M E D I A K I T 2 0 10 The Engineer’s Resource
EST. 1992
rtc ma ga z ine.c o m T h e R T C Gr o u p
9 0 5 Ca lle A manecer, Ste. 250, San Clemente, CA 92673 P (9 4 9 ) 2 2 6-2000 F (949) 226-2050 www.r tcgr oup.com
CONTACTS editorial Tom Wi llia ms
Edit or-in -Ch ief (831 ) 335 -150 9 tom w@r tcgr oup .com
Ma rin a Tri ng ali
Man agin g Edit or/A d Traf fic (949 ) 226 -20 20 mar inat @rtc grou p.co m
sales Sta cy Ma nni k
Wes tern Reg iona l Sale s Man age r P (949 ) 226 -20 24 C (949 ) 274 -613 4 stac ym@ rtcg roup .com
Lau ren Tru de au
Wes tern Reg iona l Sale s Man age r P (949 ) 226 -20 14 C (949 ) 554 -974 2 laur ent@ rtcg roup .com
Sh and i Ric cio tti
Eas tern Reg iona l Sale s Man age r P (949 ) 226 -20 00 C (949 ) 573 -766 0 sha ndir @rtc grou p.co m
EDITORIAL TECHNOLOGY IN CONTEXT
T h i s s e c t i o n f ollows developments in the technology u n d e r l y i n g t h e development of embedded systems. I t i n c l u d e s t h e latest advances in processors, form f a c t o r s , p r o g rammable logic devices and standards. I t a l s o c o v e r s approaches like fault tolerance, system m a n a g e m e n t tec hn iques , ho t-s wa p a n d th er mal m a n a g e m e n t , high availability and safety-critical c o n c e r n s . Te chnology in Context focuses on the f o u n d a t i o n s u po n whic h embedded s y s tems ar e b uilt.
TECHNOLOGY CONNECTED
Today, the vast majority of embedded devices are connected via some sort of serial link or network to other embedded devices, supervisory systems and ultimately to the Internet. The newer, faster serial interconnect technologies like PCI Express, USB and RapidIO, to name a few, as well as variations on industrial Ethernet, also interface with legacy technologies such as CAN and ProfiBus, serial interconnects and a host of wireless technologies. These include 802.11, Bluetooth, Wi-Fi and a variety of wireless sensor network technologies. These many technologies and protocols eventually flow into Ethernet and Internet, and the Technology Connected section focuses on keeping our readers informed on the latest developments in connectivity in the embedded world.
TECHNOLOGY IN SYSTEMS
Putting together the three major components of any computer-based system—the CPU, the software and the I/O—is often a challenging task, especially since the I/O and the software must be specifically tailored to the needs of the application in combination with the appropriate processor. In addition, there are often other components such as a storage subsystem and display. This activity requires the full skill of the developer—in evaluating and selecting the components, integrating them electrically and mechanically and in developing and optimizing the application code. This section will look at the issues, the techniques and the tools for system development and integration.
TECHNOLOGY DEPLOYED
Embedded systems operate in an endless varie t y of applications that make differing demands on their capab ilities and how they ar e designed and configured. Despite that, many of the compone n t s , tools and design techniq ues ar e similar. This sec ti on will cover representative broad application area s and look at the unique problems they pose and t h e solutions they offer. Such thing s as d ata acquisi ti on ar e integr al to a wid e r ang e of sp ecific app licati on s as are motor control, machine-to-machine syste m s , medical devices and many more. Looking at som e o f the broader issues presented here, readers will b e able to get ideas that they can apply to their spe c i f i c need s in build ing that d ed icated emb ed d ed solu ti on .
EDITORIAL C ALEN DAR E v e r y I s s u e o f RTC ma ga z in e c o nta ins s ta ff-wr itten and contr ibuted ar ticles fr om leading technolog y ex p e rts a n d d e s i g n i n tegra to rs . RT C’s s ta ff pro du c e s a tr uly sup er ior p r oduct, one that ser ves a cr itical need in the e m b e d d e d c ommun ity. Ch a nges in the tec h nolog y, mar k et and political/legal ar enas p r ovid e a tr ue op p ortu n i ty f o r R T C ’s e d i to rs to ma ke rea l a n d mea nin gful contr ibutions to their community. Tec h n ology in Con text
rtcmk10.indd 3
Te ch n o l o gy Co n n e cte d
Te ch n o l o gy i n Sy s te ms
Te ch n o l o gy De p l o ye d
January
FPGAs—Is Bigger Always Better?
Wire l e ss Da ta A c qu i si ti o n
P ro gra m m a bl e A u to m a ti o n C o n tro l l e rs
Machine Vision in Factory A u to m a ti o n
Fe b ruary
CompactPCI in Control and Automation
Se c u r i t y f o r N e t w o r k e d Devi c e s— I s I t P o ssi bl e ?
S l e e p Mo de s a n d P o w e rDowns: Managing Power i n S m a l l S yste m s
Wireless Networks for Building and Facility Ma n a ge m e n t
March
Embedded Memory System Options
Supervisory Systems: Br i n gi n g th e Ne tw o rk to th e Ope ra to r
Mechanical Design for C h a ssi s C o di n g
Ma c h i n e to Ma c h in e S yste m s S m o ot h Tra n spo rta ti o n
A p ril
PC/104 Derivatives—This Town Ain’t Big Enough...
USB a n d/o r P C I Expre ss?
Marrying COMs and Carriers—Not Always Ma de i n He a ve n
Data Acquisition with S m a l l Mo du l e s
May
Developments in Multicore P rocessors
Ethernet: 40Gbit to 1 0 0 Gbi t to ...?
