COTS Journal

October 2016, Volume 18 – Number 10 • cotsjournalonline.com

The Journal of Military Electronics & Computing JOURNAL

Military Comms Wrestles with Scalability Challenges THREE STEP APPROACH TO AVIONICS SYSTEM DEVELOPMENT EXCLUSIVE Q&A: WHEN RF AND DIGITAL WORLDS COLLIDE DATA SHEET: HI REL POWER SUPPLIES

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The Journal of Military Electronics & Computing JOURNAL

CONTENTS

COTS (kots), n. 1. Commercial off-the-shelf.

Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements.

—Ant. When applied to the procurement of electronics for he U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

August 2016 Volume 18 Number 8

FEATURED p.10 Network and Comms Advances Serve a Connected Military SPECIAL FEATURE Scaling Up Military Comms and Networking Systems 10

Network and Comms Advances Serve a Connected Military Internet Transport Protocols Contend for Military Interconnect Role

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10/40 Gbit Ethernet Switching Poses Unique Board Design Hurdles

Shepard Siegel, Atomic Rules

AUSA and a Multi-domain Future

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The Inside Track

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COTS Products

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Marching to the Numbers

Thierry Wastiaux, Interface Concept

TECH RECON Avionics System Development Strategies Three Stage Process Speeds Path to Avionics System Deployment

Coming in November See Page 48

Wayne McGee, CES--North America

SYSTEM DEVELOPMENT Integrating RF Electronics and Computing 28

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Jeff Child

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DEPARTMENTS

EXCLUSIVE: Expert Weighs in on RF/Digital Integration Challenges Ken Karnofsky, Mathworks

On The Cover: The DoD’s 2017 budget request asks to fund completion of GPS III Space Vehicle (SV) 01 and 02 for available launch activities. GPS III will have a more powerful M-code (military) signal. Shown here a ULA Atlas V rocket blasts off carrying the Air Force’s GPS IIF-10 satellite in July 2015. (Photo: United Launch Alliance)

DATA SHEET High Rel Power Supplies Roundup 30 Power Supplies Bulk up for High Reliability Work Jeff Child

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High Rel Power Supplies Roundup

Digital subscriptions available: cotsjournalonline.com

COTS Journal | October 2016

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JOURNAL

The Journal of Military Electronics & Computing

Editorial

EDITOR-IN-CHIEF Jeff Child, jeffc@rtcgroup.com EXECUTIVE EDITOR Johnny Keggler, johnnyk@rtcgroup.com SENIOR EDITOR John Koon, johnk@rtcgroup.com

WESTERN REGIONAL SALES MANAGER John Reardon, johnr@rtcgroup.com (949) 226-2000 EASTERN REGIONAL SALES MANAGER Ruby Brower, rubyb@rtcgroup.com (949) 226-2004

Finance

COTS Journal HOME OFFICE The RTC Group 905 Calle Amanecer, Suite 150 San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050 www.rtcgroup.com

MANAGING EDITOR James Pirie, jamesp@rtcgroup.com

CONTROLLER Cindy Muir, cindym@rtcgroup.com (949) 226-2000

EDITORIAL OFFICE Jeff Child, Editor-in-Chief Phone: (603) 429-8301

Art/Production

Publisher

PUBLISHED BY THE RTC GROUP Copyright 2016, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.

ART DIRECTOR Jim Bell, jimb@rtcgroup.com GRAPHIC DESIGNER Hugo Ricardo, hugor@rtcgroup.com

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COTS Journal | October 2016

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EDITORIAL Jeff Child, Editor-in-Chief

AUSA and a Multi-domain Future

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arlier this month I trekked down to Washington D.C. to attend the annual Association of the United Systems Army (AUSA) show. There’s certainly been a shift happening in the past couple years to where AUSA has become the stand-out event that nearly every significant technology vendor in COTS Journal’s industry is an exhibitor. That trend reached a point this year whereby it was easier to name which companies where not at the show than to list the many that were there. At the same time, AUSA is one of those rare events where there’s a nice representation of the company’s where COTS Journal’s readers work—the defense primes—exhibiting alongside the embedded computing, power supply and other technology vendors that make up the industry we cover.

For me, as always, the show was an excellent opportunity to meet with all those companies, but also to attend the many keynotes, panels and sessions where key Army and DoD leaders shared their visions and concerns. Several key DoD and Army leaders weighed in during an Institute of Land Warfare contemporary military forum at AUSA on the topic of how technology must enable the shift to a multi-domain future of warfare. During this forum, Deputy Defense Secretary Robert Work explained that enemies will challenge the U.S. in all of the domains of warfare, including space and cyberspace. U.S. troops will confront enemies with better weapons, more accurate munitions, and electromagnetic and cyber capabilities that will threaten U.S. communications and may jam global positioning systems, imaging radars and other electronic capabilities that U.S. forces have come to rely upon.

To maintain superiority, Work and other senior military leaders are advocating “multidomain battle.” That means pushing each of the services to expand its capabilities well beyond the traditional spheres of operations. The Army, for example, might use rocket artillery based ashore to attack enemy ships at sea. Submarines might be used to conduct anti-air warfare, and all of the services will have to become adept at using cyberspace, Work said. Just as U.S. forces learned to use night vision to own the hours of darkness, now they must learn how to own the electromagnetic night, The panel of senior U.S. commanders in the forum described multidomain operations as a way to overwhelm adversaries who have become proficient in one or two domains. Multidomain warfare promises to transform the military much as the emphasis on jointness did 30 years ago. Navy Adm. Harry B. Harris, commander of U.S. Pacific Command, said all of the services will have to learn to operate on all of the domains: land, sea, under sea, air, space and cyberspace. As an example, he said he would like to see the Army sink a ship, shoot down

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a missile, and shoot down the aircraft that launched it—and do it all nearly simultaneously.

Another favorite talk for me at this year’s AUSA was a panel of defense and private sector officials entitled “Modernization: Addressing Today’s Threat & Ensuring Tomorrow’s Readiness; Perspectives from Government and Industry.” The main theme was addressing how technology and potential adversaries are changing rapidly while the defense procurement process is historically slow. Lead speaker on the panel Katrina McFarland, the acting assistant secretary for acquisition, logistics and technology, said the Army is “looking at where we can create more agile technology”. She said that the majority of contracts don’t have the flexibility to meet the current security environment needed. “We need to find ways we can keep up with technology.”

McFarland appealed to industry representatives in the audience to help the Army work through this challenge and providing ideas of capabilities they can procure. But my ears definitely perked up when she also called upon the industry to produce systems with “open architecture” that allows for quicker and cheaper updating of the technology. Open architecture computing technology and standards are of course the lifeblood of COTS Journal’s community of vendors. So I was pleased to hear the call for open architectures at such a high level in front of that large forum.

Hitting another theme that intrigued me, panelist Lt. Gen. Gustave F. Perna, the deputy chief of staff G-4, said soldiers in the field must be able to maintain all the Army’s equipment and not have to depend on contractor support. “We need to be able to sustain the things you give us,” he said. “If it can’t be sustained by a soldier, it’s probably not something we should have.” That to me speaks to importance of military gear that hides the computing and networking complexity from the user, and enables the warfighter user to focus on his or her mission. That again is a place where well design embedded systems and concepts like second-level maintenance—both deep within our embedded industry’s wheelhouse—can make a real difference.

It’s fair to say that for the U.S. DoD Open architecture approaches enjoyed a generous amount of lip service for many years. But over the past year in particular open standards that have been long in the works have broken down the last vestiges of resistance. System standards like FACE and computing architectures like OpenVPX are finding acceptance among airborne programs. The reduction of costs and complexity of the open approach are just too attractive to ignore. It pleases me to see open architecture touted by high level Army leaders and others.

The

INSIDE TRACK JLTV Taps Power Controller Technology from Data Device Corp.

Data Device Corp. (DDC) has been awarded a contract by Oshkosh Defense to supply SolidState Power Control (SSPC) Power Distribution Units (PDUs) and modules for the Joint Light Tactical Vehicle (JLTV) program. The JLTV incorporates dramatic electrical power utilization improvements that are readily served by the advanced management capabilities and higher reliability provided

by DDC’s battle proven Solid-State Power Control solutions (Figure 1).

DDC SSPCs enable network control, programmability, and autonomous operation—simplifying vehicle control and freeing

crew members’ time, so they can concentrate on mission critical tasks. They also provide channel paralleling, controlled rise/fall times, and I2T trip protection, to deliver accurate load protection and flexible power distribution.

DDC’s SSPCs also offer flexible control options, including CANbus and RS-485 interfaces, and a range of discrete controls. DDC SSPCs have a 25X improved MTBF compared with mechanical switches, breakers, and relays, with moving parts which are more prone to failure.

Data Device Corp. Bohemia, NY (631) 567-5600. www.ddc-web.com

SSPCs on the JLTV enable network control, programmability, and autonomous operation—simplifying vehicle control and freeing crew to concentrate on mission critical tasks.

AAR and Textron Team to Compete for USAF T-6 Support Contract

sites throughout the U.S. AAR helps the U.S. government and its allies increase efficiencies and decrease costs with its industry-leading integrated supply solutions including Contract Logistics Support (CLS), Government Performance-Based Logistics (PBL), Sustainment and ITAR

support. AAR’s award-winning fleet support teams ramp up quickly, colocate on customer sites as needed, and utilize AAR’s global network of warehouses and parts supply. AAR’s inventory control systems have easily integrated with numerous U.S. and foreign government procurement systems, maintaining the

AAR has established an exclusive team with Beechcraft Defense Company and Textron Systems to respond to the U.S. Air Force request for proposals to provide support for the Beechcraft T-6 military training aircraft (Figure 2) in the Joint Primary Aircraft Training System (JPATS) fleet under a Contractor Operated and Maintained Base Supply (COMBS) contract. Beechcraft Defense Company and Textron Systems will work together with AAR to compete for this contract that will provide parts and warehouse support for the U.S. Air Force, U.S. Navy, and U.S. Army JPATS. Beechcraft Defense Company will offer product expertise and factorydirect parts, while Textron Systems will provide warehouse labor at 10

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Figure 2 The Beechcraft T-6C is a military training aircraft purpose-built for a wide range of capabilities—from initial pilot screens to advanced operational training.

COTS Journal | October 2016

strictest data integrity standards.

AAR Wood Dale, IL (630) 227-2000 www.aarcorp.com

ACT R&D Contract Awards Reach Over $3 Million Advanced Cooling Technologies (ACT) has announced that it is continuing its rapid technology diversification through multiple R&D contract wins. In 2015 and early 2016 ACT was awarded over 15 new contracts, totaling more than $3 million dollars, through government-funded Small Business Innovative Research (SBIR), Small Business Technology Transfer Program (STTR) and Broad Agency Announcement (BAA) programs.

These contracts were awarded from several different government agencies, including DoE, DOD (Air Force,

The

INSIDE TRACK Army, Navy), and NASA. These contracts will enable development of innovative thermal management technologies and perform R&D in new areas that include corrosionresistant coatings, energy conservation, and unique test rigs.

The contract awards demonstrate ACT’s continued diversification into R&D areas such as combustion, power plant dry cooling, and advanced modeling. Many of ACT’s R&D programs are in collaboration with industrial and academic partners. The academic partners in the past year include: Columbia University, Drexel University, Florida State University, Lehigh University, Pennsylvania State University, Texas A&M, University of California, Merced, University of Maryland, and the University of Southern California.

Advanced Cooling Technologies Lancaster, PA (717) 295-6021 www.1-act.com

Lockheed Martin Gets Production Contract for Shipboard EW Upgrade The U.S. Navy awarded the Lockheed Martin an initial $148.9 million contract for full rate production of Surface Electronic Warfare Improvement Program (SEWIP) Block 2 systems with four additional option years to upgrade the fleet’s electronic warfare capabilities so warfighters can respond to evolving threats. Under this fullrate production contract, Lockheed Martin will provide additional systems to upgrade the AN/SLQ-32 systems on U.S. aircraft carriers, cruisers, destroyers and other warships with key capabilities to determine if the electronic sensors of potential foes are tracking the ship (Figure 3).

The SEWIP Block 2 System is the first sensor to be fully compliant with the Navy’s Product

Line Architecture strategy, which facilitates the rapid introduction of new technology into the fleet.

Block 2 is the latest deployed improvement in an evolutionary succession of “blocks”, which will incrementally add new defensive technologies and functional capabilities. Block 2 provides an upgraded antenna, receiver and improved interface with existing ship combat systems. Since 2009 when the design and development contract was awarded Lockheed Martin has been awarded Low Rate Initial Production (LRIP) contract for an additional 38 units and 22 of these units have been delivered to the Navy on schedule.

Lockheed Martin Bethesda, MD (301) 897-6000 www.lockheedmartin.com

General Dynamics Awarded Ohio Replacement Sub Development Contract The U.S. Navy has awarded General Dynamics Electric Boat a $101.3 million contract modification to continue development of the Common Missile Compartment for the Navy’s Ohio Replacement submarine and the United Kingdom’s Successor-class

Figure 4 AN/TPY-2 is a transportable X-band radar that protects civilians and infrastructure in the U.S., deployed military personnel, and allied nations from the growing ballistic missile threat. ballistic-missile submarine. The modification is for the procurement of 22 missile tubes to support the manufacturing of the Common Missile Compartment. Electric Boat is a wholly owned subsidiary of General Dynamics.

Initially awarded in December 2012, the five-year, $1.85 billion contract calls for Electric Boat to perform research and development work for the Navy’s next-generation ballistic-missile submarine, which is scheduled to begin construction in 2021. The potential value of the overall contract is $2.5 billion. The Columbia-class submarine is being designed to replace the Ohio-class ballistic missile submarines. The Ohio-class of submarines are aging and the first ship in that class is scheduled to be decommissioned in 2027 with the remaining scheduled to be decommissioned yearly following the first ship’s decommissioning.

