while mechanical standoffs provide a high degree of insulation from external forces. Available in a standard version for benign environments, the bCOM2-L1100 is optionally available in extended temperature variants and with conformal coating. Despite its small size, the bCOM2-L1100 offers a broad range of connectivity and I/O capabilities, including Gigabit Ethernet, eight USB 2.0 ports, four Serial ATA (SATA) ports (RAIDconfigurable), one PATA port, eight GPIO ports (four in, four out), one LVDS port, two SDVO channels, VGA, High Definition Audio (HDA) and PCI Express (configurable as one 4x PCI Express lane or four 1x PCI Express lanes). Also provided is a x16 PCI Express port for high-end graphics and video applications.

GE Intelligent Platforms Charlottesville, VA. (800) 368-2738. [www.ge-ip.com].

January 2011 COTS Journal [ 55 ]

FPGA Processing Boards & Power Conversion Products Gallery Featuring the latest in FPGA Processing Boards & Power Conversion Products technologies S4-AMC: Altera Stratix® IV GX AdvancedMC with VITA 57 Site

S4-3U-VPX: Commercial & Rugged Altera Stratix® IV GX 3U VPX Board

VITA 57 FMC site for I/O and processing expansion High density Altera Stratix IV GX supported by BittWare’s ATLANTiS™ FrameWork BittWare’s FINe™ III Host/Control Bridge provides control plane processing and interface Fully connected to AMC (16 ports SerDes, 4 ports LVDS) I/O includes 10/100/1000 Ethernet, SerDes, LVDS, RS-232, and JTAG

VITA 57 FMC site for processing and I/O expansion High density Altera Stratix IV GX supported by BittWare ATLANTiS™ FrameWork for FPGAs BittWare FINe™ III Host/Control Bridge provides control plane processing and interface Fully connected to VPX: GigE, 15 SerDes, 32 LVDS Additional I/O: 10/100 Ethernet, RS232, JTAG

BittWare Phone: (603) 226-0404 Fax: (603) 226-6667

BittWare E-mail: info@bittware.com Web: www.bittware.com

E-mail: info@bittware.com Web: www.bittware.com

GPIO-8439

VCP-8166

The GPIO-8439 is an air-cooled/ conduction-cooled user-programmable I/O PMC/XMC with a Xilinx Virtex-6 FPGA and a huge work memory space.

It offers a private multilane full duplex data channel, using multiple high-speed serial links to/from the carrier board processor memories.

The VCP-8166 is an air-cooled/ conduction-cooled video PMC/XMC with a Xilinx Spartan-6 FPGA and a dedicated H.264/AVC co-processor for real-time video compression/ decompression of two full-HD channels in parallel; HD-SDI, HDMI and analog I/O are supported.

CES - Creative Electronic Systems SA Phone: +41.22.884.51.00

Phone: (603) 226-0404 Fax: (603) 226-6667

E-mail: ces@ces.ch Web: www.ces.ch

CES - Creative Electronic Systems SA Phone: +41.22.884.51.00

E-mail: ces@ces.ch Web: www.ces.ch

Xilinx & Actel Based FPGA Solutions

CHAMP-FX3 The CHAMP-FX3 is a rugged 6U OpenVPX™ module combining two SX475T Xilinx® Virtex®-6 FPGAs with an MPC8640D processor.

A mix of high-speed memories, 5 GHz serial links, Serial RapidIO fabric and two FMC sites for sensor I/O completes this industry-leading FPGA card.

Xilinx Virtex-6, Virtex-5, Spartan-6 & Spartan-3E reconfigurable FPGAs Actel ProAsic 3 reconfigurable FPGA PCI Express, PC/104 and PCI-104 Customizable with the free Xilinx ISE and Actel Libero software Use Connect Tech’s Engineering Services for a Modified COTS solution

Connect Tech Inc. Phone: (519) 836-1291 Toll Free: (800) 426-8979

Curtiss-Wright Controls Embedded Computing E-mail: sales@connecttech.com Web: www.connecttech.com

Phone: (703) 779-7800 Fax: (703) 779-7805

150W (Watt) DC/DC Converter, 3U cPCI 55MQ2

Avnet Spartan-6 FPGA DSP Kit The Xilinx Spartan®-6 FPGA DSP Kit brings hardware, development tools, methodologies, IP, and verified reference designs together into solutions that accelerate development for experienced users and simplifies the adoption of FPGAs for new users. By combining all the pieces of a total solution, users can focus on the unique value of a design at the beginning of the design process.

The 55MQ2 is a full-featured, rugged converter with high power/low profile packaging, designed for 3U, cPCI systems and is fully compliant with the PICMG 2.11, 47-position connector pin-out. This true, single-slot solution fits in a standard 3U cPCI or VPX rack and is Intelligent Power Management Bus compatible.

North Atlantic Industries, Inc. Phone: (631) 567-1100 Fax: (631) 567-1823

E-mail: sales@naii.com Web: www.naii.com

Xilinx, Inc. Phone: (408) 559-7778 Fax: (408) 559-7114

E-mail: sales@xilinx.com Web: www.xilinx.com

Avnet Virtex-6 FPGA DSP Kit with AD/DA

Avnet TI OMAP/Spartan-6 FPGA Co-Processing Kit

The Xilinx Virtex®-6 FPGA DSP Kit brings hardware, development tools, methodologies, IP, and verified reference designs together into solutions that accelerate development for experienced users and simplifies the adoption of FPGAs for new users. By combining all the pieces of a total solution, users can focus on the unique value of a design at the beginning of the design process.

The TI OMAP/Spartan-6 FPGA Co-Processing Development Kit is a sophisticated platform that delivers breakthrough system performance by integrating and optimizing the key strengths of high performance FPGAs, system control processing, and digital signal processing, all within one single environment. While an ARM9 CPU provides run control and executes Real Time Operating Systems like embedded Linux, and a C674X DSP can be dedicated to specific signal processing algorithms, a flexible Spartan-6 FPGA can be focused on the performance bottlenecks to accelerate datapath applications.

Xilinx, Inc. Phone: (408) 559-7778 Fax: (408) 559-7114

E-mail: info@cwcembedded.com Web: www.cwcembedded.com

Xilinx, Inc. E-mail: sales@xilinx.com Web: www.xilinx.com

Phone: (408) 559-7778 Fax: (408) 559-7114

E-mail: sales@xilinx.com Web: www.xilinx.com

COM Express Boards Roundup

Credit Card Size COM Express Card Sports Atom E6xx

COM Solution Uses Latest Atom Embedded Processor Family

The Atom CPU and the COM Express form factor are a marriage made in heaven for sizeand power-constrained military systems. With that in mind, Kontron has launched a COM Express-compatible module (55 mm x 84 mm) with the new Intel Atom processor E6XX. Called the COM nanoETXexpress-TT, the card is also equipped with the newly defined PICMG COM Express COM.0.R.2 Type 10 pin-out that was added to the COM.0 R2.0 specification.

With industrial grade components, functional in the range (E2) -40° to +85°C and different

A new COM Express board is based on the new Intel Atom E6xxx Series processors, formerly code named Tunnel Creek. The E6xx series is the first Intel Atom processorbased system-on-a-chip (SoC) for embedded applications. The highly integrated SoC uses PCI Express (PCIe) as the chipset interface, which means the processor can pair up with any PCIe-compliant device such as a proprietary ASIC, FPGA or application-specific I/O hubs. A combination of this SoC with the Intel Platform Controller Hub EG20T is called the Queensbay platform by Intel.

