RTC 4-Page Media Kit

The magazine of record for the embedded computing industry

Solve The Puzzle The guide for decision makers in the embedded, real-time and open systems computer industry

media kit 2009

CIRCULATION INFORMATION CIRCULATION THAT COUNTS

EDITORIAL THAT MATTERS

RTC has mastered the circulation puzzle.

Through our regional events, participation with industry exhibitions and continual circulation development, we have created the most focused and unique circulation in the industry.

RTC reaches critical decision makers and will continue to break new ground as technologies emerge

RTC’s Readers are the most active participants in the industry: 82% of the magazine’s subscribers have attended an embedded industry conference or exhibition within the last 12 months.

TOTAL Circulation 37,000 •2 0,000 print circulation in the USA • 1 7,000 digital circulation Worldwide READERS’ END USE FUNCTION OTHER ENT 3% REM ASU & ME % 6

UN IC 1 2 % AT I O

NS

TEST

MM

RETAIL/POS 7% MILITARY 12%

RTC covers cutting-edge technology in real-world applications, including medicine, communications, aerospace, industrial automation, and control. The Technology in Context sections looks at the impact of embedded technology in these major application areas. Our editors strategically select key technologies where the solutions outlined and information provided are highly applicable and transferable.

industry insight

MEDICAL 12%

Our editors compile and consider different approaches to a technology sector, helping the reader ready their product for market. This includes such issues as updates on industry standards, advances in semiconductors, development tools, connectors, RTOSs, and networking infrastructure.

JOB TITLES ENGINEERING MANAGER/PROGRAM MANAGER 34% HARDWARE ENGINEER/DESIGNER 26% BUSINESS DEVELOPMENT 2% DESIGN TEAM LEADER 17%

system integration

EXECUTIVE MANAGEMENT 19%

RTC magazine devotes an entire section each month to the latest developments in real-time operating systems, development, and analysis tools and standards, as well as the latest verification and debug strategies. Our editors are the most experienced in the technical publishing industry on embedded software, and our readers confidently open them for insight and expertise.

OTHER 2% 0

5

10

15

20

25

30

AREAS OF ENGINEERING DEVELOPMENT CONNECTIVITY 30%

The design community turns to RTC magazine for the latest product developments.

BLADE SERVER PROCESSING 14% BLADE SERVER SWITCHING 10% CONTROL FUNCTIONS 25% POS/RETAIL TERMINAL 22% SAFETY/PROTECTION 16% 5

10

35

products and technology

SIGNAL PROCESSING 14%

0

technology in context

RTC focuses on how OEMs can achieve solutions within the standards-based environment. Solutions Engineering covers the impact of standards such as ATCA and IPv6 and issues such as EMI and SAF specifications for systems that are built and deployed to address real-world situations.

AUTOMATION & CONTROL 26%

TRANSPORTATION 9%

EDITORIAL SECTIONS

solutions engineering

CO

SECURITY 15%

RTC magazine plays the leadership role in the industry. It is the first place engineers turn for in-depth coverage of the latest developments in embedded technology.

15

20

25

30

2009 EDITORIAL CALENDAR TECHNOLOGY IN CONTEXT

SOLUTIONS ENGINEERING

INDUSTRY INSIGHT

SYSTEM INTEGRATION

PROMOTIONAL OPPORTUNITIES

JANUARY

Microcontrollers Bring Big Power to Small Places

Wireless Sensors: MiniNetworks Stretch into the Real World

Interconnect Wars: Sorting Out the Survivors

Machine to Machine: Small Modules Make Big Systems

FEBRUARY

COMs vs. SBCs: Trade-offs and Pitfalls

FPGA Board Solutions: Multiple Personalities Trim System Costs

Ruggedization: Making Rugged That Which Was Not

CompactPCI Express

Multicore Processors: Making Progress on the Promise

10 Gbit Ethernet Aims at 100 Gbit

I/O Subsystems: Standard, Custom, or Modular?

Bonus Distribution: ECS Real Time or Real Time West Enough? Match System Requirements to CPU Speed Small Form Factor SIG Showcase

APRIL

Small Form Factor Developments and Trends

Fire It Up! The Perils of Powering Up COM-I/O Board Combos

LPC Bus: Why It’s Needed and Where It Fits

Green Engineering: Spreading Intelligence to Save Power

MAY

MicroTCA and 3U cPCI in Control

The Incredible Shrinking Blade Server

USB Stakes Its Claim in the Embedded World

Multicore CPUs Marry Windows with RTOSs

COM Modules Bring CPUs to More Specialized Apps

Intelligent Power Management with ACPI and More

Managing Small Modules with I2C

Motion Control: Combining Vision with Control

Low-Power Processors Deliver High-Power Performance

Data Acquisition with Small Modules

Security for Wireless Networking

Human/Machine Interfaces Large and Small

Rugged SBC Showcase

ATCA: Growing in Telecom and Growing Beyond

PCI Express Enters the Second Generation

Mobile Robotics: Small Boards Behind the Bars

Industrial Networks: Is It IP All the Way?

3U CompactPCI Showcase

Non-PCs: Challenging x86 in Small Modules?

