Global system on package market

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IndustryARC

Global System on Package (SOP) Market (2014-2020)

By Technology Elements (Electrical Silicon Through-Vias, Fine Pitch, High Bandwidth Wiring and Others), By Application (Consumers Electronics, Wireless Communication) and By Geography

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TABLE OF CONTENTS 1. Global SOP (SOP) Market - Market Overview 2. Executive Summary 3. Global SOP Market - Market Landscape 3.1. Market Share Analysis 3.2. Comparative Analysis 3.2.1.

Product Benchmarking

3.2.2.

End user profiling

3.2.3.

Patent Analysis

3.2.4.

Top 5 Financials Analysis

3.2.5.

Global SOP Market – Market Forces

3.3. Market Drivers 3.4. Market Constraints 3.5. Market Challenges 3.6. Attractiveness of the Global SOP Market 3.6.1.

Power of Suppliers

3.6.2.

Power of Customers

3.6.3.

Threat of New entrants

3.6.4.

Threat of Substitution

3.6.5.

Degree of Competition

4. Global SOP Market – Strategic Analysis 4.1. Value Chain Analysis 4.2. Pricing Analysis 4.3. Opportunities Analysis

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4.4. Product/Market Life Cycle Analysis 4.5. Suppliers and Distributors 5. Global SOP Market – by Technology Elements 5.1. Electrical Silicon through-vias 5.2. Fine-Pitch 5.3. High Bandwidth Wiring 5.4. Fine-Pitch Solder Interconnection 5.5. Fine-Pitch Known-good-Die 5.6. Advanced Microchannel Cooling 6. Global SOP Market – by Application 6.1. Consumer Electronics 6.2. Wireless Communication 7. Global SOP Market– By Geography 7.1. Americas 7.1.1.

US

7.1.2.

Canada

7.1.3.

Mexico

7.1.4.

Brazil

7.1.5.

Others

7.2. Europe 7.2.1.

UK

7.2.2.

Germany

7.2.3.

Italy

7.2.4.

France

7.2.5.

Others

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7.3. Asia-Pacific 7.4. China 7.5. India 7.6. Japan 7.7. Russia 7.8. Others 7.9. ROW 7.9.1.

Middle East

7.9.2.

Africa

8. Global SOP - Market Entropy 8.1. New Product Launches 8.2. M&As, Collaborations, JVs and Partnership 9. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio) 9.1. IBM Corporation 9.2. ABB Ltd. 9.3. Rockwell Automation, Inc. 9.4. Honeywell International Inc. 9.5. Cooper Industries plc 9.6. Emerson Electric Co. 9.7. Hollysys Automation Technologies Ltd 9.8. Thomas & Betts Corporation 9.9. Thales Group 9.10. R. STAHL, Inc. 9.11. NHP Electrical Engineering Products 9.12. E2S Warning Signals

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9.13. WERMA SIGNALTECHNIK GMBH + CO.KG 9.14. J. Auer Signalgerate GmbH 10. Appendix 10.1. Abbreviations 10.2. Sources 10.3. Research Methodology 10.4. Bibliography 10.5. Compilation of Expert Insights 10.6. Disclaimer

