COTS Journal

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February 2017, Volume 19 – Number 2 • cotsjournalonline.com

The Journal of Military Electronics & Computing JOURNAL

Cloud Computing and IoT Enter Defense Arena

JEFF'S PICKS JEFF'S TOP BACKPLANE SOLUTIONS MODELING SMOOTHS PATH TO RADAR DESIGN SUCCESS DATA SHEET: SMALL RUGGED BOX SYSTEMS An RTC Group Publication


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The Journal of Military Electronics & Computing JOURNAL

CONTENTS

COTS (kots), n. 1. Commercial off-the-shelf. Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements. —Ant. When applied to the procurement of electronics for he U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

January 2017 Volume 19 Number 1

FEATURED p.10 IoT and Cloud Computing Gear Up for Military Duty SPECIAL FEATURE Cloud Computing and IoT for the Military 10 14

IoT and Cloud Computing Gear Up for Military Duty

DEPARTMENTS 6 Editorial

Tick, Tock, Tock

Jeff Child

Net-Connected Systems Wrestle with Cybersecurity John Koon

8

The Inside Track

32

COTS Products

42

Marching to the Numbers

TECH RECON Jeff Child’s Top Backplane Solutions 18

C4ISR/EW Modular Open Standards Supported on 3U VPX Backplane Jeff Child

SYSTEM DEVELOPMENT Modeling Military Radar Systems 22

Modeling Technology Critical for Radar System Designs Honglei Chen, Rick Gentile, Mathworks

Coming in March See Page 44 On The Cover: Last year the Navy and Marine Corps team executed a series of tests including evaluating the F-35B fighters’ aircraft-to-ship network interoperability in a fully operational setting. The USS America (LHA 6), a large deck amphibious assault ship, participated in the testing. The USS America shown in in the Pacific Ocean on June 24, 2016. (US Navy Photo).

DATA SHEET Small Rugged Box Systems Roundup 26 27

Small Box Systems Deliver on SWaP Requirements Jeff Child

Small Rugged Box Systems Roundup

Digital subscriptions available: cotsjournalonline.com

COTS Journal | February 2017

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JOURNAL

The Journal of Military Electronics & Computing

Editorial

EDITOR-IN-CHIEF Jeff Child, jeffc@rtc-media.com EXECUTIVE EDITOR Johnny Keggler, johnnyk@rtc-media.com SENIOR EDITOR John Koon, johnk@rtc-media.com

WESTERN REGIONAL SALES MANAGER John Reardon, johnr@rtc-media.com (949) 226-2000 EASTERN REGIONAL SALES MANAGER Ruby Brower, rubyb@rtc-media.com (949) 226-2004

Finance

COTS Journal HOME OFFICE The RTC Media, LLC 940 Calle Negocio, Suite 230 San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050 www.rtc-media.com

MANAGING EDITOR James Pirie, jamesp@rtc-media.com

CONTROLLER Cindy Muir, cindym@rtc-media.com (949) 226-2000

EDITORIAL OFFICE Jeff Child, Editor-in-Chief Phone: (603) 429-8301

Art/Production

Publisher

PUBLISHED BY THE RTC GROUP Copyright 2017, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.

ART DIRECTOR Jim Bell, jimb@rtc-media.com GRAPHIC DESIGNER Hugo Ricardo, hugor@rtc-media.com

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COTS Journal | February 2017

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EDITORIAL Jeff Child, Editor-in-Chief

Tick, Tock, Tock

I

n the world of military embedded computing, Intel processors are now long past the days when they were the outsider looking in. Things were not always so. Until about 20 years ago, Intel processors couldn’t crack the competition held by Motorola 68000 line of CPUs and its massive installed base in military systems. Many of those 68k based systems upgraded to the PowerPC processor in order to avoid rewriting all the legacy embedded software. Another issue was that Intel processors were burdened with power dissipation levels much higher than the embedded-focused PowerPC/68000 lineage of processors. High power dissipation translates to managing heat levels—a problem that’s particularly tricky in defense systems where conduction cooling is preferred over the use of fan cooling. The turning point came as Intel’s line of processors developed for laptop and other portable devices evolved to where they contend and often surpass the low power levels of the completion. Today processors like Intel Core i7 family now offer leading edge levels of compute performance within a reasonable realm of power dissipation. Along the way, the growing sophistication of software deployment—in terms of operating systems and tools—makes it no longer a huge chore to port from legacy processor architectures to new ones and thus switching to Intel was less of a hurdle. And while legacy PowerPC ( formerly Motorola, then Freescale and now NXP) technology is still a force in the military embedded space, it no longer dominates. Looking at the last 12 to 18 months, significantly more board and box-level products based on the Core i7 have emerged than on any other processor—many of those based on the 5th and 6th generation Core i7 processors. COTS Journal covers those products each month giving us a pretty good perspective on which processors embedded computing suppliers are designing in on board- and box- products marketed toward defense customers. Because defense runs a generation behind the consumer and desktop computing markets, most of the SBCs and systems aimed at the military embedded computing market last year were 5th gen Broadwell Core i7, with some 6th gen Skylake products seen as well. In 2017 we’re already seeing a slew of products rolling out based on Intel’s 7th generation Core i7 ( formerly code named Kaby Lake). For some years now, Intel has followed a yearly roll out strategy for its processors that’s become known as “Tick Tock”. On even numbered years a processor family advanced to new manufacturing process— Tick. And on odd numbered years that same processor family would get a new architecture design. 2012’s Ivy Bridge processors (Tick) for example was introduced on a 22-nm process (down from 2011’s 32 nm Sandy Bridge process). And 2013’s Haswell (Tock) processor introduced an architecture upgrade while maintaining a 22-nm process. 6

COTS Journal | February 2017

The pattern continued in 2014 with Intel’s Broadwell introduced on 14 nm process followed in 2015’s Skylake once again with a new architecture. The Kaby Lake or 7th Gen i7 (i3, i5, m3) has broken the Tick Tock cycle making no architecture change while using a “tweaked version of Intel’s 14 nm silicon process. In keeping with the theme of low power discussed above, the 7th generation Core processor maintains a standardized thermal envelope for 65W and 35W desktop products, remaining consistent with the previous processor generation. In terms of efficiency, Intel claims the improved technology promises up to 17 percent faster multithreaded CPU performance and up to 15 percent faster graphics. That’s all at the same or similar thermal design power (TDP) as the prior generation. Intel says the Kaby Lake enables developers to craft more flexible designs with the same high-speed I/O as the previous generation and tap into fast memory performance and 64 Gbyte max capacity with 8 Gbyte density. The 7th gen Core i7 and Intel Core i5 processors come with Intel Turbo Boost Technology 2.06. With Intel Hyper-Threading Technology (only on Intel Core i7 processors) each processor core can work on two tasks simultaneously. Other important features include Intel Advanced Vector Extensions 2 (Intel AVX2), which provides optimized instructions to drive enhanced performance on floating point-intensive apps, and the company’s Ready Mode Technology for PCI Express storage. New to 7th Gen device are accelerated 4K hardware media codecs. These provide enhanced high-density streaming applications and optimized 4K videoconferencing with HEVC (10-bit), VP8, VP9, and VDENC encoding, decoding, and transcoding. Offering 4K Ultra HD capability enables resolutions now up to 4096 x 2304 pixels with support for performance across three independent displays with audio. It’s worth pointing out that Intel for its part has become very helpful to embedded system developers by providing clear roadmap information on their processors. These help board and box system suppliers know what’s coming, and perhaps more importantly knowing how many years a processor will stay in production. The military’s long development cycles have always been way out of synch with the consumer semiconductor market. Design cycles for military platforms can be decades long versus one year (or less) long life cycles of the consumer products. But while semiconductor suppliers like Intel and others know the military market is a tiny slice of their revenue, they do a pretty good job providing clear roadmaps of their product lifecycles. In the upcoming months and throughout the year, expect to see the next wave Intel processor based SBCs and rugged systems here in the pages of COTS Journal.


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INSIDE TRACK US Navy Taps BAE Systems to Modernize USS Roosevelt The U.S. Navy has awarded BAE Systems a $51.3 million contract for the maintenance and modernization of the USS Roosevelt (DDG 80), an Arleigh Burkeclass guided missile destroyer. The full value could reach $68.4 million if all options are exercised. Under the competitively awarded, depot maintenance availability contract, BAE Systems first will dry dock the ship at the company’s shipyard and then complete the work at Naval Station Mayport, both located in Jacksonville, Florida. The work is expected to begin in April and be completed in April 2018.

The USS Roosevelt is the 30th ship in the Arleigh Burke class and was commissioned in October 2000 (Figure 1). BAE Systems is a leading provider of ship repair, maintenance, modernization, conversion, and overhaul services for the Navy, other government agencies, and select commercial customers. The company operates five full-service shipyards in Alabama, California, Florida, Hawaii, and Virginia, and offers a highly skilled, experienced workforce, dry docks and marine railways, deep water access, and significant pier space and ship support services.

BAE Systems Arlington, VA (703) 312 6100 www.baesystems.com

AUDS Counter-Drone System Achieves DoD TRL-9 Status The AUDS counter-UAS defense system is the first fully integrated system worldwide to achieve TRL-9 status. This follows the successful mission deployment of the AUDS system with United States Forces. The AUDS system—developed by Blighter Surveillance Systems, Chess Dynamics and Enterprise Control Systems—can detect a drone six miles (10km) away using electronic scanning radar, track it using precision infrared and daylight cameras and advanced video tracking software before disrupting the flight using a non-kinetic inhibitor to block the radio signals that control it (Figure 2). TRL-9 is the very highest technology readiness level or maturity that a technology system can attain. TRL-9 signifies that a technol-

8

Figure 1 The USS Roosevelt is the 30th ship in the Arleigh Burke class and was commissioned in October 2000.

Blighter Surveillance Systems Saffron Walden, UK +44 1223 491122 www.blighter.com

DARPA Teams with Flex Logix to Develop FPGA IP for Gov Projects

Figure 2 The AUDS system can detect a drone six miles (10km) away using electronic scanning radar and track it. It can then disrupt the drone’s flight using an inhibitor to block its control signals. ogy system or product is in its final form and that the actual system is proven through successful mission operations. Over the last 18 months, the AUDS system has been heavily evaluated and tested by

COTS Journal | February 2017

military and government organizations. Through this process, AUDS consistently exceeded the mission requirements, simultaneously providing ground and air surveillance against possible threats.

DARPA (Defense Advanced Research Projects Agency) has signed an agreement to work with Flex Logix to develop Flex Logix’s EFLX embedded FPGA technology for use by any company or government agency designing integrated circuits for the US Government. As part of the agreement, Flex Logix will make available EFLX arrays in the TSMC 16FFC process node from 2.5K to 122.5K LUTs so that these companies and agencies can reconfigure RTL at any point during the design process. Having this flexibility will enable chip designers to increase performance,


The

INSIDE TRACK reduce power and lower the size/ weight of their critical systems. The EFLX platform will also allow companies to customize one chip in software for numerous applications; or even upgrade the chip when already deployed in the field. Flex Logix is already engaged with additional IC designs under this agreement with DARPA, and it also provides the software for programming the embedded FPGA. The EFLX-2.5K Logic and DSP IP cores are also available for license to any commercial customer directly from Flex Logix. Flex Logix provides an EFLX-2.5K Logic IP core and EFLX-2.5K DSP IP core which are the building blocks for almost 50 different sized arrays. Flex Logix Technologies Mountain View, CA www.flex-logix.com

Boeing Secures $2.1 billion Deal for 15 KC-46A Tanker Aircraft The U.S. Air Force has awarded Boeing $2.1 billion for 15 KC-46A tanker aircraft, spare engines and wing air refueling pod kits. This

order is the third low-rate initial production lot for Boeing. The first two came in August 2016 and included seven and 12 planes, respectively, as well as spare parts. Boeing plans to build 179 of the 767-based refueling aircraft for the Air Force to replace its legacy tanker fleet. Tanker deliveries will begin later this year. Boeing received an initial contract in 2011 to design and develop the Air Force’s next-generation tanker aircraft. As part of that contract, Boeing built four test aircraft – two configured as 767-2Cs and two as KC-46A tankers. Those test aircraft, along with the first production plane, have completed nearly 1,500 flight hours to date. The KC-46A is a multirole tanker that can refuel all allied and coalition military aircraft compatible with international aerial refueling procedures and can carry passengers, cargo and patients (Figure 3). Boeing Integrated Defense Systems St. Louis, MO (314) 232-0232 www.boeing.com

TECHNOLOGY SPOTLIGHT OpenVPX Connector Supports 10 Gbit/s Rates with Path to Higher Speeds For most board level products the chips are the star of the show—for example microprocessors, GPUs and FPGAs. But not so on backplanes. For backplanes it’s all about the connectors. (See Jeff ’s Picks: Backplane Solutions” section on p.18 of this issue). Exemplifying leading edge connector technology is the MULTIGIG RT 2-R connector from TE Connectivity (TE) (Figure 1). This rugged, lightweight and high-speed board-to-board interconnect is compliant to VITA 46 and supports OpenVPX architecture. The connector system features modularity and flexibility. The configurable PCB wafer interface has enabled new combinations of power and signal to support SpaceVPX standards VITA 78 and 78.1, as well as custom configurations.

