COTS Journal

March 2017, Volume 19 – Number 3 • cotsjournalonline.com

The Journal of Military Electronics & Computing JOURNAL

Power Supplies Pave Path to Reducing Size and Weight

JEFF'S PICKS JEFF'S TOP HIGH-PERFORMANCE SBCs 18th ANNUAL OBSOLESCENCE SERVICES DIRECTORY DATA SHEET: FPGA PROCESSING BOARDS An RTC-Media, LLC Publication

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Copyright © 2017 Mercury Systems is a trademark of Mercury Systems, Inc. -3258

The Journal of Military Electronics & Computing JOURNAL

CONTENTS

COTS (kots), n. 1. Commercial off-the-shelf.

Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements.

—Ant. When applied to the procurement of electronics for he U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

March 2017 Volume 19 Number 3

FEATURED p.10 Compact, Rugged Solutions Lead Power Converter Race SPECIAL FEATURE Power Supplies/Converters Focus on Low SWaP Needs 10

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Compact, Rugged Solutions Lead Power Converter Race

DEPARTMENTS 6 Editorial

FY2017 Budget Reloaded

Jeff Child

Soldiers Reap Rewards of Wearable Battery Design Rethink Mark Batts, Mike Stein, Inventus Power

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The Inside Track

32

COTS Products

42

Marching to the Numbers

TECH RECON Jeff Child’s Top High-Performance SBCs 18

3 GHz Kaby Lake-Based VME SBC Boasts 64 GB of DRAM and Rich I/O Jeff Child

SYSTEM DEVELOPMENT Annual Obsolescence Services Directory 22

DMSMS Experts Help Navigate Consumer Electronics Dominance Jeff Child

DATA SHEET FPGA Processing Boards Roundup 26

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Coming in April See Page 40 On The Cover: The Oshkosh Defense L-ATV combines field-proven technologies, an advanced crew protection system that provides MRAP-level protection and expeditionary levels of mobility in a light-duty profile. It can be equipped with the ProPulse hybrid diesel-electric drive train with exportable power including 70kW of on-board and export power.

(Oshkosh Defense Photo).

FPGA Boards Step Up Their Processing Game Jeff Child

FPGA Processing Boards Roundup

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COTS Journal | March 2017

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JOURNAL

The Journal of Military Electronics & Computing

Editorial

EDITOR-IN-CHIEF Jeff Child, jeffc@rtc-media.com EXECUTIVE EDITOR Johnny Keggler, johnnyk@rtc-media.com SENIOR EDITOR John Koon, johnk@rtc-media.com

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Finance

COTS Journal HOME OFFICE The RTC Media, LLC 940 Calle Negocio, Suite 230 San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050 www.rtc-media.com

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EDITORIAL OFFICE Jeff Child, Editor-in-Chief Phone: (603) 429-8301

Art/Production

Publisher

PUBLISHED BY RTC MEDIA, LLC Copyright 2017, RTC Media, LLC. Printed in the United States. All rights reserved. All related graphics are trademarks of RTC Media, LLC. All other brand and product names are the property of their holders.

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PRESIDENT John Reardon, johnr@rtc-media.com VICE PRESIDENT Aaron Foellmi, aaronf@rtc-media.com

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COTS Journal | March 2017

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EDITORIAL Jeff Child, Editor-in-Chief

FY2017 Budget Reloaded

T

he $54 billion—the amount of proposed fiscal year 2018 increase in military spending by unveiled by the White House this month—is a number well known to all at this point. But perhaps of more immediate interest is the DoD’s request to amended the fiscal year 2017 budget. The DoD has announced a two part strategy for its upcoming budget plans. Released this month was an amendment to the fiscal year 2017 budget. Meanwhile, the budget request for fiscal 2018—which on “normal” years comes out in early February—is scheduled to be released on May 1.

The 2017 budget amendment is the current admiration’s chance to add its own priorities to previous administration’s FY 2017 budget submission. That budget request from last year was for $582.7 billion—a budget that Congress has not passed. How sequestration and the Budget Control Act of 2011 will come into play remains to be seen—though the BCA becomes a non-issue if the Congress ends up repealing that law.

The $30 billion 2017 budget amendment includes appropriations aimed at accelerating the defeat of the ISIS, al Qaeda, and their affiliated or associated groups, increasing warfighting readiness, and covering new must-pay bills. Here, I’ll focus on the items within 2017 budget amendment most relevant to COTS Journal readers: such as weapon system procurement and technology.

For the Army, some of the key procurement/technology items include $2.8 billion in equipment spending. This includes restoring and modernizing equipment in Aviation, Armor Formations, Unmanned Aerial Systems (UAS), and Air and Missile Defense systems across the operational force. $1.2 billion is allocated toward COCOM support / Counter ISIS. That includes funding for Intelligence, Surveillance and Reconnaissance (ISR) for multiple COCOM operations to counter ISIS, al Qaeda, and their affiliated or associated groups.

The Navy’s share of the 2017 budget amendment meanwhile includes a lot of aircraft procurement and technology investment. It calls for the purchase of 24 F/A-18E/F Super Hornet strike fighters and six P-8A Poseidon maritime patrol aircraft to replenish combatworn strike fighters and increase the number of ready available aircraft within 30-35 months. Aviation spares funding buys spare parts for nine types of aircraft: F-35C Lightning II, F-35B Lightning II, CH-53K King Stallion, E-2D Advanced Hawkeye, C-40 Clipper, E-6 Mercury, H-1 series, MQ-8 Fire Scout, Special Project. There’s also an increase in information warfare funding will upgrade and maintain afloat and ashore networks to improve cyber security. It also provides planning and design for the new Command, Control, com-

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COTS Journal | March 2017

munications, Computers and Intelligence (C4I) system at the Naval Computer and Telecommunications Area Master Station Atlantic building in Norfolk, Virginia.

2017 budget amendment dollars allocated for the Marine Corps focus on a number of areas including Counter-Unmanned Aerial Systems capabilities, long range precision fires, and intelligence and communications. One goal is to balance ground and aviation, which involves fixing holes that resulted from the difficult decisions made during years of fiscal limitations and uncertainty. This means essential modernization for the aviation platforms and enhances the combat capability through electronic warfare and jammer techniques.

And finally, the Air Force portion of the 2017 budget amendment makes investments in capability and capacity designed to improve its 4th and 5th generation aircraft in areas such as F-16 Fighting Falcon sensor upgrades, MC-130J Commando II and HC130 Combat King II retrofits, HH-60G Pave Hawk datalink interoperability, C-130H Hercules fleet propulsion upgrades and B-52 Stratofortress engine risk reduction. Added funds will also be used by the Air Force to procure five additional F-35A Lightning II’s and fund production shortfalls for C-130’s, space, and munitions. Funds will also strengthen the Air Force nuclear posture by funding nuclear command, control, and communications (NC3), Intercontinental Ballistic Missile (ICBM) sustainment, and bomber readiness.

There’s never been an exact correlation between increases in DoD funding and revenue growth in our military embedded computing industry. In fact in times of tight defense budgets our industry tends to actually thrive from technology upgrade program business. Moreover, changes don’t always trickle down to our market immediately—especially given long development cycles typical to the military. Ultimately however, more dollars allocated to procuring military platforms and modernization and upgrading of existing platforms translates to revenue opportunities for our space. With prime contractors reducing their engineering workforce numbers in recent years, it’s a particularly good time for our industry to contribute their expertise in embedded computing technology.

AIA

CONVERTER

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8 Watts: MGDD-08 Series

• Ultra Wide input ranges - 4.5-33VIN Range (45V ≤ 100ms transient) - 9-60VIN Range (80V ≤ 1sec transient) • Dual isolated / unbalanced outputs for 3.3 ~ 50VOUT • DO-160 & MIL-STD-704 compliant • MTBF >1.2M Hrs @ 40°C per MIL-HDBK-217F

• High Power Density / Compact Size • No optocouplers for high reliability • MIL-STD-461 Compliant with Filter • Encapsulated with Metallic Enclosure

27.5mm / 1.083” 27.5mm / 1.083” 27.5mm / 1.083” V Trim V Trim Sync -VOUT 1 Sync 1 -V 19.3mm UVLO Set +VOUTOUTV1Trim 19.3mm UVLO Set 1 +V 0.76” OUT -VIN Sync -VOUT-V2OUT 1 0.76” 19.3mm -VInput IN 2 1 UVLO FilterSet -V +V 2OUT +VOUTOUT Filter 0.76” Input 2 2 +VOUT -V +VIN-VIN OUT +VIN Input Filter +VOUT 2 +VIN

Height: 8.0mm / 0.315” Tall 32.7mm / 1.287” 32.7mm / 1.287”

20 Watts: MGDD-21 Series

• Ultra Wide input ranges - 4.5-33VIN Range (45V ≤ 100ms transient) - 9-60VIN Range (80V ≤ 1sec transient) • Dual isolated & unbalanced outputs for 3.3 ~ 50VOUT • DO-160 & MIL-STD-704 compliant • MTBF >1,060kHrs @ 40°C per MIL-HDBK-217F

26.1mm 26.1mm 1.03” 1.03” 26.1mm 1.03”

32.7mm / 1.287” Sync Sync UVLO Set UVLOSync Set -VIN -VIN UVLO Set V Trim Input Filter V Trim Input-V Filter -VOUT 1 +VIN IN 1 -V +VIN Input Filter +VOUTOUTV1Trim 1 +VOUT -V +VIN -VOUT 2OUT 1 2 -VOUT+V +VOUT 2OUT 1 2 2 +VOUT -V OUT

Height: 8.0mm / 0.315” Tall +VOUT 2

150 Watts: MGDS-155 Series

• Ultra Wide input ranges - 9-45VIN Range (50V ≤ 100ms transient) - 16-80VIN Range (100V ≤ 100ms transient) - 150-480VIN Range • MIL-STD-1275, MIL-STD-704 & DO-160 Compliant • Single outputs from 3.3 ~ 28VOUT • MTBF >490kHrs @ 40°C per MIL-HDBK-217F

57.9mm / 2.28” 57.9mm / 2.28”

57.9mm / 2.28” 36.8mm 36.8mm 1.45” 1.45” 36.8mm 1.45”

-VIN -VIN Sync Sync-V IN Sync On/Off On/Off +VIN +VIN On/Off

-VOUT -VOUT Sense (-) Sense (-) -VOUT V Trim V Trim Sense (-) Sens (+) Sens (+)V Trim +VOUT +VSens OUT (+)

+VIN

Height: 12.7mm / 0.50” Tall

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w w w . g a i a - c o n v e r t e r. c o m

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INSIDE TRACK GMS Rugged Smart Displays Chosen for Navy Upgrades General Micro Systems announced that its SD19 rugged smart display is being deployed for use in modernizing select U.S. Navy ships.

This smart, all-in-one display will be distributed throughout the Navy’s fleet to replace an existing “dumb” display that had been facing end-oflife challenges. According to GMS, the award comes from a customer that wanted to combine two functions into one: a rugged, 19-inch LCD with special electrical, mechanical and environmental characteristics; and a rugged Intel-based single-board computer running Microsoft Windows.

GMS met the specification requirements in all cases and units passed rigorous qualification testing.

General Micro Systems has been awarded multi-year contracts to deliver tens of displays per ship, with volume of several dozen ships per year. Combined, all programs will exceed several million dollars in revenue per year. U.S. Navy programs such as the AEGIS Modernization Program (AMOD) requires computing system upgrades via the Advanced Capability Build (ACB) and Technology Insertion (TI) process for both cruisers and destroyers. COTS computer systems including the GMS SD19 are specified in the AEGIS Baseline 9 (BL 9) development effort (Figure 1). More upgrades are planned across the 84 ships in service with the AEGIS Weapons Systems installed (22 Cruisers and

62 Destroyers).

Figure 1

General Micro Systems Rancho Cucamonga, CA (909) 980-4863 www.gms4sbc.com

Ships with AEGIS Baseline 9 (BL 9) include the USS John Paul Jones (DDG-53), the third Arleigh Burkeclass guided missile destroyer.

DTS and Army Open Test Lab for Advancing Soldier Safety Earlier this month nearly 100 DTS employees and several key U.S. Army personnel gathered for the official ribbon-cutting ceremony at the new WIAMan ATD Lab located inside DTS headquarters in Seal Beach, CA. The new lab is being used exclusively to support the design, development and testing of the first blast test dummy, officially called the Warrior Injury Assessment Manikin (WIAMan).

DTS is the Prime Contractor to the U.S. Army for the WIAMan project, which is the first anthropomorphic test device (ATD) designed specifically to withstand underbody blasts (like IEDs).

The new 3,000+ sq. ft. lab is furnished with state-of-the-art test equipment including an 11-foot drop tower used to simulate the

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COTS Journal | March 2017

test manikin and include internal power and a variety of sensors.