General Dynamics Electric Boat Groton, CT (860) 433-3000 www.gdeb.com

Figure 3 SEWIP Block 2 provides upgrades the AN/SLQ-32 systems on U.S. Navy ships with key capabilities to determine if the electronic sensors of potential foes are tracking the ship.

Raytheon GaN Technology Chosen for AN/TPY-2 Radars The U.S. Missile Defense

Agency has awarded Raytheon a contract modification to develop a transition to production process to incorporate Gallium Nitride, or GaN, components into existing and future AN/TPY-2 radars. This initial effort will support the transition from Gallium Arsenide to GaN technology, which would further modernize the ballistic missile defense radar and drive down system obsolescence. As demonstrated in other Raytheon-developed military radar applications, Gallium Nitride has the capability to enhance range, increase detection and discrimination performance and lower production costs.

Currently fielded AN/TPY-2 radars use Gallium Arsenide (GaAs) based transmit/receive modules to emit high power radiation.

Raytheon and MDA are pursuing a retrofit approach to leverage Gallium Nitride elements. The AN/ TPY-2 is a transportable X-band radar that protects civilians and infrastructure in the U.S., deployed military personnel, and allied nations and security partners from the growing ballistic missile threat (Figure 4).

Raytheon Waltham, MA (781) 522-3000 www.raytheoncom

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SPECIAL FEATURE Scaling Up Military Comms and Networking Systems

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SPECIAL FEATURE

Network and Comms Advances Serve a Connected Military The military continues to enhance its next-gen communications and network gear—on land, in the air and in space. Challenges of scalability are being addressed by embedded solutions.

Jeff Child, Editor-in-Chief

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or more than a decade new the DoD has ramped up its efforts toward overhauling its networking and communications technology—advancing toward the goal of full interoperable operations. Although the term “network-centric operations” is less often voiced these days, that’s mostly because it’s become a given. Enhanced situational awareness and increased use of commercial technology is the focus of many of these technology development and funding activities. Defense communications technologies such as tactical radios and military satellite and network-centric communications are the key technologies driving this transition.

Both directly and indirectly the requirements of many of today’s U.S. military platforms are involved in communications or networking critical information between warfighters.

Net-centricity is a service-based architecture pattern for information sharing. Falling under the responsibility of the DoD’s Command, Control, Communications, Computer and Intelligence (C4I) community, the ongoing plan is building joint architectures and roadmaps for integrating joint airborne networking capabilities with the evolving ground, maritime and space networks. It encompasses the development of technologies like gateways, waveforms, network management and information assurance. Feeding the needs of those systems are next-generation embedded computing solutions—in the form of single board computers,

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SPECIAL FEATURE

Figure 1 Lockheed Martin’s Advanced Extremely High Frequency system includes AEHF-1, AEHF-2, and AEHF-3 (shown) which are in orbit and operating—with AEHF-4’s launch planned for 2017.

box-level systems and special-function subsystems—used to build sophisticated compute-intensive radio and network nodes— each suited for different environments, platforms and warfighter users.

Communications a Priority Despite this new era of tighter defense budgets many expect networking and comms related programs seem to survive reductions more than other segments. Part of that thinking is that in a reduced-sized military, the ability to do more situational awareness and reconnaissance becomes more of a priority when forces are smaller or in a less active mode. The systems span across all the branches, and include programs like the Advanced Extremely High Frequency (AEHF) satellite and Wideband Global Satellite (WGS). Airborne comms systems are playing a role too, with technologies such as Link-16. Other programs play closer to the user like Tactical Radios 12

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and the Warfighter Information Network – Tactical (WIN-T).

Among the major spaced-based DoD communications programs are the Advanced Extremely High Frequency (AEHF)5, AEHF-6, Space Based Infrared System (SBIRS) Geosynchronous Earth Orbit (GEO)-5 and GEO-6, and the upgraded GPS system: GPS III. Lockheed Martin’s Advanced Extremely High Frequency (AEHF) system.

AEHF will be a constellation of communications satellites in geosynchronous orbit that will replenish the existing EHF system MILSTAR satellite at a much higher capacity and data rate capability. It will provide 24-hour low, medium and extended data rate satellite connectivity from 65 N to 65 S latitude worldwide. AEHF-1, AEHF-2, and AEHF-3 (Figure 1) are in orbit and operational.

Meanwhile the launch of AEHF-4 is planned for 2017; AEHF-5 and AEHF-6 are scheduled to replace AEHF-1 and AEHF-2 at the end of their useful life. The program’s funding includes selected MILSATCOM Space Modernization Initiative (SMI) development activities which are focused on inserting new technologies to replace obsolete parts and materials and to improve capabilities.

Enhancing today’s existing GPS-II system, the GPS III space vehicles will be fully backward compatible with legacy signals while delivering new capabilities and enhancements to include a new Galileocompatible signal (civil), a more powerful M-code (military) signal, and the possibility to on-ramp future capabilities. The GPS Next Generation Operational Control System (OCX) will enable operational use of all modernized GPS signals, as well as enabling improved PNT performance. The 2017 DoD budget request calls for completion of GPS III Space Vehicle (SV) 01 and 02 for available launch activities. It also funds the technology development and lead platform integration of Military GPS User Equipment (MGUE) Increment 1.

WIN-T and Tactical Radios The Command, Control, Communications, Computers, and Intelligence (C4I) Systems segment of the DoD’s comms/networking plans tends to have the most direct relevance to the embedded computing market. Developments and deployments are

moving ahead for the Warfighter Information Network- Tactical (WIN-T), the Army’s high speed, high capability backbone C4ISR network, linking Warfighters in the battlefield with the Global Information Grid. WINT program development consists of four increments. Increment 1 (Inc 1) provides “networking at the halt” by upgrading the Joint Network Node (JNN) satellite capability to access the Wideband Global Satellite.

Increment 2 (Inc 2) provides networking onthe-move to the company level. Increment 3 (Inc 3) provides Integrated Network Operations development. General Micro Systems supplies the multi-domain boxes in several of all six of the WIN-T program’s ground vehicles. Themis Computer also supplies systems to the WIN-T program which were on board a WIN-T vehicle on display at this year’s AUSA 2016 show.

Among GMS’s latest offerings designed to serve WIN-T requirements is the SB2002SW “Blackhawk” switch/router. The system boasts 20 managed ports, 64 Gbytes of RAM, removable storage, Cisco routing software, and high-level security in compact sevenpound box. The Blackhawk server supports the Xeon D processor with hyper-threading for a total of up to 16 logical cores (32 threads) in a single SoC device—12 cores in the extended-temperature version. Each core operates at up to 2.5GHz and can turbo boost up to 3.1GHz. The product is part of product line of deployable, rugged, small form-factor server systems, based on the Intel Xeon D processor.

New WIN-T Inc 2 Capabilities Earlier this month General Dynamics Mission Systems announced that new and improved versions of two key Warfighter Information Network-Tactical (WIN-T) Increment 2 capabilities have begun the test and evaluation process at U.S. Army installations across the country. Integrated on HMMWVs (Figure 2) instead of five-ton FMTVs, both the Tactical Communications Node-Lite (TCNL) and the Network Operations and Security Center-Lite (NOSC-L) feature a greatly reduced footprint and improved transportability for expeditionary operations (C-130 rollon/roll off and CH-47 sling loadable).

The TCN-L and NOSC-L provide the same networking and network management capability to command posts while

SPECIAL FEATURE

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In addition to the embedded computing industry, NOVAsom is involved in the newest high level video technologies, including 4K displays. The 2 key differences that make us stand out are our 32/64 bit full architecture and the ability to provide interface to ANY display/sensor combination.

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Figure 2 Improved versions of two key WIN-T Inc 2 systems are integrated on HMMWVs instead of five-ton FMTVs. Both the TCN-L and the NOSC-L feature a greatly reduced footprint and improved transportability.

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reducing the complexity to install, operate and maintain the Army’s mobile tactical communications network. According to U.S. Army, the new capabilities provide a more agile network capability and greater expeditionary reach. And the smaller footprint will result in reduced maintenance and logistics costs—a crucial factor in today’s resourceconstrained environment.

Meanwhile in the tactical radio space— under the program name Handheld, Manpack, and Small Form Fit (HMS)—asks for funding that is necessary to execute the required full and open competition contract strategy for the Rifleman Radio and the Manpack radios. The budget request conducts testing for the Manpack and the Rifleman candidate products to demonstrate compliance with program requirements to assess effectiveness, suitability, and survivability and to obtain material release for Full Rate Production. It funds support safety, spectrum supportability, and other certifications necessary to prepare the products for fielding. Funding is also including for the procurement of the Rifleman and the Manpack Radios, support equipment, fielding, non-recurring engineering, and platform vehicle integration.

Link 16 and MIDS JTRS No discussion of military communications is complete without including Link 16 and MIDS and the transmission between the two. With a couple decades under its belt Link 16 was the first and is still today only communications data link that offers the interoperability and situational awareness required in all domains of the battlespace.

Link 16 is established as the prime tactical data link for U.S. and NATO forces and has been implemented through a diverse family of terminals (JTIDS / MIDS / URC-138) meeting all requirements of a variety of users, In 1996 BAE Systems and Rockwell Collins formed a joint LLC called Data Link Solutions pursue the next generation Link 16 applications.

DLS supplies of Link 16 terminals and software, with more than 3,000 Link 16 systems delivered. It also provided MIDS terminals for more than 40 different platforms in 28 different countries. And DLS is leading efforts to develop and test of the next generation of software defined MIDS terminals: MIDS Joint Tactical Radio System (JTRS) (Figure 3). The MIDS JTRS is a networked communications system providing a single chassis, multiple-channel radio that signifi-

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SPECIAL FEATURE

Figure 3 The MIDS JTRS is a four-channel JTRS radio that includes Link 16 and Tactical Air Navigation (TACAN) functionality.

cantly reduces the number of different and unique radios needed on the battlefield. The MIDS JTRS is a four-channel JTRS radio that includes Link 16 and Tactical Air Navigation (TACAN) functionality.

DLS achieved a couple milestones in those efforts late last year. SPAWAR awarded

DLS a contract to demonstrate the Multifunction Advanced Data Link (MADL) on the MIDS JTRS. The goal is to support the sharing of mission-critical data to further bridge the interoperability communications gap between fifth-generation stealth aircraft and fourth-generation fighter jets.

The enhanced communications capabilities will allow fourth generation jets to receive more detailed information to improve situational awareness across the battlespace. The demonstration used a MADL data link on a MIDS JTRS transceiver communicating with a fifth-generation stealth fighter reference implementation. DLS was also awarded a $51.8 million contract from SPAWAR MIDS JTRS to U.S. and coalition forces. This award included radios for U.S. platforms and Foreign Military Sales (FMS) customers.

BAE Systems Nashua, NH (603) 885-3653 www.baesystems.com

General Dynamics Mission Systems Fairfax, VA (877) 449-0600 www.gdmissionsystems.com General Micro Systems Rancho Cucamonga, CA. (909) 980-4863. www.gms4sbc.com Lockheed Martin Bethesda, MD (301) 897-6000 www.lockheedmartin.com Rockwell Collins Cedar Rapids, IA (319) 295-1000 www.rockwellcollins.com Themis Computer Fremont, CA. (510) 252-0870. www.themis.com

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SPECIAL FEATURE Military Applications for FPGAs and GPGPUs

Internet Transport Protocols Contend for Military Interconnect Role Internet technologies face some tradeoffs for interfacing real-time systems like radar. But there’s a strong argument to be made for an UDP-based architecture solution.

Shepard Siegel, CTO, Atomic Rules

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arge ground-based systems such as phased-array radars, SDR, and satellite ground stations generate massive amounts of data processed in real time using multicomputers. With hundreds or thousands of potentially heterogeneous compute nodes inter-communicating with each other, military systems engineers and engineering managers are accustomed to the challenge of finding the correct balance between potentially conflicting objectives. Throughput, latency, energy, standards, weight-of-implementation, ability to tech-refresh, and cost are just some of their concerns.

On a SWaP constrained platform, the less-significant communication concerns thin out very quickly. In such systems a specialty interconnection network task-suited for platform may be the only way to achieve demanding mission objectives. However, for ground-based, non-SWaP applications, tech evolution is well on its way to disrupt the assumption that internet transport layer protocols cannot be used for messaging.

Outside of the particular case of SWaP constrained systems, there’s a lot of disruptive interconnect changes afoot. With that in mind, this article showcases a real-life phased array radar system implementation example of what the future of military interconnect fabric might look like. What is infeasible today may become practical tomorrow through iterative refinements.

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COTS Journal | October 2016

Typical Radar Signal Processing Chain

PreProcessing

Coherent Processing/ Slow-Time Filter

Beamforming

Doppler Processing

Pulse Compression

CFAR Detection

Interconnect Capabilities Required: Communication AND Data Reorganization

Figure 1 Shown here are the six sequential steps of a typical radar signal processing chain.

Costs of Comms under Constraint Historically, to achieve higher system performance, emphasis has been on placed on individual computational blocks which comprise a system. For example, a typical Radar signal processing chain might be comprised of the these six sequential steps: (a.) Pre-Processing; (b.) Coherent Processing / Slow-Time Filter; (c.) Beamforming; (d.) Doppler Processing; (e.) Pulse Compression; and ( f.) CFAR Detection (Figure 1).

Great emphasis has been placed on optimizing the computational efficiency of these kernels, as the weakest link can ultimately limit system performance. This is obvious. What is more subtle is that the communication, which includes data reor-

ganization, has often been a second-class citizen “dictated-to” by the way in which each computational step consumes and produces data.

Systems engineers in a non-SWaP constrained space live this problem every day.

Not just balancing computation and communication; but also effectively managing the impact of memory access patterns.