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LIST OF TABLES Table1 Global SOP Market Revenue, 2014 – 2020 ($m) Table2 Global SOP Market Revenue, By Technology, 2014 – 2020 ($m) Table3 Global SOP Market Revenue, By Application, 2014 – 2020 ($m) Table4 Global SOP Market Revenue, By Geography, 2014 – 2020 ($m) Table5 Electrical Silicon through-vias SOP Market Revenue, By Geography, 2014 – 2020 ($m) Table6 Fine Pitch SOP Market Revenue, By Geography, 2014 – 2020 ($m) Table7 High Bandwidth Wiring SOP Equipments Market Revenue, By Geography, 2014 – 2020 ($m) Table8 Fine Pitch Solder Inetrconnection SOP Equipments Market Revenue, By Geography, 2014 – 2020 ($m) Table9 Fine Pitch Known-Good-Die SOP Market Revenue, By Geography, 2014 – 2020 ($m) Table10 Advanced Microchannel Cooling SOP Market Revenue, By Geography, 2014 – 2020 ($m) Table12 Electrical Silicon through-vias SOP Market Revenue, By Application, 2014 – 2020 ($m) Table13 Fine Pitch SOP Market Revenue, By Application, 2014 – 2020 ($m) Table14 High Bandwidth Wiring SOP Equipments Market Revenue, By Application, 2014 – 2020 ($m) Table15 Fine Pitch Solder Interconnection SOP Equipments Market Revenue, By Application, 2014 – 2020 ($m) Table16 Fine Pitch Known-Good-Die SOP Market Revenue, By Application, 2014 – 2020 ($m) Table17 Advanced Microchannel Cooling SOP Market Revenue, By Application, 2014 – 2020 ($m) Table18 Americas SOP Market Revenue, By Application, 2014 – 2020 ($m) Table19 Europe SOP Market Revenue, By Application, 2014 – 2020 ($m) Table20 APAC SOP Market Revenue, By Application, 2014 – 2020 ($m) Table21 RoW SOP Market Revenue, By Application, 2014 – 2020 ($m) Table22 Americas SOP Market Revenue, By Technology, 2014 – 2020 ($m) Table23 Europe SOP Market Revenue, By Technology, 2014 – 2020 ($m) Table24 APAC SOP Market Revenue, Technology, 2014 – 2020 ($m) Table25 RoW SOP Market Revenue, By Technology, 2014 – 2020 ($m) Table26 Americas SOP Market Revenue, By Country, 2014 – 2020 ($m) Table27 Europe SOP Market Revenue, By Country, 2014 – 2020 ($m) Table28 APAC SOP Market Revenue, By Country, 2014 – 2020 ($m) Table29 RoW SOP Market Revenue, By Country, 2014 – 2020 ($m)

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LIST OF FIGURES Figure 1 Global SOP Market, 2014 (%) Figure 2 Global SOP Market, by Type of Sensor, 2014 (%) Figure 3 Global SOP Market, by Technology, 2014 (%) Figure 4 Global SOP Market, by Industry, 2014 (%) Figure 5 Global SOP Market, by Application, 2014 (%) Figure 6 Global SOP Market, by Geography, 2014 (%) Figure 7 Global SOP Market, Value Chain Analysis Figure 8 Global SOP Market, Porter’s Five Forces Analysis Figure 9 Global SOP Market, Market Share Analysis, By Key Player, 2014 (%) Figure 10 Global SOP Market, Patent Analysis by Year, 2014 – 2020 ($M) Figure 11 Global SOP Market, Patent Analysis by Company, 2014 – 2020 ($M) Figure 12 Global SOP Market, Financial Analysis, by Key Players, 2014 Figure 13 Global SOP Market, Life-Cycle Analysis, 2014-2020 Figure 14 Global SOP Market, New Product Launches, by Year, 2012-2015 Figure 15 Global SOP Market, Recent Developments, by Year, 2012-2015

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REPORT SCOPE The Global SOP Market has been segmented by type of technology elements and by type of applications. Each of these segments is further broken down into sub-segments give an indepth analysis of the market.

The overall market is also presented from the perspective of different geographic regions and the key countries for this industry. Competitive landscape for each of the product types is highlighted and market players are profiled with attributes of company overview, financial overview, business strategies, product portfolio and recent developments. Market shares of the key players for 2014 are provided. The report contains the most detailed and in-depth segmentation of the Global Signaling Devices Market.

Stakeholders     

Product OEMs Contract manufacturers Service providers Component suppliers System Integrators

 Maintenance Companies

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EXECUTIVE SUMMARY SOP is a technology that places an entire system with computing, communications, and consumer functions all in a single chip. This technology is forecast to enable lower cost, more efficient and higher performance electronic systems. SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip.

This report categorizes the market into three different segments, namely, market by type of technology elements, application, and geography. Based on the technology elements, the market has been classified into Electrical Silicon through-vias, Fine-Pitch, High Bandwidth Wiring, Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and Advanced Microchannel Cooling. The applications include Consumer electronics and wireless communications. Based on the geography, the report has been segmented into North America, Europe, APAC, and RoW.

SAMPLE TABLE: GLOBAL SOP MARKET REVENUE, BY REGION, 2014-2020 ($M) Region

2014

2015

2016

2017

2018

2019

2020

Americas xx xx Europe xx xx APAC xx xx RoW xx xx Total xx xx Source: IndustryARC Analysis

xx xx xx xx xx

xx xx xx xx xx

xx xx xx xx xx

xx xx xx xx xx

xx xx xx xx xx

CAGR % (20152020) xx% xx% xx% xx% xx%

Americas and Europe together hold major share of xx% in Global SOP market. Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Global SOP Market and future opportunities are provided in the report. This report on the Global SOP Market identifies many such insights and M&A opportunities, besides providing a detailed analysis of the market.