Figure 4: The Shadow v2 UAV is an all-digital, modern system, optimized for new multi-mission, single-sortie profiles and mannedunmanned teaming.

Figure 3

TE collaborated with Mercury Systems to develop and test this connector and contact system for use in the most challenging environments, beyond requirements of the VITA 47 VPX standard. Thermography was used to analyze the positioning of power wafers within the connector array and their effect on thermal characteristics. This study helped define power contact layouts with alternate connector module configurations. According to TE, these connectors are designed for rugged embedded computing applications for ground defense, missile defense, electronic systems/C4ISR, and commercial and military aerospace applications. The RT 2-R connectors support high-speed protocols up to 10Gb and with a path to 16Gb and higher. Because it is a modular connector platform, it can be used in conjunction with RF Modules (VITA 67) and optical modules (VITA 66) to customize slot configurations using standard components. The RT 2-R is constructed from a variety of advanced materials. The contacts are high performance copper alloy plated 50 μin Au (gold) in the mating area, and tin-lead or tin options on compliant pin tails. The connector housings are space compatible, high-temperature thermoplastic. The rugged guide hardware is made from aluminum or passivated stainless steel.

The KC-46A is a multirole tanker that can refuel all allied and coalition military aircraft compatible with international aerial refueling procedures.

TE Connectivity, Berwyn, PA (610) 893-9800. www.te.com

COTS Journal | February 2017

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SPECIAL FEATURE Cloud Computing and IoT for the Military

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COTS Journal | February 2017


SPECIAL FEATURE

IoT and Cloud Computing Gear Up for Military Duty IoT and Cloud Computing solutions from the commercial world are becoming attractive to defense applications as virtualized computing and sensor networking take center stage. Jeff Child, Editor-in-Chief

T

he Internet of Things (IoT) and Cloud Computing phenomena continue to skyrocket in the consumer, industrial and IT markets, the defense industry is eager to leverage whatever they can from those technologies. What gets confusing however is that the underlying parts of IoT and “the cloud” are pretty much the same things the U.S. military has been evolving toward for several years now. Case in point: the military has long been interested in perfecting ways to move data captured from a multitude of sensors and collecting it on a virtualized “cloud” network where it can be used from any remote location. But instead of “IoT’ the military has been calling that “Net-Centric” operations for over a decade now. This network-centric idea includes programs to build joint architectures and roadmaps for integrating joint airborne networking capabilities with the evolving ground, maritime and space networks. Note that the military talking about a “Global Information Grid” long before terms like “the cloud” entered the mainstream.

COTS Journal | February 2017

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SPECIAL FEATURE

cause system developers needed computing systems to work alongside 1U rackmount routers from Cisco and other comms gear from various vendors. Fast forward to today, and that idea has inverted itself: now Cisco’s-switching and routing technologies are being embedded into the box-level products of Cisco’s partners in our embedded computing industry.

Embedded Routing Technology Figure 1 The XPand6052 system integrates an XMC/PMC-based Embedded Services Router (ESR) router that runs Cisco IOS Software with Cisco Mobile Ready Net capabilities.

Question of Terminology The challenge therefore gets to be a little bit of identifying what products and technologies serve the needs of military cloud computing and military IoT even when the terminology may not include “cloud” or “IoT. In its basic sense an IoT network is a connection of sensors, embedded devices and systems. Military cloud computing was Mercury Systems’ motivation to re-entered the ATCA two years ago with its Ensemble HDS8613 dual Intel Xeon serverclass processor ATCA blade and the Ensemble SFM8104 40 Gb/s Ethernet/InfiniBand ATCA switch. But there are many vendors in the military embedded computing industry that make high-density severs capable of virtualizing computing without using the word “cloud” in their market. There are many that make networking technologies that function like IoT gateways without using the term “IoT”. And there are numerous vendors expert in technologies that capture and aggregate sensor data and never use terms like “IoT Edge devices”. One can’t get into the topic of networkcentric technologies without including the role of Cisco Systems. The DoD has collaborated closely with Cisco in multiple core network and edge-implantations of the DoD’s networks including what is today called the DoD Information Network (DoDIN). Moreover, routing, switching, unified communications, and security technologies from Cisco enables all the wired and wireless (SATCOM) infrastructures necessary for the DoD’s global coverage. In addition, Cisco 12

COTS Journal | February 2017

technologies are used in net-centric tactical communications programs in all branches of the U.S. Military. Among those programs are the Army’s Warfighter Information Network -Tactical (WIN-T); the Air Force’s Theater Deployable Communications (TDC); the Navy’s Automated Digital Network System (ADNS); and the Marine Corps’ Comm On the Move. Airborne platforms using Cisco technologies include the Navy P3 and TRITON Air Force AWACS, JSTARS, VIP Aircraft, C130s, and Global Hawk. It can be argued that the desire to use gear from the IT and telecom industries driven the kinds of form factor choices used in some military programs. For example, the emergence of 1U rackmount servers in military vehicle mounted systems happened be-

Along those lines, vendors including Curtiss Wright, Extreme Engineering, Elma and General Micro Systems offer a variety of board- and box-level system that provide the functionality of a Cisco router either stand-alone or now often integrated with many other mission computing hardware. The need for unwieldy rack-mounted gear becomes unnecessary when more rugged stand-alone box systems can provide the same functionality. An example along those lines is Extreme Engineering Solutions’ XPand6052 box level system integrates the XPedite5205: an XMC/PMC-based Embedded Services Router (ESR) router that runs Cisco IOS Software with Cisco Mobile Ready Net capabilities (Figure 1). Meanwhile there are several embedded computing technology companies that are aggressively pursuing the industrial IoT and Cloud Computing market segments alongside—many of which also play in the defense market. It remains to be seen whether or not those companies will have a leg up when it comes to applying IoT and Cloud Computing

Figure 2 The PL-81060 is a high-performance server with dual Cavium ThunderX processors optimized as a Cloud and Data Center server with up to 240 Terabytes of storage. The dual Cavium ThunderX CN8890-2000 processors boast 48 cores each.


SPECIAL FEATURE

to military applications. Along those lines, WIN Enterprise last fall introduced its PL81060, a high-performance server with dual Cavium ThunderX processors optimized as a Cloud and Data Center server (Figure 2). From the 64-bit ARMv8 server processor family, the dual Cavium ThunderX CN8890-2000 processors boast 48 cores each. The system provides up to Up to 24x 3.5 inch HDDs providing up to 240 Terabytes of storage and 4x 2.5-inch HDD/SSDs providing an additional 8 Terabytes of cache storage. In another example, in October Eurotech announced the EDCK 4001, a new Everyware Device Cloud Development Kit that bundles all the hardware and software needed to prototype, develop, test and integrate a complete IoT solution that bridges the gap between sensors, devices and the cloud. While targeted for industrial applications, it’s clear that there’s applicability to defense IoT implementations as well. The EDCK 4001 Development Kit lets users model their use cases starting from a realistic template that integrates all the key elements typical of an industrial IoT chain (Gateway, PLC, field devices, field protocols, cloud services). The EDCK 4001 Development Kit includes a ReliaGATE 10-11, Eurotech’s IoT Gateway for industrial applications, and a PLC connected to a demo board fitted with digital and analog controls. The kit provides all the Virtual Machine, Framework and middleware needed for an IoT implementation. It includes a trial license of Everyware Cloud (EC), Eurotech’s IoT Integration Platform. EC, which provides cloud-based access, visualization and management of the device, and additional services like data storage, analytics and remote software deployment and update.

Hyperconverged Virtualization While a number of vendors have embraced the idea of coverage embedded computing, KALEAO has made it the centerpiece of its offerings. Last fall the company introduced its KMAX system that provides compute, storage and networking in an integrated platform. As a hyperconverged platform, KMAX dynamically defines “physicalized” computing resources and assigns them directly to virtual machines and applications, without unnecessary software layers (Figure 3). It uses an ultra-efficient light-

Figure 3 KMAX dynamically defines “physicalized” computing resources and assigns them directly to virtual machines and applications, without unnecessary software layers.

weight hypervisor called a microvisor. The microvisor works seamlessly with hardware to orchestrate global pools of software defined and hardware-accelerated resources. KMAX removes the performance overhead that is typical when layering applications over a virtualized, hyperconverged platform running on commodity hardware. The hyperconverged and orchestration functionality can be used to efficiency implement, deliver and manage cloud services, without incurring the typical virtualization compromise between agility and performance. The KMAX uses ARM 64-bit hardware to achieve low power consumption, data locality, high density and high performance. In terms of performance density KMAX provides 1536 CPU cores, 370 Terabytes of all flash storage and 960 Gbits/s in 3U Rackspace. KALEAO claims that’s up to 10 times the performance density than today’s typical hyperconverged offerings, blades and rackmount solutions.

Net Virtualization Solution ADLINK Technology and Wind River— both separately with well-established backgrounds in the IoT space—recently teamed up to establish joint lab facilities in Shanghai, China and San Jose, CA, US, to promote the adoption of Network Functions Virtualization (NFV). The Research & Development centers will feature Wind River Titanium Server software running on ADLINK’s hardware platform based on the Modular Industrial Cloud Architecture (MICA) open framework. The combination of technologies will offer a platform for software man-

ufacturers, system device suppliers and service providers to test software rapidly through preliminary platform verification and system optimization. Wind River’s Titanium Server is a complete, commercial NFV infrastructure (NFVI) software platform that delivers carrier grade reliability and performance for NFV applications. By integrating Titanium Server with ADLINK’s rugged hardware platforms, NFV can be achieved at the network edge or in the data center, providing users with greater opportunities to maximize the performance and capacity of their NFV implementation and reduce operating expenses. ADLINK Technology San Jose, CA (408) 360-0200 www.adlinktech.com Curtiss-Wright Defense Solutions Ashburn, VA (703) 779-7800 www.cwcdefense.com General Micro Systems Rancho Cucamonga, CA (909) 980-4863 www.gms4sbc.com Eurotech Columbia, MD (301) 490-4007 www.eurotech.com Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com KALEAO Charlotte, NC (704) 235 4809 www.kaleao.com Mercury Systems Chelmsford, MA (978) 967-1401 www.mrcy.com WIN Enterprises North Andover, MA (978) 688-2000 www.win-ent.com Wind River Alameda, CA (510) 748-4100 www.windriver.com

COTS Journal | February 2017

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SPECIAL FEATURE Cloud Computing and IoT for the Military

Net-Connected Systems Wrestle with Cybersecurity Defending against cyberattacks gets more challenging every day. Fortunately, there are tools, techniques and organizations ready to tackle the problem. John Koon, Sr. Editor

C

yberattacks pose the greatest threat in today’s connected world. They are unpredictable, unescapable and they can disrupt lives in many ways. A successful attack can overload a network so you cannot access the services you need as in the case of distributed denial of services (DDoS) reported recently or bring down your smart energy grids to cause a blackout. Some time ago, Ukraine power grids were attacked by Russian hackers, not once, but twice. The second one caused a power outage for 230,000 people. Worse, hackers were able to track the military unit in Ukraine and compromise their military intelligence. Yahoo was hacked and the identity of 1.5 billion accounts were exposed. Heard of ransomware? The attackers took some hospitals hostage and their IT operations ceased to function until the demanded payments were paid. Cyberattacks will get worse as more and more devices get connected. How to solve the problems? Many vendors including exhibitors of the recent Embedded System Conference offer different solutions. The concept of end-to-end security is not new. Many tier one IT firms, including Cisco, propose solutions to guarantee the security of the entire network from the sending end to the receiving end. But it is easier said than done. A network system is as safe as its weakest link. The cloud is made 14

COTS Journal | February 2017

Each Layer can be Attacked

Bad Server

Bad Device

A Bad Server sending incorrect commands can be used to trigger unplanned events, to send some physical resource (water, oil, electricity, etc.) to an unplanned destination, and so forth.