DTS Seal Beach, CA (562) 493 0158 www.dtsweb.com

Gowanda Acquires Microwave Circuits and Dyco Electronics

Figure 2 The 3,000+ sq. ft. lab includes an 11-foot drop tower used to simulate the vertical impact experienced by an occupant in a vehicle blast.

vertical impact experienced by an occupant in a vehicle blast (Figure 2). To measure potential skeletal injuries, WIAMan currently uses 146 channels of embedded data

acquisition and sensors, but is designed to support up to 180 channels. The self-contained miniature data acquisition systems are distributed throughout the

Gowanda Components Group has announced two acquisitions.

In February the company acquired Microwave Circuits from AMTI in Lynchburg, VA. The deal is expected to expand its capabilities for the design and manufacture of RF and microwave filters. Terms of the deal were not disclosed but GCG has stated that Microwave Circuits’ production facilities will remain in Beltsville, MD and sales and technical support will remain in Lynchburg.

The

INSIDE TRACK And earlier this month, Gowanda announced the acquisition of Dyco Electronics in Hornell, NY. Dyco Electronics will be featured at Gowanda’s booth #310 during APEC 2017, the applied power electronics conference being held March 27-29 in Tampa, FL. Dyco Electronics’ operations will remain in Hornell, NY. In addition to Hornell and Beltsville, GCG has two other production facilities located within the United States.

The two acquisitions are the fifth and sixth for GCG within the last five years.

Gowanda Components Group Gowanda, NY (716) 532-2234 www.gowandacomponentsgroup.com

Lockheed Martin Upgrades its Flying Intelligence Testbed Lockheed Martin’s manned airborne testbed, the Airborne MultiINT Lab (AML), has been enhanced to expedite its ability to deliver decision-quality intelligence. The AML is used to experiment with combinations of sensors, systems and technologies Updates were

recently made to the AML’s onboard processing capability, which collects and correlates disparate types of sensor data. The AML now has an autonomous sensor control mode that can coordinate operations between the testbed’s various onboard sensors. Also integrated into the testbed’s mission system was a cognitive processing capability that enables rapid adaptation to a changing target environment.

The AML, a modified Gulfstream III business jet, provides a readily reconfigurable platform to rapidly explore how multiple sensors and onboard systems interact (Figure 3), and how to best apply them for use in military and non-military markets. Beyond traditional uses such as development and evaluation support, this robust intelligence, surveillance, and reconnaissance (ISR) lab can be deployed anywhere in the world with a minimal support footprint.

Lockheed Martin Bethesda, MD (301) 897-6000 www.lockheedmartin.com

Figure 3 The AML, a modified Gulfstream III business jet, provides a readily reconfigurable platform to rapidly explore how multiple sensors and onboard systems interact.

TECHNOLOGY SPOTLIGHT Tool Provides Harsh Environment Vibration and Acceleration Simulation Mentor Graphics has announced its new Xpedition vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction. The Xpedition product augments mechanical analysis and physical testing by introducing virtual accelerated lifecycle testing much earlier in the design process. According to Mentor Graphics, this is the industry’s first PCB-design-specific vibration and acceleration simulation solution targeting products where harsh environments can compromise product performance and reliability, including the military and aerospace markets.

Figure 4: Xpedition lets users use simulation to detect components on the threshold of failure that would be missed during physical testing.

Traditional, physical HALT (highly accelerated lifecycle testing) is conducted just before volume manufacturing, and requires expert technicians, which can result in costly schedule delays. Bridging mechanical and electronic design disciplines, the Xpedition product provides vibration simulation significantly faster than any existing method. This results in increased test coverage and shortened design cycles to ensure product reliability and faster time to market.

The Xpedition component modeling library is comprised of over 4,000 unique 3D solid models which are used to create highly defined parts for simulation. The 3D library allows users to easily match geometries to their 2D cell database. Designers can assemble the parts models on board and automatically mesh them for performance analysis, including stiffeners and mechanical parts. The system modeling tool is ultra-fast since it can model over 1,000 components per minute.

The Xpedition product can perform acceleration stress simulation for specialized applications. This feature provides safety factor simulation for constant acceleration conditions, pin-level Von-Mises stress, detailed stress and deformation plots, and three- axes user-defined force vector (X, Y, Z) simulation. These features are developed for safety-critical applications such as those targeting the mil-aero markets. Xpedition lets users simulate during the design process to determine PCB reliability and reduce field failure rates. They can detect components on the threshold of failure that would be missed during physical testing (Figure 4).

Mentor Graphics, Wilsonville, OR (503) 685-7000. www.mentor.com

COTS Journal | March 2017

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SPECIAL FEATURE Power Supplies/Converters Focus on Low SWaP Needs

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COTS Journal | March 2017

SPECIAL FEATURE

Compact, Rugged Solutions Lead Power Converter Race Driven by demands to reduce SWaP, DC-DC and AD-DC converter vendors are focusing on small, efficient devices capable of enduring harsh environments.

Jeff Child, Editor-in-Chief

F

or military system designs, reducing SWaP (size, weight and power) is a leading priority. Power conversion technologies play their part in that trend by providing more efficient power conversion combined with ever more compact devices. Power conversion has direct impact the cooling and mobility of defense platforms. Issues like the need to accommodate multi-voltage electronics, operate at wide temperature ranges and serve distributed system requirements all add up to some daunting design challenges.

DC-DC and AD-DC conversion products must juggle a lot of masters to push the limits in power density, voltage range, wide temperature range and advanced filtering schemes.

Designs that enable conversion technologies to be compliant to military standards are especially in demand. The need to meet noise and power related standards such as MIL-STD-461, MIL-STD-704 and MIL-STD-1275.

COTS Journal | March 2017

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SPECIAL FEATURE

Wide Input Range Solution Exemplifying those trends is Gaia Converter’s latest ultra wide input voltage range DC/DC converter—announced last month —the High Rel MGDD-40 series, targeting military and airborne applications. The voltage ranges are ideal for complying with MILSTD-1275, 704 or DO-160 standards without additional front end protection device (Figure 1). The ranges are 9-60 V and 80V /1s and 4.5-33V and 45V /100ms. According to Gaia that performance is achieved thanks to Gaia’s proprietary switching techniques while also keeping efficiency over 90 percent. With two outputs ( for parallel, serial or symmetrical operation) of 3.3V, 5V, 12V, 15V and 24V, they can cover a wide variety of needs such as single 5 to 48V output, +/- 15V or 2x24V outputs for example. The MGDD-40 Series have a wide temperature range of -55 to +105 degrees C and are potted to fit rugged military and airborne environmental conditions.

The MGDD-40 is packaged in a very low profile 0.33- and 1.5-x1.75-inch housing. The units are full featured and protected with zero to full load regulation, trim and on/off capability, adjustable UVLO, soft start, embedded EMI filter as well as over-current and over-temperature protection. They can also be synchronized and/or paralleled for added power or N+1 redundancy. Designed for rugged applications, the MGDDI-40 series do not use any optocoupler.

Reducing Size and Weight Also following the space-saving trend, last fall Technology Dynamics announced the release of their new COTS TDDC series of 1U DC to DC converter modules (Figure 2). This robust and ruggedized construction allows high performance and superb reliability. With reduced size and weight along with higher efficiency (SWaP), it provides a highdensity, space saving solution for applications in the military. The TDDC series delivers up to 1,500W of power and offers DC input voltage range of 18 to 32VDC. The output (24V or 48V) is adjustable and tightly regulated to ±1 percent (load) and ±0.5 percent (line).

Features include parallel/redundant operation, inhibit, Power-OK alarms, system reset signaling, active current sharing and programming/monitoring functions. In addition, the converters are fan cooled with a standard operating temperature range of 12

COTS Journal | March 2017

and 28V outputs, the encapsulated quarter bricks accept a wide range DC input of 9V to 40V, withstanding a 50V surge for 10 seconds.

Support for High Temp Operations

Figure 1 Wide input voltage range allows the MGDD-40 series DC-DC converter to comply with MIL-STD-1275, 704 or DO160 standards without additional front end protection device.

–20 to +75 degrees C, with an option for -40 to +75 degrees C. The unit includes forced current sharing, heavy duty output termination, remote inhibit, OV, OL, OT protection and it is designed to meet MIL-STD-810 and 461 standards. Forced current share makes this IU DC to DC converter ideal for parallel connection. Custom output voltages are available upon request with mechanical and electrical modification readily done. For MILSTD-461F compliance an external EMI filter is needed. Additional available options include conformal coating, remote voltage adjust, rack mount/panel mount and parallel/ redundant operation.

Encapsulated Packages Meanwhile, Pico Electronics provides its AVP/AVN series of unregulated high voltage DC-DC converters—with output voltages from 6,000 VDC to 10,000 VDC—are produced in an ultra-miniature encapsulated package.

50 different standard models are available.

These single output units will operate over the temperature range of -25 to +70 degrees C with no heat sink or electrical derating. For military applications, an operating temperature range -55 to +85 degrees C is available.

An optional environmental screening package per MIL-STD-883 is also available.

TDK-Lambda’s HQA120 isolated DC-DC converters are rated at 120W and have been qualified with methods consistent with MILSTD-883 and MIL-STD-202, making it suitable for use in COTS and harsh environment equipment. Initially available with 12V, 24V

A key aspect that separates military requirements from that of other markets is the need to function harsh environments like high temperatures. Feeding those needs, VPT’s HTD Series of DC-DC converters specifically designed for harsh and extreme temperature environments including aircraft engine electronics and other industrial applications requiring reliable operation in high temperatures (Figure 3). The HTD isolated 1.5 W DC-DC converter operates from -55 to 155 degrees C and the HTD non-isolated DC-DC converters operate from -55 to 185 degrees C. Each model has dual outputs and is designed using thick film hybrid microcircuit technology, bare semiconductor die integrated with passive components and thick film conductors on a ceramic substrate.

Within the HTD design, component-attach and die bonding are optimized for high temperature life, and hermetic metal packaging protects internal components for long-term reliability. Each HTD Series product has a low profile of 0.27 inches and measures less than an inch wide at 0.975 x 0.800 inches. The HTD Series of DC-DC converters are available for immediate sale.

Likewise address the need for hightemperature operations is the QMW quarter brick from Calex. Recently UL60950 ap-

Figure 2 The TDDC series of 1U DC-DC converter modules exemplify high power density combined with compact footprint delivering up to 1,500W of power and offers DC input voltage range of 18 to 32VDC.

SPECIAL FEATURE

Figure 3 The HTD isolated 1.5 W DC-DC converter operates from -55 to 155 degrees C and the HTD non-isolated DC-DC converters operate from -55 to 185 degrees C. proved, the devices feature an operating temperature range of -40 to +105 degrees C. The storage temperature is -55 to +125 degrees C. The QMW has an ultra wide 9 to 36V input range making the unit ideal for 12V and 24V battery powered applications. The QMW features remote ON/OFF for battery conservation. Other features include isolated input to output and a fully regulated 12V output with 20.5A of output current max. The unit has a peak efficiency of 93 percent with a fixed switching frequency of 275kHz. The QMW measures 1.54- x 2.39- x 0.50-inches and is designed to meet MIL-STD-810G for functional shock and vibration.

AC-DC Building Blocks On the AD-DC power supply side, the trend in recent years is toward building block components. The power factor correction piece of that is particularly important.

Along those lines, SynQor 3-Phase Power Factor Correction Module provides an essential building block of an AC-DC power supply that make use of full digital control to enable control strategies not possible with conventional designs. The product with part number MPFC 115 3PH-270 FP has a special constant-power output characteristic which helps pulsed-power systems-like radars for example-maintain good input harmonics (Figure 4). Digital control also allows for a data interface allowing the military system developers to view internal voltages, currents, and temperatures-information which would be difficult to obtain otherwise.

The MPFC 115 3PH-270 FP make use of SynQor’s robust construction techniques including automated assembly, embedded planar magnetics, and compliant potting ma-

terials. The device boasts innovations including minimal inrush current, support for full load current during startup ramp and balanced phase currents with low THD (1.5 percent at full load). It delivers a wide input frequency range of 45- to 800-Hz. The full-brick sized converter delivers 1.5 kW at 270 VDC while switching at 200 kHz, which allows for a groundbreaking improvement in power density. System developers requiring 400 Hz 3-phase for airborne military platforms will find huge weight savings over existing custom solutions. EMI is fully characterized with the available 3-phase half-brick input line filter (SynQor product number MACF 115 3PHUNV HT).

Another example of innovative AD-DC convertor building block technology is Vicor’s family of high density PFM AC-DC frontend modules in the rugged VIA package offer superior cooling performance and versatility in converter mounting. Featuring a universal AC input range (85 - 264 VAC), power factor correction, and a fully isolated 24 VDC or 48 VDC output, and delivering 400 W of isolated, regulated, DC output power at efficiencies up to 93 percent these new modules provide unprecedented power density of 127 W/in3 (8 W/cm3) and best-in-class performance in a diminutive, 9 mm thin VIA package.

www.calex.com Gaia Converter Morristown, NJ (973) 539.0568 www.gaia-converter.com SynQor Boxborough, MA (978) 849-0600 www.synqor.com TDK-Lambda Americas San Diego, CA (619) 628 2885 www.us.tdk-lambda.com/lp Technology Dynamics Bergenfield, NJ (201) 385-0500 www.technologydynamicsinc.com Vicor Andover, MA (978) 749-8359 www.vicorpower.com VPT Blacksburg VA (425) 353-3010 www.vpt-inc.com

Calex Concord, CA (925) 687-4411

Figure 4 The MPFC 115 3PH-270 FP has a special constant-power output characteristic which helps pulsed-power systems-like radar systems maintain good input harmonics.