Built in the small COM Express Compact form factor of 95 x 95 mm, the Toucan-TC embedded PC module from Lippert Embedded Computers takes advantage of the Queensbay

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options for data storage, it is suitable for use in harsh environments and thus complements the existing portfolio. Finally, the nanoETXexpress COM family gains four new members, broadening the scalability from 600 MHz to 1.6 GHz and throughout the industrial-grade temperature range.

The nanoETXexpress-TT customer has four PCI Express lanes of which three can be utilized for dedicated customer-specific interfaces. This enables the use of even more dedicated minidevices in a semi-custom solution. In addition to LVDS, it offers the newly implemented Digital Display Interface (DDI) for SDVO, Display Port or HDMI that allows two displays to be controlled independently. The board also features Intel’s Platform Controller Hub EG20T, allowing the new Computer-on-Module to be configured very flexibly. In addition to three PCI Express Lanes for custom extensions, the module also supports two different options for data storage: either a robust micro-SD Card socket offering up to 32 Gbytes and 2x SATA II 300 Mbyte/s interfaces, or a planned version with industrial-grade SATA Flash Memory (up to 16 Gbytes) and 1x SATA II 300 Mbyte/s connector.

Kontron Poway, CA. (888) 294-4558. [www.kontron.com].

platform and features the Intel Atom E6xx in versions ranging from 0.6 GHz to 1.6 GHz and up to 2 Gbytes of soldered DDR2 memory.

The Toucan-TC also offers both SDVO and LVDS graphics interfaces, 3 SATA ports, one PATA port and five PCIe x1 ports. Additional interfaces include seven USB 2.0 ports including a client port, a Gigabit Ethernet port with PHY, a Micro-SD Card Slot, a CAN bus and four UART ports on mechanically lockable option connectors. The Toucan-TC is also optionally available in the extended temperature range of -40° to 85°C. Cooling is supported with a suitable heat spreader. All memory is soldered to the board in order to achieve high levels of shock and vibration resistance.

LiPPERT Embedded Computers Mannheim, Germany. +49 621 4 32 14-0. [www.lippertembedded.com].

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COM Express Boards Roundup

Atom-based COM Module Offers Extended Temperature Operation

Core i7-based Module Boasts -25° to 70°C Temp Operation

Ideal for systems where the overhead of slot-card backplanes isn’t desirable, COM modules are becoming a key form factor choice for military systems. An upgraded ESMexpress Computer-on-Module (COM) incorporates the Intel Atom XL processor to provide tested, qualified operation in the extended temperature range of -40° to +85°C (-40° to +185°F) in both conduction- and convectioncooled environments. It also features an

While the first generation of COM Express boards wasn’t generally rugged, a new set of products has emerged specifically crafted for harsh environments. With that in mind, the ruggedized Procelerant CEQM57XT COM Express from RadiSys combines the Intel Core i7 and i5 processors and the Mobile Intel QM57 Express chipset with extended temperature range from -25° to 70°C and ruggedized vibration specifications that are required for many mil/aero and industrial applications such as ruggedized computers/tablets, unmanned vehicles/robots and in-vehicle computers. The CEQM57XT features the Intel Core i7 2.53 GHz, 2.0 GHz and 1.06 GHz processors and the Intel Core i5 2.4 GHz processor for increased processing performance and a seven-year lifecycle, a key requirement for mil/aero and industrial applications.

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Impedance Levels 10 ohms to 250k ohms, Power Levels to 3 Watts, Frequency Response ±3db 20Hz to 250Hz. All units manufactured and tested to MIL-PRF-27. QPL Units available.

Power & EMI Inductors Ideal for noise, spike and Power Filtering Applications in Power Supplies, DC-DC Converters and Switching Regulators

Pulse Transformers increased memory capacity of 2 Gbytes, double its predecessor. Because the enhanced XM1L from MEN Micro conforms to the ANSI-VITA 59 RSE standard currently in development, it provides a cost-effective and easily upgradeable means of employing advanced embedded technology in highly rugged applications as found in industrial, harsh, mobile and missioncritical environments.

The low-power XM1L uses the Intel Atom XL processor family operating at up to 1.6 GHz in combination with an IA-32 core based on 45nm process technology, while drawing a maximum of 7W. In addition to the upgraded 2 Gbytes of soldered DDR2 SDRAM system memory, the XM1L supports other memory, including USB flash on the carrier board and 512 Kbytes of L2 cache integrated into the processor. Pricing starts at $497.

MEN Micro Ambler, PA. (215) 542-9575. [www.menmicro.com].

10 Nanoseconds to 100 Microseconds. ET Rating to 150 Volt Microsecond, Manufactured and tested to MIL-PRF-21038.

Multiplex Data Bus Pulse Transformers The board’s COM Express 1.0 Type 2 pin-out ensures smooth upgrades. Six PCI Express x1 ports, one PCI Express x8 port, and optional PCI Express x16 expansion port are provided for increased peripheral performance. The board also provides Gbit Ethernet, Trusted Platform Management (TPM), optional conformal coating and optional extended and industrial temperature standalone SODIMM memory.

RadiSys designs ruggedness into the CEQM57XT by utilizing its proprietary implementation of the Highly Accelerated Life Test (HALT) during the design process to identify and correct product weaknesses prior to production; Highly Accelerated Sample Screen (HASS) is then used during production to continually monitor supplier quality and component robustness. Through rigorous HALT/HASS testing, RadiSys ensures that the product is designed to its extended temperature range limits required by its target markets.

RadiSys Hillsboro, OR. (503) 615-1100. [www.radisys.com].

Plug-In units meet the requirements of QPL-MIL-PRF 21038/27.

Surface units are electrical equivilents of QPL-MIL-PRF 21038/27.

DC-DC Converter Transformers

Input voltages of 5V, 12V, 24V And 48V. Standard Output Voltages to 300V (Special voltages can be supplied). Can be used as self saturating or linear switching applications. All units manufactured and tested to MIL-PRF-27.

400Hz/800Hz Power Transformers

0.4 Watts to 150 Watts. Secondary Voltages 5V to 300V. Units manufactured to MIL-PRF-27 Grade 5, Class S (Class V, 1550C available).

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January 2011 COTS Journal [ 61 ] Untitled-1 1

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M12 Connectors Hardened Steel Case Extended Operating Temps Fiber Options, Copper, PoE IEC 61373 Compliant for shock and vibration

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COM Express Boards Roundup

COM Express Module Supports Multimedia

Module with Intel Core 2 Duo Provides Flexible Configuration

A fanless COM Express form factor module offers a complete, multimedia-capable platform for a variety of military embedded applications. Available with a choice of Via C7 or Via Eden processors, the Via COME7N80 from Via Technologies also integrates Via CN896 North Bridge and VT8251 South Bridge chipsets providing a flexible and comprehensive computer-on-module product. Targeted at industrial PC and large OEM customers

A flexible COM Express design features the Intel CPU Socket 479, which enables support for Intel Core 2 Duo, Core Duo or single core Pentium M and Celeron M processors. The MB-80070 from Win Enterprises offers further flexibility in storage options by providing parallel and serial ATA interfaces. In addition, the unit enables easy system expansion by supporting interfaces that include 5x PCI Express, 32-bit PCI 2.3 and LPC bus. The board supports 24-bit dual-channel LVDS for high-quality video and is appropriate for cart-

focused on dynamic application segments, including gaming, healthcare and industrial automation, customers can take advantage of a proprietary multi-I/O baseboard, or can utilize Via’s extensive technical support in developing a custom baseboard.