A Bad Device injecting fake measurements can disrupt the control processes and cause them to react inappropriately or dangerously, or can be used to mask physical attacks.

Figure 1 A network system is as safe as its weakest link. The cloud is made up of multiple connected network devices, gateways and links; hackers will find the weakest link to attack. (Image courtesy of Infineon). up of multiple connected network devices, gateways and links; hackers will find the weakest link to attack. Figure 1.

Security Models Multiple organizations have recently released security specifications to help fight the battle. The Trusted Computing Group (TCG), a non-profit membership organiza-

tion including companies from IBM, Intel, Deauville, Microsoft and HP proposed a security model which has many layers; each can be secured with proper security policies implemented. They include Configuration & Management, Monitoring & Analysis, Communication & Connectivity as well as Endpoint Security. Above all, it includes Data Protection and System Analysis. Figure 2.


SPECIAL FEATURE

Figure 2 A security model has many layers; each can be secured with proper security policies implemented. (Image courtesy of Industrial Internet Consortium).

Additionally, the TCG publishes a design guidelines to support the model and it is free to download. The UK-based IoT Security Foundation, IoTSF, a nonprofit international organization which promotes IOT security provides a guideline on best practices to secure the networks. Its members include ARM, Green Hills, IBM, Huawei, Intel, Phillips, NXP and others. This specification covers a complete security checklist of device hardware /physical, software, operating system and interfaces including wireless. The specification release 1.0 is also free to download. Finally, the Industrial Internet Consortium (IIC), with founding members from Bosch, EMC, GE, Huawei, Intel, IBM, SAP and Schneider, offers a free publication entitled Industrial Internet of Things Volume G4: Security Framework. It is a comprehensive documentation covering the framework (configuration, monitoring, analysts and communication), functional view (actuation, sense operation and applications) and the system view (edge, cloud and connectivity). Additionally, it also spells out in details on how to do the end-point protection.

Cybersecurity Isn’t Free Raj Samani, CTO of Intel’s Security Group, formerly known as McAfee, pointed out the key in a secured system is to be able to identify the sender is indeed a trusted source. The level of security required depends on the types of applications. In the

case of automotive and medical applications, high level of security is required. Cybersecurity comes with a price tag. The more secure the system, the higher the price. There is a constant struggle for developers to balance security, risk and affordable system costs. When devices are connected to each other, how do you know that the party at the other end is the one you intend to connect? To solve this problem, more and more silicon manufacturers are starting to provide secured basic building blocks at the silicon level. STMicroelectronics offers a STSAFE-A turnkey solution to achieve true authentication using the public/private key management scheme. In the Thread-local Storage (TLS) session, the STSAFE-A software would verify signatures, offer secure storage and decrement counters for usage monitoring. The focus will be to secure a system by providing a unique device identity, running verified software, ensuring the privacy of data through encryption, and securing the communication to the remote or local host. Infineon, another chip manufacturer and a member of TCG, stated that a software-only security system is not sufficient. Software bugs such as the Heartbleed would compromise the system to allow anyone to read the memory content due to the vulnerability of the OpenSSL software. To counter that, Infineon offers a TCG compliant security chip solution (Optiga Trust embedded security) to perform authentication, se-

Integrated Rack Level Systems Elma integrates 19” COTS components from Cisco, Dell and others into our equipment racks, providing fully configured and tested turnkey systems. As your single source supplier, Elma provides component life cycle management, documentation, spares support and design services.

COTS Journal | February 2017

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SPECIAL FEATURE

cured communications, boot process protection, secure software/firmware updates and stored data protection. Micron, one of the largest flash memory manufacturers in the world, pointed out that attacks against persistent code and data can be very dangerous and difficult to detect. After a successful attack, modified malicious codes can reside in storage device such as a flash memory undetected for a long time. This is especially true when applied to bootable media with code and data content typically untouched by standard OS level virus detection. To protect against such an attack, Micron applies various techniques. One of them is replay-protected monotonic counter (RPMC) feature which provides a cryptographic primitive to select serial NOR devices, like Intel’s Serial Flash Hardening Product External Architecture specification for use in the Intel Ultrabook series. With RPMC, flash memory can provide system-level anti-rollback capabilities for virtual time stamping and software version control. Attacker will be prevented from replacing system software with older versions that may contain vulnerabilities.

Developing Safe and Secure Software In software, safety and security are inseparable. In aerospace, for example, if the airplane control software is hacked, the plane will not be safe. To achieve both safety and security, a development process needs to be in place with security built-in from the ground up. Several software vendors offering development tools to help developers to reach the goal of creating safe, security and reliable software. For example, LDRA offers a tool suite to help developers with missioncritical software and certification services using the LDRA Compliance Management System (LCMS) to ensure that the final products comply with Level A DER with documentation templates, process checklists and packaged certification including DO-178B/C Level A (Aerospace), IEC 61508 SIL 4 (Industrial), ISO 26262 ASIL A – ASIL D (Automotive), EN 50128 SIL 3/4 (Rail Transportation) and IEC 62304 (Medical Devices, Class II and III). Compliance of such standards increases software quality. Software contents are updated from time to time to fix bugs or add new features, it is important to make sure that the new 16

COTS Journal | February 2017

codes will not impact other areas of the software program without the knowledge of the developers. Another advantage of software development automation can help track changes made, update documentation and ensure all the new changes and related areas are thoroughly tested and documented. This is essential for military applications. “ARM-based SoCs are increasingly incorporated into military applications just as they have gained popularity across other industries for a variety of reasons including performance-to-power optimization and their vast ecosystem of solutions,” commented Shan Bhattacharya, LDRA’s Director of Business Development. “Interoperability and other open standards, such as Future Avionics Capability Environment (FACE), are further driving DoD programs to standardize to such widely adopted platforms”.

A Never-Ending Challenge So, can cybersecurity be achieved? In short, it is a never-ending task as it is a constant race between security developers and the innovative hackers. Building security into the development cycle is important. Paying attention to the entire cloud network, applying security models from TCG, to both software and hardware designs is a good starting point to achieve cybersecurity. This will make future connected cars, smart cities and factories, other IoT applications as well as DoD deployments safer.


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JEFF’S PICKS Jeff Child, Editor-in-Chief

C4ISR/EW Modular Open Standards Supported on 3U VPX Backplane

M

any military systems depend heavily on open standard slot-card style embedded computing technologies such as VME, CompactPCI, MicroTCA and OpenVPX. And a key piece of those system architectures are the backplanes such boards plug into. As processor and serial interconnect speeds have ramped up over the years, backplane designs have had to keep pace with designs that can handle higher speeds but also all the tricky effects that come into play at GHz level speeds and beyond. Adding more twists to backplane complexity, new standards and technologies emerged to accommodate coaxial/ RF interconnects implemented directly on backplanes and slot cards. And support for ever faster revs of Ethernet, PCI Express, Serial RapidIO brought along new challenges as well. OpenVPX in particular ushered in new varieties of backplanes supporting lengths between one and twenty-one slots. Meanwhile, there are many different profiles available for OpenVPX backplanes—such as central switch topologies, and distributed topologies and root-leaf topologies. This month’s Jeff ’s Pick section looks at backplane solutions. COTS Journal evaluated several such products on three aspects: technology leadership. The winning product is Elma Electronic’s high speed 3U VPX backplane that supports multiple functions including mixed payload modules, single board computers, switches and RF payloads for use by the DoD’s Hardware/Software Convergence Initiative (Figure 1). A unique 18

COTS Journal | February 2017

Figure 1 Jeff’s Pick is Elma Electronic’s high speed 3U VPX backplane. It supports multiple functions including mixed payload modules, single board computers, switches and RF payloads for use by the DoD’s Hardware/Software Convergence Initiative. aspect to this backplane is its support of high speed signals on all the data paths as well as leading edge VITA 67.3 connectors compatible with legacy VITA 67.1 and VITA 66.4 RF and optical I/O connectors. According to Elma, this was also the first VPX backplane with a radial slot card for timing and synchronization The 3U, 12-slot backplane includes 7 slots that receive radial clock signals (Aux Clk and Ref Clk) driven independently from a radial clock timing card. The remaining 5 slots receive standard VPX bussed Aux_Clk and Ref_Clk signals. The timing card slot also supports a VITA 67.3c connector with 10 SMPM cavities. The backplane can handle the highest data rates possible with the VPX connector through its multiple data plane UTP connections at 10GBASE-KR data rates

and 10GBase-KR UTP control plane connections. Four payload slots, each equipped with a combination VITA 67.3c optical and RF connector in the J2 position are also featured on the backplane. The slot 2 switch supports a VITA 67.3d connector module compatible with a payload module fitted with a VITA 66.4 MT optical ribbon connector or a VITA 67.1 RF coaxial connector. When equipped with optical interfaces, the VPX architecture now allows data rates across the backplane far greater than any copper interconnect can be expected to achieve with the additional benefit of lower design complexity. The VPX optical interface ensures that this backplane will be able to meet all future bandwidth requirements. Also included on the backplane is a 12-cavity, VITA 67.3e connector to support an RF switch card. The new VITA 67.3 connectors allow high speed optical and RF interfaces present on payload modules to be mated and removed from the backplane. The scheme allows different types of I/O cabling routed to a slot to remain connected to the rear of the backplane to distribute interfaces. The backplane is designed to align with the DOD’s Hardware/Software Convergence Initiative, which aims to develop a common, modular hardware architecture across C4ISR and EW systems. Elma Electronic Fremont, CA (510) 656-3400 www.elma.com.


...and the Runners Up 3U and 6U OpenVPX Backplanes Available in Several Slot Configurations Last year Pixus Technologies greatly expanded its OpenVPX enclosure offering along with new backplane configurations. The company has new 3U backplanes in 5, 9, and 18 slots and new 6U versions in 2 and 5 slots (Figure 2). The boards are compliant to the VITA 65 specification. The backplanes come with or without rear I/O connectors and are designed to cable over to Pixus power boards for VITA 62 or PICMG 2.11 power supplies. They have header options for VITA 46.11 for system management. Pixus also offers OpenVPX backplanes to VITA 66 for Optical and VITA 67 for RF. Pixus Technologies Waterloo, Ontario Canada (519) 885-5775 www.pixustechnologies.com

Figure 2 These backplanes come with or without rear I/O connectors and are designed to cable over to Pixus power boards for VITA 62 or PICMG 2.11 power supplies.