High Temp in Small Spaces: Thermal Management for Small Form Factors

Small DSP Boards for Sensing and Control

Rails and Boxes: SnapTogether Solutions for Industrial Control

Bonus Distribution: ESC Boston and ATCA Summit San Jose

Developments in VME

Solid-State Drives: Options for Storage and Safety

Rugged Apps: It’s Small, but Small Modules Power Can It Take It? Medical Devices

Solid-State Drives Showcase

High Reliability and SafetyJava and Linux Span the Critical Systems for the Next Embedded Space Generation

PMC/XMC Board Showcase/Data Acquisition Showcase

MARCH

JUNE JULY AUGUST SEPTEMBER OCTOBER

COM Express Showcase FPGA Board Showcase Bonus Distribution: Embedded World Multicore Board Showcase

NOVEMBER

PMC/PrPMC, XMC: New Directions for Mezzanines?

MicroTCA in Communications

DECEMBER

WiFi and GSM: Where They Fit and Where They Can Go

Standards Update: Update Fault Management and Hoton the Latest Industry Swapping on the Small Standards

Operating Systems and Tools for Multicore Development

ATCA Showcase USB Module Showcase PC/104 Express Showcase Ethernet Boards Showcase Industrial Box PC Showcase

AMC Board Showcase

2-Fer and Editorial Index

PRICING PRINT ADVERTISING 1X TWO-PAGE $6,772 SPREAD

2X

3X

4X

6X

8X

12X

18X

24X

$6,416

$6,030

$5,672

$5,530

$5,275

$5,165

$4,988

$4,630

FULL PAGE

$4,516

$4,278

$4,020

$3,782

$3,686

$3,517

$3,444

$3,326

$3,088

2/3 PAGE

$4,194

$3,980

$3,737

$3,500

$3,427

$3,307

$3,202

$3,080

$2,906

1/2 PAGE

$3,012

$2,857

$2,684

$2,566

$2,463

$2,379

$2,300

$2,212

$2,086

1/3 PAGE

$2,200

$2,086

$1,960

$1,903

$1,796

$1,760

$1,680

$1,588

$1,523

1/4 PAGE

$1,666

$1,580

$1,485

$1,428

$1,360

$1,309

$1,273

$1,224

$1,155

Due to unexpected or unusual increases in postage associated with fuel costs, The RTC Group reserves the right to revise rates throughout the year. Check with your sales representative for current rates.

RATE COMBINATIONS Rates for COTS Journal, RTC, PKG and Portable Design can be combined to give you the maximum discount. Use the pricing schedule for the total number of pages in all four publications in your annual contract. Discounts may also be applicable if you purchase RTECC shows or take advantage of additional online advertising opportunities; contact your sales representative for more information.

SPECIFICATIONS

2-PAGE SPREAD 17” X 11-1/8”

1/2 PAGE ISLAND 7-3/8” X 4-3/4”

FULL PAGE 8-1/2” X 11-1/8”

1/3 PAGE V 2-1/4” X 9-7/8”

1/2 PAGE V 3-1/2” X 9-7/8”

2/3 PAGE 7-3/8” X 6-3/8”

1/3 PAGE H 7-3/8” X 3-3/8”

1/3 PAGE SQUARE 4-3/4” X 4-3/4”

1/4 PAGE V 3-1/2” X 4-3/4”

1/2 PAGE H 7-3/8” X 4-3/4”

1/4 PAGE H 7-3/8” X 2-3/8”

MATERIAL INSTRUCTIONS

Press Release Submissions

All advertising must be submitted as a high-resolution PDF (PDF/X-1a). Four-color images must be CMYK; minimum resolution 300 dpi; tiff or eps are preferred; line art a minimum of 1200 dpi. Only full-page ads require a bleed of 1/8” (4 mm).

To submit new product announcements, send e-mail versions of the release to the editors. The more technical the information, the more useful it is to our readers. Each product announcement should include a press release, product datasheet and pricing. Digital files, such as PDF documents and digital graphics, should be sent only through prior arrangements with an editor. Published image resolutions need to be at least 300 dpi.

Full-page live area is 1/2” (13 mm) from trim on all sides. For all other ad sizes, all live content should stay 1/4” from the edge of the ad space.

Please submit PDFs via The RTC Group’s FTP site:

http://upload.rtcgroup.com

The Final Piece of the Puzzle: maximize your company branding and technical web presence visit www.rtcmagazine.com for online advertising opportunities.

Sales Team

Editorial Team

STACY MANNIK

SHANDI RICCIOTTI

TOM WILLIAMS

MARINA TRINGALI

Western Regional Sales Manager 949.226.2024 (tel) 949.274.6134 (mobile) stacym@rtcgroup.com

Eastern Regional Sales Manager 949.226.2000 (tel) 949.573.7660 (mobile) shandir@rtcgroup.com

Editor-in-Chief 831.335.1509 tomw@rtcgroup.com

Ad Traffic/Managing Editor 949.226.2020 marinat@rtcgroup.com

WARREN ANDREWS

Colin McCracken & Paul Rosenfeld

LAUREN TRUDEAU

Editorial Director/Associate Publisher 239.992.4357 warrena@rtcgroup.com

Western Regional Sales Manager 949.226.2014 (tel) 949.554.9742 (mobile) laurent@rtcgroup.com

Contributing Editors Small Form Factor Forum Column (SF3) sf3@rtcgroup.com

The magazine of record for the embedded computing industry

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