Steps (b), (c), (d), and (e) above don’t simply need to communicate; they require a transpose in the 3D data set moved between them. To meet these challenges under tight SWaP constraints all but requires the use of lightweight, application-specific communication patterns.

SPECIAL FEATURE

Expense and Limited Reuse

Internet Protocol: A Path Forward

The result is that significant engineering expense in invested, often with limited reuse, in these application-specific communication patterns. This situation is not unique to radar (non-SWaP examples such as SDR systems also use custom protocols to transport data between servers). As a consequence, these high-performance specialized interconnects drive manufacturers to reengineer their multicomputer interconnect fabrics at each tech refresh. This increases R&D expenses, systems upgrade costs; and it slows down the pace at which new products and features may be brought to market.

That’s not to say you can’t have standards-based interconnect under SWaP. It’s just more difficult. Our industry has watched circuit-switched standards become displaced by packet-switched standards RapidIO, Infiniband and Ethernet. At the end of the day, even well-vetted protocols like JESD204 and VITA49 raise eyebrows if they adversely impact SWaP. Besides SWaP, there are other factors that favor a specialized, as opposed to a commoditized, interconnect.

Latency is perhaps chief among them. In application domains such as EW, getting a correct answer clock cycles ahead of an adversary is of obvious value.

Despite the aforementioned caveats on SWaP, and in some cases latency, there is terrific pressure to standardize on communication that can both scale-up and scale-out.

COTS vendors are eager to translate the economics of convergence—seen in the broader Internet in ubiquitous datacenter use-case— to domain- and mission- specialized applications. For the reasons given, developers have had the Internet Protocol (IP) Transport Layer 4 in their sights for some time. Migrating toward L4 would provide access to hierarchical scalability and redundancy (via the internets), robust multicast capabilities (via IGMP), and rich COTS component availability in silicon, switches and software.

However, migrating the interconnect architecture toward L4 has not been a practical solution. On one hand, Transmission Control Protocol (TCP) did not have the efficiency and throughput. On the other hand, User Datagram Protocol (UDP) did, but was simply not reliable enough. Fast forward to today, TCP still is fundamentally a low throughput protocol. However, modern transceivers Bit Error Rates (BER) have fallen dramatically. Forward Error Correction (FEC) can reduce the BER from 1 error every 100 seconds to 1 error every 3 years

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COTS Journal | October 2016

17

SPECIAL FEATURE

(Figure 2). This technology evolution disrupts the legacy assumption that UDP can be summarily dismissed for multicomputer messaging. Two factors, falling point-topoint BER and Software Defined Networking (SDN) lead the charge to make UDP stand up to the task.

Fueled in no small part by industry standards like IEEE 100 GbE and PCI Express

Gen 4, chip manufacturers, especially FPGA vendors, have been pressed to make exceptional SERDES transceivers. While PCIe Gen 4 “only” presses the SERDES to 16 Gbps; the CAUI-4 flavor of 100 GbE demands 25 Gbps across four physical lanes. These facts on the ground have essentially made 25 Gb/lane signaling a commodity on many devices.

For chip to chip applications, power

Figure 3 The XUSPS3 board serves up sixteen o28 Gbit SERDES on four QSFP28s facing the panel.

can be reduced to maintain a target BER. For backplane and chassis applications, direct-attached copper remains a low-cost option to optics. Few things come “for free” however, and with the extended reach the SERDES require increased drive power— significant when you may have hundreds or thousands of nodes). Designers of engineered Ethernet interconnects have the option of incorporating two different styles of Forward Error Correction (FEC) to reduce BER as well.

The Case for UDP The simplicity of UDP and its stateless transmission of datagrams comes at a cost beyond the aforementioned discussion of bit error rate. UDP datagrams, unlike TCP, have no inherent handshaking and therefore, no guarantee of delivery. A datagram may arrive out of order, late, replicated, or not at all. What you can count on, owing to frame-level Frame Check Sequence (FCS) protection and IP-level checksum protection, is that when a datagram arrives, it has arrived intact, that is to say its contents are not corrupt.

It’s not by mistake then that a wide range of networking services and applications are built on top of UDP. However some of these services and applications are not satisfied by the “good enough” of a particular BER or guaranteed Service-Level Agreement (SLA) for packet loss. This is an important point of divergence for System Architects.

Without UDP, for example with a lowerlevel Xilinx Aurora or Altera/Intel SerialLite interface, you are pretty much on your own to invent whatever protocol you need. This double-edged sword should on one hand 18

COTS Journal | October 2016

SPECIAL FEATURE

fulfill mission requirements, but essentially punts the leverage of using COTS infrastructure for switches, routers, and software.

An alternative is to use UDP, optionally with a supplemental scheme to deal with an imperfect channel. The old adage here is that once you begin this task, you are doomed to re-invent TCP. But this isn’t true. There exists a universe of protocols that can be run on top of UDP to build a reliable service on top of one that is, by definition, without a delivery guarantee. The trade-space needs to be watched closely as the added gates to realize this capability will likely add latency, area, and power. But in some protocols, for example the Paxos family of consensus protocols, this is entirely the point: to find consensus across potentially unreliable nodes connected by imperfect edges (channels).

A Perfect Storm Since 2014, Atomic Rules has been working on a UDP Offload Engine (UOE) core for FPGA and ASIC. Before discussing a specific-use case in the next section, it may be insightful to understand the facts on the ground leading up to the development of this product. Back in 2010, a significant FPGA vendor was doing technical planning conference calls for their 20 nm product line and asked Atomic Rules “What would you do with a 28 Gbps SERDES?”. Our fromthe-hip, instant on-the-phone response was “We don’t know, is there a 28 Gb Ethernet?”.

A few years later leading FPGA vendors announced 28 Gbit SERDES and the 25/50 GbE Consortium was formed to fill-in-theblanks of the as-of-yet not-standardized IEEE 802 details.

In2014, Atomic Rules stood shoulder to shoulder with the 25/50 GbE Consortium members and knew that 25/50 GbE was on the way. Atomic Rules heard that a product from BittWare, the XUSPS3 was coming and it would have sixteen of these 28 Gbit SERDES on four QSFP28s facing the panel (Figure 3).

It was clear at that point that the future would include a world with up to 16 parallel, independent, full-duplex 25 GbE UDP lanes occupying a modest area on an FPGA. Even early in 2015, however, 25 GbE was considered too “early”, “risky”, or “aggressive”. We devised a plan to under-clock the 400 MHz 25 GbE core at 156.25 MHz for operation at

Deployed UDP-Based Radar Architecture

PreProcessing

Coherent Processing/ Slow-Time Filter

Beamforming

Interconnect: Transposing Memory

Doppler Processing

Pulse Compression

CFAR Detection

Interconnect: UDP

Figure 4 This UDP use case shows deployed UDP-based radar architecture.

10 GbE. The result is detailed in presentation at a San Jose Xilinx event in 2015 (see online version for link). The bottom-line on AR-UOE development is that Atomic Rules brought together two key concepts to address a military market need: (1.) The standards-based ubiquity of UDP as a Transport Protocol; and (2.) The 10/25/50/100 GbE capabilities of contemporary FPGA SERDES.

UDP Implementation Use Case Illustrating the potential impact of what we have been discussing so far we can talk in broad terms of where UDP may or may not make sense. It’s helpful now to go back to the phased array radar example.

It’s a common practice to aggregate multiple channels of I/Q onto a single card. Assuming contemporary JESD204 convertors, there would be little utility for UDP in that role. But just a level or two up the processing chain where the baseband becomes Pulse Descriptor Words (PDWs) or other relatively high-throughput construct, UDP has a place for several reasons (Figure 4).

The isochrony of the time-aligned I/Q domain can now be represented asynchronously. UDP is an excellent transport; and although packets can have latency jitter, they may still be timestamped to microsecond precision. UDP datagrams can easily be multicast. That is to say that a “one to many” data distribution plan can easily and efficiently be created using the IGMP “join” and “leave” commands. For example, imagine that any number of nodes wish to subscribe to a particular multicast channel. The datagram consumer UDP core simply “join” that channel and the connected

switch or router does the replication work.

UDP multicast is the backbone of how trading markets disseminate the stream of asset prices – it’s reasonable to consider reusing this well-traveled technology in a Radar or SIGINT domain.

UDP Here to Stay In the end, each system architect will need to judge for themselves if UDP is ready for their application. At the performance extremes, the case can almost always be made for a proprietary protocol. But when costs and time-to-deployment are key concerns, it is difficult to overlook how UDP—a thirty year old protocol—continues to thrive at 100 GbE and beyond.

Atomic Rules is currently working on a free, one page checklist to help military systems engineer find out if UDP would be a good fit for their application. Please send an email to info@atomicrules.com if you would like to access the checklist.

Atomic Rules Auburn, NH (603) 483-0994 www.atomicrules.com Bittware Concord, NH (603) 226-0404 www.alteraboards.com

COTS Journal | October 2016

19

SPECIAL FEATURE Scaling Up Military Comms and Networking Systems

10/40 Gbit Ethernet Switching Poses Unique Board Design Hurdles High-speed board level protocols bring some tricky design challenges. Understanding the details of the associated PCB design issues is the key crafting solutions.

Thierry Wastiaux, Senior Vice President, Interface Concept

I

n the key military fields of high end SIGINT, radar, EW, Search and Track applications defense budgets are constantly increasing. But the computing architectures for such systems are particularly demanding. To get the maximum benefits from the processing power of the latest generation of processors and FPGAs, system developers have to take into consideration the speed and the flexibility of the interconnect technologies that link them together.

In High Performance Embedded Computing systems (HPEC) the VITA 65 OpenVPX standard has emerged as the best standard to allow very high speed data transmission between different boards of the systems. This data transmission is carried out through the Data Plane of the interconnect as specified in the VITA65 norm.

Three Most Important Types of Signal Integrity Design Challenges • Line-width changes, Vias, Serpentines, Connectors and Cables Impedance mismatch that are generated by:

• Manufacturing tolerances for PCBs & Packages: effective dielectric constant, surface-roughness variations • Tx output-impedance, Rx input-impedance vs. line impedance

Crosstalk noise that appears due to:

Power/Ground Noise that can be very detrimental:

• Electromagnetic coupling between signal lines • Trace-to-trace crosstalk, Via-to-Via coupling, Digital/RF coupling • Tight requirement on PDN impedance is required as supply voltages decrease and currents increase to provide clean power to FPGAs/ASICS • Imperfect power/ground delivery system results in Simultaneous Switching Output (SSO) noise to propagate through the PDN

Figure 1 High data rate protocols create some challenges in terms of signal integrity. The table shows the most important ones.

Two Protocols Dominate The PCI Express protocol continues to see constant improvement in the last couple years reaching the current Gen3 version thanks to the steady investments of Intel that is natively using it on all its processors. This protocol is particularly robust and power efficient. In its Gen3 implementation the 128B/130B encoding limits the coding overhead allowing a throughput of 7.88 Gbits/s— close to the 8 Gbit/s limit of the raw Gen3 throughput. In addition a Fat Pipe PCIe x 4 reaches 31.5 Gbits/s. Today that is sufficient 20

COTS Journal | October 2016

in most cases and can be supported by the current VPX backplane technology.

All that said, there are some drawbacks.

This protocol is based on a Root Complex / End Point architecture where the Root Complex is the master in its PCIe kingdom using software to find, identify and configure all the End points. This means that getting communication between several processors requires a dedicated software package. Interface Concept has developed the Multiware

for this purpose. The architecture of the PCIe Data Plane HPEC systems may use a central switch in VPX 3U with the Comeht4410a for instance. In the VPX 6U HPEC systems, a decentralized switching is preferred.

By design, PCIe is a point to point link protocol. When an important processing power is required with a high speed Data Plane over 10 GbE, the PCIe protocol becomes more cumbersome to use as many connections are necessary between the dif-

SPECIAL FEATURE M1

M1

M1

M2

M2

M2

M3

M3

M3

M4

M4

M4

M5

M5

M5

M6

M6

M6

M7

M7

M7

M8

M8

M8

STUB

Figure 2 The backdrilling process allows the elimination all the unwanted stubs as shown in a connection between layer M1 and M3 of the PCB.

ferent Root Complex. In addition reaching 10 Gbits/s on a differential pair will only be possible with the PCIe Gen4 standard currently under specification. This PCIe Gen4 standard is expected to be released in 2017 and its silicon implementation will take some time. Today 10 Gbits/s cannot be achieved on an Ultra Thin pipe in PCIe Gen3 and a PCIe Fat Pipe Gen3 cannot reach 40 Gbits/s.

IEEE 802.3 Standard for Ethernet Sections 4 and 6 from 2012 specifies new standards including 10GBASE-R and 40GBASE-R with their Physical Layer implementations for backplane communication based on 64B/66B code, 10GBASE-KR and40GBASEKR4.The 64B/66B code of the Physical Coding Sublayer (PCS) allows robust error detection. Its encoding ensures that sufficient transitions are present in the PHY bit stream to make clock recovery possible at the receiver. The Physical Medium Dependent Sublayer (PMD) of 10GBASE-KR allows transmission on one lane at 10.325 Gbit/s.

The PMD Sublayer of 40GBASE-KR4 allows transmission on four lanes at the same rate.

egy, there is the assumption of the forthcoming adoption of the Remote Direct Memory Access (RDMA) norm in HPEC systems. In computing, Remote Direct Memory Access (RDMA) corresponds to the direct memory access from the memory of one processor

into that of another without involving either one’s operating system. This allows highthroughput, low-latency networking, which is especially useful in massively parallel computer clusters.

