RTC Magazine 2010 4-Page Media Kit

M E D I A K I T 2 0 10 The Engineer’s Resource

EST. 1992

rtc ma ga z ine.c o m T h e R T C Gr o u p

9 0 5 Ca lle A manecer, Ste. 250, San Clemente, CA 92673 P (9 4 9 ) 2 2 6-2000 F (949) 226-2050 www.r tcgr oup.com

CONTACTS editorial Tom Wi llia ms

Edit or-in -Ch ief (831 ) 335 -150 9 tom w@r tcgr oup .com

Ma rin a Tri ng ali

Man agin g Edit or/A d Traf fic (949 ) 226 -20 20 mar inat @rtc grou p.co m

sales Sta cy Ma nni k

Wes tern Reg iona l Sale s Man age r P (949 ) 226 -20 24 C (949 ) 274 -613 4 stac ym@ rtcg roup .com

Lau ren Tru de au

Wes tern Reg iona l Sale s Man age r P (949 ) 226 -20 14 C (949 ) 554 -974 2 laur ent@ rtcg roup .com

Sh and i Ric cio tti

Eas tern Reg iona l Sale s Man age r P (949 ) 226 -20 00 C (949 ) 573 -766 0 sha ndir @rtc grou p.co m

EDITORIAL TECHNOLOGY IN CONTEXT

T h i s s e c t i o n f ollows developments in the technology u n d e r l y i n g t h e development of embedded systems.

I t i n c l u d e s t h e latest advances in processors, form f a c t o r s , p r o g rammable logic devices and standards.

I t a l s o c o v e r s approaches like fault tolerance, system m a n a g e m e n t tec hn iques , ho t-s wa p a n d th er mal m a n a g e m e n t , high availability and safety-critical c o n c e r n s . Te chnology in Context focuses on the f o u n d a t i o n s u po n whic h embedded s y s tems ar e b uilt.

TECHNOLOGY CONNECTED

Today, the vast majority of embedded devices are connected via some sort of serial link or network to other embedded devices, supervisory systems and ultimately to the Internet. The newer, faster serial interconnect technologies like PCI Express, USB and RapidIO, to name a few, as well as variations on industrial Ethernet, also interface with legacy technologies such as CAN and ProfiBus, serial interconnects and a host of wireless technologies.

These include 802.11, Bluetooth, Wi-Fi and a variety of wireless sensor network technologies. These many technologies and protocols eventually flow into Ethernet and Internet, and the Technology Connected section focuses on keeping our readers informed on the latest developments in connectivity in the embedded world.

TECHNOLOGY IN SYSTEMS

Putting together the three major components of any computer-based system—the CPU, the software and the I/O—is often a challenging task, especially since the I/O and the software must be specifically tailored to the needs of the application in combination with the appropriate processor. In addition, there are often other components such as a storage subsystem and display.

This activity requires the full skill of the developer—in evaluating and selecting the components, integrating them electrically and mechanically and in developing and optimizing the application code. This section will look at the issues, the techniques and the tools for system development and integration.

TECHNOLOGY DEPLOYED

Embedded systems operate in an endless varie t y of applications that make differing demands on their capab ilities and how they ar e designed and configured. Despite that, many of the compone n t s , tools and design techniq ues ar e similar. This sec ti on will cover representative broad application area s and look at the unique problems they pose and t h e solutions they offer. Such thing s as d ata acquisi ti on ar e integr al to a wid e r ang e of sp ecific app licati on s as are motor control, machine-to-machine syste m s , medical devices and many more. Looking at som e o f the broader issues presented here, readers will b e able to get ideas that they can apply to their spe c i f i c need s in build ing that d ed icated emb ed d ed solu ti on .

EDITORIAL C ALEN DAR E v e r y I s s u e o f RTC ma ga z in e c o nta ins s ta ff-wr itten and contr ibuted ar ticles fr om leading technolog y ex p e rts a n d d e s i g n i n tegra to rs . RT C’s s ta ff pro du c e s a tr uly sup er ior p r oduct, one that ser ves a cr itical need in the e m b e d d e d c ommun ity. Ch a nges in the tec h nolog y, mar k et and political/legal ar enas p r ovid e a tr ue op p ortu n i ty f o r R T C ’s e d i to rs to ma ke rea l a n d mea nin gful contr ibutions to their community.

Tec h n ology in Con text

rtcmk10.indd 3

Te ch n o l o gy Co n n e cte d

Te ch n o l o gy i n Sy s te ms

Te ch n o l o gy De p l o ye d

January

FPGAs—Is Bigger Always Better?

Wire l e ss Da ta A c qu i si ti o n

P ro gra m m a bl e A u to m a ti o n C o n tro l l e rs

Machine Vision in Factory A u to m a ti o n

Fe b ruary

CompactPCI in Control and Automation

Se c u r i t y f o r N e t w o r k e d Devi c e s— I s I t P o ssi bl e ?

S l e e p Mo de s a n d P o w e rDowns: Managing Power i n S m a l l S yste m s

Wireless Networks for Building and Facility Ma n a ge m e n t

March

Embedded Memory System Options

Supervisory Systems: Br i n gi n g th e Ne tw o rk to th e Ope ra to r

Mechanical Design for C h a ssi s C o di n g

Ma c h i n e to Ma c h in e S yste m s S m o ot h Tra n spo rta ti o n

A p ril

PC/104 Derivatives—This Town Ain’t Big Enough...

USB a n d/o r P C I Expre ss?

Marrying COMs and Carriers—Not Always Ma de i n He a ve n

Data Acquisition with S m a l l Mo du l e s

May

Developments in Multicore P rocessors

Ethernet: 40Gbit to 1 0 0 Gbi t to ...?