COTS Journal | March 2017

13

SPECIAL FEATURE Power Supplies/Converters Focus on Low SWaP Needs

Soldiers Reap Rewards of Wearable Battery Design Rethink A much-improved wearable battery design is achieved with advanced ballistic technology integrated into the conformal wearable battery. This provides protection and power in a single system.

Mark Batts, Lead Project Engineer Mike Stein, Director of Military and Government Programs Inventus Power

A

significant portion of the weight today’s soldier carries is attributable to a number of electronic systems; all requiring power sources to operate. The transition of the current, distributed system to one built around integrated power, in an ergonomic form factor that conforms to the soldier’s chest, yields an appreciable optimization of load carriage, and therefore improves overall human performance potential.

For the development of a next generation Conformal Wearable Battery (CWB) that is married with ballistic protection, Inventus Power partnered with an antiballistic technology expert to produce an anti-ballistic plate combined with a 150 Whr battery. The Ballistically Rated Conformal Wearable Battery, or BR-CWB, reduces the battery burden on the soldier while providing ballistic protection within the Improved Outer Tactical Vest (IOTV) footprint

Figure 1 Shown here is the test set-up for ballistic testing the BR-CWB.

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COTS Journal | March 2017

or Enhanced Small Arms Protective Inserts (ESAPI) form factor. The design saves the Warfighter over four pounds per plate/battery pair. Human factors studies were performed to demonstrate the advantages of this design and body armor ballistic testing was conducted to determine the resistance to penetration.

Background and Project Objectives The new BR-CWB will increase energy independence for the soldier while decreasing the size and weight of the overall system and maintaining ballistic protection in the IOTV footprint, ESAPI form factor. The combination of a lightweight, low profile ballistic plate with a high energy density and ballistically safe battery will save the Warfighter over four pounds per plate/battery pair, a weight reduction of 35 percent. The thickness of the system is reduced by 42 percent to 1.1 inches.

The resistance to penetration or “V-0 testing” determines the velocity at which the bullet will have a 0 percent chance of penetrating a given piece of armor. The battery with its anti-ballistic plate were subjected to this testing to prove that the BR-CWB can withstand impact with deformations well within standard limits.

Design Overview

SPECIAL FEATURE

Figure 2 Typical Teton ballistic results: damage to the exterior on the left, deformation of the test back, or amount of BFD in the center and penetration of the ballistic into the plate on the right.

The BR-CWB is a 14.8 volt (V), 150 Watthour (Wh) nominal rechargeable lithiumion (Li+) conformable, soldier worn battery integrated into a SAPI/ESAPI style ceramic trauma plate. The BR-CWB is designed to fit many different carry locations available to the Warfighter but is specifically referenced to the side worn, small arms protection ballistic plate.

The BR-CWB is constructed using lithium-ion batteries that are connected in parallel to establish the maximum capacity of the system. The batteries are redundantly connected in series and parallel to ensure output even if one battery is compromised.

It is monitored by electronics with a fuel gauge and a smart software system to control the battery output and prevent thermal overload leading to the batteries entering a hazardous condition. The ballistic plate is a lightweight hard-faced material that is especially formulated for ballistic applications; it has excellent ballistic properties and high mechanical strength and offers a weight savings of up to 10 percent in comparison with traditional ballistic tile materials.

Deformation Test Results Body armor ballistic testing was conducted to determine the resistance to penetration and the ballistic limit of body armor test samples. The objective of resistance to penetration or “V-0 testing� is to fire projec-

tiles at a constant velocity to demonstrate that the armor samples provide specified protection against required threats. This test determines at what velocity the bullet will have a 0 percent chance of penetrating a given piece of armor. Results of this type of testing is measured in the amount of Back Face Deformation (BFD). Five BRCWB units were manufactured and used for testing. In order to provide a control group and comparison, backer coupons and Teton plates were tested separately from the BRCWB samples. The test set-up for ballistic testing is shown in Figure 1.

Coupons (6- x 6-inches) of the composite backer were tested separately to characterize performance at varying energy and velocity levels. Because the backer is not capable of stopping a higher level threat alone, the velocities and energy levels were intentionally low to allow for non-penetrative testing. A special Teton threat plate was used for the ballistic portion of the system for this testing. Images of typical results are shown in Figure 2 showing damage to the exterior on the left, deformation of the test back, or amount of BFD in the center and penetration of the ballistic into the plate in the enlarged image on the right. The Inventus Power BR-CWB was tested in the same set up as the backer and Teton plate. The typical results are shown in Figure 3 and the cells and electronics can be seen in the

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COTS Journal | March 2017

15

SPECIAL FEATURE

Figure 3 The BR-CWB was tested in the same set up as the backer and Teton plate. Typical results are shown in here—the cells and electronics can be seen in the center.

center.

The graph in Figures 4 shows the BFD performance versus energy of the tested subsystems. BFD performance has a slightly larger tolerance with the BR-CWB (approx. +/- 3mm) as compared to a standalone Teton (approx. +/- 1.5mm). This variance can be attributable to location of the projectile impact relative to a cell as well as any thixotropic behavior of the battery cell gel. These tests provide proof of concept for the BR-CWB, since there was a 72 percent reduction in median BFD from standalone Teton performance.

Human Factors Study Results After preliminary research, the human factors considerations for this project fall under two broad categories; the effects of mass consolidation on metabolic energy expenditure and torsional stability, and the potential influence of the device on human core temperature regulation. Use of this single device moves the mass of several batteries—whose position is currently distributed in a wide variety of locations—to a central location near the Center of Mass of the body (COM). This results in a shorter moment arm, which decreases both angular deviation and momentum when the system is in motion. This change is expected to result in an overall decrease in the metabolic energy required to carry the power supply, compared to a multiple-battery system.

While these savings are expected to be negligible in short term road marches (2030 minutes), trends seen in multiple load 16

COTS Journal | March 2017

carriage studies support the theory that savings will become much more significant over the long term (periods greater than 1 hour). Similarly, the effects on short burst energy expenditures are expected to be relatively small. However, evidence from a single study on armor size and fit indicates that the most important factors could be an increase in stability, speed of reaction, and sprint speed in a consolidated-mass condition. Such factors are critical in a combat situation, where the ability to rapidly change direction is crucial.

Because the use of any armor reduces the Warfighter’s ability to regulate his core temperature, careful consideration must be given to this issue. Initial “ballpark” bench top investigations indicate that the surface temperature of the battery ranges from 24 to 29 degrees Celsius under low-draw conditions (approximately 500mA). At maximal discharge, these figures increase, reaching a peak of approximately 33 degrees C (with the control circuit region elevated to approximately 36 degrees C). While the armor plate will offer some mitigation of these temperatures due to its effect as a heat sink, these values are still being established due to the wide range of power consumption scenarios. Considering that the thermoneutral zone for a sedentary, naked human body falls between 28 and 31 degrees C, it is very important that all possible influences of the system on the regulation of body core temperature be investigated further and were out of the scope of this study.

SPECIAL FEATURE

BR-CWB Put to Use The Inventus Power BR-CWB will be used to operate Nett Warrior, Ground Soldier, and existing Land Warrior Systems and electronic equipment including, radios, computers, GPS, NVG displays and other electronic applications. The combination of a lightweight, low profile ballistic plate with a high energy density and ballistically safe battery will save the Warfighter over four (4) pounds per plate/battery pair. This will increase Soldier mobility and agility and provide mission-extending, wearable power in a fightable format. The anti-ballistic protection provided by this device will be equal to or greater than any currently specified ESAPI. The transition of the current soldier system to one built around integrated power yields an appreciable optimization of load carriage, and therefore improves overall human performance potential.

Cell puncture does not appear to be a relevant failure mode when the battery is paired with a ballistic plate such as the Teton used in these tests. Thus, one does not expect the catastrophic failure sometimes associated with a hard short, which would preclude the use of a battery against the Warfighter’s body.

In addition, initial human factors studies indicate that the concept of a single battery, integrated in the ESAPI form factor, provides metabolic benefit, but more work is necessary to quantify that benefit relative to the possible issue of increased heat generation, and decreased dissipation, associated with locating a single battery pack against the Warfighter’s chest versus distributed power on extremities and other parts of the body. Approaching the BR-CWB engineering challenge as a partnership, with expertise brought across disciplines and industries, is a viable model to solve the complex problems encountered by today’s military. With each subsystem tested as independent units and as a whole, the individual contractors can provide a portable power solution for the soldier.

Inventus Power Woodridge, IL (630) 410-7900 www.inventuspower.com

Figure 4 Graphed here is the BFD performance versus energy of the tested subsystems.

Star Communications, Inc.

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www.starcommva.com COTS Journal | March 2017

17

JEFF’S PICKS Jeff Child, Editor-in-Chief

3 GHz Kaby Lake-Based VME SBC Boasts 64 GB of DRAM and Rich I/O

B

ecause many military applications are hungry for the most compute performance available, single board computer (SBC) vendors continue to design their high-end lines of SBCs around the latest and greatest microprocessors available. And unlike 15 years ago, those processors tend to show up on embedded SBCs with practically no delay. To judge the High-Performance end of SBCs requires at least a nod toward the term High Performance Embedded Computing (HPEC).

HPEC gets a little fuzzy because vendors still tend to all define it differently. Whether it means highly dense arrays of GPGPUs—or as data-center levels of computing based on server-class Xeon processors and all their support electronics—they all are meeting the military’s ongoing demand for greater computing muscle and compute density.

This month’s Jeff ’s Pick section looks at High Performance SBCs. Because OpenVPX is considered the leading edge open architecture for defense application, it’s not surprising that most of the contenders this month are OpenVPX boards. All that said, the winner is an VME SBC—a fact which exemplifies the defense industry’s continued reliance on VME for technology upgrade programs. For this Editor’s Pick section COTS Journal evaluated several such products on three aspects: technology leadership, design innovation and market relevance.

18

COTS Journal | March 2017

Figure 1 Jeff’s Pick is the VME120 from General Micro Systems, a 6U VME SBC a 3.0 GHz Core i7 Kaby Lake CPU (Xeon E3). It also features includes 64 Gbytes of DDR4 with ECC and an interconnect system for expanding mezzanine I/O.

This month’s Pick is the VME120 from General Micro Systems (Figure 1). The SBC is the company’s ninth-generation 6U VME SBC module based on GMS’s upgradable CPU “computing engine” technology. According to GMS, the product is perfect for defense programs that designed in VME and can’t easily requalify or afford a complete redesign to VPX. But adding “more” to VME is still desirable, and that’s the key benefit of the GMS VME120. It is a multi-optioned version of a well-proven GMS VME board designed into countless U.S. Navy platforms.

It gets its “high performance” distinction from its Intel 7th Generation Core i7 Kaby Lake CPU (Xeon E3). It clocks at 3.0 GHz (Turbo Boost 2.0 up to 4.1 GHz), has 4 cores and supports 8 virtual machines. Kaby Lake boasts an embedded graphics engine, HD

Graphics P630 with GT2, H.265 CODEC. Memory includes 64 Gbytes of DDR4 with ECC—double what most SBCs provide.

Rich I/O and Expansion Options The board can be equipped with 3- or 5-row VME connectors, and all of the board’s I/O can be routed off the front panel or to an optional P0 connector (if not on P2). Standard I/O includes 2x 10GigE, 2x 1GigE with TOE designed for VITA 31.1, 7x USB 2.0/3.0, GPIO and so on. But that’s all enhanced by an inter-board connector that mates to a second VME mezzanine board adding three more add-in I/O mezzanine cards and additional I/O. Called the VME120-WSIO (“workstation I/O”), the WSIO adds 3x PMC modules, or 1x XMC and 2x PMC. Designers can also add 1x MXM module—a popular format for add-in GPU or GPGPU cards.

The product scores high in market relevance because it directly feeds a very important requirement: The need for older programs to be brought up to leading-edge technology. It does this by combining Intel’s very latest and very best workstation processor Xeon E3 has been added, plus a rich array of high- and low-speed I/O including multiple 10GigE ports.

General Micro Systems Rancho Cucamonga, CA (909) 980-4863

...and the Runners Up 3U OpenVPX Module Marries Xeon-D and FPGA Processing Mercury Systems’ OpenVPX Ensemble LDS3506 processing module seamlessly integrates the Intel Xeon processor D system-on-a-chip (SoC) product family ( formerly codenamed “Broadwell DE”) with Xilinx’s powerful Ultrascale FPGA in a SWaP-constrained 3U package (Figure 2). This dense union of best available commercial-item general processing and FPGA resources produces a highly versatile, affordable and interoperable building block for embedded, high-performance computing applications with additional low-latency mission or secure processing requirements.