Highly Integrated Memory Modules (HiMODs) DDR2/DDR3/DDR4 up to 8 GBytes in 16 x 22 mm x 1.5 mm package Two independent channels in one package for small embedded systems Wide word widths x32/x40/x64/x72/x80 bits Fast – currently to 2400Mbs Low Power – typcially 50% of discrete DRAMs Wide temperature range available – industrial, extended, military Simpliied layout routing of critical high speed buses Evaluation boards available Solves SWaP challenges in HPEC and network switching & routing applications Approximately 80% less board area than discrete components, even greater savings compared to DIMMs

Benefits of RDMA So when many Digital Processing Boards are gathered in a HPEC Systems a centralized switching approach using 10GBASE-R and 40BASE-KR4 is preferred as it brings back simplicity. That is the reason why Interface Concept has developed the Cometh4580a (3U VPX) and Cometh4510a (6U VPX) switches.

Behind this central Ethernet switching strat-

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COTS Journal | October 2016

21

SPECIAL FEATURE

New standards such as iWARP enable Ethernet RDMA implementation at the physical layer using TCP/IP as the transport, combining the performance and latency advantages of RDMA with a low-cost, standard-based solution. New signal integrity and thermal design methodologies for fast Data Plane implementation. To be able to reach the required speed on the differential pairs supporting the high data rate protocols being PCIe Gen3/4v or 10GBASE-R and 40BASE-KR4, the hardware engineers are facing some challenges in terms of signal integrity. The table in Figure 1 shows a list of the most important ones.

To help the designers in overcoming these difficulties, Interface Concept is using the W2211BP version of KEYSIGHT ADS dedicated to high speed signal to ensure that the designers stay within the limits allowed by the VITA68 norm in term of attenuation, reflection and crosstalk. The data supplied by the component manufacturers are usually used under the IBIS-AMI or HSPICE format.

Figure 3 The Cometh4510a is a 10/40 GbE switch that can be used in central switched low latency RDMA VPX 6U architectures.

Signal Integrity Analysis In a first step, designers are carrying out a pre-layout signal integrity analysis through simulation using ADS (stacking, tracks and vias) leading to the constraints and specifications of the PCB design. These include material, size of the stack, tracks

and vias, anti-pads, stubs and spacing between the tracks. In a second step, the designers perform Post-layout signal integrity verifications. This includes electromagnetic simulation of the designed PCB, extraction of the Scattering Parameters and verification of the compliancy with the VITA68.

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COTS Journal | October 2016

SPECIAL FEATURE

Also involved is simulation in the temporal domain for Channel Simulation. Special lab equipment and high performance oscilloscope are required to achieve all this process. The backdrilling process allows the elimination all the unwanted stubs as shown in Figure 2 in a connection between layer M1 and M3 of the PCB. In addition to the Signal Integrity challenges, mechanical solutions have to fulfil many requirements, including protection against shocks and vibrations and most importantly operation under wide temperature range. This means in particular that the design must provide low enough thermal resistance (degrees C/W) from semiconductor junction to ambient environment—air flow in air cooled and thermal edge in conduction cooled.

Simulations are used to compute the physical temperature fields and predict thermal path and thermal resistance. Fluid dynamics equations and heat equations are solved using the 6SigmaET software leading

to the design of the best thermal solution with low enough components temperature rise and limited weight. The thermal behaviors of the designs are then experimentally investigated and validated.

Board-Level Example An example board that employed all those design processes is the Cometh4510a—a 10/40 GbE switch that can be used in central switched low latency RDMA VPX 6U architectures (Figure 3). The Data Plane of this OpenVPX Switch is compliant with the switch profile MOD6-SWH16U16F-12.4.5-4. It uses the last generation of Marvell Prestera CX platforms as the Control Plane uses the well proven Ethernet packet processors of the Cometh434xa switch family.

It features 16 ports 1000BASE-KX on the Control Plane and 16 40GBASE-KR4 ports or 48 10GBASE-KR ports on the Data Plane, thus offering a huge switching bandwidth.

A multicore PowerPC management pro-

cessor running the IC proven Switchware package offers two out of band 1000BASE-T ports and allows the traffic log recording on NAND flash. In addition a custom mezzanine can bring either two 10GBASE-T ports at the front and two 10GBASE-KX4 ports on P6, or 4 10GBASE-T ports at the front. This switch is the keystone for building multiprocessing VPX6U HPEC systems allowing the huge processing capacity of up to 48 DSP boards in 10 GbE and up to 16 DSP boards in 40GbE. Thanks to new design methodologies and tools, designers can bring to the HPEC systems the best technologies deployed in the commercial High Performance Computing environments allowing high speed Data Plane transmission between the computing nodes.

Interface Concept Quimper, France. +33 (0)2 98 57 30 30. www.interfaceconcept.com

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23

TECH RECON Avionics System Development Strategies

Three Stage Process Speeds Path to Avionics System Deployment There are right and wrong ways to move an avionics system from development to deployment in an effective way. By following a three stage method, engineers can same time and cost.

Wayne McGee, VP and General Manager CES--North America

T

he traditional development process involves three separate stages to get to a deployable system. The first stage gathers the requirements for the system including the deployment environment, functional requirements, performance requirements and CPU headroom. The type of certification (commercial or military), certifying body (FAA, ESA, etc) and level of criticality (Design Assurance Level) are also taken into account. With the completed requirements documents in hand the next step is to build a lab or proof of concept model using as many commercial off the shelf (COTS) as possible to approximate the final system configuration. The examples shown here depict 3u VPX and are applicable to 6u VPX and VNX as well.

Frequently these are air-cooled system that will never be subjected to the actual deployment environment and will be used to develop and do initial testing of the software. Using COTS boards allows engineers to focus on developing hardware functions or sensor interfaces that are not available commercially. At this stage, cabling and connectorization usually does not even closely resemble the final system. As the missing pieces are made available the system integration effort gets underway. The application software is added and debugged.

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COTS Journal | October 2016

Iterative Development As the system becomes functional, performance testing begins. This is an iterative phase as mistakes are uncovered and fixed and the degree that the system meets all of the requirements is determined. If the system requires safety certification any changes to the design must be integrated into the certification package and comply with the original plan. Figure 1 shows an example of a lab system with prototype cabling.

After the proof of concept lab system has been fully debugged, tested and characterized, the pre-flight stage starts. The air-cooled assemblies are redesigned or replaced with ruggedized conduction cooled extended temperature models with all of the changes required in the first stage incorporated. A conduction cooled chassis replaced the air-cooled version and rugged connectors replaced the commercial versions. This in and of itself creates a more difficult situation for cabling as custom cables must be fabricated at this point using far more expensive wiring and connectors.

EMI and Protection Circuitry The PCB on the chassis with the mating connectors must now support any EMI and protection circuitry that would be needed in the deployment environment. If there are hold-up requirements on the power supply

Figure 1 At the proof-of-concept phase cabling and connectorization usually does not even closely resemble the final system.

this must now be implemented. After all of the redesigned subsystems are available and integrated, the testing gauntlet begins in earnest. Extensive temperature cycling, shock and vibration and EMI testing are performed.

A19_COTS_2-25x9-875NEWWEB_A19.qxd 9/1/16

TECH RECON

Shop Replaceable Units

Figure 2 Shop Replaceable Units (SRUs) provide most of the functionality needed for the end system. Shown here are SRUs with various commercial connectorizations.

It is not uncommon for these tests to reveal weaknesses not previously seen and measures taken to eliminate the issues. As this version of the hardware more closely resembles the final version, more rigorous testing of the software and performance are performed including deliberate fault injection to test BIT coverage and fault recovery mechanisms. As the second stage draws to a close all of the changes must again be rigorously documented in preparation for the final stage.

For the production stage, all of the previously implemented changed are put through even more rigorous testing to prove the system hardware and software perform per the spec. Fault resilience and BIT performance are exercised thoroughly. The certification documents with evidence and artifacts are put into final form and delivered to the next level in the vehicle integration chain. The process described here can take between three to five years, especially where higher Design Assurance Levels are required. So the question to be asked is how do we reduce the time, effort and cost to get to the production stage without introducing additional risks? How do we show higher Technology Readiness Levels (TRL) earlier in the development process?

In order to shorten the development cycle you need to start with a collection of Shop Replaceable Units (SRUs) that would be used in all stages of the development.

These SRUs must provide most of the functionality needed for the end system. These would, of course, be conduction cooled, not air-cooled. For ease of use in the laboratory you would need a chassis that uses the exact same backplane as the deployment chassis, but would use a commercial power supply and connectors. It would be internally conduction cooled for the payload but externally air-cooled for use in the lab. This allows the system to be quickly configured using standard commercial cabling prior to final selection of the final rugged connectors and pinout assignments.

The SRU collection should include the SBC, an Avionics I/O module capable of providing the most common interfaces as well as a graphics module with sufficient capture, render and display capability. Other interface needs could be addressed using available XMCs and carrier cards. By utilizing this approach, much of the second stage of integration and testing is eliminated. Figure 2 shows an example of lab chassis with various commercial connectorization.

Deployable Chassis Once the payload has been characterized in the above-mentioned chassis the payload and backplane can be migrated to the deployable chassis. Here the lab power supply is replaced with the final supply with hold-up capacitors if required. The interface board with commercial connectors is replaced by one with the appropriate rugged connectors.

Depending on the deployment requirements various circuits for signal conditioning, EMI and lightning protection would be implemented on the connector board or an interposing board prior to connection into the backplane. Figure 3 shows an example of the final deployable chassis. At this phase all of the final environmental testing can be completed and flight testing can begin.

Savings Using this approach it is estimated that you could take six to twelve months off of the development schedule, reducing both the risk and the cost of the project. When reusing the building blocks

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for subsequent projects the savings on the BSP, drivers and BIT software is significant.

Putting SRUs to Good Use By combining elements of the laboratory and pre-flight stages with reusable SRUs you can eliminate some of the redundant integration and testing required to move from the initial stage to the next. By selecting SRUs that cover the most common functions required in an Avionics Mission Computer the building blocks can be reused on similar projects. The use of these common SRUs also boosts the Technology Readiness Level by allowing quick demonstration of functional systems.

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COTS Journal | October 2016

Figure 3 Shown here is an example of the final deployable chassis on which final environmental testing can be completed and flight testing can be done.

Established platform parallel bus protocols like VMEbus and CompactPCI still have their place in today’s and tomorrow’s harsh environment, real-time/hard-deadline embedded sub-system applications...especially when these products are upgraded and maintained to keep pace with the newest, fastest processor and memory technologies.

While there are some applications where high speed serial fabrics like VPX are ideal, there are others where VMEbus or CompactPCI still rule the roost.

One company continues to actively invest in maintaining – and not obsolescing – their military and space embedded computing products with a proactive 12-year minimum COTS Lifecycle+™ Program.

And one company continues to also invest in delivering the very best of the newest embedded COTS computing platforms with the new, serial fabric protocols.

And one company actively invests in technology insertion at the board level, creating backplane, pin-compatible products with the latest, next generation memory and processor technologies “on-board”.

And that same company still delivers their legacy bus products at full speed and full capability and full mil temp range (-55 to +85°C) with those latest technologies.

The one company to do all that? Aitech. Check our website to learn more about our technology roadmaps and how they protect your investments.

Aitech Defense Systems, Inc. 19756 Prairie Street Chatsworth, CA 91311 email: sales@rugged.com Toll Free: 888-Aitech8 - (888) 248-3248 Fax: (818) 407-1502 www.rugged.com

COTS Journal | October 2016

27

SYSTEM DEVELOPMENT: EXCLUSIVE Integrating RF Electronics and Computing

Expert Weighs in on RF/Digital Integration Challenges Although they speak different languages, digital designers and RF designers have to integrate their subsystems at some point. Advanced tools help smooth the way.

I

t’s clear that both RF and embedded computing are critical technologies for a host of military systems—but the two worlds have traditionally run in separate circles. Today the push is toward streamlining the integration of RF and digital subsystems. Designers of advanced sensor processing applications want more affordable, flexible solutions that ease the integration of RF and digital subsystems.

With all that in mind, COTS Journal’s Jeff Child had the opportunity to sit down Ken Karnofsky, Senior Strategist for Signal Processing at Mathworks to discuss the complex challenges inherent in tackling tricky integration problems that encompass RF, DSP and the embedded software that ties everything together.

Jeff Child, COTS Journal: From your

perspective, what are the biggest challenges facing today’s wireless design teams?

Ken Karnofsky: Developing wireless systems today is a task that requires multiple design skills, including system architecture, DSP, RF, antenna, mixed signal, digital hardware, and embedded software. Most teams don’t have expertise in all those areas. Even when they do, each specialist typically uses their favored tool.

This makes system integration increasingly difficult, and pushes discovery of critical

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COTS Journal | October 2016

Figure 1 Ken Karnofsky stresses the benefits of software that lets teams model and simulate digital and RF components in the same environment, at multiple levels of fidelity

problems to the end of the development process when they’re most expensive to fix.

This challenge has different impacts at different stages of development. For example, researchers can’t effectively explore 5G hybrid beamforming techniques when they use different tools for digital and RF design. Advanced technology teams can’t prove their concepts in hardware prototypes when they have to rely on other teams

for RTL implementation. And design teams are spending far too much time debugging highly integrated radio designs in the hardware lab or in the field.

CJ: How does a single software solution address the disparate needs of digital, RF and system engineers who have different perspectives and tools?

INDUSTRY LEADERS Q&A

Karnofsky: The primary benefit comes from software that enables those teams to model and simulate digital and RF components in the same environment, at multiple levels of fidelity. This enables system engineers to quickly build a reference design, and for each design team to elaborate the design with high-fidelity behavioral models that incorporate DSP, RF, antenna, mixed-signal, and control models.

System-level simulation using these models provides insight into component interactions, exposes integration issues before building hardware, and enables more rigorous system verification much earlier in the development process.

systems. Other engineers are concerned with minimizing interference from other operational systems in a shared spectrum environment. And the signal intelligence community needs to understand how to extract information from systems using these standards.

These tasks are complicated by the scope and rapid change of commercial wireless standards. Defense system designers are users of these standards; they can’t afford to maintain comprehensive knowledge or in-house tools to keep up with them.