OpenVPX Backplanes Boast Signal Integrity at up to 10.3 Gbaud Dawn VME Products’ VPX-598x Series Gen3 3U OpenVPX backplanes are designed for true signal integrity at up to 10.3 Gbaud performance (per VITA 68 backplane simulation models) (Figure 3). Supporting PCIe Gen 3 and 10 GbE (XAUI) and the most advanced Gen3 bandwidth module configurations, Dawn Gen3 backplanes offer multiple connector choices, including a high vibration option. Dawn uses VITA 68 S-parameter simulation models of signal paths across the backplane to insure compliance with signal integrity standards. In the simulation models a signal integrity budget is established for the backplane portion of a system. These models permit simulation of the backplane with available OpenVPX modules and connectors, so full system signal integrity can be achieved. Using these simulations to guide the backplane designs, Dawn engineers use back drilling to remove stubs and then layout paths to eliminate impedance discontinuities. The goal is to optimize the path between any pair of transmitting and receiving chips in the systems, so communication proceeds without cross talk or other forms of interference. Dawn’s 598x Series VPX backplanes are designed to be compliant with the following released standards and December 2015 state of draft specifications: VITA 46.0, VITA 46.1, VITA 46.3, VITA 46.4, VITA 46.6, VITA 46.7, VITA 46.9, VITA 46.10, VITA 46.11, VITA 48.0(REDI), VITA 48.1(REDI Air Cooling), Vita 48.2(REDI Conduction Cooling), VITA65.0 (OpenVPX) ready. VITA 68 backplane models are available on request for system simulation.

Figure 3 VPX-598x Series Gen3 3U OpenVPX backplanes are designed for signal integrity at up to 10.3 Gbaud performance and support PCIe Gen 3 and 10 GbE (XAUI).

Dawn VME Products San Jose, CA (510) 657-4444 www.dawnvme.com

COTS Journal | February 2017

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Check Out These Backplane Solutions Too… Atrenne’s 10 GHz Gen-3 backplanes enable applications to run 40 Gb Ethernet, PCI Express Gen 3, Infiniband (QDR and FDR-10), USB 3.1 or other high-speed serial interconnects over the standard VPX connector. Atrenne Integrated Solutions, Brockton, MA (508) 588-6110. www.atrenne.com

The Orbit Electronics Group offers several different model backplanes in 6U and 3U form factors. Two to 21 slots are standard, and virtually any custom performance configuration can be provided. Its VITA 67 backplane enables the use of high-speed serial switch fabric technologies. Orbit Electronics Group, Louisville, KY (866) 319-8085. www.vmevpx.com

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COTS Journal | February 2017

The 100 Gbps Schroff AdvancedTCA backplane from Pentair is verified according to the design requirements of the IEEE802.3bj specifications for 100 Gbps Ethernet. The IEEE802.3bj specification defines two encoding techniques for 100 Gbps: 100GBASE-KR4 and 100GBASE-KP4. Pentair Technical Solutions, Warwick, RI (401) 732-3770. www.pentairequipmentprotection.com

Trenton Systems’ HDB8228 HDEC Series

The VT072 single slot backplane from Vadatech provides a simple tool for benchtop testing of AMCs. It prevents the requirement of a full MicroTCA chassis for simple power-up and de-bug. Although the VT072 is typically used without a chassis, it comes with mounting holes for use within an enclosure. Vadatech, Henderson, NV (702) 896-3337. www.vadatech.com

Verotec offers a wide range of standard PICMG2.0 Rev 3 compliant CompactPCI backplanes in 3U, 6U and 9U heights, 2 to 16

Midsize Backplane supports up to eight PCI Express option cards and one dual processor. The design eliminates PCIe switch hops providing a 15.3 percent average bandwidth gain per option card slot compared to previous PICMG 1.3 backplane designs.

Slots wide. The are available in many different configurations: 32/64-bit, 33/66MHz, left or right system slot and 5V/3.3V voltages.

Trenton Systems, Gainesville, GA (770) 287-3100. www.trentonsystems.com

Verotec, Manchester, NH (603) 821-9921. www.verotec.us


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SYSTEM DEVELOPMENT Modeling Military Radar Systems

Modeling Technology Critical for Radar System Designs Designing today’s advanced military radar systems is no simple task. Cutting edge modeling tools and techniques help smooth the path and tame the complexities. Honglei Chen, Software Engineer Rick Gentile, Product Manager Mathworks

R

adar system design is a complex, multi-domain challenge. As phased array antennas are used in new designs, an extended set of capabilities including electronic beam steering and spatial signal processing techniques are possible. These added capabilities come with a corresponding increase in system level complexity. In addition, growing levels of interference sources due to a crowded RF spectrum, as well as smaller cross-section targets contribute to the increased challenge of achieving desired radar performance levels. A system simulation framework can be a critical part of today’s system design workflow to help reduce the risks brought on by the increases in system level and environmental complexity. Modeling multidomain radar systems can help drive design decisions and detect design issues early on in the project. For example, evaluating a radar’s ability to detect low cross section targets or adding the right level of signal processing to remove unwanted noise sources. These same types of models can be used to help justify upgrades to mature, fielded systems before any hardware is procured or developed. In addition, aspects of life cycle planning for radar systems can be assessed by understanding how systems perform as failures occur.

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COTS Journal | February 2017

From Waveform to Detections It’s useful to review some ways a model can be used to assess a range of design challenges, including all of the areas described above. Figure 1 shows a multi-domain, system-level model created in Simulink. The model covers radar blocks from waveform generation, to the transmit and receive chain, to the spatial signal processing components. Environmental and target modeling are also included to complete the system scenario. The model shown in Fig 1 represents a low power X-band radar which can detect targets with small RCS values (< 0.5 m2).

Figure 1 Multi-domain radar system model.

The required radar coverage for the system in this example is 35 km with a range resolution of 5 meters. This type of radar is typical of a system considered to help fill gaps within a network of larger surveillance systems. Each of the building blocks shown in Fig 1 can also be easily implemented in MATLAB as well. The building blocks can each can be set to match the desired system configuration. For example, parameters such as the waveform description, the required transmit power, and the antenna gain are parameterized and can be directly configured in each of the blocks.


A19_COTS_2_25x9_875_A19.qxd 12/21/16 5:01 PM

SYSTEM DEVELOPMENT

Designing the Waveforms Once we have the requirements set for the range and Doppler resolution and the minimum and maximum range of the desired coverage, we can interactively design the appropriate baseband waveform parameters needed to achieve these requirements in our system. The resulting “waveform characteristics” from these baseband parameters are highlighted in the figure to show the requirements have been met. For this type of radar system, we are trying to design a system that requires a low transmit peak power with the intent to translate directly into a lower cost solution. With a lower cost and lower system complexity, it should be easier to deploy more systems. We also have to balance the low power requirement with the need to detect low cross section targets. This requires designing an array for the X-band system with a large gain.

Building an Array We can interactively design and analyze the array parameters including the geometry, element spacing, lattice structure, and element tapering. Consider for example a 36x36 element array with uniform spacing between each element. The radar beam that can be generated with this type of array can be steered in azimuth and elevation. Figure 2 shows the beam at the radar boresight angle. An antenna array of this size for X-band is small enough that it can be easily mounted on a variety of support structures, which makes deploying this type of system much easier. We can use this array design directly in the system model. Due to the large number of

Figure 2 Beam pattern at radar boresight in 3D of a 36x36 Uniform Rectangular Array (URA).

elements in the array, the resulting antenna directivity allows the peak power to be less than 20 watts. This is based on the array directivity of 34.73 dBi. Taylor weighting has been applied to reduce the sidelobe levels. If a higher level of fidelity in our model is needed, we can design a specific antenna element using a full-wave solver in Antenna Toolbox. We also have the ability to model the effects of mutual coupling between antenna elements, which typically impacts the beam pattern as it is steered off boresight in both azimuth and elevation. This allows us to easily see how the array design affects the performance and provides us with an earlier opportunity to either change the design or adjust the requirements for downstream processing.

“What If” Analysis

Before we move on to some of the other radar blocks, it is interesting to note that the model can also be used to support a variety

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SYSTEM DEVELOPMENT

of specific “what-if � analysis exercises that relate to more detailed design trade-offs and life cycle planning. For example, we have a framework in place which we can reference for the best implementation for array thinning techniques. Alternately, Figure 3a and Figure 3b show an example where we can evaluate the impact of failed elements in the array. This can be important for determining maintenance cycles. For a radar site that is not staffed 24/7, multiple failures can be tolerated before a site is visited and the failures are repaired. The beam pattern (also shown in Fig 3) shows the degradations in the beam pattern with 15 percent of the elements failed. Similar analysis can be performed at the subarray level too. Figure 4 shows an example where the array is built up from 6x6 subarrays. The resulting beam pattern is also shown with 10 of the 36 subarrays in a failed state. Again, this type of data can be used to determine how many subarrays should be implemented. It can also be used in a way similar to the maintenance concept described earlier.

Modeling a Complete Scenario There are tools available for each component to help you quickly complete a system model. In our example, we create targets of varying complexity (including RCS fluctuations and angle and frequency dependent RCS behavior). We can also set these targets in motion in the model. This can provide

insights into whether the design meets all performance goals. Environmental factors such as line-of-sight propagation effects due to rain, fog and gas, as well as channel fading can be included to improve the fidelity of the model.

Emulating Complex RF To emulate the complex RF environment, signal source models can also be integrated to test interference mitigation techniques and to assess complexity levels prior to implementation. In our model, we add targets with an RCS value of 0.05 m2. This type of scenario has taken on new importance with the increased use of drones and UAVs. Fidelity in the RF domain can also be extended by building up subarrays with models of RF components such as phase shifters, amplifiers, etc. Simulink can serve as a great platform to perform multi-domain simulation because it provides customizable block libraries, and solvers for modeling and simulating dynamic systems. Since it is integrated with MATLAB, algorithms can be incorporated into models and simulation results can be exported to MATLAB for further analysis. In our signal processing subsystem, we form multiple beams that cover various azimuth and elevation angles in front of the array. These same channels are also used to estimate the directions that the returned signals are arriving from. The matched filter

Figure 4a and 4b 36x36 element array built up with subarrays and the pattern with 10 of the subarrays failed.

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COTS Journal | February 2017

provides the system with a processing gain which improves the detection threshold. A time varying gain is added to the model so that a constant threshold can be used for detection across the entire detectable range. The resulting pulses are non-coherently integrated. The combination of these techniques allow processed returns for a single integration interval to support target detections at a desired signal-to-noise ratio (SNR). Results can be visualized in a variety of ways, including the ones shown in Figure 5 (Power vs. Time and a view of the scenario playing out). All three target returns are above the threshold, and therefore can be detected. In this example, the simulated targets have a non-fluctuating RCS of 0.5 m2 and are located throughout the area of radar coverage. It should be noted that the blocks used in the simulation are scalable. Each input and output is clearly defined such that custom blocks can be swapped into the model or extended to an existing block. One of the resulting data sets from the model is I/Q data generation for each processing interval.

Time and Cost Savings Modeling a radar system early in the design process can save countless hours and reduce program costs by exposing design issues in the early stages of the project. In addition to finding design issues, a range of what-if analysis efforts can be accomplished without having to build any hardware. This


SYSTEM DEVELOPMENT

Figure 5a and 5b Detection for three small RCS targets with in an X-band radar model.

analysis can be performed on the full range of system components, from the antenna to detections. This type of radar model can also be used to either simulate a radar system for signal processing development or generate the radar echo(s), which can then be fed into “downstream” data post-processing systems. The resulting IQ data can then be used to tune algorithms. Once the algorithm is tuned, developers can easily replace the synthesized data with measured data at any location in the model. Off-the-shelf radar model components provide all of the basic building blocks for a full system model, but the simulation framework has the flexibility to be extended with custom additions for each portion of the radar design. As demonstrated in the examples above, the radar system design workflow, from requirements analysis, to design trade-offs, to system development, can benefit from this work. Mathworks Natick, MA (508) 647-7000 www.mathworks.com

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DATA SHEET Small Rugged Box Systems Roundup

Small Box Systems Deliver on SWaP Requirements With lowering Size, Weight and Power (SWaP) an increasing priority, vendors of small box products are answering the call for high performance computing in tightly integrated systems.