The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, graphics and Ethernet, through board-to-board connectors to an I/O baseboard. The Via COME7N80 features the Type 2 COM Express standard, three PCI and three x1 lanes plus a x16 PCIe slot and up to 2 Gbyte of DDR2. In addition, the module features 10/100 Ethernet, up to eight USB 2.0 ports and up to four SATA devices.

VIA Technologies Fremont, CA. (510) 683-3300. [www.viaembedded.com].

based medical, test & measurement, industrial automation, interactive client, military and other applications.

Key features include support for Intel Core 2 Duo, Core Duo, Pentium M and Celeron M processors and the Intel 945GME with ICH7M chipset. The MB-80070 is PICMG COM Express R1.0 compliant, using the standard form factor of 95x 125 mm; 3.8 x 5 inches. It supports one DDRII SO-DIMM socket and an Intel 82573L Gbit Ethernet interface. System memory supports DDR II 400/533/667 up to 2 Gbytes. Integrated graphics support includes dual SDVO, Analog VGA, 24-bit LVDS, TV-Out interface. The board supports COM Express standard features including USB, SATA, ATA, GPIO and AC97 and is RoHS compliant.

Pricing begins at $280 in OEM quantities and does not include CPU.

WIN Enterprises North Andover, MA. (978) 688-2000. [www.win-ent.com].

PowerlinePlus-Converters operate up to +100째C with full load.

Some like it hot!

For Military COTS, Aerospace, Telecom & High-End Industrial Controls Applications. Designed to meet MIL-STD-461 & MIL-STD-704 with a simple external circuit!

NEW!

The RPP Converters can be supplied with a base plate with mounting holes for high vibration applications.

The RPP converter case laid out as a heat-sink optimizes heat-transfer and efficiency.

PowerlinePlus converters main features: -

Up to 100degC of ambient temperature - no derating! +120degC maximum case temperature Optional -55degC start-up guaranteed Built-in FCC/EN55022 Class B Filter Meets MIL-STD-461 with a simple external filter Efficiency up to 89% Built-in heatsink or baseplate case styles (Ultra compact packages) MTBF over 2,000,000 hours RECOM Power Supplies available through:

NORTH ATLANTIC INDUSTRIES, INC.

PHONE: (631) 567-1100 WEB: www.naii.com

6U OpenVPX Multifunction I/O Model: 67C3

3U OpenVPX Multifunction I/O Model: 68C3

Single slot 6U OpenVPX multi-function I/O and serial communications card ideally suited for military, aerospace and industrial applications.

Single slot 3U OpenVPX multi-function I/O and serial communications card ideally suited for military, aerospace and industrial applications.

VME, Gigabit Ethernet and Serial RapidIO (sRIO) or PCI Express (PCIe) control interface options enable users to take advantage of the higher speed, switched fabric communication architectures, offering significantly greater capability and flexibility.

VME, Gigabit Ethernet and Serial RapidIO (sRIO) or PCI Express (PCIe) control interface options enable users to take advantage of the higher speed, switched fabric communication architectures, offering significantly greater capability and flexibilty.

FEATURES • Multiple functions on a single slot 6U OpenVPX card • OpenVPX Slot Profile: SLT6-BRG-4F1V2T-10.5.1 • Users can specify up to six different function modules • Front and/or Rear I/O • Conduction or Convection-cooled versions • Automatic background Built-in-Test

FEATURES • Multiple functions on a single slot, 3U, OpenVPX card • OpenVPX Slot Profile: SLT3-PAY-2F2T-14.2.5 • Users can specify three different function modules • Front and/or Rear I/O • Conduction or Convection-cooled versions • Automatic background Built-in-Test

Control & Packing Density

Small Systems Operating in Rugged Environments

The enhanced motherboard contains six independent module slots, each of which can be populated with a function-specific module. This unique design eliminates the need for multiple, specialized, single function cards by providing a single board solution for a broad assortment of signal interface modules such as, Synchro/Resolver/ LVDT/RVDT Simulation and Measurement, A/D, D/A, Discrete/Differential/ TTL/CMOS I/O, RTD, Encoder/Counter and communications such as RS232/422/485, MILSTD-1553, ARINC 429 and CANBus. Using multiple DSPs, the enhanced motherboard enables higher processing power and dedicated control for each module. This approach also increases packing density, saves enclosure slots, reduces power consumption and adds continuous background built-in-test.

The motherboard contains three independent module slots, two of which can be populated with a function-specific module and the third with either a combination module featuring four multiplexed A/D channels and 28 discrete I/O programmable channels or reference supply.

North Atlantic Industries designs, manufactures and sells Commercial-off-the-Shelf (COTS) and Modified COTS, Embedded I/O Boards, Single Board Computers, Rugged Military Power Supplies, Embedded Systems and Motion Simulation and Measurement Instruments for the Defense and Aerospace Industries.

The enhanced motherboard, using multiple DSPs enables higher processing power and dedicated control for each module. This unique design eliminates the need for multiple, specialized, single function cards by providing a single board solution for a broad assortment of signal interface modules such as, Synchro/ Resolver/ LVDT/RVDT Simulation and Measurement, A/D, D/A, Discrete/Differential/ TTL/CMOS I/O, RTD, Encoder/Counter and communications such as RS232/422/485, MILSTD-1553, ARINC 429 and CANBus. This approach also increases packing density, saves enclosure slots, reduces power consumption and adds continuous background built-in-test.

The only compact, rugged chassis offering 300 I/O pins and processing!

Proudly made in the USA.

SIU6... The COTS Multifunction I/O, Communication and Processing subsystem.

Ideally suited for remote data distribution, acquisition and processing systems, the SIU6 takes full advantage of North Atlantic Industries’ Multifunction and Communications I/O and Power Supply products.

• • • • • •

Multiple I/O Configurations... Single COTS solution • PowerPC MPC8536 processor option Dual 10/100/1000BaseT Ethernet • Intel ATOM processor option A/D, D/A, TTL, RTD, Discretes, Encoder • ADI Blackfin BF533 low power processor option Synchro/Resolver/LVDT/RVDT-to-Digital • Rugged, -40˚C to +71˚C Base-Plate Cooled Digital-to-Synchro/Resolver/LVDT/RVDT • MIL-STD-810, -704 and -461 MIL-STD-1553, ARINC 429/575, RS232/422/485, CANBus and USB Interfaces

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Products

COTS

Get Connected with companies and products featured in this section. www.cotsjournalonline.com/getconnected

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Products Get Connected

with companies mentioned in this article. www.cotsjournalonline.com/getconnected

Rugged Display Computer Features Capacitive Touch for Easier HMI

Get Connected with companies mentioned in this article.

The military’s drive toward net-centric operations means more need for displays at every network node. www.cotsjournalonline.com/getconnected Serving such needs, MENwith Micro offersand theproducts DC2. The new in rugged panel display combines capacitive touch Get Connected companies featured this section. technology for easier human interface with a fanless, maintenance-free design for better display reliability. www.cotsjournalonline.com/getconnected Equipped with an Intel Atom 1.3 GHz XL Z520PT processor as well as 1 Gbyte of DDR2 SDRAM and a 2 Gbyte microSD card, the DC2 offers high data throughput and memory capacities.

The panel-mounted DC2 features a 10.4-inch 4:3 LCD TFT display with a 1024 x 768 resolution as standard, with larger screen sizes up to 19 inch as well as higher resolutions and aspect ratios available, depending on user requirements. Standard I/O is comprised of two Fast Ethernet and two USB ports as well as four binary inputs via the 10-pin power supply connector. The Ethernet interfaces have switch functionality to provide Ethernet connection to subsequent intelligent displays. A MiniPCI Express card slot with an external antenna can be used for wireless functions, such as WLAN, WI-FI, GSM/GPRS, EDGE, UMTS, HDSPA and LTE. The DC2 is equipped with a 9V to 36V wide-range power supply and operates from -40° to +70°C as well as at +85°C for up to 10 minutes according to temperature class Tx. All components are soldered to withstand shock and vibration and are prepared for conformal coating.