CJ: How are IoT (Internet of Things)

CJ: Where does the introduction of

designers ensuring that RF technology and wireless connectivity are properly designed and integrated?

wireless system design tools demonstrate the biggest benefit?

Karnofsky: Today, most IoT designers

Karnofsky: System-level modeling and simulation pays large benefits in several ways. First, simulation can eliminate many system-level and integration errors before building hardware. This is the first step in Model-Based Design where system models automatically generate code for hardware and software implementation of algorithms, enabling algorithm designers to prototype on hardware without having to find programmers or HDL engineers from other teams. The models also provide a reusable test bench throughout the development process, saving time and ensuring consistency of testing. These combined capabilities enable faster design iterations and streamline verification. An upfront investment in modeling has been proven to reduce overall development time by 30 percent or more.

CJ: What unique challenges do existing and emerging wireless standards (Wi-Fi, LTE, 5G) pose for designers of defense electronics and military systems?

Karnofsky: Defense electronics and military system designers use commercial wireless standards in a variety of ways.

Researchers want to anticipate the impact of emerging technologies such as mmWave and massive MIMO systems.

System designers are looking to adapt those standards to lower cost and improve reliability of military communications

purchase RF modules to add wireless connectivity to their products. If something goes wrong, they face a lot of time in the lab debugging a design they didn’t create.

Leading edge designers are instead using Model-Based Design to simulate the integration of RF front ends into their designs, which helps them identify and fix issues earlier and at lower cost.

CJ: What role do MATLAB and Simulink

and network development, radar systems, interference and spectrum management, electronic countermeasures, and satellite and space systems, and signal intelligence.

CJ: What is the future role of SDR (Software Defined Radio) technology in the defense arena and how is Mathworks enabling that?

Karnofsky: Low-cost, highly capable SDR technology is driving innovation and broader adoption. COTS SDR hardware can be connected to a PC to create highly capable testing and prototyping systems.

The challenge is that those first generation SDR tools limited even broader adoption of the technology by forcing engineers to maintain low-level programming environments, or use software tools that work only with a single vendor’s hardware.

MATLAB and Simulink support a broad range of SDR hardware, allowing engineers to select the appropriate hardware for over-the-air testing, rapid prototyping, and system development. Using SDR hardware directly with MATLAB and Simulink accelerates system deployment and verification.

In addition, the HDL and C code generated for prototypes can be used on different devices for production deployment.

play in addressing these challenges?

CJ: What technology innovations do you

Karnofsky: MATLAB and Simulink serve

foresee as most affecting the military electronics landscape in the next 5-10 years?

engineers who do wireless design, system modeling, and advanced technology R&D by providing: • Rapid and flexible algorithm exploration, design, and analysis.

• Unified simulation of digital, RF, and antenna elements.

• Standard-based models for simulation and waveform generation.

• HDL and C code generation for FPGAs, processors, and ASICs. • Multi-vendor hardware and software support for verification and prototyping.

CJ: What about specific applications in the military electronics sector?

Karnofsky:These capabilities serve a broad range of applications in the military electronics sector, including tactical radio

Karnofsky: A partial list of innovations includes: • Technology emerging from the 5G efforts to support extreme mobile broadband and large-scale IoT communication, including massive MIMO, mmWave frequencies, and low-power operating modes.

• Cognitive radio and spectrum sensing technologies to enable robust, flexible tactical systems.

• Machine learning and big data techniques to add intelligence and flexibility to communications networks.

Mathworks Natick, MA (508) 647-7000 www.mathworks.com

COTS Journal | October 2016

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DATA SHEET High Rel Power Supplies Roundup

Power Supplies Bulk up for High Reliability Work The reliability of a military system is tightly linked to its choice of power supply technology. Vendors of such products continue to evolve their power technology innovations.

Jeff Child, Editor-in-Chief

A

s military systems pack ever more computing into smaller spaces, power has direct implications on the size, cooling and mobility of a boardor box-level system. As a result military system designers can no longer afford to make their choice of power supplies and power conversion electronics an afterthought. Mix in the challenges of multi-voltage electronics and the complexity of distributed system architectures, and it’s clear that military system designers need solutions that address those needs. Arguably the unsung hero of a system design, power supplies and converters are critical enablers for meeting today’s rugged requirements.

To keep pace, power supply vendors continue to roll out more efficient products, new partitioning strategies and increased ruggedization. These new solutions continue to emerge not just at the component or brick level, but also at the module and board level. Meanwhile, uninterruptible power supplies (UPS) are now more critical than ever as computer and network gear pervade the battlefield.

In tandem to those trends, there’s a growing demand to reduce size, weight and power (SWaP) of system electronics. And the two go hand in hand. More and more programs are pushing for as much com-

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COTS Journal | October 2016

Figure 1 The OSIRIS-REx spacecraft, which was launched aboard the ULA’s Atlas V, is traveling to near-Earth Asteroid Bennu.

puter processing muscle as can possibly fit into a board-level solution. Driving those demands is a desire to fit more functionality in the same space or into a smaller footprint. In the air, this means smaller and lon-

ger endurance for systems like UAVs. On the ground, this means more weight can be allocated to the all-important armor of ground vehicles. In the realm of high-power-density DC/DC converters, the modular form factor, commonly referred to as a brick, continues to be the preferred building block component for any application, commercial and military.

One example application area where high-reliability DC-DC convertor technology is critical is in space systems. DC-DC converters from VPT are used on board NASA’s first asteroid sampling mission launched successfully in September from Cape Canaveral Air Force Station in Florida. The OSIRIS-REx spacecraft, which was launched aboard the ULA’s Atlas V, is traveling to near-Earth Asteroid Bennu (Figure 1). OSIRIS-REx is scheduled to reach the asteroid in 2018 to explore and eventually approach the asteroid to obtain a sample, which will be returned to Earth in 2023 for scientists to study. Asteroid Bennu is considered part of the early solar system and is classified as a potentially hazardous asteroid. The study of the asteroid’s material will allow researchers to better understand the asteroid orbiting patterns as well as gain further understanding of the origins of life in the solar system.

DATA SHEET

High Rel Power Supplies Roundup

1,000 W Full Brick DC/DC Converters Add Extended Temp Option

Fanless Modular 600W Supply Uses Natural Convection Cooling

260W 3U VPX Power Supply is VITA 62 Compliant

Calex has added the "-T" option on the 1,000 W FXW series. The "-T" option allows for extended temperature operation of the converters from -55- to +105-degrees C including cold start at -55 degrees C. The FXW offers high efficiency, up to 96.5 percent, and high power density which is accomplished through the use of synchronous rectification, advanced circuit, packaging and thermal design resulting in a compact, highly reliable product.

The CoolX600 Series from Excelsys Technologies is a convection-cooled modular power supply that delivers 600W without fan assisted cooling from a very compact 8.5 x 4.5 x 1U package. The only fanless modular power supply on the market according to Excelsys, the CoolX600 offers system designers best in class performance for efficiency and reliability in addition to the most comprehensive feature set and specifications available.

Extreme Engineering’s XPm2222 is a VITA 62.0 form factor 3U VPX power supply.

The XPm2222 takes in a MIL-STD-704A/E/F or MIL-STD-1275D 28 VDC input voltage and provides up to 260 W on 3.3 V, 5 V, and ±12 V at up to 87 percent efficiency. The XPm2222 fits in a VITA 62-compliant 3U VPX 1.0 in. slot and can provide a combined total output power of up to 260 W at maximum operating temperature.

• Wide Input Voltage Range: 9 to 36 VDC.

• 100 percent natural convection cooled; No internal or externals fans needed.

• Output Voltage: 24 and 28 VDC. • Over-current and short circuit protection; Over-temperature protection.

• No base-plate needed.

• Efficiency up to 96 percent.

• Reverse energy protection.

• Small size: 2.5- x 4.7- x 0.52-inch.

• Extended Temperature Range: -55 to +105 degrees C. • Remote On/Off; Auto-restart, Monotonic startup into pre bias.

• Good shock and vibration damping.

Calex Concord, CA (925) 687-4411 www.calex.com

• No acoustic noise or vibrations.

• High input surge protection.

•24W standby power.

•Safety approved to 5000m altitude.

• Greater than 93 percent efficiency.

Excelsys Technologies Rockwall, TX (972) 771-4544 www.excelsys.com

• MIL-STD-704A/E/F and MIL-STD1275D 28 VDC input voltage; MIL-STD461F EMI filtering.

• VITA 62.0 form factor VPX power supply.

• Up to 260 W output on 3.3 V, 5 V, and ±12 V. • Isolated 3.3 V AUX supply.

• Spike and surge transient suppression; Short circuit, overcurrent, and overvoltage protection; Output overvoltage clamping circuitry.

• -40 to 85 degrees C conduction- cooled operating temperature.

Extreme Engineering Solutions Middleton, WI. (608) 833-1155 www.xes-inc.com

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COTS Journal | October 2016

31

DATA SHEET

High Rel Power Supplies Roundup

Lightweight 1U Rack Mountable UPS Uses High Power Density Batteries

High Efficiency VITA 62, 3U VPX Supply Provides 500 Watts

VITA 62, 6U VPX Single Phase FrontEnd Module Delivers 1,500 Watts

Intellipower’s FA00399 is a lightweight, 1U rack mountable UPS which includes the use of lithium iron phosphate (LiFePO4) batteries. Because LiFePO4 batteries provide higher power density, weigh less than lead acid batteries and offer a much longer cycle life, this solution, which was specifically developed for military, industrial and mission-critical commercial applications results in a lightweight, spacesaving, UPS with longer battery life.

The VPX55H-3 is North Atlantic Industries’ latest high power 500 Watt DC/ DC converter that plugs directly into a standard 3U VPX chassis with a VITA 62 0.8 inch power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.

Behlman Electronics, a subsidiary of Orbit International, offers the VPXtra 1500CS3 series, an AC to DC front-end module built for high-end industrial and military applications. The unit is a VITA 62, Open VPX compliant, 6U front-end module that accepts a wide input voltage range 85-265VAC, over wide frequency range (47-440 Hz) and delivers 1500W of 33VDC power. The front-end module is designed to support the rigors of mission critical airborne, shipboard, vehicle and mobile applications.

• 500 W of AC or DC power.

• -20°C to +50°C operating temperature.

• 1500VA, 1000 W (Dual 500W AC and 500W DC Output), 120VAC, 50/60Hz Input and 120VAC, 50/60Hz Output.

• Double Conversion, On-Line UPS, 1U, High Temperature, Lithium Iron Phosphate Battery Hot Swap Drawer, Rugged UPS with Power Factor Correction.

• Galvanic isolation provides ideal electrical output performance.

• Supports standard communications protocols such as SNMP with OID and MIB Support, RS-232, Ethernet/IP and others.

Intellipower Orange, CA (714) 921-1580 www.intellipower.com

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32

COTS Journal | October 2016

• Standard VPX-compatible connectors and I/O per VITA 62.

• Compatible with System Management Bus per VITA 46.11.

• Open VPX VITA 62 compliant.

• Supports all VITA standard I/O, signals, and features.

• Active, Single Phase PFC input.

• Input transient protection per MILSTD-704F.

• Low input current distortion.

• Integrated EMI filtering per MIL-STD461F. • Operates at full 500W load through the entire -40 to +85 degrees C temperature range.

North Atlantic Industries Bohemia, NY (631) 567-1100 www.naii.com

• 6U VPX, 1.0 inch pitch single slot.

• Wide input frequency range, 47-440Hz. • High power DC output: 33V/46A. • Auxiliary DC output: 3.3V Aux/0.2A. • Wide input voltage range 85-265 VAC. • Input-output isolation.

Orbit Power Group Hauppauge, NY (631) 435-0410 www.vmevpx.com

DATA SHEET

HIGH REL POWER SUPPLIES ROUNDUP Links to the full data sheets for each of these products are posted on the online version of this section.

10,000 VDC Output DC-DC Converter Features Small Size and Weight

Family of Military Power Solutions Handle Extreme Conditions

3-Phase 1500 W Power Factor Correction Module Meets Radar Needs

Pico Electronics’ AVP/AVN series of unregulated high voltage DC-DC converters with output voltages to 10,000 VDC are produced in an ultra-miniature encapsulated package. 50 different standard models are available. These single output units will operate over the temperature range of -25 to +70 degrees C with no heat sink or electrical derating. For military applications an operating temperature range -55 to +85 degrees C is available. An optional environmental screening package per MIL-STD-883 is also available.

The MIL-K Series from Schaefer is a family of Military AC/AC Frequency Converters, AC/DC power supplies, DC/ DC converters, Battery chargers, Power Quality systems, Power distribution units, and DC/AC Inverters. Its robust housing, solid design, high performance, superb reliability as well as the build to order flexibility, makes the MIL-K series the ideal source for use in shelters, vehicles, avionics, radar, Naval and many other open air applications.

SynQor’s MilCOTS 3-phase MPFCQor Power Factor Correction module is an essential building block of an AC-DC power supply. Used in conjunction with SynQor’s MACF-115-3PH-UNV-HT AC line filter and a limited amount of stabilizing capacitance, the 3-Phase MPFCQor will draw wellbalanced and low-distortion sinusoidal currents from each phase of a 3-phase AC input. It is designed to comply with a wide range of military standards and is manufactured in the United States.

• Output Voltages: 6,000 VDC to 10,000 VDC. • 1.25 watt output at 70º ambient.

• Ultra-miniature size 0.500 inch height, 5.0 grams weight, 0.25 cubic inches volume.

• 5 input voltage ranges 5, 12, 15, 24 and 28 VDC.

• Single and three phase inputs; High voltage DC inputs.

• Full brick form factor.

• Wide frequency input range of 45-440Hz.

• Compatible with Military Standard 60 Hz, 400 Hz and var. freq. systems.