Jeff Child, Editor-in-Chief

O

ver the past decade there is perhaps no product category that’s seen faster growth than that of rugged box-level systems. Where once they were “one-off “custom efforts offered by military embedded computer vendors, box-level systems are now fully entrenched as major product lines from several vendors. Box-level products are so pervasive that COTS Journal this year has divided its Data Sheet Round Up section coverage into two separate sub-categories: Small Rugged Box Systems (covered this month) and Large Rugged Box Systems (coming later this year). Small form factor rugged- box level systems are perhaps one of the most active design activities in the embedded computing industry. Some have remarked that the whole idea of a “standard” small form factor format is a bit of contradiction. They argue that any system developer that wants the smallest possible box will opt for a smaller box each time rather than fitting some standard. These solutions are edging out traditional backplane-centric slot card system architectures in many military platforms. This box-level system trend is dominating wherever size, weight and power (SWaP) is a priority concerns-especially in UAVs and military vehicle electronic systems. Small rugged box-level systems span a wide range of formats, sizes and configurations with a wealth of non-standard formats that have emerged. On the standard-based side, only one of the three VITA specification efforts is continuing 26

COTS Journal | February 2017

Figure 1 Small box level systems have enabled the Army put WIN-T functionalities like TCN-L and NOSC-L on Humvees instead of on five-ton FMTVs. forward toward full ANSI standardization. Over the past several years embedded computing industry has made moves to apply some standardization on the format or I/O configurations between vendors of rugged box systems products. These efforts have evolved around standardization on the mechanical format or I/O configuration. The three VITA draft specification efforts jockeying for acceptance have been VITA 73, VITA 74 and VITA 75. Today only VITA 74-also dubbed VNX-in on path toward full ANSI-standardization status in VITA. Stakeholders for VITA 75 meanwhile don’t plan to move its specification beyond its current status and VITA 73

has been scrapped. It’s worth noting that on the product round up pages in this section, none of the representative products (new within the past 12 to 18 months) are standards-based. Demand for higher levels of system integration is only ramping up among military system developers. And that need is moved small rugged box systems front and center for today’s technology decision makers. One force driving demand for these systems is a hunger for complete systems that are at a high TRL (Technology Readiness Level). Motivated by the desire to avoid staking military programs on immature technologies, the DoD is pushing for demonstrations earlier in the program development phase. That means that technologies used also have to show higher TRLs than previously required. All of that has helped fuel demand for prepackaged and prequalified subsystems as primes find themselves without the time or the DoD funding to develop a prototype subsystem themselves. As TRL becomes a more significant part of military requirements, suppliers are crafting solutions with that specifically in mind. An example application embracing compact box-level systems is the U.S. Army’s WIN-T program (Figure 1). Several WIN-T vehicles use the S902R-SVM Golden-Eye III system from General Micro Systems. The Golden Eye III is a fourth generation, ultra-rugged, small, lightweight computer system possible in a fully ruggedized, conduction cooled, fully sealed enclosure that can operate up to -40 to +85 degrees C.


DATA SHEET

Small Rugged Box Systems Roundup

Box System Exploits UltraScale FPGA Performance

System Serves FACE-Compliant DO-254/DO-178 Certifiable Needs

IP67-Rated Rugged System Features Unibody Chassis

The CESCC820 (Compact Embedded System) from 4DSP is a ruggedized, small form factor embedded system designed to provide a complete and generic processing platform for data acquisition, signal processing, and communication. With Size, Weight, and Power (SWaP) in mind, the conduction-cooled CESCC820 features a low-power x86 CPU tightly coupled to a high-performance Kintex UltraScale UltraScale FPGA and FPGA Mezzanine Card (FMC - VITA 57.1).

Abaco Systems’ FORCE2 Open Reference Computing Environment is designed to support the planned development of safety-critical, DO-254/DO-178 certifiable applications compliant with the FACE initiative. This rugged, pre-integrated small form factor system for mission computing and avionics display comprises a high TRL SBC314 3U VPX single board computer and graphics card housed in a robust enclosure.

The ADLMES9200 from ADL Embedded Solutions is an IP67 chassis systems that is a successor to ADL's ADLMES8200 IP65 chassis system. Improvements include lower weight, lower cost, quick and reliable IP67 integration for rugged military and industrial applications. Design features for military/defense system include MIL-STD 810 tolerance and MIL-STD 461/704/1275 compliance capability. The 9200 is compatible with ADL's full-range of Intelbased PC/104 and 3.5 inch SBCs.

• Intel Atom Quad Core 1.91 GHz processor. • 2 Gbytes of DDR3 SDRAM. • 64 Gbyte SSD (2x SSD option available). • HDMI, USB, 2x 1 Gbit Ethernet links, FMC HPC site, JTAG. • Kintex UltraScale XCKU040 FPGA with 4 Gbytes DDR3 SDRAM. • Enclosure base: 148 x 163 mm, Enclosure body: 121 x 163 mm. • Height 100 mm, weight: 3.0 kg. 4DSP Austin, TX. (800) 816-1751 www.4dsp.com

• Freescale QorIQ T1042 or T2081 processor; AMD Radeon E8860 or core AVI E8860 GPUs available. • 1553/ARINC429 I/O options. • Solid state disk option up to 1 Terabyte. • Weight: 6.8 lbs (4kg).

• Embeds ADL’s SBCs which range from Atom to Core i5/i7 processors. • Power supply options for MIL-STD 461/704/1275 compliant filtering.

• MIL-STD-704F 28VDC power.

• Unibody design, with minimal, reliable EMC-compliant gasketing.

• Qualified to MIL-STD-461G, DO-160G, MIL-STD-704F, MIL-STD-810G.

• Designed for MIL-STD 810G shock and vibration profiles.

• -40 to +71 degrees C operating temperature; Cold-plate cooled.

• Operating temperature estimated from -40 to 85 degrees C with Core i7 SBCs with heat spreaders and flanged plate for conduction cooling.

• FACE-aligned operating systems and I/O services. Abaco Systems Huntsville, AL (866) 652-2226 www.abaco.com

ADL Embedded Solutions San Diego, CA (858) 490-0597 www.adl-usa.com

FIND the products featured in this section and more at

intelligentsystemssource.com

COTS Journal | February 2017

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DATA SHEET

Small Rugged Box Systems Roundup

Fanless Embedded Computer Supports Three HD Displays

Compact GPGPU System Delivers 60 Gflops/W Performance

Ultra-Small Mission Computer Provides Mini-PCIe I/O Expansion

The Matrix MXC-6400 series from ADLINK Technology is a line of highperformance fanless embedded computers, integrating 6th generation Intel Core i7/i5/ i3 processors and the QM170 chipset. The MXC-6400 series offers independent digital display support from DisplayPort and DVI-I with HD 4K resolution.

Aitech Defense Systems’ A176 Cyclone is a fanless, rugged GPGPU system capable of 1 Tflops parallel processing. The system is based on the NVIDIA Maxwell architecture which includes two processors: A GPU and a Quad-core ARM Cortex A57 CPU. The compact A176 measures 4.3- x 4.3- x 1.18-inches and weighs less than 2.2 lbs. Provides capability of embedded deep learning, computer vision, graphics and GPU computing in harsh environments.

The Parvus DuraCOR 312 form CurtissWright Defense Solutions is an ultra-small form factor modular mission computer built around the NVIDIA Jetson Tegra X1 (TX1) “supercomputer-on-a module” integrated in a miniature rugged chassis with MIL-grade high-density connectors.

• 6th Generation Intel Core i7/i5/i3 processors and QM170 chipset. • 2x DDR4 SO-DIMM sockets support up to 32 Gbytes of memory. • 1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots. • 2x Mini PCIe and 1x USIM slots. • Support for 3 independent displays with 2x DisplayPort and 1x DVI-I ports. • 3x Intel GbE LAN ports with teaming function, Intel iAMT 11.0. • 2x 2.5 inch hot-swappable SATA III trays on the front panel and 2x internal SATA III ports with RAID 0/1/5/10 support. ADLINK Technology San Jose, CA (408) 360-0200 www.adlinktech.com

FIND the products featured in this section and more at

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COTS Journal | February 2017

• Measures only 20 cubic inches using 17 W max (8-10 typ). • 1 Tflops rugged GPGPU with 256 CUDA cores (NVIDIA Jetson TX1); ARM Cortex Quad-core A57). • Extensive I/O: HD/DVI, H.264/.265 video encoder, SATA SSD, GbE, USB, serial, discrete digital. • Memory: 4 Gbytes of LPDDR4 RAM. • Video: encode 4K at 60 Hz; decode 4K at 30 Hz. • Storage: 16 Gbytes of eMMC and SATA SSD with quick erase/secure erase. Aitech Defense Systems Chatsworth, CA (888) 248-3248 www.rugged.com

• Ruggedized NVIDIA Jetson Tegra X1 module: Quad-core ARM Cortex-A57; 256 core Maxwell GPU; Thermal enhancement. • 1.4 x 5.2 x 5.4-inches; 1.5 lb.; 20 W. • Rugged IP67 chassis with micro-mini MIL-performance circular connectors. • Modular I/O architecture: up to three slots for add-on Mini-PCIe I/O cards. • Rugged Flash SSD storage: eMMC + M.2 / mSATA / microSD card / removable 2.5 inch SATA. • 28 VDC MIL-1275/704/DO-160 power supply for aircraft and ground vehicles. • Qual testing pending for extreme MILSTD- 810G/DO-160 thermal, shock, vibration, altitude, humidity; also MILSTD- 461F/DO-160G EMI/EMC. Curtiss-Wright Defense Solutions Ashburn, VA. (703) 779-7800. www.cwcdefense.com.


DATA SHEET

SMALL RUGGED BOX SYSTEMS ROUNDUP

Links to the full data sheets for each of these products are posted on the online version of this section.

Fanless Embedded Computer Features Quad Core Atom E3800

COM Express-based System Runs Cisco IOS Software

Rugged Server-Level Box Blends Switch/Routing and Security

The EC700-BT Fanless Embedded System from DFI Tech features an Intel Atom E3845 quad core 1.91 GHz processor and 4 Gbytes of DDR3L ECC on-board memory. The lightweight fanless system is rugged, conforming to MIL-STD-810F (514-5C-2) for vibration and can handle 15G half sine wave of shock for 11 ms in 3 axes. The EC700 can be wall-mounted or VESAmounted and supports expansion for 3 Mini PCIe, 1 mSATA storage, 1 SIM card, and 1 microSD. There is also I/O of 8-bit DIO, 4 serial ports, 5 USB, 2 WiFi antenna holes, 1 VGA, 1 HDMI, and 2 LAN.

Extreme Engineering Solutions’ XPand6052 integrates the Intel Core i7 processor-based XPedite7450 COM Express mezzanine module and the XPedite5205 XMC/PMC Embedded Services Router (ESR) to provide processing with networking capability in one Small Form Factor rugged embedded module. The new combined unit, XPand6052, complies with multiple military specifications including MIL-STD-810, DO-160 and MIL-STD461G. It is flight-qualified and meets the MIL-STD-704A-F 28 VDC power input requirement.

The SB2002-SW “Blackhawk” from General Micro Systems is an ultra-rugged, small, lightweight server system with up to 16 CPU cores and up to four removable drives. It is designed to provide a 20-port intelligent hardware switch/router system supporting Layer 2/3 routing functions with customizable rules while providing the highest level of workstation performance possible in a fully ruggedized, conductioncooled, sealed system.