With over 256 peak GFLOPS of general processing power from the Intel processor alone, the board is suited for applications such as electronic warfare (EW), electro-optical/infrared (EO/IR), image intelligence (IMINT) and other mission or sensor processing applications. The LDS3506 provides x4 Gen3 PCIe connectivity across the data plane via Xilinx’s FPGA device, with multiple DMA-enabled non-transparent bridge (NTB) interfaces, giving users the versatility needed to construct powerful processing subsystems quickly.

The module’s latest Xilinx FPGA hosts Mercury’s Protocol Offload Engine Technology (POET) to give each module the ability to refresh its mission capability, provide information assurance abilities, or even refresh or upgrade its switch fabric itself without affecting any hardware.

Figure 2 The Ensemble LDS3506 processing module integrates the Intel Xeon processor D SoC product family with an Ultrascale FPGA in a SWaP-constrained 3U OpenVPX package.

Mercury Systems, Chelmsford, MA (978) 967-1401 www.mrcy.com

3U OpenVPX Xeon E3-1505M V6 SBC Features Anti-Tamper and IA Support The SBC329 from Abaco Systems is a rugged 3U OpenVPX SBC designed as a straightforward, cost-effective ‘drop in’ technology insertion opportunity for existing users of Abaco’s mission ready systems (Figure 3). It offers a 10 percent performance improvement over its predecessors. This is the third SBC from Abaco to feature the latest 7th generation Intel Core technology (codenamed “Kaby Lake”). The SBC329 is configurable with the Intel Xeon E31505M V6 processor operating at 3.0 GHz. For applications prioritizing minimal power consumption/heat dissipation, the Intel Xeon E3-1505L operating at 2.2 GHz is available.

The SBC329 provides enhanced support for customers planning to implement advanced security capabilities such as anti-tamper and information assurance. This includes an inherently secure FPGA solution, and support for Intel’s Trusted Execution Technology. It also benefits from its support for Abaco’s AXIS Advanced Multiprocessor Integrated Software development environment. AXIS enables the rapid creation and testing of sophisticated HPEC applications. The SBC329 supports a comprehensive range of onboard I/O features. It also offers an on-board mezzanine expansion site for enhanced system flexibility. Memory resources include 16 Gbytes of DDR4 SDRAM, up to 32 Gbytes of NAND Flash (SSD), 32 Mbytes of BIOS flash and 16 Mbytes BIOS backup flash.

Figure 3 The SBC329 is a rugged 3U OpenVPX SBC with the Intel Xeon E3-1505M V6 processor operating at 3.0 GHz.

Abaco Systems, Huntsville, AL (866) 652-2226 www.abaco.com

COTS Journal | March 2017

19

Check Out These High-Performance SBC Products Too… Aitech Defense Systems offers the C535 Typhoon is based on Jetson TX1 SoM, which combines a powerful ARM Quad-Core CPU with the advanced NVIDIA Maxwell GPU. The 3U VPX board provides 60 GLFOPS/W performance.

Aitech Defense Systems Chatsworth, CA (888) 248-3248 www.rugged.com

Curtiss-Wright Defense Solutions is updating it rugged modules, the 3U OpenVPX VPX3-1220 and XMC-121 XMC processor mezzanine card to feature Intel’s latest low-power EL-1505L v6 Xeon processor in the same low-power 25 Watt footprint as the earlier Xeon SBCs. Curtiss-Wright Defense Solutions Ashburn, VA (703) 779-7800 www.curtisswrightds.com

The AM G6x/msd from Concurrent Technologies is a double AdvancedMC module based on the latest generation of Intel Xeon processor E3 v6 family. The board is suitable for high-speed physics experiments, instrumentation and test based applications.

Concurrent Technologies Woburn, MA (781) 933-5900 www.gocct.com

The XPedite7674 from Extreme Engineering is an Intel Xeon D-1500 family processor-based 3U VPX SBC that can support up to 16 core-count SKUs with native extended temperature support on up to 12 core-count SKUs. Extreme Engineering Solutions Middleton, WI (608) 833-1155. www.xes-inc.com

Interface Concept’s IC-INT-VPX3d/e is an OpenVPX 3U SBC based on the Xeon-D Broadwell-DE processor. It also provides a Kintex-7 FPGA, 2 banks of DDR4 DRAM with ECC (up to 8 Gbytes per bank) and a SATA NAND SSD (up to 16 Gbytes).

Interface Concept Quimper, France. +33 (0)2 98 57 30 30 www.interfaceconcept.com

The VX3058 from Kontron is a 3U VPX blade is based on the highly integrated 8-core Intel Xeon D architecture, supporting Dual 10 Gbit Ethernet, high bandwidth PCI Express 3.0, and high speed DDR4 memory.

Kontron America Poway, CA (858) 677-0877 www.kontron.com

Rough & Ready Data Storage AS9100 Rev C/ISO 9001: 2008 Certified Phoenix-developed state-of-the-art enabling technology provides users with products that ensure the highest performance storage and data network systems. These systems range in size and application from multi-terabyte Fibre Channel RAID, NAS and Storage Area Network (SAN) configurations to conduction cooled plug-in Open VPX solid state disk storage modules.

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COTS Journal | March 2017

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Aitech Defense Systems, Inc. 19756 Prairie Street Chatsworth, CA 91311 email: sales@rugged.com Toll Free: 888-Aitech8 - (888) 248-3248 Fax: (818) 407-1502 www.rugged.com

SYSTEM DEVELOPMENT Annual Obsolescence Services Directory

DMSMS Experts Help Navigate Consumer Electronics Dominance Military system developers are forever racing to keep pace with the consumer-driven IC market. Thankfully a mix of distributors, engineering firms and government groups can help ease the pain.

Jeff Child, Editor-in-Chief

D

iminishing Manufacturing Sources and Material Shortages (DMSMS) is a problem that the defense industry will likely never escape. That’s because the long development cycles in the defense world are way out of synch with the consumer semiconductor market. And with the volumes so much less in the military, the semiconductor vendors naturally orient everything they do toward big markets like smart phones, computers and a myriad other consumer electronic products.

Listed on the following three pages of COTS Journal’s 18th Annual Obsolescence Services Directory are a robust group of companies and organizations that are in the business of dealing with such problems.

Among them aftermarket chip suppliers who stock inventories of devices that have gone obsolete. Some are large distributors who include aftermarket products in their portfolio, while others are small firms specializing in aftermarket business.

Also in the directory are packaging firms who do custom assembly of obsolete integrated circuits using existing wafer and die. And going a step further there are engineering labs with expertise in remaking the obsolete die and fabricating it on a more current process geometry. Meanwhile there are government groups like the Defense Microelectronics Activity (DMEA) and the

22

COTS Journal | March 2017

Government-Industry Data Exchange Program (GIDEP) that provide comprehensive support beyond what business entities can provide.

The DMEA’s obsolescence management services involve continual active monitoring of a system’s parts to stay ahead of the obsolescence curve and to plan ahead for mitigation activities. These options range from component replacement to board or system upgrades with advanced technology.

The latter options create opportunities for multi-symptom resolution and truly transformational alternatives. DMEA’s engineers are specialists, and our facilities are state of the art. They can produce, on demand, microelectronic parts for all weapons systems.

For its part, the DMEA has evolved over the years as the nature of DMSMS has changed. Originally a small unit in the Engineering Division of the Sacramento Air Logistics Center at McClellan Air Force Base near Silicon Valley, in the 1997 the group was given the name it has today—Defense Microelectronics Activity—and taken out of the administrative structure of the Air Force and put within the Office of the Secretary of Defense. The U.S. Secretary of Defense at the time Dr. William Perry—the father of the COTS movement—declared the specialized group of engineers and facilities to be a unique national resource. And the DMEA

Figure 1 With today’s electronics changing so fast, even the production model of a modern fighter like F-35 couldn’t be delivered today without dealing with DMS issues.

was made the U.S. government’s official authority on microelectronics obsolescence.

According the DMEA, Diminishing Manufacturing Sources (DMS) activities in electronics once meant supporting obsolete parts in mature systems, such as the B-52 that will be in service 94 years before being retired. Fast forward to today and the accelerating rate of change means that even the production model of the F-22 or F-35 couldn’t be delivered without solving DMS issues (Figure 1).

SYSTEM DEVELOPMENT Company/ Organization

Contact

Category

Description

Arrow Electronics

Centennial, CO (303) 600-1200 www.arrow.com/en/arrow-services/end-of-life

O, S

Arrow has purchased hundreds of millions of dollars in obsolete finished goods and die. Customers with ongoing demand for parts after the component manufacturer has discontinued production can order pedigree, factory-direct parts directly from Arrow.

Artisan Technology Group

Champaign, IL (888) 887-6872 www.artisantg.com

B, L, O

Provides solutions that allow customers the ability to maintain and extend the life of their critical industrial, commercial and military systems beyond obsolescence.

Artisan’s experienced engineers and tens of thousands of items ready to ship allow us to offer qualified products with superior service and support

Avnet

Phoenix, AZ (480) 643-2000 www.avnet.com

DB, E, L, O, P, R, S

Avnet’s supply chain experts can help customers assess supply chain health and manage future expansion. They can maximize your supply chain and keep products in the market longer with Avnet’s comprehensive supply chain portfolio and global scale.

Center for Advanced Life Cycle Engineering (CALCE)

College Park, MD (301) 405-5323 www.enme.umd.edu/ESCML

B, DB, R, S

The Electronics Systems Cost Modeling Laboratory (ESCML) at the University of Maryland develops modeling methodologies and tools that address all aspects of the lifecycle cost of electronic systems from hardware fabrication and software development through sustainment and end of life.

DMEA

McClellan Park, CA (916) 231-1555 www.dmea.osd.mil

B, E, F, G, P

The DMEA operates a sophisticated design, prototyping, and testing facility supported by a team of more than a hundred advanced technology specialists. DMEA operates under the authority of the Undersecretary of Defense for Acquisition, Technology & Logistics in the Department of Defense.

DPA Components International

Simi Valley, CA (805) 581-9200 www.dpaci.com

D, P, S

DPACI is DLAM qualified, DMEA Trusted Source to provide Turn-Key EEE Parts Solutions with QML Q (military) and V (space) level manufacturing in accordance with MIL-PRF-38535. The standard manufacturing product DPACI offer is listed in the QML Memory Products section of this web site. DPACI is also DLAM certified for Mil-Std-883 and Mil-Std-750 Test Lab Suitability and a DMEA Trusted Source.

e2v aerospace and defense

Milpitas, CA (408) 737-0992 www.e2v.com

DB, D, E, F, R

e2v’s Semiconductor Lifecycle Management (SLiM) proactive planning program offers long-term continuity of supply for critical semiconductor components through wafer banking and accredited final manufacture, backed by redesign and reengineering capabilities.

Electronic Expediters

Camarillo, CA (805) 987-7171 www.expediters.com

O

Independent distributor of electronic components. Provides them with difficult-tofind or obsolete parts Method of processing, identifying, and warehousing surplus inventory is taken with extreme care for all components with many components remain untouched and sealed in their original factory packaging.

Falcon Electronics

Commack, NY (800) 444-4744 www.falconelec.com

L, O, S

Authorized/Franchised Distributor to the avionics, military and space industry. Falcon’s line card showcases superior, high-reliability product lines from the industry’s top manufacturers, all with long-term Mil-Aero strategies, reducing the possibility of obsolescence.

GDCA

Livermore, CA (925) 456-9900 www.gdca.com

B, R, E, O

A specialist in COTS obsolescence management, GDCA is authorized by our OEM partners to continue to manufacture and repair the embedded legacy products critical to long-lasting applications. Using OEM-authorized IP and original specifications, GDCA provides repair, long-term customer support, manufacturing, and sustainment for over three thousand End-of-Life, COTS, and custom-embedded computer boards and systems.

GIDEP

Corona, CA (951) 898-3207 www.gidep.org

DB, G, R

GIDEP (Government-Industry Data Exchange Program) is a cooperative activity between government and industry participants seeking to reduce or eliminate expenditures of resources by sharing technical information. Since GIDEP’s inception, participants have reported over $2.1 billion in prevention of unplanned expenditures.

IEC/IECQ

Sydney, Australia +61-2-4628-4690 www.iecq.org

R

The IECQ is a worldwide approval and certification system covering the supply of electronic components and associated materials and assemblies (including modules) and processes. It uses quality assessment specifications that are based on International Standards prepared by the International Electrotechnical Commission (IEC).

IHS

Englewood, CO (303) 790-0600 www.IHS.com

DB, L

IHS Supply Management solutions can help reduce costs through more strategic and informed purchasing decisions. Offers objective, defensible analysis, in-depth industry and economic expertise, proven methodologies and vast proprietary databases—including 500,000+ historic prices and 4,000+ forecasts, costs, and wages.

Innovasic

Albuquerque, NM. (505) 883-5263. www.innovasic.com

E

Produces silicon and software solutions for customers with long product life-cycles.

Supplies extended-life processors, peripherals, ASICs and mixed-signal devices for embedded communication and control. Solves obsolescence problems by developing pin-compatible integrated circuits that have been discontinued by the original manufacturer.