• CARC (Chemical Agent Resistant Coating).

• Digital Meters for output current and voltage.

• Transformer Isolated Design.

• LEDs (input, output, alarm);Black-out switch for LEDs or covers.

• MIL-STD 883 options available.

• Quick connectors for output.

• No heat sink or electrical derating required.

• Weep holes for condensation drip or fully sealed unit (up to IP69 rated).

Pico Electronics Pelham, NY (914) 738-1400 www.picoelectronics.com

• Mil connectors (standard, bayonet style, other type).

• Semi-regulated output: 270 VDC.

• Meets military standards for harmonic content.

• High power factor (0.98 at 400 Hz / 1.5 kW).

• Size: 2.486- x 4.686- x 0.512-inches.

• Weight: 11.3 oz. (320 g).

SynQor Boxborough, MA (978) 849-0600 www.synqor.com

Schaefer Hopkinton, MA (508) 436-6400 www.schaeferpower.com

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COTS Journal | October 2016

33

DATA SHEET

High Rel Power Supplies Roundup

Quarter Brick DC-DC Converters Suited for Harsh Environment Use

High Density AC-DC Front-Ends Boast Rugged Chassis-Mountable Package

DC-DC Converters Operate at FullLoad From -40 to 100 Degrees C

TDK-Lambda’s HQA120 isolated DC-DC converters are rated at 120W and have been qualified with methods consistent with MIL-STD-883 and MIL-STD-202, making it suitable for use in COTS and harsh environment equipment. Initially available with 12V, 24V and 28V outputs, the encapsulated quarter bricks accept a wide range DC input of 9V to 40V, withstanding a 50V surge for 10 seconds.

Vicor’s family of high density PFM ACDC front-end modules in the rugged VIA package offer superior cooling performance and versatility in converter mounting.

Featuring a universal AC input range (85 – 264 VAC), power factor correction, and a fully isolated 24 VDC or 48 VDC output, and delivering 400 W of isolated, regulated, DC output power at efficiencies up to 93 percent these new modules provide unprecedented power density of 127 W/in3 (8 W/cm3) and best-in-class performance in a diminutive, 9 mm thin VIA package.

VPT’s VHR series of industrial level DC-DC converters and EMI filters provides system developers with high levels of product reliability for powering non-flight-critical programs in military, avionics, and unmanned systems as well as manufacturing equipment and controls.

The VHR series of DC-DC converters are available in models ranging from 5 to 100 Watts. EMI filters are available from 1 to 20 A.

• Standard quarter brick footprint.

• 9-40, 18-40VDC inputs.

• 5 to 48V nominal outputs.

• Up to 115 degrees C ambient temperatures.

• Up to 91.5 percent efficiency (48V).

• 2,250 VDC Isolation.

• Encapsulated for rugged environments; No opto-couplers used.

• Enhanced screening option with -55 degrees C ambient operation.

• Qualification methods consistent with MIL-STD-883.

TDK-Lambda Americas San Diego, CA (619) 628 2885 www.us.tdk-lambda.com/lp

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34

COTS Journal | October 2016

• Input voltages: universal rectified 85 to 264 VRMS. • Output voltage: 24 and 48 V isolated and regulated outputs.

• Output power: 400 W over entire input voltage range.

• Efficiency: up to 92 percent.

• Power Density: ≥ 127 W/in3.

• Dimensions: PFM 4414: 4.37 x 1.42 x 0.37 in.; PFM 4914: 4.92 x 1.42 x 0.37 in.

Vicor Andover, MA (978) 749-8359 www.vicorpower.com

• Wide temperature range of -40 to +100 degrees C. • Fixed frequency operation.

• Soft-start.

• Magnetic feedback.

• Inhibit and current-limit protection.

• J-STD-001, ISO-9001, IPC-A-610 Class 3 manufacturing.

• Available models range from 5 to 100 Watts.

• EMI filters are available from 1 to 20 A. VPT Blacksburg VA (425) 353-3010 www.vptpower.com

Military-Grade 1.5 kW

3-Phase EMI Filter & 3-Phase PFC Rectifier Small Size

light Weight high efficiency

3-PhaSe emi filteR

3-PhaSe Pfc RectifieR 270VDc OutPut

3-PhaSe ac inPut 115 VRmS l-n

High efficiency: 94% at full load 3-Phase AC input 45–800 Hz, 115 Vrms L-N 1.5 kW power available at 100 °C Baseplate Fixed frequency switching for predictable EMI Semi-Regulated output: 270 Vdc Drawing nearly perfect sinusoidal current from each of a 3-Phase AC input (1.5% THD)  MIL-STD Compliant  1500 W 3-Phase Filter/PFC System S-Grade Evaluation Kit 2N1 Stand      

, ber 6-8 m e t p e S 22 tralia, oth 69 s o u B A , , 5 e r3 aid Octobe in Adel , .

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0 D 2 Forces n Washington d n a L t a SA i Visit us & at AU

Made in the USA 1-978-849-0600 www.SynQor.com/C2

COTS

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PRODUCTS

intelligentsystemssource.com

Xeon-based 10 Gbit Ethernet Switch Server is Optimized for SWaP The FR 351/m06 is a new 3U VPX switch from Concurrent Technologies that supports up to six server grade payload boards. The built-in management processor allows easy access via a network or command line interface. 80 Gbps of non-blocking switching is achieved from six 10 Gigabit VPX payloads plus two additional 10 Gbit Ethernet SFP+ ports on the front panel of the air-cooled variant. A separate Gbit Ethernet switch is available for plane traffic control, segregating management from user data for increased reliability.

The FR 351/m06 is a layer 2 switch that works at the datalink layer of the OSI networking model capable of segmenting Virtual LANs (VLANs) and provide Quality of Service (QoS) so that video, voice and control packets can be prioritized over other traffic. Multiple boxes can be connected together via the SFP+ interfaces on the front panel and they are optimized for peak performance. The target applications are compact, rugged edge servers include image and signals analysis, video encoding, simulation and communications systems.

Concurrent Technologies Woburn, MA (781) 933-5900 www.gocct.com

2U Cloud/Data Center Server Boasts Cavium ThunderX Processors

HVF Precious Metals Precious Metals & Electronic Recycling Solutions

Demil Specialist

Specializing in the recovery of precious metals from: l E-Scrap l Plated Components l Plate/Strip Solutions

In house Assay Lab utilizing: l Fire Assay l Atomic Absorption l X-Ray Spectroscopy l Wet Chemistry

5657 S. Wilmot Road Tucson, AZ 85756 P: (520) 574-1817 | F: (520) 574-1818 www.hvfpreciousmetals.com

36

COTS Journal | October 2016

WIN Enterprises has announced the PL-81060, a high-performance server with dual Cavium ThunderX processors optimized as a Cloud and Data Center server. From the 64-bit ARMv8 server processor family, the dual Cavium ThunderX CN8890-2000 processors boast 48 cores each. The system provides up to Up to 24x 3.5 inch HDDs providing up to 240 Terabytes of storage and 4x 2.5-inch HDD/SSDs providing an additional 8 Terabytes of cache storage.

The PL-81060 uses the standard-size 2U chassis that is popular in the cloud market. Moreover, with its 1000 W 80 Plus Power Supply-unit, the PL-81060 consumes less power than comparable high-performance storage units.

WIN Enterprises North Andover, MA (978) 688-2000 www.win-ent.com

Rugged Solutions for Mission Critical Applications All Systel products are designed, manufactured, and tested in the USA

• Military-Grade Custom and COTS Rugged Systems Designed to Excel in the Harshest Environments • 25 Year Track Record of Excellence • SWaP Optimized

Rack Mount Servers and Workstations

MIL-STD-810G MIL-STD-901D MIL-STD-167 MIL-STD-461 DO-160 IP66

Flat Panel Displays and Computers

High Performance Computing

Embedded Systems

Contact Us Today to Discuss Your Rugged Needs! www.systelusa.com/cots 1-877-979-7835 sales@systelusa.com

COTS PRODUCTS

Rugged 3U VPX GPGPU Board Delivers 1 Tflops Performance

Are Your OpenVPX Handles Breaking?

Superior Rugged Metal Claw If you are ready for a more robust handle/panel solution, come to Pixus! Our OpenVPX handles feature a metal engagement claw and rugged design that ensures the highest reliability. Ask about our new rugged horizontal extruded rails with thicker material for OpenVPX and high insertion force systems today!

sales@pixustechnologies.com pixustechnologies.com

38

COTS Journal | October 2016

Aitech has announced the rugged C535 Typhoon, a 3U VPX module which combines the GPU and CPU power to redefine SWaP (size, weight and power) in embedded computing. Based on the NVIDIA Jetson TX1 System on Module (SoM) which uses the advanced Maxwell architecture, the C535 can deliver over 1 Teraflops of signal and video processor performance with H.264/H.265 encoding.

The small 3U footprint module consumes only 17W (8-10W typical) and is a good fit for applications in autonomous vehicles, avionics, flight systems, surveillance, targeting and EW systems.

I/O options include dual Gigabit Ethernet, UART and USB serial ports, dual DVI/HMDI video outputs, composite and SDI video inputs, Camera Link video input, USB, discrete and a stereo HD audio output.

Memory capabilities include a 32 Gbyte miniSATA SSD with SLC Flash with 4 Gbytes of LPDDR4 RAM in dual channels operating at 3,200 MT/s and 16 Gbytes of eMMC 5.1 as the boot source.

Quick erase and secure erase are part of the built-in security features.

On-board resources include dynamic voltage and frequency scaling as well as a temperature sensor and time elapsed recorder. Planned future enhancement includes an on-board FPGA to handle added video input and output formats such as composite, STANAG, Camera Link, SDI, more DVI/HDMI ports and a frame grabber. Security features include HW acceleration for AES 128/192/256 encryption and decryption as well as for AES CMAC, SHA-1 and SHA-256 algorithms. Additionally, an HW random number generator and 2048-bit RSA HW functions further secure the board’s data processing needs.

Aitech Defense Systems, Chatsworth, CA (888) 248-3248. www.rugged.com

COTS PRODUCTS

3U VPX Board Serves Up NVIDIA Jetson TX1 GPGPU Connect Tech has announced the release of its GraphiteVPX/CPU-TX1. The product is a VITA 65 compliant 3U VPX single board computer that brings the NVIDIA Jetson TX1 embedded computing platform to the VPX form factor. Delivering over a TeraFlop of performance, the powerful GraphiteVPX/CPU-TX1 has multiple USB 3.0 ports, multiple GbE channels, and 6 CSI camera interfaces to round out this 3U VPX solution. The onboard PCIe Gen 3.0 switch supports two x4 interfaces, providing two additional downstream ports on the backplane.

NVIDIA Jetson TX1 is a supercomputer on a module that's the size of a credit card. It features the new NVIDIA Maxwell architecture, 256 NVIDIA CUDA cores, 64-bit CPUs, and unmatched power efficiency. Plus, it includes the latest technology for deep learning, computer vision, GPU computing, and graphics, making it ideal for embedded visual computing. The extended temperature range of the product is -40 to +70 degrees C (-40 to +158 degrees F) and it is conduction cooled. To aid in development, use Connect Tech's RTG004 GraphiteVPX/CPU-TX1 RTM. Connect Tech Guelph, Ontario, Canada (519) 836-1291 www.connecttech.com

Visualization Tool Helps Calculate Optimum Radar Coverage Cambridge Pixel has announced the availability of a free software tool to assist system developers to select the optimum location for a radar or other sensor based on line-of-sight visibility.

The SPx Radar Coverage Tool is an easy to use downloadable Windows application providing a visual display of radar coverage around the world. The tool calculates the visibility of targets at different heights based on the location and height of the radar. It uses terrain data from the Shuttle Radar Topography Mission to calculate the line-of-sight from the radar to each point in space, and the display then shows this as color-coded bands on an underlay map.

Rugged Integrated Systems Packaged for Performance Embedded computing platforms brought to you by the leaders in electronic packaging and systems integration, Elma Electronic.

Field proven solutions including compute, IP routing, switching and storage support with custom I/O for demanding applications and environments.

Cambridge Pixel Cambridge, UK +44 (0) 1763 852749 www.cambridgepixel.com

COTS Journal | October 2016

39

COTS PRODUCTS

CompactPCI Serial Vision Systems Offer Choice of Interfaces

Fanless Atom E3845 System Ready for Mission-Critical Duties

EKF Elektronik has announced CompactPCI Serial modular industrial computer systems for image capturing and vision processing.

These rugged 19-inch systems with passive backplanes support plug-in Eurocards. Depending on application needs, users, users can choose from multiple I/O including USB 3.0 (5 Gbps), Camera Link (CL) (6.8 Gbps), 10 Gbit Ethernet or PCI Express (20 Gbps). The EKF SV2-MOVIE MXM 3.0 carrier board will house GPU modules/ graphics controllers for industrial systems from AMD and NVIDIA. For image processing, the system is equipped with the Intel Core-i7 or XEON M.2 style SSD modules supports up to 1500 Mbyte/s for sequential write.

Axiomtek has announced a fanless embedded system, eBOX800-841-FL, with IP67 protection for missioncritical applications. It is able to operate from -30 to 60 degrees C with DC input from 9 to 36V. One DDR3L SO-DIMM slot is available with total system memory of 8 Gbytes. External drives include one 2.5 inch SATA HDD, one mSATA and one CFast. The unit comes with two Gbit Ethernet ports, two RS-232/422/485 ports, two USB 2.0 ports, one VGA and power input. This extended temperature embedded system comes with two PCI Express Mini Card slots and one SIM slot for wireless network communication options. Embedded OS supported include Windows 10 IoT and Windows 7.