Pricing for the DC2 is $2,200.

MEN Micro, Ambler, PA. (215) 542-9575. [www.menmicro.com].

Mini-ITX Embedded Motherboards Sport Second Gen Intel Core Processors

Compact Encapsulated AC/DC Converters Boast Long Life

Emerson Network Power’s latest series of Mini-ITX form factor embedded motherboards supports the new second generation Intel Core i7-2710QE and Intel Core i52510E processors, launched today

by Intel. Featuring up to 8 Gbytes of DDR3 memory and dual display capability from multiple physical display connections, the MITX-CORE-800 series features a standard latching 12 VDC power input connector for ease of use and low cost integration by original equipment manufacturers (OEMs). The MITXCORE-800 series presents the user with a PICMG standard Extended Application Programming Interface (EAPI) to simplify the control of essential hardware functionality such as the backlight inverter and the watchdog timer.

Bear Power Supplies’ compact and rugged BP Series encapsulated AC/DC power converters are now available for purchase.

BP Series power supplies are designed for long life and reliable operation in demanding environments. The power supplies operate from -40° to +70°C (half load) and -40° to +60°C (full load) with convection cooling.

They are available in 5W, 10W, 15W and 30W versions with universal input (90 to 264 Vac) and regulated output of 3.3V, 5V, 12V, 15V, 24V or 48V. All feature low inrush current with active inrush current limiting, fusing and EMI filtering. The PCB-mountable, chassis-mountable and DIN rail-mountable packages are as small as 1.75 x 2.25 x 0.75 inches. BP Series power supplies are designed and manufactured in the USA. Prices range from $59 to $139 for single units.

Emerson Network Power, EmbeddedComputing, Carlsbad, CA. (407) 241-2751. [www.emersonnetworkpower.com].

BEAR Power Supplies, Phelps, NY. (315) 548-6188. [www.bearpwr.com].

300 Amp High Power Solid State Power Controller Power subsystems for military applications require more than your standard level of reliability and performance. Serving those needs, Data Device Corporation (DDC) has introduced a new compact (6.3 in x 4.6 in), multichannel Solid-State Power Controller card with the capability to distribute and control power to four independent 75 amp subsystems, and handle high current loads (up to 300 amps) with channel paralleling.

Solid-State Power Controllers provide many performance and reliability advantages over electromechanical circuit breakers, and the RP-26300 further expands those advantages by offering a low-weight, low-volume and highly efficient thermal dissipation solution for high-power applications. The RP-26300 features mission-critical capabilities such as remote monitoring of load current, voltage and temperature, SAE J1939-compatible CAN interface, programmable trip setting per channel, and battle mode trip override. The RP-26300 provides advanced power control for a variety of needs including to protect sensitive electronics with EMI reduction, support load shedding, and simplify crew operation with automated power control.

Data Device Corp., Bohemia, NY. (631) 567-5600. [www.ddc-web.com].

[ 66 ] COTS Journal January 2011

COTS Products Get Connected with companies and products featured in this section. www.cotsjournalonline.com/getconnected

Multi-Display Graphics Card Targets Embedded Apps VIA Technologies offers a graphics card designed specifically

Get Connected with companies and featured in this section. for products the embedded market with the VIA eH1, a DX10.1-compliant, www.cotsjournalonline.com/getconnected

multi-display card that thrusts any system with a PCI Express slot into a new realm of graphics and video capability. The board features an advanced DirectX 10.1, OpenGL 3.1, OpenGL ES 2.0 compatible 64-bit architecture and offers multi-stream 1080p HD video decoding and Stereoscopic 3D rendering capability. This makes it the ideal solution for a range of embedded applications that require advanced graphics and video on multiple displays.

The VIA eH1 is a low-profile PCI Express add-in board and features the S3 Chrome 5400E GPU, the industry’s most power-efficient 64-bit discrete graphics solution, and is complemented with 512 Mbytes of DDR3 memory.

VIA Technologies, Fremont, CA. (510) 683-3300. [www.via.com.tw].

Secure Rugged SATA SSD XMC Card Has Data Encryption Solid-state disk drives offer key advantages for military users such as enhanced security and secure erase. Curtiss-Wright Controls Embedded Computing (CWCEC) has announced the introduction of the XMC-552, its new rugged, high-performance, reliable and power-efficient NAND flash solid state drive XMC/PMC card. The XMC/ PMC-552, which is visible to the system as two independent SATA drives, is available in 64, 128 or 256 Gbyte configurations. The small form factor mezzanine card speeds and simplifies the integration of large capacity solid-state flash memory into deployed subsystems.

Designed for use in demanding military environments, the XMC552 provides features to protect critical data including 128-bit AES data encryption using a programmable key, an instant purge function that enables the erasure of all memory within 4 seconds, and secure data erase. The sequential read performance of the XMC-552’s flash memory is rated at an industry 200 Mbyte per second, which can be increased to 400 Mbyte per second with RAID 0 software. The card supports industry standard ECC NAND flash correction that can correct up to eight random single-bit errors per 512-byte sectors. It also supports a wear leveling algorithm that spreads program/erase cycles evenly across the media to mitigate premature device failure due to frequent data overwrites. The XMC-552 is available in both air-cooled and conduction-cooled configurations. Designed in accordance with the IEEE 1386 and IEEE 1386.1 specifications, the card is designed for optimal performance with basecards that support either a full XMC mezzanine connector set (Pn5 and Pn6) or a mixed set PMC and XMC connectors (Pn4 and Pn5).

Development Tool Aids Complex Comms System Designs Communications forms a major part of today’s military system development efforts.

Aculab has announced the release of its AMS Server application development platform. This highly flexible solution enables developers to access the powerful telephony and media server functionality of Aculab’s Prosody S Host Media Processing (HMP) platform using high-level object-oriented programming languages. The core functionality of Aculab’s HMP platform is controlled through a highly effective C language API. By its nature, C requires relatively complex commands and syntax.

The C# and Python APIs, now available with the AMS Server, abstract the complex, low-level telephony processes inherent in the underlying C language structure and capabilities, and eliminate the need to deal with these issues when accessing or controlling the media server or telephony functions. AMS Server can reduce development time by two orders of magnitude.

In addition, it offers these efficiencies at a substantially lower cost compared to traditional development platforms.

Aculab, Milton Keynes, United Kingdom, +44 (0)1908 273800. [www.aculab.com].

Curtiss-Wright Controls Embedded Computing, Ashburn, VA. (703) 779-7800. [www.cwcembedded.com].

Vector Network Analyzer Delivers RF Network, Impedance Analysis Agilent Technologies introduced two options for its ENA Series E5061B 5-Hz to 3-GHz vector network analyzer. The new RF NA (network analysis) and ZA (impedance analysis) options increase the analyzer’s frequency range, speed, upgradability and versatility. This enables the analyzer to deliver solid performance for basic RF network and impedance measurements. Agilent’s RF NA option delivers significantly faster measurement speed. Operating from 100 kHz to 1.5/3 GHz, the RF NA option is available as either a two-port S-parameter, or as a transmission/reflection test set, with a 50- or 75-ohm port impedance. The new ZA software option adds an impedance analysis function to the E5061B-3L5 LFRF network analyzer, offering a migration path for legacy network plus impedance combination analyzer users. Pricing ranges from $3,100 to $23,700.