• Intel Atom E3800 Series processor. • 4 Gbytes of DDR3L ECC DRAM onboard. • Video support: 1 HDMI + 1 VGA or 1 DVI. • Storage: 1 Notebook HDD, Optional eMMC onboard. • I/O includes 4 COM, 2 LAN, 5 USB. • Size: 180mm x 33mm x 121.2mm. DFI Tech Sacramento, CA (916) 568-1234 www.dfitech.com

• Includes XPedite7450 Intel Core i7 ruggedized COM Express module. • XPedite5205 Cisco IOS Gbit Ethernet Embedded Services Router. • Four 10/100/1000BASE-T Ethernet ports on XPedite5205; Two 10/100/1000BASE-T Ethernet ports on XPedite7450. • 8.2- x 4.88- x 1.85 inch; Weighs 4.0 lbs.; Environmentally sealed. • Integrated MIL-STD-704F 28 VDC input voltage power supply; Integrated MILSTD-461 EMI filtering. Extreme Engineering Solutions Middleton, WI. (608) 833-1155 www.xes-inc.com

• Intel Xeon processor D up to 16 cores (D-15xx). • Up to 64 Gbytes of DDR4 ECC memory. • Up to four removable 2.5-inch SATA or one NVMe SSD. • Two 10 Gbit and 17 Gbit Ethernet (4x PoE) ports; Supports Layer 2/3 software routing functions. • Security features for authentication, authorization, multicast IPv4, IPv6 with IGMPv2/3 snooping. • Extended temperature from -40 to +85 degrees C. General Micro Systems Rancho Cucamonga, CA. (909) 980-4863 www.gms4sbc.com

FIND the products featured in this section and more at

intelligentsystemssource.com

COTS Journal | February 2017

29


DATA SHEET

Small Rugged Box Systems Roundup

Suite of Rugged, Application-Ready Systems Require no NRE

Rugged Box-Level System Boasts Quad-core GPU and Rick I/O

Small Footprint Embedded System Provides Low Cost Solution

NAI offers multiple application-ready rugged systems that use NAI’s, scalable Custom on Standard Architecture (COSA), approach. An example shown here is the VMS-35CP0A is a 3U 5-slot Vehicle Management System. This preconfigured system with an Intel Core i7 processor is suited to applications that require highdensity, multi-channel, programmable LVDT Measurement; Discrete I/O; D/A Conversion; AC Reference; CANBus; Differential Transceiver; RTD Measurement; TTL/CMOS I/O; ARINC 429/575 and Dual-Port Gig-E Ethernet.

Octagon Systems’ TRAX-10 is a miniserver/router optimized for the rugged mobile market. It is powered by the latest Intel Quad-core CPU with high performance graphics capabilities. TRAX10 features a substantial amount of I/O including 5 Ethernet ports, CAN bus and multiple wireless modes. The versatility and processing power make it ideally suited for deployment on vehicles and equipment that run multiple on-board applications in stressful environments.

Systel’s EB5000 is a low cost, low power solution suited for users seeking high reliability from a small footprint embedded system. It is compact and lightweight yet extremely rugged and is suitable for deployment into almost any environment. The EB5000 embedded computer is an extreme duty system designed for military operations, oilfield services, and a multitude of other rugged industrial environments. With a compact design that saves space and weight, the EB5000 offers performance without the associated high cost.

• Meets or exceeds MIL-STD-461F and MIL-STD-810G requirements. • Linux (CentOS, Red Hat) and Windows Embedded Standard 7 OS. • Continuous Background Built-in-Test (BIT).

• Open Architecture - Windows and Linux ready. • Intel Dual Core CPU, 1.91 GHz. • Future Proof - Plug in I/O. • Gbit Ethernet, CAN, Serial, USB & Digital. • GPS, WiFi, Cellular.

• Less than 15 lbs. typical.

• -40 to 85 degrees C temperature range.

• COTS/NDI, no NRE required.

• Server, router and I/O in one.

• COSA architecture. • SWaP-optimized. North Atlantic Industries Bohemia, NY (631) 567-1100 www.naii.com

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COTS Journal | February 2017

Octagon Systems Westminster, CO (303) 430-1500 www.octagonsystems.com

• Rugged small form factor embedded system. • Low cost, low power, high reliability. • Compact and lightweight. • Zeus Rail compatible – ideal for airborne applications. • 512 Mbytes of memory, 2 Gbytes of microSD storage (extended temperature). • - 40 to +70 degrees C operating temperature. • MIL-STD-810G, DO-160G. Systel Sugar Land, TX (281) 313-3600 www.systelusa.com



COTS

FIND the products featured in this section and more at

PRODUCTS

intelligentsystemssource.com

8-Channel A/D XMC Serves Radar Phased-Array Applications Pentek has introduced the newest member of the Jade family of high-performance data converter XMC modules based on the Xilinx Kintex Ultrascale FPGA. The Model 71131 is an eightchannel, 250 MHz XMC module featuring 16-bit A/Ds with programmable multiband digital down converters (DDCs). The Model 71131 is suitable for connection to HF or IF ports of a communications or radar system. Its built-in data capture feature offers an ideal turnkey solution as well as a platform for developing and deploying custom FPGA-processing IP. The eight channels make it especially beneficial for multi-channel phased array platforms in defense and weather radar applications where the cost per channel can be substantially reduced. The front end accepts eight analog HF or IF inputs on front panel MMCX connectors with transformer coupling into four Texas Instruments ADS42LB69 dual 250 MHz, 16-bit A/D converters. The Model 71131 features eight A/D Acquisition IP Modules for easily capturing and moving data. Pentek’s Navigator Design Suite was designed from the ground up to work with Pentek’s Jade architecture and Xilinx’s Vivado Design Suite. The Navigator Design Suite consists of two

1U MicroTCA Chassis Adds Advanced Power Management Pixus Technologies has announced that its 1U MicroTCA Chassis has new versatile power options. The 1U high unit offers a mix-and-match approach for the MicroTCA Carrier Hub (MCH), power, and payload modules. There are options for 1 or 2 MCHs, single or dual power supplies, and multiple size variants of AMCs. Further, the chassis now has advanced power management features. The previous version had only basic, active power management across the backplane. The upgraded PXS0108 has full power module functionality including failover, remote management, power sequencing, and more. The 6-slot MicroTCA system platform has backplane options up to PCIe Gen3 speeds. Pixus Technologies Waterloo, Ontario, Canada (519) 885-5775 www.pixustechnologies.com

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components: Navigator FDK (FPGA Design Kit) for integrating custom IP into Pentek sourced designs and Navigator BSP (Board Support Package) for creating host applications. Designed for aircooled, conduction-cooled, and rugged operating environments, the Model 71131 XMC module with 5 Gbytes of DDR4 SDRAM starts at $13,495. Additional FPGA options are available. The Navigator Design Suite consists of two packages. The Navigator BSP is $2,500 and the Navigator FDK is $3,500. Pentek Upper Saddle River, NJ (201) 818-5900 www.pentek.com

AMC Board Sports Virtex UltraScale FPGA and 8 GB of DRAM Vadatech has announced the AMC596, an FPGA module based on the Virtex UltraScale XCVU440 FPGA. This is the largest of the UltraScale FPGAs, here supported by 8 Gbytes of 64-bit wide DDR4 and an on-board Power PC P2040. The additional connectivity provided by PinoutPlus—over 250 Gbps between neighboring modules—makes the product ideal for ASIC emulation and demanding sensor processing applications. The AMC596 extends a rich product line of Virtex-7 and UltraScale products covering PCIe edge, VPX and AMC form factors. With common architecture and supporting VHDL, users can easily port applications from one form factor to another to meet different environmental and market requirements. Vadatech Henderson, NV (702) 896-3337 www.vadatech.com


COTS PRODUCTS

POWER YOUR CRITICAL MISSION TODAY

VME Xeon Kaby Lake SBCs Target Low Risk Upgrades Abaco Systems has announced the XVB603 and XVR19 6U VME SBCs based on the latest 7th generation Intel technology (codenamed “Kaby Lake”). The XVB603 and XVR19 provide straightforward, cost-effective and low risk upgrades for users of previous XVB and XVR products, bringing enhanced processor performance, enhanced storage and improved protection against obsolescence. Long term availability is assured as a result of utilizing CPUs from Intel’s long term-supported roadmap, and Abaco’s new Vivo FPGA-based VME interface which abstracts these products from potential obsolescence issues. The XVB603 is specifically targeted at air-cooled, front I/O application in relatively benign environments typically found in industrial or sheltered defense settings. The XVR19 is a fully rugged offering, with both rugged air-cooled and conduction-cooled versions, targeted at command and control applications typical of the defense and aerospace markets on land, sea and air. In addition to a comprehensive range of onboard I/O features, the XVB603 and XVR19 also offer on-board mezzanine expansion sites for enhanced system flexibility. Memory resources include up to 16 Gbytes of soldered DDR4 SDRAM. Abaco Systems Huntsville, AL (866) 652-2226 www.abaco.com

PXIe Test Instruments Provide 126 MHz Digitizer and AWG Solutions Astronics Test Systems has introduced two new test instruments: the PXIe-1802 Arbitrary Waveform Generator and the new PXIe-1803 Digitizer. The PXIe1802 Arbitrary Waveform Generator (AWG) offers both speed and performance for output frequencies of up to 125 MHz. With built-in waveforms, high signal quality, high density and modularity, and a host of other convenient features, this AWG delivers dual 14/16bit waveform generator channels, bandwidths of 90-140 MHz, synchronization, and 250 μV measurement accuracy. The PXIe-1803 is a 130/180 MS/s dual-channel digitizer providing industry-leading speed and performance for input frequencies up to 175 MHz. With exceptional signal integrity, high density, and modularity, this new digitizer provides a dual-channel 14/16bit digitizer configurable as separate or fully synchronized channels. Other features include waveform bandwidths of 65-175 MHz (typical), 64M of waveform memory per channel, and relative accuracy of up to 0.006 percent.

COTS DC-DC Converters and EMI Filters: VXR and VPT Series in Fully Encapsulated Epoxy V-SHIELD® Packaging D 5-250 watts D -55 °C to +105°C D Integral metalized EMI shielding D Fully compatible with aqueous cleaning processes D Proven for harsh environments including vibration, shock and temperature cycling

Astronics East Aurora, NY (716) 805-1599 www.astronics.com

www.vptpower.com

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COTS PRODUCTS

3U VPX SBC Serves Up Xilinx Zynq Ultrascale+ SoC PanaTeQ has introduced the VPX3-ZU1, an expandable SBC a 3U (100 x 160mm) OpenVPX compatible board. The VPX3-ZU1 owes its performance. In a single device, the Zynq UltraScale+ integrates a Quad-core 1.5GHz 32/64-bit ARM Cortex-A53 based Application Processing Unit (APU), a Dual-core ARM Cortex-R5 based Real-Time Processing Unit (RPU), an ARM MALI-400 based GPU and a large Programmable Logic (PL) Array. The device also includes on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces. The VPX3-ZU1 includes an FMC connector allowing the board to be targeted to specific applications by fitting it with any compatible front end I/O interfaces, such as ultra-high speed Analog to Digital Converters, Video Adapters, or high speed networking ports. The FMC site is compliant to the Vita 57.1 HPC standard and includes 90 Single Ended IO (45 Differential Pairs) and 10 Multi Gbit Transceivers. The multiple Cores and Programmable Logic can operate together to resolve today’s and tomorrow’s most demanding embedded computing challenges, in applications ranging from Software Defined Radio, Image Processing, Target Detection, EW / ISR, advanced Multi-Axes Motors controller, Multi-Gigabit Ethernet Communications, to LIDAR / RADAR / SONAR. Using Xilinx’s powerful SDSoC Development Environment, the User Application Code can easily be partitioned between the Zynq’s available Cores, and the Programmable Logic. The air cooled PanaTeQ System Development Kit VPX3-ZU1-PSDK is available for the developers and includes a lab chassis with 3-slots OpenVPX CEN03-15-2-9 backplane, the VPX3-ZU1-B1-AC and RTM-ZU1-A1 boards, a PentaLinux BSP, the PanateQ FPGA Design Kit (PAN-FDK) and cables. PanaTeQ USA Scottsdale AZ www.panateq.com

E3800 Atom-Based Embedded PC Boasts Ultra Compact Size

High-Brightness Monitors are Designed for Direct, Bright Sunlight

ADL Embedded Solutions has announced its ultra-compact ADLEPC-1500 Embedded PC. At 3.4- x 3.2-inches, the ADLEPC-1500 is a full-feature embedded PC targeted for unmanned, Industrial controls, robotics, traffic management and surveillance. Its wide voltage and temperature range make it ideal for a variety of applications and environments. The ADLEPC-1500 is based on the compact ADLE3800SEC E3800series Atom SBC with onboard DisplayPort, USB3.0, USB2.0, M.2 KeyB 2242 SATA and two LAN ports. Quad and dual-core E3800 processor options also support DirectX 11, Open GL 4.0, and full HD video playback.