EKF Elektronik Hamm, Germany +49 (0)2381/6890-0 www.ekf.de

Axiomtek City of Industry, CA (626) 581-3232 www.axiomtek.com/us

COTS

PRODUCT GALLERY Tyton VS2

Jade Model 71861

• • • • • • • • • • • • • • •

The Jade Model 71861 is an XMC module with four 200 MHz A/D channels and programmable multiband DDCs. The Model 71861 is based on the Xilinx Kintex UltraScale FPGA family with FPGA choices to match price, power, and processing performance needs.

The Jade products utlize the Navigator Design Suite to ease IP development and BSP connectivity.

Rugged Stand-Alone Solution H.265 (HEVC) / H.264 (AVC) Video Encoding and Streaming Two 3G-SDI Video Inputs (other video formats possible on per customer basis) Two Bypass SDI Video Outputs 1GB Ethernet Output (All encoded streams sent over same Ethernet port) SNMP based control API ( for easy integration into existing user applications) Web Server Configuration App for easy configuration of device CoT & KLV Metadata Insertion Multiple Encoded Streams per Input (8x Dynamic Encoding Cores) Customizable Design Even at Low Volumes Stereo Audio Input w/ AAC Audio Encoding Low Power & Low Latency Small Compact Form Factor Ruggedized for Vibration, Shock, Humidity (MIL-STD-810G & IP67) -45°C to 85°C Operating Temperature

Eizo Rugged Solutions

Phone: (800) 330-8301 FAX: (407) 339-2554 Email: tyton@eizo.com Web: www.eizorugged.com

40

COTS Journal | October 2016

Pentek Inc.

Phone: (201) 818-5900 FAX: (201) 818-5904 Email: sales@pentek.com Web: www.pentek.com

COTS PRODUCTS

VPX Backplane Supports C4ISR/EW Modular Open Standards Elma Electronic has announced a high speed 3U VPX backplane that supports multiple functions including mixed payload modules, single board computers, switches and RF payloads for use by the DoD’s Hardware/Software Convergence Initiative. The 3U, 12-slot backplane provides 7 slots for receiving radial clock signals driven independently from a radial clock timing card and 5 slots for standard VPX bused Aux_Clk and Ref_Clk signals. The timing card slot also supports a VITA 67.3c connector with 10 SMPM cavities, compatible with the legacy VITA 67.1 and VITA 66.4 RF. The backplane operates up to 10Gbps data rate through the data plane UTP connection with optional optical interfaces for future bandwidth expansion requirement.

Each of the four payload slots is equipped with a combination VITA Our designer friendly 67.3c optical and RF connector in the J2 and flexible technology position. Furthermore, the slot 2 switch has a VITA 67.3d connector module can solve many of your compatible with a payload module fitted application problems with a VITA 66.4 MT optical ribbon in the design phase. connector or a VITA 67.1 RF coaxial connector. VITA 67.3e connectors are included to support an RF switch card.

Two additional slots (outside the 12 slots) are available for plug-in power supplies or threaded studs. Optionally, the backplane can be supplied in a mini ATR style chassis. Overall, the design provides flexibility for easy hardware swap in the field. It also supports the DoD’s Hardware/Software Convergence Initiative requiring common, modular Contact Dawn to ease the designhardware architecture with lower lifecycle costs. to-production transition and reduce deployment time to enable high Elma Electronic performance, mission critical systems.

Fremont, CA We look forward to speaking with (510) 656-3400 www.elma.com you soon.

Rugged, Reliable and Ready

Dawn’s advanced backplane topology customization tools now feature OpenVPX Fabric Mapping Modules.

You need it right.

You want Dawn.

(510) 657-4444 dawnvme.com COTS Journal | October 2016

41

COTS PRODUCTS

75 GHz Clamshell Socket Can Be Mounted Without Soldering Ironwood Electronics has announced a clamshell socket, GT-BGA-2052, capable of 75 GHz with less than 1dB of insertion loss, very low inductance and will operate in a wide range of temperature (-55 to +160 degrees C). The 17x17 mm package size socket supports NXP BGA’s and IC's such as 292 BGA, 17x17mm with 20x20 array and 0.8mm pitch. The contact resistance is typically 30 milliohms per pin and the socket can be mounted on the target PCB with no soldering and can accommodate up to 100 W. Quantity 1 price is $715.

Ironwood Electronics Eagan, MN 800-404-0204 www.ironwoodelectronics.com

PICMG 1.3 SBC Implements M.2 NVMe, DDR4, and Multiple Video Links The TKL8255 is Trenton Systems’ latest PICMG 1.3 single board computer based on Intel Xeon E31200 v5 or Intel Core 6xxx processor options. It features support for DDR4 system memory, native PCI Express 3.0 links, USB 3.0 ports, three video ports, and an on-board M.2 connector for supporting a plug-in NVMe storage module. It sports four DDR4-2133 Standard DIMMs and an M.2 interface driven by x4 PCIe 3.0 link for NVMe modules.

Three video interfaces include 1 Display Port and 2 DVI-D headers.

There’s also an HD-Audio interface header on board. I/O includes four USB 3.0 ports and six USB 2.0 ports along with three Ethernet LANs. A full-length aluminum backer plate is provided. Trenton offers a 5-year factory warranty and 7+ years of SBC availability.

Trenton Systems Gainesville, GA (770) 287-3100 www.trentonsystems.com

Star Communications, Inc.

SAE AS5643-Compliant IEEE 1394 Cable Serves Military Applications

signal processing receivers computing accelerators x 6.6” >65 Teraop/s 4.4 Small.

Powerful.

Affordable.

Easy-to-use.

4.4 x 6.6 x 0.8 inches >65 Teraops/sec scalable 1-4 FPGAs installs in any PC or server made in the U.S.A.

www.starcommva.com 42

COTS Journal | October 2016

TE Connectivity has announced a SAE AS5643-compliant, highspeed data transmission cable of capable of 0.4 Gbps (IEEE 1394A) and 3.2 Gbps (IEEE 1394B). The small cable diameter allows greater flexibility and a tight bend radius for easy routing through small spaces. They are designed for applications in mission systems, flight control, avionics and propulsion control. To operate in harsh environments, the cables are able to perform in wide temperature range, aerospace flammability and low smoke generation with easy termination. Three versions of cable gauge are available. The 22 and 24 AWG are made with silver-coated copper alloy while the 26 AWG use silver-coated high-strength alloy.

TE Connectivity Berwyn, PA (610) 893-9800 www.te.com

COTS PRODUCTS

Core i7-based COM Express Module Runs Cisco IOS Software

Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com

Microwave Shielding Effec-veness 140

120

100

Shielding Effec-vness (dB)

Extreme Engineering Solutions (X-ES) has announced the XPand6052 which integrates the Intel Core i7 processor-based XPedite7450 COM Express mezzanine module and the XPedite5205 XMC/PMC Embedded Services Router (ESR) to provide processing with networking capability in one Small Form Factor rugged embedded module.

The XPedite7450 is a COM Express Type 6 module based on Intel Core i7 and Intel QM67 chipset. It accommodates up to 16 Gbytes of DDR3-1600 ECC SDRAM in two channels to support memory-intensive applications.

The XPedite5205 is an XMC/PMC-based Embedded Services Router (ESR) router that runs Cisco IOS Software with Cisco Mobile Ready Net capabilities. It supports secure data, voice, and video communications to wire/wireless stationary and mobile network nodes. Its onboard hardware encryption off-loads encryption processing, radio aware routing (RAR) with support for the latest Dynamic Link Exchange Protocol (DLEP) and IPv6 and Quality of Service (QoS). Many field personnels have already been trained on the Cisco IOS making the support of the XPedite5205 easier.

The new combined unit, XPand6052, complies with multiple military specifications including MIL-STD-810, DO-160 and MILSTD-461G. It is flight-qualified and meets the MIL-STD-704A-F 28 VDC power input requirement. Its I/O includes those from the XPedite7450: two USB 2.0 ports, two configurable RS-232/422/485 serial ports, DisplayPort and VGA graphics ports, and two 10/100/1000BASE-T Gbit Ethernet ports. And the I/O from the XPedite5205 router includes four 10/100/1000BASE-T Gbit Ethernet ports, along with two RS-232 serial ports with 64 Gbytes of internal SATA-accessed storage.

80

60

40

20

0

10

16

19

21

23

26

28 31 34 38

Frequency (GHz)

COTS Journal | October 2016

43

COTS PRODUCTS

Conduction-Cooled Card Guides Support IEEE Air-Cooled Enclosures

Tablet Provides RF Spectrum Analysis and Frequency Coordination

Pixus Technologies has announced the conductioncooled card guides to support the company’s Test/ Development chassis for OpenVPX, CompactPCI, and VME/VME64x systems. The guide rails work with 160mm deep cards and fit in the IEEE 1101.10/.11 modular extrusions. Custom depths are available. Additional standard plastic card guides are available for air-cooled boards with color coded versions for system, node, and power slots as well as multiple depths. Other components from Pixus include embedded enclosure components and full systems including extrusion rails, threaded inserts, sidewalls, handles/panels, top and bottom covers, ESD clips and gaskets.

The RF-VUE from Kaltman Creations is the first tabletbased RF spectrum analyzer of its kind, putting the power of RF analysis and frequency coordination in users’ hands. The tablet features Touch to Listen technology, allowing you to listen directly to RF signals and identify interference at the touch of a button. The built-in RF Congestion Scale gauges local severity, and up to 100 color-coded custom markers are available to monitor the performance of your own transmitters and track potential interference sources. Ideal for live sound and wireless design in any setting, the Invisible Waves RF-VUE spectrum analyzer is available in frequency ranges up to 2.5 GHz to cover all potential pro audio wireless applications.

Pixus Technologies, Waterloo, Ontario, Canada (519) 885-5775. www.pixustechnologies.com.

Kaltman Creations Seneca, SC (864) 885-0500 www.kaltmancreationsllc.com

COTS Technology with a Custom Twist.

Many companies choose to focus on what they offer to the customer by way of solutions and skills. System providers and niche market OEMs often sub-contract their computer hardware design. If your application has unusual requirements, Sundance has the skills and resources to specify, design, manufacture and test a custom solution for you.

Our design engineers will help you to develop a specification that meets your requirements, whilst making every effort to ensure that your product conforms to appropriate industry standards. By doing so, your product will be re-useable in future system-building applications. As a result, you will enjoy the benefits of both compatibility and an optimised solution, along with a fast, cost-effective route to market.

For more information on any of these products, or assistance please contact us and we will help you the best we can.

Sundance Multiprocessor Technology Ltd. cots@sundance.com • www.sundance.com Photo: U.S. Air Force / Sr. Airman Nathanael Callon

44

COTS Journal | October 2016

COTS PRODUCTS

Hyperconverged Platform Blends Compute, Storage and Network Functionality KALEAO introduced KMAX: as system that provides compute, storage and networking in an integrated platform. As a hyperconverged platform, KMAX dynamically defines “physicalized” computing resources and assigns them directly to virtual machines and applications, without unnecessary software layers. An ultra-efficient lightweight hypervisor called a microvisor works seamlessly with hardware to orchestrate global pools of software defined and hardwareaccelerated resources. KMAX removes the performance overhead that is typical when layering applications over a virtualized, hyperconverged platform Embedded Solutions running on commodity hardware, while for the Next 25 Years enabling appliance simplicity and the Acromag Redefines SWaP-C With flexibility of a software-defined solution.

Our New AcroPack® I/O Platform Leveraging this advanced technology and the cost advantages of ARM 64-bit The AcroPack® product line updates our popular Industry Pack I/O modules by using the hardware, KMAX is capable of achieving mPCIe interface format. We added 19mm and a 100 pin connector to provide up to 50 significant improvements in energy isolated rear I/O signals, giving you a tremendous amount of capability on an efficiency, density and scalability.

Extremely Small Footprint - Without Cabling!

The KMAX platform follows the design principles of low power consumption, data locality, high density and high Key Features Include: performance. In terms of performance ▪ A/D, D/A, serial, digital I/O, density KMAX provides 1536 CPU cores, counter/timers and FPGA 370 Terabytes of all flash storage and 960 Gbits/s in 3U Rackspace. That’s up to ▪ Low-power consumption 10 times the performance density than ▪ Solid-state electronics today’s typical hyperconverged offerings, ▪ -40 to 85°C standard operating blades and rackmount solutions. Energy temperature efficiency is less than 15W for each 8-core server with 10 Gbit/s I/O, providing over ▪ Conduction cooled models available four times the performance per unit of ▪ Mix and match endless I/O combinations energy spent. KMAX further reduces in a single slot by using our VPX or an organization cost of ownership by Two AcroPack I/O modules shown PCIe-based carriers over 3 times by allowing the adoption plugged into a PCIe carrier of web scale, flexible and manageable infrastructure, paving the way for enterprises to obtain a more efficient and Visit Acromag.com/AcroPacks agile IT management that translates into TO LEARN MORE bottom line savings.

Embedded I/O Solutions KALEAO Charlotte, NC (704) 235 4809 www.kaleao.com

FPGA Modules

AcroPack I/O Modules

VME SBCs

SFF Embedded Computers

www.acromag.com | solutions@acromag.com | 877-295-7084

COTS Journal | October 2016

45

COTS PRODUCTS

6U cPCI Blade Marries Intel Xeon D-1500 and AMD Radeon E8860 ADLINK Technology has introduced the cPCI-6940 processor blade featuring the Intel Xeon processor D-1500 and AMD Radeon E8860 embedded GPU. The cPCI-6940 6U CompactPCI processor blade offers up to 16-core computing power and high-performance graphics in a robust design. With an extended operating temperature range of -45 to 85 degrees C and 16 CONVERTER Gbytes of DDR4 soldered memory, the cPCI-6940 is ideal for the rugged environments encountered by military field vehicles and naval or aerospace carriers.