Inventory Locator Service (ILS)

Memphis, TN. (901) 794-5000. www.ilsmart.com

DB, L

Inventory Locator Service enables subscribers in the aerospace, defense and marine industries to buy and sell parts, equipment and services. Over 85 million line items of available inventory, 75,000 customer accesses each day, and 23,000+ members.

Lansdale Semiconductor

Phoenix, AZ (602) 438-0123. www.lansdale.com

D, E, O, P

Leading supplier of “semiconductor aftermarket” ICs. Extends product’s life cycle by manufacturing electronic components that the original manufacturers no longer produce. Licensed to manufacture and market thousands of ICs originally designed and previously produced by AMD, Fairchild, Freescale, Harris, Intel, National, Philips and Raytheon.

Micross Components

Orlando, FL. (407) 298-7100. www.micross.com

B, DB, D, L, P, R

One-source, one-solution provider of bare die & wafers, advanced interconnect technology, custom packaging & assembly, component modification services, electrical & environmental testing and standard products to manufacturers and users of semiconductor devices.

NAPCO

Hopkins, MN (952) 931-2400 www.napcointl.com

R

A material manager, procurement, distribution and light manufacturing supplier of military spare and repair parts for a wide range of military vehicles and electronic equipment to the U.S. Department of Defense, OEMs and over 20 countries around the world.

Company/ Organization

Contact

Category

Description COTS Journal | March 2017

23

SYSTEM DEVELOPMENT

Now Electronics

Huntington, NY (631) 351-8300 www.nowelectro.com

L, O, P

Distributor specializing in military and aerospace level components. An approved supplier to Lockheed-Martin, Northrop-Grumman, Raytheon, Boeing Sanmina-SCI Systems, the U.S. Defense Dept., NATO and many others.

Phoenix Logistics

Tempe, AZ (602) 231-8616 www.phxlogistics.com

E, O

Provider of engineering, manufacturing, information technology, and logistics & supply chain services to the defense, aerospace, and industrial markets. Serves the warehousing and logistics needs of government customers with strategically located facilities in Mesa, Arizona and Orlando, Florida.

Pikes Peak Test Labs

Colorado Springs, CO (719) 596-0802 www.pptli.com

B, D, E, L, O, P, S

Lab experienced in SEM (Scanning Electron Microscopy) with Elemental Analysis (EDX) capabilities, electronic component upgrade screening to MIL-STD-883, Class B, lid torque, radiation hardness testing and evaluation. Offers in-house services to assist in determining whether your components are genuine or potentially counterfeit.

Rochester Electronics

Newburyport, MA (978) 462-9332 www.rocelec.com

D, F, O, P, R

Offers comprehensive solutions for mature and end-of-life semiconductors. Rochester works with customers to help turn End-of-Life problems into Extension-of-Life solutions to provide the semiconductor industry with an authorized, guaranteed source of supply for long-lifecycle applications. Manufacturer dedicated to ongoing support of critically needed semiconductors for the entire lifecycle.

SRI International

Princeton, NJ (609)-734-3245 www.gemes.com

B, E, F, R, P

The Generalized Emulation of Microcircuits (GEM) technology uses a set of gate arrays and single line processing technology. Advanced Microcircuit Emulation (AME) Enrichment may be used to provide Form, Fit, and Function (FFF) solutions at the digital component level for logic devices, ASICs, FPGAs, static memory devices, hybrids, microprocessors, and microcontrollers.

NSWC Corona Division

Corona, CA (951) 273-4209 www.navsea.navy.mil/Home/Warfare-Centers/NSWCCorona/What-We-Do/Readiness-Assessment-Department

B, G

The Acquisition and Readiness Assessment (AR) Department serves as the Navy’s Independent Assessment agent to assure disciplined application of systems engineering, risk management, quality, and management principles for development, production, and sustainment of defense systems.

Total Parts Plus

Fort Walton Beach, FL (877) 912-7278 www.totalpartsplus.com

DB

Provider of parts data content for product environmental compliance and lifecycle management. TPP’s data collection and validation services along with suite of software tools and applications provide a comprehensive solution for data analysis and compliance reporting.

Abbreviation

Categories

Explanation

B

Board level

Solves board-level DMS problems (as opposed to componentlevel problems).

DB

Database

Provides a database covering topics such as alternate sources, devices that are obsolete, cross-references or uprating results.

D

Die processor

Refers to processing OEM die, not an emulated solution.

E

Emulation/reverse engineering

Vendor may emulate a DMS device in a gate array or full-custom device, or provide a pseudo-form, fit and functional equivalent.

F

Foundry

Has foundry capability to fabricate wafers.

G

Government agency

–

L

Locator

The vendor provides a service to locate DMS components and boards/systems.

O

Obsolete inventory

Maintains OEM inventory in die or packaged form.

P

Specialty packaging

Packages components as monolithic or multi-chip modules.

R

Industry reference

Denotes an organization or company with widely recognized knowledge or information concerning the DMS industry.

S

Uprating/upscreening

Performs uprating or upscreening.

24

COTS Journal | March 2017

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DATA SHEET FPGA Processing Boards Roundup

FPGA Boards Step Up Their Processing Game By embedding the latest FPGA ICs, module vendors can provide more compute muscle and digital conversion capabilities on their FPGA processing board products.

Jeff Child, Editor-in-Chief

T

oday FPGAs have hands down become the main engine for digital signal processing in military system designs. The kind of signal processing functionality on today’s FPGA chips are ideally suited to the kind of system-oriented DSP functions used in defense. And signal processing capabilities of FPGAs continue to climb satisfying those applications for whom an appetite for ever more processing muscle is endless. Today FPGAs have even become complete systems on a chip. The high-end lines of the major FPGA vendors have general-purpose CPU cores on them. And the military is hungry to use FPGAs to fill processing roles.

FPGAs have now evolved to the point that calling them “systems-on-chips” is redundant.

It’s now simply a given that the high-end lines of the major FPGA vendors have general-purpose CPU cores on them. And the military now routinely uses FPGAs to fill processing roles. Moreover, the flavor of signal processing functionality on today’s FPGA chips are ideally suited to the kind of system-oriented DSP functions used in defense. The signal processing capabilities of FPGAs continue to climb feeding applications like radar and SIGINT for whom an appetite for ever more processing muscle is endless.

Aside from processing, another big advantage of FPGAs lies in their ample, programmable, high-speed I/O, which is why they are often found close to the analog-to-digital converters (ADC) behind radar phased arrays. Board level 26

COTS Journal | March 2017

Figure 1 AESA radar systems are used on board military aircraft like the EA-18G Growler to broadcast strong radar signals while remaining undetected. vendors continue to roll out integrated solutions using the latest greats ADCs and DACs tied with FPGA processing.

Digital conversation requires the marriage of those two key technologies ADCs and FPGAs. The trend has to been to do that digital conversion as soon along the signal chain as possible.

High-bandwidth A/D converters with high sampling rates must connect to extremely fast data transfer paths to store and process data with triggering or gating circuitry to digitize pulse waveforms at precisely the right time. With that in mind, board vendors continue to push the barriers with solutions with ever faster ADCs and more sophisticated FPGAs. A number of

digital receiver products combine ADCs and FPGAs on one VME, VPX, or PCI Express board, while others partition the integrate an FPGA processing engine with mezzanine-based ADCs using form-factors like FMC or XMC. FPGA products such as the Xilinx Virtex-6 and -7 and the Altera Stratix IV and V are examples that have redefined an FPGA as a complete processing engine in its own right. And newer FPGA families like Xilinx’s UltraScale Kintex 7 and Artix 7 and Altera’s Arria 10 and Stratix 10 FPGAs are this year dominating the latest crop of embedded board-level products. The Data Sheet roundup on the next couple pages shows several examples of board and module products using those advanced FPGA chips.

System developers depend on FPGA chips and boards to build radar receiver systems with a higher instantaneous bandwidth and can handle the corresponding increase in compute power required to process the received data streams. FPGAs have replaced ASIC-based radar design approaches that lacked the flexibility inherent in designs based on FPGA technology. An example military technology that relies heavily on FPGA processing is advanced active electronically scanned array (AESA) radar systems. AESA radar systems create highly adaptive steerable beams able to track multiple targets or focus electromagnetic energy in one location. These systems are used on board military aircraft like the EA-18G Growler (Figure 1) to broadcast strong radar signals while remaining undetected.

DATA SHEET

FPGA Processing Boards Roundup

3U VPX FMC+ Carrier Serves up Kintex/Virtex Ultrascale FPGAs

I/O Platform Features Reconfigurable Xilinx Artix-7 FPGA Module

PCI Express Card Blends UltraScale FPGA and Rich I/O

The latest expansion of Abaco Systems’ 4DSP advanced RF and DSP product line is the 3U VPX VP880. It is an FMC+ (VITA 57) FPGA carrier featuring Xilinx UltraScale FPGA and Zynq UltraScale+ multiprocessor system-on-chip (MPSoC) technology. It also features 10 Gbytes of onboard memory— around twice that typically available on alternative products. The VP880 is designed for applications such as electronic warfare/ DRFM, radar/sonar image processing, satellite communications systems, and advanced digital beamforming.

Acromag's APA7-200 series provides a user-customizable FPGA on an AcroPack mezzanine module. The module plugs into a connector on an AcroPack carrier to add up to 48 TTL or 24 EIA-485/422 I/O signals or a mix of both types. Mix and match I/O combinations in a single slot for embedded applications. The APA7-200 offers a wide operating range of -40 to 85 degrees C. Reconfiguration of the FPGA is possible via a direct download into the flash configuration memory over the PCIe bus.

The ADM-PCIE-8K5 from Alpha Data is a half-length, low profile, PCI Express Add-In Card featuring the Xilinx Kintex Ultrascale KU115-2 FPGA. The board features two independent channels of DDR4 memory capable of 2400 MT/s, dual SFP+ cages providing 2x 10GbE/16G Fiber Channel (Gen 5) capability. Dual Firefly connectors deliver up to 4x16 Gbps per connector.

• 3U VPX FMC+ (VITA 57) FPGA carrier.

• Xilinx UltraScale FPGA and Zynq UltraScale+ multiprocessor system-onchip (MPSoC).

• 8 GB of DDR4 DRAM mapped to FPGA; 2GB of DDR4 DRAM mapped to Zynq.

• 1x HSPC/FMC+ site for Analog or Digital Input/Output.

• Backplane options: VITA 67.1 and VITA 67.2 analog interface ports; VITA 66.4 Optical Interface via Firefly BLAST site.

• Air, Conduction cooling (optional).

Abaco Systems Huntsville, AL (866) 652-2226 www.abaco.com

• PCI Express Generation 1 interface • Reconfigurable Artix-7 FPGA. • Mix and match countless I/O combinations in a single slot.

• High channel count digital interface: RS485, LVDS and TTL interface options.

• 32 Mb quad serial Flash memory.

• 33,280 logic cells; 41,600 Flip flops; 1,800 kb block RAM; 90 DSP slices.

• Conduction-cooled options.

Acromag Wixom, MI. (248) 295-0310 www.acromag.com

• Half-Length, low profile x8 PCIe form factor.

• PCI Express Gen3 x8.

• Xilinx Kintex Ultrascale: XCKU115-2 FLVA1517E. • 2x banks of 8G x 72, DDR4-2400 DRAM. • On-board re-programmable flash memory for embedded configuration.

• Optional integrated Board Support Package (BSP) including extensive FPGA example designs, plug and play drivers, and a mature Application Programming Interface (API).

• CAPI Compliant.

Alpha Data Denver, CO (303) 954-8768 www.alpha-data.com

FIND the products featured in this section and more at

intelligentsystemssource.com

COTS Journal | March 2017

27

DATA SHEET

FPGA Processing Boards Roundup

PCI Express Board Blends Xilinx UltraScale+ FPGA, 256 Gbytes DRAM

3U VPX Xeon-D Boasts an Integrated Kintex UltraScale FPGA

PCIe XMC Module Sports 2 ADCs, 2 DACs and Artix-7 FPGA

The XUPP3R from BittWare is a 3/4-length PCIe board that supports PCIe Gen4 x8 or Gen3 x16 and offers four front panel QSFP28 cages, each supporting 4 lanes of up to 25 Gbps with support for 10/25/40/100 GbE. Four DIMM sockets support massive memory configurations including up to 256 Gbytes of memory across four 72-bit wide banks. Alternatively, each of those DIMM sockets can be populated with BittWare’s dual bank QDR DIMMs, each providing 576 Mbits of QDRII+. An optional Hybrid Memory Cube (HMC) module with 2 GB can be populated in addition to the DIMMs.

The XPedite7674 from Extreme Engineering is a high-performance, 3U VPX-REDI, multiprocessing, SBC featuring Intel Xeon D-1500 family processors coupled with the Xilinx Kintex UltraScale FPGA. The XPedite7674 integrates SecureCOTS technology with the Kintex UltraScale FPGA for hosting custom functions to protect data from being or observed and provides an ideal solution when stringent security capabilities are required.