TRU-Vu Monitors has released a new high-brightness monitor with over 1,500 nits of brightness, ideal for use in direct, bright sunlight. The new SRMH-24R features a 24 screen inch with 1920 x 1080 full HD resolution. The 1,500 nits brightness means the SRMH-24R is 7 times brighter than a typical desktop monitor. It will produce clear, sharp video images even when used in direct, bright sunlight. The ALS (Ambient Light Sensor) automatically adjusts monitor brightness depending upon ambient light conditions. The SRMH-24R is also available with optional touch screens, NEMA 4X waterproof enclosures, and more.

ADL Embedded Solutions San Diego, CA (858) 490-0597 www.adl-usa.com

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COTS Journal | February 2017

TRU-Vu Monitors Arlington Heights, IL (847) 259-2344 www.tru-vumonitors.com\


COTS PRODUCTS

Space-Qualified 3U cPCI SBC Boost Speed and Memory Size Aitech Defense Systems has created its new SP0-S space-qualified 3U CompactPCI SBC with additional on-board memory, as well as voltage and temperature monitoring resources. This radiationhardened board now provides 1 Gbyte of DDR2 ECC SDRAM, doubling the previous version’s processing performance and increasing performance. 1 Gbyte of user flash is standard; adding up to 8 Gbytes of user flash as a future option that will be qualified and available early this year. The SP0-S still features a low overall power consumption of only 10 W. Its solid functionality, large memory arrays and exceptional operating characteristics Dawn’s PSC-6238 VITA in the harsh, remote environment 62 compliant 3U VPX Power of space make the new SBC ideal for Supply for conduction high performance, in-orbit systems for LEO (Low), MEO (Medium) and GEO cooled systems is designed (Geostationary Earth) Orbits. The board to operate in a military has been fully tested and characterized environment over a wide at NASA-approved cyclotrons at both UC range of temperatures Davis (proton) and Texas A&M (heavy at high power levels. Up to ion) to over 100 kRad (Si). The SBC is latch-up immune to greater than 65 MeV800 Watts available power. cm2/mg for reliable operation in either of the three main orbits, or anywhere in Onboard embedded RuSH™ between. technology. Switchable Battleshort A rad-tolerant NXP SOI MPC8548E and NED functions. PowerQUICC-III 1 GHz processor provides 400 MHz of CCB (Core Complex Bus) and an e500 SoC, which integrates an L1 cache with 32 Kbytes each of on-chip instruction and data, and a 512 Kbytes L2 cache. Extensive on-board Dawn is the leader in VITA 62 I/O potentially reduces the number of compliant power supplies for the additional peripheral cards needed to mission critical market. Wide range of implement a fully functional C&DH or standard features, highly configurable other subsystems, simplifying system through custom firmware. integration.

Dawn Powers VPX

Aitech Defense Systems Chatsworth, CA (888) 248-3248 www.rugged.com

Rugged, Reliable and Ready.

You need it right. You want Dawn.

(510) 657-4444 dawnvme.com COTS Journal | February 2017

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COTS PRODUCTS

Socket for 14x10mm BGA Device Supports Extreme Temperatures Ironwood Electronics has introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA208 - CBT-BGA-7041. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 40 degrees C temperature rise. Socket temperature range is -55 to +180 degrees C. Socket features a clamshell lid design for ease of chip replacement in production environment. It also has an integrated compression plate for vertical force without distorting device position. The specific configuration of the package to be tested in the CBT-BGA-7041 is a BGA, 14x10mm, 0.75mm pitch 16x13 array with 208 balls. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. Pricing for the CBTBGA-7041 is $863 at qty 1 with reduced pricing available depending on quantity required. Ironwood Electronics Eagan, MN (800) 404-0204 www.ironwoodelectronics.com

500W AC-DC Power Supplies Target Shipboard Applications Behlman Electronics’ latest shipboard power supply, P/N 94088, is a reconfiguration of their proven DCS1000D Series of COTS power solutions. Designated DCS1000D-8-(15, 33.3)- (15, 33.3), to identify its special ability to provide redundant 500 Watt outputs of 15 VDC at 33.3 A, this AC-DC power supply is both rugged and compact. It can support the special requirements of military shipboard systems, and is designed to meet the input power requirements of MIL-STD-1399, Section 300, Type II. This unit accepts 3-phase Delta 115 VAC input from 360 Hz to 440 Hz, and has protection from short circuit, over current, over voltage, and over temperature. It is designed to meet MIL-S-901 and MIL-STD-810 for shock; MIL-STD-167 and MIL-STD-810 for vibration and humidity, plus MIL-STD-461C/D and RE102 (with proper shielding) for EMC/EMC. At only 9.75- x 5- x 2.5-inches, this compact unit is readily accommodated in tight spaces. Behlman Electronics Hauppauge, NY (631) 435-0410 www.behlman.com

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COTS Journal | February 2017

Low Profile, Rugged Core i7 Tablet Weighs Only 3 Pounds MilDef has introduced the Intel Core i7-based DS11 rugged tablet, featuring a low profile, lightweight design. The DS11 features a high-brightness, antiglare, anti-reflective 10.1-inch capacitive multi-touch display and a CNC milled lightweight aluminum chassis. A wide selection of customization options ranges from various military connectors to a resistive touchscreen and several wireless connectivity options. This tablet includes an mSATA SSD and up to 8 Gbytes of DDR-lll RAM. The DS11 is compliant with IP65, MIL-STD-810 and MILSTD-461 and can operate in temperatures from -20 to +55 degrees C. The compact tablet measures 11.0- x 7.3- x 0.7-inches and weighs only 3 lbs. MilDef Alexandria, VA (703) 224-8835 www.mildef.com


COTS PRODUCTS

Altivec-Enabled VPX SBC Features a Quad-core T2080 Processor Curtiss-Wright’s Defense Solutions has introduced the VPX6-197, its newest Power Architecture-based 6U VPX SBC. The board features NXP Semiconductors’ quad-core dual threaded 64-bit AltiVec-enabled T2080 processor. It delivers up to 1.8 GHz nonthrottling processing performance yet only requires 42 W of power dissipation. The new SBC extends Curtiss-Wright’s ongoing commitment to lead the industry in delivering Power Architecture based embedded processing solutions. The VPX6-197 provides system designers with a backwards compatible solution for upgrading previous generation PowerPC/ Power Architecture modules based on the P4080 processor, such as Curtiss-Wright’s VPX6-187 SBC. Its quad-core T2080 CPU, each core featuring AltiVec support, delivers the high performance processing needed to handle the acquisition, processing, and distribution of sensor data for demanding video, radar, and sonar applications. It’s equally well suited for use as a mission computer, display computer, or in SIGINT and motor control applications deployed on space-constrained tactical aircraft, armored vehicles and harsh environment naval systems. For retrofit and technology insertion applications, the new SBC delivers the same complement of I/O, including includes four Gigabit Ethernet ports (2 x 1000BASE-KX and 2 x 1000BASE-T), EIA-232/422 serial channels, discrete and differential digital I/O, Universal Serial Bus (USB) 2.0 ports, and SATA interfaces as the earlier design, yet is cost competitive. For mezzanine support, the If you are ready for a more robust handle/panel solution, VPX6-197 provides one XMC site and come to Pixus! Our OpenVPX handles feature a metal one PMC/XMC site. The SBC provides PCI Express expansion plane capability engagement claw and rugged design that ensures the to support a variety of port widths. In highest reliability. Ask about our new rugged horizontal addition the SBC features an updated extruded rails with thicker material for OpenVPX and high OpenVPX dataplane that supports the insertion force systems today! 10Ge-KR profile natively from the T2080 processor.

Are Your OpenVPX Handles Breaking?

Superior Rugged Metal Claw

Curtiss-Wright Defense Solutions Ashburn, VA (703) 779-7800 www.cwcdefense.com.

sales@pixustechnologies.com pixustechnologies.com

COTS Journal | February 2017

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COTS PRODUCTS

Compact 35 Amp, 24 V SSPC Delivers Power System Flexibility Data Device Corp. (DDC) has introduced a highly versatile 35A, 28V Single Channel Remote Solid-State Power Controller (SSPC) module, offering advanced programmability, power optimization, and system health diagnostic and prognostic data in a compact and reliable module. The RP-20011601S0 programmable remote power controller can be readily configured for a wide range of power requirements, making it ideal for advanced electrical management systems, as demonstrated by its selection for use on the Joint Light Tactical Vehicle (JLTV). DDC SSPCs enable network control, programmability, and autonomous operation—simplifying vehicle control and freeing crew members’ time, so they can concentrate on mission critical tasks. They also provide controlled rise/fall times, and I2t trip protection, to deliver accurate load protection and flexible power distribution. DDC’s SSPCs also offer flexible control options, including CANbus and RS-485 interfaces, and a range of discrete controls. Highly efficient, DDC’s SSPCs enable significant SWaP-C savings compared with mechanical switches, breakers, and relays, saving space for other components and expanded functionality. These compact, high density power control solutions enable a 7X power-tovolume and 5X power-to-weight savings, compared with larger mechanical alternatives, enabling reduced space consumption and fuel costs, while extending mission range. DDC SSPCs have a 25X improved MTBF compared with mechanical switches, breakers, and relays, with moving parts which are more prone to failure. They also provide real-time health and diagnostic data, enabling improved mission uptime, safety and longevity through preventative and automated maintenance. Data Device Corp. Bohemia, NY (631) 567-5600 www.ddc-web.com

Xeon-Based Server-Class Systems Offer Extended Life Cycle Support Corvalent has announced its CorServer 2600 server-class product family. Integrating the Intel® Xeon E5-2600 v3/v4 processor family, CorServer enables high performance storage and data processing at the edge, while server-class design reduces cost by eliminating unnecessary third-party software certifications. Data-intensive applications gain an operational advantage with data management close to the source, for example reducing challenges of latency and bandwidth by transmitting processed, encrypted files rather than massive amounts of raw data. More reliable and functional than a commercial controller typically deployed at the source, CorServer enables dualprocessor performance for Internet of Things (IoT) and number crunching applications such as Big Data analytics, medical imaging, or security and surveillance in critical infrastructure environments. The CorServer 2600 family is available in 1U and 2U configurations, with design and layout informed by Corvalent’s expertise supporting OEMs and application developers with custom designs. Server board and chassis are optimized to work together, while cabling layout enables airflow supported by low-noise internal fans. The CorServer product family features both server-class and workstation-class systems, offering up to eight channels of 16 DDR4 DIMM memory support, extended temperature operation from 5 to 35 degrees C, and redundant power supplies and fans to assure rugged reliability. Corvalent Cedar Park, TX (512) 456-2400 www.corvalent.com

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COTS Journal | February 2017


COTS PRODUCTS

Maker Transition Kit Helps Bring Prototypes to Market Critical Link has announced the MitySOM-335x Maker Transition Kit. Users can now convert prototypes based on the BeagleBone Black with Texas Instruments AM335x ARM processor to production-suitable designs leveraging Critical Link’s proven MitySOM platform. The Maker Transition Kit has been designed to minimize changes required for those transitioning from the BeagleBone Black, and in many cases is a drop-in replacement. The BeagleBone Black continues to be one of the most popular maker development platforms. It follows the community-supported model which provides numerous advantages in initial hardware costs, open source design documentation, and a large user base of talented developers willing to lend support. Critical Link Syracuse, NY (315) 425-4045 www.criticallink.com

COM Express Basic Module Sports Intel Kaby Lake Processors Congatec has extended its COM Express Basic portfolio with the conga-TS175 Computer-on-Module. Equipped with the dual chip versions of the new Intel Xeon and Gen 7 Intel Core processors (codename Kaby Lake), the board boards an embedded power envelope of up to 45 Watts and up to 32 Gbytes of DDR4 memory. Also featured is the new Intel HD630 graphics supporting up to three independent displays with up to 4k at 60 Hz via DisplayPort 1.4 and HDMI 2.0—both with HDCP 2.2, and eDP 1.4 support. The modules offer all the common I/O interfaces of the Type 6 pinout. Powerful system extensions including Intel Optane memory can be connected via PCI Express Gen 3.0 Lanes. Congatec San Diego CA. 858-457-2600 www.congatec.us

COTS

PRODUCT GALLERY VPX56H-6 - 1000-Watt AC/DC Power Converter, 6U VPX The VPX56H-6 is NAI’s latest conduction-cooled 1000 Watt AC/DC converter. It accepts either a 3Ø, 115VAC L-N input or a +270 VDC input and plugs directly into a standard 6U VPX chassis. It supports all VITA standard I/O, signals and features, and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.