I n t e g r a t i n g To u c h S c r e e n a n d I n pu t Te c h n o l o gi e s
Gre e n En gi n e e ri n g : Ma ki n g th e Mo st o f Pow e r
June
Low-Power CPUs Bring Intelligence into Small Spaces
Using CompactPCI and P XI
Hypervisors and Operating Systems for Mu l ti c o re
Mo to r a n d Mo ti o n C on t r ol
July
Mini-, Nano- and Pico-ITX Modules
Mi c ro T C A i n Ne tw o rks
Embedded Windows vs. Linux
Medical Devices Build on Small Modules with Low Power
A ugust
Batteries, Fuel Cells and Photovoltaics in Embedded Design
So r t i n g O u t G S M , W i - F i a n d Bl u e to o th
Rugged, Hot-Swappable a n d R e l i a b l e — To u g h S yste m s f o r To u gh Jo bs
Ma ki n g F a c to r y A u to m a ti o n S yste m s F l e xi bl e a n d C o n f i g u r ab le
Se p t e mb e r
VME—Will Its Derivatives P revail?
Options for Industrial Ne tw o rks
Thermal Management in Ti gh t S pa c e s
Ro bo ti c S yste m s C o m b in e S e n so rs, C o m pu te r Pow e r a n d Mo ti o n
O ct o b e r
Advances in Solid- State Storage
Latest Generation PCI Expre ss
System Monitoring and Ma n a ge m e n t
E m b e d d e d Te c h n o l o g i e s f o r th e S m a rt P o w e r G r id
No ve mb e r
ARM and Power Modules Move in on Applications
Rem o t e M a n a g e m e n t a n d Ma i n te n a n c e
We a r a b l e a n d H a n d h e l d Computers Move into S pe c i a l i ze d Jo bs
Box PCs Package M o d u l a r i t y, C o n n e c t i v i t y a n d A ppl i c a ti o n Di v er s it y
D e ce mb e r
COMs vs. SBCs—What to Use and When
P CI Expre ss o ve r C a bl e
Mi c ro T C A i n C o n tro l a n d A u to m a ti o n
Standards Update: Report o n th e Mo st S i gn i f ican t I n du stry S ta n dar d s
8/21/09 11:18:17 AM
rtcmk10.indd 3
8/21/09 11:18:17 AM
CIRCULATION º º º º º
mastered circuation regional events participation with industry exhibitions continual circulation development most focused, unique circulation in the industry
20,000 print + 17,000 digital
37,000 unique industry
th professionals every mon Make sure our ads are seen by these people!
are most active participants in the º readers industry of subscribers have attended an º 82% embedded industry conference/exhibition in past 12 mos. come to RTC for assistance º advertisers in promoting activites through dedicated circulation
Readers’ End Use Function Test & Measurement
Other 3%
Communications 12%
15%
Security
circulation : organic, focused and growing
15%
Automation & Control 26%
Transportation 9%
Areas of Engineering Development
Retail/POS
Connectivity
12%
30%
Medical
Military
Signal Processing
12%
12%
14%
Blade Server Processing 14%
Job Titles
Blade Server Switching 10%
Engineering Manager/Program Manager
Control Functions
30%
25%
Hardware Engineer/Designer
POS/Retail Terminal
26%
22%
Business Development
Safety/Protection
2%
16%
0
Design Team Leader
5
10
15
20
25
17%
30
Executive Management 19%
Other 2%
0
5
10
15
20
25
30
35
PRIC ING print adve rtisin g two page spread
1X
2X
3X
4X
6X
8X
12X
18X
24X
$6,772
$6,416
$6,030
$5,672
$5,530
$5,275
$5,165
$4,988
$4,630 $3,088
full page
$4,516
$4,278
$4,020
$3,782
$3,686
$3,517
$3,444
2/3 page
$3,326
$4,194
$3,980
$3,737
$3,500
$3,427
$3,307
$3,202
1/2 page
$3,080
$2,906
$3,012
$2,857
$2,684
$2,566
$2,463
$2,379
$2,300
1/3 page
$2,212
$2,086
$2,200
$2,086
$1,960
$1,903
$1,796
$1,760
$1,680
1/4 page
$1,588
$1,523
$1,666
$1,580
$1,485
$1,428
$1,360
$1,309
$1,273
$1,224
$1,155
AD SIZE S
full page
8-1/2” (216 mm) x 11-1/8” (283 mm)
1/3 page V
2-1/4” (57 mm) x 9-7/8” (251 mm)
2/3 page
1/2 page V
7-3/8” (187 mm) x 6-3/8” (162 mm)
3-1/2” (89 mm) x 9-7/8” (251 mm)
1/3 page H
1/3 page square
7-3/8” (187 mm) x 3-3/8” (85 mm)
4-3/4” (121 mm) x 4-3/4” (121 mm)
1/2 page H
7-3/8” (187 mm) x 4-3/4” (121 mm)
1/4 page V
3-1/2” (89 mm) x 4-3/4” (121 mm)
1/2 page island 7-3/8” (187 mm) x 4-3/4” (121 mm)
1/4 page H
7-3/8” (187 mm) x 2-3/8” (60 mm)
MAT ERIA L INST RUC TION S All advertisi ng must be submitte d as a high-res olution PDF (PDF/X-1 a). Four-col or images must be CMYK; minimum resolutio n 300 dpi; tiff or eps are preferre d; line art a minimum of 1200 dpi. Only full-page ads require a bleed of 1/8” (4 mm). Full-pag e live area is 1/2” (13 mm) from trim on all sides. For all other ad sizes, all live content should stay 1/4” from the edge of the ad space. Please submit PDFs via The RTC Group’s FTP site:
rtcmk10.indd 3
http://u pload.rt cgroup. com
8/21/09 11:18:17 AM