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SAMPLE TABLE: GLOBAL SOP MARKET REVENUE, BY PRODUCT TYPE, 20142020 ($M) Product Type

2014

2015

2016

2017

2018

2019

2020

Electrical Silicon xx through-vias Fine-Pitch xx High Bandwidth xx Wiring Fine-Pitch Solder xx Interconnection Fine-Pitch Knownxx good-Die Advanced xx Microchannel Cooling Total xx Source: IndustryARC Analysis

xx

xx

xx

xx

xx

xx

CAGR % (20152020) xx%

xx xx

xx xx

xx xx

xx xx

xx xx

xx xx

xx% xx%

xx

xx

xx

xx

xx

xx

xx%

xx

xx

xx

xx

xx

xx

xx%

xx

xx

xx

xx

xx

xx

xx%

xx

xx

xx

xx

xx

xx

xx%

There are the various types of SOP technologies being worked upon currently. Market size and forecast are provided for each of these technology elements. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the global SOP market and future opportunities are provided in the report.

This report on the Global SOP Market identifies many such insights and M&A opportunities, besides providing a detailed analysis of the SOP market.

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KEY MARKET INSIGHTS  System on Package (SOP) is the only way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration  NANIUM renewed the co-operation contract with Georgia Tech 3D Systems Packaging Research Center (GT PRC) till 2015 towards development and industrialization of new packaging technologies, especially SOP  SOP provides a promising solution for integrating heterogeneous functions such as highspeed digital processing, memory, radio-frequency circuits, sensors, MEMS, and optoelectronic devices  LTCC SOP Technology is presently the most effective method for realizing the miniaturization of wireless front-end applications

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RESEARCH METHODOLOGY The quantitative and qualitative data collected for the SOP report is from a combination of secondary and primary sources. Research interviews were conducted with senior executives and/or mangers in the SOP Industry. These Key Opinion Leaders (KOLs) were then provided a questionnaire to gather quantitative and qualitative inputs on their operations, performance, strategies and views on the overall market, including key developments and technology trends. Data from interviews is consolidated, checked for consistency and accuracy, and the final market numbers are again validated by experts. The global market was split by product types and geography based on different factors like primary and secondary sources, understanding of the number of companies operating in each segment and also KOL insights.

We have used various secondary sources such as directories, articles, white papers, newsletters, annual reports and paid databases such as OneSource, Hoovers and Factiva to identify and collect information for extensive technical and commercial study of the SOP market.

The key players in the market and its value chain were identified through secondary research and their market opinions were also gathered in a similar way through telephonic interviews and questionnaires. We have also studied the annual reports of these top market players.

Interviews with key opinion leaders such as directors, managers, and marketing personnel were used extensively in understanding the need and emergence of SOP Energy Storage market.

We also have extensive database of contacts which were used to conduct primary interviews and also to get their inputs using questionnaires.

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THE ARC ADVANTAGE An analytical model lies at the core of our process, ensuring logical consistency throughout our research. We complement the model with secondary data and interviews with industry experts to reflect the latest trends. With our final expert validation, we provide you with only the most accurate and actionable intelligence.

THE ARC PROCESS Analytical Method 1. Granular breakdown of drivers into factors 2. Validate all factors in terms of their present impact on the market 3. Assign weights to these factors in terms of their relevance and impact on the market 4. Build the Analytical Model ANALYTICAL MODEL

Base Method

1. Get a topdown estimate of the market 2. Follow it up with a bottom-up estimate of the market 3. Check forconsistency and new growth factors that are relevant over the next 10 Years

4. Build the Base model BASE MODEL

Consolidation Method 1. Granular breakdown of drivers into factors 2. Validate all factors in terms of their present impact on the market.

3. Assign weights to these factors in terms of their relevance and impact on the market.

4. Build the Consolidated Model

Delphi Verification 1. Verify the findings of the model with experts from across the value chain 2. Verify the findings with players across small and large enterprises 3. Tweak the model and add new factors 4. Finalize the ARC Model

CONSOLIDATED MODEL

ARC MODEL

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