The XA-160M from Innovative Integration is an XMC IO module featuring two 16-bit, 160 MSPS A/D channels and two 16-bit, 600 MSPS DAC channels designed for high speed stimulus-response and servo control applications. Data acquisition control, signal processing, buffering, and system interface functions are implemented in a Xilinx Artix-7 FPGA device. Two 256Mx16 memories provide data buffering and FPGA computing memory.

• Xilinx Virtex UltraScale+ FPGA. • Up to two PCIe x16 interfaces supporting Gen1, Gen2, or Gen3.

• Up to two PCIe x8 interfaces supporting Gen4.

• Four QSFP28 cages for 1x 400GbE, 4x 100GbE, 4x 40GbE, 16x 25GbE, or 16x 10GbE. • Up to 256 GB of DDR4 SDRAM with ECC; Up to 288 MB of QDR-II+ SRAM. BittWare Concord, NH (603) 226-0404 www.bittware.com

FIND the products featured in this section and more at

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28

COTS Journal | March 2017

• Supports Intel Xeon D-1500 family processors ( formerly Broadwell-DE).

• Designed with SecureCOTS technology to support enhanced security and trusted computing.

• Xilinx Kintex UltraScale XCKU060 or XCKU095 FPGA with up to 8 GB DDR4-2133 ECC SDRAM and 1 Gb synchronous configuration BPI flash.

• 3U VPX (VITA 46) module; Compatible with multiple VITA 65 OpenVPX slot profiles.

• Up to 16 GB of DDR4 SDRAM in two channels; Up to 32 GB of SLC NAND flash.

Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com

• Two 160 MSPS, 16-bit ADC channels; Two 615 MSPS, 16-bit DAC channels.

• 89 dB SFDR, 72 dBFS SNR A/Ds; 73 dB SFDR, 68 dBFS SNR D/As. • Xilinx Artix-7 FPGA. • DDR3 Memory.

• Programmable or external sample clock.

• PCI Express 2.0 XMC Module (75x150 mm).

• Use in any PCI Express desktop, compact PCI/PXI, PXIe, or cabled PCI Express application.

Innovative Integration Simi Valley, CA (805) 578-4260 www.innovative-dsp.com

DATA SHEET

FPGA PROCESSING BOARDS ROUNDUP

Links to the full data sheets for each of these products are posted on the online version of this section.

6U OpenVPX Board Marries QorIQ and Dual Virtex-7 FPGAs

Configurable 3U OpenVPX Rx/Tx Board Offers Ultra-Low Latency

FPGA Accelerator Card Features Altera Arria 10 SoC FPGA

Interface Concept’s IC-FEP-VPX6b board is controlled by a QorIQ T1042 quadcore supporting four integrated 64bit e5500 Power Architecture processor cores with high-performance data path acceleration architecture (DPAA) and network peripheral interfaces required for demanding processing applications.

The board’s two FPGAs are directly interconnected via 8 GTH lanes and 35 LVDS signals.

Mercury’s Ensemble RFM-4R2G-2T3GKU is a versatile OpenVPX Rx/Tx module packaged in an efficient 3U form-factor.

These modules are designed for use in ultra-low latency transceivers/ DRFMs, GSPS receivers and GSPS AWGs (Arbitrary Waveform Generator) applications within the EW (EP and EA), ultra-wideband comms and SAR domains. Performance of the RFM-4R2G-2T3G-KU is derived from its 12-bit TI (ADC12D2000RF) powered ADC frontend and the processing power of the Kintex UltraScale KU115 FPGA. Both elements represent the most contemporary technology available.

Nallatech’s 385A-SoC low profile System on Chip SoC FPGA accelerator card provides a powerful computing and I/O platform for SoC FPGA and ARM-based development and deployment across a range of application areas including High Performance Computing, Image Processing and Network Analytics. The OpenCLprogrammable 385A-SoC is an 8-lane PCIe Gen 3 card featuring an Altera Arria 10 SoC FPGA and DDR4 SDRAM external memory.

• QorIQ processor T1042, e5500 quad core.

• Up to 4 Gbytes of DDR3L SDRAM with ECC. • VPX 6U / 4HP 1” board compliant with 6U module definitions of the VITA 46.0 standard.

• Available in air-cooled and conductioncooled grades.

• Two Xilinx Virtex-7 XC7VX690T FPGAs. • 4 PCIe x4 ports; GTH ports; General purpose I/Os; 3 QorIQ Serdes; 4 Ethernet ports; 1 RS485/RS232 port; 2 USB 2.0 ports; FMC links.

Interface Concept Quimper, France. +33 (0)2 98 57 30 30. www.interfaceconcept.com

• Multi-channel, highly configurable Rx/ Tx module.

• Coherent and spectrally pure for EW applications.

• Kintex UltraScale FPGA processing power.

• Low-latency ADC and DAC performance.

• Multi-channel/Multi-card synchronization.

• Built-in IPMI controller.

Mercury Systems Chelmsford, MA (866) 627-6951. www.mrcy.com.

• Altera Arria 10 SX F34 package.

• Dual 10G QSFP Ports.

• NIC Form Factor.

• 2 Banks 4G DDR4 SDRAM. • 8-Lane PCI-Express Gen 3.

• Active cooling / passive cooling available upon request.

• 1/2 height, 1/2 length, single width PCIe card (NIC size).

• Altera Quartus Software Development Kit Edition w/ OpenCL SDK. Nallatech Camarillo, CA (805) 383-8997 www.nallatech.com

FIND the products featured in this section and more at

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COTS Journal | March 2017

29

DATA SHEET

FPGA Processing Boards Roundup

XMC Provides 200 MHz 16-bit ADCs and Kintex Ultrascale FPGA

Virtex-7 FPGA PCIe Card Provides Complete IF-to-DMA Path

AMC Board Sports Virtex UltraScale FPGA and 8 GB of DRAM

The Model 71131 from Pentek is a member of the Jade family of highperformance data converter XMC modules based on the Xilinx Kintex Ultrascale FPGA. is an eight-channel, 250 MHz XMC module featuring 16-bit A/Ds with programmable multiband digital down converters (DDCs).

The Model 71131 is suitable for connection to HF or IF ports of a communications or radar system. Its built-in data capture feature offers an ideal turnkey solution as well as a platform for developing and deploying custom FPGA-processing IP.

The PVP card family from Star Communications combine a multichannel digital receiver with up to four FPGA processing elements, on a standard PCI Express card. When installed in a customer's host computer system, a PVP card provides a complete IF-to-DMA path for receiving wireless signals, processing them in an FPGA, and sending results to the host computer system via PCI Express.

A PVP card has 1 to 4 input channels, which are routed to each FPGA on the card.

Vadatech’s AMC596 board is based on the Virtex UltraScale XCVU440 FPGA in FLGA2892 package with an on board Power PC P2040. The FPGA is supported by 8 Gbytes of 64-bit wide DDR4 and an on-board Power PC P2040. The additional connectivity provided by PinoutPlus—over 250 Gbps between neighboring modules— makes the product ideal for ASIC emulation and demanding sensor processing applications.

• Complete radar and software radio interface solution.

• Supports Xilinx Kintex Ultrascale FPGAs. • Three 200 MHz 16-bit A/Ds. • Three multiband DDCs (digital downconverters).

• One DUC (digital upconverter).

• Two 800 MHz 16-bit D/As. 5 GB of DDR4 SDRAM. • Ruggedized and conduction-cooled versions available.

Pentek Upper Saddle River, NJ (201) 818-5900 www.pentek.com

FIND the products featured in this section and more at

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30

COTS Journal | March 2017

• Up to four high-end Virtex-7 FPGAs (XC7VX485T).

• PCI Express card 6.6- x 4.4- x 0.8-inches.

• Weighs less than 11 ounces.

• 50-125 Watts, depending on the number of FPGAs selected.

• 1 to 4 input channels, which are routed to each FPGA on the card.

• Provides a complete IF-to-DMA path.

• Onboard sample clock generation.

Star Communications Vienna, VA (703) 254-5860 www.starcommva.com

• Xilinx Ultra Scale XCVU440 w/ QorIQ PPC2040.

• 8 GB of DDR-4 (single bank of 64-bits).

• 20 SERDES lanes optionally routed to Tongue 2.

• Ideal for ASIC prototyping/emulation.

• Compliant to the AMC.1, AMC.2, AMC.3 and/orAMC.4 specification.

• Clock jitter cleaner.

• Single module, mid-size AMC ( full-size optional).

Vadatech Henderson, NV (702) 896-3337 www.vadatech.com

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COTS

FIND the products featured in this section and more at

PRODUCTS

intelligentsystemssource.com

System Allows High-Quality Digital Radar Data Manipulation Cambridge Pixel has announced RadarVision, a plug and play system which converts radar data into camera-like data stream to display on any security video management system (VMS). Additionally, the radar images displayed alongside the camera images can be zoomed and panned using an on-screen or physical joystick with the PELCO-D interface from the VMS. It is compatible with a wide range of security, maritime and specialist radars. The unit can enhance the radar information by integrating new information to it and display the final output to regular video unit. Radar video signals are input via an acquisition card, as ASTERIX CAT-240 network data or in proprietary formats. The data is then scan converted into a plan image and output as a H.264 (RTSP packaged) network video stream that feeds directly into the VMS to be viewed alongside data from traditional daylight and thermal cameras.

Traditionally, radar signals are displayed in relatively low resolution and the data cannot be modified or manipulated.

The new approach allows data to be more versatile and useful.

Most important of all, the system allows can integrate the radar information other data. For example, maps can be displayed with

radar signal on top with manipulation. The unit is available as either software-only version or a complete software /hardware solution and is commonly used in mission critical applications such as naval, vessel traffic, air traffic control, commercial shipping and airborne radar.

Cambridge Pixel Cambridge, UK +44 (0) 1763 852749 www.cambridgepixel.com

Skylake-S Processorbased SBC Features 32 Gbyte of DDR4 DRAM

Universal Generic Platform Enables Rapid FPGA Prototyping

WIN Enterprises has announced the MB-83940, a single board computer based on the 6th Gen Intel Core processor-based ( formerly code-named the Intel Skylake-S 13/15/17). Gen 9 Graphics, Integrated Intel Iris Pro GT4e graphic engine is used to support 3 active displays with one HDMI/ 4K (4096 x 2304 resolution) with 15W audio. Two DDR4 memory modules deliver up to 32 Gbytes with 2 Mbytes of nonvolatile MRAM (up to 16 Mbytes). 2x GbE LAN I/O is available for networking. Dual BIOS and security boot support are built-in. The unit is compliant with the gaming/casino GLI standards.

Hitex has created Tanto3—a universal generic platform which can be used for rapid FPGA prototyping. Tanto3 can be modified to the user’s needs by simple programming and is ideal for test applications, signal and bus analysis, debugging and programming as well as FPGA development. The platform is equipped with high-speed communication interfaces (USB3.0, Gigabit Ethernet) and a 3,5 inch TFT color touch screen. The fanless passive cooled system with its Cyclone V SoC control processor, a 1GB DDR3 RAM, a powerful Stratix V and 24 Mbytes of SSRAM can be configured and used for sophisticated designs.

Applications requiring fast I/O access with complex processing power can be hosted on the FPGA and thus make the design more efficient.

WIN Enterprises North Andover, MA (978) 688-2000 www.win-ent.com

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COTS Journal | March 2017

Hitex Karlsruhe, Germany +49 721 9628-0 www.hitex.com

COTS PRODUCTS

Solderless Socket for NXP's BGA141 Supports 75 GHz Ironwood Electronics has announced the 75 GHz Socket for NXP's BGA141. The GT-BGA-2061 socket has less than 1dB of insertion loss and can be directly mounted on the target PCB without soldering. It supports 10x10 mm package size and other passive components can be placed on the back side of PCB making it very real-estate friendly overall. Using compression screw and adding axial flow fan, the socket can be customized to work with packages up to 100 W with modified fin design on top of the screw.

The contact resistance is typically 30 milliohms per pin and the 131BGA is 0.65mm pitch 13x13 array. The socket is constructed with a swivel lid to facilitate quick insertion and removal of IC by applying downward pressure with the turning of the compression screw. The socket is made of low inductance elastomer contactor and supports temperature range from -55 to +160 degrees C. Quantity 1 pricing is $623.

Ironwood Electronics Eagan, MN (800) 404-0204 www.ironwoodelectronics.com

3U MicroTCA Chassis Accommodates AMC.1, AMC.2 and AMC.4 Vadatech has announced the VT884, a 3U 12-slot MicroTCA chassis that accommodates AMC.1 (ports 4 to 11), AMC.2 (ports 0 and 1) and AMC.3 (ports 2 and 3 are routed to adjacent slots). Additionally, it complies with the PICMG 3.0 Rev 3.0 and Module Management IPMI Version 2.0. The processors include fully populated High-end Virtex UltraScale XCVU440 (Xilinx), while the Extended Options and PinoutPlus can be used to support tightly-coupled networks of FPGAs. Operating temperatures are from -5 to 55 degrees C while the relative humidity 5 to 95 percent (non-condensing). Three 1100 W power supplies operate from 110-240 VAC (47-63Hz) or -36V to -75V (DC).