Agilent Technologies, Palo Alto, CA. (650) 752-5000. [www.agilent.com].

January 2011 COTS Journal [ 67 ]

COTS Products Get Connected with companies and products featured in this section. www.cotsjournalonline.com/getconnected

Dual-Active Fibre RAID SAN Storage Solution Is Scalable Get Connected with companies and products featured in this section.

High-speed, reliable, mass storage has become a crucialwww.cotsjournalonline.com/getconnected part of many military development efforts. With just that in mind, Enhance Technology has released its new UltraStor ES3160 FS dual-active Fibre RAID SAN storage solution. ES3160 FS is the latest addition to the award winning UltraStor enterprise storage line, featuring dual active RAID controllers, high data bandwidth, cache mirroring, load-balancing and user-friendly WebGUI all in one densely packed 3U 16-drive rackmount system.

The UltraStor ES3160 FS uses sixteen (16x) hot-swappable disk trays with up to 32 Tbyte and is expandable up to 60 Tbyte total storage capacity (raw) via three (3x) ES3160 JS enterprise JBOD storage systems with SAS hard drives. The scalability of ES3160 FS helps administrators to add more storage capacity as their business grows, and lowers IT maintenance cost, simplifies operations and improves resource utilization. Equipped with auto disk spin-down and powered by redundant 80-Plus green power supply, the UltraStor ES3160 FS helps businesses reduce downtime and decrease energy consumption. The ES3160 FS is compatible with VMware ESX 3.5 and vSphere 4.0 servers, which allow users to take advantage of storage virtualization, further reducing the investment on hardware and servers resulting in an immense savings on total cost of ownership. Users will appreciate the UltraStor ES3160 FS easy-to-use Web-based cross-platform RAID management and monitoring system with event log, email notification and easy configuration.

Enhance Technology, Santa Fe Springs, CA. (562) 777-3488. [www.enhance-tech.com].

Ruggedized XMC Module Provides +28V General Purpose I/O Extreme Engineering Solutions is now shipping the XPort9100, a ruggedized XMC module that supports eight +28V general purpose input/output (GPIO) channels, commonly used to control subsystems within military aircraft and vehicles. The XPort9100 is designed for use in avionics, as well as ground vehicle and shipboard applications, to control subsystems such as fire control and target acquisition systems. The XPort9100 features include eight avionics-level (+28V) GPIO channels. Each GPIO is configurable as either an input or an output and each I/O signal is optically isolated. For this conductioncooled XMC form factor, each input channel of the XPort9100 can be configured to generate an interrupt, and each output channel is capable of pulse-width modulation (PWM).

30-Watt DC/DC Converter Provides 4:1 Input ConTech, a division of Calex, has announced the “KMW” Series of DC/DC converters. The KMW Series offers up to 30 watts of fully regulated output power with an industry standard 2 x 1.6-inch footprint. The series offers a 4:1 input range with nominal input voltages of 24VDC and 48 VDC. Single outputs offered are 3.3, 5, 12 and 15 VDC. Dual outputs are +/-12 and +/-15VDC. The operating ambient temperature range of the KMW is -40° to 50°C with no de-rating. The unit is encapsulated with a thermally conductive potting compound in an anodized aluminum case for improved thermal performance in still air environments. Pricing for the KMW Series is as low as $27.58/each.

ConTech, Concord, CA. (925) 609-1193. [www.contech-us.com].

Extreme Engineering Solutions, Middleton, WI. (608) 833-1155. [www.xes-inc.com].

Digitally Controlled 400-Watt Power Supplies Gone are the days when military specs were the only game in town as a measure of reliability and performance. Medical power supplies for example have a nice overlap with the requirements of military power supplies. TDK-Lambda Americas has extended the power range of their digitally controlled EFE-M series of medical/ITE power supplies from 300W to now 400W. With a 4kVAC reinforced input to output isolation and an output-to-ground isolation of 1500 VAC, the EFE400M meets the rigorous international safety standards of IEC/UL 60601-1 for medical equipment. Regulated DC outputs of 12V, 24V, or 48 VDC are standard, plus other voltages can be provided.

With a 3.5 x 6.5-inch footprint and less than a 1U profile, the EFE400M can be incorporated easily into designs where space is limited so the end product can be smaller and cooler. Other features such as a redundant operation capability, a standby voltage output and ITE safety certifications per IEC/UL 60950-1, make the EFE400M equally suitable for high-integrity applications. The EFE400M delivers 400W continuous power and up to 475W peak for 10 seconds. And non-standard output voltages can be accommodated easily by precise factory programming. The EFE400M series is available now with prices starting at $224 each in 250 piece quantities.

TDK-Lambda Americas, San Diego, CA. (619) 575-4400. [www.us.tdk-lambda.com]. [ 68 ] COTS Journal January 2011

COTS Products Get Connected with companies and products featured in this section. www.cotsjournalonline.com/getconnected

Rad-Tolerant PMC Provides Gbit Ethernet Data Transport to CPU Ethernet has become popular throughout the military and aerospace realm. And now even space-based applications are making use of it. Aitech Defense Systems now offers the S750, the space industry’s first COTS, radiation-tolerant, Layer 2 Gigabit Ethernet switch PCI mezzanine Get Connected companies and products featured in this section. cardwith (PMC) that quickly and reliably transfers Ethernet data to and from GbE www.cotsjournalonline.com/getconnected NIC end-points and the host CPU. With onboard memory and key function redundancy implemented in a rad-hard FPGA, the new PMC is specifically designed for harsh space environments including low earth orbit (LEO), Mars terrestrial and geostationary earth orbit (GEO). The S750 features up to four 100/1000BaseT, full duplex Ethernet ports and one emulated virtual network port for network access to the SBC network stack via the local PCI bus.

1000Base-X is available as an option. In tandem with the S750 TMR (triple modular redundancy) FPGA architecture, the S950 also delivers onboard flash and SDRAM memory redundancy to ensure low latency Ethernet transfers and outstanding data integrity.

Enabled immediately at power-up, the S750/S950 mated pair allows the space-rated SBC to quickly manage GbE switch ports and data via the SBC’s RS-422 UART console port and the virtual port.

The switch configuration can be stored in the S950 non-volatile user flash memory so it can be reloaded across power cycles to reduce management complexity. The low single event upset (SEU) rate and low power consumption of less than 8W provide added system reliability. The S750 PMC features an 8 Mbyte no-overhead, direct memory addressable buffer allocated in the SBC SDRAM.

Aitech Defense Systems, Chatsworth, CA. (888) 248-3248. [www.rugged.com].

Compact 300-Watt 3 x 5-inch Switcher Comes in Five Models

A new Series of 300-watt HighDensity / HighEfficiency switching power supplies in a compact 3.00 x 5.00 x 1.34� open-frame package comes in five models. The VHD300 Series from PowerGate comes in versions with main output voltages ranging from 12-48 VDC and auxiliary outputs of 5VSb at 1A and 12V Fan at 1A. All models of the VHD300 family feature Remote On/Off Control; DC OK Signal; Universal AC Input (90-264 VAC); High Efficiency operation up to 89%; Active Power Factor Correction for EN61000-3-2 Class D compliance; Full load operation up to 50°C with 20 cfm airflow (150 watts convection cooled); and Reliability in excess of 100k Hours. The series has been qualified for Class B Emissions and is safety approved to UL/cUL 60950-1, EN60950-1 standards and bears thev CE Mark.

Pricing starts at $76 in 500 piece quantities.