The Intel Xeon processor D-1500 for Military & High Reliability Applications has a TDP of 35 to 45 W and gives • 800 Watts Conduction Cooled (No Fans) the cPCI-6940 a 1.5x performance • 9~45 or 16~80 VDC Input Ranges increase over its predecessor, • MIL-STD-704, 461 & DO-160 Compliant the cPCI-6930 (8-core Intel Xeon • Measures only 180 x 120 x 60mm processor E5-2448L). Server class computing capabilities include hardware virtualization and Intel AES-NI for secure transmission in the field. Graphics on the cPCI-6940 are supported by the AMD Radeon E8860 GPU. 800 Watt Modular DC-DC Power System The cPCI-6940 is available in single/dual-slot (4/8 HP) width form • Up to 4 Isolated Outputs factor versions and offers flexible • Parallel or Serial Connections connectivity and storage options.

• -40~+85°C Ambient (-55°C Option), Faceplate IO includes 1x RJ-45 serial Conduction Cooled Operation port, 1x DisplayPort, 1x VGA, 2x • Ultra-Wide input ranges: GbE, and 2x USB 3.0 ports. Dual slot - 9~45Vdc (transient 60Vdc/100ms) versions support dual integrated - 16~80Vdc (transient 100Vdc/100ms) 10G SFP+ KR ports, while two • Reverse Polarity Protection additional 10GBASE-T ports can be • Inrush Current Limiting configured through XMC expansion.

• Advanced Status & Control Two DVI-D ports are routed to rear - Global Output Enable / Inhibit I/O. Expansion options include one - Individual Voltage Enable / Inhibit PCIe x16 to J4 and one PCIe x4 to J5.

- Synchronization In/Out (560kHZ) Storage is provided by up to two 2.5 - Over Temperature Monitor inch onboard SATA drives and four - Remote Sense (≤10% compensation) SATA ports routed to the backplane.

- Output Voltage Trimming

AIA

Flexible DC-DC Power Systems

GPack800

- Output Current Trimming - Active Current Share (± 5% Accuracy)

• Up to 88% efficiency

w w w . g a i a - c o n v e r t e r. c o m 46

COTS Journal | October 2016

ADLINK Technology San Jose, CA (408) 360-0200 www.adlinktech.com

COTS PRODUCTS

COM Express: Wide Variety, Long Lifecycles

Digital Receiver Combines GNU Radio, GSM Beamformer and More Innovative Integration, a Molex company, has announced a Rugged Digital Receiver K707 which integrates an embedded PC running 64-bit Linux with an internal Xilinx K410T2 FPGA and optional 3-18 GHz RF receiver in a module. It is a 3-in-1 unit: a digital beamformer, spectrum analyzer and custom software defined radio solution. Two FMC-310 plug-in modules provide up to 6 antenna inputs, 128 independent channels of DDC, and one spectrum analyzer embedded in a Xilinx Kintex-7 FPGA. The K707 is capable of monitoring and/or recording of wide, narrow-band spectra or channelized IF band data and supports continuous recording at 1,300 Mbytes/s to four SSDs until running out of disk space. Eight DDC banks, 16 channels each, can monitor 128 DDC channels per single module. Each DDC bank can select its ADC source and decimation rate; each DDC channel has its own programmable tuner and programmable low-pass filtering supporting output bandwidth up-to 800 KHz. The spectrum analyzer can calculate the wide-band spectrum of raw ADC data or the narrowband spectrum. A development kit is also available.

Innovative Integration Camarillo, CA (805) 383-8994 www.innovative-dsp.com

DFI Tech offers COM Express modules with the latest generation Intel Core i ™ and Atom™ processors. With seven-year CPU lifecycle support, DFI Tech offers a wide variety of board-level and system solutions.

•Up to 6th Generation

Low Profile PCIe Synch Adapter Supports Multiple Outputs

Intel Core i7 (Skylake)

•Basic, Compact, Mini, Qseven,

Sealevel Systems has announced, the 5104e, its first Zilog Z16C32-based PCI Express sync adapter configurable for RS-232, RS-422, RS-485, RS-530, RS-530A, or V.35 (with optional cable accessary). By using the Zilog Z16C32, multiple functions can be integrated on a single chip. They include Universal Serial Controller (IUSC) with on-chip direct memory access (DMA) controller and 32-byte first in, first out (FIFO) buffer coupled with 256K of on-board memory. Burst rate can reach 10 Mbps. The DMA controller supports a variety of data transfer modes including single buffer, pipelined, array and link list. An optional OEM security feature is available. Single quantity 5104e is priced at $649.

and Carrier versions

•Type 6, Type 2, Type 10, and more

•Seven year & beyond lifecycle support

•System-level design and customization available

Sealevel Systems Liberty, SC (864) 843-4343 www.sealevel.com

www.dfitech.com FIND the products featured in this section and more at

intelligentsystemssource.com

sales.inquiry@dfitech.com Sacramento, CA 916-568-1234

COTS Journal | October 2016

47

COTS

ADVERTISERS INDEX GET CONNECTED WITH INTELLIGENT SYSTEMS SOURCE AND PURCHASABLE SOLUTIONS NOW Intelligent Systems Source is a new resource that gives you the power to compare, review and even purchase embedded computing products intelligently. To help you research SBCs, SOMs, COMs, Systems, or I/O boards, the Intelligent Systems Source website provides products, articles, and whitepapers from industry leading manufacturers---and it's even connected to the top 5 distributors. Go to Intelligent Systems Source now so you can start to locate, compare, and purchase the correct product for your needs.

Index

intelligentsystemssource.com

Company Page# Website

Company Page# Website

Acromag..............................................45........................... www.acromag.com AIM......................................................14........................ www.aim-online.com Aitech..................................................27..............................www.rugged.com Cemtrol................................................2.............................. www.cemtrol.com Chassis Plans......................................22................... www.chassis-plans.com Critical I/O...........................................5............................ www.criticalio.com Dawn VME...........................................41.......................... www.dawnvme.com DFI Tech..............................................47..............................www.dfitech.com Eizo Rugged........................................26........................www.eizorugged.com Elma Electronics.................................39................................. www.elma.com Equipto................................................43.......................www.equiptoelec.com GAIA Converter Inc..............................46.................. www.gaia-converter.com HVF Precious Metals............................36............www.hvfpreciousmetals.com Innovative Integration.........................18..................www.innovative-dsp.com Mercury Systems, Inc. ........................52................................. www.mrcy.com

North Atlantic...................................15, 17................................ www.naii.com NovaSom Industries............................13........... www.novasomindustries.com One Stop Systems, Inc. ......................4, 7....................... onestopsystems.com Pentek.................................................51.............................. www.pentek.com Phoenix International..........................23........................... www.phenxint.com Pico Electronics, Inc............................25................. www.picoelectronics.com Pixus Technologies..............................38.............www.pixustechnologies.com Stacked Technologies..........................21.........www.stackedtechnologies.com Star Communications Inc....................42......................www.starcommva.com Sundance............................................44..........................www.sundance.com SynQor.................................................35...............................www.synqor.com Systel USA...........................................37.......................... www.systelusa.com TQ-Systems.........................................49...............www.embeddedmodule.net COTS Gallery Ad..................................40.........................................................

COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 150, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices.

POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 150, San Clemente, CA 92673.

COMING NEXT MONTH Special Feature: Advances in Small Form Factor Box Systems

Small form factor rugged box have become a staple in today’s military embedded computing market. On the standard-based side, only one of the three VITA specification efforts is continuing forward toward full ANSI standardization. Meanwhile a new wave of smaller, more computedense SFF systems is emerging. This section looks at this critical product class and the trade-offs versus slot-card solutions, and how system consolidation is impacting the choices made in military system designs.

Tech Recon: Jeff’s Picks: Jeff Child’s Top Video Distribution and Display Systems

In the Jeff’s Picks section we choose the top products in a different category each month and share insights on why they’re significant in terms of design innovation, market relevance and technology leadership. The November Jeff’s Picks section looks at video distribution and display systems that serve the needs of today’s warfighters.

48

COTS Journal | October 2016

System Development: : Leveraging IoT Strategies for Defense Needs

The latest buzzword gaining steam in the technology world is Internet-ofThings (IoT). Today the military is very much interested in the technologies and capabilities of IoT. In its basic sense an IoT network is a connection of sensors, embedded devices and systems. That’s really the same sort of architecture is essentially what the DoD has been calling “net-centric” operations for more than a decade now. This section looks at the cloud computing, network gateway and sensor interface solutions from the IoT that can be applied to defense needs..

Data Sheet: Rugged Stand-Alone Box Products Roundup

Traditional embedded board vendors have added stand-alone rugged boxlevel systems to their military market offerings. These complete system boxes often support standard form factor boards inside them. The result is a complete, tested and enclosed computing solution that eliminates complex integration chores for customers. This section looks at this emerging product class and outlines the problems they solve. A product album rounds up the latest representative products in this area.

Experience Real Design Freedom

Only TQ allows you to choose between ARM®, Intel®, NXP and TI • Off-the-shelf modules from Intel, NXP and TI • Custom designs and manufacturing • Rigorous testing • Built for rugged environments: -40°C... +85°C • Long-term availability • Smallest form factors in the industry • All processor functions available

For more information call 508 209 0294 www.embeddedmodules.net

COTS Journal’s

MARCHING TO THE NUMBERS

21.23 BILLION

$

Forecasted value of the UAV Drones market is projected to reach by 2022 at a CAGR of 19.99 percent during the forecast period, according to a new research report published by ASDReports.com. The report covers the UAV/drones market by type, payload, application and geography. The major factors driving this market include the increasing demand for drones for commercial applications and rapid technological advancements in drones. The sensors component is estimated to grow at the highest rate during the forecast period—including sensors in military drones used for marking targets, guiding munitions and more.

1,661 The number of Family of Medium Tactical Vehicle (FMTV) Oshkosh Defense will produce per a contract U.S. Army awarded to the company for $409 million under Order Year 7 of the current FMTV contract. That total also includes 31 trailers. Deliveries will continue through July 2018. The current generation FMTV A1P2 is comprised of 17 models ranging from 2.5-ton to 10-ton payloads. The vehicles feature a parts commonality of more than 80 percent, resulting in streamlined maintenance, training, sustainment and overall cost efficiency for the U.S. Army, Army Reserves, National Guard and U.S. Air Force.

20 MONTHS

Length of extended planned stay in port for the aircraft carrier USS Nimitz (CVN 68). Early this month the Nimitz pulled into San Diego after completing a successful six-day sea trials. The sea trials where the first time the Nimitz got underway since January 2015. Sea trials is intended to assess the ship’s readiness by evaluating the crew’s performance, and testing the operability of the ship’s equipment and upgrades using various system checks and drills. The evaluations included the execution of high-speed turns, sea and anchor and precision anchoring exercises, testing of the ship’s self-defense weapons and more.

50

COTS Journal | October 2016

2020

Year by which Rockwell Collins is expected to repair US UH-60 displays units according to a contract from the U.S. Army. The company is servicing the MFD-268C4 multi-function display (MFD) units for its UH-60M Black Hawk fleet under a five-year firm-fixed-price, indefinite delivery, indefinite quantity contract.

This is a follow-on contract that continues the Army’s relationship with Rockwell Collins for long-term support of the program. Installed on the Army’s UH-60M Black Hawk helicopters, the MFD-268C4 displays provide advanced graphic engines, safety critical processing, and Active Matrix LCD technologies, as well as multiple video interfaces.

1.9 BILLION

$

Total value of IDIQ contract is expected to reach for L-3 Communications’ Vertex Aerospace division to provide full contractor logistics support (CLS) for the U.S. Air Force (USAF) KC-10 aircraft fleet. That approximate total value of this firm-fixed-price contract is expected to be reached over a 9 year period.

Under the contract, L-3 will provide Contractor Operated and Maintained Base Supply (COMBS), Field Service Representative (FSR) and depot maintenance support for 59 USAF KC-10 aircraft, as well as support for the Aerial Refueling System for two Royal Netherlands Air Force KDC-10 aircraft.

Capture. Record. Real-Time. Every Time.

Intelligently record wideband signals continuously...for hours Capturing critical SIGINT, radar and communications signals requires hardware highly-optimized for precision and performance.

Our COTS Talon® recording systems deliver the industry’s highest levels of performance, even in the harshest environments. You’ll get extended operation, high dynamic range and exceptional recording speed every time!

•

High-speed, real-time recording: Sustained data capture rates to 8 GB/sec

•

Extended capture periods: Record real-time for hours or days with storage up to 100+ TB

•

Exceptional signal quality: Maintain highest dynamic range for critical signals

•

Flexible I/O: Capture both analog and digital signals

•

Operational in any environment: Lab, rugged, flight-certified, portable and SFF systems designed for SWaP

•

Out-of-the-box operation: SystemFlow® GUI, signal analyzer and API provide simple instrument interfaces

•

Intelligent recording: Sentinel Intelligent Scan and Capture software automatically detects and records signals of interest ™

Eight SSD QuickPac™ canister, removable in seconds!

Download the FREE High-Speed Recording Systems Handbook at: www.pentek.com/go/cotstalon or call 201-818-5900 for additional information.

Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2016 Pentek, Inc. Pentek, Talon, SystemFlow, Sentinel and QuickPac are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.

Innovation

That Protects.

When data protection is mission critical, you can trust mercury’s secure solid state drives (ssds). our ssds provide exceptional data-at-rest protection against intruders, even in the harshest environments. these rugged drives are engineered and manufactured in our

dmea

trusted facility and our commitment to long-

term product support guard against obsolescence risk.

Key Features: • Densities from 32GB to 1TB • Multiple form-factors from onboard BGA’s to 2.5” removable platforms • AES 256 XTS encryption • Multiple key management modes • High-speed purge, clear and sanitization validation • Meets all DoD military purge protocols • Customizable security features and packaging options

Visit mrcy.com/SSD to learn more.

Copyright © 2016 Mercury Systems and Innovation That Matters are trademarks of Mercury Systems, Inc. - 3193