Vadatech Henderson, NV (702) 896-3337 www.vadatech.com

Atom E3900-based Qseven 2.1 Module Provides IC-Level Security Portwell Technology has announced the Intel Atom E3900 series-based, PQ7-M108, Qseven 2.1 module. The E3900 series integrates the Gen 9 graphics with four vector image processing units and the Time Coordinated Computing (TCC) Technology to synchronize connected devices within a microsecond. Additionally, the unit is designed with security at the chip level by using Infineon’s OPTIGA TRUST IC to prevent unauthorized parties from re-use or re-provisioning of the original parts.

Up to 8 Gbytes of LPDDR4 (2400MT/s) RAM and 64 Gbytes of eMMC5.0 are available on board. Five available Intel Apollo Lake processors can be selected with software support from Linux, Microsoft Windows 10, Windows IoT Core, Wind River VxWorks 7 and Android. Multimedia interfaces include dual-channel LVDS (up to 1920 x 1200 at60Hz), DDI option of either DisplayPort 1.2 (up to 4096 x 2160 pixels) or HDMI 1.4b (up to 3840 x 2160). I/O available include 3 x USB 3.0or 4x USB 2.0, 1x SDIO 3.0, 2x SATA 3, and up to 4x PCIe Gen2 lanes. Also, onboard are 1x I2C, 1x UART, HDA co-lay with I2S, 2x SPI, and a JTAG for debugging function. The module measures 70 x 70 mm and operates from 70 x 70 mm.

Its target market includes smart building control and Human Machine Interface (HMI) devices.

American Portwell Technology Fremont, CA (510) 403-3399 www.portwell.com

COTS Journal | March 2017

33

COTS PRODUCTS

Lowest Power Cost-Optimized FPGAs Sport 12.7G Transceivers Microsemi has announced its cost-optimized PolarFire FPGA product family, delivering low power, 500K logic elements and 12.7 Gbps Serializer/ Deserializer (SerDes) transceivers as well as best-in-class security and reliability. The devices are also well-suited to applications within the defense and aerospace market, such as encryption and root of trust, secure wireless communications, radar and electronic warfare (EW), aircraft networking, actuation and control. The 12.7 Gbps transceivers are fully optimized to be area efficient and low power, resulting in total power of less than 90 mWs at 10 Gbps. Standby power is 130 mWs at 25 degrees C, up to 50 percent lower Dawn’s PSC-6238 VITA power than competing FPGAs for the same 62 compliant 3U VPX Power application.

Supply for conduction Leveraging Microsemi’s expertise in security, PolarFire FPGAs offer Cryptography cooled systems is designed Research Incorporated (CRI) patented to operate in a military differential power analysis (DPA) environment over a wide bitstream protection, integrated physically range of temperatures unclonable function (PUF), 56 Kbytes of at high power levels. Up to secure embedded non-volatile memory (eNVM), built-in tamper detectors and 800 Watts available power. countermeasures, true random number generators, integrated Athena TeraFire Onboard embedded RuSH™ EXP5200B Crypto Co-processors (Suite B technology. Switchable Battleshort capable) and a CRI DPA countermeasures and NED functions. pass-through license.

The devices’ cost-optimized architecture uses 28 nanometer (nm) Silicon-OxideNitride-Oxide-Silicon (SONOS) nonvolatile process technology on standard complementary metal oxide semiconductor Dawn is the leader in VITA 62 (CMOS). PolarFire FPGAs also incorporate compliant power supplies for the transceiver performance optimized for mission critical market. Wide range of 12.7 Gbps enabling smaller size and lowest standard features, highly configurable power, hardened I/O gearing logic for through custom firmware. double date rate (DDR) memory and lowvoltage differential signaling (LVDS), high performance security IP and the industry’s only low cost mid-range device with clock Rugged, Reliable and You need it right. and data recovery (CDR) capable 1.6 Gbps Ready.

You want Dawn.

I/Os. Microsemi’s PolarFire FPGA product family is shipping to early access customers now and samples for general availability will be offered in the second quarter of 2017.

Dawn Powers VPX

Microsemi, Aliso Viejo CA (949) 380-6100. www.microsemi.com

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COTS Journal | March 2017

(510) 657-4444

dawnvme.com

A45_CotsJrnl_2-25x9_875_A45.qxd 1/23/17 3:20 P

COTS PRODUCTS

FMC Offers Four ADCs, Two DACs and High SNR Performance Innovative Integration has announced the FMC-SDF. The FMC-SDF FMC module features four 24-bit, ADCs and two, 18-bit DACs, each simultaneously-sampling and DC-accurate. These ultra-high resolution, sigmadelta devices support high dynamic range applications such as stimulus-response, ATE, and seismic data acquisition. Ultra-low jitter clock and trigger controls provide ultimate analog fidelity coupled with precisely framed acquisition and playback. Captures may be triggered via software or external LVCMOS edges.

The FMC-SDF power consumption is under 15 W for typical operation. The module may be conduction cooled using a VITA20 standard heat-spreader. The product may be conformal coated and ruggedized for wide-temperature operation from -40 to +85 degrees C operation and exposure to 0.1 g2/Hz vibration. Support logic in VHDL is provided for Innovative’s broad line of FPGA-accelerated FMC carriers. The Framework Logic package supports development under Xilinx Vivado using VHDL or HLS (highlevel synthesis). Additionally, the Matlab BSP within the Framework supports realtime hardware-in-the-loop development using the graphical block-diagram Simulink environment and Xilinx System Generator.

Innovative Integration Simi Valley, CA 805) 578-4260 www.innovative-dsp.com

100 to 10,000 VDC Output DC-DC CONVERTERS 4 Watt to 10 Watt Series

Surface Mount & Plug In Over 250 Standard Models!

Isolated Outputs/ Proportional V in and V out Miniature fully encpsulated modules for operation in rugged environment

Military options available Expanded operating temperature -55º to +85º C Ambient •

Military Standard 883 Selected testing available Will review all Customer Specifications for custom design specifications

100A Point-of-Load DC-DC Converter Supports PMBus TDK has announced the iJC series of POL (Point of Load) non-isolated DC-DC converters.

The 100A non-isolated DC-DC converter supports the PMBus which allows programmability of the iJC parameters and real-time, precision monitoring of voltage, current and temperature. When PMBus is not implemented, functional pins are available for development purpose. Additionally, GUI (Graphical User Interface) and evaluation boards are also available.

The iJC series operate from an 8 to 14VDC (input) and 0.6 to 1.5V (output) with a set point accuracy of 0.5 percent. Overall power module efficiency is 91.5 percent (typical) with a 1.5V output, 12V input and 80 percent loading. The unit measures 28mm x 35mm x 10mm weighs 20g. Maximum power output is 150W which translates into 66 Amps per cubic inch. Target applications include servers, routers, information & communication technology (ICT) equipment, semiconductor manufacturing equipment, test & measuring and other industrial equipment. The products are available through distributors worldwide.

TDK-Lambda Americas San Diego, CA (619) 628 2885 www.us.tdk-lambda.com/lp

Over 2,500 standard high and low voltage DC-DC converters and AC-DC power supplies Industrial/Cots/Military Isolated/Regulated/Proportional/ Programmable Also Thousands of Hi reliability, Ultra Miniature Transformers and Inductors US Manufactured since 1969

See PICO’s full line catalog on OUR EXCITING NEW WEBSITE

www.picoelectronics.com Featuring our easy-to-use product Search Wizard!

800-431-1064 PICO ELECTRONICS, Inc. 143 Sparks Ave., Pelham, New York 10803 Call Toll Free 800-431-1064 • FAX 914-738-8225

E Mail: info@picoelectronics.com

COTS Journal | March 2017

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COTS PRODUCTS

3U VPX H.265 Video Encoder Boasts Dual 3G-SDI Inputs EIZO Rugged Solutions has introduced a rugged 3U VPX H.265 High Efficiency Video Encoding (HEVC) video/audio encoder. The Condor VPX-H265-SDI features dual 3G-SDI inputs and support for CoT (Cursor on Target), KLV (Key Length Value), and VANC (vertical ancillary data) metadata insertion. The board is a H.265 (HEVC) or H.264 video encoding and streaming solution designed for harsh field environments. The Condor VPX-H265-SDI encodes and streams two 3G-SDI, HD-SDI, or SD-SDI inputs simultaneously using the highly versatile video coding standard H.265 (HEVC) which provides increased video quality and a 50 percent reduction in bitrate compared to H.264.

The H.265 encoding parameters are highly configurable with main profile support as well as variable and constant bitrate configurations (512 Kbps to 15+ Mbps). The board also supports CoT and KLV metadata insertion via RS-232 or Ethernet. The card also allows vertical ancillary data (VANC) to be streamed efficiently in non-picture regions of the frame. USB 3.0 with encoded data is also supported on the new VPX product for external recording to benign or rugged removable hard drives. The Condor VPX-H265-SDI is a MIL-STD-810G compliant card ruggedized too withstand vibration, shock, and humidity and support temperatures from -40 to 85 degrees C. EIZO Rugged Solutions Altamonte Springs, FL (407) 262-7100 www.eizorugged.com

QorIQ T208 PrXMC is Supported by Wind River VxWorks 653

Secure Rugged Tablet is Designed for Tactical Operations

Extreme Engineering Solutions (X-ES) has announces the availability of a NXP QorIQ T2081 processor- based COTS board solution, the XPedite6101, with a certification-ready multi-core operating system environment, Wind River VxWorks 653 3.0 Multi-core Edition platform. The fully ARINC 653-compliant VxWorks 653 enables avionics vendors and hostedfunction suppliers to independently develop and deploy multiple applications on a single multi-core hardware platform, supporting rigorous avionics safety standards. The XPedite6101 XMC/PrPMC mezzanine module supports multiple NXP QorIQ processor configurations, a number of I/O ports including Gigabit Ethernet, serial, USB, and SATA, and up to 8 GB of DDR3-1600 ECC SDRAM.

Getac has introduced its first rugged tactical tablet, built from the ground up, for combat-ready military forces. Designed from feedback from Special Forces and tactical operators, the Getac MX50 rugged tactical tablet is battle-ready tough. It is MIL-STD 810G and MIL-STD 461 certified and IP67 waterproof. Its large, 5.7-inch screen offers a bright, 480 nit sunlight-readable display with glove-touch and night vision capabilities. The chest mount is designed to integrate with a standard issue MOLLE vest, providing hands-free carrying and ease of access. The MX50 meets the Common Criteria ISO/IEC 15408 computer security certification, and the NSA’s Commercial Solutions for Classified (CSfC) guidelines (certification pending) and Data-at-Rest (DAR) requirements.

Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com

Getac USA Irvine, CA (949) 681-2900 www.us.getac.com

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COTS Journal | March 2017

COTS PRODUCTS

Precertified Rugged, NAS Device Reduces Development Time Curtiss-Wright has announced the rugged DTS1, a COTS data-at-rest (DAR) storage device that complies with the Commercial Solutions for Classified (CSfC) 2-Layer Encryption requirement, endorsed

by NSA. Usually the development and certification can take 36 months with a total cost of $5 million. NSA has approved an alternative approach called 2-Layer Encryption End User device (EUD) list. Because the EUD is precertified, OEM and system integrators can include it in the system to reduce development and certification time.

The CSfC 2-Layer Encryption certified, DTS1, is a single-slot NAS device which supports the PXE protocol that all network clients on board of a vehicle or aircraft can boot from the encrypted files on the DTS1’s removable memory cartridge (RMC). Additionally, the RMC (128 Gbytes to 2 Terabytes) physical data transfer from one DTS1 to another with Suite B encryption. The optional packet capture software (PCAP) enables Ethernet packet recording for later analysis and the iSCSI support makes sharing data easier.

Data formats that support industry standard protocols such as NFS, CIFS, FTP, or HTTP can store data on the DTS1. The target applications will be storage, removal, and transport of critical data such as cockpit data (mission, map, maintenance), ISR Why would you choose anything else? (camera, I&Q, sensors), mobile applications (ground radar, ground mobile, airborne ISR pods), heavy industrial (steel, refinery), and video/ audio data collection ( flight test instrumentation) in helicopters, UAVs, UUVs and UGVs. The unit measures 1.5 x 5.0 x 6.5-inches (38.1 x 127 x 165.1 mm) and weighs 4.0 lb.

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08/03/2017 19:22:01

COTS Journal | March 2017

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COTS PRODUCTS

AMC Board Serves up Latest Gen of Xeon Processor E3-1500 v6

Concurrent Technologies has announced AM G6x/msd, an AdvancedMC (AMC) module that is its first product to support the latest generation of Intel Xeon processor E3-1500 v6. Customers will be able to specify a choice of processors including the Intel Xeon processor E3-1505M v6 or Intel Xeon processor E3-1505L v6. These are both high performance 4-core devices with Intel HD Graphics P630 and are optimized to create board variants with high compute performance or low power consumption respectively. AM G6x/msd has an on board 64 Gbytes of Solid State Drive (SSD) and wo sites for M.2 storage modules based on PCI Express M-key interconnects supporting the new Non-Volatile Memory Express (NVMe) protocol. AM G6x/msd is also the first board from Concurrent Technologies that has support for the future Intel Optane range of 3D XPoint modules. These are expected to be made available during 2017 and offer the promise of further improvements in storage speed.

