Ryan Hayden Product Design & Development Engineer

Ryan Hayden Portfolio BE (hons) Product Design & Development Engineer Content Is Copyrighted and Confidential and cannot be removed or edited.

021 40 60 74 09 973 0679 ext 3 ryan@remstate.co.nz 56 Hobson Rd, Albany Auckland, 0632 Work Entailed: Product Design & Development, CAD Design and FEA Analysis (Solidworks), Mechanical Engineering.

Branding, Graphic Design, Webdesign

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head phone jack

SDCard 10

5

Screen Corner

A

Entire shell is 1mm in thickness

4.25

A

Still to be decided: the shape of the electrodes. whether a small circular pad should be used or fill the current shape out in a metal.

screen centred from sides

B

B

these areas are flat mini usb

C

40

these areas are flat

23

C

distance to centre of pad

these areas are flat

40

division between top and bottom casing

82

distance to electrode pads

7.80

7.98

height of finger pad from base of top casing Top and bottom Split here

the head phone jack should sit half way on the top shell and bottom shell

D

6.87

D

what thickness should this pad be for the electronics to pick up finger movement?

height of top of screen from base of top casing

E

10

110

centred on split UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MILLIMETERS SURFACE FINISH: TOLERANCES: LINEAR: ANGULAR: NAME

These values can be changed if necessary. The Model is obviously quite slim.

DEBUR AND BREAK SHARP EDGES

FINISH:

SIGNATURE

DATE

DO NOT SCALE DRAWING

TITLE:

DRAWN

REVISION

Health Scope Dimensions

CHK'D APPV'D

F

MFG Q.A

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MATERIAL:

WEIGHT:

DWG NO.

SCALE:1:1

Assembly3 SHEET 1 OF 1

A3

LASER CUTTING