PowerGate, Santa Clara, CA. (408) 588-1751. [www.powergatellc.com].

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XEMBEDDED

PHONE: (734) 975-0577 WEB: www.xembedded.com

XVPX-9400 Raid Controller Module

XVPX-9425 VPX PMC/XMC Carrier Module

The XVPX-9400 is a 3U VPX RAID controller capable of supporting up to eight SAS/SATA hard drives. It accommodates on-board storage of user-defined parameters, BIOS and mirroring data. The module includes a PMC/XMC site using PCIe, as well as front panel status indicator lights for each supported drive for easy recognition. This product is available in air-cooled, conduction-cooled and with REDI covers.

The Xembedded XVPX-9425 VPX Mezzanine Carrier board provides 25 Watts of power (3.3 and 5VDC) for the on-board PMC/XMC site, accommodating either high-powered PMC I/O or FPGA modules. The XVPX-9425 offers front and rear panel I/O support in a single, standard 3U VPX slot. The XVPX-9425 is ideal for use in high-performance industrial, COTS, and MIL-AERO VPX systems that require very high performance I/O expansion using PMC or XMC modules. This product is available in air-cooled, conduction-cooled and with REDI covers.

Established as Xycom in 1969, Xembedded has led the market in VMEbus processor and I/O design for over 25 years. Having expanded our offering to include other embedded products including VPX, we changed our name to Xembedded to better reflect our capabilities. Our boardlevel solutions are used in Military, Aerospace, Homeland Security and thousands of Industrial applications around the globe. We also offer our core-competency of embedded product development to companies seeking legacy replacements or custom designs.

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6U VME Single Board Computer with Multifunction I/Owith companies and products featured in this section.

Get Connected

A 6U, VME Single Board Computer (SBC) combines multifunction and communications I/O options. The 64EP3 www.cotsjournalonline.com/getconnected from North Atlantic Industries effectively eliminates the need for a separate SBC for I/O-intensive system applications.

The processor provides real-time, intelligent sensor data acquisition and local data management operations such as analysis, algorithm manipulation and control of all I/O functions. It also supports direct data management and distribution between dual Gigabit Ethernet and communication interfaces such as MIL-STD-1553, ARINC 429/575, RS-232/422/485 and CANBus. The 64EP3 includes four module slots for numerous mix-and-match configurations from a wide selection of multifunction I/O and communication modules. The available I/O functions include A/D, D/A, Discrete/TTL/ CMOS/Differential I/O, RTD, Synchro/Resolver/LVDT/RVDT Measurement and Simulation and Encoder/Counter.

Available communication functions include MIL-STD-1553, ARINC 429/575, RS-232/422/485 and CANBus. The enhanced motherboard design, using multiple DSPs, enables higher processing power and dedicated control for each I/O module. The U3 Processor Module utilizes Freescale’s 1.25 GHz e500 core MPC8536 PowerPC processor, coupled with Wind River’s VxWorks 6.x BSP and NAI’s full complement of libraries; system integrators are given complete control over the development of their I/O systems using a total NAI solution.

North Atlantic Industries, Bohemia, NY. (631) 567-1100. [www.naii.com].

Desktop Comm Appliance Supports Atom D510/ D410/N450 Processors

Interface Module for Motion Control and Position Sensing

A new desktop communication appliance features a reset button that will change the system back to the manufacturer’s default setting, if required. The CAD-0210 from American Portwell is also suitable for customers who need 6 GbE ports and applications that require the high performance and low power consumption of Intel’s dual-core Atom D510 processor. It supports: fanless operation; up to 4 Gbyte DIMM with D510/D410 and up to 2 Gbyte DIMM with N450; 6 GbE ports (Intel 82583V) with two bypass segments; two SATA ports and one CompactFlash card slot; onboard RS-232 via an RJ-45 connector and two USB ports; one Mini PCI slot and one PCI slot; LEDS on front panel for Power and HDD status; reset and factory defaults button; a 12V 40W/60W DC adapter; and support for Wake-On-LAN (WOL) function.

A communications interface between digital encoders and SNAP PAC System I/O processors or programmable automation controllers provides two isolated serial synchronous inputs (SSI) for acquiring data from optical and mechanical encoders and other types of linear and rotary transducers.

Designed for use in motion control and other applications where tracking and identifying the movement and position of machinery or components is critical, the SNAP-SCM-SSI from Opto22 connects to and accepts input from either binary or Gray code encoders.

The module can be used with both SNAP PAC Ethernet (EB-series) and SNAP PAC serial (SB-series) I/O processors, standard SNAP PAC standalone and rackmounted controllers, and all SNAP PAC Wired+Wireless controllers.

Pricing starts at $295.

American Portwell Technology, Fremont, CA. (510) 403-3399. [www.portwell.com].

Opto22, Temecula, CA. (951) 695-3000. [www.opto22.com].

COM Express FPGA Starter Kit Provides Flexible I/O A new COM Express starter kit featuring the Altera Cyclone IV GX FPGA provides all the required components to evaluate board designs with open-definable I/Os. With this COM Express FPGA Starterkit from Kontron, OEM developers can get an immediate start in the development of FPGAbased, dedicated applications, thus reducing the overall R&D costs and time-to-market for purposebuilt platforms that rely on I/O unique to the application.

The main component in the kit is the COM Express FPGA Baseboard for pin-out Types 1, 2 and 10 COMs. The Altera Cyclone IV GX FPGA is designed into the carrier board and the specific I/Os are configured via enclosed IP bit streams. The configuration of the FPGA is possible through the enclosed USB-Blaster download cable, and the physical interfaces are brought about by two High Speed Mezzanine Cards (HSMCs); one Communication Board and one Mass storage and Video Board. An ATX PSU and mounting kit complete the elements of the Kontron Starterkit.

Kontron, Poway, CA. (888) 294-4558. [www.kontron.com].

[ 72 ] COTS Journal January 2011

COTS Products Ruggedized 3U Fibre RP R RPC PC12 Channel PC RAID System Phoenix International designs and builds rugged COTS Data Storage Systems that plug and play in any application -- from Multi-Terabyte Fibre Channel RAID and Storage Area Network configurations to plug-in Solid State Disk Drive VME Storage Modules.

GPU Expansion System Leverages PCIe Cabling One Stop Systems (OSS) offers a 2U expansion enclosure that provides four or eight PCIe x16 Gen2 slots, two PCIe x16 cable interfaces, ample cooling, and an 850 watt power supply to support up to four GPU boards or other high-speed I/O cards, a two PCIe x16 Gen 2 host cable adapter, and two PCIe x16 one-meter cable. The system includes a system monitor (fans, temperature, voltage), dual redundant 850 watt power supplies, one or two PCIe x16 Gen 2 host cable adapters and one or two 1 meter PCIe x16 cables.

Operating temperature range is 0° to 35°C while storage temperature is -40° to 85°C. The unit operates in 10 to 90 percent relative humidity (non-condensing) and operates at 0 to 10,000 feet.

Low Operational Temperature -20° C

High Operational Temperature +60° C

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One Stop Systems, Escondido, CA. (760) 466-1646. [www.onestopsystems.com].

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MIL-STD-1553 Modules for Embedded Systems

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The magazine of record for the embedded computing industry

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Programmable Automation Controllers Merge PLC and PC

10 Gbit Ethernet Rolls Into Satcom, Radar and Comms

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Two new versions of MIL-STD-1553 bus modules are being made available to interface avionics and weapons subsystems to an embedded control system. Acromag’s IP570 is an Industry Pack ANSI/VITA-4 card that plugs into VME, CompactPCI and PCI bus mezzanine carrier cards Untitled-3 or high-performance single board computers. The company’s IOS-570 models are designed for use within Acromag’s I/O Server industrial PC, a small fanless box computer. Both 1553 bus modules offer the choice of one or two interface channels.