• 1000 watts power through full temperature range • Conduction-cooled through the card edge/wedgelock • Ideal for rugged 6U VPX power applications • Standard VPX-compatible connectors and I/O per VITA 62 • Compatible with System Management Bus per VITA 46.11 • Off-the-shelf solution for VITA 46.0 and VITA 65 systems • Accepts 3Ø AC or +270 VDC input • Provides five outputs and I/O • Optional holdup capacitor charging circuit

North Atlantic Industries, Inc. Phone: (631) 567-1100 Web: www.naii.com

COTS Journal | February 2017

39


COTS PRODUCTS

3.5-Inch Form Factor Board Sports Atom Apollo Lake SoC

Rugged NVMe SSD Module Rides OpenVPX

American Portwell Technology has announced the release of the PEB-2773 (146mm x 102mm) 3.5-inch embedded system board based on the Intel Atom processor E3900 series. The processors integrate the Intel Gen 9 3D graphics engine with up to 18 EUs (Execution Units) that improves the performance and supports 4K codec encoding/decoding. It also supports one dual-channel 24bit LVDS connection, one DisplayPort (DP) and HDMI on rear I/O with resolution up to 4096x2160. The 204-pin non-ECC SODIMM provides maximum memory, making it capable of supporting up to 8Gbytes of DDR3L. PEB-2773 supports a total of six COM ports, six USB 3.0 ports and dual Gbit Ethernet.

The VP1-250-eSSD from Phoenix International Systems is a 3U VPX SSD storage module that delivers extremely high performance via a single Fat Pipe (PICe 4x). It is designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS. Data is delivered fast and efficiently with minimal burden on the host CPU. NVM Express (NVMe) is an industry-standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. The NVMe protocol was established in collaboration by server industry leaders to standardize a scalable PCIe interface, making it easier for designers to unlock the full potential of PCIe.

American Portwel Technology, Fremont, CA (510) 403-3399 www.portwell.com

Phoenix International Systems Orange, CA (714) 283-4800 www.phenxint.com

Low Profile Power Supplies Require Less Space on DIN Rail TDK has announced the TDK-Lambda brand DRL AC-DC DIN Rail mount power supplies. With efficiencies of up to 90 percent, waste heat has been reduced, allowing the use of very narrow width package sizes ranging from 18mm for the 10W, to 72mm for the 100W model. Less space on the rail provides additional room for other components or the use of smaller enclosures. The DRL series has an operating input range of 85 to 264 VAC, and can withstand 300 VAC for 5 seconds. The units have a Class II construction (double insulation) and do not require an earth ground connection. Four power levels and case sizes are offered: 10W, 30W, 60W and 100W. TDK-Lambda Americas San Diego, CA (619) 628 2885 www.us.tdk-lambda.com/lp

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COTS Journal | February 2017

High-Voltage Contactor is Suited for Harsh Environments TE Connectivity (TE) has released its KILOVAC K1K high-voltage contactor. Designed for harsh environments, these contactors offer exceptional performance in new-technology higher voltage and current battery systems and energy storage systems. This contactor is among the smallest and lowest cost in the industry while maintaining high-voltage switching capabilities. The KILOVAC K1K contactors are constructed to support up to 1000 V/1000 A in harsh and explosive environments, and are compact and lightweight for optimal performance without oxidation or contamination of contacts, even over periods of non-use. In addition to being hermetically sealed for long-lasting performance, the contactors feature bidirectional switching and can mount in any position. TE Connectivity Berwyn, PA (610) 893-9800 www.te.com


COTS

ADVERTISERS INDEX GET CONNECTED WITH INTELLIGENT SYSTEMS SOURCE AND PURCHASABLE SOLUTIONS NOW Intelligent Systems Source is a new resource that gives you the power to compare, review and even purchase embedded computing products intelligently. To help you research SBCs, SOMs, COMs, Systems, or I/O boards, the Intelligent Systems Source website provides products, articles, and whitepapers from industry leading manufacturers---and it's even connected to the top 5 distributors. Go to Intelligent Systems Source now so you can start to locate, compare, and purchase the correct product for your needs.

intelligentsystemssource.com

Company Page# Website

Critical I/O...........................................5............................ www.criticalio.com

North Atlantic Industries, Inc..............43................................... www.naii.com

Dawn VME...........................................35.......................... www.dawnvme.com

Pentek.................................................44.............................. www.pentek.com

Eizo......................................................4.........................www.eizorugged.com

Pico Electronics, Inc............................23................. www.picoelectronics.com

Elma Electronics.................................15................................. www.elma.com

Pixus Technologies..............................37.............www.pixustechnologies.com

Embedded World.................................31..................www.embedded-world.eu

Star Communications Inc....................25......................www.starcommva.com

GAIA Converter Inc...............................7................... www.gaia-converter.com

SynQor.................................................17...............................www.synqor.com

Horizon Display.......................................16...................... www.horizondisplay.com

VPT......................................................33...........................www.vptpower.com

Intelligent Systems Source.....................20...... www.intelligentsystemssource.com

WinSystems.........................................21.......................www.winsystems.com

Mercury Systems, Inc. .........................2.................................. www.mrcy.com

COTS Gallery Ad..................................39.........................................................

COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 150, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices. POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 150, San Clemente, CA 92673.

COMING NEXT MONTH Power Converters and Supplies Enable Low SWaP Designs

Today the choice of power supplies and power converters can rank as a make or break decision in embedded military computer systems. With more and more computing stuffed into smaller spaces, power has direct implications on the size, cooling and mobility of a system. Articles in this section examine technology trends affecting DC/DC converters, power supply module bricks and slot-card power supplies (VME, cPCI and others).

Tech Recon: Jeff’s Picks: Jeff Child’s Top Ultra High-Performance SBC Products

In our popular Tech Recon feature “Jeff’s Pick” section we directly leverage Jeff’s decades of experience covering the embedded computing and defense market. He will choose the top products in a different category each month and share his insights on why they’re significant in terms of design innovation, market relevance and technology leadership. March’s section looks at SBCs that offer the highest levels of computing performance available today.

System Development: Annual Obsolescence and Life-Cycle Management Services Directory

Unique coverage of key military technology issues in a way that you can’t find elsewhere; that’s what COTS Journal is known for. Exemplifying that unique character is our Annual Obsolescence Services Directory. Now in its 17th year, the Annual Obsolescence Services Directory lists both key DoD organizations and commercial firms involved in solving the problems of component obsolescence.

Data Sheet: FPGA Processing Board Roundup

As the signal processing capabilities of FPGAs continue to climb, boardlevel configurable computing solutions have grown to become key enablers for waveform-intensive applications like sonar, radar, SIGINT and SDR. Such systems have an insatiable appetite for more digital signal processing muscle. This feature section delves into the solutions available in this area and explores how they’re transforming military signal processing systems.

COTS Journal | February 2017

41

Index

Company Page# Website


COTS Journal’s

MARCHING TO THE NUMBERS

14.8 MILLION

$

$

Potential value of contract indefinite-delivery/ indefinite-quantity (IDIQ) contract awarded to CPI Aerostructures from Bell Helicopter for the manufacture of engine cowl assemblies and support assemblies for the AH-1Z Viper attack helicopter. That potential value is based on the estimated order quantity during the period of performance, ending December 31, 2020. CPI Aero has manufactured such assemblies for the AH-1Z Viper since 2011 totaling $6.8 million in orders. The AH-1Z Viper is a twinengine attack helicopter used by the United States Marine Corps.

235 MILLION

$

Value of contract the U.S. Navy has awarded to Raytheon for Standard Missile-6 all-up round production missiles and spares. Raytheon will begin delivery in 2018. The missiles will be deployed on Aegis cruisers and destroyers to support U.S. Navy fleet operations. The award funds the fourth year of full-rate production for the multi-mission missile, which recently accomplished significant testing milestones and achievements. The contracted missiles will include an anti-surface capability, which was demonstrated in early 2016 during a highly successful tactical demonstration event off the coast of Kauai.

1 GRAM

Weight of the smallest smallest ADS-B transceiver yet developed by uAvionix. Weighing less than 1 gram, a dime sized ADS-B prototype module for drones with transmission power between 0.010.25 Watts could provide visibility to any aircraft equipped with ADS-B “IN” avionics from 1 – 10 miles away, and is small enough to integrate directly into professional and consumer-level drones. uAvionix is working with the FAA and other partners under a Collaborative Research and Development Agreement (CRDA) to test the unit, along with other uAvionix products.

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COTS Journal | February 2017

9.7

BILLION Projected value that the global Artillery and Systems market will grow to by 2026 according to a market research report now available from ASDReports. The market value at $6.2 billion in 2016, is projected to grow at a CAGR of 4.59 percent over 2016-2026. The report says the market will be dominated by the Turret Systems segment. Asia Pacific is forecast to dominate the sector, followed by North America and Europe. The Asia Pacific region is estimated to account for the largest share of the global artillery and systems market, with a cumulative spending of countries forecast to reach $39.4 billion over the forecast period.

210 KNOTS Airspeed of new variant of General Atomics Predator B UAV. General Atomics Aeronautical Systems (GA-ASI) launched a “Type-Certifiable” (STANAG 4571) version of its Predator B product line, called SkyGuardian late last month. SkyGuardian is the result of a five-year long company funded effort to deliver a UAV system that can operate under the stringent airworthiness requirements of non-military airspace. The aircraft leverages the legacy of the multi-mission Predator B fleet, which has amassed nearly two million flight hours. SkyGuardian can fly in excess of 35 hours and reach altitudes of more than 14000 meters.


Widest Input Voltage Range

Multi-function I/O Single Board Computers Rugged Power Supplies Rugged Systems Benchtop & VXI Instruments

High Power Density

VITA Compliant

BIT Communications

NAI’s board and box-level power solutions are used worldwide in a broad range of rugged military shipboard, ground-based and airborne systems. NAI builds upon a comprehensive family of standard power products resulting in power solutions that meet customer specific requirements – FAST. COTS and modified COTS power supplies provide intelligent monitoring, control and communications. Features include; I2C communications, geographical addressing, current sharing and programmability. When it comes to power solutions for the most demanding applications, NAI delivers. 3U VPX/cPCI & 6U VPX/VME High power density up to 3000W Integrated EMI filtering

Made in USA A certified small business

VITA 62 compliant Lower engineering costs Stand-alone power solutions

North Atlantic I n d u s t r i e s

www.na i i . c om


Unfair Advantage. 2X HIGHER performance

4X FASTER development

Introducing Jade™ architecture and Navigator™ Design Suite, the next evolutionary standards in digital signal processing.

Kintex Ultrascale FPGA

Pentek’s new Jade architecture, based on the latest generation Xilinx® Kintex® Ultrascale™ FPGA, doubles the performance levels of previous products. Plus, Pentek’s next generation Navigator FPGA Design Kit and BSP tool suite unleashes these resources to speed IP development and optimize applications. •

Streamlined Jade architecture boosts performance, reduces power and lowers cost Superior analog and digital I/O handle multi-channel wideband signals with highest dynamic range

Built-in IP functions for DDCs, DUCs, triggering, synchronization, DMA engines and more

Board resources include PCIe Gen3 x8 interface, sample clock synthesizer and 5 GB DDR4 SDRAM

Navigator Design Suite BSP and FPGA Design Kit (FDK) for Xilinx Vivado® IP Integrator expedite development

Applications include wideband phased array systems, communications transceivers, radar transponders, SIGINT and ELINT monitoring and EW countermeasures

Jade Model 71861 XMC module, also available in VPX, PCIe, cPCI and AMC with rugged options.

Navigator FDK shown in IP Integrator.

See the Video!

www.pentek.com/go/rtcjade or call 201-818-5900 for more information

All this plus FREE lifetime applications support! Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2016 Pentek, Inc. Pentek, Jade and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.


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