Compared to Concurrent Technologies previous AMC products, AM G6x/msd offers improved CPU and memory performance. A version will also be available offering dual 10 Gigabit Ethernet connectivity for higher speed networking with the ability to connect via either electrical or fiber links making it more suitable for use in remote locations. As with all other Concurrent Technologies products, AM G6x/ msd is designed for long life-cycle applications. Concurrent Technologies has a wide product range including VME, VPX, CompactPCI, XMC and AdvancedMC processor boards and further products supporting Kaby Lake will be announced during 2017.

Concurrent Technologies Woburn, MA (781) 933-5900 www.gocct.com

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COTS Journal | March 2017

COTS PRODUCTS

Server-Grade COM Express Module Serves up 64 GB of DDR Memory

TI Sitara-based COM Module Boasts Small Footprint Format

Advantech has announced the COM Express module, SOM-5992, powered by the Intel Xeon Processor D-1500 Family and support up to 16-core (with TDP) and 64 Gbytes DDR4 memory. The unit complies with the PICMG COM.0 R3.0 type 7 COM Express Basic Module and is configurable to Gen3 PCIe x16, x8 and 8x1 expansion. Additionally, it is integrated with two 10GBASE-KR interfaces and 1000BASE-T. The dual DDR4 2400 runs at 1.2V. It supports iManager, WISEPaaS/RMM and Embedded Software APIs. The COM Express Basic module measures 125mm x 95mm with overall power consumption of 45W and targets the server markets.

MEN Micro has announced the CM10, the Texas Instruments Sitara ARM Cortex-A15 AM57xx- based COM Module. Targeting the industrial communication and IoT and gateway market, the fanless unit can be configured with single or dual core processor and Up to 2 Gbytes DDR3 SDRAM with ECC, soldered with eMMC multimedia card. I/O is flexible with two Gb Ethernet, two PCI Express interfaces, SATA, USB, UARTs, CANbus, video, audio, and a SD card interface. Graphics resolution is 1920 x 1080 pixels with optional HD video and both 3D and 2D. Operating temperature range is from -40 to +85 degrees C.

Advantech Irvine, CA (949) 420-2500 www.advantech.com

MEN Micro Ambler, PA (215) 542-9575 www.menmicro.com

COTS

PRODUCT GALLERY IC-INT-VPX3d 3U OpenVPX Single Board Computer (SBC) based on Intel XEON (Broadwell-DE SoC) processor.

• One Intel® Xeon® Processor D-15xx • Two banks of DDR4 with ECC • Boot flash memory • External independent RTC with supercap backup • 2 10Gbe ports • 2 PCIe x4 ports • 2 GigaEthernet ports • 1 RS232 console port • 4 rear SATA interfaces • 6 GPIOs • 1 extension FPGA Kintex-7 • 1 extension XMC slot PCIe x8 - or 2 x4

Interface Concept Phone: (510) 656-3400 Web: www.interfaceconcept.com

A176 Cyclone Aitech Defense Systems’ fanless, rugged GPGPU supercomputer measures only 20 cubic inches, while providing 1 TFLOP of parallel processing. The self-contained, military grade A176 Cyclone redefines SFF power density by delivering 60 GFLOPs/W in a compact, low power HPEC. Using the revolutionary NVIDIA Maxwell architecture for the GPU subsystem, the A176 integrates 256 CUDA cores with 4 GB of LPDDR4 RAM. The Quad-core ARM Cortex A57 CPU provides an operating frequency to 1.9 GHz per core, with an overall maximum power consumption of only 17 W (8-10 W typical).

• Measures only 20 cubic inches using 17 W max (8-10 typ) • Fanless, rugged GPGPU with 256 CUDA cores (NVIDIA 1 TFLOPs Maxwell) • High performance, low power SFF supercomputer (ARM Cortex Quad-core A57) • Memory: 4 GB LPDDR4 RAM • Video: encode 4K 60 Hz; decode 4K 30 Hz • Storage: 16 GB of eMMC and SATA SSD with quick erase/secure erase

Aitech Defense Systems, INC Phone: (888) 248-3248 Web: www.rugged.com

COTS Journal | March 2017

39

COTS

ADVERTISERS INDEX GET CONNECTED WITH INTELLIGENT SYSTEMS SOURCE AND PURCHASABLE SOLUTIONS NOW Intelligent Systems Source is a new resource that gives you the power to compare, review and even purchase embedded computing products intelligently. To help you research SBCs, SOMs, COMs, Systems, or I/O boards, the Intelligent Systems Source website provides products, articles, and whitepapers from industry leading manufacturers---and it's even connected to the top 5 distributors. Go to Intelligent Systems Source now so you can start to locate, compare, and purchase the correct product for your needs.

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Index

Company Page# Website

Company Page# Website

Adder Technology................................37................................ www.adder.com

North Atlantic Industries, Inc..............43................................... www.naii.com

Aitech..................................................21..............................www.rugged.com

One Stop Systems...............................41................www.onestopsystems.com

Critical I/O...........................................5............................ www.criticalio.com

Pentek.................................................44.............................. www.pentek.com

Dawn VME...........................................34.......................... www.dawnvme.com

Phoenix International..........................20........................... www.phenxint.com

Elma Electronics.................................15................................. www.elma.com

Pico Electronics, Inc............................35................. www.picoelectronics.com

GAIA Converter Inc...............................7................... www.gaia-converter.com

Star Communications Inc....................17......................www.starcommva.com

Great River Technology...........................38...................... www.greatrivertech.com

SynQor.................................................25...............................www.synqor.com

Horizon Display.......................................16...................... www.horizondisplay.com

Xponential...........................................31.......................... www.xponential.org

LCR Embedded Systems, INC...............4......... www.lcrembeddedsystems.com

COTS Gallery Ad..................................39.........................................................

Mercury Systems, Inc. .........................2.................................. www.mrcy.com COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 150, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices.

POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 150, San Clemente, CA 92673.

COMING NEXT MONTH Embedded Computing Choices for UAVs and UGVs

Both unmanned aerial vehicles (UAVs) and unmanned ground vehicles (UGVs) designs are moving toward more autonomous capabilities and ever more sophisticated ISR collecting. All that requires increased embedded compute density. The embedded computing industry is responding with highly integrated, small form factor solutions. This sections delves into the key technology and products aimed at UAV and UGV platforms.

Tech Recon Jeff’s Picks: Jeff Child’s Top D-A and A-D Conversion Boards

In our popular Tech Recon feature “Jeff’s Pick” section we directly leverage Jeff’s decades of experience covering the embedded computing and defense market. He will choose the top products in a different category each month and share his insights on why they’re significant in terms of design innovation, market relevance and technology leadership. April’s section looks at the leading crop of D-A and A-D Conversion Boards.

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COTS Journal | March 2017

System Development: DoD Budget Report: Major Weapons Programs

The new Administration’s DoD budget request for fiscal year 2018 isn’t expected out until may. But they have released their amended FY2017 budget which adds $30 billion to the previous administration’s request. Aircraft procurements and technology upgrades make up a good chunk of that increase. This section examines what the plans are for the DoD’s major military programs and what the opportunities are for embedded computing and electronics technologies.

Data Sheet: ITX and Mini-ITX Boards Roundup

For many military systems the priority is on squeezing as much functionality and compute density onto a single board solution. One of the fasting growing form factor aimed at that segment are Mini-ITX cards. And a Thin Mini-ITX is version of Mini-ITX offers an even smaller solution and a thinner port cluster. This section explores these key technologies. A product album rounds up the latest representative products in this area.

Flash Storage Array with 200TB capacity in four removable canisters

50TB data in each 7 Lb. removable canister

• 100Gb Infiniband or Ethernet connections • MIL-STD 810 and 461 tested • Two versions: airborne and ground • 4U rackmount unit

(877) 438-2724

www.onestopsystems.com

COTS Journal’s

MARCHING TO THE NUMBERS

60 kW

Class of a beam combined fiber laser Lockheed Martin has completed the design, development and demonstration of for the U.S. Army. In testing earlier this month, the Lockheed Martin laser produced a single beam of 58 kW, representing a world record for a laser of this type. The Lockheed Martin team met all contractual deliverables for the laser system and is preparing to ship it to the US Army Space and Missile Defense Command/Army Forces Strategic Command in Huntsville, AL. A beam combined fiber laser brings together individual lasers, generated through fiber optics, to generate a single, intense laser beam.

$30 MILLION

Combined value of modification contract completed

by TRU Simulation + Training, a Textron company.

Included were the modifications to the United States Air Force’s (USAF) C17 Maintenance Training System (MTS) as well as a Maintenance Training Device (MTD) for the Royal Australian Air Force (RAAF). The C-17 MTS is the USAF Air Mobility Command’s large complex training system with 11 device types. The modifications included aircraft concurrency revisions to the Block 17+ configuration, as well as adding new task capabilities for Electronic Warfare and Flares training.

567-FEET

Length of the USS Vicksburg (CG 69), a Ticonderoga-class guided missile cruiser to be modernized under $42.9 million U.S. Navy contract awarded to BAE Systems. The value of the competitively awarded contract could reach $45.9 million if all options are exercised. Under the contract, BAE Systems will perform ship alternations and miscellaneous repairs aboard the, including the replacement of critical aluminum structures. The work is expected to begin in April at the company’s Norfolk, Virginia shipyard. BAE Systems is a leading provider of ship repair, maintenance, modernization, conversion, and overhaul services for the Navy.

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COTS Journal | March 2017

$

3.4

BILLION Value of a five-year contract Boeing and the U.S. government recently signed through which the Army, and a customer outside the U.S., will acquire the latest Apache attack helicopter at a significant savings to taxpayers. This is the first multi-year agreement for the Apache “E” variant. The Army will receive 244 remanufactured Apaches while 24 new ones will go to the international customer. Boeing builds the Apache in Mesa, AZ. Deliveries of the “E” model began in October 2011. Seven customers outside the U.S. have ordered this variant. Including this latest version, the U.S. and 15 other countries have relied on the Apache during the past three decades.

24,000 FEET Altitude over which Lockheed Martin’s Air-toSurface Standoff Missile (JASSM) completed two product verification flight tests at White Sands Missile Range, New Mexico. Focused on demonstrating the updated Global Positioning System (GPS) anti-jam hardware and software, flight testing verified effective operation in both GPS-degraded and non-jammed environments. B-2 and B-52 bomber aircraft launched the JASSM missiles. The missiles navigated to and destroyed their intended targets, completing all mission objectives. Armed with a penetrating blast-fragmentation warhead, JASSM and JASSM-Extended Range (ER) can be used in all weather conditions.

Widest Input Voltage Range

Multi-function I/O Single Board Computers Rugged Power Supplies Rugged Systems Benchtop & VXI Instruments

High Power Density

VITA Compliant

BIT Communications

NAI’s board and box-level power solutions are used worldwide in a broad range of rugged military shipboard, ground-based and airborne systems. NAI builds upon a comprehensive family of standard power products resulting in power solutions that meet customer specific requirements – FAST. COTS and modified COTS power supplies provide intelligent monitoring, control and communications. Features include; I2C communications, geographical addressing, current sharing and programmability. When it comes to power solutions for the most demanding applications, NAI delivers.

3U VPX/cPCI & 6U VPX/VME High power density up to 3000W Integrated EMI filtering

Made in USA A certified small business

VITA 62 compliant Lower engineering costs Stand-alone power solutions

North Atlantic I n d u s t r i e s

www.na i i . c om

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Introducing Jade™ architecture and Navigator™ Design Suite, the next evolutionary standards in digital signal processing.

Kintex Ultrascale FPGA

Pentek’s new Jade architecture, based on the latest generation Xilinx® Kintex® Ultrascale™ FPGA, doubles the performance levels of previous products. Plus, Pentek’s next generation Navigator FPGA Design Kit and BSP tool suite unleashes these resources to speed IP development and optimize applications.

•

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Streamlined Jade architecture boosts performance, reduces power and lowers cost Superior analog and digital I/O handle multi-channel wideband signals with highest dynamic range

•

Built-in IP functions for DDCs, DUCs, triggering, synchronization, DMA engines and more

•

Board resources include PCIe Gen3 x8 interface, sample clock synthesizer and 5 GB DDR4 SDRAM

•

Navigator Design Suite BSP and FPGA Design Kit (FDK) for Xilinx Vivado® IP Integrator expedite development

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Applications include wideband phased array systems, communications transceivers, radar transponders, SIGINT and ELINT monitoring and EW countermeasures

Jade Model 71861 XMC module, also available in VPX, PCIe, cPCI and AMC with rugged options.

Navigator FDK shown in IP Integrator.

See the Video!

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All this plus FREE lifetime applications support!

Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: info@pentek.com • www.pentek.com Worldwide Distribution & Support, Copyright © 2016 Pentek, Inc. Pentek, Jade and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.