A DDC Micro-ACE device controls the 1553 interface. Extended temperature models support -40° to 85°C operation.

All models feature a DDC Micro-ACE bus terminal that supports both MIL-STD-1553 revision B and MILSTD-1760 transceivers, as well as the STANAG 3838 protocol. Users can choose from models with one or two complete dual-redundant interface channels. Each channel can be wired for either direct or transformer coupled operation and operates at data rates of up to 1 Mbit/s. The DDC Micro-ACE controller provides a flexible host-side interface that is compatible with Mini-ACE or ACE architectures and supports multiple configurations (bus controller, remote terminal, or bus monitor). Users get a highly autonomous bus controller with many powerful capabilities and options. Acromag offers several programmer support tools. A Windows development package provides API development software and Win32 DLL drivers, plus examples for C, Visual Basic, .Net and LabVIEW environments. Single quantity pricing starts at $1,695.

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Acromag, Wixom, MI. (248) 295-0310. [www.acromag.com].

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First PCI Express 3.0 Switch Chips Roll PCI Express is among the leading switched fabric technologies under consideration in military embedded systems.

The industry’s first PCI Express 3.0 (PCIe Gen 3) switches Get Connected with companies and products featured in this section. have begun to become available as www.cotsjournalonline.com/getconnected samples from PLX Technology. Each of the six new Gen 3 switches is designed to upgrade today’s widely deployed PCIe-based systems including computing and communications platforms. The new PLX ExpressLane PCIe Gen 3 switch family, designed on 40nm process node, includes broad lane counts ranging from 12 to 48 lanes. Board and system designers can take full advantage of the latest PCIe specification—8 Gbit/s in both directions (Tx/Rx), per lane—thus enabling one PLX 48-lane Gen 3 switch to handle an astounding 96 Gbit/s of full peer-to-peer bandwidth.

PLX’s Gen 3 switches also offer hot-plug controllers, virtual channels and a non-transparent (NT) port feature, which enable the implementation of multi-host systems in communications, storage and blade server applications. PLX PCIe Gen 3 switches include software-driven on-chip hardware debug and monitoring features such as measurement of the SerDes eye inside the device; PCIe packet generation to saturate x16 Gen 3 port; injection of error in live traffic; error logging; port utilization count. Volume pricing ranges from $40 to $80.

PLX Technology, Sunnyvale, CA. 408) 774-9060. [www.plxtech.com].

HP Fiber to RS-232 Converters Now Include 2-Pin Euro Power Supplies

Hybrid Flat Panel USB Controller Board Does Ethernet and Wireless

Electro Standards Laboratories offers Fiber 232 Models 4137EU and 4139EU with 2-pin European power supplies. These HP VersaLink Fiber to RS-232 Converters are used to connect fiber optic linked terminals to a controller having an RS-232 interface port. HP Fiber to RS-232 Converters convert RS-232 Serial Communication Interface to HP Versatile Link Plastic Core Cable providing full galvanic isolation (no metallic connection) between connected devices. This allows the interference-free fiber optical transfer of data to be utilized by the device having an RS-232 interface, featuring a data transfer rate up to 120 Kbit/s (enhanced RS-232). Model 4137EU uses an RJ45 connector and Model 4139EU has a DB9 connector for RS-232 connection.

A controller board family for rugged flat panel solutions is available in four basic versions from Display Solution.

Innovative control via Ethernet or USB / WUSB (Wireless USB) for displays is now possible.

The d.screen Hybrid controller supports resolutions up to FullHD/WUXGA/QWXGA, allows one to connect up to six additional LCD displays without an extra graphic card, and is based on DisplayLink’s latest chip generation. It includes an Onboard USB Hub to connect up to three additional USB devices. Its high efficient power supply of 5V or 12/24V, the Ethernet 10/100/ Gigabit or USB2.0/WUSB interface and optional DVI/RGB output interface allow the development of outstanding modern TFT applications. For Touch applications, an onboard optional Touch Controller for 4- or 5-wire resistive Touch Screens can be offered.

Electro Standards Laboratories, Cranston, RI. (401) 943-1164. [www.electrostandards.com].

Display Solution, Gilching, Germany. +49 (0) 81 05 - 73403-0. [www.display-solution.com].

L-Band RF Tuner Integrated with Virtex-6 FPGA An L-Band RF tuner and dual digitizer module incorporates an onboard Xilinx Virtex-6 FPGA. The instrument targets reception and processing of digitally modulated RF signals such as satellite television and terrestrial wireless communications. The Model 71690 from Pentek requires only an antenna and a host system, such as a personal computer, to form a complete L-band SDR development platform. The 71690 RF tuner and digitizer module is capable of directly receiving and digitizing signals in the 925 MHz to 2175 MHz (L-band) frequency range with a dynamic range of -75 dBm to 0 dBm. Dual 16-bit, 200 MHz ADCs synchronously sample the I and Q signals, passing them to a Xilinx Virtex-6 FPGA for processing tasks such as demodulation, decoding and decryption. Customers can choose from a variety of FPGAs, including the LX130T, LX240T, LX365T, SX315T and SX475T. The 71690’s native form factor is a ruggedized XMC module.

It can also be implemented in PCI Express (Model 78690) and VITA 65 3U VPX (Model 53690) form factors. ReadyFlow software support for the Model 71690 includes drivers for Windows and Linux platforms, as well as future support for VxWorks. Pricing starts at $9,995.

Pentek, Upper Saddle River, NJ. (201) 818-5900. [www.pentek.com].

[ 74 ] COTS Journal January 2011

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Lind Electronics, Inc......................... 4.................... www.lindelectronics.com

Arbor Solutions................................ 4...................... www.arborsolution.com

Mercury Computer Systems.........26,27........................... www.mercury.com

Ballard Technology........................... 5.......................... www.ballardtech.com

Products BittWare......................................... 18,19........................... www.bittware.com

End of Article Ocean Server Technology............... 58...................... www.ocean-server.com

CM Computer.................................. 80................................ cmcomputer.com

One Stop Systems........................... 77.................www.onestopsystems.com

Get Connected with companies 7. and CMD/Systel. ..................................... ................................... sysstelusa.com

PDI...................................................

16....................................www.ncpdi.org Get Connected

products featured in this section. www.cotsjournalonline.com/getconnected congatec..........................................

51................................www.congatec.us

Pelican Products, Inc...................... 31................................www.pelican.com www.cotsjournalonline.com/getconnected

Curtiss-Wright Controls

Pentek, Inc.....................................32,33............................. www.pentek.com

Electronic Systems........................52,53.....www.cwcelectronicsystems.com

Phoenix International...................... 73............................. www.phenxint.com

Data Bus Products Inc..................... 43................ www.databusproducts.com

PICO Electronics, Inc.................... 37,61...........www.picoelectronicsinc.com www.cotsjournalonline.com/getconnected

www.cotsjournalonline.com/getconnected Elma Bustronic Corp....................... 25.................... www.elmabustronic.com

PLD Applications............................. 23.................................... www.plda.com

ELMA Electronic Inc......................44,45......................www.acttechnico.com

Recom Power.................................. 63...............................recom-power.com

Extreme Engineering Solutions, Inc.............48,49.............. www.xes-inc.com

RTD Embedded Technologies ......... 2........................................www.rtd.com

FGPGA Processing Boards & Power Conversion Products Gallery......56,57

Real-Time&Embedded Computing Conference .........60....... www.rtecc.com

Garrettcom ..................................... 62..........................www.garrettcom.com

SynQor Inc....................................... 69................................ www.synqor.com

GE Intelligent Platforms................. 10,11................................www.ge-ip.com

Themis Computer..........................40,41............................. www.themis.com

Innovative Integration...................... 59................... www.innovative-dsp.com

VersaLogic Corporation.................. 17...........................www.versalogic.com

ISI Nallatech Inc.............................. 24.............................www.nallatech.com

VICOR............................................30,79.......................www.vicorpower.com

Kontron America...........................38,39............................www.kontron.com

Xembedded, Inc............................70,71..................... www.xembedded.com

Get Connected with companies and products featured in this section.