I n t e g r a t i n g To u c h S c r e e n a n d I n pu t Te c h n o l o gi e s

Gre e n En gi n e e ri n g : Ma ki n g th e Mo st o f Pow e r

June

Low-Power CPUs Bring Intelligence into Small Spaces

Using CompactPCI and P XI

Hypervisors and Operating Systems for Mu l ti c o re

Mo to r a n d Mo ti o n C on t r ol

July

Mini-, Nano- and Pico-ITX Modules

Mi c ro T C A i n Ne tw o rks

Embedded Windows vs.

Linux

Medical Devices Build on Small Modules with Low Power

A ugust

Batteries, Fuel Cells and Photovoltaics in Embedded Design

So r t i n g O u t G S M , W i - F i a n d Bl u e to o th

Rugged, Hot-Swappable a n d R e l i a b l e — To u g h S yste m s f o r To u gh Jo bs

Ma ki n g F a c to r y A u to m a ti o n S yste m s F l e xi bl e a n d C o n f i g u r ab le

Se p t e mb e r

VME—Will Its Derivatives P revail?

Options for Industrial Ne tw o rks

Thermal Management in Ti gh t S pa c e s

Ro bo ti c S yste m s C o m b in e S e n so rs, C o m pu te r Pow e r a n d Mo ti o n

O ct o b e r

Advances in Solid- State Storage

Latest Generation PCI Expre ss

System Monitoring and Ma n a ge m e n t

E m b e d d e d Te c h n o l o g i e s f o r th e S m a rt P o w e r G r id

No ve mb e r

ARM and Power Modules Move in on Applications

Rem o t e M a n a g e m e n t a n d Ma i n te n a n c e

We a r a b l e a n d H a n d h e l d Computers Move into S pe c i a l i ze d Jo bs

Box PCs Package M o d u l a r i t y, C o n n e c t i v i t y a n d A ppl i c a ti o n Di v er s it y

D e ce mb e r

COMs vs. SBCs—What to Use and When

P CI Expre ss o ve r C a bl e

Mi c ro T C A i n C o n tro l a n d A u to m a ti o n

Standards Update: Report o n th e Mo st S i gn i f ican t I n du stry S ta n dar d s

8/21/09 11:18:17 AM

rtcmk10.indd 3

8/21/09 11:18:17 AM

CIRCULATION º º º º º

mastered circuation

regional events participation with industry exhibitions

continual circulation development

most focused, unique circulation in the

industry

20,000 print + 17,000 digital

37,000 unique industry

th professionals every mon Make sure our ads are seen by these people!

are most active participants in the º readers

industry of subscribers have attended an º 82%

embedded industry conference/exhibition in past 12 mos. come to RTC for assistance º advertisers

in promoting activites through dedicated circulation

Readers’ End Use Function Test & Measurement

Other 3%

Communications 12%

15%

Security

circulation : organic, focused and growing

15%

Automation & Control 26%

Transportation 9%

Areas of Engineering Development

Retail/POS

Connectivity

12%

30%

Medical

Military

Signal Processing

12%

12%

14%

Blade Server Processing 14%

Job Titles

Blade Server Switching 10%

Engineering Manager/Program Manager

Control Functions

30%

25%

Hardware Engineer/Designer

POS/Retail Terminal

26%

22%

Business Development

Safety/Protection

2%

16%

0

Design Team Leader

5

10

15

20

25

17%

30

Executive Management 19%

Other 2%

0

5

10

15

20

25

30

35

PRIC ING print adve rtisin g two page spread

1X

2X

3X

4X

6X

8X

12X

18X

24X

$6,772

$6,416

$6,030

$5,672

$5,530

$5,275

$5,165

$4,988

$4,630 $3,088

full page

$4,516

$4,278

$4,020

$3,782

$3,686

$3,517

$3,444

2/3 page

$3,326

$4,194

$3,980

$3,737

$3,500

$3,427

$3,307

$3,202

1/2 page

$3,080

$2,906

$3,012

$2,857

$2,684

$2,566

$2,463

$2,379

$2,300

1/3 page

$2,212

$2,086

$2,200

$2,086

$1,960

$1,903

$1,796

$1,760

$1,680

1/4 page

$1,588

$1,523

$1,666

$1,580

$1,485

$1,428

$1,360

$1,309

$1,273

$1,224

$1,155

AD SIZE S

full page

8-1/2” (216 mm) x 11-1/8” (283 mm)

1/3 page V

2-1/4” (57 mm) x 9-7/8” (251 mm)

2/3 page

1/2 page V

7-3/8” (187 mm) x 6-3/8” (162 mm)

3-1/2” (89 mm) x 9-7/8” (251 mm)

1/3 page H

1/3 page square

7-3/8” (187 mm) x 3-3/8” (85 mm)

4-3/4” (121 mm) x 4-3/4” (121 mm)

1/2 page H

7-3/8” (187 mm) x 4-3/4” (121 mm)

1/4 page V

3-1/2” (89 mm) x 4-3/4” (121 mm)

1/2 page island 7-3/8” (187 mm) x 4-3/4” (121 mm)

1/4 page H

7-3/8” (187 mm) x 2-3/8” (60 mm)

MAT ERIA L INST RUC TION S All advertisi ng must be submitte d as a high-res olution PDF (PDF/X-1 a). Four-col or images must be CMYK; minimum resolutio n 300 dpi; tiff or eps are preferre d; line art a minimum of 1200 dpi. Only full-page ads require a bleed of 1/8” (4 mm).

Full-pag e live area is 1/2” (13 mm) from trim on all sides. For all other ad sizes, all live content should stay 1/4” from the edge of the ad space.

Please submit PDFs via The RTC Group’s FTP site:

rtcmk10.indd 3

http://u pload.rt cgroup. com

8/21/09 11:18:17 AM