Index

North Atlantic Industries...............64,65.................................. www.naii.com

with companies mentioned in this article.

Get Connected with companies mentioned in this article.

COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 250, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices.

POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 250, San Clemente, CA 92673.

Coming Next Month Special Feature: Target Report: 10 Technology Hurdles Facing the Military Electronics and computing, more than any other realm of technology, are what give today’s warfighters the edge they need to succeed in their mission. But the task of adapting the latest and greatest advanced electronics to suit military needs is not without challenges. System designers are trying to squeeze more functionality into existing spaces or the same capabilities into smaller platforms. This special Target Report section explores the top 10 hurdles the military faces in accomplishing those goals. Topics include compute density, system cooling, power management, component obsolescence and more.

Tech Recon: Power Supply Trends for Board and Box-Level Systems There’s no avoiding the trend toward processors and other key components ramping up in wattage. And more power means more challenges dissipating heat. Rugged board and box-level systems using VPX, CompactPCI and non-standard form factors are now available that address these problems themselves. Exotic techniques such as spray-cooling and liquid-cooling are all on the table as possible ways to attack the cooling challenge.

Articles in this section touch on all these present-day and future cooling solutions.

System Development: SatCom and Networking on the Move Now that all tactical vehicles are up-armored to protect our soldiers from IEDs and other threats, the pressure is on to reduce the weight budget left over for the electronics aboard vehicles. For SATCOM On-the-Move systems, that means systems integrated into a much smaller volume, compared to the current-generation systems. System designers are consolidating their architectures relying heavily on server computer blades and subsystems in 1U form factors and/or CompactPCI. This section examines the efforts underway to accomplish mobile satellite comms in half the space, and considerably less weight.

Tech Focus: Conduction-Cooled Compact PCI Boards The CompactPCI embedded form factor has achieved the maturity and broad product range that military system designers so crave. Now well into its second decade of existence, the 3U flavor of cPCI is particularly attractive to space/weight-constrained applications like avionics. This Tech Focus section updates readers on cPCI trends, and provides a product album of representative conduction-cooled 6U and 3U cPCI boards. [[ 76 76 ]] COTS COTS Journal Journal January 2010 2011

COTS

Editorial Jeff Child, Editor-in-Chief

Time, Convergence and SWaP

T

here’s no doubt that the beating heart of today’s military innovation is the advanced level of technology at the computing core of systems. Faster, denser processors, memories and higher bandwidth interconnect fabrics are huge enablers pushing forward the functionality that next-gen defense systems are hungry for. Board- and box-level systems that package those technologies are a central focus for COTS Journal because naturally those are the products that have the most frequent cycles of innovation. Also important are technologies that support that computing core—everything from power supplies to displays to enclosures to clock generators. Those supporting technologies are more evolutionary in the kinds of technology steps forward they take—quite unlike the frantic cycle of Moore’s law that fuels things like processors and memory ICs. What’s changed in recent years is that demand for lowering the size, weight and power (SWaP) of military electronic systems has moved to the top of many design requirements. And that’s put a greater emphasis on the supporting technologies outside the computing core. With that in mind, we’ll be keeping a close eye on those supporting technologies that are key to addressing design hurdles like SWaP and others. Two recent examples of breakthrough technologies along these lines—at opposite ends of the spectrum—are Symmetricom’s new commercialized Chip Scale Atomic Clock (CSAC) device and Curtiss-Wright Controls Electronic Systems’ new CoolWall technology for thermal management of rugged embedded computing enclosures. Both exemplify advances forward in technology segments that don’t often see great leaps forward, but that address SWaP needs head on.

The Symmetricom SA.45s Chip Scale Atomic Clock (CSAC) is based on the fruits of a DARPA-initiated program to create a small component-level atomic clock device. The goal of the DARPA program was to enable ultra-miniaturized (wristwatch in size) and ultra-low-power time and frequency references for high-security UHF communication and jam-resistant GPS receivers. The Symmetricom team won the DARPA CSAC competition and decided to commercialize the technology under its own investment.

The device consumes only 115 mW of power compared to the 10W or more of current generation atomic clocks. Because of its small size and high thermal isolation, the SA.45s CSAC warms up in less than 110 sec, compared to 8 minutes or more for conventional atomic clocks. And it has approximately1/30th the volume and 1/14th the weight of previous clocks. The device relies on the convergence of not only chip packing design, but also microelectromechanical systems (MEMS) and tiny vertical-cavity surface-emitting lasers (VCSELs). The significance of this for military applications is [ 78 ] COTS Journal January 2011

that it allows portable systems with advanced timing.

A critical application example along such lines is dismounted (backpack) IED jammers. IED explosions represent the largest cause of casualties in the current U.S. conflicts. Jammers are used to jam the wireless signals used to detonate Improvised Explosive Devices (IEDs). First generation IED jammers—used in Iraq—were vehiclemounted. But because 70 percent of all patrols in Afghanistan are on foot, there’s a need for smaller dismounted jammers. These devices need atomic clock electronics so they can be synchronized to allow friendly communications, while blocking detonation signals. CSAC precision enables synchronization, while its low power consumption reduces the amount of batteries needed to power the jammer.

Switching gears now to the realm of electronic system enclosures, a recent example of enabling technology is Curtiss-Wright’s patent-pending CoolWall technology. The technology comprises a unique thermal metallic composite core housed within a structural metallic composite shell. It uses a mixture of metal composites to deliver enhanced thermal performance combined with the structural characteristics required for rugged applications. Test results of the technology, using the company’s baseplate-cooled Hybricon SFF-6 enclosure, showed a 2.4x increase in thermal conductivity at the chassis level (2.4x decrease in sidewall temperature rise) along with a 10 percent weight decrease as compared to aluminum construction. The initial test results showed a 9°C temperature rise of the chassis rails at 67W/slot power dissipation. To address a variety of requirements, the technology can be flexibly optimized to modify the balance of its optimization of thermal management or weight reduction.

The electronic system enclosure segment isn’t an area known for frequent advances. But the military market has its eyes open for solutions that suit this new era of design where SWaP is a priority.

Advances like CoolWall are expected to be critical for enabling embedded computing architectures like OpenVPX to successfully deploy into military systems. While OpenVPX offers a wide range of aspects that the military is demanding, the hard truth is that today’s embedded computing systems are huge power hogs. And even as lower power processors emerge, many military applications—like radar—will always want to pack more compute density into the same or smaller space. As a result, enclosures that handle greater levels of thermal output will be vital.

While the computing core remains the center of the embedded military universe, it’s clear that supporting technologies are becoming an ever more important part of the puzzle. To best serve your needs, we’ll keep our eyes out for the ones that solve the issue you face as you try to squeeze more functionality into existing spaces or the same capabilities into smaller military platforms.

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Visit www.cmcomputer.com or contact us at info@cmcomputer.com to request our latest Chassis Catalog.